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AP3R604GH-HF

更新时间：2024-09-18 12:54:08
品牌：A-POWER
描述：Low On-resistance, Simple Drive Requirement, Fast Switching Characteristic

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AP3R604GH-HF 概述

Low On-resistance, Simple Drive Requirement, Fast Switching Characteristic 低导通电阻，简单的驱动要求，快速开关特性 功率场效应晶体管

AP3R604GH-HF 规格参数

生命周期：Contact Manufacturer零件包装代码：TO-252
包装说明：SMALL OUTLINE, R-PSSO-G2针数：4
Reach Compliance Code：compliantECCN代码：EAR99
风险等级：5.68Is Samacsys：N
配置：SINGLE WITH BUILT-IN DIODE最小漏源击穿电压：40 V
最大漏极电流 (ID)：75 A最大漏源导通电阻：0.0037 Ω
FET 技术：METAL-OXIDE SEMICONDUCTORJEDEC-95代码：TO-252
JESD-30 代码：R-PSSO-G2元件数量：1
端子数量：2工作模式：ENHANCEMENT MODE
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE极性/信道类型：N-CHANNEL
最大脉冲漏极电流 (IDM)：300 A表面贴装：YES
端子形式：GULL WING端子位置：SINGLE
晶体管应用：SWITCHING晶体管元件材料：SILICON
Base Number Matches：1

AP3R604GH-HF 数据手册

通过下载AP3R604GH-HF数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。

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AP3R604GH-HF  
Halogen-Free Product  
Advanced Power  
Electronics Corp.  
N-CHANNEL ENHANCEMENT MODE  
POWER MOSFET  
▼ Low On-resistance  
BVDSS  
RDS(ON)  
ID  
40V  
3.7mΩ  
75A  
D
S
▼ Simple Drive Requirement  
▼ Fast Switching Characteristic  
G
Description  
Advanced Power MOSFETs from APEC provide the designer with the  
G
D
S
best combination of fast switching, ruggedized device design, low on-  
TO-252(H)  
resistance and cost-effectiveness.  
The TO-252 package is widely preferred for commercial-industrial  
surface mount applications and suited for low voltage applications such  
as DC/DC converters.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
40  
Units  
V
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
+20  
V
ID@TC=25℃  
ID@TC=25℃  
ID@TC=100℃  
IDM  
Continuous Drain Current (Chip)  
Continuous Drain Current4  
Continuous Drain Current4  
Pulsed Drain Current1  
125  
A
75  
A
75  
A
300  
A
PD@TC=25℃  
TSTG  
Total Power Dissipation  
104  
W
℃
℃
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
TJ  
Thermal Data  
Symbol  
Parameter  
Value  
Units  
℃/W  
℃/W  
Rthj-c  
Maximum Thermal Resistance, Junction-case  
Maximum Thermal Resistance, Junction-ambient (PCB mount)3  
1.2  
Rthj-a  
62.5  
Data & specifications subject to change without notice  
1
201206131  
AP3R604GH-HF  
Electrical Characteristics@Tj=25oC(unless otherwise specified)  
Symbol  
BVDSS  
RDS(ON)  
Parameter  
Test Conditions  
Min. Typ. Max. Units  
Drain-Source Breakdown Voltage  
Static Drain-Source On-Resistance2 VGS=10V, ID=40A  
VGS=0V, ID=250uA  
40  
-
-
-
-
-
V
3.7  
5.6  
mΩ  
mΩ  
V
GS=4.5V, ID=30A  
-
VGS(th)  
Gate Threshold Voltage  
Forward Transconductance  
Drain-Source Leakage Current  
Gate-Source Leakage  
Total Gate Charge  
VDS=VGS, ID=250uA  
VDS=10V, ID=40A  
VDS=40V, VGS=0V  
VGS=+20V, VDS=0V  
ID=40A  
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
100  
-
3
V
gfs  
-
S
IDSS  
IGSS  
uA  
nA  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
pF  
pF  
pF  
Ω
10  
-
+100  
Qg  
28  
5.3  
16  
10  
80  
36  
105  
45  
-
Qgs  
Qgd  
td(on)  
tr  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time  
Rise Time  
VDS=32V  
VGS=4.5V  
-
VDS=20V  
-
ID=40A  
-
td(off)  
tf  
Turn-off Delay Time  
Fall Time  
RG=3.3Ω  
-
VGS=10V  
-
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
VGS=0V  
2750 4400  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
VDS=25V  
600  
175  
1.5  
-
-
f=1.0MHz  
f=1.0MHz  
2.3  
Source-Drain Diode  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max. Units  
VSD  
trr  
Forward On Voltage2  
IS=40A, VGS=0V  
IS=10A, VGS=0V,  
dI/dt=100A/µs  
-
-
-
-
1.2  
V
Reverse Recovery Time  
Reverse Recovery Charge  
45  
58  
-
-
ns  
nC  
Qrr  
Notes:  
1.Pulse width limited by max. junction temperature  
2.Pulse test  
3.Surface mounted on 1 in2 copper pad of FR4 board  
4.Package limitation current is 75A .  
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.  
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.  
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED  
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN.  
2
AP3R604GH-HF  
300  
250  
200  
150  
100  
50  
160  
120  
80  
T C =25 o C  
T C =150 o C  
10V  
7.0V  
6.0V  
5.0V  
10V  
7.0V  
6.0V  
5.0V  
V G = 4.0 V  
V
G =4.0V  
40  
0
0
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
0.0  
1.0  
2.0  
3.0  
4.0  
V DS , Drain-to-Source Voltage (V)  
V DS , Drain-to-Source Voltage (V)  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
4.4  
2.0  
1.6  
1.2  
0.8  
0.4  
I D =30A  
I D =40A  
C =25 o C  
V
G =10V  
T
4
Ω
3.6  
3.2  
2.8  
2.4  
-50  
0
50  
100  
150  
2
4
6
8
10  
T j , Junction Temperature ( o C)  
V GS , Gate-to-Source Voltage (V)  
Fig 3. On-Resistance v.s. Gate Voltage  
Fig 4. Normalized On-Resistance  
v.s. Junction Temperature  
1.6  
1.2  
0.8  
0.4  
0.0  
40  
30  
20  
10  
0
T j =25 o C  
T j =150 o C  
0
0.4  
0.8  
1.2  
-50  
0
50  
100  
150  
T j , Junction Temperature ( o C)  
V SD , Source-to-Drain Voltage (V)  
Fig 5. Forward Characteristic of  
Reverse Diode  
Fig 6. Gate Threshold Voltage v.s.  
Junction Temperature  
3
AP3R604GH-HF  
f=1.0MHz  
10  
4000  
3000  
2000  
1000  
0
I D =40A  
8
V DS =20V  
C iss  
V
DS =24V  
V
DS =32V  
6
4
2
0
C oss  
C rss  
0
10  
20  
30  
40  
50  
1
5
9
13  
17  
21  
25  
29  
Q G , Total Gate Charge (nC)  
V DS ,Drain-to-Source Voltage (V)  
Fig 7. Gate Charge Characteristics  
Fig 8. Typical Capacitance Characteristics  
1000  
1
Duty factor = 0.5  
Operation in this  
area limited by  
100us  
RDS(ON)  
100  
10  
1
0.2  
0.1  
0.1  
0.05  
1ms  
PDM  
t
0.02  
0.01  
T
10ms  
100ms  
DC  
Duty Factor = t/T  
T C =25 o C  
Peak Tj = PDM x Rthjc + TC  
Single Pulse  
Single Pulse  
0.01  
0.1  
1
10  
100  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
V DS ,Drain-to-Source Voltage (V)  
t , Pulse Width (s)  
Fig 9. Maximum Safe Operating Area  
Fig 10. Effective Transient Thermal Impedance  
VDS  
VG  
90%  
QG  
4.5V  
QGD  
QGS  
10%  
VGS  
tr  
td(on)  
td(off) tf  
Q
Charge  
Fig 11. Switching Time Waveform  
Fig 12. Gate Charge Waveform  
4

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