TF-COM-965-A10-01 [AAEON]
Intel® Core⢠2 Duo/ Celeron® M (Socket-P Based) Processors; 英特尔®科雷亚?? ¢ 2双核/ Celeron® M（插座-P型）处理器
| 型号： | TF-COM-965-A10-01 |
| 厂家： | 
AAEON TECHNOLOGY |
| 描述： | Intel® Core⢠2 Duo/ Celeron® M (Socket-P Based) Processors |
| 文件： | 总1页 (文件大小：367K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
COM-965
COM Express CPU Module with Intel® Core™ 2 Duo/ Celeron® M (Socket-P Based) Processors
07
Features
ꢀꢁIntel® Core™ 2 Duo/ Celeron® M (Socket-P Based)
Dual-channel DDR2 SODIMM
Processors
ꢀꢁIntel® GME965 + ICH8M
ꢀꢁDual-channel DDR2 SODIMM 533/667 Memory, Max. 4 GB
ꢀꢁGigabit Ethernet
ꢀꢁCRT, Up To 24-bit Dual-channel LVDS LCD, SDVO
2-pin Wafer for
RTC Battery
µFC-PGA
(Socket P)
ꢀꢁHigh Definition Audio Interface
ICH8M
ꢀꢁPATA x 1, SATA 3.0Gb/s x 3
ꢀꢁUSB2.0 x 8
ꢀꢁPCI x 4, PCI-Express [x16] x 1, PCI-Express [x1] x 5
Intel® 82566MM
Gigabit Ethernet
ꢀꢁWide DC Input Range, +8.5V To +19V (Optional)
ꢀꢁCOM Express Basic Module Pin-out Type 2, COM.0 Rev. 1.0
GME965
For Wide Temperature series of this model, please refer to Chapter 1 -
Wide Temperature Boards, to get detailed specification of COM-965W1.
Specifications
System
Form Factor
Processor
COM Express basic module, Pin-out Type 2, COM.0 Rev. 1.0
Intel® Core™ 2 Duo/ Celeron® M (Socket-P based) processors
Packing list
•ꢀ M2.5ꢀScrewꢀxꢀ5
•ꢀ ProductꢀCD
•ꢀ COM-965
200-pin DDR2 SODIMM x 2, Max. 4 GB (DDR2 533/667), supports dual-
channel function
System Memory
Chipset
I/O Chipset
Ethernet
TPM
Intel® GME965 + ICH8M
ICH8M
Intel® 82566MM, 10/100/1000Base-TX
v1.2, Infineon SLB9635TT1.2
Ordering Information
Award BIOS v6.0
SPI Type, 2 MB ROM
BIOS
•ꢀ TF-COM-965-A10
EEPROM
Atmel® AT24C02, save BIOS and configuration data (Optional)
COM Express CPU Module, Socket P, Dual DDR2, Gigabit Ethernet, USB2.0, Rev. A1.0
Wake on LAN
Watchdog Timer
Yes
Fintek F75111
•ꢀ TF-COM-965-A10-01
COM Express CPU Module, Socket P, Dual DDR2, Gigabit Ethernet, USB2.0, TPM, Rev. A1.0
H/W Status Monitoring Supports CPU temperature monitoring
PCI-Express [x16] x 1 (Shared with 2 SDVO ports)
PCI-Express [x1] x 5
32-bit PCI x 4
LPC bus x 1
Expansion Interface
Optional Accessories
SMBus x 1
I2C x 1
•ꢀ TF-ECB-916M-A10-01
Wide DC input range, +8.5V to +19V (Optional)
Nominal: +12V
2-pin wafer for RTC battery
COM Express Carrier Board, microATX, Dual Gigabit Ethernet, 7.1CH Audio, 4 COM, USB, PCI-Express,
AT/ATX, Rev. A1.0
Power Requirement
•ꢀ TF-PER-A051
CPU Cooler, For COM-965/COM-45SP, Socket-type CPU, 12V Fan
Power Consumption
(Typical)
Intel® T7500 2.2GHz, DDR2 667 1 GB
3.7A @ +12V, 0.8A @ +5V (w/ECB-916M)
Board Size
4.92”(L) x 3.74"(W) (125mm x 95mm)
0.66 lb (0.3 Kg)
•ꢀ TF-PER-A052
CPU Cooler, For COM-965/COM-45SP, Onboard CPU, 12V Fan
Gross Weight
Operating
Temperature
32°F ~ 140°F (0°C ~ 60°C)
•ꢀ TF-PER-A082
Storage Temperature
Operating Humidity
MTBF (Hours)
Display
-40°F ~ 176°F (-40°C ~ 80°C)
Passive Heat-sink, For COM-965/COM-45SP, Socket-type CPU
0% ~ 90% relative humidity, non-condensing
100,000
•ꢀ TF-PER-A067
Passive Heat-sink, For COM-965/COM-45SP, Onboard CPU
Supports CRT/LCD simultaneous/ dual view displays
Intel® GME965 integrated
•ꢀ TF-PER-A072
Heat Spreader Kit, For COM-965/COM-45SP, Socket-type CPU
Chipset
Memory
Shared system memory up to 384 MB/ DVMT 4.0
Up to 2048 x 1536 (QXGA) @ 60 Hz for CRT
Up to 2048 x 1536 (QXGA) for LCD
•ꢀ TF-PER-A066
Heat Spreader Kit, For COM-965/COM-45SP, Onboard CPU
Resolution
LCD Interface
Up to 24-bit dual-channel LVDS
SDVO/ DVO/ Side Port
Supports SDVO x 2 (Shared with PCI-Express [x16])
I/O
Storage
USB
PATA x 1 (Two devices), SATA 3.0Gb/s x 3
USB2.0 x 8
Audio
GPIO
High definition audio
Up to 4 in or 4 out
07-5
Note: All specifications are subject to change without notice.
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