MU1608301YL [ABC]
MULTILAYER CHIP BEAD; 叠层片式磁珠
| 型号： | MU1608301YL |
| 厂家： | 
ABC Taiwan Electronics Corp |
| 描述： | MULTILAYER CHIP BEAD |
| 文件： | 总7页 (文件大小：361K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SPECIFICATION FOR APPROVAL
REF :
PAGE: 1
PROD.
NAME
ABC'S DWG NO.
ABC'S ITEM NO.
M□□□□□□□□□L□-□□□
MULTILAYER CHIP BEAD
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
D
I
G
I
( PCB Pattern )
B
C
Unit : m/m
Series
M□1608
M□2029
M□3261
A
B
D
G
H
I
1.6±0.2
2.0±0.2
3.2±0.2
0.8±0.2
1.2±0.2
1.6±0.2
0.8±0.2
0.9±0.2
1.1±0.2
0.30±0.2
0.50±0.3
0.60±0.4
0.7
1.0
2.2
0.7
1.0
1.4
0.7
1.0
1.1
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒MATERIALS：
a
b
c
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal electrode：Ag/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40 ---- +105℃
b﹒Operating temp.：-55 ---- +125℃
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
c﹒Terminal strength：
F
Temperature
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
+2.0 ~ 4.0℃
/ sec max.
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
-(1.0 ~ 5.0)℃ / sec max.
Type
F ( kgf )
Time ( sec )
Peak Temperature:
260℃
250
200
150
100
50
M□1608
M□2029
M□3261
0.5
0.6
1.0
230℃
50sec max.
30±5
70sec max.
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
50
100
150
Time ( seconds )
200
250
0
AR-001A
SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 2-1
M□□□□□□□□□L□-□□□
ABC'S DWG NO.
ABC'S ITEM NO.
MULTILAYER CHIP BEAD
Ⅴ﹒ELECTRICAL CHARACTERISITCS：
Impedance
RDC
IDC
(mA)
max.
DWG No.
(Ω)
(Ω)
at 100MHz
max.
MD1608400YL□ -□□□
MG1608800YL□ -□□□
MG1608121YL□ -□□□
MU1608221YL□ -□□□
MU1608301YL□ -□□□
MZ1608601YL□ -□□□
MZ1608102YL□ -□□□
MG1608152YL□ -□□□
MG1608202YL□ -□□□
40±25%
80±25%
0.30
0.30
0.30
0.30
0.35
0.45
0.60
0.70
0.80
300
300
200
200
150
100
100
50
120±25%
220±25%
300±25%
600±25%
1000±25%
1500±25%
2000±25%
50
1). □：Packaging Information… A：Bulk B：Taping Reel
2) ."- ":Reference code
□□□
MD1608400YL□
MG1608800YL□
MG1608121YL□
MU1608221YL□
MU1608301YL□
MZ1608601YL□
□
□
□
MG1608202YL
MZ1608102YL
MG1608152YL
AR-001A
SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 2-2
ABC'S DWG NO.
ABC'S ITEM NO.
M□□□□□□□□□L□-□□□
MULTILAYER CHIP BEAD
Ⅴ﹒ELECTRICAL CHARACTERISITCS：
Impedance
RDC
IDC
(mA)
max.
DWG No.
(Ω)
(Ω)
at 100MHz
max.
MD2029400YL□ -□□□
MG2029800YL□ -□□□
MG2029121YL□ -□□□
MU2029221YL□ -□□□
MU2029301YL□ -□□□
MZ2029601YL□ -□□□
MZ2029102YL□ -□□□
MG2029152YL□ -□□□
MG2029202YL□ -□□□
40±25%
80±25%
0.20
0.20
0.25
0.30
0.30
0.40
0.45
0.55
0.60
300
300
300
200
200
100
100
100
50
120±25%
220±25%
300±25%
600±25%
1000±25%
1500±25%
2000±25%
1). □：Packaging Information… A：Bulk B：Taping Reel
2) ."- ":Reference code
□□□
MD2029400YL
MG2029800YL
□
MG2029121YL
□
□
MU2029221YL
MU2029301YL
MZ2029601YL
□
□
□
MZ2029102YL
MG2029152YL
□
MG2029202YL
□
□
AR-001A
SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 2-3
ABC'S DWG NO.
ABC'S ITEM NO.
M□□□□□□□□□L□-□□□
MULTILAYER CHIP BEAD
Ⅴ﹒ELECTRICAL CHARACTERISITCS：
Impedance
(Ω)
at 100MHz
RDC
(Ω)
max.
IDC
(mA)
max.
DWG No.
MG3261151YL□ -□□□
MG3261301YL□ -□□□
MU3261301YL□ -□□□
MU3261601YL□ -□□□
MZ3261601YL□ -□□□
MZ3261122YL□ -□□□
MU3261122YL□ -□□□
MZ3261202YL□ -□□□
MU3261202YL□ -□□□
150±25%
300±25%
0.30
0.30
0.30
0.30
0.30
0.50
0.50
0.60
0.60
300
300
300
200
200
100
100
100
100
300±25%
600±25%
600±25%
1200±25% (at 50MHz)
1200±25% (at 50MHz)
2000±25% (at 30MHz)
2000±25% (at 30MHz)
1). □：Packaging Information… A：Bulk B：Taping Reel
2) ."- ":Reference code
□□□
MZ3261151YL□
MG3261301YL□
MU3261301YL□
□
□
□
MZ3261122YL
MU3261601YL
MZ3261601YL
MU3261122YL□
MZ3261202YL□
MU3261202YL□
AR-001A
SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 3
ABC'S DWG NO.
ABC'S ITEM NO.
M□□□□□□□□□L□-□□□
MULTILAYER CHIP BEAD
Ⅵ﹒PACKAGING INFORMATION：
( 1 ) Configuration
T
Cover Tape
2.0±0.5
∮C
G
Embossed Carrier
※Carrier tape width : D
P:4 m/m
4 m/m
End
Start
Leader
Trailer
no comppnent
400 m/m min.
no component
Components
User direction of feed
200 m/m min.
Unit:m/m
( 2 ) Dimensions
Style
A
B
C
D
8
G
N
T
+0
-0
07 - 08
178
21±0.8
13
10
50
12.5
( 3 ) Q'TY & G.W. Per package
Inner : Reel
Outer : Carton
Series
Q'TY (pcs)
G.W. (gw)
Style
Q'TY(kpcs) G.W. (Kg)
Size (cm)
M□1608
4,000
90
07 - 08
200
7.0
41 x 39 x 22
M□2029
M□3261
4,000
3,000
120
150
07 - 08
07 - 08
200
120
8.5
8.5
41 x 39 x 22
41 x 39 x 22
AR-001A
SPECIFICATION FOR APPROVAL
REF :
PROD.
PAGE: 4
ABC'S DWG NO.
ABC'S ITEM NO.
M□□□□□□□□□L□-□□□
MULTILAYER CHIP BEAD
NAME
( 4 ) TYPE DIMENSIONS
Fig 1.
φ1.55±0.05
(0.157±0.004) (0.079±0.002) (0.061±0.002)
4±0.1
2±0.05
T max.
P±0.1
(0.004)
A±0.1
(0.004)
Fig 2.
φ1.55±0.05
(0.157±0.004) (0.079±0.002) (0.061±0.002)
4±0.1
2±0.05
0.23±0.1(0.004)
T±0.1(0.004)
P±0.1
A±0.1
(0.004)
(0.004)
Unit:m/m
Type
A
B
F
P
T
W
Fig
1
M□1608
M□2029
M□3261
1.05
1.85
2.30
3.50
3.50
3.50
3.50
4.0
4.0
4.0
1.10
1.10
1.27
8.0
8.0
8.0
1.50
1.88
1
2
AR-001A
SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 5
ABC'S DWG NO.
ABC'S ITEM NO.
M□□□□□□□□□L□-□□□
MULTILAYER CHIP BEAD
Ⅶ﹒DWGING NUMBER EXPRESSION：
M
Reference code
Appendix code 2 : Package
Appendix code 1 : Classification
Tolerance code
Electrical code
Dimension code
Type code
Appendix code 1：Product Classification
L：Lead Free Standard products comply with RoHS' requirements
1 ~ 9：Lead Free Special products comply with RoHS' requirements
Appendix code 2：Package Information
Remark
Code
Inner package
T.B.D.
Inner package Q'TY
T.B.D.
A
T / R ( Reel package )
T / R ( Reel package )
T / R ( Reel package )
4000
4000
3000
pcs
pcs
pcs
M□1608
M□2029
M□3261
B
AR-001A
相关型号：
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