CE-64-U [ADAM-TECH]
Card Edge Connector, 64 Contact(s), 2 Row(s), Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, ROHS COMPLIANT;
| 型号： | CE-64-U |
| 厂家： | 
ADAM TECHNOLOGIES, INC. |
| 描述： | Card Edge Connector, 64 Contact(s), 2 Row(s), Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, ROHS COMPLIANT PC 连接器 |
| 文件： | 总6页 (文件大小：872K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CARD EDgE CONNECTORS
.100" X .200" [2.54 X 5.08] CEꢀTERLIꢀE
CE SERIES
INTRODUCTION:
Adam Tech CE Series Card Edge Connectors are precision
engineered PCB mount connectors developed to mate with the
plated fingers of a printed circuit daughter board. Their bifurcated,
cantilever contacts are set in a dual readout configuration and they
offer a reliable connection for a wide range of PCB thicknesses.
Adam Tech’s sturdy solder tails with tapers allow easy insertion and
rugged durability.
FEATURES:
.100" x .200" centerlines
Selectively gold plated contacts
Wide selection of positions
Compatible with a wide range of PCB thicknesses
MATINg pC BOARDS:
All printed circuit boards with a thickness of .055" to .075"
SpECIFICATIONS:
Material:
Standard insulator: PBT, 30% glass reinforced, rated UL94V-0
Optional Hi-Temp insulator: ꢀylon 6T, rated UL94V-0
Insulator Color: Black
Contacts: Phosphor Bronze
Contact platinꢀ:
Gold over ꢀickel underplate on contact area, tin over copper
underplate on tails.
ORDERINg INFORMATION
Electrical:
Operating voltage: 250V AC max.
Current rating: 3 Amps max.
98
U
CE
Contact resistance: 30 mΩ max. initial
Insulation resistance: 3000 MΩ min.
Dielectric withstanding voltage: 500V AC for 1 minute
CONTACT
pꢂATINg:
U = Selectively
gold plated
contacts
SERIES INDICATOR
CE = Card Edge
Connector,
Vertical Mount
CERA = Card Edge
Connector,
Mechanical:
Insertion force: 10 oz max.
Withdrawal force: 3 oz min
Temꢁerature Ratinꢀ:
Right Angle
Mount
Operating temperature: -55°C to +105°C
Soldering process temperature:
Standard insulator: 235°C
pOSITIONS
4, 6, 8, 12, 16, 20, 24, 26, 28,
30, 32, 34, 36, 38, 40, 44, 48,
50, 60, 62, 64, 70, 72, 80, 86,
98, 100, 108, 120
Hi-Temp insulator: 260°C
pACkAgINg:
Anti-ESD plastic trays
SAFETy AgENCy AppROvAꢂS:
UL Recognized & CSA Certified, File no. E224053
OpTIONS:
Add designator(s) to end of part number
30 = 30 µin gold plating in contact area
HT = Hi-Temp insulator for Hi-Temp soldering processes
up to 260°C
BR = Board retention tails
176
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CARD EDgE CONNECTORS
.100" X .200" [2.54 X 5.08] CEnTERLInE
CE SERIES
18p-100p
C
B
A
.100 [2.54]
.362
[9.20]
.177
[4.50]
.614
[15.60]
.022 x .014
[0.55 x 0.35]
.200
[5.08]
A = .100 [2.54] X No. of spaces
B = A + .207 [5.28]
A
C = A + .360 [9.14]
.200 [5.08]
.100 [2.54]
ø.039 [1.00]
RECOMENDED PCB LAYOUT
Recommended pCB layout
98p
5.460 [138.68]
5.300 [134.62]
5.100 [129.54]
1.700 [43.18]
3.00 [76.20]
.362
[9.20]
.598
[15.20]
.122
[3.10]
.200
[5.08]
.022 x .014
[0.55 x 0.35]
5.381 [136.68]
5.100 [129.54]
3.00 [76.20]
.100 [2.54]
1.700 [43.18]
.200 [5.08]
ø.039 [1.00]
RECOMENDED PCB LAYOUT
Recommended pCB layout
177
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HIgH DENSITy CARD EDgE
.050" [1.27] VESA MICRO CHAꢀꢀEL
ARCHITECTURE (MCA)
HMCA SERIES
INTRODUCTION:
Adam Tech HMCA Series Card Edge Connectors include Standard
and Express versions designed for PCB’s in Peripheral Component
Interconnect (PCI) applications. Each is manufactured in a four row,
high density package which is completely compatible to industry
standards and has specially engineered contacts which provide a
very short electrical path between boards. Adam Tech card edge
connectors are designed for high performance with solid board pegs
and precision located, selectively gold plated contacts which are
ideal in high speed, increased bandwidth applications
FEATURES:
PCI and PCI Express Versions
High density compact designs
Industry standard PCI compatible
Special contact design reduces electrical path
Selectively plated contacts
Open bottom for after solder cleaning
MATINg pC BOARDS:
All .050" centerline printed circuit board pads with a thickness of
.062" to .072"
SpECIFICATIONS:
Material:
Standard insulator: PPS, 30% glass reinforced, rated UL94V-0
Optional Hi-Temp insulator: ꢀylon 6T, rated UL94V-0
Insulator Color: Dark Brown (White for 120 pos.)
Contacts: Phosphor Bronze
ORDERINg INFORMATION
HMCA
A
112
g
Contact platinꢀ:
Gold over ꢀickel underplate on contact area, tin over copper
underplate on tails.
pꢂATINg
SERIES INDICATOR
HMCA =
VESA Micro-channel
Card Edge connector
Electrical:
Operating voltage: 125V AC max.
Current rating: 1 Amp max.
Contact resistance: 30 mΩ max. initial
Insulation resistance: 1000 MΩ min.
Dielectric withstanding voltage: 500V AC for 1 minute
g = Selectively
gold plated
contacts
pEgS
Mechanical:
A = Plastic pegs
B = Metal boardlocks
Insertion force: 7 oz max.
Withdrawal force: 0.9 oz min
Temꢁerature Ratinꢀ:
Operating temperature: -55°C to +105°C
Soldering process temperature:
Standard insulator: 235°C
pOSITIONS
112, 120, 132, 182, 184, 194
Hi-Temp insulator: 260°C
pACkAgINg:
Anti-ESD plastic trays
SAFETy AgENCy AppROvAꢂS:
UL Recognized & CSA Certified, File no. E224053
OpTIONS
Add designator(s) to end of part number
30 = 30 µin gold plating in contact area
HT = Hi-Temp insulator for Hi-Temp soldering
processes up to 260°C
178
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HIgH DENSITy CARD EDgE
.050" [1.27] VESA MICRO CHAnnEL
ARCHITECTURE (MCA)
HMCA SERIES
A
B
C
.070 ]1.78]
.050 [1.27]
D
E
.023 [0.60]
.300
[7.62]
.157 [4.00]
.118
[3.00]
.610
[15.50]
.100
[2.54]
ø.083
[2.10]
F
.300
[7.62]
.100
[2.54]
D
E
2.200 [55.88]
2.400 [60.96]
.100
[2.54]
.050 [1.27]
.050 [1.27]
ø.040 [1.02]
2.350 [59.69]
ø.098 [2.49]
2.550 [64.77]
ø.040 [1.02]
F
ø.098 [2.49]
112 and 120 PIN
184 PIN
112 and 120 pIN
184 pIN
D
E
G
.100
[2.54]
.100
[2.54]
D
E
.050
[1.27]
.050 [1.27]
ø.098 [2.49]
ø.040 [1.02]
ø.040 [1.02]
F
ø.098 [2.49]
F
132 PIN
182 PIN
132 pIN
182 pIN
Recommended pCB laꢀout
Uꢀit: Iꢀch [mm]
G
Dimeꢀsioꢀs
Part no. &
Positioꢀs
D
C
A
B
E
F
HMCA-112-G
HMCA-120-G
HMCA-132-G
HMCA-182-G
3.140 [79.76]
3.340 [84.84]
3.740 [95.00]
4.890 [124.21]
0.625 [15.88]
0.625 [15.88]
0.625 [15.88]
2.175 [55.25]
2.200 [ 55.88]
2.400 [ 60.96]
2.325 [59.06]
2.525 [64.14]
2.925 [74.30]
0.500 [12.70]
0.500 [12.70]
1.834 [46.60]
2.050 [52.07]
2.050 [52.07]
2.232 [56.69]
2.550 [64.77]
2.350 [59.69]
—
—
0.450 [11.43]
—
2.200 [55.88]
2.050 [52.07]
2.200 [55.88]
2.525 [64.14]
2.925 [74.30]
2.550 [64.77]
2.350 [55.88]
HMCA-194-G
5.290 [134.37]
2.175 [55.25]
0.450 [11.43]
179
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HIgH DENSITy CARD EDgE
.050" [1.27] CEꢀTERLIꢀE
EISA COꢀꢀECTOR
HDCE SERIES
INTRODUCTION:
Adam Tech HDCE Series EISA (Extended Industry Standard
Architecture) Card Edge Connectors are .050" pitch 188 position
dual level contact connectors specifically designed to mate with AT,
XT and PC expansion cards. Our precision formed High Reliability
contact system is contained within a Hi-Temp PPS body which
features a close tolerance polarizing slot and card edge lead-in area
for superior mating.
FEATURES:
High density .050" Centerlines
Compatible with PC, XT & AT
Durable Long Life cycle contacts
High Pressure Contacts for Low Level Circuits
MATINg pC BOARDS:
All .050" centerline printed circuit board pads with a thickness of
.062" to .072"
SpECIFICATIONS:
Material:
Standard insulator: PPS, 30% glass reinforced, rated UL94V-0
Optional Hi-Temp insulator: ꢀylon 6T, rated UL94V-0
Insulator Color: Dark Brown (Black optional)
Contacts: Phosphor Bronze
Contact platinꢀ:
Gold over ꢀickel underplate on contact area, tin over copper
underplate on tails.
ORDERINg INFORMATION
HDCE
188
g
Electrical:
Operating voltage: 125V AC max.
Current rating: 3 Amps max.
Contact resistance: 20 mΩ max. initial
Insulation resistance: 1000 MΩ min.
Dielectric withstanding voltage: 500V AC for 1 minute
SERIES INDICATOR
HDCE = EISA
Card Edge
pꢂATINg
g = Selectively gold
plated contacts
Connector
Mechanical:
Insertion force: 7 oz max.
Withdrawal force: 0.9 oz min
pOSITIONS
188
Temꢁerature Ratinꢀ:
Operating temperature: -55°C to +105°C
Soldering process temperature:
Standard insulator: 235°C
Hi-Temp insulator: 260°C
pACkAgINg:
Anti-ESD plastic trays
AppROvAꢂS AND CERTIFICATIONS:
UL Recognized & CSA Certified, File no. E224053
OpTIONS:
Add designator(s) to end of part number
30 = 30 µin gold plating in contact area
Bk = Black color insulation
HT = Hi-Temp insulator for Hi-Temp soldering
processes up to 260°C
180
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HIgH DENSITꢀ CARD EDgE
.050" [1.27] CEnTERLInE
EISA COnnECTOR
HDCE SERIES
ꢀꢁꢂꢃ-188-g
5.10 [129.55]
1.85 [47.00]
.050 [1.27]
3.05 [77.47]
.100 [2.54]
.200 [5.08]
5.463 [138.77]
.366
[9.30]
.060
[1.52]
.617
[15.68]
.300
[7.62]
3.30 [83.82]
.118 [3.00]
.114 [2.90]
3.00 [76.20]
.150 [3.81]
1.70 [43.18]
ø.096 [2.44]
.264 [6.71]
.136 [3.45]
.050 [1.27] TYP.
.050 [1.27]
.300
[7.62]
.100 [2.54]
.100
[2.54]
3.30 [83.82]
.150
[3.81]
ø.042 [1.07]
Recommended pCB layout
181
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