127102-HMC856LC5 [ADI]
EVAL BOARD HMC856LC5;
| 型号： | 127102-HMC856LC5 |
| 厂家： | 
ADI |
| 描述： | EVAL BOARD HMC856LC5 |
| 文件： | 总13页 (文件大小：762K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
28 Gbps, 5-Bit, Digital Time Delay with
Programmable Output Voltage
Data Sheet
HMC856
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Differential and single-ended operation
Supports data rates up to 28 Gbps
Fast rise/fall time: 20 ps/18 ps
Low power consumption: 610 mW typical
Programmable differential
Output voltage swing: 500 mV p-p to 1350 mV p-p
Single supply: −3.3 V
5 mm × 5 mm, 32-terminal ceramic leadless chip carrier (LCC)
package: 25 mm2
GND
I+
1
2
3
4
5
6
7
8
24 GND
23 O+
HMC856
50Ω
50Ω
50Ω
50Ω
DELAY
I–
22 O–
GND
GND
B0+
B0–
NC
21 GND
20 GND
19 B4+
18 B4–
17 NC
600Ω
600Ω
APPLICATIONS
SONET OC-192
600Ω 600Ω
600Ω
High speed serial logic
Clock and data recovery
Broadband test and measurement equipment
Frequency synthesis
PACKAGE
BASE
V
Matched timing
EE
Figure 1.
GENERAL DESCRIPTION
The HMC856 is a wideband time delay device with a 5-bit
digital control designed for timing compensation or clock skew
management applications. The time delay provides nearly
100 ps (maximum) of delay range with 3 ps resolution and
supports 28 Gbps data. The monotonic delay is compensated
for stable operation over both power supply and temperature
variation.
outputs are source terminated to 50 Ω and can also be ac or dc-
coupled. Connect outputs directly to a 50 Ω ground terminated
system or drive devices with CML logic input. The control lines,
B4 to B0, are differential CML inputs terminated with 600 Ω to
the positive rail, which supports lower power control options.
The HMC856 features an output level control pin, VR, that
allows loss compensation or signal level optimization. The
HMC856 operates from a single −3.3 V supply and is available
in a 5 mm × 5 mm LCC package.
All differential inputs to the HMC856 are current mode logic
(CML) and terminated on chip with 50 Ω to the positive supply
ground, GND, and can be ac or dc-coupled. The differential CML
Rev. D
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Tel: 781.329.4700
Technical Support
©2018 Analog Devices, Inc. All rights reserved.
www.analog.com
HMC856
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................5
Interface Schematics .....................................................................6
Typical Performance Characteristics ..............................................7
Theory of Operation ...................................................................... 10
Applications Information .............................................................. 11
Evaluation Printed Circuit Board (PCB) ................................ 11
Typical Application Circuit....................................................... 12
Outline Dimensions....................................................................... 13
Ordering Guide .......................................................................... 13
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Specifications............................................................... 3
Timing Diagram ........................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
REVISION HISTORY
6/2018—Rev. C to Rev. D
Changes to Figure 1.......................................................................... 1
Changes to Resolution Parameter, Table 1 and Figure 2............. 3
Changes to Figure 22 Caption and Figure 23 ............................... 9
Changes to Theory of Operation Section.................................... 10
Changes to Figure 25...................................................................... 12
Changes to Ordering Guide .......................................................... 13
This Hittite Microwave Products data sheet has been reformatted to
meet the styles and standards of Analog Devices, Inc.
12/2016—Rev. 01.0611 to Rev. C
Updated Format..................................................................Universal
Changes to Features Section, General Description Section, and
Figure 1 .............................................................................................. 1
Added Power Consumption Parameter, Table 1 .......................... 3
Changes to Figure 2.......................................................................... 3
Changes to Table 2 ............................................................................ 4
Changes to Figure 3 and Table 3 ..................................................... 5
Changes to Typical Performance Characteristics Section........... 7
Added Theory of Operation Section ........................................... 10
Changes to Table 4 and Figure 24 Caption ................................. 11
Changes to Figure 25...................................................................... 12
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guide .......................................................... 13
Rev. D | Page 2 of 13
Data Sheet
HMC856
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
TA = 25°C, VEE = −3.3 V, VR = 0 V, unless otherwise noted.
Table 1.
Parameter
Symbol
Test Conditions/Comments
Min
Typ
Max
Unit
POWER SUPPLY
Voltage
Current
VEE
−3.7
−3.3
185
610
−2.9
28
V
mA
mW
Gbps
POWER CONSUMPTION
MAXIMUM DATA RATE
INPUT VOLTAGE
Single-Ended
Differential
CML logic input
−1.5
0.1
+0.5
2.0
V
V
OUTPUT
Rise/Fall Time
Single-Ended Amplitude
Differential Amplitude
High Voltage
Low Voltage
RETURN LOSS
Input
tR, tF
Differential, 20% to 80%
20/18
565
1130
−20
ps
mV p-p
mV p-p
mV
500
1350
−585
mV
Frequency <12 GHz
RMS
10
10
dB
dB
Output
JITTER
Random
Deterministic
JR
JD
0.2
<2
ps rms
ps p-p
215 − 1 pseudo random binary sequence (PRBS)
28 Gbps input
VR PIN CURRENT
VR = 0 V
VR = 0.4 V
3
mA
mA
4.25
DELAY
Propagation Delay Data to Data
Control Range
Temperature Variation
tPROP
255
92
ps
ps
ps
ps
ps
TA = 85°C
TA = −40°C
9
4
12
8
Resolution
tPROG_DELAY
3
TIMING DIAGRAM
I±
1
2
3
4
5
6
tPROP
80%
20%
80%
20%
O±
1
1
2
3
4
5
tF
tR
tPROG_DELAY
Figure 2. Timing Diagram
Rev. D | Page 3 of 13
HMC856
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Parameter
Rating
Power Supply Voltage (VEE)
Input Signals
Output Signals
Maximum Junction Temperature
Continuous Power Dissipation, PDISS
(T = 85°C, Derate 33 mW/°C Above 85°C)
Thermal Resistance, θJC (Worst Case Device
to Package Exposed Paddle)
−3.75 V to +0.5 V
−2 V to +0.5 V
−1.5 V to 0.5 V
125°C
1.33 W
ESD CAUTION
30°C/W
Temperature
Storage
Operating
−65°C to +150°C
−40°C to +85°C
260°C
Reflow (MSL3 Rating)
ESD Sensitivity Human Body Model (HBM)
Class 1C
Rev. D | Page 4 of 13
Data Sheet
HMC856
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND
I+
I–
1
2
3
4
5
6
7
8
24 GND
23 O+
22
O–
HMC856
21 GND
GND
GND
B0+
B0–
NC
TOP VIEW
(Not to Scale)
20
19
GND
B4+
18 B4–
17 NC
PACKAGE
BASE
V
EE
NOTES
1. NC = NO CONNECT.
2. NIC = NOT INTERNALLY CONNECTED.
3. EXPOSED PAD. THE EXPOSED PAD MUST
BE CONNECTED TO THE NEGATIVE
VOLTAGE SUPPLY.
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin Number
1, 4, 5, 11, 14, 20, 21, 24
2, 3
Mnemonic
Description
GND
I+, I−
Signal Ground.
Differential Data Inputs. CML referenced to positive supply.
6, 7, 9, 10, 12, 13, 15, 16, B0+, B0−, B1+, B1−, B2+, B2−,
Differential Digital Control Inputs. CML referenced to positive supply.
18, 19
B3+, B3−, B4−, B4+
8, 17
NC
No Connect. These pins are internally connected to the device. These pins can
be connected to radio frequency (RF)/dc ground without affecting performance.
25, 32
NIC
Not Internally Connected. These pins can be connected to radio frequency
(RF)/dc ground without affecting performance.
22, 23
26, 31
27, 30
O−, O+
GND
VEE
Differential Data Outputs. CML referenced to positive supply, 50 Ω termination.
Supply Ground.
Negative Supply Voltage. These pins and the exposed pad must be connected
to the negative voltage supply.
28
29
VR
Output Level Control. Output levels can be increased or decreased by
applying voltage to VR, as shown in Figure 12.
DC Bias Voltage. VB must be connected to ground.
VB
EPAD (VEE)
Exposed Pad. The exposed pad must be connected to the negative voltage supply.
Rev. D | Page 5 of 13
HMC856
Data Sheet
INTERFACE SCHEMATICS
GND
GND
GND
O+
GND
O–
50Ω
50Ω
Figure 4. GND Interface Schematic
Figure 7. O+, O− Interface Schematic
VR
GND
GND
I+
GND
I–
50Ω
50Ω
Figure 5. I+, I− Interface Schematic
Figure 8. VR Interface Schematic
GND
GND
600Ω
Bx+
GND
600Ω
Bx–
Figure 6. BX+, BX− Interface Schematic
Rev. D | Page 6 of 13
Data Sheet
HMC856
TYPICAL PERFORMANCE CHARACTERISTICS
VEE = −3.3 V, VR = 0 V, 400 mV, 28 Gbps, PRBS 215 − 1, input applied, unless otherwise noted.
280
260
240
220
200
180
160
140
120
1500
1400
1300
1200
1100
1000
900
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
800
700
600
500
–1.2
–3.7
–3.6
–3.5
–3.4
–3.3
–3.2
–3.1
–3.0
–2.9
–1.0
–0.8
–0.6
–0.4
–0.2
0
0.2
0.4
SUPPLY VOLTAGE (V)
VR (V)
Figure 9. DC Current vs. Supply Voltage, VR = 0 V at Various Temperatures
Figure 12. Differential Output Voltage vs. VR at Various Temperatures
280
24
+85°C
260
RISE
FALL
+25°C
–40°C
240
22
20
18
16
14
220
200
180
160
140
120
100
80
–1.2
–1.0
–0.8
–0.6
–0.4
–0.2
0
0.2
0.4
–3.7
–3.6
–3.5
–3.4
–3.3
–3.2
–3.1
–3.0
–2.9
VR (V)
SUPPLY VOLTAGE (V)
Figure 10. DC Current vs. VR at Various Temperatures
Figure 13. Rise/Fall Time vs. Supply Voltage
1500
1400
1300
1200
1100
1000
900
26
+85°C
+25°C
–40°C
RISE
FALL
24
22
20
18
16
800
700
–3.7
–3.6
–3.5
–3.4
–3.3
–3.2
–3.1
–3.0
–2.9
–1.2
–1.0
–0.8
–0.6
–0.4
–0.2
0
0.2
0.4
SUPPLY VOLTAGE (V)
VR (V)
Figure 11. Differential Output Voltage vs. Supply Voltage at Various
Temperatures
Figure 14. Rise/Fall Time vs. VR
Rev. D | Page 7 of 13
HMC856
Data Sheet
100
98
96
94
92
90
88
86
84
82
100
98
96
94
92
90
88
86
84
82
80
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
80
–3.7
–3.6
–3.5
–3.4
–3.3
–3.2
–3.1
–3.0
–2.9
–1.2
–1.0
–0.8
–0.6
–0.4
–0.2
0
0.2
0.4
SUPPLY VOLTAGE (V)
VR (V)
Figure 15. Delay vs. Supply Voltage at Various Temperatures
Figure 18. Delay vs. VR at Various Temperatures
10
5
100
90
80
70
60
50
40
30
20
10
0
0
–5
–10
–15
–20
–25
–30
+85°C
+25°C
–40°C
0
5
10
15
20
25
0
4
8
12
16
20
24
28
32
FREQUENCY (GHz)
Bx± DIGITAL DELAY SETTING (Bits)
Figure 19. Normalized Delay vs. Bx Digital Delay Setting
Figure 16. Input Return Loss vs. Frequency
(Device Measured on an Evaluation Board with Port Extensions Normalized
to Minimum Delay, 0 Setting (B4 :B0 = 00000), at its Respective
Temperature)
(Device Measured on an Evaluation Board with Port Extensions)
360
350
5
0
+85°C
340
+25°C
–40°C
–5
330
320
310
300
290
280
270
260
250
–10
–15
–20
–25
–30
–35
0
4
8
12
16
20
24
28
32
0
5
10
15
20
25
SETTING (Bits)
FREQUENCY (GHz)
Figure 20. Absolute Delay vs. Setting
(Normalized to 0 Setting at its Respective Temperature)
Figure 17. Output Return Loss vs. Frequency
(Device Measured on an Evaluation Board with Port Extensions)
Rev. D | Page 8 of 13
Data Sheet
HMC856
100
90
80
70
60
50
40
30
20
10
0
–30dBm
–25dBm
–20dBm
–10dBm
0dBm
5
0
5
10
15
20
CH5 98.0mV
17.6ps
FREQUENCY (GHz)
Figure 21. Single-Ended Output Eye Diagram at 28 Gbps,
Measured VOUT = 550 mV p-p
Figure 23. Saturated Gain vs. Frequency at Various Input Powers
(Device Measured on an Evaluation Board with Port Extensions), The Output
is Saturated, Limiting the Gain for Larger Input Signals, Gain ≈ Saturated
Output Power − Input Power
100
90
80
70
60
50
40
30
20
10
0
31
16
8
4
2
1
–40
–15
10
35
60
85
TEMPERATURE (°C)
Figure 22. Delay vs. Temperature at Various Bit Settings
(Device Measured on an Evaluation Board with Port Extensions)
Rev. D | Page 9 of 13
HMC856
Data Sheet
THEORY OF OPERATION
The HMC856 is a wideband time delay device with a 5-bit digital
control designed for timing compensation or clock skew
management applications. The HMC856 operates from a single
−3.3 V supply and is available in a 5 mm × 5 mm LCC package.
50 Ω is recommended. For dc coupling, inputs and outputs can be
directly interfaced with another CML circuit. The control lines, B4
to B0, are also CML, but they are terminated with 600 Ω to the
positive rail for low power operation.
The HMC856 can support data rates up to 28 Gbps and is able
to provide 100 ps variable delay with 3 ps resolution. The total
propagation delay of the HMC856 varies between 250 ps and
350 ps. The maximum achievable bandwidth of the HMC856
depends on the power of the input signal. The highest
bandwidth of the device is at the larger input power levels, as
shown in Figure 23.
The HMC856 features an output level control pin, VR, that
allows loss compensation or signal level optimization. VR can
have a voltage value between −1.2 V and 0.4 V, which results in
a differential output swing of 500 mV p-p and 1350 mV p-p.
Increasing the output swing affects the rise and fall times. As
VR becomes higher, the rise and fall times increase. Changing
the VR pin also changes the power dissipation because the
HMC856 can consume between 140 mA and 200 mA at room
temperature depending on the VR pin.
The HMC856 uses a CML interface, which uses 50 Ω internal
terminations to the ground. The input and output pins can be
interfaced with either ac or dc coupling. For ac coupling, using a
series resistor, which is effectively short circuit, and an ac load of
Rev. D | Page 10 of 13
Data Sheet
HMC856
APPLICATIONS INFORMATION
EVALUATION PRINTED CIRCUIT BOARD (PCB)
Table 4. Bill of Materials for the Evaluation PCB 127102-
HMC856LC51
The evaluation PCB of the HMC856 uses RF circuit design
techniques. Signal lines must have 50 Ω impedance whereas the
package ground leads must connect directly to the ground plane
similar to that shown in Figure 25. The exposed metal package
base must connect to VEE. A sufficient number of via holes must
connect the top and bottom ground planes. The evaluation PCB
shown in Figure 24 is available from Analog Devices, Inc., upon
request. Install a jumper on the JP1 header to short VR to GND
for normal operation.
Item
Description
J1 to J4
J5
K connectors
0.1 inch 2 × 5 header
J7 to J14
JP1
C1, C2
C3 to C5
R1, R8
R2
R3 to R7
U1
PCB2
0.04 inch dc pin
0.1 inch 2 position header with shunt
4.7 μF capacitor, Case A
100 pF capacitor, 0402 package
10 Ω resistor, 0603 package
1.2 kΩ resistor, 0603 package
2.7 kΩ resistor, 0603 package
28 Gbps digital time delay HMC856
127100 evaluation board PCB
1 127100 is the raw bare PCB. Reference 127102-HMC856LC5 when ordering
the complete evaluation PCB.
2 Use Arlon 25FR or Rogers 4350 for circuit board material.
Figure 24. Evaluation Board Layout, Top Side
Rev. D | Page 11 of 13
HMC856
Data Sheet
TYPICAL APPLICATION CIRCUIT
VB
J12
VR
J13
GND
J14
R8
10Ω
JP1
1
2
+
C4
100pF
C5
100pF
C2
4.7µF
R1
10Ω
C1
4.7µF
C3
100pF
+
J10
J9
O+
J4
I+
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
J1
50Ω
50Ω
50Ω
50Ω
DELAY
O–
J3
I–
J2
600Ω
600Ω
600Ω 600Ω
600Ω
VT
J8
VS
J7
R7
2.7kΩ
R2
1.2kΩ
R3
2.7kΩ
R4
2.7kΩ
R5
2.7kΩ
R6
2.7kΩ
2
1
4
3
6
5
8
7
10
9
J5
V
EE
J11
Figure 25. Typical Application Circuit
Rev. D | Page 12 of 13
Data Sheet
HMC856
OUTLINE DIMENSIONS
5.13
5.00 SQ
4.87
0.36
0.30
0.24
PIN 1
INDICATOR
PIN 1
(0.32 × 0.32)
25
32
24
1
0.50
BSC
EXPOSED
PAD
3.50 SQ
17
8
16
9
BOTTOM VIEW
3.50 REF
TOP VIEW
SIDE VIEW
0.40
BSC
1.12 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 26. 32-Terminal Ceramic Leadless Chip Carrier [LCC]
(HE-32-1)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature
Range
Moisture Sensitivity
Package
Option
Model1
Level (MSL) Rating2
Package Description
HMC856LC5
HMC856LC5TR
HMC856LC5TR-R5
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
MSL3
MSL3
MSL3
32-Terminal Ceramic Leadless Chip Carrier [LCC]
32-Terminal Ceramic Leadless Chip Carrier [LCC]
32-Terminal Ceramic Leadless Chip Carrier [LCC]
Evaluation Board
HE-32-1
HE-32-1
HE-32-1
127102-
HMC856LC5
1 All models are RoHS compliant parts.
2 See the Absolute Maximum Ratings section.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14720-0-6/18(D)
Rev. D | Page 13 of 13
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