AD14160LKB-4 [ADI]
Quad-SHARC DSP Multiprocessor Family; 四SHARC DSP多处理器家族
| 型号： | AD14160LKB-4 |
| 厂家： | 
ADI |
| 描述： | Quad-SHARC DSP Multiprocessor Family |
| 文件： | 总52页 (文件大小：1195K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Quad-SHARC®
DSP Multiprocessor Family
a
AD14160/AD14160L
PERFORMANCE FEATURES
FUNCTIONAL BLOCK DIAGRAM
ADSP-21060 Core Processor (. . .
؋
4) 480 MFLOPS Peak, 320 MFLOPS Sustained
25 ns Instruction Rate, Single-Cycle
Instruction Execution–Each of Four Processors
16 Mbit Shared SRAM (Internal to SHARCs)
4 Gigawords Addressable Off-Module Memory
Sixteen 40 Mbyte/s Link Ports (Four per SHARC)
Eight 40 Mbit/s Independent Serial Ports (Two
from Each SHARC)
ID
2-0
LINK 0
LINK 0
ID
2-0
CPA
CPA
SPORT 1
SPORT 0
SPORT 1
SPORT 0
TDI
LINK 5
TDO
LINK 5
TDI
SHARC_B
SHARC_A
5 V and 3.3 V Operation
32-Bit Single Precision and 40-Bit Extended
Precision IEEE Floating Point Data Formats, or
32-Bit Fixed Point Data Format
IEEE JTAG Standard 1149.1 Test Access Port and
On-Chip Emulation
SHARC BUS (ADDR31-0
,
DATA47-0 MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK,
,
AD14160/
AD14160L
SBTS, HBR, HBG, REDY, BR6-1, RPBA, DMAR1.2, DMAG1.2
)
PACKAGING FEATURES
452-Lead Ceramic Ball Grid Array (CBGA)
1.85" (47 mm) Body Size
0.200" Max Height
0.050" Ball Pitch
29 Grams (typical)
ID
2-0
ID
2-0
CPA
SPORT 1
SPORT 0
CPA
SHARC_D
SHARC_C
LINK 0
LINK 0
SPORT 1
SPORT 0
TDO
JC = 0.36؇C/W
LINK 5
TDO
LINK 5
TDI
The ADSP-21060 link ports are interconnected to provide
direct communication among the four SHARCs as well as high
speed off-module access. Internally, links connect the SHARC
in a ring. Externally, each SHARC has a total of 160 Mbytes/s
link port bandwidth.
GENERAL DESCRIPTION
The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid
Array (CBGA) puts the power of the first generation AD14060
(CQFP) DSP multiprocessor into a very high density ball grid
array package; now with additional link and serial I/O pinned
out, beyond that from the CQFP package. The core of the multi-
processor is the ADSP-21060 DSP microcomputer. The AD14x60
modules have the highest performance—density and lowest
cost— performance ratios of any in their class. They are ideal
for applications requiring higher levels of performance and/or
functionality per unit area.
Multiprocessor performance is enhanced with embedded power
and ground planes, matched impedance interconnect, and opti-
mized signal routing lengths and separation. The fully tested
and ready-to-insert multiprocessor also significantly reduces
board space.
The AD14160/AD14160L takes advantage of the built-in
multiprocessing features of the ADSP-21060 to achieve 480 peak
MFLOPS with a single chip type, in a single package. The on-
chip SRAM of the DSPs provides 16 Mbits of on-module
shared SRAM. The complete shared bus (48 data, 32 address)
is also brought off-module for interfacing with expansion
memory or other peripherals.
s
s
s
s
SHARC is a registered trademark of Analog Devices, Inc.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
World Wide Web Site: http://www.analog.com
© Analog Devices, Inc., 1998
AD14160/AD14160L
DETAILED DESCRIPTION
Architectural Features
ADSP-21060 Core
is a 10-port, 32-register (16 primary, 16 secondary) file. Each
SHARC’s core also implements two data address generators
(DAGs), implementing circular data buffers in hardware. The
DAGs contain sufficient registers to allow the creation of up to
32 circular buffers. The 48-bit instruction word accommodates a
variety of parallel operations, for concise programming. For ex-
ample, the ADSP-21060 can conditionally execute a multiply, an
add, a subtract, and a branch, all in a single instruction.
The AD14160/AD14160L is based on the powerful ADSP-21060
(SHARC) DSP chip. The ADSP-21060 SHARC combines a
high performance floating-point DSP core with integrated, on-
chip system features including a 4 Mbit SRAM memory, host
processor interface, DMA controller, serial ports, and both link
port and parallel bus connectivity for glueless DSP multiprocess-
ing, (see Figure 1). It is fabricated in a high speed, low power
CMOS process, and has a 25 ns instruction cycle time. The arith-
metic/ logic unit (ALU), multiplier and shifter all perform single-
cycle instructions, and the three units are arranged in parallel,
maximizing computational throughput.
The SHARCs contain 4 Mbits of on-chip SRAM each, orga-
nized as two blocks of 2 Mbits, which can be configured for
different combinations of code and data storage. The memory
can be configured as a maximum of 128K words of 32-bit data,
256K words of 16-bit data, 80K words of 48-bit instructions (or
40-bit data), or combinations of different word sizes up to
4 megabits. A 16-bit floating-point storage format is supported
which effectively doubles the amount of data that may be stored
on chip. Conversion between the 32-bit floating point and 16-
bit floating point formats is done in a single instruction. Each
memory block is dual-ported for single-cycle, independent
accesses by the core processor and I/O processor or DMA con-
troller. The dual-ported memory and separate on-chip buses
allow two data transfers from the core and one from I/O, all in a
single cycle.
The SHARC features an enhanced Harvard architecture in
which the data memory (DM) bus transfers data, and the pro-
gram memory (PM) bus transfers both instructions and data.
There is also an on-chip instruction cache which selectively
caches only those instructions whose fetches conflict with the
PM bus data accesses. This combines with the separate program
and data memory buses to enable three-bus operation for fetch-
ing an instruction and two operands, all in a single cycle. The
SHARC also contains a general purpose data register file, which
DUAL-PORTED SRAM
CORE PROCESSOR
INSTRUCTION
TIMER
JTAG
TWO INDEPENDENT
DUAL-PORTED BLOCKS
7
CACHE
32 x 48-BIT
TEST AND
EMULATION
PROCESSOR PORT
I/O PORT
DATA
ADDR
DATA
ADDR
DATA
ADDR
ADDR
DATA
DAG1
8 x 4 x 32
DAG2
8 x 4 x 24
PROGRAM
SEQUENCER
EXTERNAL
PORT
IOD
48
IOA
17
PM ADDRESS BUS
24
32
32
48
ADDR BUS
MUX
DM ADDRESS BUS
PM DATA BUS
MULTIPROCESSOR
INTERFACE
48
BUS
CONNECT
(PX)
DATA BUS
MUX
DM DATA BUS 40/32
HOST PORT
4
6
DMA
DATA
REGISTER
FILE
IOP
REGISTERS
MEMORY MAPPED)
CONTROLLER
(
SERIAL PORTS
(2)
16 x 40-BIT
BARREL
SHIFTER
6
MULTIPLIER
ALU
CONTROL,
STATUS, AND
DATA BUFFERS
36
LINK PORTS
(6)
I/O PROCESSOR
Figure 1. ADSP-21060 Processor Block Diagram (Core of the AD14160/AD14160L)
REV. A
–2–
AD14160/AD14160L
0x0000 0000
0x0002 0000
0x0040 0000
IOP REGISTERS
INTERNAL
MEMORY
SPACE
(INDIVIDUAL
SHARCs)
BANK 0
MS
MS
MS
0
1
2
NORMAL WORD ADDRESSING
SHORT WORD ADDRESSING
DRAM
(OPTIONAL)
0x0004 0000
0x0008 0000
INTERNAL MEMORY SPACE
OF SHARC_A
BANK 1
BANK 2
ID=001
0x0010 0000
0x0018 0000
INTERNAL MEMORY SPACE
OF SHARC_B
ID=010
INTERNAL
TO AD14160x
INTERNAL MEMORY SPACE
OF SHARC_C
ID=011
EXTERNAL
MEMORY
SPACE
0x0020 0000
0x0028 0000
INTERNAL MEMORY SPACE
OF SHARC_D
MULTIPROCESSOR
MEMORY SPACE
ID=100
MS
BANK 3
3
INTERNAL MEMORY SPACE
OF ADSP-2106x
WITH ID=101
BANK SIZE IS
EXTERNAL
TO AD14160x
0x0030 0000
0x0038 0000
0x003F FFFF
SELECTED BY
MSIZE BIT FIELD OF
SYSCON
INTERNAL MEMORY SPACE
OF ADSP-2106x
WITH ID=110
REGISTER.
BROADCAST WRITE
TO ALL
NONBANKED
ADSP-2106xs
NORMAL WORD ADDRESSING: 32-BIT DATA WORDS
48-BIT INSTRUCTION WORDS
SHORT WORD ADDRESSING: 16-BIT DATA WORDS
0xFFFF FFFF
Figure 2. AD14160/AD14160L Memory Map
SYSTEM EXPANSION
SHARC_A
SHARC_B
ADDR
DATA
1X CLOCK
CLKIN
31-0
LINKS 1, 2, 3, & 4; LINKS 1, 2, 3, & 4;
47-0
RD
IRQ
;
IRQ
;
RESET
2-0
2-0
FLAG
;
FLAG
;
3-0
3-0
TIMEXP,
SPORT1
CPA
TIMEXP,
SPORT1
CPA
WR
ACK
ID
ID
MS
-0
2
-0
2
3-0
BOOTSELECT A
PAGE
AD14160/
AD14160L
BOOTSELECT BCD
SBTS
SW
(QUAD PROCESSOR
CLUSTER)
DMAR1,2
DMAG1,2
ADRCLK
SHARC_D
SHARC_C
CS
HBR
LINKS 1, 2, 3, & 4;
LINKS 1, 2, 3, & 4;
SPORT0
SPORT1
IRQ
;
IRQ
;
2-0
2-0
HBG
FLAG
;
FLAG
;
3-0
3-0
REDY
TIMEXP,
SPORT1
CPA
TIMEXP,
SPORT1
CPA
BR
1-6
JTAG
RPBA
ID
ID
-0
2
-0
2
Figure 3. Complete Shared Memory Multiprocessing System
REV. A
–3–
AD14160/AD14160L
Shared Memory Multiprocessing
The bus master can communicate with slave SHARCs by writ-
ing messages to their internal IOP registers. The MSRG0–
MSRG7 registers are general-purpose registers that can be used
for convenient message passing, semaphores and resource shar-
ing between the SHARCs. For message passing, the master
communicates with a slave by writing and/or reading any of the
eight message registers on the slave. For vector interrupts, the
master can issue a vector interrupt to a slave by writing the
address of an interrupt service routine to the slave’s VIRPT
register. This causes an immediate high priority interrupt on the
slave which, when serviced, will cause it to branch to the speci-
fied service routine.
The AD14160/AD14160L takes advantage of the powerful
multiprocessing features built into the SHARC. The SHARCs are
connected to maximize the performance of this cluster-of-four
architecture, and still allow for off-module expansion. The
AD14160/AD14160L in itself is a complete shared memory
multiprocessing system, as shown in Figure 3. The unified ad-
dress space of the SHARCs allows direct interprocessor ac-
cesses of each SHARCs’ internal memory. In other words, each
SHARC can directly access the internal memory and IOP registers
of each of the other SHARCs by simply reading or writing to the
appropriate address in multi-processor memory space (see Fig-
ure 2)—this is called a direct read or direct write.
Off-Module Memory and Peripherals Interface
Bus arbitration is accomplished with the on-SHARC arbitration
logic. Each SHARC has a unique ID, and drives the Bus-Request
(BR) line corresponding to its ID, while monitoring all others.
BR1–BR4 are used within the AD14160/AD14160L, while BR5
and BR6 can be used for expansion. All bus requests (BR1–BR6)
are included in the module I/O.
The AD14160/AD14160L’s external port provides the interface to
off-module memory and peripherals (see Figure 5). This port
consists of the complete external port bus of the SHARC, bused
together in common among the four SHARCs.
The 4-gigaword off-module address space is included in the
AD14160/AD14160L’s unified address space. Addressing of
external memory devices is facilitated by each SHARC inter-
nally decoding the high order address lines to generate memory
bank select signals. Separate control lines are also generated for
simplified addressing of page-mode DRAM. The AD14160/
AD14160L also supports programmable memory wait states and
external memory acknowledge controls to allow interfacing to
DRAM and peripherals with variable access, hold and disable
time requirements.
Two different priority schemes, fixed and rotating, are available
to resolve competing bus requests. The RPBA pin selects which
scheme is used: when RPBA is high, rotating priority bus arbitra-
tion is selected, and when RPBA is low, fixed priority is selected.
Table I. Rotating Priority Arbitration Example
Hardware Processor IDs
Cycle ID1 ID2
ID3
ID4 ID5 ID6
1
2
3
4
5
M
4
4
5 BR
1 BR
1
2 BR
3
1
1
2
4
4
2
2
3
5
5
3
3
Initial Priority Assignments
Final Priority Assignments
Link Port I/O
5 BR M-BR
5 BR
M
Each individual SHARC features six 4-bit link ports that facili-
tate SHARC-to-SHARC communication and external I/O inter-
facing. Each link port can be configured for either 1× or 2×
operation, allowing each to transfer either 4 or 8 bits per cycle.
The link ports can operate independently and simultaneously,
with a maximum bandwidth of 40 MBytes/s each, or a total of
240 MBytes/s per SHARC.
M
1
3
4 BR
M
2
NOTES
1–5 = Assigned Priority.
M = Bus Mastership (in that cycle).
BR = Requesting Bus Mastership with BRx.
The AD14160/AD14160L provides additional link port I/O
beyond that of the AD14060. Internally, two links from each
SHARC form a ring connection among the four. The remaining
four link ports from each SHARC are brought out indepen-
dently from each SHARC. A maximum of 640 MBytes/s link
port bandwidth is then available off of the AD14160/AD14160L.
The link port connections are detailed in Figure 4.
Bus mastership is passed from one SHARC to another during a
bus transition cycle. A bus transition cycle only occurs when the
current bus master deasserts its BR line and one of the slave
SHARCs asserts its BR line. The bus master can therefore re-
tain bus mastership by keeping its BR line asserted. When the
bus master deasserts its BR line, and no other BR line is as-
serted, then the master will not lose any bus cycles. When more
than one SHARC asserts its BR line, the SHARC with the
highest priority request becomes bus master on the following
cycle. Each SHARC observes all of the BR lines, and therefore
tracks when a bus transition cycle has occurred, and which
processor has become the new bus master. Master processor
changeover incurs only one cycle of overhead. An example bus
transition sequence is shown in Table I.
1
2
1
2
5
5
SHARC_A
SHARC_B
3
4
3
4
0
0
0
0
Bus locking is possible, allowing indivisible read-modify-write
sequences for semaphores. In either the fixed or rotating priority
scheme, it is also possible to limit the number of cycles the
master can control the bus. The AD14160/AD14160L also
provides the option of using the Core Priority Access (CPA)
mode of the SHARC. Using the CPA signal allows external bus
accesses by the core processor of a slave SHARC to take priority
over ongoing DMA transfers. Also, each SHARC can broadcast
write to all other SHARCs simultaneously, allowing the implemen-
tation of reflective semaphores.
1
2
1
2
SHARC_D
SHARC_C
3
4
3
4
5
5
Figure 4. Link Port Connections
REV. A
–4–
AD14160/AD14160L
AD14160/
AD14160L
1x
CLOCK
CLKIN
RESET
RPBA
ID
ADDR
ADDR
DATA
31–0
GLOBAL
MEMORY
DATA
47–0
RESET
AND
RD
WR
OE
PERIPHERALS
(OPTIONAL)
WE
ACK
ACK
3
MS
CS
3–0
CS
BMS
BOOT
EPROM
(OPTIONAL)
PAGE
ADDR
DATA
SBTS
SW
CONTROL
ADRCLK
CS
HBR
HOST
PROCESSOR
INTERFACE
(OPTIONAL)
HBG
REDY
ADDR
DATA
SERIALS
LINKS
CPA
5
BR
2–6
DISCRETES
BR
1
ADSP-2106x #5
(OPTIONAL)
ADDR
31–0
47–0
CLKIN
DATA
RESET
RPBA
ID
3
CONTROL
CPA
5
BR
, 2, 3, 4, 6
1
BR
5
ADSP-2106x #6
(OPTIONAL)
ADDR
DATA
CLKIN
31–0
47–0
RESET
RPBA
ID
3
CONTROL
CPA
BR
5
1–5
BR
6
Figure 5. Optional System Interconnections
REV. A
–5–
AD14160/AD14160L
Link port 4, the boot link port, is brought off independently
from each SHARC. Individual booting is then allowed, or
chained link port booting is possible as described under “Link
Port Booting.”
to become bus master and boot itself. Only the BMS pin of
SHARC_A is connected to the chip select of the EPROM.
When SHARC_A has finished booting, it can boot the re-
maining ADSP-21060s by writing to their external port DMA
buffer 0 (EPB0) via multiprocessor memory space.
Link port data is packed into 32-bit or 48-bit words, and can be
directly read by the SHARC core processor or DMA-transferred
to on-SHARC memory.
All ADSP-21060s Boot in Turn From a Single EPROM.
The BMS signals from each ADSP-21060 may be wire-ORed
together to drive the chip select pin of the EPROM. Each
ADSP-21060 can boot in turn, according to its priority. When
the last one has finished booting, it must inform the others (which
may be in the idle state) that program execution can begin.
Each link port has its own double-buffered input and output
registers. Clock/acknowledge handshaking controls link port
transfers. Transfers are programmable as either transmit or
receive.
Multiprocessor Link Port Booting
Serial Ports
Booting can also be accomplished from a single source through
the link ports. Link Buffer 4 must always be used for booting.
To simultaneously boot all of the ADSP-21060s, a parallel
common connection is available through Link Port 4 on each of
the processors. Or, using the daisy chain connection that exists
between the processors’ link ports, each ADSP-21060 can boot
the next one in turn. In this case, the Link Assignment Register
(LAR) must be programmed to configure the internal link ports
with Link Buffer 4.
The SHARC serial ports provide an inexpensive interface to a
wide variety of digital and mixed-signal peripheral devices. Each
SHARC has two serial ports. All eight of the AD14160/AD14160L
serial ports are brought off-module.
The serial ports can operate at the full clock rate of the module,
providing each with a maximum data rate of 40 Mbit/s. Inde-
pendent transmit and receive functions provide more flexible
communications. Serial port data can be automatically trans-
ferred to and from on-SHARC memory via DMA, and each of
the serial ports offers time division multiplexed (TDM) multi-
channel mode.
Multiprocessor Booting From External Memory
If external memory contains a program after reset, then
SHARC_A should be set up for no boot mode; it will begin ex-
ecuting from address 0x0040 0004 in external memory. When
booting has completed, the other ADSP-21060s may be booted
by SHARC_A if they are set up for host booting, or they can
begin executing out of external memory if they are set up for no
boot mode. Multiprocessor bus arbitration will allow this booting
to occur in an orderly manner.
The serial ports can operate with little-endian or big-endian
transmission formats, with word lengths selectable from 3 bits to
32 bits. They offer selectable synchronization and transmit
modes as well as optional µ-law or A-law companding. Serial
port clocks and frame syncs can be internally or externally
generated.
Program Booting
Host Processor Interface
The AD14160/AD14160L supports automatic downloading of
programs following power-up or a software reset. The SHARC
offers four options for program booting: 1) from an 8-bit
EPROM; 2) from a host processor; 3) through the link ports;
and 4) no-boot. In no-boot mode, the SHARC starts executing
instructions from address 0x0040 0004 in external memory.
The boot mode is selected by the state of the following signals:
BMS, EBOOT, and LBOOT.
The AD14160/AD14160L’s host interface allows for easy con-
nection to standard microprocessor buses, both 16-bit and 32-
bit, with little additional hardware required. Asynchronous
transfers at speeds up to the full clock rate of the module are
supported. The host interface is accessed through the AD14160/
AD14160L external port and is memory-mapped into the uni-
fied address space. Four channels of DMA are available for the
host interface; code and data transfers are accomplished with
low software overhead.
On the AD14160/AD14160L, SHARC_A’s boot mode is sepa-
rately controlled, while SHARCs B, C, and D are controlled as
a group. With this flexibility, the AD14160/AD14160L can be
configured to boot in any of the following methods.
The host processor requests the AD14160/AD14160L’s external
bus with the host bus request (HBR), host bus grant (HBG),
and ready (REDY) signals. The host can directly read and write
the internal memory of the SHARCs, and can access the DMA
channel setup and mailbox registers. Vector interrupt support is
provided for efficient execution of host commands.
Multiprocessor Host Booting
To boot multiple ADSP-21060 processors from a host, each
ADSP-21060 must have its EBOOT, LBOOT and BMS pins
configured for host booting: EBOOT = 0, LBOOT = 0, and
BMS = 1. After system power-up, each ADSP-21060 will be in
the idle state and the BRx bus request lines will be deasserted.
The host must assert the HBR input and boot each ADSP-21060
by asserting its CS pin and downloading instructions.
Direct Memory Access (DMA) Controller
The SHARCs on-chip DMA control logic allows zero-over-
head data transfers without processor intervention. The DMA
controller operates independently and invisibly to each SHARCs
processor core, allowing DMA operations to occur while the core
is simultaneously executing its program instructions.
Multiprocessor EPROM Booting
There are two methods of booting the multiprocessor system
from an EPROM.
DMA transfers can occur between SHARC internal memory
and either external memory, external peripherals, or a host
processor. DMA transfers can also occur between the SHARC’s
internal memory and its serial ports or link ports. DMA trans-
fers between external memory and external peripheral devices are
another option. External bus packing to 16-, 32- or 48-bit words
is performed during DMA transfers.
SHARC_A Is Booted, Which Then Boots the Others. The
EBOOT pin on the SHARC_A must be set high for EPROM
booting. All other ADSP-21060s should be configured for host
booting (EBOOT = 0, LBOOT = 0, and BMS = 1), which
leaves them in the idle state at start-up and allows SHARC_A
REV. A
–6–
AD14160/AD14160L
Ten channels of DMA are available on the SHARCs—two via
the link ports, four via the serial ports, and four via the processor’s
external port (for either host processor, other SHARCs, memory,
or I/O transfers). Four additional link port DMA channels are
shared with serial port 1 and the external port. Programs can be
downloaded to the SHARCs using DMA transfers. Asynchro-
nous off-module peripherals can control two DMA channels
using DMA Request/Grant lines (DMAR1-2, DMAG1-2).
Other DMA features include interrupt generation upon comple-
tion of DMA transfers and DMA chaining for automatic linked
DMA transfers.
EZ-ICE provides full-speed emulation, allowing inspection and
modification of memory, registers and processor stacks.
Nonintrusive in-circuit emulation is assured by the use of the
processor’s JTAG interface—the emulator does not affect target
system loading or timing.
Further details and ordering information are available in the
ADSP-21000 Family Hardware & Software Development Tools
data sheet (ADDS-2100xx-TOOLS). This data sheet can be
requested from any Analog Devices sales office or distributor,
or from the Literature Center.
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the SHARC processor family. Hard-
ware tools include SHARC PC plug-in cards, multiprocessor
SHARC VME boards, and daughter card modules with multiple
SHARCs and additional memory. These modules are based on
the SHARCPAC™ module specification. Third party software
tools include an Ada compiler, DSP libraries, operating systems
and block diagram design tools.
Development Tools
The AD14160/AD14160L is supported with a complete set
of software and hardware development tools, including an
EZ-LAB® In-Circuit Emulator, and development software.
Analog Devices’ ADSP-21000 Family Development Software
includes an easy to use Assembler based on an algebraic syntax,
an Assembly Library/Librarian, a Linker, an Instruction-Level
Simulator, an ANSI C optimizing Compiler, the CBug™ C
Source-Level Debugger, and a C Runtime Library including
DSP and mathematical functions. The Optimizing Compiler
includes Numerical C extensions based on the work of the ANSI
Numerical C Extensions Group. Numerical C provides exten-
sions to the C language for array selection, vector math op-
erations, complex data types, circular pointers and variably
dimensioned arrays. The ADSP-21000 Family Development
Software is available for both the PC and Sun platforms.
Other Package Details
The AD14160/AD14160L contains 14 on-module 0.1 micro-
farad bypass capacitors. It is recommended that in the target
system at least four additional capacitors, of 0.018 microfarad
value, be placed around the module—one near each of the four
corners.
The top surface, lid, of the AD14160/AD14160L is electrically
connected to GND.
The SHARC EZ-KIT combines the ADSP-21000 Family De-
velopment Software for the PC and the EZ-LAB Development
Board in one package.
The ADSP-2106x EZ-ICE® Emulator uses the IEEE 1149.1
JTAG test access port of the ADSP-2106x processor to monitor
and control the target board processor during emulation. The
Additional Information
This data sheet provides a general overview of the AD14160/
AD14160L architecture and functionality. For detailed infor-
mation on the ADSP-2106x SHARC and the ADSP-21000
Family core architecture and instruction set, refer to the
ADSP-2106x SHARC User’s Manual.
EZ-ICE and EZ-LAB are registered trademarks of Analog Devices, Inc.
CBug and SHARCPAC are trademarks of Analog Devices, Inc.
REV. A
–7–
AD14160/AD14160L
PIN FUNCTION DESCRIPTIONS
TCLKx, RCLKx, LxDAT3-0, LxCLK, LxACK, TMS and
TDI)—these pins can be left floating. These pins have a logic-
level hold circuit that prevents the input from floating internally.
AD14160/AD14160L pin definitions are listed below. Inputs
identified as synchronous (S) must meet timing requirements
with respect to CLKIN (or with respect to TCK for TMS,
TDI). Inputs identified as asynchronous (A) can be asserted
asynchronously to CLKIN (or to TCK for TRST).
A = Asynchronous O = Output
(A/D) = Active Drive
G = Ground
I = Input
P = Power Supply (O/D) = Open Drain
S = Synchronous
Unused inputs should be tied or pulled to VDD or GND, except
for ADDR31-0, DATA47-0, FLAG2-0, SW, and inputs that have
internal pull-up or pull-down resistors (CPA, ACK, DTx, DRx,
T = Three-State (when SBTS is asserted, or when the AD14160/
AD14160L is a bus slave)
Pin
Type
Function
ADDR31-0
I/O/T
External Bus Address. (Common to all SHARCs) The AD14160/AD14160L outputs addresses for
external memory and peripherals on these pins. In a multiprocessor system, the bus master outputs ad-
dresses for read/writes on the internal memory or IOP registers of slave ADSP-2106xs. The AD14160/
AD14160L inputs addresses when a host processor or multiprocessing bus master is reading or writing
the internal memory or IOP registers of internal ADSP-21060s.
DATA47-0
I/O/T
O/T
External Bus Data. (Common to all SHARCs) The AD14160/AD14160L inputs and outputs data and
instructions on these pins. 32-bit single-precision floating-point data and 32-bit fixed-point data is trans-
ferred over bits 47-16 of the bus. 40-bit extended-precision floating-point data is transferred over bits 47-
8 of the bus. 16-bit short word data is transferred over bits 31-16 of the bus. In PROM boot mode, 8-bit
data is transferred over bits 23-16. Pull-up resistors on unused DATA pins are not necessary.
MS3-0
Memory Select Lines. (Common to all SHARCs) These lines are asserted (low) as chip selects for the
corresponding banks of external memory. Memory bank size must be defined in the individual ADSP-
21060’s system control registers (SYSCON). The MS3-0 lines are decoded memory address lines that
change at the same time as the other address lines. When no external memory access is occurring the MS3-0
lines are inactive; they are active, however, when a conditional memory access instruction is executed, whether
or not the condition is true. MS0 can be used with the PAGE signal to implement a bank of DRAM memory
(Bank 0). In a multiprocessing system, the MS3-0 lines are output by the bus master.
RD
I/O/T
I/O/T
O/T
Memory Read Strobe. (Common to all SHARCs) This pin is asserted (low) when the AD14160/
AD14160L reads from external devices or when the internal memory of internal ADSP-2106xs is being
accessed. External devices (including other ADSP-2106xs) must assert RD to read from the AD14160/
AD14160L’s internal memory. In a multiprocessing system, RD is output by the bus master and is input
by all other ADSP-2106xs.
WR
Memory Write Strobe. (Common to all SHARCs) This pin is asserted (low) when the AD14160/
AD14160L writes to external devices or when the internal memory of internal ADSP-2106xs is being
accessed. External devices (including other ADSP-2106xs) must assert WR to write to the AD14160/
AD14160L’s internal memory. In a multiprocessing system WR is output by the bus master and is input by all
other ADSP-2106xs.
PAGE
DRAM Page Boundary. (Common to all SHARCs) The AD14160/AD14160L asserts this pin to signal
that an external DRAM page boundary has been crossed. DRAM page size must be defined in the indi-
vidual ADSP-21060’s memory control register (WAIT). DRAM can only be implemented in external
memory Bank 0; the PAGE signal can only be activated for Bank 0 accesses. In a multiprocessing system,
PAGE is output by the bus master.
ADRCLK
O/T
Clock Output Reference. (Common to all SHARCs) In a multiprocessing system, ADRCLK is output
by the bus master.
SW
I/O/T
Synchronous Write Select. (Common to all SHARCs) This signal is used to interface the AD14160/
AD14160L to synchronous memory devices (including other ADSP-2106xs). The AD14160/AD14160L
asserts SW (low) to provide an early indication of an impending write cycle, which can be aborted if WR
is not later asserted (e.g., in a conditional write instruction). In a multiprocessing system, SW is output
by the bus master and is input by all other ADSP-2106xs to determine if the multiprocessor memory
access is a read or write. SW is asserted at the same time as the address output. A host processor using
synchronous writes must assert this pin when writing to the AD14160/AD14160L.
ACK
I/O/S
Memory Acknowledge. (Common to all SHARCs) External devices can deassert ACK (low) to add
wait states to an external memory access. ACK is used by I/O devices, memory controllers, or other pe-
ripherals to hold off completion of an external memory access. The AD14160/AD14160L deasserts ACK,
as an output, to add wait states to a synchronous access of its internal memory. In a multiprocessing
system, a slave ADSP-2106x deasserts the bus master’s ACK input to add wait state(s) to an access of its
internal memory. The bus master has a keeper latch on its ACK pin that maintains the input at the level
it was last driven to.
REV. A
–8–
AD14160/AD14160L
Pin
Type
Function
SBTS
I/S
Suspend Bus Three-State. (Common to all SHARCs) External devices can assert SBTS (low) to
place the external bus address, data, selects, and strobes in a high impedance state for the following cycle.
If the AD14160/AD14160L attempts to access external memory while SBTS is asserted, the processor
will halt and the memory access will not be completed until SBTS is deasserted. SBTS should only be
used to recover from host processor/AD14160/AD14160L deadlock, or used with a DRAM controller.
HBR
HBG
I/A
I/O
Host Bus Request. (Common to all SHARCs) Must be asserted by a host processor to request control
of the AD14160/AD14160L’s external bus. When HBR is asserted in a multiprocessing system, the
ADSP-2106x that is bus master will relinquish the bus and assert HBG. To relinquish the bus, the
ADSP-2106x places the address, data, select, and strobe lines in a high impedance state. HBR has priority
over all ADSP-2106x bus requests (BR6-1) in a multiprocessing system.
Host Bus Grant. (Common to all SHARCs) Acknowledges an HBR bus request, indicating that the
host processor may take control of the external bus. HBG is asserted (held low) by the AD14160/
AD14160L until HBR is released. In a multiprocessing system, HBG is output by the ADSP-2106x bus
master and is monitored by all others.
CSA
I/A
I/A
I/A
I/A
O
Chip Select. Asserted by host processor to select SHARC_A.
Chip Select. Asserted by host processor to select SHARC_B.
Chip Select. Asserted by host processor to select SHARC_C.
Chip Select. Asserted by host processor to select SHARC_D.
CSB
CSC
CSD
REDY (O/D)
Host Bus Acknowledge. (Common to all SHARCs) The AD14160/AD14160L deasserts REDY (low)
to add wait states to an asynchronous access of its internal memory or IOP registers by a host. Open drain
output (O/D) by default; can be programmed in ADREDY bit of SYSCON register of individual ADSP-
21060s to be active drive (A/D). REDY will only be output if the CS and HBR inputs are asserted.
BR6-1
I/O/S
I
Multiprocessing Bus Requests. (Common to all SHARCs) Used by multiprocessing ADSP-2106xs to
arbitrate for bus mastership. An ADSP-2106x only drives its own BRx line (corresponding to the value of
its ID2-0 inputs) and monitors all others. In a multiprocessor system with less than six ADSP-2106xs, the
unused BRx pins should be pulled high; BR4-1 must not be pulled high or low because they are outputs.
IDy2-0
Multiprocessing ID. (Individual ID2–0 from y = SHARC_A, SHARC_B, SHARC_C, SHARC_D.)
Determines which multiprocessing bus request (BR1–BR6) is used by individual ADSP-2106x’s. ID =
001 corresponds to BR1, ID = 010 corresponds to BR2, etc. ID = 000 is reserved for single processor
systems. These lines are a system configuration selection, which should be hardwired or only changed at
reset.
RPBA
I/S
Rotating Priority Bus Arbitration Select. (Common to all SHARCs) When RPBA is high, rotating
priority for multiprocessor bus arbitration is selected. When RPBA is low, fixed priority is selected. This
signal is a system configuration selection that must be set to the same value on every ADSP-2106x. If the
value of RPBA is changed during system operation, it must be changed in the same CLKIN cycle on
every ADSP-2106x.
CPAy (O/D)
I/O
Core Priority Access. (y = SHARC_A, B, C, D) Asserting its CPA pin allows the core processor of an
ADSP-2106x bus slave to interrupt background DMA transfers and gain access to the external bus.
CPA is an open drain output that is connected to all ADSP-2106x in the system if this function is
required. The CPA pin of each internal ADSP-21060 is brought out individually. The CPA pin has
an internal 5 kΩ pull-up resistor. If core access priority is not required in a system, the CPA pin
should be left unconnected.
DTy0
O/T
I
Data Transmit (Serial Port 0 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D). DT
pin has a 50 kΩ internal pull-up resistor.
DRy0
Data Receive (Serial Port 0 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D). DR pin
has a 50 kΩ internal pull-up resistor.
TCLKy0
RCLKy0
I/O
I/O
Transmit Clock (Serial Port 0 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D).
TCLK pin has a 50 kΩ internal pull-up resistor.
Receive Clock (Serial Port 0 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D). RCLK
pin has a 50 kΩ internal pull-up resistor.
TFSy0
RFSy0
I/O
I/O
Transmit Frame Sync (Serial Port 0 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D).
Receive Frame Sync (Serial Port 0 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D).
REV. A
–9–
AD14160/AD14160L
Pin
Type
Function
DTy1
O/T
Data Transmit (Serial Port 1 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D) DT pin
has a 50 kΩ internal pull-up resistor.
DRy1
I
Data Receive (Serial Port 1 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D) DR pin
has a 50 kΩ internal pull-up resistor.
TCLKy1
RCLKy1
I/O
I/O
Transmit Clock (Serial Port 1 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D) TCLK
pin has a 50 kΩ internal pull-up resistor.
Receive Clock (Serial Port 1 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D) RCLK
pin has a 50 kΩ internal pull-up resistor.
TFSy1
I/O
Transmit Frame Sync (Serial Port 1 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D)
Receive Frame Sync (Serial Port 1 individual from SHARC_A, SHARC_B, SHARC_C, SHARC_D)
RFSy1
I/O
FLAGy3-0
I/O/A
Flag Pins. (Individual FLAG3-0 from y = SHARC_A, SHARC_B, SHARC_C, SHARC_D) Each is
configured via control bits as either an input or output. As an input, it can be tested as a condition. As an
output, it can be used to signal external peripherals.
IRQy2-0
I/A
Interrupt Request Lines. (Individual IRQ2-0 from y = SHARC_A, SHARC_B, SHARC_C, SHARC_D)
May be either edge-triggered or level-sensitive.
DMAR1
DMAR2
DMAG1
DMAG2
LyxCLK
I/A
DMA Request 1 (DMA Channel 7). Common to SHARC_A, SHARC_B, SHARC_C, SHARC_D.
DMA Request 2 (DMA Channel 8). Common to SHARC_A, SHARC_B, SHARC_C, SHARC_D.
DMA Grant 1 (DMA Channel 7). Common to SHARC_A, SHARC_B, SHARC_C, SHARC_D.
DMA Grant 2 (DMA Channel 8). Common to SHARC_A, SHARC_B, SHARC_C, SHARC_D.
Link Port Clock (y = SHARC_A, B, C, D; x = Link Ports 1, 2, 3, 4)1. Each LyxCLK pin has a 50 kΩ
internal pull-down resistor which is enabled or disabled by the LPDRD bit of the LCOM register, of the
ADSP-20160.
I/A
O/T
O/T
I/O
LyxDAT3-0
LyxACK
EBOOTA
LBOOTA
BMSA
I/O
Link Port Data (y = SHARC_A, B, C, D; x = Link Ports 1, 2, 3, 4)1. Each LyxDAT pin has a
50 kΩ internal pull-down resistor which is enabled or disabled by the LPDRD bit of the LCOM register,
of the ADSP-21060.
Link Port Acknowledge (y = SHARC_A, B, C, D; x = Link Ports 1, 2, 3, 4)1. Each LyxACK pin has a
50 kΩ internal pull-down resistor which is enabled or disabled by the LPDRD bit of the LCOM register,
of the ADSP-21060.
I/O
I
EPROM Boot Select. (SHARC_A) When EBOOTA is high, SHARC_A is configured for booting from
an 8-bit EPROM. When EBOOTA is low, the LBOOTA and BMSA inputs determine booting mode for
SHARC_A. See the following table. This signal is a system configuration selection which should be hardwired.
I
Link Boot. When LBOOTA is high, SHARC_A is configured for link port booting. When LBOOTA is
low, SHARC_A is configured for host processor booting or no booting. See the following table. This
signal is a system configuration selection which should be hardwired.
I/O/T2
Boot Memory Select. Output: Used as chip select for boot EPROM devices (when EBOOTA = 1,
LBOOTA = 0). In a multiprocessor system, BMS is output by the bus master. Input: When low, indicates
that no booting will occur and that SHARC_A will begin executing instructions from external memory.
See the following table. This input is a system configuration selection which should be hardwired.
EBOOTBCD
LBOOTBCD
I
I
EPROM Boot Select. (Common to SHARC_B, SHARC_C, SHARC_D) When EBOOTBCD is high,
SHARC_B, C, D are configured for booting from an 8-bit EPROM. When EBOOTBCD is low, the
LBOOTBCD and BMSBCD inputs determine booting mode for SHARC_B, C and D. See the following
table. This signal is a system configuration selection which should be hardwired.
LINK Boot. (Common to SHARC_B, SHARC_C, SHARC_D) When LBOOTBCD is high, SHARC_B, C,
D are configured for link port booting. When LBOOTBCD is low, SHARC_B, C, D are configured for
host processor booting or no booting. See the following table. This signal is a system configuration selec-
tion which should be hardwired.
REV. A
–10–
AD14160/AD14160L
Pin
Type
Function
BMSBCD
I/O/T2
Boot Memory Select. Output: Used as chip select for boot EPROM devices (when EBOOTBCD = 1,
LBOOTBCD = 0). In a multiprocessor system, BMS is output by the bus master. Input: When low,
indicates that no booting will occur and that SHARC_B, C, D will begin executing instructions from
external memory. See table below. This input is a system configuration selection which should be
hardwired.
EBOOT
LBOOT
BMS
Booting Mode
1
0
0
0
0
1
0
0
1
0
1
1
Output
1 (Input) Host Processor
1 (Input) Link Port
0 (Input) No Booting. Processor executes from external memory.
0 (Input) Reserved
EPROM (Connect BMS to EPROM chip select)
x (Input) Reserved
TIMEXPy
CLKIN
O
I
Timer Expired. (Individual TIMEXP from y = SHARC_A, SHARC_B, SHARC_C, SHARC_D) Asserted
for four cycles when the timer is enabled and TCOUNT decrements to zero.
Clock In. (Common to all SHARCs) External clock input to the AD14160/AD14160L. The instruction
cycle rate is equal to CLKIN. CLKIN may not be halted, changed, or operated below the minimum specified
frequency.
RESET
TCK
TMS
TDI
I/A
I
Module Reset. (Common to all SHARCs) Resets the AD14160/AD14160L to a known state. This input
must be asserted (low) at power-up.
Test Clock (JTAG). (Common to all SHARCs) Provides an asynchronous clock for JTAG boundary
scan.
I/S
I/S
Test Mode Select (JTAG). (Common to all SHARCs) Used to control the test state machine. TMS has
a 20 kΩ internal pull-up resistor.
Test Data Input (JTAG). Provides serial data for the boundary scan logic chain starting at SHARC_A.
TDI has a 20 kΩ internal pull-up resistor.
TDO
O
Test Data Output (JTAG). Serial scan output of the boundary scan chain path, from SHARC_D.
TRST
I/A
Test Reset (JTAG). (Common to all SHARCs) Resets the test state machine. TRST must be asserted
(pulsed low) after power-up or held low for proper operation of the AD14160/AD14160L. TRST has a
20 kΩ internal pull-up resistor.
EMU (O/D)
O
Emulation Status. (Common to all SHARCs) Must be connected to the ADSP-2106x EZ-ICE target
board connector only.
VDD
P
Power Supply. Nominally +5.0 V dc for 5 V devices or +3.3 V dc for 3.3 V devices (50 pins).
Power Supply Return. (64 pins).
GND
G
NOTES
1LINK PORTS 0 and 5 are connected internally as described earlier in Link Port I/O.
2Three-statable only in EPROM boot mode (when BMS is an output).
REV. A
–11–
AD14160/AD14160L
The 14-pin, 2-row pin strip header is keyed at the Pin 3 location;
Pin 3 must be removed from the header. The pins must be
0.025 inch square and at least 0.20 inch in length. Pin spacing
should be 0.1 × 0.1 inches. Pin strip headers are available from
vendors such as 3M, McKenzie and Samtec.
TARGET BOARD CONNECTOR FOR EZ-ICE PROBE
The ADSP-2106x EZ-ICE Emulator uses the IEEE 1149.1
JTAG test access port of the ADSP-2106x to monitor and con-
trol the target board processor during emulation. The EZ-ICE
probe requires that the AD14160/AD14160L’s CLKIN (op-
tional), TMS, TCK, TRST, TDI, TDO, EMU and GND signals
be made accessible on the target system via a 14-pin connector
(a pin strip header) such as that shown in Figure 6. The EZ-
ICE probe plugs directly onto this connector for chip-on-board
emulation. You must add this connector to your target board
design if you intend to use the ADSP-2106x EZ-ICE. The
length of the traces between the connector and the AD14160/
AD14160L’s JTAG pins should be as short as possible.
The BTMS, BTCK, BTRST and BTDI signals are provided so
that the test access port can also be used for board-level testing.
When the connector is not being used for emulation, place
jumpers between the Bxxx pins and the xxx pins as shown in
Figure 6. If you are not going to use the test access port for
board testing, tie BTRST to GND and tie or pull up BTCK to
V
DD. The TRST pin must be asserted after power-up (through
BTRST on the connector) or held low for proper operation of
the AD14160/AD14160L. None of the Bxxx pins (Pins 5, 7, 9,
11) are connected on the EZ-ICE probe.
1
2
EMU
GND
The JTAG signals are terminated on the EZ-ICE probe as follows:
3
5
4
6
KEY (NO PIN)
CLKIN (OPTIONAL)
TMS
Signal
Termination
TMS
TCK
Driven through 22 Ω Resistor (16 mA/3.2 mA Driver)
Driven at 10 MHz through 22 Ω Resistor (16 mA/
3.2 mA Driver)
Driven by Open-Drain Driver* (Pulled Up by On-Chip
20 kΩ Resistor)
Driven by 16 mA/3.2 mA Driver
One TTL Load, No Termination
BTMS
7
9
8
TCK
BTCK
TRST
10
12
BTRST
TRST
TDI
TDO
11
BTDI
GND
TDI
CLKIN One TTL Load, No Termination (Optional Signal)
EMU
4.7 kΩ Pull-Up Resistor, One TTL Load (Open-Drain
Output from ADSP-2106x)
13
14
TDO
*TRST is driven low until the EZ-ICE probe is turned on by the EZ-ICE
TOP VIEW
software (after the invocation command).
Figure 6. Target Board Connector for ADSP-2106x EZ-ICE
Emulator (Jumpers in Place)
Figure 7 shows JTAG scan path connections for the multi-
processor system.
JTAG DEVICE
(OPTIONAL)
ADSP-2106x
#n
SHARC_A
SHARC_B
SHARC_C
SHARC_D
TDI
TDI
TDO
TDI
TDO
TDI
TDO
TDI
TDO
TDI
TDO
TDI
TDO
EZ-ICE
JTAG
CONNECTOR
OTHER
JTAG
CONTROLLER
TCK
TMS
EMU
TRST
TDO
CLKIN
OPTIONAL
Figure 7. JTAG Scan Path Connections for the AD14160/AD14160L
REV. A
–12–
AD14160/AD14160L
Connecting CLKIN to Pin 4 of the EZ-ICE header is optional.
The emulator only uses CLKIN when directed to perform op-
erations such as starting, stopping and single-stepping multiple
ADSP-2106xs in a synchronous manner. If you do not need
these operations to occur synchronously on the multiple proces-
sors, simply tie Pin 4 of the EZ-ICE header to ground.
treated as critical signals in terms of skew, and should be laid
out as short as possible on your board. If TCK, TMS and
CLKIN are driving a large number of ADSP-2106xs (more than
eight) in your system, then treat them as a “clock tree” using
multiple drivers to minimize skew. (See Figure 8 JTAG Clock
Tree and Clock Distribution in the “High Frequency Design
Considerations” section of the ADSP-2106x User’s Manual).
If synchronous multiprocessor operations are needed and
CLKIN is connected, clock skew between the AD14160/
AD14160L and the CLKIN pin on the EZ-ICE header must be
minimal. If the skew is too large, synchronous operations may
be off by one cycle between processors. For synchronous multi-
processor operation TCK, TMS, CLKIN and EMU should be
If synchronous multiprocessor operations are not needed (i.e.,
CLKIN is not connected), just use appropriate parallel termina-
tion on TCK and TMS. TDI, TDO, EMU and TRST are not
critical signals in terms of skew.
TDI
TDO
TDI
TDO
TDI
TDO
5k⍀
*
TDI
TDO
TDI
TDO
TDI
TDO
TDI
5k⍀
*
EMU
TCK
TMS
TRST
TDO
SYSTEM
CLKIN
CLKIN
EMU
*
OPEN DRAIN DRIVER OR EQUIVALENT, i.e.,
Figure 8. JTAG Clocktree for Multiple ADSP-2106x Systems
REV. A
–13–
AD14160/AD14160L–SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
B Grade
Min
K Grade
Parameter
Max
Min
Max
Units
VDD
Supply Voltage (5 V)
Supply Voltage (3.3 V)
Case Operating Temperature
4.75
3.15
–40
5.25
3.6
+100
4.75
3.15
0
5.25
3.6
+85
V
V
°C
TCASE
ELECTRICAL CHARACTERISTICS (5 V, 3.3 V SUPPLY)
Case Test
5 V
3.3 V
Min Typ Max
Parameter
Temp Level Test Condition
Min Typ Max
Units
VIH1
VIH2
VIL
VOH
VOL
IIH
IIHX4
IIL
IILX4
IILP
IILPX4
IOZH
High Level Input Voltage1
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
@ VDD = max
@ VDD = max
@ VDD = min
2.0
2.2
VDD + 0.5 2.0
VDD + 0.5 2.2
0.8
2.4
0.4
10
40
10
40
150
600
10
40
10
VDD + 0.5
VDD + 0.5
0.8
V
V
V
V
High Level Input Voltage2
Low Level Input Voltage1, 2
High Level Output Voltage3, 4
Low Level Output Voltage3, 4
High Level Input Current5, 6
High Level Input Current7, 8
Low Level Input Current5
Low Level Input Current7
Low Level Input Current6
Low Level Input Current8
Three-State Leakage Current9, 10, 11
@ VDD = min, IOH = –2.0 mA4
@ VDD = min, IOL = 4.0 mA4
@ VDD = max, VIN = VDD max
@ VDD = max, VIN = VDD max
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = VDD max
@ VDD = max, VIN = VDD max
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = VDD max
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 0 V
@ VDD = max, VIN = 2 V (3.3 V),
1.5 V (5 V)
4.1
0.4
10
40
10
40
150
600
10
40
10
V
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
mA
mA
IOZHX4 Three-State Leakage Current12
IOZL
Three-State Leakage Current9, 13
Three-State Leakage Current12
Three-State Leakage Current13
Three-State Leakage Current14
IOZLX4
IOZHP
IOZLC
40
40
350
1.5
4.2
350
1.5
4.2
IOZLAR Three-State Leakage Current11
IOZLA
Three-State Leakage Current15
350
150
1.4 3.4
800
350
150
2.2
µA
µA
A
mA
pF
IOZLS
IDDIN
Three-State Leakage Current10
Supply Current (Internal)16
Full
Full
Full
+25°C
I
IV
I
@ VDD = max, VIN = 0 V
tCK = 25 ns, VDD = max
VDD = max
1
IDDIDLE Supply Current (Idle)17
760
CIN
Input Capacitance18, 19
V
15
15
EXPLANATION OF TEST LEVELS
Test Level
I
II
100% Production Tested20
.
100% Production Tested at +25°C, and Sample Tested at Specified Temperatures.
III
IV
V
Sample Tested Only.
Parameter is guaranteed by design and analysis, and characterization testing on discrete SHARCs.
Parameter is typical value only.
All devices are 100% production tested at +25°C; sample tested at temperature extremes.
VI
NOTES
1 Applies to input and bidirectional pins: DATA47-0, ADDR31-0, RD, WR, SW, ACK, SBTS, IRQy2-0, FLAGy0-3, HBG, CSy, DMAR1, DMAR2, BR6-1, IDy0-2,
RPBA, CPAy, TFSy0, TFSy1, RFSy0, RFSy1, LyxDAT3-0, LyxCLK, LyxACK, EBOOTA, LBOOTA, EBOOTBCD, LBOOTBCD, BMSA, BMSBCD, TMS,
TDI, TCK, HBR, DRy0, DRy1, TCLKy0, TCLKy1, RCLKy0, RCLKy1.
2 Applies to input pins: CLKIN, RESET, TRST.
3 Applies to output and bidirectional pins: DATA47-0, ADDR31-0, MS3-0 RD, WR, PAGE, ADRCLK, SW, ACK, FLAGy0-3, TIMEXPy, HBG, REDY, DMAG1,
DMAG2, BR6-1, CPAy, DTy0, DTy1, TCLKy0, TCLKy1, RCLKy0, RCLKy1, TFSy0, TFSy1, RFSy0, RFSy1 LyxDAT 3-0, LyxCLK, LyxACK, BMSA,
BMSBCD, TDO, EMU.
4 See Output Drive Currents for typical drive current capabilities.
5Applies to input pins: IRQy2-0, CSy, IDy0-2, EBOOTA, LBOOTA.
6 Applies to input pins with internal pull-ups: DRy0, DRy1, TDI.
7Applies to bussed input pins: SBTS, HBR, DMAR1, DMAR2, RPBA, EBOOTBCD, LBOOTBCD, CLKIN, RESET, TCK.
8Applies to bussed input pins with internal pull-ups: TRST, TMS.
9Applies to three-statable pins: FLAGy0-3, BMSA, TDO.
10 Applies to three-statable pins with internal pull-ups: DTy0, TCLKy0, RCLKy0, DTy1, TCLKy1, RCLKy1.
11 Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2 kΩ during reset in a multiprocessor system, when ID2-0 = 001 and another
ADSP-2106x is not requesting bus mastership.)
12Applies to bussed three-statable pins: DATA47-0, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, REDY, HBG, DMAG1, DMAG2, BMSBCD, EMU. (Note
that ACK is pulled up internally with 2 kΩ during reset in a multiprocessor system, when ID2-0 = 001 and another ADSP-2106x is not requesting bus mastership.
HBG and EMU are not tested for leakage current.)
REV. A
–14–
AD14160/AD14160L
13 Applies to three-statable pins with internal pull-downs: LyxDAT3-0, LyxCLK, LyxACK.
14 Applies to CPAy pin.
15 Applies to ACK pin when keeper latch enabled.
16 Applies to VDD pins. Conditions of operation: each processor executing radix-2 FFT butterfly with instruction in cache, one data operand fetched from each inter-
nal memory block, and one DMA transfer occurring from/to internal memory at tCK = 25 ns.
17 Applies to VDD pins. Idle denotes AD14160/AD14160L state during execution of IDLE instruction.
18 Applies to all signal pins.
19 Guaranteed but not tested.
20 Link and Serial Ports: All are 100% tested at die level prior to assembly. All are 100% ac tested at module level; Link-4 and Serial-0 are also dc tested at the module
level. See Timing Specifications.
Specifications subject to change without notice.
*Stresses greater than those listed above may cause permanent damage to the
device. These are stress ratings only; functional operation of the device at these
or any other conditions greater than those indicated in the operational sections of
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage (5 V) . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Supply Voltage (3.3 V) . . . . . . . . . . . . . . . . –0.3 V to +4.6 V
Input Voltage . . . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V
Output Voltage Swing . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V
Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF
Junction Temperature Under Bias . . . . . . . . . . . . . . . . 130°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Solder Ball Temperature (5 seconds) . . . . . . . . . . . . . +230°C
this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
ESD SENSITIVITY
The AD14160/AD14160L modules are ESD (electrostatic discharge) sensitive devices. Electro-
static charges readily accumulate on the human body and equipment and can discharge without
detection. Permanent damage may occur to devices subjected to high energy electrostatic
discharges.
WARNING!
The ADSP-21060 processors include proprietary ESD protection circuitry to dissipate high
energy discharges. Per method 3015 of MIL-STD-883, the ADSP-21060 processors have been
classified as a Class 2 device.
ESD SENSITIVE DEVICE
Proper ESD precautions are recommended to avoid performance degradation or loss of function-
ality. Unused devices must be stored in conductive foam or shunts, and the foam should be
discharged to the destination socket before devices are removed.
While addition or subtraction would yield meaningful results for
an individual device, the values given in this data sheet reflect
statistical variations and worst cases. Consequently, you cannot
meaningfully add parameters to derive longer times.
TIMING SPECIFICATIONS
GENERAL NOTES
This data sheet represents production released specifications for
the AD14160L (3.3 V), and the AD14160 (5 V). The ADSP-
21060 die components are 100% tested, and the assembled
AD14160/AD14160L units are again extensively tested at-
speed, and across-temperature. Parametric limits were estab-
lished from the ADSP-21060 characterization followed by
further design/analysis of the AD14160/AD14160L package char-
acteristics. The specifications shown are based on a CLKIN
frequency of 40 MHz (tCK = 25 ns). The DT derating allows
specifications at other CLKIN frequencies (within the min-max
range of the tCK specification; see “Clock Input” below). DT is the
difference between the actual CLKIN period and a CLKIN period
of 25 ns:
Switching Characteristics specify how the processor changes its
signals. You have no control over this timing—circuitry external
to the processor must be designed for compatibility with these
signal characteristics. Switching characteristics tell you what the
processor will do in a given circumstance. You can also use
switching characteristics to ensure that any timing requirement
of a device connected to the processor (such as memory) is
satisfied.
Timing Requirements apply to signals that are controlled by cir-
cuitry external to the processor, such as the data input for a read
operation. Timing requirements guarantee that the processor
operates correctly with other devices.
DT = tCK – 25 ns
(O/D) = Open Drain
(A/D) = Active Drain
Use the exact timing information given. Do not attempt to
derive parameters from the addition or subtraction of others.
REV. A
–15–
AD14160/AD14160L
40 MHz–5 V
Max
40 MHz–3.3 V
Parameter
Min
Min
Max
Units
Clock Input
Timing Requirements:
tCK
CLKIN Period
25
7
5
100
3
25
8.75
5
100
3
ns
ns
ns
ns
tCKL
tCKH
tCKRF
CLKIN Width Low
CLKIN Width High
CLKIN Rise/Fall (0.4 V–2.0 V)
tCK
CLKIN
tCKH
tCKL
Figure 9. Clock Input
40 MHz–5 V
40 MHz–3.3 V
Parameter
Reset
Min
Max
Min
Max
Units
Timing Requirements:
tWRST
RESET Pulsewidth Low1
tSRST
RESET Setup Before CLKIN High2
4tCK
4tCK
ns
ns
14.5 + DT/2 tCK
14.5 + DT/2 tCK
NOTES
1Applies after the power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2000 CLKIN cycles while RESET is
low, assuming stable VDD and CLKIN (not including start-up time of external clock oscillator).
2Only required if multiple ADSP-2106xs must come out of reset synchronous to CLKIN with program counters (PC) equal (i.e., for a SIMD system). Not required
for multiple ADSP-2106xs communicating over the shared bus (through the external port), because the bus arbitration logic automatically synchronizes itself after
reset.
CLKIN
tSRST
tWRST
RESET
Figure 10. Reset
40 MHz–5 V
40 MHz–3.3 V
Min Max
Parameter
Min
Max
Units
Interrupts
Timing Requirements:
tSIR
tHIR
tIPW
IRQ2-0 Setup Before CLKIN High1
18 + 3DT/4
2 + tCK
18 + 3DT/4
2 + tCK
ns
ns
ns
IRQ2-0 Hold Before CLKIN High1
IRQ2-0 Pulsewidth2
12 + 3DT/4
12 + 3DT/4
NOTES
1Only required for IRQx recognition in the following cycle.
2Applies only if tSIR and tHIR requirements are not met.
CLKIN
tSIR
tHIR
IRQ
2-0
tIPW
Figure 11. Interrupts
–16–
REV. A
AD14160/AD14160L
40 MHz–5 V
Max
40 MHz–3.3 V
Parameter
Min
Min
Max
Units
Timer
Switching Characteristic:
tDTEX
CLKIN High to TIMEXP
15.5
15.5
ns
CLKIN
tDTEX
tDTEX
TIMEXP
Figure 12. Timer
40 MHz–5 V
40 MHz–3.3 V
Parameter
Flags
Min
Max
Min
Max
Units
Timing Requirements:
tSFI
tHFI
tDWRFI
tHFIWR
FLAG3-0IN Setup Before CLKIN High1
FLAG3-0IN Hold After CLKIN High1
FLAG3-0IN Delay After RD/WR Low1
FLAG3-0IN Hold After RD/WR Deasserted1
8 + 5DT/16
0 – 5DT/16
8 + 5DT/16
0 – 5DT/16
ns
ns
ns
ns
5 + 7DT/16
5 + 7DT/16
0.5
0.5
Switching Characteristics:
tDFO
FLAG3-0OUT Delay After CLKIN High
16.5
14.5
16.5
14.5
ns
ns
ns
ns
tHFO
FLAG3-0OUT Hold After CLKIN High
CLKIN High to FLAG3-0OUT Enable
CLKIN High to FLAG3-0OUT Disable
4
3
4
3
tDFOE
tDFOD
NOTE
1Flag inputs meeting these setup and hold times will affect conditional instructions in the following instruction cycle.
CLKIN
tDFOE
tDFO
tDFO
tDFOD
tHFO
FLAG3–0
OUT
FLAG OUTPUT
CLKIN
tHFI
tSFI
FLAG3–0
IN
tHFIWR
tDWRFI
RD, WR
FLAG INPUT
Figure 13. Flags
REV. A
–17–
AD14160/AD14160L
Memory Read—Bus Master
These switching characteristics also apply for bus master syn-
chronous read/write timing (see Synchronous Read/Write—Bus
Master below). If these timing requirements are met, the syn-
chronous read/write timing can be ignored (and vice versa).
Use these specifications for asynchronous interfacing to memo-
ries (and memory-mapped peripherals) without reference to
CLKIN. These specifications apply when the AD14160/
AD14160L is the bus master accessing external memory space.
40 MHz–5 V
40 MHz–3.3 V
Parameter
Min
Max
Min
Max
Units
Timing Requirements:
tDAD
tDRLD
tHDA
tHDRH
tDAAK
tDSAK
Address, Selects Delay to Data Valid1, 2
17 + DT + W
11 + 5DT/8 + W
17 + DT + W
11 + 5DT/8 + W
ns
ns
ns
ns
ns
ns
RD Low to Data Valid1
Data Hold from Address3
Data Hold from RD High3
ACK Delay from Address2, 4
ACK Delay from RD Low4
1.5
3
1.5
3
13 + 7DT/8 + W
7 + DT/2 + W
13 + 7DT/8 + W
7 + DT/2 + W
Switching Characteristics:
tDRHA
tDARL
tRW
tRWR
tSADADC
Address Hold After RD High
–1 + H
1 + 3DT/8
12.5 + 5DT/8 + W
7.5 + 3DT/8 + HI
–0.5 + DT/4
–1 + H
1 + 3DT/8
12.5 + 5DT/8 + W
7.5 + 3DT/8 + HI
–0.5 + DT/4
ns
ns
ns
ns
ns
Address to RD Low2
RD Pulsewidth
RD High to WR, RD, DMAGx Low
Address Setup Before ADRCLK High2
W = (number of wait states specified in WAIT register) × tCK.
HI = tCK (if an address hold cycle or bus idle cycle occurs, as specified in WAIT register; otherwise HI = 0).
H = tCK (if an address hold cycle occurs as specified in WAIT register; otherwise H = 0).
NOTES
1Data Delay/Setup: User must meet tDAD or tDRLD or synchronous spec tSSDATI
.
2For MSx, SW, BMS, the falling edge is referenced.
3Data Hold: User must meet tHDA or tHDRH or synchronous spec tHDATI. See System Hold Time Calculation under Test Conditions for the calculation of hold times
given capacitive and dc loads.
4ACK Delay/Setup: User must meet tDSAK or tDAAK or synchronous specification tSACKC
.
ADDRESS
MSx, SW
BMS
tDRHA
tDARL
tRW
RD
tHDA
tHDRH
tDRLD
tDAD
DATA
tDSAK
tRWR
tDAAK
ACK
WR, DMAG
tSADADC
ADRCLK
(OUT)
Figure 14. Memory Read—Bus Master
REV. A
–18–
AD14160/AD14160L
Memory Write—Bus Master
These switching characteristics also apply for bus master syn-
chronous read/write timing (see Synchronous Read/Write—Bus
Master). If these timing requirements are met, the synchronous
read/write timing can be ignored (and vice versa).
Use these specifications for asynchronous interfacing to memo-
ries (and memory-mapped peripherals) without reference to
CLKIN. These specifications apply when the AD14160/
AD14160L is the bus master accessing external memory space.
40 MHz–5 V
40 MHz–3.3 V
Parameter
Min
Max
Min
Max
Units
Timing Requirements:
tDAAK
tDSAK
ACK Delay from Address, Selects1, 2
13 + 7DT/8 + W
7 + DT/2 + W
13 + 7DT/8 + W ns
ACK Delay from WR Low1
7 + DT/2 + W
ns
Switching Characteristics:
tDAWH
tDAWL
tWW
tDDWH
tDWHA
tDATRWH
tWWR
tDDWR
tWDE
tSADADC
Address, Selects to WR Deasserted2
16 + 15DT/16 + W
2 + 3DT/8
12 + 9DT/16 + W
6 + DT/2 + W
0 + DT/16 + H
0.5 + DT/16 + H
16 + 15DT/16 + W
2 + 3DT/8
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Address, Selects to WR Low2
WR Pulsewidth
12 + 9DT/16 + W
6 + DT/2 + W
0 + DT/16 + H
0.5 + DT/16 + H
7.5 + 7DT/16 + H
4 + 3DT/8 + I
–1.5 + DT/16
Data Setup Before WR High
Address Hold After WR Deasserted
Data Disable After WR Deasserted3
WR High to WR, RD, DMAGx Low 7.5 + 7DT/16 + H
Data Disable Before WR or RD Low 4 + 3DT/8 + I
7 + DT/16 + H
7 + DT/16 + H
WR Low to Data Enabled
–1.5 + DT/16
Address, Selects to ADRCLK High2 –0.5 + DT/4
–0.5 + DT/4
W = (number of wait states specified in WAIT register) × tCK
.
H = tCK (if an address hold cycle occurs, as specified in WAIT register; otherwise H = 0).
I = tCK (if a bus idle cycle occurs, as specified in WAIT register; otherwise I = 0).
NOTES
1ACK Delay/Setup: User must meet tDAAK or tDSAK or synchronous specification tSACKC
.
2For MSx, SW, BMS, the falling edge is referenced.
3See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads.
ADDRESS
MSx , SW
BMS
tDWHA
tDAWH
tWW
tDAWL
WR
tWWR
tDDWR
tDDWH
tWDE
tDATRWH
DATA
tDSAK
tDAAK
ACK
RD , DMAG
tSADADC
ADRCLK
(OUT)
Figure 15. Memory Write—Bus Master
REV. A
–19–
AD14160/AD14160L
Synchronous Read/Write—Bus Master
When accessing a slave ADSP-2106x, these switching character-
istics must meet the slave’s timing requirements for synchronous
read/writes (see Synchronous Read/Write—Bus Slave). The
slave ADSP-2106x must also meet these (bus master) timing
requirements for data and acknowledge setup and hold times.
Use these specifications for interfacing to external memory
systems that require CLKIN—relative timing or for accessing a
slave ADSP-2106x (in multiprocessor memory space). These
synchronous switching characteristics are also valid during asyn-
chronous memory reads and writes (see Memory Read—Bus
Master and Memory Write—Bus Master).
40 MHz–5 V
40 MHz–3.3 V
Max
Parameter
Min
Max
Min
Units
Timing Requirements:
tSSDATI
tHSDATI
tDAAK
Data Setup Before CLKIN
3.5 + DT/8
3.5 – DT/8
3.5 + DT/8
3.5 – DT/8
ns
ns
Data Hold After CLKIN
ACK Delay After Address,
MSx, SW, BMS1, 2
13 + 7 DT/8 + W
13 + 7 DT/8 + W
ns
ns
ns
tSACKC
tHACKC
ACK Setup Before CLKIN2
ACK Hold After CLKIN
7 + DT/4
–1 – DT/4
7 + DT/4
–1 – DT/4
Switching Characteristics:
tDADRO
Address, MSx, BMS, SW Delay
After CLKIN1
8 – DT/8
8 – DT/8
ns
tHADRO
Address, MSx, BMS, SW Hold
After CLKIN
–1 – DT/8
9 + DT/8
–2 – DT/8
–3 – 3DT/16
8 + DT/4
–1 – DT/8
9 + DT/8
–2 – DT/8
–3 – 3DT/16
8 + DT/4
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tDPGC
tDRDO
tDWRO
tDRWL
tSDDATO
tDATTR
tDADCCK
tADRCK
tADRCKH
tADRCKL
PAGE Delay After CLKIN
RD High Delay After CLKIN
WR High Delay After CLKIN
RD/WR Low Delay After CLKIN
Data Delay After CLKIN
Data Disable After CLKIN3
ADRCLK Delay After CLKIN
ADRCLK Period
16.5 + DT/8
5 – DT/8
5 – 3DT/16
13.5 + DT/4
20 + 5DT/16
8 – DT/8
16.5 + DT/8
5 – DT/8
5 – 3DT/16
13.5 + DT/4
20 + 5DT/16
8 – DT/8
0 – DT/8
4 + DT/8
tCK
(tCK/2 – 2)
(tCK/2 – 2)
0 – DT/8
4 + DT/8
tCK
(tCK/2 – 2)
(tCK/2 – 2)
10.5 + DT/8
10.5 + DT/8
ADRCLK Width High
ADRCLK Width Low
W = (number of Wait states specified in WAIT register) × tCK
.
NOTES
1For MSx, SW, BMS, the falling edge is referenced.
2ACK Delay/Setup: User must meet tDAAK or tDSAK or synchronous specification tSACKC
.
3See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads.
REV. A
–20–
AD14160/AD14160L
CLKIN
tADRCK
tADRCKL
tADRCKH
tDADCCK
ADRCLK
tHADRO
tDAAK
tDADRO
ADDRESS
SW
tDPGC
PAGE
tHACKC
tSACKC
ACK
(IN)
READ CYCLE
tDRWL
tDRDO
RD
tHSDATI
tSSDATI
DATA
(IN)
WRITE CYCLE
tDWRO
tDRWL
WR
tDATTR
tSDDATO
DATA
(OUT)
Figure 16. Synchronous Read/Write—Bus Master
REV. A
–21–
AD14160/AD14160L
Synchronous Read/Write—Bus Slave
The bus master must meet these (bus slave) timing requirements.
Use these specifications for bus master accesses of a slave’s IOP
registers or internal memory (in multiprocessor memory space).
40 MHz–5 V
40 MHz–3.3 V
Max
Parameter
Min
Max
Min
Units
Timing Requirements:
tSADRI
tHADRI
tSRWLI
tHRWLI
tRWHPI
tSDATWH
tHDATWH
Address, SW Setup Before CLKIN
15.5 + DT/2
10 + 5DT/16
–4 – 5DT/16 7.5 + 7DT/16
3
6
1.5
15.5 + DT/2
10 + 5DT/16
–4 – 5DT/16 7.5 + 7DT/16
3
6
1.5
ns
ns
ns
ns
ns
ns
ns
Address, SW Hold Before CLKIN
RD/WR Low Setup Before CLKIN1
RD/WR Low Hold After CLKIN
RD/WR Pulse High
5 + DT/2
5 + DT/2
Data Setup Before WR High
Data Hold After WR High
Switching Characteristics:
tSDDATO
tDATTR
tDACKAD
tACKTR
Data Delay After CLKIN
20 + 5DT/16
8 – DT/8
10
20 + 5DT/16
8 – DT/8
10
ns
ns
ns
ns
Data Disable After CLKIN2
ACK Delay After Address, SW3
ACK Disable After CLKIN3
0 – DT/8
0 – DT/8
–1 – DT/8
7 – DT/8
–1 – DT/8
7 – DT/8
NOTES
1tSRWLI (min) = 10 + 5DT/16 when Multiprocessor Memory Space Wait State (MMSWS bit in WAIT register) is disabled; when MMSWS is enabled,
tSRWLI (min) = 4.5 + DT/8.
2See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads.
3tDACKAD is true only if the address and SW inputs have setup times (before CLKIN) greater than 10.5 + DT/8 and less than 19 + 3DT/4. If the address and SW inputs have
setup times greater than 19 + 3DT/4, then ACK is valid 15 + DT/4 (max) after CLKIN. A slave that sees an address with an M field match will respond with ACK
regardless of the state of MMSWS or strobes. A slave will three-state ACK every cycle with tACKTR
.
CLKIN
tSADRI
tHADRI
ADDRESS
SW
tDACKAD
tACKTR
ACK
READ ACCESS
tSRWLI
tHRWLI
tRWHPI
RD
tSDDATO
tDATTR
DATA
(OUT)
WRITE ACCESS
tRWHPI
tSRWLI
tHRWLI
WR
tHDATWH
tSDATWH
DATA
(IN)
Figure 17. Synchronous Read/Write—Bus Slave
REV. A
–22–
AD14160/AD14160L
Multiprocessor Bus Request and Host Bus Request
Use these specifications for passing of bus mastership between
multiprocessing ADSP-2106x’s (BRx) or a host processor
(HBR, HBG).
40 MHz–5 V
40 MHz–3.3 V
Parameter
Min
Max
Min
Max
Units
Timing Requirements:
tHBGRCSV
tSHBRI
tHHBRI
tSHBGI
tHHBGI
tSBRI
HBG Low to RD/WR/CS Valid1
19.5 + 5DT/4
14 + 3DT/4
6 + DT/2
19.5 + 5DT/4
14 + 3DT/4
6 + DT/2
ns
ns
ns
ns
ns
ns
ns
ns
ns
HBR Setup Before CLKIN2
20 + 3DT/4
13 + DT/2
20 + 3DT/4
13 + DT/2
HBR Hold Before CLKIN2
HBG Setup Before CLKIN
HBG Hold Before CLKIN High
BRx, CPA Setup Before CLKIN3
BRx, CPA Hold Before CLKIN High
RPBA Setup Before CLKIN
RPBA Hold Before CLKIN
13.5 + DT/2
21.5 + 3DT/4
13.5 + DT/2
21.5 + 3DT/4
tHBRI
tSRPBAI
tHRPBAI
6 + DT/2
6 + DT/2
12 + 3DT/4
12 + 3DT/4
Switching Characteristics:
tDHBGO
tHHBGO
tDBRO
HBG Delay After CLKIN
7.5 – DT/8
8 – DT/8
7.5 – DT/8
8 – DT/8
ns
ns
ns
ns
ns
ns
HBG Hold After CLKIN
BRx Delay After CLKIN
BRx Hold After CLKIN
CPA Low Delay After CLKIN
CPA Disable After CLKIN
REDY (O/D) or (A/D) Low from CS
and HBR Low4
–2 – DT/8
–2 – DT/8
–2 – DT/8
–2 – DT/8
–2 – DT/8
–2 – DT/8
tHBRO
tDCPAO
tTRCPA
tDRDYCS
8.5 – DT/8
5 – DT/8
8.5 – DT/8
5 – DT/8
9.5
10.25
ns
ns
ns
tTRDYHG
tARDYTR
REDY (O/D) Disable or REDY (A/D)
High from HBG4
43.5 + 27DT/16
43.5 + 27DT/16
REDY (A/D) Disable from CS or HBR
High4
11
11
NOTES
1For first asynchronous access after HBR and CS asserted, ADDR31–0 must be a non-MMS value 1/2 tCK before RD or WR goes low or by tHBGRCSV after HBG goes
low. This is easily accomplished by driving an upper address signal high when HBG is asserted.
2Only required for recognition in the current cycle.
3CPA assertion must meet the setup to CLKIN; deassertion does not need to meet the setup to CLKIN.
4(O/D) = open drain, (A/D) = active drive.
REV. A
–23–
AD14160/AD14160L
CLKIN
tSHBRI
tHHBRI
HBR
tDHBGO
tHHBGO
HBG
(OUT)
tDBRO
tHBRO
BRx
(OUT)
tDCPAO
tTRCPA
CPA (OUT)
(O/D)
tSHBGI
tHHBGI
HBG (IN)
BRx (IN)
tSBRI
tHBRI
CPA (IN)
(O/D)
HBR
CS
tTRDYHG
tDRDYCS
REDY (O/D)
REDY (A/D)
tARDYTR
tHBGRCSV
HBG (OUT)
RD
WR
CS
tSRPBAI
tHRPBAI
RPBA
O/D = OPEN DRAIN, A/D = ACTIVE DRIVE
NOTE:
HBG WILL BE DELAYED BY n CLOCK CYCLES
WHEN WAIT STATES OR BUS LOCK ARE IN EFFECT.
Figure 18. Multiprocessor Bus Request and Host Bus Request
REV. A
–24–
AD14160/AD14160L
Asynchronous Read/Write—Host to AD14160/AD14160L
Use these specifications for asynchronous host processor accesses
of an AD14160/AD14160L, after the host has asserted CS and
HBR (low). After HBG is returned by the AD14160/AD14160L,
the host can drive the RD and WR pins to access the AD14160/
AD14160L’s internal memory or IOP registers. HBR and HBG
are assumed low for this timing.
40 MHz–5 V
Max
40 MHz–3.3 V
Max
Parameter
Min
Min
Units
Lead Cycle
Timing Requirements:
tSADRDL
tHADRDH
tWRWH
Address Setup/CS Low Before RD Low1
Address Hold/CS Hold Low After RD
RD/WR High Width
1
1
6
0.5
0.5
1
1
6
0.5
0.5
ns
ns
ns
ns
ns
tDRDHRDY RD High Delay After REDY (O/D) Disable
tDRDHRDY RD High Delay After REDY (A/D) Disable
Switching Characteristics:
tSDATRDY
Data Valid Before REDY Disable from Low
1
1
ns
ns
ns
ns
tDRDYRDL REDY (O/D) or (A/D) Low Delay After RD Low
tRDYPRD
tHDARWH
11
11.5
10
REDY (O/D) or (A/D) Low Pulsewidth for Read
Data Disable After RD High
45 + DT
2
45 + DT
2
9.5
Write Cycle
Timing Requirements:
tSCSWRL
tHCSWRH
tSADWRH
tHADWRH
tWWRL
CS Low Setup Before WR Low
0
0.5
6
2.5
7
6
0.5
6
1.5
0
0.5
6
2.5
7
6
0.5
6
1.5
ns
ns
ns
ns
ns
ns
ns
ns
ns
CS Low Hold After WR High
Address Setup Before WR High
Address Hold After WR High
WR Low Width
tWRWH
RD/WR High Width
tDWRHRDY WR High Delay After REDY (O/D) or (A/D) Disable
tSDATWH
tHDATWH
Data Setup Before WR High
Data Hold After WR High
Switching Characteristics:
tDRDYWRL REDY (O/D) or (A/D) Low Delay After WR/CS Low
11
11.5
ns
ns
ns
tRDYPWR
tSRDYCK
REDY (O/D) or (A/D) Low Pulsewidth for Write
REDY (O/D) or (A/D) Disable to CLKIN
15
15
0.5 + 7DT/16 8 + 7DT/16
0.5 + 7DT/16
8 + 7DT/16
NOTE
1Not required if RD and address are valid tHBGRCSV after HBG goes low. For first access after HBR asserted, ADDR31–0 must be a non-MMS value 1/2 tCLK before RD
or WR goes low or by tHBGRCSV after HBG goes low. This is easily accomplished by driving an upper address signal high when HBG is asserted. For address bits to be
driven during asynchronous host accesses, see Table 8.2 of the ADSP-2106x SHARC User’s Manual.
CLKIN
tSRDYCK
REDY (O/D)
REDY (A/D)
O/D = OPEN DRAIN, A/D = ACTIVE DRIVE
Figure 19a. Synchronous REDY Timing
REV. A
–25–
AD14160/AD14160L
READ CYCLE
ADDRESS/CS
tHADRDH
tSADRDL
tWRWH
RD
tHDARWH
DATA (OUT)
tDRDHRDY
tSDATRDY
tRDYPRD
tDRDYRDL
REDY (O/D)
REDY (A/D)
WRITE CYCLE
ADDRESS
tHADWRH
tSADWRH
tHCSWRH
tSCSWRL
CS
tWWRL
tWRWH
WR
tHDATWH
tSDATWH
DATA (IN)
tDWRHRDY
tDRDYWRL
tRDYPWR
REDY (O/D)
REDY (A/D)
O/D = OPEN DRAIN, A/D = ACTIVE DRIVE
Figure 19b. Asynchronous Read/Write—Host to ADSP-2106x
REV. A
–26–
AD14160/AD14160L
Three-State Timing—Bus Master, Bus Slave, HBR, SBTS
These specifications show how the memory interface is disabled
(stops driving) or enabled (resumes driving) relative to CLKIN
and the SBTS pin. This timing is applicable to bus master tran-
sition cycles (BTC) and host transition cycles (HTC) as well as
the SBTS pin.
40 MHz–5 V
Max
40 MHz–3.3 V
Parameter
Min
Min
Max
Units
Timing Requirements:
tSTSCK
tHTSCK
SBTS Setup Before CLKIN
SBTS Hold Before CLKIN
12 + DT/2
12 + DT/2
ns
ns
6 + DT/2
6 + DT/2
Switching Characteristics:
tMIENA
tMIENS
tMIENHG
tMITRA
Address/Select Enable After CLKIN
–1.5 – DT/8
–1.5 – DT/8
–1.5 – DT/8
–1.25 – DT/8
–1.5 – DT/8
–1.5 – DT/8
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Strobes Enable After CLKIN1
HBG Enable After CLKIN
Address/Select Disable After CLKIN
Strobes Disable After CLKIN1
HBG Disable After CLKIN
Data Enable After CLKIN2
Data Disable After CLKIN2
ACK Enable After CLKIN2
ACK Disable After CLKIN2
ADRCLK Enable After CLKIN
ADRCLK Disable After CLKIN
1 – DT/4
2.5 – DT/4
2.5 – DT/4
1 – DT/4
2.5 – DT/4
2.5 – DT/4
tMITRS
tMITRHG
tDATEN
tDATTR
tACKEN
tACKTR
tADCEN
tADCTR
tMTRHBG
tMENHBG
9 + 5DT/16
0 – DT/8
7.5 + DT/4
–1 – DT/8
–2 – DT/8
9 + 5DT/16
0 – DT/8
7.5 + DT/4
–1 – DT/8
–2 – DT/8
8 – DT/8
7 – DT/8
8.5 – DT/4
8 – DT/8
7 – DT/8
8.5 – DT/4
Memory Interface Disable Before HBG Low3 –0.5 + DT/8
Memory Interface Enable After HBG High3
18.5 + DT
–0.5 + DT/8
18.5 + DT
NOTES
1Strobes = RD, WR, SW, PAGE, DMAG.
2In addition to bus master transition cycles, these specs also apply to bus master and bus slave synchronous read/write.
3Memory Interface = Address, RD, WR, MSx, SW, HBG, PAGE, DMAGx, BMS (in EPROM boot mode).
CLKIN
tSTSCK
tHTSCK
SBTS
tMITRA, tMITRS, tMITRHG
tMIENA, tMIENS, tMIENHG
MEMORY
INTERFACE
tDATTR
tDATEN
DATA
tACKTR
tACKEN
ACK
ADRCLK
HBG
tADCEN
tADCTR
tMTRHBG
tMENHBG
MEMORY
INTERFACE
MEMORY INTERFACE = ADDRESS, RD, WR, MSx, SW, HBG, PAGE, DMAGx. BMS (IN EPROM BOOT MODE)
Figure 20. Three-State Timing
REV. A
–27–
AD14160/AD14160L
DMA Handshake
transfer is controlled by ADDR31-0, RD, WR, MS3-0, and ACK
(not DMAG). For Paced Master mode, the “Memory Read–Bus
Master”, “Memory Write–Bus Master”, and “Synchronous
These specifications describe the three DMA handshake modes.
In all three modes DMAR is used to initiate transfers. For hand-
shake mode, DMAG controls the latching or enabling of data
externally. For external handshake mode, the data transfer is
Read/Write–Bus Master” timing specifications for ADDR31-0
,
RD, WR, MS3-0, SW, PAGE, DATA47-0, and ACK also apply.
controlled by the ADDR31-0, RD, WR, SW, PAGE, MS3-0
,
ACK, and DMAG signals. For Paced Master mode, the data
40 MHz–5 V
40 MHz–3.3 V
Parameter
Min
Max
Min
Max
Units
Timing Requirements:
tSDRLC
tSDRHC
tWDR
DMARx Low Setup Before CLKIN1
5.5
5.5
6
5.5
5.5
6
ns
ns
ns
ns
ns
ns
ns
ns
DMARx High Setup Before CLKIN1
DMARx Width Low (Nonsynchronous)
tSDATDGL Data Setup After DMAGx Low2
9 + 5DT/8
9 + 5DT/8
tHDATIDG
tDATDRH
tDMARLL
tDMARH
Data Hold After DMAGx High
Data Valid After DMAGx High2
DMAGx Low Edge to Low Edge
DMAGx Width High
2.5
2.5
15 + 7DT/8
15 + 7DT/8
23 + 7DT/8
6
23 + 7DT/8
6
Switching Characteristics:
tDDGL
tWDGH
tWDGL
tHDGC
DMAGx Low Delay After CLKIN
DMAGx High Width
DMAGx Low Width
9 + DT/4
6 + 3DT/8
12 + 5DT/8
–2 – DT/8
7 + 9DT/16
–0.5
16 + DT/4
7 – DT/8
9 + DT/4
6 + 3DT/8
12 + 5DT/8
–2 – DT/8
7 + 9DT/16
–0.5
16 + DT/4
7 – DT/8
ns
ns
ns
ns
ns
ns
ns
ns
DMAGx High Delay After CLKIN
tVDATDGH Data Valid Before DMAGx High3
tDATRDGH Data Disable After DMAGx High4
8
2.5
8
2.5
tDGWRF
tDGWRH
tDGWRR
tDGRDF
tDRDGH
tDGRDR
tDGWR
WR Low Before DMAGx Low
–0.5
–0.5
DMAGx Low Before WR High
WR High Before DMAGx High
RD Low Before DMAGx Low
9.5 + 5DT/8 + W
0.5 + DT/16
–0.5
10.5 + 9DT/16 + W
–0.5
5 + 3DT/8 + HI
16 + DT
–1.5
9.5 + 5DT/8 + W
0.5 + DT/16
–0.5
10.5 + 9DT/16 + W
–0.5
5 + 3DT/8 + HI
16 + DT
–1.5
3.5 + DT/16
2.5
3.5 + DT/16 ns
2.5
ns
ns
ns
ns
ns
ns
RD Low Before DMAGx High
RD High Before DMAGx High
DMAGx High to WR, RD, DMAGx Low
Address/Select Valid to DMAGx High
Address/Select Hold After DMAGx High
3.5
3.5
tDADGH
tDDGHA
W = (number of wait states specified in WAIT register) × tCK
.
HI = tCK (if an address hold cycle or bus idle cycle occurs, as specified in WAIT register; otherwise HI = 0).
NOTES
1Only required for recognition in the current cycle.
2tSDATDGL is the data setup requirement if DMARx is not being used to hold off completion of a write. Otherwise, if DMARx low holds off completion of the write, the
data can be driven tDATDRH after DMARx is brought high.
3tVDATDGH is valid if DMARx is not being used to hold off completion of a read. If DMARx is used to prolong the read, then tVDATDGH = 7 + 9DT/16 + (n × tCK) where
n equals the number of extra cycles that the access is prolonged.
4See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads.
REV. A
–28–
AD14160/AD14160L
CLKIN
tSDRLC
tDMARLL
tSDRHC
tWDR
tDMARH
DMARx
DMAGx
tHDGC
tDDGL
tWDGL
tWDGH
TRANSFERS BETWEEN ADSP-2106x INTERNAL MEMORY AND EXTERNAL DEVICE
tDATRDGH
tVDATDGH
DATA (FROM
ADSP-2106x TO
EXTERNAL DRIVE)
tDATDRH
tHDATIDG
tSDATDGL
DATA (FROM
EXTERNAL DRIVE
TO ADSP-2106x)
TRANSFERS BETWEEN EXTERNAL DEVICE AND EXTERNAL MEMORY* (EXTERNAL HANDSHAKE MODE)
tDGWRL
WR
tDGWRH
tDGWRR
(EXTERNAL DEVICE
TO EXTERNAL
MEMORY)
tDGRDR
tDGRDL
RD
(EXTERNAL
MEMORY TO
EXTERNAL DEVICE)
tDRDGH
tDADGH
tDDGHA
ADDRESS
MS , SW
X
*
“MEMORY READ – BUS MASTER,” “MEMORY WRITE – BUS MASTER,” AND “SYNCHRONOUS READ/WRITE – BUS MASTER”
TIMING SPECIFICATIONS FOR ADDR
, RD, WR, SW, MS AND ACK ALSO APPLY HERE.
31–0
3-0
Figure 21. DMA Handshake Timing
REV. A
–29–
AD14160/AD14160L
Link Ports: 1 × CLK Speed Operation
Parameter
40 MHz–5 V
Max
40 MHz–3.3 V
Min
Min
Max
Units
Receive
Timing Requirements:
tSLDCL
tHLDCL
tLCLKIW
tLCLKRWL
tLCLKRWH
Data Setup Before LCLK Low
Data Hold After LCLK Low
LCLK Period (1 × Operation)
LCLK Width Low
3.5
3
tCK
6
3
3
tCK
6
5
ns
ns
ns
ns
ns
LCLK Width High
5
Switching Characteristics:
tDLAHC
tDLALC
tENDLK
tTDLK
LACK High Delay After CLKIN High
18 + DT/2
–3
5 + DT/2
29 + DT/2
13.5
18 + DT/2
–3
5 + DT/2
29 + DT/2
13.5
ns
ns
ns
ns
LACK Low Delay After LCLK High1
LACK Enable from CLKIN
LACK Disable from CLKIN
20.5 + DT/2
20.5 + DT/2
Transmit
Timing Requirements:
tSLACH LACK Setup Before LCLK High
tHLACH LACK Hold After LCLK High
18
–7
20
–7
ns
ns
Switching Characteristics:
tDLCLK
LCLK Delay After CLKIN (1 × Operation)
16
3.5
17
3
ns
ns
ns
ns
ns
tDLDCH
tHLDCH
tLCLKTWL
tLCLKTWH
tDLACLK
tENDLK
tTDLK
Data Delay After LCLK High
Data Hold After LCLK High
LCLK Width Low
–3
–3
(tCK/2) – 2
(tCK/2) – 2
(tCK/2) + 2
(tCK/2) + 2
(tCK/2) + 8.5 (3 × tCK/2) + 17.5
5 + DT/2
(tCK/2) – 1
(tCK/2) – 1.25
(tCK/2) + 8
5 + DT/2
(tCK/2) + 1.25
(tCK/2) + 1
(3 × tCK/2) + 18 ns
LCLK Width High
LCLK Low Delay After LACK High
LDAT, LCLK Enable After CLKIN
LDAT, LCLK Disable After CLKIN
ns
ns
20.5 + DT/2
20.5 + DT/2
Link Port Service Request Interrupts: 1 × and
2 × Speed Operations
Timing Requirements:
tSLCK
tHLCK
LACK/LCLK Setup Before CLKIN Low2
LACK/LCLK Hold After CLKIN Low2
10
2
10
2
ns
ns
NOTES
1LACK will go low with tDLALC relative to rising edge of LCLK after first nibble is received. LACK will not go low if the receiver’s link buffer is not about to fill.
2Only required for interrupt recognition in the current cycle.
REV. A
–30–
AD14160/AD14160L
Link Ports: 2 × CLK Speed Operation
40 MHz–5 V
40 MHz–3.3 V
Parameter
Min
Max
Min
Max
Units
Receive
Timing Requirements:
tSLDCL
tHLDCL
tLCLKIW
tLCLKRWL
tLCLKRWH
Data Setup Before LCLK Low
Data Hold After LCLK Low
LCLK Period (2 × Operation)
LCLK Width Low
2.5
2.25
2.25
tCK/2
5
ns
ns
ns
ns
ns
2.25
tCK/2
4.5
LCLK Width High
4.25
4
Switching Characteristics:
tDLAHC LACK High Delay After CLKIN High
tDLALC
LACK Low Delay After LCLK High1
18 + DT/2
6
29 + DT/2
16.5
18 + DT/2
6
30 + DT/2
18.5
ns
ns
Transmit
Timing Requirements:
tSLACH LACK Setup Before LCLK High
tHLACH LACK Hold After LCLK High
19
–6.75
19
–6.5
ns
ns
Switching Characteristics:
tDLCLK
tDLDCH
tHLDCH
tLCLKTWL
tLCLKTWH
tDLACLK
LCLK Delay After CLKIN
8.5
3
8.5
2.75
ns
ns
ns
ns
ns
ns
Data Delay After LCLK High
Data Hold After LCLK High
LCLK Width Low
LCLK Width High
LCLK Low Delay After LACK High
–2
–2
(tCK/4) – 1
(tCK/4) – 1
(tCK/4) + 9
(tCK/4) + 1
(tCK/4) + 1
(3 × tCL/4) + 17
(tCK/4) – 0.75
(tCK/4) – 1.5
(tCK/4) + 9
(tCK/4) + 1.5
(tCK/4) + 1
(3 × tCL/4) + 17
NOTE
1LACK will go low with tDLALC relative to rising edge of LCLK after first nibble is received. LACK will not go low if the receiver’s link buffer is not about to fill.
REV. A
–31–
AD14160/AD14160L
TRANSMIT
CLKIN
tDLCLK
tLCLKTWL
tLCLKTWH
LAST NIBBLE
TRANSMITTED
FIRST NIBBLE
TRANSMITTED
LCLK INACTIVE
(HIGH)
LCLK 1x
OR
LCLK 2x
tDLDCH
tHLDCH
LDAT(3:0)
LACK (IN)
OUT
tDLACLK
tSLACH
tHLACH
THE tSLACH REQUIREMENT APPLIES TO THE RISING EDGE OF LCLK ONLY FOR THE FIRST NIBBLE TRANSMITTED.
RECEIVE
CLKIN
tLCLKIW
tLCLKRWH
tLCLKRWL
LCLK 1x
OR
LCLK 2x
tHLDCL
tSLDCL
LDAT(3:0)
IN
tDLALC
tDLAHC
LACK (OUT)
LACK GOES LOW ONLY AFFTER THE SECOND NIBBLE IS RECEIVED.
LINK PORT ENABLE/THREE-STATE DELAY FROM INSTRUCTION
CLKIN
tENDLK
tTDLK
LCLK
LDAT(3:0)
LACK
LINK PORT ENABLE OR THREE-STATE TAKES EFFECT 2 CYCLES AFTER A WRITE TO A LINK PORT CONTROL REGISTER.
LINK PORT INTERRUPT SETUP TIME
CLKIN
tHLCK
tSLCK
LCLK
LACK
Figure 22. Link Ports
REV. A
–32–
AD14160/AD14160L
Serial Ports
Parameter
40 MHz–5 V
Max
40 MHz–3.3 V
Min
Min
Max
Units
External Clock
Timing Requirements:
tSFSE
TFS/RFS Setup Before TCLK/RCLK1
3.5
4
1.5
4
9.5
tCK
3.5
4
1.5
4
9
tCK
ns
ns
ns
ns
ns
ns
tHFSE
tSDRE
tHDRE
tSCLKW
tSCLK
TFS/RFS Hold After TCLK/RCLK1, 2
Receive Data Setup Before RCLK1
Receive Data Hold After RCLK1
TCLK/RCLK Width
TCLK/RCLK Period
Internal Clock
Timing Requirements:
tSFSI
TFS Setup Before TCLK1; RFS Setup Before RCLK1
8
1
3
3
8
1
3
3
ns
ns
ns
ns
tHFSI
tSDRI
tHDRI
TFS/RFS Hold After TCLK/RCLK1, 2
Receive Data Setup Before RCLK1
Receive Data Hold After RCLK1
External or Internal Clock
Switching Characteristics:
tDFSE
tHFSE
RFS Delay After RCLK (Internally Generated RFS)3
13.5
13.5
ns
ns
RFS Hold After RCLK (Internally Generated RFS)3
3
3
External Clock
Switching Characteristics:
tDFSE
tHFSE
tDDTE
tHDTE
TFS Delay After TCLK (Internally Generated TFS)3
13.5
16.5
13.5
16.5
ns
ns
ns
ns
TFS Hold After TCLK (Internally Generated TFS)3
Transmit Data Delay After TCLK3
3
5
3
5
Transmit Data Hold After TCLK3
Internal Clock
Switching Characteristics:
tDFSI
tHFSI
tDDTI
tHDTI
tSCLKIW
TFS Delay After TCLK (Internally Generated TFS)3
4.5
7.5
4.5
7.5
ns
ns
ns
ns
ns
TFS Hold After TCLK (Internally Generated TFS)3 –1.5
Transmit Data Delay After TCLK3
–1.5
0
Transmit Data Hold After TCLK3
TCLK/RCLK Width
0
(SCLK/2) – 2 (SCLK/2) + 2 (SCLK/2) – 2.5 (SCLK/2) + 2.5
Enable and Three-State
Switching Characteristics:
tDDTEN
tDDTTE
tDDTIN
tDDTTI
tDCLK
Data Enable from External TCLK3
3.5
0
4
0
ns
ns
ns
ns
ns
ns
Data Disable from External TCLK3
Data Enable from Internal TCLK3
Data Disable from Internal TCLK3
TCLK/RCLK Delay from CLKIN
SPORT Disable After CLKIN
11
11
3
3
22.5 + 3DT/8
17.5
22.5 + 3DT/8
17.5
tDPTR
External Late Frame Sync
Switching Characteristics:
tDDTLFSE Data Delay from Late External TFS or
External RFS with MCE = 1, MFD = 04
tDDTENFS Data Enable from Late FS or MCE = 1, MFD = 04
12.5
13.3
ns
ns
3
3.5
To determine whether communication is possible between two devices at clock speed n, the following specifications must be confirmed: 1) frame sync delay and frame
sync setup and hold, 2) data delay and data setup and hold, and 3) SCLK width.
NOTES
1Referenced to sample edge.
2RFS hold after RCK when MCE = 1, MFD = 0 is 0 ns minimum from drive edge. TFS hold after TCK for late external TFS is 0 ns minimum from drive edge.
3Referenced to drive edge.
4MCE = 1, TFS enable and TFS valid follow tDDTLFSE and tDDTENFS
.
REV. A
–33–
AD14160/AD14160L
EXTERNAL RFS with MCE = 1, MFD = 0
DRIVE
DRIVE
SAMPLE
RCLK
RFS
tHFSE/I
(SEE NOTE 2)
tSFSE/I
tDDTE/I
tDDTENFS
tHDTE/I
DT
1ST BIT
2ND BIT
tDDTLFSE
LATE EXTERNAL TFS
DRIVE
DRIVE
SAMPLE
TCLK
TFS
tHFSE/I
(SEE NOTE 2)
tSFSE/I
tDDTE/I
tDDTENFS
tHDTE/I
DT
1ST BIT
2ND BIT
tDDTLFSE
Figure 23. External Late Frame Sync
REV. A
–34–
AD14160/AD14160L
DATA RECEIVE– INTERNAL CLOCK
DATA RECEIVE– EXTERNAL CLOCK
SAMPLE
EDGE
DRIVE
EDGE
DRIVE
EDGE
SAMPLE
EDGE
tSCLKIW
tSCLKW
RCLK
RCLK
tDFSE
tHFSE
tDFSE
tHFSE
tHFSE
tSFSI
tHFSI
tSFSE
RFS
DR
RFS
DR
tSDRE
tHDRE
tSDRI
tHDRI
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK, TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT– INTERNAL CLOCK
DATA TRANSMIT– EXTERNAL CLOCK
SAMPLE
EDGE
DRIVE
EDGE
DRIVE
EDGE
SAMPLE
EDGE
tSCLKIW
tSCLKW
TCLK
TCLK
tDFSI
tDFSE
tHFSE
tHFSI
tSFSI
tHFSI
tHFSE
tSFSE
TFS
TFS
tDDTI
tDDTE
tHDTI
tHDTE
DT
DT
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK, TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DRIVE
EDGE
DRIVE
EDGE
TCLK / RCLK
TCLK (EXT)
DT
tDDTEN
tDDTTE
DRIVE
EDGE
DRIVE
EDGE
TCLK / RCLK
TCLK (INT)
tDDTIN
tDDTTI
DT
CLKIN
CLKIN
tHTFSCK
tDPTR
tSTFSCK
SPORT ENABLE AND
THREE-STATE
LATENCY
TCLK, RCLK
SPORT DISABLE DELAY
FROM INSTRUCTION
TFS (EXT)
TFS, RFS, DT
IS TWO CYCLES
tDCLK
NOTE: APPLIES ONLY TO GATED SERIAL CLOCK MODE WITH
EXTERNAL TFS, AS USED IN THE SERIAL PORT SYSTEM I/O FOR
MESH MULTIPROCESSING.
TCLK (INT)
RCLK (INT)
LOW TO HIGH ONLY
Figure 24. Serial Ports
REV. A
–35–
AD14160/AD14160L
JTAG Test Access Port and Emulation
40 MHz–5 V
Max
40 MHz–3.3 V
Parameter
Min
Min
Max
Units
Timing Requirements:
tTCK
TCK Period
tCK
5.5
6.5
8
18.5
4tCK
tCK
5.5
6.5
8
19
4tCK
ns
ns
ns
ns
ns
ns
tSTAP
tHTAP
tSSYS
tHSYS
tTRSTW
TDI, TMS Setup Before TCK High
TDI, TMS Hold After TCK High
System Inputs Setup Before TCK Low1
System Inputs Hold After TCK Low1
TRST Pulsewidth
Switching Characteristics:
tDTDO TDO Delay from TCK Low
tDSYS
System Outputs Delay After TCK Low 2
13.5
20
13.5
20
ns
ns
NOTES
1System Inputs = DATA47-0, ADDR31-0, RD, WR, ACK, SBTS, SW, HBR, HBG, CS, DMAR1, DMAR2, BR6-1, RPBA, IDy2-0, IRQ2-0, FLAGy3-0, DRy0, DyR1,
TCLKy0, TCLKy1, RCLKy0, RCLKy1, TFSy0, TFSy1, RFSy0, RFSy1, LxDAT3-0, LxCLK, LxACK, EBOOT, LBOOT, BMS, CLKIN, RESET.
2System Outputs = DATA47-0, ADDR31-0, MS3-0, RD, WR, ACK, PAGE, ADRCLK, SW, HBG, REDY, DMAG1, DMAG2, BR6-1, CPA, FLAG2-0, TIMEXP, DT0,
DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, BMS.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 25. IEEE 11499.1 JTAG Test Access Port
REV. A
–36–
AD14160/AD14160L
POWER DISSIPATION
OUTPUT DRIVE CURRENTS
Total power dissipation has two components, one due to inter-
nal circuitry and one due to the switching of external output
drivers. Internal power dissipation is dependent on the instruc-
tion execution sequence and the data operands involved. Inter-
nal power dissipation is calculated in the following way:
Figure 26 shows typical I-V characteristics for the output drivers
of the ADSP-2106x. The curves represent the current drive
capability of the output drivers as a function of output voltage.
100
75
P
INT = IDDIN × VDD
50
The external component of total power dissipation is caused by
the switching of output pins. Its magnitude depends on:
25
5.25V, –40؇C
0
5.0V, +25°C
4.75V, +85
°
C
– the number of output pins that switch during each cycle (O)
– the maximum frequency at which they can switch (f)
– their load capacitance (C)
–25
–50
4.75V, +85
°C
–75
– their voltage swing (VDD
)
5.0V, +25
°
C
–100
–125
5.25V, –40°C
and is calculated by:
PEXT = O × C × VDD2 × f
–150
–175
–200
The load capacitance should include the processor’s package
capacitance (CIN). The switching frequency includes driving the
load high and then back low. Address and data pins can drive
high and low at a maximum rate of 1/(2tCK). The write strobe
can switch every cycle at a frequency of 1/tCK. Select pins switch
at 1/(2tCK), but selects can switch on each cycle.
0
0.75
1.50
2.25
3.00
3.75
4.50
5.25
SOURCE VOLTAGE – V
Figure 26. ADSP-2106x Typical Drive Currents (VDD = 5 V)
120
100
Example:
3.3V, +25°C
80
60
40
Estimate PEXT with the following assumptions:
3.6V, –40°C
–A system with one bank of external data memory RAM
(32-bit).
–Four 128K × 8 RAM chips are used, each with a load of 10 pF.
–External data memory writes occur every other cycle, a rate
–of 1/(4tCK), with 50% of the pins switching.
–The instruction cycle rate is 40 MHz (tCK = 25 ns) and
–VDD = 3.3 V.
3.0V, +85؇C
V
20
0
OH
–20
–40
–60
3.0V, +85°C
3.3V, +25°C
3.6V, –40°C
–80
–100
–120
The PEXT equation is calculated for each class of pins that can
drive:
V
OL
0
0.5
1
1.5
2
2.5
3
3.5
SOURCE VOLTAGE – V
Pin
# of
%
2
Type
Pins
Switching
؋
C ؋
؋
VDD = PEXT Figure 27. ADSP-2106x Typical Drive Currents (VDD = 3.3 V)
Address
MS0
WR
Data
ADRCLK
15
1
1
32
1
50
0
–
50
–
× 55 pF × 20 MHz × 10.9 V = 0.089 W
× 55 pF × 20 MHz × 10.9 V = 0.00 W
× 55 pF × 40 MHz × 10.9 V = 0.024 W
× 25 pF × 20 MHz × 10.9 V = 0.087 W
× 15 pF × 40 MHz × 10.9 V = 0.007 W
PEXT (3.3 V)= 0.207 W
PEXT (5 V)= 0.476 W
A typical power consumption can now be calculated for these
conditions by adding a typical internal power dissipation:
P
TOTAL = PEXT + (IDDIN2 × 5.0 V )
Note that the conditions causing a worst-case PEXT are different
from those causing a worst-case PINT. Maximum PINT cannot
occur while 100% of the output pins are switching from all ones
to all zeros. Also note that it is not common for an application to
have 100% or even 50% of the outputs switching simultaneously.
REV. A
–37–
AD14160/AD14160L
TEST CONDITIONS
Output Disable Time
REFERENCE
SIGNAL
Output pins are considered to be disabled when they stop driv-
ing, go into a high impedance state, and start to decay from
their output high or low voltage. The time for the voltage on the
bus to decay by ∆V is dependent on the capacitive load, CL, and
the load current, IL. This decay time can be approximated by
the following equation:
tMEASURED
tENA
tDIS
V
V
OH (MEASURED)
V
V
OH (MEASURED)
V
– ⌬V
+ ⌬V
2.0V
1.0V
OH (MEASURED)
V
OL (MEASURED)
OL (MEASURED)
OL (MEASURED)
tDECAY
CL ∆V
tDECAY
=
IL
OUTPUT STARTS
DRIVING
OUTPUT STOPS
DRIVING
The output disable time, tDIS, is the difference between tMEASURED
and tDECAY as shown in Figure 28. The time tMEASURED is the
interval from when the reference signal switches to when the
output voltage decays ∆V from the measured output high or
output low voltage. tDECAY is calculated with test loads CL and
IL, and with ∆V equal to 0.5 V.
HIGH-IMPEDANCE STATE.
TEST CONDITIONS CAUSE
THIS VOLTAGE TO BE
APPROXIMATELY 1.5V
Figure 28. Output Enable/Disable
I
OL
Output Enable Time
Output pins are considered to be enabled when they have made
a transition from a high impedance state to when they start
driving. The output enable time, tENA, is the interval from when
a reference signal reaches a high or low voltage level to when the
output has reached a specified high or low trip point, as shown
in the Output Enable/Disable diagram (Figure 28). If multiple
pins (such as the data bus) are enabled, the measurement value
is that of the first pin to start driving.
TO
OUTPUT
PIN
+1.5V
50pF
Example System Hold Time Calculation
I
OH
To determine the data output hold time in a particular system,
first calculate tDECAY using the equation given above. Choose
∆V to be the difference between the ADSP-2106x’s output
voltage and the input threshold for the device requiring the hold
time. A typical ∆V will be 0.4 V. CL is the total bus capacitance
(per data line), and IL is the total leakage or three-state current
(per data line). The hold time will be tDECAY plus the minimum
disable time (i.e., tHDWD for the write cycle).
Figure 29. Equivalent Device Loading for AC Measure-
ments (Includes All Fixtures)
INPUT OR
OUTPUT
1.5V
1.5V
Figure 30. Voltage Reference Levels for AC Measurements
(Except Output Enable/Disable)
Capacitive Loading
Output delays and holds are based on standard capacitive loads:
50 pF on all pins (see Figure 29). The delay and hold specifica-
tions given should be derated by a factor of 1.5 ns/50 pF for
loads other than the nominal value of 50 pF. Figures 31, 32, 33
and 34 show how output rise time varies with capacitance.
Figures 35 and 36 graphically show how output delays and
holds vary with load capacitance. (Note that these graphs or
derating does not apply to output disable delays; see the previ-
ous section Output Disable Time under Test Conditions.) The
graphs of Figures 31 through 36 may not be linear outside the
ranges shown.
REV. A
–38–
AD14160/AD14160L
9
8
16.0
14.0
12.0
10.0
8.0
7
6
Y = 0.0391X + 0.36
RISE TIME
5
4
Y = 0.005X + 3.7
RISE TIME
FALL TIME
Y = 0.0305X + 0.24
6.0
3
2
1
0
FALL TIME
4.0
2.0
0
Y = 0.0031X + 1.1
0
20
40
60
80 100 120 140 160 180 200
0
20
40
60
80
100 120 140 160 180 200
LOAD CAPACITANCE – pF
LOAD CAPACITANCE – pF
Figure 31. Typical Output Rise Time (10%–90%)
vs. Load Capacitance (VDD = 5 V)
Figure 34. Typical Output Rise Time (0.8 V –2.0 V)
vs. Load Capacitance (VDD = 3.3 V)
18
16
5
4
14
Y = 0.0796X + 1.17
12
3
Y = 0.03X –1.45
10
2
1
RISE TIME
8
6
Y = 0.0467X + 0.55
4
2
0
FALL TIME
NOMINAL
–1
0
20
40
60
80 100 120 140 160 180 200
25
50
75
100
125
150
175
200
LOAD CAPACITANCE – pF
LOAD CAPACITANCE – pF
Figure 35. Typical Output Delay or Hold vs. Load Capaci-
tance (at Maximum Case Temperature) (VDD = 5 V)
Figure 32. Typical Output Rise Time (10%–90%)
vs. Load Capacitance (VDD = 3.3 V)
5
3.5
3.0
2.5
4
3
2
1
Y = 0.0329X –1.65
RISE TIME
2.0
Y = 0.009X + 1.1
1.5
FALL TIME
1.0
Y = 0.005X + 0.6
NOMINAL
–1
0.5
0
25
50
75
100
125
150
175
200
0
20
40
60
80
100 120 140 160 180 200
LOAD CAPACITANCE – pF
LOAD CAPACITANCE – pF
Figure 33. Typical Output Rise Time (0.8 V–2.0 V)
vs. Load Capacitance (VDD = 5 V)
Figure 36. Typical Output Delay or Hold vs. Load Capaci-
tance (at Maximum Case Temperature) (VDD = 3.3 V)
REV. A
–39–
AD14160/AD14160L
ASSEMBLY RECOMMENDATIONS
Signal Pad Assignment Topology
Socket Information
The AD14160/AD14160L signal pad assignments were care-
fully analyzed for improved board routing and maximum reliabil-
ity. By restricting the required 432 I/O to the inner 25 mm circle,
TCE mismatch concerns are minimized. (BGA ball patterns of
25 mm size are well characterized and documented.) The signal
I/O is carefully placed and grouped to minimize pin escape
difficulties in routing. Redundant power/ground contact pads are
also provided (but not required) to improve the thermal perfor-
mance and the ground bounce performance of the package (see
Figure 42).
Standard sockets are available from 3M and Plastronics. The
3M socket used is the BGA III style. The customer must specify
how they want the socket populated with pins and a slight modifi-
cation is required to compensate for the tolerance of the package
thickness.
PCB Board Layout
A classical dog bone style pad should be used. A solder pad
diameter of 0.65 mm is recommended. The pad should be non-
soldermask defined.
DENSITY IMPROVEMENTS
NON-SOLDERMASK
DEFINED PAD
In addition to careful considerations to performance characteris-
tics such as ground bounce, signal quality, and noise isolation,
the AD14160/AD14160L also provides significant density ad-
vantages.
Board Area Reduction
SOLDERMASK
The minimally packaged AD14160/AD14160L CBGA reduces
required board area by approximately 75%.
DISCRETE
SHARC
DISCRETE
SHARC
Figure 37.
Solder Paste Printing
A solder paste print of 0.7 mm diameter with thickness of 0.15
to 0.2 mm is recommended. Normal solder paste alloy can be
used, i.e., 60/40, 63/37, etc.
Reflow Profile
The profile shown below is recommended.
QUAD SHARC
BGA MCM
MEASUREMENT POINT
DISCRETE
SHARC
BGA
PCB
PIN ONE
PEAK 220 ؎10؇C
220
200
200
–40 ؎10؇C/MIN
170؇C
160
50 ؎10؇C/MIN
200؇C
1.850 IN SQ
160
150
Figure 39.
Embedded Wiring
120 ؎30 SEC
150
ف
160؇C 60 ؎10 SEC
OVER 200؇C
Forty feet of optimized routing is embedded in four integrated
signal routing layers (in addition to power and ground planes).
This eliminated hundreds of feet of multiprocessing intercon-
nect on the target PCB; thereby, also reducing board cost and
required routing layers.
100
100
50 ؎10؇C/MIN
150؇C
TIME – Sec
Figure 38.
REV. A
–40–
AD14160/AD14160L
GROUND BOUNCE ESTIMATE
In the Quad-SHARC module, the worse case ground bounce
condition occurs during an external memory operation in which
86 signals switch simultaneously from high to low. Because of
the ground planes embedded within the substrate of the mod-
ule, the effective ground pin inductance is found by dividing the
CBGA’s single ground pin inductance, estimated to be about
3 nH, by the 64 ground pins resulting in LGND = 0.05 nH.
Typical output fall times for varying load conditions can be
obtained from this data sheet.
Ground bounce diminishes noise margins in a system and must
be held as low as possible. Ground bounce results from switch-
ing output pins from a high to a low state with the ensuing dis-
charge current creating a voltage across the parasitic inductance
of the MCM’s ground pins (and to a lesser extent across the
wirebond wires connecting the ground pads). A useful model for
calculating the level of ground bounce is shown below (Johnson,
Howard W. and Graham, Martin, “High-Speed Digital Design,”
Prentice Hall p67, 1993).
The induced voltage generated by the switching currents is
V
DD
given by
d
dt
VGND = LGND
(IDISCHARGE)
SHARC DIE
Assuming the voltage waveform is an integrated Gaussian pulse,
the peak amplitude is approximated by
V
IN
1. 5 2 ∆ V
|VGND| max = LGND
C.
2
T10–90
Calculated ground bounce maximum values for the CBGA
module are listed below.
I
LOAD C
DISCHARGE
Load per Output
(pF)
Fall Time
(ns)
Ground Bounce
(V)
GROUND PIN
INDUCTANCE
V
GND
L
20
100
200
1.8
4.2
7.4
0.161
0.148
0.095
GND
SYSTEM GROUND PLANE
Figure 40.
REV. A
–41–
AD14160/AD14160L
Thermal Characteristics
Metal Coverage Per Layer
Percent Metal
The AD14160/AD14160L is packaged in a 452-lead ceramic
ball grid array (CBGA). The package is optimized for thermal
conduction through the core (base of the package) down to the
mounting surface. The AD14160/AD14160L is specified for a
case temperature (TCASE). Design of the mounting surface and
attachment material should be such that TCASE is not exceeded.
Layer
(1 Mil Thick)
VDD
87
12
12
89
14
13
91
SIG2
SIG3
GND
SIG4
SIG5
BASE
θJC = 0.36°C/W
Thermal Cross-Section
The data below, together with the detailed mechanical drawings
at the end of the data sheet, allows for constructing simple ther-
mal models for further analysis within targeted systems. The top
layer of the package, where the die are mounted, is a metal VDD
layer. The approximate metal area coverage from the metal
planes and routing layers is estimated below.
(Assume Uniformly Distributed)
Thermal Conductivity
Thermal Conductivity
Material
W/cm؇C
Ceramic
Kovar
Tungsten
Thermoplastic
Silicon
0.18
0.14
1.78
0.03
1.45
KOVAR LID
0.015 IN
KOVAR SEAL RING
HEIGHT = 50 MILS
SUB-PAD
SIGI
SEAL RING METALIZATION
SILICON DIE
19 MILS
THERMOPLASTIC
THICKNESS 5 MILS
CERAMIC LAYER 28 MILS
(2 LAYERS 14 MILS EACH)
V
DD
SIG2
SIG3
GND
SIG4
SIG5
CERAMIC LAYER 6 MILS
CERAMIC LAYER 6 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 8 MILS
BASE
DBGA PADS
Figure 41.
REV. A
–42–
AD14160/AD14160L
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A
A
A
B
A
C
A
D
A
E
A
F
A
G
A
H
A
J
A
K
A
L
A
M
A
N
A
P
A
R
A
T
ADDRESS
DATA
CONTROLS, MISC
VDD
GND
NOTE:
PADS OUTSIDE THE DARK BORDER ARE REDUNDANT
OR NOT REQUIRED. THE MODULE IS PRODUCTION
TESTED WITH ONLY THOSE SIGNALS INSIDE THE
DARK BORDER.
LINKS
SERIAL PORTS
UNUSED
Figure 42. Board Footprint for AD14160/AD14160L Quad SHARC BGA
REV. A
–43–
AD14160/AD14160L
MECHANICAL CHARACTERISTICS
Lid Deflection Analysis
1.850؎0.012 SQ.
25
20
15
0.670؎0.007
4
؋
0.653؎0.007
4
؋
0.195
0.633
0.616
10
5
0.188
0.230
0.188
1.790
1.710
1.680
0
7.33034759
4.87379679
2.41724599
2
0.69766043
EXTERNAL PRESSURE – lbs/in
0.024 TYP
Figure 43. Deflection (mils) vs. External Pressure
Mechanical Model
0.012 REF
0.060
4
؋
0.008 REF
4
؋
The data below, together with the detailed mechanical drawings
at the end of the data sheet, allows for construction of simple
mechanical models for further analysis within targeted systems.
The following pages list two separate pin listings. The first is
ordered by pin number and the second is an alphabetical list by
pin name. Note that there are many not required or redundant
pins beyond the standard package 452 leads. These pins are
noted in parentheses. For example: (GND), (VDD), (unused),
(TEST). These pins are extraneous and only the redundant
(GND) and (VDD) should be connected if desired.
Mechanical Properties
Material
Modulus of Elasticity
Ceramic
Kovar
Tungsten
Thermoplastic
Silicon
26 × 103 kg/mm2
14.1 × 103 kg/mm2
35 × 103 kg/mm2
279 kg/mm2
11 × 103 kg/mm2
452-LEAD CBGA PIN CONFIGURATION
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
PIN A1
INDEX
BOTTOM VIEW
REV. A
–44–
AD14160/AD14160L
PIN CONFIGURATIONS (Pin Order Listing)
Pin
No
Pin
Name
Pin Pin
No Name
Pin
No.
Pin
Name
Pin
No
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
C1 (GND)
C2 (GND)
C3 (unused)
C4 (VDD)
C5 (unused)
C6 (unused)
C7 (unused)
C8 (unused)
C9 (unused)
C10 (unused)
C11 (unused)
C12 (unused)
C13 (unused)
C14 (unused)
C15 (unused)
C16 (unused)
C17 (unused)
C18 (GND)
C19 (VDD)
C20 (unused)
C21 (unused)
C22 (unused)
C23 (unused)
C24 (unused)
C25 (unused)
C26 (unused)
C27 (unused)
C28 (unused)
C29 (unused)
C30 (unused)
C31 (unused)
C32 (unused)
C33 (GND)
C34 (unused)
C35 (VDD)
C36 (GND)
D1 (GND)
D2 (unused)
D3 (unused)
D4 (GND)
D5 (unused)
D6 (GND)
D7 (unused)
D8 (GND)
D9 (unused)
D10 (GND)
D11 (unused)
D12 (GND)
D13 (unused)
D14 (GND)
D15 (unused)
D16 (GND)
D17 (unused)
D18 (VDD)
D19 (VDD)
D20 (unused)
D21 (GND)
D22 (unused)
D23 (GND)
D24 (unused)
D25 (GND)
D26 (unused)
D27 (GND)
D28 (unused)
D29 (GND)
D30 (unused)
D31 (GND)
D32 (unused)
D33 (GND)
D34 (unused)
D35 (unused)
D36 (GND)
E1
E2
E3
E4
E5
E6
E7
E8
E9
(GND)
G1
G2
G3
G4
G5
G6
G7
G8
G9
(GND)
J1
(GND)
(unused)
(unused)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(TEST11)
DATA10
LB2ACK
LB2CLK
LB2DAT0
LB2DAT1
GND
L1
L2
L3
L4
L5
L6
L7
L8
L9
(GND)
(unused)
(unused)
(unused)
(GND)
(unused)
(unused)
(unused)
(GND)
J2
(unused)
(unused)
(unused)
(GND)
A3
A4
A5
A6
A7
A8
A9
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
J3
J4
J5
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
J6
(unused)
(GND)
(unused)
(TEST10)
J7
J8
J9
A10 (GND)
A11 (GND)
A12 (GND)
A13 (GND)
A14 (GND)
A15 (GND)
A16 (GND)
A17 (GND)
A18 (GND)
A19 (GND)
A20 (GND)
A21 (GND)
A22 (GND)
A23 (GND)
A24 (GND)
A25 (GND)
A26 (GND)
A27 (GND)
A28 (GND)
A29 (GND)
A30 (GND)
A31 (GND)
A32 (GND)
A33 (GND)
A34 (GND)
E10 (unused)
E11 (GND)
E12 (unused)
E13 (GND)
E14 (unused)
E15 (GND)
E16 (unused)
E17 (unused)
E18 (VDD)
E19 (VDD)
E20 (unused)
E21 (unused)
E22 (GND)
E23 (unused)
E24 (GND)
E25 (unused)
E26 (GND)
E27 (unused)
E28 (GND)
E29 (unused)
E30 (GND)
E31 (unused)
E32 (GND)
E33 (unused)
E34 (unused)
E35 (unused)
E36 (GND)
G10 (unused)
G11 (GND)
G12 (unused)
G13 (GND)
G14 (unused)
G15 (GND)
G16 GND
G17 LB1DAT2
G18 LB1DAT3
G19 RFSA1
G20 RFSA0
G21 VDD
G22 (GND)
G23 (unused)
G24 (GND)
G25 (unused)
G26 (GND)
G27 (unused)
G28 (GND)
G29 (unused)
G30 (GND)
G31 (unused)
G32 (GND)
G33 (unused)
G34 (unused)
G35 (unused)
G36 (GND)
H1
H2
H3
H4
H5
H6
H7
H8
H9
J10
J11
J12
J13
J14
J15
J16
J17
J18
J19
J20
J21
J22
J23
J24
J25
J26
J27
J28
J29
J30
J31
J32
J33
J34
J35
J36
K1
K2
K3
K4
K5
K6
K7
K8
K9
L10 DATA30
L11 DATA22
L12 DATA12
L13 LB4ACK
L14 LB4CLK
L15 LB4DAT0
L16 LB4DAT1
L17 LB4DAT2
L18 LB4DAT3
L19 TCLKA1
L20 TCLKA0
L21 RESET
L22 LA2ACK
L23 LA2CLK
L24 LA2DAT0
L25 LA2DAT1
L26 LA2DAT2
L27 LA2DAT3
L28 (TEST15)
L29 (unused)
L30 (GND)
L31 (unused)
L32 (GND)
L33 (unused)
L34 (unused)
L35 (unused)
L36 (GND)
M1
M2
M3
M4
M5
M6
M7
M8
M9
VDD
DRA1
DRA0
ACK
PAGE
GND
VDD
GND
(TEST14)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(unused)
(unused)
(GND)
(GND)
(unused)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
F1
F2
F3
F4
F5
F6
F7
F8
F9
(GND)
(GND)
(GND)
B2
B3
B4
B5
B6
B7
B8
B9
(GND)
(unused)
(unused)
(GND)
(unused)
(unused)
(GND)
(unused)
(unused)
(GND)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(GND)
(unused)
(GND)
(unused)
(unused)
(GND)
(unused)
(GND)
(unused)
(unused)
(GND)
(unused)
(TEST10)
RFSB0
B10 (unused)
B11 (unused)
B12 (unused)
B13 (unused)
B14 (unused)
B15 (unused)
B16 (unused)
B17 (unused)
B18 (unused)
B19 (unused)
B20 (unused)
B21 (unused)
B22 (unused)
B23 (unused)
B24 (unused)
B25 (unused)
B26 (unused)
B27 (unused)
B28 (unused)
B29 (unused)
B30 (unused)
B31 (unused)
B32 (unused)
B33 (unused)
B34 (unused)
B35 (GND)
F10 (GND)
F11 (unused)
F12 (GND)
F13 (unused)
F14 (GND)
F15 (unused)
F16 (GND)
F17 (TEST12)
F18 (TEST12)
F19 (TEST13)
F20 (TEST13)
F21 (GND)
F22 (unused)
F23 (GND)
F24 (unused)
F25 (GND)
F26 (unused)
F27 (GND)
F28 (unused)
F29 (GND)
F30 (unused)
F31 (GND)
F32 (unused)
F33 (GND)
F34 (unused)
F35 (unused)
F36 (GND)
H10 (GND)
H11 (unused)
H12 (TEST11)
H13 LB1ACK
H14 LB1CLK
H15 LB1DAT0
H16 LB1DAT1
H17 LB2DAT2
H18 LB2DAT3
H19 RCLKA1
H20 RCLKA0
H21 REDY
K10 GND
M10 DATA31
M11 DATA23
M12 DATA13
M13 DATA2
M14 DATA0
M15 DMAG1
M16 DMAR1
M17 DMAR2
M18 VDD
K11 DATA21
K12 DATA11
K13 LB3ACK
K14 LB3CLK
K15 LB3DAT0
K16 LB3DAT1
K17 LB3DAT2
K18 LB3DAT3
K19 TFSA1
M19 DTA1
K20 TFSA0
K21 CSA
M20 DTA0
M21 CPAA
H22 VDD
K22 LA1ACK
K23 LA1CLK
K24 LA1DAT0
K25 LA1DAT1
K26 LA1DAT2
K27 LA1DAT3
K28 (unused)
K29 (GND)
K30 (unused)
K31 (GND)
K32 (unused)
K33 (GND)
M22 LA3ACK
M23 LA3CLK
M24 LA3DAT0
M25 LA3DAT1
M26 LA3DAT2
M27 LA3DAT3
M28 VDD
H23 GND
H24 VDD
H25 (TEST14)
H26 (unused)
H27 (GND)
H28 (unused)
H29 (GND)
H30 (unused)
H31 (GND)
H32 (unused)
H33 (GND)
H34 (unused)
H35 (unused)
H36 (GND)
M29 (TEST15)
M30 (unused)
M31 (GND)
M32 (unused)
M33 (GND)
M34 (unused)
M35 (unused)
M36 (GND)
K34 (unused)
K35 (unused)
K36 (GND)
REV. A
–45–
AD14160/AD14160L
PIN CONFIGURATIONS (Pin Order Listing Continued)
Pin
No
Pin
Name
Pin
No
Pin
Name
Pin
No.
Pin
Name
Pin
No
Pin
Name
Pin
Pin
Name
Pin
No.
Pin
Name
No.
N1
(GND)
(unused)
(unused)
(unused)
(GND)
(unused)
(GND)
VDD
RCLKB0
DATA32
DATA24
DATA14
DATA3
DATA1
DMAG2
SBTS
R1
(GND)
(unused)
(unused)
(unused)
(GND)
(unused)
(GND)
RCLKB1
TFSB0
DATA34
DATA26
DATA16
DATA5
GND
U1
(GND)
(unused)
(unused)
(unused)
(unused)
(TEST9)
GND
W1
(GND)
(GND)
(VDD)
(VDD)
(VDD)
(TEST8)
GND
AA1
(GND)
(unused)
(unused)
(GND)
(unused)
(GND)
GND
AC1
(GND)
(unused)
(unused)
(GND)
(unused)
(GND)
(unused)
GND
N2
R2
U2
W2
AA2
AC2
N3
R3
U3
W3
AA3
AC3
N4
R4
U4
W4
AA4
AC4
N5
R5
U5
W5
AA5
AC5
N6
R6
U6
W6
AA6
AC6
N7
R7
U7
W7
AA7
AC7
N8
R8
U8
TFSB1
DTB0
W8
DTB1
AA8
HBR
AC8
N9
R9
U9
W9
DATA46
DATA38
DATA29
DATA20
DATA9
(unused)
(unused)
GND
AA9
BR2
CPAB
AC9
BR4
N10
N11
N12
N13
N14
N15
N16
N17
N18
N19
N20
N21
N22
N23
N24
N25
N26
N27
N28
N29
N30
N31
N32
N33
N34
N35
N36
P1
R10
R11
R12
R13
R14
R15
R16
R17
R18
R19
R20
R21
R22
R23
R24
R25
R26
R27
R28
R29
R30
R31
R32
R33
R34
R35
R36
T1
U10
U11
U12
U13
U14
U15
U16
U17
U18
U19
U20
U21
U22
U23
U24
U25
U26
U27
U28
U29
U30
U31
U32
U33
U34
U35
U36
V1
DATA36
CLKIN
DATA18
DATA7
VDD
W10
W11
W12
W13
W14
W15
W16
W17
W18
W19
W20
W21
W22
W23
W24
W25
W26
W27
W28
W29
W30
W31
W32
W33
W34
W35
W36
Y1
AA10
AA11
AA12
AA13
AA14
AA15
AA16
AA17
AA18
AA19
AA20
AA21
AA22
AA23
AA24
AA25
AA26
AA27
AA28
AA29
AA30
AA31
AA32
AA33
AA34
AA35
AA36
AB1
AC10
AC11
AC12
AC13
AC14
AC15
AC16
AC17
AC18
AC19
AC20
AC21
AC22
AC23
AC24
AC25
AC26
AC27
AC28
AC29
AC30
AC31
AC32
AC33
AC34
AC35
AC36
AD1
FLAGC0
RCLKC1
RCLKC0
ADRCLK
VDD
DATA44
DATA42
DATA40
(unused)
(unused)
GND
GND
GND
VDD
GND
TIMEXPB
VDD
VDD
(unused)
(unused)
(unused)
(unused)
(unused)
LA4ACK
LA4CLK
LA4DAT0
LA4DAT1
LA4DAT2
LA4DAT3
GND
IRQB0
IRQB1
IRQB2
GND
VDD
GND
VDD
VDD
VDD
GND
GND
VDD
VDD
GND
GND
VDD
GND
GND
GND
GND
GND
VDD
VDD
VDD
VDD
GND
VDD
VDD
VDD
RPBA
GND
GND
GND
TIMEXPC
ADDR0
ADDR1
ADDR2
ADDR3
FLAGD3
VDD
MS0
ADDR24
ADDR25
ADDR26
ADDR27
IRQA2
ADDR16
ADDR17
ADDR18
ADDR19
FLAGA3
FLAGA2
TDI
ADDR8
ADDR9
ADDR10
ADDR11
FLAGD1
IRQD1
VDD
MS1
MS2
MS3
IDA0
VDD
LBOOTA
(GND)
(unused)
(GND)
(unused)
(unused)
(unused)
(GND)
(GND)
(unused)
(unused)
(GND)
(unused)
(GND)
VDD
IRQA1
TDOA
(GND)
(unused)
(GND)
(unused)
(unused)
(unused)
(GND)
(GND)
(unused)
(unused)
(GND)
(unused)
(GND)
(unused)
RFSB1
(unused)
(GND)
(unused)
(GND)
(unused)
(unused)
(GND)
(GND)
(unused)
(unused)
(unused)
(GND)
(unused)
(GND)
VDD
BR5
FLAGC1
DRC1
DRC0
CPAC
CSC
EMU
(TEST16)
(unused)
(unused)
(unused)
(unused)
(GND)
(GND)
(GND)
(VDD)
(VDD)
(VDD)
(TEST9)
CSB
(TEST1)
(VDD)
(VDD)
(GND)
(VDD)
(GND)
(GND)
(unused)
(unused)
(unused)
(unused)
(TEST8)
VDD
(GND)
(unused)
(GND)
(unused)
(unused)
(GND)
(GND)
(unused)
(unused)
(unused)
(GND)
(unused)
(GND)
HBG
P2
T2
V2
Y2
AB2
AD2
P3
T3
V3
Y3
AB3
AD3
P4
T4
V4
Y4
AB4
AD4
P5
T5
V5
Y5
AB5
AD5
P6
T6
V6
Y6
AB6
AD6
P7
T7
V7
Y7
AB7
AD7
P8
T8
DRB1
V8
TCLKB1
DATA45
DATA37
DATA28
DATA19
DATA8
FLAGB0
FLAGB1
FLAGB2
FLAGB3
VDD
Y8
SW
BR1
AB8
AD8
P9
DRB0
T9
TCLKB0
DATA35
DATA27
DATA17
DATA6
VDD
V9
Y9
AB9
BR3
GND
AD9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P25
P26
P27
P28
P29
P30
P31
P32
P33
P34
P35
P36
DATA33
DATA25
DATA15
DATA4
GND
T10
T11
T12
T13
T14
T15
T16
T17
T18
T19
T20
T21
T22
T23
T24
T25
T26
T27
T28
T29
T30
T31
T32
T33
T34
T35
T36
V10
V11
V12
V13
V14
V15
V16
V17
V18
V19
V20
V21
V22
V23
V24
V25
V26
V27
V28
V29
V30
V31
V32
V33
V34
V35
V36
Y10
Y11
Y12
Y13
Y14
Y15
Y16
Y17
Y18
Y19
Y20
Y21
Y22
Y23
Y24
Y25
Y26
Y27
Y28
Y29
Y30
Y31
Y32
Y33
Y34
Y35
Y36
DATA47
DATA43
DATA41
DATA39
(unused)
(unused)
GND
AB10
AB11
AB12
AB13
AB14
AB15
AB16
AB17
AB18
AB19
AB20
AB21
AB22
AB23
AB24
AB25
AB26
AB27
AB28
AB29
AB30
AB31
AB32
AB33
AB34
AB35
AB36
AD10
AD11
AD12
AD13
AD14
AD15
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
AD24
AD25
AD26
AD27
AD28
AD29
AD30
AD31
AD32
AD33
AD34
AD35
AD36
RFSC1
RFSC0
TDOB
(unused)
(unused)
GND
GND
GND
IDB0
GND
GND
IDB1
GND
GND
GND
TMS
IDB2
GND
VDD
GND
TRST
(unused)
(unused)
(unused)
GND
GND
VDD
VDD
GND
RFSD1
RFSD0
BMSBCD
LD1ACK
LD1CLK
LD1DAT0
LD1DAT1
LD1DAT2
LD1DAT3
TIMEXPD
GND
(GND)
(unused)
(GND)
(unused)
(unused)
(unused)
(GND)
(unused)
(unused)
(unused)
(unused)
ADDR28
ADDR29
ADDR30
ADDR31
IRQA0
EBOOTA
GND
GND
VDD
VDD
VDD
VDD
VDD
BMSA
GND
VDD
GND
GND
GND
VDD
GND
ADDR20
ADDR21
ADDR22
ADDR23
FLAGA0
FLAGA1
TIMEXPA
(TEST16)
(VDD)
ADDR12
ADDR13
ADDR14
ADDR15
FLAGD0
IRQD0
GND
ADDR4
ADDR5
ADDR6
ADDR7
FLAGD2
IRQD2
(GND)
(unused)
(GND)
(unused)
(unused)
(unused)
(GND)
GND
GND
GND
IDA1
IDA2
(unused)
(GND)
(unused)
(GND)
(unused)
(unused)
(GND)
(GND)
(unused)
(GND)
(unused)
(unused)
(GND)
(TEST1)
(unused)
(unused)
(unused)
(unused)
(GND)
(VDD)
(GND)
(VDD)
(GND)
REV. A
–46–
AD14160/AD14160L
PIN CONFIGURATIONS (Pin Order Listing Continued)
Pin
No
Pin
Name
Pin
No
Pin
Name
Pin
No.
Pin
Name
Pin
No
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
AE1
(GND)
AG1
(GND)
AJ1
(GND)
AL1
(GND)
AN1
(GND)
AE2
(unused)
(unused)
(GND)
AG2
(unused)
(unused)
(GND)
AJ2
(unused)
(unused)
(GND)
AL2
(unused)
(unused)
(GND)
AN2
(unused)
(unused)
(GND)
AR2
(GND)
AE3
AG3
AJ3
AL3
AN3
AR3
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(GND)
AE4
AG4
AJ4
AL4
AN4
AR4
AE5
(unused)
(GND)
(unused)
(TEST7)
BR6
FLAGC2
TFSC1
TFSC0
LC1ACK
LC1CLK
LC1DAT0
LC1DAT1
LC1DAT2
LC1DAT3
RCLKD1
RCLKD0
WR
LD2ACK
LD2CLK
LD2DAT0
LD2DAT1
LD2DAT2
LD2DAT3
VDD
AG5
(unused)
(GND)
(unused)
(GND)
(unused)
GND
AJ5
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(TEST6)
LC4ACK
LC4CLK
LC4DAT0
LC4DAT1
LC4DAT2
LC4DAT3
DTD1
DTD0
CPAD
TDO
LBOOTBCD
TCK
(TEST3)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
AL5
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(TEST5)
(TEST5)
(TEST4)
(TEST4)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
AN5
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(VDD)
(VDD)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
AR5
AE6
AG6
AJ6
AL6
AN6
AR6
AE7
AG7
AJ7
AL7
AN7
AR7
AE8
AG8
AJ8
AL8
AN8
AR8
AE9
AG9
AJ9
AL9
AN9
AR9
AE10
AE11
AE12
AE13
AE14
AE15
AE16
AE17
AE18
AE19
AE20
AE21
AE22
AE23
AE24
AE25
AE26
AE27
AE28
AE29
AE30
AE31
AE32
AE33
AE34
AE35
AE36
AF1
AG10
AG11
AG12
AG13
AG14
AG15
AG16
AG17
AG18
AG19
AG20
AG21
AG22
AG23
AG24
AG25
AG26
AG27
AG28
AG29
AG30
AG31
AG32
AG33
AG34
AG35
AG36
AH1
AJ10
AJ11
AJ12
AJ13
AJ14
AJ15
AJ16
AJ17
AJ18
AJ19
AJ20
AJ21
AJ22
AJ23
AJ24
AJ25
AJ26
AJ27
AJ28
AJ29
AJ30
AJ31
AJ32
AJ33
AJ34
AJ35
AJ36
AK1
AK2
AK3
AK4
AK5
AK6
AK7
AK8
AK9
AL10
AL11
AL12
AL13
AL14
AL15
AL16
AL17
AL18
AL19
AL20
AL21
AL22
AL23
AL24
AL25
AL26
AL27
AL28
AL29
AL30
AL31
AL32
AL33
AL34
AL35
AL36
AM1
AN10
AN11
AN12
AN13
AN14
AN15
AN16
AN17
AN18
AN19
AN20
AN21
AN22
AN23
AN24
AN25
AN26
AN27
AN28
AN29
AN30
AN31
AN32
AN33
AN34
AN35
AN36
AP1
AR10
AR11
AR12
AR13
AR14
AR15
AR16
AR17
AR18
AR19
AR20
AR21
AR22
AR23
AR24
AR25
AR26
AR27
AR28
AR29
AR30
AR31
AR32
AR33
AR34
AR35
DTC1
DTC0
IRQC0
IRQC1
IRQC2
IDC0
IDC1
IDC2
TFSD1
TFSD0
CSD
LD4ACK
LD4CLK
LD4DAT0
LD4DAT1
LD4DAT2
LD4DAT3
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(TEST2)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(unused)
(GND)
(unused)
(unused)
(GND)
(unused)
(unused)
(GND)
(unused)
(unused)
(GND)
(unused)
(unused)
(GND)
(GND)
(GND)
(unused)
(VDD)
(GND)
(GND)
(GND)
(GND)
AF2
(unused)
(unused)
(unused)
(GND)
AH2
(unused)
(unused)
(unused)
(GND)
(unused)
(unused)
(unused)
(GND)
AM2
(unused)
(unused)
(unused)
(GND)
AP2
AF3
AH3
AM3
AP3
AT3
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
AF4
AH4
AM4
AP4
AT4
AF5
AH5
AM5
AP5
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(GND)
AT5
AF6
(unused)
(GND)
AH6
(unused)
(GND)
(unused)
(GND)
(unused)
(TEST6)
VDD
LC3ACK
LC3CLK
LC3DAT0
LC3DAT1
LC3DAT2
LC3DAT3
TCLKD1
TCLKD0
IDD0
(unused)
(GND)
(unused)
(GND)
AM6
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
AP6
AT6
AF7
AH7
AM7
AP7
AT7
AF8
(unused)
(TEST7)
FLAGC3
TCLKC1
TCLKC0
LC2ACK
LC2CLK
LC2DAT0
LC2DAT1
LC2DAT2
LC2DAT3
DRD1
AH8
AM8
AP8
AT8
AF9
AH9
AM9
AP9
AT9
AF10
AF11
AF12
AF13
AF14
AF15
AF16
AF17
AF18
AF19
AF20
AF21
AF22
AF23
AF24
AF25
AF26
AF27
AF28
AF29
AF30
AF31
AF32
AF33
AF34
AF35
AH10
AH11
AH12
AH13
AH14
AH15
AH16
AH17
AH18
AH19
AH20
AH21
AH22
AH23
AH24
AH25
AH26
AH27
AH28
AH29
AH30
AH31
AH32
AH33
AH34
AH35
AK10 (unused)
AK11 (GND)
AK12 (unused)
AK13 (GND)
AK14 (unused)
AK15 (GND)
AK16 GND
AK17 VDD
AK18 GND
AK19 VDD
AK20 VDD
AK21 GND
AK22 (GND)
AK23 (unused)
AM10
AM11
AM12
AM13
AM14
AM15
AM16
AM17
AM18
AM19
AM20
AM21
AM22
AM23
AM24
AM25
AM26
AM27
AM28
AM29
AM30
AM31
AM32
AM33
AM34
AM35
AP10
AP11
AP12
AP13
AP14
AP15
AP16
AP17
AP18
AP19
AP20
AP21
AP22
AP23
AP24
AP25
AP26
AP27
AP28
AP29
AP30
AP31
AP32
AP33
AP34
AP35
AT10
AT11
AT12
AT13
AT14
AT15
AT16
AT17
AT18
AT19
AT20
AT21
AT22
AT23
AT24
AT25
AT26
AT27
AT28
AT29
AT30
AT31
AT32
AT33
AT34
(unused)
(GND)
(unused)
(unused)
(VDD)
(VDD)
(VDD)
DRD0
RD
(unused)
(unused)
(GND)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(GND)
LD3ACK
LD3CLK
LD3DAT0
LD3DAT1
LD3DAT2
LD3DAT3
(TEST2)
(unused)
(GND)
(unused)
(GND)
(unused)
(unused)
(unused)
IDD1
IDD2
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(unused)
(unused)
EBOOTBCD AK24 (GND)
TDOC
(TEST3)
(unused)
(GND)
(unused)
(GND)
(unused)
(GND)
(unused)
(unused)
(unused)
AK25 (unused)
AK26 (GND)
AK27 (unused)
AK28 (GND)
AK29 (unused)
AK30 (GND)
AK31 (unused)
AK32 (GND)
AK33 (unused)
AK34 (unused)
AK35 (unused)
(unused)
(VDD)
AF36
(GND)
AH36
(GND)
AK36 (GND)
AM36
(GND)
AP36
(GND)
REV. A
–47–
AD14160/AD14160L
PIN CONFIGURATIONS (Alphabetical Listing)
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
ACK
J21
DATA21
DATA22
DATA23
DATA24
DATA25
DATA26
DATA27
DATA28
DATA29
DATA30
DATA31
DATA32
DATA33
DATA34
DATA35
DATA36
DATA37
DATA38
DATA39
DATA40
DATA41
DATA42
DATA43
DATA44
DATA45
DATA46
DATA47
DMAG1
DMAG2
DMAR1
DMAR2
DRA0
DRA1
DRB0
DRB1
DRC0
DRC1
DRD0
DRD1
DTA0
DTA1
DTB0
DTB1
DTC0
DTC1
DTD0
DTD1
EBOOTA
K11
L11
M11
N11
P11
R11
T11
V11
W11
L10
M10
N10
P10
R10
T10
U10
V10
W10
Y13
AA13
Y12
AA12
Y11
AA11
V9
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
HBG
HBR
N28
P14
P15
P22
P23
P24
P25
P26
P27
R14
R15
R16
R20
R21
R22
T15
T16
IRQA0
IRQA1
IRQA2
IRQB0
IRQB1
IRQB2
IRQC0
IRQC1
IRQC2
IRQD0
IRQD1
IRQD2
T28
U29
U28
R17
R18
R19
AG13
AG14
AG15
Y29
AA29
AB29
K22
K23
K24
K25
K26
K27
L22
LC2DAT2
LC2DAT3
LC3ACK
LC3CLK
LC3DAT0
LC3DAT1
LC3DAT2
LC3DAT3
LC4ACK
LC4CLK
LC4DAT0
LC4DAT1
LC4DAT2
LC4DAT3
LD1ACK
LD1CLK
LD1DAT0
LD1DAT1
LD1DAT2
LD1DAT3
LD2ACK
LD2CLK
LD2DAT0
LD2DAT1
LD2DAT2
LD2DAT3
LD3ACK
LD3CLK
LD3DAT0
LD3DAT1
LD3DAT2
LD3DAT3
LD4ACK
LD4CLK
LD4DAT0
LD4DAT1
LD4DAT2
LD4DAT3
MS0
MS1
MS2
MS3
PAGE
RCLKA0
RCLKA1
RCLKB0
RCLKB1
RCLKC0
RCLKC1
RCLKD0
RCLKD1
RD
REDY
RESET
RFSA0
RFSA1
RFSB0
RFSB1
RFSC0
RFSC1
AF17
AF18
AH13
AH14
AH15
AH16
AH17
AH18
AJ13
AJ14
AJ15
AJ16
AJ17
AJ18
AD22
AD23
AD24
AD25
AD26
AD27
AE22
AE23
AE24
AE25
AE26
AE27
AF22
AF23
AF24
AF25
AF26
AF27
AG22
AG23
AG24
AG25
AG26
AG27
R24
R25
R26
R27
J22
H20
H19
N9
R8
AC12
AC11
AE20
AE19
AF21
H21
L21
G20
G19
M9
TCLKD0
TCLKD1
TDI
AH20
AH19
W30
AJ22
U30
AB13
AH25
K20
K19
R9
U8
AE12
AE11
AG20
AG19
V30
ADDR0
ADDR1
ADDR2
ADDR3
ADDR4
ADDR5
ADDR6
ADDR7
ADDR8
ADDR9
ADDR10
ADDR11
ADDR12
ADDR13
ADDR14
ADDR15
ADDR16
ADDR17
ADDR18
ADDR19
ADDR20
ADDR21
ADDR22
ADDR23
ADDR24
ADDR25
ADDR26
ADDR27
ADDR28
ADDR29
ADDR30
ADDR31
ADRCLK
BMSA
BMSBCD
BR1
BR2
BR3
BR4
BR5
BR6
CLKIN
CPAA
CPAB
CPAC
CPAD
CSA
CSB
CSC
CSD
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
DATA16
DATA17
DATA18
DATA19
DATA20
AC24
AC25
AC26
AC27
AB24
AB25
AB26
AB27
AA24
AA25
AA26
AA27
Y24
Y25
Y26
Y27
W24
W25
W26
W27
V24
V25
V26
TDO
TDOA
TDOB
TDOC
TFSA0
TFSA1
TFSB0
TFSB1
TFSC0
TFSC1
TFSD0
TFSD1
TIMEXPA
TIMEXPB
TIMEXPC
TIMEXPD
TMS
TRST
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
LA1ACK
LA1CLK
LA1DAT0
LA1DAT1
LA1DAT2
LA1DAT3
LA2ACK
LA2CLK
LA2DAT0
LA2DAT1
LA2DAT2
LA2DAT3
LA3ACK
LA3CLK
LA3DAT0
LA3DAT1
LA3DAT2
LA3DAT3
LA4ACK
LA4CLK
LA4DAT0
LA4DAT1
LA4DAT2
LA4DAT3
LB1ACK
LB1CLK
LB1DAT0
LB1DAT1
LB1DAT2
LB1DAT3
LB2ACK
LB2CLK
LB2DAT0
LB2DAT1
LB2DAT2
LB2DAT3
LB3ACK
LB3CLK
LB3DAT0
LB3DAT1
LB3DAT2
LB3DAT3
LB4ACK
LB4CLK
LB4DAT0
LB4DAT1
LB4DAT2
LB4DAT3
LBOOTA
LBOOTBCD
LC1ACK
LC1CLK
LC1DAT0
LC1DAT1
LC1DAT2
LC1DAT3
LC2ACK
LC2CLK
LC2DAT0
LC2DAT1
U16
T17
T18
T19
T30
AC23
AD28
AD17
AD18
G21
H22
H24
J18
J24
M18
M28
N8
N29
T7
T14
U14
U17
U18
U19
U20
U21
V18
V19
V21
W17
W18
W19
W21
W22
Y7
Y18
Y19
Y20
Y21
AA21
AA22
AA30
AB20
AB21
AB22
AB23
AC14
AC15
AC16
AC17
AC21
AC22
AC29
AD8
AE28
AH12
AK17
AK19
AK20
AE21
L23
L24
L25
L26
U7
U15
U22
U23
V20
V23
W7
W16
W20
W23
Y16
Y17
Y22
L27
V27
M22
M23
M24
M25
M26
M27
N22
N23
N24
N25
N26
N27
H13
H14
H15
H16
G17
G18
J13
U24
U25
U26
U27
T24
T25
T26
T27
AC13
V22
AD21
Y9
AA9
AB9
AC9
AD9
AE9
U11
M21
AA10
AD13
AJ21
K21
V7
AD14
AG21
M14
N14
M13
N13
P13
R13
T13
U13
V13
W13
J12
K12
L12
M12
N12
P12
R12
T12
W9
Y10
M15
N15
M16
M17
J20
J19
P9
T8
AD12
AD11
AF20
AF19
M20
M19
U9
Y23
Y30
AA7
AA16
AA17
AA18
AA19
AA20
AA23
AB10
AB16
AB17
AB18
AB19
AC8
AC18
AC19
AC20
AD16
AD29
AG10
AK16
AK18
AK21
AB8
AA8
R28
W8
AG12
AG11
AJ20
AJ19
T29
J14
J15
J16
H17
H18
K13
K14
K15
K16
K17
K18
L13
L14
L15
L16
L17
EBOOTBCD AH24
EMU
AD15
V28
V29
W29
W28
V14
V15
V16
V17
AC10
AD10
AE10
AF10
Y28
AA28
AB28
AC28
G16
H23
J17
FLAGA0
FLAGA1
FLAGA2
FLAGA3
FLAGB0
FLAGB1
FLAGB2
FLAGB3
FLAGC0
FLAGC1
FLAGC2
FLAGC3
FLAGD0
FLAGD1
FLAGD2
FLAGD3
GND
P8
AB12
AB11
AD20
AD19
R23
N16
Y8
AJ24
L20
L19
T9
V8
L18
R29
IDA0
IDA1
IDA2
IDB0
IDB1
IDB2
IDC0
IDC1
IDC2
IDD0
IDD1
IDD2
RFSD0
RFSD1
RPBA
SBTS
SW
TCK
TCLKA0
TCLKA1
TCLKB0
TCLKB1
TCLKC0
TCLKC1
P28
P29
P16
P17
AJ23
AE13
AE14
AE15
AE16
AE17
AE18
AF13
AF14
AF15
AF16
P18
AG16
AG17
AG18
AH21
AH22
AH23
GND
GND
GND
GND
U12
V12
W12
J23
J25
K10
VDD
VDD
WR
AF12
AF11
GND
REV. A
–48–
AD14160/AD14160L
PIN CONFIGURATIONS (Alphabetical Listing Continued)
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
A3
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
F8
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
P4
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
AG36
AH1
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(GND)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
(VDD)
AN23
AN25
AN27
AN29
AN31
AN33
AN36
AP1
(TEST1)
(TEST1)
(TEST2)
(TEST2)
(TEST3)
(TEST3)
(TEST4)
(TEST4)
(TEST5)
(TEST5)
(TEST6)
(TEST6)
(TEST7)
(TEST7)
(TEST8)
(TEST8)
(TEST9)
(TEST9)
(TEST10)
(TEST10)
(TEST11)
(TEST11)
(TEST12)
(TEST12)
(TEST13)
(TEST13)
(TEST14)
(TEST14)
(TEST15)
(TEST15)
(TEST16)
(TEST16)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
W31
Y31
AE29
AF28
AH26
AJ25
AL19
AL20
AL17
AL18
AH11
AJ12
AE8
AF9
W6
A4
F10
F12
F14
F16
F21
F23
F25
F27
F29
F31
F33
F36
G1
P6
A5
P31
AH5
A6
P33
AH7
AH9
A7
P36
A8
R1
AH28
AH30
AH32
AH36
AJ1
A9
R5
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
A32
A33
A34
B2
R7
R30
R32
AP2
AP18
AP33
AP36
AR2
R36
T1
T4
T6
T31
T33
T36
U1
AJ4
AJ6
AJ8
AJ10
AJ27
AJ29
AJ31
AJ33
AJ36
AK1
AR35
AT3
G5
G7
AT4
Y6
G9
AT5
U6
G11
G13
G15
G22
G24
G26
G28
G30
G32
G36
H1
AT6
V6
U36
V1
AT7
L9
AT8
M8
V2
AK5
AT9
H12
J11
V34
AK7
AT10
AT11
AT12
AT13
AT14
AT15
AT16
AT17
AT18
AT19
AT20
AT21
AT22
AT23
AT24
AT25
AT26
AT27
AT28
AT29
AT30
AT31
AT32
AT33
AT34
C4
V36
AK9
F17
F18
F19
F20
H25
J26
W1
AK11
AK13
AK15
AK22
AK24
AK26
AK28
AK30
AK32
AK36
AL1
W2
W34
W36
Y1
H4
Y36
L28
M29
U31
V31
B3
H6
AA1
AA4
AA6
AA31
AA33
AA36
AB1
AB5
AB7
AB30
AB32
AB36
AC1
AC4
AC6
AC31
AC33
AC36
AD1
AD5
AD7
AD30
AD32
AD36
AE1
AE4
AE6
AE31
AE33
AE36
AF1
AF5
AF7
AF30
AF32
AF36
AG1
AG4
AG6
AG8
AG29
AG31
AG33
H8
H10
H27
H29
H31
H33
H36
J1
B35
C1
C2
B4
AL4
B5
AL6
B6
C18
C33
C36
D1
AL8
B7
AL10
AL12
AL14
AL16
AL21
AL23
AL25
AL27
AL29
AL31
AL33
AL36
AM1
AM5
AM7
AM9
AM11
AM13
AM15
AM22
AM24
AM26
AM28
AM30
AM32
AM36
AN1
B8
J5
B9
J7
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
B32
B33
B34
C3
D4
J9
D6
J28
D8
J30
D10
D12
D14
D16
D21
D23
D25
D27
D29
D31
D33
D36
E1
J32
J36
K1
K4
K6
C19
K8
C35
K29
K31
K33
K36
L1
D18
D19
E18
E19
V3
L5
L7
V4
V5
E5
L30
L32
L36
M1
M4
M6
M31
M33
M36
N1
N5
N7
N30
N32
N36
P1
V32
E7
V33
E9
V35
E11
E13
E15
E22
E24
E26
E28
E30
E32
E36
F1
W3
W4
W5
W32
W33
W35
AM18
AM19
AN18
AN19
AP4
AN4
AN6
C5
AN8
C6
AN10
AN12
AN14
AN16
AN21
C7
C8
C9
F4
F6
AP19
AP35
C10
C11
REV. A
–49–
AD14160/AD14160L
PIN CONFIGURATIONS (Alphabetical Listing Continued)
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
Pin
Name
Pin
No.
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
C12
C13
C14
C15
C16
C17
C20
C21
C22
C23
C24
C25
C26
C27
C28
C29
C30
C31
C32
C34
D2
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
F34
F35
G2
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
N4
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
AB14
AB15
AB31
AB33
AB34
AB35
AC2
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
AJ34
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
(unused)
AP3
N6
AJ35
AP5
N17
N18
N19
N20
N21
N31
N33
N34
N35
P2
AK2
AP6
G3
AK3
AP7
G4
AK4
AP8
G6
AK6
AP9
G8
AK8
AP10
AP11
AP12
AP13
AP14
AP15
AP16
AP17
AP20
AP21
AP22
AP23
AP24
AP25
AP26
AP27
AP28
AP29
AP30
AP31
AP32
AP34
AR3
G10
G12
G14
G23
G25
G27
G29
G31
G33
G34
G35
H2
AC3
AK10
AK12
AK14
AK23
AK25
AK27
AK29
AK31
AK33
AK34
AK35
AL2
AC5
AC7
AC30
AC32
AC34
AC35
AD2
AD3
AD4
AD6
AD31
AD33
AD34
AD35
AE2
P3
P5
P7
P19
P20
P21
P30
P32
P34
P35
R2
H3
AL3
H5
AL5
D3
H7
AL7
D5
H9
AL9
D7
H11
H26
H28
H30
H32
H34
H35
J2
R3
AE3
AL11
AL13
AL15
AL22
AL24
AL26
AL28
AL30
AL32
AL34
AL35
AM2
AM3
AM4
AM6
AM8
AM10
AM12
AM14
AM16
AM17
AM20
AM21
AM23
AM25
AM27
AM29
AM31
AM33
AM34
AM35
AN2
D9
R4
AE5
D11
D13
D15
D17
D20
D22
D24
D26
D28
D30
D32
D34
D35
E2
R6
AE7
R31
R33
R34
R35
T2
AE30
AE32
AE34
AE35
AF2
AR4
AR5
J3
T3
T5
AF3
AR6
J4
AF4
AR7
J6
T20
T21
T22
T23
T32
T34
T35
U2
AF6
AR8
J8
AF8
AR9
J10
AF29
AF31
AF33
AF34
AF35
AG2
AG3
AG5
AG7
AG9
AG28
AG30
AG32
AG34
AG35
AH2
AH3
AH4
AH6
AH8
AH10
AH27
AH29
AH31
AH33
AH34
AH35
AJ2
AR10
AR11
AR12
AR13
AR14
AR15
AR16
AR17
AR18
AR19
AR20
AR21
AR22
AR23
AR24
AR25
AR26
AR27
AR28
AR29
AR30
AR31
AR32
AR33
AR34
J27
J29
J31
E3
J33
E4
J34
E6
J35
U3
E8
K2
U4
E10
E12
E14
E16
E17
E20
E21
E23
E25
E27
E29
E31
E33
E34
E35
F2
K3
U5
K5
U32
U33
U34
U35
W14
W15
Y2
K7
K9
K28
K30
K32
K34
K35
L2
Y3
Y4
L3
Y5
L4
Y14
Y15
Y32
Y33
Y34
Y35
AA2
AA3
AA5
AA14
AA15
AA32
AA34
AA35
AB2
AB3
AB4
AB6
L6
AN3
L8
AN5
L29
L31
L33
L34
L35
M2
M3
M5
M7
M30
M32
M34
M35
N2
AN7
AN9
F3
AN11
AN13
AN15
AN17
AN20
AN22
AN24
AN26
AN28
AN30
AN32
AN34
AN35
F5
F7
F9
F11
F13
F15
F22
F24
F26
F28
F30
F32
AJ3
AJ5
AJ7
AJ9
AJ11
AJ26
AJ28
AJ30
AJ32
N3
REV. A
–50–
AD14160/AD14160L
ORDERING GUIDE
Case Temperature Range
Part Number
Instruction Rate
Operating Voltage
AD14160BB-4*
AD14160/AD14160LBB-4*
AD14160KB-4
–40°C to +100°C
–40°C to +100°C
0°C to +85°C
40 MHz
40 MHz
40 MHz
40 MHz
5 V
3.3 V
5 V
AD14160/AD14160LKB-4
0°C to +85°C
3.3 V
NOTES
1. Part numbers marked with an * are shipping as x-grade (preproduction) material at the time of this printing.
2. These parts are packaged in a 452-lead Ceramic Ball Grid Array Package (CBGA).
3. Military and Industrial temperature SMD parts, in the same package are in development.
PACKAGE DIMENSIONS
Dimensions shown in inches and (mm).
452-Lead Ceramic Ball Grid Array (CBGA)
(QS-452)
1.862 (47.295)
SQ
1.838 (46.685)
SOLID COPPER BALL
SOLDER COATED
4 PLACES
1.795 (45.593)
1.785 (45.339)
SQ
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
TOP VIEW
8
7
6
PIN A1
INDEX
5
4
3
2
PIN A1
0.060 (1.524)
0.040 (1.016)
1
0.030 (0.762) x 45
°
0.015 (0.381) x 45
°
BOTTOM VIEW
1 PLACE
0.060 (1.524)
0.040 (1.016)
3 PLACES
0.110 (2.794)
0.090 (2.286)
0.170 (4.318)
MAX
0.200 (5.08)
MAX
0.024 (0.610)
TYP
0.033 (0.838)
TYP
0.055 (1.397)
0.045 (1.143)
REV. A
–51–
–52–
相关型号：
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