AD5663 [ADI]

串行16位DAC,电源电压2.7到5.5V;
AD5663
型号: AD5663
厂家: ADI    ADI
描述:

串行16位DAC,电源电压2.7到5.5V

文件: 总24页 (文件大小:726K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2.7 V to 5.5 V, 250 μA, Rail-to-Rail Output,  
Dual 16-Bit nanoDAC®  
AD5663  
FUNCTIONAL BLOCK DIAGRAM  
FEATURES  
V
V
DD  
REF  
Low power, dual 16-bit nanoDAC  
Relative accuracy: 12 LSBs maximum  
Guaranteed monotonic by design  
10-lead MSOP and 3 mm × 3 mm LFCSP_WD  
2.7 V to 5.5 V power supply  
LDAC  
INPUT  
DAC  
STRING  
DAC A  
V
V
A
B
SCLK  
SYNC  
DIN  
BUFFER  
BUFFER  
OUT  
OUT  
REGISTER  
REGISTER  
INTERFACE  
LOGIC  
INPUT  
REGISTER  
DAC  
REGISTER  
STRING  
DAC B  
Per channel power-down  
Power-on reset to zero scale or midscale  
AD5663  
LDAC  
CLR  
functions  
Hardware  
and  
POWER-ON  
RESET  
POWER-DOWN  
LOGIC  
Serial interface; up to 50 MHz  
LDAC CLR  
GND  
Figure 1.  
APPLICATIONS  
Process control  
Data acquisition systems  
Table 1. Related Devices  
Part No.  
Portable battery-powered instruments  
Digital gain and offset adjustment  
Programmable voltage and current sources  
Programmable attenuators  
Description  
AD5623R/AD5643R/AD5663R  
2.7 V to 5.5 V, dual 12-/14-/16-bit  
DACs with internal reference  
GENERAL DESCRIPTION  
PRODUCT HIGHLIGHTS  
1. Dual 16-bit DAC; relative accuracy of 12 ꢀSBs maximum.  
The AD5663, a member of the nanoDAC family, is a low power,  
dual, 16-bit buffered voltage-out DAC that operates from a single  
2.7 V to 5.5 V supply and is guaranteed monotonic by design.  
2. Available in 10-lead MSOP and 10-lead, 3 mm × 3 mm  
ꢀFCSP_WD packages.  
The AD5663 requires an external reference voltage to set the  
output range of the DAC. The part incorporates a power-on  
reset circuit that ensures the DAC output powers up to 0 V or  
midscale (AD5663-1) and remains there until a valid write takes  
place. The part contains a power-down feature that reduces the  
current consumption of the device to 480 nA at 5 V and provides  
software-selectable output loads while in power-down mode.  
3. ꢀow power; typically consumes 0.6 mW at 3 V and  
1.25 mW at 5 V.  
4. 7 μs maximum settling time.  
The low power consumption of this part in normal operation  
makes it ideally suited to portable, battery-operated equipment.  
The power consumption is 1.25 mW at 5 V, going down to  
2.4 μW in power-down mode.  
The on-chip precision output amplifier of the AD5663 allows  
rail-to-rail output swing to be achieved.  
The AD5663 uses a versatile, 3-wire serial interface that  
operates at clock rates up to 50 MHz and is compatible with  
standard SPI®, QSPI™, MICROWIRE™, and DSP interface  
standards.  
Rev. 0  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2006 Analog Devices, Inc. All rights reserved.  
 
AD5663  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Output Amplifier........................................................................ 14  
Serial Interface............................................................................ 14  
Input Shift Register .................................................................... 14  
Applications....................................................................................... 1  
Functional Block Diagram .............................................................. 1  
General Description......................................................................... 1  
Product Highlights ........................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
AC Characteristics........................................................................ 4  
Timing Characteristics ................................................................ 5  
Timing Diagram ........................................................................... 5  
Absolute Maximum Ratings............................................................ 6  
ESD Caution.................................................................................. 6  
Pin Configuration and Function Description .............................. 7  
Typical Performance Characteristics ............................................. 8  
Terminology .................................................................................... 12  
Theory of Operation ...................................................................... 14  
D/A Section................................................................................. 14  
Resistor String............................................................................. 14  
SYNC  
Interrupt .......................................................................... 15  
Power-On Reset.......................................................................... 15  
Software Reset............................................................................. 15  
Power-Down Modes .................................................................. 16  
ꢀDAC  
Function .......................................................................... 16  
Microprocessor Interfacing....................................................... 18  
Applications..................................................................................... 19  
Choosing a Reference for the AD5663.................................... 19  
Using a Reference as a Power Supply for the AD5663 .......... 19  
Bipolar Operation Using the AD5663..................................... 20  
Using the AD5663 with a Galvanically Isolated Interface .... 20  
Power Supply Bypassing and Grounding................................ 20  
Outline Dimensions....................................................................... 21  
Ordering Guide .......................................................................... 21  
REVISION HISTORY  
4/06—Revision 0: Initial Version  
Rev. 0 | Page 2 of 24  
 
AD5663  
SPECIFICATIONS  
VDD = 2.7 V to 5.5 V; R= 2 kΩ to GND; C= 200 pF to GND; VREF = VDD; all specifications TMIN to TMAX, unless otherwise noted.  
Table 2.  
A Grade1  
Min Typ  
B Grade1  
Max Min Typ  
Parameter  
STATIC PERFORMANCE2  
Max  
Unit  
Conditions/Comments  
AD5663  
Resolution  
16  
16  
Bits  
LSB  
LSB  
mV  
mV  
Relative Accuracy  
Differential Nonlinearity  
Zero-Scale Error  
Offset Error  
±±  
±16  
±1  
+10  
±10  
±6  
±12  
±1  
+10  
±10  
Guaranteed monotonic by design  
All 0s loaded to DAC register  
+2  
±1  
+2  
±1  
Full-Scale Error  
Gain Error  
Zero-Scale Error Drift3  
Gain Temperature Coefficient  
DC Power Supply Rejection Ratio  
DC Crosstalk  
−0.15 ±1  
±1.5  
±2  
±2.5  
−100  
10  
−0.15 ±1  
±1.5  
±2  
±2.5  
−100  
10  
% of FSR All 1s loaded to DAC register  
% of FSR  
μV/°C  
ppm  
dB  
Of FSR/°C  
DAC code = midscale, VDD ± 10%  
μV  
Due to full-scale output change  
R = 2 kΩ to GND or VDD  
L
10  
5
10  
5
μV/mA  
μV  
Due to load current change  
Due to powering down (per channel)  
OUTPUT CHARACTERISTICS2  
Output Voltage Range  
0
VDD  
0
VDD  
V
Capacitive Load Stability  
2
2
nF  
nF  
Ω
mA  
ꢀs  
RL = ∞  
RL = 2 kΩ  
10  
0.5  
30  
4
10  
0.5  
30  
4
DC Output Impedance  
Short-Circuit Current  
Power-Up Time  
VDD = 5 V  
Coming out of power-down mode;  
V
DD = 5 V  
REFERENCE INPUTS  
Reference Current  
Reference Input Range  
Reference Input Impedance  
LOGIC INPUTS3  
170  
26  
200  
VDD  
170  
26  
200  
VDD  
μA  
V
kΩ  
VREF = VDD = 5.5 V, 3.6 V  
0.75  
0.75  
Input Current  
±2  
0.±  
±2  
0.±  
μA  
V
V
pF  
pF  
All digital inputs  
VDD = 5 V, 3 V  
VDD = 5 V, 3 V  
DIN, SCLK, and SYNC  
LDAC and CLR  
VINL, Input Low Voltage  
VINH, Input High Voltage  
Pin Capacitance  
2
2
3
3
19  
19  
POWER REQUIREMENTS  
VDD  
2.7  
5.5  
2.7  
5.5  
V
IDD (Normal Mode)4  
VDD = 4.5 V to 5.5 V  
VDD = 2.7 V to 3.6 V  
IDD (All Power-Down  
Modes)5  
VIH = VDD and VIL = GND  
VIH = VDD, VIL = GND  
250  
200  
450  
425  
250  
200  
450  
425  
μA  
μA  
VDD = 4.5 V to 5.5 V  
VDD = 2.7 V to 3.6 V  
0.4±  
0.2  
1
1
0.4±  
0.2  
1
1
μA  
μA  
1 Temperature range: A grade and B grade are both equal to −40°C to +105°C.  
2 Linearty calculated using a reduced code range: AD5663 (Code 512 to Code 65024). Output unloaded.  
3 Guaranteed by design and characterization, not production tested.  
4 Interface inactive. All DACs active. DAC outputs unloaded.  
5 Both DACs powered down.  
Rev. 0 | Page 3 of 24  
 
 
 
 
AD5663  
AC CHARACTERISTICS  
VDD = 2.7 V to 5.5 V; R= 2 kΩ to GND; C= 200 pF to GND; VREF = VDD; all specifications TMIN to TMAX, unless otherwise noted.1  
Table 3.  
Parameter2  
Min  
Typ  
4
1.±  
10  
0.1  
−90  
0.1  
1
Max  
Unit  
μs  
V/μs  
nV-s  
nV-s  
dBs  
nV-s  
nV-s  
nV-s  
kHz  
Conditions/Comments  
Output Voltage Settling Time  
Slew Rate  
Digital-to-Analog Glitch Impulse  
Digital Feedthrough  
Reference Feedthrough  
Digital Crosstalk  
7
1/4 to 3/4 scale settling to ±2 LSB  
1 LSB change around major carry  
VREF = 2 V ± 0.1 V p-p, frequency 10 Hz to 20 MHz  
Analog Crosstalk  
DAC-to-DAC Crosstalk  
Multiplying Bandwidth  
Total Harmonic Distortion  
Output Noise Spectral Density  
1
340  
−±0  
120  
100  
15  
VREF = 2 V ± 0.1 V p-p  
dB  
VREF = 2 V ± 0.1 V p-p; frequency = 10 kHz  
DAC code = midscale, 1 kHz  
DAC code = midscale, 10 kHz  
0.1 Hz to 10 Hz  
nV/√Hz  
nV/√Hz  
μV p-p  
Output Noise  
1 Guaranteed by design and characterization, not production tested.  
2 See the Terminology section.  
Rev. 0 | Page 4 of 24  
 
AD5663  
TIMING CHARACTERISTICS  
All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIꢀ + VIH)/2.  
V
DD = 2.7 V to 5.5 V; all specifications TMIN to TMAX, unless otherwise noted.1  
Table 4.  
Limit at TMIN, TMAX  
VDD = 2.7 V to 5.5 V  
Parameter  
Unit  
Conditions/Comments  
2
t1  
20  
ns min  
SCLK cycle time  
t2  
t3  
t4  
t5  
t6  
t7  
t±  
t9  
t10  
9
9
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
SCLK high time  
SCLK low time  
SYNC to SCLK falling edge setup time  
Data setup time  
Data hold time  
SCLK falling edge to SYNC rising edge  
Minimum SYNC high time  
SYNC rising edge to SCLK fall ignore  
SCLK falling edge to SYNC fall ignore  
13  
5
5
0
15  
13  
0
LDAC pulse width low  
t11  
t12  
t13  
t14  
t15  
10  
15  
5
ns min  
ns min  
ns min  
ns min  
ns max  
SCLK falling edge to LDAC rising edge  
CLR pulse width low  
SCLK falling edge to LDAC falling edge  
CLR pulse activation time  
0
300  
1 Guaranteed by design and characterization; not production tested.  
2 Maximum SCLK frequency is 50 MHz at VDD = 2.7 V to 5.5 V.  
TIMING DIAGRAM  
t10  
t1  
t9  
SCLK  
t2  
t8  
t3  
t4  
t7  
SYNC  
t6  
t5  
DIN  
1
DB23  
DB0  
t14  
t11  
LDAC  
t12  
2
LDAC  
t13  
CLR  
t15  
V
OUT  
1
2
ASYNCHRONOUS LDAC UPDATE MODE.  
SYNCHRONOUS LDAC UPDATE MODE.  
Figure 2. Serial Write Operation  
Rev. 0 | Page 5 of 24  
 
 
AD5663  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Table 5.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
VDD to GND  
−0.3 V to +7 V  
VOUT to GND  
VREF to GND  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
Digital Input Voltage to GND  
Operating Temperature Range  
Industrial  
Storage Temperature Range  
Junction Temperature (TJ max)  
Power Dissipation  
−40°C to +105°C  
−65°C to +150°C  
150°C  
(TJ max − TA)/θJA  
LFCSP_WD Package (4-Layer Board)  
θJA Thermal Impedance  
MSOP Package (4-Layer Board)  
θJA Thermal Impedance  
θJC Thermal Impedance  
Reflow Soldering Peak Temperature  
Pb-Free  
61°C/W  
142°C/W  
43.7°C/W  
260(+0/−5)°C  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. 0 | Page 6 of 24  
 
AD5663  
PIN CONFIGURATION AND FUNCTION DESCRIPTION  
1
2
3
4
5
10  
9
V
V
A
B
V
V
OUT  
REF  
DD  
OUT  
AD5663  
TOP VIEW  
(Not to Scale)  
8
GND  
DIN  
7
LDAC  
CLR  
SCLK  
SYNC  
6
Figure 3. Pin Configuration  
Table 6. Pin Function Descriptions  
Pin No. Mnemonic Description  
1
2
3
4
VOUT  
VOUT  
GND  
LDAC  
A
B
Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.  
Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.  
Ground Reference Point for All Circuitry on the Part.  
Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new data.  
This allows simultaneous update of all DAC outputs. Alternatively, this pin can be tied permanently low.  
5
CLR  
Asynchronous Clear Input. The CLR input is falling edge sensitive. While CLR is low, all LDAC pulses are ignored.  
When CLR is activated, zero scale is loaded to all input and DAC registers. This clears the output to 0 V. The part  
exits clear code mode on the 24th falling edge of the next write to the part. If CLR is activated during a write  
sequence, the write is aborted.  
6
SYNC  
Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low,  
it powers on the SCLK and DIN buffers and enables the input shift register. Data is transferred in on the falling  
edges of the next 24 clocks. If SYNC is taken high before the 24th falling edge, the rising edge of SYNC acts as an  
interrupt, and the write sequence is ignored by the device.  
7
SCLK  
DIN  
VDD  
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input.  
Data can be transferred at rates up to 50 MHz.  
Serial Data Input. This device has a 24-bit shift register. Data is clocked into the register on the falling edge  
of the serial clock input.  
Power Supply Input. These parts can be operated from 2.7 V to 5.5 V, and the supply should be decoupled with a  
10 μF capacitor in parallel with a 0.1 μF capacitor to GND.  
±
9
10  
VREF  
Reference Voltage Input.  
Rev. 0 | Page 7 of 24  
 
AD5663  
TYPICAL PERFORMANCE CHARACTERISTICS  
10  
8
10  
MAX INL  
V
= V = 5V  
REF  
DD  
= 25°C  
8
T
A
6
V
= 5V  
DD  
= 25°C  
6
4
2
4
T
A
2
MAX DNL  
MIN DNL  
0
0
–2  
–4  
–2  
–4  
–6  
MIN INL  
4.25  
–6  
–8  
–8  
–10  
0.75  
1.25  
1.75  
2.25  
2.75  
3.25  
(V)  
3.75  
4.75  
–10  
V
REF  
0
5k 10k 15k 20k 25k 30k 35k 40k 45k 50k 55k 60k 65k  
CODE  
Figure 4. INL  
Figure 7. INL and DNL Error vs. VREF  
8
6
1.0  
0.8  
0.6  
0.4  
0.2  
MAX INL  
V
T
= V  
REF  
= 5V  
DD  
= 25°C  
A
T
A
= 25°C  
4
2
MAX DNL  
MIN DNL  
0
0
–2  
–4  
–6  
–8  
–0.2  
–0.4  
–0.6  
MIN INL  
–0.8  
–1.0  
2.7  
3.2  
3.7  
4.2  
(V)  
4.7  
5.2  
V
DD  
0
10k  
20k  
30k  
CODE  
40k  
50k  
60k  
Figure 5. DNL  
Figure 8. INL and DNL Error vs. Supply  
8
6
0
–0.02  
–0.04  
–0.06  
–0.08  
V
= 5V  
DD  
MAX INL  
V
= V = 5V  
REF  
DD  
4
2
GAIN ERROR  
MAX DNL  
MIN DNL  
0
–0.10  
–0.12  
–2  
–4  
–6  
–8  
–0.14  
–0.16  
FULL-SCALE ERROR  
MIN INL  
100  
–0.18  
–0.20  
–40  
–20  
0
20  
40  
60  
80  
120  
–40  
–20  
0
20  
40  
60  
80  
100  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 9. Gain Error and Full-Scale Error vs. Temperature  
Figure 6. INL Error and DNL Error vs. Temperature  
Rev. 0 | Page ± of 24  
 
 
 
 
AD5663  
1.5  
1.0  
V
= 5.5V  
DD  
= 25°C  
T
A
8
6
4
2
0
ZERO-SCALE ERROR  
0.5  
0
–0.5  
–1.0  
–1.5  
–2.0  
–2.5  
OFFSET ERROR  
0.230  
0.235  
0.240  
0.245  
0.250  
0.255  
–40  
–20  
0
20  
40  
60  
80  
100  
I
(mA)  
DD  
TEMPERATURE (°C)  
Figure 10. Zero-Scale and Offset Error vs. Temperature  
Figure 13. IDD Histogram with VDD = 5.5 V  
0.20  
1.0  
DAC LOADED WITH  
ZERO SCALE –  
SINKING CURRENT  
V
T
= V  
REF  
= 5V, 3V  
DD  
= 25°C  
0.15  
0.10  
0.05  
A
0.5  
0
GAIN ERROR  
0
–0.05  
–0.10  
–0.15  
FULL-SCALE ERROR  
–0.5  
–1.0  
DAC LOADED WITH  
FULL SCALE –  
SOURCING CURRENT  
–1.5  
–2.0  
–0.20  
–0.25  
–5  
–4  
–3  
–2  
–1  
0
1
2
3
4
5
2.7  
3.2  
3.7  
4.2  
(V)  
4.7  
5.2  
I (mA)  
V
DD  
Figure 14. Headroom at Rails vs. Source and Sink Current  
Figure 11. Gain Error and Full-Scale Error vs. Supply  
0.30  
1.0  
T
= 25°C  
T
= 25°C  
A
A
V
= V  
= 5V  
= 3V  
DD  
DD  
REFIN  
REFIN  
0.25  
0.20  
0.15  
0.10  
0.5  
0
ZERO-SCALE ERROR  
V
= V  
–0.5  
–1.0  
–1.5  
0.05  
0
–2.0  
–2.5  
OFFSET ERROR  
–40  
–20  
0
20  
40  
60  
80  
100  
2.7  
3.2  
3.7  
4.2  
(V)  
4.7  
5.2  
TEMPERATURE (°C)  
V
DD  
Figure 12. Zero-Scale and Offset Error vs. Supply  
Figure 15. Supply Current vs. Temperature  
Rev. 0 | Page 9 of 24  
 
 
AD5663  
2.538  
2.537  
2.536  
2.535  
2.534  
2.533  
2.532  
2.531  
2.530  
2.529  
2.528  
2.527  
2.526  
2.525  
2.524  
2.523  
2.522  
2.521  
V
= V = 5V  
REF  
DD  
= 25°C  
T
A
5ns/SAMPLE NUMBER  
GLITCH IMPULSE = 9.494nV  
1LSB CHANGE AROUND  
MIDSCALE (0x8000 TO 0x7FFF)  
V
= V = 5V  
REF  
DD  
= 25°C  
T
A
FULL-SCALE CODE CHANGE  
0x0000 TO 0xFFFF  
OUTPUT LOADED WITH 2k  
AND 200pF TO GND  
V
= 909mV/DIV  
OUT  
1
0
50  
100 150 200 250 300 350 400 450  
SAMPLE NUMBER  
512  
TIME BASE = 4µs/DIV  
Figure 19. Digital-to-Analog Glitch Impulse (Negative)  
Figure 16. Full-Scale Settling Time, 5 V  
2.498  
2.497  
2.496  
2.495  
2.494  
2.493  
2.492  
2.491  
V
T
= V = 5V  
REF  
DD  
= 25°C  
V
T
= V = 5V  
REF  
A
DD  
= 25°C  
5ns/SAMPLE NUMBER  
ANALOG CROSSTALK = 0.424nV  
A
V
DD  
1
2
MAX(C2)*  
420.0mV  
V
OUT  
CH2 500mV  
0
50  
100 150 200 250 300 350 400 450  
SAMPLE NUMBER  
512  
CH1 2.0V  
M100µs 125MS/s  
A CH1 1.28V  
8.0ns/pt  
Figure 17. Power-On Reset to 0 V  
Figure 20. Analog Crosstalk  
–20  
–30  
–40  
V
= 5V  
DD  
= 25°C  
SYNC  
SLCK  
T
A
DAC LOADED WITH FULL SCALE  
= 2V ± 0.3V p-p  
V
REF  
1
3
–50  
–60  
–70  
–80  
V
OUT  
V
= 5V  
DD  
–90  
2
–100  
2k  
4k  
6k  
8k  
10k  
CH1 5.0V  
CH3 5.0V  
CH2 500mV  
M400ns  
A CH1  
1.4V  
FREQUENCY (Hz)  
Figure 18. Exiting Power-Down to Midscale  
Figure 21. Total Harmonic Distortion  
Rev. 0 | Page 10 of 24  
 
 
AD5663  
16  
14  
12  
10  
8
5
0
V
= 5V  
DD  
= 25°C  
V
T
= V  
DD  
REF  
= 25°C  
T
A
A
5  
V
= 3V  
DD  
10  
15  
20  
25  
30  
35  
–40  
V
DD  
= 5V  
6
4
0
1
2
3
4
5
6
7
8
9
10  
10k  
100k  
FREQUENCY (Hz)  
1M  
10M  
CAPACITANCE (nF)  
Figure 22. Settling Time vs. Capacitive Load  
Figure 25. Multiplying Bandwidth  
V
= V = 5V  
REF  
DD  
= 25°C  
T
CLR  
A
3
DAC LOADED WITH MIDSCALE  
V
A
OUT  
1
V
B
OUT  
4
2
Y AXIS = 2µV/DIV  
X AXIS = 4s/DIV  
CH2 1.0V  
CH4 1.0V  
M200ns A CH3  
1.10V  
CH3 5.0V  
Figure 23. 0.1 Hz to 10 Hz Output Noise Plot  
CLR  
Pulse Activation Time  
Figure 26.  
800  
700  
600  
500  
400  
300  
V
= V = 5V  
REF  
DD  
= 25°C  
T
A
200  
100  
0
10  
100  
1k  
10k  
100k  
1M  
FREQUENCY (Hz)  
Figure 24. Noise Spectral Density  
Rev. 0 | Page 11 of 24  
 
AD5663  
TERMINOLOGY  
Output Voltage Settling Time  
Relative Accuracy or Integral Nonlinearity (INL)  
Output voltage settling time is the amount of time it takes for the  
output of a DAC to settle to a specified level for a 1/4 to 3/4 full-  
scale input change and is measured from the 24th falling edge of  
SCꢀK.  
For the DAC, relative accuracy or integral nonlinearity is a  
measurement of the maximum deviation, in ꢀSBs, from a  
straight line passing through the endpoints of the DAC transfer  
function. A typical INꢀ vs. code plot is shown in Figure 4.  
Digital-to-Analog Glitch Impulse  
Differential Nonlinearity (DNL)  
Digital-to-analog glitch impulse is the impulse injected into the  
analog output when the input code in the DAC register changes  
state. It is normally specified as the area of the glitch in nV-s,  
and is measured when the digital input code is changed by  
1 ꢀSB at the major carry transition (0x7FFF to 0x8000). See  
Figure 19.  
Differential nonlinearity is the difference between the measured  
change and the ideal 1 ꢀSB change between any two adjacent  
codes. A specified differential nonlinearity of 1 ꢀSB maximum  
ensures monotonicity. This DAC is guaranteed monotonic by  
design. A typical DNꢀ vs. code plot is shown in Figure 5.  
Zero-Scale Error  
Digital Feedthrough  
Zero-scale error is a measurement of the output error when  
zero code (0x0000) is loaded to the DAC register. Ideally, the  
output should be 0 V. The zero-scale error is always positive in  
the AD5663 because the output of the DAC cannot go below  
0 V. It is due to a combination of the offset errors in the DAC  
and the output amplifier. Zero-scale error is expressed in mV.  
A plot of zero-scale error vs. temperature is shown in Figure 10.  
Digital feedthrough is a measure of the impulse injected into  
the analog output of the DAC from the digital inputs of the  
DAC, but it is measured when the DAC output is not updated.  
It is specified in nV-s and measured with a full-scale code change  
on the data bus, that is, from all 0s to all 1s and vice versa.  
Total Harmonic Distortion (THD)  
Total harmonic distortion is the difference between an ideal  
sine wave and its attenuated version using the DAC. The sine  
wave is used as the reference for the DAC, and the THD is a  
measurement of the harmonics present on the DAC output.  
It is measured in dB.  
Full-Scale Error  
Full-scale error is a measurement of the output error when full-  
scale code (0xFFFF) is loaded to the DAC register. Ideally, the  
output should be VDD 1 ꢀSB. Full-scale error is expressed in  
percent of full-scale range. A plot of full-scale error vs. tempera-  
ture is shown in Figure 9.  
Noise Spectral Density  
Noise spectral density is a measurement of the internally  
generated random noise. Random noise is characterized as a  
spectral density (voltage per √Hz). It is measured by loading the  
DAC to midscale and measuring noise at the output. It is  
measured in nV/√Hz. Figure 24 shows a plot of noise spectral  
density.  
Gain Error  
Gain error is a measure of the span error of the DAC. It is the  
deviation in slope of the DAC transfer characteristic from ideal  
expressed as a percent of the full-scale range.  
Zero-Scale Error Drift  
Zero-scale error drift is a measurement of the change in zero-  
scale error with a change in temperature. It is expressed in μV/°C.  
DC Crosstalk  
DC crosstalk is the dc change in the output level of one DAC in  
response to a change in the output of another DAC. It is measured  
with a full-scale output change on one DAC (or soft power-down  
and power-up) while monitoring another DAC kept at midscale.  
It is expressed in ꢁV.  
Gain Temperature Coefficient  
Gain temperature coefficient is a measurement of the change in  
gain error with changes in temperature. It is expressed in (ppm  
of full-scale range)/°C.  
DC crosstalk due to load current change is a measure of the  
impact that a change in load current on one DAC has to another  
DAC kept at midscale. It is expressed in ꢁV/mA.  
Offset Error  
Offset error is a measure of the difference between VOUT (actual)  
and VOUT (ideal) expressed in mV in the linear region of the trans-  
fer function. Offset error is measured on the AD5663 with  
Code 512 loaded in the DAC register. It can be negative or  
positive.  
Digital Crosstalk  
Digital crosstalk is the glitch impulse transferred to the output  
of one DAC at midscale in response to a full-scale code change  
(all 0s to all 1s and vice versa) in the input register of another  
DAC. It is measured in standalone mode and is expressed  
in nV-s.  
DC Power Supply Rejection Ratio (PSRR)  
PSRR indicates how the output of the DAC is affected by changes  
in the supply voltage. PSRR is the ratio of the change in VOUT to  
a change in VDD for full-scale output of the DAC. It is measured  
in dB. VREF is held at 2 V, and VDD is varied by 10%.  
Rev. 0 | Page 12 of 24  
 
AD5663  
Analog Crosstalk  
Multiplying Bandwidth  
Analog crosstalk is the glitch impulse transferred to the output  
of one DAC due to a change in the output of another DAC. It is  
measured by loading one of the input registers with a full-scale  
code change (all 0s to all 1s and vice versa) while keeping  
The amplifiers within the DAC have a finite bandwidth. The  
multiplying bandwidth is a measure of this. A sine wave on the  
reference (with full-scale code loaded to the DAC) appears on  
the output. The multiplying bandwidth is the frequency at  
which the output amplitude falls to 3 dB below the input.  
ꢀDAC  
ꢀDAC  
high. Then pulse  
low and monitor the output of  
the DAC whose digital code was not changed. The area of the  
glitch is expressed in nV-s.  
DAC-to-DAC Crosstalk  
DAC-to-DAC crosstalk is the glitch impulse transferred to the  
output of one DAC due to a digital code change and subsequent  
output change of another DAC. This includes both digital and  
analog crosstalk. It is measured by loading one of the DACs  
with a full-scale code change (all 0s to all 1s and vice versa) with  
ꢀDAC  
low and monitoring the output of another DAC. The  
energy of the glitch is expressed in nV-s.  
Rev. 0 | Page 13 of 24  
AD5663  
THEORY OF OPERATION  
D/A SECTION  
OUTPUT AMPLIFIER  
The AD5663 DAC is fabricated on a CMOS process. The  
architecture consists of a string DAC followed by an output  
buffer amplifier. Figure 27 shows a block diagram of the DAC  
architecture.  
The output buffer amplifier can generate rail-to-rail voltages on  
its output, which gives an output range of 0 V to VDD. It can drive  
a load of 2 kꢂ in parallel with 1000 pF to GND.  
The source and sink capabilities of the output amplifier can be  
seen in Figure 14. The slew rate is 1.8 V/μs with a 1/4 to 3/4  
full-scale settling time of 10 μs.  
V
DD  
OUTPUT  
AMPLIFIER  
(GAIN = +2)  
REF (+)  
DAC  
REGISTER  
RESISTOR  
STRING  
V
OUT  
SERIAL INTERFACE  
REF (–)  
SYNC  
The AD5663 has a 3-wire serial interface (  
, SCꢀK, and  
DIN) that is compatible with SPI, QSPI, and MICROWIRE  
interface standards, as well as with most DSPs. See Figure 2 for  
a timing diagram of a typical write sequence.  
GND  
Figure 27. DAC Architecture  
Because the input coding to the DAC is straight binary, the ideal  
output voltage is given by  
SYNC  
The write sequence begins by bringing the  
line low. Data  
from the DIN line is clocked into the 24-bit shift register on the  
falling edge of SCꢀK. The serial clock frequency can be as high  
as 50 MHz, making the AD5663 compatible with high speed  
DSPs. On the 24th falling clock edge, the last data bit is clocked  
in and the programmed function is executed; that is, there is a  
change in DAC register contents and/or a change in the mode  
D
65,536  
VOUT =VREF  
×
where D is the decimal equivalent of the binary code that is  
loaded to the DAC register. It can range from 0 to 65,535.  
SYNC  
of operation. At this stage, the  
line can be kept low or be  
RESISTOR STRING  
brought high. In either case, it must be brought high for a mini-  
mum of 15 ns before the next write sequence so that a falling edge  
The resistor string section is shown in Figure 28. It is a string of  
resistors, each of Value R. The code loaded to the DAC register  
determines at which node on the string the voltage is tapped off  
to be fed into the output amplifier. The voltage is tapped off by  
closing one of the switches connecting the string to the amplifier.  
Because it is a string of resistors, it is guaranteed monotonic.  
SYNC  
SYNC  
of  
buffer draws more current when VIN = 2.0 V than it does when  
SYNC  
can initiate the next write sequence. Because the  
VIN = 0.10 V,  
should be idled low between write sequences  
for even lower power operation. As mentioned previously,  
however, it must be brought high again just before the next  
write sequence.  
R
INPUT SHIFT REGISTER  
R
The input shift register is 24 bits wide (see Figure 29). The first  
two bits are don’t cares. The next three are the Command Bit C2  
to Command Bit C0 (see Table 7), followed by the 3-bit DAC  
Address A2 to DAC Address A0 (see Table 8), and, finally, the  
16-bit data-word. These are transferred to the DAC register on  
the 24th falling edge of SCꢀK.  
TO OUTPUT  
R
AMPLIFIER  
Table 7. Command Definition  
R
R
C2  
C1  
C0  
Command  
0
0
0
0
0
1
Write to input register n  
Update DAC register n  
0
1
0
Write to input register n, update all  
(software LDAC)  
0
1
1
1
1
1
0
0
1
1
1
0
1
0
1
Write to and update DAC channel n  
Power down DAC (power up)  
Reset  
LDAC register setup  
Reserved  
Figure 28. Resistor String  
Rev. 0 | Page 14 of 24  
 
 
 
 
AD5663  
Table 8. Address Command  
SOFTWARE RESET  
A2  
A1  
A0  
ADDRESS (n)  
DAC A  
DAC B  
The AD5663 contains a software reset function. Command 101  
is reserved for the software reset function (see Table 7). The  
software reset command contains two reset modes that are  
software-programmable by setting Bit DB0 in the control  
register.  
0
0
0
0
0
1
0
1
0
Reserved  
Reserved  
All DACs  
0
1
1
1
1
1
Table 9 shows how the state of the bit corresponds to the mode  
of operation of the device. Table 10 shows the contents of the  
input shift register during the software reset mode of operation.  
SYNC INTERRUPT  
SYNC  
In a normal write sequence, the  
least 24 falling edges of SCꢀK, and the DAC is updated on the  
SYNC  
line is kept low for at  
Table 9. Software Reset Modes for the AD5663  
24th falling edge. However, if  
is brought high before the  
DB0  
Registers Reset to 0  
24th falling edge, this acts as an interrupt to the write sequence.  
The shift register is reset and the write sequence is seen as  
invalid. Neither an update of the DAC register contents nor a  
change in the operating mode occurs (see Figure 30).  
0
DAC register  
Input register  
DAC register  
Input register  
1 (Power-On Reset)  
LDAC register  
POWER-ON RESET  
Power-down register  
The AD5663 family contains a power-on reset circuit that  
controls the output voltage during power-up. The AD5663 DAC  
outputs power up to 0 V, the AD5663-1 powers up to midscale,  
and the output remains there until a valid write sequence is  
made to the DAC. This is useful in applications where it is  
important to know the state of the output of the DAC while it is  
ꢀDAC CꢀR  
in the process of powering up. Any events on  
during power-on reset are ignored.  
or  
Table 10. 24-Bit Input Shift Register Contents for Software Reset Command  
MSB  
LSB  
DB23 to DB22  
DB21  
DB20  
DB19  
DB18  
DB17  
DB16  
DB15 to DB1  
DB0  
x
1
0
1
x
x
x
x
1/0  
Don’t care  
Command bits (C2 to C0)  
Address bits (A2 to A0)  
Don’t care  
Determines software reset mode  
DB23 (MSB)  
DB0 (LSB)  
X
X
C2  
C1  
C0  
A2  
A1  
A0 D15 D14 D13 D12 D11 D10 D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
DATA BITS  
COMMAND BITS ADDRESS BITS  
Figure 29. Input Register Contents  
SCLK  
SYNC  
DIN  
DB23  
DB0  
DB23  
DB0  
INVALID WRITE SEQUENCE:  
SYNC HIGH BEFORE 24 FALLING EDGE  
VALID WRITE SEQUENCE, OUTPUT UPDATES  
TH  
TH  
ON THE 24 FALLING EDGE  
SYNC  
Figure 30.  
Interrupt Facility  
Rev. 0 | Page 15 of 24  
 
 
 
 
 
 
AD5663  
The time required to exit power-down is typically 4 μs for  
DD = 5 V and for VDD = 3 V (see Figure 18).  
Table 11. Power-Down Modes of Operation for the AD5663  
POWER-DOWN MODES  
V
The AD5663 contains four separate modes of operation.  
Command 100 is reserved for the power-down function  
(see Table 7). These modes are software-programmable by  
setting Bit DB5 and Bit DB4 in the control register. Table 11  
shows how the state of the bits corresponds to the mode of  
operation of the device. Any or all DACs (DAC B and DAC A)  
can be powered down to the selected mode by setting the  
corresponding two bits (Bit DB1 and Bit DB0) to 1. By  
executing the same Command 100, any combination of DACs  
can be powered up by setting Bit DB5 and Bit DB4 to normal  
operation mode. Again, to select which combination of DAC  
channels to power up, set the corresponding two bits (Bit DB1  
and Bit DB0) to 1. See Table 12 for contents of the input shift  
register during power-down/power-up operation.  
DB5  
DB4  
Operating Mode  
Normal operation  
Power-Down Modes  
1 kΩ to GND  
100 kΩ to GND  
Three-state  
0
0
0
1
1
1
0
1
LDAC FUNCTION  
The AD5663 DAC has double-buffered interfaces consisting of  
two banks of registers: input registers and DAC registers. The  
input registers are connected directly to the input shift register  
and the digital code is transferred to the relevant input register  
on completion of a valid write sequence. The DAC registers  
contain the digital code used by the resistor strings.  
The DAC output powers up to the value in the input register  
ꢀDAC  
ꢀDAC  
while  
is low. If  
is high, the DAC output powers up  
to the value held in the DAC register before power-down.  
ꢀDAC  
Access to the DAC registers is controlled by the  
pin.  
pin is high, the DAC registers are latched and  
the input registers can change state without affecting the  
ꢀDAC  
When both bits are set to 0, the part works normally with its  
normal power consumption of 500 μA at 5 V. However, for the  
three power-down modes, the supply current falls to 480 nA at  
5 V (100 nA at 3 V). Not only does the supply current fall, but  
the output stage is also internally switched from the output of  
the amplifier to a resistor network of known values. This has the  
advantage that the output impedance of the part is known while  
the part is in power-down mode. The outputs can either be  
connected internally to GND through a 1 kΩ or 100 kΩ register  
or left open-circuited (three-state) (see Figure 31).  
ꢀDAC  
When the  
contents of the DAC registers. When  
is brought low,  
however, the DAC registers become transparent and the  
contents of the input registers are transferred to them. The  
double-buffered interface is useful if the user requires  
simultaneous updating of all DAC outputs. The user can write  
to one of the input registers individually and then, by bringing  
ꢀDAC  
low when writing to the other DAC input register, all  
outputs update simultaneously.  
These parts each contain an extra feature whereby a DAC  
register is not updated unless its input register has been  
RESISTOR  
STRING DAC  
AMPLIFIER  
V
OUT  
ꢀDAC  
updated since the last time  
was brought low. Normally,  
ꢀDAC  
when  
is brought low, the DAC registers are filled with  
the contents of the input registers. In the case of the AD5663,  
the DAC register updates only if the input register has changed  
since the last time the DAC register was updated, thereby  
removing unnecessary digital crosstalk.  
POWER-DOWN  
CIRCUITRY  
RESISTOR  
NETWORK  
Figure 31. Output Stage During Power-Down  
The outputs of all DACs can be updated simultaneously using  
The bias generator, the output amplifier, the resistor string, and  
other associated linear circuitry are shut down when power-  
down mode is activated. However, the contents of the DAC  
register are unaffected when in power-down.  
ꢀDAC  
the hardware  
pin.  
Table 12. 24-Bit Input Shift Register Contents of Power-Up/Power-Down Function  
MSB  
LSB  
DB23 to  
DB22  
DB15 to  
DB6  
DB21  
DB20  
DB19  
DB18 DB17 DB16  
DB5  
DB4 DB3  
PD0  
DB2 DB1  
DAC B  
DB0  
x
1
0
0
x
x
x
x
PD1  
x
x
DAC A  
Don’t  
care  
Command bits (C2 to C0)  
Address bits (A2 to A0);  
don’t care  
Don’t  
care  
Power-down  
mode  
Don’t care  
Power down/Power up  
channel selection;  
set bit to 1 to select  
channel  
Rev. 0 | Page 16 of 24  
 
 
 
 
AD5663  
This flexibility is useful in applications where the user wants to  
simultaneously update select channels while the rest of the  
channels are synchronously updating  
LDAC  
Synchronous  
: The DAC registers are updated after new  
data is read in on the falling edge of the 24th SCꢀK pulse.  
ꢀDAC  
can be permanently low or pulsed, as shown in Figure 2.  
ꢀDAC  
Writing to the DAC using Command 110 loads the 2-bit  
register [DB1:DB0]. The default for each channel is 0; that is,  
ꢀDAC  
LDAC  
Asynchronous  
: The outputs are not updated at the same  
ꢀDAC  
time that the input registers are written to. When  
low, the DAC registers are updated with the contents of the  
input register.  
goes  
the  
DAC register is updated regardless of the state of the  
See Table 14 for contents of the input shift register during the  
pin works normally. Setting the bits to 1 means the  
ꢀDAC  
pin.  
ꢀDAC  
register setup command.  
ꢀDAC  
The  
over the hardware  
select which combination of channels to simultaneously update  
register gives the user full flexibility and control  
ꢀDAC  
pin. This register allows the user to  
LDAC  
Table 13.  
LDAC Bits  
(DB1 to DB0)  
Register Mode of Operation  
ꢀDAC  
ꢀDAC  
when the hardware  
register to 0 for a DAC channel means that the update of this  
channel is controlled by the  
channel synchronously updates; that is, the DAC register is  
updated after new data is read in, regardless of the state of the  
pin is executed. Setting the  
bit  
LDAC Pin  
LDAC Operation  
0
1/0  
Determined by LDAC pin  
ꢀDAC  
pin. If this bit is set to 1, this  
1
x = don’t care  
The DAC registers are updated  
after new data is read in on the  
falling edge of the 24th SCLK  
pulse  
ꢀDAC  
ꢀDAC  
pin. It effectively sees the  
pin as being pulled low.  
ꢀDAC  
See Table 13 for the  
register mode of operation.  
LDAC  
Table 14. 24-Bit Input Shift Register Contents for  
Register Setup Command  
MSB  
LSB  
DB23 to DB22  
DB21  
DB20 DB19  
DB18  
DB17  
DB16  
DB15 to DB2  
DB1  
DB0  
x
1
1
0
x
x
x
x
DAC B  
DAC A  
Set DAC to 0 or 1 for required mode of  
operation  
Don’t care  
Command bits (C2 to C0)  
Address bits (A3 to A0);  
Don’t care  
Don’t care  
Rev. 0 | Page 17 of 24  
 
 
AD5663  
AD56631  
SYNC  
1
68HC11/68L11  
MICROPROCESSOR INTERFACING  
AD5663 to Blackfin® ADSP BF53x Interface  
PC7  
SCK  
SCLK  
Figure 32 shows a serial interface between the AD5663 and the  
Blackfin ADSP-BF53x microprocessor. The ADSP-BF53x processor  
family incorporates two dual-channel synchronous serial ports,  
SPORT1 and SPORT0, for serial and multiprocessor  
communications. Using SPORT0 to connect to the AD5663, the  
setup for the interface is as follows:  
MOSI  
DIN  
1
ADDITIONAL PINS OMITTED FOR CLARITY.  
Figure 33. AD5663 to 68HC11/68L11 Interface  
AD5663 to 80C51/80L51 Interface  
DT0PRI drives the DIN pin of the AD5663.  
TSCꢀK0 drives the SCꢀK of the part.  
Figure 34 shows a serial interface between the AD5663 and the  
80C51/80ꢀ51 microcontroller. The setup for the interface is as  
follows:  
SYNC  
The  
pin is driven from TFS0.  
TxD of the 80C51/80ꢀ51 drives SCꢀK of the AD5663.  
RxD drives the serial data line of the part.  
1
ADSP-BF53x  
AD56631  
TFS0  
SYNC  
SYNC  
The  
signal is again derived from a bit-programmable pin  
DTOPRI  
TSCLK0  
DIN  
on the port. In this case, Port ꢀine P3.3 is used. When data is to be  
transmitted to the AD5663, P3.3 is taken low. The 80C51/80ꢀ51  
transmits data in 10-bit bytes only; thus only eight falling clock  
edges occur in the transmit cycle. To load data to the DAC, P3.3  
is left low after the first eight bits are transmitted, and a second  
write cycle is initiated to transmit the second byte of data. P3.3  
is taken high following the completion of this cycle. The 80C51/  
80ꢀ51 outputs the serial data in a format that has the ꢀSB first.  
The AD5663 must receive data with the MSB first. The 80C51/  
80ꢀ51 transmit routine should take this into account.  
SCLK  
1
ADDITIONAL PINS OMITTED FOR CLARITY.  
Figure 32. AD5663 to Blackfin ADSP-BF53x Interface  
AD5663 to 68HC11/68L11 Interface  
Figure 33 shows a serial interface between the AD5663 and the  
68HC11/68ꢀ11 microcontroller. SCK of the 68HC11/68ꢀ11  
drives the SCꢀK of the AD5663, and the MOSI output drives  
the serial data line of the DAC.  
1
80C51/80L51  
AD56631  
SYNC  
SYNC  
The  
signal is derived from a port line (PC7). The setup  
P3.3  
TxD  
RxD  
conditions for correct operation of this interface are as follows:  
SCLK  
The 68HC11/68ꢀ11 is configured with its CPOꢀ bit as 0.  
The 68HC11/68ꢀ11 is configured with its CPHA bit as 1.  
DIN  
1
ADDITIONAL PINS OMITTED FOR CLARITY.  
SYNC  
When data is being transmitted to the DAC, the  
line is  
Figure 34. AD5663 to 80C51/80L51 Interface  
taken low (PC7). When the 68HC11/68ꢀ11 is configured as  
previously described, data appearing on the MOSI output is  
valid on the falling edge of SCK. Serial data from the  
68HC11/68ꢀ11 is transmitted in 10-bit bytes with only eight  
falling clock edges occurring in the transmit cycle. Data is  
transmitted MSB first. To load data to the AD5663, PC7 is left  
low after the first eight bits are transferred, and a second serial  
write operation is performed to the DAC. PC7 is taken high at  
the end of this procedure.  
AD5663 to MICROWIRE Interface  
Figure 35 shows an interface between the AD5663 and any  
MICROWIRE-compatible device. Serial data is shifted out on  
the falling edge of the serial clock and is clocked into the AD5663  
on the rising edge of the SK.  
MICROWIRE  
AD56631  
SYNC  
1
CS  
SK  
SO  
SCLK  
DIN  
1
ADDITIONAL PINS OMITTED FOR CLARITY.  
Figure 35. AD5663 to MICROWIRE Interface  
Rev. 0 | Page 1± of 24  
 
 
 
 
 
AD5663  
APPLICATIONS  
CHOOSING A REFERENCE FOR THE AD5663  
USING A REFERENCE AS A POWER SUPPLY FOR  
THE AD5663  
To achieve the optimum performance from the AD5663,  
thought should be given to the choice of a precision voltage  
Because the supply current required by the AD5663 is extremely  
low, an alternative option is to use a voltage reference to supply  
the required voltage to the part (see Figure 36). This is especially  
useful if the power supply is quite noisy, or if the system supply  
voltages are at some value other than 5 V or 3 V (for example,  
15 V). The voltage reference outputs a steady supply voltage for  
the AD5663; see Table 15 for a suitable reference. If the low drop-  
out REF195 is used, it must supply 250 μA of current to the  
AD5663, with no load on the output of the DAC. When the  
DAC output is loaded, the REF195 also needs to supply the  
current to the load. The total current required (with a 5 kΩ  
load on the DAC output) is  
reference. The AD5663 has only one reference input, VREF  
.
The voltage on the reference input is used to supply the positive  
input to the DAC. Therefore, any error in the reference is  
reflected in the DAC.  
When choosing a voltage reference for high accuracy applica-  
tions, the sources of error are initial accuracy, ppm drift, long-  
term drift, and output voltage noise. Initial accuracy on the  
output voltage of the DAC leads to a full-scale error in the  
DAC. To minimize these errors, a reference with high initial  
accuracy is preferred. Also, choosing a reference with an output  
trim adjustment, such as the ADR423, allows a system designer  
to trim system errors out by setting a reference voltage to a  
voltage other than the nominal. The trim adjustment can also  
be used at temperature to trim out any error.  
250 μA + (5 V/5 kΩ) = 1.25 mA  
The load regulation of the REF195 is typically 2 ppm/mA,  
which results in a 2.5 ppm (12.5 μV) error for the 1.25 mA  
current drawn from it. This corresponds to a 0.164 ꢀSB error.  
ꢀong-term drift is a measurement of how much the reference  
drifts over time. A reference with a tight long-term drift specifi-  
cation ensures that the overall solution remains relatively stable  
during its entire lifetime.  
15V  
5V  
REF195  
500µA  
The temperature coefficient of a reference’s output voltage  
affects INꢀ, DNꢀ, and TUE. A reference with a tight temperature  
coefficient specification should be chosen to reduce temperature  
dependence of the DAC output voltage in ambient conditions.  
SYNC  
SCLK  
DIN  
V
V
REF  
DD  
V
= 0V TO 5V  
THREE-WIRE  
SERIAL  
INTERFACE  
OUT  
AD5663  
In high accuracy applications, which have a relatively low noise  
budget, reference output voltage noise needs to be considered.  
It is important to choose a reference with as low an output noise  
voltage as practical for the system noise resolution required.  
Precision voltage references, such as the ADR425, produce low  
output noise in the 0.1 Hz to 10 Hz range. Examples of recom-  
mended precision references for use as supplies to the AD5663  
are shown in the Table 15.  
Figure 36. REF195 as Power Supply to the AD5663  
Table 15. Partial List of Precision References for Use with the AD5663  
Part No.  
ADR425  
ADR395  
REF195  
AD7±0  
Initial Accuracy (mV Max)  
Temperature Drift (ppmoC Max)  
0.1 Hz to 10 Hz Noise (μV p-p Typ)  
VOUT (V)  
±2  
±6  
±2  
±2  
±2  
3
25  
5
3
3
3.4  
5
50  
4
5
5
5
2.5/3  
3
ADR423  
3.4  
Rev. 0 | Page 19 of 24  
 
 
 
AD5663  
5V  
BIPOLAR OPERATION USING THE AD5663  
REGULATOR  
10µF  
0.1µF  
POWER  
The AD5663 has been designed for single-supply operation,  
but a bipolar output range is also possible using the circuit in  
Figure 37. The circuit gives an output voltage range of 5 V.  
Rail-to-rail operation at the amplifier output is achievable using  
an AD820 or an OP295 as the output amplifier.  
V
DD  
SCLK  
V
V
V
V
OA  
SCLK  
IA  
ADuM1300  
AD5663  
The output voltage for any input code can be calculated as  
V
SDI  
OUT  
V
SYNC  
DIN  
IB  
OB  
OC  
D
65,536  
R1+ R2  
R1  
R2  
R1  
VO = V  
×
×
V  
×
DD  
DD  
V
DATA  
IC  
GND  
where D represents the input code in decimal (0 to 65,535).  
With VDD = 5 V, R1 = R2 = 10 kΩ  
Figure 38. AD5663 with a Galvanically Isolated Interface  
POWER SUPPLY BYPASSING AND GROUNDING  
10×D  
65,536  
V =  
5 V  
O
When accuracy is important in a circuit, it is helpful to carefully  
consider the power supply and ground return layout on the  
board. The printed circuit board containing the AD5663 should  
have separate analog and digital sections, each having its own  
area of the board. If the AD5663 is in a system where other  
devices require an AGND-to-DGND connection, the connection  
should be made at one point only. This ground point should be  
as close as possible to the AD5663.  
This is an output voltage range of 5 V, with 0x0000 corre-  
sponding to a −5 V output, and 0xFFFF corresponding to a  
+5 V output.  
R2 = 10k  
+5V  
+5V  
R1 = 10kΩ  
AD820/  
OP295  
The power supply to the AD5663 should be bypassed with 10 μF  
and 0.1 μF capacitors. The capacitors should be located as close  
as possible to the device, with the 0.1 μF capacitor ideally right  
up against the device. The 10 μF capacitors are of the tantalum  
bead type. It is important that the 0.1 μF capacitor have low  
effective series resistance (ESR) and effective series inductance  
(ESI) as in, for example, common ceramic types of capacitors.  
This 0.1 μF capacitor provides a low impedance path to ground  
for high frequencies caused by transient currents due to internal  
logic switching.  
±5V  
V
V
OUT  
DD  
10µF  
0.1µF  
AD5663  
–5V  
THREE-WIRE  
SERIAL  
INTERFACE  
Figure 37. Bipolar Operation with the AD5663  
USING THE AD5663 WITH  
A GALVANICALLY ISOLATED INTERFACE  
The power supply line itself should have as large a trace as  
possible to provide a low impedance path and to reduce glitch  
effects on the supply line. Clocks and other fast switching  
digital signals should be shielded from other parts of the board  
by digital ground. Avoid crossover of digital and analog signals  
if possible. When traces cross on opposite sides of the board,  
ensure that they run at right angles to each other to reduce  
feedthrough effects through the board. The best board layout  
technique is the microstrip technique, where the component  
side of the board is dedicated to the ground plane only, and the  
signal traces are placed on the solder side. However, this is not  
always possible with a 2-layer board.  
In process control applications in industrial environments, it  
is often necessary to use a galvanically isolated interface to  
protect and isolate the controlling circuitry from any hazardous  
common-mode voltages that can occur in the area where the  
DAC is functioning. iCoupler® provides isolation in excess of  
2.5 kV. The AD5663 use a 3-wire serial logic interface, so the  
ADuM1300 three-channel digital isolator provides the required  
isolation (see Figure 38). The power supply to the part also  
needs to be isolated, which is done by using a transformer. On  
the DAC side of the transformer, a 5 V regulator provides the  
5 V supply required for the AD5663.  
Rev. 0 | Page 20 of 24  
 
 
 
AD5663  
OUTLINE DIMENSIONS  
INDEX  
AREA  
PIN 1  
INDICATOR  
3.00  
BSC SQ  
10  
1
1.50  
BCS SQ  
0.50  
BSC  
2.48  
2.38  
2.23  
EXPOSED  
PAD  
TOP VIEW  
(BOTTOM VIEW)  
6
5
0.50  
0.40  
0.30  
1.74  
1.64  
1.49  
0.80 MAX  
0.55 TYP  
0.80  
0.75  
0.70  
0.05 MAX  
0.02 NOM  
SIDE VIEW  
SEATING  
PLANE  
0.30  
0.23  
0.18  
0.20 REF  
Figure 39. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]  
3 mm x 3 mm Body, Very Very Thin, Dual Lead  
(CP-10-9)  
Dimensions shown in millimeters  
3.10  
3.00  
2.90  
6
10  
5.15  
4.90  
4.65  
3.10  
3.00  
2.90  
1
5
PIN 1  
0.50 BSC  
0.95  
0.85  
0.75  
1.10 MAX  
0.80  
0.60  
0.40  
8°  
0°  
0.15  
0.05  
0.33  
0.17  
SEATING  
PLANE  
0.23  
0.08  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-187-BA  
Figure 40. 10-Lead Mini Small Outline Package [MSOP]  
(RM-10)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Temperature  
Range  
Power-On  
Reset Code  
Package  
Package  
Option  
Model  
Accuracy  
Description  
10-lead MSOP  
10-lead MSOP  
Branding  
D±0  
D±0  
AD5663ARMZ1  
AD5663ARMZ-REEL71  
−40°C to +105°C  
−40°C to +105°C  
Zero  
Zero  
±16 LSB INL  
±16 LSB INL  
RM-10  
RM-10  
AD5663BRMZ1  
AD5663BRMZ-REEL71  
AD5663BRMZ-11  
AD5663BRMZ-1REEL71  
AD5663BCPZ-250RL71  
AD5663BCPZ-REEL71  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
Zero  
±12 LSB INL  
±12 LSB INL  
±12 LSB INL  
±12 LSB INL  
±12 LSB INL  
±12 LSB INL  
10-lead MSOP  
RM-10  
RM-10  
RM-10  
RM-10  
CP-10-9  
CP-10-9  
D±C  
D±C  
D7J  
D7J  
D±C  
D±C  
Zero  
10-lead MSOP  
Midscale  
Midscale  
Zero  
10-lead MSOP  
10-lead MSOP  
10-lead LFCSP_WD  
10-lead LFCSP_WD  
Zero  
1 Z = Pb-free part.  
Rev. 0 | Page 21 of 24  
 
 
AD5663  
NOTES  
Rev. 0 | Page 22 of 24  
AD5663  
NOTES  
Rev. 0 | Page 23 of 24  
AD5663  
NOTES  
©2006 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D05855-0-4/06(0)  
Rev. 0 | Page 24 of 24  
 
 
 
 
 
 
 
 
 
 

相关型号:

AD5663ARMZ

2.7 V to 5.5 V, 250 uA, Rail-to-Rail Output, Dual 16-Bit nanoDAC
ADI

AD5663ARMZ-REEL7

2.7 V to 5.5 V, 250 uA, Rail-to-Rail Output, Dual 16-Bit nanoDAC
ADI

AD5663BCPZ-250RL7

2.7 V to 5.5 V, 250 uA, Rail-to-Rail Output, Dual 16-Bit nanoDAC
ADI

AD5663BCPZ-REEL7

2.7 V to 5.5 V, 250 uA, Rail-to-Rail Output, Dual 16-Bit nanoDAC
ADI

AD5663BRMZ

2.7 V to 5.5 V, 250 uA, Rail-to-Rail Output, Dual 16-Bit nanoDAC
ADI

AD5663BRMZ-1

2.7 V to 5.5 V, 250 uA, Rail-to-Rail Output, Dual 16-Bit nanoDAC
ADI

AD5663BRMZ-1REEL7

2.7 V to 5.5 V, 250 uA, Rail-to-Rail Output, Dual 16-Bit nanoDAC
ADI

AD5663BRMZ-REEL7

2.7 V to 5.5 V, 250 uA, Rail-to-Rail Output, Dual 16-Bit nanoDAC
ADI

AD5663R

Dual 12-/14-/16-Bit nanoDAC with 5 ppm/C On-Chip Reference
ADI

AD5663RBCPZ-3R2

Dual 12-/14-/16-Bit nanoDAC with 5 ppm/C On-Chip Reference
ADI

AD5663RBCPZ-3R2

SERIAL INPUT LOADING, 4 us SETTLING TIME, 16-BIT DAC, PDSO10, 3 X 3 MM, ROHS COMPLIANT, LFCSP-10
ROCHESTER

AD5663RBCPZ-3REEL7

Dual 12-/14-/16-Bit nanoDAC with 5 ppm/C On-Chip Reference
ADI