AD7291TCPZ-EP-RL7 [ADI]

8-Channel, I2C, 12-Bit SAR ADC with Temperature Sensor;
AD7291TCPZ-EP-RL7
型号: AD7291TCPZ-EP-RL7
厂家: ADI    ADI
描述:

8-Channel, I2C, 12-Bit SAR ADC with Temperature Sensor

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8-Channel, I2C, 12-Bit SAR ADC  
with Temperature Sensor  
Enhanced Product  
AD7291-EP  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
V
DD  
GND  
12-bit SAR ADC  
8 single-ended analog input channels  
Analog input range: 0 V to 2.5 V  
12-bit temperature to digital converter  
Temperature sensor accuracy of 1°C typical  
Channel sequencer operation  
Specified for VDD of 2.8 V to 3.6 V  
Logic voltage VDRIVE = 1.65 V to 3.6 V  
Internal 2.5 V reference  
V
REF  
REF  
BUF  
12-BIT  
V
IN0  
SUCCESSIVE  
APPROXIMATION  
ADC  
T/H  
INPUT  
MUX  
AD7291-EP  
V
IN7  
I2C-compatible serial interface supports standard and  
fast speed modes  
SEQUENCER  
SCL  
SDA  
AS1  
Out of range indicator/alert function  
Autocycle mode  
Power-down current: 13 µA maximum  
20-lead LFCSP package  
CONTROL LOGIC  
2
I C INTERFACE  
TEMP  
SENSOR  
AS0  
V
DRIVE  
ALERT  
PD/RST  
ENHANCED PRODUCT FEATURES  
Figure 1.  
Supports defense and aerospace applications (AQEC  
standard)  
Extended industrial temperature range: −55°C to +125°C  
Controlled manufacturing baseline  
1 assembly/test site  
1 fabrication site  
Product change notification  
Qualification data available upon request  
GENERAL DESCRIPTION  
The AD7291-EP is a 12-bit, low power, 8-channel, successive  
approximation analog-to-digital converter (ADC) with an  
internal temperature sensor.  
The AD7291-EP includes a high accuracy band gap temperature  
sensor, which is monitored and digitized by the 12-bit ADC to  
give a resolution of 0.25°C.  
The device operates from a single 3.3 V power supply and  
features an I2C-compatible interface. The device contains a  
9-channel multiplexer and a track-and-hold amplifier with an  
input bandwidth of 30 MHz. The device has an on-chip 2.5 V  
reference that can be disabled to allow the use of an external  
reference.  
The AD7291-EP offers a programmable sequencer, which  
enables the selection of a preprogrammable sequence of  
channels for conversion.  
On-chip limit registers can be programmed with high and low  
limits for the conversion results; an out-of-range indicator output  
(ALERT) becomes active when the programmed high or low  
limits are violated by the conversion result. This output can be  
used as an interrupt.  
The AD7291-EP provides a 2-wire serial interface compatible  
with I2C interfaces. The I2C interface supports standard and fast  
I2C interface modes. The AD7291-EP normally remains in a  
partial power-down state while not converting and powers up  
for conversions. The conversion process can be controlled by a  
command mode where conversions occur across I2C write  
operations or an autocycle mode selected through software control.  
Additional application and technical information can be found  
in the AD7291 data sheet.  
Rev. 0  
Document Feedback  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rightsof third parties that may result fromits use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks andregisteredtrademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Technical Support  
©2017 Analog Devices, Inc. All rights reserved.  
www.analog.com  
 
 
 
 
AD7291-EP  
Enhanced Product  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Thermal Resistance.......................................................................5  
ESD Caution...................................................................................5  
Pin Configuration and Function Descriptions..............................6  
Typical Performance Characteristics ..............................................7  
Outline Dimensions..........................................................................8  
Ordering Guide .............................................................................8  
Enhanced Product Features ............................................................ 1  
Functional Block Diagram .............................................................. 1  
General Description......................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Absolute Maximum Ratings............................................................ 5  
REVISION HISTORY  
7/2017—Revision 0: Initial Version  
Rev. 0 | Page 2 of 8  
 
Enhanced Product  
SPECIFICATIONS  
AD7291-EP  
VDD = 2.8 V to 3.6 V; VDRIVE = 1.65 V to 3.6 V; fSCL = 400 kHz, fast SCLK mode; VREF = 2.5 V internal/external; TA = −55°C to +125°C,  
unless otherwise noted.  
Table 1.  
Parameter  
Min  
Typ  
Max  
Unit1  
Test Conditions/Comments  
DYNAMIC PERFORMANCE  
Signal-to-Noise Ratio (SNR)  
Signal-to-Noise + Distortion Ratio (SINAD)  
Total Harmonic Distortion (THD)  
Spurious-Free Dynamic Range (SFDR)  
Intermodulation Distortion (IMD)  
Second-Order Terms  
Third-Order Terms  
Channel-to-Channel Isolation  
Full Power Bandwidth2  
fIN = 1 kHz sine wave  
70  
70  
71  
71  
−84  
−85  
dB  
dB  
dB  
dB  
−78  
−80  
fA = 5.4 kHz, fB = 4.6 kHz  
−88  
−88  
−100  
30  
dB  
dB  
dB  
MHz  
MHz  
fIN = 10 kHz  
At 3 dB  
At 0.1 dB  
10  
DC ACCURACY  
Resolution  
12  
Bits  
Integral Nonlinearity (INL)  
Differential Nonlinearity (DNL)  
Offset Error  
Offset Error Matching  
Offset Temperature Drift  
Gain Error  
0.5  
0.5  
2
2.5  
4
1
0.99  
4.5  
4.5  
LSB  
LSB  
LSB  
LSB  
ppm/°C  
LSB  
Guaranteed no missing codes to 12 bits  
1
4
Gain Error Matching  
Gain Temperature Drift  
ANALOG INPUT  
1
0.5  
2.5  
LSB  
ppm/°C  
Input Voltage Ranges  
DC Leakage Current  
Input Capacitance2  
0
VREF  
1
V
0.01  
34  
8
µA  
pF  
pF  
When in track  
When in hold  
REFERENCE INPUT/OUTPUT  
Reference Output Voltage3  
Long-Term Stability  
Output Voltage Hysteresis  
Reference Input Voltage Range4  
DC Leakage Current  
VREF Output Impedance  
Reference Temperature Coefficient  
VREF Noise2  
2.4925  
1
2.5  
150  
50  
2.5075  
V
0.3% maximum at 25°C  
For 1000 hours  
ppm  
ppm  
V
µA  
2.5  
1
0.01  
1
12  
External reference applied to Pin VREF  
Bandwidth = 10 MHz  
35  
ppm/°C  
µV rms  
60  
LOGIC INPUTS (SDA, SCL)  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current, IIN  
Input Capacitance, CIN  
Input Hysteresis, VHYST  
0.7 × VDRIVE  
V
V
µA  
pF  
V
0.3 × VDRIVE  
1
0.01  
6
VIN = 0 V or VDRIVE  
2
0.1 × VDRIVE  
Rev. 0 | Page 3 of 8  
 
AD7291-EP  
Enhanced Product  
Parameter  
Min  
Typ  
Max  
Unit1  
Test Conditions/Comments  
LOGIC OUTPUTS  
Output High Voltage, VOH  
VDRIVE − 0.3  
VDRIVE − 0.2  
V
V
V
V
µA  
pF  
VDRIVE < 1.8  
VDRIVE ≥ 1.8  
ISINK = 3 mA  
ISINK = 6 mA  
Output Low Voltage, VOL  
0.4  
0.6  
1
Floating State Leakage Current  
Floating State Output Capacitance2  
INTERNAL TEMPERATURE SENSOR  
Operating Range  
0.01  
8
−55  
+125  
2
3
°C  
°C  
°C  
°C  
Accuracy  
1
1
0.25  
TA = −55°C to +85°C  
TA = 85°C to 125°C  
LSB size  
Resolution  
CONVERSION RATE  
Conversion Time  
Autocycle Update Rate5  
Throughput Rate  
POWER REQUIREMENTS  
VDD  
3.2  
50  
μs  
μs  
kSPS  
22.22  
fSCL = 400 kHz  
Digital inputs = 0 V or VDRIVE  
2.8  
1.65  
3
3
3.6  
3.6  
V
V
VDRIVE  
6, 7  
ITOTAL  
Normal Mode (Operational)  
Normal Mode (Static)  
Full Power-Down Mode  
2.9  
2.9  
0.3  
1.6  
4.9  
3.5  
3.4  
1.6  
4.5  
13  
mA  
mA  
μA  
μA  
μA  
TA = −55°C to +25°C  
TA = >25°C to 85°C  
TA = >85°C to 125°C  
Power Dissipation7  
Normal Mode (Operational)  
8.7  
10.5  
12.6  
12.2  
5.8  
16.2  
46.8  
mW  
mW  
mW  
µW  
µW  
µW  
VDD = 3 V, VDRIVE = 3 V  
10.4  
10.4  
1.1  
5.8  
17.6  
Normal Mode (Static)  
Full Power-Down Mode  
TA = −55°C to +25°C  
TA = >25°C to 85°C  
TA = >85°C to 125°C  
1 All specifications expressed in decibels are referred to full-scale range (FSR) and tested with an input signal at 0.5 dB below full scale, unless otherwise specified.  
2 Sample tested during initial product release to ensure compliance.  
3 Refers to Pin VREF specified for 25oC.  
4 A correction factor can be required on the temperature sensor results when using an external VREF (see the AD7291 data sheet).  
5 Sampled during initial product release to ensure compliance; not subject to production testing.  
6 ITOTAL is the total current flowing in VDD and VDRIVE  
.
7 ITOTAL and power dissipation are specified with VDD = VDRIVE = 3.6 V, unless otherwise noted.  
Rev. 0 | Page 4 of 8  
 
Enhanced Product  
AD7291-EP  
ABSOLUTE MAXIMUM RATINGS  
THERMAL RESISTANCE  
Table 2.  
Thermal performance is directly linked to printed circuit board  
(PCB) design and operating environment. Close attention to  
PCB thermal design is required.  
Parameter  
Rating  
VDD to GND1, GND  
VDRIVE to GND1, GND  
Analog Input Voltage to GND1  
Digital Input Voltage to GND1  
Digital Output Voltage to GND1  
VREF to GND1  
−0.3 V to +5 V  
−0.3 V to +5 V  
−0.3 V to +3 V  
−0.3 V to VDRIVE + 0.3 V  
−0.3 V to VDRIVE + 0.3 V  
−0.3 V to +3 V  
−0.3 V to +0.3 V  
10 mA  
Table 3. Thermal Resistance  
Package Type  
CP-20-81  
θJA  
θJC  
Unit  
52  
6.5  
°C/W  
GND to GND1  
1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test  
board with 9 thermal vias. See JEDEC JESD51.  
Input Current to Any Pin Except Supplies1  
Operating Temperature Range  
Storage Temperature Range  
Junction Temperature  
Pb-free Temperature, Soldering  
Reflow  
−55°C to +125°C  
−65°C to +150°C  
150°C  
ESD CAUTION  
260(+0)°C  
2 kV  
ESD  
1 Transient currents of up to 100 mA do not cause latch-up.  
Stresses at or above those listed under Absolute Maximum  
Ratings may cause permanent damage to the product. This is a  
stress rating only; functional operation of the product at these  
or any other conditions above those indicated in the operational  
section of this specification is not implied. Operation beyond  
the maximum operating conditions for extended periods may  
affect product reliability.  
Rev. 0 | Page 5 of 8  
 
 
 
AD7291-EP  
Enhanced Product  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
15 SCL  
14 SDA  
V
V
V
V
V
1
2
3
4
5
IN3  
IN4  
IN5  
IN6  
IN7  
AD7291-EP  
TOP VIEW  
(Not to Scale)  
13 AS1  
ALERT  
12  
11 AS0  
NOTES  
1. THE EXPOSED METAL PADDLE ON THE BOTTOM  
OF THE LFCSP PACKAGE SHOULD BE SOLDERED  
TO PCB GROUND FOR PROPER HEAT DISSIPATION  
AND PERFORMANCE.  
Figure 2. Pin Configuration  
Table 4. Pin Function Descriptions  
Pin No. Mnemonic Description  
1 to 5,  
18 to 20 VIN5, VIN6  
VIN3, VIN4  
,
,
,
Analog Inputs. The AD7291-EP has eight single-ended analog inputs that are multiplexed into the on-chip track-  
and-hold amplifier. Each input channel can accept analog inputs from 0 V to 2.5 V. Any unused input channels  
must be connected to GND1 to avoid noise pickup.  
V
V
IN7, VIN0  
IN1, VIN2  
6
7
GND1  
Ground. Ground reference point for the internal reference circuitry on the AD7291-EP. All analog input signals and  
the external reference signals must be referred to this GND1 voltage. The GND1 pin must be connected to the  
ground plane of a system. All ground pins must ideally be at the same potential and must not be more than 0.3 V  
apart, even on a transient basis. The VREF pin must be decoupled to this ground pin via a 10 μF decoupling capacitor.  
Internal Reference/External Reference Supply. The nominal internal reference voltage of 2.5 V appears at this pin.  
Provided the output is buffered, the on-chip reference can be taken from this pin and applied externally to the rest  
of a system. Decoupling capacitors must be connected to this pin to decouple the reference buffer. For best  
performance, it is recommended to use a 10 μF decoupling capacitor on this pin to GND1. The internal reference  
can be disabled and an external reference supplied to this pin if required. The input voltage range for the external  
reference is 2.0 V to 2.5 V.  
VREF  
8
9
DCAP  
Decoupling Capacitor Pin. Decoupling capacitors (1 μF recommended) are connected to this pin to decouple the  
internal low dropout regulator (LDO).  
Ground. Ground reference point for all analog and digital circuitry on the AD7291-EP. The GND pin must be con-  
nected to the ground plane of the system. All ground pins must ideally be at the same potential and must not be  
more than 0.3 V apart, even on a transient basis. Both DCAP and VDD pins must be decoupled to this GND pin.  
GND  
10  
11, 13  
VDD  
Supply Voltage, 2.8 V to 3.6 V. This supply must be decoupled to GND with 10 μF and 100 nF decoupling capacitors.  
Logic Inputs. Together, the logic state of these two inputs selects a unique I2C address for the AD7291-EP. See the  
AD7291 data sheet for details. The device address depends on the voltage applied to these pins.  
Digital Output. This pin acts as an out-of-range indicator and, if enabled, becomes active when the conversion  
result violates the DATAHIGH or DATALOW register values. See the AD7291 data sheet for further details.  
Digital Input/Output. Serial bus bidirectional data. This open-drain output requires a pull-up resistor. The output  
coding is straight binary for the voltage channels and twos complement for the temperature sensor result.  
Digital Inputs. Serial I2C Bus Clock. This input requires a pull-up resistor. The data transfer rate in I2C mode is  
compatible with both 100 kHz and 400 kHz operating modes.  
Logic Power Supply Input. The voltage supplied at this pin determines the voltage at which the interface operates.  
This pin must be decoupled to GND. The voltage range on this pin is 1.65 V to 3.6 V and can be less than the  
voltage at VDD but must never exceed it by more than 0.3 V.  
AS0, AS1  
ALERT  
SDA  
12  
14  
15  
16  
SCL  
VDRIVE  
17  
PD/RST  
EPAD  
Power-Down Pin. This pin places the device into a full power-down mode and enables power conservation when  
operation is not required. This pin can be used to reset the device by toggling the pin low for a minimum of 1 ns and a  
maximum of 100 ns. If the maximum time is exceeded, the device enters power-down mode. When placing the device  
in full power-down mode, the analog inputs must be returned to 0 V.  
Exposed Pad. The exposed metal paddle on the bottom of the LFCSP package must be soldered to PCB ground for  
proper functionality and heat dissipation.  
EPAD  
Rev. 0 | Page 6 of 8  
 
Enhanced Product  
AD7291-EP  
TYPICAL PERFORMANCE CHARACTERISTICS  
1.5  
7
V
= 3V  
DRIVE  
6
5
4
3
2
1
0
1.0  
0.5  
0
–55°C  
+25°C  
+85°C  
+125°C  
–0.5  
–1.0  
–1.5  
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
(V)  
3.3  
3.4  
3.5  
3.6  
–55 –40 –25 –10  
5
20 35 55 65 80 95 110  
125  
V
DD  
TEMPERATURE (°C)  
Figure 3. Temperature Accuracy at 3 V  
Figure 4. Full Shutdown Current vs. Supply Voltage for Various Temperatures  
Rev. 0 | Page 7 of 8  
 
AD7291-EP  
Enhanced Product  
OUTLINE DIMENSIONS  
DETAIL A  
(JEDEC 95)  
4.10  
4.00 SQ  
3.90  
0.30  
0.25  
0.18  
PIN 1  
INDICATOR  
PIN 1  
INDIC ATOR AREA OPTIONS  
(SEE DETAIL A)  
16  
20  
0.50  
BSC  
1
15  
2.75  
2.60 SQ  
2.35  
EXPOSED  
PAD  
5
11  
10  
6
0.50  
0.40  
0.30  
0.25 MIN  
TOP VIEW  
SIDE VIEW  
BOTTOM VIEW  
0.80  
0.75  
0.70  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
0.05 MAX  
0.02 NOM  
COPLANARITY  
0.08  
SECTION OF THIS DATA SHEET.  
SEATING  
PLANE  
0.20 REF  
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-11.  
Figure 5. 20-Lead Lead Frame Chip Scale Package [LFCSP]  
4 mm × 4 mm Body and 0.75 mm Package Height  
(CP-20-8)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model1  
Temperature Range  
−55°C to +125°C  
−55°C to +125°C  
Package Description  
Package Option  
CP-20-8  
CP-20-8  
AD7291TCPZ-EP  
AD7291TCPZ-EP-RL7  
20-Lead Lead Frame Chip Scale Package [LFCSP]  
20-Lead Lead Frame Chip Scale Package [LFCSP]  
1 Z = RoHS Compliant Part.  
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).  
©2017 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D15915-0-7/17(0)  
Rev. 0 | Page 8 of 8  
 
 

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