AD7537TE/883B [ADI]

IC DUAL, PARALLEL, 8 BITS INPUT LOADING, 0.8 us SETTLING TIME, 12-BIT DAC, CQCC28, CERAMIC, LCC-28, Digital to Analog Converter;
AD7537TE/883B
型号: AD7537TE/883B
厂家: ADI    ADI
描述:

IC DUAL, PARALLEL, 8 BITS INPUT LOADING, 0.8 us SETTLING TIME, 12-BIT DAC, CQCC28, CERAMIC, LCC-28, Digital to Analog Converter

输入元件 信息通信管理 转换器
文件: 总14页 (文件大小:79K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
REVISIONS  
LTR  
A
DESCRIPTION  
Update drawing to current requirements. Editorial changes throughout. - drw  
DATE (YR-MO-DA)  
04-01-27  
APPROVED  
Raymond Monnin  
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.  
REV  
SHEET  
REV  
SHEET  
REV STATUS  
OF SHEETS  
REV  
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
A
A
A
SHEET  
10  
11  
12  
13  
PMIC N/A  
PREPARED BY  
Marcia B. Kelleher  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216  
CHECKED BY  
Raymond Monnin  
STANDARD  
MICROCIRCUIT  
DRAWING  
http://www.dscc.dla.mil  
APPROVED BY  
Michael A. Frye  
THIS DRAWING IS AVAILABLE  
FOR USE BY ALL  
DEPARTMENTS  
AND AGENCIES OF THE  
DEPARTMENT OF DEFENSE  
MICROCIRCUIT, LINEAR, CMOS, DUAL 12-BIT,  
DIGITAL-TO-ANALOG CONVERTER,  
MONOLITHIC SILICON  
DRAWING APPROVAL DATE  
88-05-10  
AMSC N/A  
REVISION LEVEL  
A
SIZE  
A
CAGE CODE  
5962-87763  
67268  
SHEET  
1
OF  
13  
DSCC FORM 2233  
APR 97  
5962-E115-04  
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.  
1. SCOPE  
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in  
accordance with MIL-PRF-38535, appendix A.  
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:  
5962-87763  
01  
L
A
Drawing number  
Device type  
(see 1.2.1)  
Case outline  
(see 1.2.2)  
Lead finish  
(see 1.2.3)  
1.2.1 Device types. The device types identify the circuit function as follows:  
Device type  
01  
Generic number  
7537S  
Circuit function  
8 + 4 loading structure, dual 12-bit CMOS  
D/A converter, 11-bit linearity, ±6 LSB’s of  
gain error  
02  
03  
7537T  
7537U  
8 + 4 loading structure, dual 12-bit CMOS  
D/A converter, 12-bit linearity, ±3 LSB’s of  
gain error  
8 + 4 loading structure, dual 12-bit CMOS  
D/A converter, 12-bit linearity, ±2 LSB’s of  
gain error  
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:  
Outline letter  
Descriptive designator  
Terminals  
Package style  
L
3
GDIP3-T24 or CDIP4-T24  
CQCC1-N28  
24  
28  
Dual-in-line  
Square leadless chip carrier  
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.  
1.3 Absolute maximum ratings.  
VDD to DGND ...................................................................................................... -0.3 V, +17 V  
VREFA, VREFB to AGNDA, AGNDB....................................................................... ±25 V  
VRFBA, VRFBB to AGNDA, AGNDB....................................................................... ±25 V  
Digital input voltage to DGND............................................................................. -0.3 V, VDD +0.3 V  
VIOUTA, VIOUTB to DGND....................................................................................... -0.3 V, VDD +0.3 V  
AGNDA, AGNDB to DGND................................................................................ -0.3 V, VDD +0.3 V  
Power dissipation:  
Up to +75°C .................................................................................................... 450 mW  
Derate above +75°C ....................................................................................... 6 mW/°C  
Lead temperature (soldering, 10 seconds)......................................................... +300°C  
Thermal resistance ( JC):  
Cases L and 3 ................................................................................................. See MIL-STD-1835  
Thermal resistance ( JA) ..................................................................................... 120°C/W  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
2
DSCC FORM 2234  
APR 97  
1.4 Recommended operating conditions.  
Ambient operating temperature range................................................................ -55°C to +125°C  
Supply voltage range (VDD)................................................................................. 10.8 V dc to 16.5 V dc  
Minimum high level input voltage........................................................................ 2.4 V dc  
Maximum low level input voltage......................................................................... 0.8 V dc  
VREFA, VREFB ........................................................................................................ 10 V dc  
VAGNDA, VIOUTA ..................................................................................................... 0 V dc  
VAGNDB, VIOUTB ..................................................................................................... 0 V dc  
Output amplifiers................................................................................................. AD644 or equivalent  
2. APPLICABLE DOCUMENTS  
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part  
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the  
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the  
solicitation.  
SPECIFICATION  
DEPARTMENT OF DEFENSE  
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.  
STANDARDS  
DEPARTMENT OF DEFENSE  
MIL-STD-883  
-
Test Method Standard Microcircuits.  
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.  
HANDBOOKS  
DEPARTMENT OF DEFENSE  
MIL-HDBK-103 - List of Standard Microcircuit Drawings.  
MIL-HDBK-780 - Standard Microcircuit Drawings.  
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization  
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)  
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of  
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific  
exemption has been obtained.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
3
DSCC FORM 2234  
APR 97  
3. REQUIREMENTS  
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN  
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing  
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535  
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval  
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make  
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These  
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is  
required to identify when the QML flow option is used.  
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in  
MIL-PRF-38535, appendix A and herein.  
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.  
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.  
3.2.3 Truth tables. The truth tables shall be as specified on figure 2.  
3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3.  
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as  
specified in table I and shall apply over the full ambient operating temperature range.  
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests  
for each subgroup are described in table I.  
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in  
1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages  
where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not  
marking the "5962-" on the device.  
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to  
MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance  
with MIL-PRF-38535 to identify when the QML flow option is used.  
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an  
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing  
as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix  
A and the requirements herein.  
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with  
each lot of microcircuits delivered to this drawing.  
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix  
A.  
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's  
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the  
reviewer.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
4
DSCC FORM 2234  
APR 97  
TABLE I. Electrical performance characteristics.  
Conditions 1/  
-55°C TA +125°C  
unless otherwise specified  
Group A  
subgroups  
Device  
type  
Limits  
Unit  
Test  
Symbol  
Min  
12  
Max  
Bits  
V
Resolution  
VIL  
VIH  
IIN  
VDD = 10.8 V and 16.5 V  
VDD = 10.8 V and 16.5 V  
VIN = VDD = 16.5 V  
1, 2, 3  
1, 2, 3  
1
All  
All  
All  
0.8  
Input low voltage  
Input high voltage  
Input current  
2.4  
V
1.0  
µA  
2, 3  
1, 2, 3  
1
10.0  
2.0  
IDD  
VDD = 16.5 V  
All  
All  
mA  
Supply current  
RA  
V
DD = 10.8 V and 16.5 V  
-1.0  
-1.0  
-0.5  
-0.5  
+1.0  
+1.0  
+0.5  
+0.5  
LSB  
Relative accuracy  
2, 3  
2, 3  
12  
01  
02, 03  
02, 03  
All grades guaranteed  
monotonic to 12 bits over  
-55°C to +125°C range.  
VDD = 10.8 V and 16.5 V  
DNL  
AE  
1, 2, 3  
All  
-1.0  
+1.0  
LSB  
LSB  
Differential nonlinearity  
Gain error  
Measured using RFA and RFB  
Both DAC registers loaded  
.
1
All  
01  
02  
03  
02  
03  
All  
-6.0  
-6.0  
-3.0  
-2.0  
-3.0  
-2.0  
-5.0  
+6.0  
+6.0  
+3.0  
+2.0  
+3.0  
+2.0  
+5.0  
with all 1’s. VDD = 10.8 V  
2, 3  
2, 3  
2, 3  
12  
12  
Gain temperature 2/  
coefficient  
TCAE/dt  
4
ppm/°C  
See footnotes at end of table.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
5
DSCC FORM 2234  
APR 97  
TABLE I. Electrical performance characteristics - continued.  
Conditions 1/  
-55°C TA +125°C  
unless otherwise specified  
Group A  
subgroups  
Device  
type  
Limits  
Unit  
nA  
Test  
Symbol  
Min  
-10  
Max  
+10  
DAC A register loaded with all  
0’s. VDD = 16.5 V  
IOUTA  
1
2, 3  
1
All  
All  
Output leakage current  
-250  
-10  
-250  
9
+250  
+10  
+250  
20  
DAC B register loaded with all  
0’s. VDD = 16.5 V  
IOUTB  
nA  
Output leakage current  
2, 3  
1, 2, 3  
1
RI  
VDD = 10.8 V  
VDD = 10.8 V  
All  
All  
k
Reference input resistance  
Reference input resistance  
RIN  
-3  
+3  
%
match. VREFA  
,
VREFB  
2, 3  
2, 3  
12  
01, 02  
03  
-3  
+3  
-1  
+1  
03  
-1  
+1  
Output current settling  
time 2/, 3/  
tSL  
FT  
4
All  
1.5  
µs  
dB  
V
REFA, VREFB = 20 V p-p,  
AC feedthrough VREFA to  
IOUTA and VREFB to IOUTB  
2/  
10 kHz sinewave. DAC  
register loaded with all 0’s  
4
All  
All  
-65  
V
DD = VDD max – VDD min  
Power supply rejection  
ratio  
PSRR  
1
2, 3  
4
-0.01  
-0.02  
+0.01  
+0.02  
70  
%/%  
VDD = 10.8 V  
Output capacitance for  
DAC A and DAC B  
COUT  
DAC A, DAC B loaded with 0’s  
DAC A, DAC B loaded with 1’s  
See 4.3.1c  
All  
pF  
140  
7
All  
All  
All  
Functional test  
Address valid to write  
setup time, t1  
tAWS  
tAWH  
See figure 4  
9, 10, 11  
9, 10, 11  
30  
25  
ns  
ns  
Address valid to write hold  
time, t2  
See figure 4  
See footnotes at end of table.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
6
DSCC FORM 2234  
APR 97  
TABLE I. Electrical performance characteristics - continued.  
Conditions 1/  
-55°C TA +125°C  
unless otherwise specified  
Group A  
subgroups  
Device  
type  
Limits  
Max  
Unit  
Test  
Symbol  
Min  
80  
tOS  
tOH  
See figure 4  
See figure 4  
See figure 4  
See figure 4  
See figure 4  
See figure 4  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
All  
All  
All  
All  
All  
All  
ns  
ns  
ns  
ns  
ns  
ns  
Data setup time, t3  
Data hold time, t4  
25  
0
Chip select or update to  
write setup time, t5  
tCWS  
tCWH  
tWR  
tCL  
Chip select or update to  
write hold time, t6  
0
100  
100  
Write pulse width, t7  
Clear pulse width, t8  
1/ VDD = 10.8 V to 16.5 V except where otherwise specified; VREFA = VREFB = 10 V (see 1.4). VAGNDA = VAGNDB = 0 V, VIOUTA  
VIOUTB = 0 V.  
=
2/ Guaranteed if not tested to the limits as specified on table I.  
2/ To 0.01 percent of full-scale-range. IOUT load = 100 ; CEXT = 13 pF. DAC output measured from rising edge of WR .  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
7
DSCC FORM 2234  
APR 97  
Device  
types  
01, 02, 03  
Case  
outlines  
Terminal  
number  
L
3
Pin function description  
Description  
Terminal symbol  
Mnemonic  
1
2
AGNDA  
IOUTA  
RFBA  
NC  
AGNDA  
IOUTA  
AGNDA  
IOUTA  
Analog ground for DAC A.  
Current output terminal of DAC A.  
Feedback resistor for DAC A.  
Reference input to DAC A.  
Chip select input. Active low.  
Eight data inputs, DB0-DB7  
Digital ground  
3
RFBA  
4
VREFA  
RFBA  
VREFA  
5
VREFA  
CS  
CS  
6
DB0  
DB0-DB7  
CS  
7
DB1  
DB2  
DB0  
DGND  
A0  
8
NC  
Address line 0.  
9
DB3  
DB1  
DB2  
DB3  
DB4  
A1  
Address line 1.  
10  
11  
12  
DB4  
Clear input. Active low. Clears all registers.  
Write input. Active low.  
CLR  
WR  
UPD  
VDD  
DB5  
DGND  
Updates DAC registers from input registers.  
Power supply input. Nominally +12 V to 15 V,  
with ±10 percent tolerance.  
13  
DB6  
DB5  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
DB7  
A0  
DGND  
NC  
VREFB  
RFBB  
Reference input to DAC B.  
Feedback resistor for DAC B.  
Current output terminal of DAC B.  
Analog ground for DAC B.  
No connect.  
A1  
DB6  
DB7  
A0  
IOUTB  
AGNDB  
NC  
CLR  
WR  
A1  
UPD  
VDD  
CLR  
VREFB  
RFBB  
IOUTB  
AGNDB  
- - -  
WR  
NC  
UPD  
VDD  
VREFB  
RFBB  
- - -  
- - -  
IOUTB  
- - -  
AGNDB  
FIGURE 1. Terminal connections and function descriptions.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
8
DSCC FORM 2234  
APR 97  
A1  
A0  
Function  
No data transfer  
CLR  
UPD  
CS  
WR  
1
1
0
1
1
1
1
1
1
1
1
X
1
1
1
1
0
0
1
X
X
0
0
0
0
1
0
X
1
X
0
0
0
0
0
0
X
X
X
0
X
X
X
0
No data transfer  
All registers cleared  
DAC A LS input register loaded with  
DB7 – DB0  
DAC A MS input register loaded  
with DB3 – DB0  
DAC B LS input register loaded with  
DB7 – DB0  
DAC B MS input register loaded  
with DB3 – DB0  
DAC A, DAC B registers updated  
simultaneously from input registers  
DAC A, DAC B registers are  
transparent  
0
1
1
0
1
1
X
X
X
X
FIGURE 2. Truth table.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
9
DSCC FORM 2234  
APR 97  
FIGURE 3. Logic diagram.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
10  
DSCC FORM 2234  
APR 97  
NOTES:  
1.  
2.  
All input signal rise and fall times measured from 10 percent to 90 percent of +5 V, tr = tf = 20 ns.  
Timing measurement reference level VIH + VIL .  
2
FIGURE 4. Timing waveforms.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
11  
DSCC FORM 2234  
APR 97  
4. QUALITY ASSURANCE PROVISIONS  
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,  
appendix A.  
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices  
prior to quality conformance inspection. The following additional criteria shall apply:  
a. Burn-in test, method 1015 of MIL-STD-883.  
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level  
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the  
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method  
1015 of MIL-STD-883.  
(2) TA = +125°C, minimum.  
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests  
prior to burn-in are optional at the discretion of the manufacturer.  
c. Optional subgroup 12 is used for grading and part selection at +25°C, not included in PDA.  
TABLE II. Electrical test requirements.  
Subgroups  
(in accordance with  
MIL-STD-883 test requirements  
MIL-STD-883, method 5005,  
table I)  
Interim electrical parameters  
(method 5004)  
1
Final electrical test parameters  
1*, 2, 3, 4, 7, 12  
(method 5004)  
Group A test requirements  
1, 2, 3, 4, 7, 9, 10**, 11**, 12  
(method 5005)  
Groups C and D end-point  
electrical parameters  
(method 5005)  
1, 12  
* PDA applies to subgroup 1.  
** Subgroups 10 and 11 shall be guaranteed if not tested.  
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-  
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.  
4.3.1 Group A inspection.  
a. Tests shall be as specified in table II herein.  
b. Subgroups 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.  
c. Subgroups 7 shall include verification of the truth table (see figure 2).  
d. Optional subgroup 12 is used for grading and part selection at +25°C.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
12  
DSCC FORM 2234  
APR 97  
4.3.2 Groups C and D inspections.  
a. End-point electrical parameters shall be as specified in table II herein.  
b. Steady-state life test conditions, method 1005 of MIL-STD-883.  
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level  
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify  
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test  
method 1005 of MIL-STD-883.  
(2) TA = +125°C, minimum.  
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.  
5. PACKAGING  
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.  
6. NOTES  
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications  
(original equipment), design applications, and logistics purposes.  
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared  
specification or drawing.  
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the  
individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.  
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application  
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for  
coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should  
contact DSCC-VA, telephone (614) 692-0544.  
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614)  
692-0547.  
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-  
103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-  
VA.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-87763  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
A
SHEET  
13  
DSCC FORM 2234  
APR 97  
STANDARD MICROCIRCUIT DRAWING BULLETIN  
DATE: 04-01-27  
Approved sources of supply for SMD 5962-87763 are listed below for immediate acquisition information only and shall  
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised  
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of  
compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of  
MIL-HDBK-103 and QML-38535.  
Standard  
microcircuit drawing  
PIN 1/  
Vendor  
CAGE  
number  
Vendor  
similar  
PIN 2/  
5962-87763013A  
5962-87763013C  
5962-8776301LA  
3/  
AD7537SE/883B  
MX7537SE/883B  
AD7537SQ/883B  
MX7537SQ/883B  
AD7537TE/883B  
MX7537TE/883B  
AD7537TQ/883B  
MX7537TQ/883B  
AD7537UE/883B  
MX7537UE/883B  
AD7537UQ/883B  
MX7537UQ/883B  
1ES66  
24335  
1ES66  
3/  
5962-87763023A  
5962-87763023C  
5962-8776302LA  
1ES66  
24335  
1ES66  
3/  
5962-87763033A  
5962-87763033C  
5962-8776303LA  
1ES66  
24335  
1ES66  
1/ The lead finish shown for each PIN representing  
a hermetic package is the most readily available  
from the manufacturer listed for that part. If the  
desired lead finish is not listed contact the vendor  
to determine its availability.  
2/ Caution. Do not use this number for item  
acquisition. Items acquired to this number may not  
satisfy the performance requirements of this drawing.  
3/ Not available from an approved source.  
Vendor CAGE  
number  
Vendor name  
and address  
24335  
Analog Devices  
Rt 1 Industrial Park  
PO Box 9106  
Norwood, MA 02062  
Point of contact:  
Raheen Business Park  
Limerick, Ireland  
1ES66  
Maxim Integrated Products  
120 San Gabriel Dr  
Sunnyvale, CA 94086-5125  
The information contained herein is disseminated for convenience only and the  
Government assumes no liability whatsoever for any inaccuracies in the  
information bulletin.  

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