AD7609 [ADI]

8-Channel Differential DAS with 18-Bit, Bipolar, Simultaneous Sampling ADC; 8通道差分DAS 18位,双极性,同步采样ADC
AD7609
型号: AD7609
厂家: ADI    ADI
描述:

8-Channel Differential DAS with 18-Bit, Bipolar, Simultaneous Sampling ADC
8通道差分DAS 18位,双极性,同步采样ADC

文件: 总36页 (文件大小:788K)
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8-Channel Differential DAS with 18-Bit,  
Bipolar, Simultaneous Sampling ADC  
Data Sheet  
AD7609  
FEATURES  
APPLICATIONS  
8 simultaneously sampled inputs  
True differential inputs  
Power line monitoring and protection systems  
Multiphase motor control  
True bipolar analog input ranges: 10 V, 5 V  
Single 5 V analog supply and 2.3 V to 5.25 V VDRIVE  
Fully integrated data acquisition solution  
Analog input clamp protection  
Input buffer with 1 MΩ analog input impedance  
Second-order antialiasing analog filter  
On-chip accurate reference and reference buffer  
18-bit ADC with 200 kSPS on all channels  
Oversampling capability with digital filter  
Flexible parallel/serial interface  
SPI/QSPI™/MICROWIRE™/DSP compatible  
Performance  
7 kV ESD rating on analog input channels  
98 dB SNR, −107 dB THD  
Dynamic range: up to 105 dB typical  
Low power: 100 mW  
Standby mode: 25 mW  
64-lead LQFP package  
Instrumentation and control systems  
Multiaxis positioning systems  
Data acquisition systems (DAS)  
COMPANION PRODUCTS  
External References: ADR421, ADR431  
Digital Isolators: ADuM1402, ADuM5000, ADuM5402  
Power: ADIsimPower, Supervisor Parametric Search  
Additional companion products on the AD7609 product page  
Table 1. High Resolution, Bipolar Input, Simultaneous  
Sampling DAS Solutions  
Single-  
Ended  
Inputs  
True  
Number of  
Differential Simultaneous  
Inputs  
AD76091  
Resolution  
18 Bits  
16 Bits  
Sampling Channels  
AD7608  
AD7606  
AD7606-6  
AD7606-4  
AD7607  
8
8
6
4
8
14 Bits  
1 Patent pending.  
FUNCTIONAL BLOCK DIAGRAM  
AVCC  
AVCC  
REGCAP REGCAP REFCAPB REFCAPA  
RFB  
1MΩ  
V1+  
V1–  
CLAMP  
CLAMP  
T/H  
SECOND-  
ORDER LPF  
2.5V  
LDO  
2.5V  
LDO  
RFB  
RFB  
1MΩ  
1MΩ  
REFIN/REFOUT  
V2+  
V2–  
CLAMP  
CLAMP  
T/H  
T/H  
T/H  
T/H  
T/H  
T/H  
T/H  
SECOND-  
ORDER LPF  
RFB  
RFB  
1MΩ  
1MΩ  
REF SELECT  
AGND  
2.5V  
REF  
V3+  
V3–  
CLAMP  
CLAMP  
OS 2  
OS 1  
OS 0  
SECOND-  
ORDER LPF  
RFB  
RFB  
1MΩ  
1MΩ  
V4+  
V4–  
CLAMP  
CLAMP  
DOUT  
A
SECOND-  
ORDER LPF  
SERIAL  
RFB  
RFB  
1MΩ  
1MΩ  
DOUTB  
8:1  
MUX  
PARALLEL/  
SERIAL  
RD/SCLK  
CS  
DIGITAL  
FILTER  
18-BIT  
SAR  
V5+  
V5–  
CLAMP  
CLAMP  
INTERFACE  
SECOND-  
ORDER LPF  
RFB  
RFB  
1MΩ  
1MΩ  
PAR/SER SEL  
VDRIVE  
V6+  
V6–  
CLAMP  
CLAMP  
SECOND-  
ORDER LPF  
PARALLEL  
DB[15:0]  
RFB  
RFB  
1MΩ  
1MΩ  
AD7609  
V7+  
V7–  
CLAMP  
CLAMP  
SECOND-  
ORDER LPF  
CLK OSC  
RFB  
RFB  
1MΩ  
1MΩ  
BUSY  
CONTROL  
INPUTS  
V8+  
V8–  
CLAMP  
CLAMP  
SECOND-  
ORDER LPF  
FRSTDATA  
RFB  
1MΩ  
AGND  
CONVST A CONVST B RESET RANGE  
Figure 1.  
Rev. A  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700 www.analog.com  
Fax: 781.461.3113 ©2011–2012 Analog Devices, Inc. All rights reserved.  
 
 
 
 
AD7609  
Data Sheet  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Converter Details ....................................................................... 21  
Analog Input ............................................................................... 21  
ADC Transfer Function............................................................. 22  
Internal/External Reference...................................................... 23  
Typical Connection Diagram ................................................... 24  
Power-Down Modes .................................................................. 24  
Conversion Control ................................................................... 25  
Digital Interface.............................................................................. 26  
Applications....................................................................................... 1  
Companion Products....................................................................... 1  
Functional Block Diagram .............................................................. 1  
Revision History ............................................................................... 2  
General Description......................................................................... 3  
Specifications..................................................................................... 4  
Timing Specifications .................................................................. 7  
Absolute Maximum Ratings.......................................................... 11  
Thermal Resistance .................................................................... 11  
ESD Caution................................................................................ 11  
Pin Configuration and Function Descriptions........................... 12  
Typical Performance Characteristics ........................................... 15  
Terminology .................................................................................... 19  
Theory of Operation ...................................................................... 21  
PAR  
/SER SEL = 0)...................................... 26  
Parallel Interface (  
PAR  
Serial Interface (  
/SER SEL = 1)......................................... 26  
Reading During Conversion..................................................... 27  
Digital Filter ................................................................................ 28  
Layout Guidelines....................................................................... 32  
Outline Dimensions....................................................................... 34  
Ordering Guide .......................................................................... 34  
REVISION HISTORY  
2/12—Rev. 0 to Rev. A  
Changes to Analog Input Ranges Section ....................................21  
7/11—Revision 0: Initial Version  
Rev. A | Page 2 of 36  
 
Data Sheet  
AD7609  
GENERAL DESCRIPTION  
The AD7609 is an 18-bit, 8-channel, true differential,  
simultaneous sampling analog-to-digital data acquisition  
system (DAS). The part contains analog input clamp protection,  
a second-order antialiasing filter, a track-and-hold amplifier, an  
18-bit charge redistribution successive approximation analog-  
to-digital converter (ADC), a flexible digital filter, a 2.5 V  
reference and reference buffer, and high speed serial and  
parallel interfaces.  
The AD7609 operates from a single 5 V supply and can  
accommodate 10 V and 5 V true bipolar differential input  
signals while sampling at throughput rates up to 200 kSPS for  
all channels. The input clamp protection circuitry can tolerate  
voltages up to 16.5 V. T h e AD7609 has 1 MΩ analog input  
impedance regardless of sampling frequency. The single supply  
operation, on-chip filtering, and high input impedance elimi-  
nate the need for driver op amps and external bipolar supplies.  
The AD7609 antialiasing filter has a −3 dB cutoff frequency of  
32 kHz and provides 40 dB antialias rejection when sampling  
at 200 kSPS. The flexible digital filter is pin driven, yields  
improvements in SNR, and reduces the −3 dB bandwidth.  
Rev. A | Page 3 of 36  
 
AD7609  
Data Sheet  
SPECIFICATIONS  
VREF = 2.5 V external/internal, AVCC = 4.75 V to 5.25 V, VDRIVE = 2.3 V to 5.25 V; fSAMPLE = 200 kSPS, TA = TMIN to TMAX, unless otherwise  
noted.1  
Table 2.  
Parameter  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
DYNAMIC PERFORMANCE  
Signal-to-Noise Ratio (SNR)2, 3  
fIN = 1 kHz sine wave unless otherwise noted  
Oversampling by 16; 10 V range; fIN = 160 Hz  
Oversampling by 16; 5 V range; fIN = 160 Hz  
No oversampling; 10 V range  
No oversampling; 5 V range  
No oversampling; 10 V range  
No oversampling; 5 V range  
No oversampling; 10 V range  
No oversampling; 5 V range  
98  
101  
100  
91  
90.5  
91  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
90  
89.5  
89.5  
89  
Signal-to-(Noise + Distortion) (SINAD)2  
Dynamic Range  
90  
91.5  
90.5  
−107  
−110  
−108  
Total Harmonic Distortion (THD)2, 3  
No oversampling; 10 V range  
No oversampling; 5 V range  
−97  
−96  
Peak Harmonic or Spurious Noise (SFDR)2  
Intermodulation Distortion (IMD)2  
Second-Order Terms  
Third-Order Terms  
Channel-to-Channel Isolation2  
fa = 1 kHz, fb = 1.1 kHz  
−110  
−106  
−95  
dB  
dB  
dB  
fIN on unselected channels up to 160 kHz  
ANALOG INPUT FILTER  
Full Power Bandwidth  
−3 dB, 10 V range  
−3 dB, 5 V range  
−0.1 dB, 10 V range  
−0.1 dB, 5 V range  
10 V range  
32  
23  
13  
10  
7.1  
10.2  
kHz  
kHz  
kHz  
kHz  
µs  
tGROUP DELAY  
5 V range  
µs  
DC ACCURACY  
Resolution  
No missing codes  
18  
Bits  
Differential Nonlinearity2  
Integral Nonlinearity2  
Total Unadjusted Error (TUE)  
0.75  
3
10  
90  
8
40  
2
7
−0.99/+2  
7.5  
LSB4  
LSB  
LSB  
LSB  
LSB  
10 V range  
5 V range  
Positive Full-Scale Error2, 5  
External reference  
Internal reference  
External reference  
Internal reference  
10 V range  
140  
LSB  
Positive Full-Scale Error Drift  
Positive Full-Scale Error Matching2  
ppm/°C  
ppm/°C  
LSB  
LSB  
LSB  
12  
40  
3
80  
100  
24  
5 V range  
10 V range  
Bipolar Zero Code Error2,  
6
5 V range  
3
48  
LSB  
Bipolar Zero Code Error Drift  
Bipolar Zero Code Error Matching2  
Negative Full-Scale Error2, 5  
10 V range  
5 V range  
10 V range  
5 V range  
External reference  
Internal reference  
External reference  
Internal reference  
10 V range  
10  
5
2.7  
13  
8
40  
4
8
µV/°C  
µV/°C  
LSB  
LSB  
LSB  
30  
65  
140  
LSB  
Negative Full-Scale Error Drift  
Negative Full-Scale Error Matching2  
ppm/°C  
ppm/°C  
LSB  
12  
40  
80  
100  
5 V range  
LSB  
Rev. A | Page 4 of 36  
 
Data Sheet  
AD7609  
Parameter  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
ANALOG INPUT  
Differential Input Voltage Ranges  
VIN = Vx+ − (Vx−)  
RANGE = 1; 10 V  
RANGE = 0; 5 V  
−20  
−10  
−10  
+20  
+10  
+10  
V
V
V
Absolute Voltage Input  
10 V range, see the Analog Input Clamp  
Protection section  
5 V range, see the Analog Input Clamp  
Protection section  
−5  
−4  
+5  
+4  
V
Common-Mode Input Range  
CMRR  
Analog Input Current  
5
−70  
5.4  
2.5  
5
V
dB  
µA  
µA  
pF  
MΩ  
10 V, see Figure 28  
5 V, see Figure 28  
Input Capacitance7  
Input Impedance  
1
REFERENCE INPUT/OUTPUT  
Reference Input Voltage Range  
DC Leakage Current  
2.475  
2.5  
7.5  
2.49/  
2.505  
2.525  
1
V
µA  
pF  
V
Input Capacitance7  
REF SELECT = 1  
REFIN/REFOUT  
Reference Output Voltage  
Reference Temperature Coefficient  
LOGIC INPUTS  
10  
ppm/°C  
Input High Voltage (VINH  
)
0.7 × VDRIVE  
V
Input Low Voltage (VINL  
Input Current (IIN)  
Input Capacitance (CIN)7  
LOGIC OUTPUTS  
)
0.3 × VDRIVE  
2
V
µA  
pF  
5
Output High Voltage (VOH  
)
ISOURCE = 100 µA  
ISINK = 100 µA  
VDRIVE − 0.2  
V
V
µA  
pF  
Output Low Voltage (VOL  
)
0.2  
20  
Floating-State Leakage Current  
Floating-State Output Capacitance7  
Output Coding  
1
5
Twos complement  
CONVERSION RATE  
Conversion Time  
Track-and-Hold Acquisition Time  
Throughput Rate  
All eight channels included  
Per channel, all eight channels included  
4
1
µs  
µs  
kSPS  
200  
POWER REQUIREMENTS  
AVCC  
VDRIVE  
4.75  
2.3  
5.25  
5.25  
V
V
ITOTAL  
Digital inputs = 0 V or VDRIVE  
fSAMPLE = 200 kSPS  
Normal Mode (Static)  
Normal Mode (Operational)8  
Standby Mode  
16  
20  
5
22  
28.5  
8
mA  
mA  
mA  
µA  
Shutdown Mode  
2
11  
Rev. A | Page 5 of 36  
AD7609  
Data Sheet  
Parameter  
Test Conditions/Comments  
Min  
Typ  
Max  
Unit  
Power Dissipation  
Normal Mode (Static)  
Normal Mode (Operational)8  
Standby Mode  
80  
100  
25  
115.5  
157  
42  
mW  
mW  
mW  
µW  
fSAMPLE = 200 kSPS  
Shutdown Mode  
10  
60.5  
1 Temperature range for B version is −40°C to +85°C.  
2 See the Terminology section.  
3 This specification applies when reading during a conversion or after a conversion. If reading during a conversion in parallel and serial modes with VDRIVE = 5 V, SNR typically reduces  
by 1.5 dB and THD by 3 dB.  
4 LSB means least significant bit. With 5 V input range, 1 LSB = 76.29 µV. With 10 V input range, 1 LSB = 152.58 µV.  
5 These specifications include the full temperature range variation and contribution from the internal reference buffer but do not include the error contribution from  
the external reference.  
6 Bipolar zero code error is calculated with respect to the analog input voltage. See the Analog Input Clamp Protection section.  
7 Sample tested during initial release to ensure compliance.  
8 Operational power/current figure includes contribution when running in oversampling mode.  
Rev. A | Page 6 of 36  
 
 
 
 
 
 
 
Data Sheet  
AD7609  
TIMING SPECIFICATIONS  
AVCC = 4.75 V to 5.25 V, VDRIVE = 2.3 V to 5.25 V, VREF = 2.5 V external reference/ internal reference, TA = TMIN to TMAX  
,
unless otherwise noted.1  
Table 3.  
Limit at TMIN, TMAX  
Parameter  
Min  
Typ Max Unit Description  
PARALLEL/SERIAL/BYTE MODE  
tCYCLE  
1/throughput rate  
Parallel mode, reading during; or after conversion VDRIVE = 2.7 V to 5.25 V; or  
5
µs  
µs  
serial mode: VDRIVE = 3.3 V to 5.25 V, reading during a conversion using DOUT  
A
and DOUTB lines  
Parallel mode reading after conversion VDRIVE = 2.3 V  
Serial mode reading after conversion; VDRIVE = 2.7 V, DOUTA and DOUTB lines  
Serial mode reading after a conversion; VDRIVE = 2.3 V, DOUTA and DOUTB lines  
Conversion time  
Oversampling off  
Oversampling by 2  
Oversampling by 4  
Oversampling by 8  
Oversampling by 16  
Oversampling by 32  
Oversampling by 64  
5
4
10.1 µs  
11.5 µs  
tCONV  
3.45  
7.87  
16.05  
33  
66  
133  
257  
4.15 µs  
9.1  
18.8 µs  
39  
µs  
µs  
µs  
µs  
µs  
µs  
78  
158  
315  
100  
tWAKE-UP STANDBY  
STBY rising edge to CONVST x rising edge; power-up time from standby mode  
tWAKE-UP SHUTDOWN  
Internal Reference  
30  
13  
ms  
ms  
STBY rising edge to CONVST x rising edge; power-up time from  
shutdown mode  
STBY rising edge to CONVST x rising edge; power-up time from  
shutdown mode  
External Reference  
tRESET  
tOS_SETUP  
tOS_HOLD  
t1  
t2  
t3  
t4  
50  
20  
20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
ns  
ns  
RESET high pulse width  
BUSY to OS x pin setup time  
BUSY to OS x pin hold time  
CONVST x high to BUSY high  
Minimum CONVST x low pulse  
Minimum CONVST x high pulse  
BUSY falling edge to CS falling edge setup time  
45  
25  
25  
0
2
t5  
0.5  
25  
Maximum delay allowed between CONVST A, CONVST B rising edges  
Maximum time between last CS rising edge and BUSY falling edge  
Minimum delay between RESET low to CONVST x high  
t6  
t7  
25  
PARALLEL READ OPERATION  
t8  
0
0
ns  
ns  
CS to RD setup time  
t9  
CS to RD hold time  
t10  
RD low pulse width  
19  
24  
30  
37  
15  
22  
ns  
ns  
ns  
ns  
ns  
ns  
VDRIVE above 4.75 V  
VDRIVE above 3.3 V  
VDRIVE above 2.7 V  
VDRIVE above 2.3 V  
RD high pulse width  
CS high pulse width (see Figure 5); CS and RD linked  
t11  
t12  
Rev. A | Page 7 of 36  
 
 
AD7609  
Data Sheet  
Limit at TMIN, TMAX  
Min Typ Max Unit Description  
Parameter  
t13  
Delay from CS until DB[15:0] three-state disabled  
VDRIVE above 4.75 V  
VDRIVE above 3.3 V  
VDRIVE above 2.7 V  
VDRIVE above 2.3 V  
Data access time after RD falling edge  
VDRIVE above 4.75 V  
VDRIVE above 3.3 V  
VDRIVE above 2.7 V  
VDRIVE above 2.3 V  
19  
24  
30  
37  
ns  
ns  
ns  
ns  
3
t14  
19  
24  
30  
37  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t15  
t16  
t17  
6
6
Data hold time after RD falling edge  
CS to DB[15:0] hold time  
Delay from CS rising edge to DB[15:0] three-state enabled  
22  
SERIAL READ OPERATION  
fSCLK  
Frequency of serial read clock  
20  
15  
MHz VDRIVE above 4.75 V  
MHz VDRIVE above 3.3 V  
12.5 MHz VDRIVE above 2.7 V  
10  
MHz VDRIVE above 2.3 V  
t18  
Delay from CS until DOUTA/DOUTB three-state disabled/delay from CS until  
MSB valid  
18  
23  
35  
ns  
ns  
ns  
VDRIVE above 4.75 V  
VDRIVE above 3.3 V  
VDRIVE = 2.3 V to 2.7 V  
Data access time after SCLK rising edge  
VDRIVE above 4.75 V  
VDRIVE above 3.3 V  
VDRIVE above 2.7 V  
VDRIVE above 2.3 V  
SCLK low pulse width  
3
t19  
20  
26  
32  
39  
ns  
ns  
ns  
ns  
ns  
ns  
t20  
t21  
t22  
t23  
0.4 tSCLK  
0.4 tSCLK  
7
SCLK high pulse width  
SCLK rising edge to DOUTA/DOUTB valid hold time  
CS rising edge to DOUTA/DOUTB three-state enabled  
22  
ns  
FRSTDATA OPERATION  
t24  
Delay from CS falling edge until FRSTDATA three-state disabled  
VDRIVE above 4.75 V  
VDRIVE above 3.3 V  
VDRIVE above 2.7 V  
VDRIVE above 2.3 V  
Delay from CS falling edge until FRSTDATA high, serial mode  
VDRIVE above 4.75 V  
VDRIVE above 3.3 V  
VDRIVE above 2.7 V  
VDRIVE above 2.3 V  
18  
23  
30  
35  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t25  
18  
23  
30  
35  
t26  
Delay from RD falling edge to FRSTDATA high  
VDRIVE above 4.75 V  
VDRIVE above 3.3 V  
VDRIVE above 2.7 V  
VDRIVE above 2.3 V  
19  
23  
30  
35  
ns  
ns  
ns  
ns  
Rev. A | Page 8 of 36  
Data Sheet  
AD7609  
Limit at TMIN, TMAX  
Min Typ Max Unit Description  
Parameter  
t27  
Delay from RD falling edge to FRSTDATA low  
VDRIVE = 3.3 V to 5.25 V  
VDRIVE = 2.3 V to 2.7 V  
Delay from 18th SCLK falling edge to FRSTDATA low  
22  
29  
ns  
ns  
t28  
20  
27  
29  
ns  
ns  
ns  
VDRIVE = 3.3 V to 5.25 V  
VDRIVE = 2.3 V to 2.7 V  
Delay from CS rising edge until FRSTDATA three-state enabled  
t29  
1 Sample tested during initial release to ensure compliance. All input signals are specified with tR = tF = 5 ns (30% to 70% of VDD) and timed from a voltage level of 1.6 V.  
2 The delay between the CONVST x signals was measured as the maximum time allowed while ensuring a <40 LSB performance matching between channel sets.  
3 A buffer is used on the data output pins for these measurements, which is equivalent to a load of 20 pF on the output pins.  
Timing Diagrams  
t5  
CONVST A/  
CONVST B  
tCYCLE  
t2  
CONVST A/  
CONVST B  
t3  
tCONV  
t1  
BUSY  
t4  
CS  
t7  
tRESET  
RESET  
Figure 2. CONVST x Timing—Reading After a Conversion  
t5  
CONVST A/  
CONVST B  
tCYCLE  
t2  
CONVST A/  
CONVST B  
t3  
tCONV  
t1  
BUSY  
t6  
CS  
t7  
tRESET  
RESET  
Figure 3. CONVST x Timing—Reading During a Conversion  
CS  
RD  
t9  
t8  
t13  
t11  
t10  
t16  
t17  
t14  
V2  
t15  
V8  
V1  
[17:2]  
V1  
[1:0]  
V2  
[1:0]  
V8  
[1:0]  
DATA:  
DB[15:0]  
INVALID  
t24  
[17:2]  
[17:2]  
t26  
t27  
t29  
FRSTDATA  
CS  
RD  
Pulses  
Figure 4. Parallel Mode Separate and  
Rev. A | Page 9 of 36  
 
 
 
 
 
 
AD7609  
Data Sheet  
t12  
CS, RD  
t16  
t13  
V1  
t17  
V1  
[1:0]  
V2  
[17:2]  
V2  
[1:0]  
V7  
[17:2]  
V7  
[1:0]  
V8  
[17:2]  
V8  
[1:0]  
DATA:  
DB[15:0]  
[17:2]  
FRSTDATA  
CS  
RD  
Figure 5. and  
Linked Parallel Mode  
CS  
t21  
t20  
SCLK  
t19  
t22  
DB1  
t23  
t18  
D
D
A,  
B
OUT  
OUT  
DB17  
t25  
DB14  
DB13  
DB0  
t28  
t29  
FRSTDATA  
Figure 6. Serial Read Operation  
Rev. A | Page 10 of 36  
 
 
 
Data Sheet  
AD7609  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Table 4.  
Parameter  
Rating  
AVCC to AGND  
VDRIVE to AGND  
−0.3 V to +7 V  
−0.3 V to AVCC + 0.3 V  
16.5 V  
−0.3 V to VDRIVE + 0.3 V  
−0.3 V to VDRIVE + 0.3 V  
−0.3 V to AVCC + 0.3 V  
10 mA  
Analog Input Voltage to AGND1  
Digital Input Voltage to AGND  
Digital Output Voltage to AGND  
REFIN to AGND  
Input Current to Any Pin Except  
Supplies1  
THERMAL RESISTANCE  
θJA is specified for the worst-case conditions, that is, a device  
soldered in a circuit board for surface-mount packages. These  
specifications apply to a 4-layer board.  
Operating Temperature Range  
B Version  
Storage Temperature Range  
Junction Temperature  
Pb/SN Temperature, Soldering  
Reflow (10 sec to 30 sec)  
Table 5. Thermal Resistance  
Package Type  
−40°C to +85°C  
−65°C to +150°C  
150°C  
θJA  
θJC  
Unit  
64-Lead LQFP  
45  
11  
°C/W  
240(+0)°C  
ESD CAUTION  
Pb-Free Temperature, Soldering Reflow 260(+0)°C  
ESD (All Pins Except Analog Inputs)  
ESD (Analog Input Pins Only)  
2 kV  
7 kV  
1 Transient currents of up to 100 mA do not cause SCR latch-up.  
Rev. A | Page 11 of 36  
 
 
 
 
 
AD7609  
Data Sheet  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49  
1
AV  
48  
AV  
CC  
CC  
ANALOG INPUT  
PIN 1  
2
3
47 AGND  
46  
AGND  
OS 0  
DECOUPLING CAPACITOR PIN  
POWER SUPPLY  
REFGND  
4
5
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
OS 1  
OS 2  
REFCAPB  
REFCAPA  
REFGND  
REFIN/REFOUT  
AGND  
GROUND PIN  
6
DATA OUTPUT  
PAR/SER SEL  
AD7609  
7
STBY  
TOP VIEW  
DIGITAL OUTPUT  
DIGITAL INPUT  
(Not to Scale)  
8
RANGE  
9
AGND  
CONVST A  
CONVST B  
RESET  
REFERENCE INPUT/OUTPUT  
10  
11  
12  
13  
REGCAP  
AV  
CC  
AV  
CC  
RD/SCLK  
REGCAP  
CS  
BUSY 14  
35 AGND  
FRSTDATA 15  
34 REF SELECT  
33 DB15  
DB0  
16  
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32  
Figure 7. Pin Configuration  
Table 6. Pin Function Descriptions  
Pin No.  
Type1 Mnemonic Description  
1, 37, 38, 48  
P
AVCC  
Analog Supply Voltage 4.75 V to 5.25 V. This supply voltage is applied to the internal front-end  
amplifiers and to the ADC core. These supply pins should be decoupled to AGND.  
2, 26, 35,  
40, 41, 47  
P
AGND  
Analog Ground. This pin is the ground reference point for all analog circuitry on the AD7609. All  
analog input signals and external reference signals should be referred to these pins. All six of these  
AGND pins should connect to the AGND plane of a system.  
23  
P
VDRIVE  
Logic Power Supply Input. The voltage (2.3 V to 5 V) supplied at this pin determines the operating  
voltage of the interface. This pin is nominally at the same supply as the supply of the host interface  
(that is, DSP, FPGA).  
36, 39  
P
REGCAP  
Decoupling Capacitor Pins for Voltage Output from Internal Regulator. These output pins should be  
decoupled separately to AGND using a 1 μF capacitor. The voltage on these output pins is in the  
range of 2.5 V to 2.7 V.  
49, 51, 53,  
55, 57, 59,  
61, 63  
50, 52, 54,  
56, 58, 60,  
62, 64  
AI+  
AI−  
REF  
V1+ to V8+ Analog Input V1+ to Analog Input V8+. These pins are the positive terminal of the true differential  
analog inputs. The analog input range of these channels is determined by the RANGE pin.  
V1− to V8− Analog Input V1− to Analog Input V8−. These are the negative terminals of the true differential  
analog inputs. The analog input range of these channels is determined by the RANGE pin. The signal  
on this pin should be 180° out of phase with the corresponding Vx+ pin.  
42  
REFIN/  
REFOUT  
Reference Input/ Reference Output. The on-chip reference of 2.5 V is available on this pin for external  
use if the REF SELECT pin is set to a logic high. Alternatively, the internal reference can be disabled by  
setting the REF SELECT pin to a logic low and an external reference of 2.5 V can be applied to this  
input. See the Internal/External Reference section. Decoupling is required on this pin for both the  
internal or external reference options. A 10 µF capacitor should be applied from this pin to ground  
close to the REFGND pins.  
34  
DI  
REF SELECT Internal/External Reference Selection Input. Logic input. If this pin is set to logic high, the internal  
reference is selected and is enabled. If this pin is set to logic low, the internal reference is disabled and  
an external reference voltage must be applied to the REFIN/REFOUT pin.  
44, 45  
43, 46  
REF  
REF  
REFCAPA,  
REFCAPB  
REFGND  
Reference Buffer Output Force/Sense Pins. These pins must be connected together and decoupled to  
AGND using a low ESR 10 μF ceramic capacitor.  
Reference Ground Pins. These pins should be connected to AGND.  
Rev. A | Page 12 of 36  
 
Data Sheet  
AD7609  
Pin No.  
Type1 Mnemonic Description  
8
DI  
DI  
DI  
RANGE  
Analog Input Range Selection. Logic input. The polarity on this pin determines the input range of the  
analog input channels. If this pin is tied to a logic high, the analog input range is 10 V for all  
channels. If this pin is tied to a logic low, the analog input range is 5 V for all channels. A logic  
change on this pin has an immediate effect on the analog input range. Changing this pin during a  
conversion is not recommended. See the Analog Input section for more details.  
Parallel/Serial Interface Selection Input. Logic input. If this pin is tied to a logic low, the parallel  
interface is selected. If this pin is tied to a logic high, the serial interface is selected.  
In serial mode, the RD/SCLK pin functions as the serial clock input. The DB7/DOUTA and DB8/DOUTB pins  
function as serial data outputs.  
6
PAR/  
SER SEL  
When the serial interface is selected, the DB[15:9] and DB[6:0] pins should be tied to AGND.  
9, 10  
CONVST A,  
CONVST B  
Conversion Start Input A, Conversion Start Input B. Logic inputs. These logic inputs are used to initiate  
conversions on the analog input channels. For simultaneous sampling of all input channels, CONVST A  
and CONVST B can be shorted together and a single conversion start signal applied. Alternatively,  
CONVST A can be used to initiate simultaneous sampling for V1, V2, V3, and V4, and CONVST B can be  
used to initiate simultaneous sampling on the other analog inputs (V5, V6, V7, and V8). This is only  
possible when oversampling is not switched on. When the CONVST A or CONVST B pin transitions  
from low to high, the front-end track-and-hold circuitry for their respective analog inputs is set to  
hold. This function allows a phase delay to be created inherently between the sets of analog inputs.  
13  
12  
DI  
DI  
CS  
Chip Select. This active low logic input frames the data transfer. When both CS and RD are logic low in  
parallel mode, the output bus (DB[15:0]) is enabled and the conversion result is output on the parallel  
data bus lines. In serial mode, the CS is used to frame the serial read transfer and clocks out the MSB  
of the serial output data.  
Parallel Data Read Control Input When Parallel Interface is Selected (RD)/Serial Clock Input When  
Serial Interface is Selected (SCLK). When both CS and RD are logic low in parallel mode, the output  
bus is enabled. In parallel mode, two RD pulses are required to read the full 18 bits of conversion  
results from each channel. The first RD pulse outputs DB[17:2], and the second RD pulses outputs  
DB[1:0]. In serial mode, this pin acts as the serial clock input for data transfers. The CS falling edge  
takes the data output lines, DOUTA and DOUTB, out of three-state and clocks out the MSB of the  
conversion result. The rising edge of SCLK clocks all subsequent data bits onto the serial data  
outputs, DOUTA and DOUTB. For further information, see the Conversion Control section.  
RD/SCLK  
14  
DO  
BUSY  
Busy Output. This pin transitions to a logic high after both CONVST A and CONVST B rising edges and  
indicates that the conversion process has started. The BUSY output remains high until the conversion  
process for all channels is complete. The falling edge of BUSY signals that the conversion data is being  
latched into the output data registers and will be available to be read after a time, t4. Any data read  
while BUSY is high should be complete before the falling edge of BUSY occurs. Rising edges on  
CONVST A or CONVST B have no effect while the BUSY signal is high.  
11  
15  
DI  
RESET  
Reset Input. When set to logic high, the rising edge of RESET resets the AD7609. The part must receive  
a RESET pulse after power-up. To achieve the specified performance after the RESET signal, the tWAKE_UP  
SHUTDOWN time should elapse between power-on and the RESET pulse. The RESET high pulse should be  
typically 100 ns wide. If a RESET pulse is applied during a conversion, the conversion is aborted. If a  
RESET pulse is applied during a read, the contents of the output registers reset to all zeros.  
Digital Output. The FRSTDATA output signal indicates when the first channel, V1, is being read back  
on either the parallel or serial interface. When the CS input is high, the FRSTDATA output pin is in  
three-state. The falling edge of CS takes FRSTDATA out of three-state. In parallel mode, the falling  
edge of RD corresponding to the result of V1 then sets the FRSTDATA pin high, indicating that the  
result from V1 is available on the output data bus. The FRSTDATA output returns to a logic low  
following the third falling edge of RD. In serial mode, FRSTDATA goes high on the falling edge of CS  
as this clocks out the MSB of V1 on DOUTA. It returns low on the 18th SCLK falling edge after the CS  
falling edge. See the Conversion Control section for more details.  
DO  
FRSTDATA  
7
DI  
STBY  
Standby Mode Input. This pin is used to place the AD7609 into one of two power-down modes:  
standby mode or shutdown mode. The power-down mode entered depends on the state of the  
RANGE pin, as shown in Table 8. When in standby mode, all circuitry except the on-chip reference,  
regulators, and regulator buffers is powered down. When in shutdown mode, all circuitry is  
powered down.  
Rev. A | Page 13 of 36  
AD7609  
Data Sheet  
Pin No.  
Type1 Mnemonic Description  
DI OS [2:0]  
5, 4, 3  
Oversampling Mode Pins. Logic inputs. These inputs are used to select the oversampling ratio. OS 2 is  
the MSB control bit, and OS 0 is the LSB control bit. See the Digital Filter section for additional details  
on the oversampling mode of operation and Table 9 for oversampling bit decoding.  
33  
DO/DI DB15  
DO/DI DB14  
Parallel Output Data Bits, Data Bit 15. When PAR/SER SEL = 0, this pin acts as three-state parallel digital  
output pin. This pin is used to output DB17 of the conversion result during the first RD pulse and DB1  
of the same conversion result during the second RD pulse. When PAR/SER SEL = 1, this pin should be  
tied to AGND.  
Parallel Output Data Bits, Data Bit 14. When PAR/SER SEL = 0, this pin acts as three-state parallel digital  
output pin. When CS and RD are low, this pin is used to output DB16 of the conversion result during  
the first RD pulse and DB0 of the same conversion result during the second RD pulse. When PAR/SER  
SEL = 1, this pin should be tied to AGND.  
32  
31 to 27  
24  
DO  
DO  
DO  
DO  
DB[13:9]  
Parallel Output Data Bits, Data Bit 13 to Data Bit 9. When PAR/SER SEL = 0, these pins act as three-state  
parallel digital input/output pins. When CS and RD are low, these pins are used to output DB15 to  
DB11 of the conversion result during the first RD pulse and output 0 during the second RD pulse.  
When PAR/SER SEL = 1, these pins should be tied to AGND.  
DB7/DOUT  
DB8/DOUT  
DB[6:0]  
A
B
Parallel Output Data Bit 7 (DB7)/Serial Interface Data Output Pin (DOUTA). When PAR/SER SEL = 0, this  
pins acts as a three-state parallel digital input/output pin. When CS and RD are low, this pin is used to  
output DB9 of the conversion result. When PAR/SER SEL = 1, this pin functions as DOUTA and outputs  
serial conversion data. See the Conversion Control section for further details.  
Parallel Output Data Bit 8 (DB8)/Serial Interface Data Output Pin (DOUTB). When PAR/SER SEL = 0, this  
pins acts as a three-state parallel digital input/output pin. When CS and RD are low, this pin is used to  
output DB10 of the conversion result. When PAR/SER SEL = 1, this pin functions as DOUTB and outputs  
serial conversion data. See the Conversion Control section for further details.  
Parallel Output Data Bits, Data Bit 6 to Data Bit 0. When PAR/SER SEL = 0, these pins act as three-state  
parallel digital input/output pins. When CS and RD are low, these pins are used to output DB8 to DB2  
of the conversion result during the first RD pulse and output 0 during the second RD pulse. When  
PAR/SER SEL = 1, these pins should be tied to AGND.  
25  
22 to 16  
1 Refers to classification of pin type; P denotes power, AI denotes analog input, REF denotes reference, DI denotes digital input, DO denotes digital output.  
Rev. A | Page 14 of 36  
 
Data Sheet  
AD7609  
TYPICAL PERFORMANCE CHARACTERISTICS  
3
2
0
AV , V  
= 5V  
CC DRIVE  
INTERNAL REFERENCE  
±10V RANGE  
fSAMPLE = 200 kSPS  
fIN = 1kHz  
–20  
–40  
1
16384 POINT FFT  
SNR = 91.52dB  
–60  
0
THD = –111.05dB  
–80  
±10V RANGE  
–1  
–2  
–3  
AV , V  
= 5V  
CC DRIVE  
= 25°C  
–100  
–120  
–140  
–160  
T
A
fSAMPLE = 200 kSPS  
WCP INL = 1.69 LSB  
WCN INL = –1.3 LSB  
0
20k  
40k  
60k  
80k  
100k  
CODE  
INPUT FREQUENCY (Hz)  
Figure 8. FFT Plot, 10 V Range  
Figure 11. Typical INL, 10 V Range  
1.0  
0.8  
±10V RANGE  
0
AV , V = 5V  
CC DRIVE  
T
= 25°C  
AV , V  
CC DRIVE  
INTERNAL REFERENCE  
±5V RANGE  
fSAMPLE = 200kSPS  
f IN = 1kHz  
16,384 POINT FFT  
= 5V  
fSAAMPLE = 200 kSPS  
WCP DNL = 0.33 LSB  
WCN DNL = –0.32 LSB  
0.6  
–20  
–40  
0.4  
0.2  
–60  
SNR = 91.12dB  
0
THD = –109.77dB  
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
–80  
–100  
–120  
–140  
–160  
0
20k  
40k  
60k  
80k  
100k  
INPUT FREQUENCY (Hz)  
CODE  
Figure 9. FFT Plot, 5 V Range  
Figure 12. Typical DNL, 10 V Range  
3
2
0
AV , V  
CC  
= 5V  
DRIVE  
–20  
–40  
INTERNAL REFERENCE  
±10V RANGE  
fSAMPLE = 12.5kSPS  
fIN = 1Hz  
1
8192 POINT FFT  
SNR = 100.71dB  
THD: –111.74dB  
–60  
0
–80  
–1  
–2  
–3  
±5V RANGE  
AV , V  
CC DRIVE  
= 5V  
–100  
–120  
–140  
–160  
T
= 25°C  
A
fSAMPLE = 200 kSPS  
WCP INL = 1.56 LSB  
WCN INL = –1.22 LSB  
0
1
2
3
4
5
6
INPUT FREQUENCY (kHz)  
CODE  
Figure 10. FFT Plot, 10 V Range  
Figure 13. Typical INL, 5 V Range  
Rev. A | Page 15 of 36  
 
AD7609  
Data Sheet  
1.0  
±5V RANGE  
AV , V  
= 5V  
0.8  
CC DRIVE  
40  
32  
T
= 25°C  
fSAAMPLE = 200 kSPS  
WCP INL = 0.45 LSB  
WCN INL = –0.38 LSB  
0.6  
PFS ERROR  
NFS ERROR  
0.4  
24  
0.2  
16  
0
8
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
0
–8  
–16  
–24  
–32  
–40  
±10V RANGE  
AV , V  
= 5V  
CC DRIVE  
EXTERNAL REFERENCE  
–40  
–25  
–10  
5
20  
35 50 65 80  
TEMPERATURE (°C)  
CODE  
Figure 17. NFS and PFS Error Matching  
Figure 14. Typical DNL, 5 V Range  
10  
8
80  
60  
40  
±10V RANGE  
6
20  
±5V RANGE  
4
0
–20  
–40  
–60  
AV , V  
= 5V  
2
CC DRIVE  
fSAMPLE = 200 kSPS  
= 25°C  
T
A
EXTERNAL REFERENCE  
SOURCE RESISTANCE IS MATCHED ON  
THE V– INPUT  
0
200kSPS  
AV , V  
= 5V  
CC DRIVE  
±10V AND ±5V RANGE  
EXTERNAL REFERENCE  
35 50 65 80  
TEMPERATURE (°C)  
–2  
–80  
–40  
0
20k  
40k  
60k  
80k  
100k  
120k  
–25  
–10  
5
20  
SOURCE RESISTANCE ()  
Figure 18. PFS and NFS Error vs. Source Resistance  
Figure 15. NFS Error vs. Temperature  
105  
80  
60  
AV , V  
= 5V  
fSAMPLE CHANGES WITH OS RATE  
= 25°C  
CC DRIVE  
T
A
100  
95  
INTERNAL REFERENCE  
±10V RANGE  
40  
20  
0
±5V RANGE  
±10V RANGE  
90  
–20  
–40  
–60  
NO OS  
OS × 2  
OS × 4  
OS × 8  
OS × 16  
OS × 32  
OS × 64  
85  
200kSPS  
AV , V  
= 5V  
CC DRIVE  
EXTERNAL REFERENCE  
35 50 65 80  
TEMPERATURE (°C)  
80  
–80  
–40  
10  
100  
10k  
INPUT FREQUENCY (Hz)  
10k  
100k  
–25  
–10  
5
20  
Figure 19. SNR vs. Input Frequency, 10 V Range  
Figure 16. PFS Error vs. Temperature  
Rev. A | Page 16 of 36  
Data Sheet  
AD7609  
8
6
105  
AV , V  
= 5V  
fSAMPLE CHANGES WITH OS RATE  
= 25°C  
CC DRIVE  
T
A
100  
95  
INTERNAL REFERENCE  
±5V RANGE  
4
2
0
90  
±5V RANGE  
NO OS  
OS × 2  
OS × 4  
OS × 8  
OS × 16  
OS × 32  
OS × 64  
–2  
–4  
–6  
±10V RANGE  
85  
80  
200 kSPS  
AV ,V  
= 5V  
CC DRIVE  
EXTERNAL REFERENCE  
10  
100  
10k  
INPUT FREQUENCY (Hz)  
10k  
100k  
–40  
–20  
0
20  
40  
60  
80  
TEMPERATURE (°C)  
Figure 23. Bipolar Zero Code Error vs. Temperature  
Figure 20. SNR vs. Input Frequency, 5 V Range  
–60  
–70  
±10V RANGE  
16  
12  
8
AV , V  
= 5V  
CC DRIVE  
T
= 25°C  
fSAAMPLE = 200 kSPS  
±5V RANGE  
±10V RANGE  
R
MATCHED  
SOURCE  
ON V +, V – INPUTS  
x
x
–80  
4
–90  
0Ω  
10Ω  
0
500Ω  
1.2kΩ  
5kΩ  
–100  
–110  
–120  
–4  
–8  
–12  
10kΩ  
200kSPS  
AV , V  
= 5V  
CC DRIVE  
EXTERNAL REFERENCE  
35 50 65 80  
TEMPERATURE (°C)  
1
10  
100  
–16  
–40  
FREQUENCY (kHz)  
–25  
–10  
5
20  
Figure 24. Bipolar Zero Code Error Matching Between Channels  
Figure 21. THD vs. Input Frequency for Various Source Impedances,  
10 V Range  
–50  
–40  
AV , V  
CC DRIVE  
INTERNAL REFERENCE  
AD7609 RECOMMENDED DECOUPLING USED  
= 5V  
±5V RANGE  
–60  
–70  
AV , V  
= 5V  
–50  
–60  
CC DRIVE  
T
= 25°C  
fSAAMPLE = 200 kSPS  
fSAMPLE = 200kSPS  
T
= 25°C  
A
R
MATCHED  
SOURCE  
ON V +, V – INPUTS  
–80  
x
x
±10V RANGE  
–70  
–90  
±5V RANGE  
–80  
–100  
–110  
–120  
–130  
–140  
0Ω  
10Ω  
500Ω  
1.2kΩ  
5kΩ  
–90  
–100  
–110  
–120  
10kΩ  
0
20  
40  
60  
80  
100  
120  
140  
160  
1
10  
100  
NOISE FREQUENCY (kHz)  
FREQUENCY (kHz)  
Figure 25. Channel-to-Channel Isolation  
Figure 22. THD vs. Input Frequency for Various Source Impedances,  
5 V Range  
Rev. A | Page 17 of 36  
AD7609  
Data Sheet  
110  
105  
100  
95  
22  
20  
18  
16  
14  
12  
10  
8
±10V RANGE  
±5V RANGE  
90  
AV = V  
CC DRIVE  
= 5V  
AV , V  
= 5V  
CC DRIVE  
T
= 25°C  
85  
80  
A
T
= 25°C  
A
INTERNAL REFERENCE  
INTERNAL REFERENCE  
fSAMPLE VARIES WITH OS RATE  
fSAMPLE SCALES WITH OS RATIO  
NO OS OS × 2 OS × 4 OS × 8 OS × 16 OS × 32 OS × 64  
OVERSAMPLING RATIO  
NO OS  
OS × 2  
OS × 4  
OS × 8  
OS × 16 OS × 32 OS × 64  
OVERSAMPLING RATIO  
Figure 26. Dynamic Range vs. Oversampling Ratio  
Figure 29. Supply Current vs. Oversampling Rate  
140  
130  
120  
110  
100  
90  
2.5010  
2.5005  
2.5000  
2.4995  
2.4990  
2.4985  
2.4980  
AV  
= 5.25V  
CC  
AV  
AV  
= 5V  
CC  
CC  
±10V RANGE  
±5V RANGE  
= 4.75V  
80  
AV , V  
= 5V  
CC DRIVE  
INTERNAL REFERENCE  
AD7609 RECOMMENDED DECOUPLING USED  
70  
fSAMPLE = 200kSPS  
T
= 25°C  
A
60  
0
100 200 300 400 500 600 700 800 900 1000 1100  
–40  
–25  
–10  
5
20  
35  
50  
65  
80  
AV  
NOISE FREQUENCY (kHz)  
CC  
TEMPERATURE (°C)  
Figure 27. Reference Output Voltage vs. Temperature for Different Supply  
Voltages  
Figure 30. PSRR  
10  
0
AV , V  
CC DRIVE  
= 5V  
AV , V  
= 5V  
CC DRIVE  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
T = 25°C  
fSAAMPLE = 200kSPS  
fSAMPLE = 200kSPS  
INTERNAL REFERENCE  
5
0
±5V RANGE  
–5  
±10V RANGE  
+25°C V+  
+25°C V–  
+85°C V–  
+85°C V+  
–40°C V–  
–40°C V+  
–10  
–15  
–20  
10  
100  
1k  
FREQUENCY (Hz)  
10k  
100k  
–15  
–10  
–5  
0
5
10  
15  
20  
DIFFERENTIAL ANALOG INPUT VOLTAGE (Vx+ – (Vx–)) (V)  
Figure 28. Analog Input Current vs. Input Voltage Over Temperature  
Figure 31. CMRR vs. Common-Mode Ripple Frequency  
Rev. A | Page 18 of 36  
 
Data Sheet  
AD7609  
TERMINOLOGY  
Signal-to-(Noise + Distortion) Ratio  
Integral Nonlinearity  
The measured ratio of signal-to-(noise + distortion) at the  
output of the ADC. The signal is the rms amplitude of the  
fundamental. Noise is the sum of all nonfundamental signals  
up to half the sampling frequency (fS/2, excluding dc). The ratio  
depends on the number of quantization levels in the digitization  
process: the more levels, the smaller the quantization noise. The  
theoretical signal-to-(noise + distortion) ratio for an ideal N-bit  
converter with a sine wave input is given by  
The maximum deviation from a straight line passing through  
the endpoints of the ADC transfer function. The endpoints of  
the transfer function are zero scale, a ½ LSB below the first code  
transition, and full scale at ½ LSB above the last code transition.  
Differential Nonlinearity  
The difference between the measured and the ideal 1 LSB  
change between any two adjacent codes in the ADC.  
Bipolar Zero Code Error  
The deviation of the midscale transition (all 1s to all 0s) from  
the ideal VIN voltage, that is, AGND.  
Signal-to-(Noise + Distortion) = (6.02 N + 1.76) dB  
Thus, for an 18-bit converter, this is 110.12 dB.  
Total Harmonic Distortion (THD)  
The ratio of the rms sum of the harmonics to the fundamental.  
For the AD7609, it is defined as  
Bipolar Zero Code Error Match  
The difference in bipolar zero code error between any two input  
channels.  
THD (dB) =  
Positive Full-Scale Error  
2
2
2
2
2
2
2
2
The last transition (from 011 . . . 10 to 011 . . . 11 in twos  
complement coding) should occur for an analog voltage 1½  
LSB below the nominal full scale (9.99977 V for the 10 V  
range and 4.99988 V for the 5 V range). The positive full-scale  
error is the deviation of the actual level of the last transition  
from the ideal level.  
V2 +V3 +V4 +V5 +V6 +V7 +V8 +V9  
20log  
V1  
where:  
V1 is the rms amplitude of the fundamental.  
V2 to V9 are the rms amplitudes of the second through ninth  
harmonics.  
Positive Full-Scale Error Match  
The difference in positive full-scale error between any two input  
channels.  
Peak Harmonic or Spurious Noise  
The ratio of the rms value of the next largest component in the  
ADC output spectrum (up to fS/2, excluding dc) to the rms value  
of the fundamental. Normally, the value of this specification is  
determined by the largest harmonic in the spectrum, but for  
ADCs where the harmonics are buried in the noise floor, it is  
determined by a noise peak.  
Negative Full-Scale Error  
The first transition (from 100 . . . 00 to 100 . . . 01 in twos  
complement coding) should occur for an analog voltage ½ LSB  
above the negative full scale (−9.999923 V for the 10 V range  
and −4.9999618 for the 5 V range). The negative full-scale  
error is the deviation of the actual level of the first transition  
from the ideal level.  
Intermodulation Distortion  
With inputs consisting of sine waves at two frequencies, fa and fb,  
any active device with nonlinearities creates distortion products  
at sum and difference frequencies of mfa nfb, where m, n = 0,  
1, 2, 3. Intermodulation distortion terms are those for which  
neither m nor n is equal to 0. For example, the second-order  
terms include (fa + fb) and (fa − fb), and the third-order terms  
include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa − 2fb).  
Negative Full-Scale Error Match  
The difference in negative full-scale error between any two  
input channels.  
Track-and-Hold Acquisition Time  
The track-and-hold amplifier returns to track mode at the end  
of the conversion. The track-and-hold acquisition time is the  
time required for the output of the track-and-hold amplifier to  
reach its final value, within 1 LSB, after the end of the conversion.  
See the Track-and-Hold Amplifiers section for more details.  
The calculation of the intermodulation distortion is per the  
THD specification, where it is the ratio of the rms sum of the  
individual distortion products to the rms amplitude of the  
sum of the fundamentals expressed in decibels (dB).  
Rev. A | Page 19 of 36  
 
AD7609  
Data Sheet  
Power Supply Rejection (PSR)  
Channel-to-Channel Isolation  
Variations in power supply affect the full-scale transition but  
not the converters linearity. Power supply rejection is the  
maximum change in full-scale transition point due to a change  
in power supply voltage from the nominal value. The power  
supply rejection ratio is defined as the ratio of the power in  
the ADC output at full-scale frequency, f, to the power of a  
200 mV p-p sine wave applied to the ADC VDD and VSS supplies  
of Frequency fS.  
Channel-to-channel isolation is a measure of the level of crosstalk  
between any two channels. It is measured by applying a full-scale,  
10 kHz sine wave signal to all unselected input channels and  
determining the degree to which the signal attenuates in the  
selected channel with a 1 kHz signal.  
Common-Mode Rejection Ratio (CMRR)  
CMRR is defined as the ratio of the power in the ADC  
common-mode input at full-scale frequency, f, to the power in  
the output of a full-scale p-p sine wave applied to the common-  
mode voltage of VINX+ and VINX− of frequency, fS,  
PSRR (dB) = 10 log (Pf/PfS)  
where:  
Pf is equal to the power at Frequency f in the ADC output.  
PfS is equal to the power at Frequency fS coupled onto the VDD  
and VSS supplies.  
CMRR (dB) = 20 log (Pf/PfS)  
where:  
Pf is equal to the power at Frequency f in the ADC input.  
PfS is equal to the power at Frequency fS in the ADC output.  
Rev. A | Page 20 of 36  
Data Sheet  
AD7609  
THEORY OF OPERATION  
Analog Input Clamp Protection  
CONVERTER DETAILS  
Figure 32 shows the analog input structure of the AD7609.  
Each AD7609 analog input contains clamp protection circuitry.  
Despite a single 5 V supply operation, this analog input clamp  
protection allows for an input overvoltage up to 16.5 V.  
The AD7609 is a data acquisition system that employs a high  
speed, low power, charge redistribution successive approxima-  
tion analog-to-digital converter (ADC) and allows the  
simultaneous sampling of eight true differential analog input  
channels. The analog inputs on the AD7609 can accept true  
bipolar input signals. The RANGE pin is used to select either  
10 V or 5 V as the input range. The AD7609 operates from  
a single 5 V supply.  
R
FB  
1MΩ  
Vx+  
Vx–  
CLAMP  
CLAMP  
1MΩ  
SECOND-  
ORDER  
LPF  
The AD7609 contains input clamp protection, input signal  
scaling amplifiers, a second-order antialiasing filter, track-and-  
hold amplifiers, an on-chip reference, reference buffers, a high  
speed ADC, a digital filter, and high speed parallel and serial  
interfaces. Sampling on the AD7609 is controlled using  
CONVST x signals.  
R
FB  
Figure 32. Analog Input Circuitry  
Figure 33 shows the current vs. voltage characteristic of the  
clamp circuit. For input voltages up to 16.5 V, no current flows  
in the clamp circuit. For input voltages above 16.5 V, the  
AD7609 clamp circuitry turns on and clamps the analog input  
to 16.5 V. A series resister should be placed on the analog  
input channels to limit the current to 10 mA for input voltages  
above 16.5 V. In an application where there is a series resistance  
on an analog input channel, VINx+, a corresponding resistance  
is required on the VINx− channel (see Figure 34). If there is no  
corresponding resister on the Vx− channel, this results in an  
offset error on that channel. It is recommended that the input  
overvoltage clamp protection circuitry be used to protect the  
AD7609 against transient overvoltage events. It is not recom-  
mended to leave the AD7609 in a condition where the clamp  
protection circuitry is active (in normal or power-down  
conditions) for extended periods because this may degrade the  
bipolar zero code error performance of the AD7609.  
ANALOG INPUT  
Analog Input Ranges  
The AD7609 can handle true bipolar input voltages. The logic  
level on the RANGE pin determines the analog input range of  
all analog input channels. If this pin is tied to a logic high, the  
analog input range is 10 V for all channels. If this pin is tied  
to a logic low, the analog input range is 5 V for all channels.  
A logic change on this pin has an immediate effect on the  
analog input range; however, there is a settling time of 80 µs  
typically, in addition to the normal acquisition time requirement.  
The recommended practice is to hardwire the RANGE pin  
according to the desired input range for the system signals.  
During normal operation, the applied analog input voltage should  
remain within the analog input range selected via the RANGE  
pin. A RESET pulse must be applied to the part to ensure the  
analog input channels are configured for the range selected.  
AV , V  
CC DRIVE  
= 5V  
30  
20  
T
= 25°C  
A
10  
When in a power-down mode, it is recommended to tie the  
analog inputs together or both analog input pins (Vx+, Vx−) to  
GND. As per the Analog Input Clamp Protection section, the  
overvoltage clamp protection is recommended for use in  
transient overvoltage conditions, and should not remain active  
for extended periods. Stressing the analog inputs outside of  
these conditions may degrade the Bipolar Zero Code error and  
THD performance of the AD7609.  
0
–10  
–20  
–30  
–40  
–50  
–20  
–15  
–10  
–5  
0
5
10  
15  
20  
Analog Input Impedance  
SOURCE VOLTAGE (V)  
The analog input impedance of the AD7609 is 1 MΩ. This is a  
fixed input impedance and does not vary with the AD7609 sam-  
pling frequency. This high analog input impedance eliminates  
the need for a driver amplifier in front of the AD7609 allowing  
for direct connection to the source or sensor. With the need for  
a driver amplifier eliminated, bipolar supplies can be removed  
from the signal chain, which are often a source of noise in a system.  
Figure 33. Input Protection Clamp Profile  
R
FB  
AD7609  
1MΩ  
1MΩ  
R
R
+10V  
VINx+  
VINx–  
CLAMP  
CLAMP  
–10V  
+10V  
C
–10V  
R
FB  
Figure 34. Input Resistance Matching on the Analog Input  
Rev. A | Page 21 of 36  
 
 
 
 
 
 
 
AD7609  
Data Sheet  
The conversion clock for the part is internally generated, and  
the conversion time for all channels is 4 µs on the AD7609. The  
BUSY signal returns low after all eight conversions to indicate the  
end of the conversion process. On the falling edge of BUSY, the  
track-and-hold amplifiers return to track mode. New data can  
be read from the output register via the parallel, or serial  
interface after BUSY goes low; or, alternatively, data from the  
previous conversion can be read while BUSY is high. Reading data  
from the AD7609 while a conversion is in progress has little  
effect on performance and allows a faster throughput to be  
achieved. With a VDRIVE > 3.3 V, the SNR is reduced by ~1.5 dB  
when reading during a conversion.  
Analog Input Antialiasing Filter  
An analog antialiasing filter is also provided on the AD7609.  
The filter is a second-order Butterworth. Figure 35 and  
Figure 36 show the frequency and phase response respectively  
of the analog antialiasing filter. In the 5 V range, the −3 dB  
frequency is typically 23 kHz. In the 10 V range, the −3 dB  
frequency is typically 32 kHz.  
0
10V DIFF  
–5  
5V DIFF  
–10  
–15  
–20  
–25  
ADC TRANSFER FUNCTION  
The output coding of the AD7609 is twos complement. The  
designed code transitions occur midway between successive  
integer LSB values, that is, 1/2 LSB, 3/2 LSB. The LSB size is  
FSR/262,144 for the AD7609. The FSR for the AD7609 is 40 V  
for the 10 V range and 20 V for the 5 V range. The ideal  
transfer characteristic for the AD7609 is shown in Figure 37.  
TEMP  
0.1dB  
3dB  
–40°C 13,354Hz 33,520Hz  
10V 25°C 12,769Hz 32,397Hz  
85°C 12,427Hz 31,177Hz  
–30  
–35  
–40°C 10,303Hz 24,365Hz  
5V  
25°C  
85°C  
9619Hz 23,389Hz  
9326Hz 22,607Hz  
–40  
100  
1k  
10k  
100k  
V+ ± (V–)  
10V  
V+ ± (V–)  
5V  
REF  
2.5V  
REF  
2.5V  
±10V CODE =  
× 131,072 ×  
FREQUENCY (Hz)  
Figure 35. Analog Antialiasing Filter Frequency Response  
±5V CODE =  
× 131,072 ×  
14  
13  
12  
11  
10  
9
011...111  
011...110  
+FSR – (–FSR)  
218  
000...001  
000...000  
111...111  
LSB =  
±5V RANGE  
±10V RANGE  
8
7
100...010  
100...001  
100...000  
6
5
–FS + 1/2LSB 0V – 1LSB +FS – 3/2LSB  
4
ANALOG INPUT  
3
Figure 37. AD7609 Transfer Characteristic  
AV , V  
= 5V  
fSAMPLE = 200kSPS  
= 25°C  
CC DRIVE  
2
1
The LSB size is dependent on the analog input range selected  
(see Table 7).  
T
A
0
10  
1k  
10k  
100k  
INPUT FREQUENCY (Hz)  
Table 7. Output Codes and Ideal Input Values  
Figure 36. Analog Antialiasing Filter Phase Response  
Analog  
Analog Input  
(V+ − (V−)  
Input  
V+ − (V−)  
Digital  
Output  
Track-and-Hold Amplifiers  
The track-and-hold amplifiers on the AD7609 allow the ADC to  
accurately acquire an input sine wave of full-scale amplitude  
to 18-bit resolution. The track-and-hold amplifiers sample  
their respective inputs simultaneously on the rising edge of  
CONVST x. The aperture time for track-and-hold (that is, the  
delay time between the external CONVST x signal and the  
track-and-hold actually going into hold) is well matched, by design,  
across all eight track-and-holds on one device and from device  
to device. This matching allows more than one AD7609 device  
to be sampled simultaneously in a system.  
Description  
FSR − 0.5 LSB  
Midscale + 1 LSB  
Midscale  
Midscale – 1 LSB  
−FSR + 1 LSB  
−FSR  
10 V Range  
5 V Range  
Code (Hex)  
+19.99992 V  
+152.58 µV  
0 V  
−152.58 µV  
−19.99984 V  
−20 V  
9.999961 V  
76 µV  
0 V  
−76 µV  
−9.99992 V  
−10 V  
0x1FFFF  
0x00001  
0x00000  
0x3FFFF  
0x20001  
0x20000  
The end of the conversion process across all eight channels is  
indicated by the falling edge of BUSY; and it is at this point that the  
track-and-holds return to track mode and the acquisition time  
for the next set of conversions begins.  
Rev. A | Page 22 of 36  
 
 
 
 
 
 
Data Sheet  
AD7609  
REFIN/REFOUT  
INTERNAL/EXTERNAL REFERENCE  
SAR  
The AD7609 contains an on-chip 2.5 V band gap reference. The  
REFIN/REFOUT pin allows access to the 2.5 V reference that  
generates the on-chip 4.5 V reference internally, or it allows an  
external reference of 2.5 V to be applied to the AD7609. An  
externally applied reference of 2.5 V is also amplified to 4.5 V using  
the internal buffer. This 4.5 V buffered reference is the reference  
used by the SAR ADC.  
REFCAPB  
REFCAPA  
BUF  
10µF  
2.5V  
REF  
Figure 38. Reference Circuitry  
The REF SELECT pin is a logic input pin that allows the user to  
select between the internal reference and the external reference.  
If this pin is set to logic high, the internal reference is selected  
and is enabled; if this pin is set to logic low, the internal refer-  
ence is disabled and an external reference voltage must be  
applied to the REFIN/REFOUT pin. The internal reference  
buffer is always enabled. After a reset, the AD7609 operates in  
the reference mode selected by the REF SELECT pin. Decoupling  
is required on the REFIN/REFOUT pin for both the internal  
or external reference options. A 10 µF ceramic capacitor is  
required on the REFIN/REFOUT to ground close to the  
REFGND pins. The AD7609 contains a reference buffer  
configured to amplify the REF voltage up to ~4.5 V, as shown  
in Figure 38. The REFCAPA and REFCAPB pins must be  
shorted together externally and a ceramic capacitor of 10 μF  
applied to REFGND to ensure the reference buffer is in  
closed-loop operation. The reference voltage available at the  
REFIN/REFOUT pin is 2.5 V.  
V
DRIVE  
AD7609  
AD7609  
AD7609  
REF SELECT  
REF SELECT  
REF SELECT  
REFIN/REFOUT  
REFIN/REFOUT  
REFIN/REFOUT  
+
10µF  
100nF  
100nF  
Figure 39. Single External Reference Driving Multiple AD7609  
REFIN/REFOUT Pins  
AD7609  
AD7609  
AD7609  
REF SELECT  
REF SELECT  
REF SELECT  
REFIN/REFOUT  
REFIN/REFOUT  
REFIN/REFOUT  
100nF  
100nF  
100nF  
When the AD7609 is configured in external reference mode,  
the REFIN/REFOUT pin is a high input impedance pin. For  
applications using multiple AD7609 devices, the following  
configurations are recommended depending on the application  
requirements.  
ADR421  
0.1µF  
Figure 40. Internal Reference Driving Multiple AD7609 REFIN Pins  
External Reference Mode  
One ADR421 external reference can be used to drive the  
REFIN/REFOUT pins of all AD7609 devices (see Figure 39). In  
this configuration, each AD7609 REFIN/REFOUT pin should  
be decoupled with a 100 nF decoupling capacitor.  
Internal Reference Mode  
One AD7609 device, configured to operate in the internal  
reference mode, can be used to drive the remaining AD7609  
devices, which are configured to operate in external reference  
mode (see Figure 40). The REFIN/REFOUT pin of the AD7609,  
configured in internal reference mode, should be decoupled  
using a 10 µF ceramic decoupling capacitor. The other AD7609  
devices, configured in external reference mode, should use a  
100 nF decoupling capacitor on their REFIN/REFOUT pins.  
Rev. A | Page 23 of 36  
 
 
 
 
AD7609  
Data Sheet  
TYPICAL CONNECTION DIAGRAM  
POWER-DOWN MODES  
Figure 41 shows the typical connection diagram for the  
AD7609. There are four AVCC supply pins on the part that  
can be tied together and decoupled using a 100 nF capacitor at  
each supply pin and a 10 µF capacitor at the supply source. The  
AD7609 can operate with the internal reference or an externally  
applied reference. In this configuration, the AD7609 is config-  
ured to operate with the internal reference. When using a single  
AD7609 device on the board, the REFIN/REFOUT pin should  
be decoupled with a 10 µF capacitor. In an application with  
multiple AD7609 devices, see the Internal/External Reference  
section. The REFCAPA and REFCAPB pins are shorted together  
and decoupled with a 10 µF ceramic capacitor.  
There are two power-down modes available on the AD7609.  
STBY  
or one of the two power-down modes. The two power-down  
modes available are standby mode and shutdown mode. The  
power-down mode is selected through the state of the RANGE  
The  
pin controls whether the AD7609 is in normal mode  
STBY  
pin when the  
pin is low. Table 8 shows the configurations  
required to choose the desired power-down mode. When the  
AD7609 is placed in standby mode, the current consumption is  
8 mA maximum and power-up time is approximately 100 µs  
because the capacitor on the REFCAPA/REFCAPB pins must  
charge up. In standby mode, the on-chip reference and  
regulators remain powered up and the amplifiers and ADC core  
are powered down. When the AD7609 is placed in shutdown  
mode, the current consumption is 11 µA maximum and power  
up time is about 13 ms. In shutdown mode, all circuitry  
is powered down. When the AD7609 is powered up from  
shutdown mode, a reset signal must be applied to the AD7609  
after the required power-up time has elapsed.  
The VDRIVE supply is connected to the same supply as the pro-  
cessor. The voltage on VDRIVE controls the voltage value of the  
output logic signals. For layout, decoupling, and grounding  
hints, see the Layout Guidelines section.  
After supplies are applied to the AD7609, a reset should be  
applied to the AD7609 to ensure that it is configured for the  
correct mode of operation.  
Table 8. Power-Down Mode Selection  
STBY  
Power-Down Mode  
Standby  
Shutdown  
RANGE  
0
0
1
0
ANALOG SUPPLY  
VOLTAGE 5V1  
DIGITAL SUPPLY  
VOLTAGE +2.3V TO +5V  
+
1µF  
10µF  
100nF  
100nF  
2
AV  
V
DRIVE  
REFIN/REFOUT  
REGCAP  
CC  
REFCAPA  
PARALLEL  
INTERFACE  
+
DB0 TO DB15  
10µF  
REFCAPB  
REFGND  
CONVST A, B  
CS  
RD  
BUSY  
V1+  
V1–  
V2+  
V2–  
V3+  
V3–  
V4+  
V4–  
V5+  
V5–  
V6+  
V6–  
V7+  
V7–  
V8+  
V8–  
AD7609  
RESET  
OS 2  
OS 1  
OS 0  
OVERSAMPLING  
EIGHT DIFFERENTIAL  
ANALOG INPUT PAIRS  
REF SELECT  
PAR/SER SEL  
V
DRIVE  
RANGE  
STBY  
V
DRIVE  
AGND  
1
DECOUPLING SHOWN ON THE AV PIN APPLIES TO EACH AV PIN (PIN 1, PIN 37, PIN 38, PIN 48).  
CC  
CC  
DECOUPLING CAPACITOR CAN BE SHARED BETWEEN AV  
PIN 37 AND PIN 38.  
CC  
2
DECOUPLING SHOWN ON THE REGCAP PIN APPLIES TO EACH REGCAP PIN (PIN 36, PIN 39).  
Figure 41. Typical Connection Diagram  
Rev. A | Page 24 of 36  
 
 
 
 
Data Sheet  
AD7609  
Simultaneously Sampling Two Sets of Channels  
CONVERSION CONTROL  
The AD7609 also allows the analog input channels to be  
sampled simultaneously in two sets. This can be used in power  
line protection and measurement systems to compensate for  
phase differences between PT and CT transformers. In a 50 Hz  
system, this allows for up to 9° of phase compensation, and in a  
60 Hz system, it allows for up to 10° of phase compensation.  
Simultaneous Sampling on All Analog Input Channels  
The AD7609 allows simultaneous sampling of all analog input  
channels. All channels are sampled simultaneously when both  
CONVST x pins (CONVST A, CONVST B) are tied together. A  
single CONVST x signal is used to control both CONVST x inputs.  
The rising edge of this common CONVST x signal initiates  
simultaneous sampling on all analog input channels.  
This is accomplished by pulsing the two CONVST x pins inde-  
pendently and is only possible if oversampling is not in use.  
CONVST A is used to initiate simultaneous sampling of the first  
set of channels (V1 to V4). CONVST B is used to initiate  
simultaneous sampling on the second set of analog input  
channels (V5 to V8), as illustrated in Figure 42. On the rising  
edge of CONVST A, the track-and-hold amplifiers for the first  
set of channels are placed into hold mode. On the rising edge  
of CONVST B, the track-and-hold amplifiers for the second set  
of channels are placed into hold mode. The conversion process  
begins after both rising edges of CONVST x have occurred;  
therefore, BUSY goes high on the rising edge of the later  
CONVST x signal. The falling edge of BUSY also indicates that  
the new data can now be read from the parallel bus or the serial  
data lines, DOUTA and DOUTB. There is no change to the data  
read process when using two separate CONVST x signals.  
The AD7609 contains an on-chip oscillator that is used to  
perform the conversions. The conversion time for all ADC  
channels is tCONV. The BUSY signal indicates to the user when  
conversions are in progress, so that when the rising edge of  
CONVST x is applied, BUSY goes logic high and transitions low  
at the end of the entire conversion process. The falling edge of  
the BUSY signal is used to place all eight track-and-hold  
amplifiers back into track mode. The falling edge of BUSY also  
indicates that the new data can now be read from the parallel  
bus (DB[15:0]) or the serial data lines, DOUTA and DOUTB.  
Connect all unused analog input channel to AGND. The results  
for any unused channels are still included in the data read  
because all channels are always converted.  
V1 TO V4 TRACK-AND-HOLD  
ENTER HOLD  
V5 TO V8 TRACK-AND-HOLD  
ENTER HOLD  
t5  
CONVST A  
CONVST B  
AD7609 CONVERTS  
ON ALL 8 CHANNELS  
BUSY  
tCONV  
CS, RD  
V1  
V2  
V8  
DATA: DB[15:0]  
FRSTDATA  
Figure 42. Simultaneous Sampling on Channel Sets Using Independent CONVST A/CONVST B Signals—Parallel Mode  
Rev. A | Page 25 of 36  
 
 
AD7609  
Data Sheet  
DIGITAL INTERFACE  
The AD7609 provides two interface options: a parallel interface  
and a high speed serial interface. The required interface mode is  
AD7609  
INTERRUPT  
BUSY 14  
PAR  
selected via the  
/SER SEL pin.  
13  
CS  
RD  
12  
DIGITAL  
HOST  
The operation of the interface modes is described in the  
following sections.  
33:16  
DB[15:0]  
CS  
Figure 43. AD7609 Interface Diagram: One AD7609 Using the Parallel Bus;  
RD  
PARALLEL INTERFACE (PAR/SER SEL = 0)  
and  
Shorted Together  
Data can be read from the AD7609 via the parallel data bus with  
SERIAL INTERFACE (PAR/SER SEL = 1)  
CS  
RD  
standard and  
signals. To read the data over the parallel  
PAR  
CS  
RD  
and  
bus, the  
/SER SEL pin should be tied low. The  
To read data back from the AD7609 over the serial interface,  
input signals are internally gated to enable the conversion result  
onto the data bus. The data lines, DB15 to DB0, leave their high  
PAR  
CS  
the  
/SER SEL pin should be tied high. The  
and SCLK  
signals are used to transfer data from the AD7609. The AD7609  
has two serial data output pins, DOUTA and DOUTB. Data can be  
read back from the AD7609 using one or both of these DOUT  
lines. For the AD7609, conversion results from Channel V1 to  
Channel V4 first appear on DOUTA, whereas conversion results  
from Channel V5 to Channel V8 first appear on DOUTB.  
CS  
RD  
impedance state when both  
and  
are logic low.  
CS  
CS  
CS  
The rising edge of the  
the falling edge of the  
high impedance state.  
input signal three-states the bus and  
input signal takes the bus out of the  
is the control signal that enables the  
data lines; it is the function that allows multiple AD7609  
CS  
CS  
The  
OUTB) out of three-state and clocks out the MSB of the conver-  
sion result. The rising edge of SCLK clocks all subsequent data  
CS  
falling edge takes the data output lines (DOUTA and  
devices to share the same parallel data bus. The  
signal can  
signal can be used to  
D
RD  
be permanently tied low, and the  
access the conversion results, as shown in Figure 4. A read  
operation of new data can take place after the BUSY signal  
goes low (Figure 2), or, alternatively, a read operation of data  
from the previous conversion process can take place while  
BUSY is high (Figure 3).  
bits onto the serial data outputs, DOUTA and DOUTB. The  
input can be held low for the entire serial read or it can be  
pulsed to frame each channel read of 18 SCLK cycles.  
Figure 44 shows a read of eight simultaneous conversion results  
using two DOUT lines on the AD7609. In this case, a 72 SCLK  
transfer is used to access data from the AD7609 and  
low to frame the entire 72 SCLK cycles. Data can also be clocked  
out using only one DOUT line, in which case DOUTA is recom-  
mended to access all conversion data, because the channel data  
is output in ascending order. For the AD7609 to access all eight  
conversion results on one DOUT line, a total of 144 SCLK cycles  
are required. These 144 SCLK cycles can be framed by one  
signal or each group of 18 SCLK cycles can be individually  
RD  
The  
results register. Two  
18-bit conversion result from each channel. Applying a  
RD RD  
pin clocks the  
pin is used to read data from the output conversion  
CS  
is held  
RD  
pulses are required to read the full  
sequence of 16  
conversion results out from each channel onto the parallel  
RD  
pulses to the AD7609  
output bus, DB[15:0], in ascending order. The first  
edge after BUSY goes low clocks out DB[17:2] of the V1 result,  
RD  
falling  
CS  
the next  
falling edge updates the bus with DB[1:0] of the V1  
RD  
result. It takes 16  
pulses to read the eight 18-bit conversion  
CS  
framed by the  
signal. The disadvantage of using only one  
th  
RD  
results from the AD7609. The 16 falling edge of  
the DB[1:0] conversion result for Channel V8. When the  
clocks out  
RD  
D
OUT line is that the throughput rate is reduced if reading after  
conversion. The unused DOUT line should be left unconnected  
in serial mode. For the AD7609, if DOUTB is to be used as a  
single DOUT line, the channel results are output in the following  
order: V5, V6, V7, V8, V1, V2, V3, V4; however, the FRSTDATA  
indicator returns low after V5 is read on DOUTB.  
signal is logic low, it enables the data conversion result from  
each channel to be transferred to the digital host (DSP, FPGA).  
When there is only one AD7609 in a system/board and it  
does not share the parallel bus, data can be read using only one  
CS  
RD  
control signal from the digital host. The  
can be tied together, as shown in Figure 5. In this case, the data  
CS RD  
and  
signals  
bus comes out of three-state on the falling edge of  
/
. The  
signal allows the data to be clocked out  
of the AD7609 and to be read by the digital host. In this case,  
CS RD  
combined  
and  
CS  
16  
is used to frame the data transfer of each data channel and  
CS  
pulses are required to read the eight channels of data.  
Rev. A | Page 26 of 36  
 
 
 
Data Sheet  
AD7609  
Figure 6 shows the timing diagram for reading one channel of  
are read on DOUTB, the FRSTDATA output does not go high  
CS  
when V1 is being output on this serial data output pin. It only  
goes high when V1 is available on DOUTA (and this is when V5  
is available on DOUTB).  
data, framed by the  
The SCLK input signal provides the clock source for the serial  
CS  
signal, from the AD7609 in serial mode.  
read operation. goes low to access the data from the AD7609.  
CS  
The falling edge of  
clocks out the MSB of the 18-bit conversion result. This MSB  
CS  
takes the bus out of three-state and  
READING DURING CONVERSION  
Data can be read from the AD7609 while BUSY is high  
and conversions are in progress. This has little effect on the  
performance of the converter and allows a faster throughput  
rate to be achieved. A parallel or serial read can be performed  
during conversions and when oversampling may or may not  
be in use. Figure 3 shows the timing diagram for reading while  
BUSY is high in parallel or serial mode. Reading during conver-  
sions allows the full throughput rate to be achieved when using  
the serial interface with a VDRIVE of 3.3 V to 5.25 V.  
is valid on the first falling edge of the SCLK after the  
edge. The subsequent 17 data bits are clocked out of the  
falling  
AD7609 on the SCLK rising edge. Data is valid on the SCLK  
falling edge. Eighteen clock cycles must be provided to the  
AD7609 to access each conversion result.  
The FRSTDATA output signal indicates when the first channel,  
V1, is being read back. When the input is high, the FRSTDATA  
output pin is in three-state. In serial mode, the falling edge of  
CS  
CS  
takes FRSTDATA out of three-state and sets the FRSTDATA  
pin high indicating that the result from V1 is available on the  
Data can be read from the AD7609 at any time other than on  
the falling edge of BUSY because this is when the output data  
registers are updated with the new conversion data. t6, outlined  
in Table 3, should be observed in this condition.  
DOUTA output data line. The FRSTDATA output returns to a  
logic low following the 18th SCLK falling edge. If all channels  
CS  
72  
SCLK  
D
D
A
B
V1  
V5  
V2  
V6  
V3  
V7  
V4  
V8  
OUT  
OUT  
Figure 44. AD7609 Serial Interface with Two DOUT Lines  
Rev. A | Page 27 of 36  
 
 
AD7609  
Data Sheet  
The CONVST A and CONVST B pins must be tied/driven  
DIGITAL FILTER  
together when oversampling is turned on. When the over-  
sampling function is turned on, the BUSY high time for the  
conversion process extends. The actual BUSY high time  
depends on the oversampling rate selected; the higher the  
oversampling rate, the longer the BUSY high, or total  
conversion time, see Table 9.  
The AD7609 contains an optional digital filter. This digital filter  
is a first-order sinc filter. This digital filter should be used in  
applications where slower throughput rates are used or where  
higher signal-to-noise ratio or dynamic range is desirable. The  
oversampling ratio of the digital filter is controlled using the  
oversampling pins, OS [2:0] (see Table 9). OS 2 is the MSB  
control bit and OS 0 is the LSB control bit. Table 9 provides  
the oversampling bit decoding to select the different oversample  
rates. The OS pins are latched on the falling edge of BUSY.  
This sets the oversampling rate for the next conversion (see  
Figure 45). In addition to the oversampling function, the output  
result is decimated to 18-bit resolution.  
Figure 46 shows that the conversion time extends as the over-  
sampling rate is increased, and the BUSY signal lengthens for the  
different oversampling rates. For example, a sampling frequency  
of 10 kSPS yields a cycle time of 100 µs. Figure 46 shows OS × 2  
and OS × 4; for a 10 kSPS example, there is adequate cycle time  
to further increase the oversampling rate and yield greater  
improvements in SNR performance. In an application where  
the initial sampling or throughput rate is at 200 kSPS, for  
example, and oversampling is turned on, the throughput rate  
must be reduced to accommodate the longer conversion time  
and to allow for the read. To achieve the fastest throughput  
rate possible when oversampling is turned on, the read can be  
performed during the BUSY high time. The falling edge of BUSY  
is used to update the output data registers with the new conver-  
sion data; therefore, the reading of conversion data should not  
occur on this edge. Figure 47 to Figure 53 illustrate the effect of  
oversampling on the code spread in a dc histogram plot. As the  
oversample rate is increased, the spread of codes is reduced. (In  
Figure 47 to Figure 53, AVCC = VDRIVE = 5 V and the sampling  
rate was scaled with OS ratio.)  
If the OS pins are set to select an OS ratio of 8, the next  
CONVST x rising edge takes the first sample for each channel  
and the remaining seven samples for all channels are taken with  
an internally generated sampling signal. These samples are then  
averaged to yield an improvement in SNR performance. Table 9  
shows typical SNR performance for both the 10 V and the  
5 V ranges. As Table 9 indicates, there is an improvement in  
SNR as the OS ratio increases. As the OS ratio increases, the  
3 dB frequency is reduced and the allowed sampling frequency  
is also reduced. In an application where the required sampling  
frequency is 10 kSPS, an OS ratio of up to 16 can be used. In  
this case, the application sees an improvement in SNR but the  
input −3 dB bandwidth is limited to ~6 kHz.  
CONVST A,  
CONVST B  
OVERSAMPLE RATE  
LATCHED FOR CONVERSION N + 1  
CONVERSION N  
CONVERSION N + 1  
BUSY  
OS x  
tOS_HOLD  
tOS_SETUP  
Figure 45. OS Pin Timing  
Table 9. Oversampling Bit Decoding (100 Hz Input Signal)  
OS  
[2:0]  
OS  
Ratio  
SNR 5 V Range SNR 10 V Range −3 dB BW 5 V Range −3 dB BW 10 V  
Maximum Throughput  
CONVST x Frequency (kHz)  
(dB)  
90.8  
93.3  
95.5  
98  
100.6  
101.8  
102.7  
(dB)  
91.5  
93.9  
96.4  
98.9  
101  
(kHz)  
Range (kHz)  
000  
001  
010  
011  
100  
101  
110  
111  
No OS  
2
4
8
16  
32  
64  
Invalid  
22  
22  
18.5  
11.9  
6
33  
28.9  
21.5  
12  
6
200  
100  
50  
25  
12.5  
6.25  
3.125  
102  
3
3
102.9  
1.5  
1.5  
Rev. A | Page 28 of 36  
 
 
 
Data Sheet  
AD7609  
tCYCLE  
CONVST A,  
CONVST B  
tCONV  
19µs  
9µs  
4µs  
OS = 0  
OS = 2  
OS = 4  
BUSY  
CS  
t4  
t4  
t4  
RD  
DATA:  
DB[15:0]  
Figure 46. AD7609—No Oversampling, Oversampling × 4, and Oversampling × 8 Using Read After Conversion  
3000  
1600  
OVERSAMPLING BY 4  
NO OVERSAMPLING  
1384  
1373  
1400  
1200  
1000  
800  
600  
400  
200  
0
2394  
2500  
2000  
1500  
1000  
500  
2363  
1167  
1062  
840  
1340  
727  
1191  
492  
450  
422  
2
210  
219  
4
341  
100  
5
83  
79  
3
49  
5
27  
32  
6
8
4
10  
2
11  
7
2
1
0
–5  
–4  
–3  
–2  
–1  
0
1
–9 –8 –7 –6 –5 –4 –3 –2 –1  
0
1
2
3
8
9
CODE  
CODE  
Figure 49. Histogram of Codes—OS × 4 (10 Codes)  
Figure 47. Histogram of Codes—No OS (19 Codes)  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
2000  
1800  
1600  
1400  
1200  
1000  
800  
OVERSAMPLING BY 2  
OVERSAMPLING BY 8  
3392  
1785  
1772  
1389  
2397  
1146  
1568  
788  
599  
600  
400  
317  
549  
214  
200  
229  
105  
15  
46  
41  
1
15  
3
12  
1
2
1
0
0
–4  
–3  
–2  
–1  
0
1
2
–7 –6 –5 –4 –3 –2 –1  
0
CODE  
1
2
3
4
5
6
7
CODE  
Figure 50. Histogram of Codes—OS × 8 (Eight Codes)  
Figure 48. Histogram Of Codes—OS × 2 (15 Codes)  
Rev. A | Page 29 of 36  
 
 
AD7609  
Data Sheet  
4500  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
When the oversampling mode is selected, this has the effect  
OVERSAMPLING BY 16  
of adding a digital filter function after the ADC. The different  
oversampling rates and the CONVST x sampling frequency  
produces different digital filter frequency profiles.  
3833  
3279  
Figure 54 to Figure 59 show the digital filter frequency profiles  
for the different oversampling rates. The combination of the  
analog antialiasing filter and the oversampling digital filter can  
be used to eliminate or reduce the complexity of the design of  
the filter before the AD7609. The digital filtering combines  
steep roll-off and linear phase response.  
657  
406  
–2  
0
AV  
V
= 5V  
CC  
14  
2
3
= 5V  
0
DRIVE  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–3  
–1  
0
1
T
= 25°C  
A
10V RANGE  
OS BY 2  
CODE  
Figure 51. Histogram of Codes—OS × 16 (Six Codes)  
6000  
5000  
4000  
3000  
2000  
1000  
0
OVERSAMPLING BY 32  
5090  
2716  
100  
1k  
10k  
100k  
1M  
10M  
FREQUENCY (Hz)  
Figure 54. Digital Filter Response for OS × 2  
341  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
45  
–2  
AV  
= 5V  
= 5V  
CC  
V
DRIVE  
= 25°C  
–1  
0
1
T
A
CODE  
10V RANGE  
OS BY 4  
Figure 52. Histogram of Codes—OS × 32 (Four Codes)  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
OVERSAMPLING BY 64  
5871  
2245  
100  
1k  
10k  
100k  
1M  
10M  
FREQUENCY (Hz)  
Figure 55. Digital Filter Response for OS × 4  
75  
1
–2  
–1  
0
1
CODE  
Figure 53. Histogram of Codes – OS × 64 (Four Codes)  
Rev. A | Page 30 of 36  
 
 
Data Sheet  
AD7609  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
AV  
= 5V  
= 5V  
AV  
= 5V  
= 5V  
CC  
CC  
V
V
DRIVE  
= 25°C  
DRIVE  
T
T = 25°C  
A
A
10V RANGE  
OS BY 8  
10V RANGE  
OS BY 32  
–100  
100  
1k  
10k  
100k  
1M  
10M  
100  
1k  
10k  
100k  
1M  
10M  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
Figure 56. Digital Filter Response for OS × 8  
Figure 58. Digital Filter Response for OS × 32  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
AV  
= 5V  
= 5V  
AV  
= 5V  
CC  
CC  
V
V
= 5V  
DRIVE  
= 25°C  
DRIVE  
T = 25°C  
A
T
A
10V RANGE  
OS BY 16  
10V RANGE  
OS BY 64  
100  
1k  
10k  
100k  
1M  
10M  
100  
1k  
10k  
100k  
1M  
10M  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
Figure 57. Digital Filter Response for OS × 16  
Figure 59. Digital Filter Response for OS × 64  
Rev. A | Page 31 of 36  
 
AD7609  
Data Sheet  
LAYOUT GUIDELINES  
The printed circuit board that houses the AD7609 should be  
designed so that the analog and digital sections are separated  
and confined to different areas of the board.  
Use at least one ground plane. It can be common or split  
between the digital and analog sections. In the case of the split  
plane, the digital and analog ground planes should be joined in  
only one place, preferably as close as possible to the AD7609.  
If the AD7609 is in a system where multiple devices require  
analog-to-digital ground connections, the connection should  
still be made at only one point, a star ground point, which  
should be established as close as possible to the AD7609. Good  
connections should be made to the ground plane. Avoid sharing  
one connection for multiple ground pins. Individual vias or  
multiple vias to the ground plane should be used for each  
ground pin.  
Figure 60. Top Layer Decoupling REFIN/REFOUT, REFCAPA, REFCAPB, and  
REGCAP Pins  
Avoid running digital lines under the devices because doing  
so couples noise onto the die. Allow the analog ground plane  
to run under the AD7609 to avoid noise coupling. Shield fast-  
switching signals like CONVST A, CONVST B, or clocks with  
digital ground to avoid radiating noise to other sections of the  
board, and they should never run near analog signal paths.  
Avoid crossover of digital and analog signals. Run traces on  
layers in close proximity on the board at right angles to each  
other to reduce the effect of feedthrough through the board.  
The power supply lines to the AVCC and VDRIVE pins on the  
AD7609 should use as large a trace as possible to provide low  
impedance paths and reduce the effect of glitches on the power  
supply lines. Where possible, use supply planes. Good connec-  
tions should be made between the AD7609 supply pins and the  
power tracks on the board; this should involve the use of a single  
via or multiple vias for each supply pin.  
Figure 61. Bottom Layer Decoupling  
Good decoupling is also important to lower the supply imped-  
ance presented to the AD7609 and to reduce the magnitude of  
the supply spikes. Place the decoupling capacitors close to,  
ideally right up against, these pins and their corresponding  
ground pins. Place the decoupling capacitors for the REFIN/  
REFOUT pin and the REFCAPA and REFCAPB pins as close as  
possible to their respective AD7609 pins. Where possible, they  
should be placed on the same side of the board as the AD7609  
device. Figure 60 shows the recommended decoupling on the  
top layer of the AD7609 board. Figure 61 shows bottom layer  
decoupling. Bottom layer decoupling is for the four AVCC pins  
and the VDRIVE pin.  
Rev. A | Page 32 of 36  
 
 
 
Data Sheet  
AD7609  
To ensure good device-to-device performance matching in a  
system that contains multiple AD7609 devices, a symmetrical  
layout between the AD7609 devices is important. Figure 62  
shows a layout with two AD7609 devices. The AVCC supply  
plane runs to the right of both devices. The VDRIVE supply track  
runs to the left of the two AD7609 devices. The reference chip  
is positioned between both AD7609 devices and the reference  
voltage track runs north to Pin 42 of U1 and south to Pin 42  
to U2. A solid ground plane is used. These symmetrical layout  
principles can be applied to a system that contains more than  
two AD7609 devices. The AD7609 devices can be placed in a  
north-to-south direction with the reference voltage located  
midway between the AD7609 devices and the reference track  
running in the north-to-south direction similar to Figure 62.  
Figure 62. Multiple AD7609 Layout, Top Layer and Supply Plane Layer  
Rev. A | Page 33 of 36  
 
 
AD7609  
Data Sheet  
OUTLINE DIMENSIONS  
12.20  
12.00 SQ  
11.80  
0.75  
0.60  
0.45  
1.60  
MAX  
64  
49  
1
48  
PIN 1  
10.20  
10.00 SQ  
9.80  
TOP VIEW  
(PINS DOWN)  
1.45  
1.40  
1.35  
0.20  
0.09  
7°  
3.5°  
0°  
0.08  
COPLANARITY  
16  
33  
0.15  
0.05  
SEATING  
PLANE  
17  
32  
VIEW A  
0.27  
0.22  
0.17  
0.50  
BSC  
LEAD PITCH  
VIEW A  
ROTATED 90° CCW  
COMPLIANT TO JEDEC STANDARDS MS-026-BCD  
Figure 63. 64-Lead Low Profile Quad Flat Package [LQFP]  
(ST-64-2)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model1  
AD7609BSTZ  
AD7609BSTZ-RL  
EVAL-AD7609EDZ  
CED1Z  
Temperature Range  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
Package Description  
Package Option  
64-Lead Low Profile Quad Flat Package [LQFP]  
64-Lead Low Profile Quad Flat Package [LQFP]  
Evaluation Board for the AD7609  
ST-64-2  
ST-64-2  
Converter Evaluation Development  
1 Z = RoHS Compliant Part.  
Rev. A | Page 34 of 36  
 
 
 
Data Sheet  
NOTES  
AD7609  
Rev. A | Page 35 of 36  
AD7609  
NOTES  
Data Sheet  
©2011–2012 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D09760-0-2/12(A)  
Rev. A | Page 36 of 36  

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