AD7841ASZ [ADI]
Octal 14-Bit, Parallel Input, Voltage-Output DAC; 八通道14位，并行输入，电压输出DAC
| 型号： | AD7841ASZ |
| 厂家： | 
ADI |
| 描述： | Octal 14-Bit, Parallel Input, Voltage-Output DAC |
| 文件： | 总13页 (文件大小：442K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Octal 14-Bit, Parallel Input,
Voltage-Output DAC
a
AD7841
GENERAL DESCRIPTION
FEATURES
The AD7841 contains eight 14-bit DACs on one monolithic
chip. It has output voltages with a full-scale range of 10 V
from reference voltages of 5 V.
Eight 14-Bit DACs in One Package
Voltage Outputs
Offset Adjust for Each DAC Pair
Reference Range of ꢀ5 V
Maximum Output Voltage Range of ꢀ10 V
ꢀ15 V ꢀ 10% Operation
The AD7841 accepts 14-bit parallel loaded data from the exter-
nal bus into one of the input registers under the control of the
WR, CS, and DAC channel address pins, A0–A2.
Clear Function to User-Defined Voltage
44-Lead MQFP Package
The DAC outputs are updated on reception of new data into
the DAC registers. All the outputs may be updated simulta-
neously by taking the LDAC input low.
APPLICATIONS
Automatic Test Equipment
Process Control
General Purpose Instrumentation
Each DAC output is buffered with a gain-of-two amplifier into
which an external DAC offset voltage can be inserted via the
DUTGNDx pins.
The AD7841 is available in a 44-lead MQFP package.
FUNCTIONAL BLOCK DIAGRAM
V
(+)
V
(–)
AB
DUTGND
CD
DUTGND
AB
REF
AB
REF
V
V
V
DD
CC
SS
AD7841
R
R
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
INPUT
REG
A
DAC
REG
A
DAC A
V
A
B
OUT
R
R
DB13
DB0
14
14
14
14
14
14
14
DAC
REG
B
INPUT
REG
B
DAC B
V
OUT
R
R
R
INPUT
REG
C
DAC
REG
C
DAC C
V
C
D
OUT
WR
CS
R
INPUT
REG
D
DAC
REG
D
DAC D
V
OUT
A0
A1
INPUT
REG
E
DAC
REG
E
DAC E
A2
V
E
F
OUT
LDAC
R
R
R
R
INPUT
REG
F
DAC
REG
F
DAC F
V
OUT
INPUT
REG
G
DAC
REG
G
DAC G
V
G
H
OUT
R
R
INPUT
REG
H
DAC
REG
H
R
DAC H
V
OUT
R
V
(+) V
(–)
V
(+) V
(–)
CDEF CDEF
GND
DUTGND DUTGND
CLR
REF
GH
REF
GH
REF
REF
EF
GH
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
© 1999-2011 Analog Devices, Inc. All rights reserved.
Fax: 781/461-3113
(VCC = 5 V ꢀ 5%; VDD = 15 V ꢀ 10%; VSS = –15 V ꢀ 10%; GND = DUTGND =
1
0 V; R = 5 kꢁ and C = 50 pF to GND, T = TMIN to TMAX, unless otherwise noted)
AD7841–SPECIFICATIONS
L
L
A
Parameter
A
B
Unit
Test Conditions/Comments
ACCURACY
Resolution
Relative Accuracy
Differential Nonlinearity
14
4
–0.9/2
14
2
1
Bits
LSB max
LSB max
Guaranteed Monotonic Over Temperature for All
Grades
Zero-Scale Error
Full-Scale Error
Gain Error
8
8
2
8
8
LSB max
LSB max
VREF(+) = +5 V, VREF(–) = –5 V. Typically within
2 LSB
VREF(+) = +5 V, VREF(–) = –5 V. Typically within
2 LSB
VREF(+) = +5 V, VREF(–) = –5 V
2
0.5
10
LSB typ
Gain Temperature Coefficient2 0.5
10
ppm FSR/°C typ
ppm FSR/°C max
µV max
DC Crosstalk2
120
120
See Terminology. Typically 75 µV
Per Input. Typically 0.03 µA
REFERENCE INPUTS2
DC Input Impedance
Input Current
100
1
0/5
–5/0
2/10
100
1
0/5
–5/0
2/10
MΩ typ
µA max
V min/max
V min/max
V min/max
VREF(+) Range
V
REF(–) Range
[VREF(+) – VREF(–)]
For Specified Performance. Can Go as Low as 0 V,
but Performance Not Guaranteed
DUTGND INPUTS2
DC Input Impedance
Max Input Current
Input Range3
60
0.3
–2/+2
60
0.3
–2/+2
kΩ typ
mA typ
Per Input
V min/max
OUTPUT CHARACTERISTICS2
Output Voltage Swing
VSS + 2.5 V to VSS + 2.5 V to V typ
VOUT = 2 × (VREF(–) + [VREF(+) – VREF(–)] × D)
– VDUTGND
VDD – 2.5 V
VDD – 2.5 V
Short Circuit Current
Resistive Load
Capacitive Load
15
5
50
0.5
15
5
50
0.5
mA max
kΩ min
pF max
Ω max
To 0 V
To 0 V
DC Output Impedance
DIGITAL INPUTS2
VINH, Input High Voltage
VINL, Input Low Voltage
2.4
0.8
2.4
0.8
V min
V max
I
INH, Input Current
@ 25°C
Total for All Pins
1
10
10
1
10
10
µA max
µA max
pF max
TMIN to TMAX
CIN, Input Capacitance
POWER REQUIREMENTS4
VCC
VDD
VSS
4.75/+5.25
15 V 10%
–15 V 10%
4.75/+5.25
15 V 10%
–15 V 10%
V min/max
V min/max
V min/max
For Specified Performance
For Specified Performance
For Specified Performance
Power Supply Sensitivity2
∆Full Scale/∆VDD
90
90
0.5
10
10
90
90
0.5
10
10
dB typ
dB typ
mA max
mA max
mA max
∆Full Scale/∆VSS
ICC
IDD
ISS
VINH = VCC, VINL = GND. Dynamic Current
Outputs Unloaded. Typically 8 mA
Outputs Unloaded. Typically 8 mA
NOTES
1Temperature range for A and B Versions: –40°C to +85°C.
2Guaranteed by characterization. Not production tested.
3See DUTGND Voltage Range section.
4The AD7841 is functional with power supplies of 12 V 10% with reduced output range. Output amplifier requires 2.5 V of head room at the bottom and top ends
of the transfer for function. At 12 V supplies it is recommended to restrict the reference range to 4 V.
Specifications subject to change without notice.
REV. B
–2–
AD7841
(These characteristics are included for Design Guidance and are not subject
to production testing.)
AC PERFORMANCE CHARACTERISTICS
A & B
Parameter
Versions Unit
Test Conditions/Comments
DYNAMIC PERFORMANCE
Output Voltage Settling Time
31
µs typ
Full-Scale Change to 1/2 LSB. DAC Latch Contents Alternately
Loaded with All 0s and All 1s
Slew Rate
Digital-to-Analog Glitch Impulse 230
0.7
V/µs typ
nV-s typ
Measured with VREF(+) = +5 V, VREF(–) = –5 V. DAC Latch
Alternately Loaded with 1FFF Hex and 2000 Hex. Not Dependent
on Load Conditions
Channel-to-Channel Isolation
DAC-to-DAC Crosstalk
Digital Crosstalk
99
40
0.2
dB typ
nV-s typ
nV-s typ
See Terminology
See Terminology
Feedthrough to DAC Output Under Test Due to Change in Digital
Input Code to Another Converter
Digital Feedthrough
Output Noise Spectral Density
@ 1 kHz
0.1
nV-s typ
Effect of Input Bus Activity on DAC Output Under Test
200
nV/√Hz typ All 1s Loaded to DAC. VREF(+) = VREF(–) = 0 V
Specifications subject to change without notice.
TIMING SPECIFICATIONS1, 2
(VCC = 5 V ꢀ 5%; VDD = 15 V ꢀ 10%; VSS = –15 V ꢀ 10%; GND = DUTGND = 0 V)
Parameter
Limit at TMIN, TMAX
Unit
Description
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
15
0
50
50
0
0
20
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
µs typ
Address to WR Setup Time
Address to WR Hold Time
CS Pulsewidth Low
WR Pulsewidth Low
CS to WR Setup Time
WR to CS Hold Time
Data Setup Time
Data Hold Time
Settling Time
CLR Pulse Activation Time
LDAC Pulsewidth Low
0
31
300
50
ns max
ns min
NOTES
1All input signals are specified with tr = tf = 5 ns (10% to 90% of 5 V) and timed from a voltage level of 1.6 V.
2Rise and fall times should be no longer than 50 ns.
Specifications subject to change without notice.
t1
t5
t2
t6
A0, A1, A2
t3
t4
CS
WR
t8
t7
DATA
t9
V
OUT
t10
CLR
V
OUT
t11
LDAC
Figure 1. Timing Diagram
–3–
REV. B
AD7841
ABSOLUTE MAXIMUM RATINGS1, 2
(TA = 25°C unless otherwise noted)
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
MQFP Package
VCC to GND3 . . . . . . . . . . . . . . –0.3 V, +7 V or VDD + 0.3 V
(Whichever Is Lower)
Power Dissipation . . . . . . . . . . . . . . . . . (TJ Max – TA)/θJA
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 95°C/W
Lead Temperature ............................JEDEC Industry Standard
Soldering ......................................................................J-STD-020
ESD .................................................................................. >4000 V
V
V
DD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
SS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –17 V
Digital Inputs to GND . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V
V
V
V
REF(+) to VREF(–) . . . . . . . . . . . . . . . . . . . . . –0.3 V, +18 V
REF(+) to GND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
REF(–) to GND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch-up.
3VCC must not exceed VDD by more than 0.3 V. If it is possible for this to happen
during power supply sequencing, the following diode protection scheme will ensure
protection.
DUTGND to GND . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
OUT (A–H) to GND . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
V
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
V
V
CC
DD
IN4148
HP5082-2811
V
V
CC
DD
AD7841
PIN CONFIGURATION
44 43 42 41 40 39 38 37 36 35 34
1
33
32
31
30
29
28
27
26
25
24
23
DUTGND_AB
DUTGND_GH
PIN 1
IDENTIFIER
V
A
2
3
V
V
V
H
OUT
OUT
V
V
(–)AB
(–)GH
REF
REF
REF
REF
4
5
(+)AB
(+)GH
V
CLR
DD
AD7841
TOP VIEW
(Not to Scale)
DB13
6
7
V
SS
LDAC
A2
DB12
DB11
DB10
DB9
8
9
A1
A0 10
11
CS
DB8
12 13 14 15 16 17 18 19 20 21 22
REV. B
–4–
AD7841
PIN FUNCTION DESCRIPTIONS
Pin
No.
Mnemonic
Description
1
DUTGND_AB
Device Sense Ground for DACs A and B. VOUTA and VOUTB are referenced to the voltage
applied to this pin.
2, 44, 43,
41, 37, 35,
34, 32
V
OUTA . . VOUT
H
DAC Outputs.
3, 4
5, 38
6
V
VDD
VSS
REF(–)AB, VREF(+)AB
Reference Inputs for DACs A and B. These reference voltages are referred to GND.
Positive Analog Power Supply; +15 V 10% for specified performance.
Negative Analog Power Supply; –15 V 10% for specified performance.
7
LDAC
Load DAC Logic Input (active low). When this logic input is taken low the contents of the
registers are transferred to their respective DAC registers. LDAC can be tied permanently
low enabling the outputs to be updated on the rising edge of WR.
8, 9, 10
A2, A1, A0
Address inputs. A0, A1 and A2 are decoded to select one of the eight input registers for a
data transfer.
11
12
CS
Level-Triggered Chip Select Input (active low). The device is selected when this input is low.
WR
Level-Triggered Write Input (active low), used in conjunction with CS to write data to the
AD7841 data registers. Data is latched into the selected input register on the rising edge
of WR.
13
14
VCC
GND
Logic Power Supply; 5 V 5%.
Ground.
15–28
DB0 . . DB12
Parallel Data Inputs. The AD7841 can accept a straight 14-bit parallel word on DB0 to
DB13 where DB13 is the MSB and DB0 is the LSB.
29
CLR
Asynchronous Clear Input (level sensitive, active low). When this input is low, all analog
outputs are switched to the externally set potential on the relevant DUTGND pin. The con-
tents of input registers and DAC registers A to H are not affected when the CLR pin is taken
low. When CLR is brought back high, the DAC outputs revert to their original outputs as
determined by the data in their DAC registers.
30, 31
33
VREF(+)GH, VREF(–)GH Reference Inputs for DACs G and H. These reference voltages are referred to GND.
DUTGND_GH
Device Sense Ground for DACs G and H. VOUTG and VOUTH are referenced to the voltage
applied to this pin.
36
DUTGND_EF
Device Sense Ground for DACs E and F. VOUTE and VOUTF are referenced to the voltage
applied to this pin.
39
40
42
V
REF(+)CDEF
Reference Inputs for DACs C, D, E and F. These reference voltages are referred to GND.
Reference Inputs for DACs C, D, E and F. These reference voltages are referred to GND.
Device Sense Ground for DACs C and D. VOUTC and VOUTD are referenced to the voltage
applied to this pin.
VREF(–)CDEF
DUTGND_CD
REV. B
–5–
AD7841
TERMINOLOGY
DC Output Impedance
Relative Accuracy
This is the effective output source resistance. It is dominated by
package lead resistance.
Relative accuracy or endpoint linearity is a measure of the max-
imum deviation from a straight line passing through the endpoints
of the DAC transfer function. It is measured after adjusting for
zero-scale error and full-scale error and is expressed in Least
Significant Bits.
Full-Scale Error
This is the error in DAC output voltage when all 1s are loaded
into the DAC latch. Ideally the output voltage, with all 1s loaded
into the DAC latch, should be 2 VREF(+) – 1 LSB.
Differential Nonlinearity
Zero-Scale Error
Differential nonlinearity is the difference between the measured
change and the ideal 1 LSB change between any two adjacent
codes. A specified differential nonlinearity of 1 LSB maximum
ensures monotonicity.
Zero-scale error is the error in the DAC output voltage when all
0s are loaded into the DAC latch. Ideally the output voltage,
with all 0s in the DAC latch should be equal to 2 VREF(–). Zero-
scale error is mainly due to offsets in the output amplifier.
DC Crosstalk
Gain Error
Although the common input reference voltage signals are inter-
nally buffered, small IR drops in the individual DAC reference
inputs across the die can mean that an update to one channel
can produce a dc output change in one or another of the chan-
nel outputs.
Gain Error is defined as (Full-Scale Error) – (Zero-Scale Error).
GENERAL DESCRIPTION
DAC Architecture—General
Each channel consists of a straight 14-bit R-2R voltage-mode
DAC. The full-scale output voltage range is equal to twice the
reference span of VREF(+) – VREF(–). The DAC coding is straight
binary; all 0s produces an output of 2 VREF(–); all 1s produces
an output of 2 VREF(+) – 1 LSB.
The eight DAC outputs are buffered by op amps that share
common VDD and VSS power supplies. If the dc load current
changes in one channel (due to an update), this can result in a
further dc change in one or another of the channel outputs. This
effect is most obvious at high load currents and reduces as the
load currents are reduced. With high impedance loads the effect
is virtually impossible to measure.
The analog output voltage of each DAC channel reflects the
contents of its own DAC register. Data is transferred from
the external bus to the input register of each DAC on a per
channel basis.
Output Voltage Settling Time
This is the amount of time it takes for the output to settle to a
specified level for a full-scale input change.
Bringing the CLR line low switches all the signal outputs, VOUTA
to VOUTH, to the voltage level on the relevant DUTGND pin.
When the CLR signal is brought back high, the output voltages
from the DACs will reflect the data stored in the relevant
DAC registers.
Digital-to-Analog Glitch Impulse
This is the amount of charge injected into the analog output
when the inputs change state. It is specified as the area of the
glitch in nV-secs. It is measured with VREF(+) = +5 V and
Data Loading to the AD7841
Data is loaded into the AD7841 in straight parallel 14-bit wide
words.
V
REF(–) = –5 V and the digital inputs toggled between 1FFFH
and 2000H.
Channel-to-Channel Isolation
The DAC output voltages, VOUTA – VOUTH are updated to
reflect new data in the DAC registers.
Channel-to-channel isolation refers to the proportion of input
signal from one DAC’s reference input that appears at the out-
put of another DAC. It is expressed in dBs.
The actual input register being written to is determined by the
logic levels present on the device’s address lines, as shown in
Table I.
DAC-to-DAC Crosstalk
DAC-to-DAC crosstalk is defined as the glitch impulse that
appears at the output of one converter due to both the digital
change and subsequent analog O/P change at another converter.
It is specified in nV-secs.
Table I. Address Line Truth Table
A2
A1
A0
DAC Selected
Digital Crosstalk
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
INPUT REG A (DAC A)
INPUT REG B (DAC B)
INPUT REG C (DAC C)
INPUT REG D (DAC D)
INPUT REG E (DAC E)
INPUT REG F (DAC F)
INPUT REG G (DAC G)
INPUT REG H (DAC H)
The glitch impulse transferred to the output of one converter
due to a change in digital input code to the other converter is
defined as the digital crosstalk and is specified in nV-secs.
Digital Feedthrough
When the device is not selected, high frequency logic activity on
the device’s digital inputs can be capacitively coupled both
across and through the device to show up as noise on the VOUT
pins. This noise is digital feedthrough.
REV. B
–6–
Typical Performance Characteristics–AD7841
1
4
2
1
V
V
V
V
= +15V
= –15V
DD
SS
V
V
V
V
= +15V
= –15V
DD
SS
0.75
0.5
0.25
0
(+) = +5V
(–) = –5V
REF
REF
(+) = +5V
REF
REF
2
0
(–) = –5V
T
= 25ꢂC
A
0
–1
–2
–0.25
–0.5
–0.75
–1
V
V
V
V
= +15V
= –15V
DD
SS
–2
–1
(+) = +5V
(–) = –5V
REF
REF
T
= 25ꢂC
A
0
2048 4096 6144 8192 10240 12288 14336 16384
CODE
0
2048 4096 6144 8192 10240 12288 14336 16384
CODE
–40 –20
0
20
40
60
80
100
TEMPERATURE – ꢂC
TPC 1. Typical INL Plot
TPC 2. Typical DNL Plot
TPC 3. Typical INL Error vs.
Temperature
6
5
4
3
2
1
4
1
V
V
V
= +5V
= +15V
= –15V
CC
DD
SS
V
V
V
V
= +15V
= –15V
DD
SS
= +5V
REF(+)
0.5
0
2
0
= –5V
REF(–)
V
V
V
V
= +15V
= –15V
DD
DIGITAL INPUTS @
THRESHOLDS
SS
ZERO-SCALE ERROR
FULL-SCALE ERROR
(+) = +5V
(+) = –5V
REF
REF
–2
–4
–0.5
–1
DIGITAL INPUTS @ SUPPLIES
0
–1
–40 –20
0
20
40
60
80
100
–40 –20
0
20
40
60
80
100
–40 –20
0
20
40
60
80
100
TEMPERATURE – ꢂC
TEMPERATURE – ꢂC
TEMPERATURE – ꢂC
TPC 4. Typical DNL Error vs.
Temperature
TPC 5. Zero-Scale and Full-Scale
Error vs. Temperature
TPC 6. ICC vs. Temperature
0.6
10
8
V
V
V
= +15V
= –15V
= +5V
DD
SS
CC
0.5
0.4
0.3
0.2
0.1
0
10.19
10.18
10.17
10.16
I
DD
I
SS
6
–0.1
–0.2
4
0
500 1000 1500 2000 2500 3000 3500 4000 4500 5000
27
28
29
30
31
32
33
–40 –20
0
20
40
60
80
100
TEMPERATURE – °C
SETTLING TIME – ꢃs
TPC 7. Typical Digital-to-Analog
Glitch Impulse
TPC 8. Settling Time (+)
TPC 9. IDD, ISS vs. Temperature
REV. B
–7–
AD7841
Unipolar Configuration
When bipolar-zero and full-scale adjustment are not needed, R2
and R3 can be omitted. Pin 12 on the AD588 should be con-
nected to Pin 11 and Pin 5 should be left floating.
Figure 2 shows the AD7841 in the unipolar binary circuit
configuration. The VREF(+) input of the DAC is driven by the
AD586, a 5 V reference. VREF(–) is tied to ground. Table II
gives the code table for unipolar operation of the AD7841.
Other suitable references include the REF02, a precision 5 V
reference, and the REF195, a low dropout, micropower preci-
sion 5 V reference.
+15V
+5V
R1
39kꢁ
4
6
2
3
1
V
V
DD
CC
V
7
9
V
C1
1ꢃF
OUT
OUT
(–10V TO +10V)
+15V
+5V
V
V
(+)
REF
AD588
AD7841*
14
15
16
5
10
11
R2
100kꢁ
DUTGND
2
AD586
4
V
V
DD
(+)
CC
V
(–)
REF
6
5
V
V
V
OUT
OUT
(0 TO +10V)
REF
GND
V
SS
8
12
8 13
R1
10kꢁ
AD7841*
R3
100kꢁ
SIGNAL
GND
C1
1ꢃF
DUTGND
–15V
(–)
REF
GND
*ADDITIONAL PINS OMITTED FOR CLARITY
V
SS
SIGNAL
GND
Figure 3. Bipolar 10 V Operation
Table III. Code Table for Bipolar Operation
SIGNAL
GND
–15V
*ADDITIONAL PINS OMITTED FOR CLARITY
Binary Number in DAC
Register
MSB
Figure 2. Unipolar 10 V Operation
Analog Output
LSB (VOUT)
Offset and gain may be adjusted in Figure 2 as follows: To
adjust offset, disconnect the VREF(–) input from 0 V, load the
DAC with all 0s and adjust the VREF(–) voltage until VOUT = 0 V.
For gain adjustment, the AD7841 should be loaded with all 1s
and R1 adjusted until VOUT = 2 VREF(+) – 1 LSB = 10 V(16383/
16384) = 9.99939 V.
11 1111 1111 1111
10 0000 0000 0001
10 0000 0000 0000
01 1111 1111 1111
00 0000 0000 0001
00 0000 0000 0000
2[VREF(–) + VREF (16383/16384)] V
2[VREF(–) + VREF (8193/16384)] V
2[VREF(–) + VREF (8192/16384)] V
2[VREF(–) + VREF (8191/16384)] V
2[VREF(–) + VREF (1/16384)] V
2[VREF(–)] V
Many circuits will not require these offset and gain adjustments.
In these circuits R1 can be omitted. Pin 5 of the AD586 may be
left open circuit and Pin 2 (VREF(–)) of the AD7841 tied to 0 V.
NOTES
VREF = (VREF(+) – VREF(–)).
For VREF(+) = +5 V, and VREF(–) = –5 V, VREF = 10 V, 1 LSB = 2 VREF V/214
=
Table II. Code Table for Unipolar Operation
20 V/16384 = 1.22 mV.
Binary Number in DAC Register
Analog Output
(VOUT
CONTROLLED POWER-ON OF THE OUTPUT STAGE
MSB
LSB
)
A block diagram of the output stage of the AD7841 is shown in
Figure 4. It is capable of driving a load of 5 kΩ in parallel with
50 pF. G1 to G6 are transmission gates used to control the
power on voltage present at VOUT. On power up G1 and G2 are
also used in conjunction with the CLR input to set VOUT to the
user defined voltage present at the DUTGND pin. When CLR
is taken back high, the DAC outputs reflect the data in the
DAC registers.
11
10
01
00
00
1111
0000
1111
0000
0000
1111
0000
1111
0000
0000
1111
0000
1111
0001
0000
2 VREF (16383/16384) V
2 VREF (8192/16384) V
2 VREF (8191/16384) V
2 VREF (1/16384) V
0 V
NOTES
V= VREF(+); VREF(–) = 0 V for unipolar operation.
For VREF(+) = 5 V, 1 LSB = 10 V/214 = 10 V/16384 = 610 µV.
G
1
Bipolar Configuration
G
6
DAC
Figure 3 shows the AD7841 set up for 10 V operation. The
AD588 provides precision 5 V tracking outputs that are fed to
the VREF(+) and VREF(–) inputs of the AD7841. The code table
for bipolar operation of the AD7841 is shown in Table III.
V
OUT
G
3
G
G
4
2
R = 60kꢁ
In Figure 3, full-scale and bipolar zero adjustments are provided
by varying the gain and balance on the AD588. R2 varies the
gain on the AD588 while R3 adjusts the offset of both the +5 V
and –5 V outputs together with respect to ground.
R
G
5
14kꢁ
For bipolar-zero adjustment, the DAC is loaded with
1000 . . . 0000 and R3 is adjusted until VOUT = 0 V. Full scale
is adjusted by loading the DAC with all 1s and adjusting R2
until VOUT = 10(8191/8192) V = 9.99878 V.
DUTGND
Figure 4. Block Diagram of AD7841 Output Stage
REV. B
–8–
AD7841
G
1
Power-On with CLR Low
G
6
DAC
The output stage of the AD7841 has been designed to allow
output stability during power-on. If CLR is kept low during
power-on, then just after power is applied to the AD7841, the
situation is as depicted in Figure 5. G1, G4 and G6 are open
while G2, G3 and G5 are closed.
V
OUT
G
G
3
G
G
4
2
R
R
G
1
5
14kꢁ
G
6
DAC
V
OUT
G
3
5
DUTGND
Figure 7. Output Stage After CLR Is Taken High
G
G
4
2
R
Power-On with CLR High
If CLR is high on the application of power to the device, the
output stages of the AD7841 are configured as in Figure 8 while
R
G
14kꢁ
VDD is less than 7 V and VSS is more positive than –3 V. G1 is
closed and G2 is open, thereby connecting the output of the
DAC to the input of its output amplifier. G3 and G5 are closed
while G4 and G6 are open, thus connecting the output amplifier as
a unity gain buffer. VOUT is connected to DUTGND via G5
through a 14 kΩ resistor until VDD exceeds 7 V and VSS is more
negative than –3 V.
DUTGND
Figure 5. Output Stage with VDD < 7 V or VSS > –3 V; CLR
Low
VOUT is kept within a few hundred millivolts of DUTGND via
G5 and a 14 kΩ resistor. This thin-film resistor is connected in
parallel with the gain resistors of the output amplifier. The
output amplifier is connected as a unity gain buffer via G3, and
the DUTGND voltage is applied to the buffer input via G2. The
amplifier’s output is thus at the same voltage as the DUTGND
pin. The output stage remains configured as in Figure 5 until
the voltage at VDD exceeds 7 V and VSS is more negative than
–3 V. By now the output amplifier has enough headroom to
handle signals at its input and has also had time to settle. The
internal power-on circuitry opens G3 and G5 and closes G4 and
G6. This situation is shown in Figure 6. Now the output ampli-
fier is configured in its noise gain configuration via G4 and G6.
The DUTGND voltage is still connected to the noninverting
G
1
G
6
DAC
V
OUT
G
3
5
G
G
4
2
R
R
G
14kꢁ
DUTGND
input via G2 and this voltage appears at VOUT
.
Figure 8. Output Stage Powering Up with CLR High
While VDD < 7 V or VSS > –3 V
G
1
G
6
When the difference between the supply voltages reaches 10 V,
the internal power-on circuitry opens G3 and G5 and closes G4
and G6 configuring the output stage as shown in Figure 9.
DAC
V
OUT
G
3
5
G
1
G
G
4
2
R
G
6
DAC
V
OUT
R
G
G
14kꢁ
3
5
G
G
4
2
R
DUTGND
Figure 6. Output Stage with VDD > 7 V and VSS < –3 V; CLR
R
G
14kꢁ
Low
VOUT has been disconnected from the DUTGND pin by the
opening of G5, but will track the voltage present at DUTGND
via the configuration shown in Figure 6.
DUTGND
Figure 9. Output Stage Powering Up with CLR High
When VDD > 7 V and VSS < –3 V
When CLR is taken back high, the output stage is configured as
shown in Figure 7. The internal control logic closes G1 and
opens G2. The output amr})fier is connected in a noninverting
gain-of-two configuration. The voltage that appears on the VOUT
pins is determined by the data present in the DAC registers.
REV. B
–9–
AD7841
DUTGND Voltage Range
ꢃCONTROLLER/
AD7841
During power-on, the VOUT pins of the AD7841 are connected
to the relevant DUTGND pins via G5 and the 14 kΩ thin-film
resistor. The DUTGND potential must obey the max ratings at
all times. Thus, the voltage at DUTGND must always be within
the range VSS – 0.3 V, VDD + 0.3 V. However, in order that the
voltages at the VOUT pins of the AD7841 stay within 2 V of the
relevant DUTGND potential during power-on, the voltage
applied to DUTGND should also be kept within the range
GND – 2 V, GND + 2 V.
DSP PROCESSOR*
D13
D13
DATA
BUS
D0
D0
CS
UPPER BITS OF
ADDRESS BUS
ADDRESS
DECODE
LDAC
A2
A1
A2
A1
A0
WR
Once the AD7841 has powered on and the on-chip amplifiers
have settled, any voltage that is now applied to the DUTGND
pin is subtracted from the DAC output, which has been gained
up by a factor of two. Thus, for specified operation, the maximum
voltage that can be applied to the DUTGND pin increases to the
maximum allowable 2 VREF(+) voltage, and the minimum volt-
age that can be applied to DUTGND is the minimum 2 VREF(–)
voltage. After the AD7841 has fully powered on, the outputs
can track any DUTGND voltage within this minimum/maxi-
mum range.
A0
R/W
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 10. Parallel Interface
APPLICATIONS
Power Supply Bypassing and Grounding
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. The printed circuit board on which the
AD7841 is mounted should be designed such that the analog
and digital sections are separated and confined to certain areas
of the board. This facilitates the use of ground planes that can
be easily separated. A minimum etch technique is generally best
for ground planes as it gives the best shielding. Digital and ana-
log ground planes should be joined at only one place. The GND
pin of the AD7841 should be connected to the AGND of the
system. If the AD7841 is in a system where multiple devices
require an AGND-to-DGND connection, the connection should
be made at one point only, a star ground point that should be
established as close as possible to the AD7841.
Power Supply Sequencing
When operating the AD7841, it is important that ground be
connected at all times to avoid high current states. The recom-
mended power-up sequence is VDD/VSS followed by VCC. If VCC
can exceed VDD on power-up, the diode scheme shown in the
absolute maximum ratings section will ensure protection. The
reference inputs and digital inputs should be powered up last.
Should the references exceed VDD/VSS on power-up, current
limiting resistors should be inserted in series with the reference
inputs to limit the current to 20 mA. Logic inputs should not be
applied before VCC. Current limiting resistors (470 Ω) in series
with the logic inputs should be inserted if these inputs come up
before VCC
.
Digital lines running under the device should be avoided as
these will couple noise onto the die. The analog ground plane
should be allowed to run under the AD7841 to avoid noise
coupling. The power supply lines of the AD7841 should use as
large a trace as possible to provide low impedance paths and
reduce the effects of glitches on the power supply line. Fast
switching signals like clocks should be shielded with digital
ground to avoid radiating noise to other parts of the board and
should never be run near the analog inputs.
MICROPROCESSOR INTERFACING
Interfacing the AD7841—16-Bit Interface
The AD7841 can be interfaced to a variety of 16-bit micro-
controllers or DSP processors. Figure 10 shows the AD7841
interfaced to a generic 16-bit microcontroller/DSP processor.
The lower address lines from the processor are connected to A0,
A1 and A2 on the AD7841 as shown. The upper address lines
are decoded to provide a chip select signal or an LDAC signal
for the AD7841. The fast interface timing of the AD7841 allows
direct interface to a wide variety of microcontrollers and DSPs
as shown in Figure 10.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other. This
reduces the effects of feedthrough through the board. A micro-
strip technique is by far the best but not always possible with a
double sided board. In this technique, the component side of
the board is dedicated to ground plane while signal traces are
placed on the solder side.
REV. B
–10–
AD7841
The AD7841 should have ample supply bypassing located as
close to the package as possible, ideally right up against the
device. Figure 11 shows the recommended capacitor values of
10 µF in parallel with 0.1 µF on each of the supplies. The 10 µF
capacitors are the tantalum bead type. The 0.1 µF capacitor
should have low Effective Series Resistance (ESR) and Effective
Series Inductance (ESI), such as the common ceramic types,
which provide a low impedance path to ground at high frequen-
cies to handle transient currents due to internal logic switching.
VOFFSET. However, the output of the pin driver will vary from
–10 V to +10 V with respect to DUTGND as the DAC input
code varies from 000 . . . 000 to 111 . . . 111. The VOFFSET
voltage is also applied to the DUTGND pins. When a clear is
performed on the AD7841, the output of the pin driver will be
0 V with respect to DUTGND.
The other AD588 is used to provide a reference voltage for
DACs G and H. These provide the reference voltages for the
window comparator shown in the diagram. Note that Pin 9 of
this AD588 is connected to Device GND. This causes VREF(+)GH
and VREF(–)GH to be referenced to Device GND. As DAC G
and DAC H input codes vary from 000 . . . 000 to 111 . . . 111,
V
V
CC
DD
0.1ꢃF
10ꢃF
10ꢃF
0.1ꢃF
0.1ꢃF
V
OUTG and VOUTH vary from –10 V to +10 V with respect to
AD7841
Device GND. Device GND is also connected to DUTGND.
When the AD7841 is cleared, VOUTG and VOUTH are cleared to
0 V with respect to Device GND.
V
SS
10ꢃF
Programmable Reference Generation for the AD7841 in an
ATE Application
Figure 11. Recommended Decoupling Scheme for AD7841
The AD7841 is particularly suited for use in an automated test
environment. The reference input for the AD7841 octal 14-bit
DAC requires three differential references for the eight DACs.
Programmable references may be a requirement in some ATE
applications as the offset and gain errors at the output of a DAC
can be adjusted by varying the voltages on the reference pins of
the DAC. To trim offset errors, the DAC is loaded with the
digital code 000 . . . 000 and the voltage on the VREF(–) pin is
adjusted until the desired negative output voltage is obtained.
To trim out gain errors, first the offset error is trimmed. Then
the DAC is loaded with the code 111 . . . 111 and the voltage
on the VREF(+) pin is adjusted until the desired full-scale voltage
minus one LSB is obtained.
Automated Test Equipment
The AD7841 is particularly suited for use in an automated test
environment. Figure 12 shows the AD7841 providing the neces-
sary voltages for the pin driver and the window comparator in a
typical ATE pin electronics configuration. AD588s are used to
provide reference voltages for the AD7841. In the configuration
shown, the AD588s are configured so that the voltage at Pin 1 is
5 V greater than the voltage at Pin 9 and the voltage at Pin 15 is
5 V less than the voltage at Pin 9.
V
+15V –15V
OFFSET
16
2
4
6
8
3
1
+15V
V
(+)AB
It is not uncommon in ATE design, to have other circuitry at
the output of the AD7841 that can have offset and gain errors of
up to say 300 mV. These offset and gain errors can be easily
removed by adjusting the reference voltages of the AD7841.
The AD7841 uses nominal reference values of 5 V to achieve
an output span of 10 V. Since the AD7841 has a gain of two
from the reference inputs to the DAC output, adjusting the
reference voltages by 150 mV will adjust the DAC offset and
gain by 300 mV.
REF
15
14
9
V
V
A
B
OUT
PIN
DRIVER
AD588
V
(–)AB
REF
13
10
11
12
OUT
DUTGND_AB
0.1ꢃF
–15V
7
AD7841*
1ꢃF
DUTGND_GH
DEVICE
GND
V
+15V –15V
OUT
2
16
V
G
H
4
6
8
3
1
OUT
DEVICE
GND
There are a number of suitable 8- and 10-bit DACs available
that would be suitable to drive the reference inputs of the AD7841,
such as the AD7804, a quad 10-bit digital-to-analog converter
with serial load capabilities. The voltage output from this DAC
is in the form of VBIAS VSWING and rail-to-rail operation is
achievable. The voltage reference for this DAC can be inter-
nally generated or provided externally. This DAC also contains
an 8-bit SUB DAC which can be used to shift the complete trans-
fer function of each DAC around the VBIAS point. This can be
used as a fine trim on the output voltage. In this application two
AD7804s are required to provide programmable reference capabil-
ity for all eight DACs. One AD7804 is used to drive the VREF(+)
pins and the second package used to drive the VREF(–) pins.
V
(+)GH
REF
V
15
14
OUT
V
(–)GH
REF
AD588
13
10
11
12
9
GND
DEVICE
GND
WINDOW
COMPARATOR
7
1ꢃF
TO TESTER
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 12. ATE Application
One of the AD588s is used as a reference for DACs A and B.
These DACs are used to provide high and low levels for the pin
driver. The pin driver may have an associated offset. This can
be nulled by applying an offset voltage to Pin 9 of the AD588.
First, the code 1000 . . . 0000 is loaded into the DACA latch
and the pin driver output is set to the DACA output. The
Another suitable DAC for providing programmable reference
capability is the AD8803. This is an octal 8-bit TRIMDAC®
and provides independent control of both the top and bottom
ends of the TRIMDAC. This is helpful in maximizing the reso-
lution of devices with a limited allowable voltage control range.
V
OFFSET voltage is adjusted until 0 V appears between the pin
driver output and DUTGND. This causes both VREF(+) and
REF(–) to be offset with respect to GND by an amount equal to
V
TRIMDAC is a registered trademark of Analog Devices, Inc.
REV. B
–11–
AD7841
The AD8803 has an output voltage range of GND to VDD (0 V
to 5 V). To trim the VREF(+) input, the appropriate trim range
on the AD8803 DAC can be set using the VREFL and VREFH pins
allowing 8 bits of resolution between the two points. This will
allow the VREF(+) pin to be adjusted to remove gain errors.
provide a positive output voltage and then to level shift that ana-
log voltage to the required negative range. Alternatively these
DACs can be operated with supplies of 0 V and –5 V, with the
VDD pin connected to 0 V and the GND pin connected to –5 V.
Now these can be used to provide the negative reference volt-
ages for the VREF(–) inputs on the AD7841. However, the digital
signals driving the DACs need to be level-shifted from the 0 V
to +5 V range to the –5 V to 0 V range. Figure 13 shows a
typical application circuit to provide programmable reference
capabilities for the AD7841.
To trim the VREF(–) voltage, some method of providing a trim
voltage in the required negative voltage range is required. Neither
the AD7804 or the AD8803 can provide this range in normal
operation as their output range is 0 V to 5 V. There are two
methods of producing this negative voltage. One method is to
ADDR BUS
+5V
V
ADDR
DECODER
8/10-BIT
DAC
DD
FSIN/CS
A0, A1, A2
0V TO +5V
D IN
V
(+)AB
SDATA
REF
V
OUT
A
V
A
OUT
SCLK
SCLK
GND
AD7841*
LOGIC LEVEL
SHIFT
CONTROLLER
V
8/10-BIT
DAC
DD
FSIN/CS
D IN
0V TO ꢄ5V
V
(ꢄ)AB
REF
V
OUT
B
SCLK
V
B
OUT
GND
ꢄ5V
DATA BUS
DATA BUS
GND
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 13. Programmable Reference Generation for the AD7841
REV. B
–12–
AD7841
OUTLINE DIMENSIONS
14.15
1.03
0.88
0.73
13.90 SQ
13.65
2.45
MAX
34
44
1.95 REF
1
33
PIN 1
SEATING
PLANE
10.20
10.00 SQ
9.80
TOP VIEW
(PINS DOWN)
2.20
2.00
1.80
0.23
0.11
23
11
7°
0°
22
12
0.25 MIN
0.10
0.45
0.30
LEAD WIDTH
COPLANARITY
VIEW A
0.80 BSC
LEAD PITCH
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MO-112-AA-1
Figure 14. 44-Lead Metric Quad Flat Package [MQFP]
(S-44-2)
Dimensions shown in millimeters
ORDERING GUIDE
Package
Option
Model1
Linearity Error (LSBs) DNL (LSBs) Temperature Range Package Description
AD7841ASZ
AD7841ASZ-REEL
AD7841BSZ
AD7841BSZ-REEL
EVAL-AD7841EBZ
4
4
2
2
−0.9/+2
−0.9/+2
1
1
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
44-Lead Metric Quad Flat Package [MQFP] S-44-2
44-Lead Metric Quad Flat Package [MQFP] S-44-2
44-Lead Metric Quad Flat Package [MQFP] S-44-2
44-Lead Metric Quad Flat Package [MQFP] S-44-2
Evaluation Board
1 Z = RoHS Compliant Part.
REVISION HISTORY
1/11—Rev. A to Rev. B
Changes to Absolute Maximum Ratings, Lead Temperature......4
Updated Outline Dimensions........................................................13
Moved and Changes to Ordering Guide......................................13
©1999-2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09645-0-1/11(B)
Rev. B | Page 13 of 13
相关型号：
AD7841BS-REEL
IC PARALLEL, WORD INPUT LOADING, 31 us SETTLING TIME, 14-BIT DAC, PQFP44, PLASTIC, MQFP-44, Digital to Analog Converter
ADI
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