AD7888ARZ-REEL7 [ADI]

2.7 V to 5.25 V, Micropower, 8-Channel, 125 kSPS, 12-Bit ADC in 16-Lead TSSOP; 2.7 V至5.25 V ,微功耗, 8通道, 125 kSPS时, 12位ADC,采用16引脚TSSOP
AD7888ARZ-REEL7
型号: AD7888ARZ-REEL7
厂家: ADI    ADI
描述:

2.7 V to 5.25 V, Micropower, 8-Channel, 125 kSPS, 12-Bit ADC in 16-Lead TSSOP
2.7 V至5.25 V ,微功耗, 8通道, 125 kSPS时, 12位ADC,采用16引脚TSSOP

文件: 总17页 (文件大小:197K)
中文:  中文翻译
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2.7 V to 5.25 V, Micropower, 8-Channel,  
125 kSPS, 12-Bit ADC in 16-Lead TSSOP  
a
AD7888  
FUNCTIONAL BLOCK DIAGRAM  
FEATURES  
Specified for VDD of 2.7 V to 5.25 V  
Flexible Power/Throughput Rate Management  
Shutdown Mode: 1 A Max  
Eight Single-Ended Inputs  
Serial Interface: SPI™/QSPI™/MICROWIRE™/DSP  
Compatible  
AD7888  
AIN1  
I/P  
MUX  
T/H  
V
DD  
AIN8  
2.5V  
REF  
COMP  
16-Lead Narrow SOIC and TSSOP Packages  
APPLICATIONS  
REF IN/REF OUT  
BUF  
Battery-Powered Systems (Personal Digital Assistants,  
Medical Instruments, Mobile Communications)  
Instrumentation and Control Systems  
High-Speed Modems  
CHARGE  
REDISTRIBUTION  
DAC  
SAR + ADC  
CONTROL LOGIC  
AGND  
AGND  
GENERAL DESCRIPTION  
SPORT  
The AD7888 is a high speed, low power, 12-bit ADC that oper-  
ates from a single 2.7 V to 5.25 V power supply. The AD7888 is  
capable of a 125 kSPS throughput rate. The input track-and-  
hold acquires a signal in 500 ns and features a single-ended  
sampling scheme. The AD7888 contains eight single-ended  
analog inputs, AIN1 through AIN8. The analog input on each  
of these channels is from 0 to VREF. The part is capable of con-  
verting full power signals up to 2.5 MHz.  
DIN  
DOUT SCLK  
CS  
PRODUCT HIGHLIGHTS  
1. Smallest 12-bit 8-channel ADC; 16-lead TSSOP is the same  
area as an 8-lead SOIC and less than half the height.  
The AD7888 features an on-chip 2.5 V reference that can be  
used as the reference source for the A/D converter. The REF  
IN/REF OUT pin allows the user access to this reference. Alter-  
natively, this pin can be overdriven to provide an external refer-  
ence voltage for the AD7888. The voltage range for this external  
2. Lowest Power 12-bit 8-channel ADC.  
3. Flexible power management options including automatic  
power-down after conversion.  
4. Analog input range from 0 V to VREF (VDD).  
reference is from 1.2 V to VDD  
.
5. Versatile serial I/O port (SPI/QSPI/MICROWIRE/DSP  
Compatible).  
CMOS construction ensures low power dissipation of typically  
2 mW for normal operation and 3 µW in power-down mode.  
The part is available in a 16-lead narrow body small outline  
(SOIC) and a 16-lead thin shrink small outline (TSSOP) package.  
SPI and QSPI are trademarks of Motorola, Inc.  
MICROWIRE is a trademark of National Semiconductor Corporation.  
REV. C  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat  
may result from its use. No license is granted by implication or otherwise  
under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
www.analog.com  
©2010 Analog Devices, Inc. All rights reserved.  
(VDD = 2.7 V to 5.25 V, REFIN/REFOUT = 2.5 V External/Internal Reference unless  
otherwise noted; fSCLK = 2 MHz (VDD = 2.7 V to 5.25 V); TA = TMIN to TMAX, unless otherwise noted.)  
AD7888–SPECIFICATIONS  
Parameter  
A Version1 B Version1  
Unit  
Test Condition/Comment  
DYNAMIC PERFORMANCE  
Signal to Noise + Distortion Ratio2, 3 (SNR) 71  
71  
–80  
–80  
dB typ  
dB typ  
dB typ  
fIN = 10 kHz Sine Wave, fSAMPLE = 125 kSPS  
fIN = 10 kHz Sine Wave, fSAMPLE = 125 kSPS  
fIN = 10 kHz Sine Wave, fSAMPLE = 125 kSPS  
Total Harmonic Distortion2 (THD)  
Peak Harmonic or Spurious Noise2  
Intermodulation Distortion2 (IMD)  
Second Order Terms  
–80  
–80  
–78  
–78  
–80  
2.5  
–78  
–78  
–80  
2.5  
dB typ  
dB typ  
dB typ  
MHz typ  
fa = 9.983 kHz, fb = 10.05 kHz, fSAMPLE = 125 kSPS  
fa = 9.983 kHz, fb = 10.05 kHz, fSAMPLE = 125 kSPS  
fIN = 25 kHz  
@ 3 dB  
Third Order Terms  
Channel-to-Channel Isolation2  
Full Power Bandwidth  
DC ACCURACY  
Resolution  
Any Channel  
12  
2
2
12  
1
–1/+1.5  
Bits  
LSB max  
LSB max  
Integral Nonlinearity2  
Differential Nonlinearity2  
Guaranteed No Missed Codes to 11 Bits (A Grade)  
Guaranteed No Missed Codes to 12 Bits (B Grade)  
VDD = 4.75 V to 5.25 V (Typically 3 LSB)  
Offset Error  
6
4.5  
6
4.5  
2
LSB max  
LSB max  
LSB typ  
LSB max  
LSB max  
VDD = 2.7 V to 3.6 V (Typically 2 LSB)  
Offset Error Match2  
Gain Error2  
2
3
2
2
Typically 30 LSB with Internal Reference  
Gain Error Match2  
3
ANALOG INPUT  
Input Voltage Ranges  
Leakage Current  
0 to VREF  
0 to VREF  
Volts  
1
38  
4
1
38  
4
µA max  
pF typ  
pF typ  
Input Capacitance  
When in Track  
When in Hold  
REFERENCE INPUT/OUTPUT  
REFIN Input Voltage Range  
Input Impedance  
2.5/VDD  
5
2.5/VDD  
5
V min/max  
ktyp  
Functional from 1.2 V  
Very High Impedance If Internal Reference Disabled  
REFOUT Output Voltage  
REFOUT Tempco  
2.45/2.55  
50  
2.45/2.55  
50  
V min/max  
ppm/°C typ  
LOGIC INPUTS  
Input High Voltage, VINH  
2.4  
2.1  
0.8  
10  
2.4  
2.1  
0.8  
10  
V min  
V min  
V max  
µA max  
pF max  
VDD = 4.75 V to 5.25 V  
VDD = 2.7 V to 3.6 V  
VDD = 2.7 V to 5.25 V  
Input Low Voltage, VINL  
Input Current, IIN  
Typically 10 nA, VIN = 0 V or VDD  
4
Input Capacitance, CIN  
10  
10  
LOGIC OUTPUTS  
Output High Voltage, VOH  
ISOURCE = 200 µA  
VDD = 2.7 V to 5.25 V  
ISINK = 200 µA  
V
DD – 0.5  
0.4  
10  
10  
VDD – 0.5  
V min  
Output Low Voltage, VOL  
Floating-State Leakage Current  
Floating-State Output Capacitance5  
Output Coding  
0.4  
10  
10  
V max  
µA max  
pF max  
Straight (Natural) Binary  
CONVERSION RATE  
Throughput Time  
16  
16  
SCLK Cycles  
Conversion Time + Acquisition Time. 125 kSPS with  
2 MHz Clock  
Track/Hold Acquisition Time2  
Conversion Time  
1.5  
14.5  
1.5  
14.5  
SCLK Cycles  
SCLK Cycles  
7.25 µs (2 MHz Clock)  
REV. C  
–2–  
AD7888  
Parameter  
A Version1 B Version1  
Unit  
Test Condition/Comment  
POWER REQUIREMENTS  
VDD  
2.7/5.25  
2.7/5.25  
V min/max  
IDD  
Normal Mode5 (Static)  
Normal Mode (Operational)  
Using Standby Mode  
Using Shutdown Mode  
700  
700  
450  
80  
12  
220  
2
700  
700  
450  
80  
12  
220  
µA max  
µA typ  
µA typ  
µA typ  
µA typ  
µA max  
µA max  
µA max  
mW max  
mW max  
µW max  
µW max  
mW max  
µW max  
fSAMPLE = 125 kSPS  
fSAMPLE = 50 kSPS  
fSAMPLE = 10 kSPS  
fSAMPLE = 1 kSPS  
VDD = 2.7 V to 5.25 V  
VDD = 4.75 V to 5.25 V (0.5 µA typ)  
VDD = 2.7 V to 3.6 V  
VDD = 5 V  
VDD = 3 V  
VDD = 5 V  
Standby Mode6  
Shutdown Mode6  
2
1
3.5  
2.1  
10  
3
1
Normal-Mode Power Dissipation  
Shutdown Power Dissipation  
Standby Power Dissipation  
3.5  
2.1  
10  
3
1
600  
V
DD = 3 V  
1
600  
VDD = 5 V  
VDD = 3 V  
NOTES  
1Temperature ranges as follows: A Version: –40°C to +105°C; B Version: –40°C to +105°C.  
2See Terminology.  
3SNR calculation includes distortion and noise components.  
4Sample tested @ 25°C to ensure compliance.  
5All digital inputs @ GND except CS @ VDD. No load on the digital outputs. Analog inputs @ GND.  
6SCLK @ GND when SCLK off. All digital inputs @ GND except for CS @ VDD. No load on the digital outputs. Analog inputs @ GND.  
Specifications subject to change without notice.  
ABSOLUTE MAXIMUM RATINGS1  
(TA = 25°C unless otherwise noted)  
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V  
Analog Input Voltage to AGND . . . . . –0.3 V to VDD + 0.3 V  
Digital Input Voltage to AGND . . . . . . –0.3 V to VDD + 0.3 V  
Digital Output Voltage to AGND . . . . –0.3 V to VDD + 0.3 V  
REFIN/REFOUT to AGND . . . . . . . . –0.3 V to VDD + 0.3 V  
Input Current to Any Pin Except Supplies2 . . . . . . . . 10 mA  
Operating Temperature Range  
Commercial  
(A Version) . . . . . . . . . . . . . . . . . . . . . . –40°C to +105°C  
(B Version) . . . . . . . . . . . . . . . . . . . . . . 40°C to +105°C  
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
SOIC, TSSOP Package, Power Dissipation . . . . . . . . 450 mW  
θ
JA Thermal Impedance . . . . . . . . . . . . 124.9°C/W (SOIC)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150.4°C/W (TSSOP)  
θ
JC Thermal Impedance . . . . . . . . . . . . . 42.9°C/W (SOIC)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27.6°C/W (TSSOP)  
Lead Temperature, Soldering  
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . 215°C  
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . 220°C  
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV  
NOTES  
1Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those listed in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
2Transient currents of up to 100 mA will not cause SCR latch-up.  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although the AD7888 features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD  
precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
REV. C  
–3–  
AD7888  
TIMING SPECIFICATIONS1  
(TA = TMIN to TMAX, unless otherwise noted)  
Limit at TMIN, TMAX  
(A, B Versions)  
4.75 V to 5.25 V 2.7 V to 3.6 V  
Parameter  
Unit  
Description  
2
fSCLK  
2
2
MHz max  
tCONVERT  
14.5 tSCLK  
14.5 tSCLK  
tACQ  
t13  
t23  
t3  
t4  
t5  
1.5 tSCLK  
10  
30  
75  
20  
20  
0.4 tSCLK  
0.4 tSCLK  
1.5 tSCLK  
10  
60  
100  
20  
20  
0.4 tSCLK  
0.4 tSCLK  
Throughput Time = tCONVERT + tACQ = 16 tSCLK  
CS to SCLK Setup Time  
Delay from CS until DOUT 3-State Disabled  
Data Access Time after SCLK Falling Edge  
Data Setup Time Prior to SCLK Rising Edge  
Data Valid to SCLK Hold Time  
SCLK High Pulsewidth  
SCLK Low Pulsewidth  
CS Rising Edge to DOUT High Impedance  
Power-Up Time from Shutdown  
ns min  
ns max  
ns max  
ns min  
ns min  
ns min  
ns min  
ns max  
µs typ  
t6  
t74  
t8  
80  
5
80  
5
t9  
NOTES  
1Sample tested at 25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.  
2Mark/Space ratio for the SCLK input is 40/60 to 60/40. See Serial Interface section.  
3Measured with the load circuit of Figure 1 and defined as the time required for the output to cross 0.8 V or 2.4 V with V DD = 5 V 10% and time for an output to  
cross 0.4 V or 2.0 V with VDD = 3 V 10%.  
4t8 is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated  
back to remove the effects of charging or discharging the 50 pF capacitor. This means that the time, t8, quoted in the timing characteristics is the true bus relinquish  
time of the part and is independent of the bus loading.  
Specifications subject to change without notice.  
I
200A  
OL  
TO  
OUTPUT  
PIN  
1.6V  
C
L
50pF  
200A  
I
OH  
Figure 1. Load Circuit for Digital Output Timing Specifications  
REV. C  
–4–  
AD7888  
PIN CONFIGURATIONS  
SOIC AND TSSOP  
1
2
3
4
5
6
7
8
16 SCLK  
15 DOUT  
CS  
REF IN/REF OUT  
14  
13  
V
DIN  
DD  
AD7888  
AGND  
AGND  
AIN1  
AIN2  
AIN3  
AIN4  
TOP VIEW  
(Not to Scale)  
12 AIN8  
11 AIN7  
10 AIN6  
9
AIN5  
PIN FUNCTION DESCRIPTIONS  
Pin  
No.  
Mnemonic  
Function  
1
CS  
Chip Select. Active low logic input. This input provides the dual function of initiating conversions on  
the AD7888 and also frames the serial data transfer.  
2
REF IN/REF OUT  
Reference Input/Output. The on-chip reference is available on this pin for use external to the AD7888.  
Alternatively, the internal reference can be disabled and an external reference applied to this input.  
The voltage range for the external reference is from 1.2 V to VDD  
.
3
VDD  
Power Supply Input. The VDD range for the AD7888 is from 2.7 V to 5.25 V.  
4, 13 AGND  
Analog Ground. Ground reference point for all circuitry on the AD7888. All analog input signals and  
any external reference signals should be referred to this AGND voltage. Both of these pins should  
connect to the AGND plane of a system.  
5–12 AIN1–AIN8  
Analog Input 1 through Analog Input 8. Eight single-ended analog input channels that are multiplexed  
into the on-chip track/hold. The analog input channel to be converted is selected by using the ADD0  
through ADD2 bits of the Control Register. The input range for all input channels is 0 to VREF. Any  
unused input channels should be connected to AGND to avoid noise pickup.  
14  
15  
DIN  
Data In. Logic Input. Data to be written to the AD7888’s Control Register is provided on this input  
and is clocked into the register on the rising edge of SCLK (see Control Register section).  
Data Out. Logic Output. The conversion result from the AD7888 is provided on this output as a serial  
data stream. The bits are clocked out on the falling edge of the SCLK input. The data stream consists  
of four leading zeros followed by the 12 bits of conversion data, which is provided MSB first.  
DOUT  
16  
SCLK  
Serial Clock. Logic Input. SCLK provides the serial clock for accessing data from the part and writing  
serial data to the Control Register. This clock input is also used as the clock source for the AD7888’s  
conversion process.  
REV. C  
–5–  
AD7888  
TERMINOLOGY  
Peak Harmonic or Spurious Noise  
Integral Nonlinearity  
Peak harmonic or spurious noise is defined as the ratio of the  
rms value of the next largest component in the ADC output  
spectrum (up to fS/2 and excluding dc) to the rms value of the  
fundamental. Normally, the value of this specification is deter-  
mined by the largest harmonic in the spectrum, but for ADCs  
where the harmonics are buried in the noise floor, it will be a  
noise peak.  
This is the maximum deviation from a straight line passing  
through the endpoints of the ADC transfer function. The end-  
points of the transfer function are zero scale, a point 1/2 LSB  
below the first code transition, and full scale, a point 1/2 LSB  
above the last code transition.  
Differential Nonlinearity  
This is the difference between the measured and the ideal 1 LSB  
change between any two adjacent codes in the ADC.  
Intermodulation Distortion  
With inputs consisting of sine waves at two frequencies, fa and  
fb, any active device with nonlinearities will create distortion  
products at sum and difference frequencies of mfa nfb where  
m, n = 0, 1, 2, 3, etc. Intermodulation distortion terms are  
those for which neither m nor n is equal to zero. For example,  
the second order terms include (fa + fb) and (fa fb), while the  
third order terms include (2fa + fb), (2fa fb), (fa + 2fb) and  
(fa 2fb).  
Offset Error  
This is the deviation of the first code transition (00 . . . 000) to  
(00 . . . 001) from the ideal, i.e., AGND + 0.5 LSB.  
Offset Error Match  
This is the difference in offset error between any two channels.  
Gain Error  
This is the deviation of the last code transition (111 . . . 110) to  
(111 . . . 111) from the ideal (i.e., VREF – 1.5 LSB) after the  
offset error has been adjusted out.  
The AD7888 is tested using the CCIF standard where two  
input frequencies near the top end of the input bandwidth are  
used. In this case, the second order terms are usually distanced  
in frequency from the original sine waves while the third order  
terms are usually at a frequency close to the input frequencies.  
As a result, the second and third order terms are specified sepa-  
rately. The calculation of the intermodulation distortion is as  
per the THD specification where it is the ratio of the rms sum of  
the individual distortion products to the rms amplitude of the  
sum of the fundamentals expressed in dBs.  
Gain Error Match  
This is the difference in gain error between any two channels.  
Track/Hold Acquisition Time  
The track/hold amplifier returns into track mode at the end of  
conversion. Track/Hold acquisition time is the time required for  
the output of the track/hold amplifier to reach its final value,  
within 1/2 LSB, after the end of conversion.  
Channel-to-Channel Isolation  
Signal to (Noise + Distortion) Ratio  
Channel-to-channel isolation is a measure of the level of crosstalk  
between channels. It is measured by applying a full-scale 25 kHz  
sine wave signal to all nonselected input channels and determin-  
ing how much that signal is attenuated in the selected channel.  
The figure given is the worst case across all four or eight chan-  
nels for the AD7888.  
This is the measured ratio of signal to (noise + distortion) at the  
output of the A/D converter. The signal is the rms amplitude of  
the fundamental. Noise is the sum of all nonfundamental sig-  
nals up to half the sampling frequency (fS/2), excluding dc. The  
ratio is dependent on the number of quantization levels in the  
digitization process; the more levels, the smaller the quantiza-  
tion noise. The theoretical signal to (noise + distortion) ratio for  
an ideal N-bit converter with a sine wave input is given by:  
PSR (Power Supply Rejection)  
Variations in power supply will affect the full-scale transition,  
but not the converters linearity. Power supply rejection is the  
maximum change in the full-scale transition point due to a  
change in power-supply voltage from the nominal value.  
Signal to (Noise + Distortion) = (6.02 N + 1.76) dB  
Thus for a 12-bit converter, this is 74 dB.  
Total Harmonic Distortion  
Total harmonic distortion (THD) is the ratio of the rms sum of  
harmonics to the fundamental. For the AD7888, it is defined as:  
V22 +V32 +V42 +V52 +V62  
THD(dB)= log  
V1  
where V1 is the rms amplitude of the fundamental and V2, V3,  
V4, V5 and V6 are the rms amplitudes of the second through the  
sixth harmonics.  
REV. C  
–6–  
AD7888  
CONTROL REGISTER  
The Control Register on the AD7888 is an 8-bit, write-only register. Data is loaded from the DIN pin of the AD7888 on the rising  
edge of SCLK. The data is transferred on the DIN line at the same time as the conversion result is read from the part. This requires  
16 serial clocks for every data transfer. Only the information provided on the first 8 rising clock edges (after CS falling edge) is loaded  
to the Control Register. MSB denotes the first bit in the data stream. The bit functions are outlined in Table I. The default contents  
of the Control Register on power-up is all zeros.  
Table I. Control Register Bit Function Description  
MSB  
DONTC  
ZERO  
ADD2  
ADD1  
ADD0  
REF  
PM1  
PM0  
Bit Mnemonic Comment  
7
DONTC  
Dont Care. The value written to this bit of the Control Register is a dont care, i.e., it doesnt matter if the bit is  
0 or 1.  
6
ZERO  
A zero must be written to this bit to ensure correct operation of the AD7888.  
5
4
3
ADD2  
ADD1  
ADD0  
These three address bits are loaded at the end of the present conversion sequence and select which analog input  
channel is converted for the next conversion. The selected input channel is decoded as shown in Table II.  
2
REF  
Reference Bit. With a 0 in this bit, the on-chip reference is enabled. With a 1 in this bit, the on-chip reference  
is disabled. To obtain best performance from the AD7888, the internal reference should be disabled when  
using an externally applied reference source. (See On-Chip Reference section.)  
1, 0 PM1, PM0  
Power Management Bits. These two bits decode the mode of operation of the AD7888 as shown in Table III.  
PERFORMANCE CURVES  
Figure 2 shows a typical FFT plot for the AD7888 at 100 kHz  
sample rate and 10 kHz input frequency.  
Figure 3 shows a typical plot for the SNR vs. frequency for a  
5 V supply and with a 5 V external reference.  
73.0  
4096 POINT FFT  
–10  
V
= 5V  
SAMPLING  
100kSPS  
DD  
5V EXT REFERENCE  
f
= 10kHz  
IN  
72.5  
72.0  
SNR = 70dB  
–30  
–50  
–70  
71.5  
71.0  
–90  
–110  
0
12.21  
24.41  
36.62  
48.83  
0
10.89  
21.14  
INPUT FREQUENCY kHz  
31.59  
42.14  
FREQUENCY – kHz  
Figure 2. Dynamic Performance  
Figure 3. SNR vs. Input Frequency  
REV. C  
–7–  
AD7888  
Figure 4 shows the typical power supply rejection ratio vs.  
frequency for the part. The power supply rejection ratio is defined  
as the ratio of the power in the ADC output at frequency f  
to the power of a full-scale sine wave applied to the ADC of  
frequency fs:  
CHARGE  
REDISTRIBUTION  
DAC  
SAMPLING  
CAPACITOR  
A
AIN  
CONTROL  
LOGIC  
SW1  
B
ACQUISITION  
PHASE  
PSRR (dB) = 10 log (Pf/Pfs)  
AGND  
SW2  
COMPARATOR  
Pf = Power at frequency f in ADC output, Pfs = power at fre-  
quency fs in ADC full scale input. Here a 100 mV peak-to-peak  
sine wave is coupled onto the VDD supply. Both the 2.7 V and  
5.5 V supply performances are shown.  
(REF IN/REF OUT)/2  
Figure 5. ADC Acquisition Phase  
When the ADC starts a conversion, (see Figure 6), SW2 will open  
and SW1 will move to Position B causing the comparator to  
become unbalanced. The control logic and the charge redistribu-  
tion DAC are used to add and subtract fixed amounts of charge  
from the sampling capacitor to bring the comparator back into a  
balanced condition. When the comparator is rebalanced, the  
conversion is complete. The control logic generates the ADC  
output code. Figure 7 shows the ADC transfer function.  
75  
V
= 5.5V/2.7V  
DD  
77  
79  
81  
100mV p-p SINE WAVE ON V  
REF = 2.488V EXT REFERENCE  
DD  
IN  
83  
85  
87  
CHARGE  
REDISTRIBUTION  
DAC  
89  
91  
93  
SAMPLING  
CAPACITOR  
A
VIN  
CONTROL  
LOGIC  
SW1  
B
CONVERSION  
PHASE  
2.65  
12.85  
23.15  
33.65  
54.35  
64.15  
43.85  
SW2  
AGND  
COMPARATOR  
INPUT FREQUENCY kHz  
Figure 4. PSRR vs. Frequency  
CIRCUIT INFORMATION  
The AD7888 is a fast, low power, 12-bit, single supply, 8-channel  
A/D converter. The part can be operated from 3 V (2.7 V to  
3.6 V) supply or from 5 V (4.75 V to 5.25 V) supply. When  
operated from either a 5 V supply or a 3 V supply, the AD7888  
is capable of throughput rates of 125 kSPS when provided with  
a 2 MHz clock.  
(REF IN/REF OUT)/2  
Figure 6. ADC Conversion Phase  
ADC TRANSFER FUNCTION  
The output coding of the AD7888 is straight binary. The  
designed code transitions occur at successive integer LSB  
values (i.e., 1 LSB, 2 LSBs, etc.). The LSB size is = VREF  
4096. The ideal transfer characteristic for the AD7888 is  
shown in Figure 7 below.  
/
The AD7888 provides the user with an 8-channel multiplexer,  
on-chip track/hold, A/D converter, reference and serial interface  
housed in a tiny 16-lead TSSOP package, which offers the user  
considerable space saving advantages over alternative solutions.  
The serial clock input accesses data from the part and also  
provides the clock source for the successive-approximation  
A/D converter. The analog input range is 0 to VREF (where  
the externally-applied VREF can be between 1.2 V and VDD).  
111...111  
111...110  
111...000  
1LSB = V  
/4096  
REF  
011...111  
The 8-channel multiplexer is controlled by the parts Control  
Register. This Control Register also allows the user to power-off  
the internal reference and to determine the Modes of Operation.  
000...010  
000...001  
000...000  
CONVERTER OPERATION  
+V  
1.5LSB  
REF  
0.5LSB  
0V  
ANALOG INPUT  
The AD7888 is a successive-approximation analog-to-digital  
converter based around a charge redistribution DAC. Figures 5  
and 6 show simplified schematics of the ADC. Figure 5 shows  
the ADC during its acquisition phase. SW2 is closed and SW1 is  
in Position A, the comparator is held in a balanced condition  
and the sampling capacitor acquires the signal on AIN.  
Figure 7. Transfer Characteristic  
REV. C  
–8–  
AD7888  
For ac applications, removing high frequency components from  
the analog input signal is recommended by use of an RC low-  
pass filter on the relevant analog input pin. In applications  
where harmonic distortion and signal to noise ratio are critical  
the analog input should be driven from a low impedance source.  
Large source impedances will significantly affect the ac perfor-  
mance of the ADC. This may necessitate the use of an input  
buffer amplifier. The choice of the op amp will be a function of  
the particular application.  
TYPICAL CONNECTION DIAGRAM  
Figure 8 shows a typical connection diagram for the AD7888.  
Both AGND pins are connected to the analog ground plane of  
the system. VREF is connected to a well decoupled VDD pin to  
provide an analog input range of 0 V to VDD. The conversion  
result is output in a 16-bit word with four leading zeroes fol-  
lowed by the MSB of the 12-bit result. For applications where  
power consumption is of concern, the automatic power down at  
the end of conversion should be used to improve power perfor-  
mance. See Modes of Operation section of the data sheet.  
When no amplifier is used to drive the analog input the source  
impedance should be limited to low values. The maximum  
source impedance will depend on the amount of total harmonic  
distortion (THD) that can be tolerated. The THD will increase  
as the source impedance increases and performance will degrade.  
Figure 10 shows a graph of the total harmonic distortion versus  
analog input signal frequency for different source impedances.  
SUPPLY 2.7V  
TO 5.25V  
10F  
0.1F  
SERIAL  
INTERFACE  
V
REF IN/  
REF OUT  
DD  
AD7888  
AIN1  
AIN2  
SCLK  
DOUT  
DIN  
0V TO  
REF IN/  
REF OUT  
INPUT  
65  
THD vs. FREQUENCY FOR DIFFERENT  
SOURCE IMPEDANCES  
C/P  
AIN8  
V
= 5V  
70  
75  
DD  
5V EXT REFERENCE  
CS  
AGND  
AGND  
R
= 1k, C = 100pF  
IN  
IN  
R
= 50, C = 2.2nF  
IN  
IN  
Figure 8. Typical Connection Diagram  
Analog Input  
80  
85  
90  
Figure 9 shows an equivalent circuit of the analog input structure  
of the AD7888. The two diodes D1 and D2 provide ESD pro-  
tection for the analog inputs. Care must be taken to ensure that  
the analog input signal never exceeds the supply rails by more  
than 200 mV. This will cause these diodes to become forward-  
biased and start conducting current into the substrate. 20 mA is  
the maximum current these diodes can conduct without causing  
irreversible damage to the part. However, it is worth noting that  
a small amount of current (1 mA) being conducted into the  
substrate due to an overvoltage on an unselected channel, can  
cause inaccurate conversions on a selected channel. The capaci-  
tor C1 in Figure 9 is typically about 4 pF and can primarily be  
attributed to pin capacitance. The resistor R1 is a lumped com-  
ponent made up of the on resistance of a multiplexer and a switch.  
This resistor is typically about 100 . The capacitor C2 is the  
ADC sampling capacitor and has a capacitance of 20 pF typically.  
R
= 10, C = 10nF  
IN  
IN  
0.15  
10.89  
21.14  
31.59  
42.14  
49.86  
INPUT FREQUENCY kHz  
Figure 10. THD vs. Analog Input Frequency  
Analog Input Selection  
On power-up, the default AIN selection is AIN1. When returning  
to normal operation from power-down, the AIN selected will be  
the same one that was selected prior to power-down being initi-  
ated. Table II below shows the multiplexer address correspond-  
ing to each analog input from AIN1 to AIN8 for the AD7888.  
Table II. Channel Configurations  
Note: The analog input capacitance seen when the track and  
hold is in track mode is typically 38 pF, while in hold mode it is  
typically 4 pF.  
ADD2  
ADD1  
ADD0  
Analog Input Channel  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
AIN1  
AIN2  
AIN3  
AIN4  
AIN5  
AIN6  
AIN7  
AIN8  
V
DD  
D1  
C2  
20pF  
R1  
V
IN  
C1  
4pF  
D2  
CONVERSION PHASE SWITCH OPEN  
TRACK PHASE SWITCH CLOSED  
On-Chip Reference  
The AD7888 has an on-chip 2.5 V reference. This reference can  
be enabled or disabled by clearing or setting the REF bit in the  
Control Register, respectively. If the on-chip reference is to  
be used externally in a system, it must be buffered before it is  
applied elsewhere. If an external reference is applied to the device,  
the internal reference is automatically overdriven. However, in  
Figure 9. Equivalent Analog Input Circuit  
REV. C  
–9–  
AD7888  
order to obtain optimum performance from the device it is  
advised to disable the internal reference by setting the REF bit  
in the Control Register when an external reference is applied.  
When the internal reference is disabled, SW1 in Figure 11 will  
open and the input impedance seen at the REF IN/REF OUT  
pin is the input impedance of the reference buffer, which is in  
the region of giga . When the reference is enabled, the input  
impedance seen at the pin is typically 5 k.  
the only way to fully power it up again is to reprogram the  
power management bits to PM1 = PM0 = 0, i.e., normal  
mode. In this case the device will power up on the 16th SCLK  
rising edge after the CS falling edge as this is when the power  
management bits become effective.  
Power-Up Times  
The AD7888 has an approximate 1 µs power-up time when  
powering up from standby or when using an external reference.  
When VDD is first connected, the AD7888 will fully power up,  
i.e., it powers up in normal mode. If the part is put into shut-  
down, a subsequent power-up will take approximately 5 µs. The  
AD7888 wake-up time is very short in the autostandby mode so  
it is possible to wake up the part and carry out a valid conver-  
sion in the same read/write operation.  
REF IN/REF OUT  
SW1  
5k⍀  
2.5V  
Figure 11. On-Chip Reference Circuitry  
POWER vs. THROUGHPUT RATE  
By operating the AD7888 in autoshutdown or autostandby  
mode the average power consumption of the AD7888 decreases  
at lower throughput rates. Figure 12 shows how as the through-  
put rate is reduced, the device remains in its power-down state  
longer and the average power consumption over time drops  
accordingly.  
Table III. Power Management Options  
PM1 PM0 Mode  
0
0
Normal Operation. In this mode, the AD7888  
remains in full power mode regardless of the  
status of any of the logic inputs. This mode  
allows the fastest possible throughput rate from  
the AD7888.  
For example, if the AD7888 were operated in a continuous  
sampling mode, with a throughput rate of 10 kSPS and a SCLK  
of 2 MHz (VDD = 5 V), and if PM1 = 1 and PM0 = 0, i.e., the  
device is in autoshutdown mode and the on-chip reference is  
used, the power consumption is calculated as follows. The  
0
1
Full Shutdown. In this mode, the AD7888 is  
in full shutdown mode with all circuitry on the  
AD7888, including the on-chip reference, enter-  
ing its power-down mode. The AD7888 retains  
the information in the control Register bits  
while in full shutdown. The part remains in full  
shutdown until these bits are changed.  
power dissipation during normal operation is 3.5 mW (VDD  
=
5 V). If the power-up time is 5 µs and the remaining conversion-  
plus-acquisition time is 15.5 tSCLK, i.e., approximately 7.75 µs,  
(see Figure 14a), the AD7888 can be said to dissipate 3.5 mW  
for 12.75 µs during each conversion cycle. If the throughput rate  
is 10 kSPS, the cycle time is 100 µs and the average power dissi-  
pated during each cycle is (12.75/100) × (3.5 mW) = 446.25 µW.  
If VDD = 3 V SCLK = 2 MHz, and the device is again in auto-  
shutdown mode using the on-chip reference, the power dissipa-  
tion during normal operation is 2.1 mW. The AD7888 can now  
be said to dissipate 2.1 mW for 12.75 µs during each conversion  
cycle. With a throughput rate of 10 kSPS, the average power  
dissipated during each cycle is (12.75/100) × (2.1 mW) =  
267.75 µW. Figure 12 shows the power vs. throughput rate for  
automatic shutdown with both 5 V and 3 V supplies.  
1
1
0
1
Autoshutdown. In this mode, the AD7888  
automatically enters full shutdown mode at the  
end of each conversion. Wake-up time from full  
shutdown is 5 µs and the user should ensure that  
5 µs have elapsed before attempting to perform  
a valid conversion on the part in this mode.  
Autostandby. In this standby mode, portions  
of the AD7888 are powered down but the on-  
chip reference voltage remains powered up. The  
REF bit should be 0 to ensure the on-chip refer-  
ence is enabled. This mode is similar to auto-  
shutdown but allows the part to power-up  
much faster.  
10  
V
= 5V  
DD  
SCLK = 2MHz  
1
POWER-DOWN OPTIONS  
The AD7888 provides flexible power management to allow the  
user to achieve the best power performance for a given through-  
put rate.  
V
= 3V  
DD  
SCLK = 2MHz  
The power management options are selected by programming  
the power management bits (i.e., PM1 and PM0) in the control  
register. Table III summarizes the options available. When the  
power management bits are programmed for either of the auto  
power-down modes, the part will enter the power-down mode  
on the 16th rising SCLK edge after the falling edge of CS. The  
first falling SCLK edge after the CS falling edge will cause the  
part to power up again. When the AD7888 is in full shutdown,  
0.1  
0.01  
0
10  
20  
30  
40  
50  
THROUGHPUT kSPS  
Figure 12. Power vs. Throughput  
REV. C  
–10–  
AD7888  
THE PART REMAINS POWERED UP  
AT ALL TIMES AS PM1 AND PM0 = 0  
CS  
16  
1
SCLK  
DOUT  
DIN  
4 LEADING ZEROES + CONVERSION RESULT  
DATA IN  
CONTROL REGISTER DATA IS LOADED ON THE  
FIRST 8 CLOCKS. PM1 AND PM0 = 0 TO KEEP  
THE PART IN THIS MODE  
Figure 13. Normal-Mode Operation  
MODES OF OPERATION  
Full Shutdown (PM1 = 0, PM0 = 1)  
The AD7888 has a number of different modes of operation.  
These are designed to provide flexible power management  
options. These options can be chosen to optimize the power  
dissipation/throughput rate ratio for differing application require-  
ments. The modes of operation are controlled by the PM1 and  
PM0 bits of the Control Register as outlined previously.  
In this mode, all internal circuitry on the AD7888, including the  
on-chip reference, is powered-down. The part retains the infor-  
mation in the Control Register during full shutdown. The part  
remains in full shutdown until the power management bits are  
changed. If the power management bits are changed to PM1 = 1  
and PM0 = 0, i.e., the autoshutdown mode, the part will remain  
in shutdown (now in autoshutdown) but will power up once a  
conversion is initiated after that (see Power-Up Times section).  
The part changes mode as soon as the control register has been  
updated, so if the part is in full shutdown mode and the power  
management bits are changed to PM1 = PM0 = 0, i.e., normal  
mode, then the part will power up on the 16th SCLK rising edge.  
Normal Mode (PM1 = 0, PM0 = 0)  
This mode is intended for fastest throughput rate performance  
as the user does not have to worry about any power-up times  
with the AD7888 remaining fully powered all the time. Figure  
13 shows the general diagram of the operation of the AD7888 in  
this mode.  
Autoshutdown (PM1 = 1, PM0 = 0)  
The data presented to the AD7888 on the DIN line during the  
first eight clock cycles of the data transfer are loaded to the  
Control Register. The part will remain powered up at the end of  
the conversion as long as PM1 and PM0 were set to zero in the  
write during that conversion. To continue to operate in this  
mode, the user must ensure that PM1 and PM0 are both loaded  
with 0 on every data transfer.  
In this mode, the AD7888 automatically enters its power-down  
mode at the end of every conversion. Figure 14a shows the  
general diagram of the operation of the AD7888 in this mode.  
When CS goes from high to low, all on-chip circuitry will start  
to power up on the next falling edge of SCLK. On the sixteenth  
SCLK rising edge the part will power down again. It takes  
approximately 5 µs for the AD7888 internal circuitry to be fully  
powered up. As a result, a conversion (or sample-and-hold  
acquisition) should not be initiated during this 5 µs. The input  
signal is sampled on the second rising edge of SCLK following  
the CS falling edge. The user should ensure that 5 µs elapse  
between the first falling edge of SCLK after the falling edge of  
The falling edge of CS initiates the sequence and the input  
signal is sampled on the second rising edge of the SCLK input.  
Sixteen serial clock cycles are required to complete the conver-  
sion and access the conversion result. Once a data transfer is  
complete (CS has returned high), another conversion can be  
initiated immediately by bringing CS low again.  
THE PART ENTERS  
THE PART POWERS UP FROM  
SHUTDOWN ON SCLK FALLING EDGE AS  
PM1 = 1 AND PM0 = 0  
SHUTDOWN AT THE END OF  
CONVERSION AS PM1 = 1 AND PM0 = 0  
CS  
16  
16  
1
2
1
SCLK  
t10 = 5s  
4 LEADING ZEROES + CONVERSION RESULT  
DOUT  
DIN  
4 LEADING ZEROES + CONVERSION RESULT  
DATA IN  
DATA IN  
CONTROL REGISTER DATA IS LOADED ON THE  
FIRST 8 CLOCKS. PM1 = 1 AND PM0 = 0  
PM1 = 1 AND PM0 = 0 TO KEEP THE  
PART IN THIS MODE  
Figure 14a. Autoshutdown Operation  
REV. C  
–11–  
AD7888  
THE PART ENTERS  
SHUTDOWN AT THE END  
OF CONVERSION AS  
PM1 = 1 AND PM0 = 0  
THE PART ENTERS  
SHUTDOWN AT THE END OF  
CONVERSION AS PM1 = 1  
AND PM0 = 0  
THE PART BEGINS TO POWER-  
UP FROM SHUTDOWN  
THE PART REMAINS POWERED  
UP AS PM1 AND PM0 = 0  
CS  
8
16  
8
1
1
16  
1
8
16  
SCLK  
DOUT  
4 LEADING ZEROES  
+ CONVERSION RESULT  
4 LEADING ZEROES  
+ CONVERSION RESULT  
4 LEADING ZEROES  
+ CONVERSION RESULT  
DATA IN  
DIN  
DATA IN  
DATA IN  
PM1 = 1 AND PM0 = 0 TO  
PLACE THE PART BACK IN  
AUTOSHUTDOWN MODE  
CONTROL REGISTER DATA IS LOADED ON  
THE FIRST 8 CLOCKS. PM1 = 1 AND PM0 = 0  
PM1 AND PM0 = 0 TO PLACE  
THE PART IN NORMAL MODE  
Figure 14b. Autoshutdown Operation  
Autostandby (PM1 = 1, PM0 = 1)  
CS and the second rising edge of SCLK as shown in Figure 14a.  
In microcontroller applications, this is readily achievable by  
driving the CS input from one of the port lines and ensuring  
that the serial data read (from the microcontrollers serial port) is  
not initiated for 5 µs. In DSP applications, where the CS is  
generally derived from the serial frame synchronization line, it is  
not possible to separate the first falling edge and second rising  
edge of SCLK after the CS falling edge by up to 5 µs. There-  
fore, the user will need to write to the Control Register to exit  
this mode and (by writing PM1 = 0 and PM0 = 0) put the part  
into normal mode. A second conversion will then need to be  
initiated when the part is powered up to obtain a conversion  
result as shown in Figure 14b.  
In this mode, the AD7888 automatically enters a standby (or  
sleep) mode at the end of every conversion. In this standby  
mode, all on-chip circuitry, apart from the on-chip reference, is  
powered down. This mode is similar to the autoshutdown but  
in this case, the power-up time is much shorter as the on-chip  
reference remains powered up at all times.  
Figure 15 shows the general diagram of the operation of the  
AD7888 in this mode. On the first falling SCLK edge after CS  
goes low, the AD7888 comes out of standby. The AD7888  
wake-up time is very short in this mode so it is possible to wake  
up the part and carry out a valid conversion in the same read/  
write operation. The input signal is sampled on the second  
rising edge of SCLK following the CS falling edge. At the end  
of conversion (last rising edge of SCLK) the part automatically  
enters its standby mode.  
THE PART POWERS UP  
FROM STANDBY ON SCLK  
FALLING EDGE AS PM1 = 1  
AND PM0 = 1  
THE PART ENTERS  
STANDBY AT THE END OF  
CONVERSION AS  
PM1 = 1 AND PM0 = 1  
CS  
16  
16  
1
1
SCLK  
4 LEADING ZEROES + CONVERSION RESULT  
DOUT  
4 LEADING ZEROES + CONVERSION RESULT  
DATA IN  
DATA IN  
DIN  
CONTROL REGISTER DATA IS LOADED ON  
THE FIRST 8 CLOCKS. PM1 = 1 AND PM0 = 1  
PM1 = 1 AND PM0 = 1 TO KEEP  
THE PART IN THIS MODE  
Figure 15. Autostandby Operation  
REV. C  
–12–  
AD7888  
SERIAL INTERFACE  
Writing of information to the Control Register takes place on  
the first eight rising edges of SCLK in a data transfer. The Con-  
trol Register is always written to when a data transfer takes  
place. The user must be careful to always set up the correct  
information on the DIN line when reading data from the part.  
Figure 16 shows the detailed timing diagram for serial interfac-  
ing to the AD7888. The serial clock provides the conversion  
clock and also controls the transfer of information to and from  
the AD7888 during conversion.  
CS initiates the data transfer and conversion process. For the  
autoshutdown mode, the first falling edge of SCLK after the  
falling edge of CS wakes up the part. In all cases, it gates the  
serial clock to the AD7888 and puts the on-chip track/hold into  
track mode. The input signal is sampled on the second rising  
edge of the SCLK input after the falling edge of CS. Thus, the  
first one and one-half clock cycles after the falling edge of CS is  
when the acquisition of the input signal takes place. This time is  
denoted as the acquisition time (tACQ). In autoshutdown mode,  
the acquisition time must allow for the wake-up time of 5 µs. The  
on-chip track/hold goes from track mode to hold mode on the  
second rising edge of SCLK and a conversion is also initiated on  
this edge. The conversion process takes a further fourteen and  
one-half SCLK cycles to complete. The rising edge of CS will  
put the bus back into three-state. If CS is left low a new conver-  
sion will be initiated.  
Sixteen serial clock cycles are required to perform the conver-  
sion process and to access data from the AD7888. In applica-  
tions where the first serial clock edge, following CS going low, is  
a falling edge, this edge clocks out the first leading zero. Thus,  
the first rising clock edge on the SCLK clock has the first lead-  
ing zero provided. In applications where the first serial clock  
edge, following CS going low, is a rising edge, the first leading  
zero may not be set up in time for the processor to read it cor-  
rectly. However, subsequent bits are clocked out on the falling  
edge of SCLK so they are provided to the processor on the  
following rising edge. Thus, the second leading zero is clocked  
out on the falling edge subsequent to the first rising edge. The  
final bit in the data transfer is valid on the 16th rising edge,  
having being clocked out on the previous falling edge.  
NOTE: The mark space ratio for SCLK is specified for at least  
40% high time (with corresponding 60% low time) or 40% low  
time (with corresponding 60% high time). As the SCLK frequency  
is reduced, the mark space ratio may vary provided the conver-  
sion time never exceeds 50 µsto avoid capacitive droop effects.  
The input channel that is sampled is the one selected in the  
previous write to the Control Register. Thus, the user must  
write ahead of the channel for conversion. In other words, the  
user must write the channel address for the next conversion  
while the present conversion is in progress.  
tACQ  
tCONVERT  
CS  
t6  
t1  
16  
1
2
3
4
5
6
15  
SCLK  
DOUT  
t7  
t8  
t2  
t3  
DB11  
THREE-  
STATE  
THREE-  
STATE  
4 LEADING ZEROS  
DB10  
DB9  
DB0  
t4  
t5  
ZERO  
ADD2  
ADD1  
ADD0  
REF  
PM1  
PM0  
DONTC  
DIN  
Figure 16. Serial Interface Timing Diagram  
REV. C  
–13–  
AD7888  
MICROPROCESSOR INTERFACING  
The Timer Registers, etc., are loaded with a value that will  
provide an interrupt at the required sample interval. When an  
interrupt is received, a value is transmitted with TFS/DT (ADC  
control word). The TFS is used to control the RFS and hence  
the reading of data. The frequency of the serial clock is set in  
the SCLKDIV Register. When the instruction to transmit with  
TFS is given, (i.e., AX0 = TX0), the state of the SCLK is checked.  
The DSP will wait until the SCLK has gone high, low and high  
before transmission will start. If the timer and SCLK values are  
chosen such that the instruction to transmit occurs on or near  
the rising edge of SCLK, the data may be transmitted or it may  
wait until the next clock edge.  
The serial interface on the AD7888 allows the part to be directly  
connected to a range of many different microprocessors. This  
section explains how to interface the AD7888 with some of the  
more common microcontroller and DSP serial interface protocols.  
AD7888 to TMS320C5x  
The serial interface on the TMS320C5x uses a continuous serial  
clock and frame synchronization signals to synchronize the data  
transfer operations with peripheral devices like the AD7888.  
The CS input allows easy interfacing with an inverter between  
the serial clock of the TMS320C5x and the AD7888 being the  
only glue logic required. The serial port of the TMS320C5x is  
set up to operate in burst mode with internal CLKX (TX serial  
clock) and FSX (TX frame sync). The serial port control register  
(SPC) must have the following setup: FO = 0, FSM = 1, MCM  
= 1 and TXM = 1. The connection diagram is shown in Figure 17.  
For example, the ADSP-2111 has a master clock frequency of  
16 MHz. If the SCLKDIV Register is loaded with the value 3, a  
SCLK of 2 MHz is obtained, and eight master clock periods will  
elapse for every one SCLK period. If the timer registers are  
loaded with the value 803, then 100.5 SCLKs will occur between  
interrupts and subsequently between transmit instructions. The  
situation will result in nonequidistant sampling as the transmit  
instruction is occurring on a SCLK edge. If the number of SCLKs  
between interrupts is not a figure of N.5, equidistant sampling  
will be implemented by the DSP.  
TMS320C5x*  
CLKX  
AD7888*  
SCLK  
CLKR  
DR  
DOUT  
DIN  
DT  
FSX  
FSR  
CS  
ADSP-21xx*  
SCLK  
AD7888*  
SCLK  
DR  
DOUT  
DIN  
*ADDITIONAL PINS OMITTED FOR CLARITY  
DT  
Figure 17. Interfacing to the TMS320C5x  
AD7888 to ADSP-21xx  
RFS  
TFS  
CS  
The ADSP-21xx family of DSPs are interfaced to the AD7888  
with an inverter between the serial clock of the ADSP-21xx  
and the AD7888. This is the only glue logic required. The SPORT  
control register should be set up as follows:  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 18. Interfacing to the ADSP-21xx  
AD7888 to DSP56xxx  
TFSW = RFSW = 1, Alternate Framing  
INVRFS = INVTFS = 1, Active Low Frame Signal  
DTYPE = 00, Right Justify Data  
SLEN = 1111, 16-Bit Data Words  
ISCLK = 1, Internal Serial Clock  
TFSR = RFSR = 1, Frame Every Word  
IRFS = 0  
The connection diagram in Figure 19 shows how the AD7888  
can be connected to the SSI (Synchronous Serial Interface) of  
the DSP56xxx family of DSPs from Motorola. The SSI is oper-  
ated in synchronous mode (SYN bit in CRB = 1) with internally  
generated 1-bit clock period frame sync for both TX and RX  
(bits FSL1 = 1 and FSL0 = 0 in CRB). Set the word length to  
16 by setting bits WL1 = 1 and WL0 = 0 in CRA. An inverter is  
also necessary between the SCLK from the DSP56xxx and the  
SCLK pin of the AD7888 as shown in Figure 19.  
ITFS = 1  
The connection diagram is shown in Figure 18. The ADSP-  
21xx has the TFS and RFS of the SPORT tied together with  
TFS set as an output and RFS set as in input. The DSP oper-  
ated in Alternate Framing Mode and the SPORT Control Reg-  
ister is set up as described. The frame synchronization signal  
generated on the TFS is tied to CS and, as with all signal pro-  
cessing applications, equidistant sampling is necessary. How-  
ever, in this example the timer interrupt is used to control the  
sampling rate of the ADC and, under certain conditions, equi-  
distant sampling may not be achieved.  
AD7888*  
DSP56xxx*  
SCK  
SCLK  
DOUT  
DIN  
SRD  
STD  
SC2  
CS  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 19. Interfacing to the DSP56xxx  
REV. C  
–14–  
AD7888  
AD7888 to MC68HC11  
APPLICATION HINTS  
Grounding and Layout  
The AD7888 has very good immunity to noise on the power  
supplies as can be seen by the PSRR vs. Frequency graph.  
However, care should still be taken with regard to grounding  
and layout.  
The Serial Peripheral Interface (SPI) on the MC68HC11 is  
configured for Master Mode (MSTR = 1), Clock Polarity Bit  
(CPOL) = 1 and the Clock Phase Bit (CPHA) = 1. The SPI is  
configured by writing to the SPI Control Register (SPCR)see  
68HC11 User Manual. The serial transfer will take place as two  
8-bit operations. A connection diagram is shown in Figure 20.  
The printed circuit board that houses the AD7888 should be  
designed so the analog and digital sections are separated and  
confined to certain areas of the board. This facilitates the use of  
ground planes that can be easily separated. A minimum etch  
technique is generally best for ground planes as it gives the best  
shielding. Digital and analog ground planes should be joined in  
only one place. Both AGND pins of the AD7888 should be  
sunk in the AGND plane. The AGND plane and DGND plane  
connection should be made at one point only, a star ground  
point that should be established as close as possible to an AGND  
pin of the AD7888.  
MC68HC11*  
SCLK/PD4  
AD7888*  
SCLK  
MISO/PD2  
MOSI/PD3  
PA0  
DOUT  
DIN  
CS  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 20. Interfacing to the MC68HC11  
AD7888 to 8051  
Avoid running digital lines under the device as these will couple  
noise onto the die. The analog ground plane should be allowed  
to run under the AD7888 to avoid noise coupling. The power  
supply lines to the AD7888 should use as large a trace as pos-  
sible to provide low impedance paths and reduce the effects of  
glitches on the power supply line. Fast switching signals like  
clocks should be shielded with digital ground to avoid radiating  
noise to other sections of the board, and clock signals should  
never be run near the analog inputs. Avoid crossover of digital  
and analog signals. Traces on opposite sides of the board should  
run at right angles to each other. This will reduce the effects of  
feedthrough through the board. A microstrip technique is by far  
the best but is not always possible with a double-sided board. In  
this technique, the component side of the board is dedicated to  
ground planes while signals are placed on the solder side.  
It is possible to implement a serial interface using the data  
ports on the 8051. This allows a full duplex serial transfer to be  
implemented. The technique involves bit-bangingan I/O port  
(e.g., P1.0) to generate a serial clock and using two other I/O  
ports (e.g., P1.1 and P1.2) to shift data in and outsee  
Figure 21.  
AD7888*  
8051*  
P1.0  
P1.1  
P1.2  
P1.3  
SCLK  
DOUT  
DIN  
CS  
Good decoupling is also important. All analog supplies should  
be decoupled with 10 µF tantalum in parallel with 0.1 µF capaci-  
tors to AGND. To achieve the best from these decoupling  
components, they must be placed as close as possible to the  
device, ideally right up against the device.  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 21. Interfacing to the 8051 Using I/O Ports  
AD7888 to PIC16C6x/7x  
Evaluating the AD7888 Performance  
The PIC16C6x Synchronous Serial Port (SSP) is configured  
as an SPI Master with the Clock Polarity Bit = 1. This is done  
by writing to the Synchronous Serial Port Control Register  
(SSPCON). See user PIC16/17 Microcontroller User Manual.  
Figure 22 shows the hardware connections needed to interface  
to the PIC16/17. In this example I/O port RA1 is being used to  
pulse CS. This microcontroller only transfers eight bits of data  
during each serial transfer operation. Therefore, two consecutive  
read/write operations are needed.  
The recommended layout for the AD7888 is outlined in the  
evaluation board for the AD7888. The evaluation board pack-  
age includes a fully assembled and tested evaluation board,  
documentation, and software for controlling the board from the  
PC via the EVAL-CONTROL BOARD. The EVAL-CONTROL  
BOARD can be used in conjunction with the AD7888 evalua-  
tion board, as well as many other Analog Devices evaluation  
boards ending in the CB designator, to demonstrate/evaluate  
the ac and dc performance of the AD7888.  
The software allows the user to perform ac (fast Fourier trans-  
form) and dc (histogram of codes) tests on the AD7888.  
PIC16C6x/7x*  
SCK/RC3  
AD7888*  
SCLK  
SDO/RC5  
SDI/RC4  
RA1  
DOUT  
DIN  
CS  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 22. Interfacing to the PIC16C6x/17x  
REV. C  
–15–  
AD7888  
OUTLINE DIMENSIONS  
10.00 (0.3937)  
9.80 (0.3858)  
9
8
16  
1
6.20 (0.2441)  
5.80 (0.2283)  
4.00 (0.1575)  
3.80 (0.1496)  
1.27 (0.0500)  
BSC  
0.50 (0.0197)  
0.25 (0.0098)  
45°  
1.75 (0.0689)  
1.35 (0.0531)  
0.25 (0.0098)  
0.10 (0.0039)  
8°  
0°  
COPLANARITY  
0.10  
SEATING  
PLANE  
1.27 (0.0500)  
0.40 (0.0157)  
0.51 (0.0201)  
0.31 (0.0122)  
0.25 (0.0098)  
0.17 (0.0067)  
COMPLIANT TO JEDEC STANDARDS MS-012-AC  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
Figure 23. 16-Lead Standard Small Outline Package [SOIC_N]  
Narrow Body  
(R-16)  
Dimensions shown in millimeters and (inches)  
5.10  
5.00  
4.90  
16  
9
8
4.50  
4.40  
4.30  
6.40  
BSC  
1
PIN 1  
1.20  
MAX  
0.15  
0.05  
0.20  
0.09  
0.75  
0.60  
0.45  
8°  
0°  
0.30  
0.19  
0.65  
BSC  
SEATING  
PLANE  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-153-AB  
Figure 24. 16-Lead Thin Shrink Small Outline Package [TSSOP]  
(RU-16)  
Dimensions shown in millimeters  
Rev. C| Page 16 of 17  
AD7888  
ORDERING GUIDE  
Linearity  
Temperature  
Range  
Package  
Option  
Model1  
Notes Error (LSB)2  
Package Description  
AD7888ARU  
±±  
±±  
±±  
±±  
±±  
±±  
±±  
±±  
±±  
±1  
±1  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16  
16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16  
16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16  
16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16  
16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16  
16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16  
AD7888ARU-REEL  
AD7888ARU-REEL7  
AD7888ARUZ  
AD7888ARUZ-REEL  
AD7888ARUZ-REEL7  
AD7888ARZ  
AD7888ARZ-REEL  
AD7888ARZ-REEL7  
AD7888BR-REEL  
AD7888BR-REEL7  
AD7888BRZ  
16-Lead Standard Small Outline Package [SOIC_N]  
16-Lead Standard Small Outline Package [SOIC_N]  
16-Lead Standard Small Outline Package [SOIC_N]  
16-Lead Standard Small Outline Package [SOIC_N]  
16-Lead Standard Small Outline Package [SOIC_N]  
16-Lead Standard Small Outline Package [SOIC_N]  
R-16  
R-16  
R-16  
R-16  
R-16  
R-16  
±1  
3
EVAL-AD7888CB  
1 Z = RoHS Compliant Part.  
± Linearity error here refers to integral linearity error.  
3 This can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BOARD for evaluation/demonstration purposes.  
REVISION HISTORY  
6/10—Rev. B to Rev. C  
Changes to Standby Mode Parameter, AD7888 Specifications  
Section ............................................................................................... 3  
Changes to Operating Temperature Range, Commercial  
(B Version) Parameter, Absolute Maximum Ratings Section..... 3  
Updated Outline Dimensions....................................................... 16  
Changes to Ordering Guide .......................................................... 17  
6/01—Rev. A to Rev. B  
Edit to DC Accuracy Section of Specifications ............................ 2  
©2010 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D01356-0-6/10(C)  
Rev. C | Page 17 of 17  

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