AD7982BRMZ [ADI]

18-Bit, 1 MSPS PulSAR 7.0 mW; 18位, 1 MSPS PulSAR系列7.0毫瓦
AD7982BRMZ
型号: AD7982BRMZ
厂家: ADI    ADI
描述:

18-Bit, 1 MSPS PulSAR 7.0 mW
18位, 1 MSPS PulSAR系列7.0毫瓦

转换器 模数转换器 光电二极管
文件: 总24页 (文件大小:672K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
18-Bit, 1 MSPS PulSAR 7.0 mW  
ADC in MSOP/QFN  
AD7982  
FEATURES  
APPLICATION DIAGRAM EXAMPLE  
2.5V TO 5V 2.5V  
18-bit resolution with no missing codes  
Throughput: 1 MSPS  
Low power dissipation  
7.0 mW at 1 MSPS  
70 μW at 10 kSPS  
INL: 1 LSB typical, 2 LSB maximum  
Dynamic range: 99 dB  
VIO  
SDI  
1.8V TO 5V  
REF VDD  
IN+  
3- OR 4-WIRE  
INTERFACE  
(SPI, CS  
SCK  
SDO  
CNV  
AD7982  
±10V, ±5V, ..  
IN–  
DAISY CHAIN)  
GND  
ADA4941  
True differential analog input range: VREF  
0 V to VREF with VREF between 2.5 V to 5.0 V  
Allows use of any input range  
Easy to drive with the ADA4941  
No pipeline delay  
Figure 1.  
GENERAL DESCRIPTION  
The AD7982 is an 18-bit, successive approximation, analog-to-  
digital converter (ADC) that operates from a single power supply,  
VDD. It contains a low power, high speed, 18-bit sampling ADC  
and a versatile serial interface port. On the CNV rising edge,  
the AD7982 samples the voltage difference between the IN+  
and IN− pins. The voltages on these pins usually swing in  
opposite phases between 0 V and VREF. The reference voltage,  
REF, is applied externally and can be set independent of the  
supply voltage, VDD. Its power scales linearly with throughput.  
Single-supply 2.5 V operation with 1.8 V/2.5 V/3 V/5 V logic  
interface  
Serial interface SPI®-/QSPI™-/MICROWIRE™-/DSP-compatible  
Ability to daisy-chain multiple ADCs and busy indicator  
10-lead package: MSOP (MSOP-8 size) and 3 mm × 3 mm QFN  
(LFCSP), SOT-23 size  
APPLICATIONS  
Battery-powered equipment  
Data acquisition systems  
Medical instruments  
The SPI-compatible serial interface also features the ability,  
using the SDI input, to daisy-chain several ADCs on a single  
3-wire bus and provides an optional busy indicator. It is compatible  
with 1.8 V, 2.5 V, 3 V, and 5 V logic, using the separate VIO supply.  
Seismic data acquisition systems  
The AD7982 is available in a 10-lead MSOP or a 10-lead QFN  
(LFCSP) with operation specified from −40°C to +85°C.  
Table 1. MSOP, QFN (LFCSP) 14-/16-/18-Bit PulSAR® ADCs  
Type  
100 kSPS  
250 kSPS  
400 kSPS to 500 kSPS  
≥1000 kSPS  
AD7982  
AD7984  
ADC Driver  
ADA4941  
ADA4841  
ADA4941  
ADA4841  
ADA4841  
18-Bit True Differential  
AD7691  
AD7690  
16-Bit True Differential  
16-Bit Pseudo Differential  
14-Bit Pseudo Differential  
AD7684  
AD7687  
AD7688  
AD7693  
AD7686  
AD7680  
AD7683  
AD7940  
AD7685  
AD7694  
AD7942  
AD7980  
AD7946  
ADA4841  
Rev. A  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2007 Analog Devices, Inc. All rights reserved.  
 
AD7982  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Driver Amplifier Choice ........................................................... 14  
Single-to-Differential Driver .................................................... 15  
Voltage Reference Input ............................................................ 15  
Power Supply............................................................................... 15  
Digital Interface.......................................................................... 16  
Applications....................................................................................... 1  
Application Diagram Example........................................................ 1  
General Description......................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Timing Specifications .................................................................. 5  
Absolute Maximum Ratings............................................................ 6  
ESD Caution.................................................................................. 6  
Pin Configurations and Function Descriptions ........................... 7  
Terminology ...................................................................................... 8  
Typical Performance Characteristics ............................................. 9  
Theory of Operation ...................................................................... 12  
Circuit Information.................................................................... 12  
Converter Operation.................................................................. 12  
Typical Connection Diagram ................................................... 13  
Analog Inputs.............................................................................. 14  
CS  
CS  
CS  
CS  
Mode, 3-Wire Without Busy Indicator ............................. 17  
Mode, 3-Wire with Busy Indicator .................................... 18  
Mode, 4-Wire Without Busy Indicator ............................. 19  
Mode, 4-Wire with Busy Indicator .................................... 20  
Chain Mode Without Busy Indicator ...................................... 21  
Chain Mode with Busy Indicator............................................. 22  
Application Hints ........................................................................... 23  
Layout .......................................................................................... 23  
Evaluating AD7982 Performance............................................. 23  
Outline Dimensions....................................................................... 24  
Ordering Guide .......................................................................... 24  
REVISION HISTORY  
10/07—Rev. 0 to Rev. A  
Changes to Table 1 and Layout....................................................... 1  
Changes to Table 2............................................................................ 3  
Changes to Layout ............................................................................ 5  
Changes to Layout ............................................................................ 6  
Changes to Figure 5.......................................................................... 7  
Changes to Figure 18 and Figure 20............................................. 11  
Changes to Figure 23...................................................................... 13  
Changers to Figure 26 .................................................................... 15  
Changes to Digital Interface Section............................................ 16  
Changes to Figure 38...................................................................... 21  
Changes to Figure 40...................................................................... 22  
Updated Outline Dimensions....................................................... 24  
Changes to Ordering Guide .......................................................... 24  
3/07—Revision 0: Initial Version  
Rev. A | Page 2 of 24  
 
AD7982  
SPECIFICATIONS  
VDD = 2.5 V, VIO = 2.3 V to 5.5 V, REF = 5 V, TA = −40°C to +85°C, unless otherwise noted.  
Table 2.  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
RESOLUTION  
18  
Bits  
ANALOG INPUT  
Voltage Range  
IN+ − IN−  
−VREF  
+VREF  
V
Absolute Input Voltage  
Common-Mode Input Range  
Analog Input CMRR  
Leakage Current at 25°C  
Input Impedance  
ACCURACY  
IN+, IN−  
IN+, IN−  
fIN = 450 kHz  
Acquisition phase  
−0.1  
VREF × 0.475  
VREF + 0.1  
VREF × 0.525  
V
V
dB  
nA  
VREF × 0.5  
67  
200  
See the Analog Inputs section  
No Missing Codes  
Differential Linearity Error  
Integral Linearity Error  
Transition Noise  
18  
−0.85  
−2  
Bits  
0.5  
1
1.05  
+0.004  
1
100  
0.5  
90  
+1.5  
+2  
LSB1  
LSB1  
LSB1  
% of FS  
ppm/°C  
μV  
ppm/°C  
dB  
REF = 5 V  
2
Gain Error, TMIN to TMAX  
−0.023  
+0.023  
+700  
Gain Error Temperature Drift  
2
Zero Error, TMIN to TMAX  
Zero Temperature Drift  
Power Supply Rejection Ratio  
THROUGHPUT  
Conversion Rate  
Transient Response  
AC ACCURACY  
VDD = 2.5 V 5%  
Full-scale step  
0
1
290  
MSPS  
ns  
Dynamic Range  
VREF = 5 V  
VREF = 2.5 V  
FO = 1 kSPS  
fIN = 1 kHz, VREF = 5 V, TA = 25°C  
fIN = 1 kHz, VREF = 2.5 V, TA = 25°C  
fIN = 10 kHz  
fIN = 10 kHz  
fIN = 1 kHz, VREF = 5 V, TA = 25°C  
97  
95.5  
99  
93  
dB3  
dB3  
dB3  
dB3  
dB3  
dB3  
dB3  
dB3  
Oversampled Dynamic Range4  
Signal-to-Noise  
129  
98  
92.5  
−115  
−120  
97  
Spurious-Free Dynamic Range  
Total Harmonic Distortion5  
Signal-to-(Noise + Distortion)  
1 LSB means least significant bit. With the 5 V input range, 1 LSB is 38.15 μV.  
2 See Terminology section. These specifications include full temperature range variation but not the error contribution from the external reference.  
3 All specifications expressed in decibels are referred to a full-scale input FSR and tested with an input signal at 0.5 dB below full scale, unless otherwise specified.  
4 Dynamic range is obtained by oversampling the ADC running at a throughput Fs of 1 MSPS followed by postdigital filtering with an output word rate of FO.  
5 Tested fully in production at fIN = 1 kHz.  
Rev. A | Page 3 of 24  
 
 
 
 
AD7982  
VDD = 2.5 V, VIO = 2.3 V to 5.5 V, REF = 5 V, TA = −40°C to +85°C, unless otherwise noted.  
Table 3.  
Parameter  
REFERENCE  
Voltage Range  
Load Current  
SAMPLING DYNAMICS  
−3 dB Input Bandwidth  
Aperture Delay  
DIGITAL INPUTS  
Logic Levels  
VIL  
Conditions  
Min  
Typ  
Max  
Unit  
2.4  
5.1  
V
μA  
1 MSPS, REF = 5 V  
VDD = 2.5 V  
350  
10  
2
MHz  
ns  
VIO > 3 V  
VIO > 3 V  
VIO ≤ 3 V  
VIO ≤ 3 V  
–0.3  
0.7 × VIO  
–0.3  
0.9 × VIO  
−1  
−1  
+0.3 × VIO  
VIO + 0.3  
+0.1 × VIO  
VIO + 0.3  
+1  
V
V
V
V
μA  
μA  
VIH  
VIL  
VIH  
IIL  
IIH  
+1  
DIGITAL OUTPUTS  
Data Format  
Pipeline Delay  
Serial 18 bits, twos complement  
Conversion results available immediately  
after completed conversion  
VOL  
VOH  
ISINK = +500 μA  
ISOURCE = −500 μA  
0.4  
V
V
VIO − 0.3  
POWER SUPPLIES  
VDD  
VIO  
2.375  
2.3  
2.5  
2.625  
5.5  
V
V
Specified performance  
VIO Range  
Standby Current1, 2  
Power Dissipation  
1.8  
5.5  
V
μA  
μW  
mW  
VDD and VIO = 2.5 V, 25°C  
10 kSPS throughput  
1 MSPS throughput  
0.35  
70  
7.0  
7.0  
86  
8.6  
Energy per Conversion  
TEMPERATURE RANGE3  
Specified Performance  
nJ/sample  
TMIN to TMAX  
−40  
+85  
°C  
1 With all digital inputs forced to VIO or GND as required.  
2 During acquisition phase.  
3 Contact an Analog Devices, Inc. sales representative for the extended temperature range.  
Rev. A | Page 4 of 24  
 
AD7982  
TIMING SPECIFICATIONS  
TA = −40°C to +85°C, VDD = 2.37 V to 2.63 V, VIO = 2.3 V to 5.5 V, unless otherwise noted.1  
Table 4.  
Parameter  
Symbol  
Min  
500  
290  
1000  
10  
Typ  
Max  
Unit  
ns  
ns  
ns  
ns  
Conversion Time: CNV Rising Edge to Data Available  
Acquisition Time  
Time Between Conversions  
CNV Pulse Width (CS Mode)  
SCK Period (CS Mode)  
tCONV  
tACQ  
tCYC  
tCNVH  
tSCK  
710  
VIO Above 4.5 V  
VIO Above 3 V  
VIO Above 2.7 V  
VIO Above 2.3 V  
10.5  
12  
13  
ns  
ns  
ns  
ns  
15  
SCK Period (Chain Mode)  
tSCK  
VIO Above 4.5 V  
VIO Above 3 V  
VIO Above 2.7 V  
VIO Above 2.3 V  
SCK Low Time  
SCK High Time  
SCK Falling Edge to Data Remains Valid  
SCK Falling Edge to Data Valid Delay  
VIO Above 4.5 V  
11.5  
13  
14  
16  
4.5  
4.5  
3
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSCKL  
tSCKH  
tHSDO  
tDSDO  
9.5  
11  
12  
14  
ns  
ns  
ns  
ns  
VIO Above 3 V  
VIO Above 2.7 V  
VIO Above 2.3 V  
CNV or SDI Low to SDO D15 MSB Valid (CS Mode)  
VIO Above 3 V  
tEN  
10  
15  
20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
VIO Above 2.3 V  
CNV or SDI High or Last SCK Falling Edge to SDO High Impedance (CS Mode)  
SDI Valid Setup Time from CNV Rising Edge  
SDI Valid Hold Time from CNV Rising Edge (CS Mode)  
SDI Valid Hold Time from CNV Rising Edge (Chain Mode)  
SCK Valid Setup Time from CNV Rising Edge (Chain Mode)  
SCK Valid Hold Time from CNV Rising Edge (Chain Mode)  
SDI Valid Setup Time from SCK Falling Edge (Chain Mode)  
SDI Valid Hold Time from SCK Falling Edge (Chain Mode)  
SDI High to SDO High (Chain Mode with Busy Indicator)  
tDIS  
tSSDICNV  
tHSDICNV  
tHSDICNV  
tSSCKCNV  
tHSCKCNV  
tSSDISCK  
tHSDISCK  
tDSDOSDI  
5
2
0
5
5
2
3
15  
1 See Figure 2 and Figure 3 for load conditions.  
1
Y% VIO  
500µA  
I
OL  
1
X% VIO  
tDELAY  
tDELAY  
2
2
V
V
V
IH  
IH  
1.4V  
TO SDO  
2
2
V
IL  
IL  
C
L
20pF  
1
2
FOR VIO 3.0V, X = 90, AND Y = 10; FOR VIO > 3.0V, X = 70, AND Y = 30.  
MINIMUM V AND MAXIMUM V USED. SEE DIGITAL INPUTS  
500µA  
I
IH  
IL  
OH  
SPECIFICATIONS IN TABLE 3.  
Figure 2. Load Circuit for Digital Interface Timing  
Figure 3. Voltage Levels for Timing  
Rev. A | Page 5 of 24  
 
 
AD7982  
ABSOLUTE MAXIMUM RATINGS  
Table 5.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
Analog Inputs  
IN+, IN− to GND1  
−0.3 V to VREF + 0.3 V  
or 130 mA  
Supply Voltage  
REF, VIO to GND  
VDD to GND  
VDD to VIO  
−0.3 V to +6.0 V  
−0.3 V to +3.0 V  
+3 V to −6 V  
Digital Inputs to GND  
Digital Outputs to GND  
Storage Temperature Range  
Junction Temperature  
θJA Thermal Impedance  
10-Lead MSOP  
10-Lead QFN (LFCSP_WD)  
θJC Thermal Impedance  
10-Lead MSOP  
−0.3 V to VIO + 0.3 V  
−0.3 V to VIO + 0.3 V  
−65°C to +150°C  
150°C  
ESD CAUTION  
200°C/W  
48.7°C/W  
44°C/W  
10-Lead QFN (LFCSP_WD)  
Lead Temperatures  
Vapor Phase (60 sec)  
Infrared (15 sec)  
2.96°C/W  
215°C  
220°C  
1 See the Analog Inputs section for an explanation of IN+ and IN−.  
Rev. A | Page 6 of 24  
 
 
AD7982  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
REF 1  
VDD 2  
IN+ 3  
10 VIO  
REF  
VDD  
IN+  
1
2
3
4
5
10 VIO  
9
8
7
6
SDI  
9
8
7
6
SDI  
AD7982  
TOP VIEW  
AD7982  
TOP VIEW  
(Not to Scale)  
SCK  
SDO  
CNV  
SCK  
SDO  
CNV  
IN– 4  
IN–  
GND 5  
GND  
Figure 4. 10-Lead MSOP Pin Configuration  
Figure 5. 10-Lead QFN (LFCSP) Pin Configuration  
Table 6. Pin Function Descriptions  
Pin  
No. Mnemonic Type1 Description  
1
REF  
AI  
Reference Input Voltage. The REF range is 2.4 V to 5.1 V. This pin is referred to the GND pin and should  
be decoupled closely to the GND pin with a 10 μF capacitor.  
2
3
4
5
6
VDD  
IN+  
IN−  
GND  
CNV  
P
Power Supply.  
AI  
AI  
P
Differential Positive Analog Input.  
Differential Negative Analog Input.  
Power Supply Ground.  
Convert Input. This input has multiple functions. On its leading edge, it initiates the conversions and  
selects the interface mode of the part: chain mode or CS mode. In CS mode, the SDO pin is enabled  
when CNV is low. In chain mode, the data should be read when CNV is high.  
DI  
7
8
9
SDO  
SCK  
SDI  
DO  
DI  
DI  
Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK.  
Serial Data Clock Input. When the part is selected, the conversion result is shifted out by this clock.  
Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC as follows:  
Chain mode is selected if SDI is low during the CNV rising edge. In this mode, SDI is used as a data input to  
daisy-chain the conversion results of two or more ADCs onto a single SDO line. The digital data level on SDI is  
output on SDO with a delay of 18 SCK cycles.  
CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable  
the serial output signals when low. If SDI or CNV is low when the conversion is complete, the busy indicator  
feature is enabled.  
10  
VIO  
P
Input/Output Interface Digital Power. Nominally at the same supply as the host interface (1.8 V, 2.5 V, 3 V, or 5 V).  
1AI = analog input, DI = digital input, DO = digital output, and P = power.  
Rev. A | Page 7 of 24  
 
AD7982  
TERMINOLOGY  
Integral Nonlinearity Error (INL)  
Effective Resolution  
INL refers to the deviation of each individual code from a line  
drawn from negative full scale through positive full scale. The  
point used as negative full scale occurs ½ LSB before the first  
code transition. Positive full scale is defined as a level 1½ LSB  
beyond the last code transition. The deviation is measured from  
the middle of each code to the true straight line (see Figure 22).  
Effective resolution is calculated as  
Effective Resolution = log2(2N/RMS Input Noise)  
and is expressed in bits.  
Total Harmonic Distortion (THD)  
THD is the ratio of the rms sum of the first five harmonic  
components to the rms value of a full-scale input signal and is  
expressed in decibels.  
Differential Nonlinearity Error (DNL)  
In an ideal ADC, code transitions are 1 LSB apart. DNL is the  
maximum deviation from this ideal value. It is often specified in  
terms of resolution for which no missing codes are guaranteed.  
Dynamic Range  
Dynamic range is the ratio of the rms value of the full scale to  
the total rms noise measured with the inputs shorted together.  
The value for dynamic range is expressed in decibels. It is  
measured with a signal at −60 dBF so that it includes all noise  
sources and DNL artifacts.  
Zero Error  
Zero error is the difference between the ideal midscale voltage,  
that is, 0 V, from the actual voltage producing the midscale  
output code, that is, 0 LSB.  
Signal-to-Noise Ratio (SNR)  
Gain Error  
SNR is the ratio of the rms value of the actual input signal to the  
rms sum of all other spectral components below the Nyquist  
frequency, excluding harmonics and dc. The value for SNR is  
expressed in decibels.  
The first transition (from 100 ... 00 to 100 ... 01) should occur at  
a level ½ LSB above nominal negative full scale (−4.999981 V  
for the 5 V range). The last transition (from 011 … 10 to  
011 … 11) should occur for an analog voltage 1½ LSB below  
the nominal full scale (+4.999943 V for the 5 V range). The  
gain error is the deviation of the difference between the actual  
level of the last transition and the actual level of the first transition  
from the difference between the ideal levels.  
Signal-to-(Noise + Distortion) Ratio (SINAD)  
SINAD is the ratio of the rms value of the actual input signal to  
the rms sum of all other spectral components that are less than  
the Nyquist frequency, including harmonics but excluding dc.  
The value of SINAD is expressed in decibels.  
Spurious-Free Dynamic Range (SFDR)  
SFDR is the difference, in decibels (dB), between the rms  
amplitude of the input signal and the peak spurious signal.  
Aperture Delay  
Aperture delay is the measure of the acquisition performance  
and is the time between the rising edge of the CNV input and  
when the input signal is held for a conversion.  
Effective Number of Bits (ENOB)  
ENOB is a measurement of the resolution with a sine wave  
input. It is related to SINAD as follows  
Transient Response  
ENOB = (SINADdB − 1.76)/6.02  
Transient response is the time required for the ADC to accurately  
acquire its input after a full-scale step function is applied.  
and is expressed in bits.  
Noise-Free Code Resolution  
Noise-free code resolution is the number of bits beyond which it is  
impossible to distinctly resolve individual codes. It is calculated as  
Noise-Free Code Resolution = log2(2N/Peak-to-Peak Noise)  
and is expressed in bits.  
Rev. A | Page 8 of 24  
 
 
AD7982  
TYPICAL PERFORMANCE CHARACTERISTICS  
VDD = 2.5 V, REF = 5.0 V, VIO = 3.3 V.  
2.0  
1.5  
1.0  
2.0  
POSITIVE INL: +0.79 LSB  
NEGATIVE INL: –0.68 LSB  
POSITIVE INL: +0.46 LSB  
NEGATIVE INL: –0.49 LSB  
1.5  
1.0  
0.5  
0.5  
0
0
–0.5  
–1.0  
–0.5  
–1.0  
–1.5  
–2.0  
–1.5  
–2.0  
0
65536  
131072  
CODE  
196608  
262144  
0
65536  
131072  
CODE  
196608  
262144  
Figure 6. Integral Nonlinearity vs. Code  
Figure 9. Differential Nonlinearity vs. Code  
50000  
45000  
60000  
50000  
40000  
30000  
20000  
10000  
0
44806  
43239  
50975  
40000  
35000  
30000  
25000  
20000  
15000  
10000  
5000  
32476  
29064  
20013  
16682  
9064  
7795  
3158  
9
2793  
4
745  
881  
145  
3
222  
A
43  
29  
0
0
0
1
7
2
7
0
0
0
0
0
0
0
5
6
7
8
B
C
D
3FFF0  
3FFF2  
3FFF4  
3FFF6  
3FFF8  
3FFFA  
3FFFC  
CODE IN HEX  
CODE IN HEX  
Figure 10. Histogram of a DC Input at the Code Transition  
Figure 7. Histogram of a DC Input at the Code Center  
0
–20  
100  
fS = 1MSPS  
fIN = 2kHz  
SNR = 97.3dB  
THD = –121.8dB  
SFDR = 120.2dB  
SINAD = 97.3dB  
99  
98  
97  
96  
95  
94  
93  
92  
91  
90  
–40  
–60  
–80  
–100  
–120  
–140  
–160  
–180  
0
100  
200  
300  
400  
500  
–10  
–9  
–8  
–7  
–6  
–5  
–4  
–3  
–2  
–1  
0
FREQUENCY (kHz)  
INPUT LEVEL (dB)  
Figure 11. SNR vs. Input Level  
Figure 8. FFT Plot  
Rev. A | Page 9 of 24  
 
AD7982  
100  
18  
17  
16  
15  
14  
–100  
–105  
–110  
130  
125  
SNR, SINAD  
95  
90  
85  
120  
115  
110  
105  
100  
SFDR  
THD  
–115  
–120  
–125  
–130  
ENOB  
80  
2.25  
2.75  
3.25  
3.75  
4.25  
4.75  
5.25  
2.25  
2.75  
3.25  
3.75  
4.25  
4.75  
5.25  
REFERENCE VOLTAGE (V)  
REFERENCE VOLTAGE (V)  
Figure 12. SNR, SINAD, and ENOB vs. Reference Voltage  
Figure 15. THD, SFDR vs. Reference Voltage  
100  
–115  
98  
96  
94  
92  
–117  
–119  
–121  
–123  
90  
–55  
–125  
–35  
–15  
5
25  
45  
65  
85  
105  
125  
–55  
–35  
–15  
5
25  
45  
65  
85  
105  
125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 13. SNR vs. Temperature  
Figure 16. THD vs. Temperature  
–80  
–85  
100  
95  
–90  
–95  
–100  
–105  
–110  
–115  
–120  
–125  
90  
85  
80  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
FREQUENCY (kHz)  
FREQUENCY (kHz)  
Figure 17. THD vs. Frequency  
Figure 14. SINAD vs. Frequency  
Rev. A | Page 10 of 24  
AD7982  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
I
I
VDD  
VDD  
I
REF  
I
REF  
I
I
VIO  
VIO  
2.375  
2.425  
2.475  
2.525  
2.575  
2.625  
–55  
–35  
–15  
5
25  
45  
65  
85  
105  
125  
SUPPLY VOLTAGE (V)  
TEMPERATURE (°C)  
Figure 18. Operating Currents vs. Supply Voltage  
Figure 20. Operating Currents vs. Temperature  
8
7
6
5
4
3
2
1
I
+ I  
VIO  
VDD  
0
–55  
–35  
–15  
5
25  
45  
65  
85  
105  
125  
TEMPERATURE (°C)  
Figure 19. Power-Down Currents vs. Temperature  
Rev. A | Page 11 of 24  
AD7982  
THEORY OF OPERATION  
IN+  
SWITCHES CONTROL  
CONTROL  
SW+  
SW–  
MSB  
LSB  
LSB  
131,072C 65,536C  
4C  
4C  
2C  
2C  
C
C
C
C
BUSY  
REF  
COMP  
LOGIC  
GND  
131,072C 65,536C  
MSB  
OUTPUT CODE  
CNV  
IN–  
Figure 21. ADC Simplified Schematic  
During the acquisition phase, terminals of the array tied to the  
input of the comparator are connected to GND via SW+ and  
SW−. All independent switches are connected to the analog  
inputs. Therefore, the capacitor arrays are used as sampling  
capacitors and acquire the analog signal on the IN+ and IN−  
inputs. When the acquisition phase is complete and the CNV  
input goes high, a conversion phase is initiated. When the  
conversion phase begins, SW+ and SW− are opened first. The  
two capacitor arrays are then disconnected from the inputs and  
connected to the GND input. Therefore, the differential voltage  
between the inputs IN+ and IN− captured at the end of the  
acquisition phase is applied to the comparator inputs, causing  
the comparator to become unbalanced. By switching each  
element of the capacitor array between GND and REF, the  
comparator input varies by binary-weighted voltage steps  
(VREF/2, VREF/4 ... VREF/262,144). The control logic toggles these  
switches, starting with the MSB, to bring the comparator back  
into a balanced condition. After the completion of this process,  
the part returns to the acquisition phase, and the control logic  
generates the ADC output code and a busy signal indicator.  
CIRCUIT INFORMATION  
The AD7982 is a fast, low power, single-supply, precise, 18-bit  
ADC using a successive approximation architecture.  
The AD7982 is capable of converting 1,000,000 samples per  
second (1 MSPS) and powers down between conversions. When  
operating at 10 kSPS, for example, it typically consumes 70 μW,  
making it ideal for battery-powered applications.  
The AD7982 provides the user with an on-chip track-and-hold  
and does not exhibit any pipeline delay or latency, making it  
ideal for multiple multiplexed channel applications.  
The AD7982 can be interfaced to any 1.8 V to 5 V digital logic  
family. It is available in a 10-lead MSOP or a tiny 10-lead QFN  
(LFCSP) that allows space savings and flexible configurations.  
It is pin-for-pin-compatible with the 16-bit AD7980.  
CONVERTER OPERATION  
The AD7982 is a successive approximation ADC based on a  
charge redistribution DAC. Figure 21 shows the simplified  
schematic of the ADC. The capacitive DAC consists of two  
identical arrays of 18 binary-weighted capacitors, which are  
connected to the two comparator inputs.  
Because the AD7982 has an on-board conversion clock, the  
serial clock, SCK, is not required for the conversion process.  
Rev. A | Page 12 of 24  
 
 
AD7982  
Transfer Functions  
Table 7. Output Codes and Ideal Input Voltages  
The ideal transfer characteristic for the AD7982 is shown in  
Figure 22 and Table 7.  
Analog Input  
VREF = 5 V  
Digital Output  
Code (Hex)  
Description  
FSR – 1 LSB  
Midscale + 1 LSB  
Midscale  
+4.999962 V  
+38.15 μV  
0 V  
0x1FFFF1  
0x00001  
0x00000  
0x3FFFF  
0x20001  
0x200002  
011...111  
011...110  
011...101  
Midscale – 1 LSB  
–FSR + 1 LSB  
–FSR  
−38.15 μV  
−4.999962 V  
−5 V  
1 This is also the code for an overranged analog input (VIN+ − VIN− above VREF − VGND).  
2 This is also the code for an underranged analog input (VIN+ − VIN− below VGND).  
100...010  
100...001  
100...000  
TYPICAL CONNECTION DIAGRAM  
Figure 23 shows an example of the recommended connection  
diagram for the AD7982 when multiple supplies are available.  
–FSR  
–FSR + 1 LSB  
+FSR – 1 LSB  
+FSR – 1.5 LSB  
ANALOG INPUT  
–FSR + 0.5 LSB  
Figure 22. ADC Ideal Transfer Function  
1
2.5V  
REF  
V+  
V+  
2
100nF  
10µF  
1.8V TO 5V  
100nF  
20  
0 TO VREF  
REF  
VDD  
VIO  
2.7nF  
SDI  
IN+  
IN–  
V–  
V+  
SCK  
SDO  
CNV  
4
AD7982  
3-WIRE INTERFACE  
20Ω  
GND  
VREF TO 0  
2.7nF  
ADA48412, 3  
V–  
4
NOTES  
1
SEE VOLTAGE REFERENCE INPUT SECTION FOR REFERENCE SELECTION.  
IS USUALLY A 10µF CERAMIC CAPACITOR (X5R).  
2
C
REF  
SEE RECOMMENDED LAYOUT FIGURE 41 AND FIGURE 42.  
SEE DRIVER AMPLIFIER CHOICE SECTION.  
OPTIONAL FILTER. SEE ANALOG INPUT SECTION.  
3
4
Figure 23. Typical Application Diagram with Multiple Supplies  
Rev. A | Page 13 of 24  
 
 
 
 
AD7982  
When the source impedance of the driving circuit is low, the  
AD7982 can be driven directly. Large source impedances  
significantly affect the ac performance, especially THD. The  
dc performances are less sensitive to the input impedance. The  
maximum source impedance depends on the amount of THD  
that can be tolerated. The THD degrades as a function of the  
source impedance and the maximum input frequency.  
ANALOG INPUTS  
Figure 24 shows an equivalent circuit of the input structure of  
the AD7982.  
The two diodes, D1 and D2, provide ESD protection for the  
analog inputs, IN+ and IN−. Care must be taken to ensure that  
the analog input signal does not exceed the reference input  
voltage (REF) by more than 0.3 V. If the analog input signal  
exceeds this level, the diodes become forward biased and start  
conducting current. These diodes can handle a forward-biased  
current of 130 mA maximum. However, if the supplies of the  
input buffer (for example, the supplies of the ADA4841 in  
Figure 23) are different from those of the REF, the analog input  
signal may eventually exceed the supply rails by more than  
0.3 V. In such a case (for example, an input buffer with a short-  
circuit), the current limitation can be used to protect the part.  
DRIVER AMPLIFIER CHOICE  
Although the AD7982 is easy to drive, the driver amplifier must  
meet the following requirements:  
The noise generated by the driver amplifier must be kept  
as low as possible to preserve the SNR and transition noise  
performance of the AD7982. The noise from the driver is  
filtered by the AD7982 analog input circuits 1-pole, low-  
pass filter made by RIN and CIN or by the external filter, if  
one is used. Because the typical noise of the AD7982 is  
40 μV rms, the SNR degradation due to the amplifier is  
REF  
D1  
D2  
C
IN  
R
IN  
IN+ OR IN–  
GND  
C
PIN  
40  
SNRLOSS = 20 log  
π
2
402 + f3dB (NeN )2  
Figure 24. Equivalent Analog Input Circuit  
where:  
–3dB is the input bandwidth, in megahertz, of the AD7982  
(10 MHz) or the cutoff frequency of the input filter, if  
The analog input structure allows the sampling of the true  
differential signal between IN+ and IN−. By using these  
differential inputs, signals common to both inputs are rejected.  
f
one is used.  
90  
85  
80  
75  
70  
N is the noise gain of the amplifier (for example, 1 in buffer  
configuration).  
eN is the equivalent input noise voltage of the op amp, in  
nV/√Hz.  
For ac applications, the driver should have a THD perfor-  
mance commensurate with the AD7982.  
For multichannel multiplexed applications, the driver  
amplifier and the AD7982 analog input circuit must settle  
for a full-scale step onto the capacitor array at an 18-bit level  
(0.0004%, 4 ppm). In the data sheet of the amplifier,  
settling at 0.1% to 0.01% is more commonly specified. This  
may differ significantly from the settling time at an 18-bit  
level and should be verified prior to driver selection.  
65  
60  
1
10  
100  
1000  
10000  
FREQUENCY (kHz)  
Figure 25. Analog Input CMRR vs. Frequency  
Table 8. Recommended Driver Amplifiers  
During the acquisition phase, the impedance of the analog  
inputs (IN+ or IN−) can be modeled as a parallel combination  
of Capacitor CPIN and the network formed by the series connection  
of RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically  
400 Ω and is a lumped component composed of serial resistors  
and the on resistance of the switches. CIN is typically 30 pF and  
is mainly the ADC sampling capacitor.  
Amplifier  
ADA4941  
ADA4841  
AD8021  
AD8022  
OP184  
Typical Application  
Very low noise, low power, single to differential  
Very low noise, small, and low power  
Very low noise and high frequency  
Low noise and high frequency  
Low power, low noise, and low frequency  
5 V single supply, low noise  
AD8655  
During the sampling phase, where the switches are closed, the  
input impedance is limited to CPIN. RIN and CIN make a 1-pole,  
low-pass filter that reduces undesirable aliasing effects and  
limits noise.  
AD8605, AD8615 5 V single supply, low power  
Rev. A | Page 14 of 24  
 
 
 
 
AD7982  
POWER SUPPLY  
SINGLE-TO-DIFFERENTIAL DRIVER  
The AD7982 uses two power supply pins: a core supply (VDD) and  
a digital input/output interface supply (VIO). VIO allows direct  
interface with any logic between 1.8 V and 5.5 V. To reduce the  
number of supplies needed, VIO and VDD can be tied together.  
The AD7982 is independent of power supply sequencing between  
VIO and VDD. Additionally, it is very insensitive to power supply  
variations over a wide frequency range, as shown in Figure 27.  
For applications using a single-ended analog signal, either  
bipolar or unipolar, the ADA4941 single-ended-to-differential  
driver allows for a differential input to the part. The schematic  
is shown in Figure 26.  
R1 and R2 set the attenuation ratio between the input range and  
the ADC range (VREF). R1, R2, and CF are chosen depending on  
the desired input resistance, signal bandwidth, antialiasing, and  
noise contribution. For example, for the 10 V range with a 4 kΩ  
impedance, R2 = 1 kΩ and R1 = 4 kΩ.  
95  
90  
85  
R3 and R4 set the common mode on the IN− input, and R5 and R6  
set the common mode on the IN+ input of the ADC. The common  
mode should be close to VREF/2. For example, for the 10 V range  
with a single supply, R3 = 8.45 kΩ, R4 = 11.8 kΩ, R5 = 10.5 kΩ,  
and R6 = 9.76 kΩ.  
80  
75  
70  
65  
R5  
R6  
R3  
R4  
+5V REF  
+2.5V  
10µF  
+5.2V  
60  
100nF  
100nF  
REF  
1
10  
100  
FREQUENCY (kHz)  
1000  
20  
20Ω  
OUTN  
OUTP  
REF  
VDD  
IN+  
IN–  
2.7nF  
2.7nF  
Figure 27. PSRR vs. Frequency  
AD7982  
To ensure optimum performance, VDD should be roughly half  
of REF, the voltage reference input. For example, if REF is 5.0 V,  
VDD should be set to 2.5 V ( 5%).  
IN  
GND  
FB  
ADA4941  
–0.2V  
R2  
R1  
±10V,  
±5V, ..  
The AD7982 powers down automatically at the end of each  
conversion phase; therefore, the power scales linearly with the  
sampling rate. This makes the part ideal for low sampling rates  
(even of a few hertz) and low battery-powered applications.  
C
F
Figure 26. Single-Ended-to-Differential Driver Circuit  
10.000  
VOLTAGE REFERENCE INPUT  
The AD7982 voltage reference input, REF, has a dynamic input  
impedance and should therefore be driven by a low impedance  
source with efficient decoupling between the REF and GND  
pins, as explained in the Layout section.  
1.000  
I
VDD  
I
0.100  
REF  
When REF is driven by a very low impedance source (for  
example, a reference buffer using the AD8031 or the AD8605),  
a 10 μF (X5R, 0805 size) ceramic chip capacitor is appropriate  
for optimum performance.  
I
VIO  
0.010  
0.001  
If an unbuffered reference voltage is used, the decoupling value  
depends on the reference used. For instance, a 22 μF (X5R,  
1206 size) ceramic chip capacitor is appropriate for optimum  
performance using a low temperature drift ADR43x reference.  
10000  
100000  
1000000  
SAMPLING RATE (SPS)  
Figure 28. Operating Currents vs. Sampling Rate  
If desired, a reference decoupling capacitor with values as small  
as 2.2 μF can be used with a minimal impact on performance,  
especially DNL.  
Regardless, there is no need for an additional lower value ceramic  
decoupling capacitor (for example, 100 nF) between the REF  
and GND pins.  
Rev. A | Page 15 of 24  
 
 
 
AD7982  
The mode in which the part operates depends on the SDI level  
CS  
SDI is high, and the chain mode is selected if SDI is low. The  
SDI hold time is such that when SDI and CNV are connected  
together, the chain mode is always selected.  
DIGITAL INTERFACE  
when the CNV rising edge occurs. The  
mode is selected if  
Although the AD7982 has a reduced number of pins, it offers  
flexibility in its serial interface modes.  
CS  
When in  
mode, the AD7982 is compatible with SPI, QSPI,  
digital hosts, and DSPs. In this mode, the AD7982 can use  
either a 3-wire or 4-wire interface. A 3-wire interface using the  
CNV, SCK, and SDO signals minimizes wiring connections  
useful, for instance, in isolated applications. A 4-wire interface  
using the SDI, CNV, SCK, and SDO signals allows CNV, which  
initiates the conversions, to be independent of the readback  
timing (SDI). This is useful in low jitter sampling or  
simultaneous sampling applications.  
In either mode, the AD7982 offers the option of forcing a start  
bit in front of the data bits. This start bit can be used as a busy  
signal indicator to interrupt the digital host and trigger the data  
reading. Otherwise, without a busy indicator, the user must timeout  
the maximum conversion time prior to readback.  
The busy indicator feature is enabled  
CS  
mode if CNV or SDI is low when the ADC  
In the  
When in chain mode, the AD7982 provides a daisy-chain feature  
using the SDI input for cascading multiple ADCs on a single  
data line similar to a shift register.  
conversion ends (see Figure 32 and Figure 36).  
In the chain mode if SCK is high during the CNV rising  
edge (see Figure 40).  
Rev. A | Page 16 of 24  
 
AD7982  
high for the maximum possible conversion time to avoid the  
CS MODE, 3-WIRE WITHOUT BUSY INDICATOR  
generation of the busy signal indicator. When the conversion is  
complete, the AD7982 enters the acquisition phase and powers  
down. When CNV goes low, the MSB is output onto SDO. The  
remaining data bits are clocked by subsequent SCK falling edges.  
The data is valid on both SCK edges. Although the rising edge  
can be used to capture the data, a digital host using the SCK  
falling edge allows a faster reading rate, provided it has an  
acceptable hold time. After the 18th SCK falling edge or when  
CNV goes high (whichever occurs first), SDO returns to high  
impedance.  
This mode is usually used when a single AD7982 is connected  
to an SPI-compatible digital host. The connection diagram is  
shown in Figure 29, and the corresponding timing is given in  
Figure 30.  
With SDI tied to VIO, a rising edge on CNV initiates a  
CS  
conversion, selects the  
mode, and forces SDO to high  
impedance. Once a conversion is initiated, it continues until  
completion irrespective of the state of CNV. This can be useful,  
for instance, to bring CNV low to select other SPI devices, such  
as analog multiplexers; however, CNV must be returned high  
before the minimum conversion time elapses and then held  
CONVERT  
DIGITAL HOST  
CNV  
VIO  
SDI  
SDO  
DATA IN  
AD7982  
SCK  
CLK  
CS  
Figure 29. Mode, 3-Wire Without Busy Indicator Connection Diagram (SDI High)  
SDI = 1  
tCYC  
tCNVH  
CNV  
tCONV  
tACQ  
ACQUISITION  
CONVERSION  
ACQUISITION  
tSCK  
tSCKL  
SCK  
1
2
3
16  
17  
18  
tHSDO  
tSCKH  
tDSDO  
tEN  
tDIS  
SDO  
D17  
D16  
D15  
D1  
D0  
CS  
Figure 30. Mode, 3-Wire Without Busy Indicator Serial Interface Timing (SDI High)  
Rev. A | Page 17 of 24  
 
 
 
AD7982  
When the conversion is complete, SDO goes from high  
impedance to low impedance. With a pull-up on the SDO line,  
this transition can be used as an interrupt signal to initiate the  
data reading controlled by the digital host. The AD7982 then  
enters the acquisition phase and powers down. The data bits are  
then clocked out, MSB first, by subsequent SCK falling edges.  
The data is valid on both SCK edges. Although the rising edge  
can be used to capture the data, a digital host using the SCK  
falling edge allows a faster reading rate, provided it has an  
acceptable hold time. After the optional 19th SCK falling edge  
or when CNV goes high (whichever occurs first), SDO returns  
to high impedance.  
CS MODE, 3-WIRE WITH BUSY INDICATOR  
This mode is usually used when a single AD7982 is connected  
to an SPI-compatible digital host having an interrupt input.  
The connection diagram is shown in Figure 31, and the  
corresponding timing is given in Figure 32.  
With SDI tied to VIO, a rising edge on CNV initiates a  
CS  
conversion, selects the  
mode, and forces SDO to high  
impedance. SDO is maintained in high impedance until the  
completion of the conversion irrespective of the state of CNV.  
Prior to the minimum conversion time, CNV can be used to  
select other SPI devices, such as analog multiplexers, but CNV  
must be returned low before the minimum conversion time  
elapses and then held low for the maximum possible conversion  
time to guarantee the generation of the busy signal indicator.  
If multiple AD7982s are selected at the same time, the SDO  
output pin handles this contention without damage or induced  
latch-up. Meanwhile, it is recommended to keep this contention  
as short as possible to limit extra power dissipation.  
CONVERT  
VIO  
47k  
DIGITAL HOST  
CNV  
VIO  
SDI  
SDO  
DATA IN  
AD7982  
IRQ  
SCK  
CLK  
CS  
Figure 31. Mode, 3-Wire with Busy Indicator Connection Diagram (SDI High)  
SDI = 1  
tCYC  
tCNVH  
CNV  
tCONV  
tACQ  
ACQUISITION  
CONVERSION  
ACQUISITION  
tSCK  
tSCKL  
SCK  
1
2
3
17  
18  
19  
tHSDO  
tSCKH  
tDSDO  
tDIS  
SDO  
D17  
D16  
D1  
D0  
CS  
Figure 32. Mode, 3-Wire with Busy Indicator Serial Interface Timing (SDI High)  
Rev. A | Page 18 of 24  
 
 
 
AD7982  
time elapses and then held high for the maximum possible  
CS MODE, 4-WIRE WITHOUT BUSY INDICATOR  
conversion time to avoid the generation of the busy signal  
indicator. When the conversion is complete, the AD7982 enters  
the acquisition phase and powers down. Each ADC result can  
be read by bringing its SDI input low, which consequently  
outputs the MSB onto SDO. The remaining data bits are then  
clocked by subsequent SCK falling edges. The data is valid on  
both SCK edges. Although the rising edge can be used to  
capture the data, a digital host using the SCK falling edge allows  
a faster reading rate, provided it has an acceptable hold time.  
After the 18th SCK falling edge or when SDI goes high (whichever  
occurs first), SDO returns to high impedance and another  
AD7982 can be read.  
This mode is usually used when multiple AD7982s are  
connected to an SPI-compatible digital host.  
A connection diagram example using two AD7982s is shown in  
Figure 33, and the corresponding timing is given in Figure 34.  
With SDI high, a rising edge on CNV initiates a conversion,  
CS  
selects the  
mode, and forces SDO to high impedance. In this  
mode, CNV must be held high during the conversion phase and  
the subsequent data readback. (If SDI and CNV are low, SDO is  
driven low.) Prior to the minimum conversion time, SDI can be  
used to select other SPI devices, such as analog multiplexers,  
but SDI must be returned high before the minimum conversion  
CS2  
CS1  
CONVERT  
CNV  
CNV  
DIGITAL HOST  
SDI  
SDO  
AD7982  
SDI  
SDO  
AD7982  
SCK  
SCK  
DATA IN  
CLK  
CS  
Figure 33. Mode, 4-Wire Without Busy Indicator Connection Diagram  
tCYC  
CNV  
tACQ  
tCONV  
ACQUISITION  
tSSDICNV  
CONVERSION  
ACQUISITION  
SDI(CS1)  
tHSDICNV  
SDI(CS2)  
SCK  
tSCK  
tSCKL  
1
2
3
16  
17  
18  
19  
20  
34  
35  
36  
tHSDO  
tSCKH  
tDSDO  
tDIS  
tEN  
SDO  
D17  
D16  
D15  
D1  
D0  
D17  
D16  
D1  
D0  
CS  
Figure 34. Mode, 4-Wire Without Busy Indicator Serial Interface Timing  
Rev. A | Page 19 of 24  
 
 
 
AD7982  
used to select other SPI devices, such as analog multiplexers,  
but SDI must be returned low before the minimum conversion  
time elapses and then held low for the maximum possible  
conversion time to guarantee the generation of the busy signal  
indicator. When the conversion is complete, SDO goes from  
high impedance to low impedance. With a pull-up on the SDO  
line, this transition can be used as an interrupt signal to initiate  
the data readback controlled by the digital host. The AD7982  
then enters the acquisition phase and powers down. The data  
bits are then clocked out, MSB first, by subsequent SCK falling  
edges. The data is valid on both SCK edges. Although the rising  
edge can be used to capture the data, a digital host using the  
SCK falling edge allows a faster reading rate, provided it has an  
acceptable hold time. After the optional 19th SCK falling edge or  
SDI going high (whichever occurs first), SDO returns to high  
impedance.  
CS MODE, 4-WIRE WITH BUSY INDICATOR  
This mode is usually used when a single AD7982 is connected  
to an SPI-compatible digital host with an interrupt input and  
when it is desired to keep CNV, which is used to sample the  
analog input, independent of the signal used to select the data  
reading. This independence is particularly important in  
applications where low jitter on CNV is desired.  
The connection diagram is shown in Figure 35, and the  
corresponding timing is given in Figure 36.  
With SDI high, a rising edge on CNV initiates a conversion,  
CS  
selects the  
mode, and forces SDO to high impedance. In this  
mode, CNV must be held high during the conversion phase and  
the subsequent data readback. (If SDI and CNV are low, SDO is  
driven low.) Prior to the minimum conversion time, SDI can be  
CS1  
CONVERT  
VIO  
47k  
DIGITAL HOST  
CNV  
SDI  
SDO  
DATA IN  
AD7982  
IRQ  
SCK  
CLK  
CS  
Figure 35. Mode, 4-Wire with Busy Indicator Connection Diagram  
tCYC  
CNV  
tACQ  
tCONV  
ACQUISITION  
CONVERSION  
ACQUISITION  
tSSDICNV  
SDI  
tSCK  
tHSDICNV  
tSCKL  
SCK  
SDO  
1
2
3
17  
tSCKH  
18  
19  
tHSDO  
tDSDO  
tDIS  
tEN  
D17  
D16  
D1  
D0  
CS  
Figure 36. Mode, 4-Wire with Busy Indicator Serial Interface Timing  
Rev. A | Page 20 of 24  
 
 
 
AD7982  
held high during the conversion phase and the subsequent data  
readback. When the conversion is complete, the MSB is output  
onto SDO and the AD7982 enters the acquisition phase and  
powers down. The remaining data bits stored in the internal  
shift register are clocked by subsequent SCK falling edges. For  
each ADC, SDI feeds the input of the internal shift register and  
is clocked by the SCK falling edge. Each ADC in the chain  
outputs its data MSB first, and 18 × N clocks are required to  
read back the N ADCs. The data is valid on both SCK edges.  
Although the rising edge can be used to capture the data, a  
digital host using the SCK falling edge allows a faster reading  
rate and consequently more AD7982s in the chain, provided the  
digital host has an acceptable hold time. The maximum conversion  
rate may be reduced due to the total readback time.  
CHAIN MODE WITHOUT BUSY INDICATOR  
This mode can be used to daisy-chain multiple AD7982s on  
a 3-wire serial interface. This feature is useful for reducing  
component count and wiring connections, for example, in  
isolated multiconverter applications or for systems with a  
limited interfacing capacity. Data readback is analogous to  
clocking a shift register.  
A connection diagram example using two AD7982s is shown in  
Figure 37, and the corresponding timing is given in Figure 38.  
When SDI and CNV are low, SDO is driven low. With SCK low,  
a rising edge on CNV initiates a conversion, selects the chain  
mode, and disables the busy indicator. In this mode, CNV is  
CONVERT  
CNV  
CNV  
DIGITAL HOST  
DATA IN  
SDI  
SDO  
AD7982  
SDI  
SDO  
AD7982  
A
B
SCK  
SCK  
CLK  
Figure 37. Chain Mode Without Busy Indicator Connection Diagram  
SDI = 0  
A
tCYC  
CNV  
tACQ  
tCONV  
ACQUISITION  
CONVERSION  
ACQUISITION  
tSCK  
tSCKL  
tSSCKCNV  
SCK  
1
A
B
2
3
A
B
16  
17  
18  
19  
20  
34  
35  
36  
tHSCKCNV  
tSSDISCK  
tSCKH  
tHSDISCK  
tEN  
D
D
17  
D
16  
D
D
15  
15  
D
1
1
D
0
SDO = SDI  
A
A
A
A
B
tHSDO  
tDSDO  
17  
D
16  
D
B
D
0
D
17  
D
16  
D
1
D 0  
A
SDO  
B
B
A
A
A
B
Figure 38. Chain Mode Without Busy Indicator Serial Interface Timing  
Rev. A | Page 21 of 24  
 
 
 
AD7982  
subsequent data readback. When all ADCs in the chain have  
completed their conversions, the SDO pin of the ADC closest to  
the digital host (see the AD7982 ADC labeled C in Figure 39) is  
driven high. This transition on SDO can be used as a busy indicator  
to trigger the data readback controlled by the digital host. The  
AD7982 then enters the acquisition phase and powers down.  
The data bits stored in the internal shift register are clocked out,  
MSB first, by subsequent SCK falling edges. For each ADC, SDI  
feeds the input of the internal shift register and is clocked by the  
SCK falling edge. Each ADC in the chain outputs its data MSB  
first, and 18 × N + 1 clocks are required to read back the N ADCs.  
Although the rising edge can be used to capture the data, a digital  
host using the SCK falling edge allows a faster reading rate and  
consequently more AD7982s in the chain, provided the digital  
host has an acceptable hold time.  
CHAIN MODE WITH BUSY INDICATOR  
This mode can also be used to daisy-chain multiple AD7982s  
on a 3-wire serial interface while providing a busy indicator.  
This feature is useful for reducing component count and wiring  
connections, for example, in isolated multiconverter applications or  
for systems with a limited interfacing capacity. Data readback is  
analogous to clocking a shift register.  
A connection diagram example using three AD7982s is shown  
in Figure 39, and the corresponding timing is given in Figure 40.  
When SDI and CNV are low, SDO is driven low. With SCK  
high, a rising edge on CNV initiates a conversion, selects the  
chain mode, and enables the busy indicator feature. In this  
mode, CNV is held high during the conversion phase and the  
CONVERT  
CNV  
CNV  
CNV  
DIGITAL HOST  
SDI  
SDO  
AD7982  
SDI  
SDO  
SDI  
SDO  
AD7982  
AD7982  
DATA IN  
IRQ  
A
B
C
SCK  
SCK  
SCK  
CLK  
Figure 39. Chain Mode with Busy Indicator Connection Diagram  
tCYC  
CNV = SDI  
A
tCONV  
tACQ  
ACQUISITION  
CONVERSION  
ACQUISITION  
tSCK  
tSSCKCNV  
tSCKH  
SCK  
1
2
3
A
4
17  
18  
19  
20  
21  
35  
36  
37  
38  
39  
53  
54  
55  
tHSCKCNV  
tSSDISCK  
tSCKL  
tDSDOSDI  
tHSDISCK  
tEN  
SDO = SDI  
D
17  
D
16  
D
15  
D
1
D 0  
A
A
B
A
A
A
tHSDO  
tDSDO  
tDSDOSDI  
tDSDOSDI  
tDSDOSDI  
SDO = SDI  
B
D
17  
D
D
16  
D
D
15  
D
D
1
D
0
D
17  
D
16  
D 1  
A
D 0  
A
C
B
B
B
B
B
A
A
tDSDOSDI  
SDO  
D
17  
16  
15  
1
D
0
D
17  
D
16  
D
1
D
0
D
17  
D
16  
D
1
D 0  
A
C
C
C
C
C
C
B
B
B
B
A
A
A
Figure 40. Chain Mode with Busy Indicator Serial Interface Timing  
Rev. A | Page 22 of 24  
 
 
 
AD7982  
APPLICATION HINTS  
LAYOUT  
AD7982  
The printed circuit board that houses the AD7982 should be  
designed so that the analog and digital sections are separated  
and confined to certain areas of the board. The pinout of the  
AD7982, with its analog signals on the left side and its digital  
signals on the right side, eases this task.  
Avoid running digital lines under the device because these  
couple noise onto the die, unless a ground plane under the  
AD7982 is used as a shield. Fast switching signals, such as CNV  
or clocks, should not run near analog signal paths. Crossover of  
digital and analog signals should be avoided.  
At least one ground plane should be used. It can be common or  
split between the digital and analog sections. In the latter case,  
the planes should be joined underneath the AD7982s.  
Figure 41. Example Layout of the AD7982 (Top Layer)  
The AD7982 voltage reference input REF has a dynamic input  
impedance and should be decoupled with minimal parasitic  
inductances. This is done by placing the reference decoupling  
ceramic capacitor close to, ideally right up against, the REF and  
GND pins and connecting them with wide, low impedance traces.  
Finally, the power supplies VDD and VIO of the AD7982  
should be decoupled with ceramic capacitors, typically 100 nF,  
placed close to the AD7982 and connected using short, wide  
traces to provide low impedance paths and to reduce the effect  
of glitches on the power supply lines.  
An example of layout following these rules is shown in  
Figure 41 and Figure 42.  
EVALUATING AD7982 PERFORMANCE  
Figure 42. Example Layout of the AD7982 (Bottom Layer)  
Other recommended layouts for the AD7982 are outlined  
in the documentation of the evaluation board for the AD7982  
(EVAL-AD7982CBZ). The evaluation board package includes  
a fully assembled and tested evaluation board, documentation,  
and software for controlling the board from a PC via the  
EVAL-CONTROL BRD3.  
Rev. A | Page 23 of 24  
 
 
 
 
AD7982  
OUTLINE DIMENSIONS  
3.10  
3.00  
2.90  
6
10  
5.15  
4.90  
4.65  
3.10  
3.00  
2.90  
1
5
PIN 1  
0.50 BSC  
0.95  
0.85  
0.75  
1.10 MAX  
0.80  
0.60  
0.40  
8°  
0°  
0.15  
0.05  
0.33  
0.17  
SEATING  
PLANE  
0.23  
0.08  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-187-BA  
Figure 43. 10-Lead Mini Small Outline Package [MSOP]  
(RM-10)  
Dimensions shown in millimeters  
0.30  
0.23  
0.18  
3.00  
BSC SQ  
0.50 BSC  
8
5
4
PIN 1 INDEX  
1.74  
1.64  
1.49  
EXPOSED  
PAD  
AREA  
(BOTTOM VIEW)  
0.50  
0.40  
0.30  
1
PIN 1  
INDICATOR  
(R 0.19)  
TOP VIEW  
2.48  
2.38  
2.23  
0.80 MAX  
0.55 NOM  
0.80  
0.75  
0.70  
0.05 MAX  
0.02 NOM  
SEATING  
PLANE  
0.20 REF  
Figure 44. 10-Lead Lead Frame Chip Scale Package [QFN (LFCSP_WD)]  
3 mm × 3 mm Body, Very Very Thin, Dual Lead  
(CP-10-9)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model  
Temperature Range  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
Package Description  
10-Lead MSOP  
10-Lead MSOP  
10-Lead QFN (LFCSP_WD)  
10-Lead QFN (LFCSP_WD)  
10-Lead QFN (LFCSP_WD)  
Evaluation Board  
Package Option  
RM-10  
RM-10  
CP-10-9  
CP-10-9  
Ordering Quantity  
Tube, 50  
Reel, 1000  
Tube, 75  
Reel, 1000  
Reel, 5000  
Branding  
C5F  
C5F  
C5F  
C5F  
AD7982BRMZ1  
AD7982BRMZRL71  
AD7982BCPZ1  
AD7982BCPZ-RL71  
AD7982BCPZ-RL1  
EVAL-AD7982CBZ1, 2  
EVAL-CONTROL BRD3Z3  
CP-10-9  
C5F  
Controller Board  
1 Z = RoHS compliant part.  
2 This board can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BRD3 for evaluation/demonstration purposes.  
3 This board allows a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designator.  
©2007 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D06513–0–10/07(A)  
Rev. A | Page 24 of 24  
 
 
 
 
 

相关型号:

AD7982BRMZRL7

18-Bit, 1 MSPS PulSAR 7.0 mW ADC in MSOP/QFN
ADI

AD7983

16-Bit, 1.33 MSPS PulSAR ADC in MSOP/QFN
ADI

AD79831

14-Bit, 500 kSPS PulSAR ADC in MSOP
ADI

AD7983BCPZ-R2

16-Bit, 1.33 MSPS PulSAR ADC in MSOP/QFN
ADI

AD7983BCPZ-RL

16-Bit, 1.33 MSPS PulSAR ADC in MSOP/QFN
ADI

AD7983BCPZ-RL7

16-Bit, 1.33 MSPS PulSAR ADC in MSOP/QFN
ADI

AD7983BRMZ

16-Bit, 1.33 MSPS PulSAR ADC in MSOP/QFN
ADI

AD7983BRMZ-RL7

16-Bit, 1.33 MSPS PulSAR ADC in MSOP/LFCSP
ADI

AD7983BRMZRL7

16-Bit, 1.33 MSPS PulSAR ADC in MSOP/QFN
ADI

AD7983_17

16-Bit, 1.33 MSPS PulSAR ADC in MSOP/QFN
ADI

AD7984

18-Bit, 1.33 MSPS PulSAR 10.5 mW ADC in MSOP/QFN
ADI

AD79841

14-Bit, 500 kSPS PulSAR ADC in MSOP
ADI