AD8235 [ADI]
40 μA Micropower Instrumentation Amplifier in WLCSP Package; 40 μA微功耗仪表放大器，采用WLCSP封装
| 型号： | AD8235 |
| 厂家： | 
ADI |
| 描述： | 40 μA Micropower Instrumentation Amplifier in WLCSP Package |
| 文件： | 总20页 (文件大小：508K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
40 μA Micropower Instrumentation
Amplifier in WLCSP Package
AD8235
FEATURES
CONNECTION DIAGRAM
RG
Low power
+VS
A1
–VS
D1
RG
RG
B3
C3
40 μA maximum supply current
6 nA shutdown current
Low input currents
ESD
PROTECTION
ESD
PROTECTION
SDN
A2
B1
50 pA input bias current
25 pA input offset current
High Common Mode Rejection Ratio (CMRR)
110 dB CMRR , G = 100
Space saving
ESD
PROTECTION
C1
REF
210kΩ
52.5kΩ
52.5kΩ
210kΩ
OP AMP
A
ESD
PROTECTION
VOUT
OP AMP
B
B2
D2
NC
NC
WLCSP package
ESD
ESD
PROTECTION
PROTECTION
Zero input crossover distortion
Versatile
AD8235
A3
D3
Rail-to-rail input and output
Shutdown
+IN
–IN
Figure 1.
Gain set with single resistor (G = 5 to 200)
AD8236: ꢀSOIC package version of AD8235
PIN CONFIGURATION
BALL A1
INDICATOR
APPLICATIONS
1
2
3
Medical instrumentation
Low-side current sense
Portable electronics
+V
–IN
SDN
S
A
B
V
OUT
RG
RG
+IN
NC
NC
GENERAL DESCRIPTION
REF
The AD8235 is the smallest and lowest power instrumentation
amplifier in the industry. It is available in a 1.5 mm × 2.2 mm
wafer level chip scale package (WLCSP). The AD8235 draws
a maximum quiescent current of 40 μA. In addition, it draws a
maximum 500 nA of current during shutdown mode, making
it an excellent instrumentation amplifier for battery powered,
portable applications.
C
D
–V
S
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
NC = NO CONNECT
Figure 2. 11-Ball WLCSP (CB-11-1)
The AD8235 can operate on supply voltages as low as 1.8 V. The
input stage allows for wide rail-to-rail input voltage range without
the crossover distortion, common in other designs. The rail-to-
rail output enables easy interfacing to ADCs.
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
G = 5
V
V
= 5V
S
= 2.5V
REF
The AD8235 is an excellent choice for signal conditioning. Its
low input bias current of 50 pA and high CMRR of 110 dB
(G = 100) offer tremendous value for its size and low power.
It is specified over the extended industrial temperature range of
−40°C to 125°C.
G = 5
V
V
= 1.8V
S
= 0.9V
REF
–0.5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
OUTPUT VOLTAGE (V)
Figure 3. Wide Common-Mode Voltage Range vs. Output Voltage
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2009 Analog Devices, Inc. All rights reserved.
AD8235
TABLE OF CONTENTS
Features .............................................................................................. 1
Shutdown Feature....................................................................... 15
Layout Recommendations ........................................................ 15
Reference Terminal .................................................................... 16
Power Supply Regulation and Bypassing ................................ 16
Input Bias Current Return Path ............................................... 17
Input Protection ......................................................................... 17
RF Interference ........................................................................... 17
Common-Mode Input Voltage Range..................................... 18
Applications Information.............................................................. 19
AC-Coupled Instrumentation Amplifier................................ 19
Low Power Heart Rate Monitor ............................................... 19
Outline Dimensions....................................................................... 20
Ordering Guide .......................................................................... 20
Applications....................................................................................... 1
General Description......................................................................... 1
Connection Diagram ....................................................................... 1
Pin Configuration............................................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 7
Thermal Resistance ...................................................................... 7
Pin Configuration and Function Descriptions............................. 8
Typical Performance Characteristics ............................................. 9
Theory of Operation ...................................................................... 14
Basic Operation .......................................................................... 14
Gain Selection............................................................................. 14
REVISION HISTORY
8/09—Revision 0: Initial Version
Rev. 0 | Page 2 of 20
AD8235
SPECIFICATIONS
+VS = 5 V, −VS = 0 V (GND), VREF = 2.5 V, TA = 25°C, G = 5, RLOAD = 100 kΩ to GND, SDN pin tied to +VS, unless otherwise noted.
Table 1.
Parameter
Test Conditions
Min
Typ
Max
Unit
COMMON-MODE REJECTION RATIO (CMRR)
CMRR DC
VS = 2.ꢀ V, VREF = 0 V
VCM = −1.8 V to +1.8 V
G = ꢀ
90
94
dB
dB
dB
dB
G = 10
90
100
110
110
G = 100
100
100
G = 200
NOISE
Voltage Noise Spectral Density, RTI
RTI, 0.1 Hz to 10 Hz
G = ꢀ
f = 1 kHz, G = ꢀ
76
nV/√Hz
4
4
1ꢀ
μV p-p
μV p-p
fA/√Hz
G = 200
Current Noise
VOLTAGE OFFSET
Input Offset, VOS
Average Temperature Coefficient (TC)
Offset RTI vs. Supply (PSR)
G = ꢀ
2.ꢀ
mV
μV/°C
−40°C to +12ꢀ°C
VS = 1.8 V to ꢀ V
0.7
100
110
110
110
120
126
130
130
dB
dB
dB
dB
G = 10
G = 100
G = 200
INPUT CURRENT
Input Bias Current
Overtemperature
1
ꢀ0
pA
pA
pA
pA
pA
pA
−40°C to +8ꢀ°C
−40°C to +12ꢀ°C
100
600
2ꢀ
ꢀ0
130
Input Offset Current
Overtemperature
0.ꢀ
−40°C to +8ꢀ°C
−40°C to +12ꢀ°C
DYNAMIC RESPONSE
Small Signal Bandwidth, −3 dB
G = ꢀ
23
9
kHz
kHz
kHz
kHz
G = 10
G = 100
0.8
0.4
G = 200
Settling Time 0.01%
G = ꢀ
VOUT = 4 V step
444
4ꢀ6
992
1816
μs
μs
μs
μs
G = 10
G = 100
G = 200
Slew Rate
G = ꢀ to 100
9
mV/μs
Rev. 0 | Page 3 of 20
AD8235
Parameter
GAIN
Test Conditions
Min
Typ
Max
Unit
Gain Range
Gain Error
G = ꢀ + 420 kΩ/RG
ꢀ
2001
V/V
VS = 2.ꢀ V, VREF = 0 V, VOUT = −2 V to +2 V
G = ꢀ
0.00ꢀ
0.03
0.06
0.1ꢀ
0.0ꢀ
0.2
%
%
%
%
G = 10
G = 100
0.2
G = 200
0.3
Nonlinearity
G = ꢀ
RL = 10 kΩ or 100 kΩ
−40°C to +12ꢀ°C
2
10
10
10
10
ppm
ppm
ppm
ppm
G = 10
1.2
0.ꢀ
0.ꢀ
G = 100
G = 200
Gain vs. Temperature
G = ꢀ
0.3ꢀ
1.ꢀ
ppm/°C
ppm/°C
G > 10
−ꢀ0
INPUT
Differential Impedance
Common-Mode Impedance
Input Voltage Range
OUTPUT
440||1.6
110||6.2
GΩ||pF
GΩ||pF
V
−40°C to +12ꢀ°C
0
+VS
Output Voltage High, VOH
RL = 100 kΩ
4.98
4.98
4.9
4.99
4.9ꢀ
2
V
−40°C to +12ꢀ°C
RL = 10 kΩ
V
V
−40°C to +12ꢀ°C
RL = 100 kΩ
4.9
V
Output Voltage Low, VOL
ꢀ
mV
mV
mV
mV
mA
−40°C to +12ꢀ°C
RL = 10 kΩ
ꢀ
10
2ꢀ
30
−40°C to +12ꢀ°C
Short-Circuit Limit, ISC
REFERENCE INPUT
RIN
ꢀꢀ
−IN, +IN = 0 V
210
20
kΩ
nA
V
IIN
Voltage Range
Gain to Output
SHUTDOWN OPERATION
Shutdown current
−VS
+VS
1
6
V/V
ꢀ00
1.ꢀ
nA
μA
−40°C to +12ꢀ°C
SDN PIN INPUT VOLTAGE RANGE
VOH
−40°C to +12ꢀ°C
−40°C to +12ꢀ°C
+VS − 0.ꢀ
−VS
+VS
V
V
VOL
−VS + 0.ꢀ
POWER SUPPLY
Operating Range
Quiescent Current
Overtemperature
TEMPERATURE RANGE
For Specified Performance
1.8
ꢀ.ꢀ
40
ꢀ0
V
30
μA
μA
−40°C to +12ꢀ°C
−40
+12ꢀ
°C
1 Although the specifications of the AD823ꢀ list only low to midrange gains, gains can be set beyond 200.
Rev. 0 | Page 4 of 20
AD8235
+VS = 1.8 V, −VS = 0 V (GND), VREF = 0.9 V, TA = 25°C, G = 5, RLOAD = 100 kΩ to GND, SDN pin tied to +VS, unless otherwise noted.
Table 2.
Parameter
Test Conditions
Min
Typ
Max
Unit
COMMON-MODE REJECTION RATIO (CMRR)
CMRR DC
VS = 0.9 V, VREF = 0 V
VCM = −0.6 V to +0.6 V
G = ꢀ
90
94
dB
dB
dB
dB
G = 10
90
100
110
110
G = 100
100
100
G = 200
NOISE
Voltage Noise Spectral Density, RTI
RTI, 0.1 Hz to 10 Hz
G = ꢀ
f = 1 kHz, G = ꢀ
76
nV/√Hz
4
4
1ꢀ
μV p-p
μV p-p
fA/√Hz
G = 200
Current Noise
VOLTAGE OFFSET
Input Offset, VOS
Average Temperature Coefficient (TC)
Offset RTI vs. Supply (PSR)
G = ꢀ
2.ꢀ
mV
μV/°C
−40°C to +12ꢀ°C
VS = 1.8 V to ꢀ V
0.7
100
110
110
110
120
126
130
130
dB
dB
dB
dB
G = 10
G = 100
G = 200
INPUT CURRENT
Input Bias Current
Overtemperature
1
ꢀ0
pA
pA
pA
pA
pA
pA
−40°C to +8ꢀ°C
−40°C to +12ꢀ°C
100
600
2ꢀ
ꢀ0
130
Input Offset Current
Overtemperature
0.ꢀ
−40°C to +8ꢀ°C
−40°C to +12ꢀ°C
DYNAMIC RESPONSE
Small Signal Bandwidth, –3 dB
G = ꢀ
23
9
kHz
kHz
kHz
kHz
G = 10
G = 100
0.8
0.4
G = 200
Settling Time 0.01%
G = ꢀ
VOUT = 1.4 V step
143
μs
μs
μs
μs
G = 10
178
G = 100
1000
1864
G = 200
Slew Rate
G = ꢀ to 100
11
mV/μs
Rev. 0 | Page ꢀ of 20
AD8235
Parameter
GAIN
Test Conditions
Min
Typ
Max
Unit
Gain Range
Gain Error
G = ꢀ + 420 kΩ/RG
ꢀ
2001
V/V
VS = 0.9 V, VREF = 0 V, VOUT = −0.6 V to +0.6 V
G = ꢀ
0.00ꢀ
0.03
0.06
0.1ꢀ
0.0ꢀ
0.2
%
%
%
%
G = 10
G = 100
0.2
G = 200
0.3
Nonlinearity
G = ꢀ
RL = 10 kΩ or 100 kΩ
−40°C to +12ꢀ°C
1
10
10
10
10
ppm
ppm
ppm
ppm
G = 10
1
G = 100
0.ꢀ
0.4
G = 200
Gain vs. Temperature
G = ꢀ
0.3ꢀ
1.ꢀ
ppm/°C
ppm/°C
G > 10
−ꢀ0
INPUT
Differential Impedance
Common-Mode Impedance
Input Voltage Range
OUTPUT
440||1.6
110||6.2
GΩ||pF
GΩ||pF
V
−40°C to +12ꢀ°C
0
+VS
Output Voltage High, VOH
RL = 100 kΩ
1.78
1.78
1.6ꢀ
1.6ꢀ
1.79
1.7ꢀ
2
V
−40°C to +12ꢀ°C
RL = 10 kΩ
V
V
−40°C to +12ꢀ°C
RL = 100 kΩ
V
Output Voltage Low, VOL
ꢀ
mV
mV
mV
mV
mA
−40°C to +12ꢀ°C
RL = 10 kΩ
ꢀ
12
6
2ꢀ
2ꢀ
−40°C to +12ꢀ°C
Short-Circuit Limit, ISC
REFERENCE INPUT
RIN
−IN, +IN = 0 V
210
20
kΩ
nA
V
IIN
Voltage Range
Gain to Output
SHUTDOWN OPERATION
Shutdown Current
−VS
+VS
1
6
V/V
ꢀ00
1.ꢀ
nA
μA
−40°C to +12ꢀ°C
SDN PIN INPUT VOLTAGE RANGE
VOH
−40°C to +12ꢀ°C
−40°C to +12ꢀ°C
+VS − 0.ꢀ
−VS
+VS
V
V
VOL
−VS + 0.ꢀ
TEMPERATURE RANGE
For Specified Performance
−40
+12ꢀ
°C
1 Although the specifications of the AD823ꢀ list only low to midrange gains, gains can be set beyond 200.
Rev. 0 | Page 6 of 20
AD8235
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. This
was measured using a standard 4-layer board, unless otherwise
specified.
Parameter
Rating
Supply Voltage
6 V
ꢀꢀ mA
VS
VS
−6ꢀ°C to +12ꢀ°C
−40°C to +12ꢀ°C
12ꢀ°C
Output Short-Circuit Current
Input Voltage (Common Mode)
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
Junction Temperature
ESD
Human Body Model
Charge Device Model
Machine Model
Table 4. Thermal Resistance
Package Type
PCB
Power (W)
0.2ꢀ
1.2ꢀ
θJA (°C/W)
139.1
130
11-Ball WLCSP CB-11-1
1S0P1
2S2P2
0.2ꢀ
69.ꢀ
1.ꢀ kV
0.ꢀ kV
200 V
1.2ꢀ
68.3
1 Simulated thermal numbers per JESDꢀ1-9:
1-layer PCB (1S0P), low effective thermal conductivity test board.
2 4-layer PCB (2S2P), high effective thermal conductivity test board.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. 0 | Page 7 of 20
AD8235
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
BALL A1
INDICATOR
1
2
3
+V
–IN
SDN
S
A
B
V
OUT
RG
RG
+IN
NC
NC
REF
C
D
–V
S
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
NC = NO CONNECT
Figure 4. Pin Configuration (Top View Looking Through Package)
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
A1
B1
C1
D1
A2
B2, D2
A3
B3, C3
D3
+VS
VOUT
REF
−VS
SDN
NC
−IN
RG
+IN
Positive Power Supply Terminal.
Output Terminal.
Reference Voltage Terminal. Drive this terminal with a low impedance voltage source to level-shift the output.
Negative Power Supply Terminal.
Shutdown Pin. Tie to −VS for shutdown. Tie to +VS for normal operation.
No Connect. Leave both pins floating. Should not connect to any potential.
Negative Input Terminal (True Differential Input).
Gain Setting Terminals. Place resistor across the RG pins.
Positive Input Terminal (True Differential Input).
Rev. 0 | Page 8 of 20
AD8235
TYPICAL PERFORMANCE CHARACTERISTICS
G = 5, +VS = 5 V, VREF = 2.5 V, RL = 100 kꢀ tied to GND, TA = 25°C, SDN pin connected to +VS, unless otherwise noted
2400
2100
1800
1500
1200
900
GAIN = 5
600
300
5µV/DIV
1s/DIV
0
–40
–30
–20
–10
0
10
20
30
40
3000
10k
CMRR (µV/V)
Figure 5. CMRR Distribution
Figure 8. 0.1 Hz to 10 Hz RTI Voltage Noise
400
350
300
250
200
150
100
50
GAIN = 200
5µV/DIV
1s/DIV
0
–3000
–2000
–1000
0
1000
2000
V
(µV)
OSI
Figure 9. 0.1 Hz to 10 Hz RTI Voltage Noise
Figure 6. Typical Distribution of Input Offset Voltage
140
1k
100
10
120
100
80
60
40
20
0
GAIN = 200
GAIN = 100
INTERNAL
CLIPPING
GAIN = 5
GAIN = 200
BANDWIDTH
LIMITED
GAIN = 10
GAIN = 5
0.1
1
10
100
1k
10k
100k
1
10
100
1k
FREQUNCY (Hz)
FREQUENCY (Hz)
Figure 7. Voltage Noise Spectral Density vs. Frequency
Figure 10. Positive PSRR vs. Frequency, RTI,
VS = 0.9 V, 2.5 V, VREF = 0 V
Rev. 0 | Page 9 of 20
AD8235
120
100
80
10
5
GAIN = 100
GAIN = 10
GAIN = 5
GAIN = 200
60
0
40
–5
–10
20
0
0.1
1
10
100
1k
10k
100k
–40
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FREQUENCY (Hz)
Figure 11. Negative PSRR vs. Frequency, RTI, VS = 0.9 V, 2.5 V, VREF = 0 V
Figure 14. Change in CMRR vs. Temperature, G = 5, Normalized at 25°C
120
60
50
40
GAIN = 200
100
80
GAIN = 100
GAIN = 10
30
20
60
40
20
0
GAIN = 200
GAIN = 100
10
GAIN = 5
0
–10
–20
–30
–40
GAIN = 10
GAIN = 5
1k
0.1
1
10
100
10k
100k
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 12. CMRR vs. Frequency, RTI
Figure 15. Gain vs. Frequency, VS = 1.8 V, 5 V
120
100
80
60
40
20
0
6
5
4
3
2
1
0
GAIN = 200
GAIN = 100
GAIN = 5
GAIN = 10
0.1
1
10
100
1k
10k 100k
1
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 13. CMRR vs. Frequency, 1 kΩ Source Imbalance, RTI
Figure 16. Maximum Output Voltage vs. Frequency
Rev. 0 | Page 10 of 20
AD8235
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
(4.98V, 4.737V)
(0.01V, 4.24V)
R
R
= 100kꢀ TIED TO GND
= 10kꢀ TIED TO GND
LOAD
LOAD
(4.98V, 0.767V)
(0.01V, 0.27V)
V
= 5V
S
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
–0.5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
Figure 20. Input Common-Mode Voltage Range vs. Output Voltage,
G = 5, VS = 5 V, VREF = 2.5 V
Figure 17. Gain Nonlinearity, G = 5
5.0
4.5
(4.994V, 4.75V)
(0.01V, 4.25V)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
TWO CURVES REPRESENTED:
R
= 10kꢀ AND 100kꢀ TIED TO GND
LOAD
(4.994V, 0.076V)
(0.01V, 0.026V)
V
= 5V
S
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
–0.5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
Figure 18. Gain Nonlinearity, G = 10
Figure 21. Input Common-Mode Voltage Range vs. Output Voltage,
G = 200, VS = 5 V, VREF = 2.5 V
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
(1.78V, 1.704V)
(0.0069V, 1.52V)
TWO CURVES REPRESENTED:
R
= 10kꢀ AND 100kꢀ TIED TO GND
LOAD
(1.78V, 0.274V)
(0.0069V, 0.09V)
V
= 5V
S
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
–0.2
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
Figure 19. Gain Nonlinearity, G = 200
Figure 22. Input Common-Mode Voltage Range vs. Output Voltage,
G = 5, VS = 1.8 V, VREF = 0.9 V
Rev. 0 | Page 11 of 20
AD8235
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
(1.75V, 1.705V)
(0.03V, 1.533V)
444μs TO 0.01%
(1.75V, 0.275V)
(0.03V, 0.103V)
0
–0.2
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
OUTPUT VOLTAGE (V)
1ms/DIV
Figure 23. Input Common-Mode Voltage Range vs. Output Voltage,
G = 200, VS = 1.8 V, VREF = 0.9 V
Figure 26. Large Signal Pulse Response and Settling Time,
VS = 2.5 V, VREF = 0 V, RLOAD = 10 kΩ to VREF
+V
S
–0.001
–0.002
–0.003
+125°C
+85°C
+25°C –40°C
143.2μs TO 0.01%
+0.003
+0.002
+0.001
+85°C +25°C
2.8
+125°C
–40°C
3.3
–V
S
1.8
2.3
3.8
4.3
4.8
1ms/DIV
SUPPLY VOLTAGE (V)
Figure 24. Output Voltage Swing vs. Supply Voltage,
VS = 0.9 V, 2.5 V, VREF = 0 V, RLOAD = 100 kΩ Tied to −VS
Figure 27. Large Signal Pulse Response and Settling Time,
VS = 0.9 V, VREF = 0 V, RLOAD = 10 kΩ to VREF
+V
S
–0.1
–40°C
+25°C
+85°C
+125°C
–0.2
–0.3
+0.003
+0.002
+0.001
+125°C
+85°C
+25°C
–40°C
–V
S
100µs/DIV
1k
10k
100k
R
(ꢀ)
LOAD
Figure 25. Output Voltage Swing vs. Load Resistance,
VS = 0.9 V, 2.5 V, VREF = 0 V, RLOAD = 100 kΩ Tied to −VS
Figure 28. Small Signal Pulse Response, G = 5,
VS = 2.5 V, VREF = 0 V, RLOAD = 100 kΩ to VREF, CL = 100 pF
Rev. 0 | Page 12 of 20
AD8235
500
400
300
200
100
0
100µs/DIV
0
1
2
3
4
OUTPUT VOLTAGE STEP SIZE (V)
Figure 29. Small Signal Pulse Response, G = 5, CL = 100 pF,
VS = 0.9 V, VREF = 0 V, RLOAD = 100 kΩ to VREF
Figure 32. Settling Time vs. Output Voltage Step Size,
VS = 2.5 V, VREF = 0 V, RLOAD = 10 kΩ Tied to VREF
40
38
36
34
32
30
28
26
24
22
20
1.8V
5V
1ms/DIV
–40 –25 –10
5
20
35
50
65
80
95 110 125
TEMPERATURE (°C)
Figure 30. Small Signal Pulse Response, G = 200,
CL = 100 pF, VS = 2.5 V, VREF = 0 V, RLOAD = 100 kΩ to VREF
Figure 33. Total Supply Current vs. Temperature
600
500
400
300
200
100
0
V
= 5V
S
V
= 1.8V
S
–100
1ms/DIV
–40 –25 –10
5
20
35
50
65
80
95 110 125
TEMPERATURE (°C)
Figure 31. Small Signal Pulse Response, G = 200,
Figure 34. Total Supply Current During Shutdown vs. Temperature
CL = 100 pF, VS = 0.9 V, VREF = 0 V, RLOAD = 100 kΩ to VREF
Rev. 0 | Page 13 of 20
AD8235
THEORY OF OPERATION
R
G
+V
–V
S
S
RG
RG
B3
C3
A1
D1
ESD
ESD
PROTECTION
PROTECTION
SDN
A2
B1
ESD
PROTECTION
C1
REF
210kꢀ
52.5kꢀ 52.5kꢀ
210kꢀ
OP AMP
A
ESD
PROTECTION
V
OP AMP
B
B2
D2
NC
NC
OUT
ESD
ESD
PROTECTION
PROTECTION
AD8235
A3
D3
+IN
–IN
Figure 35. Simplified Schematic
5V
SDN
The AD8235 is a monolithic, two-op amp instrumentation
amplifier. It is designed for low power, portable applications
where size and low quiescent current are paramount. The
AD8235 is offered in a WLCSP package, minimizing layout
area. Additional features that make this part optimal for
portable applications include a rail-to-rail input and output
stage that offers more dynamic range when operating on low
voltage batteries. Unlike traditional rail-to-rail input amplifiers
that use a complementary differential pair stage and suffer from
nonlinearity, the AD8235 uses a novel architecture to internally
boost the supply rail, allowing the amplifier to operate rail-to-
rail yet still deliver a low 0.5 ppm of nonlinearity. In addition,
the two-op amp instrumentation amplifier architecture offers a
wide operational common-mode voltage range. Additional
information is provided in the Common-Mode Input Voltage
Range section. Precision, laser-trimmed resistors provide the
AD8235 with a high CMRR of 90 dB (minimum) at G = 5 and
gain accuracy of 0.05% (maximum).
0.1µF
OUT
+IN
RG
VINP
+V
S
GAIN SETTING
RESISTOR
V
AD8235
OUT
RG
–IN
REF
VINM
V
REF
–V
S
Figure 36. Basic Setup
GAIN SELECTION
Placing a resistor across the RG terminals sets the gain of the
AD8235. The gain may be derived by referring to Table 6 or by
using the following equation:
420 kΩ
RG
=
G −5
Table 6. Gains Achieved Using 1% Resistors
1% Standard Table Value of RG (kΩ)
Calculated Gain
BASIC OPERATION
422
210
140
10ꢀ
84.ꢀ
28
9.31
4.42
2.1ꢀ
6.0
7.0
8.0
9.0
10.0
20.0
ꢀ0.1
100.0
200.3
The AD8235 amplifies the difference between its positive input
(+IN) and its negative input (−IN). The REF pin allows the user
to level-shift the output signal. This is convenient when interfacing
to a filter or analog-to-digital converter (ADC). The basic setup
is shown in Figure 36. Figure 39 shows an example configuration
for operating the AD8235 with dual supplies. The equation for
the AD8235 is as follows:
V
OUT = G × (VINP − VINM) + VREF
If no gain setting resistor is installed, the default gain, G, is 5.
The Gain Selection section describes how to program the gain, G.
The AD8235 defaults to G = 5 when no gain resistor is used.
Gain accuracy is determined by the absolute tolerance of RG.
The TC of the external gain resistor increases the gain drift of
the instrumentation amplifier. Gain error and gain drift are at
a minimum when the gain resistor is not used.
Rev. 0 | Page 14 of 20
AD8235
SHUTDOWN FEATURE
The AD8235 includes a shutdown pin (SDN) that further
enhances the flexibility and ease of use in portable applications
where power consumption is critical. A logic level signal can be
applied to this pin to switch to shutdown mode, even when the
supply is still on.
When connecting the SDN pin to +VS or applying a voltage
within +VS − 0.5 V, the AD8235 operates in its normal condition
and, therefore, draws approximately 40 μA of supply current.
When connecting the SDN pin to −VS, or any voltage within −VS +
0.5 V, the AD8235 operates in shutdown mode and, therefore,
draws less than 500 nA of supply current, offering considerable
power savings.
TRACE
WIDTH
PAD OPENING
MASK OPENING
Figure 37. Pad Opening
In cases where the AD8235 is operating in shutdown mode, if
a voltage potential exists at the REF pin, and there is a load to
−VS at the output of the part, some additional current draw is
noticeable. In this mode, a path from the REF pin to −VS exists,
leading to some additional current draw from the reference.
Typically, this current is negligible because the output of the
AD8235 is driving a high impedance node, such as the input of
an ADC.
Pad Type
For the actual board fabrication, the following types of
pads/land patterns are used for surface mount assembly:
•
Nonsolder mask defined (NSMD). The metal pad on the
PCB (to which the I/O is attached) is smaller than the
solder mask opening.
•
Solder mask defined (SMD). The solder mask opening is
smaller than the metal pad.
LAYOUT RECOMMENDATIONS
The critical board design parameters, as it pertains to a WLCSP
package, are pad opening, pad type, pad finish, and board
thickness.
Because the copper etching process has tighter control than the
solder mask opening process, NSMD is preferred over SMD.
The solder mask opening on NSMD pads is larger than the
copper pads, allowing the solder to attach to the sides of the
copper pad and improving the reliability of the solder joints.
Pad Opening
Based on the IPC (Institute for Printed Circuits) standard, the
pad opening equals the UBM (Under Bump Metallurgy)
opening. The typical pad openings for the AD8235 shown in
Figure 37 are:
Pad Finish
The finish layer on the metal pads has a significant effect on
assembly yield and reliability. The typical metal pad finishes
used are organic surface preservative (OSP) and electroless
nickel immersion gold (ENIG). The thickness of the OSP finish
on a metal pad is 0.2 ꢁm to 0.5 ꢁm. This finish evaporates during
the reflow soldering process and interfacial reactions occur
between the solder and metal pad. The ENIG finish consists
of 5 ꢁm of electroless nickel and 0.02 ꢁm to 0.05 μm of gold.
During reflow soldering, the gold layer dissolves rapidly, followed
by reaction between the nickel and solder. It is extremely important
to keep the thickness of gold below 0.05 ꢁm to prevent the
formation of brittle intermetallic compounds.
•
250 μm (0.5 mm pitch WLCSP)
The solder mask opening is 100 ꢁm plus the pad opening (or
350 μm in the case of the AD8235). The trace width should be
less than two-thirds of the pad opening. Increasing the trace
width can cause reduction in the stand-off height of the solder
bump. Therefore, maintaining the proper trace width ratio is
important to ensure the reliability of the solder connections.
Rev. 0 | Page 1ꢀ of 20
AD8235
INCORRECT
CORRECT
Board Thickness
Typical board thicknesses used in the industry range from
0.4 mm to 1.6 mm and are most applicable for the AD8235. The
thickness selected depends on the required robustness of the
populated system assembly. The thinner board results in smaller
shear stress range, creep shear strain range, and creep strain
energy density range in the solder joints under the thermal
loading. Therefore, the thinner build-up board leads to longer
thermal fatigue life of solder joints [John H. Lau and S.W. Ricky
Lee]1
AD8235
AD8235
REF
REF
V
V
+
OP AMP
–
Figure 38. Driving the REF Pin
Grounding
POWER SUPPLY REGULATION AND BYPASSING
The output voltage of the AD8235 is developed with respect to
the potential on the reference terminal, REF. To ensure the most
accurate output, the trace from the REF pin should either be
connected to the AD8235 local ground (see Figure 39) or
connected to a voltage that is referenced to the AD8235 local
ground (Figure 36).
The AD8235 has high power supply rejection ration (PSRR).
However, for optimal performance, a stable dc voltage should be
used to power the instrumentation amplifier. Noise on the supply
pins can adversely affect performance. As in all linear circuits,
bypass capacitors must be used to decouple the amplifier.
A 0.1 μF capacitor should be placed close to each supply pin.
A 10 μF tantalum capacitor can be used farther away from the
part (see Figure 39). In most cases, it can be shared by other
precision integrated circuits.
REFERENCE TERMINAL
The reference terminal, REF, is at one end of a 210 kꢀ resistor
(see Figure 35). The output of the instrumentation amplifier
is referenced to the voltage on the REF terminal; this is useful
when the output signal needs to be offset to voltages other than
common. For example, a voltage source can be tied to the REF
pin to level-shift the output so that the AD8235 can interface
with an ADC. The allowable reference voltage range is a function
of the gain, common-mode input, and supply voltages. The REF
pin should not exceed either +VS or −VS by more than 0.5 V.
+V
S
0.1µF
10µF
SDN
+IN
–IN
V
OUT
AD8235
LOAD
For best performance, especially in cases where the output is not
measured with respect to the REF terminal, source impedance to
the REF terminal should be kept low because parasitic resistance
can adversely affect CMRR and gain accuracy. Figure 38
demonstrates how an op amp is configured to provide a low
source impedance to the REF terminal when a midscale
reference voltage is desired.
REF
–V
S
0.1µF
10µF
–V
S
Figure 39. Supply Decoupling, REF, and Output Referred to Ground
1John H. Lau and S.W. Ricky Lee, “Effects of Build-Up Printed Circuit Board
Thickness on the Solder Joint Reliability of a Wafer Level Chip Scale Package
(WLCSP),” IEEE Transactions on Components and Packaging Technologies,
Vol.2ꢀ, No.1, March 2002, pages 3-14.
Rev. 0 | Page 16 of 20
AD8235
+V
+V
S
S
AD8235
AD8235
REF
REF
–V
–V
S
S
TRANSFORMER
TRANSFORMER
+V
+V
S
S
C
C
R
R
1
fHIGH-PASS
=
AD8235
2πRC
AD8235
REF
REF
–V
–V
S
S
AC-COUPLED
AC-COUPLED
Figure 40. Creating an IBIAS Path
RF INTERFERENCE
INPUT BIAS CURRENT RETURN PATH
RF rectification is often a problem in applications where there are
large RF signals. The problem appears as a small dc offset voltage.
The AD8235, by its nature, has a 3.1 pF gate capacitance, CG, at
each input. Matched series resistors form a natural low-pass filter
that reduces rectification at high frequency (see Figure 41). The
relationship between external, matched series resistors and the
internal gate capacitance is expressed as
The AD8235 input bias current is extremely small at less than
50 pA. Nonetheless, the input bias current must have a return
path to common. When the source, such as a transformer,
cannot provide a return current path, one should be created
(see Figure 40).
INPUT PROTECTION
All terminals of the AD8235 are protected against ESD. In addition,
the input structure allows for dc overload conditions a diode drop
above the positive supply and a diode drop below the negative
supply. Voltages beyond a diode drop of the supplies cause the
ESD diodes to conduct and enable current to flow through the
diode. Therefore, an external resistor should be used in series
with each of the inputs to limit current for voltages above +VS.
In either scenario, the AD8235 safely handles a continuous 6 mA
current at room temperature.
1
FilterFreqDIFF
FilterFreqCM
=
2πRCG
1
=
2πRCG
+V
S
0.1µF
10µF
SDN
For applications where the AD8235 encounters extreme
overload voltages, as in cardiac defibrillators, external series
resistors and low leakage diode clamps, such as BAV199Ls,
FJH1100s, or SP720s, should be used.
+IN
R
R
C
C
G
V
OUT
AD8235
–V
S
G
REF
–V
S
–IN
0.1µF
10µF
–V
S
Figure 41. RFI Filtering Without External Capacitors
Rev. 0 | Page 17 of 20
AD8235
To eliminate high frequency common-mode signals while using
smaller source resistors, a low-pass RC network can be placed
at the input of the instrumentation amplifier (see Figure 42).
The filter limits the input signal bandwidth according to the
following relationship:
COMMON-MODE INPUT VOLTAGE RANGE
The common-mode input voltage range is a function of the
input voltages, reference voltage, supplies, and the output of
Internal Op Amp A. Figure 35 shows the internal nodes of the
AD8235. Figure 20 to Figure 23 show the common-mode
voltage ranges for typical supply voltages and gains.
1
FilterFreqDIFF
FilterFreqCM
=
2πR(2 CD +CC + CG )
If the supply voltages and reference voltage are not represented
in Figure 20 to Figure 23, the following methodology can be
used to calculate the acceptable common-mode voltage range:
1
=
2πR(CC + CG )
1. Adhere to the input, output, and reference voltage ranges
shown in Table 1 and Table 2.
2. Calculate the output of Internal Op Amp A. The following
equation calculates this output:
Mismatched CC capacitors result in mismatched low-pass filters.
The imbalance causes the AD8235 to treat what is a common-
mode signal as a differential signal. To reduce the effect of
mismatched external CC capacitors, select a value of CD greater
than 10× CC. This sets the differential filter frequency lower than
the common-mode frequency.
52.5 kΩ
VDIFF
2
VREF
4
5
4
⎛
⎜
⎝
⎞
⎟
⎠
A =
V
−
−
VDIFF −
CM
RG
+V
S
where:
0.1µF
1nF
10µF
V
V
V
V
DIFF is defined as the difference in input voltages,
DIFF = VINP − VINM.
CM is defined as the common-mode voltage,
CM = (VINP + VINM)/2.
SDN
C
C
C
C
D
C
R
+IN
4.02kꢀ
V
OUT
If no gain setting resistor, RG, is installed, set RG to infinity.
3. Keep A within 10 mV of either supply rail. This is valid over
the −40°C to +125°C temperature range.
10nF
1nF
AD8235
R
REF
–IN
4.02kꢀ
−VS + 10 mV < A < +VS – 10 mV
Figure 42. RFI Suppression
Rev. 0 | Page 18 of 20
AD8235
APPLICATIONS INFORMATION
AC-COUPLED INSTRUMENTATION AMPLIFIER
LOW POWER HEART RATE MONITOR
An integrator can be tied to the AD8235 in feedback to create a
high-pass filter, as shown in Figure 43. This circuit can be used
to reject dc voltages and offsets. At low frequencies, the impedance
of the capacitor, C, is high. Therefore, the gain of the integrator
is high. DC voltage at the output of the AD8235 is inverted and
gained by the integrator. The inverted signal is injected back into
the REF pin, nulling the output. In contrast, at high frequencies,
the integrator has low gain because the impedance of C is low.
Voltage changes at high frequencies are inverted but at a low
gain. The signal is injected into the REF pins, but it is not enough to
null the output. At very high frequencies, the capacitor appears as
a short. The op amp is at unity gain. High frequency signals are,
therefore, allowed to pass.
The low power and small size of the AD8235 make it an excellent
choice for heart rate monitors. As shown in Figure 44, the
AD8235 measures the biopotential signals from the body. It
rejects common-mode signals and serves as the primary gain
stage set at G = 5. The 4.7 μF capacitor and the 100 kΩ resistor
set the −3 dB cutoff of the high-pass filter that follows the
instrumentation amplifier. It rejects any differential dc offsets
that may develop from the half-cell overpotential of the electrode.
A secondary gain stage, set at G = 403, amplifies the ECG signal,
which is then sent into a second-order, low-pass, Bessel filter
with −3 dB cutoff at 48 Hz. The 324 Ω resistor and 1 ꢁF capacitor
serve as an antialiasing filter. The 1 μF capacitor also serves as a
charge reservoir for the ADC switched capacitor input stage.
When a signal exceeds fHIGH-PASS, the AD8235 outputs the high-
pass filtered input signal.
This circuit was designed and tested using the AD8609, low
power, quad op amp. The fourth op amp is configured as a Schmitt
trigger to indicate if the right arm or left arm electrodes fall off
the body. Used in conjunction with the 953 kΩ resistors at the
inputs of the AD8235, the resistors pull the inputs apart when
the electrodes fall off the body. The Schmitt trigger sends an
active low signal to indicate a leads off condition.
+V
S
0.1µF
SDN
+IN
–IN
1
fHIGH-PASS
=
2πRC
The reference electrode (right leg) is set tied to ground. Likewise,
the shield of the electrode cable is also tied to ground. Some
portable heart rate monitors do not have a third electrode. In
such cases, the negative input of the AD8235 can be tied to GND.
AD8235
R
REF
C
+V
S
Note that this circuit is shown, solely, to demonstrate the capability
of the AD8235. Additional effort must be made to ensure
compliance with medical safety guidelines.
0.1µF
AD8603
+V
S
V
REF
10µF
Figure 43. AC-Coupled Circuit
+2.5V
–2.5V
20kꢀ
1kꢀ
+2.5V
+2.5V
5kꢀ
AD8609
LEADS OFF DETECTION
INTERRUPT
LEADS OFF
0.1µF
680nF
953kꢀ
SDN
+2.5V
0.1µF
RA
LA
AD8235
24.9kꢀ
4.02kꢀ
IN-AMP
AD8609
324ꢀ
AD8609
0.1µF
10-BIT ADC
MCU + ADC
100kꢀ
RL
953kꢀ
1kꢀ
402kꢀ
220nF
1µF
0.1µF
4.7µF
–2.5V
–2.5V
–2.5V
+2.5V
AD8609
1kꢀ
–2.5V
Figure 44. Example Low Power Heart Rate Monitor Schematic
Rev. 0 | Page 19 of 20
AD8235
OUTLINE DIMENSIONS
0.657
0.602
0.546
1.61
1.57
1.53
0.348
0.328
0.308
0.020
REF
SEATING
PLANE
3
2
1
A
BALL A1
IDENTIFIER
1.50
REF
2.08
2.04
2.00
B
C
D
0.330
0.310
0.290
0.50
REF
0.230
0.212
0.192
TOP VIEW
(BALL SIDE DOWN)
BOTTOM VIEW
(BALL SIDE UP)
0.04 MAX
0.355
0.330
0.304
COPLANARITY
1.00
REF
0.280
0.250
0.220
Figure 45. 11-Ball, Backside-Coated, Wafer Level Chip Scale Package [WLCSP]
(CB-11-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD823ꢀACBZ-P71
Temperature Range
Package Description
Package Option
Branding
−40°C to + 12ꢀ°C
11-Ball [WLCSP]
CB-11-1
H20
1 Z = RoHS Compliant Part.
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08211-0-8/09(0)
Rev. 0 | Page 20 of 20
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