AD8331_10 [ADI]
Ultralow Noise VGAs with Preamplifier and Programmable RIN; 超低噪声可变增益放大器与前置放大器和可编程RIN
| 型号： | AD8331_10 |
| 厂家： | 
ADI |
| 描述： | Ultralow Noise VGAs with Preamplifier and Programmable RIN |
| 文件： | 总56页 (文件大小：1825K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Ultralow Noise VGAs with
Preamplifier and Programmable RIN
AD8331/AD8332/AD8334
FEATURES
FUNCTIONAL BLOCK DIAGRAM
LON LOP VIP VIN
VCM
HILO
Ultralow noise preamplifier (preamp)
Voltage noise = 0.74 nV/√Hz
Current noise = 2.5 pA/√Hz
3 dB bandwidth
AD8331: 120 MHz
3.5dB OR 15.5dB
V
MID
LNA
19dB
–
ATTENUATOR
VOH
VOL
48dB
21dB
PA
INH
+
AD8332, AD8334: 100 MHz
Low power
AD8331: 125 mW/channel
CLAMP
LMD
GAIN
VCM
BIAS
VGA BIAS AND
INTERPOLATOR
RCLMP
CONTROL
INTERFACE
AD8332, AD8334: 145 mW/channel
Wide gain range with programmable postamp
−4.5 dB to +43.5 dB in LO gain mode
7.5 dB to 55.5 dB in HI gain mode
Low output-referred noise: 48 nV/√Hz typical
Active input impedance matching
Optimized for 10-bit/12-bit ADCs
Selectable output clamping level
Single 5 V supply operation
AD8331/AD8332/AD8334
ENB
GAIN
Figure 1. Signal Path Block Diagram
60
50
40
30
20
10
0
V
= 1V
GAIN
HI GAIN
MODE
V
= 0.8V
= 0.6V
= 0.4V
GAIN
GAIN
GAIN
GAIN
V
V
V
AD8332 and AD8334 available in lead frame chip scale package
APPLICATIONS
= 0.2V
= 0V
Ultrasound and sonar time-gain controls
High performance automatic gain control (AGC) systems
I/Q signal processing
V
GAIN
High speed, dual ADC drivers
–10
100k
1M
10M
FREQUENCY (Hz)
100M
1G
GENERAL DESCRIPTION
The AD8331/AD8332/AD8334 are single-, dual-, and quad-
channel, ultralow noise linear-in-dB, variable gain amplifiers
(VGAs). Optimized for ultrasound systems, they are usable as a
low noise variable gain element at frequencies up to 120 MHz.
Figure 2. Frequency Response vs. Gain
Differential signal paths result in superb second- and third-
order distortion performance and low crosstalk.
The low output-referred noise of the VGA is advantageous in
driving high speed differential ADCs. The gain of the postamp
can be pin selected to 3.5 dB or 15.5 dB to optimize gain range
and output noise for 12-bit or 10-bit converter applications. The
output can be limited to a user-selected clamping level, preventing
input overload to a subsequent ADC. An external resistor adjusts
the clamping level.
Included in each channel are an ultralow noise preamp (LNA),
an X-AMP® VGA with 48 dB of gain range, and a selectable gain
postamp with adjustable output limiting. The LNA gain is 19 dB
with a single-ended input and differential outputs. Using a single
resistor, the LNA input impedance can be adjusted to match a
signal source without compromising noise performance.
The 48 dB gain range of the VGA makes these devices suitable
for a variety of applications. Excellent bandwidth uniformity is
maintained across the entire range. The gain control interface
provides precise linear-in-dB scaling of 50 dB/V for control
voltages between 40 mV and 1 V. Factory trim ensures excellent
part-to-part and channel-to-channel gain matching.
The operating temperature range is −40°C to +85°C. The
AD8331 is available in a 20-lead QSOP package, the AD8332 is
available in 28-lead TSSOP and 32-lead LFCSP packages, and
the AD8334 is available in a 64-lead LFCSP package.
Rev. G
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2003–2010 Analog Devices, Inc. All rights reserved.
AD8331/AD8332/AD8334
TABLE OF CONTENTS
Features .............................................................................................. 1
Ultrasound TGC Application ................................................... 34
High Density Quad Layout....................................................... 34
AD8331 Evaluation Board ............................................................ 39
General Description................................................................... 39
User-Supplied Optional Components..................................... 39
Measurement Setup.................................................................... 39
Board Layout............................................................................... 39
AD8331 Evaluation Board Schematics.................................... 40
AD8331 Evaluation Board PCB Layers................................... 42
AD8332 Evaluation Board ............................................................ 43
General Description................................................................... 43
User-Supplied Optional Components..................................... 43
Measurement Setup.................................................................... 43
Board Layout............................................................................... 43
Evaluation Board Schematics ................................................... 44
AD8332 Evaluation Board PCB Layers................................... 46
AD8334 Evaluation Board ............................................................ 47
General Description................................................................... 47
Configuring the Input Impedance........................................... 48
Measurement Setup.................................................................... 48
Board Layout............................................................................... 48
Evaluation Board Schematics ................................................... 49
AD8334 Evaluation Board PCB Layers................................... 51
Outline Dimensions....................................................................... 53
Ordering Guide .......................................................................... 55
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 4
Absolute Maximum Ratings............................................................ 7
ESD Caution.................................................................................. 7
Pin Configurations and Function Descriptions ........................... 8
Typical Performance Characteristics ........................................... 12
Test Circuits..................................................................................... 20
Measurement Considerations................................................... 20
Theory of Operation ...................................................................... 24
Overview...................................................................................... 24
Low Noise Amplifier (LNA) ..................................................... 25
Variable Gain Amplifier ............................................................ 27
Postamplifier ............................................................................... 28
Applications Information .............................................................. 30
LNA—External Components.................................................... 30
Driving ADCs ............................................................................. 32
Overload ...................................................................................... 32
Optional Input Overload Protection ....................................... 32
Layout, Grounding, and Bypassing.......................................... 33
Multiple Input Matching ........................................................... 33
Disabling the LNA...................................................................... 33
REVISION HISTORY
10/10—Rev. F to Rev. G
Deleted AD8331 Bill of Materials Section and Table 11;
Changes to Quiescent Current per Channel Parameter,
Renumbered Sequentially ............................................................. 43
Changes to Figure 104 ................................................................... 43
Changes to Figure 106 ................................................................... 45
Changes to Figure 107 ................................................................... 46
Changes to Figure 113 ................................................................... 47
Changes to Figure 114 and Board Layout Section..................... 48
Deleted AD8332 Bill of Materials Section and Table 13;
Renumbered Sequentially ............................................................. 48
Changes to Figure 115 ................................................................... 49
Changes to Figure 116 ................................................................... 50
Changes to Figure 117 to Figure 120 ........................................... 51
Changes to Figure 121 ................................................................... 52
Deleted AD8334 Bill of Materials Section and Table 15;
Table 1 ................................................................................................ 6
Changes to Pin 1, Table 3................................................................. 8
Changes to Pin 1 and Pin 28, Table 4 and Pin 4 and Pin 5,
Table 5 ................................................................................................ 9
Changes to Figure 6 and Table 6................................................... 10
Changes to Figure 33...................................................................... 16
Changes to Figure 64...................................................................... 22
Changes to Figure 70...................................................................... 24
Changes to Low Noise Amplifier (LNA) Section and
Figure 74 .......................................................................................... 25
Changes to Figure 94...................................................................... 38
Changes to General Descriptions Section, Figure 95 Caption,
Table 10, and Board Layout Section............................................. 39
Changes to Figure 96...................................................................... 40
Changes to Figure 97...................................................................... 41
Changes to Figure 98 and Figure 103........................................... 42
Renumbered Sequentially ............................................................. 54
Rev. G | Page 2 of 56
AD8331/AD8332/AD8334
4/08—Rev. E to Rev. F
Changes to Figure 23 and Figure 24 .............................................14
Changes to Figure 25 through Figure 27......................................15
Changes to Figure 31 and Figure 33 through Figure 36 ............16
Changes to Figure 37 through Figure 42......................................17
Changes to Figure 43, Figure 44, and Figure 48..........................18
Changes to Figure 49, Figure 50, and Figure 54..........................19
Inserted Figure 56 and Figure 57 ..................................................20
Inserted Figure 58, Figure 59, and Figure 61...............................21
Changes to Figure 60 ......................................................................21
Inserted Figure 63 and Figure 65 ..................................................22
Changes to Figure 64 ......................................................................22
Moved Measurement Considerations Section ............................23
Inserted Figure 67 and Figure 68 ..................................................23
Inserted Figure 70 and Figure 71 ..................................................24
Change to Figure 72........................................................................24
Changes to Figure 73 and Low Noise Amplifier Section...........25
Changes to Postamplifier Section .................................................28
Changes to Figure 80 ......................................................................29
Changes to LNA—External Components Section......................30
Changes to Logic Inputs—ENB, MODE, and HILO Section ...31
Changes to Output Decoupling and Overload Sections............32
Changes to Layout, Grounding, and Bypassing Section............33
Changes to Ultrasound TGC Application Section .....................34
Added High Density Quad Layout Section.................................34
Inserted Figure 94 ...........................................................................38
Updated Outline Dimensions........................................................39
Changes to Ordering Guide...........................................................40
Changed RFB to RIZ Throughout .....................................................4
Changes to Figure 1...........................................................................1
Changes to Table 1, LNA and VGA Characteristics, Output
Offset Voltage, Conditions...............................................................4
Changes to Quiescent Current per Channel and Power Down
Current Parameters...........................................................................6
Changes to Table 2 ............................................................................7
Changes to Table 3, Pin 1 Description ...........................................8
Changes to Table 4, Pin 1 and Pin 28 Descriptions......................9
Changes to Table 5, Pin 4 and Pin 5 Descriptions ........................9
Changes to Table 6, Pin 2, Pin 15, and Pin 20 Descriptions......10
Changes to Table 6, Pin 61 Description .......................................11
Changes to Typical Performance Characteristics Section,
Default Conditions..........................................................................12
Changes to Figure 25 ......................................................................15
Changes to Figure 39 ......................................................................17
Changes to Figure 55 Through Figure 68 ...................................20
Changes to Theory of Operation, Overview Section .................24
Changes to Low Noise Amplifier Section and Figure 74...........25
Changes to Active Impedance Matching Section, Figure 75,
and Figure 77 ...................................................................................26
Changes to Figure 78 ......................................................................27
Changes to Equation 6, Table 7, Figure 81, and Figure 82.........30
Changes to Figure 83 ......................................................................31
Changes to Figure 88 ......................................................................32
Switched Figure 89 and Figure 90.................................................33
Changes to Figure 89 ......................................................................33
Changes to Ultrasound TGC Application Section......................34
Incorporated AD8331-EVAL Data Sheet, Rev. A .......................39
Changes to User-Supplied Optional Components Section
and Measurement Setup Section...................................................39
Changes to Figure 95 ......................................................................39
Changes to Figure 97 ......................................................................41
Added Figure 98 ..............................................................................42
Incorporated AD8332-EVALZ Data Sheet, Rev. D.....................44
Incorporated AD8334-EVAL Data Sheet, Rev. 0 ........................49
Updated Outline Dimensions........................................................55
Changes to Ordering Guide...........................................................57
3/06—Rev. C to Rev. D
Updated Format ................................................................. Universal
Changes to Features and General Description..............................1
Changes to Table 1 ............................................................................3
Changes to Table 2 ............................................................................6
Changes to Ordering Guide...........................................................34
11/03—Rev. B to Rev. C
Addition of New Part......................................................... Universal
Changes to Figures............................................................. Universal
Updated Outline Dimensions........................................................32
5/03—Rev. A to Rev. B
Edits to Ordering Guide.................................................................32
Edits to Ultrasound TGC Application Section ...........................25
Added Figure 71, Figure 72, and Figure 73..................................26
Updated Outline Dimensions........................................................31
4/06—Rev. D to Rev. E
Added AD8334................................................................... Universal
Changes to Figure 1 and Figure 2....................................................1
Changes to Table 1 ............................................................................4
Changes to Table 2 ............................................................................7
Changes to Figure 7 through Figure 9 and Figure 12.................12
Changes to Figure 13, Figure 14, Figure 16, and Figure 18 .......13
2/03—Rev. 0 to Rev. A
Edits to Ordering Guide.................................................................32
Rev. G | Page 3 of 56
AD8331/AD8332/AD8334
SPECIFICATIONS
TA = 25°C, VS = 5 V, RL = 500 Ω, RS = RIN = 50 Ω, RIZ = 280 Ω, CSH = 22 pF, f = 10 MHz, RCLMP = ∞, CL = 1 pF, VCM pin floating,
−4.5 dB to +43.5 dB gain (HILO = LO), and differential output voltage, unless otherwise specified.
Table 1.
Parameter
Test Conditions/Comments
Min
Typ
Max Unit1
LNA CHARACTERISTICS
Gain
Single-ended input to differential output
Input to output (single-ended)
AC-coupled
19
13
2ꢀ5
dB
dB
mV
Ω
Input Voltage Range
Input Resistance
RIZ = 280 Ω
50
RIZ = 412 Ω
ꢀ5
Ω
RIZ = 562 Ω
RIZ = 1.13 kΩ
RIZ = ∞
100
200
6
13
5
130
650
0.ꢀ4
2.5
Ω
Ω
kΩ
pF
Ω
MHz
V/μs
Input Capacitance
Output Impedance
−3 dB Small Signal Bandwidth
Slew Rate
Input Voltage Noise
Input Current Noise
Noise Figure
Single-ended, either output
VOUT = 0.2 V p-p
RS = 0 Ω, HI or LO gain, RIZ = ∞, f = 5 MHz
RIZ = ∞, HI or LO gain, f = 5 MHz
f = 10 MHz, LOP output
nV/√Hz
pA/√Hz
Active Termination Match
Unterminated
RS = RIN = 50 Ω
RS = 50 Ω, RIZ = ∞
3.ꢀ
2.5
dB
dB
Harmonic Distortion at LOP1 or LOP2
HD2
HD3
Output Short-Circuit Current
LNA AND VGA CHARACTERISTICS
−3 dB Small Signal Bandwidth
AD8331
AD8332, AD8334
−3 dB Large Signal Bandwidth
AD8331
VOUT = 0.5 V p-p, single-ended, f = 10 MHz
−56
−ꢀ0
165
dBc
dBc
mA
Pin LON, Pin LOP
VOUT = 0.2 V p-p
120
100
MHz
MHz
VOUT = 2 V p-p
110
90
MHz
MHz
AD8332, AD8334
Slew Rate
AD8331
LO gain
300
V/μs
HI gain
LO gain
1200
2ꢀ5
V/μs
V/μs
AD8332, AD8334
HI gain
1100
0.82
V/μs
nV/√Hz
Input Voltage Noise
Noise Figure
RS = 0 Ω, HI or LO gain, RIZ = ∞, f = 5 MHz
VGAIN = 1.0 V
Active Termination Match
RS = RIN = 50 Ω, f = 10 MHz, measured
RS = RIN = 200 Ω, f = 5 MHz, simulated
RS = 50 Ω, RIZ = ∞, f = 10 MHz, measured
RS = 200 Ω, RIZ = ∞, f = 5 MHz, simulated
4.15
2.0
2.5
dB
dB
dB
dB
Unterminated
1.0
Output-Referred Noise
AD8331
VGAIN = 0.5 V, LO gain
VGAIN = 0.5 V, HI gain
VGAIN = 0.5 V, LO gain
VGAIN = 0.5 V, HI gain
DC to 1 MHz
48
1ꢀ8
40
150
1
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
Ω
AD8332, AD8334
Output Impedance, Postamplifier
Rev. G | Page 4 of 56
AD8331/AD8332/AD8334
Parameter
Test Conditions/Comments
Min
Typ
Max Unit1
Output Signal Range, Postamplifier
Differential
RL ≥ 500 Ω, unclamped, either pin
VCM 1.125
4.5
V
V p-p
Output Offset Voltage
AD8331
Differential, VGAIN = 0.5 V
Common mode
Differential, 0.05 V ≤ VGAIN ≤ 1.0 V
Common mode
−50
−125 −25
−20
−125 –25
45
5
+50
+100 mV
+20 mV
+100 mV
mA
mV
AD8332, AD8334
5
Output Short-Circuit Current
Harmonic Distortion
AD8331
VGAIN = 0.5 V, VOUT = 1 V p-p, HI gain
f = 1 MHz
HD2
−88
−85
−68
−65
dBc
dBc
dBc
dBc
HD3
HD2
HD3
f = 10 MHz
AD8332, AD8334
HD2
HD3
HD2
HD3
f = 1 MHz
−82
−85
−62
−66
1
dBc
dBc
dBc
dBc
dBm
f = 10 MHz
Input 1 dB Compression Point
Two-Tone Intermodulation Distortion (IMD3)
AD8331
VGAIN = 0.25 V, VOUT = 1 V p-p, f = 1 MHz to 10 MHz
VGAIN = 0.ꢀ2 V, VOUT = 1 V p-p, f = 1 MHz
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 10 MHz
VGAIN = 0.ꢀ2 V, VOUT = 1 V p-p, f = 1 MHz
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 10 MHz
−80
−ꢀ2
−ꢀ8
−ꢀ4
dBc
dBc
dBc
dBc
AD8332, AD8334
Output Third-Order Intercept
AD8331
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 1 MHz
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 10 MHz
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 1 MHz
VGAIN = 0.5 V, VOUT = 1 V p-p, f = 10 MHz
38
33
35
32
−98
5
dBm
dBm
dBm
dBm
dB
AD8332, AD8334
Channel-to-Channel Crosstalk (AD8332, AD8334) VGAIN = 0.5 V, VOUT = 1 V p-p, f = 1 MHz
Overload Recovery
Group Delay Variation
ACCURACY
VGAIN = 1.0 V, VIN = 50 mV p-p/1 V p-p, f = 10 MHz
5 MHz < f < 50 MHz, full gain range
ns
ns
2
Absolute Gain Error2
0.05 V < VGAIN < 0.10 V
0.10 V < VGAIN < 0.95 V
0.95 V < VGAIN < 1.0 V
0.1 V < VGAIN < 0.95 V
0.1 V < VGAIN < 0.95 V
−1
−1
−2
+0.5
0.3
−1
0.2
0.1
+2
+1
+1
dB
dB
dB
dB
dB
Gain Law Conformance3
Channel-to-Channel Gain Matching
GAIN CONTROL INTERFACE (Pin GAIN)
Gain Scaling Factor
0.10 V < VGAIN < 0.95 V
LO gain
HI gain
48.5
50
51.5
dB/V
dB
dB
V
MΩ
ns
Gain Range
−4.5 to +43.5
ꢀ.5 to 55.5
0 to 1.0
10
Input Voltage (VGAIN) Range
Input Impedance
Response Time
48 dB gain change to 90% full scale
500
COMMON-MODE INTERFACE (PIN VCMx)
Input Resistance4
Output CM Offset Voltage
Voltage Range
Current limited to 1 mA
VCM = 2.5 V
VOUT = 2.0 V p-p
30
Ω
−125 −25
1.5 to 3.5
+100 mV
V
Rev. G | Page 5 of 56
AD8331/AD8332/AD8334
Parameter
Test Conditions/Comments
Min
Typ
Max Unit1
ENABLE INTERFACE
(PIN ENB, PIN ENBL, PIN ENBV)
Logic Level to Enable Power
Logic Level to Disable Power
Input Resistance
2.25
0
5
1.0
V
V
Pin ENB
Pin ENBL
Pin ENBV
VINH = 30 mV p-p
VINH = 150 mV p-p
25
40
ꢀ0
300
4
kΩ
kΩ
kΩ
μs
ms
Power-Up Response Time
HILO GAIN RANGE INTERFACE (PIN HILO)
Logic Level to Select HI Gain Range
Logic Level to Select LO Gain Range
Input Resistance
2.25
0
5
1.0
V
V
kΩ
50
OUTPUT CLAMP INTERFACE (PIN RCLMP; HI OR
LO GAIN)
Accuracy
HILO = LO
HILO = HI
RCLMP = 2.ꢀ4 kΩ, VOUT = 1 V p-p (clamped)
RCLMP = 2.21 kΩ, VOUT = 1 V p-p (clamped)
50
ꢀ5
mV
mV
MODE INTERFACE (PIN MODE)
Logic Level for Positive Gain Slope
Logic Level for Negative Gain Slope
Input Resistance
0
2.25
1.0
5
V
V
kΩ
200
5.0
POWER SUPPLY (PIN VPS1, PIN VPS2,
PIN VPSV, PIN VPSL, PIN VPOS)
Supply Voltage
Quiescent Current per Channel
AD8331
4.5
5.5
V
20
22
24
25
2ꢀ.5
29.5
mA
mA
AD8332
AD8334
32
34
Power Dissipation per Channel
AD8331
AD8332, AD8334
Power-Down Current
AD8331
No signal
125
138
mW
mW
VGA and LNA disabled
50
50
50
240
300
600
400
600
μA
μA
1200 μA
AD8332
AD8334
LNA Current
AD8331 (ENBL)
AD8332, AD8334 (ENBL)
VGA Current
Each channel
Each channel
ꢀ.5
ꢀ.5
11
12
15
15
mA
mA
AD8331 (ENBV)
AD8332, AD8334 (ENBV)
PSRR
ꢀ.5
ꢀ.5
14
1ꢀ
−68
20
20
mA
mA
dB
VGAIN = 0 V, f = 100 kHz
1 All dBm values are referred to 50 Ω.
2 The absolute gain refers to the theoretical gain expression in Equation 1.
3 Best-fit to linear-in-dB curve.
4 The current is limited to 1 mA typical.
Rev. G | Page 6 of 56
AD8331/AD8332/AD8334
ABSOLUTE MAXIMUM RATINGS
Table 2.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Rating
Voltage
Supply Voltage (VPSn, VPSV, VPSL, VPOS)
Input Voltage (INHx)
ENB, ENBL, ENBV, HILO Voltage
GAIN Voltage
5.5 V
VS + 200 mV
VS + 200 mV
2.5 V
Power Dissipation
ESD CAUTION
RU Package1 (AD8332)
CP-32 Package (AD8332)
RQ Package1 (AD8331)
CP-64 Package (AD8334)
Temperature
0.96 W
1.9ꢀ W
0.ꢀ8 W
0.91 W
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering 60 sec)
θJA
−40°C to +85°C
−65°C to +150°C
300°C
RU Package1 (AD8332)
CP-32 Package22 (AD8332)
RQ Package1 (AD8331)
CP-64 Package3 (AD8334)
68°C/W
33°C/W
83°C/W
24.2°C/W
1 4-layer JEDEC board (2S2P).
2 Exposed pad soldered to board, nine thermal vias in pad—JEDEC, 4-layer
board J-STD-51-9.
3 Exposed pad soldered to board, 25 thermal vias in pad—JEDEC, 4-layer
board J-STD-51-9.
Rev. G | Page ꢀ of 56
AD8331/AD8332/AD8334
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
20 COMM
LMD
INH
PIN 1
INDICATOR
19
18
ENBL
ENBV
3
VPSL
LON
LOP
4
17 COMM
AD8331
TOP VIEW
(Not to Scale)
5
16
15
14
VOL
6
VOH
VPOS
COML
VIP
7
8
13 HILO
VIN
9
12
11
RCLMP
VCM
MODE
GAIN
10
Figure 3. 20-Lead QSOP Pin Configuration (AD8331)
Table 3. 20-Lead QSOP Pin Function Description (AD8331)
Pin No.
Mnemonic
Description
1
2
LMD
INH
LNA Midsupply Bypass Pin; Connect a Capacitor for Midsupply HF Bypass
LNA Input
3
4
5
6
ꢀ
8
9
10
11
12
13
14
15
16
1ꢀ
18
19
20
VPSL
LON
LOP
COML
VIP
VIN
MODE
GAIN
VCM
RCLMP
HILO
VPOS
VOH
VOL
LNA 5 V Supply
LNA Inverting Output
LNA Noninverting Output
LNA Ground
VGA Noninverting Input
VGA Inverting Input
Gain Slope Logic Input
Gain Control Voltage
Common-Mode Voltage
Output Clamping Level
Gain Range Select (HI or LO)
VGA 5 V Supply
Noninverting VGA Output
Inverting VGA Output
VGA Ground
VGA Enable
LNA Enable
COMM
ENBV
ENBL
COMM
VGA Ground
Rev. G | Page 8 of 56
AD8331/AD8332/AD8334
1
2
28
27
26
25
24
23
LMD2
INH2
LMD1
INH1
PIN 1
INDICATOR
32
31
30
29
28
27
26
25
3
VPS2
LON2
LOP2
COM2
VIP2
VPS1
LON1
LOP1
COM1
VIP1
LON1
VPS1
INH1
1
2
3
4
5
6
7
8
COMM
VOH1
VOL1
VPSV
NC
24
23
22
21
20
19
18
17
4
PIN 1
INDICATOR
5
AD8332
TOP VIEW
6
7
(Not to Scale) 22
LMD1
LMD2
INH2
AD8332
TOP VIEW
(Not to Scale)
8
21
20
19
VIN2
VIN1
9
VCM2
GAIN
RCLMP
VOH2
VOL2
COMM
VCM1
HILO
VOL2
VOH2
COMM
10
11
12
13
14
18 ENB
17 VOH1
16
VPS2
LON2
VOL1
15 VPSV
9
10
11
12
13
14
15
16
NC = NO CONNECT
Figure 4. 28-Lead TSSOP Pin Configuration (AD8332)
Figure 5. 32-Lead LFCSP Pin Configuration (AD8332)
Table 4. 28-Lead TSSOP Pin Function Description (AD8332)
Table 5. 32-Lead LFCSP Pin Function Description (AD8332)
Pin No.
Pin No.
Mnemonic Description
Mnemonic Description
1
LMD2
CH 2 LNA Midsupply Pin; Connect a
Capacitor for Midsupply HF Bypass
CH2 LNA Input
CH2 Supply LNA 5 V
1
2
3
4
LON1
VPS1
INH1
LMD1
CH1 LNA Inverting Output
CH1 LNA Supply 5 V
CH1 LNA Input
CH 1 LNA Midsupply Pin; Connect a
Capacitor for Midsupply HF Bypass
CH 2 LNA Midsupply Pin; Connect a
Capacitor for Midsupply HF Bypass
2
3
4
5
6
ꢀ
8
9
10
11
12
13
14
15
16
1ꢀ
18
19
20
21
22
23
24
25
26
2ꢀ
28
INH2
VPS2
LON2
LOP2
COM2
VIP2
CH2 LNA Inverting Output
CH2 LNA Noninverting Output
CH2 LNA Ground
CH2 VGA Noninverting Input
CH2 VGA Inverting Input
CH2 Common-Mode Voltage
Gain Control Voltage
Output Clamping Resistor
CH2 Noninverting VGA Output
CH2 Inverting VGA Output
VGA Ground (Both Channels)
VGA Supply 5 V (Both Channels)
CH1 Inverting VGA Output
CH1 Noninverting VGA Output
Enable—VGA/LNA
VGA Gain Range Select (HI or LO)
CH1 Common-Mode Voltage
CH1 VGA Inverting Input
CH1 VGA Noninverting Input
CH1 LNA Ground
5
LMD2
6
ꢀ
8
9
INH2
VPS2
LON2
LOP2
COM2
VIP2
CH2 LNA Input
CH2 LNA Supply 5 V
VIN2
CH2 LNA Inverting Output
CH2 LNA Noninverting Output
CH2 LNA Ground
CH2 VGA Noninverting Input
CH2 VGA Inverting Input
CH2 Common-Mode Voltage
Gain Slope Logic Input
Gain Control Voltage
Output Clamping Level Input
VGA Ground
CH2 Noninverting VGA Output
CH2 Inverting VGA Output
No Connect
VCM2
GAIN
RCLMP
VOH2
VOL2
COMM
VPSV
VOL1
VOH1
ENB
10
11
12
13
14
15
16
1ꢀ
18
19
20
21
22
23
24
25
26
2ꢀ
28
29
30
31
32
VIN2
VCM2
MODE
GAIN
RCLMP
COMM
VOH2
VOL2
NC
VPSV
VOL1
VOH1
COMM
ENBV
ENBL
HILO
HILO
VCM1
VIN1
VGA Supply 5 V
VIP1
CH1 Inverting VGA Output
CH1 Noninverting VGA Output
VGA Ground
VGA Enable
LNA Enable
VGA Gain Range Select (HI or LO)
CH1 Common-Mode Voltage
CH1 VGA Inverting Input
CH1 VGA Noninverting Input
CH1 LNA Ground
COM1
LOP1
LON1
VPS1
INH1
LMD1
CH1 LNA Noninverting Output
CH1 LNA Inverting Output
CH1 LNA Supply 5 V
CH1 LNA Input
CH 1 LNA Midsupply Pin; Connect a
Capacitor for Midsupply HF Bypass
VCM1
VIN1
VIP1
COM1
LOP1
CH1 LNA Noninverting Output
Rev. G | Page 9 of 56
AD8331/AD8332/AD8334
PIN 1
INDICATOR
INH2
LMD2
NC
LON2
LOP2
VIP2
VIN2
VPS2
VPS3
VIN3 10
VIP3 11
LOP3 12
LON3 13
NC 14
1
2
3
4
5
6
7
8
9
48 COM12
47 VOH1
46 VOL1
45 VPS12
44 VOL2
43 VOH2
42 COM12
41 MODE
40 NC
39 COM34
38 VOH3
37 VOL3
36 VPS34
35 VOL4
34 VOH4
33 COM34
AD8334
TOP VIEW
(Not to Scale)
LMD3 15
INH3 16
NOTES
1. THE EXPOSED PADDLE MUST BE
SOLDERED TO THE PCB GROUND
TO ENSURE PROPER HEAT
DISSIPATION, NOISE, AND
MECHANICAL STRENGTH BENEFITS.
2. NC = NO CONNECT.
Figure 6. 64-Lead LFCSP Pin Configuration (AD8334)
Table 6. 64-Lead LFCSP Pin Function Description (AD8334)
Pin No.
Mnemonic
INH2
LMD2
NC
Description
1
2
3
CH2 LNA Input.
CH 2 LNA Midsupply Pin; Connect a Capacitor for Midsupply HF Bypass.
Not Connected.
4
5
6
LON2
LOP2
VIP2
CH2 LNA Feedback Output (for RIZ).
CH2 LNA Output.
CH2 VGA Positive Input.
ꢀ
8
9
VIN2
VPS2
VPS3
VIN3
VIP3
LOP3
LON3
NC
LMD3
INH3
COM3
COM4
INH4
LMD4
NC
LON4
LOP4
VIP4
CH2 VGA Negative Input.
CH2 LNA Supply 5 V.
CH3 LNA Supply 5 V.
CH3 VGA Negative Input.
CH3 VGA Positive Input.
CH3 LNA Positive Output.
CH3 LNA Feedback Output (for RIZ).
Not Connected.
CH 3 LNA Midsupply Pin; Connect a Capacitor for Midsupply HF Bypass.
CH3 LNA Input.
CH3 LNA Ground.
CH4 LNA Ground.
CH4 LNA Input.
10
11
12
13
14
15
16
1ꢀ
18
19
20
21
22
23
24
25
26
CH 4 LNA Midsupply Pin; Connect a Capacitor for Midsupply HF Bypass.
Not Connected.
CH4 LNA Feedback Output (for RIZ).
CH4 LNA Positive Output.
CH4 VGA Positive Input.
VIN4
VPS4
CH4 VGA Negative Input.
CH4 LNA Supply 5 V.
Rev. G | Page 10 of 56
AD8331/AD8332/AD8334
Pin No.
2ꢀ
28
29
30
31
32
33
34
35
36
3ꢀ
38
39
40
41
42
43
44
45
46
4ꢀ
48
49
50
51
52
53
54
55
56
5ꢀ
58
59
60
61
62
63
64
Mnemonic
GAIN34
CLMP34
HILO
VCM4
VCM3
NC
COM34
VOH4
VOL4
VPS34
VOL3
VOH3
COM34
NC
MODE
COM12
VOH2
VOL2
Description
Gain Control Voltage for CH3 and CH4.
Output Clamping Level Input for CH3 and CH4.
Gain Select for Postamp 0 dB or 12 dB.
CH4 Common-Mode Voltage—AC Bypass.
CH3 Common-Mode Voltage—AC Bypass.
No Connect.
VGA Ground CH3 and CH4.
CH4 Positive VGA Output.
CH4 Negative VGA Output.
VGA Supply 5 V CH3 and CH4.
CH3 Negative VGA Output.
CH3 Positive VGA Output.
VGA Ground CH3 and CH4.
No Connect.
Gain Control Slope, Logic Input, 0 = Positive.
VGA Ground CH1 and CH2.
CH2 Positive VGA Output.
CH2 Negative VGA Output.
CH2 VGA Supply 5 V CH1 and CH2.
CH1 Negative VGA Output.
CH1 Positive VGA Output.
VPS12
VOL1
VOH1
COM12
VCM2
VCM1
EN34
VGA Ground CH1 and CH2.
CH2 Common-Mode Voltage—AC Bypass.
CH1 Common-Mode Voltage—AC Bypass.
Shared LNA/VGA Enable CH3 and CH4.
Shared LNA/VGA Enable CH1 and CH2.
Output Clamping Level Input CH1 and CH2.
Gain Control Voltage CH1 and CH2.
CH1 LNA Supply 5 V.
CH1 VGA Negative Input.
CH1 VGA Positive Input.
CH1 LNA Positive Output.
CH1 LNA Feedback Output (for RIZ).
Not Connected.
EN12
CLMP12
GAIN12
VPS1
VIN1
VIP1
LOP1
LON1
NC
LMD1
INH1
COM1
COM2
EPAD
CH 1 LNA Midsupply Pin; Connect a Capacitor for Midsupply HF Bypass.
CH1 LNA Input.
CH1 LNA Ground.
CH2 LNA Ground.
The exposed paddle must be soldered to the PCB ground to ensure proper heat dissipation,
noise, and mechanical strength benefits.
Rev. G | Page 11 of 56
AD8331/AD8332/AD8334
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, VS = 5 V, RL = 500 Ω, RS = RIN = 50 Ω, RIZ = 280 Ω, CSH = 22 pF, f = 10 MHz, RCLMP = ∞, CL = 1 pF, VCM pin floating,
−4.5 dB to +43.5 dB gain (HILO = LO), and differential output voltage, unless otherwise specified.
60
50
40
30
20
10
0
50
40
30
20
10
0
SAMPLE SIZE = 80 UNITS
= 0.5V
V
GAIN
HILO = HI
HILO = LO
ASCENDING GAIN MODE
DESCENDING GAIN MODE
(WHERE AVAILABLE)
–10
0
0.2
0.4
0.6
(V)
0.8
1.0 1.1
–0.5 –0.4 –0.3 –0.2 –0.1
0
0.1
0.2
0.3
0.4
0.5
V
GAIN ERROR (dB)
GAIN
Figure 10. Gain Error Histogram
Figure 7. Gain vs. VGAIN and MODE (MODE Available on RU Package)
25
20
15
10
5
2.0
1.5
1.0
SAMPLE SIZE = 50 UNITS
V = 0.2V
GAIN
–40°C
+25°C
0.5
0
0
25
V
= 0.7V
GAIN
20
15
10
5
–0.5
+85°C
–1.0
–1.5
–2.0
0
0
0.2
0.4
0.6
(V)
0.8
1.0 1.1
V
GAIN
CHANNEL TO CHANNEL GAIN MATCH (dB)
Figure 8. Absolute Gain Error vs. VGAIN at Three Temperatures
Figure 11. Gain Match Histogram for VGAIN = 0.2 V and 0.7 V
2.0
50
V
V
= 1V
GAIN
GAIN
1.5
1.0
40
30
= 0.8V
V
V
V
= 0.6V
= 0.4V
= 0.2V
GAIN
GAIN
GAIN
0.5
20
1MHz
0
10
10MHz
30MHz
–0.5
0
–1.0
50MHz
V
= 0V
GAIN
–10
–1.5
70MHz
–2.0
–20
100k
1M
10M
FREQUENCY (Hz)
100M
500M
0
0.2
0.4
0.6
(V)
0.8
1.0 1.1
V
GAIN
Figure 12. Frequency Response for Various Values of VGAIN
Figure 9. Absolute Gain Error vs. VGAIN at Various Frequencies
Rev. G | Page 12 of 56
AD8331/AD8332/AD8334
60
50
40
30
20
10
0
0
–20
V
V
= 1V
GAIN
GAIN
V
= 1V p-p
OUT
= 0.8V
V
= 1.0V
= 0.7V
= 0.4V
GAIN
GAIN
GAIN
V
V
V
= 0.6V
= 0.4V
= 0.2V
AD8332
AD8334
GAIN
GAIN
GAIN
V
–40
V
–60
–80
V
= 0V
GAIN
–100
–10
100k
–120
100k
1M
10M
FREQUENCY (Hz)
100M
500M
1M
10M
FREQUENCY (Hz)
100M
Figure 13. Frequency Response for Various Values of VGAIN, HILO = HI
Figure 16. Channel-to-Channel Crosstalk vs.
Frequency for Various Values of VGAIN
30
50
45
40
35
30
25
20
15
10
5
V
= 0.5V
GAIN
R
= R = 75Ω
S
IN
R
= R = 50Ω
S
IN
20
10
0.1µF
COUPLING
R
= R = 100Ω
S
IN
R
= R = 200Ω
S
IN
1µF
COUPLING
0
R
= R = 500Ω
S
IN
–10
–20
–30
R
= R = 1kΩ
S
IN
0
100k
100k
1M
10M
FREQUENCY (Hz)
100M
500M
1M
10M
FREQUENCY (Hz)
100M
Figure 14. Frequency Response for Various Matched Source Impedances
Figure 17. Group Delay vs. Frequency for Two Values of AC Coupling
20
30
T = +85°C
T = +25°C
T = –40°C
HI GAIN
V
R
= 0.5V
= ∞
GAIN
IZ
10
0
20
10
–10
–20
20
0
LO GAIN
10
0
–10
–20
–30
T = +85°C
T = +25°C
T = –40°C
–10
–20
100k
1M
10M
100M
500M
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
(V)
FREQUENCY (Hz)
V
GAIN
Figure 18. Representative Differential Output Offset Voltage vs.
VGAIN at Three Temperatures
Figure 15. Frequency Response, Unterminated LNA, RS = 50 Ω
Rev. G | Page 13 of 56
AD8331/AD8332/AD8334
50j
100j
25j
35
SAMPLE SIZE = 100
R
R
= 50Ω,
= 270Ω
IN
IZ
0.2V < V
< 0.7V
GAIN
30
25
20
15
10
5
R
R
= 6kΩ,
f
= 100kHz
IN
=
∞
IZ
0Ω
17Ω
R
R
= 75Ω,
= 412Ω
IN
IZ
R
R
= 100Ω,
= 549Ω
IN
IZ
R
R
= 200Ω,
= 1.1kΩ
IN
IZ
0
49.6 49.7 49.8 49.9 50.0 50.1 50.2 50.3 50.4 50.5
GAIN SCALING FACTOR
–25j
–100j
–50j
Figure 19. Gain Scaling Factor Histogram
Figure 22. Smith Chart, S11 vs. Frequency,
0.1 MHz to 200 MHz for Various Values of RIZ
100
10
1
20
15
10
5
SINGLE ENDED, PIN VOH OR PIN VOL
V
= 10mV p-p
R
= 50Ω
IN
IN
R
= ∞
L
R
= 100Ω
IN
R
= 200Ω
IN
R
= 500Ω
IN
0
R
= 1kΩ
IN
–5
–10
–15
R
= 75Ω
IN
0.1
100k
1M
10M
FREQUENCY (Hz)
100M
100k
1M
10M
FREQUENCY (Hz)
100M
500M
Figure 20. Output Impedance vs. Frequency
Figure 23. LNA Frequency Response, Single-Ended, for Various Values of RIN
20
15
10k
R
= ∞
IZ
10
5
1k
100
10
0
–5
–10
–15
RIZ = ∞, CSH = 0pF
RIZ = 6.65kΩ, CSH = 0pF
RIZ = 3.01kΩ, CSH = 0pF
RIZ = 1.1kΩ, CSH = 1.2pF
RIZ = 549Ω, CSH = 8.2pF
RIZ = 412Ω, CSH = 12pF
RIZ = 270Ω, CSH = 22pF
100k
1M
10M
100M
100k
1M
10M
100M
500M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 24. Frequency Response for Unterminated LNA, Single-Ended
Figure 21. LNA Input Impedance vs.
Frequency for Various Values of RIZ and CSH
Rev. G | Page 14 of 56
AD8331/AD8332/AD8334
500
400
300
200
100
0
1.00
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
R
V
= 0, R = ∞,
IZ
S
= 1V, f = 10MHz
f
= 10MHz
GAIN
AD8332
AD8334
HI GAIN
LO GAIN
AD8331
0
0.2
0.4
0.6
0.8
1.0
–50
–30
–10
10
30
50
70
90
V
(V)
TEMPERATURE (°C)
GAIN
Figure 25. Output-Referred Noise vs. VGAIN
Figure 28. Short-Circuit, Input-Referred Noise vs. Temperature
2.5
2.0
1.5
1.0
0.5
10
f = 5MHz, R = ∞,
IZ
R
= 0, R = ∞, V
= 1V,
S
IZ
GAIN
V
= 1V
HILO = LO OR HI
GAIN
1
R
THERMAL NOISE
ALONE
S
0.1
100k
1M
10M
FREQUENCY (Hz)
100M
1
10
100
1k
SOURCE RESISTANCE (Ω)
Figure 26. Short-Circuit, Input-Referred Noise vs. Frequency
Figure 29. Input-Referred Noise vs. RS
100
7
R
= 0, R = ∞,
IZ
S
INCLUDES NOISE OF VGA
HILO = LO OR HI, f = 10MHz
6
5
4
3
2
1
0
R
= 50Ω
10
IN
R
= 75Ω
IN
R
= 100Ω
IN
1
R
= 200Ω
IN
R
= ∞
IZ
SIMULATED RESULTS
100
0.1
0
0.2
0.4
0.6
0.8
1.0
50
1k
V
(V)
SOURCE RESISTANCE (Ω)
GAIN
Figure 30. Noise Figure vs. RS for Various Values of RIN
Figure 27. Short-Circuit, Input-Referred Noise vs. VGAIN
Rev. G | Page 15 of 56
AD8331/AD8332/AD8334
35
–30
–40
–50
–60
–70
–80
–90
PREAMP LIMITED
f = 10MHz, R = 50Ω
S
f = 10MHz,
= 1V p-p
V
OUT
30
25
20
15
10
HILO = LO, HD2
HILO = HI, HD2
HILO = HI, HD3
HILO = LO, HD3
HILO = LO, R = 50Ω
IN
HILO = LO, R = ∞
IZ
5
0
HILO = HI, R = 50Ω
IN
HILO = HI, R = ∞
Iz
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
(V)
0
0
0
200 400 600 800 1000 1200 1400 1600 1800 2000
(Ω)
V
R
LOAD
GAIN
Figure 31. Noise Figure vs. VGAIN
Figure 34. Harmonic Distortion vs. RLOAD
30
25
20
15
10
5
–40
–50
–60
–70
–80
–90
f = 10MHz,
= 1V p-p
HILO = LO, R = 50Ω
IN
V
OUT
HILO = LO, R
FB
= ∞
HILO = HI, R = 50Ω
IN
HILO = HI, R
FB
= ∞
HILO = LO, HD2
HILO = LO, HD3
HILO = HI, HD2
HILO = HI, HD3
f = 10MHz, R = 50Ω
S
0
10
15
20
25
30
35
40
45
50
55
60
10
20
30
(pF)
40
50
GAIN (dB)
C
LOAD
Figure 35. Harmonic Distortion vs. CLOAD
Figure 32. Noise Figure vs. Gain
–20
–40
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
G = 30dB
= 1Vp-p
HILO = HI, HD2
HILO = HI, HD3
HILO = LO, HD2
HILO = LO, HD3
f = 10MHz,
GAIN = 30dB
V
OUT
HILO = LO, HD3
HILO = LO, HD2
–60
HILO = HI, HD2
HILO = HI, HD3
–80
–100
1
2
3
4
1M
10M
100M
V
(V p-p)
FREQUENCY (Hz)
OUT
Figure 36. Harmonic Distortion vs. Differential Output Voltage
Figure 33. Harmonic Distortion vs. Frequency
Rev. G | Page 16 of 56
AD8331/AD8332/AD8334
0
–20
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
V
= 1V p-p COMPOSITE (f1
+
f2)
OUT
G = 30dB
V
= 1V p-p
OUT
INPUT RANGE
LIMITED WHEN
HILO = LO
–40
HILO = LO, HD3
HILO = LO
HILO = LO, HD2
–60
–80
HILO = HI, HD3
–100
–120
HILO = HI, HD2
HILO = HI
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1M
10M
100M
V
(V)
FREQUENCY (Hz)
GAIN
Figure 40. IMD3 vs. Frequency
Figure 37. Harmonic Distortion vs. VGAIN, f = 1 MHz
0
–20
40
35
30
25
20
15
10
5
10MHz HILO = HI
V
= 1V p-p
OUT
1MHz HILO = LO
10MHz HILO = LO
1MHz HILO = HI
HILO = LO, HD2
INPUT RANGE
LIMITED WHEN
HILO = LO
–40
HILO = LO, HD3
–60
–80
HILO = HI, HD3
HILO = HI, HD2
–100
–120
V
= 1V p-p COMPOSITE (f1 + f2)
OUT
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
V
(V)
V
(V)
GAIN
GAIN
Figure 41. Output Third-Order Intercept (IP3) vs. VGAIN
Figure 38. Harmonic Distortion vs. VGAIN, f = 10 MHz
10
0
2mV
100
90
f = 10MHz
HILO = LO
HILO = HI
–10
–20
–30
–40
10
0
50mV
10ns
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
V
(V)
GAIN
Figure 39. IP1dB Compression vs. VGAIN
Figure 42. Small Signal Pulse Response, G = 30 dB,
Top: Input, Bottom: Output Voltage, HILO = HI or LO
Rev. G | Page 1ꢀ of 56
AD8331/AD8332/AD8334
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
20mV
100
90
HILO = HI
HILO = LO
10
0
500mV
10ns
0
5
10
15
20
25
30
(kΩ)
35
40
45
50
R
CLMP
Figure 43. Large Signal Pulse Response, G = 30 dB,
HILO = HI or LO, Top: Input, Bottom: Output Voltage
Figure 46. Clamp Level vs. RCLMP
2
1
4
3
C
C
C
C
= 0pF
L
L
L
L
G = 40dB
G = 30dB
= 10pF
= 22pF
= 47pF
R
= 48.1kΩ
CLMP
R
= 16.5kΩ
CLMP
2
INPUT
1
INPUT
0
0
R
= 7.15kΩ
CLMP
R
= 2.67kΩ
–1
–2
–3
–4
CLMP
–1
INPUT IS NOT TO SCALE
–2
–50 –40 –30 –20 –10
0
10
20
30
40
50
–30 –20 –10
0
10
20
30
40
50
60
70
80
TIME (ns)
TIME (ns)
Figure 44. Large Signal Pulse Response for Various Capacitive Loads,
CL = 0 pF, 10 pF, 20 pF, 50 pF
Figure 47. Clamp Level Pulse Response for Four Values of RCLMP
500mV
200mV
100
90
10
0
200mV
400ns
100ns
Figure 48. LNA Overdrive Recovery, VINH 0.05 V p-p to 1 V p-p Burst,
VGAIN = 0.27 V VGA Output Shown
Figure 45. Pin GAIN Transient Response,
Top: VGAIN, Bottom: Output Voltage
Rev. G | Page 18 of 56
AD8331/AD8332/AD8334
1V
2V
100
90
10
0
100ns
1V
1ms
Figure 52. Enable Response, Large Signal,
Top: VENB, Bottom: VOUT, VINH = 150 mV p-p
Figure 49. VGA Overdrive Recovery, VINH 4 mV p-p to 70 mV p-p Burst,
VGAIN = 1 V VGA Output Shown Attenuated by 24 dB
0
–10
–20
–30
–40
–50
–60
–70
–80
VPS1, V
GAIN
= 0.5V
1V
100
90
VPSV, V
GAIN
= 0.5V
VPS1, V
GAIN
= 0V
10
0
100ns
100k
1M
10M
FREQUENCY (Hz)
100M
Figure 50. VGA Overdrive Recovery, VINH 4 mV p-p to 275 mV p-p Burst,
VGAIN = 1 V VGA Output Shown Attenuated by 24 dB
Figure 53. PSRR vs. Frequency (No Bypass Capacitor)
140
130
120
110
100
90
V
= 0.5V
GAIN
2V
AD8334
80
70
AD8332
60
50
40
200mV
1ms
AD8331
40
30
20
–40
–20
0
20
60
80
100
TEMPERATURE (°C)
Figure 51. Enable Response, Top: VENB, Bottom: VOUT, VINH = 30 mV p-p
Figure 54. Quiescent Supply Current vs. Temperature
Rev. G | Page 19 of 56
AD8331/AD8332/AD8334
TEST CIRCUITS
dividing the output noise by the numerical gain between Point A
and Point B and accounting for the noise floor of the spectrum
analyzer. The gain should be measured at each frequency of
interest and with low signal levels because a 50 Ω load is driven
directly. The generator is removed when noise measurements
are made.
MEASUREMENT CONSIDERATIONS
Figure 55 through Figure 68 show typical measurement
configurations and proper interface values for measurements
with 50 Ω conditions.
Short-circuit input noise measurements are made as shown in
Figure 62. The input-referred noise level is determined by
NETWORK ANALYZER
50Ω
50Ω
OUT
IN
18nF
270Ω
0.1µF
237Ω
FB*
120nH
0.1µF
28Ω
INH
DUT
0.1µF
1:1
22pF
237Ω
28Ω
0.1µF
LMD
*FERRITE BEAD
Figure 55. Test Circuit—Gain and Bandwidth Measurements
NETWORK ANALYZER
50Ω
50Ω
OUT
IN
18nF 10kΩ
0.1µF
237Ω
FB*
120nH
0.1µF
10kΩ
28Ω
INH
DUT
0.1µF
1:1
22pF
237Ω
28Ω
LMD
0.1µF
VGN
*FERRITE BEAD
Figure 56. Test Circuit—Frequency Response for Various Matched Source Impedances
NETWORK ANALYZER
50Ω
50Ω
OUT
IN
0.1µF
237Ω
FB*
120nH
0.1µF
28Ω
INH
DUT
0.1µF
1:1
22pF
237Ω
28Ω
LMD
0.1µF
*FERRITE BEAD
VGN
Figure 57. Test Circuit—Frequency Response for Unterminated LNA, RS = 50 Ω
Rev. G | Page 20 of 56
AD8331/AD8332/AD8334
NETWORK ANALYZER
50Ω
50Ω
OUT
IN
10kΩ
18nF
0.1µF
OR
1µF
0.1µF
0.1µF
OR
237Ω
28Ω
FB*
120nH
1µF
INH
LNA
LMD
VGA
1:1
22pF
237Ω
0.1µF
OR
1µF
0.1µF
0.1µF
28Ω
*FERRITE BEAD
Figure 58. Test Circuit—Group Delay vs. Frequency for Two Values of AC Coupling
18nF
270Ω
NETWORK
ANALYZER
0.1µF
237Ω
FB*
120nH
0.1µF
28Ω
50Ω
INH
OUT
DUT
1:1
50Ω
22pF
LMD 0.1µF
0.1µF
237Ω
28Ω
*FERRITE BEAD
Figure 59. Test Circuit—LNA Input Impedance vs. Frequency in Standard and Smith Chart (S11) Formats
NETWORK ANALYZER
50Ω
50Ω
OUT
IN
0.1µF
0.1µF
0.1µF
237Ω
28Ω
FB*
120nH
0.1µF
INH
1:1
LNA
LMD
VGA
22pF
237Ω
28Ω
0.1µF
0.1µF
0.1µF
*FERRITE BEAD
Figure 60. Test Circuit—Frequency Response for Unterminated LNA, Single-Ended
NETWORK
ANALYZER
18nF
270Ω
0.1µF
237Ω
28Ω
50Ω
IN
1:1
FB*
120nH
0.1µF
INH
DUT
22pF
237Ω
0.1µF
0.1µF
28Ω
LMD
*FERRITE BEAD
Figure 61. Test Circuit—Short-Circuit, Input-Referred Noise
Rev. G | Page 21 of 56
AD8331/AD8332/AD8334
SPECTRUM
ANALYZER
A
B
GAIN
INH
0.1µF
0.1µF
50Ω
IN
FERRITE
BEAD
0.1µF
120nH
49.9Ω
50Ω
DUT
1:1
22pF
1Ω
0.1µF
SIGNAL GENERATOR
TO MEASURE GAIN
DISCONNECT FOR
LMD
NOISE MEASUREMENT
Figure 62. Test Circuit—Noise Figure
SPECTRUM
ANALYZER
18nF
270Ω
AD8332
50Ω
0.1µF
0.1µF
1kΩ
1kΩ
–6dB
1:1
IN
0.1µF
22pF
28Ω
28Ω
INH
–6dB
DUT
LPF
LMD
0.1µF
50Ω
SIGNAL
GENERATOR
Figure 63. Test Circuit—Harmonic Distortion vs. Load Resistance
SPECTRUM
ANALYZER
18nF
270Ω
AD8332
50Ω
IN
0.1µF
237Ω
237Ω
–6dB
1:1
0.1µF
28Ω
28Ω
INH
–6dB
DUT
LPF
22pF
LMD
0.1µF
0.1µF
50Ω
SIGNAL
GENERATOR
Figure 64. Test Circuit—Harmonic Distortion vs. Load Capacitance
SPECTRUM
ANALYZER
–6dB
+22dB
+22dB
18nF
274Ω
INPUT
0.1µF
50Ω
237Ω
COMBINER
–6dB
–6dB
FB*
50Ω
0.1µF
28Ω
120nH
INH
DUT
1:1
–6dB
22pF
237Ω
0.1µF
0.1µF
28Ω
LMD
50Ω
SIGNAL
GENERATORS
*FERRITE BEAD
Figure 65.Test Circuit—IMD3 vs. Frequency
Rev. G | Page 22 of 56
AD8331/AD8332/AD8334
OSCILLOSCOPE
18nF
270Ω
0.1µF
0.1µF
237Ω
28Ω
50Ω
FB*
IN
0.1µF
120nH
INH
DUT
1:1
22pF
237Ω
28Ω
50Ω
LMD
0.1µF
*FERRITE BEAD
Figure 66. Test Circuit—Pulse Response Measurements
OSCILLOSCOPE
18nF
INH
270Ω
0.1µF
CH1 CH2
DIFF
PROBE
FB*
0.1µF
255Ω
255Ω
120nH
DUT
22pF
50Ω
RF
LMD
0.1µF
0.1µF
SIGNAL
GENERATOR
9.5dB
50Ω
TO PIN GAIN
OR PIN ENxx
*FERRITE BEAD
PULSE
GENERATOR
Figure 67. Test Circuit—Gain and Enable Transient Response
NETWORK
ANALYZER
50Ω
50Ω
OUT
IN
TO POWER
PINS
18nF
270Ω
0.1µF
DIFF
PROBE
FB*
PROBE POWER
0.1µF
255Ω
255Ω
120nH
INH
DUT
22pF
50Ω
LMD
RF
0.1µF
SIGNAL
GENERATOR
0.1µF
*FERRITE BEAD
Figure 68. Test Circuit—PSRR vs. Frequency
Rev. G | Page 23 of 56
AD8331/AD8332/AD8334
THEORY OF OPERATION
LON1 LOP1 VIP1 VIN1 EN12
VCM1
OVERVIEW
CLMP12
V
CLAMP
PA1
MID1
The AD8331/AD8332/AD8334 operate in the same way.
Figure 69, Figure 70, and Figure 71 are functional block
diagrams of the three devices
INH1
LNA 1
VOH1
VOL1
–
+
ATTENUATOR
–48dB
21dB
LMD1
LMD2
VCM
BIAS
LON LOP VIP VIN
VCM
HILO
VGA BIAS AND
INTERPOLATOR
GAIN
INT
GAIN12
3.5dB/
HILO
VOL2
LNA 2
INH2
V
15.5dB
PA
MID
+
ATTENUATOR
–48dB
21dB
PA2
–
VOH
VOL
LON2
LOP2
VIP2
+
–
VOH2
ATTENUATOR
–48dB
LNA
–
21dB
INH
+
V
VCM2
VCM3
MID2
VIN2
GAIN UP/
DOWN
LMD
VCM
BIAS
VGA BIAS AND
INTERPOLATOR
MODE
GAIN INT
CLAMP
RCLMP
MODE
V
MID3
VIN3
VIP3
AD8331
VOH3
VOL3
–
+
LOP3
LON3
ATTENUATOR
–48dB
21dB
PA3
ENBL
ENBV
GAIN
Figure 69. AD8331 Functional Block Diagram
VGA BIAS AND
INTERPOLATOR
GAIN
INT
GAIN34
VOL4
INH3
LNA 3
LON1 LOP1 VIP1 VIN1
VCM1
HILO
+
ATTENUATOR
–48dB
LMD3
LMD4
21dB
PA4
VCM
BIAS
–
VOH4
3.5dB/
15.5dB
V
MID
+19dB
AD8334
INH4
CLAMP
LNA 4
CLMP34
VOH1
VOL1
–
INH1
V
MID4
LNA 1
ATTENUATOR
–48dB
21dB
PA1
+
LMD1
LMD2
VGA BIAS AND
LON4 LOP4 VIP4 VIN4
EN34
VCM4
GAIN
INT
LNA
V
MID
GAIN
VOH2
INTERPOLATOR
Figure 71. AD8334 Functional Block Diagram
+
ATTENUATOR
–48dB
21dB
PA2
INH2
LNA 2
Each channel contains an LNA that provides user-adjustable input
impedance termination, a differential X-AMP VGA, and a pro-
grammable gain postamp with adjustable output voltage limiting.
Figure 72 shows a simplified block diagram with external
components.
–
VOL2
AD8332
V
MID
CLAMP
RCLMP
LON2 LOP2 VIP2 VIN2
ENB
VCM2
Figure 70. AD8332 Functional Block Diagram
HILO
LON
VIN
SIGNAL PATH
POSTAMP
3.5dB/15.5dB
PREAMPLIFIER
19dB
VOH
VOL
48dB
ATTENUATOR
21dB
INH
LNA
V
MID
LMD
LOP
VIP
VCM
CLAMP
RCLMP
BIAS AND
INTERPOLATOR
GAIN
INTERFACE
VCM
BIAS
GAIN
Figure 72. Simplified Block Diagram
Rev. G | Page 24 of 56
AD8331/AD8332/AD8334
The linear-in-dB, gain control interface is trimmed for slope and
absolute accuracy. The gain range is +48 dB, extending from
−4.5 dB to +43.5 dB in LO gain and +7.5 dB to +55.5 dB in HI
gain mode. The slope of the gain control interface is 50 dB/V,
and the gain control range is 40 mV to 1 V. Equation 1 and
Equation 2 are the expressions for gain.
LOW NOISE AMPLIFIER (LNA)
Good noise performance in the AD8331/AD8332/AD8334
relies on a proprietary ultralow noise preamplifier at the beginning
of the signal chain, which minimizes the noise contribution in the
following VGA. Active impedance control optimizes noise per-
formance for applications that benefit from input matching.
GAIN (dB) = 50 (dB/V) × VGAIN − 6.5 dB, (HILO = LO)
(1)
A simplified schematic of the LNA is shown in Figure 74. INH
is capacitively coupled to the source. A bias generator establishes dc
input bias voltages of 3.25 V and centers the output common-
mode levels at 2.5 V. A capacitor CLMD (can be the same value as
the input coupling capacitor CINH) is connected from the LMD
pin to ground to decouple the LMD bus. The LMD pin is not
useable for configuring the LNA as a differential input amplifier.
or
GAIN (dB) = 50 (dB/V) × VGAIN + 5.5 dB, (HILO = HI)
(2)
The ideal gain characteristics are shown in Figure 73.
60
50
C
R
IZ
IZ
HILO = HI
40
30
20
10
0
TO
VGA
VPOS
LON
LOP
2.5V
–a
2.5V
I
I
0
0
–a
HILO = LO
C
INH
INH
LMD
3.25V
3.25V
ASCENDING GAIN MODE
Q1
Q2
60Ω
40Ω
80Ω
DESCENDING GAIN MODE
(WHERE AVAILABLE)
C
LMD
C
SH
–10
R
S
0
0.2
0.4
0.6
(V)
0.8
1.0 1.1
VCM
BIAS
I
I
0
0
V
GAIN
Figure 73. Ideal Gain Control Characteristics
The gain slope is negative with MODE pulled high (where
available), as follows:
Figure 74. Simplified LNA Schematic
The LNA supports differential output voltages as high as 5 V p-p,
with positive and negative excursions of 1.25 V, about a
common-mode voltage of 2.5 V. Because the differential gain
magnitude is 9, the maximum input signal before saturation is
275 mV or +550 mV p-p. Overload protection ensures quick
recovery time from large input voltages. Because the inputs are
capacitively coupled to a bias voltage near midsupply, very large
inputs can be handled without interacting with the ESD protection.
GAIN (dB) = −50 (dB/V) × VGAIN + 45.5 dB, (HILO = LO)
(3)
(4)
or
GAIN (dB) = −50 (dB/V) × VGAIN + 57.5 dB, (HILO = HI)
The LNA converts a single-ended input to a differential output
with a voltage gain of 19 dB. If only one output is used, the gain
is 13 dB. The inverting output is used for active input impedance
termination. Each of the LNA outputs is capacitively coupled to
a VGA input. The VGA consists of an attenuator with a range of
48 dB followed by an amplifier with 21 dB of gain for a net gain
range of −27 dB to +21 dB. The X-AMP, gain interpolation
technique results in low gain error and uniform bandwidth, and
differential signal paths minimize distortion.
Low value feedback resistors and the current-driving capability
of the output stage allow the LNA to achieve a low input-referred
voltage noise of 0.74 nV/√Hz. This is achieved with a current
consumption of only 11 mA per channel (55 mW). On-chip
resistor matching results in precise single-ended gains of 4.5×
(9× differential), critical for accurate impedance control. The use
of a fully differential topology and negative feedback minimizes
distortion. Low HD2 is particularly important in second harmonic
ultrasound imaging applications. Differential signaling enables
smaller swings at each output, further reducing third-order
distortion.
The final stage is a logic programmable amplifier with gains of
3.5 dB or 15.5 dB. The LO and HI gain modes are optimized for
12-bit and 10-bit ADC applications, in terms of output-referred
noise and absolute gain range. Output voltage limiting can be
programmed by the user.
Rev. G | Page 25 of 56
AD8331/AD8332/AD8334
UNTERMINATED
Active Impedance Matching
R
The LNA supports active impedance matching through an external
shunt feedback resistor from Pin LON to Pin INH. The input
resistance, RIN, is given in Equation 5, where A is the single-
ended gain of 4.5, and 6 kΩ is the unterminated input impedance.
IN
R
S
V
OUT
+
–
V
IN
RESISTIVE TERMINATION
6 kꢀ × RIZ
33 kꢀ + RIZ
RIZ
1 + A
RIN
=
6 kꢀ =
(5)
R
IN
R
S
V
OUT
+
–
R
S
CIZ is needed in series with RIZ because the dc levels at Pin LON
V
IN
and Pin INH are unequal. Expressions for choosing RIZ in terms
of RIN and for choosing CIZ are found in the Applications
Information section. CSH and the ferrite bead enhance stability
at higher frequencies, where the loop gain is diminished, and
prevent peaking. Frequency response plots of the LNA are shown
in Figure 23 and Figure 24. The bandwidth is approximately
130 MHz for matched input impedances of 50 Ω to 200 Ω and
declines at higher source impedances. The unterminated
bandwidth (when RIZ = ∞) is approximately 80 MHz.
ACTIVE IMPEDANCE MATCH - R = R
S
IN
R
IZ
R
IN
R
S
V
OUT
+
–
V
IN
R
IZ
R
=
IN
1 + 4.5
Figure 75. Input Configurations
Each output can drive external loads as low as 100 Ω in addition
to the 100 Ω input impedance of the VGA (200 Ω differential).
Capacitive loading up to 10 pF is permissible. All loads should
be ac-coupled. Typically, Pin LOP output is used as a single-ended
driver for auxiliary circuits, such as those used for Doppler
ultrasound imaging. Pin LON drives RIZ. Alternatively, a
differential external circuit can be driven from the two outputs
in addition to the active feedback termination. In both cases,
important stability considerations discussed in the Applications
Information section should be carefully observed.
7
6
5
4
3
2
1
0
INCLUDES NOISE OF VGA
RESISTIVE TERMINATION
(R = R
)
S
IN
ACTIVE IMPEDANCE MATCH
UNTERMINATED
The impedance at each LNA output is 5 Ω. A 0.4 dB reduction
in open circuit gain results when driving the VGA, and a 0.8 dB
reduction results with an additional 100 Ω load at the output.
The differential gain of the LNA is 6 dB higher. If the load is less
than 200 Ω on either side, a compensating load is recommended
on the opposite output.
SIMULATION
50 100
1k
R
(Ω)
S
Figure 76. Noise Figure vs. RS for Resistive,
Active Match, and Unterminated Inputs
7
6
5
4
3
2
1
0
LNA Noise
INCLUDES NOISE OF VGA
The input-referred voltage noise sets an important limit on
system performance. The short-circuit input voltage noise of
the LNA is 0.74 nV/√Hz or 0.82 nV/√Hz (at maximum gain),
including the VGA noise. The open circuit, current noise is
2.5 pA/√Hz. These measurements, taken without a feedback
resistor, provide the basis for calculating the input noise and
noise figure performance of the configurations in Figure 75.
Figure 76 and Figure 77 show simulations extracted from these
results and the 4.1 dB noise figure (NF) measurement with the
input actively matched to a 50 Ω source. Unterminated (RIZ = ∞)
operation exhibits the lowest equivalent input noise and noise
figure. Figure 76 shows the noise figure vs. source resistance,
rising at low RS, where the LNA voltage noise is large compared
to the source noise, and again at high RS due to current noise.
The VGA input-referred voltage noise of 2.7 nV/√Hz is
included in all of the curves.
R
= 50Ω
IN
R
= 75Ω
IN
R
= 100Ω
IN
R
= 200Ω
IN
R
= ∞
IZ
(SIMULATED RESULTS)
100
50
1k
R
(Ω)
S
Figure 77. Noise Figure vs. RS for Various Fixed Values of RIN, Actively Matched
Rev. G | Page 26 of 56
AD8331/AD8332/AD8334
The primary purpose of input impedance matching is to
improve the system transient response. With resistive termination,
the input noise increases due to the thermal noise of the matching
resistor and the increased contribution of the LNA input voltage
noise generator. With active impedance matching, however, the
contributions of both are smaller than they would be for resistive
termination by a factor of 1/(1 + LNA Gain). Figure 76 shows
their relative NF performance. In this graph, the input impedance
is swept with RS to preserve the match at each point. The noise
figures for a source impedance of 50 ꢀ are 7.1 dB, 4.1 dB, and
2.5 dB, respectively, for the resistive, active, and unterminated
configurations. The noise figures for 200 ꢀ are 4.6 dB, 2.0 dB,
and 1.0 dB, respectively.
X-AMP VGA
The input of the VGA is a differential R-2R ladder attenuator
network with 6 dB steps per stage and a net input impedance of
200 Ω differential. The ladder is driven by a fully differential
input signal from the LNA and is not intended for single-ended
operation. LNA outputs are ac-coupled to reduce offset and isolate
their common-mode voltage. The VGA inputs are biased through
the center tap connection of the ladder to VCM, which is typically
set to 2.5 V and is bypassed externally to provide a clean ac ground.
The signal level at successive stages in the input attenuator
falls from 0 dB to −48 dB in +6 dB steps. The input stages of the
X-AMP are distributed along the ladder, and a biasing interpolator,
controlled by the gain interface, determines the input tap point.
With overlapping bias currents, signals from successive taps
merge to provide a smooth attenuation range from 0 dB to
−48 dB. This circuit technique results in excellent linear-in-dB
gain law conformance and low distortion levels and deviates
0.2 dB or less from the ideal. The gain slope is monotonic with
respect to the control voltage and is stable with variations in
process, temperature, and supply.
Figure 77 is a plot of NF vs. RS for various values of RIN, which is
helpful for design purposes. The plateau in the NF for actively
matched inputs mitigates source impedance variations. For
comparison purposes, a preamp with a gain of 19 dB and noise
spectral density of 1.0 nV/√Hz, combined with a VGA with
3.75 nV/√Hz, yields a noise figure degradation of approximately
1.5 dB (for most input impedances), significantly worse than
the AD8331/AD8332/AD8334 performance.
The X-AMP inputs are part of a gain-of-12 feedback amplifier
that completes the VGA. Its bandwidth is 150 MHz. The input
stage is designed to reduce feedthrough to the output and to
ensure excellent frequency response uniformity across gain
setting (see Figure 12 and Figure 13).
The equivalent input noise of the LNA is the same for single-
ended and differential output applications. The LNA noise figure
improves to 3.5 dB at 50 Ω without VGA noise, but this is
exclusive of noise contributions from other external circuits
connected to LOP. A series output resistor is usually recom-
mended for stability purposes when driving external circuits on
a separate board (see the Applications Information section). In
low noise applications, a ferrite bead is even more desirable.
Gain Control
Position along the VGA attenuator is controlled by a single-ended
analog control voltage, VGAIN, with an input range of 40 mV to
1.0 V. The gain control scaling is trimmed to a slope of 50 dB/V
(20 mV/dB). Values of VGAIN beyond the control range saturate
to minimum or maximum gain values. Both channels of the
AD8332 are controlled from a single gain interface to preserve
matching. Gain can be calculated using Equation 1 and Equation 2.
VARIABLE GAIN AMPLIFIER
The differential X-AMP VGA provides precise input attenuation
and interpolation. It has a low input-referred noise of 2.7 nV/√Hz
and excellent gain linearity. A simplified block diagram is shown
in Figure 78.
Gain accuracy is very good because both the scaling factor and
absolute gain are factory trimmed. The overall accuracy relative
to the theoretical gain expression is 1 dB for variations in
temperature, process, supply voltage, interpolator gain ripple,
trim errors, and tester limits. The gain error relative to a best-fit
line for a given set of conditions is typically 0.2 dB. Gain matching
between channels is better than 0.1 dB (Figure 11 shows gain errors
in the center of the control range). When VGAIN < 0.1 or > 0.95,
gain errors are slightly greater.
GAIN
GAIN INTERPOLATOR
(BOTH CHANNELS)
POSTAMP
+
g
m
6dB
R
VIP
48dB
2R
200Ω
VIN
The gain slope can be inverted, as shown in Figure 73 (except for
the AD8332 AR models). The gain drops with a slope of −50 dB/V
across the gain control range from maximum to minimum gain.
This slope is useful in applications such as automatic gain control,
where the control voltage is proportional to the measured output
signal amplitude. The inverse gain mode is selected by setting the
MODE pin to HI gain mode.
–
POSTAMP
Figure 78. Simplified VGA Schematic
Gain control response time is less than 750 ns to settle within 10%
of the final value for a change from minimum to maximum gain.
Rev. G | Page 2ꢀ of 56
AD8331/AD8332/AD8334
VGA Noise
Common-Mode Biasing
In a typical application, a VGA compresses a wide dynamic
range input signal to within the input span of an ADC. While
the input-referred noise of the LNA limits the minimum resolvable
input signal, the output-referred noise, which depends primarily
on the VGA, limits the maximum instantaneous dynamic range
that can be processed at any one particular gain control voltage.
This limit is set in accordance with the quantization noise floor
of the ADC.
An internal bias network connected to a midsupply voltage
establishes common-mode voltages in the VGA and postamp.
An externally bypassed buffer maintains the voltage. The bypass
capacitors form an important ac ground connection because
the VCM network makes a number of important connections
internally, including the center tap of the VGA differential input
attenuator, the feedback network of the VGA fixed gain amplifier,
and the feedback network of the postamp in both gain settings.
For best results, use a 1 nF capacitor and a 0.1 μF capacitor in
parallel, with the 1 nF capacitor nearest to the VCM pin. Separate
VCM pins are provided for each channel. For dc coupling to a 3 V
ADC, the output common-mode voltage is adjusted to 1.5 V by
biasing the VCM pin.
Output- and input-referred noise as a function of VGAIN are plotted
in Figure 25 and Figure 27 for the short circuited input conditions.
The input noise voltage is simply equal to the output noise divided
by the measured gain at each point in the control range.
The output-referred noise is flat over most of the gain range
because it is dominated by the fixed output-referred noise of the
VGA. Values are 48 nV/√Hz in LO gain mode and 178 nV/√Hz
in HI gain mode. At the high end of the gain control range, the
noise of the LNA and the noise of the source prevail. The input-
referred noise reaches its minimum value near the maximum
gain control voltage, where the input-referred contribution of
the VGA becomes very small.
POSTAMPLIFIER
The final stage has a selectable gain of 3.5 dB (×1.5) or 15.5 dB
(×6), set by the HILO logic pin. Figure 79 is a simplified block
diagram.
Gm2
+
VOH
Gm1
F2
At lower gains, the input-referred noise, and thus noise figure,
increases as the gain decreases. The instantaneous dynamic
range of the system is not lost, however, because the input
capacity increases with it. The contribution of the ADC noise
floor has the same dependence as well. The important relationship
is the magnitude of the VGA output noise floor relative to that
of the ADC.
VCM
F1
Gm2
VOL
–
Gm1
With its low output-referred noise levels, these devices ideally
drive low voltage ADCs. The converter noise floor drops 12 dB
for every two bits of resolution and drops at lower input full-
scale voltages and higher sampling rates. ADC quantization
noise is discussed in the Applications Information section.
Figure 79. Postamplifier Block Diagram
Separate feedback attenuators implement the two gain settings.
These are selected in conjunction with an appropriately scaled
input stage to maintain a constant 3 dB bandwidth between the
two gain modes (~150 MHz). The slew rate is 1200 V/μs in HI gain
mode and 300 V/μs in LO gain mode. The feedback networks
for HI and LO gain modes are factory trimmed to adjust the
absolute gains of each channel.
The preceding noise performance discussion applies to a
differential VGA output signal. Although the LNA noise
performance is the same in single-ended and differential
applications, the VGA performance is not. The noise of the
VGA is significantly higher in single-ended usage because the
contribution of its bias noise is designed to cancel in the differential
signal. A transformer can be used with single-ended applications
when low noise is desired.
Noise
The topology of the postamp provides constant input-referred
noise with the two gain settings and variable output-referred
noise. The output-referred noise in HI gain mode increases
(with gain) by four. This setting is recommended when driving
converters with higher noise floors. The extra gain boosts the
output signal levels and noise floor appropriately. When driving
circuits with lower input noise floors, the LO gain mode optimizes
the output dynamic range.
Gain control noise is a concern in very low noise applications.
Thermal noise in the gain control interface can modulate the
channel gain. The resultant noise is proportional to the output
signal level and usually only evident when a large signal is present.
Its effect is observable only in LO gain mode where the noise
floor is substantially lower. The gain interface includes an
on-chip noise filter, which reduces this effect significantly at
frequencies above 5 MHz. Care should be taken to minimize
noise impinging at the GAIN input. An external RC filter can be
used to remove VGAIN source noise. The filter bandwidth should be
sufficient to accommodate the desired control bandwidth.
Although the quantization noise floor of an ADC depends on a
number of factors, the 48 nV/√Hz and 178 nV/√Hz levels are
well suited to the average requirements of most 12-bit and 10-bit
converters, respectively. An additional technique, described in
the Applications Information section, can extend the noise floor
even lower for possible use with 14-bit ADCs.
Rev. G | Page 28 of 56
AD8331/AD8332/AD8334
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Output Clamping
Outputs are internally limited to a level of 4.5 V p-p differential
when operating at a 2.5 V common-mode voltage. The postamp
implements an optional output clamp engaged through a resistor
from RCLMP to ground. Table 8 shows a list of recommended
resistor values.
R
= ∞
CLMP
8.8kΩ
3.5kΩ
R
= 1.86kΩ
CLMP
Output clamping can be used for ADC input overload protection, if
needed, or postamp overload protection when operating from a
lower common-mode level, such as 1.5 V. The user should be
aware that distortion products increase as output levels approach
the clamping levels, and the user should adjust the clamp resistor
accordingly. For additional information, see the Applications
Information section.
3.5kΩ
8.8kΩ
R
= ∞
CLMP
–3
–2
–1
0
1
2
3
V
(V)
INH
The accuracy of the clamping levels is approximately 5% in LO
or HI mode. Figure 80 illustrates the output characteristics for a
Figure 80. Output Clamping Characteristics
few values of RCLMP
.
Rev. G | Page 29 of 56
AD8331/AD8332/AD8334
APPLICATIONS INFORMATION
LNA—EXTERNAL COMPONENTS
C
LMD
0.1µF
LNA
SOURCE
FB
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
The LMD pin (connected to the bias circuitry) must be bypassed to
ground and signal sourced to the INH pin, which is capacitively
coupled using 2.2 nF to 0.1 μF capacitors (see Figure 81).
0.1µF
LMD2
INH2
LMD1
INH1
C
*
SH
5V
C
*
IZ
+5V
3
VPS2
LON2
LOP2
VPS1
LON1
LOP1
COM1
VIP1
The unterminated input impedance of the LNA is 6 kꢀ. The
user can synthesize any LNA input resistance between 50 ꢀ and
6 kꢀ. RIZ is calculated according to Equation 6 or selected from
Table 7.
R
*
IZ
1nF
LNA OUT
0.1µF
4
5
6
COM2
VIP2
33 kꢀ ×
(
RIN
)
7
RIZ
=
(6)
6 kꢀ –
(
RIN
)
0.1µF
0.1µF
1nF
8
VIN2
VIN1
Table 7. LNA External Component Values for Common
Source Impedances
9
V
VCM2
GAIN
RCLMP
VOH2
VOL2
COMM
GAIN
VCM1
HILO
ENB
5V
1nF
5V
0.1µF
1nF
10
11
12
13
14
RIN (Ω)
RIZ (Nearest STD 1% Value, Ω)
CSH (pF)
50
280
22
0.1µF
1nF
ꢀ5
412
12
*
*
VGA OUT
VGA OUT
VOH1
100
200
500
6 k
562
8
1.2
None
None
VOL1
VPSV
1.13 k
3.01 k
∞
5V
1nF
0.1µF
*SEE TEXT
When active input termination is used, a decoupling capacitor (CIS)
is required to isolate the input and output bias voltages of the LNA.
Figure 81. Basic Connections for a Typical Channel (AD8332 Shown)
LNA
DECOUPLING
RESISTOR
TO EXT
CIRCUIT
R
IZ
The shunt input capacitor, CSH, reduces gain peaking at higher
frequencies where the active termination match is lost due to
the gain roll-off of the LNA at high frequencies. The value of CSH
diminishes as RIN increases to 500 Ω, at which point no capacitor is
required. Suggested values for CSH for 50 Ω ≤ RIN ≤ 200 Ω are
shown in Table 7.
VIP
5Ω
50Ω
50Ω
LON
100Ω
100Ω
3.25V
VCM
2.5V
2.5V
5Ω
LNA
C
SH
LOP
When a long trace to Pin INH is unavoidable, or if both LNA
outputs drive external circuits, a small ferrite bead (FB) in series
with Pin INH preserves circuit stability with negligible effect on
noise. The bead shown is 75 Ω at 100 MHz (Murata BLM21 or
equivalent). Other values can prove useful.
3.25V
VIN
LNA
DECOUPLING
RESISTOR
TO EXT
CIRCUIT
Figure 82. Interconnections of the LNA and VGA
Figure 82 shows the interconnection details of the LNA output.
Capacitive coupling between the LNA outputs and the VGA
inputs is required because of the differences in their dc levels
and the need to eliminate the offset of the LNA. Capacitor values
of 0.1 μF are recommended. There is a 0.4 dB loss in gain
between the LNA output and the VGA input due to the 5 Ω
output resistance. Additional loading at the LOP and LON
outputs affects LNA gain.
Both LNA outputs are available for driving external circuits.
Pin LOP should be used in those instances when a single-ended
LNA output is required. The user should be aware of stray
capacitance loading of the LNA outputs, in particular LON. The
LNA can drive 100 Ω in parallel with 10 pF. If an LNA output is
routed to a remote PC board, it tolerates a load capacitance up
to 100 pF with the addition of a 49.9 Ω series resistor or ferrite
75 Ω/100 MHz bead.
Rev. G | Page 30 of 56
AD8331/AD8332/AD8334
Gain Input
Optional Output Voltage Limiting
The GAIN pin is common to both channels of the AD8332. The
input impedance is nominally 10 MΩ, and a bypass capacitor
from 100 pF to 1 nF is recommended.
The RCLMP pin provides the user with a means to limit the
output voltage swing when used with loads that have no
provisions for prevention of input overdrive. The peak-to-peak
limited voltage is adjusted by a resistor to ground (see Table 8
for a list of several voltage levels and corresponding resistor
values). Unconnected, the default limiting level is 4.5 V p-p.
Parallel connected devices can be driven by a common voltage
source or DAC. Decoupling should take into account any band-
width considerations of the drive waveform, using the total
distributed capacitance.
Note that third harmonic distortion increases as waveform
amplitudes approach clipping. For lowest distortion, the clamp level
should be set higher than the converter input span. A clamp level
of 1.5 V p-p is recommended for a 1 V p-p linear output range,
2.7 V p-p for a 2 V p-p range, or 1 V p-p for a 0.5 V p-p operation.
The best solution is determined experimentally. Figure 84 shows
third harmonic distortion as a function of the limiting level for
a 2 V p-p output signal. A wider limiting level is desirable in HI
gain mode.
If gain control noise in LO gain mode becomes a factor, main-
taining ≤15 nV/√Hz noise at the GAIN pin ensures satisfactory
noise performance. Internal noise prevails below 15 nV/√Hz at
the GAIN pin. Gain control noise is negligible in HI gain mode.
VCM Input
The common-mode voltage of Pin VCM, Pin VOL, and Pin VOH
defaults to 2.5 V dc. With output ac-coupled applications, the
VCM pin is unterminated; however, it must still be bypassed in
close proximity for ac grounding of internal circuitry. The VGA
outputs can be dc connected to a differential load, such as an
ADC. Common-mode output voltage levels between 1.5 V and
3.5 V can be realized at Pin VOH and Pin VOL by applying the
desired voltage at Pin VCM. DC-coupled operation is not
recommended when driving loads on a separate PC board.
–20
V
= 0.75V
GAIN
–30
–40
–50
–60
–70
–80
The voltage on the VCM pin is sourced by an internal buffer
with an output impedance of 30 Ω and a 2 mA default output
current (see Figure 83). If the VCM pin is driven from an external
source, its output impedance should be <<30 Ω, and its current
drive capability should be >>2 mA. If the VCM pins of several
devices are connected in parallel, the external buffer should be
capable of overcoming their collective output currents. When a
common-mode voltage other than 2.5 V is used, a voltage-
limiting resistor, RCLMP, is needed to protect against overload.
INTERNAL
HILO = LO
HILO = HI
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
CLAMP LIMIT LEVEL (V p-p)
Figure 84. HD3 vs. Clamping Level for 2 V p-p Differential Input
Table 8. Clamp Resistor Values
Clamp Resistor Value (kΩ)
CIRCUITRY
Clamp Level (V p-p)
HILO = LO
1.21
2.ꢀ4
4.ꢀ5
ꢀ.5
HILO = HI
2mA MAX
R
<< 30Ω
NEW V
CM
O
VCM
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.4
30Ω
2.21
4.02
6.49
9.53
14.ꢀ
23.2
39.2
ꢀ3.2
100pF
0.1µF
AC GROUNDING FOR
INTERNAL CIRCUITRY
11
Figure 83. VCM Interface
16.9
26.ꢀ
49.9
100
Logic Inputs—ENB, MODE, and HILO
The input impedance of all enable pins is nominally 25 kΩ and
can be pulled up to 5 V (a pull-up resistor is recommended) or
driven by any 3 V or 5 V logic families. The enable pin, ENB,
powers down the VGA; when pulled low, the VGA output voltages
are near ground. Multiple devices can be driven from a common
source. Consult Table 3, Table 4, Table 5, and Table 6 for infor-
mation about circuit functions controlled by the enable pins.
Output Decoupling
When driving capacitive loads greater than about 10 pF, or long
circuit connections on other boards, an output network of resistors
and/or ferrite beads can be useful to ensure stability. These
components can be incorporated into a Nyquist filter such as
the one shown in Figure 81. In Figure 81, the resistor value is
84.5 Ω. For example, all the evaluation boards for this series
incorporate 100 ꢀ in parallel with a 120 nH bead. Lower value
resistors are permissible for applications with nearby loads or
Pin HILO is compatible with 3 V or 5 V CMOS logic families. It
is either connected to ground or pulled up to 5 V, depending on
the desired gain range and output noise.
Rev. G | Page 31 of 56
AD8331/AD8332/AD8334
with gains less than 40 dB. The exact values of these components
can be selected empirically.
Signals larger than 275 mV at the LNA input are clipped to
5 V p-p differential prior to the input of the VGA. Figure 48
shows the response to a 1 V p-p input burst. The symmetric
overload waveform is important for applications, such as CW
Doppler ultrasound, where the spectrum of the LNA outputs
during overload is critical. The input stage is also designed to
accommodate signals as high as 2.5 V without triggering the
slow-settling ESD input protection diodes.
An antialiasing noise filter is typically used with an ADC. Filter
requirements are application dependent.
When the ADC resides on a separate board, the majority of
filter components should be placed nearby to suppress noise
picked up between boards and to mitigate charge kickback from
the ADC inputs. Any series resistance beyond that required for
output stability should be placed on the ADC board. Figure 85
shows a second-order, low-pass filter with a bandwidth of 20 MHz.
The capacitor is chosen in conjunction with the 10 pF input
capacitance of the ADC.
Both stages of the VGA are susceptible to overload. Post-
amplifier limiting is more common and results in the clean-
limited output characteristics found in Figure 49. Recovery is fast in
all cases. The graph in Figure 87 summarizes the combinations of
input signal and gain that lead to the different types of overload.
OPTIONAL
BACKPLANE
POSTAMP
OVERLOAD
X-AMP
OVERLOAD
POSTAMP
OVERLOAD
X-AMP
OVERLOAD
0.1µF
0.1µF
1.5µH
1.5µH
15mV 25mV
4mV
25mV
84.5Ω
84.5Ω
158Ω
158Ω
43.5
56.5
18pF
ADC
41dB
29dB
Figure 85. 20 MHz Second-Order, Low-Pass Filter
24.5dB
24.5dB
LO GAIN
MODE
HI GAIN
MODE
DRIVING ADCs
The output drive accommodates a wide range of ADCs. The
noise floor requirements of the VGA depend on a number of
application factors, including bit resolution, sampling rate, full-
scale voltage, and the bandwidth of the noise/antialias filter. The
output noise floor and gain range can be adjusted by selecting
HI or LO gain mode.
–4.5
1m
7.5
1m
10m
0.1 0.275
1
10m
0.1 0.275
1
INPUT AMPLITUDE (V)
INPUT AMPLITUDE (V)
Figure 87. Overload Gain and Signal Conditions
The relative noise and distortion performance of the two gain
modes can be compared in Figure 25 and Figure 31 through
Figure 41. The 48 nV/√Hz noise floor of the LO gain mode is
suited to converters with higher sampling rates or resolutions
(such as 12 bits). Both gain modes can accommodate ADC full-
scale voltages as high as 4 V p-p. Because distortion performance
remains favorable for output voltages as high as 4 V p-p (see
Figure 36), it is possible to lower the output-referred noise even
further by using a resistive attenuator (or transformer) at the
output. The circuit in Figure 86 has an output full-scale range of
2 V p-p, a gain range of −10.5 dB to +37.5 dB, and an output
noise floor of 24 nV/√Hz, making it suitable for some 14-bit
ADC applications.
The clamp interface mentioned in the Output Clamping section
controls the maximum output swing of the postamp and its
overload response. When the clamp feature is not used, the
output level defaults to approximately 4.5 V p-p differential
centered at 2.5 V common mode. When other common-mode
levels are set through the VCM pin, the value of RCLMP should be
selected for graceful overload. A value of 8.3 kΩ or less is
recommended for 1.5 V or 3.5 V common-mode levels (7.2 kΩ
for HI gain mode). This limits the output swing to just above
2 V p-p differential.
OPTIONAL INPUT OVERLOAD PROTECTION
Applications in which high transients are applied to the LNA
input can benefit from the use of clamp diodes. A pair of back-
to-back Schottky diodes can reduce these transients to manageable
levels. Figure 88 illustrates how such a diode protection scheme
can be connected.
4V p-p DIFF,
48nV/ Hz
2V p-p DIFF,
24nV/ Hz
187Ω
VOH
VOL
ADC
AD6644
374Ω
2:1
LPF
OPTIONAL
SCHOTTKY
187Ω
COMM 20
OVERLOAD
Figure 86. Adjusting the Noise Floor for 14-Bit ADCs
CLAMP
0.1µF
FB
2
INH
ENBL 19
OVERLOAD
C
R
3
IZ
SH
3
4
VPSL
LON
These devices respond gracefully to large signals that overload
its input stage and to normal signals that overload the VGA
when the gain is set unexpectedly high. Each stage is designed
for clean-limited overload waveforms and fast recovery when
gain setting or input amplitude is reduced.
R
C
IZ
SH
2
1
BAS40-04
Figure 88. Input Overload Clamping
Rev. G | Page 32 of 56
AD8331/AD8332/AD8334
ADG736
When selecting overload protection, the important parameters
are forward and reverse voltages and trr (or τrr). The Infineon
BAS40-04 series shown in Figure 88 has a τrr of 100 ps and a VF
of 310 mV at 1 mA. Many variations of these specifications can
be found in vendor catalogs.
1.13kΩ
SELECT R
IZ
280Ω
5Ω
LON
LOP
18nF
LAYOUT, GROUNDING, AND BYPASSING
200Ω
50Ω
INH
Due to their excellent high frequency characteristics, these
devices are sensitive to their PCB environments. Realizing
expected performance requires attention to detail critical to
good, high speed, board design.
LNA
LMD
5Ω
0.1µF
AD8332
Figure 89. Accommodating Multiple Sources
A multilayer board with power and ground planes is recom-
mended with blank areas in the signal layers filled with ground
plane. Be certain that the power and ground pins provided for
robust power distribution to the device are connected. Decouple
the power supply pins with surface-mount capacitors as close as
possible to each pin to minimize impedance paths to ground.
Decouple the LNA power pins from the VGA supply using
ferrite beads. Together with the capacitors, ferrite beads
eliminate undesired high frequencies without reducing the
headroom. Use a larger value capacitor for every 10 chips to
20 chips to decouple residual low frequency noise. To minimize
voltage drops, use a 5 V regulator for the VGA array.
DISABLING THE LNA
Where accessible, connection of the LNA enable pin to ground
powers down the LNA, resulting in a current reduction of about
half. In this mode, the LNA input and output pins can be left
unconnected; however, the power must be connected to all the
supply pins for the disabling circuit to function. Figure 90 illustrates
the connections using AD8331 as an example.
1
20
19
18
17
16
15
14
13
12
11
NC
COMM
LMD
AD8331
2
NC
INH
ENBL
ENBV
COMM
VOL
Several critical LNA areas require special care. The LON and
LOP output traces must be as short as possible before connecting
to the coupling capacitors connected to Pin VIN and Pin VIP.
RIZ must be placed near the LON pin as well. Resistors must be
placed as close as possible to the VGA output pins, VOL and
VOH, to mitigate loading effects of connecting traces. Values
are discussed in the Output Decoupling section.
+5V
3
VPSL
LON
LOP
COML
+5V
4
NC
NC
Signal traces must be short and direct to avoid parasitic effects.
Wherever there are complementary signals, symmetrical layout
should be employed to maintain waveform balance. PCB traces
should be kept adjacent when running differential signals over a
long distance.
5
VOUT
6
VOH
MULTIPLE INPUT MATCHING
0.1µF
Matching of multiple sources with dissimilar impedances can be
accomplished as shown in Figure 89. A relay and low supply voltage
analog switch can be used to select between multiple sources
and their associated feedback resistors. An ADG736 dual SPDT
switch is shown in this example; however, multiple switches are
also available and users are referred to the Analog Devices
Selection Guide for switches and multiplexers.
7
VIP
VPOS
+5V
VIN
0.1µF
8
HILO
RCLMP
VCM
VIN
HILO
9
MODE
MODE
R
CLMP
10
GAIN
GAIN
VCM
Figure 90. Disabling the LNA
Rev. G | Page 33 of 56
AD8331/AD8332/AD8334
ULTRASOUND TGC APPLICATION
HIGH DENSITY QUAD LAYOUT
The AD8332 ideally meets the requirements of medical and
industrial ultrasound applications. The TGC amplifier is a key
subsystem in such applications because it provides the means
for echo location of reflected ultrasound energy.
The AD8334 is the ideal solution for applications with limited
board space. Figure 94 represents four channels routed to and
away from this very compact quad VGA. Note that none of the
signal paths crosses and that all four channels are spaced apart
to eliminate crosstalk.
Figure 91 through Figure 93 are schematics of a dual, fully
differential system using the AD8332 and the AD9238 12-bit
high speed ADC with conversion speeds as high as 65 MSPS.
In this example, all of the components shown are 0402 size;
however, the same layout is executable at the expense of slightly
more board area. The sketch also assumes that both sides of the
printed circuit board are available for components and that the
bypass and power supply decoupling circuitry is located on the
wiring side of the board.
Rev. G | Page 34 of 56
AD8331/AD8332/AD8334
S3
E
IN2
TP5
AD8332ARU
C50
0.1µF
1
28
27
26
LMD1
LMD2
C49
TP6
C70
0.1µF
0.1µF
L12
120nH FB
L13
120nH FB
C60
0.1µF
TP3
2
3
S1
IN1
(RED)
+5V
INH1
INH2
E
C79
TB1
+5V
C80
22pF
JP5
IN2
JP6
IN1
22pF
CFB2
18nF
CFB1
18nF
+5VLNA
+
C46
1µF
TP4
(BLACK)
VPS1
LON1
LOP1
COM1
VIP1
VPS2
LON2
LOP2
COM2
VIP2
RFB1
274Ω
C41
C74
1nF
+5VLNA
RFB2
274Ω
0.1µF
TB2
GND
L7
4
25
24
23
22
21
20
19
120nH FB
+5VGA
5
L6
120nH FB
+5VLNA
C42
0.1µF
C59
0.1µF
6
C51
0.1µF
C53
0.1µF
7
VCM1
8
VIN2
VIN1
VCM1
JP13
C78
1nF
C48
0.1µF
9
VCM2
GAIN
RCLMP
VOH2
VOL2
COMM
VCM1
HILO
ENB
C43
0.1µF
C77
1nF
+5VGA
10
HI GAIN
JP10
TP2 GAIN
TP7 GND
C83
1nF
+5VGA
LO GAIN
ENABLE
18
11
12
JP16
R3
C68
1nF
C69
0.1µF
DISABLE
(R
)
CLMP
17
16
15
VOH1
VOL1
VPSV
JP8
DC2H
R27
100Ω
R24
100Ω
JP9
OPTIONAL 4-POLE LOW-PASS
FILTER
OPTIONAL 4-POLE LOW-PASS
FILTER
13
14
C58
0.1µF
L19
L17
SAT
SAT
L11
120nH FB
L9
120nH FB
L1
C54
0.1µF
L15
SAT
V
+B
IN
SAT
V
+A
IN
C64
SAT
C65
SAT
JP17
C67
SAT
C66
SAT
C55
0.1µF
JP12
L20
SAT
L10
120nH FB
C56
0.1µF
L18
SAT
L14
SAT
L16
SAT
L8
120nF FB
V
–A
IN
V
–B
IN
JP7
DC2L
R26
100Ω
R25
100Ω
+5VGA
C45
0.1µF
C85
1nF
JP10
Figure 91. Schematic, TGC, VGA Section Using an AD8332 and AD9238
Rev. G | Page 35 of 56
AD8331/AD8332/AD8334
VR1
+3.3VAVDD
ADP3339AKC-3.3
L5
120nH FB
C44
1µF
+5V
+
C22
0.1µF
C21
1nF
C31
0.1µF
3
2
1
ADCLK
IN OUT GND
L4
R11
C2
10µF
6.3V
+
120nH FB
100Ω
JP2
R10
1
2
64
63
62
61
60
59
58
57
56
55
AGND
VIN+_A
AVDD
0Ω
SHARED
REF
Y
R5
OUT
TAB
C30
33Ω
0.1µF
V
V
+_A
CLK_A
IN
C61
18pF
L3
120nH FB
N
3
VIN–_A SHARED_REF
–_A
IN
R14
4.7kΩ
R6
33Ω
4
C29
0.1µF
R4
AGND
AVDD
REFT_A
REFB_A
VREF
MUX_SELECT
PDWN_A
OEB_A
OTR_A
D11_A (MSB)
D10_A
D9_A
R12
1.5kΩ
+3.3VADDIG
C17
C18
1nF
1.5kΩ
R15
0Ω
5
0.1µF
C33
10µF
6.3V
L2
120nH FB
C35
0.1µF
6
+
C40
0.1µF
C52
C1
0.1µF
10nF
7
OTR_A
C36
0.1µF
TP9
+
8
D11_A
D10_A
D9_A
VREF
C12
10µF
6.3V
C32
9
0.1µF
C34
10µF
6.3V
SENSE
REFB_B
REFT_B
AVDD
AGND
VIN–_B
VIN+_B
AGND
AVDD
CLK_B
DCS
C38
0.1µF
10
C57
10nF
C39
10µF
11
12
13
14
15
16
54
53
D8_A
D8_A
C37
0.1µF
+3.3VADDIG
DRGND
DRVDD
D7_A
C23
0.1µF
C25
1nF
C16
0.1µF
C15
1nF
1.5kΩ
1.5kΩ
52
51
50
49
R8
33Ω
V
V
–_B
+_B
D7_A
D6_A
D5_A
D4_A
D3_A
D2_A
D1_A
D0_A
DNC
IN
C62
18pF
D6_A
IN
R7
33Ω
+3.3VCLK
D5_A
R18
499Ω
17
18
19
20
48
47
46
45
44
43
S2
D4_A
C63
C20
0.1µF
C19
1nF
EXT CLOCK
0.1µF
R16
5kΩ
D3_A
R17
49.9Ω
D2_A
R19
499Ω
JP3
JP11
DFS
D1_A
R20
4.7kΩ
R41
4.7kΩ
21
22
PDWN_B
OEB_B
DNC
D0_A
DNC
+3.3VCLK
ADCLK
TP 12
23
24
25
26
27
28
29
42
41
40
39
38
37
36
DNC
DNC
DNC
DNC
C47
10µF
6.3V
+
C86
0.1µF
ADCLK
DNC
DRVDD
DRGND
OTR_B
D11_B (MSB)
D10_B
D9_B
C11
10µF
6.3V
+
C13
1nF
C14
0.1µF
U5
74VHC04
U5
74VHC04
EXT
3
D0_B
D1_B
D2_B
D0_B
R9
0Ω
4
1
V
OE
3
5
4
1
9
2
DD
20MHz
OUT
JP4
D1_B
OTR_B
D11_B
D10_B
D9_B
2
3
1
INT
D2_B
GND
TP 13
DATA
CLK
2
U5
74VHC04
U5
74VHC04
DRGND
DRVDD
D3_B
3
U6
SG-636PCE
6
8
1
JP1
2
D3_B
D4_B
D5_B
30
31
32
35
34
33
D8_B
D8_B
U5
D4_B
D7_B
D7_B
74VHC04
13
12
D5_B
D6_B
D6_B
SPARES
11
10
+3.3VADDIG
U5
74VHC04
C24
1nF
C26
0.1µF
Figure 92. Converter Schematic, TGC Using an AD8332 and AD9238
Rev. G | Page 36 of 56
AD8331/AD8332/AD8334
R40
1
20
10
18
17
16
15
14
13
12
22Ω
U10
74VHC541
GND
DATACLKA
G1
G2
A1
A2
A3
A4
A5
A6
A7
A8
VCC
+3.3VDVDD
+
C3
0.1µF
C28
10µF
6.3V
19
2
4
1
3
22 × 4
RP 1
1
8
2
3
4
5
6
7
8
22 × 4
8
1
2
Y1
Y2
Y3
RP 9
7
2
3
4
1
7
6
5
8
6
5
OTR_A
D11_A
D10_A
D9_A
3
4
1
6
5
8
7
10
12
14
16
9
Y4
Y5
Y6
Y7
Y8
8
22 × 4
RP2
11
13
15
22 × 4
RP 10
7
2
3
4
2
3
4
1
2
7
6
5
8
7
D8_A
6
5
D7_A
9
11
18
20
22
24
26
28
30
32
34
36
38
40
17
19
21
23
25
27
29
31
33
35
37
39
D6_A
22 × 4
RP 3
3
4
1
2
6
5
8
7
+3.3VDVDD
1
20
10
18
17
U7
74VHC541
G1
G2
A1
A2
A3
A4
A5
A6
VCC
+
22 × 4
RP 4
C76
10µF
6.3V
C8
0.1µF
C10
0.1µF
19
GND
8
1
2
3
4
1
2
3
22 × 4
D5_A
D4_A
D3_A
D2_A
D1_A
D0_A
Y1
Y2
Y3
Y4
Y5
Y6
3
4
6
5
RP 11
7
6
5
4
5
6
7
8
9
16
15
14
13
12
11
8
22 × 4
RP 12
7
2
3
4
6
5
DNC
DNC
A7
A8
Y7
Y8
SAM080UPM
+3.3VDVDD
1
20
10
18
17
16
15
14
13
12
11
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
U2
74VHC541
G1
G2
A1
A2
A3
A4
A5
VCC
GND
Y1
+
+
C27
C7
C9
0.1µF
19
1
22 × 4
RP 13
8
10µF
6.3V
0.1µF
22 × 4
RP 5
2
3
4
7
6
5
2
3
4
5
6
7
8
9
1
2
3
4
8
7
6
5
8
OTR_B
D11_B
D10_B
D9_B
Y2
Y3
22 × 4
RP 14
1
2
8
7
Y4
1
2
3
4
22 × 4
RP 6
D8_B
Y5
7
6
5
3
6
D7_B
A6
A7
A8
Y6
Y7
Y8
4
1
5
8
D6_B
D5_B
22 × 4
1
2
3
4
1
8
7
6
5
8
22 × 4
RP 7
+3.3VDVDD
1
20
10
RP 15
G1
G2
A1
A2
A3
A4
A5
A6
A7
A8
U3 VCC
74VHC541
+
C75
C4
0.1µF
C5
0.1µF
C6
0.1µF
19
10µF
6.3V
GND
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
22 × 4
RP 8
2
3
4
1
7
6
5
8
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
D4_B
D3_B
D2_B
D1_B
D0_B
DNC
2
3
4
7
6
5
74
76
78
80
73
75
77
79
22 × 4
RP 16
2
3
4
7
6
5
SAM080UPM
DNC
R39
22Ω
DATACLK
Figure 93. Interface Schematic, TGC Using an AD8332 and AD9238
Rev. G | Page 3ꢀ of 56
AD8331/AD8332/AD8334
COM2
COM1
INH1
COM3
COM4
INH4
LMD1
NC
LMD4
NC
LON1
LOP1
VIP1
LON4
LOP4
VIP4
VIN1
VIN4
VPS1
GAIN12
CLMP12
EN12
EN34
VCM1
VCM2
VPS4
GAIN34
CLMP34
HILO
VCM4
VCM3
NC
03199-094
Figure 94. Compact Signal Path and Board Layout for the AD8334
Rev. G | Page 38 of 56
AD8331/AD8332/AD8334
AD8331 EVALUATION BOARD
GENERAL DESCRIPTION
The AD8331 evaluation board is a platform for testing and
evaluating the AD8331 variable gain amplifier (VGA). The
board is provided completely assembled and tested; the user
simply connects an input signal, VGAIN sources, and a 5 V
power supply. The AD8331-EVALZ is lead free and RoHS
compliant. Figure 95 is a photograph of the board.
USER-SUPPLIED OPTIONAL COMPONENTS
As shown in the schematic in Figure 96, the board provides for
optional components. The components shown in black are for
typical operation, and the components shown in gray are
installed at the user’s discretion.
As shipped, the LNA input impedance of the AD8331-EVALZ is
configured for 50 ꢀ to accommodate most signal generators and
network analyzers. Input impedances up to 6 kΩ are realized by
changing the values of RFB and CSH. Refer to the Theory of
Operation section for details on this circuit feature. See Table 9
for typical values of input impedance and corresponding
components.
Figure 95. Photograph of AD8331-EVALZ
MEASUREMENT SETUP
The basic board connection for measuring bandwidth is shown
in Figure 97. A 5 V, 100 mA minimum power supply and a low
noise, voltage reference supply for GAIN are required. Table 10
lists jumpers, and Figure 97 shows their functions and positions.
Table 9. LNA External Component Values for Common
Source Impedances
The preferred signal detection method is a differential probe
connected to VO, as shown in Figure 97. Single-ended loads can be
connected using the board edge SMA connector, VOH. Be sure to
take into account the 25.8 dB attenuation incurred when using the
board in this manner. For connection to an ADC, the 270 ꢀ series
resistors can be replaced with 0 ꢀ or other appropriate values.
RIN (Ω)
RFB (Ω, Nearest 1% Value)
CSH (pF)
50
2ꢀ4
22
ꢀ5
412
12
100
200
500
6 k
562
8
1.2
None
None
1.13 k
3.01 k
∞
Table 10. Jumper Functions
Switch
LNA_EN
VGA_EN
W5, W6
Function
Enables the LNA when in the top position
Enables the VGA when in the top position
Connects the AD8331 outputs to the SMA connectors
The board is designed for 0603 size, surface-mount components.
Back-to-back diodes can be installed at Location D3 if desired.
To evaluate the LNA as a standalone amplifier, install optional
SMA connectors LON and LOP and capacitors C1 and C2;
typical values are 0.1 μF or smaller. At R4 and R8, 0 ꢀ resistors
are installed unless capacitive loads larger than 10 pF are connected
to the SMA connectors LON and LOP (such as coaxial cables).
In that event, small value resistors (68 ꢀ to 100 ꢀ) must be
installed at R4 and R8 to preserve the stability of the amplifier.
GN_SLOPE Left = gain increases with VGAIN
Right = gain decreases with VGAIN
GN_HI_LO Left = high gain
Right = LO gain
BOARD LAYOUT
The evaluation board circuitry uses four conductor layers. The
two inner layers are grounded, and all interconnecting circuitry
is located on the outer layers. Figure 99 to Figure 102 illustrate
the copper patterns.
A resistor can be inserted at RCLMP if output clamping is
desired. Refer to Table 8 for appropriate values.
Rev. G | Page 39 of 56
AD8331/AD8332/AD8334
AD8331 EVALUATION BOARD SCHEMATICS
GND1 GND2 GND +5V
GND3 GND4
+
C3
10µF
10V
1
2
20
19
18
17
16
15
14
13
12
11
LMD2
INH
COMM
ENB
CLMD
0.1µF
+5V
C
INH
0.1µF
L1
120nH FB
LNA2
ENABLE
DISABLE
LNA_EN
PROBE
D1
CSH
22pF
CFB
0.018µF
RFB
274µF
3
INPUT
CLAMP
DIODES
L2
120nH FB
BAT64-04
ENABLE
DISABLE
3
VGA_EN
VPS
ENBV
+5V
C6
0.1µF
DUT
AD8331ARQ
LON
C1
R4
R8
4
LON
COMM
VOL
LO
L3
120nH FB
C2
5
LOP
C24
R16
R44
LOP
0.1µF
W5
W6
237Ω
100Ω
T1
1:1
6
VO
COML
VIP
VOH
C26
0.1µF
R43
100Ω
R20
237Ω
C16
C14
0.1µF
0.1µF
VOH
L4
7
120nH FB
VPOS
HILO
CLMP
VCM
+5V
L5
120nH FB
C32
0.1µF
HI
8
GN_HI_LO
VIN
LO
+5V
RCLMP
DOWN
UP
9
MODE
GAIN
GN_SLOPE
C17
0.1µF
RCLMP
VCM
10
GAIN
C34
1nF
C18
0.1µF
COMPONENTS IN GRAY ARE
OPTIONAL AND USER SUPPLIED.
Figure 96. Schematic of the AD8331 Evaluation Board
Rev. G | Page 40 of 56
AD8331/AD8332/AD8334
4395A ANALYZER
GN D
1103 TEKPROBE
POWER SUPPLY
E3631A
POWER SUPPLY
+5V
GND
DIFFERENTIAL PROBE
TO VO PINS
DP8200 PRECISION VOLTAGE REFERENCE
(FOR VGAIN)
INSERT JUMPERS W5 AND W6
TO USE OUTPUT
TRANSFORMER AND VOH SMA
Figure 97. AD8331 Typical Board Test Connections
Rev. G | Page 41 of 56
AD8331/AD8332/AD8334
AD8331 EVALUATION BOARD PCB LAYERS
Figure 98. AD8331-EVALZ Assembly
Figure 101. Internal Layer Ground
Figure 99. Primary Side Copper
Figure 102. Power Plane
Figure 103. Top Silkscreen
Figure 100. Secondary Side Copper
Rev. G | Page 42 of 56
AD8331/AD8332/AD8334
AD8332 EVALUATION BOARD
GENERAL DESCRIPTION
Table 11. LNA External Component Values for Common
Source Impedances
The AD8332-EVALZ is a platform for the testing and evaluation of
the AD8332 variable gain amplifier (VGA). The board is shipped
assembled and tested, and users need only connect the signal
and VGAIN sources to a single 5 V power supply. Figure 104 is a
photograph of the component side of the board, and Figure 105
shows the schematic. The AD8332-EVALZ is lead free and
RoHS compliant.
RIN (Ω)
RFB1, RFB2 (Ω Std 1% Value)
CSH1, CSH2 (pF)
50
2ꢀ4
22
ꢀ5
412
12
100
200
500
6 k
562
8
1.2
None
None
1.13 k
3.01 k
∞
SMA connectors, S2, S3, S6, and S7, are provided for access to
the LNA outputs or the VGA inputs. If the LNA is used alone,
0.1 μF coupling capacitors can be installed at the C5, C9, C23,
and C24 locations. Resistors of 68 Ω to 100 Ω may be required
if the load capacitances, as seen by the LNA outputs, are larger
than approximately 10 pF.
A resistor can be inserted at RCLMP if output clamping is desired.
The peak-to-peak clamping level is adjusted by installing one of
the standard 1% resistor values listed in Table 8.
A high frequency differential probe connected to the 2-pin headers,
VOx, is the preferred method to observe a waveform at the VGA
output. A typical setup is shown in Figure 106. Single-ended loads
can be connected directly via the board edge SMA connectors.
Note that the AD8332 output amplifier is buffered with 237 Ω
resistors; therefore, be sure to compensate for attenuation if low
impedances are connected to the output SMAs.
MEASUREMENT SETUP
Figure 104.Photograph of the AD8332-EVALZ
The basic board connections for measuring bandwidth are
shown in Figure 106. A 5 V, 100 mA (minimum) power supply
is required, and a low noise voltage reference supply is required
for VGAIN.
USER-SUPPLIED OPTIONAL COMPONENTS
The board is built and tested using the components shown in
black in Figure 105. Provisions are made for optional components
(shown in gray) that can be installed for testing at user discretion.
The default LNA input impedance is 50 Ω to match various
signal generators and network analyzers. Input impedances up to
6 kΩ are realized by changing the values of RFBx and CSHx. For
reference, Table 11 lists the common input impedance values
and corresponding adjustments. The board is designed for 0603
size, surface-mount components.
BOARD LAYOUT
The evaluation board circuitry uses four conductor layers.
The two inner layers are power and ground planes, and all
interconnecting circuitry is located on the outer layers. Figure 108
to Figure 111 illustrate the copper patterns.
Rev. G | Page 43 of 56
AD8331/AD8332/AD8334
EVALUATION BOARD SCHEMATICS
+5V
GND GND1 GND2 GND3 GND4
+
C25
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
LMD2
INH2
LMD1
INH1
10µF
C2
C1
0.1µF
0.1µF
C4
C3
0.1µF
L1
CSH1
22pF
CSH2
22pF
L2
120nH FB
0.1µF
LNA2
LNA1
120nH FB
CAL2
CFB2
18nF
CFB1
18nF
CAL1
L8
120nH FB
3
+5V
VPS2
VPS1
+5VLNA
C6
0.1µF
C7
0.1µF
+5VLNA
RFB1
274Ω
RFB2
274Ω
AD8332ARUZ
S2
LON1
S6
LON2
C9
C5
C23
4
LON2
LOP2
COM2
VIP2
LON1
LOP1
COM1
VIP1
R9
R10
W8
W9
5
C24
S7
S3
LOP1
R12
R11
6
LOP2
C16
0.1µF
C14
0.1µF
C13
0.1µF
C15
0.1µF
7
8
VIN2
VIN1
C10
0.1µF
9
VCM2
VCM2
GAIN
RCLMP
VOH2
VOL2
COMM
VCM1
HILO
ENB
VCM1
+5V
C17
0.1µF
10
11
12
13
14
HI
GAIN
W5
LO
C8
1nF
+5V
TP3
CLAMP
ENABLE
DISABLE
W4
C20
0.1µF
RCLMP
L3
L6
120nH FB
120nH FB
VOH1
VOL1
VPSV
C11
0.1µF
C19
0.1µF
T2
1:1
R13
237Ω
R7
100Ω
R15
237Ω
R5
100Ω
W12
W10
T1
1:1
VOH2
VOH1
W6
VO2
W7
VO1
C18
0.1µF
R8
100Ω
R6
100Ω
R14
237Ω
R16
237Ω
W13
W11
L5
120nH FB
C12
0.1µF
L4
120nH FB
L7
120nH FB
COMPONENTS IN GRAY ARE
OPTIONAL AND USER SUPPLIED.
+5V
C22
0.1µF
Figure 105. Schematic of the AD8332 Evaluation Board
Rev. G | Page 44 of 56
AD8331/AD8332/AD8334
NETWORK ANALYZER
1103 TEKPROBE
POWER SUPPLY
VGAIN SUPPLY
DIFFERENTIAL PROBE
Figure 106. AD8332 Typical Board Test Connections
Rev. G | Page 45 of 56
AD8331/AD8332/AD8334
AD8332 EVALUATION BOARD PCB LAYERS
Figure 107. AD8332-EVALZ Assembly
Figure 110. Ground Plane
Figure 108. Primary Side Copper
Figure 111. Power Plane
Figure 109. Secondary Side Copper
Figure 112. Component Side Silkscreen
Rev. G | Page 46 of 56
AD8331/AD8332/AD8334
AD8334 EVALUATION BOARD
GENERAL DESCRIPTION
The AD8334-EVALZ is a platform for the testing and evaluation of
the AD8334 variable gain amplifier (VGA). The board is shipped
assembled and tested, and users need only connect the signal
and VGAIN sources and a single 5 V power supply. Figure 113
is a photograph of the board. The AD8334-EVALZ is lead free
and RoHS compliant.
Figure 113. AD8334-EVALZ Top View
Rev. G | Page 4ꢀ of 56
AD8331/AD8332/AD8334
Viewing Signals
CONFIGURING THE INPUT IMPEDANCE
The preferred signal detector is a high impedance differential
probe, such as the Tektronix P6247, 1 GHz differential probe,
connected to the 2-pin headers (VO1, VO2, VO3, or VO4), as
shown in Figure 116. The low capacitance of this probe has the
least effect on the performance of the device of any detection
method tried. The probe can also be used for monitoring input
signals at IN1, IN2, IN3, or IN4. It can be used for probing
other circuit nodes; however, be aware that the 200 kΩ input
impedance can affect certain circuits.
The board is built and tested using the components shown in
black in Figure 115. Provisions are made for optional components
(shown in gray) that can be installed at user discretion. As
shipped, the input impedances of the low noise amplifiers (LNAs)
are configured for 50 Ω to match the output impedances of most
signal generators and network analyzers. Input impedances up to
6 kΩ can be realized by changing the values of the feedback
resistors, RFB1, RFB2, RFB3, RFB4, and shunt capacitors, C6, C8, C10,
and C12. For reference, Table 12 lists standard values of 1%
resistors for some typical values of input impedance. Of course,
if the user has determined that the source impedance falls
between these values, the feedback resistor value can be
calculated accordingly. Note that the board is designed to accept
standard surface-mount, size 0603 components.
Differential-to-single-ended transformers are provided for
single-ended output connections. Note that series resistors are
provided to protect against accidental output overload should a
50 Ω load be connected to the connector. Of course, the effect
of these resistors is to limit the bandwidth. If the load connected
to the SMA is >500 Ω, the 237 Ω series resistors, RX1, RX2, RX3,
RX4, RX5, RX6, RX7, and RX8, can be replaced with 0 Ω values.
Table 12. LNA External Component Values for Common
Source Impedances
RIN (Ω) RFB1, RFB2, RFB3, RFB4 (Ω, 1%) C6, C8, C10, C12 (pF)
50
2ꢀ4
22
ꢀ5
412
12
100
200
500
6 k
562
8
1.2
1.13 k
3.01 k
No resistor
No capacitor
No capacitor
Driving the VGA from an External Source or Using the
LNA to Drive an External Load
Appropriate components can be installed if the user wants to
drive the VGA directly from an external source or to evaluate
the LNA output. If the LNA is used to drive off-board loads
or cables, small value series resistors (47 Ω to 100 Ω) are
recommended for LNA decoupling. These can be installed
in the R10, R11, R14, R15, R18, R19, R22, and R23 spaces.
Provisions are made for surface-mount SMA connectors that
can be used for driving from either direction. If the LNA is not
used, it is recommended that the capacitors, C16, C17, C21,
C22, C26, C27, C31, and C32, be carefully removed to avoid
driving the outputs of the LNAs.
Figure 114. AD8334-EVALZ Assembly
MEASUREMENT SETUP
The basic board connections for measuring bandwidth are
shown in Figure 116. A 5 V, 200 mA (minimum) power supply
is required, and a low noise voltage reference supply is required
for VGAIN.
Using the Clamp Circuit
The board is shipped with no resistors installed in the spaces
provided for clamp-circuit operation. Note that each pair of
channels shares a clamp resistor. If the output clamping is
desired, the resistors are installed in R49 and R50. The peak-to-
peak clamping level is application dependent.
BOARD LAYOUT
The evaluation board circuitry uses four conductor layers. The
two inner layers are ground, and all interconnecting circuitry is
located on the outer layers. Figure 117 to Figure 120 illustrate
the copper patterns.
Rev. G | Page 48 of 56
AD8331/AD8332/AD8334
EVALUATION BOARD SCHEMATICS
INH1
+5V
L1
+5V
+5V GND1 GND2 GND3 GND4 GND5 GND6
L9
120 nH
R49
4.02kꢀ
+
C14
10 µF
LO11
L5
RX1
100ꢀ
R111
120 nH
R101
EN12
120 nH
EN34
IN1
ICR1
C17
0.1 µF
E
E
CFB1
18 nF
RFB1
274ꢀ
RX2
100ꢀ
1
2
VO1
C5
0.1 µF
C6
C57
D
D
0.1 µF
C16
0.1 µF
CR1
L10
120 nH
C1
C59
0.1 µF
22 pF
0.1 µF
3
L12
120 nH FB
57
64 63 62 61 60 59 58
56 55 54 53 52 51 50 49
+5V
C7
CFB2
18 nF
C8
L7
C75
0.1 µF
0.1 µF
INH2
120 nH
22 pF
1
2
48
INH2
COM12
47
46
45
44
43
42
L1 1
120 nH
IN2
ICR2
2
LMD2
NC
VOH1
VOL1
RFB2
274ꢀ
3
C2
0.1 µF
1
RX3
100ꢀ
R141
0ꢀ
4
CR2
LO N2
LO P2
VIP2
VPSV2
VOL2
LO21
5
3
VO2
RX4
100ꢀ
R151
0ꢀ
C22
0.1 µF
C21
0.1 µF
6
VOH2
L1 3
120 nH
7
+5V
L2
C69
0.1 µF
VIN2
VPS2
VPS3
VIN3
VIP3
COM12
120 nH
+5V
+5V
8
D
MODE 41
AD8334
SLOPE
L3
9
120 nH
L14
120 nH
U
NC3 40
39
C71
0.1 µF
10
11
12
13
14
15
16
COMM34
C26
0.1 µF
RX5
100ꢀ
38
37
36
35
C27
0.1 µF
R181
VOH3
VOL3
VPS34
VOL4
LO31
LO P3
LO N3
NC
VO3
RX6
100ꢀ
R191
C9
RFB3
274ꢀ
L15
120 nH
CFB3
18 nF
L6
120 nH
LMD3
INH3
34
33
0.1 µF
INH3
VOH4
COM34
L34
120 nH
C10
22 pF
ICR3
C3
0.1µF
IN3
+5V
23
29
1
2
17 18 19 20 21 22
24 25 26 27 28
30 31
32
C77
0.1 µF
C62
0.1 µF
C4
L16
C12
22 pF
0.1 µF
120 nH
C31
0.1 µF
3
CR3
RFB4
RX7
100ꢀ
C11
0.1 µF
CFB4
274ꢀ
HI
+5V
18 nF
C32
0.1 µF
IN4
HILO
LO
VO4
CLMP34
L4
120 nH
ICR4
RX8
100ꢀ
L8
120 nH
R221
R231
1
2
R50
4.02kꢀ
L17
120 nH
+5V
LO41
3
CR4
NOTES
1
COMPONENTS IN GRAY ARE OPTIONAL USER SUPPLIED.
NC = NO CONNECT.
2
Figure 115. AD8334-EVALZ Schematic
Rev. G | Page 49 of 56
AD8331/AD8332/AD8334
PROBE
POWER
SUPPLY
PRECISION VOLTAGE
REFERENCE (FOR VGAIN)
GAIN
CONTROL
VOLTAGE
GND
NETWORK ANALYZER
+5V
DIFFERENTIAL PROBE
POWER SUPPLY
SIGNAL INPUT
GND
Figure 116. AD8334 Typical Board Test Connections (One Channel Shown)
Rev. G | Page 50 of 56
AD8331/AD8332/AD8334
AD8334 EVALUATION BOARD PCB LAYERS
Figure 119. AD8334-EVALZ Inner Layer 1Copper
Figure 117. AD8334-EVALZ Primary Side Copper
Figure 118. AD8334-EVALZ Secondary Side Copper
Figure 120. AD8334-EVALZ Inner Layer 2 Copper
Rev. G | Page 51 of 56
AD8331/AD8332/AD8334
Figure 121. AD8334-EVALZ Component Side Silkscreen
Rev. G | Page 52 of 56
AD8331/AD8332/AD8334
OUTLINE DIMENSIONS
9.80
9.70
9.60
28
15
4.50
4.40
4.30
6.40 BSC
1
14
PIN 1
0.65
BSC
1.20 MAX
0.15
0.05
8°
0°
0.75
0.60
0.45
0.30
0.19
0.20
0.09
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AE
Figure 122. 28-Lead Thin Shrink Small Outline Package (TSSOP)
(RU-28)
Dimensions shown in millimeters
0.345 (8.76)
0.341 (8.66)
0.337 (8.55)
20
11
10
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
1
0.010 (0.25)
0.006 (0.15)
0.020 (0.51)
0.010 (0.25)
0.069 (1.75)
0.053 (1.35)
0.065 (1.65)
0.049 (1.25)
0.010 (0.25)
0.004 (0.10)
0.041 (1.04)
REF
SEATING
PLANE
8°
0°
0.025 (0.64)
BSC
0.050 (1.27)
0.016 (0.41)
COPLANARITY
0.004 (0.10)
0.012 (0.30)
0.008 (0.20)
COMPLIANT TO JEDEC STANDARDS MO-137-AD
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 123. 20-Lead Shrink Small Outline Package (QSOP)
(RQ-20)
Dimensions shown in Inches and (millimeters
Rev. G | Page 53 of 56
AD8331/AD8332/AD8334
5.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
25
24
32
1
PIN 1
INDICATOR
0.50
BSC
TOP
VIEW
3.25
3.10 SQ
2.95
EXPOSED
PAD
(BOTTOM VIEW)
4.75
BSC SQ
0.50
0.40
0.30
17
16
8
9
0.25 MIN
0.80 MAX
0.65 TYP
3.50 REF
12° MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
1.00
0.85
0.80
0.30
0.23
0.18
COPLANARITY
0.08
0.20 REF
SECTION OF THIS DATA SHEET.
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 124. 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
0.30
9.00
BSC SQ
0.25
0.18
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
64
49
48
1
PIN 1
INDICATOR
*
4.85
4.70 SQ
4.55
8.75
BSC SQ
TOP
VIEW
EXPOSED PAD
(BOTTOM VIEW)
0.50
0.40
0.30
33
32
16
17
7.50
REF
0.80 MAX
0.65 TYP
1.00
0.85
0.80
12° MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
SEATING
PLANE
SECTION OF THIS DATA SHEET.
0.50 BSC
0.20 REF
*
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 125. 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
9 mm × 9 mm Body, Very Thin Quad
(CP-64-1)
Dimensions shown in millimeters
Rev. G | Page 54 of 56
AD8331/AD8332/AD8334
ORDERING GUIDE
Model1
AD8331ARQ
AD8331ARQ-REEL
AD8331ARQ-REELꢀ
AD8331ARQZ
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Package Option
RQ-20
RQ-20
RQ-20
RQ-20
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
Evaluation Board with AD8331ARQ
AD8331ARQZ-RL
AD8331ARQZ-Rꢀ
AD8331-EVALZ
AD8332ACP-R2
AD8332ACP-REEL
AD8332ACP-REELꢀ
AD8332ACPZ-R2
AD8332ACPZ-Rꢀ
AD8332ACPZ-RL
AD8332ARU
AD8332ARU-REEL
AD8332ARU-REELꢀ
AD8332ARUZ
AD8332ARUZ-Rꢀ
AD8332ARUZ-RL
AD8332-EVALZ
AD8334ACPZ
RQ-20
RQ-20
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
Evaluation Board with AD8332ARU
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board with AD8334ACP
CP-64-1
CP-64-1
CP-64-1
AD8334ACPZ-REEL
AD8334ACPZ-REELꢀ
AD8334-EVALZ
1 Z = RoHS Compliant Part.
Rev. G | Page 55 of 56
AD8331/AD8332/AD8334
NOTES
©2003–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03199-0-10/10(G)
Rev. G | Page 56 of 56
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