AD8655_15 [ADI]
Precision CMOS Amplifier;
ADI 
Low Noise,
Precision CMOS Amplifier
Data Sheet
AD8655/AD8656
FEATURES
PIN CONFIGURATIONS
Low noise: 2.7 nV/√Hz at f = 10 kHz
Low offset voltage: 250 µV max over VCM
Offset voltage drift: 0.4 µV/°C typ and 2.3 µV/°C max
Bandwidth: 28 MHz
NC
–IN
+IN
V–
1
2
3
4
8
7
6
5
NC
V+
OUT A
–IN A
+IN A
V–
1
2
3
4
8
7
6
5
V+
AD8655
AD8656
OUT B
–IN B
+IN B
TOP VIEW
TOP VIEW
(Not to Scale)
OUT
NC
(Not to Scale)
Rail-to-rail input/output
NC = NO CONNECT
Unity gain stable
2.7 V to 5.5 V operation
−40°C to +125°C operation
Figure 2. AD8656
8-Lead MSOP (RM-8)
8-Lead SOIC (R-8)
Figure 1. AD8655
8-Lead MSOP (RM-8)
8-Lead SOIC (R-8)
Qualified for automotive applications
APPLICATIONS
ADC and DAC buffers
Audio
Industrial controls
Precision filters
Digital scales
Automotive collision avoidance
PLL filters
GENERAL DESCRIPTION
The AD8655/AD8656 are the industry’s lowest noise, precision
CMOS amplifiers. They leverage the Analog Devices DigiTrim®
technology to achieve high dc accuracy.
The high precision performance of the AD8655/AD8656 improves
the resolution and dynamic range in low voltage applications.
Audio applications, such as microphone pre-amps and audio
mixing consoles, benefit from the low noise, low distortion, and
high output current capability of the AD8655/AD8656 to reduce
system level noise performance and maintain audio fidelity. The
high precision and rail-to-rail input and output of the AD8655/
AD8656 benefit data acquisition, process controls, and PLL
filter applications.
The AD8655/AD8656 provide low noise (2.7 nV/√Hz at 10 kHz),
low THD + N (0.0007%), and high precision performance
(250 µV max over VCM) to low voltage applications. The ability
to swing rail-to-rail at the input and output enables designers
to buffer analog-to-digital converters (ADCs) and other wide
dynamic range devices in single-supply systems.
The AD8655/AD8656 are fully specified over the −40°C to
+125°C temperature range. The AD8655/AD8656 are available
in Pb-free, 8-lead MSOP and SOIC packages. The AD8655/
AD8656 are both available for automotive applications.
Rev. E
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Technical Support
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AD8655/AD8656
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Input Overvoltage Protection................................................... 16
Input Capacitance ...................................................................... 16
Driving Capacitive Loads.......................................................... 16
Layout, Grounding, and Bypassing Considerations .................. 18
Power Supply Bypassing............................................................ 18
Grounding................................................................................... 18
Leakage Currents........................................................................ 18
Outline Dimensions....................................................................... 19
Ordering Guide............................................................................... 19
Automotive Products................................................................. 19
Applications....................................................................................... 1
Pin Configurations ........................................................................... 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ...................................................................... 15
Applications Information .............................................................. 16
REVISION HISTORY
10/13—Rev. D to Rev. E
6/05—Rev. 0 to Rev. A
Changes to Figure 1 Caption and Figure 2 Caption .................... 1
Deleted Figure 3 and Figure 4; Renumbered Sequentially ......... 1
Change to General Description Section........................................ 1
Change to Figure 4 ........................................................................... 6
Change to Figure 32 ....................................................................... 10
Changes to Ordering Guide .......................................................... 19
Changes to Automotive Products Section................................... 19
Added AD8656 ...................................................................Universal
Added Figure 2 and Figure 4 ...........................................................1
Changes to Specifications.................................................................3
Changed Caption of Figure 12 and Added Figure 13...................7
Replaced Figure 16............................................................................7
Changed Caption of Figure 37 and Added Figure 38................ 11
Replaced Figure 47......................................................................... 13
Added Figure 55 ............................................................................. 14
Changes to Ordering Guide.......................................................... 18
6/13—Rev. C to Rev. D
Change to Figure 57 ....................................................................... 16
4/05—Revision 0: Initial Version
5/13—Rev. B to Rev. C
Change to Figure 57 ....................................................................... 16
9/11—Rev. A to Rev. B
Changes to Features Section............................................................ 1
Updated Outline Dimensions ....................................................... 19
Changes to Ordering Guide .......................................................... 19
Added Automotive Products Section .......................................... 19
Rev. E | Page 2 of 20
Data Sheet
AD8655/AD8656
SPECIFICATIONS
VS = 5.0 V, VCM = VS/2, TA = 25°C, unless otherwise specified.
Table 1.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
INPUT CHARACTERISTICS
Offset Voltage
VOS
VCM = 0 V to 5 V
−40°C ≤ TA ≤ +125°C
−40°C ≤ TA ≤ +125°C
50
250
550
2.3
10
500
10
µV
µV
µV/°C
pA
pA
pA
pA
V
Offset Voltage Drift
Input Bias Current
ΔVOS/ΔT
IB
0.4
1
−40°C ≤ TA ≤ +125°C
−40°C ≤ TA≤ +125°C
Input Offset Current
IOS
500
5
Input Voltage Range
0
Common-Mode Rejection Ratio
Large Signal Voltage Gain
CMRR
AVO
VCM = 0 V to 5 V
VO = 0.2 V to 4.8 V, RL = 10 kΩ, VCM = 0 V
−40°C ≤ TA ≤ +125°C
85
100
95
100
110
dB
dB
dB
OUTPUT CHARACTERISTICS
Output Voltage High
Output Voltage Low
Output Current
VOH
VOL
IOUT
IL = 1 mA; −40°C ≤ TA ≤ +125°C
IL = 1 mA; −40°C ≤ TA ≤ +125°C
VOUT = 0.5 V
4.97
4.991
8
220
V
mV
mA
30
POWER SUPPLY
Power Supply Rejection Ratio
Supply Current/Amplifier
PSRR
ISY
VS = 2.7 V to 5.0 V
VO = 0 V
−40°C ≤ TA ≤ +125°C
88
105
3.7
dB
mA
mA
4.5
5.3
INPUT CAPACITANCE
Differential
Common-Mode
CIN
9.3
16.7
pF
pF
NOISE PERFORMANCE
Input Voltage Noise Density
en
f = 1 kHz
4
nV/√Hz
nV/√Hz
%
f = 10 kHz
2.7
Total Harmonic Distortion + Noise
FREQUENCY RESPONSE
Gain Bandwidth Product
Slew Rate
Settling Time
Phase Margin
THD + N
G = 1, RL = 1 kΩ, f = 1 kHz, VIN = 2 V p-p
0.0007
GBP
SR
ts
28
11
370
69
MHz
V/µs
ns
RL = 10 kΩ
To 0.1%, VIN = 0 V to 2 V step, G = +1
CL = 0 pF
degrees
Rev. E | Page 3 of 20
AD8655/AD8656
Data Sheet
VS = 2.7 V, VCM = VS/2, TA = 25°C, unless otherwise specified.
Table 2.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
INPUT CHARACTERISTICS
Offset Voltage
VOS
VCM = 0 V to 2.7 V
−40°C ≤ TA ≤ +125°C
−40°C ≤ TA ≤ +125°C
44
250
550
2.0
10
500
10
µV
µV
µV/°C
pA
pA
pA
pA
V
Offset Voltage Drift
Input Bias Current
ΔVOS/ΔT
IB
0.4
1
−40°C ≤ TA ≤ +125°C
−40°C ≤ TA ≤ +125°C
Input Offset Current
IOS
500
2.7
Input Voltage Range
0
Common-Mode Rejection Ratio
Large Signal Voltage Gain
CMRR
AVO
VCM = 0 V to 2.7 V
VO = 0.2 V to 2.5 V, RL = 10 kΩ, VCM = 0 V
−40°C ≤ TA ≤ +125°C
80
98
90
98
dB
dB
dB
OUTPUT CHARACTERISTICS
Output Voltage High
Output Voltage Low
Output Current
VOH
VOL
IOUT
IL = 1 mA; −40°C ≤ TA ≤ +125°C
IL = 1 mA; −40°C ≤ TA ≤ +125°C
VOUT = 0.5 V
2.67
2.688
10
75
V
mV
mA
30
POWER SUPPLY
Power Supply Rejection Ratio
Supply Current/Amplifier
PSRR
ISY
VS = 2.7 V to 5.0 V
VO = 0 V
−40°C ≤ TA ≤ +125°C
88
105
3.7
dB
mA
mA
4.5
5.3
INPUT CAPACITANCE
Differential
Common-Mode
CIN
9.3
16.7
pF
pF
NOISE PERFORMANCE
Input Voltage Noise Density
en
f = 1 kHz
4.0
nV/√Hz
nV/√Hz
%
f = 10 kHz
2.7
Total Harmonic Distortion + Noise
FREQUENCY RESPONSE
Gain Bandwidth Product
Slew Rate
Settling Time
Phase Margin
THD + N
G = 1, RL = 1kΩ, f = 1 kHz, VIN = 2 V p-p
0.0007
GBP
SR
ts
27
MHz
V/µs
ns
RL = 10 kΩ
To 0.1%, VIN = 0 to 1 V step, G = +1
CL = 0 pF
8.5
370
54
degrees
Rev. E | Page 4 of 20
Data Sheet
AD8655/AD8656
ABSOLUTE MAXIMUM RATINGS
Table 3.
Table 4.
1
Package Type
8-Lead MSOP (RM)
8-Lead SOIC (R)
θJA
θJC
45
43
Unit
°C/W
°C/W
Parameter
Rating
210
158
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
to GND
6 V
VSS − 0.3 V to VDD + 0.3 V
6 V
Indefinite
1 θJA is specified for worst-case conditions; that is, θJA is specified for a device
soldered in the circuit board for surface-mount packages.
Electrostatic Discharge (HBM)
Storage Temperature Range
R, RM Packages
3.0 kV
−65°C to +150°C
ESD CAUTION
Junction Temperature Range
R, RM Packages
Lead Temperature
(Soldering, 10 sec)
−65°C to +150°C
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. E | Page 5 of 20
AD8655/AD8656
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
60
20
10
V
S
= ±2.5V
V
S
= ±2.5V
50
40
30
20
0
–10
10
0
–20
–30
–150
–100
–50
0
50
100
150
0
1
2
3
4
5
6
V
(µV)
OS
COMMON-MODE VOLTAGE (V)
Figure 3. Input Offset Voltage Distribution
Figure 6. Input Offset Voltage vs. Common-Mode Voltage
250
200
250
200
150
100
V
V
= ±2.5V
S
V
= ±2.5V
S
= 0V
CM
150
100
50
0
–50
–100
–150
–200
–250
+3σ
50
0
TYPICAL
–3σ
–50
–25
0
25
50
75
100
125
150
0
20
40
60
80
100
120
140
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 7. Input Bias Current vs. Temperature
Figure 4. Input Offset Voltage vs. Temperature
60
50
40
30
20
4.0
3.5
3.0
V
S
= ±2.5V
V
= ±2.5V
S
2.5
2.0
1.5
1.0
0.5
0
10
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
1
2
3
4
5
6
|TCV | (µV/°C)
SUPPLY VOLTAGE (V)
OS
Figure 8. Supply Current vs. Supply Voltage
Figure 5. |TCVOS | Distribution
Rev. E | Page 6 of 20
Data Sheet
AD8655/AD8656
4.5
4.996
4.994
4.992
4.990
V
= ±2.5V
V
= ±2.5V
S
S
LOAD CURRENT = 1mA
4.0
3.5
3.0
4.988
4.986
4.984
4.982
2.5
2.0
–50
0
50
100
150
–50
0
50
TEMPERATURE (°C)
100
150
TEMPERATURE (°C)
Figure 12. Output Voltage Swing High vs. Temperature
Figure 9. Supply Current vs. Temperature
12
10
8
2500
2000
1500
1000
LOAD CURRENT = 1mA
V
= ±2.5V
S
V
= ±2.5V
S
V
OH
6
V
OL
4
2
500
0
–50
0
50
100
150
0
50
100
150
200
250
TEMPERATURE (°C)
CURRENT LOAD (mA)
Figure 13. Output Voltage Swing Low vs. Temperature
Figure 10. AD8655 Output Voltage to Supply Rail vs. Current Load
120
100
10000
V
V
R
C
= ±2.5V
= 28mV
= 1MΩ
= 47pF
V
= ±2.5V
S
S
IN
L
L
1000
100
10
80
60
40
20
0
V
OL
V
OH
1
100
1k
10k
100k
1M
10M
0.1
1
10
100
1000
FREQUENCY (Hz)
CURRENT LOAD (mA)
Figure 11. AD8656 Output Swing vs. Current Load
Figure 14. CMRR vs. Frequency
Rev. E | Page 7 of 20
AD8655/AD8656
Data Sheet
100
10
1
110.00
107.00
104.00
101.00
98.00
V
V
= ±2.5V
S
V
= ±2.5V
S
= 0V
CM
95.00
92.00
–50
0
50
100
150
1
10
100
1k
10k
100k
TEMPERATURE (°C)
FREQUENCY (Hz)
Figure 15. Large Signal CMRR vs. Temperature
Figure 18. Voltage Noise Density vs. Frequency
100
80
+PSRR
V
= ±2.5V
S
V
V
R
C
= ±2.5V
= 50mV
= 1MΩ
S
Vn (p-p) = 1.23µV
IN
L
L
–PSRR
= 47pF
60
1
40
20
0
1s/DIV
100
1k
10k
100k
1M
10M
100M
FREQUENCY (Hz)
Figure 16. Small Signal PSSR vs. Frequency
Figure 19. Low Frequency Noise (0.1 Hz to 10 Hz).
110.00
108.00
106.00
104.00
102.00
100.00
T
V
V
IN
V
C
= ±2.5V
= 50pF
S
V
= ±2.5V
S
L
GAIN = +1
OUT
2
20µs/DIV
–50
0
50
100
150
TEMPERATURE (°C)
Figure 17. Large Signal PSSR vs. Temperature
Figure 20. No Phase Reversal
Rev. E | Page 8 of 20
Data Sheet
AD8655/AD8656
–45
6
5
4
3
2
120
100
80
V
V
= ±2.5V
= 5V
V
C
= ±2.5V
S
S
= 11.5pF
IN
LOAD
PHASE MARGIN = 69°
G = +1
–90
60
40
20
–135
–180
–225
0
–20
–40
1
0
10k
100k
1M
10M
10k
100k
1M
FREQUENCY (Hz)
10M
100M
FREQUENCY (Hz)
Figure 21. Open-Loop Gain and Phase vs. Frequency
Figure 24. Maximum Output Swing vs. Frequency
140.00
130.00
120.00
110.00
T
V
C
= ±2.5V
= 100pF
S
V
R
= ±2.5V
= 10kΩ
S
L
L
GAIN = +1
V = 4V
IN
2
100.00
90.00
TIME (10µs/DIV)
–50
0
50
100
150
TEMPERATURE (°C)
Figure 22. Large Signal Open-Loop Gain vs. Temperature
Figure 25. Large Signal Response
50
40
30
20
T
V
R
C
= ±2.5V
= 1MΩ
= 47pF
V
C
= ±2.5V
= 100pF
S
S
L
L
L
G = +1
2
10
0
–10
–20
1k
10k
100k
1M
10M
100M
TIME (1µs/DIV)
FREQUENCY (Hz)
Figure 23. Closed-Loop Gain vs. Frequency
Figure 26. Small Signal Response
Rev. E | Page 9 of 20
AD8655/AD8656
Data Sheet
30
100
10
V
= ±2.5V
S
V
V
= ±2.5V
= 200mV
S
IN
25
20
15
10
G = +1
G = +100
G = +10
–OS
1
+OS
5
0
0.1
100
0
50
100
150
200
250
300
350
1k
10k
100k
1M
10M
100M
FREQUENCY (Hz)
CAPACITANCE (pF)
Figure 27. Small Signal Overshoot vs. Load Capacitance
Figure 30. Output Impedance vs. Frequency
80
70
60
T
V
= ±1.35V
300mV
S
V
IN
1
2
0V
0V
50
40
V
OUT
V
V
= ±2.5V
= 300mV
S
30
20
10
0
IN
GAIN = –10
RECOVERY TIME = 240ns
–2.5V
400ns/DIV
–150 –125 –100 –75 –50 –25
V
0
25 50 75 100 125 150
(µV)
OS
Figure 28. Negative Overload Recovery Time
Figure 31. Input Offset Voltage Distribution
250
200
T
V
V
= ±1.35V
S
1
0V
= 0V
CM
V
IN
150
100
50
V
V
= ±2.5V
= 300mV
S
IN
–300mV
2.5V
GAIN = –10
RECOVERY TIME = 240ns
0
V
OUT
–50
–100
–150
–200
–250
2
+3σ
0V
TYPICAL
–3σ
400ns/DIV
–50
–25
0
25
50
75
100
125
150
TEMPERATURE (°C)
Figure 29. Positive Overload Recovery Time
Figure 32. Input Offset Voltage vs. Temperature
Rev. E | Page 10 of 20
Data Sheet
AD8655/AD8656
10000
1000
100
10
80
70
60
V
= ±1.35V
V
= ±1.35V
S
S
50
40
30
20
10
0
V
OL
V
OH
1
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1
10
100
|TCV | (µV/°C)
CURRENT LOAD (mA)
OS
Figure 33. |TCVOS| Distribution
Figure 36. AD8656 Output Swing vs. Current Load
4.5
4.0
3.5
3.0
2.698
2.694
2.690
2.686
2.682
V
= ±1.35V
S
V
= ±1.35V
S
LOAD CURRENT = 1mA
2.5
2.0
2.678
2.674
–50
0
50
TEMPERATURE (°C)
100
150
–50
0
50
100
150
TEMPERATURE (°C)
Figure 37. Output Voltage Swing High vs. Temperature
Figure 34. Supply Current vs. Temperature
14
12
10
8
1400
V
= ±1.35V
S
V
= ±1.35V
S
LOAD CURRENT = 1mA
1200
1000
800
V
OH
600
400
200
0
6
V
OL
4
2
–50
0
50
TEMPERATURE (°C)
100
150
0
20
40
60
80
100
120
LOAD CURRENT (mA)
Figure 38. Output Voltage Swing Low vs. Temperature
Figure 35. AD8655 Output Voltage to Supply Rail vs. Load Current
Rev. E | Page 11 of 20
AD8655/AD8656
Data Sheet
35
30
25
20
15
10
5
T
V
= ±1.35V
S
V
V
= ±1.35V
= 200mV
G = +1
C
S
= 50pF
IN
L
V
IN
–OS
V
OUT
2
+OS
0
20µs/DIV
0
50
100
150
200
250
300
350
CAPACITANCE (pF)
Figure 42. Small Signal Overshoot vs. Load Capacitance
Figure 39. No Phase Reversal
T
T
V
C
= ±1.35V
= 50pF
S
200mV
L
GAIN = +1
V
IN
0V
1
2
2
0V
V
OUT
–1.35V
V
V
= ±1.35V
= 200mV
S
IN
GAIN = –10
RECOVERY TIME = 180ns
400ns/DIV
TIME (10µs/DIV)
Figure 43. Negative Overload Recovery Time
Figure 40. Large Signal Response
T
T
V
C
= ±1.35V
= 100pF
S
1
0V
L
V
IN
GAIN = +1
V
V
= ±1.35V
= 200mV
S
–200mV
IN
GAIN = –10
RECOVERY TIME = 200ns
2
1.35V
V
OUT
0V
2
TIME (1µs/DIV)
400ns/DIV
Figure 41. Small Signal Response
Figure 44. Positive Overload Recovery Time
Rev. E | Page 12 of 20
Data Sheet
AD8655/AD8656
120
120
100
–45
V
C
= ±1.35V
V
V
R
C
= ±1.35V
= 28mV
= 1MΩ
S
S
= 11.5pF
LOAD
IN
100
PHASE MARGIN = 54°
L
L
= 47pF
–90
80
60
40
80
60
40
20
–135
–180
–225
20
0
–20
–40
0
100
10k
100k
1M
10M
100M
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 45. CMRR vs. Frequency
Figure 48. Open-Loop Gain and Phase vs. Frequency
102.00
98.00
94.00
90.00
130.00
120.00
110.00
V
= ±1.35V
V
R
= ±1.35V
= 10kΩ
S
S
L
100.00
90.00
80.00
86.00
–50
0
50
100
150
–50
0
50
100
150
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 46. Large Signal CMRR vs. Temperature
Figure 49. Large Signal Open-Loop Gain vs. Temperature
50
40
100
80
V
V
R
C
= ±1.35V
= 50mV
= 1MΩ
V
R
C
= ±1.35V
= 1MΩ
= 47pF
S
S
IN
L
L
+PSRR
L
L
= 47pF
–PSRR
30
60
20
10
40
0
20
0
–10
–20
100
1k
10k
100k
1M
10M
100M
1k
10k
100k
1M
10M
100M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 47. Small Signal PSSR vs. Frequency
Figure 50. Closed-Loop Gain vs. Frequency
Rev. E | Page 13 of 20
AD8655/AD8656
Data Sheet
0
–20
3.0
V
V
= ±2.5V
= 50mV
S
R1
IN
10kΩ
+2.5V
V+
R2
100Ω
2.5
V–
V
V
= 1.35V
= 2.7V
+
–
S
VIN
50mV p-p
A
B
VOUT
V–
–2.5V
IN
–40
V+
2.0
1.5
1.0
G = +1
NO LOAD
–60
–80
–100
0.5
0
–120
–140
10k
100k
FREQUENCY (Hz)
1M
10M
10
100
1k
10k
100k
1M
10M
100M
FREQUENCY (Hz)
Figure 53. Channel Separation vs. Frequency
Figure 51. Maximum Output Swing vs. Frequency
1000
100
10
V
= ±1.35V
S
G = +100
G = +10
G = +1
1
0.1
100
1k
10k
100k
1M
10M
100M
FREQUENCY (Hz)
Figure 52. Output Impedance vs. Frequency
Rev. E | Page 14 of 20
Data Sheet
AD8655/AD8656
THEORY OF OPERATION
The AD8655/AD8656 amplifiers are voltage feedback, rail-to-rail
input and output precision CMOS amplifiers, which operate
from 2.7 V to 5.0 V of power supply voltage. These amplifiers
use the Analog Devices DigiTrim technology to achieve a higher
degree of precision than is available from most CMOS amplifiers.
DigiTrim technology, used in a number of Analog Devices
amplifiers, is a method of trimming the offset voltage of the
amplifier after it is packaged. The advantage of post-package
trimming is that it corrects any offset voltages caused by the
mechanical stresses of assembly.
The AD8655/AD8656 can be used in any precision op amp
application. The amplifier does not exhibit phase reversal for
common-mode voltages within the power supply. The AD8655/
AD8656 are great choices for high resolution data acquisition
systems with voltage noise of 2.7 nV/√Hz and THD + Noise of
–103 dB for a 2 V p-p signal at 10 kHz. Their low noise, sub-pA
input bias current, precision offset, and high speed make them
superb preamps for fast filter applications. The speed and output
drive capability of the AD8655/AD8656 also make them useful
in video applications.
The AD8655/AD8656 are available in standard op amp pinouts,
making DigiTrim completely transparent to the user. The input
stage of the amplifiers is a true rail-to-rail architecture, allowing
the input common-mode voltage range of the amplifiers to
extend to both positive and negative supply rails. The open-
loop gain of the AD8655/AD8656 with a load of 10 kΩ is
typically 110 dB.
Rev. E | Page 15 of 20
AD8655/AD8656
Data Sheet
APPLICATIONS INFORMATION
One simple technique for compensation is a snubber that
INPUT OVERVOLTAGE PROTECTION
consists of a simple RC network. With this circuit in place,
output swing is maintained, and the amplifier is stable at all
gains. Figure 55 shows the implementation of a snubber, which
reduces overshoot by more than 30% and eliminates ringing.
Using a snubber does not recover the loss of bandwidth
incurred from a heavy capacitive load.
The internal protective circuitry of the AD8655/AD8656 allows
voltages exceeding the supply to be applied at the input. It is
recommended, however, not to apply voltages that exceed the
supplies by more than 0.3 V at either input of the amplifier. If a
higher input voltage is applied, series resistors should be used to
limit the current flowing into the inputs. The input current
should be limited to less than 5 mA.
V
A
C
= ±2.5V
= 1
S
V
L
= 500pF
The extremely low input bias current allows the use of larger
resistors, which allows the user to apply higher voltages at the
inputs. The use of these resistors adds thermal noise, which
contributes to the overall output voltage noise of the amplifier.
For example, a 10 kΩ resistor has less than 12.6 nV/√Hz of
thermal noise and less than 10 nV of error voltage at room
temperature.
INPUT CAPACITANCE
Along with bypassing and ground, high speed amplifiers can be
sensitive to parasitic capacitance between the inputs and ground.
For circuits with resistive feedback network, the total capacitance,
whether it is the source capacitance, stray capacitance on the
input pin, or the input capacitance of the amplifier, causes a
breakpoint in the noise gain of the circuit. As a result, a
capacitor must be added in parallel with the gain resistor to
obtain stability. The noise gain is a function of frequency and
peaks at the higher frequencies, assuming the feedback capaci-
tor is selected to make the second-order system critically damped.
A few picofarads of capacitance at the input reduce the input
impedance at high frequencies, which increases the amplifier’s
gain, causing peaking in the frequency response or oscillations.
With the AD8655/AD8656, additional input damping is required
for stability with capacitive loads greater than 200 pF with
direct input to output feedback. See the Driving Capacitive
Loads section.
TIME (2µs/DIV)
Figure 54. Driving Heavy Capacitive Loads Without Compensation
V
CC
–IN
+IN
–
+
200Ω
500pF
+
–
500pF
V
EE
200mV
Figure 55. Snubber Network
V
= ±2.5V
= 1
= 200Ω
= 500pF
= 500pF
S
A
R
C
C
V
S
S
L
DRIVING CAPACITIVE LOADS
Although the AD8655/AD8656 can drive capacitive loads up to
500 pF without oscillating, a large amount of ringing is present
when operating the part with input frequencies above 100 kHz.
This is especially true when the amplifiers are configured in
positive unity gain (worst case). When such large capacitive
loads are required, the use of external compensation is highly
recommended. This reduces the overshoot and minimizes
ringing, which, in turn, improves the stability of the AD8655/
AD8656 when driving large capacitive loads.
TIME (10µs/DIV)
Figure 56. Driving Heavy Capacitive Loads Using a Snubber Network
Rev. E | Page 16 of 20
Data Sheet
AD8655/AD8656
1.0
0.5
THD Readings vs. Common-Mode Voltage
SWEEP 1:
SWEEP 2:
Total harmonic distortion of the AD8655/AD8656 is well below
0.0007% with a load of 1 kΩ. This distortion is a function of the
circuit configuration, the voltage applied, and the layout, in
addition to other factors.
V
R
= 2V p-p
= 10kΩ
V
R
= 2V p-p
= 1kΩ
IN
IN
0.2
0.1
L
L
0.05
0.02
0.01
+2.5V
–
0.005
V
OUT
0.002
0.001
AD8655
R
+
SWEEP 2
SWEEP 1
L
0.0005
–2.5V
V
IN
0.0002
0.0001
20
50
100 200 500
1k 2k 5k
Hz
10k 20k 50k 80k
Figure 57. THD + N Test Circuit
Figure 58. THD + Noise vs. Frequency
Rev. E | Page 17 of 20
AD8655/AD8656
Data Sheet
LAYOUT, GROUNDING, AND BYPASSING CONSIDERATIONS
LEAKAGE CURRENTS
POWER SUPPLY BYPASSING
Poor PC board layout, contaminants, and the board insulator
material can create leakage currents that are much larger than
the input bias current of the AD8655/AD8656. Any voltage
differential between the inputs and nearby traces creates leakage
currents through the PC board insulator, for example, 1 V/100
GΩ = 10 pA. Similarly, any contaminants on the board can
create significant leakage (skin oils are a common problem).
Power supply pins can act as inputs for noise, so care must be
taken to apply a noise-free, stable dc voltage. The purpose of
bypass capacitors is to create low impedances from the supply
to ground at all frequencies, thereby shunting or filtering most
of the noise. Bypassing schemes are designed to minimize the
supply impedance at all frequencies with a parallel combination
of capacitors with values of 0.1 µF and 4.7 µF. Chip capacitors
of 0.1 µF (X7R or NPO) are critical and should be as close as
possible to the amplifier package. The 4.7 µF tantalum capacitor
is less critical for high frequency bypassing, and, in most cases,
only one is needed per board at the supply inputs.
To significantly reduce leakage, put a guard ring (shield) around
the inputs and input leads that are driven to the same voltage
potential as the inputs. This ensures there is no voltage potential
between the inputs and the surrounding area to create any
leakage currents. To be effective, the guard ring must be driven
by a relatively low impedance source and should completely
surround the input leads on all sides, above and below, by using
a multilayer board.
GROUNDING
A ground plane layer is important for densely packed PC
boards to minimize parasitic inductances. This minimizes
voltage drops with changes in current. However, an under-
standing of where the current flows in a circuit is critical to
implementing effective high speed circuit design. The length
of the current path is directly proportional to the magnitude
of parasitic inductances, and, therefore, the high frequency
impedance of the path. Large changes in currents in an
inductive ground return create unwanted voltage noise.
The charge absorption of the insulator material itself can also
cause leakage currents. Minimizing the amount of material
between the input leads and the guard ring helps to reduce the
absorption. Also, using low absorption materials, such as
Teflon® or ceramic, may be necessary in some instances.
The length of the high frequency bypass capacitor leads is
critical, and, therefore, surface-mount capacitors are recom-
mended. A parasitic inductance in the bypass ground trace
works against the low impedance created by the bypass
capacitor. Because load currents flow from the supplies, the
ground for the load impedance should be at the same physical
location as the bypass capacitor grounds. For larger value
capacitors intended to be effective at lower frequencies, the
current return path distance is less critical.
Rev. E | Page 18 of 20
Data Sheet
AD8655/AD8656
OUTLINE DIMENSIONS
3.20
3.00
2.80
5.00 (0.1968)
4.80 (0.1890)
8
1
5
4
6.20 (0.2441)
5.80 (0.2284)
4.00 (0.1574)
3.80 (0.1497)
8
1
5
4
5.15
4.90
4.65
3.20
3.00
2.80
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
BSC
45°
PIN 1
IDENTIFIER
1.75 (0.0688)
1.35 (0.0532)
0.25 (0.0098)
0.10 (0.0040)
8°
0°
0.65 BSC
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
0.95
0.85
0.75
15° MAX
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
1.10 MAX
SEATING
PLANE
0.80
0.55
0.40
0.15
0.05
0.23
0.09
6°
0°
COMPLIANT TO JEDEC STANDARDS MS-012-AA
0.40
0.25
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 60. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Figure 59. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-8)
Dimensions shown in millimeters
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model1, 2
Temperature Range Package Description
Package Option
Branding
AD8655ARZ
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
R-8
R-8
R-8
RM-8
RM-8
RM-8
R-8
R-8
R-8
AD8655ARZ-REEL
AD8655ARZ-REEL7
AD8655ARMZ-REEL
AD8655ARMZ
AD8655WARMZ-RL
AD8656ARZ
AD8656ARZ-REEL
AD8656ARZ-REEL7
AD8656ARMZ
AD8656ARMZ-REEL
AD8656WARMZ-REEL
A0D
A0D
A0D
RM-8
RM-8
RM-8
A0S
A0S
A0S
1 Z = RoHS Compliant Part.
2 W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The AD8655W model and the AD8656W model are available with controlled manufacturing to support the quality and reliability
requirements of automotive applications. Note that these automotive models may have specifications that differ from the commercial
models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products
shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product
ordering information and to obtain the specific Automotive Reliability reports for this model.
Rev. E | Page 19 of 20
AD8655/AD8656
NOTES
Data Sheet
©2005–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05304-0-10/13(E)
Rev. E | Page 20 of 20
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