AD9122 [ADI]

Dual, 16-Bit, 1200 MSPS, TxDAC+® Digital-to-Analog Converter; 双通道, 16位, 1200 MSPS ,通道TxDAC + ®数字 - 模拟转换器
AD9122
型号: AD9122
厂家: ADI    ADI
描述:

Dual, 16-Bit, 1200 MSPS, TxDAC+® Digital-to-Analog Converter
双通道, 16位, 1200 MSPS ,通道TxDAC + ®数字 - 模拟转换器

转换器
文件: 总56页 (文件大小:910K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Dual, 16-Bit, 1200 MSPS,  
TxDAC+® Digital-to-Analog Converter  
AD9122  
FEATURES  
GENERAL DESCRIPTION  
Flexible LVDS interface allows word, byte, or nibble load  
Single-carrier W-CDMA ACLR = 82 dBc @ 122.88 MHz IF  
The AD9122 is a dual 16-bit, high dynamic range, digital-to-  
analog converter (DAC) that provides a sample rate of 1200 MSPS,  
Analog output: adjustable 8.7 mA to 31.7 mA, RL = 25 Ω to 50 Ω  
Novel 2×/4×/8× interpolator/complex modulator allows  
carrier placement anywhere in the DAC bandwidth  
Digital gain and phase adjustment for sideband suppression  
Multiple chip synchronization interfaces  
High performance, low noise PLL clock multiplier  
Digital inverse sinc filter  
Flexible LVDS interface allows word, byte, or nibble load  
Low power: 1.5 W @ 1.2 GSPS, 800 mW @ 500 MSPS, full  
operating conditions  
permitting a multicarrier generation up to the Nyquist frequency.  
It includes features optimized for direct conversion transmit  
applications, including complex digital modulation, and gain and  
offset compensation. The DAC outputs are optimized to interface  
seamlessly with analog quadrature modulators, such as the  
ADL537x F-MOD series from Analog Devices, Inc. A 4-wire  
serial port interface provides for programming/readback of many  
internal parameters. Full-scale output current can be programmed  
over a range of 8.7 mA to 31.7 mA. The AD9122 comes in a  
72-lead LFCSP.  
72-lead, exposed paddle LFCSP  
PRODUCT HIGHLIGHTS  
1. Ultralow noise and intermodulation distortion (IMD)  
enable high quality synthesis of wideband signals from  
baseband to high intermediate frequencies.  
2. A proprietary DAC output switching technique enhances  
dynamic performance.  
APPLICATIONS  
Wireless infrastructure  
W-CDMA, CDMA2000, TD-SCDMA, WiMAX, GSM, LTE  
Digital high or low IF synthesis  
Transmit diversity  
Wideband communications: LMDS/MMDS, point-to-point  
3. The current outputs are easily configured for various  
single-ended or differential circuit topologies.  
4. Flexible LVDS digital interface allows the standard 32-wire  
bus to be reduced to ½ or ¼ of the width.  
TYPICAL SIGNAL CHAIN  
COMPLEX BASEBAND  
DC  
COMPLEX IF  
RF  
f
LO – f  
IF  
IF  
I DAC  
2
2
2/4  
2/4  
SIN  
DIGITAL  
ANTIALIASING  
FILTER  
PA  
BASEBAND  
AQM  
LO  
PROCESSOR  
COS  
Q DAC  
NOTES  
1. AQM = ANALOG QUADRATURE MODULATOR.  
Figure 1.  
Rev. 0  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2009 Analog Devices, Inc. All rights reserved.  
 
AD9122  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
NCO Modulation ....................................................................... 37  
Datapath Configuration ............................................................ 37  
Determining Interpolation Filter Modes ................................ 38  
Datapath Configuration Example............................................ 39  
Data Rates vs. Interpolation Modes......................................... 40  
Coarse Modulation Mixing Sequences.................................... 40  
Quadrature Phase Correction................................................... 41  
DC Offset Correction ................................................................ 41  
Inverse Sinc Filter....................................................................... 41  
DAC Input Clock Configurations................................................ 42  
DAC Input Clock Configurations............................................ 42  
Analog Outputs............................................................................... 44  
Transmit DAC Operation.......................................................... 44  
Auxiliary DAC Operation......................................................... 45  
Baseband Filter Implementation.............................................. 46  
Driving the ADL5375-15 .......................................................... 46  
Reducing LO Leakage and Unwanted Sidebands .................. 47  
Device Power Dissipation.............................................................. 48  
Temperature Sensor ................................................................... 49  
Multichip Synchronization............................................................ 50  
Synchronization with Clock Multiplication............................... 50  
Synchronization with Direct Clocking.................................... 51  
Data Rate Mode Synchronization ............................................ 51  
FIFO Rate Mode Synchronization ........................................... 52  
Additional Synchronization Features ...................................... 52  
Interrupt Request Operation ........................................................ 54  
Interrupt Service Routine.......................................................... 54  
Interface Timing Validation.......................................................... 55  
SED Operation............................................................................ 55  
SED Example .............................................................................. 55  
Outline Dimensions....................................................................... 56  
Ordering Guide .......................................................................... 56  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Product Highlights ........................................................................... 1  
Typical Signal Chain......................................................................... 1  
Revision History ............................................................................... 2  
Functional Block Diagram .............................................................. 3  
Specifications..................................................................................... 4  
DC Specifications ......................................................................... 4  
Digital Specifications ................................................................... 5  
Digital Input Data Timing Specifications ................................. 5  
AC Specifications.......................................................................... 6  
Absolute Maximum Ratings............................................................ 7  
Thermal Resistance ...................................................................... 7  
ESD Caution.................................................................................. 7  
Pin Configuration and Function Descriptions............................. 8  
Typical Performance Characteristics ........................................... 10  
Terminology .................................................................................... 16  
Theory of Operation ...................................................................... 17  
Serial Port Operation................................................................. 17  
Data Format ................................................................................ 17  
Serial Port Pin Descriptions...................................................... 17  
Serial Port Options..................................................................... 18  
Device Configuration Register Map and Descriptions ......... 19  
LVDS Input Data Ports .................................................................. 31  
Word Interface Mode................................................................. 31  
Byte Interface Mode ................................................................... 31  
Nibble Interface Mode ............................................................... 31  
FIFO Operation.......................................................................... 31  
Interface Timing......................................................................... 33  
Digital Datapath.............................................................................. 34  
Premodulation ............................................................................ 34  
Interpolation Filters ................................................................... 34  
REVISION HISTORY  
9/09—Revision 0: Initial Version  
Rev. 0 | Page 2 of 56  
 
AD9122  
FUNCTIONAL BLOCK DIAGRAM  
IOUT1P  
IOUT1N  
16  
1.2G  
AUX  
DAC 1  
16-BIT  
16  
D15P—D15N  
I OFFSET  
f
/2  
PRE  
MOD  
NCO  
AND  
MOD  
DATA  
10  
INV  
SINC  
DAC CLK  
FIFO  
HB1  
HB2  
HB3  
Q OFFSET  
16  
D0P—D0N  
DCI  
IOUT2P  
IOUT2N  
16  
1.2G  
FRAME  
AUX  
DAC 1  
16-BIT  
REF  
REFIO  
FSADJ  
10  
10  
AND  
BIAS  
INTERNAL CLOCK TIMING AND CONTROL LOGIC  
DAC CLK_SEL  
PLL CONTROL  
DAC_CLK  
DACCLKP  
DACCLKN  
CLK  
0
RCVR  
SERIAL  
INPUT/OUTPUT  
PORT  
SYNC  
PROGRAMMING  
REGISTERS  
POWER-ON  
RESET  
MULTICHIP  
SYNCHRONIZATION  
CLOCK  
MULTIPLIER  
(2× TO 16×)  
REFCLKP  
REFCLKN  
CLK  
RCVR  
1
PLL_LOCK  
Figure 2. AD9122 Functional Block Diagram  
Rev. 0 | Page 3 of 56  
 
AD9122  
SPECIFICATIONS  
DC SPECIFICATIONS  
TMIN to TMAX, AVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 =1.8 V, IOUTFS = 20 mA, maximum sample rate, unless otherwise noted.  
Table 1.  
Parameter  
Min  
Typ  
Max  
Unit  
RESOLUTION  
16  
Bits  
ACCURACY  
Differential Nonlinearity (DNL)  
Integral Nonlinearity (INL)  
MAIN DAC OUTPUTS  
Offset Error  
Gain Error (with Internal Reference)  
Full-Scale Output Current1  
Output Compliance Range  
Output Resistance  
2.1  
3.ꢀ  
LSB  
LSB  
−0.001  
−3.6  
8.66  
0
+0.001  
+3.6  
31.66  
+1.0  
% FSR  
% FSR  
mA  
V
MΩ  
2
19.6  
−1.0  
10  
Gain DAC Monotonicity  
Settling Time to Within 0.5 LSB  
MAIN DAC TEMPERATURE DRIFT  
Offset  
Gain  
Reference Voltage  
Guaranteed  
20  
ns  
0.04  
100  
30  
ppm/°C  
ppm/°C  
ppm/°C  
REFERENCE  
Internal Reference Voltage  
Output Resistance  
1.2  
5
V
kΩ  
ANALOG SUPPLY VOLTAGES  
AVDD33  
CVDD18  
3.13  
1.ꢀ1  
3.3  
1.8  
3.4ꢀ  
1.89  
V
V
DIGITAL SUPPLY VOLTAGES  
DVDD18  
IOVDD  
1.ꢀ1  
1.ꢀ1  
1.8  
1.8/2.5  
1.89  
2.94  
V
V
POWER CONSUMPTION  
2× Mode, fDAC = 491.22 MSPS, IF = 10 MHz, PLL Off  
2× Mode, fDAC = 491.22 MSPS, IF = 10 MHz, PLL On  
8× Mode, fDAC = 800 MSPS, IF = 10 MHz, PLL Off  
AVDD33  
834  
913  
1135  
55  
mW  
mW  
mW  
mA  
1241  
5ꢀ  
CVDD18  
85  
90  
mA  
DVDD18  
444  
2.5  
495  
9.8  
+0.3  
+85  
mA  
Power-Down Mode  
Power Supply Rejection Ratio, AVDD33  
OPERATING RANGE  
mW  
% FSR/V  
°C  
−0.3  
−40  
+25  
1 Based on a 10 kΩ external resistor.  
Rev. 0 | Page 4 of 56  
 
AD9122  
DIGITAL SPECIFICATIONS  
TMIN to TMAX, AVDD33 = 1.8 V, IOVDD = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFS = 20 mA, maximum sample rate, unless  
otherwise noted.  
Table 2.  
Parameter  
Conditions  
Min  
Typ Max  
Unit  
CMOS INPUT LOGIC LEVEL  
Input VIN Logic High (IOVDD = 1.8 V)  
Input VIN Logic High (IOVDD = 2.5 V)  
Input VIN Logic Low (IOVDD = 1.8 V)  
Input VIN Logic Low (IOVDD = 2.5 V)  
CMOS OUTPUT LOGIC LEVEL  
Output VOUT Logic High  
Output VOUT Logic High  
Output VOUT Logic Low  
Output VOUT Logic Low  
1.2  
1.6  
V
V
V
V
0.6  
0.8  
IOVDD = 1.8 V  
IOVDD = 2.5 V  
IOVDD = 1.8 V  
IOVDD = 2.5 V  
1.4  
1.8  
V
V
V
V
0.4  
0.4  
LVDS RECEIVER INPUTS1  
Input Voltage Range, VIA or VIB  
Input Differential Threshold, VIDTH  
Input Differential Hysteresis, VIDTHH to VIDTHL  
Receiver Differential Input Impedance, RIN  
LVDS Input Rate  
825  
−100  
15ꢀ5 mV  
+100 mV  
mV  
20  
80  
120  
Ω
See Table 5  
DAC CLOCK INPUT (DACCLKP, DACCLKN)  
Differential Peak-to-Peak Voltage  
Common-Mode Voltage  
100  
500  
1.25  
2000 mV  
V
Self biased input, ac couple  
Maximum Clock Rate  
1200  
100  
MSPS  
REFCLK INPUT (REFCLKP, REFCLKN)  
Differential Peak-to-Peak Voltage  
Common-Mode Voltage  
500  
1.25  
2000 mV  
V
REFCLK Frequency (PLL Mode)  
REFCLK Frequency (SYNC Mode)  
SERIAL PERIPHERAL INTERFACE  
Maximum Clock Rate (SCLK)  
1 GHz ≤ fVCO ≤ 26 Hz  
See Multichip Synchronization section for conditions  
15.625  
0
600  
600  
MHz  
MHz  
40  
MHz  
ns  
ns  
ns  
ns  
Minimum Pulse Width High (tPWH  
)
)
12.5  
12.5  
Minimum Pulse Width Low (tPWOL  
Setup Time, SDI to SCLK (tDS)  
Hold Time, SDI to SCLK (tDH)  
Data Valid, SDO to SCLK (tDV)  
1.9  
0.2  
23  
ns  
Setup Time, CS to SCLK (tDCSB  
)
1.4  
ns  
1 LVDS receiver is compliant to the IEEE 1596 reduced range link, unless otherwise noted.  
DIGITAL INPUT DATA TIMING SPECIFICATIONS  
Table 3.  
Parameter  
Min  
Typ  
Max  
Unit  
LATENCY (DACCLK Cycles)  
1× Interpolation (With or Without Modulation)  
2× Interpolation (With or Without Modulation)  
4× Interpolation (With or Without Modulation)  
8× Interpolation (With or Without Modulation)  
Inverse Sinc  
64  
Cycles  
Cycles  
Cycles  
Cycles  
Cycles  
Cycles  
ms  
135  
292  
608  
20  
8
260  
Fine Modulation  
Power-Up Time  
Rev. 0 | Page 5 of 56  
 
 
AD9122  
AC SPECIFICATIONS  
TMIN to TMAX, AVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFS = 20 mA, maximum sample rate, unless otherwise noted.  
Table 4.  
Parameter  
Min  
Typ  
Max  
Unit  
SPURIOUS-FREE DYNAMIC RANGE (SFDR)  
fDAC = 100 MSPS, fOUT = 20 MHz  
fDAC = 200 MSPS, fOUT = 50 MHz  
fDAC = 400 MSPS, fOUT = ꢀ0 MHz  
fDAC = 800 MSPS, fOUT = ꢀ0 MHz  
ꢀ8  
80  
69  
ꢀ2  
dBc  
dBc  
dBc  
dBc  
TWO-TONE INTERMODULATION DISTORTION (IMD)  
fDAC = 200 MSPS, fOUT = 50 MHz  
fDAC = 400 MSPS, fOUT = 60 MHz  
fDAC = 400 MSPS, fOUT = 80 MHz  
fDAC = 800 MSPS, fOUT = 100 MHz  
84  
86  
84  
81  
dBc  
dBc  
dBc  
dBc  
NOISE SPECTRAL DENSITY (NSD) EIGHT-TONE, 500 kHz TONE SPACING  
fDAC = 200 MSPS, fOUT = 80 MHz  
fDAC = 400 MSPS, fOUT = 80 MHz  
−162  
−163  
−164  
dBm/Hz  
dBm/Hz  
dBm/Hz  
fDAC = 800 MSPS, fOUT = 80 MHz  
W-CDMA ADJACENT CHANNEL LEAKAGE RATIO (ACLR), SINGLE CARRIER  
fDAC = 491.52 MSPS, fOUT = 10 MHz  
fDAC = 491.52 MSPS, fOUT = 122.88 MHz  
fDAC = 983.04 MSPS, fOUT = 122.88 MHz  
W-CDMA SECOND ACLR, SINGLE CARRIER  
fDAC = 491.52 MSPS, fOUT = 10 MHz  
fDAC = 491.52 MSPS, fOUT = 122.88 MHz  
fDAC = 983.04 MSPS, fOUT = 122.88 MHz  
84  
82  
83  
dBc  
dBc  
dBc  
88  
86  
88  
dBc  
dBc  
dBc  
Table 5. Interface Speeds  
fBUS (Mbps)  
1.8 V 2%  
Bus Width  
Interpolation Factor  
1.8 V 5%  
1100  
1100  
1100  
1100  
1100  
1100  
1100  
1100  
1100  
550  
1.9 V 5%  
1200  
1200  
1200  
1200  
1200  
1200  
1200  
1200  
1200  
600  
Nibble (4 Bits)  
1×  
1200  
1200  
1200  
1200  
1200  
1200  
1200  
1200  
1200  
600  
2× (HB1)  
2× (HB2)  
4×  
8×  
Byte (8 Bits)  
1×  
2× (HB1)  
2× (HB2)  
4×  
8×  
Word (16 Bits)  
1×  
1100  
900  
1100  
550  
1200  
1000  
1200  
600  
1200  
1000  
1200  
600  
2× (HB1)  
2× (HB2)  
4×  
8×  
2ꢀ5  
300  
300  
Rev. 0 | Page 6 of 56  
 
 
AD9122  
ABSOLUTE MAXIMUM RATINGS  
THERMAL RESISTANCE  
Table 6.  
The exposed paddle (EPAD) must be soldered to the ground  
plane for the 72-lead, LFCSP. The EPAD performs as an  
electrical and thermal connection to the board.  
With  
Parameter  
Respect To Rating  
AVDD33  
AVSS, EPAD, −0.3 V to +3.6 V  
CVSS, DVSS  
AVSS, EPAD, −0.3 V to +3.3 V  
CVSS, DVSS  
Typical θJA, θJB, and θJC are specified for a 4-layer board in still air.  
Airflow increases heat dissipation effectively reducing θJA and θJB.  
IOVDD  
DVDD18, CVDD18  
AVSS  
AVSS, EPAD, −0.3 V to +2.1 V  
CVSS, DVSS  
EPAD, CVSS, −0.3 V to +0.3 V  
DVSS  
Table 7. Thermal Resistance  
Package  
θJA  
θJB  
θJC Unit Conditions  
ꢀ2-Lead LFCSP_VQ 20.ꢀ 10.9 1.1 °C/W EPAD soldered  
EPAD  
AVSS, CVSS, −0.3 V to +0.3 V  
DVSS  
ESD CAUTION  
CVSS  
AVSS, EPAD, −0.3 V to +0.3 V  
DVSS  
DVSS  
AVSS, EPAD, −0.3 V to +0.3 V  
CVSS  
FSADJ, REFIO,  
AVSS  
−0.3 V to AVDD33 + 0.3 V  
IOUT1P/IOUT1N,  
IOUT2P/IOUT2N  
D[15:0]P/D[15:0]N,  
FRAMEP/FRAMEN,  
DCIP/DCIN  
EPAD, DVSS −0.3 V to DVDD18 + 0.3 V  
DACCLKP/DACCLKN,  
REFCLKP/REFCLKN  
DVSS  
−0.3 V to CVDD18 + 0.3 V  
RESET, IRQ, CS, SCLK,  
SDIO, SDO  
EPAD, DVSS −0.3 V to IOVDD + 0.3 V  
Junction Temperature  
125°C  
Storage Temperature  
Range  
−65°C to +150°C  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Rev. 0 | Page ꢀ of 56  
 
 
AD9122  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
CVDD18  
DACCLKP  
DACCLKN  
CVSS  
FRAMEP  
FRAMEN  
IRQ  
1
2
3
4
5
6
7
8
9
54 RESET  
53 CS  
PIN 1  
INDICATOR  
52 SCLK  
51 SDIO  
50 SDO  
49 DVDD18  
48 D0N  
47 D0P  
46 D1N  
45 D1P  
44 DVSS  
43 DVDD18  
42 D2N  
41 D2P  
AD9122  
D15P  
D15N  
TOP VIEW  
(Not to Scale)  
NC 10  
IOVDD 11  
DVDD18 12  
D14P 13  
D14N 14  
D13P 15  
D13N 16  
D12P 17  
D12N 18  
40 D3N  
39 D3P  
38 D4N  
37 D4P  
NOTES  
1. NC = NO CONNECT.  
2. EXPOSED PAD MUST BE CONNECTED TO AVSS.  
Figure 3. Pin Configuration  
Table 8. Pin Function Descriptions  
Pin No.  
Mnemonic  
CVDD18  
DACCLKP  
DACCLKN  
CVSS  
Description  
1
2
3
4
1.8 V Clock Supply. Supplies clock receivers, clock distribution, and PLL circuitry.  
DAC Clock Input, Positive.  
DAC Clock Input, Negative.  
Clock Supply Common.  
5
6
FRAMEP  
FRAMEN  
IRQ  
Frame Input, Positive.  
Frame Input, Negative.  
Interrupt Request. Open-drain, active low output.  
Data Bit 15 (MSB), Positive.  
8
D15P  
9
D15N  
NC  
Data Bit 15 (MSB), Negative.  
No connection to device.  
10  
11  
12  
13  
14  
15  
16  
1ꢀ  
18  
19  
20  
21  
22  
23  
24  
25  
26  
IOVDD  
DVDD18  
D14P  
D14N  
D13P  
D13N  
D12P  
D12N  
D11P  
D11N  
D10P  
D10N  
D9P  
D9N  
D8P  
Supply Pin for Serial Ports, RESET and IRQ. 1.8 V to 2.8 V can be supplied to this pin.  
1.8 V Digital Supply. Supplies power to digital core and digital data ports.  
Data Bit 14, Positive.  
Data Bit 14, Negative.  
Data Bit 13, Positive.  
Data Bit 13, Negative.  
Data Bit 12, Positive.  
Data Bit 12, Negative.  
Data Bit 11, Positive.  
Data Bit 11, Negative.  
Data Bit 10, Positive.  
Data Bit 10, Negative.  
Data Bit 9, Positive.  
Data Bit 9, Negative.  
Data Bit 8, Positive.  
Data Bit 8, Negative.  
D8N  
Rev. 0 | Page 8 of 56  
 
AD9122  
Pin No.  
2ꢀ  
28  
29  
30  
31  
32  
33  
34  
35  
36  
3ꢀ  
38  
39  
40  
41  
42  
43  
44  
45  
46  
4ꢀ  
48  
49  
50  
51  
52  
53  
54  
55  
56  
5ꢀ  
58  
59  
60  
61  
62  
63  
64  
65  
66  
6ꢀ  
68  
69  
ꢀ0  
ꢀ1  
ꢀ2  
Mnemonic  
DCIP  
DCIN  
DVDD18  
DVSS  
DꢀP  
DꢀN  
D6P  
D6N  
D5P  
D5N  
D4P  
D4N  
D3P  
D3N  
D2P  
D2N  
DVDD18  
DVSS  
D1P  
D1N  
D0P  
D0N  
DVDD18  
SDO  
SDIO  
SCLK  
CS  
Description  
Data Clock Input, Positive.  
Data Clock Input, Negative.  
1.8 V Digital Supply.  
Digital Common.  
Data Bit ꢀ, Positive.  
Data Bit ꢀ, Negative.  
Data Bit 6, Positive.  
Data Bit 6, Negative.  
Data Bit 5, Positive.  
Data Bit 5, Negative.  
Data Bit 4, Positive.  
Data Bit 4, Negative.  
Data Bit 3, Positive.  
Data Bit 3, Negative.  
Data Bit 2, Positive.  
Data Bit 2, Negative.  
1.8 V Digital Supply.  
Digital Common.  
Data Bit 1, Positive.  
Data Bit 1, Negative.  
Data Bit 0, Positive.  
Data Bit 0, Negative.  
1.8 V Digital Supply.  
Serial Port Data Output (CMOS Levels with Respect to IOVDD).  
Serial Port Data Input/Output (CMOS Levels with Respect to IOVDD).  
Serial Port Clock Input (CMOS Levels With Respect to IOVDD).  
Serial Port Chip Select. Active Low (CMOS Levels With Respect to IOVDD).  
Reset. Active Low (CMOS Levels With Respect to IOVDD).  
No connection to device.  
Analog Supply Common.  
3.3 V Analog Supply.  
Q DAC Positive Current Output.  
Q DAC Negative Current Output.  
3.3 V Analog Supply.  
Analog Supply Common.  
Voltage Reference. Nominally 1.2 V output. Should be decoupled to analog common.  
Full-Scale Current Output Adjust. Place a 10 kΩ resistor on the analog common.  
Analog Common.  
3.3 V Analog Supply.  
I DAC Positive Current Output.  
I DAC Negative Current Output.  
3.3 V Analog Supply.  
PLL Reference Clock Input, Negative. This pin has secondary function as SYNC input.  
PLL Reference Clock Input, Positive. This pin has secondary function as SYNC input.  
1.8 V Clock Supply. Supplies clock receivers, clock distribution, and PLL circuitry.  
1.8 V Clock Supply. Supplies clock receivers, clock distribution, and PLL circuitry.  
Exposed pad must be connected to AVSS. This provides an electrical, thermal, and mechanical connection  
to the PCB.  
RESET  
NC  
AVSS  
AVDD33  
IOUT2P  
IOUT2N  
AVDD33  
AVSS  
REFIO  
FSADJ  
AVSS  
AVDD33  
IOUT1N  
IOUT1P  
AVDD33  
REFCLKN  
REFCLKP  
CVDD18  
CVDD18  
EPAD  
Rev. 0 | Page 9 of 56  
AD9122  
TYPICAL PERFORMANCE CHARACTERISTICS  
0
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
fDATA = 250MSPS, SECOND HARMONIC  
0dBFS  
fDATA = 250MSPS, THIRD HARMONIC  
fDATA = 400MSPS, SECOND HARMONIC  
fDATA = 400MSPS, THIRD HARMONIC  
–6dBFS  
–12dBFS  
–18dBFS  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
450  
700  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
fOUT (MHz)  
fOUT (MHz)  
Figure 4. Harmonics vs. fOUT over fDATA, 2× Interpolation,  
Digital Scale = 0 dBFS, fSC = 20 mA  
Figure 7. Second Harmonic vs. fOUT over Digital Scale, 2× Interpolation,  
fDATA = 400 MSPS, fSC = 20 mA  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
0
fDATA = 100MSPS, SECOND HARMONIC  
fDATA = 100MSPS, THIRD HARMONIC  
fDATA = 200MSPS, SECOND HARMONIC  
fDATA = 200MSPS, THIRD HARMONIC  
0dBFS  
–6dBFS  
–12dBFS  
–18dBFS  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
0
50  
100  
150  
200  
250  
300  
350  
400  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
fOUT (MHz)  
fOUT (MHz)  
Figure 5. Harmonics vs. fOUT over fDATA, 4× Interpolation,  
Digital Scale = 0 dBFS, fSC = 20 mA  
Figure 8. Third Harmonic vs. fOUT over Digital Scale, 2× Interpolation,  
fDATA = 400 MSPS, fSC = 20 mA  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
0
10mA, SECOND HARMONIC  
fDATA = 100MSPS, SECOND HARMONIC  
fDATA = 100MSPS, THIRD HARMONIC  
fDATA = 150MSPS, SECOND HARMONIC  
fDATA = 150MSPS, THIRD HARMONIC  
20mA, SECOND HARMONIC  
–10  
30mA, SECOND HARMONIC  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
10mA, THIRD HARMONIC  
20mA, THIRD HARMONIC  
30mA, THIRD HARMONIC  
0
100  
200  
300  
400  
500  
600  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
fOUT (MHz)  
fOUT (MHz)  
Figure 6. Harmonics vs. fOUT over fDATA, 8× Interpolation,  
Digital Scale = 0 dBFS, fSC = 20 mA  
Figure 9. Second Harmonic vs. fOUT over fSC, 2× Interpolation,  
DATA = 400 MSPS, Digital Scale = 0 dBFS  
f
Rev. 0 | Page 10 of 56  
 
AD9122  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
fDATA = 250MSPS  
fDATA = 400MSPS  
2× INTERPOLATION,  
SINGLE-TONE SPECTRUM,  
fDATA = 250MSPS,  
fOUT = 101MHz  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
START 1.0MHz  
#RES BW 10kHz  
VBW 10kHz  
STOP 500.0MHz  
SWEEP 6.017s (601 PTS)  
fOUT (MHz)  
Figure 13. 2× Interpolation, Single-Tone Spectrum  
Figure 10. Highest Digital Spur vs. fOUT over fDATA, 2× Interpolation,  
Digital Scale = 0 dBFS, fSC = 20 mA  
–64  
fDATA = 100MSPS  
fDATA = 200MSPS  
–66  
–68  
–70  
–72  
–74  
–76  
–78  
4× INTERPOLATION,  
SINGLE-TONE SPECTRUM,  
fDATA = 200MSPS,  
fOUT = 151MHz  
START 1.0MHz  
#RES BW 10kHz  
VBW 10kHz  
STOP 800.0MHz  
SWEEP 9.634s (601 PTS)  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
fOUT (MHz)  
Figure 14. 4× Interpolation, Single-Tone Spectrum  
Figure 11. Highest Digital Spur vs. fOUT over fDATA, 4× Interpolation,  
Digital Scale = 0 dBFS, fSC = 20 mA  
–64  
fDATA = 100MSPS  
fDATA = 150MSPS  
–66  
–68  
–70  
–72  
–74  
–76  
8× INTERPOLATION,  
SINGLE-TONE SPECTRUM,  
fDATA = 100MSPS,  
fOUT = 131MHz  
START 1.0MHz  
#RES BW 10kHz  
VBW 10kHz  
STOP 800.0MHz  
SWEEP 9.634s (601 PTS)  
0
100  
200  
300  
400  
500  
600  
700  
fOUT (MHz)  
Figure 15. 8× Interpolation, Single-Tone Spectrum  
Figure 12. Highest Digital Spur vs. fOUT over fDATA, 8× Interpolation,  
Digital Scale = 0 dBFS, fSC = 20 mA  
Rev. 0 | Page 11 of 56  
AD9122  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
fDATA = 250MSPS  
fDATA = 400MSPS  
0dBFS  
–6dBFS  
–12dBFS  
–18dBFS  
–90  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
450  
450  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
fOUT (MHz)  
fOUT (MHz)  
Figure 16. IMD vs. fOUT over fDATA, 2× Interpolation,  
Digital Scale = 0 dBFS, fSC = 20 mA  
Figure 19. IMD vs. fOUT over Digital Scale, 2× Interpolation,  
fDATA = 400 MSPS, fSC = 20 mA  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–50  
–55  
–60  
–65  
–70  
–75  
–80  
–85  
fDATA = 100MSPS  
fDATA = 200MSPS  
I
I
I
= 20mA  
= 30mA  
= 10mA  
FS  
FS  
FS  
0
50  
100  
150  
200  
250  
300  
350  
400  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
fOUT (MHz)  
fOUT (MHz)  
Figure 17. IMD vs. fOUT over fDATA, 4× Interpolation,  
Digital Scale = 0 dBFS, fSC = 20 mA  
Figure 20. IMD vs. fOUT over fSC, 2× Interpolation, fDATA = 400 MSPS,  
Digital Scale = 0 dBFS  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
–40  
–45  
fDATA = 100MSPS  
–50  
PLL ON  
–55  
–60  
–65  
PLL OFF  
–70  
–75  
–80  
–85  
–90  
0
50  
100  
150  
200  
250  
300  
350  
400  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
fOUT (MHz)  
fOUT (MHz)  
Figure 18. IMD vs. fOUT over fDATA, 8× Interpolation,  
Digital Scale = 0 dBFS, fSC = 20 mA  
Figure 21. IMD vs. fOUT, PLL On vs. PLL Off  
Rev. 0 | Page 12 of 56  
AD9122  
–152  
–154  
–156  
–158  
–160  
–162  
–164  
–166  
–161.0  
–161.5  
–162.0  
–162.5  
–163.0  
–163.5  
–164.0  
–164.5  
–165.0  
–165.5  
1×, fDATA = 200MSPS  
2×, fDATA = 200MSPS  
4×, fDATA = 200MSPS  
8×, fDATA = 100MSPS  
1×, fDATA = 200MSPS  
2×, fDATA = 200MSPS  
4×, fDATA = 200MSPS  
8×, fDATA = 100MSPS  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
fOUT (MHz)  
fOUT (MHz)  
Figure 22. 1-Tone NSD vs. fOUT over Interpolation Rate, Digital Scale = 0 dBFS,  
fSC = 20 mA, PLL Off  
Figure 25. 8-Tone NSD vs. fOUT over Interpolation Rate, Digital Scale = 0 dBFS,  
fSC = 20 mA, PLL Off  
–154  
–161.0  
0dBFS  
0dBFS  
–161.5  
–162.0  
–162.5  
–163.0  
–163.5  
–164.0  
–164.5  
–165.0  
–165.5  
–166.0  
–166.5  
–6dBFS  
–6dBFS  
–12dBFS  
–18dBFS  
–156  
–12dBFS  
–18dBFS  
–158  
–160  
–162  
–164  
–166  
–168  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
fOUT (MHz)  
fOUT (MHz)  
Figure 23. 1-Tone NSD vs. fOUT over Digital Scale, fDATA = 200 MSPS,  
4× Interpolation, fSC = 20 mA, PLL Off  
Figure 26. 8-Tone NSD vs. fOUT over Digital Scale, fDATA = 200 MSPS,  
4× Interpolation, fSC = 20 mA, PLL Off  
–158  
–160  
2×, fDATA = 200MSPS  
2×, fDATA = 200MSPS  
4×, fDATA = 200MSPS  
8×, fDATA = 100MSPS  
4×, fDATA = 200MSPS  
8×, fDATA = 100MSPS  
–159  
–161  
–162  
–163  
–164  
–165  
–166  
–160  
–161  
–162  
–163  
–164  
–165  
–166  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
fOUT (MHz)  
fOUT (MHz)  
Figure 24. 1-Tone NSD vs. fOUT over Interpolation Rate, Digital Scale = 0 dBFS,  
SC = 20 mA, PLL On  
Figure 27. 8-Tone NSD vs. fOUT over Interpolation Rate, Digital Scale = 0 dBFS,  
SC = 20 mA, PLL On  
f
f
Rev. 0 | Page 13 of 56  
AD9122  
–77  
–78  
–79  
–80  
–81  
–82  
–83  
–50  
–55  
–60  
–65  
–70  
–75  
–80  
–85  
–90  
0dBFS  
INTERPOLATION FACTOR = 2×, PLL OFF  
INTERPOLATION FACTOR = 4×, PLL OFF  
INTERPOLATION FACTOR = 2×, PLL ON  
INTERPOLATION FACTOR = 4×, PLL ON  
–3dBFS  
–6dBFS  
–84  
0
50  
100  
150  
200  
250  
250  
250  
0
100  
200  
300  
400  
500  
fOUT (MHz)  
fOUT (MHz)  
Figure 28. 1-Carrier W-CDMA ACLR vs. fOUT over fDAC  
Adjacent Channel, PLL Off  
,
,
,
Figure 31. 1-Carrier W-CDMA ACLR vs. fOUT, Adjacent Channel,  
PLL On vs. PLL Off  
–78  
–80  
–82  
–84  
–86  
–88  
–90  
–70  
0dBFS  
INTERPOLATION FACTOR = 2×, PLL OFF  
INTERPOLATION FACTOR = 4×, PLL OFF  
INTERPOLATION FACTOR = 2×, PLL ON  
INTERPOLATION FACTOR = 4×, PLL ON  
–3dBFS  
–6dBFS  
–72  
–74  
–76  
–78  
–80  
–82  
–84  
–86  
–88  
–90  
0
50  
100  
150  
200  
0
100  
200  
300  
400  
500  
fOUT (MHz)  
fOUT (MHz)  
Figure 29. 1-Carrier W-CDMA ACLR vs. fOUT over fDAC  
Alternate Channel, PLL Off  
Figure 32. 1-Carrier W-CDMA ACLR vs. fOUT, Alternate Channel,  
PLL On vs. PLL Off  
–70  
–75  
–80  
–85  
–90  
–95  
–70  
0dBFS  
INTERPOLATION FACTOR = 2×, PLL OFF  
INTERPOLATION FACTOR = 4×, PLL OFF  
INTERPOLATION FACTOR = 2×, PLL ON  
–3dBFS  
–6dBFS  
INTERPOLATION FACTOR = 4×, PLL ON  
–75  
–80  
–85  
–90  
–95  
0
50  
100  
150  
200  
0
100  
200  
300  
400  
500  
fOUT (MHz)  
fOUT (MHz)  
Figure 30. 1-Carrier W-CDMA ACLR vs. fOUT over fDAC  
Second Alternate Channel, PLL Off  
Figure 33. 1-Carrier W-CDMA ACLR vs. fOUT, Second Alternate Channel,  
PLL On vs. PLL Off  
Rev. 0 | Page 14 of 56  
AD9122  
START 133.06MHz  
#RES BW 30kHz  
VBW 30kHz  
STOP 166.94MHz  
START 125.88MHz  
#RES BW 30kHz  
VBW 30kHz  
STOP 174.42MHz  
SWEEP 143.6ms (601 PTS)  
SWEEP 206.9ms (601 PTS)  
RMS RESULTS  
FREQ  
OFFSET REF BW  
LOWER  
dBc dBm  
UPPER  
dBc dBm  
TOTAL CARRIER POWER –11.19dBm/15.3600MHz  
RRC FILTER: OFF FILTER ALPHA 0.22  
CARRIER POWER 5.00MHz 3.840MHz –75.96 –85.96  
–77.13 –87.13  
–85.24 –95.25  
–85.43 –95.43  
REF CARRIER POWER –16.89dBm/3.84000MHz  
–10.00dBm/  
3.840MHz  
10.00MHz 3.840MHz –85.33 –95.33  
15.00MHz 2.888MHz –95.81 –95.81  
LOWER  
dBc dBm  
UPPER  
dBc dBm  
OFFSET FREQ INTEG BW  
1
2
3
4
–16.92dBm  
–16.89dBm  
–17.43dBm  
–17.64dBm  
5.000MHz  
10.00MHz  
15.00MHz  
3.840MHz  
3.840MHz  
3.840MHz  
–65.88 –82.76  
–68.17 –85.05  
–70.42 –87.31  
–67.52 –84.40  
–69.91 –86.79  
–71.40 –88.28  
Figure 35. 1-Carrier W-CDMA ACLR Performance, IF = ~150 MHz  
Figure 34. 4-Carrier W-CDMA ACLR Performance, IF = ~150 MHz  
Rev. 0 | Page 15 of 56  
AD9122  
TERMINOLOGY  
Integral Nonlinearity (INL)  
Settling Time  
INL is defined as the maximum deviation of the actual analog  
output from the ideal output, determined by a straight line drawn  
from zero scale to full scale.  
The time required for the output to reach and remain within a  
specified error band around its final value, measured from  
the start of the output transition.  
Differential Nonlinearity (DNL)  
DNL is the measure of the variation in analog value, normalized  
to full scale, associated with a 1 LSB change in digital input code.  
Spurious Free Dynamic Range (SFDR)  
The difference, in decibels, between the peak amplitude of the  
output signal and the peak spurious signal within the dc to the  
Nyquist frequency of the DAC. Typically, energy in this band is  
rejected by the interpolation filters. This specification, therefore,  
defines how well the interpolation filters work and the effect of  
other parasitic coupling paths to the DAC output.  
Offset Error  
The deviation of the output current from the ideal of zero is  
called offset error. For IOUT1P, 0 mA output is expected when  
the inputs are all 0s. For IOUT1N, 0 mA output is expected  
when all inputs are set to 1.  
Signal-to-Noise Ratio (SNR)  
SNR is the ratio of the rms value of the measured output signal  
to the rms sum of all other spectral components below the Nyquist  
frequency, excluding the first six harmonics and dc. The value  
for SNR is expressed in decibels.  
Gain Error  
The difference between the actual and ideal output span. The  
actual span is determined by the difference between the output  
when all inputs are set to 1 and the output when all inputs are  
set to 0.  
Interpolation Filter  
If the digital inputs to the DAC are sampled at a multiple rate of  
Output Compliance Range  
f
DATA (interpolation rate), a digital filter can be constructed that  
The range of allowable voltage at the output of a current output  
DAC. Operation beyond the maximum compliance limits can  
cause either output stage saturation or breakdown, resulting in  
nonlinear performance.  
has a sharp transition band near fDATA/2. Images that typically  
appear around fDAC (output data rate) can be greatly suppressed.  
Adjacent Channel Leakage Ratio (ACLR)  
The ratio in decibels relative to the carrier (dBc) between the  
measured power within a channel relative to its adjacent channel.  
Temperature Drift  
Temperature drift is specified as the maximum change from  
the ambient (25°C) value to the value at either TMIN or TMAX  
.
Complex Image Rejection  
For offset and gain drift, the drift is reported in ppm of full-  
scale range (FSR) per degree Celsius. For reference drift, the  
drift is reported in ppm per degree Celsius.  
In a traditional two-part upconversion, two images are created  
around the second IF frequency. These images have the effect  
of wasting transmitter power and system bandwidth. By placing  
the real part of a second complex modulator in series with the  
first complex modulator, either the upper or lower frequency  
image near the second IF can be rejected.  
Power Supply Rejection (PSR)  
The maximum change in the full-scale output as the supplies  
are varied from minimum to maximum specified voltages.  
Rev. 0 | Page 16 of 56  
 
AD9122  
THEORY OF OPERATION  
The AD9122 combines many features that make it a very attractive  
DAC for wired and wireless communications systems. The dual  
digital signal path and dual DAC structure allow an easy interface  
to common quadrature modulators when designing single  
sideband transmitters. The speed and performance of the AD9122  
allows wider bandwidths and more carriers to be synthesized than  
in previously available DACs. In addition, these devices include an  
innovative low power, 32-bit complex NCO that greatly increases  
the ease of frequency placement.  
The remaining SCLK edges are for Phase 2 of the communication  
cycle. Phase 2 is the actual data transfer between the device and  
the system controller. Phase 2 of the communication cycle is a  
transfer of one or more data bytes. Registers change immediately  
upon writing to the last bit of each transfer byte, except for the  
frequency tuning word and NCO phase offsets that only change  
when the frequency update bit (Register 0x36, Bit 0) is set.  
DATA FORMAT  
The instruction byte contains the information shown in Table 9.  
The AD9122 offers features that allow simplified synchronization  
with incoming data and between multiple devices. Auxiliary  
DACs are also provided on chip for output dc offset compensation  
(for LO compensation in SSB transmitters) and for gain matching  
(for image rejection optimization in SSB transmitters).  
Table 9. Serial Port Instruction Byte  
I7 (MSB)  
I6  
I5  
I4  
I3  
I2  
I1  
I0 (LSB)  
R/W  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
W
R/ , Bit 7 of the instruction byte, determines whether a read or  
a write data transfer occurs after the instruction byte write. Logic 1  
indicates a read operation, and Logic 0 indicates a write  
operation.  
SERIAL PORT OPERATION  
The serial port is a flexible, synchronous serial communications  
port allowing easy interface to many industry-standard micro-  
controllers and microprocessors. The serial I/O is compatible  
with most synchronous transfer formats, including both the  
Motorola SPI® and Intel® SSR protocols. The interface allows  
read/write access to all registers that configure the AD9122.  
Single or multiple byte transfers are supported, as well as MSB-  
first or LSB-first transfer formats. The serial interface ports can  
be configured as a single pin I/O (SDIO) or two unidirectional  
pins for input/output (SDIO/SDO).  
A6 to A0, Bit 6 to Bit 0 of the instruction byte, determine the  
register that is accessed during the data transfer portion of the  
communication cycle. For multibyte transfers, A6 is the starting  
byte address. The remaining register addresses are generated by  
the device based on the LSB_FIRST bit (Register 0x00, Bit 6).  
SERIAL PORT PIN DESCRIPTIONS  
Serial Clock (SCLK)  
The serial clock pin synchronizes data to and from the device  
and runs the internal state machines. The maximum frequency  
of SCLK is 40 MHz. All data input is registered on the rising  
edge of SCLK. All data is driven out on the falling edge of SCLK.  
50  
SDO  
SDIO 51  
SPI  
PORT  
52  
53  
SCLK  
CS  
CS  
Chip Select (  
)
Figure 36. Serial Port Interface Pins  
An active low input starts and gates a communication cycle.  
It allows more than one device to be used on the same serial  
communications lines. The SDO and SDIO pins go to a high  
impedance state when this input is high. During the communication  
cycle, chip select should stay low.  
There are two phases to a communication cycle with the AD9122.  
Phase 1 is the instruction cycle (the writing of an instruction  
byte into the device), coincident with the first eight SCLK rising  
edges. The instruction byte provides the serial port controller  
with information regarding the data transfer cycle, Phase 2 of  
the communication cycle. The Phase 1 instruction byte defines  
whether the upcoming data transfer is a read or write and the  
starting register address for the first byte of the data transfer.  
The first eight SCLK rising edges of each communication cycle  
are used to write the instruction byte into the device.  
Serial Data I/O (SDIO)  
Data is always written into the device on this pin. However, this  
pin can be used as a bidirectional data line. The configuration  
of this pin is controlled by Register 0x00, Bit 7. The default is  
Logic 0, configuring the SDIO pin as unidirectional.  
Serial Data Out (SDO)  
CS  
A logic high on the  
pin followed by a logic low resets the  
serial port timing to the initial state of the instruction cycle.  
From this state, the next eight rising SCLK edges represent the  
instruction bits of the current I/O operation.  
Data is read from this pin for protocols that use separate lines  
for transmitting and receiving data. In the case where the device  
operates in a single bidirectional I/O mode, this pin does not  
output data and is set to a high impedance state.  
Rev. 0 | Page 1ꢀ of 56  
 
 
AD9122  
INSTRUCTION CYCLE  
DATA TRANSFER CYCLE  
SERIAL PORT OPTIONS  
CS  
The serial port can support both MSB-first and LSB-first data  
formats. This functionality is controlled by LSB_FIRST  
(Register 0x00, Bit 6). The default is MSB-first (LSB_FIRST = 0).  
SCLK  
A0 A1 A2 A3 A4 N0 N1 R/W D0 D1 D2  
D4 D5 D6 D7  
N N N  
SDIO  
SDO  
0
0
0
N
N
When LSB_FIRST = 0 (MSB-first), the instruction and data bit  
must be written from MSB to LSB. Multibyte data transfers in  
MSB-first format start with an instruction byte that includes  
the register address of the most significant data byte. Subsequent  
data bytes should follow from the high address to low address.  
In MSB-first mode, the serial port internal byte address  
generator decrements for each data byte of the multibyte  
communication cycle.  
D0 D1 D2  
D4 D5 D6 D7  
N N N  
0
0
0
Figure 38. Serial Register Interface Timing LSB-First  
tDS  
tSCLK  
CS  
tPWH  
tPWL  
SCLK  
When LSB_FIRST = 1 (LSB-first), the instruction and data bit  
must be written from LSB to MSB. Multibyte data transfers in  
LSB-first format start with an instruction byte that includes the  
register address of the least significant data byte followed by  
multiple data bytes. The serial port internal byte address generator  
increments for each byte of the multibyte communication cycle.  
tDS  
tDH  
SDIO  
INSTRUCTION BIT 7  
INSTRUCTION BIT 6  
Figure 39. Timing Diagram for Serial Port Register Write  
CS  
The serial port controller data address decrements from the  
data address written toward 0x00 for multibyte I/O operations  
if the MSB-first mode is active. The serial port controller address  
increments from the data address written toward 0x7F for  
multibyte I/O operations if the LSB-first mode is active.  
SCLK  
tDV  
SDIO,  
SDO  
DATA BIT n  
DATA BIT n – 1  
Figure 40. Timing Diagram for Serial Port Register Read  
INSTRUCTION CYCLE  
DATA TRANSFER CYCLE  
CS  
SCLK  
SDIO  
SDO  
R/W A6 A5 A4 A3 A2 A1 A0 D7 D6 D5  
N
D3 D2 D1 D0  
0 0 0  
N
0
0
D7 D6 D5  
N
D3 D2 D1 D0  
0 0 0  
N
Figure 37. Serial Register Interface Timing MSB-First  
Rev. 0 | Page 18 of 56  
 
AD9122  
DEVICE CONFIGURATION REGISTER MAP AND DESCRIPTIONS  
Table 10. Device Configuration Register Map  
Addr  
(Hex) Bit 7  
Reg Name  
Comm  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Default  
0x00  
0x00  
0x01  
SDIO  
LSB_FIRST  
Reset  
Power Control  
Power-  
down  
DAC I  
Power-  
down  
DAC Q  
Power-  
down data down  
receiver  
Power-  
PLL lock  
status  
0x10  
aux ADC  
Data Format  
0x03  
0x04  
Binary  
data  
format  
Q data  
first  
MSB swap  
Data bus width[1:0]  
0x00  
0x00  
Interrupt Enable  
Enable  
PLL lock  
lost  
Enable  
PLL  
locked  
Enable  
sync  
signal  
lost  
Enable  
sync  
signal  
locked  
Enable  
sync  
phase  
locked  
Enable  
soft  
FIFO  
sync  
Enable  
FIFO  
Enable  
FIFO  
Warning 1 Warning 2  
Interrupt Enable  
0x05  
0
0
0
Enable  
AED  
Enable  
AED  
Enable  
SED  
0
0
0x00  
compar  
pass  
compar  
fail  
compar  
fail  
Event Flag  
Event Flag  
0x06  
0x0ꢀ  
0x08  
PLL  
lock  
lost  
PLL  
locked  
Sync  
signal  
lost  
Sync  
signal  
locked  
Sync  
phase  
locked  
Soft  
FIFO  
sync  
FIFO  
FIFO  
N/A  
Warning 1 Warning 2  
AED  
compar  
pass  
AED  
compar  
fail  
SED  
compar  
fail  
N/A  
Clock Receiver  
Control  
DACCLK  
duty  
correction correction  
REFCLK  
duty  
DACCLK  
cross-  
correction  
REFCLK  
cross-  
correction  
0
0
0
0
0x3F  
0x40  
0x00  
PLL Control  
PLL Control  
0x0A PLL  
enable  
PLL  
manual  
enable  
Manual VCO Band[5:0]  
0x0B  
PLL VCO  
enable  
PLL Control  
PLL Control  
0x0C  
0x0D  
PLL Loop  
Bandwidth[1:0]  
PLL Charge Pump Current[4:0]  
N0[1:0]  
0xD1  
0xD9  
N2[1:0]  
PLL cross  
control  
enable  
N1[1:0]  
PLL Status  
PLL Status  
0x0E  
0x0F  
PLL lock  
VCO Control Voltage[3:0]  
VCO Band Readback[5:0]  
0x00  
0x00  
Sync Control  
0x10  
Sync  
enable  
Data/FIFO  
rate toggle  
Rising  
edge sync  
Sync Averaging[2:0]  
0x48  
Sync Control  
Sync Status  
0x11  
0x12  
Sync Phase Request[5:0]  
0x00  
N/A  
Sync lost  
Sync  
locked  
Sync Status  
0x13  
0x15  
Sync Phase Readback[ꢀ:0] (6.2 format)  
N/A  
N/A  
Data Receiver  
Status  
LVDS  
LVDS  
LVDS  
DCI level  
high  
LVDS  
DCI  
LVDS  
LVDS data  
FRAME  
level high  
FRAME  
level low  
data level level low  
high  
level  
low  
FIFO Control  
FIFO Status  
0x1ꢀ  
0x18  
FIFO Phase Offset[2:0]  
0x04  
N/A  
FIFO  
FIFO  
FIFO  
soft  
FIFO soft  
align  
FIFO reset  
aligned  
Warning 1 Warning 2  
align  
ack  
request  
FIFO Status  
0x19  
FIFO Level[ꢀ:0]  
N/A  
Rev. 0 | Page 19 of 56  
 
AD9122  
Addr  
(Hex) Bit 7  
Reg Name  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Default  
Datapath  
Control  
0x1B  
Bypass  
premod  
Bypass  
Sinc−1  
Bypass  
NCO  
NCO gain  
Bypass  
phase  
comp  
and dc  
offset  
Select  
sideband to Q data  
Send I data  
0xE4  
HB1 Control  
0x1C  
HB1[1:0]  
Bypass HB1 0x00  
HB2 Control  
HB3 Control  
Chip ID  
0x1D  
0x1E  
0x1F  
0x30  
0x31  
0x32  
0x33  
0x34  
HB2[5:0]  
Bypass HB2 0x00  
HB3[5:0]  
Bypass HB3 0x00  
Chip ID[ꢀ:0]  
FTW[ꢀ:0]  
0x08  
0x00  
0x00  
0x00  
0x08  
0x00  
FTW LSB  
FTW  
FTW[15:8]  
FTW[23:16]  
FTW[31:24]  
FTW  
FTW MSB  
NCO Phase  
Offset LSB  
NCO Phase Offset[ꢀ:0]  
NCO Phase  
Offset MSB  
0x35  
0x36  
NCO Phase Offset[15:8]  
0x00  
NCO FTW  
Update  
Frame  
FTW ack  
Frame FTW  
request  
Update  
FTW ack  
Update  
FTW  
0x00  
request  
I Phase Adj LSB  
I Phase Adj MSB  
Q Phase Adj LSB  
0x38  
0x39  
0x3A  
I Phase Adj[ꢀ:0]  
Q Phase Adj[ꢀ:0]  
0x00  
0x00  
0x00  
0x00  
0x00  
0x00  
0x00  
I Phase Adj[9:8]  
Q Phase Adj[9:8]  
Q Phase Adj MSB 0x3B  
I DAC Offset LSB 0x3C  
I DAC Offset MSB 0x3D  
I DAC Offset[ꢀ:0]  
I DAC Offset[15:8]  
Q DAC Offset[ꢀ:0]  
Q DAC Offset  
LSB  
0x3E  
Q DAC Offset  
MSB  
0x3F  
Q DAC Offset[15:8]  
I DAC FS Adj[ꢀ:0]  
0x00  
I DAC FS Adj.  
I DAC Control  
0x40  
0x41  
0xF9  
0x01  
I DAC  
sleep  
I DAC FS Adj[9:8]  
Aux DAC I Data  
0x42  
0x43  
I Aux DAC[ꢀ:0]  
0x00  
0x00  
I Aux DAC  
Control  
I Aux  
DAC sign  
I Aux DAC  
current  
I Aux DAC  
Sleep  
I Aux DAC[9:8]  
direction  
Q DAC FS Adj.  
Q DAC Control  
0x44  
0x45  
Q DAC FS Adj[ꢀ:0]  
Q Aux DAC[ꢀ:0]  
0xF9  
0x01  
Q DAC  
sleep  
Q DAC FS Adj[9:8]  
Q Aux DAC[9:8]  
Aux DAC Q Data  
0x46  
0x4ꢀ  
0x00  
0x00  
Q Aux DAC  
Control  
Q Aux  
DAC sign  
Q Aux DAC Q Aux DAC  
current  
Sleep  
direction  
Die Temp  
Range Control  
0x48  
FS Current[2:0]  
Ref Current[2:0]  
Capacitor 0x02  
value  
Die Temp LSB  
Die Temp MSB  
SED Control  
0x49  
0x4A  
0x6ꢀ  
Die Temp[ꢀ:0]  
Die Temp[15:8]  
N/A  
N/A  
SED  
compare  
enable  
Sample  
error  
detected  
Autoclear  
enable  
Compare Compare  
fail pass  
0x00  
Rev. 0 | Page 20 of 56  
AD9122  
Addr  
(Hex) Bit 7  
Reg Name  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Default  
0xB6  
Compare I0 LSBs 0x68  
Compare Value I0[ꢀ:0]  
Compare Value I0[15:8]  
Compare  
I0 MSBs  
0x69  
0x6A  
0x6B  
0xꢀA  
Compare  
Q0 LSBs  
Compare Value Q0[ꢀ:0]  
Compare Value Q0[15:8]  
0x45  
0xEA  
Compare  
Q0 MSBs  
Compare I1 LSBs 0x6C  
Compare I1 MSBs 0x6D  
Compare Value I1[ꢀ:0]  
Compare Value I1[15:8]  
Compare Value Q1[ꢀ:0]  
0x16  
0x1A  
0xC6  
Compare  
Q1 LSBs  
0x6E  
Compare  
Q1 MSBs  
0x6F  
Compare Value Q1[15:8]  
0xAA  
SED I LSBs  
SED I MSBs  
SED Q LSBs  
SED Q MSBs  
0xꢀ0  
0xꢀ1  
0xꢀ2  
0xꢀ3  
Errors Detected I_BITS[ꢀ:0]  
Errors Detected I_BITS[15:8]  
Errors Detected Q_BITS[ꢀ:0]  
Errors Detected Q_BITS[15:8]  
0x00  
0x00  
0x00  
0x00  
Table 11. Device Configuration Register Descriptions  
Reg  
Name  
Addr  
(Hex)  
Bit  
Name  
Description  
Default  
Comm  
00  
SDIO  
SDIO Operation.  
0
0 = SDIO operates as an input only.  
1 = SDIO operates as bidirectional input/output.  
Serial port communication LSB or MSB first.  
0 = MSB first.  
6
LSB_FIRST  
0
1 = LSB first.  
5
6
5
Reset  
Reset is asserted when this bit transitions from 0 to 1.  
1 = power down DAC I.  
0
0
0
0
Power  
01  
Power-down DAC I  
Power-down DAC Q  
1 = power down DAC Q.  
Control  
Power-down data  
receiver  
1 = power down the input data receiver.  
4
0
Power-down auxiliary  
ADC  
1 = power down auxiliary ADC for temperature sensor.  
1 = PLL is locked.  
0
0
PLL lock status  
Rev. 0 | Page 21 of 56  
 
AD9122  
Reg  
Name  
Addr  
(Hex)  
Bit  
Name  
Description  
Default  
Data  
Format  
03  
Binary data format  
0 = input data is in twos complement format.  
1 = input data is in binary format.  
Indicates I/Q data pairing on data input.  
0 = I data sent to data receiver first.  
1 = Q data sent to data receiver first.  
Swaps the bit order of the data input port.  
0
6
5
Q data first  
MSB swap  
0
0
0 = order of the data bits corresponds to the pin  
descriptions  
1 = bit designations are swapped; most significant bits  
become the least significant bits  
1:0  
Data bus width  
Data receiver interface mode.  
0
00 = word mode; 16-bit interface bus width.  
01 = byte mode; 8-bit interface bus width.  
10 = nibble mode; 4-bit interface bus width.  
11 = invalid.  
See the LVDS Input Data Ports section for details on  
the operation of the different interface modes.  
Interrupt 04  
Enable  
6
5
4
Enable PLL lock lost  
Enable PLL locked  
1 = enable interrupt for PLL lock lost.  
1 = enable interrupt for PLL locked.  
0
0
0
0
Enable sync signal lost  
1 = enable interrupt for sync signal lock lost.  
1 = enable interrupt for sync signal locked.  
Enable sync signal  
locked  
3
Enable sync phase  
locked  
1 = enable interrupt for clock generation ready.  
0
2
1
0
Enable soft FIFO sync  
Enable FIFO Warning 1  
Enable FIFO Warning 2  
Set to 0  
1 = enable interrupt for soft FIFO reset.  
1 = enable interrupt for FIFO Warning 1.  
1 = enable interrupt for FIFO Warning 2.  
0
0
0
Interrupt 05  
Enable  
6
5
4
Set this bit to 0.  
0
0
0
0
Set to 0  
Set this bit to 0.  
Set to 0  
Set this bit to 0.  
Enable AED comparison  
pass  
1 = enable interrupt for AED comparison pass.  
3
2
Enable AED comparison  
fail  
1 = enable interrupt for AED comparison fail.  
1 = enable interrupt for SED comparison fail.  
0
0
Enable SED comparison  
fail  
1
0
Set to 0  
Set to 0  
Set this bit to 0.  
Set this bit to 0.  
0
0
Rev. 0 | Page 22 of 56  
AD9122  
Reg  
Name  
Addr  
(Hex)  
Bit  
Name  
Description  
Default  
Event  
Flag  
06  
PLL lock lost  
1 = indicates that the PLL, which had been previously  
locked, has unlocked from the reference signal. This is a  
latched signal.  
0
6
5
4
PLL locked  
1 = indicates that the PLL has locked to the reference  
clock input.  
0
0
0
Sync signal lost  
Sync signal locked  
1 = indicates that the sync logic, which had been  
previously locked, has lost alignment. This is a latched signal.  
1 = indicates that the sync logic did achieve sync  
alignment. This is indicated when no phase changes  
were requested for at least a few full averaging cycles.  
3
2
Sync phase locked  
Soft FIFO sync  
1 = indicates that the internal digital clock generation logic is  
ready. This occurs when internal clocks are present and stable.  
0
0
1 = indicates that a FIFO reset originating from a serial  
port-based request has successfully completed. This is  
a latched signal.  
1
0
FIFO Warning 1  
FIFO Warning 2  
1 = indicates that the difference between the FIFO read  
and write pointers is 1.  
0
0
1 = indicates that the difference between the FIFO read  
and write pointers is 2.  
Note that all bit event flags are cleared by writing the respective bit high.  
Event  
Flag  
0ꢀ  
4
3
AED comparison pass  
1 = indicates that the SED logic detected a valid input data  
pattern compared against the preprogrammed expected  
values. This is a latched signal.  
0
0
AED comparison fail  
1 = indicates that the SED logic detected an invalid input  
data pattern comparison against the preprogrammed  
expected values. This is a latched signal that automatically  
clears when eight valid I/Q data pairs are received.  
2
SED comparison fail  
1 = indicates that the SED logic detected an invalid input  
data pattern comparison against the preprogrammed  
expected values. This is a latched signal.  
Note that all bit event flags are cleared by writing the respective bit high.  
Clock  
08  
DACCLK duty correction  
1 = enables duty-cycle correction on DACCLK input.  
0
Receiver  
Control  
6
5
REFCLK duty correction  
1 = enables duty-cycle correction on REFCLK input.  
0
0
DACCLK cross-  
correction  
1 = enables differential crossing correction on the CLK input.  
4
6
REFCLK cross-  
correction  
1 = enables differential crossing correction on the  
REFCLK input.  
0
0
1
PLL  
Control  
0A  
0B  
PLL enable  
1 = enables the PLL clock multiplier. REFCLK input is used  
as the PLL reference clock signal.  
PLL manual enable  
Enables the manual selection of the VCO band.  
1 = manual mode; the correct VCO band must be  
determined by the user.  
5:0  
5
Manual VCO band  
PLL VCO enable  
Selects the VCO band to be used.  
0 = disables the PLL VCO.  
0
PLL  
Control  
1 = enables the PLL VCO. Set this bit high prior to  
enabling PLL.  
Rev. 0 | Page 23 of 56  
AD9122  
Reg  
Name  
Addr  
(Hex)  
Bit  
Name  
Description  
Default  
PLL  
0C  
ꢀ:6  
PLL Loop  
Selects the PLL loop filter bandwidth.  
3
Control  
Bandwidth[1:0]  
00 = narrowest bandwidth.  
01 = narrow/medium bandwidth.  
10 = medium/wide bandwidth.  
11 = widest bandwidth.  
4:0  
ꢀ:6  
PLL Charge Pump  
Current[4:0]  
Sets the nominal PLL charge pump current.  
001  
3
00000 = lowest current setting.  
11111 = highest current setting.  
PLL  
Control  
0D  
N2[1:0]  
PLL control clock divider. It determines the ratio of the  
DACCLK rate to the PLL controller clock rate.  
00 = fDACCLK/fPC_CLK = 2.  
01 = fDACCLK/fPC_CLK = 4.  
10 = fDACCLK/fPC_CLK = 8.  
11 = fDACCLK/fPC_CLK = 16.  
fPC_CLK must always be less than 50 MHz.  
4
PLL cross control enable Enable PLL cross point controller.  
0
3:2  
N0[1:0]  
PLL VCO divider. It determines the ratio of the VCO  
01  
output to the DACCLK frequencies.  
00 = fVCO/fDACCLK = 1.  
01 = fVCO/fDACCLK = 2.  
10 = fVCO/fDACCLK = 4.  
11 = fVCO/fDACCLK = 4.  
1:0  
N1[1:0]  
PLL Loop divider. It determines the ratio of the DACCLK to  
the REFCLK frequencies.  
01  
00 = fDACCLK/fREFCLK = 2.  
01 = fDACCLK/fREFCLK = 4.  
10 = fDACCLK/fREFCLK = 8.  
11 = fDACCLK/fREFCLK = 16.  
PLL  
Status  
0E  
PLL lock  
The PLL generated clock is tracking the REFCLK input signal.  
VCO Control Voltage readback. See Table 24.  
R
R
3:0  
VCO Control  
Voltage[3:0]  
PLL  
Status  
0F  
10  
5:0  
VCO Band  
Readback[5:0]  
Indicates the VCO band currently selected.  
R
Sync  
Control  
6
Sync enable  
1 = enables the synchronization logic.  
0
0
Data/FIFO rate toggle  
0 = operates the synchronization at the FIFO reset rate.  
1 = operates the synchronization at the data rate.  
0 = sync is initiated on the falling edge of the sync input.  
1 = sync is initiated on the rising edge of the sync input.  
3
Rising edge sync  
1
0
2:0  
Sync Averaging[2:0]  
Sets the number of input samples that are averaged in  
determining the sync phase.  
000 = 1.  
001 = 2.  
010 = 4.  
011 = 8.  
100 = 16.  
101 = 32.  
110 = 64.  
111 = 128.  
Rev. 0 | Page 24 of 56  
AD9122  
Reg  
Name  
Addr  
(Hex)  
Bit  
Name  
Description  
Default  
0
Sync  
Control  
11  
5:0  
Sync Phase Request[5:0] This sets the requested clock phase offset after sync. The  
offset unit is in DACCLK cycles.  
000000 = 0 DACCLK cycles.  
000001 = 1 DACCLK cycle.  
111111 = 63 DACCLK cycles.  
This enables repositioning of the DAC output with respect  
to the sync input. The offset can also be used to skew the  
DAC outputs between the synchronized DACs.  
Sync  
Status  
12  
13  
Sync lost  
1 = indicates that synchronization had been attained but  
has been lost.  
R
6
Sync locked  
1 = indicates that synchronization has been attained.  
Indicates the averaged sync phase offset (6.2 format).  
R
R
Sync  
ꢀ:0  
Sync Phase Readback[ꢀ:0]  
Status  
00000000 = 0.0.  
00000001 = 0.25.  
11111110 = 63.50.  
11111111 = 63.ꢀ5.  
If this value differs from the requested sync phase value,  
this indicates sync timing errors.  
Data  
Receiver  
Status  
15  
5
4
LVDS FRAME level high  
LVDS FRAME level low  
One or both of the LVDS FRAME input signals  
have exceeded 1.ꢀ V.  
R
R
One or both of the LVDS FRAME input signals  
have crossed below 0.ꢀ V.  
3
2
LVDS DCI level high  
LVDS DCI level low  
One or both of the LVDS DCI input signals have exceeded 1.ꢀ V.  
One or both of the LVDS DCI input signals have crossed  
below 0.ꢀ V.  
R
R
1
LVDS data level high  
LVDS data level low  
FIFO Phase Offset[2:0]  
One or more of the LVDS Dx input signals have  
exceeded 1.ꢀ V.  
R
R
0
0
One or both of the LVDS Dx input signals have crossed  
below 0.ꢀ V.  
FIFO  
1ꢀ  
2:0  
FIFO write pointer phase offset following FIFO reset.  
Control  
000 = 0.  
001 = 1.  
111 = ꢀ.  
This is the difference between the read pointer and the  
write pointer values upon FIFO reset. The optimal value is  
nominally 4.  
FIFO  
Status  
18  
19  
6
2
FIFO Warning 1  
FIFO Warning 2  
FIFO read and write pointers within 1.  
FIFO read and write pointers within 2.  
0
0
FIFO soft align  
acknowledge  
FIFO read and write pointers are aligned after serial  
port initiated FIFO reset.  
1
FIFO soft align request  
Request FIFO read and write pointers alignment via  
serial port.  
0
0
FIFO reset aligned  
FIFO Level[ꢀ:0]  
FIFO read and write pointers aligned after hardware reset.  
Thermometer encoded measure of the FIFO level.  
0
0
FIFO  
Status  
ꢀ:0  
Rev. 0 | Page 25 of 56  
AD9122  
Reg  
Name  
Addr  
(Hex)  
Bit  
Name  
Description  
Default  
Datapath 1B  
Control  
Bypass Premod  
Bypass Sinc−1  
Bypass NCO  
NCO gain  
1 = bypasses fS/2 premodulator.  
1 = bypasses inverse sinc filter.  
1 = bypasses NCO.  
1
1
1
0
6
5
3
0 = default. No gain scaling is applied to the NCO input to  
the internal digital modulator.  
1 = gain scaling of 0.5 is applied to the NCO input to the  
internal digital modulator. This can eliminate saturation  
of the modulator output for some combinations of data  
inputs and NCO signals.  
2
1
Bypass phase  
compensation and  
dc offset  
1 = bypasses phase compensation.  
1
0
Select sideband  
0 = the modulator outputs high-side image.  
1 = the modulator outputs low-side image. The image is  
spectrally inverted compared to the input data.  
0
Send I data to Q data  
HB1[1:0]  
1 = ignores Q data from interface and disables the clocks  
to Q datapath. Sends I data to both I and Q DACs.  
0
0
HB1  
1C  
2:1  
00 = input signal not modulated, filter pass band is from  
Control  
−0.4 to +0.4 of fIN1  
01 = input signal not modulated, filter pass band is from  
0.1 to 0.9 of fIN1  
10 = input signal modulated by fIN1, filter pass band is from  
0.6 to 1.4 of fIN1  
11 = input signal modulated by fIN1, filter pass band is from  
1.1 to 1.9 of fIN1  
.
.
.
.
0
Bypass HB1  
HB2[5:0]  
1 = bypasses first stage interpolation filter.  
0
0
HB2  
1D  
6:1  
Modulation mode for I Side Half-Band Filter 2.  
Control  
000000 = input signal not modulated, filter pass band is  
from −0.25 to +0.25 of fIN2  
001001 = input signal not modulated, filter pass band is  
from 0.0 to 0.5 of fIN2  
010010 = input signal not modulated, filter pass band is  
from 0.25 to 0.ꢀ5 of fIN2  
011011 = input signal not modulated, filter pass band is  
from 0.5 to 1.0 of fIN2  
100100 = input signal modulated by fIN2, filter pass band is  
from 0.ꢀ5 to 1.25 of fIN2  
101101 = input signal modulated by fIN2, filter pass band is  
from 1.0 to 1.5 of fIN2  
110110 = input signal modulated by fIN2, filter pass band is  
from 1.25 to 1.ꢀ5 of fIN2  
111111 = input signal modulated by fIN2, filter pass band is  
from 1.5 to 2.0 of fIN2  
.
.
.
.
.
.
.
.
0
Bypass HB2  
1 = bypasses second stage interpolation filter.  
0
Rev. 0 | Page 26 of 56  
AD9122  
Reg  
Name  
Addr  
(Hex)  
Bit  
Name  
Description  
Default  
HB3  
Control  
1E  
6:1  
HB3[5:0]  
Modulation mode for I Side Half-Band Filter 3.  
000000 = input signal not modulated, filter pass band is  
0
from −0.2 to +0.2 of fIN3  
001001 = input signal not modulated, filter pass band is  
from 0.05 to 0.45 of fIN3  
010010 = input signal not modulated, filter pass band is  
from 0.3 to 0.ꢀ of fIN3  
011011 = input signal not modulated, filter pass band is  
from 0.55 to 0.95 of fIN3  
100100 = input signal modulated by fIN3, filter pass band is  
from 0.8 to 1.2 of fIN3  
101101 = input signal modulated by fIN3, filter pass band is  
from 1.05 to 1.45 of fIN3  
110110 = input signal modulated by fIN3, filter pass band is  
from 1.3 to 1.ꢀ of fIN3  
111111 = input signal modulated by fIN3, filter pass band is  
from 1.55 to 1.95 of fIN3  
.
.
.
.
.
.
.
.
0
Bypass HB3  
Chip ID[ꢀ:0]  
FTW[ꢀ:0]  
1 = bypasses third stage interpolation filter.  
Chip ID.  
0
8
0
0
0
0
Chip ID  
1F  
ꢀ:0  
ꢀ:0  
ꢀ:0  
ꢀ:0  
ꢀ:0  
FTW LSB 30  
See Register 0x33.  
FTW  
FTW  
31  
32  
33  
FTW[15:8]  
FTW[23:16]  
FTW[31:24]  
See Register 0x33.  
See Register 0x33.  
FTW  
MSB  
FTW[31:0] is the 32-bit frequency tuning word that  
determines the frequency of the complex carrier  
generated by the on-chip NCO. The frequency is not  
updated when the FTW registers are written. The values  
are only updated when Bit 0 of Register 0x36 transitions  
from 0 to 1.  
NCO  
Phase  
Offset  
LSB  
34  
35  
36  
ꢀ:0  
ꢀ:0  
NCO Phase Offset[ꢀ:0]  
NCO Phase Offset[15:8]  
See Register 0x35.  
0
0
NCO  
The NCO sets the phase of the complex carrier signal  
when the NCO is reset. The phase offset spans between 0°  
and 360°. Each bit represents an offset of 0.0055°. Value is  
in twos complement format.  
Phase  
Offset  
MSB  
NCO  
FTW  
Update  
5
4
1
FRAME FTW  
acknowledge  
1 = indicates that the NCO has been reset due to an  
extended FRAME pulse signal.  
0
0
0
FRAME FTW request  
0 1 = the NCO is reset on the first extended FRAME  
pulse after this bit transitions from 0 to 1.  
Update FTW  
acknowledge  
1 = indicates that the FTW has been updated.  
0
Update FTW request  
I Phase Adj[ꢀ:0]  
0
0
0 1 = the FTW is updated on 0-to-1 transition of this bit.  
I Phase  
Adj LSB  
38  
39  
ꢀ:0  
See Register 0x39.  
I Phase  
Adj MSB  
1:0  
I Phase Adj[9:8]  
I Phase Adj[9:0] is used to insert a phase offset between  
the I and Q datapaths. This can be used to correct for  
phase imbalance in a quadrature modulator. See the  
Quadrature Phase Correction section for details.  
0
Q Phase  
Adj LSB  
3A  
3B  
ꢀ:0  
1:0  
Q Phase Adj[ꢀ:0]  
Q Phase Adj[9:8]  
See Register 0x3B.  
0
0
Q Phase  
Adj MSB  
Q Phase Adj[9:0] is used to insert a phase offset between  
the I and Q datapaths. This can be used to correct for  
phase imbalance in a quadrature modulator. See the  
Quadrature Phase Correction section for details.  
Rev. 0 | Page 2ꢀ of 56  
AD9122  
Reg  
Name  
Addr  
(Hex)  
Bit  
Name  
Description  
Default  
I DAC  
Offset  
LSB  
3C  
3D  
3E  
3F  
40  
ꢀ:0  
I DAC Offset[ꢀ:0]  
I DAC Offset[15:0] is a value added directly to the samples  
written to the I DAC.  
0
I DAC  
Offset  
MSB  
ꢀ:0  
ꢀ:0  
ꢀ:0  
ꢀ:0  
I DAC Offset[15:8]  
Q DAC Offset[ꢀ:0]  
Q DAC Offset[15:8]  
I DAC FS Adj[ꢀ:0]  
See Register 0x3C.  
0
Q DAC  
Offset  
LSB  
Q DAC Offset[15:0] is a value added directly to the samples  
written to the Q DAC.  
0
Q DAC  
Offset  
MSB  
See Register 0x3E.  
0
I DAC  
FS Adjust  
I DAC FS Adj[9:0] sets the full-scale current of the I DAC.  
The full-scale current can be adjusted from 8.64 mA to  
31.6 mA in step sizes of approximately 22.5 μA.  
F9  
0x000 = 8.64 mA.  
0x200 = 20.14 mA.  
0x3FF = 31.66 mA.  
I DAC  
Control  
41  
I DAC sleep  
1 = puts the I-channel DAC into sleep mode (fast  
wake-up mode).  
0
1:0  
ꢀ:0  
I DAC FS Adj[9:8]  
I Aux DAC[ꢀ:0]  
See Register 0x40.  
1
0
Aux DAC 42  
I Data  
I Aux DAC[9:0] sets the magnitude of the auxiliary DAC  
current. The range is 0 mA to 2 mA and the step size is 2 μA.  
0x000 = 0.000 mA.  
0x001 = 0.002 mA.  
0x3FF = 2.046 mA.  
I Aux  
DAC  
Control  
43  
6
I aux DAC sign  
0 = the auxiliary DAC I sign is positive, and the current is  
directed to the IOUT1P pin (Pin 6ꢀ).  
0
0
1 = the auxiliary DAC I sign is negative, and the current is  
directed to the IOUT1N pin (Pin 66).  
I aux DAC current  
direction  
0 = the auxiliary DAC I sources current.  
1 = the auxiliary DAC I sinks current.  
I channel auxiliary DAC sleep.  
See Register 0x42.  
5
I aux DAC sleep  
I Aux DAC[9:8]  
0
1:0  
ꢀ:0  
0
Q DAC  
FS Adj.  
44  
Q DAC FS Adj[ꢀ:0]  
Q DAC FS Adj[9:0] sets the full-scale current of  
F9  
the I DAC. The full-scale current can be adjusted from  
8.64 mA to 31.6 mA in step sizes of approximately 22.5 μA.  
0x000 = 8.64 mA.  
0x200 = 20.14 mA.  
0x3FF = 31.66 mA.  
Q DAC  
Control  
45  
Q DAC sleep  
1 = puts the Q-channel DAC into sleep mode (fast  
wake-up mode).  
0
1
1:0  
Q DAC FS Adj[9:8]  
See Register 0x44.  
Rev. 0 | Page 28 of 56  
AD9122  
Reg  
Name  
Addr  
(Hex)  
Bit  
Name  
Description  
Default  
Aux DAC 46  
Q Data  
ꢀ:0  
Q Aux DAC[ꢀ:0]  
Q Aux DAC[9:0] sets the magnitude of the aux DAC current.  
The range is 0 mA to 2 mA and the step size is 2 μA.  
0
0x000 = 0.000 mA.  
0x001 = 0.002 mA.  
0x3FF = 2.046 mA.  
Q Aux  
DAC  
Control  
4ꢀ  
6
Q aux DAC sign  
0 = the auxiliary DAC Q sign is positive, and the current is  
directed to the IOUT2P pin (Pin 58).  
1 = the auxiliary DAC Q sign is negative, and the current is  
directed to the IOUT2N pin (Pin 59).  
0
0
Q aux DAC current  
direction  
0 = the auxiliary DAC Q sources current.  
1 = the auxiliary DAC Q sinks current.  
Q-channel auxiliary DAC sleep  
5
Q aux DAC sleep  
Q Aux DAC[9:8]  
FS Current[2:0]  
0
0
0
1:0  
6:4  
See Register 0x46.  
DieTemp 0x48  
Range  
Control  
Auxiliary ADC full-scale current.  
000 = lowest current.  
111 = highest current.  
Auxiliary ADC reference current.  
000 = lowest current.  
111 = highest current.  
Auxiliary ADC internal capacitor value.  
0 = 5 pF.  
3:1  
0
Reference Current[2:0]  
Capacitor value  
1
0
1 = 10 pF.  
Die  
Temp  
LSB  
49  
4A  
ꢀ:0  
ꢀ:0  
Die Temp[ꢀ:0]  
Die Temp[15:8]  
See Register 0x4A.  
R
R
Die  
Die Temp[15:0] indicates the approximate die  
temperature.  
Temp  
MSB  
0xADCC = −39.9°C  
0xC422 = 25.1°C  
0xD8A8 = 84.8°C (see Temperature Sensor section for details)  
SED  
Control  
6ꢀ  
SED compare enable  
1 = enables the SED circuitry. None of the flags in this  
register or the values in Register 0xꢀ0 through  
0
Register 0xꢀ3 are significant if the SED is not enabled.  
5
3
Sample error detected  
Autoclear enable  
1 = indicates an error is detected. The bit remains set until  
cleared. Any write to this register clears this bit to 0.  
0
0
1 = enables autoclear mode. This activates Bit 1 and Bit 0  
of this register and causes Register 0xꢀ0 through  
Register 0xꢀ3 to be autocleared whenever eight  
consecutive sample data sets are received error free.  
1
Compare fail  
1 = indicates an error has been detected. This bit remains  
high until it is autocleared by the reception of eight  
consecutive error free comparisons or is cleared by  
writing to this register.  
0
0
Compare pass  
1 = indicates that the last sample comparison was error free.  
0
Compare 68  
I0 LSBs  
ꢀ:0  
Compare Value I0[ꢀ:0]  
Compare Value I0[15:0] is the word that is compared  
with the I0 input sample captured at the input interface.  
B6  
Compare 69  
I0 MSBs  
ꢀ:0  
ꢀ:0  
Compare Value I0[15:8]  
Compare Value Q0[ꢀ:0]  
See Register 0x68.  
ꢀA  
45  
Compare 6A  
Q0 LSBs  
Compare Value Q0[15:0] is the word that is compared  
with the Q0 input sample captured at the input interface.  
Rev. 0 | Page 29 of 56  
AD9122  
Reg  
Name  
Addr  
(Hex)  
Bit  
Name  
Description  
Default  
Compare 6B  
Q0 MSBs  
ꢀ:0  
Compare Value Q0[15:8] See Register 0x6A  
EA  
Compare 6C  
I1 LSBs  
ꢀ:0  
ꢀ:0  
ꢀ:0  
ꢀ:0  
ꢀ:0  
ꢀ:0  
ꢀ:0  
ꢀ:0  
Compare Value I1[ꢀ:0]  
Compare Value I1[15:8]  
Compare Value Q1[ꢀ:0]  
Compare Value I1[15:0] is the word that is compared  
with the I1 input sample captured at the input interface.  
16  
1A  
C6  
AA  
0
Compare 6D  
I1 MSBs  
See Register 0x6C.  
Compare 6E  
Q1 LSBs  
Compare Value Q1[15:0] is the word that is compared  
with the Q1 input sample captured at the input interface.  
Compare 6F  
Q1 MSBs  
Compare Value Q1[15:8] See Register 0x6E.  
SED I  
LSBs  
ꢀ0  
ꢀ1  
ꢀ2  
ꢀ3  
Errors Detected  
I_BITS[ꢀ:0]  
Errors Detected I_BITS[15:0] indicates which bits were  
received in error.  
SED I  
MSBs  
Errors Detected  
I_BITS[15:8]  
See Register 0xꢀ0.  
0
SED Q  
LSBs  
Errors Detected  
Q_BITS[ꢀ:0]  
Errors Detected Q_BITS[15:0] indicates which bits were  
received in error.  
0
SED Q  
MSBs  
Errors Detected  
Q_BITS[15:8]  
See Register 0xꢀ2.  
0
Rev. 0 | Page 30 of 56  
AD9122  
LVDS INPUT DATA PORTS  
The AD9122 has one LVDS data port that receives data for both  
the I and Q transmit paths. The device can accept data in word,  
byte, and nibble formats. In word, byte, and nibble modes, the data  
is sent over 16-bit, 8-bit, and 4-bit LVDS data busses, respectively.  
The pin assignment of the bus in each mode is shown in Table 12.  
with DCI being high, and the least significant byte of the data  
should correspond with DCI being low. The FRAME signal  
indicates to which DAC the data is sent. When FRAME is high,  
data is sent to the I DAC, and when FRAME is low, data is sent  
to the Q DAC. The complete timing diagram is shown in Figure 42.  
NIBBLE INTERFACE MODE  
Table 12. Data Bit Pair Assignments for Data Input Modes  
In nibble mode, the DCI signal is a reference bit used for  
generating the data sampling clock and should be time aligned  
with the data. The FRAME signal indicates to which DAC the  
data is sent. When FRAME is high, data is sent to the I DAC.  
When FRAME is low, data is sent to the Q DAC. All four nibbles  
must be written to the device for proper operation. For 12-bit  
resolution devices, the data in the fourth nibble acts as a place  
holder for the data framing structure. The complete timing  
diagram is shown in Figure 43.  
Mode  
MSB, …, LSB  
Word  
D15, D14, …, D0  
D14, D12, D10, D8, Dꢀ, D5, D3, D1  
D10, D8, Dꢀ, D5  
Byte1  
Nibble1  
1 In byte and nibble modes, the unused pins can be left floating.  
The data is accompanied by a reference bit (DCI) that is used to  
generate a double data rate (DDR) clock. In byte and nibble modes,  
a FRAME signal is required for controlling to which DAC the  
data is sent. All of the interface signals are time aligned. While  
there is a maximum skew requirement on the bus, there are no  
setup and hold times to be met.  
FIFO OPERATION  
The AD9122 contains a 2-channel, 16-bit wide, eight-word deep  
FIFO designed to relax the timing relationship between the data  
arriving at the DAC input ports and the internal DAC data rate  
clock. The FIFO acts as a buffer that absorbs timing variations  
between the data source and DAC, such as the clock-to-data  
variation of an FPGA or ASIC, which significantly increases the  
timing budget of the interface.  
WORD INTERFACE MODE  
In word mode, the DCI signal is a reference bit used for  
generating the data sampling clock. Time align the DCI  
signal with the data. The I DAC data should correspond  
with DCI being high and the Q DAC data with DCI being  
low, as illustrated in Figure 41.  
Figure 44 shows the block diagram of the datapath through the  
FIFO. The data is latched into the device, is formatted, and is  
then written into the FIFO register determined by the FIFO write  
pointer. The value of the write pointer is incremented every time a  
new word is loaded into the FIFO. Meanwhile, data is read from  
the FIFO register determined by the read pointer and fed into  
the digital datapath. The value of the read pointer is updated  
every time data is read into the datapath from the FIFO. This  
happens at the data rate, that is, the DACCLK rate divided by the  
interpolation ratio.  
DCI  
Q
I
Q
I
Q
I
Q
3
DATA[15:0]  
0
1
1
2
2
3
Figure 41. Timing Diagram for Word Mode  
BYTE INTERFACE MODE  
In byte mode, the DCI signal is a reference bit used for generating  
the data sampling clock and should be time aligned with the  
data. The most significant byte of the data should correspond  
DCI  
Q
I
I
Q
Q
I
I
Q
Q
2LSB  
DATA[15:0]  
FRAME  
LSB  
1MSB  
1LSB  
1MSB  
1LSB  
2MSB  
2LSB  
2MSB  
Figure 42. Timing Diagram for Byte Mode  
DCI  
DATA[15:0]  
FRAME  
Q
I
I
I
I
Q
Q
Q
Q
Q
2N3  
0N0  
1N3  
1N2  
1N1  
1N0  
1N3  
1N2  
1N1  
1N0  
Figure 43. Timing Diagram for Nibble Mode  
Rev. 0 | Page 31 of 56  
 
 
 
 
 
 
 
AD9122  
32 BITS  
REG 0  
REG 1  
REG 2  
REG 3  
REG 4  
REG 5  
REG 6  
REG 7  
16  
16  
DATA  
PATHS  
INPUT  
LATCH  
DATA  
ASSEMBLER  
DACS  
DATA  
WRITE POINTER  
READ POINTER  
DACCLK  
DCI  
32 BITS  
÷ INT  
Figure 44. Block Diagram of FIFO  
Valid data is transmitted through the FIFO as long as the  
FIFO does not overflow or become empty. Note that an over-  
flow or empty condition of the FIFO is the same as the write  
pointer and read pointer being equal. When both pointers are  
equal, an attempt is made to read and write a single FIFO register  
simultaneously. This simultaneous register access leads to  
unreliable data transfer through the FIFO and must be avoided.  
To initialize the FIFO data level through the serial port, Bit 1 of  
Register 0x18 should be toggled from 0 to 1 and back. When the  
write to the register is complete, the FIFO data level is initialized.  
This method operates similar to the method previously described.  
When the initialization is triggered, the next time the read  
pointer becomes 0, the write pointer is set to the value of the FIFO  
start level (Register 0x17, Bits[2:0]) variable upon initialization. By  
default, this is 4 but can be programmed to a value of 0 to 7.  
Nominally, data is written to the FIFO at the same rate that data  
is read from the FIFO, which keeps the data level in the FIFO  
constant. If data is written to the FIFO faster than data is read,  
the data level in the FIFO increases. If the data is written to the  
device slower than data is read, the data level in the FIFO decreases.  
For optimum timing margin, the FIFO level should be maintained  
near half full, which is the same as maintaining a difference of  
four between the write pointer and read pointer values.  
The recommended procedure for a serial port FIFO data level  
initialization is as follows:  
Request FIFO level reset by setting Register 0x18, Bit 1 to 1.  
Verify the part acknowledges the request by ensuring  
Register 0x18, Bit 2 is 1.  
Remove the request by setting Register 0x18, Bit 1 to 0.  
Verify the part drops the acknowledge signal by ensuring  
Register 0x18, Bit 2 is 0.  
Resetting the FIFO Data Level  
Monitoring the FIFO Status  
To maximize the timing margin between the DCI input and  
the internal DAC data rate clock, the FIFO data level should be  
initialized prior to beginning data transmission. The value of  
the FIFO data level can be initialized in three ways; by resetting  
the device, by strobing the FRAME input, and via a write sequence  
to the serial port. The two preferred methods are by using of the  
FRAME signal and by issuing a command.  
The FIFO initialization and status can be read from Register 0x18.  
This register provides information on the FIFO initialization  
method, and whether the initialization was successful. The MSB  
of Register 0x18 is a FIFO warning flag that can optionally  
trigger a device IRQ. This flag is an indication that the FIFO  
is close to emptying (FIFO level is 1) or overflowing (FIFO level  
is 7). This is an indication that data may soon be corrupted, and  
action should be taken.  
As discussed in the Byte Interface Mode and Nibble Interface  
Mode sections, the FRAME input is used as a data select signal  
that indicates to which DACs the input data is written. The second  
function of the FRAME input is initializing the FIFO data level  
value. This is done by asserting the FRAME signal high for at  
least the time interval needed to load complete data to the I and  
Q DACs. This corresponds to one DCI period in word mode,  
two DCI periods in byte mode, and four DCI periods in nibble  
mode. When FRAME is asserted in this manner, the write pointer  
is set to 4 (by default or to the FIFO start level) the next time  
the read pointer becomes 0 (see Figure 45).  
The FIFO data level can be read from Register 0x19 at any time.  
The serial port reported FIFO data level is denoted as a 7-bit  
thermometer code of the write counter state relative to the absolute  
read counter being at 0. The optimum FIFO data level of 4 is  
therefore reported as a value of 00001111 in the status register.  
It should be noted that, depending on the timing relationship  
between DCI and the main DACCLK, the FIFO level value can be  
off by 1 count. Therefore, it is important to keep the difference  
between the read and write pointers to at least 2.  
READ  
POINTER  
0
1
2
3
4
5
6
7
0
1
2
3
FIFO WRITE RESETS  
FRAME  
WRITE  
POINTER  
3
4
5
6
7
0
1
2
4
5
6
7
Figure 45. Timing of the FRAME Input vs. Write Pointer Value  
Rev. 0 | Page 32 of 56  
 
 
AD9122  
In data rate mode, a second timing constraint between DCI and  
DACCLK must be met in addition to the DCI-to-DATA timing  
shown in Table 14. In data rate mode, only one FIFO slot is being  
used. The DCI to DACCLK timing restriction is required to  
prevent data being written to and read from the FIFO slot at the  
same time. The required timing between DCI and DACCLK is  
shown in Figure 47.  
INTERFACE TIMING  
The timing diagram for the digital interface port is shown  
in Figure 46. The sampling point of the data bus occurs about  
350 ps after each edge of the DCI signal and has an uncertainty  
of 300 ps, as illustrated by the sampling interval shown in  
Figure 46. The DATA and FRAME signals must be valid  
throughout this sampling interval. The DATA and FRAME  
signals may change at any time between sampling intervals.  
The setup (tS) and hold (tH) times with respect to the edges  
are shown in Figure 46. The minimum setup and hold times  
are shown in Table 13.  
tDATA  
DACCLK/  
REFCLK  
SAMPLING  
INTERVAL  
tDATA  
tDATA  
DCI  
DCI  
SAMPLING  
INTERVAL  
SAMPLING  
INTERVAL  
tSDCI  
tHDCI  
DATA  
Figure 47. Timing Diagram for Input Data Port (Data Rate Mode)  
Table 14. Data Port Setup and Hold Times  
tS  
tS  
Parameter  
Time (ps)  
tH  
tH  
tSDCI (MIN)  
−120  
tHDCI (MIN)  
820  
Figure 46. Timing Diagram for Input Data Ports  
Table 13. Data Port Setup and Hold Times  
Parameter  
Time (ps)  
tS (MIN)  
tH (MIN)  
−50  
650  
The data interface timing can be verified by using the sample  
error detection (SED) circuitry. See the Interface Timing  
Validation section for details.  
Rev. 0 | Page 33 of 56  
 
 
 
 
 
AD9122  
DIGITAL DATAPATH  
The block diagram in Figure 48 shows the functionality of the  
digital datapath. The digital processing includes a premodulation  
block, three half-band interpolation filters, a quadrature modulator  
with a fine resolution NCO, phase and offset adjustment blocks,  
and an inverse sinc filter.  
Half-Band Filter 1 (HB1)  
HB1 has four modes of operation, as shown in Figure 49. The  
shape of the filter response is identical in each of the four modes.  
The four modes are distinguished by two factors, the filter center  
frequency and whether or not the input signal is modulated by  
the filter.  
PHASE  
MODE 0  
MODE 2  
MODE 1  
MODE 3  
AND  
–1  
0
PREMOD  
HB1  
HB2  
HB3  
SINC  
OFFSET  
ADJUST  
Figure 48. Block Diagram of Digital Datapath  
–20  
The digital datapath accepts I and Q data streams and processes  
them as a quadrature data stream. The signal processing blocks can  
be used when the input data stream is represented as complex data.  
–40  
–60  
The datapath can be used to process an input data stream  
representing two independent real data streams as well, but  
the functionality is somewhat restricted. The premodulation  
block can be used. As well as, any of the nonshifted interpolation  
filter modes. See the Premodulation section for more details.  
–80  
–100  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
PREMODULATION  
fIN1  
)
Figure 49. HB1 Filter Modes  
The half-band interpolation filters have selectable pass bands  
that allow the center frequencies to be moved in increments of  
½ of their input data rate. The premodulation block provides a  
digital upconversion of the incoming waveform by ½ of the  
incoming data rate, fDATA. This can be used to frequency shift  
baseband input data to the center of the interpolation filters  
pass band.  
As is shown in Figure 49, the center frequency in each mode is  
offset by ½ of the input data rate (fIN1) of the filter. Mode 0 and  
Mode 1 do not modulate the input signal. Mode 2 and Mode 3  
modulate the input signal by fIN1. When operating in Mode 0  
and Mode 2, the I and Q paths operate independently and no  
mixing of the data between channels occurs. When operating  
in Mode 1 and Mode 3, mixing of the data between the I and Q  
paths occurs; therefore, the data input into the filter is assumed  
complex. Table 15 summarizes the HB1 modes.  
INTERPOLATION FILTERS  
The transmit path contains three interpolation filters. Each of  
the three interpolation filters provides a 2× increase in output data  
rate. The half-band (HB) filters can be individually bypassed or  
cascaded to provide 1×, 2×, 4×, or 8× interpolation ratios. Each  
of the half-band filter stages offers a different combination of  
bandwidths and operating modes.  
Table 15. HB1 Filter Mode Summary  
Mode  
fCENTER  
fMOD  
None  
None  
fIN  
Input Data  
Real or complex  
Complex  
Real or complex  
Complex  
0
1
2
3
DC  
fIN/2  
fIN  
The bandwidth of the three half-band filters with respect to the  
data rate at the filter input is as follows:  
3fIN/2  
fIN  
Bandwidth of HB1 = 0.8 × fIN1  
Bandwidth of HB2 = 0.5 × fIN2  
Bandwidth of HB3 = 0.4 × fIN3  
The usable bandwidth is defined as the frequency over which  
the filters have a pass-band ripple of less than 0.001 dB and an  
image rejection of greater than +85 dB. As is discussed in the  
Half-Band Filter 1 (HB1) section, the image rejection usually sets  
the usable bandwidth of the filter, not the pass-band flatness.  
The half-band filters operate in several modes, providing  
programmable pass-band center frequencies as well as signal  
modulation. The HB1 filter has four modes of operation and  
the HB2 and HB3 filters each have eight modes of operation.  
Rev. 0 | Page 34 of 56  
 
 
 
 
 
 
AD9122  
Figure 50 shows the pass-band filter response for HB1. In most  
applications, the usable bandwidth of the filter is limited by the  
image suppression provided by the stop-band rejection and not  
by the pass-band flatness. Table 16 shows the pass-band flatness  
and stop-band rejection the HB1 filter supports at different  
bandwidths.  
Half-Band Filter 2 (HB2)  
HB2 has eight modes of operation, as shown in Figure 51 and  
Figure 52. The shape of the filter response is identical in each of  
the eight modes. The eight modes are distinguished by two factors,  
the filter center frequency and whether the input signal is  
modulated by the filter.  
0.02  
MODE 0  
MODE 4  
MODE 2  
MODE 6  
0
0
–0.02  
–0.04  
–0.06  
–0.08  
–0.10  
–20  
–40  
–60  
–80  
–100  
0
0.04 0.08 0.12 0.16 0.20 0.24 0.28 0.32 0.36 0.40  
fIN1  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
)
fIN2  
)
Figure 50. Pass-Band Detail of HB1  
Figure 51. HB2, Even Filter Modes  
MODE 7  
MODE 5  
MODE 1  
MODE 3  
Table 16. HB1 Pass-Band and Stop-Band Performance by  
Bandwidth  
0
–20  
Pass-Band  
Stop-Band  
Rejection (dB)  
Bandwidth (% of fIN1  
)
Flatness (dB)  
80  
0.001  
85  
80  
ꢀ0  
60  
50  
40  
–40  
80.4  
81.2  
82.0  
83.6  
85.6  
0.0012  
0.0033  
0.00ꢀ6  
0.02ꢀ1  
0.1096  
–60  
–80  
–100  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
fIN2  
)
Figure 52. HB2, Odd Filter Modes  
As shown in Figure 51 and Figure 52, the center frequency in  
each mode is offset by ¼ of the input data rate (fIN2) of the filter.  
Mode 0 through Mode 3 do not modulate the input signal. Mode 4  
through Mode 7 modulate the input signal by fIN2. When operating  
in Mode 0 and Mode 4, the I and Q paths operate independently  
and no mixing of the data between channels occurs. When  
operating in the other six modes, mixing of the data between  
the I and Q paths occurs; therefore, the data input to the filter  
is assumed complex.  
Rev. 0 | Page 35 of 56  
 
 
 
AD9122  
Table 17 summarizes the HB2 and HB3 modes.  
Half-Band Filter 3 (HB3)  
HB3 has eight modes of operation that function the same as  
HB2. The primary difference between HB2 and HB3 are the  
filter bandwidths.  
Table 17. HB2 and HB3 Filter Mode Summary  
Mode  
fCENTER  
fMOD  
None  
None  
None  
None  
fIN  
fIN  
fIN  
fIN  
Input Data  
Real or complex  
Complex  
Complex  
Complex  
Real or complex  
Complex  
Complex  
0
1
2
3
4
5
6
DC  
fIN/8  
fIN/4  
3fIN/8  
fIN/2  
5fIN/8  
3fIN/4  
ꢀfIN/8  
0.02  
0
–0.02  
–0.04  
–0.06  
–0.08  
–0.10  
Complex  
Figure 53 shows the pass-band filter response for HB2. In most  
applications, the usable bandwidth of the filter is limited by the  
image suppression provided by the stop-band rejection and not  
by the pass-band flatness. Table 18 shows the pass-band flatness  
and stop-band rejection the HB2 filter supports at different  
bandwidths.  
0
0.04 0.08 0.12 0.16 0.20 0.24 0.28 0.32 0.36 0.40  
fIN3  
)
Figure 54. Pass-Band Detail of HB3  
0.02  
Figure 54 shows the pass-band filter response for HB3. In most  
applications, the usable bandwidth of the filter is limited by the  
image suppression provided by the stop-band rejection and not  
by the pass-band flatness. Table 19 shows the pass-band flatness  
and stop-band rejection the HB3 filter supports at different  
bandwidths.  
0
–0.02  
–0.04  
–0.06  
–0.08  
–0.10  
Table 19. HB3 Pass-Band and Stop-Band Performance by  
Bandwidth  
Pass-Band  
Flatness (dB)  
Stop-Band  
Rejection (dB)  
Bandwidth (% of fIN3  
)
40  
0.001  
0.0014  
0.002  
0.0093  
0.03  
85  
80  
ꢀ0  
60  
50  
40  
0
0.04  
0.08  
0.12  
0.16  
0.20  
0.24  
0.28  
0.32  
40.8  
42.4  
45.6  
49.8  
55.6  
fIN2  
)
Figure 53. Pass-Band Detail of HB2  
Table 18. HB2 Pass-Band and Stop-Band Performance by  
Bandwidth  
0.1  
Pass-Band  
Flatness (dB)  
Stop-Band  
Rejection (dB)  
Bandwidth (% of fIN2  
)
50  
0.001  
85  
80  
ꢀ0  
60  
50  
40  
50.8  
52.8  
56.0  
60  
0.0012  
0.0028  
0.0089  
0.028ꢀ  
0.18ꢀꢀ  
64.8  
Rev. 0 | Page 36 of 56  
 
 
 
 
 
AD9122  
INTERPOLATION  
FTW[31:0]  
I DATA  
COSINE  
NCO  
SINE  
NCO PHASE OFFSET  
[15:0]  
OUT_I  
OUT_Q  
+
–1  
1
SPECTRAL  
INVERSION  
0
INTERPOLATION  
Q DATA  
Figure 55. Digital Quadrature Modulator Block Diagram  
Given these four parameters, the first step in configuring the  
datapath is to verify that the device supports the bandwidth  
requirements. The modes of the interpolation filters are then  
chosen. Finally, any additional frequency offset requirements  
are determined and applied with premodulation and NCO  
modulation.  
NCO MODULATION  
The digital quadrature modulator makes use of a numerically  
controlled oscillator, a phase shifter, and a complex modulator  
to provide a means for modulating the signal by a programmable  
carrier signal. A block diagram of the digital modulator is shown in  
Figure 55. The fine modulation provided by the digital modulator,  
in conjunction with the coarse modulation of the interpolation  
filters and premodulation block, allows the signal to be placed  
anywhere in the output spectrum with very fine frequency  
resolution.  
Determining Datapath Signal Bandwidth  
The available signal bandwidth of the datapath is dependent on  
the center frequency of the output signal in relation to the center  
frequency of the interpolation filters used. Signal center frequencies  
offset from the center frequencies of the half-band filters lower  
the available signal bandwidth.  
The quadrature modulator is used to mix the carrier signal  
generated by the NCO with the I and Q signal. The NCO produces  
a quadrature carrier signal to translate the input signal to a new  
center frequency. A complex carrier signal is a pair of sinusoidal  
waveforms of the same frequency, offset 90° from each other.  
The frequency of the complex carrier signal is set via FTW[31:0]  
in Register 0x30 through Register 0x33.  
When correctly configured, the available complex signal band-  
width for 2× interpolation is always 80% of the input data rate.  
The available signal bandwidth for 4× interpolation vs. output  
frequency varies between 50% and 80% of the input data rate,  
as shown in Figure 56. Note that in 4× interpolation mode,  
fDAC = 4 × fDATA; therefore, the data shown in Figure 56 repeats  
The NCO operating frequency, fNCO, is at either fDATA (HB1  
bypassed) or twice fDATA (HB1 enabled). The frequency of  
the complex carrier signal can be set from dc up to fNCO. The  
frequency tuning word (FTW) is calculated as  
four times from dc to fDAC  
.
HB1 AND HB2  
0.8  
fCARRIER  
fNCO  
FTW =  
×232  
0.5  
0.3  
The generated quadrature carrier signal is mixed with the I and  
Q data. The quadrature products are then summed into the I  
and Q data paths, as shown in Figure 55.  
HB2 AND HB3  
Updating the Frequency Tuning Word  
The frequency tuning word registers are not updated immediately  
upon writing as other configuration registers do. After loading  
the FTW registers with the desired values, Bit 0 of Register 0x36  
must transition from 0 to 1 for the new FTW to take effect.  
0.2  
0.4  
0.6  
fOUT/fDATA  
0.8  
1.0  
Figure 56. Signal Bandwidth vs. Center Frequency of the Output Signal,  
4× Interpolation  
DATAPATH CONFIGURATION  
Configuring 4× interpolation using the HB2 and HB3 filters can  
lower the power consumption of the device at the expense of  
bandwidth. The lower curve in Figure 56 shows that the supported  
Configuring the AD9122 datapath starts with the application  
requirements of the input data rate, the interpolation ratio, the  
output signal bandwidth, and the output signal center frequency.  
bandwidth in this mode varies from 30% to 50% of fDATA  
.
Rev. 0 | Page 3ꢀ of 56  
 
 
 
AD9122  
The available signal bandwidth for 8× interpolation vs. output  
frequency varies between 50% and 80% of the input data rate,  
as shown in Figure 57. Note that in 8× interpolation mode,  
fDAC = 8 × fDATA; therefore, the data shown in Figure 57 repeats  
DETERMINING INTERPOLATION FILTER MODES  
Table 20 shows the recommended interpolation filter settings  
for a variety of filter interpolation factors, filter center frequencies,  
and signal modulation. The interpolation modes were chosen  
based on the final center frequency of the signal and by  
determining the frequency shift of the signal required. When  
these are known, and put in terms of the input data rate (fDATA),  
the filter configuration that comes closest to matching is chosen  
from Table 20.  
eight times from dc to fDAC  
.
HB1, HB2, AND HB3  
0.8  
0.6  
0.5  
0.1  
0.4  
0.6  
0.9  
0.25  
0.50  
fOUT  
0.75  
1.00  
/
fDATA  
Figure 57. Signal Bandwidth vs. Center Frequency of the Output Signal,  
8× Interpolation  
Table 20. Recommended Interpolation Filter Modes (Register 0x1C through Register 0x1E)  
Filter Modes  
Interpolation Factor  
HB1[1:0]  
00 (0)  
01 (1)  
10 (2)  
11 (3)  
00 (0)  
01 (1)  
10 (2)  
11 (3)  
00 (0)  
01 (1)  
10 (2)  
11 (3)  
00 (0)  
01 (1)  
10 (2)  
11 (3)  
00 (0)  
01 (1)  
10 (2)  
11 (3)  
00 (0)  
01 (1)  
10 (2)  
11 (3)  
00 (0)  
01 (1)  
10 (2)  
11 (3)  
HB2[5:0]  
000000  
001001  
010010  
011011  
100100  
101101  
110110  
111111  
000000  
001001  
010010  
011011  
100100  
101101  
110110  
111111  
000000  
001001  
010010  
011011  
100100  
101101  
110110  
111111  
Bypass  
Bypass  
Bypass  
Bypass  
HB3[5:0]  
000000  
000000  
001001  
001001  
010010  
010010  
011011  
011011  
100100  
100100  
101101  
101101  
110110  
110110  
111111  
111111  
Bypass  
Bypass  
Bypass  
Bypass  
Bypass  
Bypass  
Bypass  
Bypass  
Bypass  
Bypass  
Bypass  
Bypass  
fSIGNAL Modulation  
DC  
DC1  
fCENTER Shift  
0
fDATA/2  
fDATA  
3fDATA/2  
2fDATA  
5fDATA/2  
3fDATA  
ꢀfDATA/2  
4fDATA  
9fDATA/2  
5fDATA  
11fDATA/2  
6fDATA  
13fDATA/2  
ꢀfDATA  
15fDATA/2  
0
fDATA/2  
fDATA  
3fDATA/2  
2fDATA  
5fDATA/2  
3fDATA  
ꢀfDATA/2  
0
fDATA/2  
fDATA  
8
8
82  
8
8
8
8
8
8
8
8
8
8
8
8
8
4
43  
4
4
4
4
4
4
2
2
2
2
fDATA  
fDATA  
1
2fDATA  
2fDATA  
1
3fDATA  
3 fDATA  
1
4fDATA  
4fDATA  
1
5fDATA  
5fDATA  
1
6fDATA  
6fDATA  
1
ꢀfDATA  
ꢀfDATA  
1
DC  
DC1  
fDATA  
fDATA  
1
2fDATA  
2fDATA  
1
3fDATA  
3fDATA  
1
DC  
DC1  
fDATA  
fDATA  
1
3fDATA/2  
1 When HB1 Mode 1 or Mode 3 is used, enabling premodulation provides an addition frequency translation of the input signal by fDATA/2, which centers a baseband  
input signal in the filter pass band.  
2 This configuration was used in the 8× interpolation without NCO example. Also, see the 8× Interpolation Without NCO section.  
3 This configuration was used in the 4× interpolation with NCO example. Also, see the 4× Interpolation With NCO section.  
Rev. 0 | Page 38 of 56  
 
 
 
 
 
 
AD9122  
4× Interpolation With NCO  
DATAPATH CONFIGURATION EXAMPLE  
8× Interpolation Without NCO  
Given the following:  
Given the following:  
f
DATA = 250 MSPS  
4× interpolation  
fBW = 140 MHz  
fCENTER = 175 MHz  
fDATA = 100 MSPS  
8× interpolation  
f
f
BW = 75 MHz  
The desired 140 MHz of bandwidth is 56% of fDATA. As shown  
in Figure 56, the value at 0.7 × fDATA is 0.6. This is calculated as  
0.8 − 2(0.7 − 0.6) = 0.6. This verifies that the AD9122 supports  
a bandwidth of 60% of fDATA, which exceeds the required 56%.  
CENTER = 100 MHz  
The desired 75 MHz of bandwidth is 75% of fDATA. In this case,  
the ratio of fOUT/fDATA = 100/100 = 1.0. From Figure 57, the band-  
width supported at fDATA is 0.8, which verifies that the AD9122  
supports the bandwidth required in this configuration.  
The signal center frequency is 0.7 × fDATA, and assuming the  
input signal is at baseband, the frequency shift required is also  
0.7 × fDATA. Choosing the second row in the IF column in the  
4× interpolation section in Table 20 selects the filter modes that  
give a center frequency of fDATA/2 and no frequency translation.  
The selected modes for the three half-band filters are HB1,  
Mode 1; HB2, Mode 1; and HB3, bypassed.  
The signal center frequency is fDATA, and assuming the input signal  
is at baseband, the frequency shift required is also fDATA. Choosing  
the third row (highlighted by the superscripted number two) of the  
IF column from Table 20 selects filter modes that give a center  
frequency of fDATA and a frequency translation of fDATA. The selected  
modes for the three half-band filters are: HB1, Mode 2; HB2,  
Mode 2; and HB3, Mode 1. Figure 58 shows how the signal  
propagates through the interpolation filters.  
Because Mode 1 of HB1 was selected, the premodulation block  
should be enabled. This provides fDATA/2 modulation, which  
centers the baseband input data at the center frequency of HB1.  
The digital modulator can be used to provide the final frequency  
translation of 0.2 × fDATA to place the output signal at 0.7 × fDATA  
as desired.  
Because 2 × fIN1 = fIN2 and 2 × fIN2 = fIN3, the signal appears  
frequency scaled by ½ into each consecutive stage. The output  
signal band spans 0.15 to 0.35 of fIN3 (400 MHz). Therefore,  
the output frequency supported is 60 MHz to 140 MHz, which  
covers the 75 MHz bandwidth centered at 100 MHz, as desired.  
,
The formula for calculating the FTW of the NCO is:  
fCARRIER  
fNCO  
FTW =  
×232  
where:  
f
f
CARRIER = 0.2 × fDATA.  
NCO = 2 × fDATA. Therefore, FTW = 232/10.  
0
2
0
3
1
HB1  
0.1  
0
0.4 0.6  
0.5  
×
2.0  
fIN1  
–0.5  
0
1.0  
1.5  
1
3
5
7
1.75  
7
4
HB2  
2
6
0.25  
0.75  
1.25  
×
2.0  
fIN2  
–0.5  
0
0.5  
1.0  
4
1.5  
0.3  
0.7  
0
1
3
5
HB3  
2
6
–0.2  
0.2 0.3  
0.7  
×
fIN3  
–0.5  
0
0.5  
1.0  
1.5  
2.0  
0.15 0.35  
Figure 58. Signal Propagation for 8× Interpolation (fDATA Modulation)  
Rev. 0 | Page 39 of 56  
 
 
 
AD9122  
In practice, this modulation results in mixing functions as  
shown in Table 21.  
DATA RATES vs. INTERPOLATION MODES  
Table 22 summarizes the maximum bus speed (fBUS), supported  
input data rates, and signal bandwidths with the various  
combinations of bus width modes and interpolation rates.  
The maximum bus speed in any mode is 1200 MHz. The  
maximum DAC update rate (fDAC) in any mode is 1200 MHz.  
The real signal bandwidth supported is a fraction of the input  
data rate, which depends on the interpolation filters (HB1, HB2,  
or HB3) selected. The complex signal bandwidth supported is  
twice the real signal bandwidth.  
Table 21. Modulation Mixing Sequences  
Modulation Mixing Sequence  
fS/2  
I = I, −I, I, −I, …  
Q = Q, −Q, Q, −Q, …  
fS/4  
I = I, Q, −I, −Q, …  
Q = Q, −I, −Q, I, …  
3 fS/4  
fS/8  
I = I, −Q, −I, Q, …  
Q = Q, I, −Q, −I, …  
In general, 2× interpolation is best supported by enabling HB1,  
and 4× interpolation is best supported enabling HB1 and HB2.  
In some cases, power dissipation can be lowered by avoiding  
HB1. If the bandwidth required is low enough, 2× interpolation  
can be supported by using HB2, and 4× interpolation can be  
supported by using HB2 and HB3.  
I = I, r(I + Q), Q, r(−I + Q), −I, −r(I + Q), −Q, r(I − Q), …  
Q = Q, r(Q − I), −I, −r(Q + I), −Q, r(−Q + I),I, r(Q + I), …  
2
2
Note that r =  
As shown in Table 21, the mixing functions of most of the modes  
crosscouple samples between the I and Q channels. The I and Q  
channels only operate independently in fS/2 mode. This means  
that real modulation using both the I and Q DAC outputs can only  
be done in fS/2 mode. All other modulation modes require  
complex input data and produce complex output signals.  
COARSE MODULATION MIXING SEQUENCES  
The coarse digital quadrature modulation occurs within the  
interpolation filters. The modulation shifts the frequency  
spectrum of the incoming data by the frequency offset selected.  
The frequency offsets available are multiples of the input data  
rate. The modulation is equivalent to multiplying the quadrature  
input signal by a complex carrier signal, C(t), of the form  
C(t) = cos(ωct) + j sin(ωct)  
Table 22. Summary of Data Rates and Bandwidths vs. Interpolation Modes  
Filter Modes  
Bus Width  
HB3  
0
0
0
0
HB2  
0
0
1
1
HB1  
0
1
0
1
fBUS (Mbps)  
1200  
1200  
1200  
1200  
1200  
1200  
1200  
1200  
1200  
1200  
1200  
600  
fDATA (Mbps)  
150  
150  
150  
150  
Real Signal Bandwidth (MHz)  
fDAC (MHz)  
150  
300  
300  
600  
600  
1200  
300  
600  
600  
Nibble (4 Bits)  
ꢀ5  
60  
3ꢀ.5  
60  
3ꢀ.5  
60  
1
1
1
1
0
1
150  
150  
Byte (8 Bits)  
0
0
0
0
1
1
0
0
1
1
1
1
0
1
0
1
0
1
300  
300  
300  
300  
300  
150  
150  
120  
ꢀ5  
120  
ꢀ5  
1200  
1200  
1200  
600  
60  
Word (16 Bits)  
0
0
0
0
1
1
0
0
1
1
1
1
0
1
0
1
0
1
1200  
800  
1200  
600  
600  
300  
600  
400  
600  
300  
300  
150  
300  
160  
150  
120  
ꢀ5  
800  
1200  
1200  
1200  
1200  
60  
Rev. 0 | Page 40 of 56  
 
 
 
AD9122  
QUADRATURE PHASE CORRECTION  
20  
15  
10  
5
0
The purpose of the quadrature phase correction block is to  
enable compensation of the phase imbalance of the analog  
quadrature modulator following the DAC. If the quadrature  
modulator has a phase imbalance, the unwanted sideband appears  
with significant energy. Tuning the quadrature phase adjust value  
can optimize image rejection in single sideband radios.  
5
10  
15  
Ordinarily, the I and Q channels have an angle of precisely 90°  
between them. The quadrature phase adjustment is used to  
change the angle between the I and Q channels. When the  
I Phase Adj[9:0] is set to 1000000000b, the I DAC output moves  
approximately 1.75° away from the Q DAC output, creating an  
angle of 91.75° between the channels. When the I Phase Adj[9:0]  
is set to 0111111111b, the I DAC output moves approximately  
1.75° toward the Q DAC output, creating an angle of 88.25°  
between the channels.  
0
20  
0xFFFF  
0x0000  
0x4000  
0x8000  
0xC000  
DAC OFFSET VALUE  
Figure 59. DAC Output Currents vs. DAC Offset Value  
INVERSE SINC FILTER  
The inverse sinc (sinc−1) filter is a nine-tap FIR filter. The  
composite response of the sinc−1 and the sin(x)/x response of  
the DAC is shown in Figure 59. The composite response has less  
The Q Phase Adj[9:0] works in a similar fashion. When the Q  
Phase Adj[9:0] is set to 1000000000b, the Q DAC output moves  
approximately 1.75° away from the I DAC output, creating an  
angle of 91.75° between the channels. When the Q Phase Adj[9:0]  
is set to 0111111111b, the Q DAC output moves approximately  
1.75° toward the I DAC output, creating an angle of 88.25°  
between the channels.  
than 0.05 dB pass-band ripple up to a frequency of 0.4 × fDACCLK  
To provide the necessary peaking at the upper end of the pass  
band, the inverse sinc filters shown have an intrinsic insertion  
loss of about 3.2 dB. Figure 60 shows the composite frequency  
.
response.  
Based on these two endpoints, the combined resolution of the  
phase compensation register is approximately 3.5°/1024 or  
0.00342° per code.  
–3.0  
–3.2  
–3.4  
–3.6  
–3.8  
–4.0  
DC OFFSET CORRECTION  
The dc value of the I datapath and the Q datapath can be  
independently controlled by adjusting the I DAC Offset[15:0]  
and Q DAC Offset[15:0] values in Register 0x3C through  
Register 0x3F. These values are added directly to the datapath  
values. Care should be taken not to overrange the transmitted  
values.  
Figure 59 shows how the DAC offset current varies as a function  
of the I DAC Offset[15:0] and the Q DAC Offset[15:0] values.  
With the digital inputs fixed at midscale (0x0000, twos complement  
data format), Figure 59 shows the nominal IOUTP and IOUTN currents  
as the DAC offset value is swept from 0 to 65535. Because IOUTP  
and IOUTN are complementary current outputs, the sum of IOUTP  
and IOUTN is always 20 mA.  
0
0.1  
0.2  
fOUT  
0.3  
0.4  
0.5  
/
fDAC  
Figure 60. Sample Composite Responses of the Sinc−1 Filter with Sin(x)/x Roll-Off  
The sinc−1 filter is enabled by default. It can be bypassed by setting  
the bypass sinc−1 bit (Register 0x1B, Bit 6).  
Rev. 0 | Page 41 of 56  
 
 
 
 
AD9122  
DAC INPUT CLOCK CONFIGURATIONS  
when the clock input signal is between 800 mV p-p differential and  
1.6 V p-p differential. Whether using the on-chip clock multiplier  
or sourcing the DACCLK, directly, it is necessary that the input  
clock signal to the device has low jitter and fast edge rates to  
optimize the DAC noise performance.  
DAC INPUT CLOCK CONFIGURATIONS  
The AD9122 DAC sample clock (DACCLK) can be sourced  
directly or by clock multiplying. Clock multiplying employs the  
on-chip phased-locked loop (PLL) that accepts a reference clock  
operating at a submultiple of the desired DACCLK rate, most  
commonly the data input frequency. The PLL then multiplies  
the reference clock up to the desired DACCLK frequency, which  
can then be used to generate all the internal clocks required by  
the DAC. The clock multiplier provides a high quality clock that  
meets the performance requirements of most applications. Using  
the on-chip clock multiplier removes the burden of generating  
and distributing the high speed DACCLK.  
Direct Clocking  
Direct clocking with a low noise clock produces the lowest noise  
spectral density at the DAC outputs. To select the differential CLK  
inputs as the source for the DAC sampling clock, set the PLL  
enable bit (Register 0x0A, Bit[7]) to 0. This powers down the  
internal PLL clock multiplier and selects the input from the  
DACCLKP and DACCLKN pins as the source for the internal  
DAC sample clock.  
The second mode bypasses the clock multiplier circuitry and  
allows DACCLK to be sourced directly to the DAC core. This  
mode enables the user to source a very high quality clock directly  
to the DAC core. Sourcing the DACCLK directly through the  
REFCLKP, REFCLKN, DACCLKP, and DACCLKN pins may  
be necessary in demanding applications that require the lowest  
possible DAC output noise, particularly when directly synthesizing  
signals above 150 MHz.  
The device also has duty-cycle correction circuitry and  
differential input level correction circuitry. Enabling these  
circuits can provide improved performance in some cases.  
The control bits for these functions can be found in Register 0x08.  
See Table 11 for complete details.  
Clock Multiplication  
The on-chip PLL clock multiplier circuit can be used to generate  
the DAC sample rate clock from a lower frequency reference  
clock. When the PLL enable bit (Register 0x0A, Bit[7]) is set to 1,  
the clock multiplication circuit generates the DAC sample clock  
from the lower rate REFCLK input. The functional diagram of  
the clock multiplier is shown in Figure 62.  
Driving the DACCLK and REFCLK Inputs  
The REFCLK and DACCLK differential inputs share similar  
clock receiver input circuitry. Figure 61 shows a simplified circuit  
diagram of the input. The on-chip clock receiver has a differential  
input impedance of about 10 kΩ. It is self biased to a common-  
mode voltage of about 1.25 V. The inputs can be driven by  
direct coupling differential PECL or LVDS drivers. The inputs  
can also be ac-coupled if the driving source cannot meet the  
input compliance voltage of the receiver.  
The clock multiplication circuit operates such that the VCO  
outputs a frequency, fVCO, equal to the REFCLK input signal  
frequency multiplied by N1 × N0.  
f
VCO = fREFCLK × (N1 × N0)  
The DAC sample clock frequency, fDACCLK, is equal to  
DACCLK = fREFCLK × N1  
DACCLKP,  
REFCLKP  
5k  
f
1.25V  
The output frequency of the VCO must be chosen to keep fVCO  
in the optimal operating range of 1.0 GHz to 2.1 GHz. The  
frequency of the reference clock and the values of N1 and N0  
must be chosen so that the desired DACCLK frequency can be  
synthesized and the VCO output frequency is in the correct range.  
5kΩ  
DACCLKN,  
REFCLKN  
Figure 61. Clock Receiver Input Equivalent Circuit  
The minimum input drive level to either of the clock inputs is  
200 mV p-p differential. The optimal performance is achieved  
0x0E[3:0]  
0x06[7:6]  
VCO CONTROL  
VOLTAGE  
PLL LOCKED  
ADC  
PLL LOCKED LOST  
REFCLKP/REFCLKN  
PHASE  
LOOP  
FILTER  
(PIN 69 AND PIN 70)  
DETECTION  
VCO  
÷N1  
÷N0  
0x0D[1:0]  
N1  
0x0D[3:2]  
N0  
DACCLK  
DACCLKP/DACCLKN  
(PIN 2 AND PIN 3)  
0x0D[7:6]  
N2  
÷N2  
0x0A[7]  
PLL ENABLE  
PC_CLK  
Figure 62. PLL Clock Multiplication Circuit  
Rev. 0 | Page 42 of 56  
 
 
 
AD9122  
PLL Settings  
Manual VCO Band Select  
There are three settings for the PLL circuitry that should be  
programmed to their nominal values. The PLL values shown in  
Table 23 are the recommended settings for these parameters.  
The device also has a manual band select mode (PLL manual  
enable, Register 0x0A, Bit[6] = 1) that allows the user to select  
the VCO tuning band. When in manual mode, the VCO band  
is set directly with the value written to the manual VCO band,  
(Register 0x0A, Bit[5:0]). To properly select the VCO band,  
follow these steps:  
Table 23. PLL Settings  
Address  
Register  
Optimal  
Setting  
PLL SPI Control  
Bit  
1. Put the device in manual band select mode.  
2. Sweep the VCO band over a range of bands that result in  
the PLL being locked.  
PLL Loop Bandwidth[1:0]  
PLL Charge Pump Current[4:0]  
PLL Cross Control Enable  
0x0C  
0x0C  
0x0D  
[ꢀ:6] 11  
[4:0] 00001  
[4]  
1
3. For each band, verify that the PLL is locked and read the  
PLL using the VCO control voltage (Register 0x0E[3:0]).  
4. Select the band that results in the control voltage being  
closest to the center of the range (that is, 0000 or 1000). See  
Table 24 for more details. The resulting VCO band should  
be the optimal setting for the device. Write this band to the  
manual VCO band (Register 0x0A[5:0]) value.  
5. If desired, an indication of where the VCO is within the  
operating frequency band can be determined by querying  
the VCO control voltage. Table 24 shows how to interpret  
the PLL VCO control voltage (Register 0x0E, Bits[2:0]) value.  
Configuring the VCO Tuning Band  
The PLL VCO has a valid operating range from approximately  
1.0 GHz to 2.1 GHz covered in 63 overlapping frequency bands.  
For any desired VCO output frequency, there may be several  
valid PLL band select values. The frequency bands of a typical  
device are shown in Figure 63. Device-to-device variations and  
operating temperature affect the actual band frequency range.  
Therefore, it is required that the optimal PLL band select value  
be determined for each individual device.  
Automatic VCO Band Select  
Table 24. VCO Control Voltage Range Indications  
The device has an automatic VCO band select feature on chip.  
Using the automatic VCO band select feature is a simple and  
reliable method of configuring the VCO frequency band. This  
feature is enabled by writing 0x80 to Register 0x0A. When this  
value is written, the device executes an automated routine that  
determines the optimal VCO band setting for the device. The  
setting selected by the device ensures that the PLL remains  
locked over the full −40°C to +85°C operating temperature  
range of the device without further adjustment. (The PLL  
remains locked over the full temperature range even if the  
temperature during initialization is at one of the temperature  
extremes.)  
VCO Control Voltage  
Indication  
0111  
0110  
0101  
0100  
0011  
0010  
0001  
0000  
1000  
1001  
1010  
1011  
1100  
1101  
1110  
1111  
Move to higher VCO Band  
VCO is operating in the higher end of  
frequency band  
VCO is operating within an optimal  
region of the frequency band  
VCO is operating in the lower end of  
frequency band  
0
4
8
12  
16  
20  
24  
28  
32  
36  
40  
44  
48  
52  
56  
60  
Move to lower VCO Band  
1000  
1200  
1400  
1600  
1800  
2000  
2200  
VCO FREQUENCY (MHz)  
Figure 63. PLL Lock Range Over Temperature for a Typical Device  
Rev. 0 | Page 43 of 56  
 
 
 
AD9122  
ANALOG OUTPUTS  
For nominal values of VREF (1.2 V), RSET (10 kꢀ), and DAC gain  
(512), the full-scale current of the DAC is typically 20.16 mA.  
The DAC full-scale current can be adjusted from 8.66 mA to  
31.66 mA by setting the DAC gain parameter setting as shown  
in Figure 65.  
TRANSMIT DAC OPERATION  
Figure 64 shows a simplified block diagram of the transmit path  
DACs. The DAC core consists of a current source array, a switch  
core, digital control logic, and full-scale output current control.  
The DAC full-scale output current (IOUTFS) is nominally 20 mA.  
The output currents from the IOUT1P/IOUT2P and IOUT1N/  
IOUT2N pins are complementary, meaning that the sum of the  
two currents always equals the full-scale current of the DAC.  
The digital input code to the DAC determines the effective  
differential current delivered to the load.  
35  
30  
25  
20  
15  
10  
5
I DAC FS ADJUST  
1.2V  
REGISTER 0x40  
IOUT1P  
I DAC  
5k  
IOUT1N  
REFIO  
CURRENT  
SCALING  
0.1µF  
FSADJ  
10kΩ  
IOUT2N  
IOUT2P  
Q DAC  
0
Q DAC FS ADJUST  
REGISTER 0x44  
0
200  
400  
600  
800  
1000  
DAC GAIN CODE  
Figure 64. Simplified Block Diagram of DAC Core  
Figure 65. DAC Full-Scale Current vs. DAC Gain Code  
The DAC has a 1.2 V band gap reference with an output impedance  
of 5 kꢀ. The reference output voltage appears on the REFIO  
pin. When using the internal reference, the REFIO pin should  
be decoupled to AVSS with a 0.1 μF capacitor. Only use the internal  
reference for external circuits that draw dc currents of 2 μA or  
less. For dynamic loads or static loads greater than 2 μA, buffer  
the REFIO pin. If desired, an external reference (between 1.10 V  
and 1.30 V) can be applied to the REFIO pin. The internal  
reference can either be overdriven or powered down by setting  
Register 0x43, Bit [5].  
Transmit DAC Transfer Function  
The output currents from the IOUT1P/IOUT2P and IOUT1N/  
IOUT2N pins are complementary, meaning that the sum of the  
two currents always equals the full-scale current of the DAC.  
The digital input code to the DAC determines the effective  
differential current delivered to the load. IOUT1P/IOUT2P  
provide maximum output current when all bits are high. The  
output currents vs. DACCODE for the DAC outputs are  
expressed as  
DACCODE  
A 10 kꢀ external resistor, RSET, must be connected from the  
IOUTP  
=
× IOUTFS  
(1)  
(2)  
2N  
RESET  
pin to AVSS. This resistor, along with the reference  
control amplifier, sets up the correct internal bias currents for  
the DAC. Because the full-scale current is inversely proportional  
to this resistor, the tolerance of RSET is reflected in the full-scale  
output amplitude.  
IOUTN = IOUTFS IOUTP  
where DACCODE = 0 to 2N − 1.  
Transmit DAC Output Configurations  
The optimum noise and distortion performance of the AD9122  
is realized when it is configured for differential operation. The  
common-mode error sources of the DAC outputs are significantly  
reduced by the common-mode rejection of a transformer or  
differential amplifier. These common-mode error sources include  
even-order distortion products and noise. The enhancement in  
distortion performance becomes more significant as the frequency  
content of the reconstructed waveform increases and/or its  
amplitude increases. This is due to the first-order cancellation  
of various dynamic common-mode distortion mechanisms,  
digital feedthrough, and noise.  
The full-scale current equation, where the DAC gain is set  
individually for the I and Q DACs in Register 040 and Register 044,  
respectively, follows:  
VREF  
3
IFS  
=
× 72 +  
× DAC gain  
RSET  
16  
Rev. 0 | Page 44 of 56  
 
 
 
AD9122  
–60  
–65  
–70  
–75  
–80  
–85  
–90  
Figure 66 shows the most basic DAC output circuitry. A pair of  
resistors, RO, is used to convert each of the complementary output  
currents to a differential voltage output, VOUT. Because the current  
outputs of the DAC are high impedance, the differential driving  
point impedance of the DAC outputs, ROUT, is equal to 2 × RO.  
Figure 67 illustrates the output voltage waveforms.  
10mA  
20mA  
30mA  
V
+
IP  
IOUT1P  
R
O
V
OUTI  
R
O
V
IN  
IOUT1N  
0
0.2  
0.4  
0.6  
V
0.8  
(V)  
1.0  
1.2  
1.4  
V
+
QP  
V
IOUT2P  
CMD  
R
O
Figure 68. IMD vs. Output Common-Mode Voltage (fOUT = 61 MHz,  
RLOAD = 50 Ω differential, IFS = 10 mA, 20 mA, and 30 mA)  
OUTQ  
R
O
–50  
V
QN  
10mA  
IOUT2N  
20mA  
–55  
30mA  
Figure 66. Basic Transmit DAC Output Circuit  
V
PEAK  
–60  
–65  
–70  
–75  
–80  
–85  
V
CM  
0
V
V
P
N
V
OUT  
–V  
PEAK  
Figure 67. Voltage Output Waveforms  
0
0.2  
0.4  
0.6  
V
0.8  
(V)  
1.0  
1.2  
1.4  
CMD  
The common-mode signal voltage, VCM, is calculated as  
Figure 69. IMD vs. Output Common-Mode Voltage (fOUT = 161 MHz,  
RLOAD = 50 Ω differential, IFS = 10 mA, 20 mA, and 30 mA)  
IFS  
2
VCM  
=
× RO  
AUXILIARY DAC OPERATION  
The peak output voltage, VPEAK, is calculated as  
PEAK = IFS × RO  
The AD9122 have two auxiliary DACs, one associated with the  
I path and one associated with the Q path. These auxiliary DACs  
can be used to compensate for dc offsets in the transmitted signal.  
Each auxiliary DAC has a single-ended current that can sink or  
source current into either the P or N output of the associated  
transmit DAC. The auxiliary DAC structure is shown in Figure 70.  
V
With this circuit configuration, the single-ended peak voltage is  
the same as the peak differential output voltage.  
Transmit DAC Linear Output Signal Swing  
To achieve optimum performance, the DAC outputs have a linear  
output compliance voltage range that must be adhered to. The  
linear output signal swing is dependent on the full-scale output  
current, IOUTFS, and the common-mode level of the output.  
Figure 68 and Figure 69 show the IMD performance vs. the  
common-mode voltage at the different full-scale currents and  
output frequencies.  
V
B
AUXDAC[4:0]  
AUXDAC  
DIRECTION  
AUXDAC  
SIGN  
IOUTP  
IOUTN  
I DAC  
Figure 70. Auxiliary DAC Structure  
Rev. 0 | Page 45 of 56  
 
 
 
 
 
 
AD9122  
The control registers for controlling the I and Q auxiliary DACs  
are in Register 0x42, Register 0x43, and Register 0x46.  
Figure 73 shows a fifth-order, low-pass filter. A common-mode  
choke is used between the I-V resistors and the remainder of  
the filter. This removes the common-mode signal produced by  
the DAC and prevents the common-mode signal from being  
converted to a differential signal, which can appear as unwanted  
spurious signals in the output spectrum. Splitting the first filter  
capacitor into two and grounding the center point creates a  
common-mode low-pass filter, providing additional common-  
mode rejection of high frequency signals. A purely differential  
filter can pass common-mode signals.  
Interfacing to Modulators  
The AD9122 interfaces to the ADL537x family of modulators  
with a minimal number of components. An example of the  
recommended interface circuitry is shown in Figure 71.  
The baseband inputs of the ADL537x family require a dc bias  
of 500 mV. The nominal midscale output current on each output  
of the DAC is 10 mA (½ the full-scale current). Therefore, a  
single 50 Ω resistor to ground from each of the DAC outputs  
results in the desired 500 mV dc common-mode bias for the  
inputs to the ADL537x. The signal level can be reduced through  
the addition of the load resistor in parallel with the modulator  
inputs. The peak-to-peak voltage swing of the transmitted signal is  
DRIVING THE ADL5375-15  
The ADL5375-15 requires a 1500 mV dc bias and, therefore,  
requires a slightly more complex interface than most other  
Analog Devices, Inc, modulators. It is necessary to level shift  
the DAC output from a 500 mV dc bias to the 1500 mV dc bias  
that the ADL5375-15 requires. Level shifting can be achieved  
with a purely passive network, as shown in Figure 72. In this  
network, the dc bias of the DAC remains at 500 mV while the  
input to the ADL5375-15 is 1500 mV. This passive, level shifting  
network introduces approximately 2 dB of loss in the ac signal.  
[
2×RB ×RL  
]
]
VSIGNAL = IFS  
×
[2×RB + RL  
AD9122  
ADL537x  
IBBP  
67  
IOUT1P  
RBIP  
50  
RLI  
100Ω  
RBIN  
50Ω  
AD9122  
ADL5375-15  
IBBP  
RSIN  
1k  
66  
59  
67  
21  
IOUT1N  
IOUT2N  
IBBN  
IOUT1P  
RBIP  
45.3Ω  
RLIP  
3480Ω  
5V  
QBBN  
RBIN  
45.3Ω  
RLIN  
3480Ω  
RSIP  
1kΩ  
66  
59  
22  
RBQN  
50Ω  
IOUT1N  
IOUT2N  
IBBN  
RLQ  
100Ω  
RBQP  
50Ω  
RSQN  
1kΩ  
58  
9
IOUT2P  
QBBP  
QBBN  
RBQN  
45.3Ω  
RLQN  
3480Ω  
5V  
10  
Figure 71. Typical Interface Circuitry Between the AD9122 and the ADL537x  
Family of Modulators  
RBQP  
45.3Ω  
RLQP  
3480Ω  
RSQP  
1kΩ  
58  
IOUT2P  
QBBP  
BASEBAND FILTER IMPLEMENTATION  
Figure 72. Passive, Level Shifting Network for Biasing ADL5375-15  
Most applications require a baseband anti-imaging filter between  
the DAC and the modulator to filter out Nyquist images and  
broadband DAC noise. The filter can be inserted between the  
I-V resistors at the DAC output and the signal-level setting resistor  
across the modulator input. Doing this establishes the input and  
output impedances for the filter.  
22pF  
56nH  
50  
3pF  
33nH  
2pF  
6pF  
3pF  
140ADL537x  
AD9122  
33nH  
56nH  
50Ω  
22pF  
Figure 73. DAC Modulator Interface with Fifth-Order, Low Pass Filter  
Rev. 0 | Page 46 of 56  
 
 
 
 
AD9122  
The disadvantage is that the common-mode level of the output  
signal changes as a function of the auxiliary DAC current. The  
opposite is true when the digital offset adjustment is used.  
REDUCING LO LEAKAGE AND UNWANTED  
SIDEBANDS  
Analog quadrature modulators can introduce unwanted signals at  
the LO frequency due to dc offset voltages in the I and Q baseband  
inputs, as well as feedthrough paths from the LO input to the  
output. The LO feedthrough can be nulled by applying the correct  
dc offset voltages at the DAC output. This can be done using the  
auxiliary DACs (Register 0x42, Register 0x43, Register 0x46, and  
Register 0x47) or by using the digital dc offset adjustments  
(Register 0x3C through Register 0x3F). The advantage of using  
the auxiliary DACs is that none of the main DAC dynamic  
range is used to perform the dc offset adjustment.  
Good sideband suppression requires both gain and phase  
matching of the I and Q signals. The I/Q phase adjust  
(Register 0x38 through Register 0x3B) and DAC FS adjust  
(Register 0x40 and Register 0x44) registers can be used to  
calibrate I and Q transmit paths to optimize the sideband  
suppression.  
Rev. 0 | Page 4ꢀ of 56  
 
AD9122  
DEVICE POWER DISSIPATION  
1700  
1500  
1300  
1100  
900  
1×  
2×  
4×  
8×  
The AD9122 has four supply rails: AVDD33, IOVDD, DVDD18,  
and CVDD18.  
The AVDD33 supply powers the DAC core circuitry. The power  
dissipation of the AVDD33 supply rail is independent of the digital  
operating mode and sample rate. The current drawn from the  
AVDD33 supply rail is typically 57 mA (188 mW) when the  
full-scale current of the I and Q DACs is set to the nominal value  
of 20 mA. Changing the full-scale current directly impacts the  
supply current drawn from the AVDD33 rail. For example, if  
the full-scale current of the I DAC and the Q DAC is changed to  
10 mA, the AVDD33 supply current drops by 20 mA to 37 mA.  
700  
500  
300  
100  
RESET  
The IOVDD voltage supplies the serial port I/O pins, the  
IRQ  
0
50  
100  
150  
200  
250  
300  
pin, and the  
pin. The voltage applied to the IOVDD pin  
fDATA (MHz)  
can range from 1.8 V to 2.8 V. The current drawn by the  
IOVDD supply pin is typically 3 mA.  
Figure 74. Total Power Dissipation vs. fDATA Without PLL, Fine NCO, and  
Inverse Sinc  
1200  
1×  
The DVDD18 supply powers all of the digital signal processing  
blocks of the device. The power consumption from this supply  
is a function of which digital blocks are enabled and the frequency  
at which the device is operating.  
2×  
4×  
1000  
8×  
800  
600  
400  
200  
0
The CVDD18 supply powers the clock receiver and clock  
distribution circuitry. The power consumption from this  
supply varies directly with the operating frequency of the  
device. CVDD18 also powers the PLL. The power dissipation  
of the PLL is typically 80 mA when enabled.  
Figure 74 through Figure 78 detail the power dissipation of the  
AD9122 under a variety of operating conditions. All of the graphs  
are taken with data being supplied to both the I and Q channels.  
The power consumption of the device does not vary significantly  
with changes in the coarse modulation mode selected or analog  
output frequency. Graphs of the total power dissipation are shown  
along with the power dissipation of the DVDD18 and CVDD18  
supplies.  
0
50  
100  
150  
200  
250  
300  
fDATA (MHz)  
Figure 75. DVDD18 Power Dissipation vs. fDATA Without Fine NCO and  
Inverse Sinc  
250  
1×  
2×  
4×  
8×  
Maximum power dissipation can be estimated to be 20% higher  
than the typical power dissipation.  
200  
150  
100  
50  
0
0
50  
100  
150  
200  
250  
300  
fDATA (MHz)  
Figure 76. CVDD18 Power Dissipation vs. fDATA with PLL Disabled  
Rev. 0 | Page 48 of 56  
 
 
AD9122  
300  
250  
200  
150  
100  
50  
TEMPERATURE SENSOR  
The AD9122 has a diode-based temperature sensor for measuring  
the temperature of the die. The temperature reading is accessed  
through Register 0x49 and Register 0x4A. The temperature of  
the die can be calculated by  
(DieTemp[15 : 0]47,925)  
TDIE  
=
88  
where TDIE is the die temperature in oC. The temperature  
accuracy is 5oC typical.  
Estimates of the ambient temperature can be made if the power  
dissipation of the device is known. For example, if the device power  
dissipation is 800 mW, and the measured die temperature is 50oC,  
then the ambient temperature can be calculated as  
0
0
200  
400  
600  
800  
100  
1200  
fDAC (MHz)  
Figure 77. DVDD18 Power Dissipation vs. fDAC Due to Inverse Sinc Filter  
TA = TDIE PD × TJA = 50 – 0.8 × 20.7 = 33.4°C  
300  
1×  
where:  
2×, 4×, 8×  
TA is the ambient temperature in oC.  
TJA is the thermal resistance from junction to ambient of the  
AD9122, as shown in Table 7.  
250  
200  
150  
100  
50  
To use the temperature sensor, it must be enabled by setting  
Register 0x01, Bit 4 to 0. In addition, to obtain accurate readings,  
the range control register (Register 0x48) should be set to 0x02.  
0
50  
100  
150  
200  
250  
300  
fDATA (MHz)  
Figure 78. DVDD18 Power Dissipation vs. fDATA Due to Fine NCO  
Rev. 0 | Page 49 of 56  
 
 
 
AD9122  
MULTICHIP SYNCHRONIZATION  
System demands may require that the outputs of multiple DACs  
be synchronized with each other or with a system clock. Systems  
that support transmit diversity or beam forming, where multiple  
antennas are used to transmit a correlated signal, require multiple  
DAC outputs to be phase aligned with each other. Systems with  
a time division multiplexing transmit chain may require one or  
more DACs to be synchronized with a system-level reference clock.  
SYNCHRONIZATION WITH CLOCK MULTIPLICATION  
When using the clock multiplier to generate the DAC sample  
rate clock, the REFCLK input signal acts as both the reference  
clock for the PLL-based clock multiplier and as the synchronization  
signal. To synchronize devices, distribute the REFCLK signal  
with low skew to all of the devices that need to be synchronized.  
Skew between the REFCLK signals of the different devices  
shows up directly as a timing mismatch at the DAC outputs.  
Multiple devices are considered synchronized to each other when  
the state of the clock generation state machines is identical for all  
parts, and when time aligned data is being read from the FIFOs  
of all parts simultaneously. Devices are considered synchronized  
to a system clock when there is a fixed and known relationship  
between the clock generation state machine and the data being  
read from the FIFO and a particular clock edge of the system  
clock. The AD9122 has provisions for enabling multiple devices  
to be synchronized to each other or to a system clock.  
The frequency of the REFCLK signal is typically equal to the  
input data rate. The FRAME and DCI signals can be created  
in the FPGA along with the data. A circuit diagram of a typical  
configuration is shown in Figure 79.  
MATCHED  
LENGTH TRACES  
REFCLKP/  
REFCLKN  
IOUT1P/  
IOUT1N  
FRAMEP/  
FRAMEN  
DCIP/  
DCIN  
The AD9122 supports synchronization in two different modes,  
data rate mode and FIFO rate mode. The lowest rate clock that  
the synchronization logic attempts to synchronize to distinguishes  
these two modes. In data rate mode, the input data rate represents  
the lowest synchronized clock. In FIFO rate mode, the FIFO  
rate, which is the data rate divided by the FIFO depth of 8,  
represents the lowest rate clock. The advantage of FIFO rate  
synchronization is increased time between keep-out windows  
for DCI changes relative to the DACCLK or REFCLK input.  
SYSTEM  
CLOCK  
LOW SKEW  
CLOCK DRIVER  
REFCLKP/  
REFCLKN  
IOUT2P/  
IOUT2N  
FRAMEP/  
FRAMEN  
DCIP/  
DCIN  
FPGA  
Figure 79. Typical Circuit Diagram for Synchronizing Devices  
The Procedure for Synchronization when Using the PLL section  
outlines the steps required to synchronize multiple devices. The  
procedure assumes that the REFCLK signal is applied to all of the  
devices, and that the PLL of each device is phase locked to it. The  
following procedure must be carried out on each individual device.  
When in data rate mode, the elasticity of the FIFO is not used to  
absorb timing variations between the data source and the DAC,  
resulting in keep-out widows repeating at the input data rate.  
The method chosen for providing the DAC sampling clock directly  
impacts the synchronization methods available. When the device  
clock multiplier is used, only data rate mode is available. When  
the DAC sampling clock is sourced directly, both data rate  
mode and FIFO rate mode synchronization is available. The  
following sections detail the synchronization methods for  
enabling both clocking modes and querying the status of the  
synchronization logic.  
Procedure for Synchronization when Using the PLL  
Configure for data rate, periodic synchronization by writing  
0xC0 to the sync control register (Register 0x10). Additional  
synchronization options are available.  
Read the sync status register (Register 0x12) and verify that  
the sync locked bit (Bit 6) is set high, indicating that the device  
achieved back-end synchronization and that the sync lost bit  
(Bit 7) is low. These levels indicate that the clocks are running with  
a constant and known phase relative to the sync signal.  
Reset the FIFO by strobing the FRAME signal high for the time  
required to write two complete input data words. Resetting the  
FIFO ensures that the correct data is being read from the FIFO.  
This completes the synchronization procedure, and at this stage,  
all devices should be synchronized.  
Rev. 0 | Page 50 of 56  
 
 
 
 
AD9122  
tSKEW  
REFCLKP(1)/  
REFCLKN(1)  
REFCLKP(2)/  
REFCLKN(2)  
tSU_DCI tH_DCI  
DCIP(2)/  
DCIN(2)  
FRAMEP(2)/  
FRAMEN(2)  
Figure 80. Timing Diagram Required for Synchronizing Devices  
DACCLKP/  
DACCLKN  
REFCLKP/  
REFCLKN  
FRAMEP/  
FREMEN  
IOUT1P/  
IOUT1N  
DCIP/  
DCIN  
SAMPLE  
RATE CLOCK  
LOW SKEW  
CLOCK DRIVER  
MATCHED  
LENGTH TRACES  
DACCLKP/  
DACCLKN  
REFCLKP/  
REFCLKN  
FRAMEP/  
FREMEN  
DCIP/  
DCIN  
IOUT2P/  
IOUT2N  
SYNC  
CLOCK  
LOW SKEW  
CLOCK DRIVER  
FPGA  
Figure 81. Typical Circuit Diagram for Synchronizing Devices to a System Clock  
To maintain synchronization, the skew between the REFCLK  
signals of the devices must be less than tSKEW nanoseconds. There is  
also a setup-and-hold time to be observed between the DCI and  
data of each device and the REFCLK signal. When resetting the  
FIFO, the FRAME signal must be held high for the time interval  
required to write two complete input data words. A timing  
diagram of the input signals is shown in Figure 80.  
to a master clock, then use the master clock directly for generating  
the REFCLK input (see Figure 81).  
DATA RATE MODE SYNCHRONIZATION  
The Procedure for Data Rate Synchronization when Directly  
Sourcing the DAC Sampling Clock section outlines the steps  
required to synchronize multiple devices in data rate mode. The  
procedure assumes that the DACCLK and REFCLK signals are  
applied to all of the devices. The procedure must be carried out  
on each individual device.  
The preceding example shows a REFCLK frequency equal to  
the data rate. While this is the most common situation, it is not  
strictly required for proper synchronization. Any REFCLK  
frequency that satisfies the following equation is acceptable.  
Procedure for Data Rate Synchronization when Directly  
Sourcing the DAC Sampling Clock  
f
SYNC_I = fDACCLK/2N and fSYNC_I fDATA  
Configure for data rate, periodic synchronization by writing  
0xC0 to the sync control register (Register 0x10). Additional  
synchronization options are available and are described in the  
Additional Synchronization Features section.  
where N = 0, 1, 2, or 3.  
As an example, a configuration with 4× interpolation and clock  
frequencies of fVCO = 1600 MHz, fDACCLK = 800 MHz, fDATA  
=
200 MHz, and fSYNC_I = 100 MHz is a viable solution.  
Poll the sync locked bit (Register 0x12, Bit 6) to verify that the  
device is back-end synchronized. A high level on this bit indicates  
that the clocks are running with a constant and known phase  
relative to the sync signal.  
SYNCHRONIZATION WITH DIRECT CLOCKING  
When directly sourcing the DAC sample rate clock, a separate  
REFCLK input signal is required for synchronization. To  
synchronize devices, the DACCLK signal and the REFCLK  
signal must be distributed with low skew to all of the devices  
being synchronized. If the devices need to be synchronized  
Reset the FIFO by strobing the FRAME signal high for the time  
interval required to input two complete data input words. Resetting  
the FIFO ensures that the correct data is being read from the  
FIFO of each of the devices simultaneously.  
Rev. 0 | Page 51 of 56  
 
 
 
 
AD9122  
This completes the synchronization procedure, and at this stage,  
all devices should be synchronized.  
Poll the sync locked bit (Register 0x12, Bit[6]) to verify that the  
device is back-end synchronized. A high level on this bit indicates  
that the clocks are running with a constant and known phase  
relative to the sync signal.  
To ensure that each of the DACs are updated with the correct  
data on the same CLK edge, two timing relationships must be  
met on each DAC. DCIP/DCIN and D[15:0]P/D[15:0]N must  
meet the setup-and-hold times with respect to the rising edge of  
DACCLK, and REFCLK must also meet the setup-and-hold time  
with respect to the rising edge of DACCLK. When resetting the  
FIFO, the FRAME signal must be held high the time required to  
input two complete data input words. When these conditions are  
met, the outputs of the DACs are updated within tSKEW + tOUTDLY  
nanoseconds of each other. A timing diagram that illustrates the  
timing requirements of the input signals is shown in Figure 82.  
tSKEW  
Reset the FIFO by strobing the FRAME signal high for the time  
required to input to complete input words. Resetting the FIFO  
ensures that the correct data is being read from the FIFO of  
each of the devices simultaneously.  
This completes the synchronization procedure, and at this stage,  
all devices should be synchronized.  
To ensure that each of the DACs are updated with the correct  
data on the same CLK edge, two timing relationships must be  
met on each DAC. DCIP/DCIN and D[15:0]P/D[15:0]N must  
meet the setup-and-hold times with respect to the rising edge of  
DACCLK, and REFCLK must also meet the setup-and-hold  
time with respect to the rising edge of DACCLK. When resetting  
the FIFO, the FRAME signal must be held high for at least three  
data periods (that is, 1.5 cycles of DCI). When these conditions  
are met, the outputs of the DACs are updated within tSKEW + tOUTDLY  
nanoseconds of each other. A timing diagram that illustrates the  
timing requirements of the input signals is shown in Figure 83.  
tSKEW  
DACCLKP(1)/  
DACCLKN(1)  
DACCLKP(2)/  
DACCLKN(2)  
tSU_SYNC tH_SYNC  
REFCLKP(2)/  
REFCLKN(2)  
tSU_DCI tH_DCI  
DCIP(2)/  
DCIN(2)  
FRAMEP(2)/  
FRAMEN(3)  
DACCLKP(1)/  
DACCLKN(1)  
Figure 82. Data Rate Synchronization Signal Timing Requirements,  
2x Interpolation  
DACCLKP(2)/  
DACCLKN(2)  
tSU_SYNC tH_SYNC  
Figure 82 shows the synchronization signal timing with 2×  
interpolation; therefore, fDCI = ½ × fCLK. The REFCLK input is  
shown to be equal to the data rate. The maximum frequency at  
which the device can be resynchronized in data rate mode can  
be expressed as  
REFCLKP(2)/  
REFCLKN(2)  
DCIP(2)/  
DCIN(2)  
FRAMEP(2)/  
FRAMEN(2)  
f
SYNC_I = fDATA/2N  
where N is any nonnegative integer.  
Figure 83. FIFO Rate Synchronization Signal Timing Requirements,  
2× Interpolation  
Generally, for values of N equal to or greater than 3, select the  
FIFO rate synchronization mode.  
Figure 83 shows the synchronization signal timing with 2×  
interpolation; therefore, fDCI = ½ × fCLK. The REFCLK input is  
shown to be equal to the FIFO rate. More generally, the maximum  
frequency at which the device can be resynchronized in FIFO  
rate mode can be expressed as  
FIFO RATE MODE SYNCHRONIZATION  
The Procedure for FIFO Rate Synchronization when Directly  
Sourcing the DAC Sampling Clock section outlines the steps  
required to synchronize multiple devices in FIFO rate mode.  
The procedure assumes that the REFCLK and DACCLK signals  
are applied to all of the devices. The procedure must be carried  
out on each individual device.  
f
SYNC_I = (fDATA/8 × 2N)  
where N is any nonnegative integer.  
ADDITIONAL SYNCHRONIZATION FEATURES  
Procedure for FIFO Rate Synchronization when Directly  
Sourcing the DAC Sampling Clock  
The synchronization logic incorporates additional features that  
provide means for querying the status of the synchronization,  
improving the robustness of the synchronization, and a one shot  
synchronization mode. These features are detailed in the Sync  
Status Bits and Timing Optimization sections that follow.  
Configure for FIFO rate, periodic synchronization by writing  
0x80 to the sync control register (Register 0x10). Additional  
synchronization options are available and are described in the  
Additional Synchronization Features section.  
Rev. 0 | Page 52 of 56  
 
 
 
 
 
AD9122  
Sync Status Bits  
The synchronization logic resynchronizes when a phase change  
between the REFCLK signal and the state of the clock generation  
state machine exceeds a threshold. To mitigate the effects of  
jitter and prevent erroneous resynchronizations, the relative  
phase can be averaged. The amount of averaging is set by the  
sync averaging bits (Register 0x10, Bits[2:0]) and can be set  
from 1 to 128. The higher the number of averages, the more  
slowly the device recognizes and resynchronizes to a legitimate  
phase correction. Generally, the averaging should be made as large  
as possible while still meeting the allotted resynchronization  
time interval.  
When the sync locked bit (Register 0x12, Bit 6) is set, it indicates  
that the synchronization logic has reached alignment. This  
alignment is determined when the clock generation state machine  
phase is constant. It takes between (11 + averaging) × 64 and  
(11 + averaging) × 128 DACCLK cycles. This bit may optionally  
IRQ  
trigger an  
section.  
as described in the Interrupt Request Operation  
When the sync lost bit (Register 0x12, Bit 7) is set, it indicates  
a previously synchronized device has lost alignment. This bit is  
latched and remains set until cleared by overwriting the register.  
The sync phase request bits value (Register 0x11, Bits[5:0]) is  
the state to which the clock generation state machine resets upon  
initialization. By varying this value, the timing of the internal  
clocks, with respect to the REFCLK signal, can be adjusted.  
Every increment of the Sync Phase Request[5:0] (Register 0x11,  
Bits[5:0]) value advances the internal clocks by one DACCLK  
period. This offset can be used for two purposes: to skew the  
outputs of two synchronized DAC outputs in increments of the  
DACCLK period and to change the relative timing between the  
DCI input and REFCLK. This may allow for a more optimal place-  
ment of the DCI sampling point in data rate synchronization mode.  
IRQ  
This bit may optionally trigger an  
Interrupt Request Operation section.  
as described in the  
The sync phase readback bits (Register 0x13, Bits[7:0]) report  
the current clock phase in a 6.2 format. Bits[7:2] report which  
of the 64 states (0 to 63) the clock is currently in. When averaging  
is enabled, Bits[1:0] provide ¼ state accuracy (for 0, ¼, ½, ¾).  
The lower two bits give an indication of the timing margin issues  
that may exist. If the sync sampling is error free, the fractional  
clock state should be 00.  
Timing Optimization  
The REFCLK signal is sampled by a version of the DACCLK. If  
sampling errors are being detected, the opposite sampling edge  
can be selected to improve the sampling point. The sampling  
edge can be selected by setting Register 0x10, Bit 3 (1 = rising  
and 0 = falling).  
Table 25. Synchronization Setup and Hold Times  
Parameter  
Min  
Max  
Unit  
ps  
ps  
tSKEW  
tSV_SYNC  
TH_SYNC  
−tDACCLK/2  
100  
330  
+tDACCLK/2  
ps  
Rev. 0 | Page 53 of 56  
 
 
AD9122  
INTERRUPT REQUEST OPERATION  
The AD9122 provides an interrupt request output signal (on  
The latched version of an event flag (the interupt_source signal)  
can be cleared in two ways. The recommended way is by writing  
1 to the corresponding event flag bit. A hardware or software  
reset also clears the interupt_source.  
IRQ  
Pin 7,  
) that can be used to notify an external host processor  
of significant device events. Upon assertion of the interrupt,  
the device should be queried to determine the precise event that  
IRQ  
occurred. The  
pin is an open-drain, active low output. Pull  
INTERRUPT SERVICE ROUTINE  
IRQ  
the  
pin high external to the device. This pin can be tied to  
the interrupt pins of other devices with open-drain outputs to  
wired-OR these pins together.  
Interrupt request management starts by selecting the set of event  
flags that require host intervention or monitoring. Those events  
that require host action should be enabled so that the host is  
notified when they occur. For events requiring host intervention,  
Sixteen different event flags provide visibility into the device.  
These 16 flags are located in the two event flag registers  
(Register 0x06 and Register 0x07). The behavior of each of the  
event flags is independently selected in the interrupt enable  
registers (Register 0x04 and Register 0x05). When the flag  
interrupt enable is active, the event flag latches and triggers an  
external interrupt. When the flag interrupt is disabled, the event  
IRQ  
upon  
activation, run the following routine to clear an  
interrupt request:  
1. Read the status of the event flag bits that are being  
monitored.  
2. Set the interupt enable bit low so that the unlatched  
event_flag_source can be monitored directly.  
3. Perform any actions that may be required to clear the  
event_source_flag. In many cases, no specific actions may  
be required.  
IRQ  
flag simply monitors the source signal and the external  
remains inactive.  
IRQ  
Figure 84 shows the  
-related circuitry. This diagram shows  
IRQ  
how the event flag signals propagate to the  
output. The  
4. Read the event flag to verify the actions taken have cleared  
the event_flag_source.  
5. Clear the interrupt by writing 1 to the event flag bit.  
6. Set the interupt enable bits of the events to be monitored.  
interupt_enable signal represents one bit from the interrupt  
enable register. The event_flag_source signal represents one bit  
from the event flag register. The event_flag_source signal  
represents one of the device signals that can be monitored such  
as the PLL_locked signal from the PLL phase detector or the  
FIFO Warning 1 signal from the FIFO controller.  
Note that some of the event_flag_source signals are latched signals.  
These are cleared by writing to the corresponding event flag bit.  
Details of each of the event flags can be found in Table 11.  
When an interrupt enable bit is set high, the corresponding event  
flag bit reflects a positively tripped (that is, latched on the rising  
edge of the event_flag_source version of the event_flag_source  
IRQ  
signal. This signal also asserts the external  
. When an  
interrupt enable bit is set low, the event flag bit reflects the  
current status of the event_flag_source signal, and the event flag  
IRQ  
has no effect on the external  
.
0
1
EVENT_FLAG  
IRQ  
INTERRUPT  
SOURCE  
INTERRUPT_ENABLE  
OTHER  
INTERRUPT  
SOURCES  
EVENT_FLAG_SOURCE  
WRITE_1_TO_EVENT_FLAG  
DEVICE_RESET  
IRQ  
Figure 84. Simplified Schematic of  
Circuitry  
Rev. 0 | Page 54 of 56  
 
 
 
AD9122  
INTERFACE TIMING VALIDATION  
The AD9122 provides on-chip sample error detection (SED)  
circuitry that simplifies verification of the input data interface.  
The SED compares the input data samples captured at the digital  
input pins with a set of comparison values. The comparison values  
are loaded into registers through the SPI port. Differences between  
the captured values and the comparison values are detected and  
stored. Options are available for customizing SED test sequencing  
and error handling.  
The sample error, compare pass, and compare fail flags can be  
IRQ  
configured to trigger an  
when active, if desired. This is  
done by enabling the appropriate bits in the event flag register  
(Register 0x07).  
Table 26 shows a progression of the input sample comparison  
results and the corresponding states of the error flags.  
SED EXAMPLE  
Normal Operation  
SED OPERATION  
The following example illustrates the SED configuration for  
continuously monitoring the input data and assertion of an  
when a single error is detected.  
The SED circuitry operates on a data set made up of four 16-bit  
input words, denoted as I0, Q0, I1, and Q1. To properly align  
the input samples, the first I and Q data-words (that is, I0 and  
Q0) are indicated by asserting the FRAME signal for a  
minimum of two complete input samples.  
IRQ  
1. Write to the following registers to enable the SED and load  
the comparison values.  
Register 0x67 → 0x80  
Register 0x68 → I0[7:0]  
Register 0x69 → I0[15:8]  
Register 0x6A → Q0[7:0]  
Register 0x6B → Q0[15:8]  
Register 0x6C → I1[7:0]  
Figure 85 shows the input timing of the interface in word mode.  
The FRAME signal can be issued once at the start of the data  
transmission, or it can be asserted repeatedly at intervals coinciding  
with the I0 and Q0 data-words.  
FRAME  
Register 0x6D → I1[15:8]  
Register 0x6E → Q1[7:0]  
DATA[15:0]  
I0  
Q0  
I1  
Q1  
I0  
Q0  
Register 0x6F → Q1[15:8]  
Figure 85. Timing Diagram of Extended FRAME Signal Required to Align  
Input Data for SED  
Comparison values can be chosen arbitrarily; however,  
choosing values that require frequent bit toggling provides  
the most robust test.  
The SED has three flag bits (Register 0x67, Bit 0, Bit 1, and  
Bit 5) that indicate the results of the input sample comparisons.  
The sample error detected bit (Register 0x67, Bit 5) is set when  
an error is detected and remains set until cleared. The SED also  
provides registers that indicate which input data bits experienced  
errors (Register 0x70 through Register 0x73). These bits are  
latched and indicate the accumulated errors detected until cleared.  
IRQ  
2. Enable the SED error detect flag to assert the  
Register 0x05 → 0x04  
3. Begin transmitting the input data pattern.  
pin.  
IRQ  
If  
is asserted, read Register 0x67 and Register 0x70 through  
Register 0x73 to verify that a SED error was detected and determine  
which input bits were in error. The bits in Register 0x70 through  
Register 0x73 are latched; therefore, the bits indicate any errors  
that occurred on those bits throughout the test and not just the  
errors that caused the error detected flag to be set.  
The autoclear mode has two effects: it activates the compare fail  
bit and the compare pass bit (Register 0x67, Bit 1 and Bit 0) and  
changes the behavior of Register 0x70 through Register 0x73. The  
compare pass bit sets if the last comparison indicated the  
sample was error free. The compare fail bit sets if an error is  
detected. The compare fail bit is automatically cleared by the  
reception of eight consecutive error-free comparisons. When  
autoclear mode is enabled, Register 0x70 through Register 0x73  
accumulate errors as previously described but reset to all 0s after  
eight consecutive error-free sample comparisons are made.  
Table 26. Progression of Comparison Outcomes and the Resulting SED Register Values  
Compare Results (Pass/Fail)  
P
0
0
1
F
1
1
0
F
1
1
0
F
1
1
0
P
1
1
1
P
1
1
1
P
1
1
1
P
1
1
1
P
1
1
1
P
1
1
1
P
1
1
1
P
1
1
1
P
1
0
1
F
1
1
0
P
1
1
1
F
1
1
0
Register 0x6ꢀ, Bit 5 (Sample Error Detected)  
Register 0x6ꢀ, Bit 1 (Compare Fail)  
Register 0x6ꢀ, Bit 0 (Compare Pass)  
Register 0xꢀ0 to Register 0xꢀ3  
(Errors Detected x_BITS[15:0])  
Z1 N2 N2 N2 N2 N2 N2 N2 N2 N2 N2 N2 Z1 N2 N2 N2  
1 Z = all 0s.  
2 N = nonzero.  
Rev. 0 | Page 55 of 56  
 
 
 
 
 
AD9122  
OUTLINE DIMENSIONS  
0.60  
0.42  
0.24  
10.00  
BSC SQ  
0.60  
0.42  
0.24  
PIN 1  
INDICATOR  
55  
54  
72  
1
PIN 1  
INDICATOR  
0.50  
BSC  
9.75  
BSC SQ  
6.15  
6.00 SQ  
5.85  
TOP VIEW  
EXPOSED PAD  
(BOTTOM VIEW)  
0.50  
0.40  
0.30  
18  
37  
36  
19  
0.80 MAX  
0.65 TYP  
12° MAX  
1.00  
0.85  
0.80  
8.50 REF  
0.05 MAX  
0.02 NOM  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
COPLANARITY  
0.08  
0.30  
0.23  
0.18  
SEATING  
PLANE  
0.20 REF  
SECTION OF THIS DATA SHEET.  
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4  
Figure 86. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
10 mm × 10 mm Body, Very Thin Quad  
(CP-72-7)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model  
AD9122BCPZ1  
AD9122BCPZRL1  
AD9122-M53ꢀ2-EBZ1  
AD9122-M53ꢀ5-EBZ1  
Temperature Range  
Package Description  
Package Option  
CP-ꢀ2-ꢀ  
CP-ꢀ2-ꢀ  
−40°C to +85°C  
−40°C to +85°C  
ꢀ2-lead LFCSP_VQ  
ꢀ2-lead LFCSP_VQ  
Evaluation Board Connected to ADL53ꢀ2 Modulator  
Evaluation Board Connected to ADL53ꢀ5 Modulator  
1Z = RoHS Compliant Part.  
©2009 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D08281-0-9/09(0)  
Rev. 0 | Page 56 of 56  
 

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Dual, 16-Bit, 1200 MSPS, TxDAC+® Digital-to-Analog Converter
ADI

AD9122SCPZ-EP

TxDAC Digital-to-Analog Converter
ADI

AD9122SCPZ-EP-RL

TxDAC Digital-to-Analog Converter
ADI

AD9125

Dual, 16-Bit, 1000 MSPS, TxDAC+ Digital-to-Analog Converter
ADI

AD9125-M5372-EBZ

Dual, 16-Bit, 1000 MSPS, TxDAC+ Digital-to-Analog Converter
ADI

AD9125-M5375-EBZ

Dual, 16-Bit, 1000 MSPS, TxDAC+ Digital-to-Analog Converter
ADI

AD9125BCPZ

Dual, 16-Bit, 1000 MSPS, TxDAC Digital-to-Analog Converter
ADI

AD9125BCPZRL

Dual, 16-Bit, 1000 MSPS, TxDAC+ Digital-to-Analog Converter
ADI