AD9122 [ADI]
Dual, 16-Bit, 1200 MSPS, TxDAC+® Digital-to-Analog Converter; 双通道, 16位, 1200 MSPS ,通道TxDAC + ®数字 - 模拟转换器型号: | AD9122 |
厂家: | ADI |
描述: | Dual, 16-Bit, 1200 MSPS, TxDAC+® Digital-to-Analog Converter |
文件: | 总56页 (文件大小:910K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Dual, 16-Bit, 1200 MSPS,
TxDAC+® Digital-to-Analog Converter
AD9122
FEATURES
GENERAL DESCRIPTION
Flexible LVDS interface allows word, byte, or nibble load
Single-carrier W-CDMA ACLR = 82 dBc @ 122.88 MHz IF
The AD9122 is a dual 16-bit, high dynamic range, digital-to-
analog converter (DAC) that provides a sample rate of 1200 MSPS,
Analog output: adjustable 8.7 mA to 31.7 mA, RL = 25 Ω to 50 Ω
Novel 2×/4×/8× interpolator/complex modulator allows
carrier placement anywhere in the DAC bandwidth
Digital gain and phase adjustment for sideband suppression
Multiple chip synchronization interfaces
High performance, low noise PLL clock multiplier
Digital inverse sinc filter
Flexible LVDS interface allows word, byte, or nibble load
Low power: 1.5 W @ 1.2 GSPS, 800 mW @ 500 MSPS, full
operating conditions
permitting a multicarrier generation up to the Nyquist frequency.
It includes features optimized for direct conversion transmit
applications, including complex digital modulation, and gain and
offset compensation. The DAC outputs are optimized to interface
seamlessly with analog quadrature modulators, such as the
ADL537x F-MOD series from Analog Devices, Inc. A 4-wire
serial port interface provides for programming/readback of many
internal parameters. Full-scale output current can be programmed
over a range of 8.7 mA to 31.7 mA. The AD9122 comes in a
72-lead LFCSP.
72-lead, exposed paddle LFCSP
PRODUCT HIGHLIGHTS
1. Ultralow noise and intermodulation distortion (IMD)
enable high quality synthesis of wideband signals from
baseband to high intermediate frequencies.
2. A proprietary DAC output switching technique enhances
dynamic performance.
APPLICATIONS
Wireless infrastructure
W-CDMA, CDMA2000, TD-SCDMA, WiMAX, GSM, LTE
Digital high or low IF synthesis
Transmit diversity
Wideband communications: LMDS/MMDS, point-to-point
3. The current outputs are easily configured for various
single-ended or differential circuit topologies.
4. Flexible LVDS digital interface allows the standard 32-wire
bus to be reduced to ½ or ¼ of the width.
TYPICAL SIGNAL CHAIN
COMPLEX BASEBAND
DC
COMPLEX IF
RF
f
LO – f
IF
IF
I DAC
2
2
2/4
2/4
SIN
DIGITAL
ANTIALIASING
FILTER
PA
BASEBAND
AQM
LO
PROCESSOR
COS
Q DAC
NOTES
1. AQM = ANALOG QUADRATURE MODULATOR.
Figure 1.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2009 Analog Devices, Inc. All rights reserved.
AD9122
TABLE OF CONTENTS
Features .............................................................................................. 1
NCO Modulation ....................................................................... 37
Datapath Configuration ............................................................ 37
Determining Interpolation Filter Modes ................................ 38
Datapath Configuration Example............................................ 39
Data Rates vs. Interpolation Modes......................................... 40
Coarse Modulation Mixing Sequences.................................... 40
Quadrature Phase Correction................................................... 41
DC Offset Correction ................................................................ 41
Inverse Sinc Filter....................................................................... 41
DAC Input Clock Configurations................................................ 42
DAC Input Clock Configurations............................................ 42
Analog Outputs............................................................................... 44
Transmit DAC Operation.......................................................... 44
Auxiliary DAC Operation......................................................... 45
Baseband Filter Implementation.............................................. 46
Driving the ADL5375-15 .......................................................... 46
Reducing LO Leakage and Unwanted Sidebands .................. 47
Device Power Dissipation.............................................................. 48
Temperature Sensor ................................................................... 49
Multichip Synchronization............................................................ 50
Synchronization with Clock Multiplication............................... 50
Synchronization with Direct Clocking.................................... 51
Data Rate Mode Synchronization ............................................ 51
FIFO Rate Mode Synchronization ........................................... 52
Additional Synchronization Features ...................................... 52
Interrupt Request Operation ........................................................ 54
Interrupt Service Routine.......................................................... 54
Interface Timing Validation.......................................................... 55
SED Operation............................................................................ 55
SED Example .............................................................................. 55
Outline Dimensions....................................................................... 56
Ordering Guide .......................................................................... 56
Applications....................................................................................... 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Typical Signal Chain......................................................................... 1
Revision History ............................................................................... 2
Functional Block Diagram .............................................................. 3
Specifications..................................................................................... 4
DC Specifications ......................................................................... 4
Digital Specifications ................................................................... 5
Digital Input Data Timing Specifications ................................. 5
AC Specifications.......................................................................... 6
Absolute Maximum Ratings............................................................ 7
Thermal Resistance ...................................................................... 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Typical Performance Characteristics ........................................... 10
Terminology .................................................................................... 16
Theory of Operation ...................................................................... 17
Serial Port Operation................................................................. 17
Data Format ................................................................................ 17
Serial Port Pin Descriptions...................................................... 17
Serial Port Options..................................................................... 18
Device Configuration Register Map and Descriptions ......... 19
LVDS Input Data Ports .................................................................. 31
Word Interface Mode................................................................. 31
Byte Interface Mode ................................................................... 31
Nibble Interface Mode ............................................................... 31
FIFO Operation.......................................................................... 31
Interface Timing......................................................................... 33
Digital Datapath.............................................................................. 34
Premodulation ............................................................................ 34
Interpolation Filters ................................................................... 34
REVISION HISTORY
9/09—Revision 0: Initial Version
Rev. 0 | Page 2 of 56
AD9122
FUNCTIONAL BLOCK DIAGRAM
IOUT1P
IOUT1N
16
1.2G
AUX
DAC 1
16-BIT
16
D15P—D15N
I OFFSET
f
/2
PRE
MOD
NCO
AND
MOD
DATA
10
INV
SINC
DAC CLK
FIFO
HB1
HB2
HB3
Q OFFSET
16
D0P—D0N
DCI
IOUT2P
IOUT2N
16
1.2G
FRAME
AUX
DAC 1
16-BIT
REF
REFIO
FSADJ
10
10
AND
BIAS
INTERNAL CLOCK TIMING AND CONTROL LOGIC
DAC CLK_SEL
PLL CONTROL
DAC_CLK
DACCLKP
DACCLKN
CLK
0
RCVR
SERIAL
INPUT/OUTPUT
PORT
SYNC
PROGRAMMING
REGISTERS
POWER-ON
RESET
MULTICHIP
SYNCHRONIZATION
CLOCK
MULTIPLIER
(2× TO 16×)
REFCLKP
REFCLKN
CLK
RCVR
1
PLL_LOCK
Figure 2. AD9122 Functional Block Diagram
Rev. 0 | Page 3 of 56
AD9122
SPECIFICATIONS
DC SPECIFICATIONS
TMIN to TMAX, AVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 =1.8 V, IOUTFS = 20 mA, maximum sample rate, unless otherwise noted.
Table 1.
Parameter
Min
Typ
Max
Unit
RESOLUTION
16
Bits
ACCURACY
Differential Nonlinearity (DNL)
Integral Nonlinearity (INL)
MAIN DAC OUTPUTS
Offset Error
Gain Error (with Internal Reference)
Full-Scale Output Current1
Output Compliance Range
Output Resistance
2.1
3.ꢀ
LSB
LSB
−0.001
−3.6
8.66
0
+0.001
+3.6
31.66
+1.0
% FSR
% FSR
mA
V
MΩ
2
19.6
−1.0
10
Gain DAC Monotonicity
Settling Time to Within 0.5 LSB
MAIN DAC TEMPERATURE DRIFT
Offset
Gain
Reference Voltage
Guaranteed
20
ns
0.04
100
30
ppm/°C
ppm/°C
ppm/°C
REFERENCE
Internal Reference Voltage
Output Resistance
1.2
5
V
kΩ
ANALOG SUPPLY VOLTAGES
AVDD33
CVDD18
3.13
1.ꢀ1
3.3
1.8
3.4ꢀ
1.89
V
V
DIGITAL SUPPLY VOLTAGES
DVDD18
IOVDD
1.ꢀ1
1.ꢀ1
1.8
1.8/2.5
1.89
2.94
V
V
POWER CONSUMPTION
2× Mode, fDAC = 491.22 MSPS, IF = 10 MHz, PLL Off
2× Mode, fDAC = 491.22 MSPS, IF = 10 MHz, PLL On
8× Mode, fDAC = 800 MSPS, IF = 10 MHz, PLL Off
AVDD33
834
913
1135
55
mW
mW
mW
mA
1241
5ꢀ
CVDD18
85
90
mA
DVDD18
444
2.5
495
9.8
+0.3
+85
mA
Power-Down Mode
Power Supply Rejection Ratio, AVDD33
OPERATING RANGE
mW
% FSR/V
°C
−0.3
−40
+25
1 Based on a 10 kΩ external resistor.
Rev. 0 | Page 4 of 56
AD9122
DIGITAL SPECIFICATIONS
TMIN to TMAX, AVDD33 = 1.8 V, IOVDD = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFS = 20 mA, maximum sample rate, unless
otherwise noted.
Table 2.
Parameter
Conditions
Min
Typ Max
Unit
CMOS INPUT LOGIC LEVEL
Input VIN Logic High (IOVDD = 1.8 V)
Input VIN Logic High (IOVDD = 2.5 V)
Input VIN Logic Low (IOVDD = 1.8 V)
Input VIN Logic Low (IOVDD = 2.5 V)
CMOS OUTPUT LOGIC LEVEL
Output VOUT Logic High
Output VOUT Logic High
Output VOUT Logic Low
Output VOUT Logic Low
1.2
1.6
V
V
V
V
0.6
0.8
IOVDD = 1.8 V
IOVDD = 2.5 V
IOVDD = 1.8 V
IOVDD = 2.5 V
1.4
1.8
V
V
V
V
0.4
0.4
LVDS RECEIVER INPUTS1
Input Voltage Range, VIA or VIB
Input Differential Threshold, VIDTH
Input Differential Hysteresis, VIDTHH to VIDTHL
Receiver Differential Input Impedance, RIN
LVDS Input Rate
825
−100
15ꢀ5 mV
+100 mV
mV
20
80
120
Ω
See Table 5
DAC CLOCK INPUT (DACCLKP, DACCLKN)
Differential Peak-to-Peak Voltage
Common-Mode Voltage
100
500
1.25
2000 mV
V
Self biased input, ac couple
Maximum Clock Rate
1200
100
MSPS
REFCLK INPUT (REFCLKP, REFCLKN)
Differential Peak-to-Peak Voltage
Common-Mode Voltage
500
1.25
2000 mV
V
REFCLK Frequency (PLL Mode)
REFCLK Frequency (SYNC Mode)
SERIAL PERIPHERAL INTERFACE
Maximum Clock Rate (SCLK)
1 GHz ≤ fVCO ≤ 26 Hz
See Multichip Synchronization section for conditions
15.625
0
600
600
MHz
MHz
40
MHz
ns
ns
ns
ns
Minimum Pulse Width High (tPWH
)
)
12.5
12.5
Minimum Pulse Width Low (tPWOL
Setup Time, SDI to SCLK (tDS)
Hold Time, SDI to SCLK (tDH)
Data Valid, SDO to SCLK (tDV)
1.9
0.2
23
ns
Setup Time, CS to SCLK (tDCSB
)
1.4
ns
1 LVDS receiver is compliant to the IEEE 1596 reduced range link, unless otherwise noted.
DIGITAL INPUT DATA TIMING SPECIFICATIONS
Table 3.
Parameter
Min
Typ
Max
Unit
LATENCY (DACCLK Cycles)
1× Interpolation (With or Without Modulation)
2× Interpolation (With or Without Modulation)
4× Interpolation (With or Without Modulation)
8× Interpolation (With or Without Modulation)
Inverse Sinc
64
Cycles
Cycles
Cycles
Cycles
Cycles
Cycles
ms
135
292
608
20
8
260
Fine Modulation
Power-Up Time
Rev. 0 | Page 5 of 56
AD9122
AC SPECIFICATIONS
TMIN to TMAX, AVDD33 = 3.3 V, DVDD18 = 1.8 V, CVDD18 = 1.8 V, IOUTFS = 20 mA, maximum sample rate, unless otherwise noted.
Table 4.
Parameter
Min
Typ
Max
Unit
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fDAC = 100 MSPS, fOUT = 20 MHz
fDAC = 200 MSPS, fOUT = 50 MHz
fDAC = 400 MSPS, fOUT = ꢀ0 MHz
fDAC = 800 MSPS, fOUT = ꢀ0 MHz
ꢀ8
80
69
ꢀ2
dBc
dBc
dBc
dBc
TWO-TONE INTERMODULATION DISTORTION (IMD)
fDAC = 200 MSPS, fOUT = 50 MHz
fDAC = 400 MSPS, fOUT = 60 MHz
fDAC = 400 MSPS, fOUT = 80 MHz
fDAC = 800 MSPS, fOUT = 100 MHz
84
86
84
81
dBc
dBc
dBc
dBc
NOISE SPECTRAL DENSITY (NSD) EIGHT-TONE, 500 kHz TONE SPACING
fDAC = 200 MSPS, fOUT = 80 MHz
fDAC = 400 MSPS, fOUT = 80 MHz
−162
−163
−164
dBm/Hz
dBm/Hz
dBm/Hz
fDAC = 800 MSPS, fOUT = 80 MHz
W-CDMA ADJACENT CHANNEL LEAKAGE RATIO (ACLR), SINGLE CARRIER
fDAC = 491.52 MSPS, fOUT = 10 MHz
fDAC = 491.52 MSPS, fOUT = 122.88 MHz
fDAC = 983.04 MSPS, fOUT = 122.88 MHz
W-CDMA SECOND ACLR, SINGLE CARRIER
fDAC = 491.52 MSPS, fOUT = 10 MHz
fDAC = 491.52 MSPS, fOUT = 122.88 MHz
fDAC = 983.04 MSPS, fOUT = 122.88 MHz
84
82
83
dBc
dBc
dBc
88
86
88
dBc
dBc
dBc
Table 5. Interface Speeds
fBUS (Mbps)
1.8 V 2%
Bus Width
Interpolation Factor
1.8 V 5%
1100
1100
1100
1100
1100
1100
1100
1100
1100
550
1.9 V 5%
1200
1200
1200
1200
1200
1200
1200
1200
1200
600
Nibble (4 Bits)
1×
1200
1200
1200
1200
1200
1200
1200
1200
1200
600
2× (HB1)
2× (HB2)
4×
8×
Byte (8 Bits)
1×
2× (HB1)
2× (HB2)
4×
8×
Word (16 Bits)
1×
1100
900
1100
550
1200
1000
1200
600
1200
1000
1200
600
2× (HB1)
2× (HB2)
4×
8×
2ꢀ5
300
300
Rev. 0 | Page 6 of 56
AD9122
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 6.
The exposed paddle (EPAD) must be soldered to the ground
plane for the 72-lead, LFCSP. The EPAD performs as an
electrical and thermal connection to the board.
With
Parameter
Respect To Rating
AVDD33
AVSS, EPAD, −0.3 V to +3.6 V
CVSS, DVSS
AVSS, EPAD, −0.3 V to +3.3 V
CVSS, DVSS
Typical θJA, θJB, and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation effectively reducing θJA and θJB.
IOVDD
DVDD18, CVDD18
AVSS
AVSS, EPAD, −0.3 V to +2.1 V
CVSS, DVSS
EPAD, CVSS, −0.3 V to +0.3 V
DVSS
Table 7. Thermal Resistance
Package
θJA
θJB
θJC Unit Conditions
ꢀ2-Lead LFCSP_VQ 20.ꢀ 10.9 1.1 °C/W EPAD soldered
EPAD
AVSS, CVSS, −0.3 V to +0.3 V
DVSS
ESD CAUTION
CVSS
AVSS, EPAD, −0.3 V to +0.3 V
DVSS
DVSS
AVSS, EPAD, −0.3 V to +0.3 V
CVSS
FSADJ, REFIO,
AVSS
−0.3 V to AVDD33 + 0.3 V
IOUT1P/IOUT1N,
IOUT2P/IOUT2N
D[15:0]P/D[15:0]N,
FRAMEP/FRAMEN,
DCIP/DCIN
EPAD, DVSS −0.3 V to DVDD18 + 0.3 V
DACCLKP/DACCLKN,
REFCLKP/REFCLKN
DVSS
−0.3 V to CVDD18 + 0.3 V
RESET, IRQ, CS, SCLK,
SDIO, SDO
EPAD, DVSS −0.3 V to IOVDD + 0.3 V
Junction Temperature
125°C
Storage Temperature
Range
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. 0 | Page ꢀ of 56
AD9122
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
CVDD18
DACCLKP
DACCLKN
CVSS
FRAMEP
FRAMEN
IRQ
1
2
3
4
5
6
7
8
9
54 RESET
53 CS
PIN 1
INDICATOR
52 SCLK
51 SDIO
50 SDO
49 DVDD18
48 D0N
47 D0P
46 D1N
45 D1P
44 DVSS
43 DVDD18
42 D2N
41 D2P
AD9122
D15P
D15N
TOP VIEW
(Not to Scale)
NC 10
IOVDD 11
DVDD18 12
D14P 13
D14N 14
D13P 15
D13N 16
D12P 17
D12N 18
40 D3N
39 D3P
38 D4N
37 D4P
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD MUST BE CONNECTED TO AVSS.
Figure 3. Pin Configuration
Table 8. Pin Function Descriptions
Pin No.
Mnemonic
CVDD18
DACCLKP
DACCLKN
CVSS
Description
1
2
3
4
1.8 V Clock Supply. Supplies clock receivers, clock distribution, and PLL circuitry.
DAC Clock Input, Positive.
DAC Clock Input, Negative.
Clock Supply Common.
5
6
ꢀ
FRAMEP
FRAMEN
IRQ
Frame Input, Positive.
Frame Input, Negative.
Interrupt Request. Open-drain, active low output.
Data Bit 15 (MSB), Positive.
8
D15P
9
D15N
NC
Data Bit 15 (MSB), Negative.
No connection to device.
10
11
12
13
14
15
16
1ꢀ
18
19
20
21
22
23
24
25
26
IOVDD
DVDD18
D14P
D14N
D13P
D13N
D12P
D12N
D11P
D11N
D10P
D10N
D9P
D9N
D8P
Supply Pin for Serial Ports, RESET and IRQ. 1.8 V to 2.8 V can be supplied to this pin.
1.8 V Digital Supply. Supplies power to digital core and digital data ports.
Data Bit 14, Positive.
Data Bit 14, Negative.
Data Bit 13, Positive.
Data Bit 13, Negative.
Data Bit 12, Positive.
Data Bit 12, Negative.
Data Bit 11, Positive.
Data Bit 11, Negative.
Data Bit 10, Positive.
Data Bit 10, Negative.
Data Bit 9, Positive.
Data Bit 9, Negative.
Data Bit 8, Positive.
Data Bit 8, Negative.
D8N
Rev. 0 | Page 8 of 56
AD9122
Pin No.
2ꢀ
28
29
30
31
32
33
34
35
36
3ꢀ
38
39
40
41
42
43
44
45
46
4ꢀ
48
49
50
51
52
53
54
55
56
5ꢀ
58
59
60
61
62
63
64
65
66
6ꢀ
68
69
ꢀ0
ꢀ1
ꢀ2
Mnemonic
DCIP
DCIN
DVDD18
DVSS
DꢀP
DꢀN
D6P
D6N
D5P
D5N
D4P
D4N
D3P
D3N
D2P
D2N
DVDD18
DVSS
D1P
D1N
D0P
D0N
DVDD18
SDO
SDIO
SCLK
CS
Description
Data Clock Input, Positive.
Data Clock Input, Negative.
1.8 V Digital Supply.
Digital Common.
Data Bit ꢀ, Positive.
Data Bit ꢀ, Negative.
Data Bit 6, Positive.
Data Bit 6, Negative.
Data Bit 5, Positive.
Data Bit 5, Negative.
Data Bit 4, Positive.
Data Bit 4, Negative.
Data Bit 3, Positive.
Data Bit 3, Negative.
Data Bit 2, Positive.
Data Bit 2, Negative.
1.8 V Digital Supply.
Digital Common.
Data Bit 1, Positive.
Data Bit 1, Negative.
Data Bit 0, Positive.
Data Bit 0, Negative.
1.8 V Digital Supply.
Serial Port Data Output (CMOS Levels with Respect to IOVDD).
Serial Port Data Input/Output (CMOS Levels with Respect to IOVDD).
Serial Port Clock Input (CMOS Levels With Respect to IOVDD).
Serial Port Chip Select. Active Low (CMOS Levels With Respect to IOVDD).
Reset. Active Low (CMOS Levels With Respect to IOVDD).
No connection to device.
Analog Supply Common.
3.3 V Analog Supply.
Q DAC Positive Current Output.
Q DAC Negative Current Output.
3.3 V Analog Supply.
Analog Supply Common.
Voltage Reference. Nominally 1.2 V output. Should be decoupled to analog common.
Full-Scale Current Output Adjust. Place a 10 kΩ resistor on the analog common.
Analog Common.
3.3 V Analog Supply.
I DAC Positive Current Output.
I DAC Negative Current Output.
3.3 V Analog Supply.
PLL Reference Clock Input, Negative. This pin has secondary function as SYNC input.
PLL Reference Clock Input, Positive. This pin has secondary function as SYNC input.
1.8 V Clock Supply. Supplies clock receivers, clock distribution, and PLL circuitry.
1.8 V Clock Supply. Supplies clock receivers, clock distribution, and PLL circuitry.
Exposed pad must be connected to AVSS. This provides an electrical, thermal, and mechanical connection
to the PCB.
RESET
NC
AVSS
AVDD33
IOUT2P
IOUT2N
AVDD33
AVSS
REFIO
FSADJ
AVSS
AVDD33
IOUT1N
IOUT1P
AVDD33
REFCLKN
REFCLKP
CVDD18
CVDD18
EPAD
Rev. 0 | Page 9 of 56
AD9122
TYPICAL PERFORMANCE CHARACTERISTICS
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
fDATA = 250MSPS, SECOND HARMONIC
0dBFS
fDATA = 250MSPS, THIRD HARMONIC
fDATA = 400MSPS, SECOND HARMONIC
fDATA = 400MSPS, THIRD HARMONIC
–6dBFS
–12dBFS
–18dBFS
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
0
50
100
150
200
250
300
350
400
450
450
700
0
50
100
150
200
250
300
350
400
450
fOUT (MHz)
fOUT (MHz)
Figure 4. Harmonics vs. fOUT over fDATA, 2× Interpolation,
Digital Scale = 0 dBFS, fSC = 20 mA
Figure 7. Second Harmonic vs. fOUT over Digital Scale, 2× Interpolation,
fDATA = 400 MSPS, fSC = 20 mA
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
0
fDATA = 100MSPS, SECOND HARMONIC
fDATA = 100MSPS, THIRD HARMONIC
fDATA = 200MSPS, SECOND HARMONIC
fDATA = 200MSPS, THIRD HARMONIC
0dBFS
–6dBFS
–12dBFS
–18dBFS
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
0
50
100
150
200
250
300
350
400
0
50
100
150
200
250
300
350
400
450
fOUT (MHz)
fOUT (MHz)
Figure 5. Harmonics vs. fOUT over fDATA, 4× Interpolation,
Digital Scale = 0 dBFS, fSC = 20 mA
Figure 8. Third Harmonic vs. fOUT over Digital Scale, 2× Interpolation,
fDATA = 400 MSPS, fSC = 20 mA
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
0
10mA, SECOND HARMONIC
fDATA = 100MSPS, SECOND HARMONIC
fDATA = 100MSPS, THIRD HARMONIC
fDATA = 150MSPS, SECOND HARMONIC
fDATA = 150MSPS, THIRD HARMONIC
20mA, SECOND HARMONIC
–10
30mA, SECOND HARMONIC
–20
–30
–40
–50
–60
–70
–80
–90
–100
10mA, THIRD HARMONIC
20mA, THIRD HARMONIC
30mA, THIRD HARMONIC
0
100
200
300
400
500
600
0
50
100
150
200
250
300
350
400
450
fOUT (MHz)
fOUT (MHz)
Figure 6. Harmonics vs. fOUT over fDATA, 8× Interpolation,
Digital Scale = 0 dBFS, fSC = 20 mA
Figure 9. Second Harmonic vs. fOUT over fSC, 2× Interpolation,
DATA = 400 MSPS, Digital Scale = 0 dBFS
f
Rev. 0 | Page 10 of 56
AD9122
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
fDATA = 250MSPS
fDATA = 400MSPS
2× INTERPOLATION,
SINGLE-TONE SPECTRUM,
fDATA = 250MSPS,
fOUT = 101MHz
0
50
100
150
200
250
300
350
400
450
START 1.0MHz
#RES BW 10kHz
VBW 10kHz
STOP 500.0MHz
SWEEP 6.017s (601 PTS)
fOUT (MHz)
Figure 13. 2× Interpolation, Single-Tone Spectrum
Figure 10. Highest Digital Spur vs. fOUT over fDATA, 2× Interpolation,
Digital Scale = 0 dBFS, fSC = 20 mA
–64
fDATA = 100MSPS
fDATA = 200MSPS
–66
–68
–70
–72
–74
–76
–78
4× INTERPOLATION,
SINGLE-TONE SPECTRUM,
fDATA = 200MSPS,
fOUT = 151MHz
START 1.0MHz
#RES BW 10kHz
VBW 10kHz
STOP 800.0MHz
SWEEP 9.634s (601 PTS)
0
50
100
150
200
250
300
350
400
450
fOUT (MHz)
Figure 14. 4× Interpolation, Single-Tone Spectrum
Figure 11. Highest Digital Spur vs. fOUT over fDATA, 4× Interpolation,
Digital Scale = 0 dBFS, fSC = 20 mA
–64
fDATA = 100MSPS
fDATA = 150MSPS
–66
–68
–70
–72
–74
–76
8× INTERPOLATION,
SINGLE-TONE SPECTRUM,
fDATA = 100MSPS,
fOUT = 131MHz
START 1.0MHz
#RES BW 10kHz
VBW 10kHz
STOP 800.0MHz
SWEEP 9.634s (601 PTS)
0
100
200
300
400
500
600
700
fOUT (MHz)
Figure 15. 8× Interpolation, Single-Tone Spectrum
Figure 12. Highest Digital Spur vs. fOUT over fDATA, 8× Interpolation,
Digital Scale = 0 dBFS, fSC = 20 mA
Rev. 0 | Page 11 of 56
AD9122
0
–10
–20
–30
–40
–50
–60
–70
–80
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
fDATA = 250MSPS
fDATA = 400MSPS
0dBFS
–6dBFS
–12dBFS
–18dBFS
–90
0
50
100
150
200
250
300
350
400
450
450
450
0
50
100
150
200
250
300
350
400
450
fOUT (MHz)
fOUT (MHz)
Figure 16. IMD vs. fOUT over fDATA, 2× Interpolation,
Digital Scale = 0 dBFS, fSC = 20 mA
Figure 19. IMD vs. fOUT over Digital Scale, 2× Interpolation,
fDATA = 400 MSPS, fSC = 20 mA
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–50
–55
–60
–65
–70
–75
–80
–85
fDATA = 100MSPS
fDATA = 200MSPS
I
I
I
= 20mA
= 30mA
= 10mA
FS
FS
FS
0
50
100
150
200
250
300
350
400
0
50
100
150
200
250
300
350
400
450
fOUT (MHz)
fOUT (MHz)
Figure 17. IMD vs. fOUT over fDATA, 4× Interpolation,
Digital Scale = 0 dBFS, fSC = 20 mA
Figure 20. IMD vs. fOUT over fSC, 2× Interpolation, fDATA = 400 MSPS,
Digital Scale = 0 dBFS
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–40
–45
fDATA = 100MSPS
–50
PLL ON
–55
–60
–65
PLL OFF
–70
–75
–80
–85
–90
0
50
100
150
200
250
300
350
400
0
50
100
150
200
250
300
350
400
450
fOUT (MHz)
fOUT (MHz)
Figure 18. IMD vs. fOUT over fDATA, 8× Interpolation,
Digital Scale = 0 dBFS, fSC = 20 mA
Figure 21. IMD vs. fOUT, PLL On vs. PLL Off
Rev. 0 | Page 12 of 56
AD9122
–152
–154
–156
–158
–160
–162
–164
–166
–161.0
–161.5
–162.0
–162.5
–163.0
–163.5
–164.0
–164.5
–165.0
–165.5
1×, fDATA = 200MSPS
2×, fDATA = 200MSPS
4×, fDATA = 200MSPS
8×, fDATA = 100MSPS
1×, fDATA = 200MSPS
2×, fDATA = 200MSPS
4×, fDATA = 200MSPS
8×, fDATA = 100MSPS
0
50
100
150
200
250
300
350
400
450
0
50
100
150
200
250
300
350
400
450
fOUT (MHz)
fOUT (MHz)
Figure 22. 1-Tone NSD vs. fOUT over Interpolation Rate, Digital Scale = 0 dBFS,
fSC = 20 mA, PLL Off
Figure 25. 8-Tone NSD vs. fOUT over Interpolation Rate, Digital Scale = 0 dBFS,
fSC = 20 mA, PLL Off
–154
–161.0
0dBFS
0dBFS
–161.5
–162.0
–162.5
–163.0
–163.5
–164.0
–164.5
–165.0
–165.5
–166.0
–166.5
–6dBFS
–6dBFS
–12dBFS
–18dBFS
–156
–12dBFS
–18dBFS
–158
–160
–162
–164
–166
–168
0
50
100
150
200
250
300
350
400
450
0
50
100
150
200
250
300
350
400
450
fOUT (MHz)
fOUT (MHz)
Figure 23. 1-Tone NSD vs. fOUT over Digital Scale, fDATA = 200 MSPS,
4× Interpolation, fSC = 20 mA, PLL Off
Figure 26. 8-Tone NSD vs. fOUT over Digital Scale, fDATA = 200 MSPS,
4× Interpolation, fSC = 20 mA, PLL Off
–158
–160
2×, fDATA = 200MSPS
2×, fDATA = 200MSPS
4×, fDATA = 200MSPS
8×, fDATA = 100MSPS
4×, fDATA = 200MSPS
8×, fDATA = 100MSPS
–159
–161
–162
–163
–164
–165
–166
–160
–161
–162
–163
–164
–165
–166
0
50
100
150
200
250
300
350
400
450
0
50
100
150
200
250
300
350
400
450
fOUT (MHz)
fOUT (MHz)
Figure 24. 1-Tone NSD vs. fOUT over Interpolation Rate, Digital Scale = 0 dBFS,
SC = 20 mA, PLL On
Figure 27. 8-Tone NSD vs. fOUT over Interpolation Rate, Digital Scale = 0 dBFS,
SC = 20 mA, PLL On
f
f
Rev. 0 | Page 13 of 56
AD9122
–77
–78
–79
–80
–81
–82
–83
–50
–55
–60
–65
–70
–75
–80
–85
–90
0dBFS
INTERPOLATION FACTOR = 2×, PLL OFF
INTERPOLATION FACTOR = 4×, PLL OFF
INTERPOLATION FACTOR = 2×, PLL ON
INTERPOLATION FACTOR = 4×, PLL ON
–3dBFS
–6dBFS
–84
0
50
100
150
200
250
250
250
0
100
200
300
400
500
fOUT (MHz)
fOUT (MHz)
Figure 28. 1-Carrier W-CDMA ACLR vs. fOUT over fDAC
Adjacent Channel, PLL Off
,
,
,
Figure 31. 1-Carrier W-CDMA ACLR vs. fOUT, Adjacent Channel,
PLL On vs. PLL Off
–78
–80
–82
–84
–86
–88
–90
–70
0dBFS
INTERPOLATION FACTOR = 2×, PLL OFF
INTERPOLATION FACTOR = 4×, PLL OFF
INTERPOLATION FACTOR = 2×, PLL ON
INTERPOLATION FACTOR = 4×, PLL ON
–3dBFS
–6dBFS
–72
–74
–76
–78
–80
–82
–84
–86
–88
–90
0
50
100
150
200
0
100
200
300
400
500
fOUT (MHz)
fOUT (MHz)
Figure 29. 1-Carrier W-CDMA ACLR vs. fOUT over fDAC
Alternate Channel, PLL Off
Figure 32. 1-Carrier W-CDMA ACLR vs. fOUT, Alternate Channel,
PLL On vs. PLL Off
–70
–75
–80
–85
–90
–95
–70
0dBFS
INTERPOLATION FACTOR = 2×, PLL OFF
INTERPOLATION FACTOR = 4×, PLL OFF
INTERPOLATION FACTOR = 2×, PLL ON
–3dBFS
–6dBFS
INTERPOLATION FACTOR = 4×, PLL ON
–75
–80
–85
–90
–95
0
50
100
150
200
0
100
200
300
400
500
fOUT (MHz)
fOUT (MHz)
Figure 30. 1-Carrier W-CDMA ACLR vs. fOUT over fDAC
Second Alternate Channel, PLL Off
Figure 33. 1-Carrier W-CDMA ACLR vs. fOUT, Second Alternate Channel,
PLL On vs. PLL Off
Rev. 0 | Page 14 of 56
AD9122
START 133.06MHz
#RES BW 30kHz
VBW 30kHz
STOP 166.94MHz
START 125.88MHz
#RES BW 30kHz
VBW 30kHz
STOP 174.42MHz
SWEEP 143.6ms (601 PTS)
SWEEP 206.9ms (601 PTS)
RMS RESULTS
FREQ
OFFSET REF BW
LOWER
dBc dBm
UPPER
dBc dBm
TOTAL CARRIER POWER –11.19dBm/15.3600MHz
RRC FILTER: OFF FILTER ALPHA 0.22
CARRIER POWER 5.00MHz 3.840MHz –75.96 –85.96
–77.13 –87.13
–85.24 –95.25
–85.43 –95.43
REF CARRIER POWER –16.89dBm/3.84000MHz
–10.00dBm/
3.840MHz
10.00MHz 3.840MHz –85.33 –95.33
15.00MHz 2.888MHz –95.81 –95.81
LOWER
dBc dBm
UPPER
dBc dBm
OFFSET FREQ INTEG BW
1
2
3
4
–16.92dBm
–16.89dBm
–17.43dBm
–17.64dBm
5.000MHz
10.00MHz
15.00MHz
3.840MHz
3.840MHz
3.840MHz
–65.88 –82.76
–68.17 –85.05
–70.42 –87.31
–67.52 –84.40
–69.91 –86.79
–71.40 –88.28
Figure 35. 1-Carrier W-CDMA ACLR Performance, IF = ~150 MHz
Figure 34. 4-Carrier W-CDMA ACLR Performance, IF = ~150 MHz
Rev. 0 | Page 15 of 56
AD9122
TERMINOLOGY
Integral Nonlinearity (INL)
Settling Time
INL is defined as the maximum deviation of the actual analog
output from the ideal output, determined by a straight line drawn
from zero scale to full scale.
The time required for the output to reach and remain within a
specified error band around its final value, measured from
the start of the output transition.
Differential Nonlinearity (DNL)
DNL is the measure of the variation in analog value, normalized
to full scale, associated with a 1 LSB change in digital input code.
Spurious Free Dynamic Range (SFDR)
The difference, in decibels, between the peak amplitude of the
output signal and the peak spurious signal within the dc to the
Nyquist frequency of the DAC. Typically, energy in this band is
rejected by the interpolation filters. This specification, therefore,
defines how well the interpolation filters work and the effect of
other parasitic coupling paths to the DAC output.
Offset Error
The deviation of the output current from the ideal of zero is
called offset error. For IOUT1P, 0 mA output is expected when
the inputs are all 0s. For IOUT1N, 0 mA output is expected
when all inputs are set to 1.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the measured output signal
to the rms sum of all other spectral components below the Nyquist
frequency, excluding the first six harmonics and dc. The value
for SNR is expressed in decibels.
Gain Error
The difference between the actual and ideal output span. The
actual span is determined by the difference between the output
when all inputs are set to 1 and the output when all inputs are
set to 0.
Interpolation Filter
If the digital inputs to the DAC are sampled at a multiple rate of
Output Compliance Range
f
DATA (interpolation rate), a digital filter can be constructed that
The range of allowable voltage at the output of a current output
DAC. Operation beyond the maximum compliance limits can
cause either output stage saturation or breakdown, resulting in
nonlinear performance.
has a sharp transition band near fDATA/2. Images that typically
appear around fDAC (output data rate) can be greatly suppressed.
Adjacent Channel Leakage Ratio (ACLR)
The ratio in decibels relative to the carrier (dBc) between the
measured power within a channel relative to its adjacent channel.
Temperature Drift
Temperature drift is specified as the maximum change from
the ambient (25°C) value to the value at either TMIN or TMAX
.
Complex Image Rejection
For offset and gain drift, the drift is reported in ppm of full-
scale range (FSR) per degree Celsius. For reference drift, the
drift is reported in ppm per degree Celsius.
In a traditional two-part upconversion, two images are created
around the second IF frequency. These images have the effect
of wasting transmitter power and system bandwidth. By placing
the real part of a second complex modulator in series with the
first complex modulator, either the upper or lower frequency
image near the second IF can be rejected.
Power Supply Rejection (PSR)
The maximum change in the full-scale output as the supplies
are varied from minimum to maximum specified voltages.
Rev. 0 | Page 16 of 56
AD9122
THEORY OF OPERATION
The AD9122 combines many features that make it a very attractive
DAC for wired and wireless communications systems. The dual
digital signal path and dual DAC structure allow an easy interface
to common quadrature modulators when designing single
sideband transmitters. The speed and performance of the AD9122
allows wider bandwidths and more carriers to be synthesized than
in previously available DACs. In addition, these devices include an
innovative low power, 32-bit complex NCO that greatly increases
the ease of frequency placement.
The remaining SCLK edges are for Phase 2 of the communication
cycle. Phase 2 is the actual data transfer between the device and
the system controller. Phase 2 of the communication cycle is a
transfer of one or more data bytes. Registers change immediately
upon writing to the last bit of each transfer byte, except for the
frequency tuning word and NCO phase offsets that only change
when the frequency update bit (Register 0x36, Bit 0) is set.
DATA FORMAT
The instruction byte contains the information shown in Table 9.
The AD9122 offers features that allow simplified synchronization
with incoming data and between multiple devices. Auxiliary
DACs are also provided on chip for output dc offset compensation
(for LO compensation in SSB transmitters) and for gain matching
(for image rejection optimization in SSB transmitters).
Table 9. Serial Port Instruction Byte
I7 (MSB)
I6
I5
I4
I3
I2
I1
I0 (LSB)
R/W
A6
A5
A4
A3
A2
A1
A0
W
R/ , Bit 7 of the instruction byte, determines whether a read or
a write data transfer occurs after the instruction byte write. Logic 1
indicates a read operation, and Logic 0 indicates a write
operation.
SERIAL PORT OPERATION
The serial port is a flexible, synchronous serial communications
port allowing easy interface to many industry-standard micro-
controllers and microprocessors. The serial I/O is compatible
with most synchronous transfer formats, including both the
Motorola SPI® and Intel® SSR protocols. The interface allows
read/write access to all registers that configure the AD9122.
Single or multiple byte transfers are supported, as well as MSB-
first or LSB-first transfer formats. The serial interface ports can
be configured as a single pin I/O (SDIO) or two unidirectional
pins for input/output (SDIO/SDO).
A6 to A0, Bit 6 to Bit 0 of the instruction byte, determine the
register that is accessed during the data transfer portion of the
communication cycle. For multibyte transfers, A6 is the starting
byte address. The remaining register addresses are generated by
the device based on the LSB_FIRST bit (Register 0x00, Bit 6).
SERIAL PORT PIN DESCRIPTIONS
Serial Clock (SCLK)
The serial clock pin synchronizes data to and from the device
and runs the internal state machines. The maximum frequency
of SCLK is 40 MHz. All data input is registered on the rising
edge of SCLK. All data is driven out on the falling edge of SCLK.
50
SDO
SDIO 51
SPI
PORT
52
53
SCLK
CS
CS
Chip Select (
)
Figure 36. Serial Port Interface Pins
An active low input starts and gates a communication cycle.
It allows more than one device to be used on the same serial
communications lines. The SDO and SDIO pins go to a high
impedance state when this input is high. During the communication
cycle, chip select should stay low.
There are two phases to a communication cycle with the AD9122.
Phase 1 is the instruction cycle (the writing of an instruction
byte into the device), coincident with the first eight SCLK rising
edges. The instruction byte provides the serial port controller
with information regarding the data transfer cycle, Phase 2 of
the communication cycle. The Phase 1 instruction byte defines
whether the upcoming data transfer is a read or write and the
starting register address for the first byte of the data transfer.
The first eight SCLK rising edges of each communication cycle
are used to write the instruction byte into the device.
Serial Data I/O (SDIO)
Data is always written into the device on this pin. However, this
pin can be used as a bidirectional data line. The configuration
of this pin is controlled by Register 0x00, Bit 7. The default is
Logic 0, configuring the SDIO pin as unidirectional.
Serial Data Out (SDO)
CS
A logic high on the
pin followed by a logic low resets the
serial port timing to the initial state of the instruction cycle.
From this state, the next eight rising SCLK edges represent the
instruction bits of the current I/O operation.
Data is read from this pin for protocols that use separate lines
for transmitting and receiving data. In the case where the device
operates in a single bidirectional I/O mode, this pin does not
output data and is set to a high impedance state.
Rev. 0 | Page 1ꢀ of 56
AD9122
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
SERIAL PORT OPTIONS
CS
The serial port can support both MSB-first and LSB-first data
formats. This functionality is controlled by LSB_FIRST
(Register 0x00, Bit 6). The default is MSB-first (LSB_FIRST = 0).
SCLK
A0 A1 A2 A3 A4 N0 N1 R/W D0 D1 D2
D4 D5 D6 D7
N N N
SDIO
SDO
0
0
0
N
N
When LSB_FIRST = 0 (MSB-first), the instruction and data bit
must be written from MSB to LSB. Multibyte data transfers in
MSB-first format start with an instruction byte that includes
the register address of the most significant data byte. Subsequent
data bytes should follow from the high address to low address.
In MSB-first mode, the serial port internal byte address
generator decrements for each data byte of the multibyte
communication cycle.
D0 D1 D2
D4 D5 D6 D7
N N N
0
0
0
Figure 38. Serial Register Interface Timing LSB-First
tDS
tSCLK
CS
tPWH
tPWL
SCLK
When LSB_FIRST = 1 (LSB-first), the instruction and data bit
must be written from LSB to MSB. Multibyte data transfers in
LSB-first format start with an instruction byte that includes the
register address of the least significant data byte followed by
multiple data bytes. The serial port internal byte address generator
increments for each byte of the multibyte communication cycle.
tDS
tDH
SDIO
INSTRUCTION BIT 7
INSTRUCTION BIT 6
Figure 39. Timing Diagram for Serial Port Register Write
CS
The serial port controller data address decrements from the
data address written toward 0x00 for multibyte I/O operations
if the MSB-first mode is active. The serial port controller address
increments from the data address written toward 0x7F for
multibyte I/O operations if the LSB-first mode is active.
SCLK
tDV
SDIO,
SDO
DATA BIT n
DATA BIT n – 1
Figure 40. Timing Diagram for Serial Port Register Read
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CS
SCLK
SDIO
SDO
R/W A6 A5 A4 A3 A2 A1 A0 D7 D6 D5
N
D3 D2 D1 D0
0 0 0
N
0
0
D7 D6 D5
N
D3 D2 D1 D0
0 0 0
N
Figure 37. Serial Register Interface Timing MSB-First
Rev. 0 | Page 18 of 56
AD9122
DEVICE CONFIGURATION REGISTER MAP AND DESCRIPTIONS
Table 10. Device Configuration Register Map
Addr
(Hex) Bit 7
Reg Name
Comm
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Default
0x00
0x00
0x01
SDIO
LSB_FIRST
Reset
Power Control
Power-
down
DAC I
Power-
down
DAC Q
Power-
down data down
receiver
Power-
PLL lock
status
0x10
aux ADC
Data Format
0x03
0x04
Binary
data
format
Q data
first
MSB swap
Data bus width[1:0]
0x00
0x00
Interrupt Enable
Enable
PLL lock
lost
Enable
PLL
locked
Enable
sync
signal
lost
Enable
sync
signal
locked
Enable
sync
phase
locked
Enable
soft
FIFO
sync
Enable
FIFO
Enable
FIFO
Warning 1 Warning 2
Interrupt Enable
0x05
0
0
0
Enable
AED
Enable
AED
Enable
SED
0
0
0x00
compar
pass
compar
fail
compar
fail
Event Flag
Event Flag
0x06
0x0ꢀ
0x08
PLL
lock
lost
PLL
locked
Sync
signal
lost
Sync
signal
locked
Sync
phase
locked
Soft
FIFO
sync
FIFO
FIFO
N/A
Warning 1 Warning 2
AED
compar
pass
AED
compar
fail
SED
compar
fail
N/A
Clock Receiver
Control
DACCLK
duty
correction correction
REFCLK
duty
DACCLK
cross-
correction
REFCLK
cross-
correction
0
0
0
0
0x3F
0x40
0x00
PLL Control
PLL Control
0x0A PLL
enable
PLL
manual
enable
Manual VCO Band[5:0]
0x0B
PLL VCO
enable
PLL Control
PLL Control
0x0C
0x0D
PLL Loop
Bandwidth[1:0]
PLL Charge Pump Current[4:0]
N0[1:0]
0xD1
0xD9
N2[1:0]
PLL cross
control
enable
N1[1:0]
PLL Status
PLL Status
0x0E
0x0F
PLL lock
VCO Control Voltage[3:0]
VCO Band Readback[5:0]
0x00
0x00
Sync Control
0x10
Sync
enable
Data/FIFO
rate toggle
Rising
edge sync
Sync Averaging[2:0]
0x48
Sync Control
Sync Status
0x11
0x12
Sync Phase Request[5:0]
0x00
N/A
Sync lost
Sync
locked
Sync Status
0x13
0x15
Sync Phase Readback[ꢀ:0] (6.2 format)
N/A
N/A
Data Receiver
Status
LVDS
LVDS
LVDS
DCI level
high
LVDS
DCI
LVDS
LVDS data
FRAME
level high
FRAME
level low
data level level low
high
level
low
FIFO Control
FIFO Status
0x1ꢀ
0x18
FIFO Phase Offset[2:0]
0x04
N/A
FIFO
FIFO
FIFO
soft
FIFO soft
align
FIFO reset
aligned
Warning 1 Warning 2
align
ack
request
FIFO Status
0x19
FIFO Level[ꢀ:0]
N/A
Rev. 0 | Page 19 of 56
AD9122
Addr
(Hex) Bit 7
Reg Name
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Default
Datapath
Control
0x1B
Bypass
premod
Bypass
Sinc−1
Bypass
NCO
NCO gain
Bypass
phase
comp
and dc
offset
Select
sideband to Q data
Send I data
0xE4
HB1 Control
0x1C
HB1[1:0]
Bypass HB1 0x00
HB2 Control
HB3 Control
Chip ID
0x1D
0x1E
0x1F
0x30
0x31
0x32
0x33
0x34
HB2[5:0]
Bypass HB2 0x00
HB3[5:0]
Bypass HB3 0x00
Chip ID[ꢀ:0]
FTW[ꢀ:0]
0x08
0x00
0x00
0x00
0x08
0x00
FTW LSB
FTW
FTW[15:8]
FTW[23:16]
FTW[31:24]
FTW
FTW MSB
NCO Phase
Offset LSB
NCO Phase Offset[ꢀ:0]
NCO Phase
Offset MSB
0x35
0x36
NCO Phase Offset[15:8]
0x00
NCO FTW
Update
Frame
FTW ack
Frame FTW
request
Update
FTW ack
Update
FTW
0x00
request
I Phase Adj LSB
I Phase Adj MSB
Q Phase Adj LSB
0x38
0x39
0x3A
I Phase Adj[ꢀ:0]
Q Phase Adj[ꢀ:0]
0x00
0x00
0x00
0x00
0x00
0x00
0x00
I Phase Adj[9:8]
Q Phase Adj[9:8]
Q Phase Adj MSB 0x3B
I DAC Offset LSB 0x3C
I DAC Offset MSB 0x3D
I DAC Offset[ꢀ:0]
I DAC Offset[15:8]
Q DAC Offset[ꢀ:0]
Q DAC Offset
LSB
0x3E
Q DAC Offset
MSB
0x3F
Q DAC Offset[15:8]
I DAC FS Adj[ꢀ:0]
0x00
I DAC FS Adj.
I DAC Control
0x40
0x41
0xF9
0x01
I DAC
sleep
I DAC FS Adj[9:8]
Aux DAC I Data
0x42
0x43
I Aux DAC[ꢀ:0]
0x00
0x00
I Aux DAC
Control
I Aux
DAC sign
I Aux DAC
current
I Aux DAC
Sleep
I Aux DAC[9:8]
direction
Q DAC FS Adj.
Q DAC Control
0x44
0x45
Q DAC FS Adj[ꢀ:0]
Q Aux DAC[ꢀ:0]
0xF9
0x01
Q DAC
sleep
Q DAC FS Adj[9:8]
Q Aux DAC[9:8]
Aux DAC Q Data
0x46
0x4ꢀ
0x00
0x00
Q Aux DAC
Control
Q Aux
DAC sign
Q Aux DAC Q Aux DAC
current
Sleep
direction
Die Temp
Range Control
0x48
FS Current[2:0]
Ref Current[2:0]
Capacitor 0x02
value
Die Temp LSB
Die Temp MSB
SED Control
0x49
0x4A
0x6ꢀ
Die Temp[ꢀ:0]
Die Temp[15:8]
N/A
N/A
SED
compare
enable
Sample
error
detected
Autoclear
enable
Compare Compare
fail pass
0x00
Rev. 0 | Page 20 of 56
AD9122
Addr
(Hex) Bit 7
Reg Name
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Default
0xB6
Compare I0 LSBs 0x68
Compare Value I0[ꢀ:0]
Compare Value I0[15:8]
Compare
I0 MSBs
0x69
0x6A
0x6B
0xꢀA
Compare
Q0 LSBs
Compare Value Q0[ꢀ:0]
Compare Value Q0[15:8]
0x45
0xEA
Compare
Q0 MSBs
Compare I1 LSBs 0x6C
Compare I1 MSBs 0x6D
Compare Value I1[ꢀ:0]
Compare Value I1[15:8]
Compare Value Q1[ꢀ:0]
0x16
0x1A
0xC6
Compare
Q1 LSBs
0x6E
Compare
Q1 MSBs
0x6F
Compare Value Q1[15:8]
0xAA
SED I LSBs
SED I MSBs
SED Q LSBs
SED Q MSBs
0xꢀ0
0xꢀ1
0xꢀ2
0xꢀ3
Errors Detected I_BITS[ꢀ:0]
Errors Detected I_BITS[15:8]
Errors Detected Q_BITS[ꢀ:0]
Errors Detected Q_BITS[15:8]
0x00
0x00
0x00
0x00
Table 11. Device Configuration Register Descriptions
Reg
Name
Addr
(Hex)
Bit
Name
Description
Default
Comm
00
ꢀ
SDIO
SDIO Operation.
0
0 = SDIO operates as an input only.
1 = SDIO operates as bidirectional input/output.
Serial port communication LSB or MSB first.
0 = MSB first.
6
LSB_FIRST
0
1 = LSB first.
5
ꢀ
6
5
Reset
Reset is asserted when this bit transitions from 0 to 1.
1 = power down DAC I.
0
0
0
0
Power
01
Power-down DAC I
Power-down DAC Q
1 = power down DAC Q.
Control
Power-down data
receiver
1 = power down the input data receiver.
4
0
Power-down auxiliary
ADC
1 = power down auxiliary ADC for temperature sensor.
1 = PLL is locked.
0
0
PLL lock status
Rev. 0 | Page 21 of 56
AD9122
Reg
Name
Addr
(Hex)
Bit
Name
Description
Default
Data
Format
03
ꢀ
Binary data format
0 = input data is in twos complement format.
1 = input data is in binary format.
Indicates I/Q data pairing on data input.
0 = I data sent to data receiver first.
1 = Q data sent to data receiver first.
Swaps the bit order of the data input port.
0
6
5
Q data first
MSB swap
0
0
0 = order of the data bits corresponds to the pin
descriptions
1 = bit designations are swapped; most significant bits
become the least significant bits
1:0
Data bus width
Data receiver interface mode.
0
00 = word mode; 16-bit interface bus width.
01 = byte mode; 8-bit interface bus width.
10 = nibble mode; 4-bit interface bus width.
11 = invalid.
See the LVDS Input Data Ports section for details on
the operation of the different interface modes.
Interrupt 04
Enable
ꢀ
6
5
4
Enable PLL lock lost
Enable PLL locked
1 = enable interrupt for PLL lock lost.
1 = enable interrupt for PLL locked.
0
0
0
0
Enable sync signal lost
1 = enable interrupt for sync signal lock lost.
1 = enable interrupt for sync signal locked.
Enable sync signal
locked
3
Enable sync phase
locked
1 = enable interrupt for clock generation ready.
0
2
1
0
Enable soft FIFO sync
Enable FIFO Warning 1
Enable FIFO Warning 2
Set to 0
1 = enable interrupt for soft FIFO reset.
1 = enable interrupt for FIFO Warning 1.
1 = enable interrupt for FIFO Warning 2.
0
0
0
Interrupt 05
Enable
ꢀ
6
5
4
Set this bit to 0.
0
0
0
0
Set to 0
Set this bit to 0.
Set to 0
Set this bit to 0.
Enable AED comparison
pass
1 = enable interrupt for AED comparison pass.
3
2
Enable AED comparison
fail
1 = enable interrupt for AED comparison fail.
1 = enable interrupt for SED comparison fail.
0
0
Enable SED comparison
fail
1
0
Set to 0
Set to 0
Set this bit to 0.
Set this bit to 0.
0
0
Rev. 0 | Page 22 of 56
AD9122
Reg
Name
Addr
(Hex)
Bit
Name
Description
Default
Event
Flag
06
ꢀ
PLL lock lost
1 = indicates that the PLL, which had been previously
locked, has unlocked from the reference signal. This is a
latched signal.
0
6
5
4
PLL locked
1 = indicates that the PLL has locked to the reference
clock input.
0
0
0
Sync signal lost
Sync signal locked
1 = indicates that the sync logic, which had been
previously locked, has lost alignment. This is a latched signal.
1 = indicates that the sync logic did achieve sync
alignment. This is indicated when no phase changes
were requested for at least a few full averaging cycles.
3
2
Sync phase locked
Soft FIFO sync
1 = indicates that the internal digital clock generation logic is
ready. This occurs when internal clocks are present and stable.
0
0
1 = indicates that a FIFO reset originating from a serial
port-based request has successfully completed. This is
a latched signal.
1
0
FIFO Warning 1
FIFO Warning 2
1 = indicates that the difference between the FIFO read
and write pointers is 1.
0
0
1 = indicates that the difference between the FIFO read
and write pointers is 2.
Note that all bit event flags are cleared by writing the respective bit high.
Event
Flag
0ꢀ
4
3
AED comparison pass
1 = indicates that the SED logic detected a valid input data
pattern compared against the preprogrammed expected
values. This is a latched signal.
0
0
AED comparison fail
1 = indicates that the SED logic detected an invalid input
data pattern comparison against the preprogrammed
expected values. This is a latched signal that automatically
clears when eight valid I/Q data pairs are received.
2
SED comparison fail
1 = indicates that the SED logic detected an invalid input
data pattern comparison against the preprogrammed
expected values. This is a latched signal.
Note that all bit event flags are cleared by writing the respective bit high.
Clock
08
ꢀ
DACCLK duty correction
1 = enables duty-cycle correction on DACCLK input.
0
Receiver
Control
6
5
REFCLK duty correction
1 = enables duty-cycle correction on REFCLK input.
0
0
DACCLK cross-
correction
1 = enables differential crossing correction on the CLK input.
4
ꢀ
6
REFCLK cross-
correction
1 = enables differential crossing correction on the
REFCLK input.
0
0
1
PLL
Control
0A
0B
PLL enable
1 = enables the PLL clock multiplier. REFCLK input is used
as the PLL reference clock signal.
PLL manual enable
Enables the manual selection of the VCO band.
1 = manual mode; the correct VCO band must be
determined by the user.
5:0
5
Manual VCO band
PLL VCO enable
Selects the VCO band to be used.
0 = disables the PLL VCO.
0
PLL
Control
1 = enables the PLL VCO. Set this bit high prior to
enabling PLL.
Rev. 0 | Page 23 of 56
AD9122
Reg
Name
Addr
(Hex)
Bit
Name
Description
Default
PLL
0C
ꢀ:6
PLL Loop
Selects the PLL loop filter bandwidth.
3
Control
Bandwidth[1:0]
00 = narrowest bandwidth.
01 = narrow/medium bandwidth.
10 = medium/wide bandwidth.
11 = widest bandwidth.
4:0
ꢀ:6
PLL Charge Pump
Current[4:0]
Sets the nominal PLL charge pump current.
001
3
00000 = lowest current setting.
11111 = highest current setting.
PLL
Control
0D
N2[1:0]
PLL control clock divider. It determines the ratio of the
DACCLK rate to the PLL controller clock rate.
00 = fDACCLK/fPC_CLK = 2.
01 = fDACCLK/fPC_CLK = 4.
10 = fDACCLK/fPC_CLK = 8.
11 = fDACCLK/fPC_CLK = 16.
fPC_CLK must always be less than 50 MHz.
4
PLL cross control enable Enable PLL cross point controller.
0
3:2
N0[1:0]
PLL VCO divider. It determines the ratio of the VCO
01
output to the DACCLK frequencies.
00 = fVCO/fDACCLK = 1.
01 = fVCO/fDACCLK = 2.
10 = fVCO/fDACCLK = 4.
11 = fVCO/fDACCLK = 4.
1:0
N1[1:0]
PLL Loop divider. It determines the ratio of the DACCLK to
the REFCLK frequencies.
01
00 = fDACCLK/fREFCLK = 2.
01 = fDACCLK/fREFCLK = 4.
10 = fDACCLK/fREFCLK = 8.
11 = fDACCLK/fREFCLK = 16.
PLL
Status
0E
ꢀ
PLL lock
The PLL generated clock is tracking the REFCLK input signal.
VCO Control Voltage readback. See Table 24.
R
R
3:0
VCO Control
Voltage[3:0]
PLL
Status
0F
10
5:0
VCO Band
Readback[5:0]
Indicates the VCO band currently selected.
R
Sync
Control
ꢀ
6
Sync enable
1 = enables the synchronization logic.
0
0
Data/FIFO rate toggle
0 = operates the synchronization at the FIFO reset rate.
1 = operates the synchronization at the data rate.
0 = sync is initiated on the falling edge of the sync input.
1 = sync is initiated on the rising edge of the sync input.
3
Rising edge sync
1
0
2:0
Sync Averaging[2:0]
Sets the number of input samples that are averaged in
determining the sync phase.
000 = 1.
001 = 2.
010 = 4.
011 = 8.
100 = 16.
101 = 32.
110 = 64.
111 = 128.
Rev. 0 | Page 24 of 56
AD9122
Reg
Name
Addr
(Hex)
Bit
Name
Description
Default
0
Sync
Control
11
5:0
Sync Phase Request[5:0] This sets the requested clock phase offset after sync. The
offset unit is in DACCLK cycles.
000000 = 0 DACCLK cycles.
000001 = 1 DACCLK cycle.
…
111111 = 63 DACCLK cycles.
This enables repositioning of the DAC output with respect
to the sync input. The offset can also be used to skew the
DAC outputs between the synchronized DACs.
Sync
Status
12
13
ꢀ
Sync lost
1 = indicates that synchronization had been attained but
has been lost.
R
6
Sync locked
1 = indicates that synchronization has been attained.
Indicates the averaged sync phase offset (6.2 format).
R
R
Sync
ꢀ:0
Sync Phase Readback[ꢀ:0]
Status
00000000 = 0.0.
00000001 = 0.25.
…
11111110 = 63.50.
11111111 = 63.ꢀ5.
If this value differs from the requested sync phase value,
this indicates sync timing errors.
Data
Receiver
Status
15
5
4
LVDS FRAME level high
LVDS FRAME level low
One or both of the LVDS FRAME input signals
have exceeded 1.ꢀ V.
R
R
One or both of the LVDS FRAME input signals
have crossed below 0.ꢀ V.
3
2
LVDS DCI level high
LVDS DCI level low
One or both of the LVDS DCI input signals have exceeded 1.ꢀ V.
One or both of the LVDS DCI input signals have crossed
below 0.ꢀ V.
R
R
1
LVDS data level high
LVDS data level low
FIFO Phase Offset[2:0]
One or more of the LVDS Dx input signals have
exceeded 1.ꢀ V.
R
R
0
0
One or both of the LVDS Dx input signals have crossed
below 0.ꢀ V.
FIFO
1ꢀ
2:0
FIFO write pointer phase offset following FIFO reset.
Control
000 = 0.
001 = 1.
…
111 = ꢀ.
This is the difference between the read pointer and the
write pointer values upon FIFO reset. The optimal value is
nominally 4.
FIFO
Status
18
19
ꢀ
6
2
FIFO Warning 1
FIFO Warning 2
FIFO read and write pointers within 1.
FIFO read and write pointers within 2.
0
0
FIFO soft align
acknowledge
FIFO read and write pointers are aligned after serial
port initiated FIFO reset.
1
FIFO soft align request
Request FIFO read and write pointers alignment via
serial port.
0
0
FIFO reset aligned
FIFO Level[ꢀ:0]
FIFO read and write pointers aligned after hardware reset.
Thermometer encoded measure of the FIFO level.
0
0
FIFO
Status
ꢀ:0
Rev. 0 | Page 25 of 56
AD9122
Reg
Name
Addr
(Hex)
Bit
ꢀ
Name
Description
Default
Datapath 1B
Control
Bypass Premod
Bypass Sinc−1
Bypass NCO
NCO gain
1 = bypasses fS/2 premodulator.
1 = bypasses inverse sinc filter.
1 = bypasses NCO.
1
1
1
0
6
5
3
0 = default. No gain scaling is applied to the NCO input to
the internal digital modulator.
1 = gain scaling of 0.5 is applied to the NCO input to the
internal digital modulator. This can eliminate saturation
of the modulator output for some combinations of data
inputs and NCO signals.
2
1
Bypass phase
compensation and
dc offset
1 = bypasses phase compensation.
1
0
Select sideband
0 = the modulator outputs high-side image.
1 = the modulator outputs low-side image. The image is
spectrally inverted compared to the input data.
0
Send I data to Q data
HB1[1:0]
1 = ignores Q data from interface and disables the clocks
to Q datapath. Sends I data to both I and Q DACs.
0
0
HB1
1C
2:1
00 = input signal not modulated, filter pass band is from
Control
−0.4 to +0.4 of fIN1
01 = input signal not modulated, filter pass band is from
0.1 to 0.9 of fIN1
10 = input signal modulated by fIN1, filter pass band is from
0.6 to 1.4 of fIN1
11 = input signal modulated by fIN1, filter pass band is from
1.1 to 1.9 of fIN1
.
.
.
.
0
Bypass HB1
HB2[5:0]
1 = bypasses first stage interpolation filter.
0
0
HB2
1D
6:1
Modulation mode for I Side Half-Band Filter 2.
Control
000000 = input signal not modulated, filter pass band is
from −0.25 to +0.25 of fIN2
001001 = input signal not modulated, filter pass band is
from 0.0 to 0.5 of fIN2
010010 = input signal not modulated, filter pass band is
from 0.25 to 0.ꢀ5 of fIN2
011011 = input signal not modulated, filter pass band is
from 0.5 to 1.0 of fIN2
100100 = input signal modulated by fIN2, filter pass band is
from 0.ꢀ5 to 1.25 of fIN2
101101 = input signal modulated by fIN2, filter pass band is
from 1.0 to 1.5 of fIN2
110110 = input signal modulated by fIN2, filter pass band is
from 1.25 to 1.ꢀ5 of fIN2
111111 = input signal modulated by fIN2, filter pass band is
from 1.5 to 2.0 of fIN2
.
.
.
.
.
.
.
.
0
Bypass HB2
1 = bypasses second stage interpolation filter.
0
Rev. 0 | Page 26 of 56
AD9122
Reg
Name
Addr
(Hex)
Bit
Name
Description
Default
HB3
Control
1E
6:1
HB3[5:0]
Modulation mode for I Side Half-Band Filter 3.
000000 = input signal not modulated, filter pass band is
0
from −0.2 to +0.2 of fIN3
001001 = input signal not modulated, filter pass band is
from 0.05 to 0.45 of fIN3
010010 = input signal not modulated, filter pass band is
from 0.3 to 0.ꢀ of fIN3
011011 = input signal not modulated, filter pass band is
from 0.55 to 0.95 of fIN3
100100 = input signal modulated by fIN3, filter pass band is
from 0.8 to 1.2 of fIN3
101101 = input signal modulated by fIN3, filter pass band is
from 1.05 to 1.45 of fIN3
110110 = input signal modulated by fIN3, filter pass band is
from 1.3 to 1.ꢀ of fIN3
111111 = input signal modulated by fIN3, filter pass band is
from 1.55 to 1.95 of fIN3
.
.
.
.
.
.
.
.
0
Bypass HB3
Chip ID[ꢀ:0]
FTW[ꢀ:0]
1 = bypasses third stage interpolation filter.
Chip ID.
0
8
0
0
0
0
Chip ID
1F
ꢀ:0
ꢀ:0
ꢀ:0
ꢀ:0
ꢀ:0
FTW LSB 30
See Register 0x33.
FTW
FTW
31
32
33
FTW[15:8]
FTW[23:16]
FTW[31:24]
See Register 0x33.
See Register 0x33.
FTW
MSB
FTW[31:0] is the 32-bit frequency tuning word that
determines the frequency of the complex carrier
generated by the on-chip NCO. The frequency is not
updated when the FTW registers are written. The values
are only updated when Bit 0 of Register 0x36 transitions
from 0 to 1.
NCO
Phase
Offset
LSB
34
35
36
ꢀ:0
ꢀ:0
NCO Phase Offset[ꢀ:0]
NCO Phase Offset[15:8]
See Register 0x35.
0
0
NCO
The NCO sets the phase of the complex carrier signal
when the NCO is reset. The phase offset spans between 0°
and 360°. Each bit represents an offset of 0.0055°. Value is
in twos complement format.
Phase
Offset
MSB
NCO
FTW
Update
5
4
1
FRAME FTW
acknowledge
1 = indicates that the NCO has been reset due to an
extended FRAME pulse signal.
0
0
0
FRAME FTW request
0 → 1 = the NCO is reset on the first extended FRAME
pulse after this bit transitions from 0 to 1.
Update FTW
acknowledge
1 = indicates that the FTW has been updated.
0
Update FTW request
I Phase Adj[ꢀ:0]
0
0
0 → 1 = the FTW is updated on 0-to-1 transition of this bit.
I Phase
Adj LSB
38
39
ꢀ:0
See Register 0x39.
I Phase
Adj MSB
1:0
I Phase Adj[9:8]
I Phase Adj[9:0] is used to insert a phase offset between
the I and Q datapaths. This can be used to correct for
phase imbalance in a quadrature modulator. See the
Quadrature Phase Correction section for details.
0
Q Phase
Adj LSB
3A
3B
ꢀ:0
1:0
Q Phase Adj[ꢀ:0]
Q Phase Adj[9:8]
See Register 0x3B.
0
0
Q Phase
Adj MSB
Q Phase Adj[9:0] is used to insert a phase offset between
the I and Q datapaths. This can be used to correct for
phase imbalance in a quadrature modulator. See the
Quadrature Phase Correction section for details.
Rev. 0 | Page 2ꢀ of 56
AD9122
Reg
Name
Addr
(Hex)
Bit
Name
Description
Default
I DAC
Offset
LSB
3C
3D
3E
3F
40
ꢀ:0
I DAC Offset[ꢀ:0]
I DAC Offset[15:0] is a value added directly to the samples
written to the I DAC.
0
I DAC
Offset
MSB
ꢀ:0
ꢀ:0
ꢀ:0
ꢀ:0
I DAC Offset[15:8]
Q DAC Offset[ꢀ:0]
Q DAC Offset[15:8]
I DAC FS Adj[ꢀ:0]
See Register 0x3C.
0
Q DAC
Offset
LSB
Q DAC Offset[15:0] is a value added directly to the samples
written to the Q DAC.
0
Q DAC
Offset
MSB
See Register 0x3E.
0
I DAC
FS Adjust
I DAC FS Adj[9:0] sets the full-scale current of the I DAC.
The full-scale current can be adjusted from 8.64 mA to
31.6 mA in step sizes of approximately 22.5 μA.
F9
0x000 = 8.64 mA.
…
0x200 = 20.14 mA.
…
0x3FF = 31.66 mA.
I DAC
Control
41
ꢀ
I DAC sleep
1 = puts the I-channel DAC into sleep mode (fast
wake-up mode).
0
1:0
ꢀ:0
I DAC FS Adj[9:8]
I Aux DAC[ꢀ:0]
See Register 0x40.
1
0
Aux DAC 42
I Data
I Aux DAC[9:0] sets the magnitude of the auxiliary DAC
current. The range is 0 mA to 2 mA and the step size is 2 μA.
0x000 = 0.000 mA.
0x001 = 0.002 mA.
…
0x3FF = 2.046 mA.
I Aux
DAC
Control
43
ꢀ
6
I aux DAC sign
0 = the auxiliary DAC I sign is positive, and the current is
directed to the IOUT1P pin (Pin 6ꢀ).
0
0
1 = the auxiliary DAC I sign is negative, and the current is
directed to the IOUT1N pin (Pin 66).
I aux DAC current
direction
0 = the auxiliary DAC I sources current.
1 = the auxiliary DAC I sinks current.
I channel auxiliary DAC sleep.
See Register 0x42.
5
I aux DAC sleep
I Aux DAC[9:8]
0
1:0
ꢀ:0
0
Q DAC
FS Adj.
44
Q DAC FS Adj[ꢀ:0]
Q DAC FS Adj[9:0] sets the full-scale current of
F9
the I DAC. The full-scale current can be adjusted from
8.64 mA to 31.6 mA in step sizes of approximately 22.5 μA.
0x000 = 8.64 mA.
…
0x200 = 20.14 mA.
…
0x3FF = 31.66 mA.
Q DAC
Control
45
ꢀ
Q DAC sleep
1 = puts the Q-channel DAC into sleep mode (fast
wake-up mode).
0
1
1:0
Q DAC FS Adj[9:8]
See Register 0x44.
Rev. 0 | Page 28 of 56
AD9122
Reg
Name
Addr
(Hex)
Bit
Name
Description
Default
Aux DAC 46
Q Data
ꢀ:0
Q Aux DAC[ꢀ:0]
Q Aux DAC[9:0] sets the magnitude of the aux DAC current.
The range is 0 mA to 2 mA and the step size is 2 μA.
0
0x000 = 0.000 mA.
0x001 = 0.002 mA.
…
0x3FF = 2.046 mA.
Q Aux
DAC
Control
4ꢀ
ꢀ
6
Q aux DAC sign
0 = the auxiliary DAC Q sign is positive, and the current is
directed to the IOUT2P pin (Pin 58).
1 = the auxiliary DAC Q sign is negative, and the current is
directed to the IOUT2N pin (Pin 59).
0
0
Q aux DAC current
direction
0 = the auxiliary DAC Q sources current.
1 = the auxiliary DAC Q sinks current.
Q-channel auxiliary DAC sleep
5
Q aux DAC sleep
Q Aux DAC[9:8]
FS Current[2:0]
0
0
0
1:0
6:4
See Register 0x46.
DieTemp 0x48
Range
Control
Auxiliary ADC full-scale current.
000 = lowest current.
…
111 = highest current.
Auxiliary ADC reference current.
000 = lowest current.
111 = highest current.
Auxiliary ADC internal capacitor value.
0 = 5 pF.
3:1
0
Reference Current[2:0]
Capacitor value
1
0
1 = 10 pF.
Die
Temp
LSB
49
4A
ꢀ:0
ꢀ:0
Die Temp[ꢀ:0]
Die Temp[15:8]
See Register 0x4A.
R
R
Die
Die Temp[15:0] indicates the approximate die
temperature.
Temp
MSB
0xADCC = −39.9°C
0xC422 = 25.1°C
…
0xD8A8 = 84.8°C (see Temperature Sensor section for details)
SED
Control
6ꢀ
ꢀ
SED compare enable
1 = enables the SED circuitry. None of the flags in this
register or the values in Register 0xꢀ0 through
0
Register 0xꢀ3 are significant if the SED is not enabled.
5
3
Sample error detected
Autoclear enable
1 = indicates an error is detected. The bit remains set until
cleared. Any write to this register clears this bit to 0.
0
0
1 = enables autoclear mode. This activates Bit 1 and Bit 0
of this register and causes Register 0xꢀ0 through
Register 0xꢀ3 to be autocleared whenever eight
consecutive sample data sets are received error free.
1
Compare fail
1 = indicates an error has been detected. This bit remains
high until it is autocleared by the reception of eight
consecutive error free comparisons or is cleared by
writing to this register.
0
0
Compare pass
1 = indicates that the last sample comparison was error free.
0
Compare 68
I0 LSBs
ꢀ:0
Compare Value I0[ꢀ:0]
Compare Value I0[15:0] is the word that is compared
with the I0 input sample captured at the input interface.
B6
Compare 69
I0 MSBs
ꢀ:0
ꢀ:0
Compare Value I0[15:8]
Compare Value Q0[ꢀ:0]
See Register 0x68.
ꢀA
45
Compare 6A
Q0 LSBs
Compare Value Q0[15:0] is the word that is compared
with the Q0 input sample captured at the input interface.
Rev. 0 | Page 29 of 56
AD9122
Reg
Name
Addr
(Hex)
Bit
Name
Description
Default
Compare 6B
Q0 MSBs
ꢀ:0
Compare Value Q0[15:8] See Register 0x6A
EA
Compare 6C
I1 LSBs
ꢀ:0
ꢀ:0
ꢀ:0
ꢀ:0
ꢀ:0
ꢀ:0
ꢀ:0
ꢀ:0
Compare Value I1[ꢀ:0]
Compare Value I1[15:8]
Compare Value Q1[ꢀ:0]
Compare Value I1[15:0] is the word that is compared
with the I1 input sample captured at the input interface.
16
1A
C6
AA
0
Compare 6D
I1 MSBs
See Register 0x6C.
Compare 6E
Q1 LSBs
Compare Value Q1[15:0] is the word that is compared
with the Q1 input sample captured at the input interface.
Compare 6F
Q1 MSBs
Compare Value Q1[15:8] See Register 0x6E.
SED I
LSBs
ꢀ0
ꢀ1
ꢀ2
ꢀ3
Errors Detected
I_BITS[ꢀ:0]
Errors Detected I_BITS[15:0] indicates which bits were
received in error.
SED I
MSBs
Errors Detected
I_BITS[15:8]
See Register 0xꢀ0.
0
SED Q
LSBs
Errors Detected
Q_BITS[ꢀ:0]
Errors Detected Q_BITS[15:0] indicates which bits were
received in error.
0
SED Q
MSBs
Errors Detected
Q_BITS[15:8]
See Register 0xꢀ2.
0
Rev. 0 | Page 30 of 56
AD9122
LVDS INPUT DATA PORTS
The AD9122 has one LVDS data port that receives data for both
the I and Q transmit paths. The device can accept data in word,
byte, and nibble formats. In word, byte, and nibble modes, the data
is sent over 16-bit, 8-bit, and 4-bit LVDS data busses, respectively.
The pin assignment of the bus in each mode is shown in Table 12.
with DCI being high, and the least significant byte of the data
should correspond with DCI being low. The FRAME signal
indicates to which DAC the data is sent. When FRAME is high,
data is sent to the I DAC, and when FRAME is low, data is sent
to the Q DAC. The complete timing diagram is shown in Figure 42.
NIBBLE INTERFACE MODE
Table 12. Data Bit Pair Assignments for Data Input Modes
In nibble mode, the DCI signal is a reference bit used for
generating the data sampling clock and should be time aligned
with the data. The FRAME signal indicates to which DAC the
data is sent. When FRAME is high, data is sent to the I DAC.
When FRAME is low, data is sent to the Q DAC. All four nibbles
must be written to the device for proper operation. For 12-bit
resolution devices, the data in the fourth nibble acts as a place
holder for the data framing structure. The complete timing
diagram is shown in Figure 43.
Mode
MSB, …, LSB
Word
D15, D14, …, D0
D14, D12, D10, D8, Dꢀ, D5, D3, D1
D10, D8, Dꢀ, D5
Byte1
Nibble1
1 In byte and nibble modes, the unused pins can be left floating.
The data is accompanied by a reference bit (DCI) that is used to
generate a double data rate (DDR) clock. In byte and nibble modes,
a FRAME signal is required for controlling to which DAC the
data is sent. All of the interface signals are time aligned. While
there is a maximum skew requirement on the bus, there are no
setup and hold times to be met.
FIFO OPERATION
The AD9122 contains a 2-channel, 16-bit wide, eight-word deep
FIFO designed to relax the timing relationship between the data
arriving at the DAC input ports and the internal DAC data rate
clock. The FIFO acts as a buffer that absorbs timing variations
between the data source and DAC, such as the clock-to-data
variation of an FPGA or ASIC, which significantly increases the
timing budget of the interface.
WORD INTERFACE MODE
In word mode, the DCI signal is a reference bit used for
generating the data sampling clock. Time align the DCI
signal with the data. The I DAC data should correspond
with DCI being high and the Q DAC data with DCI being
low, as illustrated in Figure 41.
Figure 44 shows the block diagram of the datapath through the
FIFO. The data is latched into the device, is formatted, and is
then written into the FIFO register determined by the FIFO write
pointer. The value of the write pointer is incremented every time a
new word is loaded into the FIFO. Meanwhile, data is read from
the FIFO register determined by the read pointer and fed into
the digital datapath. The value of the read pointer is updated
every time data is read into the datapath from the FIFO. This
happens at the data rate, that is, the DACCLK rate divided by the
interpolation ratio.
DCI
Q
I
Q
I
Q
I
Q
3
DATA[15:0]
0
1
1
2
2
3
Figure 41. Timing Diagram for Word Mode
BYTE INTERFACE MODE
In byte mode, the DCI signal is a reference bit used for generating
the data sampling clock and should be time aligned with the
data. The most significant byte of the data should correspond
DCI
Q
I
I
Q
Q
I
I
Q
Q
2LSB
DATA[15:0]
FRAME
LSB
1MSB
1LSB
1MSB
1LSB
2MSB
2LSB
2MSB
Figure 42. Timing Diagram for Byte Mode
DCI
DATA[15:0]
FRAME
Q
I
I
I
I
Q
Q
Q
Q
Q
2N3
0N0
1N3
1N2
1N1
1N0
1N3
1N2
1N1
1N0
Figure 43. Timing Diagram for Nibble Mode
Rev. 0 | Page 31 of 56
AD9122
32 BITS
REG 0
REG 1
REG 2
REG 3
REG 4
REG 5
REG 6
REG 7
16
16
DATA
PATHS
INPUT
LATCH
DATA
ASSEMBLER
DACS
DATA
WRITE POINTER
READ POINTER
DACCLK
DCI
32 BITS
÷ INT
Figure 44. Block Diagram of FIFO
Valid data is transmitted through the FIFO as long as the
FIFO does not overflow or become empty. Note that an over-
flow or empty condition of the FIFO is the same as the write
pointer and read pointer being equal. When both pointers are
equal, an attempt is made to read and write a single FIFO register
simultaneously. This simultaneous register access leads to
unreliable data transfer through the FIFO and must be avoided.
To initialize the FIFO data level through the serial port, Bit 1 of
Register 0x18 should be toggled from 0 to 1 and back. When the
write to the register is complete, the FIFO data level is initialized.
This method operates similar to the method previously described.
When the initialization is triggered, the next time the read
pointer becomes 0, the write pointer is set to the value of the FIFO
start level (Register 0x17, Bits[2:0]) variable upon initialization. By
default, this is 4 but can be programmed to a value of 0 to 7.
Nominally, data is written to the FIFO at the same rate that data
is read from the FIFO, which keeps the data level in the FIFO
constant. If data is written to the FIFO faster than data is read,
the data level in the FIFO increases. If the data is written to the
device slower than data is read, the data level in the FIFO decreases.
For optimum timing margin, the FIFO level should be maintained
near half full, which is the same as maintaining a difference of
four between the write pointer and read pointer values.
The recommended procedure for a serial port FIFO data level
initialization is as follows:
•
•
Request FIFO level reset by setting Register 0x18, Bit 1 to 1.
Verify the part acknowledges the request by ensuring
Register 0x18, Bit 2 is 1.
•
•
Remove the request by setting Register 0x18, Bit 1 to 0.
Verify the part drops the acknowledge signal by ensuring
Register 0x18, Bit 2 is 0.
Resetting the FIFO Data Level
Monitoring the FIFO Status
To maximize the timing margin between the DCI input and
the internal DAC data rate clock, the FIFO data level should be
initialized prior to beginning data transmission. The value of
the FIFO data level can be initialized in three ways; by resetting
the device, by strobing the FRAME input, and via a write sequence
to the serial port. The two preferred methods are by using of the
FRAME signal and by issuing a command.
The FIFO initialization and status can be read from Register 0x18.
This register provides information on the FIFO initialization
method, and whether the initialization was successful. The MSB
of Register 0x18 is a FIFO warning flag that can optionally
trigger a device IRQ. This flag is an indication that the FIFO
is close to emptying (FIFO level is 1) or overflowing (FIFO level
is 7). This is an indication that data may soon be corrupted, and
action should be taken.
As discussed in the Byte Interface Mode and Nibble Interface
Mode sections, the FRAME input is used as a data select signal
that indicates to which DACs the input data is written. The second
function of the FRAME input is initializing the FIFO data level
value. This is done by asserting the FRAME signal high for at
least the time interval needed to load complete data to the I and
Q DACs. This corresponds to one DCI period in word mode,
two DCI periods in byte mode, and four DCI periods in nibble
mode. When FRAME is asserted in this manner, the write pointer
is set to 4 (by default or to the FIFO start level) the next time
the read pointer becomes 0 (see Figure 45).
The FIFO data level can be read from Register 0x19 at any time.
The serial port reported FIFO data level is denoted as a 7-bit
thermometer code of the write counter state relative to the absolute
read counter being at 0. The optimum FIFO data level of 4 is
therefore reported as a value of 00001111 in the status register.
It should be noted that, depending on the timing relationship
between DCI and the main DACCLK, the FIFO level value can be
off by 1 count. Therefore, it is important to keep the difference
between the read and write pointers to at least 2.
READ
POINTER
0
1
2
3
4
5
6
7
0
1
2
3
FIFO WRITE RESETS
FRAME
WRITE
POINTER
3
4
5
6
7
0
1
2
4
5
6
7
Figure 45. Timing of the FRAME Input vs. Write Pointer Value
Rev. 0 | Page 32 of 56
AD9122
In data rate mode, a second timing constraint between DCI and
DACCLK must be met in addition to the DCI-to-DATA timing
shown in Table 14. In data rate mode, only one FIFO slot is being
used. The DCI to DACCLK timing restriction is required to
prevent data being written to and read from the FIFO slot at the
same time. The required timing between DCI and DACCLK is
shown in Figure 47.
INTERFACE TIMING
The timing diagram for the digital interface port is shown
in Figure 46. The sampling point of the data bus occurs about
350 ps after each edge of the DCI signal and has an uncertainty
of 300 ps, as illustrated by the sampling interval shown in
Figure 46. The DATA and FRAME signals must be valid
throughout this sampling interval. The DATA and FRAME
signals may change at any time between sampling intervals.
The setup (tS) and hold (tH) times with respect to the edges
are shown in Figure 46. The minimum setup and hold times
are shown in Table 13.
tDATA
DACCLK/
REFCLK
SAMPLING
INTERVAL
tDATA
tDATA
DCI
DCI
SAMPLING
INTERVAL
SAMPLING
INTERVAL
tSDCI
tHDCI
DATA
Figure 47. Timing Diagram for Input Data Port (Data Rate Mode)
Table 14. Data Port Setup and Hold Times
tS
tS
Parameter
Time (ps)
tH
tH
tSDCI (MIN)
−120
tHDCI (MIN)
820
Figure 46. Timing Diagram for Input Data Ports
Table 13. Data Port Setup and Hold Times
Parameter
Time (ps)
tS (MIN)
tH (MIN)
−50
650
The data interface timing can be verified by using the sample
error detection (SED) circuitry. See the Interface Timing
Validation section for details.
Rev. 0 | Page 33 of 56
AD9122
DIGITAL DATAPATH
The block diagram in Figure 48 shows the functionality of the
digital datapath. The digital processing includes a premodulation
block, three half-band interpolation filters, a quadrature modulator
with a fine resolution NCO, phase and offset adjustment blocks,
and an inverse sinc filter.
Half-Band Filter 1 (HB1)
HB1 has four modes of operation, as shown in Figure 49. The
shape of the filter response is identical in each of the four modes.
The four modes are distinguished by two factors, the filter center
frequency and whether or not the input signal is modulated by
the filter.
PHASE
MODE 0
MODE 2
MODE 1
MODE 3
AND
–1
0
PREMOD
HB1
HB2
HB3
SINC
OFFSET
ADJUST
Figure 48. Block Diagram of Digital Datapath
–20
The digital datapath accepts I and Q data streams and processes
them as a quadrature data stream. The signal processing blocks can
be used when the input data stream is represented as complex data.
–40
–60
The datapath can be used to process an input data stream
representing two independent real data streams as well, but
the functionality is somewhat restricted. The premodulation
block can be used. As well as, any of the nonshifted interpolation
filter modes. See the Premodulation section for more details.
–80
–100
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
PREMODULATION
(× fIN1
)
Figure 49. HB1 Filter Modes
The half-band interpolation filters have selectable pass bands
that allow the center frequencies to be moved in increments of
½ of their input data rate. The premodulation block provides a
digital upconversion of the incoming waveform by ½ of the
incoming data rate, fDATA. This can be used to frequency shift
baseband input data to the center of the interpolation filters
pass band.
As is shown in Figure 49, the center frequency in each mode is
offset by ½ of the input data rate (fIN1) of the filter. Mode 0 and
Mode 1 do not modulate the input signal. Mode 2 and Mode 3
modulate the input signal by fIN1. When operating in Mode 0
and Mode 2, the I and Q paths operate independently and no
mixing of the data between channels occurs. When operating
in Mode 1 and Mode 3, mixing of the data between the I and Q
paths occurs; therefore, the data input into the filter is assumed
complex. Table 15 summarizes the HB1 modes.
INTERPOLATION FILTERS
The transmit path contains three interpolation filters. Each of
the three interpolation filters provides a 2× increase in output data
rate. The half-band (HB) filters can be individually bypassed or
cascaded to provide 1×, 2×, 4×, or 8× interpolation ratios. Each
of the half-band filter stages offers a different combination of
bandwidths and operating modes.
Table 15. HB1 Filter Mode Summary
Mode
fCENTER
fMOD
None
None
fIN
Input Data
Real or complex
Complex
Real or complex
Complex
0
1
2
3
DC
fIN/2
fIN
The bandwidth of the three half-band filters with respect to the
data rate at the filter input is as follows:
3fIN/2
fIN
•
•
•
Bandwidth of HB1 = 0.8 × fIN1
Bandwidth of HB2 = 0.5 × fIN2
Bandwidth of HB3 = 0.4 × fIN3
The usable bandwidth is defined as the frequency over which
the filters have a pass-band ripple of less than 0.001 dB and an
image rejection of greater than +85 dB. As is discussed in the
Half-Band Filter 1 (HB1) section, the image rejection usually sets
the usable bandwidth of the filter, not the pass-band flatness.
The half-band filters operate in several modes, providing
programmable pass-band center frequencies as well as signal
modulation. The HB1 filter has four modes of operation and
the HB2 and HB3 filters each have eight modes of operation.
Rev. 0 | Page 34 of 56
AD9122
Figure 50 shows the pass-band filter response for HB1. In most
applications, the usable bandwidth of the filter is limited by the
image suppression provided by the stop-band rejection and not
by the pass-band flatness. Table 16 shows the pass-band flatness
and stop-band rejection the HB1 filter supports at different
bandwidths.
Half-Band Filter 2 (HB2)
HB2 has eight modes of operation, as shown in Figure 51 and
Figure 52. The shape of the filter response is identical in each of
the eight modes. The eight modes are distinguished by two factors,
the filter center frequency and whether the input signal is
modulated by the filter.
0.02
MODE 0
MODE 4
MODE 2
MODE 6
0
0
–0.02
–0.04
–0.06
–0.08
–0.10
–20
–40
–60
–80
–100
0
0.04 0.08 0.12 0.16 0.20 0.24 0.28 0.32 0.36 0.40
(× fIN1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
)
(× fIN2
)
Figure 50. Pass-Band Detail of HB1
Figure 51. HB2, Even Filter Modes
MODE 7
MODE 5
MODE 1
MODE 3
Table 16. HB1 Pass-Band and Stop-Band Performance by
Bandwidth
0
–20
Pass-Band
Stop-Band
Rejection (dB)
Bandwidth (% of fIN1
)
Flatness (dB)
80
0.001
85
80
ꢀ0
60
50
40
–40
80.4
81.2
82.0
83.6
85.6
0.0012
0.0033
0.00ꢀ6
0.02ꢀ1
0.1096
–60
–80
–100
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
(× fIN2
)
Figure 52. HB2, Odd Filter Modes
As shown in Figure 51 and Figure 52, the center frequency in
each mode is offset by ¼ of the input data rate (fIN2) of the filter.
Mode 0 through Mode 3 do not modulate the input signal. Mode 4
through Mode 7 modulate the input signal by fIN2. When operating
in Mode 0 and Mode 4, the I and Q paths operate independently
and no mixing of the data between channels occurs. When
operating in the other six modes, mixing of the data between
the I and Q paths occurs; therefore, the data input to the filter
is assumed complex.
Rev. 0 | Page 35 of 56
AD9122
Table 17 summarizes the HB2 and HB3 modes.
Half-Band Filter 3 (HB3)
HB3 has eight modes of operation that function the same as
HB2. The primary difference between HB2 and HB3 are the
filter bandwidths.
Table 17. HB2 and HB3 Filter Mode Summary
Mode
fCENTER
fMOD
None
None
None
None
fIN
fIN
fIN
fIN
Input Data
Real or complex
Complex
Complex
Complex
Real or complex
Complex
Complex
0
1
2
3
4
5
6
ꢀ
DC
fIN/8
fIN/4
3fIN/8
fIN/2
5fIN/8
3fIN/4
ꢀfIN/8
0.02
0
–0.02
–0.04
–0.06
–0.08
–0.10
Complex
Figure 53 shows the pass-band filter response for HB2. In most
applications, the usable bandwidth of the filter is limited by the
image suppression provided by the stop-band rejection and not
by the pass-band flatness. Table 18 shows the pass-band flatness
and stop-band rejection the HB2 filter supports at different
bandwidths.
0
0.04 0.08 0.12 0.16 0.20 0.24 0.28 0.32 0.36 0.40
(× fIN3
)
Figure 54. Pass-Band Detail of HB3
0.02
Figure 54 shows the pass-band filter response for HB3. In most
applications, the usable bandwidth of the filter is limited by the
image suppression provided by the stop-band rejection and not
by the pass-band flatness. Table 19 shows the pass-band flatness
and stop-band rejection the HB3 filter supports at different
bandwidths.
0
–0.02
–0.04
–0.06
–0.08
–0.10
Table 19. HB3 Pass-Band and Stop-Band Performance by
Bandwidth
Pass-Band
Flatness (dB)
Stop-Band
Rejection (dB)
Bandwidth (% of fIN3
)
40
0.001
0.0014
0.002
0.0093
0.03
85
80
ꢀ0
60
50
40
0
0.04
0.08
0.12
0.16
0.20
0.24
0.28
0.32
40.8
42.4
45.6
49.8
55.6
(× fIN2
)
Figure 53. Pass-Band Detail of HB2
Table 18. HB2 Pass-Band and Stop-Band Performance by
Bandwidth
0.1
Pass-Band
Flatness (dB)
Stop-Band
Rejection (dB)
Bandwidth (% of fIN2
)
50
0.001
85
80
ꢀ0
60
50
40
50.8
52.8
56.0
60
0.0012
0.0028
0.0089
0.028ꢀ
0.18ꢀꢀ
64.8
Rev. 0 | Page 36 of 56
AD9122
INTERPOLATION
FTW[31:0]
I DATA
COSINE
NCO
SINE
NCO PHASE OFFSET
[15:0]
OUT_I
OUT_Q
–
+
–1
1
SPECTRAL
INVERSION
0
INTERPOLATION
Q DATA
Figure 55. Digital Quadrature Modulator Block Diagram
Given these four parameters, the first step in configuring the
datapath is to verify that the device supports the bandwidth
requirements. The modes of the interpolation filters are then
chosen. Finally, any additional frequency offset requirements
are determined and applied with premodulation and NCO
modulation.
NCO MODULATION
The digital quadrature modulator makes use of a numerically
controlled oscillator, a phase shifter, and a complex modulator
to provide a means for modulating the signal by a programmable
carrier signal. A block diagram of the digital modulator is shown in
Figure 55. The fine modulation provided by the digital modulator,
in conjunction with the coarse modulation of the interpolation
filters and premodulation block, allows the signal to be placed
anywhere in the output spectrum with very fine frequency
resolution.
Determining Datapath Signal Bandwidth
The available signal bandwidth of the datapath is dependent on
the center frequency of the output signal in relation to the center
frequency of the interpolation filters used. Signal center frequencies
offset from the center frequencies of the half-band filters lower
the available signal bandwidth.
The quadrature modulator is used to mix the carrier signal
generated by the NCO with the I and Q signal. The NCO produces
a quadrature carrier signal to translate the input signal to a new
center frequency. A complex carrier signal is a pair of sinusoidal
waveforms of the same frequency, offset 90° from each other.
The frequency of the complex carrier signal is set via FTW[31:0]
in Register 0x30 through Register 0x33.
When correctly configured, the available complex signal band-
width for 2× interpolation is always 80% of the input data rate.
The available signal bandwidth for 4× interpolation vs. output
frequency varies between 50% and 80% of the input data rate,
as shown in Figure 56. Note that in 4× interpolation mode,
fDAC = 4 × fDATA; therefore, the data shown in Figure 56 repeats
The NCO operating frequency, fNCO, is at either fDATA (HB1
bypassed) or twice fDATA (HB1 enabled). The frequency of
the complex carrier signal can be set from dc up to fNCO. The
frequency tuning word (FTW) is calculated as
four times from dc to fDAC
.
HB1 AND HB2
0.8
fCARRIER
fNCO
FTW =
×232
0.5
0.3
The generated quadrature carrier signal is mixed with the I and
Q data. The quadrature products are then summed into the I
and Q data paths, as shown in Figure 55.
HB2 AND HB3
Updating the Frequency Tuning Word
The frequency tuning word registers are not updated immediately
upon writing as other configuration registers do. After loading
the FTW registers with the desired values, Bit 0 of Register 0x36
must transition from 0 to 1 for the new FTW to take effect.
0.2
0.4
0.6
fOUT/fDATA
0.8
1.0
Figure 56. Signal Bandwidth vs. Center Frequency of the Output Signal,
4× Interpolation
DATAPATH CONFIGURATION
Configuring 4× interpolation using the HB2 and HB3 filters can
lower the power consumption of the device at the expense of
bandwidth. The lower curve in Figure 56 shows that the supported
Configuring the AD9122 datapath starts with the application
requirements of the input data rate, the interpolation ratio, the
output signal bandwidth, and the output signal center frequency.
bandwidth in this mode varies from 30% to 50% of fDATA
.
Rev. 0 | Page 3ꢀ of 56
AD9122
The available signal bandwidth for 8× interpolation vs. output
frequency varies between 50% and 80% of the input data rate,
as shown in Figure 57. Note that in 8× interpolation mode,
fDAC = 8 × fDATA; therefore, the data shown in Figure 57 repeats
DETERMINING INTERPOLATION FILTER MODES
Table 20 shows the recommended interpolation filter settings
for a variety of filter interpolation factors, filter center frequencies,
and signal modulation. The interpolation modes were chosen
based on the final center frequency of the signal and by
determining the frequency shift of the signal required. When
these are known, and put in terms of the input data rate (fDATA),
the filter configuration that comes closest to matching is chosen
from Table 20.
eight times from dc to fDAC
.
HB1, HB2, AND HB3
0.8
0.6
0.5
0.1
0.4
0.6
0.9
0.25
0.50
fOUT
0.75
1.00
/
fDATA
Figure 57. Signal Bandwidth vs. Center Frequency of the Output Signal,
8× Interpolation
Table 20. Recommended Interpolation Filter Modes (Register 0x1C through Register 0x1E)
Filter Modes
Interpolation Factor
HB1[1:0]
00 (0)
01 (1)
10 (2)
11 (3)
00 (0)
01 (1)
10 (2)
11 (3)
00 (0)
01 (1)
10 (2)
11 (3)
00 (0)
01 (1)
10 (2)
11 (3)
00 (0)
01 (1)
10 (2)
11 (3)
00 (0)
01 (1)
10 (2)
11 (3)
00 (0)
01 (1)
10 (2)
11 (3)
HB2[5:0]
000000
001001
010010
011011
100100
101101
110110
111111
000000
001001
010010
011011
100100
101101
110110
111111
000000
001001
010010
011011
100100
101101
110110
111111
Bypass
Bypass
Bypass
Bypass
HB3[5:0]
000000
000000
001001
001001
010010
010010
011011
011011
100100
100100
101101
101101
110110
110110
111111
111111
Bypass
Bypass
Bypass
Bypass
Bypass
Bypass
Bypass
Bypass
Bypass
Bypass
Bypass
Bypass
fSIGNAL Modulation
DC
DC1
fCENTER Shift
0
fDATA/2
fDATA
3fDATA/2
2fDATA
5fDATA/2
3fDATA
ꢀfDATA/2
4fDATA
9fDATA/2
5fDATA
11fDATA/2
6fDATA
13fDATA/2
ꢀfDATA
15fDATA/2
0
fDATA/2
fDATA
3fDATA/2
2fDATA
5fDATA/2
3fDATA
ꢀfDATA/2
0
fDATA/2
fDATA
8
8
82
8
8
8
8
8
8
8
8
8
8
8
8
8
4
43
4
4
4
4
4
4
2
2
2
2
fDATA
fDATA
1
2fDATA
2fDATA
1
3fDATA
3 fDATA
1
4fDATA
4fDATA
1
5fDATA
5fDATA
1
6fDATA
6fDATA
1
ꢀfDATA
ꢀfDATA
1
DC
DC1
fDATA
fDATA
1
2fDATA
2fDATA
1
3fDATA
3fDATA
1
DC
DC1
fDATA
fDATA
1
3fDATA/2
1 When HB1 Mode 1 or Mode 3 is used, enabling premodulation provides an addition frequency translation of the input signal by fDATA/2, which centers a baseband
input signal in the filter pass band.
2 This configuration was used in the 8× interpolation without NCO example. Also, see the 8× Interpolation Without NCO section.
3 This configuration was used in the 4× interpolation with NCO example. Also, see the 4× Interpolation With NCO section.
Rev. 0 | Page 38 of 56
AD9122
4× Interpolation With NCO
DATAPATH CONFIGURATION EXAMPLE
8× Interpolation Without NCO
Given the following:
Given the following:
f
DATA = 250 MSPS
4× interpolation
fBW = 140 MHz
fCENTER = 175 MHz
fDATA = 100 MSPS
8× interpolation
f
f
BW = 75 MHz
The desired 140 MHz of bandwidth is 56% of fDATA. As shown
in Figure 56, the value at 0.7 × fDATA is 0.6. This is calculated as
0.8 − 2(0.7 − 0.6) = 0.6. This verifies that the AD9122 supports
a bandwidth of 60% of fDATA, which exceeds the required 56%.
CENTER = 100 MHz
The desired 75 MHz of bandwidth is 75% of fDATA. In this case,
the ratio of fOUT/fDATA = 100/100 = 1.0. From Figure 57, the band-
width supported at fDATA is 0.8, which verifies that the AD9122
supports the bandwidth required in this configuration.
The signal center frequency is 0.7 × fDATA, and assuming the
input signal is at baseband, the frequency shift required is also
0.7 × fDATA. Choosing the second row in the IF column in the
4× interpolation section in Table 20 selects the filter modes that
give a center frequency of fDATA/2 and no frequency translation.
The selected modes for the three half-band filters are HB1,
Mode 1; HB2, Mode 1; and HB3, bypassed.
The signal center frequency is fDATA, and assuming the input signal
is at baseband, the frequency shift required is also fDATA. Choosing
the third row (highlighted by the superscripted number two) of the
IF column from Table 20 selects filter modes that give a center
frequency of fDATA and a frequency translation of fDATA. The selected
modes for the three half-band filters are: HB1, Mode 2; HB2,
Mode 2; and HB3, Mode 1. Figure 58 shows how the signal
propagates through the interpolation filters.
Because Mode 1 of HB1 was selected, the premodulation block
should be enabled. This provides fDATA/2 modulation, which
centers the baseband input data at the center frequency of HB1.
The digital modulator can be used to provide the final frequency
translation of 0.2 × fDATA to place the output signal at 0.7 × fDATA
as desired.
Because 2 × fIN1 = fIN2 and 2 × fIN2 = fIN3, the signal appears
frequency scaled by ½ into each consecutive stage. The output
signal band spans 0.15 to 0.35 of fIN3 (400 MHz). Therefore,
the output frequency supported is 60 MHz to 140 MHz, which
covers the 75 MHz bandwidth centered at 100 MHz, as desired.
,
The formula for calculating the FTW of the NCO is:
fCARRIER
fNCO
FTW =
×232
where:
f
f
CARRIER = 0.2 × fDATA.
NCO = 2 × fDATA. Therefore, FTW = 232/10.
0
2
0
3
1
HB1
0.1
0
0.4 0.6
0.5
×
2.0
fIN1
–0.5
0
1.0
1.5
1
3
5
7
1.75
7
4
HB2
2
6
0.25
0.75
1.25
×
2.0
fIN2
–0.5
0
0.5
1.0
4
1.5
0.3
0.7
0
1
3
5
HB3
2
6
–0.2
0.2 0.3
0.7
×
fIN3
–0.5
0
0.5
1.0
1.5
2.0
0.15 0.35
Figure 58. Signal Propagation for 8× Interpolation (fDATA Modulation)
Rev. 0 | Page 39 of 56
AD9122
In practice, this modulation results in mixing functions as
shown in Table 21.
DATA RATES vs. INTERPOLATION MODES
Table 22 summarizes the maximum bus speed (fBUS), supported
input data rates, and signal bandwidths with the various
combinations of bus width modes and interpolation rates.
The maximum bus speed in any mode is 1200 MHz. The
maximum DAC update rate (fDAC) in any mode is 1200 MHz.
The real signal bandwidth supported is a fraction of the input
data rate, which depends on the interpolation filters (HB1, HB2,
or HB3) selected. The complex signal bandwidth supported is
twice the real signal bandwidth.
Table 21. Modulation Mixing Sequences
Modulation Mixing Sequence
fS/2
I = I, −I, I, −I, …
Q = Q, −Q, Q, −Q, …
fS/4
I = I, Q, −I, −Q, …
Q = Q, −I, −Q, I, …
3 fS/4
fS/8
I = I, −Q, −I, Q, …
Q = Q, I, −Q, −I, …
In general, 2× interpolation is best supported by enabling HB1,
and 4× interpolation is best supported enabling HB1 and HB2.
In some cases, power dissipation can be lowered by avoiding
HB1. If the bandwidth required is low enough, 2× interpolation
can be supported by using HB2, and 4× interpolation can be
supported by using HB2 and HB3.
I = I, r(I + Q), Q, r(−I + Q), −I, −r(I + Q), −Q, r(I − Q), …
Q = Q, r(Q − I), −I, −r(Q + I), −Q, r(−Q + I),I, r(Q + I), …
2
2
Note that r =
As shown in Table 21, the mixing functions of most of the modes
crosscouple samples between the I and Q channels. The I and Q
channels only operate independently in fS/2 mode. This means
that real modulation using both the I and Q DAC outputs can only
be done in fS/2 mode. All other modulation modes require
complex input data and produce complex output signals.
COARSE MODULATION MIXING SEQUENCES
The coarse digital quadrature modulation occurs within the
interpolation filters. The modulation shifts the frequency
spectrum of the incoming data by the frequency offset selected.
The frequency offsets available are multiples of the input data
rate. The modulation is equivalent to multiplying the quadrature
input signal by a complex carrier signal, C(t), of the form
C(t) = cos(ωct) + j sin(ωct)
Table 22. Summary of Data Rates and Bandwidths vs. Interpolation Modes
Filter Modes
Bus Width
HB3
0
0
0
0
HB2
0
0
1
1
HB1
0
1
0
1
fBUS (Mbps)
1200
1200
1200
1200
1200
1200
1200
1200
1200
1200
1200
600
fDATA (Mbps)
150
150
150
150
Real Signal Bandwidth (MHz)
fDAC (MHz)
150
300
300
600
600
1200
300
600
600
Nibble (4 Bits)
ꢀ5
60
3ꢀ.5
60
3ꢀ.5
60
1
1
1
1
0
1
150
150
Byte (8 Bits)
0
0
0
0
1
1
0
0
1
1
1
1
0
1
0
1
0
1
300
300
300
300
300
150
150
120
ꢀ5
120
ꢀ5
1200
1200
1200
600
60
Word (16 Bits)
0
0
0
0
1
1
0
0
1
1
1
1
0
1
0
1
0
1
1200
800
1200
600
600
300
600
400
600
300
300
150
300
160
150
120
ꢀ5
800
1200
1200
1200
1200
60
Rev. 0 | Page 40 of 56
AD9122
QUADRATURE PHASE CORRECTION
20
15
10
5
0
The purpose of the quadrature phase correction block is to
enable compensation of the phase imbalance of the analog
quadrature modulator following the DAC. If the quadrature
modulator has a phase imbalance, the unwanted sideband appears
with significant energy. Tuning the quadrature phase adjust value
can optimize image rejection in single sideband radios.
5
10
15
Ordinarily, the I and Q channels have an angle of precisely 90°
between them. The quadrature phase adjustment is used to
change the angle between the I and Q channels. When the
I Phase Adj[9:0] is set to 1000000000b, the I DAC output moves
approximately 1.75° away from the Q DAC output, creating an
angle of 91.75° between the channels. When the I Phase Adj[9:0]
is set to 0111111111b, the I DAC output moves approximately
1.75° toward the Q DAC output, creating an angle of 88.25°
between the channels.
0
20
0xFFFF
0x0000
0x4000
0x8000
0xC000
DAC OFFSET VALUE
Figure 59. DAC Output Currents vs. DAC Offset Value
INVERSE SINC FILTER
The inverse sinc (sinc−1) filter is a nine-tap FIR filter. The
composite response of the sinc−1 and the sin(x)/x response of
the DAC is shown in Figure 59. The composite response has less
The Q Phase Adj[9:0] works in a similar fashion. When the Q
Phase Adj[9:0] is set to 1000000000b, the Q DAC output moves
approximately 1.75° away from the I DAC output, creating an
angle of 91.75° between the channels. When the Q Phase Adj[9:0]
is set to 0111111111b, the Q DAC output moves approximately
1.75° toward the I DAC output, creating an angle of 88.25°
between the channels.
than 0.05 dB pass-band ripple up to a frequency of 0.4 × fDACCLK
To provide the necessary peaking at the upper end of the pass
band, the inverse sinc filters shown have an intrinsic insertion
loss of about 3.2 dB. Figure 60 shows the composite frequency
.
response.
Based on these two endpoints, the combined resolution of the
phase compensation register is approximately 3.5°/1024 or
0.00342° per code.
–3.0
–3.2
–3.4
–3.6
–3.8
–4.0
DC OFFSET CORRECTION
The dc value of the I datapath and the Q datapath can be
independently controlled by adjusting the I DAC Offset[15:0]
and Q DAC Offset[15:0] values in Register 0x3C through
Register 0x3F. These values are added directly to the datapath
values. Care should be taken not to overrange the transmitted
values.
Figure 59 shows how the DAC offset current varies as a function
of the I DAC Offset[15:0] and the Q DAC Offset[15:0] values.
With the digital inputs fixed at midscale (0x0000, twos complement
data format), Figure 59 shows the nominal IOUTP and IOUTN currents
as the DAC offset value is swept from 0 to 65535. Because IOUTP
and IOUTN are complementary current outputs, the sum of IOUTP
and IOUTN is always 20 mA.
0
0.1
0.2
fOUT
0.3
0.4
0.5
/
fDAC
Figure 60. Sample Composite Responses of the Sinc−1 Filter with Sin(x)/x Roll-Off
The sinc−1 filter is enabled by default. It can be bypassed by setting
the bypass sinc−1 bit (Register 0x1B, Bit 6).
Rev. 0 | Page 41 of 56
AD9122
DAC INPUT CLOCK CONFIGURATIONS
when the clock input signal is between 800 mV p-p differential and
1.6 V p-p differential. Whether using the on-chip clock multiplier
or sourcing the DACCLK, directly, it is necessary that the input
clock signal to the device has low jitter and fast edge rates to
optimize the DAC noise performance.
DAC INPUT CLOCK CONFIGURATIONS
The AD9122 DAC sample clock (DACCLK) can be sourced
directly or by clock multiplying. Clock multiplying employs the
on-chip phased-locked loop (PLL) that accepts a reference clock
operating at a submultiple of the desired DACCLK rate, most
commonly the data input frequency. The PLL then multiplies
the reference clock up to the desired DACCLK frequency, which
can then be used to generate all the internal clocks required by
the DAC. The clock multiplier provides a high quality clock that
meets the performance requirements of most applications. Using
the on-chip clock multiplier removes the burden of generating
and distributing the high speed DACCLK.
Direct Clocking
Direct clocking with a low noise clock produces the lowest noise
spectral density at the DAC outputs. To select the differential CLK
inputs as the source for the DAC sampling clock, set the PLL
enable bit (Register 0x0A, Bit[7]) to 0. This powers down the
internal PLL clock multiplier and selects the input from the
DACCLKP and DACCLKN pins as the source for the internal
DAC sample clock.
The second mode bypasses the clock multiplier circuitry and
allows DACCLK to be sourced directly to the DAC core. This
mode enables the user to source a very high quality clock directly
to the DAC core. Sourcing the DACCLK directly through the
REFCLKP, REFCLKN, DACCLKP, and DACCLKN pins may
be necessary in demanding applications that require the lowest
possible DAC output noise, particularly when directly synthesizing
signals above 150 MHz.
The device also has duty-cycle correction circuitry and
differential input level correction circuitry. Enabling these
circuits can provide improved performance in some cases.
The control bits for these functions can be found in Register 0x08.
See Table 11 for complete details.
Clock Multiplication
The on-chip PLL clock multiplier circuit can be used to generate
the DAC sample rate clock from a lower frequency reference
clock. When the PLL enable bit (Register 0x0A, Bit[7]) is set to 1,
the clock multiplication circuit generates the DAC sample clock
from the lower rate REFCLK input. The functional diagram of
the clock multiplier is shown in Figure 62.
Driving the DACCLK and REFCLK Inputs
The REFCLK and DACCLK differential inputs share similar
clock receiver input circuitry. Figure 61 shows a simplified circuit
diagram of the input. The on-chip clock receiver has a differential
input impedance of about 10 kΩ. It is self biased to a common-
mode voltage of about 1.25 V. The inputs can be driven by
direct coupling differential PECL or LVDS drivers. The inputs
can also be ac-coupled if the driving source cannot meet the
input compliance voltage of the receiver.
The clock multiplication circuit operates such that the VCO
outputs a frequency, fVCO, equal to the REFCLK input signal
frequency multiplied by N1 × N0.
f
VCO = fREFCLK × (N1 × N0)
The DAC sample clock frequency, fDACCLK, is equal to
DACCLK = fREFCLK × N1
DACCLKP,
REFCLKP
5kΩ
f
1.25V
The output frequency of the VCO must be chosen to keep fVCO
in the optimal operating range of 1.0 GHz to 2.1 GHz. The
frequency of the reference clock and the values of N1 and N0
must be chosen so that the desired DACCLK frequency can be
synthesized and the VCO output frequency is in the correct range.
5kΩ
DACCLKN,
REFCLKN
Figure 61. Clock Receiver Input Equivalent Circuit
The minimum input drive level to either of the clock inputs is
200 mV p-p differential. The optimal performance is achieved
0x0E[3:0]
0x06[7:6]
VCO CONTROL
VOLTAGE
PLL LOCKED
ADC
PLL LOCKED LOST
REFCLKP/REFCLKN
PHASE
LOOP
FILTER
(PIN 69 AND PIN 70)
DETECTION
VCO
÷N1
÷N0
0x0D[1:0]
N1
0x0D[3:2]
N0
DACCLK
DACCLKP/DACCLKN
(PIN 2 AND PIN 3)
0x0D[7:6]
N2
÷N2
0x0A[7]
PLL ENABLE
PC_CLK
Figure 62. PLL Clock Multiplication Circuit
Rev. 0 | Page 42 of 56
AD9122
PLL Settings
Manual VCO Band Select
There are three settings for the PLL circuitry that should be
programmed to their nominal values. The PLL values shown in
Table 23 are the recommended settings for these parameters.
The device also has a manual band select mode (PLL manual
enable, Register 0x0A, Bit[6] = 1) that allows the user to select
the VCO tuning band. When in manual mode, the VCO band
is set directly with the value written to the manual VCO band,
(Register 0x0A, Bit[5:0]). To properly select the VCO band,
follow these steps:
Table 23. PLL Settings
Address
Register
Optimal
Setting
PLL SPI Control
Bit
1. Put the device in manual band select mode.
2. Sweep the VCO band over a range of bands that result in
the PLL being locked.
PLL Loop Bandwidth[1:0]
PLL Charge Pump Current[4:0]
PLL Cross Control Enable
0x0C
0x0C
0x0D
[ꢀ:6] 11
[4:0] 00001
[4]
1
3. For each band, verify that the PLL is locked and read the
PLL using the VCO control voltage (Register 0x0E[3:0]).
4. Select the band that results in the control voltage being
closest to the center of the range (that is, 0000 or 1000). See
Table 24 for more details. The resulting VCO band should
be the optimal setting for the device. Write this band to the
manual VCO band (Register 0x0A[5:0]) value.
5. If desired, an indication of where the VCO is within the
operating frequency band can be determined by querying
the VCO control voltage. Table 24 shows how to interpret
the PLL VCO control voltage (Register 0x0E, Bits[2:0]) value.
Configuring the VCO Tuning Band
The PLL VCO has a valid operating range from approximately
1.0 GHz to 2.1 GHz covered in 63 overlapping frequency bands.
For any desired VCO output frequency, there may be several
valid PLL band select values. The frequency bands of a typical
device are shown in Figure 63. Device-to-device variations and
operating temperature affect the actual band frequency range.
Therefore, it is required that the optimal PLL band select value
be determined for each individual device.
Automatic VCO Band Select
Table 24. VCO Control Voltage Range Indications
The device has an automatic VCO band select feature on chip.
Using the automatic VCO band select feature is a simple and
reliable method of configuring the VCO frequency band. This
feature is enabled by writing 0x80 to Register 0x0A. When this
value is written, the device executes an automated routine that
determines the optimal VCO band setting for the device. The
setting selected by the device ensures that the PLL remains
locked over the full −40°C to +85°C operating temperature
range of the device without further adjustment. (The PLL
remains locked over the full temperature range even if the
temperature during initialization is at one of the temperature
extremes.)
VCO Control Voltage
Indication
0111
0110
0101
0100
0011
0010
0001
0000
1000
1001
1010
1011
1100
1101
1110
1111
Move to higher VCO Band
VCO is operating in the higher end of
frequency band
VCO is operating within an optimal
region of the frequency band
VCO is operating in the lower end of
frequency band
0
4
8
12
16
20
24
28
32
36
40
44
48
52
56
60
Move to lower VCO Band
1000
1200
1400
1600
1800
2000
2200
VCO FREQUENCY (MHz)
Figure 63. PLL Lock Range Over Temperature for a Typical Device
Rev. 0 | Page 43 of 56
AD9122
ANALOG OUTPUTS
For nominal values of VREF (1.2 V), RSET (10 kꢀ), and DAC gain
(512), the full-scale current of the DAC is typically 20.16 mA.
The DAC full-scale current can be adjusted from 8.66 mA to
31.66 mA by setting the DAC gain parameter setting as shown
in Figure 65.
TRANSMIT DAC OPERATION
Figure 64 shows a simplified block diagram of the transmit path
DACs. The DAC core consists of a current source array, a switch
core, digital control logic, and full-scale output current control.
The DAC full-scale output current (IOUTFS) is nominally 20 mA.
The output currents from the IOUT1P/IOUT2P and IOUT1N/
IOUT2N pins are complementary, meaning that the sum of the
two currents always equals the full-scale current of the DAC.
The digital input code to the DAC determines the effective
differential current delivered to the load.
35
30
25
20
15
10
5
I DAC FS ADJUST
1.2V
REGISTER 0x40
IOUT1P
I DAC
5kΩ
IOUT1N
REFIO
CURRENT
SCALING
0.1µF
FSADJ
10kΩ
IOUT2N
IOUT2P
Q DAC
0
Q DAC FS ADJUST
REGISTER 0x44
0
200
400
600
800
1000
DAC GAIN CODE
Figure 64. Simplified Block Diagram of DAC Core
Figure 65. DAC Full-Scale Current vs. DAC Gain Code
The DAC has a 1.2 V band gap reference with an output impedance
of 5 kꢀ. The reference output voltage appears on the REFIO
pin. When using the internal reference, the REFIO pin should
be decoupled to AVSS with a 0.1 μF capacitor. Only use the internal
reference for external circuits that draw dc currents of 2 μA or
less. For dynamic loads or static loads greater than 2 μA, buffer
the REFIO pin. If desired, an external reference (between 1.10 V
and 1.30 V) can be applied to the REFIO pin. The internal
reference can either be overdriven or powered down by setting
Register 0x43, Bit [5].
Transmit DAC Transfer Function
The output currents from the IOUT1P/IOUT2P and IOUT1N/
IOUT2N pins are complementary, meaning that the sum of the
two currents always equals the full-scale current of the DAC.
The digital input code to the DAC determines the effective
differential current delivered to the load. IOUT1P/IOUT2P
provide maximum output current when all bits are high. The
output currents vs. DACCODE for the DAC outputs are
expressed as
DACCODE
⎡
⎤
A 10 kꢀ external resistor, RSET, must be connected from the
IOUTP
=
× IOUTFS
(1)
(2)
2N
⎢
⎣
⎥
⎦
RESET
pin to AVSS. This resistor, along with the reference
control amplifier, sets up the correct internal bias currents for
the DAC. Because the full-scale current is inversely proportional
to this resistor, the tolerance of RSET is reflected in the full-scale
output amplitude.
IOUTN = IOUTFS − IOUTP
where DACCODE = 0 to 2N − 1.
Transmit DAC Output Configurations
The optimum noise and distortion performance of the AD9122
is realized when it is configured for differential operation. The
common-mode error sources of the DAC outputs are significantly
reduced by the common-mode rejection of a transformer or
differential amplifier. These common-mode error sources include
even-order distortion products and noise. The enhancement in
distortion performance becomes more significant as the frequency
content of the reconstructed waveform increases and/or its
amplitude increases. This is due to the first-order cancellation
of various dynamic common-mode distortion mechanisms,
digital feedthrough, and noise.
The full-scale current equation, where the DAC gain is set
individually for the I and Q DACs in Register 040 and Register 044,
respectively, follows:
VREF
3
⎛
⎞
⎟
⎛
⎜
⎝
⎞
⎟
⎠
IFS
=
× 72 +
× DAC gain
⎜
RSET
16
⎝
⎠
Rev. 0 | Page 44 of 56
AD9122
–60
–65
–70
–75
–80
–85
–90
Figure 66 shows the most basic DAC output circuitry. A pair of
resistors, RO, is used to convert each of the complementary output
currents to a differential voltage output, VOUT. Because the current
outputs of the DAC are high impedance, the differential driving
point impedance of the DAC outputs, ROUT, is equal to 2 × RO.
Figure 67 illustrates the output voltage waveforms.
10mA
20mA
30mA
V
+
IP
IOUT1P
R
O
V
OUTI
–
R
O
V
IN
IOUT1N
0
0.2
0.4
0.6
V
0.8
(V)
1.0
1.2
1.4
V
+
QP
V
IOUT2P
CMD
R
O
Figure 68. IMD vs. Output Common-Mode Voltage (fOUT = 61 MHz,
RLOAD = 50 Ω differential, IFS = 10 mA, 20 mA, and 30 mA)
OUTQ
R
O
–50
V
–
QN
10mA
IOUT2N
20mA
–55
30mA
Figure 66. Basic Transmit DAC Output Circuit
V
PEAK
–60
–65
–70
–75
–80
–85
V
CM
0
V
V
P
N
V
OUT
–V
PEAK
Figure 67. Voltage Output Waveforms
0
0.2
0.4
0.6
V
0.8
(V)
1.0
1.2
1.4
CMD
The common-mode signal voltage, VCM, is calculated as
Figure 69. IMD vs. Output Common-Mode Voltage (fOUT = 161 MHz,
RLOAD = 50 Ω differential, IFS = 10 mA, 20 mA, and 30 mA)
IFS
2
VCM
=
× RO
AUXILIARY DAC OPERATION
The peak output voltage, VPEAK, is calculated as
PEAK = IFS × RO
The AD9122 have two auxiliary DACs, one associated with the
I path and one associated with the Q path. These auxiliary DACs
can be used to compensate for dc offsets in the transmitted signal.
Each auxiliary DAC has a single-ended current that can sink or
source current into either the P or N output of the associated
transmit DAC. The auxiliary DAC structure is shown in Figure 70.
V
With this circuit configuration, the single-ended peak voltage is
the same as the peak differential output voltage.
Transmit DAC Linear Output Signal Swing
To achieve optimum performance, the DAC outputs have a linear
output compliance voltage range that must be adhered to. The
linear output signal swing is dependent on the full-scale output
current, IOUTFS, and the common-mode level of the output.
Figure 68 and Figure 69 show the IMD performance vs. the
common-mode voltage at the different full-scale currents and
output frequencies.
V
B
AUXDAC[4:0]
AUXDAC
DIRECTION
AUXDAC
SIGN
IOUTP
IOUTN
I DAC
Figure 70. Auxiliary DAC Structure
Rev. 0 | Page 45 of 56
AD9122
The control registers for controlling the I and Q auxiliary DACs
are in Register 0x42, Register 0x43, and Register 0x46.
Figure 73 shows a fifth-order, low-pass filter. A common-mode
choke is used between the I-V resistors and the remainder of
the filter. This removes the common-mode signal produced by
the DAC and prevents the common-mode signal from being
converted to a differential signal, which can appear as unwanted
spurious signals in the output spectrum. Splitting the first filter
capacitor into two and grounding the center point creates a
common-mode low-pass filter, providing additional common-
mode rejection of high frequency signals. A purely differential
filter can pass common-mode signals.
Interfacing to Modulators
The AD9122 interfaces to the ADL537x family of modulators
with a minimal number of components. An example of the
recommended interface circuitry is shown in Figure 71.
The baseband inputs of the ADL537x family require a dc bias
of 500 mV. The nominal midscale output current on each output
of the DAC is 10 mA (½ the full-scale current). Therefore, a
single 50 Ω resistor to ground from each of the DAC outputs
results in the desired 500 mV dc common-mode bias for the
inputs to the ADL537x. The signal level can be reduced through
the addition of the load resistor in parallel with the modulator
inputs. The peak-to-peak voltage swing of the transmitted signal is
DRIVING THE ADL5375-15
The ADL5375-15 requires a 1500 mV dc bias and, therefore,
requires a slightly more complex interface than most other
Analog Devices, Inc, modulators. It is necessary to level shift
the DAC output from a 500 mV dc bias to the 1500 mV dc bias
that the ADL5375-15 requires. Level shifting can be achieved
with a purely passive network, as shown in Figure 72. In this
network, the dc bias of the DAC remains at 500 mV while the
input to the ADL5375-15 is 1500 mV. This passive, level shifting
network introduces approximately 2 dB of loss in the ac signal.
[
2×RB ×RL
]
]
VSIGNAL = IFS
×
[2×RB + RL
AD9122
ADL537x
IBBP
67
IOUT1P
RBIP
50Ω
RLI
100Ω
RBIN
50Ω
AD9122
ADL5375-15
IBBP
RSIN
1kΩ
66
59
67
21
IOUT1N
IOUT2N
IBBN
IOUT1P
RBIP
45.3Ω
RLIP
3480Ω
5V
QBBN
RBIN
45.3Ω
RLIN
3480Ω
RSIP
1kΩ
66
59
22
RBQN
50Ω
IOUT1N
IOUT2N
IBBN
RLQ
100Ω
RBQP
50Ω
RSQN
1kΩ
58
9
IOUT2P
QBBP
QBBN
RBQN
45.3Ω
RLQN
3480Ω
5V
10
Figure 71. Typical Interface Circuitry Between the AD9122 and the ADL537x
Family of Modulators
RBQP
45.3Ω
RLQP
3480Ω
RSQP
1kΩ
58
IOUT2P
QBBP
BASEBAND FILTER IMPLEMENTATION
Figure 72. Passive, Level Shifting Network for Biasing ADL5375-15
Most applications require a baseband anti-imaging filter between
the DAC and the modulator to filter out Nyquist images and
broadband DAC noise. The filter can be inserted between the
I-V resistors at the DAC output and the signal-level setting resistor
across the modulator input. Doing this establishes the input and
output impedances for the filter.
22pF
56nH
50Ω
3pF
33nH
2pF
6pF
3pF
140Ω ADL537x
AD9122
33nH
56nH
50Ω
22pF
Figure 73. DAC Modulator Interface with Fifth-Order, Low Pass Filter
Rev. 0 | Page 46 of 56
AD9122
The disadvantage is that the common-mode level of the output
signal changes as a function of the auxiliary DAC current. The
opposite is true when the digital offset adjustment is used.
REDUCING LO LEAKAGE AND UNWANTED
SIDEBANDS
Analog quadrature modulators can introduce unwanted signals at
the LO frequency due to dc offset voltages in the I and Q baseband
inputs, as well as feedthrough paths from the LO input to the
output. The LO feedthrough can be nulled by applying the correct
dc offset voltages at the DAC output. This can be done using the
auxiliary DACs (Register 0x42, Register 0x43, Register 0x46, and
Register 0x47) or by using the digital dc offset adjustments
(Register 0x3C through Register 0x3F). The advantage of using
the auxiliary DACs is that none of the main DAC dynamic
range is used to perform the dc offset adjustment.
Good sideband suppression requires both gain and phase
matching of the I and Q signals. The I/Q phase adjust
(Register 0x38 through Register 0x3B) and DAC FS adjust
(Register 0x40 and Register 0x44) registers can be used to
calibrate I and Q transmit paths to optimize the sideband
suppression.
Rev. 0 | Page 4ꢀ of 56
AD9122
DEVICE POWER DISSIPATION
1700
1500
1300
1100
900
1×
2×
4×
8×
The AD9122 has four supply rails: AVDD33, IOVDD, DVDD18,
and CVDD18.
The AVDD33 supply powers the DAC core circuitry. The power
dissipation of the AVDD33 supply rail is independent of the digital
operating mode and sample rate. The current drawn from the
AVDD33 supply rail is typically 57 mA (188 mW) when the
full-scale current of the I and Q DACs is set to the nominal value
of 20 mA. Changing the full-scale current directly impacts the
supply current drawn from the AVDD33 rail. For example, if
the full-scale current of the I DAC and the Q DAC is changed to
10 mA, the AVDD33 supply current drops by 20 mA to 37 mA.
700
500
300
100
RESET
The IOVDD voltage supplies the serial port I/O pins, the
IRQ
0
50
100
150
200
250
300
pin, and the
pin. The voltage applied to the IOVDD pin
fDATA (MHz)
can range from 1.8 V to 2.8 V. The current drawn by the
IOVDD supply pin is typically 3 mA.
Figure 74. Total Power Dissipation vs. fDATA Without PLL, Fine NCO, and
Inverse Sinc
1200
1×
The DVDD18 supply powers all of the digital signal processing
blocks of the device. The power consumption from this supply
is a function of which digital blocks are enabled and the frequency
at which the device is operating.
2×
4×
1000
8×
800
600
400
200
0
The CVDD18 supply powers the clock receiver and clock
distribution circuitry. The power consumption from this
supply varies directly with the operating frequency of the
device. CVDD18 also powers the PLL. The power dissipation
of the PLL is typically 80 mA when enabled.
Figure 74 through Figure 78 detail the power dissipation of the
AD9122 under a variety of operating conditions. All of the graphs
are taken with data being supplied to both the I and Q channels.
The power consumption of the device does not vary significantly
with changes in the coarse modulation mode selected or analog
output frequency. Graphs of the total power dissipation are shown
along with the power dissipation of the DVDD18 and CVDD18
supplies.
0
50
100
150
200
250
300
fDATA (MHz)
Figure 75. DVDD18 Power Dissipation vs. fDATA Without Fine NCO and
Inverse Sinc
250
1×
2×
4×
8×
Maximum power dissipation can be estimated to be 20% higher
than the typical power dissipation.
200
150
100
50
0
0
50
100
150
200
250
300
fDATA (MHz)
Figure 76. CVDD18 Power Dissipation vs. fDATA with PLL Disabled
Rev. 0 | Page 48 of 56
AD9122
300
250
200
150
100
50
TEMPERATURE SENSOR
The AD9122 has a diode-based temperature sensor for measuring
the temperature of the die. The temperature reading is accessed
through Register 0x49 and Register 0x4A. The temperature of
the die can be calculated by
(DieTemp[15 : 0]− 47,925)
TDIE
=
88
where TDIE is the die temperature in oC. The temperature
accuracy is 5oC typical.
Estimates of the ambient temperature can be made if the power
dissipation of the device is known. For example, if the device power
dissipation is 800 mW, and the measured die temperature is 50oC,
then the ambient temperature can be calculated as
0
0
200
400
600
800
100
1200
fDAC (MHz)
Figure 77. DVDD18 Power Dissipation vs. fDAC Due to Inverse Sinc Filter
TA = TDIE – PD × TJA = 50 – 0.8 × 20.7 = 33.4°C
300
1×
where:
2×, 4×, 8×
TA is the ambient temperature in oC.
TJA is the thermal resistance from junction to ambient of the
AD9122, as shown in Table 7.
250
200
150
100
50
To use the temperature sensor, it must be enabled by setting
Register 0x01, Bit 4 to 0. In addition, to obtain accurate readings,
the range control register (Register 0x48) should be set to 0x02.
0
50
100
150
200
250
300
fDATA (MHz)
Figure 78. DVDD18 Power Dissipation vs. fDATA Due to Fine NCO
Rev. 0 | Page 49 of 56
AD9122
MULTICHIP SYNCHRONIZATION
System demands may require that the outputs of multiple DACs
be synchronized with each other or with a system clock. Systems
that support transmit diversity or beam forming, where multiple
antennas are used to transmit a correlated signal, require multiple
DAC outputs to be phase aligned with each other. Systems with
a time division multiplexing transmit chain may require one or
more DACs to be synchronized with a system-level reference clock.
SYNCHRONIZATION WITH CLOCK MULTIPLICATION
When using the clock multiplier to generate the DAC sample
rate clock, the REFCLK input signal acts as both the reference
clock for the PLL-based clock multiplier and as the synchronization
signal. To synchronize devices, distribute the REFCLK signal
with low skew to all of the devices that need to be synchronized.
Skew between the REFCLK signals of the different devices
shows up directly as a timing mismatch at the DAC outputs.
Multiple devices are considered synchronized to each other when
the state of the clock generation state machines is identical for all
parts, and when time aligned data is being read from the FIFOs
of all parts simultaneously. Devices are considered synchronized
to a system clock when there is a fixed and known relationship
between the clock generation state machine and the data being
read from the FIFO and a particular clock edge of the system
clock. The AD9122 has provisions for enabling multiple devices
to be synchronized to each other or to a system clock.
The frequency of the REFCLK signal is typically equal to the
input data rate. The FRAME and DCI signals can be created
in the FPGA along with the data. A circuit diagram of a typical
configuration is shown in Figure 79.
MATCHED
LENGTH TRACES
REFCLKP/
REFCLKN
IOUT1P/
IOUT1N
FRAMEP/
FRAMEN
DCIP/
DCIN
The AD9122 supports synchronization in two different modes,
data rate mode and FIFO rate mode. The lowest rate clock that
the synchronization logic attempts to synchronize to distinguishes
these two modes. In data rate mode, the input data rate represents
the lowest synchronized clock. In FIFO rate mode, the FIFO
rate, which is the data rate divided by the FIFO depth of 8,
represents the lowest rate clock. The advantage of FIFO rate
synchronization is increased time between keep-out windows
for DCI changes relative to the DACCLK or REFCLK input.
SYSTEM
CLOCK
LOW SKEW
CLOCK DRIVER
REFCLKP/
REFCLKN
IOUT2P/
IOUT2N
FRAMEP/
FRAMEN
DCIP/
DCIN
FPGA
Figure 79. Typical Circuit Diagram for Synchronizing Devices
The Procedure for Synchronization when Using the PLL section
outlines the steps required to synchronize multiple devices. The
procedure assumes that the REFCLK signal is applied to all of the
devices, and that the PLL of each device is phase locked to it. The
following procedure must be carried out on each individual device.
When in data rate mode, the elasticity of the FIFO is not used to
absorb timing variations between the data source and the DAC,
resulting in keep-out widows repeating at the input data rate.
The method chosen for providing the DAC sampling clock directly
impacts the synchronization methods available. When the device
clock multiplier is used, only data rate mode is available. When
the DAC sampling clock is sourced directly, both data rate
mode and FIFO rate mode synchronization is available. The
following sections detail the synchronization methods for
enabling both clocking modes and querying the status of the
synchronization logic.
Procedure for Synchronization when Using the PLL
Configure for data rate, periodic synchronization by writing
0xC0 to the sync control register (Register 0x10). Additional
synchronization options are available.
Read the sync status register (Register 0x12) and verify that
the sync locked bit (Bit 6) is set high, indicating that the device
achieved back-end synchronization and that the sync lost bit
(Bit 7) is low. These levels indicate that the clocks are running with
a constant and known phase relative to the sync signal.
Reset the FIFO by strobing the FRAME signal high for the time
required to write two complete input data words. Resetting the
FIFO ensures that the correct data is being read from the FIFO.
This completes the synchronization procedure, and at this stage,
all devices should be synchronized.
Rev. 0 | Page 50 of 56
AD9122
tSKEW
REFCLKP(1)/
REFCLKN(1)
REFCLKP(2)/
REFCLKN(2)
tSU_DCI tH_DCI
DCIP(2)/
DCIN(2)
FRAMEP(2)/
FRAMEN(2)
Figure 80. Timing Diagram Required for Synchronizing Devices
DACCLKP/
DACCLKN
REFCLKP/
REFCLKN
FRAMEP/
FREMEN
IOUT1P/
IOUT1N
DCIP/
DCIN
SAMPLE
RATE CLOCK
LOW SKEW
CLOCK DRIVER
MATCHED
LENGTH TRACES
DACCLKP/
DACCLKN
REFCLKP/
REFCLKN
FRAMEP/
FREMEN
DCIP/
DCIN
IOUT2P/
IOUT2N
SYNC
CLOCK
LOW SKEW
CLOCK DRIVER
FPGA
Figure 81. Typical Circuit Diagram for Synchronizing Devices to a System Clock
To maintain synchronization, the skew between the REFCLK
signals of the devices must be less than tSKEW nanoseconds. There is
also a setup-and-hold time to be observed between the DCI and
data of each device and the REFCLK signal. When resetting the
FIFO, the FRAME signal must be held high for the time interval
required to write two complete input data words. A timing
diagram of the input signals is shown in Figure 80.
to a master clock, then use the master clock directly for generating
the REFCLK input (see Figure 81).
DATA RATE MODE SYNCHRONIZATION
The Procedure for Data Rate Synchronization when Directly
Sourcing the DAC Sampling Clock section outlines the steps
required to synchronize multiple devices in data rate mode. The
procedure assumes that the DACCLK and REFCLK signals are
applied to all of the devices. The procedure must be carried out
on each individual device.
The preceding example shows a REFCLK frequency equal to
the data rate. While this is the most common situation, it is not
strictly required for proper synchronization. Any REFCLK
frequency that satisfies the following equation is acceptable.
Procedure for Data Rate Synchronization when Directly
Sourcing the DAC Sampling Clock
f
SYNC_I = fDACCLK/2N and fSYNC_I ≤ fDATA
Configure for data rate, periodic synchronization by writing
0xC0 to the sync control register (Register 0x10). Additional
synchronization options are available and are described in the
Additional Synchronization Features section.
where N = 0, 1, 2, or 3.
As an example, a configuration with 4× interpolation and clock
frequencies of fVCO = 1600 MHz, fDACCLK = 800 MHz, fDATA
=
200 MHz, and fSYNC_I = 100 MHz is a viable solution.
Poll the sync locked bit (Register 0x12, Bit 6) to verify that the
device is back-end synchronized. A high level on this bit indicates
that the clocks are running with a constant and known phase
relative to the sync signal.
SYNCHRONIZATION WITH DIRECT CLOCKING
When directly sourcing the DAC sample rate clock, a separate
REFCLK input signal is required for synchronization. To
synchronize devices, the DACCLK signal and the REFCLK
signal must be distributed with low skew to all of the devices
being synchronized. If the devices need to be synchronized
Reset the FIFO by strobing the FRAME signal high for the time
interval required to input two complete data input words. Resetting
the FIFO ensures that the correct data is being read from the
FIFO of each of the devices simultaneously.
Rev. 0 | Page 51 of 56
AD9122
This completes the synchronization procedure, and at this stage,
all devices should be synchronized.
Poll the sync locked bit (Register 0x12, Bit[6]) to verify that the
device is back-end synchronized. A high level on this bit indicates
that the clocks are running with a constant and known phase
relative to the sync signal.
To ensure that each of the DACs are updated with the correct
data on the same CLK edge, two timing relationships must be
met on each DAC. DCIP/DCIN and D[15:0]P/D[15:0]N must
meet the setup-and-hold times with respect to the rising edge of
DACCLK, and REFCLK must also meet the setup-and-hold time
with respect to the rising edge of DACCLK. When resetting the
FIFO, the FRAME signal must be held high the time required to
input two complete data input words. When these conditions are
met, the outputs of the DACs are updated within tSKEW + tOUTDLY
nanoseconds of each other. A timing diagram that illustrates the
timing requirements of the input signals is shown in Figure 82.
tSKEW
Reset the FIFO by strobing the FRAME signal high for the time
required to input to complete input words. Resetting the FIFO
ensures that the correct data is being read from the FIFO of
each of the devices simultaneously.
This completes the synchronization procedure, and at this stage,
all devices should be synchronized.
To ensure that each of the DACs are updated with the correct
data on the same CLK edge, two timing relationships must be
met on each DAC. DCIP/DCIN and D[15:0]P/D[15:0]N must
meet the setup-and-hold times with respect to the rising edge of
DACCLK, and REFCLK must also meet the setup-and-hold
time with respect to the rising edge of DACCLK. When resetting
the FIFO, the FRAME signal must be held high for at least three
data periods (that is, 1.5 cycles of DCI). When these conditions
are met, the outputs of the DACs are updated within tSKEW + tOUTDLY
nanoseconds of each other. A timing diagram that illustrates the
timing requirements of the input signals is shown in Figure 83.
tSKEW
DACCLKP(1)/
DACCLKN(1)
DACCLKP(2)/
DACCLKN(2)
tSU_SYNC tH_SYNC
REFCLKP(2)/
REFCLKN(2)
tSU_DCI tH_DCI
DCIP(2)/
DCIN(2)
FRAMEP(2)/
FRAMEN(3)
DACCLKP(1)/
DACCLKN(1)
Figure 82. Data Rate Synchronization Signal Timing Requirements,
2x Interpolation
DACCLKP(2)/
DACCLKN(2)
tSU_SYNC tH_SYNC
Figure 82 shows the synchronization signal timing with 2×
interpolation; therefore, fDCI = ½ × fCLK. The REFCLK input is
shown to be equal to the data rate. The maximum frequency at
which the device can be resynchronized in data rate mode can
be expressed as
REFCLKP(2)/
REFCLKN(2)
DCIP(2)/
DCIN(2)
FRAMEP(2)/
FRAMEN(2)
f
SYNC_I = fDATA/2N
where N is any nonnegative integer.
Figure 83. FIFO Rate Synchronization Signal Timing Requirements,
2× Interpolation
Generally, for values of N equal to or greater than 3, select the
FIFO rate synchronization mode.
Figure 83 shows the synchronization signal timing with 2×
interpolation; therefore, fDCI = ½ × fCLK. The REFCLK input is
shown to be equal to the FIFO rate. More generally, the maximum
frequency at which the device can be resynchronized in FIFO
rate mode can be expressed as
FIFO RATE MODE SYNCHRONIZATION
The Procedure for FIFO Rate Synchronization when Directly
Sourcing the DAC Sampling Clock section outlines the steps
required to synchronize multiple devices in FIFO rate mode.
The procedure assumes that the REFCLK and DACCLK signals
are applied to all of the devices. The procedure must be carried
out on each individual device.
f
SYNC_I = (fDATA/8 × 2N)
where N is any nonnegative integer.
ADDITIONAL SYNCHRONIZATION FEATURES
Procedure for FIFO Rate Synchronization when Directly
Sourcing the DAC Sampling Clock
The synchronization logic incorporates additional features that
provide means for querying the status of the synchronization,
improving the robustness of the synchronization, and a one shot
synchronization mode. These features are detailed in the Sync
Status Bits and Timing Optimization sections that follow.
Configure for FIFO rate, periodic synchronization by writing
0x80 to the sync control register (Register 0x10). Additional
synchronization options are available and are described in the
Additional Synchronization Features section.
Rev. 0 | Page 52 of 56
AD9122
Sync Status Bits
The synchronization logic resynchronizes when a phase change
between the REFCLK signal and the state of the clock generation
state machine exceeds a threshold. To mitigate the effects of
jitter and prevent erroneous resynchronizations, the relative
phase can be averaged. The amount of averaging is set by the
sync averaging bits (Register 0x10, Bits[2:0]) and can be set
from 1 to 128. The higher the number of averages, the more
slowly the device recognizes and resynchronizes to a legitimate
phase correction. Generally, the averaging should be made as large
as possible while still meeting the allotted resynchronization
time interval.
When the sync locked bit (Register 0x12, Bit 6) is set, it indicates
that the synchronization logic has reached alignment. This
alignment is determined when the clock generation state machine
phase is constant. It takes between (11 + averaging) × 64 and
(11 + averaging) × 128 DACCLK cycles. This bit may optionally
IRQ
trigger an
section.
as described in the Interrupt Request Operation
When the sync lost bit (Register 0x12, Bit 7) is set, it indicates
a previously synchronized device has lost alignment. This bit is
latched and remains set until cleared by overwriting the register.
The sync phase request bits value (Register 0x11, Bits[5:0]) is
the state to which the clock generation state machine resets upon
initialization. By varying this value, the timing of the internal
clocks, with respect to the REFCLK signal, can be adjusted.
Every increment of the Sync Phase Request[5:0] (Register 0x11,
Bits[5:0]) value advances the internal clocks by one DACCLK
period. This offset can be used for two purposes: to skew the
outputs of two synchronized DAC outputs in increments of the
DACCLK period and to change the relative timing between the
DCI input and REFCLK. This may allow for a more optimal place-
ment of the DCI sampling point in data rate synchronization mode.
IRQ
This bit may optionally trigger an
Interrupt Request Operation section.
as described in the
The sync phase readback bits (Register 0x13, Bits[7:0]) report
the current clock phase in a 6.2 format. Bits[7:2] report which
of the 64 states (0 to 63) the clock is currently in. When averaging
is enabled, Bits[1:0] provide ¼ state accuracy (for 0, ¼, ½, ¾).
The lower two bits give an indication of the timing margin issues
that may exist. If the sync sampling is error free, the fractional
clock state should be 00.
Timing Optimization
The REFCLK signal is sampled by a version of the DACCLK. If
sampling errors are being detected, the opposite sampling edge
can be selected to improve the sampling point. The sampling
edge can be selected by setting Register 0x10, Bit 3 (1 = rising
and 0 = falling).
Table 25. Synchronization Setup and Hold Times
Parameter
Min
Max
Unit
ps
ps
tSKEW
tSV_SYNC
TH_SYNC
−tDACCLK/2
100
330
+tDACCLK/2
ps
Rev. 0 | Page 53 of 56
AD9122
INTERRUPT REQUEST OPERATION
The AD9122 provides an interrupt request output signal (on
The latched version of an event flag (the interupt_source signal)
can be cleared in two ways. The recommended way is by writing
1 to the corresponding event flag bit. A hardware or software
reset also clears the interupt_source.
IRQ
Pin 7,
) that can be used to notify an external host processor
of significant device events. Upon assertion of the interrupt,
the device should be queried to determine the precise event that
IRQ
occurred. The
pin is an open-drain, active low output. Pull
INTERRUPT SERVICE ROUTINE
IRQ
the
pin high external to the device. This pin can be tied to
the interrupt pins of other devices with open-drain outputs to
wired-OR these pins together.
Interrupt request management starts by selecting the set of event
flags that require host intervention or monitoring. Those events
that require host action should be enabled so that the host is
notified when they occur. For events requiring host intervention,
Sixteen different event flags provide visibility into the device.
These 16 flags are located in the two event flag registers
(Register 0x06 and Register 0x07). The behavior of each of the
event flags is independently selected in the interrupt enable
registers (Register 0x04 and Register 0x05). When the flag
interrupt enable is active, the event flag latches and triggers an
external interrupt. When the flag interrupt is disabled, the event
IRQ
upon
activation, run the following routine to clear an
interrupt request:
1. Read the status of the event flag bits that are being
monitored.
2. Set the interupt enable bit low so that the unlatched
event_flag_source can be monitored directly.
3. Perform any actions that may be required to clear the
event_source_flag. In many cases, no specific actions may
be required.
IRQ
flag simply monitors the source signal and the external
remains inactive.
IRQ
Figure 84 shows the
-related circuitry. This diagram shows
IRQ
how the event flag signals propagate to the
output. The
4. Read the event flag to verify the actions taken have cleared
the event_flag_source.
5. Clear the interrupt by writing 1 to the event flag bit.
6. Set the interupt enable bits of the events to be monitored.
interupt_enable signal represents one bit from the interrupt
enable register. The event_flag_source signal represents one bit
from the event flag register. The event_flag_source signal
represents one of the device signals that can be monitored such
as the PLL_locked signal from the PLL phase detector or the
FIFO Warning 1 signal from the FIFO controller.
Note that some of the event_flag_source signals are latched signals.
These are cleared by writing to the corresponding event flag bit.
Details of each of the event flags can be found in Table 11.
When an interrupt enable bit is set high, the corresponding event
flag bit reflects a positively tripped (that is, latched on the rising
edge of the event_flag_source version of the event_flag_source
IRQ
signal. This signal also asserts the external
. When an
interrupt enable bit is set low, the event flag bit reflects the
current status of the event_flag_source signal, and the event flag
IRQ
has no effect on the external
.
0
1
EVENT_FLAG
IRQ
INTERRUPT
SOURCE
INTERRUPT_ENABLE
OTHER
INTERRUPT
SOURCES
EVENT_FLAG_SOURCE
WRITE_1_TO_EVENT_FLAG
DEVICE_RESET
IRQ
Figure 84. Simplified Schematic of
Circuitry
Rev. 0 | Page 54 of 56
AD9122
INTERFACE TIMING VALIDATION
The AD9122 provides on-chip sample error detection (SED)
circuitry that simplifies verification of the input data interface.
The SED compares the input data samples captured at the digital
input pins with a set of comparison values. The comparison values
are loaded into registers through the SPI port. Differences between
the captured values and the comparison values are detected and
stored. Options are available for customizing SED test sequencing
and error handling.
The sample error, compare pass, and compare fail flags can be
IRQ
configured to trigger an
when active, if desired. This is
done by enabling the appropriate bits in the event flag register
(Register 0x07).
Table 26 shows a progression of the input sample comparison
results and the corresponding states of the error flags.
SED EXAMPLE
Normal Operation
SED OPERATION
The following example illustrates the SED configuration for
continuously monitoring the input data and assertion of an
when a single error is detected.
The SED circuitry operates on a data set made up of four 16-bit
input words, denoted as I0, Q0, I1, and Q1. To properly align
the input samples, the first I and Q data-words (that is, I0 and
Q0) are indicated by asserting the FRAME signal for a
minimum of two complete input samples.
IRQ
1. Write to the following registers to enable the SED and load
the comparison values.
Register 0x67 → 0x80
Register 0x68 → I0[7:0]
Register 0x69 → I0[15:8]
Register 0x6A → Q0[7:0]
Register 0x6B → Q0[15:8]
Register 0x6C → I1[7:0]
Figure 85 shows the input timing of the interface in word mode.
The FRAME signal can be issued once at the start of the data
transmission, or it can be asserted repeatedly at intervals coinciding
with the I0 and Q0 data-words.
FRAME
Register 0x6D → I1[15:8]
Register 0x6E → Q1[7:0]
DATA[15:0]
I0
Q0
I1
Q1
I0
Q0
Register 0x6F → Q1[15:8]
Figure 85. Timing Diagram of Extended FRAME Signal Required to Align
Input Data for SED
Comparison values can be chosen arbitrarily; however,
choosing values that require frequent bit toggling provides
the most robust test.
The SED has three flag bits (Register 0x67, Bit 0, Bit 1, and
Bit 5) that indicate the results of the input sample comparisons.
The sample error detected bit (Register 0x67, Bit 5) is set when
an error is detected and remains set until cleared. The SED also
provides registers that indicate which input data bits experienced
errors (Register 0x70 through Register 0x73). These bits are
latched and indicate the accumulated errors detected until cleared.
IRQ
2. Enable the SED error detect flag to assert the
Register 0x05 → 0x04
3. Begin transmitting the input data pattern.
pin.
IRQ
If
is asserted, read Register 0x67 and Register 0x70 through
Register 0x73 to verify that a SED error was detected and determine
which input bits were in error. The bits in Register 0x70 through
Register 0x73 are latched; therefore, the bits indicate any errors
that occurred on those bits throughout the test and not just the
errors that caused the error detected flag to be set.
The autoclear mode has two effects: it activates the compare fail
bit and the compare pass bit (Register 0x67, Bit 1 and Bit 0) and
changes the behavior of Register 0x70 through Register 0x73. The
compare pass bit sets if the last comparison indicated the
sample was error free. The compare fail bit sets if an error is
detected. The compare fail bit is automatically cleared by the
reception of eight consecutive error-free comparisons. When
autoclear mode is enabled, Register 0x70 through Register 0x73
accumulate errors as previously described but reset to all 0s after
eight consecutive error-free sample comparisons are made.
Table 26. Progression of Comparison Outcomes and the Resulting SED Register Values
Compare Results (Pass/Fail)
P
0
0
1
F
1
1
0
F
1
1
0
F
1
1
0
P
1
1
1
P
1
1
1
P
1
1
1
P
1
1
1
P
1
1
1
P
1
1
1
P
1
1
1
P
1
1
1
P
1
0
1
F
1
1
0
P
1
1
1
F
1
1
0
Register 0x6ꢀ, Bit 5 (Sample Error Detected)
Register 0x6ꢀ, Bit 1 (Compare Fail)
Register 0x6ꢀ, Bit 0 (Compare Pass)
Register 0xꢀ0 to Register 0xꢀ3
(Errors Detected x_BITS[15:0])
Z1 N2 N2 N2 N2 N2 N2 N2 N2 N2 N2 N2 Z1 N2 N2 N2
1 Z = all 0s.
2 N = nonzero.
Rev. 0 | Page 55 of 56
AD9122
OUTLINE DIMENSIONS
0.60
0.42
0.24
10.00
BSC SQ
0.60
0.42
0.24
PIN 1
INDICATOR
55
54
72
1
PIN 1
INDICATOR
0.50
BSC
9.75
BSC SQ
6.15
6.00 SQ
5.85
TOP VIEW
EXPOSED PAD
(BOTTOM VIEW)
0.50
0.40
0.30
18
37
36
19
0.80 MAX
0.65 TYP
12° MAX
1.00
0.85
0.80
8.50 REF
0.05 MAX
0.02 NOM
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
COPLANARITY
0.08
0.30
0.23
0.18
SEATING
PLANE
0.20 REF
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4
Figure 86. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
10 mm × 10 mm Body, Very Thin Quad
(CP-72-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD9122BCPZ1
AD9122BCPZRL1
AD9122-M53ꢀ2-EBZ1
AD9122-M53ꢀ5-EBZ1
Temperature Range
Package Description
Package Option
CP-ꢀ2-ꢀ
CP-ꢀ2-ꢀ
−40°C to +85°C
−40°C to +85°C
ꢀ2-lead LFCSP_VQ
ꢀ2-lead LFCSP_VQ
Evaluation Board Connected to ADL53ꢀ2 Modulator
Evaluation Board Connected to ADL53ꢀ5 Modulator
1Z = RoHS Compliant Part.
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08281-0-9/09(0)
Rev. 0 | Page 56 of 56
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