AD974 [ADI]

4-Channel, 16-Bit, 200 kSPS Data Acquisition System; 4通道, 16位, 200 kSPS的数据采集系统
AD974
型号: AD974
厂家: ADI    ADI
描述:

4-Channel, 16-Bit, 200 kSPS Data Acquisition System
4通道, 16位, 200 kSPS的数据采集系统

文件: 总20页 (文件大小:205K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
4-Channel, 16-Bit, 200 kSPS  
Data Acquisition System  
a
AD974  
FUNCTIONAL BLOCK DIAGRAM  
FEATURES  
Fast 16-Bit ADC with 200 kSPS Throughput  
Four Single-Ended Analog Input Channels  
Single +5 V Supply Operation  
Input Ranges: 0 V to +4 V, 0 V to +5 V and ؎10 V  
120 mW Max Power Dissipation  
Power-Down Mode 50 W  
Choice of External or Internal 2.5 V Reference  
On-Chip Clock  
Power-Down Mode  
V
V
REF  
PWRD  
CAP  
DIG  
ANA  
BIP  
REF  
BUFF  
2.5V  
REFERENCE  
V1A  
V1B  
RESISTIVE  
NETWORK  
AD974  
EXT/INT  
DATACLK  
DATA  
V2A  
V2B  
RESISTIVE  
NETWORK  
16  
SWITCHED  
CAP ADC  
4 TO 1  
MUX  
+
SERIAL  
INTERFACE  
R/C  
V3A  
V3B  
RESISTIVE  
NETWORK  
LATCH  
CS  
CLOCK  
SYNC  
V4A  
V4B  
EN  
RESISTIVE  
NETWORK  
CONTROL LOGIC  
&
CALIBRATION CIRCUITRY  
GENERAL DESCRIPTION  
The AD974 is a four-channel, data acquisition system with a  
serial interface. The part contains an input multiplexer, a high-  
speed 16-bit sampling ADC and a +2.5 V reference. All of this  
operates from a single +5 V power supply that also has a power-  
down mode. The part will accommodate 0 V to +4 V, 0 V to  
+5 V or ±10 V analog input ranges.  
A0 A1  
BUSY  
AGND1 AGND2  
WR1  
WR2  
DGND  
PRODUCT HIGHLIGHTS  
1. The AD974 is a complete data acquisition system combining  
a four-channel multiplexer, a 16-bit sampling ADC and a  
+2.5 V reference on a single chip.  
The interface is designed for an efficient transfer of data while  
requiring a low number of interconnects.  
The AD974 is comprehensively tested for ac parameters such as  
SNR and THD, as well as the more traditional parameters of  
offset, gain and linearity.  
2. The part operates from a single +5 V supply and also has a  
power-down feature.  
3. Interfacing to the AD974 is simple with a low number of  
interconnect signals.  
The AD974 is fabricated on Analog Devices’ BiCMOS process,  
which has high performance bipolar devices along with CMOS  
transistors.  
4. The AD974 is comprehensively specified for ac parameters  
such as SNR and THD, as well as dc parameters such as  
linearity and offset and gain errors.  
The AD974 is available in 28-lead DIP, SOIC and SSOP  
packages.  
REV. A  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, nor for any infringements of patents or other rights of third parties  
which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
World Wide Web Site: http://www.analog.com  
© Analog Devices, Inc., 1999  
(–40؇C to +85؇C, fS = 200 kHz, VDIG = VANA = +5 V, unless otherwise noted)  
AD974–SPECIFICATIONS  
A Grade  
Typ  
B Grade  
Min Typ Max  
Parameter  
Conditions  
Min  
Max  
Units  
RESOLUTION  
16  
16  
Bits  
ANALOG INPUT  
Voltage Range  
Impedance  
±10 V, 0 V to +4 V, 0 V to +5 V (See Table I)  
Channel On or Off  
(See Table I)  
Sampling Capacitance  
40  
40  
pF  
THROUGHPUT SPEED  
Complete Cycle  
(Acquire and Convert)  
Throughput Rate  
5
5
µs  
kHz  
200  
200  
DC ACCURACY  
Integral Linearity Error  
Differential Linearity Error  
No Missing Codes  
±3  
+3  
±2.0  
+1.75  
LSB1  
LSB  
Bits  
LSB  
%
ppm/°C  
%
ppm/°C  
mV  
ppm/°C  
mV  
ppm/°C  
% FSR  
–2  
15  
–1  
16  
Transition Noise2  
1.0  
±7  
±2  
±2  
±2  
1.0  
±7  
±2  
±2  
±2  
Full-Scale Error3  
Internal Reference  
Internal Reference  
Ext. REF = +2.5 V  
Ext. REF = +2.5 V  
Bipolar Range  
Bipolar Range  
Unipolar Ranges  
Unipolar Ranges  
±0.5  
±0.5  
±10  
±0.25  
±0.25  
±10  
Full-Scale Error Drift  
Full-Scale Error  
Full-Scale Error Drift  
Bipolar Zero Error  
Bipolar Zero Error Drift  
Unipolar Zero Error  
Unipolar Zero Error Drift  
Channel-to-Channel Matching  
Recovery to Rated Accuracy  
After Power-Down4  
±10  
±10  
±0.1  
±0.05  
2.2 µF to CAP  
VD = 5 V ± 5%  
1
1
ms  
Power Supply Sensitivity  
VANA = VDIG = VD  
±8  
±8  
LSB  
AC ACCURACY  
Spurious Free Dynamic Range  
Total Harmonic Distortion  
Signal-to-(Noise+Distortion)  
f
IN = 20 kHz  
90  
83  
83  
96  
85  
85  
dB5  
dB  
dB  
dB  
dB  
dB  
MHz  
MHz  
fIN = 20 kHz  
fIN = 20 kHz  
–60 dB Input  
fIN = 20 kHz  
fIN = 20 kHz  
–90  
–96  
27  
28  
Signal-to-Noise  
Channel-to-Channel Isolation  
Full Power Bandwidth6  
–3 dB Input Bandwidth  
–110  
1
2.7  
–100  
–110 –100  
1
2.7  
SAMPLING DYNAMICS  
Aperture Delay  
40  
40  
1
150  
ns  
µs  
ns  
Transient Response  
Full-Scale Step  
1
Overvoltage Recovery7  
150  
REFERENCE  
Internal Reference Voltage  
Internal Reference Source Current  
External Reference Voltage Range  
for Specified Linearity  
2.48  
2.3  
2.5  
1
2.52  
2.48 2.5  
1
2.52  
V
µA  
2.5  
2.7  
2.3  
2.5  
2.7  
V
External Reference Current Drain  
Ext. REF = +2.5 V  
100  
100  
µA  
DIGITAL INPUTS  
Logic Levels  
VIL  
VIH  
IIL  
–0.3  
+2.0  
+0.8  
VDIG + 0.3  
±10  
–0.3  
+2.0  
+0.8  
VDIG + 0.3  
±10  
V
V
µA  
µA  
IIH  
±10  
±10  
–2–  
REV. A  
AD974  
A Grade  
Typ  
B Grade  
Min Typ Max  
Parameter  
Conditions  
Min  
Max  
Units  
DIGITAL OUTPUTS  
Data Format  
Data Coding  
VOL  
Serial 16 Bits  
Straight Binary  
+0.4  
ISINK = 1.6 mA  
ISOURCE = 500 µA  
High-Z State  
+0.4  
15  
V
V
pF  
VOH  
+4  
+4  
Output Capacitance  
Leakage Current  
15  
High-Z State  
VOUT = 0 V to VDIG  
±5  
±5  
µA  
POWER SUPPLIES  
Specified Performance  
VDIG  
+4.75 +5  
+4.75 +5  
4.5  
+5.25  
+5.25  
+4.75 +5  
+4.75 +5  
4.5  
+5.25  
+5.25  
V
V
mA  
mA  
VANA  
IDIG  
IANA  
14  
14  
Power Dissipation  
PWRD LOW  
PWRD HIGH  
120  
+85  
120  
+85  
mW  
µW  
50  
50  
TEMPERATURE RANGE  
Specified Performance  
TMIN to TMAX  
–40  
–40  
°C  
NOTES  
1LSB means Least Significant Bit. With a ±10 V input, one LSB is 305 µV.  
2Typical rms noise at worst case transitions and temperatures.  
3Full-Scale Error is expressed as the % difference between the actual full-scale code transition voltage and the ideal full-scale transition voltage, and includes the effect  
of offset error. For bipolar input, the Full-Scale Error is the worst case of either the –Full-Scale or +Full-Scale code transition voltage errors. For unipolar input  
ranges, Full-Scale Error is with respect to the +Full-Scale code transition voltage.  
4External 2.5 V reference connected to REF.  
5All specifications in dB are referred to a full-scale ±10 V input.  
6Full-Power Bandwidth is defined as full-scale input frequency at which Signal-to-(Noise + Distortion) degrades to 60 dB, or 10 bits of accuracy.  
7Recovers to specified performance after a 2 × FS input overvoltage.  
Specifications subject to change without notice.  
TIMING SPECIFICATIONS (fS = 200 kHz, VDIG = VANA = +5 V, –40؇C to +85؇C)  
Parameter  
Symbol  
Min  
Typ  
Max  
Units  
Convert Pulsewidth  
R/C, CS to BUSY Delay  
BUSY LOW Time  
BUSY Delay after End of Conversion  
Aperture Delay  
Conversion Time  
Acquisition Time  
Throughput Time  
R/C Low to DATACLK Delay  
DATACLK Period  
DATA Valid Setup Time  
DATA Valid Hold Time  
EXT. DATACLK Period  
EXT. DATACLK HIGH  
EXT. DATACLK LOW  
R/C, CS to EXT. DATACLK Setup Time  
R/C to CS Setup Time  
EXT. DATACLK to SYNC Delay  
EXT. DATACLK to DATA Valid Delay  
CS to EXT. DATACLK Rising Edge Delay  
Previous DATA Valid after CS, R/C Low  
BUSY to EXT. DATACLK Setup Time  
Final EXT. DATACLK to BUSY Rising Edge  
A0, A1 to WR1, WR2 Setup Time  
A0, A1 to WR1, WR2 Hold Time  
WR1, WR2 Pulsewidth  
t1  
t2  
t3  
t4  
t5  
t6  
t7  
t6 + t7  
t8  
50  
ns  
ns  
µs  
ns  
ns  
µs  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
µs  
ns  
µs  
ns  
ns  
ns  
100  
4.0  
50  
40  
3.8  
4.0  
5
1.0  
220  
220  
t9  
t10  
t11  
t12  
t13  
t14  
t15  
t16  
t17  
t18  
t19  
t20  
t21  
t22  
t23  
t24  
t25  
50  
20  
66  
20  
30  
20  
10  
15  
25  
10  
3.5  
5
t12 + 5  
66  
66  
1.7  
10  
10  
50  
Specifications subject to change without notic e.  
REV. A  
–3–  
AD974  
ABSOLUTE MAXIMUM RATINGS1  
PIN CONFIGURATION  
SOIC, DIP AND SSOP  
Analog Inputs  
VxA, VxB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 V  
CAP . . . . . . . . . . . . . . . . +VANA + 0.3 V to AGND2 – 0.3 V  
REF . . . . . . . . . . . . . . . . . . . . Indefinite Short to AGND2,  
Momentary Short to VANA  
Ground Voltage Differences  
DGND, AGND1, AGND2 . . . . . . . . . . . . . . . . . . . ±0.3 V  
Supply Voltages  
VANA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V  
VDIG to VANA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7 V  
VDIG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V  
Digital Inputs . . . . . . . . . . . . . . . . . . . –0.3 V to VDIG + 0.3 V  
Internal Power Dissipation2  
PDIP (N), SOIC (R), SSOP (RS) . . . . . . . . . . . . . 700 mW  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150°C  
Storage Temperature Range N, R . . . . . . . . –65°C to +150°C  
Lead Temperature Range  
1
2
28  
27  
26  
25  
24  
23  
V2B  
V2A  
V1B  
V1A  
AGND1  
V3A  
V3B  
3
V4A  
4
V4B  
5
V
ANA  
6
A0  
BIP  
AD974  
TOP VIEW  
(Not to Scale)  
7
CAP  
REF  
22 A1  
8
21  
20  
19  
18  
BUSY  
CS  
AGND2  
9
10  
11  
12  
13  
14  
R/C  
WR1  
WR2  
V
DIG  
17 DATA  
PWRD  
16 DATACLK  
EXT/INT  
15  
DGND  
SYNC  
(Soldering 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+300°C  
NOTES  
1Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
2Specification is for device in free air:  
1.6mA  
I
OL  
28-Lead PDIP: θJA = 100°C/W, θJC = 31°C/W  
28-Lead SOIC: θJA = 75°C/W, θJC = 24°C/W  
28-Lead SSOP: θJA = 109°C/W, θJC = 39°C/W  
TO OUTPUT  
PIN  
+1.4V  
C
100pF  
L
500A  
I
OH  
Figure 1. Load Circuit for Digital Interface Timing  
ORDERING GUIDE  
Temperature  
Range  
Package  
Description  
Package  
Options  
Model  
Max INL  
Min S/(N+D)  
AD974AN  
AD974BN  
AD974AR  
AD974BR  
AD974ARS  
AD974BRS  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
±3.0 LSB  
±2.0 LSB  
±3.0 LSB  
±2.0 LSB  
±3.0 LSB  
±2.0 LSB  
83 dB  
85 dB  
83 dB  
85 dB  
83 dB  
85 dB  
28-Lead Plastic DIP  
28-Lead Plastic DIP  
28-Lead SOIC  
28-Lead SOIC  
28-Lead SSOP  
N-28B  
N-28B  
R-28  
R-28  
RS-28  
RS-28  
28-Lead SSOP  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although the AD974 features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD  
precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
–4–  
REV. A  
AD974  
PIN FUNCTION DESCRIPTIONS  
Pin No.  
Mnemonic  
Description  
1
AGND1  
VxA, VxB  
BIP  
Analog Ground. Used as the ground reference point for the REF pin.  
Analog Input. Refer to Table I for input range configuration.  
Bipolar Offset. Connect VxA inputs to provide Bipolar input range.  
2–5, 25–28  
6
7
CAP  
Reference Buffer Output. Connect a 2.2 µF tantalum capacitor between CAP and Analog  
Ground.  
8
REF  
Reference Input/Output. The internal +2.5 V reference is available at this pin. Alternatively an  
external reference can be used to override the internal reference. In either case, connect a 2.2 µF  
tantalum capacitor between REF and Analog Ground.  
9
AGND2  
Analog Ground.  
10  
R/C  
Read/Convert Input. Used to control the conversion and read modes. With CS LOW, a falling  
edge on R/C holds the analog input signal internally and starts a conversion; a rising edge enables  
the transmission of the conversion result.  
11  
12  
VDIG  
PWRD  
Digital Power Supply. Nominally +5 V.  
Power-Down Input. When set to a logic HIGH, power consumption is reduced and conversions  
are inhibited. The conversion result from the previous conversion is stored in the onboard shift  
register.  
13  
EXT/INT  
Digital select input for choosing the internal or an external data clock. With EXT/INT tied LOW,  
after initiating a conversion, 16 DATACLK pulses transmit the previous conversion result as  
shown in Figure 3. With EXT/INT set to a Logic HIGH, output data is synchronized to an  
external clock signal connected to the DATACLK input. Data is output as indicated in Figure 4  
through Figure 9.  
14  
15  
DGND  
SYNC  
Digital Ground.  
Digital output frame synchronization for use with an external data clock (EXT/INT = Logic  
HIGH). When a read sequence is initiated, a pulse one DATACLK period wide is output  
synchronous to the external data clock.  
16  
17  
DATACLK  
DATA  
Serial data clock input or output, dependent upon the logic state of the EXT/INT pin. When  
using the internal data clock (EXT/INT = Logic LOW), a conversion start sequence will initiate  
transmission of 16 DATACLK periods. Output data is synchronous to this clock and is valid on  
both its rising and falling edges (Figure 3). When using an external data clock (EXT/INT = Logic  
HIGH), the CS and R/C signals control how conversion data is accessed.  
The serial data output is synchronized to DATACLK. Conversion results are stored in an on-  
chip register. The AD974 provides the conversion result, MSB first, from its internal shift regis-  
ter. When using the internal data clock (EXT/INT = Logic LOW), DATA is valid on both the  
rising and falling edges of DATACLK. Using an external data clock (EXT/INT = Logic HIGH)  
allows previous conversion data to be accessed during a conversion (Figures 5, 7 and 9) or the  
conversion result can be accessed after the completion of a conversion (Figures 4, 6 and 8).  
18, 19  
20  
WR1, WR2  
CS  
Multiplexer Write Inputs. These inputs are internally ORed to generate the mux latch inputs.  
The latch is transparent when WR1 and WR2 are tied low.  
Chip Select Input. With R/C LOW, a falling edge on CS will initiate a conversion. With R/C  
HIGH, a falling edge on CS will enable the serial data output sequence.  
21  
BUSY  
A1, A0  
Busy Output. Goes LOW when a conversion is started, and remains LOW until the conversion is  
completed and the data is latched into the on-chip shift register.  
Address multiplexer inputs latched with the WR1, WR2 inputs.  
22, 23  
A1  
A0  
Data Available from Channel  
0
0
1
1
0
1
0
1
AIN 1  
AIN 2  
AIN 3  
AIN 4  
24  
VANA  
Analog Power Supply. Nominally +5 V.  
REV. A  
–5–  
AD974  
SPURIOUS FREE DYNAMIC RANGE  
DEFINITION OF SPECIFICATIONS  
The difference, in decibels (dB), between the rms amplitude of  
the input signal and the peak spurious signal.  
INTEGRAL NONLINEARITY ERROR (INL)  
Linearity error refers to the deviation of each individual code  
from a line drawn from “negative full scale” through “positive  
full scale.” The point used as “negative full scale” occurs 1/2 LSB  
before the first code transition. “Positive full scale” is defined as  
a level 1 1/2 LSB beyond the last code transition. The deviation  
is measured from the middle of each particular code to the true  
straight line.  
TOTAL HARMONIC DISTORTION (THD)  
THD is the ratio of the rms sum of the first six harmonic com-  
ponents to the rms value of a full-scale input signal and is ex-  
pressed in decibels.  
SIGNAL TO (NOISE AND DISTORTION) (S/[N+D]) RATIO  
S/(N+D) is the ratio of the rms value of the measured input  
signal to the rms sum of all other spectral components below  
the Nyquist frequency, including harmonics but excluding dc.  
The value for S/(N+D) is expressed in decibels.  
DIFFERENTIAL NONLINEARITY ERROR (DNL)  
In an ideal ADC, code transitions are 1 LSB apart. Differential  
nonlinearity is the maximum deviation from this ideal value. It  
is often specified in terms of resolution for which no missing  
codes are guaranteed.  
FULL POWER BANDWIDTH  
The full power bandwidth is defined as the full-scale input fre-  
quency at which the S/(N+D) degrades to 60 dB, 10 bits of  
accuracy.  
FULL-SCALE ERROR  
The last + transition (from 011 . . . 10 to 011 . . . 11) should  
occur for an analog voltage 1 1/2 LSB below the nominal full  
scale (9.9995422 V for a ±10 V range). The full-scale error is  
the deviation of the actual level of the last transition from the  
ideal level.  
APERTURE DELAY  
Aperture delay is a measure of the acquisition performance, and  
is measured from the falling edge of the R/C input to when the  
input signal is held for a conversion.  
BIPOLAR ZERO ERROR  
Bipolar zero error is the difference between the ideal midscale  
input voltage (0 V) and the actual voltage producing the mid-  
scale output code.  
TRANSIENT RESPONSE  
The time required for the AD974 to achieve its rated accuracy  
after a full-scale step function is applied to its input.  
UNIPOLAR ZERO ERROR  
OVERVOLTAGE RECOVERY  
In unipolar mode, the first transition should occur at a level  
1/2 LSB above analog ground. Unipolar zero error is the devia-  
tion of the actual transition from that point.  
The time required for the ADC to recover to full accuracy after  
an analog input signal 150% of full-scale is reduced to 50% of  
the full-scale value.  
–6–  
REV. A  
AD974  
CONVERSION CONTROL  
INTERNAL DATA CLOCK MODE  
The AD974 is controlled by two signals: R/C and CS. When  
R/C is brought low, with CS low, for a minimum of 50 ns, the  
input signal will be held on the internal capacitor array and a  
conversion “n” will begin. Once the conversion process does  
begin, the BUSY signal will go low until the conversion is com-  
plete. Internally, the signals R/C and CS are ORed together and  
there is no requirement on which signal is taken low first when  
initiating a conversion. The only requirement is that there be at  
least 10 ns of delay between the two signals being taken low.  
After the conversion is complete, the BUSY signal will return  
high and the AD974 will again resume tracking the input signal.  
Under certain conditions the CS pin can be tied Low and R/C  
will be used to determine whether you are initiating a conver-  
sion or reading data. On the first conversion, after the AD974 is  
powered up, the DATA output will be indeterminate.  
The AD974 is configured to generate and provide the data clock  
when the EXT/INT pin is held low. Typically CS will be tied  
low and R/C will be used to initiate a conversion “n.” During  
the conversion the AD974 will output 16 bits of data, MSB first,  
from conversion “n-1” on the DATA pin. This data will be  
synchronized with 16 clock pulses provided on the DATACLK  
pin. The output data will be valid on both the rising and falling  
edge of the data clock as shown in Figure 3. After the LSB has  
been presented, the DATACLK pin will stay low until another  
conversion is initiated.  
In this mode, the digital input/output pins’ transitions are suit-  
ably positioned to minimize degradation on the conversion  
result, mainly during the second half of the conversion process.  
EXTERNAL DATA CLOCK MODE  
Conversion results can be clocked serially, using either an  
internal clock generated by the AD974 or an external clock.  
The AD974 is configured for the internal data clock mode by  
pulling the EXT/INT pin low. It is configured for the external  
clock mode by pulling the EXT/INT pin high.  
The AD974 is configured to accept an externally supplied data  
clock when the EXT/INT pin is held high. This mode of opera-  
tion provides several methods by which conversion results can  
be read. The output data from conversion “n-1” can be read  
during conversion “n,” or the output data from conversion “n”  
t1  
CS, R/C  
A0, A1  
WR1, WR2  
t25  
t24  
t23  
t3  
BUSY  
t2  
t4  
t5  
MODE  
ACQUIRE  
CONVERT  
t6  
ACQUIRE  
CONVERT  
t7  
Figure 2. Basic Conversion Timing  
t8  
R/C  
t9  
t1  
DATACLK  
1
2
3
15  
16  
t10  
t11  
LSB  
VALID  
BIT 1  
VALID  
BIT 14  
VALID  
BIT 13  
VALID  
MSB  
VALID  
DATA  
t2  
t6  
BUSY  
Figure 3. Serial Data Timing for Reading Previous Conversion Results with Internal Clock  
(CS and EXT/INT Set to Logic Low)  
REV. A  
–7–  
AD974  
EXTERNAL DISCONTINUOUS CLOCK DATA READ  
AFTER CONVERSION WITH NO SYNC OUTPUT  
GENERATED  
can be read after the conversion is complete. The external clock  
can be either a continuous or discontinuous clock. A discontinu-  
ous clock can be either normally low or normally high when  
inactive. In the case of the discontinuous clock, the AD974 can be  
configured to either generate or not generate a SYNC output  
(with a continuous clock a SYNC output will always be produced).  
Figure 4 illustrates the method by which data from conversion  
“n” can be read after the conversion is complete using a discon-  
tinuous external clock without the generation of a SYNC  
output. After a conversion is complete, indicated by BUSY  
returning high, the result of that conversion can be read while  
CS is Low and R/C is high. In this mode CS can be tied low.  
The MSB will be valid on the first falling edge and the second  
rising edge of DATACLK. The LSB will be valid on the 16th  
falling edge and the 17th rising edge of DATACLK. A mini-  
mum of 16 clock pulses are required for DATACLK if the  
receiving device will be latching data on the falling edge of  
DATACLK. A minimum of 17 clock pulses are required for  
DATACLK if the receiving device will be latching data on the  
rising edge of DATACLK.  
Each of the methods will be described in the following sections  
and are illustrated in Figures 4 through 9. It should be noted  
that all timing diagrams assume that the receiving device is  
latching data on the rising edge of the external clock. If the  
falling edge of DATACLK is used then, in the case of a discon-  
tinuous clock, one less clock pulse is required than shown in  
Figures 4 through 7 to latch in a 16-bit word. Note that data is  
valid on the falling edge of a clock pulse (for t13 greater than t18)  
and the rising edge of the next clock pulse.  
The AD974 provides error correction circuitry that can correct  
for an improper bit decision made during the first half of the  
conversion cycle. Normally the occurrence of an incorrect bit  
decision during a conversion cycle is irreversible. This error  
occurs as a result of noise during the time of the decision or due  
to insufficient settling time. As the AD974 is performing a  
conversion it is important that transitions not occur on digital  
input/output pins or degradation of the conversion result could  
occur. This is particularly important during the second half of  
the conversion process. For this reason it is recommended that  
when an external clock is being provided it be a discontinuous  
clock that is not toggling during the time that BUSY is low or,  
more importantly, that it does not transition during the latter  
half of BUSY low.  
The advantage of this method of reading data is that data is not  
being clocked out during a conversion and therefore conversion  
performance is not degraded.  
When reading data after the conversion is complete, with the  
highest frequency permitted for DATACLK (15.15 MHz), the  
maximum possible throughput is approximately 195 kHz, and  
not the rated 200 kHz.  
t12  
t13  
t14  
EXT  
DATACLK  
0
1
2
3
14  
15  
16  
t1  
t2  
R/C  
BUSY  
t21  
SYNC  
DATA  
t18  
BIT 15  
(MSB)  
t18  
BIT 0  
(LSB)  
BIT 14  
BIT 13  
BIT 1  
Figure 4. Conversion and Read Timing Using an External Discontinuous Data Clock  
(EXT/INT Set to Logic High, CS Set to Logic Low)  
–8–  
REV. A  
AD974  
EXTERNAL DISCONTINUOUS CLOCK DATA READ  
DURING CONVERSION WITH NO SYNC OUTPUT  
GENERATED  
discontinuous external clock, with the generation of a SYNC  
output. What permits the generation of a SYNC output is a  
transition of DATACLK while either CS is high or while both  
CS and R/C are low. After a conversion is complete, indicated  
by BUSY returning high, the result of that conversion can be  
read while CS is Low and R/C is high. In this mode CS can be  
tied low. In Figure 6 clock pulse #0 is used to enable the gen-  
eration of a SYNC pulse. The SYNC pulse is actually clocked  
out approximately 40 ns after the rising edge of clock pulse #1.  
The SYNC pulse will be valid on the falling edge of clock pulse  
#1 and the rising edge of clock pulse #2. The MSB will be valid  
on the falling edge of clock pulse #2 and the rising edge of clock  
pulse #3. The LSB will be valid on the falling edge of clock  
pulse #17 and the rising edge of clock pulse #18. The advan-  
tage of this method of reading data is that it is not being clocked  
out during a conversion and therefore conversion performance is  
not degraded.  
Figure 5 illustrates the method by which data from conversion  
“n-1” can be read during conversion “n” while using a discon-  
tinuous external clock, without the generation of a SYNC out-  
put. After a conversion is initiated, indicated by BUSY going  
low, the result of the previous conversion can be read while CS  
is low and R/C is high. In this mode CS can be tied low. The  
MSB will be valid on the 1st falling edge and the 2nd rising edge of  
DATACLK. The LSB will be valid on the 16th falling edge and  
the 17th rising edge of DATACLK. A minimum of 16 clock  
pulses are required for DATACLK if the receiving device will be  
latching data on the falling edge of DATACLK. A minimum of  
17 clock pulses are required for DATACLK if the receiving  
device will be latching data on the rising edge of DATACLK.  
In this mode the data should be clocked out during the first half  
of BUSY so not to degrade conversion performance. This re-  
quires use of a 10 MHz DATACLK or greater, with data being  
read out as soon as the conversion process begins.  
When reading data after the conversion is complete, with the  
highest frequency permitted for DATACLK (15.15 MHz), the  
maximum possible throughput is approximately 195 kHz and  
not the rated 200 kHz.  
EXTERNAL DISCONTINUOUS CLOCK DATA READ  
AFTER CONVERSION WITH SYNC OUTPUT GENERATED  
Figure 6 illustrates the method by which data from conver-  
sion “n” can be read after the conversion is complete using a  
t12  
t13  
t14  
1
EXT  
DATACLK  
0
2
15  
16  
t22  
t15  
R/C  
t1  
t20  
BUSY  
t21  
t18  
t2  
SYNC  
DATA  
t18  
BIT 15  
(MSB)  
BIT 0  
(LSB)  
BIT 14  
Figure 5. Conversion and Read Timing for Reading Previous Conversion Results During a Conversion  
Using External Discontinuous Data Clock (EXT/INT Set to Logic High, CS Set to Logic Low)  
t12  
t13  
t14  
EXT  
DATACLK  
0
1
2
3
4
17  
18  
t15  
t15  
t15  
R/C  
t2  
t17  
BUSY  
SYNC  
t12  
t18  
t18  
BIT 0  
(LSB)  
BIT 15  
(MSB)  
DATA  
BIT 14  
Figure 6. Conversion and Read Timing Using An External Discontinuous Data Clock  
(EXT/INT Set to Logic High, CS Set to Logic Low)  
REV. A  
–9–  
AD974  
EXTERNAL DISCONTINUOUS CLOCK DATA READ  
DURING CONVERSION WITH SYNC OUTPUT  
GENERATED  
begun. Figure 7 shows R/C then going high and after a delay of  
greater than 15 ns (t15) clock pulse #1 can be taken high to  
request the SYNC output. The SYNC output will appear ap-  
proximately 40 ns after this rising edge and will be valid on the  
falling edge of clock pulse #1 and the rising edge of clock pulse  
#2. The MSB will be valid approximately 40 ns after the rising  
edge of clock pulse #2 and can be latched off either the falling  
edge of clock pulse #2 or the rising edge of clock pulse #3. The  
LSB will be valid on the falling edge of clock pulse #17 and the  
rising edge of clock pulse #18.  
Figure 7 illustrates the method by which data from conversion  
“n-1” can be read during conversion “n” while using a discon-  
tinuous external clock, with the generation of a SYNC output.  
What permits the generation of a SYNC output is a transition of  
DATACLK while either CS is High or while both CS and R/C  
are low. In Figure 7 a conversion is initiated by taking R/C low  
with CS tied low. While this condition exists a transition of  
DATACLK, clock pulse #0, will enable the generation of a  
SYNC pulse. Less then 83 ns after R/C is taken low the BUSY  
output will go low to indicate that the conversion process has  
Data should be clocked out during the first half of BUSY to  
avoid degrading conversion performance. This requires use of a  
10 MHz DATACLK or greater, with data being read out as  
soon as the conversion process begins.  
t12  
t13  
t14  
EXT  
DATACLK  
1
2
3
4
17  
18  
0
t15  
t22  
t15  
R/C  
t1  
t20  
BUSY  
t2  
t17  
SYNC  
t12  
t18  
t18  
BIT 0  
(LSB)  
BIT 15  
(MSB)  
DATA  
BIT 14  
Figure 7. Conversion and Read Timing for Reading Previous Conversion Results During a Conversion  
Using External Discontinuous Data Clock (EXT/INT Set to Logic High, CS Set to Logic Low)  
–10–  
REV. A  
AD974  
EXTERNAL CONTINUOUS CLOCK DATA READ AFTER  
CONVERSION WITH SYNC OUTPUT GENERATED  
Figure 8 illustrates the method by which data from conversion  
“n” can be read after the conversion is complete using a con-  
tinuous external clock, with the generation of a SYNC output.  
What permits the generation of a SYNC output is a transition of  
DATACLK either while CS is high or while both CS and R/C are  
low.  
and R/C is high. In Figure 8 clock pulse #0 is used to enable the  
generation of a SYNC pulse. The SYNC pulse is actually clocked  
out approximately 40 ns after the rising edge of clock pulse #1.  
The SYNC pulse will be valid on the falling edge of clock pulse  
#1 and the rising edge of clock pulse #2. The MSB will be valid  
on the falling edge of clock pulse #2 and the rising edge of clock  
pulse #3. The LSB will be valid on the falling edge of clock  
pulse #17 and the rising edge of clock pulse #18.  
With a continuous clock the CS pin cannot be tied low as it  
could be with a discontinuous clock. Use of a continuous clock,  
while a conversion is occurring, can increase the DNL and  
Transition Noise of the AD974.  
When reading data after the conversion is complete, with the  
highest frequency permitted for DATACLK (15.15 MHz) the  
maximum possible throughput is approximately 195 kHz and  
not the rated 200 kHz.  
After a conversion is complete, indicated by BUSY returning  
high, the result of that conversion can be read while CS is low  
t12  
t13  
t14  
EXT  
DATACLK  
0
1
2
3
4
17  
18  
t19  
t1  
t15  
CS  
t10  
R/C  
t16  
t2  
BUSY  
t17  
SYNC  
t12  
t18  
t18  
BIT 15  
(MSB)  
BIT 0  
(LSB)  
BIT 14  
DATA  
Figure 8. Conversion and Read Timing Using an External Continuous Data Clock (EXT/INT Set to Logic High)  
REV. A  
–11–  
AD974  
to indicate that the conversion process has began. Figure 9  
shows R/C then going high and after a delay of greater than  
15 ns (t15), clock pulse #1 can be taken high to request the  
SYNC output. The SYNC output will appear approximately  
50 ns after this rising edge and will be valid on the falling edge  
of clock pulse #1 and the rising edge of clock pulse #2. The  
MSB will be valid approximately 40 ns after the rising edge of  
clock pulse #2 and can be latched off either the falling edge of  
clock pulse #2 or the rising edge of clock pulse #3. The LSB  
will be valid on the falling edge of clock pulse #17 and the  
rising edge of clock pulse #18.  
EXTERNAL CONTINUOUS CLOCK DATA READ DURING  
CONVERSION WITH SYNC OUTPUT GENERATED  
Figure 9 illustrates the method by which data from conversion  
“n-1” can be read during conversion “n” while using a continu-  
ous external clock with the generation of a SYNC output. What  
permits the generation of a SYNC output is a transition of  
DATACLK either while CS is high or while both CS and R/C  
are low.  
With a continuous clock the CS pin cannot be tied low as it  
could be with a discontinuous clock. Use of a continuous clock  
while a conversion is occurring can increase the DNL and  
Transition Noise.  
Data should be clocked out during the 1st half of BUSY to  
not degrade conversion performance. This requires use of a  
10 MHz DATACLK or greater, with data being read out as  
soon as the conversion process begins.  
In Figure 9 a conversion is initiated by taking R/C low with CS  
held low. While this condition exists a transition of DATACLK,  
clock pulse #0, will enable the generation of a SYNC pulse. Less  
then 83 ns after R/C is taken low the BUSY output will go low  
t12  
t13  
t14  
EXT  
DATACLK  
0
1
2
3
18  
t19  
CS  
t16  
t15  
R/C  
t1  
t20  
BUSY  
t2  
t17  
SYNC  
t12  
t18  
t18  
BIT 15  
(MSB)  
BIT 0  
(LSB)  
DATA  
Figure 9. Conversion and Read Timing for Reading Previous Conversion Results During a Conversion  
Using An External Continuous Data Clock (EXT/INT Set to Logic High)  
–12–  
REV. A  
AD974  
Table I. Analog Input Configuration  
Input Voltage  
Range  
Connect  
VxA to  
Connect  
VxB to  
Input  
Impedance  
±10 V  
0 V to +5 V  
0 V to +4 V  
BIP  
VIN  
VIN  
VIN  
GND  
VIN  
13.7 kΩ  
6.0 kΩ  
6.4 kΩ  
Table II. Output Codes and Ideal Input Voltage  
Digital Input  
Straight Binary  
Description  
Analog Input  
Full-Scale Range  
±10 V  
0 V to +5 V  
76 µV  
+4.999847 V  
+2.5 V  
0 V to +4 V  
61 µV  
+3.999939 V  
+2 V  
Least Significant Bit  
+Full Scale (FS – 1 LSB)  
Midscale  
305 µV  
+9.999695 V  
0 V  
1111 1111 1111 1111  
1000 0000 0000 0000  
0111 1111 1111 1111  
0000 0000 0000 0000  
One LSB Below Midscale  
–Full Scale  
–305 µV  
–10 V  
+2.499924 V  
0 V  
+1.999939 V  
0 V  
ANALOG INPUTS  
Figure 10 shows the simplified analog input section for the  
AD974. Since the AD974 can operate with an internal or exter-  
nal reference, and three different analog input ranges, the full-  
scale analog input range is best represented with a voltage that  
spans 0 V to VREF across the 40 pF sampling capacitor. The on-  
chip resistors are laser trimmed to ratio match for adjustment of  
offset and full-scale error using fixed external resistors.  
The AD974 is specified to operate with three full-scale analog  
input ranges. Connections required for each of the eight analog  
inputs, VxA and VxB and the resulting full-scale ranges, are  
shown in Table I. The nominal input impedance for each ana-  
log input range is also shown. Table II shows the output codes  
for the ideal input voltages of each of the analog input ranges.  
The analog input section has a ±25 V overvoltage protection on  
VxA and VxB. Since the AD974 has two analog grounds it is  
important to ensure that the analog input is referenced to the  
AGND1 pin, the low current ground. This will minimize any  
problems associated with a resistive ground drop. It is also  
important to ensure that the analog inputs are driven by a low  
impedance source. With its primarily resistive analog input  
circuitry, the ADC can be driven by a wide selection of general  
purpose amplifiers.  
BIP  
AGND1  
REF  
4k⍀  
2.5V  
REFERENCE  
CAP  
VxA  
3k⍀  
12k⍀  
4k⍀  
SWITCHED  
CAP ADC  
VxB  
40pF  
To achieve the low distortion capability of the AD974 care  
should be taken in the selection of the drive circuitry  
op amp.  
AGND2  
AD974  
Figure 10. Simplified Analog Input  
REV. A  
–13–  
AD974  
INPUT RANGE  
BASIC CONNECTIONS FOR AD974  
BIP  
VxA  
V
IN  
VxB  
AGND1  
؎10V  
CAP  
+
+
2.2F  
2.2F  
AD974  
REF  
AGND2  
BIP  
V
IN  
VxA  
VxB  
AGND1  
0V TO +5V  
CAP  
+
+
2.2F  
2.2F  
AD974  
REF  
AGND2  
BIP  
V
VxA  
VxB  
IN  
AGND1  
CAP  
0V TO +4V  
+
+
2.2F  
2.2F  
AD974  
REF  
AGND2  
Figure 11. Analog Input Configurations  
–14–  
REV. A  
AD974  
are taken to minimize any degradation in the ADC’s perfor-  
mance. Figure 14 shows the load regulation of the reference  
buffer. Notice that this figure is also normalized so that there is  
zero error with no dc load. In the linear region, the output imped-  
ance at this point is typically 1 . Because of this output imped-  
ance, it is important to minimize any ac- or input-dependent  
loads that will lead to increased distortion. Any dc load will  
simply act as a gain error. Although the typical characteristic of  
Figure 14 shows that the AD974 is capable of driving loads  
greater than 15 mA, it is recommended that the steady state  
current not exceed 2 mA.  
OFFSET AND GAIN ADJUSTMENT  
The AD974 is factory trimmed to minimize gain, offset and  
linearity errors. There are no internal provisions to allow for any  
further adjustment of offset error through external circuitry.  
The reference of the AD974 can be adjusted as shown in Figure  
12. This will allow the full-scale error of any one channel to be  
adjusted to zero or will allow the average full-scale error of the  
four channels to be minimized.  
CAP  
+
2.2F  
AD974  
+5V  
576k⍀  
2.2F  
50k⍀  
REF  
+
AGND2  
SOURCE CAPABILITY  
SINK CAPABILITY  
Figure 12. AD974 Full-Scale Trim  
VOLTAGE REFERENCE  
LOAD CURRENT – 5mA/DIV  
Figure 14. CAP Pin Load Regulation  
Using an External Reference  
In addition to the on-chip reference, an external 2.5 V reference  
can be applied. When choosing an external reference for a  
16-bit application, however, careful attention should be paid to  
noise and temperature drift. These critical specifications can  
have a significant effect on the ADC performance.  
The AD974 has an on-chip temperature compensated bandgap  
voltage reference that is factory trimmed to +2.5 V ± 20 mV.  
The accuracy of the AD974 over the specified temperature  
range is dominated by the drift performance of the voltage refer-  
ence. The on-chip voltage reference is laser-trimmed to provide  
a typical drift of 7 ppm/°C. This typical drift characteristic is  
shown in Figure 13, which is a plot of the change in reference  
voltage (in mV) versus the change in temperature—notice the  
plot is normalized for zero error at +25°C. If improved drift perfor-  
mance is required, an external reference such as the AD780  
should be used to provide a drift as low as 3 ppm/°C. In order to  
simplify the drive requirements of the voltage reference (internal  
or external), an on-chip reference buffer is provided.  
Figure 15 shows the AD974 used in bipolar mode with the  
AD780 voltage reference applied to the REF pin. The AD780  
is a bandgap reference that exhibits ultralow drift, low initial  
error and low output noise. For low power applications, the  
AD780 provides a low quiescent current, high accuracy and low  
temperature drift solution.  
V
IN  
VxB  
VxA  
BIP  
0.1F  
3
2
TEMP  
V
6
4
REF  
OUT  
+
C1  
2.2F  
AD780  
+5V  
V
IN  
AGND1  
GND  
+
C3  
1F  
C4  
0.1F  
AD974  
V
ANA  
–55  
25  
125  
CAP  
+
DEGREES – Celsius  
C2  
2.2F  
AGND2  
Figure 13. Reference Drift  
The output of this buffer is provided at the CAP pin and is  
available to the user; however, when externally loading the refer-  
ence buffer, it is important to make sure that proper precautions  
Figure 15. External Reference to AD974 Configured for  
±10 V Input Range  
REV. A  
–15–  
AD974  
AC PERFORMANCE  
100%  
2.0  
1.5  
The AD974 is fully specified and tested for dynamic perfor-  
mance specifications. The ac parameters are required for signal  
processing applications such as speech recognition and spectrum  
analysis. These applications require information on the ADC’s  
effect on the spectral content of the input signal. Hence, the  
parameters for which the AD974 is specified include S/(N+D),  
THD and Spurious Free Dynamic Range. These terms are  
discussed in greater detail in the following sections.  
1.0  
0.5  
0
–0.5  
–1.0  
–1.5  
–2.0  
As a general rule, it is recommended that the results from sev-  
eral conversions be averaged to reduce the effects of noise and  
thus improve parameters such as S/(N+D) and THD. AC per-  
formance can be optimized by operating the ADC at its maxi-  
mum sampling rate of 200 kHz and digitally filtering the resulting  
bit stream to the desired signal bandwidth. By distributing noise  
over a wider frequency range the noise density in the frequency  
band of interest can be reduced. For example, if the required  
input bandwidth is 50 kHz, the AD974 could be oversampled  
by a factor of 4. This would yield a 6 dB improvement in the  
effective SNR performance.  
0
5
10 15 20 25 30 35 40 45 50 55 60  
SAMPLES – K  
66  
Figure 17. INL Plot  
100%  
2.0  
1.5  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
–110  
5280 POINT FFT  
fSAMPLE = 200kHz  
fIN = 20kHz  
SNRD = 86.7dB  
THD = 100.7dB  
1.0  
0.5  
0
–0.5  
–1.0  
–1.5  
–2.0  
0
5
10 15 20 25 30 35 40 45 50 55 60 66  
SAMPLES – K  
–125  
0
5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100  
FREQUENCY – kHz  
Figure 18. DNL Plot  
Figure 16. FFT Plot  
90  
80  
70  
60  
50  
40  
30  
20  
10  
SNR+D (dB) FOR AD974  
DC PERFORMANCE  
The factory calibration scheme used for the AD974 compen-  
sates for bit weight errors that may exist in the capacitor array.  
The mismatch in capacitor values is adjusted (using the calibra-  
tion coefficients) during a conversion, resulting in excellent dc  
linearity performance. Figures 17 and 18, respectively, show  
typical INL and DNL plots for the AD974 at +25°C.  
A histogram test is a statistical method for deriving an A/D  
converter’s differential nonlinearity. A ramp input is sampled  
by the ADC and a large number of conversions are taken at  
each voltage level, averaged and then stored. The effect of  
averaging is to reduce the transition noise by 1/n. If 64 samples  
are averaged at each point, the effect of transition noise is  
reduced by a factor of 8; i.e., a transition noise of 0.8 LSBs rms  
is reduced to 0.1 LSBs rms. Theoretically the codes, during a  
test of DNL, would all be the same size and therefore have an  
equal number of occurrences. A code with an average number  
of occurrences would have a DNL of “0.” A code that is  
different from the average would have a DNL that was either  
greater or less than zero LSB. A DNL of –1 LSB indicates that  
there is a missing code present at the 16-bit level and that the  
ADC exhibits 15-bit performance.  
1
10  
100  
1000  
INPUT SIGNAL FREQUENCY – kHz  
Figure 19. S/(N+D) vs. Input Frequency  
–16–  
REV. A  
AD974  
When used with an external reference, connected to the REF  
pin and a 2.2 µF capacitor, connected to the CAP pin, the  
power-up recovery time is typically 1 ms. This typical value of  
1 ms for recovery time depends on how much charge has de-  
cayed from the external 2.2 µF capacitor on the CAP pin and  
assumes that it has decayed to zero. The 1 ms recovery time has  
been specified such that settling to 16 bits has been achieved.  
110  
105  
100  
95  
–80  
SFDR  
–85  
–90  
–95  
When used with the internal reference, the dominant time con-  
stant for power-up recovery is determined by the external ca-  
pacitor on the REF pin and the internal 4K impedance seen at  
that pin. An external 2.2 µF capacitor is recommended for the  
REF pin.  
THD  
–100  
–105  
–110  
90  
SNRD  
85  
80  
–75  
CROSSTALK  
0
–50  
–25  
25  
50  
75  
100  
125  
150  
TEMPERATURE – ؇C  
The crosstalk between adjacent channels, nonadjacent channels  
and worst-case adjacent channels is shown in Figures 22 to 24.  
The worst-case crosstalk occurs between channels 1 and 2.  
Figure 20. AC Parameters vs. Temperature  
DC CODE UNCERTAINTY  
–80  
–85  
Ideally, a fixed dc input should result in the same output code  
for repetitive conversions; however, as a consequence of un-  
avoidable circuit noise within the wideband circuits of the ADC,  
a range of output codes may occur for a given input voltage.  
Thus, when a dc signal is applied to the AD974 input, and  
10,000 conversions are recorded, the result will be a distribution  
of codes as shown in Figure 21. This histogram shows a bell  
shaped curve consistent with the Gaussian nature of thermal  
noise. The histogram is approximately seven codes wide. The  
standard deviation of this Gaussian distribution results in a code  
transition noise of 1 LSB rms.  
–90  
ADJACENT CHANNELS,  
WORST PAIR  
–95  
–100  
NONADJACENT  
CHANNELS  
–105  
–110  
–115  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
1
10  
100  
1000  
10000  
ACTIVE CHANNEL INPUT FREQUENCY – kHz  
Figure 22. Crosstalk vs. Input Frequency (kHz)  
0
–10  
–20  
–30  
–40  
–50  
–60  
0
–70  
–3  
–2  
–1  
0
1
2
3
4
–80  
Figure 21. Histogram of 10,000 Conversions of a DC Input  
–90  
–100  
–110  
–120  
–130  
POWER-DOWN FEATURE  
The AD974 has analog and reference power-down capability  
through the PWRD pin. When the PWRD pin is taken high,  
the power consumption drops from a maximum value of  
100 mW to a typical value of 50 µW. When in the power-  
down mode the previous conversion results are still available in  
the internal registers and can be read out providing it has not  
already been shifted out.  
1
2
4
6
8
10  
12  
14  
16  
18  
20  
FREQUENCY – kHz  
Figure 23. Adjacent Channel Crosstalk, Worst Pair  
(8192 Point FFT; AIN 2 = 1.02 kHz, –0.1 dB; AIN 1 = AGND)  
REV. A  
–17–  
AD974  
data read operation. The recommended procedure to ensure  
this is as follows:  
0
–10  
–20  
• Enable SPORT0 through the System Control register.  
• Set the SCLK Divide register to zero.  
–30  
–40  
• Setup PF0 and PF1 as outputs by setting bits 0 and 1 in  
PFTYPE.  
–50  
–60  
–70  
• Force RFS0 low through PF0. The Receive Frame Sync  
signal has been programmed active high.  
–80  
–90  
• Enable AD974 by forcing CS = 0 through PF1.  
–100  
–110  
–120  
–130  
• Enable SPORT0 Receive Interrupt through the IMASK  
register.  
• Wait for at least one full conversion cycle of the AD974 and  
throw away the received data.  
1
2
4
6
8
10  
12  
14  
16  
18  
20  
FREQUENCY – kHz  
Figure 24. Adjacent Channel Crosstalk, Worst Pair (8192  
Point FFT; AIN 2 = 220 kHz, –0.1 dB; AIN 1 = AGND)  
• Disable the AD974 by forcing CS = 1 through PF1.  
• Wait for a period of time equal to one conversion cycle.  
• Force RFS0 high through PF0.  
MICROPROCESSOR INTERFACING  
The AD974 is ideally suited for traditional dc measurement  
applications supporting a microprocessor, and ac signal process-  
ing applications interfacing to a digital signal processor. The  
AD974 is designed to interface with a general purpose serial  
port or I/O ports on a microcontroller. A variety of external  
buffers can be used with the AD974 to prevent digital noise  
from coupling into the ADC. The following sections illustrate  
the use of the AD974 with an SPI equipped microcontroller and  
the ADSP-2181 signal processor.  
• Enable the AD974 by forcing CS = 0 through PF1.  
The ADSP-2181 SPORT0 will now remain synchronized to the  
external discontinuous clock for all subsequent conversions.  
DATA  
DR0  
DATACLK  
SCLK0  
R/C  
OSCILLATOR  
ADSP-2181  
AD974  
SPI INTERFACE  
CS  
PF1  
RFS0  
PF0  
Figure 25 shows a general interface diagram between the  
AD974 and an SPI equipped microcontroller. This interface  
assumes that the convert pulses will originate from the micro-  
controller and that the AD974 will act as the slave device. The  
convert pulse could be initiated in response to an internal timer  
interrupt. The reading of output data, one byte at a time,  
if necessary, could be initiated in response to the end-of-  
conversion signal (BUSY going high).  
EXT/INT  
SPORT0 CNTRL REG = 0
؋
300F  
Figure 26. AD974-to-ADSP-2181 Interface  
POWER SUPPLIES AND DECOUPLING  
The AD974 has two power supply input pins. VANA and VDIG  
provide the supply voltages to the analog and digital portions,  
respectively. VANA is the +5 V supply for the on-chip analog  
circuitry, and VDIG is the +5 V supply for the on-chip digital  
circuitry. The AD974 is designed to be independent of power  
supply sequencing and thus free from supply voltage induced  
latchup.  
DATA  
SDI  
SCK  
DATACLK  
R/C  
I/O PORT  
IRQ  
AD974  
BUSY  
EXT/INT  
+5V  
SPI  
With high performance linear circuits, changes in the power  
supplies can result in undesired circuit performance. Optimally,  
well regulated power supplies should be chosen with less than  
1% ripple. The ac output impedance of a power supply is a  
complex function of frequency and will generally increase with  
frequency. Thus, high frequency switching, such as that en-  
countered with digital circuitry, requires the fast transient cur-  
rents that most power supplies cannot adequately provide. Such  
a situation results in large voltage spikes on the supplies. To  
compensate for the finite ac output impedance of most supplies,  
charge “reserves” should be stored in bypass capacitors. This  
will effectively lower the supplies impedance presented to the  
AD974 VANA and VDIG pins and reduce the magnitude of these  
spikes. Decoupling capacitors, typically 0.1 µF, should be placed  
close to the power supply pins of the AD974 to minimize any  
inductance between the capacitors and the VANA and VDIG pins.  
CS  
Figure 25. AD974-to-SPI Interface  
ADSP-2181 INTERFACE  
Figure 26 shows an interface between the AD974 and the  
ADSP-2181 Digital Signal Processor. The AD974 is configured  
for the Internal Clock mode (EXT/INT = 0) and will therefore  
act as the master device. The convert command is shown gener-  
ated from an external oscillator in order to provide a low jitter  
signal appropriate for both dc and ac measurements. Because  
the SPORT, within the ADSP-2181, will be seeing a discontinu-  
ous external clock, some steps are required to ensure that the  
serial port is properly synchronized to this clock during each  
–18–  
REV. A  
AD974  
The AD974 may be operated from a single +5 V supply.  
When separate supplies are used, however, it is beneficial to  
have larger (10 µF) capacitors placed between the logic supply  
(VDIG) and digital common (DGND), and between the analog  
supply (VANA) and the analog common (AGND2). Addition-  
ally, 10 µF capacitors should be located in the vicinity of the  
ADC to further reduce low frequency ripple. In systems where  
the device will be subjected to harsh environmental noise,  
additional decoupling may be required.  
BOARD LAYOUT  
Designing with high resolution data converters requires careful  
attention to board layout and trace impedance is a significant  
issue. A 1.22 mA current through a 0.5 trace will develop a  
voltage drop of 0.6 mV, which is 2 LSBs at the 16-bit level over  
the 20 volt full-scale range. Ground circuit impedances should  
be reduced as much as possible since any ground potential  
differences between the signal source and the ADC appear as  
an error voltage in series with the input signal. In addition to  
ground drops, inductive and capacitive coupling needs to be  
considered. This is especially true when high accuracy analog  
input signals share the same board with digital signals. Thus, to  
minimize input noise coupling, the input signal leads to VIN and  
the signal return leads from AGND should be kept as short as  
possible. In addition, power supplies should also be decoupled  
to filter out ac noise.  
GROUNDING  
The AD974 has three ground pins; AGND1, AGND2 and  
DGND. The analog ground pins are the “high quality” ground  
reference points and should be connected to the system analog  
common. AGND2 is the ground to which most internal ADC  
analog signals are referenced. This ground is most susceptible to  
current-induced voltage drops and thus must be connected with  
the least resistance back to the power supply. AGND1 is the low  
current analog supply ground and should be the analog common  
for the external reference, input op amp drive circuitry and the  
input resistor divider circuit. By applying the inputs referenced  
to this ground, any ground variations will be offset and have a  
minimal effect on the resulting analog input to the ADC. The  
digital ground pin, DGND, is the reference point for all of the  
digital signals that control the AD974.  
Analog and digital signals should not share a common path.  
Each signal should have an appropriate analog or digital return  
routed close to it. Using this approach, signal loops enclose a  
small area, minimizing the inductive coupling of noise. Wide  
PC tracks, large gauge wire and ground planes are highly rec-  
ommended to provide low impedance signal paths. Separate  
analog and digital ground planes are also recommended with a  
single interconnection point to minimize ground loops. Analog  
signals should be routed as far as possible from high speed  
digital signals and if absolutely necessary, should only cross  
them at right angles.  
The AD974 can be powered with two separate power supplies or  
with a single analog supply. When the system digital supply is  
noisy, or fast switching digital signals are present, it is recom-  
mended to connect the analog supply to both the VANA and VDIG  
pins of the AD974 and the system supply to the remaining  
digital circuitry. With this configuration, AGND1, AGND2 and  
DGND should be connected back at the ADC. When there is  
significant bus activity on the digital output pins, the digital and  
analog supply pins on the ADC should be separated. This would  
eliminate any high speed digital noise from coupling back to the  
analog portion of the AD974. In this configuration, the digital  
ground pin DGND should be connected to the system digital  
ground and be separate from the AGND pins.  
In addition, it is recommended that multilayer PC boards be  
used with separate power and ground planes. When designing  
the separate sections, careful attention should be paid to the  
layout.  
REV. A  
–19–  
AD974  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
28-Lead 300 Mil Plastic DIP  
(N-28B)  
1.425 (38.195)  
1.385 (35.179)  
15  
28  
0.280 (7.11)  
14 0.240 (6.10)  
1
0.325 (8.25)  
0.300 (7.62)  
PIN 1  
0.015 (0.381)  
MIN  
0.210  
(5.33)  
MAX  
SEATING  
PLANE  
0.195 (4.95)  
0.115 (2.93)  
0.150 (3.81)  
0.115 (2.92)  
0.014 (0.356)  
0.008 (0.204)  
0.022 (0.558) 0.100 (2.54) 0.070 (1.77)  
BSC  
0.014 (0.356)  
0.045 (1.15)  
28-Lead Wide Body (SOIC)  
(R-28)  
0.7125 (18.10)  
0.6969 (17.70)  
28  
15  
1
14  
0.1043 (2.65)  
0.0926 (2.35)  
PIN 1  
0.0291 (0.74)  
x 45°  
0.0098 (0.25)  
8°  
0°  
0.0500  
(1.27)  
BSC  
0.0192 (0.49)  
0.0138 (0.35)  
0.0118 (0.30)  
0.0040 (0.10)  
SEATING  
PLANE  
0.0500 (1.27)  
0.0125 (0.32)  
0.0157 (0.40)  
0.0091 (0.23)  
28-Lead Shrink Small Outline Package (SSOP)  
(RS-28)  
0.407 (10.34)  
0.397 (10.08)  
28  
15  
14  
1
PIN 1  
0.07 (1.79)  
0.078 (1.98)  
0.068 (1.73)  
0.066 (1.67)  
8°  
0°  
0.0256  
(0.65)  
BSC  
0.015 (0.38)  
0.010 (0.25)  
0.008 (0.203)  
0.002 (0.050)  
SEATING  
PLANE  
0.009 (0.229)  
0.005 (0.127)  
0.03 (0.762)  
0.022 (0.558)  
–20–  
REV. A  

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