ADA4099-2BRMZ-RL7 [ADI]

50 V, 8 MHz, 1.5 mA per Channel, Robust, Over-The-Top, Precision Op Amps;
ADA4099-2BRMZ-RL7
型号: ADA4099-2BRMZ-RL7
厂家: ADI    ADI
描述:

50 V, 8 MHz, 1.5 mA per Channel, Robust, Over-The-Top, Precision Op Amps

文件: 总34页 (文件大小:1962K)
中文:  中文翻译
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Data Sheet  
ADA4099-1/ADA4099-2  
50 V, 8 MHz, 1.5 mA per Channel, Robust, Over-The-Top, Precision Op Amps  
FEATURES  
GENERAL DESCRIPTION  
Ultrawide common-mode range: −VS − 0.1 V to −VS + 70 V  
Wide power supply voltage range: (VSY): +3.15 V to +50 V (±25  
V for PSRR)  
Low supply current: 1.5 mA per channel (typical)  
Low input offset voltage: ±40 µV maximum  
Low input offset voltage drift: ±0.4 μV/°C maximum  
Low voltage noise:  
1/f noise corner: 6 Hz typical  
150 nV p-p typical at 0.1 Hz to 10 Hz  
7 nV/√Hz typical at 100 Hz (en)  
High speed  
GBP: 8 MHz typical  
Slew rate: 5.5 V/µs typical at ΔVOUT = 25 V  
Low power shutdown: 20 µA maximum  
Low input bias current: ±10 nA maximum  
Large signal voltage gain: 120 dB minimum  
CMRR: 118 dB, minimum  
The ADA4099-1 and ADA4099-2 are single/dual robust, precision,  
rail-to-rail input/output operational amplifiers (op amps) with inputs  
that operate from −VS to +VS and beyond, which is referred to  
in this data sheet as Over-The-Top . The devices feature offset  
voltages of <40 µV, input bias currents (IB) of <10 nA, and can  
operate on single or split supplies that range from 3.15 V to 50 V.  
The ADA4099-1 and ADA4099-2 draws 1.5 mA of quiescent current  
per channel.  
The ADA4099-1 and ADA4099-2 Over-The-Top input stages have  
robust input protection features for abusive environments. The  
inputs can tolerate up to 80 V of differential voltage without damage  
or degradation to dc accuracy. The operating input common-mode  
range extends from rail-to-rail and beyond, up to 70 V > –VS,  
independent of the +VS supply.  
The ADA4099-1 and ADA4099-2 are unity-gain stable and can  
drive loads requiring up to 20 mA per channel. The device can  
also drive capacitive loads as large as 100 pF. The amplifiers are  
available with low power shutdown.  
The ADA4099-1 is available in a standard, 6-lead, thin small outline  
transistor (TSOT) package. The ADA4099-2 is available in an 8-  
lead, standard small outline package (SOIC_N), 8-lead, mini small  
outline package (MSOP), and a 10-lead, lead frame chip scale  
package (LFCSP).  
PSRR: 123 dB, minimum  
Input overdrive tolerant with no phase reversal  
±2 kV HBM and ±1.25 kV FICDM  
Wide temperature range: −55°C to +150°C (H grade)  
APPLICATIONS  
Industrial sensor conditioning  
Supply current sensing  
Battery and power supply monitoring  
Front-end amplifiers in abusive environments  
4 mA to 20 mA transmitters  
TYPICAL APPLICATION CIRCUIT  
Figure 1. 1 V/A Over-The-Top Current Sense Application (ADA4099-1 6-lead  
TSOT)  
Figure 2. Output Error vs. Load Current  
Rev. A  
Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog  
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to  
change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
DOCUMENT FEEDBACK  
TECHNICAL SUPPORT  
Data Sheet  
ADA4099-1/ADA4099-2  
TABLE OF CONTENTS  
Features................................................................ 1  
Applications........................................................... 1  
General Description...............................................1  
Typical Application Circuit......................................1  
Specifications........................................................ 3  
5 V Supply..........................................................3  
±15 V Supply......................................................5  
Absolute Maximum Ratings...................................8  
Maximum Power Dissipation..............................8  
Thermal Resistance........................................... 8  
Electrostatic Discharge (ESD) Ratings...............8  
ESD Caution.......................................................9  
Pin Configurations and Function Descriptions.....10  
Typical Performance Characteristics...................12  
Theory of Operation.............................................20  
Input Protection................................................ 21  
Over-The-Top Operation Considerations......... 21  
Output...............................................................22  
Shutdown Pins................................................. 22  
Applications Information...................................... 24  
Large Resistor Gain Operation.........................24  
Recommended Values for Various Gains.........24  
Noise................................................................ 25  
Distortion.......................................................... 25  
Power Dissipation and Thermal Shutdown...... 26  
Circuit Layout Considerations.......................... 26  
Power Supply Bypassing..................................26  
Grounding.........................................................26  
ESD Protection when Powered........................27  
Related Products..............................................27  
Typical Applications..........................................28  
Outline Dimensions............................................. 30  
Ordering Guide.................................................34  
Evaluation Boards............................................ 34  
REVISION HISTORY  
1/2022—Rev. 0 to Rev. A  
Added ADA4099-2...........................................................................................................................................1  
Change to Data Sheet Title..............................................................................................................................1  
Changes to Features Section.......................................................................................................................... 1  
Changes to General Description Section.........................................................................................................1  
Changes to 5 V Supply Section and Table 1....................................................................................................3  
Changes to ±15 V Supply Section and Table 2................................................................................................5  
Changes to Table 3..........................................................................................................................................8  
Changes to Table 4..........................................................................................................................................8  
Change to Table 6 Title..................................................................................................................................10  
Added Figure 5, Figure 6, Table 7, and Table 8; Renumbered Sequentially..................................................10  
Added Figure 50............................................................................................................................................ 19  
Changes to Shutdown Pins Section and Title................................................................................................22  
Changes to Power Supply Bypassing............................................................................................................26  
Changes to Table 10......................................................................................................................................27  
Added Figure 76, Figure 77, and Figure 78...................................................................................................30  
Changes to Ordering Guide...........................................................................................................................34  
1/2021—Revision 0: Initial Version  
analog.com  
Rev. A | 2 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
SPECIFICATIONS  
5 V SUPPLY  
Common-mode voltage (VCM) = 2.5 V, SHDN pin (ADA4099-1) and SHDNx pins (ADA4099-2 10-lead LFCSP) are open, load resistance (RL) =  
499 kΩ to midsupply, ambient temperature (TA) = 25°C, unless otherwise noted.  
Table 1.  
Parameter  
Test Conditions/Comments  
B Grade  
Typ  
H Grade  
Typ  
Unit  
Min  
Max  
Min  
Max  
DC PERFORMANCE  
1
Input Offset Voltage (VOS  
)
0.25 V < VCM < 3.25 V  
±10  
±40  
±90  
±10  
±40  
±90  
µV  
µV  
Minimum temperature (TMIN) < TA  
<
maximum temperature (TMAX  
0.25 V < VCM < 70 V  
TMIN < TA < TMAX  
)
±25  
±25  
±65  
±125  
±70  
±125  
±0.4  
±10  
±15  
98  
±25  
±25  
±65  
±140  
±70  
±200  
±0.8  
±10  
±30  
98  
µV  
µV  
µV  
µV  
µV/°C  
nA  
nA  
µA  
µA  
µA  
µA  
nA  
nA  
µA  
µA  
dB  
−0.1 V < VCM < +70 V  
TMIN < TA < TMAX  
Input Offset Voltage Drift2  
Input Bias Current (IB)  
TMIN < TA < TMAX  
±0.1  
±4  
±0.1  
±4  
TMIN < TA < TMAX  
VCM = 70 V, Over-The-Top  
TMIN < TA < TMAX  
70  
40  
82.5  
0.001  
±2  
70  
40  
82.5  
0.001  
±2  
125  
10  
125  
10  
0 V < VCM < 70 V, VSY = 0 V  
TMIN < TA < TMAX  
25  
25  
Input Offset Current (IOS  
)
±4  
±4  
TMIN < TA < TMAX  
VCM = 70 V, Over-The-Top3  
±10  
±2  
±20  
±2  
±0.5  
136  
±0.5  
136  
TMIN < TA < TMAX  
±5  
±5  
Common-Mode Rejection Ratio  
(CMRR)  
VCM = −0.1 V to +70 V  
118  
118  
TMIN < TA < TMAX  
110  
108  
dB  
dB  
dB  
V
VCM = 0.25 V to 3.25 V  
TMIN < TA < TMAX  
114  
132  
114  
132  
108  
108  
Common-Mode Input Range  
Guaranteed by CMRR tests  
ΔVOUT = 4 V  
−VS − 0.1  
126  
−VS + 70  
−VS − 0.1  
126  
−VS + 70  
Large Signal Voltage Gain (AOL  
)
140  
130  
140  
130  
dB  
dB  
dB  
dB  
TMIN < TA < TMAX  
116  
110  
ΔVOUT = 4 V, RL = 10 kΩ  
TMIN < TA < TMAX  
120  
120  
110  
102  
NOISE PERFORMANCE  
Input Voltage Noise  
Frequency (f) = 0.1 Hz to 10 Hz  
1/f noise corner  
150  
6
150  
6
nV p-p  
Hz  
f = 100 Hz  
7
7
nV/√Hz  
nV/√Hz  
pA/√Hz  
pA/√Hz  
Over-The-Top  
Input Current Noise  
Over-The-Top  
f = 100 Hz, VCM > 5 V  
f = 100 Hz  
8
8
0.5  
5
0.5  
5
f = 100 Hz, VCM > 5 V  
DYNAMIC PERFORMANCE  
Slew Rate  
ΔVOUT = 2 V  
2.7  
4
8
2.7  
1.75  
7.5  
4
8
V/μs  
V/μs  
MHz  
MHz  
Degrees  
μs  
TMIN < TA < TMAX  
1.75  
7.5  
Gain Bandwidth Product (GBP)  
Test frequency (fTEST) = 25 kHz  
TMIN < TA < TMAX  
6.75  
6.5  
Phase Margin  
47  
47  
1% Settling Time  
ΔVOUT = ±2 V  
1.15  
1.15  
analog.com  
Rev. A | 3 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
SPECIFICATIONS  
Table 1.  
Parameter  
Test Conditions/Comments  
B Grade  
Typ  
H Grade  
Typ  
Unit  
Min  
Max  
Min  
Max  
0.1% Settling Time  
ΔVOUT = ±2 V  
1.5  
1.5  
μs  
%
Total Harmonic Distortion Plus Noise  
(THD + N)  
f = 10 kHz, VOUT = 2 V p-p, RL = 10 kΩ,  
bandwidth = 80 kHz  
0.001  
0.001  
Channel Separation  
INPUT CHARACTERISTICS  
Input Resistance  
f = 1 kHz, RL = 2 kΩ  
115  
115  
dB  
Differential mode  
100  
>1  
100  
>1  
kΩ  
GΩ  
Common mode  
Over-The-Top  
Differential mode, VCM > 5 V  
Common mode, VCM > 5 V  
Differential mode  
600  
>100  
9
600  
>100  
9
MΩ  
pF  
pF  
Input Capacitance  
Common mode  
3
3
SHDN AND SHDNx PINS  
Input Logic Low  
Amplifier active, SHDN and SHDNx  
voltage (VSHDN) < −VS + 0.5 V, TMIN  
< TA < TMAX  
−VS + 0.5  
−VS + 0.5  
V
V
Input Logic High  
Response Time  
Pull-Down Current  
Amplifier shutdown, VSHDN  
>
−VS + 1.5  
−VS + 1.5  
−VS + 1.5 V, TMIN < TA < TMAX  
Amplifier active to shutdown  
2.5  
10  
2.5  
10  
μs  
μs  
µA  
µA  
Amplifier shutdown to active  
VSHDN = −VS + 0.5 V, TMIN < TA < TMAX  
VSHDN = −VS + 1.5 V, TMIN < TA < TMAX  
0.6  
0.3  
3
0.6  
0.3  
3
2.5  
2.5  
OUTPUT CHARACTERISTICS  
Output Voltage Swing Low  
Overdrive voltage (VOD4) = 30 mV, no  
load  
45  
60  
45  
60  
mV  
TMIN < TA < TMAX  
105  
325  
120  
325  
mV  
mV  
VOD = 30 mV, sink current, (ISINK) =  
10 mA  
260  
260  
TMIN < TA < TMAX  
VOD = 30 mV, no load  
TMIN < TA < TMAX  
VOD = 30 mV, source current,  
(ISOURCE) = 10 mA  
TMIN < TA < TMAX  
ISOURCE  
435  
55  
450  
55  
mV  
mV  
mV  
mV  
Output Voltage Swing High  
Short-Circuit Current  
45  
45  
110  
1100  
140  
1100  
900  
900  
1500  
1650  
mV  
mA  
mA  
mA  
mA  
nA  
20  
15  
40  
20  
30  
20  
15  
40  
20  
30  
TMIN< TA < TMAX  
ISINK  
50  
50  
TMIN < TA < TMAX  
Output Pin Leakage During Shutdown VSHDN = −VS + 1.5 V  
TMIN < TA < TMAX  
±0.01  
±100  
±10  
±0.01  
±100  
±10  
µA  
POWER SUPPLY  
Maximum Operating Voltage5  
50  
50  
50  
50  
V
V
Voltage Range  
Guaranteed by power supply rejection  
3.15  
3.15  
ratio (PSRR)  
Supply Current/Channel  
Amplifier active  
TMIN < TA < TMAX  
1.5  
12  
1.6  
2.2  
20  
1.5  
12  
1.6  
2.35  
20  
mA  
mA  
µA  
Amplifier shutdown VSHDN = −VS + 1.5  
V
TMIN < TA < TMAX  
22.5  
22.5  
µA  
analog.com  
Rev. A | 4 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
SPECIFICATIONS  
Table 1.  
Parameter  
Test Conditions/Comments  
B Grade  
Typ  
H Grade  
Typ  
Unit  
Min  
Max  
Min  
Max  
PSRR  
VSY = 3.15 V to ±25 V  
TMIN < TA < TMAX  
123  
119  
136  
123  
120  
136  
dB  
dB  
THERMAL SHUTDOWN6  
Temperature  
Junction temperature (TJ)  
Ambient temperature (TA)  
175  
20  
175  
20  
°C  
°C  
°C  
Hysteresis  
Operating Temperature  
−40  
+125  
−55  
+150  
1
Thermoelectric voltages present in the high speed production test limit the measurement accuracy of this parameter. The limits shown in Table 1 are determined by test  
capability and are not necessarily indicative of actual device performance.  
2
3
Offset voltage drift is guaranteed through lab characterization and is not production tested.  
Test accuracy is limited by high speed production test equipment repeatability. Bench measurements indicate that the input offset current in Over-The-Top configuration is  
typically controlled to under 250 nA at +25°C and 1000 nA over the −55°C < TA < +150°C temperature range.  
4
5
VOD is +30 mV for VOUT high and −30 mV for VOUT low.  
Maximum operating voltage is limited by the time-dependent dielectric breakdown (TDDB) of on-chip capacitor oxides. The amplifier tolerates temporary transient overshoot  
up to the specified absolute maximum rating, but the dc supply voltage must be limited to the maximum operating voltage.  
6
Thermal shutdown is lab characterized only and is not tested in production.  
±15 V SUPPLY  
VCM = 0 V, SHDN pin (ADA4099-1) and SHDNx pins (ADA4099-2 10-lead LFCSP) are open, RL = 499 kΩ to ground, and TA = 25°C, unless  
otherwise noted.  
Table 2.  
B Grade  
Typ  
H Grade  
Typ  
Parameter  
Test Conditions/Comments  
Min  
Max  
Min  
Max  
Unit  
DC PERFORMANCE  
1
Input Offset Voltage (VOS  
)
±12  
±15  
±40  
±95  
±40  
±105  
±12  
±15  
±40  
±90  
±40  
±90  
µV  
µV  
µV  
µV  
TMIN < TA < TMAX  
VSY = ±25 V  
TMIN < TA < TMAX  
Input Offset Voltage Drift2  
Input Bias Current  
TMIN < TA < TMAX  
±0.1  
±4  
±0.4  
±10  
±25  
±10  
±35  
±5  
±0.1  
±4  
±0.9  
±10  
±60  
±10  
±100  
±5  
µV/°C  
nA  
nA  
nA  
nA  
nA  
nA  
nA  
nA  
dB  
dB  
dB  
dB  
dB  
dB  
V
TMIN < TA < TMAX  
VSY = ±25 V  
±4  
±4  
TMIN < TA < TMAX  
Input Offset Current  
CMRR  
±2  
±2  
TMIN < TA < TMAX  
±15  
±5  
±30  
±5  
VSY = ±25 V  
±4  
±4  
TMIN < TA < TMAX  
±20  
±35  
VCM = −14.75 V to +13.25 V  
TMIN < TA < TMAX  
118  
112  
115  
105  
117  
110  
−15.1  
130  
126  
126  
118  
114  
115  
101  
117  
107  
−15.1  
130  
126  
126  
VCM = −15.1 V to +13.25 V  
TMIN < TA < TMAX  
VCM = −15.1 V to +55 V  
TMIN < TA < TMAX  
Common-Mode Input Range  
Guaranteed by CMRR tests  
+55  
+55  
analog.com  
Rev. A | 5 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
SPECIFICATIONS  
Table 2.  
B Grade  
Typ  
H Grade  
Parameter  
Test Conditions/Comments  
Min  
Max  
Min  
Typ  
Max  
Unit  
AOL  
ΔVOUT = 25 V  
134  
120  
120  
114  
154  
134  
116  
120  
110  
154  
dB  
dB  
dB  
dB  
TMIN < TA < TMAX  
ΔVOUT = 25 V, RL =10 kΩ  
TMIN < TA < TMAX  
134  
134  
NOISE PERFORMANCE  
Input Voltage Noise  
f = 0.1 Hz to 10 Hz  
1/f noise corner  
f = 100 Hz  
150  
6
150  
6
nV p-p  
Hz  
7
7
nV/√Hz  
nV/√Hz  
pA/√Hz  
pA/√Hz  
Over-The-Top  
Input Current Noise  
Over-The-Top  
f = 100 Hz, VCM > +VS  
f = 100 Hz  
8
8
0.5  
5
0.5  
5
f = 100 Hz, VCM > +VS  
DYNAMIC PERFORMANCE  
Slew Rate  
ΔVOUT = 25 V  
3.5  
2.0  
5.5  
8
3.5  
2.0  
7.5  
6.5  
5.5  
8
V/μs  
V/μs  
MHz  
MHz  
Degrees  
μs  
TMIN < TA < TMAX  
fTEST = 25 kHz  
TMIN < TA < TMAX  
GBP  
7.5  
6.75  
Phase Margin  
1% Settling Time  
0.1% Settling Time  
THD + N  
57  
57  
ΔVOUT = ±2 V  
ΔVOUT = ±2 V  
1.15  
1.5  
1.15  
1.5  
μs  
f = 10 kHz, VOUT = 5.6 V p-p, RL  
10 kΩ, bandwidth = 80 kHz  
=
0.001  
0.001  
%
Channel Separation  
INPUT CHARACTERISTICS  
Input Resistance  
f = 1 kHz, RL = 2 kΩ  
115  
115  
dB  
Differential mode  
Common mode  
Differential mode  
Common mode  
100  
>1  
9
100  
>1  
9
kΩ  
GΩ  
pF  
Input Capacitance  
3
3
pF  
SHDN AND SHDNx PINS  
Input Logic Low  
Amplifier active, VSHDN < −VS + 0.5 V  
−VS + 0.5  
−VS + 0.5  
V
Input Logic High  
Amplifier shutdown, VSHDN > −VS + 1.5 V −VS + 1.5  
Amplifier active to shutdown  
−VS + 1.5  
V
Response Time  
2.5  
10  
2.5  
10  
μs  
μs  
µA  
µA  
Amplifier shutdown to active  
Pull-Down Current  
VSHDN = −VS + 0.5 V, TMIN < TA < TMAX  
VSHDN = −VS + 1.5 V, TMIN < TA < TMAX  
0.6  
0.3  
3
0.6  
0.3  
3
2.5  
2.5  
OUTPUT CHARACTERISTICS  
Output Voltage Swing Low  
VOD3 = 30 mV, no load  
TMIN < TA < TMAX  
45  
60  
45  
60  
mV  
mV  
mV  
mV  
mV  
mV  
mV  
mV  
115  
325  
435  
55  
125  
325  
450  
55  
VOD = 30 mV, ISINK = 10 mA  
TMIN < TA < TMAX  
260  
45  
260  
45  
Output Voltage Swing High  
VOD = 30 mV, no load  
TMIN < TA < TMAX  
140  
1100  
1500  
165  
1100  
1650  
VOD = 30 mV, ISOURCE = 10 mA  
TMIN < TA < TMAX  
900  
900  
analog.com  
Rev. A | 6 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
SPECIFICATIONS  
Table 2.  
B Grade  
Typ  
H Grade  
Parameter  
Test Conditions/Comments  
Min  
Max  
Min  
Typ  
Max  
Unit  
Short-Circuit Current  
ISOURCE  
25  
20  
40  
20  
34  
25  
20  
40  
20  
34  
mA  
mA  
mA  
mA  
TMIN < TA < TMAX  
ISINK  
50  
50  
TMIN < TA < TMAX  
POWER SUPPLY  
Maximum Operating Voltage4  
50  
50  
1.8  
2.45  
2
50  
50  
1.8  
2.6  
2
V
Voltage Range  
Guaranteed by PSRR  
Amplifier active  
3.15  
3.15  
V
Supply Current/Channel  
1.65  
1.75  
17  
1.65  
1.75  
17  
mA  
mA  
mA  
mA  
µA  
µA  
dB  
dB  
TMIN < TA < TMAX  
VSY = ±25 V  
TMIN < TA < TMAX  
2.7  
24  
27  
2.85  
24  
27  
Amplifier shutdown, VSHDN = −VS + 1.5 V  
TMIN < TA < TMAX  
PSRR  
VSY = 3.15 V to 50 V  
TMIN < TA < TMAX  
123  
119  
136  
123  
120  
136  
THERMAL SHUTDOWN5  
Temperature  
TJ  
175  
20  
175  
20  
°C  
°C  
°C  
Hysteresis  
Operating Temperature  
TA  
−40  
+125  
−55  
+150  
1
Thermoelectric voltages present in the high speed production test limit the measurement accuracy of this parameter. The limits shown in Table 2 are determined by test  
capability and are not necessarily indicative of actual device performance.  
2
3
4
Offset voltage drift is guaranteed through lab characterization and is not production tested.  
VOD is +30 mV for VOUT high and −30 mV for VOUT low.  
Maximum operating voltage is limited by the TDDB of on-chip capacitor oxides. The amplifier tolerates temporary transient overshoot up to the specified absolute maximum  
rating and the dc supply voltage must be limited to the maximum operating voltage.  
5
Thermal shutdown is lab characterized only and is not tested in production.  
analog.com  
Rev. A | 7 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
ABSOLUTE MAXIMUM RATINGS  
Table 3.  
The PD due to the load drive depends on the application. The PD  
due to load drive is calculated by multiplying the load current by  
the associated voltage drop across the device. RMS voltages and  
currents must be used in these calculations.  
Parameter  
Rating  
Supply Voltage1  
Transient  
60 V  
Continuous  
50 V  
Airflow increases heat dissipation, effectively reducing θJA. Addi-  
tional metal that is directly in contact with the package leads from  
metal traces through vias, ground, and power planes reduces θJA  
Power Dissipation (PD)  
Differential Input Voltage  
±IN Pin Voltage  
See Figure 3  
±80 V  
.
Figure 3 shows the maximum PD vs. TA for the single and dual  
Continuous  
−5 V to +80 V  
−10 V to +80 V  
20 mA  
6-lead TSOT packages on a JEDEC standard, 4layer board, with  
−VS connected to a pad that is thermally connected to a printed  
circuit board (PCB) plane. θJA values are approximations.  
Survival  
±IN Pin Current  
SHDN and SHDNx Voltage2  
Storage Temperature Range  
Operating Temperature Range  
Lead Temperature (Soldering, 10 sec)  
Junction Temperature (TJ)  
−0.3 V to +60 V  
−65°C to +150°C  
−55°C to +150°C  
300°C  
175°C  
1
Maximum supply voltage is limited by the TDDB of on-chip capacitor oxides.  
The amplifiers tolerate temporary transient overshoot up to the specified  
transient maximum rating. The continuous operating supply voltage must be  
limited to no more than 50 V.  
2
SHDN is Pin 5 on the ADA4099-1. SHDNx refers to SHDN1 and SHDN2 (Pin 5  
and Pin 6, respectively) on the ADA4099-2 10-lead LFCSP).  
Stresses at or above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress rating  
only; functional operation of the product at these or any other  
conditions above those indicated in the operational section of this  
specification is not implied. Operation beyond the maximum operat-  
ing conditions for extended periods may affect product reliability.  
Figure 3. Maximum Power Dissipation vs. Ambient Temperature  
THERMAL RESISTANCE  
Junction temperatures (TJ) exceeding 125°C promote accelerated  
aging. The ADA4099-1 and ADA4099-2 demonstrates ±25 V supply  
operation beyond 1400 hours at TA = 140°C.  
Thermal performance is directly linked to PCB design and operating  
environment. Careful attention to PCB thermal design is required.  
θJA is the junction to ambient thermal resistance.  
MAXIMUM POWER DISSIPATION  
Table 4. Thermal Resistance  
The maximum safe power dissipation (PD) on the device is limited  
by the associated rise in either case temperature (TC) or TJ on  
the die. At approximately TC = 150°C, which is the glass transition  
temperature, the properties of the plastic changes. Exceeding this  
temperature limit, even temporarily, may change the stresses that  
the package exerts on the die, which permanently shifts the para-  
metric performance of the ADA4099-1 and ADA4099-2. Exceeding  
TJ = 175°C for an extended period may result in changes in the  
silicon devices and may cause failure of the device.  
Package Type  
θJA  
Unit  
UJ-6  
192  
120  
163  
43  
°C/W  
°C/W  
°C/W  
°C/W  
R-8  
RM-8  
05-08-1699  
ELECTROSTATIC DISCHARGE (ESD) RATINGS  
The following ESD information is provided for handling of ESD-sen-  
sitive devices in an ESD protected area only.  
The PD on the package is the sum of the quiescent power dissipa-  
tion and the power dissipated in the package due to the output load  
drive. The quiescent power is expressed in the following equation:  
Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.  
Field induced charged device model (FICDM) per ANSI/ESDA/JE-  
DEC JS-002.  
VSY × ISY  
where ISY is the quiescent current.  
analog.com  
Rev. A | 8 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
ABSOLUTE MAXIMUM RATINGS  
ESD Ratings for ADA4099-1 and ADA4099-2  
ESD CAUTION  
Table 5. ADA4099-1 6-Lead TSOT, ADA4099-2 8-Lead SOIC_N, ADA4099-2  
8-Lead MSOP, ADA4099-2 10-Lead LFCSP  
ESD (electrostatic discharge) sensitive device. Charged devi-  
ces and circuit boards can discharge without detection. Although  
this product features patented or proprietary protection circuitry,  
damage may occur on devices subjected to high energy ESD.  
Therefore, proper ESD precautions should be taken to avoid  
performance degradation or loss of functionality.  
ESD Model  
Withstand Threshold (kV)  
Class  
HBM  
±2  
2
3
FICDM  
±1.25  
analog.com  
Rev. A | 9 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
Figure 4. Pin Configuration for ADA4099-1 6-Lead TSOT  
Table 6. Pin Function Descriptions for ADA4099-1 6-Lead TSOT  
Pin No. Mnemonic Description  
1
2
VOUT  
−VS  
Amplifier Output.  
Negative Power Supply. In single-supply applications, this pin is normally soldered to a low impedance ground plane. In split supply applications,  
bypass this pin with a capacitance of at least 0.1 μF to a low impedance ground plane, as close to the pin as possible.  
3
4
5
+IN  
Noninverting Input of the Amplifier.  
Inverting Input of the Amplifier.  
−IN  
SHDN  
Op Amp Shutdown. The threshold for shutdown is approximately 1 V above the negative supply. If this pin is not connected or hard tied to −VS, the  
amplifier is active. If asserted high (VSHDN > −VS + 1.5 V), the amplifier is placed in a shutdown state, and the output of the amplifier goes to a high  
impedance state. If this pin is left unconnected, it is recommended to connect a small capacitor of 1 nF between SHDN and −VS to prevent signals  
from −IN from capacitively coupling to the SHDN pin.  
6
+VS  
Positive Power Supply. Bypass this pin with a capacitance of at least 0.1 μF to a low impedance ground plane, as close to the pin as possible.  
Figure 5. Pin Configuration for ADA4099-2 8-Lead SOIC_N and 8-Lead MSOP  
Table 7. Pin Function Descriptions for ADA4099-2 8-Lead SOIC_N and 8-Lead MSOP  
Pin No. Mnemonic Description  
1
2
3
4
VOUT1  
−IN1  
+IN1  
−VS  
Amplifier Output, Channel 1.  
Inverting Input of the Amplifier, Channel 1.  
Noninverting Input of the Amplifier, Channel 1.  
Negative Power Supply. In single-supply applications, this pin is normally soldered to a low impedance ground plane. In split supply applications,  
bypass this pin with a capacitance of at least 0.1 μF to a low impedance ground plane, as close to the pin as possible.  
5
6
7
8
+IN2  
−IN2  
VOUT2  
+VS  
Inverting Input of the Amplifier, Channel 2.  
Noninverting Input of the Amplifier, Channel 2.  
Amplifier Output, Channel 2.  
Positive Power Supply. Bypass this pin with a capacitance of at least 0.1 μF to a low impedance ground plane, as close to the pin as possible.  
analog.com  
Rev. A | 10 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
Figure 6. Pin Configuration for ADA4099-2 10-Lead LFCSP  
Table 8. Pin Function Descriptions for ADA4099-2 10-Lead LFCSP  
Pin No. Mnemonic Description  
1
2
3
4
VOUT1  
−IN1  
+IN1  
−VS  
Amplifier Output, Channel 1.  
Inverting Input of the Amplifier, Channel 1.  
Noninverting Input of the Amplifier, Channel 1.  
Negative Power Supply. In single-supply applications, this pin is normally soldered to a low impedance ground plane. In split supply applications,  
bypass this pin with a capacitance of at least 0.1 μF to a low impedance ground plane, as close to the pin as possible.  
5
SHDN1  
Op Amp Shutdown, Channel 1. The threshold for shutdown is approximately 1 V above the negative supply. If this pin is not connected or hard tied to  
−VS, the amplifier is active. If asserted high (VSHDN > −VS + 1.5 V), the amplifier is placed in a shutdown state, and the output of the amplifier goes to  
a high impedance state. If this pin is left unconnected, it is recommended to connect a small capacitor of 1 nF between SHDN1 and −VS to prevent  
signals from −IN from capacitively coupling to the SHDN1 pin.  
6
SHDN2  
Op Amp Shutdown, Channel 2. The threshold for shutdown is approximately 1 V above the negative supply. If this pin is not connected or hard tied to  
−VS, the amplifier is active. If asserted high (VSHDN > −VS + 1.5 V), the amplifier is placed in a shutdown state, and the output of the amplifier goes to  
a high impedance state. If this pin is left unconnected, it is recommended to connect a small capacitor of 1 nF between SHDN2 and −VS to prevent  
signals from −IN from capacitively coupling to the SHDN2 pin.  
7
+IN2  
−IN2  
VOUT2  
+VS  
Inverting Input of the Amplifier, Channel 2.  
8
Noninverting Input of the Amplifier, Channel 2.  
9
Amplifier Output, Channel 2.  
10  
Positive Power Supply. Bypass this pin with a capacitance of at least 0.1 μF to a low impedance ground plane, as close to the pin as possible.  
Exposed Pad. Connect the exposed pad to −VS.  
EPAD  
analog.com  
Rev. A | 11 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 7. Supply Current vs. Supply Voltage  
Figure 10. Shutdown Supply Current vs. Supply Voltage  
Figure 8. Supply Current vs. Temperature Across Various Supply Voltages  
Figure 11. Typical Distribution of Input Offset Voltage, VSY = 5 V  
Figure 9. Supply Current vs. VSHDN with Respect to −VS  
Figure 12. Typical Distribution of Input Offset Voltage with VSY = ±15 V  
analog.com  
Rev. A | 12 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 13. Typical Distribution of Input Offset Voltage with VSY = ±25 V  
Figure 16. Offset Voltage vs. Temperature with VSY = ±25 V  
Figure 14. Offset Voltage vs. Temperature with VSY = 5 V  
Figure 17. Midsupply Input Bias Current vs. Temperature with VSY = 5 V  
Figure 15. Offset Voltage vs. Temperature with VSY = ±15 V  
Figure 18. Midsupply Input Bias Current vs. Temperature with VSY = ±15 V  
analog.com  
Rev. A | 13 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 19. Offset Voltage vs. Temperature with VCM = 6 V, Over-The-Top  
Figure 22. Input Bias Current vs. Temperature with VSY = 5 V, Over-The-Top  
Figure 20. Offset Voltage vs. Temperature with VCM = 70 V  
Figure 23. Midsupply Input Bias Current vs. Temperature Across Various  
Supply Voltages  
Figure 21. Over-The-Top Input Bias Current vs. Temperature with VCM = 6 V  
Figure 24. Offset Voltage vs. Temperature Across Various Supply Voltages  
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Rev. A | 14 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 25. Offset Voltage vs. Input Common-Mode Voltage over the Input  
Common-Mode Range  
Figure 28. Offset Voltage vs. Input Common-Mode Voltage for Ground  
Sensing Applications  
Figure 26. Offset Voltage vs. Input Common-Mode Voltage from Normal  
Operation to Over-The-Top Operation  
Figure 29. Input Bias Current vs. Input Common-Mode Voltage for Ground  
Sensing Applications  
Figure 27. Input Bias Current vs. Input Common-Mode Voltage from Normal  
Operation to Over-The-Top Operation  
Figure 30. Input Bias Current vs. Input Common-Mode Voltage  
analog.com  
Rev. A | 15 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 31. Supply Current vs. Minimum Supply Voltage  
Figure 34. Δ Offset Voltage vs. Output Voltage (VOUT)  
Figure 32. Offset Voltage vs. Minimum Supply Voltage  
Figure 35. Δ Offset Voltage vs. VOUT (2 kΩ Load)  
Figure 33. Offset Voltage vs. Supply Voltage  
Figure 36. SHDN Pin Current vs. VSHDN with Respect to −VS over Various  
Temperatures  
analog.com  
Rev. A | 16 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 37. Output Voltage Low (VOL) and Output Voltage High (VOH) vs.  
Temperature  
Figure 40. Noninverting Small Signal Frequency Response  
Figure 41. Inverting Small Signal Frequency Response  
Figure 38. Gain Bandwidth vs. Temperature  
Figure 39. Loop Gain and Phase vs. Frequency  
Figure 42. Unity-Gain Output Noise Density vs. Frequency  
analog.com  
Rev. A | 17 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 46. THD + N vs. Frequency over Load  
Figure 43. 0.1 Hz to 10 Hz Noise  
Figure 47. THD + N vs. Output Amplitude  
Figure 44. Unity-Gain Small Signal Step Response  
Figure 48. THD + N vs. Output Amplitude and Load  
Figure 45. Unity-Gain Large Signal Step Response  
analog.com  
Rev. A | 18 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 49. CMRR vs. Frequency  
Figure 51. Output Impedance vs. Frequency  
Figure 50. PSRR vs. Frequency  
Figure 52. Channel Separation vs. Frequency  
analog.com  
Rev. A | 19 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
THEORY OF OPERATION  
The ADA4099-1 and ADA4099-2 are single/dual robust, voltage  
feedback amplifiers that combine unity-gain stability with low offset,  
low offset drift, and 7 nV/√Hz of input noise. Figure 55 shows a  
simplified schematic of the device. The ADA4099-1 and ADA4099-2  
have two input stages: a common emitter differential input stage  
consisting of the Q1 and Q2 PNP transistors that operate with the  
inputs biased between −VS and 1.5 V below +VS, and a common  
base input stage that consists of the Q3 to Q6 PNP transistors  
that operate when the common-mode input is biased >+VS − 1.5  
V. These input stages result in two distinct operating regions, as  
shown in Figure 53.  
For common-mode input voltages that are approximately 1.5 V  
below the +VS supply, where Q1 and Q2 are active (see Figure  
53), the common emitter PNP input stage is active and the input  
bias current is typically <4 nA. When the common-mode input is  
above +VS − 1.5 V, the Q9 transistor turns on, which diverts bias  
current away from the common emitter differential input pair to the  
mirror that consists of M3 and M4. The current from M4 biases the  
common base differential input pair (Q3 to Q6). The Over-The-Top  
input pair operates in a common base configuration and the input  
bias current increases to ~82.5 µA. The offset voltages of both input  
stages are tightly trimmed and are specified in Table 1 and Table 2.  
As the input common-mode transitions to the Over-The-Top region,  
the input CMRR degrades slightly when compared to the rest of the  
input common-mode range, as shown in Figure 54.  
Figure 53. Input Bias Current vs. Input Common-Mode Voltage over  
Temperature, VSY = 5 V  
Figure 54. Offset Voltage vs. Input Common-Mode Voltage over Temperature,  
VSY = 5 V  
Figure 55. Simplified ADA4099-1 and ADA4099-2 Schematic  
analog.com  
Rev. A | 20 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
THEORY OF OPERATION  
INPUT PROTECTION  
The inputs are protected against temporary voltage excursions to  
10 V below –VS (see Figure 56) by an internal 250 Ω resistor (see  
Figure 55). This resistor limits the current in the series D1 diode  
and D2 diode that are tied to the bases of the Q1 and Q2 tran-  
sistors, respectively. Adding additional external series resistance  
extends the protection to >10 V below −VS, at the cost of stability  
and added thermal noise. The input stage of the ADA4099-1 and  
ADA4099-2 incorporates phase reversal protection to prevent the  
output from phase reversing for inputs below −VS. The ADA4099-1  
and ADA4099-2 op amps do not have clamping diodes between  
the inputs and can be differentially overdriven up to 80 V without  
damage, inducing parametric shifts, or drawing appreciable input  
current. Figure 57 summarizes the input fault types that can be  
applied to the ADA4099-1 and ADA4099-2 without compromising  
input integrity.  
Figure 57. ADA4099-1 and ADA4099-2 Fault Tolerant Conditions  
OVER-THE-TOP OPERATION  
CONSIDERATIONS  
When the ADA4099-1 and ADA4099-2 input common-modes are  
biased near or >+VS supply, the amplifiers operate in the Over-The-  
Top configuration. The differential input pair that controls amplifier  
operation is the common base pair, Q3 to Q6 (see Figure 55).  
Input bias currents change from <±4 nA in normal operation to  
approximately 82.5 μA in Over-The-Top operation when the input  
stage transitions from common emitter to common base. The Over-  
The-Top input bias currents are well matched, and the associated  
offset is typically <250 nA. Ensure that the impedance connected to  
the inverting and noninverting inputs is well matched to avoid any  
input bias current induced voltage offsets.  
Figure 56. ADA4099-1 and ADA4099-2 as Unity-Gain Buffers with  
Noninverting Inputs Driven Beyond the Supply (VSY = 5 V)  
Differential input impedance, RIN (see Figure 58), decreases from  
>100 kΩ in normal operation to ~600 Ω in Over-The-Top operation  
(see Table 1 and Table 2).  
Figure 58. Difference Amplifier Configured for Normal Operation and Over-  
The-Top Operation  
analog.com  
Rev. A | 21 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
THEORY OF OPERATION  
This RIN resistance appears across the summing nodes in Over-  
The-Top operation due to the configuration of the common base  
input stage.  
In normal operation,  
GBP  
BWCLOSED_LOOP  
R
F
1 +  
R
I
The RIN value is derived from the specified IB that flows to the op  
amp inputs, as expressed in the following equation:  
In Over-The-Top operation,  
GBP  
RIN = 2kT/(qIB)  
BWCLOSED_LOOP  
Noise Gain  
OTT  
where:  
k is Boltzmann’s constant.  
T is the operating temperature.  
q is the charge of an electron.  
IB is the operating input bias current in Over-The-Top operation.  
Output voltage noise density (eno) is impacted when the device  
transitions from normal operation to Over-The-Top operation. Resis-  
tor noise is neglected in both modes of operation in the following  
equations:  
In normal operation, neglecting resistor noise,  
The inputs are biased proportional to absolute temperature. There-  
fore, RIN is relatively constant with temperature. This resistance  
appears across the summing nodes of the amplifiers, which is  
forced to 0 V differentially by the feedback action of the amplifi-  
ers and can seem relatively harmless. However, depending on  
the configuration, this input resistance can boost the noise gain,  
lower overall amplifier loop gain and closed-loop bandwidth, and  
raise output noise. The singular benefit of this configuration is an  
increase in closed-loop amplifier stability.  
R
F
eno ≅ en 1 +  
R
I
where en is input referred voltage noise density.  
In Over-The-Top operation, neglecting resistor noise,  
eno ≅ en × Noise GainOTT  
OUTPUT  
In normal mode (−VS < VCM < +VS −1.5 V), RIN is typically large  
compared to the value of the gain setting resistors (RF and RI), and  
RIN can be ignored.  
The output of the ADA4099-1 and ADA4099-2 can swing rail-to-rail  
to within 45 mV of either supply with no load. The output can source  
and sink ~30 mA. The amplifiers are internally compensated to  
drive at least 100 pF of load capacitance (CL). Adding a series  
resistance of 50 Ω between the output and larger capacitive loads  
extends the capacitive drive capability of the amplifiers.  
In this case, the noise gain is defined by the following equation:  
Noise Gain = 1 + RF/RI  
When the amplifiers transition to Over-The-Top operation with the  
input common-mode biased near or above the +VS supply, consider  
the value of RIN.  
If the ADA4099-1 and ADA4099-2 enter shutdown, the VOUT pin  
appears as high impedance with two steering diodes connected to  
either supply. In this state, the output typically leaks <5 nA.  
The noise gain of the amplifiers increases as shown in the following  
equation:  
SHUTDOWN PINS  
The ADA4099-1 and ADA4099-2 have dedicated shutdown pins  
(SHDN for the ADA4099-1, and SHDN1 and SHDN2 for the  
ADA4099-2 10-lead LFCSP) to place the amplifiers in a very low  
power shutdown state when asserted high. A logic high is defined  
by a voltage ≥1.5 V applied to SHDN and SHDNx with respect to  
the −VS pin. In shutdown, the amplifiers draw <15 μA of supply  
current (see Figure 59) and the VOUT pin is placed in a high  
impedance state.  
R
F
+ R  
Noise GainOTT  
=
1 +  
×
R
R
R
F
I
IN  
I
R
R
F
I
R
1 +  
IN  
where Noise GainOTT is the Over-The-Top noise gain.  
The dc closed-loop gain remains mostly unaffected (RF/RI). Howev-  
er, the loop gain of the amplifiers decreases, as expressed in the  
following equation:  
A
A
OL  
R
OL  
Noise Gain  
to  
F
OTT  
1 +  
R
I
Likewise, the closed-loop bandwidth (BWCLOSED_LOOP) of the am-  
plifiers changes, going from normal operation to Over-The-Top  
operation.  
analog.com  
Rev. A | 22 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
THEORY OF OPERATION  
Alternatively, the amplifiers can be effectively placed in a low power  
state by removing +VS. In this low power state, the inputs typically  
leak <1 nA with either ±IN pin or either ±INx biased between −VS  
and 70 V above −VS. If the ±IN pins or ±INx pins are taken below  
−VS, they appear as a diode connected to the −VS supply in series  
with a resistance of 250 Ω. In this condition, limit the current to <30  
mA.  
Using an external source to drive the output beyond either ±VS  
supply under shutdown conditions may produce unlimited current  
and may damage the device.  
Figure 59. Supply Current vs. VSHDN with Respect to −VS  
SHDN or SHDNx can be driven beyond the +VS supply up to the  
absolute maximum voltage (60 V with respect to −VS) and draws  
little current (<1.5 μA). For normal active amplifier operation, SHDN  
or SHDNx can be floated or driven by an external voltage source  
low (within 0.5 V of −VS). If SHDN or SHDNx are left floating, an  
internal current source (~600 nA) pulls SHDN or SHDNx to –VS,  
which places the amplifiers into a default, active amplifying state.  
Because of the close proximity of the −IN pin (ADA4099-1) or  
−INx pins (ADA4099-2 10-lead LFCSP) and SHDN or SHDNx, fast  
edges on the −IN pin or −INx pins may ac-couple to the adjacent  
high impedance SHDN or SHDNx, inadvertently placing the devices  
in shutdown. If this scenario is a concern, add a 1 nF capacitor  
between SHDN or SHDNx and the −VS pin.  
analog.com  
Rev. A | 23 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
APPLICATIONS INFORMATION  
LARGE RESISTOR GAIN OPERATION  
The ADA4099-1 and ADA4099-2 have approximately 12 pF of input  
capacitance.  
The parallel combination of the feedback resistor (RF) and gain set-  
ting resistor (RG) on the inverting input can combine with this input  
capacitance (CIN) to form a pole that can reduce bandwidth, cause  
frequency response peaking, or produce oscillations (see Figure  
61). To mitigate these consequences, place a feedback capacitor  
with a value of CF > CIN(RG/RF) in parallel with RF for summing  
node impedances >1 kΩ (RF||RG>1 kΩ). This capacitor placement  
cancels the input pole and optimizes dynamic performance (see  
Figure 60).  
For applications where the noise gain is unity (RG→∞), and the  
feedback resistor exceeds 1 kΩ, CF ≥ CIN. Optimize PCB layouts  
to keep layout related summing node capacitance to an absolute  
minimum.  
Figure 61. Inverting Gain of 1, Small Signal Frequency Response, RF = RG  
10 kΩ  
=
RECOMMENDED VALUES FOR VARIOUS  
GAINS  
Table 9 is a reference for determining various recommended gains  
and associated noise performance. The total impedance seen at  
the inverting input is kept to <1 kΩ for gains >1 to maintain ideal  
small signal bandwidth.  
Figure 60. Inverting Gain Schematic  
Table 9. Gains and Associated Recommended Resistor Values (TA = 25°C)  
Gain RG (kΩ)  
RF (kΩ)  
CF (pF)  
Approximate −3 dB Frequency (MHz)  
Total System Noise (nV/√Hz at 1 kHz), Referred to Input  
+1  
+2  
+2  
+5  
−1  
−1  
−2  
−5  
−10  
Not applicable  
0
Not applicable  
8
6.8  
7.2  
11  
1
1
0
4
10  
1
10  
4.02  
10  
1
8.2  
0
2.7  
1.5  
2.1  
4.8  
2.9  
1.4  
0.75  
7.4  
22  
10  
1
8.2  
0
14.4  
11.3  
9.2  
8.7  
1
2
0
1
4.99  
10  
0
1
0
analog.com  
Rev. A | 24 of 34  
Data Sheet  
APPLICATIONS INFORMATION  
NOISE  
ADA4099-1/ADA4099-2  
by the resistor and current noise density. The ADA4099-1 and  
ADA4099-2 have an en of 7 nV/√Hz.  
To analyze the noise performance of an amplifier circuit, identify the  
noise sources, and then determine if each source has a significant  
contribution to the overall noise performance of the amplifiers. To  
simplify the noise calculations, noise spectral densities (NSDs)  
are used rather than actual voltages, to leave bandwidth out of  
the expressions. NSD is generally expressed in nV/√Hz and is  
equivalent to the noise in a 1 Hz bandwidth.  
If resistor and current noise contributions are less than half this  
value, the en introduced by the op amps dominates and provides  
optimal noise performance of the devices.  
The noise model shown in Figure 62 has six individual noise  
sources: the Johnson noise of the three resistors (R1 to R3), the op  
amp voltage noise, and the current noise (I) in each input of the  
amplifiers. Each noise source has its own contribution to the noise  
at the output. Noise is generally specified as referring to input (RTI),  
but it is often simpler to calculate the noise referred to the output  
(RTO), and then divide by the noise gain to obtain the RTI noise.  
Figure 63. Noise Contributions vs. Equivalent Input Resistance (REQ  
)
For the ADA4099-1 and ADA4099-2, this lower bound of resistance  
in the feedback network is about 750 Ω. For the amplifier configu-  
ration shown in Figure 62, REQ < 750 Ω provides stable noise  
performance. If noise performance is not important, en is typically  
fixed for a given TA, en,R increases with the square root of the  
resistor value, and the IN × REQ resistance increases linearly, but  
does not impact total noise until it approaches the value of en,R  
.
With REQ < ~60 kΩ, en,R is larger than IN × REQ. A safe value for  
REQ is ~30 kΩ to ensure that IN is not the majority contributor to  
total noise seen by the input.  
Figure 62. Op Amp Noise Analysis Model  
Figure 63 shows the noise contributions for the range of resistance  
values discussed in this section.  
Assuming IN+ = IN− = IN, the equation for RTI noise can be simpli-  
fied to the following form:  
DISTORTION  
2
2
RTI Noise = en +en, R2+ INREQ  
There are two main contributors of distortion in op amps: output  
crossover distortion as the output transitions from sourcing to sink-  
ing, and distortion caused by nonlinear common-mode rejection. If  
the op amps are operating in an inverting configuration, there is  
no common-mode induced distortion. If the op amps are operating  
in the noninverting configurations within the normal input common-  
mode range (−VS to +VS − 1.5 V), distortion is acceptable. When  
the inputs transition from normal to Over-The-Top operation or  
vice versa, a significant degradation occurs in linearity due to the  
change of input circuitry.  
en, R = 4kTREQ  
REQ = R3 + R1||R2  
where:  
en is the op amp voltage noise.  
en,R is the thermal noise contribution of the surrounding R1 to R3  
resistors.  
REQ is the equivalent input resistance.  
T is the absolute temperature in Kelvin.  
As RL decreases, distortion increases due to a net decrease in loop  
gain and greater signal swings internal to the amplifiers that are  
necessary to drive the load. The lowest distortion can be achieved  
with the ADA4099-1 and ADA4099-2 operating in Class A operation  
A 50 Ω resistor generates a Johnson noise of 1 nV/√Hz at 25°C.  
For optimal performance, the lower bound of resistance in a feed-  
back network is determined by the amount of quiescent power and  
distortion that can be tolerated. The upper bound is determined  
analog.com  
Rev. A | 25 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
APPLICATIONS INFORMATION  
in an inverting configuration, with the input common-mode biased at  
midsupply.  
For a given supply voltage, use Figure 65 as a guide for estimating  
the minimum load resistance that the ADA4099-1 and ADA4099-2  
can drive for a given supply voltage and a given rise in junction  
temperature (ΔTJ). For example, to limit ΔTJ to 50°C, the load  
driven on the ±15 V supplies (+30 V total supply) must not be lower  
than 1.2 kΩ. It is assumed that θJA is 192°C/W.  
POWER DISSIPATION AND THERMAL  
SHUTDOWN  
The ADA4099-1 and ADA4099-2 can drive heavy loads on power  
supplies up to ±25 V. Therefore, ensure that TJ on the integrated  
circuit does not exceed 175°C.  
Junction temperatures exceeding 125°C promote accelerated ag-  
ing. Reliability of the ADA4099-1 and ADA4099-2 may be impaired  
if the junction temperature exceeds 175°C. If the junction tempera-  
ture exceeds 175°C, the ADA4099-1 and ADA4099-2 have a final  
safety measure in the form of a thermal shutdown that shuts off the  
output stage and reduces the internal device currents. When this  
thermal shutdown function triggers, the output remains disabled in  
a high impedance state until the junction temperature drops 20°C.  
Persistent heavy loads and elevated ambient temperatures can  
cause the ADA4099-1 and ADA4099-2 to oscillate in and out of  
thermal shutdown depending on the power dissipated on the die,  
until the heavy load is removed (see Figure 64).  
Figure 65. Minimum Load Resistance for Given ΔTJ and VSY  
CIRCUIT LAYOUT CONSIDERATIONS  
Careful and deliberate attention to detail when laying out the  
ADA4099-1 and ADA4099-2 boards yields optimal performance.  
Power supply bypassing, parasitic capacitance, and component  
selection all contribute to the overall performance of the amplifiers.  
POWER SUPPLY BYPASSING  
On single supplies, solder the −VS supply pin directly to a low  
impedance ground plane. Bypass the +VS pin to a low impedance  
ground plane with a low effective series resistance (ESR) multilayer  
ceramic capacitor (MLCC) of 0.1 µF, typically, as close to the ±VS  
supply pins as possible. When driving heavy loads, add 10 µF of  
supply capacitance. When using split supplies, these conditions are  
applicable to the −VS supply pin.  
Figure 64. ADA4099-1 and ADA4099-2 Cycling In and Out of Thermal  
Shutdown  
It is not recommended to operate near the maximum junction  
temperature.  
The ADA4099-1 and ADA4099-2 have an internal current source  
of ~0.6 μA on the SHDN (ADA4099-1) and SHDNx (ADA4099-2  
10-lead LFCSP) pins to pull the pins down to −VS and place the  
amplifiers in the default amplifying state. If the shutdown state is  
not required, hard tie SHDN or SHDNx to the −VS pin. If SHDN or  
SHDNx is left floating or driven by a source with significant source  
impedance (>100 Ω), bypass the −VS supply pin with a small,  
1 nF capacitor to prevent stray signals from coupling on SHDN or  
SHDNx, which can inadvertently trigger shutdown.  
Typically, TJ can be estimated from TA and the device power  
dissipation (PD × θJA), as shown in the following equation:  
TJ = TA + PD × θJA  
The power dissipation in the IC varies as a function of supply  
voltage, the output voltage, and load resistance. For a given supply  
voltage, the worst case power dissipation (PD(MAX)) in the IC occurs  
when the supply current is maximum, and the output voltage is at  
half of either supply voltage.  
GROUNDING  
Use ground and power planes where possible to reduce the re-  
sistance and inductance of the supply and ground returns. Place  
bypass capacitors as close as possible to the ±VS supply pins, with  
2
V
SY  
2
PD(MAX) = VsIs(MAX)  
+
R
L
analog.com  
Rev. A | 26 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
APPLICATIONS INFORMATION  
the other ends connected to the ground plane. It is recommended  
to use a bypass capacitor of at least 0.1 µF when driving light  
loads (load currents < 100 µA), and more capacitance when driving  
heavier loads. Routing from the output to the load and return to the  
ground plane must have minimal loop area to keep inductance to a  
minimum.  
ESD PROTECTION WHEN POWERED  
Figure 66. ESD Protection Circuit (RC Network)  
ICs react to ESD strikes differently when unpowered vs. powered,  
which falls under IEC-61000-4-2 standards (see the Absolute Max-  
imum Ratings section). A device that performs well under HBM  
conditions can perform poorly under International Electrotechnical  
Commission (IEC) conditions. The ADA4099-1 and ADA4099-2  
are thoroughly abused with ESD strikes under IEC conditions  
to create a front-end circuit protection scheme that protects the  
devices if subjected to ESD strikes. Figure 66 and Figure 67 show  
two different protection schemes that extend the protection of the  
ADA4099-1 and ADA4099-2 to ±8 kV ESD strikes.  
In the circuit shown in Figure 67, R1 is a 220 Ω, Panasonic, 0805,  
ERJ-P6 series, and D1 is a Bourns CDSOD323-T36SC. An ESD  
varistor can be considered for D1.  
For more information on system level ESD considerations, see the  
technical article, When Good Electrons Go Bad: How to Protect  
Your Analog Front End, on the Analog Devices, Inc., website.  
RELATED PRODUCTS  
Table 10 describes several alternative precision amplifiers that can  
also be considered for certain applications.  
Consider the following when selecting components:  
A component size of 0805 or larger to reduce chance of arc-over.  
Pulse withstanding, thick film resistors.  
C0G MLCC with a minimum rating of 100 V.  
Bidirectional, transient voltage suppression (TVS) diodes.  
In the circuit shown in Figure 66, R1 is a 220 Ω, Panasonic, 0805,  
ERJ-P6 series, and C1 is a 100 pF, Yageo, 0805, 100 V, C0G/NPO.  
Figure 67. ESD Protection Circuit (R-TVS Network)  
Table 10. ADA4099-1 and ADA4099-2 Related Products  
Model  
VOS (μV)  
IB (nA)  
GBP (kHz)  
en (nV/√Hz)  
ISY (μA)  
Input Common-Mode Range (V)  
ADA4099-1  
ADA4099-2  
ADA4077-1  
LT6015  
25  
10  
10  
1
8000  
8000  
3900  
3200  
1600  
2.7  
7
1500  
1500  
500  
335  
165  
1.5  
−VS to −VS + 70  
−VS to −VS + 70  
−VS to +VS  
25  
7
35  
7
50  
5
18  
9.5  
185  
50  
−VS to −VS + 76  
−VS to +VS  
LT6014  
60  
0.4  
1
LT1494  
375  
500  
−VS to −VS + 36  
−VS to −VS + 44  
LT1490A  
8
180  
55  
analog.com  
Rev. A | 27 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
APPLICATIONS INFORMATION  
TYPICAL APPLICATIONS  
Figure 68. ±10 V to 0 V to +5 V Funnel Amplifier, High CMRR and ±80 V Input Protection via LT5400-7 Resistor Network (ADA4099-1 6-lead TSOT)  
Figure 69. ±10 V to 0 V to +5 V Funnel Amplifier, Input and Output Voltages  
Figure 70. ±10 V to 0 V to +5 V Funnel Amplifier, System Gain  
analog.com  
Rev. A | 28 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
APPLICATIONS INFORMATION  
Figure 71. ±10 V to 0 V to +5 V Funnel Amplifier, Large Signal Pulse Response  
Figure 72. 1 V/A Low-Side Current Sense (ADA4099-1 6-lead TSOT)  
Figure 73. 1 V/A High-Side Current Sense (ADA4099-1 6-lead TSOT)  
Figure 74. Microprocessor Control of SHDN Pin in Split Supply Applications (ADA4099-1 6-lead TSOT)  
analog.com  
Rev. A | 29 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
OUTLINE DIMENSIONS  
Figure 75. 6-Lead Small Outline Transistor Package [TSOT]  
(UJ-6)  
Dimensions shown in millimeters  
analog.com  
Rev. A | 30 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
OUTLINE DIMENSIONS  
Figure 76. 8-Lead Standard Small Outline Package [SOIC_N]  
Narrow Body  
(R-8)  
Dimensions shown in millimeters and (inches)  
analog.com  
Rev. A | 31 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
OUTLINE DIMENSIONS  
Figure 77. 8-Lead Mini Small Outline Package [MSOP]  
(RM-8)  
Dimensions shown in millimeters  
analog.com  
Rev. A | 32 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
OUTLINE DIMENSIONS  
Figure 78. 10-Lead Lead Frame Chip Scale Package [LFCSP]  
3 mm × 3 mm Body and 0.75 mm Package Height  
(05-08-1699)  
Dimensions shown in millimeters  
analog.com  
Rev. A | 33 of 34  
Data Sheet  
ADA4099-1/ADA4099-2  
OUTLINE DIMENSIONS  
Updated: January 07, 2022  
ORDERING GUIDE  
Model1  
Temperature Range  
Package Description  
Package Option Marking Code  
ADA4099-1BUJZ-R5  
ADA4099-1BUJZ-RL7  
ADA4099-1HUJZ-RL7  
ADA4099-2BCPZ  
-40°C to +125°C  
-40°C to +125°C  
-55°C to +150°C  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
-55°C to +150°C  
-55°C to +150°C  
-55°C to +150°C  
-55°C to +150°C  
6-Lead TSOT  
UJ-6  
Y7P  
Y7P  
Y7Q  
A44  
A44  
A44  
A44  
6-Lead TSOT  
UJ-6  
6-Lead TSOT  
UJ-6  
10-Lead LFCSP (3mm x 3mm w/ EP)  
10-Lead LFCSP (3mm x 3mm w/ EP)  
8-Lead MSOP  
05-08-1699  
05-08-1699  
RM-8  
ADA4099-2BCPZ-RL7  
ADA4099-2BRMZ  
ADA4099-2BRMZ-RL7  
ADA4099-2BRZ  
8-Lead MSOP  
RM-8  
8-Lead SOIC_N  
R-8  
ADA4099-2BRZ-RL7  
ADA4099-2HCPZ  
8-Lead SOIC_N  
R-8  
10-Lead LFCSP (3mm x 3mm w/ EP)  
10-Lead LFCSP (3mm x 3mm w/ EP)  
8-Lead SOIC_N  
05-08-1699  
05-08-1699  
R-8  
A45  
A45  
ADA4099-2HCPZ-RL7  
ADA4099-2HRZ  
ADA4099-2HRZ-RL7  
8-Lead SOIC_N  
R-8  
1
Z = RoHS Compliant Part.  
EVALUATION BOARDS  
Model1  
Description  
EVAL-ADA4099-1HUJZ  
EVAL-ADA4099-2BCPZ  
Evaluation Board, Single TSOT  
Evaluation Board, Dual LFCSP  
1
Z = RoHS Compliant Part.  
©2021-2022 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
One Analog Way, Wilmington, MA 01887-2356, U.S.A.  
Rev. A | 34 of 34  

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