ADD5205ACPZ-RL [ADI]
Four-String White LED Driver; 四串白光LED驱动器型号: | ADD5205ACPZ-RL |
厂家: | ADI |
描述: | Four-String White LED Driver |
文件: | 总16页 (文件大小:424K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Four-String White LED Driver
Data Sheet
ADD5205
FEATURES
FUNCTIONAL BLOCK DIAGRAM
STEP-UP SWITCHING REGULATOR
4-CHANNEL CURRENT SOURCES
White LED driver based on inductive boost converter
Input voltage range: 2.8 V to 18 V
Internal compensation
1 MHz fixed operating frequency
28 V fixed overvoltage protection
Built-in soft start for boost converter
Drives up to 4 LED current sources
LED current adjustable up to 25 mA for each channel
DC current level brightness control with PWM input
LED open fault protection
BRIGHTNESS CONTROL LOGIC
UNDERVOLTAGE LOCKOUT
SOFT START
THERMAL PROTECTION
OVERVOLTAGE PROTECTION
AUTODISABLE FOR LED OPEN
Figure 1.
General
Thermal shutdown
Undervoltage lockout
12-lead, 3 mm × 3 mm × 0.75 mm LFCSP package
APPLICATIONS
Smart PCs, PMPs, tablet PCs, UMPCs, and notebooks
GENERAL DESCRIPTION
The ADD5205 is a white LED driver for backlight applications
based on high efficiency, current mode, step-up converter
technology. It is designed with a 0.3 Ω internal switch and 1 MHz
fixed operating frequency. The ADD5205 contains four regulated
constant current sources for uniform brightness intensity. Each
current source is capable of driving up to 25 mA.
The ADD5205 has multiple safety protection features to prevent
any damage during fault conditions. If one or more LEDs are open,
the device disables the faulty current regulator automatically.
The internal soft start prevents inrush current during startup. A
thermal shutdown protection feature prevents thermal damage.
The ADD5205 is available in a low profile, thermally enhanced
3 mm × 3 mm × 0.75 mm, 12-lead lead frame chip scale package
(LFCSP) and is specified over the temperature range of −25°C
to +85°C.
The ADD5205 has four parallel strings of multiple series connected
LEDs with 2ꢀ current matching. The device provides adjustable
current sources that drive up to 25 mA using an external resistor.
The LED current can be controlled by a PWM signal input on
the PWM pin. An internal circuit translates the PWM signal to
an analog signal with an external capacitor and linearly controls
the LED current.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2011 Analog Devices, Inc. All rights reserved.
ADD5205
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Performance Characteristics ..............................................8
Theory of Operation ...................................................................... 10
Current Mode, Stepup Switching Regulator Operation........ 10
Current Source............................................................................ 10
PWM Dimming Mode .............................................................. 10
Safety Features ............................................................................ 10
External Component Selection Guide..................................... 11
Layout Guidelines....................................................................... 12
Typical Application Circuit........................................................... 13
Outline Dimensions....................................................................... 14
Ordering Guide .......................................................................... 14
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Functional Block Diagram .............................................................. 3
Specifications..................................................................................... 4
Absolute Maximum Ratings............................................................ 6
Thermal Resistance ...................................................................... 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
REVISION HISTORY
8/11—Revision 0: Initial Version
Rev. 0 | Page 2 of 16
Data Sheet
ADD5205
FUNCTIONAL BLOCK DIAGRAM
VIN
1
SHDN
2
OVP
5
VOLTAGE
REFERENCE
THERMAL
SHUTDOWN
OCP
REF
SHUTDOWN
UVP COMP
R1
UVP
REF
LL COMP
4
SW
OVP
REF
LL
REF
ERROR
AMP
R2
REF
GM
PWM
COMP
R
S
Q
R
C
DCOMP
DREF
C
OSC
C
+
CURRENT SENSE
SOFT START
+
R
SENSE
HEADROOM CONTROL
LED OPEN FAULT
PROTECTION
3
GND
FB1
12
CURRENT SOURCE 1
CURRENT SOURCE 2
7
ISET
V
GENERATOR
REF
11 FB2
R_FILTER
6
PWM
10
9
FB3
FB4
CURRENT SOURCE 3
CURRENT SOURCE 4
8
C_FILTER
Figure 2. Functional Block Diagram
Rev. 0 | Page 3 of 16
ADD5205
Data Sheet
SPECIFICATIONS
SHDN
VIN = 3.7 V,
= high, TA = −25°C to +85°C, unless otherwise noted. Typical values are at TA = 25°C.
Table 1.
Parameter
SUPPLY
Symbol
Test Conditions/Comments
Min
Typ
Max
18
Unit
Input Voltage Range
Quiescent Current
VIN
IQ
2.8
V
VIN = 2.8 V to 18 V, not switching
3.4
mA
μA
Shutdown Supply Current
ISD
SHDN
1
VIN = 2.8 V to 18 V,
= 0 V
SWITCH
On Resistance
RDS(ON)
ICL
ISW = 100 mA
0.3
1.9
Ω
Switch Current Limit
Leakage Current
A
ILKG
1
μA
OSCILLATOR
Switching Frequency
Maximum Duty Cycle
SOFT START
fOSC
1
MHz
%
DMAX
90
Soft Start Time1
1.5
ms
CURRENT SOURCE
ISET Pin Voltage
VSET
1.26
0.22
V
C_FILTER Pin Voltage
Adjustable LED Current1
Constant Current Sink of 20 mA2
Headroom Voltage of 20 mA2
Current Matching Between Strings2
LED Current Accuracy of 20 mA2
Current Source Leakage Current
SHUTDOWN CONTROL
VC_FILTER
ILED
ILED20
VHR20
Duty = 100%
V
25
mA
mA
V
%
%
RSET = 130 kΩ
RSET = 130 kΩ
ILED = 20 mA
ILED = 20 mA
19.6
20
20.6
0.66
−2
−3
+2
+3
1
μA
SHDN
SHDN
VSHDN
VIN = 2.8 V to 18 V
VIN = 2.8 V to 18 V
1.5
6
V
V
Voltage High
Voltage Low
_HIGH
VSHDN
0.6
_LOW
PWM Control
PWM Input Frequency Range1
PWM Voltage High
PWM Voltage Low
0.1
1.5
kHz
V
V
VPWM_HIGH
VPWM_LOW
VIN = 2.8 V to 18 V
VIN = 2.8 V to 18 V
0.6
1 Guaranteed by design.
2 Tested at TA = 25°C.
Rev. 0 | Page 4 of 16
Data Sheet
ADD5205
SHDN
VIN = 3.7 V,
= high, TA = −25°C to +85°C, unless otherwise noted. Typical values are at TA = 25°C.
Table 2.
Parameter
Symbol
Test Conditions/Comments
Min
Typ
Max
Unit
THERMAL PROTECTION
Thermal Shutdown Threshold1
Thermal Shutdown Hysteresis1
UVLO
TSD
TSDHYST
160
30
°C
°C
UVLO Rising Threshold
UVLO Falling Threshold
OVERVOLTAGE PROTECTION
Overvoltage Threshold on OVP Pin
VUVLOR
VUVLOF
VIN rising
VIN falling
2.5
2
V
V
VOVP
28
V
1 Guaranteed by design.
Rev. 0 | Page 5 of 16
ADD5205
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
TA = 25°C, unless otherwise noted.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3.
Parameter
Rating
Table 4. Thermal Resistance
Package Type
12-Lead LFCSP
VIN
SW
SHDN,
−0.3 V to +20 V
−0.3 V to +32 V
−0.3 V to +7 V
−0.3 V to +3.6 V
−0.3 V to +7 V
−0.3 V to +32 V
−0.3 V to +32 V
150°C
θJA
θJC
Unit
41.6
7.65
°C/W
ISET, C_FILTER
PWM
FB1, FB2, FB3, FB4
OVP
Maximum Junction Temperature (TJ max)
Operating Temperature Range (TA)
Storage Temperature Range (TS)
Reflow Peak Temperature (20 sec to 40 sec)
ESD CAUTION
−25°C to +85°C
−65°C to +150°C
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. 0 | Page 6 of 16
Data Sheet
ADD5205
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
VIN
SHDN
GND
FB4
1
2
3
9
8
ADD5205
TOP
VIEW
C_FILTER
7 ISET
(Not to Scale)
NOTES
1. CONNECT THE EXPOSED PADDLE TO GROUND.
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin
No.
Mnemonic Description
1
2
VIN
Supply Input Pin. Bypassed with a capacitor to ground.
Shutdown Control Pin for Enabling IC. Active low.
SHDN
GND
SW
3
4
Ground Pin.
Drain Connection of the Internal Power FET Pin.
5
OVP
Overvoltage Protection Sense Input Pin. Must be locally bypassed with a 100 nF capacitor and placed as close as
possible to the IC.
6
7
8
PWM
ISET
C_FILTER
PWM Signal Input Pin.
Full-Scale LED Current Set Pin. A resistor from this pin to ground sets the LED current up to 25 mA.
Filtered PWM Signal Output Pin. Connect a capacitor between C_FILTER and ground. This capacitor forms a low-pass
filter with an internal resistor.
9
FB4
FB3
FB2
FB1
EPAD
Regulated Current Sink Input Pin. Connect the bottom cathode of the LED string to this pin. If unused, connect FB4
to ground.
Regulated Current Sink Input Pin. Connect the bottom cathode of the LED string to this pin. If unused, connect FB3
to ground.
Regulated Current Sink Input Pin. Connect the bottom cathode of the LED string to this pin. If unused, connect FB2
to ground.
Regulated Current Sink Input Pin. Connect the bottom cathode of the LED string to this pin. This channel should be
connected to LEDs as a default channel.
10
11
12
Connect the exposed paddle to ground.
Rev. 0 | Page 7 of 16
ADD5205
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
100
25
20
15
10
5
90
80
70
60
50
40
30
20
10
0
0
0
5
10
15
20
0
5
10
15
20
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 4. Boost Converter Efficiency vs. Input Voltage,
Figure 7. LED Current vs. Input Voltage (ILED = 22 mA)
ILED = 20 mA, Brightness = 100%, and LEDs = 6 Series × 4 Parallel
30
20
15
25
20
15
10
5
10
5
0
–5
–10
–15
–20
0
0
200
400
600
800
(kΩ)
1000
1200
1400
1600
0
20
40
60
80
100
R
PWM INPUT DUTY CYCLE (%)
SET
Figure 8. LED Current Matching vs. PWM Input Duty Cycle
Figure 5. LED Current (ILED) vs. RSET
20
18
16
14
12
10
8
V
(10V/DIV)
(10V/DIV)
OUT
V
SW
1
2
SHDN (3V/DIV)
3
4
I
(500mA/DIV)
L
6
4
2
0
V
= 3.7V
A
CH3
960mV
IN
0
20
40
60
80
100
BRIGHTNESS = 100% 6 SERIES x 4 PARALLEL
PWM INPUT DUTY CYCLE (%)
Figure 6. LED Current vs. PWM Input Duty Cycle
Figure 9. Start-Up Waveforms (Brightness = 100%)
Rev. 0 | Page 8 of 16
Data Sheet
ADD5205
PWM (2V/DIV)
V
(100mV/DIV)
OUT
V
1
1
2
(10V/DIV)
SW
V
(1V/DIV)
FB1
2
4
I
(500mA/DIV)
I
(10mA/DIV)
L
FB1
4
V
= 18V
A
CH2
11.6V
V
= 5V
A CH1
840mV
IN
IN
BRIGHTNESS = 100% 6 SERIES x 4 PARALLEL
BRIGHTNESS = 10% 6 SERIES x 4 PARALLEL
Figure 12. LED Current Waveforms (Brightness = 10%)
Figure 10. Switching Waveforms (VIN = 18 V)
PWM (2V/DIV)
V
V
(100mV/DIV)
OUT
1
1
2
(10V/DIV)
SW
V
(1V/DIV)
FB1
2
4
I (10mA/DIV)
FB1
I
(500mA/DIV)
L
4
V
= 5V
A CH1
840mV
V
= 3V
A
CH2
11.6V
IN
IN
BRIGHTNESS = 70% 6 SERIES x 4 PARALLEL
BRIGHTNESS = 100% 6 SERIES x 4 PARALLEL
Figure 13. LED FB1 Waveforms (Brightness = 70%)
Figure 11. Switching Waveforms (VIN = 3 V)
Rev. 0 | Page 9 of 16
ADD5205
Data Sheet
THEORY OF OPERATION
CURRENT MODE, STEPUP SWITCHING
REGULATOR OPERATION
PWM DIMMING MODE
The ADD5205 supports PWM input. The internal resistor and
external capacitor change the PWM input duty to analog level,
and the low-pass filter output adjusts each current source sink
current level.
The ADD5205 uses a current mode PWM boost regulator to
provide the minimal voltage needed to enable the LED string at
the programmed LED current. The current mode regulation
system allows fast transient response while maintaining a stable
output voltage. The regulator response can be optimized for a
wide range of input voltages, output voltages, and load conditions.
The ADD5205 can provide a 28 V fixed overvoltage protection
voltage and drive up to 6 LEDs (3.4 V/20 mA type of LEDs) for
four channels from a supply of 3 V or up to 7 LEDs (3.4 V/20 mA
type of LEDs) for four channels from a supply of 5 V to 18 V.
DC Current Dimming
In this mode, the maximum LED current is set by the value of RSET.
Once the maximum LED current is set, the LED current can be
changed through PWM input.
DUTY = 80%
DUTY = 60%
DUTY = 40%
DUTY = 20%
PWMI
I
LED MAX
CURRENT SOURCE
0.8 × I
LED MAX
I
LED
0A
0.6 × I
LED MAX
The ADD5205 contains four current sources to provide accurate
current sinking for each LED string. String-to-string tolerance
is kept within 2ꢀ at 20 mA. Each LED string current is adjusted
up to 25 mA by an external resistor.
0.4 × I
LED MAX
0.2 × I
LED MAX
Figure 14. DC Current Dimming Timing
The ADD5205 contains an LED open fault protection circuit for
each channel. The ADD5205 recognizes that the current source
has an open load fault for the current source, and the current
source is disabled.
SAFETY FEATURES
The ADD5205 contains several safety features to provide stable
operation, such as soft start, open load protection (OLP), under-
voltage lockout (UVLO), and thermal protection.
Programming the LED Current
Soft Start
As shown in Figure 2, the ADD5205 has an LED current set pin
(ISET). A resistor (RSET) from this pin to ground adjusts the
LED current up to 25 mA (see Figure 15). LED current level can
be set by
The ADD5205 contains an internal soft start function to reduce
inrush current at startup. The soft start time is typically 1.5 ms.
OLP
The ADD5205 contains a headroom control circuit to minimize
power loss at each current source. Therefore, the minimum feed-
back voltage is achieved by regulating the output voltage of the
boost converter. If any LED string is open during normal operation,
the current source headroom voltage (VHR) is pulled to GND. In
this condition, OLP is activated.
2600
RSET
ILED =
(A)
UVLO
An undervoltage lockout circuit is included with built-in hysteresis.
The ADD5205 turns on when VIN rises above 2.5 V (typical) and
shuts down when VIN falls below 2 V (typical).
Thermal Protection
Thermal overload protection prevents excessive power dissipation
from overheating the ADD5205. When the junction temperature
(TJ) exceeds 160°C, a thermal sensor immediately activates the
fault protection, which shuts down the device, allowing the IC to
cool. The device self starts when the TJ of the die falls below 130°C.
Rev. 0 | Page 10 of 16
Data Sheet
ADD5205
Table 6 shows a list of recommend inductors.
EXTERNAL COMPONENT SELECTION GUIDE
Inductor Selection
Table 6. Recommended Inductors
The inductor is an integral part of the step-up converter. It stores
energy during the switch-on time and transfers that energy to
the output through the output diode during the switch-off time.
An inductor in the 3.3 μH to 6.8 μH range is recommended. In
general, lower inductance values result in higher saturation
current and lower series resistance for a given physical size.
Coilcraft Part No.
XFL4020-332ML
LPS4012-472ML
LPS4018-472ML
LPS4018-682ML
L (μH)
ISAT (A)
Size (mm)
3.3
4.7
4.7
6.8
2.7
1.6
1.8
1.2
4 × 4 × 2
3.9 × 3.9 × 1.1
3.9 × 3.9 × 1.7
3.9 × 3.9 × 1.7
Input and Output Capacitors Selection
The input (VIN) and output (VOUT) voltages determine the switch
duty cycle (D), which in turn can be used to determine the
inductor ripple current.
The ADD5205 requires input and output bypass capacitors to
supply transient currents while maintaining a constant input
and output voltage. Use a low effective series resistance (ESR)
4.7 μF or greater capacitor for the input capacitor to prevent noise
at the ADD5205 input. Place the input between VIN and GND,
as close as possible to the ADD5205.
VOUT −VIN
D =
VOUT
Use the duty cycle and switching frequency (fSW) to determine
the on time (tON).
The output capacitor maintains the output voltage and supplies
current to the load while the ADD5205 switch is on. The value
and characteristics of the output capacitor greatly affect the
output voltage ripple and stability of the regulator. Use a ceramic
X5R or X7R dielectric capacitor, and for the output capacitor, a
4.7 μF or greater capacitor is preferred.
D
tON
=
fSW
The inductor ripple current (ΔIL) in a steady state is
V
IN ×tON
L
ΔIL =
Place a 100 nF or greater capacitor as close as possible to the
OVP pin of ADD5205.
Solve for the inductance value (L).
V
IN ×tON
ΔIL
Diode Selection
L =
The output diode conducts the inductor current to the output
capacitor and loads while the switch is off. For high efficiency,
minimize the forward voltage drop of the diode. Schottky diodes
are recommended.
Ensure that the peak inductor current (that is, the maximum
input current plus half of the inductor ripple current) is less
than the rated saturation current of the inductor. In addition,
ensure that the maximum rated rms current of the inductor is
greater than the maximum dc input current to the regulator.
The output diode for a boost regulator must be chosen depending
on the output voltage and the output current. The diode must
be rated for a reverse voltage greater than the output voltage used.
The average current rating must be greater than the maximum
load current expected, and the peak current rating must be greater
than the peak inductor current.
1
2
ILPK = ILAVG
+
ΔIL ,
I
OUT ×VOUT
η×VIN
ILAVG
=
VOUT −VIN
fSW ×VOUT
1
L
ΔIL = VIN
where:
ILPK is the peak inductor current.
ILAVG is the input average current.
Rev. 0 | Page 11 of 16
ADD5205
Data Sheet
Layout Procedure
Use the following general guidelines when designing PCBs:
LAYOUT GUIDELINES
When designing a high frequency, switching, regulated power
supply, layout is very important. Using a good layout can solve
many problems associated with these types of supplies. The main
problems are loss of regulation at high output current and/or
large input-to-output voltage differentials, excessive noise on
the output and switch waveforms, and instability. Using the
following guidelines can help minimize these problems.
•
•
Keep CIN close to the VIN and GND leads of the ADD5205.
Keep the high current path from CIN (through L1) to the
SW and GND leads as short as possible.
•
Keep the high current path from CIN (through L1), D1, and
COUT as short as possible.
•
•
•
Keep high current traces as short and wide as possible.
Place the COVP as close as possible to the OVP pin.
Place the LED current setting resistors as close as possible
to each pin to prevent noise pickup.
Make all power (high current) traces as short, direct, and thick
as possible. It is good practice on a standard printed circuit
board (PCB) to make the traces an absolute minimum of 15 mil
(0.381 mm) per ampere. Place the inductor, output capacitors,
and output diode as close to each other as possible. This helps
reduce the EMI radiated by the power traces that is due to the
high switching currents through them. This also reduces lead
inductance and resistance, which in turn reduces noise spikes,
ringing, and resistive losses that produce voltage errors.
•
•
Avoid routing noise sensitive traces near high current
traces and components, especially the LED current setting
node (ISET).
Use a thermal pad size that is the same dimension as the
exposed pad on the bottom of the package.
Heat Sinking
The grounds of the IC, input capacitors, output capacitors, and
output diode (if applicable), should be connected close together,
directly to a ground plane. It is also a good idea to have a ground
plane on both sides of the PCB. This reduces noise by reducing
ground loop errors and by absorbing more of the EMI radiated
by the inductor.
When using a surface-mount power IC or external power
switches, the PCB can often be used as the heat sink. This is
done by using the copper area of the PCB to transfer heat from
the device. Users should maximize this area to optimize thermal
performance.
Due to how switching regulators operate, there are two power
states: on and off. During each state, there is a current loop made
by the power components currently conducting. Place the power
components so that the current loop is conducting in the same
direction during each of the two states. This prevents magnetic
field reversal caused by the traces between the two half cycles
and reduces radiated EMI.
Rev. 0 | Page 12 of 16
Data Sheet
ADD5205
TYPICAL APPLICATION CIRCUIT
L1
4.7µH
D1
+
–
C
4.7µF
C
OUT
4.7µF
IN
4
SW
5
OVP
VIN
1
C
OVP
100nF
ADD5205
ON
2
6
SHDN
OFF
12
11
10
9
FB1
FB2
FB3
FB4
PWM
8
C_FILTER
C
FILTER
1µF
GND
3
ISET
7
R
SET
Figure 15. Typical Application Circuit
Rev. 0 | Page 13 of 16
ADD5205
Data Sheet
OUTLINE DIMENSIONS
3.10
3.00 SQ
2.90
0.30
0.23
0.18
PIN 1
INDICATOR
PIN 1
INDICATOR
10
12
0.50
BSC
1
3
9
7
EXPOSED
PAD
1.70
1.60 SQ
1.50
0.20 MIN
6
4
0.50
0.40
0.30
TOP VIEW
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.80
0.75
0.70
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4.
Figure 16. 12-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-12-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
ADD5205ACPZ-RL
−25°C to +85°C
12-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
CP-12-6
1 Z = RoHS Compliant Part.
Rev. 0 | Page 14 of 16
Data Sheet
NOTES
ADD5205
Rev. 0 | Page 15 of 16
ADD5205
NOTES
Data Sheet
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09858-0-8/11(0)
Rev. 0 | Page 16 of 16
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