ADD8505WRUZ [ADI]

4-, 5-, 6-Channel, Muxed Input Line Inversion LCD Gamma Buffers; 4-,5- , 6-通道,多路复用输入行反转LCD伽玛缓冲器
ADD8505WRUZ
型号: ADD8505WRUZ
厂家: ADI    ADI
描述:

4-, 5-, 6-Channel, Muxed Input Line Inversion LCD Gamma Buffers
4-,5- , 6-通道,多路复用输入行反转LCD伽玛缓冲器

缓冲放大器 放大器电路 光电二极管 CD
文件: 总8页 (文件大小:221K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
4-, 5-, 6-Channel, Muxed Input  
Line Inversion LCD Gamma Buffers  
ADD8504/ADD8505/ADD8506  
FEATURES  
PIN CONFIGURATION DIAGRAMS  
Single-supply operation: 3.3 V to 6.5 V  
Rail-to-rail input, rail-to-rail output  
High output current: 380 mA  
Low supply current: 3.9 mA  
Stable with 1 nF loads  
INA1  
INB1  
INA2  
INB2  
INA3  
INB3  
INA4  
INB4  
1
2
3
4
5
6
7
8
16 OUT1  
15 OUT2  
14 VCC1  
13 A/B  
12 GND  
11 GND  
10 OUT3  
Wide temperature range: −40°C to +105°C  
16-, 20-, and 24-lead, Pb-free, TSSOP packages  
9
OUT4  
APPLICATIONS  
LCD line inversion gamma references  
Car navigation panels  
Figure 1. ADD8504: 4-Channel Buffer  
INA1  
INB1  
INA2  
INB2  
INA3  
INB3  
INA4  
INB4  
INA5  
1
2
3
4
5
6
7
8
9
20 VCC1  
19 OUT1  
18 OUT2  
17 OUT3  
16 VCC2  
15 A/B  
Personal media player panels  
GENERAL DESCRIPTION  
The ADD8504, ADD8505, and ADD8506 are 4-, 5-, and  
6-channel LCD gamma reference buffers designed to drive  
column driver gamma inputs in line inversion panels. Each  
buffer channel has an A/B input to select between two gamma  
voltage curves. These buffer channels drive the resistor ladders  
of LCD column drivers for gamma correction. The ADD8504/  
ADD8505/ADD8506 outputs have high slew rates and output  
drives that increase the stability of the reference ladder resulting  
in optimal gray scale and visual performance.  
14 GND  
13 GND  
12 OUT4  
11 OUT5  
INB5 10  
Figure 2. ADD8505: 5-Channel Buffer  
INA1  
INB1  
INA2  
INB2  
INA3  
INB3  
INA4  
INB4  
INA5  
1
2
3
4
5
6
7
8
9
24 VCC1  
23 OUT1  
22 OUT2  
21 OUT3  
20 VCC2  
19 A/B  
The ADD8504/ADD8505/ADD8506 are specified over the  
−40°C to +105°C temperature range. They are available, respec-  
tively, in 16-, 20-, and 24-lead thin shrink small outline (TSSOP),  
surface-mount, Pb-free packages.  
18 GND  
17 GND  
16 OUT4  
15 OUT5  
14 OUT6  
13 VCC3  
INB5 10  
INA6 11  
INB6 12  
Figure 3. ADD8506: 6-Channel Buffer  
Rev. B  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2006 Analog Devices, Inc. All rights reserved.  
 
ADD8504/ADD8505/ADD8506  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Thermal Resistance.......................................................................4  
ESD Performance ..........................................................................4  
ESD Caution...................................................................................4  
Pin Configurations and Function Descriptions............................5  
Typical Performance Characteristics ..............................................6  
Applications........................................................................................7  
Outline Dimensions..........................................................................8  
Ordering Guide .............................................................................8  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Pin Configuration Diagrams........................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Electrical Characteristics............................................................. 3  
Absolute Maximum Ratings............................................................ 4  
REVISION HISTORY  
1/06—Rev. A to Rev. B  
Added Pin Configurations and Function  
Descriptions Section ........................................................................ 5  
Added Table 5.................................................................................... 8  
10/05—Rev. 0 to Rev. A  
Added ADD8504 and ADD8505......................................Universal  
Changes to Specifications Section.................................................. 3  
Updated Outline Dimensions......................................................... 7  
Changes to Ordering Guide ............................................................ 7  
9/05—Revision 0: Initial Version  
Rev. B | Page 2 of 8  
 
ADD8504/ADD8505/ADD8506  
SPECIFICATIONS  
ELECTRICAL CHARACTERISTICS  
VCC = 5 V, TA = 25°C, unless otherwise noted. VIN denotes buffer input voltage; ILOAD denotes load current; RL denotes load resistance;  
CL denotes load capacitance.  
Table 1.  
Parameter  
Symbol Conditions  
Min  
Typ  
Max Unit  
INPUT CHARACTERISTICS  
Offset Voltage  
Input Common-Mode Voltage Range  
Input Bias Current  
Voltage Gain  
VOS  
VCM  
IB  
0 V ≤ VIN ≤ 5 V  
VIN = 2.5 V  
20  
5
50  
mV  
V
nA  
V/V  
0
2
AVO  
0.985  
4.75  
OUTPUT CHARACTERISTICS  
Output Voltage High  
Output Voltage Low  
Output Resistance  
Output Short-Circuit Current  
POWER SUPPLY  
VOH  
VOL  
ROUT  
ISC  
ILOAD = +20 mA  
ILOAD = −20 mA  
−20 mA ≤ ILOAD ≤ +20 mA; 0.5 V ≤ VIN ≤ 4.5 V  
V
V
Ω
mA  
0.2  
0.20  
380  
120  
Supply Current  
ISY  
VIN = 2.5 V  
ADD8504  
ADD8505  
ADD8506  
2.7  
3.0  
3.9  
3.8  
4.4  
5.1  
6.5  
mA  
mA  
mA  
V
Supply Voltage Range  
DYNAMIC PERFORMANCE  
Slew Rate  
VCC  
SR  
tS  
3.3  
CL = 15 pF  
RL = 250 Ω  
CL = 200 pF, RL = 10 kΩ  
7.0  
6.2  
2.5  
V/μs  
V/μs  
μs  
Settling Time  
6
LOGIC INPUT CHARACTERISTICS  
Input Current Low  
Input Current High  
Input Voltage Low  
Input Voltage Low  
Input Voltage High  
Input Voltage High  
IIL  
IIH  
VIL  
VIL  
VIH  
VIH  
VIN = 0.0 V  
VIN = 5.0 V  
VCC = 5.0 V, −40°C ≤ TA ≤ 105°C  
VCC = 3.3 V, −40°C ≤ TA ≤ 105°C  
VCC = 5.0 V, −40°C ≤ TA ≤ 105°C  
VCC = 3.3 V, −40°C ≤ TA ≤ 105°C  
100  
100  
0.8  
nA  
nA  
V
V
V
0.7  
1.7  
1.4  
V
Rev. B | Page 3 of 8  
 
ADD8504/ADD8505/ADD8506  
ABSOLUTE MAXIMUM RATINGS  
Table 2.  
THERMAL RESISTANCE  
Parameter  
Rating  
Table 3. Thermal Package Characteristics  
Supply Voltage  
7 V  
1
2
Model  
Package Type  
θJA  
θJC  
Unit  
°C/W  
°C/W  
°C/W  
Input Voltage  
GND to VCC  
−65°C to +150°C  
−65°C to +150°C  
300°C  
ADD8504WRUZ 16-Lead Pb-Free TSSOP  
ADD8505WRUZ 20-Lead Pb-Free TSSOP  
ADD8506WRUZ 24-Lead Pb-Free TSSOP  
150 28  
143 45  
128 45  
Storage Temperature Range  
Junction Temperature Range  
Lead Temperature (Soldering, 60 sec)  
1 θJA is specified for natural convection on a two-layer board.  
2 θJC is specified for natural convection on a two-layer board.  
Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
ESD PERFORMANCE  
Table 4.  
Model  
HBM1  
MM2  
400 V  
200 V  
200 V  
FICDM3  
1.0 kV  
1.0 kV  
1.0 kV  
ADD8504WRUZ 4.0 kV  
ADD8505WRUZ 3.5 kV  
ADD8506WRUZ 3.5 kV  
1 Human body model.  
2 Machine model.  
3 Field induced charge device model.  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. B | Page 4 of 8  
 
 
 
ADD8504/ADD8505/ADD8506  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
INA1  
INB1  
INA2  
INB2  
INA3  
INB3  
INA4  
INB4  
INA5  
1
2
3
4
5
6
7
8
9
24 VCC1  
23 OUT1  
22 OUT2  
21 OUT3  
20 VCC2  
19 A/B  
INA1  
INB1  
INA2  
INB2  
INA3  
INB3  
INA4  
INB4  
INA5  
1
2
3
4
5
6
7
8
9
20 VCC1  
19 OUT1  
18 OUT2  
17 OUT3  
16 VCC2  
15 A/B  
INA1  
INB1  
INA2  
INB2  
INA3  
INB3  
INA4  
INB4  
1
2
3
4
5
6
7
8
16 OUT1  
15 OUT2  
14 VCC1  
13 A/B  
18 GND  
17 GND  
16 OUT4  
15 OUT5  
14 OUT6  
13 VCC3  
12 GND  
11 GND  
10 OUT3  
14 GND  
13 GND  
12 OUT4  
11 OUT5  
INB5 10  
INA6 11  
INB6 12  
9
OUT4  
INB5 10  
Figure 5. ADD8505  
5-Channel Buffer  
Figure 6. ADD8504  
4-Channel Buffer  
Figure 4. ADD8506  
6-Channel Buffer  
Table 5. Pin Function Descriptions  
ADD8506 ADD8505 ADD8504  
Pin No.  
Pin No.  
Pin No.  
Mnemonic Function Description  
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
INA1  
INB1  
INA2  
INB2  
INA3  
INB3  
INA4  
INB4  
INA5  
INB5  
INA6  
INB6  
VCC3  
OUT6  
OUT5  
OUT4  
GND  
A/B  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Power In  
Output  
Output  
Output  
Ground  
Input  
Power In  
Output  
Output  
Output  
Power In  
Channel 1 Buffer Input A.  
Channel 1 Buffer Input B.  
Channel 2 Buffer Input A.  
Channel 2 Buffer Input B.  
Channel 3 Buffer Input A.  
Channel 3 Buffer Input B.  
Channel 4 Buffer Input A.  
Channel 4 Buffer Input B.  
Channel 5 Buffer Input A.  
Channel 5 Buffer Input B.  
Channel 6 Buffer Input A.  
Channel 6 Buffer Input B.  
Power Supply Input. Short to VCC1 and VCC2. Typically connected to +5 V.  
Channel 6 Buffer Output.  
Channel 5 Buffer Output.  
Channel 4 Buffer Output.  
Ground.  
9
9
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
9
11, 12  
13  
N/A  
10  
10  
11  
12  
13  
14  
15  
16  
17, 18  
19  
20  
21  
22  
23  
24  
10  
N/A  
N/A  
N/A  
N/A  
11  
12  
13, 14  
15  
16  
17  
18  
19  
20  
Switch Control. Logic high selects Input A; logic low selects Input B.  
Power Supply Input. Short to VCC1 and VCC3. Typically connected to +5 V.  
Channel 3 Buffer Output.  
Channel 2 Buffer Output.  
Channel 1 Buffer Output.  
VCC2  
OUT3  
OUT2  
OUT1  
VCC1  
15  
16  
14  
Power Supply Input. Short to VCC2 and VCC3. Typically connected to +5 V.  
Rev. B | Page 5 of 8  
 
ADD8504/ADD8505/ADD8506  
TYPICAL PERFORMANCE CHARACTERISTICS  
5.5  
V
T
= 2.5V  
= 25°C  
CM  
5V  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
A
VCC = 5V  
= 25°C  
T
A
INPUT  
0V  
5V  
OUTPUT  
0V  
0.5  
0
0
1
2
3
4
5
6
7
CH1 2.00V CH2 2.00V  
M400ns  
SUPPLY VOLTAGE (V)  
Figure 7. Supply Current vs. Supply Voltage  
Figure 10. Transient Response—Rising  
1000  
100  
10  
VCC = 5V  
= 25°C  
5V  
T
A
INPUT  
VCC = 5V  
= 25°C  
T
A
0V  
5V  
OUTPUT HIGH  
OUTPUT LOW  
OUTPUT  
0V  
1
0
1
10  
100  
CH1 2.00V CH2 2.00V  
M400ns  
LOAD CURRENT (mA)  
Figure 8. Δ Output Voltage to Supply Rail vs. Load Current  
Figure 11. Transient Response—Falling  
6
VCC = 5V  
V
= 2.5V  
CM  
CH6  
4
2
CH2  
CH5  
0
CH3  
CH1  
–2  
–4  
–6  
–8  
CH4  
–40  
0
25  
40  
80  
90  
95  
100  
105  
TEMPERATURE (°C)  
Figure 9. Offset Voltage vs. Temperature  
Rev. B | Page 6 of 8  
 
ADD8504/ADD8505/ADD8506  
APPLICATIONS  
The ADD8504/ADD8505/ADD8506 have CMOS buffers with  
A/B inputs to select between two different reference voltages set  
up by an external resistor ladder. Input bias currents are orders  
of magnitude less than competitive parts. This allows the use of  
a very large resistor ladder to save supply current.  
Power supply pins on the ADD8505 and ADD8506 have  
multiple ground (GND) and supply (VCC) connections.  
Because of the high peak currents that these buffers deliver, it  
is recommended that all GND and VCC pins be connected and  
suitably bypassed.  
The buffer outputs are designed to drive resistive or capacitive  
loads. Therefore, to attain the best display performance, do not  
use resistors in series with these outputs. Outputs have high  
slew rates and 6 μs settling times. Each output delivers a mini-  
mum of 120 mA, ensuring a fast response to varying loads.  
Table 6. MUX Function  
A/B Select  
Logic High  
Logic Low  
Input  
INAx  
INBx  
VCOM  
(INVERTING SIGNAL)  
5V  
5V  
0.1μF  
0.1μF  
RA1  
RB1  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
TO COLUMN  
DRIVERS  
RA2  
2
3
RB2  
4
RA3  
RA4  
RA5  
RA6  
RB3  
RB4  
RB5  
RB6  
5
6
7
8
9
10  
11
12  
RA7  
RB7  
5V  
0.1μF  
NOTES  
1. RAx RESISTORS ARE USED TO SET POSITIVE INVERSION GAMMA VOLTAGES.  
2. RBx RESISTORS ARE USED TO SET NEGATIVE INVERSION GAMMA VOLTAGES.  
Figure 12. Typical Application  
Rev. B | Page 7 of 8  
 
ADD8504/ADD8505/ADD8506  
OUTLINE DIMENSIONS  
5.10  
5.00  
4.90  
6.60  
6.50  
6.40  
16  
9
20  
11  
10  
4.50  
4.40  
4.30  
4.50  
4.40  
4.30  
6.40  
BSC  
6.40 BSC  
1
8
1
PIN 1  
PIN 1  
0.65  
BSC  
1.20  
MAX  
0.15  
0.05  
1.20 MAX  
0.20  
0.09  
0.15  
0.05  
0.20  
0.09  
0.75  
0.60  
0.45  
0.75  
0.60  
0.45  
8°  
0°  
0.30  
0.19  
8°  
0°  
0.30  
0.19  
0.65  
BSC  
SEATING  
PLANE  
COPLANARITY  
0.10  
SEATING  
PLANE  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-153-AC  
COMPLIANT TO JEDEC STANDARDS MO-153-AB  
Figure 14. 20-Lead Thin Shrink Small Outline Package [TSSOP]  
(RU-20)  
Figure 13. 16-Lead Thin Shrink Small Outline Package [TSSOP]  
(RU-16)  
Dimensions shown in millimeters  
Dimensions shown in millimeters  
7.90  
7.80  
7.70  
24  
13  
12  
4.50  
4.40  
4.30  
6.40 BSC  
1
PIN 1  
0.65  
BSC  
1.20  
MAX  
0.15  
0.05  
0.75  
0.60  
0.45  
8°  
0°  
0.30  
0.19  
0.20  
0.09  
SEATING  
PLANE  
0.10 COPLANARITY  
COMPLIANT TO JEDEC STANDARDS MO-153-AD  
Figure 15. 24-Lead Thin Shrink Small Outline Package [TSSOP]  
(RU-24)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Temperature  
Range  
Package  
Option  
Ordering  
Quantity  
Model  
Package Description  
ADD8504WRUZ1  
ADD8504WRUZ-REEL71  
ADD8504WRUZ-REEL1  
ADD8505WRUZ1  
ADD8505WRUZ-REEL71  
ADD8505WRUZ-REEL1  
ADD8506WRUZ1  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
16-Lead Thin Shrink Small Outline Package [TSSOP], Tube  
16-Lead Thin Shrink Small Outline Package [TSSOP], 7Reel  
16-Lead Thin Shrink Small Outline Package [TSSOP], 13Reel  
20-Lead Thin Shrink Small Outline Package [TSSOP], Tube  
20-Lead Thin Shrink Small Outline Package [TSSOP], 7Reel  
20-Lead Thin Shrink Small Outline Package [TSSOP], 13Reel  
24-Lead Thin Shrink Small Outline Package [TSSOP], Tube  
24-Lead Thin Shrink Small Outline Package [TSSOP], 7Reel  
24-Lead Thin Shrink Small Outline Package [TSSOP], 13Reel  
RU-16  
RU-16  
RU-16  
RU-20  
RU-20  
RU-20  
RU-24  
RU-24  
RU-24  
96  
1,000  
2,500  
96  
1,000  
2,500  
96  
ADD8506WRUZ-REEL71 −40°C to +105°C  
ADD8506WRUZ-REEL1  
1,000  
2,500  
−40°C to +105°C  
1 Z = Pb-free part.  
©2006 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D05549-0-1/06(B)  
Rev. B | Page 8 of 8  
 
 
 

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