ADG333ABRZ1 [ADI]

Quad SPDT Switch; 四路SPDT开关
ADG333ABRZ1
型号: ADG333ABRZ1
厂家: ADI    ADI
描述:

Quad SPDT Switch
四路SPDT开关

开关 光电二极管
文件: 总12页 (文件大小:317K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Quad SPDT Switch  
ADG333A  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
44 V supply maximum ratings  
VSS to VDD analog signal range  
Low on resistance (45 Ω max)  
Low ∆RON (5 Ω max)  
S4A  
D2  
S1A  
D1  
S4B  
S1B  
IN1  
IN4  
Low RON match (4 Ω max)  
Low power dissipation  
Fast switching times  
tON < 175 ns  
ADG333A  
IN2  
IN3  
S2B  
D2  
S3B  
D3  
tOFF < 145 ns  
S2A  
S3A  
Low leakage currents (5 nA max)  
Low charge injection (10 pC max)  
Break-before-make switching action  
SWITCHES SHOWN FOR A LOGIC 1 INPUT  
Figure 1.  
APPLICATIONS  
Audio and video switching  
Battery-powered systems  
Test equipment  
Communication systems  
GENERAL DESCRIPTION  
PRODUCT HIGHLIGHTS  
The ADG333A is a monolithic CMOS device comprising four  
independently selectable SPDT switches. It is designed on an  
LC2MOS process, which provides low power dissipation yet  
achieves a high switching speed and a low on resistance.  
1. Extended signal range.  
The ADG333A is fabricated on an enhanced LC2MOS  
process, giving an increased signal range which extends to  
the supply rails.  
2. Low power dissipation.  
The on resistance profile is very flat over the full analog input  
range, ensuring good linearity and low distortion when  
switching audio signals. High switching speed also makes the  
part suitable for video signal switching. CMOS construction  
ensures ultralow power dissipation, making the part ideally  
suited for portable, battery-powered instruments.  
3. Low RON  
.
4. Single-supply operation.  
For applications where the analog signal is unipolar, the  
ADG333A can be operated from a single rail power supply.  
The part is fully specified with a single 12 V supply.  
When they are on, each switch conducts equally well in both  
directions and has an input signal range that extends to the  
power supplies. In the off condition, signal levels up to the  
supplies are blocked. All switches exhibit break-before-make  
switching action for use in multiplexer applications. Inherent  
in the design is low charge inject  
Rev. A  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
© 2005 Analog Devices, Inc. All rights reserved.  
ADG333A  
TABLE OF CONTENTS  
Specifications..................................................................................... 3  
Typical Performance Characteristics ..............................................8  
Test Circuits..................................................................................... 10  
Application Information................................................................ 11  
ADG333A Supply Voltages....................................................... 11  
Power Supply Sequencing ......................................................... 11  
Outline Dimensions....................................................................... 12  
Ordering Guide .......................................................................... 12  
Dual Supply ................................................................................... 3  
Single Supply ................................................................................. 4  
Absolute Maximum Ratings............................................................ 5  
ESD Caution.................................................................................. 5  
Terminology ...................................................................................... 6  
Pin Configurations and Function Descriptions ........................... 7  
REVISION HISTORY  
3/05—Rev. 0 to Rev. A  
Updated Format..................................................................Universal  
Changes to Specifications Tables.................................................... 3  
Updated Outline Dimensions....................................................... 12  
Changes to Ordering Guide .......................................................... 12  
10/95—Revision 0: Initial Version  
Rev. A | Page 2 of 12  
ADG333A  
SPECIFICATIONS  
DUAL SUPPLY  
VDD = +15 V, VSS = −15 V, GND = 0 V, unless otherwise noted.1  
Table 1.  
Parameter  
+25°C  
−40°C to +85°C  
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
RON  
VSS to VDD  
V
20  
45  
Ω typ  
Ω max  
Ω max  
Ω max  
VD = 10 Vꢀ IS = –1 mA  
45  
5
VD = 5 Vꢀ IS = –10 mA  
VD = 10 Vꢀ IS = –10 mA  
VDD = +16.5 Vꢀ VSS = –16.5 V  
VD = 15.5 Vꢀ VS = +15.5 V  
Figure 15  
RON  
RON Match  
4
LEAKAGE CURRENTS  
Source OFF Leakage IS (OFF)  
0.1  
nA typ  
nA max  
nA typ  
nA max  
0.25  
0.1  
3
5
Channel ON Leakage IDꢀ IS (ON)  
VS = VD = 15.5 V  
0.4  
Figure 16  
DIGITAL INPUTS  
Input High Voltageꢀ VINH  
Input Low Voltageꢀ VINL  
Input Current  
2.4  
0.8  
V min  
V max  
IINL or IINH  
0.005  
0.5  
µA typ  
µA max  
VIN = 0 V or VDD  
DYNAMIC CHARACTERISTICS2  
tON  
90  
80  
10  
ns typ  
ns max  
ns typ  
ns max  
ns min  
RL= 300 Ωꢀ CL = 35 pF;  
VS = 10 V; Figure 17  
RL = 300 Ωꢀ CL = 35 pF;  
VS = 10 V; Figure 17  
RL = 300 Ωꢀ CL= 35 pF;  
VS = +5 V; Figure 18  
175  
145  
tOFF  
Break-Before-Make Delayꢀ tOPEN  
Charge Injection  
2
10  
72  
pC typ  
pC max  
dB typ  
VD = 0 Vꢀ RD = 0 Ωꢀ CL= 10 nF;  
VDD = +15 Vꢀ VSS = –15 V; Figure 19  
RL = 75 Ωꢀ CL = 5 pFꢀ f = 1 MHz;  
VS = 2.3 V rms; Figure 20  
OFF Isolation  
Channel-to-Channel Crosstalk  
85  
dB typ  
RL = 75 Ωꢀ CL = 5 pFꢀ f = 1 MHz;  
VS = 2.3 V rms; Figure 21  
CS (OFF)  
CDꢀ CS (ON)  
7
26  
pF typ  
pF typ  
POWER REQUIREMENTS  
IDD  
0.05  
0.25  
0.01  
1
mA typ  
mA max  
µA typ  
Digital inputs = 0 V or 5 V  
0.35  
ISS  
5
µA max  
VDD/VSS  
3/ 20  
V min/V max  
|VDD| = |VSS|  
1 Temperature range is as follows: B version: −40°C to +85°C.  
2 Guaranteed by design; not subject to production test.  
Rev. A | Page 3 of 12  
 
 
ADG333A  
SINGLE SUPPLY  
VDD = +12 V, VSS = 0 V 10ꢀ, GND = 0 V, unless otherwise noted.1  
Table 2.  
Parameter  
+25°C  
−40°C to +85°C  
0 V to VDD  
75  
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
RON  
V
35  
Ω typ  
Ω max  
VD = 1 Vꢀ 10 Vꢀ IS = –1 mA  
LEAKAGE CURRENTS  
VDD = 13.2 V  
Source OFF Leakage IS (OFF)  
0.1  
0.25  
0.1  
nA typ  
nA max  
nA typ  
nA max  
VD = 12.2 V/1 Vꢀ VS = 1 V/12.2 V  
Figure 15  
VS = VD = 12.2 V/1 V  
Figure 16  
3
5
Channel ON Leakage IDꢀ IS (ON)  
0.4  
DIGITAL INPUTS  
Input High Voltageꢀ VINH  
Input Low Voltageꢀ VINL  
Input Current  
2.4  
0.8  
V min  
V max  
IINL or IINH  
0.005  
0.5  
µA typ  
µA max  
VIN = 0 V or VDD  
DYNAMIC CHARACTERISTICS2  
tON  
110  
100  
10  
5
ns typ  
ns max  
ns typ  
ns max  
ns min  
ns min  
pC typ  
RL = 300 Ωꢀ CL = 35 pF;  
VS = 8 V; Figure 17  
RL = 300 Ωꢀ CL = 35 pF;  
VS = 8 V; Figure 17  
RL = 300 Ωꢀ CL = 35 pF;  
VS = 5 V; Figure 18  
VD = 6 Vꢀ RD = 0 Wꢀ CL = 10 nF;  
VDD = 12 Vꢀ VSS = 0 V; Figure 19  
RL = 75 Ωꢀ CL = 5 pFꢀ f = 1 MHz;  
VS = 1.15 V rms; Figure 20  
RL = 75 Ωꢀ CL = 5 pFꢀ f = 1 MHz;  
VS = 1.15 V rms; Figure 21  
200  
180  
tOFF  
Break-Before-Make Delayꢀ tOPEN  
Charge Injection  
OFF Isolation  
72  
85  
dB typ  
dB typ  
Channel-to-Channel Crosstalk  
CS (OFF)  
CDꢀ CS (ON)  
12  
25  
pF typ  
pF typ  
POWER REQUIREMENTS  
IDD  
VDD = 13.5 V  
Digital inputs = 0 V or 5 V  
0.05  
0.25  
mA typ  
mA max  
0.35  
VDD  
3/ 30  
V min/V max  
1 Temperature range is as follows: B Version: −40°C to +85°C.  
2 Guaranteed by design; not subject to production test.  
Rev. A | Page 4 of 12  
 
 
ADG333A  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C unless otherwise noted.  
Table 3.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Min  
VDD to VSS  
+44 V  
VDD to GND  
VSS to GND  
Analogꢀ Digital Inputs1  
–0.3 V to +30 V  
+0.3 V to –30 V  
VSS – 2 V to VDD + 2 V or 20 mAꢀ  
whichever occurs first  
Continuous Currentꢀ S or D  
Peak Currentꢀ S or D (Pulsed at  
1 msꢀ 10% Duty Cycle Max)  
20 mA  
40 mA  
Table 4. Truth Table  
Operating Temperature Range  
Industrial (B Version)  
Storage Temperature Range  
Junction Temperature  
θJAꢀ Thermal Impedance  
PDIP Package  
SOIC Package  
SSOP Package  
Lead Temperatureꢀ Soldering  
(10 sec)  
Logic  
Switch A  
Switch B  
On  
Off  
−40°C to +85°C  
−65°C to +125°C  
150°C  
0
1
Off  
On  
103°C/W  
74°C/W  
130°C/W  
260°C  
Lead Temperatureꢀ Soldering  
Vapor Phase (60 sec)  
Infrared (15 sec)  
215°C  
220°C  
Lead Temperatureꢀ Soldering  
Vapor Phase (60 sec)  
Infrared (15 sec)  
215°C  
220°C  
1 Overvoltage at INꢀ Sꢀ or D is clamped by internal diodes. Current should be  
limited to the maximum ratings given.  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitryꢀ permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Thereforeꢀ proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. A | Page 5 of 12  
 
 
 
ADG333A  
TERMINOLOGY  
RON  
tON  
Ohmic resistance between D and S.  
Delay between applying the digital control input and the output  
switching on.  
∆RON  
tOFF  
RON variation due to a change in the analog input voltage with a  
constant load current.  
Delay between applying the digital control input and the output  
switching off.  
RON Match  
tOPEN  
Difference between the RON of any two channels.  
IS (OFF)  
Break-before-make delay when switches are configured as a  
multiplexer.  
Source leakage current with the switch off.  
ID (OFF)  
VINL  
Maximum input voltage for Logic 0.  
VINH  
Drain leakage current with the switch off.  
ID, IS (ON)  
Minimum input voltage for Logic 1.  
Channel leakage current with the switch on.  
VD (VS)  
IINL (IINH  
)
Input current of the digital input.  
Analog voltage on Terminals D, S.  
CS (OFF)  
Crosstalk  
A measure of unwanted signal which is coupled through from  
one channel to another as a result of parasitic capacitance.  
OFF switch source capacitance.  
CD (OFF)  
Off Isolation  
A measure of unwanted signal coupling through an OFF switch.  
OFF switch drain capacitance.  
CD, CS (ON)  
Charge Injection  
A measure of the glitch impulse transferred from the digital  
input to the analog output during switching.  
ON switch capacitance.  
Rev. A | Page 6 of 12  
 
ADG333A  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
IN1  
S1A  
D1  
1
2
3
4
5
6
7
8
9
20 IN4  
19 S4A  
18 D4  
IN1  
S1A  
D1  
1
2
3
4
5
6
7
8
9
20 IN4  
19 S4A  
18 D4  
IN1  
S1A  
D1  
1
2
3
4
5
6
7
8
9
20 IN4  
19 S4A  
18 D4  
S1B  
17 S4B  
ADG333A  
TOP VIEW  
(Not to Scale)  
S1B  
ADG333A  
TOP VIEW  
(Not to Scale)  
17 S4B  
ADG333A  
S1B  
17 S4B  
V
16  
V
DD  
SS  
TOP VIEW  
V
16  
V
DD  
V
16  
V
DD  
SS  
SS  
GND  
S2B  
D2  
15 NC  
14 S3B  
13 D3  
(Not to Scale)  
GND  
S2B  
D2  
15 NC  
14 S3B  
13 D3  
GND  
S2B  
D2  
15 NC  
14 S3B  
13 D3  
S2A  
12 S3A  
11 IN3  
S2A  
12 S3A  
11 IN3  
S2A  
12 S3A  
11 IN3  
IN2 10  
IN2 10  
IN2 10  
NC = NO CONNECT  
NC = NO CONNECT  
NC = NO CONNECT  
Figure 2. PDIP Pin Configuration  
Figure 3. SOIC Pin Configuration  
Figure 4. SSOP Pin Configuration  
Table 5. Pin Function Descriptions  
Pin No.  
Mnemonic  
Description  
1ꢀ 10ꢀ 11ꢀ 20  
IN1ꢀ IN2ꢀ IN3ꢀ IN4  
Logic Control Input.  
2ꢀ 4ꢀ 7ꢀ 9ꢀ 12ꢀ 14ꢀ  
17ꢀ 19  
S1Aꢀ S1Bꢀ S2Bꢀ S2Aꢀ  
S3Aꢀ S3Bꢀ S4Bꢀ S4A  
Source Terminal. Can be an input or output.  
3ꢀ 8ꢀ 13ꢀ 18  
5
D1ꢀ D2ꢀ D3ꢀ D4  
VSS  
Drain Terminal. Can be an input or output.  
Most Negative Power Supply Potential in Dual Supplies. In single-supply applicationsꢀ it can be  
connected to ground.  
6
15  
16  
GND  
NC  
VDD  
Ground (0 V) Reference.  
No Connect.  
Most Positive Power Supply Potential.  
Rev. A | Page 7 of 12  
 
ADG333A  
TYPICAL PERFORMANCE CHARACTERISTICS  
60  
60  
V
V
= 15V  
= 0V  
T
= 25°C  
DD  
SS  
A
50  
40  
30  
50  
40  
30  
V
V
= +5V  
= –5V  
DD  
SS  
+125°C  
+85°C  
V
V
= +10V  
= –10V  
DD  
SS  
20  
10  
20  
10  
+25°C  
–40°C  
V
V
= +15V  
= –15V  
DD  
SS  
–15  
–10  
–5  
0
5
10  
15  
0
3
6
9
12  
15  
V
, V (V)  
V
, V (V)  
DD  
S
DD S  
Figure 5. RON as a Function of VD (VS):  
Dual Supply  
Figure 8. RON as a Function of VD (VS) for Different Temperatures:  
Single Supply  
100  
0.004  
T
= 25°C  
A
V
V
T
= +16.5V  
= –16.5V  
= 25°C  
DD  
SS  
90  
80  
0.002  
0
I
(OFF)  
A
S
V
V
= +5V  
= –5V  
DD  
SS  
70  
60  
–0.002  
–0.004  
–0.006  
I
(ON)  
S
50  
40  
V
V
= +10V  
= –10V  
DD  
SS  
I
(ON)  
D
V
V
= +15V  
= –15V  
DD  
SS  
–0.008  
–0.010  
30  
20  
0
3
6
9
12  
15  
–15  
–10  
–5  
0
5
10  
15  
V
, V (V)  
V , V (V)  
D S  
DD  
S
Figure 6. RON as a Function of VD (VS):  
Single Supply  
Figure 9. Leakage Currents as a Function of VD (VS):  
Dual Supply  
45  
0.001  
0
V
V
= +15V  
= –15V  
DD  
SS  
I (OFF)  
S
40  
35  
V
V
= +16.5V  
= –16.5V  
= 25°C  
DD  
SS  
T
A
+125°C  
–0.001  
–0.002  
30  
25  
20  
+85°C  
I
(ON)  
D
I
(ON)  
S
–0.003  
–0.004  
15  
10  
–40°C  
+25°C  
–15  
–10  
–5  
0
5
10  
15  
0
3
6
9
12  
V
, V (V)  
V , V (V)  
D S  
DD  
S
Figure 7. RON as a Function of VD (VS) for Different Temperatures:  
Dual Supply  
Figure 10. Leakage Currents as a Function of VD (VS):  
Single Supply  
Rev. A | Page 8 of 12  
 
 
ADG333A  
20  
1
0.8  
0.6  
0.4  
C
= 10nF  
L
V
V
= +16.5V  
= –16.5V  
DD  
SS  
15  
10  
5
T
= 25°C  
A
V
V
= +16.5V  
= –16.5V  
DD  
SS  
0
V
V
= +12V  
= 0V  
DD  
SS  
–5  
–10  
0.2  
0
–15  
–20  
–15  
–10  
–5  
0
5
10  
15  
0
200  
400  
600  
800  
1000  
V
(V)  
S
SWITCHING FREQUENCY (kHz)  
Figure 11. Charge Injection as a Function of VS  
Figure 13. IDD as a Function of Switching Frequency  
160  
140  
120  
100  
V
V
= +2V  
= –2V  
D
S
80  
60  
0
5
10  
(V)  
15  
20  
V
DD  
Figure 12. Switching Time as a Function of VD  
Rev. A | Page 9 of 12  
ADG333A  
TEST CIRCUITS  
I
DS  
V
1
I
(ON)  
A
I
(OFF)  
A
D
S
NC  
S
D
S
D
S
D
V
V
D
V
V
D
D
S
R
= V /I  
DS  
NC = NO CONNECT  
ON  
1
Figure 14. On Resistance  
Figure 15. Off Leakage  
Figure 16. On Leakage  
V
DD  
0.1µF  
+3V  
V
DD  
50%  
50%  
–10V  
SB  
V
V
IN  
D
0V  
V
S
V
OUT  
R
300Ω  
C
L
SA  
L
+10V  
35pF  
+10V  
0V  
tOFF  
IN  
S
V
V
GND  
SS  
50%  
50%  
tON  
–10V  
0.1µF  
SS  
Figure 17. Switching Times  
V
V
DD  
0.1µF  
3V  
DD  
V
V
IN  
V
S
SB  
SA  
D
V
0V  
V
OUT  
R
L
300Ω  
C
L
35pF  
V
S
IN  
50%  
50%  
OUT  
GND  
SS  
tOPEN  
0.1µF  
V
SS  
Figure 18. Break-Before-Make Delay, tOPEN  
V
V
DD  
DD  
3V  
R
D
V
IN  
V
OUT  
V
D
0V  
0V  
D
SA  
C
L
10nF  
IN  
V
OUT  
Q
= C  
×
V  
OUT  
V  
OUT  
INJ  
L
V
V
GND  
SS  
SS  
Figure 19. Charge Injection  
V
V
DD  
0.1µF  
DD  
V
DD  
75Ω  
0.1µF  
S
D
V
DD  
V
V
IN2  
IN1  
V
S
V
OUT  
S
D
R
L
S
D
75Ω  
V
V
NC  
IN  
OUT  
R
75Ω  
L
V
V
SS  
GND  
GND  
SS  
V
S
CHANNEL-TO-CHANNEL  
CROSSTALK  
0.1µF  
0.1µF  
20  
×
LOG |V /V |  
V
V
S
OUT  
SS  
SS  
Figure 20. Off Isolation  
Figure 21. Channel-to-Channel Crosstalk  
Rev. A | Page 10 of 12  
 
ADG333A  
APPLICATION INFORMATION  
ADG333A SUPPLY VOLTAGES  
POWER SUPPLY SEQUENCING  
The ADG333A can operate from a dual or signal supply. VSS  
should be connected to GND when operating with a single  
supply. When using a dual supply, the ADG333A can also  
operate with unbalanced supplies; for example VDD = 20 V and  
When using CMOS devices, care must be taken to ensure  
correct power-supply sequencing. Incorrect power-supply  
sequencing can result in the device being subjected to stresses  
beyond those listed in the Absolute Maximum Ratings. This is  
also true for the ADG333A. Always turn on VDD first, followed  
by VSS and the logic signals. An external signal within the maxi-  
mum specified ratings can then be safely presented to the source  
or drain of the switch  
VSS = −5 V. The only restrictions are that VDD to GND must not  
exceed 30 V, VSS to GND must not drop below −30 V, and VDD  
to VSS must not exceed +44 V. It is important to remember that  
the ADG333A supply voltage directly affects the input signal  
range, the switch on resistance and the switching times of the  
part. The effects of the power supplies on these characteristics  
can be clearly seen from the Typical Performance Characteristics  
curves.  
Rev. A | Page 11 of 12  
 
ADG333A  
OUTLINE DIMENSIONS  
1.060 (26.92)  
1.030 (26.16)  
0.980 (24.89)  
13.00 (0.5118)  
12.60 (0.4961)  
20  
1
11  
0.280 (7.11)  
0.250 (6.35)  
0.240 (6.10)  
10  
20  
1
11  
10  
0.325 (8.26)  
0.310 (7.87)  
0.300 (7.62)  
7.60 (0.2992)  
7.40 (0.2913)  
PIN 1  
0.100 (2.54)  
BSC  
0.060 (1.52)  
MAX  
0.195 (4.95)  
0.130 (3.30)  
0.115 (2.92)  
10.65 (0.4193)  
10.00 (0.3937)  
0.210  
(5.33)  
MAX  
0.015  
(0.38)  
MIN  
0.150 (3.81)  
0.015 (0.38)  
GAUGE  
PLANE  
0.130 (3.30)  
0.115 (2.92)  
2.65 (0.1043)  
2.35 (0.0925)  
0.014 (0.36)  
0.010 (0.25)  
0.008 (0.20)  
0.75 (0.0295)  
0.25 (0.0098)  
SEATING  
PLANE  
× 45°  
0.30 (0.0118)  
0.10 (0.0039)  
0.022 (0.56)  
0.430 (10.92)  
MAX  
0.005 (0.13)  
MIN  
0.018 (0.46)  
0.014 (0.36)  
8°  
0°  
0.070 (1.78)  
0.060 (1.52)  
0.045 (1.14)  
1.27  
(0.0500)  
BSC  
SEATING  
PLANE  
0.51 (0.0201)  
0.31 (0.0122)  
1.27 (0.0500)  
0.40 (0.0157)  
COPLANARITY  
0.10  
0.33 (0.0130)  
0.20 (0.0079)  
COMPLIANT TO JEDEC STANDARDS MS-001-AD  
COMPLIANT TO JEDEC STANDARDS MS-013AC  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN  
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.  
Figure 22. 20-Lead Plastic Dual In-Line Package [PDIP]  
Narrow Body (N-20)  
Figure 23. 20-Lead Standard Small Outline Package [SOIC]  
Wide Body (R-20)  
Dimensions shown in inches and (millimeters)  
Dimensions shown in millimeters and (inches)  
7.50  
7.20  
6.90  
20  
11  
5.60  
5.30  
5.00  
8.20  
7.80  
7.40  
1
10  
PIN 1  
1.85  
1.75  
1.65  
2.00 MAX  
0.25  
0.09  
8°  
4°  
0°  
0.65  
0.95  
0.75  
0.55  
0.38  
0.22  
0.05 MIN  
BSC  
SEATING  
PLANE  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-150AE  
Figure 24. 20-Lead Shrink Small Outline Package [SSOP]  
(RS-20)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model  
ADG333ABN  
Temperature Range  
Package Description  
Package Option  
N-20  
R-20  
R-20  
R-20  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
20-Lead Plastic Dual In-Line Package (PDIP)  
20-Lead Standard Small Outline Package (SOIC)  
20-Lead Standard Small Outline Package (SOIC)  
20-Lead Standard Small Outline Package (SOIC)  
20-Lead Standard Small Outline Package (SOIC)  
20-Lead Shrink Small Outline Package (SSOP)  
20-Lead Shrink Small Outline Package (SSOP)  
20-Lead Shrink Small Outline Package (SSOP)  
20-Lead Shrink Small Outline Package (SSOP)  
ADG333ABR  
ADG333ABR-REEL  
ADG333ABRZ1  
ADG333ABRZ-REEL1  
ADG333ABRS  
ADG333ABRS-REEL  
ADG333ABRSZ1  
ADG333ABRSZ-REEL1  
R-20  
RS-20  
RS-20  
RS-20  
RS-20  
1 Z = Pb-free part.  
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
C01212–0–3/05(A)  
Rev. A | Page 12 of 12  
 
 

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