ADG701L [ADI]

CMOS Low Voltage 2 OHM SPST Switches; CMOS低压2 OHM SPST开关
ADG701L
型号: ADG701L
厂家: ADI    ADI
描述:

CMOS Low Voltage 2 OHM SPST Switches
CMOS低压2 OHM SPST开关

开关
文件: 总12页 (文件大小:265K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CMOS Low Voltage  
2 Ω SPST Switches  
ADG701L/ADG702L  
FUNCTIONAL BLOCK DIAGRAMS  
FEATURES  
1.8 V to 5.5 V single supply  
2 Ω (typical) on resistance  
Low on resistance flatness  
Guaranteed leakage specifications up to 85°C  
–3 dB bandwidth > 200 MHz  
Rail-to-rail operation  
ADG701L  
S
D
IN  
Fast switching times  
SWITCHES SHOWN  
FOR A LOGIC 1 INPUT  
tON 18 ns  
t
OFF 12 ns  
Figure 1.  
Typical power consumption < 0.01 μW  
TTL/CMOS-compatible  
ADG702L  
APPLICATIONS  
S
D
Battery-powered systems  
Communication systems  
Sample-and-hold systems  
Audio signal routing  
Video switching  
Mechanical reed relay replacement  
IN  
SWITCHES SHOWN  
FOR A LOGIC 1 INPUT  
Figure 2.  
PRODUCT HIGHLIGHTS  
GENERAL DESCRIPTION  
1. 1.8 V to 5.5 V single-supply operation. The ADG701L/  
ADG702L offer high performance, including low on  
resistance and fast switching times. The ADG701L/  
ADG702L are fully specified and guaranteed with 3 V  
and 5 V supply rails.  
The ADG701L/ADG702L are monolithic CMOS SPST switches.  
These switches are designed using an advanced submicron  
process that provides low power dissipation, yet offers high  
switching speed, low on resistance, and low leakage currents.  
In addition, −3 dB bandwidths of greater than 200 MHz can  
be achieved.  
2. Very low RON (3 Ω maximum at 5 V, 5 Ω maximum at 3 V).  
At 1.8 V operation, RON is typically 40 Ω over the  
temperature range.  
The ADG701L/ADG702L can operate from a single 1.8 V to  
5.5 V supply, making it ideal for use in battery-powered  
instruments and with the new generation of DACs and ADCs  
from Analog Devices.  
3. On resistance flatness RFLAT(ON) (1 Ω maximum).  
4. −3 dB bandwidth > 200 MHz.  
Figure 1 and Figure 2 show that with a logic input of 1, the  
switch of the ADG701L is closed, while that of the ADG702L  
is open. Each switch conducts equally well in both directions  
when on.  
5. Low power dissipation. CMOS construction ensures low  
power dissipation.  
6. Fast tON/tOFF  
.
The ADG701L/ADG702L are packaged as 5-lead SOT-23,  
6-lead SOT-23, and 8-lead MSOP.  
Rev. 0  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2006 Analog Devices, Inc. All rights reserved.  
 
 
 
ADG701L/ADG702L  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Typical Performance Characteristics ..............................................7  
Test Circuits........................................................................................8  
Terminology.......................................................................................9  
Applications Information.............................................................. 10  
Supply Voltages........................................................................... 10  
Bandwidth ................................................................................... 10  
Off Isolation ................................................................................ 10  
Outline Dimensions....................................................................... 11  
Ordering Guide .......................................................................... 12  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Functional Block Diagrams............................................................. 1  
Product Highlights ........................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Absolute Maximum Ratings............................................................ 5  
ESD Caution.................................................................................. 5  
Pin Configurations and Function Descriptions ........................... 6  
REVISION HISTORY  
11/06—Revision 0: Initial Version  
Rev. 0 | Page 2 of 12  
 
ADG701L/ADG702L  
SPECIFICATIONS  
VDD = 5 V 10%, GND = 0 V. Temperature range for the B version is −40°C to +85°C, unless otherwise noted.  
Table 1.  
B Version  
40°C to  
Parameter  
+25°C  
+85°C  
0 V to VDD  
4
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
On Resistance (RON)  
V
2
Ω typ  
Ω max  
Ω typ  
Ω max  
VS = 0 V to VDD, IS = 10 mA; see Figure 12  
VS = 0 V to VDD, IS = 10 mA  
3
On Resistance Flatness (RFLAT(ON)  
)
0.5  
1.0  
LEAKAGE CURRENTS  
VDD = 5.5 V  
Source Off Leakage, IS (OFF)  
0.01  
0.25  
0.01  
0.25  
0.01  
0.25  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
VS = 4.5 V/1 V, VD = 1 V/4.5 V; see Figure 13  
0.35  
0.35  
0.35  
Drain Off Leakage, ID (OFF)  
VS = 4.5 V/1 V, VD = 1 V/4.5 V; see Figure 13  
VS = VD = 1 V, or 4.5 V; see Figure 14  
Channel On Leakage, ID, IS (ON)  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current  
2.4  
0.8  
V min  
V max  
IINL or IINH  
0.005  
μA typ  
VIN = VINL or VINH  
0.1  
μA max  
DYNAMIC CHARACTERISTICS1  
tON  
12  
8
ns typ  
ns max  
ns typ  
ns max  
pC typ  
dB typ  
dB typ  
MHz typ  
RL = 300 Ω, CL = 35 pF  
VS = 3 V; see Figure 15  
RL = 300 Ω, CL = 35 pF  
VS = 3 V; see Figure 15  
VS = 2 V, RS = 0 Ω, CL = 1 nF; see Figure 16  
RL = 50 Ω, CL = 5 pF, f = 10 MHz  
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 17  
RL = 50 Ω, CL = 5 pF; see Figure 18  
18  
12  
tOFF  
Charge Injection  
Off Isolation  
5
55  
75  
200  
Bandwidth 3 dB  
CS (OFF)  
CD (OFF)  
17  
17  
38  
pF typ  
pF typ  
pF typ  
CD, CS (ON)  
POWER REQUIREMENTS  
IDD  
VDD = 5.5 V  
Digital inputs = 0 V or 5 V  
0.001  
μA typ  
1.0  
μA max  
1 Guaranteed by design, not subject to production test.  
Rev. 0 | Page 3 of 12  
 
 
ADG701L/ADG702L  
VDD = 3 V 10%, GND = 0 V. Temperature range for the B version is −40°C to +85°C, unless otherwise noted.  
Table 2.  
B Version  
40°C to  
Parameter  
+25°C  
+85°C  
0 V to VDD  
6
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
On Resistance (RON)  
V
3.5  
5
Ω typ  
Ω max  
Ω typ  
VS = 0 V to VDD, IS = 10 mA; see Figure 12  
VS = 0 V to VDD, IS = 10 mA  
On Resistance Flatness (RFLAT(ON)  
)
1.5  
LEAKAGE CURRENTS  
VDD = 3.3 V  
Source Off Leakage IS (OFF)  
0.01  
0.25  
0.01  
0.25  
0.01  
0.25  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
VS = 3 V/1 V, VD = 1 V/3 V; see Figure 13  
0.35  
0.35  
0.35  
Drain Off Leakage ID (OFF)  
VS = 3 V/1 V, VD = 1 V/3 V; see Figure 13  
VS = VD = 1 V, or 3 V; see Figure 14  
Channel On Leakage ID, IS (ON)  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current  
2.0  
0.4  
V min  
V max  
IINL or IINH  
0.005  
μA typ  
VIN = VINL or VINH  
0.1  
μA max  
DYNAMIC CHARACTERISTICS1  
tON  
14  
8
ns typ  
ns max  
ns typ  
ns max  
pC typ  
dB typ  
dB typ  
MHz typ  
pF typ  
pF typ  
pF typ  
RL = 300 Ω, CL = 35 pF  
VS = 2 V, see Figure 15  
20  
13  
tOFF  
RL = 300 Ω, CL = 35 pF  
VS = 2 V, see Figure 15  
Charge Injection  
Off Isolation  
4
VS = 1.5 V, RS = 0 Ω, CL = 1 nF; see Figure 16  
RL = 50 Ω, CL = 5 pF, f = 10 MHz  
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 17  
RL = 50 Ω, CL = 5 pF; see Figure 18  
55  
75  
200  
17  
17  
38  
Bandwidth 3 dB  
CS (OFF)  
CD (OFF)  
CD, CS (ON)  
POWER REQUIREMENTS  
IDD  
VDD = 3.3 V  
Digital Inputs = 0 V or 3 V  
0.001  
μA typ  
1.0  
μA max  
1 Guaranteed by design, not subject to production test.  
Rev. 0 | Page 4 of 12  
 
ADG701L/ADG702L  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Table 3.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
VDD to GND  
Analog, Digital Inputs1  
0.3 V to +7 V  
0.3 V to VDD + 0.3 V or 30 mA,  
whichever occurs first  
30 mA  
100 mA, pulsed at 1 ms,  
10% duty cycle maximum  
Continuous Current, S or D  
Peak Current, S or D  
Operating Temperature Range  
Industrial (B Version)  
40°C to +85°C  
65°C to +150°C  
150°C  
Storage Temperature Range  
Junction Temperature  
MSOP Package, Power Dissipation 315 mW  
θJA Thermal Impedance  
θJC Thermal Impedance  
206°C/W  
44°C/W  
SOT-23 Package, Power Dissipation 282 mW  
θJA Thermal Impedance  
θJC Thermal Impedance  
Lead Temperature, Soldering  
Vapor Phase (60 sec)  
Infrared (15 sec)  
229.6°C/W  
91.99°C/W  
215°C  
220°C  
Lead-free Reflow Soldering  
Peak Temperature  
Time at Peak Temperature  
ESD  
260 (+0/−5)°C  
10 sec to 40 sec  
2 kV  
1 Overvoltages at IN, S, or D are clamped by internal diodes. Current should be  
limited to the maximum ratings given.  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada-  
tion or loss of functionality.  
Rev. 0 | Page 5 of 12  
 
 
 
ADG701L/ADG702L  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
D
NC  
NC  
1
2
3
4
8
7
6
5
S
D
S
1
2
3
6
5
4
V
DD  
D
S
1
2
3
5
4
V
DD  
ADG701L/  
ADG702L  
TOP VIEW  
(Not to Scale)  
GND  
IN  
ADG701L/  
ADG702L  
ADG701L/  
ADG702L  
NC  
IN  
TOP VIEW  
TOP VIEW  
V
NC  
GND  
DD  
(Not to Scale)  
GND  
IN  
(Not to Scale)  
NC = NO CONNECT  
NC = NO CONNECT  
Figure 3. 8-Lead MSOP Pin Configuration  
Figure 4. 6-Lead SOT-23 Pin Configuration  
Figure 5. 5-Lead SOT-23 Pin Configuration  
Table 4. Pin Function Descriptions  
Pin Number  
Mnemonic  
Description  
8-Lead MSOP 6-lead SOT-23  
5-lead SOT-23  
1
1
5
6
4
3
2
1
N/A  
5
4
3
D
Drain Terminal. May be an input or output.  
No Connect.  
Most Positive Power Supply Potential.  
Logic Control Input.  
Ground (0 V) Reference.  
Source Terminal. May be an input or output.  
2, 3, 5  
NC  
VDD  
IN  
GND  
S
4
6
7
8
2
Table 5. Truth Table  
ADG701L In  
ADG702L In  
Switch Condition  
0
1
1
0
Off  
On  
Rev. 0 | Page 6 of 12  
 
ADG701L/ADG702L  
TYPICAL PERFORMANCE CHARACTERISTICS  
3.5  
10m  
1m  
V
= 5V  
DD  
V
= 2.7V  
T
= 25°C  
DD  
A
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
100μ  
10μ  
1μ  
V
= 4.5V  
V
= 3.0V  
DD  
DD  
V
= 5.0V  
DD  
100n  
10n  
1n  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
10  
100  
1k  
10k  
100k  
1M  
10M  
V
OR V (DRAIN OR SOURCE VOLTAGE (V))  
FREQUENCY (Hz)  
D
S
Figure 9. Supply Current vs. Input Switching Frequency  
Figure 6. On Resistance as a Function of VD (VS) Single Supplies  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
–110  
3.5  
V
= 5V, 3V  
DD  
V
= 3V  
DD  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
+85°C  
+25°C  
–40°C  
10k  
100k  
1M  
10M  
100M  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
FREQUENCY (Hz)  
V
OR V (DRAIN OR SOURCE VOLTAGE (V))  
D
S
Figure 7. On Resistance as a Function of VD (VS) for Different  
Temperatures VDD = 3 V  
Figure 10. Off Isolation vs. Frequency  
3.5  
0
–2  
–4  
–6  
V
= 5V  
DD  
V
= 3V  
DD  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
+85°C  
+25°C  
–40°C  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
10k  
100k  
1M  
10M  
100M  
V
OR V (DRAIN OR SOURCE VOLTAGE (V))  
FREQUENCY (Hz)  
D
S
Figure 8. On Resistance as a Function of VD (VS) for Different  
Temperatures VDD = 5 V  
Figure 11. Bandwidth  
Rev. 0 | Page 7 of 12  
 
 
 
 
ADG701L/ADG702L  
TEST CIRCUITS  
I
DS  
V1  
I
(ON)  
A
I
(OFF)  
A
I
(OFF)  
A
D
S
D
S
D
S
D
S
D
V
R
= V1/I  
V
V
D
V
V
D
S
ON  
DS  
S
S
Figure 12. On Resistance  
Figure 13. Off Leakage  
Figure 14. On Leakage  
V
V
DD  
0.1μF  
V
V
IN  
50%  
50%  
50%  
50%  
ADG701L  
ADG702L  
DD  
V
OUT  
S
D
IN  
R
C
L
L
V
S
300Ω  
35pF  
IN  
90%  
90%  
V
OUT  
GND  
tON  
tOFF  
Figure 15. Switching Times  
V
V
DD  
DD  
V
IN  
ADG701L  
ADG702L  
ON  
OFF  
R
S
S
D
V
OUT  
C
1nF  
L
V
S
V
IN  
IN  
V
OUT  
ΔV  
OUT  
GND  
Q
= C × ΔV  
INJ  
L
OUT  
Figure 16. Charge Injection  
V
V
V
DD  
DD  
0.1μF  
0.1μF  
V
DD  
DD  
V
V
OUT  
OUT  
S
D
S
D
R
50Ω  
R
L
50Ω  
L
IN  
IN  
V
V
IN  
IN  
V
V
S
S
GND  
GND  
Figure 17. Off Isolation  
Figure 18. Bandwidth  
Rev. 0 | Page 8 of 12  
 
 
 
 
 
 
ADG701L/ADG702L  
TERMINOLOGY  
RON  
tON  
Ohmic resistance between D and S.  
Delay between applying the digital control input and the output  
switching on. See Figure 15.  
RFLAT (ON)  
Flatness is defined as the difference between the maximum and  
minimum value of on resistance as measured over the specified  
analog signal range.  
tOFF  
Delay between applying the digital control input and the output  
switching off.  
IS (OFF)  
Off Isolation  
Source leakage current with the switch off.  
A measure of unwanted signal coupling through an off switch.  
ID (OFF)  
Charge Injection  
Drain leakage current with the switch off.  
A measure of the glitch impulse transferred from the digital  
input to the analog output during switching.  
ID, IS (ON)  
Channel leakage current with the switch on.  
Bandwidth  
The frequency at which the output is attenuated by −3 dB.  
VD (VS)  
Analog voltage on Terminal D and Terminal S.  
On Response  
The frequency response of the on switch.  
CS (OFF)  
Off switch source capacitance.  
On Loss  
The voltage drop across the on switch, seen in Figure 11 as  
the number of decibels the signal is away from 0 dB at very low  
frequencies.  
CD (OFF)  
Off switch drain capacitance.  
CD, CS (ON)  
On switch capacitance.  
Rev. 0 | Page 9 of 12  
 
ADG701L/ADG702L  
APPLICATIONS INFORMATION  
The ADG701L/ADG702L belong to the Analog Devices new  
family of CMOS switches. This series of general-purpose switches  
have improved switching times, lower on resistance, higher  
bandwidth, low power consumption, and low leakage currents.  
The signal transfer characteristic is dependent on the switch  
channel capacitance, CDS. This capacitance creates a frequency  
zero in the numerator of the transfer function, A(s). Because  
the switch on resistance is small, this zero usually occurs at high  
frequencies. The bandwidth is a function of the switch output  
capacitance combined with CDS and the load capacitance. The  
frequency pole corresponding to these capacitances appears in  
the denominator of A(s).  
SUPPLY VOLTAGES  
Functionality of the ADG701L/ADG702L extends from 1.8 V to  
5.5 V single supply, making the parts ideal for battery-powered  
instruments where power, efficiency, and performance are  
important design parameters.  
The dominant effect of the output capacitance, CD, causes the  
pole breakpoint frequency to occur first. In order to maximize  
bandwidth, a switch must have a low input and output capaci-  
tance and low on resistance. The on response versus frequency  
for the ADG701L/ADG702L is shown in Figure 11.  
It is important to note that the supply voltage affects the input  
signal range, the on resistance, and the switching times of the  
part. The effects of the power supplies can be clearly seen in the  
Typical Performance Characteristics and the Specifications  
sections.  
OFF ISOLATION  
Off isolation is a measure of the input signal coupled through  
an off switch to the switch output. The capacitance, CDS, couples  
the input signal to the output load when the switch is off (see  
Figure 20).  
For VDD = 1.8 V operation, RON is typically 40 Ω over the  
temperature range.  
BANDWIDTH  
C
Figure 19 illustrates the parasitic components that affect the ac  
performance of CMOS switches (a box surrounds the switch).  
Additional external capacitances further degrade some perform-  
ance. These capacitances affect feedthrough, crosstalk, and  
system bandwidth.  
DS  
S
D
V
OUT  
C
R
LOAD  
C
LOAD  
D
V
IN  
Figure 20. Off Isolation Is Affected by External Load Resistance and  
Capacitance  
C
DS  
S
D
V
OUT  
The larger the value of CDS, the larger the values of feedthrough  
produced. Figure 10 illustrates the drop in off isolation as a  
function of frequency. From dc to roughly 1 MHz, the switch  
shows better than −75 dB isolation. Up to frequencies of  
10 MHz, the off isolation remains better than −55 dB. As the  
frequency increases, more and more of the input signal is  
coupled through to the output. Off isolation can be maximized  
by choosing a switch with the smallest CDS possible. The values  
of load resistance and capacitance also affect off isolation, as  
they contribute to the coefficients of the poles and zeros in the  
transfer function of the switch when open.  
R
ON  
C
R
LOAD  
C
LOAD  
D
V
IN  
Figure 19. Switch Represented by Equivalent Parasitic Components  
The transfer function that describes the equivalent diagram of  
the switch (see Figure 19) is of the form A(s), as shown in the  
following equation:  
s(RON  
s(RONCT RT ) +1  
CDS ) +1  
A(s) = RT  
where CT = CLOAD + CD + CDS.  
s(RLOADCDS ) +1  
s(RLOAD )(CT ) +1  
A(s) = RT  
Rev. 0 | Page 10 of 12  
 
 
 
ADG701L/ADG702L  
OUTLINE DIMENSIONS  
2.90 BSC  
3.00  
BSC  
6
1
5
2
4
3
2.80 BSC  
1.60 BSC  
8
1
5
4
4.90  
BSC  
3.00  
BSC  
PIN 1  
INDICATOR  
0.95 BSC  
PIN 1  
1.90  
BSC  
1.30  
1.15  
0.90  
0.65 BSC  
1.10 MAX  
0.15  
0.00  
1.45 MAX  
0.22  
0.08  
0.80  
0.60  
0.40  
8°  
0°  
10°  
4°  
0°  
0.60  
0.45  
0.30  
0.38  
0.22  
0.23  
0.08  
0.50  
0.30  
0.15 MAX  
SEATING  
PLANE  
COPLANARITY  
0.10  
SEATING  
PLANE  
COMPLIANT TO JEDEC STANDARDS MO-178-AB  
COMPLIANT TO JEDEC STANDARDS MO-187-AA  
Figure 22. 6-Lead Small Outline Transistor Package [SOT-23]  
Figure 21. 8-Lead Mini Small Outline Package [MSOP]  
(RM-8)  
(RT-6)  
Dimensions shown in millimeters  
Dimensions shown in millimeters  
2.90 BSC  
5
1
4
3
2.80 BSC  
1.60 BSC  
2
PIN 1  
0.95 BSC  
1.90  
BSC  
1.30  
1.15  
0.90  
1.45 MAX  
0.22  
0.08  
10°  
5°  
0°  
0.15 MAX  
0.50  
0.30  
0.60  
0.45  
0.30  
SEATING  
PLANE  
COMPLIANT TO JEDEC STANDARDS MO-178-AA  
Figure 23. 5-Lead Small Outline Transistor Package [SOT-23]  
(RJ-5)  
Dimensions shown in millimeters  
Rev. 0 | Page 11 of 12  
 
ADG701L/ADG702L  
ORDERING GUIDE  
Model  
Temperature Range  
Package Description  
Package Option  
RJ-5  
RJ-5  
RJ-5  
RJ-5  
Branding1  
S15  
S15  
S15  
S10  
S10  
S10  
S15  
S15  
S15  
S10  
S10  
S10  
S15  
S15  
S10  
S10  
S16  
S16  
S11  
S11  
S11  
S16  
S16  
S16  
S11  
S11  
S11  
S16  
S16  
S11  
S11  
ADG701LBRJ-500RL7  
ADG701LBRJ-REEL  
ADG701LBRJ-REEL7  
ADG701LBRJZ-500RL72  
ADG701LBRJZ-REEL2  
ADG701LBRJZ-REEL72  
ADG701LBRM  
ADG701LBRM-REEL  
ADG701LBRM-REEL7  
ADG701LBRMZ2  
ADG701LBRMZ-REEL2  
ADG701LBRMZ-REEL72  
ADG701LBRT-REEL  
ADG701LBRT-REEL7  
ADG701LBRTZ-REEL2  
ADG701LBRTZ-REEL72  
ADG702LBRJ-REEL  
ADG702LBRJ-REEL7  
ADG702LBRJZ-500RL72  
ADG702LBRJZ-REEL2  
ADG702LBRJZ-REEL72  
ADG702LBRM  
ADG702LBRM-REEL  
ADG702LBRM-REEL7  
ADG702LBRMZ2  
ADG702LBRMZ-REEL2  
ADG702LBRMZ-REEL72  
ADG702LBRT-REEL  
ADG702LBRT-REEL7  
ADG702LBRTZ-REEL2  
ADG702LBRTZ-REEL72  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
40°C to +85°C  
5-Lead Small Outline Transistor Package [SOT-23]  
5-Lead Small Outline Transistor Package [SOT-23]  
5-Lead Small Outline Transistor Package [SOT-23]  
5-Lead Small Outline Transistor Package [SOT-23]  
5-Lead Small Outline Transistor Package [SOT-23]  
5-Lead Small Outline Transistor Package [SOT-23]  
8-Lead Mini Small Outline Package [MSOP]  
8-Lead Mini Small Outline Package [MSOP]  
8-Lead Mini Small Outline Package [MSOP]  
8-Lead Mini Small Outline Package [MSOP]  
8-Lead Mini Small Outline Package [MSOP]  
8-Lead Mini Small Outline Package [MSOP]  
6-Lead Small Outline Transistor Package [SOT-23]  
6-Lead Small Outline Transistor Package [SOT-23]  
6-Lead Small Outline Transistor Package [SOT-23]  
6-Lead Small Outline Transistor Package [SOT-23]  
5-Lead Small Outline Transistor Package [SOT-23]  
5-Lead Small Outline Transistor Package [SOT-23]  
5-Lead Small Outline Transistor Package [SOT-23]  
5-Lead Small Outline Transistor Package [SOT-23]  
5-Lead Small Outline Transistor Package [SOT-23]  
8-Lead Mini Small Outline Package [MSOP]  
8-Lead Mini Small Outline Package [MSOP]  
8-Lead Mini Small Outline Package [MSOP]  
8-Lead Mini Small Outline Package [MSOP]  
8-Lead Mini Small Outline Package [MSOP]  
8-Lead Mini Small Outline Package [MSOP]  
6-Lead Small Outline Transistor Package [SOT-23]  
6-Lead Small Outline Transistor Package [SOT-23]  
6-Lead Small Outline Transistor Package [SOT-23]  
6-Lead Small Outline Transistor Package [SOT-23]  
RJ-5  
RJ-5  
RM-8  
RM-8  
RM-8  
RM-8  
RM-8  
RM-8  
RT-6  
RT-6  
RT-6  
RT-6  
RJ-5  
RJ-5  
RJ-5  
RJ-5  
RJ-5  
RM-8  
RM-8  
RM-8  
RM-8  
RM-8  
RM-8  
RT-6  
RT-6  
RT-6  
RT-6  
1 Due to package size limitations, these three characters represent the part number.  
2 Z = Pb-free part.  
©2006 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D05486-0-11/06(0)  
Rev. 0 | Page 12 of 12  
 
 
 
 
 
 
 

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