ADG711BRU-REEL7 [ADI]

CMOS Low Voltage, 4 Ω Quad, SPST Switches; CMOS低压, 4 I ©四路, SPST开关
ADG711BRU-REEL7
型号: ADG711BRU-REEL7
厂家: ADI    ADI
描述:

CMOS Low Voltage, 4 Ω Quad, SPST Switches
CMOS低压, 4 I ©四路, SPST开关

复用器 开关 复用器或开关 信号电路 光电二极管 输出元件
文件: 总16页 (文件大小:259K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CMOS Low Voltage, 4 Ω Quad,  
SPST Switches  
ADG711/ADG712/ADG713  
FUNCTIONAL BLOCK DIAGRAM  
FEATURES  
S1  
S1  
S1  
1.8 V to 5.5 V single supply  
Low on resistance (2.5 Ω Typ)  
Low on resistance flatness  
−3 dB bandwidth > 200 MHz  
Rail-to-rail operation  
16-lead TSSOP and SOIC packages  
Fast switching times: tON =16 ns, tOFF =10 ns  
Typical power consumption (< 0.01 μW)  
TTL/CMOS compatible  
IN1  
IN2  
IN1  
IN2  
IN1  
IN2  
D1  
S2  
D1  
S2  
D1  
S2  
D2  
S3  
D2  
S3  
D2  
S3  
ADG711  
ADG712  
ADG713  
IN3  
IN4  
IN3  
IN4  
IN3  
IN4  
D3  
S4  
D3  
S4  
D3  
S4  
D4  
D4  
D4  
Qualified for automotive applications  
SWITCHES SHOWN FOR A LOGIC “1” INPUT  
APPLICATIONS  
Figure 1.  
USB 1.1 signal switching circuits  
Cell phones  
PDAs  
Battery-powered systems  
Communication systems  
Sample hold systems  
Audio signal routing  
Video switching  
Mechanical reed relay replacement  
GENERAL DESCRIPTION  
The ADG711, ADG712, and ADG713 are monolithic CMOS  
devices containing four independently selectable switches. These  
switches are designed on an advanced submicron process that  
provides low power dissipation yet gives high switching speed, low  
on resistance, low leakage currents, and high bandwidth.  
The ADG711/ADG712/ADG713 are available in 16-lead TSSOP  
and 16-lead SOIC packages.  
PRODUCT HIGHLIGHTS  
1. 1.8 V to 5.5 V Single-Supply Operation.  
The ADG711, ADG712, and ADG713 offer high performance  
and are fully specified and guaranteed with 3 V and 5 V  
supply rails.  
They are designed to operate from a single 1.8 V to 5.5 V supply,  
making them ideal for use in battery-powered instruments and  
with the new generation of DACs and ADCs from Analog Devices,  
Inc. Fast switching times and high bandwidth make the parts  
suitable for switching USB 1.1 data signals and video signals.  
2. Very Low RON (4.5 Ω maximum at 5 V, 8 Ω maximum at 3 V).  
At supply voltage of 1.8 V, RON is typically 35 Ω over the  
temperature range.  
The ADG711, ADG712, and ADG713 contain four independent  
single-pole/single-throw (SPST) switches. The ADG711 and  
ADG712 differ only in that the digital control logic is inverted. The  
ADG711 switches are turned on with a logic low on the appropriate  
control input, while a logic high is required to turn on the switches  
of the ADG712. The ADG713 contains two switches whose digital  
control logic is similar to the ADG711, while the logic is inverted  
on the other two switches.  
3. Low On Resistance Flatness.  
4. −3 dB Bandwidth >200 MHz.  
5. Low Power Dissipation. CMOS construction ensures low  
power dissipation.  
6. Fast tON/tOFF  
.
7. Break-Before-Make Switching.  
This prevents channel shorting when the switches are  
configured as a multiplexer (ADG713 only).  
Each switch conducts equally well in both directions when On. The  
ADG713 exhibits break-before-make switching action.  
8. 16-Lead TSSOP and 16-Lead SOIC Packages.  
Rev. B  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
www.analog.com  
Fax: 781.461.3113 ©2004–2011 Analog Devices, Inc. All rights reserved.  
 
ADG711/ADG712/ADG713  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Pin Configuration and Function Descriptions..............................6  
Typical Performance Characteristics ..............................................7  
Test Circuits........................................................................................9  
Terminology.................................................................................... 11  
Applications Information.............................................................. 12  
Outline Dimensions....................................................................... 13  
Ordering Guide .......................................................................... 14  
Automotive Products................................................................. 14  
Applications....................................................................................... 1  
Functional Block Diagram .............................................................. 1  
General Description......................................................................... 1  
Product Highlights ........................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Absolute Maximum Ratings............................................................ 5  
ESD Caution.................................................................................. 5  
REVISION HISTORY  
6/11—Rev. A to Rev. B  
Updated Format..................................................................Universal  
Changes to Features Section............................................................ 1  
Changes to Absolute Maximum Ratings Table............................. 5  
Changes to Ordering Guide .......................................................... 14  
Added Automotive Products Section .......................................... 14  
3/04—Rev. 0 to Rev. A  
Added Applications.......................................................................... 1  
Changes to Ordering Guide ............................................................ 4  
Updated Outline Dimensions....................................................... 10  
Rev. B | Page 2 of 16  
 
ADG711/ADG712/ADG713  
SPECIFICATIONS  
VDD = +5 V 10%, GND = 0 V. All specifications −40°C to +85°C, unless otherwise noted.  
Table 1.  
Parameter  
+25°C  
−40°C to +85°C  
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
On Resistance (RON)  
0 V to VDD  
V
2.5  
4
Ω typ  
Ω max  
Ω typ  
Ω max  
Ω typ  
Ω max  
VS = 0 V to VDD, IS = −10 mA;  
See Figure 11  
VS = 0 V to VDD, IS = −10 mA  
4.5  
0.05  
0.3  
On Resistance Match Between  
Channels (ΔRON)  
On Resistance Flatness (RFLAT(ON)  
)
0.5  
VS = 0 V to VDD, IS = −10 mA  
1.0  
LEAKAGE CURRENTS  
VDD = +5.5 V  
Source Off Leakage IS (Off)  
0.01  
0.1  
0.01  
0.1  
0.01  
0.1  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
VS = 4.5 V/1 V, VD = 1 V/4.5 V  
See Figure 12  
VS = 4.5 V/1 V, VD = 1 V/4.5 V  
See Figure 12  
VS = VD = 1 V, or 4.5 V  
See Figure 13  
0.2  
0.2  
0.2  
Drain Off Leakage ID (Off)  
Channel On Leakage ID, IS (On)  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current  
2.4  
0.8  
V min  
V max  
IINL or IINH  
0.005  
μA typ  
VIN = VINL or VINH  
0.1  
μA max  
DYNAMIC CHARACTERISTICS1  
tON  
11  
6
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns min  
pC typ  
dB typ  
dB typ  
dB typ  
MHz typ  
pF typ  
pF typ  
pF typ  
RL = 300 Ω, CL = 35 pF  
VS = 3 V; see Figure 14  
RL = 300 Ω, CL = 35 pF  
VS = 3 V; see Figure 14  
16  
10  
1
tOFF  
Break-Before-Make Time Delay, tD  
(ADG713 Only)  
Charge Injection  
6
RL = 300 Ω, CL = 35 pF  
VS1 = VS2 = 3 V; see Figure 15  
VS = 2 V; RS = 0 Ω, CL = 1 nF; see Figure 16  
RL = 50 Ω, CL = 5 pF, f = 10 MHz  
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 17  
RL = 50 Ω, CL = 5 pF, f = 10 MHz; see Figure 18  
RL = 50 Ω, CL = 5 pF; see Figure 19  
3
Off Isolation  
−58  
−78  
−90  
200  
10  
Channel-to-Channel Crosstalk  
Bandwidth −3 dB  
CS  
CD  
10  
22  
CD, CS (On)  
POWER REQUIREMENTS  
IDD  
VDD = +5.5 V  
Digital inputs = 0 V or 5 V  
0.001  
μA typ  
μ max  
1.0  
1 Guaranteed by design, not subject to production test.  
Rev. B | Page 3 of 16  
 
ADG711/ADG712/ADG713  
VDD = +3 V 10%, GND = 0 V. All specifications −40°C to +85°C, unless otherwise noted.  
Table 2.  
Parameter  
+25°C  
−40°C to +85°C  
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
On Resistance (RON)  
0 V to VDD  
5.5  
8
V
5
Ω typ  
Ω max  
Ω typ  
Ω max  
Ω typ  
VS = 0 V to VDD, IS = −10 mA;  
See Figure 11  
VS = 0 V to VDD, IS = −10 mA  
On Resistance Match Between  
Channels (ΔRON)  
On Resistance Flatness (RFLAT(ON)  
0.1  
0.3  
2.5  
)
VS = 0 V to VDD, IS = −10 mA  
VDD = +3.3 V  
LEAKAGE CURRENTS  
Source Off Leakage IS (Off)  
0.01  
0.1  
0.01  
0.1  
0.01  
0.1  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
VS = 3 V/1 V, VD = 1 V/3 V  
See Figure 12  
VS = 3 V/1 V, VD = 1 V/ 3 V  
See Figure 12  
VS = VD = 1 V, or 3 V  
See Figure 13  
0.2  
0.2  
0.2  
Drain Off Leakage ID (Off)  
Channel On Leakage ID, IS (On)  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current  
2.0  
0.4  
V min  
V max  
IINL or IINH  
0.005  
μA typ  
VIN = VINL or VINH  
0.1  
μA max  
DYNAMIC CHARACTERISTICS1  
tON  
13  
7
ns typ  
ns max  
ns typ  
ns max  
ns typ  
ns min  
pC typ  
dB typ  
dB typ  
RL = 300 Ω, CL = 35 pF  
VS = 2 V; see Figure 14  
RL = 300 Ω, CL = 35 pF  
VS = 2 V; see Figure 14  
20  
12  
1
tOFF  
Break-Before-Make Time Delay, tD  
(ADG713 Only)  
Charge Injection  
7
RL = 300 Ω, CL = 35 pF  
VS1 = VS2 = 2 V; see Figure 15  
VS = 1.5 V; RS = 0 Ω, CL = 1 nF; see Figure 16  
RL = 50 Ω, CL = 5 pF, f = 10 MHz  
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 17  
3
−58  
−78  
Off Isolation  
Channel-to-Channel Crosstalk  
Bandwidth −3 dB  
CS  
CD  
−90  
200  
10  
10  
22  
dB typ  
MHz typ  
pF typ  
pF typ  
pF typ  
RL = 50 Ω, CL = 5 pF, f = 10 MHz; see Figure 18  
RL = 50 Ω, CL = 5 pF; see Figure 19  
CD, CS (On)  
POWER REQUIREMENTS  
IDD  
VDD = +3.3 V  
Digital inputs = 0 V or 3 V  
0.001  
μA typ  
μ max  
1.0  
1 Guaranteed by design, not subject to production test.  
Rev. B | Page 4 of 16  
ADG711/ADG712/ADG713  
ABSOLUTE MAXIMUM RATINGS  
TA = +25°C, unless otherwise noted.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Table 3.  
Parameter  
Rating  
VDD to GND  
Analog, Digital Inputs1  
−0.3 V to +6 V  
−0.3 V to VDD +0.3 V or  
30 mA, whichever occurs  
first  
Only one absolute maximum rating may be applied at any  
one time.  
Continuous Current, S or D  
Peak Current, S or D  
30 mA  
100 mA (Pulsed at 1 ms,  
10% duty cycle maximum)  
−40°C to +85°C  
−65°C to +150°C  
150°C  
ESD CAUTION  
Operating Temperature Range  
Storage Temperature Range  
Junction Temperature  
TSSOP Package, Power Dissipation 430 mW  
θJA Thermal Impedance  
θJC Thermal Impedance  
SOIC Package, Power Dissipation  
θJA Thermal Impedance  
θJC Thermal Impedance  
Lead Temperature, Soldering  
Vapor Phase (60 sec)  
Infrared (15 sec)  
150°C/W  
27°C/W  
520 mW  
125°C/W  
42°C/W  
215°C  
220°C  
Soldering(Pb-Free)  
Reflow, Peak Temperature  
Time at Peak Temperature  
ESD  
260(+0/−5)°C  
20 sec to 40 sec  
2 kV  
1 Overvoltages at IN, S or D will be clamped by internal diodes. Currents  
should be limited to the maximum ratings given.  
Rev. B | Page 5 of 16  
 
 
ADG711/ADG712/ADG713  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
IN1  
1
2
3
4
5
6
7
8
16 IN2  
15 D2  
14 S2  
D1  
ADG711/  
ADG712/  
ADG713  
S1  
NC  
GND  
S4  
13  
V
DD  
12 NC  
11 S3  
10 D3  
TOP VIEW  
(Not to Scale)  
D4  
IN4  
9 IN3  
NOTES  
1. NC = NO CONNECT. DO NOT  
CONNECT TO THIS PIN.  
Figure 2. Pin Configuration  
Table 4.  
Pin Number  
Mnemonic  
IN1  
D1  
Description  
1
2
Digital Control Input. Its logic state controls the status of the Switch S1-D1.  
Drain Pin. Can be used as input or output.  
3
S1  
Source Pin. Can be used as input or output.  
4
NC  
Not internally connected.  
5
6
GND  
S4  
The most negative power supply pin.  
Source Pin. Can be used as input or output.  
7
D4  
Drain Pin. Can be used as input or output.  
8
9
IN4  
IN3  
D3  
S3  
NC  
VDD  
S2  
D2  
Digital Control Input. Its logic state controls the status of the Switch S4-D4.  
Digital Control Input. Its logic state controls the status of the Switch S3-D3.  
Drain Pin. Can be used as input or output.  
Source Pin. Can be used as input or output.  
Not internally connected.  
The most positive power supply pin.  
Source Pin. Can be used as input or output.  
Drain Pin. Can be used as input or output.  
Digital Control Input. Its logic state controls the status of the Switch S3-D3.  
10  
11  
12  
13  
14  
15  
16  
IN2  
Table 5. Truth Table (ADG711/ADG712)  
ADG711 In  
ADG712 In  
Switch Condition  
0
1
1
0
On  
Off  
Table 6. Truth Table (ADG713)  
Logic  
Switch 1, 4  
Switch 2, 3  
0
1
Off  
On  
On  
Off  
Rev. B | Page 6 of 16  
 
ADG711/ADG712/ADG713  
TYPICAL PERFORMANCE CHARACTERISTICS  
10m  
1m  
6.0  
V
= 5V  
DD  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
T
= 25°C  
A
V
= 2.7V  
DD  
100µ  
10µ  
1µ  
4 SW  
V
= 4.5V  
DD  
V
= 3.0V  
DD  
8 SW  
V
= 5.0V  
100n  
10n  
1n  
DD  
100  
1k  
10k  
100k  
1M  
10M  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
FREQUENCY (Hz)  
DRAIN OR SOURCE VOLTAGE (V)  
Figure 3. On Resistance as a Function of VD (VS)  
Figure 6. Supply Current vs. Input Switching Frequency  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
–30  
–40  
V
= 5V, 3V  
DD  
V
= 3V  
DD  
T
= +85°C  
A
–50  
T
= +25°C  
A
–60  
–70  
–80  
–90  
T
= –40°C  
A
–100  
–110  
–120  
–130  
10k  
100k  
1M  
FREQUENCY (Hz)  
10M  
100M  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
DRAIN OR SOURCE VOLTAGE (V)  
Figure 4. On Resistance as a Function of VD (VS) for Different Temperatures  
VDD = 3 V  
Figure 7. Off Isolation vs. Frequency  
6.0  
–30  
–40  
V
= 5V, 3V  
DD  
V
= 5V  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
DD  
–50  
–60  
T
= +85°C  
A
–70  
T
= +25°C  
A
–80  
–90  
–100  
–110  
–120  
–130  
T
= –40°C  
A
10k  
100k  
1M  
FREQUENCY (Hz)  
10M  
100M  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
DRAIN OR SOURCE VOLTAGE (V)  
Figure 8. Crosstalk vs. Frequency  
Figure 5. On Resistance as a Function of VD (VS) for Different Temperatures  
DD = 5 V  
V
Rev. B | Page 7 of 16  
 
ADG711/ADG712/ADG713  
0
25  
20  
15  
10  
5
T
= 25°C  
A
V
= 5V  
DD  
–2  
–4  
V
= 5V  
DD  
V
= 3V  
DD  
0
–5  
–10  
–6  
10k  
100k  
1M  
10M  
100M  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
FREQUENCY (Hz)  
SOURCE VOLTAGE (V)  
Figure 10. Charge Injection vs. Source Voltage  
Figure 9. On Response vs. Frequency  
Rev. B | Page 8 of 16  
ADG711/ADG712/ADG713  
TEST CIRCUITS  
I
DS  
I
(ON)  
A
D
S
D
V1  
V
V
D
S
S
D
Figure 13. On Leakage  
V
S
R
= V1/I  
ON  
DS  
Figure 11. On Resistance  
I
(OFF)  
I
(OFF)  
A
S
D
S
D
A
V
V
D
S
Figure 12. Off Leakage  
V
DD  
0.1µF  
V
V
50%  
50%  
50%  
ADG711  
ADG712  
IN  
IN  
V
DD  
50%  
90%  
S
D
V
OUT  
R
300  
C
L
35pF  
IN  
V
L
V
S
S
90%  
V
OUT  
GND  
tON  
tOFF  
Figure 14. Switching Times  
V
DD  
V
50%  
50%  
0.1µF  
IN  
0V  
0V  
V
DD  
90%  
90%  
V
OUT1  
S1  
S2  
D1  
D2  
V
V
V
OUT1  
S1  
S2  
R
C
L1  
300  
L1  
35pF  
V
OUT2  
R
300Ω  
C
IN1, IN2  
L2  
L2  
35pF  
90%  
90%  
V
OUT2  
ADG713  
GND  
0V  
tD  
tD  
Figure 15. Break-Before-Make Time Delay, tD  
V
V
SW ON  
SW OFF  
DD  
V
IN  
DD  
R
S
S
D
V
OUT  
C
15nF  
IN  
L
V
S
V
OUT  
V  
OUT  
GND  
Q
= C × V  
OUT  
INJ  
L
Figure 16. Charge Injection  
 
 
 
 
 
 
 
ADG711/ADG712/ADG713  
V
V
V
DD  
DD  
DD  
0.1µF  
0.1µF  
S
V
DD  
S
D
D
V
V
OUT  
OUT  
R
R
L
L
50  
50Ω  
IN  
IN  
V
V
IN  
IN  
V
V
S
S
GND  
GND  
Figure 17. Off Isolation  
Figure 19. Bandwidth  
V
DD  
0.1µF  
S
V
DD  
50  
D
D
V
IN1  
V
S
V
IN2  
S
V
OUT  
NC  
R
L
50Ω  
GND  
CHANNEL-TO-CHANNEL CROSSTALK = 20 × log |V /V  
S
|
OUT  
Figure 18. Channel-to-Channel Crosstalk  
Rev. B | Page 10 of 16  
 
 
ADG711/ADG712/ADG713  
TERMINOLOGY  
tON  
RON  
Delay between applying the digital control input and the output  
switching on.  
Ohmic resistance between D and S.  
ΔRON  
tOFF  
On resistance match between any two channels, ie., RONmax −  
Delay between applying the digital control input and the output  
switching off.  
RONmin.  
RFLAT(ON)  
tD  
Flatness is defined as the difference between the maximum and  
minimum value of on resistance as measured over the specified  
analog signal range.  
Off time or on time measured between the 90% points of both  
switches, when switching from one address state to another  
(ADG713 only).  
IS (OFF)  
Crosstalk  
Source leakage current with the switch off.  
A measure of unwanted signal that is coupled through from one  
channel to another as a result of parasitic capacitance.  
ID (OFF)  
Drain leakage current with the switch off.  
Off Isolation  
ID, IS (ON)  
A measure of unwanted signal coupling through an off switch.  
Channel leakage current with the switch on.  
Charge Injection  
A measure of the glitch impulse transferred from the digital  
input to the analog output during switching.  
VD (VS)  
Analog voltage on Terminals D, S.  
CS (OFF)  
Bandwidth  
Off switch source capacitance.  
The frequency at which the output is attenuated by 3 dB.  
CD (OFF)  
On Response  
Off switch drain capacitance.  
The frequency response of the on switch.  
CD, CS (ON)  
On switch capacitance.  
 
ADG711/ADG712/ADG713  
APPLICATIONS INFORMATION  
C1  
Figure 20 illustrates a photodetector circuit with programmable  
gain. An AD820 is used as the output operational amplifier.  
With the resistor values shown in the circuit, and using different  
combinations of the switches, gain in the range of 2 to 16 can be  
achieved.  
R1  
33k  
+5V  
AD820  
D1  
+2.5V  
V
OUT  
R2  
510kΩ  
+5V  
R4  
R5  
240k240kΩ  
S1  
D1  
D2  
D3  
D4  
(LSB) IN1  
IN2  
R6  
R7  
R3  
510kΩ  
120k120kΩ  
S2  
S3  
S4  
R8  
120kΩ  
IN3  
R9  
120kΩ  
+2.5V  
(MSB) IN4  
R10  
120kΩ  
GND  
Figure 20. Photodetector Circuit with Programmable Gain  
Rev. B | Page 12 of 16  
 
 
ADG711/ADG712/ADG713  
OUTLINE DIMENSIONS  
10.00 (0.3937)  
9.80 (0.3858)  
9
8
16  
1
6.20 (0.2441)  
5.80 (0.2283)  
4.00 (0.1575)  
3.80 (0.1496)  
1.27 (0.0500)  
BSC  
0.50 (0.0197)  
0.25 (0.0098)  
45°  
1.75 (0.0689)  
1.35 (0.0531)  
0.25 (0.0098)  
0.10 (0.0039)  
8°  
0°  
COPLANARITY  
0.10  
SEATING  
PLANE  
1.27 (0.0500)  
0.40 (0.0157)  
0.51 (0.0201)  
0.31 (0.0122)  
0.25 (0.0098)  
0.17 (0.0067)  
COMPLIANT TO JEDEC STANDARDS MS-012-AC  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
Figure 21. 16-Lead Standard Small Outline Package [SOIC]  
Narrow Body  
(R-16)  
Dimensions shown in millimeters and (inches)  
5.10  
5.00  
4.90  
16  
9
8
4.50  
4.40  
4.30  
6.40  
BSC  
1
PIN 1  
1.20  
MAX  
0.15  
0.05  
0.20  
0.09  
0.75  
0.60  
0.45  
8°  
0°  
0.30  
0.19  
0.65  
BSC  
SEATING  
PLANE  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-153-AB  
Figure 22. 16-Lead Thin Shrink Small Outline Package [TSSOP]  
(RU-16)  
Dimensions shown in millimeters  
Rev. B | Page 13 of 16  
 
ADG711/ADG712/ADG713  
ORDERING GUIDE  
Model1, 2  
Temperature range  
Package Description  
Package Option  
R-16  
ADG711BR  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Standard Small Outline(SOIC)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
Thin Shrink Small Outline(TSSOP)  
ADG711BR-REEL  
ADG711BR-REEL7  
ADG711BRZ  
ADG711BRZ-REEL  
ADG711BRZ-REEL7  
ADG711BRU  
ADG711BRU-REEL  
ADG711BRU-REEL7  
ADG711BRUZ  
ADG711BRUZ-REEL  
ADG711BRUZ-REEL7  
ADG711WBRUZ-REEL  
ADG712BR  
ADG712BR-REEL  
ADG712BR-REEL7  
ADG712BRZ  
ADG712BRZ-REEL  
ADG712BRZ-REEL7  
ADG712BRU  
ADG712BRU-REEL  
ADG712BRU-REEL7  
ADG712BRUZ  
ADG712BRUZ-REEL  
ADG712BRUZ-REEL7  
ADG713BR  
R-16  
R-16  
R-16  
R-16  
R-16  
RU-16  
RU-16  
RU-16  
RU-16  
RU-16  
RU-16  
RU-16  
R-16  
R-16  
R-16  
R-16  
R-16  
R-16  
RU-16  
RU-16  
RU-16  
RU-16  
RU-16  
RU-16  
R-16  
R-16  
R-16  
R-16  
RU-16  
RU-16  
RU-16  
RU-16  
RU-16  
RU-16  
ADG713BRZ  
ADG713BRZ-REEL  
ADG713BRZ-REEL7  
ADG713BRU  
ADG713BRU-REEL  
ADG713BRU-REEL7  
ADG713BRUZ  
ADG713BRUZ-REEL  
ADG713BRUZ-REEL7  
1 Z = RoHS Compliant Part.  
2 W = Qualified for Automotive Applications.  
AUTOMOTIVE PRODUCTS  
The AD711W models are available with controlled manufacturing to support the quality and reliability requirements of automotive  
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers  
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in  
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to  
obtain the specific Automotive Reliability reports for these models.  
Rev. B | Page 14 of 16  
 
 
ADG711/ADG712/ADG713  
NOTES  
Rev. B | Page 15 of 16  
ADG711/ADG712/ADG713  
NOTES  
©20042011 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D00042-0-6/11(B)  
Rev. B | Page 16 of 16  

相关型号:

ADG711BRUZ

CMOS Low Voltage, 4 Ω Quad, SPST Switches
ADI

ADG711BRUZ-REEL

CMOS Low Voltage, 4 Ω Quad, SPST Switches
ADI

ADG711BRUZ-REEL7

CMOS Low Voltage, 4 Ω Quad, SPST Switches
ADI

ADG711BRZ

CMOS Low Voltage, 4 Ω Quad, SPST Switches
ADI

ADG711BRZ-REEL

CMOS Low Voltage, 4 Ω Quad, SPST Switches
ADI

ADG711BRZ-REEL7

CMOS Low Voltage, 4 Ω Quad, SPST Switches
ADI

ADG711WBRUZ-REEL

CMOS Low Voltage, 4 Ω Quad, SPST Switches
ADI

ADG711_15

CMOS Low Voltage
ADI

ADG712

CMOS Low Voltage 4 ohm Quad SPST Switches
ADI

ADG712BR

CMOS Low Voltage 4 ohm Quad SPST Switches
ADI

ADG712BR-REEL

CMOS Low Voltage, 4 Ω Quad, SPST Switches
ADI

ADG712BR-REEL7

CMOS Low Voltage, 4 Ω Quad, SPST Switches
ADI