ADG741 [ADI]

CMOS Low Voltage 2ohm SPST Switches in SC70 Packages; CMOS低压2ohm SPST开关采用SC70封装
ADG741
型号: ADG741
厂家: ADI    ADI
描述:

CMOS Low Voltage 2ohm SPST Switches in SC70 Packages
CMOS低压2ohm SPST开关采用SC70封装

开关
文件: 总8页 (文件大小:119K)
中文:  中文翻译
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CMOS Low Voltage  
2 SPST Switches in SC70 Packages  
a
ADG741/ADG742  
FEATURES  
FUNCTIONAL BLOCK DIAGRAMS  
1.8 V to 5.5 V Single Supply  
2 (Typ) On Resistance  
Low On-Resistance Flatness  
–3 dB Bandwidth >200 MHz  
Rail-to-Rail Operation  
6-Lead SC70  
ADG741  
S
D
IN  
Fast Switching Times  
tON 18 ns  
tOFF 12 ns  
Typical Power Consumption (<0.01 W)  
TTL/CMOS Compatible  
ADG742  
S
D
APPLICATIONS  
Battery Powered Systems  
Communication Systems  
Sample Hold Systems  
Audio Signal Routing  
Video Switching  
IN  
SWITCHES SHOWN FOR  
A LOGIC "1" INPUT  
Mechanical Reed Relay Replacement  
GENERAL DESCRIPTION  
PRODUCT HIGHLIGHTS  
The ADG741/ADG742 are monolithic CMOS SPST switches.  
These switches are designed on an advanced submicron process  
that provides low power dissipation yet high switching speed,  
low on resistance, low leakage currents and –3 dB bandwidths of  
greater than 200 MHz can be achieved.  
1. 1.8 V to 5.5 V Single Supply Operation. The ADG741/  
ADG742 offer high performance, including low on resistance  
and fast switching times and is fully specified and guaranteed  
with 3 V and 5 V supply rails.  
2. Very Low RON (3 max at 5 V, 5 max at 3 V). At 1.8 V  
operation, RON is typically 40 over the temperature range.  
The ADG741/ADG742 can operate from a single 1.8 V to 5.5 V  
supply, making it ideal for use in battery-powered instruments  
and with Analog Devices’ new generation of DACs and ADCs.  
3. On-Resistance Flatness RFLAT(ON) (1 max).  
4. –3 dB Bandwidth >200 MHz.  
As can be seen from the Functional Block Diagrams, with a  
logic input of “1” the switch of the ADG741 is closed, while  
that of the ADG742 is open. Each switch conducts equally well  
in both directions when ON.  
5. Low Power Dissipation. CMOS construction ensures low  
power dissipation.  
6. Fast tON/tOFF.  
The ADG741/ADG742 are available in 6-lead SC70 package.  
7. Tiny 6-Lead SC70 package.  
REV. 0  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, nor for any infringements of patents or other rights of third parties  
which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
World Wide Web Site: http://www.analog.com  
© Analog Devices, Inc., 2000  
(VDD = 5 V ؎ 10%, GND = 0 V. All specifications –40؇C to +85؇C  
unless otherwise noted.)  
ADG741/ADG742–SPECIFICATIONS1  
B Version  
Parameter  
25؇C  
–40؇C to +85؇C  
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
0 V to VDD  
V
On Resistance (RON  
)
2
3
0.5  
typ  
max  
typ  
max  
VS = 0 V to VDD, IS = –10 mA;  
Test Circuit 1  
VS = 0 V to VDD, IS = –10 mA  
4
On-Resistance Flatness (RFLAT(ON)  
)
1.0  
LEAKAGE CURRENTS2  
Source OFF Leakage IS (OFF)  
VDD = 5.5 V  
VS = 4.5 V/1 V, VD = 1 V/4.5 V;  
Test Circuit 2  
VS = 4.5 V/1 V, VD = 1 V/4.5 V;  
Test Circuit 2  
VS = VD = 1 V, or 4.5 V;  
Test Circuit 3  
0.01  
0.25  
0.01  
0.25  
0.01  
0.25  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
0.35  
0.35  
0.35  
Drain OFF Leakage ID (OFF)  
Channel ON Leakage ID, IS (ON)  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current  
2.4  
0.8  
V min  
V max  
IINL or IINH  
0.005  
µA typ  
µA max  
VIN = VINL or VINH  
0.1  
DYNAMIC CHARACTERISTICS2  
tON  
12  
8
ns typ  
ns max  
ns typ  
ns max  
pC typ  
RL = 300 , CL = 35 pF  
VS = 3 V; Test Circuit 4  
RL = 300 , CL = 35 pF  
VS = 3 V; Test Circuit 4  
VS = 2 V, RS = 0 , CL = 1 nF;  
Test Circuit 5  
RL = 50 , CL = 5 pF, f = 10 MHz  
RL = 50 , CL = 5 pF, f = 1 MHz;  
Test Circuit 6  
18  
12  
tOFF  
Charge Injection  
Off Isolation  
5
–55  
–75  
dB typ  
dB typ  
Bandwidth –3 dB  
CS (OFF)  
200  
MHz typ  
RL = 50 , CL = 5 pF;  
Test Circuit 7  
17  
17  
38  
pF typ  
pF typ  
pF typ  
C
D (OFF)  
CD, CS (ON)  
POWER REQUIREMENTS  
VDD = 5.5 V  
Digital Inputs = 0 V or 5 V  
IDD  
0.001  
µA typ  
µA max  
1.0  
NOTES  
1Temperature ranges are as follows: B Versions: 40°C to +85°C.  
2Guaranteed by design, not subject to production test.  
Specifications subject to change without notice.  
–2–  
REV. 0  
ADG741/ADG742  
SPECIFICATIONS1(VDD = 3 V ؎ 10%, GND = 0 V. All specifications –40؇C to +85؇C unless otherwise noted.)  
B Version  
Parameter  
25؇C  
–40؇C to +85؇C  
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
0 V to VDD  
6
V
On Resistance (RON  
)
3.5  
5
1.5  
typ  
max  
typ  
VS = 0 V to VDD, IS = –10 mA;  
Test Circuit 1  
VS = 0 V to VDD, IS = –10 mA  
On-Resistance Flatness (RFLAT(ON)  
)
LEAKAGE CURRENTS2  
VDD = 3.3 V  
Source OFF Leakage IS (OFF)  
0.01  
0.25  
0.01  
0.25  
0.01  
0.25  
nA typ  
nA max  
nA typ  
nA max  
nA typ  
nA max  
VS = 3 V/1 V, VD = 1 V/3 V;  
Test Circuit 2  
VS = 3 V/1 V, VD = 1 V/3 V;  
Test Circuit 2  
VS = VD = 1 V, or 3 V;  
Test Circuit 3  
0.35  
0.35  
0.35  
Drain OFF Leakage ID (OFF)  
Channel ON Leakage ID, IS (ON)  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current  
2.0  
0.4  
V min  
V max  
IINL or IINH  
0.005  
µA typ  
µA max  
VIN = VINL or VINH  
0.1  
DYNAMIC CHARACTERISTICS2  
tON  
14  
8
ns typ  
ns max  
ns typ  
ns max  
pC typ  
RL = 300 , CL = 35 pF  
VS = 2 V, Test Circuit 4  
RL = 300 , CL = 35 pF  
VS = 2 V, Test Circuit 4  
VS = 1.5 V, RS = 0 , CL = 1 nF;  
Test Circuit 5  
RL = 50 , CL = 5 pF, f = 10 MHz  
RL = 50 , CL = 5 pF, f = 1 MHz;  
Test Circuit 6  
20  
13  
tOFF  
Charge Injection  
Off Isolation  
4
–55  
–75  
dB typ  
dB typ  
Bandwidth –3 dB  
200  
MHz typ  
RL = 50 , CL = 5 pF;  
Test Circuit 7  
CS (OFF)  
CD (OFF)  
CD, CS (ON)  
17  
17  
38  
pF typ  
pF typ  
pF typ  
POWER REQUIREMENTS  
VDD = 3.3 V  
Digital Inputs = 0 V or 3 V  
IDD  
0.001  
µA typ  
µA max  
1.0  
NOTES  
1Temperature ranges are as follows: B Versions: –40°C to +85°C.  
2Guaranteed by design, not subject to production test.  
Specifications subject to change without notice.  
REV. 0  
–3–  
ADG741/ADG742  
ABSOLUTE MAXIMUM RATINGS1  
NOTES  
1Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those listed in the operational sections  
of this specification is not implied. Exposure to absolute maximum rating condi-  
tions for extended periods may affect device reliability. Only one absolute maxi-  
mum rating may be applied at any one time.  
(TA = 25°C unless otherwise noted)  
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V  
Analog, Digital Inputs2 . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V  
or 30 mA, Whichever Occurs First  
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA  
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA  
(Pulsed at 1 ms, 10% Duty Cycle Max)  
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be  
limited to the maximum ratings given.  
Operating Temperature Range  
Table I. Truth Table  
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C  
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . .150°C  
SC70 Package  
ADG741 In  
ADG742 In  
Switch Condition  
0
1
1
0
OFF  
ON  
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 332°C/W  
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120°C/W  
θ
Lead Temperature, Soldering  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .220°C  
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 kV  
ORDERING GUIDE  
Model  
Temperature Range  
Brand*  
Package Description  
Package Option  
ADG741BKS  
ADG742BKS  
–40°C to +85°C  
–40°C to +85°C  
SFB  
SGB  
SC70  
SC70  
KS-6  
KS-6  
*Brand = Brand on these packages is limited to three characters due to space constraints.  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
the ADG741/ADG742 features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD  
precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
–4–  
REV. 0  
ADG741/ADG742  
PIN CONFIGURATIONS  
TERMINOLOGY  
VDD  
GND  
S
D
IN  
Most Positive Power Supply Potential.  
Ground (0 V) Reference.  
Source Terminal. May be an input or output.  
Drain Terminal. May be an input or output.  
Logic Control Input.  
6-Lead Plastic Surface Mount  
(SC70)  
1
2
3
6
5
4
D
S
V
DD  
ADG741/  
ADG742  
TOP VIEW  
(Not to Scale)  
NC  
IN  
RON  
RFLAT(ON)  
Ohmic Resistance Between D and S.  
GND  
Flatness is defined as the difference between  
the maximum and minimum value of on  
resistance as measured over the specified  
analog signal range.  
NC = NO CONNECT  
IS (OFF)  
Source Leakage Current with the Switch “OFF.”  
Drain Leakage Current with the Switch “OFF.”  
Channel Leakage Current with the Switch “ON.”  
Analog Voltage on Terminals D, S.  
I
D (OFF)  
ID, IS (ON)  
VD (VS)  
CS (OFF)  
CD (OFF)  
“OFF” Switch Source Capacitance.  
“OFF” Switch Drain Capacitance.  
CD, CS (ON) “ON” Switch Capacitance.  
tON  
Delay between applying the digital control  
input and the output switching on. See Test  
Circuit 4.  
tOFF  
Delay between applying the digital control  
input and the output switching off.  
Off Isolation  
A measure of Unwanted Signal Coupling  
Through an “OFF” Switch.  
Charge  
Injection  
A measure of the glitch impulse transferred  
from the digital input to the analog output  
during switching.  
Bandwidth  
The frequency at which the output is attenu-  
ated by –3 dBs.  
On Response The frequency response of the “ON” switch.  
On Loss  
The voltage drop across the “ON” switch seen  
on the On Response vs. Frequency plot as how  
many dBs the signal is away from 0 dB at very  
low frequencies.  
REV. 0  
–5–  
ADG741/ADG742Typical Performance Characteristics  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
10m  
V
= 2.7V  
T
= 25 C  
DD  
V
= 5V  
A
DD  
1m  
100  
10␮  
1␮  
V
= 3.0V  
DD  
V
= 4.5V  
DD  
V
= 5.0V  
DD  
100n  
10n  
1n  
0
0.5  
1.0  
1.5  
2.0 2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
10  
100  
1k  
10k  
100k  
1M  
10M  
FREQUENCY Hz  
V
OR V – DRAIN OR SOURCE VOLTAGE – V  
D
S
TPC 1. On Resistance as a Function of VD (VS) Single  
Supplies  
TPC 4. Supply Current vs. Input Switching Frequency  
3.5  
10  
V
= 3V  
DD  
V
= 5V, 3V  
20  
30  
40  
50  
60  
DD  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
+85؇C  
+25؇C  
40؇C  
70  
80  
90  
100  
110  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
10k  
100k  
1M  
10M  
100M  
FREQUENCY Hz  
V
OR V DRAIN OR SOURCE VOLTAGE V  
D
S
TPC 2. On Resistance as a Function of VD (VS) for  
Different Temperatures VDD = 3 V  
TPC 5. Off Isolation vs. Frequency  
3.5  
0
V
= 5V  
DD  
V
= 3V  
3.0  
2.5  
2.0  
1.5  
DD  
2  
4  
6  
+85؇C  
+25؇C  
40؇C  
1.0  
0.5  
0
0
0.5  
1.0  
1.5  
2.0 2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
10k  
100k  
1M  
10M  
100M  
FREQUENCY Hz  
V
OR V DRAIN OR SOURCE VOLTAGE V  
D
S
TPC 3. On Resistance as a Function of VD (VS) for  
Different Temperatures VDD = 5 V  
TPC 6. On Response vs. Frequency  
–6–  
REV. 0  
ADG741/ADG742  
Test Circuits  
I
DS  
V1  
I
(OFF)  
A
I
(OFF)  
A
I
D
(ON)  
A
S
D
S
D
S
D
S
D
V
R
= V1/I  
V
V
V
V
D
S
ON  
DS  
S
D
S
Test Circuit 1. On Resistance  
Test Circuit 2. Off Leakage  
Test Circuit 3. On Leakage  
V
DD  
0.1F  
V
V
ADG741  
50%  
50%  
50%  
IN  
V
DD  
V
L
OUT  
S
D
50%  
90%  
IN  
ADG742  
R
300⍀  
C
L
V
S
35pF  
IN  
90%  
V
OUT  
GND  
tOFF  
tON  
Test Circuit 4. Switching Times  
V
V
DD  
DD  
V
V
IN  
ADG741  
ADG742  
ON  
OFF  
V
R
OUT  
S
S
D
V
C
L
S
IN  
1nF  
IN  
V
OUT  
V  
OUT  
GND  
Q
= C 
؋
 V  
INJ  
L
OUT  
Test Circuit 5. Charge Injection  
V
DD  
0.1F  
V
DD  
0.1F  
V
DD  
V
DD  
V
OUT  
S
D
V
OUT  
S
D
R
L
50⍀  
IN  
R
L
V
50⍀  
IN  
IN  
V
S
GND  
V
IN  
V
S
GND  
Test Circuit 6. Off Isolation  
Test Circuit 7. Bandwidth  
REV. 0  
–7–  
ADG741/ADG742  
APPLICATIONS INFORMATION  
The signal transfer characteristic is dependent on the switch  
channel capacitance, CDS. This capacitance creates a frequency  
zero in the numerator of the transfer function A(s). Because the  
switch on resistance is small, this zero usually occurs at high  
frequencies. The bandwidth is a function of the switch output  
capacitance combined with CDS and the load capacitance. The  
frequency pole corresponding to these capacitances appears in  
the denominator of A(s).  
The ADG741/ADG742 belongs to Analog Devices’ new fam-  
ily of CMOS switches. This series of general-purpose switches  
have improved switching times, lower on resistance, higher  
bandwidth, low power consumption and low leakage currents.  
ADG741/ADG742 Supply Voltages  
Functionality of the ADG741/ADG742 extends from 1.8 V to  
5.5 V single supply, which makes it ideal for battery-powered  
instruments, where important design parameters are power  
efficiency and performance.  
The dominant effect of the output capacitance, CD, causes the  
pole breakpoint frequency to occur first. Therefore, in order to  
maximize bandwidth a switch must have a low input and output  
capacitance and low on resistance. The On Response vs. Fre-  
quency plot for the ADG741/ADG742 can be seen in TPC 6.  
It is important to note that the supply voltage effects the input  
signal range, the on resistance, and the switching times of the  
part. By looking at the typical performance characteristics  
and the specifications, the effects of the power supplies can  
be clearly seen.  
Off Isolation  
Off isolation is a measure of the input signal coupled through an  
off switch to the switch output. The capacitance, CDS, couples  
the input signal to the output load, when the switch is off, as  
shown in Figure 2.  
For VDD = 1.8 V operation, RON is typically 40 over the tem-  
perature range.  
On Response vs. Frequency  
C
DS  
Figure 1 illustrates the parasitic components that affect the ac  
performance of CMOS switches (the switch is shown surrounded  
by a box). Additional external capacitances will further degrade  
some performance. These capacitances affect feedthrough,  
crosstalk and system bandwidth.  
S
D
V
OUT  
C
C
R
D
LOAD  
LOAD  
V
IN  
C
Figure 2. Off Isolation Is Affected by External Load Resis-  
tance and Capacitance  
DS  
S
D
V
OUT  
R
The larger the value of CDS, larger values of feedthrough will be  
produced. The typical performance characteristic graph of TPC 5  
illustrates the drop in off-isolation as a function of frequency. From  
dc to roughly 1 MHz, the switch shows better than 75 dB isola-  
tion. Up to frequencies of 10 MHz, the off isolation remains better  
than 55 dB. As the frequency increases, more and more of the  
input signal is coupled through to the output. Off-isolation can be  
maximized by choosing a switch with the smallest CDS as possible.  
The values of load resistance and capacitance affect off isolation  
also, as they contribute to the coefficients of the poles and zeros  
in the transfer function of the switch when open.  
ON  
C
C
R
D
LOAD  
LOAD  
V
IN  
Figure 1. Switch Represented by Equivalent Parasitic  
Components  
The transfer function that describes the equivalent diagram of  
the switch (Figure 1) is of the form (A)s shown below.  
s(RON  
CDS )+1  
A(s) = RT  
s(RON CT RT )+1  
s(RLOAD CDS  
s(RLOAD )(CT )+1  
)
where:  
A(s)=  
CT = CLOAD + CD + CDS  
RT = RLOAD/(RLOAD + RON  
)
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
6-Lead Plastic Surface Mount  
(SC70)  
0.087 (2.20)  
0.071 (1.80)  
6
5
2
4
3
0.053 (1.35)  
0.045 (1.15)  
0.094 (2.40)  
0.071 (1.80)  
1
PIN 1  
0.026 (0.65) BSC  
0.051 (1.30)  
BSC  
0.039 (1.00)  
0.031 (0.80)  
0.043 (1.10)  
0.031 (0.80)  
8؇  
0؇  
0.012 (0.30)  
0.006 (0.15)  
0.004 (0.10)  
0.000 (0.00)  
0.012 (0.30)  
0.004 (0.10)  
SEATING  
PLANE  
0.007 (0.18)  
0.004 (0.10)  
–8–  
REV. 0  

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