ADG902BCPZ-REEL7 [ADI]
0MHz - 2500MHz RF/MICROWAVE DIVERSITY SWITCH, 1.25dB INSERTION LOSS, 3 X 3 MM, LEAD FREE, LFCSP-8;
| 型号： | ADG902BCPZ-REEL7 |
| 厂家： | 
ADI |
| 描述： | 0MHz - 2500MHz RF/MICROWAVE DIVERSITY SWITCH, 1.25dB INSERTION LOSS, 3 X 3 MM, LEAD FREE, LFCSP-8 瞄准线 射频 微波 |
| 文件： | 总13页 (文件大小：734K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
0 Hz to 4.5 GHz, 40 dB Off Isolation at 1 GHz,
17 dBm P1dB at 1 GHz SPST Switches
Data Sheet
ADG901/ADG902
FEATURES
FUNCTIONAL BLOCK DIAGRAMS
ADG901 absorptive switch
ADG902 reflective switch
ADG901
RF1
RF2
Enables user to pass dc signals up to 0.5 V without dc
blocking capacitor
Operational from 0 Hz up to 4.5 GHz at −3 dB frequency
40 dB off isolation at 1 GHz typical
0.8 dB insertion loss at 1 GHz typical
17 dBm P1dB at 1 GHz typical
50Ω
50Ω
CTRL
Available in 3 mm × 3 mm, 8-lead MSOP and 8-lead LFCSP
<1 μA power consumption
CMOS/LVTTL control logic
Figure 1. ADG901
Specified at 1.65 V to 2.75 V
ADG902
RF1
RF2
APPLICATIONS
Wireless communications
General purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front-end switch
IF switching
CTRL
Tuner modules
Antenna diversity switching list
Figure 2. ADG902
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG901/ADG902 are wideband switches that use a comple-
mentary metal-oxide semiconductor (CMOS) process to provide
high isolation and low insertion loss to 1 GHz. The ADG901 is an
absorptive (matched) switch with 50 Ω terminated shunt legs, while
the ADG902 is a reflective switch. These devices are designed
such that the isolation is high over the dc to 1 GHz frequency
range. These switches enable the user to pass dc signals up to 0.5 V
without the use of a dc blocking capacitor. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
LVTTL compatible. The low power consumption of these CMOS
devices makes them ideally suited to wireless applications and
general-purpose high frequency switching.
1. 40 dB Off Isolation at 1 GHz
2. 0.8 dB Insertion Loss at 1 GHz
3. 17 dBm P1dB at 1 GHz
0
T
= 25C
A
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
V
= 2.5V
DD
V
= 1.8V
DD
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
Figure 3. Off Isolation vs. Frequency
Rev. D
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2003–2017 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADG901/ADG902
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
ESD Caution...................................................................................5
Pin Configurations and Function Descriptions............................6
Typical Performance Characteristics ..............................................7
Terminology.......................................................................................9
Test Circuits..................................................................................... 10
Applications Information.............................................................. 11
Absorptive vs. Reflective Switches ........................................... 11
ADG901/ADG902 Evaluation Board.......................................... 12
Outline Dimensions....................................................................... 13
Ordering Guide .......................................................................... 13
Applications....................................................................................... 1
Functional Block Diagrams............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Continous Current Per Channel ................................................ 4
Absolute Maximum Ratings............................................................ 5
REVISION HISTORY
11/2017—Rev. C to Rev. D
10/2005—Rev. A to Rev. B
Deleted Figure 3; Renumbered Sequentially................................. 1
Added Figure 2; Renumbered Sequentially ................................. 1
Changes to Features Section, Figure 1, General Description
Section, and Product Highlights Section ...................................... 1
Deleted Endnote 4, Table 1; Renumbered Sequentially .............. 3
Change to −3 dB Frequency Parameter, Table 1........................... 3
Added Table 2; Renumbered Sequentially .................................... 4
Changes to Table 3............................................................................ 5
Change to Figure 4 ........................................................................... 6
Changes to Ordering Guide .......................................................... 12
Changes to Figure 1...........................................................................1
Changes to Table 1.............................................................................3
Changes to Ordering Guide.......................................................... 12
10/2004—Rev. 0 to Rev. A
Changes to Features .........................................................................1
Changes to Product Highlights ......................................................1
Changes to Specifications.................................................................2
Changes to Ordering Guide.............................................................3
Change to ADG9xx Evaluation Board Section .............................9
Changes to Ordering Guide.......................................................... 10
5/2016—Rev. B to Rev. C
Changes to Figure 4 and Table 3..................................................... 5
Added Figure 5; Renumbered Sequentially .................................. 5
Updated Outline Dimensions....................................................... 12
Changes to Ordering Guide .......................................................... 13
8/2003—Revision 0: Initial Version
Rev. D | Page 2 of 13
Data Sheet
ADG901/ADG902
SPECIFICATIONS
VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications TMIN to TMAX, unless otherwise specified.1
Table 1.
B Version
Parameter
Symbol
Test Conditions/Comments
Min
Typ2
Max
Unit
AC ELECTRICAL CHARACTERISTICS
Operating Frequency3
−3 dB Frequency
DC
2.5
GHz
GHz
dBm
dBm
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
ns
ns
ns
dBm
dBm
mV p-p
4.5
Input Power
0 V dc bias
0.5 V dc bias
DC to 100 MHz; VDD = 2.5 V 10%
500 MHz; VDD = 2.5 V 10%
1000 MHz; VDD = 2.5 V 10%
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
7
16
0.7
0.8
1.25
Insertion Loss
S21, S12
S21, S12
S21, S12
S11, S22
S11, S22
0.4
0.5
0.8
61
45
40
60
47
37
28
29
28
23
21
19
3.6
5.8
3.1
6.0
17
36
2.5
Isolation—RF1 to RF2
CP Package
60
43
34
51
37.5
31
20
23
25
18
17
15
Isolation—RF1 to RF2
RM Package
Return Loss (On Channel)
Return Loss (Off Channel)
1000 MHz
On Switching Time
Off Switching Time
Rise Time
Fall Time
1 dB Compression
tON
tOFF
tRISE
tFALL
P1dB
50% CTRL to 90% RF
50% CTRL to 10% RF
10% to 90% RF
90% to 10% RF
1000 MHz
6
9.5
5.5
8.5
Third-Order Intermodulation Intercept IP3
Video Feedthrough4
900 MHz/901 MHz, 4 dBm
28.5
DC ELECTRICAL CHARACTERISTICS
Input High Voltage
VINH
VINH
VINL
VINL
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
1.7
0.65 VDD
V
V
V
V
Input Low Voltage
0.7
0.35
VDD
Input Leakage Current
CAPACITANCE
II
0 ≤ VIN ≤ 2.75 V
0.1
1
µA
RF1/RF2, RF Port On Capacitance
CTRL Input Capacitance
POWER REQUIREMENTS
VDD
CRF on
CCTRL
f = 1 MHz
f = 1 MHz
1.2
2.1
pF
pF
1.65
2.75
1
V
µA
Quiescent Power Supply Current
IDD
Digital inputs = 0 V or VDD
0.1
1 Temperature range for B version: −40°C to +85°C.
2 Typical values are at VDD = 2.5 V and 25°C, unless otherwise specified.
3 Point at which insertion loss degrades by 1 dB.
4 The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns
rise time pulses and 500 MHz bandwidth.
Rev. D | Page 3 of 13
ADG901/ADG902
Data Sheet
CONTINOUS CURRENT PER CHANNEL
Table 2.
Parameter
25°C 85°C 105°C 125°C Unit
Test Conditions/Comments
CONTINUOUS CURRENT PER CHANNEL
8-Lead LFCSP
θJA = 48°C/W, dc bias = 0.5 V
VDD = 2.75 V, VSS = 0 V
VDD = 1.65 V, VSS = 0 V
8-lead MSOP
70
56
7
7
3.85
3.85
2.8
2.1
mA maximum
mA maximum
θJA = 206°C/W, dc bias = 0.5 V
VDD = 2.75 V, VSS = 0 V
VDD = 1.65 V, VSS = 0 V
51.1
39.9
7
7
3.85
3.85
2.8
2.1
mA maximum
mA maximum
Rev. D | Page 4 of 13
Data Sheet
ADG901/ADG902
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise specified.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Table 3.
Parameter
Rating
VDD to GND
Inputs to GND
Continuous Current
Input Power3
−0.5 V to +4 V
−0.5 V to VDD + 0.3 V1
Data2 + 15%
18 dBm
ESD CAUTION
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
θJA Thermal Impedance
MSOP Package
−40°C to +85°C
−65°C to +150°C
150°C
206°C/W
LFCSP Package
2-Layer Board
4-Layer Board
Lead Temperature, Soldering (10 sec)
IR Reflow, Peak Temperature (<20 sec)
ESD
84°C/W
48°C/W
300°C
235°C
1 kV
1 RF1/RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V.
2 See Table 2.
3 Input power is tested with switch in both open and close position. Power is
applied on RFx, while RFC is terminated to a 50 Ω resistor to GND.
Rev. D | Page 5 of 13
ADG901/ADG902
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
ADG901
V
1
2
3
4
DD
8
7
6
5
RF2
V
DD
1
2
3
4
8
7
6
5
RF2
ADG901/
ADG902
CTRL
GND
RF1
GND
CTRL
GND
RF1
GND
GND
GND
TOP VIEW
(Not to Scale)
GND
GND
TOP VIEW
(Not to Scale)
NOTES
1. THE LFCSP PACKAGE HAS AN EXPOSED
PAD. THE EXPOSED PAD MUST BE TIED
TO THE SUBSTRATE, GND.
Figure 5. 8-Lead MSOP Pin Configuration
Figure 4. 8-Lead LFCSP Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic Description
1
2
VDD
CTRL
Power Supply Input. These devices can be operated from 1.65 V to 2.75 V; decouple VDD to GND.
CMOS or LVTTL Logic Level. CTRL input must not exceed VDD.
Logic 0: RF1 isolated from RF2.
Logic 1: RF1 to RF2.
3, 5, 6, 7
4
8
GND
RF1
RF2
Ground Reference Point for All Circuitry on the Device.
RF1 Port.
RF2 Port.
EPAD
Exposed Pad. The LFCSP package has an exposed pad. The exposed pad must be tied to the substrate, GND.
Table 5. Truth Table
CTRL
Signal Path
0
1
RF1 isolated from RF2
RF1 to RF2
Rev. D | Page 6 of 13
Data Sheet
ADG901/ADG902
TYPICAL PERFORMANCE CHARACTERISTICS
–0.4
–0.6
–0.8
–0.4
–40°C
–0.6
V
= 2.5V
–0.8 +25°C
–1.0
DD
V
= 2.25V
DD
+85°C
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
–3.0
–1.2
–1.4
–1.6
–1.8
–2.0
V
= 2.75V
DD
–2.2
–2.4
–2.6
–2.8
V
T
= 25°C
= 2.5V
100k
A
DD
–3.0
10k
10k
100k
1M
10M
100M
1G
10G
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 6. Insertion Loss vs. Frequency over Supplies (S12 and S21)
Figure 9. Insertion Loss vs. Frequency over Temperature (S12 and S21)
–0.40
–0.45
–0.50
0
T
= 25°C
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
–65
–70
–75
–80
–85
–90
–95
–100
A
V
DD
= 2.5V
–0.55
–0.60
–0.65
–0.70
–0.75
–0.80
–0.85
–0.90
–0.95
–1.00
V
= 2.25V
DD
V
= 2.75V
DD
V
= 2.5V
DD
V
= 1.8V
1G
DD
T
= 25°C
A
10k
100k
1M
10M
100M
1G
10G
10k
100k
1M
10M
100M
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 7. Insertion Loss vs. Frequency over Supplies (S12 and S21)
(Zoomed Figure 6 Plot)
Figure 10. Off Isolation vs. Frequency over Supplies (S12 and S21)
–0.4
–0.6
–0.8
0
V
= 2.5V
DD
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
–65
–70
–75
–80
–85
–90
V
= 1.95V
V
= 1.8V
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
–3.0
DD
DD
+85°C
V
= 1.65V
DD
+25°C
–40°C
T
= 25°C
A
10k
100k
1M
10M
100M
1G
10G
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 8. Insertion Loss vs. Frequency over Supplies (S12 and S21)
Figure 11. Off Isolation vs. Frequency over Temperature (S12 and S21)
Rev. D | Page 7 of 13
ADG901/ADG902
Data Sheet
0
40
35
30
25
20
15
10
5
T
V
= 25°C
A
= 2.5V
DD
–5
–10
–15
–20
–25
–30
–35
OFF SWITCH
V
= 2.5V
= 25C
DD
ON SWITCH
1M
T
A
0
250
350
450
550
650
750
850
10k
100k
10M
100M
1G
10G
FREQUENCY (MHz)
FREQUENCY (Hz)
Figure 15. IP3 vs. Frequency
Figure 12. Return Loss vs. Frequency (S11)
20
18
16
14
12
10
8
CH1
CH2
6
4
V
= 2.5V
DD
= 25C
2
T
A
0
0
250
500
750
1000
1250
1500
CH1 = CTRL = 1V/DIV
CH2 = RFx = 100mV/DIV
t
= 2.8ns
= 5.1ns
RISE
t
FREQUENCY (MHz)
FALL
Figure 16. P−1dB vs. Frequency
Figure 13. Switch Timing
1
CTRL
RFx
2
CH2 pk-pk
2.016mV
CH1 500mV
CH2 1mV
10.0ns
Figure 14. Video Feedthrough
Rev. D | Page 8 of 13
Data Sheet
ADG901/ADG902
TERMINOLOGY
VDD
tFALL
Most positive power supply potential.
Fall time. Time for the RF signal to fall from 90% to 10% of the
on level.
IDD
Positive supply current.
Off Isolation
The attenuation between input and output ports of the switch
when the switch control voltage is in the off condition.
GND
Ground (0 V) reference.
Insertion Loss
CTRL
The attenuation between input and output ports of the switch
when the switch control voltage is in the on condition.
Logic control input.
VINL
P1dB
Maximum input voltage for Logic 0.
1 dB compression point. The RF input power level at which the
switch insertion loss increases by 1 dB over its low level value. It
is a measure of how much power the on switch can handle
before the insertion loss increases by 1 dB.
VINH
Minimum input voltage for Logic 1.
IINL (IINH
)
Input current of the digital input.
IP3
CIN
Third-order intermodulation intercept. This is a measure of the
power in false tones that occur when closely spaced tones are
passed through a switch, whereby the nonlinearity of the switch
causes these false tones to be generated.
Digital input capacitance.
tON
Delay between applying the digital control input and the output
switching on.
Return Loss
The amount of reflected power relative to the incident power at
a port. Large return loss indicates good matching. By measuring
return loss the voltage standing wave ratio VSWR can be
calculated from conversion charts. The VSWR indicates the
degree of matching present at a switch RF port.
tOFF
Delay between applying the digital control input and the output
switching off.
tRISE
Rise time. Time for the RF signal to rise from 10% to 90% of the
on level.
Video Feedthrough
The spurious signals present at the RF ports of the switch when
the control voltage is switched from high to low or low to high
without an RF signal present.
Rev. D | Page 9 of 13
ADG901/ADG902
Data Sheet
TEST CIRCUITS
Similar setups for ADG902.
V
V
DD
DD
0.1µF
0.1µF
ADG901
50Ω
V
DD
V
V
OUT
DD
RF1
RF2
50%
50%
V
CTRL
NC
OSCILLOSCOPE
R
RF1
L
RF2
V
S
CTRL
50
Ω
10%
90%
V
OUT
50Ω
GND
CTRL
tON
tOFF
GND
V
CTRL
Figure 17. Switching Timing: tON, tOFF
V
DD
0.1µF
Figure 21. Video Feedthrough
V
V
DD
DD
0.1µF
V
OUT
RF2
RF1
50%
50%
V
CTRL
R
RF
SOURCE
L
V
S
90%
90%
CTRL
50
Ω
10%
10%
V
V
OUT
DD
ADG901
GND
SPECTRUM
ANALYZER
COMBINER
RF1
RF2
tRISE
tFALL
50
Ω
50Ω
RF
SOURCE
Figure 18. Switch Timing: tRISE, tFALL
CTRL
V
DD
GND
0.1µF
V
CTRL
V
OUT
Figure 22. IP3
R
L
V
50
Ω
DD
ADG901
V
DD
0.1µF
RF1
50Ω
RF2
V
S
50
Ω
50Ω
NETWORK
ANALYZER
V
DD
CTRL
ADG901
GND
RF
SPECTRUM
ANALYZER
SOURCE
V
V
RF1
RF2
OUT
CTRL
OFF ISOLATION = 20 LOG
V
V
S
S
50Ω
50Ω
Figure 19. Off Isolation
CTRL
V
DD
GND
0.1µF
V
CTRL
V
OUT
Figure 23. P1dB
R
L
V
50
Ω
DD
ADG901
RF1
50Ω
RF2
V
S
50
Ω
50
Ω
NETWORK
ANALYZER
CTRL
GND
V
OUT
V
INSERTION LOSS = 20 LOG
CTRL
V
S
Figure 20. Insertion Loss
Rev. D | Page 10 of 13
Data Sheet
ADG901/ADG902
APPLICATIONS INFORMATION
The ADG901/ADG902 are ideal solutions for low power, high
frequency applications. The low insertion loss, high isolation
between ports, low distortion, and low current consumption of
these parts make them excellent solutions for many high
frequency switching applications.
The ADG902 reflective switch is suitable for applications where
high off port VSWR does not matter and the switch has some
other desired performance feature. It can be used in many
applications, including high speed filter selection. In most cases,
an absorptive switch can be used instead of a reflective switch,
but not vice versa.
Applications include switching between high frequency filters,
ASK generators, and FSK generators.
ABSORPTIVE vs. REFLECTIVE SWITCHES
The ADG901 is an absorptive (matched) switch with 50 Ω
terminated shunt legs and the ADG902 is a reflective switch
with 0 Ω terminated shunts to ground. The ADG901 absorptive
switch has a good VSWR on each port, regardless of the switch
mode. Use an absorptive switch when there is a need for a good
VSWR that is looking into the port but not passing the through
signal to the common port. The ADG901 is therefore ideal for
applications that require minimum reflections back to the RF
source. It also ensures that the maximum power is transferred
to the load.
Rev. D | Page 11 of 13
ADG901/ADG902
Data Sheet
ADG901/ADG902 EVALUATION BOARD
The ADG901/ADG902 evaluation board allows designers to
evaluate the high performance wideband switches with a
minimum of effort. To prove that these devices meet user
requirements, the user requires only a power supply and a
network analyzer along with the evaluation board. An
application note is available with the evaluation board and
provides complete information on operating the evaluation
board.
The RF1 port (see Figure 24) is connected through a 50 Ω
transmission line to the top left SMA Connector J1. RF2 is
connected through a 50 Ω transmission line to the top SMA
Connector J2. J3 is connected to GND. A through transmission
line connects J4 and J5 and this transmission line is used to
estimate the loss of the PCB over the environmental conditions
being evaluated.
The board is constructed of a 4-layer, FR4 material with a
dielectric constant of 4.3 and an overall thickness of 0.062 inches.
Two ground layers with grounded planes provide ground for
the RF transmission lines. The transmission lines were designed
using a coplanar waveguide with ground plane model using a
trace width of 0.052 inches, clearance to ground plane of
0.030 inches, dielectric thickness of 0.029 inches, and a metal
thickness of 0.014 inches.
Figure 24. ADG901/ADG902 Evaluation Board Top View
Rev. D | Page 12 of 13
Data Sheet
ADG901/ADG902
OUTLINE DIMENSIONS
3.20
3.00
2.80
8
1
5
4
5.15
4.90
4.65
3.20
3.00
2.80
PIN 1
IDENTIFIER
0.65 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
0.80
0.55
0.40
0.15
0.05
0.23
0.09
6°
0°
0.40
0.25
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 25. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
DETAIL A
(JEDEC 95)
1.84
3.10
3.00 SQ
2.90
1.74
1.64
0.50
BSC
8
5
PIN 1 INDEX
EXPOSED
PAD
1.55
1.45
1.35
AREA
0.50
0.40
0.30
4
1
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
NS
INDIC ATOR AREA OPTIO
(SEE DETAIL A)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.80
0.75
0.70
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
0.30
0.25
0.20
SEATING
PLANE
0.203 REF
COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4
Figure 26. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-8-13)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADG901BRMZ
ADG901BRMZ-REEL7
ADG901BCPZ-500RL7
ADG902BRMZ
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
Branding
S1T
S1T
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Lead Frame Chip Scale Package [LFCSP]
8-Lead Mini Small Outline Package [MSOP]
ADG901 Evaluation Board
RM-8
RM-8
CP-8-13
RM-8
S1T
S1V
EVAL-ADG901EBZ
EVAL-ADG902EBZ
ADG902 Evaluation Board
1 Z = RoHS Compliant Part.
©2003–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03336-0-11/17(D)
Rev. D | Page 13 of 13
相关型号：
ADG904BCP-500RL7
4-CHANNEL, SGL ENDED MULTIPLEXER, QCC20, 4 X 4 MM, MO-220VGGD-1, LFCSP-20
ROCHESTER
©2020 ICPDF网 联系我们和版权申明