ADM1169ASTZ-REEL [ADI]
IC POWER SUPPLY MANAGEMENT CKT, PQFP32, 7 X 7 MM, ROHS COMPLIANT, MS-026BBA, LQFP-32, Power Management Circuit;
| 型号： | ADM1169ASTZ-REEL |
| 厂家： | 
ADI |
| 描述： | IC POWER SUPPLY MANAGEMENT CKT, PQFP32, 7 X 7 MM, ROHS COMPLIANT, MS-026BBA, LQFP-32, Power Management Circuit |
| 文件： | 总36页 (文件大小：831K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Super Sequencer with Margining Control
and Nonvolatile Fault Recording
ADM1169
Data Sheet
FEATURES
APPLICATIONS
Complete supervisory and sequencing solution for up to
8 supplies
Central office systems
Servers/routers
16-event deep black box nonvolatile fault recording
8 supply fault detectors enable supervision of supplies to
<0.5% accuracy at all voltages at 25°C
<1.0% accuracy across all voltages and temperatures
4 selectable input attenuators allow supervision of supplies to
14.4 V on VH
Multivoltage system line cards
DSP/FPGA supply sequencing
In-circuit testing of margined supplies
FUNCTIONAL BLOCK DIAGRAM
REFIN REFOUT REFGND
SDA SCL A1
A0
6 V on VP1 to VP3 (VPx)
ADM1169
SMBus
VREF
INTERFACE
4 dual-function inputs, VX1 to VX4 (VXx)
High impedance input to supply fault detector with
thresholds between 0.573 V and 1.375 V
General-purpose logic input
12-BIT
SAR ADC
FAULT
RECORDING
EEPROM
CLOSED-LOOP
MARGINING SYSTEM
8 programmable driver outputs, PDO1 to PDO8 (PDOx)
Open-collector with external pull-up
Push/pull output, driven to VDDCAP or VPx
Open-collector with weak pull-up to VDDCAP or VPx
Internally charge-pumped high drive for use with external
NFET (PDO1 to PDO6 only)
PDO1
PDO2
PDO3
PDO4
PDO5
PDO6
CONFIGURABLE
OUTPUT
DRIVERS
DUAL-
FUNCTION
INPUTS
VX1
VX2
VX3
VX4
(LOGIC INPUTS
OR
(HV CAPABLE OF
DRIVING GATES
OF NFET)
SFDs)
SEQUENCING
ENGINE
VP1
VP2
VP3
VH
CONFIGURABLE
OUTPUT
DRIVERS
PROGRAMMABLE
RESET
GENERATORS
Sequencing engine (SE) implements state machine control of
PDO outputs
PDO7
PDO8
(LV CAPABLE
OF DRIVING
LOGIC SIGNALS)
(SFDs)
State changes conditional on input events
Enables complex control of boards
Power-up and power-down sequence control
Fault event handling
AGND
PDOGND
VDDCAP
VDD
ARBITRATOR
VOUT VOUT VOUT VOUT
DAC
DAC
DAC
DAC
Interrupt generation on warnings
DAC1 DAC2 DAC3 DAC4
VCCP
GND
Watchdog function can be integrated in SE
Program software control of sequencing through SMBus
Complete voltage margining solution for 4 voltage rails
4 voltage output 8-bit DACs (0.300 V to 1.551 V) allow voltage
adjustment via dc-to-dc converter trim/feedback node
12-bit ADC for readback of all supervised voltages
Reference input (REFIN) has 2 input options
Driven directly from 2.048 V ( 0.25%) REFOUT pin
More accurate external reference for improved ADC
performance
Figure 1.
GENERAL DESCRIPTION
The ADM1169 Super Sequencer® is a configurable supervisory/
sequencing device that offers a single-chip solution for supply
monitoring and sequencing in multiple supply systems. In addition
to these functions, the ADM1169 integrates a 12-bit ADC and
four 8-bit voltage output DACs. These circuits can be used to
implement a closed-loop margining system that enables supply
adjustment by altering either the feedback node or reference of
a dc-to-dc converter using the DAC outputs.
Device powered by the highest of VPx, VH for improved
redundancy
Supply margining can be performed with a minimum of external
components. The margining loop can be used for in-circuit
testing of a board during production (for example, to verify
board functionality at −5% of nominal supplies), or it can be
used dynamically to accurately control the output voltage of
a dc-to-dc converter.
User EEPROM: 256 bytes
Industry-standard 2-wire bus interface (SMBus)
Guaranteed PDO low with VH, VPx = 1.2 V
Available in 32-lead, 7 mm × 7 mm LQFP and 40-lead,
6 mm × 6 mm LFCSP packages
For more information about the ADM1169 register map, refer
to the AN-721 Application Note.
Rev. A
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2011–2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADM1169
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Sequencing Engine Application Example............................... 19
Fault and Status Reporting........................................................ 20
Nonvolatile Black Box Fault Recording................................... 20
Black Box Writes with No External Supply ............................ 21
Voltage Readback............................................................................ 22
Supply Supervision with the ADC........................................... 22
Supply Margining ........................................................................... 23
Overview ..................................................................................... 23
Open-Loop Supply Margining ................................................. 23
Closed-Loop Supply Margining ............................................... 23
Writing to the DACs .................................................................. 24
Choosing the Size of the Attenuation Resistor....................... 24
DAC Limiting and Other Safety Features ............................... 24
Applications Diagram.................................................................... 25
Communicating with the ADM1169........................................... 26
Configuration Download at Power-Up ................................... 26
Updating the Configuration ..................................................... 26
Updating the Sequencing Engine............................................. 27
Internal Registers........................................................................ 27
EEPROM ..................................................................................... 27
Serial Bus Interface..................................................................... 28
SMBus Protocols for RAM and EEPROM.............................. 29
Write Operations........................................................................ 30
Read Operations......................................................................... 31
Outline Dimensions....................................................................... 33
Ordering Guide .......................................................................... 33
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Detailed Block Diagram .................................................................. 3
Specifications..................................................................................... 4
Absolute Maximum Ratings............................................................ 7
Thermal Resistance ...................................................................... 7
ESD Caution.................................................................................. 7
Pin Configurations and Function Descriptions ........................... 8
Typical Performance Characteristics ........................................... 10
Powering the ADM1169................................................................ 13
Inputs................................................................................................ 14
Supply Supervision..................................................................... 14
Programming the Supply Fault Detectors............................... 14
Input Comparator Hysteresis.................................................... 15
Input Glitch Filtering ................................................................. 15
Supply Supervision with VXx Inputs....................................... 16
VXx Pins as Digital Inputs ........................................................ 16
Outputs ............................................................................................ 17
Supply Sequencing Through Configurable Output Drivers. 17
Default Output Configuration.................................................. 17
Sequencing Engine ......................................................................... 18
Overview...................................................................................... 18
Warnings...................................................................................... 18
SMBus Jump (Unconditional Jump)........................................ 18
REVISION HISTORY
8/13—Rev. 0 to Rev. A
Change to Table 12 ......................................................................... 28
4/11—Revision 0: Initial Version
Rev. A | Page 2 of 36
Data Sheet
ADM1169
The device also provides up to eight programmable inputs for
monitoring undervoltage faults, overvoltage faults, or out-of-
window faults on up to eight supplies. In addition, there are eight
programmable outputs that can be used as logic enables. Six of
these programmable outputs can also provide up to a 12 V output
for driving the gate of an NFET that can be placed in the path of
a supply.
A block of nonvolatile EEPROM is available that can be used to
store user-defined information and can also be used to hold a
number of fault records that are written by the sequencing engine
defined by the user when a particular fault or sequence occurs.
The ADM1169 is controlled via configuration data that can be
programmed into an EEPROM. The entire configuration can
be programmed using an intuitive GUI-based software package
provided by Analog Devices, Inc.
The logical core of the device is a SE. This state machine-based
construction provides up to 63 different states. This design enables
very flexible sequencing of the outputs based on the condition of
the inputs.
DETAILED BLOCK DIAGRAM
REFIN
REFOUT
REFGND SDA SCL A1
SMBus
A0
VREF
ADM1169
INTERFACE
OSC
DEVICE
CONTROLLER
EEPROM
12-BIT
SAR ADC
FAULT
RECORDING
GPI SIGNAL
CONDITIONING
CONFIGURABLE
OUTPUT DRIVER
(HV)
PDO1
VX1
VX2
VX3
VX4
SFD
PDO2
PDO3
PDO4
PDO5
GPI SIGNAL
CONDITIONING
CONFIGURABLE
OUTPUT DRIVER
(HV)
PDO6
SEQUENCING
ENGINE
SFD
SFD
SELECTABLE
ATTENUATOR
VP1
VP2
VP3
CONFIGURABLE
OUTPUT DRIVER
(LV)
PDO7
CONFIGURABLE
OUTPUT DRIVER
(LV)
SELECTABLE
ATTENUATOR
VH
SFD
PDO8
AGND
PDOGND
REG 5.25V
CHARGE PUMP
V
DAC
V
OUT
DAC
OUT
VDDCAP
VDD
ARBITRATOR
GND
VCCP
DAC1 DAC2 DAC3 DAC4
Figure 2. Detailed Block Diagram
Rev. A | Page 3 of 36
ADM1169
Data Sheet
SPECIFICATIONS
VH = 3.0 V to 14.4 V,1 VPx = 3.0 V to 6.0 V,1 TA = −40°C to +85°C, unless otherwise noted.
Table 1.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
POWER SUPPLY ARBITRATION
VH, VPx
VPx
VH
VDDCAP
CVDDCAP
3.0
V
V
V
V
Minimum supply required on one of VH, VPx
Maximum VDDCAP = 5.1 V, typical
VDDCAP = 4.75 V
Regulated LDO output
Minimum recommended decoupling
capacitance
6.0
14.4
5.4
2.7
10
4.75
µF
POWER SUPPLY
Supply Current, IVH, IVPx
4.2
1
6
2
mA
VDDCAP = 4.75 V, PDO1 to PDO8 off, DACs off,
ADC off
Additional Currents
All PDOx FET Drivers On
mA
mA
VDDCAP = 4.75 V, PDO1 to PDO6 loaded with
1 µA each, PDO7 to PDO8 off
Maximum additional load that can be drawn
from all PDO pull-ups to VDDCAP
Current Available from VDDCAP
DAC Supply Currents
ADC Supply Current
EEPROM Erase Current
SUPPLY FAULT DETECTORS
VH Pin
2.2
1
10
mA
mA
mA
Four DACs on with 100 µA maximum load on each
Running round-robin loop
1 ms duration only, VDDCAP = 3 V
Input Impedance
Input Attenuator Error
Detection Ranges
High Range
Midrange
VPx Pins
Input Impedance
Input Attenuator Error
Detection Ranges
Midrange
Low Range
Ultralow Range
VXx Pins
52
0.05
kΩ
%
Midrange and high range
Low range and midrange
6
2.5
14.4
6
V
V
52
0.05
kΩ
%
2.5
1.25
0.573
6
3
V
V
V
1.375
No input attenuation error
No input attenuation error
Internal reference VREF error + DAC nonlinearity +
comparator offset error
Input Impedance
Ultralow Range
Absolute Accuracy
1
MΩ
V
%
0.573
1.375
1
Threshold Resolution
Digital Glitch Filter
8
0
100
Bits
µs
µs
Minimum programmable filter length
Maximum programmable filter length
Rev. A | Page 4 of 36
Data Sheet
ADM1169
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
ANALOG-TO-DIGITAL CONVERTER
Signal Range
0
VREFIN
V
The ADC can convert signals presented to the
VH, VPx, and VXx pins; VPx and VH input signals
are attenuated depending on the selected
range; a signal at the pin corresponding to the
selected range is from 0.573 V to 1.375 V at the
ADC input
Input Reference Voltage on REFIN Pin, VREFIN
Resolution
INL
Gain Error
Conversion Time
2.048
12
V
Bits
LSB
%
ms
ms
LSB
2.5
0.05
Endpoint corrected, VREFIN = 2.048 V
VREFIN = 2.048 V
One conversion on one channel
All eight channels selected, averaging enabled
VREFIN = 2.048 V
0.44
84
Offset Error
2
Input Noise
0.25
8
LSBrms Direct input (no attenuator)
BUFFERED VOLTAGE OUTPUT DACS
Resolution
Bits
Code 0x80 Output Voltage
Four DACs are individually selectable for
centering on one of four output voltage ranges
Range 1
Range 2
Range 3
Range 4
Output Voltage Range
LSB Step Size
0.592
0.796
0.996
1.246
0.6
0.8
1
1.25
601.25
2.36
0.603
0.803
1.003
1.253
V
V
V
V
mV
mV
Same range, independent of center point
Endpoint corrected
INL
0.75 LSB
DNL
Gain Error
0.4
LSB
%
1
Maximum Load Current (Source)
Maximum Load Current (Sink)
Maximum Load Capacitance
Settling Time into 50 pF Load
Load Regulation
PSRR
100
100
µA
µA
pF
µs
mV
dB
dB
50
2
2.5
60
40
Per mA
DC
100 mV step in 20 ns with 50 pF load
REFERENCE OUTPUT
Reference Output Voltage
Load Regulation
2.043
1
2.048
−0.25
+0.25
2.053
V
No load
mV
mV
µF
dB
Sourcing current, IDACxMAX = −100 µA
Sinking current, IDACxMAX = +100 µA
Capacitor required for decoupling, stability
DC
Minimum Load Capacitance
PSRR
60
Rev. A | Page 5 of 36
ADM1169
Data Sheet
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
PROGRAMMABLE DRIVER OUTPUTS
High Voltage (Charge Pump) Mode
(PDO1 to PDO6)
Output Impedance
VOH
500
12.5
12
kΩ
V
V
11
10.5
14
13.5
IOH = 0 µA
IOH = 1 µA
IOUTAVG
20
µA
2 V < VOH < 7 V
Standard (Digital Output) Mode (PDO1 to PDO8)
VOH
2.4
V
V
V
V
mA
mA
kΩ
mA
VPU (pull-up to VDDCAP or VPx) = 2.7 V, IOH = 0.5 mA
VPU to VPx = 6.0 V, IOH = 0 mA
VPU ≤ 2.7 V, IOH = 0.5 mA
4.5
VPU − 0.3
0
VOL
0.50
20
60
29
2
IOL = 20 mA
2
IOL
Maximum sink current per PDOx pin
Maximum total sink for all PDOx pins
Internal pull-up
Current load on any VPx pull-ups, that is, total
source current available through any number of
PDO pull-up switches configured onto any one
VPx pin
2
ISINK
RPULL-UP
ISOURCE (VPx)2
16
20
Three-State Output Leakage Current
Oscillator Frequency
10
110
µA
kHz
VPDO = 14.4 V
All on-chip time delays derived from this clock
90
2.0
−1
100
DIGITAL INPUTS (VXx, A0, A1)
Input High Voltage, VIH
Input Low Voltage, VIL
Input High Current, IIH
Input Low Current, IIL
V
V
µA
µA
pF
µA
Maximum VIN = 5.5 V
Maximum VIN = 5.5 V
VIN = 5.5 V
0.8
1
VIN = 0 V
Input Capacitance
Programmable Pull-Down Current, IPULL-DOWN
5
20
VDDCAP = 4.75 V, TA = 25°C, if known logic state
is required
SERIAL BUS DIGITAL INPUTS (SDA, SCL)
Input High Voltage, VIH
2.0
V
V
V
Input Low Voltage, VIL
0.8
0.4
2
Output Low Voltage, VOL
IOUT = −3.0 mA
See Figure 38
SERIAL BUS TIMING
Clock Frequency, fSCLK
Bus Free Time, tBUF
Start Setup Time, tSU;STA
Stop Setup Time, tSU;STO
Start Hold Time, tHD;STA
SCL Low Time, tLOW
SCL High Time, tHIGH
SCL, SDA Rise Time, tR
SCL, SDA Fall Time, tF
Data Setup Time, tSU;DAT
Data Hold Time, tHD;DAT
Input Low Current, IIL
SEQUENCING ENGINE TIMING
State Change Time
400
kHz
µs
µs
µs
µs
µs
µs
ns
ns
ns
ns
µA
1.3
0.6
0.6
0.6
1.3
0.6
300
300
100
250
1
VIN = 0 V
10
µs
1 At least one of the VH, VPx pins must be ≥3.0 V to maintain the device supply on VDDCAP.
2 Specification is not production tested but is supported by characterization data at initial product release.
Rev. A | Page 6 of 36
Data Sheet
ADM1169
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Parameter
Rating
Voltage on VH Pin
16 V
Voltage on VPx Pins
Voltage on VXx Pins
7 V
Table 3. Thermal Resistance
−0.3 V to +6.5 V
−0.3 V to +7 V
5 V
6.5 V
6.5 V
16 V
7 V
Package Type
32-Lead LQFP
40-Lead LFCSP
θJA
54
26.5
Unit
°C/W
°C/W
Voltage on A0, A1 Pins
Voltage on REFIN, REFOUT Pins
Voltage on VDDCAP, VCCP Pins
Voltage on DACx Pins
Voltage on PDOx Pins
Voltage on SDA, SCL Pins
ESD CAUTION
Voltage on GND, AGND, PDOGND,
REFGND Pins
−0.3 V to +0.3 V
Input Current at Any Pin
Package Input Current
5 mA
20 mA
Maximum Junction Temperature (TJ max)
Storage Temperature Range
Lead Temperature
150°C
−65°C to +150°C
Soldering Vapor Phase, 60 sec
ESD Rating, All Pins
215°C
2000 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. A | Page 7 of 36
ADM1169
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
25
32
1
24
VX1
VX2
VX3
VX4
VP1
VP2
VP3
VH
PDO1
PDO2
PDO3
PDO4
PDO5
PDO6
PDO7
PDO8
PIN 1
INDICATOR
PIN 1
NC
VX1
VX2
VX3
VX4
NC
VP1
VP2
VP3
VH
1
2
30 PDO1
INDICATOR
29 PDO2
28
27
PDO3
PDO4
3
ADM1169
TOP VIEW
(Not to Scale)
4
ADM1169
5
26 PDO5
25 PDO6
24 PDO7
23 PDO8
22 NC
6
TOP VIEW
7
(Not to Scale)
8
9
8
17
21 NC
10
9
16
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
2. THE LFCSP HAS AN EXPOSED PAD ON THE BOTTOM.
THIS PAD IS A NO CONNECT (NC). IF POSSIBLE, THIS
PAD SHOULD BE SOLDERED TO THE BOARD FOR
IMPROVED MECHANICAL STABILITY.
Figure 3. 32-Lead LQFP Pin Configuration
Figure 4. 40-Lead LFCSP Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
LFCSP1
LQFP
Mnemonic
Description
N/A2
1, 6, 15,
16, 21,
NC
No Connect.
22, 37, 38
1 to 4
5 to 7
2 to 5
7 to 9
VX1 to VX4 (VXx) High Impedance Inputs to Supply Fault Detectors. Fault thresholds can be set from 0.573 V
to 1.375 V. Alternatively, these pins can be used as general-purpose digital inputs.
VP1 to VP3 (VPx)
Low Voltage Inputs to Supply Fault Detectors. Three input ranges can be set by altering the input
attenuation on a potential divider connected to these pins, the output of which connects to a supply
fault detector. These pins allow thresholds from 2.5 V to 6 V, from 1.25 V to 3 V, and from 0.573 V
to 1.375 V.
8
10
VH
High Voltage Input to Supply Fault Detectors. Three input ranges can be set by altering the input
attenuation on a potential divider connected to this pin, the output of which connects to a supply
fault detector. This pin allows thresholds from 6 V to 14.4 V and from 2.5 V to 6 V.
9
10
11
11
12
13
AGND3
REFGND3
REFIN
Ground Return for Input Attenuators.
Ground Return for On-Chip Reference Circuits.
Reference Input for ADC. Nominally, 2.048 V. This pin must be driven by a reference voltage. The
on-board reference can be used by connecting the REFOUT pin to the REFIN pin. This is the normal
configuration.
12
14
REFOUT
2.048 V Reference Output. A reservoir capacitor must always be connected between this pin and
GND, even if the REFIN pin is driven by an external reference. A 10 µF capacitor is recommended
for this purpose.
13 to 16 17 to 20
17 to 24 23 to 30
DAC1 to DAC4
PDO8 to PDO1
PDOGND3
Voltage Output DACs. These pins default to high impedance at power-up.
Programmable Output Drivers.
Ground Return for Output Drivers.
Central Charge-Pump Voltage of 5.25 V. A reservoir capacitor must be connected between this
pin and GND. A 10 µF capacitor is recommended for this purpose.
25
26
31
32
VCCP
27
28
29
30
33
34
35
36
A0
A1
SCL
SDA
Logic Input. This pin sets the seventh bit of the SMBus interface address.
Logic Input. This pin sets the sixth bit of the SMBus interface address.
SMBus Clock Pin. Bidirectional open drain requires external resistive pull-up.
SMBus Data Pin. Bidirectional open drain requires external resistive pull-up.
Rev. A | Page 8 of 36
Data Sheet
ADM1169
Pin No.
LQFP
LFCSP1
Mnemonic
Description
31
39
VDDCAP
Device Supply Voltage. Linearly regulated from the highest of the VPx and VH pins to a typical of
4.75 V. Note that a capacitor must be connected between this pin and GND. A 10 µF capacitor is
recommended for this purpose.
32
40
N/A2
GND3
EPAD
Supply Ground.
Exposed Pad. This pad is a no connect (NC). If possible, this pad should be soldered to the board for
improved mechanical stability.
1
The LFCSP has an exposed pad on the bottom. This pad is a no connect (NC). If possible, this pad should be soldered to the board for improved mechanical stability.
2 N/A is not applicable.
3 In a typical application, all ground pins are connected together.
Rev. A | Page 9 of 36
ADM1169
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
6
180
160
140
120
100
80
5
4
3
2
1
0
60
40
20
0
0
0
0
1
2
3
4
5
6
16
6
0
1
2
3
4
5
6
16
6
V
(V)
V
(V)
VP1
VP1
Figure 5. VVDDCAP vs. VVP1
Figure 8. IVP1 vs. VVP1 (VP1 Not as Supply)
6
5
4
3
2
1
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
2
4
6
8
10
12
14
0
2
4
6
8
10
12
14
V
(V)
V
(V)
VH
VH
Figure 6. VVDDCAP vs. VVH
Figure 9. IVH vs. VVH (VH as Supply)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
350
300
250
200
150
100
50
0
1
2
3
4
5
0
1
2
3
4
5
V
(V)
V
(V)
VP1
VH
Figure 7. IVP1 vs. VVP1 (VP1 as Supply)
Figure 10. IVH vs. VVH (VH Not as Supply)
Rev. A | Page 10 of 36
Data Sheet
ADM1169
14
12
10
8
1.0
0.8
0.6
0.4
0.2
0
6
–0.2
–0.4
–0.6
–0.8
–1.0
4
2
0
0
2.5
5.0
7.5
(µA)
10.0
12.5
15.0
0
1000
2000
3000
4000
CODE
I
LOAD
Figure 11. Charge-Pumped VPDO1 (FET Drive Mode) vs. ILOAD
Figure 14. DNL for ADC
5.0
1.0
0.8
0.6
0.4
0.2
0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
VP1 = 5V
VP1 = 3V
–0.2
–0.4
–0.6
–0.8
–1.0
0
1
2
3
4
5
6
0
1000
2000
3000
4000
CODE
I
(mA)
LOAD
Figure 12. VPDO1 (Strong Pull-Up to VPx) vs. ILOAD
Figure 15. INL for ADC
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
12000
10000
8000
6000
4000
2000
0
9894
VP1 = 5V
VP1 = 3V
25
81
0
10
20
30
(µA)
40
50
60
2047
2048
2049
CODE
I
LOAD
Figure 16. ADC Noise, Midcode Input, 10,000 Reads
Figure 13. VPDO1 (Weak Pull-Up to VPx) vs. ILOAD
Rev. A | Page 11 of 36
ADM1169
Data Sheet
1.005
1.004
1.003
1.002
1.001
1.000
0.999
0.998
0.997
0.996
0.995
VP1 = 3.0V
DAC
BUFFER
OUTPUT
20kΩ
47pF
PROBE
POINT
VP1 = 4.75V
1
CH1 200mV
M1.00µs
CH1
756mV
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
Figure 19. DAC Output vs. Temperature
Figure 17. Transient Response of DAC Code Change into Typical Load
2.058
2.053
2.048
2.043
2.038
VP1 = 3.0V
DAC
BUFFER
OUTPUT
100kΩ
1V
VP1 = 4.75V
PROBE
POINT
1
CH1 200mV
M1.00µs
CH1
944mV
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
Figure 20. REFOUT vs. Temperature
Figure 18. Transient Response of DAC to Turn-On from High-Z State
Rev. A | Page 12 of 36
Data Sheet
ADM1169
POWERING THE ADM1169
The ADM1169 is powered from the highest voltage input on
either the positive-only supply inputs (VPx) or the high voltage
supply input (VH). This technique offers improved redundancy
because the device is not dependent on any particular voltage rail
to keep it operational. The same pins are used for supply fault
detection (see the Supply Supervision section). A VDD arbitrator
on the device chooses which supply to use. The arbitrator can
be considered an OR’ing of four low dropout regulators (LDOs)
together. A supply comparator chooses the highest input to
provide the on-chip supply. There is minimal switching loss
with this architecture (~0.2 V), resulting in the ability to power
the ADM1169 from a supply as low as 3.0 V. Note that the
supply on the VXx pins cannot be used to power the device.
When two or more supplies are within 100 mV of each other,
the supply that first takes control of VDD keeps control. For
example, if VP1 is connected to a 3.3 V supply, VDD powers up
to approximately 3.1 V through VP1. If VP2 is then connected
to another 3.3 V supply, VP1 still powers the device unless VP2
goes 100 mV higher than VP1.
VDDCAP
VP1
VP2
VP3
VH
IN
OUT
OUT
OUT
OUT
4.75V
LDO
EN
IN
4.75V
LDO
EN
IN
4.75V
LDO
An external capacitor to GND is required to decouple the on-chip
supply from noise. This capacitor should be connected to the
VDDCAP pin, as shown in Figure 21. The capacitor has another
use during brownouts (momentary loss of power). Under these
conditions, when the input supply (VPx or VH) dips transiently
below VDD, the synchronous rectifier switch immediately turns
off so that it does not pull VDD down. The VDD capacitor can
then act as a reservoir to keep the device active until the next
highest supply takes over the powering of the device. A 10 µF
capacitor is recommended for this reservoir/decoupling function.
EN
IN
INTERNAL
DEVICE
SUPPLY
4.75V
LDO
EN
SUPPLY
COMPARATOR
Figure 21. VDD Arbitrator Operation
The VH input pin can accommodate supplies up to 14.4 V, which
allows the ADM1169 to be powered using a 12 V backplane supply.
In cases where this 12 V supply is hot swapped, it is recommended
that the ADM1169 not be connected directly to the supply. Suitable
precautions, such as the use of a hot swap controller or RC filter
network, should be taken to protect the device from transients
that may cause damage during hot swap events.
Rev. A | Page 13 of 36
ADM1169
Data Sheet
INPUTS
Table 5 lists the upper and lower limits of each available range,
the bottom of each range (VB), and the range itself (VR).
SUPPLY SUPERVISION
The ADM1169 has eight programmable inputs. Four of these are
dedicated supply fault detectors (SFDs). These dedicated inputs
are called VH and VPx (VP1 to VP3) by default. The other four
inputs are labeled VXx (VX1 to VX4) and have dual functionality.
They can be used either as SFDs, with functionality similar to the
VH and VPx, or as CMOS-/TTL-compatible logic inputs to the
device. Therefore, the ADM1169 can have up to eight analog
inputs, a minimum of four analog inputs and four digital inputs,
or a combination thereof. If an input is used as an analog input,
it cannot be used as a digital input. Therefore, a configuration
requiring eight analog inputs has no available digital inputs.
Table 6 shows the details of each input.
Table 5. Voltage Range Limits
Voltage Range (V)
0.573 to 1.375
1.25 to 3.00
VB (V)
0.573
1.25
2.5
VR (V)
0.802
1.75
3.5
2.5 to 6.0
6.0 to 14.4
6.0
8.4
The threshold value required is given by
VT = (VR × N)/255 + VB
where:
VT is the desired threshold voltage (undervoltage or overvoltage).
VR is the voltage range.
PROGRAMMING THE SUPPLY FAULT DETECTORS
N is the decimal value of the 8-bit code.
VB is the bottom of the range.
The ADM1169 can have up to eight SFDs on its eight input
channels. These highly programmable reset generators enable
the supervision of up to eight supply voltages. The supplies can
be as low as 0.573 V and as high as 14.4 V. The inputs can be
configured to detect an undervoltage fault (the input voltage
drops below a preprogrammed value), an overvoltage fault (the
input voltage rises above a preprogrammed value), or an out-of-
window fault (the input voltage is outside a preprogrammed
range). The thresholds can be programmed to an 8-bit resolution
in registers provided in the ADM1169. This translates to a voltage
resolution that is dependent on the range selected. The resolution
is given by
Reversing the equation, the code for a desired threshold is given by
N = 255 × (VT − VB)/VR
For example, if the user wants to set a 5 V overvoltage threshold
on VP1, the code to be programmed in the PS1OVTH register
(as described in the AN-721 Application Note) is given by
N = 255 × (5 − 2.5)/3.5
Therefore, N = 182 (1011 0110 or 0xB6).
Step Size = Threshold Range/255
Therefore, if the high range is selected on VH, the step size can
be calculated as follows:
(14.4 V − 6.0 V)/255 = 32.9 mV
Rev. A | Page 14 of 36
Data Sheet
ADM1169
For example, when the glitch filter timeout is 100 μs, any pulse
appearing on the input of the glitch filter block that is less than
100 μs in duration is prevented from appearing on the output of
the glitch filter block. Any input pulse that is longer than 100 μs
appears on the output of the glitch filter block. The output is
delayed with respect to the input by 100 μs. The filtering
process is shown in Figure 22.
INPUT COMPARATOR HYSTERESIS
The UV and OV comparators shown in Figure 23 are always
monitoring VPx. To avoid chatter (multiple transitions when
the input is very close to the set threshold level), these comparators
have digitally programmable hysteresis. The hysteresis can be
programmed up to the values shown in Table 6.
The hysteresis is added after a supply voltage goes out of tolerance.
Therefore, the user can program the amount above the undervoltage
threshold to which the input must rise before an undervoltage
fault is deasserted. Similarly, the user can program the amount
below the overvoltage threshold to which an input must fall
before an overvoltage fault is deasserted.
INPUT PULSE SHORTER
THAN GLITCH FILTER TIMEOUT
INPUT PULSE LONGER
THAN GLITCH FILTER TIMEOUT
PROGRAMMED
TIMEOUT
PROGRAMMED
TIMEOUT
INPUT
INPUT
The hysteresis value is given by
V
HYST = VR × NTHRESH/255
t0
tGF
t0
tGF
where:
V
HYST is the desired hysteresis voltage.
NTHRESH is the decimal value of the 5-bit hysteresis code.
Note that NTHRESH has a maximum value of 31. The maximum
hysteresis for the ranges is listed in Table 6.
OUTPUT
OUTPUT
INPUT GLITCH FILTERING
t0
tGF
t0
tGF
Figure 22. Input Glitch Filter Function
The final stage of the SFDs is a glitch filter. This block provides
time-domain filtering on the output of the SFD comparators,
which allows the user to remove any spurious transitions such
as supply bounce at turn-on. The glitch filter function is in addition
to the digitally programmable hysteresis of the SFD comparators.
The glitch filter timeout is programmable up to 100 μs.
RANGE
SELECT
ULTRA
LOW
OV
COMPARATOR
+
–
VPx
GLITCH
FILTER
FAULT
OUTPUT
VREF
+
–
LOW
MID
UV
FAULT TYPE
SELECT
COMPARATOR
Figure 23. Supply Fault Detector Block
Table 6. Input Functions, Thresholds, and Ranges
Input Function
Voltage Range (V)
Maximum Hysteresis
425 mV
1.02 V
Voltage Resolution (mV)
Glitch Filter (μs)
VH
High voltage analog input
Positive analog input
2.5 to 6.0
13.7
32.9
0 to 100
0 to 100
0 to 100
0 to 100
0 to 100
0 to 100
0 to 100
6.0 to 14.4
0.573 to 1.375
1.25 to 3.00
2.5 to 6.0
VPx
97.5 mV
212 mV
425 mV
3.14
6.8
13.7
VXx
High-Z analog input
Digital input
0.573 to 1.375
0 to 5.0
97.5 mV
Not applicable
3.14
Not applicable
Rev. A | Page 15 of 36
ADM1169
Data Sheet
SUPPLY SUPERVISION WITH VXx INPUTS
VXx PINS AS DIGITAL INPUTS
The VXx inputs have two functions. They can be used as either
supply fault detectors or digital logic inputs. When selected as
analog (SFD) inputs, the VXx pins have functionality that is very
similar to the VH and VPx pins. The primary difference is that the
VXx pins have only one input range: 0.573 V to 1.375 V. Therefore,
these inputs can directly supervise only the very low supplies.
However, the input impedance of the VXx pins is high, allowing
an external resistor divide network to be connected to the pin.
Thus, potentially any supply can be divided down into the input
range of the VXx pin and supervised. This enables the ADM1169
to monitor other supplies, such as + 2 4 V, + 4 8 V, a n d − 5 V.
As described in the Supply Supervision with VXx Inputs section,
the VXx input pins on the ADM1169 have dual functionality.
The second function is as a digital logic input to the device.
Therefore, the ADM1169 can be configured for up to four digital
inputs. These inputs are TTL-/CMOS-compatible inputs. Standard
logic signals can be applied to the pins: RESET from reset generators,
PWRGD signals, fault flags, manual resets, and so on. These
signals are available as inputs to the SE and, therefore, can be
used to control the status of the PDOs. The inputs can be
configured to detect either a change in level or an edge.
When configured for level detection, the output of the digital
block is a buffered version of the input. When configured for
edge detection, a pulse of programmable width is output from
the digital block when the logic transition is detected. The
width is programmable from 0 µs to 100 µs.
An additional supply supervision function is available when the
VXx pins are selected as digital inputs. In this case, the analog
function is available as a second detector on each of the dedicated
analog inputs, VPx and VH. The analog function of VX1 is mapped
to VP1, VX2 is mapped to VP2, and so on. VX4 is mapped to
VH. In this case, these SFDs can be viewed as secondary or
warning SFDs.
The digital blocks feature the same glitch filter function that is
available on the SFDs. This enables the user to ignore spurious
transitions on the inputs. For example, the filter can be used to
debounce a manual reset switch.
The secondary SFDs are fixed to the same input range as the
primary SFDs. They are used to indicate warning levels rather
than failure levels. This allows faults and warnings to be generated
on a single supply using only one pin. For example, if VP1 is set
to output a fault when a 3.3 V supply drops to 3.0 V, VX1 can be set
to output a warning at 3.1 V. Warning outputs are available for
readback from the status registers. They are also OR’ed together
and fed into the SE, allowing warnings to generate interrupts on
the PDOs. Therefore, in this example, if the supply drops to 3.1 V,
a warning is generated, and remedial action can be taken before
the supply drops out of tolerance.
When configured as digital inputs, each VXx pin has a weak
(10 µA) pull-down current source available for placing the input
into a known condition, even if left floating. The current source,
if selected, weakly pulls the input to GND.
VXx
+
(DIGITAL INPUT)
TO
GLITCH
FILTER
SEQUENCING
ENGINE
DETECTOR
–
DIGITIAL THRESHOLD = 1.4V
Figure 24. VXx Digital Input Function
Rev. A | Page 16 of 36
Data Sheet
OUTPUTS
ADM1169
SUPPLY SEQUENCING THROUGH CONFIGURABLE
OUTPUT DRIVERS
The data driving each of the PDOs can come from one of three
sources. The source can be enabled in the PDOxCFG configuration
register (see the AN-721 Application Note for details).
Supply sequencing is achieved with the ADM1169 using the
programmable driver outputs (PDOs) on the device as control
signals for supplies. The output drivers can be used as logic
enables or as FET drivers.
The data sources are as follows:
•
•
Output from the SE.
Directly from the SMBus. A PDO can be configured so that
the SMBus has direct control over it. This enables software
control of the PDOs. Therefore, a microcontroller can be
used to initiate a software power-up/power-down sequence.
On-chip clock. A 100 kHz clock is generated on the device.
This clock can be made available on any of the PDOs. It can be
used, for example, to clock an external device such as an LED.
The sequence in which the PDOs are asserted (and, therefore,
the supplies are turned on) is controlled by the SE. The SE
determines what action is taken with the PDOs based on the
condition of the ADM1169 inputs. Therefore, the PDOs can be
set up to assert when the SFDs are in tolerance, the correct input
signals are received on the VXx digital pins, and no warnings
are received from any of the inputs of the devices. The PDOs
can be used for a variety of functions. The primary function is
to provide enable signals for LDOs or dc-to-dc converters that
generate supplies locally on a board. The PDOs can also be used
to provide a PWRGD signal when all the SFDs are in tolerance
or a RESET output if one of the SFDs goes out of specification
(this can be used as a status signal for a DSP, FPGA, or other
microcontroller).
•
DEFAULT OUTPUT CONFIGURATION
All of the internal registers in an unprogrammed ADM1169 device
from the factory are set to 0. Because of this, the PDOx pins are
pulled to GND by a weak (20 kΩ), on-chip, pull-down resistor.
As the input supply to the ADM1169 ramps up on VPx or VH,
all PDOx pins behave as follows:
•
•
Input supply = 0 V to 1.2 V. The PDOs are high impedance.
Input supply = 1.2 V to 2.7 V. The PDOs are pulled to GND
by a weak (20 kΩ), on-chip, pull-down resistor.
Supply > 2.7 V. Factory programmed devices continue to
pull all PDOs to GND by a weak (20 kΩ), on-chip, pull-down
resistor. Programmed devices download current EEPROM
configuration data, and the programmed setup is latched. The
PDO then goes to the state demanded by the configuration.
This provides a known condition for the PDOs during
power-up.
The PDOs can be programmed to pull up to a number of different
options. The outputs can be programmed as follows:
•
•
Open-drain (allowing the user to connect an external pull-up
resistor)
•
•
•
•
•
•
Open-drain with weak pull-up to VDD
Open-drain with strong pull-up to VDD
Open-drain with weak pull-up to VPx
Open-drain with strong pull-up to VPx.
Strong pull-down to GND
The internal pull-down can be overdriven with an external pull-up
of suitable value tied from the PDOx pin to the required pull-up
voltage. The 20 kΩ resistor must be accounted for in calculating
a suitable value. For example, if PDOx must be pulled up to 3.3 V,
and 5 V is available as an external supply, the pull-up resistor
value is given by
Internally charge-pumped high drive (12 V, PDO1 to
PDO6 only)
The last option (available only on PDO1 to PDO6) allows the
user to directly drive a voltage high enough to fully enhance an
external NFET, which is used to isolate, for example, a card-side
voltage from a backplane supply (a PDO can sustain greater than
10.5 V into a 1 µA load). The pull-down switches can also be
used to drive status LEDs directly.
3.3 V = 5 V × 20 kΩ/(RUP + 20 kΩ)
Therefore,
R
UP = (100 kΩ − 66 kΩ)/3.3 V = 10 kΩ
VFET (PDO1 TO PDO6 ONLY)
V
DD
VP4
VP1
SEL
CFG4 CFG5 CFG6
SE DATA
SMBus DATA
CLK DATA
PDO
Figure 25. Programmable Driver Output
Rev. A | Page 17 of 36
ADM1169
Data Sheet
SEQUENCING ENGINE
OVERVIEW
MONITOR
FAULT
The ADM1169 SE provides the user with powerful and flexible
control of sequencing. The SE implements a state machine control
of the PDO outputs, with state changes conditional on input
events. SE programs can enable complex control of boards such
as power-up and power-down sequence control, fault event
handling, and interrupt generation on warnings. A watchdog
function that verifies the continued operation of a processor
clock can be integrated into the SE program. The SE can also be
controlled via the SMBus, giving software or firmware control
of the board sequencing.
STATE
TIMEOUT
SEQUENCE
Figure 26. State Cell
The ADM1169 offers up to 63 state definitions. The signals
monitored to indicate the status of the input pins are the
outputs of the SFDs.
The SE state machine comprises 63 state cells. Each state has the
following attributes:
WARNINGS
The SE also monitors warnings. These warnings can be generated
when the ADC readings violate their limit register value or when
the secondary voltage monitors on VPx and VH are triggered.
The warnings are OR’ed together and are available as a single
warning input to each of the three blocks that enable exiting
a state.
•
It monitors signals indicating the status of the eight input
pins: VP1 to VP3, VH, and VX1 to VX4.
•
•
It can be entered from any other state.
Three exit routes move the state machine onto a next state:
sequence detection, fault monitoring, and timeout.
Delay timers for the sequence and timeout blocks can be
programmed independently and changed with each state
change. The range of timeouts is from 0 ms to 400 ms.
Output condition of the eight PDO pins is defined and
fixed within a state.
It transitions from one state to the next in less than 20 µs,
which is the time needed to download a state definition
from EEPROM to the SE.
•
SMBus JUMP (UNCONDITIONAL JUMP)
The SE can be forced to advance to the next state unconditionally.
This enables the user to force the SE to advance. Examples of
the use of this feature include moving to a margining state or
debugging a sequence. The SMBus jump or go-to command
can be seen as another input to sequence and timeout blocks to
provide an exit from each state.
•
•
•
It can trigger a write of the black box fault and status
registers into the black box section of EEPROM.
Table 7. Sample Sequence State Entries
State
IDLE1
IDLE2
EN3V3
Sequence
Timeout
Monitor
If VX1 is low, go to State IDLE2.
If VP1 is okay, go to State EN3V3.
If VP2 is okay, go to State EN2V5.
If VP2 is not okay after 10 ms,
go to State DIS3V3.
If VP1 is not okay, go to State IDLE1.
DIS3V3
EN2V5
If VX1 is high, go to State IDLE1.
If VP3 is okay, go to State PWRGD.
If VP3 is not okay after 20 ms,
go to State DIS2V5.
If VP1 or VP2 is not okay, go to State FSEL2.
DIS2V5
FSEL1
FSEL2
If VX1 is high, go to State IDLE1.
If VP3 is not okay, go to State DIS2V5.
If VP2 is not okay, go to State DIS3V3.
If VX1 is high, go to State DIS2V5.
If VP1 or VP2 is not okay, go to State FSEL2.
If VP1 is not okay, go to State IDLE1.
If VP1, VP2, or VP3 is not okay, go to State FSEL1.
PWRGD
Rev. A | Page 18 of 36
Data Sheet
ADM1169
If a timer delay is specified, the input to the sequence detector
must remain in the defined state for the duration of the timer
delay. If the input changes state during the delay, the timer is reset.
SEQUENCING ENGINE APPLICATION EXAMPLE
The application in this section demonstrates the operation of
the SE. Figure 28 shows how the simple building block of a
single SE state can be used to build a power-up sequence for
a three-supply system. Table 8 lists the PDO outputs for each
state in the same SE implementation. In this system, a good 5 V
supply on the VP1 pin and the VX1 pin held low are the triggers
required to start a power-up sequence. The sequence next turns
on the 3.3 V supply, then the 2.5 V supply (assuming successful
turn-on of the 3.3 V supply). When all three supplies have turned
on correctly, the PWRGD state is entered, where the SE remains
until a fault occurs on one of the three supplies, or until it is
instructed to go through a power-down sequence by VX1
going high.
The sequence detector can also help to identify monitoring faults.
In the sample application shown in Figure 28, the FSEL1 and
FSEL2 states first identify which of the VP1, VP2, or VP3 pins
has faulted, and then they take appropriate action.
SEQUENCE
STATES
IDLE1
VX1 = 0
Faults are dealt with throughout the power-up sequence on a
case-by-case basis. The following three sections (the Sequence
Detector section, the Monitoring Fault Detector section, and
the Timeout Detector section) describe the individual blocks
and use the sample application shown in Figure 28 to demonstrate
the actions of the state machine.
IDLE2
VP1 = 1
MONITOR FAULT
STATES
TIMEOUT
STATES
EN3V3
10ms
VP1 = 0
Sequence Detector
VP2 = 1
The sequence detector block is used to detect when a step in a
sequence has been completed. It looks for one of the SE inputs
to change state, and it is most often used as the gate for successful
progress through a power-up or power-down sequence. A timer
block that is included in this detector can insert delays into a
power-up or power-down sequence, if required. Timer delays
can be set from 10 µs to 400 ms. Figure 27 is a block diagram of
the sequence detector.
EN2V5
DIS3V3
20ms
(VP1 + VP2) = 0
VX1 = 1
VP3 = 1
PWRGD
DIS2V5
VP2 = 0
(VP1 + VP2 + VP3) = 0
VX1 = 1
VX1 = 1
FSEL1
(VP1 +
VP2) = 0
SUPPLY FAULT
DETECTION
VP1
VP3 = 0
SEQUENCE
DETECTOR
FSEL2
VP1 = 0
LOGIC INPUT CHANGE
VX4
OR FAULT DETECTION
VP2 = 0
TIMER
WARNINGS
INVERT
Figure 28. Sample Application Flow Diagram
FORCE FLOW
(UNCONDITIONAL JUMP)
SELECT
Figure 27. Sequence Detector Block Diagram
Table 8. PDO Outputs for Each State
PDO Outputs
PDO1 = 3V3ON
PDO2 = 2V5ON
PDO3 = FAULT
IDLE1
IDLE2
EN3V3
EN2V5
DIS3V3
DIS2V5
PWRGD
FSEL1
FSEL2
0
0
0
0
0
0
1
0
0
1
1
0
0
1
1
1
0
1
1
1
0
1
1
1
1
1
1
Rev. A | Page 19 of 36
ADM1169
Data Sheet
Monitoring Fault Detector
FAULT AND STATUS REPORTING
The monitoring fault detector block is used to detect a failure on an
input. The logical function implementing this is a wide OR gate
that can detect when an input deviates from its expected condition.
The clearest demonstration of the use of this block is in the
PWRGD state, where the monitor block indicates that a failure
on one or more of the VPx, VXx, or VH inputs has occurred.
The ADM1169 has a fault latch for recording faults. Two registers,
FSTAT1 and FSTAT2, are set aside for this purpose. A single bit
is assigned to each input of the device, and a fault on that input
sets the relevant bit. The contents of the fault register can be
read out over the SMBus to determine which input(s) faulted.
The fault register can be enabled/disabled in each state. To latch
data from one state, ensure that the fault latch is disabled in the
following state. This ensures that only real faults are captured
and not, for example, undervoltage conditions that may be present
during a power-up or power-down sequence.
No programmable delay is available in this block because the
triggering of a fault condition is likely to be caused by a supply
falling out of tolerance. In this situation, the device needs to react as
quickly as possible. Some latency occurs when moving out of
this state because it takes a finite amount of time (~20 µs) for the
state configuration to download from EEPROM into the SE.
Figure 29 is a block diagram of the monitoring fault detector.
The ADM1169 also has a number of status registers. These include
more detailed information, such as whether an undervoltage or
overvoltage fault is present on a particular input. The status
registers also include information on ADC limit faults.
MONITORING FAULT
DETECTOR
There are two sets of these registers with different behaviors. The
first set of status registers is not latched in any way and, therefore,
can change at any time in response to changes on the inputs.
These registers provide information such as the UV and OV
state of the inputs, the digital state of the GPI VXx inputs, and
also the ADC warning limit status.
1-BIT FAULT
DETECTOR
FAULT
SUPPLY FAULT
DETECTION
VP1
MASK
SENSE
The second set of registers update each time the sequence engine
changes state and are latched until the next state change. The
second set of registers provides the same information as the first
set, but in a more compact form. The reason for this is that these
registers are used by the black box feature when writing status
information for the previous state into EEPROM.
1-BIT FAULT
DETECTOR
FAULT
LOGIC INPUT CHANGE
OR FAULT DETECTION
VX4
MASK
SENSE
1-BIT FAULT
DETECTOR
See the AN-721 Application Note for full details about the
ADM1169 registers.
FAULT
WARNINGS
NONVOLATILE BLACK BOX FAULT RECORDING
MASK
A section of EEPROM, from Address 0xF900 to Address 0xF9FF, is
provided that by default can be used to store user-defined settings
and information. Part of this section of EEPROM, Address 0xF980
to Address 0xF9FF, can instead be used to store up to 16 fault records.
Figure 29. Monitoring Fault Detect or Block Diagram
Timeout Detector
The timeout detector allows the user to trap a failure to ensure
proper progress through a power-up or power-down sequence.
Any sequencing engine state can be designated as a black box write
state. Each time the sequence engine enters that state, a fault record
is written into EEPROM. The fault record provides a snapshot of
the entire ADM1169 state at the point in time when the last state
was exited, just prior to entering the designated black box write
state. A fault record contains the following information:
In the sample application shown in Figure 28, the timeout next-
state transition is from the EN3V3 and EN2V5 states. For the
EN3V3 state, the signal 3V3ON is asserted on the PDO1 output
pin upon entry to this state to turn on a 3.3 V supply.
•
•
A flag bit set to 0 after the fault record has been written.
The state number of the previous state prior to the fault
record write state.
Did a sequence, timeout, or monitor condition cause the
previous state to exit?
UVSTATx and OVSTATx input comparator status.
VXx GPISTAT status.
LIMSTATx status.
This supply rail is connected to the VP2 pin, and the sequence
detector looks for the VP2 pin to go above its undervoltage
threshold, which is set in the supply fault detector (SFD)
attached to that pin.
•
The power-up sequence progresses when this change is detected.
If, however, the supply fails (perhaps due to a short circuit over-
loading this supply), the timeout block traps the problem. In this
example, if the 3.3 V supply fails within 10 ms, the SE moves to
the DIS3V3 state and turns off this supply by bringing PDO1
low. It also indicates that a fault has occurred by taking PDO3
high. Timeout delays of 100 µs to 400 ms can be programmed.
•
•
•
•
A checksum byte.
Rev. A | Page 20 of 36
Data Sheet
ADM1169
Each fault record contains eight bytes, with each byte taking
typically about 250 µs to write to EEPROM, for a total write
time of about 2 ms. After the black box begins to write a fault
record into EEPROM, the ADM1169 ensures that is complete
before attempting to write any additional fault records. This
means that if consecutive sequencing engine states are designated
as black box write states, then a time delay must be used in the
first state to ensure that the fault record is written before moving to
the next state.
BLACK BOX WRITES WITH NO EXTERNAL SUPPLY
In cases where all the input supplies fail, for example, if the card
has been removed from a powered backplane, the state machine
can be programmed to trigger a write into the black box EEPROM.
The decoupling capacitors on the rail that power the ADM1169
and other loads on the board form an energy reservoir. Depending
on the other loads on the board and their behavior as the supply
rails drop, there may be sufficient energy in the decoupling
capacitors to allow the ADM1169 to write a complete fault
record (eight bytes of data).
When the ADM1169 powers on initially, it performs a search to
find the first fault record that has not been written to. It does this by
checking the flag bit in each fault record until it finds one where
the flag bit is 1. The first fault record is stored at Address 0xF980,
and at multiples of eight bytes after that, with the last record
stored at Address 0xF9F8.
Typically, it takes 2 ms to write to the eight bytes of a fault record. If
the ADM1169 is powered using a 12 V supply on the VH pin, then
a UV threshold at 6 V can be set and used as the state machine
trigger to start writing a fault record to EEPROM. The higher the
threshold is, the earlier the black box write begins, and the more
energy available in the decoupling capacitors to ensure it completes
successfully.
The fault recorder is only able to write in the EEPROM. It is
not able to erase the EEPROM prior to writing the fault record.
Therefore, to ensure correct operation, it is important that the fault
record EEPROM is erased prior to use. When all the EEPROM
locations for the fault records are used, no more fault records are
written. This ensures that the first fault in any cascading fault is
stored and not overwritten and lost.
Provided the VH supply, or another supply connected to a VPx pin,
remains above 3.0 V during the time to write, the entire fault record
is always written to the EEPROM. In many cases, there should be
sufficient decoupling capacitors on a board to power the
ADM1169 as it writes into the EEPROM.
To avoid the fault recorder filling up and fault records being lost, an
application can periodically poll the ADM1169 to determine if there
are fault records to be read. Alternatively, one of the PDOx outputs
can be used to generate an interrupt for a processor in the fault
record write state to signal the need to come and read one or more
fault records.
In cases where the decoupling capacitors are not able to supply
sufficient energy after the board is removed to ensure a complete
fault record is written, the value of the capacitor on VDDCAP
may be increased. In the worst case, assuming that no energy is
supplied to the ADM1169 by the external decoupling capacitors,
but that VDDCAP has 4.75 V on it, then a 47 µF is sufficient to
guarantee that a single complete black box record can be written
to the EEPROM.
After reading fault records during normal operation, two things
must be done before the fault recorder is able to reuse the
EEPROM locations. First, the EEPROM section must be erased.
The fault recorder must then be reset so that it performs its search
again for the first unused location of EEPROM that is available to
store a fault record.
Rev. A | Page 21 of 36
ADM1169
Data Sheet
VOLTAGE READBACK
The ADM1169 has an on-board, 12-bit, accurate ADC for voltage
readback over the SMBus. The ADC has an 8-channel analog
mux on the front end. The eight channels consist of the eight
SFD inputs (VH, VPx, and VXx). Any or all of these inputs can be
selected to be read, in turn, by the ADC. The circuit controlling
this operation is called the round-robin circuit. This circuit can be
selected to run through its loop of conversions once or continuously.
Averaging is also provided for each channel. In this case, the
round-robin circuit runs through its loop of conversions 16 times
before returning a result for each channel. At the end of this
cycle, the results are written to the output registers.
Table 9. ADC Input Voltage Ranges
SFD Input
ADC Input
Attenuation Factor Voltage Range (V)
Range (V)
0.573 to 1.375
1.25 to 3.00
2.5 to 6.0
1
0 to 2.048
0 to 4.46
0 to 6.01
2.181
4.363
10.472
6.0 to 14.4
0 to 14.41
1 The upper limit is the absolute maximum allowed voltage on the VPx and
VH pins.
The typical way to supply the reference to the ADC on the
REFIN pin is to connect the REFOUT pin to the REFIN pin.
REFOUT provides a 2.048 V reference. As such, the supervising
range covers less than half the normal ADC range. It is possible,
however, to provide the ADC with a more accurate external
reference for improved readback accuracy.
The ADC samples single-sided inputs with respect to the AGND
pin. A 0 V input produces Code 0, and an input equal to the
voltage on REFIN produces full code (4095 decimal).
The inputs to the ADC come directly from the VXx pins and from
the back of the input attenuators on the VPx and VH pins,
as shown in Figure 30 and Figure 31.
Supplies can also be connected to the input pins purely for ADC
readback, even though these pins may go above the expected
supervisory range limits (but not above the absolute maximum
ratings on these pins). For example, a 1.5 V supply connected
to the VX1 pin can be correctly read out as an ADC code of
approximately ¾ full scale, but it always sits above any supervisory
limits that can be set on that pin. The maximum setting for the
REFIN pin is 2.048 V.
DIGITIZED
VOLTAGE
READING
NO ATTENUATION
12-BIT
ADC
VXx
2.048V VREF
Figure 30. ADC Reading on VXx Pins
SUPPLY SUPERVISION WITH THE ADC
In addition to the readback capability, another level of supervision
is provided by the on-chip, 12-bit ADC. The ADM1169 has
limit registers with which the user can program a maximum or
minimum allowable threshold. Exceeding the threshold generates
a warning that can either be read back from the status registers
or input into the SE to determine what sequencing action the
ADM1169 should take. Only one register is provided for each
input channel. Therefore, either an undervoltage threshold or
overvoltage threshold (but not both) can be set for a given channel.
The round-robin circuit can be enabled via an SMBus write, or
it can be programmed to turn on in any state in the SE program.
For example, it can be set to start after a power-up sequence is
complete, and all supplies are known to be within expected
tolerance limits.
ATTENUATION NETWORK
VPx/VH
(DEPENDS ON RANGE SELECTED)
DIGITIZED
VOLTAGE
READING
12-BIT
ADC
2.048V VREF
Figure 31. ADC Reading on VPx/VH Pins
The voltage at the input pin can be derived from the following
equation:
ADCCode
V =
× Attenuation Factor × VREFIN
4095
where VREFIN = 2.048 V when the internal reference is used (that is,
the REFIN pin is connected to the REFOUT pin).
Note that a latency is built into this supervision, dictated by the
conversion time of the ADC. With all 12 channels selected, the
total time for the round-robin operation (averaging off) is approx-
imately 6 ms (500 µs per channel selected). Supervision using
the ADC, therefore, does not provide the same real-time response
as the SFDs.
The ADC input voltage ranges for the SFD input ranges are
listed in Table 9.
Rev. A | Page 22 of 36
Data Sheet
ADM1169
SUPPLY MARGINING
to fall to compensate for this. The dc-to-dc converter output can be
forced high by setting the DACx output voltage lower than the
feedback node voltage. The series resistor can be split in two, and
the node between them can be decoupled with a capacitor to
ground. This can help to decouple any noise picked up from the
board. Decoupling to a ground local to the dc-to-dc converter is
recommended.
OVERVIEW
It is often necessary for the system designer to adjust supplies,
either to optimize their level or force them away from nominal
values to characterize the system performance under these
conditions. This is a function typically performed during an
in-circuit test (ICT), such as when a manufacturer wants to
guarantee that a product under test functions correctly at
nominal supplies minus 10%.
The ADM1169 can be commanded to margin a supply up or
down over the SMBus by updating the values on the relevant
DAC output.
OPEN-LOOP SUPPLY MARGINING
The simplest method of margining a supply is to implement an
open-loop technique (see Figure 32). A popular way to do this
is to switch extra resistors into the feedback node of a power
module, such as a dc-to-dc converter or low dropout regulator
(LDO). The extra resistor alters the voltage at the feedback or
trim node and forces the output voltage to margin up or down
by a certain amount.
CLOSED-LOOP SUPPLY MARGINING
A more accurate and comprehensive method of margining is to
implement a closed-loop system (see Figure 33). The voltage on
the rail to be margined can be read back to accurately margin the
rail to the target voltage. The ADM1169 incorporates all the
circuits required to do this, with the 12-bit successive
approximation ADC used to read back the level of the
supervised voltages, and the six voltage output DACs,
implemented as described in the Open-Loop Supply Margining
section, used to adjust supply levels. These circuits can be used
along with other intelligence, such as a microcontroller, to
implement a closed-loop margining system that allows any dc-to-
dc converter or LDO supply to be set to any voltage, accurate to
within 0.5% of the target.
The ADM1169 can perform open-loop margining for up to four
supplies. The four on-board voltage DACs (DAC1 to DAC4) can
drive into the feedback pins of the power modules to be margined.
The simplest circuit to implement this function is an attenuation
resistor that connects the DACx pin to the feedback node of a
dc-to-dc converter. When the DACx output voltage is set equal
to the feedback voltage, no current flows into the attenuation
resistor, and the dc-to-dc converter output voltage does not change.
Taking DACx above the feedback voltage forces current into the
feedback node, and the output of the dc-to-dc converter is forced
VIN
MICROCONTROLLER
ADM1169
V
OUT
DEVICE
CONTROLLER
(SMBus)
OUTPUT
DC-TO-DC
ATTENUATION
RESISTOR, R3
CONVERTER
R1
R2
DACx
FEEDBACK
DAC
PCB
GND
TRACE NOISE
DECOUPLING
CAPACITOR
Figure 32. Open-Loop Margining System Using the ADM1169
MICROCONTROLLER
VIN
ADM1169
MUX
VH/VPx/VXx
DACx
DC-TO-DC
CONVERTER
ADC
DAC
ATTENUATION
RESISTOR, R3
OUTPUT
FEEDBACK
GND
DEVICE
CONTROLLER
(SMBus)
R1
R2
PCB
TRACE NOISE
DECOUPLING
CAPACITOR
Figure 33. Closed-Loop Margining System Using the ADM1169
Rev. A | Page 23 of 36
ADM1169
Data Sheet
To implement closed-loop margining,
CHOOSING THE SIZE OF THE ATTENUATION
RESISTOR
1. Disable the four DACx outputs.
2. Set the DAC output voltage equal to the voltage on the
feedback node.
3. Enable the DAC.
The size of the attenuation resistor, R3, determines how much
the DAC voltage swing affects the output voltage of the dc-to-dc
converter that is being margined (see Figure 33).
4. Read the voltage at the dc-to-dc converter output that is
connected to one of the VPx, VH, or VXx pins.
5. If necessary, modify the DACx output code up or down to
adjust the dc-to-dc converter output voltage. Otherwise,
stop because the target voltage has been reached.
6. Set the DAC output voltage to a value that alters the supply
output by the required amount (for example, 5%).
7. Repeat Step 4 through Step 6 until the measured supply
reaches the target voltage.
Because the voltage at the feedback pin remains constant, the
current flowing from the feedback node to GND through R2 is
a constant. In addition, the feedback node itself is high impedance.
This means that the current flowing through R1 is the same as
the current flowing through R3. Therefore, a direct relationship
exists between the extra voltage drop across R1 during margining
and the voltage drop across R3.
This relationship is given by
R1
R3
Step 1 to Step 3 ensures that when the DACx output buffer is
turned on, it has little effect on the dc-to-dc converter output. The
DAC output buffer is designed to power up without glitching by
first powering up the buffer to follow the pin voltage. It does not
drive out onto the pin at this time. When the output buffer is
properly enabled, the buffer input is switched over to the DAC,
and the output stage of the buffer is turned on. Output glitching
is negligible.
ΔVOUT
=
(VFB − VDACOUT)
where:
ΔVOUT is the change in VOUT
VFB is the voltage at the feedback node of the dc-to-dc converter.
DACOUT is the voltage output of the margining DAC.
.
V
This equation demonstrates that if the user wants the output
voltage to change by 300 mV, then R1 = R3. If the user wants
the output voltage to change by 600 mV, R1 = 2 × R3, and so on.
WRITING TO THE DACS
It is best to use the full DAC output range to margin a supply.
Choosing the attenuation resistor in this way provides the most
resolution from the DAC, meaning that with one DAC code
change, the smallest effect on the dc-to-dc converter output
voltage is induced. If the resistor is sized up to use a code such
as 27 decimal to 227 decimal to move the dc-to-dc converter
output by 5%, it takes 100 codes to move 5% (each code moves
the output by 0.05%). This is beyond the readback accuracy of
the ADC, but it should not prevent the user from building a
circuit to use the most resolution.
Four DAC ranges are offered. They can be placed with midcode
(Code 0x7F) at 0.6 V, 0.8 V, 1.0 V, and 1.25 V. These voltages are
placed to correspond to the most common feedback voltages.
Centering the DAC outputs in this way provides the best use of
the DAC resolution. For most supplies, it is possible to place the
DAC midcode at the point where the dc-to-dc converter output
is not modified, thereby giving half of the DAC range to margin
up and the other half to margin down.
The DAC output voltage is set by the code written to the DACx
register. The voltage is linear with the unsigned binary number
in this register. Code 0x7F is placed at the midcode voltage, as
described previously. The output voltage is given by
DAC LIMITING AND OTHER SAFETY FEATURES
Limit registers (called DPLIMx and DNLIMx) on the device
offer the user some protection from firmware bugs that can
cause catastrophic board problems by forcing supplies beyond
their allowable output ranges. Essentially, the DAC code written
into the DACx register is clipped such that the code used to set
the DAC voltage is given by
DAC Output = (DACx − 0x7F)/255 × 0.6015 + VOFF
where VOFF is one of the four offset voltages.
There are 256 DAC settings available. The midcode value is
located at DAC Code 0x7F, as close as possible to the middle
of the 256 code range. The full output swing of the DACs is
+302 mV (+128 codes) and −300 mV (−127 codes) around the
selected midcode voltage. The voltage range for each midcode
voltage is shown in Table 10.
DAC Code
= DACx, DACx ≥ DNLIMx and DACx ≤ DPLIMx
= DNLIMx,
= DPLIMx,
DACx < DNLIMx
DACx > DPLIMx
In addition, the DAC output buffer is three-stated if DNLIMx >
DPLIMx. By programming the limit registers this way, the user
can make it very difficult for the DAC output buffers to be turned
on during normal system operation. The limit registers are among
the registers downloaded from EEPROM at startup.
Table 10. Ranges for Midcode Voltages
Midcode
Voltage (V)
Minimum Voltage
Output (V)
Maximum Voltage
Output (V)
0.6
0.8
1.0
1.25
0.300
0.500
0.700
0.950
0.902
1.102
1.302
1.552
Rev. A | Page 24 of 36
Data Sheet
ADM1169
APPLICATIONS DIAGRAM
12V IN
5V IN
3V IN
12V OUT
5V OUT
3V OUT
IN
DC-TO-DC1
EN
OUT
3.3V OUT
VH
ADM1169
PDO1
PDO2
5V OUT
3V OUT
3.3V OUT
VP1
VP2
VP3
IN
DC-TO-DC2
EN OUT
PDO3
PDO4
PDO5
1.25V OUT
1.25V OUT
1.2V OUT
0.9V OUT
VX1
VX2
VX3
PWRGD
PDO6
PDO7
SYSTEM RESET
IN
DC-TO-DC3
EN OUT
POWRON
1.2V OUT
0.9V OUT
VX4
PDO8
DAC1
3.3V OUT
IN
REFOUT
REFIN VCCP VDDCAP GND
OUT
10µF 10µF 10µF
EN
TRIM
DC-TO-DC4
*ONLY ONE MARGINING CIRCUIT
SHOWN FOR CLARITY. DAC1 TO DAC4
ALLOW MARGINING FOR UP TO
FOUR VOLTAGE RAILS.
Figure 34. Applications Diagram
Rev. A | Page 25 of 36
ADM1169
Data Sheet
COMMUNICATING WITH THE ADM1169
The ADM1169 provides several options that allow the user to
update the configuration over the SMBus interface. The following
three options are controlled in the UPDCFG register.
CONFIGURATION DOWNLOAD AT POWER-UP
The configuration of the ADM1169 (undervoltage/overvoltage
thresholds, glitch filter timeouts, and PDO configurations) is
dictated by the contents of the RAM. The RAM comprises
digital latches that are local to each of the functions on the device.
The latches are double-buffered and have two identical latches,
Latch A and Latch B. Therefore, when an update to a function
occurs, the contents of Latch A are updated first, and then the
contents of Latch B are updated with identical data. The advantages
of this architecture are explained in detail in the Updating the
Configuration section.
Option 1
Update the configuration in real time. The user writes to the RAM
across the SMBus, and the configuration is updated immediately.
Option 2
Update the Latch As without updating the Latch Bs. With this
method, the configuration of the ADM1169 remains unchanged
and continues to operate in the original setup until the instruction
is given to update the Latch Bs.
The two latches are volatile memory and lose their contents at
power-down. Therefore, the configuration in the RAM must be
restored at power-up by downloading the contents of the EEPROM
(nonvolatile memory) to the local latches. This download occurs
in steps, as follows:
Option 3
Change the EEPROM register contents without changing the RAM
contents, and then download the revised EEPROM contents to the
RAM registers. With this method, the configuration of the
ADM1169 remains unchanged and continues to operate in the
original setup until the instruction is given to update the RAM.
1. With no power applied to the device, the PDOs are all high
impedance.
2. When 1.2 V appears on any of the inputs connected to the
VDD arbitrator (VH or VPx), the PDOs are all weakly pulled
to GND with a 20 kΩ resistor.
3. When the supply rises above the undervoltage lockout of
the device (UVLO is 2.5 V), the EEPROM starts to
download to the RAM.
4. The EEPROM downloads its contents to all Latch As.
5. When the contents of the EEPROM are completely
downloaded to the Latch As, the device controller signals
all Latch As to download to all Latch Bs simultaneously,
completing the configuration download.
6. At 0.5 ms after the configuration download completes, the
first state definition is downloaded from the EEPROM
into the SE.
The instruction to download from the EEPROM in the Option 3
section is also a useful way to restore the original EEPROM
contents if revisions to the configuration are unsatisfactory. For
example, if the user needs to alter an overvoltage threshold, the
RAM register can be updated, as described in the Option 1
section. However, if the user is not satisfied with the change and
wants to revert to the original programmed value, the device
controller can issue a command to download the EEPROM
contents to the RAM again, as described in the Option 3
section, restoring the ADM1169 to its original configuration.
The topology of the ADM1169 makes this type of operation
possible. The local, volatile registers (RAM) are all double-buffered
latches. Setting Bit 0 of the UPDCFG register to 1 leaves the
double buffered latches open at all times, allowing the registers
to be updated continuously as they are written to. If Bit 0 is set to
0 when a RAM write occurs across the SMBus, only the first side
of the double-buffered latch is written to. The user must then
write a 1 to Bit 1 of the UPDCFG register. This generates a pulse
to update all the second latches at once. EEPROM writes occur
in a similar way.
Note that any attempt to communicate with the device prior to
the completion of the download causes the ADM1169 to issue
a no acknowledge (NACK).
UPDATING THE CONFIGURATION
After power-up, with all the configuration settings loaded from
the EEPROM into the RAM registers, the user may need to alter
the configuration of functions on the ADM1169, such as changing
the undervoltage or overvoltage limit of an SFD, changing the
fault output of an SFD, or adjusting the rise time delay of one
of the PDOs.
The final bit in this register can enable or disable EEPROM page
erasure. If this bit is set high, the contents of an EEPROM page can
all be set to 1. If this bit is set low, the contents of a page cannot be
erased, even if the command code for page erasure is programmed
across the SMBus. The bit map for the UPDCFG register is shown
in the AN-721 Application Note. A flow diagram for download at
power-up and subsequent configuration updates is shown in
Figure 35.
Rev. A | Page 26 of 36
Data Sheet
ADM1169
SMBus
POWER-UP
CC
DEVICE
(V > 2.5V)
CONTROLLER
E
E
P
R
O
M
L
R
A
M
L
U
P
D
D
A
T
D
A
LATCH A
LATCH B
FUNCTION
(OV THRESHOLD
ON VP1)
D
EEPROM
Figure 35. Configuration Update Flow Diagram
UPDATING THE SEQUENCING ENGINE
The major differences between the EEPROM and other
registers are as follows:
SE functions are not updated in the same way as regular
configuration latches. The SE has its own dedicated 512-byte
EEPROM for storing state definitions, providing 63 individual
states, each with a 64-bit word (one state is reserved). At power-up,
the first state is loaded from the SE EEPROM into the engine
itself. When the conditions of this state are met, the next state is
loaded from the EEPROM into the engine and so on. The loading
of each new state takes approximately 10 µs.
•
An EEPROM location must be blank before it can be
written to. If it contains data, the data must first be erased.
Writing to the EEPROM is slower than writing to the RAM.
Writing to the EEPROM should be restricted because it has
a limited write/cycle life of typically 10,000 write operations,
due to the usual EEPROM wear-out mechanisms.
•
•
The first EEPROM is split into 16 (0 to 15) pages of 32 bytes each.
Page 0 to Page 4, from Address 0xF800 to Address 0xF89F, hold
the configuration data for the applications on the ADM1169
(such as the SFDs and PDOs). These EEPROM addresses are
the same as the RAM register addresses, prefixed by F8. Page 5
to Page 7, from Address 0xF8A0 to Address 0xF8FF, are reserved.
To alter a state, the required changes must be made directly to
the EEPROM. RAM for each state does not exist. The relevant
alterations must be made to the 64-bit word, which is then
uploaded directly to the EEPROM.
INTERNAL REGISTERS
Page 8 to Page 11 are available for customer use to store any
information that may be required by the customer in their
application. Customers can store information on Page 12 to
Page 15, or these pages can store the fault records written by the
sequencing engine if users have decided to enable writing of the
fault records for different states.
The ADM1169 contains a large number of data registers. The
principal registers are the address pointer register and the
configuration registers.
Address Pointer Register
The address pointer register contains the address that selects one
of the other internal registers. When writing to the ADM1169,
the first byte of data is always a register address that is written to
the address pointer register.
Data can be downloaded from the EEPROM to the RAM in one
of the following ways:
•
•
At power-up, when Page 0 to Page 4 are downloaded.
By setting Bit 0 of the UDOWNLD register (0xD8), which
performs a user download of Page 0 to Page 4.
Configuration Registers
The configuration registers provide control and configuration
for various operating parameters of the ADM1169. See the
AN-721 Application Note.
When the sequence engine is enabled, it is not possible to access
the section of EEPROM from Address 0xFA00 to Address 0xFBFF.
The sequence engine must be halted before it is possible to read or
write to this range. Attempting to read or write to this range if the
sequence engine is not halted generates a no acknowledge,
or NACK.
EEPROM
The ADM1169 has two 512-byte cells of nonvolatile, electrically
erasable, programmable read-only memory (EEPROM), from
Address 0xF800 to Register Address 0xFBFF. The EEPROM is
used for permanent storage of data that is not lost when the
ADM1169 is powered down. One EEPROM cell, 0xF800 to
0xF9FF, contains the configuration data, user information, and,
if enabled, any fault records of the device; the other section, 0xFA00
to 0xFBFF, contains the state definitions for the SE. Although
referred to as read-only memory, the EEPROM can be written to,
as well as read from, using the serial bus in exactly the same way
as the other registers.
Read/write access to the configuration and user EEPROM ranges
from Address 0xF800 to Address 0xF89F and Address 0xF900 to
Address 0xF9FF depends on whether the black box fault recorder is
enabled. If the fault recorder is enabled and one or more states
have been set as fault record trigger states, then it is not possible to
access any EEPROM location in this range without first halting
the black box. Attempts to read or write to this EEPROM range
while the fault recorder is operating are acknowledged by the
device but do not return any useful data or modify the EEPROM
in any way.
Rev. A | Page 27 of 36
ADM1169
Data Sheet
If none of the states are set as fault record trigger states, then the
black box is considered disabled, and read/write access is allowed
without having to halt the black box fault recorder.
The general SMBus protocol operates in the following three steps.
Step 1
The master initiates data transfer by establishing a start condition,
defined as a high-to-low transition on the serial data line SDA,
while the serial clock line SCL remains high. This indicates that
a data stream follows. All slave peripherals connected to the serial
bus respond to the start condition and shift in the next eight bits,
SERIAL BUS INTERFACE
The ADM1169 is controlled via the serial system management
bus (SMBus) and is connected to this bus as a slave device,
under the control of a master device. It takes approximately
1 ms after power-up for the ADM1169 to download from its
EEPROM. Therefore, access to the ADM1169 is restricted until
the download is complete.
W
consisting of a 7-bit slave address (MSB first) plus an R/ bit.
This bit determines the direction of the data transfer, that is,
whether data is written to or read from the slave device (0 = write,
1 = read).
Identifying the ADM1169 on the SMBus
The peripheral whose address corresponds to the transmitted
address responds by pulling the data line low during the low period
before the ninth clock pulse, known as the acknowledge bit, and
by holding it low during the high period of this clock pulse.
The ADM1169 has a 7-bit serial bus slave address (see Table 11).
The device is powered up with a default serial bus address. The
five MSBs of the address are set to 10011; the two LSBs are
determined by the logical states of Pin A1 and Pin A0. This
allows the connection of four ADM1169s to one SMBus.
All other devices on the bus remain idle while the selected device
W
waits for data to be read from or written to it. If the R/ bit is a 0,
Table 11. Serial Bus Slave Address
W
the master writes to the slave device. If the R/ bit is a 1, the
A1 Pin
A0 Pin
Hex Address
7-Bit Address1
1001100x
master reads from the slave device.
Low
Low
0x98
Low
High
High
High
Low
High
0x9A
0x9C
0x9E
1001101x
1001110x
1001111x
Step 2
Data is sent over the serial bus in sequences of nine clock pulses:
eight bits of data followed by an acknowledge bit from the slave
device. Data transitions on the data line must occur during the
low period of the clock signal and remain stable during the high
period because a low-to-high transition when the clock is high
may be interpreted as a stop signal. If the operation is a write
operation, the first data byte after the slave address is a command
byte. This command byte tells the slave device what to expect next.
It may be an instruction telling the slave device to expect a block
write, or it may be a register address that tells the slave where
subsequent data is to be written. Because data can flow in only
1 x = read/write bit. The address is shown only as the first seven MSBs.
The device also has several identification registers (read-only)
that can be read across the SMBus. Table 12 lists these registers
with their values and functions.
Table 12. Identification Register Values and Functions
Name
MANID 0xF4
REVID 0xF5
MARK1 0xF6
MARK2 0xF7
Address Value Function
0x41
0x10
0x00
0x00
Manufacturer ID for Analog Devices
Silicon revision
Software brand
W
one direction, as defined by the R/ bit, sending a command to
a slave device during a read operation is not possible. Before a read
operation, it may be necessary to perform a write operation to tell
the slave what sort of read operation to expect and/or the address
from which data is to be read.
Software brand
General SMBus Timing
Figure 36, Figure 37, and Figure 38 are timing diagrams for general
read and write operations using the SMBus. The SMBus specification
defines specific conditions for different types of read and write
operations, which are discussed in the Write Operations and
Read Operations sections.
Step 3
When all data bytes have been read or written, stop conditions
are established. In write mode, the master pulls the data line high
during the 10th clock pulse to assert a stop condition. In read
mode, the master device releases the SDA line during the low
period before the ninth clock pulse, but the slave device does not
pull it low. This is known as a no acknowledge. The master then
takes the data line low during the low period before the 10th clock
pulse and then high during the 10th clock pulse to assert a stop
condition.
Rev. A | Page 28 of 36
Data Sheet
ADM1169
1
9
1
9
SCL
1
0
0
1
1
A1
A0 R/W
D7
D6 D5 D4
D3 D2
D1
D0
SDA
ACK. BY
SLAVE
ACK. BY
SLAVE
START BY
MASTER
FRAME 1
SLAVE ADDRESS
FRAME 2
COMMAND CODE
1
9
1
9
SCL
(CONTINUED)
SDA
(CONTINUED)
D7 D6
D5 D4
D3 D2
D1
D7
D6 D5 D4
D3 D2
D1
D0
D0
STOP
BY
MASTER
ACK. BY
SLAVE
ACK. BY
SLAVE
FRAME 3
FRAME N
DATA BYTE
DATA BYTE
Figure 36. General SMBus Write Timing Diagram
1
9
1
9
SCL
SDA
1
0
0
1
1
A1
A0 R/W
D7
D6 D5 D4
D3 D2
D1
D0
ACK. BY
SLAVE
ACK. BY
MASTER
START BY
MASTER
FRAME 1
SLAVE ADDRESS
FRAME 2
DATA BYTE
1
9
1
9
SCL
(CONTINUED)
SDA
(CONTINUED)
D7 D6
D5 D4
D3 D2
D1
D7
D6 D5 D4
D3 D2
D1
D0
NO ACK.
D0
STOP
BY
MASTER
ACK. BY
MASTER
FRAME 3
FRAME N
DATA BYTE
DATA BYTE
Figure 37. General SMBus Read Timing Diagram
tR
tF
tHD;STA
tLOW
tHD;STA
tHD;DAT
SCL
SDA
tHIGH
tSU;STA
tSU;STO
tSU;DAT
tBUF
P
S
S
P
Figure 38. Serial Bus Timing Diagram
SMBus PROTOCOLS FOR RAM AND EEPROM
programmed location, the location contents must first be erased.
EEPROM erasure cannot be done at the byte level. The EEPROM
is arranged as 32 pages of 32 bytes each, and an entire page must
be erased.
The ADM1169 contains volatile registers (RAM) and nonvolatile
registers (EEPROM). User RAM occupies Address 0x00 to
Address 0xDF; and the EEPROM occupies Address 0xF800 to
Address 0xFBFF.
Page erasure is enabled by setting Bit 2 in the UPDCFG register
(Address 0x90) to 1. If this bit is not set, page erasure cannot occur,
even if the command byte (0xFE) is programmed across the SMBus.
Data can be written to and read from both the RAM and the
EEPROM as single data bytes. Data can be written only to
unprogrammed EEPROM locations. To write new data to a
Rev. A | Page 29 of 36
ADM1169
Data Sheet
WRITE OPERATIONS
The SMBus specification defines several protocols for different
types of read and write operations. The following abbreviations
are used in Figure 39 to Figure 47:
As soon as the ADM1169 receives the command byte, page
erasure begins. The master device can send a stop command
as soon as it sends the command byte. Page erasure takes
approximately 20 ms. If the ADM1169 is accessed before
erasure is complete, it responds with a no acknowledge
(NACK).
•
•
•
•
•
•
S = Start
P = Stop
R = Read
W = Write
A = Acknowledge
Write Byte/Word
In a write byte/word operation, the master device sends a command
byte and one or two data bytes to the slave device, as follows:
= No acknowledge
A
1. The master device asserts a start condition on SDA.
2. The master sends the 7-bit slave address followed by the
write bit (low).
The ADM1169 uses the following SMBus write protocols.
Send Byte
3. The addressed slave device asserts an ACK on SDA.
4. The master sends a command code.
5. The slave asserts an ACK on SDA.
6. The master sends a data byte.
7. The slave asserts an ACK on SDA.
8. The master sends a data byte (or asserts a stop condition).
9. The slave asserts an ACK on SDA.
10. The master asserts a stop condition on SDA to end the
transaction.
In a send byte operation, the master device sends a single
command byte to a slave device, as follows:
1. The master device asserts a start condition on SDA.
2. The master sends the 7-bit slave address followed by the
write bit (low).
3. The addressed slave device asserts an acknowledge (ACK)
on SDA.
4. The master sends a command code.
5. The slave asserts ACK on SDA.
6. The master asserts a stop condition on SDA and the
transaction ends.
In the ADM1169, the write byte/word protocol is used for the
following three purposes:
In the ADM1169, the send byte protocol is used for the following
two purposes:
•
To write a single byte of data to the RAM. In this case, the
command byte is RAM Address 0x00 to RAM Address 0xDF,
and the only data byte is the actual data, as shown in Figure 41.
•
To write a register address to the RAM for a subsequent
single byte read from the same address, or for a block read
or a block write starting at that address, as shown in Figure 39.
1
2
3
4
5
6
7
8
RAM
SLAVE
ADDRESS
S
W
A
ADDRESS
A
DATA
A
P
(0x00 TO 0xDF)
1
2
3
4
5
6
Figure 41. Single Byte Write to the RAM
RAM
SLAVE
ADDRESS
S
W
A
ADDRESS
A
P
(0x00 TO 0xDF)
•
To set up a 2-byte EEPROM address for a subsequent read,
write, block read, block write, or page erasure. In this case,
the command byte is the high byte of EEPROM Address 0xF8
to EEPROM Address 0xFB. The only data byte is the low byte
of the EEPROM address, as shown in Figure 42.
Figure 39. Setting a RAM Address for Subsequent Read
•
To erase a page of EEPROM memory. EEPROM memory
can be written to only if it is unprogrammed. Before writing
to one or more EEPROM memory locations that are already
programmed, the page(s) containing those locations must
first be erased. EEPROM memory is erased by writing a
command byte.
1
2
3
4
5
6
7
8
EEPROM
ADDRESS
HIGH BYTE
(0xF8 TO 0xFB)
EEPROM
ADDRESS
LOW BYTE
(0x00 TO 0xFF)
SLAVE
S
W
A
A
A
P
ADDRESS
Figure 42. Setting an EEPROM Address
The master sends a command code telling the slave device to
erase the page. The ADM1169 command code for a page
erasure is 0xFE (1111 1110). Note that, for a page erasure
to take place, the page address must be given in the previous
write word transaction (see the Write Byte/Word section).
In addition, Bit 2 in the UPDCFG register (Address 0x90)
must be set to 1. See Figure 40.
Because a page consists of 32 bytes, only the three MSBs of
the address low byte are important for page erasure. The
lower five bits of the EEPROM address low byte specify the
addresses within a page and are ignored during an erase
operation.
1
2
3
4
5
6
COMMAND
BYTE
(0xFE)
SLAVE
ADDRESS
S
W
A
A
P
Figure 40. EEPROM Page Erasure
Rev. A | Page 30 of 36
Data Sheet
ADM1169
•
To write a single byte of data to the EEPROM. In this case, the
Unlike some EEPROM devices that limit block writes to within
a page boundary, there is no limitation on the start address
when performing a block write to EEPROM, except when
command byte is the high byte of EEPROM Address 0xF8
to EEPROM Address 0xFB. The first data byte is the low
byte of the EEPROM address, and the second data byte is
the actual data, as shown in Figure 43.
•
There are fewer than N locations from the start address to
the highest EEPROM address (0xFBFF), which results in
writing to invalid addresses.
1
2
3
4
5
6
7
8
9
10
EEPROM
ADDRESS
HIGH BYTE
(0xF8 TO 0xFB)
EEPROM
ADDRESS
LOW BYTE
(0x00 TO 0xFF)
SLAVE
ADDRESS
S
W
A
A
A
DATA
A
P
•
An address crosses a page boundary. In this case, both
pages must be erased before programming.
Figure 43. Single Byte Write to the EEPROM
Note that the ADM1169 features a clock extend function for
writes to EEPROM. Programming an EEPROM byte takes
approximately 250 µs, which limits the SMBus clock for
repeated or block write operations. The ADM1169 pulls SCL
low and extends the clock pulse when it cannot accept any
more data.
Block Write
In a block write operation, the master device writes a block of
data to a slave device, as shown in Figure 45. The start address
for a block write must have been set previously. In the ADM1169,
a send byte operation sets a RAM address, and a write byte/word
operation sets an EEPROM address as follows:
READ OPERATIONS
1. The master device asserts a start condition on SDA.
2. The master sends the 7-bit slave address followed by
the write bit (low).
3. The addressed slave device asserts an ACK on SDA.
4. The master sends a command code that tells the slave
device to expect a block write. The ADM1169 command
code for a block write is 0xFC (1111 1100).
The ADM1169 uses the following SMBus read protocols.
Receive Byte
In a receive byte operation, the master device receives a single
byte from a slave device, as follows:
1. The master device asserts a start condition on SDA.
2. The master sends the 7-bit slave address followed by the
read bit (high).
3. The addressed slave device asserts an ACK on SDA.
4. The master receives a data byte.
5. The master asserts a NACK on SDA.
6. The master asserts a stop condition on SDA, and the
transaction ends.
5. The slave asserts an ACK on SDA.
6. The master sends a data byte that tells the slave device how
many data bytes are being sent. The SMBus specification
allows a maximum of 32 data bytes in a block write.
7. The slave asserts an ACK on SDA.
8. The master sends N data bytes.
9. The slave asserts an ACK on SDA after each data byte.
10. The master asserts a stop condition on SDA to end the
transaction.
In the ADM1169, the receive byte protocol is used to read a
single byte of data from a RAM or EEPROM location whose
address has previously been set by a send byte or write byte/
word operation, as shown in Figure 44.
1
2
3
4
5
6
SLAVE
ADDRESS
S
R
A
DATA
A
P
Figure 44. Single Byte Read from the EEPROM or RAM
1
2
3
4
5
6
7
8
9
10
SLAVE
ADDRESS
COMMAND 0xFC
(BLOCK WRITE)
BYTE
COUNT
DATA
1
DATA
2
DATA
A P
N
S
W
A
A
A
A
A
Figure 45. Block Write to the EEPROM or RAM
Rev. A | Page 31 of 36
ADM1169
Data Sheet
Block Read
Error Correction
In a block read operation, the master device reads a block of
data from a slave device. The start address for a block read must
have been set previously. In the ADM1169, this is done by a
send byte operation to set a RAM address, or a write byte/word
operation to set an EEPROM address. The block read operation
itself consists of a send byte operation that sends a block read
command to the slave, immediately followed by a repeated start
and a read operation that reads out multiple data bytes, as follows:
The ADM1169 provides the option of issuing a packet error
checking (PEC) byte after a write to the RAM, a write to the
EEPROM, a block write to the RAM/EEPROM, or a block read
from the RAM/EEPROM. This option enables the user to verify
that the data received by or sent from the ADM1169 is correct.
The PEC byte is an optional byte sent after the last data byte has
been written to or read from the ADM1169. The protocol is the
same as a block read for Step 1 to Step 12 and then proceeds as
follows:
1. The master device asserts a start condition on SDA.
2. The master sends the 7-bit slave address followed by the
write bit (low).
3. The addressed slave device asserts an ACK on SDA.
4. The master sends a command code that tells the slave
device to expect a block read. The ADM1169 command
code for a block read is 0xFD (1111 1101).
13. The ADM1169 issues a PEC byte to the master. The master
checks the PEC byte and issues another block read, if the
PEC byte is incorrect.
14. A NACK is generated after the PEC byte to signal the end
of the read.
15. The master asserts a stop condition on SDA to end the
transaction.
5. The slave asserts an ACK on SDA.
6. The master asserts a repeat start condition on SDA.
7. The master sends the 7-bit slave address followed by the
read bit (high).
Note that the PEC byte is calculated using CRC-8. The frame
check sequence (FCS) conforms to CRC-8 by the polynomial
C(x) = x8 + x2 + x1 + 1
8. The slave asserts an ACK on SDA.
9. The ADM1169 sends a byte-count data byte that tells the
master how many data bytes to expect. The ADM1169 always
returns 32 data bytes (0x20), which is the maximum allowed
by the SMBus Version 1.1 specification.
See the SMBus Version 1.1 specification for details.
An example of a block read with the optional PEC byte is shown
in Figure 47.
10. The master asserts an ACK on SDA.
11. The master receives 32 data bytes.
12. The master asserts an ACK on SDA after each data byte.
13. The master asserts a stop condition on SDA to end the
transaction.
1
2
3
4
5
6
7
8
9
10 11 12
DATA
SLAVE
ADDRESS
COMMAND 0xFD
(BLOCK READ)
SLAVE
ADDRESS
BYTE
COUNT
S
W
A
A
S
R A
A
A
1
13
P
DATA
32
A
Figure 46. Block Read from the EEPROM or RAM
1
2
3
4
5
6
7
8
9
10 11 12
DATA
SLAVE
ADDRESS
COMMAND 0xFD
(BLOCK READ)
SLAVE
ADDRESS
BYTE
COUNT
S
W
A
A
S
R A
A
A
1
13 14 15
PEC A
DATA
32
A
P
Figure 47. Block Read from the EEPROM or RAM with PEC
Rev. A | Page 32 of 36
Data Sheet
ADM1169
OUTLINE DIMENSIONS
0.75
0.60
0.45
1.60
MAX
9.00
BSC SQ
32
25
1
24
PIN 1
7.00
BSC SQ
TOP VIEW
(PINS DOWN)
1.45
1.40
1.35
0.20
0.09
7°
8
17
3.5°
0°
0.15
0.05
9
16
SEATING
PLANE
0.10 MAX
COPLANARITY
0.45
0.37
0.30
0.80
BSC
VIEW A
LEAD PITCH
VIEW A
° CCW
ROTATED 90
COMPLIANT TO JEDEC STANDARDS MS-026-BBA
Figure 48. 32-Lead Low Profile Quad Flat Package [LQFP]
(ST-32-2)
Dimensions shown in millimeters
6.10
6.00 SQ
5.90
0.30
0.25
0.18
PIN 1
INDICATOR
PIN 1
INDICATOR
31
30
40
1
0.50
BSC
*
4.70
EXPOSED
PAD
4.60 SQ
4.50
21
20
10
11
0.45
0.40
0.35
0.20 MIN
TOP VIEW
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.80
0.75
0.70
0.05 MAX
0.02 NOM
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5
WITH EXCEPTION TO EXPOSED PAD DIMENSION.
Figure 49. 40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADM1169ASTZ
ADM1169ASTZ-RL7
ADM1169ACPZ
ADM1169ACPZ-RL7
EVAL-ADM1169LQEBZ
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
ST-32-2
ST-32-2
CP-40-7
CP-40-7
32-Lead Low Profile Quad Flat Package [LQFP]
32-Lead Low Profile Quad Flat Package [LQFP]
40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Evaluation Board (LQFP Version)
1 Z = RoHS Compliant Part.
Rev. A | Page 33 of 36
ADM1169
NOTES
Data Sheet
Rev. A | Page 34 of 36
Data Sheet
NOTES
ADM1169
Rev. A | Page 35 of 36
ADM1169
NOTES
Data Sheet
©2011–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09475-0-8/13(A)
Rev. A | Page 36 of 36
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