ADM1232ARN-REEL [ADI]
Microprocessor Supervisory Circuit; 微处理器监控电路
| 型号： | ADM1232ARN-REEL |
| 厂家： | 
ADI |
| 描述： | Microprocessor Supervisory Circuit |
| 文件： | 总12页 (文件大小：263K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Microprocessor
Supervisory Circuit
ADM1232
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Pin-compatible with MAX1232 and Dallas DS1232
Adjustable precision voltage monitor with 4.5 V and
4.75 V options
5%/10%
TOLERANCE
SELECT
V
RESET
CC
TOLERANCE
VREF
Adjustable strobe monitor with 150 ms, 600 ms, or
1.2 sec options
RESET
PB RESET
DEBOUNCE
No external components
Specified from −40°C to +85°C
WATCHDOG
TIMER
WATCHDOG
TIME-BASE
SELECT
STROBE
TD
ADM1232
GND
APPLICATIONS
Figure 1.
Microprocessor systems
Portable equipment
Computers
Controllers
Intelligent instruments
Automotive systems
GENERAL DESCRIPTION
5V
5V
The ADM1232 is pin-compatible with the MAX1232, DS1232LP,
and DS1232. The Analog Devices, Inc., ADM1232 is a micro-
processor monitoring circuit that can monitor the following:
10kΩ
ADM1232
MICROPROCESSOR
I/O
•
•
•
Microprocessor supply voltage
Whether a microprocessor has locked up
External interrupts
STROBE
RESET
GND TD TOLERANCE
RESET
The ADM1232 is available in four packages: an 8-lead MSOP
(RM-8), an 8-lead PDIP (N-8), a 16-lead wide SOIC (RW-16),
and an 8-lead narrow SOIC (R-8).
Figure 2. Typical Supply Monitoring Application
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©1997–2008 Analog Devices, Inc. All rights reserved.
ADM1232
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configurations and Function Descriptions............................5
Circuit Information...........................................................................6
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
PB RESET
.......................................................................................6
Timeout Selection.........................................................6
STROBE
Tolerance ........................................................................................6
RESET
RESET and
Outputs.........................................................6
Outline Dimensions..........................................................................7
Ordering Guide .............................................................................9
REVISION HISTORY
12/08—Rev. B to Rev. C
Updated Format..................................................................Universal
Changes to Table 2............................................................................ 4
Added Thermal Resistance Section ............................................... 4
Updated Outline Dimensions......................................................... 7
Changes to Ordering Guide ............................................................ 9
12/97—Rev. A to Rev. B
Changes to Specifications Section.................................................. 2
x/97—Rev. 0 to Rev. A
Changes to Specifications Section.................................................. 2
7/97—Revision 0: Initial Version
Rev. C | Page 2 of 12
ADM1232
SPECIFICATIONS
VCC = full operating range, TA = TMIN to TMAX, unless otherwise noted.
Table 1.
Parameter
TEMPERATURE
POWER SUPPLY
Voltage
Min
Typ
Max
Unit
Test Conditions/Comments
TA = TMIN to TMAX
−40
+85
°C
.
4.5
5.0
20
200
5.5
50
500
V
Current
μA
μA
VIL, VIH = CMOS levels.
VIL, VIH = TTL levels.
STROBE AND PB RESET INPUTS
Input High Level
Input Low Level
INPUT LEAKAGE CURRENT
(STROBE, TOLERANCE)
TD
2.0
−0.3
VCC + 0.3
+0.8
V
V
−1.0
+1.0
μA
μA
1.6
OUTPUT CURRENT
RESET
RESET/RESET
8
−8
10
−12
mA
mA
VCC is at 4.5 V to 5.5 V.
VCC is at 4.5 V to 5.5 V.
OUTPUT VOLTAGE
RESET/RESET
V
CC − 0.5
VCC − 0.1
V
When sourcing less than 500 μA, RESET remains within
0.5 V of VCC on power-down until VCC drops below 2.0 V.
When sinking less than 500 μA, RESET remains within
0.5 V of GND on power-down until VCC drops below 2.0 V.
RESET/RESET High Level
RESET/RESET Low Level
0.4
V
V
2.4
1 V OPERATION
RESET Output Voltage
RESET Output Voltage
VCC − 0.1
0.1
V
V
When sourcing less than 50 μA.
When sinking less than 50 μA.
VCC TRIP POINT
5%
10%
4.5
4.25
4.62
4.37
4.74
4.49
V
V
TOLERANCE = GND.
TOLERANCE = VCC.
CAPACITANCE
Input (STROBE, TOLERANCE)
Output (RESET, RESET)
5
7
pF
pF
TA = 25°C.
TA = 25°C.
PB RESET
Time
20
ms
PB RESET must be held low for a minimum of 20 ms to
guarantee a reset.
Delay
1
4
20
ms
ms
RESET ACTIVE TIME
250
610
1000
STROBE
Pulse Width
Timeout Period
70
ns
62.5
250
500
150
600
1200
250
1000
2000
ms
ms
ms
TD = 0 V.
TD = floating.
TD = VCC.
VCC
Fall Time
Rise Time
10
0
μs
μs
Guaranteed by design.
Guaranteed by design.
VCC FAIL DETECT TO RESET
OUTPUT DELAY
RESET and RESET are logically correct.
50
1000
μs
ms
After VCC falls below the set tolerance voltage (see Figure 9).
After VCC rises above the set tolerance voltage.
250
610
Rev. C | Page 3 of 12
ADM1232
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
TA = 25°C unless otherwise noted.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 2.
Parameter
Rating
Table 3. Thermal Resistance
VCC
5.5 V
Logic Inputs
−0.3 V to VCC + 0.3 V
−65°C to +150°C
300°C
215°C
220°C
Package Type
θJA
Unit
°C/W
°C/W
°C/W
°C/W
Storage Temperature Range
Lead Temperature (Soldering, 10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
Power Dissipation
N-81
8-Lead PDIP (N-8)
100
73
206
153
16-Lead SOIC_W (RW-16)
8-Lead MSOP (RM-8)
8-Lead SOIC_N (R-8)
1000 mW
900 mW
900 μW
RW-16, RM-82
R-82
ESD CAUTION
1 Derate by 13.5 mW/°C above 25°C.
2 Derate by 12 mW/°C above 25°C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. C | Page 4 of 12
ADM1232
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
NC
1
2
3
4
5
6
7
8
16 NC
PB RESET
15
V
CC
NC
14 NC
ADM1232
TD
NC
13 STROBE
12 NC
TOP VIEW
(Not to Scale)
TOLERANCE
NC
11 RESET
10 NC
GND
9 RESET
NC = NO CONNECT
Figure 3. RW-16 Pin Configuration
PB RESET
TD
1
2
3
4
8
7
6
5
V
CC
ADM1232
STROBE
RESET
RESET
TOLERANCE
GND
TOP VIEW
(Not to Scale)
Figure 4. RM-8 Pin Configuration
PB RESET
TD
1
2
3
4
8
7
6
5
V
CC
ADM1232
STROBE
RESET
RESET
TOLERANCE
GND
TOP VIEW
(Not to Scale)
Figure 5. N-8 and R-8 Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
N-8, R-8,
RM-8
RW-16
Mnemonic
Description
No Connection.
1, 3, 5, 7,
10, 12,
14, 16
NC
2
1
2
PB RESET
TD
Push-Button Reset Input. This debounced input ignores pulses of less than 1 ms and is
guaranteed to respond to pulses greater than 20 ms.
Time Delay Set. This input allows the user to select the maximum amount of time that the
ADM1232 allows the STROBE input to remain inactive—that is, STROBE is not receiving any
high-to-low transitions—without forcing the ADM1232 to generate a RESET pulse.
See the Specifications section, Figure 8, and the STROBE Timeout Selection section.
4
6
3
TOLERANCE
Tolerance Input. This input determines how much the supply voltage is allowed to decrease (as a
percentage) before a RESET is asserted. Connect this pin to VCC for 10% and to GND for 5%.
8
9
4
5
GND
RESET
0 V Ground Reference for All Signals.
Active High Logic Output. This pin is asserted when any of the following events occurs:
V
CC decreases below the amount specified by the TOLERANCE input; when PB RESET is forced low;
if there are no high-to-low transitions within the limits set by TD at STROBE; and during power-up.
11
13
6
7
RESET
Inverse of RESET. This pin has an open-drain output.
STROBE
The STROBE input is used to monitor the activity of a microprocessor. If there are no high-to-low
transitions within the time specified by TD, a reset is asserted.
Power Supply Input, 5 V.
15
8
VCC
Rev. C | Page 5 of 12
ADM1232
CIRCUIT INFORMATION
PB RESET
STROBE TIMEOUT SELECTION
PB RESET
TD (time delay) set is used to set the strobe timeout period. The
strobe timeout period is the maximum time between high-to-
The
input makes it possible to manually reset a
system using either a standard push-button switch or a logic
low input. An internal debounce circuit provides glitch
immunity when used with a switch, reducing the effects of
glitches on the line. The debounce circuit is guaranteed to cause
the ADM1232 to assert a reset if
more than 20 ms and is guaranteed to ignore low inputs of less
than 1 ms.
STROBE
low transitions that
accepts before a reset is asserted
(see Figure 8). The strobe timeout settings are listed in Table 5.
Table 5. Strobe Timeout Settings
PB RESET
is brought low for
Condition
Min
62.5
250
500
Typ
150
600
1200
Max
250
1000
2000
Unit
ms
ms
TD = 0 V
TD = Floating
TD = VCC
V
CC
ms
V
TD
CC
STROBE
PULSE WIDTH
ADM1232
MICROPROCESSOR
I/O
STROBE
STROBE
PB RESET
GND
RESET
RESET
TOLERANCE
STROBE TIMEOUT PERIOD
STROBE
Figure 8.
Parameters
Figure 6. Typical Push-Button Reset Application
5V
5V
V
4.5V (5% TRIP POINT)
CC
PB RESET TIME
PB RESET
4.25V (10% TRIP POINT)
PB RESET
DELAY
V
RESET OUTPUT DELAY
RESET OUTPUT DELAY
WHEN V IS RISING
IH
WHEN V IS FALLING
CC
CC
V
IL
RESET ACTIVE
TIME
RESET
RESET
RESET
RESET
Figure 9. Reset Output Delay
TOLERANCE
PB RESET
Figure 7.
The TOLERANCE input is used to determine the level at which
VCC can vary below 5 V without the ADM1232 asserting a reset.
Connecting TOLERANCE to GND selects a −5% tolerance level
and causes the ADM1232 to generate a reset if VCC falls below
4.75 V. If TOLERANCE is connected to VCC, a −10% tolerance
level is selected, which causes the ADM1232 to generate a reset
if VCC falls below 4.5 V. See the parameters for the VCC trip point
in the Specifications section for more information.
RESET AND RESET OUTPUTS
RESET is capable of sourcing and sinking current, whereas
RESET
is an open-drain MOSFET that sinks current only.
Therefore, it is necessary to pull this output high.
Rev. C | Page 6 of 12
ADM1232
OUTLINE DIMENSIONS
10.50 (0.4134)
10.10 (0.3976)
16
1
9
8
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
0.75 (0.0295)
0.25 (0.
0098)
1.27 (0.0500)
BSC
45°
2.65 (0.1043)
2.35 (0.0925)
0.30 (0.0118)
0.10 (0.0039)
8°
0°
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
COMPLIANT TO JEDEC STANDARDS MS-013-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 10. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
Dimensions shown in millimeters and (inches)
3.20
3.00
2.80
8
1
5
4
5.15
4.90
4.65
3.20
3.00
2.80
PIN 1
0.65 BSC
0.95
0.85
0.75
1.10 MAX
0.80
0.60
0.40
8°
0°
0.15
0.00
0.38
0.22
0.23
0.08
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 11. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
Rev. C | Page 7 of 12
ADM1232
0.400 (10.16)
0.365 (9.27)
0.355 (9.02)
8
1
5
4
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.100 (2.54)
BSC
0.060 (1.52)
MAX
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
0.210 (5.33)
MAX
0.015
(0.38)
MIN
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.015 (0.38)
GAUGE
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
PLANE
SEATING
PLANE
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.430 (10.92)
MAX
0.005 (0.13)
MIN
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
COMPLIANT TO JEDEC STANDARDS MS-001
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
Figure 12. 8-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-8)
Dimensions shown in inches and (millimeters)
5.00 (0.1968)
4.80 (0.1890)
8
1
5
4
6.20 (0.2441)
5.80 (0.2284)
4.00 (0.1574)
3.80 (0.1497)
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
BSC
45°
1.75 (0.0688)
1.35 (0.0532)
0.25 (0.0098)
0.10 (0.0040)
8°
0°
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 13. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
Rev. C | Page 8 of 12
ADM1232
ORDERING GUIDE
Temperature
Range
Package
Options
Model
Package Description
Branding
M2A
ADM1232ARM
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
8-Lead Mini Small Outline Package [MSOP]
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
N-8
ADM1232ARM-REEL
ADM1232ARM-REEL7
ADM1232ARMZ1
ADM1232ARMZ-REEL1
ADM1232ARMZ-REEL71
ADM1232AN
8-Lead Mini Small Outline Package [MSOP]
M2A
8-Lead Mini Small Outline Package [MSOP]
M2A
8-Lead Mini Small Outline Package [MSOP]
M4W
M4W
M4W
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Plastic Dual In-Line Package [PDIP]
8-Lead Plastic Dual In-Line Package [PDIP]
ADM1232ANZ1
ADM1232ARW
N-8
16-Lead Standard Small Outline Package [SOIC_W], Wide Body
16-Lead Standard Small Outline Package [SOIC_W], Wide Body
16-Lead Standard Small Outline Package [SOIC_W], Wide Body
16-Lead Standard Small Outline Package [SOIC_W], Wide Body
16-Lead Standard Small Outline Package [SOIC_W], Wide Body
16-Lead Standard Small Outline Package [SOIC_W], Wide Body
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
R-8
R-8
R-8
R-8
R-8
ADM1232ARW-REEL
ADM1232ARW-REEL7
ADM1232ARWZ1
ADM1232ARWZ-REEL1
ADM1232ARWZ-REEL71
ADM1232ARN
ADM1232ARN-REEL
ADM1232ARN-REEL7
ADM1232ARNZ1
ADM1232ARNZ-REEL1
ADM1232ARNZ-REEL71
R-8
1 Z = RoHS Compliant Part.
Rev. C | Page 9 of 12
ADM1232
NOTES
Rev. C | Page 10 of 12
ADM1232
NOTES
Rev. C | Page 11 of 12
ADM1232
NOTES
©1997–2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07522-0-12/08(C)
Rev. C | Page 12 of 12
相关型号：
ADM1232ARNZ-REEL7
1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8
ROCHESTER
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