ADM2795ETRWZ-EP [ADI]
Robust 5 kV RMS Isolated RS-485/RS-422 Transceiver with Level 4 EMC and Full ±42 V Protection;
| 型号： | ADM2795ETRWZ-EP |
| 厂家： | 
ADI |
| 描述： | Robust 5 kV RMS Isolated RS-485/RS-422 Transceiver with Level 4 EMC and Full ±42 V Protection 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总17页 (文件大小：437K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Robust 5 kV RMS Isolated RS-485 Transceiver with
Level 4 DO-160G EMC and Full ±42 V Protection
Enhanced Product
ADM2795E-EP
FEATURES
APPLICATIONS
5 kV rms isolated RS-485 transceiver
Military and aerospace (MILA) avionics for sensors,
42 V ac/dc peak fault protection on RS-485 bus pins
DO-160G Section 25 ESD protection: 15 kV air discharge
Fully certified DO-160G EMC protection on RS-485 bus pins
Section 22 lightning protection Waveform 3, Waveform 4/
Waveform 1, Waveform 5A Pin injection, Level 4
protection
RS-485 A, B pins HBM ESD protection: > 30 kV
Safety and regulatory approvals
CSA Component Acceptance Notice 5A, DIN V VDE V 0884-10,
UL 1577, CQC11-471543-2012 (pending)
TIA/EIA RS-485/RS-422 compliant over full supply range
3 V to 5.5 V operating voltage range on VDD2
1.7 V to 5.5 V operating voltage range on VDD1 logic supply
Common-mode input range of −25 V to +25 V
High common-mode transient immunity: >75 kV/μs
Robust noise immunity (tested to the IEC 62132-4 standard)
Passes EN55022 Class B radiated emissions by 6 dBµV/m margin
Receiver short-circuit, open-circuit, and floating input fail-safe
Supports 256 bus nodes (96 kΩ receiver input impedance)
Glitch free power-up/power-down (hot swap)
actuators, and engine control
GENERAL DESCRIPTION
The ADM2795E-EP is a 5 kV rms signal isolated RS-485 trans-
ceiver that features up to 42 V of ac/dc peak bus overvoltage fault
protection on the RS-485 bus pins. The device integrates Analog
Devices, Inc., iCoupler® technology to combine a 3-channel
isolator, RS-485 transceiver, and IEC electromagnetic compatibil-
ity (EMC) transient protection in a single package. The
ADM2795E-EP integrates fully certified DO-160G EMC protec-
tion on the RS-485 bus pins, with Section 22 lightning protection.
The ADM2795E-EP also provides Section 25 15 kV ESD air
discharge protection. For Section 22 lightning, the ADM2795E-EP
provides protection for Waveform 3, Waveform 4/ Waveform 1,
and Waveform 5A to Level 4 using 33 Ω or 47 Ω current
limiting resistors to GND2, or to Level 4 across the isolation
barrier to GND1. This device has an extended common-mode
input range of 25 V to improve data communication reliability in
noisy environments. The ADM2795E-EP is capable of operating
over wide power supply ranges, with a 1.7 V to 5.5 V VDD1 power
supply range, allowing interfacing to low voltage logic supplies.
The ADM2795E-EP is also fully TIA/EIA RS-485/RS-422
compliant when operated over a 3 V to 5.5 V VDD2 power supply.
The device is fully characterized over an extended operating
temperature range of −55°C to +125°C, and is available in a
16-lead, wide-body SOIC package.
ENHANCED PRODUCT FEATURES
Supports defense and aerospace applications (AQEC
standard)
Military −55°C to +125°C temperature range
Controlled manufacturing baseline
1 assembly/test site
Additional application and technical information can be found
in the ADM2795E data sheet.
Enhanced product change notification
Qualification data available on request
FUNCTIONAL BLOCK DIAGRAM
V
V
DD2
DD1
RS-485
TRANSCEIVER
ADM2795E-EP
DIGITAL ISOLATOR
RxD
RE
EMC
A
B
TRANSIENT
PROTECTION
CIRCUIT
DE
TxD
GND
GND
2
1
ISOLATION
BARRIER
Figure 1.
Rev. 0
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2017 Analog Devices, Inc. All rights reserved.
www.analog.com
ADM2795E-EP
Enhanced Product
TABLE OF CONTENTS
Features .............................................................................................. 1
Absolute Maximum Ratings ............................................................7
Thermal Resistance.......................................................................7
ESD Caution...................................................................................7
Pin Configuration and Function Descriptions..............................8
Typical Performance Characteristics ..............................................9
Test Circuits..................................................................................... 13
Switching Characteristics.......................................................... 14
Theory of Operation ...................................................................... 15
RS-485 with Added DO-160G EMC Robustness .................. 15
Certified DO-160G EMC Protection ...................................... 15
DO-160G ADM2795E-EP Test Details................................... 15
Outline Dimensions....................................................................... 17
Ordering Guide .......................................................................... 17
Enhanced Product Features ............................................................ 1
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Specifications .................................................................. 4
Insulation and Safety Related Specifications ............................ 5
Package Characteristics ............................................................... 5
Regulatory Information............................................................... 5
DIN V VDE V 0884-10 (VDE V 0884-10) Insulation
Characteristics .............................................................................. 6
REVISION HISTORY
7/2017—Revision 0: Initial Version
Rev. 0 | Page 2 of 17
Enhanced Product
SPECIFICATIONS
ADM2795E-EP
1.7 V ≤ VDD1 ≤ 5.5 V, 3 V ≤ VDD2 ≤ 5.5 V, TA = −55°C to +125°C. All min/max specifications apply over the entire recommended
operation range, unless otherwise noted. All typical specifications at TA = 25°C, VDD1 = VDD2 = 5.0 V, unless otherwise noted.
Table 1.
Parameter
Symbol Min
Typ
Max
Unit
Test Conditions/Comments
SUPPLY CURRENT
Power Supply Current
Logic Side
IDD1
IDD2
10
10
12
90
130
mA
mA
mA
mA
mA
Unloaded output, DE = VDD1, RE = 0 V
Unloaded output, DE = VDD1, RE = 0 V
Unloaded output, DE = VDD1, RE = 0 V
Unloaded output, DE = VDD1, RE = 0 V
TxD/RxD Data Rate = 2.5 Mbps
Bus Side
TxD/RxD Data Rate = 2.5 Mbps
DE = VDD1, RE = 0 V, VDD2 = 5.5 V,
R = 27 Ω, see Figure 27
94
46
mA
mA
mA
DE = VDD1, RE = 0 V, VDD2 = 5.5 V,
R = 27 Ω, see Figure 27
DE = VDD1, RE = 0 V, VDD2 = 3.0 V,
R = 27 Ω, see Figure 27
Supply Current in Shutdown Mode
DRIVER
ISHDN
10
DE = 0 V, RE = VDD1
Differential Outputs
Differential Output Voltage
|VOD
|
1.5
2.1
1.5
2.1
5.0
5.0
5.0
5.0
0.2
V
V
V
V
V
VDD2 ≥ 3.0 V, R = 27 Ω or 50 Ω,
see Figure 27
VDD2 ≥ 4.5 V, R = 27 Ω or 50 Ω,
see Figure 27
VDD2 ≥ 3.0 V, VCM = −25 V to +25 V,
see Figure 28
VDD2 ≥ 4.5 V, VCM = −25 V to +25 V,
see Figure 28
|VOD3
|
Change in Differential Output
Voltage for Complementary
Output States
∆|VOD
|
R = 27 Ω or 50 Ω, see Figure 27
Common-Mode Output Voltage
VOC
∆|VOC|
3.0
0.2
V
V
R = 27 Ω or 50 Ω, see Figure 27
R = 27 Ω or 50 Ω, see Figure 27
Change in Common-Mode Output
Voltage for Complementary
Output States
Short-Circuit Output Current
VOUT = Low
VOUT = High
IOSL
IOSH
−250
−250
+250
+250
mA
mA
−42 V ≤ VSC ≤ +42 V1
−42 V ≤ VSC ≤ +42 V1
Logic Inputs (DE, RE, TxD)
Input Threshold Low
Input Threshold High
Input Current
VIL
VIH
ITxD
0.33 × VDD1
+1
V
V
µA
1.7 V ≤ VDD1 ≤ 5.5 V
1.7 V ≤ VDD1 ≤ 5.5 V
0 V ≤ VIN ≤ VDD1
0.7 VDD1
RECEIVER
Differential Inputs
Differential Input Threshold Voltage
Input Voltage Hysteresis
Input Current (A, B)
VTH
VHYS
II
−200
−125 −30
30
mV
mV
mA
mA
pF
−25 V ≤ VCM ≤ +25 V
−25 V ≤ VCM ≤ +25 V
DE = 0 V, VDD2 = 0 V/5 V, VIN
DE = 0 V, VDD2 = 0 V/5 V, VIN
TA = 25°C, see Figure 17
−1.0
−1.0
+1.0
+1.0
=
=
25 V
42 V
Input Capacitance (A, B)
Line Input Resistance
CAB
RIN
150
96
kΩ
−25 V ≤ VCM ≤ +25 V, up to
256 nodes supported
Rev. 0 | Page 3 of 17
ADM2795E-EP
Enhanced Product
Parameter
Symbol Min
Typ
Max
Unit
Test Conditions/Comments
Logic Outputs
Output Voltage Low
Output Voltage High
Short-Circuit Current
Three-State Output Leakage Current
VOLRxD
VOHRxD
0.2
V
V
mA
µA
IORxD = 3.0 mA, VA − VB = −0.2 V
IORxD = −3.0 mA, VA − VB = 0.2 V
VOUT = GND or VDD1, RE = 0 V
RE = VDD1, RxD = 0 V or VDD1
VDD1 − 0.2
100
2
IOZR
COMMON-MODE TRANSIENT IMMUNITY2
75
125
kV/µs VCM ≥1 kV, transient magnitude
≥800 V
1 VSC is the short-circuit voltage at the RS-485 A or B bus pin.
2 Common-mode transient immunity is the maximum common-mode voltage slew rate that can be sustained while maintaining specification compliant
operation. VCM is the common-mode potential difference between the logic and bus sides. The transient magnitude is the range over which the common mode
is slewed. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
TIMING SPECIFICATIONS
VDD1 = 1.7 V to 5.5 V, V DD2 = 3.0 V to 5.5 V, T A = TMIN to TMAX (−55°C to +125°C), unless otherwise noted.
Table 2.
Parameter
DRIVER1
Min
Typ
Max
Unit
Test Conditions/Comments
Maximum Data Rate
Propagation Delay, tDPLH, tDPHL
Differential Skew, tSKEW
Rise/Fall Times, tR, tF
Enable Time, tZH, tZL
Disable Time, tHZ, tLZ
RECEIVER2
2.5
Mbps
ns
ns
ns
ns
30
10
40
500
500
500
50
130
2500
2500
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 29 and Figure 33
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 29 and Figure 33
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 29 and Figure 33
RL = 110 Ω, CL = 50 pF, see Figure 30 and Figure 35
ns
RL = 110 Ω, CL = 50 pF, see Figure 30 and Figure 35
Propagation Delay, tPLH, tPHL
120
140
4
10
10
200
220
40
50
50
ns
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 31 and Figure 34, 10, VID ≥ 1.5 V
CL = 15 pF, see Figure 31 and Figure 34, VID
CL = 15 pF, see Figure 31 and Figure 34, VID
≥
≥
600 mV
1.5 V
Skew, tSKEW
Enable Time
Disable Time
RxD Pulse Width Distortion
RL = 1 kΩ, CL = 15 pF, see Figure 32 and Figure 36
RL = 1 kΩ, CL = 15 pF, see Figure 32 and Figure 36
CL = 15 pF, see Figure 31 and Figure 34, VID ≥ 1.5 V
40
1 See Figure 29 for the definition of RLDIFF
.
2 Receiver propagation delay, skew, and pulse width distortion specifications are tested with a receiver differential input voltage (VID) of ≥±600 mV or ≥±1.5 V, as noted.
Rev. 0 | Page 4 of 17
Enhanced Product
ADM2795E-EP
INSULATION AND SAFETY RELATED SPECIFICATIONS
For additional information, see www.analog.com/icouplersafety.
Table 3.
Parameter
Symbol
Value
5000
7.8
Unit
Conditions
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)
V rms
mm min
1 minute duration
Measured from input terminals to output terminals,
shortest distance through air
Measured from input terminals to output terminals,
shortest distance along body
Measured from input terminals to output terminals,
shortest distance through air, line of sight, in the PCB
mounting plane
L(I01)
L(I02)
L(PCB)
Minimum External Tracking (Creepage)
7.8
8.3
mm min
mm min
Minimum Clearance in the Plane of the Printed
Circuit Board (PCB Clearance)
Minimum Internal Gap (Internal Clearance)
Tracking Resistance (Comparative Tracking Index)
Material Group
25.5
>400
II
µm min
V
Minimum distance through insulation
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89)
CTI
PACKAGE CHARACTERISTICS
Table 4.
Parameter
Symbol Min Typ Max Unit Test Conditions/Comments
Resistance (Input to Output)1
Capacitance (Input to Output)1
Input Capacitance2
RI-O
CI-O
CI
1013
Ω
2.2
4.0
150
59.7
pF
pF
pF
f = 1 MHz
TA = 25°C, see Figure 17
Input Capacitance, A and B Pins
IC Junction to Ambient Thermal Resistance θJA
CAB
°C/W Thermocouple located at center of package underside
1 The device is considered a 2-terminal device: Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together.
2 Input capacitance is from any digital input pin to ground.
REGULATORY INFORMATION
See Table 8 and the ADM2795E data sheet for details regarding recommended maximum working voltages for specific cross isolation
waveforms and insulation levels.
The ADM2795E-EP is approved or pending approval by the organizations listed in Table 5.
Table 5. ADM2795E-EP Approvals
UL
CSA
VDE
CQC (Pending)
Recognized Under UL 1577
Component Recognition
Program1
Approved under CSA Component
Acceptance Notice 5A
Certified according to DIN V VDE V 0884-
10 (VDE V 0884-10):2006-122
Certified by
CQC11-471543-2012,
GB4943.1-2011
Single Protection, 5000 V rms
Isolation Voltage
CSA 60950-1-07+A1+A2 and IEC 60950-1
second edition +A1+A2:
Reinforced insulation, VIORM = 849 V peak, Basic insulation at
VIOSM = 8000 V peak
780 V rms (1103 V peak)
Basic insulation at 780 V rms
(1103 V peak)
Reinforced insulation at
389 V rms (552 V peak)
Reinforced insulation at 390 V rms
(552 V peak)
IEC 60601-1 Edition 3.1: basic insulation
(two means of patient protection
(MOPP)), 250 V rms (353 V peak)
CSA 61010-1-12 and IEC 61010-1 third
edition:
Basic insulation at 300 V rms mains, 780 V
secondary (1103 V peak)
Reinforced insulation at 300 V rms mains,
390 V secondary (552 V peak)
File E214100
File 70078455
File 40011599
File (pending)
1 In accordance with UL 1577, each ADM2795E-EP is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 sec.
2 In accordance with DIN V VDE V 0884-10, each ADM2795E-EP is proof tested by applying an insulation test voltage ≥1592 V peak for 1 sec.
Rev. 0 | Page 5 of 17
ADM2795E-EP
Enhanced Product
DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS
This isolator is suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured
by means of protective circuits.
An asterisk (*) on a package denotes VDE 0884 approval for a 849 V peak working voltage.
Table 6.
Description
Test Conditions/Comments
Symbol Characteristic Unit
Installation Classification per DIN VDE 0110 for
Rated Mains Voltage
≤150 V rms
≤300 V rms
≤400 V rms
Climatic Classification
Pollution Degree (DIN VDE 0110, see Table 3)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b1
I to IV
I to IV
I to III
40/125/21
2
VIORM
VPR
849
1592
V peak
V peak
VIORM × 1.875 = VPR, 100% production tested, tm
1 sec, partial discharge < 5 pC
=
Input to Output Test Voltage, Method a
After Environmental Tests, Subgroup 1
After Input and/or Safety Test,
Subgroup 2/Subgroup 3
VPR
VIORM × 1.5 = VPR, tm = 60 sec, partial discharge < 5 pC
VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC
1274
1019
V peak
V peak
Highest Allowable Overvoltage
Reinforced Surge Isolation Voltage
Safety Limiting Values
Transient overvoltage, tTR = 10 sec
VPEAK = 12.8 kV, 1.2 µs rise time, 50 µs, 50% fall time
Maximum value allowed in the event of a failure,
see Figure 2
VIOTM
VIOSM
TS
7000
8000
150
V peak
V peak
°C
Total Power Dissipation at TA = 25°C
Insulation Resistance at TS
PS
RS
1.80
>109
W
Ω
VIO = 500 V
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
50
100
150
AMBIENT TEMPERATURE (°C)
Figure 2. Thermal Derating Curve for RW-16 Wide Body [SOIC_W] Package,
Dependence of Safety Limiting Values with Ambient Temperature per
DIN V VDE V 0884-10
Rev. 0 | Page 6 of 17
Enhanced Product
ADM2795E-EP
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 8. Maximum Continuous Working Voltage1
Parameter
Max Unit
Reference Standard2
Table 7.
AC Voltage
Parameter
Rating
Bipolar Waveform
Basic Insulation
VDD1
−0.5 V to +7 V
849
768
V peak
V peak
50-year minimum
insulation lifetime
VDD2
−0.5 V to +7 V
Digital Input/Output Voltage (DE, RE,
TxD, RxD)
−0.3 V to VDD1 + 0.3 V
Reinforced
Insulation
Lifetime limited by
package creepage
maximum approved
working voltage per
IEC 60950-1
Driver Output/Receiver Input Voltage
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Continuous Total Power Dissipation
Lead Temperature
48 V
−55°C to +125°C
−65°C to +150°C
150°C
Unipolar Waveform
Basic Insulation
1698 V peak
885 V peak
50-year minimum
insulation lifetime
405 mW
Reinforced
Insulation
Lifetime limited by
package creepage
maximum approved
working voltage per
IEC 60950-1
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
300°C
215°C
220°C
ESD (A, B Pins Tested to GND2)
IEC 61000-4-2 Contact Discharge
IEC 62000-4-2 Air Discharge
EFT (A, B Pins Tested to GND2)
IEC 61000-4-4 Level 4 EFT Protection
Surge (A, B Pins Tested to GND2)
8 kV
15 kV
DC Voltage
Basic Insulation
1092 V peak
Lifetime limited by
package creepage
maximum approved
working voltage per
IEC 60950-1
2 kV
4 kV
IEC 61000-4-5 Level 4 Surge
Protection
Reinforced
Insulation
543
V peak
Lifetime limited by
package creepage
maximum approved
working voltage per
IEC 60950-1
EMC Performance from A, B Bus Pins
Across the Isolation Barrier to GND1
ESD
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air Discharge
EFT
IEC 61000-4-4
Surge
9 kV
8 kV
1 The maximum continuous working voltage refers to the continuous voltage
magnitude imposed across the isolation barrier. See the ADM2795E data
sheet for more details.
2 Insulation lifetime for the specified test condition is greater than 50 years.
2 kV
THERMAL RESISTANCE
IEC 61000-4-5
Human Body Model (HBM) ESD
Protection (A, B Pins Tested to GND2)
HBM ESD Protection (All Pins)
4 kV
> 30 kV
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
6 kV
θJA is the natural convection junction to ambient thermal resistance
measured in a one cubic foot sealed enclosure. θJC is the junction to
case thermal resistance.
DO-160G Section 25 ESD Protection Air
Discharge
Field Induced Charged Device Model
ESD (FICDM)
15 kV
1.25 kV
Table 9. Thermal Resistance
Package Type
RW-16
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
1
1
θJA
59.7
θJC
28.3
Unit
°C/W
1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board with no vias. See JEDEC JESD51.
ESD CAUTION
Rev. 0 | Page 7 of 17
ADM2795E-EP
Enhanced Product
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
ADM2795E-EP
V
1
2
3
4
5
6
7
8
16
V
DD2
DD1
GND
15 GND
1
2
TxD
DE
14
13
B
V
DD2
TOP VIEW
(Not to Scale)
RE
12 GND
11
10 GND
2
RxD
NIC
A
2
2
GND
9 GND
1
NOTES
1. NIC = NOT INTERNALLY CONNECTED.
Figure 3. Pin Configuration
Table 10. Pin Function Descriptions
Pin No. Mnemonic Description
1
2
3
4
VDD1
GND1
TxD
DE
1.7 V to 5.5 V Flexible Logic Interface Supply.
Ground 1, Logic Side.
Transmit Data Input. Data to be transmitted by the driver is applied to this input.
Driver Output Enable. A high level on this pin enables the driver differential outputs, A and B. A low level places
them into a high impedance state.
5
RE
Receiver Enable Input. This pin is an active low input. Driving this input low enables the receiver, and driving it high
disables the receiver.
6
7
8
9
10
11
RxD
NIC
GND1
GND2
GND2
A
Receiver Output Data. This output is high when (A – B) > −30 mV and low when (A – B) < –200 mV.
Not Internally Connected. This pin is not internally connected.
Ground 1, Logic Side.
Isolated Ground 2, Bus Side.
Isolated Ground 2, Bus Side.
Noninverting Driver Output/Receiver Input. When the driver is disabled, or when VDD1 or VDD2 is powered down,
Pin A is put into a high impedance state to avoid overloading the bus.
12
13
14
GND2
VDD2
B
Isolated Ground 2, Bus Side.
3 V to 5.5 V Power Supply. Pin 13 must be connected externally to Pin 16.
Inverting Driver Output/Receiver Input. When the driver is disabled, or when VDD1 or VDD2 is powered down, Pin B is
put into a high impedance state to avoid overloading the bus.
15
16
GND2
VDD2
Isolated Ground 2, Bus Side.
3 V to 5.5 V Power Supply. Pin 16 must be connected externally to Pin 13.
Rev. 0 | Page 8 of 17
Enhanced Product
ADM2795E-EP
TYPICAL PERFORMANCE CHARACTERISTICS
100
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
V
1 = V 2 = 5.5V
DD
V
1 = V 2 = 5.5V
DD
DD
DD
90
80
70
60
50
40
30
20
10
0
I
2 54Ω LOAD
DD
I
2 120Ω LOAD
DD
I
2 NO LOAD
DD
I
1
DD
–55
–5
45
TEMPERATURE (°C)
95
–55
–5
45
95
TEMPERATURE (°C)
Figure 4. Supply Current (ICC) vs. Temperature at RL = 54 Ω, 120 Ω, and No
Load; Data Rate = 2.5 Mbps, VDD1 = 5.5 V, VDD2 = 5.5 V
Figure 7. Driver Differential Output Voltage vs. Temperature
60
0
V
1 = 1.7V, V 2 = 3.0V
DD
DD
–0.02
–0.04
–0.06
–0.08
–0.10
–0.12
–0.14
–0.16
50
40
30
20
10
0
I
2 54Ω LOAD
V
= 1.7V, V
= 1.7V, V
= 5.5V, V
= 5.5V, V
= 3.0V
= 3.0V
= 5.5V
= 5.5V
DD
DD1
DD2
DD2
DD2
DD2
PIN A
V
DD1
PIN B
V
I
2 120Ω LOAD
DD1
DD
PIN A
V
DD1
PIN B
I
2 NO LOAD
DD
I
1
DD
–55
–5
45
TEMPERATURE (°C)
95
DRIVER OUTPUT HIGH VOLTAGE (V)
Figure 5. Supply Current (ICC) vs. Temperature at RL = 54 Ω, 120 Ω, and No
Load; Data Rate = 2.5 Mbps, VDD1 = 1.7 V, VDD2 = 3.0 V
Figure 8. Driver Output Current vs. Driver Output High Voltage
0.01
0.14
V
V
= 1.7V,
= 3.0V
–0.04
–0.09
–0.14
–0.19
–0.24
–0.29
–0.34
–0.39
DD1
DD2
0.12
0.10
0.08
0.06
0.04
0.02
0
V
= 1.7V, V
= 1.7V, V
= 5.5V, V
= 5.5V, V
= 3.0V
= 3.0V
= 5.5V
= 5.5V
DD1
DD2
DD2
DD2
DD2
PIN A
V
V
= 4.5V,
DD1
DD2
V
DD1
= 4.5V
PIN B
V
V
= 5.5V,
= 5.5V
V
DD1
DD2
DD1
PIN A
V
DD1
PIN B
0
1
2
3
4
5
6
0
5
10
15
20
25
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT LOW VOLTAGE (V)
Figure 6. Driver Output Current vs. Differential Output Voltage
Figure 9. Driver Output Current vs. Driver Output Low Voltage
Rev. 0 | Page 9 of 17
ADM2795E-EP
Enhanced Product
36
35
34
33
32
31
30
29
28
27
26
45
40
35
30
25
20
15
10
5
V
1 = V 2 = 5.5V
DD
V
= V
= 5V
DD
DD1
DD2
tDPLH
tDPHL
0
–55
–5
45
95
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
TEMPERATURE (°C)
RECEIVER OUTPUT LOW VOLTAGE (V)
Figure 10. Driver Differential Propagation Delay vs. Temperature
Figure 13. Receiver Output Current vs. Receiver Output Low Voltage
6
TxD
V
V
= 5.0V,
= 5.0V
I
= –1mA
DD1
DD2
RxD
5
4
3
2
1
C1
V
OD
M1
V
V
= 1.8V,
= 3.3V
DD1
DD2
0
–55
B
C1 2.0V/DIV 1MΩ
: 500M
A
CH1
2.12V
W
–25
5
35
65
95
125
M1 2.00V
100ns
TEMPERATURE (°C)
Figure 11. Driver Propagation Delay (Oscilloscope)
Figure 14. Receiver Output High Voltage vs. Temperature
–70
–60
–50
–40
–30
–20
–10
0
60
50
40
30
20
10
0
I
= 1mA
RO
V
= V
= 5V
DD2
DD1
V
V
= 1.8V,
= 3.3V
= 5V,
= 5V
DD1
DD2
V
V
DD1
DD2
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
125
95
65
35
5
–25
–55
RECEIVER OUTPUT HIGH VOLTAGE (V)
TEMPERATURE (°C)
Figure 12. Receiver Output Current vs. Receiver Output High Voltage
Figure 15. Receiver Output Low Voltage vs. Temperature
Rev. 0 | Page 10 of 17
Enhanced Product
ADM2795E-EP
140
120
100
80
tPLH
tPHL
A
B
2
V
OD
M1
60
RxD
40
20
3
0
–55
B
C1 2.0V/DIV 1MΩ
C2 2.0V/DIV 1MΩ
C3 2.0V/DIV 1MΩ
: 500M
: 500M
: 500M
A
CH3
2.56V
W
W
W
–25
5
35
65
95
125
100ns/DIV
1.0ns/pt
B
B
TEMPERATURE (°C)
M1 1.4V
100ns
Figure 19. Receiver Propagation Delay vs. Temperature
Figure 16. Receiver Propagation Delay (Oscilloscope)
250
200
150
100
50
A
B
2
PIN B
PIN A
V
OD
M1
RxD
3
0
B
B
B
C1 1.0V
C2 1.0V
1MΩ
1MΩ
: 500M OFFSET: 25.0V
: 500M OFFSET: 25.0V
: 500M
A
CH3
2.56V
15
JUNCTION TEMPERATURE (°C)
W
W
W
–55 –40 –25 –5
35 55 75 95 115 125 130 140
100ns/DIV
1.0ns/pt
C3 2.0V/DIV 1MΩ
M1 600mV 100ns
Figure 20. Receiver Performance with Input Common-Mode Voltage of 25 V
Figure 17. Input Capacitance (A, B) vs. Junction Temperature
80
0.14
0.12
0.10
0.08
70
60
50
40
30
20
10
0
EN55022
EN55022B
V
= 1.7V, V
= 1.7V, V
= 5.5V, V
= 5.5V, V
= 3.0V
= 3.0V
= 5.5V
= 5.5V
DD1
DD2
DD2
DD2
DD2
0.06
0.04
0.02
0
PIN A
V
DD1
PIN B
V
DD1
PIN A
V
DD1
PIN B
30M
100M
FREQUENCY (Hz)
1G
PIN VOLTAGE (V)
Figure 18. Radiated Emissions Profile with 120 pF Capacitor to GND1 on the
RxD Pin (Horizontal Scan, Data Rate = 2.5 Mbps, VDD1 = VDD2 = 5.0 V)
Figure 21. Short-Circuit Current over Fault Voltage Range
Rev. 0 | Page 11 of 17
ADM2795E-EP
Enhanced Product
45
40
35
30
25
20
15
10
5
700
600
500
400
300
200
100
0
0
100k
1M
10M
100M
1G
0
0.25
0.50
1.00
2.00
2.50
DPI FREQUENCY (Hz)
SIGNALING RATE (Mbps)
Figure 22. DPI IEC 62132-4 Noise Immunity with 100 nF and 10 µF
Decoupling on VDD1
Figure 25. Receiver Input Differential Voltage (VID) vs. Signaling Rate
45
40
35
30
25
20
15
10
5
60
50
FALL TIME
40
RISE TIME
30
20
10
0
0
100k
1M
10M
100M
1G
10
100
1000
DPI FREQUENCY (Hz)
LOAD CAPACITANCE (pF)
Figure 26. Receiver Output (RxD) Rise/Fall Time vs. Load Capacitance
Figure 23. DPI IEC 62132-4 Noise Immunity with 100 nF Decoupling on VDD1
45
40
35
30
25
20
15
10
5
0
100k
1M
10M
100M
1G
DPI FREQUENCY (Hz)
Figure 24. DPI IEC 62132-4 Noise Immunity with 100 nF and Decoupling on VDD2
Rev. 0 | Page 12 of 17
Enhanced Product
TEST CIRCUITS
ADM2795E-EP
V
V
DD2
OUT
R
R
A
B
R
L
110Ω
V
OD
TxD
DE
S2
S1
C
L
V
OC
50pF
Figure 30. Driver Enable/Disable
Figure 27. Driver Voltage Measurement
375Ω
A
V
OUT
V
CM
V
RE
OD3
B
60Ω
C
L
375Ω
Figure 31. Receiver Propagation Delay
Figure 28. Driver Voltage Measurement over Common-Mode Voltage Range
+1.5V
–1.5V
V
DD1
A
S1
C
C
L1
R
L
S2
R
LDIFF
RE
C
V
OUT
L
L2
B
RE IN
Figure 29. Driver Propagation Delay
Figure 32. Receiver Enable/Disable
Rev. 0 | Page 13 of 17
ADM2795E-EP
Enhanced Product
SWITCHING CHARACTERISTICS
V
V
DD1
DD1
DE
TxD
0.5V
DD1
0.5V
DD1
0.5V
tZL
0.5V
DD1
DD1
0V
B
0V
tPHL
tPLH
tLZ
1/2V
OD
V
OD
0.5V
DD2
A, B
A, B
V
+ 0.5V
– 0.5V
OL
A
V
V
OL
tSKEW
= |tPLH – tPHL|
tZH
tHZ
+V
O
O
90% POINT
OH
90% POINT
V
OH
V
0.5V
DIFF
DD2
10% POINT
10% POINT
–V
0V
tR
tF
Figure 33. Driver Propagation Delay, Rise/Fall Timing
Figure 35. Driver Enable/Disable Timing
V
DD1
RE
0.5V
tZL
0.5V
DD1
DD1
0V
tLZ
A, B
0V
0V
0.5V
DD1
RxD
V
+ 0.5V
OL
tPLH
tPHL
OUTPUT LOW
V
OL
tHZ
tZH
OUTPUT HIGH
V
OH
V
– 0.5V
0.5V
0.5V
DD1
RxD
0V
OH
DD1
RxD
0.5V
DD1
tSKEW
=
|tPLH
–
tPHL
|
Figure 36. Receiver Enable/Disable Timing
Figure 34. Receiver Propagation Delay
Rev. 0 | Page 14 of 17
Enhanced Product
ADM2795E-EP
THEORY OF OPERATION
the high amounts of energy associated with the DO-160G
RS-485 WITH ADDED DO-160G EMC ROBUSTNESS
Section 22 lightning standard, the ADM2795E-EP was tested
using external 33 Ω or 47 Ω A pin and B pin bus current
limiting resistors for testing to GND2. These resisters were
required in addition to the ADM2795E-EP integrated EMC
protection circuitry. However, when testing to GND1, no
current limiting resistors are required. The ADM2795E-EP
iCoupler isolation technology protects the device in the
presence of these extreme transients.
The ADM2795E-EP is a 3 V to 5.5 V RS-485 transceiver with
added robustness that reduces system failures when operating
in harsh application environments such as military and aerospace
(MILA) avionics for sensors, actuators, and engine control.
Lightning strikes to jet airliners are common, about once every
1000 flight hours. The DO-160G standard, Environmental
Conditions and Test Procedures for Airborne Equipment, is a
standard for the environmental testing of avionics hardware.
Many airplane manufacturers specify DO-160G Section 22,
lightning induced transient susceptibility, as a requirement for
critical systems, like guidance, radars, communications, engine
control, and heat and air controls. Aircraft radome, wing tips,
fin tips, nacelles, and landing gear are areas most likely to be hit
by lightning strikes.
800
DO-160G SECTION 22
WAVEFORM 5A
700
600
500
400
300
200
100
0
The ADM2795E-EP integrates fully certified DO-160G EMC
protection on the RS-485 bus pins, with Section 22 lightning
protection. The ADM2795E-EP also provides Section 25 15 kV
ESD air discharge protection. For Section 22 lightning, the
ADM2795E-EP provides protection against Waveform 3,
Waveform 4/Waveform 1, and Waveform 5A to Level 4 using
33 Ω or 47 Ω current limiting resistors to GND2, or to Level 4
across the isolation barrier to GND1.
DO-160G SECTION 22
WAVEFORM 1
IEC 61000-4-5 SURGE
0
20
40
60
80
100
120
TIME (µs)
Figure 37. DO-160G Section 22 Waveform 1 and Waveform 5A, and IEC61000-4-5
Surge Waveform
CERTIFIED DO-160G EMC PROTECTION
DO-160G ADM2795E-EP TEST DETAILS
Table 11 details the open circuit voltage (VOC) and short-circuit
current (ISC) as specified in the DO-160G Section 22 lightning
induced transient susceptibility standard for Waveform 3,
Waveform 4/Waveform 1, and Waveform 5A for pin injection
testing. The peak currents for the DO-160G Level 4 tests are
much greater than standard industrial surge IEC 61000-4-5
peak currents. The waveform shape and rise/decay times for the
DO-160G standard are significantly longer than those specified
by the IEC 61000-4-5 standard, as shown in Figure 37. Due to
Figure 38 and Figure 39 show the Waveform 3 test setup
coupling/decoupling network (CDN) and the Waveform 5A,
Waveform 4/Waveform 1 CDN, respectively. For testing to
RS-485 bus side, GND2, an additional 33 Ω or 47 Ω current
limiting resistance is added on both A and B bus pins. DO-160G
Section 22 testing is performed on one pin at a time. The test is
not performed in common mode. Table 12 and Table 13 show a
summary of the ADM2795E-EP certified test results.
Table 11. DO-160G Section 22 Pin Injection Level 4 and Level 3 Compared to IEC 61000-4-5 Lightning Level 4 and Level 3
Level
DO-160G Waveform 3
DO-160G Waveform 4/Waveform 1
DO-160G Waveform 5A
IEC 61000-4-5
4
3
1500 V, 60 A
600 V, 24 A
750 V, 150 A
300 V, 60 A
750 V, 750 A
300 V, 300 A
4000 V, 49 A
2000 V, 24.5 A
Table 12. DO-160G Section 22 Pin Injection Level 4 Certified Test Results
Testing to Current Limiting
DO-160 Waveform 3;
1500 V, 60 A
DO-160 Waveform 4/ Waveform 1;
750 V, 150 A
DO-160 Waveform 5A;
750 V ,750 A
GNDx
GND1
GND2
Resistor
None
47 Ω or 33 Ω
Pass
Pass with 47 Ω
Pass
Pass with 33 Ω
Pass
Pass with 33 Ω
Table 13. DO-160G Section 22 Pin Injection Level 3 Certified Test Results
Testing to Current Limiting
DO-160 Waveform 3;
600 V, 24 A
DO-160 Waveform 4/ Waveform 1;
300 V, 60 A
DO-160 Waveform 5A;
300 V ,300 A
GNDx
GND1
GND2
Resistor
None
33 Ω
Pass
Pass
Pass
Pass
Pass
Pass
Rev. 0 | Page 15 of 17
ADM2795E-EP
Enhanced Product
V
V
DD2
DD1
RS-485
TRANSCEIVER
DIGITAL ISOLATOR
ADM2795E-EP
RxD
RE
CDN
40µF
A
B
EMC
TRANSIENT
PROTECTION
CIRCUIT
DE
TxD
GND
GND
2
1
ISOLATION
BARRIER
GND2
GND1
Figure 38. DO-160G Section 22 Waveform 3 Test Setup CDN
V
V
DD2
DD1
RS-485
TRANSCEIVER
DIGITAL ISOLATOR
ADM2795E-EP
RxD
RE
CDN
A
B
EMC
TRANSIENT
PROTECTION
CIRCUIT
DE
TRANSORB
TxD
GND
GND
2
1
ISOLATION
BARRIER
GND2
GND1
Figure 39. DO-160G Section 22 Waveform 5A, Waveform 4/Waveform 1 Test Setup CDN
Rev. 0 | Page 16 of 17
Enhanced Product
ADM2795E-EP
OUTLINE DIMENSIONS
10.50 (0.4134)
10.10 (0.3976)
16
1
9
8
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
0.75 (0.0295)
0.25 (0.0098)
1.27 (0.0500)
BSC
45°
2.65 (0.1043)
2.35 (0.0925)
0.30 (0.0118)
0.10 (0.0039)
8°
0°
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
COMPLIANT TO JEDEC STANDARDS MS-013-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 40. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Temperature
Range
Package
Option
Ordering
Quantity
Model1
Package Description
ADM2795ETRWZ-EP
ADM2795ETRWZ-EP-R7 −55°C to +125°C
EVAL-ADM2795EEPBZ
−55°C to +125°C
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W], 7”Reel
Evaluation Board
RW-16
RW-16
400
1 Z = RoHS Compliant Part.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15664-0-7/17(0)
Rev. 0 | Page 17 of 17
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