ADM489ARUZ-REEL [ADI]

5 V, Slew-Rate Limited, Low Power, 250 kbps, Full Duplex EIA RS-485 Transceiver (with DE/RE);
ADM489ARUZ-REEL
型号: ADM489ARUZ-REEL
厂家: ADI    ADI
描述:

5 V, Slew-Rate Limited, Low Power, 250 kbps, Full Duplex EIA RS-485 Transceiver (with DE/RE)

驱动 信息通信管理 光电二极管 接口集成电路 驱动器
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Full-Duplex, Low Power,  
Slew Rate Limited, EIA RS-485 Transceivers  
ADM488/ADM489  
FEATURES  
FUNCTIONAL BLOCK DIAGRAMS  
Meets EIA RS-485 and RS-422 standards  
250 kbps data rate  
Single 5 V 10% supply  
−7 V to +12 V bus common-mode range  
12 kΩ input impedance  
2 kV EFT protection meets IEC1000-4-4  
High EM immunity meets IEC1000-4-3  
Reduced slew rate for low EM interference  
Short-circuit protection  
ADM488  
A
R
RO  
DI  
B
Z
Y
D
Figure 1.  
Excellent noise immunity  
30 μA supply current  
ADM489  
A
B
APPLICATIONS  
Low power RS-485 and RS-422 systems  
DTE-DCE interface  
Packet switching  
Local area networks  
R
RO  
RE  
DE  
DI  
Z
Y
D
Data concentration  
Data multiplexers  
Integrated services digital network (ISDN)  
Figure 2.  
GENERAL DESCRIPTION  
The receiver contains a fail-safe feature that results in a logic  
high output state if the inputs are unconnected (floating).  
The ADM488 and ADM489 are low power, differential line  
transceivers suitable for communication on multipoint bus  
transmission lines. They are intended for balanced data  
transmission and comply with both Electronics Industries  
Association (EIA) RS-485 and RS-422 standards. Both products  
contain a single differential line driver and a single differential  
line receiver, making them suitable for full-duplex data transfer.  
The ADM489 contains an additional receiver and driver enable  
control.  
The ADM488/ADM489 are fabricated on BiCMOS, an  
advanced mixed technology process combining low power  
CMOS with fast switching bipolar technology.  
The ADM488/ADM489 are fully specified over the industrial  
temperature range and are available in PDIP, SOIC, and TSSOP  
packages.  
The input impedance is 12 kΩ, allowing 32 transceivers to be  
connected on the bus.  
The ADM488/ADM489 operate from a single 5 V 1ꢀ0 power  
supply. Excessive power dissipation caused by bus contention or  
output shorting is prevented by a thermal shutdown circuit.  
This feature forces the driver output into a high impedance state  
if, during fault conditions, a significant temperature increase is  
detected in the internal driver circuitry.  
Rev. D  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2006 Analog Devices, Inc. All rights reserved.  
 
ADM488/ADM489  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Theory of Operation ...................................................................... 11  
EFT Transient Protection Scheme ........................................... 11  
Fast Transient Burst Immunity (IEC1ꢀꢀꢀ-4-4)...................... 11  
Radiated Immunity (IEC1ꢀꢀꢀ-4-3) ......................................... 12  
EMI Emissions............................................................................ 13  
Conducted Emissions ................................................................ 13  
Application Information................................................................ 14  
Differential Data Transmission ................................................ 14  
Cable and Data Rate................................................................... 14  
Outline Dimensions....................................................................... 15  
Ordering Guide .......................................................................... 16  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Functional Block Diagrams............................................................. 1  
Specifications..................................................................................... 3  
Timing Specifications .................................................................. 4  
Absolute Maximum Ratings............................................................ 5  
ESD Caution.................................................................................. 5  
Pin Configurations and Function Descriptions ........................... 6  
Test Circuits................................................................................... 7  
Switching Characteristics ............................................................ 8  
Typical Performance Characteristics ............................................. 9  
REVISION HISTORY  
4/06—Rev. C to Rev. D  
Updated Outline Dimensions....................................................... 15  
Changes to Ordering Guide .......................................................... 16  
11/04—Rev. B to Rev. C  
Updated Format..................................................................Universal  
Changes to Receiving Truth Table Inputs Data Section............ 11  
Renamed General Information to Theory of Operation........... 12  
Updated Outline Dimensions....................................................... 15  
Changes to Ordering Guide .......................................................... 16  
5/01—Rev. A to Rev. B  
Changes to Absolute Maximum Ratings Section......................... 3  
3/01—Rev. 0 to Rev. A  
Changes to ESD Specification, Absolute Maximum Ratings...... 3  
6/97—Revision 0: Initial Version  
Rev. D | Page 2 of 16  
ADM488/ADM489  
SPECIFICATIONS  
VCC = 5 V 1ꢀ0. All specifications TMIN to TMAX, unless otherwise noted.  
Table 1.  
Parameter  
Min  
Typ  
Max  
Unit  
Test Conditions/Comments  
DRIVER  
Differential Output Voltage, VOD  
5.0  
5.0  
5.0  
5.0  
0.2  
3
0.2  
250  
250  
0.8  
V
V
V
V
V
V
V
mA  
mA  
V
V
μA  
R = ∞, see Figure 6  
2.0  
1.5  
1.5  
VCC = 5 V, R = 50 Ω (RS-422), see Figure 6  
R = 27 Ω (RS-485), see Figure 6  
VTST = –7 V to +12 V, see Figure 7, VCC = 5 V 5ꢀ  
R = 27 Ω or 50 Ω, see Figure 6  
R = 27 Ω or 50 Ω, see Figure 6  
R = 27 Ω or 50 Ω  
Δ|VOD| for Complementary Output States  
Common-Mode Output Voltage, VOC  
Δ|VOC| for Complementary Output States  
Output Short-Circuit Current (VOUT = High)  
Output Short-Circuit Current (VOUT = Low)  
CMOS Input Logic Threshold Low, VINL  
CMOS Input Logic Threshold High, VINH  
Logic Input Current (DE, DI)  
−7 V ≤ VO ≤ +12 V  
−7 V ≤ VO ≤ +12 V  
1.4  
1.4  
2.0  
1.0  
RECEIVER  
Differential Input Threshold Voltage, VTH  
Input Voltage Hysteresis, Δ VTH  
Input Resistance  
−0.2  
12  
+0.2  
V
−7 V ≤ VCM ≤ +12 V  
VCM = 0 V  
−7 V ≤ VCM ≤ +12 V  
VIN = 12 V  
70  
mV  
kΩ  
mA  
mA  
μA  
V
V
mA  
μA  
Input Current (A, B)  
1
−0.8  
1
VIN = –7 V  
Logic Enable Input Current (RE)  
CMOS Output Voltage Low, VOL  
CMOS Output Voltage High, VOH  
Short-Circuit Output Current  
Three-State Output Leakage Current  
POWER SUPPLY CURRENT  
ICC  
0.4  
IOUT = +4.0 mA  
IOUT = −4.0 mA  
VOUT = GND or VCC  
0.4 V ≤ VOUT ≤ +2.4 V  
Outputs unloaded, receivers enabled  
DE = 0 V (disabled)  
DE = 5 V (enabled)  
4.0  
7
85  
1.0  
30  
37  
60  
74  
μA  
μA  
Rev. D | Page 3 of 16  
 
ADM488/ADM489  
TIMING SPECIFICATIONS  
VCC = 5 V 1ꢀ0. All specifications TMIN to TMAX, unless otherwise noted.  
Table 2.  
Parameter  
Min Typ  
Max  
Unit  
Test Conditions/Comments  
DRIVER  
Propagation Delay Input to Output, TPLH, TPHL  
250  
100  
250  
2000  
800  
ns  
ns  
ns  
RL Differential = 54 Ω, CL1 = CL2 = 100 pF,  
see Figure 10  
RL Differential = 54 Ω, CL1 = CL2 = 100 pF,  
see Figure 10  
RL Differential = 54 Ω, CL1 = CL2 = 100 pF,  
see Figure 10  
Driver O/P to OP, TSKEW  
Driver Rise/Fall Time, TR, TF  
2000  
Driver Enable to Output Valid  
Driver Disable Timing  
Data Rate  
250  
300  
250  
2000  
3000  
ns  
ns  
kbps  
RL = 500 Ω, CL = 100 pF, see Figure 7  
RL = 500 Ω, CL = 15 pF, see Figure 7  
RECEIVER  
Propagation Delay Input to Output, TPLH, TPHL  
250  
100  
10  
2000  
ns  
ns  
ns  
ns  
CL = 15 pF, see Figure 10  
Skew |TPLH − TPHL  
|
Receiver Enable, TEN1  
Receiver Disable, TEN2  
Data Rate  
50  
50  
RL = 1 kΩ, CL = 15 pF, see Figure 9  
RL = 1 kΩ, CL = 15 pF, see Figure 9  
10  
250  
kbps  
Rev. D | Page 4 of 16  
 
ADM488/ADM489  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Table 3.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
VCC  
7 V  
Inputs  
Driver Input (DI)  
−0.3 V to VCC + 0.3 V  
−0.3 V to VCC + 0.3 V  
−14 V to +14 V  
Control Inputs (DE, RE)  
Receiver Inputs (A, B)  
Outputs  
Driver Outputs  
Receiver Output  
−14 V to +12.5 V  
−0.5 V to VCC + 0.5 V  
700 mW  
120°C/W  
520 mW  
110°C/W  
800 mW  
140°C/W  
800 mW  
Power Dissipation 8-Lead PDIP  
θJA, Thermal Impedance  
Power Dissipation 8-Lead SOIC  
θJA, Thermal Impedance  
Power Dissipation 14-Lead PDIP  
θJA, Thermal Impedance  
Power Dissipation 14-Lead SOIC  
θJA, Thermal Impedance  
Power Dissipation 16-Lead TSSOP  
θJA, Thermal Impedance  
Operating Temperature Range  
Industrial (A Version)  
Storage Temperature Range  
120°C/W  
800 mW  
150°C/W  
−40°C to +85°C  
−65°C to +150°C  
Lead Temperature (Soldering, 10 sec) 300°C  
Vapor Phase (60 sec)  
Infrared (15 sec)  
ESD Association S5.1 HBM Standard  
EFT Rating, IEC1000-4-4  
215°C  
220°C  
3 kV  
2 kV  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. D | Page 5 of 16  
 
ADM488/ADM489  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
V
1
2
3
4
8
7
6
5
A
B
Z
CC  
ADM488  
RO  
DI  
TOP VIEW  
(Not to Scale)  
GND  
Y
Figure 3. ADM488 8-Lead PDIP/SOIC Pin Configuration  
Table 4. ADM488 Pin Function Descriptions  
Pin No.  
Mnemonic  
Description  
1
2
3
4
5
6
7
8
VCC  
RO  
DI  
GND  
Y
Z
B
A
Power Supply, 5 V 10ꢀ.  
Receiver Output. When A > B by 200 mV, RO = high. If A < B by 200 mV, RO = low.  
Driver Input. A logic low on DI forces Y low and Z high, while a logic high on DI forces Y high and Z low.  
Ground Connection, 0 V.  
Noninverting Driver, Output Y.  
Inverting Driver, Output Z.  
Inverting Receiver, Input B.  
Noninverting Receiver, Input A.  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
V
NC  
A
CC  
NC  
RO  
NC  
RO  
1
B
14  
V
CC  
ADM489  
TOP VIEW  
2
3
4
5
6
7
13 NC  
RE  
NC  
Z
(Not to Scale)  
ADM489  
RE  
12  
11  
10  
9
A
DE  
TOP VIEW  
(Not to Scale)  
DE  
B
DI  
Y
DI  
Z
GND  
GND  
NC  
NC  
GND  
GND  
Y
8
NC  
NC = NO CONNECT  
NC = NO CONNECT  
Figure 4. ADM489 14-Lead PDIP/SOIC Pin Configuration  
Figure 5. ADM489 16-Lead TSSOP Pin Configuration  
Table 5. ADM489 Pin Function Descriptions  
PDIP/SOIC  
Pin No.  
TSSOP  
Pin No.  
Mnemonic Description  
1, 8, 13  
2, 9, 10, 13,  
16  
NC  
RO  
RE  
DE  
DI  
No Connect. No connections are required to this pin.  
2
3
4
5
3
4
5
6
Receiver Output. When enabled, if A > B by 200 mV then RO = high. If A < B by 200 mV then  
RO = low.  
Receiver Output Enable. A low level enables the receiver output, RO. A high level places it in a  
high impedance state.  
Driver Output Enable. A high level enables the driver differential outputs, Y and Z. A low level  
places it in a high impedance state.  
Driver Input. When the driver is enabled, a logic low on DI forces Y low and Z high, while a logic  
high on DI forces Y high and Z low.  
6, 7  
9
10  
11  
12  
14  
7, 8  
11  
12  
14  
15  
1
GND  
Y
Z
B
A
Ground Connection, 0 V.  
Noninverting Driver, Output Y.  
Inverting Driver, Output Z.  
Inverting Receiver, Input B.  
Noninverting Receiver, Input A.  
Power Supply, 5 V 10ꢀ.  
VCC  
Rev. D | Page 6 of 16  
 
ADM488/ADM489  
TEST CIRCUITS  
V
CC  
R
R
A
B
V
OD  
R
L
0V OR 3V  
DE IN  
S1  
S2  
V
DE  
OC  
C
V
L
OUT  
Figure 8. Driver Voltage Measurement Test Circuit 2  
Figure 6. Driver Voltage Measurement Test Circuit  
V
CC  
+1.5V  
375  
S1  
R
L
S2  
RE  
–1.5V  
V
C
L
60Ω  
375Ω  
OD3  
V
TST  
V
OUT  
RE IN  
Figure 9. Receiver Enable/Disable Test Circuit  
3V  
DE  
Figure 7. Driver Enable/Disable Test Circuit  
A
B
C
C
Y
Z
L1  
RO  
DI  
RL  
D
DIFF  
R
L2  
RE  
Figure 10. Driver/Receiver Propagation Delay Test Circuit  
Rev. D | Page 7 of 16  
 
 
 
 
 
ADM488/ADM489  
SWITCHING CHARACTERISTICS  
3V  
3V  
0V  
1.5V  
1.5V  
T
PLH  
1.5V  
LZ  
DE  
A, B  
A, B  
1.5V  
0V  
T
PHL  
B
T
ZL  
T
1/2VO  
VO  
A
2.3V  
2.3V  
V
+ 0.5V  
OL  
T
T
SKEW  
SKEW  
V
V
OL  
OH  
+VO  
90% POINT  
90% POINT  
T
T
ZH  
HZ  
0V  
V
– 0.5V  
OH  
10% POINT  
10% POINT  
–VO  
T
R
T
F
0V  
Figure 11. Driver Propagation Delay, Rise/Fall Timing  
Figure 13. Driver Enable/Disable Timing  
3V  
0V  
RE  
1.5V  
1.5V  
T
T
ZL  
LZ  
0V  
0V  
A–B  
R
1.5V  
1.5V  
V
+ 0.5V  
O/P LOW  
O/P HIGH  
OL  
V
V
OL  
T
T
PLH  
PHL  
T
T
ZH  
HZ  
V
V
OH  
OH  
RO  
V
– 0.5V  
1.5V  
1.5V  
OH  
R
0V  
OL  
Figure 14. Receiver Enable/Disable Timing  
Figure 12. Receiver Propagation Delay  
Rev. D | Page 8 of 16  
 
ADM488/ADM489  
TYPICAL PERFORMANCE CHARACTERISTICS  
40  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
35  
30  
25  
20  
15  
10  
5
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
0
0.5  
1.0  
1.5  
2.0  
2.5  
OUTPUT VOLTAGE (V)  
OUTPUT VOLTAGE (V)  
Figure 15. Output Current vs. Receiver Output Low Voltage  
Figure 18. Output Current vs. Driver Output High Voltage  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
–5  
–10  
–15  
–20  
3.4  
3.6  
3.8  
4.0  
4.2  
4.4  
4.6  
4.8  
5.0  
0
0.5  
1.0  
1.5  
OUTPUT VOLTAGE (V)  
3.5  
4.5  
2.0  
2.5  
3.0  
4.0  
OUTPUT VOLTAGE (V)  
Figure 16. Output Current vs. Receiver Output High Voltage  
Figure 19. Output Current vs. Driver Differential Output Voltage  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
T
100  
T
T
90  
RO  
DI  
10  
0%  
0
3.0  
0.5  
1.0  
1.5  
2.0  
2.5  
OUTPUT VOLTAGE (V)  
Figure 17. Output Current vs. Driver Output Low Voltage  
Figure 20. Driving 4000 Ft. of Cable  
Rev. D | Page 9 of 16  
 
ADM488/ADM489  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
LIMIT  
10  
0%  
0.3  
0.6  
1
3
6
10  
30  
0
500kHz/DIV  
5MHz  
log FREQUENCY (0.15–30) (MHz)  
Figure 23. Conducted Emissions  
Figure 21. Driver Output Waveform and FFT Plot Transmitting at 150 kHz  
80  
70  
60  
50  
40  
30  
20  
10  
0
LIMIT  
30  
200  
FREQUENCY (MHz)  
Figure 22. Radiated Emissions  
Rev. D | Page 10 of 16  
ADM488/ADM489  
THEORY OF OPERATION  
The ADM488/ADM489 are ruggedized RS-485 transceivers  
that operate from a single 5 V supply. They contain protection  
against radiated and conducted interference and are ideally  
suited for operation in electrically harsh environments or where  
cables can be plugged/unplugged. They are also immune to  
high RF field strengths without special shielding precautions.  
They are intended for balanced data transmission and comply  
with both EIA RS-485 and RS-422 standards. They contain a  
differential line driver and a differential line receiver, and are  
suitable for full-duplex data transmission.  
Table 6 and Table 7 show the truth tables for transmitting and  
receiving.  
Table 6. Transmitting Truth Table  
Inputs  
Outputs  
RE  
DE  
DI  
Z
Y
X1  
X1  
0
1
1
0
0
1
0
X1  
X1  
0
1
Hi-Z  
Hi-Z  
1
0
Hi-Z  
Hi-Z  
1
1 X = Don’t care.  
The input impedance on the ADM488/ADM489 is 12 kΩ,  
allowing up to 32 transceivers on the differential bus. The  
ADM488/ADM489 operate from a single 5 V 1ꢀ0 power  
supply. A thermal shutdown circuit prevents excessive power  
dissipation caused by bus contention or by output shorting.  
This feature forces the driver output into a high impedance state  
if, during fault conditions, a significant temperature increase is  
detected in the internal driver circuitry.  
Table 7. Receiving Truth Table  
Inputs  
Output  
RO  
RE  
DE  
A to B  
0
0
0
1
0
0
0
0
≥ +0.2 V  
0.2 V  
Inputs O/C  
X1  
1
0
1
Hi-Z  
1 X = Don’t care.  
The receiver contains a fail-safe feature that results in a logic  
high output state if the inputs are unconnected (floating). A  
high level of robustness is achieved using internal protection  
circuitry, eliminating the need for external protection com-  
ponents such as tranzorbs or surge suppressors. Furthermore,  
low electromagnetic emissions are achieved using slew limited  
drivers, minimizing interference both conducted and radiated.  
EFT TRANSIENT PROTECTION SCHEME  
The ADM488/ADM489 use protective clamping structures on  
their inputs and outputs that clamp the voltage to a safe level  
and dissipate the energy present in ESD (electrostatic) and EFT  
(electrical fast transients) discharges.  
FAST TRANSIENT BURST IMMUNITY (IEC1000-4-4)  
The ADM488/ADM489 can transmit at data rates up to  
25ꢀ kbps. A typical application for the ADM488/ADM489 is  
illustrated in Figure 24 showing a full-duplex link where data is  
transferred at rates of up to 25ꢀ kbps. A terminating resistor is  
shown at both ends of the link. This termination is not critical  
because the slew rate is controlled by the ADM488/ADM489  
and reflections are minimized.  
IEC1ꢀꢀꢀ-4-4 (previously 8ꢀ1-4) covers electrical fast transient  
burst (EFT) immunity. Electrical fast transients occur as a result  
of arcing contacts in switches and relays. The tests simulate the  
interference generated when, for example, a power relay disconnects  
an inductive load. A spark is generated due to the well known  
back EMF effect. In fact, the spark consists of a burst of sparks  
as the relay contacts separate. The voltage appearing on the line,  
therefore, consists of a burst of extremely fast transient impulses.  
A similar effect occurs when switching on fluorescent lights.  
5V  
5V  
0.1µF  
0.1µF  
V
V
CC  
CC  
DE  
DI  
RE  
RO  
The fast transient burst test, defined in IEC1ꢀꢀꢀ-4-4, simulates  
this arcing, and its waveform is illustrated in Figure 25. It  
consists of a burst of 2.5 kHz to 5 kHz transients repeating at  
3ꢀꢀ ms intervals. It is specified for both power and data lines.  
A
B
Y
Z
R
D
ADM488  
ADM489  
RS-485/RS-422 LINK  
Z
Y
B
A
DI  
RO  
RE  
R
D
Four severity levels are defined in terms of an open-circuit voltage  
as a function of installation environment. The installation  
environments are defined as  
DE  
GND  
GND  
Figure 24. ADM488/ADM489 Full-Duplex Data Link  
Well protected  
Protected  
The communications network can be extended to include  
multipoint connections, as shown in Figure 3ꢀ. As many as  
32 transceivers can be connected to the bus.  
Typical industrial  
Severe industrial  
Rev. D | Page 11 of 16  
 
 
 
 
 
 
 
ADM488/ADM489  
V
Test results are classified according to the following:  
Normal performance within specification limits.  
t
Temporary degradation or loss of performance that is self-  
recoverable.  
300ms  
16ms  
V
Temporary degradation or loss of function or performance  
that requires operator intervention or system reset.  
5ns  
Degradation or loss of function that is not recoverable due  
to damage.  
50ns  
t
0.2/0.4ms  
The ADM488/ADM489 have been tested under worst-case  
conditions using unshielded cables, and meet Classification 2 at  
Severity Level 4. Data transmission during the transient  
condition is corrupted, but it can be resumed immediately  
following the EFT event without user intervention.  
Figure 25. IEC1000-4-4 Fast Transient Waveform  
Table 8 shows the peak voltages for each of the environments.  
Table 8. Peak Voltages  
Level  
VPEAK (kV) PSU  
VPEAK (kV) I/O  
RADIATED IMMUNITY (IEC1000-4-3)  
1
2
3
4
0.5  
1
2
0.25  
0.5  
1
IEC1ꢀꢀꢀ-4-3 (previously IEC8ꢀ1-3) describes the measurement  
method and defines the levels of immunity to radiated electro-  
magnetic fields. It was originally intended to simulate the  
electromagnetic fields generated by portable radio transceivers  
or any other device that generates continuous wave-radiated  
electromagnetic energy. Its scope has been broadened to include  
spurious EM energy, which can be radiated from fluorescent  
lights, thyristor drives, inductive loads, and so on.  
4
2
A simplified circuit diagram of the actual EFT generator is  
shown in Figure 26.  
These transients are coupled onto the signal lines using an EFT  
coupling clamp. The clamp is 1 m long and completely sur-  
rounds the cable, providing maximum coupling capacitance  
(5ꢀ pF to 2ꢀꢀ pF typical) between the clamp and the cable. High  
energy transients are capacitively coupled onto the signal lines.  
Fast rise times (5 ns), as specified by the standard, result in very  
effective coupling. This test is very severe because high voltages  
are coupled onto the signal lines. The repetitive transients often  
cause problems, while single pulses do not. Destructive latch-up  
can be induced due to the high energy content of the transients.  
Note that this stress is applied while the interface products are  
powered up and transmitting data. The EFT test applies hun-  
dreds of pulses with higher energy than ESD. Worst-case  
transient current on an I/O line can be as high as 4ꢀ A.  
Testing for immunity involves irradiating the device with an  
EM field. Test methods include the use of anechoic chamber,  
stripline cell, TEM cell, and GTEM cell. These consist of two  
parallel plates with an electric field developed between them.  
The device under test is placed between the plates and exposed  
to the electric field. The three severity levels have field strengths  
ranging from 1 V/m to 1ꢀ V/m. Results are classified as follows:  
Normal operation.  
Temporary degradation or loss of function that is self-  
recoverable when the interfering signal is removed.  
Temporary degradation or loss of function that requires  
operator intervention or system reset when the interfering  
signal is removed.  
C
D
R
R
M
L
HIGH  
VOLTAGE  
SOURCE  
C
50  
OUTPUT  
Z
C
S
C
Degradation or loss of function that is not recoverable due  
to damage.  
Figure 26. EFT Generator  
Rev. D | Page 12 of 16  
 
 
 
 
ADM488/ADM489  
The ADM488/ADM489 comfortably meet Classification 1 at  
the most stringent (Level 3) requirement. In fact, field strengths  
up to 3ꢀ V/m showed no performance degradation, and error-  
free data transmission continued even during irradiation.  
The objective is to control the level of both conducted and  
radiated emissions.  
For ease of measurement and analysis, conducted emissions are  
assumed to predominate below 3ꢀ MHz, while radiated  
emissions predominate above this frequency.  
Table 9. Field Strengths  
Level V/m  
Field Strength  
CONDUCTED EMISSIONS  
1
2
3
1
3
10  
Conducted emissions are a measure of noise that is conducted  
onto the main power supply. The noise is measured using a  
LISN (line impedance stabilizing network) and a spectrum  
analyzer. The test setup is shown in Figure 28. The spectrum  
analyzer is set to scan the spectrum from ꢀ MHz to 3ꢀ MHz.  
Figure 29 shows that the level of conducted emissions from the  
ADM488/ADM489 is well below the maximum allowable  
limits.  
EMI EMISSIONS  
The ADM488/ADM489 contain internal slew rate limiting to  
minimize the level of electromagnetic interference generated.  
Figure 27 shows an FFT plot when transmitting a 15ꢀ kHz data  
stream.  
SPECTRUM  
ANALYZER  
100  
90  
DUT  
LISN  
PSU  
Figure 28. Conducted Emissions Test Setup  
10dB/DIV  
80  
70  
60  
50  
40  
30  
20  
10  
0
10  
0%  
LIMIT  
0
500kHz/DIV  
5MHz  
Figure 27. Driver Output Waveform and FFT Plot Transmitting at 150 kHz  
The slew limiting attenuates the high frequency components.  
EMI is, therefore, reduced, as are reflections due to improperly  
terminated cables.  
0.6  
36  
10  
0.3  
1
30  
EN55ꢀ22, CISPR22 defines the permitted limits of radiated and  
conducted interference from information technology  
equipment (ITE).  
log FREQUENCY (0.15–30) (MHz)  
Figure 29. Conducted Emissions  
Rev. D | Page 13 of 16  
 
 
 
 
ADM488/ADM489  
APPLICATION INFORMATION  
DIFFERENTIAL DATA TRANSMISSION  
CABLE AND DATA RATE  
Differential data transmission is used to reliably transmit data at  
high rates over long distances and through noisy environments.  
Differential transmission nullifies the effects of ground shifts  
and noise signals, which appear as common-mode voltages on  
the line. Two main standards that specify the electrical  
characteristics of transceivers used in differential data  
transmission are approved by the EIA.  
The transmission line of choice for RS-485 communications is a  
twisted pair. Twisted-pair cable tends to cancel common-mode  
noise and also causes cancellation of the magnetic fields gener-  
ated by the current flowing through each wire, thereby reducing  
the effective inductance of the pair.  
The ADM488/ADM489 are designed for bidirectional data  
communications on multipoint transmission lines. A typical  
application showing a multipoint transmission network is  
illustrated in Figure 3ꢀ. An RS-485 transmission line can have  
up to 32 transceivers on the bus. Only one driver can transmit  
at a particular time, but multiple receivers can be simultane-  
ously enabled.  
The RS-422 standard specifies data rates up to 1ꢀ MBaud and  
line lengths up to 4ꢀꢀꢀ ft. A single driver can drive a transmis-  
sion line with up to 1ꢀ receivers.  
To cater to true multipoint communications, the RS-485 stan-  
dard was defined to meet or exceed the requirements of RS-422.  
It also allows up to 32 drivers and 32 receivers to be connected  
to a single bus. An extended common-mode range of −7 V to  
+12 V is defined. The most significant difference between the  
RS-422 and RS-485 is that the RS-485 drivers can be disabled,  
thereby allowing up to 32 receivers to be connected to a single  
line. Only one driver should be enabled at a time, but the RS-  
485 standard contains additional specifications to guarantee  
device safety in the event of line contention.  
As with any transmission line, it is important that reflections be  
minimized. This can be achieved by terminating the extreme  
ends of the line using resistors equal to the characteristic im-  
pedance of the line. Stub lengths of the main line should also be  
kept as short as possible. A properly terminated transmission  
line appears purely resistive to the driver.  
Table 10. Comparison of RS-422 and RS-485 Interface Standards  
Specification  
RS-422  
Differential  
10 MB/s  
4000 ft.  
2 V  
RS-485  
Transmission Type  
Maximum Data Rate  
Differential  
10 MB/s  
4000 ft.  
1.5 V  
54 Ω  
12 kΩ minimum  
200 mV  
−7 V to +12 V  
32/32  
Maximum Cable Length  
Minimum Driver Output Voltage  
Driver Load Impedance  
Receiver Input Resistance  
Receiver Input Sensitivity  
Receiver Input Voltage Range  
Number of Drivers/Receivers per Line  
RT  
100 Ω  
4 kΩ minimum  
200 mV  
−7 V to +7 V  
1/10  
RT  
D
D
R
R
R
R
D
D
Figure 30. Typical RS-485 Network  
Rev. D | Page 14 of 16  
 
 
ADM488/ADM489  
OUTLINE DIMENSIONS  
0.400 (10.16)  
0.365 (9.27)  
0.355 (9.02)  
0.775 (19.69)  
0.750 (19.05)  
0.735 (18.67)  
14  
1
8
7
8
1
5
4
0.280 (7.11)  
0.250 (6.35)  
0.240 (6.10)  
0.280 (7.11)  
0.250 (6.35)  
0.240 (6.10)  
0.325 (8.26)  
0.310 (7.87)  
0.300 (7.62)  
0.325 (8.26)  
0.310 (7.87)  
0.300 (7.62)  
PIN 1  
PIN 1  
0.100 (2.54)  
BSC  
0.100 (2.54)  
BSC  
0.060 (1.52)  
MAX  
0.195 (4.95)  
0.130 (3.30)  
0.115 (2.92)  
0.060 (1.52)  
MAX  
0.195 (4.95)  
0.130 (3.30)  
0.115 (2.92)  
0.210  
(5.33)  
MAX  
0.210  
(5.33)  
MAX  
0.015  
(0.38)  
MIN  
0.015  
(0.38)  
MIN  
0.150 (3.81)  
0.130 (3.30)  
0.110 (2.79)  
0.150 (3.81)  
0.130 (3.30)  
0.115 (2.92)  
0.015 (0.38)  
GAUGE  
0.015 (0.38)  
GAUGE  
0.014 (0.36)  
0.010 (0.25)  
0.008 (0.20)  
PLANE  
0.014 (0.36)  
0.010 (0.25)  
0.008 (0.20)  
PLANE  
SEATING  
PLANE  
SEATING  
PLANE  
0.022 (0.56)  
0.018 (0.46)  
0.014 (0.36)  
0.022 (0.56)  
0.018 (0.46)  
0.014 (0.36)  
0.430 (10.92)  
MAX  
0.005 (0.13)  
MIN  
0.430 (10.92)  
MAX  
0.005 (0.13)  
MIN  
0.070 (1.78)  
0.050 (1.27)  
0.045 (1.14)  
0.070 (1.78)  
0.060 (1.52)  
0.045 (1.14)  
COMPLIANT TO JEDEC STANDARDS MS-001-AA  
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.  
COMPLIANT TO JEDEC STANDARDS MS-001-BA  
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.  
Figure 31. 8-Lead Plastic Dual In-Line Package [PDIP]  
Figure 33. 14-Lead Plastic Dual In-Line Package [PDIP]  
Narrow Body  
(N-8)  
Dimensions shown in inches and (millimeters)  
Narrow Body  
(N-14)  
Dimensions shown in inches and (millimeters)  
5.00 (0.1968)  
4.80 (0.1890)  
8.75 (0.3445)  
8.55 (0.3366)  
8
1
5
4
14  
1
8
7
6.20 (0.2440)  
5.80 (0.2284)  
4.00 (0.1575)  
3.80 (0.1496)  
6.20 (0.2441)  
5.80 (0.2283)  
4.00 (0.1574)  
3.80 (0.1497)  
1.27 (0.0500)  
BSC  
0.50 (0.0197)  
0.25 (0.0098)  
1.27 (0.0500)  
BSC  
0.50 (0.0196)  
0.25 (0.0099)  
1.75 (0.0689)  
1.35 (0.0531)  
× 45°  
× 45°  
1.75 (0.0688)  
1.35 (0.0532)  
0.25 (0.0098)  
0.10 (0.0039)  
0.25 (0.0098)  
0.10 (0.0040)  
8°  
0°  
8°  
0.51 (0.0201)  
0.31 (0.0122)  
SEATING  
PLANE  
0.51 (0.0201)  
0.31 (0.0122)  
1.27 (0.0500)  
0.40 (0.0157)  
COPLANARITY  
0.10  
0.25 (0.0098)  
0.17 (0.0067)  
0° 1.27 (0.0500)  
COPLANARITY  
0.10  
0.25 (0.0098)  
0.17 (0.0067)  
SEATING  
PLANE  
0.40 (0.0157)  
COMPLIANT TO JEDEC STANDARDS MS-012-AB  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
COMPLIANT TO JEDEC STANDARDS MS-012-AA  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
Figure 32. 8-Lead Standard Small Outline Package [SOIC_N]  
Figure 34. 14-Lead Standard Small Outline Package [SOIC_N]  
Narrow Body  
(R-8)  
Narrow Body  
(R-14)  
Dimensions show in millimeters and (inches)  
Dimensions shown in millimeters and (inches)  
Rev. D | Page 15 of 16  
 
ADM488/ADM489  
5.10  
5.00  
4.90  
16  
9
8
4.50  
4.40  
4.30  
6.40  
BSC  
1
PIN 1  
1.20  
MAX  
0.15  
0.05  
0.20  
0.09  
0.75  
0.60  
0.45  
8°  
0°  
0.30  
0.19  
0.65  
BSC  
SEATING  
PLANE  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-153-AB  
Figure 35. 16-Lead Thin Shrink Small Outline Package [TSSOP]  
(RU-16)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model  
ADM488AN  
ADM488ANZ1  
Temperature Range Package Description  
8-Lead Plastic Dual In-Line Package [PDIP]  
8-Lead Plastic Dual In-Line Package [PDIP]  
Package Option  
N-8  
N-8  
R-8  
R-8  
R-8  
R-8  
R-8  
R-8  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
ADM488AR  
8-Lead Standard Small Outline Package [SOIC_N]  
8-Lead Standard Small Outline Package [SOIC_N]  
8-Lead Standard Small Outline Package [SOIC_N]  
8-Lead Standard Small Outline Package [SOIC_N]  
8-Lead Standard Small Outline Package [SOIC_N]  
8-Lead Standard Small Outline Package [SOIC_N]  
14-Lead Plastic Dual In-Line Package [PDIP]  
ADM488AR-REEL  
ADM488AR-REEL7  
ADM488ARZ1  
ADM488ARZ-REEL1  
ADM488ARZ-REEL71  
ADM489AN  
N-14  
N-14  
R-14  
R-14  
R-14  
R-14  
R-14  
R-14  
RU-16  
RU-16  
RU-16  
RU-16  
RU-16  
RU-16  
ADM489ANZ1  
ADM489AR  
14-Lead Plastic Dual In-Line Package [PDIP]  
14-Lead Standard Small Outline Package [SOIC_N]  
14-Lead Standard Small Outline Package [SOIC_N]  
14-Lead Standard Small Outline Package [SOIC_N]  
14-Lead Standard Small Outline Package [SOIC_N]  
14-Lead Standard Small Outline Package [SOIC_N]  
14-Lead Standard Small Outline Package [SOIC_N]  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
ADM489AR-REEL  
ADM489AR-REEL7  
ADM489ARZ1  
ADM489ARZ-REEL1  
ADM489ARZ-REEL71  
ADM489ARU  
ADM489ARU-REEL  
ADM489ARU-REEL7  
ADM489ARUZ1  
ADM489ARUZ-REEL1  
ADM489ARUZ-REEL71  
1 Z = Pb-free part.  
©2006 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
C00079-0-4/06(D)  
Rev. D | Page 16 of 16  
 
 
 

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