ADMP401-1 [ADI]
Omnidirectional Microphone with Bottom Port and Analog Output; 全向麦克风与底部端口和模拟输出
| 型号： | ADMP401-1 |
| 厂家： | 
ADI |
| 描述： | Omnidirectional Microphone with Bottom Port and Analog Output |
| 文件： | 总8页 (文件大小：184K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Omnidirectional Microphone with
Bottom Port and Analog Output
Preliminary Technical Data
ADMP401-1
FEATURES
GENERAL DESCRIPTION
4.72 mm × 3.76 mm × 1.0 mm surface mount package
High SNR: 62 dBA
High sensitivity: −37 dBV
Flat frequency response from 100 Hz to over 12 kHz
Low current consumption: <200 μA
Single-ended analog output
High PSRR: >50 dB
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant
The ADMP401-1 is a high quality, low cost, low power analog
output bottom-ported omnidirectional MEMS microphone.
The ADMP401-1 consists of a MEMS microphone element and
an output amplifier. The ADMP401-1 has a high SNR and high
sensitivity, making it an excellent choice for far field applications.
The ADMP401-1 has a flat wideband frequency response
resulting in natural sound with high intelligibility. Low current
consumption enables long battery life for portable applications.
A built-in particle filter provides for high reliability.
The ADMP401-1 is available in a thin 4.72 mm × 3.76 mm ×
1.0 mm surface mount package. The ADMP401-1 is reflow
solder compatible with no sensitivity degradation.
APPLICATIONS
Cell phones
PC audio
Digital cameras
Bluetooth headsets
FUNCTIONAL BLOCK DIAGRAM
–
MEMS
ASIC
OUTPUT
DRIVER
OUTPUT
+
BUFFER
MEMS
SIGNAL
V
DD
GND
MEMBRANE
BACKPLATE
REFERENCE VOLTAGE
BIAS CURRENT
MEMS
V
BIAS
CHARGE
PUMP
FILTER
GENERATOR
Figure 1.
Rev. PrB
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2008 Analog Devices, Inc. All rights reserved.
ADMP401-1
Preliminary Technical Data
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Performance Characteristics ..............................................6
Handling Instructions.......................................................................7
Pick-and-Place Equipment ..........................................................7
Reflow Solder.................................................................................7
Board Wash ....................................................................................7
Outline Dimensions..........................................................................8
Ordering Guide .............................................................................8
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Rev. PrB | Page 2 of 8
Preliminary Technical Data
SPECIFICATIONS
ADMP401-1
TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not
guaranteed.
Table 1.
Parameter
Symbol
Test Conditions/Comments
Min
Typ
Max
Unit
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio
Equivalent Input Noise
Frequency Response
Omni
−37
62
32
0
1 kHz, 94 dB SPL
−40
60
−34
dBV
dBA
dBA SPL
dB
dB
%
SNR
EIN
100 Hz to 10 kHz
100 Hz to 12 kHz
105 dB SPL
−2
−3
+2
+2
3
0
Total Harmonic Distortion
THD
Power Supply Rejection Ratio
PSRR
217 Hz, 100 mV p-p square wave super-
imposed on VDD = 1.8 V
50
dB
Maximum Acoustic Input
POWER SUPPLY
Peak
120
dB SPL
Supply Voltage
Supply Current
VDD
IS
1.5
3.6
200
V
μA
OUTPUT CHARACTERISTICS
Output Impedance
Polarity
ZOUT
200
Noninverting1
Ω
1 Positive going (increasing) pressure on the membrane results in a positive going (increasing) output voltage.
Rev. PrB | Page 3 of 8
ADMP401-1
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
ESD CAUTION
Table 2.
Parameter
Rating
Supply Voltage
3.6 V
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
160 dB
20,000 g
Per MIL-STD-883G
−40°C to +85°C
Temperature Range
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t
25°C TO PEAK
TIME
Figure 2. Recommended Soldering Profile
Table 3. Recommended Soldering Profile
Profile Feature
Sn63/Pb37
Pb-Free
Average Ramp Rate (TL to TP)
Preheat
3°C/sec max
3°C/sec max
Minimum Temperature (TSMIN
Maximum Temperature (TSMAX
Time (TSMIN to TSMAX), tS
)
100°C
150°C
60 sec to 120 sec
3°C/sec
150°C
200°C
60 sec to 120 sec
3°C/sec
)
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
60 sec to 150 sec
183°C
240°C + 0°C/−5°C
10 sec to 30 sec
6°C/sec max
6 minute max
60 sec to 150 sec
217°C
260°C + 0°C/−5°C
20 sec to 40 sec
6°C/sec max
8 minute max
Time 25°C to Peak Temperature
Rev. PrB | Page 4 of 8
Preliminary Technical Data
ADMP401-1
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
OUTPUT
GND
2
1
GND
3
GND
6
V
DD
5
4
GND
BOTTOM VIEW
(TERMINAL SIDE DOWN)
Not to Scale
Figure 3. Pin Configuration (Bottom View)
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
OUTPUT
GND
GND
GND
Description
1
2
3
4
5
6
Analog Output Signal.
Ground.
Ground.
Ground.
Power Supply.
Ground.
VDD
GND
Rev. PrB | Page 5 of 8
ADMP401-1
Preliminary Technical Data
TYPICAL PERFORMANCE CHARACTERISTICS
0
–10
–20
–30
10
8
100mV p-p SINE WAVE
SUPERIMPOSED ON V = 3.0V
DD
6
4
2
0
–2
–4
–6
–8
–10
–40
–50
–60
10
100
1k
10k
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 4. Typical Frequency Response
Figure 5. Typical Power Supply Rejection Ratio vs. Frequency
Rev. PrB | Page 6 of 8
Preliminary Technical Data
ADMP401-1
HANDLING INSTRUCTIONS
PICK-AND-PLACE EQUIPMENT
REFLOW SOLDER
Standard reflow solder conditions specified in Figure 2 can be
used to attach the MEMS microphone to the PCB.
The MEMS microphone can be handled using standard pick-
and-place and chip shooting equipment. Care should be taken
to avoid damage to the MEMS microphone structure as follows:
BOARD WASH
•
Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
When washing the PCB, ensure that water does not make
contact with the microphone port. Blow-off procedures and
ultrasonic cleaning must not be used.
•
•
•
Use care during pick-and-place to ensure that no high
shock events above 20 kg are experienced, because such
events may cause damage to the microphone.
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not pull air out or blow air into the microphone port.
Do not use excessive force to place the microphone on
the PCB.
Rev. PrB | Page 7 of 8
ADMP401-1
Preliminary Technical Data
OUTLINE DIMENSIONS
4.82
4.72
4.62
3.30
REFERENCE
CORNER
2.62
3
REFERENCE
CORNER
0.79
0.90 DIA.
)
(PINS 1, 5, 6
1
6
2
1.68 DIA.
3.86
3.76
3.66
2.54
2.40
1.02 DIA.
1.27
1.20
0.50 DIA.
(THRU HOLE)
5
4
0.15
0.61
0.70 DIA.
(PINS 2, 4)
0.68
TOP VIEW
SIDE VIEW
BOTTOM VIEW
0.82
0.76
0.70
1.10
1.00
0.90
0.24 NOM
Figure 6. 6-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
4.72 mm × 3.76 mm Body
(CE-6-1)
Dimensions shown in millimeters
2.052
2.00
1.95
1.60 MAX
1.50 NOM
8.00
0.35
0.30
0.25
A
4.001
1.85
1.75
1.65
0.20
MAX
3.20
12.30
5.552
5.50
5.45
12.00
11.70
4.80
1.50 MIN
DIA
2.20
1.60
A
DETAIL A
0.25
3.80
1.30 REF
SECTION A-A
NOTES:
0.25
1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ± 0.20.
2. POCKET POSITION RELATIVE TO SPROCKET HOLE
MEASURED AS TRUE POSITION OF POCKET, NOT
POCKET HOLE.
0.50 R
DETAIL A
Figure 7. LGA_CAV Tape and Reel Outline Dimensions
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADMP401-1ACEZ-RL1
ADMP401-1ACEZ-RL71
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
CE-6-1
CE-6-1
Ordering Quantity
6-Terminal LGA_CAV, 13”Tape and Reel
6-Terminal LGA_CAV, 7”Tape and Reel
4,000
1,000
1 Z = RoHS Compliant Part.
©2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
PR07712-0-10/08(PrB)
Rev. PrB | Page 8 of 8
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