ADP1649ACBZ-R7 [ADI]
1.0 A LED Flash Driver with I2C-Compatible Interface;
| 型号： | ADP1649ACBZ-R7 |
| 厂家： | 
ADI |
| 描述： | 1.0 A LED Flash Driver with I2C-Compatible Interface |
| 文件： | 总28页 (文件大小：591K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1.0 A LED Flash Driver with
I2C-Compatible Interface
ADP1649
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
INPUT VOLTAGE = 2.7V TO 5.0V
Ultracompact solution
Small, 2 mm × 1.5 mm, 12-ball WLCSP package
Smallest footprint, 1 mm height, 1 μH power inductor
LED current source for local LED grounding
Simplified routing to and from the LED
Improved LED thermals
10µF
1.0µH
VIN
SW
TxMASK1/TORCH
GPIO1
GPIO2
VOUT
TxMASK2/ILED/ADC
10µF
Synchronous 3 MHz PWM boost converter, no external diode
High efficiency: 90% peak
ADP1649
Reduces high levels of input battery current during flash
Limits battery current drain in torch mode
I2C programmable
Currents of up to 1000 mA in flash mode for 1 LED with
7% accuracy over all conditions
STROBE
LED_OUT
MAX 1.0A
SCL
SDA
EN
SGND
PGND
Currents of up to 200 mA in torch mode
Programmable dc battery current limit (4 settings)
Programmable flash timer up to 1600 ms
Low VBAT mode to reduce LED current automatically
4-bit ADC for LED VF, die/LED temperature readback
Control
Figure 1.
C1
Li-ION +
L1
I2C-compatible control registers
PGND
External strobe and torch input pins
2 transmitter mask (TxMASK) inputs
Safety
Thermal overload protection
Inductor fault detection
Li-ION +
C2
INDUCTOR
DIGITAL
INPUT/
OUTPUT
LED short-circuit and open-circuit protection
2
AREA = 16.4mm
APPLICATIONS
LED
ANODE
Camera enabled cellular phones and smart phones
Digital still cameras, camcorders, and PDAs
Figure 2. PCB Layout (WLCSP)
GENERAL DESCRIPTION
The ADP1649 is a very compact, highly efficient, single white
LED flash driver for high resolution camera phones that improves
picture and video quality in low light environments. The device
integrates a programmable 1.5 MHz or 3 MHz synchronous
inductive boost converter, an I2C-compatible interface, and a
1000 mA current source. The high switching frequency enables
the use of a tiny, 1 mm high, low cost, 1 µH power inductor, and
the current source permits LED cathode grounding for thermally
enhanced, low EMI, and compact layouts.
events. A programmable dc battery current limit safely maximizes
LED current for all LED VF and battery voltage conditions.
Two independent TxMASK inputs permit the flash LED current
and battery current to reduce quickly during a power amplifier
current burst. The I2C-compatible interface enables the pro-
grammability of timers, currents, and status bit readback for
monitoring the operation and for safety control.
The ADP1649 is available in a compact 12-ball, 0.5 mm pitch
WLCSP package, and operates within specification over the full
−40°C to +125°C junction temperature range.
The LED driver maximizes efficiency over the entire battery
voltage range to maximize the input power-to-LED power
conversion and to minimize battery current draw during flash
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2012 Analog Devices, Inc. All rights reserved.
ADP1649
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Indicator LED Driver................................................................. 13
Low Battery LED Current Foldback........................................ 13
Programmable Battery DC Current Limit.............................. 14
Analog-to-Digital Converter Operation................................. 15
5 V Output Operation ............................................................... 15
Safety Features................................................................................. 17
Short-Circuit Fault ..................................................................... 17
Overvoltage Fault ....................................................................... 17
Dynamic Overvoltage Mode (DOVP) .................................... 17
Timeout Fault.............................................................................. 17
Overtemperature Fault .............................................................. 17
Indicator LED Fault ................................................................... 17
Current Limit.............................................................................. 17
Input Undervoltage .................................................................... 17
Soft Start ...................................................................................... 17
Reset Using the Enable (EN) Pin ............................................. 17
Clearing Faults............................................................................ 17
I²C Interface ................................................................................ 18
I²C Register Map............................................................................. 19
Applications Information .............................................................. 25
External Component Selection ................................................ 25
PCB Layout...................................................................................... 27
Packaging and Ordering Information ......................................... 28
Outline Dimensions................................................................... 28
Ordering Guide .......................................................................... 28
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Recommended Specifications: Input and Output Capacitance
and Inductance ............................................................................. 5
I2C-Compatible Interface Timing Specifications..................... 5
Absolute Maximum Ratings ....................................................... 6
Thermal Data ................................................................................ 6
Thermal Resistance ...................................................................... 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ...................................................................... 11
White LED Driver ...................................................................... 11
Modes of Operation ................................................................... 11
Assist Light .................................................................................. 12
Flash Mode.................................................................................. 12
Assist to Flash Operation .......................................................... 12
Torch Mode ................................................................................. 12
Torch to Flash Mode .................................................................. 13
TxMASK Operation................................................................... 13
Frequency Foldback ................................................................... 13
REVISION HISTORY
7/12—Revision 0: Initial Version
Rev. 0 | Page 2 of 28
Data Sheet
ADP1649
SPECIFICATIONS
VIN1 = 3.6 V, TJ = −40°C to +125°C for minimum/maximum specifications, and TA = 25°C for typical specifications, unless otherwise noted.
Table 1.
Parameter2
Test Conditions/Comments
Min
Typ
Max
Unit
SUPPLY
Input Voltage Range
Undervoltage Lockout
Threshold
2.7
5.0
V
VIN falling
2.3
50
2.4
100
0.2
3
2.5
150
1
V
Hysteresis
mV
µA
µA
mA
µA
µA
Shutdown Current (IQ), EN = 0 V
Standby Current (ISTBY), EN = 1.8 V
Operating Quiescent Current
Switch Leakage, SW
TJ = −40°C to +85°C, current into VIN pin, VIN = 2.7 V to 4.5 V
TJ = −40°C to +85°C, current into VIN pin, VIN = 2.7 V to 4.5 V
Torch mode, LED current = 100 mA
TJ = −40°C to +85°C, VSW3 = 4.5 V
TJ = 25°C, VSW3 = 4.5 V
10
5.3
2
0.5
LED DRIVER
LED Current
Assist Light, Torch
Assist light value setting = 0 (000 binary)
Assist light value setting = 7 (111 binary)
Flash value setting = 0 (00000 binary)
Flash value setting = 14 (01110 binary)
ILED = 700 mA to 1000 mA
25
mA
mA
mA
mA
%
200
300
1000
Flash
LED Current Error
−6
+6
ILED = 300 mA to 650 mA
−7
+7
%
ILED = 75 mA to 200 mA
ILED = 25 mA to 50 mA
−10
−15
+10
+15
%
%
LED Current Source Headroom
Flash, 1000 mA LED current
Torch, 200 mA LED current
265
190
mV
mV
ms
ms
LED_OUT Ramp-Up Time
LED_OUT Ramp-Down Time
SWITCHING REGULATOR
Switching Frequency
0.6
0.1
Switching frequency = 3 MHz
Switching frequency = 1.5 MHz
Switching frequency = 3 MHz
Switching frequency = 1.5 MHz
2.8
1.4
3
3.2
1.6
MHz
MHz
%
1.5
14
7
Minimum Duty Cycle
%
NFET Resistance
PFET Resistance
Voltage Output Mode
VOUT Voltage
60
50
mΩ
mΩ
4.575 5.000 5.425
V
Output Current
Line Regulation
Load Regulation
Pass Through Mode Transition, Flash
VIN to LED_OUT
Entry
500
0.3
−0.7
mA
%/V
%/A
ILOAD at VOUT = 300 mA
1000 mA LED current
1000 mA LED current
530
400
mV
mV
Exit
Pass Through Mode Transition, Torch
VIN to LED_OUT
Entry
200 mA LED current
200 mA LED current
380
285
mV
mV
Exit
Rev. 0 | Page 3 of 28
ADP1649
Data Sheet
Parameter2
Test Conditions/Comments
Min
Typ
Max
0.54
7.5
Unit
DIGITAL INPUTS/GPIOx
Input Logic
Low Voltage
High Voltage
GPIO1, GPIO2, STROBE Pull-Down
Torch Glitch Filtering Delay
INDICATOR LED
V
V
kΩ
ms
1.26
5.5
390
7
From torch rising edge to device start
LED Current Accuracy
Short-Circuit Detection Threshold
Open-Circuit Detection Threshold
ADC
Resolution
Error
−22
2.45
4
+22
1.2
%
V
V
Bits
LSB
LSB
LSB
V
External voltage mode
VF mode, TJ = 25°C
VF mode, TJ = −40°C to +125°C
External voltage mode
0
1
1
1.5
0. 5
Input Voltage Range, GPIO2
SAFETY FEATURES
0
Maximum Timeout For Flash
Timer Accuracy
DC Current Limit
1600
ms
%
A
A
A
−7.0
1.35
1.55
1.8
+7.0
1.65
1.95
2.2
DC current value setting = 0 (00 binary)
DC current value setting = 1 (01 binary)
DC current value setting = 2 (10 binary)
1.5
1.75
2.0
Low VBAT Mode Transition Voltage
Error
Hysteresis
3.2
%
mV
A
A
A
50
Coil Peak Current Limit
Peak current value setting = 0 (00 binary)
Peak current value setting = 1 (01 binary)
Peak current value setting = 2 (10 binary)
1.55
2.02
2.47
5.15
1.75
2.25
2.75
5.5
1.95
2.5
3.0
5.9
1.3
Overvoltage Detection Threshold
LED_OUT Short-Circuit Detection
Comparator Reference Voltage
V
V
1.2
Thermal Shutdown Threshold
TJ Rising
TJ Falling
150
140
°C
°C
1 VIN is the input voltage to the circuit.
2 All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC).
3 VSW is the voltage on the SW switch pin.
Rev. 0 | Page 4 of 28
Data Sheet
ADP1649
RECOMMENDED SPECIFICATIONS: INPUT AND OUTPUT CAPACITANCE AND INDUCTANCE
Table 2.
Parameter
Symbol
Test Conditions/Comments
Min
Typ
Max
Unit
CAPACITANCE
CMIN
Input
Output
TA = −40°C to +125°C
TA = −40°C to +125°C
TA = −40°C to +125°C
4.0
3.0
0.6
10
10
1.0
µF
µF
µH
20
MINIMUM AND MAXIMUM INDUCTANCE
L
1.5
I2C-COMPATIBLE INTERFACE TIMING SPECIFICATIONS
Table 3.
Parameter1
fSCL
Min
Max
Unit
kHz
µs
Description
400
SCL clock frequency
SCL high time
tHIGH
0.6
tLOW
1.3
µs
SCL low time
tSU, DAT
tHD, DAT
tSU, STA
tHD, STA
tBUF
tSU, STO
tR
tF
100
0
0.6
0.6
1.3
0.6
20 + 0.1 CB
20 + 0.1 CB
0
ns
µs
µs
µs
µs
µs
ns
ns
Data setup time
Data hold time
0.9
Setup time for repeated start
Hold time for start/repeated start
Bus free time between a stop and a start condition
Setup time for a stop condition
Rise time of SCL and SDA
Fall time of SCL and SDA
Pulse width of suppressed spike
Capacitive load for each bus line
2
2
300
300
50
tSP
ns
pF
2
CB
400
1 Guaranteed by design.
2 CB is the total capacitance of one bus line in picofarads.
Timing Diagram
SDA
tBUF
tF
tLOW
tR
tR
tF
tSP
tSU, DAT
tHD, STA
SCL
tHIGH
tSU, STA
tSU, STO
tHD, DAT
S
Sr
P
S
S = START CONDITION
Sr = REPEATED START CONDITION
P = STOP CONDITION
Figure 3. I2C-Compatible Interface Timing Diagram
Rev. 0 | Page 5 of 28
ADP1649
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
θJA of the package is based on modeling and calculation using
a 4-layer board. θJA is highly dependent on the application and
board layout. In applications where high maximum power dissi-
pation exists, attention to thermal board design is required. The
value of θJA may vary, depending on PCB material, layout, and
environmental conditions. The specified value of θJA is based
on a 4-layer, 4 in × 3 in, 2½ oz copper board, per JEDEC
standards. For more information, see the AN-617 Application
Note, MicroCSP™ Wafer Level Chip Scale Package.
Parameter
Rating
VIN, SDA, SCL, EN, GPIO1, GPIO2, STROBE,
LED_OUT, SW, VOUT to Power Ground
PGND to SGND
Ambient Temperature Range (TA)
Junction Temperature Range (TJ)
Storage Temperature
ESD Models
Human Body
Charged Device
Machine
−0.3 V to +6 V
−0.3 V to +0.3 V
−40°C to +85°C
−40°C to +125°C
JEDEC J-STD-020
2000 V
500 V
150 V
θ
JA is specified for a device mounted on a JEDEC 2s2p PCB.
Table 5. Thermal Resistance
Package Type
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
θJA
Unit
12-Ball WLCSP
75
°C/W
ESD CAUTION
THERMAL DATA
Exceeding the junction temperature limits may damage the
ADP1649. Monitoring TA does not guarantee that TJ is within
the specified temperature limits. In applications with high power
dissipation and poor thermal resistance, the maximum TA may
need to be derated. In applications with moderate power dissipa-
tion and low printed circuit board (PCB) thermal resistance, the
maximum TA can exceed the maximum limit as long as the TJ is
within specification limits. TJ of the device is dependent on the
TA, the power dissipation (PD) of the device, and the junction-
to-ambient thermal resistance (θJA) of the package. Maximum TJ
is calculated from TA and PD using the following formula:
TJ = TA + (PD × θJA)
Rev. 0 | Page 6 of 28
Data Sheet
ADP1649
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
BALL A1
INDICATOR
1
2
3
PGND
SGND
VIN
A
B
SW
GPIO1
GPIO2
VOUT
STROBE
EN
C
D
LED_OUT
SDA
SCL
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
Figure 4. Pin Configuration
Table 6. Pin Function Descriptions
Pin No.
Mnemonic Description
A1
A2
A3
B1
PGND
SGND
VIN
Power Ground.
Signal Ground.
Input Voltage for the Device. Connect an input bypass capacitor close to this pin.
Boost Switch. Connect the power inductor between SW and the input capacitor.
SW
B2
GPIO2
General-Purpose Input/Output for the ILED/TxMASK2/ADC Modes. These modes are register selectable. This is
a multifunction pin for the red indicator LED current source, TxMASK2, or ADC input.
ILED Mode. For the ILED mode, connect this pin to the red LED anode. Connect the LED cathode to power
ground.
TxMASK2 Mode. TheTxMASK2 function of this pin reduces the current to the programmable TxMASK2 current.
ADC Mode. The ADC function of this pin is used as the input pin for the ADC.
B3
GPIO1
General-Purpose Input/Output for the Torch/TxMASK1 Modes. These modes are register selectable. This is a
multifunction pin for the external torch mode or TxMASK1 input.
Torch Mode. Enables the integrated circuit (IC) in direct torch mode.
TxMASK1 Mode. Reduces the flash current to the programmable TxMASK1 current.
C1
C2
C3
VOUT
STROBE
EN
Boost Output. Connect an output bypass capacitor very close to this pin. VOUT is the output for the 5 V
external voltage mode.
Strobe Signal Input. STROBE synchronizes the flash pulse to the image capture. In most cases, this signal
comes directly from the image sensor.
Enable. Set EN low to bring the quiescent current (IQ) to <1 µA. Registers are set to their defaults when EN is
brought from low to high.
D1
D2
D3
LED_OUT
SDA
SCL
LED Current Source. Connect the LED_OUT pin to the anode of the flash LED.
I2C Data Signal in I2C Mode.
I2C Clock Signal in I2C Mode.
Rev. 0 | Page 7 of 28
ADP1649
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
I
I
L
LED_OUT
LED
2
3
SWITCH
4
I
LED
3
I
L
2
1
1
STROBE
CH1 5.00V
CH3 500mA CH4 1.00V
CH2 1.00A
M100.0µs
400µs
A CH1
1.00V
CH1 2.00V
CH3 500mA
CH2 500mA
M100.0ns
4.00ms
A CH1
2.40V
T
T
Figure 5. Start-Up Flash Mode, VIN = 3.6 V, ILED = 1000 mA
Figure 8. Switching Waveforms, Flash Mode, ILED = 1000 mA
VIN
LED_OUT
LED_OUT
4
3
1
4
I
LED
I
I
L
I
L
2
3
2
1
LED
GPIO (TORCH)
CH1 5.00V
CH3 100mA CH4 2.00V
CH2 100mA
M1.00ms
4.00ms
A CH1
1.00V
CH1 2.00V
CH3 100mA CH4 2.00V
CH2 100mA
M500.0µs
1.5ms
A CH1
1.00V
T
T
Figure 6. Start-Up Torch Mode, VIN = 3.6 V, ILED = 100 mA
Figure 9. Pass Through to Boost Mode Transition, ILED = 100 mA
LED_OUT
LED_OUT
4
I
BAT
I
LED
I
LED
4
2
3
I
L
3
2
GPIO (TxMASK1)
1
STROBE
1
CH1 5.00V
CH3 500mA CH4 1.00V
CH2 1.00A
M100.0µs
400µs
A CH1
1.00V
CH1 2.00V
CH3 500mA CH4 2.00V
CH2 500mA
M10.00µs
20.00µs
A CH1
1.00V
T
T
Figure 7. 100 mA Torch to 1000 mA Flash Transition
Figure 10. Entry into TxMASK1 Mode
Rev. 0 | Page 8 of 28
Data Sheet
ADP1649
100
90
80
70
60
50
40
30
20
10
0
LED_OUT
4
I
BAT
I
LED
2
3
V
V
V
V
= 4.2V
= 3.6V
= 3.4V
= 3.2V
IN
IN
IN
IN
GPIO (TxMASK1)
1
CH1 2.00V
CH2 500mA
M20.00µs
80.00µs
A CH1
1.20V
0.3
0.5
0.7
0.9
1.0
CH3 500mA CH4 2.00V
T
LED CURRENT (A)
Figure 14. Flash Mode Efficiency vs. LED Current
Figure 11. Exit from TxMASK1 Mode
3.04
100
90
80
70
60
50
40
–40°C
V
V
V
V
V
= 2.7V
= 3.0V
= 3.3V
= 3.6V
= 4.2V
IN
IN
IN
IN
IN
+25°C
+85°C
+125°C
3.03
3.02
3.01
3.00
2.99
2.98
2.97
2.96
2.95
2.94
2.7
3.0
3.3
3.6
3.9
4.2
4.5
4.8
5.1
5.4
0.01
0.1
1
INPUT VOLTAGE (V)
OUTPUT CURRENT (A)
Figure 15. Voltage Regulation Mode Efficiency vs. Load Current
Figure 12. Switching Frequency vs. Supply Voltage (3 MHz Mode)
1111
6
V
V
V
= 2.7V
= 3.6V
= 4.5V
IN
IN
IN
1110
1100
1010
1000
0110
0100
0010
0000
5
4
3
2
1
0
0
50 100 150 200 250 300 350 400 450 500 550
ADC INPUT VOLTAGE (mV)
–40
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
Figure 16. ADC External Voltage Mode Transfer Characteristic
Figure 13. Standby Current vs. Temperature
Rev. 0 | Page 9 of 28
ADP1649
Data Sheet
295
294
293
292
291
290
289
288
287
286
1111
1110
1100
1010
1000
0110
0100
0010
V
= 5V
IN
V
= 3.6V
= 2.7V
IN
V
IN
0000
0
25
50
75
100
125
150
–40
10
60
TEMPERATURE (°C)
110
DIE TEMPERATURE (°C)
Figure 20. ADC External Voltage Mode, Code 1000, Midpoint vs. Temperature
Figure 17. ADC Die Temperature Mode Transfer Characteristic
1111
1110
1100
1010
1000
0110
0100
0010
0000
0.5
V
V
V
= 3.2V
= 3.6V
= 4.2V
IN
IN
IN
0
–0.5
–1.0
–1.5
–2.0
–2.5
–3.0
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
–40
10
60
110
LED_OUT VOLTAGE (V)
TEMPERATURE (°C)
Figure 18. ADC LED VF Mode Transfer Characteristic
Figure 21. LED Current Error vs. Temperature, ILED = 800 mA
1.0
0.5
3.760
3.755
3.750
3.745
3.740
3.735
3.730
3.725
3.720
3.715
3.710
V
V
V
= 3.2V
= 3.6V
= 4.2V
IN
IN
IN
V
= 5.0V
IN
0
–0.5
–1.0
–1.5
–2.0
–2.5
V
= 3.6V
IN
V
= 2.7V
IN
–40
10
60
110
–40
10
60
TEMPERATURE (°C)
110
TEMPERATURE (°C)
Figure 19. ADC LED VF Mode, Code 1000, Midpoint vs. Temperature
Figure 22. LED Current Error vs. Temperature, ILED = 1000 mA
Rev. 0 | Page 10 of 28
Data Sheet
ADP1649
THEORY OF OPERATION
The ADP1649 is a high power, I2C programmable, white LED
driver ideal for driving white LEDs for use as a camera flash.
The ADP1649 includes a boost converter and a current regu-
lator suitable for powering one high power white LED.
MODES OF OPERATION
After the enable pin is high, the device can be set into the four
modes of operation using the LED_MOD bits in Register 0x04,
via the I2C-compatible interface.
WHITE LED DRIVER
Table 7. LED_MOD Bit Settings, I2C-Compatible Interface
The ADP1649 drives a synchronous 3 MHz boost converter as
required to power the high power LED. If the sum of the LED
forward voltage and current regulator voltage is higher than
the battery voltage, the boost turns on. If the battery voltage is
higher than the sum of the LED VF and current regulator voltage,
the boost is disabled and the part operates in pass through mode.
The ADP1649 uses an integrated PFET high-side current regu-
lator for accurate brightness control.
LED_MOD
Setting
Description
00
Sets the device to standby mode, consuming 3 μA
typical.
Sets the device to fixed VOUT = 5 V output mode.
Sets the device to assist light mode with continuous
LED current.
Sets the device to flash mode with an available
current of up to 1 A for 1.6 sec.
01
10
11
INPUT VOLTAGE = 2.7V TO 5.0V
C
10µF
C
10µF
IN
OUT
L1
1µF
PGND
PGND
VIN
VOUT
SW
HPLED
DRIVER
5.5V
CURRENT
SENSE
2.4V
UVLO
OVP
CURRENT
SENSE
PWM
CONTROLLER
LED_OUT
EN
FAULT
REGISTER
HPLED
SHORT
SCL
INTERFACE
AND
CONTROL
SDA
25mA TO 1.0A
STROBE
HIGH POWER LED
CURRENT CONTROL
TxMASK1
TxMASK2
PGND
IC THERMAL
SENSING
TORCH
4-BIT
ADC
VIN
ILED
LED_OUT PIN
IO1_CFG[5:4] IO2_CFG[7:6]
SGND
AGND
PGND
PGND
GPIO1
GPIO2
Figure 23. Detailed Block Diagram
Rev. 0 | Page 11 of 28
ADP1649
Data Sheet
I
FLASH
ASSIST LIGHT
The assist light mode provides a continuous current that is
programmable from 25 mA to 200 mA. Set the assist light
current using the I_TOR bits (in Register 0x03).
LED CURRENT
0A
FL_TIM
STROBE
To enable assist, set LED_MOD to assist light mode and set
OUTPUT_EN = 1 (in Register 0x04). Disable assist light mode by
setting LED_MOD to standby mode or setting OUTPUT_EN = 0.
2
I C DATA BUS
REG 0x02, FL_TIM = XXXX ms
REG 0x03, I_FL = XXXXX mA
ADP1649 SETS OUTPUT_EN TO 0.
ADP1649 SETS LED_MOD TO 00.
I
ASSIST
LED CURRENT
0A
REG 0x04, OUTPUT_EN = 1
STR_LV = 0
LED_MOD = 11
Figure 26. Flash Operation: Edge Sensitive Mode
2
I C DATA BUS
In edge sensitive mode, a positive edge on the STROBE pin
enables the flash, and the FL_TIM bits set the flash duration.
REG 0x03, I_TOR = XXX mA
REG 0x04, OUTPUT_EN = 0
REG 0x04, OUTPUT_EN = 1
ASSIST TO FLASH OPERATION
LED_MOD = 10
I
FLASH
Figure 24. Enabling and Disabling Assist Light Mode
LED CURRENT
FLASH MODE
I
ASSIST
0A
Flash mode provides 300 mA to 1 A for a programmable time of
up to 1.6 seconds. Set the flash current using the I_FL bits (in
Register 0x03) and the maximum flash duration with the FL_TIM
bits (in Register 0x02). To enable flash mode, set LED_MOD
to flash mode and set OUTPUT_EN = 1. Enable flash without
the STROBE pin by setting STR_MODE (in Register 0x04) to 0
(software strobe).
STROBE
2
I C DATA BUS
REG 0x02, FL_TIM = XXXX ms
REG 0x03, I_TOR = XXX mA
REG 0x03, I_FL = XXXXX mA
ADP1649 SETS OUTPUT_EN TO 0.
ADP1649 SETS LED_MOD TO 00.
When STR_MODE is in hardware strobe mode, setting the
STROBE pin high enables flash and synchronizes it to the image
sensor. Hardware strobe mode has two modes for timeout: level
sensitive (STR_LV = 1, Register 0x04) and edge sensitive
(STR_LV = 0, Register 0x04).
REG 0x04, OUTPUT_EN = 1
STR_LV = 1
LED_MOD = 10
Figure 27. Enabling Assist to Flash (Level Sensitive) Mode
The STR_POL bit in Register 0x07 changes the default enable of
the STROBE pin from low to high and from high to low. Additional
image sensor specific assist/flash enable modes are included in
the device, and information on these modes is available by request
from the Analog Devices, Inc., sales team.
I
FLASH
LED CURRENT
0A
TORCH MODE
STROBE
Set the assist/torch light current modes using the I_TOR bits.
To enable torch mode using a logic signal, set LED_MOD to
standby mode, set OUTPUT_EN = 1, and bring GPIO1 high.
Disable the external torch mode by setting GPIO1 low or pro-
gramming OUTPUT_EN = 0. Bringing GPIO1 low during torch
mode automatically sets OUTPUT_EN = 0. To reenable torch
mode, program OUTPUT_EN = 1 and bring GPIO high again.
2
I C DATA BUS
REG 0x02, FL_TIM = XXXX ms
REG 0x03, I_FL = XXXXX mA
ADP1649 SETS OUTPUT_EN TO 0.
ADP1649 SETS LED_MOD TO 00.
REG 0x04, OUTPUT_EN = 1
STR_LV = 1
LED_MOD = 11
Figure 25. Flash Operation: Level Sensitive Mode
I
ASSIST
LED CURRENT
0A
In level sensitive mode, the duration of the STROBE pin set to
high sets the duration of the flash up to the maximum time
indicated by the FL_TIM timeout. If STROBE remains high
longer than the duration set by FL_TIM, a timeout fault
disables the flash.
GPIO1 (TORCH)
2
I C DATA BUS
REG 0x03, I_TOR = XXX mA
REG 0x04, OUTPUT_EN = 1
LED_MOD = 00
ADP1649 SETS OUTPUT_EN TO 0
Figure 28. Enabling External Torch Mode Using GPIO1
Rev. 0 | Page 12 of 28
Data Sheet
ADP1649
low again, the LED current returns to the full flash level in a
controlled manner. If both TxMASK inputs are set high
simultaneously, the TxMASK1 current level is used.
TORCH TO FLASH MODE
The driver can move directly from external torch mode (using
GPIO1) to flash mode by bringing the STROBE pin high before
bringing the GPIO1 pin (set for the torch mode) low. Bringing
torch low before the STROBE pin goes high prevents the flash
from firing when the STROBE pin goes high.
FREQUENCY FOLDBACK
Frequency foldback is an optional mode that optimizes efficiency
by reducing the switching frequency to 1.5 MHz when VIN is
slightly less than VOUT. Enable frequency foldback by setting
FREQ_FB = 1 in Register 0x04.
The ADP1649 returns to standby mode after a successful flash
and sets OUTPUT_EN = 0.
I
FLASH
INDICATOR LED DRIVER
LED CURRENT
The indicator LED driver on GPIO2 provides a programmable
current source of between 2.75 mA and 11 mA for driving a red
privacy LED; the I_ILED bits in Register 0x07 program the current
level. The circuit consists of a programmable current source and
a monitoring circuit that uses comparators to determine whether
the indicator LED is short circuit or open circuit. The threshold
for detection of a short circuit is 1.2 V (maximum), and for an
open circuit, the threshold is 2.45 V (minimum). The indicator
LED must not be used at the same time as a flash or an assist/
torch event.
I
ASSIST
0A
STROBE
TORCH
2
I C DATA BUS
REG 0x02, FL_TIM = XXXX ms
ADP1649 SETS OUTPUT_EN TO 0
IO1_CFG = 01, TORCH
REG 0x03, I_TOR = XXX mA
REG 0x03, I_FL = XXXXX mA
LOW BATTERY LED CURRENT FOLDBACK
REG 0x04, OUTPUT_EN = 1
STR_LV = 1
As the battery discharges, the lower battery voltage results in
higher peak currents through the battery ESR, which may cause
early shutdown of the phone. The ADP1649 features an optional
low battery detection option that reduces the flash current (to a
programmable level) when the battery voltage falls below a
programmable level. Set V_VB_LO = 000 to disable the low
battery current foldback (see Table 8 for details).
LED_MOD = 00
Figure 29. Enabling Flash Mode from External Torch Mode
TxMASK OPERATION
When the ADP1649 is in flash mode, the TxMASK1 and the
TxMASK2 functions reduce the battery load in response to the
system enabling a power amplifier. The device remains in flash
mode, but the LED driver output current reduces to the pro-
grammed TxMASK light level in less than 21 µs.
I
FLASH
I
I_VB_LO
LED CURRENT
I
FLASH
0
A
GLITCH < 50µs IGNORED
LED CURRENT
VIN
I
TxMASK1
0A
50mV HYS
V
V_VB_LO
TxMASK1
(GPIO1)
STROBE
STROBE
2
I C DATA BUS
2
I C DATA BUS
REG 0x09, I_VB_LO = XXXX mA
FL_VB_LO = 1
ADP1649 SETS OUTPUT_EN TO 0.
V_VB_LO = XXX V
REG 0x02, IO1_CFG = 10
FL_TX1 = 1
ADP1649 SETS LED_MOD TO 00.
REG 0x04, OUTPUT_EN = 1
LED_MOD = 10
FL_TIM = XXXX ms
REG 0x03, I_FL = XXXXX mA
REG 0x06, I_TX1 = XXXX mA
ADP1649 SETS OUTPUT_EN TO 0.
ADP1649 SETS LED_MOD TO 00.
Figure 31. Register 0x09 Sets the Battery Voltage Threshold Level and the
Reduced LED Current Level
REG 0x04, OUTPUT_EN = 1
STR_LV = 1
LED_MOD = 11
Figure 30. TxMASK1 Operation During Flash (Level Sensitive) Mode
The device selects the TxMASK1 or TxMASK2 current level
based on whether the TxMASK1 or TxMASK2 input is used.
Anytime TxMASK1 or TxMASK2 is brought high during a
flash event, a flag is set in the fault information register. To avoid
overshoots on the battery current, when the TxMASK signal goes
Rev. 0 | Page 13 of 28
ADP1649
Data Sheet
Table 8. VDD Level at Which the VBAT Low Function Is Enabled
Bit Name VDD Level
During startup of the flash, if the battery current does not reach
the dc current limit, the LED current is set to the current value
of the I_FL bits. If the battery current reaches the programmed
dc current limit on startup, the LED current does not increase
further. The dc current limit flag is set in the fault information
register. The I_FL bits in Register 0x03 are set to the automatically
reduced current-limit LED current and are available for readback.
V_VB_LO
000 = disabled (default)
001 = 3.3 V
010 = 3.35 V
011 = 3.4 V
100 = 3.45 V
101 = 3.5 V
NO LIMIT LED CURRENT
ACTUAL LED CURRENT
110 = 3.55 V
111 = 3.6 V
STROBE
PROGRAMMABLE BATTERY DC CURRENT LIMIT
I2C DATA BUS
ADP1649 SETS OUTPUT_EN TO 0.
ADP1649 SETS LED_MOD TO 00.
REG 0x02, FL_TIM = XXXX ms
REG 0x03, I_FL = XXXXX mA
The ADP1649 has four optional programmable input dc current
limits that limit the maximum input battery current over all con-
ditions. This allows use of higher LED currents in a system with
significant variation in LED forward voltage (VF) and supply
battery voltage without risk of exceeding the current allocated
to the flash.
ADP1649 SETS FL_IDC (REG 0x05) TO 1.
ADP1649 SETS I_FL TO ACTUAL LED CURRENT.
REG 0x07 IL_DC_EN = 1
REG 0x07 IL_DC = XX A
REG 0x04, OUTPUT_EN = 1
STR_LV = 1
LED_MOD = 11
Figure 32. DC Current-Limit Operation in a Low Battery, High LED VF Case
The camera system shown in Figure 33 can adjust the image
sensor settings based on the known reduced LED current for a
low battery and a high VF LED.
Table 9. Input DC Current Limit Setting the LED Current
Bit Name
Current Limit
IL_DC
00 = 1.5 A
01 = 1.75 A
10 = 2.0 A (default)
11 = reserved
SELECT FLASH CURRENT
SELECT MAX BATTERY CURRENT
PREFLASH STROBE
NO
YES
DC LIMIT HIT?
LED CURRENT =
REDUCED LED CURRENT
LED CURRENT =
PROGAMMED LED
CURRENT
BATTERY CURRENT =
PROGRAMMED DC LIMIT
STROBE
2
I C READ LED CURRENT
ADJUST IMAGE SENSOR
STROBE
Figure 33. Use of the DC Current Limit in an Optimized Camera System
Rev. 0 | Page 14 of 28
Data Sheet
ADP1649
In flash mode, set ADC_EN = 01. The conversion occurs imme-
diately before the timeout; therefore, the FL_TIM bits set when
the ADC sample occurs. This allows the VF to settle from the
initial peak as the junction temperature of the LED stabilizes.
An LED temperature vs. flash time profile for the handset PCB
design can be generated during the design phase by varying the
FL_TIM bits from the lowest to the highest setting and collecting a
VF sample on each flash.
ANALOG-TO-DIGITAL CONVERTER OPERATION
The internal 4-bit analog-to-digital converter (ADC) is config-
urable to measure the LED VF, the integrated circuit (IC) die
temperature, or to measure an external voltage using the GPIO2
pin. Read the 4-bit resolution output code from Register 0x08
using the I2C interface.
EN
I
FLASH
LED CURRENT
0A
FL_TIM
IC TEMPERATURE
SENSOR
GPIO2
STROBE
SDA
INTERFACE/
CONTROL
SCL
LED_OUT
tS = 1ms
START CONVERSION
(INTERNAL SIGNAL)
ADC_EN[1:0]
4-BIT ADC
2
PTC
I C DATA BUS
ADC_VAL[5:2]
REG 0x02, FL_TIM = XXXX ms
ADC_VAL[5:2]
AVAILABLE FOR READ
REG 0x03, I_FL = XXXXX mA
REG 0x04, OUTPUT_EN = 1
STR_LV = 0
Figure 34. Available ADC Modes
REG 0x08, ADC_EN = 01
LED_MOD = 11
The ADC can perform the conversion immediately on an I2C
Figure 36. ADC Timing for VF Measurement in Flash Mode
command or it can delay the conversion until the next time the
ADP1649 exits an active mode. Delayed conversion can be
useful, for example, for measuring the IC temperature at the
end of a timed flash period.
Die Temperature Mode
The ADC measures the IC die temperature and provides the result
to the I2C interface. This is useful during the design phase of the
flash system to optimize PCB layout for the best thermal design.
To set up a delayed conversion, set ADC_EN to the required
mode while OUTPUT_EN = 0. Next, set the ADP1649 to the
desired output mode (torch, flash assist light, or 5 V output) and
set OUTPUT_EN = 1. The ADC conversion is performed when
the ADP1649 exits the chosen mode.
Write ADC_EN = 10 to begin a die temperature measurement.
The value can be read back from the ADC_VAL[5:2] bits 1 ms
after the conversion has started. The most stable and accurate value
of the die temperature is available at the end of the flash pulse.
To perform an immediate conversion, set ADC_EN to the
required mode during ADP1649 operation (OUTPUT_EN = 1).
Note that an ADC conversion cannot be performed when the
ADP1649 is idle. This is interpreted as an attempt to set up a
delayed conversion.
External Voltage Mode
The ADC measures the voltage on the GPIO2 pin when the GPIO2
is configured as an ADC input by setting IO2_CFG = 11. One
example is using an external temperature dependent resistor to
create a voltage based on the temperature of the flash LED. The
EN line can be used for biasing to reduce leakage current when
the flash is not being used.
LED VF Mode
5 V OUTPUT OPERATION
The ADC can measure the LED VF in both flash and assist/torch
modes. In torch mode, set ADC_EN = 01 to begin a conversion.
The value can be read back from the ADC_VAL[5:2] bits 1 ms
after the conversion has started. Assist/torch mode, rather than
flash mode, is best in the handset production test to verify the
LED VF.
The ADP1649 can be used as a 5 V boost to supply up to 500 mA
for an audio voltage rail or keypad LED driver voltage. To move
into voltage regulation mode, the OUTPUT_EN bit must be set
to 0. To enable the 5 V output, set LED_MOD[1:0] = 01, and set
OUTPUT_EN = 1. The ADP1649 sets the VOUT pin to 5 V
and disconnects VOUT from LED_OUT. The VOUT pin is
connected to the SW node when the ADP1649 is not enabled.
Do not connect VOUT directly to a positive external voltage
source because this causes current to flow from VOUT to the
battery.
1ms
START CONVERSION
(INTERNAL SIGNAL)
2
I
C DATA BUS
REG 0x08, ADC_EN = 01
ADC_VAL[5:2]
AVAILABLE FOR READ
Figure 35. ADC Timing for All Modes Except VF Measurement in Flash Mode
Rev. 0 | Page 15 of 28
ADP1649
Data Sheet
INPUT VOLTAGE = 2.7V TO 5.0V
ON
OFF
10µF
3.2 MEGAPIXEL
TO 5.0 MEGAPIXEL
CMOS IMAGE SENSOR
1.0µH
STROBE
VIN
SW
VOUT = 5.0V
10µF
VOUT*
GPIO2
VDD
APPLICATIONS PROCESSOR
ADP1649
SCL
SDA
KEYPAD
2
SDA, SCL
I C BUS
LED DRIVER
GND
LED_OUT
PGND
POWER-ON RESET
EN
EN
GPIO1 SGND
*THE VOUT PIN IS CONNECTED TO THE SW NODE WHEN THE ADP1649 IS NOT ENABLED. VOUT SHOULD NOT BE CONNECTED DIRECTLY TO A POSITIVE
EXTERNAL VOLTAGE SOURCE BECAUSE THIS CAUSES CURRENT TO FLOW FROM VOUT TO THE BATTERY.
Figure 37. Voltage Regulation Mode: LED Driver Application
INPUT VOLTAGE = 2.7V TO 5.0V
ON
OFF
10µF
3.2 TO 5.0 MEGAPIXEL
CMOS IMAGE SENSOR
1.0µH
STROBE VIN
GPIO2
SW
VOUT
VOUT = 5.0V ±8.5%, IMAX = 500mA
0.1µF
10µF
APPLICATIONS
PROCESSOR
VDD
IN+
160kΩ
SSM2315
OUT+
ADP1649
SCL
SDA
47nF
47nF
80kΩ
80kΩ
2
SDA, SCL
I C BUS
AUDIO IN+
MODULATOR
FET
DRIVER
OUT–
IN–
(Σ-Δ)
LED_OUT
PGND
AUDIO IN–
POWER-ON
RESET
EN
160kΩ
EN
GPIO1
SGND
SD
INTERNAL
POP/CLICK
OSCILLATOR SUPPRESSION
BIAS
SHUTDOWN
GND
Figure 38. Voltage Regulation Mode: Class-D Audio Application
Rev. 0 | Page 16 of 28
Data Sheet
ADP1649
SAFETY FEATURES
For critical fault conditions, such as output overvoltage, flash
timeout, LED output short-circuit, and overtemperature
conditions, the ADP1649 has built-in protection modes. If a
critical fault occurs, OUTPUT_EN (Register 0x04) is set to 0,
and the driver shuts down. The appropriate fault bit is set in the
fault information register (Register 0x05). The processor can
read the fault information register through the I2C interface to
determine the nature of the fault condition. When the fault
register is read, the corresponding fault bit is cleared.
OVERTEMPERATURE FAULT
When the junction temperature of the ADP1649 rises above
150°C, a thermal protection circuit shuts down the device. Bit 5 of
the fault information register is set high. The ADP1649 remains
disabled until the processor clears the fault register.
INDICATOR LED FAULT
The GPIO2 pin features open-circuit and short-circuit protec-
tion in the indicator LED mode. If a short circuit or open circuit
occurs, Bit 2 of the fault information register is set high. The
indicator LED regulator ensures that no damage occurs to the
IC during a fault.
If a noncritical event such as an indicator LED open-circuit,
short-circuit, TxMASK1, or TxMASK2 event occurs, or if the dc
or soft inductor current limit is reached, the LED driver continues
operating. The corresponding information bits are set in the
fault information register until the processor reads them.
CURRENT LIMIT
The internal switch limits battery current by ensuring that the
peak inductor current does not exceed the programmed limit
(Bit 6 and Bit 7 in Register 0x04 set the current limit). The default
mode of the ADP1649 is soft current-limit mode. If the peak
inductor current limit is reached, Bit 1 of the fault information
register is set, and the inductor and LED current cannot increase
further although the ADP1649 continues to operate. If the
ADP1649 has soft current limit disabled and the peak inductor
current exceeds the limit, the device shuts down and Bit 1 of the
fault information register is set high. In this case, the ADP1649
remains disabled until the processor clears the fault register.
SHORT-CIRCUIT FAULT
When the flash driver is disabled, the high-side current regulator
disconnects the dc path between the battery and the LED, pro-
tecting the system from an LED short circuit. The LED_OUT
pin features short-circuit protection that monitors the LED
voltage when the LED driver is enabled. If the LED_OUT pin
remains below the short-circuit detection threshold, a short
circuit is detected. Bit 6 of the fault information register is set
high. The ADP1649 remains disabled until the processor clears
the fault register.
INPUT UNDERVOLTAGE
OVERVOLTAGE FAULT
The ADP1649 includes a battery undervoltage lockout circuit.
During 5 V or LED operation, the battery voltage dropping
below the 2.4 V (typical) input UVLO threshold shuts down the
ADP1649. A power-on reset circuit resets the registers to their
default conditions when the voltage rises above the UVLO rising
threshold.
The ADP1649 contains a comparator at the VOUT pin that
monitors the voltage between VOUT and GND. If the voltage
exceeds 5.5 V (typical), the ADP1649 shuts down. Bit 7 in the
fault information register is read back as high. The ADP1649 is
disabled until the fault is cleared, ensuring protection against an
open circuit.
SOFT START
DYNAMIC OVERVOLTAGE MODE (DOVP)
The ADP1649 has a soft start mode that controls the rate of
increase of battery current at startup by digitally controlling the
output current ramp. The maximum soft start time is 0.6 ms.
Dynamic OVP mode is a programmable feature that limits the
VOUT voltage exceeding the OVP level while maintaining as
much current as possible through the LED. This mode prevents
an overvoltage fault in the case of a much higher than expected
LED forward voltage. If the LED forward voltage reduces due to
the LED temperature rising, the ADP1649 moves out of DOVP
mode and regulates the LED at the programmed current level.
Set Bit 7 of Register 0x07 high to enable the DOVP mode.
RESET USING THE ENABLE (EN) PIN
A low to high transition on the EN pin resets all registers to
their default values. Bringing EN low reduces the IQ to 0.2 µA
(typical).
CLEARING FAULTS
TIMEOUT FAULT
The information bits and faults in Register 0x05 automatically
clear when the processor reads the fault register.
When the external strobe mode is enabled (Register 0x04, Bit 2)
and the strobe enable bit is set to the level sensitive mode
(Register 0x04, Bit 5), then, if the STROBE pin remains high for
longer than the programmed timeout period, the timeout fault
bit (Register 0x05, Bit 4) is read back as high. The ADP1649
remains disabled until the processor clears the fault register.
Rev. 0 | Page 17 of 28
ADP1649
Data Sheet
Figure 39 illustrates the I2C write sequence to a single register.
The subaddress content selects which of the nine ADP1649
registers is written to. The ADP1649 sends an acknowledgment
to the master after the 8-bit data byte has been written. Figure 40
shows the I2C read sequence of a single register. See the I²C
Register Map section for a list of register definitions.
I²C INTERFACE
The ADP1649 includes an I2C-compatible serial interface for
control of the LED current, as well as for readback of the system
status registers. The I2C chip address is 0x30 (0x60 in write
mode and 0x61 in read mode). Additional I2C addresses are
available on request.
MASTER
STOP
0 = WRITE
S
T
S
P
0
1
1
0
0
0
0
0
0
0
0
CHIP ADDRESS
SUBADDRESS
ADP1649 RECEIVES
DATA
Figure 39. I2C Single Register Write Sequence
MASTER
STOP
0 = WRITE
1 = READ
S
T
S
T
S
0
1
1
0
0
0
0
0
0
0
0
1
1
0
0
0
0
1
0
0
1
P
CHIP ADDRESS
SUBADDRESS
CHIP ADDRESS
ADP1649 SENDS
DATA
Figure 40. I2C Single Register Read Sequence
Rev. 0 | Page 18 of 28
Data Sheet
ADP1649
I²C REGISTER MAP
The lowest bit number (0) represents the least significant bit, the highest bit number (7) represents the most significant bit, and R/W indicates
whether the bit is read only (R), write only (W), or both read and write (R/W).
Table 10. Design Information Register (Register 0x00)
Bit
Bit Name
R/W
Reset State
[7:0]
Manufacturer Information
R
00100010
Table 11. VREF and Timer Register (Register 0x02)
Bit
Bit Name
R/W
Description
[7:6]
IO2_CFG
R/W
GPIO2 configuration
00 = high impedance (default)
01 = indicator LED
10 = TxMASK2 operation mode
11 = analog input (to ADC)
GPIO1 configuration
00 = high impedance (default)
01 = torch
[5:4]
[3:0]
IO1_CFG
FL_TIM
R/W
R/W
10 = TxMASK1 operation mode
11 = reserved
Flash timer value setting
0000 = 100 ms
0001 = 200 ms
0010 = 300 ms
0011 = 400 ms
0100 = 500 ms
0101 = 600 ms
0110 = 700 ms
0111 = 800 ms
1000 = 900 ms
1001 = 1000 ms
1010 = 1100 ms
1011 = 1200 ms
1100 = 1300 ms
1101 = 1400 ms
1110 = 1500 ms
1111 = 1600 ms (default)
Rev. 0 | Page 19 of 28
ADP1649
Data Sheet
Table 12. Current Set Register (Register 0x03)
Bit
Bit Name
R/W
Description
[7:3]
I_FL
R/W
Flash current value setting
00000 = 300 mA
00001 = 350 mA
00010 = 400 mA
00011 = 450 mA
00100 = 500 mA
00101 = 550 mA
00110 = 600 mA
00111 = 650 mA
01000 = 700 mA
01001 = 750 mA
01010 = 800 mA
01011 = 850 mA
01100 = 900 mA
01101 = 950 mA
01110 = 1000 mA (default)
Codes above 01110 are reserved
Torch and assist light current value setting
000 = 25 mA
[2:0]
I_TOR
R/W
001 = 50 mA
010 = 75 mA
011 = 100 mA (default)
100 = 125 mA
101 = 150 mA
110 = 175 mA
111 = 200 mA
Rev. 0 | Page 20 of 28
Data Sheet
ADP1649
Table 13. Output Mode Register (Register 0x04)
Bit
Bit Name
R/W
Description
[7:6]
IL_PEAK
R/W
Inductor peak current-limit setting
00 = 1.75 A
01 = 2.25 A
10 = 2.75 A (default)
11 = reserved
5
STR_LV
R/W
R/W
R/W
R/W
R/W
0 = edge sensitive
1 = level sensitive (default)
0 = frequency foldback to 1.5 MHz not allowed (default)
1 = frequency foldback to 1.5 MHz allowed
0 = output off (default)
1 = output on
4
FREQ_FB
3
OUTPUT_EN
STR_MODE
LED_MOD
2
0 = software strobe mode (software flash occurs when output is enabled in flash mode)
1 = hardware strobe mode (the STROBE pin must go high for flash) (default)
Configures LED output mode
[1:0]
00 = standby mode (default)
01 = voltage output mode, VOUT = 5 V
10 = assist light mode
11 = flash mode
Table 14. Fault Information Register (Register 0x05)
Bit
Bit Name
R/W
Description
7
FL_OVP
R
0 = no fault (default)
1 = overvoltage fault
6
5
4
3
2
FL_SC
FL_OT
FL_TO
FL_TX1
FL_IO2
R
R
R
R
R
0 = no fault (default)
1 = short-circuit fault
0 = no fault (default)
1 = overtemperature fault
0 = no fault (default)
1 = timeout fault
0 = no TxMASK1 operation mode during last flash (default)
1 = TxMASK1 operational mode occurred during last flash
If GPIO2 is configured as TxMASK2
0 = no TxMASK2 operation mode during last flash (default)
1 = TxMASK2 operational mode occurred during last flash
If GPIO2 is configured as ILED
0 = no fault (default)
1 = indicator LED fault
1
0
FL_IL
R
R
0 = no fault (default)
1 = inductor peak current-limit fault
0 = programmed dc current limit is not hit (default)
1 = programmed dc current limit is hit
FL_IDC
Rev. 0 | Page 21 of 28
ADP1649
Data Sheet
Table 15. Input Control Register (Register 0x06)
Bit
Bit Name
R/W
Description
[7:4]
I_TX2
R/W
TxMASK2 operational mode foldback current
0000 = 100 mA
0001 = 150 mA
0010 = 200 mA
0011 = 250 mA
0100 = 300 mA
0101 = 350 mA
0110 = 400 mA (default)
0111 = 450 mA
1000 = 500 mA
1001 = 550 mA
1010 = 600 mA
1011 = 650 mA
1100 = 700 mA
1101 = 750 mA
1110 = 800 mA
1111 = 850 mA
[3:0]
I_TX1
R/W
TxMASK1 operational mode foldback current
0000 = 100 mA
0001 = 150 mA
0010 = 200 mA
0011 = 250 mA
0100 = 300 mA
0101 = 350 mA
0110 = 400 mA (default)
0111 = 450 mA
1000 = 500 mA
1001 = 550 mA
1010 = 600 mA
1011 = 650 mA
1100 = 700 mA
1101 = 750 mA
1110 = 800 mA
1111 = 850 mA
Rev. 0 | Page 22 of 28
Data Sheet
ADP1649
Table 16. Additional Mode Register, AD_MOD (Register 0x07)
Bit
Bit Name
R/W
Description
7
DYN_OVP
R/W
Dynamic overvoltage protection (DOVP)
0 = DOVP off (default)
1 = DOVP on
6
SW_LO
STR_POL
I_ILED
R/W
R/W
R/W
Force 1.5 MHz switching frequency
0 = disabled (default)
1 = enabled
5
Strobe polarity
0 = active low
1 = active high (default)
Indicator LED current
00 = 2.75 mA (default)
01 = 5.5 mA
[4:3]
10 = 8.25 mA
11 = 11 mA
[2:1]
IL_DC
R/W
R/W
Input dc current limit setting the LED current
00 = 1.5 A
01 = 1.75 A
10 = 2.0 A (default)
11 = reserved
0
IL_DC_EN
Input dc current limit
0 = disabled (default)
1 = enabled
Table 17. Additional Mode Register, ADC (Register 0x08)
Bit
Bit Name
R/W
Description
7
Reserved
R/W
Test mode
0 = disabled (default)
1 = enabled
6
FL_VB_LO
R
Programmed VBAT low threshold status; low battery mode must be enabled in Register 0x09
0 = VDD is greater than the VBAT low threshold (default)
1 = VDD is less than the VBAT low threshold
ADC readback value; four bits (see Figure 16, Figure 17, and Figure 18)
ADC enable mode
[5:2]
[1:0]
ADC_VAL
ADC_EN
R/W
R/W
00 = disabled (default)
01 = LED VF measurement
10 = die temperature measurement
11 = external voltage mode
Rev. 0 | Page 23 of 28
ADP1649
Data Sheet
Table 18. Battery Low Mode Register (Register 0x09)
Bit
Bit Name
R/W
Description
7
CL_SOFT
R/W
Soft inductor peak current limit
0 = disabled (ADP1649 is disabled when the inductor peak current limit is reached)
1 = enabled (default)
Current setting for VBAT low mode
0000 = 300 mA
[6:3]
I_VB_LO
R
0001 = 350 mA
0010 = 400 mA
0011 = 450 mA
0100 = 500 mA
0101 = 550 mA
0110 = 600 mA
0111 = 650 mA
1000 = 700 mA
1001 = 750 mA
1010 = 800 mA (default)
1011 = 850 mA
1100 = 900 mA
1101 = 950 mA
1110 = 1000 mA
1111 = reserved
VDD level where VBAT low function is enabled
000 = disabled (default)
001 = 3.3 V
[2:0]
V_VB_LO
R/W
010 = 3.35 V
011 = 3.4 V
100 = 3.45 V
101 = 3.5 V
110 = 3.55 V
111 = 3.6 V
Rev. 0 | Page 24 of 28
Data Sheet
ADP1649
APPLICATIONS INFORMATION
EXTERNAL COMPONENT SELECTION
Selecting the Inductor
To minimize supply noise, place the input capacitor as close to
the VIN pin of the ADP1649 as possible. A low ESR capacitor is
required. Table 20 provides a list of suggested input capacitors.
The ADP1649 boost converter increases the battery voltage
to allow driving of one LED, whose voltage drop is higher than
the battery voltage plus the current source headroom voltage.
This allows the converter to regulate the LED current over the
entire battery voltage range and with a wide variation of LED
forward voltage.
Selecting the Output Capacitor
The output capacitor maintains the output voltage and supplies
the LED current during the period when the NFET power
switch is on. The output capacitor also stabilizes the loop. The
recommended output capacitor is a 10 µF, 6.3 V, X5R/X7R
ceramic capacitor with low ESR.
The inductor saturation current should be greater than the sum
of the dc input current and half of the inductor ripple current. A
reduction in the effective inductance due to saturation increases
the inductor current ripple. Table 19 provides a list of recom-
mended inductors.
Note that dc bias characterization data is available from capa-
citor manufacturers and should be taken into account when
selecting input and output capacitors. The 6.3 V capacitors are
best for most designs. Table 21 provides a list of recommended
output capacitors.
Selecting the Input Capacitor
The ADP1649 requires an input bypass capacitor to supply
transient currents while maintaining constant input and output
voltages. The input capacitor carries the input ripple current,
allowing the input power source to supply only the dc current.
Increased input capacitance reduces the amplitude of the switching
frequency ripple on the battery. Due to the dc bias characteris-
tics of ceramic capacitors, the use of a 0603, 6.3 V, X5R/X7R,
10 µF ceramic capacitor is preferable. Higher value input
capacitors help to reduce the input voltage ripple and improve
transient response.
Higher output capacitor values reduce the output voltage ripple
and improve load transient response. When choosing this value,
it is also important to account for the loss of capacitance caused
by output voltage dc bias.
Ceramic capacitors have a variety of dielectrics, each with different
behavior over temperature and applied voltage. Capacitors must
have a dielectric that ensures the minimum capacitance over the
necessary temperature range and dc bias conditions. X5R or X7R
dielectrics with a voltage rating of 6.3 V or 10 V are recommended
for best performance. Y5V and Z5U dielectrics are not recom-
mended for use with any dc-to-dc converter because of their
poor temperature and dc bias characteristics.
Table 19. Suggested Inductors
Vendor
Coilcraft
Murata
Wurth
Taiyo Yuden
FDK
Value (µH)
Part No.
DCR (mΩ)
ISAT (A)
2.4
3
1.5
2.1
3
Dimensions L × W × H (mm)
3.0 × 3.0 × 1.0
3.2 × 2.5 × 1.0
2.8 × 2.8 × 1.1
3.0 × 3.0 × 1.5
1.0
1.0
1.0
1.0
1.0
XFL3010
43
60
65
36
40
LQM32P_G0
744028001
NR 3015T 1R0N
MIP3226D
2.5 × 2.0 × 1.2
Table 20. Suggested Input Capacitors
Vendor
Murata
TDK
Value
Part No.
Dimensions L × W × H (mm)
1.6 × 0.8 × 0.8
1.6 × 0.8 × 0.8
10 µF, 6.3 V
10 µF, 6.3 V
10 µF, 6.3 V
GRM188R60J106ME47
C1608JB0J106K
JMK107BJ106MA
Taiyo Yuden
1.6 × 0.8 × 0.8
Table 21. Suggested Output Capacitors
Vendor
Murata
TDK
Value
Part No.
Dimensions L × W × H (mm)
1.6 × 0.8 × 0.8
1.6 × 0.8 × 0.8
10 µF, 6.3 V
10 µF, 6.3 V
10 µF, 6.3 V
GRM188R60J106ME47
C1608JB0J106K
JMK107BJ106MA
Taiyo Yuden
1.6 × 0.8 × 0.8
Rev. 0 | Page 25 of 28
ADP1649
Data Sheet
10
0
The worst-case capacitance accounting for capacitor variation
over temperature, component tolerance, and voltage is calcu-
lated using the following equation:
–10
–20
–30
–40
–50
–60
–70
–80
–90
C
EFF = COUT × (1 − TEMPCO) × (1 − TOL)
where:
EFF is the effective capacitance at the operating voltage.
C
TEMPCO is the worst-case capacitor temperature coefficient.
TOL is the worst-case component tolerance.
In this example, the 10 μF X5R capacitor has the following
characteristics:
• TEMPCO from −40°C to +85°C is 15%.
• TOL is 10%.
0
1.26
2.52
3.78
5.04
6.30
DC BIAS VOLTAGE (V)
• COUT at VOUT (max) = 5 V, is 3 μF, as shown in Figure 41.
Figure 41. DC Bias Characteristic of a 6.3 V, 10 μF Ceramic Capacitor
Substituting these values in the equation yields
CEFF = 3 μF × (1 − 0.15) × (1 − 0.1) = 2.3 μF
The effective capacitance needed for stability, which includes
temperature and dc bias effects, is 3.0 μF.
Rev. 0 | Page 26 of 28
Data Sheet
ADP1649
PCB LAYOUT
Poor layout can affect performance, causing electromagnetic
interference (EMI) and electromagnetic compatibility (EMC)
problems, ground bounce, and power losses. Poor layout can
also affect regulation and stability. Figure 42 shows an optimized
layout implemented using the following guidelines:
Analog Devices applications engineers can be contacted
through the Analog Devices sales team to discuss different
layouts based on system design constraints.
C1
Li-ION +
•
Place the inductor, input capacitor, and output capacitor
close to the IC using short tracks. These components carry
high switching frequencies and large currents.
L1
PGND
Li-ION +
•
Route the trace from the inductor to the SW pin, providing
as wide a trace as possible. The easiest path is through the
center of the output capacitor.
Route the LED_OUT path away from the inductor and the
SW node to minimize noise and magnetic interference.
Maximize the size of ground metal on the component side
to help with thermal dissipation.
Use a ground plane with two to three vias connected to the
component side ground near the output capacitor to
reduce noise interference on sensitive circuit nodes.
C2
INDUCTOR
DIGITAL
•
•
•
INPUT/
OUTPUT
2
AREA = 16.4mm
LED
ANODE
Figure 42. Layout of the ADP1649 Driving a High Power White LED (WLCSP)
Rev. 0 | Page 27 of 28
ADP1649
Data Sheet
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
0.660
0.602
0.544
1.54
1.50
0.022
REF
1.46
SEATING
PLANE
3
2
1
A
BALL A1
IDENTIFIER
2.04
2.00
1.96
B
C
D
0.330
0.310
0.290
1.50
REF
0.50
REF
TOP VIEW
(BALL SIDE DOWN)
BOTTOM VIEW
(BALL SIDE UP)
0.04 MAX
0.380
0.352
0.324
COPLANARITY
1.00
REF
0.280
0.250
0.220
Figure 43. 12-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option2
ADP1649ACBZ-R7
ADP1649CB-EVALZ
−40°C to +125°C
12-Ball Wafer Level Chip Scale Package [WLCSP]
Evaluation Board WLCSP Package
CB-12-4
1 Z = RoHS Compliant Part.
2 This package option is halide free.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10779-0-7/12(0)
www.analog.com/ADP1649
Rev. 0 | Page 28 of 28
相关型号：
©2020 ICPDF网 联系我们和版权申明