ADSP-BF536 [ADI]

Blackfin Embedded Processor; Blackfin嵌入式处理器
ADSP-BF536
型号: ADSP-BF536
厂家: ADI    ADI
描述:

Blackfin Embedded Processor
Blackfin嵌入式处理器

文件: 总68页 (文件大小:2430K)
中文:  中文翻译
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Blackfin®  
Embedded Processor  
a
ADSP-BF534/ADSP-BF536/ADSP-BF537  
FEATURES  
PERIPHERALS  
Up to 600 MHz high performance Blackfin processor  
Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,  
40-bit shifter  
RISC-like register and instruction model for ease of  
programming and compiler-friendly support  
Advanced debug, trace, and performance monitoring  
0.8 V to 1.2 V core VDD with on-chip voltage regulation  
2.5 V and 3.3 V-tolerant I/O with specific 5 V-tolerant pins  
182-ball and 208-ball MBGA packages  
IEEE 802.3-compliant 10/100 Ethernet MAC (ADSP-BF536 and  
ADSP-BF537 only)  
Controller area network (CAN) 2.0B interface  
Parallel peripheral interface (PPI), supporting ITU-R 656  
video data formats  
Two dual-channel, full-duplex synchronous serial ports  
(SPORTs), supporting eight stereo I2S channels  
12 peripheral DMAs, 2 mastered by the Ethernet MAC  
Two memory-to-memory DMAs with external request lines  
Event handler with 32 interrupt inputs  
Serial peripheral interface (SPI)-compatible  
Two UARTs with IrDA® support  
MEMORY  
Up to 132K bytes of on-chip memory comprised of:  
Instruction SRAM/cache; instruction SRAM;  
Two-wire interface (TWI) controller  
data SRAM/cache; additional dedicated data SRAM;  
scratchpad SRAM (see Table 1 on Page 3 for available  
memory configurations)  
Eight 32-bit timer/counters with PWM support  
Real-time clock (RTC) and watchdog timer  
32-bit core timer  
48 general-purpose I/Os (GPIOs), 8 with high current drivers  
On-chip PLL capable of 1
؋
 to 63
؋
 frequency multiplication  
Debug/JTAG interface  
External memory controller with glueless support for SDRAM  
and asynchronous 8-bit and 16-bit memories  
Flexible booting options from external flash, SPI and TWI  
memory or from SPI, TWI, and UART host devices  
Memory management unit providing memory protection  
JTAG TEST AND EMULATION  
VOLTAGE REGULATOR  
PERIPHERAL ACCESS BUS  
WATCHDOG TIMER  
RTC  
INTERRUPT  
CONTROLLER  
B
CAN  
TWI  
PORT  
J
L1  
L1  
DATA  
MEMORY  
SPORT0  
SPORT1  
PPI  
DMA  
CONTROLLER  
INSTRUCTION  
MEMORY  
GPIO  
PORT  
G
EXTERNAL  
ACCESS  
BUS  
DMA CORE BUS  
UART 0-1  
GPIO  
PORT  
F
EXTERNAL PORT  
FLASH, SDRAM CONTROL  
SPI  
TIMERS 0-7  
16  
GPIO  
PORT  
H
ETHERNET MAC  
(ADSP-BF536/  
BF537 ONLY)  
BOOT ROM  
Figure 1. Functional Block Diagram  
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.  
Rev. B  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2006 Analog Devices, Inc. All rights reserved.  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
TABLE OF CONTENTS  
General Description ................................................. 3  
Portable Low Power Architecture ............................. 3  
System Integration ................................................ 3  
Blackfin Processor Peripherals ................................. 3  
Blackfin Processor Core .......................................... 4  
Memory Architecture ............................................ 5  
DMA Controllers .................................................. 8  
Real-Time Clock ................................................... 9  
Watchdog Timer .................................................. 9  
Timers ............................................................... 9  
Serial Ports (SPORTs) .......................................... 10  
Serial Peripheral Interface (SPI) Port ....................... 10  
UART Ports ...................................................... 10  
Controller Area Network (CAN) ............................ 11  
TWI Controller Interface ...................................... 11  
10/100 Ethernet MAC .......................................... 11  
Ports ................................................................ 12  
Parallel Peripheral Interface (PPI) ........................... 12  
Dynamic Power Management ................................ 13  
Voltage Regulation .............................................. 14  
Clock Signals ..................................................... 14  
Booting Modes ................................................... 16  
Instruction Set Description ................................... 16  
Development Tools ............................................. 17  
Designing an Emulator-Compatible Processor Board .. 18  
Related Documents ............................................. 18  
Pin Descriptions .................................................... 19  
Specifications ........................................................ 23  
Operating Conditions .......................................... 23  
Electrical Characteristics ....................................... 24  
Absolute Maximum Ratings .................................. 25  
ESD Sensitivity ................................................... 25  
Package Information ............................................ 25  
Timing Specifications ........................................... 26  
Asynchronous Memory Read Cycle Timing ............ 28  
Asynchronous Memory Write Cycle Timing ........... 29  
External Port Bus Request and Grant Cycle Timing .. 30  
SDRAM Interface Timing .................................. 31  
External DMA Request Timing ............................ 32  
Parallel Peripheral Interface Timing ...................... 33  
Serial Ports ..................................................... 36  
Serial Peripheral Interface Port—Master Timing ...... 40  
Serial Peripheral Interface Port—Slave Timing ........ 41  
Universal Asynchronous Receiver-Transmitter (UART)  
Ports—Receive and Transmit Timing ................. 42  
General-Purpose Port Timing ............................. 43  
Timer Cycle Timing .......................................... 44  
Timer Clock Timing ......................................... 45  
JTAG Test and Emulation Port Timing .................. 46  
10/100 Ethernet MAC Controller Timing ............... 47  
Output Drive Currents ......................................... 50  
Power Dissipation ............................................... 53  
Test Conditions .................................................. 54  
Capacitive Loading .............................................. 55  
Thermal Characteristics ........................................ 58  
182-Ball Mini-BGA Pinout ....................................... 59  
208-Ball Sparse Mini-BGA Pinout .............................. 62  
Outline Dimensions ................................................ 65  
Surface Mount Design .......................................... 66  
Ordering Guide ..................................................... 66  
REVISION HISTORY  
7/07—Revision B  
Revised Figure 47, Figure 48, and Figure 49 Under  
Test Conditions ..................................................... 54  
For this revision of the data sheet, the ADSP-BF534,  
ADSP-BF536, and ADSP-BF537 have been combined into  
a single family data sheet. Because of this change, not all  
processor features and attributes apply across all products. See  
Table 1 on Page 3 for a breakdown of product offerings.  
Added 208-Ball Mini BGA Thermal Characteristics on Page 58  
and 208-Ball Sparse Mini-BGA Pinout on Page 62.  
Added Table 10, Maximum Duty Cycle for Input Transient  
Voltage ............................................................. 25  
Added Universal Asynchronous Receiver-Transmitter (UART)  
Ports—Receive and Transmit Timing ......................... 42  
Rev. B  
| Page 2 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
GENERAL DESCRIPTION  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors are  
members of the Blackfin family of products, incorporating the  
Analog Devices/Intel Micro Signal Architecture (MSA).  
Blackfin processors combine a dual-MAC state-of-the-art signal  
processing engine, the advantages of a clean, orthogonal RISC-  
like microprocessor instruction set, and single-instruction,  
multiple-data (SIMD) multimedia capabilities into a single  
instruction-set architecture.  
PORTABLE LOW POWER ARCHITECTURE  
Blackfin processors provide world-class power management  
and performance. They are produced with a low power and low  
voltage design methodology and feature on-chip dynamic  
power management, which is the ability to vary both the voltage  
and frequency of operation to significantly lower overall power  
consumption. This capability can result in a substantial reduc-  
tion in power consumption, compared with just varying the  
frequency of operation. This allows longer battery life for  
portable appliances.  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors are  
completely code and pin compatible. They differ only with  
respect to their performance, on-chip memory, and presence of  
the Ethernet MAC module. Specific performance, memory, and  
feature configurations are shown in Table 1.  
SYSTEM INTEGRATION  
The Blackfin processor is a highly integrated system-on-a-chip  
solution for the next generation of embedded network-con-  
nected applications. By combining industry-standard interfaces  
with a high performance signal processing core, cost-effective  
applications can be developed quickly, without the need for  
costly external components. The system peripherals include an  
IEEE-compliant 802.3 10/100 Ethernet MAC (ADSP-BF536 and  
ADSP-BF537 only), a CAN 2.0B controller, a TWI controller,  
two UART ports, an SPI port, two serial ports (SPORTs), nine  
general-purpose 32-bit timers (eight with PWM capability), a  
real-time clock, a watchdog timer, and a parallel peripheral  
interface (PPI).  
Table 1. Processor Comparison  
Features  
Ethernet MAC  
1
1
1
1
2
2
1
8
1
1
1
48  
1
1
1
2
2
1
8
1
1
1
48  
CAN  
TWI  
1
SPORTs  
2
BLACKFIN PROCESSOR PERIPHERALS  
UARTs  
2
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors con-  
tains a rich set of peripherals connected to the core via several  
high bandwidth buses, providing flexibility in system configura-  
tion as well as excellent overall system performance (see the  
block diagram on Page 1). The processors contain dedicated  
network communication modules and high speed serial and  
parallel ports, an interrupt controller for flexible management  
of interrupts from the on-chip peripherals or external sources,  
and power management control functions to tailor the perfor-  
mance and power characteristics of the processor and system to  
many application scenarios.  
SPI  
1
GP Timers  
8
Watchdog Timers  
1
RTC  
1
Parallel Peripheral Interface  
GPIOs  
1
48  
L1 Instruction 16K bytes 16K bytes 16K bytes  
SRAM/Cache  
L1 Instruction 48K bytes 48K bytes 48K bytes  
SRAM  
Memory  
Configuration  
All of the peripherals, except for the general-purpose I/O, CAN,  
TWI, real-time clock, and timers, are supported by a flexible  
DMA structure. There are also separate memory DMA channels  
dedicated to data transfers between the processor’s various  
memory spaces, including external SDRAM and asynchronous  
memory. Multiple on-chip buses running at up to 133 MHz  
provide enough bandwidth to keep the processor core running  
along with activity on all of the on-chip and external  
peripherals.  
L1 Data  
32K bytes 32K bytes 32K bytes  
SRAM/Cache  
L1 Data SRAM 32K bytes  
L1 Scratchpad 4K bytes  
32K bytes  
4K bytes 4K bytes  
2K bytes 2K bytes  
400 MHz 600 MHz  
L3 Boot ROM  
2K bytes  
500 MHz  
Maximum Speed Grade  
Package Options:  
Sparse Mini-BGA  
Mini-BGA  
208-Ball  
182-Ball  
208-Ball 208-Ball  
182-Ball 182-Ball  
The Blackfin processors include an on-chip voltage regulator in  
support of the processors’ dynamic power management capabil-  
ity. The voltage regulator provides a range of core voltage levels  
when supplied from a single 2.25 V to 3.6 V input. The voltage  
regulator can be bypassed at the user’s discretion.  
By integrating a rich set of industry-leading system peripherals  
and memory, the Blackfin processors are the platform of choice  
for next-generation applications that require RISC-like pro-  
grammability, multimedia support, and leading-edge signal  
processing in one integrated package.  
Rev. B  
|
Page 3 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
instructions include byte alignment and packing operations,  
16-bit and 8-bit adds with clipping, 8-bit average operations,  
and 8-bit subtract/absolute value/accumulate (SAA) operations.  
Also provided are the compare/select and vector search  
instructions.  
BLACKFIN PROCESSOR CORE  
As shown in Figure 2 on Page 4, the Blackfin processor core  
contains two 16-bit multipliers, two 40-bit accumulators, two  
40-bit ALUs, four video ALUs, and a 40-bit shifter. The compu-  
tation units process 8-, 16-, or 32-bit data from the register file.  
For certain instructions, two 16-bit ALU operations can be per-  
formed simultaneously on register pairs (a 16-bit high half and  
16-bit low half of a compute register). If the second ALU is used,  
quad 16-bit operations are possible.  
The compute register file contains eight 32-bit registers. When  
performing compute operations on 16-bit operand data, the  
register file operates as 16 independent 16-bit registers. All  
operands for compute operations come from the multiported  
register file and instruction constant fields.  
The 40-bit shifter can perform shifts and rotates and is used to  
support normalization, field extract, and field deposit  
instructions.  
Each MAC can perform a 16-bit by 16-bit multiply in each  
cycle, accumulating the results into the 40-bit accumulators.  
Signed and unsigned formats, rounding, and saturation  
are supported.  
The program sequencer controls the flow of instruction execu-  
tion, including instruction alignment and decoding. For  
program flow control, the sequencer supports PC relative and  
indirect conditional jumps (with static branch prediction), and  
subroutine calls. Hardware is provided to support zero-over-  
head looping. The architecture is fully interlocked, meaning that  
the programmer need not manage the pipeline when executing  
instructions with data dependencies.  
The ALUs perform a traditional set of arithmetic and logical  
operations on 16-bit or 32-bit data. In addition, many special  
instructions are included to accelerate various signal processing  
tasks. These include bit operations such as field extract and pop-  
ulation count, modulo 232 multiply, divide primitives, saturation  
and rounding, and sign/exponent detection. The set of video  
ADDRESS ARITHMETIC UNIT  
SP  
FP  
P5  
P4  
I3  
I2  
I1  
I0  
L3  
L2  
L1  
L0  
B3  
B2  
B1  
B0  
M3  
M2  
M1  
M0  
DAG1  
P3  
DAG0  
P2  
P1  
P0  
DA1 32  
DA0 32  
32  
32  
RAB  
PREG  
SD 32  
LD1 32  
LD0 32  
ASTAT  
32  
32  
SEQUENCER  
R7.H  
R6.H  
R5.H  
R4.H  
R3.H  
R2.H  
R1.H  
R0.H  
R7.L  
R6.L  
R5.L  
R4.L  
R3.L  
R2.L  
R1.H  
R0.L  
ALIGN  
16  
16  
8
8
8
8
DECODE  
BARREL  
SHIFTER  
LOOP BUFFER  
40  
40  
40 40  
A0  
A1  
CONTROL  
UNIT  
32  
32  
DATA ARITHMETIC UNIT  
Figure 2. Blackfin Processor Core  
Rev. B  
| Page 4 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
The address arithmetic unit provides two addresses for simulta-  
neous dual fetches from memory. It contains a multiported  
register file consisting of four sets of 32-bit index, modify,  
length, and base registers (for circular buffering), and eight  
additional 32-bit pointer registers (for C-style indexed stack  
manipulation).  
The memory DMA controller provides high bandwidth data-  
movement capability. It can perform block transfers of code or  
data between the internal memory and the external  
memory spaces.  
Internal (On-Chip) Memory  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors have  
three blocks of on-chip memory providing high-bandwidth  
access to the core.  
Blackfin processors support a modified Harvard architecture in  
combination with a hierarchical memory structure. Level 1 (L1)  
memories are those that typically operate at the full processor  
speed with little or no latency. At the L1 level, the instruction  
memory holds instructions only. The two data memories hold  
data, and a dedicated scratchpad data memory stores stack and  
local variable information.  
The first block is the L1 instruction memory, consisting of  
64K bytes SRAM, of which 16K bytes can be configured as a  
four-way set-associative cache. This memory is accessed at full  
processor speed.  
In addition, multiple L1 memory blocks are provided, offering a  
configurable mix of SRAM and cache. The memory manage-  
ment unit (MMU) provides memory protection for individual  
tasks that may be operating on the core and can protect system  
registers from unintended access.  
The second on-chip memory block is the L1 data memory, con-  
sisting of up to two banks of up to 32K bytes each. Each memory  
bank is configurable, offering both cache and SRAM functional-  
ity. This memory block is accessed at full processor speed.  
The third memory block is a 4K byte scratchpad SRAM, which  
runs at the same speed as the L1 memories, but is only accessible  
as data SRAM, and cannot be configured as cache memory.  
The architecture provides three modes of operation: user mode,  
supervisor mode, and emulation mode. User mode has  
restricted access to certain system resources, thus providing a  
protected software environment, while supervisor mode has  
unrestricted access to the system and core resources.  
External (Off-Chip) Memory  
External memory is accessed via the EBIU. This 16-bit interface  
provides a glueless connection to a bank of synchronous DRAM  
(SDRAM) as well as up to four banks of asynchronous memory  
devices including flash, EPROM, ROM, SRAM, and memory  
mapped I/O devices.  
The Blackfin processor instruction set has been optimized so  
that 16-bit opcodes represent the most frequently used instruc-  
tions, resulting in excellent compiled code density. Complex  
DSP instructions are encoded into 32-bit opcodes, representing  
fully featured multifunction instructions. Blackfin processors  
support a limited multi-issue capability, where a 32-bit instruc-  
tion can be issued in parallel with two 16-bit instructions,  
allowing the programmer to use many of the core resources in a  
single instruction cycle.  
The PC133-compliant SDRAM controller can be programmed  
to interface to up to 512M bytes of SDRAM. A separate row can  
be open for each SDRAM internal bank, and the SDRAM con-  
troller supports up to 4 internal SDRAM banks, improving  
overall performance.  
The Blackfin processor assembly language uses an algebraic syn-  
tax for ease of coding and readability. The architecture has been  
optimized for use in conjunction with the C/C++ compiler,  
resulting in fast and efficient software implementations.  
The asynchronous memory controller can be programmed to  
control up to four banks of devices with very flexible timing  
parameters for a wide variety of devices. Each bank occupies a  
1M byte segment regardless of the size of the devices used, so  
that these banks are only contiguous if each is fully populated  
with 1M byte of memory.  
MEMORY ARCHITECTURE  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors view  
memory as a single unified 4G byte address space, using 32-bit  
addresses. All resources, including internal memory, external  
memory, and I/O control registers, occupy separate sections of  
this common address space. The memory portions of this  
address space are arranged in a hierarchical structure to provide  
a good cost/performance balance of some very fast, low latency  
on-chip memory as cache or SRAM, and larger, lower cost, and  
performance off-chip memory systems. See Figure 3.  
I/O Memory Space  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors do  
not define a separate I/O space. All resources are mapped  
through the flat 32-bit address space. On-chip I/O devices have  
their control registers mapped into memory-mapped registers  
(MMRs) at addresses near the top of the 4G byte address space.  
These are separated into two smaller blocks, one which contains  
the control MMRs for all core functions, and the other which  
contains the registers needed for setup and control of the on-  
chip peripherals outside of the core. The MMRs are accessible  
only in supervisor mode and appear as reserved space to on-  
chip peripherals.  
The on-chip L1 memory system is the highest performance  
memory available to the Blackfin processor. The off-chip mem-  
ory system, accessed through the external bus interface unit  
(EBIU), provides expansion with SDRAM, flash memory, and  
SRAM, optionally accessing up to 516M bytes of  
physical memory.  
Rev. B  
|
Page 5 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
ADSP-BF534/ADSP-BF537 MEMORY MAP  
0xFFFF FFFF  
ADSP-BF536 MEMORY MAP  
0xFFFF FFFF  
0xFFE0 0000  
0xFFC0 0000  
0xFFB0 1000  
0xFFB0 0000  
0xFFA1 4000  
0xFFA1 0000  
0xFFA0 C000  
0xFFA0 8000  
0xFFA0 0000  
0xFF90 8000  
0xFF90 4000  
0xFF90 0000  
0xFF80 8000  
0xFF80 4000  
0xFF80 0000  
0xEF00 0800  
0xEF00 0000  
0x2040 0000  
0x2030 0000  
0x2020 0000  
0x2010 0000  
0x2000 0000  
0x0000 0000  
CORE MMR REGISTERS (2M BYTES)  
SYSTEM MMR REGISTERS (2M BYTES)  
RESERVED  
CORE MMR REGISTERS (2M BYTES)  
0xFFE0 0000  
SYSTEM MMR REGISTERS (2M BYTES)  
0xFFC0 0000  
RESERVED  
0xFFB0 1000  
SCRATCHPAD SRAM (4K BYTES)  
0xFFB0 0000  
SCRATCHPAD SRAM (4K BYTES)  
RESERVED  
RESERVED  
0xFFA1 4000  
INSTRUCTION SRAM/CACHE (16K BYTES)  
RESERVED  
INSTRUCTION SRAM/CACHE (16K BYTES)  
0xFFA1 0000  
RESERVED  
0xFFA0 C000  
INSTRUCTION BANK B SRAM (16K BYTES)  
0xFFA0 8000  
INSTRUCTION BANK B SRAM (16K BYTES)  
INSTRUCTION BANK A SRAM (32K BYTES)  
RESERVED  
INSTRUCTION BANK A SRAM (32K BYTES)  
0xFFA0 0000  
RESERVED  
0xFF90 8000  
DATA BANK B SRAM/CACHE (16K BYTES)  
RESERVED  
DATA BANK B SRAM/CACHE (16K BYTES)  
0xFF90 4000  
DATA BANK B SRAM (16K BYTES)  
0xFF90 0000  
RESERVED  
0xFF80 8000  
DATA BANK A SRAM/CACHE (16K BYTES)  
0xFF80 4000  
RESERVED  
DATA BANK A SRAM/CACHE (16K BYTES)  
RESERVED  
RESERVED  
DATA BANK A SRAM (16K BYTES)  
0xFF80 0000  
RESERVED  
0xEF00 0800  
BOOT ROM (2K BYTES)  
0xEF00 0000  
BOOT ROM (2K BYTES)  
RESERVED  
RESERVED  
0x2040 0000  
ASYNC MEMORY BANK 3 (1M BYTES)  
ASYNC MEMORY BANK 2 (1M BYTES)  
ASYNC MEMORY BANK 1 (1M BYTES)  
ASYNC MEMORY BANK 0 (1M BYTES)  
ASYNC MEMORY BANK 3 (1M BYTES)  
0x2030 0000  
ASYNC MEMORY BANK 2 (1M BYTES)  
0x2020 0000  
ASYNC MEMORY BANK 1 (1M BYTES)  
0x2010 0000  
ASYNC MEMORY BANK 0 (1M BYTES)  
0x2000 0000  
SDRAM MEMORY (16M BYTES TO 512M BYTES)  
SDRAM MEMORY (16M BYTES TO 512M BYTES)  
0x0000 0000  
Figure 3. ADSP-BF534/ADSP-BF536/ADSP-BF537 Memory Maps  
• Nonmaskable Interrupt (NMI) – The NMI event can be  
Booting  
generated by the software watchdog timer or by the NMI  
input signal to the processor. The NMI event is frequently  
used as a power-down indicator to initiate an orderly shut-  
down of the system.  
The Blackfin processor contains a small on-chip boot kernel,  
which configures the appropriate peripheral for booting. If the  
Blackfin processor is configured to boot from boot ROM mem-  
ory space, the processor starts executing from the on-chip boot  
ROM. For more information, see Booting Modes on Page 16.  
• Exceptions – Events that occur synchronously to program  
flow (in other words, the exception is taken before the  
instruction is allowed to complete). Conditions such as  
data alignment violations and undefined instructions cause  
exceptions.  
Event Handling  
The event controller on the Blackfin processor handles all asyn-  
chronous and synchronous events to the processor. The  
Blackfin processor provides event handling that supports both  
nesting and prioritization. Nesting allows multiple event service  
routines to be active simultaneously. Prioritization ensures that  
servicing of a higher priority event takes precedence over servic-  
ing of a lower priority event. The controller provides support for  
five different types of events:  
• Interrupts – Events that occur asynchronously to program  
flow. They are caused by input pins, timers, and other  
peripherals, as well as by an explicit software instruction.  
Each event type has an associated register to hold the return  
address and an associated return-from-event instruction. When  
an event is triggered, the state of the processor is saved on the  
supervisor stack.  
• Emulation – An emulation event causes the processor to  
enter emulation mode, allowing command and control of  
the processor via the JTAG interface.  
The Blackfin processor event controller consists of two stages,  
the core event controller (CEC) and the system interrupt con-  
troller (SIC). The core event controller works with the system  
interrupt controller to prioritize and control all system events.  
• Reset – This event resets the processor.  
Rev. B  
| Page 6 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Conceptually, interrupts from the peripherals enter into the  
SIC, and are then routed directly into the general-purpose inter-  
rupts of the CEC.  
Table 3. System Interrupt Controller (SIC)  
Default  
Peripheral  
Interrupt ID  
Peripheral Interrupt Event  
PLL Wakeup  
Mapping  
Core Event Controller (CEC)  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
0
1
1
1
1
1
2
2
The CEC supports nine general-purpose interrupts (IVG15–7),  
in addition to the dedicated interrupt and exception events. Of  
these general-purpose interrupts, the two lowest priority  
interrupts (IVG15–14) are recommended to be reserved for  
software interrupt handlers, leaving seven prioritized interrupt  
inputs to support the peripherals of the Blackfin processor.  
Table 2 describes the inputs to the CEC, identifies their names  
in the event vector table (EVT), and lists their priorities.  
DMA Error (generic)  
DMAR0 Block Interrupt  
DMAR1 Block Interrupt  
DMAR0 Overflow Error  
DMAR1 Overflow Error  
CAN Error  
Ethernet Error (ADSP-BF536 and  
ADSP-BF537 only)  
Table 2. Core Event Controller (CEC)  
SPORT 0 Error  
IVG7  
2
Priority  
SPORT 1 Error  
IVG7  
2
(0 Is Highest) Event Class  
EVT Entry  
EMU  
PPI Error  
IVG7  
2
0
Emulation/Test Control  
SPI Error  
IVG7  
2
1
Reset  
RST  
UART0 Error  
IVG7  
2
2
Nonmaskable Interrupt  
Exception  
NMI  
UART1 Error  
IVG7  
2
3
EVX  
Real-Time Clock  
IVG8  
3
4
Reserved  
DMA Channel 0 (PPI)  
DMA Channel 3 (SPORT 0 Rx)  
DMA Channel 4 (SPORT 0 Tx)  
DMA Channel 5 (SPORT 1 Rx)  
DMA Channel 6 (SPORT 1 Tx)  
TWI  
IVG8  
4
5
Hardware Error  
IVHW  
IVTMR  
IVG7  
IVG9  
5
6
Core Timer  
IVG9  
6
7
General-Purpose Interrupt 7  
General-Purpose Interrupt 8  
General-Purpose Interrupt 9  
General-Purpose Interrupt 10  
General-Purpose Interrupt 11  
General-Purpose Interrupt 12  
General-Purpose Interrupt 13  
General-Purpose Interrupt 14  
General-Purpose Interrupt 15  
IVG9  
7
8
IVG8  
IVG9  
8
9
IVG9  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG11  
IVG11  
IVG11  
9
10  
11  
12  
13  
14  
15  
IVG10  
IVG11  
IVG12  
IVG13  
IVG14  
IVG15  
DMA Channel 7 (SPI)  
DMA Channel 8 (UART0 Rx)  
DMA Channel 9 (UART0 Tx)  
DMA Channel 10 (UART1 Rx)  
DMA Channel 11 (UART1 Tx)  
CAN Rx  
10  
11  
12  
13  
14  
15  
16  
17  
CAN Tx  
System Interrupt Controller (SIC)  
DMA Channel 1 (Ethernet Rx,  
The system interrupt controller provides the mapping and rout-  
ing of events from the many peripheral interrupt sources to the  
prioritized general-purpose interrupt inputs of the CEC.  
Although the processor provides a default mapping, the user  
can alter the mappings and priorities of interrupt events by writ-  
ing the appropriate values into the interrupt assignment  
registers (IAR). Table 3 describes the inputs into the SIC and the  
default mappings into the CEC.  
ADSP-BF536 and ADSP-BF537 only)  
Port H Interrupt A  
IVG11  
IVG11  
17  
18  
DMA Channel 2 (Ethernet Tx,  
ADSP-BF536 and ADSP-BF537 only)  
Port H Interrupt B  
Timer 0  
IVG11  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
IVG12  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
Timer 1  
Timer 2  
Timer 3  
Timer 4  
Timer 5  
Timer 6  
Timer 7  
Port F, G Interrupt A  
Port G Interrupt B  
Rev. B  
|
Page 7 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Table 3. System Interrupt Controller (SIC) (Continued)  
• SIC interrupt wakeup enable register (SIC_IWR) – By  
enabling the corresponding bit in this register, a peripheral  
can be configured to wake up the processor, should the  
core be idled when the event is generated. (For more infor-  
mation, see Dynamic Power Management on Page 13.)  
Default  
Peripheral  
Peripheral Interrupt Event  
Mapping  
Interrupt ID  
DMA Channels 12 and 13  
(Memory DMA Stream 0)  
IVG13  
IVG13  
29  
30  
Because multiple interrupt sources can map to a single general-  
purpose interrupt, multiple pulse assertions can occur simulta-  
neously, before or during interrupt processing for an interrupt  
event already detected on this interrupt input. The IPEND reg-  
ister contents are monitored by the SIC as the interrupt  
acknowledgement.  
DMA Channels 14 and 15  
(Memory DMA Stream 1)  
Software Watchdog Timer  
Port F Interrupt B  
IVG13  
IVG13  
31  
31  
Event Control  
The appropriate ILAT register bit is set when an interrupt rising  
edge is detected (detection requires two core clock cycles). The  
bit is cleared when the respective IPEND register bit is set. The  
IPEND bit indicates that the event has entered into the proces-  
sor pipeline. At this point the CEC recognizes and queues the  
next rising edge event on the corresponding event input. The  
minimum latency from the rising edge transition of the general-  
purpose interrupt to the IPEND output asserted is three core  
clock cycles; however, the latency can be much higher, depend-  
ing on the activity within and the state of the processor.  
The Blackfin processor provides a very flexible mechanism to  
control the processing of events. In the CEC, three registers are  
used to coordinate and control events. Each register is  
16 bits wide:  
• CEC interrupt latch register (ILAT) – Indicates when  
events have been latched. The appropriate bit is set when  
the processor has latched the event and cleared when the  
event has been accepted into the system. This register is  
updated automatically by the controller, but it may be writ-  
ten only when its corresponding IMASK bit is cleared.  
DMA CONTROLLERS  
• CEC interrupt mask register (IMASK) – Controls the  
masking and unmasking of individual events. When a bit is  
set in the IMASK register, that event is unmasked and is  
processed by the CEC when asserted. A cleared bit in the  
IMASK register masks the event, preventing the processor  
from servicing the event even though the event may be  
latched in the ILAT register. This register may be read or  
written while in supervisor mode. (Note that general-pur-  
pose interrupts can be globally enabled and disabled with  
the STI and CLI instructions, respectively.)  
The Blackfin processors have multiple, independent DMA con-  
trollers that support automated data transfers with minimal  
overhead for the processor core. DMA transfers can occur  
between the processor’s internal memories and any of its DMA-  
capable peripherals. Additionally, DMA transfers can be accom-  
plished between any of the DMA-capable peripherals and  
external devices connected to the external memory interfaces,  
including the SDRAM controller and the asynchronous mem-  
ory controller. DMA-capable peripherals include the Ethernet  
MAC (ADSP-BF536 and ADSP-BF537 only), SPORTs, SPI port,  
UARTs, and PPI. Each individual DMA-capable peripheral has  
at least one dedicated DMA channel.  
• CEC interrupt pending register (IPEND) – The IPEND  
register keeps track of all nested events. A set bit in the  
IPEND register indicates the event is currently active or  
nested at some level. This register is updated automatically  
by the controller but may be read while in supervisor mode.  
The DMA controller supports both one-dimensional (1-D) and  
two-dimensional (2-D) DMA transfers. DMA transfer initial-  
ization can be implemented from registers or from sets of  
parameters called descriptor blocks.  
The SIC allows further control of event processing by providing  
three 32-bit interrupt control and status registers. Each register  
contains a bit corresponding to each of the peripheral interrupt  
events shown in Table 3 on Page 7.  
The 2-D DMA capability supports arbitrary row and column  
sizes up to 64K elements by 64K elements, and arbitrary row  
and column step sizes up to 32K elements. Furthermore, the  
column step size can be less than the row step size, allowing  
implementation of interleaved data streams. This feature is  
especially useful in video applications where data can be de-  
interleaved on the fly.  
• SIC interrupt mask register (SIC_IMASK) – Controls the  
masking and unmasking of each peripheral interrupt event.  
When a bit is set in the register, that peripheral event is  
unmasked and is processed by the system when asserted. A  
cleared bit in the register masks the peripheral event, pre-  
venting the processor from servicing the event.  
Examples of DMA types supported by the DMA controller  
include:  
• SIC interrupt status register (SIC_ISR) – As multiple  
peripherals can be mapped to a single event, this register  
allows the software to determine which peripheral event  
source triggered the interrupt. A set bit indicates the  
peripheral is asserting the interrupt, and a cleared bit indi-  
cates the peripheral is not asserting the event.  
• A single, linear buffer that stops upon completion  
• A circular, auto-refreshing buffer that interrupts on each  
full or fractionally full buffer  
• 1-D or 2-D DMA using a linked list of descriptors  
• 2-D DMA using an array of descriptors, specifying only the  
base DMA address within a common page.  
Rev. B  
| Page 8 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
In addition to the dedicated peripheral DMA channels, there are  
two memory DMA channels provided for transfers between the  
various memories of the processor system. This enables trans-  
fers of blocks of data between any of the memories—including  
external SDRAM, ROM, SRAM, and flash memory—with mini-  
mal processor intervention. Memory DMA transfers can be  
controlled by a very flexible descriptor-based methodology or  
by a standard register-based autobuffer mechanism.  
RTXI  
RTXO  
R1  
X1  
C1  
C2  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors also  
have an external DMA controller capability via dual external  
DMA request pins when used in conjunction with the external  
bus interface unit (EBIU). This functionality can be used when a  
high speed interface is required for external FIFOs and high  
bandwidth communications peripherals such as USB 2.0. It  
allows control of the number of data transfers for memDMA.  
The number of transfers per edge is programmable. This feature  
can be programmed to allow memDMA to have an increased  
priority on the external bus relative to the core.  
SUGGESTED COMPONENTS:  
ECLIPTEK EC38J (THROUGH-HOLE PACKAGE)  
EPSON MC405 12pF LOAD (SURFACE MOUNT PACKAGE)  
C1 = 22pF  
C2 = 22pF  
R1 = 10M  
YSTAL SPECIFIED FOR X1.  
CONTACT CRYSTAL MANUFACTURER FOR DETAILS. C1 AND C2  
SPECIFICATIONS ASSUME BOARD TRACE CAPACITANCE OF 3pF.  
Figure 4. External Components for RTC  
or general-purpose interrupt, if the timer expires before being  
reset by software. The programmer initializes the count value of  
the timer, enables the appropriate interrupt, then enables the  
timer. Thereafter, the software must reload the counter before it  
counts to zero from the programmed value. This protects the  
system from remaining in an unknown state where software,  
which would normally reset the timer, has stopped running due  
to an external noise condition or software error.  
REAL-TIME CLOCK  
The real-time clock (RTC) provides a robust set of digital watch  
features, including current time, stopwatch, and alarm. The  
RTC is clocked by a 32.768 kHz crystal external to the  
processor. The RTC peripheral has dedicated power supply pins  
so that it can remain powered up and clocked even when the  
rest of the processor is in a low-power state. The RTC provides  
several programmable interrupt options, including interrupt  
per second, minute, hour, or day clock ticks, interrupt on pro-  
grammable stopwatch countdown, or interrupt at a  
programmed alarm time.  
If configured to generate a hardware reset, the watchdog timer  
resets both the core and the processor peripherals. After a reset,  
software can determine if the watchdog was the source of the  
hardware reset by interrogating a status bit in the watchdog  
timer control register.  
The 32.768 kHz input clock frequency is divided down to a 1 Hz  
signal by a prescaler. The counter function of the timer consists  
of four counters: a 60-second counter, a 60-minute counter, a  
24-hour counter, and an 32,768-day counter.  
The timer is clocked by the system clock (SCLK), at a maximum  
frequency of fSCLK  
.
TIMERS  
When enabled, the alarm function generates an interrupt when  
the output of the timer matches the programmed value in the  
alarm control register. There are two alarms: The first alarm is  
for a time of day, while the second alarm is for a day and time of  
that day.  
There are nine general-purpose programmable timer units in  
the processor. Eight timers have an external pin that can be con-  
figured either as a pulse width modulator (PWM) or timer  
output, as an input to clock the timer, or as a mechanism for  
measuring pulse widths and periods of external events. These  
timers can be synchronized to an external clock input to the sev-  
eral other associated PF pins, to an external clock input to the  
PPI_CLK input pin, or to the internal SCLK.  
The stopwatch function counts down from a programmed  
value, with one-second resolution. When the stopwatch is  
enabled and the counter underflows, an interrupt is generated.  
Like the other peripherals, the RTC can wake up the processor  
from sleep mode upon generation of any RTC wakeup event.  
Additionally, an RTC wakeup event can wake up the processor  
from deep sleep mode, and wake up the on-chip internal voltage  
regulator from the hibernate operating mode.  
The timer units can be used in conjunction with the two UARTs  
and the CAN controller to measure the width of the pulses in  
the data stream to provide a software auto-baud detect function  
for the respective serial channels.  
Connect RTC pins RTXI and RTXO with external components  
as shown in Figure 4.  
The timers can generate interrupts to the processor core provid-  
ing periodic events for synchronization, either to the system  
clock or to a count of external signals.  
WATCHDOG TIMER  
In addition to the eight general-purpose programmable timers,  
a ninth timer is also provided. This extra timer is clocked by the  
internal processor clock and is typically used as a system tick  
clock for generating periodic interrupts in an operating system.  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors  
include a 32-bit timer that can be used to implement a software  
watchdog function. A software watchdog can improve system  
availability by forcing the processor to a known state through  
generation of a hardware reset, nonmaskable interrupt (NMI),  
Rev. B  
|
Page 9 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
port provides a full-duplex, synchronous serial interface, which  
supports both master/slave modes and multimaster  
environments.  
SERIAL PORTS (SPORTs)  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors  
incorporate two dual-channel synchronous serial ports  
(SPORT0 and SPORT1) for serial and multiprocessor commu-  
nications. The SPORTs support the following features:  
The SPI port’s baud rate and clock phase/polarities are pro-  
grammable, and it has an integrated DMA controller,  
configurable to support transmit or receive data streams. The  
SPI’s DMA controller can only service unidirectional accesses at  
any given time.  
• I2S capable operation.  
• Bidirectional operation – Each SPORT has two sets of inde-  
pendent transmit and receive pins, enabling eight channels  
of I2S stereo audio.  
The SPI port’s clock rate is calculated as:  
fSCLK  
2 × SPI_Baud  
• Buffered (8-deep) transmit and receive ports – Each port  
has a data register for transferring data words to and from  
other processor components and shift registers for shifting  
data in and out of the data registers.  
--------------------------------  
SPI Clock Rate =  
Where the 16-bit SPI_Baud register contains a value of 2  
to 65,535.  
• Clocking – Each transmit and receive port can either use an  
external serial clock or generate its own, in frequencies  
ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz.  
During transfers, the SPI port simultaneously transmits and  
receives by serially shifting data in and out on its two serial data  
lines. The serial clock line synchronizes the shifting and sam-  
pling of data on the two serial data lines.  
• Word length – Each SPORT supports serial data words  
from 3 to 32 bits in length, transferred most significant bit  
first or least significant bit first.  
UART PORTS  
• Framing – Each transmit and receive port can run with or  
without frame sync signals for each data word. Frame sync  
signals can be generated internally or externally, active high  
or low, and with either of two pulse widths and early or late  
frame sync.  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors pro-  
vide two full-duplex universal asynchronous receiver and  
transmitter (UART) ports, which are fully compatible with PC-  
standard UARTs. Each UART port provides a simplified UART  
interface to other peripherals or hosts, supporting full-duplex,  
DMA-supported, asynchronous transfers of serial data. A  
UART port includes support for five to eight data bits, one or  
two stop bits, and none, even, or odd parity. Each UART port  
supports two modes of operation:  
• Companding in hardware – Each SPORT can perform  
A-law or μ-law companding according to ITU recommen-  
dation G.711. Companding can be selected on the transmit  
and/or receive channel of the SPORT without  
additional latencies.  
• PIO (programmed I/O) – The processor sends or receives  
data by writing or reading I/O mapped UART registers.  
The data is double-buffered on both transmit and receive.  
• DMA operations with single-cycle overhead – Each SPORT  
can automatically receive and transmit multiple buffers of  
memory data. The processor can link or chain sequences of  
DMA transfers between a SPORT and memory.  
• DMA (direct memory access) – The DMA controller trans-  
fers both transmit and receive data. This reduces the  
number and frequency of interrupts required to transfer  
data to and from memory. The UART has two dedicated  
DMA channels, one for transmit and one for receive. These  
DMA channels have lower default priority than most DMA  
channels because of their relatively low service rates.  
• Interrupts – Each transmit and receive port generates an  
interrupt upon completing the transfer of a data word or  
after transferring an entire data buffer, or buffers,  
through DMA.  
• Multichannel capability – Each SPORT supports 128 chan-  
nels out of a 1024-channel window and is compatible with  
the H.100, H.110, MVIP-90, and HMVIP standards.  
Each UART port’s baud rate, serial data format, error code gen-  
eration and status, and interrupts are programmable:  
• Supporting bit rates ranging from (fSCLK/1,048,576) to  
(fSCLK/16) bits per second.  
SERIAL PERIPHERAL INTERFACE (SPI) PORT  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors have  
an SPI-compatible port that enables the processor to communi-  
cate with multiple SPI-compatible devices.  
• Supporting data formats from 7 to 12 bits per frame.  
• Both transmit and receive operations can be configured to  
generate maskable interrupts to the processor.  
The SPI interface uses three pins for transferring data: two data  
pins (Master Output-Slave Input, MOSI, and Master Input-  
Slave Output, MISO) and a clock pin (serial clock, SCK). An SPI  
chip select input pin (SPISS) lets other SPI devices select the  
processor, and seven SPI chip select output pins (SPISEL7–1) let  
the processor select other SPI devices. The SPI select pins are  
reconfigured programmable flag pins. Using these pins, the SPI  
The UART port’s clock rate is calculated as:  
fSCLK  
16 × UART_Divisor  
-----------------------------------------------  
UART Clock Rate =  
Where the 16-bit UARTx_Divisor comes from the DLH register  
(most significant 8 bits) and UARTx_DLL register (least signifi-  
cant 8 bits).  
Rev. B  
| Page 10 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
In conjunction with the general-purpose timer functions, auto-  
baud detection is supported.  
10/100 ETHERNET MAC  
The ADSP-BF536 and ADSP-BF537 processors offer the capa-  
bility to directly connect to a network by way of an embedded  
Fast Ethernet Media Access Controller (MAC) that supports  
both 10-BaseT (10M bits/sec) and 100-BaseT (100M bits/sec)  
operation. The 10/100 Ethernet MAC peripheral is fully compli-  
ant to the IEEE 802.3-2002 standard, and it provides  
The capabilities of the UARTs are further extended with sup-  
port for the infrared data association (IrDA) serial infrared  
physical layer link specification (SIR) protocol.  
CONTROLLER AREA NETWORK (CAN)  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors offer  
a CAN controller that is a communication controller imple-  
menting the CAN 2.0B (active) protocol. This protocol is an  
asynchronous communications protocol used in both industrial  
and automotive control systems. The CAN protocol is well-  
suited for control applications due to its capability to communi-  
cate reliably over a network, since the protocol incorporates  
CRC checking message error tracking, and fault node  
confinement.  
programmable features designed to minimize supervision, bus  
use, or message processing by the rest of the processor system.  
Some standard features are:  
• Support of MII and RMII protocols for external PHYs.  
• Full duplex and half duplex modes.  
• Data framing and encapsulation: generation and detection  
of preamble, length padding, and FCS.  
• Media access management (in half-duplex operation): col-  
lision and contention handling, including control of  
retransmission of collision frames and of back-off timing.  
The CAN controller offers the following features:  
• 32 mailboxes (eight receive only, eight transmit only, 16  
configurable for receive or transmit).  
• Flow control (in full-duplex operation): generation and  
detection of PAUSE frames.  
• Dedicated acceptance masks for each mailbox.  
• Additional data filtering on first two bytes.  
• Station management: generation of MDC/MDIO frames  
for read-write access to PHY registers.  
• Support for both the standard (11-bit) and extended  
(29-bit) identifier (ID) message formats.  
• SCLK operating range down to 25 MHz (active and sleep  
operating modes).  
• Support for remote frames.  
• Internal loopback from Tx to Rx.  
Some advanced features are:  
• Active or passive network support.  
• CAN wakeup from hibernation mode (lowest static power  
consumption mode).  
• Buffered crystal output to external PHY for support of a  
single crystal system.  
• Interrupts, including: Tx complete, Rx complete, error,  
global.  
• Automatic checksum computation of IP header and IP  
payload fields of Rx frames.  
The electrical characteristics of each network connection are  
very demanding so the CAN interface is typically divided into  
two parts: a controller and a transceiver. This allows a single  
controller to support different drivers and CAN networks. The  
CAN module represents only the controller part of the interface.  
The controller interface supports connection to 3.3 V high-  
speed, fault-tolerant, single-wire transceivers.  
• Independent 32-bit descriptor-driven Rx and Tx DMA  
channels.  
• Frame status delivery to memory via DMA, including  
frame completion semaphores, for efficient buffer queue  
management in software.  
• Tx DMA support for separate descriptors for MAC header  
and payload to eliminate buffer copy operations.  
TWI CONTROLLER INTERFACE  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors  
include a 2-wire interface (TWI) module for providing a simple  
exchange method of control data between multiple devices. The  
TWI is compatible with the widely used I2C® bus standard. The  
TWI module offers the capabilities of simultaneous master and  
slave operation, support for both 7-bit addressing and multime-  
dia data arbitration. The TWI interface utilizes two pins for  
transferring clock (SCL) and data (SDA) and supports the  
protocol at speeds up to 400k bits/sec. The TWI interface pins  
are compatible with 5 V logic levels.  
• Convenient frame alignment modes support even 32-bit  
alignment of encapsulated Rx or Tx IP packet data in mem-  
ory after the 14-byte MAC header.  
• Programmable Ethernet event interrupt supports any com-  
bination of:  
• Any selected Rx or Tx frame status conditions.  
• PHY interrupt condition.  
• Wakeup frame detected.  
• Any selected MAC management counter(s) at  
half-full.  
Additionally, the processor’s TWI module is fully compatible  
with serial camera control bus (SCCB) functionality for easier  
control of various CMOS camera sensor devices.  
• DMA descriptor error.  
• 47 MAC management statistics counters with selectable  
clear-on-read behavior and programmable interrupts on  
half maximum value.  
Rev. B  
| Page 11 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
• Programmable Rx address filters, including a 64-bit  
address hash table for multicast and/or unicast frames, and  
programmable filter modes for broadcast, multicast, uni-  
cast, control, and damaged frames.  
GPIO pins defined as inputs can be configured to generate  
hardware interrupts, while output pins can be triggered by  
software interrupts.  
• GPIO interrupt sensitivity registers – The two GPIO inter-  
rupt sensitivity registers specify whether individual pins are  
level- or edge-sensitive and specify—if edge-sensitive—  
whether just the rising edge or both the rising and falling  
edges of the signal are significant. One register selects the  
type of sensitivity, and one register selects which edges are  
significant for edge-sensitivity.  
• Advanced power management supporting unattended  
transfer of Rx and Tx frames and status to/from external  
memory via DMA during low-power sleep mode.  
• System wakeup from sleep operating mode upon magic  
packet or any of four user-definable wakeup frame filters.  
• Support for 802.3Q tagged VLAN frames.  
PARALLEL PERIPHERAL INTERFACE (PPI)  
• Programmable MDC clock rate and preamble suppression.  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors pro-  
vide a parallel peripheral interface (PPI) that can connect  
directly to parallel A/D and D/A converters, ITU-R-601/656  
video encoders and decoders, and other general-purpose  
peripherals. The PPI consists of a dedicated input clock pin, up  
to 3 frame synchronization pins, and up to 16 data pins.  
• In RMII operation, 7 unused pins may be configured as  
GPIO pins for other purposes.  
PORTS  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors  
group the many peripheral signals to four ports—Port F, Port G,  
Port H, and Port J. Most of the associated pins are shared by  
multiple signals. The ports function as multiplexer controls.  
Eight of the pins (Port F7–0) offer high source/high sink current  
capabilities.  
In ITU-R-656 modes, the PPI receives and parses a data stream  
of 8-bit or 10-bit data elements. On-chip decode of embedded  
preamble control and synchronization information  
is supported.  
Three distinct ITU-R-656 modes are supported:  
General-Purpose I/O (GPIO)  
• Active video only mode – The PPI does not read in any  
data between the End of Active Video (EAV) and Start of  
Active Video (SAV) preamble symbols, or any data present  
during the vertical blanking intervals. In this mode, the  
control byte sequences are not stored to memory; they are  
filtered by the PPI.  
The processors have 48 bidirectional, general-purpose I/O  
(GPIO) pins allocated across three separate GPIO modules—  
PORTFIO, PORTGIO, and PORTHIO, associated with Port F,  
Port G, and Port H, respectively. Port J does not provide GPIO  
functionality. Each GPIO-capable pin shares functionality with  
other processor peripherals via a multiplexing scheme; however,  
the GPIO functionality is the default state of the device upon  
power-up. Neither GPIO output or input drivers are active by  
default. Each general-purpose port pin can be individually con-  
trolled by manipulation of the port control, status, and interrupt  
registers:  
• Vertical blanking only mode – The PPI only transfers verti-  
cal blanking interval (VBI) data, as well as horizontal  
blanking information and control byte sequences on  
VBI lines.  
• Entire field mode – The entire incoming bitstream is read  
in through the PPI. This includes active video, control pre-  
amble sequences, and ancillary data that may be embedded  
in horizontal and vertical blanking intervals.  
• GPIO direction control register – Specifies the direction of  
each individual GPIO pin as input or output.  
• GPIO control and status registers – The processors employ  
a “write one to modify” mechanism that allows any combi-  
nation of individual GPIO pins to be modified in a single  
instruction, without affecting the level of any other GPIO  
pins. Four control registers are provided. One register is  
written in order to set pin values, one register is written in  
order to clear pin values, one register is written in order to  
toggle pin values, and one register is written in order to  
specify a pin value. Reading the GPIO status register allows  
software to interrogate the sense of the pins.  
Though not explicitly supported, ITU-R-656 output functional-  
ity can be achieved by setting up the entire frame structure  
(including active video, blanking, and control information) in  
memory and streaming the data out the PPI in a frame sync-less  
mode. The processor’s 2-D DMA features facilitate this transfer  
by allowing the static frame buffer (blanking and control codes)  
to be placed in memory once, and simply updating the active  
video information on a per-frame basis.  
The general-purpose modes of the PPI are intended to suit a  
wide variety of data capture and transmission applications. The  
modes are divided into four main categories, each allowing up  
to 16 bits of data transfer per PPI_CLK cycle:  
• GPIO interrupt mask registers – The two GPIO interrupt  
mask registers allow each individual GPIO pin to function  
as an interrupt to the processor. Similar to the two GPIO  
control registers that are used to set and clear individual  
pin values, one GPIO interrupt mask register sets bits to  
enable interrupt function, and the other GPIO interrupt  
mask register clears bits to disable interrupt function.  
• Data receive with internally generated frame syncs  
• Data receive with externally generated frame syncs  
• Data transmit with internally generated frame syncs  
• Data transmit with externally generated frame syncs  
Rev. B  
| Page 12 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
These modes support ADC/DAC connections, as well as video  
communication with hardware signalling. Many of the modes  
support more than one level of frame synchronization. If  
desired, a programmable delay can be inserted between asser-  
tion of a frame sync and reception/transmission of data.  
System DMA access to L1 memory is not supported in  
sleep mode.  
Deep Sleep Operating Mode—Maximum Dynamic Power  
Savings  
The deep sleep mode maximizes dynamic power savings by dis-  
abling the clocks to the processor core (CCLK) and to all  
synchronous peripherals (SCLK). Asynchronous peripherals,  
such as the RTC, may still be running but cannot access internal  
resources or external memory. This powered-down mode can  
only be exited by assertion of the reset interrupt (RESET) or by  
an asynchronous interrupt generated by the RTC. When in deep  
sleep mode, an RTC asynchronous interrupt causes the proces-  
sor to transition to the active mode. Assertion of RESET while  
in deep sleep mode causes the processor to transition to the full-  
on mode.  
DYNAMIC POWER MANAGEMENT  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors pro-  
vide five operating modes, each with a different performance  
and power profile. In addition, dynamic power management  
provides the control functions to dynamically alter the proces-  
sor core supply voltage, further reducing power dissipation.  
Control of clocking to each of the peripherals also reduces  
power consumption. See Table 4 for a summary of the power  
settings for each mode.  
Full-On Operating Mode—Maximum Performance  
Hibernate Operating Mode—Maximum Static Power  
Savings  
In the full-on mode, the PLL is enabled and is not bypassed,  
providing capability for maximum operational frequency. This  
is the power-up default execution state in which maximum per-  
formance can be achieved. The processor core and all enabled  
peripherals run at full speed.  
The hibernate mode maximizes static power savings by dis-  
abling the voltage and clocks to the processor core (CCLK) and  
to all of the synchronous peripherals (SCLK). The internal volt-  
age regulator for the processor can be shut off by writing b#00 to  
the FREQ bits of the VR_CTL register. This disables both CCLK  
and SCLK. Furthermore, it sets the internal power supply volt-  
age (VDDINT) to 0 V to provide the greatest power savings. To  
preserve the processor state, prior to removing power, any criti-  
cal information stored internally (memory contents, register  
contents, etc.) must be written to a non volatile storage device.  
Active Operating Mode—Moderate Power Savings  
In the active mode, the PLL is enabled but bypassed. Because the  
PLL is bypassed, the processor’s core clock (CCLK) and system  
clock (SCLK) run at the input clock (CLKIN) frequency. In this  
mode, the CLKIN to CCLK multiplier ratio can be changed,  
although the changes are not realized until the full-on mode is  
entered. DMA access is available to appropriately configured  
L1 memories.  
Since VDDEXT is still supplied in this mode, all of the external pins  
three-state, unless otherwise specified. This allows other devices  
that are connected to the processor to still have power applied  
without drawing unwanted current.  
In the active mode, it is possible to disable the PLL through the  
PLL control register (PLL_CTL). If disabled, the PLL must be  
re-enabled before transitioning to the full-on or sleep modes.  
The Ethernet or CAN modules can wake up the internal supply  
regulator. The regulator can also be woken up by a real-time  
clock wakeup event or by asserting the RESET pin, both of  
which initiate the hardware reset sequence.  
Table 4. Power Settings  
Core  
Clock  
System  
Clock  
Internal  
Power  
PLL  
With the exception of the VR_CTL and the RTC registers, all  
(VDDINT) internal registers and memories lose their content in the hiber-  
Mode  
Full On  
Active  
PLL  
Bypassed (CCLK)  
(SCLK)  
nate state. State variables may be held in external SRAM or  
SDRAM. The CKELOW bit in the VR_CTL register controls  
whether SDRAM operates in self-refresh mode which allows it  
to retain its content while the processor is in reset.  
Enabled  
No  
Enabled Enabled On  
Enabled Enabled On  
Enabled/ Yes  
Disabled  
Sleep  
Enabled  
Disabled Enabled On  
Disabled Disabled On  
Disabled Disabled Off  
Power Savings  
Deep Sleep Disabled  
Hibernate Disabled  
As shown in Table 5, the processors support three different  
power domains which maximizes flexibility, while maintaining  
compliance with industry standards and conventions. By isolat-  
ing the internal logic of the processor into its own power  
domain, separate from the RTC and other I/O, the processor  
can take advantage of dynamic power management, without  
affecting the RTC or other I/O devices. There are no sequencing  
requirements for the various power domains.  
Sleep Operating Mode—High Dynamic Power Savings  
The sleep mode reduces dynamic power dissipation by disabling  
the clock to the processor core (CCLK). The PLL and system  
clock (SCLK), however, continue to operate in this mode. Typi-  
cally an external event or RTC activity wakes up the processor.  
When in the sleep mode, asserting wakeup causes the processor  
to sense the value of the BYPASS bit in the PLL control register  
(PLL_CTL). If BYPASS is disabled, the processor transitions to  
the full on mode. If BYPASS is enabled, the processor transi-  
tions to the active mode.  
Rev. B  
| Page 13 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Table 5. Power Domains  
V
V
DDEXT  
DDINT  
Power Domain  
VDD Range  
VDDINT  
100µF  
2.25V TO 3.6V  
INPUT VOLTAGE  
RANGE  
All internal logic, except RTC  
RTC internal logic and crystal I/O  
All other I/O  
VDDRTC  
10µH  
VDDEXT  
0.1µF  
ZHCS1000  
NDS8434  
100µF  
1µF  
The dynamic power management feature allows both the pro-  
cessor’s input voltage (VDDINT) and clock frequency (fCCLK) to be  
dynamically controlled.  
VR  
1-0  
OUT  
The power dissipated by a processor is largely a function of its  
clock frequency and the square of the operating voltage. For  
example, reducing the clock frequency by 25% results in a 25%  
reduction in power dissipation, while reducing the voltage by  
25% reduces power dissipation by more than 40%. Further,  
these power savings are additive, in that if the clock frequency  
and supply voltage are both reduced, the power savings can be  
dramatic, as shown in the following equations.  
EXTERNAL COMPONENTS  
1-0 SHOULD BE TIED TOGETHER EXTERNALLY  
NOTE: VR  
OUT  
AND DESIGNER SHOULD MINIMIZE TRACE LENGTH TO NDS8434.  
Figure 5. Voltage Regulator Circuit  
CLOCK SIGNALS  
The power savings factor is calculated as:  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processor can be  
clocked by an external crystal, a sine wave input, or a buffered,  
shaped clock derived from an external clock oscillator.  
power savings factor  
2
fCCLKRED  
---------------------  
fCCLKNOM  
VDDINTRED  
--------------------------  
VDDINTNOM  
TRED  
------------  
TNOM  
=
×
×
If an external clock is used, it should be a TTL compatible signal  
and must not be halted, changed, or operated below the speci-  
fied frequency during normal operation. This signal is  
connected to the processor’s CLKIN pin. When an external  
clock is used, the XTAL pin must be left unconnected.  
where the variables in the equations are:  
f
CCLKNOM is the nominal core clock frequency  
CCLKRED is the reduced core clock frequency  
f
Alternatively, because the processors include an on-chip oscilla-  
tor circuit, an external crystal may be used. For fundamental  
frequency operation, use the circuit shown in Figure 6. A  
parallel-resonant, fundamental frequency, microprocessor-  
grade crystal is connected across the CLKIN and XTAL pins.  
The on-chip resistance between CLKIN and the XTAL pin is in  
the 500 kΩ range. Further parallel resistors are typically not rec-  
ommended. The two capacitors and the series resistor shown in  
Figure 6 fine-tune phase and amplitude of the sine frequency.  
V
V
DDINTNOM is the nominal internal supply voltage  
DDINTRED is the reduced internal supply voltage  
T
NOM is the duration running at fCCLKNOM  
RED is the duration running at fCCLKRED  
T
The percent power savings is calculated as:  
% power savings = (1 power savings factor) × 100%  
The capacitor and resistor values shown in Figure 6 are typical  
values only. The capacitor values are dependent upon the crystal  
manufacturers’ load capacitance recommendations and the PCB  
physical layout. The resistor value depends on the drive level  
specified by the crystal manufacturer. The user should verify the  
customized values based on careful investigations of multiple  
devices over temperature range.  
VOLTAGE REGULATION  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processor pro-  
vides an on-chip voltage regulator that can generate processor  
core voltage levels (0.85 V to 1.2 V guaranteed from –5% to  
+10%) from an external 2.25 V to 3.6 V supply. Figure 5 shows  
the typical external components required to complete the power  
management system. The regulator controls the internal logic  
voltage levels and is programmable with the voltage regulator  
control register (VR_CTL) in increments of 50 mV. To reduce  
standby power consumption, the internal voltage regulator can  
be programmed to remove power to the processor core while  
keeping I/O power supplied. While in hibernate mode, VDDEXT  
can still be applied, eliminating the need for external buffers.  
The voltage regulator can be activated from this power-down  
state by asserting the RESET pin, which then initiates a boot  
sequence. The regulator can also be disabled and bypassed at the  
user’s discretion.  
A third-overtone crystal can be used for frequencies above  
25 MHz. The circuit is then modified to ensure crystal operation  
only at the third overtone, by adding a tuned inductor circuit as  
shown in Figure 6. A design procedure for third-overtone oper-  
ation is discussed in detail in application note EE-168.  
The CLKBUF pin is an output pin, and is a buffer version of the  
input clock. This pin is particularly useful in Ethernet applica-  
tions to limit the number of required clock sources in the  
system. In this type of application, a single 25 MHz or 50 MHz  
crystal may be applied directly to the processors. The 25 MHz or  
50 MHz output of CLKBUF can then be connected to an exter-  
nal Ethernet MII or RMII PHY device.  
Rev. B  
| Page 14 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
BLACKFIN  
“FINE” ADJUSTMENT  
REQUIRES PLL SEQUENCING  
“COURSE” ADJUSTMENT  
ON THE FLY  
CLKOUT  
CLKBUF  
TO PLL CIRCUITRY  
EN  
EN  
، 1, 2, 4, 8  
، 1 TO 15  
CCLK  
PLL  
0.5ϫ - 64ϫ  
CLKIN  
VCO  
SCLK  
CLKIN  
18pF*  
XTAL  
330*  
SCLK CCLK  
SCLK 133MHz  
FOR OVERTONE  
OPERATION ONLY:  
Figure 7. Frequency Modification Methods  
18pF*  
Note that the divisor ratio must be chosen to limit the system  
clock frequency to its maximum of fSCLK. The SSEL value can be  
changed dynamically without any PLL lock latencies by writing  
the appropriate values to the PLL divisor register (PLL_DIV).  
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED  
DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE  
ANALYZE CAREFULLY.  
Figure 6. External Crystal Connections  
Table 6. Example System Clock Ratios  
Because of the default 10x PLL multiplier, providing a 50 MHz  
CLKIN exceeds the recommended operating conditions of the  
lower speed grades. Because of this restriction, a 50 MHz RMII  
PHY cannot be clocked directly from the CLKBUF pin. Either  
provide a separate 50 MHz clock source, or use an RMII PHY  
with 25 MHz clock input options. The CLKBUF output is active  
by default and can be disabled using the VR_CTL register for  
power savings.  
Example Frequency Ratios  
(MHz)  
VCO  
100  
Signal Name Divider Ratio  
SSEL3–0  
VCO/SCLK  
SCLK  
100  
50  
0001  
1:1  
0110  
6:1  
300  
1010  
10:1  
500  
50  
The Blackfin core runs at a different clock rate than the on-chip  
peripherals. As shown in Figure 7, the core clock (CCLK) and  
system peripheral clock (SCLK) are derived from the input  
clock (CLKIN) signal. An on-chip PLL is capable of multiplying  
the CLKIN signal by a programmable 0.5× to 64× multiplication  
factor (bounded by specified minimum and maximum VCO  
frequencies). The default multiplier is 10×, but it can be modi-  
fied by a software instruction sequence in the PLL_CTL register.  
The core clock (CCLK) frequency can also be dynamically  
changed by means of the CSEL1–0 bits of the PLL_DIV register.  
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in  
Table 7. This programmable core clock capability is useful for  
fast core frequency modifications.  
Table 7. Core Clock Ratios  
On-the-fly CCLK and SCLK frequency changes can be effected  
by simply writing to the PLL_DIV register. Whereas the maxi-  
mum allowed CCLK and SCLK rates depend on the applied  
voltages VDDINT and VDDEXT, the VCO is always permitted to run  
up to the frequency specified by the part’s speed grade. The  
CLKOUT pin reflects the SCLK frequency to the off-chip world.  
It belongs to the SDRAM interface, but it functions as reference  
signal in other timing specifications as well. While active by  
default, it can be disabled using the EBIU_SDGCTL and  
EBIU_AMGCTL registers.  
Example Frequency Ratios  
(MHz)  
VCO  
300  
Signal Name Divider Ratio  
CSEL1–0  
VCO/CCLK  
CCLK  
300  
150  
125  
25  
00  
01  
10  
11  
1:1  
2:1  
4:1  
8:1  
300  
500  
200  
The maximum CCLK frequency not only depends on the part’s  
speed grade (see Ordering Guide on Page 66), it also depends on  
the applied VDDINT voltage. See Table 12 and Table 13 for details.  
The maximal system clock rate (SCLK) depends on the chip  
package and the applied VDDEXT voltage (see Table 16).  
All on-chip peripherals are clocked by the system clock (SCLK).  
The system clock frequency is programmable by means of the  
SSEL3–0 bits of the PLL_DIV register. The values programmed  
into the SSEL fields define a divide ratio between the PLL output  
(VCO) and the system clock. SCLK divider values are 1 through  
15. Table 6 illustrates typical system clock ratios.  
Rev. B  
| Page 15 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
any more bytes until the flag is deasserted. The flag is cho-  
sen by the user and this information is transferred to the  
Blackfin processor via bits 10:5 of the FLAG header.  
BOOTING MODES  
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processor has six  
mechanisms (listed in Table 8) for automatically loading inter-  
nal and external memory after a reset. A seventh mode is  
provided to execute from external memory, bypassing the boot  
sequence.  
• Boot from UART – Using an autobaud handshake  
sequence, a boot-stream-formatted program is downloaded  
by the host. The host agent selects a baud rate within the  
UART’s clocking capabilities. When performing the auto-  
baud, the UART expects an “@” (boot stream) character  
(8 bits data, 1 start bit, 1 stop bit, no parity bit) on the RXD  
pin to determine the bit rate. It then replies with an  
acknowledgement that is composed of 4 bytes: 0xBF, the  
value of UART_DLL, the value of UART_DLH, and 0x00.  
The host can then download the boot stream. When the  
processor needs to hold off the host, it deasserts CTS.  
Therefore, the host must monitor this signal.  
Table 8. Booting Modes  
BMODE2–0  
Description  
000  
Executefrom16-bitexternalmemory(bypass  
boot ROM)  
001  
Boot from 8-bit or 16-bit memory  
(EPROM/flash)  
010  
011  
100  
101  
110  
111  
Reserved  
• Boot from serial TWI memory (EEPROM/flash) – The  
Blackfin processor operates in master mode and selects the  
TWI slave with the unique ID 0xA0. It submits successive  
read commands to the memory device starting at two byte  
internal address 0x0000 and begins clocking data into the  
processor. The TWI memory device should comply with  
Philips I2C Bus Specification version 2.1 and have the capa-  
bility to auto-increment its internal address counter such  
that the contents of the memory device can be read  
sequentially.  
Boot from serial SPI memory (EEPROM/flash)  
Boot from SPI host (slave mode)  
Boot from serial TWI memory (EEPROM/flash)  
Boot from TWI host (slave mode)  
Boot from UART host (slave mode)  
The BMODE pins of the reset configuration register, sampled  
during power-on resets and software-initiated resets, imple-  
ment the following modes:  
• Boot from TWI host – The TWI host agent selects the slave  
with the unique ID 0x5F. The processor replies with an  
acknowledgement and the host can then download the  
boot stream. The TWI host agent should comply with  
Philips I2C Bus Specification version 2.1. An I2C multi-  
plexer can be used to select one processor at a time when  
booting multiple processors from a single TWI.  
• Execute from 16-bit external memory – Execution starts  
from address 0x2000 0000 with 16-bit packing. The boot  
ROM is bypassed in this mode. All configuration settings  
are set for the slowest device possible (3-cycle hold time;  
15-cycle R/W access times; 4-cycle setup).  
• Boot from 8-bit and 16-bit external flash memory – The  
8-bit or 16-bit flash boot routine located in Boot ROM  
memory space is set up using asynchronous memory bank  
0. All configuration settings are set for the slowest device  
possible (3-cycle hold time; 15-cycle R/W access times;  
4-cycle setup). The Boot ROM evaluates the first byte of the  
boot stream at address 0x2000 0000. If it is 0x40, 8-bit boot  
is performed. A 0x60 byte assumes a 16-bit memory device  
and performs 8-bit DMA. A 0x20 byte also assumes 16-bit  
memory but performs 16-bit DMA.  
For each of the boot modes, a 10-byte header is first brought in  
from an external device. The header specifies the number of  
bytes to be transferred and the memory destination address.  
Multiple memory blocks may be loaded by any boot sequence.  
Once all blocks are loaded, program execution commences from  
the start of L1 instruction SRAM.  
In addition, Bit 4 of the reset configuration register can be set by  
application code to bypass the normal boot sequence during a  
software reset. For this case, the processor jumps directly to the  
beginning of L1 instruction memory.  
• Boot from serial SPI memory (EEPROM or flash) – 8-, 16-,  
or 24-bit addressable devices are supported as well as  
AT45DB041, AT45DB081, AT45DB161, AT45DB321,  
AT45DB642, and AT45DB1282 DataFlash® devices from  
Atmel. The SPI uses the PF10/SPI SSEL1 output pin to  
select a single SPI EEPROM/flash device, submits a read  
command and successive address bytes (0x00) until a valid  
8-, 16-, or 24-bit, or Atmel addressable device is detected,  
and begins clocking data into the processor.  
To augment the boot modes, a secondary software loader can be  
added to provide additional booting mechanisms. This second-  
ary loader could provide the capability to boot from flash,  
variable baud rate, and other sources. In all boot modes except  
bypass, program execution starts from on-chip L1 memory  
address 0xFFA0 0000.  
INSTRUCTION SET DESCRIPTION  
• Boot from SPI host device – The Blackfin processor oper-  
ates in SPI slave mode and is configured to receive the bytes  
of the .LDR file from an SPI host (master) agent. To hold  
off the host device from transmitting while the boot ROM  
is busy, the Blackfin processor asserts a GPIO pin, called  
host wait (HWAIT), to signal the host device not to send  
The Blackfin processor family assembly language instruction set  
employs an algebraic syntax designed for ease of coding and  
readability. The instructions have been specifically tuned to pro-  
vide a flexible, densely encoded instruction set that compiles to  
a very small final memory size. The instruction set also provides  
fully featured multifunction instructions that allow the  
Rev. B  
| Page 16 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
programmer to use many of the processor core resources in a  
single instruction. Coupled with many features more often seen  
on microcontrollers, this instruction set is very efficient when  
compiling C and C++ source code. In addition, the architecture  
supports both user (algorithm/application code) and supervisor  
(O/S kernel, device drivers, debuggers, ISRs) modes of opera-  
tion, allowing multiple levels of access to core processor  
resources.  
designer’s development schedule, increasing productivity. Sta-  
tistical profiling enables the programmer to nonintrusively poll  
the processor as it is running the program. This feature, unique  
to VisualDSP++, enables the software developer to passively  
gather important code execution metrics without interrupting  
the real-time characteristics of the program. Essentially, the  
developer can identify bottlenecks in software quickly and effi-  
ciently. By using the profiler, the programmer can focus on  
those areas in the program that impact performance and take  
corrective action.  
The assembly language, which takes advantage of the proces-  
sor’s unique architecture, offers the following advantages:  
Debugging both C/C++ and assembly programs with the  
VisualDSP++ debugger, programmers can:  
• Seamlessly integrated DSP/MCU features are optimized for  
both 8-bit and 16-bit operations.  
• View mixed C/C++ and assembly code (interleaved source  
and object information).  
• A multi-issue load/store modified-Harvard architecture,  
which supports two 16-bit MAC or four 8-bit ALU + two  
load/store + two pointer updates per cycle.  
• Insert breakpoints.  
• All registers, I/O, and memory are mapped into a unified  
4G byte memory space, providing a simplified program-  
ming model.  
• Set conditional breakpoints on registers, memory, and  
stacks.  
• Trace instruction execution.  
• Microcontroller features, such as arbitrary bit and bit-field  
manipulation, insertion, and extraction; integer operations  
on 8-, 16-, and 32-bit data-types; and separate user and  
supervisor stack pointers.  
• Perform linear or statistical profiling of program execution.  
• Fill, dump, and graphically plot the contents of memory.  
• Perform source level debugging.  
• Code density enhancements, which include intermixing of  
16-bit and 32-bit instructions (no mode switching, no code  
segregation). Frequently used instructions are encoded  
in 16 bits.  
• Create custom debugger windows.  
The VisualDSP++ IDE lets programmers define and manage  
software development. Its dialog boxes and property pages let  
programmers configure and manage all development tools,  
including color syntax highlighting in the VisualDSP++ editor.  
These capabilities permit programmers to:  
DEVELOPMENT TOOLS  
The Blackfin is supported with a complete set of  
• Control how the development tools process inputs and  
generate outputs.  
CROSSCORE®software and hardware development tools,  
including Analog Devices emulators and the VisualDSP++®  
development environment. The same emulator hardware that  
supports other Analog Devices processors also fully emulates  
the Blackfin.  
• Maintain a one-to-one correspondence with the tool’s  
command line switches.  
The VisualDSP++ Kernel (VDK) incorporates scheduling and  
resource management tailored specifically to address the mem-  
ory and timing constraints of embedded, real-time  
The VisualDSP++ project management environment lets pro-  
grammers develop and debug an application. This environment  
includes an easy to use assembler that is based on an algebraic  
syntax, an archiver (librarian/library builder), a linker, a loader,  
a cycle-accurate instruction-level simulator, a C/C++ compiler,  
and a C/C++ runtime library that includes DSP and mathemati-  
cal functions. A key point for these tools is C/C++ code  
efficiency. The compiler has been developed for efficient  
translation of C/C++ code to Blackfin assembly. The Blackfin  
processor has architectural features that improve the efficiency  
of compiled C/C++ code.  
programming. These capabilities enable engineers to develop  
code more effectively, eliminating the need to start from the  
very beginning when developing new application code. The  
VDK features include threads, critical and unscheduled regions,  
semaphores, events, and device flags. The VDK also supports  
priority-based, pre-emptive, cooperative, and time-sliced sched-  
uling approaches. In addition, the VDK was designed to be  
scalable. If the application does not use a specific feature, the  
support code for that feature is excluded from the target system.  
The VisualDSP++ debugger has a number of important fea-  
tures. Data visualization is enhanced by a plotting package that  
offers a significant level of flexibility. This graphical representa-  
tion of user data enables the programmer to quickly determine  
the performance of an algorithm. As algorithms grow in com-  
plexity, this capability can have increasing significance on the  
Because the VDK is a library, a developer can decide whether to  
use it or not. The VDK is integrated into the VisualDSP++  
development environment, but can also be used with standard  
command line tools. When the VDK is used, the development  
environment assists the developer with many error prone tasks  
and assists in managing system resources, automating the gen-  
eration of various VDK-based objects, and visualizing the  
system state when debugging an application that uses the VDK.  
CROSSCORE is a registered trademark of Analog Devices, Inc.  
VisualDSP++ is a registered trademark of Analog Devices, Inc.  
Rev. B  
| Page 17 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
VCSE is Analog Devices’ technology for creating, using, and  
reusing software components (independent modules of sub-  
stantial functionality) to quickly and reliably assemble software  
applications. Components can be downloaded from the Web  
and dropped into the application. Component archives can be  
published from within VisualDSP++. VCSE supports compo-  
nent implementation in C/C++ or assembly language.  
(EE-68) on the Analog Devices website under  
www.analog.com/ee-notes. This document is updated regularly  
to keep pace with improvements to emulator support.  
RELATED DOCUMENTS  
The following publications that describe the ADSP-BF534/  
ADSP-BF536/ADSP-BF537 processors (and related processors)  
can be ordered from any Analog Devices sales office or accessed  
electronically on our website:  
The expert linker can be used to visually manipulate the place-  
ment of code and data in the embedded system. Memory  
utilization can be viewed in a color-coded graphical form. Code  
and data can be easily moved to different areas of the processor  
or external memory with the drag of the mouse. Runtime stack  
and heap usage can be examined. The expert linker is fully com-  
patible with existing linker definition file (LDF), allowing the  
developer to move between the graphical and textual  
environments.  
Getting Started with Blackfin Processors  
ADSP-BF537 Blackfin Processor Hardware Reference  
ADSP-BF53x/ADSP-BF56x Blackfin Processor Program-  
ming Reference  
ADSP-BF537 Blackfin Processor Anomaly List  
Analog Devices emulators use the IEEE 1149.1 JTAG test access  
port of the Blackfin to monitor and control the target board  
processor during emulation. The emulator provides full-speed  
emulation, allowing inspection and modification of memory,  
registers, and processor stacks. Nonintrusive in-circuit emula-  
tion is assured by the use of the processor’s JTAG interface—the  
emulator does not affect target system loading or timing.  
In addition to the software and hardware development tools  
available from Analog Devices, third parties provide a wide  
range of tools supporting the Blackfin processor family. Third  
party software tools include DSP libraries, real-time operating  
systems, and block diagram design tools.  
EZ-KIT Lite® Evaluation Board  
For evaluation of ADSP-BF534/ADSP-BF536/ADSP-BF537  
processors, use the ADSP-BF537 EZ-KIT Lite board available  
from Analog Devices. Order part number ADDS-BF537-  
EZLITE. The board comes with on-chip emulation capabilities  
and is equipped to enable software development. Multiple  
daughter cards are available.  
DESIGNING AN EMULATOR-COMPATIBLE  
PROCESSOR BOARD  
The Analog Devices family of emulators are tools that every sys-  
tem developer needs in order to test and debug hardware and  
software systems. Analog Devices has supplied an IEEE 1149.1  
JTAG Test Access Port (TAP) on each JTAG processor. The  
emulator uses the TAP to access the internal features of the pro-  
cessor, allowing the developer to load code, set breakpoints,  
observe variables, observe memory, and examine registers. The  
processor must be halted to send data and commands, but once  
an operation has been completed by the emulator, the processor  
system is set running at full speed with no impact on  
system timing.  
To use these emulators, the target board must include a header  
that connects the processor’s JTAG port to the emulator.  
For details on target board design issues including mechanical  
layout, single processor connections, multiprocessor scan  
chains, signal buffering, signal termination, and emulator pod  
logic, see Analog Devices JTAG Emulation Technical Reference  
Rev. B  
| Page 18 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
PIN DESCRIPTIONS  
ADSP-BF534/ADSP-BF536/ADSP-BF537 processor’s pin defi-  
nitions are listed in Table 9. In order to maintain maximum  
function and reduce package size and pin count, some pins have  
dual, multiplexed functions. In cases where pin function is  
reconfigurable, the default state is shown in plain text, while the  
alternate function is shown in italics. Pins shown with an aster-  
isk after their name (*) offer high source/high sink current  
capabilities.  
All pins are three-stated during and immediately after reset,  
with the exception of the external memory interface and the  
buffered XTAL output pin (CLKBUF). On the external memory  
interface, the control and address lines are driven high during  
reset unless the BR pin is asserted.  
All I/O pins have their input buffers disabled with the exception  
of the pins noted in the data sheet that need pull-ups or pull-  
downs if unused.  
The SDA (serial data) and SCL (serial clock) pins are open drain  
and therefore require a pull-up resistor. Consult version 2.1 of  
the I2C specification for the proper resistor value.  
Table 9. Pin Descriptions  
Driver  
Pin Name  
Type Function  
Type1  
Pull-Up/Pull-Down  
Memory Interface  
ADDR19–1  
DATA15–0  
O
I/O  
O
I
Address Bus for Async Access  
Data Bus for Async/Sync Access  
A
A
ABE1–0/SDQM1–0  
BR  
Byte Enables/Data Masks for Async/Sync Access A  
Bus Request  
Thispinshould be pulledhighwhen  
not used  
BG  
O
O
Bus Grant  
A
A
BGH  
Bus Grant Hang  
Asynchronous Memory Control  
AMS3–0  
O
I
Bank Select  
A
ARDY  
Hardware Ready Control  
Output Enable  
Read Enable  
AOE  
O
O
O
A
A
A
ARE  
AWE  
Write Enable  
Synchronous Memory Control  
SRAS  
SCAS  
SWE  
O
O
O
O
O
O
O
Row Address Strobe  
Column Address Strobe  
Write Enable  
A
A
A
A
B
SCKE  
CLKOUT  
SA10  
SMS  
Clock Enable  
Clock Output  
A10 Pin  
A
A
Bank Select  
Rev. B  
| Page 19 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Table 9. Pin Descriptions (Continued)  
Driver  
Type1  
Pin Name  
Type Function  
Pull-Up/Pull-Down  
Port F:  
GPIO/UART1–0/Timer7–0/SPI/  
External DMA Request  
(* = High Source/High Sink Pin)  
PF0* – GPIO/UART0 TX/DMAR0 I/O  
GPIO/UART0 Transmit/DMA Request 0  
C
C
PF1* – GPIO/UART0  
RX/DMAR1/TACI1  
I/O  
GPIO/UART0 Receive/DMA Request 1/Timer1  
Alternate Input Capture  
PF2* – GPIO/UART1 TX/TMR7  
I/O  
I/O  
GPIO/UART1 Transmit/Timer7  
C
C
PF3* – GPIO/UART1  
RX/TMR6/TACI6  
GPIO/UART1 Receive/Timer6/Timer6 Alternate  
Input Capture  
PF4* – GPIO/TMR5/SPI SSEL6  
PF5* – GPIO/TMR4/SPI SSEL5  
PF6* – GPIO/TMR3/SPI SSEL4  
PF7* – GPIO/TMR2/PPI FS3  
PF8 – GPIO/TMR1/PPI FS2  
PF9 – GPIO/TMR0/PPI FS1  
PF10 – GPIO/SPI SSEL1  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
GPIO/Timer5/SPI Slave Select Enable 6  
GPIO/Timer4/SPI Slave Select Enable 5  
GPIO/Timer3/SPI Slave Select Enable 4  
GPIO/Timer2/PPI Frame Sync 3  
GPIO/Timer1/PPI Frame Sync 2  
GPIO/Timer0/PPI Frame Sync 1  
GPIO/SPI Slave Select Enable 1  
GPIO/SPI Master Out Slave In  
C
C
C
C
C
C
C
C
C
PF11 – GPIO/SPI MOSI  
PF12 – GPIO/SPI MISO  
GPIO/SPI Master In Slave Out  
This pin should always be pulled  
high through a 4.7 kΩ resistor if  
booting via the SPI port  
PF13 – GPIO/SPI SCK  
I/O  
I/O  
GPIO/SPI Clock  
D
C
PF14 – GPIO/SPI SS/TACLK0  
GPIO/SPI Slave Select/Alternate Timer0  
Clock Input  
PF15 – GPIO/PPI CLK/TMRCLK I/O  
GPIO/PPI Clock/External Timer Reference  
C
Port G: GPIO/PPI/SPORT1  
PG0 – GPIO/PPI D0  
PG1 – GPIO/PPI D1  
PG2 – GPIO/PPI D2  
PG3 – GPIO/PPI D3  
PG4 – GPIO/PPI D4  
PG5 – GPIO/PPI D5  
PG6 – GPIO/PPI D6  
PG7 – GPIO/PPI D7  
PG8 – GPIO/PPI D8/DR1SEC  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
GPIO/PPI Data 0  
GPIO/PPI Data 1  
GPIO/PPI Data 2  
GPIO/PPI Data 3  
GPIO/PPI Data 4  
GPIO/PPI Data 5  
GPIO/PPI Data 6  
GPIO/PPI Data 7  
C
C
C
C
C
C
C
C
C
GPIO/PPI Data 8/SPORT1 Receive Data  
Secondary  
PG9 – GPIO/PPI D9/DT1SEC  
I/O  
GPIO/PPI Data 9/SPORT1 Transmit Data  
C
Secondary  
PG10 – GPIO/PPI D10/RSCLK1 I/O  
PG11 – GPIO/PPI D11/RFS1 I/O  
GPIO/PPI Data 10/SPORT1 Receive Serial Clock  
GPIO/PPI Data 11/SPORT1 Receive Frame Sync  
GPIO/PPI Data 12/SPORT1 Receive Data Primary  
GPIO/PPI Data 13/SPORT1 Transmit Serial Clock  
GPIO/PPI Data 14/SPORT1 Transmit Frame Sync  
D
C
C
D
C
PG12 – GPIO/PPI D12/DR1PRI I/O  
PG13 – GPIO/PPI D13/TSCLK1 I/O  
PG14 – GPIO/PPI D14/TFS1  
I/O  
PG15 – GPIO/PPI D15/DT1PRI I/O  
GPIO/PPI Data 15/SPORT1 Transmit Data Primary C  
Rev. B  
| Page 20 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Table 9. Pin Descriptions (Continued)  
Driver  
Pin Name  
Type Function  
Type1  
Pull-Up/Pull-Down  
Port H: GPIO/10/100 Ethernet  
MAC (On ADSP-BF534, these  
pins are GPIO only)  
PH0 – GPIO/ETxD0  
PH1 – GPIO/ETxD1  
PH2 – GPIO/ETxD2  
PH3 – GPIO/ETxD3  
PH4 – GPIO/ETxEN  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
GPIO/Ethernet MII or RMII Transmit D0  
GPIO/Ethernet MII or RMII Transmit D1  
GPIO/Ethernet MII Transmit D2  
E
E
E
E
E
E
GPIO/Ethernet MII Transmit D3  
GPIO/Ethernet MII or RMII Transmit Enable  
PH5 – GPIO/MII TxCLK/RMII  
GPIO/Ethernet MII Transmit Clock/RMII Reference  
REF_CLK  
Clock  
PH6 – GPIO/MII PHYINT/RMII  
I/O  
GPIO/Ethernet MII PHY Interrupt/RMII  
E
MDINT  
Management Data Interrupt  
PH7 – GPIO/COL  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
GPIO/Ethernet Collision  
E
E
E
E
E
E
PH8 – GPIO/ERxD0  
PH9 – GPIO/ERxD1  
PH10 – GPIO/ERxD2  
PH11 – GPIO/ERxD3  
PH12 – GPIO/ERxDV/TACLK5  
GPIO/Ethernet MII or RMII Receive D0  
GPIO/Ethernet MII or RMII Receive D1  
GPIO/Ethernet MII Receive D2  
GPIO/Ethernet MII Receive D3  
GPIO/Ethernet MII Receive Data Valid/Alternate  
Timer5 Input Clock  
PH13 – GPIO/ERxCLK/TACLK6 I/O  
GPIO/Ethernet MII Receive Clock/Alternate  
Timer6 Input Clock  
E
E
E
PH14 – GPIO/ERxER/TACLK7  
I/O  
I/O  
GPIO/Ethernet MII or RMII Receive Error/Alternate  
Timer7 Input Clock  
PH15 – GPIO/MII CRS/RMII  
GPIO/Ethernet MII Carrier Sense/Ethernet RMII  
CRS_DV  
Carrier Sense and Receive Data Valid  
Port J: SPORT0/TWI/SPI  
Select/CAN  
PJ0 – MDC  
O
Ethernet Management Channel Clock  
E
E
On ADSP-BF534 processors, do not  
connect PJ0, and tie PJ1 to ground  
PJ1 – MDIO  
I/O  
Ethernet Management Channel Serial Data  
On ADSP-BF534 processors, do not  
connect PJ0, and tie PJ1 to ground  
PJ2 – SCL  
I/O  
I/O  
I
TWI Serial Clock  
TWI Serial Data  
F
F
PJ3 – SDA  
PJ4 – DR0SEC/CANRX/TACI0  
SPORT0 Receive Data Secondary/CAN  
Receive/Timer0 Alternate Input Capture  
PJ5 – DT0SEC/CANTX/SPI SSEL7 O  
SPORT0 Transmit Data Secondary/CAN  
Transmit/SPI Slave Select Enable 7  
C
D
C
PJ6 – RSCLK0/TACLK2  
PJ7 – RFS0/TACLK3  
I/O  
SPORT0 Receive Serial Clock/Alternate Timer2  
Clock Input  
I/O  
I
SPORT0 Receive Frame Sync/Alternate Timer3  
Clock Input  
PJ8 – DR0PRI/TACLK4  
PJ9 – TSCLK0/TACLK1  
PJ10 – TFS0/SPI SSEL3  
PJ11 – DT0PRI/SPI SSEL2  
SPORT0 Receive Data Primary/Alternate Timer4  
Clock Input  
I/O  
I/O  
O
SPORT0 Transmit Serial Clock/Alternate Timer1  
Clock Input  
D
C
C
SPORT0 Transmit Frame Sync/SPI Slave Select  
Enable 3  
SPORT0 Transmit Data Primary/SPI Slave Select  
Enable 2  
Rev. B  
| Page 21 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Table 9. Pin Descriptions (Continued)  
Driver  
Type1  
Pin Name  
Real Time Clock  
RTXI  
Type Function  
Pull-Up/Pull-Down  
I
RTC Crystal Input  
This pin should always be pulled  
low when not used  
RTXO  
JTAG Port  
TCK  
O
RTC Crystal Output  
I
JTAG Clock  
TDO  
O
I
JTAG Serial Data Out  
JTAG Serial Data In  
JTAG Mode Select  
JTAG Reset  
C
TDI  
TMS  
I
TRST  
I
This pin should be pulled low if the  
JTAG port is not used  
EMU  
O
Emulation Output  
C
E
Clock  
CLKIN  
I
Clock/Crystal Input  
Crystal Output  
XTAL  
O
O
CLKBUF  
Mode Controls  
RESET  
Buffered XTAL Output  
E
I
I
Reset  
NMI  
Nonmaskable Interrupt  
This pin should always be pulled  
high when not used  
BMODE2–0  
Voltage Regulator  
VROUT0  
VROUT1  
Supplies  
I
Boot Mode Strap 2-0  
O
O
External FET Drive  
External FET Drive  
VDDEXT  
P
P
I/O Power Supply  
VDDINT  
Internal Power Supply (regulated from 2.25 V  
to 3.6 V)  
VDDRTC  
GND  
P
Real Time Clock Power Supply  
External Ground  
G
1 See Output Drive Currents on Page 50 for more information about each driver types.  
Rev. B  
| Page 22 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
SPECIFICATIONS  
Note that component specifications are subject to change  
without notice.  
OPERATING CONDITIONS  
Parameter1  
Min  
0.8  
Nominal  
1.26  
Max  
1.32  
3.6  
Unit  
V
VDDINT  
VDDEXT  
VDDRTC  
VIH  
Internal Supply Voltage2  
External Supply Voltage  
2.25  
2.25  
2.0  
2.5 or 3.3  
V
Real Time Clock Power Supply Voltage  
High Level Input Voltage3, 4, @ VDDEXT = maximum  
High Level Input Voltage5, @ VDDEXT = maximum  
3.6  
V
3.6  
V
VIHCLKIN  
VIH5V  
VIL  
2.2  
3.6  
V
5.0 V Tolerant Pins, High Level Input Voltage6, @ VDDEXT = maximum 2.0  
5.0  
V
Low Level Input Voltage3, 7, @ VDDEXT = minimum  
5.0 V Tolerant Pins, Low Level Input Voltage6, @ VDDEXT = minimum  
–0.3  
–0.3  
+0.6  
+0.8  
V
VIL5V  
V
1 Specifications subject to change without notice.  
2 The voltage regulator can generate VDDINT at levels of 0.85 V to 1.2 V with –5% to +10% tolerance. To run the processors at 500 MHz or 600 MHz, VDDINT must be in an  
operating range of 1.2 V to 1.32 V.  
3 Bidirectional pins (DATA15–0, PF15–0, PG15–0, PH15–0, TFS0, TCLK0, RSCLK0, RFS0, MDIO) and input pins (BR, ARDY, DR0PRI, DR0SEC, RTXI, TCK, TDI, TMS,  
TRST, CLKIN, RESET, NMI, and BMODE2–0) of the ADSP-BF534/ADSP-BF536/ADSP-BF537 are 3.3 V-tolerant (always accept up to 3.6 V maximum VIH). Voltage  
compliance (on outputs, VOH) is limited by the VDDEXT supply voltage.  
4 Parameter value applies to all input and bidirectional pins except CLKIN, SDA, and SCL.  
5 Parameter value applies to CLKIN pin only.  
6 Pins SDA, SCL, and PJ4 are 5.0 V tolerant (always accept up to 5.5 V maximum VIH). Voltage compliance (on outputs, VOH) is limited by the VDDEXT supply voltage.  
7 Parameter value applies to all input and bidirectional pins except SDA and SCL.  
Rev. B  
| Page 23 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
ELECTRICAL CHARACTERISTICS  
Parameter  
Description  
Test Conditions  
Min  
Max Unit  
V
V
OH (All Outputs and I/Os Except High Level Output Voltage1 @ VDDEXT = 3.3 V 10%, IOH = –0.5 mA  
VDDEXT – 0.5  
VDDEXT – 0.5  
V
V
Port F, Port G, Port H)  
OH (Port F7–0)  
@ VDDEXT = 2.5 V 10%, IOH = –0.5 mA  
@ VDDEXT = 3.3 V 10%, IOH = –8 mA  
@ VDDEXT = 2.5 V 10%, IOH = –6 mA  
VDDEXT – 0.5  
V
V
V
DDEXT – 0.5  
VOH (Port F15–8, Port G, Port H)  
IOH = –2 mA  
VDDEXT – 0.5  
V
I
OH (Max Combined for  
Port F7–0)  
VOH = VDDEXT – 0.5 V min  
–64  
mA  
I
OH (Max Total for All Port F,  
Port G, and Port H Pins)  
VOH = VDDEXT – 0.5 V min  
–144 mA  
V
OL (All Outputs and I/Os Except Low Level Output Voltage1 @ VDDEXT = 3.3 V 10%, IOL = 2.0 mA  
0.4  
V
Port F, Port G, Port H)  
@ VDDEXT = 2.5 V 10%, IOL = 2.0 mA  
@ VDDEXT = 3.3 V 10%, IOL = 8 mA  
@ VDDEXT = 2.5 V 10%, IOL = 6 mA  
IOL = 2 mA  
VOL (Port F7–0)  
0.5  
0.5  
0.5  
64  
V
V
V
OL (Port F15–8, Port G, Port H)  
V
I
OL (Max Combined for Port F7–0)  
VOL = 0.5 V max  
mA  
mA  
IOL (Max Total for All Port F, Port G,  
and Port H Pins)  
VOL = 0.5 V max  
144  
IIH  
High Level Input Current2 @ VDDEXT =3.6 V, VIN = 3.6 V  
High Level Input Current3 @ VDDEXT =3.0 V, VIN = 5.5 V  
10  
10  
10  
μA  
μA  
μA  
IIH5V  
IIL  
Low Level Input Current2  
@ VDDEXT =3.6 V, VIN = 0 V  
@ VDDEXT = 3.6 V, VIN = 3.6 V  
IIHP  
High Level Input Current  
JTAG4  
50.0 μA  
IOZH  
IOZH5V  
IOZL  
Three-State Leakage  
Current5  
@ VDDEXT = 3.6 V, VIN = 3.6 V  
@ VDDEXT =3.0 V, VIN = 5.5 V  
@ VDDEXT = 3.6 V, VIN = 0 V  
10  
10  
10  
8
μA  
μA  
μA  
pF  
Three-State Leakage  
Current6  
Three-State Leakage  
Current5  
Input Capacitance7, 8  
CIN  
fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V  
1 Applies to output and bidirectional pins.  
2 Applies to input pins.  
3 Applies to input pin PJ4.  
4 Applies to JTAG input pins (TCK, TDI, TMS, TRST).  
5 Applies to three-statable pins.  
6 Applies to bidirectional pins PJ2 and PJ3.  
7 Applies to all signal pins.  
8 Guaranteed, but not tested.  
Rev. B  
| Page 24 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
ABSOLUTE MAXIMUM RATINGS  
PACKAGE INFORMATION  
Stresses greater than those listed below may cause permanent  
damage to the device. These are stress ratings only. Functional  
operation of the device at these or any other conditions greater  
than those indicated in the operational sections of this specifica-  
tion is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
The information presented in Figure 8 and Table 11 provides  
details about the package branding for the Blackfin processors.  
For a complete listing of product availability, see Ordering  
Guide on Page 66.  
a
ADSP-BF5xx  
Parameter  
Rating  
Internal (Core) Supply Voltage (VDDINT  
)
0.3 V to +1.4 V  
0.3 V to +3.8 V  
–0.5 V to +3.6 V  
0.5 V to +5.5 V  
–0.5 V to VDDEXT +0.5 V  
200 pF  
tppZccc  
vvvvvv.x n.n  
External (I/O) Supply Voltage (VDDEXT  
)
Input Voltage  
Input Voltage1  
yyww country_of_origin  
B
Output Voltage Swing  
Load Capacitance2  
Figure 8. Product Information on Package  
Storage Temperature Range  
Junction Temperature Underbias  
1 Applies to pins SCL, SDA, and PJ4. For other duty cycles, see Table 10.  
2 For proper SDRAM controller operation, the maximum load capacitance is 50 pF  
(at 3.3 V) or 30 pF (at 2.5 V) for ADDR19–1, DATA15–0, ABE1–0/SDQM1–0,  
CLKOUT, SCKE, SA10, SRAS, SCAS, SWE, and SMS.  
65°C to +150°C  
+125°C  
Table 11. Package Brand Information  
Brand Key  
Field Description  
Temperature Range  
Package Type  
t
pp  
Z
Lead Free Option (optional)  
See Ordering Guide  
Assembly Lot Code  
Silicon Revision  
Table 10. Maximum Duty Cycle for Input1 Transient Voltage  
ccc  
VIN Min (V)  
–0.33  
VIN Max (V)2  
3.63  
Maximum Duty Cycle  
vvvvvv.x  
n.n  
100%  
48%  
30%  
20%  
10%  
8%  
–0.50  
3.80  
yyww  
Date Code  
–0.60  
3.90  
–0.70  
4.00  
–0.80  
4.10  
–0.90  
4.20  
–1.00  
4.30  
5%  
1 Applies to all signal pins with the exception of CLKIN, XTAL, and VROUT1–0.  
2 Only one of the listed options can apply to a particular design.  
ESD SENSITIVITY  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
the Blackfin processor features proprietary ESD protection circuitry, permanent damage may occur  
on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are  
recommended to avoid performance degradation or loss of functionality.  
Rev. B  
| Page 25 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
TIMING SPECIFICATIONS  
Table 12 and Table 13 describe the timing requirements for the  
ADSP-BF534/ADSP-BF536/ADSP-BF537 processor clocks.  
Take care in selecting MSEL, SSEL, and CSEL ratios so as not to  
exceed the maximum core clock and system clock. Table 15  
describes phase-locked loop operating conditions.  
Table 12. Core Clock Requirements—600 MHz Speed Grade1  
Parameter  
Min  
Max  
600  
475  
425  
375  
250  
Unit  
MHz  
MHz  
MHz  
MHz  
MHz  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
Core Clock Frequency (VDDINT =1.2 V minimum)  
Core Clock Frequency (VDDINT =1.045 V minimum)  
Core Clock Frequency (VDDINT = 0.95 V minimum)  
Core Clock Frequency (VDDINT = 0.85 V minimum)  
Core Clock Frequency (VDDINT = 0.8 V )  
1 The speed grade of a given part is printed on the chip’s package as shown in Figure 8 on Page 25 and can also be seen on the specific products ordering guide. It stands for the  
maximum allowed CCLK frequency at VDDINT = 1.2 V and the maximum allowed VCO frequency at any supply voltage.  
Table 13. Core Clock Requirements—500 MHz Speed Grade1  
Parameter  
fCCLK  
Min  
Max  
500  
444  
400  
333  
250  
Unit  
MHz  
MHz  
MHz  
MHz  
MHz  
Core Clock Frequency (VDDINT = 1.2 V minimum)  
Core Clock Frequency (VDDINT = 1.045 V minimum)  
Core Clock Frequency (VDDINT = 0.95 V minimum)  
Core Clock Frequency (VDDINT = 0.85 V minimum)  
Core Clock Frequency (VDDINT = 0.8 V )  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
1 The speed grade of a given part is printed on the chip’s package as shown in Figure 8 on Page 25 and can also be seen on the specific products ordering guide. It stands for the  
maximum allowed CCLK frequency at VDDINT = 1.2 V and the maximum allowed VCO frequency at any supply voltage.  
Table 14. Core Clock Requirements—400 MHz Speed Grade1  
Parameter  
fCCLK  
Min  
Max  
400  
363  
333  
280  
250  
Unit  
MHz  
MHz  
MHz  
MHz  
MHz  
Core Clock Frequency (VDDINT = 1.14 V minimum)  
Core Clock Frequency (VDDINT = 1.045 V minimum)  
Core Clock Frequency (VDDINT = 0.95 V minimum)  
Core Clock Frequency (VDDINT = 0.85 V minimum)  
Core Clock Frequency (VDDINT = 0.8 V )  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
1 The speed grade of a given part is printed on the chip’s package as shown in Figure 8 on Page 25 and can also be seen on the specific products ordering guide. It stands for the  
maximum allowed CCLK frequency at VDDINT = 1.2 V and the maximum allowed VCO frequency at any supply voltage.  
Table 15. Phase-Locked Loop Operating Conditions  
Parameter  
Min  
Max  
Speed Grade1  
Unit  
fVCO  
Voltage Controlled Oscillator (VCO) Frequency  
50  
MHz  
1 The speed grade of a given part is printed on the chip’s package as shown in Figure 8 on Page 25 and can also be seen on the specific products ordering guide. It stands for the  
maximum allowed CCLK frequency at VDDINT = 1.2 V and the maximum allowed VCO frequency at any supply voltage.  
Rev. B  
| Page 26 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Table 16. System Clock Requirements  
Parameter  
fSCLK  
Condition  
Min  
Max  
133  
100  
133  
100  
Unit  
MHz  
MHz  
MHz  
MHz  
V
V
V
V
DDEXT = 3.3 V, VDDINT 1.14 V  
DDEXT = 3.3 V, VDDINT < 1.14 V  
DDEXT = 2.5 V, VDDINT 1.14 V  
DDEXT = 2.5 V, VDDINT < 1.14 V  
fSCLK  
fSCLK  
fSCLK  
Table 17. Clock Input and Reset Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tCKIN  
CLKIN Period1  
CLKIN Low Pulse2  
CLKIN High Pulse2  
25.0  
10.0  
10.0  
100.0  
10  
ns  
ns  
ns  
ns  
ns  
tCKINL  
tCKINH  
tBUFDLAY  
tWRST  
CLKIN to CLKBUF Delay  
RESET Asserted Pulse Width Low3  
11 tCKIN  
1 Combinations of the CLKIN frequency and the PLL clock multiplier must not exceed the allowed fVCO, fCCLK, and fSCLK settings discussed in Table 12 through Table 16. Since  
by default the PLL is multiplying the CLKIN frequency by 10, 300 MHz and 400 MHz speed grade parts can not use the full CLKIN period range.  
2 Applies to bypass mode and nonbypass mode.  
3 Applies after power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2000 CLKIN cycles while RESET is asserted,  
assuming stable power supplies and CLKIN (not including start-up time of external clock oscillator).  
tCKIN  
CLKIN  
tCKINL  
tCKINH  
tBUFDLAY  
tBUFDLAY  
CLKBUF  
tWRST  
RESET  
Figure 9. Clock and Reset Timing  
Rev. B  
| Page 27 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Asynchronous Memory Read Cycle Timing  
Table 18. Asynchronous Memory Read Cycle Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSDAT  
DATA15–0 Setup Before CLKOUT  
DATA15–0 Hold After CLKOUT  
ARDY Setup Before CLKOUT  
ARDY Hold After CLKOUT  
2.1  
0.8  
4.0  
0.0  
ns  
ns  
ns  
ns  
tHDAT  
tSARDY  
tHARDY  
Switching Characteristics  
tDO  
tHO  
Output Delay After CLKOUT1  
Output Hold After CLKOUT 1  
6.0  
ns  
ns  
0.8  
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, AOE, ARE.  
HOLD  
1 CYCLE  
SETUP  
2 CYCLES  
PROGRAMMED READ ACCESS  
4 CYCLES  
ACCESS EXTENDED  
3 CYCLES  
CLKOUT  
tDO  
tHO  
AMSx  
ABE1–0  
BE, ADDRESS  
ADDR19–1  
AOE  
tDO  
tHO  
ARE  
tHARDY  
tSARDY  
tHARDY  
ARDY  
tSARDY  
tSDAT  
tHDAT  
DATA15–0  
READ  
Figure 10. Asynchronous Memory Read Cycle Timing  
Rev. B  
| Page 28 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Asynchronous Memory Write Cycle Timing  
Table 19. Asynchronous Memory Write Cycle Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSARDY  
tHARDY  
ARDY Setup Before CLKOUT  
ARDY Hold After CLKOUT  
4.0  
0.0  
ns  
ns  
Switching Characteristics  
tDDAT  
tENDAT  
tDO  
DATA15–0 Disable After CLKOUT  
6.0  
6.0  
ns  
ns  
ns  
ns  
DATA15–0 Enable After CLKOUT  
Output Delay After CLKOUT1  
Output Hold After CLKOUT 1  
1.0  
0.8  
tHO  
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.  
ACCESS  
EXTENDED  
1 CYCLE  
SETUP  
2 CYCLES  
HOLD  
1 CYCLE  
PROGRAMMED WRITE  
ACCESS 2 CYCLES  
CLKOUT  
AMSx  
tDO  
tHO  
ABE1–0  
BE, ADDRESS  
ADDR19–1  
tDO  
tHO  
AWE  
tHARDY  
tSARDY  
ARDY  
tSARDY  
tENDAT  
tDDAT  
DATA15–0  
WRITE DATA  
Figure 11. Asynchronous Memory Write Cycle Timing  
Rev. B  
| Page 29 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
External Port Bus Request and Grant Cycle Timing  
Table 20 and Figure 12 describe external port bus request and  
bus grant operations.  
Table 20. External Port Bus Request and Grant Cycle Timing  
Parameter1, 2  
Min  
Max  
Unit  
Timing Requirements  
tBS  
BR Asserted to CLKOUT Low Setup  
4.6  
0.0  
ns  
ns  
tBH  
CLKOUT Low to BR Deasserted Hold Time  
Switching Characteristics  
tSD  
CLKOUT Low to AMSx, Address, and RD/WR Disable  
4.5  
4.5  
3.6  
3.6  
3.6  
3.6  
ns  
ns  
ns  
ns  
ns  
ns  
tSE  
CLKOUT Low to AMSx, Address, and RD/WR Enable  
CLKOUT High to BG Asserted Setup  
tDBG  
tEBG  
tDBH  
tEBH  
CLKOUT High to BG Deasserted Hold Time  
CLKOUT High to BGH Asserted Setup  
CLKOUT High to BGH Deasserted Hold Time  
1 These are preliminary timing parameters that are based on worst-case operating conditions.  
2 The pad loads for these timing parameters are 20 pF.  
CLKOUT  
tBS  
tBH  
BR  
tSD  
tSE  
AMSx  
tSD  
tSE  
ADDR19-1  
ABE1-0  
tSD  
tSE  
AWE  
ARE  
tDBG  
tEBG  
BG  
tDBH  
tEBH  
BGH  
Figure 12. External Port Bus Request and Grant Cycle Timing  
Rev. B  
| Page 30 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
SDRAM Interface Timing  
Table 21. SDRAM Interface Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSSDAT  
tHSDAT  
Switching Characteristics  
DATA Setup Before CLKOUT  
1.5  
0.8  
ns  
ns  
DATA Hold After CLKOUT  
tSCLK  
CLKOUT Period1  
7.5  
2.5  
2.5  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSCLKH  
tSCLKL  
tDCAD  
tHCAD  
tDSDAT  
tENSDAT  
CLKOUT Width High  
CLKOUT Width Low  
Command, ADDR, Data Delay After CLKOUT2  
Command, ADDR, Data Hold After CLKOUT2  
Data Disable After CLKOUT  
4.0  
6.0  
1.0  
Data Enable After CLKOUT  
1.0  
1 The tSCLK value is the inverse of the fSCLK specification discussed in Table 16. Package type and reduced supply voltages affect the best-case value of 7.5 ns listed here.  
2 Command pins include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.  
tSCLK  
tSCLKH  
CLKOUT  
tSSDAT  
tSCLKL  
tHSDAT  
DATA (IN)  
tDCAD  
tDSDAT  
tENSDAT  
tHCAD  
DATA (OUT)  
tDCAD  
COMMAND ADDR  
(OUT)  
tHCAD  
NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.  
Figure 13. SDRAM Interface Timing  
Rev. B  
| Page 31 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
External DMA Request Timing  
Table 22 and Figure 14 describe the external DMA request  
operations.  
Table 22. External DMA Request Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tDR  
DMARx Asserted to CLKOUT High Setup  
CLKOUT High to DMARx Deasserted Hold Time  
DMARx Active Pulse Width  
6.0  
ns  
ns  
ns  
ns  
tDH  
0.0  
tDMARACT  
tDMARINACT  
1.0 × tSCLK  
1.75 × tSCLK  
DMARx Inactive Pulse Width  
CLKOUT  
tDR  
tDH  
DMAR0/1  
(Active Low)  
tDMARACT  
tDMARINACT  
DMAR0/1  
(Active High)  
tDMARACT  
tDMARINACT  
Figure 14. External DMA Request Timing  
Rev. B  
| Page 32 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Parallel Peripheral Interface Timing  
Table 23 and Figure 15 on Page 33, Figure 19 on Page 37, and  
Figure 20 on Page 38 describe parallel peripheral interface  
operations.  
Table 23. Parallel Peripheral Interface Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tPCLKW  
tPCLK  
PPI_CLK Width1  
PPI_CLK Period1  
6.0  
ns  
ns  
15.0  
Timing Requirements—GP Input and Frame Capture Modes  
tSFSPE  
External Frame Sync Setup Before PPI_CLK  
6.7  
ns  
(Nonsampling Edge for Rx, Sampling Edge for Tx)  
tHFSPE  
tSDRPE  
tHDRPE  
External Frame Sync Hold After PPI_CLK  
Receive Data Setup Before PPI_CLK  
Receive Data Hold After PPI_CLK  
1.0  
3.5  
1.5  
ns  
ns  
ns  
Switching Characteristics—GP Output and Frame Capture Modes  
tDFSPE  
tHOFSPE  
tDDTPE  
tHDTPE  
Internal Frame Sync Delay After PPI_CLK  
Internal Frame Sync Hold After PPI_CLK  
Transmit Data Delay After PPI_CLK  
Transmit Data Hold After PPI_CLK  
8.0  
8.0  
ns  
ns  
ns  
ns  
1.7  
1.8  
1 PPI_CLK frequency cannot exceed fSCLK/2.  
FRAME  
SYNC  
DATA  
DATA  
SAMPLING  
EDGE  
DRIVING  
EDGE  
SAMPLING  
EDGE  
POLC = 0  
PPI_CLK  
PPI_CLK  
POLC = 1  
t
DFSPE  
t
HOFSPE  
POLS = 1  
PPI_FS1  
POLS = 0  
POLS = 1  
PPI_FS2  
POLS = 0  
t
t
SDRPE  
HDRPE  
PPI_DATA  
Figure 15. PPI GP Rx Mode with Internal Frame Sync Timing  
Rev. B  
| Page 33 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
DATA  
DATA  
SAMPLING/  
FRAME  
SYNC  
SAMPLING/  
FRAME  
SYNC  
SAMPLING  
EDGE  
SAMPLING  
EDGE  
PPI_CLK  
POLC = 0  
PPI_CLK  
POLC = 1  
t
t
HFSPE  
SFSPE  
POLS = 1  
POLS = 0  
PPI_FS1  
POLS = 1  
POLS = 0  
PPI_FS2  
t
t
SDRPE  
HDRPE  
PPI_DATA  
Figure 16. PPI GP Rx Mode with External Frame Sync Timing  
DATA  
DATA  
DRIVING/  
FRAME  
SYNC  
DRIVING/  
FRAME  
SYNC  
DRIVING  
DRIVING  
EDGE  
EDGE  
PPI_CLK  
POLC = 0  
PPI_CLK  
POLC = 1  
t
DFSPE  
t
HOFSPE  
POLS = 1  
POLS = 0  
PPI_FS1  
PPI_FS2  
POLS = 1  
POLS = 0  
t
DDTPE  
t
HDTPE  
PPI_DATA  
Figure 17. PPI GP Tx Mode with Internal Frame Sync Timing  
Rev. B  
| Page 34 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
DATA  
DATA  
DRIVING/  
FRAME  
SYNC  
DRIVING/  
FRAME  
SYNC  
SAMPLING  
EDGE  
SAMPLING  
EDGE  
PPI_CLK  
POLC = 0  
PPI_CLK  
POLC = 1  
t
HFSPE  
t
SFSPE  
POLS = 1  
POLS = 0  
PPI_FS1  
POLS = 1  
POLS = 0  
PPI_FS2  
t
DDTPE  
t
HDTPE  
PPI_DATA  
Figure 18. PPI GP Tx Mode with External Frame Sync Timing  
Rev. B  
| Page 35 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Serial Ports  
Table 24 through Table 27 on Page 37 and Figure 19 on Page 37  
through Figure 21 on Page 39 describe serial port operations.  
Table 24. Serial Ports—External Clock  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSFSE  
TFS/RFS Setup Before TSCLK/RSCLK1  
TFS/RFS Hold After TSCLK/RSCLK1  
Receive Data Setup Before RSCLK1  
Receive Data Hold After RSCLK1  
TSCLK/RSCLK Width  
3.0  
3.0  
3.0  
3.0  
4.5  
15.0  
ns  
ns  
ns  
ns  
ns  
ns  
tHFSE  
tSDRE  
tHDRE  
tSCLKEW  
tSCLKE  
TSCLK/RSCLK Period  
Switching Characteristics  
tDFSE  
tHOFSE  
tDDTE  
tHDTE  
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)2  
TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)2  
Transmit Data Delay After TSCLK2  
10.0  
10.0  
ns  
ns  
ns  
ns  
0
0
Transmit Data Hold After TSCLK2  
1 Referenced to sample edge.  
2 Referenced to drive edge.  
Table 25. Serial Ports—Internal Clock  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSFSI  
TFS/RFS Setup Before TSCLK/RSCLK1  
8.0  
ns  
ns  
ns  
ns  
ns  
ns  
tHFSI  
TFS/RFS Hold After TSCLK/RSCLK1  
Receive Data Setup Before RSCLK1  
Receive Data Hold After RSCLK1  
TSCLK/RSCLK Width  
–1.5  
8.0  
tSDRI  
tHDRI  
tSCLKEW  
tSCLKE  
–1.5  
4.5  
TSCLK/RSCLK Period  
15.0  
Switching Characteristics  
tDFSI  
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)2  
TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)2  
Transmit Data Delay After TSCLK2  
3.0  
3.0  
ns  
ns  
ns  
ns  
ns  
tHOFSI  
tDDTI  
1.0  
tHDTI  
Transmit Data Hold After TSCLK2  
1.0  
tSCLKIW  
TSCLK/RSCLK Width  
4.5  
1 Referenced to sample edge.  
2 Referenced to drive edge.  
Table 26. Serial Ports—Enable and Three-State  
Parameter  
Min  
0
Max  
Unit  
Switching Characteristics  
tDTENE  
tDDTTE  
tDTENI  
tDDTTI  
Data Enable Delay from External TSCLK1  
Data Disable Delay from External TSCLK1  
Data Enable Delay from Internal TSCLK1  
Data Disable Delay from Internal TSCLK1  
ns  
ns  
ns  
ns  
10.0  
3.0  
–2.0  
1 Referenced to drive edge.  
Rev. B  
| Page 36 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Table 27. External Late Frame Sync  
Parameter  
Min  
Max  
Unit  
Switching Characteristics  
tDDTLFSE  
tDTENLFS  
Data Delay from Late External TFS or External RFS with MCE = 1, MFD = 01, 2  
Data Enable from Late FS or MCE = 1, MFD = 01, 2  
10.0  
ns  
ns  
0
1 MCE = 1, TFS enable and TFS valid follow tDDTENFS and tDDTLFS  
2 If external RFS/TFS setup to RSCLK/TSCLK > tSCLKE/2, then tDDTE/I and tDTENE/I apply, otherwise tDDTLFSE and tDTENLFS apply.  
.
DATA RECEIVE INTERNAL CLOCK  
DATA RECEIVE EXTERNAL CLOCK  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
SAMPLE  
EDGE  
tSCLKIW  
tSCLKEW  
RSCLK  
RSCLK  
tDFSE  
tDFSE  
tHOFSE  
RFS  
tSFSI  
tHFSI  
tHOFSE  
tSFSE  
tHFSE  
RFS  
tSDRI  
tHDRI  
tSDRE  
tHDRE  
DR  
DR  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK, TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
DATA TRANSMIT INTERNAL CLOCK  
DATA TRANSMIT EXTERNAL CLOCK  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
SAMPLE  
EDGE  
tSCLKIW  
tSCLKEW  
TSCLK  
TSCLK  
tDFSI  
tDFSE  
tHOFSI  
tSFSI  
tHFSI  
tHOFSE  
tSFSE  
tHFSE  
TFS  
DT  
TFS  
tDDTI  
tDDTE  
tHDTI  
tHDTE  
DT  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK OR TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
DRIVE  
EDGE  
DRIVE  
EDGE  
TSCLK (EXT.)  
TFS (“LATE,” EXT.)  
TSCLK/RSCLK  
tDDTTE  
tDDTENE  
DT  
DRIVE  
EDGE  
DRIVE  
EDGE  
TSCLK (INT.)  
TFS (“LATE,” INT.)  
TSCLK/RSCLK  
tDDTENI  
tDDTTI  
DT  
Figure 19. Serial Ports  
Rev. B  
| Page 37 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
EXTERNAL RFS WITH MCE = 1, MFD = 0  
DRIVE  
SAMPLE  
DRIVE  
RSCLK  
RFS  
tHOFSE/I  
tSFSE/I  
tDDTE/I  
tDTENLFS  
tHDTE/I  
1ST BIT  
2ND BIT  
DT  
tDDTLFSE  
LATE EXTERNAL TFS  
DRIVE  
SAMPLE  
DRIVE  
TSCLK  
TFS  
tSFSE/I  
tHOFSE/I  
tDDTE/I  
tDTENLFS  
tHDTE/I  
DT  
1ST BIT  
2ND BIT  
tDDTLFSE  
Figure 20. External Late Frame Sync (Frame Sync Setup < tSCLKE/2)  
Rev. B  
| Page 38 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
EXTERNAL RFS WITH MCE = 1, MFD = 0  
DRIVE  
SAMPLE  
DRIVE  
RSCLK  
RFS  
tSFSE/I  
tHOFSE/I  
tDDTE/I  
tHDTE/I  
tDTENLSCK  
1ST BIT  
DT  
2ND BIT  
tDDTLSCK  
LATE EXTERNAL TFS  
DRIVE  
SAMPLE  
DRIVE  
TSCLK  
TFS  
tSFSE/I  
tHOFSE/I  
tDDTE/I  
tHDTE/I  
tDTENLSCK  
DT  
1ST BIT  
2ND BIT  
tDDTLSCK  
Figure 21. External Late Frame Sync (Frame Sync Setup > tSCLKE/2)  
Rev. B  
| Page 39 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Serial Peripheral Interface Port—Master Timing  
Table 28 and Figure 22 describe SPI port master operations.  
Table 28. Serial Peripheral Interface (SPI) Port—Master Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSSPIDM  
tHSPIDM  
Data Input Valid to SCK Edge (Data Input Setup)  
SCK Sampling Edge to Data Input Invalid  
7.5  
ns  
ns  
–1.5  
Switching Characteristics  
tSDSCIM  
tSPICHM  
tSPICLM  
tSPICLK  
SPISELx Low to First SCK Edge (x = 0 or x = 1)  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
4 × tSCLK 1.5  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Serial Clock High Period  
Serial Clock Low Period  
Serial Clock Period  
tHDSM  
Last SCK Edge to SPISELx High (x = 0 or x = 1)  
Sequential Transfer Delay  
tSPITDM  
tDDSPIDM  
tHDSPIDM  
SCK Edge to Data Out Valid (Data Out Delay)  
SCK Edge to Data Out Invalid (Data Out Hold)  
6
–1.0  
+4.0  
SPISELx  
(OUTPUT)  
tSPICLK  
tHDSM  
tSPITDM  
tSDSCIM  
tSPICHM  
tSPICLM  
SCK  
(CPOL = 0)  
(OUTPUT)  
tSPICLM  
tSPICHM  
SCK  
(CPOL = 1)  
(OUTPUT)  
tDDSPIDM  
tHDSPIDM  
MOSI  
(OUTPUT)  
MSB  
LSB  
CPHA = 1  
tSSPIDM  
tHSPIDM  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
tDDSPIDM  
tHDSPIDM  
MOSI  
(OUTPUT)  
MSB  
LSB  
CPHA = 0  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 22. Serial Peripheral Interface (SPI) Port—Master Timing  
Rev. B  
| Page 40 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Serial Peripheral Interface Port—Slave Timing  
Table 29 and Figure 23 describe SPI port slave operations.  
Table 29. Serial Peripheral Interface (SPI) Port—Slave Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSPICHS  
tSPICLS  
tSPICLK  
tHDS  
Serial Clock High Period  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
4 × tSCLK 1.5  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
1.6  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Serial Clock Low Period  
Serial Clock Period  
Last SCK Edge to SPISS Not Asserted  
Sequential Transfer Delay  
tSPITDS  
tSDSCI  
tSSPID  
tHSPID  
SPISS Assertion to First SCK Edge  
Data Input Valid to SCK Edge (Data Input Setup)  
SCK Sampling Edge to Data Input Invalid  
1.6  
Switching Characteristics  
tDSOE  
SPISS Assertion to Data Out Active  
0
0
0
0
8
ns  
ns  
ns  
ns  
tDSDHI  
tDDSPID  
tHDSPID  
SPISS Deassertion to Data High Impedance  
SCK Edge to Data Out Valid (Data Out Delay)  
SCK Edge to Data Out Invalid (Data Out Hold)  
8
10  
10  
SPISS  
(INPUT)  
tSPICHS  
tSPICLS  
tSPICLK  
tHDS  
tSPITDS  
SCK  
(CPOL = 0)  
(INPUT)  
tSDSCI  
tSPICLS  
tSPICHS  
SCK  
(CPOL = 1)  
(INPUT)  
tDSOE  
tDDSPID  
tHDSPID  
MSB  
tDDSPID  
tDSDHI  
LSB  
MISO  
(OUTPUT)  
tHSPID  
tSSPID  
CPHA = 1  
tSSPID  
tHSPID  
MOSI  
(INPUT)  
MSB VALID  
LSB VALID  
tDSOE  
tDDSPID  
tDSDHI  
MISO  
(OUTPUT)  
MSB  
LSB  
tHSPID  
CPHA = 0  
tSSPID  
MOSI  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 23. Serial Peripheral Interface (SPI) Port—Slave Timing  
Rev. B  
| Page 41 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Universal Asynchronous Receiver-Transmitter  
(UART) Ports—Receive and Transmit Timing  
Figure 24 describes the UART ports receive and transmit opera-  
tions. The maximum baud rate is SCLK/16. As shown in  
Figure 24 there is some latency between the generation of  
internal UART interrupts and the external data operations.  
These latencies are negligible at the data transmission rates for  
the UART.  
CLKOUT  
(SAMPLE CLOCK)  
UARTX Rx  
DATA(5–8)  
STOP  
RECEIVE  
INTERNAL  
UART RECEIVE  
INTERRUPT  
UART RECEIVE BIT SET BY DATA STOP;  
CLEARED BY FIFO READ  
START  
UARTX Tx  
DATA(5–8)  
STOP (1–2)  
TRANSMIT  
INTERNAL  
UART TRANSMIT  
INTERRUPT  
UART TRANSMIT BIT SET BY PROGRAM;  
CLEARED BY WRITE TO TRANSMIT  
Figure 24. UART Ports—Receive and Transmit Timing  
Rev. B  
| Page 42 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
General-Purpose Port Timing  
Table 30 and Figure 25 describe general-purpose  
port operations.  
Table 30. General-Purpose Port Timing  
Parameter  
Min  
tSCLK + 1  
0
Max  
Unit  
ns  
Timing Requirement  
tWFI  
General-Purpose Port Pin Input Pulse Width  
Switching Characteristic  
tGPOD  
General-Purpose Port Pin Output Delay from CLKOUT Low  
6
ns  
CLKOUT  
tGPOD  
GPP OUTPUT  
tWFI  
GPP INPUT  
Figure 25. General-Purpose Port Timing  
Rev. B  
| Page 43 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Timer Cycle Timing  
Table 31 and Figure 26 describe timer expired operations. The  
input signal is asynchronous in “width capture mode” and  
“external clock mode” and has an absolute maximum input fre-  
quency of (fSCLK/2) MHz.  
Table 31. Timer Cycle Timing  
Parameter  
Min  
Max  
Unit  
Timing Characteristics  
tWL  
tWH  
tTIS  
tTIH  
Timer Pulse Width Input Low (Measured In SCLK Cycles)1  
Timer Pulse Width Input High (Measured In SCLK Cycles)1  
Timer Input Setup Time Before CLKOUT Low2  
1 × tSCLK  
1 × tSCLK  
5
ns  
ns  
ns  
ns  
Timer Input Hold Time After CLKOUT Low2  
–2  
Switching Characteristics  
tHTO Timer Pulse Width Output (Measured In SCLK Cycles)  
tTOD Timer Output Update Delay After CLKOUT High  
1 × tSCLK  
(232–1) × tSCLK ns  
ns  
6
1 The minimum pulse widths apply for TMRx signals in width capture and external clock modes. They also apply to the PF15 or PPI_CLK signals in PWM output mode.  
2 Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize programmable flag inputs.  
CLKOUT  
tTO D  
TIMER OUTPUT  
tHTO  
tTIS  
tTIH  
TIMER INPUT  
tWH, tWL  
Figure 26. Timer Cycle Timing  
Rev. B  
| Page 44 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Timer Clock Timing  
Table 32 and Figure 27 describe timer clock timing.  
Table 32. Timer Clock Timing  
Parameter  
Min  
Max  
Unit  
Switching Characteristic  
tTODP  
Timer Output Update Delay After PPICLK High  
12  
ns  
PPI CLOCK  
tTODP  
TIMER OUTPUT  
Figure 27. Timer Clock Timing  
Rev. B  
| Page 45 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
JTAG Test and Emulation Port Timing  
Table 33 and Figure 28 describe JTAG port operations.  
Table 33. JTAG Port Timing  
Parameter  
Min  
Max  
Unit  
Timing Parameters  
tTCK  
TCK Period  
20  
4
ns  
tSTAP  
tHTAP  
tSSYS  
tHSYS  
tTRSTW  
TDI, TMS Setup Before TCK High  
TDI, TMS Hold After TCK High  
System Inputs Setup Before TCK High1  
System Inputs Hold After TCK High1  
TRST Pulse Width2 (Measured in TCK Cycles)  
ns  
4
ns  
4
ns  
5
ns  
4
TCK  
Switching Characteristics  
tDTDO TDO Delay From TCK Low  
tDSYS  
System Outputs Delay After TCK Low3  
10  
12  
ns  
ns  
0
1 System Inputs = DATA15–0, BR, ARDY, SCL, SDA, TFS0, TSCLK0, RSCLK0, RFS0, DR0PRI, DR0SEC, PF15–0, PG15–0, PH15–0, MDIO, TCK, TD1, TMS, TRST, RESET,  
NMI, BMODE2–0.  
2 50 MHz maximum  
3 System Outputs = DATA15–0, ADDR19–1, ABE1–0, AOE, ARE, AWE, AMS3–0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS, SCL, SDA, TSCLK0, TFS0, RFS0, RSCLK0,  
DT0PRI, DT0SEC, PF15–0, PG15–0, PH15–0, RTX0, TD0, EMU, XTAL, VROUT.  
tTCK  
TCK  
tSTAP  
tHTAP  
TMS  
TDI  
tDTDO  
TDO  
tSSYS  
tHSYS  
SYSTEM  
INPUTS  
tDSYS  
SYSTEM  
OUTPUTS  
Figure 28. JTAG Port Timing  
Rev. B  
| Page 46 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
10/100 Ethernet MAC Controller Timing  
Table 34 through Table 39 and Figure 29 through Figure 34  
describe the 10/100 Ethernet MAC controller operations. This  
feature is only available on the ADSP-BF536 and ADSP-BF537  
processors. For more information, see Table 1 on Page 3.  
Table 34. 10/100 Ethernet MAC Controller Timing: MII Receive Signal  
Parameter1  
Min  
Max  
Unit  
tERXCLKF  
ERxCLK Frequency (fSCLK = SCLK Frequency)  
None  
25 MHz + 1%  
fSCLK + 1%  
ns  
tERXCLKW  
tERXCLKIS  
tERXCLKIH  
ERxCLK Width (tERxCLK = ERxCLK Period)  
t
ERxCLK × 35%  
t
ERxCLK × 65%  
ns  
ns  
ns  
Rx Input Valid to ERxCLK Rising Edge (Data In Setup)  
7.5  
7.5  
ERxCLK Rising Edge to Rx Input Invalid (Data In Hold)  
1 MII inputs synchronous to ERxCLK are ERxD3–0, ERxDV, and ERxER.  
Table 35. 10/100 Ethernet MAC Controller Timing: MII Transmit Signal  
Parameter1  
Min  
Max  
Unit  
tETF  
ETxCLK Frequency (fSCLK = SCLK Frequency)  
None  
25 MHz + 1%  
fSCLK + 1%  
ns  
tETXCLKW  
tETXCLKOV  
tETXCLKOH  
ETxCLK Width (tETxCLK = ETxCLK Period)  
t
ETxCLK × 35%  
t
ETxCLK × 65%  
ns  
ns  
ns  
ETxCLK Rising Edge to Tx Output Valid (Data Out Valid)  
20  
ETxCLK Rising Edge to Tx Output Invalid (Data Out Hold)  
0
1 MII outputs synchronous to ETxCLK are ETxD3–0.  
Table 36. 10/100 Ethernet MAC Controller Timing: RMII Receive Signal  
Parameter1  
Min  
Max  
Unit  
tEREFCLKF  
REF_CLK Frequency (fSCLK = SCLK Frequency)  
None  
50 MHz + 1%  
ns  
2 × fSCLK + 1%  
tEREFCLKW  
tEREFCLKIS  
tEREFCLKIH  
EREF_CLK Width (tEREFCLK = EREFCLK Period)  
t
EREFCLK × 35%  
t
EREFCLK × 65%  
ns  
ns  
ns  
Rx Input Valid to RMII REF_CLK Rising Edge (Data In Setup)  
4
2
RMII REF_CLK Rising Edge to Rx Input Invalid (Data In Hold)  
1 RMII inputs synchronous to RMII REF_CLK are ERxD1–0, RMII CRS_DV, and ERxER.  
Table 37. 10/100 Ethernet MAC Controller Timing: RMII Transmit Signal  
Parameter1  
Min  
Max  
7.5  
Unit  
ns  
tEREFCLKOV  
RMII REF_CLK Rising Edge to Tx Output Valid (Data Out Valid)  
RMII REF_CLK Rising Edge to Tx Output Invalid (Data Out Hold)  
tEREFCLKOH  
2
ns  
1 RMII outputs synchronous to RMII REF_CLK are ETxD1–0.  
Rev. B  
| Page 47 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Table 38. 10/100 Ethernet MAC Controller Timing: MII/RMII Asynchronous Signal  
Parameter1, 2  
Min  
Max  
Unit  
tECOLH  
COL Pulse Width High  
COL Pulse Width Low  
t
t
ETxCLK × 1.5  
ERxCLK × 1.5  
ns  
tECOLL  
t
t
ETxCLK × 1.5  
ERxCLK × 1.5  
ns  
tECRSH  
tECRSL  
CRS Pulse Width High  
CRS Pulse Width Low  
t
ETxCLK × 1.5  
ns  
ns  
tETxCLK × 1.5  
1 MII/RMII asynchronous signals are COL, CRS. These signals are applicable in both MII and RMII modes. The asynchronous COL input is synchronized separately to both  
the ETxCLK and the ERxCLK, and must have a minimum pulse width high or low at least 1.5 times the period of the slower of the two clocks.  
2 The asynchronous CRS input is synchronized to the ETxCLK, and must have a minimum pulse width high or low at least 1.5 times the period of ETxCLK.  
Table 39. 10/100 Ethernet MAC Controller Timing: MII Station Management  
Parameter1  
tMDIOS  
Min  
10  
Max  
Unit  
ns  
MDIO Input Valid to MDC Rising Edge (Setup)  
MDC Rising Edge to MDIO Input Invalid (Hold)  
MDC Falling Edge to MDIO Output Valid  
tMDCIH  
10  
ns  
tMDCOV  
25  
ns  
tMDCOH  
MDC Falling Edge to MDIO Output Invalid (Hold)  
–1  
ns  
1 MDC/MDIO is a 2-wire serial bidirectional port for controlling one or more external PHYs. MDC is an output clock whose minimum period is programmable as a multiple  
of the system clock SCLK. MDIO is a bidirectional data line.  
tERXCLK  
ERxCLK  
tERXCLKW  
ERxD3-0  
ERxDV  
ERxER  
tERXCLKIS  
tERXCLKIH  
Figure 29. 10/100 Ethernet MAC Controller Timing: MII Receive Signal  
tETXCLK  
MII TxCLK  
tETXCLKW  
tETXCLKOH  
ETxD3-0  
ETxEN  
tETXCLKOV  
Figure 30. 10/100 Ethernet MAC Controller Timing: MII Transmit Signal  
Rev. B  
| Page 48 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
tREFCLK  
ERxCLK  
tREFCLKW  
ERxD1-0  
ERxDV  
ERxER  
tERXCLKIS  
tERXCLKIH  
Figure 31. 10/100 Ethernet MAC Controller Timing: RMII Receive Signal  
tREFCLK  
RMII REF_CLK  
tEREFCLKOH  
ETxD1-0  
ETxEN  
tEREFCLKOV  
Figure 32. 10/100 Ethernet MAC Controller Timing: RMII Transmit Signal  
MII CRS, COL  
tECRSH  
tECOLH  
tECRSL  
tECOLL  
Figure 33. 10/100 Ethernet MAC Controller Timing: Asynchronous Signal  
MDC (OUTPUT)  
MDIO (OUTPUT)  
tMDCOH  
tMDCOV  
MDIO (INPUT)  
tMDIOS tMDCIH  
Figure 34. 10/100 Ethernet MAC Controller Timing: MII Station Management  
Rev. B  
| Page 49 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
OUTPUT DRIVE CURRENTS  
Figure 35 through Figure 46 show typical current-voltage char-  
acteristics for the output drivers of the processors. The curves  
represent the current drive capability of the output drivers as a  
function of output voltage. See Table 9 on Page 19 for informa-  
tion about which driver type corresponds to a particular pin.  
150  
100  
50  
VDDEX T = 2.25V @ 95°C  
VDD E XT = 2.50V @ 25°C  
VDDE XT = 2.75V @  
-40°C  
VOH  
120  
0
VDDE XT = 2.25V @ 95°C  
VDDE XT = 2.50V @ 25°C  
VDDE XT = 2.75V @ 40°C  
100  
80  
-50  
-
VOL  
60  
40  
20  
VOH  
-
100  
150  
-
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
SOURCE VOLTAGE (V)  
-20  
-
40  
VOL  
Figure 37. Drive Current B (Low VDDEXT  
)
-60  
-80  
200  
150  
-100  
3. 0  
0
0.5  
1.0  
1.5  
2.0  
2.5  
VDD E XT = 3.0V @ 95°C  
VDD E XT = 3.3V @ 25°C  
SOURCE VOLTAGE (V)  
VDDEX T = 3.6V @  
-40°C  
100  
50  
0
Figure 35. Drive Current A (Low VDDEXT  
)
VO H  
150  
100  
50  
VDDEX T = 3.0V @ 95°C  
DDEX T = 3.3V @ 25°C  
VDDEX T = 3.6V @ 40°C  
-50  
V
-
-100  
-150  
-200  
VOL  
VO H  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
SOURCE VOLTAGE (V)  
-50  
VOL  
Figure 38. Drive Current B (High VDDEXT  
)
-100  
-150  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
SOURCE VOLTAGE (V)  
Figure 36. Drive Current A (High VDDEXT  
)
Rev. B  
|
Page 50 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
80  
60  
150  
VDDE XT = 3.0V @ 95°C  
VDDEXT = 2.25V @ 95°C  
VDDEXT = 2.50V @ 25°C  
VDDE XT = 3.3V @ 25°C  
DD E XT = 3.6V @ 40°C  
100  
V
-
VDDEX T = 2.75V @ -40°C  
40  
20  
0
50  
0
VOH  
VOH  
-50  
VOL  
-20  
VOL  
-100  
-40  
-60  
-150  
0
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
SOURCE VOLTAGE (V)  
SOURCE VOLTAGE (V)  
Figure 39. Drive Current C (Low VDDEXT  
)
Figure 42. Drive Current D (High VDDEXT)  
100  
80  
50  
40  
30  
20  
10  
0
VDDEX T = 3.0V @ 95°C  
DDEX T = 3.3V @ 25°C  
VDD E XT = 3.6V @ 40°C  
VDDEX T = 2.25V @ 95°C  
DDEX T = 2.50V @ 25°C  
DDEX T = 2.75V @ 40°C  
V
V
-
V
-
60  
40  
VOH  
VOH  
20  
0
-
10  
20  
30  
40  
50  
-
20  
40  
60  
80  
-
-
-
VO L  
VOL  
-
-
-
-
3. 0  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
0.5  
1.0  
1.5  
2.0  
2.5  
SOURCE VOLTAGE (V)  
SOURCE VOLTAGE (V)  
Figure 40. Drive Current C (High VDDEXT  
)
Figure 43. Drive Current E (Low VDDEXT  
)
100  
80  
80  
60  
40  
VDDE XT = 2.25V @ 95°C  
VDDE XT = 2.50V @ 25°C  
VDDEX T = 3.0V @ 95°C  
DDEX T = 3.3V @ 25°C  
DD E XT = 3.6V @ 40°C  
VDDE XT = 2.75V @ -40°C  
V
60  
V
-
40  
VOH  
20  
0
20  
0
VO H  
-
20  
40  
60  
80  
-
20  
40  
60  
80  
-
-
VOL  
VOL  
-
-
-
-
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
4.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
SOURCE VOLTAGE (V)  
SOURCE VOLTAGE (V)  
Figure 41. Drive Current D (Low VDDEXT  
)
Figure 44. Drive Current E (High VDDEXT  
)
Rev. B  
|
Page 51 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
0
VDD E XT = 2.25V @ 95°C  
V
DD E XT = 2.50V @ 25°C  
40°C  
-
-
-
-
-
-
10  
VDDEX T = 2.75V @  
-
20  
30  
40  
50  
60  
VOL  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
SOURCE VOLTAGE (V)  
Figure 45. Drive Current F (Low VDDEXT  
)
0
VDDEX T = 3.0V @ 95°C  
DDEX T = 3.3V @ 25°C  
VDDEXT = 3.6V @ 40°C  
-
10  
20  
30  
40  
50  
60  
70  
80  
V
-
-
-
-
VOL  
-
-
-
-
4.0  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
SOURCE VOLTAGE (V)  
Figure 46. Drive Current F (High VDDEXT  
)
Rev. B  
|
Page 52 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
POWER DISSIPATION  
Total power dissipation has two components: one due to inter-  
nal circuitry (PINT) and one due to the switching of external  
output drivers (PEXT). Table 40 shows the power dissipation for  
internal circuitry (VDDINT).  
Many operating conditions can affect power dissipation. System  
designers should refer to EE-297: Estimating Power for the  
ADSP-BF534/BF536/BF537 Blackfin Processors.” This document  
will provide detailed information for optimizing your design for  
lowest power.  
Table 40. Internal Power Dissipation  
Test Conditions1  
fCCLK = 50 MHz  
DDINT = 0.8 V  
fCCLK = 400 MHz  
VDDINT =1.0 V  
fCCLK = 400 MHz  
VDDINT =1.2 V  
Parameter  
V
Unit  
mA  
mA  
mA  
μA  
2
IDDTYP  
26  
16  
14  
50  
30  
130  
30  
25  
50  
30  
160  
37  
31  
50  
30  
3, 4  
IDDSLEEP  
3
IDDDEEPSLEEP  
4
IDDHIBERNATE  
5
IDDRTC  
μA  
fCCLK = 250 MHz  
VDDINT =0.8 V  
fCCLK = 500 MHz  
VDDINT =1.2 V  
Parameter  
Unit  
mA  
mA  
mA  
μA  
2
IDDTYP  
65  
16  
14  
50  
30  
190  
37  
31  
50  
30  
3, 4  
IDDSLEEP  
3
IDDDEEPSLEEP  
4
IDDHIBERNATE  
5
IDDRTC  
μA  
fCCLK = 600 MHz  
VDDINT =1.2 V  
Parameter  
Unit  
mA  
mA  
mA  
μA  
2
IDDTYP  
220  
37  
31  
50  
30  
3, 4  
IDDSLEEP  
3
IDDDEEPSLEEP  
4
IDDHIBERNATE  
5
IDDRTC  
μA  
1 IDD data is specified for typical process parameters. All data at 25°C.  
2 Processor executing 75% dual MAC, 25% ADD with moderate data bus activity.  
3 See the ADSP-BF537 Blackfin Processor Hardware Reference Manual for definitions of sleep and deep sleep operating modes.  
4 IDDHIBERNATE is measured @ VDDEXT = 3.65 V with the core voltage regulator off (VDDINT = 0 V).  
5 Measured at VDDRTC = 3.3 V at 25°C.  
The external component of total power dissipation is caused by  
the switching of output pins. Its magnitude depends on:  
The frequency f includes driving the load high and then back  
low. For example: DATA15–0 pins can drive high and low at a  
maximum rate of 1÷(2
؋
tSCLK) while in SDRAM burst mode.  
• The output voltage swing (VDDEXT).  
• The output capacitance (C0) individual pins have to load.  
A typical power consumption can now be calculated for these  
conditions by adding a typical internal power dissipation:  
• The maximum frequency (f0) at which individual pins  
switch.  
Furthermore, because I/O activity is usually not constant over  
time, the external component of power dissipation is not a con-  
stant value. Its peak value is best estimated by identifying  
representative phases with the highest I/O activity and analyz-  
ing output switching pin by pin. The following formula  
calculates the average power for an analyzed period by accumu-  
lating the power of all output pins.  
PTOTAL = PEXT + (IDD × VDDINT  
)
Note that the conditions causing a worst-case PEXT differ from  
those causing a worst-case PINT. Maximum PINT cannot occur  
while 100% of the output pins are switching from all ones (1s) to  
all zeros (0s). Note, as well, that it is uncommon for an applica-  
tion to have 100% or even 50% of the outputs switching  
simultaneously.  
2
PEXT = VDDEXT  
×
C0 f0  
Rev. B  
| Page 53 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
TEST CONDITIONS  
All timing parameters appearing in this data sheet were  
measured under the conditions described in this section.  
REFERENCE  
SIGNAL  
Output Enable Time  
tDIS_MEASURED  
tENA_MEASURED  
Output pins are considered to be enabled when they have made  
a transition from a high impedance state to the point when they  
start driving. The output enable time tENA is the interval from  
the point when a reference signal reaches a high or low voltage  
level to the point when the output starts driving as shown in the  
Output Enable/Disable diagram (Figure 47). The time  
tENA_MEASURED is the interval from when the reference signal  
switches to when the output voltage reaches 2.0 V (output high)  
or 1.0 V (output low). Time tTRIP is the interval from when the  
output starts driving to when the output reaches the 1.0 V or  
2.0 V trip voltage. Time tENA is calculated as shown in  
the equation:  
tDIS  
VOH  
tENA  
VOH(MEASURED)  
(MEASURED)  
VOH (MEASURED) ؊ ⌬V  
VOL (MEASURED) + V  
VTRIP(HIGH)  
VTRIP(LOW)  
VOL  
VOL(MEASURED)  
(MEASURED)  
tDECAY  
tTRIP  
OUTPUT STOPS DRIVING  
OUTPUT STARTS DRIVING  
HIGH IMPEDANCE STATE  
Figure 47. Output Enable/Disable  
Example System Hold Time Calculation  
tENA = tENA_MEASURED tTRIP  
To determine the data output hold time in a particular system,  
first calculate tDECAY using the equation given above. Choose ΔV  
to be the difference between the processor’s output voltage and  
the input threshold for the device requiring the hold time. A  
typical ΔV is 0.4 V. CL is the total bus capacitance (per data line),  
and IL is the total leakage or three-state current (per data line).  
The hold time is tDECAY plus the minimum disable time (for  
example, tDSDAT for an SDRAM write cycle).  
If multiple pins (such as the data bus) are enabled, the measure-  
ment value is that of the first pin to start driving.  
Output Disable Time  
Output pins are considered to be disabled when they stop driv-  
ing, go into a high impedance state, and start to decay from their  
output high or low voltage. The time for the voltage on the bus  
to decay by ΔV is dependent on the capacitive load, CL and the  
load current, IL. This decay time can be approximated by  
the equation:  
50  
TO  
V
OUTPUT  
PIN  
LOAD  
30pF  
tDECAY = (CLΔV) ⁄ IL  
The output disable time tDIS is the difference between  
Figure 48. Equivalent Device Loading for AC Measurements  
(Includes All Fixtures)  
t
DIS_MEASURED and tDECAY as shown in Figure 47. The time  
DIS_MEASURED is the interval from when the reference signal  
t
switches to when the output voltage decays ΔV from the mea-  
sured output-high or output-low voltage. The time tDECAY is  
calculated with test loads CL and IL, and with ΔV equal to 0.5 V.  
INPUT  
OR  
OUTPUT  
V
V
MEAS  
MEAS  
Figure 49. Voltage Reference Levels for AC Measurements (Except  
Output Enable/Disable)  
Rev. B  
| Page 54 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Capacitive Loading  
Output delays and holds are based on standard capacitive loads:  
30 pF on all pins (see Figure 48). Figure 50 through Figure 59 on  
Page 57 show how output rise time varies with capacitance. The  
delay and hold specifications given should be derated by a factor  
derived from these figures. The graphs in these figures may not  
be linear outside the ranges shown.  
CLKOUT (CLKOUT DRIVER), V  
(MIN) = 2.25V, TEMPERATURE = 85°C  
DDEXT  
12  
10  
RISE TIME  
8
6
4
2
0
FALL TIME  
ABE0 (133 MHz DRIVER), V  
(MIN) = 2.25V, TEMPERATURE = 85°C  
DDEXT  
14  
12  
RISE TIME  
10  
FALL TIME  
8
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
6
4
Figure 52. Typical Output Delay or Hold for Driver B at VDDEXT Min  
2
0
CLKOUT (CLKOUT DRIVER), V  
(MAX) = 3.65V, TEMPERATURE = 85°C  
DDEXT  
10  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
9
8
7
Figure 50. Typical Output Delay or Hold for Driver A at VDDEXT Min  
RISE TIME  
6
5
FALL TIME  
ABE0 (133 MHz DRIVER), V  
(MAX) = 3.65V, TEMPERATURE = 85°C  
DDEXT  
12  
4
3
2
1
0
10  
8
RISE TIME  
FALL TIME  
6
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
4
Figure 53. Typical Output Delay or Hold for Driver B at VDDEXT Max  
2
0
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
Figure 51. Typical Output Delay or Hold for Driver A at VDDEXT Max  
Rev. B  
|
Page 55 of 68  
|
July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
PF9 (33 MHz DRIVER), V  
(MIN) = 2.25V, TEMPERATURE = 85°C  
DDEXT  
SCK (66 MHz DRIVER), V  
(MIN) = 2.25V, TEMPERATURE = 85°C  
DDEXT  
30  
25  
20  
15  
10  
5
18  
16  
14  
12  
10  
8
RISE TIME  
RISE TIME  
FALL TIME  
FALL TIME  
6
4
2
0
0
0
50  
100  
150  
200  
250  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
LOAD CAPACITANCE (pF)  
Figure 54. Typical Output Delay or Hold for Driver C at VDDEXT Min  
Figure 56. Typical Output Delay or Hold for Driver D at VDDEXT Min  
PF9 (33 MHz DRIVER), V  
(MAX) = 3.65V, TEMPERATURE = 85°C  
SCK (66 MHz DRIVER), V  
(MAX) = 3.65V, TEMPERATURE = 85°C  
DDEXT  
DDEXT  
14  
20  
18  
16  
14  
12  
10  
8
RISE TIME  
RISE TIME  
12  
10  
FALL TIME  
FALL TIME  
6
4
2
0
8
6
4
2
0
0
50  
100  
150  
200  
250  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
LOAD CAPACITANCE (pF)  
Figure 55. Typical Output Delay or Hold for Driver C at VDDEXT Max  
Figure 57. Typical Output Delay or Hold for Driver D at VDDEXT Max  
Rev. B  
|
Page 56 of 68  
|
July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
PH0 V  
(MIN) = 2.25V, TEMPERATURE = 85°C  
PH0 V  
(MAX) = 3.65V, TEMPERATURE = 85°C  
DDEXT  
DDEXT  
36  
36  
32  
32  
28  
28  
24  
20  
16  
12  
8
RISE TIME  
RISE TIME  
24  
20  
16  
12  
8
FALL TIME  
FALL TIME  
4
4
0
0
0
50  
100  
150  
200  
250  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
LOAD CAPACITANCE (pF)  
Figure 58. Typical Output Delay or Hold for Driver E at VDDEXT Min  
Figure 60. Typical Output Delay or Hold for Driver F at VDDEXT Min  
PH0 V  
(MAX) = 3.65V, TEMPERATURE = 85°C  
PH0 V  
(MAX) = 3.65V, TEMPERATURE = 85°C  
DDEXT  
DDEXT  
36  
32  
36  
32  
28  
24  
20  
16  
12  
8
28  
24  
20  
16  
12  
8
RISE TIME  
RISE TIME  
FALL TIME  
FALL TIME  
4
4
0
0
0
50  
100  
150  
200  
250  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
LOAD CAPACITANCE (pF)  
Figure 59. Typical Output Delay or Hold for Driver E at VDDEXT Max  
Figure 61. Typical Output Delay or Hold for Driver F at VDDEXT Max  
Rev. B  
|
Page 57 of 68  
|
July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Table 42. Thermal Characteristics (208-Ball BGA Without  
Thermal Vias in PCB)  
THERMAL CHARACTERISTICS  
To determine the junction temperature on the application  
printed circuit board use:  
Parameter Condition  
Typical Unit  
θJA  
0 linear m/s air flow  
23.30  
20.20  
19.20  
13.05  
6.92  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
TJ = TCASE + JT × PD)  
θJMA  
θJMA  
θJB  
1 linear m/s air flow  
2 linear m/s air flow  
where:  
TJ = Junction temperature (؇C)  
θJC  
T
CASE = Case temperature (؇C) measured by customer at top  
ΨJT  
ΨJT  
ΨJT  
0 linear m/s air flow  
1 linear m/s air flow  
2 linear m/s air flow  
0.18  
center of package.  
0.27  
ΨJT = From Table 41  
0.32  
PD = Power dissipation (see Power Dissipation on Page 53 for  
Table 43. Thermal Characteristics (208-Ball BGA with  
Thermal Vias in PCB)  
the method to calculate PD)  
Values of θJA are provided for package comparison and printed  
circuit board design considerations. θJA can be used for a first  
order approximation of TJ by the equation:  
Parameter Condition  
Typical Unit  
θJA  
0 linear m/s air flow  
22.60  
19.40  
18.40  
13.20  
6.85  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
θJMA  
θJMA  
θJB  
1 linear m/s air flow  
2 linear m/s air flow  
TJ = TA + JA × PD)  
where:  
θJC  
TA = Ambient temperature (؇C)  
ΨJT  
ΨJT  
ΨJT  
0 linear m/s air flow  
1 linear m/s air flow  
2 linear m/s air flow  
0.16  
Values of θJC are provided for package comparison and printed  
circuit board design considerations when an external heat sink  
is required.  
0.27  
0.32  
Values of θJB are provided for package comparison and printed  
circuit board design considerations.  
In Table 41 through Table 43, airflow measurements comply  
with JEDEC standards JESD51-2 and JESD51-6, and the junc-  
tion-to-board measurement complies with JESD51-8. Test  
board and thermal via design comply with JEDEC standards  
JESD51-9 (BGA). The junction-to-case measurement complies  
with MIL-STD-883 (Method 1012.1). All measurements use a  
2S2P JEDEC test board.  
Industrial applications using the 208-ball BGA package require  
thermal vias, to an embedded ground plane, in the PCB. Refer to  
JEDEC standard JESD51-9 for printed circuit board thermal  
ball land and thermal via design information.  
Table 41. Thermal Characteristics (182-Ball BGA)  
Parameter Condition  
Typical Unit  
θJA  
0 linear m/s air flow  
32.80  
29.30  
28.00  
20.10  
7.92  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
θJMA  
θJMA  
θJB  
1 linear m/s air flow  
2 linear m/s air flow  
θJC  
ΨJT  
ΨJT  
ΨJT  
0 linear m/s air flow  
1 linear m/s air flow  
2 linear m/s air flow  
0.19  
0.35  
0.45  
Rev. B  
| Page 58 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
182-BALL MINI-BGA PINOUT  
Table 44 lists the mini-BGA pinout by signal mnemonic.  
Table 45 on Page 60 lists the mini-BGA pinout by ball number.  
Table 44. 182-Ball Mini-BGA Ball Assignment (Alphabetically by Signal Mnemonic)  
Mnemonic Ball No. Mnemonic Ball No. Mnemonic Ball No. Mnemonic Ball No.  
Mnemonic Ball No.  
ABE0  
H13  
H12  
J14  
CLKOUT  
DATA0  
DATA1  
DATA10  
DATA11  
DATA12  
DATA13  
DATA14  
DATA15  
DATA2  
DATA3  
DATA4  
DATA5  
DATA6  
DATA7  
DATA8  
DATA9  
EMU  
B14  
M9  
N9  
N6  
P6  
GND  
GND  
GND  
GND  
GND  
GND  
NMI  
PF0  
L6  
PG8  
PG9  
PH0  
PH1  
PH10  
PH11  
PH12  
PH13  
PH14  
PH15  
PH2  
PH3  
PH4  
PH5  
PH6  
PH7  
PH8  
PH9  
PJ0  
E3  
SRAS  
D13  
D12  
P2  
ABE1  
L8  
E4  
SWE  
ADDR1  
ADDR10  
ADDR11  
ADDR12  
ADDR13  
ADDR14  
ADDR15  
ADDR16  
ADDR17  
ADDR18  
ADDR19  
ADDR2  
ADDR3  
ADDR4  
ADDR5  
ADDR6  
ADDR7  
ADDR8  
ADDR9  
AMS0  
L10  
M4  
M10  
P14  
B10  
M1  
L1  
C2  
TCK  
M13  
M14  
N14  
N13  
N12  
M11  
N11  
P13  
P12  
P11  
K14  
L14  
J13  
C3  
TDI  
M3  
N3  
B6  
TDO  
M5  
N5  
P5  
A2  
A3  
A4  
A5  
A6  
C4  
TMS  
N2  
TRST  
N1  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDRTC  
VROUT0  
VROUT1  
XTAL  
A1  
P4  
PF1  
C12  
E6  
P9  
PF10  
PF11  
PF12  
PF13  
PF14  
PF15  
PF2  
J2  
M8  
N8  
P8  
J3  
E11  
F4  
H1  
H2  
H3  
H4  
L2  
C5  
C6  
F12  
H5  
M7  
N7  
P7  
B1  
B2  
H10  
J11  
J12  
K7  
B3  
K13  
L13  
K12  
L12  
M12  
E14  
F14  
F13  
G12  
G13  
E13  
G14  
H14  
P10  
N10  
N4  
M6  
M2  
A10  
A14  
D4  
E7  
PF3  
L3  
B4  
PF4  
L4  
B5  
GND  
PF5  
K1  
K2  
K3  
K4  
J1  
C7  
K9  
GND  
PF6  
PJ1  
B7  
L7  
GND  
PF7  
PJ10  
PJ11  
PJ2  
D10  
D11  
B11  
C11  
D7  
D8  
C8  
L9  
GND  
PF8  
L11  
P1  
AMS1  
GND  
E9  
PF9  
AMS2  
GND  
F5  
PG0  
PG1  
PG10  
PG11  
PG12  
PG13  
PG14  
PG15  
PG2  
PG3  
PG4  
PG5  
PG6  
PG7  
G1  
G2  
D1  
D2  
D3  
D5  
D6  
C1  
G3  
F1  
PJ3  
E5  
AMS3  
GND  
F6  
PJ4  
E8  
AOE  
GND  
F10  
F11  
G4  
G5  
G11  
H11  
J4  
PJ5  
E10  
G10  
K5  
ARDY  
GND  
PJ6  
ARE  
GND  
PJ7  
B8  
AWE  
GND  
PJ8  
D9  
C9  
K8  
BG  
GND  
PJ9  
K10  
B9  
BGH  
GND  
RESET  
RTXO  
RTXI  
SA10  
SCAS  
SCKE  
SMS  
C10  
A8  
A9  
E12  
C14  
B13  
C13  
BMODE0  
BMODE1  
BMODE2  
BR  
GND  
A13  
B12  
A11  
P3  
GND  
J5  
L5  
GND  
J9  
F2  
D14  
A7  
GND  
J10  
K6  
F3  
CLKBUF  
CLKIN  
GND  
E1  
A12  
GND  
K11  
E2  
Rev. B  
|
Page 59 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Table 45. 182-Ball Mini-BGA Ball Assignment (Numerically by Ball Number)  
Ball No.  
A1  
Mnemonic Ball No.  
Mnemonic Ball No.  
Mnemonic Ball No.  
Mnemonic Ball No.  
Mnemonic  
DATA0  
GND  
VDDEXT  
PH11  
PH12  
PH13  
PH14  
PH15  
CLKBUF  
RTXO  
RTXI  
C10  
C11  
C12  
C13  
C14  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
D9  
D10  
D11  
D12  
D13  
D14  
E1  
RESET  
PJ3  
F5  
GND  
J14  
K1  
ADDR1  
PF5  
M9  
M10  
M11  
M12  
M13  
M14  
N1  
A2  
F6  
GND  
A3  
VDDEXT  
SMS  
F10  
F11  
F12  
F13  
F14  
G1  
GND  
K2  
PF6  
ADDR15  
ADDR9  
ADDR10  
ADDR11  
TRST  
A4  
GND  
K3  
PF7  
A5  
SCAS  
PG10  
PG11  
PG12  
GND  
PG13  
PG14  
PJ4  
VDDEXT  
AMS2  
AMS1  
PG0  
K4  
PF8  
A6  
K5  
VDDINT  
GND  
A7  
K6  
A8  
K7  
VDDEXT  
VDDINT  
VDDEXT  
VDDINT  
GND  
N2  
TMS  
A9  
G2  
PG1  
K8  
N3  
TDO  
A10  
A11  
A12  
A13  
A14  
B1  
GND  
XTAL  
CLKIN  
VROUT0  
GND  
PH5  
G3  
PG2  
K9  
N4  
BMODE0  
DATA13  
DATA10  
DATA7  
DATA4  
DATA1  
BGH  
G4  
GND  
K10  
K11  
K12  
K13  
K14  
L1  
N5  
G5  
GND  
N6  
PJ5  
G10  
G11  
G12  
G13  
G14  
H1  
VDDINT  
GND  
ADDR7  
ADDR5  
ADDR2  
PF1  
N7  
PJ8  
N8  
PJ10  
AMS3  
AOE  
N9  
B2  
PH6  
PJ11  
N10  
N11  
N12  
N13  
N14  
P1  
B3  
PH7  
SWE  
ARE  
L2  
PF2  
ADDR16  
ADDR14  
ADDR13  
ADDR12  
VDDEXT  
TCK  
B4  
PH8  
SRAS  
BR  
PF12  
PF13  
PF14  
PF15  
VDDEXT  
VDDEXT  
GND  
L3  
PF3  
B5  
PH9  
H2  
L4  
PF4  
B6  
PH10  
PJ1  
PG6  
H3  
L5  
BMODE2  
GND  
B7  
E2  
PG7  
H4  
L6  
B8  
PJ7  
E3  
PG8  
H5  
L7  
VDDEXT  
GND  
P2  
B9  
VDDRTC  
NMI  
E4  
PG9  
H10  
H11  
H12  
H13  
H14  
J1  
L8  
P3  
BMODE1  
DATA15  
DATA14  
DATA11  
DATA8  
DATA5  
DATA2  
BG  
B10  
B11  
B12  
B13  
B14  
C1  
E5  
VDDINT  
VDDEXT  
GND  
VDDINT  
GND  
VDDINT  
VDDEXT  
SA10  
ARDY  
AMS0  
PG3  
L9  
VDDEXT  
GND  
P4  
PJ2  
E6  
ABE1  
ABE0  
AWE  
L10  
L11  
L12  
L13  
L14  
M1  
M2  
M3  
M4  
M5  
M6  
M7  
M8  
P5  
VROUT1  
SCKE  
CLKOUT  
PG15  
PH0  
E7  
VDDEXT  
ADDR8  
ADDR6  
ADDR3  
PF0  
P6  
E8  
P7  
E9  
PF9  
P8  
E10  
E11  
E12  
E13  
E14  
F1  
J2  
PF10  
PF11  
GND  
P9  
C2  
J3  
P10  
P11  
P12  
P13  
P14  
C3  
PH1  
J4  
EMU  
ADDR19  
ADDR18  
ADDR17  
GND  
C4  
PH2  
J5  
GND  
TDI  
C5  
PH3  
J9  
GND  
GND  
C6  
PH4  
J10  
J11  
J12  
J13  
GND  
DATA12  
DATA9  
DATA6  
DATA3  
C7  
PJ0  
F2  
PG4  
VDDEXT  
VDDEXT  
ADDR4  
C8  
PJ6  
F3  
PG5  
C9  
PJ9  
F4  
VDDEXT  
Rev. B  
| Page 60 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Figure 63 shows the top view of the mini-BGA ball configura-  
tion. Figure 62 shows the bottom view of the mini-BGA  
ball configuration.  
1
2
3
4
5
6
7
8
9
10 11 12 13 14  
14 13 12 11 10  
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
A
B
C
D
E
F
G
H
J
G
H
J
K
L
K
L
M
N
P
M
N
P
KEY:  
KEY:  
VDDINT  
VDDEXT  
VDDRTC  
VROUT  
VDDINT  
VDDRTC  
VROUT  
GND  
I/O  
GND  
I/O  
VDDEXT  
Figure 62. 182-Ball Mini-BGA Configuration (Top View)  
Figure 63. 182-Ball Mini-BGA Configuration (Bottom View)  
Rev. B  
| Page 61 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
208-BALL SPARSE MINI-BGA PINOUT  
Table 46 lists the sparse mini-BGA pinout by signal mnemonic.  
Table 47 on Page 63 lists the sparse mini-BGA pinout by ball  
number.  
Table 46. 208-Ball Sparse Mini-BGA Ball Assignment (Alphabetically by Signal Mnemonic)  
Mnemonic Ball No.  
Mnemonic Ball No.  
Mnemonic Ball No.  
Mnemonic Ball No.  
Mnemonic Ball No.  
ABE0  
P19  
P20  
R19  
W18  
Y18  
W17  
Y17  
W16  
Y16  
W15  
Y15  
W14  
Y14  
T20  
T19  
U20  
U19  
V20  
V19  
W20  
Y19  
M20  
M19  
G20  
G19  
N20  
J19  
DATA12  
DATA13  
DATA14  
DATA15  
DATA2  
DATA3  
DATA4  
DATA5  
DATA6  
DATA7  
DATA8  
DATA9  
EMU  
Y4  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
NMI  
PF0  
M13  
N9  
N10  
N11  
N12  
N13  
P11  
V2  
PG6  
PG7  
PG8  
PG9  
PH0  
PH1  
PH10  
PH11  
PH12  
PH13  
PH14  
PH15  
PH2  
PH3  
PH4  
PH5  
PH6  
PH7  
PH8  
PH9  
PJ0  
E2  
TDI  
V1  
ABE1  
W4  
Y3  
D1  
TDO  
Y2  
ADDR1  
ADDR10  
ADDR11  
ADDR12  
ADDR13  
ADDR14  
ADDR15  
ADDR16  
ADDR17  
ADDR18  
ADDR19  
ADDR2  
ADDR3  
ADDR4  
ADDR5  
ADDR6  
ADDR7  
ADDR8  
ADDR9  
AMS0  
D2  
TMS  
U2  
W3  
Y9  
C1  
TRST  
U1  
B4  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDRTC  
VROUT0  
VROUT1  
XTAL  
G7  
W9  
Y8  
A5  
G8  
B9  
G9  
W8  
Y7  
A10  
B10  
A11  
B11  
A12  
B5  
G10  
H7  
W2  
W19  
Y1  
W7  
Y6  
H8  
J7  
W6  
T1  
Y13  
Y20  
C20  
T2  
J8  
K7  
GND  
A1  
A6  
K8  
GND  
A13  
A20  
B2  
B6  
L7  
GND  
PF1  
R1  
A7  
L8  
GND  
PF10  
PF11  
PF12  
PF13  
PF14  
PF15  
PF2  
L2  
B7  
M7  
M8  
N7  
GND  
G11  
H9  
K1  
A8  
GND  
K2  
B8  
GND  
H10  
H11  
H12  
H13  
J9  
J1  
A9  
N8  
GND  
J2  
B12  
B13  
B19  
C19  
D19  
E19  
B18  
A19  
B15  
B16  
B17  
B20  
D20  
A15  
A14  
L20  
K20  
H20  
J20  
K19  
L19  
W1  
P7  
GND  
H1  
R2  
PJ1  
P8  
AMS1  
GND  
PJ10  
PJ11  
PJ2  
P9  
AMS2  
GND  
PF3  
P1  
P10  
G12  
G13  
G14  
H14  
J14  
K14  
L14  
M14  
N14  
P12  
P13  
P14  
A16  
E20  
F20  
A17  
AMS3  
GND  
J10  
J11  
J12  
J13  
K9  
PF4  
P2  
AOE  
GND  
PF5  
N1  
N2  
M1  
M2  
L1  
PJ3  
ARDY  
GND  
PF6  
PJ4  
ARE  
N19  
R20  
Y11  
Y12  
W13  
W12  
W11  
F19  
B14  
A18  
H19  
Y10  
W10  
Y5  
GND  
PF7  
PJ5  
AWE  
GND  
PF8  
PJ6  
BG  
GND  
K10  
K11  
K12  
K13  
L9  
PF9  
PJ7  
BGH  
GND  
PG0  
H2  
G1  
C2  
PJ8  
BMODE0  
BMODE1  
BMODE2  
BR  
GND  
PG1  
PJ9  
GND  
PG10  
PG11  
PG12  
PG13  
PG14  
PG15  
PG2  
RESET  
RTXO  
RTXI  
SA10  
SCAS  
SCKE  
SMS  
SRAS  
SWE  
TCK  
GND  
B1  
GND  
L10  
L11  
L12  
L13  
M9  
M10  
M11  
M12  
A2  
A3  
B3  
CLKBUF  
CLKIN  
GND  
GND  
CLKOUT  
DATA0  
DATA1  
DATA10  
DATA11  
GND  
A4  
G2  
F1  
GND  
GND  
PG3  
GND  
PG4  
F2  
W5  
GND  
PG5  
E1  
Rev. B  
| Page 62 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Table 47 lists the sparse mini-BGA pinout by ball number.  
Table 46 on Page 62 lists the sparse mini-BGA pinout by signal  
mnemonic.  
Table 47. 208-Ball Sparse Mini-BGA Ball Assignment (Numerically by Ball Number)  
Ball No.  
A1  
Mnemonic Ball No.  
Mnemonic Ball No.  
Mnemonic Ball No.  
Mnemonic Ball No.  
Mnemonic  
TCK  
GND  
PG12  
PG13  
PG15  
PH1  
C19  
C20  
D1  
PJ11  
J9  
GND  
M19  
M20  
N1  
AMS1  
AMS0  
PF5  
W1  
W2  
W3  
W4  
W5  
W6  
W7  
W8  
W9  
W10  
W11  
W12  
W13  
W14  
W15  
W16  
W17  
W18  
W19  
W20  
Y1  
A2  
NMI  
J10  
J11  
J12  
J13  
J14  
J19  
J20  
K1  
GND  
GND  
A3  
PG7  
GND  
DATA15  
DATA13  
DATA11  
DATA9  
DATA7  
DATA5  
DATA3  
DATA1  
BMODE2  
BMODE1  
BMODE0  
ADDR18  
ADDR16  
ADDR14  
ADDR12  
ADDR10  
GND  
A4  
D2  
PG8  
GND  
N2  
PF6  
A5  
D19  
D20  
E1  
PJ2  
GND  
N7  
VDDEXT  
VDDEXT  
GND  
A6  
PH3  
RESET  
PG5  
VDDINT  
ARDY  
SMS  
N8  
A7  
PH5  
N9  
A8  
PH7  
E2  
PG6  
N10  
N11  
N12  
N13  
N14  
N19  
N20  
P1  
GND  
A9  
PH9  
E19  
E20  
F1  
PJ3  
PF11  
GND  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
A17  
A18  
A19  
A20  
B1  
PH11  
PH13  
PH15  
GND  
RTXI  
RTXO  
VDDRTC  
XTAL  
CLKIN  
PJ5  
VROUT0  
PG3  
K2  
PF12  
GND  
K7  
VDDEXT  
VDDEXT  
GND  
GND  
F2  
PG4  
K8  
VDDINT  
ARE  
F19  
F20  
G1  
BR  
K9  
VROUT1  
PG1  
K10  
K11  
K12  
K13  
K14  
K19  
K20  
L1  
GND  
AOE  
GND  
PF3  
G2  
PG2  
GND  
P2  
PF4  
G7  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
GND  
GND  
P7  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
GND  
G8  
VDDINT  
SRAS  
SCAS  
PF9  
P8  
G9  
P9  
GND  
PG11  
GND  
PG14  
PH0  
G10  
G11  
G12  
G13  
G14  
G19  
G20  
H1  
P10  
P11  
P12  
P13  
P14  
P19  
P20  
R1  
ADDR8  
GND  
B2  
VDDINT  
VDDINT  
VDDINT  
AMS3  
AMS2  
PF15  
L2  
PF10  
VDDINT  
VDDINT  
VDDINT  
ABE0  
Y2  
TDO  
B3  
L7  
VDDEXT  
VDDEXT  
GND  
Y3  
DATA14  
DATA12  
DATA10  
DATA8  
DATA6  
DATA4  
DATA2  
DATA0  
BG  
B4  
L8  
Y4  
B5  
PH2  
L9  
Y5  
B6  
PH4  
L10  
L11  
L12  
L13  
L14  
L19  
L20  
M1  
M2  
M7  
M8  
M9  
M10  
M11  
M12  
M13  
M14  
GND  
ABE1  
Y6  
B7  
PH6  
GND  
PF1  
Y7  
B8  
PH8  
H2  
PG0  
GND  
R2  
PF2  
Y8  
B9  
PH10  
PH12  
PH14  
PJ0  
H7  
VDDEXT  
VDDEXT  
GND  
GND  
R19  
R20  
T1  
ADDR1  
AWE  
Y9  
B10  
B11  
B12  
B13  
B14  
B15  
B16  
B17  
B18  
B19  
B20  
C1  
H8  
VDDINT  
SWE  
Y10  
Y11  
Y12  
Y13  
Y14  
Y15  
Y16  
Y17  
Y18  
Y19  
Y20  
H9  
EMU  
H10  
H11  
H12  
H13  
H14  
H19  
H20  
J1  
GND  
SA10  
PF7  
T2  
PF0  
BGH  
PJ1  
GND  
T19  
T20  
U1  
ADDR3  
ADDR2  
TRST  
GND  
CLKBUF  
PJ6  
GND  
PF8  
ADDR19  
ADDR17  
ADDR15  
ADDR13  
ADDR11  
ADDR9  
GND  
GND  
VDDEXT  
VDDEXT  
GND  
PJ7  
VDDINT  
CLKOUT  
SCKE  
U2  
TMS  
PJ8  
U19  
U20  
V1  
ADDR5  
ADDR4  
TDI  
PJ4  
GND  
PJ10  
PJ9  
PF13  
GND  
J2  
PF14  
GND  
V2  
GND  
PG9  
J7  
VDDEXT  
VDDEXT  
GND  
V19  
V20  
ADDR7  
ADDR6  
C2  
PG10  
J8  
VDDINT  
Rev. B  
| Page 63 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Figure 64 shows the top view of the sparse mini-BGA ball con-  
figuration. Figure 65 shows the bottom view of the sparse mini-  
BGA ball configuration.  
20 19 18 17 16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20  
A
B
C
D
E
F
A
B
C
D
E
F
G
H
J
G
H
J
K
L
K
L
M
N
P
R
M
N
P
R
T
T
U
V
U
V
W
Y
W
Y
KEY:  
KEY:  
V
V
V
GND  
I/O  
DDINT  
DDRTC  
ROUT  
V
V
V
GND  
I/O  
DDINT  
DDRTC  
V
DDEXT  
V
DDEXT  
ROUT  
Figure 65. 208-Ball Mini-BGA Configuration (Bottom View)  
Figure 64. 208-Ball Mini-BGA Configuration (Top View)  
Rev. B  
|
Page 64 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
OUTLINE DIMENSIONS  
Dimensions in Figure 66 and Figure 67 are shown in  
millimeters.  
A1 CORNER  
INDEX AREA  
12.00 BSC SQ  
13  
14 12 10  
9
7
5
3
1
11  
8
6
4
2
A
B
C
D
E
F
G
H
J
PIN A1  
INDICATOR  
10.40  
BSC  
SQ  
LOCATION  
K
L
M
N
P
0.80  
BSC  
TYP  
TOP VIEW  
1.70  
1.56  
1.35  
BOTTOM VIEW  
DETAIL A  
1.31  
1.21  
1.10  
0.35 NOM  
0.25 MIN  
NOTES:  
0.50  
0.45  
0.40  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. COMPLIANT TO JEDEC STANDARD MO-205-AE,  
EXCEPT FOR BALL DIAMETER.  
0.12  
COPLANARITY  
SEATING  
PLANE  
(BALL  
DIAMETER)  
3. CENTER DIMENSIONS ARE NOMINAL.  
4. THE ACTUAL POSITION OF THE BALL GRID IS  
WITHIN 0.15 OF ITS IDEAL POSITION RELATIVE  
TO THE PACKAGE EDGES.  
DETAIL A  
Figure 66. 182-Ball Mini-BGA (BC-182)  
A1 CORNER  
INDEX AREA  
17.00 BSC SQ  
20 18 16 14 12 10  
19 17 15 13 11  
8
6
4
2
9
7
5
3 1  
A
B
C
D
E
F
PIN A1  
INDICATOR  
15.20  
BSC  
SQ  
G
H
J
LOCATION  
K
L
M
N
P
R
T
U
V
W
Y
0.80  
BSC  
TYP  
BOTTOM VIEW  
TOP VIEW  
1.70  
1.56  
1.35  
1.31  
1.21  
1.10  
DETAIL A  
0.35 NOM  
0.25 MIN  
NOTES:  
0.50  
0.45  
0.40  
(BALL  
DIAMETER)  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. COMPLIANT TO JEDEC STANDARD MO-205-AM,  
EXCEPT FOR BALL DIAMETER.  
3. CENTER DIMENSIONS ARE NOMINAL.  
4. THE ACTUAL POSITION OF THE BALL GRID IS  
WITHIN 0.15 OF ITS IDEAL POSITION RELATIVE  
TO THE PACKAGE EDGES.  
0.12  
COPLANARITY  
SEATING  
PLANE  
DETAIL A  
Figure 67. 208-Ball Sparse Mini-BGA (BC-208-2)  
Rev. B  
| Page 65 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
SURFACE MOUNT DESIGN  
The following table is provided as an aide to PCB design. For  
industry-standard design recommendations, refer to IPC-7351,  
Generic Requirements for Surface Mount Design and Land Pat-  
tern Standard.  
Package  
Ball Attach Type  
Solder Mask Opening  
0.40 mm diameter  
0.40 mm diameter  
Ball Pad Size  
182-Ball Mini-BGA (BC-182)  
208-Ball Sparse Mini-BGA (BC-208-2)  
Solder Mask Defined  
Solder Mask Defined  
0.55 mm diameter  
0.55 mm diameter  
ORDERING GUIDE  
Temperature  
Range1  
Speed Grade  
(Max)  
Package  
Model  
Operating Voltage (Nominal)  
Package Description  
Option  
BC-182  
BC-182  
BC-182  
BC-182  
ADSP-BF534BBC-4A  
ADSP-BF534BBCZ-4A2  
ADSP-BF534BBC-5A  
ADSP-BF534BBCZ-5A2  
ADSP-BF534BBCZ-4B2  
ADSP-BF534BBCZ-5B2  
ADSP-BF534YBCZ-4B2  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
400 MHz  
400 MHz  
500 MHz  
500 MHz  
400 MHz  
500 MHz  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.26 V internal, 2.5 V or 3.3 V I/O  
1.26 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.26 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.26 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.26 V internal, 2.5 V or 3.3 V I/O  
1.26 V internal, 2.5 V or 3.3 V I/O  
1.26 V internal, 2.5 V or 3.3 V I/O  
1.26 V internal, 2.5 V or 3.3 V I/O  
1.26 V internal, 2.5 V or 3.3 V I/O  
1.26 V internal, 2.5 V or 3.3 V I/O  
182-Ball Mini-BGA  
182-Ball Mini-BGA  
182-Ball Mini-BGA  
182-Ball Mini-BGA  
208-Ball Sparse Mini-BGA BC-208-2  
208-Ball Sparse Mini-BGA BC-208-2  
208-Ball Sparse Mini-BGA BC-208-2  
208-Ball Sparse Mini-BGA BC-208-2  
–40°C to +105°C 400 MHz  
ADSP-BF534WYBCZ-4B2, 3 –40°C to +105°C 400 MHz  
ADSP-BF534WBBCZ-4A2, 3 –40°C to +85°C  
ADSP-BF534WBBCZ-4B2, 3 –40°C to +85°C  
ADSP-BF534WBBCZ-5B2, 3 –40°C to +85°C  
400 MHz  
400 MHz  
500 MHz  
300 MHz  
300 MHz  
400 MHz  
400 MHz  
300 MHz  
400 MHz  
500 MHz  
500 MHz  
600 MHz  
600 MHz  
500 MHz  
600 MHz  
182-Ball Mini-BGA  
BC-182  
208-Ball Sparse Mini-BGA BC-208-2  
208-Ball Sparse Mini-BGA BC-208-2  
ADSP-BF536BBC-3A  
ADSP-BF536BBCZ-3A2  
ADSP-BF536BBC-4A  
ADSP-BF536BBCZ-4A2  
ADSP-BF536BBCZ-3B2  
ADSP-BF536BBCZ-4B2  
ADSP-BF537BBC-5A  
ADSP-BF537BBCZ-5A2  
ADSP-BF537KBC-6A  
ADSP-BF537KBCZ-6A2  
ADSP-BF537BBCZ-5B2  
ADSP-BF537KBCZ-6B2  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
0°C to 70°C  
182-Ball Mini-BGA  
182-Ball Mini-BGA  
182-Ball Mini-BGA  
182-Ball Mini-BGA  
BC-182  
BC-182  
BC-182  
BC-182  
208-Ball Sparse Mini-BGA BC-208-2  
208-Ball Sparse Mini-BGA BC-208-2  
182-Ball Mini-BGA  
182-Ball Mini-BGA  
182-Ball Mini-BGA  
182-Ball Mini-BGA  
BC-182  
BC-182  
BC-182  
BC-182  
0°C to 70°C  
–40°C to +85°C  
0°C to 70°C  
208-Ball Sparse Mini-BGA BC-208-2  
208-Ball Sparse Mini-BGA BC-208-2  
1 Referenced temperature is ambient temperature.  
2 Z = Pb-free part.  
3 The W in the model number signifies that a version of this product is available for use in automotive applications. Contact your local ADI sales office for complete ordering  
information.  
Rev. B  
| Page 66 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
Rev. B  
| Page 67 of 68 | July 2006  
ADSP-BF534/ADSP-BF536/ADSP-BF537  
©2006 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D05317-0-6/06(B)  
Rev. B  
| Page 68 of 68 | July 2006  

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