ADSP-BF538_技术文档

Blackfin^®

Embedded Processor

a

Preliminary Technical Data

FEATURES

Up to 500 MHz high performance Blackfin processor

Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,

40-bit shifter

ADSP-BF538/ADSP-BF538F

Memory management unit providing memory protection

External memory controller with glueless support

for SDRAM, SRAM, flash, and ROM

Flexible memory booting options from SPI^®and external

memory

RISC-like register and instruction model for ease of pro-

gramming and compiler friendly support

PERIPHERALS

Advanced debug, trace, and performance monitoring

0.8 V to 1.2 V core V_DDwith on-chip voltage regulation

3.3 V tolerant I/O with specific 5 V tolerant pins

316-ball Pb-free mini-BGA package

Parallel peripheral interface (PPI/GPIO)

supporting ITU-R 656 video data formats

Four dual-channel, full-duplex synchronous serial ports, sup-

porting 16 stereo I²S^®channels

Two DMA controllers supporting 26 DMA channels

Controller area network (CAN) 2.0B controller

Three SPI-compatible ports

Three timer/counters with PWM support

Three UARTs with support for IrDA^®

Two TWI controllers compatible with I²C^®industry standard

Up to 54 general-purpose I/O pins (GPIO)

Real time clock, watchdog timer, and core timer

On-chip PLL capable of 0.5x To 64x frequency multiplication

Debug/JTAG interface

MEMORY

148K bytes of on-chip memory:

16K bytes of instruction SRAM/cache

64K bytes of instruction SRAM

32K bytes of data SRAM

32K bytes of data SRAM/cache

4K bytes of scratchpad SRAM

512K bytes or 1M byte of flash memory (ADSP-BF538F parts

only)

Four dual-channel memory DMA controllers

JTAG TEST AND EMULATION

VOLTAGE REGULATOR

INTERRUPT

WATCHDOG

CONTROLLER

TIMER

B

TWI0-1

RTC

CAN 2.0B

GPIO

PORT

C

L1

DATA

MEMORY

PPI

GPIO

SPI1-2

INSTRUCTION

MEMORY

GPIO

PORT

F

TIMER0-2

SPI0

DMA CORE

BUS 1

DMA ACCESS

BUS 1

GPIO

PORT

D

DMA ACCESS

BUS 0

DMA CORE

BUS 0

UART1-2

UART0

SPORT0-1

DMA

CONTROLLER1

GPIO

PORT

E

EXTERNAL PORT

FLASH, SDRAM CONTROL

DMA

CONTROLLER0

SPORT2-3

DMA

EXTERNAL

BUS 1

DMA

EXTERNAL

BUS 0

512 KB OR 1 MB

FLASH MEMORY

BOOT ROM

(ADSP-BF538F ONLY)

Figure 1. Functional Block Diagram

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Rev. PrD

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Tel: 781.329.4700

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www.analog.com

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

TABLE OF CONTENTS

Operating Conditions ........................................... 22

Operating Conditions—Applies to 5V Tolerant pins .... 22

Electrical Characteristics ....................................... 22

Absolute Maximum Ratings ................................... 23

Package Information ............................................ 23

ESD Sensitivity ................................................... 23

Timing Specifications ........................................... 24

Clock and Reset Timing ..................................... 24

Asynchronous Memory Read Cycle Timing ............ 25

Asynchronous Memory Write Cycle Timing ........... 27

SDRAM Interface Timing .................................. 29

External Port Bus Request and Grant Cycle Timing .. 30

Parallel Peripheral Interface Timing ...................... 32

Serial Port Timing ............................................ 35

Serial Peripheral Interface Port—Master Timing ...... 39

Serial Peripheral Interface Port—Slave Timing ........ 40

General-Purpose Port Timing ............................. 41

Timer Cycle Timing .......................................... 42

JTAG Test And Emulation Port Timing ................. 43

Output Drive Currents ......................................... 44

Power Dissipation ............................................... 46

Test Conditions .................................................. 46

Thermal Characteristics ........................................ 50

316-Ball Mini-BGA Pinout ....................................... 51

Outline Dimensions ................................................ 54

Surface Mount Design .......................................... 55

Ordering Guide ..................................................... 55

General Description ................................................. 3

Low Power Architecture ......................................... 3

System Integration ................................................ 3

ADSP-BF538/ADSP-BF538F Processor Peripherals ....... 3

Blackfin Processor Core .......................................... 4

Memory Architecture ............................................ 5

DMA Controllers .................................................. 8

Real Time Clock ................................................... 9

Watchdog Timer .................................................. 9

Timers ............................................................... 9

Serial Ports (SPORTs) .......................................... 10

Serial Peripheral Interface (SPI) Ports ...................... 10

Two Wire Interface ............................................. 10

UART Ports ...................................................... 10

General-Purpose Ports ......................................... 11

Parallel Peripheral Interface ................................... 11

Controller Area Network (CAN) Interface ................ 12

Dynamic Power Management ................................ 12

Voltage Regulation .............................................. 14

Clock Signals ..................................................... 14

Booting Modes ................................................... 15

Instruction Set Description ................................... 15

Development Tools ............................................. 16

Designing an Emulator Compatible Processor Board ... 17

Voltage Regulator Layout Guidelines ....................... 17

Pin Descriptions .................................................... 18

Specifications ........................................................ 22

REVISION HISTORY

5/06—Revision PrD:

For this revision, the following sections were changed.

Functional Block Diagram ......................................... 1

Booting Modes ...................................................... 15

Pin Descriptions .................................................... 18

Output Drive Currents ............................................ 44

Power Dissipation .................................................. 46

Test Conditions ..................................................... 46

316-Ball Mini-BGA Pinout ....................................... 51

Rev. PrD

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Preliminary Technical Data

GENERAL DESCRIPTION

The ADSP-BF538/ADSP-BF538F processors are members of

the Blackfin family of products, incorporating the Analog

Devices/Intel Micro Signal Architecture (MSA). Blackfin pro-

cessors combine a dual-MAC state-of-the-art signal processing

engine, the advantages of a clean, orthogonal RISC-like micro-

processor instruction set, and single-instruction, multiple-data

(SIMD) multimedia capabilities into a single instruction set

architecture.

ADSP-BF538/ADSP-BF538F

substantial reduction in power consumption, compared with

just varying the frequency of operation. This translates into

longer battery life and lower heat dissipation.

SYSTEM INTEGRATION

The ADSP-BF538/ADSP-BF538F processors are highly inte-

grated system-on-a-chip solution for the next generation of

consumer and industrial applications including audio and video

signal processing. By combining advanced memory configura-

tions, such as on-chip flash memory, with industry-standard

interfaces with a high performance signal processing core, users

can develop cost-effective solutions quickly without the need for

costly external components. The system peripherals include

three UART ports, three SPI ports, four serial ports (SPORT),

one CAN interface, 2 two wire interfaces (TWI), four general-

purpose timers (three with PWM capability), a real-time clock, a

watchdog timer, a parallel peripheral interface, general-purpose

I/O, and general-purpose I/O pins.

The ADSP-BF538/ADSP-BF538F processors are completely

code compatible with other Blackfin processors, differing only

with respect to performance, peripherals, and on-chip memory.

Specific performance, peripherals, and memory configurations

are shown in Table 1.

Table 1. Processor Features

ADSP-BF538/ADSP-BF538F PROCESSOR

PERIPHERALS

Feature

The ADSP-BF538/ADSP-BF538F processors contain a rich set

of peripherals connected to the core via several high bandwidth

buses, providing flexibility in system configuration as well as

excellent overall system performance (see the block diagram

on Page 1). The general-purpose peripherals include functions

such as UART, Timers with PWM (pulse width modulation)

and pulse measurement capability, general-purpose I/O pins, a

real time clock, and a watchdog timer. This set of functions sat-

isfies a wide variety of typical system support needs and is

augmented by the system expansion capabilities of the device. In

addition to these general-purpose peripherals, the

ADSP-BF538/ADSP-BF538F processors contain high speed

serial and parallel ports for interfacing to a variety of audio,

video, and modem codec functions. A CAN 2.0B controller is

provided for automotive control networks. An interrupt con-

troller manages interrupts from the on-chip peripherals or

external sources. Power management control functions tailor

the performance and power characteristics of the processors

and system to many application scenarios.

Maximum Performance

Instruction SRAM/Cache

Instruction SRAM

Data SRAM/Cache

Data SRAM

500 MHz 1000 MMACs

16 K bytes

64 K bytes

32 K bytes

4 K bytes

Scratchpad

Flash

NA

512 K bytes 1 M byte

4

SPORTs

SPIs

3

TWIs (connection to I²C

compatible devices)

2

3

1

UARTs

CAN

PPI

Package Option

See Ordering Guide on Page 55

All of the peripherals, except for general-purpose I/O, CAN,

TWI, real time clock, and timers, are supported by a flexible

DMA structure. There are also two separate memory DMA con-

trollers dedicated to data transfers between the processor's

various memory spaces, including external SDRAM and asyn-

chronous memory. Multiple on-chip buses running at up to

133 MHz provide enough bandwidth to keep the processor core

running along with activity on all of the on-chip and external

peripherals.

By integrating a rich set of industry-leading system peripherals

and memory, Blackfin processors are the platform of choice for

next generation applications that require RISC-like program-

mability, multimedia support and leading edge signal

processing in one integrated package.

LOW POWER ARCHITECTURE

Blackfin processors provide world class power management and

performance. Blackfin processors are designed in a low power

and low voltage design methodology and feature dynamic

power management, the ability to vary both the voltage and fre-

quency of operation to significantly lower overall power

consumption. Varying the voltage and frequency can result in a

The ADSP-BF538/ADSP-BF538F processors include an on-chip

voltage regulator in support of the ADSP-BF538/ADSP-BF538F

processor’s dynamic power management capability. The voltage

regulator provides a range of core voltage levels from a single

2.25 V to 3.6 V input. The voltage regulator can be bypassed at

the user's discretion.

Rev. PrD

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

bit and 8-bit adds with clipping, 8-bit average operations, and 8-

bit subtract/absolute value/accumulate (SAA) operations. Also

provided are the compare/select and vector search instructions.

BLACKFIN PROCESSOR CORE

As shown in Figure 2 on Page 4, the Blackfin processor core

contains two 16-bit multipliers, two 40-bit accumulators, two

40-bit ALUs, four video ALUs, and a 40-bit shifter. The compu-

tation units process 8-bit, 16-bit, or 32-bit data from the register

file.

For certain instructions, two 16-bit ALU operations can be per-

formed simultaneously on register pairs (a 16-bit high half and

16-bit low half of a compute register). By also using the second

ALU, quad 16-bit operations are possible.

The compute register file contains eight 32-bit registers. When

performing compute operations on 16-bit operand data, the

register file operates as 16 independent 16-bit registers. All

operands for compute operations come from the multiported

register file and instruction constant fields.

The 40-bit shifter can perform shifts and rotates and is used to

support normalization, field extract, and field deposit

instructions.

The program sequencer controls the flow of instruction execu-

tion, including instruction alignment and decoding. For

program flow control, the sequencer supports PC relative and

indirect conditional jumps (with static branch prediction), and

subroutine calls. Hardware is provided to support zero over-

head looping. The architecture is fully interlocked, meaning that

the programmer need not manage the pipeline when executing

instructions with data dependencies.

Each MAC can perform a 16-bit by 16-bit multiply in each

cycle, accumulating the results into the 40-bit accumulators.

Signed and unsigned formats, rounding, and saturation are

supported.

The ALUs perform a traditional set of arithmetic and logical

operations on 16-bit or 32-bit data. In addition, many special

instructions are included to accelerate various signal processing

tasks. These include bit operations such as field extract and pop-

ulation count, modulo 2³²multiply, divide primitives, saturation

and rounding, and sign/exponent detection. The set of video

instructions include byte alignment and packing operations, 16-

The address arithmetic unit provides two addresses for simulta-

neous dual fetches from memory. It contains a multiported

register file consisting of four sets of 32-bit index, modify,

length, and base registers (for circular buffering), and eight

additional 32-bit pointer registers (for C style indexed stack

manipulation).

ADDRESS ARITHMETIC UNIT

SP

FP

P5

P4

P3

P2

P1

P0

I3

I2

I1

I0

L3

L2

L1

L0

B3

B2

B1

B0

M3

M2

M1

M0

DAG0

DAG1

SEQUENCER

ALIGN

DECODE

R7 R7 .H

R6 R6 .H

R5 R5 .H

R4 R4 .H

R3 R3 .H

R7.L

R6.L

R5.L

R4.L

R3.L

LD0 32 BITS

LD1 32 BITS

SD 32 BI TS

LOOPBUFFER

16

8

CONTROL

UNIT

R2 R2 .H

R1 R1 .H

R2.L

R1.L

BARREL

SHIFTER

R0 R0 .H

R0.L

40

A0

A1

DATA ARITHMETIC UNIT

Figure 2. Blackfin Processor Core

Rev. PrD

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Blackfin processors support a modified Harvard architecture in

combination with a hierarchical memory structure. Level 1 (L1)

memories are those that typically operate at the full processor

speed with little or no latency. At the L1 level, the instruction

memory holds instructions only. The two data memories hold

data, and a dedicated scratchpad data memory stores stack and

local variable information.

0xFFFF FFFF

0xFFE0 0000

0xFFC0 0000

0xFFB0 1000

0xFFB0 0000

0xFFA1 4000

0xFFA1 0000

0xFFA0 8000

0xFF90 8000

0xFF90 4000

0xFF80 8000

0xFF80 4000

0xEF00 0000

0x2040 0000

CORE MMR REGISTERS (2M BYTE)

SYSTEM MMR REGISTERS (2M BYTE)

RESERVED

SCRATCHPAD SRAM (4K BYTE)

RESERVED

In addition, multiple L1 memory blocks are provided, offering a

configurable mix of SRAM and cache. The Memory Manage-

ment Unit (MMU) provides memory protection for individual

tasks that may be operating on the core and can protect system

registers from unintended access.

INSTRUCTION SRAM / CACHE (16K BYTE)

INSTRUCTION SRAM (32K BYTE)

RESERVED

DATA BANK B SRAM / CACHE (16K BYTE)

RESERVED

The architecture provides three modes of operation: User mode,

Supervisor mode, and Emulation mode. User mode has

restricted access to certain system resources, thus providing a

protected software environment, while supervisor mode has

unrestricted access to the system and core resources.

DATA BANK A SRAM / CACHE (16K BYTE)

RESERVED

ASYNC MEMORY BANK 3 (1M BYTE) OR

ON-CHIP FLASH

The Blackfin processor instruction set has been optimized so

that 16-bit opcodes represent the most frequently used instruc-

tions, resulting in excellent compiled code density. Complex

DSP instructions are encoded into 32-bit opcodes, representing

fully featured multifunction instructions. Blackfin processors

support a limited multi-issue capability, where a 32-bit instruc-

tion can be issued in parallel with two 16-bit instructions,

allowing the programmer to use many of the core resources in a

single instruction cycle.

0x2030 0000

0x2020 0000

0x2010 0000

ASYNC MEMORY BANK 2 (1M BYTE) OR

ON-CHIP FLASH

ASYNC MEMORY BANK 1 (1M BYTE) OR

ON-CHIP FLASH

ASYNC MEMORY BANK 0 (1M BYTE) OR

ON-CHIP FLASH

0x2000 0000

0x0800 0000

0x0000 0000

RESERVED

SDRAM MEMORY (16M BYTE - 128M BYTE)

The Blackfin processor assembly language uses an algebraic syn-

tax for ease of coding and readability. The architecture has been

optimized for use in conjunction with the C/C++ compiler,

resulting in fast and efficient software implementations.

Figure 3. ADSP-BF538/ADSP-BF538F Internal/External Memory Map

Internal (On-chip) Memory

MEMORY ARCHITECTURE

The ADSP-BF538/ADSP-BF538F processors have three blocks

of on-chip memory providing high bandwidth access to the

core.

The ADSP-BF538/ADSP-BF538F processors view memory as a

single unified 4 Gbyte address space, using 32-bit addresses. All

resources, including internal memory, external memory, and

I/O control registers, occupy separate sections of this common

address space. The memory portions of this address space are

arranged in a hierarchical structure to provide a good cost/per-

formance balance of some very fast, low latency on-chip

memory as cache or SRAM, and larger, lower cost and perfor-

mance off-chip memory systems. See Figure 3.

The first is the L1 instruction memory, consisting of 80 Kbytes

SRAM, of which 16 Kbytes can be configured as a four way set-

associative cache. This memory is accessed at full processor

speed.

The second on-chip memory block is the L1 data memory, con-

sisting of two banks of up to 32 Kbytes each. Each memory bank

is configurable, offering both two-way set-associative cache and

SRAM functionality. This memory block is accessed at full pro-

cessor speed.

The L1 memory system is the primary highest performance

memory available to the Blackfin processor. The off-chip mem-

ory system, accessed through the External Bus Interface Unit

(EBIU), provides expansion with SDRAM, flash memory, and

SRAM, optionally accessing up to 132 Mbytes of physical

memory.

The third memory block is a 4K byte scratchpad SRAM which

runs at the same speed as the L1 memories, but is only accessible

as data SRAM and cannot be configured as cache memory.

External (Off-Chip) Memory

The memory DMA controllers provide high bandwidth data

movement capability. They can perform block transfers of code

or data between the internal memory and the external memory

spaces.

External memory is accessed via the EBIU. This 16-bit interface

provides a glueless connection to a bank of synchronous DRAM

(SDRAM) as well as up to four banks of asynchronous memory

devices including flash, EPROM, ROM, SRAM, and memory

mapped I/O devices.

Rev. PrD

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

The PC133-compliant SDRAM controller can be programmed

to interface to up to 128 Mbytes of SDRAM. The SDRAM con-

troller allows one row to be open for each internal SDRAM

bank, for up to four internal SDRAM banks, improving overall

system performance.

When connected to AMS3–1 the flash memory will appear as

non-volatile memory in the processor memory map shown in

Figure 3 on Page 5.

Flash Memory Programming

The ADSP-BF538F4 and ADSP-BF538F8 flash memory may be

programmed before or after mounting on the printed circuit

board.

The asynchronous memory controller can be programmed to

control up to four banks of devices with very flexible timing

parameters for a wide variety of devices. Each bank occupies a

1 Mbyte segment regardless of the size of the devices used, so

that these banks will only be contiguous if each is fully popu-

lated with 1 Mbyte of memory.

To program the flash prior to mounting on the printed circuit

board, use a hardware programming tool that can provide the

data, address, and control stimuli to the flash die through the

external pins on the package. During this programming, V_DDEXT

and GND must be provided to the package and the Blackfin

must be held in reset with bus request (BR) asserted and a

CLKIN provided.

Flash Memory

The ADSP-BF538F4 and ADSP-BF538F8 processors contain a

separate flash die, connected to the EBIU bus, within the pack-

age of the processors. Figure 4 on Page 6 shows how the flash

memory die and Blackfin processor die are connected.

The VisualDSP++^®tools may be used to program the flash

memory after the device is mounted on a printed circuit board.

Flash Memory Sector Protection

To use the sector protection feature, a high voltage (+12 V nom-

inal) must be applied to the flash FRESET pin. Refer to the flash

datasheet for details.

I/O Memory Space

ADDR19-1

A18-0

OE

WE

ARE

AWE

Blackfin processors do not define a separate I/O space. All

resources are mapped through the flat 32-bit address space. On-

chip I/O devices have their control registers mapped into mem-

ory mapped registers (MMRs) at addresses near the top of the

4 Gbyte address space. These are separated into two smaller

blocks, one which contains the control MMRs for all core func-

tions, and the other which contains the registers needed for

setup and control of the on-chip peripherals outside of the core.

The MMRs are accessible only in supervisor mode and appear

as reserved space to on-chip peripherals.

ARDY

DATA15-0

RY/BY

DQ15-0

VSS

VCC

BYTE

CE

GND

DDEXT

V

AMS3-0

RESET

ADSP-BF538Fx

package

Booting

The ADSP-BF538/ADSP-BF538F processors contain a small

boot kernel, which configures the appropriate peripheral for

booting. If the processors are configured to boot from boot

ROM memory space, the processors start executing from the

on-chip boot ROM. For more information, see Booting Modes

on Page 15.

Figure 4. Internal Connection of Flash Memory (ADSP-BF538Fx)

The ADSP-BF538F4 contains a 512 Kbits bottom boot sector

flash memory. The ADSP-BF538F8 contains a 1 Mbit bottom

boot sector flash memory. Features include the following.

• access times as fast as 70 ns (EBIU registers must be set

appropriately)

Event Handling

The event controller on the ADSP-BF538/ADSP-BF538F pro-

cessors handle all asynchronous and synchronous events to the

processors. The processor provides event handling that sup-

ports both nesting and prioritization. Nesting allows multiple

event service routines to be active simultaneously. Prioritization

ensures that servicing of a higher priority event takes prece-

dence over servicing of a lower priority event. The controller

provides support for five different types of events:

• sector protection

• one million write cycles per sector

• 20 year data retention

The Blackfin processor connects to the flash memory die with

address, data, chip enable, write enable, and output enable con-

trols as if it were an external memory device.

The flash chip enable pin FCE must be connected to AMS0 or

AMS3–1 through a printed circuit board trace. When connected

to AMS0 the Blackfin processor can boot from the flash die.

• Emulation – An emulation event causes the processor to

enter emulation mode, allowing command and control of

the processor via the JTAG interface.

• Reset – This event resets the processor.

Rev. PrD

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

• Non-maskable interrupt (NMI) – The NMI event can be

generated by the software watchdog timer or by the NMI

input signal to the processor. The NMI event is frequently

used as a power-down indicator to initiate an orderly shut-

down of the system.

support the peripherals of the processor. Table 2 describes the

inputs to the CEC, identifies their names in the event vector

table (EVT), and lists their priorities.

System Interrupt Controllers (SIC)

The system interrupt controllers (SIC0, SIC1) provide the map-

ping and routing of events from the many peripheral interrupt

sources to the prioritized general-purpose interrupt inputs of

the CEC. Although the ADSP-BF538/ADSP-BF538F processors

provide a default mapping, the user can alter the mappings and

priorities of interrupt events by writing the appropriate values

into the interrupt assignment registers (IAR). Table 3 describes

the inputs into the SICs and the default mappings into the CEC.

• Exceptions – Events that occur synchronously to program

flow (the exception are taken before the instruction is

allowed to complete). Conditions such as data alignment

violations and undefined instructions cause exceptions.

• Interrupts – Events that occur asynchronously to program

flow. They are caused by input pins, timers, and other

peripherals, as well as by an explicit software instruction.

Each event type has an associated register to hold the return

address and an associated return-from-event instruction. When

an event is triggered, the state of the processors are saved on the

supervisor stack.

Table 3. System and Core Event Mapping

Core

Event Name

Event Source

The ADSP-BF538/ADSP-BF538F processor’s event controllers

consist of two stages, the core event controller (CEC) and the

system interrupt controller (SIC). the core event controller

works with the system interrupt controller to prioritize and con-

trol all system events. Conceptually, interrupts from the

peripherals enter into the SIC, and are then routed directly into

the general-purpose interrupts of the CEC.

PLL Wakeup Interrupt

IVG7

DMA Controller 0 Error

DMA Controller 1 Error

PPI Error Interrupt

IVG7

SPORT0 Error Interrupt

SPORT1 Error Interrupt

SPORT2 Error Interrupt

SPORT3 Error Interrupt

SPI0 Error Interrupt

IVG7

Core Event Controller (CEC)

IVG7

Table 2. Core Event Controller (CEC)

IVG7

Priority

SPI1 Error Interrupt

IVG7

(0 is Highest)

Event Class

EVT Entry

EMU

SPI2 Error Interrupt

IVG7

0

Emulation/Test Control

Reset

UART0 Error Interrupt

IVG7

1

RST

UART1 Error Interrupt

IVG7

2

Non-Maskable Interrupt

Exception

NMI

UART2 Error Interrupt

IVG7

3

EVX

CAN Error Interrupt

IVG7

4

Reserved

—

Real Time Clock Interrupts

DMA0 Interrupt (PPI)

IVG8

5

Hardware Error

IVHW

IVTMR

IVG7

IVG8

6

Core Timer

DMA1 Interrupt (SPORT0 RX)

DMA2 Interrupt (SPORT0 TX)

DMA3 Interrupt (SPORT1 RX)

DMA4 Interrupt (SPORT1 TX)

DMA8 Interrupt (SPORT2 RX)

DMA9 Interrupt (SPORT2 TX)

DMA10 Interrupt (SPORT3 RX)

DMA11 Interrupt (SPORT3 TX)

DMA5 Interrupt (SPI0)

DMA14 Interrupt (SPI1)

DMA15 Interrupt (SPI2)

DMA6 Interrupt (UART0 RX)

DMA7 Interrupt (UART0 TX)

DMA16 Interrupt (UART1 RX)

DMA17 Interrupt (UART1 TX)

IVG9

7

General Interrupt 7

General Interrupt 8

General Interrupt 9

General Interrupt 10

General Interrupt 11

General Interrupt 12

General Interrupt 13

General Interrupt 14

General Interrupt 15

IVG9

8

IVG8

IVG9

9

IVG9

10

11

12

13

14

15

IVG10

IVG11

IVG12

IVG13

IVG14

IVG15

IVG9

IVG10

The CEC supports nine general-purpose interrupts (IVG15–7),

in addition to the dedicated interrupt and exception events. Of

these general-purpose interrupts, the two lowest priority inter-

rupts (IVG15–14) are recommended to be reserved for software

interrupt handlers, leaving seven prioritized interrupt inputs to

Rev. PrD

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Table 3. System and Core Event Mapping (Continued)

• SIC interrupt mask registers (SIC_IMASKx)– These regis-

ters control the masking and unmasking of each peripheral

interrupt event. When a bit is set in these registers, that

peripheral event is unmasked and will be processed by the

system when asserted. A cleared bit in these registers masks

the peripheral event, preventing the processor from servic-

ing the event.

Core

Event Source

Event Name

DMA18 Interrupt (UART2 RX)

DMA19 Interrupt (UART2 TX)

Timer0, Timer1, Timer2 Interrupts

TWI0 Interrupt

IVG10

IVG11

IVG12

IVG13

• SIC interrupt status registers (SIC_ISRx) – As multiple

peripherals can be mapped to a single event, these registers

allow the software to determine which peripheral event

source triggered the interrupt. A set bit indicates the

peripheral is asserting the interrupt, and a cleared bit indi-

cates the peripheral is not asserting the event.

TWI1 Interrupt

CAN Receive Interrupt

CAN Transmit Interrupt

Port F GPIO Interrupts A and B

MDMA0 Stream 0 Interrupt

MDMA0 Stream 1 Interrupt

MDMA1 Stream 0 Interrupt

MDMA1 Stream 1 Interrupt

Software Watchdog Timer

• SIC interrupt wakeup enable registers (SIC_IWRx) – By

enabling the corresponding bit in these registers, a periph-

eral can be configured to wake up the processor, should the

core be idled when the event is generated. (For more infor-

mation, see Dynamic Power Management on Page 12.)

Because multiple interrupt sources can map to a single general-

purpose interrupt, multiple pulse assertions can occur simulta-

neously, before or during interrupt processing for an interrupt

event already detected on this interrupt input. The IPEND reg-

ister contents are monitored by the SIC as the interrupt

acknowledgement.

Event Control

The ADSP-BF538/ADSP-BF538F processors provide the user

with a very flexible mechanism to control the processing of

events. In the CEC, three registers are used to coordinate and

control events. Each register is 16 bits wide:

The appropriate ILAT register bit is set when an interrupt rising

edge is detected (detection requires two core clock cycles). The

bit is cleared when the respective IPEND register bit is set. The

IPEND bit indicates that the event has entered into the proces-

sor pipeline. At this point the CEC will recognize and queue the

next rising edge event on the corresponding event input. The

minimum latency from the rising edge transition of the general-

purpose interrupt to the IPEND output asserted is three core

clock cycles; however, the latency can be much higher, depend-

ing on the activity within and the state of the processor.

• CEC interrupt latch register (ILAT) – The ILAT register

indicates when events have been latched. The appropriate

bit is set when the processor has latched the event and

cleared when the event has been accepted into the system.

This register is updated automatically by the controller, but

it may also be written to clear (cancel) latched events. This

register may be read while in supervisor mode and may

only be written while in supervisor mode when the corre-

sponding IMASK bit is cleared.

DMA CONTROLLERS

• CEC interrupt mask register (IMASK) – The IMASK regis-

ter controls the masking and unmasking of individual

events. When a bit is set in the IMASK register, that event is

unmasked and will be processed by the CEC when asserted.

A cleared bit in the IMASK register masks the event, pre-

venting the processor from servicing the event even though

the event may be latched in the ILAT register. This register

may be read or written while in supervisor mode. (Note

that general-purpose interrupts can be globally enabled and

disabled with the STI and CLI instructions, respectively.)

The ADSP-BF538/ADSP-BF538F processors have multiple,

independent DMA controllers that support automated data

transfers with minimal overhead for the processor core. DMA

transfers can occur between the processor internal memories

and any of its DMA capable peripherals. Additionally, DMA

transfers can be accomplished between any of the DMA capable

peripherals and external devices connected to the external

memory interfaces, including the SDRAM controller and the

asynchronous memory controller. DMA capable peripherals

include the SPORTs, SPI port, UART, and PPI. Each individual

DMA capable peripheral has at least one dedicated DMA

channel.

• CEC interrupt pending register (IPEND) – The IPEND

register keeps track of all nested events. A set bit in the

IPEND register indicates the event is currently active or

nested at some level. This register is updated automatically

by the controller but may be read while in supervisor mode.

The DMA controllers support both 1-dimensional (1D) and 2-

dimensional (2D) DMA transfers. DMA transfer initialization

can be implemented from registers or from sets of parameters

called descriptor blocks.

The SIC allows further control of event processing by providing

three 32-bit interrupt control and status registers. Each register

contains a bit corresponding to each of the peripheral interrupt

events shown in Table 3 on Page 7.

The 2D DMA capability supports arbitrary row and column

sizes up to 64K elements by 64K elements, and arbitrary row

and column step sizes up to 32K elements. Furthermore, the

column step size can be less than the row step size, allowing

Rev. PrD

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

implementation of interleaved data streams. This feature is

especially useful in video applications where data can be de-

interleaved on the fly.

RTXI

RTXO

R1

Examples of DMA types supported by the processor DMA con-

troller include:

X1

• A single, linear buffer that stops upon completion

C1

C2

• A circular, auto-refreshing buffer that interrupts on each

full or fractionally full buffer

• 1-D or 2-D DMA using a linked list of descriptors

SUGGESTED COMPONENTS:

ECLIPTEK EC38J (THROUGH-HOLE PACKAGE)

EPSON MC405 12 PF LOAD (SURFACE MOUNT PACKAGE)

C1 = 22 PF

• 2-D DMA using an array of descriptors, specifying only the

base DMA address within a common page

C2 = 22 PF

R1 = 10M OHM

In addition to the dedicated peripheral DMA channels, there are

four memory DMA channels provided for transfers between the

various memories of the ADSP-BF538/ADSP-BF538F proces-

sor’s systems. This enables transfers of blocks of data between

any of the memories—including external SDRAM, ROM,

SRAM, and flash memory—with minimal processor interven-

tion. Memory DMA transfers can be controlled by a very

flexible descriptor based methodology or by a standard register

based autobuffer mechanism.

NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.

CONTACT CRYSTAL MANUFACTURER FOR DETAILS. C1 AND C2

SPECIFICATIONS ASSUME BOARD TRACE CAPACITANCE OF 3 PF.

Figure 5. External Components for RTC

WATCHDOG TIMER

The ADSP-BF538/ADSP-BF538F processors include a 32-bit

timer that can be used to implement a software watchdog func-

tion. A software watchdog can improve system availability by

forcing the processor to a known state through generation of a

hardware reset, non-maskable interrupt (NMI), or general-pur-

pose interrupt, if the timer expires before being reset by

software. The programmer initializes the count value of the

timer, enables the appropriate interrupt, then enables the timer.

Thereafter, the software must reload the counter before it

counts to zero from the programmed value. This protects the

system from remaining in an unknown state where software,

which would normally reset the timer, has stopped running due

to an external noise condition or software error.

REAL TIME CLOCK

The ADSP-BF538/ADSP-BF538F processor’s real time clock

(RTC) provides a robust set of digital watch features, including

current time, stopwatch, and alarm. The RTC is clocked by a

32.768 KHz crystal external to the processor. The RTC periph-

eral has dedicated power supply pins so that it can remain

powered up and clocked even when the rest of the processors

are in a low power state. The RTC provides several programma-

ble interrupt options, including interrupt per second, minute,

hour, or day clock ticks, interrupt on programmable stopwatch

countdown, or interrupt at a programmed alarm time.

If configured to generate a hardware reset, the watchdog timer

resets both the core and the processor peripherals. After a reset,

software can determine if the watchdog was the source of the

hardware reset by interrogating a status bit in the watchdog

timer control register.

The 32.768 KHz input clock frequency is divided down to a

1 Hz signal by a prescaler. The counter function of the timer

consists of four counters: a 60 second counter, a 60 minute

counter, a 24 hour counter, and an 32,768 day counter.

When enabled, the alarm function generates an interrupt when

the output of the timer matches the programmed value in the

alarm control register. There are two alarms: The first alarm is

for a time of day. The second alarm is for a day and time of that

day.

The timer is clocked by the system clock (SCLK), at a maximum

frequency of f_SCLK

.

TIMERS

There are four general-purpose programmable timer units in

the ADSP-BF538/ADSP-BF538F processors. Three timers have

an external pin that can be configured either as a pulse width

modulator (PWM) or timer output, as an input to clock the

timer, or as a mechanism for measuring pulse widths and peri-

ods of external events. These timers can be synchronized to an

external clock input to the PF1 pin, an external clock input to

the PPI_CLK pin, or to the internal SCLK.

The stopwatch function counts down from a programmed

value, with one second resolution. When the stopwatch is

enabled and the counter underflows, an interrupt is generated.

Like the other peripherals, the RTC can wake up the ADSP-

BF538/ADSP-BF538F processor from sleep mode upon genera-

tion of any RTC wakeup event. Additionally, an RTC wakeup

event can wake up the processor from deep sleep mode, and

wake up the on-chip internal voltage regulator from a powered

down state.

The timer units can be used in conjunction with the UART to

measure the width of the pulses in the data stream to provide an

auto-baud detect function for a serial channel.

Connect RTC pins RTXI and RTXO with external components

as shown in Figure 5.

The timers can generate interrupts to the processor core provid-

ing periodic events for synchronization, either to the system

clock or to a count of external signals.

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Preliminary Technical Data

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In addition to the three general-purpose programmable timers,

a fourth timer is also provided. This extra timer is clocked by the

internal processor clock and is typically used as a system tick

clock for generation of operating system periodic interrupts.

processor. For SPI0, seven SPI chip select output pins

(SPI0SEL7–1) let the processor select other SPI devices. The SPI

select pins are reconfigured GPIO pins. SPI1 and SPI2 have a

single SPI select for SPI point-to-point communication. Using

these pins, the SPI ports provide a full-duplex, synchronous

serial interface, which supports both master/slave modes and

multimaster environments.

SERIAL PORTS (SPORTs)

The ADSP-BF538/ADSP-BF538F processors incorporate four

dual-channel synchronous serial ports for serial and multipro-

cessor communications. The SPORTs support the following

features:

The SPI ports’ baud rate and clock phase/polarities are pro-

grammable, and it has an integrated DMA controller,

configurable to support transmit or receive data streams. Each

SPI’s DMA controller can only service unidirectional accesses at

any given time.

• I²S capable operation.

• Bidirectional operation – Each SPORT has two sets of inde-

pendent transmit and receive pins, enabling eight channels

of I²S stereo audio.

The SPI port’s clock rate is calculated as:

f_SCLK

2 × SPIx_BAUD

--------------------------------------

SPI Clock Rate =

• Buffered (8-deep) transmit and receive ports – Each port

has a data register for transferring data words to and from

other processor components and shift registers for shifting

data in and out of the data registers.

Where the 16-bit SPIx_BAUD register contains a value of 2 to

65,535.

• Clocking – Each transmit and receive port can either use an

external serial clock or generate its own, in frequencies

ranging from (f_SCLK/131,070) Hz to (f_SCLK/2) Hz.

During transfers, the SPI port simultaneously transmits and

receives by serially shifting data in and out on its two serial data

lines. The serial clock line synchronizes the shifting and sam-

pling of data on the two serial data lines.

• Word length – Each SPORT supports serial data words

from 3 to 32 bits in length, transferred most significant bit

first or least significant bit first.

TWO WIRE INTERFACE

The ADSP-BF538/ADSP-BF538F processors have 2 two wire

interface (TWI) modules that are compatible with the Philips

Inter-IC bus standard. The TWI modules offer the capabilities

of simultaneous master and slave operation, support for 7-bit

addressing and multimedia data arbitration. The TWI also

includes master clock synchronization and support for clock

low extension.

• Framing – Each transmit and receive port can run with or

without frame sync signals for each data word. Frame sync

signals can be generated internally or externally, active high

or low, and with either of two pulsewidths and early or late

frame sync.

• Companding in hardware – Each SPORT can perform

A-law or μ-law companding according to ITU recommen-

dation G.711. Companding can be selected on the transmit

and/or receive channel of the SPORT without additional

latencies.

The TWI interface uses two pins for transferring clock (SCLx)

and data (SDAx) and supports the protocol at speeds up to

400 kbits/sec.

The TWI interface pins are compatible with 5V logic levels.

• DMA operations with single-cycle overhead – Each SPORT

can automatically receive and transmit multiple buffers of

memory data. The processor can link or chain sequences of

DMA transfers between a SPORT and memory.

UART PORTs

The ADSP-BF538/ADSP-BF538F processors incorporate three

full-duplex Universal Asynchronous Receiver/Transmitter

(UART) ports, which are fully compatible with PC standard

UARTs. The UART ports provide a simplified UART interface

to other peripherals or hosts, supporting full-duplex, DMA sup-

ported, asynchronous transfers of serial data. The UART ports

include support for 5 to 8 data bits, 1 or 2 stop bits, and none,

even, or odd parity. The UART ports support two modes of

operation:

• Interrupts – Each transmit and receive port generates an

interrupt upon completing the transfer of a data word or

after transferring an entire data buffer or buffers through

DMA.

• Multichannel capability – Each SPORT supports 128 chan-

nels out of a 1024 channel window and is compatible with

the H.100, H.110, MVIP-90, and HMVIP standards.

• PIO (programmed I/O) – The processor sends or receives

data by writing or reading I/O mapped UART registers.

The data is double buffered on both transmit and receive.

SERIAL PERIPHERAL INTERFACE (SPI) PORTS

The ADSP-BF538/ADSP-BF538F processors incorporate three

SPI compatible ports that enable the processor to communicate

with multiple SPI compatible devices.

• DMA (direct memory access) – The DMA controller trans-

fers both transmit and receive data. This reduces the

number and frequency of interrupts required to transfer

data to and from memory. Each UART has two dedicated

The SPI interface uses three pins for transferring data: two data

pins (master output-slave input, MOSIx, and master input-slave

output, MISOx) and a clock pin (serial clock, SCKx). An SPI

chip select input pin (SPIxSS) lets other SPI devices select the

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

DMA channels, one for transmit and one for receive. These

DMA channels have lower default priority than most DMA

channels because of their relatively low service rates.

inputs can be configured to generate hardware interrupts,

while output PFx pins can be triggered by software

interrupts.

The UART port's baud rate, serial data format, error code gen-

eration and status, and interrupts are programmable:

• Flag interrupt sensitivity registers – The two flag interrupt

sensitivity registers specify whether individual PFx pins are

level- or edge-sensitive and specify—if edge-sensitive—

whether just the rising edge or both the rising and falling

edges of the signal are significant. One register selects the

type of sensitivity, and one register selects which edges are

significant for edge-sensitivity.

• Supporting bit rates ranging from (f_SCLK/ 1,048,576) to

(f_SCLK/16) bits per second.

• Supporting data formats from 7 to12 bits per frame.

• Both transmit and receive operations can be configured to

generate maskable interrupts to the processor.

Table 4. GPIO Ports

The UART port’s clock rate is calculated as:

Peripheral

PPI

Alternate GPIO Port Function

GPIO Port F15–0

GPIO Port E7–0

f_SCLK

16 × UART_Divisor

-----------------------------------------------

UART Clock Rate =

SPORT2

SPORT3

SPI1

Where the 16-bit UART_Divisor comes from the UARTx_DLH

register (most significant 8 bits) and UARTx_DLL register (least

significant 8 bits).

GPIO Port E15–8

GPIO Port D4–0

SPI2

GPIO Port D9–5

In conjunction with the general-purpose timer functions, auto-

baud detection is supported.

UART1

UART2

CAN

GPIO Port D11–10

GPIO Port D13–12

GPIO Port C1–0

The capabilities of the UARTs are further extended with sup-

port for the Infrared Data Association (IrDA^®) Serial Infrared

Physical Layer Link Specification (SIR) protocol.

GPIO

GPIO Port C9–4

GENERAL-PURPOSE PORTS

PARALLEL PERIPHERAL INTERFACE

The ADSP-BF538/ADSP-BF538F processors have up to 54 gen-

eral-purpose I/O pins that are multiplexed with other

peripherals. They are arranged into ports C, D, E, and F as

shown in Table 4.

The ADSP-BF538/ADSP-BF538F processors provide a parallel

peripheral interface (PPI) that can connect directly to parallel

A/D and D/A converters, video encoders and decoders, and

other general-purpose peripherals. The PPI consists of a dedi-

cated input clock pin, up to 3 frame synchronization pins, and

at up to 16 data pins. The input clock supports parallel data rates

at up to f_SCLK/2 MHz, and the synchronization signals can be con-

figured as either inputs or outputs.

The general-purpose I/O pins may be individually controlled by

manipulation of the control and status registers. These pins may

be polled to determine their status.

• GPIO direction control register – Specifies the direction of

each individual GPIOx pin as input or output.

The PPI supports a variety of general-purpose and ITU-R 656

modes of operation. In general-purpose mode, the PPI provides

half-duplex, bi-directional data transfer with up to 16 bits of

data. Up to 3 frame synchronization signals are also provided.

In ITU-R 656 mode, the PPI provides half-duplex, bi-direc-

tional transfer of 8- or 10-bit video data. Additionally, on-chip

decode of embedded start-of-line (SOL) and start-of-field (SOF)

preamble packets is supported.

• GPIO control and status registers – The processor employs

a “write one to modify” mechanism that allows any combi-

nation of individual GPIO to be modified in a single

instruction, without affecting the level of any other GPIO.

Four control registers and a data register are provided for

each GPIO port. One register is written in order to set

GPIO values, one register is written in order to clear GPIO

values, one register is written in order to toggle GPIO val-

ues, and one register is written in order to specify a GPIO

input or output. Reading the GPIO Data allows software to

determine the state of the input GPIO pins.

General-Purpose Mode Descriptions

The general-purpose modes of the PPI are intended to suit a

wide variety of data capture and transmission applications.

Three distinct submodes are supported:

In addition to the GPIO function described above, the 16 port F

pins can be individually configured to generate interrupts.

• Input mode – frame syncs and data are inputs into the PPI.

• Flag interrupt mask registers – The two Flag interrupt

mask registers allow each individual PFx pin to function as

an interrupt to the processor. similar to the two flag control

registers that are used to set and clear individual flag values,

one flag interrupt mask register sets bits to enable interrupt

function, and the other flag interrupt mask register clears

bits to disable interrupt function. PFx pins defined as

• Frame capture mode – frame syncs are outputs from the

PPI, but data are inputs.

• Output mode – frame syncs and data are outputs from the

PPI.

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Input Mode

CONTROLLER AREA NETWORK (CAN) INTERFACE

Input mode is intended for ADC applications, as well as video

communication with hardware signaling. In its simplest form,

PPI_FS1 is an external frame sync input that controls when to

read data. The PPI_DELAY MMR allows for a delay (in

PPI_CLK cycles) between reception of this frame sync and the

initiation of data reads. The number of input data samples is

user programmable and defined by the contents of the

PPI_Count register. Data widths of 8-bits, and 10-bits through

16-bits are supported, and are programmed using the

PPI_CONTROL register.

The ADSP-BF538/ADSP-BF538F processors provide a CAN

controller that is a communication controller implementing the

Controller Area Network (CAN) V2.0B protocol. This protocol

is an asynchronous communications protocol used in both

industrial and automotive control systems. CAN is well suited

for control applications due to its capability to communicate

reliably over a network since the protocol incorporates CRC

checking message error tracking, and fault node confinement.

The CAN controller is based on a 32 entry mailbox RAM and

supports both the standard and extended identifier (ID) mes-

sage formats specified in the CAN protocol specification,

revision 2.0, part B.

Frame Capture Mode

Frame capture mode allows the video source(s) to act as a slave

(e.g., for frame capture). The ADSP-BF538/ADSP-BF538F pro-

cessors control when to read from the video source(s). PPI_FS1

is an HSYNC output and PPI_FS2 is a VSYNC output.

Each mailbox consists of eight 16-bit data words. The data is

divided into fields, which includes a message identifier, a time

stamp, a byte count, up to 8 bytes of data, and several control

bits. Each node monitors the messages being passed on the net-

work. If the identifier in the transmitted message matches an

identifier in one of it's mailboxes, then the module knows that

the message was meant for it, passes the data into it's appropri-

ate mailbox, and signals the processor of message arrival with an

interrupt.

Output Mode

Output mode is used for transmitting video or other data with

up to three output frame syncs. Typically, a single frame sync is

appropriate for data converter applications, whereas two or

three frame syncs could be used for sending video with hard-

ware signaling.

The CAN controller can wake up the processor from sleep mode

upon generation of a wakeup event, such that the processor can

be maintained in a low power mode during idle conditions.

Additionally, a CAN wakeup event can wake up the processor

from deep sleep, and wake up the on-chip internal voltage regu-

lator from a powered-down state.

ITU-R 656 Mode Descriptions

The ITU-R 656 modes of the PPI are intended to suit a wide

variety of video capture, processing, and transmission applica-

tions. Three distinct submodes are supported:

• Active video only mode

• Vertical blanking only mode

• Entire field mode

The electrical characteristics of each network connection are

very stringent, therefore the CAN interface is typically divided

into 2 parts: a controller and a transceiver. This allows a single

controller to support different drivers and CAN networks. The

ADSP-BF538/ADSP-BF538F CAN module represents the con-

troller part of the interface. This module's network I/O is a

single transmit output and a single receive input, which connect

to a line transceiver.

Active Video Only Mode

Active video only mode is used when only the active video por-

tion of a field is of interest and not any of the blanking intervals.

The PPI does not read in any data between the end of active

video (EAV) and start of active video (SAV) preamble symbols,

or any data present during the vertical blanking intervals. In this

mode, the control byte sequences are not stored to memory;

they are filtered by the PPI. After synchronizing to the start of

Field 1, the PPI ignores incoming samples until it sees an SAV

code. The user specifies the number of active video lines per

frame (in PPI_Count register).

The CAN clock is derived from the processor system clock

(SCLK) through a programmable divider and therefore does not

require an additional crystal.

DYNAMIC POWER MANAGEMENT

The ADSP-BF538/ADSP-BF538F processors provide five oper-

ating modes, each with a different performance/power profile.

In addition, dynamic power management provides the control

functions to dynamically alter the processor core supply voltage,

further reducing power dissipation. Control of clocking to each

of the processor peripherals also reduces power consumption.

See Table 5 for a summary of the power settings for each mode.

Vertical Blanking Interval Mode

In this mode, the PPI only transfers vertical blanking interval

(VBI) data.

Entire Field Mode

Full-On Operating Mode—Maximum Performance

In this mode, the entire incoming bit stream is read in through

the PPI. This includes active video, control preamble sequences,

and ancillary data that may be embedded in horizontal and ver-

tical blanking intervals. Data transfer starts immediately after

synchronization to Field 1. Data is transferred to or from the

synchronous channels through eight DMA engines that work

autonomously from the processor core.

In the full-on mode, the PLL is enabled and is not bypassed,

providing capability for maximum operational frequency. This

is the powerup default execution state in which maximum per-

formance can be achieved. The processor core and all enabled

peripherals run at full speed.

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

FREQ bits of the VR_CTL register. This disables both CCLK

and SCLK. Furthermore, it sets the internal power supply volt-

age (V_DDINT) to 0 V to provide the lowest static power dissipation.

Any critical information stored internally (memory contents,

register contents, etc.) must be written to a non-volatile storage

device prior to removing power if the processor state is to be

preserved. Since V_DDEXTis still supplied in this mode, all of the

external pins three-state, unless otherwise specified. This allows

other devices that may be connected to the processor to have

power still applied without drawing unwanted current. The

internal supply regulator can be woken up either by a real time

clock wakeup, by CAN bus traffic, by asserting the RESET pin

or by an external source.

Active Operating Mode—Moderate Power Savings

In the active mode, the PLL is enabled but bypassed. Because the

PLL is bypassed, the processor’s core clock (CCLK) and system

clock (SCLK) run at the input clock (CLKIN) frequency. In this

mode, the CLKIN to CCLK multiplier ratio can be changed,

although the changes are not realized until the full-on mode is

entered. DMA access is available to appropriately configured L1

memories.

In the active mode, it is possible to disable the PLL through the

PLL Control register (PLL_CTL). If disabled, the PLL must be

re-enabled before transitioning to the Full-On or Sleep modes.

Table 5. Power Settings

Power Savings

Core

Clock

System

Clock

As shown in Table 6, the ADSP-BF538/ADSP-BF538F proces-

sors support three different power domains. The use of multiple

power domains maximizes flexibility, while maintaining com-

pliance with industry standards and conventions. By isolating

the internal logic of the processor into its own power domain,

separate from the RTC and other I/O, the processor can take

advantage of Dynamic Power Management, without affecting

the RTC or other I/O devices. There are no sequencing require-

ments for the various power domains.

PLL

Core

Power

Mode

Full On

Active

PLL

Bypassed (CCLK)

(SCLK)

Enabled

No

Enabled Enabled On

Enabled/

Disabled

Yes

Sleep

Enabled

Disabled Enabled On

Disabled Disabled On

Disabled Disabled Off

Deep Sleep Disabled

Hibernate Disabled

Table 6. Power Domains

Sleep Operating Mode—High Dynamic Power Savings

Power Domain

VDD Range

VDDRTC

VDDINT

The sleep mode reduces dynamic power dissipation by disabling

the clock to the processor core (CCLK). The PLL and system

clock (SCLK), however, continue to operate in this mode. Typi-

cally an external event or RTC activity will wake up the

RTC crystal I/O and logic

All internal logic except RTC

All I/O except RTC

VDDEXT

processor. When in the Sleep mode, assertion of wakeup causes

the processor to sense the value of the BYPASS bit in the PLL

control register (PLL_CTL). If BYPASS is disabled, the proces-

sor transitions to the full on mode. If BYPASS is enabled, the

processor will transition to the Active mode. When in the sleep

mode, system DMA access to L1 memory is not supported.

The power dissipated by a processors are largely a function of

the clock frequency of the processors and the square of the oper-

ating voltage. For example, reducing the clock frequency by 25%

results in a 25% reduction in power dissipation, while reducing

the voltage by 25% reduces power dissipation by more than

40%. Further, these power savings are additive, in that if the

clock frequency and supply voltage are both reduced, the power

savings can be dramatic.

Deep Sleep Operating Mode—Maximum Dynamic Power

Savings

The deep sleep mode maximizes dynamic power savings by dis-

abling the clocks to the processor core (CCLK) and to all

synchronous peripherals (SCLK). Asynchronous peripherals

such as the RTC may still be running, but will not be able to

access internal resources or external memory. This powered

down mode can only be exited by assertion of the reset interrupt

(RESET) or by an asynchronous interrupt generated by the

RTC. When in deep sleep mode, an RTC asynchronous inter-

rupt causes the processor to transition to the active mode.

Assertion of RESET while in deep sleep mode causes the proces-

sor to transition to the Full On mode.

The dynamic power management feature of the processor

allows both the processor’s input voltage (V_DDINT) and clock fre-

quency (f_CCLK) to be dynamically controlled.

The savings in power dissipation can be modeled using the

power savings factor and % power savings calculations.

The power savings factor is calculated as:

Power Savings Factor

2

f_CCLKRED

-------------------------

f_CCLKNOM

V_DDINTRED

-------------------------------

V_DDINTNOM

T_RED

--------------

T_NOM

⎛

⎝

⎞

⎠

⎛

⎝

⎞

⎠

=

×

Hibernate Operating Mode—Maximum Static Power

Savings

where the variables in the equations are:

The hibernate mode maximizes static power savings by dis-

abling the voltage and clocks to the processor core (CCLK) and

to all the synchronous peripherals (SCLK). The internal voltage

regulator for the processor can be shut off by writing b#00 to the

• f_CCLKNOMis the nominal core clock frequency

• f_CCLKREDis the reduced core clock frequency

• V_DDINTNOMis the nominal internal supply voltage

Rev. PrD

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

• V_DDINTREDis the reduced internal supply voltage

• T_NOMis the duration running at f_CCLKNOM

• T_REDis the duration running at f_CCLKRED

The Power Savings Factor is calculated as:

Alternatively, because the ADSP-BF538/ADSP-BF538F proces-

sors include an on-chip oscillator circuit, an external crystal

may be used. The crystal should be connected across the CLKIN

and XTAL pins, with two capacitors connected as shown in

Figure 7. Capacitor values are dependent on crystal type and

should be specified by the crystal manufacturer. A parallel-reso-

nant, fundamental frequency, microprocessor-grade crystal

should be used.

% Power Savings = (1 – Power Savings Factor) × 100%

VOLTAGE REGULATION

The Blackfin processor provides an on-chip voltage regulator

that can generate processor core voltage levels 0.8 V to

1.2V(–5%/+10%) from an external 2.7 V to 3.6 V supply.

Figure 6 shows the typical external components required to

complete the power management system.^†The regulator con-

trols the internal logic voltage levels and is programmable with

the voltage regulator control register (VR_CTL) in increments

of 50 mV. To reduce standby power consumption, the internal

voltage regulator can be programmed to remove power to the

processor core while I/O power (V_DDRTC, V_DDEXT) is still supplied.

While in hibernate mode, I/O power is still being applied, elimi-

nating the need for external buffers. The voltage regulator can

be activated from this power-down state either through an RTC

wakeup, a CAN wakeup, a general-purpose wakeup, or by

asserting RESET, which will then initiate a boot sequence. The

regulator can also be disabled and bypassed at the user’s

discretion.

XTAL

CLKOUT

CLKIN

BLACKFIN

PROCESSOR

Figure 7. External Crystal Connections

As shown in Figure 8 on Page 14, the core clock (CCLK) and

system peripheral clock (SCLK) are derived from the input

clock (CLKIN) signal. An on-chip PLL is capable of multiplying

the CLKIN signal by a user programmable 1× to 63× multiplica-

tion factor (bounded by specified minimum and maximum

VCO frequencies). The default multiplier is 10×, but it can be

modified by a software instruction sequence. On-the-fly fre-

quency changes can be effected by simply writing to the

PLL_DIV register.

V

DDEXT

“FINE” ADJUSTMENT

REQUIRES PLL SEQUENCING

“COURSE” ADJUSTMENT

ON-THE-FLY

100 µF

2.25V - 3.6V

INPUT VOLTAGE

RANGE

10 µH

0.1 µF

ZHCS1000

V

DDINT

، 1, 2, 4, 8

، 1:15

CCLK

FDS9431A

PLL

0.5x - 64x

CLKIN

VCO

100 µF

1 µF

SCLK

VR

1-0

OUT

SCLK ≤ CCLK

SCLK ≤ 133 MHz

EXTERNAL COMPONENTS

1-0 SHOULD BE TIED TOGETHER EXTERNALLY

NOTE: VR

OUT

Figure 8. Frequency Modification Methods

AND DESIGNER SHOULD MINIMIZE TRACE LENGTH TO FDS9431A.

Figure 6. Voltage Regulator Circuit

All on-chip peripherals are clocked by the system clock (SCLK).

The system clock frequency is programmable by means of the

SSEL3–0 bits of the PLL_DIV register. The values programmed

into the SSEL fields define a divide ratio between the PLL output

(VCO) and the system clock. SCLK divider values are 1 through

15. Table 7 illustrates typical system clock ratios:

CLOCK SIGNALS

The ADSP-BF538/ADSP-BF538F processors can be clocked by

an external crystal, a sine wave input, or a buffered, shaped

clock derived from an external clock oscillator.

If an external clock is used, it should be a TTL compatible signal

and must not be halted, changed, or operated below the speci-

fied frequency during normal operation. This signal is

connected to the processor’s CLKIN pin. When an external

clock is used, the XTAL pin must be left unconnected.

Table 7. Example System Clock Ratios

Example Frequency Ratios (MHz)

Signal Name Divider Ratio

SSEL3–0

VCO/SCLK

VCO

100

300

500

SCLK

100

50

0001

1:1

0110

6:1

^†See EE-228: Switching Regulator Design Considerations for ADSP-BF533

Blackfin Processors.

1010

10:1

50

Rev. PrD

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

The maximum frequency of the system clock is f_SCLK. Note that

the divisor ratio must be chosen to limit the system clock fre-

quency to its maximum of f_SCLK. The SSEL value can be changed

dynamically without any PLL lock latencies by writing the

appropriate values to the PLL divisor register (PLL_DIV).

ADSP-BF538F. All configuration settings are set for the

slowest device possible (3-cycle hold time; 15-cycle R/W

access times; 4-cycle setup).

• Boot from SPI serial EEPROM/flash (8-, 16-, or 24-bit

addressable, or Atmel AT45DB041, AT45DB081, or

AT45DB161) – The SPI uses the PF2 output pin to select a

single SPI EEPROM/flash device, submits a read command

and successive address bytes (0x00) until a valid 8-, 16-, or

24-bit, or Atmel addressable device is detected, and begins

clocking data into the processor at the beginning of L1

instruction memory.

Note that when the SSEL value is changed, it will affect all the

peripherals that derive their clock signals from the SCLK signal.

The core clock (CCLK) frequency can also be dynamically

changed by means of the CSEL1–0 bits of the PLL_DIV register.

Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in

Table 8. This programmable core clock capability is useful for

fast core frequency modifications.

• Boot from SPI host device – The Blackfin processor oper-

ates in SPI slave mode and is configured to receive the bytes

of the .LDR file from an SPI host (master) agent. To hold

off the host device from transmitting while the boot ROM

is busy, the Blackfin processor asserts a GPIO pin, called

host wait (HWAIT), to signal the host device not to send

any more bytes until the flag is deasserted. The flag is cho-

sen by the user and this information is transferred to the

Blackfin processor via bits 10:5 of the FLAG header.

Table 8. Core Clock Ratios

Example Frequency Ratios

Signal Name Divider Ratio

CSEL1–0

VCO/CCLK

VCO

300

500

200

CCLK

300

150

125

25

00

01

10

11

1:1

2:1

4:1

8:1

For each of the boot modes, a 10-byte header is first read from

an external memory device. The header specifies the number of

bytes to be transferred and the memory destination address.

Multiple memory blocks may be loaded by any boot sequence.

Once all blocks are loaded, program execution commences from

the start of L1 instruction SRAM.

BOOTING MODES

The ADSP-BF538/ADSP-BF538F processors have three mecha-

nisms (listed in Table 9) for automatically loading internal L1

instruction memory after a reset. A fourth mode is provided to

execute from external memory, bypassing the boot sequence.

In addition, bit 4 of the reset configuration register can be set by

application code to bypass the normal boot sequence during a

software reset. For this case, the processor jumps directly to the

beginning of L1 instruction memory.

Table 9. Booting Modes

To augment the boot modes, a secondary software loader is pro-

vided that adds additional booting mechanisms. This secondary

loader provides the capability to boot from 16-bit flash memory,

fast flash, variable baud rate, and other sources. In all boot

modes except bypass, program execution starts from on-chip L1

memory address 0xFFA0 0000.

BMODE1–0 Description

00

Execute from 16-bit external memory

(bypass boot ROM)

01

Boot from 8-bit or 16-bit flash (ADSP-BF538 only) or

Boot from on board flash (ADSP-BF538F only)

10

11

Boot from SPI serial master

INSTRUCTION SET DESCRIPTION

Boot from SPI serial slave EEPROM /flash

(8-,16-, or 24-bit address range, or Atmel

AT45DB041, AT45DB081, or AT45DB161serial flash)

The Blackfin processor family assembly language instruction set

employs an algebraic syntax designed for ease of coding and

readability. The instructions have been specifically tuned to pro-

vide a flexible, densely encoded instruction set that compiles to

a very small final memory size. The instruction set also provides

fully featured multifunction instructions that allow the pro-

grammer to use many of the processor core resources in a single

instruction. Coupled with many features more often seen on

microcontrollers, this instruction set is very efficient when com-

piling C and C++ source code. In addition, the architecture

supports both user (algorithm/application code) and supervisor

(O/S kernel, device drivers, debuggers, ISRs) modes of opera-

tion, allowing multiple levels of access to core processor

resources.

The BMODE pins of the reset configuration register, sampled

during power-on resets and software initiated resets, implement

the following modes:

• Execute from 16-bit external memory – Execution starts

from address 0x2000 0000 with 16-bit packing. The boot

ROM is bypassed in this mode. All configuration settings

are set for the slowest device possible (3-cycle hold time;

15-cycle R/W access times; 4-cycle setup).

• Boot from 8-bit or 16-bit external flash memory – The 8-bit

flash boot routine located in boot ROM memory space is

set up using asynchronous memory bank 0. If FCE is con-

nected to AMS0, then the on-chip flash is booted from the

Rev. PrD

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

The assembly language, which takes advantage of the proces-

sor’s unique architecture, offers the following advantages:

Debugging both C/C++ and assembly programs with the

VisualDSP++ debugger, programmers can:

• Seamlessly integrated DSP/CPU features are optimized for

both 8-bit and 16-bit operations.

• View mixed C/C++ and assembly code (interleaved source

and object information).

• A multi-issue load/store modified Harvard architecture,

which supports two 16-bit MAC or four 8-bit ALU plus

two load/store plus two pointer updates per cycle.

• Insert breakpoints.

• Set conditional breakpoints on registers, memory,

and stacks.

• All registers, I/O, and memory are mapped into a unified

4 Gbyte memory space, providing a simplified program-

ming model.

• Trace instruction execution.

• Perform linear or statistical profiling of program execution.

• Fill, dump, and graphically plot the contents of memory.

• Perform source level debugging.

• Microcontroller features, such as arbitrary bit and bit-field

manipulation, insertion, and extraction; integer operations

on 8-, 16-, and 32-bit data types; and separate user and

supervisor stack pointers.

• Create custom debugger windows.

The VisualDSP++ IDDE lets programmers define and manage

software development. Its dialog boxes and property pages let

programmers configure and manage all of the Blackfin develop-

ment tools, including the color syntax highlighting in the

VisualDSP++ editor. This capability permits programmers to:

• Code density enhancements, which include intermixing of

16- and 32-bit instructions (no mode switching, no code

segregation). Frequently used instructions are encoded in

16 bits.

DEVELOPMENT TOOLS

• Control how the development tools process inputs and

generate outputs.

The ADSP-BF538/ADSP-BF538F processors are supported with

a complete set of CROSSCORE^®software and hardware devel-

opment tools, including Analog Devices emulators and

VisualDSP++^®development environment. The same emulator

hardware that supports other Blackfin processors also fully

emulates the ADSP-BF538/ADSP-BF538F processors.

• Maintain a one-to-one correspondence with the tool’s

command line switches.

The VisualDSP++ Kernel (VDK) incorporates scheduling and

resource management tailored specifically to address the mem-

ory and timing constraints of DSP programming. These

capabilities enable engineers to develop code more effectively,

eliminating the need to start from the very beginning, when

developing new application code. The VDK features include

threads, critical and unscheduled regions, semaphores, events,

and device flags. The VDK also supports priority-based, pre-

emptive, cooperative, and time-sliced scheduling approaches. In

addition, the VDK was designed to be scalable. If the application

does not use a specific feature, the support code for that feature

is excluded from the target system.

The VisualDSP++ project management environment lets pro-

grammers develop and debug an application. This environment

includes an easy to use assembler (which is based on an alge-

braic syntax), an archiver (librarian/library builder), a linker, a

loader, a cycle-accurate instruction-level simulator, a C/C++

compiler, and a C/C++ runtime library that includes DSP and

mathematical functions. A key point for these tools is C/C++

code efficiency. The compiler has been developed for efficient

translation of C/C++ code to processor assembly. The proces-

sors have architectural features that improve the efficiency of

compiled C/C++ code.

Because the VDK is a library, a developer can decide whether to

use it or not. The VDK is integrated into the VisualDSP++

development environment, but can also be used via standard

command line tools. When the VDK is used, the development

environment assists the developer with many error prone tasks

and assists in managing system resources, automating the gen-

eration of various VDK based objects, and visualizing the

system state, when debugging an application that uses the VDK.

The VisualDSP++ debugger has a number of important fea-

tures. Data visualization is enhanced by a plotting package that

offers a significant level of flexibility. This graphical representa-

tion of user data enables the programmer to quickly determine

the performance of an algorithm. As algorithms grow in com-

plexity, this capability can have increasing significance on the

designer’s development schedule, increasing productivity. Sta-

tistical profiling enables the programmer to non intrusively poll

the processors as they are running the program. This feature,

unique to VisualDSP++, enables the software developer to pas-

sively gather important code execution metrics without

interrupting the real time characteristics of the program. Essen-

tially, the developer can identify bottlenecks in software quickly

and efficiently. By using the profiler, the programmer can focus

on those areas in the program that impact performance and take

corrective action.

Use the Expert Linker to visually manipulate the placement of

code and data on the embedded system. View memory utiliza-

tion in a color coded graphical form, easily move code and data

to different areas of the processor or external memory with the

drag of the mouse, examine run time stack and heap usage. The

Expert Linker is fully compatible with existing Linker Definition

File (LDF), allowing the developer to move between the graphi-

cal and textual environments.

Analog Devices emulators use the IEEE 1149.1 JTAG Test

Access Port of the ADSP-BF538/ADSP-BF538F processors to

monitor and control the target board processor during emula-

tion. The emulator provides full speed emulation, allowing

Rev. PrD

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

inspection and modification of memory, registers, and proces-

sor stacks. Non intrusive in-circuit emulation is assured by the

use of the processor’s JTAG interface—the emulator does not

affect target system loading or timing.

erence on the Analog Devices web site (www.analog.com)—use

site search on “EE-68.” This document is updated regularly to

keep pace with improvements to emulator support.

VOLTAGE REGULATOR LAYOUT GUIDELINES

In addition to the software and hardware development tools

available from Analog Devices, third parties provide a wide

range of tools supporting the Blackfin processor family. Hard-

ware tools include Blackfin processor PC plug-in cards. Third

party software tools include DSP libraries, real time operating

systems, and block diagram design tools.

Regulator external component placement, board routing, and

bypass capacitors all have a significant effect on noise injected

into the other analog circuits on-chip. The VROUT1-0 traces

and voltage regulator external components should be consid-

ered as noise sources when doing board layout and should not

be routed or placed near sensitive circuits or components on the

board. All internal and I/O power supplies should be well

bypassed with bypass capacitors placed as close to the ADSP-

BF538/ADSP-BF538F processors as possible.

Evaluation Kit

Analog Devices offers a range of EZ-KIT Lite^®evaluation plat-

forms to use as a cost effective method to learn more about

developing or prototyping applications with Analog Devices

processors, platforms, and software tools. Each EZ-KIT Lite

includes an evaluation board along with an evaluation suite of

the VisualDSP++ development and debugging environment

with the C/C++ compiler, assembler, and linker. Also included

are sample application programs, power supply, and a USB

cable. All evaluation versions of the software tools are limited

for use only with the EZ-KIT Lite product.

For further details on the on-chip voltage regulator and related

board design guidelines, see the EE-228: Switching Regulator

Design Considerations for ADSP-BF533 Blackfin Processors

applications note on the Analog Devices web site (www.ana-

log.com)—use site search on “EE-228.”.

The USB controller on the EZ-KIT Lite board connects the

board to the USB port of the user’s PC, enabling the

VisualDSP++ evaluation suite to emulate the on-board proces-

sor in-circuit. This permits the customer to download, execute,

and debug programs for the EZ-KIT Lite system. It also allows

in-circuit programming of the on-board flash device to store

user-specific boot code, enabling the board to run as a standal-

one unit without being connected to the PC.

With a full version of VisualDSP++ installed (sold separately),

engineers can develop software for the EZ-KIT Lite or any cus-

tom defined system. Connecting one of Analog Devices JTAG

emulators to the EZ-KIT Lite board enables high-speed, non-

intrusive emulation.

DESIGNING AN EMULATOR COMPATIBLE

PROCESSOR BOARD

The Analog Devices family of emulators are tools that every sys-

tem developer needs to test and debug hardware and software

systems. Analog Devices has supplied an IEEE 1149.1 JTAG

Test Access Port (TAP) on each JTAG processor. The emulator

uses the TAP to access the internal features of the processor,

allowing the developer to load code, set breakpoints, observe

variables, observe memory, and examine registers. The proces-

sor must be halted to send data and commands, but once an

operation has been completed by the emulator, the processor

system is set running at full speed with no impact on system

timing.

To use these emulators, the target board must include a header

that connects the processor’s JTAG port to the emulator.

For details on target board design issues including mechanical

layout, single processor connections, multiprocessor scan

chains, signal buffering, signal termination, and emulator pod

logic, see EE-68: Analog Devices JTAG Emulation Technical Ref-

Rev. PrD

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

PIN DESCRIPTIONS

ADSP-BF538/ADSP-BF538F processor pin definitions are listed

in Table 10. In order to maintain maximum functionality and

reduce package size and pin count, some pins have dual, multi-

plexed functionality. In cases where pin functionality is

reconfigurable, the default state is shown in plain text, while

alternate functionality is shown in italics.

Table 10. Pin Descriptions

Pin Name

I/O

Function

Driver Type

Memory Interface

ADDR19–1

O

I/O

O

I

Address Bus for Async/Sync Access

Data Bus for Async/Sync Access

A

DATA15–0

ABE1–0/SDQM1–0

Byte Enables/Data Masks for Async/Sync Access

Bus Request (This pin should be pulled HIGH when not used.)

Bus Grant

A

BR

BG

O

A

BGH

Bus Grant Hang

Asynchronous Memory Control

AMS3–0

O

I

Bank Select

A

ARDY

Hardware Ready Control (This pin should always be pulled LOW when not used.)

AOE

O

Output Enable

Read Enable

Write Enable

A

ARE

AWE

Flash Control

FCE

I

Flash Enable (This pin should be left unconnected if not used.)

Flash Reset (This pin should be left unconnected if not used.)

FRESET

Synchronous Memory Control

SRAS

O

Row Address Strobe

Column Address Strobe

Write Enable

A

B

SCAS

SWE

SCKE

Clock Enable

CLKOUT

SA10

Clock Output

A10 Pin

A

SMS

Bank Select

Timers

TMR0

I/O

Timer 0

C

TMR1/PPI_FS1

Timer 1/PPI Frame Sync1

TMR2/PPI_FS2

Timer 2/PPI Frame Sync2

Two Wire Interface Port (These pins are open drain and require a pullup resistor. See version 2.1 of the I²C specification for

proper resistor values.)

SDA0

SCL0

SDA1

SCL1

I/O 5V

TWI0 Serial Data

TWI0 Serial Clock

TWI1 Serial Data

TWI1 Serial Clock

E

Rev. PrD

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Table 10. Pin Descriptions (Continued)

Pin Name

Serial Port0

RSCLK0

RFS0

I/O

Function

Driver Type

I/O

I

SPORT0 Receive Serial Clock

SPORT0 Receive Frame Sync

SPORT0 Receive Data Primary

SPORT0 Receive Data Secondary

SPORT0 Transmit Serial Clock

SPORT0 Transmit Frame Sync

SPORT0 Transmit Data Primary

SPORT0 Transmit Data Secondary

D

C

DR0PRI

DR0SEC

TSCLK0

TFS0

I

I/O

O

D

C

DT0PRI

DT0SEC

Serial Port1

RSCLK1

RFS1

O

I/O

I

SPORT1 Receive Serial Clock

SPORT1 Receive Frame Sync

SPORT1 Receive Data Primary

SPORT1 Receive Data Secondary

SPORT1 Transmit Serial Clock

SPORT1 Transmit Frame Sync

SPORT1 Transmit Data Primary

SPORT1 Transmit Data Secondary

D

C

DR1PRI

DR1SEC

TSCLK1

TFS1

I

I/O

O

D

C

DT1PRI

DT1SEC

SPI0 Port

MOSI0

O

I/O

SPI0 Master Out Slave In

C

MISO0

SPI0 Master In Slave Out (This pin should always be pulled HIGH through a 4.7 C

KΩ resistor if booting via the SPI port.)

SCK0

I/O

SPI0 Clock

D

UART0 Port

RX0

I

UART Receive

UART Transmit

TX0

O

C

PPI Port

PPI3–0

PPI_CLK

I/O

I

PPI3–0

PPI Clock

Port C: Controller Area Network/GPIO

CANTX/PC0

CANRX/PC1

PC[9:4]

I/O 5V

I/O

CAN Transmit/GPIO

CAN Receive/GPIO

GPIO

C

Port D: SPI1/SPI2/UART1/UART2/GPIO

MOSI1/PD0

MISO1/PD1

SCK1/PD2

I/O

SPI1 Master Out Slave In/GPIO

SPI1 Master In Slave Out/GPIO

SPI1 Clock/GPIO

C

D

C

SPI1SS/PD3

SPI1SEL/PD4

MOSI2/PD5

MISO2/PD6

SPI1 Slave Select Input/GPIO

SPI1 Slave Select Enable/GPIO

SPI2 Master Out Slave In/GPIO

SPI2 Master In Slave Out/GPIO

Rev. PrD

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Table 10. Pin Descriptions (Continued)

Pin Name

I/O

Function

Driver Type

SCK2/PD7

SPI2 Clock/GPIO

D

C

SPI2SS/PD8

SPI2SEL/PD9

RX1/PD10

SPI2 Slave Select Input/GPIO

SPI2 Slave Select Enable/GPIO

UART1 Receive/GPIO

UART1 Transmit/GPIO

UART2 Receive/GPIO

UART2 Transmit/GPIO

TX1/PD11

RX2/PD12

TX2/PD13

Port E: SPORT2/SPORT3/GPIO

RSCLK2/PE0

RFS2/PE1

I/O

SPORT2 Receive Serial Clock/GPIO

SPORT2 Receive Frame Sync/GPIO

SPORT2 Receive Data Primary/GPIO

SPORT2 Receive Data Secondary/GPIO

SPORT2 Transmit Serial Clock/GPIO

SPORT2 Transmit Frame Sync/GPIO

SPORT2 Transmit Data Primary/GPIO

SPORT2 Transmit Data Secondary/GPIO

SPORT3 Receive Serial Clock/GPIO

SPORT3 Receive Frame Sync/GPIO

SPORT3 Receive Data Primary/GPIO

SPORT3 Receive Data Secondary/GPIO

SPORT3 Transmit Serial Clock/GPIO

SPORT3 Transmit Frame Sync/GPIO

SPORT3 Transmit Data Primary/GPIO

SPORT3 Transmit Data Secondary/GPIO

D

C

D

C

D

C

D

C

DR2PRI /PE2

DR2SEC/PE3

TSCLK2/PE4

TFS2/PE5

DT2PRI/PE6

DT2SEC/PE7

RSCLK3/PE8

RFS3/PE9

DR3PRI/PE10

DR3SEC/PE11

TSCLK3/PE12

TFS3/PE13

DT3PRI/PE14

DT3SEC/PE15

Port F: Parallel Peripheral Interface Port/SPI0/Timers/GPIO

SPI0SS/PF0

I/O

SPI Slave Select Input/GPIO

C

SPI0SEL1/TMRCLK/PF1

SPI0SEL2/PF2

PPI_FS3/SPI0SEL3/PF3

PPI15/SPI0SEL4/PF4

PPI14/SPI0SEL5/PF5

PPI13/SPI0SEL6/PF6

PPI12/SPI0SEL7/PF7

PPI11/PF8

SPI Slave Select Enable 1/External Timer Reference/GPIO

SPI Slave Select Enable 2/GPIO

PPI Frame Sync 3/SPI Slave Select Enable 3/GPIO

PPI 15/SPI Slave Select Enable 4/GPIO

PPI 14/SPI Slave Select Enable 5/GPIO

PPI 13/SPI Slave Select Enable 6/GPIO

PPI 12/SPI Slave Select Enable 7/GPIO

PPI 11/GPIO

C

PPI10/PF9

PPI 10/GPIO

PPI9/PF10

PPI 9/GPIO

PPI8/PF11

PPI 8/GPIO

PPI7/PF12

PPI 7/GPIO

PPI6/PF13

PPI 6/GPIO

PPI5/PF14

PPI 5/GPIO

PPI4/PF15

PPI 4/GPIO

Rev. PrD

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Table 10. Pin Descriptions (Continued)

Pin Name

Real Time Clock

RTXI

I/O

Function

Driver Type

I

RTC Crystal Input

RTXO

O

RTC Crystal Output

JTAG Port

TCK

I

JTAG Clock

TDO

O

I

JTAG Serial Data Out

JTAG Serial Data In

JTAG Mode Select

C

TDI

TMS

I

TRST

I

JTAG Reset (This pin should be pulled LOW if the JTAG port will not be used.)

Emulation Output

EMU

O

C

Clock

CLKIN

I

Clock/Crystal Input

Crystal Output

XTAL

O

Mode Controls

RESET

I

Reset

NMI

Non-maskable Interrupt (This pin should be pulled HIGH when not used.)

Boot Mode Strap

BMODE1–0

Voltage Regulator

VROUT0

VROUT1

GPW

O

External FET Drive 0

External FET Drive 1

O

I/O

General-purpose regulator wakeup (This pin should be pulled HIGH when not

used)

Supplies

VDDEXT

VDDINT

VDDRTC

GND

P

G

I/O Power Supply

Internal Power Supply

Real Time Clock Power Supply

Ground

Rev. PrD

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Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

SPECIFICATIONS

Note that component specifications are subject to change

without notice.

OPERATING CONDITIONS

Parameter¹

Min

0.8

Nominal

1.2

Max

1.32

3.6

Unit

V

V_DDINT

V_DDEXT

V_DDRTC

V_IH

Internal Supply Voltage

External Supply Voltage

2.25

2.0

3.3

V

Real Time Clock Power Supply Voltage

High Level Input Voltage², @ V_DDEXT=maximum

High Level Input Voltage³, @ V_DDEXT=maximum

Low Level Input Voltage^{2, 4}, @ V_DDEXT=minimum

3.6

V

3.6

V

V_IHCLKIN

V_IL

2.2

3.6

V

–0.3

0.6

V

¹Specifications subject to change without notice.

²The 3.3 V tolerant pins are capable of accepting up to 3.6 V maximum V_IHThe following bi-directional pins are 3.3 V tolerant: DATA15–0, MISO0, MOSI0, PF15–0, PPI3–0,

SCK1, MISO1, MOSI1, SPI1SS, SPI1SEL, SCK2, MISO2, MOSI2, SPI2SS, SPI2SEL, RX1, TX1, RX2, TX2, DT2PRI, DT2SEC, TSCLK2, DR2PRI, DT2SEC, RSCLK2, RFS2,

TFS2, DT3PRI, DT3SEC, DR3PRI, DR3SEC, RSCLK3, RFS3, TFS3, RFS0, RFS1, RSCLK0, RSCLK1, TSCLK0, TSCLK1, SCK0, TFS0, TFS1, and TMR2–0. The following

input-only pins are 3.3 V tolerant: RESET, RX0, TCK, TDI, TMS, TRST, ARDY, BMODE1–0, BR, DR0PRI, DR0SEC, DR1PRI, DR1SEC, NMI, PPI_CLK, RTXI, and GP.

³Parameter value applies to the CLKIN pins.

⁴Parameter value applies to all input and bi-directional pins.

OPERATING CONDITIONS—APPLIES TO 5V TOLERANT PINS

Parameter¹

Min

2.0

Nominal

Max

5.5

Unit

V

2

V_IH

5

High Level Input Voltage, @ V_DDEXT=maximum

Low Level Input Voltage, @ V_DDEXT=minimum

V

2

V_IL

5

–0.3

0.8

V

¹Specifications subject to change without notice.

²The 5.V tolerant pins are capable of accepting up to 5.5 V maximum V_IH. The following bi-directional pins are 5 V tolerant: SCL0, SCL1, SDA0, SDA1, CANRX, CANTX.

ELECTRICAL CHARACTERISTICS

Parameter¹

Test Conditions

Min

Max

Unit

V

V_OH

V_OL

I_IH

High Level Output Voltage²

@ V_DDEXT=3.0V, I_OH= –0.5 mA

2.4

Low Level Output Voltage²

High Level Input Current³

Low Level Input Current⁴

Three-State Leakage Current⁴

Three-State Leakage Current⁵

Input Capacitance^{5, 6}

@ V_DDEXT=3.0V, I_OL= 2.0 mA

0.4

V

@ V_DDEXT=maximum, V_IN= V_DDmaximum

@ V_DDEXT=maximum, V_IN= 0 V

@ V_DDEXT= maximum, V_IN= V_DDmaximum

@ V_DDEXT= maximum, V_IN= 0 V

f_IN= 1 MHz, T_AMBIENT= 25°C, V_IN= 2.5 V

TBD

10

μA

pF

I_IL

I_OZH

I_OZL

C_IN

10

TBD

¹Specifications subject to change without notice.

²Applies to output and bidirectional pins.

³Applies to input pins.

⁴Applies to three-statable pins.

⁵Applies to all signal pins.

⁶Guaranteed, but not tested.

Rev. PrD

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

ABSOLUTE MAXIMUM RATINGS

PACKAGE INFORMATION

Stresses greater than those listed below may cause permanent

damage to the device. These are stress ratings only. Functional

operation of the device at these or any other conditions greater

than those indicated in the operational sections of this specifica-

tion is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

The information presented in Figure 9 and Table 12 provides

information about how to read the package brand and relate it

to specific product features. For a complete listing of product

offerings, see the Ordering Guide on Page 55.

a

ADSP-BF5xx

Parameter

Rating

Internal (Core) Supply Voltage (V_DDINT

)

–0.3 V to +1.4 V

–0.3 V to +3.8 V

–0.5 V to +3.6 V

–0.5 V to +5.5 V

–0.5 V to V_DDEXT+0.5 V

200 pF

tppZccc

vvvvvv.x n.n

External (I/O) Supply Voltage (V_DDEXT

)

Input Voltage

Input Voltage¹

yyww country_of_origin

B

Output Voltage Swing

Load Capacitance

Figure 9. Product Information on Package

Storage Temperature Range

–65°C to +150°C

+125°C

Junction Temperature Under bias

Table 12. Package Brand Information

¹The 5.V tolerant pins are capable of accepting up to 5.5 V maximum V_IH. The

following bi-directional pins are 5 V tolerant: SCL0, SCL1, SDA0, SDA1,

CANRX, CANTX. For other duty cycles, see Table 11.

Brand Key

Field Description

Temperature Range

Package Type

t

pp

Table 11. Maximum Duty Cycle for Input¹Transient Voltage

Z

Lead Free Option (optional)

See Ordering Guide

Assembly Lot Code

Silicon Revision

V_INMax (V)²

3.63

V_INMin (V)

–0.33

Maximum Duty Cycle

ccc

100%

48%

30%

20%

10%

8%

vvvvvv.x

n.n

3.80

–0.50

3.90

–0.60

yyww

Date Code

4.00

–0.70

4.10

–0.80

4.20

–0.90

4.30

–1.00

5%

¹Applies to all signal pins with the exception of CLKIN, XTAL, and VROUT1–0.

²Only one of the listed options can apply to a particular design.

ESD SENSITIVITY

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the ADSP-BF538/ADSP-BF538F processors feature proprietary ESD protection circuitry, permanent

damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper

ESD precautions are recommended to avoid performance degradation or loss of functionality.

Rev. PrD

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Page 23 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

TIMING SPECIFICATIONS

Table 13 describes the timing requirements for the ADSP-

BF538/ADSP-BF538F processor clocks. Take care in selecting

MSEL, SSEL, and CSEL ratios so as not to exceed the maximum

core clock, system clock and Voltage Controlled Oscillator

(VCO) operating frequencies, as described in Absolute Maxi-

mum Ratings on Page 23. Table 14 describes Phase Locked

Loop operating conditions.

Table 13. Core and System Clock Requirements—ADSP-BF538/ADSP-BF538F—500 MHz

Parameter

f_CCLK

Min

Max

500

444

400

333

Unit

MHz

Core Clock Frequency (V_DDINT= 1.2 V minimum)

Core Clock Frequency (V_DDINT= 1.045 V minimum)

Core Clock Frequency (V_DDINT= 0.95 V minimum)

Core Clock Frequency (V_DDINT= 0.85 V minimum)

f_CCLK

Table 14. Phase Locked Loop Operating Conditions

Parameter

Min

Max

Unit

f_VCO

Voltage Controlled Oscillator (VCO) Frequency

50

Max CCLK

MHz

Clock and Reset Timing

Table 15 and Figure 10 describe clock and reset operations. Per

Absolute Maximum Ratings on Page 23, combinations of

CLKIN and clock multipliers must not select core/peripheral

clocks in excess of 500/133 MHz.

Table 15. Clock and Reset Timing

Parameter

Min

Max

100.0

Unit

Timing Requirements

t_CKIN

CLKIN Period

CLKIN Low Pulse¹

CLKIN High Pulse¹

RESET Asserted Pulsewidth Low²

20.0

8.0

ns

t_CKINL

t_CKINH

t_WRST

8.0

11 t_CKIN

¹Applies to bypass mode and non-bypass mode.

²Applies after power-up sequence is complete. At power-up, the processor’s internal phase locked loop requires no more than 2000 CLKIN cycles, while RESET is asserted,

assuming stable power supplies and CLKIN (not including startup time of external clock oscillator).

t_CKIN

CLKIN

t_CKINL

t_CKINH

t_WRST

RESET

Figure 10. Clock and Reset Timing

Rev. PrD

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Asynchronous Memory Read Cycle Timing

Table 16 and Table 17 on Page 26 and Figure 11 and Figure 12

on Page 26 describe asynchronous memory read cycle opera-

tions for synchronous and for asynchronous ARDY.

Table 16. Asynchronous Memory Read Cycle Timing with Synchronous ARDY

Parameter

Min

Max

Unit

Timing Requirements

t_SDAT

t_HDAT

t_SARDY

t_HARDY

t_DO

DATA15–0 Setup Before CLKOUT

DATA15–0 Hold After CLKOUT

2.1

ns

0.8

ARDY Setup Before the Falling Edge of CLKOUT

ARDY Hold After the Falling Edge of CLKOUT

Output Delay After CLKOUT¹

TBD

6.0

t_HO

Output Hold After CLKOUT¹

0.8

¹Output pins include AMS3–0, ABE1–0, ADDR19–1, AOE, ARE.

HOLD

1 CYCLE

SETUP

2 CYCLES

PROGRAMMED READ ACCESS

4 CYCLES

ACCESS EXTENDED

3 CYCLES

CLKOUT

t_DO

t_HO

AMSx

ABE1–0

BE, ADDRESS

ADDR19–1

AOE

t_DO

t_HO

ARE

t_HARDY

t_SARDY

t_HARDY

ARDY

t_SARDY

t_SDAT

t_HDAT

DATA15–0

READ

Figure 11. Asynchronous Memory Read Cycle Timing with Synchronous ARDY

Rev. PrD

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Table 17. Asynchronous Memory Read Cycle Timing with Asynchronous ARDY

Parameter

Min

Max

Unit

Timing Requirements

t_SDAT

t_HDAT

t_DANR

DATA15–0 Setup Before CLKOUT

DATA15–0 Hold After CLKOUT

ARDY Negated Delay from AMSx Asserted¹

2.1

0.8

ns

(S + RA – 2) × t_SCLK

t_HAA

t_DO

t_HO

ARDY Asserted Hold After ARE Negated

Output Delay After CLKOUT²

Output Hold After CLKOUT²

0.0

0.8

ns

6.0

¹S = number of programmed setup cycles, RA = number of programmed read access cycles.

²Output pins include AMS3–0, ABE1–0, ADDR19–1, AOE, ARE.

HOLD

1 CYCLE

SETUP

2 CYCLES

PROGRAMMED READ ACCESS

4 CYCLES

ACCESS EXTENDED

CLKOUT

t_DO

t_H

AMSx

ABE1–0

BE, ADDRESS

ADDR19–1

AOE

t_DO

t_HO

ARE

t_HAA

t_DANR

ARDY

t_SDAT

t_HDAT

DATA15–0

READ

Figure 12. Asynchronous Memory Read Cycle Timing with Asynchronous ARDY

Rev. PrD

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Page 26 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Asynchronous Memory Write Cycle Timing

Table 18 and Table 19 on Page 28 and Figure 13 and Figure 14

on Page 28 describe asynchronous memory write cycle opera-

tions for synchronous and for asynchronous ARDY.

Table 18. Asynchronous Memory Write Cycle Timing with Synchronous ARDY

Parameter

Min

Max

Unit

Timing Requirements

t_SARDY

t_HARDY

Switching Characteristics

ARDY Setup Before the Falling Edge of CLKOUT

TBD

ns

ARDY Hold After the Falling Edge of CLKOUT

t_DDAT

t_ENDAT

t_DO

DATA15–0 Disable After CLKOUT

6.0

ns

DATA15–0 Enable After CLKOUT

Output Delay After CLKOUT¹

Output Hold After CLKOUT¹

1.0

0.8

t_HO

¹Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.

ACCESS

EXTENDED

1 CYCLE

SETUP

2 CYCLES

HOLD

1 CYCLE

PROGRAMMED WRITE

ACCESS 2 CYCLES

CLKOUT

AMSx

t_DO

t_HO

ABE1–0

BE, ADDRESS

ADDR19–1

t_DO

t_HO

AWE

t_SARDY

ARDY

t_SARDY

t_HARDY

t_DDAT

t_ENDAT

DATA15–0

WRITE DATA

Figure 13. Asynchronous Memory Write Cycle Timing with Synchronous ARDY

Rev. PrD

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Page 27 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Table 19. Asynchronous Memory Write Cycle Timing with Asynchronous ARDY

Parameter

Min

Max

Unit

Timing Requirements

t_DANR

t_HAA

ARDY Negated Delay from AMSx Asserted¹

ns

(S + WA – 2) × t_SCLK

ARDY Asserted Hold After ARE Negated

0.0

Switching Characteristics

t_DDAT

t_ENDAT

t_DO

DATA15–0 Disable After CLKOUT

6.0

ns

DATA15–0 Enable After CLKOUT

Output Delay After CLKOUT²

Output Hold After CLKOUT²

1.0

0.8

t_HO

¹S = number of programmed setup cycles, WA = number of programmed write access cycles.

²Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.

ACCESS

EXTENDED

SETUP

2 CYCLES

HOLD

1 CYCLE

PROGRAMMED WRITE

ACCESS 2 CYCLES

CLKOUT

AMSx

t_DO

t_HO

ABE1–0

BE, ADDRESS

ADDR19–1

t_DO

t_HO

AWE

t_DANW

t_HAA

ARDY

t_ENDAT

DATA15–0

WRITE DATA

Figure 14. Asynchronous Memory Write Cycle Timing with Asynchronous ARDY

Rev. PrD

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Page 28 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

SDRAM Interface Timing

Table 20. SDRAM Interface Timing

Parameter

Min

Max

Unit

Timing Requirements

t_SSDAT

t_HSDAT

DATA Setup Before CLKOUT

DATA Hold After CLKOUT

2.1

0.8

ns

Switching Characteristics

t_SCLK

CLKOUT Period

7.5

2.5

ns

t_SCLKH

t_SCLKL

t_DCAD

t_HCAD

t_DSDAT

t_ENSDAT

CLKOUT Width High

CLKOUT Width Low

Command, ADDR, Data Delay After CLKOUT¹

Command, ADDR, Data Hold After CLKOUT¹

Data Disable After CLKOUT

Data Enable After CLKOUT

6.0

0.8

1.0

¹Command pins include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.

t_SCLK

t_SCLKH

CLKOUT

t_SSDAT

t_SCLKL

t_HSDAT

DATA (IN)

t_DCAD

t_DSDAT

t_ENSDAT

t_HCAD

DATA(OUT)

t_DCAD

CMND ADDR

(OUT)

t_HCAD

NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.

Figure 15. SDRAM Interface Timing

Rev. PrD

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Page 29 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

External Port Bus Request and Grant Cycle Timing

Table 21 and Table 22 on Page 31 and Figure 16 and Figure 17

on Page 31 describe external port bus request and grant cycle

operations for synchronous and for asynchronous BR.

Table 21. External Port Bus Request and Grant Cycle Timing with Synchronous BR

Parameter

Min

Max

Unit

Timing Requirements

t_BS

t_BH

BR Setup to Falling Edge of CLKOUT

TBD

ns

Falling Edge of CLKOUT to BR Deasserted Hold Time

Switching Characteristics

t_SD

CLKOUT Low to xMS, Address, and RD/WR disable

4.5

3.6

ns

t_SE

CLKOUT Low to xMS, Address, and RD/WR enable

CLKOUT High to BG High Setup

t_DBG

t_EBG

t_DBH

t_EBH

CLKOUT High to BG Deasserted Hold Time

CLKOUT High to BGH High Setup

CLKOUT High to BGH Deasserted Hold Time

CLKOUT

t_BH

t_BS

BR

t_SD

t_SE

AMSx

t_SD

t_SE

ADDR19-1

ABE1-0

t_SD

t_SE

AWE

ARE

t_DBG

t_EBG

BG

t_DBH

t_EBH

BGH

Figure 16. External Port Bus Request and Grant Cycle Timing with Synchronous BR

Rev. PrD

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Page 30 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Table 22. External Port Bus Request and Grant Cycle Timing with Asynchronous BR

Parameter

Min

Max

Unit

Timing Requirements

t_WBR

BR Pulsewidth

2 x t_SCLK

ns

Switching Characteristics

t_SD

CLKOUT Low to xMS, Address, and RD/WR disable

4.5

3.6

ns

t_SE

CLKOUT Low to xMS, Address, and RD/WR enable

CLKOUT High to BG High Setup

t_DBG

t_EBG

t_DBH

t_EBH

CLKOUT High to BG Deasserted Hold Time

CLKOUT High to BGH High Setup

CLKOUT High to BGH Deasserted Hold Time

CLKOUT

t_WBR

BR

t_SD

t_SE

AMSx

t_SD

t_SE

ADDR19-1

ABE1-0

t_SD

t_SE

AWE

ARE

t_DBG

t_EBG

BG

t_DBH

t_EBH

BGH

Figure 17. External Port Bus Request and Grant Cycle Timing with Asynchronous BR

Rev. PrD

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Page 31 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Parallel Peripheral Interface Timing

Table 23 and Figure 18, Figure 19, Figure 20, and Figure 21

describe Parallel Peripheral Interface operations.

Table 23. Parallel Peripheral Interface Timing

Parameter

Min

Max

Unit

Timing Requirements

t_PCLKW

t_PCLK

PPI_CLK Width

PPI_CLK Period¹

6.0

15.0

3.0

2.0

4.0

ns

t_SFSPE

External Frame Sync Setup Before PPI_CLK

External Frame Sync Hold After PPI_CLK

Receive Data Setup Before PPI_CLK

Receive Data Hold After PPI_CLK

t_HFSPE

t_SDRPE

t_HDRPE

Switching Characteristics — GP Output and Frame Capture Modes

t_DFSPE

t_HOFSPE

t_DDTPE

t_HDTPE

Internal Frame Sync Delay After PPI_CLK

Internal Frame Sync Hold After PPI_CLK

Transmit Data Delay After PPI_CLK

Transmit Data Hold After PPI_CLK

10.0

ns

0.0

¹PPI_CLK frequency cannot exceed f_SCLK/2

FRAME

SYNC IS

DRIVEN

OUT

DATA0

IS

SAMPLED

POLC = 0

PPI_CLK

POLC = 1

t

DFSPE

t

HOFSPE

POLS = 1

PPI_FS1

POLS = 0

POLS = 1

PPI_FS2

POLS = 0

t

SDRPE

HDRPE

PPI_DATA

Figure 18. PPI GP Rx Mode with Internal Frame Sync Timing

Rev. PrD

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Page 32 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

FRAME

SYNC IS

SAMPLED

FOR

DATA0 IS

DATA1 IS

SAMPLED

DATA0

SAMPLED

PPI_CLK

POLC = 0

PPI_CLK

POLC = 1

t

HFSPE

t

SFSPE

POLS = 1

POLS = 0

PPI_FS1

POLS = 1

POLS = 0

PPI_FS2

t

SDRPE

HDRPE

PPI_DATA

Figure 19. PPI GP Rx Mode with External Frame Sync Timing

FRAME

SYNC IS

SAMPLED

DATA0 IS

DRIVEN

OUT

PPI_CLK

POLC = 0

PPI_CLK

POLC = 1

t

HFSPE

t

SFSPE

POLS = 1

POLS = 0

PPI_FS1

POLS = 1

POLS = 0

PPI_FS2

t

HDTPE

PPI_DATA

DATA0

t

DDTPE

Figure 20. PPI GP Tx Mode with External Frame Sync Timing

Rev. PrD

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Page 33 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

FRAME

SYNC IS

DATA0 IS

DRIVEN

OUT

REFERENCED

TO THIS CLOCK

EDGE

PPI_CLK

POLC = 0

PPI_CLK

POLC = 1

t

DFSPE

t

HOFSPE

POLS = 1

PPI_FS1

POLS = 0

POLS = 1

PPI_FS2

POLS = 0

t

DDTPE

t

HDTPE

PPI_DATA

DATA0

Figure 21. PPI GP Tx Mode with Internal Frame Sync Timing

Rev. PrD

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Page 34 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Serial Port Timing

Table 24 through Table 27 on Page 36 and Figure 22 on Page 36

through Figure 24 on Page 38 describe Serial Port operations.

Table 24. Serial Ports—External Clock

Parameter

Min

Max

Unit

Timing Requirements

t_SFSE

TFS/RFS Setup Before TSCLK/RSCLK (externally generated TFS/RFS)¹

3.0

4.5

15.0

ns

t_HFSE

TFS/RFS Hold After TSCLK/RSCLK (externally generated TFS/RFS)¹

Receive Data Setup Before RSCLK¹

Receive Data Hold After RSCLK¹

TSCLK/RSCLK Width

t_SDRE

t_HDRE

t_SCLKEW

t_SCLKE

TSCLK/RSCLK Period

Switching Characteristics

t_DFSE

t_HOFSE

t_DDTE

t_HDTE

TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)²

TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)²

Transmit Data Delay After TSCLK²

10.0

ns

0.0

Transmit Data Hold After TSCLK²

¹Referenced to sample edge.

²Referenced to drive edge.

Table 25. Serial Ports—Internal Clock

Parameter

Min

Max

Unit

Timing Requirements

t_SFSI

TFS/RFS Setup Before TSCLK/RSCLK (externally generated TFS/RFS)¹

8.0

ns

t_HFSI

TFS/RFS Hold After TSCLK/RSCLK (externally generated TFS/RFS)¹

Receive Data Setup Before RSCLK¹

Receive Data Hold After RSCLK¹

TSCLK/RSCLK Width

–2.0

6.0

t_SDRI

t_HDRI

t_SCLKEW

t_SCLKE

0.0

4.5

TSCLK/RSCLK Period

15.0

Switching Characteristics

t_DFSI

TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)²

TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)²

Transmit Data Delay After TSCLK²

3.0

ns

t_HOFSI

t_DDTI

–1.0

t_HDTI

Transmit Data Hold After TSCLK²

–2.0

4.5

t_SCLKIW

TSCLK/RSCLK Width

¹Referenced to sample edge.

²Referenced to drive edge.

Table 26. Serial Ports—Enable and Three-State

Parameter

Min

0

Max

Unit

Switching Characteristics

t_DTENE

t_DDTTE

t_DTENI

t_DDTTI

Data Enable Delay from External TSCLK¹

Data Disable Delay from External TSCLK¹

Data Enable Delay from Internal TSCLK¹

Data Disable Delay from Internal TSCLK¹

ns

10.0

3.0

–2.0

¹Referenced to drive edge.

Rev. PrD

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Page 35 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Table 27. External Late Frame Sync

Parameter

Min

Max

Unit

Switching Characteristics

t_DDTLFSE

t_DTENLFS

Data Delay from Late External TFS or External RFS with MCE = 1, MFD = 0^{1, 2}

Data Enable from late FS or MCE = 1, MFD = 0^{1, 2}

10.0

ns

0

¹MCE = 1, TFS enable and TFS valid follow t_DTENLFSand t_DDTLFSE

²If external RFS/TFS setup to RSCLK/TSCLK > t_SCLKE/2, then t_DDTE/Iand t_DTENE/Iapply; otherwise t_DDTLFSEand t_DTENLFSapply.

.

DATA RECEIVE- INTERNAL CLOCK

DATA RECEIVE- EXTERNAL CLOCK

DRIVE

EDGE

SAMPLE

EDGE

DRIVE

EDGE

SAMPLE

EDGE

t_SCLKIW

t_SCLKEW

RSCLK

t_DFSE

t_HOFSE

RFS

t_SFSI

t_HFSI

t_HOFSE

t_SFSE

t_HFSE

RFS

t_SDRI

t_HDRI

t_SDRE

t_HDRE

DR

NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK OR TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.

DATA TRANSMIT- INTERNAL CLOCK

DATA TRANSMIT- EXTERNAL CLOCK

DRIVE

EDGE

SAMPLE

EDGE

DRIVE

EDGE

SAMPLE

EDGE

t_SCLKIW

t_SCLKEW

TSCLK

t_DFSI

t_DFSE

t_HOFSI

t_SFSI

t_HFSI

t_HOFSE

t_SFSE

t_HFSE

TFS

DT

TFS

t_DDTI

t_DDTE

t_HDTI

t_HDTE

DT

NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK OR TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.

DRIVE

EDGE

DRIVE

EDGE

TSCLK (EXT)

TFS ("LATE", EXT.)

TSCLK / RSCLK

t_DDTTE

t_DTENE

DT

DRIVE

EDGE

DRIVE

EDGE

TSCLK (INT)

TFS ("LATE", INT.)

TSCLK / RSCLK

t_DTENI

t_DDTTI

DT

Figure 22. Serial Ports

Rev. PrD

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Page 36 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

EXTERNAL RFS WITH MCE = 1, MFD = 0

DRIVE

SAMPLE

DRIVE

RSCLK

RFS

t_HOFSE/I

t_SFSE/I

t_DDTE/I

t_DTENLFSE

t_HDTE/I

1ST BIT

2ND BIT

DT

t_DDTLFSE

LATE EXTERNAL TFS

DRIVE

SAMPLE

DRIVE

TSCLK

TFS

t_SFSE/I

t_HOFSE/I

t_DDTE/I

t_DTENLFSE

t_HDTE/I

DT

1ST BIT

2ND BIT

t_DDTLFSE

Figure 23. External Late Frame Sync (Frame Sync Setup < t_SCLKE/2)

Rev. PrD

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Page 37 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

EXTERNAL RFS WITH MCE = 1, MFD = 0

DRIVE

SAMPLE

DRIVE

RSCLK

RFS

t_SFSE/I

t_HOFSE/I

t_DDTE/I

t_HDTE/I

t_DTENLSCK

1ST BIT

DT

2ND BIT

t_DDTLSCK

LATE EXTERNAL TFS

DRIVE

SAMPLE

DRIVE

TSCLK

TFS

t_SFSE/I

t_HOFSE/I

t_DDTE/I

t_HDTE/I

t_DTENLSCK

DT

1ST BIT

2ND BIT

t_DDTLSCK

Figure 24. External Late Frame Sync (Frame Sync Setup > t_SCLKE/2)

Rev. PrD

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Page 38 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Serial Peripheral Interface Port—Master Timing

Table 28 and Figure 25 describe SPI port master operations.

Table 28. Serial Peripheral Interface (SPI) Port—Master Timing

Parameter

Min

Max

Unit

Timing Requirements

t_SSPIDM

t_HSPIDM

Switching Characteristics

Data Input Valid to SCK Edge (Data Input Setup)

7.5

ns

SCK Sampling Edge to Data Input Invalid

–1.5

t_SDSCIM

t_SPICHM

t_SPICLM

t_SPICLK

SPI0SELx Low to First SCK edge (x=0 or 1)

2t_SCLK–1.5

4t_SCLK–1.5

2t_SCLK–1.5

0

ns

Serial Clock High period

Serial Clock Low period

Serial Clock Period

t_HDSM

Last SCK Edge to SPI0SELx High (x=0 or 1)

Sequential Transfer Delay

t_SPITDM

t_DDSPIDM

t_HDSPIDM

SCK Edge to Data Out Valid (Data Out Delay)

SCK Edge to Data Out Invalid (Data Out Hold)

6

–1.0

4.0

SPISELx

(OUTPUT)

t_SPICLK

t_HDSM

t_SPITDM

t_SDSCIM

t_SPICHM

t_SPICLM

SCK

(CPOL = 0)

(OUTPUT)

t_SPICLM

t_SPICHM

SCK

(CPOL = 1)

(OUTPUT)

t_DDSPIDM

t_HDSPIDM

MOSI

(OUTPUT)

MSB

LSB

CPHA=1

t_SSPIDM

t_HSPIDM

t_SSPIDM

t_HSPIDM

MISO

(INPUT)

MSB VALID

LSB VALID

t_DDSPIDM

t_HDSPIDM

MOSI

(OUTPUT)

MSB

LSB

CPHA=0

t_SSPIDM

t_HSPIDM

MISO

(INPUT)

MSB VALID

LSB VALID

Figure 25. Serial Peripheral Interface (SPI) Port—Master Timing

Rev. PrD

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Page 39 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Serial Peripheral Interface Port—Slave Timing

Table 29 and Figure 26 describe SPI port slave operations.

Table 29. Serial Peripheral Interface (SPI) Port—Slave Timing

Parameter

Min

Max

Unit

Timing Requirements

t_SPICHS

t_SPICLS

t_SPICLK

t_HDS

Serial Clock High Period

2t_SCLK–1.5

4t_SCLK–1.5

2t_SCLK–1.5

1.6

ns

Serial Clock low Period

Serial Clock Period

Last SCK Edge to SPI0SS Not Asserted

Sequential Transfer Delay

t_SPITDS

t_SDSCI

t_SSPID

t_HSPID

SPI0SS Assertion to First SCK Edge

Data Input Valid to SCK Edge (Data Input Setup)

SCK Sampling Edge to Data Input Invalid

1.6

Switching Characteristics

t_DSOE

SPI0SS Assertion to Data Out Active

0

8

ns

t_DSDHI

t_DDSPID

t_HDSPID

SPI0SS Deassertion to Data High impedance

SCK Edge to Data Out Valid (Data Out Delay)

SCK Edge to Data Out Invalid (Data Out Hold)

8

10

SPISS

(INPUT)

t_SPICHS

t_SPICLS

t_SPICLK

t_HDS

t_SPITDS

SCK

(CPOL = 0)

(INPUT)

t_SDSCI

t_SPICLS

t_SPICHS

SCK

(CPOL = 1)

(INPUT)

t_DSOE

t_DDSPID

t_HDSPID

MSB

t_DDSPID

t_DSDHI

LSB

MISO

(OUTPUT)

t_HSPID

t_SSPID

CPHA=1

t_SSPID

t_HSPID

MOSI

(INPUT)

MSB VALID

LSB VALID

t_DSOE

t_DDSPID

t_DSDHI

MISO

(OUTPUT)

MSB

LSB

t_HSPID

CPHA=0

t_SSPID

MOSI

(INPUT)

MSB VALID

LSB VALID

Figure 26. Serial Peripheral Interface (SPI) Port—Slave Timing

Rev. PrD

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Page 40 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

General-Purpose Port Timing

Table 30 and Figure 27 describe general-purpose operations.

Table 30. General-Purpose Port Timing

Parameter

Min

t_SCLK+ 1

0

Max

Unit

ns

Timing Requirement

t_WFI

Switching Characteristic

t_GPODGP Port Pin Output Delay From CLKOUT Low

GP Port Pin Input Pulse Width

6

ns

CLKOUT

t_GPOD

GPP OUTPUT

t_WFI

GPP INPUT

Figure 27. Programmable Flags Cycle Timing

Rev. PrD

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Page 41 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Timer Cycle Timing

Table 31 and Figure 28 describe timer expired operations. The

input signal is asynchronous in “width capture mode” and

“external clock mode” and has an absolute maximum input fre-

quency of f_SCLK/2 MHz.

Table 31. Timer Cycle Timing

Parameter

Min

Max

Unit

Timing Characteristics

t_WL

t_WH

Timer Pulsewidth Input Low¹(measured in SCLK cycles)

Timer Pulsewidth Input High¹(measured in SCLK cycles)

1

SCLK

Switching Characteristic

t_HTO

Timer Pulsewidth Output²(measured in SCLK cycles)

1

(2³²– 1)

SCLK

¹The minimum pulsewidths apply for TMRx input pins in width capture and external clock modes. They also apply to the PF1 or PPI_CLK input pins in PWM output mode.

²The minimum time for t_HTOis one cycle, and the maximum time for t_HTOequals (2³²–1) cycles.

CLKOUT

t_HTO

TMRx

(PWM OUTPUT MODE)

TMRx

t_WL

t_WH

(WIDTH CAPTURE AND

EXTERNAL CLOCK MODES)

Figure 28. Timer PWM_OUT Cycle Timing

Rev. PrD

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Page 42 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

JTAG Test And Emulation Port Timing

Table 32 and Figure 29 describe JTAG port operations.

Table 32. JTAG Port Timing

Parameter

Min

Max

Unit

Timing Requirements

t_TCK

TCK Period

20

4

ns

t_STAP

t_HTAP

t_SSYS

t_HSYS

t_TRSTW

TDI, TMS Setup Before TCK High

TDI, TMS Hold After TCK High

System Inputs Setup Before TCK High¹

System Inputs Hold After TCK High¹

TRST Pulsewidth²(measured in TCK cycles)

ns

4

ns

4

ns

5

ns

4

TCK

Switching Characteristics

t_DTDOTDO Delay from TCK Low

t_DSYS

System Outputs Delay After TCK Low³

10

12

ns

0

¹System Inputs=ARDY, BMODE1–0, BR, DATA15–0.DR0PRI, DR0SEC, DR1PRI, DR1SEC, MISO0, MOSI0, NMI, PF15–0, PPI_CLK, PPI3–0.SCL0, SCL1, SDA0, SDA1,

SCK, SCK1, MISO1, MOSI1, SPI1SS, SPI1SEL, SCK2, MISO2, MOSI2, SPI2SS, SPI2SEL, RX1, TX1, RX2, TX2, DT2PRI, DT2SEC, TSCLK2, DR2PRI, DT2SEC, RSCLK2,

RFS2, TFS2, DT3PRI, DT3SEC, DR3PRI, DR3SEC, RSCLK3, RFS3, TFS3, CANTX, CANRX, RESET, RFS0, RFS1, RSCLK0, RSCLK1, TSCLK0, TSCLK1, RX0,.SCK0, TFS0,

TFS1, and TMR2–0,

²50 MHz Maximum

³System Outputs = AMS, AOE, ARE, AWE, ABE, BG, DATA15–0, DT0PRI, DT0SEC, DT1PRI, DT1SEC, MISO0, MOSI0, PF15–0, PPI3–0, SCK1, MISO1, MOSI1, SPI1SS,

SPI1SEL, SCK2, MISO2, MOSI2, SPI2SS, SPI2SEL, RX1, TX1, RX2, TX2, DT2PRI, DT2SEC, TSCLK2, DR2PRI, DR2SEC, RSCLK2, RFS2, TFS2, DT3PRI, DT3SEC, TSCLK3,

DR3PRI, DR3SEC, RSCLK3, RFS3, TFS3, CANTX, CANRX, RFS0, RFS1, RSCLK0, RSCLK1, TSCLK0, TSCLK1, CLKOUT, TX0, SA10, SCAS, SCK0, SCKE, SMS, SRAS,

SWE, and TMR2–0.

t_TCK

TCK

t_STAP

t_HTAP

TMS

TDI

t_DTDO

TDO

t_SSYS

t_HSYS

SYSTEM

INPUTS

t_DSYS

SYSTEM

OUTPUTS

Figure 29. JTAG Port Timing

Rev. PrD

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Page 43 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

OUTPUT DRIVE CURRENTS

150

100

50

V_DDEXT= 2.25V @ 95°C

V_{DD E XT}= 2.50V @ 25°C

Figure 30 through Figure 37 on Page 45 shows typical current-

voltage characteristics for the output drivers of the ADSP-

BF538/ADSP-BF538F processors. The curves represent the cur-

rent drive capability of the output drivers as a function of output

voltage.

V_DDEXT= 2.75V @

-40°C

V_OH

0

120

-

50

V_DDEXT= 2.25V @ 95°C

V_DDEXT= 2.50V @ 25°C

V_DDEXT= 2.75V @ 40°C

100

80

V_OL

-

100

150

60

40

20

V_OH

-

0

0.5

1.0

1.5

2.0

2.5

3.0

SOURCE VOLTAGE (V)

0

Figure 32. Drive Current B (Low V_DDEXT

)

-20

-40

V_OL

-

60

200

150

-80

V_{DDE XT}= 3.0V @ 95°C

_{DDE XT}= 3.3V @ 25°C

V_{DDEX T}= 3.6V @ 40°C

-

100

V

3. 0

0

0.5

1.0

1.5

2.0

2.5

-

100

50

0

SOURCE VOLTAGE (V)

V_{O H}

Figure 30. Drive Current A (Low V_DDEXT

)

150

100

50

-50

V_DDEXT= 3.0V @ 95°C

_DDEXT= 3.3V @ 25°C

V_DDEXT= 3.6V @ 40°C

-

100

150

200

V

V_OL

-

V_{O H}

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

0

SOURCE VOLTAGE (V)

Figure 33. Drive Current B (High V_DDEXT

)

-50

V_OL

-100

-150

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

SOURCE VOLTAGE (V)

Figure 31. Drive Current A (High V_DDEXT

)

Rev. PrD

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Page 44 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

80

150

100

V_DDEXT= 3.0V @ 95°C

V_DDEXT= 3.3V @ 25°C

V_DDEXT= 2.25V @ 95°C

V_DDEXT= 2.50V @ 25°C

V_DDEXT= 2.75V @ 40°C

60

40

20

0

V

_{DDE XT}= 3.6V @ -40°C

-

50

0

V_OH

-50

V_OL

-20

V_OL

-100

-40

-60

-150

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

3.0

4.0

0

0.5

1.0

1.5

2.0

2.5

3.0

SOURCE VOLTAGE (V)

Figure 34. Drive Current C (Low V_DDEXT

)

Figure 37. Drive Current D (High V_DDEXT)

100

80

0

-10

-20

-30

-40

-50

-60

V_{DDEX T}= 3.0V @ 95°C

_{DDEX T}= 3.3V @ 25°C

V_{DD E XT}= 3.6V @ 40°C

V_{DD E XT}= 2.25V @ 95°C

_{DD E XT}= 2.50V @ 25°C

40°C

V

-

V

_{DDEX T}= 2.75V @

-

60

40

V_OH

20

0

V_OL

-

20

40

60

80

-

V_{O L}

-

0.5

1.0

1.5

2.0

2.5

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

SOURCE VOLTAGE (V)

Figure 35. Drive Current C (High V_DDEXT

)

Figure 38. Drive Current E (Low V_DDEXT

)

100

80

0

-10

-20

V_DDEXT= 2.25V @ 95°C

V_DDEXT= 2.50V @ 25°C

V_{DDEX T}= 3.0V @ 95°C

_{DDEX T}= 3.3V @ 25°C

V_DDEXT= 3.6V @ 40°C

V

V_DDEXT= 2.75V @ -40°C

60

-

40

-30

-40

V_OH

20

0

V_OL

-50

-60

-70

-80

-

20

40

60

80

-

V_OL

-

0

0.5

1.0

1.5

2.0

2.5

3.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

SOURCE VOLTAGE (V)

Figure 36. Drive Current D (Low V_DDEXT

)

Figure 39. Drive Current E (High V_DDEXT

)

Rev. PrD

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Page 45 of 56

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May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

POWER DISSIPATION

TEST CONDITIONS

Total power dissipation has two components: one due to inter-

nal circuitry (P_INT) and one due to the switching of external

output drivers (P_EXT). Table 33 through Table 35 show the power

dissipation for internal circuitry (V_DDINT).

All timing parameters appearing in this data sheet were mea-

sured under the conditions described in this section. Figure 40

shows the measurement point for AC measurements (except

output enable/disable). The measurement point V_MEASis 1.5 V

for V_DDEXT(nominal) = 2.5/3.3 V.

See the ADSP-BF53x Blackfin Processor Hardware Reference

Manual for definitions of the various operating -modes and for

instructions on how to minimize system power.

INPUT

1.5V

OR

OUTPUT

Many operating conditions can affect power dissipation. System

designers should refer to EE-TBD: Estimating Power for

ADSP-BF538/ADSP-BF538F Blackfin Processors.” This docu-

ment will provide detailed information for optimizing your

design for lowest power.

Figure 40. Voltage Reference Levels for AC

Measurements (Except Output Enable/Disable)

Table 33. Internal Power Dissipation (Hibernate mode)

Output Enable Time Measurement

I_DD(nominal¹)

TBD

Unit

μA

Output pins are considered to be enabled when they have made

a transition from a high impedance state to the point when they

start driving.

2

I_DDHIBERNATE

3

I_DDRTC

TBD

μA

The output enable time t_ENAis the interval from the point when a

reference signal reaches a high or low voltage level to the point

when the output starts driving as shown on the right side of Fig-

ure 41, “Output Enable/Disable,” on page 47.

¹Nominal assumes an operating temperature of 25°C.

²Measured at V_DDEXT= 3.65 V with voltage regulator off (V_DDINT= 0 V).

³Measured at V_DDRTC= 3.3 V at 25°C.

The time t_{ENA_MEASURED}is the interval, from when the reference

signal switches, to when the output voltage reaches V_TRIP(high)

or V_TRIP(low). V_TRIP(high) is 2.0 V and V_TRIP(low) is 1.0 V for

Table 34. Internal Power Dissipation (Deep Sleep mode)

1

V_DDINT

0.80

0.90

1.00

1.10

1.26

I_DD(nominal²)

19.00

Unit

mA

V

_DDEXT(nominal) = 2.5/3.3 V. Time t_TRIPis the interval from

when the output starts driving to when the output reaches the

V_TRIP(high) or V_TRIP(low) trip voltage.

25.00

32.00

Time t_ENAis calculated as shown in the equation:

40.00

t_ENA= t_{ENA_MEASURED}– t_TRIP

If multiple pins (such as the data bus) are enabled, the measure-

ment value is that of the first pin to start driving.

54.00

¹Assumes V_DDINTis regulated externally.

²Nominal assumes an operating temperature of 25°C.

Output Disable Time Measurement

Table 35. Internal Power Dissipation (Full On¹mode)

Output pins are considered to be disabled when they stop driv-

ing, go into a high impedance state, and start to decay from their

output high or low voltage. The output disable time t_DISis the

V_DDINT²@ f_CCLK(MHz)

0.8 @ 50 MHz

I_DD(nominal³)

32.00

Unit

mA

difference between t_{DIS MEASURED}and t_DECAYas shown on the left

_

side of Figure 41.

0.8 @ 250 MHz

0.9 @ 300 MHz

1.0 @ 350 MHz

1.1 @ 444 MHz

1.26 @ 500 MHz

72.00

t_DIS= t_{DIS_MEASURED}– t_DECAY

98.00

The time for the voltage on the bus to decay by ΔV is dependent

on the capacitive load C_Land the load current I_L. This decay time

can be approximated by the equation:

132.00

180.00

235.00

t_DECAY= (C_LΔV) ⁄ I_L

¹Processor executing 75% dual MAC, 25% ADD with moderate data bus

activity.

The time t_DECAYis calculated with test loads C_Land I_L, and with

²Assumes V_DDINTis regulated externally.

ΔV equal to 0.5 V for V_DDEXT(nominal) = 2.5/3.3 V.

³Nominal assumes an operating temperature of 25°C.

The time t_{DIS MEASURED}is the interval from when the reference sig-

+_

nal switches, to when the output voltage decays ΔV from the

measured output high or output low voltage.

Rev. PrD

|

Page 46 of 56

|

May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Example System Hold Time Calculation

Capacitive Loading

To determine the data output hold time in a particular system,

first calculate t_DECAYusing the equation given above. Choose ΔV

to be the difference between the ADSP-BF538/ADSP-BF538F

processor’s output voltage and the input threshold for the

device requiring the hold time. C_Lis the total bus capacitance

(per data line), and I_Lis the total leakage or three-state current

(per data line). The hold time will be t_DECAYplus the various out-

put disable times as specified in the Timing Specifications on

Page 24 (for example t_DSDATfor an SDRAM write cycle as shown

in Table 20 on Page 29).

Output delays and holds are based on standard capacitive loads:

30 pF on all pins (see Figure 42). V_LOADis 1.5 V for V_DDEXT

(nominal) = 2.5/3.3 V. Figure 43 through Figure 52 on Page 49

show how output rise time varies with capacitance. The delay

and hold specifications given should be derated by a factor

derived from these figures. The graphs in these figures may not

be linear outside the ranges shown.

ABE0 (133 MHz DRIVER), V

(MIN) = 2.25V,TEMPERATURE = 85°C

DDEXT

14

12

REFERENCE

SIGNAL

RISE TIME

10

t_{DIS_MEASURED}

t_ENA-MEASURED

FALL TIME

t_DIS

V_OH

t_ENA

8

V_OH

2.0V

(MEASURED)

V_OH(MEASURED) ؊ ⌬V

V_OL(MEASURED) + ⌬V

6

4

(MEASURED)

1.0V

V_OL

(MEASURED)

t_DECAY

t_TRIP

2

0

OUTPUT STOPS DRIVING

OUTPUT STARTS DRIVING

HIGH IMPEDANCE STATE.

0

50

100

150

200

250

LOAD CAPACITANCE (pF)

TEST CONDITIONS CAUSE THIS

VOLTAGE TO BE APPROXIMATELY 1.5V.

Figure 43. Typical Output Delay or Hold for Driver A at V_DDEXTMIN

Figure 41. Output Enable/Disable

50⍀

TO

OUTPUT

ABE0 (133 MHz DRIVER), V

(MAX) = 3.65V,TEMPERATURE = 85°C

DDEXT

1.5V

12

30pF

10

8

RISE TIME

Figure 42. Equivalent Device Loading for AC Measurements

(Includes All Fixtures)

FALL TIME

6

4

2

0

50

100

150

200

250

LOAD CAPACITANCE (pF)

Figure 44. Typical Output Delay or Hold for Driver A at V_DDEXTMAX

Rev. PrD

|

Page 47 of 56

|

May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

CLKOUT (CLKOUT DRIVER), V

(MIN) = 2.25V,TEMPERATURE = 85

°

C

PF9 (33 MHz DRIVER), V

(MIN) = 2.25V,TEMPERATURE = 85°C

DDEXT

12

10

30

25

20

15

10

5

RISE TIME

8

6

4

2

0

FALL TIME

0

50

100

150

200

250

0

50

100

150

200

250

LOAD CAPACITANCE (pF)

Figure 45. Typical Output Delay or Hold for Driver B at V_DDEXTMIN

Figure 47. Typical Output Delay or Hold for Driver C at V_DDEXTMIN

CLKOUT (CLKOUT DRIVER), V

(MAX) = 3.65V,TEMPERATURE = 85°C

PF9 (33 MHz DRIVER), V

(MAX) = 3.65V,TEMPERATURE = 85°C

DDEXT

10

20

9

8

7

18

16

14

RISE TIME

6

5

12

10

FALL TIME

4

3

2

1

0

8

6

4

2

0

50

100

150

200

250

0

50

100

150

200

250

LOAD CAPACITANCE (pF)

Figure 46. Typical Output Delay or Hold for Driver B at V_DDEXTMAX

Figure 48. Typical Output Delay or Hold for Driver C at V_DDEXTMAX

Rev. PrD

|

Page 48 of 56

|

May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

SCK (66 MHz DRIVER), V

(MIN) = 2.25V,TEMPERATURE = 85°C

DDEXT

PH0 V

(MAX) = 3.65V,TEMPERATURE = 85°C

18

16

14

12

10

8

DDEXT

36

32

RISE TIME

28

24

20

16

12

8

RISE TIME

FALL TIME

6

FALL TIME

4

2

4

0

50

100

150

200

250

0

LOAD CAPACITANCE (pF)

0

50

100

150

200

250

LOAD CAPACITANCE (pF)

Figure 49. Typical Output Delay or Hold for Driver D at V_DDEXTMIN

Figure 51. Typical Output Delay or Hold for Driver E at V_DDEXTMIN

SCK (66 MHz DRIVER), V

(MAX) = 3.65V,TEMPERATURE = 85°C

DDEXT

14

PH0 V

(MAX) = 3.65V,TEMPERATURE = 85°C

DDEXT

36

32

12

10

8

RISE TIME

28

24

20

16

12

8

RISE TIME

FALL TIME

6

4

2

0

FALL TIME

4

0

50

100

150

200

250

LOAD CAPACITANCE (pF)

0

50

100

150

200

250

LOAD CAPACITANCE (pF)

Figure 50. Typical Output Delay or Hold for Driver D at V_DDEXTMAX

Figure 52. Typical Output Delay or Hold for Driver E at V_DDEXTMAX

Rev. PrD

|

Page 49 of 56

|

May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

THERMAL CHARACTERISTICS

To determine the junction temperature on the application

printed circuit board use:

T_J= T_CASE+ (Ψ_JT× P_D)

where:

T_J= Junction temperature (؇C)

T_CASE= Case temperature (؇C) measured by customer at top

center of package.

Ψ_JT= From Table 36

P_D= Power dissipation (see Power Dissipation on Page 46 for

the method to calculate P_D)

Values of θ_JAare provided for package comparison and printed

circuit board design considerations. θ_JAcan be used for a first

order approximation of T_Jby the equation:

T_J= T_A+ (θ_JA× P_D)

where:

T_A= Ambient temperature (؇C)

Values of θ_JCare provided for package comparison and printed

circuit board design considerations when an external heatsink is

required.

Values of θ_JBare provided for package comparison and printed

circuit board design considerations.

In Table 36, airflow measurements comply with JEDEC stan-

dards JESD51-2 and JESD51-6, and the junction-to-board

measurement complies with JESD51-8. The junction-to-case

measurement complies with MIL-STD-883 (Method 1012.1).

All measurements use a 2S2P JEDEC test board.

Table 36. Thermal Characteristics 316-ball BGA

Parameter

Condition

Typical

TBD

Unit

؇C/W

θ_JA

0 linear m/s air flow

1 linear m/s air flow

2 linear m/s air flow

θ_JMA

θ_JB

TBD

θ_JC

TBD

ψ_JT

0 linear m/s air flow

TBD

Rev. PrD

|

Page 50 of 56

|

May 2006

Preliminary Technical Data

316-BALL MINI-BGA PINOUT

ADSP-BF538/ADSP-BF538F

Table 37 on Page 52 lists the mini-BGA pinout by pin number.

Table 38 on Page 53 lists the mini-BGA pinout by signal.

A1 BALL

A

B

C

D

E

F

A

B

C

D

E

F

G

H

J

G

H

J

K

L

K

L

M

N

P

R

T

M

N

P

R

T

U

V

W

Y

U

V

W

Y

1

2

3

4

5

6

7

8 9 10 11 12 13 14 15 16 17 18 19 20

GND

I/O

VDDRTC

VROUTx

NC

VDDINT

VDDEXT

20 19 18 17 16 15 14 13 12 11 10

9

8

7

6

5

4

3

2

1

FLASH CONTROL

GND

VDDINT

VDDRTC

NC

VDDEXT

VROUTx

FLASH CONTROL

I/O

Figure 53. 316-Ball Mini-BGA Pin Configuration (Top View)

Figure 54. 316-Ball Mini-BGA Pin Configuration (Bottom View)

Rev. PrD

|

Page 51 of 56

|

May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Table 37. 316-Ball Mini-BGA Pin Assignment (Numerically by Pin Number)

Ball No. Signal

Ball No. Signal Ball No. Signal Ball No. Signal Ball No. Signal Ball No. Signal

Ball No. Signal

A1

GND

PF10

PF11

C7

C8

C9

SPI2SEL F8

SPI2SS F9

MOSI2 F10

MISO2 F11

GND

J12

J13

J14

J18

J19

J20

K1

GND

AMS0

AMS2

SA10

RFS1

TMR2

M19

M20

N1

ABE0

ABE1

TFS0

T3

T7

T8

GND

W1

TCK

A2

VDDEXT W2

VDDEXT W3

VDDEXT W4

VDDEXT W5

VDDEXT W6

VDDINT W7

VDDINT W8

VDDINT W9

GND

A3

DATA15

DATA13

DATA11

DATA9

DATA7

DATA5

DATA3

DATA1

RSCK2

DR2PRI

DT2PRI

RX2

A4

PPI_CLK C10

N2

DR0PRI T9

A5

PPI0

PPI2

PF15

PF13

C11

C12

C13

C14

SCK2

F12

N3

GND

T10

A6

VDDINT F13

SPI1SEL F14

MISO1 F18

SPI1SS F19

MOSI1 F20

N7

VDDEXT T11

A7

N8

GND

T12

T13

T14

T18

T19

T20

A8

DT3PRI K2

N9

A9

VDDRTC C15

PC4

K3

K7

K8

VDDEXT N10

A10

A11

A12

A13

A14

A15

A16

A17

A18

A19

A20

B1

RTXO

RTXI

GND

CLKIN

XTAL

GND

NC

C16

C17

C18

C19

C20

D1

PC8

GND

AMS3

AMS1

AOE

N11

N12

N13

N14

N18

N19

N20

P1

RFS3

W10

SCK1

GND

PC6

G1

G2

G3

G7

G8

G9

SCK0

ADDR7 W11

ADDR8 W12

MOSI0 K9

DT0SEC K10

VDDINT U1

DT3SEC U2

ADDR1 U3

ADDR2 U7

TRST

TMS

GND

W13

W14

W15

SCKE

PF4

GND

BR

K11

K12

K13

K14

K18

K19

K20

L1

TX2

D2

PF5

VDDEXT W16

VDDEXT W17

VDDEXT W18

VDDEXT W19

VDDEXT W20

VDDINT Y1

VDDINT Y2

VDDINT Y3

ADDR18

ADDR15

ADDR13

GND

GPW

D3

DT1SEC G10

TSCK0

RFS0

GND

U8

D7

GND

PC7

G11

G12

G13

G14

G18

G19

G20

H1

P2

U9

VROUT1 D8

P3

U10

GND

PF8

D9

P7

VDDEXT U11

ADDR14

GND

D10

D11

D12

D13

D14

D18

D19

D20

E1

RSCK1

TMR1

GND

TSCK3

ARE

P8

GND

U12

U13

U14

U18

U19

U20

B2

GND

PF9

L2

P9

TDO

B3

CLKOUT L3

SRAS L7

DT1PRI L8

TSCK1 L9

DR1SEC L10

P10

P11

P12

P13

P14

P18

P19

P20

R1

DATA14

DATA12

DATA10

DATA8

DATA6

DATA4

DATA2

DATA0

RFS2

B4

PF3

RSCK3

Y4

B5

PPI1

ADDR9 Y5

ADDR10 Y6

B6

PPI3

H2

B7

PF14

PF12

SCL0

SDA0

CANRX

CANTX

NMI

H3

VDDINT V1

DR3SEC V2

ADDR3 V3

ADDR4 V4

TDI

Y7

Y8

Y9

B8

SMS

PF1

H7

GND

FCE

L11

L12

L13

L14

L18

L19

L20

M1

M2

M3

M7

M8

GND

B9

H8

B10

B11

B12

B13

B14

B15

B16

B17

B18

B19

B20

C1

E2

PF2

H9

BMODE1 Y10

BMODE0 Y11

E3

GND

PC5

H10

H11

H12

H13

H14

H18

H19

H20

J1

TX0

V5

V6

V7

E7

R2

RSCK0

GND

Y12

TSCK2

TFS2

E8

R3

VDDEXT Y13

VDDEXT Y14

VDDEXT Y15

VDDEXT Y16

VDDEXT Y17

VDDINT Y18

DR2SEC Y19

RESET

E9

AWE

R7

VDDEXT V8

FRESET

SCL1

VDDEXT E10

DT0PRI R8

GND

V9

GND

PC9

E11

E12

E13

E14

TMR0

GND

R9

V10

V11

V12

V13

V14

SDA1

SCAS

SWE

TFS1

R10

ADDR19

ADDR17

ADDR16

GND

VDDEXT R11

GND

R12

R13

R14

R18

R19

R20

VROUT0 E18

J2

DR1PRI M9

DR0SEC M10

BG

Y20

PF6

E19

E20

F1

J3

VDDINT V15

DR3PRI V16

ADDR5 V17

ADDR6 V18

BGH

C2

PF7

ARDY

PF0

J7

GND

M11

M12

M13

M14

M18

DT2SEC

GND

C3

GND

RX1

TX1

J8

C4

F2

MISO0 J9

GND

C5

F3

GND

J10

J11

VDDINT T1

RX0

V19

V20

ADDR11

ADDR12

C6

F7

TFS3

T2

EMU

Rev. PrD

|

Page 52 of 56

|

May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

Table 38. 316-Ball Mini-BGA Pin Assignment (Alphabetically by Signal)

Signal

ABE0

Ball No. Signal Ball No. Signal Ball No. Signal Ball No. Signal

Ball No. Signal Ball No. Signal Ball No.

M19

M20

N19

U20

V19

V20

W18

W20

W17

Y19

Y18

W16

Y17

N20

P19

P20

R19

R20

T19

T20

U19

J18

DATA2 Y9

DATA3 W9

DATA4 Y8

DATA5 W8

DATA6 Y7

DATA7 W7

DATA8 Y6

DATA9 W6

DR0PRI N2

DR0SEC J3

DR1PRI J2

DR1SEC H3

DR2PRI W12

DR2SEC V13

DR3PRI R18

DR3SEC P18

DT0PRI M1

DT0SEC G3

DT1PRI H1

DT1SEC D3

DT2PRI W13

DT2SEC V16

DT3PRI F18

DT3SEC N18

GND

E7

E8

E9

F8

F9

F10

GND

K11

K12

K13

L13

L14

M3

GND

GPW

MISO0

MISO1

MISO2

MOSI0

MOSI1

MOSI2

NC

V17

V18

W2

W19

Y1

RFS0

RFS1

RFS2

RFS3

P2

TX0

TX1

TX2

R1

ABE1

K1

C6

ADDR1

ADDR10

ADDR11

ADDR12

ADDR13

ADDR14

ADDR15

ADDR16

ADDR17

ADDR18

ADDR19

ADDR2

ADDR3

ADDR4

ADDR5

ADDR6

ADDR7

ADDR8

ADDR9

AMS0

Y11

T18

W15

VDDEXT K3

VDDEXT B15

VDDEXT T8

VDDEXT T9

VDDEXT T10

VDDEXT T11

VDDEXT U7

VDDEXT U8

VDDEXT U9

VDDEXT U10

VDDEXT U11

VDDEXT V7

VDDEXT M7

VDDEXT N7

VDDEXT P7

VDDEXT R7

VDDEXT T7

VDDEXT V8

VDDEXT V9

VDDEXT V10

VDDEXT V11

VDDINT C12

VDDINT M14

VDDINT N14

VDDINT P14

VDDINT R14

VDDINT T12

VDDINT T13

VDDINT T14

VDDINT U12

VDDINT U13

VDDINT U14

VDDINT V12

VDDRTC A9

VROUT0 B20

VROUT1 A19

RSCK0 R2

RSCK1 L1

RSCK2 W11

RSCK3 U18

Y20

A15

B16

A17

A18

F2

GND F11

GND F12

GND M8

GND M9

GND

F13

F14

G7

GND

M10

RTXI

RTXO

RX0

A11

A10

T1

M11

M12

M13

N3

G8

C14

C10

G2

RX1

C5

G9

RX2

W14

J20

H19

G1

E10

K14

L3

SA10

SCAS

SCK0

SCK1

SCK2

SCKE

SCL0

SCL1

SDA0

SDA1

SMS

GND E11

C16

C9

GND

E12

E13

E14

E18

F3

L7

L8

A16

B13

F19

E19

C19

D19

F20

C17

F1

C17

C11

C20

B9

L9

NMI

L10

L11

PC4

PC5

GND F7

GND L12

PC6

Y15

B10

Y16

D20

GND

G10

GND

N8

PC7

AMS1

K19

J19

G11

G12

G13

G14

H7

N9

PC8

AMS2

N10

N11

N12

N13

P3

PC9

AMS3

K18

K20

E20

L19

L20

V14

V15

V5

EMU

FCE

T2

PF0

SPI1SEL C13

SPI1SS C15

SPI2SEL C7

SPI2SS C8

AOE

H18

PF1

E1

ARDY

FRESET Y14

PF10

PF11

PF12

PF13

PF14

PF15

PF2

A2

ARE

GND

A1

H8

A3

AWE

A12

A20

B2

GND H9

GND P8

B8

SRAS

SWE

TCK

G20

H20

W1

V1

BG

GND

H10

GND

P9

A8

BGH

H11

H12

H13

H14

P10

P11

P12

P13

B7

BMODE0

BMODE1

BR

B18

B19

C3

A7

TDI

V4

E2

TDO

TFS0

TFS1

TFS2

TFS3

TMR0

TMR1

TMR2

TMS

Y2

G18

B11

B12

A13

G19

Y10

W10

Y5

PF3

B4

N1

J1

CANRX

CANTX

CLKIN

C4

GND J7

GND R3

PF4

D1

C18

D7

GND

J8

GND

R8

PF5

D2

Y13

M18

M2

L2

J9

R9

PF6

C1

CLKOUT

DATA0

DATA1

DATA10

DATA11

DATA12

DATA13

DATA14

DATA15

D8

J10

J11

J12

J13

J14

K7

R10

R11

R12

R13

T3

PF7

C2

D9

PF8

B1

D10

D11

D12

D13

D14

D18

E3

PF9

B3

K2

XTAL

A14

PPI_CLK A4

U2

W5

PPI0

PPI1

PPI2

PPI3

RESET

A5

B5

TRST

U1

Y4

U3

V2

TSCK0 P1

TSCK1 H2

TSCK2 Y12

TSCK3 L18

W4

K8

A6

B6

Y3

K9

V3

W3

K10

V6

B14

Rev. PrD

|

Page 53 of 56

|

May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

OUTLINE DIMENSIONS

Dimensions in Figure 55—316-Ball Mini Ball Grid Array

(BC-316) are shown in millimeters.

15.20 BSC SQ

17.00 BSC SQ

A1 BALL

0.80 BSC BALL PITCH

A1 BALL INDICATOR

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

V

W

Y

20 19 18 17 16 1514 13 12 11 10

9 8 7 6 5 4 3 2 1

BOTTOM VIEW

TOP VIEW

0.30 MIN

0.12 MAX

COPLANARITY

1.70

1.61

SIDE VIEW

0.50

SEATING PLANE

1.46

BALL DIAMETER 0.45

0.40

DETAIL A

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS.

2. COMPLIANT TO JEDEC REGISTERED OUTLINE MO-205, VARIATION AM,

WITH THE EXCEPTION OF BALL DIAMETER.

3. CENTER DIMENSIONS ARE NOMINAL.

Figure 55. 316-Ball Mini Ball Grid Array (BC-316)

Rev. PrD

|

Page 54 of 56

|

May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

SURFACE MOUNT DESIGN

Table 39 is provided as an aid to PCB design. For industry-

standard design recommendations, refer to IPC-7351,

Generic Requirements for Surface Mount Design and Land Pat-

tern Standard.

Table 39. BGA Data for Use with Surface Mount Design

Solder Mask

Package

Ball Attach Type

Opening

Ball Pad Size

316-Ball Mini Ball Grid Array Solder Mask Defined 0.40 mm diameter 0.50 mm diameter

(BC-316)

ORDERING GUIDE

Model ¹

Temperature

Range²

Instruction Flash

Rate (Max) Memory

Operating Voltage

(Nominal)

Package

Package Description

Option

BC-316

ADSP-BF538BBCZ-4A

ADSP-BF538BBCZ-4F4

ADSP-BF538BBCZ-4F8

ADSP-BF538BBCZ-5A

ADSP-BF538BBCZ-5F4

ADSP-BF538BBCZ-5F8

¹Z = Pb-free part.

–40ºC to +85ºC 400 MHz

–40ºC to +85ºC 500 MHz

NA

1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA

512K byte 1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA

1M byte

NA

1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA

512K byte 1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA

1M byte 1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA

²Referenced temperature is ambient temperature.

Rev. PrD

|

Page 55 of 56

|

May 2006

Preliminary Technical Data

ADSP-BF538/ADSP-BF538F

registered trademarks are the property of their respective owners.

PR06172-0-5/06(PrD)

Rev. PrD

|

Page 56 of 56

|

May 2006


型号：	ADSP-BF538
厂家：	ADI
描述：	Blackfin Embedded Processor Blackfin嵌入式处理器
文件：	总56页 (文件大小：3080K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ADSP-BF538 [ADI]

相关型号：

ADSP-BF538BBCZ-4A

ADSP-BF538BBCZ-4F4

ADSP-BF538BBCZ-4F8

ADSP-BF538BBCZ-5A

ADSP-BF538BBCZ-5F4

ADSP-BF538BBCZ-5F8

ADSP-BF538F

ADSP-BF538F_15

ADSP-BF538_07

ADSP-BF538_08

ADSP-BF538_15

ADSP-BF539