ADSP-BF542_07 [ADI]
Embedded Processor; 嵌入式处理器型号: | ADSP-BF542_07 |
厂家: | ADI |
描述: | Embedded Processor |
文件: | 总68页 (文件大小:2678K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
•
Blackfin®
Embedded Processor
a
Preliminary Technical Data
FEATURES
ADSP-BF542/BF544/BF548/BF549
PERIPHERALS
Up to 600 MHz High-Performance Blackfin Processor
Two 16-Bit MACs, Two 40-Bit ALUs, Four 8-Bit Video ALUs
RISC-Like Register and Instruction Model
High-Speed USB On-the-Go (OTG) with Integrated PHY
SD/SDIO Controller
ATA/ATAPI-6 Controller
0.9 V to TBD V Core VDD with On-chip Voltage Regulation
2.5 V and 3.3 V-Tolerant I/O with Specific 5V-Tolerant Pins
400-ball Lead-Free mBGA Package
Up to Four Synchronous Serial Ports (SPORTs)
Up to Three Serial Peripheral Interfaces (SPI-Compatible)
Up to Four UARTs, Two with Automatic Hardware Flow
Control
Up to Two CAN (Controller Area Network) 2.0B Interfaces
Up to Two TWI (Two-Wire Interface) Controllers
8- or 16-Bit Asynchronous Host DMA Interface
Multiple Enhanced Parallel Peripheral Interfaces (EPPIs), Sup-
porting ITU-R BT.656 Video Formats and 18/24-bit LCD
Connections
Media Transceiver (MXVR) for connection to a MOST®
Network
Pixel Compositor for overlays, alpha blending, and color
conversion
Up to Eleven 32-Bit Timers/Counters with PWM Support
Real-Time Clock (RTC) and Watchdog Timer
Up/Down Counter With Support for Rotary Encoder
Up to 152 General Purpose I/O (GPIOs)
On-Chip PLL Capable of 1x to 63x Frequency Multiplication
Debug/JTAG Interface
MEMORY
Up to 324K bytes of on-chip memory comprised of:
Instruction SRAM/cache; instruction SRAM;
data SRAM/cache; additional dedicated data SRAM;
scratchpad SRAM (see Table 1 on Page 3 for available
memory configurations
External Sync Memory Controller Supporting
DDR/Mobile DDR SDRAM
External Async Memory Controller Supporting 8/16 bit Async
Memories and Burst Flash Devices
NAND Flash Controller
Four Memory-to-Memory DMA pairs, two with external
requests
Memory Management Unit Providing Memory Protection
Flexible Booting Options
Code Security with LockboxTM Secure Technology
One-Time-Programmable (OTP) Memory
VOLTAGE
REGULATOR
JTAG TEST AND
EMULATION
WATCHDOG
TIMER
CAN (0-1)
RTC
OTP
TWI (0-1)
HOST DMA
UART (0-1)
UART (2-3)
SPI (0-1)
PAB 16
TIMERS(0-10)
INTERRUPTS
B
COUNTER
KEYPAD
L2
SRAM
L1
INSTR ROM
L1
L1
INSTR SRAM
DATA SRAM
SPI (2)
32-BIT DMA
16-BIT DMA
MXVR
DAB1 32
DAB0 16
DCB 32
EAB 64
DEB 32
SPORT (2-3)
SPORT (0-1)
SD / SDIO
USB
BOOT
ROM
EXTERNAL PORT
NOR, DDR1 CONTROL
ATAPI
EPPI (0-2)
DDR1
16
ASYNC
16
NAND FLASH
CONTRLOLLER
PIXEL
COMPOSITOR
•
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.
Figure 1. Functional Block Diagram
Rev. PrE
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O.Box 9106, Norwood, MA 02062-9106 U.S.A.
Tel:781/329-4700
Fax:781/461-3113
www.analog.com
© 2007 Analog Devices, Inc. All rights reserved.
ADSP-BF542/4/8/9
Preliminary Technical Data
TABLE OF CONTENTS
Features ................................................................. 1
Memory ................................................................ 1
Peripherals ............................................................. 1
Table Of Contents .................................................... 2
Revision History ...................................................... 2
General Description ................................................. 3
Low-Power Architecture ......................................... 4
System Integration ................................................ 4
ADSP-BF542/4/8/9 Processor Peripherals ................... 4
Blackfin Processor Core .......................................... 4
Memory Architecture ............................................ 5
DMA Controllers ................................................ 10
Real-Time Clock ................................................. 11
Watchdog Timer ................................................ 11
Timers ............................................................. 12
Up/Down Counter and Thumbwheel Interface .......... 12
Serial Ports (SPORTs) .......................................... 12
Serial Peripheral Interface (SPI) Ports ...................... 12
UART Ports (UARTs) .......................................... 13
Controller Area Network (CAN) ............................ 13
TWI Controller Interface ...................................... 13
Ports ................................................................ 14
Pixel Compositor (PIXC) ...................................... 14
Enhanced Parallel Peripheral Interface (EPPI) ........... 14
USB On-The-Go Dual-Role Device Controller ........... 15
ATA/ATAPI–6 Interface ...................................... 15
Keypad Interface ................................................. 15
Secure Digital (SD)/SDIO Controller ....................... 15
Code Security ..................................................... 15
Media Transceiver Mac Layer (MXVR) .................... 15
Voltage Regulation .............................................. 17
Clock Signals ...................................................... 17
Booting Modes ................................................... 19
Instruction Set Description .................................... 20
Development Tools .............................................. 21
Designing an Emulator-Compatible Processor
Board (Target) ................................................. 21
Related Documents .............................................. 21
Pin Descriptions .................................................... 22
Specifications ........................................................ 31
Operating Conditions ........................................... 31
Electrical Characteristics ....................................... 32
ESD Sensitivity ................................................... 32
Absolute Maximum Ratings ................................... 33
Package Information ............................................ 33
Timing Specifications ........................................... 34
Power Dissipation ............................................... 58
Test Conditions .................................................. 58
Environmental Conditions .................................... 59
400-Ball BGA Pinout ............................................... 60
Outline Dimensions ................................................ 66
Ordering Guide ..................................................... 67
REVISION HISTORY
Revision PrE: Corrections and additions to PrD:
• Many individual line changes throughout datasheet
• Specific Peripherals for Processors table added
• Replace Voltage Regulator Circuit diagram
• Table 10 - processor pin multiplexing reworked
• Table 11 - Pin Descriptions reworded
• Absolute Maximum Rating reworked
• HDMA A/C Timing-Host Read Cycle and Write Cycle
added
• Outline dimensions specified
Rev. PrE
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Page 2 of 68
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April 2007
Preliminary Technical Data
GENERAL DESCRIPTION
ADSP-BF542/4/8/9
The ADSP-BF542/4/8/9 processors are members of the Blackfin
family of products, incorporating the Analog Devices/Intel
Micro Signal Architecture (MSA). Blackfin processors combine
a dual-MAC state-of-the-art signal processing engine, the
advantages of a clean, orthogonal RISC-like microprocessor
instruction set, and single-instruction, multiple-data (SIMD)
multimedia capabilities into a single instruction-set
architecture.
1 Automotive Only.
2 This ROM is not customer configurable.
Specific peripherals for ADSP-BF542/4/8/9 processors are
shown in Table 2.
Table 2. ADSP-BF54x Specific Peripherals for Processors
Specific performance and memory configurations for
ADSP-BF542/4/8/9 processors are shown in Table 1.
Module
Table 1. ADSP-BF542/4/8/9 Processor Features
Processor
Features
EBIU (async)
NAND Flash Controller
ATAPI
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
–
3
3
–
3
3
3
–
Host DMA Port (HOSTDP)
SD/SDIO Controller
EPPI0
3
–
Code Security
SD/SDIO Controller
Pixel Compositor
18- or 24-bit EPPI0 with LCD
16-bit EPPI1, 8-bit EPPI2
Host DMA Port
NAND Flash Controller
ATAPI
1
1
1
1
1
1
1
1
1
1
1
2
2
3
4
4
1
1
1
1
1
1
1
1
1
1
1
–
2
2
3
4
4
1
1
–
1
1
1
1
1
–
–
–
–
2
2
2
3
3
1
1
1
1
–
1
–
1
1
1
1
–
1
1
2
3
3
1
8
3
–
3
3
3
–
EPPI1
3
3
–
EPPI2
SPORT0
SPORT1
3
3
3
3
3
–
3
3
3
3
3
–
SPORT2
SPORT3
High Speed USB OTG
Keypad Interface
MXVR
SPI0
SPI1
SPI2
CAN ports1
UART0
3
3
–
3
3
–
TWI ports
UART1
SPI ports
UART2
UART ports
UART3
3
–
3
3
3
–
SPORTs
High Speed USB OTG
CAN01
CAN11
Up / Down Counter
Timers
3
3
3
3
3
3
3
–
11 11 11
152 152 152 152
–
General-purpose I/O pins
TWI0
3
3
3
3
3
3
–
3
–
Memory
Configurations
(K Bytes)
L1 Instruction SRAM/Cache 16 16 16 16
TWI1
L1 Instruction SRAM
L1 Data SRAM/Cache
L1 Data SRAM
L1 Scratchpad SRAM
L1 ROM2
48 48 48 48
32 32 32 32
32 32 32 32
Timer 0-7
Timer 8-10
Up / Down Counter
Keypad Interface
MXVR
3
–
3
3
–
4
4
4
4
64 64 64 64
–
L2
128 128 64
–
4
GPIOs
1 Automotive Only.
3
3
3
L3 Boot ROM2
4
4
4
Maximum Core Instruction Rate (MHz)
533 600 533 600
Rev. PrE
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Page 3 of 68
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
The ADSP-BF542/BF544/BF548 processors are completely code
and pin compatible. They differ only with respect to their per-
formance, on-chip memory, and selection of I/O peripherals.
Specific performance, memory, and feature configurations, are
shown in Table 1. The ADSP-BF549 is completely code compat-
ible with the other ADSP-BF542/4/8/9 processors, and this
processor is pin compatible, except for the location of the
HWAIT pin.
All of the peripherals, except for general-purpose I/O, CAN,
TWI, real-time clock, and timers, are supported by a flexible
DMA structure. There are also separate memory DMA channels
dedicated to data transfers between the processor's various
memory spaces, including external DDR and asynchronous
memory. Multiple on-chip buses running at up to 133 MHz
provide enough bandwidth to keep the processor core running
along with activity on all of the on-chip and external
peripherals.
By integrating a rich set of industry-leading system peripherals
and memory, Blackfin processors are the platform of choice for
next-generation applications that require RISC-like program-
mability, multimedia support and leading-edge signal
processing in one integrated package.
The ADSP-BF542/4/8/9 processor includes an on-chip voltage
regulator in support of the ADSP-BF542/4/8/9 processor
dynamic power management capability. The voltage regulator
provides a range of core voltage levels when supplied from a sin-
gle 2.70 V to 3.6 V input. The voltage regulator can be bypassed
at the user's discretion.
LOW-POWER ARCHITECTURE
Blackfin processors provide world-class power management
and performance. Blackfin processors are designed in a low
power and low voltage design methodology and feature on-chip
dynamic power management, the ability to vary both the voltage
and frequency of operation to significantly lower overall power
consumption. Varying the voltage and frequency can result in a
substantial reduction in power consumption, compared with
just varying the frequency of operation. This translates into
longer battery life for portable appliances.
BLACKFIN PROCESSOR CORE
As shown in Figure 2 on Page 5, the Blackfin processor core
contains two 16-bit multipliers, two 40-bit accumulators, two
40-bit ALUs, four video ALUs, and a 40-bit shifter. The compu-
tation units process 8-bit, 16-bit, or 32-bit data from the register
file.
The compute register file contains eight 32-bit registers. When
performing compute operations on 16-bit operand data, the
register file operates as 16 independent 16-bit registers. All
operands for compute operations come from the multiported
register file and instruction constant fields.
SYSTEM INTEGRATION
The ADSP-BF542/4/8/9 processors are highly integrated sys-
tem-on-a-chip solutions for the next generation of embedded
network connected applications. By combining industry-stan-
dard interfaces with a high performance signal processing core,
users can develop cost-effective solutions quickly without the
need for costly external components. The system peripherals
include a high speed USB OTG (On-The-Go) controller with
integrated PHY, CAN 2.0B controllers, TWI controllers, UART
ports, SPI ports, serial ports (SPORTs), ATAPI controller,
SD/SDIO controller, a real-time clock, a watchdog timer, LCD
controller, and multiple enhanced parallel peripheral interfaces.
Each MAC can perform a 16-bit by 16-bit multiply in each
cycle, accumulating the results into the 40-bit accumulators.
Signed and unsigned formats, rounding, and saturation are
supported.
The ALUs perform a traditional set of arithmetic and logical
operations on 16-bit or 32-bit data. In addition, many special
instructions are included to accelerate various signal processing
tasks. These include bit operations such as field extract and pop-
ulation count, modulo 232 multiply, divide primitives, saturation
and rounding, and sign/exponent detection. The set of video
instructions include byte alignment and packing operations, 16-
bit and 8-bit adds with clipping, 8-bit average operations, and 8-
bit subtract/absolute value/accumulate (SAA) operations. Also
provided are the compare/select and vector search instructions.
ADSP-BF542/4/8/9 PROCESSOR PERIPHERALS
The ADSP-BF542/4/8/9 processor contains a rich set of periph-
erals connected to the core via several high bandwidth buses,
providing flexibility in system configuration as well as excellent
overall system performance (see Figure 1 on Page 1). The gen-
eral-purpose peripherals include functions such as UARTs, SPI,
TWI, timers with pulse width modulation (PWM) and pulse
measurement capability, general purpose I/O pins, a real-time
clock, and a watchdog timer. This set of functions satisfies a
wide variety of typical system support needs and is augmented
by the system expansion capabilities of the part. The
ADSP-BF542/4/8/9 processor contains dedicated network com-
munication modules and high-speed serial and parallel ports, an
interrupt controller for flexible management of interrupts from
the on-chip peripherals or external sources, and power manage-
ment control functions to tailor the performance and power
characteristics of the processor and system to many application
scenarios.
For certain instructions, two 16-bit ALU operations can be per-
formed simultaneously on register pairs (a 16-bit high half and
16-bit low half of a compute register). By also using the second
ALU, quad 16-bit operations are possible.
The 40-bit shifter can perform shifts and rotates and is used to
support normalization, field extract, and field deposit
instructions.
The program sequencer controls the flow of instruction execu-
tion, including instruction alignment and decoding. For
program flow control, the sequencer supports PC relative and
indirect conditional jumps (with static branch prediction), and
subroutine calls. Hardware is provided to support zero-over-
head looping. The architecture is fully interlocked, meaning that
the programmer need not manage the pipeline when executing
instructions with data dependencies.
Rev. PrE
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Page 4 of 68
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
The address arithmetic unit provides two addresses for simulta-
neous dual fetches from memory. It contains a multiported
register file consisting of four sets of 32-bit index, modify,
length, and base registers (for circular buffering), and eight
additional 32-bit pointer registers (for C-style indexed stack
manipulation).
The architecture provides three modes of operation: user mode,
supervisor mode, and emulation mode. User mode has
restricted access to certain system resources, thus providing a
protected software environment, while supervisor mode has
unrestricted access to the system and core resources.
The Blackfin processor instruction set has been optimized so
that 16-bit opcodes represent the most frequently used instruc-
tions, resulting in excellent compiled code density. Complex
DSP instructions are encoded into 32-bit opcodes, representing
fully featured multifunction instructions. Blackfin processors
support a limited multi-issue capability, where a 32-bit instruc-
tion can be issued in parallel with two 16-bit instructions,
allowing the programmer to use many of the core resources in a
single instruction cycle.
Blackfin processors support a modified Harvard architecture in
combination with a hierarchical memory structure. Level 1 (L1)
memories are those that typically operate at the full processor
speed with little or no latency. At the L1 level, the instruction
memory holds instructions only. The two data memories hold
data, and a dedicated scratchpad data memory stores stack and
local variable information.
In addition, multiple L1 memory blocks are provided, offering a
configurable mix of SRAM and cache. The memory manage-
ment unit (MMU) provides memory protection for individual
tasks that may be operating on the core and can protect system
registers from unintended access.
The Blackfin processor assembly language uses an algebraic syn-
tax for ease of coding and readability. The architecture has been
optimized for use in conjunction with the C/C++ compiler,
resulting in fast and efficient software implementations.
ADDRESS ARITHMETIC UNIT
SP
FP
P5
P4
P3
P2
P1
P0
I3
I2
I1
I0
L3
L2
L1
L0
B3
B2
B1
B0
M3
M2
M1
M0
DAG1
DAG0
DA1 32
DA0 32
32
PREG
32
RAB
SD 32
LD1 32
LD0 32
ASTAT
32
32
SEQUENCER
ALIGN
R7.H
R6.H
R5.H
R4.H
R3.H
R2.H
R1.H
R0.H
R7.L
R6.L
R5.L
R4.L
R3.L
R2.L
R1.L
R0.L
16
16
8
8
8
8
DECODE
BARREL
SHIFTER
LOOP BUFFER
40
40
40 40
A0
A1
CONTROL
UNIT
32
32
DATA ARITHMETIC UNIT
Figure 2. Blackfin Processor Core
resources, including internal memory, external memory, and
I/O control registers, occupy separate sections of this common
address space. The memory portions of this address space are
MEMORY ARCHITECTURE
The ADSP-BF542/4/8/9 processor views memory as a single
unified 4G byte address space, using 32-bit addresses. All
Rev. PrE
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Page 5 of 68
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
arranged in a hierarchical structure to provide a good cost/per-
formance balance of some very fast, low-latency on-chip
memory as cache or SRAM, and larger, lower-cost and perfor-
mance off-chip memory systems. See Figure 3 on Page 6.
The memory DMA controllers (DMAC1 and DMAC0) pro-
vides high-bandwidth data-movement capability. They can
perform block transfers of code or data between the internal
memory and the external memory spaces.
The on-chip L1 memory system is the highest-performance
memory available to the Blackfin processor. The off-chip mem-
ory system, accessed through the external bus interface unit
(EBIU), provides expansion with flash memory, SRAM, and
double-rate SDRAM (DDR1), optionally accessing up to
516M bytes of physical memory.
0xFFFF FFFF
CORE MMR REGISTERS (2M BYTE)
0xFFE0 0000
SYSTEM MMR REGISTERS (2M BYTE)
0xFFC0 0000
RESERVED
0xFFB0 1000
SCRATCHPAD SRAM (4K BYTE)
0xFFB0 0000
The ADSP-BF542/4/8/9 processor also includes an L2 SRAM
memory array which provides 128K bytes of high speed SRAM
operating at one half the frequency of the core, and slightly
longer latency than the L1 memory banks. The L2 memory is a
unified instruction and data memory and can hold any mixture
of code and data required by the system design. The Blackfin
cores share a dedicated low latency 64-bit wide data path port
into the L2 SRAM memory.
RESERVED
0xFFA2 4000
L1 ROM (64K BYTE)
0xFFA1 4000
INSTRUCTION SRAM / CACHE (16K BYTE)
0xFFA1 0000
RESERVED
0xFFA0 C000
INSTRUCTION BANK B SRAM (16K BYTE)
0xFFA0 8000
INSTRUCTION BANK A SRAM (32K BYTE)
0xFFA0 0000
RESERVED
0xFF90 8000
DATA BANK B SRAM / CACHE (16K BYTE)
0xFF90 4000
DATA BANK B SRAM (16K BYTE)
0xFF90 0000
RESERVED
0xFF80 8000
DATA BANK A SRAM / CACHE (16K BYTE)
0xFF80 4000
DATA BANK A SRAM (16K BYTE)
0xFF80 0000
RESERVED
0xFEB2 0000
L2 SRAM (128K BYTE)
0xFEB0 0000
RESERVED
0xEF00 1000
BOOT ROM (4K BYTE)
0xEF00 0000
RESERVED
0x3000 0000
ASYNC MEMORY BANK 3 (64M BYTE)
0x2C00 0000
ASYNC MEMORY BANK 2 (64M BYTE)
0x2800 0000
ASYNC MEMORY BANK 1 (64M BYTE)
0x2400 0000
ASYNC MEMORY BANK 0 (64M BYTE)
0x2000 0000
RESERVED
TOP OF LAST
DDR PAGE
DDR1 MEM BANK 1 (8M BYTE - 256M BYTE)
DDR1 MEM BANK 0 (8M BYTE - 256M BYTE)
0x0000 0000
Figure 3. ADSP-BF549 Internal/External Memory Map1
1
This memory map applies to all ADSP-BF542/4/8/9 processors, except for L2
memory population. For details, see Table 1.
Internal (On-Chip) Memory
The ADSP-BF542/4/8/9 processor has several blocks of on-chip
memory providing high-bandwidth access to the core.
The first block is the L1 instruction memory, consisting of
48K bytes SRAM, and also 16K bytes that can be configured as a
four-way set-associative cache or SRAM. This memory is
accessed at full processor speed.
The second on-chip memory block is the L1 data memory, con-
sisting of 64K bytes SRAM, of which 32K bytes can be
configured as a two-way set associative cache. This memory
block is accessed at full processor speed.
Rev. PrE
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Page 6 of 68
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
The third memory block is a 4K byte scratchpad SRAM which
runs at the same speed as the L1 memories, but is only accessible
as data SRAM and cannot be configured as cache memory.
system may be used to manage reading and writing of the
NAND flash device. The file system selects memory segments
for storage with the goal of avoiding bad blocks and equally dis-
tributing memory accesses across all address locations.
Hardware features of the NFC include:
The fourth memory block is the factory programmed L1
instruction ROM, operating at full processor speed. This ROM
is not customer configurable.
• Support for page program, page read, and block erase of
NAND flash devices, with accesses aligned to page
boundaries.
The fifth memory block is the L2 SRAM, providing 128K bytes
of unified Instruction and data memory, operating at one half
the frequency of the core.
• Error checking and correction (ECC) hardware that facili-
tates error detection and correction.
Finally, there is a 4K boot ROM that can be seen as L3 memory.
It operates at full SCLK rate.
• A single 8-bit or 16-bit external bus interface for com-
mands, addresses and data.
External (Off-Chip) Memory
• Support for SLC (single level cell) NAND flash devices
unlimited in size, with page sizes of 256 and 512 bytes.
Larger page sizes can be supported in software.
Through the External Bus Interface Unit (EBIU) the
ADSP-BF542/4/8/9 processors provide glueless connectivity to
external 16-bit wide memories, such as DDR SDRAM, Mobile
DDR, SRAM, NOR flash, NAND flash, and FIFO devices. To
provide the best performance, the bus system of the DDR inter-
face is completely separate from the other parallel interfaces.
• Capability of releasing external bus interface pins during
long accesses.
• Support for internal bus requests of 16 or 32 bits.
The DDR/Mobile DDR memory controller can gluelessly man-
age up to two banks of double-rate synchronous dynamic
memory (DDR1 SDRAM). The 16-bit wide interface operates at
SCLK frequency enabling maximum throughput of 532
Mbyte/s. The DDR controller is augmented with a queuing
mechanism that performs efficient bursts onto the DDR. The
controller is an industry standard DDR SDRAM controller with
each bank supporting from 64 Mbit to 512 Mbit device sizes and
4-, 8-, or 16-bit widths. The controller supports up to 512
Mbytes in one bank, but the total in two banks is limited to 512
Mbytes. Each bank is independently programmable and is con-
tiguous with adjacent banks regardless of the sizes of the
different banks or their placement.
• DMA engine to transfer data between internal memory and
NAND flash device.
I/O Memory Space
The ADSP-BF542/4/8/9 processors do not define a separate I/O
space. All resources are mapped through the flat 32-bit address
space. On-chip I/O devices have their control registers mapped
into memory-mapped registers (MMRs) at addresses near the
top of the 4G byte address space. These are separated into two
smaller blocks, one which contains the control MMRs for all
core functions, and the other which contains the registers
needed for setup and control of the on-chip peripherals outside
of the core. The MMRs are accessible only in supervisor mode
and appear as reserved space to on-chip peripherals.
Traditional 16-bit asynchronous memories, such as SRAM,
EPROM, and flash devices, can be connected to one of the four
64 MByte asynchronous memory banks, represented by four
memory select strobes. Alternatively, these strobes can function
as bank-specific read or write strobes preventing further glue
logic when connecting to asynchronous FIFO devices.
Booting
The ADSP-BF542/4/8/9 processor contains a small on-chip
boot kernel, which configures the appropriate peripheral for
booting. If the ADSP-BF542/4/8/9 processor is configured to
boot from boot ROM memory space, the processor starts exe-
cuting from the on-chip boot ROM. For more information, see
Booting Modes on Page 19.
In addition, the external bus can connect to advanced flash
device technologies, such as:
• Page-mode NOR flash devices
• Synchronous burst-mode NOR flash devices
• NAND flash devices
Event Handling
The event controller on the ADSP-BF542/4/8/9 processor han-
dles all asynchronous and synchronous events to the processor.
The ADSP-BF542/4/8/9 processor provides event handling that
supports both nesting and prioritization. Nesting allows multi-
ple event service routines to be active simultaneously.
Prioritization ensures that servicing of a higher-priority event
takes precedence over servicing of a lower-priority event. The
controller provides support for five different types of events:
NAND Flash Controller (NFC)
The ADSP-BF542/4/8/9 provides a NAND Flash Controller
(NFC) as part of the external bus interface. NAND flash devices
provide high-density, low-cost memory. However, NAND flash
devices also have long random access times, invalid blocks, and
lower reliability over device lifetimes. Because of this, NAND
flash is often used for read-only code storage. In this case, all
DSP code can be stored in NAND flash and then transferred to a
faster memory (such as DDR or SRAM) before execution.
Another common use of NAND flash is for storage of multime-
dia files or other large data segments. In this case, a software file
• Emulation. An emulation event causes the processor to
enter emulation mode, allowing command and control of
the processor via the JTAG interface.
• Reset. This event resets the processor.
Rev. PrE
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ADSP-BF542/4/8/9
Preliminary Technical Data
• Non-Maskable Interrupt (NMI). The NMI event can be
generated by the software watchdog timer or by the NMI
input signal to the processor. The NMI event is frequently
used as a power-down indicator to initiate an orderly shut-
down of the system.
System Interrupt Controller (SIC)
The system interrupt controller provides the mapping and rout-
ing of events from the many peripheral interrupt sources to the
prioritized general-purpose interrupt inputs of the CEC.
Although the ADSP-BF542/4/8/9 processor provides a default
mapping, the user can alter the mappings and priorities of
interrupt events by writing the appropriate values into the inter-
rupt assignment registers (IAR). Table 4 describes the inputs
into the SIC and the default mappings into the CEC.
• Exceptions. Events that occur synchronously to program
flow (that is, the exception is taken before the instruction is
allowed to complete). Conditions such as data alignment
violations and undefined instructions cause exceptions.
• Interrupts. Events that occur asynchronously to program
flow. They are caused by input pins, timers, and other
peripherals, as well as by an explicit software instruction.
Table 4. System Interrupt Controller (SIC)
Peripheral IRQ
(IRQ) Source
IRQ
GP IRQ
Core
Each event type has an associated register to hold the return
address and an associated return-from-event instruction. When
an event is triggered, the state of the processor is saved on the
supervisor stack.
ID (at Reset) IRQ ID
PLL Wakeup IRQ
0
IVG7
IVG7
IVG7
IVG7
IVG7
IVG7
IVG7
IVG8
IVG8
IVG9
IVG9
IVG9
IVG9
IVG10
IVG10
IVG10
IVG11
IVG11
IVG11
IVG12
IVG12
IVG13
IVG13
IVG13
IVG7
IVG7
IVG7
IVG7
IVG7
IVG7
IVG7
IVG7
0
0
0
0
0
0
0
1
1
2
2
2
2
3
3
3
4
4
4
5
5
6
6
6
0
0
0
0
0
0
0
0
DMAC0 Status (generic)
EPPI0 Error IRQ
1
2
The ADSP-BF542/4/8/9 processor event controller consists of
two stages, the core event controller (CEC) and the system
interrupt controller (SIC). The core event controller works with
the system interrupt controller to prioritize and control all sys-
tem events. Conceptually, interrupts from the peripherals enter
into the SIC, and are then routed directly into the general-pur-
pose interrupts of the CEC.
SPORT0 Error IRQ
SPORT1 Error IRQ
SPI0 Status IRQ
3
4
5
UART0 Status IRQ
Real-Time Clock IRQ
DMA12 IRQ (EPPI0)
DMA0 IRQ (SPORT0 RX)
DMA1 IRQ (SPORT0 TX)
DMA2 IRQ (SPORT1 RX)
DMA3 IRQ (SPORT1 TX)
DMA4 IRQ (SPI0)
6
7
Core Event Controller (CEC)
8
The CEC supports nine general-purpose interrupts (IVG15–7),
in addition to the dedicated interrupt and exception events. Of
these general-purpose interrupts, the two lowest-priority inter-
rupts (IVG15–14) are recommended to be reserved for software
interrupt handlers, leaving seven prioritized interrupt inputs to
support the peripherals of the ADSP-BF542/4/8/9 processor.
Table 3 describes the inputs to the CEC, identifies their names
in the event vector table (EVT), and lists their priorities.
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
DMA6 IRQ (UART0 RX)
DMA7 IRQ (UART0 TX)
Timer 8 IRQ
Table 3. Core Event Controller (CEC)
Priority
Event Class
EVT Entry
Timer 9 IRQ
(0 is Highest)
Timer 10 IRQ
0
Emulation/Test Control EMU
Reset RST
Non-Maskable Interrupt NMI
1
Pin IRQ 0 (PINT0)
2
Pin IRQ 1 (PINT1)
3
Exception
EVX
MDMA Stream 0 IRQ
MDMA Stream 1 IRQ
Software Watchdog Timer IRQ
DMAC1 Status (generic)
SPORT2 Error IRQ
SPORT3 Error IRQ
MXVR Synchronous Data IRQ
SPI1 Status IRQ
4
Reserved
—
5
Hardware Error
IVHW
IVTMR
IVG7
6
Core Timer
7
General Interrupt 7
General Interrupt 8
General Interrupt 9
General Interrupt 10
General Interrupt 11
General Interrupt 12
General Interrupt 13
General Interrupt 14
General Interrupt 15
8
IVG8
9
IVG9
10
11
12
13
14
15
IVG10
IVG11
IVG12
IVG13
IVG14
IVG15
SPI2 Status IRQ
UART1 Status IRQ
UART2 Status IRQ
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Preliminary Technical Data
ADSP-BF542/4/8/9
Table 4. System Interrupt Controller (SIC) (Continued)
Table 4. System Interrupt Controller (SIC) (Continued)
Peripheral IRQ
(IRQ) Source
IRQ
GP IRQ
Core
Peripheral IRQ
(IRQ) Source
IRQ
GP IRQ
Core
ID (at Reset) IRQ ID
ID (at Reset) IRQ ID
CAN0 Status IRQ
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
63
63
63
64
65
66
67
IVG7
IVG9
0
2
2
2
2
2
2
3
3
3
3
3
3
4
4
4
4
6
6
4
4
4
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
Counter (CNT) IRQ
Keypad (KEY) IRQ
CAN1 RX IRQ
CAN1 TX IRQ
SDH Mask 0 IRQ
SDH Mask 1 IRQ
Reserved
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
IVG8
1
1
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
DMA18 IRQ (SPORT2 RX)
DMA19 IRQ (SPORT2 TX)
DMA20 IRQ (SPORT3 RX)
DMA21 IRQ (SPORT3 TX)
DMA13 IRQ (EPPI1)
DMA14 IRQ (EPPI2, Host DMA)
DMA5 IRQ (SPI1)
IVG8
IVG9
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG12
IVG12
IVG9
IVG9
IVG9
IVG9
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
IVG11
IVG11
IVG11
IVG11
IVG13
IVG13
IVG11
IVG11
IVG11
IVG7
USB_INT0 IRQ
USB_INT1 IRQ
USB_INT2 IRQ
USB_DMAINT IRQ
OTPSEC IRQ
Reserved
DMA23 IRQ (SPI2)
DMA8 IRQ (UART1 RX)
DMA9 IRQ (UART1 TX)
DMA10 IRQ (ATAPI RX)
DMA11 IRQ (ATAPI TX)
TWI0 IRQ
Reserved
TWI1 IRQ
Reserved
CAN0 Receive IRQ
Reserved
CAN0 Transmit IRQ
MDMA Stream 2 IRQ
MDMA Stream 3 IRQ
MXVR Status IRQ
Reserved
Reserved
Timer 0 IRQ
Timer 1 IRQ
Timer 2 IRQ
Timer 3 IRQ
Timer 4 IRQ
Timer 5 IRQ
Timer 6 IRQ
Timer 7 IRQ
Pin IRQ 2 (PINT2)
Pin IRQ 3 (PINT3)
MXVR Control Message IRQ
MXVR Asynchronous Packet IRQ
EPPI1 Error IRQ
EPPI2 Error IRQ
IVG7
UART3 Status IRQ
IVG7
Host DMA Status
IVG7
Reserved
IVG7
Pixel Compositor (PIXC) Status IRQ
NFC Error IRQ
IVG7
IVG7
Event Control
ATAPI Error IRQ
IVG7
The ADSP-BF542/4/8/9 processor provides the user with a very
flexible mechanism to control the processing of events. In the
CEC, three registers are used to coordinate and control events.
Each register is 16 bits wide:
CAN1 Status IRQ
IVG7
DMAR0 Block IRQ
IVG7
DMAR1 Block IRQ
IVG7
• CEC interrupt latch register (ILAT). The ILAT register
indicates when events have been latched. The appropriate
bit is set when the processor has latched the event and
cleared when the event has been accepted into the system.
DMAR0 Overflow Error IRQ
DMAR1 Overflow Error IRQ
DMA15 IRQ (PIXC0)
DMA16 IRQ (PIXC1)
DMA17 IRQ (PIXC2)
DMA22 IRQ (SDH/NFC)
IVG7
IVG7
IVG8
IVG8
IVG8
IVG8
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ADSP-BF542/4/8/9
Preliminary Technical Data
This register is updated automatically by the controller, but
it may be written only when its corresponding IMASK bit
is cleared.
DMA CONTROLLERS
ADSP-BF542/4/8/9 processors have multiple, independent
DMA channels that support automated data transfers with min-
imal overhead for the processor core. DMA transfers can occur
between the ADSP-BF542/4/8/9 processor’s internal memories
and any of its DMA-capable peripherals. Additionally, DMA
transfers can be accomplished between any of the DMA-capable
peripherals and external devices connected to the external
memory interfaces, including DDR and asynchronous memory
controllers.
• CEC interrupt mask register (IMASK). The IMASK regis-
ter controls the masking and unmasking of individual
events. When a bit is set in the IMASK register, that event is
unmasked and is processed by the CEC when asserted. A
cleared bit in the IMASK register masks the event, prevent-
ing the processor from servicing the event even though the
event may be latched in the ILAT register. This register
may be read or written while in supervisor mode. (Note
that general-purpose interrupts can be globally enabled and
disabled with the STI and CLI instructions, respectively.)
While the USB controller and MXVR have their own dedicated
DMA controllers, the other on-chip peripherals are managed by
two centralized DMA controllers, called DMAC1 (32-bit) and
DMAC0 (16-bit). Both operate in the SCLK domain. Each DMA
controller manages twelve independent DMA channels. The
DMAC1 controller masters high-bandwidth peripherals over a
dedicated 32-bit DMA access bus (DAB32). Similarly, the
DMAC0 controller masters most of serial interfaces over the 16-
bit DAB16 bus. Individual DMA channels have fixed access pri-
ority on the DAB buses. DMA priority of peripherals is
• CEC interrupt pending register (IPEND). The IPEND reg-
ister keeps track of all nested events. A set bit in the IPEND
register indicates the event is currently active or nested at
some level. This register is updated automatically by the
controller but may be read while in supervisor mode.
The SIC allows further control of event processing by providing
three 32-bit interrupt control and status registers. Each register
contains a bit corresponding to each of the peripheral interrupt
events shown in Table 4 on Page 8.
managed by flexible peripheral-to-DMA channel assignment.
All four DMA controllers use the same 32-bit DCB bus to
exchange data with L1 memory. This includes L1 ROM, but
excludes scratchpad memory. Fine granulation of L1 memory
and special DMA buffers minimize potential memory conflicts,
if the L1 memory is accessed by the core contemporaneously.
Similarly, there are dedicated DMA buses between the DMAC1,
DMAC0, and USB DMA controllers and the external bus inter-
face unit (EBIU) that arbitrates DMA accesses to external
memories and boot ROM.
• SIC interrupt mask register (SIC_IMASK). This register
controls the masking and unmasking of each peripheral
interrupt event. When a bit is set in the register, that
peripheral event is unmasked and is processed by the sys-
tem when asserted. A cleared bit in the register masks the
peripheral event, preventing the processor from servicing
the event.
• SIC interrupt status register (SIC_ISR). As multiple periph-
erals can be mapped to a single event, this register allows
the software to determine which peripheral event source
triggered the interrupt. A set bit indicates the peripheral is
asserting the interrupt, and a cleared bit indicates the
peripheral is not asserting the event.
The ADSP-BF542/4/8/9 processor DMA controllers support
both 1-dimensional (1D) and 2-dimensional (2D) DMA trans-
fers. DMA transfer initialization can be implemented from
registers or from sets of parameters called descriptor blocks.
The 2D DMA capability supports arbitrary row and column
sizes up to 64K elements by 64K elements, and arbitrary row
and column step sizes up to 32K elements. Furthermore, the
column step size can be less than the row step size, allowing
implementation of interleaved data streams. This feature is
especially useful in video applications where data can be de-
interleaved on the fly.
• SIC interrupt wakeup enable register (SIC_IWR). By
enabling the corresponding bit in this register, a peripheral
can be configured to wake up the processor, should the
core be idled when the event is generated. (For more infor-
mation, see Dynamic Power Management on Page 16.)
Because multiple interrupt sources can map to a single general-
purpose interrupt, multiple pulse assertions can occur simulta-
neously, before or during interrupt processing for an interrupt
event already detected on this interrupt input. The IPEND reg-
ister contents are monitored by the SIC as the interrupt
acknowledgement.
Examples of DMA types supported by the ADSP-BF542/4/8/9
processor DMA controller include:
• A single, linear buffer that stops upon completion
• A circular, auto-refreshing buffer that interrupts on each
full or fractionally full buffer
The appropriate ILAT register bit is set when an interrupt rising
edge is detected (detection requires two core clock cycles). The
bit is cleared when the respective IPEND register bit is set. The
IPEND bit indicates that the event has entered into the proces-
sor pipeline. At this point the CEC recognizes and queues the
next rising edge event on the corresponding event input. The
minimum latency from the rising edge transition of the general-
purpose interrupt to the IPEND output asserted is three core
clock cycles; however, the latency can be much higher, depend-
ing on the activity within and the state of the processor.
• 1-D or 2-D DMA using a linked list of descriptors
• 2-D DMA using an array of descriptors, specifying only the
base DMA address within a common page
In addition to the dedicated peripheral DMA channels, both the
DMAC1 and the DMAC0 controllers feature two memory
DMA channel pairs for transfers between the various memories
of the ADSP-BF542/4/8/9 processor system. This enables trans-
fers of blocks of data between any of the memories—including
Rev. PrE
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
external DDR, ROM, SRAM, and flash memory—with minimal
processor intervention. Like peripheral DMAs, memory DMA
transfers can be controlled by a very flexible descriptor-based
methodology or by a standard register-based autobuffer
mechanism.
The 32.768 KHz input clock frequency is divided down to a
1 Hz signal by a prescaler. The counter function of the timer
consists of four counters: a 60-second counter, a 60-minute
counter, a 24-hour counter, and an 32,768-day counter.
When enabled, the alarm function generates an interrupt when
the output of the timer matches the programmed value in the
alarm control register. There are two alarms: The first alarm is
for a time of day. The second alarm is for a day and time of that
day.
The memory DMA channels of the DMAC1 controller
(MDMA2 and MDMA3) can be optionally controlled by the
external DMA request input pins. When used in conjunction
with the External Bus Interface Unit (EBIU), this so-called
Handshaked Memory DMA (HMDMA) scheme can be used to
efficiently exchange data with block-buffered or FIFO-style
devices connected externally. Users can select whether the DMA
request pins control the source or the destination side of the
memory DMA. It allows control of the number of data transfers
for memory DMA. The number of transfers per edge is pro-
grammable. This feature can be programmed to allow memory
DMA to have an increased priority on the external bus relative
to the core.
The stopwatch function counts down from a programmed
value, with one-second resolution. When the stopwatch is
enabled and the counter underflows, an interrupt is generated.
Like the other peripherals, the RTC can wake up the
ADSP-BF542/4/8/9 processor from sleep mode upon generation
of any RTC wakeup event. Additionally, an RTC wakeup event
can wake up the ADSP-BF542/4/8/9 processor from deep sleep
mode, and wake up the on-chip internal voltage regulator from
the hibernate operating mode.
Host DMA Port Interface
Connect RTC pins RTXI and RTXO with external components
as shown in Figure 4.
The Host DMA port (HOSTDP) facilitates a host device exter-
nal to the ADSP-BF542/4/8/9 to be a DMA master and transfer
data back and forth. The host device always masters the transac-
tions and the processor is always a DMA slave device.
RTXI
RTXO
R1
X1
The HOSTDP port is enabled through the peripheral access bus.
Once the port has been enabled, the transaction are controlled
by the external host. The external host programs standard DMA
configuration words in order to send/receive data to any valid
internal or external memory location. The Host DMA Port con-
troller includes the following features:
C1
C2
• Allows an external master to configure DMA read/write
data transfers and read port status
SUGGESTED COMPONENTS:
ECLIPTEK EC38J (THROUGH-HOLE PACKAGE)
EPSON MC405 12 PF LOAD (SURFACE MOUNT PACKAGE)
C1 = 22 PF
C2 = 22 PF
• Uses a flexible asynchronous memory protocol for its
external interface
⍀
R1 = 10 M
• Allows an 8- or 16-bit external data interface to the host
device
NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.
CONTACT CRYSTAL MANUFACTURER FOR DETAILS. C1 AND C2
SPECIFICATIONS ASSUME BOARD TRACE CAPACITANCE OF 3 PF.
• Supports half-duplex operation
Figure 4. External Components for RTC
• Supports Little/Big Endian data transfers
• Acknowledge mode allows flow control on host
transactions
WATCHDOG TIMER
The ADSP-BF542/4/8/9 processor includes a 32-bit timer that
can be used to implement a software watchdog function. A soft-
ware watchdog can improve system availability by forcing the
processor to a known state through generation of a hardware
reset, non-maskable interrupt (NMI), or general-purpose inter-
rupt, if the timer expires before being reset by software. The
programmer initializes the count value of the timer, enables the
appropriate interrupt, then enables the timer. Thereafter, the
software must reload the counter before it counts to zero from
the programmed value. This protects the system from remain-
ing in an unknown state where software, which would normally
reset the timer, has stopped running due to an external noise
condition or software error.
• Interrupt mode guarantees a burst of FIFO depth host
transactions
REAL-TIME CLOCK
The ADSP-BF542/4/8/9 processor Real-Time Clock (RTC) pro-
vides a robust set of digital watch features, including current
time, stopwatch, and alarm. The RTC is clocked by a
32.768 KHz crystal external to the ADSP-BF542/4/8/9 proces-
sors. The RTC peripheral has dedicated power supply pins so
that it can remain powered up and clocked even when the rest of
the processor is in a low-power state. The RTC provides several
programmable interrupt options, including interrupt per sec-
ond, minute, hour, or day clock ticks, interrupt on
programmable stopwatch countdown, or interrupt at a pro-
grammed alarm time.
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
If configured to generate a hardware reset, the watchdog timer
resets both the core and the ADSP-BF542/4/8/9 processor
peripherals. After a reset, software can determine if the watch-
dog was the source of the hardware reset by interrogating a
status bit in the watchdog timer control register.
SERIAL PORTS (SPORTS)
The ADSP-BF542/4/8/9 processor incorporates up to four dual-
channel synchronous serial ports (SPORT0, SPORT1, SPORT2,
SPORT3) for serial and multiprocessor communications. The
SPORTs support the following features:
The timer is clocked by the system clock (SCLK), at a maximum
• I2S capable operation.
frequency of fSCLK
.
• Bidirectional operation. Each SPORT has two sets of inde-
pendent transmit and receive pins, enabling eight channels
of I2S stereo audio.
TIMERS
There are up to two timer units in the ADSP-BF542/4/8/9 pro-
cessors. One unit provides eight general-purpose programmable
timers and the other unit provides three. Each timer has an
external pin that can be configured either as a Pulse Width
Modulator (PWM) or timer output, as an input to clock the
timer, or as a mechanism for measuring pulse widths and peri-
ods of external events. These timers can be synchronized to an
external clock input on the TMRx pins, an external clock
TMRCLK input pin, or to the internal SCLK.
• Buffered (8-deep) transmit and receive ports. Each port has
a data register for transferring data words to and from
other processor components and shift registers for shifting
data in and out of the data registers.
• Clocking. Each transmit and receive port can either use an
external serial clock or generate its own, in frequencies
ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz.
• Word length. Each SPORT supports serial data words from
3 to 32 bits in length, transferred most-significant-bit first
or least-significant-bit first.
The timer units can be used in conjunction with the two UARTs
and the CAN controller to measure the width of the pulses in
the data stream to provide a software auto-baud detect function
for the respective serial channels.
• Framing. Each transmit and receive port can run with or
without frame sync signals for each data word. Frame sync
signals can be generated internally or externally, active high
or low, and with either of two pulsewidths and early or late
frame sync.
The timers can generate interrupts to the processor core provid-
ing periodic events for synchronization, either to the system
clock or to a count of external signals.
In addition to the general-purpose programmable timers,
another timer is also provided by the processor core. This extra
timer is clocked by the internal processor clock and is typically
used as a system tick clock for generation of operating system
periodic interrupts.
• Companding in hardware. Each SPORT can perform
A-law or μ-law companding according to ITU recommen-
dation G.711. Companding can be selected on the transmit
and/or receive channel of the SPORT without additional
latencies.
UP/DOWN COUNTER AND THUMBWHEEL
INTERFACE
• DMA operations with single-cycle overhead. Each SPORT
can automatically receive and transmit multiple buffers of
memory data. The processor can link or chain sequences of
DMA transfers between a SPORT and memory.
A 32-bit up/down counter is provided that can sense 2-bit
quadrature or binary codes as typically emitted by industrial
drives or manual thumb wheels. The counter can also operate in
general-purpose up/down count modes. Then, count direction
is either controlled by a level-sensitive input pin or by two edge
detectors.
• Interrupts. Each transmit and receive port generates an
interrupt upon completing the transfer of a data word or
after transferring an entire data buffer or buffers through
DMA.
• Multichannel capability. Each SPORT supports 128 chan-
nels out of a 1024-channel window and is compatible with
the H.100, H.110, MVIP-90, and HMVIP standards.
A third input can provide flexible zero marker support and can
alternatively be used to input the push-button signal of thumb
wheels. All three pins have a programmable debouncing circuit.
An internal signal forwarded to the timer unit enables one timer
to measure the intervals between count events. Boundary regis-
ters enable auto-zero operation or simple system warning by
interrupts when programmable count values are exceeded.
SERIAL PERIPHERAL INTERFACE (SPI) PORTS
The ADSP-BF542/4/8/9 processor has up to three SPI-compati-
ble ports that allow the processor to communicate with multiple
SPI-compatible devices.
Each SPI port uses three pins for transferring data: two data pins
(master output-slave input, MOSI, and master input-slave out-
put, MISO) and a clock pin (serial clock, SCK). An SPI chip
select input pin (SPISS) lets other SPI devices select the proces-
sor, and seven SPI chip select output pins (SPISEL7–1) let the
processor select other SPI devices. The SPI select pins are recon-
figured programmable flag pins. Using these pins, the SPI ports
provide a full-duplex, synchronous serial interface, which sup-
ports both master/slave modes and multimaster environments.
Rev. PrE
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Preliminary Technical Data
ADSP-BF542/4/8/9
The SPI port’s baud rate and clock phase/polarities are pro-
grammable, and it has an integrated DMA controller,
configurable to support transmit or receive data streams. The
SPI’s DMA controller can only service unidirectional accesses at
any given time.
UART1 and UART3 feature a pair of RTS (request to send) and
CTS (clear to send) signals for hardware flow purposes. The
transmitter hardware is automatically prevented from sending
further data when the CTS input is de-asserted. The receiver can
automatically de-assert its RTS output when the enhanced
receive FIFO exceeds a certain high-water level. The capabilities
of the UARTs are further extended with support for the Infrared
Data Association (IrDA®) Serial Infrared Physical Layer Link
Specification (SIR) protocol.
The SPI port’s clock rate is calculated as:
f
SCLK
--------------------------------
SPI Clock Rate =
2 × SPI_Baud
CONTROLLER AREA NETWORK (CAN)
Where the 16-bit SPI_BAUD register contains a value of 2 to
65,535.
The ADSP-BF542/4/9 processor offers up to two CAN control-
lers that are communication controllers that implement the
Controller Area Network (CAN) 2.0B (active) protocol. This
protocol is an asynchronous communications protocol used in
both industrial and automotive control systems. The CAN pro-
tocol is well suited for control applications due to its capability
to communicate reliably over a network since the protocol
incorporates CRC checking message error tracking, and fault
node confinement.
During transfers, the SPI port simultaneously transmits and
receives by serially shifting data in and out on its two serial data
lines. The serial clock line synchronizes the shifting and sam-
pling of data on the two serial data lines.
UART PORTS (UARTS)
The ADSP-BF542/4/8/9 processor provides up to four full-
duplex Universal Asynchronous Receiver/Transmitter (UART)
ports. Each UART port provides a simplified UART interface to
other peripherals or hosts, supporting full-duplex, DMA-sup-
ported, asynchronous transfers of serial data. A UART port
includes support for 5 to 8 data bits, 1 or 2 stop bits, and none,
even, or odd parity. Each UART port supports two modes of
operation:
The ADSP-BF542/4/9 CAN controllers offer the following
features:
• 32 mailboxes (8 receive only, 8 transmit only, 16 config-
urable for receive or transmit).
• Dedicated acceptance masks for each mailbox.
• Additional data filtering on first two bytes.
• PIO (programmed I/O). The processor sends or receives
data by writing or reading I/O-mapped UART registers.
The data is double-buffered on both transmit and receive.
• Support for both the standard (11-bit) and extended (29-
bit) identifier (ID) message formats.
• DMA (Direct Memory Access). The DMA controller trans-
fers both transmit and receive data. This reduces the
number and frequency of interrupts required to transfer
data to and from memory. Each UART has two dedicated
DMA channels, one for transmit and one for receive. These
DMA channels have lower default priority than most DMA
channels because of their relatively low service rates. Flexi-
ble interrupt timing options are available on the transmit
side.
• Support for remote frames.
• Active or passive network support.
• CAN wakeup from hibernation mode (lowest static power
consumption mode).
• Interrupts, including: TX complete, RX complete, error,
global.
The electrical characteristics of each network connection are
very demanding so the CAN interface is typically divided into
two parts: a controller and a transceiver. This allows a single
controller to support different drivers and CAN networks. The
ADSP-BF542/4/9 CAN module represents only the controller
part of the interface. The controller interface supports connec-
tion to 3.3V high-speed, fault-tolerant, single-wire transceivers.
Each UART port's baud rate, serial data format, error code gen-
eration and status, and interrupts are programmable:
• Supporting bit rates ranging from (fSCLK/ 1,048,576) to
(fSCLK) bits per second.
• Supporting data formats from 7 to12 bits per frame.
TWI CONTROLLER INTERFACE
• Both transmit and receive operations can be configured to
generate maskable interrupts to the processor.
The ADSP-BF542/4/8/9 processor includes up to two Two Wire
Interface (TWI) modules for providing a simple exchange
method of control data between multiple devices. The modules
are compatible with the widely used I2C bus standard. The TWI
modules offer the capabilities of simultaneous Master and Slave
operation, support for both 7-bit addressing and multimedia
data arbitration. Each TWI interface uses two pins for transfer-
ring clock (SCL) and data (SDA) and supports the protocol at
speeds up to 400k bits/sec. The TWI interface pins are compati-
ble with 5 V logic levels.
The UART port’s clock rate is calculated as:
f
SCLK
---------------------------------------------------------------------------
UART Clock Rate =
(1 – EBIO)
16
× UART_Divisor
Where the 16-bit UART Divisor comes from the UARTx_DLH
register (most significant 8 bits) and UARTx_DLL register (least
significant 8 bits).
In conjunction with the general-purpose timer functions, auto-
baud detection is supported.
Rev. PrE
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ADSP-BF542/4/8/9
Preliminary Technical Data
Additionally, the ADSP-BF542/4/8/9 processor’s TWI modules
are fully compatible with Serial Camera Control Bus (SCCB)
functionality for easier control of various CMOS camera sensor
devices.
both LCD panels and digital video outputs. The main image
buffer provides the basic background image, which is presented
in the data stream. The overlay image buffer allows the user to
add multiple foreground text, graphics, or video on top of the
main image or video data stream.
PORTS
ENHANCED PARALLEL PERIPHERAL INTERFACE
(EPPI)
Because of their rich set of peripherals, the ADSP-BF542/4/8/9
processors group the many peripheral signals to ten ports—
referred to as Port A to Port J. Most ports contain 16 pins, a few
have less. Many of the associated pins are shared by multiple
signals. The ports function as multiplexer controls. Every port
has its own set of memory-mapped registers to control port
muxing and GPIO functionality.
The ADSP-BF542/4/8/9 processor provides up to three
Enhanced Parallel Peripheral Interfaces (EPPIs), supporting
data widths up to 24 bits wide. The EPPI supports direct con-
nection to active TFT LCD, parallel A/D and D/A converters,
video encoders and decoders, image sensor modules and other
general purpose peripherals.
General-Purpose I/O (GPIO)
The following features are supported in the EPPI module.
Every pin in Port A to Port J can function as a GPIO pin result-
ing in a GPIO pin count of 154. While it is unlikely that all
GPIOs will be used in an application as all pins have multiple
functions, the richness of GPIO functionality guarantees unre-
strictive pin usage. Every pin that is not used by any function
can be configured in GPIO mode on an individual basis.
• Programmable data length: 8, 10, 12, 14, 16, 18, 24 and 32
bits per clock.
• Bi-directional and half-duplex port.
• Clock can be provided externally or can be generated
internally.
After reset, all pins are in GPIO mode by default. Neither GPIO
output nor input drivers are active by default. Unused pins can
be left unconnected, therefore. GPIO data and direction control
registers provide flexible write-one-to-set and write-one-to-
clear mechanisms so that independent software threads do not
need to protect against each other because of expensive read-
modify-write operations when accessing the same port.
• Various framed and non-framed operating modes. Frame
syncs can be generated internally or can be supplied by an
external device.
• Various general purpose modes with one frame syncs, two
frame syncs, three frame syncs and zero frame sync modes
for both receive and transmit.
• ITU-656 status word error detection and correction for
ITU-656 Receive modes.
Pin Interrupts
Due to the huge number of port pins, the ADSP-BF542/4/8/9
processors introduce a new scheme to manage pin interrupts.
Every port pin can request interrupts in either an edge-sensitive
or a level-sensitive manner with programmable polarity. Inter-
rupt functionality is decoupled from GPIO operation. Four
system-level interrupt channels (INT0, INT1, INT2 and INT3)
are reserved for this purpose. Each of these interrupt channels
can manage up to 32 interrupt pins. The assignment from pin to
interrupt is not performed at a pin by pin level. Rather, groups
of eight pins (half ports) can be flexibly assigned to interrupt
channels.
• ITU-656 preamble and status word decode.
• Three different modes for ITU-656 receive modes: active
video only, vertical blanking only, and entire field mode.
• Horizontal and vertical windowing for GP 2 and 3 FS
Modes.
• Optional packing and unpacking of data to/from 32 bits
from/to 8, 16 and 24 bits. If packing/unpacking is enabled,
endianness can be changed to change the order of pack-
ing/unpacking of bytes/words.
• Optional sign extension or zero fill for receive modes.
Every pin interrupt channel features a special set of 32-bit mem-
ory-mapped registers, that enable half port assignment and
interrupt management. This not only includes masking, identi-
fication, and clearing of requests, it also enables access to the
respective pin states and use of the interrupt latches regardless
of whether the interrupt is masked or not. Most control registers
feature multiple MMR address entries to write-one-to-set or
write-one-to-clear them individually.
• During receive modes, alternate even or odd data samples
can be filtered out.
• Programmable clipping of data values for 8-bit transmit
modes.
• RGB888 can be converted to RGB666 or RGB565 for trans-
mit modes.
• Various de-interleaving/interleaving modes for receiv-
ing/transmitting 4:2:2 YCrCb data.
PIXEL COMPOSITOR (PIXC)
The pixel compositor (PIXC) provides image overlay with
transparent-color support, alpha blending, and color space con-
version capability for output to TFT-LCDs as well as
NTSC/PAL video encoders. It provides all of the control to
allow two data streams from two separate data buffers to be
combined, blended, and converted into appropriate forms for
• FIFO watermarks and urgent DMA features.
• Clock gating by an external device asserting the clock gat-
ing control signal.
Rev. PrE
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Preliminary Technical Data
ADSP-BF542/4/8/9
USB ON-THE-GO DUAL-ROLE DEVICE CONTROLLER
SECURE DIGITAL (SD)/SDIO CONTROLLER
The USB OTG controller provides a low-cost connectivity solu-
tion for consumer mobile devices such as cell phones, digital
still cameras and MP3 players, allowing these devices to transfer
data using a point-to-point USB connection without the need
for a PC host. The USBDRC module can operate in a traditional
USB peripheral-only mode as well as the host mode presented
in the On-The-Go (OTG) supplement [1] to the USB 2.0 Speci-
fication [2]. In host mode, the USB module supports transfers at
high-speed (480Mbps), full-speed (12Mbps), and low-speed
(1.5Mbps) rates. Peripheral-only mode supports the high- and
full-speed transfer rates.
The SD/SDIO controller is a serial interface that stores data at a
data rate of up to 10M bytes per second using a 4-bit data line.
The interface runs at 25 MHz.
The SD/SDIO controller supports the SD memory mode only.
The interface supports all the power modes and performs error
checking by CRC.
CODE SECURITY
An OTP/security system consisting of a blend of hardware and
software provides customers with a flexible and rich set of code
TM
security features with Lockbox 1 secure technology. Key fea-
tures include:
ATA/ATAPI–6 INTERFACE
• OTP memory
The ATAPI interface connects to CD/DVD and HDD drives,
and is ATAPI-6 compliant. The controller implements the
peripheral I/O mode, the multi-DMA mode, and the Ultra
DMA mode. The DMA modes enable faster data transfer and
reduced host management. The ATAPI Controller supports
PIO, Multi-DMA, and Ultra DMA ATAPI accesses. Key fea-
tures include:
• Unique chip ID
• Code authentication
• Secure mode of operation
MEDIA TRANSCEIVER MAC LAYER (MXVR)
The ADSP-BF549 processor provides a Media Transceiver
(MXVR) MAC layer, allowing the processor to be connected
directly to a MOST®2 network through just an FOT or Electrical
PHY.
• Supports PIO modes 0,1,2,3,4
• Supports Multiword DMA modes 0,1,2
• Supports Ultra DMA modes 0,1,2,3,4,5 (up to UDMA 100)
• Programmable timing for ATA interface unit
• Supports CompactFlash Card using True IDE mode
The MXVR is fully compatible with the industry standard stan-
dalone MOST controller devices, supporting 22.579 Mbps or
24.576 Mbps data transfer. It offers faster lock times, greater jit-
ter immunity, a sophisticated DMA scheme for data transfers,
and the high-speed internal interface to the core and L1 mem-
ory allows the full bandwidth of the network to be utilized. The
MXVR can operate as either the network master or as a network
slave.
KEYPAD INTERFACE
The keypad interface is a 16 pin interface module that is used to
detect the key pressed in a 8x8 (maximum) keypad matrix. The
size of the input keypad matrix is programmable. The interface
is capable of filtering the bounce on the input pins, which is
common in keypad applications. The width of the filtered
bounce is programmable. The Interface module is capable of
generating an interrupt request to the core once it identifies that
any key has been pressed.
The MXVR supports synchronous data, asynchronous packets,
and control messages using dedicated DMA channels which
operate autonomously from the processor core moving data to
and from L1 and/or L2 memory. Synchronous data is trans-
ferred to or from the synchronous data physical channels on the
MOST bus through eight programmable DMA channels. The
synchronous data DMA channels can operate in various modes
including modes which trigger DMA operation when data pat-
terns are detected in the receive data stream. Furthermore two
DMA channels support asynchronous traffic and a further two
support control message traffic.
The interface supports a press-release-press mode and infra-
structure for a press-hold mode. The former mode identifies a
press, release and press of a key as two consecutive presses of the
same key where as the later mode checks the input key’s state in
periodic intervals to determine the number of times the same
key is meant to be pressed. Simultaneous multiple keys pressed
detection possible and limited key resolution capability. Key
features include:
Interrupts are generated when a user defined amount of syn-
chronous data has been sent or received by the processor or
when asynchronous packets or control messages have been sent
or received.
• Supports a maximum of 8x8 keypad matrix
• Programmable input keypad matrix size
• Debounce filter on input signals
The MXVR peripheral can wake up the ADSP-BF549 processor
from sleep mode when a wakeup preamble is received over the
network or based on any other MXVR interrupt event. Addi-
tionally, detection of network activity by the MXVR can be used
to wake up the ADSP-BF549 processor from sleep mode or
• Programmable debounce filter width
• Press-Release-Press mode supported
• Infrastructure for Press-Hold mode present
• Interrupt on any key pressed capability
1 Lockbox is a trademark of Analog Devices, Inc.
• Multiple key pressed detection and limited multiple key
resolution capability
2 MOST is a registered trademark of Standard Microsystems, Corp.
Rev. PrE
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
hibernate. These features allow the ADSP-BF549 to operate in a
low-power state when there is no network activity or when data
is not currently being received or transmitted by the MXVR.
cally an external event or RTC activity will wake up the
processor. When in the sleep mode, assertion of wakeup will
cause the processor to sense the value of the BYPASS bit in the
PLL control register (PLL_CTL). If BYPASS is disabled, the pro-
cessor will transition to the full on mode. If BYPASS is enabled,
the processor will transition to the active mode.
The MXVR clock is provided through a dedicated external crys-
tal or crystal oscillator. The frequency of external crystal or
crystal oscillator can be 256Fs, 384Fs, 512Fs, or 1024Fs for
Fs = 38kHz, 44.1kHz, or 48kHz. If using a crystal to provide the
MXVR clock, use a parallel-resonant, fundamental mode,
microprocessor-grade crystal.
When in the sleep mode, system DMA access to L1 memory is
not supported.
Deep Sleep Operating Mode – Maximum Dynamic Power
Savings
DYNAMIC POWER MANAGEMENT
The ADSP-BF542/4/8/9 processor provides five operating
modes, each with a different performance/power profile. In
addition, dynamic power management provides the control
functions to dynamically alter the processor core supply voltage,
further reducing power dissipation. Control of clocking to each
of the ADSP-BF542/4/8/9 processor peripherals also reduces
power consumption. See Table 5 for a summary of the power
settings for each mode.
The deep sleep mode maximizes dynamic power savings by dis-
abling the clocks to the processor core (CCLK) and to all
synchronous peripherals (SCLK). Asynchronous peripherals,
such as the RTC, may still be running but will not be able to
access internal resources or external memory. This powered-
down mode can only be exited by assertion of the reset interrupt
(RESET) or by an asynchronous interrupt generated by the
RTC. When in deep sleep mode, an RTC asynchronous inter-
rupt causes the processor to transition to the active mode.
Assertion of RESET while in deep sleep mode causes the proces-
sor to transition to the full on mode.
Full-On Operating Mode – Maximum Performance
In the full-on mode, the PLL is enabled and is not bypassed,
providing capability for maximum operational frequency. This
is the power-up default execution state in which maximum per-
formance can be achieved. The processor core and all enabled
peripherals run at full speed.
Hibernate State – Maximum Static Power Savings
The hibernate state maximizes static power savings by disabling
the voltage and clocks to the processor core (CCLK) and to all
the synchronous peripherals (SCLK). The internal voltage regu-
lator for the processor can be shut off by writing b#00 to the
FREQ bits of the VR_CTL register. This disables both CCLK
and SCLK. Furthermore, it sets the internal power supply volt-
age (VDDINT) to 0V to provide the greatest power savings mode.
Any critical information stored internally (memory contents,
register contents, etc.) must be written to a non-volatile storage
device prior to removing power if the processor state is to be
preserved.
Active Operating Mode – Moderate Power Savings
In the active mode, the PLL is enabled but bypassed. Because the
PLL is bypassed, the processor’s core clock (CCLK) and system
clock (SCLK) run at the input clock (CLKIN) frequency. In this
mode, the CLKIN to CCLK multiplier ratio can be changed,
although the changes are not realized until the Full-On mode is
entered. DMA access is available to appropriately configured L1
memories.
Since VDDEXT is still supplied in this mode, all of the external
pins tri-state, unless otherwise specified. This allows other
devices that may be connected to the processor to have power
still applied without drawing unwanted current.
In the active mode, it is possible to disable the PLL through the
PLL Control register (PLL_CTL). If disabled, the PLL must be
re-enabled before transitioning to the full-on or sleep modes.
Table 5. Power Settings
The internal supply regulator can be woken up by CAN, by the
MXVR, by the keypad, by the up/down counter, and by some
GPIO pins. It can also be woken up by a real-time clock wakeup
event or by asserting the RESET pin. Waking up from hibernate
state initiates the hardware reset sequence.
With the exception of the VR_CTL and the RTC registers, all
internal registers and memories lose their content in hibernate
state. State variables may be held in external SRAM or SDRAM.
Full On
Active
Enabled
No
Enabled Enabled On
Enabled Enabled On
Enabled/ Yes
Disabled
Sleep
Enabled
-
-
-
Disabled Enabled On
Disabled Disabled On
Disabled Disabled Off
Power Savings
Deep Sleep Disabled
Hibernate Disabled
As shown in Table 6, the ADSP-BF542/4/8/9 processor supports
different power domains. The use of multiple power domains
maximizes flexibility, while maintaining compliance with
industry standards and conventions. By isolating the internal
logic of the ADSP-BF542/4/8/9 processor into its own power
domain, separate from the RTC and other I/O, the processor
Sleep Operating Mode – High Dynamic Power Savings
The sleep mode reduces dynamic power dissipation by disabling
the clock to the processor core (CCLK). The PLL and system
clock (SCLK), however, continue to operate in this mode. Typi-
Rev. PrE
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
can take advantage of dynamic power management, without
affecting the RTC or other I/O devices. There are no sequencing
requirements for the various power domains.
For additional information, see “Switching Regulator Design
Considerations for the ASDP-BF533 Blackfin Processors” (EE-
228).
Table 6. Power Domains
Power Domain
VDD Range
VDDINT
2.25V TO 3.6V
INPUT VOLTAGE
RANGE
SET OF DECOUPLING
CAPACITORS
VDDEXT
(LOW-INDUCTANCE)
All internal logic, except RTC, DDR, and USB
RTC internal logic and crystal I/O
DDR external memory supply
USB internal logic and crystal I/O
MXVR crystal I/O
VDDRTC
VDDEXT
+
VDDDDR
VDDUSB
VDDMC
100μF
10μH
100nF
VDDINT
+
+
MXVR I/O
VDDMX
100μF
FDS9431A
MXVR PLL and logic
VDDMP
100μF
10μF
LOW ESR
All other I/O
VDDEXT
ZHCS1000
VROUT
VOLTAGE REGULATION
SHORT AND LOW-
INDUCTANCE WIRE
VROUT
The ADSP-BF542/4/8/9 processor provides an on-chip voltage
regulator that can generate processor core voltage levels from an
external supply. (Note specifications as indicated in Operating
Conditions on Page 31.) Figure 5 shows the typical external
components required to complete the power management sys-
tem. The regulator controls the internal logic voltage levels and
is programmable with the voltage regulator control register
(VR_CTL) in increments of 50 mV. To reduce standby power
consumption, the internal voltage regulator can be programmed
to remove power to the processor core while keeping I/O power
supplied. While in hibernate mode, VDDEXT can still be applied,
eliminating the need for external buffers. The voltage regulator
can be activated from this power down state by assertion of the
RESET pin, which will then initiate a boot sequence. The regula-
tor can also be disabled and bypassed at the user’s discretion.
NOTE: DESIGNER SHOULD MINIMIZE
TRACE LENGTH TO FDS9431A.
GND
Figure 5. Voltage Regulator Circuit
CLOCK SIGNALS
The ADSP-BF542/4/8/9 processor can be clocked by an external
crystal, a sine wave input, or a buffered, shaped clock derived
from an external clock oscillator.
If an external clock is used, it should be a TTL compatible signal
and must not be halted, changed, or operated below the speci-
fied frequency during normal operation. This signal is
connected to the processor’s CLKIN pin. When an external
clock is used, the XTAL pin must be left unconnected.
Alternatively, because the ADSP-BF542/4/8/9 processor
includes an on-chip oscillator circuit, an external crystal may be
used. For fundamental frequency operation, use the circuit
shown in Figure 6. A parallel-resonant, fundamental frequency,
microprocessor-grade crystal is connected across the CLKIN
and XTAL pins. The on-chip resistance between CLKIN and the
XTAL pin is in the 500 kΩ range. Further parallel resistors are
typically not recommended. The two capacitors and the series
resistor shown in Figure 6 fine tune phase and amplitude of the
sine frequency.
The capacitor and resistor values shown in Figure 6 are typical
values only. The capacitor values are dependent upon the crystal
manufacturers’ load capacitance recommendations and the PCB
physical layout. The resistor value depends on the drive level
Rev. PrE
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
specified by the crystal manufacturer. System designs should
verify the customized values based on careful investigations on
multiple devices over temperature range.
It functions as reference for many timing specifications. While
inactive by default, it can be enabled using the EBIU_SDGCTL
and EBIU_AMGCTL registers.
BLACKFIN
DYNAMIC MODIFICATION
REQUIRES PLL SEQUENCING
DYNAMIC MODIFICATION
ON-THE-FLY
CLKOUT
TO PLL CIRCUITRY
EN
، 1, 2, 4, 8
، 1:15
CCLK
CLKBUF
PLL
0.5x - 64x
CLKIN
VCO
EN
SCLK
CLKIN
18 pF*
XTAL
330⍀*
FOR OVERTONE
OPERATION ONLY:
SCLK Յ CCLK/2
SCLK Յ 133MHz
18 pF*
Figure 7. Frequency Modification Methods
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED
DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE
ANALYZE CAREFULLY.
All on-chip peripherals are clocked by the system clock (SCLK).
The system clock frequency is programmable by means of the
SSEL3–0 bits of the PLL_DIV register. The values programmed
into the SSEL fields define a divide ratio between the PLL output
(VCO) and the system clock. SCLK divider values are two
through 15. Table 7 illustrates typical system clock ratios. The
default ratio is 5.
Figure 6. External Crystal Connections
A third-overtone crystal can be used at frequencies above 25
MHz. The circuit is then modified to ensure crystal operation
only at the third overtone, by adding a tuned inductor circuit as
shown in Figure 6. A design procedure for third-overtone oper-
ation is discussed in detail in application note EE-168.
Table 7. Example System Clock Ratios
The Blackfin core runs at a different clock rate than the on-chip
peripherals. As shown in Figure 7 on Page 18, the core clock
(CCLK) and system peripheral clock (SCLK) are derived from
the input clock (CLKIN) signal. An on-chip PLL is capable of
multiplying the CLKIN signal by a programmable
1
؋
to 63؋
multiplication factor (bounded by specified mini- mum and maximum VCO frequencies). The default multiplier
is 10
؋
, but it can be modified by a software instruction sequence. On-the-fly frequency changes can be effected by sim-
ply writing to the PLL_DIV register.
Example Frequency Ratios
(MHz)
VCO
200
Signal Name Divider Ratio
SSEL3–0
VCO/SCLK
SCLK
100
50
0010
2:1
0110
6:1
300
1010
10:1
500
50
Note that the divisor ratio must be chosen to limit the system
clock frequency to its maximum of fSCLK. The SSEL value can be
changed dynamically without any PLL lock latencies by writing
the appropriate values to the PLL divisor register (PLL_DIV).
On-the-fly CCLK and SCLK frequency changes can be effected
by simply writing to the PLL_DIV register. Whereas the maxi-
mum allowed CCLK and SCLK rates depend on the applied
voltages VDDINT and VDDEXT, the VCO is always permitted to run
up to the frequency specified by the part’s speed grade. The
CLKOUT pin reflects the SCLK frequency to the off-chip world.
The core clock (CCLK) frequency can also be dynamically
changed by means of the CSEL1–0 bits of the PLL_DIV register.
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in
Table 8. The default ratio is 1. This programmable core clock
capability is useful for fast core frequency modifications.
Rev. PrE
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Preliminary Technical Data
ADSP-BF542/4/8/9
The maximum CCLK frequency not only depends on the part's
speed grade, it also depends on the applied VDDINT voltage. See
Table 15 through Table 17 for details.
pins of the reset configuration register, sampled during power-
on resets and software-initiated resets, implement the following
modes:
• Idle–no boot mode (BMODE=0x0) — In this mode, the
processor goes into idle. The idle boot mode helps to
recover from illegal operating modes, in the case the user
misconfigured the OTP memory.
Table 8. Core Clock Ratios
Signal Name Divider Ratio Example Frequency Ratios
CSEL1–0
VCO/CCLK
(MHz)
VCO
300
• Boot from 8- or 16-bit external flash memory
(BMODE=0x1) — In this mode, the boot kernel loads the
first block header from address 0x2000 0000 and—depend-
ing on instructions containing in the header—the boot
kernel performs 8-bit or 16-bit boot or starts program exe-
cution at the address provided by the header. By default, all
configuration settings are set for the slowest device possible
(3-cycle hold time; 15-cycle R/W access times; 4-cycle
setup).
CCLK
300
150
125
25
00
01
10
11
1:1
2:1
4:1
8:1
300
500
200
BOOTING MODES
The ADSP-BF542/4/8/9 processor has many mechanisms (listed
in Table 9) for automatically loading internal and external
memory after a reset. The boot mode is defined by four BMODE
input pins dedicated to this purpose. There are two categories of
boot modes: In master boot modes the processor actively loads
data from parallel or serial memories. In slave boot modes the
processor receives data from an external host devices.
• Boot from 16-bit asynchronous FIFO (BMODE=0x2) — In
this mode, the boot kernel starts booting from address
0x2030 0000. Every 16-bit word that boot kernel has to read
from the FIFO must be requested by an low pulse on the
DMAR1 pin.
• Boot from serial SPI memory, EEPROM or flash
(BMODE=0x3) — Eight-, 16-, 24- or 32-bit addressable
devices are supported. (internal note: no special support for
DataFlashes, as they understand now also standard SPI
protocol). The processor uses the PE4 GPIO pin to select a
single SPI EEPROM/flash device, submits a read command
and successive address bytes (0x00) until a valid 8-, 16-,
24-, or 32-bit addressable device is detected. Pull-up resis-
tors are required on the SSEL and MISO pins. By default, a
value of 0x85 is written to the SPI_BAUD register.
Table 9. Booting Modes
BMODE3–0 Description
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
Idle–no boot
Boot from 8- or 16-bit external flash memory
Boot from 16-bit asynchronous FIFO
Boot from serial SPI memory (EEPROM or flash)
Boot from SPI host device
Boot from serial TWI memory (EEPROM/flash)
Boot from TWI host
• Boot from SPI host device (BMODE=0x4) — The proces-
sor operates in SPI slave mode (using SPI0) and is
configured to receive the bytes of the.LDR file from an SPI
host (master) agent. In the host, the HWAIT signal must be
interrogated by the host before every transmitted byte. A
pull-up resistor is required on the SPISS input. A pull-
down on the serial clock may improve signal quality and
booting robustness.
Boot from UART host
Reserved
Reserved
Boot from (DDR) SDRAM
Reserved
• Boot from serial TWI memory, EEPROM/flash
(BMODE=0x5) — The processor operates in master mode
(using TWI0) and selects the TWI slave with the unique id
0xA0. The processor submits successive read commands to
the memory device starting at two byte internal address
0x0000 and begins clocking data into the processor. The
TWI memory device should comply with Philips I2C Bus
Specification version 2.1 and have the capability to auto-
increment its internal address counter such that the con-
tents of the memory device can be read sequentially. By
default, a prescale value of 0xA and CLKDIV value of
0x0811 is used. Unless, altered by OTP settings an I2C
memory that takes two address bytes is assumed. Develop-
ment tools ensure that data that is booted to memories that
cannot be accessed by the Blackfin core is written to inter-
mediate storage place and then copied to final destination
via Memory DMA.
Reserved
Reserved
Boot from 16-Bit Host DMA
Boot from 8-Bit Host DMA
The boot modes listed in Table 9 provide a number of mecha-
nisms for automatically loading the processor’s internal and
external memories after a reset. By default all boot modes use
the slowest meaningful configuration settings. Default settings
can be altered via the initialization code feature at boot time or
by proper OTP programming at pre-boot time.The BMODE
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Preliminary Technical Data
• Boot from TWI host (BMODE=0x6) — The TWI host
agent selects the slave with the unique id 0x5F. The proces-
sor (using TWI0) replies with an acknowledgement and the
host can then download the boot stream. The TWI host
agent should comply with Philips I2C Bus Specification ver-
sion 2.1. An I2C multiplexer can be used to select one
processor at a time when booting multiple processors from
a single TWI.
Port. The host will receive an interrupt from the
HOST_ACK signal every time it is allowed to send the next
FIFO depth (Sixteen 32-bit words) of information. When
the host sends an HIRQ control command, the boot kernel
issues a CALL instruction to address 0xFFA0 0000. It is the
host's responsibility to ensure valid code has been place at
this address. The routine at 0xFFA0 0000 can be a simple
initialization routine to configure internal resources, such
as the SDRAM controller, then returns using an RTS
instruction. The routine may also by the final application
which will never return to the boot kernel.
• Boot from UART host (BMODE=0x7) — In this mode, the
processor uses UART1 as booting source. Using an auto-
baud handshake sequence, a boot-stream-formatted
program is downloaded by the host. The host agent selects
a bit rate within the UART’s clocking capabilities.
For each of the boot modes, a 16-byte header is first read from
an external memory device. The header specifies the number of
bytes to be transferred and the memory destination address.
Multiple memory blocks may be loaded by any boot sequence.
Once all blocks are loaded, program execution commences from
the address stored in the EVT1 register.
When performing the autobaud, the UART expects a “@”
(0x40) character (eight bits data, one start bit, one stop bit,
no parity bit) on the RXD pin to determine the bit rate. It
then replies with an acknowledgement which is composed
of 4 bytes: 0xBF, the value of UART_DLL, the value of
UART_DLH, 0x00. The host can then download the boot
stream. The processor deasserts the RTS output to hold off
the host; CTS functionality is not enabled at boot time.
Prior to booting, the pre-boot routine interrogates the OTP
memory. Individual boot modes can be customized or even dis-
abled based on OTP programming. External hardware,
especially booting hosts may watch the HWAIT signal to deter-
mine when the pre-boot has finished and the boot kernel starts
the boot process.
• Boot from (DDR) SDRAM (BMODE=0xA) — In this
mode, the boot kernel starts booting from address 0x0000
0010. This is a warm boot scenery only. The SDRAM is
expected to contain a valid boot stream and the SDRAM
controller must have been configured by the OTP settings.
The boot kernel differentiates between a regular hardware reset
and a wakeup-from-hibernate event to speed up booting in the
later case. Bits 6-5 in the system reset configuration (SYSCR)
register can be used to bypass pre-boot routine and/or boot ker-
nel in case of a software reset. They can also be used to simulate
a wakeup-from-hibernate boot in the software reset case.
• Boot from 16-Bit Host DMA (BMODE=0xE) — In this
mode, the host DMA port is configured in 16-bit Acknowl-
edge mode, little endian. Unlike in other modes, here the
host is responsible for interpreting the boot stream. It
writes data block per data block into the Host DMA port.
Before configuring the DMA settings for each block, the
host may either poll the ALLOW_CONFIG bit in
HOST_STATUS or wait to be interrupted by the HWAIT
signal. When using HWAIT, the host must still check
ALLOW_CONFIG at least once before beginning to con-
figure the Host DMA Port. After completing the
configuration the host is required to poll the READY bit in
HOST_STATUS before beginning to transfer data. When
the host sends an HIRQ control command, the boot kernel
issues a CALL instruction to 0xFFA0 0000 address. It is the
host's responsibility to ensure valid code has been placed at
this address. The routine at 0xFFA0 0000 can be a simple
initialization routine to configure internal resources, such
as the SDRAM controller, then returns using an RTS
instruction. The routine may also by the final application
which will never return to the boot kernel.
The boot process can be further customized by “initialization
code.” This is a piece of code that is loaded and executed prior to
the regular application boot. Typically, this is used to configure
the DDR controller or to speed up booting by managing PLL,
clock frequencies, wait states, or serial bit rates.
The boot ROM also features C-callable function entries that can
be called by the user application at run time. This enables sec-
ond-stage boot or boot management schemes to be
implemented with ease.
INSTRUCTION SET DESCRIPTION
The Blackfin processor family assembly language instruction set
employs an algebraic syntax designed for ease of coding and
readability. The instructions have been specifically tuned to pro-
vide a flexible, densely encoded instruction set that compiles to
a very small final memory size. The instruction set also provides
fully featured multifunction instructions that allow the pro-
grammer to use many of the processor core resources in a single
instruction. Coupled with many features more often seen on
microcontrollers, this instruction set is very efficient when com-
piling C and C++ source code. In addition, the architecture
supports both user (algorithm/application code) and supervisor
(O/S kernel, device drivers, debuggers, ISRs) modes of opera-
tion, allowing multiple levels of access to core processor
resources.
• Boot from 8-Bit Host DMA (BMODE=0xF) — In this
mode, the Host DMA port is configured in 8-bit interrupt
mode, little endian. Unlike in other modes, here the host is
responsible for interpreting the boot stream. It writes data
block per data block into the Host DMA port. Before con-
figuring the DMA settings for each block, the host may
either poll the ALLOW_CONFIG bit in HOST_STATUS
or wait to be interrupted by the HWAIT signal. When
using HWAIT, the host must still check ALLOW_CONFIG
at least once before beginning to configure the Host DMA
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Preliminary Technical Data
ADSP-BF542/4/8/9
The assembly language, which takes advantage of the proces-
sor’s unique architecture, offers the following advantages:
RELATED DOCUMENTS
The following publications that describe the ADSP-BF542/4/8/9
processors (and related processors) can be ordered from any
Analog Devices sales office or accessed electronically on our
Website:
• Seamlessly integrated DSP/MCU features are optimized for
both 8-bit and 16-bit operations.
• A multi-issue load/store modified-Harvard architecture,
which supports two 16-bit MAC or four 8-bit ALU + two
load/store + two pointer updates per cycle.
• ADSP-BF54x Blackfin Processor Hardware Reference
• ADSP-BF54x Blackfin Processor Peripheral Reference
• ADSP-BF54x Blackfin Processor Programming Reference
• All registers, I/O, and memory are mapped into a unified
4G byte memory space, providing a simplified program-
ming model.
• ADSP-BF542 Blackfin Embedded Processor Silicon Anomaly
List (in preparation)
• Microcontroller features, such as arbitrary bit and bit-field
manipulation, insertion, and extraction; integer operations
on 8-, 16-, and 32-bit data-types; and separate user and
supervisor stack pointers.
• ADSP-BF544 Blackfin Embedded Processor Silicon Anomaly
List (in preparation)
• ADSP-BF548 Blackfin Embedded Processor Silicon Anomaly
List (in preparation)
• Code density enhancements, which include intermixing of
16- and 32-bit instructions (no mode switching, no code
segregation). Frequently used instructions are encoded in
16 bits.
• ADSP-BF549 Blackfin Embedded Processor Silicon Anomaly
List
DEVELOPMENT TOOLS
The ADSP-BF542/4/8/9 processor is supported with a complete
set of CROSSCORE® software and hardware development tools,
including Analog Devices emulators and VisualDSP++® devel-
opment environment. The same emulator hardware that
supports other Blackfin processors also fully emulates the
ADSP-BF542/4/8/9 processor.
EZ-KIT Lite® Evaluation Board
For evaluation of ADSP-BF542/4/8/9 processors, use the ADSP-
BF548 EZ-KIT Lite board available from Analog Devices. Order
part number ADDS-BF548-EZLITE. The board comes with on-
chip emulation capabilities and is equipped to enable software
development. Multiple daughter cards are available.
DESIGNING AN EMULATOR-COMPATIBLE
PROCESSOR BOARD (TARGET)
The Analog Devices family of emulators are tools that every sys-
tem developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG
Test Access Port (TAP) on each JTAG processor. The emulator
uses the TAP to access the internal features of the processor,
allowing the developer to load code, set breakpoints, observe
variables, observe memory, and examine registers. The proces-
sor must be halted to send data and commands, but once an
operation has been completed by the emulator, the processor
system is set running at full speed with no impact on system
timing.
To use these emulators, the target board must include a header
that connects the processor’s JTAG port to the emulator.
For details on target board design issues including mechanical
layout, single processor connections, multiprocessor scan
chains, signal buffering, signal termination, and emulator pod
logic, see Analog Devices JTAG Emulation Technical Reference
(EE-68) on the Analog Devices web site under
www.analog.com/ee-notes. This document is updated regularly
to keep pace with improvements to emulator support.
Rev. PrE
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Preliminary Technical Data
PIN DESCRIPTIONS
ADSP-BF542/4/8/9 processor pin multiplexing scheme is listed
in Table 10 and the pin definitions are listed in Table 11.
Table 10. Pin Multiplexing
Primary Pin
Function
First Peripheral
Function
Second Peripheral
Function
Third Peripheral
Function
Fourth Peripheral
Function
Interrupt Capability
(Number of Pins)
Port A
GPIO (16 pins)
SPORT2 (8 pins)
SPORT3 (8 pins)
TMR4 (1 pin)
TMR5 (1 pin)
TMR6 (1 pin)
TMR7 (1 pin)
TACI7 (1 shared pin)
TACLK7-0 (8 pins)
Interrupts (16 pins)
Port B
GPIO (15 pins)
TWI1 (2 pins)
TACI2-3 (2 pins)
Interrupts (15 pins)
HWAITA (1 pin)
UART2 or 3 CTL (2 pins)
UART2 (2 pins)
UART3 (2 pins)
SPI2 SEL (4 pins)
SPI2 (3 pins)
TMR0–2 (3 pins)
TMR3 (1 pin)
HWAITA (one pin)
Port C
GPIO (16 pins)
SPORT0 (8 pins)
SDH (6 pins)
MXVR MMCLK, MBCLK
(2 pins)
Interrupts (8 pins)1
Interrupts (8 pins)
Port D
GPIO (16 pins)
EPPI1 D0–15 (16 pins) Host D0–15 (16 pins) SPORT1 (8 pins)
EPPI2 D0–7 (8 pins)
EPPI0 D18– 23 (6 pins) Interrupts (8 pins)
Keypad
Interrupts (8 pins)
Interrupts (8 pins)
Interrupts (8 pins)
Row 0–3
Col 0–3 (8 pins)
Port E
GPIO (16 pins)
SPI0 (7 pins)
Keypad
TACI0 (1 pin)
Row 4–6
Col 4–7 (7 pins)
UART0 TX (1 pin)
Keypad R7 (1 pin)
UART0 RX (1 pin)
UART0 or 1 CTL (2 pins)
EPPI1 CLK,FS (3 pins)
5V-Tolerant inputs TWI0 (2 pins)
Port F
GPIO (16 pins)
EPPI0 D0–15 (16 pins)
Interrupts (8 pins)
Interrupts (8 pins)
Port G
GPIO (16 pins)
EPPI0 CLK,FS (3 pins) TMRCLK (1 pin)
DATA 16–17 (2 pins)
Interrupts (8 pins)
Interrupts (8 pins)
SPI1 SEL1–3 (3 pins)
SPI1 (4 pins)
Host CTL (3 pins)
EPPI2 CLK,FS (3 pins) CZM (1 pin)
MXVR MTXON (1 pin) TACI4-5 (2 pins)
CAN0 (2 pins)
CAN1 (2 pins)
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Preliminary Technical Data
ADSP-BF542/4/8/9
Table 10. Pin Multiplexing
Primary Pin
Function
First Peripheral
Function
Second Peripheral
Function
Third Peripheral
Function
Fourth Peripheral
Function
Interrupt Capability
(Number of Pins)
Port H
GPIO (14 pins)
UART1 (2 pins)
EPPI1–2_FS3 (2 pins) TACI1 (1 pin)
Interrupts (8 pins)
ATAPI_RST (1 pin)
HOST_ADDR (1 pin)
HOST_ACK (1 pin)
TMR8 (1 pin)
TMR9 (1 pin)
TMR10 (1 pin)
EPPI0_FS3 (1 pin)
Counter Up/Dir (1 pin)
Counter Down/Gate
(1 pin)
MXVR MRX, MTX,
MRXON (3 pins)
DMAR 0–1 (2 pins)
TACI8-10 (3 shared
pins)
TACLK8-10 (3 shared
pins)
AMC Addr 4-9 (6 pins)
Interrupts (6 pins)
Port I
GPIO (16 pins)
Async Addr10–25
(16 pins)
Interrupts (8 pins)
Interrupts (8 pins)
Port J
GPIO (14 pins)
Async CTL and MISC
Interrupts (8 pins)
Interrupts (6 pins)
1 A total of 32 interrupts at once are available from Ports C through J, configurable in byte-wide blocks.
ADSP-BF542/4/8/9 processor pin definitions are listed in
Table 11. To see the pin multiplexing scheme, see Table 10.
Table 11. Pin Descriptions
Pin Name
I/O1 Function (First/Second/Third/Fourth)
I/O GPIO/SPORT2 Transmit Frame Sync
Port A: GPIO/SPORT2–3/TMR4–7
PA0 / TFS2
PA1 / DT2SEC /TMR4
PA2 / DT2PRI
I/O GPIO/SPORT2 Transmit Data Secondary/Timer 4
I/O GPIO/SPORT2 Transmit Data Primary
PA3 / TSCLK2
I/O GPIO/SPORT2 Transmit Serial Clock
PA4 / RFS2
I/O GPIO/SPORT2 Receive Frame Sync
PA5 / DR2SEC/TMR5
PA6 / DR2PRI
I/O GPIO/SPORT2 Receive Data Secondary/Timer 5
I/O GPIO/SPORT2 Receive Data Primary
PA7 / RSCLK2/TACLK0
PA8 / TFS3/TACLK1
PA9 / DT3SEC /TMR6
PA10 / DT3PRI /TACLK2
PA11 / TSCLK3/TACLK3
PA12 / RFS3/TACLK4
PA13 / DR3SEC/TMR7/TACLK5
PA14 / DR3PRI/TACLK6
PA15 / RSCLK3/TACLK7 and TACI7
I/O GPIO/SPORT2 Receive Serial Clock/Alternate Input Clock 0
I/O GPIO/SPORT3 Transmit Frame Sync/Alternate Input Clock 1
I/O GPIO/SPORT3 Transmit Data Secondary/Timer 6
I/O GPIO/SPORT3 Transmit Data Primary/Alternate Input Clock 2
I/O GPIO/SPORT3 Transmit Serial Clock/Alternate Input Clock 3
I/O GPIO/SPORT3 Receive Frame Sync/Alternate Input Clock 4
I/O GPIO/SPORT3 Receive Data Secondary/Timer 7/Alternate Input Clock 5
I/O GPIO/SPORT3 Receive Data Primary/Alternate Input Clock 6
I/O GPIO/SPORT3 Receive Serial Clock/Alt Input Clock 7 and Alt Capture Input 7
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Preliminary Technical Data
Table 11. Pin Descriptions (Continued)
Pin Name
I/O1 Function (First/Second/Third/Fourth)
Port B: GPIO/TWI1/UART2–3/SPI2/TMR0–3
PB0/SCL1
I/O GPIO/TWI1 Serial Clock
PB1/SDA1
I/O GPIO/TWI1 Serial Data
PB2/UART3RTS
I/O GPIO/UART3 Request To Send
PB3/UART3CTS
I/O GPIO/UART3 Clear To Send
PB4/UART2TX
I/O GPIO/UART2 Transmit
PB5/UART2RX/TACI2
PB6/UART3TX
I/O GPIO/UART2 Receive/Alternate Capture Input 2
I/O GPIO/UART3 Transmit
PB7/UART3RX/TACI3
PB8/SPI2SS/TMR0
PB9/SPI2SEL1/TMR1
PB10/SPI2SEL2/TMR2
PB11/SPI2SEL3/TMR3/ HWAITA3
PB12/SPI2SCK
I/O GPIO/UART3 Receive/Alternate Capture Input 3
I/O GPIO/SPI2 Slave Select Input/Timer 0
I/O GPIO/SPI2 Slave Select Enable 1/Timer 1
I/O GPIO/SPI2 Slave Select Enable 2/Timer 2
I/O GPIO/SPI2 Slave Select Enable 3/Timer 3/Alternate Boot Host Wait
I/O GPIO/SPI2 Clock
PB13/SPI2MOSI
PB14/SPIMISO
I/O GPIO/SPI2 Master Out Slave In
I/O GPIO/SPI2 Master In Slave Out
Port C: GPIO/SPORT0/SD Controller/MXVR (MOST)
PC0/TFS0
I/O GPIO/SPORT0 Transmit Frame Sync
I/O GPIO/SPORT0 Transmit Data Secondary/MXVR Master Clock
I/O GPIO/SPORT0 Transmit Data Primary
I/O GPIO/SPORT0 Transmit Serial Clock
I/O GPIO/SPORT0 Receive Frame Sync
I/O GPIO/SPORT0 Receive Data Secondary/MXVR Bit Clock
I/O GPIO/SPORT0 Receive Data Primary
I/O GPIO/SPORT0 Receive Serial Clock
I/O GPIO/SD Data Bus
PC1/DT0SEC /MMCLK
PC2/DT0PRI
PC3/TSCLK0
PC4/RFS0
PC5/DR0SEC/MBCLK
PC6/DR0PRI
PC7/RSCLK0
PC8/SD_D0
PC9/SD_D1
I/O GPIO/SD Data Bus
PC10/SD_D2
I/O GPIO/SD Data Bus
PC11/SD_D3
I/O GPIO/SD Data Bus
PC12/SD_CLK
I/O GPIO/SD Clock Output
PC13/SD_CMD
I/O GPIO/SD Command
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Preliminary Technical Data
ADSP-BF542/4/8/9
Table 11. Pin Descriptions (Continued)
Pin Name
I/O1 Function (First/Second/Third/Fourth)
Port D: GPIO/EPPI0–2/SPORT 1/Keypad/Host DMA
PD0/PPI1_D0/HOST_D8/ TFS1/PPI0_D18
PD1/PPI1_D1/HOST_D9/ DT1SEC /PPI0_D19
PD2/PPI1_D2/HOST_D10/ DT1PRI /PPI0_D20
PD3/PPI1_D3/HOST_D11/ TSCLK1/PPI0_D21
PD4/PPI1_D4/HOST_D12/RFS1/PPI0_D22
PD5/PPI1_D5/HOST_D13/DR1SEC/PPI0_D23
PD6/PPI1_D6/HOST_D14/DR1PRI
PD7/PPI1_D7/HOST_D15/RSCLK1
PD8/PPI1_D8/HOST_D0/ PPI2_D0/KEY_ROW0
PD9/PPI1_D9/HOST_D1/PPI2_D1/KEY_ROW1
PD10/PPI1_D10/HOST_D2/PPI2_D2/KEY_ROW2
PD11/PPI1_D11/HOST_D3/PPI2_D3/KEY_ROW3
PD12/PPI1_D12/HOST_D4/PPI2_D4/KEY_COL0
PD13/PPI1_D13/HOST_D5/PPI2_D5/KEY_COL1
PD14/PPI1_D14/HOST_D6/PPI2_D6/KEY_COL2
PD15/PPI1_D15/HOST_D7/PPI2_D7/KEY_COL3
Port E: GPIO/SPI0/UART0-1/EPPI1/TWI0/Keypad
PE0/SPI0SCK/KEY_COL7
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Transmit Frame Sync/EPPI0 Data
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Transmit Data Secondary/EPPI0 Data
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Transmit Data Primary/EPPI0 Data
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Transmit Serial Clock/EPPI0 Data
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Receive Frame Sync/EPPI0 Data
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Receive Data Secondary/EPPI0 Data
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Receive Data Primary
I/O GPIO/EPPI1 Data /Host DMA/SPORT 1 Receive Serial Clock
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Row Input
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Row Input
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Row Input
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Row Input
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Column Output
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Column Output
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Column Output
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Column Output
I/O GPIO/SPI0 Clock/Keypad Column Output
I/O GPIO/SPI0 Master In Slave Out/Keypad Row Input
I/O GPIO/SPI0 Master Out Slave In/Keypad Column Output
I/O GPIO/SPI0 Slave Select Input/Keypad Row Input
I/O GPIO/SPI0 Slave Select Enable 1/Keypad Column Output
I/O GPIO/SPI0 Slave Select Enable 2/Keypad Row Input
I/O GPIO/SPI0 Slave Select Enable 3/Keypad Column Output
I/O GPIO/UART0 Transmit/Keypad Row Input
I/O GPIO/UART0 Receive/Alternate Capture Input 0
I/O GPIO/UART1 Request To Send
PE1/SPI0MISO/KEY_ROW6
PE2/SPI0MOSI/KEY_COL6
PE3/SPI0SS/KEY_ROW5
PE4/SPI0SEL1/KEY_COL5
PE5/SPI0SEL2/KEY_ROW4
PE6/SPI0SEL3/KEY_COL4
PE7/UART0TX/KEY_ROW7
PE8/UART0RX/TACI0
PE9/UART1RTS
PE10/UART1CTS
I/O GPIO/UART1 Clear To Send
PE11/PPI1_CLK
I/O GPIO / EPPI1Clock
PE12/PPI1_FS1
I/O GPIO/EPPI1 Frame Sync 1
PE13/PPI1_FS2
I/O GPIO/EPPI1 Frame Sync 2
PE14/SCL0
I/O GPIO/TWI0 Serial Clock
PE15/SDA0
I/O GPIO/TWI0 Serial Data
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ADSP-BF542/4/8/9
Preliminary Technical Data
Table 11. Pin Descriptions (Continued)
Pin Name
I/O1 Function (First/Second/Third/Fourth)
Port F: GPIO / EPPI0 / Alternate ATAPI Data
PF0/PPI0_D0/ATAPI_D0A2
PF1/PPI0_D1/ATAPI_D1A2
PF2/PPI0_D2/ATAPI_D2A2
PF3/PPI0_D3/ATAPI_D3A2
PF4/PPI0_D4/ATAPI_D4A2
PF5/PPI0_D5/ATAPI_D5A2
PF6/PPI0_D6/ATAPI_D6A2
PF7/PPI0_D7/ATAPI_D7A2
PF8/PPI0_D8/ATAPI_D8A2
PF9/PPI0_D9/ATAPI_D9A2
PF10/PPI0_D10/ATAPI_D10A2
PF11/PPI0_D11/ATAPI_D11A2
PF12/PPI0_D12/ATAPI_D12A2
PF13/PPI0_D13/ATAPI_D13A2
PF14/PPI0_D14/ATAPI_D14A2
PF15/PPI0_D15/ATAPI_D15A2
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
I/O GPIO/EPPI0 Data/Alternate ATAPI Data
Port G: GPIO / EPPI0 / SPI1 / EPPI2 / Up-Down Counter / CAN0–1 / Host DMA/ MXVR (MOST)
PG0/PPI0_CLK/TMRCLK
I/O GPIO/EPPI0 Clock/External Timer Reference
PG1/PPI0_FS1
I/O GPIO/EPPI0 Frame Sync 1
PG2/PPI0_FS2/ATAPI_A0A2
PG3/PPI0_D16/ATAPI_A1A2
PG4/PPI0_D17/ATAPI_A2A2
PG5/SPI1SEL1/HOST_CE/PPI2_FS2/ CZM
I/O GPIO/EPPI0 Frame Sync 2/Alternate ATAPI Address
I/O GPIO/EPPI0 Data/Alternate ATAPI Address
I/O GPIO/EPPI0 Data/Alternate ATAPI Address
I/O GPIO/SPI1 Slave Select/Host DMA Chip Enable/EPPI2 Frame Sync 2/Counter Zero
Marker
PG6/SPI1SEL2/HOST_RD/ PPI2_FS1
PG7/SPI1SEL3/HOST_WR/ PPI2_CLK
PG8/SPI1SCK
I/O GPIO/SPI1 Slave Select/ Host DMA Read/EPPI2 Frame Sync 1
I/O GPIO/SPI1 Slave Select/Host DMA Write/EPPI2 Clock
I/O GPIO/SPI1 Clock
PG9/SPI1MISO
I/O GPIO/SPI1 Master In Slave Out
PG10/SPI1MOSI
I/O GPIO/SPI1 Master Out Slave In
PG11/SPI1SS/MTXON
PG12/CAN0TX
I/O GPIO/SPI1 Slave Select Input/MXVR Transmit Phy On
I/O GPIO/CAN0 Transmit
PG13/CAN0RX/TACI4
PG14/CAN1TX
I/O GPIO/CAN0 Receive/Alternate Capture Input 4
I/O GPIO/CAN1 Transmit
PG15/CAN1RX/TACI5
I/O GPIO/CAN1 Receive/Alternate Capture Input 5
Rev. PrE
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Table 11. Pin Descriptions (Continued)
Pin Name
I/O1 Function (First/Second/Third/Fourth)
Port H: GPIO/AMC / EXTDMA / UART1 / EPPI0–2 / ATAPI Interface / Up-Down Counter /TMR8-10/ Host DMA / MXVR (MOST)
PH0/UART1TX/PPI1_FS3
I/O GPIO/UART1 Transmit/EPPI1 Frame Sync 3
PH1/UART1RX/PPI2_FS3/TACI1
I/O GPIO/UART 1 Receive/ EPPI2 Frame Sync 3/Alternate Capture Input 1
I/O GPIO/ATAPI Interface Hard Reset Signal/Timer 8/EPPI0 Frame Sync 3
I/O GPIO/HOST Address/Timer 9/Count Down and Gate
I/O GPIO/HOST Acknowledge/Timer 10/Count Up and Direction
I/O GPIO/MXVR Transmit Data/Ext. DMA Request/Alt Capt. In. 8 /Alt In. Clk 8
I/O GPIO/MXVR Receive Data/Ext. DMA Request/Alt Capt. In. 9 /Alt In. Clk 9
I/O GPIO/MXVR Receive Phy On /Alt Capt. In. 10 /Alt In. Clk 10/Boot Host Wait
I/O GPIO/Address Bus for Async Access
PH2/ATAPI_RESET /TMR8/PPI0_FS3
PH3/HOST_ADDR/TMR9/CDG
PH4/HOST_ACK/TMR10/CUD
PH5/MTX/DMAR0/TACI8 and TACLK8
PH6/MRX/DMAR1/TACI9 and TACLK9
PH7/MRXON/TACI10 and TACLK10/HWAIT3
PH8/A4
PH9/A5
I/O GPIO/Address Bus for Async Access
PH10/A6
PH11/A7
PH12/A8
PH13/A9
Port I: GPIO / AMC
PI0/A10
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access
I/O GPIO/Address Bus for Async Access/ NOR clock
PI1/A11
PI2/A12
PI3/A13
PI4/A14
PI5/A15
PI6/A16
PI7/A17
PI8/A18
PI9/A19
PI10/A20
PI11/A21
PI12/A22
PI13/A23
PI14/A24
PI15/A25/NR_CLK
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
Table 11. Pin Descriptions (Continued)
Pin Name
I/O1 Function (First/Second/Third/Fourth)
Port J: GPIO / AMC / ATAPI Controller
PJ0 / ARDY/WAIT
PJ1 / ND_CE
I/O GPIO/Async Ready/NOR Wait
I/O GPIO/NAND Chip Enable
PJ2 / ND_RB
I/O GPIO/Ready Busy Signal
PJ3 / ATAPI_DIOR
PJ4 / ATAPI_DIOW
PJ5 / ATAPI_CS0
PJ6 / ATAPI_CS1
PJ7 / ATAPI_DMACK
PJ8 / ATAPI_DMARQ
PJ9 / ATAPI_INTRQ
PJ10 / ATAPI_IORDY
PJ11 / BR
I/O GPIO/ATAPI Read
I/O GPIO/ATAPI Write
I/O GPIO/ATAPI Chip Select Signal Command Block
I/O GPIO/ATAPI Chip Select Signal
I/O GPIO/ATAPI DMA Acknowledge Signal
I/O GPIO/ATAPI DMA Request Signal
I/O GPIO/Interrupt Request from the Device
I/O GPIO/ATAPI Ready Handshake Signal
I/O GPIO/Bus Request
PJ12 / BG
I/O GPIO/Bus Grant
PJ13 / BGH
I/O GPIO/Bus Grant Hang
Memory Interface
DA0–12
O
O
DDR Address Bus
DBA0–1
DDR Bank Active Strobe
DQ0–15
I/O DDR Data Bus
DQS0–1
I/O DDR Data Strobe
DQM0–1
O
O
O
O
O
O
O
O
I
DDR Data Mask for Reads and Writes
DDR Output Clock
DCLK1–2
DCLK1–2
DDR Complementary Output Clock
DDR Chip Selects
DCS0–1
DCKE
DDR Clock Enable
DRAS
DDR Row Address Strobe
DDR Column Address Strobe
DDR Write Enable
DCAS
DWE
DDR_VREF
DDR Voltage Reference
DDR_VSSR
I
DDR Voltage Reference Shield (connect to GND)
Asynchronous Memory Interface
A1-3
O
Address Bus for Async and ATAPI Addresses
D0-15/ND_D0-15/ATAPI_D0-15
AMS0–3
I/O Data Bus for Async, NAND and ATAPI Accesses
O
O
O
O
O
O
Bank Selects
ABE0 /ND_CLE
ABE1/ND_ALE
AOE/NR_ADV
ARE
Byte Enables:Data Masks for Asynchronous Access/NAND Clock Enable
Byte Enables:Data Masks for Asynchronous Access/NAND Address Latch Enable
Output Enable/NOR Address Data Valid
Read Enable/NOR Output Enable
AWE
Write Enable
ATAPI Controller Pins
ATAPI_PDIAG
I
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Table 11. Pin Descriptions (Continued)
Pin Name
High Speed USB OTG Pins
USB_DP
I/O1 Function (First/Second/Third/Fourth)
I/O USB D+ pin
I/O USB D- pin
USB_DM
USB_XI
C
C
I
Clock XTAL input 1
Clock XTAL input 2
USB ID pin
USB_XO
USB_ID
USB_VBUS
USB_VREF
USB_RSET
MXVR (MOST) Interface
MFS
I/O USB VBUS pin
O
O
USB voltage reference source (Test purposes only)
USB resistance set (Test purposes only)
O
A
A
C
C
MXVR Frame Sync
MLF_P
MXVR Loop Filter Plus
MXVR Loop Filter Minus
MXVR Crystal Input
MXVR Crystal Output
MLF_M
MXI
MXO
Mode Control Pins
BMODE0–3
JTAG Port Pins
TDI
I
Boot Mode Strap 0–3
I
JTAG Serial Data In
JTAG Serial Data Out
JTAG Reset
TDO
TRST4
O
I
TMS
I
JTAG Mode Select
JTAG Clock
TCK
I
EMU
O
Emulation Output
Voltage Regulator
VROUT0, VROUT15
Real Time Clock
RTXO
O
External FET/BJT Drivers
C
C
RTC Crystal Output
RTC Crystal Input
RTXI
Clock (PLL) Pins
CLKIN
C
O
C
O
O
I
Clock/Crystal Input
Clock Output
CLKOUT
XTAL
Crystal Output
CLKBUF
Buffered Oscillator Output
External Wakeup Output
Reset
EXT_WAKE
RESET
NMI6
I
Non-maskable Interrupt
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
Table 11. Pin Descriptions (Continued)
Pin Name
Supplies
VDDINT
I/O1 Function (First/Second/Third/Fourth)
P
P
P
P
P
G
P
G
P
G
P
G
Internal Power Supply
External Power Supply
External DDR Power Supply
External USB Power Supply
RTC Clock Supply
VDDEXT
VDDDDR
VDDUSB
VDDRTC
GND
Ground
VDDMC
MXVR Crystal Power Supply
MXVR Crystal Ground
MXVR I/O Power Supply
MXVR I/O Ground
GNDMC
VDDMX
GNDMX
VDDMP
MXVR PLL Power Supply
GNDMP
MXVR PLL Ground
1 I = Input, O = Output, P =Power, G = Ground, C = Crystal, A = Analog.
2 By default the ATAPI bus shares the data pins D0-15 and the address pins A0-2 with the asynchronous memory interface and the NAND controller. When PORTF_MUX[1:0]
= b#01, then the ATAPI data bus is available through Port F and the address line can be found at Port G.
3 The Boot Host Wait (HWAIT) signal on PH7 is a GPIO output that is driven and toggled by the boot kernel at boot time. An external pulling resistor is required for proper
operation. A pull-up resistor instructs the HWAIT signal to behave active high (low when ready for data). A pull-down resistor instructs the HWAIT signal to behave active
low (high when ready for data) After boot it can be used for other purposes. If the PH7 pin is required for other purposes (for example, MXVR operation) the Alternate Boot
Host Wait (HWAITA) on PB11 can be used instead. This is enabled by programming a specific bit in OTP memory page 0x15.
4 This pin should be pulled LOW if the JTAG port will not be used.
5 Always connect VROUT0 and VROUT1 together to reduce signal impedance.
6 This pin should always be pulled HIGH when not used.
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April 2007
Preliminary Technical Data
SPECIFICATIONS
ADSP-BF542/4/8/9
Note that component specifications are subject to change
without notice.
OPERATING CONDITIONS
Parameter1
Minimum
Nominal
TBD2
TBD2
2.5 or 3.3
3.3
Maximum Unit
VDDINT
Internal Supply Voltage
0.9
1.0
TBD2
TBD2
3.6
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Internal Supply Voltage for Automotive Grade
External Supply Voltage3
VDDEXT
2.25
2.7
External Supply Voltage for Automotive Grade
USB External Supply Voltage
3.6
VDDUSB
VDDMC
VDDMX
VDDMP
VDDRTC
2.7
3.3
3.6
MXVR Crystal Supply Voltage
2.7
3.3
3.6
MXVR I/O Supply Voltage
3.0
3.3
3.6
TBD2
MXVR PLL Supply Voltage
1.0
TBD2
2.5 or 3.3
3.3
Real Time Clock Power Supply Voltage
Real Time Clock Power Supply Voltage for Automotive Grade
DDR Memory Supply Voltage
2.25
2.7
3.6
3.6
VDDDDR
2.3
2.5
2.7
DDR Memory Supply Voltage for Mobile DDR
High Level Input Voltage3,4, @ VDDEXT =maximum
High Level Input Voltage5, @ VDDEXT =maximum
High Level Input Voltage6
High Level Input Voltage for Mobile DDR6
High Level Input Voltage7, @ VDDEXT =maximum
Low Level Input Voltage3, 8, @ VDDEXT =minimum
Low Level Input Voltage9, @ VDDEXT =minimum
Low Level Input Voltage6
1.7
1.8
1.9
VIH
2.0
3.6
VIHCLKIN
VIHDDR
2.2
3.6
VREFDDR + 0.15
0.8 x VDDDDR
2.0
VDDDDR + 0.3 V
VDDDDR + 0.3 V
VIH5V
VIL
5.5
0.6
0.8
V
V
V
–0.3
–0.3
–0.3
-0.3
VIL5V
VILDDR
VREFDDR - 0.15 V
Low Level Input Voltage for Mobile DDR6
0.2 x VDDDDR
V
VREFDDR
TJ
DDR VREF Pin Input Voltage
0.49 x VDDDDR 0.50 x VDDDDR 0.51 x VDDDDR
V
Junction Temperature, 400-Ball Chip Scale Ball Grid Array (mini-BGA)
@TAMBIENT = –40ºC to +85ºC
–40
+105
ºC
TJ
Junction Temperature, 400-Ball Chip Scale Ball Grid Array (mini-BGA)
@TAMBIENT = 0ºC to +70ºC
0
+90
ºC
1 Specifications subject to change without notice.
2 It is recommended that preliminary designs be designed with an adjustable voltage regulator which supports 0.8 V to 1.4 V nominal.
3 The ADSP-BF542/4/8/9 processor is 3.3 V tolerant (always accepts up to 3.6 V maximum VIH), but voltage compliance (on outputs, VOH) depends on the input VDDEXT, because
VOH (maximum) approximately equals VDDEXT (maximum). This 3.3 V tolerance applies to bi-directional pins (D15–0, PA15–0, PB14–0, PC15–0, PD15–0, PE15–0, PF15–0,
PG15–0, PH13–0, PI15–0, PJ14–0) and input only pins (ATAPI_PDIAG, USB_ID, TCK, TDI, TMS, TRST, CLKIN, RESET, NMI, and BMODE3–0).
4 Parameter value applies to all input and bi-directional pins, except CLKIN, PB0, PB1, PE14, PE15, PG15–11, PH6, PH7, and the pins listed in table note 6 of the Operating
Conditions table.
5 Parameter value applies to CLKIN pin only.
6 Parameter value applies to DA0–12, DBA0–1, DQ0–15, DQS0–1, DQM0–1, DCLK1–2, DCLK1–2, DCS0–1, DCKE, DRAS, DCAS, and DWE pins only.
7 Certain ADSP-BF542/4/8/9 processor pins are 5.0 V tolerant (accept up to 5.5 V maximum VIH when power is applied to VDDEXT pins). Voltage compliance on outputs (VOH
depends on the input VDDEXT, because VOH (maximum) approximately equals VDDEXT (maximum). The 5.0 V tolerance feature applies to PB0, PB1, PE14, PE15, PG15–11,
PH6, and PH7 pins only. The 5.0 V tolerance exists only when power is applied to the VDDEXT pins. The PB0, PB1, PE14, and PE15 pins are open drain (regardless of pin
)
functionality) and therefore require a pullup resistor. Consult the I2C specification version 2.1 for the proper resistor value and other open drain pin electrical parameters.
8 Parameter value applies to all input and bi-directional pins, except PB0, PB1, PE14, PE15, PG15–11, PH6, and PH7.
9 Parameter value applies to the following pins only: PB0, PB1, PE14, PE15, PG15–11, PH6, and PH7.
Rev. PrE
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
ELECTRICAL CHARACTERISTICS
Parameter
Test Conditions
Min
2.4
Typical
Max
Unit
V
VOH
High Level Output Voltage1
High Level Output Voltage2
High Level Output Voltage2
Low Level Output Voltage1
Low Level Output Voltage2
Low Level Output Voltage2
High Level Input Current3
High Level Input Current JTAG4
Low Level Input Current3
Low Level Input Current JTAG4
Three-State Leakage Current6
Three-State Leakage Current6
Input Capacitance7
TBD
@ VDDEXT = Minimum, IOH = –0.5 mA
@ VDDDDR = 2.3V, IOH = -8.1 mA
@ VDDDDR = 1.7V, IOH = -8.1 mA
@ VDDEXT = Minimum, IOL = 2.0 mA
@ VDDDDR = 2.3V, IOH = 8.1 mA
@ VDDDDR = 1.7V, IOH = 8.1 mA
@ VDDEXT = Maximum, VIN = VIH Maximum
@ VDDEXT = Maximum, VIN = VIH Maximum
@ VDDEXT = Maximum, VIN = 0 V
@ VDDEXT = Maximum, VIN = 0 V
@ VDDEXT = Maximum, VIN = VIH Maximum
@ VDDEXT = Maximum, VIN = 0 V
fIN = TBD MHz, TAMBIENT = TBD°C, VIN = TBD V
TBD
VOHDDR
1.74
TBD
V
V
VOL
0.4
0.56
TBD
10.0
50.0
10.0
TBD
10.0
10.0
87
V
VOLDDR
V
V
IIH
μA
μA
μA
μA
μA
μA
pF
μA
mA
mA
mA
μA
IIHP
5
IIL
5
IILP
IOZH
5
IOZL
CIN
47
IDDHIBERNATE
IDDDEEPSLEEP
IDDSLEEP
IDDTYP
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
IDDRTC
TBD
TBD
1 Applies to output and bidirectional pins, except the pins listed in table note 6 of the Operating Conditions table.
2 Applies to output and bidirectional pins listed in table note 6 of the Operating Conditions table.
3 Applies to input pins except JTAG inputs.
4 Applies to JTAG input pins (TCK, TDI, TMS, TRST).
5 Absolute value.
6 Applies to three-statable pins.
7 Guaranteed, but not tested.
ESD SENSITIVITY
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge
without detection. Although this product features
patented or proprietary circuitry, damage may occur
on devices subjected to high energy ESD. Therefore,
proper ESD precautions should be take to avoid
performance degradation or loss of functionality.
Rev. PrE
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
ABSOLUTE MAXIMUM RATINGS
Internal (Core) Supply Voltage1 (VDDINT) –0.3 V to +1.4 V
External (I/O) Supply Voltage1 (VDDEXT) –0.3 V to +3.8 V
Input Voltage1,2
Output Voltage Swing1
Load Capacitance1
–0.5 V to +3.6 V
–0.5 V to VDDEXT +0.5 V
200 pF
Storage Temperature Range1
Junction Temperature Underbias1
–65ºC to +150ºC
+125ºC
1 Stresses greater than those listed above may cause permanent damage to the
device. These are stress ratings only. Functional operation of the device at these
or any other conditions greater than those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2 Applies to all bidirectional and input only pins except PB0, PB1, PE14, PE15,
PG15–11, PH6, and PH7. Absolute maximum input voltage range on pins PB0,
PB1, PE14, PE15, PG15–11, PH6, and PH7 is –0.5 V to +5.5 V.
Table 12. Maximum Duty Cycle for Input1 Transient Voltage
VIN Max (V)
3.63
VIN Min (V)
–0.33
Maximum Duty Cycle
100%
48%
30%
20%
10%
8%
3.80
–0.50
3.90
–0.60
4.00
–0.70
4.10
–0.80
4.20
–0.90
4.30
–1.00
5%
1 Applies to all signal pins with the exception of CLKIN.
PACKAGE INFORMATION
The information presented in Figure 8 and Table 13 provides
information about how to read the package brand and relate it
to specific product features. For a complete listing of product
offerings, see the Ordering Guide on Page 67.
Table 13. Package Information
Brand Key
Description
t
Temperature Range
Package Type
pp
Z
RoHS Compliant part
See Ordering Guide
Assembly Lot Code
Silicon Revision
Date Code
cc
a
ADSP-BF54x
vvvvvv.x
n.n
tppZ-cc
vvvvvv.x n.n
yyww
yyww country_of_origin
B
Figure 8. Product Information on Package
Rev. PrE
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
TIMING SPECIFICATIONS
Table 14, Table 15, Table 16, and Table 17 describe the timing
requirements for the ADSP-BF542/4/8/9 processor clocks. Take
care in selecting MSEL, SSEL, and CSEL ratios so as not to
exceed the maximum core clock and system clock. Table 18
describes phase-locked loop operating conditions. Table 19 and
Figure 9 describe Clock Input and Reset Timing. Table 20
describes Clock Out Timing.
Clock Signals
Table 14. System Clock Requirements
Parameter
fSCLK
Condition
Minimum
Maximum
133
Unit
MHz
MHz
MHz
MHz
ns
VDDEXT = 3.3 V, VDDINT ≥ TBD
VDDEXT = 3.3 V, VDDINT < TBD
VDDEXT = 2.5 V, VDDINT ≥ TBD
VDDEXT = 2.5 V, VDDINT < TBD
CLKOUT Width High
CLKOUT Width Low
fSCLK
100
fSCLK
133
fSCLK
100
tSCLKH
tSCLKL
2.5
2.5
ns
Table 15. Core Clock Requirements—600 MHz Speed Grade1
Parameter
Minimum
Maximum
600
Unit
MHz
MHz
MHz
MHz
MHz
fCCLK
fCCLK
fCCLK
fCCLK
fCCLK
Core Clock Frequency (VDDINT =TBD V minimum)
Core Clock Frequency (VDDINT =1.045 V minimum)
Core Clock Frequency (VDDINT =0.95 V minimum)
Core Clock Frequency (VDDINT =0.85 V minimum)
Core Clock Frequency (VDDINT =0.8 V )
TBD
TBD
TBD
TBD
1 The speed grade of a given part may be seen on the Ordering Guide on Page 67. It stands for the maximum allowed CCLK frequency at VDDINT = minimum and the maximum
allowed VCO frequency at any supply voltage.
Table 16. Core Clock Requirements—533 MHz Speed Grade1
Parameter
fCCLK
Minimum
Maximum
533
Unit
MHz
MHz
MHz
MHz
MHz
Core Clock Frequency (VDDINT =TBD V minimum)
Core Clock Frequency (VDDINT =1.045 V minimum)
Core Clock Frequency (VDDINT =0.95 V minimum)
Core Clock Frequency (VDDINT =0.85 V minimum)
Core Clock Frequency (VDDINT =0.8 V )
fCCLK
TBD
fCCLK
TBD
fCCLK
TBD
fCCLK
TBD
1 The speed grade of a given part may be seen on the Ordering Guide on Page 67. It stands for the maximum allowed CCLK frequency at VDDINT = minimum and the maximum
allowed VCO frequency at any supply voltage.
Table 17. Core Clock Requirements—400 MHz Speed Grade1
Parameter
fCCLK
Minimum
Maximum
400
Unit
MHz
MHz
MHz
MHz
MHz
Core Clock Frequency (VDDINT =TBD V minimum)
Core Clock Frequency (VDDINT =1.045 V minimum)
Core Clock Frequency (VDDINT = 0.95 V minimum)
Core Clock Frequency (VDDINT =0.85 V minimum)
Core Clock Frequency (VDDINT =0.8 V )
fCCLK
TBD
fCCLK
TBD
fCCLK
TBD
fCCLK
TBD
1 The speed grade of a given part may be seen on the Ordering Guide on Page 67. It stands for the maximum allowed CCLK frequency at VDDINT = minimum and the maximum
allowed VCO frequency at any supply voltage.
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Table 18. Phase-Locked Loop Operating Conditions
Parameter
Minimum
Maximum
Speed Grade1 MHz
Unit
fVCO
Voltage Controlled Oscillator (VCO) Frequency
50
1 The speed grade of a given part may be seen on the “Ordering Guide” on page 67. It stands for the Maximum allowed CCLK frequency at VDDINT = minimum and the maximum
allowed VCO frequency at any supply voltage.
Table 19. Clock Input and Reset Timing
Parameter
Minimum
Maximum
Unit
Timing Requirements
tCKIN
CLKIN Period1,2,3,4
CLKIN Low Pulse2
CLKIN High Pulse2
20.0
8.0
100.0
ns
ns
ns
ns
ns
tCKINL
tCKINH
tBUFDLAY
tWRST
8.0
CLKIN to CLKBUF Delay
RESET Asserted Pulsewidth Low5
10
11 tCKIN
1 Combinations of the CLKIN frequency and the PLL clock multiplier must not exceed the allowed fVCO, fCCLK, and fSCLK settings discussed in the previous Clock tables.
2 Applies to PLL bypass mode and PLL nonbypass mode.
3 CLKIN frequency and duty cycle must not change on the fly.
4 If the DF bit in the PLL_CTL register is set, then the maximum tCKIN period is 50 ns.
5 Applies after power-up sequence is complete. At power-up, the processor’s internal phase locked loop requires no more than 2000 CLKIN cycles, while RESET is asserted,
assuming stable power supplies and CLKIN (not including startup time of external clock oscillator).
tCKIN
CLKIN
tCKINL
tCKINH
tBUFDLAY
tBUFDLAY
CLKBUF
tWRST
RESET
Figure 9. Clock and Reset Timing
Table 20. Clock Out Timing
Parameter
Min
Max
Unit
Switching Characteristics
tSCLK
CLKOUT Period1
TBD
TBD
TBD
ns
ns
ns
tSCLKH
CLKOUT Width High
tSCLKL
CLKOUT Width Low
1 The tSCLK value is the inverse of the fSCLK specification. Package type and reduced supply voltages affect the best-case value of 7.5 ns listed here.
tSCLK
tSCLKH
CLKOUT
tSCLKL
Figure 10. SDRAM Interface Timing
Rev. PrE
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
Asynchronous Memory Read Cycle Timing
Table 21 and Table 22 on Page 37 and Figure 11 and Figure 12
on Page 37 describe asynchronous memory read cycle opera-
tions for synchronous and for asynchronous ARDY.
Table 21. Asynchronous Memory Read Cycle Timing with Synchronous ARDY
Parameter
Min
Max
Unit
Timing Requirements
tSDAT
tHDAT
tSARDY
tHARDY
tDO
DATA15–0 Setup Before CLKOUT
DATA15–0 Hold After CLKOUT
2.1
0.8
4.0
0.0
ns
ns
ns
ns
ns
ns
ARDY Setup Before the Falling Edge of CLKOUT
ARDY Hold After the Falling Edge of CLKOUT
Output Delay After CLKOUT1
6.0
tHO
Output Hold After CLKOUT1
0.8
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, AOE, ARE.
HOLD
1 CYCLE
SETUP
2 CYCLES
PROGRAMMED READ ACCESS
ACCESS EXTENDED
3 CYCLES
4 CYCLES
CLKOUT
tDO
tHO
AMSx
ABE1–0
BE, ADDRESS
ADDR19–1
AOE
tDO
tHO
ARE
tHARDY
tSARDY
tHARDY
ARDY
tSARDY
tSDAT
tHDAT
DATA15–0
READ
Figure 11. Asynchronous Memory Read Cycle Timing with Synchronous ARDY
Rev. PrE
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Table 22. Asynchronous Memory Read Cycle Timing with Asynchronous ARDY
Parameter
Min
Max
Unit
Timing Requirements
tSDAT
tHDAT
tDANR
tHAA
DATA15–0 Setup Before CLKOUT
DATA15–0 Hold After CLKOUT
ARDY Negated Delay from AMSx Asserted1
ARDY Asserted Hold After ARE Negated
Output Delay After CLKOUT2
2.1
0.8
ns
ns
(S+RA–2)*tSCLK ns
ns
0.0
0.8
tDO
6.0
ns
ns
tHO
Output Hold After CLKOUT2
1 S = number of programmed setup cycles, RA = number of programmed read access cycles.
2 Output pins include AMS3–0, ABE1–0, ADDR19–1, AOE, ARE.
HOLD
1 CYCLE
SETUP
2 CYCLES
PROGRAMMED READ ACCESS
4 CYCLES
ACCESS EXTENDED
CLKOUT
tDO
tHO
AMSx
ABE1–0
BE, ADDRESS
ADDR19–1
AOE
tDO
tHO
ARE
tHAA
tDANR
ARDY
tSDAT
tHDAT
DATA15–0
READ
Figure 12. Asynchronous Memory Read Cycle Timing with Asynchronous ARDY
Rev. PrE
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Page 37 of 68
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
Asynchronous Memory Write Cycle Timing
Table 23 and Table 24 on Page 39 and Figure 13 and Figure 14
on Page 39 describe asynchronous memory write cycle opera-
tions for synchronous and for asynchronous ARDY.
Table 23. Asynchronous Memory Write Cycle Timing with Synchronous ARDY
Parameter
Min
Max
Unit
Timing Requirements
tSARDY
tHARDY
Switching Characteristics
ARDY Setup Before the Falling Edge of CLKOUT
4.0
0.0
ns
ns
ARDY Hold After the Falling Edge of CLKOUT
tDDAT
tENDAT
tDO
DATA15–0 Disable After CLKOUT
6.0
6.0
ns
ns
ns
ns
DATA15–0 Enable After CLKOUT
Output Delay After CLKOUT1
Output Hold After CLKOUT1
1.0
0.8
tHO
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.
ACCESS
EXTENDED
1 CYCLE
SETUP
2 CYCLES
HOLD
1 CYCLE
PROGRAMMED WRITE
ACCESS 2 CYCLES
CLKOUT
tDO
tHO
AMSx
ABE1–0
BE, ADDRESS
ADDR19–1
tDO
tHO
AWE
tSARDY
ARDY
tSARDY
tHARDY
tHARDY
tDDAT
tENDAT
DATA15–0
WRITE DATA
Figure 13. Asynchronous Memory Write Cycle Timing with Synchronous ARDY
Rev. PrE
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Page 38 of 68
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Table 24. Asynchronous Memory Write Cycle Timing with Asynchronous ARDY
Parameter
Min
Max
Unit
Timing Requirements
tDANR
tHAA
Switching Characteristics
ARDY Negated Delay from AMSx Asserted1
ARDY Asserted Hold After ARE Negated
(S+WA–2)*tSCLK ns
ns
0.0
tDDAT
tENDAT
tDO
DATA15–0 Disable After CLKOUT
6.0
6.0
ns
ns
ns
ns
DATA15–0 Enable After CLKOUT
Output Delay After CLKOUT2
Output Hold After CLKOUT2
1.0
0.8
tHO
1 S = number of programmed setup cycles, WA = number of programmed write access cycles.
2 Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.
ACCESS
EXTENDED
SETUP
2 CYCLES
HOLD
1 CYCLE
PROGRAMMED WRITE
ACCESS 2 CYCLES
CLKOUT
tDO
tHO
AMSx
ABE1–0
BE, ADDRESS
ADDR19–1
tDO
tHO
AWE
tDANW
tHAA
ARDY
tENDAT
DATA15–0
WRITE DATA
Figure 14. Asynchronous Memory Write Cycle Timing with Asynchronous ARDY
Rev. PrE
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Page 39 of 68
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
Synchronous Memory DDR Read Cycle Timing
Table 25. Synchronous Memory DDR Read Cycle Timing
Parameter
Minimum
Maximum
Unit
ns
Timing Requirements
TBD
Switching Characteristic
TBD TBD
TBD
TBD
TBD
ns
Figure 15. Synchronous Memory DDR Read Cycle Timing
Synchronous Memory DDR Write Cycle Timing
Table 26. Synchronous Memory DDR Write Cycle Timing
Parameter
Minimum
Maximum
Unit
ns
Timing Requirements
TBD
Switching Characteristic
TBD TBD
TBD
TBD
TBD
ns
Figure 16. Synchronous Memory DDR Write Cycle Timing
Rev. PrE
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Page 40 of 68
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Synchronous Memory Mobile DDR Read Cycle Timing
Table 27. Synchronous Memory DDR Read Cycle Timing
Parameter
Minimum
Maximum
Unit
ns
Timing Requirements
TBD
Switching Characteristic
TBD TBD
TBD
TBD
TBD
ns
Figure 17. Synchronous Memory DDR Read Cycle Timing
Synchronous Memory Mobile DDR Write Cycle Timing
Table 28. Synchronous Memory DDR Write Cycle Timing
Parameter
Minimum
Maximum
Unit
ns
Timing Requirements
TBD
Switching Characteristic
TBD TBD
TBD
TBD
TBD
ns
Figure 18. Synchronous Memory DDR Write Cycle Timing
Rev. PrE
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Page 41 of 68
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
External Port Bus Request and Grant Cycle Timing
Table 29 and Table 30 on Page 43 and Figure 19 and Figure 20
on Page 43 describe external port bus request and grant cycle
operations for synchronous and for asynchronous BR.
Table 29. External Port Bus Request and Grant Cycle Timing with Synchronous BR
Parameter
Min
Max
Unit
Timing Requirements
tBS
tBH
BR Setup to Falling Edge of CLKOUT
4.0
0.0
ns
ns
Falling Edge of CLKOUT to BR Deasserted Hold Time
Switching Characteristics
tSD
CLKOUT Low to xMS, Address, and RD/WR disable
4.5
4.5
3.6
3.6
3.6
3.6
ns
ns
ns
ns
ns
ns
tSE
CLKOUT Low to xMS, Address, and RD/WR enable
CLKOUT High to BG High Setup
tDBG
tEBG
tDBH
tEBH
CLKOUT High to BG Deasserted Hold Time
CLKOUT High to BGH High Setup
CLKOUT High to BGH Deasserted Hold Time
CLKOUT
tBH
tBS
BR
tSD
tSE
AMSx
tSD
tSE
ADDR19-1
ABE1-0
tSD
tSE
AWE
ARE
tDBG
tEBG
BG
tDBH
tEBH
BGH
Figure 19. External Port Bus Request and Grant Cycle Timing with Synchronous BR
Rev. PrE
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Page 42 of 68
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Table 30. External Port Bus Request and Grant Cycle Timing with Asynchronous BR
Parameter
Min
Max
Unit
Timing Requirements
tWBR
BR Pulsewidth
2 x tSCLK
ns
Switching Characteristics
tSD
CLKOUT Low to xMS, Address, and RD/WR disable
4.5
4.5
3.6
3.6
3.6
3.6
ns
ns
ns
ns
ns
ns
tSE
CLKOUT Low to xMS, Address, and RD/WR enable
CLKOUT High to BG High Setup
tDBG
tEBG
tDBH
tEBH
CLKOUT High to BG Deasserted Hold Time
CLKOUT High to BGH High Setup
CLKOUT High to BGH Deasserted Hold Time
CLKOUT
tWBR
BR
tSD
tSE
AMSx
tSD
tSE
ADDR19-1
ABE1-0
tSD
tSE
AWE
ARE
tDBG
tEBG
BG
tDBH
tEBH
BGH
Figure 20. External Port Bus Request and Grant Cycle Timing with Asynchronous BR
Rev. PrE
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
Enhanced Parallel Peripheral Interface Timing
Table 31 and Figure 21 on Page 44 describes Enhanced Parallel
Peripheral Interface operations.
Table 31. Enhanced Parallel Peripheral Interface Timing
Parameter
Minimum
Maximum
Unit
Timing Requirements
tPCLKW
tPCLK
EPPI_CLK Width
EPPI_CLK Period
TBD
TBD
ns
ns
Timing Requirements - GP Input and Frame Capture Modes
tSFSPE
tHFSPE
tSDRPE
tHDRPE
External Frame Sync Setup Before EPPI_CLK
External Frame Sync Hold After EPPI_CLK
Receive Data Setup Before EPPI_CLK
Receive Data Hold After EPPI_CLK
TBD
TBD
TBD
TBD
ns
ns
ns
ns
Switching Characteristics - GP Output and Frame Capture Modes
tDFSPE
tHOFSPE
tDDTPE
tHDTPE
Internal Frame Sync Delay After EPPI_CLK
Internal Frame Sync Hold After EPPI_CLK
Transmit Data Delay After EPPI_CLK
Transmit Data Hold After EPPI_CLK
TBD
TBD
ns
ns
ns
ns
TBD
TBD
Figure 21. Enhanced Parallel Peripheral Interface Timing
Rev. PrE
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Page 44 of 68
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Serial Ports Timing
Table 32 through Table 35 on Page 46 and Figure 22 on Page 46
through Figure 24 on Page 48 describe Serial Port operations.
Table 32. Serial Ports—External Clock
Parameter
Min
Max
Unit
Timing Requirements
tSFSE
TFS/RFS Setup Before TSCLK/RSCLK (externally generated TFS/RFS)1
3.0
3.0
3.0
3.0
4.5
15.0
ns
ns
ns
ns
ns
ns
tHFSE
TFS/RFS Hold After TSCLK/RSCLK (externally generated TFS/RFS)1
Receive Data Setup Before RSCLK1
Receive Data Hold After RSCLK1
TSCLK/RSCLK Width
tSDRE
tHDRE
tSCLKEW
tSCLKE
TSCLK/RSCLK Period
Switching Characteristics
tDFSE
tHOFSE
tDDTE
tHDTE
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)2
TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)2
Transmit Data Delay After TSCLK2
10.0
10.0
ns
ns
ns
ns
0.0
0.0
Transmit Data Hold After TSCLK2
1 Referenced to sample edge.
2 Referenced to drive edge.
Table 33. Serial Ports—Internal Clock
Parameter
Min
Max
Unit
Timing Requirements
tSFSI
TFS/RFS Setup Before TSCLK/RSCLK (externally generated TFS/RFS)1
8.0
ns
ns
ns
ns
ns
ns
tHFSI
TFS/RFS Hold After TSCLK/RSCLK (externally generated TFS/RFS)1
Receive Data Setup Before RSCLK1
Receive Data Hold After RSCLK1
TSCLK/RSCLK Width
–1.5
8.0
tSDRI
tHDRI
tSCLKEW
tSCLKE
–1.5
4.5
TSCLK/RSCLK Period
15.0
Switching Characteristics
tDFSI
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)2
TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)2
Transmit Data Delay After TSCLK2
3.0
3.0
ns
ns
ns
ns
ns
tHOFSI
tDDTI
–1.0
tHDTI
Transmit Data Hold After TSCLK2
–2.0
4.5
tSCLKIW
TSCLK/RSCLK Width
1 Referenced to sample edge.
2 Referenced to drive edge.
Table 34. Serial Ports—Enable and Three-State
Parameter
Min
0
Max
Unit
Switching Characteristics
tDTENE
tDDTTE
tDTENI
tDDTTI
Data Enable Delay from External TSCLK1
Data Disable Delay from External TSCLK1
Data Enable Delay from Internal TSCLK1
Data Disable Delay from Internal TSCLK1
ns
ns
ns
ns
10.0
3.0
–2.0
1 Referenced to drive edge.
Rev. PrE
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Page 45 of 68
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
Table 35. External Late Frame Sync
Parameter
Min
Max
Unit
Switching Characteristics
tDDTLFSE
tDTENLFS
Data Delay from Late External TFS or External RFS with MCE = 1, MFD = 01, 2
Data Enable from late FS or MCE = 1, MFD = 01, 2
10.0
ns
ns
0
1 MCE = 1, TFS enable and TFS valid follow tDTENLFS and tDDTLFSE
2 If external RFS/TFS setup to RSCLK/TSCLK > tSCLKE/2, then tDDTE/I and tDTENE/I apply; otherwise tDDTLFSE and tDTENLFS apply.
.
DATA RECEIVE- INTERNAL CLOCK
DATA RECEIVE- EXTERNAL CLOCK
DRIVE
EDGE
SAMPLE
EDGE
DRIVE
EDGE
SAMPLE
EDGE
tSCLKIW
tSCLKEW
RSCLK
RSCLK
tDFSE
tDFSE
tHOFSE
RFS
tSFSI
tHFSI
tHOFSE
tSFSE
tHFSE
RFS
tSDRI
tHDRI
tSDRE
tHDRE
DR
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK OR TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DR
DATA TRANSMIT- INTERNAL CLOCK
DATA TRANSMIT- EXTERNAL CLOCK
DRIVE
EDGE
SAMPLE
EDGE
DRIVE
EDGE
SAMPLE
EDGE
tSCLKIW
tSCLKEW
TSCLK
TSCLK
tDFSI
tDFSE
tHOFSI
tSFSI
tHFSI
tHOFSE
tSFSE
tHFSE
TFS
TFS
tDDTI
tDDTE
tHDTI
tHDTE
DT
DT
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK OR TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DRIVE
EDGE
DRIVE
EDGE
TSCLK (EXT)
TFS ("LATE", EXT.)
TSCLK / RSCLK
tDDTTE
tDTENE
DT
DRIVE
EDGE
DRIVE
EDGE
TSCLK (INT)
TFS ("LATE", INT.)
TSCLK / RSCLK
tDTENI
tDDTTI
DT
Figure 22. Serial Ports
Rev. PrE
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Page 46 of 68
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
EXTERNAL RFSWITH MCE = 1, MFD = 0 (INTERNAL OR EXTERNAL CLOCK)
DRIVE SAMPLE DRIVE
RSCLK
RFS
tHOFSE/I
tSFSE/I
tDDTE/I
tDTENLFS
tHDTE/I
1STBIT
2ND BIT
DT
tDDTLFSE
LATE EXTERNAL TFS(INTERNAL OR EXTERNAL CLOCK)
DRIVE SAMPLE
DRIVE
TSCLK
tSFSE/I
tHOFSE/I
TFS
tDDTE/I
TDTENLFS
tHDTE/I
DT
1STBIT
2ND BIT
tDDTLFSE
Figure 23. External Late Frame Sync (Frame Sync Setup < tSCLKE/2)
Rev. PrE
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Page 47 of 68
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
EXTERNAL RFS WITH MCE = 1, MFD = 0
DRIVE
SAMPLE
DRIVE
RSCLK
RFS
tSFSE/I
tHOFSE/I
tDDTE/I
tHDTE/I
tDTENLSCK
1ST BIT
DT
2ND BIT
tDDTLSCK
LATE EXTERNAL TFS
DRIVE
SAMPLE
DRIVE
TSCLK
TFS
tSFSE/I
tHOFSE/I
tDDTE/I
tHDTE/I
tDTENLSCK
DT
1ST BIT
2ND BIT
tDDTLSCK
Figure 24. External Late Frame Sync (Frame Sync Setup > tSCLKE/2)
Rev. PrE
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Page 48 of 68
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Serial Peripheral Interface (SPI) Port—Master Timing
Table 36 and Figure 25 describe SPI port master operations.
Table 36. Serial Peripheral Interface (SPI) Port—Master Timing
Parameter
Minimum
Maximum
Unit
Timing Requirements
tSSPIDM
tHSPIDM
Data input valid to SCK edge (data input setup)
SCK sampling edge to data input invalid
7.5
ns
ns
–1.5
Switching Characteristics
tSDSCIM
tSPICHM
tSPICLM
tSPICLK
SPISELx low to first SCK edge (x=0 or 1)
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
4tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
0
ns
ns
ns
ns
ns
ns
ns
ns
Serial clock high period
Serial clock low period
Serial clock period
tHDSM
Last SCK edge to SPISELx high (x=0 or 1)
Sequential transfer delay
tSPITDM
tDDSPIDM
tHDSPIDM
SCK edge to data out valid (data out delay)
SCK edge to data out invalid (data out hold)
6
–1.0
4.0
SPISELx
(OUTPUT)
tSPICLK
tHDSM
tSPITDM
tSDSCIM
tSPICHM
tSPICLM
SCK
(CPOL = 0)
(OUTPUT)
tSPICLM
tSPICHM
SCK
(CPOL = 1)
(OUTPUT)
tDDSPIDM
tHDSPIDM
MOSI
(OUTPUT)
MSB
LSB
CPHA=1
tSSPIDM
tHSPIDM
tSSPIDM
tHSPIDM
MISO
(INPUT)
MSB VALID
LSB VALID
tDDSPIDM
tHDSPIDM
MOSI
(OUTPUT)
MSB
LSB
CPHA=0
tSSPIDM
tHSPIDM
MISO
(INPUT)
MSB VALID
LSB VALID
Figure 25. Serial Peripheral Interface (SPI) Port—Master Timing
Rev. PrE
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Page 49 of 68
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
Serial Peripheral Interface (SPI) Port—Slave Timing
Table 37 and Figure 26 describe SPI port slave operations.
Table 37. Serial Peripheral Interface (SPI) Port—Slave Timing
Parameter
Minimum
Maximum
Unit
Timing Requirements
tSPICHS
tSPICLS
tSPICLK
tHDS
Serial clock high period
2tSCLK –1.5
2tSCLK –1.5
4tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
2tSCLK –1.5
1.6
ns
ns
ns
ns
ns
ns
ns
ns
Serial clock low period
Serial clock period
Last SCK edge to SPISS not asserted
Sequential Transfer Delay
tSPITDS
tSDSCI
tSSPID
tHSPID
SPISS assertion to first SCK edge
Data input valid to SCK edge (data input setup)
SCK sampling edge to data input invalid
1.6
Switching Characteristics
tDSOE
SPISS assertion to data out active
0
0
0
0
8
ns
ns
ns
ns
tDSDHI
tDDSPID
tHDSPID
SPISS deassertion to data high impedance
SCK edge to data out valid (data out delay)
SCK edge to data out invalid (data out hold)
8
10
10
SPISS
(INPUT)
tSPICHS
tSPICLS
tSPICLK
tHDS
tSPITDS
SCK
(CPOL = 0)
(INPUT)
tSDSCI
tSPICLS
tSPICHS
SCK
(CPOL = 1)
(INPUT)
tDSOE
tDDSPID
tHDSPID
tDDSPID
tDSDHI
MISO
(OUTPUT)
MSB
LSB
tHSPID
tSSPID
CPHA=1
tSSPID
tHSPID
MOSI
(INPUT)
MSB VALID
LSB VALID
tDSOE
tDDSPID
tDSDHI
MISO
(OUTPUT)
MSB
LSB
tHSPID
CPHA=0
tSSPID
MOSI
(INPUT)
MSB VALID
LSB VALID
Figure 26. Serial Peripheral Interface (SPI) Port—Slave Timing
Rev. PrE
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Universal Asynchronous Receiver-Transmitter
(UART) Ports—Receive and Transmit Timing
Figure 27 describes the UART ports receive and transmit opera-
tions. The maximum baud rate is SCLK/16. There is some
latency between the generation of internal UART interrupts
and the external data operations. These latencies are negligible
at the data transmission rates for the UART.
CLKOUT
(SAMPLE CLOCK)
UARTx Rx
RECEIVE
DATA(5–8)
STOP
INTERNAL
UART RECEIVE
INTERRUPT
UART RECEIVE BIT SET BY DATA STOP;
CLEARED BY FIFO READ
START
UARTx Tx
DATA(5–8)
STOP (1–2)
TRANSMIT
INTERNAL
UART TRANSMIT
INTERRUPT
UART TRANSMIT BIT SET BY PROGRAM;
CLEARED BY WRITE TO TRANSMIT
Figure 27. UART Ports—Receive and Transmit Timing
General-Purpose Port Timing
Table 38 and Figure 28 describe general-purpose
port operations.
Table 38. General-Purpose Port Timing
Parameter
Minimum
tSCLK + 1
0
Maximum
Unit
ns
Timing Requirement
tWFI
General-Purpose Port Pin Input Pulse Width
Switching Characteristic
tGPOD
General-Purpose Port Pin Output Delay from CLKOUT Low
6
ns
CLKOUT
tGPOD
GPP OUTPUT
tWFI
GPP INPUT
Figure 28. General-Purpose Port Timing
Rev. PrE
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
Timer Cycle Timing
Table 39 and Figure 29 describe timer expired operations. The
input signal is asynchronous in “width capture mode” and
“external clock mode” and has an absolute maximum input fre-
quency of (fSCLK/2) MHz.
Table 39. Timer Cycle Timing
Parameter
Minimum
Maximum
Unit
Timing Characteristics
tWL
tWH
tTIS
tTIH
Timer Pulse Width Input Low (Measured In SCLK Cycles)1
Timer Pulse Width Input High (Measured In SCLK Cycles)1
Timer Input Setup Time Before CLKOUT Low2
1tSCLK
1tSCLK
5
ns
ns
ns
ns
Timer Input Hold Time After CLKOUT Low2
–2
Switching Characteristic
tHTO Timer Pulse Width Output (Measured In SCLK Cycles)
tTOD Timer Output Update Delay After CLKOUT High
1tSCLK
(232–1)tSCLK
6
ns
ns
1 The minimum pulse widths apply for TMRx signals in width capture and external clock modes.
2 Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize timer flag inputs.
CLKOUT
tTOD
TIMER OUTPUT
tHTO
tTIS
tTIH
TIMER INPUT
tWH, tWL
Figure 29. Timer Cycle Timing
Rev. PrE
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April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
ATA/ATAPI Controller Timing
Table 40. ATA/ATAPI Controller Timing
Parameter
Minimum
Maximum
Unit
ns
Timing Requirements
TBD
Switching Characteristic
TBD TBD
TBD
TBD
TBD
ns
Figure 30. ATA/ATAPI Controller Timing
Up/Down Counter/Rotary Encoder Timing
Table 41. Up/Down Counter/Rotary Encoder Timing
Parameter
Minimum
Maximum
Unit
Timing Requirements
tWCOUNT
Up/Down Counter/Rotary Encoder Input Pulse Width
tSCLK + 1
ns
Switching Characteristic
tCIS
tCIH
Counter Input Setup Time Before CLKOUT Low1
Counter Input Hold Time After CLKOUT Low1
TBD
TBS
TBD
TBD
ns
ns
1 Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize counter inputs.
CLKOUT
tCIS
tCIH
CUD/CDG/CZM
tWCOUNT
Figure 31. Up/Down Counter/Rotary Encoder Timing
Rev. PrE
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April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
SD/SDIO Controller Timing
Table 42. SD/SDIO Controller Timing
Parameter
Minimum
Maximum
Unit
ns
Timing Requirements
TBD
TBD
TBD
Switching Characteristic
TBD
TBD
TBD
ns
Figure 32. SD/SDIO Controller Timing
MXVR Timing
Table 43 and Table 44 describe the MXVR timing requirements.
Table 43. MXVR Timing—MXI Center Frequency Requirements
Parameter
Fs = 38 KHz Fs = 44.1 KHz Fs = 48 KHz Unit
fMXI
fMXI
fMXI
fMXI
MXI Center Frequency (256Fs)
MXI Center Frequency (384Fs)
MXI Center Frequency (512Fs)
MXI Center Frequency (1024Fs)
9.728
11.2896
16.9344
22.5792
45.1584
12.288
18.432
24.576
49.152
MHz
MHz
MHz
MHz
_256
_384
_512
_1024
14.592
19.456
38.912
Table 44. MXVR Timing— MXI Clock Requirements
Parameter
Min
Max
Unit
Timing Requirements
FSMXI
FTMXI
DCMXI
MXI Clock Frequency Stability
MXI Frequency Tolerance Over Temperature
MXI Clock Duty Cycle
–50
–300
40
+50
+300
60
ppm
ppm
%
Rev. PrE
|
Page 54 of 68
|
April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
HDMA A/C Timing- Host Read Cycle
Table 45 describe the HDMA A/C Host Read Cycle timing
requirements.
Table 45. Host Read Cycle Timing Requirements
Parameter
Description
Value
Timing Requirements
tSADRDL
tHADRDH
tRDWL
HADDR and HCE Setup before HRD assertion
1.5 * tsclk ns Min
2.5 ns Min
HADDR and HCE Hold after HRD assertion
HRD pulse width low
tDRDYRDL + tRDYPRD + tDRDHRDY ns Min (ACK mode)
1.5 * tsclk + 8.7 ns Min (INT mode)
2 * tsclk ns Min
tRDWH
HRD pulse width high
tDRDHRDY
HRD de-assertion delay after HRDY de-assertion
TBD ns Min
Switching Characteristics
tSDATRDY
tDRDYRDL
tRDYPRD
Data valid after HRDY assertion
1 * tsclk ns Max
HRDY assertion delay after hrd assertion
HRDY low pulse-width for Read access
1.5 * tsclk + 8.7 ns
Data Delay (based on when the FIFO is empty - used
for cycle extension
tHDARWH
Data disable after HRD de-assertion
1.0 ns
HOST_ADDR
HOST_CE
tHADRDH
tSADRDL
tRDWH
tRDWL
HOST_RD
tDRDYRDL
tRDYPRD
tDRDHRDY
ACK
tHDARWH
tSDATRDY
HOST_D15-0
Figure 33. HDMA A/C- Host Read Cycle
Rev. PrE
|
Page 55 of 68
|
April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
HDMA A/C Timing- Host Write Cycle
Table 46 describes the HDMA A/C Host Write Cycle timing
requirements.
Table 46. Host Write Cycle Timing Requirements
Parameter
Description
Value
Timing Requirements
tSADWRH
tHADWRH
tWRWL
HADDR/HCE Setup before HRD assertion
1.5 * tsclk + 10.8 ns Min
2.5 ns Min
HADDR/HCE Hold after HRD assertion
HWR pulse width low
tDRDYRDL + tRDYPRD + tDRDHRDY Min (ACK mode)
1.5 * tsclk + 8.7 ns Min (INT mode)
2 * tsclk ns
tWRWH
HWR pulse width high
tDWRHRDY
tHDATWH
tSDATWH
HWR de-assertion delay after HRDY de-assertion
Data Hold after HWR de-assertion
TBD ns Min
2.5 ns Min
Data Setup valid after before HWR de-assertion
2.5 ns Min
Switching Characteristics
tDRDYWRL HRDY low delay after HWR/HCE assertion
tRDYPWR
1.5 * tsclk + 8.7 ns Max
HRDY low pulse-width for Write access
Data Delay (based on when the FIFO is empty - used
for cycle extension
HOST_ADDR
HOST_CE
tHADWRH
tSADWRH
tWRWH
tWRWL
wrh
HOST_RD
tDRDYWRL
tRDYPWR
tDRRHRDY
ACK
tHDATWH
tSDATWH
HOST_D15-0
Figure 34. HDMA A/C- Host Write Cycle
Rev. PrE
|
Page 56 of 68
|
April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
JTAG Test And Emulation Port Timing
Table 47 and Figure 35 describe JTAG port operations.
Table 47. JTAG Port Timing
Parameter
Minimum
Maximum
Unit
Timing Parameters
tTCK
TCK Period
20
4
ns
tSTAP
tHTAP
tSSYS
tHSYS
tTRSTW
TDI, TMS Setup Before TCK High
TDI, TMS Hold After TCK High
System Inputs Setup Before TCK High1
System Inputs Hold After TCK High1
TRST Pulsewidth2 (measured in TCK cycles)
ns
4
ns
4
ns
5
ns
4
TCK
Switching Characteristics
tDTDO TDO Delay from TCK Low
tDSYS
System Outputs Delay After TCK Low3
10
12
ns
ns
0
1 System Inputs=PA15–0, PB14–0, PC15–0, PD15–0, PE15–0, PF15–0, PG15–0, PH13–0, PI15–0, PJ14–0, DQ15–0, DQS1–0, D15–0, ATAPI_PDIAG, CLKIN, RESET, NMI,
BMODE3–0, MFS, MLF_P, and MLF_M.
2 50 MHz Maximum
3 System Outputs=PA15–0, PB14–0, PC15–0, PD15–0, PE15–0, PF15–0, PG15–0, PH13–0, PI15–0, PJ14–0, DQ15–0, DQS1–0, D15–0, DA12–0, DBA1–0, DQM1–0, DCLK2–1,
DCLK2–1, DCS1–0, DCKE, DRAS, DCAS, DWE, AMS3–0, ABE1–0, AOE, ARE, AWE, EMU, CLKOUT, CLKBUF, EXT_WAKE.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 35. JTAG Port Timing
Rev. PrE
|
Page 57 of 68
|
April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
POWER DISSIPATION
TEST CONDITIONS
Total power dissipation has two components: one due to inter-
nal circuitry (PINT) and one due to the switching of external
output drivers (PEXT). Table 48 through Table 50 show the
power dissipation for internal circuitry (VDDINT).
All timing parameters appearing in this data sheet were mea-
sured under the conditions described in this section.
Output Enable Time
Output pins are considered to be enabled when they have made
a transition from a high impedance state to the point when they
start driving. The output enable time tENA is the interval from
the point when a reference signal reaches a high or low voltage
level to the point when the output starts driving as shown in the
Output Enable/Disable diagram (Figure 36). The time
tENA_MEASURED is the interval from when the reference signal
switches to when the output voltage reaches 2.0 V (output high)
or 1.0 V (output low). Time tTRIP is the interval from when the
output starts driving to when the output reaches the 1.0 V or
2.0 V trip voltage. Time tENA is calculated as shown in the
equation:
See the ADSP-BF549 Blackfin Processor Hardware Reference for
definitions of the various operating modes and for instructions
on how to minimize system power.
Many operating conditions can affect power dissipation. System
designers should refer to EE-TBD: Estimating Power for ADSP-
BF542/BF544/BF548/BF549 Blackfin Processors on the Analog
Devices website (www.analog.com)—use site search on
“EE-TBD.” This document provides detailed information for
optimizing your design for lowest power.
Table 48. Internal Power Dissipation (Hibernate mode)
IDD (nominal)
TBD
Unit
μA
t
= t
– t
ENA_MEASURED TRIP
1
IDDHIBERNATE
ENA
2
IDDRTC
TBD
μA
If multiple pins (such as the data bus) are enabled, the measure-
ment value is that of the first pin to start driving.
1 Measured at VDDEXT = 3.65 V with voltage regulator off (VDDINT = 0 V).
2 Measured at VDDRTC = 3.3 V at 25°C.
Output Disable Time
Table 49. Internal Power Dissipation (Deep Sleep mode)
Output pins are considered to be disabled when they stop driv-
ing, go into a high impedance state, and start to decay from their
output high or low voltage. The time for the voltage on the bus
to decay by ΔV is dependent on the capacitive load, CL and the
load current, IL. This decay time can be approximated by the
equation:
1
VDDINT
IDD (nominal2)
Unit
mA
mA
mA
mA
mA
0.8
TBD
TBD
TBD
TBD
TBD
0.9
1.0
1.1
t
= (C ΔV) ⁄ I
DECAY
L
L
1.26
1 Assumes VDDINT is regulated externally.
The output disable time tDIS is the difference between
2 Nominal assumes an operating temperature of 25°C.
t
DIS_MEASURED and tDECAY as shown in Figure 36. The time
DIS_MEASURED is the interval from when the reference signal
t
Table 50. Internal Power Dissipation (Full On1 mode)
VDDINT2 @ fCCLK
0.8 @ TBD MHz
0.8 @ TBD MHz
0.9 @ TBD MHz
1.0 @ TBD MHz
1.1 @ TBD MHz
1.26 @ TBD MHz
IDD (nominal3)
Unit
mA
mA
mA
mA
mA
mA
TBD
TBD
TBD
TBD
TBD
TBD
1 Processor executing 75% dual MAC, 25% ADD with moderate data bus activity.
2 Assumes VDDINT is regulated externally.
3 Nominal assumes an operating temperature of 25°C.
Rev. PrE
|
Page 58 of 68
|
April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
switches to when the output voltage decays ΔV from the mea-
sured output high or output low voltage. The time tDECAY is
calculated with test loads CL and IL, and with ΔV equal to 0.5 V.
ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
T
= T
+ (Ψ × P )
JT
REFERENCE
SIGNAL
J
CASE
D
where:
TJ = Junction temperature (؇C)
tDIS_MEASURED
tENA-MEASURED
tDIS
VOH
tENA
T
CASE = Case temperature (؇C) measured by customer at top
VOH
(MEASURED)
(MEASURED)
VOH (MEASURED) ؊ ⌬V
VOL (MEASURED) + ⌬V
2.0V
1.0V
center of package.
VOL
VOL
(MEASURED)
ΨJT = From Table 51
(MEASURED)
tDECAY
tTRIP
PD = Power dissipation (see Power Dissipation on Page 58 for
the method to calculate PD)
OUTPUT STOPS DRIVING
OUTPUT STARTS DRIVING
HIGH IMPEDANCE STATE.
Values of θJA are provided for package comparison and printed
circuit board design considerations. θJA can be used for a first
order approximation of TJ by the equation:
TEST CONDITIONS CAUSE THIS
VOLTAGE TO BE APPROXIMATELY 1.5V.
Figure 36. Output Enable/Disable
T
= T + (θ × P )
JA
J
A
D
Example System Hold Time Calculation
where:
TA = Ambient temperature (؇C)
To determine the data output hold time in a particular system,
first calculate tDECAY using the equation given above. Choose ΔV
to be the difference between the ADSP-BF542/4/8/9 processor’s
output voltage and the input threshold for the device requiring
the hold time. A typical ΔV will be 0.4 V. CL is the total bus
capacitance (per data line), and IL is the total leakage or three-
state current (per data line). The hold time will be tDECAY plus
the minimum disable time (for example, tDDAT for an asynchro-
nous memory write cycle).
Values of θJC are provided for package comparison and printed
circuit board design considerations when an external heatsink is
required.
Values of θJB are provided for package comparison and printed
circuit board design considerations.
In Table 51, airflow measurements comply with JEDEC stan-
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
50V
TO
1.5V
OUTPUT
PIN
Table 51. Thermal Characteristics
30pF
Parameter Condition
Typical Unit
θJA
θJA
θJA
θJB
θJC
ΨJT
ΨJT
ΨJT
0 linear m/s air flow
18.4
15.8
15.0
9.75
6.37
0.27
0.60
0.66
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
Figure 37. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
1 linear m/s air flow
2 linear m/s air flow
INPUT
OR
1.5V
1.5V
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
OUTPUT
Figure 38. Voltage Reference Levels for AC
Measurements (Except Output Enable/Disable)
Rev. PrE
|
Page 59 of 68
|
April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
400-BALL BGA PINOUT
Table 52 lists the BGA pinout by signal for the ADSP-BF549.
Table 53 on Page 63 lists the BGA pinout by ball number.
Table 52. 400-Ball BGA Ball Assignment (Alphabetically by Signal)
Signal
ABE0
ABE1
ADDR1
ADDR2
ADDR3
AMS0
AMS1
AMS2
AMS3
AOE
Ball No.
C17
C16
B2
Signal
DA4
Ball No.
G16
F19
D20
C20
F18
E19
B20
F17
D19
H17
H16
F16
E16
D16
C18
D18
B18
C19
B19
M20
N20
L18
M19
L19
L20
L17
K16
K20
K17
K19
J20
Signal
DQS1
DRAS
DWE
EMU
EXT_WAKE
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Ball No.
H18
E17
E18
R5
Signal
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GNDMC
GNDMP
GNDMX
MFS
Ball No.
P13
V6
DA5
DA6
G9
A2
DA7
G10
G11
L7
B3
DA8
M18
A1
A10
D9
DA9
DA10
DA11
DA12
DBA0
DBA1
DCAS
DCK1
DCK1
DCK2
DCK2
DCKE
DCS0
DCS1
DDR_VREF
DDR_VSSR
DQ0
A13
A20
E3
L8
B10
D10
C10
B12
P19
D12
W1
L9
L10
L11
L12
L13
L14
R9
J7
ARE
J8
ATAPI_PDIAG
AWE
J9
J10
J11
J12
N6
BMODE0
BMODE1
BMODE2
BMODE3
CLKBUF
CLKIN
CLKOUT
D0
W2
R13
R14
R16
D1
W3
W4
N7
D11
A11
L16
D13
C13
B13
B15
A15
B16
A16
B17
C14
C15
A17
D14
D15
E15
E14
D17
G19
G17
E20
G18
N8
N9
H7
N10
N11
N12
N13
N14
U8
H8
H9
D1
H10
H11
H12
M6
M7
M8
M9
M10
M11
M12
M13
M14
Y1
D2
DQ1
D3
DQ2
D4
DQ3
D5
DQ4
B11
F3
D6
DQ5
D7
DQ6
F14
K7
D8
DQ7
D9
DQ8
K8
D10
DQ9
K9
D11
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQM0
DQM1
DQS0
K18
H20
J19
K10
K11
K12
K13
P8
D12
D13
D14
J18
Y20
F6
D15
J17
DA0
J16
P9
E7
DA1
G20
H19
F20
P10
P11
P12
D4
DA2
E6
DA3
MLF_M
F4
Rev. PrE
|
Page 60 of 68
|
April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Table 52. 400-Ball BGA Ball Assignment (Alphabetically by Signal) (Continued)
Signal
MLF_P
MXI
Ball No.
E4
Signal
PC_5
PC_6
PC_7
PC_8
PC_9
PC_10
PC_11
PC_12
PC_13
PD_0
PD_1
PD_2
PD_3
PD_4
PD_5
PD_6
PD_7
PD_8
PD_9
PD_10
PD_11
PD_12
PD_13
PD_14
PD_15
PE_0
Ball No.
G1
Signal
PE_15
PF_0
Ball No.
W17
K3
Signal
Ball No.
H4
PH_7
PH_8
PH_9
PH_10
PH_11
PH_12
PH_13
PI_0
C2
J5
D5
MXO
C1
H3
PF_1
J1
C4
NMI
C11
U12
V12
W12
Y12
W11
V11
Y11
U11
U10
Y10
Y9
Y14
V13
U13
W14
Y15
W15
P3
PF_2
K2
C7
PA_0
PA_1
PA_2
PA_3
PA_4
PA_5
PA_6
PA_7
PA_8
PA_9
PA_10
PA_11
PA_12
PA_13
PA_14
PA_15
PB_0
PB_1
PB_2
PB_3
PB_4
PB_5
PB_6
PB_7
PB_8
PB_9
PB_10
PB_11
PB_12
PB_13
PB_14
PC_0
PC_1
PC_2
PC_3
PC_4
PF_3
K1
C5
PF_4
L2
D7
PF_5
L1
C6
PF_6
L4
A3
PF_7
K4
PI_1
B4
PF_8
L3
PI_2
A4
P4
PF_9
M1
M2
M3
M4
N4
PI_3
B5
R1
PF_10
PF_11
PF_12
PF_13
PF_14
PF_15
PG_0
PG_1
PG_2
PG_3
PG_4
PG_5
PG_6
PG_7
PG_8
PG_9
PG_10
PG_11
PG_12
PG_13
PG_14
PG_15
PH_0
PH_1
PH_2
PH_3
PH_4
PH_5
PH_6
PI_4
A5
R2
PI_5
B6
T1
PI_6
A6
R3
PI_7
B7
V10
Y8
T2
N1
PI_8
A7
R4
N2
PI_9
C8
W10
Y7
U1
J4
PI_10
PI_11
PI_12
PI_13
PI_14
PI_15
PJ_0
B8
U2
K5
A8
W9
W5
Y2
T3
L5
A9
V1
N3
C9
T4
P1
D8
T6
V2
V15
Y17
W16
V16
Y19
Y18
U15
P16
R18
Y13
W13
W18
U14
V17
V18
U17
C3
B9
U6
U4
R20
N18
M16
T20
N17
U20
P18
N16
R19
P17
T19
M17
P20
N19
C12
A14
B14
Y4
U3
PJ_1
Y3
V19
T17
U18
V14
Y16
W20
W19
R17
V20
U19
T18
P2
PJ_2
W6
V7
PE_1
PJ_3
PE_2
PJ_4
W8
V8
PE_3
PJ_5
PE_4
PJ_6
U7
PE_5
PJ_7
W7
Y6
PE_6
PJ_8
PE_7
PJ_9
V9
PE_8
PJ_10
PJ_11
PJ_12
PJ_13
RESET
RTXI
Y5
PE_9
H2
PE_10
PE_11
PE_12
PE_13
PE_14
J3
J2
M5
P5
H1
G2
U16
D6
RTXO
Rev. PrE
|
Page 61 of 68
|
April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
Table 52. 400-Ball BGA Ball Assignment (Alphabetically by Signal) (Continued)
Signal
TCK
Ball No.
V3
Signal
VDDDDR
VDDDDR
VDDDDR
VDDDDR
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
Ball No.
G15
H13
H14
H15
E9
Signal
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDINT
VDDINT
VDDINT
VDDINT
Ball No.
R7
Signal
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDMC
VDDMP
VDDMX
VDDRTC
VDDUSB
VDDUSB
Ball No.
P6
TDI
V5
R8
P7
TDO
V4
R15
H5
P14
G8
TMS
U5
TRST
T5
H6
G12
G13
L6
USB_DM
USB_DP
USB_ID
USB_RSET
USB_VBUS
USB_VREF
USB_XI
USB_XO
VDDDDR
VDDDDR
VDDDDR
VDDDDR
VDDDDR
VDDDDR
VDDDDR
E2
E10
E11
E12
N5
M15
T7
E1
G3
T8
L15
R10
R11
R12
F7
D3
T9
D2
N15
F8
T10
T11
T12
T13
T14
T15
T16
J6
B1
F1
F13
F15
K6
F2
E8
J14
J15
F10
F11
F12
K14
K15
E5
P15
G5
E13
F5
G6
G4
G7
J13
U9
VROUT
VROUT
XTAL
0
1
A18
A19
A12
G14
R6
F9
Rev. PrE
|
Page 62 of 68
|
April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Table 53 lists the BGA pinout by ball number for the ADSP-
BF549. Table 52 on Page 60 lists the BGA pinout by signal.
Table 53. 400-Ball BGA Ball Assignment (Numerically by Ball Number)
Ball No.
A1
Signal
GND
ADDR2
PI_0
Ball No.
B1
Signal
USB_VREF
ADDR1
ADDR3
PI_1
Ball No.
C1
Signal
MXO
MXI
Ball No.
Signal
GND
D1
A2
B2
C2
D2
USB_VBUS
USB_RSET
GNDMX
PH_8
PH_6
PH_12
PI_14
AMS1
AMS3
CLKBUF
AWE
A3
B3
C3
PH_5
PH_9
PH_11
PH_13
PH_10
PI_9
D3
A4
PI_2
B4
C4
D4
A5
PI_4
B5
PI_3
C5
D5
A6
PI_6
B6
PI_5
C6
D6
A7
PI_8
B7
PI_7
C7
D7
A8
PI_11
PI_12
AMS0
CLKIN
XTAL
GND
RTXI
D4
B8
PI_10
PI_15
AMS2
GND
C8
D8
A9
B9
C9
PI_13
AOE
D9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
E1
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
F1
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
G1
D10
D11
D12
D13
D14
D15
D16
D17
D18
D19
D20
H1
NMI
ARE
RESET
D1
D2
D0
RTXO
D3
D8
D11
D9
D12
D6
D5
ABE1
ABE0
DCK2
DCS0
DA7
DCK1
D15
D10
D7
VROUT0
DCKE
DCS1
DA10
USB_XI
USB_XO
GND
DCK2
DA12
DA6
VROUT
GND
1
USB_DP
USB_DM
GND
PC_5
PC_4
USB_ID
VDDUSB
VDDEXT
VDDEXT
VDDEXT
VDDINT
GND
GND
GND
VDDINT
VDDINT
VDDEXT
VDDDDR
DA4
PC_3
PC_0
PC_7
PH_7
VDDEXT
VDDEXT
GND
E2
F2
G2
H2
E3
F3
G3
H3
E4
MLF_P
VDDMX
MFS
F4
MLF_M
VDDUSB
GNDMC
VDDMC
VDDEXT
VDDINT
VDDDDR
VDDDDR
VDDDDR
VDDEXT
GND
G4
H4
E5
F5
G5
H5
E6
F6
G6
H6
E7
GNDMP
VDDMP
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDRTC
D14
F7
G7
H7
E8
F8
G8
H8
GND
E9
F9
G9
H9
GND
E10
E11
E12
E13
E14
E15
E16
E17
E18
E19
E20
F10
F11
F12
F13
F14
F15
F16
F17
F18
F19
F20
G10
G11
G12
G13
G14
G15
G16
G17
G18
G19
G20
H10
H11
H12
H13
H14
H15
H16
H17
H18
H19
H20
GND
GND
GND
VDDDDR
VDDDDR
VDDDDR
DBA1
DBA0
DQS1
DQM1
DQ11
D13
VDDEXT
DCAS
DA11
DA8
DCK1
DRAS
DWE
DA1
DA3
DA9
DA5
DA0
DA2
DQS0
DQM0
Rev. PrE
|
Page 63 of 68
|
April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
Table 53. 400-Ball BGA Ball Assignment (Numerically by Ball Number) (Continued)
Ball No.
J1
Signal
PF_1
PC_2
PC_1
PG_0
PC_6
VDDINT
GND
Ball No.
K1
Signal
PF_3
PF_2
PF_0
PF_7
PG_1
VDDEXT
GND
Ball No.
L1
Signal
PF_5
PF_4
PF_8
PF_6
PG_2
VDDINT
GND
GND
GND
GND
GND
GND
GND
GND
VDDINT
CLKOUT
DQ4
Ball No.
M1
Signal
PF_9
J2
K2
L2
M2
PF_10
PF_11
PF_12
PE_12
GND
J3
K3
L3
M3
J4
K4
L4
M4
J5
K5
L5
M5
J6
K6
L6
M6
J7
K7
L7
M7
GND
J8
GND
K8
GND
L8
M8
GND
J9
GND
K9
GND
L9
M9
GND
J10
J11
J12
J13
J14
J15
J16
J17
J18
J19
J20
N1
GND
K10
K11
K12
K13
K14
K15
K16
K17
K18
K19
K20
P1
GND
L10
L11
L12
L13
L14
L15
L16
L17
L18
L19
L20
R1
M10
M11
M12
M13
M14
M15
M16
M17
M18
M19
M20
T1
GND
GND
GND
GND
GND
GND
GND
VDDINT
VDDDDR
VDDDDR
DQ15
DQ14
DQ13
DQ12
DQ9
GND
GND
VDDDDR
VDDDDR
DQ5
GND
VDDEXT
PJ_2
DQ7
PJ_11
EXT_WAKE
DQ1
DQ10
DQ8
DQ0
DQ2
DQ6
DQ3
DDR_VREF
PD_4
PD_6
PD_10
PD_12
TRST
PF_14
PF_15
PG_3
PF_13
VDDEXT
GND
PG_4
PE_11
PD_0
PD_1
PE_13
VDDINT
VDDINT
GND
PD_2
PD_3
PD_5
PD_7
EMU
N2
P2
R2
T2
N3
P3
R3
T3
N4
P4
R4
T4
N5
P5
R5
T5
N6
P6
R6
VDDEXT
VDDEXT
VDDEXT
GND
VDDINT
VDDINT
VDDINT
GND
GND
VDDEXT
GND
PE_7
PG_13
PJ_8
T6
PB_2
N7
GND
P7
R7
T7
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
PE_1
N8
GND
P8
R8
T8
N9
GND
P9
GND
R9
T9
N10
N11
N12
N13
N14
N15
N16
N17
N18
N19
N20
GND
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
GND
R10
R11
R12
R13
R14
R15
R16
R17
R18
R19
R20
T10
T11
T12
T13
T14
T15
T16
T17
T18
T19
T20
GND
GND
GND
GND
GND
GND
GND
VDDINT
VDDEXT
PG_12
PJ_9
VDDEXT
PJ_7
PJ_4
PJ_1
PJ_6
PE_10
PJ_10
PJ_3
PJ_13
DDR_VSSR
ATAPI_PDIAG
PJ_12
PJ_0
Rev. PrE
|
Page 64 of 68
|
April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
Table 53. 400-Ball BGA Ball Assignment (Numerically by Ball Number) (Continued)
Ball No.
U1
Signal
PD_8
PD_9
PD_15
PD_14
TMS
Ball No.
V1
Signal
PD_11
PD_13
TCK
Ball No.
W1
Signal
BMODE0
BMODE1
BMODE2
BMODE3
PB_0
Ball No.
Signal
GND
Y1
U2
V2
W2
Y2
PB_1
U3
V3
W3
Y3
PB_5
U4
V4
TDO
W4
Y4
PB_4
U5
V5
TDI
W5
Y5
PB_14
PB_12
PA_14
PA_12
PA_10
PA_9
U6
PB_3
PB_10
GND
V6
GND
W6
PB_6
Y6
U7
V7
PB_7
PB_9
PB_13
PA_11
PA_5
PA_1
PC_9
PE_3
PG_5
PG_8
PH_2
PH_3
PE_0
PE_8
W7
PB_11
PB_8
Y7
U8
V8
W8
Y8
U9
VDDINT
PA_8
PA_7
PA_0
PC_10
PH_1
PG_11
PE_14
PH_4
PE_2
V9
W9
PA_15
PA_13
PA_4
Y9
U10
U11
U12
U13
U14
U15
U16
U17
U18
U19
U20
V10
V11
V12
V13
V14
V15
V16
V17
V18
V19
V20
W10
W11
W12
W13
W14
W15
W16
W17
W18
W19
W20
Y10
Y11
Y12
Y13
Y14
Y15
Y16
Y17
Y18
Y19
Y20
PA_6
PA_2
PA_3
PG_15
PC_11
PC_13
PG_7
PG_14
PC_8
PC_12
PE_4
PE_15
PH_0
PG_6
PG_10
PG_9
GND
PE_9
PE_6
PJ_5
PE_5
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20
R
R
A
B
C
D
E
F
R
G
S
G
S
S
S
S
G
S
S
S
S
S
S
S
S
S
G
H
J
S
S
S
K
L
R
G
M
N
P
R
T
U
V
W
Y
KEY:
VDDINT
VDDEXT
S
SUPPLIES: VDDDDR, VDDMP, VDDMX, VDDMC, VDDUSB, VDDRTC
REFERENCES: VROUTO, VROUT1, DDR_VREF, USB_VREF
GROUNDS: GNDMP, GNDMX, GNDMC, DDR_VSSR
I/O SIGNALS
R
G
GND
NC
Figure 39. 400-Ball Mini-BGA Ground Configuration (Top View)
Rev. PrE
|
Page 65 of 68
|
April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
OUTLINE DIMENSIONS
Dimensions in Figure 40 are shown in millimeters.
15.20 BSC SQ
0.80 BSC BALL PITCH
17.00 BSC SQ
A1 BALL
A1 BALL INDICATOR
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
20 19 18 17 16 1514 13 12 11 10
9 8 7 6 5 4 3 2 1
BOTTOM VIEW
TOP VIEW
0.28 MIN
0.12 MAX
COPLANARITY
SIDE VIEW
1.70 MAX
0.50
0.45
0.40
SEATING PLANE
BALL DIAMETER
DETAIL A
DETAIL A
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIANT TO JEDEC REGISTERED OUTLINE MO-205, VARIATION AM,
WITH THE EXCEPTION OF BALL DIAMETER.
3. CENTER DIMENSIONS ARE NOMINAL.
Figure 40. Chip Scale Package Ball Grid Array (Mini-BGA) BC-400
SURFACE MOUNT DESIGN
Table 54 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 54. BGA Data for Use with Surface Mount Design
Package
Ball Attach Type
Solder Mask Opening
Ball Pad Size
0.50 mm diameter
Chip Scale Package Ball Grid Array (Mini-BGA) BC-400
Solder Mask Defined
0.40 mm diameter
Rev. PrE
|
Page 66 of 68
|
April 2007
Preliminary Technical Data
ADSP-BF542/4/8/9
ORDERING GUIDE
Part numbers that include “Z” are RoHS Compliant.
Part Number
Temperature Range (Ambient)
TBD1
Speed Grade (Max)
Operating Voltage (Nominal)
ADSP-BF549BBCZ-ENG
TBD1
TBD1
1 For more information, see component engineering-grade agreement.
Rev. PrE
|
Page 67 of 68
|
April 2007
ADSP-BF542/4/8/9
Preliminary Technical Data
©
2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
PR06512-0-4/07(PrE)
Rev. PrE
|
Page 68 of 68
|
April 2007
相关型号:
ADSP-BF544BBCZ-5X
IC 16-BIT, 50 MHz, OTHER DSP, PBGA400, 17 X 17 MM, ROHS COMPLIANT, MO-205AM, CSPBGA-400, Digital Signal Processor
ADI
ADSP-BF547BBCZ-5X
IC 16-BIT, 50 MHz, OTHER DSP, PBGA400, 17 X 17 MM, ROHS COMPLIANT, MO-205AM, CSPBGA-400, Digital Signal Processor
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