ADSP-BF561SKBCZ600 [ADI]

Blackfin Embedded Symmetric Multi-Processor; Blackfin嵌入式对称多处理器
ADSP-BF561SKBCZ600
型号: ADSP-BF561SKBCZ600
厂家: ADI    ADI
描述:

Blackfin Embedded Symmetric Multi-Processor
Blackfin嵌入式对称多处理器

文件: 总52页 (文件大小:508K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Blackfin® Embedded  
Symmetric Multi-Processor  
a
Preliminary Technical Data  
FEATURES  
ADSP-BF561  
PERIPHERALS  
Dual Symmetric 600 Mhz High Performance Blackfin Core  
328 KBytes of On-chip Memory (See Memory Info on Page 3)  
Each Blackfin Core Includes:  
Two 16-Bit MACs, Two 40-Bit ALUs, Four 8-Bit Video ALUs,  
40-Bit Shifter  
RISC-Like Register and Instruction Model for Ease of Pro-  
gramming and Compiler-Friendly Support  
Advanced Debug, Trace, and Performance- Monitoring  
0.8 - 1.2V core VDD with On-Chip Voltage Regulation  
3.3V and 2.5V Tolerant I/O  
Two Parallel Input/Output Peripheral Interface Units Sup-  
porting ITU-R 656 Video and Glueless Interface to ADI  
Analog Front End ADCs  
Two Dual Channel, Full Duplex Synchronous Serial Ports Sup-  
porting Eight Stereo I2S Channels  
Dual 16 Channel DMA Controllers and one internal memory  
DMA controller  
12 General Purpose 32-bit Timer/Counters, with PWM  
Capability  
SPI-Compatible Port  
UART with Support for IrDA®  
Dual Watchdog Timers  
256-Ball Mini BGA and 297-Ball PBGA Package Options  
48 Programable Flags  
On-Chip Phase Locked Loop Capable of 1x to 63x Frequency  
Multiplication  
IRQ CTRL/  
JTAG TEST  
IRQ CTRL/  
TIMER  
TIMER  
EMULATION  
B B  
VOLTAGE  
REGULATOR  
UART  
IRDA®  
SPI  
L1  
L1  
DATA  
MEMORY  
L1  
L1  
L2 SRAM  
DATA  
MMU  
MMU  
INSTRUCTION  
MEMORY  
INSTRUCTION  
MEMORY  
128 KBYTES  
MEMORY  
SPORT0  
SPORT1  
GPIO  
IMDMA  
CONTROLLER  
CORE SYSTEM / BUS INTERFACE  
EAB  
DMA  
CONTROLLER1  
32  
TIMERS  
DMA  
CONTROLLER2  
DAB  
PAB  
16  
BOOT ROM  
16  
32  
DAB  
EXTERNAL PORT  
FLASH/SDRAM CONTROL  
PPI  
PPI  
Figure 1. Functional Block Diagram  
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.  
Rev. PrC  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O.Box 9106, Norwood, MA 02062-9106 U.S.A.  
Tel:781/329-4700  
Fax:781/326-8703  
www.analog.com  
© 2004 Analog Devices, Inc. All rights reserved.  
ADSP-BF561  
Preliminary Technical Data  
TABLE OF CONTENTS  
General Description ................................................. 3  
Portable Low-Power Architecture ............................. 3  
Blackfin Processor Core .......................................... 3  
Memory Architecture ............................................ 4  
Internal (On-chip) Memory ................................. 4  
External (Off-Chip) Memory ................................ 5  
I/O Memory Space ............................................. 6  
Booting ........................................................... 6  
Event Handling ................................................. 6  
Core Event Controller (CEC) ................................ 6  
System Interrupt Controller (SIC) .......................... 6  
Event Control ................................................... 7  
DMA Controllers .................................................. 8  
WatchDog Timers ................................................ 8  
Serial Ports (SPORTs) ............................................ 9  
Serial Peripheral Interface (SPI) Ports ........................ 9  
UART Port .......................................................... 9  
Programmable Flags (PFx) .................................... 10  
Timers ............................................................. 10  
Parallel Peripheral Interface ................................... 10  
General Purpose Mode Descriptions .................... 10  
Input Mode .................................................... 10  
ITU -R 656 Mode Descriptions ........................... 10  
Active Video Only Mode ................................... 10  
Vertical Blanking Interval Mode .......................... 11  
Entire Field Mode ............................................ 11  
Dynamic Power Management ................................ 11  
Full-On Operating Mode – Maximum Performance . 11  
Active Operating Mode – Moderate Power Savings .. 11  
Development Tools .............................................. 14  
Designing an Emulator-Compatible  
Processor Board (Target) ................................... 15  
Additional Information ........................................ 15  
Pin Descriptions .................................................... 16  
Specifications ........................................................ 20  
Recommended Operating Conditions ...................... 20  
Electrical Characteristics ....................................... 20  
Absolute Maximum Ratings ................................... 21  
ESD Sensitivity ................................................... 21  
Timing Specifications ........................................... 22  
Clock and Reset Timing ..................................... 23  
Asynchronous Memory Read Cycle Timing ............ 24  
Asynchronous Memory Write Cycle Timing ........... 25  
SDRAM Interface Timing .................................. 26  
External Port Bus Request and Grant Cycle Timing .. 27  
Parallel Peripheral Interface Timing ..................... 28  
Serial Ports ..................................................... 29  
Serial Peripheral Interface (SPI) Port—Master Timing 34  
Serial Peripheral Interface (SPI) Port—Slave Timing . 36  
Universal Asynchronous Receiver-Transmitter (UART)  
Port—Receive and Transmit Timing .................. 38  
Timer Cycle Timing .......................................... 39  
Programmable Flags Cycle Timing ....................... 40  
JTAG Test And Emulation Port Timing ................. 41  
Power Dissipation ............................................... 42  
Output Drive Currents ......................................... 42  
Test Conditions .................................................. 42  
Output Enable Time ......................................... 43  
Output Disable Time ......................................... 43  
Example System Hold Time Calculation ................... 43  
Capacitive Loading .............................................. 44  
256-ball MBGA Pin Configurations ............................ 45  
297-ball PBGA Pin Configurations ............................. 47  
Outline Dimensions ................................................ 50  
Outline Dimensions ................................................ 51  
Ordering Guide ..................................................... 51  
Hibernate Operating Mode—Maximum Static Power  
Savings ....................................................... 11  
Sleep Operating Mode – High Power Savings ......... 11  
Deep Sleep Operating Mode – Max. Power Savings .. 11  
Power Savings ................................................. 12  
Voltage Regulation .............................................. 12  
Clock Signals ..................................................... 13  
Booting Modes ................................................... 13  
Instruction Set Description ................................... 14  
REVISION HISTORY  
Revision PrC:  
• Edits made to pinlists and timing specification.  
Rev. PrC  
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Page 2 of 52  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
GENERAL DESCRIPTION  
The ADSP-BF561 processor is a high-performance member of  
the Blackfin family of products targeting a variety of multimedia  
and telecommunications applications. At the heart of this device  
are two independent Analog Devices Blackfin processors. These  
Blackfin processors combine a dual-MAC state-of-the-art signal  
processing engine, the advantage of a clean, orthogonal RISC-  
like microprocessor instruction set, and single-instruction, mul-  
tiple-data (SIMD) multimedia capabilities into a single  
instruction-set architecture. The ADSP-BF561 device integrates  
a general purpose set of digital imaging peripherals creating a  
complete system on-chip solution for digital imaging and multi-  
media applications.  
Additional on-chip memory peripherals include:  
• 128 KBytes of Low Latency On-chip SRAM  
• Four Channel Internal Memory DMA Controller  
• External Memory controller with glueless support for  
SDRAM, SRAM, and Flash  
PORTABLE LOW-POWER ARCHITECTURE  
Blackfin processors provide world-class power management  
and performance for embedded signal processing applications.  
Blackfin processors are designed in a low power and low voltage  
design methodology and feature Dynamic Power Management.  
Dynamic Power Management is the ability to vary both the volt-  
age and frequency of operation to significantly lower the overall  
power dissipation. This translates into an exponential reduction  
in power dissipation providing longer battery life to portable  
applications.  
The ADSP-BF561 processor has 328 KBytes of on-chip mem-  
ory. Each Blackfin core includes:  
• 16K Bytes of Instruction SRAM/Cache  
• 16K Bytes of Instruction SRAM  
• 32K Bytes of Data SRAM/Cache  
• 32K Bytes of Data SRAM  
BLACKFIN PROCESSOR CORE  
As shown in Figure 2, each Blackfin core contains two multi-  
plier/accumulators (MACs), two 40-bit ALUs, four video ALUs,  
and a single shifter. The computational units process 8-bit, 16-  
bit, or 32-bit data from the register file.  
• 4K Bytes of Scratchpad SRAM  
ADDRESS ARITHMETIC UNIT  
SP  
FP  
I3  
I2  
I1  
I0  
L3  
L2  
L1  
L0  
B3  
B2  
B1  
B0  
M3  
M2  
M1  
M0  
DAG0  
DAG1  
P5  
P4  
P3  
SEQUENCER  
P2  
P1  
P0  
ALIGN  
DECODE  
R7  
R6  
LOOP BUFFER  
R5  
R4  
16  
16  
8
8
8
8
CONTROL  
UNIT  
R3  
R2  
R1  
R0  
BARREL  
SHIFTER  
40  
40  
A0  
A1  
DATA ARITHMETIC UNIT  
Figure 2. Blackfin Processor Core  
Rev. PrC  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
Each MAC performs a 16-bit by 16-bit multiply in every cycle,  
with an accumulation to a 40-bit result, providing 8 bits of  
extended precision. The ALUs perform a standard set of arith-  
metic and logical operations. With two ALUs capable of  
operating on 16- or 32-bit data, the flexibility of the computa-  
tion units covers the signal processing requirements of a varied  
set of application needs.  
port a limited multi-issue capability, where a 32-bit instruction  
can be issued in parallel with two 16-bit instructions, allowing  
the programmer to use many of the core resources in a single  
instruction cycle.  
The Blackfin assembly language uses an algebraic syntax for  
ease of coding and readability. The architecture has been opti-  
mized for use in conjunction with the VisualDSP C/C++  
compiler, resulting in fast and efficient software  
implementations.  
Each of the two 32-bit input registers can be regarded as two 16-  
bit halves, so each ALU can accomplish very flexible single 16-  
bit arithmetic operations. By viewing the registers as pairs of 16-  
bit operands, dual 16-bit or single 32-bit operations can be  
accomplished in a single cycle. By further taking advantage of  
the second ALU, quad 16-bit operations can be accomplished  
simply, accelerating the per cycle throughput.  
MEMORY ARCHITECTURE  
The ADSP-BF561 views memory as a single unified 4G-byte  
address space, using 32-bit addresses. All resources including  
internal memory, external memory, and I/O control registers  
occupy separate sections of this common address space. The  
memory portions of this address space are arranged in a hierar-  
chical structure to provide a good cost/performance balance of  
some very fast, low-latency memory as cache or SRAM very  
close to the processor, and larger, lower-cost and performance-  
memory systems farther away from the processor. The ADSP-  
BF561 memory map is shown in Figure 3.  
The powerful 40-bit shifter has extensive capabilities for per-  
forming shifting, rotating, normalization, extraction, and  
depositing of data. The data for the computational units is  
found in a multi-ported register file of sixteen 16-bit entries or  
eight 32-bit entries.  
A powerful program sequencer controls the flow of instruction  
execution, including instruction alignment and decoding. The  
sequencer supports conditional jumps and subroutine calls, as  
well as zero-overhead looping. A loop buffer stores instructions  
locally, eliminating instruction memory accesses for tight  
looped code.  
The L1 memory system in each core is the highest-performance  
memory available to each Blackfin core. The L2 memory pro-  
vides additional capacity with lower performance. Lastly, the  
off-chip memory system, accessed through the External Bus  
Interface Unit (EBIU), provides expansion with SDRAM, flash  
memory, and SRAM, optionally accessing more than 768M  
bytes of physical memory. The memory DMA controllers pro-  
vide high-bandwidth data-movement capability. They can  
perform block transfers of code or data between the internal  
L1/L2 memories and the external memory spaces.  
Two data address generators (DAGs) provide addresses for  
simultaneous dual operand fetches from memory. The DAGs  
share a register file containing four sets of 32-bit Index, Modify,  
Length, and Base registers. Eight additional 32-bit registers pro-  
vide pointers for general indexing of variables and stack  
locations.  
Internal (On-chip) Memory  
Blackfin processors support a modified Harvard architecture in  
combination with a hierarchical memory structure. Level 1 (L1)  
memories are those that typically operate at the full processor  
speed with little or no latency. Level 2 (L2) memories are other  
memories, on-chip or off-chip, that may take multiple processor  
cycles to access. At the L1 level, the instruction memory holds  
instructions only. The two data memories hold data, and a dedi-  
cated scratchpad data memory stores stack and local variable  
information. At the L2 level, there is a single unified memory  
space, holding both instructions and data.  
The ADSP-BF561 has four blocks of on-chip memory providing  
high-bandwidth access to the core.  
The first is the L1 instruction memory of each Blackfin core  
consisting of 16K bytes of 4-way set-associative cache memory  
and 16K bytes of SRAM. The cache memory may also be config-  
ured as an SRAM. This memory is accessed at full processor  
speed. When configured as SRAM, each of the two 16K banks of  
memory is broken into 4K sub-banks which can be indepen-  
dently accessed by the processor and DMA.  
In addition, half of L1 instruction memory and half of L1 data  
memories may be configured as either Static RAMs (SRAMs) or  
caches. The Memory Management Unit (MMU) provides mem-  
ory protection for individual tasks that may be operating on the  
core and may protect system registers from unintended access.  
The second on-chip memory block is the L1 data memory of  
each Blackfin core which consists of four banks of 16K bytes  
each. Two of the L1 data memory banks can be configured as  
one way of a two-way set associative cache or as an SRAM. The  
other two banks are configured as SRAM. All banks are accessed  
at full processor speed. When configured as SRAM, each of the  
four 16K banks of memory is broken into 4K sub-banks which  
can be independently accessed by the processor and DMA.  
The architecture provides three modes of operation: User mode,  
Supervisor mode, and Emulation mode. User mode has  
restricted access to certain system resources, thus providing a  
protected software environment, while supervisor mode has  
unrestricted access to the system and core resources.  
The third memory block associated with each core is a 4K-byte  
scratchpad SRAM which runs at the same speed as the L1 mem-  
ories, but is only accessible as data SRAM (it cannot be  
The Blackfin instruction set has been optimized so that 16-bit  
op-codes represent the most frequently used instructions,  
resulting in excellent compiled code density. Complex DSP  
instructions are encoded into 32-bit op-codes, representing fully  
featured multifunction instructions. Blackfin processors sup-  
configured as cache memory and is not accessible via DMA).  
Rev. PrC  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
COREAMEMORYMAP  
COREBMEMORYMAP  
0xFFFF FFFF  
CORE MMR REGISTERS  
CORE MMR REGISTERS  
0xFFE0 0000  
0xFFC0 0000  
0xFFB0 1000  
0xFFB0 0000  
0xFFA1 4000  
0xFFA1 0000  
0xFFA0 4000  
0xFFA0 0000  
0xFF90 8000  
0xFF90 4000  
0xFF90 0000  
0xFF80 8000  
0xFF80 4000  
0xFF80 0000  
SYSTEMMMR REGISTERS  
RESERVED  
L1 SCRATCHPAD SRAM (4K)  
RESERVED  
L1 INSTRUCTION SRAM/CACHE (16K)  
RESERVED  
L1 INSTRUCTION SRAM (16K)  
RESERVED  
RESERVED  
L1 DATA BANK B SRAM/CACHE (16K)  
L1 DATA BANK B SRAM (16K)  
RESERVED  
L1 DATA BANK A SRAM/CACHE (16K)  
L1 DATA BANK A SRAM (16K)  
0xFF80 0000  
0xFF70 1000  
INTERNAL MEMORY  
RESERVED  
L1 SCRATCHPAD SRAM(4K)  
RESERVED  
0xFF70 0000  
0xFF61 4000  
L1 INSTRUCTION SRAM/CACHE (16K)  
RESERVED  
0xFF61 0000  
0xFF60 4000  
L1 INSTRUCTION SRAM(16K)  
RESERVED  
RESERVED  
0xFF60 0000  
0xFF50 8000  
L1 DATA BANK B SRAM/CACHE (16K)  
L1 DATA BANK B SRAM (16K)  
RESERVED  
0xFF50 4000  
0xFF50 0000  
0xFF40 8000  
0xFF40 4000  
0xFF40 0000  
L1 DATA BANK A SRAM/CACHE (16K)  
L1 DATA BANK A SRAM (16K)  
RESERVED  
0xFEB2 0000  
L2 SRAM(128K)  
RESERVED  
0xFEB0 0000  
0xEF00 4000  
0xEF00 0000  
BOOT ROM  
RESERVED  
0x3000 0000  
0x2C00 0000  
ASYNC MEMORY BANK 3  
ASYNC MEMORY BANK 2  
ASYNC MEMORY BANK 1  
ASYNC MEMORY BANK 0  
0x2800 0000  
EXTERNAL MEMORY  
0x2400 0000  
0x2000 0000  
RESERVED  
SDRAM BANK 3  
SDRAM BANK 2  
TopoflastSDRAMpage  
SDRAM BANK 1  
SDRAM BANK 0  
0x0000 0000  
Figure 3. Memory Map  
The fourth on-chip memory system is the L2 SRAM memory  
array which provides 128K bytes of high speed SRAM operating  
at one half the bandwidth of the core, and slightly longer latency  
than the L1 memory banks. The L2 memory is a unified instruc-  
tion and data memory and can hold any mixture of code and  
data required by the system design. The Blackfin cores share a  
dedicated low-latency 64-bit wide data path port into the L2  
SRAM memory.  
(SDRAM) as well as up to four banks of asynchronous memory  
devices including flash, EPROM, ROM, SRAM, and memory  
mapped I/O devices.  
The PC133-compliant SDRAM controller can be programmed  
to interface to up to four banks of SDRAM, with each bank con-  
taining between 16M bytes and 128M bytes providing access to  
up to 512M bytes of SDRAM. Each bank is independently pro-  
grammable and is contiguous with adjacent banks regardless of  
the sizes of the different banks or their placement. This allows  
flexible configuration and upgradability of system memory  
while allowing the core to view all SDRAM as a single, contigu-  
ous, physical address space.  
Each Blackfin core processor has its own set of core Memory  
Mapped Registers (MMRs) but share the same system MMR  
registers and 128 KB L2 SRAM memory.  
External (Off-Chip) Memory  
The asynchronous memory controller can also be programmed  
to control up to four banks of devices with very flexible timing  
parameters for a wide variety of devices. Each bank occupies a  
The ADSP-BF561 external memory is accessed via the External  
Bus Interface Unit (EBIU). This interface provides a glueless  
connection to up to four banks of synchronous DRAM  
Rev. PrC  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
64M-byte segment regardless of the size of the devices used so  
that these banks will only be contiguous if fully populated with  
64M bytes of memory.  
The ADSP-BF561 event controller consists of two stages, the  
Core Event Controller (CEC) and the System Interrupt Control-  
ler (SIC). The Core Event Controller works with the System  
Interrupt Controller to prioritize and control all system events.  
Conceptually, interrupts from the peripherals enter into the  
SIC, and are then routed directly into the general-purpose inter-  
rupts of the CEC.  
I/O Memory Space  
Blackfin processors do not define a separate I/O space. All  
resources are mapped through the flat 32-bit address space. On-  
chip I/O devices have their control registers mapped into mem-  
ory-mapped registers (MMRs) at addresses near the top of the  
4G-byte address space. These are separated into two smaller  
blocks, one which contains the control MMRs for all core func-  
tions, and the other which contains the registers needed for  
setup and control of the on-chip peripherals outside of the core.  
The core MMRs are accessible only by the core and only in  
supervisor mode and appear as reserved space by on-chip  
peripherals. The system MMRs are accessible by the core in  
supervisor mode and can be mapped as either visible or reserved  
to other devices, depending on the system protection model  
desired.  
Core Event Controller (CEC)  
The CEC supports nine general-purpose interrupts (IVG15–7),  
in addition to the dedicated interrupt and exception events. Of  
these general-purpose interrupts, the two lowest-priority inter-  
rupts (IVG15–14) are recommended to be reserved for software  
interrupt handlers, leaving seven prioritized interrupt inputs to  
support the peripherals of the ADSP-BF561. Table 1 describes  
the inputs to the CEC, identifies their names in the Event Vector  
Table (EVT), and lists their priorities.  
Table 1. Core Event Controller (CEC)  
Booting  
Priority  
Event Class  
EVT Entry  
(0 is Highest)  
The ADSP-BF561 contains a small boot kernel, which config-  
ures the appropriate peripheral for booting. If the ADSP-BF561  
is configured to boot from boot ROM memory space, the pro-  
cessor starts executing from the on-chip boot ROM.  
0
Emulation/Test  
Reset  
EMU  
RST  
1
2
Non-Maskable  
NMI  
3
Exceptions  
EVX  
Event Handling  
4
Global Enable  
-
The event controller on the ADSP-BF561 handles all asynchro-  
nous and synchronous events to the processor. The ADSP-  
BF561 provides event handling that supports both nesting and  
prioritization. Nesting allows multiple event service routines to  
be active simultaneously. Prioritization ensures that servicing of  
a higher-priority event takes precedence over servicing of a  
lower-priority event. The controller provides support for five  
different types of events:  
5
Hardware Error  
Core Timer  
IVHW  
IVTMR  
IVG7  
IVG8  
IVG9  
IVG10  
IVG11  
IVG12  
IVG13  
IVG14  
IVG15  
6
7
General Interrupt 7  
General Interrupt 8  
General Interrupt 9  
General Interrupt 10  
General Interrupt 11  
General Interrupt 12  
General Interrupt 13  
General Interrupt 14  
General Interrupt 15  
8
9
10  
11  
12  
13  
14  
15  
• Emulation – An emulation event causes the processor to  
enter emulation mode, allowing command and control of  
the processor via the JTAG interface.  
• Reset – This event resets the processor.  
• Non-Maskable Interrupt (NMI) – The NMI event can be  
generated by the software watchdog timer or by the NMI  
input signal to the processor. The NMI event is frequently  
used as a power-down indicator to initiate an orderly shut  
down of the system.  
System Interrupt Controller (SIC)  
The System Interrupt Controller provides the mapping and  
routing of events from the many peripheral interrupt sources, to  
the prioritized general-purpose interrupt inputs of the CEC.  
Although the ADSP-BF561 provides a default mapping, the user  
can alter the mappings and priorities of interrupt events by writ-  
ing the appropriate values into the Interrupt Assignment  
Registers (IAR). Table 2 describes the inputs into the SIC and  
the default mappings into the CEC.  
• Exceptions – Events that occur synchronously to program  
flow, i.e., the exception will be taken before the instruction  
is allowed to complete. Conditions such as data alignment  
violations, undefined instructions, etc. cause exceptions.  
• Interrupts – Events that occur asynchronously to program  
flow. They are caused by timers, peripherals, input pins,  
and an explicit software instruction.  
Each event has an associated register to hold the return address  
and an associated return-from-event instruction. When an  
event is triggered, the state of the processor is saved on the  
supervisor stack.  
Rev. PrC  
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Preliminary Technical Data  
ADSP-BF561  
Table 2. Peripheral Interrupt Source Reset State  
Table 2. Peripheral Interrupt Source Reset State (Continued)  
Peripheral Interrupt Source  
PLL wakeup  
Chan1 IVG2  
Peripheral Interrupt Source  
Timer11 interrupt  
Chan1 IVG2  
0
IVG07  
IVG07  
IVG07  
IVG07  
IVG07  
IVG07  
IVG07  
IVG07  
IVG07  
IVG07  
IVG07  
IVG08  
IVG08  
IVG08  
IVG08  
IVG08  
IVG08  
IVG08  
IVG08  
IVG08  
IVG08  
IVG08  
IVG08  
IVG09  
IVG09  
IVG09  
IVG09  
IVG09  
IVG09  
IVG09  
IVG09  
IVG09  
IVG09  
IVG09  
IVG09  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
IVG10  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG08  
IVG08  
IVG09  
IVG09  
IVG12  
IVG12  
IVG13  
IVG07  
IVG07  
IVG07  
IVG07  
DMA1 Error  
1
FIO0 interrupt A  
DMA2 Error  
2
FIO0 interrupt B  
IMDMA Error  
3
FIO1 interrupt A  
PPI1 Error  
4
FIO1 interrupt B  
PPI2 Error  
5
FIO2 interrupt A  
SPORT0 Error  
6
FIO2 interrupt B  
SPORT1 Error  
7
DMA1 write/read 0 interrupt  
DMA1 write/read1 interrupt  
DMA2 write/read 0 interrupt  
DMA2 write/read 1 interrupt  
IMDMA write/read 0 interrupt  
IMDMA write/read 1 interrupt  
Watchdog Timer  
SPI Error  
8
UART Error  
9
Reserved  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
DMA1 0 interrupt  
DMA1 1 interrupt  
DMA1 2 interrupt  
DMA1 3 interrupt  
DMA1 4 interrupt  
DMA1 5 interrupt  
DMA1 6 interrupt  
DMA1 7 interrupt  
DMA1 8 interrupt  
DMA1 9 interrupt  
DMA1 10 interrupt  
DMA1 11 interrupt  
DMA2 0 interrupt  
DMA2 1 interrupt  
DMA2 2 interrupt  
DMA2 3 interrupt  
DMA2 4 interrupt  
DMA2 5 interrupt  
DMA2 6 interrupt  
DMA2 7 interrupt  
DMA2 8 interrupt  
DMA2 9 interrupt  
DMA2 10 interrupt  
DMA2 11 interrupt  
Timer0 interrupt  
Timer1 interrupt  
Timer2 interrupt  
Timer3 interrupt  
Timer4 interrupt  
Timer5 interrupt  
Timer6 interrupt  
Timer7 interrupt  
Timer8 interrupt  
Timer9 interrupt  
Timer10 interrupt  
Reserved  
Reserved  
Supplemental 0  
Supplemental 1  
1 Peripheral Interrupt Channel Number  
2 Default User IVG Interrupt  
Event Control  
The ADSP-BF561 provides the user with a very flexible mecha-  
nism to control the processing of events. In the CEC, three  
registers are used to coordinate and control events. Each of the  
registers, as follows, is 16-bits wide, while each bit represents a  
particular event class:  
• CEC Interrupt Latch Register (ILAT) – The ILAT register  
indicates when events have been latched. The appropriate  
bit is set when the processor has latched the event and  
cleared when the event has been accepted into the system.  
This register is updated automatically by the controller, but  
may be written only when its corresponding IMASK bit is  
cleared.  
• CEC Interrupt Mask Register (IMASK) – The IMASK reg-  
ister controls the masking and unmasking of individual  
events. When a bit is set in the IMASK register, that event is  
unmasked and will be processed by the CEC when asserted.  
A cleared bit in the IMASK register masks the event  
thereby preventing the processor from servicing the event  
even though the event may be latched in the ILAT register.  
This register may be read from or written to while in super-  
visor mode. (Note that general-purpose interrupts can be  
globally enabled and disabled with the STI and CLI instruc-  
tions, respectively.)  
• CEC Interrupt Pending Register (IPEND) – The IPEND  
register keeps track of all nested events. A set bit in the  
IPEND register indicates the event is currently active or  
nested at some level. This register is updated automatically  
by the controller but may be read while in supervisor mode.  
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ADSP-BF561  
Preliminary Technical Data  
The SIC allows further control of event processing by providing  
six 32-bit interrupt control and status registers. Each register  
contains a bit corresponding to each of the peripheral interrupt  
events shown in Table 2.  
The 2D DMA capability supports arbitrary row and column  
sizes up to 64K elements by 64K elements, and arbitrary row  
and column step sizes up to +/- 32K elements. Furthermore, the  
column step size can be less than the row step size, allowing  
implementation of interleaved data streams. This feature is  
especially useful in video applications where data can be de-  
interleaved on the fly.  
• SIC Interrupt Mask Register (SIC_IMASK0, SIC_IMASK1)  
– This register controls the masking and unmasking of  
each peripheral interrupt event. When a bit is set in the reg-  
ister, that peripheral event is unmasked and will be  
processed by the system when asserted. A cleared bit in the  
register masks the peripheral event thereby preventing the  
processor from servicing the event.  
Examples of DMA types supported by the ADSP-BF561 DMA  
controllers include:  
• A single, linear buffer that stops upon completion  
• A circular, auto-refreshing buffer that interrupts on each  
full or fractionally full buffer  
• SIC Interrupt Status Register (SIC_ISTAT0, SIC_ISTAT1)  
– As multiple peripherals can be mapped to a single event,  
this register allows the software to determine which periph-  
eral event source triggered the interrupt. A set bit indicates  
the peripheral is asserting the interrupt, a cleared bit indi-  
cates the peripheral is not asserting the event.  
• 1-D or 2-D DMA using a linked list of descriptors  
• 2-D DMA using an array of descriptors, specifying only the  
base DMA address within a common page  
In addition to the dedicated peripheral DMA channels, each  
DMA Controller has four memory DMA channels provided for  
transfers between the various memories of the ADSP-BF561  
system. These enable transfers of blocks of data between any of  
the memories—including external SDRAM, ROM, SRAM, and  
flash memory—with minimal processor intervention. Memory  
DMA transfers can be controlled by a very flexible descriptor-  
based methodology or by a standard register-based autobuffer  
mechanism.  
• SIC Interrupt Wakeup Enable Register (SIC_IWR0,  
SIC_IWR1)– By enabling the corresponding bit in this reg-  
ister, each peripheral can be configured to wake up the  
processor, should the processor be in a powered down  
mode when the event is generated. (For more information,  
see Dynamic Power Management on Page 11.)  
Because multiple interrupt sources can map to a single general-  
purpose interrupt, multiple pulse assertions can occur simulta-  
neously, before or during interrupt processing for an interrupt  
event already detected on this interrupt input. The IPEND reg-  
ister contents are monitored by the SIC as the interrupt  
acknowledgement.  
Further, the ADSP-BF561 has a four channel Internal Memory  
DMA (IMDMA) Controller. The IMDMA Controller allows  
data transfers between any of the internal L1 and L2 memories.  
WATCHDOG TIMERS  
The appropriate ILAT register bit is set when an interrupt rising  
edge is detected (detection requires two core clock cycles). The  
bit is cleared when the respective IPEND register bit is set. The  
IPEND bit indicates that the event has entered into the proces-  
sor pipeline. At this point the CEC will recognize and queue the  
next rising edge event on the corresponding event input. The  
minimum latency from the rising edge transition of the general-  
purpose interrupt to the IPEND output asserted is three core  
clock cycles; however, the latency can be much higher, depend-  
ing on the activity within and the mode of the processor.  
Each ADSP-BF561 core includes a 32-bit timer, which can be  
used to implement a software watchdog function. A software  
watchdog can improve system availability by forcing the proces-  
sor to a known state, via generation of a hardware reset, non-  
maskable interrupt (NMI), or general- purpose interrupt, if the  
timer expires before being reset by software. The programmer  
initializes the count value of the timer, enables the appropriate  
interrupt, then enables the timer. Thereafter, the software must  
reload the counter before it counts to zero from the pro-  
grammed value. This protects the system from remaining in an  
unknown state where software, which would normally reset the  
timer, has stopped running due to an external noise condition  
or software error.  
DMA CONTROLLERS  
The ADSP-BF561 has multiple, independent DMA controllers  
that support automated data transfers with minimal overhead  
for the DSP core. DMA transfers can occur between the ADSP-  
BF561's internal memories and any of its DMA-capable periph-  
erals. Additionally, DMA transfers can be accomplished  
between any of the DMA-capable peripherals and external  
devices connected to the external memory interfaces, including  
the SDRAM controller and the asynchronous memory control-  
ler. DMA-capable peripherals include the SPORTs, SPI port,  
UART, and PPI. Each individual DMA-capable peripheral has  
at least one dedicated DMA channel.  
After a reset, software can determine if the watchdog was the  
source of the hardware reset by interrogating a status bit in the  
timer control register, which is set only upon a watchdog gener-  
ated reset.  
The timer is clocked by the system clock (SCLK), at a maximum  
frequency of SCLK.  
The ADSP-BF561 DMA controllers support both 1-dimen-  
sional (1D) and 2-dimensional (2D) DMA transfers. DMA  
transfer initialization can be implemented from registers or  
from sets of parameters called descriptor blocks.  
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Preliminary Technical Data  
ADSP-BF561  
provide a full duplex, synchronous serial interface, which sup-  
ports both master and slave modes and multimaster  
environments.  
SERIAL PORTS (SPORTS)  
The ADSP-BF561 incorporates two dual-channel synchronous  
serial ports (SPORT0 and SPORT1) for serial and multiproces-  
sor communications. The SPORTs support the following  
features:  
Each SPI port’s baud rate and clock phase/polarities are pro-  
grammable (see SPI Clock Rate equation), and each has an  
integrated DMA controller, configurable to support transmit or  
receive data streams. The SPI’s DMA controller can only service  
unidirectional accesses at any given time.  
• I2S capable operation.  
• Bidirectional operation – Each SPORT has two sets of inde-  
pendent transmit and receive pins, enabling eight channels  
of I2S stereo audio.  
fSCLK  
SPI Clock Rate = ----------------------------------  
2 × SPIBAUD  
• Buffered (8-deep) transmit and receive ports – Each port  
has a data register for transferring data words to and from  
other DSP components and shift registers for shifting data  
in and out of the data registers.  
During transfers, the SPI ports simultaneously transmit and  
receive by serially shifting data in and out on their two serial  
data lines. The serial clock line synchronizes the shifting and  
sampling of data on the two serial data lines.  
• Clocking – Each transmit and receive port can either use an  
external serial clock or generate its own, in frequencies  
ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz.  
UART PORT  
• Word length – Each SPORT supports serial data words  
from 3 to 32 bits in length, transferred most-significant-bit  
first or least-significant-bit first.  
The ADSP-BF561 provides a full duplex Universal Asynchro-  
nous Receiver/Transmitter (UART) ports (UART0 and  
UART1) fully compatible with PC-standard UARTs. The UART  
ports provide a simplified UART interface to other peripherals  
or hosts, supporting full duplex, DMA supported, asynchronous  
transfers of serial data. Each UART port includes support for 5  
to 8 data bits; 1 or 2 stop bits; and none, even, or odd parity. The  
UART ports support two modes of operation, as follows:  
• Framing – Each transmit and receive port can run with or  
without frame sync signals for each data word. Frame sync  
signals can be generated internally or externally, active high  
or low, and with either of two pulsewidths and early or late  
frame sync.  
• Companding in hardware – Each SPORT can perform  
A-law or µ-law companding according to ITU recommen-  
dation G.711. Companding can be selected on the transmit  
and/or receive channel of the SPORT without additional  
latencies.  
• PIO (Programmed I/O) – The processor sends or receives  
data by writing or reading I/O-mapped UATX or UARX  
registers, respectively. The data is double-buffered on both  
transmit and receive.  
• DMA (Direct Memory Access) – The DMA controller  
transfers both transmit and receive data. This reduces the  
number and frequency of interrupts required to transfer  
data to and from memory. Each UART has two dedicated  
DMA channels, one for transmit and one for receive. These  
DMA channels have lower priority than most DMA chan-  
nels because of their relatively low service rates.  
• DMA operations with single-cycle overhead – Each SPORT  
can automatically receive and transmit multiple buffers of  
memory data. The DSP can link or chain sequences of  
DMA transfers between a SPORT and memory.  
• Interrupts – Each transmit and receive port generates an  
interrupt upon completing the transfer of a data word or  
after transferring an entire data buffer or buffers through  
DMA.  
Each UART port’s baud rate (see UART Clock Rate equation),  
serial data format, error code generation and status, and inter-  
rupts are programmable. In the UART Clock Rate equation, the  
divisor (D) can be 1 to 65536.  
• Multichannel capability – Each SPORT supports 128 chan-  
nels out of a 1024-channel window and is compatible with  
the H.100, H.110, MVIP-90, and HMVIP standards.  
fSCLK  
UART Clock Rate = ---------------  
16 × D  
SERIAL PERIPHERAL INTERFACE (SPI) PORTS  
The ADSP-BF561 has one SPI-compatible ports that enable the  
processor to communicate with multiple SPI-compatible  
devices.  
The UART programmable features include:  
• Supporting bit rates ranging from (fSCLK/ 1048576) to  
(fSCLK/16) bits per second.  
The SPI interface uses three pins for transferring data: two data  
pins (Master Output-Slave Input, MOSIx, and Master Input-  
Slave Output, MISO) and a clock pin (Serial Clock, SCK). One  
SPI chip select input pin (SPISS) let other SPI devices select the  
DSP, and seven SPI chip select output pins (SPISEL7–1) let the  
DSP select other SPI devices. The SPI select pins are reconfig-  
ured Programmable Flag pins. Using these pins, the SPI ports  
• Supporting data formats from 7 to12 bits per frame.  
• Both transmit and receive operations can be configured to  
generate maskable interrupts to the processor.  
In conjunction with the general-purpose timer functions, auto-  
baud detection is supported.  
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ADSP-BF561  
Preliminary Technical Data  
The capabilities of UART0 are further extended with support  
for the InfraRed Data Association (IrDA®) Serial InfraRed Phys-  
ical Layer Link Specification (SIR) protocol.  
addition to the twelve general-purpose programmable timers,  
another timer is also provided for each core. These extra timers  
are clocked by the internal processor clock (CCLK) and is typi-  
cally used as a system tick clock for generation of operating  
system periodic interrupts.  
PROGRAMMABLE FLAGS (PFX)  
The ADSP-BF561 has 48 bi-directional, general-purpose I/O,  
Programmable Flag (PF47–0) pins. The Programmable Flag  
pins have special functions for SPI port operation. Each pro-  
grammable flag can be individually controlled as follows by  
manipulation of the flag control, status, and interrupt registers:  
PARALLEL PERIPHERAL INTERFACE  
The processor provides two Parallel Peripheral Interfaces (PPI)  
that can connect directly to parallel A/D and D/A converters,  
ITU-R-601/656 video encoders and decoders, and other general  
purpose peripherals. Each PPI consists of a dedicated input  
clock pin, up to 3 frame synchronization pins, and up to 16 data  
pins.  
• Flag Direction Control Register – Specifies the direction of  
each individual PFx pin as input or output.  
• Flag Control and Status Registers – Rather than forcing the  
software to use a read-modify-write process to control the  
setting of individual flags, the ADSP-BF561 employs a  
"write one to set" and "write one to clear" mechanism that  
allows any combination of individual flags to be set or  
cleared in a single instruction, without affecting the level of  
any other flags. Two control registers are provided, one  
register is written to in order to set flag values while  
another register is written to in order to clear flag values.  
Reading the flag status register allows software to interro-  
gate the sense of the flags.  
In ITU-R 656 mode, the PPI receives and parses a data stream of  
8- bit or 10-bit data elements. On-chip decode of embedded  
preamble control and synchronization information is  
supported.  
General Purpose Mode Descriptions  
The general-purpose modes of the PPI are intended to suit a  
wide variety of data capture and transmission applications. The  
modes are divided into four main categories, each allowing up  
to 16 bits of data transfer per PPI_CLK cycle:  
• Data Receive with Internally Generated Frame Syncs.  
• Data Receive with Externally Generated Frame Syncs.  
• Data Transmit with Internally Generated Frame Syncs.  
• Data Transmit with Externally Generated Frame Syncs.  
• Flag Interrupt Mask Registers – The Flag Interrupt Mask  
Registers allow each individual PFx pin to function as an  
interrupt to the processor. Similar to the Flag Control Reg-  
isters that are used to set and clear individual flag values,  
one Flag Interrupt Mask Register sets bits to enable inter-  
rupt function, and the other Flag Interrupt Mask register  
clears bits to disable interrupt function. PFx pins defined as  
inputs can be configured to generate hardware interrupts,  
while output PFx pins can be configured to generate soft-  
ware interrupts.  
Input Mode  
These modes support ADC/DAC connections, as well as video  
communication with hardware signaling. Many of the modes  
support more than one level of frame synchronization. If  
desired, a programmable delay can be inserted between asser-  
tion of a frame sync and reception / transmission of data.  
• Flag Interrupt Sensitivity Registers – The Flag Interrupt  
Sensitivity Registers specify whether individual PFx pins  
are level- or edge-sensitive and specify-if edge-sensitive-  
whether just the rising edge or both the rising and falling  
edges of the signal are significant. One register selects the  
type of sensitivity, and one register selects which edges are  
significant for edge-sensitivity.  
ITU -R 656 Mode Descriptions  
Three distinct ITU-R 656 modes are supported:  
• Active Video Only Mode  
• Vertical Blanking Only Mode  
• Entire Field Mode  
TIMERS  
There are fourteen (14) programmable timer units in the ADSP-  
BF561. Twelve general-purpose timers have an external pin that  
can be configured either as a Pulse Width Modulator (PWM) or  
timer output, as an input to lock the timer, or for measuring  
pulse widths of external events. Each of the twelve general-pur-  
pose timer units can be independently programmed as a PWM,  
internally or externally clocked timer, or pulse width counter.  
The general-purpose timer units can be used in conjunction  
with the UART to measure the width of the pulses in the data  
stream to provide an auto-baud detect function for a serial  
channel.  
Active Video Only Mode  
In this mode, the PPI does not read in any data between the End  
of Active Video (EAV) and Start of Active Video (SAV) pream-  
ble symbols, or any data present during the vertical blanking  
intervals. In this mode, the control byte sequences are not stored  
to memory; they are filtered by the PPI.  
Vertical Blanking Interval Mode  
In this mode, the PPI only transfers vertical blanking interval  
(VBI) data, as well as horizontal blanking information and con-  
trol byte sequences on VBI lines.  
The general-purpose timers can generate interrupts to the pro-  
cessor core providing periodic events for synchronization,  
either to the processor clock or to a count of external signals. In  
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Preliminary Technical Data  
ADSP-BF561  
Table 3. Power Settings (Continued)  
Entire Field Mode  
In this mode, the entire incoming bitstream is read in through  
the PPI. This includes active video, control preamble sequences,  
and ancillary data that may be embedded in horizontal and ver-  
tical blanking intervals.  
Mode  
PLL  
PLL  
Bypassed Clock  
(CCLK) (SCLK)  
Core  
System Core  
Clock  
Power  
Sleep  
Enabled  
Disabled Enabled On  
Disabled Disabled On  
Disabled Disabled Off  
Though not explicitly supported, ITU,-656 output functionality  
can be achieved by setting up the entire frame structure (includ-  
ing active video, blanking and control information) in memory  
and streaming the data out of the PPI in a frame sync-less mode.  
The processor’s 2D DMA features facilitate this transfer by  
allowing the static frame buffer (blanking and control codes) to  
be placed in memory once, and simply updating the active video  
information on per-frame basis.  
Deep Sleep Disabled –  
Hibernate Disabled –  
Hibernate Operating Mode—Maximum Static Power  
Savings  
The Hibernate mode maximizes static power savings by dis-  
abling the voltage and clocks to the processor core (CCLK) and  
to all the synchronous peripherals (SCLK). The internal voltage  
regulator for the processor can be shut off by writing b#00 to the  
FREQ bits of the VR_CTL register. This disables both CCLK  
and SCLK. Furthermore, it sets the internal power supply volt-  
age (VDDINT) to 0 V to provide the lowest static power  
dissipation. Any critical information stored internally (memory  
contents, register contents, etc.) must be written to a non-vola-  
tile storage device prior to removing power if the processor state  
is to be preserved. Since VDDEXT is still supplied in this mode, all  
of the external pins tri-state, unless otherwise specified. This  
allows other devices that may be connected to the processor to  
have power still applied without drawing unwanted current.  
The internal supply regulator can be woken up by asserting the  
RESET pin.  
These modes support ADC/DAC connections, as well as video  
communication with hardware signaling. Many of the modes  
support more than one level of frame synchronization. If  
desired, a programmable delay can be inserted between asser-  
tion of a frame sync and reception/transmission of data.  
DYNAMIC POWER MANAGEMENT  
The ADSP-BF561 provides four operating modes, each with a  
different performance/power profile. In addition, Dynamic  
Power Management provides the control functions to dynami-  
cally alter the processor core supply voltage, further reducing  
power dissipation. Control of clocking to each of the ADSP-  
BF561 peripherals also reduces power consumption. See Table 3  
for a summary of the power settings for each mode.  
Sleep Operating Mode—High Dynamic Power Savings  
Full-On Operating Mode – Maximum Performance  
The Sleep mode reduces power dissipation by disabling the  
clock to the processor core (CCLK). The PLL and system clock  
(SCLK), however, continue to operate in this mode. Typically an  
external event will wake up the processor. When in the Sleep  
mode, assertion of wakeup will cause the processor to sense the  
value of the BYPASS bit in the PLL Control register (PLL_CTL).  
In the Full-On mode, the PLL is enabled and is not bypassed,  
providing capability for maximum operational frequency. This  
is the default execution state in which maximum performance  
can be achieved. The processor cores and all enabled peripherals  
run at full speed.  
Active Operating Mode – Moderate Power Savings  
When in the Sleep mode, system DMA access to L1 memory is  
not supported.  
In the Active mode, the PLL is enabled but bypassed. Because  
the PLL is bypassed, the processor’s core clock (CCLK) and sys-  
tem clock (SCLK) run at the input clock (CLKIN) frequency. In  
this mode, the CLKIN to CCLK multiplier ratio can be changed,  
although the changes are not realized until the Full-On mode is  
entered. DMA access is available to appropriately configured L1  
memories.  
Deep Sleep Operating Mode—Maximum Dynamic Power  
Savings  
The Deep Sleep mode maximizes power savings by disabling the  
clocks to the processor cores (CCLK) and to all synchronous  
peripherals (SCLK). Asynchronous peripherals will not be able  
to access internal resources or external memory. This powered-  
down mode can only be exited by assertion of the reset interrupt  
(RESET). If BYPASS is disabled, the processor will transition to  
the Full On mode. If BYPASS is enabled, the processor will tran-  
sition to the Active mode.  
In the Active mode, it is possible to disable the PLL through the  
PLL Control register (PLL_CTL). If disabled, the PLL must be  
re-enabled before transitioning to the Full-On or Sleep modes.  
Table 3. Power Settings  
Power Savings  
Mode  
PLL  
PLL  
Core  
System Core  
Clock Power  
Bypassed Clock  
As shown in Table 4, the ADSP-BF561 supports two different  
power domains. The use of multiple power domains maximizes  
flexibility, while maintaining compliance with industry stan-  
dards and conventions. By isolating the internal logic of the  
ADSP-BF561 into its own power domain, separate from the I/O,  
(CCLK) (SCLK)  
Full On  
Active  
Enabled No  
Enabled Enabled On  
Enabled Enabled On  
Enabled/ Yes  
Disabled  
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ADSP-BF561  
Preliminary Technical Data  
the processor can take advantage of Dynamic Power Manage-  
ment, without affecting the I/O devices. There are no  
sequencing requirements for the various power domains.  
The Power Savings Factor is calculated as:  
Power Savings Factor  
2
Table 4. ADSP-BF561 Power Domains  
fCCLKRED  
---------------------  
fCCLKNOM  
VDDINTRED  
VDDINTNOM  
TRED  
------------  
TNOM  
--------------------------  
=
×
×
Power Domain  
All internal logic  
I/O  
VDD Range  
VDDINT  
VDDEXT  
where the variables in the equations are:  
• fCCLKNOM is the nominal core clock frequency  
• fCCLKRED is the reduced core clock frequency  
• VDDINTNOM is the nominal internal supply voltage  
• VDDINTRED is the reduced internal supply voltage  
• TNOM is the duration running at fCCLKNOM  
• TRED is the duration running at fCCLKRED  
The percent power savings is calculated as:  
The power dissipated by a processor is largely a function of the  
clock frequency of the processor and the square of the operating  
voltage. For example, reducing the clock frequency by 25%  
results in a 25% reduction in dynamic power dissipation, while  
reducing the voltage by 25% reduces dynamic power dissipation  
by more than 40%. Further, these power savings are additive, in  
that if the clock frequency and supply voltage are both reduced,  
the power savings can be dramatic.  
The Dynamic Power Management feature of the ADSP-BF561  
allows both the processor’s input voltage (VDDINT) and clock  
frequency (fCCLK) to be dynamically controlled.  
% Power Savings = (1 – Power Savings Factor) × 100%  
The savings in power dissipation can be modeled using the  
Power Savings Factor and % Power Savings calculations.  
VOLTAGE REGULATION  
The ADSP-BF561 processor provides an on-chip voltage regula-  
tor that can generate processor core voltage levels 0.85V(-5% /  
+10%) to 1.2V(-5% / +10%) from an external 2.25 V to 3.6 V  
supply. Figure 4 shows the typical external components  
required to complete the power management system. The regu-  
lator controls the internal logic voltage levels and is  
programmable with the Voltage Regulator Control Register  
(VR_CTL) in increments of 50 mV. To reduce standby power  
consumption, the internal voltage regulator can be programmed  
to remove power to the processor core while keeping I/O power  
(VDDEXT) supplied. While in hibernation, VDDEXT can still be  
applied, eliminating the need for external buffers. The voltage  
regulator can be activated from this powerdown state by assert-  
ing RESET, which will then initiate a boot sequence. The  
regulator can also be disabled and bypassed at the user’s  
discretion.  
Figure 4. Voltage Regulator Circuit  
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Preliminary Technical Data  
ADSP-BF561  
into the SSEL fields define a divide ratio between the PLL output  
(VCO) and the system clock. SCLK divider values are 1 through  
15. Table 5 illustrates typical system clock ratios:  
CLOCK SIGNALS  
The ADSP-BF561 can be clocked by an external crystal, a sine  
wave input, or a buffered, shaped clock derived from an external  
clock oscillator.  
Table 5. Example System Clock Ratios  
If an external clock is used, it should be a TTL compatible signal  
and must not be halted, changed, or operated below the speci-  
fied frequency during normal operation. This signal is  
connected to the processor’s CLKIN pin. When an external  
clock is used, the XTAL pin must be left unconnected.  
Signal Name Divider Ratio Example Frequency Ratios  
SSEL[3–0]  
VCO/SCLK  
(MHz)  
VCO  
100  
SCLK  
100  
50  
0001  
0110  
1010  
1:1  
Alternatively, because the ADSP-BF561 includes an on-chip  
oscillator circuit, an external crystal may be used. The crystal  
should be connected across the CLKIN and XTAL pins, with  
two capacitors connected as shown in Figure 5  
6:1  
300  
10:1  
500  
50  
The maximum frequency of the system clock is fSCLK. Note that  
the divisor ratio must be chosen to limit the system clock fre-  
quency to its maximum of fSCLK. The SSEL value can be changed  
dynamically without any PLL lock latencies by writing the  
appropriate values to the PLL divisor register (PLL_DIV).  
Capacitor values are dependent on crystal type and should be  
specified by the crystal manufacturer. A parallel-resonant, fun-  
damental frequency, microprocessor-grade crystal should be  
used.  
The core clock (CCLK) frequency can also be dynamically  
changed by means of the CSEL[1–0] bits of the PLL_DIV regis-  
ter. Supported CCLK divider ratios are 1, 2, 4, and 8, as shown  
in Table 6. This programmable core clock capability is useful for  
fast core frequency modifications.  
XTAL  
CLKOUT  
CLKIN  
Table 6. Core Clock Ratios  
Signal Name Divider Ratio Example Frequency Ratios  
CSEL[1–0]  
VCO/CCLK  
VCO  
500  
500  
200  
200  
CCLK  
500  
250  
50  
Figure 5. External Crystal Connections  
00  
01  
10  
11  
1:1  
2:1  
4:1  
8:1  
As shown in Figure 6, the core clock (CCLK) and system  
peripheral clock (SCLK) are derived from the input clock  
(CLKIN) signal. An on-chip PLL is capable of multiplying the  
CLKIN signal by a user programmable 1x to 63x multiplication  
factor. The default multiplier is 10x, but it can be modified by a  
software instruction sequence. On-the-fly frequency changes  
can be effected by simply writing to the PLL_DIV register.  
25  
BOOTING MODES  
The ADSP-BF561 has three mechanisms (listed in Table 7) for  
automatically loading internal L1 instruction memory after a  
reset. A fourth mode is provided to execute from external mem-  
ory, bypassing the boot sequence.  
“FINE” ADJUSTMENT  
COARSE” ADJUSTMENT  
ON-THE-FLY  
REQUIRES PLL SEQUENCING  
Table 7. Booting Modes  
BMODE1–0  
Description  
CCLK  
SCLK  
× 1, 2, 4, 8  
× 1:15  
00  
Executefrom16-bitexternalmemory(Bypass  
Boot ROM)  
PLL  
1× - 63×  
CLKIN  
VCO  
01  
10  
11  
Boot from 8/16-bit flash  
Reserved  
Boot from SPI serial ROM (16-bit address  
range)  
SCLK CCLK  
SCLK 133 MHZ  
Figure 6. Frequency Modification Methods  
All on-chip peripherals are clocked by the system clock (SCLK).  
The system clock frequency is programmable by means of the  
SSEL3–0 bits of the PLL_DIV register. The values programmed  
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ADSP-BF561  
Preliminary Technical Data  
The BMODE pins of the Reset Configuration Register, sampled  
during power-on resets and software-initiated resets, imple-  
ment the following modes:  
• All registers, I/O, and memory are mapped into a unified  
4G-byte memory space providing a simplified program-  
ming model.  
• Execute from 16-bit external memory - Execution starts  
from address 0x2000 0000 with 16-bit packing. The boot  
ROM is bypassed in this mode. All configuration settings  
are set for the slowest device possible (3-cycle hold time,  
15-cycle R/W access times, 4-cycle setup).  
• Microcontroller features, such as arbitrary bit and bit-field  
manipulation, insertion, and extraction; integer operations  
on 8-, 16-, and 32-bit data-types; and separate user and ker-  
nel stack pointers.  
• Code density enhancements, which include intermixing of  
16- and 32-bit instructions (no mode switching, no code  
segregation). Frequently used instructions are encoded as  
16-bits.  
• Boot from 8/16-bit external FLASH memory – The 8/16-bit  
FLASH boot routine located in boot ROM memory space is  
set up using Asynchronous Memory Bank 0. All configura-  
tion settings are set for the slowest device possible (3-cycle  
hold time; 15-cycle R/W access times; 4-cycle setup).  
DEVELOPMENT TOOLS  
The ADSP-BF561 is supported with a complete set of  
CROSSCORETM software and hardware development tools,  
including Analog Devices emulators and the VisualDSP++®  
development environment. The same emulator hardware that  
supports other Analog Devices processors also fully emulates  
the ADSP-BF561.  
• Boot from SPI serial EEPROM (16-bit addressable) – The  
SPI uses the PF2 output pin to select a single SPI EPROM  
device, submits a read command at address 0x0000, and  
begins clocking data into the beginning of L1 instruction  
memory. A 16-bit addressable SPI-compatible EPROM  
must be used.  
The VisualDSP++ project management environment lets pro-  
grammers develop and debug an application. This environment  
includes an easy-to-use assembler that is based on an algebraic  
syntax, an archiver (librarian/library builder), a linker, a loader,  
a cycle-accurate instruction-level simulator, a C/C++ compiler,  
and a C/C++ run-time library that includes DSP and mathemat-  
ical functions. A key point for these tools is C/C++ code  
efficiency. The compiler has been developed for efficient trans-  
lation of C/C++ code to Blackfin assembly. The Blackfin  
processor has architectural features that improve the efficiency  
of compiled C/C++ code.  
For each of the boot modes, a boot loading protocol is used to  
transfer program and data blocks, from an external memory  
device, to their specified memory locations. Multiple memory  
blocks may be loaded by any boot sequence. Once all blocks are  
loaded, Core A program execution commences from the start of  
L1 instruction SRAM (0xFFA0 0000). Core B remains in a held-  
off state until a certain register bit is cleared. After that, Core B  
will start execution at address 0xFF60 0000.  
In addition, bit 4 of the Reset Configuration Register can be set  
by application code to bypass the normal boot sequence during  
a software reset. For this case, the processor jumps directly to  
the beginning of L1 instruction memory.  
The VisualDSP++ debugger has a number of important fea-  
tures. Data visualization is enhanced by a plotting package that  
offers a significant level of flexibility. This graphical representa-  
tion of user data enables the programmer to quickly determine  
the performance of an algorithm. As algorithms grow in com-  
plexity, this capability can have increasing significance on the  
designer’s development schedule, increasing productivity. Sta-  
tistical profiling enables the programmer to non intrusively poll  
the processor as it is running the program. This feature, unique  
to VisualDSP++, enables the software developer to passively  
gather important code execution metrics without interrupting  
the real-time characteristics of the program. Essentially, the  
developer can identify bottlenecks in software quickly and effi-  
ciently. By using the profiler, the programmer can focus on  
those areas in the program that impact performance and take  
corrective action.  
INSTRUCTION SET DESCRIPTION  
The Blackfin processor family assembly language instruction set  
employs an algebraic syntax that was designed for ease of coding  
and readability. The instructions have been specifically tuned to  
provide a flexible, densely encoded instruction set that compiles  
to a very small final memory size. The instruction set also pro-  
vides fully featured multifunction instructions that allow the  
programmer to use many of the processor core resources in a  
single instruction. Coupled with many features more often seen  
on microcontrollers, this instruction set is very efficient when  
compiling C and C++ source code. In addition, the architecture  
supports both a user (algorithm/application code) and a super-  
visor (O/S kernel, device drivers, debuggers, ISRs) mode of  
operations, allowing multiple levels of access to core processor  
resources.  
Debugging both C/C++ and assembly programs with the Visu-  
alDSP++ debugger, programmers can:  
The assembly language, which takes advantage of the proces-  
sor’s unique architecture, offers the following advantages:  
• View mixed C/C++ and assembly code (interleaved source  
and object information)  
• Seamlessly integrated DSP/CPU features are optimized for  
both 8-bit and 16-bit operations.  
• Insert breakpoints  
• A multi-issue load/store modified-Harvard architecture,  
which supports two 16-bit MAC or four 8-bit ALU + two  
load/store + two pointer updates per cycle.  
• Set conditional breakpoints on registers, memory, and  
stacks  
• Trace instruction execution  
• Perform linear or statistical profiling of program execution  
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Preliminary Technical Data  
ADSP-BF561  
• Fill, dump, and graphically plot the contents of memory  
• Perform source level debugging  
emulation is assured by the use of the processor’s JTAG inter-  
face—the emulator does not affect target system loading or  
timing.  
• Create custom debugger windows  
In addition to the software and hardware development tools  
available from Analog Devices, third parties provide a wide  
range of tools supporting the Blackfin processor family. Third  
Party software tools include DSP libraries, real-time operating  
systems, and block diagram design tools.  
The VisualDSP++ IDE lets programmers define and manage  
software development. Its dialog boxes and property pages let  
programmers configure and manage all development tools,  
including Color Syntax Highlighting in the VisualDSP++ edi-  
tor. These capabilities permit programmers to:  
DESIGNING AN EMULATOR-COMPATIBLE  
PROCESSOR BOARD (TARGET)  
• Control how the development tools process inputs and  
generate outputs.  
The Analog Devices family of emulators are tools that every sys-  
tem developer needs to test and debug hardware and software  
systems. Analog Devices has supplied an IEEE 1149.1 JTAG  
Test Access Port (TAP) on the ADSP-BF561. The emulator uses  
the TAP to access the internal features of the processor, allow-  
ing the developer to load code, set breakpoints, observe  
variables, observe memory, and examine registers. The proces-  
sor must be halted to send data and commands, but once an  
operation has been completed by the emulator, the processor is  
set running at full speed with no impact on system timing.  
• Maintain a one-to-one correspondence with the tool’s  
command line switches.  
The VisualDSP++ Kernel (VDK) incorporates scheduling and  
resource management tailored specifically to address the mem-  
ory and timing constraints of embedded, real-time  
programming. These capabilities enable engineers to develop  
code more effectively, eliminating the need to start from the  
very beginning, when Developing new application code. The  
VDK features include Threads, Critical and Unscheduled  
regions, Semaphores, Events, and Device flags. The VDK also  
supports Priority-based, Pre-emptive, Cooperative and Time-  
Sliced scheduling approaches. In addition, the VDK was  
designed to be scalable. If the application does not use a specific  
feature, the support code for that feature is excluded from the  
target system.  
To use these emulators, the target board must include a header  
that connects the processor’s JTAG port to the emulator.  
For details on target board design issues including mechanical  
layout, single processor connections, multiprocessor scan  
chains, signal buffering, signal termination, and emulator pod  
logic, see the EE-68: Analog Devices JTAG Emulation Technical  
Reference on the Analog Devices web site (www.analog.com)—  
use site search on “EE-68.” This document is updated regularly  
to keep pace with improvements to emulator support.  
Because the VDK is a library, a developer can decide whether to  
use it or not. The VDK is integrated into the VisualDSP++  
development environment, but can also be used with standard  
command-line tools. When the VDK is used, the development  
environment assists the developer with many error-prone tasks  
and assists in managing system resources, automating the gen-  
eration of various VDK based objects, and visualizing the  
system state, when debugging an application that uses the VDK.  
To use these emulators, the target board must include a header  
that includes a header that connects the processor’s JTAG port  
to the emulation.  
ADDITIONAL INFORMATION  
VCSE is Analog Devices technology for creating, using, and  
reusing software components (independent modules of sub-  
stantial functionality) to quickly and reliably assemble software  
applications. Download components from the Web and drop  
them into the application. Publish component archives from  
within VisualDSP++. VCSE supports component implementa-  
tion in C/C++ or assembly language.  
This data sheet provides a general overview of the ADSP-BF561  
architecture and functionality. For detailed information on the  
Blackfin DSP family core architecture and instruction set, refer  
to the ADSP-BF561 Hardware Reference and the Blackfin Family  
Instruction Set Reference.  
Use the Expert Linker to visually manipulate the placement of  
code and data on the embedded system. View memory utiliza-  
tion in a color-coded graphical form, easily move code and data  
to different areas of the processor or external memory with the  
drag of the mouse, examine run time stack and heap usage. The  
Expert Linker is fully compatible with existing Linker Definition  
File (LDF), allowing the developer to move between the graphi-  
cal and textual environments.  
Analog Devices’ emulators use the IEEE 1149.1 JTAG test access  
port of the ADSP-BF561 to monitor and control the target  
board processor during emulation. The emulator provides full-  
speed emulation, allowing inspection and modification of mem-  
ory, registers, and processor stacks. Non intrusive in-circuit  
Rev. PrC  
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ADSP-BF561  
Preliminary Technical Data  
PIN DESCRIPTIONS  
ADSP-BF561 pin definitions are listed in Table 8. Unused  
inputs should be tied or pulled to VDDEXT or GND.  
Table 8. Pin Descriptions  
Block  
Pin Name  
Type Signals Function  
Driver Pull-up/down requirement  
Type  
EBIU  
ADDR[25:2]  
O
24  
32  
4
Address Bus for Async/Sync Access  
Data Bus for Async/Sync Access  
none  
none  
none  
A
A
A
DATA[31:0]  
I/O  
O
ABE[3:0]/SDQM[3:0]  
Byte Enables/Data Masks for Async  
/Sync Access  
BG  
O
I
1
1
1
1
1
1
1
1
1
1
4
4
1
1
1
1
8
8
1
1
1
1
8
8
1
1
1
1
1
1
1
1
1
1
Bus Grant  
A
-
none  
BR  
Bus Request  
pull-up required if function not used  
BGH  
O
O
O
O
O
O
O
O
O
O
I
Bus Grant Hang  
Row Address Strobe  
Column Address Strobe  
Write Enable  
A
A
A
A
A
B
B
A
A
A
-
none  
EBIU  
(SDRAM)  
SRAS  
none  
SCAS  
none  
SWE  
none  
SCKE  
Clock Enable  
none  
SCLK0/CLKOUT  
SCLK1  
SA10  
Clock Output Pin 0  
Clock Output Pin 1  
SDRAM A10 Pin  
Bank Select  
none  
none  
none  
SMS[3:0]  
AMS[3:0]  
ARDY  
AOE  
none  
EBIU  
(ASYNC)  
Bank Select  
none  
Hardware Ready Control  
Output Enable  
Write Enable  
pull-up required if function not used  
none  
O
O
O
A
A
A
C
C
-
AWE  
none  
ARE  
Read Enable  
none  
PPI1  
PPI2  
JTAG  
PPI1D[15:8] /PF[47:40] I/O  
PPI Data / Programmable Flag Pins  
PPI Data Pins  
software configurable, none  
software configurable, none  
software configurable, none  
software configurable, none  
software configurable, none  
software configurable, none  
software configurable, none  
software configurable, none  
software configurable, none  
software configurable, none  
software configurable, none  
software configurable, none  
none  
PPI1D[7:0]  
I/O  
I
PPI1CLK  
PPI Clock  
PPI1SYNC1/ TMR8  
PPI1SYNC2/ TMR9  
PPI1SYNC3  
I/O  
I/O  
I/O  
PPI Sync / Timer  
PPI Sync / Timer  
PPI Sync  
C
C
C
C
C
-
PPI2D[15:8] /PF[39:32] I/O  
PPI Data / Programmable Flag Pins  
PPI Data Pins  
PPI2D[7:0]  
I/O  
PPI2CLK  
I
PPI Clock  
PPI2SYNC1/ TMR10  
I/O  
PPI Sync / Timer  
PPI Sync / Timer  
PPI Sync  
C
C
C
C
-
PPI2SYNC2/ TMR11  
I/O  
PPI2SYNC3  
EMU  
I/O  
O
I
Emulation Output  
JTAG Clock  
TCK  
internal pull-down  
none  
TDO  
O
I
JTAG Serial Data Out  
JTAG Serial Data In  
JTAG Mode Select  
JTAG Reset  
C
-
TDI  
internal pull-down  
internal pull-down  
TMS  
I
-
TRST  
I
-
external down necessary if JTAG not  
used  
Rev. PrC  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
Table 8. Pin Descriptions (Continued)  
Block  
Pin Name  
RX/PF27  
TX/PF26  
MOSI  
Type Signals Function  
Driver Pull-up/down requirement  
Type  
UART  
I/O  
I/O  
I/O  
1
1
1
UART Receive  
/ Programmable Flag  
C
software configurable,  
no pull-up/down necessary  
UART Transmit  
/ Programmable Flag  
C
C
software configurable,  
no pull-up/down necessary  
SPI  
Master Out Slave In  
software configurable,  
no pull-up/down necessary  
MISO  
SCK  
I/O  
I/O  
1
1
Master In Slave Out  
SPI Clock  
C
pull-up is necessary if booting via SPI  
D
software configurable,  
no pull-up/down necessary  
SPORT0  
RSCLK0/PF28  
RFS0/PF19  
I/O  
I/O  
I
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Sport0 / Programmable Flag  
D
C
-
software configurable,  
no pull-up/down necessary  
Sport0 Receive Frame Sync  
/ Programmable Flag  
software configurable,  
no pull-up/down necessary  
DR0PRI  
Sport0 Receive Data Primary  
software configurable,  
no pull-up/down necessary  
DR0SEC/PF20  
TSCLK0/PF29  
TFS0/PF16  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I
Sport0 Receive Data Secondary  
/ Programmable Flag  
C
D
C
C
C
D
C
-
software configurable,  
no pull-up/down necessary  
Sport0 Transmit Serial Clock  
/ Programmable Flag  
software configurable,  
no pull-up/down necessary  
Sport0 Transmit Frame Sync  
/ Programmable Flag  
software configurable,  
no pull-up/down necessary  
DT0PRI/PF18  
DT0SEC/PF17  
RSCLK1/PF30  
RFS1/PF24  
Sport0 Transmit Data Primary  
/ Programmable Flag  
software configurable,  
no pull-up/down necessary  
Sport0 Transmit Data Secondary  
/ Programmable Flag  
software configurable,  
no pull-up/down necessary  
SPORT1  
Sport1 / Programmable Flag  
software configurable,  
no pull-up/down necessary  
Sport1 Receive Frame Sync  
/ Programmable Flag  
software configurable,  
no pull-up/down necessary  
DR1PRI  
Sport1 Receive Data Primary  
software configurable,  
no pull-up/down necessary  
DR1SEC/PF25  
TSCLK1/PF31  
TFS1/PF21  
I/O  
I/O  
I/O  
I/O  
I/O  
Sport1 Receive Data Secondary  
/ Programmable Flag  
C
D
C
C
C
software configurable,  
no pull-up/down necessary  
Sport1 Transmit Serial Clock  
/ Programmable Flag  
software configurable,  
no pull-up/down necessary  
Sport1 Transmit Frame Sync  
/ Programmable Flag  
software configurable,  
no pull-up/down necessary  
DT1PRI/PF23  
DT1SEC/PF22  
Sport1 Transmit Data Primary  
/ Programmable Flag  
software configurable,  
no pull-up/down necessary  
Sport1 Transmit Data Secondary  
/ Programmable Flag  
software configurable,  
no pull-up/down necessary  
Rev. PrC  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
Table 8. Pin Descriptions (Continued)  
Block  
Pin Name  
Type Signals Function  
Driver Pull-up/down requirement  
Type  
PF/TIMER PF15/EXT CLK  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Programmable Flag  
/ external timer clock input  
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
software configurable,  
no pull-up/down necessary  
PF14  
PF13  
PF12  
PF11  
PF10  
PF9  
Programmable Flag  
Programmable Flag  
Programmable Flag  
Programmable Flag  
Programmable Flag  
Programmable Flag  
Programmable Flag  
software configurable,  
no pull-up/down necessary  
software configurable,  
no pull-up/down necessary  
software configurable,  
no pull-up/down necessary  
software configurable,  
no pull-up/down necessary  
software configurable,  
no pull-up/down necessary  
software configurable,  
no pull-up/down necessary  
PF8  
software configurable,  
no pull-up/down necessary  
PF7/SPISEL7/  
TMR7  
Programmable Flag / SPI Select  
/ Timer  
software configurable,  
no pull-up/down necessary  
PF6/SPISEL6/  
TMR6  
Programmable Flag / SPI Select  
/ Timer  
software configurable,  
no pull-up/down necessary  
PF5/SPISEL5/  
TMR5  
Programmable Flag / SPI Select  
/ Timer  
software configurable,  
no pull-up/down necessary  
PF4/SPISEL4/  
TMR4  
Programmable Flag / SPI Select  
/ Timer  
software configurable,  
no pull-up/down necessary  
PF3/SPISEL3/  
TMR3  
Programmable Flag / SPI Select  
/ Timer  
software configurable,  
no pull-up/down necessary  
PF2/SPISEL2/  
TMR2  
Programmable Flag / SPI Select  
/ Timer  
software configurable,  
no pull-up/down necessary  
PF1/SPISEL1/  
TMR1  
Programmable Flag / SPI Select  
/ Timer  
software configurable,  
no pull-up/down necessary  
PF0/SPISS/  
TMR0  
Programmable Flag / Slave SPI Select C  
/ Timer  
software configurable,  
no pull-up/down necessary  
Clock  
CLKIN  
Clock input  
-
needs to be at a level or  
clocking  
Generator  
XTAL  
O
I
1
1
1
2
Crystal connection  
Chip reset signal  
Sleep  
-
none  
Mode  
Controls  
RESET  
-
always active if core power on  
none  
SLEEP  
O
I
C
-
BMODE[1:0]  
Dedicated Mode Pin, Configures  
the boot mode that is employed  
following a hardware reset or  
software reset  
pull-up or pull-down required  
BYPASS  
NMI0  
I
I
1
1
PLL BYPASS control  
-
-
pull-up or pull-down required  
Non Maskable interrupt Core A  
pull-down required if function not  
used  
NMI1  
I
1
2
Non Maskable interrupt Core B  
Regulation output  
-
-
pull-down required if function not  
used  
Regulator VROUT1-0  
O
N/A  
Rev. PrC  
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Page 18 of 52  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
Table 8. Pin Descriptions (Continued)  
Block  
Pin Name  
Type Signals Function  
Driver Pull-up/down requirement  
Type  
Supplies  
VDDEXT  
VDDINT  
P
23  
14  
41  
2
Power Supply  
Power Supply  
Power Supply Return  
NC  
-
-
-
-
N/A  
N/A  
N/A  
N/A  
P
GND  
G
No Connection  
NC  
Total pins  
256  
Rev. PrC  
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Page 19 of 52  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
SPECIFICATIONS  
Note that component specifications are subject to change with-  
out notice.  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
VDDINT  
VDDEXT  
VIH  
Parameter  
Minimum  
0.8  
Nominal  
1.2  
Maximum  
TBD  
Unit  
Internal Supply Voltage  
V
V
V
V
External Supply Voltage  
High Level Input Voltage1, @ VDDEXT =maximum  
Low Level Input Voltage2, @ VDDEXT=minimum  
Ambient Operating Temperature  
Industrial  
2.25  
2.5 or 3.3  
3.6  
2.0  
3.6  
VIL  
–0.3  
0.6  
TAMBIENT  
-40  
0
85  
70  
ºC  
ºC  
Commercial  
1 The ADSP-BF561 is 3.3 V tolerant (always accepts up to 3.6 V maximum VIH), but voltage compliance (on outputs, VOH) depends on the input VDDEXT, because VOH  
(maximum) approximately equals VDDEXT (maximum). This 3.3 V tolerance applies to bi-directional and input only pins.  
ELECTRICAL CHARACTERISTICS  
Parameter  
Test Conditions  
Minimum  
Maximum Unit  
VOH  
VOL  
IIL  
High Level Output Voltage1  
@ VDDEXT =3.0V, IOH = –0.5 mA  
2.4  
V
Low Level Output Voltage1  
Low Level Input Current2  
High Level Input Current3  
High Level Input Current4  
Three-State Leakage Current5  
Three-State Leakage Current5  
Input Capacitance6, 7  
@ VDDEXT =3.0V, IOL = 2.0 mA  
0.4  
V
@ VDDEXT =maximum, VIN = 0 V  
@ VDDEXT =maximum, VIN = VDD maximum  
@ VDDEXT =maximum, VIN = VDD maximum  
@ VDDEXT = maximum, VIN = VDD maximum  
@ VDDEXT = maximum, VIN = 0 V  
fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V  
-10  
-10  
V
IIH  
10  
50  
10  
µA  
µA  
µA  
µA  
pF  
IIH  
IOZH  
IOZL  
CIN  
TBD  
1 Applies to output and bidirectional pins.  
2 Applies to all input pins.  
3 Applies to all input pins except TCK, TDI, TMS, and TRST.  
4 Applies to TCK, TDI, TMS, and TRST.  
5 Applies to three-statable pins.  
6 Applies to all signal pins.  
7 Guaranteed, but not tested.  
Rev. PrC  
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Page 20 of 52  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
ABSOLUTE MAXIMUM RATINGS  
Internal (Core) Supply Voltage1 (VDDINT  
)
0.3 V to +1.4 V  
0.3 V to +3.8 V  
0.5 V to 3.6 V  
0.5 V to VDDEXT +0.5 V  
200 pF  
External (I/O) Supply Voltage1 (VDDEXT  
Input Voltage1  
)
Output Voltage Swing1  
Load Capacitance1 ,2  
Core Clock (CCLK)1  
ADSP-BF561SKBCZ600  
ADSP-BF561SKBCZ500  
System Clock (SCLK)1  
Storage Temperature Range1  
Junction Temperature Under Bias  
Lead Temperature (5 seconds)1  
600 MHz  
500 MHz  
133 MHz  
65ºC to +150ºC  
125ºC  
185ºC  
1 Stresses greater than those listed above may cause permanent damage to the device.  
These are stress ratings only. Functional operation of the device at these or any other  
conditionsgreaterthanthoseindicatedintheoperationalsectionsofthisspecification  
is notimplied. Exposuretoabsolutemaximumratingconditionsforextendedperiods  
may affect device reliability.  
2 For proper SDRAM controller operation, the maximum load capacitance is 50 pF (at  
3.3V) or 30 pF (at 2.5V) for ADDR25-2, DATA31-0, ABE3-0/SDQM3-0, CLKOUT,  
SCKE, SA10, SRAS, SCAS, SWE, and SMS.  
ESD SENSITIVITY  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although the ADSP-BF561 features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precau-  
tions are recommended to avoid performance degradation or loss of functionality.  
Rev. PrC  
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Page 21 of 52  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
TIMING SPECIFICATIONS  
Table 9 and Table 12 describe the timing requirements for the  
ADSP-BF561 clocks. Take care in selecting MSEL, SSEL, and  
CSEL ratios so as not to exceed the maximum core clock, system  
clock and Voltage Controlled Oscillator (VCO) operating fre-  
quencies, as described in Absolute Maximum Ratings on  
Page 21. Table 12 describes Phase-Locked Loop operating  
conditions.  
Table 9. Core and System Clock Requirements—ADSP-BF561SKBCZ500  
Parameter  
tCCLK  
Minimum  
Maximum  
Maximum  
Maximum  
Unit  
ns  
Core Cycle Period (VDDINT=1.4 V– 50 mV)  
Core Cycle Period (VDDINT=1.35 V–5%)  
Core Cycle Period (VDDINT=1.2 V–5%)  
Core Cycle Period (VDDINT=1.1 V–5%)  
Core Cycle Period (VDDINT=1.0 V–5%)  
Core Cycle Period (VDDINT=0.9 V–5%)  
Core Cycle Period (VDDINT=0.8 V)  
na  
tCCLK  
na  
ns  
tCCLK  
2
ns  
tCCLK  
2.25  
2.70  
3.20  
4.00  
ns  
tCCLK  
ns  
tCCLK  
ns  
tCCLK  
ns  
Table 10. Core and System Clock Requirements—ADSP-BF561SKBCZ600X  
Parameter  
tCCLK  
Minimum  
Unit  
ns  
Core Cycle Period (VDDINT=1.4 V– 50 mV)  
Core Cycle Period (VDDINT=1.35 V–5%)  
Core Cycle Period (VDDINT=1.2 V–5%)  
Core Cycle Period (VDDINT=1.1 V–5%)  
Core Cycle Period (VDDINT=1.0 V–5%)  
Core Cycle Period (VDDINT=0.9 V–5%)  
Core Cycle Period (VDDINT=0.8 V)  
na  
tCCLK  
na  
ns  
tCCLK  
1.66  
2.25  
2.70  
3.20  
4.00  
ns  
tCCLK  
ns  
tCCLK  
ns  
tCCLK  
ns  
tCCLK  
ns  
Table 11. Core and System Clock Requirements—ADSP-BF561SBB600  
Parameter  
tCCLK  
Minimum  
Unit  
ns  
Core Cycle Period (VDDINT=1.4 V– 50 mV)  
Core Cycle Period (VDDINT=1.35 V–5%)  
Core Cycle Period (VDDINT=1.2 V–5%)  
Core Cycle Period (VDDINT=1.1 V–5%)  
Core Cycle Period (VDDINT=1.0 V–5%)  
Core Cycle Period (VDDINT=0.9 V–5%)  
Core Cycle Period (VDDINT=0.8 V)  
na  
tCCLK  
1.66  
2.0  
ns  
tCCLK  
ns  
tCCLK  
2.25  
2.70  
3.20  
4.00  
ns  
tCCLK  
ns  
tCCLK  
ns  
tCCLK  
ns  
Table 12. Phase-Locked Loop Operating Conditions  
Parameter  
Minimum  
Maximum  
Maximum CCLK  
Unit  
MHz  
Voltage Controlled Oscillator (VCO) Frequency  
50  
Rev. PrC  
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Page 22 of 52  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
Clock and Reset Timing  
Table 13 and Figure 7 describe clock and reset operations. Per  
Figure 7, combinations of CLKIN and clock multipliers must  
not select core/peripheral clocks in excess of 600/133 MHz.  
Table 13. Clock and Reset Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tCKIN  
CLKIN Period  
CLKIN Low Pulse1  
CLKIN High Pulse1  
RESET Asserted Pulsewidth Low2  
25.0  
100.0  
ns  
ns  
ns  
ns  
tCKINL  
tCKINH  
tWRST  
10.0  
10.0  
11 tCKIN  
Switching Characteristics  
tSCLK  
CLKOUT Period3  
7.54  
ns  
1 Applies to bypass mode and non-bypass mode.  
2 Applies after power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2000 CLKIN cycles, while RESET is asserted,  
assuming stable power supplies and CLKIN (not including start-up time of external clock oscillator).  
3 The figure below shows a x2 ratio between tCKIN and tSCLK, but the ratio has many programmable options. For more information, see the System Design chapter of the ADSP-  
BF561 Hardware Reference.  
4 tSCLK must always also be larger than tC  
.
LK  
C
tCKIN  
CLKIN  
tCKINL  
tCKINH  
tWRST  
RESET  
tSCLKD  
tSCLK  
CLKOUT  
Figure 7. Clock and Reset Timing  
Rev. PrC  
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Page 23 of 52  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
Asynchronous Memory Read Cycle Timing  
Table 14. Asynchronous Memory Read Cycle Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSDAT  
DATA15–0 Setup Before CLKOUT  
DATA15–0 Hold After CLKOUT  
ARDY Setup Before CLKOUT  
ARDY Hold After CLKOUT  
2.1  
0.8  
4.0  
0.0  
ns  
ns  
ns  
ns  
tHDAT  
tSARDY  
tHARDY  
Switching Characteristic  
tDO  
Output Delay After CLKOUT1  
tHO  
Output Hold After CLKOUT 1  
6.0  
ns  
ns  
0.8  
1 Output pins include AMS3–0, ABE3–0, ADDR25–2, AOE, ARE.  
HOLD  
1 CYCLE  
SETUP  
2 CYCLES  
PROGRAMMED READ ACCESS  
4 CYCLES  
ACCESS EXTENDED  
3 CYCLES  
CLKOUT  
tDO  
tHO  
AMSx  
ABE1–0  
BE, ADDRESS  
ADDR19–1  
AOE  
tDO  
tHO  
ARE  
tHARDY  
tSARDY  
tHARDY  
ARDY  
tSARDY  
tSDAT  
tHDAT  
DATA15–0  
READ  
Figure 8. Asynchronous Memory Read Cycle Timing  
Rev. PrC  
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Page 24 of 52  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
Asynchronous Memory Write Cycle Timing  
Table 15. Asynchronous Memory Write Cycle Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSARDY  
tHARDY  
Switching Characteristic  
ARDY Setup Before CLKOUT  
4.0  
0.0  
ns  
ns  
ARDY Hold After CLKOUT  
tDDAT  
tENDAT  
tDO  
DATA15–0 Disable After CLKOUT  
6.0  
6.0  
ns  
ns  
ns  
ns  
DATA15–0 Enable After CLKOUT  
Output Delay After CLKOUT1  
Output Hold After CLKOUT 1  
1.0  
0.8  
tHO  
1 Output pins include AMS3–0, ABE3–0, ADDR25–2, DATA31–0, AOE, AWE.  
ACCESS  
EXTENDED  
1 CYCLE  
SETUP  
2 CYCLES  
HOLD  
1 CYCLE  
PROGRAMMED WRITE  
ACCESS 2 CYCLES  
CLKOUT  
AMSx  
tDO  
tHO  
ABE1–0  
BE, ADDRESS  
ADDR19–1  
tDO  
tHO  
AWE  
tHARDY  
tSARDY  
ARDY  
tSARDY  
tENDAT  
tDDAT  
DATA15–0  
WRITE DATA  
Figure 9. Asynchronous Memory Write Cycle Timing  
Rev. PrC  
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Page 25 of 52  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
SDRAM Interface Timing  
Table 16. SDRAM Interface Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirement  
tSSDAT  
tHSDAT  
Switching Characteristic  
DATA Setup Before CLKOUT  
2.1  
0.8  
ns  
ns  
DATA Hold After CLKOUT  
tSCLK  
CLKOUT Period  
7.5  
2.5  
2.5  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSCLKH  
tSCLKL  
tDCAD  
tHCAD  
tDSDAT  
tENSDAT  
CLKOUT Width High  
CLKOUT Width Low  
Command, ADDR, Data Delay After CLKOUT1  
Command, ADDR, Data Hold After CLKOUT1  
Data Disable After CLKOUT  
6.0  
6.0  
0.8  
1.0  
Data Enable After CLKOUT  
1 Command pins include: SRAS, SCAS, SWE, SDQM, SMS3-0, SA10, SCKE.  
tSCLK  
tSCLKH  
CLKOUT  
tSSDAT  
tSCLKL  
tHSDAT  
DATA (IN)  
tDCAD  
tDSDAT  
tENSDAT  
tHCAD  
DATA(OUT)  
tDCAD  
CMND ADDR  
(OUT)  
tHCAD  
NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.  
Figure 10. SDRAM Interface Timing  
Rev. PrC  
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Page 26 of 52  
|
April 2004  
Preliminary Technical Data  
ADSP-BF561  
External Port Bus Request and Grant Cycle Timing  
Table 17 and Figure 11 describe external port bus request and  
bus grant operations.  
Table 17. External Port Bus Request and Grant Cycle Timing  
Parameter, 1, 2  
Min  
Max  
Unit  
Timing Requirements  
tBS  
BR asserted to CLKOUT high setup  
4.6  
0.0  
ns  
ns  
tBH  
CLKOUT high to BR de-asserted hold time  
Switching Characteristics  
tSD  
CLKOUT low to SMS, address, and RD/WR disable  
4.5  
4.5  
3.6  
3.6  
3.6  
3.6  
ns  
ns  
ns  
ns  
ns  
ns  
tSE  
CLKOUT low to SMS, address, and RD/WR enable  
CLKOUT high to BG asserted setup  
tDBG  
tEBG  
tDBH  
tEBH  
CLKOUT high to BG de-asserted hold time  
CLKOUT high to BGH asserted setup  
CLKOUT high to BGH de-asserted hold time  
1 These are preliminary timing parameters that are based on worst-case operating conditions.  
2 The pad loads for these timing parameters are 20 pF.  
CLKOUT  
tB S  
tB H  
BR  
tS D  
tSE  
AM Sx  
tS D  
tSE  
ADDR25-2  
ABE3-0  
tS D  
tSE  
AWE  
ARE  
tD B G  
tE B G  
BG  
tD B H  
tE B H  
BG H  
Figure 11. External Port Bus Request and Grant Cycle Timing  
Rev. PrC  
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Page 27 of 52  
|
April 2004  
ADSP-BF561  
Preliminary Technical Data  
Parallel Peripheral Interface Timing  
Table 18, Figure 12, describes Parallel Peripheral Interface  
operations.  
Table 18. Parallel Peripheral Interface Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tPCLKW  
tPCLK  
PPIx_CLK Width1  
PPI_CLK Period1  
6.0  
ns  
ns  
15.0  
Timing Requirements  
tSFSPE  
tHFSPE  
tSDRPE  
tHDRPE  
External Frame Sync Setup Before PPI_CLK  
3.0  
ns  
ns  
ns  
ns  
External Frame Sync H old After PPI_CLK  
Receive Data Setup Before PPI_CLK  
Receive Data Hold After PPI_CLK  
3.0  
TBD  
TBD  
Switching Characteristics  
tDFSPE  
Internal Frame Sync Delay After PPI_CLK  
10.0  
10.0  
ns  
ns  
ns  
ns  
tHOFSPE Internal Frame Sync Hold After PPI_CLK  
0.0  
0.0  
tDDTPE  
Transmit Data Delay After PPI_CLK  
tHDTPE  
Transmit Data Hold After PPI_CLK  
1 PPI_CLK frequency cannot exceed fSCLK/2  
D R IV E  
E D G E  
S A M P L E  
E D G E  
tP C LK W  
P P I_ C L K  
tD F S P E  
tH O FS P E  
tS F S P E  
tH F S P E  
PP I_ FS 1  
PP I_ FS 2  
tD D T P E  
tS D R P E  
tH D R P E  
tH D T P E  
P P Ix  
Figure 12. Timing Diagram PPI  
Rev. PrC  
|
Page 28 of 52  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
Serial Ports  
Table 19 through Table 24 on Page 30 and Figure 13 on Page 31  
through Figure 15 on Page 33 describe Serial Port operations.  
Table 19. Serial Ports—External Clock  
Parameter  
Min  
Max  
Max  
Max  
Unit  
Timing Requirements  
tSFSE  
TFS/RFS Setup Before TSCLK/RSCLK1  
TFS/RFS Hold After TSCLK/RSCLK1  
Receive Data Setup Before RSCLK1  
Receive Data Hold After RSCLK1  
TSCLK/RSCLK Width  
3.0  
3.0  
3.0  
3.0  
4.5  
15.0  
ns  
ns  
ns  
ns  
ns  
ns  
tHFSE  
tSDRE  
tHDRE  
tSCLKW  
tSCLK  
TSCLK/RSCLK Period  
1 Referenced to sample edge.  
Table 20. Serial Ports—Internal Clock  
Parameter  
Min  
Unit  
Timing Requirements  
tSFSI  
TFS/RFS Setup Before TSCLK/RSCLK1  
TBD  
TBD  
6.0  
ns  
ns  
ns  
ns  
ns  
ns  
tHFSI  
TFS/RFS Hold After TSCLK/RSCLK1  
Receive Data Setup Before RSCLK1  
Receive Data Hold After RSCLK1  
TSCLK/RSCLK Width  
tSDRI  
tHDRI  
tSCLKW  
tSCLK  
0.0  
4.5  
TSCLK/RSCLK Period  
15.0  
1 Referenced to sample edge.  
Table 21. Serial Ports—External Clock  
Parameter  
Min  
Unit  
Switching Characteristics  
tDFSE  
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)1  
10.0  
10.0  
ns  
ns  
ns  
ns  
tHOFSE  
TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)1  
Transmit Data Delay After TSCLK1  
0.0  
0.0  
tDDTE  
tHDTE  
Transmit Data Hold After TSCLK1  
1 Referenced to drive edge.  
Rev. PrC  
|
Page 29 of 52  
|
April 2004  
ADSP-BF561  
Preliminary Technical Data  
Table 22. Serial Ports—Internal Clock  
Parameter  
Min  
Max  
Unit  
Switching Characteristics  
tDFS  
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)1  
TBD  
TBD  
ns  
ns  
ns  
ns  
ns  
I
tHOFS  
TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)1  
Transmit Data Delay After TSCLK1  
TBD  
I
tDDT  
I
tHDT  
Transmit Data Hold After TSCLK1  
TBD  
4.5  
I
tSCLKIW  
TSCLK/RSCLK Width  
1 Referenced to drive edge.  
Table 23. Serial Ports—Enable and Three-State  
Parameter  
Min  
Max  
Unit  
Switching Characteristics  
tDTENE  
Data Enable Delay from External TSCLK1  
TBD  
TBD  
ns  
ns  
ns  
ns  
tDDTTE  
Data Disable Delay from External TSCLK1  
Data Enable Delay from Internal TSCLK  
Data Disable Delay from Internal TSCLK1  
TBD  
TBD  
tDTENI  
tDDTTI  
1 Referenced to drive edge.  
Table 24. External Late Frame Sync  
Parameter  
Min  
Max  
Unit  
Switching Characteristics  
tDDTLFSE  
Data Delay from Late External TFS or External RFS with MCE = 1, MFD  
TBD  
ns  
ns  
= 01,2  
tDTENLFSE  
Data Enable from late FS or MCE = 1, MFD = 01,2  
TBD  
1 MCE = 1, TFS enable and TFS valid follow tDDTENFS and tDDTLFSE  
2 If external RFS/TFS setup to RSCLK/TSCLK > tSCLK/2 then tDDTLSCK and tDTENLSCK apply, otherwise tDDTLFSE and tDTENLFS apply.  
.
Rev. PrC  
|
Page 30 of 52  
|
April 2004  
Preliminary Technical Data  
ADSP-BF561  
DATA RECEIVE— INTERNAL CLOCK  
DATA RECEIVE— EXTERNAL CLOCK  
DRIVE EDGE SAMPLE EDGE  
DRIVE EDGE  
SAMPLE EDGE  
tSCLKIW  
tSCLKW  
RCLK  
RCLK  
tDFSE  
tDFSE  
tSFSE  
tHOFSE  
tSFSI  
tHFSI  
tHOFSE  
tHFSE  
RFS  
DR  
RFS  
DR  
tHDRE  
tSDRI  
tHDRI  
tSDRE  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK, TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
DATA TRANSMIT — INTERNAL CLOCK  
DATA TRANSMIT — EXTERNAL CLOCK  
DRIVE EDGE  
SAMPLE EDGE  
DRIVE EDGE  
SAMPLE EDGE  
tSCLKIW  
tSCLKW  
TCLK  
TCLK  
tDFSI  
tDFSE  
tHOFSI  
tSFSI  
tHFSI  
tHOFSE  
tSFSE  
tHFSE  
TFS  
DT  
TFS  
DT  
tDDTE  
tDDTI  
tHDTE  
tHDTI  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK OR TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
DRIVE EDGE  
DRIVE EDGE  
TCLK (EXT)  
TFS (“LATE”, EXT)  
TCLK/RCLK  
tDDTEN  
tDDTTE  
DT  
DRIVE EDGE  
DRIVE EDGE  
TCLK (INT)  
TFS (“LATE”, INT)  
TCLK/RCLK  
tDDTIN  
tDDTTI  
DT  
Figure 13. Serial Ports  
Rev. PrC  
|
Page 31 of 52  
|
April 2004  
ADSP-BF561  
Preliminary Technical Data  
EXTERNAL RFS WITH MCE= 1, MFD = 0  
DRIVE SAMPLE  
DRIVE  
RSCLK  
tSFSE/I  
tHOFSE/I  
RFS  
tDDTE/I  
tHDTE/I  
tDDTENFS  
1ST BIT  
2ND BIT  
DT  
tDDTLFSE  
LATE EXTERNAL TFS  
DRIVE  
SAMPLE  
DRIVE  
TSCLK  
TFS  
tHOFSE/I  
tSFSE/I  
tDDTE/I  
tHDTE/I  
tDDTENFS  
DT  
1ST BIT  
2ND BIT  
tDDTLFSE  
Figure 14. External Late Frame Sync (Frame Sync Setup < tSCLK/2)  
Rev. PrC  
|
Page 32 of 52  
|
April 2004  
Preliminary Technical Data  
ADSP-BF561  
EXTERNAL RFS WITH MCE=1, MFD=0  
DRIVE  
SAMPLE  
DRIVE  
RSCLK  
RFS  
tSFSE/I  
tHOFSE/I  
tDDTE/I  
tHDTE/I  
tDTENLSCK  
DT  
1ST BIT  
2ND BIT  
tDDTLSCK  
LATE EXTERNAL TFS  
DRIVE SAMPLE  
DRIVE  
TSCLK  
TFS  
tSFSE/I  
tHOFSE/I  
tDDTE/I  
tHDTE/I  
tDTENLSCK  
DT  
1ST BIT  
2ND BIT  
tDDTLSCK  
Figure 15. External Late Frame Sync (Frame Sync Setup > tSCLK/2)  
Rev. PrC  
|
Page 33 of 52  
|
April 2004  
ADSP-BF561  
Preliminary Technical Data  
Serial Peripheral Interface (SPI) Port—Master Timing  
Table 25 and Figure 16 describe SPI port master operations.  
Table 25. Serial Peripheral Interface (SPI) Port—Master Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSSPIDM  
tHSPIDM  
Data input valid to SCK edge (data input setup)  
SCK sampling edge to data input invalid  
TBD  
TBD  
ns  
ns  
Switching Characteristics  
tSDSCIM  
tSPICHM  
tSPICLM  
tSPICLK  
SPISELx low to first SCK edge  
2tSCLK-1.5  
2tSCLK-1.5  
2tSCLK-1.5  
4tSCLK-1.5  
2tSCLK-1.5  
2tSCLK-1.5  
TBD  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Serial clock high period  
Serial clock low period  
Serial clock period  
tHDSM  
Last SCK edge to SPISELx high  
Sequential transfer delay  
tSPITDM  
tDDSPIDM  
tHDSPIDM  
SCK edge to data out valid (data out delay)  
SCK edge to data out invalid (data out hold)  
TBD  
TBD  
TBD  
Rev. PrC  
|
Page 34 of 52  
|
April 2004  
Preliminary Technical Data  
ADSP-BF561  
SPISELx  
(OUTPUT)  
tSPICLK  
tHDSM  
tSPITDM  
tSDSCIM  
tSPICHM  
tSPICLM  
SCK  
(CPOL = 0)  
(OUTPUT)  
tSPICLM  
tSPICHM  
SCK  
(CPOL = 1)  
(OUTPUT)  
tDDSPIDM  
tHDSPIDM  
MOSI  
(OUTPUT)  
MSB  
LSB  
CPHA=1  
tSSPIDM  
tHSPIDM  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
tDDSPIDM  
tHDSPIDM  
MOSI  
(OUTPUT)  
MSB  
LSB  
CPHA=0  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 16. Serial Peripheral Interface (SPI) Port—Master Timing  
Rev. PrC  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
Serial Peripheral Interface (SPI) Port—Slave Timing  
Table 26 and Figure 17 describe SPI port slave operations.  
Table 26. Serial Peripheral Interface (SPI) Port—Slave Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSPICHS  
tSPICLS  
tSPICLK  
tHDS  
Serial clock high period  
2tSCLK-1.5  
2tSCLK-1.5  
4tSCLK-1.5  
2tSCLK-1.5  
2tSCLK-1.5  
2tSCLK-1.5  
1.6  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Serial clock low period  
Serial clock period  
Last SCK edge to SPISS not asserted  
Sequential Transfer Delay  
tSPITDS  
tSDSCI  
tSSPID  
tHSPID  
SPISS assertion to first SCK edge  
Data input valid to SCK edge (data input setup)  
SCK sampling edge to data input invalid  
1.6  
Switching Characteristics  
tDSOE  
SPISS assertion to data out active  
0
0
0
0
8
ns  
ns  
ns  
ns  
tDSDHI  
tDDSPID  
tHDSPID  
SPISS deassertion to data high impedance  
SCK edge to data out valid (data out delay)  
SCK edge to data out invalid (data out hold)  
8
10  
10  
Rev. PrC  
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Page 36 of 52  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
SPISS  
(INPUT)  
tSPICHS  
tSPICLS  
tSPICLK  
tHDS  
tSPITDS  
SCK  
(CPOL = 0)  
(INPUT)  
tSDSCI  
tSPICLS  
tSPICHS  
SCK  
(CPOL = 1)  
(INPUT)  
tDSOE  
tDDSPID  
tHDSPID  
MSB  
tDDSPID  
tDSDHI  
LSB  
MISO  
(OUTPUT)  
tHSPID  
tSSPID  
CPHA=1  
tSSPID  
tHSPID  
MOSI  
(INPUT)  
MSB VALID  
LSB VALID  
tDSOE  
tDDSPID  
tDSDHI  
MISO  
(OUTPUT)  
MSB  
LSB  
tHSPID  
CPHA=0  
tSSPID  
MOSI  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 17. Serial Peripheral Interface (SPI) Port—Slave Timing  
Rev. PrC  
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Page 37 of 52  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
Universal Asynchronous Receiver-Transmitter (UART)  
Port—Receive and Transmit Timing  
Figure 18 describes UART port receive and transmit operations.  
The maximum baud rate is SCLK/16. As shown in Figure 18  
there is some latency between the generation internal UART  
interrupts and the external data operations. These latencies are  
negligible at the data transmission rates for the UART.  
CLKOUT  
(SAMPLE CLOCK)  
RXD  
DATA(5–8)  
STOP  
RECEIVE  
INTERNAL  
UART RECEIVE  
INTERRUPT  
UART RECEIVE BIT SET BY DATA STOP;  
CLEARED BY FIFO READ  
START  
TXD  
DATA(5–8)  
STOP (1–2)  
AS DATA  
WRITEN TO  
BUFFER  
TRANSMIT  
INTERNAL  
UART TRANSMIT  
INTERRUPT  
UART TRANSMIT BIT SET BY PROGRAM;  
CLEARED BY WRITE TO TRANSMIT  
Figure 18. UART Port—Receive and Transmit Timing  
Rev. PrC  
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Page 38 of 52  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
Timer Cycle Timing  
Table 27 and Figure 19 describe timer expired operations. The  
input signal is asynchronous in “width capture mode” and  
“external clock mode” and has an absolute maximum input fre-  
quency of fSCLK/2 MHz.  
Table 27. Timer Cycle Timing  
Parameter  
Min  
Max  
Unit  
Timing Characteristics  
tWL  
Timer Pulsewidth Input Low1  
Timer Pulsewidth Input High1  
1
1
SCLK cycles  
SCLK cycles  
tWH  
Switching Characteristic  
tHTO  
Timer Pulsewidth Output2  
1
(232–1)  
SCLK cycles  
1 The minimum pulsewidths apply for TMRx input pins in width capture and external clock modes. They also apply to the PF1 or PPICLK input pins in PWM output mode.  
2 The minimum time for tHTO is one cycle, and the maximum time for tHTO equals (232–1) cycles.  
CLKOUT  
tHTO  
TMRx  
(PWM OUTPUT MODE)  
TMRx  
tWL  
tWH  
(WIDTH CAPTURE AND  
EXTERNAL CLOCK MODES)  
Figure 19. Timer PWM_OUT Cycle Timing  
Rev. PrC  
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Page 39 of 52  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
Programmable Flags Cycle Timing  
Table 28 and Figure 20 describe programmable flag operations.  
Table 28. Programmable Flags Cycle Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirement  
tWFI  
Switching Characteristic  
tDFO Flag output delay from CLKOUT low  
Flag input pulsewidth  
tSCLK + 1  
ns  
ns  
TBD  
CLKOUT  
tDFO  
PF (OUTPUT)  
FLAG OUTPUT  
FLAG INPUT  
tWFI  
PF (INPUT)  
Figure 20. Programmable Flags Cycle Timing  
Rev. PrC  
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Page 40 of 52  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
JTAG Test And Emulation Port Timing  
Table 29 and Figure 21 describe JTAG port operations.  
Table 29. JTAG Port Timing  
Parameter  
Min  
Max  
Unit  
Timing Parameters  
tTCK  
TCK Period  
20  
4
ns  
tSTAP  
tHTAP  
tSSYS  
tHSYS  
tTRSTW  
TDI, TMS Setup Before TCK High  
TDI, TMS Hold After TCK High  
System Inputs Setup Before TCK High1  
System Inputs Hold After TCK High1  
TRST Pulsewidth2  
ns  
4
ns  
4
ns  
5
ns  
4
TCK cycles  
Switching Characteristics  
tDTDO TDO Delay from TCK Low  
tDSYS  
System Outputs Delay After TCK Low3  
10  
12  
ns  
ns  
0
1 System Inputs=DATA31-0, ARDY, TMR2-0, PF47-0, PPIx_CLK, RSCLK0-1, RFS0-1, DR0PRI, DR0SEC, TSCLK0-1, TFS0-1, DR1PRI, DR1SEC, MOSI, MISO, SCK, RX,  
RESET, NMI, BMODE1-0, BR, PPIxD7-0.  
2 50 MHz max.  
3 System Outputs=DATA31-0, ADDR25-2, ABE3-0, AOE, ARE, AWE, AMS3-0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS3-0, PF47-0, RSCLK0-1, RFS0-1, TSCLK0-  
1, TFS0-1, DT0PRI, DT0SEC, DT1PRI, DT1SEC, MOSI, MISO, SCK, TX, BG, BGH, PPIxD7-0.  
tTCK  
TCK  
tSTAP  
tHTAP  
TMS  
TDI  
tDTDO  
TDO  
tSSYS  
tHSYS  
SYSTEM  
INPUTS  
tDSYS  
SYSTEM  
OUTPUTS  
Figure 21. JTAG Port Timing  
Rev. PrC  
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Page 41 of 52  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
POWER DISSIPATION  
Total power dissipation has two components, one due to inter-  
nal circuitry (PINT) and one due to the switching of external  
output drivers (PEXT). Table 30 shows the power dissipation for  
internal circuitry (VDDINT). Internal power dissipation is depen-  
dent on the instruction execution sequence and the data  
operands involved.  
The external component is calculated using:  
PEXT = O × C × V2DD × f  
The frequency f includes driving the load high and then back  
low. For example: DATA15–0 pins can drive high and low at a  
maximum rate of 1/(23tSCLK) while in SDRAM burst mode.  
Table 30. Internal Power Dissipation  
A typical power consumption can now be calculated for these  
conditions by adding a typical internal power dissipation.  
Test Conditions1  
Parameter fCCLK  
50 MHz 400 MHz 600 MHz 600 MHz  
DDINT = VDDINT VDDINT = VDDINT  
=
fCCLK  
=
fCCLK  
=
fCCLK  
=
Unit  
PTotal = PEXT + (IDD × VDDINT  
)
V
=
=
0.8 V  
TBD  
TBD  
1.2 V  
TBD  
TBD  
TBD  
1.2 V  
520  
TBD  
70  
1.35 V  
2
Note that the conditions causing a worst-case PEXT differ from  
those causing a worst-case PINT . Maximum PINT cannot occur  
while 100% of the output pins are switching from all ones (1s) to  
all zeros (0s). Note also that it is not common for an application  
to have 100%,or even 50%, of the outputs switching  
simultaneously.  
IDDTYP  
TBD  
mA  
mA  
mA  
3
IDDSLEEP  
TBD  
IDDDEEPSLEEP TBD  
TBD  
3
IDDHI-  
TBD  
TBD  
TBD  
TBD  
A  
4
BERNATE  
OUTPUT DRIVE CURRENTS  
1 IDD data is specified for typical process parameters. All data at 25ºC.  
2 Processor executing 75% dual Mac, 25% ADD with moderate data bus  
activity.  
Figure 22 shows typical I-V characteristics for the output driv-  
ers of the ADSP-BF561. The curves represent the current drive  
capability of the output drivers as a function of output voltage.  
3 See the ADSP-BF53x Blackfin Processor Hardware Reference Manual for  
definitions of Sleep and Deep Sleep operating modes.  
4 Measured at VDDEXT = 3.65V with voltage regulator off (VDDINT = 0V).  
120  
100  
The external component of total power dissipation is caused by  
the switching of output pins. Its magnitude depends on  
80  
60  
40  
• The number of output pins that switch during each cycle  
(O)  
20  
0
• The maximum frequency at which they can switch (f)  
• Their load capacitance (C)  
-20  
-40  
-60  
-80  
• Their voltage swing (VDDEXT  
)
-100  
-120  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
SOURCE (VDDEXT) VOLTAGE - V  
Figure 22. ADSP-BF561 Typical Drive  
in Figure 23.  
TEST CONDITIONS  
The ac signal specifications (timing parameters) appear in Tim-  
ing Specifications on Page 22. These include output disable  
time, output enable time, and capacitive loading. The timing  
specifications for the DSP apply for the voltage reference levels  
INPUT  
OR  
OUTPUT  
1.5V  
1.5V  
Figure 23. Voltage Reference Levels for AC Measurements (Except Output  
Enable/Disable)  
Rev. PrC  
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Page 42 of 52  
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April 2004  
Preliminary Technical Data  
ADSP-BF561  
time. A typical V will be 0.4 V. CL is the total bus capacitance  
(per data line), and IL is the total leakage or three-state current  
(per data line). The hold time will be tDECAY plus the minimum  
disable time (i.e., tDSDAT for an SDRAM write cycle).  
Output Enable Time  
Output pins are considered to be enabled when they have made  
a transition from a high impedance state to the point when they  
start driving. The output enable time tENA is the interval from  
the point when a reference signal reaches a high or low voltage  
level to the point when the output starts driving as shown in the  
Output Enable/Disable diagram (Figure 24). The time  
5
tENA_MEASURED is the interval from when the reference signal  
switches to when the output voltage reaches 2.0V (output high)  
or 1.0V (output low). Time tTRIP is the interval from when the  
output starts driving to when the output reaches the 1.0V or  
2.0V trip voltage. Time tENA is calculated as  
4
3
tENA_MEASURED–tTRIP. If multiple pins (such as the data bus) are  
enabled, the measurement value is that of the first pin to start  
driving.  
2
1
Output Disable Time  
Output pins are considered to be disabled when they stop driv-  
ing, go into a high impedance state, and start to decay from their  
output high or low voltage. The time for the voltage on the bus  
to decay by V is dependent on the capacitive load, CL and the  
load current, IL. This decay time can be approximated by the  
following equation:  
NOMINAL  
-5  
0
30  
60  
90  
120  
150  
180  
210  
LOAD CAPACITANCE - pF  
Figure 25. Typical Output Delay or Hold vs. Load Capacitance (at Max Case  
Temperature)  
tDECAY = (CLV) ⁄ IL  
The output disable time tDIS is the difference between  
t
DIS_MEASURED and tDECAY as shown in Figure 24.The time  
DIS_MEASURED is the interval from when the reference signal  
t
switches to when the output voltage decays V from the mea-  
sured output high or output low voltage. tDECAY is calculated  
with test loads CL and IL, and with V equal to 0.5 V.  
REFERENCE  
SIGNAL  
tDIS-MEASURED  
tENA-MEASURED  
tDIS  
VOH  
tENA  
VOH  
(MEASURED)  
(MEASURED)  
V
OH (MEASURED) - V  
2.0V  
1.0V  
VOL (MEASURED) + V  
VOL  
VOL  
(MEASURED)  
(MEASURED)  
tDECAY  
tTRIP  
OUTPUT STOPS DRIVING  
OUTPUT STARTS DRIVING  
HIGH-IMPEDANCE STATE.  
TEST CONDITIONS CAUSE THIS  
VOLTAGE TO BE APPROXIMATELY 1.5V.  
Figure 24. Output Enable/Disable  
EXAMPLE SYSTEM HOLD TIME CALCULATION  
To determine the data output hold time in a particular system,  
first calculate tDECAY using the equation given above. Choose  
V to be the difference between the ADSP-BF561's output volt-  
age and the input threshold for the device requiring the hold  
Rev. PrC  
|
Page 43 of 52  
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April 2004  
ADSP-BF561  
Preliminary Technical Data  
CAPACITIVE LOADING  
Output delays and holds are based on standard capacitive loads:  
30 pF on all pins (see Figure 26 on Page 44). Figure 25 shows  
graphically how output delays and holds vary with load capaci-  
tance (Note that this graph or derating does not apply to output  
disable delays; see Output Disable Time on Page 43). The graphs  
of Figure 25, Figure 27 and Figure 28 may not be linear outside  
the ranges shown, for Typical Output Delay vs. Load Capaci-  
tance and Typical Output Rise Time (10%-90%, V=Min) vs.  
Load Capacitance.  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
0
20  
40  
60  
80  
100 120 140 160 180 200  
50V  
LOAD CAPACITANCE - pF  
TO  
OUTPUT  
PIN  
1.5V  
Figure 28. Typical Output Rise/Fall Time (10%-90%, Vddext = Min)  
20pF  
Figure 26. Equivalent Device Loading for AC Measurements (Includes All  
Fixtures)  
16.0  
14.0  
12.0  
10.0  
8.0  
6.0  
4.0  
2.0  
0
0
20  
40  
60  
80  
100 120 140 160 180 200  
LOAD CAPACITANCE - pF  
Figure 27. Typical Output Rise/Fall Time (10%-90%, Vddext = Max)  
Rev. PrC  
|
Page 44 of 52  
|
April 2004  
Preliminary Technical Data  
ADSP-BF561  
256-BALL MBGA PIN CONFIGURATIONS  
Table 31. 256-Lead MBGA Pin Assignments  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
D01  
D02  
D03  
D04  
D05  
D06  
D07  
D08  
D09  
D10  
D11  
D12  
D13  
D14  
D15  
D16  
H01  
H02  
H03  
H04  
H05  
H06  
H07  
H08  
H09  
H10  
H11  
H12  
H13  
H14  
H15  
H16  
A01  
A02  
A03  
A04  
A05  
A06  
A07  
A08  
A09  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
E01  
E02  
E03  
E04  
E05  
E06  
E07  
E08  
E09  
E10  
E11  
E12  
E13  
E14  
E15  
E16  
VDDEXT  
ADDR24  
ADDR20  
VDDEXT  
ADDR14  
ADDR10  
AMS3  
B01  
B02  
B03  
B04  
B05  
B06  
B07  
B08  
B09  
B10  
B11  
B12  
B13  
B14  
B15  
B16  
F01  
F02  
F03  
F04  
F05  
F06  
F07  
F08  
F09  
F10  
F11  
F12  
F13  
F14  
F15  
F16  
PPI2CLK  
ADDR22  
ADDR18  
ADDR16  
ADDR12  
VDDEXT  
AMS1  
C01  
C02  
C03  
C04  
C05  
C06  
C07  
C08  
C09  
C10  
C11  
C12  
C13  
C14  
C15  
C16  
G01  
G02  
G03  
G04  
G05  
G06  
G07  
G08  
G09  
G10  
G11  
G12  
G13  
G14  
G15  
G16  
PPI1SYNC2/TMR9  
PPI1D13/PF45  
PPI1D15/PF47  
PPI1SYNC3  
ADDR23  
GND  
PPI1CLK  
ADDR25  
ADDR19  
GND  
ADDR11  
AOE  
GND  
ADDR09  
GND  
AWE  
ARE  
AMS0  
VDDEXT  
SMS3  
SMS1  
SMS2  
ARDY  
SCKE  
SRAS  
SCAS  
SCLK0/CLKOUT  
SCLK1  
VDDEXT  
BR  
GND  
SA10  
BGH  
VDDEXT  
ADDR02  
GND  
BG  
ABE1/SDQM1  
ADDR06  
ADDR04  
DATA0  
CLKIN  
GND  
ABE2/SDQM2  
ABE3/SDQM3  
VDDEXT  
GND  
ADDR07  
DATA1  
DATA3  
XTAL  
DATA5  
DATA6  
GND  
PPI1D11/PF43  
PPI1D12/PF44  
PPI1SYNC1/TMR8  
ADDR15  
ADDR13  
AMS2  
VDDEXT  
RESET  
GND  
GND  
VDDEXT  
BYPASS  
PPI1D14/PF46  
GND  
PPI1D9/PF41  
PPI1D7  
PPI1D5  
VDDINT  
VDDINT  
GND  
PPI1D10/PF42  
ADDR21  
ADDR17  
VDDINT  
GND  
GND  
VDDINT  
SMS0  
GND  
VDDINT  
GND  
VDDINT  
ADDR05  
ADDR03  
DATA15  
DATA14  
GND  
GND  
SWE  
GND  
ABE0/SDQM0  
DATA2  
ADDR08  
DATA10  
DATA8  
DATA12  
DATA9  
DATA11  
VDDINT  
DATA16  
DATA18  
DATA20  
DATA17  
DATA19  
GND  
DATA4  
DATA7  
DATA13  
VDDEXT  
VDDEXT  
Rev. PrC  
|
Page 45 of 52  
|
April 2004  
ADSP-BF561  
Preliminary Technical Data  
Table 31. 256-Lead MBGA Pin Assignments (Continued)  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
J01  
VROUT0  
VROUT1  
PPI1D2  
K01  
K02  
K03  
K04  
K05  
K06  
K07  
K08  
K09  
K10  
K11  
K12  
K13  
K14  
K15  
K16  
P01  
P02  
P03  
P04  
P05  
P06  
P07  
P08  
P09  
P10  
P11  
P12  
P13  
P14  
P15  
P16  
PPI1D6  
L01  
L02  
L03  
L04  
L05  
L06  
L07  
L08  
L09  
L10  
L11  
L12  
L13  
L14  
L15  
L16  
R01  
R02  
R03  
R04  
R05  
R06  
R07  
R08  
R09  
R10  
R11  
R12  
R13  
R14  
R15  
R16  
PPI1D0  
M01  
M02  
M03  
M04  
M05  
M06  
M07  
M08  
M09  
M10  
M11  
M12  
M13  
M14  
M15  
M16  
T01  
PPI2D15/PF39  
PPI2D13/PF37  
PPI2D9/PF33  
GND  
J02  
PPI1D4  
PPI2SYNC2/TMR11  
GND  
J03  
PPI1D8/PF40  
PPI2SYNC1/TMR10  
PPI2D14/PF38  
VDDEXT  
J04  
PPI1D3  
PPI2SYNC3  
VDDEXT  
PPI2D11/PF35  
GND  
J05  
PPI1D1  
NC  
J06  
VDDEXT  
GND  
PF3/SPISEL3/TMR3  
PF7/SPISEL7/TMR7  
VDDINT  
J07  
GND  
J08  
VDDINT  
VDDINT  
VDDINT  
GND  
VDDINT  
VDDINT  
GND  
J09  
GND  
GND  
J10  
GND  
VDDEXT  
GND  
BMODE0  
SCK  
J11  
VDDINT  
J12  
DATA30  
DATA22  
GND  
DATA28  
DR0PRI  
DR1PRI  
J13  
J14  
DATA26  
TFS0/PF16  
GND  
NC  
DATA24  
VDDEXT  
J15  
DATA21  
DATA23  
PPI2D12/PF36  
PPI2D10/PF34  
PPI2D3  
DATA25  
DATA27  
DATA29  
PPI2D7  
DATA31  
J16  
VDDEXT  
DT0PRI/PF18  
VDDEXT  
N01  
N02  
N03  
N04  
N05  
N06  
N07  
N08  
N09  
N10  
N11  
N12  
N13  
N14  
N15  
N16  
PPI2D8/PF32  
GND  
PPI2D6  
T02  
PPI2D4  
PPI2D5  
PPI2D2  
T03  
VDDEXT  
PPI2D1  
PF0/SPISS/TMR0  
GND  
PPI2D0  
T04  
PF2/SPISEL2/TMR2  
PF6/SPISEL6/TMR6  
VDDEXT  
PF1/SPISEL1/TMR1  
PF9  
PF4/SPISEL4/TMR4  
PF8  
T05  
PF5/SPISEL5/TMR5  
PF11  
T06  
GND  
PF10  
T07  
PF12  
PF13  
PF15/EXTCLK  
GND  
PF14  
T08  
T09  
VDDEXT  
TDO  
NMI1  
TCK  
BMODE1  
MOSI  
TRST  
TDI  
T10  
TMS  
NMI0  
BR  
T11  
T12  
SLEEP  
GND  
GND  
MISO  
VDDEXT  
RFS1/PF24  
GND  
RSCLK1/PF30  
TFS1/PF21  
RSCLK0/PF28  
DR0SEC/PF20  
TX/PF26  
TSCLK1/PF31  
DT1PRI/PF23  
RFS0/PF19  
T13  
T14  
T15  
T16  
RX/PF27  
DR1SEC/PF25  
DT1SEC/PF22  
VDDEXT  
DT0SEC/PF17  
TSCLK0/PF29  
Rev. PrC  
|
Page 46 of 52  
|
April 2004  
Preliminary Technical Data  
ADSP-BF561  
297-BALL PBGA PIN CONFIGURATIONS  
Table 32. 297-Lead PBGA Pin Assignments  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
AF17  
AF18  
AF19  
AF20  
AF21  
AF22  
AF23  
AF24  
AF25  
AF26  
B01  
A01  
A02  
A03  
A04  
A05  
A06  
A07  
A08  
A09  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
A17  
A18  
A19  
A20  
A21  
A22  
A23  
A24  
A25  
A26  
AA01  
AA02  
AA25  
AA26  
AB01  
AB02  
GND  
AB03  
AB24  
AB25  
AB26  
AC01  
AC02  
AC03  
AC04  
AC23  
AC24  
AC25  
AC26  
AD01  
AD02  
AD03  
AD04  
AD05  
AD22  
AD23  
AD24  
AD25  
AD26  
AE01  
AE02  
AE03  
AE04  
AE05  
AE06  
AE07  
AE08  
AE09  
AE10  
GND  
AE11  
AE12  
AE13  
AE14  
AE15  
AE16  
AE17  
AE18  
AE19  
AE20  
AE21  
AE22  
AE23  
AE24  
AE25  
AE26  
AF01  
AF02  
AF03  
AF04  
AF05  
AF06  
AF07  
AF08  
AF09  
AF10  
AF11  
AF12  
AF13  
AF14  
AF15  
AF16  
PF12  
SLEEP  
ADDR25  
ADDR23  
ADDR21  
ADDR19  
ADDR17  
ADDR15  
ADDR13  
ADDR11  
ADDR09  
AMS3  
GND  
PF14  
NMI0  
TFS0/PF16  
DR0PRI  
NC  
SCK  
TDO  
TX/PF26  
RSCLK1/PF30  
DR1PRI  
TSCLK1/PF31  
DT1SEC/PF22  
DT1PRI/PF23  
GND  
PPI2D9/PF33  
PPI2D8/PF32  
GND  
TRST  
EMU  
BMODE1  
BMODE0  
MISO  
GND  
GND  
GND  
MOSI  
DR0SEC/PF20  
RFS0/PF19  
PPI2D7  
RX/PF27  
RFS1/PF24  
DR1SEC/PF25  
TFS1/PF21  
GND  
PPI2CLK  
GND  
AMS1  
B02  
AWE  
B03  
ADDR24  
ADDR22  
ADDR20  
ADDR18  
ADDR16  
ADDR14  
ADDR12  
ADDR10  
AMS2  
ARE  
PPI2D6  
B04  
SMS0  
GND  
B05  
SMS2  
GND  
NC  
B06  
SRAS  
GND  
GND  
B07  
SCAS  
GND  
PPI2D4  
PPI2D2  
PPI2D0  
PF1/SPISEL1/TMR1  
PF3/SPISEL3/TMR3  
PF5/SPISEL5/TMR5  
PF7/SPISEL7/TMR7  
PF9  
B08  
SCLK0/CLKOUT  
SCLK1  
GND  
B09  
GND  
B10  
BGH  
NC  
B11  
ABE0/SDQM0  
ABE2/SDQM2  
ADDR08  
ADDR06  
GND  
RSCLK0/PF28  
PPI2D5  
B12  
AMS0  
B13  
AOE  
GND  
B14  
ARDY  
PPI2D3  
B15  
SMS1  
PPI2D1  
PF11  
B16  
SMS3  
PPI2D13/PF37  
PPI2D12/PF36  
DT0SEC/PF17  
TSCLK0/PF29  
PPI2D11/PF35  
PPI2D10/PF34  
PF0/SPISS/TMR0  
PF2/SPISEL2/TMR2  
PF4/SPISEL4/TMR4  
PF6/SPISEL6/TMR6  
PF8  
PF13  
B17  
SCKE  
PF15/EXT CLK  
NMI1  
B18  
SWE  
B19  
SA10  
TCK  
B20  
BR  
TDI  
B21  
BG  
PF10  
TMS  
B22  
ABE1/SDQM1  
Rev. PrC  
|
Page 47 of 52  
|
April 2004  
ADSP-BF561  
Preliminary Technical Data  
Table 32. 297-Lead PBGA Pin Assignments (Continued)  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
B23  
B24  
B25  
B26  
C01  
C02  
C03  
C04  
C05  
C22  
C23  
C24  
C25  
C26  
D01  
D02  
D03  
D04  
D23  
D24  
D25  
D26  
E01  
E02  
E03  
E24  
E25  
E26  
F01  
F02  
F25  
F26  
ABE3/SDQM3  
G01  
G02  
G25  
G26  
H01  
H02  
H25  
H26  
J01  
J02  
J10  
J11  
J12  
J13  
J14  
J15  
J16  
J17  
J18  
J25  
J26  
K01  
K02  
K10  
K11  
K12  
K13  
K14  
K15  
K16  
K17  
K18  
PPI1D11/PF43  
K25  
K26  
L01  
DATA10  
DATA13  
NC  
N12  
N13  
N14  
N15  
N16  
N17  
N18  
N25  
N26  
P01  
P02  
P10  
P11  
P12  
P13  
P14  
P15  
P16  
P17  
P18  
P25  
P26  
R01  
R02  
R10  
R11  
R12  
R13  
R14  
R15  
R16  
R17  
GND  
ADDR07  
GND  
PPI1D10/PF42  
DATA4  
GND  
GND  
ADDR05  
PPI1SYNC3  
PPI1CLK  
GND  
DATA7  
L02  
NC  
GND  
BYPASS  
RESET  
L10  
VDDEXT  
GND  
GND  
L11  
GND  
DATA6  
L12  
GND  
VDDINT  
DATA16  
DATA19  
PPI1D7  
PPI1D8/PF40  
VDDEXT  
GND  
GND  
DATA9  
L13  
GND  
GND  
CLKIN  
L14  
GND  
GND  
GND  
L15  
GND  
GND  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
DATA8  
L16  
GND  
GND  
L17  
GND  
ADDR04  
ADDR03  
PPI1SYNC1/TMR8  
PPI1SYNC2/TMR9  
GND  
L18  
VDDINT  
DATA12  
DATA15  
VROUT0  
GND  
L25  
GND  
L26  
GND  
M01  
M02  
M10  
M11  
M12  
M13  
M14  
M15  
M16  
M17  
M18  
M25  
M26  
N01  
N02  
N10  
N11  
GND  
GND  
GND  
VDDEXT  
GND  
GND  
GND  
GND  
GND  
GND  
VDDINT  
DATA18  
DATA21  
PPI1D5  
PPI1D6  
VDDEXT  
GND  
ADDR02  
DATA1  
DATA11  
XTAL  
GND  
GND  
PPI1D15/PF47  
PPI1D14/PF46  
GND  
NC  
GND  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
GND  
GND  
GND  
VDDINT  
DATA14  
DATA17  
VROUT1  
PPI1D9/PF41  
VDDEXT  
GND  
DATA0  
GND  
DATA3  
GND  
PPI1D13/PF45  
PPI1D12/PF44  
DATA2  
GND  
GND  
GND  
DATA5  
GND  
Rev. PrC  
|
Page 48 of 52  
|
April 2004  
Preliminary Technical Data  
ADSP-BF561  
Table 32. 297-Lead PBGA Pin Assignments (Continued)  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
MBGA Pin Name  
Pin No.  
W01  
W02  
W25  
W26  
Y01  
R18  
R25  
R26  
T01  
T02  
T10  
T11  
T12  
T13  
T14  
T15  
VDDINT  
DATA20  
DATA23  
PPI1D3  
PPI1D4  
VDDEXT  
GND  
T16  
T17  
T18  
T25  
T26  
U01  
U02  
U10  
U11  
U12  
U13  
GND  
U14  
U15  
U16  
U17  
U18  
U25  
U26  
V01  
V02  
V25  
V26  
GND  
PPI2SYNC1/TMR10  
PPI2SYNC2/TMR11  
DATA28  
GND  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
DATA24  
DATA27  
PPI2SYNC3  
PPI1D0  
VDDINT  
DATA22  
DATA25  
PPI1D1  
PPI1D2  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
DATA31  
PPI2D15/PF39  
PPI2D14/PF38  
DATA30  
Y02  
Y25  
GND  
Y26  
DT0PRI/PF18  
GND  
GND  
DATA26  
DATA29  
GND  
Rev. PrC  
|
Page 49 of 52  
|
April 2004  
ADSP-BF561  
Preliminary Technical Data  
OUTLINE DIMENSIONS  
Dimensions in the outline dimension figure are shown in  
millimeters.  
256-BALL MINI BGA  
(BC-256)  
a
12.00 BSC SQ  
9.75 BSC SQ  
CL  
A1 BALL  
PAD CORNER  
0.65 BSC  
BALL PITCH  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
G
H
J
CL  
K
L
M
N
P
R
T
16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
TOP VIEW  
BOTTOM VIEW  
0.25 MIN  
1.70  
1.51  
DETAIL A  
1.36  
SIDE VIEW  
0.10 MAX  
COPLANARITY  
NOTES  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. COMPLIES WITH JEDEC REGISTERED OUTLINE  
MO-225, WITH NO EXACT PACKAGE SIZE AND  
EXCEPTION TO PACKAGE HEIGHT.  
3. MINIMUM BALL HEIGHT 0.25  
SEATING PLANE  
0.45  
0.40  
0.35  
DETAIL A  
BALL DIAMETER  
Figure 29. 256-Ball Mini-Ball Grid Array  
Rev. PrC  
|
Page 50 of 52  
|
April 2004  
Preliminary Technical Data  
ADSP-BF561  
OUTLINE DIMENSIONS  
Dimensions in the outline dimension figure are shown in  
millimeters.  
297-BALL PBGA  
(B-297)  
a
27.00 BSC SQ  
25.00 BSC SQ  
A1 BALL  
PAD CORNER  
8.00  
CL  
1.00 BSC  
BALL PITCH  
A1 BALL  
PAD CORNER  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
8.00  
CL  
R
T
U
V
W
Y
AA  
AB  
AC  
AD  
AE  
AF  
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10  
9 8 7 6 5 4 3 2 1  
TOP VIEW  
BOTTOM VIEW  
0.40 MIN  
2.43  
2.23  
DETAIL A  
2.03  
SIDE VIEW  
0.20 MAX  
COPLANARITY  
NOTES  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. COMPLIES WITH JEDEC REGISTERED OUTLINE  
MS-034, VARIATION AAL-1.  
SEATING PLANE  
0.70  
DETAIL A  
3. MINIMUM BALL HEIGHT 0.40  
BALL DIAMETER  
0.60  
0.50  
Figure 30. 297-Ball PBGA Grid Array  
ORDERING GUIDE  
Part Number  
Ambient Temperature  
Instruction Rate  
Operating Voltage  
Range  
ADSP-BF561SKBCZ600  
ADSP-BF561SKBCZ500  
ADSP-BF561SBB500  
0ºC to +70ºC  
0ºC to +70ºC  
-40ºC to +85ºC  
600 MHz  
500 MHz  
500 MHz  
0.8 V to 1.2 V internal, 2.5 V or 3.3 V I/O  
0.8 V to 1.2 V internal, 2.5 V or 3.3 V I/O  
0.8 V to 1.2 V internal, 2.5 V or 3.3 V I/O  
Rev. PrC  
|
Page 51 of 52  
|
April 2004  
ADSP-BF561  
Preliminary Technical Data  
Rev. PrC  
|
Page 52 of 52  
|
April 2004  

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