ADSP-BF561SKBCZ600 [ADI]
Blackfin Embedded Symmetric Multi-Processor; Blackfin嵌入式对称多处理器型号: | ADSP-BF561SKBCZ600 |
厂家: | ADI |
描述: | Blackfin Embedded Symmetric Multi-Processor |
文件: | 总52页 (文件大小:508K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Blackfin® Embedded
Symmetric Multi-Processor
a
Preliminary Technical Data
FEATURES
ADSP-BF561
PERIPHERALS
Dual Symmetric 600 Mhz High Performance Blackfin Core
328 KBytes of On-chip Memory (See Memory Info on Page 3)
Each Blackfin Core Includes:
Two 16-Bit MACs, Two 40-Bit ALUs, Four 8-Bit Video ALUs,
40-Bit Shifter
RISC-Like Register and Instruction Model for Ease of Pro-
gramming and Compiler-Friendly Support
Advanced Debug, Trace, and Performance- Monitoring
0.8 - 1.2V core VDD with On-Chip Voltage Regulation
3.3V and 2.5V Tolerant I/O
Two Parallel Input/Output Peripheral Interface Units Sup-
porting ITU-R 656 Video and Glueless Interface to ADI
Analog Front End ADCs
Two Dual Channel, Full Duplex Synchronous Serial Ports Sup-
porting Eight Stereo I2S Channels
Dual 16 Channel DMA Controllers and one internal memory
DMA controller
12 General Purpose 32-bit Timer/Counters, with PWM
Capability
SPI-Compatible Port
UART with Support for IrDA®
Dual Watchdog Timers
256-Ball Mini BGA and 297-Ball PBGA Package Options
48 Programable Flags
On-Chip Phase Locked Loop Capable of 1x to 63x Frequency
Multiplication
IRQ CTRL/
JTAG TEST
IRQ CTRL/
TIMER
TIMER
EMULATION
B B
VOLTAGE
REGULATOR
UART
IRDA®
SPI
L1
L1
DATA
MEMORY
L1
L1
L2 SRAM
DATA
MMU
MMU
INSTRUCTION
MEMORY
INSTRUCTION
MEMORY
128 KBYTES
MEMORY
SPORT0
SPORT1
GPIO
IMDMA
CONTROLLER
CORE SYSTEM / BUS INTERFACE
EAB
DMA
CONTROLLER1
32
TIMERS
DMA
CONTROLLER2
DAB
PAB
16
BOOT ROM
16
32
DAB
EXTERNAL PORT
FLASH/SDRAM CONTROL
PPI
PPI
Figure 1. Functional Block Diagram
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.
Rev. PrC
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O.Box 9106, Norwood, MA 02062-9106 U.S.A.
Tel:781/329-4700
Fax:781/326-8703
www.analog.com
© 2004 Analog Devices, Inc. All rights reserved.
ADSP-BF561
Preliminary Technical Data
TABLE OF CONTENTS
General Description ................................................. 3
Portable Low-Power Architecture ............................. 3
Blackfin Processor Core .......................................... 3
Memory Architecture ............................................ 4
Internal (On-chip) Memory ................................. 4
External (Off-Chip) Memory ................................ 5
I/O Memory Space ............................................. 6
Booting ........................................................... 6
Event Handling ................................................. 6
Core Event Controller (CEC) ................................ 6
System Interrupt Controller (SIC) .......................... 6
Event Control ................................................... 7
DMA Controllers .................................................. 8
WatchDog Timers ................................................ 8
Serial Ports (SPORTs) ............................................ 9
Serial Peripheral Interface (SPI) Ports ........................ 9
UART Port .......................................................... 9
Programmable Flags (PFx) .................................... 10
Timers ............................................................. 10
Parallel Peripheral Interface ................................... 10
General Purpose Mode Descriptions .................... 10
Input Mode .................................................... 10
ITU -R 656 Mode Descriptions ........................... 10
Active Video Only Mode ................................... 10
Vertical Blanking Interval Mode .......................... 11
Entire Field Mode ............................................ 11
Dynamic Power Management ................................ 11
Full-On Operating Mode – Maximum Performance . 11
Active Operating Mode – Moderate Power Savings .. 11
Development Tools .............................................. 14
Designing an Emulator-Compatible
Processor Board (Target) ................................... 15
Additional Information ........................................ 15
Pin Descriptions .................................................... 16
Specifications ........................................................ 20
Recommended Operating Conditions ...................... 20
Electrical Characteristics ....................................... 20
Absolute Maximum Ratings ................................... 21
ESD Sensitivity ................................................... 21
Timing Specifications ........................................... 22
Clock and Reset Timing ..................................... 23
Asynchronous Memory Read Cycle Timing ............ 24
Asynchronous Memory Write Cycle Timing ........... 25
SDRAM Interface Timing .................................. 26
External Port Bus Request and Grant Cycle Timing .. 27
Parallel Peripheral Interface Timing ..................... 28
Serial Ports ..................................................... 29
Serial Peripheral Interface (SPI) Port—Master Timing 34
Serial Peripheral Interface (SPI) Port—Slave Timing . 36
Universal Asynchronous Receiver-Transmitter (UART)
Port—Receive and Transmit Timing .................. 38
Timer Cycle Timing .......................................... 39
Programmable Flags Cycle Timing ....................... 40
JTAG Test And Emulation Port Timing ................. 41
Power Dissipation ............................................... 42
Output Drive Currents ......................................... 42
Test Conditions .................................................. 42
Output Enable Time ......................................... 43
Output Disable Time ......................................... 43
Example System Hold Time Calculation ................... 43
Capacitive Loading .............................................. 44
256-ball MBGA Pin Configurations ............................ 45
297-ball PBGA Pin Configurations ............................. 47
Outline Dimensions ................................................ 50
Outline Dimensions ................................................ 51
Ordering Guide ..................................................... 51
Hibernate Operating Mode—Maximum Static Power
Savings ....................................................... 11
Sleep Operating Mode – High Power Savings ......... 11
Deep Sleep Operating Mode – Max. Power Savings .. 11
Power Savings ................................................. 12
Voltage Regulation .............................................. 12
Clock Signals ..................................................... 13
Booting Modes ................................................... 13
Instruction Set Description ................................... 14
REVISION HISTORY
Revision PrC:
• Edits made to pinlists and timing specification.
Rev. PrC
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April 2004
Preliminary Technical Data
ADSP-BF561
GENERAL DESCRIPTION
The ADSP-BF561 processor is a high-performance member of
the Blackfin family of products targeting a variety of multimedia
and telecommunications applications. At the heart of this device
are two independent Analog Devices Blackfin processors. These
Blackfin processors combine a dual-MAC state-of-the-art signal
processing engine, the advantage of a clean, orthogonal RISC-
like microprocessor instruction set, and single-instruction, mul-
tiple-data (SIMD) multimedia capabilities into a single
instruction-set architecture. The ADSP-BF561 device integrates
a general purpose set of digital imaging peripherals creating a
complete system on-chip solution for digital imaging and multi-
media applications.
Additional on-chip memory peripherals include:
• 128 KBytes of Low Latency On-chip SRAM
• Four Channel Internal Memory DMA Controller
• External Memory controller with glueless support for
SDRAM, SRAM, and Flash
PORTABLE LOW-POWER ARCHITECTURE
Blackfin processors provide world-class power management
and performance for embedded signal processing applications.
Blackfin processors are designed in a low power and low voltage
design methodology and feature Dynamic Power Management.
Dynamic Power Management is the ability to vary both the volt-
age and frequency of operation to significantly lower the overall
power dissipation. This translates into an exponential reduction
in power dissipation providing longer battery life to portable
applications.
The ADSP-BF561 processor has 328 KBytes of on-chip mem-
ory. Each Blackfin core includes:
• 16K Bytes of Instruction SRAM/Cache
• 16K Bytes of Instruction SRAM
• 32K Bytes of Data SRAM/Cache
• 32K Bytes of Data SRAM
BLACKFIN PROCESSOR CORE
As shown in Figure 2, each Blackfin core contains two multi-
plier/accumulators (MACs), two 40-bit ALUs, four video ALUs,
and a single shifter. The computational units process 8-bit, 16-
bit, or 32-bit data from the register file.
• 4K Bytes of Scratchpad SRAM
ADDRESS ARITHMETIC UNIT
SP
FP
I3
I2
I1
I0
L3
L2
L1
L0
B3
B2
B1
B0
M3
M2
M1
M0
DAG0
DAG1
P5
P4
P3
SEQUENCER
P2
P1
P0
ALIGN
DECODE
R7
R6
LOOP BUFFER
R5
R4
16
16
8
8
8
8
CONTROL
UNIT
R3
R2
R1
R0
BARREL
SHIFTER
40
40
A0
A1
DATA ARITHMETIC UNIT
Figure 2. Blackfin Processor Core
Rev. PrC
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April 2004
ADSP-BF561
Preliminary Technical Data
Each MAC performs a 16-bit by 16-bit multiply in every cycle,
with an accumulation to a 40-bit result, providing 8 bits of
extended precision. The ALUs perform a standard set of arith-
metic and logical operations. With two ALUs capable of
operating on 16- or 32-bit data, the flexibility of the computa-
tion units covers the signal processing requirements of a varied
set of application needs.
port a limited multi-issue capability, where a 32-bit instruction
can be issued in parallel with two 16-bit instructions, allowing
the programmer to use many of the core resources in a single
instruction cycle.
The Blackfin assembly language uses an algebraic syntax for
ease of coding and readability. The architecture has been opti-
mized for use in conjunction with the VisualDSP C/C++
compiler, resulting in fast and efficient software
implementations.
Each of the two 32-bit input registers can be regarded as two 16-
bit halves, so each ALU can accomplish very flexible single 16-
bit arithmetic operations. By viewing the registers as pairs of 16-
bit operands, dual 16-bit or single 32-bit operations can be
accomplished in a single cycle. By further taking advantage of
the second ALU, quad 16-bit operations can be accomplished
simply, accelerating the per cycle throughput.
MEMORY ARCHITECTURE
The ADSP-BF561 views memory as a single unified 4G-byte
address space, using 32-bit addresses. All resources including
internal memory, external memory, and I/O control registers
occupy separate sections of this common address space. The
memory portions of this address space are arranged in a hierar-
chical structure to provide a good cost/performance balance of
some very fast, low-latency memory as cache or SRAM very
close to the processor, and larger, lower-cost and performance-
memory systems farther away from the processor. The ADSP-
BF561 memory map is shown in Figure 3.
The powerful 40-bit shifter has extensive capabilities for per-
forming shifting, rotating, normalization, extraction, and
depositing of data. The data for the computational units is
found in a multi-ported register file of sixteen 16-bit entries or
eight 32-bit entries.
A powerful program sequencer controls the flow of instruction
execution, including instruction alignment and decoding. The
sequencer supports conditional jumps and subroutine calls, as
well as zero-overhead looping. A loop buffer stores instructions
locally, eliminating instruction memory accesses for tight
looped code.
The L1 memory system in each core is the highest-performance
memory available to each Blackfin core. The L2 memory pro-
vides additional capacity with lower performance. Lastly, the
off-chip memory system, accessed through the External Bus
Interface Unit (EBIU), provides expansion with SDRAM, flash
memory, and SRAM, optionally accessing more than 768M
bytes of physical memory. The memory DMA controllers pro-
vide high-bandwidth data-movement capability. They can
perform block transfers of code or data between the internal
L1/L2 memories and the external memory spaces.
Two data address generators (DAGs) provide addresses for
simultaneous dual operand fetches from memory. The DAGs
share a register file containing four sets of 32-bit Index, Modify,
Length, and Base registers. Eight additional 32-bit registers pro-
vide pointers for general indexing of variables and stack
locations.
Internal (On-chip) Memory
Blackfin processors support a modified Harvard architecture in
combination with a hierarchical memory structure. Level 1 (L1)
memories are those that typically operate at the full processor
speed with little or no latency. Level 2 (L2) memories are other
memories, on-chip or off-chip, that may take multiple processor
cycles to access. At the L1 level, the instruction memory holds
instructions only. The two data memories hold data, and a dedi-
cated scratchpad data memory stores stack and local variable
information. At the L2 level, there is a single unified memory
space, holding both instructions and data.
The ADSP-BF561 has four blocks of on-chip memory providing
high-bandwidth access to the core.
The first is the L1 instruction memory of each Blackfin core
consisting of 16K bytes of 4-way set-associative cache memory
and 16K bytes of SRAM. The cache memory may also be config-
ured as an SRAM. This memory is accessed at full processor
speed. When configured as SRAM, each of the two 16K banks of
memory is broken into 4K sub-banks which can be indepen-
dently accessed by the processor and DMA.
In addition, half of L1 instruction memory and half of L1 data
memories may be configured as either Static RAMs (SRAMs) or
caches. The Memory Management Unit (MMU) provides mem-
ory protection for individual tasks that may be operating on the
core and may protect system registers from unintended access.
The second on-chip memory block is the L1 data memory of
each Blackfin core which consists of four banks of 16K bytes
each. Two of the L1 data memory banks can be configured as
one way of a two-way set associative cache or as an SRAM. The
other two banks are configured as SRAM. All banks are accessed
at full processor speed. When configured as SRAM, each of the
four 16K banks of memory is broken into 4K sub-banks which
can be independently accessed by the processor and DMA.
The architecture provides three modes of operation: User mode,
Supervisor mode, and Emulation mode. User mode has
restricted access to certain system resources, thus providing a
protected software environment, while supervisor mode has
unrestricted access to the system and core resources.
The third memory block associated with each core is a 4K-byte
scratchpad SRAM which runs at the same speed as the L1 mem-
ories, but is only accessible as data SRAM (it cannot be
The Blackfin instruction set has been optimized so that 16-bit
op-codes represent the most frequently used instructions,
resulting in excellent compiled code density. Complex DSP
instructions are encoded into 32-bit op-codes, representing fully
featured multifunction instructions. Blackfin processors sup-
configured as cache memory and is not accessible via DMA).
Rev. PrC
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Preliminary Technical Data
ADSP-BF561
COREAMEMORYMAP
COREBMEMORYMAP
0xFFFF FFFF
CORE MMR REGISTERS
CORE MMR REGISTERS
0xFFE0 0000
0xFFC0 0000
0xFFB0 1000
0xFFB0 0000
0xFFA1 4000
0xFFA1 0000
0xFFA0 4000
0xFFA0 0000
0xFF90 8000
0xFF90 4000
0xFF90 0000
0xFF80 8000
0xFF80 4000
0xFF80 0000
SYSTEMMMR REGISTERS
RESERVED
L1 SCRATCHPAD SRAM (4K)
RESERVED
L1 INSTRUCTION SRAM/CACHE (16K)
RESERVED
L1 INSTRUCTION SRAM (16K)
RESERVED
RESERVED
L1 DATA BANK B SRAM/CACHE (16K)
L1 DATA BANK B SRAM (16K)
RESERVED
L1 DATA BANK A SRAM/CACHE (16K)
L1 DATA BANK A SRAM (16K)
0xFF80 0000
0xFF70 1000
INTERNAL MEMORY
RESERVED
L1 SCRATCHPAD SRAM(4K)
RESERVED
0xFF70 0000
0xFF61 4000
L1 INSTRUCTION SRAM/CACHE (16K)
RESERVED
0xFF61 0000
0xFF60 4000
L1 INSTRUCTION SRAM(16K)
RESERVED
RESERVED
0xFF60 0000
0xFF50 8000
L1 DATA BANK B SRAM/CACHE (16K)
L1 DATA BANK B SRAM (16K)
RESERVED
0xFF50 4000
0xFF50 0000
0xFF40 8000
0xFF40 4000
0xFF40 0000
L1 DATA BANK A SRAM/CACHE (16K)
L1 DATA BANK A SRAM (16K)
RESERVED
0xFEB2 0000
L2 SRAM(128K)
RESERVED
0xFEB0 0000
0xEF00 4000
0xEF00 0000
BOOT ROM
RESERVED
0x3000 0000
0x2C00 0000
ASYNC MEMORY BANK 3
ASYNC MEMORY BANK 2
ASYNC MEMORY BANK 1
ASYNC MEMORY BANK 0
0x2800 0000
EXTERNAL MEMORY
0x2400 0000
0x2000 0000
RESERVED
SDRAM BANK 3
SDRAM BANK 2
TopoflastSDRAMpage
SDRAM BANK 1
SDRAM BANK 0
0x0000 0000
Figure 3. Memory Map
The fourth on-chip memory system is the L2 SRAM memory
array which provides 128K bytes of high speed SRAM operating
at one half the bandwidth of the core, and slightly longer latency
than the L1 memory banks. The L2 memory is a unified instruc-
tion and data memory and can hold any mixture of code and
data required by the system design. The Blackfin cores share a
dedicated low-latency 64-bit wide data path port into the L2
SRAM memory.
(SDRAM) as well as up to four banks of asynchronous memory
devices including flash, EPROM, ROM, SRAM, and memory
mapped I/O devices.
The PC133-compliant SDRAM controller can be programmed
to interface to up to four banks of SDRAM, with each bank con-
taining between 16M bytes and 128M bytes providing access to
up to 512M bytes of SDRAM. Each bank is independently pro-
grammable and is contiguous with adjacent banks regardless of
the sizes of the different banks or their placement. This allows
flexible configuration and upgradability of system memory
while allowing the core to view all SDRAM as a single, contigu-
ous, physical address space.
Each Blackfin core processor has its own set of core Memory
Mapped Registers (MMRs) but share the same system MMR
registers and 128 KB L2 SRAM memory.
External (Off-Chip) Memory
The asynchronous memory controller can also be programmed
to control up to four banks of devices with very flexible timing
parameters for a wide variety of devices. Each bank occupies a
The ADSP-BF561 external memory is accessed via the External
Bus Interface Unit (EBIU). This interface provides a glueless
connection to up to four banks of synchronous DRAM
Rev. PrC
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April 2004
ADSP-BF561
Preliminary Technical Data
64M-byte segment regardless of the size of the devices used so
that these banks will only be contiguous if fully populated with
64M bytes of memory.
The ADSP-BF561 event controller consists of two stages, the
Core Event Controller (CEC) and the System Interrupt Control-
ler (SIC). The Core Event Controller works with the System
Interrupt Controller to prioritize and control all system events.
Conceptually, interrupts from the peripherals enter into the
SIC, and are then routed directly into the general-purpose inter-
rupts of the CEC.
I/O Memory Space
Blackfin processors do not define a separate I/O space. All
resources are mapped through the flat 32-bit address space. On-
chip I/O devices have their control registers mapped into mem-
ory-mapped registers (MMRs) at addresses near the top of the
4G-byte address space. These are separated into two smaller
blocks, one which contains the control MMRs for all core func-
tions, and the other which contains the registers needed for
setup and control of the on-chip peripherals outside of the core.
The core MMRs are accessible only by the core and only in
supervisor mode and appear as reserved space by on-chip
peripherals. The system MMRs are accessible by the core in
supervisor mode and can be mapped as either visible or reserved
to other devices, depending on the system protection model
desired.
Core Event Controller (CEC)
The CEC supports nine general-purpose interrupts (IVG15–7),
in addition to the dedicated interrupt and exception events. Of
these general-purpose interrupts, the two lowest-priority inter-
rupts (IVG15–14) are recommended to be reserved for software
interrupt handlers, leaving seven prioritized interrupt inputs to
support the peripherals of the ADSP-BF561. Table 1 describes
the inputs to the CEC, identifies their names in the Event Vector
Table (EVT), and lists their priorities.
Table 1. Core Event Controller (CEC)
Booting
Priority
Event Class
EVT Entry
(0 is Highest)
The ADSP-BF561 contains a small boot kernel, which config-
ures the appropriate peripheral for booting. If the ADSP-BF561
is configured to boot from boot ROM memory space, the pro-
cessor starts executing from the on-chip boot ROM.
0
Emulation/Test
Reset
EMU
RST
1
2
Non-Maskable
NMI
3
Exceptions
EVX
Event Handling
4
Global Enable
-
The event controller on the ADSP-BF561 handles all asynchro-
nous and synchronous events to the processor. The ADSP-
BF561 provides event handling that supports both nesting and
prioritization. Nesting allows multiple event service routines to
be active simultaneously. Prioritization ensures that servicing of
a higher-priority event takes precedence over servicing of a
lower-priority event. The controller provides support for five
different types of events:
5
Hardware Error
Core Timer
IVHW
IVTMR
IVG7
IVG8
IVG9
IVG10
IVG11
IVG12
IVG13
IVG14
IVG15
6
7
General Interrupt 7
General Interrupt 8
General Interrupt 9
General Interrupt 10
General Interrupt 11
General Interrupt 12
General Interrupt 13
General Interrupt 14
General Interrupt 15
8
9
10
11
12
13
14
15
• Emulation – An emulation event causes the processor to
enter emulation mode, allowing command and control of
the processor via the JTAG interface.
• Reset – This event resets the processor.
• Non-Maskable Interrupt (NMI) – The NMI event can be
generated by the software watchdog timer or by the NMI
input signal to the processor. The NMI event is frequently
used as a power-down indicator to initiate an orderly shut
down of the system.
System Interrupt Controller (SIC)
The System Interrupt Controller provides the mapping and
routing of events from the many peripheral interrupt sources, to
the prioritized general-purpose interrupt inputs of the CEC.
Although the ADSP-BF561 provides a default mapping, the user
can alter the mappings and priorities of interrupt events by writ-
ing the appropriate values into the Interrupt Assignment
Registers (IAR). Table 2 describes the inputs into the SIC and
the default mappings into the CEC.
• Exceptions – Events that occur synchronously to program
flow, i.e., the exception will be taken before the instruction
is allowed to complete. Conditions such as data alignment
violations, undefined instructions, etc. cause exceptions.
• Interrupts – Events that occur asynchronously to program
flow. They are caused by timers, peripherals, input pins,
and an explicit software instruction.
Each event has an associated register to hold the return address
and an associated return-from-event instruction. When an
event is triggered, the state of the processor is saved on the
supervisor stack.
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Preliminary Technical Data
ADSP-BF561
Table 2. Peripheral Interrupt Source Reset State
Table 2. Peripheral Interrupt Source Reset State (Continued)
Peripheral Interrupt Source
PLL wakeup
Chan1 IVG2
Peripheral Interrupt Source
Timer11 interrupt
Chan1 IVG2
0
IVG07
IVG07
IVG07
IVG07
IVG07
IVG07
IVG07
IVG07
IVG07
IVG07
IVG07
IVG08
IVG08
IVG08
IVG08
IVG08
IVG08
IVG08
IVG08
IVG08
IVG08
IVG08
IVG08
IVG09
IVG09
IVG09
IVG09
IVG09
IVG09
IVG09
IVG09
IVG09
IVG09
IVG09
IVG09
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
IVG10
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG08
IVG08
IVG09
IVG09
IVG12
IVG12
IVG13
IVG07
IVG07
IVG07
IVG07
DMA1 Error
1
FIO0 interrupt A
DMA2 Error
2
FIO0 interrupt B
IMDMA Error
3
FIO1 interrupt A
PPI1 Error
4
FIO1 interrupt B
PPI2 Error
5
FIO2 interrupt A
SPORT0 Error
6
FIO2 interrupt B
SPORT1 Error
7
DMA1 write/read 0 interrupt
DMA1 write/read1 interrupt
DMA2 write/read 0 interrupt
DMA2 write/read 1 interrupt
IMDMA write/read 0 interrupt
IMDMA write/read 1 interrupt
Watchdog Timer
SPI Error
8
UART Error
9
Reserved
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
DMA1 0 interrupt
DMA1 1 interrupt
DMA1 2 interrupt
DMA1 3 interrupt
DMA1 4 interrupt
DMA1 5 interrupt
DMA1 6 interrupt
DMA1 7 interrupt
DMA1 8 interrupt
DMA1 9 interrupt
DMA1 10 interrupt
DMA1 11 interrupt
DMA2 0 interrupt
DMA2 1 interrupt
DMA2 2 interrupt
DMA2 3 interrupt
DMA2 4 interrupt
DMA2 5 interrupt
DMA2 6 interrupt
DMA2 7 interrupt
DMA2 8 interrupt
DMA2 9 interrupt
DMA2 10 interrupt
DMA2 11 interrupt
Timer0 interrupt
Timer1 interrupt
Timer2 interrupt
Timer3 interrupt
Timer4 interrupt
Timer5 interrupt
Timer6 interrupt
Timer7 interrupt
Timer8 interrupt
Timer9 interrupt
Timer10 interrupt
Reserved
Reserved
Supplemental 0
Supplemental 1
1 Peripheral Interrupt Channel Number
2 Default User IVG Interrupt
Event Control
The ADSP-BF561 provides the user with a very flexible mecha-
nism to control the processing of events. In the CEC, three
registers are used to coordinate and control events. Each of the
registers, as follows, is 16-bits wide, while each bit represents a
particular event class:
• CEC Interrupt Latch Register (ILAT) – The ILAT register
indicates when events have been latched. The appropriate
bit is set when the processor has latched the event and
cleared when the event has been accepted into the system.
This register is updated automatically by the controller, but
may be written only when its corresponding IMASK bit is
cleared.
• CEC Interrupt Mask Register (IMASK) – The IMASK reg-
ister controls the masking and unmasking of individual
events. When a bit is set in the IMASK register, that event is
unmasked and will be processed by the CEC when asserted.
A cleared bit in the IMASK register masks the event
thereby preventing the processor from servicing the event
even though the event may be latched in the ILAT register.
This register may be read from or written to while in super-
visor mode. (Note that general-purpose interrupts can be
globally enabled and disabled with the STI and CLI instruc-
tions, respectively.)
• CEC Interrupt Pending Register (IPEND) – The IPEND
register keeps track of all nested events. A set bit in the
IPEND register indicates the event is currently active or
nested at some level. This register is updated automatically
by the controller but may be read while in supervisor mode.
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ADSP-BF561
Preliminary Technical Data
The SIC allows further control of event processing by providing
six 32-bit interrupt control and status registers. Each register
contains a bit corresponding to each of the peripheral interrupt
events shown in Table 2.
The 2D DMA capability supports arbitrary row and column
sizes up to 64K elements by 64K elements, and arbitrary row
and column step sizes up to +/- 32K elements. Furthermore, the
column step size can be less than the row step size, allowing
implementation of interleaved data streams. This feature is
especially useful in video applications where data can be de-
interleaved on the fly.
• SIC Interrupt Mask Register (SIC_IMASK0, SIC_IMASK1)
– This register controls the masking and unmasking of
each peripheral interrupt event. When a bit is set in the reg-
ister, that peripheral event is unmasked and will be
processed by the system when asserted. A cleared bit in the
register masks the peripheral event thereby preventing the
processor from servicing the event.
Examples of DMA types supported by the ADSP-BF561 DMA
controllers include:
• A single, linear buffer that stops upon completion
• A circular, auto-refreshing buffer that interrupts on each
full or fractionally full buffer
• SIC Interrupt Status Register (SIC_ISTAT0, SIC_ISTAT1)
– As multiple peripherals can be mapped to a single event,
this register allows the software to determine which periph-
eral event source triggered the interrupt. A set bit indicates
the peripheral is asserting the interrupt, a cleared bit indi-
cates the peripheral is not asserting the event.
• 1-D or 2-D DMA using a linked list of descriptors
• 2-D DMA using an array of descriptors, specifying only the
base DMA address within a common page
In addition to the dedicated peripheral DMA channels, each
DMA Controller has four memory DMA channels provided for
transfers between the various memories of the ADSP-BF561
system. These enable transfers of blocks of data between any of
the memories—including external SDRAM, ROM, SRAM, and
flash memory—with minimal processor intervention. Memory
DMA transfers can be controlled by a very flexible descriptor-
based methodology or by a standard register-based autobuffer
mechanism.
• SIC Interrupt Wakeup Enable Register (SIC_IWR0,
SIC_IWR1)– By enabling the corresponding bit in this reg-
ister, each peripheral can be configured to wake up the
processor, should the processor be in a powered down
mode when the event is generated. (For more information,
see Dynamic Power Management on Page 11.)
Because multiple interrupt sources can map to a single general-
purpose interrupt, multiple pulse assertions can occur simulta-
neously, before or during interrupt processing for an interrupt
event already detected on this interrupt input. The IPEND reg-
ister contents are monitored by the SIC as the interrupt
acknowledgement.
Further, the ADSP-BF561 has a four channel Internal Memory
DMA (IMDMA) Controller. The IMDMA Controller allows
data transfers between any of the internal L1 and L2 memories.
WATCHDOG TIMERS
The appropriate ILAT register bit is set when an interrupt rising
edge is detected (detection requires two core clock cycles). The
bit is cleared when the respective IPEND register bit is set. The
IPEND bit indicates that the event has entered into the proces-
sor pipeline. At this point the CEC will recognize and queue the
next rising edge event on the corresponding event input. The
minimum latency from the rising edge transition of the general-
purpose interrupt to the IPEND output asserted is three core
clock cycles; however, the latency can be much higher, depend-
ing on the activity within and the mode of the processor.
Each ADSP-BF561 core includes a 32-bit timer, which can be
used to implement a software watchdog function. A software
watchdog can improve system availability by forcing the proces-
sor to a known state, via generation of a hardware reset, non-
maskable interrupt (NMI), or general- purpose interrupt, if the
timer expires before being reset by software. The programmer
initializes the count value of the timer, enables the appropriate
interrupt, then enables the timer. Thereafter, the software must
reload the counter before it counts to zero from the pro-
grammed value. This protects the system from remaining in an
unknown state where software, which would normally reset the
timer, has stopped running due to an external noise condition
or software error.
DMA CONTROLLERS
The ADSP-BF561 has multiple, independent DMA controllers
that support automated data transfers with minimal overhead
for the DSP core. DMA transfers can occur between the ADSP-
BF561's internal memories and any of its DMA-capable periph-
erals. Additionally, DMA transfers can be accomplished
between any of the DMA-capable peripherals and external
devices connected to the external memory interfaces, including
the SDRAM controller and the asynchronous memory control-
ler. DMA-capable peripherals include the SPORTs, SPI port,
UART, and PPI. Each individual DMA-capable peripheral has
at least one dedicated DMA channel.
After a reset, software can determine if the watchdog was the
source of the hardware reset by interrogating a status bit in the
timer control register, which is set only upon a watchdog gener-
ated reset.
The timer is clocked by the system clock (SCLK), at a maximum
frequency of SCLK.
The ADSP-BF561 DMA controllers support both 1-dimen-
sional (1D) and 2-dimensional (2D) DMA transfers. DMA
transfer initialization can be implemented from registers or
from sets of parameters called descriptor blocks.
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ADSP-BF561
provide a full duplex, synchronous serial interface, which sup-
ports both master and slave modes and multimaster
environments.
SERIAL PORTS (SPORTS)
The ADSP-BF561 incorporates two dual-channel synchronous
serial ports (SPORT0 and SPORT1) for serial and multiproces-
sor communications. The SPORTs support the following
features:
Each SPI port’s baud rate and clock phase/polarities are pro-
grammable (see SPI Clock Rate equation), and each has an
integrated DMA controller, configurable to support transmit or
receive data streams. The SPI’s DMA controller can only service
unidirectional accesses at any given time.
• I2S capable operation.
• Bidirectional operation – Each SPORT has two sets of inde-
pendent transmit and receive pins, enabling eight channels
of I2S stereo audio.
fSCLK
SPI Clock Rate = ----------------------------------
2 × SPIBAUD
• Buffered (8-deep) transmit and receive ports – Each port
has a data register for transferring data words to and from
other DSP components and shift registers for shifting data
in and out of the data registers.
During transfers, the SPI ports simultaneously transmit and
receive by serially shifting data in and out on their two serial
data lines. The serial clock line synchronizes the shifting and
sampling of data on the two serial data lines.
• Clocking – Each transmit and receive port can either use an
external serial clock or generate its own, in frequencies
ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz.
UART PORT
• Word length – Each SPORT supports serial data words
from 3 to 32 bits in length, transferred most-significant-bit
first or least-significant-bit first.
The ADSP-BF561 provides a full duplex Universal Asynchro-
nous Receiver/Transmitter (UART) ports (UART0 and
UART1) fully compatible with PC-standard UARTs. The UART
ports provide a simplified UART interface to other peripherals
or hosts, supporting full duplex, DMA supported, asynchronous
transfers of serial data. Each UART port includes support for 5
to 8 data bits; 1 or 2 stop bits; and none, even, or odd parity. The
UART ports support two modes of operation, as follows:
• Framing – Each transmit and receive port can run with or
without frame sync signals for each data word. Frame sync
signals can be generated internally or externally, active high
or low, and with either of two pulsewidths and early or late
frame sync.
• Companding in hardware – Each SPORT can perform
A-law or µ-law companding according to ITU recommen-
dation G.711. Companding can be selected on the transmit
and/or receive channel of the SPORT without additional
latencies.
• PIO (Programmed I/O) – The processor sends or receives
data by writing or reading I/O-mapped UATX or UARX
registers, respectively. The data is double-buffered on both
transmit and receive.
• DMA (Direct Memory Access) – The DMA controller
transfers both transmit and receive data. This reduces the
number and frequency of interrupts required to transfer
data to and from memory. Each UART has two dedicated
DMA channels, one for transmit and one for receive. These
DMA channels have lower priority than most DMA chan-
nels because of their relatively low service rates.
• DMA operations with single-cycle overhead – Each SPORT
can automatically receive and transmit multiple buffers of
memory data. The DSP can link or chain sequences of
DMA transfers between a SPORT and memory.
• Interrupts – Each transmit and receive port generates an
interrupt upon completing the transfer of a data word or
after transferring an entire data buffer or buffers through
DMA.
Each UART port’s baud rate (see UART Clock Rate equation),
serial data format, error code generation and status, and inter-
rupts are programmable. In the UART Clock Rate equation, the
divisor (D) can be 1 to 65536.
• Multichannel capability – Each SPORT supports 128 chan-
nels out of a 1024-channel window and is compatible with
the H.100, H.110, MVIP-90, and HMVIP standards.
fSCLK
UART Clock Rate = ---------------
16 × D
SERIAL PERIPHERAL INTERFACE (SPI) PORTS
The ADSP-BF561 has one SPI-compatible ports that enable the
processor to communicate with multiple SPI-compatible
devices.
The UART programmable features include:
• Supporting bit rates ranging from (fSCLK/ 1048576) to
(fSCLK/16) bits per second.
The SPI interface uses three pins for transferring data: two data
pins (Master Output-Slave Input, MOSIx, and Master Input-
Slave Output, MISO) and a clock pin (Serial Clock, SCK). One
SPI chip select input pin (SPISS) let other SPI devices select the
DSP, and seven SPI chip select output pins (SPISEL7–1) let the
DSP select other SPI devices. The SPI select pins are reconfig-
ured Programmable Flag pins. Using these pins, the SPI ports
• Supporting data formats from 7 to12 bits per frame.
• Both transmit and receive operations can be configured to
generate maskable interrupts to the processor.
In conjunction with the general-purpose timer functions, auto-
baud detection is supported.
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ADSP-BF561
Preliminary Technical Data
The capabilities of UART0 are further extended with support
for the InfraRed Data Association (IrDA®) Serial InfraRed Phys-
ical Layer Link Specification (SIR) protocol.
addition to the twelve general-purpose programmable timers,
another timer is also provided for each core. These extra timers
are clocked by the internal processor clock (CCLK) and is typi-
cally used as a system tick clock for generation of operating
system periodic interrupts.
PROGRAMMABLE FLAGS (PFX)
The ADSP-BF561 has 48 bi-directional, general-purpose I/O,
Programmable Flag (PF47–0) pins. The Programmable Flag
pins have special functions for SPI port operation. Each pro-
grammable flag can be individually controlled as follows by
manipulation of the flag control, status, and interrupt registers:
PARALLEL PERIPHERAL INTERFACE
The processor provides two Parallel Peripheral Interfaces (PPI)
that can connect directly to parallel A/D and D/A converters,
ITU-R-601/656 video encoders and decoders, and other general
purpose peripherals. Each PPI consists of a dedicated input
clock pin, up to 3 frame synchronization pins, and up to 16 data
pins.
• Flag Direction Control Register – Specifies the direction of
each individual PFx pin as input or output.
• Flag Control and Status Registers – Rather than forcing the
software to use a read-modify-write process to control the
setting of individual flags, the ADSP-BF561 employs a
"write one to set" and "write one to clear" mechanism that
allows any combination of individual flags to be set or
cleared in a single instruction, without affecting the level of
any other flags. Two control registers are provided, one
register is written to in order to set flag values while
another register is written to in order to clear flag values.
Reading the flag status register allows software to interro-
gate the sense of the flags.
In ITU-R 656 mode, the PPI receives and parses a data stream of
8- bit or 10-bit data elements. On-chip decode of embedded
preamble control and synchronization information is
supported.
General Purpose Mode Descriptions
The general-purpose modes of the PPI are intended to suit a
wide variety of data capture and transmission applications. The
modes are divided into four main categories, each allowing up
to 16 bits of data transfer per PPI_CLK cycle:
• Data Receive with Internally Generated Frame Syncs.
• Data Receive with Externally Generated Frame Syncs.
• Data Transmit with Internally Generated Frame Syncs.
• Data Transmit with Externally Generated Frame Syncs.
• Flag Interrupt Mask Registers – The Flag Interrupt Mask
Registers allow each individual PFx pin to function as an
interrupt to the processor. Similar to the Flag Control Reg-
isters that are used to set and clear individual flag values,
one Flag Interrupt Mask Register sets bits to enable inter-
rupt function, and the other Flag Interrupt Mask register
clears bits to disable interrupt function. PFx pins defined as
inputs can be configured to generate hardware interrupts,
while output PFx pins can be configured to generate soft-
ware interrupts.
Input Mode
These modes support ADC/DAC connections, as well as video
communication with hardware signaling. Many of the modes
support more than one level of frame synchronization. If
desired, a programmable delay can be inserted between asser-
tion of a frame sync and reception / transmission of data.
• Flag Interrupt Sensitivity Registers – The Flag Interrupt
Sensitivity Registers specify whether individual PFx pins
are level- or edge-sensitive and specify-if edge-sensitive-
whether just the rising edge or both the rising and falling
edges of the signal are significant. One register selects the
type of sensitivity, and one register selects which edges are
significant for edge-sensitivity.
ITU -R 656 Mode Descriptions
Three distinct ITU-R 656 modes are supported:
• Active Video Only Mode
• Vertical Blanking Only Mode
• Entire Field Mode
TIMERS
There are fourteen (14) programmable timer units in the ADSP-
BF561. Twelve general-purpose timers have an external pin that
can be configured either as a Pulse Width Modulator (PWM) or
timer output, as an input to lock the timer, or for measuring
pulse widths of external events. Each of the twelve general-pur-
pose timer units can be independently programmed as a PWM,
internally or externally clocked timer, or pulse width counter.
The general-purpose timer units can be used in conjunction
with the UART to measure the width of the pulses in the data
stream to provide an auto-baud detect function for a serial
channel.
Active Video Only Mode
In this mode, the PPI does not read in any data between the End
of Active Video (EAV) and Start of Active Video (SAV) pream-
ble symbols, or any data present during the vertical blanking
intervals. In this mode, the control byte sequences are not stored
to memory; they are filtered by the PPI.
Vertical Blanking Interval Mode
In this mode, the PPI only transfers vertical blanking interval
(VBI) data, as well as horizontal blanking information and con-
trol byte sequences on VBI lines.
The general-purpose timers can generate interrupts to the pro-
cessor core providing periodic events for synchronization,
either to the processor clock or to a count of external signals. In
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ADSP-BF561
Table 3. Power Settings (Continued)
Entire Field Mode
In this mode, the entire incoming bitstream is read in through
the PPI. This includes active video, control preamble sequences,
and ancillary data that may be embedded in horizontal and ver-
tical blanking intervals.
Mode
PLL
PLL
Bypassed Clock
(CCLK) (SCLK)
Core
System Core
Clock
Power
Sleep
Enabled
–
Disabled Enabled On
Disabled Disabled On
Disabled Disabled Off
Though not explicitly supported, ITU,-656 output functionality
can be achieved by setting up the entire frame structure (includ-
ing active video, blanking and control information) in memory
and streaming the data out of the PPI in a frame sync-less mode.
The processor’s 2D DMA features facilitate this transfer by
allowing the static frame buffer (blanking and control codes) to
be placed in memory once, and simply updating the active video
information on per-frame basis.
Deep Sleep Disabled –
Hibernate Disabled –
Hibernate Operating Mode—Maximum Static Power
Savings
The Hibernate mode maximizes static power savings by dis-
abling the voltage and clocks to the processor core (CCLK) and
to all the synchronous peripherals (SCLK). The internal voltage
regulator for the processor can be shut off by writing b#00 to the
FREQ bits of the VR_CTL register. This disables both CCLK
and SCLK. Furthermore, it sets the internal power supply volt-
age (VDDINT) to 0 V to provide the lowest static power
dissipation. Any critical information stored internally (memory
contents, register contents, etc.) must be written to a non-vola-
tile storage device prior to removing power if the processor state
is to be preserved. Since VDDEXT is still supplied in this mode, all
of the external pins tri-state, unless otherwise specified. This
allows other devices that may be connected to the processor to
have power still applied without drawing unwanted current.
The internal supply regulator can be woken up by asserting the
RESET pin.
These modes support ADC/DAC connections, as well as video
communication with hardware signaling. Many of the modes
support more than one level of frame synchronization. If
desired, a programmable delay can be inserted between asser-
tion of a frame sync and reception/transmission of data.
DYNAMIC POWER MANAGEMENT
The ADSP-BF561 provides four operating modes, each with a
different performance/power profile. In addition, Dynamic
Power Management provides the control functions to dynami-
cally alter the processor core supply voltage, further reducing
power dissipation. Control of clocking to each of the ADSP-
BF561 peripherals also reduces power consumption. See Table 3
for a summary of the power settings for each mode.
Sleep Operating Mode—High Dynamic Power Savings
Full-On Operating Mode – Maximum Performance
The Sleep mode reduces power dissipation by disabling the
clock to the processor core (CCLK). The PLL and system clock
(SCLK), however, continue to operate in this mode. Typically an
external event will wake up the processor. When in the Sleep
mode, assertion of wakeup will cause the processor to sense the
value of the BYPASS bit in the PLL Control register (PLL_CTL).
In the Full-On mode, the PLL is enabled and is not bypassed,
providing capability for maximum operational frequency. This
is the default execution state in which maximum performance
can be achieved. The processor cores and all enabled peripherals
run at full speed.
Active Operating Mode – Moderate Power Savings
When in the Sleep mode, system DMA access to L1 memory is
not supported.
In the Active mode, the PLL is enabled but bypassed. Because
the PLL is bypassed, the processor’s core clock (CCLK) and sys-
tem clock (SCLK) run at the input clock (CLKIN) frequency. In
this mode, the CLKIN to CCLK multiplier ratio can be changed,
although the changes are not realized until the Full-On mode is
entered. DMA access is available to appropriately configured L1
memories.
Deep Sleep Operating Mode—Maximum Dynamic Power
Savings
The Deep Sleep mode maximizes power savings by disabling the
clocks to the processor cores (CCLK) and to all synchronous
peripherals (SCLK). Asynchronous peripherals will not be able
to access internal resources or external memory. This powered-
down mode can only be exited by assertion of the reset interrupt
(RESET). If BYPASS is disabled, the processor will transition to
the Full On mode. If BYPASS is enabled, the processor will tran-
sition to the Active mode.
In the Active mode, it is possible to disable the PLL through the
PLL Control register (PLL_CTL). If disabled, the PLL must be
re-enabled before transitioning to the Full-On or Sleep modes.
Table 3. Power Settings
Power Savings
Mode
PLL
PLL
Core
System Core
Clock Power
Bypassed Clock
As shown in Table 4, the ADSP-BF561 supports two different
power domains. The use of multiple power domains maximizes
flexibility, while maintaining compliance with industry stan-
dards and conventions. By isolating the internal logic of the
ADSP-BF561 into its own power domain, separate from the I/O,
(CCLK) (SCLK)
Full On
Active
Enabled No
Enabled Enabled On
Enabled Enabled On
Enabled/ Yes
Disabled
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ADSP-BF561
Preliminary Technical Data
the processor can take advantage of Dynamic Power Manage-
ment, without affecting the I/O devices. There are no
sequencing requirements for the various power domains.
The Power Savings Factor is calculated as:
Power Savings Factor
2
Table 4. ADSP-BF561 Power Domains
fCCLKRED
---------------------
fCCLKNOM
VDDINTRED
VDDINTNOM
TRED
------------
TNOM
⎛
⎝
⎞
⎠
⎛
⎝
⎞
⎠
--------------------------
=
×
×
Power Domain
All internal logic
I/O
VDD Range
VDDINT
VDDEXT
where the variables in the equations are:
• fCCLKNOM is the nominal core clock frequency
• fCCLKRED is the reduced core clock frequency
• VDDINTNOM is the nominal internal supply voltage
• VDDINTRED is the reduced internal supply voltage
• TNOM is the duration running at fCCLKNOM
• TRED is the duration running at fCCLKRED
The percent power savings is calculated as:
The power dissipated by a processor is largely a function of the
clock frequency of the processor and the square of the operating
voltage. For example, reducing the clock frequency by 25%
results in a 25% reduction in dynamic power dissipation, while
reducing the voltage by 25% reduces dynamic power dissipation
by more than 40%. Further, these power savings are additive, in
that if the clock frequency and supply voltage are both reduced,
the power savings can be dramatic.
The Dynamic Power Management feature of the ADSP-BF561
allows both the processor’s input voltage (VDDINT) and clock
frequency (fCCLK) to be dynamically controlled.
% Power Savings = (1 – Power Savings Factor) × 100%
The savings in power dissipation can be modeled using the
Power Savings Factor and % Power Savings calculations.
VOLTAGE REGULATION
The ADSP-BF561 processor provides an on-chip voltage regula-
tor that can generate processor core voltage levels 0.85V(-5% /
+10%) to 1.2V(-5% / +10%) from an external 2.25 V to 3.6 V
supply. Figure 4 shows the typical external components
required to complete the power management system. The regu-
lator controls the internal logic voltage levels and is
programmable with the Voltage Regulator Control Register
(VR_CTL) in increments of 50 mV. To reduce standby power
consumption, the internal voltage regulator can be programmed
to remove power to the processor core while keeping I/O power
(VDDEXT) supplied. While in hibernation, VDDEXT can still be
applied, eliminating the need for external buffers. The voltage
regulator can be activated from this powerdown state by assert-
ing RESET, which will then initiate a boot sequence. The
regulator can also be disabled and bypassed at the user’s
discretion.
Figure 4. Voltage Regulator Circuit
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Preliminary Technical Data
ADSP-BF561
into the SSEL fields define a divide ratio between the PLL output
(VCO) and the system clock. SCLK divider values are 1 through
15. Table 5 illustrates typical system clock ratios:
CLOCK SIGNALS
The ADSP-BF561 can be clocked by an external crystal, a sine
wave input, or a buffered, shaped clock derived from an external
clock oscillator.
Table 5. Example System Clock Ratios
If an external clock is used, it should be a TTL compatible signal
and must not be halted, changed, or operated below the speci-
fied frequency during normal operation. This signal is
connected to the processor’s CLKIN pin. When an external
clock is used, the XTAL pin must be left unconnected.
Signal Name Divider Ratio Example Frequency Ratios
SSEL[3–0]
VCO/SCLK
(MHz)
VCO
100
SCLK
100
50
0001
0110
1010
1:1
Alternatively, because the ADSP-BF561 includes an on-chip
oscillator circuit, an external crystal may be used. The crystal
should be connected across the CLKIN and XTAL pins, with
two capacitors connected as shown in Figure 5
6:1
300
10:1
500
50
The maximum frequency of the system clock is fSCLK. Note that
the divisor ratio must be chosen to limit the system clock fre-
quency to its maximum of fSCLK. The SSEL value can be changed
dynamically without any PLL lock latencies by writing the
appropriate values to the PLL divisor register (PLL_DIV).
Capacitor values are dependent on crystal type and should be
specified by the crystal manufacturer. A parallel-resonant, fun-
damental frequency, microprocessor-grade crystal should be
used.
The core clock (CCLK) frequency can also be dynamically
changed by means of the CSEL[1–0] bits of the PLL_DIV regis-
ter. Supported CCLK divider ratios are 1, 2, 4, and 8, as shown
in Table 6. This programmable core clock capability is useful for
fast core frequency modifications.
XTAL
CLKOUT
CLKIN
Table 6. Core Clock Ratios
Signal Name Divider Ratio Example Frequency Ratios
CSEL[1–0]
VCO/CCLK
VCO
500
500
200
200
CCLK
500
250
50
Figure 5. External Crystal Connections
00
01
10
11
1:1
2:1
4:1
8:1
As shown in Figure 6, the core clock (CCLK) and system
peripheral clock (SCLK) are derived from the input clock
(CLKIN) signal. An on-chip PLL is capable of multiplying the
CLKIN signal by a user programmable 1x to 63x multiplication
factor. The default multiplier is 10x, but it can be modified by a
software instruction sequence. On-the-fly frequency changes
can be effected by simply writing to the PLL_DIV register.
25
BOOTING MODES
The ADSP-BF561 has three mechanisms (listed in Table 7) for
automatically loading internal L1 instruction memory after a
reset. A fourth mode is provided to execute from external mem-
ory, bypassing the boot sequence.
“FINE” ADJUSTMENT
“COARSE” ADJUSTMENT
ON-THE-FLY
REQUIRES PLL SEQUENCING
Table 7. Booting Modes
BMODE1–0
Description
CCLK
SCLK
× 1, 2, 4, 8
× 1:15
00
Executefrom16-bitexternalmemory(Bypass
Boot ROM)
PLL
1× - 63×
CLKIN
VCO
01
10
11
Boot from 8/16-bit flash
Reserved
Boot from SPI serial ROM (16-bit address
range)
SCLK ≤ CCLK
SCLK ≤ 133 MHZ
Figure 6. Frequency Modification Methods
All on-chip peripherals are clocked by the system clock (SCLK).
The system clock frequency is programmable by means of the
SSEL3–0 bits of the PLL_DIV register. The values programmed
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Preliminary Technical Data
The BMODE pins of the Reset Configuration Register, sampled
during power-on resets and software-initiated resets, imple-
ment the following modes:
• All registers, I/O, and memory are mapped into a unified
4G-byte memory space providing a simplified program-
ming model.
• Execute from 16-bit external memory - Execution starts
from address 0x2000 0000 with 16-bit packing. The boot
ROM is bypassed in this mode. All configuration settings
are set for the slowest device possible (3-cycle hold time,
15-cycle R/W access times, 4-cycle setup).
• Microcontroller features, such as arbitrary bit and bit-field
manipulation, insertion, and extraction; integer operations
on 8-, 16-, and 32-bit data-types; and separate user and ker-
nel stack pointers.
• Code density enhancements, which include intermixing of
16- and 32-bit instructions (no mode switching, no code
segregation). Frequently used instructions are encoded as
16-bits.
• Boot from 8/16-bit external FLASH memory – The 8/16-bit
FLASH boot routine located in boot ROM memory space is
set up using Asynchronous Memory Bank 0. All configura-
tion settings are set for the slowest device possible (3-cycle
hold time; 15-cycle R/W access times; 4-cycle setup).
DEVELOPMENT TOOLS
The ADSP-BF561 is supported with a complete set of
CROSSCORETM software and hardware development tools,
including Analog Devices emulators and the VisualDSP++®
development environment. The same emulator hardware that
supports other Analog Devices processors also fully emulates
the ADSP-BF561.
• Boot from SPI serial EEPROM (16-bit addressable) – The
SPI uses the PF2 output pin to select a single SPI EPROM
device, submits a read command at address 0x0000, and
begins clocking data into the beginning of L1 instruction
memory. A 16-bit addressable SPI-compatible EPROM
must be used.
The VisualDSP++ project management environment lets pro-
grammers develop and debug an application. This environment
includes an easy-to-use assembler that is based on an algebraic
syntax, an archiver (librarian/library builder), a linker, a loader,
a cycle-accurate instruction-level simulator, a C/C++ compiler,
and a C/C++ run-time library that includes DSP and mathemat-
ical functions. A key point for these tools is C/C++ code
efficiency. The compiler has been developed for efficient trans-
lation of C/C++ code to Blackfin assembly. The Blackfin
processor has architectural features that improve the efficiency
of compiled C/C++ code.
For each of the boot modes, a boot loading protocol is used to
transfer program and data blocks, from an external memory
device, to their specified memory locations. Multiple memory
blocks may be loaded by any boot sequence. Once all blocks are
loaded, Core A program execution commences from the start of
L1 instruction SRAM (0xFFA0 0000). Core B remains in a held-
off state until a certain register bit is cleared. After that, Core B
will start execution at address 0xFF60 0000.
In addition, bit 4 of the Reset Configuration Register can be set
by application code to bypass the normal boot sequence during
a software reset. For this case, the processor jumps directly to
the beginning of L1 instruction memory.
The VisualDSP++ debugger has a number of important fea-
tures. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representa-
tion of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in com-
plexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity. Sta-
tistical profiling enables the programmer to non intrusively poll
the processor as it is running the program. This feature, unique
to VisualDSP++, enables the software developer to passively
gather important code execution metrics without interrupting
the real-time characteristics of the program. Essentially, the
developer can identify bottlenecks in software quickly and effi-
ciently. By using the profiler, the programmer can focus on
those areas in the program that impact performance and take
corrective action.
INSTRUCTION SET DESCRIPTION
The Blackfin processor family assembly language instruction set
employs an algebraic syntax that was designed for ease of coding
and readability. The instructions have been specifically tuned to
provide a flexible, densely encoded instruction set that compiles
to a very small final memory size. The instruction set also pro-
vides fully featured multifunction instructions that allow the
programmer to use many of the processor core resources in a
single instruction. Coupled with many features more often seen
on microcontrollers, this instruction set is very efficient when
compiling C and C++ source code. In addition, the architecture
supports both a user (algorithm/application code) and a super-
visor (O/S kernel, device drivers, debuggers, ISRs) mode of
operations, allowing multiple levels of access to core processor
resources.
Debugging both C/C++ and assembly programs with the Visu-
alDSP++ debugger, programmers can:
The assembly language, which takes advantage of the proces-
sor’s unique architecture, offers the following advantages:
• View mixed C/C++ and assembly code (interleaved source
and object information)
• Seamlessly integrated DSP/CPU features are optimized for
both 8-bit and 16-bit operations.
• Insert breakpoints
• A multi-issue load/store modified-Harvard architecture,
which supports two 16-bit MAC or four 8-bit ALU + two
load/store + two pointer updates per cycle.
• Set conditional breakpoints on registers, memory, and
stacks
• Trace instruction execution
• Perform linear or statistical profiling of program execution
Rev. PrC
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Page 14 of 52
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April 2004
Preliminary Technical Data
ADSP-BF561
• Fill, dump, and graphically plot the contents of memory
• Perform source level debugging
emulation is assured by the use of the processor’s JTAG inter-
face—the emulator does not affect target system loading or
timing.
• Create custom debugger windows
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the Blackfin processor family. Third
Party software tools include DSP libraries, real-time operating
systems, and block diagram design tools.
The VisualDSP++ IDE lets programmers define and manage
software development. Its dialog boxes and property pages let
programmers configure and manage all development tools,
including Color Syntax Highlighting in the VisualDSP++ edi-
tor. These capabilities permit programmers to:
DESIGNING AN EMULATOR-COMPATIBLE
PROCESSOR BOARD (TARGET)
• Control how the development tools process inputs and
generate outputs.
The Analog Devices family of emulators are tools that every sys-
tem developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG
Test Access Port (TAP) on the ADSP-BF561. The emulator uses
the TAP to access the internal features of the processor, allow-
ing the developer to load code, set breakpoints, observe
variables, observe memory, and examine registers. The proces-
sor must be halted to send data and commands, but once an
operation has been completed by the emulator, the processor is
set running at full speed with no impact on system timing.
• Maintain a one-to-one correspondence with the tool’s
command line switches.
The VisualDSP++ Kernel (VDK) incorporates scheduling and
resource management tailored specifically to address the mem-
ory and timing constraints of embedded, real-time
programming. These capabilities enable engineers to develop
code more effectively, eliminating the need to start from the
very beginning, when Developing new application code. The
VDK features include Threads, Critical and Unscheduled
regions, Semaphores, Events, and Device flags. The VDK also
supports Priority-based, Pre-emptive, Cooperative and Time-
Sliced scheduling approaches. In addition, the VDK was
designed to be scalable. If the application does not use a specific
feature, the support code for that feature is excluded from the
target system.
To use these emulators, the target board must include a header
that connects the processor’s JTAG port to the emulator.
For details on target board design issues including mechanical
layout, single processor connections, multiprocessor scan
chains, signal buffering, signal termination, and emulator pod
logic, see the EE-68: Analog Devices JTAG Emulation Technical
Reference on the Analog Devices web site (www.analog.com)—
use site search on “EE-68.” This document is updated regularly
to keep pace with improvements to emulator support.
Because the VDK is a library, a developer can decide whether to
use it or not. The VDK is integrated into the VisualDSP++
development environment, but can also be used with standard
command-line tools. When the VDK is used, the development
environment assists the developer with many error-prone tasks
and assists in managing system resources, automating the gen-
eration of various VDK based objects, and visualizing the
system state, when debugging an application that uses the VDK.
To use these emulators, the target board must include a header
that includes a header that connects the processor’s JTAG port
to the emulation.
ADDITIONAL INFORMATION
VCSE is Analog Devices technology for creating, using, and
reusing software components (independent modules of sub-
stantial functionality) to quickly and reliably assemble software
applications. Download components from the Web and drop
them into the application. Publish component archives from
within VisualDSP++. VCSE supports component implementa-
tion in C/C++ or assembly language.
This data sheet provides a general overview of the ADSP-BF561
architecture and functionality. For detailed information on the
Blackfin DSP family core architecture and instruction set, refer
to the ADSP-BF561 Hardware Reference and the Blackfin Family
Instruction Set Reference.
Use the Expert Linker to visually manipulate the placement of
code and data on the embedded system. View memory utiliza-
tion in a color-coded graphical form, easily move code and data
to different areas of the processor or external memory with the
drag of the mouse, examine run time stack and heap usage. The
Expert Linker is fully compatible with existing Linker Definition
File (LDF), allowing the developer to move between the graphi-
cal and textual environments.
Analog Devices’ emulators use the IEEE 1149.1 JTAG test access
port of the ADSP-BF561 to monitor and control the target
board processor during emulation. The emulator provides full-
speed emulation, allowing inspection and modification of mem-
ory, registers, and processor stacks. Non intrusive in-circuit
Rev. PrC
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Page 15 of 52
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April 2004
ADSP-BF561
Preliminary Technical Data
PIN DESCRIPTIONS
ADSP-BF561 pin definitions are listed in Table 8. Unused
inputs should be tied or pulled to VDDEXT or GND.
Table 8. Pin Descriptions
Block
Pin Name
Type Signals Function
Driver Pull-up/down requirement
Type
EBIU
ADDR[25:2]
O
24
32
4
Address Bus for Async/Sync Access
Data Bus for Async/Sync Access
none
none
none
A
A
A
DATA[31:0]
I/O
O
ABE[3:0]/SDQM[3:0]
Byte Enables/Data Masks for Async
/Sync Access
BG
O
I
1
1
1
1
1
1
1
1
1
1
4
4
1
1
1
1
8
8
1
1
1
1
8
8
1
1
1
1
1
1
1
1
1
1
Bus Grant
A
-
none
BR
Bus Request
pull-up required if function not used
BGH
O
O
O
O
O
O
O
O
O
O
I
Bus Grant Hang
Row Address Strobe
Column Address Strobe
Write Enable
A
A
A
A
A
B
B
A
A
A
-
none
EBIU
(SDRAM)
SRAS
none
SCAS
none
SWE
none
SCKE
Clock Enable
none
SCLK0/CLKOUT
SCLK1
SA10
Clock Output Pin 0
Clock Output Pin 1
SDRAM A10 Pin
Bank Select
none
none
none
SMS[3:0]
AMS[3:0]
ARDY
AOE
none
EBIU
(ASYNC)
Bank Select
none
Hardware Ready Control
Output Enable
Write Enable
pull-up required if function not used
none
O
O
O
A
A
A
C
C
-
AWE
none
ARE
Read Enable
none
PPI1
PPI2
JTAG
PPI1D[15:8] /PF[47:40] I/O
PPI Data / Programmable Flag Pins
PPI Data Pins
software configurable, none
software configurable, none
software configurable, none
software configurable, none
software configurable, none
software configurable, none
software configurable, none
software configurable, none
software configurable, none
software configurable, none
software configurable, none
software configurable, none
none
PPI1D[7:0]
I/O
I
PPI1CLK
PPI Clock
PPI1SYNC1/ TMR8
PPI1SYNC2/ TMR9
PPI1SYNC3
I/O
I/O
I/O
PPI Sync / Timer
PPI Sync / Timer
PPI Sync
C
C
C
C
C
-
PPI2D[15:8] /PF[39:32] I/O
PPI Data / Programmable Flag Pins
PPI Data Pins
PPI2D[7:0]
I/O
PPI2CLK
I
PPI Clock
PPI2SYNC1/ TMR10
I/O
PPI Sync / Timer
PPI Sync / Timer
PPI Sync
C
C
C
C
-
PPI2SYNC2/ TMR11
I/O
PPI2SYNC3
EMU
I/O
O
I
Emulation Output
JTAG Clock
TCK
internal pull-down
none
TDO
O
I
JTAG Serial Data Out
JTAG Serial Data In
JTAG Mode Select
JTAG Reset
C
-
TDI
internal pull-down
internal pull-down
TMS
I
-
TRST
I
-
external down necessary if JTAG not
used
Rev. PrC
|
Page 16 of 52
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April 2004
Preliminary Technical Data
ADSP-BF561
Table 8. Pin Descriptions (Continued)
Block
Pin Name
RX/PF27
TX/PF26
MOSI
Type Signals Function
Driver Pull-up/down requirement
Type
UART
I/O
I/O
I/O
1
1
1
UART Receive
/ Programmable Flag
C
software configurable,
no pull-up/down necessary
UART Transmit
/ Programmable Flag
C
C
software configurable,
no pull-up/down necessary
SPI
Master Out Slave In
software configurable,
no pull-up/down necessary
MISO
SCK
I/O
I/O
1
1
Master In Slave Out
SPI Clock
C
pull-up is necessary if booting via SPI
D
software configurable,
no pull-up/down necessary
SPORT0
RSCLK0/PF28
RFS0/PF19
I/O
I/O
I
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Sport0 / Programmable Flag
D
C
-
software configurable,
no pull-up/down necessary
Sport0 Receive Frame Sync
/ Programmable Flag
software configurable,
no pull-up/down necessary
DR0PRI
Sport0 Receive Data Primary
software configurable,
no pull-up/down necessary
DR0SEC/PF20
TSCLK0/PF29
TFS0/PF16
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
Sport0 Receive Data Secondary
/ Programmable Flag
C
D
C
C
C
D
C
-
software configurable,
no pull-up/down necessary
Sport0 Transmit Serial Clock
/ Programmable Flag
software configurable,
no pull-up/down necessary
Sport0 Transmit Frame Sync
/ Programmable Flag
software configurable,
no pull-up/down necessary
DT0PRI/PF18
DT0SEC/PF17
RSCLK1/PF30
RFS1/PF24
Sport0 Transmit Data Primary
/ Programmable Flag
software configurable,
no pull-up/down necessary
Sport0 Transmit Data Secondary
/ Programmable Flag
software configurable,
no pull-up/down necessary
SPORT1
Sport1 / Programmable Flag
software configurable,
no pull-up/down necessary
Sport1 Receive Frame Sync
/ Programmable Flag
software configurable,
no pull-up/down necessary
DR1PRI
Sport1 Receive Data Primary
software configurable,
no pull-up/down necessary
DR1SEC/PF25
TSCLK1/PF31
TFS1/PF21
I/O
I/O
I/O
I/O
I/O
Sport1 Receive Data Secondary
/ Programmable Flag
C
D
C
C
C
software configurable,
no pull-up/down necessary
Sport1 Transmit Serial Clock
/ Programmable Flag
software configurable,
no pull-up/down necessary
Sport1 Transmit Frame Sync
/ Programmable Flag
software configurable,
no pull-up/down necessary
DT1PRI/PF23
DT1SEC/PF22
Sport1 Transmit Data Primary
/ Programmable Flag
software configurable,
no pull-up/down necessary
Sport1 Transmit Data Secondary
/ Programmable Flag
software configurable,
no pull-up/down necessary
Rev. PrC
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Page 17 of 52
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April 2004
ADSP-BF561
Preliminary Technical Data
Table 8. Pin Descriptions (Continued)
Block
Pin Name
Type Signals Function
Driver Pull-up/down requirement
Type
PF/TIMER PF15/EXT CLK
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Programmable Flag
/ external timer clock input
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
software configurable,
no pull-up/down necessary
PF14
PF13
PF12
PF11
PF10
PF9
Programmable Flag
Programmable Flag
Programmable Flag
Programmable Flag
Programmable Flag
Programmable Flag
Programmable Flag
software configurable,
no pull-up/down necessary
software configurable,
no pull-up/down necessary
software configurable,
no pull-up/down necessary
software configurable,
no pull-up/down necessary
software configurable,
no pull-up/down necessary
software configurable,
no pull-up/down necessary
PF8
software configurable,
no pull-up/down necessary
PF7/SPISEL7/
TMR7
Programmable Flag / SPI Select
/ Timer
software configurable,
no pull-up/down necessary
PF6/SPISEL6/
TMR6
Programmable Flag / SPI Select
/ Timer
software configurable,
no pull-up/down necessary
PF5/SPISEL5/
TMR5
Programmable Flag / SPI Select
/ Timer
software configurable,
no pull-up/down necessary
PF4/SPISEL4/
TMR4
Programmable Flag / SPI Select
/ Timer
software configurable,
no pull-up/down necessary
PF3/SPISEL3/
TMR3
Programmable Flag / SPI Select
/ Timer
software configurable,
no pull-up/down necessary
PF2/SPISEL2/
TMR2
Programmable Flag / SPI Select
/ Timer
software configurable,
no pull-up/down necessary
PF1/SPISEL1/
TMR1
Programmable Flag / SPI Select
/ Timer
software configurable,
no pull-up/down necessary
PF0/SPISS/
TMR0
Programmable Flag / Slave SPI Select C
/ Timer
software configurable,
no pull-up/down necessary
Clock
CLKIN
Clock input
-
needs to be at a level or
clocking
Generator
XTAL
O
I
1
1
1
2
Crystal connection
Chip reset signal
Sleep
-
none
Mode
Controls
RESET
-
always active if core power on
none
SLEEP
O
I
C
-
BMODE[1:0]
Dedicated Mode Pin, Configures
the boot mode that is employed
following a hardware reset or
software reset
pull-up or pull-down required
BYPASS
NMI0
I
I
1
1
PLL BYPASS control
-
-
pull-up or pull-down required
Non Maskable interrupt Core A
pull-down required if function not
used
NMI1
I
1
2
Non Maskable interrupt Core B
Regulation output
-
-
pull-down required if function not
used
Regulator VROUT1-0
O
N/A
Rev. PrC
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Page 18 of 52
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April 2004
Preliminary Technical Data
ADSP-BF561
Table 8. Pin Descriptions (Continued)
Block
Pin Name
Type Signals Function
Driver Pull-up/down requirement
Type
Supplies
VDDEXT
VDDINT
P
23
14
41
2
Power Supply
Power Supply
Power Supply Return
NC
-
-
-
-
N/A
N/A
N/A
N/A
P
GND
G
No Connection
NC
Total pins
256
Rev. PrC
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Page 19 of 52
|
April 2004
ADSP-BF561
Preliminary Technical Data
SPECIFICATIONS
Note that component specifications are subject to change with-
out notice.
RECOMMENDED OPERATING CONDITIONS
Parameter
VDDINT
VDDEXT
VIH
Parameter
Minimum
0.8
Nominal
1.2
Maximum
TBD
Unit
Internal Supply Voltage
V
V
V
V
External Supply Voltage
High Level Input Voltage1, @ VDDEXT =maximum
Low Level Input Voltage2, @ VDDEXT=minimum
Ambient Operating Temperature
Industrial
2.25
2.5 or 3.3
3.6
2.0
3.6
VIL
–0.3
0.6
TAMBIENT
-40
0
85
70
ºC
ºC
Commercial
1 The ADSP-BF561 is 3.3 V tolerant (always accepts up to 3.6 V maximum VIH), but voltage compliance (on outputs, VOH) depends on the input VDDEXT, because VOH
(maximum) approximately equals VDDEXT (maximum). This 3.3 V tolerance applies to bi-directional and input only pins.
ELECTRICAL CHARACTERISTICS
Parameter
Test Conditions
Minimum
Maximum Unit
VOH
VOL
IIL
High Level Output Voltage1
@ VDDEXT =3.0V, IOH = –0.5 mA
2.4
V
Low Level Output Voltage1
Low Level Input Current2
High Level Input Current3
High Level Input Current4
Three-State Leakage Current5
Three-State Leakage Current5
Input Capacitance6, 7
@ VDDEXT =3.0V, IOL = 2.0 mA
0.4
V
@ VDDEXT =maximum, VIN = 0 V
@ VDDEXT =maximum, VIN = VDD maximum
@ VDDEXT =maximum, VIN = VDD maximum
@ VDDEXT = maximum, VIN = VDD maximum
@ VDDEXT = maximum, VIN = 0 V
fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V
-10
-10
V
IIH
10
50
10
µA
µA
µA
µA
pF
IIH
IOZH
IOZL
CIN
TBD
1 Applies to output and bidirectional pins.
2 Applies to all input pins.
3 Applies to all input pins except TCK, TDI, TMS, and TRST.
4 Applies to TCK, TDI, TMS, and TRST.
5 Applies to three-statable pins.
6 Applies to all signal pins.
7 Guaranteed, but not tested.
Rev. PrC
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Page 20 of 52
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April 2004
Preliminary Technical Data
ADSP-BF561
ABSOLUTE MAXIMUM RATINGS
Internal (Core) Supply Voltage1 (VDDINT
)
–0.3 V to +1.4 V
–0.3 V to +3.8 V
–0.5 V to 3.6 V
–0.5 V to VDDEXT +0.5 V
200 pF
External (I/O) Supply Voltage1 (VDDEXT
Input Voltage1
)
Output Voltage Swing1
Load Capacitance1 ,2
Core Clock (CCLK)1
ADSP-BF561SKBCZ600
ADSP-BF561SKBCZ500
System Clock (SCLK)1
Storage Temperature Range1
Junction Temperature Under Bias
Lead Temperature (5 seconds)1
600 MHz
500 MHz
133 MHz
–65ºC to +150ºC
125ºC
185ºC
1 Stresses greater than those listed above may cause permanent damage to the device.
These are stress ratings only. Functional operation of the device at these or any other
conditionsgreaterthanthoseindicatedintheoperationalsectionsofthisspecification
is notimplied. Exposuretoabsolutemaximumratingconditionsforextendedperiods
may affect device reliability.
2 For proper SDRAM controller operation, the maximum load capacitance is 50 pF (at
3.3V) or 30 pF (at 2.5V) for ADDR25-2, DATA31-0, ABE3-0/SDQM3-0, CLKOUT,
SCKE, SA10, SRAS, SCAS, SWE, and SMS.
ESD SENSITIVITY
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADSP-BF561 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precau-
tions are recommended to avoid performance degradation or loss of functionality.
Rev. PrC
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Page 21 of 52
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April 2004
ADSP-BF561
Preliminary Technical Data
TIMING SPECIFICATIONS
Table 9 and Table 12 describe the timing requirements for the
ADSP-BF561 clocks. Take care in selecting MSEL, SSEL, and
CSEL ratios so as not to exceed the maximum core clock, system
clock and Voltage Controlled Oscillator (VCO) operating fre-
quencies, as described in Absolute Maximum Ratings on
Page 21. Table 12 describes Phase-Locked Loop operating
conditions.
Table 9. Core and System Clock Requirements—ADSP-BF561SKBCZ500
Parameter
tCCLK
Minimum
Maximum
Maximum
Maximum
Unit
ns
Core Cycle Period (VDDINT=1.4 V– 50 mV)
Core Cycle Period (VDDINT=1.35 V–5%)
Core Cycle Period (VDDINT=1.2 V–5%)
Core Cycle Period (VDDINT=1.1 V–5%)
Core Cycle Period (VDDINT=1.0 V–5%)
Core Cycle Period (VDDINT=0.9 V–5%)
Core Cycle Period (VDDINT=0.8 V)
na
tCCLK
na
ns
tCCLK
2
ns
tCCLK
2.25
2.70
3.20
4.00
ns
tCCLK
ns
tCCLK
ns
tCCLK
ns
Table 10. Core and System Clock Requirements—ADSP-BF561SKBCZ600X
Parameter
tCCLK
Minimum
Unit
ns
Core Cycle Period (VDDINT=1.4 V– 50 mV)
Core Cycle Period (VDDINT=1.35 V–5%)
Core Cycle Period (VDDINT=1.2 V–5%)
Core Cycle Period (VDDINT=1.1 V–5%)
Core Cycle Period (VDDINT=1.0 V–5%)
Core Cycle Period (VDDINT=0.9 V–5%)
Core Cycle Period (VDDINT=0.8 V)
na
tCCLK
na
ns
tCCLK
1.66
2.25
2.70
3.20
4.00
ns
tCCLK
ns
tCCLK
ns
tCCLK
ns
tCCLK
ns
Table 11. Core and System Clock Requirements—ADSP-BF561SBB600
Parameter
tCCLK
Minimum
Unit
ns
Core Cycle Period (VDDINT=1.4 V– 50 mV)
Core Cycle Period (VDDINT=1.35 V–5%)
Core Cycle Period (VDDINT=1.2 V–5%)
Core Cycle Period (VDDINT=1.1 V–5%)
Core Cycle Period (VDDINT=1.0 V–5%)
Core Cycle Period (VDDINT=0.9 V–5%)
Core Cycle Period (VDDINT=0.8 V)
na
tCCLK
1.66
2.0
ns
tCCLK
ns
tCCLK
2.25
2.70
3.20
4.00
ns
tCCLK
ns
tCCLK
ns
tCCLK
ns
Table 12. Phase-Locked Loop Operating Conditions
Parameter
Minimum
Maximum
Maximum CCLK
Unit
MHz
Voltage Controlled Oscillator (VCO) Frequency
50
Rev. PrC
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Page 22 of 52
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April 2004
Preliminary Technical Data
ADSP-BF561
Clock and Reset Timing
Table 13 and Figure 7 describe clock and reset operations. Per
Figure 7, combinations of CLKIN and clock multipliers must
not select core/peripheral clocks in excess of 600/133 MHz.
Table 13. Clock and Reset Timing
Parameter
Min
Max
Unit
Timing Requirements
tCKIN
CLKIN Period
CLKIN Low Pulse1
CLKIN High Pulse1
RESET Asserted Pulsewidth Low2
25.0
100.0
ns
ns
ns
ns
tCKINL
tCKINH
tWRST
10.0
10.0
11 tCKIN
Switching Characteristics
tSCLK
CLKOUT Period3
7.54
ns
1 Applies to bypass mode and non-bypass mode.
2 Applies after power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2000 CLKIN cycles, while RESET is asserted,
assuming stable power supplies and CLKIN (not including start-up time of external clock oscillator).
3 The figure below shows a x2 ratio between tCKIN and tSCLK, but the ratio has many programmable options. For more information, see the System Design chapter of the ADSP-
BF561 Hardware Reference.
4 tSCLK must always also be larger than tC
.
LK
C
tCKIN
CLKIN
tCKINL
tCKINH
tWRST
RESET
tSCLKD
tSCLK
CLKOUT
Figure 7. Clock and Reset Timing
Rev. PrC
|
Page 23 of 52
|
April 2004
ADSP-BF561
Preliminary Technical Data
Asynchronous Memory Read Cycle Timing
Table 14. Asynchronous Memory Read Cycle Timing
Parameter
Min
Max
Unit
Timing Requirements
tSDAT
DATA15–0 Setup Before CLKOUT
DATA15–0 Hold After CLKOUT
ARDY Setup Before CLKOUT
ARDY Hold After CLKOUT
2.1
0.8
4.0
0.0
ns
ns
ns
ns
tHDAT
tSARDY
tHARDY
Switching Characteristic
tDO
Output Delay After CLKOUT1
tHO
Output Hold After CLKOUT 1
6.0
ns
ns
0.8
1 Output pins include AMS3–0, ABE3–0, ADDR25–2, AOE, ARE.
HOLD
1 CYCLE
SETUP
2 CYCLES
PROGRAMMED READ ACCESS
4 CYCLES
ACCESS EXTENDED
3 CYCLES
CLKOUT
tDO
tHO
AMSx
ABE1–0
BE, ADDRESS
ADDR19–1
AOE
tDO
tHO
ARE
tHARDY
tSARDY
tHARDY
ARDY
tSARDY
tSDAT
tHDAT
DATA15–0
READ
Figure 8. Asynchronous Memory Read Cycle Timing
Rev. PrC
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April 2004
Preliminary Technical Data
ADSP-BF561
Asynchronous Memory Write Cycle Timing
Table 15. Asynchronous Memory Write Cycle Timing
Parameter
Min
Max
Unit
Timing Requirements
tSARDY
tHARDY
Switching Characteristic
ARDY Setup Before CLKOUT
4.0
0.0
ns
ns
ARDY Hold After CLKOUT
tDDAT
tENDAT
tDO
DATA15–0 Disable After CLKOUT
6.0
6.0
ns
ns
ns
ns
DATA15–0 Enable After CLKOUT
Output Delay After CLKOUT1
Output Hold After CLKOUT 1
1.0
0.8
tHO
1 Output pins include AMS3–0, ABE3–0, ADDR25–2, DATA31–0, AOE, AWE.
ACCESS
EXTENDED
1 CYCLE
SETUP
2 CYCLES
HOLD
1 CYCLE
PROGRAMMED WRITE
ACCESS 2 CYCLES
CLKOUT
AMSx
tDO
tHO
ABE1–0
BE, ADDRESS
ADDR19–1
tDO
tHO
AWE
tHARDY
tSARDY
ARDY
tSARDY
tENDAT
tDDAT
DATA15–0
WRITE DATA
Figure 9. Asynchronous Memory Write Cycle Timing
Rev. PrC
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April 2004
ADSP-BF561
Preliminary Technical Data
SDRAM Interface Timing
Table 16. SDRAM Interface Timing
Parameter
Min
Max
Unit
Timing Requirement
tSSDAT
tHSDAT
Switching Characteristic
DATA Setup Before CLKOUT
2.1
0.8
ns
ns
DATA Hold After CLKOUT
tSCLK
CLKOUT Period
7.5
2.5
2.5
ns
ns
ns
ns
ns
ns
ns
tSCLKH
tSCLKL
tDCAD
tHCAD
tDSDAT
tENSDAT
CLKOUT Width High
CLKOUT Width Low
Command, ADDR, Data Delay After CLKOUT1
Command, ADDR, Data Hold After CLKOUT1
Data Disable After CLKOUT
6.0
6.0
0.8
1.0
Data Enable After CLKOUT
1 Command pins include: SRAS, SCAS, SWE, SDQM, SMS3-0, SA10, SCKE.
tSCLK
tSCLKH
CLKOUT
tSSDAT
tSCLKL
tHSDAT
DATA (IN)
tDCAD
tDSDAT
tENSDAT
tHCAD
DATA(OUT)
tDCAD
CMND ADDR
(OUT)
tHCAD
NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.
Figure 10. SDRAM Interface Timing
Rev. PrC
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April 2004
Preliminary Technical Data
ADSP-BF561
External Port Bus Request and Grant Cycle Timing
Table 17 and Figure 11 describe external port bus request and
bus grant operations.
Table 17. External Port Bus Request and Grant Cycle Timing
Parameter, 1, 2
Min
Max
Unit
Timing Requirements
tBS
BR asserted to CLKOUT high setup
4.6
0.0
ns
ns
tBH
CLKOUT high to BR de-asserted hold time
Switching Characteristics
tSD
CLKOUT low to SMS, address, and RD/WR disable
4.5
4.5
3.6
3.6
3.6
3.6
ns
ns
ns
ns
ns
ns
tSE
CLKOUT low to SMS, address, and RD/WR enable
CLKOUT high to BG asserted setup
tDBG
tEBG
tDBH
tEBH
CLKOUT high to BG de-asserted hold time
CLKOUT high to BGH asserted setup
CLKOUT high to BGH de-asserted hold time
1 These are preliminary timing parameters that are based on worst-case operating conditions.
2 The pad loads for these timing parameters are 20 pF.
CLKOUT
tB S
tB H
BR
tS D
tSE
AM Sx
tS D
tSE
ADDR25-2
ABE3-0
tS D
tSE
AWE
ARE
tD B G
tE B G
BG
tD B H
tE B H
BG H
Figure 11. External Port Bus Request and Grant Cycle Timing
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April 2004
ADSP-BF561
Preliminary Technical Data
Parallel Peripheral Interface Timing
Table 18, Figure 12, describes Parallel Peripheral Interface
operations.
Table 18. Parallel Peripheral Interface Timing
Parameter
Min
Max
Unit
Timing Requirements
tPCLKW
tPCLK
PPIx_CLK Width1
PPI_CLK Period1
6.0
ns
ns
15.0
Timing Requirements
tSFSPE
tHFSPE
tSDRPE
tHDRPE
External Frame Sync Setup Before PPI_CLK
3.0
ns
ns
ns
ns
External Frame Sync H old After PPI_CLK
Receive Data Setup Before PPI_CLK
Receive Data Hold After PPI_CLK
3.0
TBD
TBD
Switching Characteristics
tDFSPE
Internal Frame Sync Delay After PPI_CLK
10.0
10.0
ns
ns
ns
ns
tHOFSPE Internal Frame Sync Hold After PPI_CLK
0.0
0.0
tDDTPE
Transmit Data Delay After PPI_CLK
tHDTPE
Transmit Data Hold After PPI_CLK
1 PPI_CLK frequency cannot exceed fSCLK/2
D R IV E
E D G E
S A M P L E
E D G E
tP C LK W
P P I_ C L K
tD F S P E
tH O FS P E
tS F S P E
tH F S P E
PP I_ FS 1
PP I_ FS 2
tD D T P E
tS D R P E
tH D R P E
tH D T P E
P P Ix
Figure 12. Timing Diagram PPI
Rev. PrC
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April 2004
Preliminary Technical Data
ADSP-BF561
Serial Ports
Table 19 through Table 24 on Page 30 and Figure 13 on Page 31
through Figure 15 on Page 33 describe Serial Port operations.
Table 19. Serial Ports—External Clock
Parameter
Min
Max
Max
Max
Unit
Timing Requirements
tSFSE
TFS/RFS Setup Before TSCLK/RSCLK1
TFS/RFS Hold After TSCLK/RSCLK1
Receive Data Setup Before RSCLK1
Receive Data Hold After RSCLK1
TSCLK/RSCLK Width
3.0
3.0
3.0
3.0
4.5
15.0
ns
ns
ns
ns
ns
ns
tHFSE
tSDRE
tHDRE
tSCLKW
tSCLK
TSCLK/RSCLK Period
1 Referenced to sample edge.
Table 20. Serial Ports—Internal Clock
Parameter
Min
Unit
Timing Requirements
tSFSI
TFS/RFS Setup Before TSCLK/RSCLK1
TBD
TBD
6.0
ns
ns
ns
ns
ns
ns
tHFSI
TFS/RFS Hold After TSCLK/RSCLK1
Receive Data Setup Before RSCLK1
Receive Data Hold After RSCLK1
TSCLK/RSCLK Width
tSDRI
tHDRI
tSCLKW
tSCLK
0.0
4.5
TSCLK/RSCLK Period
15.0
1 Referenced to sample edge.
Table 21. Serial Ports—External Clock
Parameter
Min
Unit
Switching Characteristics
tDFSE
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)1
10.0
10.0
ns
ns
ns
ns
tHOFSE
TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)1
Transmit Data Delay After TSCLK1
0.0
0.0
tDDTE
tHDTE
Transmit Data Hold After TSCLK1
1 Referenced to drive edge.
Rev. PrC
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April 2004
ADSP-BF561
Preliminary Technical Data
Table 22. Serial Ports—Internal Clock
Parameter
Min
Max
Unit
Switching Characteristics
tDFS
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)1
TBD
TBD
ns
ns
ns
ns
ns
I
tHOFS
TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)1
Transmit Data Delay After TSCLK1
TBD
I
tDDT
I
tHDT
Transmit Data Hold After TSCLK1
TBD
4.5
I
tSCLKIW
TSCLK/RSCLK Width
1 Referenced to drive edge.
Table 23. Serial Ports—Enable and Three-State
Parameter
Min
Max
Unit
Switching Characteristics
tDTENE
Data Enable Delay from External TSCLK1
TBD
TBD
ns
ns
ns
ns
tDDTTE
Data Disable Delay from External TSCLK1
Data Enable Delay from Internal TSCLK
Data Disable Delay from Internal TSCLK1
TBD
TBD
tDTENI
tDDTTI
1 Referenced to drive edge.
Table 24. External Late Frame Sync
Parameter
Min
Max
Unit
Switching Characteristics
tDDTLFSE
Data Delay from Late External TFS or External RFS with MCE = 1, MFD
TBD
ns
ns
= 01,2
tDTENLFSE
Data Enable from late FS or MCE = 1, MFD = 01,2
TBD
1 MCE = 1, TFS enable and TFS valid follow tDDTENFS and tDDTLFSE
2 If external RFS/TFS setup to RSCLK/TSCLK > tSCLK/2 then tDDTLSCK and tDTENLSCK apply, otherwise tDDTLFSE and tDTENLFS apply.
.
Rev. PrC
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April 2004
Preliminary Technical Data
ADSP-BF561
DATA RECEIVE— INTERNAL CLOCK
DATA RECEIVE— EXTERNAL CLOCK
DRIVE EDGE SAMPLE EDGE
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
RCLK
RCLK
tDFSE
tDFSE
tSFSE
tHOFSE
tSFSI
tHFSI
tHOFSE
tHFSE
RFS
DR
RFS
DR
tHDRE
tSDRI
tHDRI
tSDRE
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK, TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT — INTERNAL CLOCK
DATA TRANSMIT — EXTERNAL CLOCK
DRIVE EDGE
SAMPLE EDGE
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
TCLK
TCLK
tDFSI
tDFSE
tHOFSI
tSFSI
tHFSI
tHOFSE
tSFSE
tHFSE
TFS
DT
TFS
DT
tDDTE
tDDTI
tHDTE
tHDTI
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK OR TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DRIVE EDGE
DRIVE EDGE
TCLK (EXT)
TFS (“LATE”, EXT)
TCLK/RCLK
tDDTEN
tDDTTE
DT
DRIVE EDGE
DRIVE EDGE
TCLK (INT)
TFS (“LATE”, INT)
TCLK/RCLK
tDDTIN
tDDTTI
DT
Figure 13. Serial Ports
Rev. PrC
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April 2004
ADSP-BF561
Preliminary Technical Data
EXTERNAL RFS WITH MCE= 1, MFD = 0
DRIVE SAMPLE
DRIVE
RSCLK
tSFSE/I
tHOFSE/I
RFS
tDDTE/I
tHDTE/I
tDDTENFS
1ST BIT
2ND BIT
DT
tDDTLFSE
LATE EXTERNAL TFS
DRIVE
SAMPLE
DRIVE
TSCLK
TFS
tHOFSE/I
tSFSE/I
tDDTE/I
tHDTE/I
tDDTENFS
DT
1ST BIT
2ND BIT
tDDTLFSE
Figure 14. External Late Frame Sync (Frame Sync Setup < tSCLK/2)
Rev. PrC
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April 2004
Preliminary Technical Data
ADSP-BF561
EXTERNAL RFS WITH MCE=1, MFD=0
DRIVE
SAMPLE
DRIVE
RSCLK
RFS
tSFSE/I
tHOFSE/I
tDDTE/I
tHDTE/I
tDTENLSCK
DT
1ST BIT
2ND BIT
tDDTLSCK
LATE EXTERNAL TFS
DRIVE SAMPLE
DRIVE
TSCLK
TFS
tSFSE/I
tHOFSE/I
tDDTE/I
tHDTE/I
tDTENLSCK
DT
1ST BIT
2ND BIT
tDDTLSCK
Figure 15. External Late Frame Sync (Frame Sync Setup > tSCLK/2)
Rev. PrC
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April 2004
ADSP-BF561
Preliminary Technical Data
Serial Peripheral Interface (SPI) Port—Master Timing
Table 25 and Figure 16 describe SPI port master operations.
Table 25. Serial Peripheral Interface (SPI) Port—Master Timing
Parameter
Min
Max
Unit
Timing Requirements
tSSPIDM
tHSPIDM
Data input valid to SCK edge (data input setup)
SCK sampling edge to data input invalid
TBD
TBD
ns
ns
Switching Characteristics
tSDSCIM
tSPICHM
tSPICLM
tSPICLK
SPISELx low to first SCK edge
2tSCLK-1.5
2tSCLK-1.5
2tSCLK-1.5
4tSCLK-1.5
2tSCLK-1.5
2tSCLK-1.5
TBD
ns
ns
ns
ns
ns
ns
ns
ns
Serial clock high period
Serial clock low period
Serial clock period
tHDSM
Last SCK edge to SPISELx high
Sequential transfer delay
tSPITDM
tDDSPIDM
tHDSPIDM
SCK edge to data out valid (data out delay)
SCK edge to data out invalid (data out hold)
TBD
TBD
TBD
Rev. PrC
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April 2004
Preliminary Technical Data
ADSP-BF561
SPISELx
(OUTPUT)
tSPICLK
tHDSM
tSPITDM
tSDSCIM
tSPICHM
tSPICLM
SCK
(CPOL = 0)
(OUTPUT)
tSPICLM
tSPICHM
SCK
(CPOL = 1)
(OUTPUT)
tDDSPIDM
tHDSPIDM
MOSI
(OUTPUT)
MSB
LSB
CPHA=1
tSSPIDM
tHSPIDM
tSSPIDM
tHSPIDM
MISO
(INPUT)
MSB VALID
LSB VALID
tDDSPIDM
tHDSPIDM
MOSI
(OUTPUT)
MSB
LSB
CPHA=0
tSSPIDM
tHSPIDM
MISO
(INPUT)
MSB VALID
LSB VALID
Figure 16. Serial Peripheral Interface (SPI) Port—Master Timing
Rev. PrC
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April 2004
ADSP-BF561
Preliminary Technical Data
Serial Peripheral Interface (SPI) Port—Slave Timing
Table 26 and Figure 17 describe SPI port slave operations.
Table 26. Serial Peripheral Interface (SPI) Port—Slave Timing
Parameter
Min
Max
Unit
Timing Requirements
tSPICHS
tSPICLS
tSPICLK
tHDS
Serial clock high period
2tSCLK-1.5
2tSCLK-1.5
4tSCLK-1.5
2tSCLK-1.5
2tSCLK-1.5
2tSCLK-1.5
1.6
ns
ns
ns
ns
ns
ns
ns
ns
Serial clock low period
Serial clock period
Last SCK edge to SPISS not asserted
Sequential Transfer Delay
tSPITDS
tSDSCI
tSSPID
tHSPID
SPISS assertion to first SCK edge
Data input valid to SCK edge (data input setup)
SCK sampling edge to data input invalid
1.6
Switching Characteristics
tDSOE
SPISS assertion to data out active
0
0
0
0
8
ns
ns
ns
ns
tDSDHI
tDDSPID
tHDSPID
SPISS deassertion to data high impedance
SCK edge to data out valid (data out delay)
SCK edge to data out invalid (data out hold)
8
10
10
Rev. PrC
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April 2004
Preliminary Technical Data
ADSP-BF561
SPISS
(INPUT)
tSPICHS
tSPICLS
tSPICLK
tHDS
tSPITDS
SCK
(CPOL = 0)
(INPUT)
tSDSCI
tSPICLS
tSPICHS
SCK
(CPOL = 1)
(INPUT)
tDSOE
tDDSPID
tHDSPID
MSB
tDDSPID
tDSDHI
LSB
MISO
(OUTPUT)
tHSPID
tSSPID
CPHA=1
tSSPID
tHSPID
MOSI
(INPUT)
MSB VALID
LSB VALID
tDSOE
tDDSPID
tDSDHI
MISO
(OUTPUT)
MSB
LSB
tHSPID
CPHA=0
tSSPID
MOSI
(INPUT)
MSB VALID
LSB VALID
Figure 17. Serial Peripheral Interface (SPI) Port—Slave Timing
Rev. PrC
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April 2004
ADSP-BF561
Preliminary Technical Data
Universal Asynchronous Receiver-Transmitter (UART)
Port—Receive and Transmit Timing
Figure 18 describes UART port receive and transmit operations.
The maximum baud rate is SCLK/16. As shown in Figure 18
there is some latency between the generation internal UART
interrupts and the external data operations. These latencies are
negligible at the data transmission rates for the UART.
CLKOUT
(SAMPLE CLOCK)
RXD
DATA(5–8)
STOP
RECEIVE
INTERNAL
UART RECEIVE
INTERRUPT
UART RECEIVE BIT SET BY DATA STOP;
CLEARED BY FIFO READ
START
TXD
DATA(5–8)
STOP (1–2)
AS DATA
WRITEN TO
BUFFER
TRANSMIT
INTERNAL
UART TRANSMIT
INTERRUPT
UART TRANSMIT BIT SET BY PROGRAM;
CLEARED BY WRITE TO TRANSMIT
Figure 18. UART Port—Receive and Transmit Timing
Rev. PrC
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April 2004
Preliminary Technical Data
ADSP-BF561
Timer Cycle Timing
Table 27 and Figure 19 describe timer expired operations. The
input signal is asynchronous in “width capture mode” and
“external clock mode” and has an absolute maximum input fre-
quency of fSCLK/2 MHz.
Table 27. Timer Cycle Timing
Parameter
Min
Max
Unit
Timing Characteristics
tWL
Timer Pulsewidth Input Low1
Timer Pulsewidth Input High1
1
1
SCLK cycles
SCLK cycles
tWH
Switching Characteristic
tHTO
Timer Pulsewidth Output2
1
(232–1)
SCLK cycles
1 The minimum pulsewidths apply for TMRx input pins in width capture and external clock modes. They also apply to the PF1 or PPICLK input pins in PWM output mode.
2 The minimum time for tHTO is one cycle, and the maximum time for tHTO equals (232–1) cycles.
CLKOUT
tHTO
TMRx
(PWM OUTPUT MODE)
TMRx
tWL
tWH
(WIDTH CAPTURE AND
EXTERNAL CLOCK MODES)
Figure 19. Timer PWM_OUT Cycle Timing
Rev. PrC
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April 2004
ADSP-BF561
Preliminary Technical Data
Programmable Flags Cycle Timing
Table 28 and Figure 20 describe programmable flag operations.
Table 28. Programmable Flags Cycle Timing
Parameter
Min
Max
Unit
Timing Requirement
tWFI
Switching Characteristic
tDFO Flag output delay from CLKOUT low
Flag input pulsewidth
tSCLK + 1
ns
ns
TBD
CLKOUT
tDFO
PF (OUTPUT)
FLAG OUTPUT
FLAG INPUT
tWFI
PF (INPUT)
Figure 20. Programmable Flags Cycle Timing
Rev. PrC
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April 2004
Preliminary Technical Data
ADSP-BF561
JTAG Test And Emulation Port Timing
Table 29 and Figure 21 describe JTAG port operations.
Table 29. JTAG Port Timing
Parameter
Min
Max
Unit
Timing Parameters
tTCK
TCK Period
20
4
ns
tSTAP
tHTAP
tSSYS
tHSYS
tTRSTW
TDI, TMS Setup Before TCK High
TDI, TMS Hold After TCK High
System Inputs Setup Before TCK High1
System Inputs Hold After TCK High1
TRST Pulsewidth2
ns
4
ns
4
ns
5
ns
4
TCK cycles
Switching Characteristics
tDTDO TDO Delay from TCK Low
tDSYS
System Outputs Delay After TCK Low3
10
12
ns
ns
0
1 System Inputs=DATA31-0, ARDY, TMR2-0, PF47-0, PPIx_CLK, RSCLK0-1, RFS0-1, DR0PRI, DR0SEC, TSCLK0-1, TFS0-1, DR1PRI, DR1SEC, MOSI, MISO, SCK, RX,
RESET, NMI, BMODE1-0, BR, PPIxD7-0.
2 50 MHz max.
3 System Outputs=DATA31-0, ADDR25-2, ABE3-0, AOE, ARE, AWE, AMS3-0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS3-0, PF47-0, RSCLK0-1, RFS0-1, TSCLK0-
1, TFS0-1, DT0PRI, DT0SEC, DT1PRI, DT1SEC, MOSI, MISO, SCK, TX, BG, BGH, PPIxD7-0.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 21. JTAG Port Timing
Rev. PrC
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April 2004
ADSP-BF561
Preliminary Technical Data
POWER DISSIPATION
Total power dissipation has two components, one due to inter-
nal circuitry (PINT) and one due to the switching of external
output drivers (PEXT). Table 30 shows the power dissipation for
internal circuitry (VDDINT). Internal power dissipation is depen-
dent on the instruction execution sequence and the data
operands involved.
The external component is calculated using:
PEXT = O × C × V2DD × f
The frequency f includes driving the load high and then back
low. For example: DATA15–0 pins can drive high and low at a
maximum rate of 1/(23tSCLK) while in SDRAM burst mode.
Table 30. Internal Power Dissipation
A typical power consumption can now be calculated for these
conditions by adding a typical internal power dissipation.
Test Conditions1
Parameter fCCLK
50 MHz 400 MHz 600 MHz 600 MHz
DDINT = VDDINT VDDINT = VDDINT
=
fCCLK
=
fCCLK
=
fCCLK
=
Unit
PTotal = PEXT + (IDD × VDDINT
)
V
=
=
0.8 V
TBD
TBD
1.2 V
TBD
TBD
TBD
1.2 V
520
TBD
70
1.35 V
2
Note that the conditions causing a worst-case PEXT differ from
those causing a worst-case PINT . Maximum PINT cannot occur
while 100% of the output pins are switching from all ones (1s) to
all zeros (0s). Note also that it is not common for an application
to have 100%,or even 50%, of the outputs switching
simultaneously.
IDDTYP
TBD
mA
mA
mA
3
IDDSLEEP
TBD
IDDDEEPSLEEP TBD
TBD
3
IDDHI-
TBD
TBD
TBD
TBD
A
4
BERNATE
OUTPUT DRIVE CURRENTS
1 IDD data is specified for typical process parameters. All data at 25ºC.
2 Processor executing 75% dual Mac, 25% ADD with moderate data bus
activity.
Figure 22 shows typical I-V characteristics for the output driv-
ers of the ADSP-BF561. The curves represent the current drive
capability of the output drivers as a function of output voltage.
3 See the ADSP-BF53x Blackfin Processor Hardware Reference Manual for
definitions of Sleep and Deep Sleep operating modes.
4 Measured at VDDEXT = 3.65V with voltage regulator off (VDDINT = 0V).
120
100
The external component of total power dissipation is caused by
the switching of output pins. Its magnitude depends on
80
60
40
• The number of output pins that switch during each cycle
(O)
20
0
• The maximum frequency at which they can switch (f)
• Their load capacitance (C)
-20
-40
-60
-80
• Their voltage swing (VDDEXT
)
-100
-120
0
0.5
1
1.5
2
2.5
3
3.5
SOURCE (VDDEXT) VOLTAGE - V
Figure 22. ADSP-BF561 Typical Drive
in Figure 23.
TEST CONDITIONS
The ac signal specifications (timing parameters) appear in Tim-
ing Specifications on Page 22. These include output disable
time, output enable time, and capacitive loading. The timing
specifications for the DSP apply for the voltage reference levels
INPUT
OR
OUTPUT
1.5V
1.5V
Figure 23. Voltage Reference Levels for AC Measurements (Except Output
Enable/Disable)
Rev. PrC
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April 2004
Preliminary Technical Data
ADSP-BF561
time. A typical ⌬V will be 0.4 V. CL is the total bus capacitance
(per data line), and IL is the total leakage or three-state current
(per data line). The hold time will be tDECAY plus the minimum
disable time (i.e., tDSDAT for an SDRAM write cycle).
Output Enable Time
Output pins are considered to be enabled when they have made
a transition from a high impedance state to the point when they
start driving. The output enable time tENA is the interval from
the point when a reference signal reaches a high or low voltage
level to the point when the output starts driving as shown in the
Output Enable/Disable diagram (Figure 24). The time
5
tENA_MEASURED is the interval from when the reference signal
switches to when the output voltage reaches 2.0V (output high)
or 1.0V (output low). Time tTRIP is the interval from when the
output starts driving to when the output reaches the 1.0V or
2.0V trip voltage. Time tENA is calculated as
4
3
tENA_MEASURED–tTRIP. If multiple pins (such as the data bus) are
enabled, the measurement value is that of the first pin to start
driving.
2
1
Output Disable Time
Output pins are considered to be disabled when they stop driv-
ing, go into a high impedance state, and start to decay from their
output high or low voltage. The time for the voltage on the bus
to decay by ⌬V is dependent on the capacitive load, CL and the
load current, IL. This decay time can be approximated by the
following equation:
NOMINAL
-5
0
30
60
90
120
150
180
210
LOAD CAPACITANCE - pF
Figure 25. Typical Output Delay or Hold vs. Load Capacitance (at Max Case
Temperature)
tDECAY = (CL∆V) ⁄ IL
The output disable time tDIS is the difference between
t
DIS_MEASURED and tDECAY as shown in Figure 24.The time
DIS_MEASURED is the interval from when the reference signal
t
switches to when the output voltage decays ⌬V from the mea-
sured output high or output low voltage. tDECAY is calculated
with test loads CL and IL, and with ⌬V equal to 0.5 V.
REFERENCE
SIGNAL
tDIS-MEASURED
tENA-MEASURED
tDIS
VOH
tENA
VOH
(MEASURED)
(MEASURED)
V
OH (MEASURED) - ⌬V
2.0V
1.0V
VOL (MEASURED) + ⌬V
VOL
VOL
(MEASURED)
(MEASURED)
tDECAY
tTRIP
OUTPUT STOPS DRIVING
OUTPUT STARTS DRIVING
HIGH-IMPEDANCE STATE.
TEST CONDITIONS CAUSE THIS
VOLTAGE TO BE APPROXIMATELY 1.5V.
Figure 24. Output Enable/Disable
EXAMPLE SYSTEM HOLD TIME CALCULATION
To determine the data output hold time in a particular system,
first calculate tDECAY using the equation given above. Choose
⌬V to be the difference between the ADSP-BF561's output volt-
age and the input threshold for the device requiring the hold
Rev. PrC
|
Page 43 of 52
|
April 2004
ADSP-BF561
Preliminary Technical Data
CAPACITIVE LOADING
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 26 on Page 44). Figure 25 shows
graphically how output delays and holds vary with load capaci-
tance (Note that this graph or derating does not apply to output
disable delays; see Output Disable Time on Page 43). The graphs
of Figure 25, Figure 27 and Figure 28 may not be linear outside
the ranges shown, for Typical Output Delay vs. Load Capaci-
tance and Typical Output Rise Time (10%-90%, V=Min) vs.
Load Capacitance.
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
20
40
60
80
100 120 140 160 180 200
50V
LOAD CAPACITANCE - pF
TO
OUTPUT
PIN
1.5V
Figure 28. Typical Output Rise/Fall Time (10%-90%, Vddext = Min)
20pF
Figure 26. Equivalent Device Loading for AC Measurements (Includes All
Fixtures)
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0
0
20
40
60
80
100 120 140 160 180 200
LOAD CAPACITANCE - pF
Figure 27. Typical Output Rise/Fall Time (10%-90%, Vddext = Max)
Rev. PrC
|
Page 44 of 52
|
April 2004
Preliminary Technical Data
ADSP-BF561
256-BALL MBGA PIN CONFIGURATIONS
Table 31. 256-Lead MBGA Pin Assignments
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
D01
D02
D03
D04
D05
D06
D07
D08
D09
D10
D11
D12
D13
D14
D15
D16
H01
H02
H03
H04
H05
H06
H07
H08
H09
H10
H11
H12
H13
H14
H15
H16
A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
A11
A12
A13
A14
A15
A16
E01
E02
E03
E04
E05
E06
E07
E08
E09
E10
E11
E12
E13
E14
E15
E16
VDDEXT
ADDR24
ADDR20
VDDEXT
ADDR14
ADDR10
AMS3
B01
B02
B03
B04
B05
B06
B07
B08
B09
B10
B11
B12
B13
B14
B15
B16
F01
F02
F03
F04
F05
F06
F07
F08
F09
F10
F11
F12
F13
F14
F15
F16
PPI2CLK
ADDR22
ADDR18
ADDR16
ADDR12
VDDEXT
AMS1
C01
C02
C03
C04
C05
C06
C07
C08
C09
C10
C11
C12
C13
C14
C15
C16
G01
G02
G03
G04
G05
G06
G07
G08
G09
G10
G11
G12
G13
G14
G15
G16
PPI1SYNC2/TMR9
PPI1D13/PF45
PPI1D15/PF47
PPI1SYNC3
ADDR23
GND
PPI1CLK
ADDR25
ADDR19
GND
ADDR11
AOE
GND
ADDR09
GND
AWE
ARE
AMS0
VDDEXT
SMS3
SMS1
SMS2
ARDY
SCKE
SRAS
SCAS
SCLK0/CLKOUT
SCLK1
VDDEXT
BR
GND
SA10
BGH
VDDEXT
ADDR02
GND
BG
ABE1/SDQM1
ADDR06
ADDR04
DATA0
CLKIN
GND
ABE2/SDQM2
ABE3/SDQM3
VDDEXT
GND
ADDR07
DATA1
DATA3
XTAL
DATA5
DATA6
GND
PPI1D11/PF43
PPI1D12/PF44
PPI1SYNC1/TMR8
ADDR15
ADDR13
AMS2
VDDEXT
RESET
GND
GND
VDDEXT
BYPASS
PPI1D14/PF46
GND
PPI1D9/PF41
PPI1D7
PPI1D5
VDDINT
VDDINT
GND
PPI1D10/PF42
ADDR21
ADDR17
VDDINT
GND
GND
VDDINT
SMS0
GND
VDDINT
GND
VDDINT
ADDR05
ADDR03
DATA15
DATA14
GND
GND
SWE
GND
ABE0/SDQM0
DATA2
ADDR08
DATA10
DATA8
DATA12
DATA9
DATA11
VDDINT
DATA16
DATA18
DATA20
DATA17
DATA19
GND
DATA4
DATA7
DATA13
VDDEXT
VDDEXT
Rev. PrC
|
Page 45 of 52
|
April 2004
ADSP-BF561
Preliminary Technical Data
Table 31. 256-Lead MBGA Pin Assignments (Continued)
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
J01
VROUT0
VROUT1
PPI1D2
K01
K02
K03
K04
K05
K06
K07
K08
K09
K10
K11
K12
K13
K14
K15
K16
P01
P02
P03
P04
P05
P06
P07
P08
P09
P10
P11
P12
P13
P14
P15
P16
PPI1D6
L01
L02
L03
L04
L05
L06
L07
L08
L09
L10
L11
L12
L13
L14
L15
L16
R01
R02
R03
R04
R05
R06
R07
R08
R09
R10
R11
R12
R13
R14
R15
R16
PPI1D0
M01
M02
M03
M04
M05
M06
M07
M08
M09
M10
M11
M12
M13
M14
M15
M16
T01
PPI2D15/PF39
PPI2D13/PF37
PPI2D9/PF33
GND
J02
PPI1D4
PPI2SYNC2/TMR11
GND
J03
PPI1D8/PF40
PPI2SYNC1/TMR10
PPI2D14/PF38
VDDEXT
J04
PPI1D3
PPI2SYNC3
VDDEXT
PPI2D11/PF35
GND
J05
PPI1D1
NC
J06
VDDEXT
GND
PF3/SPISEL3/TMR3
PF7/SPISEL7/TMR7
VDDINT
J07
GND
J08
VDDINT
VDDINT
VDDINT
GND
VDDINT
VDDINT
GND
J09
GND
GND
J10
GND
VDDEXT
GND
BMODE0
SCK
J11
VDDINT
J12
DATA30
DATA22
GND
DATA28
DR0PRI
DR1PRI
J13
J14
DATA26
TFS0/PF16
GND
NC
DATA24
VDDEXT
J15
DATA21
DATA23
PPI2D12/PF36
PPI2D10/PF34
PPI2D3
DATA25
DATA27
DATA29
PPI2D7
DATA31
J16
VDDEXT
DT0PRI/PF18
VDDEXT
N01
N02
N03
N04
N05
N06
N07
N08
N09
N10
N11
N12
N13
N14
N15
N16
PPI2D8/PF32
GND
PPI2D6
T02
PPI2D4
PPI2D5
PPI2D2
T03
VDDEXT
PPI2D1
PF0/SPISS/TMR0
GND
PPI2D0
T04
PF2/SPISEL2/TMR2
PF6/SPISEL6/TMR6
VDDEXT
PF1/SPISEL1/TMR1
PF9
PF4/SPISEL4/TMR4
PF8
T05
PF5/SPISEL5/TMR5
PF11
T06
GND
PF10
T07
PF12
PF13
PF15/EXTCLK
GND
PF14
T08
T09
VDDEXT
TDO
NMI1
TCK
BMODE1
MOSI
TRST
TDI
T10
TMS
NMI0
BR
T11
T12
SLEEP
GND
GND
MISO
VDDEXT
RFS1/PF24
GND
RSCLK1/PF30
TFS1/PF21
RSCLK0/PF28
DR0SEC/PF20
TX/PF26
TSCLK1/PF31
DT1PRI/PF23
RFS0/PF19
T13
T14
T15
T16
RX/PF27
DR1SEC/PF25
DT1SEC/PF22
VDDEXT
DT0SEC/PF17
TSCLK0/PF29
Rev. PrC
|
Page 46 of 52
|
April 2004
Preliminary Technical Data
ADSP-BF561
297-BALL PBGA PIN CONFIGURATIONS
Table 32. 297-Lead PBGA Pin Assignments
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
AF17
AF18
AF19
AF20
AF21
AF22
AF23
AF24
AF25
AF26
B01
A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
AA01
AA02
AA25
AA26
AB01
AB02
GND
AB03
AB24
AB25
AB26
AC01
AC02
AC03
AC04
AC23
AC24
AC25
AC26
AD01
AD02
AD03
AD04
AD05
AD22
AD23
AD24
AD25
AD26
AE01
AE02
AE03
AE04
AE05
AE06
AE07
AE08
AE09
AE10
GND
AE11
AE12
AE13
AE14
AE15
AE16
AE17
AE18
AE19
AE20
AE21
AE22
AE23
AE24
AE25
AE26
AF01
AF02
AF03
AF04
AF05
AF06
AF07
AF08
AF09
AF10
AF11
AF12
AF13
AF14
AF15
AF16
PF12
SLEEP
ADDR25
ADDR23
ADDR21
ADDR19
ADDR17
ADDR15
ADDR13
ADDR11
ADDR09
AMS3
GND
PF14
NMI0
TFS0/PF16
DR0PRI
NC
SCK
TDO
TX/PF26
RSCLK1/PF30
DR1PRI
TSCLK1/PF31
DT1SEC/PF22
DT1PRI/PF23
GND
PPI2D9/PF33
PPI2D8/PF32
GND
TRST
EMU
BMODE1
BMODE0
MISO
GND
GND
GND
MOSI
DR0SEC/PF20
RFS0/PF19
PPI2D7
RX/PF27
RFS1/PF24
DR1SEC/PF25
TFS1/PF21
GND
PPI2CLK
GND
AMS1
B02
AWE
B03
ADDR24
ADDR22
ADDR20
ADDR18
ADDR16
ADDR14
ADDR12
ADDR10
AMS2
ARE
PPI2D6
B04
SMS0
GND
B05
SMS2
GND
NC
B06
SRAS
GND
GND
B07
SCAS
GND
PPI2D4
PPI2D2
PPI2D0
PF1/SPISEL1/TMR1
PF3/SPISEL3/TMR3
PF5/SPISEL5/TMR5
PF7/SPISEL7/TMR7
PF9
B08
SCLK0/CLKOUT
SCLK1
GND
B09
GND
B10
BGH
NC
B11
ABE0/SDQM0
ABE2/SDQM2
ADDR08
ADDR06
GND
RSCLK0/PF28
PPI2D5
B12
AMS0
B13
AOE
GND
B14
ARDY
PPI2D3
B15
SMS1
PPI2D1
PF11
B16
SMS3
PPI2D13/PF37
PPI2D12/PF36
DT0SEC/PF17
TSCLK0/PF29
PPI2D11/PF35
PPI2D10/PF34
PF0/SPISS/TMR0
PF2/SPISEL2/TMR2
PF4/SPISEL4/TMR4
PF6/SPISEL6/TMR6
PF8
PF13
B17
SCKE
PF15/EXT CLK
NMI1
B18
SWE
B19
SA10
TCK
B20
BR
TDI
B21
BG
PF10
TMS
B22
ABE1/SDQM1
Rev. PrC
|
Page 47 of 52
|
April 2004
ADSP-BF561
Preliminary Technical Data
Table 32. 297-Lead PBGA Pin Assignments (Continued)
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
B23
B24
B25
B26
C01
C02
C03
C04
C05
C22
C23
C24
C25
C26
D01
D02
D03
D04
D23
D24
D25
D26
E01
E02
E03
E24
E25
E26
F01
F02
F25
F26
ABE3/SDQM3
G01
G02
G25
G26
H01
H02
H25
H26
J01
J02
J10
J11
J12
J13
J14
J15
J16
J17
J18
J25
J26
K01
K02
K10
K11
K12
K13
K14
K15
K16
K17
K18
PPI1D11/PF43
K25
K26
L01
DATA10
DATA13
NC
N12
N13
N14
N15
N16
N17
N18
N25
N26
P01
P02
P10
P11
P12
P13
P14
P15
P16
P17
P18
P25
P26
R01
R02
R10
R11
R12
R13
R14
R15
R16
R17
GND
ADDR07
GND
PPI1D10/PF42
DATA4
GND
GND
ADDR05
PPI1SYNC3
PPI1CLK
GND
DATA7
L02
NC
GND
BYPASS
RESET
L10
VDDEXT
GND
GND
L11
GND
DATA6
L12
GND
VDDINT
DATA16
DATA19
PPI1D7
PPI1D8/PF40
VDDEXT
GND
GND
DATA9
L13
GND
GND
CLKIN
L14
GND
GND
GND
L15
GND
GND
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDINT
VDDINT
VDDINT
DATA8
L16
GND
GND
L17
GND
ADDR04
ADDR03
PPI1SYNC1/TMR8
PPI1SYNC2/TMR9
GND
L18
VDDINT
DATA12
DATA15
VROUT0
GND
L25
GND
L26
GND
M01
M02
M10
M11
M12
M13
M14
M15
M16
M17
M18
M25
M26
N01
N02
N10
N11
GND
GND
GND
VDDEXT
GND
GND
GND
GND
GND
GND
VDDINT
DATA18
DATA21
PPI1D5
PPI1D6
VDDEXT
GND
ADDR02
DATA1
DATA11
XTAL
GND
GND
PPI1D15/PF47
PPI1D14/PF46
GND
NC
GND
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDINT
VDDINT
VDDINT
GND
GND
GND
VDDINT
DATA14
DATA17
VROUT1
PPI1D9/PF41
VDDEXT
GND
DATA0
GND
DATA3
GND
PPI1D13/PF45
PPI1D12/PF44
DATA2
GND
GND
GND
DATA5
GND
Rev. PrC
|
Page 48 of 52
|
April 2004
Preliminary Technical Data
ADSP-BF561
Table 32. 297-Lead PBGA Pin Assignments (Continued)
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
MBGA Pin Name
Pin No.
W01
W02
W25
W26
Y01
R18
R25
R26
T01
T02
T10
T11
T12
T13
T14
T15
VDDINT
DATA20
DATA23
PPI1D3
PPI1D4
VDDEXT
GND
T16
T17
T18
T25
T26
U01
U02
U10
U11
U12
U13
GND
U14
U15
U16
U17
U18
U25
U26
V01
V02
V25
V26
GND
PPI2SYNC1/TMR10
PPI2SYNC2/TMR11
DATA28
GND
VDDINT
VDDINT
VDDINT
VDDINT
DATA24
DATA27
PPI2SYNC3
PPI1D0
VDDINT
DATA22
DATA25
PPI1D1
PPI1D2
VDDEXT
VDDEXT
VDDEXT
VDDEXT
DATA31
PPI2D15/PF39
PPI2D14/PF38
DATA30
Y02
Y25
GND
Y26
DT0PRI/PF18
GND
GND
DATA26
DATA29
GND
Rev. PrC
|
Page 49 of 52
|
April 2004
ADSP-BF561
Preliminary Technical Data
OUTLINE DIMENSIONS
Dimensions in the outline dimension figure are shown in
millimeters.
256-BALL MINI BGA
(BC-256)
a
12.00 BSC SQ
9.75 BSC SQ
CL
A1 BALL
PAD CORNER
0.65 BSC
BALL PITCH
A1 BALL
PAD CORNER
A
B
C
D
E
F
G
H
J
CL
K
L
M
N
P
R
T
16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
TOP VIEW
BOTTOM VIEW
0.25 MIN
1.70
1.51
DETAIL A
1.36
SIDE VIEW
0.10 MAX
COPLANARITY
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MO-225, WITH NO EXACT PACKAGE SIZE AND
EXCEPTION TO PACKAGE HEIGHT.
3. MINIMUM BALL HEIGHT 0.25
SEATING PLANE
0.45
0.40
0.35
DETAIL A
BALL DIAMETER
Figure 29. 256-Ball Mini-Ball Grid Array
Rev. PrC
|
Page 50 of 52
|
April 2004
Preliminary Technical Data
ADSP-BF561
OUTLINE DIMENSIONS
Dimensions in the outline dimension figure are shown in
millimeters.
297-BALL PBGA
(B-297)
a
27.00 BSC SQ
25.00 BSC SQ
A1 BALL
PAD CORNER
8.00
CL
1.00 BSC
BALL PITCH
A1 BALL
PAD CORNER
A
B
C
D
E
F
G
H
J
K
L
M
N
P
8.00
CL
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10
9 8 7 6 5 4 3 2 1
TOP VIEW
BOTTOM VIEW
0.40 MIN
2.43
2.23
DETAIL A
2.03
SIDE VIEW
0.20 MAX
COPLANARITY
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MS-034, VARIATION AAL-1.
SEATING PLANE
0.70
DETAIL A
3. MINIMUM BALL HEIGHT 0.40
BALL DIAMETER
0.60
0.50
Figure 30. 297-Ball PBGA Grid Array
ORDERING GUIDE
Part Number
Ambient Temperature
Instruction Rate
Operating Voltage
Range
ADSP-BF561SKBCZ600
ADSP-BF561SKBCZ500
ADSP-BF561SBB500
0ºC to +70ºC
0ºC to +70ºC
-40ºC to +85ºC
600 MHz
500 MHz
500 MHz
0.8 V to 1.2 V internal, 2.5 V or 3.3 V I/O
0.8 V to 1.2 V internal, 2.5 V or 3.3 V I/O
0.8 V to 1.2 V internal, 2.5 V or 3.3 V I/O
Rev. PrC
|
Page 51 of 52
|
April 2004
ADSP-BF561
Preliminary Technical Data
Rev. PrC
|
Page 52 of 52
|
April 2004
相关型号:
ADSP-BF561WBBCZ-5A
IC 32-BIT, 133 MHz, OTHER DSP, PBGA256, 17 X 17 MM, ROHS COMPLIANT, MO-192AAF-1, CSPBGA-256, Digital Signal Processor
ADI
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