ADUCM420BCBZ-RL7 [ADI]
Precision Analog Microcontroller, 12-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33;型号: | ADUCM420BCBZ-RL7 |
厂家: | ADI |
描述: | Precision Analog Microcontroller, 12-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33 微控制器 |
文件: | 总25页 (文件大小:335K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Precision Analog Microcontroller, 12-Bit Analog
Input/Output with MDIO Interface, Arm Cortex-M33
Data Sheet
ADuCM420
Package and temperature range
3.46 mm × 3.46 mm 64-ball WLCSP
Fully specified for −40°C to +105°C operation
Tools
Low cost quick start development system
Full third-party support
FEATURES
Analog input/output
Multichannel, 12-bit, 2 MSPS ADC
Up to 12 external channels
On-chip die temperature monitor
3 power monitor channels
Single-ended mode
0 V to VREF analog input range
Input buffers
12-bit voltage output DACs
8× 0 V to 2.5 V, 1 kΩ load
4× 0 V to 2.5 V, 2.5 kΩ load
APPLICATIONS
Optical networking 100 Gbps/200 Gbps/400 Gbps and
higher frequency modules
GENERAL DESCRIPTION
The ADuCM420 is a fully integrated, single package device that
On-chip low drift voltage reference, 1.25 V or 2.5 V
Buffered 1.25 V or 2.5 V output
4 voltage comparators
incorporates high performance analog peripherals together
with digital peripherals (controlled by a 160 MHz Arm®
Cortex™-M33 processor) and integrated flash for code and data.
Microcontroller
The analog-to-digital converter (ADC) on the ADuCM420
provides 12-bit, 2 MSPS data acquisition using up to 12 input
pins for single-ended mode. Additionally, the die temperature and
supply voltages can be measured.
32-bit Arm Cortex-M33 core, 32-bit RISC architecture, FPU
Serial wire port supports code download and debug
Clocking options
16 MHz on-chip oscillator
160 MHz PLL output with programmable divider
External clock source
Memory
2× 256 kB independent Flash/EE memories with ECC
10,000-cycle Flash/EE endurance
20-year Flash/EE retention
64 kB SRAM with ECC
Software triggered, in circuit reprogrammability via MDIO or I2C
On-chip peripherals
2× UART, 2× SPI, 3× I2C serial input/output
Multilevel voltage (3.3 V, 1.8 V, 1.2 V) GPIOs
MDIO slave up to 10 MHz
The ADC input voltage is 0 V to VREF. A sequencer is
provided that allows a user to select a set of ADC channels to be
measured in sequence without software involvement during the
sequence. The sequence can optionally repeat automatically at a
user-selectable rate.
Up to 12 channels of 12-bit digital-to-analog converters
(DACs) are provided with output buffers supported.
The ADuCM420 can be configured so that the digital and analog
outputs retain their output voltages through a watchdog or
software reset sequence. Therefore, a product can remain
functional even while the ADuCM420 is resetting itself.
5 general-purpose timers
Wake-up timer (WUTs)
Watchdog timers (WDTs)
32-element PLA
The ADuCM420 has a low power Arm Cortex-M33 processor
and a 32-bit reduced instruction set computer (RISC) machine
that offers up to 240 MIPS peak performance with a floating-
point unit (FPU). Also integrated on chip are 2× 256 kB
Flash/EE memories and 64 kB of static random access memory
(SRAM), both with with single-error correction (SEC) and
double error detection (DED) error checking and correction
(ECC). The flash comprises two separate 256 kB blocks
supporting execution from one flash block and simultaneous
writing and/or erasing of the other flash block.
16-bit PWM
All GPIOs support external interrupt, 5 can support wake-up
Power
Multiple supplies: 3.3 V for voltage DACs and ADCs, and
3.3 V, 1.8 V, or 1.2 V for digital inputs/outputs
Flexible operating modes for low power applications
Continued on Page 3
Rev. 0
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice.
No license is granted by implication or otherwise under any patent or patent rights of Analog
Devices. Trademarks and registeredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2021 Analog Devices, Inc. All rights reserved.
www.analog.com
ADuCM420
Data Sheet
TABLE OF CONTENTS
Features.............................................................................................. 1
Typical Performance Characteristics .......................................... 15
Pin Configuration and Function Descriptions .......................... 16
Theory of Operation ...................................................................... 21
Applications Information ............................................................. 22
Power Supplies ........................................................................... 22
Power-Up Requirements .......................................................... 22
Recommended Circuit and Component Values ................... 23
Outline Dimensions....................................................................... 25
Ordering Guide .......................................................................... 25
Applications ...................................................................................... 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Functional Block Diagram .............................................................. 4
Specifications .................................................................................... 5
Timing Specifications .................................................................. 9
Absolute Maximum Ratings ......................................................... 14
Thermal Resistance.................................................................... 14
Electrostatic Discharge (ESD) Ratings.................................... 14
ESD Caution................................................................................ 14
REVISION HISTORY
1/2021—Revision 0: Initial Version
Rev. 0| Page 2 of 25
Data Sheet
ADuCM420
The ADuCM420 operates from an on-chip oscillator and has a
phase-locked loop (PLL) of 160 MHz. This clock can optionally
be divided down to reduce current consumption. Additional
low power modes can be set via the ADuCM420 software.
The GPIO pins (Px.x) power up in high impedance input
mode. In output mode, the software chooses between open-
drain mode and push/pull mode. The pull-up and pull-down
resistors can be disabled and enabled in the software. The GPIO
pins can be configured with different voltage levels according to
the IOVDDx pin, such as 3.3 V, 1.8 V, and 1.2 V. In GPIO
output mode, the inputs can remain enabled to monitor the
GPIO pins. The GPIO pins can also be programmed to handle
digital or analog peripheral signals, in which case, the pin
characteristics are matched to the specific requirement.
The device includes a management data input/output (MDIO)
interface capable of operating up to 10 MHz. User programming
is eased by incorporating physical address (PHYADR) and device
address (DEVADD) hardware comparators. The nonerasable
kernel code combined with flags in user flash allow user code to
reliably switch between the two hardware independent flash
blocks.
A large support ecosystem is available for the Arm Cortex-M33
processor to ease product development of the ADuCM420.
Access is via the Arm serial wire debug port. On-chip factory
firmware supports in-circuit serial download via MDIO or I2C.
These features are incorporated into a low cost quick start
development system supporting this precision analog
microcontroller
The ADuCM420 integrates a range of on-chip peripherals that
can be configured under software control, as required in the
application. These peripherals include 2× universal asynchronous
receiver transmitter (UART), 3× I2C, and 2× serial peripheral
interface (SPI) serial input/output communication controllers,
general-purpose inputs/outputs (GPIOs), a 32-element
programmable logic array (PLA), five general-purpose timers, a
wake-up timer (WUT), and a system watchdog timer (WDT).
A 16-bit pulse-width modulation (PWM) with eight output
channels is also provided.
Note that throughout this data sheet, multifunction pins, such
as AIN4/VDAC0, are referred to either by the entire pin name
or by a single function of the pin, for example, AIN4, when
only that function is relevant.
.
Rev. 0| Page 3 of 25
ADuCM420
Data Sheet
FUNCTIONAL BLOCK DIAGRAM
1
1
1
VDAC0
VDAC1
VDAC10 VDAC11
AIN0
AIN1
AIN2
AIN3
ADuCM420
1
AIN4
AIN7
AIN8/COM0P
COMP
GP TIMER
WATCHDOG
TIMER
AIN9/COM0N
2
12-BIT
SAR ADC
AT 2MSPS
GPIO
PLA
GPIOs
VDAC8
WAKE-UP TIMER
BUF
PLAOx
PLAIx
AIN8
2 × 256kB FLASH/EE
WITH ECC
AIN10/COM1P
COMP
64kB SRAM
WITH ECC
VDAC9
4
MDIO
MDIO
SPI
CACHE
AIN14
CONTROLLER
5
SPIs
AVDD/2
IOVDD/2
AGND
DMA
AIN12/COM2P
COMP
SDAx,
SCLx
AIN13/COM2N
16MHz
OSC
32kHz
6
7
WIC
NVIC
2
PLL
ALP
I C
OSC
POR
0.9V
TEMPERATURE
SENSOR
VDAC10
Arm Cortex-M33
WITH DSP
UP TO 160MHz
HP
REF
SOUTx,
SINx
UART
PWM
8
9
REF
1
COMP
AIN14/COM3P
BUF
2.5V
ALDO
DLP
VDAC11
10
11
12
SERIAL WIRE DEBUG
REF
DLDO
1
BUF0_VREF
AVDD_REG
DVDD_REG
SERIAL WIRE
3
EMULATION
1
THIS IS A PARTIAL FUNCTION OF A MULTIFUNCTION PIN. FOR EXAMPLE, VDAC0 AND AIN4 ARE SEPARATE FUNCTIONS
ON THE SAME PIN, AIN4/VDAC0.
2
GPIOs REFER TO Px.x.
3
4
SERIAL WIRE EMULATION REFERS TO SWDIO, SWCLK, AND SWO.
MDIO REFERS TO PRTADDRx, MDIO, AND MCK.
SPIs REFER TO SCLKx, CSx, MOSIx, SRDYx, AND MISOx.
NVIC IS NESTED VECTORED INTERRUPT CONTROLLER.
WAKE-UP INTERRUPT CONTROLLER.
5
6
7
8
HP REF IS HIGH POWER REFERENCE.
9
ALP REF IS ANALOG LOW POWER REFERENCE.
ALDO IS ANALOG LOW DROPOUT REGULATOR.
10
11
DLP REF IS DIGITAL LOW POWER REFERENCE.
DLDO IS DIGITAL LOW DROPOUT REGULATOR.
12
Figure 1.
Rev. 0| Page 4 of 25
Data Sheet
ADuCM420
SPECIFICATIONS
AVDD = IOVDD0 = 2.85 V to 3.6 V, IOVDD1 = 1.2 V or 1.8 V, DVDD = 1.8 V to 3.6 V, VREF = 2.5 V for the internal reference, the
core frequency (fCORE) = 160 MHz, and TA = −40°C to +105°C, unless otherwise noted. HCLK is the high speed system clock.
Table 1.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
ADC CHANNEL SPECIFICATIONS
ADC Power-Up Time
Single-ended mode only
5
μs
Data Rate (fADC
Resolution
Integral Nonlinearity
Differential Nonlinearity
DC Code Distribution1
)
2
MSPS
Bits
LSB
LSB
12
2.5 V internal reference
1
0.ꢀ
2
0.ꢁ
Minimum and maximum range from mean
ADC codes for 1000 samples
2
LSB
ꢂV
ADC input 1.25 V, single ended; fADC = 1 MSPS
ENDPOINT ERRORS
Offset Error
−ꢁ20
400
+720
External channels
Offset Error Drift
Offset Error Drift Matching
4
1
ꢂV/°C
ꢂV/°C
Matching compared to AIN0; for voltage
input channels
Full-Scale Error
Gain Error Drift
Gain Error Drift Matching
−1500
500
5
0.5
+1000
ꢂV
ppm/°C
ppm/°C
External channels
Matching compared to AIN0; for voltage
input channels
DYNAMIC PERFORMANCE
Signal-to-Noise Ratio (SNR)
Input frequency (fIN) = 500 Hz sine wave,
sampling frequency (fSAMPLE) = 1 MSPS internally
Includes distortion and noise components;
voltage input
73
dB
Total Harmonic Distortion (THD)
Peak Harmonic or Spurious Noise
Channel to Channel Crosstalk
ANALOG INPUT
−85
−82
−ꢁꢀ
dB
dB
dB
Measured on adjacent channels
Input Voltage Ranges
Single-Ended Mode
0
2.5
V
Leakage Current
Input Current
5
50
230
30
nA
nA
nA
pF
Input voltage to AINx = 0.15 V to 2.5 V
At 100 kHz sample rate from 0.15 V to 2.5 V
2 MSPS ADC sample rate
420
Input Capacitance
During ADC acquisition
ON-CHIP VOLTAGE REFERENCE
4.7 μF decoupling capacitor between
ADCREFP and ADCREFN
Output Voltage
2.5
V
Accuracy
Reference Temperature Coefficient
5
30
20
mV
ppm/°C
ppm/°C
TA = 25°C
TA = −40°C to +25°C range
TA = 25°C to 105°C range
10
10
Power Supply Rejection Ratio (PSRR)
DC
AC
70
ꢀ0
dB
dB
AVDD change effects, 2.85 V to 3.ꢀ V
Tested with AVDD noise of 1 kHz, 10 kHz,
100 kHz, and 1 MHz
Output Impedance
2
Ω
Do not use as external reference source;
TA = 25°C
EXTERNAL REFERENCE INPUT
Input Voltage Range
Input Impedance
2.5
5
V
kΩ
Only supports 2.5 V external reference input
Do not use as external reference source
Rev. 0| Page 5 of 25
ADuCM420
Data Sheet
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
BUFFERED VREF OUTPUT (BUF0_VREF)
Output Voltage
1 μF capacitor required on output
1.25 or
2.5
V
Accuracy
Reference Temperature Coefficient
ꢀ
30
20
mV
TA = 25°C, load capacitance (CL) = 4 mA
TA = −40°C to +25°C range
TA = 25°C to 105°C range
10
10
2.5
2.5
ppm/°C
ppm/°C
mV/mA
Ω
mA
dB
Load Regulation
Output Impedance
Load Current
PSRR
4
70
VOLTAGE DAC (VDAC) CHANNEL
SPECIFICATIONS
VDAC Channel 0 to Channel 7: buffer on,
load resistance (RL) = 1 kΩ, CL = 100 pF,
DACCONx, Bit ꢁ = 0 (normal drive, unless
otherwise stated); VDAC Channel 8 to
Channel 11: buffer on, RL = 2.5 kΩ, CL = 100 pF
DC Accuracy
Resolution
12
−2
−0.ꢁ
−13.5
−15
−15
Bits
LSB
LSB
mV
mV
mV
Relative Accuracy2
Differential Nonlinearity1
Calculated Offset Error
Actual Offset Error
1.5
0.5
5
+2
+2
+3
+0.ꢁ
+15.5
+15
+15
Guaranteed monotonic
2.5 V internal reference
Measured at Code 0
VDAC Channel 0 to Channel 7: DACCONx,
Bit ꢁ = 1; RL = 250 Ω; CL = 100 pF
Gain Error
−0.7
−0.7
0.2
0.2
+0.5
+0.5
% of FS3
% of FS3
VDAC Channel 0 to Channel 7: DACCONx,
Bit ꢁ = 1; RL = 250 Ω; CL = 100 pF
Offset Error Drift
Gain Error Drift
Short-Circuit Current
10
15
32
μV/°C
ppm/°C
mA
VDAC Channel 0 to Channel 7
VDAC Channel 8 to Channel 11
15
mA
VDAC OUTPUTS
Output Range1
0
0
2.5
V
V
VDAC Channel 0 to Channel 7
VDAC Channel 8 to Channel 11
Lower of 2.5
or AVDD − 0.7
Output Impedance
1
Ω
VDAC AC CHARACTERISTICS
Slew Rate
Voltage Output Settling Time
Digital to Analog Glitch Energy
2.5
10
20
V/ꢂs
ꢂs
nV-sec
1 LSB change at major carry (where
maximum number of bits simultaneously
changes in the DACDATx register)
COMPARATOR INPUT
Offset Voltage
15
mV
The offset voltage is dependent on the
comparator being enabled with its input
pins connected to external biasing circuits; if
the comparator is left powered down or if
the inputs to the comparator are left
floating, over time the offset error may
increase
Bias Current
−30
740
+3
10
50
+43
ꢁ40
nA
nA
nA
nA
Noninverting (positive) input
Inverting (negative) input, hysteresis disabled
Inverting (negative) input, hysteresis = 10 mV
Inverting (negative) input, hysteresis = 210 mV
840
Rev. 0| Page ꢀ of 25
Data Sheet
ADuCM420
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
Voltage Range
0.5
AVDD − 1.2
V
Negative input range (reference node of the
comparator)
AGND
0
AVDD
2.0
V
V
Positive input range to comparator
Differential input range; positive input −
negative input voltage
Capacitance
Hysteresis
Hysteresis Voltage Accuracy
7
50
10
pF
mV
% of target
hysteresis
10
210
35
1ꢀ configurable options4
10 mV to 35 mV settings
5
5
15
% of target
hysteresis
ꢂs
50 mV to 210 mV settings
Response Time
POWER-ON RESET (POR)
POR Trip Level (DVDD)
Refers to voltage at DVDD pin
Power-on level (see Figure 17)
Power-down level (brownout)
1.ꢀ
1.ꢀ2
1.77
1.7
V
V
ms
1.ꢀꢀ
32
Timeout from POR
FLASH MEMORY
Endurance
10,000
10
20
Cycles
Years
Years
MHz
%
Data Retention
Junction temperature (TJ) = 125°C
TJ = 85°C
INTERNAL HIGH POWER OSCILLATOR
Accuracy
1ꢀ
3
TEMPERATURE SENSOR
Voltage Output at 25°C
Voltage Temperature Coefficient
Accuracy with No Calibration
INTERNAL LOW POWER OSCILLATOR
Accuracy
Indicates die temperature
0.13ꢀ25
0.45ꢀ8
2
32
7
V
mV/°C
°C
−3
+4.4
+10
kHz
%
−10
3.3 V GPIO
Logic Inputs
IOVDD0 = 3.3 V
IOVDD0 × 0.3
Input Low Voltage (VINL
)
0.ꢁꢁ
V
Input High Voltage (VINH
)
2
V
Pull-Up Current
Pull-Down Current
Internal Pull-Up or Pull-Down
Disabled
120
115
−32
1ꢀ0
1ꢀ3
+1
210
210
+ꢀ5
ꢂA
ꢂA
nA
Input voltage (VIN) = 0 V
VIN = 3.3 V
Logic Outputs
Output High Voltage (VOH)
Output Low Voltage (VOL)
2.4
V
V
Source current (ISOURCE) = 12 mA
0.4
10
Sink current (ISINK) = 12 mA for SCL0 and
SDA0 (I2C0); and for SCL2 and SDA2 (I2C2),
I
SINK = 20 mA
Input Capacitor
Short-Circuit Current
1.8 V GPIO
pF
mA
13
IOVDD1 = 1.8 V
Logic Inputs
VINL
0.54
V
VINH
1.2ꢀ
150
170
V
Pull-Up Current
Pull-Down Current
Internal Pull-Up or Pull-Down
Disabled
1ꢁ4
217
+25
240
270
+2000
ꢂA
ꢂA
nA
VIN = 0 V
VIN = 1.8 V
IOVDD1 power source
−520
Rev. 0| Page 7 of 25
ADuCM420
Data Sheet
Parameter
Logic Outputs
VOH
Min
Typ
Max
Unit
Test Conditions/Comments
1.4
V
V
pF
mA
ISOURCE = 12 mA
ISINK = 12 mA
VOL
0.3ꢀ
10
Input Capacitor
Short-Circuit Current
1.2 V GPIO
Logic Inputs
VINL
17
IOVDD1 = 1.2 V
0.3ꢀ
V
VINH
0.84
55
55
V
Pull-Up Current
Pull-Down Current
Internal Pull-Up or Pull-Down
Disabled
7ꢀ
82
+20
100
110
+1510
ꢂA
ꢂA
nA
VIN = 0 V
VIN = 1.2 V
IOVDD1 power source
−450
Logic Outputs
VOH
VOL
1.0
V
V
pF
mA
ISOURCE = ꢀ mA
ISINK = ꢀ mA
0.18
10
Input Capacitor
Short-Circuit Current
MDIO
7
Logic Inputs
VINL
VINH
Logic Output
VOH
0.3ꢀ
V
V
0.84
1.0
V
ISOURCE = 4 mA
ISINK = 4 mA
VOL
0.2
10
V
pF
mA
Input Capacitor
Short-Circuit Current
7
MICROCONTROLLER UNIT (MCU)
CLOCK RATE
Using PLL Output
1ꢀ0
1ꢀ3
MHz
ꢂs
EXTERNAL RESET
Minimum Pulse Duration
PROCESSOR START-UP TIME
At Power-On
10
Pin voltage must stay low for this period
32
1
ms
ms
Includes kernel execution time
Includes kernel execution time
After Reset Event
After Processor Power-Down
Core Sleep Mode (Mode 1)
System Sleep Mode (Mode 2)
Hibernate Mode (Mode 3)
POWER REQUIREMENTS
Power Supply Voltage Range
AVDD to AGND
30
85
3
HCLK cycles Fixed number of HCLK periods
ꢂs
ꢂs
HCLK = 1ꢀ0 MHz from PLL
HCLK = 1ꢀ MHz from internal oscillator
2.85
1.7
3.3
1.8 or
3.3
3.ꢀ
3.ꢀ
V
V
DVDD to DGND
IOVDD0 to IOGND
IOVDD1 to IOGND
2.85
1.08
3.3
1.2 or
1.8
3.ꢀ
1.ꢁ8
V
V
If unused, can be tied to DVDD_REG or to
DGND
Analog Power Supply Currents
AVDD Current
ꢁ00
1050
ꢂA
Analog peripherals in idle mode
Digital Power Supply Current
Current in Normal Mode
IOVDD0
175
20
200
ꢀ0
ꢂA
ꢂA
IOVDD1
Rev. 0| Page 8 of 25
Data Sheet
ADuCM420
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
DVDD Current
Active Mode
Executing typical code
1ꢀ
4.8
11
4.3
2.4ꢀ
2.44
mA
mA
mA
mA
mA
mA
HCLK = 1ꢀ0 MHz clock
HCLK = 1ꢀ MHz from internal oscillator
HCLK = 1ꢀ0 MHz clock
Core Sleep Mode (Mode 1)
HCLK = 1ꢀ MHz from internal oscillator
System Sleep Mode (Mode 2)
Hibernate Mode (Mode 1)
Additional Power Supply Currents
ADC
1ꢁ
20
HCLK = 1ꢀ0 MHz clock
2.8
330
18.8
3.4
350
mA
ꢂA
mA
Continuously converting at 2 MSPS
Per powered up DAC, excluding load current
Active mode with PLL clock of 1ꢀ0 MHz and
ADC enabled
DAC
Total Supply Current
1 These numbers are not production tested but are guaranteed by design and/or characterization data at production release.
2 VDAC linearity specifications generated using reduced DAC code range of 82 to 40ꢁ5. For VDAC Channel 8 to Channel 11, end code of 40ꢁ5 only used when AVDD −
0.7 V > 2.5 V.
3 FS is full scale.
4 These options include 10 mV, 25 mV, 35 mV, 50 mV, ꢀ0 mV, 75 mV, 100 mV, 110 mV, 125 mV, 135 mV, 150 mV, 1ꢀ0 mV, 175 mV, 185 mV, 200 mV, and 210 mV.
TIMING SPECIFICATIONS
I2C Timing
Table 2. I2C Timing in Standard Mode (100 kHz)—Slave/Master
Parameter
Description
Min
4.7
4.0
4.0
250
0
Typ
Max
Unit
ꢂs
ꢂs
ꢂs
ns
tL
tH
tSHD
tDSU
tDHD
SCLx low pulse width
SCLx high pulse width
Start condition hold time
Data setup time
Data hold time (SDAx held internally after falling edge of SCLx, duration set via
TCTL register, THDATIN bits)
3.45
ꢂs
tRSU
tPSU
tBUF
tR
Setup time for repeated start
Stop condition setup time
Bus free time between a stop condition and a start condition
Rise time for both SCLx and SDAx
Fall time for both SCLx and SDAx
Data valid time
4.7
4.0
4.7
ꢂs
ꢂs
ꢂs
ꢂs
ns
ꢂs
ꢂs
pF
1
tF
15
300
3.45
3.45
400
tVD; DAT
tVD;ACK
CB
Data valid acknowledge time
Capacitive load for each bus line (not shown in Figure 2)
Table 3. I2C Timing in Fast Mode (400 kHz)—Slave/Master
Parameter Description
Min Typ Max Unit
tL
tH
tSHD
tDSU
tDHD
SCLx low pulse width
SCLx high pulse width
Start condition hold time
Data setup time
Data hold time (SDAx held internally after falling edge of SCLx, duration set via TCTL register,
THDATIN bits)
1.3
0.ꢀ
0.ꢀ
100
0
ꢂs
ꢂs
ꢂs
ns
ꢂs
tRSU
tPSU
tBUF
tR
Setup time for repeated start
Stop condition setup time
Bus free time between a stop condition and a start condition
Rise time for both SCLx and SDAx
Fall time for both SCLx and SDAx
Data valid time
Data valid acknowledge time
Capacitive load for each bus line (not shown in Figure 2)
Rev. 0| Page ꢁ of 25
0.ꢀ
0.ꢀ
1.3
20
ꢂs
ꢂs
ꢂs
ns
ns
ꢂs
ꢂs
pF
300
300
0.ꢁ
0.ꢁ
400
tF
15
tVD; DAT
tVD; ACK
CB
ADuCM420
Data Sheet
I2C GPIOs (P0.7 to P0.4 and P1.3 to P1.2) drive strength set to 20 mA.
Table 4. I2C Timing in Fast Mode Plus (1 MHz)—Slave/Master
Parameter Description
Min Typ Max Unit
tL
tH
tSHD
tDSU
tDHD
SCLx low pulse width
SCLx high pulse width
Start condition hold time
Data setup time
Data hold time (SDAx held internally after falling edge of SCLx, duration set via TCTL register,
THDATIN bits)
0.5
0.2ꢀ
0.2ꢀ
50
ꢂs
ꢂs
ꢂs
ns
ꢂs
0
tRSU
tPSU
tBUF
tR
Setup time for repeated start
Stop condition setup time
Bus free time between a stop condition and a start condition
Rise time for both SCLx and SDAx
Fall time for both SCLx and SDAx
Data valid time
0.2ꢀ
0.2ꢀ
0.5
ꢂs
ꢂs
ꢂs
ns
ns
120
120
tF
tVD; DAT
tVD; ACK
CB
0.45 ꢂs
0.45 ꢂs
Data valid acknowledge time
Capacitive load for each bus line (not shown in Figure 2)
550
pF
I2C GPIOs (P0.7 to P0.4 and P1.3 to P1.2) drive strength set to 20 mA.
Table 5. I2C Timing in High Speed Mode (3.4 MHz)—Slave Only
Parameter
Description
Min
1ꢀ0
ꢀ0
1ꢀ0
10
Typ
Max
Unit
ns
ns
ns
ns
tL
tH
tSHD
tDSU
tDHD
SCLx low pulse width
SCLx high pulse width
Start condition hold time
Data setup time
Data hold time (SDAx held internally after falling edge of SCLx, duration set via
TCTL register, THDATIN bits)
0
ns
tRSU
tPSU
tBUF
tR
Setup time for repeated start
Stop condition setup time
Bus free time between a stop condition and a start condition
Rise time for both SCLx and SDAx
Up to CB = 100 pF
1ꢀ0
1ꢀ0
200
10
ns
ns
ns
ns
40
Up to CB = 400 pF
Fall time for both SCLx and SDAx
Up to CB = 400 pF
80
40
80
400
ns
ns
ns
pF
tF
10
CB
Capacitive load for each bus line (not shown in Figure 2)
tBUF
tR
SDAx (I/O)
MSB
LSB
ACK
MSB
tDSU
tDSU
tDHD
tRSU
tF
tDHD
tPSU
tVD; DAT
tR
tH
tSHD
tVD; ACK
1
2–7
8
9
1
SCLx (I)
tL
P
S
S(R)
tF
STOP
START
REPEATED
START
CONDITION CONDITION
Figure 2. I2C-Compatible Interface Timing
Rev. 0| Page 10 of 25
Data Sheet
ADuCM420
SPI Timing Specifications: Slave Mode
SPI GPIOs (P0.3 to P0.0, P1.7 to P1.4) drive strength set to 12 mA, IOVDD1 ≥ 1.2 V, and 40 MHz SPI clock. See Figure 3 and Figure 4.
Table 6. SPI Slave Mode Timing
Parameter
Symbol
Min
Typ
Max
Unit
TIMING REQUIREMENTS
CSx
tCS
25
25
ns
ns
to SCLKx Edge
CSx
tCS
Minimum Valid
Inactive Period
M
SCLKx Low Pulse Width
SCLKx High Pulse Width
Data Input Setup Time Before SCLKx Edge
Data Input Hold Time After SCLKx Edge
SCLKx Rise Time
tSL
tSH
tDSU
tDHD
tSR
10
10
ns
ns
ns
ns
ns
ns
5
5
5
5
SCLKx Fall Time
tSF
SWITCHING CHARACTERISTICS
Data Output Valid After SCLKx Edge
tDAV
tDOCS
tSFS
10
15
ns
ns
ns
CSx
Data Output Valid After
Edge
CSx
8.75
High After SCLKx Edge
tCSM
CSx
tCS
tSFS
SCLKx
(POLARITY = 0)
tSH
tSL
tSR
tSF
SCLKx
(POLARITY = 1)
tDAV
tDOCS
tDF
tDR
MSB
MISOx
MOSIx
Figure 3. SPI Slave Mode Timing (Serial Clock Phase Mode, CTL Register, Bit 2, CPHA = 0)
tCSM
CSx
tCS
tSFS
SCLKx
(POLARITY = 0)
tSH
tSL
SCLKx
(POLARITY = 1)
tDAV
tDOCS
tDF
tDR
BIT 6 TO BIT 1
MISOx
MSB
LSB
MOSIx
MSB IN
tDSU
BIT 6 TO BIT 1
LSB IN
tDHD
Figure 4. SPI Slave Mode Timing (CPHA = 1)
Rev. 0| Page 11 of 25
ADuCM420
Data Sheet
SPI Timing Specifications: Master Mode
SCLKx = 40 MHz, SPI SPI GPIOs (P0.3 to P0.0, P1.7 to P1.4) pin drive strength set to 12 mA. IOVDD1 ≥ 1.2 V. DIV is the SPI clock
divider, in the SPI baud rate selection register (see the ADuCM420 hardware reference manual for more information). tHCLK is the time
period of HCLK set up by the user.
Table 7. SPI Master Mode Timing (CPHA = 0 and 1)
Parameter
Description
Min
Typ
Max
Unit
ns
ns
ns
ns
ns
ns
ns
ns
tSL
tSH
SCLKx low pulse width
SCLKx high pulse width
Data output valid after SCLKx edge
Data input setup time before SCLKx edge
Data input hold time after SCLKx edge
Data output fall time
Data output rise time
SCLKx rise time
SCLKx fall time
(DIV + 1) × tHCLK/2
(DIV + 1) × tHCLK/2
tDAV
tDSU
tDHD
tDF
tDR
tSR
0
5
5
5
5
5
5
tSF
ns
SCLKx
(POLARITY = 0)
tSH
tSL
tSR
tSF
SCLKx
(POLARITY = 1)
tDAV
tDF
tDR
MOSIx
MISOx
MSB
BIT 6 TO BIT 1
LSB
MSB IN
BIT 6 TO BIT 1
LSB IN
tDSU
tDHD
Figure 5. SPI Master Mode Timing (CPHA = 1)
SCLKx
(POLARITY = 0)
tSH
tSL
tSR
tSF
SCLKx
(POLARITY = 1)
tDAV
tDF
tDR
MOSIx
MISOx
MSB
BIT 6 TO BIT 1
LSB
MSB IN
BIT 6 TO BIT 1
LSB IN
tDSU
tDHD
Figure 6. SPI Master Mode Timing (CPHA = 0)
Rev. 0| Page 12 of 25
Data Sheet
ADuCM420
Table 8. MDIO vs. Management Data Clock (MDC) Timing
Parameter1
Description
Min
Typ
Max
10
4
Unit
MHz
MHz
ns
ns
ns
Maximum MCK Clock Speed
Push/pull mode
Open-drain mode, pull-up resistance (RPULLUP) = 312 Ω
MDIO setup before MCK edge (push/pull mode)
Open-drain mode, RPULLUP = 312 Ω
MDIO valid after MCK edge (push/pull mode)
Open-drain mode, RPULLUP = 312 Ω
Data output after MCK edge (push/pull mode)
Open-drain mode, RPULLUP = 312 Ω
tSETUP
tHOLD
tDELAY
5
10
7
10
ns
ns
2ꢀ
100
1 In Figure 7, CFP is C formfactor pluggable. VIH is the voltage input high level, and VIL is voltage input low level.
MCK
V
V
IH
IL
CFP
INPUT
MDIO
V
V
IH
IL
CFP
INPUT
MDIO
V
V
OH
OL
CFP
OUTPUT
tSETUP tHOLD
tDELAY
Figure 7. MDIO Timing
Rev. 0| Page 13 of 25
ADuCM420
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 9.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
AVDD to AGND
IOVDD0 to IOGND
IOVDD1 to IOGND
DVDD to DGND
AVDD to IOVDD0
Analog Input Voltage to AGND
(AVDD Range = 2.85 V to 3.ꢀ V)
Digital Input Voltage to IOGND
−0.3 V to +3.ꢀ3 V
−0.3 V to +3.ꢀ3 V
−0.3 V to +1.ꢁ8 V
−0.3 V to +3.ꢀ3 V
IOVDD0 0.3 V
−0.3 V to AVDD + 0.3 V,
must be ≤3.ꢀ3 V
−0.3 V to IOVDD0 + 0.3 V,
must be ≤3.ꢀ3 V
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 10. Thermal Resistance
Package Type
1
θJA
θJC
Unit
CB-ꢀ4-2
34
0.1ꢀ
°C/W
Digital Input Voltage to IOGND (P1.0 −0.3 V to IOVDD1 + 0.3 V,
to P1.7 and P0.0 to P0.3 Only)1
AGND to DGND
must be ≤1.ꢁ8 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
0 mA to 40 mA
−40 mA to 0 mA
1 JEDEC 2S2P.
ELECTROSTATIC DISCHARGE (ESD) RATINGS
IOGND to DGND
Total Positive GPIO Pins Current
Total Negative GPIO Pins Current
Temperature Ranges
Storage
Operating
Reflow Profiles
The following ESD information is provided for handling of
ESD sensitive devices in an ESD protected area only.
Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.
Field induced charged device model (FICDM) per
ANSI/ESDA/JEDEC JS-002.
−ꢀ5°C to +150°C
−40°C to +105°C
ESD Ratings for ADuCM420
SnPb Assemblies (10 sec to 30 sec) 240°C
Pb-Free Assemblies (20 sec to
40 sec)
Junction Temperature
2ꢀ0°C
Table 11. ADuCM420, 64-Ball WLCSP
ESD Model
Withstand Threshold (kV)
Class
2
C2A
150°C
HBM
3
1 When IOVDD1 is the selected power rail.
FICDM
0.5
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the
operational section of this specification is not implied.
Operation beyond the maximum operating conditions for
extended periods may affect product reliability.
ESD CAUTION
Rev. 0| Page 14 of 25
Data Sheet
ADuCM420
TYPICAL PERFORMANCE CHARACTERISTICS
2.510
16
14
12
10
8
DEVICE 1
DEVICE 2
DEVICE 3
2.508
2.506
2.504
2.502
2.500
2.498
2.496
2.494
2.492
2.490
6
4
DEVICE 5, AIN0
DEVICE 5, AIN1
DEVICE 5, AIN2
DEVICE 5, AIN3
DEVICE 5, AIN4
DEVICE 5, AIN7
DEVICE 5, AIN8
DEVICE 5, AIN9
DEVICE 5, AIN10
DEVICE 5, AIN12
DEVICE 5, AIN13
DEVICE 5, AIN14
2
DEVICE 6, AIN0
DEVICE 6, AIN1
DEVICE 6, AIN2
DEVICE 6, AIN3
DEVICE 6, AIN4
0
DEVICE 6, AIN7
DEVICE 6, AIN8
–2
0.1
0.5
0.9
1.3
1.7
2.1
2.5
2.9
3.3
3.7
4.0
0.30
0.60
0.90
1.20
1.35
1.65
1.95
2.25
2.50
VOLTAGE ON AINx (V)
LOAD CURRENT (mA)
Figure 11. Input Current vs. Voltage on AINx, fSAMPLE = 100 kSPS
Figure 8. BUF0_VREF Load Regulation, 2.5 V Output Setting
3
1.258
DEVICE 1
DEVICE 2
DEVICE 3
1.256
1.254
1.252
1.250
1.248
1.246
1.244
1.242
1.240
2
1
0
–1
–2
–40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90 100
TEMPERATURE (°C)
0.1
0.5
0.9
1.3
1.7
2.1
2.5
2.9
3.3
3.7
4.0
LOAD CURRENT (mA)
Figure 12. Temperature Sensor Accuracy, No Calibration, 240 Devices
Figure 9. BUF0_VREF Load Regulation, 1.25 V Output Setting
2.504
2.503
2.502
2.501
2.500
2.499
2.498
2.497
2.496
2.495
2.494
350
300
250
200
150
100
50
DEVICE 5, AIN8
DEVICE 5, AIN9
DEVICE 5, AIN10
DEVICE 5, AIN12
DEVICE 5, AIN13
DEVICE 5, AIN14
DEVICE 5, AIN0
DEVICE 5, AIN1
DEVICE 5, AIN2
DEVICE 5, AIN3
DEVICE 5, AIN4
DEVICE 5, AIN7
DEVICE 6, AIN0
DEVICE 6, AIN1
DEVICE 6, AIN2
DEVICE 6, AIN3
DEVICE 6, AIN4
DEVICE 6, AIN7
DEVICE 6, AIN8
0
–40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90 100
TEMPERATURE (°C)
0.30
0.60
0.90
1.20
1.35
1.65
1.95
2.25
2.50
VOLTAGE ON AINx (V)
Figure 10. Input Current vs. Voltage on AINx, fSAMPLE = 2 MSPS
Figure 13. Reference Voltage Drift vs. Temperature, 250 Devices
Rev. 0| Page 15 of 25
ADuCM420
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
P2.1/DM/
IRQ2/
ECLKIN/
COMPDIN3/
PLAI9
P2.0/
ADCCONV/
COMPDIN2/
PLAI8
IOGND
SWDIO
VDAC7
VDAC6
VDAC5
VDAC3
A
B
C
D
E
F
P0.3/IRQ0/
P0.2/MOSI0/
PLACLK1/
PLAI2
P2.3/
BM
PLAI10
CS0/
PLACLK0/
PLAI3
SWCLK
RESET
VDAC1
VREF
AIN2
AVDD
P2.2/
POR/
CLKOUT/
SWO
P0.0/SCLK0/
COMOUT0/
PLAI0
P1.0/SIN1/
COMOUT2/
PLAI4
P0.1/MISO0/
COMOUT1/
PLAI1
AIN14/
COM3P/
BUF0_VREF
AIN4/
VDAC0
IOVDD1
DVDD_REG
IOVDD0
P1.2/
SCL1/
PWM0/
PLAI6
P1.3/
SDA1/
PWM1/
PLAI7
P1.1/
SOUT1/
COMOUT3/
PLAI5
AIN10/
COM1P
AIN0
DGND
AIN3
P1.4/
P1.7/
SCLK1/
PWM2/
PLAO10
AIN12/
COM2P
VDAC8/
P5.0
IRQ1/CS1/
PWM5/
PLAO13
AGND
AVDD_REG
ADCREFP
IOGND
P1.5/
P1.6/
P0.7/IRQ4/
SDA2/
COMPDIN1/
PLAO5
P3.2/
AIN8/
COM0P
VDAC9/
P5.1
MISO1/
PWM3/
PLAO11
MOSI1/
PWM4/
PLAO12
PRTADDR2/
PWMTRIP/
PLAI14
ADCREFN
P0.6/IRQ3/
SCL2/
P3.1/
P0.4/SCL0/
SIN0/
P0.5/SDA0/
SOUT0/
PRTADDR1/
PWMSYNC/
PLAI13
VDAC11/
P5.3
AIN7/
AIN9/
G
H
AIN1
COMPDIN0/
PLAO4
VDAC2
COM0N
PLAO2
PLAO3
P3.5/
MCK/
SRDY1/
PLAO27
P3.0/
PRTADDR0/
SRDY0/
P3.6/
MDIO
VDAC10/
P5.2
AIN13/
COM2N
IOGND
DVDD
VDAC4
PLAI12
Figure 14. Pin Configuration
Table 12. Pin Function Descriptions
Pin No. Mnemonic
Type1
Description
A1
A2
IOGND
S
I/O
Ground for Digital Inputs/Outputs.
Digital Input/Output Port 2.0 (P2.0).
P2.0/ADCCONV/COMPDIN2/PLAI8
External Input to Start ADC Conversions (ADCCONV).
Comparator 2 Digital Input for Three-State (COMPDIN2).
Input to PLA Element 8 (PLAI8).
Digital I/O Port 2.1 (P2.1).
A3
P2.1/DM/IRQ2/ECLKIN/COMPDIN3/PLAIꢁ I/O
Download Mode Selection (DM).
External Interrupt 2 (IRQ2).
External Input Clock (ECLKIN).
Comparator 3 Digital Input for Three-State (COMPDIN3).
Input to PLA Element ꢁ (PLAIꢁ).
Serial Wire Bidirectional Data.
Voltage DAC 7 Output.
Voltage DAC ꢀ Output.
A4
A5
Aꢀ
A7
A8
SWDIO
VDAC7
VDACꢀ
VDAC5
VDAC3
I/O
AO
AO
AO
AO
Voltage DAC 5 Output.
Voltage DAC 3 Output.
Rev. 0 | Page 1ꢀ of 25
Data Sheet
ADuCM420
Pin No. Mnemonic
Type1
Description
B1
P0.3/IRQ0/CS0/PLACLK0/PLAI3
I/O
Digital Input/Output Port 0.3 (P0.3).
External Interrupt 0 (IRQ0).
SPI Channel 0 (SPI0) Chip Select (CS0).
PLA Clock 0 (PLACLK0).
Input to PLA Element 3 (PLAI3).
Ball B1 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
B2
B3
P0.2/MOSI0/PLACLK1/PLAI2
I/O
I/O
Digital Input/Output Port 0.2 (P0.2).
SPI0 Master Output, Slave Input (MOSI0).
PLA Clock 1 (PLACLK1).
Input to PLA Element 2 (PLAI2).
Ball B2 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
P2.3/BM/PLAI10
Digital Input/Output Port 2.3 (P2.3). An internal pull-up resistor is enabled
at power-up on P2.3.
Boot Mode (BM). This pin determines the start-up sequence after every reset.
Input to PLA Element 10 (PLAI10).
B4
B5
Bꢀ
B7
B8
C1
C2
SWCLK
RESET
I
I
Serial Wire Debug Clock.
Reset Input (Active Low). An internal pull-up resistor is included with this pin.
Voltage DAC 1 Output.
0.ꢁ2 V Reference with 100 nF Capacitor.
3.3 V Analog Power Supply.
1.2 V or 1.8 V GPIO Supply.
Digital Input/Output Port 0.1 (P0.1).
SPI0 Master Input, Slave Output (MISO0).
Comparator 1 Output (COMOUT1)
VDAC1
VREF
AVDD
IOVDD1
AO
AO/AI
S
S
I/O
P0.1/MISO0/COMOUT1/PLAI1
Input to PLA Element 1 (PLAI1).
Ball C2 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
C3
C4
P0.0/SCLK0/COMOUT0/PLAI0
P1.0/SIN1/COMOUT2/PLAI4
I/O
I/O
Digital Input/Output Port 0.0 (P0.0).
SPI0 Clock (SCLK0).
Comparator 0 Output (COMOUT0).
Input to PLA Element 0 (PLAI0).
Ball C3 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
Digital Input/Output Port 1.0 (P1.0).
UART Input 1 (SIN1).
Comparator 2 Output (COMOUT2).
Input to PLA Element 4 (PLAI4).
Ball C4 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
C5
Cꢀ
P2.2/POR/CLKOUT/SWO
I/O
Digital Input/Output Port 2.2 (P2.2).
Reset Output (POR). This pin function is an output, and it is the default.
Clock Output (CLKOUT).
SWD Output (SWO).
Analog Input 14 (AIN14).
AIN14/COM3P/BUF0_VREF
AI/AO
Comparator 3 Emitter Voltage (VE) Positive (COM3P).
Buffered Reference Voltage source (BUF0_VREF).
Analog Input 2.
C7
C8
AIN2
AIN4/VDAC0
AI
AI
Analog Input 4 (AIN4).
Voltage DAC 0 Output (VDAC0).
D1
D2
DVDD_REG
DGND
AO
S
0.ꢁ V Digital Regulator Supply with 0.47 ꢂF Decoupling Capacitor. Do not
use DVDD_REG to power external circuits.
Digital Ground.
Rev. 0| Page 17 of 25
ADuCM420
Data Sheet
Pin No. Mnemonic
Type1
Description
D3
D4
D5
P1.2/SCL1/PWM0/PLAIꢀ
I/O
Digital Input/Output Port 1.2 (P1.2).
I2C Channel 1 (I2C1) Serial Clock (SCL1).
PWM Output 0 (PWM0).
Input to PLA Element ꢀ (PLAIꢀ).
Ball D3 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
Digital Input/Output Port 1.3 (P1.3).
I2C1 Serial Data (SDA1).
PWM Output 1 (PWM1).
Input to PLA Element 7 (PLAI7).
Ball D4 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
P1.3/SDA1/PWM1/PLAI7
I/O
I/O
P1.1/SOUT1/COMOUT3/PLAI5
Digital Input/Output Port 1.1 (P1.1).
UART Output 1 (SOUT1).
Comparator 3 Output (COMOUT3)
Input to PLA Element 5 (PLAI5).
Ball D5 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
Dꢀ
D7
D8
AIN3
AIN0
AIN10/COM1P
AI
AI
AI
Analog Input 3.
Analog Input 0.
Analog Input 10 (AIN10).
Comparator 1 VE Positive (COM1P).
3.3 V GPIO Supply.
Ground for Digital Inputs/Outputs.
Digital Input/Output Port 1.4 (P1.4).
SPI Channel 1 (SPI1) Clock (SCLK1).
PWM Output 2 (PWM2).
E1
E2
E3
IOVDD0
IOGND
P1.4/SCLK1/PWM2/PLAO10
S
S
I/O
Output of PLA Element 10 (PLAO10).
Ball E3 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
E4
P1.7/IRQ1/CS1/PWM5/PLAO13
I/O
Digital Input/Output Port 1.7 (P1.7).
External Interrupt 1 (IRQ1).
SPI1 Chip Select (CS1).
PWM Output 5 (PWM5).
Output of PLA Element 13 (PLAO13).
Ball E4 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
E5
Eꢀ
VDAC8/P5.0
AO/I/O Voltage DAC 8 Output (VDAC8).
Digital Input/Output Port 5.0 (P5.0).
AIN12/COM2P
AI
Analog Input 12 (AIN12).
Comparator 2 VE Positive (COM2P).
Analog Ground.
E7
E8
AGND
AVDD_REG
S
AO
2.5 V Analog Regulator Supply with 0.47 ꢂF Decoupling Capacitor. Do not
use AVDD_REG to power external circuits.
F1
P1.5/MISO1/PWM3/PLAO11
I/O
Digital Input/Output Port 1.5 (P1.5).
SPI1 Master Input, Slave Output (MISO1).
PWM Output 3 (PWM3).
Output of PLA Element 11 (PLAO11).
Ball F1 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
Rev. 0 | Page 18 of 25
Data Sheet
ADuCM420
Pin No. Mnemonic
Type1
Description
F2
P1.ꢀ/MOSI1/PWM4/PLAO12
I/O
Digital Input/Output Port 1.ꢀ (P1.ꢀ).
SPI1 Master Output, Slave Input (MOSI1).
PWM Output 4 (PWM4).
Output of PLA Element 12 (PLAO12).
Ball F2 is a multilevel voltage input/output with 3.3 V, 1.8 V, or 1.2 V
support. Note that 3.3 V is the default.
F3
F4
P0.7/IRQ4/SDA2/COMPDIN1/PLAO5
P3.2/PRTADDR2/PWMTRIP/PLAI14
I/O
I/O
Digital Input/Output Port 0.7 (P0.7).
External Interrupt 4 (IRQ4).
I2C Channel 2 (I2C2) Serial Data (SDA2).
Comparator 1 Digital Input for Three-State (COMPDIN1).
Output of PLA Element 5 (PLAO5).
Digital Input/Output Port 3.2 (P3.2).
MDIO Port Address Bit 2 (PRTADDR2).
PWM Trip (PWMTRIP).
Input to PLA Element 14 (PLAI14).
F5
Fꢀ
VDACꢁ/P5.1
AIN8/COM0P
AO/I/O Voltage DAC ꢁ Output (VDACꢁ).
Digital Input/Output Port 5.1 (P5.1).
AI
Analog Input 8 (AIN8).
Comparator 0 VE Positive (COM0P).
F7
F8
ADCREFN
ADCREFP
AO/AI
AO/AI
Decoupling Capacitor Connection for ADC. Connect this pin to AGND.
Decoupling Capacitor Connection for ADC Reference Buffer with 4.7 ꢂF
Decoupling Capacitor.
G1
G2
G3
P0.4/SCL0/SIN0/PLAO2
I/O
I/O
I/O
Digital Input/Output Port 0.4 (P0.4).
I2C Channel 0 (I2C0) Serial Clock (SCL0).
UART 0 Input (SIN0).
Output of PLA Element 2 (PLAO2).
Digital Input/Output Port 0.5 (P0.5).
I2C0 Serial Data (SDA0).
P0.5/SDA0/SOUT0/PLAO3
P0.ꢀ/IRQ3/SCL2/COMPDIN0/PLAO4
UART Output 0 (SOUT0).
Output of PLA Element 3 (PLAO3).
Digital Input/Output Port 0.ꢀ (P0.ꢀ).
External Interrupt 3 (IRQ3).
I2C2 Serial Clock (SCL2).
Comparator 0 Digital Input for Three-State (COMPDIN0).
Output of PLA Element 4 (PLAO4).
Digital Input/Output Port 3.1 (P3.1).
MDIO Port Address Bit 1 (PRTADDR1).
PWM Synchronization (PWMSYNC).
Input to PLA Element 13 (PLAI13).
G4
P3.1/PRTADDR1/PWMSYNC/PLAI13
I/O
G5
Gꢀ
VDAC11/P5.3
AIN7/VDAC2
AO/I/O Voltage DAC 11 Output (VDAC11).
Digital Input/Output Port 5.1 (P5.3).
AI
Analog Input 7 (AIN7).
Voltage DAC 2 Output (VDAC2).
Analog Input 1.
Analog Input ꢁ (AINꢁ).
G7
G8
AIN1
AINꢁ/COM0N
AI
AI
Comparator 0 VE Negative (COM0N).
Ground for Digital Inputs/Outputs.
1.8 V or 3.3 V Digital Power Supply.
Digital Input/Output Port 3.ꢀ (P3.ꢀ).
MDIO Slave Data (MDIO).
H1
H2
H3
IOGND
DVDD
P3.ꢀ/MDIO
S
S
I/O
H4
P3.5/MCK/SRDY1/PLAO27
I/O
Digital Input/Output Port 3.5 (P3.5).
MDIO Slave Clock (MCK).
SPI1 Ready (SRDY1).
Output of PLA Element 27 (PLAO27).
Rev. 0| Page 1ꢁ of 25
ADuCM420
Data Sheet
Pin No. Mnemonic
Type1
Description
H5
P3.0/PRTADDR0/SRDY0/PLAI12
I/O
Digital Input/Output Port 3.0 (P3.0).
MDIO Port Address Bit 0 (PRTADDR0).
SPI0 Ready (SRDY0).
Input to PLA Element 12 (PLAI12).
Hꢀ
VDAC10/P5.2
AO/I/O Voltage DAC 10 Output (VDAC10).
Digital Input/Output Port 5.2 (P5.2).
H7
H8
VDAC4
AIN13/COM2N
AO
AI
Voltage DAC 4 Output.
Analog Input 13 (AIN13).
Comparator 2 VE Negative (COM2N).
1 S is supply, I/O is input/output, AO is analog output, I is digital input, and AI is analog input.
Rev. 0 | Page 20 of 25
Data Sheet
ADuCM420
THEORY OF OPERATION
The ADuCM420 is an on-chip system. The ADuCM420 is
mixed-signal microcontroller based on the Arm Cortex-M33
processor.
to, all register details and information about the various
features and operation of the power management unit, the Arm
Cortex-M33 processor, the ADC circuit, the flash controller,
and the SPI, I2C, and UART interfaces.
See the ADuCM420 hardware reference manual for full details
on the operation of the ADuCM420, including, but not limited
Rev. 0| Page 21 of 25
ADuCM420
Data Sheet
APPLICATIONS INFORMATION
Note that the analog and digital ground pins on the ADuCM420
must be referenced to the same system ground reference point
at all times.
POWER SUPPLIES
The ADuCM420 operational power supply voltage is 2.85 V to
3.6 V for AVDD and IOVDD0, 1.2 V or 1.8 V for IOVDD1,
and 1.8 V to 3.6 V for DVDD. Separate analog (AVDD) and
digital power supply pins (IOVDD1 and DVDD) allow AVDD
to be kept relatively free of noisy digital signals often present in
the system DVDD line. In this mode, the ADuCM420 can also
operate with split supplies. That is, the device can use different
voltage levels for each supply as long as the minimum and
maximum specifications defined in Table 1 and Table 9 for
each supply are adhered to. A typical split supply configuration
is shown in Figure 15.
POWER-UP REQUIREMENTS
Figure 17 and Figure 18 show the power-up requirements for
DVDD and AVDD. Figure 19 shows the power-up requirement
for IOVDD0 if no external pull-up is applied to the
P2.3/BM/PLAI10 pin.
3.6
AFTER 50ms DVDD MUST
STAY ABOVE 1.7V INCLUDING
NOISE EXCURSIONS
DIGITAL SUPPLY
ANALOG SUPPLY
3.3V
10µF
10µF
1.8
1.7
ADuCM420
AVDD
DVDD
0.1µF
0.1µF
0.1µF
10µF
0.1µF
0.1µF
IOVDD0
50ms MIN
DVDD MUST BE ABOVE
1.8V FOR AT LEAST 50ms
TO COMPLETE POR
1
GND
REF
1.6
AGND
IOVDD1
DGND
1.8V
TIME (Not to Scale)
1
GND
IS A COMMON GROUND BETWEEN AGND AND DGND.
REF
Figure 17. DVDD Power-Up Requirements
Figure 15. External Multiple Supply Connections
25ms
DVDD
As an alternative to providing two separate power supplies, the
user can reduce noise on AVDD by placing a small series
resistor and/or ferrite bead between AVDD and DVDD and
then decoupling AVDD separately to ground. An example of
this configuration is shown in Figure 16. With this configuration,
other analog circuitry (such as op amps and voltage reference)
can be powered from the AVDD supply line as well.
AVDD
2.85V
1.6V
AFTER DVDD RISES
ABOVE 1.6V
(POR THRESHOLD),
AVDD MUST REACH
2.85V (min.) WITHIN 25ms.
OTHERWISE, RESET ADC
BEAD
1.6V
1
3.3V
AND VDACs IN SOFTWARE .
10µF
10µF
ADuCM420
AVDD
DVDD
0.1µF
0.1µF
10µF
0.1µF
TIME
DETAILS IN HARDWARE REFERENCE MANUAL.
IOVDD0
1
0.1µF
0.1µF
1
GND
REF
LDO
1.8V
Figure 18. AVDD Power-Up Requirements
AGND
IOVDD1
DGND
25ms
DVDD
IOVDD0
1
GND
IS A COMMON GROUND BETWEEN AGND AND DGND.
2.85V
1.6V
REF
Figure 16. External Single-Supply Connections
In both Figure 15 and Figure 16, a large value (10 μF) reservoir
capacitor is connected to DVDD, and a separate 10 μF capacitor is
connected to AVDD. In addition, local small value (0.1 μF)
capacitors are located at each AVDD, IOVDD0, IOVDD1, and
DVDD pin of the chip. As per standard design practice, include
all of these capacitors and ensure that the smaller capacitors are
close to each supply pin with trace lengths as short as possible.
Connect the ground terminal of each of these capacitors
directly to the underlying ground plane.
TIME
Figure 19. IOVDD0 Power-Up Requirement, No External Pull-Up
Rev. 0 | Page 22 of 25
Data Sheet
ADuCM420
Similarly, the analog supply pin (AVDD) requires a 0.1 μF
RECOMMENDED CIRCUIT AND COMPONENT
VALUES
capacitor placed as near as possible to each ball and its
associated AGND ball. Also, place a 10 ꢀF capacitor near these
balls.
Figure 20 shows a typical connection diagram for the ADuCM420.
Adequately decouple the supplies and regulators with
capacitors connected between the AVDD_REG, DVDD_REG,
and IOVDDx balls and their associated ground balls (AGND
and DGND). Table 12 indicates which ground balls are paired
with which supply balls.
The ADC reference requires a 4.7 ꢀF capacitor be placed
between ADCREFP and ADCREFN and located as near as
possible to each ball. ADCREFN must be connected directly to
AGND. The ADuCM420 contains two internal regulators.
These regulators require external decoupling capacitors. The
DVDD_REG and AVDD_REG balls each require a 0.47 μF
capacitor to DGND and AGND, respectively. Take care in the
layout to ensure that currents flowing from the ground end of
each decoupling capacitor to its associated ground ball share as
little track as possible with other ground currents on the PCB.
There are three digital supply balls, IOVDD0, IOVDD1, and
DVDD. Decouple these balls with a 0.1 μF capacitor placed as
near as possible to each of the three balls and their associated
ground balls (IOGND and DGND). In addition, place a 10 ꢀF
capacitor near these balls.
For DVDD, to improve noise reduction, place a ferrite bead in
series with a 10 ꢀF capacitor to DGND.
Rev. 0| Page 23 of 25
ADuCM420
Data Sheet
0.47µF
IOVDD0
10kΩ
RESET
IOVDD0
10kΩ
ADuCM420
P2.3/BM/PLAI10
P1.0/SIN1/COMOUT2/PLAI4
SWCLK
P1.1/SOUT1/COMOUT3/PLAI5
SWDIO
0.47µF
0.1µF
4.7µF
RESET
GND
RESET
SWDIO
Tx
SWCLK
Rx
NC
IOVDD0
AVDD
LT3022EMSE
VIN
IN
OUT
IOVDD1
0.1µF
0.1µF
0.1µF
10µF
10kΩ
0.1µF
10µF
0.1µF
10µF
PGND
AVDD
ADJ/SENSE
AGND
10µF
ADP7104ARDZ-3.3
AVDD
VIN
VIN
VOUT
PG
10kΩ
10µF
0.1µF
10µF
0.1µF
10µF
EN/UVLO
SENSE/ADJ
GND
Figure 20. Recommended Circuit and Component Values (ADuCM420, LT3022EMSE, and ADP7104ARDZ-3.3)
Rev. 0 | Page 24 of 25
Data Sheet
ADuCM420
OUTLINE DIMENSIONS
3.50
3.46 SQ
3.42
8
7
6
5
4
3
2
1
A
BALL A1
IDENTIFIER
B
C
D
E
F
2.80
REF
G
H
0.40
BSC
TOP VIEW
(BALL SIDE DOWN)
BOTTOM VIEW
(BALL SIDE UP)
0.330
0.300
0.270
2.80 REF
0.560
0.500
0.440
SIDE VIEW
COPLANARITY
0.05
0.300
0.260
0.220
SEATING
PLANE
0.230
0.200
0.170
Figure 21. 64-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-64-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
CB-ꢀ4-2
CB-ꢀ4-2
ADUCM420BCBZ-RL
ADUCM420BCBZ-RL7
EVAL-ADuCM420QSP1Z
−40°C to +105°C
−40°C to +105°C
ꢀ4-Ball Wafer Level Chip Scale Package [WLCSP]
ꢀ4-Ball Wafer Level Chip Scale Package [WLCSP]
WLCSP Evaluation Board and Quick Start Development System
1 Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2021 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D25843-1/21(0)
Rev. 0 | Page 25 of 25
相关型号:
©2020 ICPDF网 联系我们和版权申明