ADXL345TCCZ-EP-RL [ADI]
3-Axis, ±2 g/±4 g/±8 g/±16 g Digital Accelerometer;
| 型号： | ADXL345TCCZ-EP-RL |
| 厂家： | 
ADI |
| 描述： | 3-Axis, ±2 g/±4 g/±8 g/±16 g Digital Accelerometer |
| 文件： | 总12页 (文件大小：247K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
3-Axis, 2 g/ 4 g/ 8 g/ 16 g
Digital Accelerometer
Enhanced Product
ADXL345-EP
FEATURES
GENERAL DESCRIPTION
Ultralow power: as low as 23 µA in measurement mode and
0.1 µA in standby mode at VS = 2.5 V (typical)
Power consumption scales automatically with bandwidth
User-selectable resolution from 10 to 13 bits
4 mg/LSB scale factor in all g ranges
32-sample FIFO minimizes host processor load
Single tap, double tap, and free-fall detection
Activity/inactivity monitoring
The ADXL345-EP is an extended performance version of
the ADXL345, which is a small, thin, ultralow power, 3-axis
accelerometer with high resolution (13-bit) measurement at up to
16 g. Digital output data is formatted as 16-bit twos complement
and is accessible through either a SPI (3- or 4-wire) or I2C digital
interface.
The ADXL345-EP is well suited for extended temperature range
industrial and aerospace equipment. It measures the static
acceleration of gravity in tilt-sensing applications, as well as
dynamic acceleration resulting from motion or shock. Its high
resolution (3.9 mg/LSB) enables measurement of inclination
changes less than 1.0°.
Supply voltage range: 2.0 V to 3.6 V
I/O voltage range: 1.7 V to VS
SPI (3- and 4-wire) and I2C digital interfaces
Flexible interrupt modes mappable to either interrupt pin
Measurement ranges selectable via serial command
Bandwidth selectable via serial command
10,000 g shock survival
Several special sensing functions are provided. Activity and
inactivity sensing detect the presence or lack of motion by
comparing the acceleration on any axis with user-set thresholds.
Tap sensing detects single and double taps in any direction. Free-
fall sensing detects if the device is falling. These functions can
be mapped individually to either of two interrupt output pins.
An integrated memory management system with a 32-level first in,
first out (FIFO) buffer can be used to store data to minimize host
processor activity and lower overall system power consumption.
Pb free/RoHS compliant
Small and thin: 3 mm × 5 mm × 1 mm LGA package
ENHANCED PRODUCT FEATURES
Supports defense and aerospace applications (AQEC standard)
Extended industrial temperature range (−55°C to +105°C)
Controlled manufacturing baseline
One assembly/test site
One fabrication site
Low power modes enable intelligent motion-based power
management with threshold sensing and active acceleration
measurement at extremely low power dissipation.
Enhanced product change notification
Qualification data available on request
The ADXL345-EP is supplied in a small, thin, 3 mm × 5 mm ×
1 mm, 14-lead, enhanced plastic package.
APPLICATIONS
Industrial equipment
Aerospace equipment
FUNCTIONAL BLOCK DIAGRAM
V
V
DD I/O
S
ADXL345-EP
POWER
MANAGEMENT
INT1
INT2
CONTROL
AND
INTERRUPT
LOGIC
SENSE
ELECTRONICS
ADC
DIGITAL
FILTER
3-AXIS
SENSOR
SDA/SDI/SDIO
32 LEVEL
FIFO
SERIAL I/O
SDO/ALT
ADDRESS
SCL/SCLK
GND
CS
Figure 1.
Rev. B
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2009–2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADXL345-EP
Enhanced Product
TABLE OF CONTENTS
Absolute Maximum Ratings ............................................................5
Thermal Resistance.......................................................................5
ESD Caution...................................................................................5
Pin Configuration and Function Descriptions..............................6
Typical Performance Characteristics ..............................................7
Outline Dimensions..........................................................................9
Ordering Guide .............................................................................9
Features .............................................................................................. 1
Enhanced Product Features ............................................................ 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Related Documents .......................................................................... 2
Specifications..................................................................................... 3
REVISION HISTORY
4/13—Rev. A to Rev. B
Deleted Package Information Section, Figure 2, and Table 4,
Renumbered Sequentially.................................................................5
2/13—Rev. 0 to Rev. A
Changes 354 to 345 in Figure 2....................................................... 5
12/11—Revision 0: Initial Version
RELATED DOCUMENTS
The ADXL345-EP is, by definition, an extended performance variation of the ADXL345 accelerometer. All ADXL345 datasheet
descriptions are applicable and not repeated in this document, so users should refer to it for complete functionality and product
description. Information and data in this ADXL345-EP subset datasheet supersede those in the standard ADXL345 datasheet.
Rev. B | Page 2 of 12
Enhanced Product
SPECIFICATIONS
ADXL345-EP
TA = 25°C, VS = 2.5 V, V DD I/O = 1.8 V, acceleration = 0 g, CS = 10 µF tantalum, CI/O = 0.1 µF, output data rate (ODR) = 800 Hz, unless
otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed.
Table 1.
Parameter
Test Conditions
Each axis
User selectable
Percentage of full scale
Min
Typ1
Max
Unit
SENSOR INPUT
Measurement Range
Nonlinearity
Inter-Axis Alignment Error
Cross-Axis Sensitivity2
OUTPUT RESOLUTION
All g Ranges
2, 4, 8, 16
g
%
0.5
0.1
1
Degrees
%
Each axis
10-bit resolution
Full resolution
Full resolution
Full resolution
10
Bits
Bits
Bits
Bits
Bits
2 g Range
4 g Range
8 g Range
16 g Range
10
11
12
13
Full resolution
SENSITIVITY
Each axis
Sensitivity at XOUT, YOUT, ZOUT
All g-ranges, full resolution
2 g, 10-bit resolution
4 g, 10-bit resolution
8 g, 10-bit resolution
16 g, 10-bit resolution
All g-ranges
All g-ranges, full resolution
2 g, 10-bit resolution
4 g, 10-bit resolution
8 g, 10-bit resolution
16 g, 10-bit resolution
230
230
115
57
256
256
128
64
32
1.0
3.9
3.9
7.8
15.6
31.2
282
282
141
71
LSB/g
LSB/g
LSB/g
LSB/g
LSB/g
%
mg/LSB
mg/LSB
mg/LSB
mg/LSB
mg/LSB
%/°C
29
35
Sensitivity Deviation from Ideal
Scale Factor at XOUT, YOUT, ZOUT
3.5
3.5
7.1
14.1
28.6
4.3
4.3
8.7
17.5
34.5
Sensitivity Change Due to Temperature
0 g OFFSET
0.01
Each axis
0 g Output for XOUT, YOUT
0 g Output for ZOUT
−150
−250
0
0
+150
+250
mg
mg
0 g Output Deviation from Ideal, XOUT, YOUT
0 g Output Deviation from Ideal, ZOUT
0 g Offset vs. Temperature for X-, Y-Axes
0 g Offset vs. Temperature for Z-Axis
NOISE
35
40
0.4
1.2
mg
mg
mg/°C
mg/°C
X-, Y-Axes
ODR = 100 Hz for 2 g, 10-bit resolution or
all g-ranges, full resolution
ODR = 100 Hz for 2 g, 10-bit resolution or
all g-ranges, full resolution
0.75
1.1
LSB rms
LSB rms
Z-Axis
OUTPUT DATA RATE AND BANDWIDTH
Output Data Rate (ODR)3, 4, 5
SELF-TEST6
User selectable
0.1
3200
Hz
Output Change in X-Axis
Output Change in Y-Axis
Output Change in Z-Axis
POWER SUPPLY
0.20
−2.10
0.30
2.10
−0.20
3.40
g
g
g
Operating Voltage Range (VS)
Interface Voltage Range (VDD I/O
Supply Current
2.0
1.7
2.5
1.8
140
23
0.1
1.4
3.6
VS
V
V
µA
µA
µA
ms
)
ODR ≥ 100 Hz
ODR < 10 Hz
Standby Mode Leakage Current
Turn-On and Wake-Up Time7
ODR = 3200 Hz
Rev. B | Page 3 of 12
ADXL345-EP
Enhanced Product
Parameter
Test Conditions
Min
Typ1
Max
Unit
TEMPERATURE
Operating Temperature Range
WEIGHT
−55
+105
°C
Device Weight
30
mg
1 The typical specifications shown are for at least 68% of the population of parts and are based on the worst case of mean 1 σ, except for 0 g output and sensitivity,
which represents the target value. For 0 g output and sensitivity, the deviation from the ideal describes the worst case of mean 1 σ.
2 Cross-axis sensitivity is defined as coupling between any two axes.
3 Bandwidth is the −3 dB frequency and is defined as half the output data rate, bandwidth = ODR/2.
4 The output format for the 3200 Hz and 1600 Hz ODRs is different from the output format for the remaining ODRs. This difference is described in the ADXL345 data
sheet.
5 Output data rates below 6.25 Hz exhibit additional offset shift with increased temperature, depending on selected output data rate. Refer to the ADXL345 data sheet
for details.
6 Self-test change is defined as the output (g) when the SELF_TEST bit = 1 (in the DATA_FORMAT register, Address 0x31) minus the output (g) when the SELF_TEST
bit = 0. Due to device filtering, the output reaches its final value after 4 × τ when enabling or disabling self-test, where τ = 1/(data rate). The part must be in normal
power operation (LOW_POWER bit = 0 in the BW_RATE register, Address 0x2C) for self-test to operate correctly.
7 Turn-on and wake-up times are determined by the user-defined bandwidth. At a 100 Hz data rate, the turn-on and wake-up times are each approximately 11.1 ms. For
other data rates, the turn-on and wake-up times are each approximately τ + 1.1 in milliseconds, where τ = 1/(data rate).
Rev. B | Page 4 of 12
Enhanced Product
ADXL345-EP
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Parameter
Acceleration
Any Axis, Unpowered
Any Axis, Powered
VS
Rating
Table 3. Package Characteristics
Package Type
θJA
θJC
Device Weight
10,000 g
10,000 g
−0.3 V to +3.9 V
−0.3 V to +3.9 V
14-Terminal LGA
150°C/W
85°C/W
30 mg
ESD CAUTION
VDD I/O
Digital Pins
−0.3 V to VDD I/O + 0.3 V or 3.9 V,
whichever is less
All Other Pins
Output Short-Circuit Duration
(Any Pin to Ground)
−0.3 V to +3.9 V
Indefinite
Temperature Range
Powered
Storage
−55°C to +105°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. B | Page 5 of 12
ADXL345-EP
Enhanced Product
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
ADXL345-EP
TOP VIEW
(Not to Scale)
SCL/SCLK
1
2
3
4
5
6
13
12
11
10
9
V
SDA/SDI/SDIO
SDO/ALT ADDRESS
RESERVED
NC
14
DD I/O
GND
RESERVED
GND
+x
+y
+z
INT2
GND
7
8
V
INT1
S
CS
Figure 2. Pin Configuration (Top View)
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
2
3
4
5
6
VDD I/O
GND
RESERVED
GND
GND
Digital Interface Supply Voltage.
This pin must be connected to ground.
Reserved. This pin must be connected to VS or left open.
This pin must be connected to ground.
This pin must be connected to ground.
Supply Voltage.
VS
7
CS
Chip Select.
8
INT1
Interrupt 1 Output.
9
INT2
Interrupt 2 Output.
10
11
12
13
14
NC
Not Internally Connected.
Reserved. This pin must be connected to ground or left open.
Serial Data Output (SPI 4-Wire)/Alternate I2C Address Select (I2C).
Serial Data (I2C)/Serial Data Input (SPI 4-Wire)/Serial Data Input and Output (SPI 3-Wire).
Serial Communications Clock. SCL is the clock for I2C, and SCLK is the clock for SPI.
RESERVED
SDO/ALT ADDRESS
SDA/SDI/SDIO
SCL/SCLK
Rev. B | Page 6 of 12
Enhanced Product
ADXL345-EP
TYPICAL PERFORMANCE CHARACTERISTICS
150
150
100
50
100
50
0
–50
0
–50
–100
–100
–150
–150
–60
–40
–20
0
20
40
60
80
100
–60
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 3. X-Axis Zero g Offset vs. Temperature—
Figure 6. X-Axis Zero g Offset vs. Temperature—
Eight Parts in Sockets, VS = 3.6 V
Eight Parts in Sockets, VS = 2.5 V
150
150
100
50
100
50
0
–50
0
–50
–100
–100
–150
–150
–60
–40
–20
0
20
40
60
80
100
–60
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 7. Y-Axis Zero g Offset vs. Temperature—
Eight Parts Soldered to PCB, VS = VDD I/O = 2.5 V
Figure 4. Y-Axis Zero g Offset vs. Temperature—
Eight Parts in Sockets, VS = VDD I/O = 3.6 V
250
250
200
150
100
50
200
150
100
50
0
0
–50
–60
–50
–40
–20
0
20
40
60
80
100
–60
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 5. Z-Axis Zero g Offset vs. Temperature—
Figure 8. Z-Axis Zero g Offset vs. Temperature—
Eight Parts Soldered to PCB, VS = VDD I/O = 2.5 V
Eight Parts in Sockets, VS = VDD I/O = 3.6 V
Rev. B | Page 7 of 12
ADXL345-EP
Enhanced Product
260
260
258
256
258
256
254
252
250
254
252
250
248
246
244
248
246
244
242
242
–60
–40
–20
0
20
40
60
80
100
120
–60
–40
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 9. X-Axis Sensitivity vs. Temperature—
Eight Parts in Sockets, VS = VDD I/O = 2.5 V
Figure 11. Y-Axis Sensitivity vs. Temperature—
Eight Parts in Sockets, VS = VDD I/O = 2.5 V
260
258
256
254
252
250
248
246
244
242
–60
–40
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
Figure 10. Z-Axis Sensitivity vs. Temperature—
Eight Parts in Sockets, VS = VDD I/O = 2.5 V
Rev. B | Page 8 of 12
Enhanced Product
ADXL345-EP
OUTLINE DIMENSIONS
3.00
BSC
PAD A1
CORNER
0.49
BOTTOM VIEW
0.813 × 0.50
1
13
14
0.80
BSC
5.00
BSC
0.50
8
6
7
TOP VIEW
END VIEW
1.01
0.49
0.79
0.74
0.69
1.00
0.95
0.85
1.50
SEATING
PLANE
Figure 12. 14-Terminal Land Grid Array [LGA]
(CC-14-1)
Solder Terminations Finish Is Au over Ni
Dimensions shown in millimeters
ORDERING GUIDE
Measurement Specified
Range (g) Voltage (V)
Temperature
Range
Package
Option
Model1
Package Description
ADXL345TCCZ-EP
ADXL345TCCZ-EP-RL7
ADXL345TCCZ-EP-RL
2, 4, 8, 16 2.5
2, 4, 8, 16 2.5
2, 4, 8, 16 2.5
−55°C to +105°C
−55°C to +105°C
−55°C to +105°C
14-Terminal Land Grid Array [LGA]
14-Terminal Land Grid Array [LGA]
14-Terminal Land Grid Array [LGA]
CC-14-1
CC-14-1
CC-14-1
1 Z = RoHS Compliant Part.
Rev. B | Page 9 of 12
ADXL345-EP
NOTES
Enhanced Product
Rev. B | Page 10 of 12
Enhanced Product
NOTES
ADXL345-EP
Rev. B | Page 11 of 12
ADXL345-EP
NOTES
Enhanced Product
Analog Devices offers specific products designated for automotive applications; please consult your local Analog Devices sales representative for details. Standard products sold by
Analog Devices are not designed, intended, or approved for use in life support, implantable medical devices, transportation, nuclear, safety, or other equipment where malfunction
of the product can reasonably be expected to result in personal injury, death, severe property damage, or severe environmental harm. Buyer uses or sells standard products for use
in the above critical applications at Buyer's own risk and Buyer agrees to defend, indemnify, and hold harmless Analog Devices from any and all damages, claims, suits, or expenses
resulting from such unintended use.
©2009–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10413-0-4/13(B)
Rev. B | Page 12 of 12
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