ADuM6210BRSZ [ADI]
Dual-Channel Isolators with Integrated DC-to-DC Converters; 双通道隔离器，集成DC- DC转换器
| 型号： | ADuM6210BRSZ |
| 厂家： | 
ADI |
| 描述： | Dual-Channel Isolators with Integrated DC-to-DC Converters |
| 文件： | 总24页 (文件大小：532K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Dual-Channel Isolators with
Integrated DC-to-DC Converters
ADuM6210/ADuM6211/ADuM6212
FUNCTIONAL BLOCK DIAGRAM
Data Sheet
FEATURES
isoPower integrated, isolated dc-to-dc converter
Regulated 3.15 V to 5.25 V output
Up to 150 mW output power
Dual dc-to-100 Mbps (NRZ) signal isolation channels
Soft start power supply
20-lead SSOP package with 5.3 mm creepage
Supports SPI up to 15 MHz
High temperature operation: 105°C
High common-mode transient immunity: >25 kV/µs
Safety and regulatory approvals
1
20
V
V
DD1
DD2
2
19 GND
ISO
GND
/V
P
2-CHANNEL iCoupler CORE
3
18
V
V
/V
V
V
OA IA
IA OA
ADuM6210/ADuM6211/
ADuM6212
4
17
/V
/V
IB OB
OB IB
GND
P
5
16
GND
GND
NC
ISO
ISO
GND
P
6
15
14
NC
7
8
PCS
OSC
13
PDIS
V
V
SEL
ISO
V
1.25V 12
9
DDP
UL recognition (pending)
GND
P
10
11
GND
RECT REG
ISO
3750 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice #5A (pending)
VDE certificate of conformity (pending)
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
Figure 1. ADuM6210/ADuM6211/ADuM6212
V
IORM = 849 V peak
APPLICATIONS
RS-232 transceivers
Power supply start-up bias and gate drives
Isolated sensor interfaces
Industrial PLCs
GENERAL DESCRIPTION
The ADuM6210/ADuM6211/ADuM62121 are dual-channel
digital isolators with isoPower®, an integrated, isolated dc-to-
dc converter. Based on the Analog Devices, Inc., iCoupler®
technology, the dc-to-dc converter provides regulated, isolated
power that is adjustable between 3.15 V and 5.25 V. Input supply
voltages can range from slightly below the required output to
significantly higher. Popular voltage combinations and their
associated power levels are shown in Table 1.
Table 1. Power Levels
Input Voltage (V)
Output Voltage (V) Output Power (mW)
5
5
150
100
66
5
3.3
3.3
3.3
The ADuM6210/ADuM6211/ADuM6212 eliminate the need
for a separate, isolated dc-to-dc converter in low power, isolated
designs. The iCoupler chip-scale transformer technology is used for
isolated logic signals and for the magnetic components of the dc-
to-dc converter. The result is a small form factor, total isolation
solution.
isoPower uses high frequency switching elements to transfer
power through its transformer. Take special care during printed
circuit board (PCB) layout to meet emissions standards. See the
AN-0971 Application Note for board layout recommendations.
1
Protected by U.S. Patents 5,952,849; 6,873,065; 6,903,578; and 7,075,329. Other patents are pending.
Rev. 0
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2013 Analog Devices, Inc. All rights reserved.
www.analog.com
ADuM6210/ADuM6211/ADuM6212
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Recommended Operating Conditions .................................... 10
Absolute Maximum Ratings ......................................................... 11
ESD Caution................................................................................ 11
Pin Configurations and Function Descriptions......................... 12
Truth Tables................................................................................. 15
Typical Performance Characteristics ........................................... 16
Applications Information .............................................................. 19
PCB Layout ................................................................................. 19
Thermal Analysis ....................................................................... 20
Propagation Delay Parameters ................................................. 20
EMI Considerations................................................................... 20
DC Correctness and Magnetic Field Immunity........................... 20
Power Consumption .................................................................. 21
Insulation Lifetime..................................................................... 22
Outline Dimensions....................................................................... 23
Ordering Guide .......................................................................... 23
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Characteristics—5 V Primary Input Supply/
5 V Secondary Isolated Supply ................................................... 3
Electrical Characteristics—3.3 V Primary Input Supply/
3.3 V Secondary Isolated Supply ................................................ 5
Electrical Characteristics—5 V Primary Input Supply/
3.3 V Secondary Isolated Supply ................................................ 7
Package Characteristics ............................................................... 9
Regulatory Approvals................................................................... 9
Insulation and Safety-Related Specifications............................ 9
DIN V VDE V 0884-10 (VDE V 0884-10) Insulation
Characteristics ............................................................................ 10
REVISION HISTORY
1/13—Revision 0: Initial Version
Rev. 0 | Page 2 of 24
Data Sheet
ADuM6210/ADuM6211/ADuM6212
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS—5 V PRIMARY INPUT SUPPLY/5 V SECONDARY ISOLATED SUPPLY
All typical specifications are at TA = 25°C, VDD1 = VDD2 = VDDP = 5 V, VSEL resistor network: R1 = 10 kΩ, R2 = 30.9 kΩ between VISO and
GNDISO. Minimum/maximum specifications apply over the entire recommended operation range, which is 4.5 V ≤ VDD1, VDD2, VDDP ≤ 5.5 V
and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications are tested with CL = 15 pF and CMOS signal levels, unless
otherwise noted.
Table 2. DC-to-DC Converter Static Specifications
Parameter
Symbol Min Typ Max Unit
Test Conditions/Comments
DC-TO-DC CONVERTER SUPPLY
Setpoint
Thermal Coefficient
Line Regulation
Load Regulation
Output Ripple
VISO
5.0
−44
20
1.3
75
200
125
600
V
IISO = 15 mA, R1 = 10 kΩ, R2 = 30.9 kΩ
VISO (TC)
VISO (LINE)
VISO (LOAD)
VISO (RIP)
VISO (NOISE)
fOSC
μV/°C
mV/V
%
IISO = 15 mA, VDDP = 4.5 V to 5.5 V
IISO = 3 mA to 27 mA
3
mV p-p 20 MHz bandwidth, CBO = 0.1 µF||10 µF, IISO = 27 mA
mV p-p CBO = 0.1 µF||10 µF, IISO = 27 mA
MHz
kHz
mA
%
Output Noise
Switching Frequency
Pulse-Width Modulation Frequency
Output Supply
Efficiency at IISO (MAX)
IDDP, No VISO Load
IDDP, Full VISO Load
Thermal Shutdown
Shutdown Temperature
Thermal Hysteresis
fPWM
IISO (MAX)
30
5.5 V > VISO > 4.5 V
IISO = 27 mA
29
6.8
30
IDDP (Q)
IDDP (MAX)
12
mA
mA
154
10
°C
°C
Table 3. Data Channel Supply Current
1 Mbps—A, B, C Grades
25 Mbps—B, C Grades
100 Mbps—C Grade
Test Conditions/
Unit Comments
Parameter
Symbol Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
SUPPLY CURRENT
ADuM6210
IDD1
IDD2
IDD1
IDD2
IDD1
IDD2
1.1
2.7
2.1
2.3
2.7
1.1
1.6
4.5
2.7
2.9
4.5
1.6
6.2
4.8
4.9
4.7
4.8
6.2
7.0
7.0
6.5
6.5
7.0
7.0
20
9.5
15
15.6
9.5
20
25
15
19
19
15
25
mA
mA
mA
mA
mA
mA
CL = 0 pF
CL = 0 pF
CL = 0 pF
CL = 0 pF
CL = 0 pF
CL = 0 pF
ADuM6211
ADuM6212
Table 4. Switching Specifications
A Grade
B Grade
C Grade
Test Conditions/
Comments
Parameter
Symbol Min
Typ Max Min Typ Max Min Typ Max Unit
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
Pulse Width
Propagation Delay Skew
Channel Matching
Codirectional
Opposing Direction
Jitter
1
50
10
25
35
3
100
24
2
Mbps Within PWD limit
13
10
tPHL, tPLH
PWD
PW
tPSK
18
ns
ns
ns
ns
50% input to 50% output
|tPLH − tPHL
Within PWD limit
|
1000
40
38
12
9
Between any two units
tPSKCD
tPSKOD
5
10
3
6
2
5
ns
ns
ns
2
2
1
Rev. 0 | Page 3 of 24
ADuM6210/ADuM6211/ADuM6212
Data Sheet
Table 5. Input and Output Characteristics
Parameter
Symbol Min
Typ
Max
Unit
Test Conditions/Comments
DC SPECIFICATIONS
Logic High Input Threshold
VIH
VIL
0.7 VISO,
0.7 VDD1
V
V
V
V
Logic Low Input Threshold
Logic High Output Voltages
0.3 VISO,
0.3 VDD1
VOH
VDD1 − 0.1,
VDD2 − 0.1
VDD1 − 0.4,
VDD2 − 0.4
V
DD1, VDD2
DD1 − 0.2,
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
V
VDD2 − 0.2
Logic Low Output Voltages
VOL
0.0
0.2
0.1
0.4
V
V
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
VDD1, VDD2 ,VDDP supply
Undervoltage Lockout
Positive Going Threshold
Negative Going Threshold
Hysteresis
VUV+
VUV−
VUVH
2.6
2.4
0.2
V
V
V
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
Input Currents per Channel
AC SPECIFICATIONS
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
II
0.54
1.6
0.09
0.04
+0.01
0.8
2.0
mA
mA
mA/Mbps
mA/Mbps
µA
−10
25
+10
0 V ≤ VIx ≤ VDDx
10% to 90%
VIx = VDD1 or VISO, VCM = 1000 V,
transient magnitude = 800 V
Output Rise/Fall Time
Common-Mode Transient
Immunity1
tR/tF
|CM|
2.5
35
ns
kV/µs
Refresh Rate
tr
1.6
µs
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VOx > 0.8 × VDD1 or 0.8 × VISO for a high input or VOx < 0.8 × VDD1 or 0.8
× VISO for a low input. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
Rev. 0 | Page 4 of 24
Data Sheet
ADuM6210/ADuM6211/ADuM6212
ELECTRICAL CHARACTERISTICS—3.3 V PRIMARY INPUT SUPPLY/3.3 V SECONDARY ISOLATED SUPPLY
All typical specifications are at TA = 25°C, VDD1 = VDD2 = VDDP = 3.3 V, VSEL resistor network: R1 = 10 kΩ, R2 = 16.9 kΩ between VISO and
GNDISO. Minimum/maximum specifications apply over the entire recommended operation range, which is 3.0 V ≤ VDD1, VDD2, VDDP
≤
3.6 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications are tested with CL = 15 pF and CMOS signal levels,
unless otherwise noted.
The digital isolator channels and the power section work independently, and under the operating voltages in this section, there may not
be sufficient current from the VISO to run both data channels at the maximum data rate. Verify that the application is within the power
capability of VISO if that supply is providing power to VDD2
.
Table 6. DC-to-DC Converter Static Specifications
Parameter
Symbol
Min Typ Max Unit
Test Conditions/Comments
DC-TO-DC CONVERTER SUPPLY
Setpoint
Thermal Coefficient
Line Regulation
Load Regulation
Output Ripple
Output Noise
Switching Frequency
Pulse-Width Modulation Frequency fPWM
VISO
3.3
−26
20
1.3
50
130
125
600
V
IISO = 10 mA, R1 = 10 kΩ, R2 = 16.9 kΩ
IISO = 20 mA
IISO = 10 mA, VDDP = 3.0 V to 3.6 V
IISO = 2 mA to 18 mA
20 MHz bandwidth, CBO = 0.1 µF||10 µF, IISO = 18 mA
CBO = 0.1 µF||10 µF, IISO = 18 mA
VISO (TC)
VISO (LINE)
VISO (LOAD)
VISO (RIP)
VISO (NOISE)
fOSC
μV/°C
mV/V
%
mV p-p
mV p-p
MHz
kHz
3
Output Supply
Efficiency at IISO (MAX)
IDDP, No VISO Load
IDDP, Full VISO Load
Thermal Shutdown
Shutdown Temperature
Thermal Hysteresis
IISO (MAX)
20
mA
%
mA
mA
3.6 V > VISO > 3 V
IISO = 18 mA
27
3.3
77
IDDP (Q)
IDDP (MAX)
10.5
154
10
°C
°C
Table 7. Data Channel Supply Current
1 Mbps—A, B, C Grades
25 Mbps—B, C Grades
100 Mbps—C Grade
Test Conditions/
Unit Comments
Parameter
Symbol Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
SUPPLY CURRENT
ADuM6210
IDD1
IDD2
IDD1
IDD2
IDD1
IDD2
0.75
2.0
1.6
1.7
2.0
1.4
3.5
2.1
2.3
3.5
1.4
5.1
2.7
3.8
3.9
2.7
5.1
9.0
4.6
5.0
6.2
4.6
9.0
17
4.8
11
11
4.8
17
23
9
15
15
9
mA
mA
mA
mA
mA
mA
CL = 0 pF
CL = 0 pF
CL = 0 pF
CL = 0 pF
CL = 0 pF
CL = 0 pF
ADuM6211
ADuM6212
0.75
23
Table 8. Switching Specifications
A Grade
B Grade
C Grade
Test Conditions/
Comments
Parameter
Symbol Min Typ Max Min Typ Max Min Typ Max Unit
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
Pulse Width
Propagation Delay Skew
Channel Matching
Codirectional
Opposing Direction
Jitter
1
50
10
25
35
3
100
33
2.5
Mbps Within PWD limit
tPHL, tPLH
PWD
PW
20
10
25
ns
ns
ns
ns
50% input to 50% output
|tPLH − tPHL
Within PWD limit
|
1000
40
tPSK
38
16
12
Between any two units
tPSKCD
tPSKOD
5
10
3
6
2.5
5
ns
ns
ns
2
2
1
Rev. 0 | Page 5 of 24
ADuM6210/ADuM6211/ADuM6212
Data Sheet
Table 9. Input and Output Characteristics
Parameter
Symbol Min
Typ
Max
Unit
Test Conditions/Comments
DC SPECIFICATIONS
Logic High Input Threshold
VIH
VIL
0.7 VISO
0.7 VDD1
,
V
V
V
V
Logic Low Input Threshold
Logic High Output Voltages
0.3 VISO
0.3 VDD1
,
VOH
VDD1 − 0.1,
VDD1, VDD2
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
V
DD2 − 0.1
VDD1 − 0.4,
DD2 − 0.4
VDD1 − 0.2,
VDD2 − 0.2
V
Logic Low Output Voltages
VOL
0.0
0.2
0.1
0.4
V
V
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
VDD1, VDD2 ,VDDP supply
Undervoltage Lockout
Positive Going Threshold
Negative Going Threshold
Hysteresis
VUV+
VUV−
VUVH
2.6
2.4
0.2
V
V
V
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current IDDO(Q)
IDDI(Q)
0.4
1.2
0.6
1.7
mA
mA
Dynamic Input Supply Current
Dynamic Output Supply Current
Input Currents per Channel
AC SPECIFICATIONS
Output Rise/Fall Time
Common-Mode Transient
Immunity1
IDDI(D)
IDDO(D)
II
0.08
0.015
+0.01
mA/Mbps
mA/Mbps
µA
−10
25
+10
0 V ≤ VIx ≤ VDDx
10% to 90%
VIx = VDD1 or VISO, VCM = 1000 V,
transient magnitude = 800 V
tR/tF
|CM|
3
35
ns
kV/µs
Refresh Rate
tr
1.6
µs
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VOx > 0.8 × VDD1 or 0.8 × VISO for a high input or VOx < 0.8 × VDD1 or 0.8
× VISO for a low input. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
Rev. 0 | Page 6 of 24
Data Sheet
ADuM6210/ADuM6211/ADuM6212
ELECTRICAL CHARACTERISTICS—5 V PRIMARY INPUT SUPPLY/3.3 V SECONDARY ISOLATED SUPPLY
All typical specifications are at TA = 25°C, VDD1 = VDDP = 5 V, VDD2 = 3.3 V, VSEL resistor network: R1 = 10 kΩ, R2 = 16.9 kΩ between VISO
and GNDISO. Minimum/maximum specifications apply over the entire recommended operation range, which is 4.5 V ≤ VDD1, VDDP
≤
5.5 V, 3.0 V ≤ VDD2 ≤ 3.6 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications are tested with CL = 15 pF and
CMOS signal levels, unless otherwise noted.
Table 10. DC-to-DC Converter Static Specifications
Parameter
Symbol
Min Typ Max Unit
Test Conditions/Comments
DC-TO-DC CONVERTER SUPPLY
Setpoint
Thermal Coefficient
Line Regulation
Load Regulation
Output Ripple
Output Noise
Switching Frequency
Pulse-Width Modulation Frequency fPWM
Output Supply
Efficiency at IISO (MAX)
IDDP, No VISO Load
IDDP, Full VISO Load
Thermal Shutdown
Shutdown Temperature
Thermal Hysteresis
VISO
3.3
−26
20
1.3
50
130
125
600
V
IISO = 15 mA, R1 = 10 kΩ, R2 = 16.9 kΩ
VISO (TC)
VISO (LINE)
VISO (LOAD)
VISO (RIP)
VISO (NOISE)
fOSC
μV/°C
mV/V
%
mV p-p
mV p-p
MHz
kHz
mA
%
mA
mA
IISO = 15 mA, VDDP = 4.5 V to 5.5 V
IISO = 3 mA to 27 mA
20 MHz bandwidth, CBO = 0.1 µF||10 µF, IISO = 27 mA
CBO = 0.1 µF||10 µF, IISO = 27 mA
3
8
IISO (MAX)
30
3.6 V > VISO > 3 V
IISO = 27 mA
24
3.2
85
IDDP (Q)
IDDP (MAX)
154
10
°C
°C
Table 11. Data Channel Supply Current
1 Mbps—A, B, C Grades
25 Mbps—B, C Grades
100 Mbps—C Grade
Test Conditions/
Unit Comments
Parameter
Symbol Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
SUPPLY CURRENT
ADuM6210
IDD1
IDD2
IDD1
IDD2
IDD1
IDD2
1.1
2.0
2.1
1.7
2.0
1.1
1.6
3.5
2.7
2.3
3.5
1.6
6.2
2.7
4.9
3.9
2.7
6.2
7.0
4.6
6.5
6.2
4.6
7.0
20
4.8
15
11
4.8
20
25
9.0
19
15
9.0
25
mA
mA
mA
mA
mA
mA
CL = 0 pF
CL = 0 pF
CL = 0 pF
CL = 0 pF
CL = 0 pF
CL = 0 pF
ADuM6211
ADuM6212
Table 12. Switching Specifications
A Grade
B Grade
C Grade
Test Conditions/
Comments
Parameter
Symbol Min
Typ Max Min Typ Max Min Typ Max Unit
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
Pulse Width
Propagation Delay Skew
Channel Matching
Codirectional
Opposing Direction
Jitter
1
50
10
25
35
3
100
26
Mbps Within PWD limit
13
20
tPHL, tPLH
PWD
PW
tPSK
ns
ns
ns
ns
50% input to 50% output
|tPLH − tPHL
Within PWD limit
2.5
|
1000
40
10
38
16
12
Between any two units
tPSKCD
tPSKOD
5
10
3
6
2
5
ns
ns
ns
2
2
1
Rev. 0 | Page 7 of 24
ADuM6210/ADuM6211/ADuM6212
Data Sheet
Table 13. Input and Output Characteristics
Parameter
Symbol
Min
Typ
Max
Unit
Test Conditions/Comments
DC SPECIFICATIONS
Logic High Input Threshold
VIH
VIL
0.7 VISO
0.7 VDD1
,
V
V
V
V
Logic Low Input Threshold
Logic High Output Voltages
0.3 VISO
0.3 VDD1
,
VOH
VDD1 − 0.1,
VDD1, VDD2
IOx = −20 µA, VIx = VIxH
VDD2 − 0.1
VDD1 − 0.4,
VDD2 − 0.4
VDD1 − 0.2,
IOx = −4 mA, VIx = VIxH
VDD2 − 0.2
Logic Low Output Voltages
VOL
0.0
0.2
0.1
0.4
V
V
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
VDD1, VDD2 ,VDDP supply
Undervoltage Lockout
Positive Going Threshold
Negative Going Threshold
Hysteresis
VUV+
VUV−
VUVH
2.6
2.4
0.2
V
V
V
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
Input Currents per Channel
AC SPECIFICATIONS
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
II
0.54
1.2
0.09
0.02
+0.01
0.75
2.0
mA
mA
mA/Mbps
mA/Mbps
µA
−10
25
+10
0 V ≤ VIx ≤ VDDx
10% to 90%
VIx = VDD1 or VISO, VCM = 1000 V,
transient magnitude = 800 V
Output Rise/Fall Time
Common-Mode Transient
Immunity1
tR/tF
|CM|
2.5
35
ns
kV/µs
Refresh Rate
tr
1.6
µs
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VOx > 0.8 × VDD1 or 0.8 × VISO for a high input or VOx < 0.8 × VDD1 or 0.8
× VISO for a low input. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
Rev. 0 | Page 8 of 24
Data Sheet
ADuM6210/ADuM6211/ADuM6212
PACKAGE CHARACTERISTICS
Table 14. Thermal and Isolation Characteristics
Parameter
Symbol Min Typ Max Unit Test Conditions/Comments
Resistance (Input to Output)1
Capacitance (Input to Output)1
Input Capacitance2
RI-O
CI-O
CI
1012
2.2
4.0
50
Ω
pF
pF
f = 1 MHz
IC Junction-to-Ambient Thermal Resistance θJA
°C/W Thermocouple located at center of package underside,
test conducted on 4-layer board with thin traces3
1 The device is considered a 2-terminal device: Pin 1 through Pin 10 are shorted together; and Pin 11 through Pin 20 are shorted together.
2 Input capacitance is from any input data pin to ground.
3 See the Thermal Analysis section for thermal model definitions.
REGULATORY APPROVALS
Table 15.
UL (Pending)1
CSA (Pending)
VDE (Pending)2
Recognized under 1577 Component
Recognition Program1
Approved under CSA Component
Acceptance Notice #5A
Certified according to DIN V VDE V 0884-10
(VDE V 0884-10):2006-122
Single Protection, 3750 V RMS
Isolation Voltage
Reinforced insulation per CSA 60950-1-03
and IEC 60950-1, 265 V rms (375 V peak)
maximum working voltage
Reinforced insulation, 849 V peak
File E214100
File 205078
File 2471900-4880-0001
1 In accordance with UL 1577, each ADuM6210/ADuM6211/ADuM6212 is proof tested by applying an insulation test voltage ≥ 3000 V rms for 1 second
(current leakage detection limit = 10 µA).
2 In accordance with DIN V VDE V 0884-10, each ADuM6210/ADuM6211/ADuM6212 is proof tested by applying an insulation test voltage ≥1590 V peak for
1 second (partial discharge detection limit = 5 pC). The * marking branded on the component designates DIN V VDE V 0884-10 approval.
INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 16. Critical Safety-Related Dimensions and Material Properties
Parameter
Symbol Value
Unit Test Conditions/Comments
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)
3750
5.3
V rms 1-minute duration
L(I01)
L(I02)
mm
Measured from input terminals to output terminals,
shortest distance through air
Minimum External Tracking (Creepage)
5.3
mm
Measured from input terminals to output terminals,
shortest distance path along body
Minimum Internal Gap (Internal Clearance)
Tracking Resistance (Comparative Tracking Index)
Isolation Group
0.017 min mm
Distance through insulation
DIN IEC 112/VDE 0303, Part 1
Material group (DIN VDE 0110, 1/89, Table 1)
CTI
>400
II
V
Rev. 0 | Page 9 of 24
ADuM6210/ADuM6211/ADuM6212
Data Sheet
DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS
These isolators are suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data is ensured by
the protective circuits. The asterisk (*) marking on packages denotes DIN V VDE V 0884-10 approval.
Table 17. VDE Characteristics
Description
Test Conditions/Comments
Symbol
Characteristic
Unit
Installation Classification per DIN VDE 0110
For Rated Mains Voltage ≤ 150 V rms
For Rated Mains Voltage ≤ 300 V rms
For Rated Mains Voltage ≤ 400 V rms
Climatic Classification
Pollution Degree per DIN VDE 0110, Table 1
Maximum Working Insulation Voltage
Input-to-Output Test Voltage, Method b1
I to IV
I to IV
I to III
40/105/21
2
VIORM
Vpd(m)
849
1592
V peak
V peak
VIORM × 1.875 = Vpd(m), 100% production test,
tini = tm = 1 sec, partial discharge < 5 pC
Input-to-Output Test Voltage, Method a
After Environmental Tests Subgroup 1
VIORM × 1.5 = Vpd(m), tini = 60 sec,
tm = 10 sec, partial discharge < 5 pC
VIORM × 1.2 = Vpd(m), tini = 60 sec,
tm = 10 sec, partial discharge < 5 pC
Vpd(m)
Vpd(m)
1273
1018
V peak
V peak
After Input and/or Safety Test Subgroup 2 and
Subgroup 3
Highest Allowable Overvoltage
Withstand Isolation Voltage
Surge Isolation Voltage
Safety Limiting Values
VIOTM
VISO
VIOSM
5300
3750
6000
V peak
V rms
V peak
1 minute withstand rating
VIOSM(TEST) = 10 kV, 1.2 µs rise time, 50 µs, 50% fall time
Maximum value allowed in the event of a failure
(see Figure 2)
Case Temperature
TS
IS1
RS
150
2.5
>109
°C
W
Ω
Safety Total Dissipated Power
Insulation Resistance at TS
VIO = 500 V
3.0
2.5
2.0
1.5
1.0
0.5
0
0
50
100
150
200
AMBIENT TEMPERATURE (°C)
Figure 2. Thermal Derating Curve, Dependence of Safety Limiting Values on Case Temperature, per DIN V VDE V 0884-10
RECOMMENDED OPERATING CONDITIONS
Table 18.
Parameter
Symbol
Min
Max
Unit
Operating Temperature1
Supply Voltages2
VDDP at VISO = 3.0 V to 3.6 V
VDDP at VISO = 4.5 V to 5.5 V
VDD1, VDD2
TA
−40
+105
°C
VDDP
3.0
4.5
2.7
5.5
5.5
5.5
V
V
V
VDD1, VDD2
1 Operation at 105°C requires reduction of the maximum load current as specified in Table 19.
2 Each voltage is relative to its respective ground.
Rev. 0 | Page 10 of 24
Data Sheet
ADuM6210/ADuM6211/ADuM6212
ABSOLUTE MAXIMUM RATINGS
Ambient temperature = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 19.
Parameter
Storage Temperature Range (TST)
Ambient Operating
Temperature Range (TA)
Supply Voltages (VDDP, VDD1, VDD2, VISO
VISO Supply Current2
Rating
−55°C to +150°C
−40°C to +105°C
1
)
−0.5 V to +7.0 V
TA = −40°C to +105°C
30 mA
Table 20. Maximum Continuous Working Voltage
Supporting 50-Year Minimum Lifetime1
Applicable
1, 3
Input Voltage (VIA, VIB, PDIS, VSEL
)
−0.5 V to VDDI + 0.5 V
−0.5 V to VDDO + 0.5 V
−10 mA to +10 mA
1, 3
Output Voltage ( VOA, VOB
)
Average Output Current Per Data
Parameter
Max Unit
Certification
Output Pin4
AC Voltage
Common-Mode Transients5
−100 kV/µs to +100 kV/µs
Bipolar Waveform
560
V peak All certifications,
50-year operation
1 All voltages are relative to their respective ground.
2 The VISO provides current for dc and dynamic loads on the VISO I/O
channels. This current must be included when determining the total
Unipolar Waveform 560
DC Voltage
V peak
V
ISO supply current. For ambient temperatures between 85°C and 105°C,
|DC Peak Voltage|
560
V peak
maximum allowed current is reduced.
3 VDDI and VDDO refer to the supply voltages on the input and output sides
of a given channel, respectively. See the PCB Layout section.
4 See Figure 2 for the maximum rated current values for various
temperatures.
1 Refers to the continuous voltage magnitude imposed across the
isolation barrier. See the Insulation Lifetime section for more
information.
5 Refers to common-mode transients across the insulation barrier.
Common-mode transients exceeding the absolute maximum ratings may
cause latch-up or permanent damage.
ESD CAUTION
Rev. 0 | Page 11 of 24
ADuM6210/ADuM6211/ADuM6212
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
V
1
2
20
19
18
17
16
15
14
13
12
V
DD1
DD2
GND
V
GND
P
ISO
3
V
IA
IB
OA
4
V
V
OB
ADuM6210
GND
GND
GND
NC
5
P
P
ISO
TOP VIEW
GND
6
(Not to Scale)
ISO
7
NC
V
8
PDIS
SEL
V
V
9
DDP
ISO
GND
P
11 GND
ISO
10
NOTES
1. PINS LABELED NC CAN BE ALLOWED
TO FLOAT, BUT IT IS BETTER TO
CONNECT THESE PINS TO GROUND.
AVOID ROUTING HIGH SPEED SIGNALS
THROUGH THESE PINS BECAUSE
NOISE COUPLING MAY RESULT.
Figure 3. ADuM6210 Pin Configuration
Table 21. ADuM6210 Pin Function Descriptions
Pin No.
Mnemonic Description
1
VDD1
Power Supply for the Side 1 Logic Circuits of the Device. It is independent of VDDP and can operate between 3.0 V
and 5.5 V.
2, 5, 6, 10
GNDP
Ground Reference for Isolator Side 1. All of these pins are internally connected, and it is recommended that all GNDP
pins be connected to a common ground.
3
4
7, 14
VIA
VIB
NC
Logic Input A.
Logic Input B.
No Connect. Pins labeled NC can be allowed to float, but it is better to connect these pins to ground. Avoid
routing high speed signals through these pins because noise coupling may result.
8
9
PDIS
VDDP
Power Disable. When this pin is tied to a logic low, the power converter is active; when tied to a logic high, the
power supply enters a low power standby mode.
Primary isoPower Supply Voltage, 3.0 V to 5.5 V.
11, 15, 16, 19 GNDISO
Ground Reference for Isolator Side 2. All of these pins are internally connected, and it is recommended that all GNDISO
pins be connected to a common ground.
12
13
VISO
VSEL
Secondary Supply Voltage Output for External Loads, 3.3 V (VSEL Low) or 5.0 V (VSEL High).
Output Voltage Select. Provide a thermally matched resistor network between VISO and GNDISO to divide the
required output voltage to match the 1.25 V reference voltage. VISO voltage can be programmed up to 20%
higher or 75% lower than VDDP but must be within the allowed output voltage range.
17
18
20
VOB
VOA
VDD2
Logic Output B.
Logic Output A.
Power Supply for the Side 2 Logic Circuits of the Device. It is independent of VISO and can operate between 3.0 V
and 5.5 V.
Rev. 0 | Page 12 of 24
Data Sheet
ADuM6210/ADuM6211/ADuM6212
V
1
2
20
19
18
17
16
15
14
13
12
V
DD1
DD2
GND
V
GND
P
ISO
3
V
OA
IA
4
V
V
IB
OB
ADuM6211
GND
GND
GND
NC
5
P
P
ISO
ISO
TOP VIEW
GND
6
(Not to Scale)
7
NC
PDIS
V
8
SEL
V
V
9
DDP
ISO
GND
P
11 GND
ISO
10
NOTES
1. PINS LABELED NC CAN BE ALLOWED
TO FLOAT, BUT IT IS BETTER TO
CONNECT THESE PINS TO GROUND.
AVOID ROUTING HIGH SPEED SIGNALS
THROUGH THESE PINS BECAUSE
NOISE COUPLING MAY RESULT.
Figure 4. ADuM6211 Pin Configuration
Table 22. ADuM6211 Pin Function Descriptions
Pin No.
Mnemonic Description
1
VDD1
Power Supply for the Side 1 Logic Circuits of the Device. It is independent of VDDP and can operate between 3.0 V
and 5.5 V.
2, 5, 6, 10
GNDP
Ground Reference for Isolator Side 1. All of these pins are internally connected, and it is recommended that all GNDP
pins be connected to a common ground.
3
4
VOA
VIB
Logic Output A.
Logic Input B.
7, 14
NC
No Connect. Pins labeled NC can be allowed to float, but it is better to connect these pins to ground. Avoid
routing high speed signals through these pins because noise coupling may result.
8
9
PDIS
VDDP
Power Disable. When this pin is tied to a logic low, the power converter is active; when tied to a logic high, the
power supply enters a low power standby mode.
Primary isoPower Supply Voltage, 3.0 V to 5.5 V.
11, 15, 16, 19 GNDISO
Ground Reference for Isolator Side 2. All of these pins are internally connected, and it is recommended that all GNDISO
pins be connected to a common ground.
12
13
VISO
VSEL
Secondary Supply Voltage Output for External Loads, 3.3 V (VSEL Low) or 5.0 V (VSEL High).
Output Voltage Select. Provide a thermally matched resistor network between VISO and GNDISO to divide the
required output voltage to match the 1.25 V reference voltage. VISO voltage can be programmed up to 20%
higher or 75% lower than VDDP but must be within the allowed output voltage range.
17
18
20
VOB
VIA
VDD2
Logic Output B.
Logic Input A.
Power Supply for the Side 2 Logic Circuits of the Device. It is independent of VISO and can operate between 3.0 V
and 5.5 V.
Rev. 0 | Page 13 of 24
ADuM6210/ADuM6211/ADuM6212
Data Sheet
V
1
2
20
19
18
17
16
15
14
13
12
V
DD1
DD2
GND
V
GND
P
ISO
3
V
OA
OB
IA
4
V
V
IB
ADuM6212
GND
GND
GND
GND
NC
5
P
P
ISO
ISO
TOP VIEW
6
(Not to Scale)
7
NC
PDIS
V
8
SEL
V
V
9
DDP
ISO
GND
P
11 GND
ISO
10
NOTES
1. PINS LABELED NC CAN BE ALLOWED
TO FLOAT, BUT IT IS BETTER TO
CONNECT THESE PINS TO GROUND.
AVOID ROUTING HIGH SPEED SIGNALS
THROUGH THESE PINS BECAUSE
NOISE COUPLING MAY RESULT.
Figure 5. ADuM6212 Pin Configuration
Table 23. ADuM6212 Pin Function Descriptions
Pin No.
Mnemonic Description
1
VDD1
Power Supply for the Side 1 Logic Circuits of the Device. It is independent of VDDP and can operate between 3.0 V
and 5.5 V.
2, 5, 6, 10
GNDP
Ground Reference for Isolator Side 1. All of these pins are internally connected, and it is recommended that all GNDP
pins be connected to a common ground.
3
4
7, 14
VOA
VOB
NC
Logic Output A.
Logic Output B.
No Connect. Pins labeled NC can be allowed to float, but it is better to connect these pins to ground. Avoid
routing high speed signals through these pins because noise coupling may result.
8
PDIS
Power Disable. When this pin is tied to a logic low, the power converter is active; when tied to a logic high, the
power supply enters a low power standby mode.
9
VDDP
Primary isoPower Supply Voltage, 3.0 V to 5.5 V.
11, 15, 16,19
GNDISO
Ground Reference for Isolator Side 2. All of these pins are internally connected, and it is recommended that all GNDISO
pins be connected to a common ground.
12
13
VISO
VSEL
Secondary Supply Voltage Output for External Loads, 3.3 V (VSEL Low) or 5.0 V (VSEL High).
Output Voltage Select. Provide a thermally matched resistor network between VISO and GNDISO to divide the
required output voltage to match the 1.25 V reference voltage. VISO voltage can be programmed up to 20%
higher or 75% lower than VDDP but must be within the allowed output voltage range.
17
18
20
VIB
VIA
VDD2
Logic Input B.
Logic Input A.
Power Supply for the Side 2 Logic Circuits of the Device. It is independent of VISO and can operate between
3.0 V and 5.5 V.
Rev. 0 | Page 14 of 24
Data Sheet
ADuM6210/ADuM6211/ADuM6212
TRUTH TABLES
Table 24. Power Section Truth Table (Positive Logic)
VDDP (V)
VSEL Input
PDIS Input
VISO Output (V)
Notes
5
5
3.3
3.3
5
5
3.3
3.3
R1 = 10 kΩ, R2 = 30.9 kΩ
R1 = 10 kΩ, R2 = 30.9 kΩ
R1 = 10 kΩ, R2 = 16.9 kΩ
R1 = 10 kΩ, R2 = 16.9 kΩ
R1 = 10 kΩ, R2 = 30.9 kΩ
R1 = 10 kΩ, R2 = 30.9 kΩ
R1 = 10 kΩ, R2 = 16.9 kΩ
R1 = 10 kΩ, R2 = 16.9 kΩ
Low
High
Low
High
Low
High
Low
5
0
3.3
0
3.3
0
5
0
Configuration not recommended
High
Table 25 Data Section Truth Table (Positive Logic)
VDDI State1
Powered
Powered
X2
VIx Input1 VDDO State1 VOx Output1
Notes
High
Low
X2
Powered
Powered
High
Low
Normal operation, data is high
Normal operation, data is low
Output is off
Unpowered Z3
Unpowered Low
Unpowered High
Powered
Powered
Low
Output default low
Indeterminate If a high level is applied to an input when no supply is present, it can parasiti-
cally power the input side, causing unpredictable operation
1 The references to I and O in this table refer to the input side and output side of a given data path and the associated power supply.
2 X = don’t care.
3 Z = high impedance state.
Rev. 0 | Page 15 of 24
ADuM6210/ADuM6211/ADuM6212
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0.35
I
DDP
POWER DISSIPATION
0.30
0.25
0.20
0.15
0.10
0.05
0
V
V
V
= V
= V
= V
= 5V/V
= 3.3V/V
= 5V
DD1
DD1
DD1
DDP
DDP
DDP
DD2
= 3.3V
DD2
= 5V/V
= 3.3V
DD2
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0
0.02
0.04
LOAD CURRENT (A)
0.06
0.08
V
INPUT VOLTAGE (V)
DD1
Figure 6. Typical Power Supply Efficiency at 5 V/5 V, 3.3 V/3.3 V, and 5 V/3.3 V
Figure 9. Typical Short-Circuit Input Current and Power Dissipation vs. VDD1
Supply Voltage
450
V
V
V
= V
= V
= V
= 5V/V
DD2
= 5V
= 3.3V
= 3.3V
DD1
DD1
DD1
DDP
DDP
DDP
= 3.3V/V
DD2
400
350
300
250
200
150
100
50
= 5V/V
DD2
90% LOAD
10% LOAD
(1ms/DIV)
0
0
10
20
(mA)
30
40
I
ISO
Figure 7. Typical Total Power Dissipation vs. IISO
Figure 10. Typical VISO Transient Load Response, 5 V Output,
10% to 90% Load Step
35
30
25
20
15
10
5
90% LOAD
10% LOAD
V
V
V
= V
= V
= V
= 5V/V
= 3.3V/V
= 5V
DD1
DD1
DD1
DDP
DDP
DDP
DD2
= 3.3V
DD2
= 5V/V
= 3.3V
DD2
0
0
25
50
75
100
(1ms/DIV)
I
(mA)
DDP
Figure 8. Typical Isolated Output Supply Current, IISO, as a Function of
External Load at 5 V/5 V, 3.3 V/3.3 V, and 5 V/3.3 V
Figure 11. Typical Transient Load Response, 3 V Output,
10% to 90% Load Step
Rev. 0 | Page 16 of 24
Data Sheet
ADuM6210/ADuM6211/ADuM6212
5.0
4.5
4.0
3.5
3.0
2.5
2.0
90% LOAD
30mA LOAD
20mA LOAD
10mA LOAD
10% LOAD
(1ms/DIV)
3.0
3.5
4.0
4.5
5.0
5.5
6.0
OUTPUT VOLTAGE (V)
Figure 12. Typical Transient Load Response, 5 V Input, 3.3 V Output,
10% to 90% Load Step
Figure 15. Relationship Between Output Voltage and Required Input Voltage,
Under Load, to Maintain >80% Duty Factor in the PWM
4.970
4.965
4.960
4.955
4.950
4.945
4.940
500
V
V
= V
= V
= 5V/V
= 5V/V
= 5V
= 3.3V
DD1
DD1
DDP
DDP
DD2
DD2
450
400
350
300
250
200
150
100
0
1
2
3
4
–40
–20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
TIME (µs)
Figure 16. Power Dissipation with a 30 mA Load vs. Temperature
Figure 13. Typical VISO = 5 V Output Voltage Ripple at 90% Load
500
3.280
V
V
V
= V
= V
= V
= 5V/V
= 3.3V/V
= 5V
DD1
DD1
DD1
DDP
DDP
DDP
DD2
= 3.3V
DD2
450
400
350
300
250
200
150
100
= 5V/V
= 3.3V
DD2
2.278
3.276
3.274
3.272
3.270
0
1
2
3
4
–40
–20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
TIME (µs)
Figure 17. Power Dissipation with a 20 mA Load vs. Temperature
Figure 14. Typical VISO = 3.3 V Output Voltage Ripple at 90% Load
Rev. 0 | Page 17 of 24
ADuM6210/ADuM6211/ADuM6212
Data Sheet
10
20
15
10
5
8
6
5V
5V
3.3V
4
2
0
3.3V
0
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90
100
DATA RATE (Mbps)
DATA RATE (Mbps)
Figure 18. Typical Supply Current per Input Channel vs. Data Rate
for 5 V and 3.3 V Operation (No Output Load)
Figure 21. Typical ADuM6210 VDD1 or ADuM5212 VDD2 Supply Current vs.
Data Rate for 5 V and 3.3 V Operation
10
20
8
15
6
10
4
5V
5V
5
2
3.3V
3.3V
0
0
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90
100
DATA RATE (Mbps)
DATA RATE (Mbps)
Figure 19. Typical Supply Current per Output Channel vs. Data Rate
for 5 V and 3.3 V Operation (No Output Load)
Figure 22. Typical ADuM6210 VDD2 or ADuM5212 VDD2 Supply Current vs.
Data Rate for 5 V and 3.3 V Operation
20
10
8
15
6
5V
10
4
5V
3.3V
5
2
0
3.3V
0
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90
100
DATA RATE (Mbps)
DATA RATE (Mbps)
Figure 20. Typical Supply Current per Output Channel vs. Data Rate
for 5 V and 3.3 V Operation (15 pF Output Load)
Figure 23. Typical ADuM6211 VDD1 or VDD2 Supply Current vs. Data Rate for
5 V and 3.3 V Operation
Rev. 0 | Page 18 of 24
Data Sheet
ADuM6210/ADuM6211/ADuM6212
APPLICATIONS INFORMATION
passive components to bypass the power effectively as well as
set the output voltage and bypass the core voltage regulator (see
Figure 24 through Figure 26).
The dc-to-dc converter section of the ADuM6210/ADuM6211/
ADuM6212 works on principles that are common to most
modern power supplies. It has a split controller architecture with
isolated pulse-width modulation (PWM) feedback. VDDP power is
supplied to an oscillating circuit that switches current into a chip-
scale air core transformer. Power transferred to the secondary
side is rectified and regulated to a value between 3.15 V and
5.25 V depending on the setpoint supplied by an external
voltage divider (see Equation 1). The secondary (VISO) side
controller regulates the output by creating a PWM control signal
that is sent to the primary (VDDP) side by a dedicated iCoupler
data channel. The PWM modulates the oscillator circuit to control
the power being sent to the secondary side. Feedback allows for
significantly higher power and efficiency.
PWR
EN
8
V
DDP
9
GND
P
+
10
10µF
0.1µF
Figure 24. VDDP Bias and Bypass Components
V
V
SEL
R2
13
12
11
30kΩ
ISO
GND
ISO
+
R1
10kΩ
0.1µF
10µF
Figure 25. VISO Bias and Bypass Components
(R1+ R2)
VISO =1.25 V
(1)
R1
The power supply section of the ADuM6210/ADuM6211/
ADuM6212 uses a 125 MHz oscillator frequency to efficiently
pass power through its chip-scale transformers. Bypass capaci-
tors are required for several operating frequencies. Noise
suppression requires a low inductance, high frequency
capacitor; ripple suppression and proper regulation require
a large value bulk capacitor. These capacitors are most
conveniently connected between Pin 9 and Pin 10 for VDDP and
between Pin 11 and Pin 12 for VISO. To suppress noise and reduce
ripple, a parallel combination of at least two capacitors is required.
The recommended capacitor values are 0.1 µF and 10 µF for
where:
R1 is a resistor between VSEL and GNDISO
R2 is a resistor between VSEL and VISO
.
.
Because the output voltage can be adjusted continuously,
there are an infinite number of operating conditions. This
data sheet addresses three discrete operating conditions in the
Specifications tables. Many other combinations of input and
output voltage are possible; Figure 15 depicts the supported
voltage combinations at room temperature. Figure 15 was
generated by fixing the VISO load and decreasing the input
voltage until the PWM was at 80% duty cycle. Each of the
curves represents the minimum input voltage that is required
for operation under this criterion. For example, if the applica-
tion requires 30 mA of output current at 5 V, the minimum
input voltage at VDDP is 4.25 V. Figure 15 also illustrates why
the VDDP = 3.3 V input and VISO = 5 V configuration is not
recommended. Even at 10 mA of output current, the PWM
cannot maintain less than 80% duty factor, leaving no margin
to support load or temperature variations.
V
DD1. The smaller capacitor must have a low ESR; for example,
use of an NPO or X5R ceramic capacitor is advised. Ceramic
capacitors are also recommended for the 10 μF bulk capacitance.
An additional 10 nF capacitor can be added in parallel if further
EMI reduction is required.
Note that the total lead length between the ends of the low ESR
capacitor and the input power supply pin must not exceed 2 mm.
V
V
DD2
DD1
GND
P
GND
ISO
V
V
/V
V
V
/V
OA IA
IA OA
Typically, the ADuM6210/ADuM6211/ADuM6212 dissipates
about 17% more power between room temperature and maxi-
mum temperature; therefore, the 20% PWM margin covers
temperature variations.
/V
/V
OB IB
IB OB
ADuM6210/
ADuM6211/
ADuM6212
GND
GND
ISO
P
PDIS
V
V
SEL
The ADuM6210/ADuM6211/ADuM6212 implement
undervoltage lockout (UVLO) with hysteresis on the primary
and secondary side I/O pins as well as the VDDP power input.
This feature ensures that the converter does not go into
oscillation due to noisy input power or slow power-on ramp rates.
V
DDP
ISO
GND
GND
ISO
P
BYPASS < 2mm
Figure 26. Recommended PCB Layout
In applications involving high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling
that does occur equally affects all pins on a given component side.
Failure to ensure this can cause voltage differentials between pins,
exceeding the absolute maximum ratings specified in Table 19,
thereby leading to latch-up and/or permanent damage.
PCB LAYOUT
The ADuM6210/ADuM6211/ADuM6212 digital isolators with
0.15 W isoPower integrated dc-to-dc converters require no exter-
nal interface circuitry for the logic interfaces. Power supply
bypassing with a low ESR capacitor is required, as close to the
chip pads as possible. The isoPower inputs require several
Rev. 0 | Page 19 of 24
ADuM6210/ADuM6211/ADuM6212
Data Sheet
THERMAL ANALYSIS
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
The ADuM6210/ADuM6211/ADuM6212 consist of four
internal die attached to a split lead frame with two die attach
paddles. For the purposes of thermal analysis, the chip is
treated as a thermal unit, with the highest junction tempera-
ture reflected in the θJA from Table 14. The value of θJA is based
on measurements taken with the parts mounted on a JEDEC
standard, 4-layer board with fine width traces and still air.
Under normal operating conditions, the ADuM6210/
ADuM6211/ADuM6212 can operate at full load across the
full temperature range without derating the output current.
Positive and negative logic transitions at the isolator input cause
narrow (~1 ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is, therefore, either set or reset by
the pulses, indicating input logic transitions. In the absence of
logic transitions at the input for more than 1.6 μs, periodic sets
of refresh pulses that are indicative of the correct input state are
sent to ensure dc correctness at the output. If the decoder receives
no internal pulses of more than approximately 6.4 μs, the input
side is assumed to be unpowered or nonfunctional, in which
case, the isolator output is forced to a default low state by the
watchdog timer circuit. This situation should occur in the
ADuM6210/ADuM6211/ADuM6212 only during power-up
and power-down operations.
PROPAGATION DELAY PARAMETERS
Propagation delay is a parameter that describes the time it takes
a logic signal to propagate through a component (see Figure 27).
The propagation delay to a logic low output may differ from the
propagation delay to a logic high.
The limitation on the ADuM6210/ADuM6211/ADuM6212
magnetic field immunity is set by the condition in which induced
voltage in the transformer receiving coil is sufficiently large to either
falsely set or reset the decoder. The following analysis defines
the conditions under which this can occur. The 3.3 V operating
condition of the ADuM6210/ADuM6211/ADuM6212 is
examined because it represents the most susceptible mode of
operation.
INPUT (V
)
50%
Ix
tPLH
tPHL
OUTPUT (V
)
50%
Ox
Figure 27. Propagation Delay Parameters
The pulses at the transformer output have an amplitude of >1.5 V.
The decoder has a sensing threshold of about 0.5 V, thus estab-
lishing a 0.5 V margin in which induced voltages can be tolerated.
The voltage induced across the receiving coil is given by
Pulse width distortion is the maximum difference between these
two propagation delay values and is an indication of how
accurately the input signal timing is preserved.
Channel-to-channel matching refers to the maximum amount
the propagation delay differs between channels within a single
ADuM6210/ADuM6211/ADuM6212 component.
2
V = (−dβ/dt)∑πrn ; n = 1, 2, … , N
where:
β is the magnetic flux density (gauss).
rn is the radius of the nth turn in the receiving coil (cm).
N is the number of turns in the receiving coil.
Propagation delay skew refers to the maximum amount the
propagation delay differs between multiple ADuM6210/
ADuM6211/ADuM6212 devices operating under the same
conditions.
Given the geometry of the receiving coil in the ADuM6210/
ADuM6211/ADuM6212 and an imposed requirement that
the induced voltage be, at most, 50% of the 0.5 V margin at the
decoder, a maximum allowable magnetic field is calculated as
shown in Figure 28.
EMI CONSIDERATIONS
The dc-to-dc converter section of the ADuM6210/ADuM6211/
ADuM6212 components must, of necessity, operate at a very high
frequency to allow efficient power transfer through the small
transformers. This creates high frequency currents that can
propagate in circuit board ground and power planes, causing
edge and dipole radiation. Grounded enclosures are recom-
mended for applications that use these devices. If grounded
enclosures are not possible, follow good RF design practices
in the layout of the PCB. See the AN-0971 Application Note for
the most current PCB layout recommendations for the
100
10
1
0.1
ADuM6210/ADuM6211/ADuM6212.
0.01
0.001
1k
10k
100k
1M
10M
100M
MAGNETIC FIELD FREQUENCY (Hz)
Figure 28. Maximum Allowable External Magnetic Flux Density
Rev. 0 | Page 20 of 24
Data Sheet
ADuM6210/ADuM6211/ADuM6212
For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event occurs during a transmitted pulse
(and is of the worst-case polarity), it reduces the received pulse
from >1.0 V to 0.75 V, which is still well above the 0.5 V sensing
threshold of the decoder.
POWER CONSUMPTION
The VDDP power supply input provides power only to the
converter. Power for the data channels is provided through
V
V
DD1 and VDD2. These power supplies can be connected to
DDP and VISO, if desired; or the supplies can receive power
from an independent source. The converter should be treated
as a standalone supply to be utilized at the discretion of the
designer.
The preceding magnetic flux density values correspond to specific
current magnitudes at given distances from the ADuM6210/
ADuM6211/ADuM6212 transformers. Figure 29 expresses
these allowable current magnitudes as a function of frequency
for selected distances. As shown in Figure 29, the ADuM6210/
ADuM6211/ADuM6212 are extremely immune and can be
affected only by extremely large currents operated at high fre-
quency very close to the component. For the 1 MHz example,
a 0.5 kA current, placed 5 mm away from the ADuM6210/
ADuM6211/ADuM6212, is required to affect component
operation.
The VDD1 or VDD2 supply current at a given channel of the
ADuM6210/ADuM6211/ADuM6212 isolator is a function of
the supply voltage, the data rate of the channel, and the output
load of the channel.
For each input channel, the supply current is given by
I
DDI = IDDI(Q)
f ≤ 0.5 fr
f > 0.5 fr
IDDI = IDDI(D) × (2f − fr) + IDDI(Q)
For each output channel, the supply current is given by
DDO = IDDO(Q) f ≤ 0.5 fr
DDO = (IDDO(D) + (0.5 × 10−3) × CL × VDDO) × (2f − fr) + IDDO(Q)
f > 0.5 fr
I
1k
I
DISTANCE = 1m
100
where:
DDI(D), IDDO(D) are the input and output dynamic supply currents
per channel (mA/Mbps).
DDI(Q), IDDO(Q) are the specified input and output quiescent
I
10
DISTANCE = 100mm
I
supply currents (mA).
1
f is the input logic signal frequency (MHz); it is half the input
data rate, expressed in units of Mbps.
fr is the input stage refresh rate (Mbps).
CL is the output load capacitance (pF).
DISTANCE = 5mm
0.1
0.01
VDDO is the output supply voltage (V).
1k
10k
100k
1M
10M
100M
To calculate the total VDD1 and VDD2 supply current, the supply
currents for each input and output channel corresponding to
MAGNETIC FIELD FREQUENCY (Hz)
Figure 29. Maximum Allowable Current for Various Current-to-ADuM621x
Spacings
V
DD1 and VDD2 are calculated and totaled. Figure 18 and
Figure 19 show per-channel supply currents as a function of
data rate for an unloaded output condition. Figure 20 shows the
per-channel supply current as a function of data rate for a 15 pF
output condition. Figure 21 through Figure 23 show the total
VDD1 and VDD2 supply current as a function of data rate for
ADuM6210/ADuM6211/ADuM6212 channel configurations.
Note that, in combinations of strong magnetic field and high
frequency, any loops formed by PCB traces can induce error
voltages that are sufficiently large to trigger the thresholds of
succeeding circuitry. Exercise care in the layout of such traces
to avoid this possibility.
Rev. 0 | Page 21 of 24
ADuM6210/ADuM6211/ADuM6212
Data Sheet
In the case of dc or unipolar ac voltage, the stress on the insulation
is significantly lower. This allows operation at higher working
voltages while still achieving a 50-year service life. The working
voltages listed in Table 20 can be applied while maintaining the
50-year minimum lifetime, provided that the voltage conforms to
either the dc or unipolar ac voltage cases. Any cross-insulation
voltage waveform that does not conform to Figure 31 or Figure 32
must be treated as a bipolar ac waveform, and its peak voltage
must be limited to the 50-year lifetime voltage value listed in
Table 20.
INSULATION LIFETIME
All insulation structures eventually break down when subjected to
voltage stress over a sufficiently long period. The rate of insulation
degradation is dependent on the characteristics of the voltage
waveform applied across the insulation. Analog Devices conducts
an extensive set of evaluations to determine the lifetime of the
insulation structure within the ADuM6210/ADuM6211/
ADuM6212.
Accelerated life testing is performed using voltage levels that are
higher than the rated continuous working voltage. Acceleration
factors for several operating conditions are determined, allowing
calculation of the time to failure at the working voltage of
interest. The values shown in Table 20 summarize the peak
voltages for 50 years of service life in several operating condi-
tions. In many cases, the working voltage approved by agency
testing is higher than the 50-year service life voltage. Operation
at working voltages that are higher than the service life voltage
listed leads to premature insulation failure.
RATED PEAK VOLTAGE
0V
Figure 30. Bipolar AC Waveform
RATED PEAK VOLTAGE
The insulation lifetime of the ADuM6210/ADuM6211/
ADuM6212 depends on the voltage waveform type imposed
across the isolation barrier. The iCoupler insulation structure
degrades at different rates, depending on whether the wave-
form is bipolar ac, unipolar ac, or dc. Figure 30, Figure 31, and
Figure 32 illustrate these different isolation voltage waveforms.
0V
Figure 31. DC Waveform
RATED PEAK VOLTAGE
0V
Bipolar ac voltage is the most stringent environment. A 50-year
operating lifetime under the bipolar ac condition determines
the Analog Devices recommended maximum working voltage.
NOTES
1. THE VOLTAGE IS SHOWN AS SINU SOIDAL FOR ILLUSTRATION
PUPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE
WAVEFORM VARYING BETWEEN 0V AND SOME LIMITING VALUE.
THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE,
BUT THE VOLTAGE CANNOT CROSS 0V.
Figure 32. Unipolar AC Waveform
Rev. 0 | Page 22 of 24
Data Sheet
ADuM6210/ADuM6211/ADuM6212
OUTLINE DIMENSIONS
7.50
7.20
6.90
11
20
5.60
5.30
5.00
8.20
7.80
7.40
1
10
0.25
0.09
1.85
1.75
1.65
2.00 MAX
8°
4°
0°
0.95
0.75
0.55
0.38
0.22
0.05 MIN
SEATING
PLANE
COPLANARITY
0.10
0.65 BSC
COMPLIANT TO JEDEC STANDARDS MO-150-AE
Figure 33. 20-Lead Shrink Small Outline Package [SSOP]
(RS-20)
Dimensions shown in millimeters
ORDERING GUIDE
Number
Number
Maximum Maximum
Maximum
of Inputs, of Inputs, Data Rate Propagation
Pulse Width
Temperature Package
Delay, 5 V (ns) Distortion (ns) Range (°C) Description
Package
Option
Model1, 2
VDDP Side
VISO Side
(Mbps)
ADuM6210ARSZ
ADuM6210ARSZ-RL7
ADuM6210BRSZ
ADuM6210BRSZ-RL7
ADuM6210CRSZ
ADuM6210CRSZ-RL7
ADuM6211ARSZ
ADuM6211ARSZ-RL7
ADuM6211BRSZ
ADuM6211BRSZ-RL7
ADuM6211CRSZ
ADuM6211CRSZ-RL7
ADuM6212ARSZ
ADuM6212ARSZ-RL7
ADuM6212BRSZ
ADuM6212BRSZ-RL7
ADuM6212CRSZ
ADuM6212CRSZ-RL7
2
2
2
2
2
2
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
2
2
2
2
2
2
1
1
75
75
40
40
15
15
75
75
40
40
15
15
75
75
40
40
15
15
40
40
3
3
2
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
−40 to +105
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
20-Lead SSOP RS-20
25
25
100
100
1
2
40
40
3
3
2
1
25
25
100
100
1
2
40
40
3
3
2
1
25
25
100
100
2
1 The addition of an RL7 suffix designates a 7” tape and reel option.
2 Z = RoHS Compliant Part.
Rev. 0 | Page 23 of 24
ADuM6210/ADuM6211/ADuM6212
NOTES
Data Sheet
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D11042-0-1/13(0)
Rev. 0 | Page 24 of 24
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