EVAL-ADE7169F16EBZ_技术文档

Single-Phase Energy Measurement IC with

8052 MCU, RTC, and LCD Driver

ADE7566/ADE7569/ADE7166/ADE7169

GENERAL FEATURES

MICROPROCESSOR FEATURES

Wide supply voltage operation: 2.4 V to 3.7 V

8052-based core

Internal bipolar switch between regulated and battery inputs

Ultralow power operation with power-saving modes (PSM)

Full operation: 4 mA to 1.6 mA (PLL clock dependent)

Battery mode: 3.2 mA to 400 μA (PLL clock dependent)

Sleep mode

Single-cycle 4 MIPS 8052 core

8052-compatible instruction set

32.768 kHz external crystal with on-chip PLL

Two external interrupt sources

External reset pin

Real-time clock (RTC) mode: 1.5 μA

Low power battery mode

RTC and LCD mode: 27 μA (LCD charge pump enabled)

Reference: 1.2 V 0.1% (10 ppm/°C drift)

64-lead RoHS package options

Wake-up from I/O, temperature change, alarm, and

universal asynchronous receiver/transmitter (UART)

LCD driver operation

Lead frame chip scale package (LFCSP)

Temperature measurement

Low profile quad flat package (LQFP)

Real-time clock

Operating temperature range: −40°C to +85°C

Counter for seconds, minutes, and hours

Automatic battery switchover for RTC backup

Operation down to 2.4 V

ENERGY MEASUREMENT FEATURES

Proprietary analog-to-digital converters (ADCs) and digital

signal processing (DSP) provide high accuracy active

(Watt), reactive (VAR), and apparent energy (VA)

measurement

Less than 0.1% error on active energy over a dynamic

range of 1000 to 1 @ 25°C

Less than 0.5% error on reactive energy over a dynamic

range of 1000 to 1 @ 25°C (ADE7569 and ADE7169 only)

Less than 0.5% error on root mean square (rms)

measurements over a dynamic range of 500 to 1 for

current (I_rms) and 100 to 1 for voltage (V_rms) @ 25°C

Supports IEC 62053-21, IEC 62053-22, IEC 62053-23,

EN 50470-3 Class A, Class B, and Class C, and ANSI C12-16

Differential input with programmable gain amplifiers (PGAs)

supports shunts, current transformers, and di/dt current

sensors (ADE7569 and ADE7169 only)

Ultralow battery supply current: 1.5 μA

Selectable output frequency: 1 Hz to 16.384 kHz

Embedded digital crystal frequency compensation for

calibration and temperature variation 2 ppm resolution

Integrated LCD driver

108-segment driver for the ADE7566/ADE7569 and

104-segment driver for the ADE7166/ADE7169

2×, 3×, or 4× multiplexing

LCD voltages generated internally or with external resistors

Internal adjustable drive voltages up to 5 V independent

of power supply level

On-chip peripherals

UART, SPI or I²C, and watchdog timer

Power supply monitoring with user-selectable levels

Memory: 16 kB flash memory, 512 bytes RAM

Development tools

Two current inputs for antitamper detection in the

ADE7166/ADE7169

Single-pin emulation

IDE-based assembly and C-source debugging

High frequency outputs proportional to I_rms, active, reactive,

or apparent power (AP)

Table 1.

Anti-

Tamper

Watt, VA,

_rms, V_rms

Part No.

I

VAR

No

Yes

No

di/dt Sensor

ADE7566 No

ADE7569 No

ADE7166 Yes

ADE7169 Yes

Yes

No

Yes

No

Yes

Rev. A

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice.

No license is granted by implication or otherwise under any patent or patent rights of Analog

Devices.Trademarks and registered trademarks are theproperty of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781.329.4700

Fax: 781.461.3113

www.analog.com

ADE7566/ADE7569/ADE7166/ADE7169

TABLE OF CONTENTS

General Features ............................................................................... 1

di/dt Current Sensor and Digital Integrator for the

ADE7569/ADE7169................................................................... 51

Energy Measurement Features........................................................ 1

Microprocessor Features.................................................................. 1

Revision History ............................................................................... 3

General Description......................................................................... 4

Functional Block Diagrams............................................................. 4

Specifications..................................................................................... 6

Energy Metering........................................................................... 6

Analog Peripherals ....................................................................... 7

Digital Interface............................................................................ 8

Timing Specifications ................................................................ 10

Absolute Maximum Ratings.......................................................... 15

Thermal Resistance .................................................................... 15

ESD Caution................................................................................ 15

Pin Configuration and Function Descriptions........................... 16

Typical Performance Characteristics ........................................... 18

Terminology .................................................................................... 22

SFR Mapping................................................................................... 23

Power Management........................................................................ 25

Power Management Register Details....................................... 25

Power Supply Architecture........................................................ 28

Battery Switchover...................................................................... 28

Power Supply Monitor Interrupt (PSM).................................. 29

Using the Power Supply Features ............................................. 31

Operating Modes............................................................................ 33

PSM0 (Normal Mode) ............................................................... 33

PSM1 (Battery Mode) ................................................................ 33

PSM2 (Sleep Mode).................................................................... 33

3.3 V Peripherals and Wake-Up Events................................... 34

Transitioning Between Operating Modes ............................... 35

Using the Power Management Features .................................. 35

Energy Measurement ..................................................................... 37

Access to Energy Measurement SFRs...................................... 37

Access to Internal Energy Measurement Registers................ 37

Energy Measurement Registers ................................................ 40

Energy Measurement Internal Registers Details.................... 41

Interrupt Status/Enable SFRs.................................................... 44

Analog Inputs.............................................................................. 46

Analog-to-Digital Conversion.................................................. 47

Fault Detection ........................................................................... 50

Power Quality Measurements................................................... 53

Phase Compensation ................................................................. 55

RMS Calculation ........................................................................ 55

Active Power Calculation.......................................................... 58

Active Energy Calculation ........................................................ 60

Reactive Power Calculation for the ADE7569/ADE7169..... 63

Reactive Energy Calculation for the ADE7569/ADE7169 ... 64

Apparent Power Calculation..................................................... 68

Apparent Energy Calculation ................................................... 69

Ampere-Hour Accumulation ................................................... 70

Energy-to-Frequency Conversion............................................ 71

Energy Register Scaling............................................................. 72

Energy Measurement Interrupts .............................................. 72

Temperature, Battery, and Supply Voltage Measurements........ 73

Temperature Measurement....................................................... 75

Battery Measurement................................................................. 75

External Voltage Measurement ................................................ 76

8052 MCU CORE Architecture.................................................... 78

MCU Registers............................................................................ 78

Basic 8052 Registers................................................................... 80

Standard 8052 SFRs.................................................................... 81

Memory Overview ..................................................................... 81

Addressing Modes...................................................................... 82

Instruction Set ............................................................................ 84

Read-Modify-Write Instructions ............................................. 86

Instructions That Affect Flags .................................................. 86

Dual Data Pointers ......................................................................... 88

Interrupt System ............................................................................. 89

Standard 8052 Interrupt Architecture..................................... 89

Interrupt Architecture ............................................................... 89

Interrupt Registers...................................................................... 89

Interrupt Priority........................................................................ 90

Interrupt Flags ............................................................................ 91

Interrupt Vectors ........................................................................ 93

Interrupt Latency........................................................................ 93

Context Saving............................................................................ 93

Watchdog Timer............................................................................. 94

LCD Driver...................................................................................... 96

Rev. A | Page 2 of 144

ADE7566/ADE7569/ADE7166/ADE7169

LCD Registers..............................................................................96

LCD Setup....................................................................................99

LCD Timing and Waveforms ....................................................99

Blink Mode................................................................................ 100

Display Element Control......................................................... 100

Voltage Generation .................................................................. 101

LCD External Circuitry........................................................... 101

LCD Function in PSM2........................................................... 101

Flash Memory............................................................................... 103

Overview ................................................................................... 103

Flash Memory Organization................................................... 104

Using the Flash Memory......................................................... 104

Protecting the Flash Memory................................................. 107

In-Circuit Programming......................................................... 108

Timers............................................................................................ 109

Timer Registers......................................................................... 109

Timer 0 and Timer 1................................................................ 111

Timer 2 ...................................................................................... 112

PLL ................................................................................................. 114

PLL Registers ............................................................................ 114

Real-Time Clock........................................................................... 116

RTC Registers ........................................................................... 116

Read and Write Operations .................................................... 119

RTC Modes ............................................................................... 119

RTC Interrupts ......................................................................... 119

RTC Calibration ....................................................................... 120

UART Serial Interface...................................................................121

UART Registers .........................................................................121

UART Operation Modes..........................................................124

UART Baud Rate Generation..................................................125

UART Additional Features ......................................................127

Serial Peripheral Interface (SPI)..................................................128

SPI Registers ..............................................................................128

SPI Pins.......................................................................................131

SPI Master Operating Modes ..................................................132

SPI Interrupt and Status Flags.................................................133

I²C Compatible Interface..............................................................134

Serial Clock Generation...........................................................134

Slave Addresses..........................................................................134

I²C Registers...............................................................................134

Read and Write Operations .....................................................135

I²C Receive and Transmit FIFOs.............................................136

I/O Ports.........................................................................................137

Parallel I/O.................................................................................137

I/O Registers ..............................................................................138

Port 0...........................................................................................141

Port 1...........................................................................................141

Port 2...........................................................................................141

Determining the Version of the ADE7566/ADE7569..............142

Outline Dimensions......................................................................143

Ordering Guide .........................................................................144

REVISION HISTORY

Revision History: ADE7566/ADE7569/ADE7166/ADE7169

12/07—Revision A: Initial Combined Version

Revision History: ADE7566/ADE7569

12/07—Rev. 0 to Rev. A

Added ADE7166/ADE7169.............................................. Universal

Changes to Table 1 ............................................................................1

Changes to Ordering Guide.........................................................144

11/07—Revision 0: Initial Version

Rev. A | Page 3 of 144

ADE7566/ADE7569/ADE7166/ADE7169

GENERAL DESCRIPTION

The ADE7566/ADE7569/ADE7166/ADE7169¹integrate Analog

Devices, Inc., energy (ADE) metering IC analog front end and

fixed function DSP solution with an enhanced 8052 MCU core,

an RTC, an LCD driver, and all the peripherals to make an

electronic energy meter with an LCD display in a single part.

such as SAG, peak, and zero crossing are included in the energy

measurement DSP to simplify energy meter design.

The microprocessor functionality includes a single-cycle 8052 core,

a real-time clock with a power supply backup pin, a UART, and an

SPI or I²C® interface. The ready-to-use information from the

ADE core reduces the program memory size requirement, making

it easy to integrate complicated design into 16 kB of flash

memory.

The ADE measurement core includes active, reactive, and apparent

energy calculations, as well as voltage and current rms measure-

ments. This information is ready to use for energy billing by using

built-in energy scalars. Many power line supervisory features

The ADE7566/ADE7569/ADE7166/ADE7169 also include a

108-/104-segment LCD driver. This driver generates voltages

capable of driving LCDs up to 5 V.

¹Patents pending.

FUNCTIONAL BLOCK DIAGRAMS

57

43 42

38 39 40 41

39 38

7

6

45 11 43 42 41 40 39 38

37 36

5

6

7

8

9 10

12 P2.0 (FP18)

13 P2.1 (FP17)

14 P2.2 (FP16)

44 P2.3 (SDEN)

19 LCDVP1

16 LCDVP2

18 LCDVA

2

SPI/I C

3 × 16-BIT

COUNTER

TIMERS

ADE7566/ADE7569

SERIAL

INTERFACE

1.20V

REF

+

52

53

I

P

PGA1

ADC

–

3V/5V LCD

CHARGE PUMP

I

N

17 LCDVB

15 LCDVC

ENERGY

MEASUREMENT

DSP

4

COM0

...

+

49

50

V

P

PGA2

–

V

N

1

COM3

108-SEGMENT

LCD DRIVER

FP0

...

35

SINGLE

CYCLE

8052

PROGRAM MEMORY

16kB FLASH

WATCHDOG

TIMER

20 FP15

14 FP16

13 FP17

12 FP18

11 FP19

10 FP20

63

54

DGND

AGND

MCU

USER RAM

256 BYTES

TEMP

SENSOR

TEMP

ADC

USER XRAM

256 BYTES

DOWNLOADER

DEBUGGER

BATTERY

ADC

V

58

BAT

9

8

FP21

FP22

FP23

FP24

FP25

FP26

VDCIN

ADC

PLL

POWER SUPPLY

CONTROL AND

MONITORING

UART

POR

7

UART

SERIAL

PORT

TIMER

6

5

RTC

OSC

LDO

59

55

47

46

48

45

64

60

61

62

56

51

44

37

36

Figure 1. ADE7566/ADE7569 Functional Block Diagram

Rev. A | Page 4 of 144

ADE7566/ADE7569/ADE7166/ADE7169

57

43 42

38 39 40 41

39 38

7

8

45 11 43 42 41 40 39 38

37 36

5

6

7

8

9 10

12 P2.0 (FP18)

13 P2.1 (FP17)

14 P2.2 (FP16)

44 P2.3 (SDEN)

19 LCDVP1

16 LCDVP2

18 LCDVA

1.20V

REF

2

SPI/I C

3 × 16-BIT

COUNTER

TIMERS

ADE7166/ADE7169

SERIAL

INTERFACE

+

I

52

53

PA

PGA1

ADC

–

3V/5V LCD

CHARGE PUMP

I

N

17 LCDVB

15 LCDVC

ENERGY

–

MEASUREMENT

DSP

PGA1

+

4

COM0

...

55

PB

1

COM3

108-SEGMENT

LCD DRIVER

+

49

50

V

P

PGA2

FP0

...

35

–

N

SINGLE

CYCLE

8052

PROGRAM MEMORY

16kB FLASH

WATCHDOG

TIMER

20 FP15

14 FP16

13 FP17

12 FP18

11 FP19

10 FP20

MCU

63

54

DGND

AGND

USER RAM

256 BYTES

TEMP

SENSOR

TEMP

ADC

USER XRAM

256 BYTES

DOWNLOADER

DEBUGGER

BATTERY

ADC

V

58

BAT

9

8

7

6

5

FP21

FP22

FP23

FP24

FP25

VDCIN

ADC

PLL

POWER SUPPLY

CONTROL AND

MONITORING

UART

POR

UART

SERIAL

PORT

TIMER

RTC

OSC

LDO

59

47

46

48

45

64

60

61

62

56

51

44

37

36

Figure 2. ADE7166/ADE7169 Functional Block Diagram

Rev. A | Page 5 of 144

ADE7566/ADE7569/ADE7166/ADE7169

SPECIFICATIONS

V_DD= 3.3 V 5%, AGND = DGND = 0 V, on-chip reference XTAL = 32.768 kHz, T_MINto T_MAX= −40°C to +85°C, unless otherwise noted.

ENERGY METERING

Table 2.

Parameter

Min

Typ

Max

Unit

Test Conditions/Comments

MEASUREMENT ACCURACY¹

Phase Error Between Channels

PF = 0.8 Capacitive

0.05

0.1

Degrees

% of reading

Phase lead 37°

Phase lag 60°

Over a dynamic range of 1000 to 1 @ 25°C

V_DD= 3.3 V + 100 mV rms/120 Hz

I_Px= V_P= 100 mV rms

V_DD= 3.3 V 117 mV dc

PF = 0.5 Inductive

Active Energy Measurement Error²

AC Power Supply Rejection²

Output Frequency Variation

DC Power Supply Rejection²

Output Frequency Variation

Active Energy Measurement Bandwidth¹

Reactive Energy Measurement Error^{2, 3}

V_rmsMeasurement Error²

V_rmsMeasurement Bandwidth¹

I_rmsMeasurement Error²

0.01

%

0.01

8

%

kHz

0.5

3.9

0.5

3.9

% of reading

kHz

% of reading

kHz

Over a dynamic range of 1000 to 1 @ 25°C

Over a dynamic range of 100 to 1 @ 25°C

Over a dynamic range of 500 to 1 @ 25°C

I_rmsMeasurement Bandwidth¹

ANALOG INPUTS

Maximum Signal Levels

400

250

mV peak

kΩ

mV

V_P− V_Ndifferential input

I_P− I_Ndifferential input

I_PA− I_Nand I_PB− I_Ndifferential inputs

ADE7566/ADE7569

ADE7166/ADE7169

Input Impedance (DC)

ADC Offset Error²

770

10

1

PGA1 = PGA2 = 1

PGA1 = 16

Gain Error²

Current Channel

Voltage Channel

Gain Error Match

−3

+ 3

%

I_PA= I_PB= 0.4 V dc or I_P= 0.4 dc

Voltage channel = 0.4 V dc

0.2

CF1 AND CF2 PULSE OUTPUT

Maximum Output Frequency

13.5

kHz

V_P− V_N= 400 mV peak; I_PA− I_N= 250 mV

PGA1 = 2 sine wave

Duty Cycle

Active High Pulse Width

FAULT DETECTION ⁴

50

90

%

ms

If CF1 or CF2 frequency, >5.55 Hz

If CF1 or CF2 frequency, <5.55 Hz

Fault Detection Threshold

Inactive Input ≠ Active Input

Input Swap Threshold

Inactive Input > Active Input

Accuracy Fault Mode Operation

I_PAActive, I_PB= AGND

IPB Active, I_PA= AGND

Fault Detection Delay

Swap Delay

6.25

%, of active

% of active

I_PAor I_PBactive

0.1

3

% of reading

Seconds

Over a dynamic range of 500 to 1

3

Seconds

¹These numbers are not production tested but are guaranteed by design and/or characterization data on production release.

²See the Terminology section for definition.

³This function is not available in the ADE7566 and the ADE7166.

⁴This function is not available in the ADE7566 and the ADE7569.

Rev. A | Page 6 of 144

ADE7566/ADE7569/ADE7166/ADE7169

ANALOG PERIPHERALS

Table 3.

Parameter

Min

Typ Max

Unit

Test Conditions/Comments

INTERNAL ADCs (BATTERY, TEMPERATURE, V_DCIN

Power Supply Operating Range

No Missing Codes¹

)

2.4

8

3.7

V

Bits

μs

Measured on V_SWOUT

Conversion Delay²

38

ADC Gain

V_DCINMeasurement

V_BATMeasurement

Temperature Measurement

ADC Offset

15.3

14.6

0.78

mV/LSB

°C/LSB

V_DCINMeasurement at 3 V

V_BATMeasurement at 3.7 V

Temperature Measurement at 25°C

V_DCINAnalog Input

206

205

129

LSB

Maximum Signal Levels

Input Impedance (DC)

Low V_DCINDetection Threshold

POWER-ON RESET (POR)

V_DDPOR

Detection Threshold

POR Active Timeout Period

V_SWOUTPOR

0

1

1.09

3.3

V

MΩ

V

1.2

1.27

2.95

2.2

2.5

V

ms

33

Detection Threshold

POR Active Timeout Period

V_INTDPOR

1.8

V

ms

20

Detection Threshold

POR Active Timeout Period

V_INTAPOR

Detection Threshold

POR Active Timeout Period

BATTERY SWITCH OVER

2.03

2.05

2.22

2.15

V

ms

16

V

ms

120

Voltage Operating Range (V_SWOUT

V_DDto V_BATSwitching

)

2.4

2.5

3.7

V

Switching Threshold (V_DD

)

2.95

V

Switching Delay

10

30

ns

ms

When V_DDto V_BATswitch activated by V_DD

When V_DDto V_BATswitch activated by V_DCIN

V_BATto V_DDSwitching

Switching Threshold (V_DD

Switching Delay

V_SWOUTTo V_BATLeakage Current

LCD, CHARGE PUMP ACTIVE

)

2.5

2.95

V

ms

nA

30

10

Based on V_DD> 2.75 V

V_BAT= 0 V, V_SWOUT= 3.43 V, T_A= 25°C

Charge Pump Capacitance Between

LCDVP1 and LCDVP2

100

nF

LCDVA, LCDVB, LCDVC Decoupling Capacitance

LCDVA

470

0

nF

V

1.75

LCDVB

0

3.5

V

1/3 bias mode

LCDVC

0

5.3

V

1/3 bias mode

V1 Segment Line Voltage

V2 Segment Line Voltage

V3 Segment Line Voltage

DC Voltage Across Segment and COM Pin

LCDVA − 0.1

LCDVB − 0.1

LCDVC − 0.1

LCDVA

LCDVB

LCDVC

50

V

mV

Current on segment line = −2 μA

LCDVC − LCDVB, LCDVC − LCDVA, or

LCDVB − LCDVA

Rev. A | Page 7 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Parameter

Min

Typ Max

Unit

Test Conditions/Comments

LCD, RESISTOR LADDER ACTIVE

Leakage Current

20

LCDVA

LCDVB

LCDVC

nA

V

1/2 and 1/3 bias modes, no load

Current on segment line = −2 μA

V1 Segment Line Voltage

V2 Segment Line Voltage

V3 Segment Line Voltage

ON-CHIP REFERENCE

Reference Error

LCDVA − 0.1

LCDVB − 0.1

LCDVC − 0.1

V

0.9

50

mV

dB

ppm/°C

T_A= 25°C

Power Supply Rejection

Temperature Coefficient¹

80

10

¹These numbers are not production tested but are guaranteed by design and/or characterization data on production release.

²Delay between ADC conversion request and interrupt set.

DIGITAL INTERFACE

Table 4.

Parameter

Min

Typ

Max Unit

Test Conditions/Comments

LOGIC INPUTS

All Inputs Except XTAL1, XTAL2, BCTRL,

INT0, INT1, RESET

Input High Voltage, V_INH

Input Low Voltage, V_INL

BCTRL, INT0, INT1, RESET

Input High Voltage, V_INH

Input Low Voltage, V_INL

Input Currents

2.0

1.3

V

0.4

V

0.4

RESET

100

nA

RESET = V_SWOUT= 3.3 V

Port 0, Port 1, Port 2

100 nA

Internal pull-up disabled, input = 0 V or V_SWOUT

Internal pull-up enabled, input = 0 V, V_SWOUT= 3.3 V

All digital inputs

−3.75

10

−8.5

μA

pF

Input Capacitance

FLASH MEMORY

Endurance¹

Data Retention²

10,000

20

Cycles

Years

T_J= 85°C

CRYSTAL OSCILLATOR

Crystal Equivalent Series Resistance

Crystal Frequency

XTAL1 Input Capacitance

XTAL2 Output Capacitance

30

32

50

kΩ

kHz

pF

32.768 33.5

12

pF

MCU CLOCK RATE (f_CORE

)

4.096

32

MHz

kHz

Crystal = 32.768 kHz and CD[2:0] = 0

Crystal = 32.768 kHz and CD[2:0] = 0b111

LOGIC OUTPUTS

Output High Voltage, V_OH

I_SOURCE

Output Low Voltage, V_OL

2.4

V

μA

V

V_DD= 3.3 V 5%

80

0.4

2

3

I_SINK

mA

START-UP TIME⁴

PSM0 Power-On Time

From Power Saving Mode 1 (PSM1)

448

130

ms

V_DDat 2.75 V to PSM0 code execution

PSM1 → PSM0

From Power Saving Mode 2 (PSM2)

PSM2 → PSM1

48

ms

Wake-up event to PSM1 code execution

V_DDat 2.75 V to PSM0 code execution

186

PSM2 → PSM0

Rev. A | Page 8 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Parameter

Min

Typ

Max Unit

Test Conditions/Comments

POWER SUPPLY INPUTS

V_DD

V_BAT

3.13

2.4

3.3

3.46

3.7

V

INTERNAL POWER SUPPLY SWITCH (V_SWOUT

V_BATto V_SWOUTOn Resistance

V_DDto V_SWOUTOn Resistance

)

22

10.2

Ω

V_BAT= 2.4 V

V_DD= 3.13 V

40

18

1

ns

μs

mA

V

_BAT←→ V_DDSwitching Open Time

BCTRL State Change and Switch Delay

V_SWOUTOutput Current Drive

POWER SUPPLY OUTPUTS

V_INTA

6

2.25

2.3

2.75

2.70

V

V_INTD

V_INTAPower Supply Rejection

V_INTDPower Supply Rejection

POWER SUPPLY CURRENTS

Current in Normal Mode (PSM0)

60

50

dB

4

5.3

mA

f_CORE= 4.096 MHz, LCD and meter active

f_CORE= 1.024 MHz, LCD and meter active

f_CORE= 32.768 kHz, LCD and meter active

f_CORE= 4.096 MHz, meter DSP active, metering ADC

powered down

2.1

1.6

3.2

4.25

3.9

3

mA

f_CORE= 4.096 MHz, metering ADC and DSP powered

down

Current in PSM1

Current in PSM2

3.2

880

38

5.05

mA

μA

f_CORE= 4.096 MHz, LCD active, V_BAT= 3.7 V

f_CORE= 1.024 MHz, LCD active

LCD active with charge pump at 3.3 V + RTC

RTC only, T_A= 25°C, V_BAT= 3.3 V

1.5

POWER SUPPLY CURRENTS

Current in Normal Mode (PSM0)

4

5.3

mA

f_CORE= 4.096 MHz, LCD and meter active

¹Endurance is qualified as per JEDEC Standard 22 Method A117 and measured at −40°C, +25°C, +85°C, and +125°C.

²Retention lifetime equivalent at junction temperature (T_J) = 85°C as per JEDEC Standard 22 Method A117. Retention lifetime derates with junction temperature.

³Test carried out with all the I/Os set to a low output level.

⁴Delay between power supply valid and execution of first instruction by 8052 core.

Rev. A | Page 9 of 144

ADE7566/ADE7569/ADE7166/ADE7169

TIMING SPECIFICATIONS

AC inputs during testing were driven at V_SWOUT− 0.5 V for Logic 1

and 0.45 V for Logic 0. Timing measurements were made at V_IH

minimum for Logic 1 and V_ILmaximum for Logic 0, as shown in

Figure 3.

float when a 100 mV change from the loaded V_OH/V_OLlevel

occurs as shown in Figure 3.

C_LOADfor all outputs = 80 pF, unless otherwise noted. V_DD= 2.7 V

to 3.6 V; all specifications T_MINto T_MAX, unless otherwise noted.

For timing purposes, a port pin is no longer floating when a

100 mV change from load voltage occurs. A port pin begins to

V

– 0.5V

SWOUT

V

– 0.1V

+ 0.1V

V

– 0.1V

LOAD

0.2V

+ 0.9V

SWOUT

TEST POINTS

0.2V – 0.1V

TIMING

REFERENCE

POINTS

V

LOAD

SWOUT

V

LOAD

0.45V

Figure 3. Timing Waveform Characteristics

Table 5. Clock Input (External Clock Driven XTAL1) Parameter

32.768 kHz External Crystal

Parameter

t_CK

t_CKL

t_CKH

t_CKR

Description

Min

Typ

30.52

6.26

9

Max

Unit

μs

ns

XTAL1 period

XTAL1 width low

XTAL1 width high

XTAL1 rise time

XTAL1 fall time

Core clock frequency¹

t_CKF

1/t_CORE

9

ns

MHz

0.032768

1.024

4.096

¹The ADE7566/ADE7569/ADE7166/ADE7169 internal PLL locks onto a multiple (512 times) of the 32.768 kHz external crystal frequency to provide a stable 4.096 MHz

internal clock for the system. The core can operate at this frequency or at a binary submultiple defined by the CD[2:0] bits, selected via the POWCON SFR (see Table 25).

Table 6. I²C-Compatible Interface Timing Parameters (400 kHz)

Parameter

Description

Typ

1.3

Unit

μs

ns

t_BUF

t_L

t_H

t_SHD

t_DSU

t_DHD

t_RSU

t_PSU

t_R

Bus-free time between stop condition and start condition

SCLK low pulse width

SCLK high pulse width

Start condition hold time

Data setup time

Data hold time

Setup time for repeated start

Stop condition setup time

Rise time of both SCLK and SDATA

Fall time of both SCLK and SDATA

Pulse width of spike suppressed

1.36

1.14

251.35

740

400

12.5

400

200

300

50

t_F

t_SUP

1

¹Input filtering on both the SCLK and SDATA inputs suppresses noise spikes less than 50 ns.

t_BUF

t_SUP

t_R

SDATA (I/O)

MSB

LSB

ACK

MSB

t_DSU

t_F

t_DHD

t_R

t_RSU

t_H

t_PSU

SCLK (I)

t_SHD

1

8

9

1

2 TO 7

t_SUP

t_L

S(R)

PS

t_F

STOP

START

REPEATED

START

CONDITION CONDITION

Figure 4. I²C-Compatible Interface Timing

Rev. A | Page 10 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 7. SPI Master Mode Timing (SPICPHA = 1) Parameters

Parameter

Description

Min

Typ

Max

Unit

ns

1

t_SL

t_SH

SCLK low pulse width

2^SPIR× t_CORE

SCLK high pulse width

Data output valid after SCLK edge

Data input setup time before SCLK edge

Data input hold time after SCLK edge

Data output fall time

Data output rise time

SCLK rise time

SCLK fall time

2^SPIR× t_CORE

1

t_DAV

t_DSU

t_DHD

t_DF

t_DR

t_SR

3 × t_CORE

0

t_CORE

1

19

t_SF

¹t_COREdepends on the clock divider or CD bits of the POWCON SFR (see Table 25); t_CORE= 2^CD/4.096 MHz.

SCLK

(SPICPOL = 0)

t_SH

t_SL

t_SR

t_SF

SCLK

(SPICPOL = 1)

t_DAV

t_DF

t_DR

MOSI

MISO

MSB

BITS [6:1]

LSB

LSB IN

MSB IN

BITS [6:1]

t_DSU

t_DHD

Figure 5. SPI Master Mode Timing (SPICPHA = 1)

Rev. A | Page 11 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 8. SPI Master Mode Timing (SPICPHA = 0) Parameters

Parameter

Description

Min

Typ

Max

Unit

ns

2^SPIR× t_CORE

(SPIR + 1) × t_CORE

1

t_SL

t_SH

SCLK low pulse width

SCLK high pulse width

2^SPIR× t_CORE

1

t_DAV

t_DOSU

t_DSU

t_DHD

t_DF

t_DR

t_SR

t_SF

Data output valid after SCLK edge

Data output setup before SCLK edge

Data input setup time before SCLK edge

Data input hold time after SCLK edge

Data output fall time

Data output rise time

SCLK rise time

SCLK fall time

3 × t_CORE

75

0

t_CORE

1

19

¹t_COREdepends on the clock divider or CD bits of the POWCON SFR (see Table 25); t_CORE= 2^CD/4.096 MHz.

SCLK

(SPICPOL = 0)

t_SH

t_SL

t_SR

t_SF

SCLK

(SPICPOL = 1)

t_DAV

t_DOSU

t_DF

t_DR

MOSI

MISO

MSB

BITS [6:1]

LSB

LSB IN

MSB IN

BITS [6:1]

t_DSUt_DHD

Figure 6. SPI Master Mode Timing (SPICPHA = 0)

Rev. A | Page 12 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 9. SPI Slave Mode Timing (SPICPHA = 1) Parameters

Parameter

Description

Min

Typ

Max

Unit

ns

μs

ns

t_SS

SS to SCLK edge

145

1

t_SL

t_SH

SCLK low pulse width

SCLK high pulse width

Data output valid after SCLK edge

Data input setup time before SCLK edge

Data input hold time after SCLK edge

Data output fall time

Data output rise time

SCLK rise time

SCLK fall time

6 × t_CORE

t_DAV

t_DSU

t_DHD

t_DF

t_DR

t_SR

25

0

2 × t_CORE¹+ 0.5 μs

19

t_SF

t_SFS

SS high after SCLK edge

0

¹t_COREdepends on the clock divider or CD bits of the POWCON SFR (see Table 25); t_CORE= 2^CD/4.096 MHz.

SS

t_SFS

t_SS

SCLK

(SPICPOL = 0)

t_SH

t_SL

t_SR

t_SF

SCLK

(SPICPOL = 1)

t_DAV

t_DF

t_DR

MSB

LSB

BITS [6:1]

MISO

MOSI

MSB IN

BITS [6:1]

LSB IN

t_DSU

t_DHD

Figure 7. SPI Slave Mode Timing (SPICPHA = 1)

Rev. A | Page 13 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 10. SPI Slave Mode Timing (SPICPHA = 0) Parameters

Parameter

Description

Min

Typ

Max

Unit

ns

μs

ns

t_SS

SS to SCLK edge

145

1

t_SL

t_SH

t_DAV

t_DSU

t_DHD

t_DF

t_DR

t_SR

t_SF

t_DOSS

t_SFS

SCLK low pulse width

6 × t_CORE

SCLK high pulse width

Data output valid after SCLK edge

Data input setup time before SCLK edge

Data input hold time after SCLK edge

Data output fall time

Data output rise time

SCLK rise time

SCLK fall time

Data output valid after SS edge

SS high after SCLK edge

25

0

2 × t_CORE¹+ 0.5 μs

19

0

¹t_COREdepends on the clock divider or CD bits of the POWCON SFR (see Table 25); t_CORE= 2^CD/4.096 MHz.

SS

t_SFS

t_SS

SCLK

(SPICPOL = 0)

t_SH

t_SL

t_SR

t_SF

SCLK

(SPICPOL = 1)

t_DAV

t_DOSS

t_DF

t_DR

MSB

BITS [6:1]

LSB

MISO

MOSI

BITS [6:1]

LSB IN

MSB IN

t_DSU

t_DHD

Figure 8. SPI Slave Mode Timing (SPICPHA = 0)

Rev. A | Page 14 of 144

ADE7566/ADE7569/ADE7166/ADE7169

ABSOLUTE MAXIMUM RATINGS

T_A= 25°C, unless otherwise noted.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Table 11.

Parameter

Rating

V_DDto DGND

V_BATto DGND

V_DCINto DGND

Input LCD Voltage to AGND, LCDVA,

LCDVB, LCDVC¹

−0.3 V to +3.7 V

−0.3 V to V_SWOUT+ 0.3 V

THERMAL RESISTANCE

Analog Input Voltage to AGND, V_P, V_N, I_PA, −2 V to +2 V

and I_N

θ_JAis specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Digital Input Voltage to DGND

Digital Output Voltage to DGND

Operating Temperature Range (Industrial)

Storage Temperature Range

64-Lead LQFP, Power Dissipation

Lead Temperature

−0.3 V to V_SWOUT+ 0.3 V

−0.3V to V_SWOUT+ 0.3 V

−40°C to +85°C

Table 12. Thermal Resistance

Package Type

64-Lead LQFP

64-Lead LFCSP

θ_JA

60

27.1

θ_JC

Unit

°C/W

−65°C to +150°C

20.5

2.3

Soldering

Time

300°C

30 sec

ESD CAUTION

¹When used with external resistor divider.

Rev. A | Page 15 of 144

ADE7566/ADE7569/ADE7166/ADE7169

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49

1

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

COM3/FP27

INT0

PIN 1

2

3

COM2/FP28

COM1

XTAL1

XTAL2

4

COM0

BCTRL/INT1/P0.0

SDEN/P2.3

P0.2/CF1/RTCCAL

P0.3/CF2

P0.4/MOSI/SDATA

P0.5/MISO

P0.6/SCLK/T0

P0.7/SS/T1

P1.0/RxD

P1.1/TxD

FP0

5

P1.2/FP25

P1.3/T2EX/FP24

P1.4/T2/FP23

P1.5/FP22

P1.6/FP21

P1.7/FP20

P0.1/FP19

P2.0/FP18

P2.1/FP17

P2.2/FP16

LCDVC

6

7

ADE7566/ADE7569/ADE7166/ADE7169

8

TOP VIEW

(Not to Scale)

9

10

11

12

13

14

15

16

FP1

LCDVP2

FP2

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

Figure 9. Pin Configuration

Table 13. Pin Function Descriptions

Pin No. Mnemonic Description

1

2

3

COM3/FP27

COM2/FP28

COM1

Common Output 3 or LCD Segment Output 27. COM3 is used for LCD backplane.

Common Output 2 or LCD Segment Output 28. COM2 is used for LCD backplane.

Common Output 1. COM1 is used for LCD backplane.

4

COM0

Common Output 0. COM0 is used for LCD backplane.

5

6

7

8

P1.2/FP25

P1.3/T2EX/FP24

P1.4/T2/FP23

P1.5/FP22

P1.6/FP21

P1.7/FP20

P0.1/FP19

P2.0/FP18

P2.1/FP17

P2.2/FP16

LCDVC

General-Purpose Digital I/O Port 1.2 or LCD Segment Output 25.

General-Purpose Digital I/O Port 1.3, Timer 2 Control Input, or LCD Segment Output 24.

General-Purpose Digital I/O Port 1.4, Timer 2 Input, or LCD Segment Output 23.

General-Purpose Digital I/O Port 1.5 or LCD Segment Output 22.

General-Purpose Digital I/O Port 1.6 or LCD Segment Output 21.

General-Purpose Digital I/O Port 1.7 or LCD Segment Output 20.

General-Purpose Digital I/O Port 0.1 or LCD Segment Output 19.

General-Purpose Digital I/O Port 2.0 or LCD Segment Output 18.

General-Purpose Digital I/O Port 2.1 or LCD Segment Output 17.

General-Purpose Digital I/O Port 2.2 or LCD Segment Output 16.

Output Port for LCD Levels. This pin should be decoupled with a 470 nF capacitor.

9

10

11

12

13

14

15

16

LCDVP2

Analog Output. A 100 nF capacitor should be connected between this pin and LCDVP1 for the internal LCD

charge pump device.

17, 18

19

LCDVB, LCDVA

LCDVP1

Output Port for LCD Levels. These pins should be decoupled with a 470 nF capacitor.

Analog Output. A 100 nF capacitor should be connected between this pin and LCDVP2 for the internal LCD

charge pump device.

35 to 20 FP0 to F15

LCD Segment Output 0 to LCD Segment Output 15.

36

37

38

39

40

41

42

P1.1/TxD

P1.0/RxD

P0.7/SS/T1

P0.6/SCLK/T0

P0.5/MISO

General-Purpose Digital I/O Port 1.1 or Transmitter Data Output (Asynchronous).

General-Purpose Digital I/O Port 1.0 or Receiver Data Input (Asynchronous).

General-Purpose Digital I/O Port 0.7, Slave Select when SPI is in Slave Mode or Timer 1 Input.

General-Purpose Digital I/O Port 0.6, Clock Output for I²C or SPI Port, or Timer 0 Input.

General-Purpose Digital I/O Port 0.5 or Data Input for SPI Port.

P0.4/MOSI/SDATA General-Purpose Digital I/O Port 0.4, Data Line I²C-Compatible, or Data Output for SPI Port.

P0.3/CF2

General-Purpose Digital I/O Port 0.3 or Calibration Frequency Logic Output 2. The CF2 logic output gives

instantaneous active, reactive, I_rms, or apparent power information.

Rev. A | Page 16 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Pin No. Mnemonic

Description

43

P0.2/CF1/RTCCAL General-Purpose Digital I/O Port 0.2, Calibration Frequency Logic Output 1, or RTC Calibration Frequency

Logic Output. The CF1 logic output gives instantaneous active, reactive, I_rms, or apparent power information.

The RTCCAL logic output gives access to the calibrated RTC output.

44

SDEN/P2.3

Serial Download Mode Enable or Digital Output Pin P2.3. This pin is used to enable serial download mode

through a resistor when pulled low on power-up or reset. On reset, this pin momentarily becomes an input

and the status of the pin is sampled. If there is no pull-down resistor in place, the pin momentarily goes high

and then user code is executed. If the pin is pulled down on reset, the embedded serial download/debug

kernel executes, and this pin remains low during the internal program execution. After reset, this pin can be

used as a digital output port pin (P2.3).

45

46

47

BCTRL/INT1/P0.0

XTAL2

Digital Input for Battery Control, External Interrupt Input 1, or General-Purpose Digital I/O Port 0.0. This logic

input connects V_DDor V_BATto V_SWOUTinternally when set to logic high or logic low, respectively. When left

open, the connection between V_DDor V_BATand V_SWOUTis selected internally.

A crystal can be connected across this pin and XTAL1 (see XTAL1 pin description) to provide a clock source

for the ADE7566/ADE7569/ADE7166/ADE7169. The XTAL2 pin can drive one CMOS load when an external

clock is supplied at XTAL1 or by the gate oscillator circuit. An internal 6 pF capacitor is connected to this pin.

An external clock can be provided at this logic input. Alternatively, a parallel resonant AT crystal can be

connected across XTAL1 and XTAL2 to provide a clock source for the ADE7566/ADE7569/ADE7166/ADE7169.

The clock frequency for specified operation is 32.768 kHz. An internal 6 pF capacitor is connected to this pin.

XTAL1

48

INT0

External Interrupt Input 0.

49, 50

V_P, V_N

Analog Inputs for Voltage Channel. These inputs are fully differential voltage inputs with a maximum

differential level of 400 mV for specified operation. This channel also has an internal PGA.

51

EA

This pin is used as an input for emulation. When held high, this input enables the device to fetch code from

internal program memory locations. The ADE7566/ADE7569/ADE7166/ADE7169 do not support external

code memory. This pin should not be left floating.

52, 53

I_Por I_PA, I_N

Analog Inputs for Current Channel. These inputs are fully differential voltage inputs with a maximum

differential level of 400 mV for specified operation. This channel also has an internal PGA.

54

55

AGND

FP26 or I_PB

This pin provides the ground reference for the analog circuitry.

LCD Segment Output 26 (FP26) for ADE7566 and ADE7569 or Analog Inputs for Second Current Channel (I_PB)

for ADE7166 and ADE7169. This input is fully differential with a maximum differential level of 400 mV

referred to I_Nfor specified operation. This channel also has an internal PGA.

56

57

RESET

Reset Input, Active Low.

REF_IN/OUT

This pin provides access to the on-chip voltage reference. The on-chip reference has a nominal value of

1.2 V 0.1% and a typical temperature coefficient of 50 ppm/°C maximum. This pin should be decoupled

with a 1 μF capacitor in parallel with a ceramic 100 nF capacitor.

58

59

60

V_BAT

V_INTA

V_DD

Power Supply Input from the Battery with a 2.4 V to 2.7 V Range. This pin is connected internally to V_DDwhen

the battery is selected as the power supply for the ADE7566/ADE7569/ADE7166/ADE7169.

This pin provides access to the on-chip 2.5 V analog LDO. No external active circuitry should be connected to

this pin. This pin should be decoupled with a 10 μF capacitor in parallel with a ceramic 100 nF capacitor.

3.3 V Power Supply Input from the Regulator. This pin is connected internally to V_DDwhen the regulator is

selected as the power supply for the ADE7566/ADE7569/ADE7166/ADE7169. This pin should be decoupled

with a 10 μF capacitor in parallel with a ceramic 100 nF capacitor.

61

62

V_SWOUT

3.3 V Power Supply Output. This pin provides the supply voltage for the LDOs and internal circuitry of the

ADE7566/ADE7569/ADE7166/ADE7169. This pin should be decoupled with a 10 μF capacitor in parallel with

a ceramic 100 nF capacitor.

This pin provides access to the on-chip 2.5 V digital LDO. No external active circuitry should be connected to

this pin. This pin should be decoupled with a 10 μF capacitor in parallel with a ceramic 100 nF capacitor.

V_INTD

63

64

DGND

V_DCIN

This pin provides the ground reference for the digital circuitry.

Analog Input for DC Voltage Monitoring. The maximum input voltage on this pin is V_SWOUTwith respect to

AGND. This pin is used to monitor the preregulated dc voltage.

Rev. A | Page 17 of 144

ADE7566/ADE7569/ADE7166/ADE7169

TYPICAL PERFORMANCE CHARACTERISTICS

2.0

1.5

GAIN = 1

INTEGRATOR OFF

INTERNAL REFERENCE

MID CLASS C

GAIN = 1

INTEGRATOR OFF

INTERNAL REFERENCE

1.5

1.0

+85°C; PF = 0.866

+25°C; PF = 0.866

–40°C; PF = 0.866

0.5

+85°C; PF = 1

+25°C; PF = 1

0

+85°C; PF = 0

+25°C; PF = 0

–40°C; PF = 0

–40°C; PF = 1

–0.5

–1.0

–1.5

–2.0

–0.5

–1.0

–1.5

–2.0

MID CLASS C

0.1

1

10

100

0.1

1

10

100

CURRENT CHANNEL (% of Full Scale)

Figure 10. Active Energy Error as a Percentage of Reading (Gain = 1) over

Temperature with Internal Reference, Integrator Off

Figure 13. Reactive Energy Error as a Percentage of Reading (Gain = 1) over

Power Factor with Internal Reference, Integrator Off

2.0

1.5

GAIN = 1

INTEGRATOR OFF

INTERNAL REFERENCE

1.0

MID CLASS C

GAIN = 1

INTEGRATOR OFF

INTERNAL REFERENCE

1.5

1.0

MID CLASS C

+25°C; PF = 1

0.5

+85°C; PF = 1

0.5

+85°C; PF = 1

–40°C; PF = 1

+25°C; PF = 1

0

+25°C; PF = 0.5

–40°C; PF = 1

–0.5

–1.0

–1.5

–2.0

+85°C; PF = 0.5

–40°C; PF = 0.5

–0.5

–1.0

–1.5

MID CLASS C

10

0.1

1

100

0.1

1

10

100

CURRENT CHANNEL (% of Full Scale)

Figure 14. Current RMS Error as a Percentage of Reading (Gain = 1) over

Temperature with Internal Reference, Integrator Off

Figure 11. Active Energy Error as a Percentage of Reading (Gain = 1) over

Power Factor with Internal Reference, Integrator Off

2.0

GAIN = 1

MID CLASS C

GAIN = 1

INTEGRATOR OFF

INTERNAL REFERENCE

INTEGRATOR OFF

1.5

1.0

INTERNAL REFERENCE

1.5

1.0

+25°C; PF = 1

+25°C; PF = 0.5

+85°C; PF = 1

+85°C; PF = 0.5

0.5

0

+85°C; PF = 0

+25°C; PF = 0

–40°C; PF = 0

–40°C; PF = 1

–40°C; PF = 0.5

–0.5

–1.0

–1.5

–2.0

–0.5

–1.0

–1.5

–2.0

MID CLASS C

0.1

1

10

100

0.1

1

10

100

CURRENT CHANNEL (% of Full Scale)

Figure 15. Current RMS Error as a Percentage of Reading (Gain = 1) over

Power Factor with Internal Reference, Integrator Off

Figure 12. Reactive Energy Error as a Percentage of Reading (Gain = 1) over

Temperature with Internal Reference, Integrator Off

Rev. A | Page 18 of 144

ADE7566/ADE7569/ADE7166/ADE7169

1.5

0.5

0.4

GAIN = 1

INTEGRATOR OFF

INTERNAL REFERENCE

GAIN = 8

INTEGRATOR OFF

INTERNAL REFERENCE

1.0

0.3

MID CLASS C

0.2

V

; 3.3V

rms

I

; 3.3V

rms

0.5

V

; 3.43V

rms

PF = 1

PF = –0.5

PF = +0.5

0.1

I

; 3.43V

rms

V

; 3.13V

rms

0

–0.5

–1.0

–1.5

0

–0.1

–0.2

–0.3

–0.4

–0.5

I

; 3.13V

rms

MID CLASS C

0.1

1

10

100

0.1

1

10

100

CURRENT CHANNEL (% of Full Scale)

Figure 19. Active Energy Error as a Percentage of Reading (Gain = 8) over

Power Factor with Internal Reference, Integrator Off

Figure 16. Voltage and Current RMS Error as a Percentage of Reading (Gain = 1)

over Power Supply with Internal Reference

1.0

GAIN = 1

GAIN = 8

INTEGRATOR OFF

0.8

INTERNAL REFERENCE

0.6

MID CLASS B

0.4

PF = 1

0.2

PF = +0.5

PF = 0.5

0

MID CLASS B

–0.2

–0.4

–0.6

–0.8

–1.0

PF = –0.5

–0.4

–0.6

–0.8

–1.0

0.1

1

10

100

40

45

50

55

60

65

70

CURRENT CHANNEL (% of Full Scale)

LINE FREQUENCY (Hz)

Figure 20. Reactive Energy Error as a Percentage of Reading (Gain = 8) over

Power Factor with Internal Reference, Integrator Off

Figure 17. Active Energy Error as a Percentage of Reading (Gain = 1) over

Frequency with Internal Reference, Integrator Off

1.5

0.5

GAIN = 1

GAIN = 8

INTEGRATOR OFF

INTERNAL REFERENCE

1.0

INTEGRATOR OFF

0.4

INTERNAL REFERENCE

0.3

MID CLASS C

VAR; 3.43V

W; 3.3V

0.2

0.1

0.5

PF = +0.5

PF = 1

VAR; 3.3V

0

VAR; 3.13V

–0.1

–0.2

–0.3

–0.4

–0.5

W; 3.43V

PF = –0.5

–0.5

W; 3.13V

MID CLASS C

–1.0

–1.5

0.1

1

10

100

0.1

1

10

100

CURRENT CHANNEL (% of Full Scale)

Figure 21. Current RMS Error as a Percentage of Reading (Gain = 8) over

Power Factor with Internal Reference, Integrator Off

Figure 18. Active and Reactive Energy Error as a Percentage of Reading (Gain = 1)

over Power Supply with Internal Reference, Integrator Off

Rev. A | Page 19 of 144

ADE7566/ADE7569/ADE7166/ADE7169

2.0

1.0

0.8

GAIN = 16

INTEGRATOR OFF

INTERNAL REFERENCE

MID CLASS C

GAIN = 16

INTEGRATOR OFF

1.5

INTERNAL REFERENCE

1.0

0.6

–40°C; PF = 0

+85°C; PF = 0

+85°C; PF = 0.866

–40°C; PF = 0.866

0.4

0.5

0.2

+25°C; PF = 1

0

+25°C; PF = 0.866

+25°C; PF = 0

–40°C; PF = 1

–0.5

–0.2

–0.4

–0.6

–0.8

–1.0

+85°C; PF = 1

–1.0

–1.5

MID CLASS C

–2.0

0.1

1

10

100

0.1

1

10

100

CURRENT CHANNEL (% of Full Scale)

Figure 22. Active Energy Error as a Percentage of Reading (Gain = 16) over

Temperature with Internal Reference, Integrator Off

Figure 25. Reactive Energy Error as a Percentage of Reading (Gain = 16) over

Power Factor with Internal Reference, Integrator Off

2.0

GAIN = 16

INTEGRATOR OFF

INTERNAL REFERENCE

GAIN = 16

INTEGRATOR OFF

INTERNAL REFERENCE

MID CLASS C

1.5

1.0

1.5

1.0

+85°C; PF = 0.5

+25°C; PF = 1

+25°C; PF = 0.5

0.5

–40°C; PF = 1

0

+85°C; PF = 1

–40°C; PF = 1

–40°C; PF = 0.5

+25°C; PF = 1

+85°C; PF = 1

–0.5

–1.0

–1.5

–2.0

–0.5

–1.0

–1.5

–2.0

MID CLASS C

10

MID CLASS C

10

0.1

1

100

0.1

1

100

CURRENT CHANNEL (% of Full Scale)

Figure 23. Active Energy Error as a Percentage of Reading (Gain = 16) over

Power Factor with Internal Reference, Integrator Off

Figure 26. Current RMS Error as a Percentage of Reading (Gain = 16) over

Temperature with Internal Reference, Integrator Off

1.0

2.0

GAIN = 16

INTEGRATOR OFF

INTERNAL REFERENCE

MID CLASS C

INTEGRATOR OFF

0.8

INTERNAL REFERENCE

1.5

1.0

0.6

+85°C; PF = 0

0.4

0.2

–40°C; PF = 1

+25°C; PF = 1

0.5

–40°C; PF = 0.5

–40°C; PF = 0

0

–0.2

–0.4

–0.6

–0.8

–1.0

+85°C; PF = 0.5

+25°C; PF = 0.5

+85°C; PF = 1

–0.5

–1.0

–1.5

–2.0

+25°C; PF = 0

MID CLASS C

10

0.1

1

10

100

0.1

1

100

CURRENT CHANNEL (% of Full Scale)

Figure 27. Current RMS Error as a Percentage of Reading (Gain = 16) over

Power Factor with Internal Reference, Integrator Off

Figure 24. Reactive Energy Error as a Percentage of Reading (Gain = 16) over

Temperature with Internal Reference, Integrator Off

Rev. A | Page 20 of 144

ADE7566/ADE7569/ADE7166/ADE7169

2.0

1.5

2.0

GAIN = 16

MID CLASS C

GAIN = 16

MID CLASS C

INTEGRATOR ON

INTERNAL REFERENCE

INTEGRATOR ON

INTERNAL REFERENCE

1.5

1.0

–40°C; PF = 1

+25°C; PF = 1

+25°C; PF = 0.5

+85°C; PF = 0.5

+85°C; PF = 1

–40°C; PF = 0.5

+85°C; PF = 0.5

+25°C; PF = 0.5

–40°C; PF = 0.5

0.5

0

+25°C; PF = 1

+85°C; PF = 1

–0.5

–1.0

–1.5

–2.0

–0.5

–1.0

–1.5

–2.0

–40°C; PF = 1

MID CLASS C

10

MID CLASS C

10

0.1

1

100

0.1

1

100

CURRENT CHANNEL (% of Full Scale)

Figure 28. Active Energy Error as a Percentage of Reading (Gain = 16) over

Power Factor with Internal Reference, Integrator On

Figure 30. Current RMS Error as a Percentage of Reading (Gain = 16) over

Power Factor with Internal Reference, Integrator On

1.0

GAIN = 16

INTEGRATOR ON

0.8

INTERNAL REFERENCE

0.6

0.4

+25°C; PF = 0

+85°C; PF = 0.866

0.2

–40°C; PF = 0

+25°C; PF = 0.866

0

–0.2

+85°C; PF = 0

–0.4

–40°C; PF = 0.866

–0.6

–0.8

–1.0

0.1

1

10

100

CURRENT CHANNEL (% of Full Scale)

Figure 29. Reactive Energy Error as a Percentage of Reading (Gain = 16) over

Power Factor with Internal Reference, Integrator On

Rev. A | Page 21 of 144

ADE7566/ADE7569/ADE7166/ADE7169

TERMINOLOGY

For the dc PSR measurement, a reading at nominal supplies

(3.3 V) is taken. A second reading is obtained with the same

input signal levels when the supplies are varied 5%. Any error

introduced is again expressed as a percentage of the reading.

Measurement Error

The error associated with the energy measurement made by the

ADE7566/ADE7569/ADE7166/ADE7169 is defined by the

following formula:

ADC Offset Error

⎛

⎜

⎝

⎞

⎟

⎠

Energy Register −True Energy

ADC offset error is the dc offset associated with the analog

inputs to the ADCs. It means that, with the analog inputs

connected to AGND, the ADCs still see a dc analog input

signal. The magnitude of the offset depends on the gain and

input range selection (see the Typical Performance

Characteristics section). However, when HPF1 is switched on,

the offset is removed from the current channel, and the power

calculation is not affected by this offset. The offsets can be

removed by performing an offset calibration (see the Analog

Inputs section).

Percentage Error =

×100%

True Energy

Phase Error Between Channels

The digital integrator and the high-pass filter (HPF) in the

current channel have a nonideal phase response. To offset this

phase response and equalize the phase response between

channels, two phase correction networks are placed in the

current channel: one for the digital integrator and the other for

the HPF. The phase correction networks correct the phase

response of the corresponding component and ensure a phase

match between current channel and voltage channel to within

0.1° over a range of 45 Hz to 65 Hz with the digital integrator

off. With the digital integrator on, the phase is corrected to

within 0.4° over a range of 45 Hz to 65 Hz.

Gain Error

Gain error is the difference between the measured ADC output

code (minus the offset) and the ideal output code (see the

Current Channel ADC section and the Voltage Channel ADC

section). It is measured for each of the gain settings on the

current channel (1, 2, 4, 8, and 16). The difference is expressed

as a percentage of the ideal code.

Power Supply Rejection (PSR)

PSR quantifies the ADE7566/ADE7569/ADE7166/ADE7169

measurement error as a percentage of reading when the power

supplies are varied. For the ac PSR measurement, a reading at

nominal supplies (3.3 V) is taken. A second reading is obtained

with the same input signal levels when an ac (100 mV rms/120 Hz)

signal is introduced onto the supplies. Any error introduced by

this ac signal is expressed as a percentage of reading (see the

Measurement Error definition).

Rev. A | Page 22 of 144

ADE7566/ADE7569/ADE7166/ADE7169

SFR MAPPING

Table 14.

Mnemonic

INTPR

Address

0xFF

0xFE

0xFD

0xFC

0xFB

0xFA

0xF9

0xF8

0xF7

0xF6

0xF5

0xF4

0xF3

0xF0

0xEF

0xED

0xEC

0xEA

0xE9

0xE8

0xE7

0xE6

0xE5

0xE4

0xE3

0xE2

0xE0

0xDF

0xDE

0xDD

0xDC

0xDB

0xDA

0xD9

0xD8

0xD7

0xD6

0xD5

0xD4

0xD3

0xD2

0xD1

Details

Mnemonic

PSW

Address

0xD0

0xCD

0xCC

0xCB

0xCA

0xC8

0xC7

0xC6

0xC5

0xC1

0xC0

0xBF

0xBE

0xBD

0xBC

0xBB

0xBA

0xB9

0xB8

0xB4

0xB3

0xB2

0xB1

0xAF

0xAE

0xAC

0xA9

0xA8

0xA7

0xA6

0xA5

0xA4

0xA3

0xA2

0xA1

0xA0

0x9F

0x9E

0x9D

0x9C

0x9B

0x9A

0x99

0x98

0x97

Details

Table 16

Table 24

Table 23

Table 22

Table 21

Table 51

Table 48

Table 17

Table 127

Table 126

Table 18

Table 19

Table 49

Table 55

Table 52

Table 88

Table 20

Table 142

Table 147

Table 141

Table 146

Table 140

Table 145

Table 30

Table 55

Table 53

Table 41

Table 40

Table 39

Table 44

Table 43

Table 42

Table 50

Table 54

Table 30

Table 56

Table 110

Table 111

Table 112

Table 113

Table 105

Table 100

Table 99

Table 25

Table 116

Table 75

Table 98

Table 97

Table 96

Table 95

Table 94

Table 93

Table 92

Table 69

Table 152

Table 151

Table 150

Table 81

Table 62

Table 87

Table 86

Table 70

Table 68

Table 66

Table 125

Table 124

Table 123

Table 122

Table 121

Table 120

Table 155

Table 149

Table 134

Table 135

Table 79

Table 139

Table 138

Table 133

Table 132

Table 85

SCRATCH4

SCRATCH3

SCRATCH2

SCRATCH1

BATVTH

STRBPER

IPSMF

TH2

TL2

RCAP2H

RCAP2L

T2CON

EADRH

EADRL

POWCON

KYREG

WDCON

PROTR

PROTB1

PROTB0

EDATA

PROTKY

FLSHKY

ECON

TEMPCAL

RTCCOMP

BATPR

PERIPH

DIFFPROG

B

VDCINADC

LCDSEGE2

IPSME

SPISTAT

SPI2CSTAT

SPIMOD2

I2CADR

SPIMOD1

I2CMOD

WAV2H

IP

PINMAP2

PINMAP1

PINMAP0

LCDCONY

CFG

WAV2M

WAV2L

LCDDAT

LCDPTR

IEIP2

WAV1H

WAV1M

WAV1L

IE

DPCON

INTVAL

HOUR

ACC

BATADC

MIRQSTH

MIRQSTM

MIRQSTL

MIRQENH

MIRQENM

MIRQENL

ADCGO

TEMPADC

IRMSH

MIN

SEC

HTHSEC

TIMECON

P2

EPCFG

SBAUDT

SBAUDF

LCDCONX

SPI2CRx

SPI2CTx

SBUF

IRMSM

IRMSL

VRMSH

VRMSM

VRMSL

SCON

LCDSEGE

Rev. A | Page 23 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Mnemonic

LCDCLK

LCDCON

MDATH

MDATM

MDATL

MADDPT

P1

Address

0x96

0x95

0x94

0x93

0x92

0x91

0x90

0x8D

0x8C

Details

Mnemonic

TL1

Address

0x8B

0x8A

0x89

0x88

0x87

0x83

0x82

0x81

0x80

Details

Table 82

Table 78

Table 30

Table 154

Table 108

Table 106

Table 109

Table 107

Table 103

Table 104

Table 57

Table 59

Table 58

Table 61

Table 153

TL0

TMOD

TCON

PCON

DPH

DPL

TH1

SP

TH0

P0

Rev. A | Page 24 of 144

ADE7566/ADE7569/ADE7166/ADE7169

POWER MANAGEMENT

The ADE7566/ADE7569/ADE7166/ADE7169 have elaborate

power management circuitry that manages the regular power

supply to battery switchover and power supply failures. The

power management functionalities can be accessed directly

through the 8052 SFRs (see Table 15).

Table 15. Power Management SFRs

SFR Address

R/W

Mnemonic

Description

0xEC

IPSME

Power Management Interrupt Enable. See Table 20.

Battery Switchover Configuration. See Table 18.

Power Management Interrupt Flag. See Table 17.

Interrupt Pins Configuration. See Table 16.

Peripheral Configuration SFR. See Table 19.

Power Control. See Table 25.

0xF5

BATPR

0xF8

IPSMF

0xFF

INTPR

0xF4

PERIPH

0xC5

POWCON

SCRATCH1

SCRATCH2

SCRATCH3

SCRATCH4

0xFB

Scratch Pad 1. See Table 21.

0xFC

Scratch Pad 2. See Table 22.

0xFD

0xFE

Scratch Pad 3. See Table 23.

Scratch Pad 4. See Table 24.

POWER MANAGEMENT REGISTER DETAILS

Table 16. Interrupt Pins Configuration SFR (INTPR, 0xFF)

Bit

Mnemonic

Default Description

7

RTCCAL

0

Controls RTC calibration output. When set, the RTC calibration frequency selected by FSEL[1:0] is

output on the P0.2/CF1/RTCCAL pin.

6 to 5

FSEL[1:0]

00

Sets RTC calibration output frequency and calibration window.

FSEL[1:0]

Result (Calibration window, frequency)

30.5 sec, 1 Hz

30.5 sec, 512 Hz

0.244 sec, 500 Hz

0.244 sec, 16.384 kHz

00

01

10

11

4

Reserved

3 to 1

INT1PRG[2:0] 000

Controls the function of INT1.

INT1PRG[2:0] Result

X00

X01

01X

11X

GPIO enabled

BCTRL enabled

INT1 input disabled

INT1 input enabled

0

INT0PRG

0

Controls the function of INT0.

INT0PRG

Result

0

1

INT0 input disabled

INT0 input enabled

Writing to the Interrupt Pins Configuration SFR (INTPR, 0xFF)

To protect the RTC from runaway code, a key must be written to the Key SFR (KYREG, 0xC1) to obtain write access to INTPR. KYREG

(see Table 116) should be set to 0xEA to unlock this SFR and reset to zero after a timekeeping register is written to. The RTC registers can

be written using the following 8052 assembly code:

MOV

KYREG, #0EAh

INTPR, #080h

Rev. A | Page 25 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 17. Power Management Interrupt Flag SFR (IPSMF, 0xF8)

Bit

Address Mnemonic Default Description

7

0xFF

FPSR

0

Power Supply Restored Interrupt Flag. Set when the V_DDpower supply has been restored.

This occurs when the source of V_SWOUTchanges from V_BATto V_DD

.

6

5

4

3

0xFE

0xFD

0xFC

0xFB

FPSM

0

PSM Interrupt Flag. Set when an enabled PSM interrupt condition occurs.

Voltage SAG Interrupt Flag. Set when an ADE energy measurement SAG condition occurs.

This bit must be kept cleared for proper operation.

FSAG

RESERVED

FVADC

V_DCINMonitor Interrupt Flag. Set when V_DCINchanges by VDCIN_DIFF or when V_DCIN

measurement is ready.

2

1

0

0xFA

0xF9

0xF8

FBAT

0

V_BATMonitor Interrupt Flag. Set when V_BATfalls below BATVTH or when V_BATmeasurement is ready.

Battery Switchover Interrupt Flag. Set when V_SWOUTswitches from V_DDto V_BAT.

V_DCINMonitor Interrupt Flag. Set when V_DCINfalls below 1.2 V.

FBSO

FVDCIN

Table 18. Battery Switchover Configuration SFR (BATPR, 0xF5)

Bit

Mnemonic

Default

Description

7 to 2

1 to 0

Reserved

00

These bits must be kept to 0 for proper operation.

Control Bits for Battery Switchover.

BATPRG[1:0]

00

BATPRG[1:0]

Result

00

01

1X

Battery switchover enabled on low V_DD

Battery switchover enabled on low V_DDand low V_DCIN

Battery switchover disabled

Table 19. Peripheral Configuration SFR (PERIPH, 0xF4)

Bit

Mnemonic

Default

Description

7

RXFLAG

0

1

0

If set, indicates that an Rx edge event triggered wake-up from PSM2.

Indicates the power supply that is internally connected to V_SWOUT(0 V_SWOUT= V_BAT, 1 V_SWOUT= V_DD).

If set, indicates that V_DDpower supply is ready for operation.

6

VSWSOURCE

VDD_OK

5

4

PLL_FLT

If set, indicates that a PLL fault occurred where the PLL lost lock. Set the PLLACK bit (see Table 50) in

the Start ADC Measurement SFR (ADCGO, 0xD8) to acknowledge the fault and clear the PLL_FLT bit.

3

2

REF_BAT_EN

Reserved

0

Set this bit to enable internal voltage reference in PSM2 mode. This bit should be set if LCD is on in

PSM2 mode.

0

This bit should be kept to zero.

1 to 0 RXPROG[1:0]

00

Controls the function of the P1.0/RxD pin.

RXPROG[1:0]

Result

00

01

11

GPIO

RxD with wake-up disabled

RxD with wake-up enabled

Table 20. Power Management Interrupt Enable SFR (IPSME, 0xEC)

Bit

Interrupt Enable Bit

Default

Description

7

EPSR

0

Enables a PSM interrupt when the power supply restored flag (FPSR) is set.

Reserved.

6

RESERVED

ESAG

5

Enables a PSM interrupt when the voltage SAG flag (FSAG) is set.

This bit must be kept cleared for proper operation.

Enables a PSM interrupt when the V_ADCmonitor flag (FVADC) is set.

Enables a PSM interrupt when the V_BATmonitor flag (FBAT) is set.

Enables a PSM interrupt when the battery switchover flag (FBSO) is set.

Enables a PSM interrupt when the V_DCINmonitor flag (FVDCIN) is set.

4

RESERVED

EVADC

3

2

EBAT

1

EBSO

0

EVDCIN

Table 21. Scratch Pad 1 SFR (SCRATCH1, 0xFB)

Bit

Mnemonic Default Description

7 to 0

SCRATCH1

0

Value can be written/read in this register. This value is maintained in all the power saving modes.

Rev. A | Page 26 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 22. Scratch Pad 2 SFR (SCRATCH2, 0xFC)

Bit

Mnemonic Default Description

7 to 0

SCRATCH2 Value can be written/read in this register. This value is maintained in all the power saving modes.

0

Table 23. Scratch Pad 3 SFR (SCRATCH3, 0xFD)

Bit

Mnemonic Default Description

7 to 0

SCRATCH3 Value can be written/read in this register. This value is maintained in all the power saving modes.

0

Table 24. Scratch Pad 4 SFR (SCRATCH4, 0xFE)

Bit

Mnemonic Default Description

7 to 0

SCRATCH4 Value can be written/read in this register. This value is maintained in all the power saving modes.

0

Clearing the Scratch Pad Registers (SCRATCH1, 0xFB to SCRATCH4, 0xFE)

Note that these scratch pad registers are only cleared when the part loses V_DDand V_BAT. They are not cleared by software, watchdog, or

PLL reset and, therefore, need to be set correctly in these situations.

Table 25. Power Control SFR (POWCON, 0xC5)

Bit

Mnemonic

RESERVED

METER_OFF

Default

Description

7

1

0

Reserved.

6

Set this bit to turn off the modulators and energy metering DSP circuitry to reduce power if

metering functions are not needed in PSM0.

5

RESERVED

COREOFF

RESERVED

CD[2:0]

0

This bit should be kept at 0 for proper operation.

Set this bit to shut down the core and enter PSM2 if in the PSM1 operating mode.

Reserved.

4

0

3

0

2 to 0

010

Controls the core clock frequency, f_CORE. f_CORE= 4.096 MHz/2^CD

.

CD[2:0]

000

Result (f_COREin MHz)

4.096

2.048

1.024

0.512

0.256

0.128

0.064

0.032

001

010

011

100

101

110

111

Writing to the Power Control SFR (POWCON, 0xC5)

Writing data to the POWCON SFR involves writing 0xA7 into the Key SFR (KYREG, 0xC1), which is described in Table 116, followed by

a write to the POWCON SFR. For example:

MOV KYREG,#0A7h

MOV POWCON,#10h

;Write KYREG to 0xA7 to get write access to the POWCON SFR

;Shutdown the core

Rev. A | Page 27 of 144

ADE7566/ADE7569/ADE7166/ADE7169

The battery switchover functionality provided by the

POWER SUPPLY ARCHITECTURE

ADE7566/ADE7569/ADE7166/ADE7169 allows a seamless

transition from V_DDto V_BAT. An automatic battery switchover

option ensures a stable power supply to the ADE7566/

ADE7569/ADE7166/ADE7169, as long as the external battery

voltage is above 2.75 V. It allows continuous code execution

even while the internal power supply is switching from V_DDto

V_BATand back. Note that the energy metering ADCs are not

Each ADE7566/ADE7569/ADE7166/ADE7169 has two power

supply inputs, V_DDand V_BAT, and require only a single 3.3 V

power supply at V_DDfor full operation. A battery backup, or

secondary power supply, with a maximum of 3.7 V can be

connected to the V_BATinput. Internally, the ADE7566/ADE7569/

ADE7166/ADE7169 connect V_DDor V_BATto V_SWOUT, which is used

to derive power for the ADE7566/ADE7569/ ADE7166/ADE7169

circuitry. The V_SWOUToutput pin reflects the voltage at the

internal power supply (V_SWOUT) and has a maximum output

current of 6 mA. This pin can also be used to power a limited

available when V_BATis being used for V_SWOUT

.

Power supply monitor (PSM) interrupts can be enabled to

indicate when battery switchover occurs and when the V_DD

power supply is restored (see the Power Supply Monitor

Interrupt (PSM) section.)

number of peripheral components. The 2.5 V analog supply (V_INTA

and the 2.5 V supply for the core logic (V_INTD) are derived by on-

chip linear regulators from V_SWOUT. Figure 31 shows the power

supply architecture of ADE7566/ADE7569/ADE7166/ADE7169.

)

V_DDto V_BAT

The following three events switch the internal power supply

The ADE7566/ADE7569/ADE7166/ADE7169 provide

(V_SWOUT) from V_DDto V_BAT

:

automatic battery switchover between V_DDand V_BATbased on

the voltage level detected at V_DDor V_DCIN. Additionally, the

BCTRL input can be used to trigger a battery switchover. The

conditions for switching V_SWOUTfrom V_DDto V_BATand back to

V_DDare described in the Battery Switchover section. V_DCINis an

input pin that can be connected to a 0 V to 3.3 V dc signal. This

input is intended for power supply supervisory purposes and

does not provide power to the ADE7566/ADE7569/ADE7166/

ADE7169 circuitry (see the Battery Switchover section).

•

V_DCIN< 1.2 V. When V_DCINfalls below 1.2 V, V_SWOUTswitches

from V_DDto V_BAT. This event is enabled when the

BATPRG[1:0] bits in the Battery Switchover Configuration

SFR (BATPR, 0xF5) = 0b01. Setting these bits disables

switchover based on V_DCIN. Battery switchover on low V_DCINis

disabled by default.

V_DD< 2.75 V. When V_DDfalls below 2.75 V, V_SWOUTswitches

from V_DDto V_BAT. This event is enabled when BATPRG[1:0] in

the BATPR SRF are cleared.

Falling edge on BCTRL. When the battery control pin,

BCTRL, goes low, V_SWOUTswitches from V_DDto V_BAT. This

external switchover signal can trigger a switchover to V_BAT

at any time. Setting bits INT1PRG[4:2] to 0bx01 in the

Interrupt Pins Configuration SFR (INTPR, 0xFF) enables

the battery control pin (see Table 16).

•

V

DCIN

DD

BAT

SWOUT

MCU

ADE

ADC

V

INTD

LDO

POWER SUPPLY

MANAGEMENT

V

BCTRL

SW

V

INTA

ADC

LCD

2

SPI/I C

Switching from V_BATto V_DD

SCRATCHPAD

RTC

To switch V_SWOUTfrom V_BATto V_DD, all of the following events

that are enabled to force battery switchover must be false:

UART

2.5V

TEMPERATURE ADC

3.3V

•

V_DCIN< 1.2 V and V_DD< 2.75 V enabled. If the low V_DCIN

condition is enabled, V_SWOUTswitches to V_DDafter V_DCIN

remains above 1.2 V and V_DDremains above 2.75 V.

V_DD< 2.75 V enabled. V_SWOUTswitches back to V_DDafter

V_DDremains above 2.75 V.

Figure 31. Power Supply Architecture

BATTERY SWITCHOVER

The ADE7566/ADE7569/ADE7166/ADE7169 monitor V_DD, V_BAT

,

•

and V_DCIN. Automatic battery switchover from V_DDto V_BATcan be

configured based on the status of V_DD, V_DCIN, or the BCTRL pin.

Battery switchover is enabled by default. Setting Bit 1 in the

Battery Switchover Configuration SFR (BATPR, 0xF5) disables

battery switchover so that V_DDis always connected to V_SWOUT

(see Table 18). The source of V_SWOUTis indicated by Bit 6 in the

Peripheral Configuration SFR (PERIPH, 0xF4), which is

described in Table 19. Bit 6 is set when V_SWOUTis connected to

BCTRL enabled. V_SWOUTswitches back to V_DDafter BCTRL

is high, and the first or second bullet point is satisfied.

V_DDand cleared when V_SWOUTis connected to V_BAT

.

Rev. A | Page 28 of 144

ADE7566/ADE7569/ADE7166/ADE7169

The Power Management Interrupt Enable SFR (IPSME, 0xEC)

controls the events that result in a PSM interrupt (see Table 20).

Figure 32 is a diagram illustrating how the PSM interrupt vector

is shared among the PSM interrupt sources. The PSM interrupt

flags are latched and must be cleared by writing to the IPSMF flag

register (see Table 17).

POWER SUPPLY MONITOR INTERRUPT (PSM)

The power supply monitor interrupt (PSM) alerts the 8052 core

of power supply events. The PSM interrupt is disabled by default.

Setting the EPSM bit in the Interrupt Enable and Priority 2 SFR

(IEIP2, 0xA9) enables the PSM interrupt (see Table 70).

EPSR

FPSR

ESAG

FSAG

EVADC

FVADC

FPSM

EPSM

PENDING PSM

INTERRUPT

TRUE?

EBAT

FBAT

EBSO

FBSO

EVDCIN

FVDCIN

IPSME ADDR. 0xEC

IPSMF ADDR. 0xF8

IEIP2 ADDR. 0xA9

EPSR

FPSR

RESERVED

FPSM

ESAG

RESERVED

PSI

EVADC

FVADC

EADE

EBAT

FBAT

ETI

EBSO

FBSO

EPSM

EVDCIN

FVDCIN

ESI

FSAG

RESERVED

PTI

RESERVED

NOT INVOLVED IN PSM INTERRUPT SIGNAL CHAIN

Figure 32. PSM Interrupt Sources

Rev. A | Page 29 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Battery Switchover and Power Supply Restored

PSM Interrupt

V_BATMonitor PSM Interrupt

The V_BATvoltage is measured using a dedicated ADC. These

measurements take place in the background at intervals to

check the change in V_BAT. The FBAT bit is set when the battery

level is lower than the threshold set in the Battery Detection

Threshold SFR (BATVTH, 0xFA), described in Table 51, or

when a new measurement is ready in the Battery ADC Value

SFR (BATADC, 0xDF), described in Table 53. See the Battery

Measurement section for more information. Setting the EBAT

bit in the Power Management Interrupt Enable SFR (IPSME,

0xEC) enables this event to generate a PSM interrupt.

The ADE7566/ADE7569/ADE7166/ADE7169 can be

configured to generate a PSM interrupt when the source of

V

_SWOUTchanges from V_DDto V_BAT, indicating battery switchover.

Setting the EBSO bit in the Power Management Interrupt

Enable SFR (IPSME, 0xEC) enables this event to generate a

PSM interrupt (see Table 20).

The ADE7566/ADE7569/ADE7166/ADE7169 can also be

configured to generate an interrupt when the source of V_SWOUT

changes from V_BATto V_DD, indicating that the V_DDpower supply

has been restored. Setting the EPSR bit in the Power Management

Interrupt Enable SFR (IPSME, 0xEC) enables this event to generate

a PSM interrupt.

V_DCINMonitor PSM Interrupt

The V_DCINvoltage is monitored by a comparator. The FVDCIN

bit in the Power Management Interrupt Flag SFR (IPSMF, 0xF8)

Power Management Interrupt Flag SFR (IPSMF, 0xF8) is set

when the V_DCINinput level is lower than 1.2 V. Setting the

EVDCIN bit in the IPSME SFR enables this event to generate a

PSM interrupt. This event, which is associated with the SAG

monitoring, can be used to detect a power supply (V_DD) being

compromised and to trigger further actions prior to deciding a

The flags in the IPSME SFR for these interrupts, FBSO and

FPSR, are set regardless of whether the respective enable bits

have been set. The battery switchover and power supply restore

event flags, FBSO and FPSR, are latched. These events must be

cleared by writing a 0 to these bits. Bit 6 in the Peripheral

Configuration SFR (PERIPH, 0xF4), VSWSOURCE, tracks the

source of V_SWOUT. The bit is set when V_SWOUTis connected to V_DD

switch of V_DDto V_BAT

.

and cleared when V_SWOUTis connected to V_BAT

.

SAG Monitor PSM Interrupt

V_DCINADC PSM Interrupt

The ADE7566/ADE7569/ADE7166/ADE7169 energy

The ADE7566/ADE7569/ADE7166/ADE7169 can be

measurement DSP monitors the ac voltage input at the V_Pand

V_Ninput pins. The SAGLVL register is used to set the threshold

for a line voltage SAG event. The FSAG bit in the Power

Management Interrupt Flag SFR (IPSMF, 0xF8) is set if the line

voltage stays below the level set in the SAGLVL register for the

number of line cycles set in the SAGCYC register. See the Line

Voltage SAG Detection section for more information. Setting

the ESAG bit in the Power Management Interrupt Enable SFR

(IPSME, 0xEC) enables this event to generate a PSM interrupt.

configured to generate a PSM interrupt when V_DCINchanges

magnitude by more than a configurable threshold. This threshold

is set in the Temperature and Supply Delta SFR (DIFFPROG,

0xF3), which is described in Table 49. See the External Voltage

Measurement section for more information. Setting the

EVDCIN bit in the Power Management Interrupt Enable SFR

(IPSME, 0xEC) enables this event to generate a PSM interrupt.

The V_DCINvoltage is measured using a dedicated ADC. These

measurements take place in the background at intervals to check

the change in V_DCIN. Conversions can also be initiated by writing to

the Start ADC Measurement SFR (ADCGO, 0xD8) described in

Table 50. The FVDCIN flag indicates when a V_DCINmeasurement

is ready. See the External Voltage Measurement section for

details on how V_DCINis measured.

Rev. A | Page 30 of 144

ADE7566/ADE7569/ADE7166/ADE7169

When a SAG event occurs, user code can be configured to

backup data and prepare for battery switchover if desired. The

relative spacing of these interrupts depends on the design of the

power supply.

USING THE POWER SUPPLY FEATURES

In an energy meter application, the 3.3 V power supply (V_DD) is

typically generated from the ac line voltage and regulated to

3.3 V by a voltage regulator IC. The preregulated dc voltage,

typically 5 V to 12 V, can be connected to V_DCINthrough a

resistor divider. A 3.6 V battery can be connected to V_BAT

Figure 33 shows how the ADE7566/ADE7569/ADE7166/

Figure 35 shows the sequence of events that occurs if the main

power supply starts to fail in the power meter application shown

in Figure 33, with battery switchover on low V_DCINor low V_DD

enabled.

.

ADE7169 power supply inputs are set up in this application.

Finally, the transition between V_DDand V_BATand the different

power supply modes (see the Operating Modes section) are

represented in Figure 36 and Figure 37.

Figure 34 shows the sequence of events that occurs if the main

power supply generated by the PSU starts to fail in the power

meter application shown in Figure 33. The SAG detection can

provide the earliest warning of a potential problem on V_DD.

45

49

BCTRL

(240V, 220V, 110V TYPICAL)

AC INPUT

V

P

SAG

DETECTION

V

N

50

5V TO 12V DC

V

DCIN

VOLTAGE

SUPERVISORY

64

VOLTAGE

SUPERVISORY

POWER SUPPLY

MANAGEMENT

IPSMF SFR

(ADDR. 0xF8)

V

DD

3.3V

PSU

60

REGULATOR

V

SW

61

58

V

SWOUT

V

BAT

Figure 33. Power Supply Management for Energy Meter Application

V

– V

N

P

SAG LEVEL TRIP POINT

SAGCYC = 1

V

DCIN

1.2V

t₁

V

DD

2.75V

t₂

SAG EVENT

(FSAG = 1)

V

EVENT

IF SWITCHOVER ON LOW V IS ENABLED,

DD

AUTOMATIC BATTERY SWITCHOVER

DCIN

(FVDCIN = 1)

V

CONNECTED TO V

SWOUT

BAT

BSO EVENT

(FBSO = 1)

Figure 34. Power Supply Management Interrupts and Battery Switchover with Only V_DDEnabled for Battery Switchover

Rev. A | Page 31 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 26. Power Supply Event Timing Operating Modes

Parameter Time

Description

t₁

t₂

t₃

10 ns min Time between when V_DCINgoes below 1.2 V and when VSWF is raised.

10 ns min Time between when V_DDfalls below 2.75 V and when battery switchover occurs.

30 ms

Time between when V_DCINfalls below 1.2 V and when battery switchover occurs if V_DCINis enabled to cause battery

switchover.

t₄

130 ms

Time between when power supply restore conditions are met (V_DCINabove 1.2 V and V_DDabove 2.75 V if

BATPR[1:0] = 0b01 or V_DDabove 2.75 V if BATPR[1:0] = 0b00) and when V_SWOUTswitches to V_DD

.

V

– V

N

P

SAG LEVEL TRIP POINT

SAGCYC = 1

V

DCIN

1.2V

t₃

t₁

V

DD

2.75V

SAG EVENT

(FSAG = 1)

V

EVENT

IF SWITCHOVER ON LOW V

DCIN

IS

DCIN

(FVDCIN = 1)

ENABLED, AUTOMATIC BATTERY

SWITCHOVER V CONNECTED TO V

SWOUT BAT

BSO EVENT

(FBSO = 1)

Figure 35. Power Supply Management Interrupts and Battery Switchover with V_DDor V_DCINEnabled for Battery Switchover

V

− V

N

P

SAG LEVEL

TRIP POINT

V

EVENT

SAG EVENT

DCIN

V

EVENT

DCIN

V

DCIN

1.2V

130ms MIN.

30ms MIN.

V

BAT

V

DD

2.75V

V

SW

PSM0

BATTERY SWITCH

ENABLED ON

PSM1 OR PSM2

LOW V

DCIN

V

SW

PSM0

BATTERY SWITCH

ENABLED ON

LOW V

DD

PSM1 OR PSM2

Figure 36. Power Supply Management Transitions Between Modes

Rev. A | Page 32 of 144

ADE7566/ADE7569/ADE7166/ADE7169

OPERATING MODES

•

The RAM in the MCU is no longer valid.

PSM0 (NORMAL MODE)

The program counter for the 8052, also held in volatile

memory, becomes invalid when the 2.5 V supply is shut

down. Therefore, the program does not resume from

where it left off but always starts from the power-on reset

vector when the ADE7566/ADE7569/ADE7166/ADE7169

exit PSM2.

In PSM0, normal operating mode, V_SWOUTis connected to V_DD.

All of the analog circuitry and digital circuitry powered by

V_INTDand V_INTAare enabled by default. In normal mode, the

default clock frequency, f_CORE, established during a power-on

reset or software reset, is 1.024 MHz.

PSM1 (BATTERY MODE)

The 3.3 V peripherals (temperature ADC, VDCIN ADC, RTC,

and LCD) are active in PSM2. They can be enabled or disabled

to reduce power consumption and are configured for PSM2

operation when the MCU core is active (see Table 28 for more

information about the individual peripherals and their PSM2

configuration). The ADE7566/ADE7569/ADE7166/ADE7169

remain in PSM2 until an event occurs to wake them up.

In PSM1, battery mode, V_SWOUTis connected to V_BAT. In this

operating mode, the 8052 core and all of the digital circuitry are

enabled by default. The analog circuitry for the ADE energy

metering DSP powered by V_INTAis disabled. This analog circuitry

automatically restarts, and the switch to the V_DDpower supply

occurs when the V_DDsupply is above 2.75 V and when the

PWRDN bit in the MODE1 register (0x0B) is cleared (see

Table 32). The default f_COREfor PSM1, established during a

power-on reset or software reset, is 1.024 MHz.

In PSM2, the ADE7566/ADE7569/ADE7166/ADE7169 provide

four scratch pad RAM SFRs that are maintained during this

mode. These SFRs can be used to save data from PSM0 or

PSM1 when entering PSM2 (see Table 21 to Table 24).

PSM2 (SLEEP MODE)

PSM2 is a low power consumption sleep mode for use in battery

operation. In this mode, V_SWOUTis connected to V_BAT. All of the

2.5 V digital and analog circuitry powered through V_INTAand V_INTD

are disabled, including the MCU core, resulting in the following:

In PSM2, the ADE7566/ADE7569/ADE7166/ADE7169

maintain some SFRs (see Table 27). The SFRs that are not listed

in this table should be restored when the part enters PSM0 or

PSM1 from PSM2.

Table 27. SFR Maintained in PSM2

I/O Configuration

Power Supply Monitoring

RTC Peripherals

LCD Peripherals

Interrupt Pins Configuration SFR

(INTPR, 0xFF), see Table 16

Battery Detection Threshold SFR

(BATVTH, 0xFA), see Table 51

RTC Nominal Compensation SFR

(RTCCOMP, 0xF6), seeTable 126

LCD Segment Enable 2 SFR

(LCDSEGE2, 0xED), see Table 88

Peripheral Configuration SFR (PERIPH, Battery Switchover Configura-tion

RTC Temperature Compensation

SFR (TEMPCAL, 0xF7), see Table 127 (LCDCONY, 0xB1),see Table 81

LCD Configuration Y SFR

0xF4), see Table 19

SFR (BATPR, 0xF5), see Table 18

Port 0 Weak Pull-Up Enable SFR

(PINMAP0, 0xB2), seeTable 150

Battery ADC Value SFR

(BATADC, 0xDF), see Table 53

RTC Configuration SFR (TIMECON,

0xA1), seeTable 120

LCD Configuration X SFR

(LCDCONX, 0x9C), see Table 79

Port 1 Weak Pull-Up Enable SFR

(PINMAP1, 0xB3), seeTable 151

Peripheral ADC Strobe Period SFR

(STRBPER, 0xF9), see Table 48

Hundredths of a Second Counter

SFR (HTHSEC, 0xA2), seeTable 121 (LCDCON, 0x95), see Table 78

LCD Configuration SFR

Port 2 Weak Pull-Up Enable SFR

(PINMAP2, 0xB4), seeTable 152

Temperature and Supply Delta SFR Seconds Counter SFR (SEC, 0xA3),

LCD Clock SFR (LCDCLK, 0x96),

see Table 82

(DIFFPROG, 0xF3), see Table 49

seeTable 122

Scratch Pad 1 SFR (SCRATCH1, 0xFB),

see Table 21

VDCIN ADC Value SFR

(VDCINADC, 0xEF), see Table 52

Minutes Counter SFR (MIN, 0xA4),

seeTable 123

LCD Segment Enable SFR

(LCDSEGE, 0x97) see Table 85

Scratch Pad 2 SFR (SCRATCH2, 0xFC),

see Table 22

Temperature ADC Value SFR

(TEMPADC, 0xD7), see Table 54

Hours Counter SFR (HOUR, 0xA5),

seeTable 124

LCD Pointer SFR (LCDPTR, 0xAC),

see Table 86

Scratch Pad 3 SFR (SCRATCH3, 0xFD),

see Table 23

Alarm Interval SFR (INTVAL, 0xA6),

seeTable 125

LCD Data SFR (LCDDAT, 0xAE),

see Table 87

Scratch Pad 4 SFR (SCRATCH4, 0xFE),

see Table 24

Rev. A | Page 33 of 144

ADE7566/ADE7569/ADE7166/ADE7169

3.3 V PERIPHERALS AND WAKE-UP EVENTS

Some of the 3.3 V peripherals are capable of waking the

ADE7566/ADE7569/ADE7166/ADE7169 from PSM2. The

events that can cause the ADE7566/ADE7569/ADE7166/

ADE7169 to wake up from PSM2 are listed in the wake-up

events column in Table 28. The interrupt flag associated with

these events must be cleared prior to executing instructions that

put the ADE7566/ADE7569/ ADE7166/ADE7169 in PSM2

mode after wake-up.

Table 28. 3.3 V Peripherals and Wake-Up Events

3.3 V

Peripheral

Wake- Wake-Up

Up Event Enable Bits

Interrupt

Vector

Flag

Comments

Temperature

ADC

∆T

Maskable

ITADC

The temperature ADC can wake up the ADE7566/ADE7569/

ADE7166/ADE7169 if the ITADC flag is set. A pending interrupt is

generated according to the description in the Temperature

Measurement section. This wake-up event can be disabled by

disabling temperature measurements in the Temperature and

Supply Delta SFR (DIFFPROG, 0xF3) in PSM2. The temperature

interrupt needs to be serviced and acknowledged prior to

entering PSM2 mode.

V_DCINADC

Maskable

FVDCIN

IPSM

The V_DCINmeasurement can wake up the ADE7566/ADE7569/

ADE7166/ADE7169. The FVDCIN is set according to the description

in the External Voltage Measurement section. This wake-up event

can be disabled by clearing the EVDCIN in the Power Management

Interrupt Enable SFR (IPSME, 0xEC); see Table 20. The FVDCIN flag

needs to be cleared prior to entering PSM2 mode.

ΔV

Power Supply

Management

PSR

Nonmaskable PSR

The ADE7566/ADE7569/ADE7166/ADE7169 wake up if the power

supply is restored (if V_SWOUTswitches to be connected to V_DD). The

VSWSOURCE flag, Bit 6 of the Peripheral Configuration SFR

(PERIPH, 0xF4), is set to indicate that V_SWOUTis connected to V_DD

.

RTC

Midnight Nonmaskable Midnight IRTC

The ADE7566/ADE7569/ADE7166/ADE7169 wake up at midnight

every day to update their calendars. The RTC interrupt needs to be

serviced and acknowledged prior to entering PSM2 mode.

Alarm

Maskable

Alarm

IRTC

An alarm can be set to wake the ADE7566/ADE7569/ADE7166/

ADE7169 after the desired amount of time. The RTC alarm is

enabled by setting the ALARM bit in the RTC Configuration SFR

(TIMECON, 0xA1). The RTC interrupt needs to be serviced and

acknowledged prior to entering PSM2 mode.

I/O Ports

All I/O pins are treated as inputs. The weak pull-up on each I/O pin can be disabled individually in the Port 0 Weak Pull-Up

Enable SFR (PINMAP0, 0xB2), Port 1 Weak Pull-Up Enable SFR (PINMAP1, 0xB3), and Port 2 Weak Pull-Up Enable SFR

(PINMAP2, 0xB4) to decrease current consumption. The interrupts can be enabled/disabled.

INT0

INT0PRG = 1

IE0

The edge of the interrupt is selected by Bit IT0 in the TCON register.

The IE0 flag bit in the TCON register is not affected. The Interrupt 0

interrupt needs to be serviced and acknowledged prior to entering

PSM2 mode.

INT1

INT1PRG[2:0]

= 11x

IE1

The edge of the interrupt is selected by Bit IT1 in the TCON register.

The IE1 flag bit in the TCON register is not affected. The Interrupt 1

interrupt needs to be serviced and acknowledged prior to

entering PSM2 mode.

Rx Edge

RXPROG[1:0]

= 11

PERIPH.7

(RXFG)

An Rx edge event occurs if a rising or falling edge is detected on

the Rx line. The UART RxD flag needs to be cleared prior to

entering PSM2 mode.

External Reset RESET

LCD

Nonmaskable

If the RESET pin is brought low while the ADE7566/ADE7569/

ADE7166/ADE7169 is in PSM2, it wakes up to PSM1.

The LCD can be enabled/disabled in PSM2. The LCD data memory

remains intact.

Scratch Pad

The four SCRATCHx registers remain intact in PSM2.

Rev. A | Page 34 of 144

ADE7566/ADE7569/ADE7166/ADE7169

automatically restart. PSM0 code execution begins at the power-

on reset vector.

TRANSITIONING BETWEEN OPERATING MODES

The operating mode of the ADE7566/ADE7569/ADE7166/

ADE7169 is determined by the power supply connected to

V_SWOUT. Therefore, changes in the power supply, such as when

V_SWOUTswitches from V_DDto V_BATor when V_SWOUTswitches to

V_DD, alter the operating mode. This section describes events

that change the operating mode.

Automatic Switch to V_DD(PSM1 to PSM0)

If the conditions to switch V_SWOUTfrom V_BATto V_DDoccur (see

the Battery Switchover section), the operating mode switches to

PSM0. When this switch occurs, the analog circuitry used in the

ADE energy measurement DSP automatically restarts. Note that

code execution continues normally. A software reset can be

performed to start PSM0 code execution at the power-on reset

vector.

Automatic Battery Switchover (PSM0 to PSM1)

If any of the enabled battery switchover events occur (see the

Battery Switchover section), V_SWOUTswitches to V_BAT. This

switchover results in a transition from the PSM0 to PSM1

operating mode. When battery switchover occurs, the analog

circuitry used in the ADE energy measurement DSP is disabled.

To reduce power consumption, the user code can initiate a

transition to PSM2.

USING THE POWER MANAGEMENT FEATURES

Because program flow is different for each operating mode, the

status of V_SWOUTmust be known at all times. The VSWSOURCE

bit in the Peripheral Configuration SFR (PERIPH, 0xF4)

indicates what V_SWOUTis connected to (see Table 19). This bit can

be used to control program flow on wake-up. Because code

execution always starts at the power-on reset vector, Bit 6 of the

PERIPH SRF can be tested to determine which power supply is

being used and to branch to normal code execution or to wake

up event code execution. Power supply events can also occur

when the MCU core is active. To be aware of the events that

change what V_SWOUTis connected to, use the following guidelines:

Entering Sleep Mode (PSM1 to PSM2)

To reduce power consumption when V_SWOUTis connected to

V_BAT, user code can initiate sleep mode, PSM2, by setting Bit 4

in the Power Control SFR (POWCON, 0xC5) to shut down the

MCU core. Events capable of waking the MCU can be enabled

(see the 3.3 V Peripherals and Wake-Up Events section).

Servicing Wake-Up Events (PSM2 to PSM1)

•

Enable the battery switchover interrupt (EBSO)

if V_SWOUT= V_DDat power-up.

The ADE7566/ADE7569/ADE7166/ADE7169 may need to

wake up from PSM2 to service wake-up events (see the 3.3 V

Peripherals and Wake-Up Events section). PSM1 code

execution begins at the power-on reset vector. After servicing

the wake-up event, the ADE7566/ADE7569/ADE7166/

ADE7169 can return to PSM2 by setting Bit 4 in the Power

Control SFR (POWCON, 0xC5) to shut down the MCU core.

•

Enable the power supply restored interrupt (EPSR)

if V_SWOUT= V_BATat power-up.

An early warning that battery switchover is about to occur is

provided by SAG detection and possibly low V_DCINdetection

(see the Battery Switchover section).

Automatic Switch to V_DD(PSM2 to PSM0)

For a user-controlled battery switchover, enable automatic

battery switchover on low V_DDonly. Then, enable the low V_DCIN

event to generate the PSM interrupt. When a low V_DCINevent

occurs, start data backup. Upon completion of the data backup,

enable battery switchover on low V_DCIN. Battery switchover

occurs 30 ms later.

If the conditions to switch V_SWOUTfrom V_BATto V_DDoccur (see

the Battery Switchover section), the operating mode switches to

PSM0. When this switch occurs, the MCU core and the analog

circuitry used in the ADE energy measurement DSP

Rev. A | Page 35 of 144

ADE7566/ADE7569/ADE7166/ADE7169

POWER SUPPLY

RESTORED

AUTOMATIC BATTERY

SWITCHOVER

PSM1

PSM0

BATTERY MODE

CONNECTED TO V

NORMAL MODE

CONNECTED TO V

V

SWOUT

BAT

SWOUT

DD

POWER SUPPLY

RESTORED

WAKE-UP

EVENT

USER CODE DIRECTS MCU

TO SHUTDOWN CORE AFTER

SERVICING WAKE-UP EVENT

PSM2

SLEEP MODE

CONNECTED TO V

V

SWOUT

BAT

Figure 37. Transitioning Between Operating Modes

Rev. A | Page 36 of 144

ADE7566/ADE7569/ADE7166/ADE7169

ENERGY MEASUREMENT

The ADE7566/ADE7569/ADE7166/ADE7169 offer a fixed

function, energy measurement, digital processing core that

provides all the information needed to measure energy in

single-phase energy meters. The part provides two ways to

access the energy measurements: direct access through SFRs for

time sensitive information and indirect access through address

and data SFR registers for the majority of energy measurements.

The I_rms, V_rms, interrupts, and waveform registers are readily

available through SFRs as shown in Table 30. Other energy

measurement information is mapped to a page of memory that

is accessed indirectly through the MADDPT, MDATL,

MDATM, and MDATH SFRs. The address and data registers act

as pointers to the energy measurement internal registers.

MADDPT SFR. If the internal register is 1 byte long, only the

MDATL SFR content is copied to the internal register, while the

MDATM SFR and MDATH SFR contents are ignored.

The energy measurement core functions with an internal clock

of 4.096 MHz ∕ 5 or 819.2 kHz. Because the 8052 core functions

with another clock, 4.096MHz ∕ 2^CD, synchronization between

the two clock environments when CD = 0 or 1 is an issue. When

data is written to the internal energy measurement registers, a

small wait period needs to be implemented before another read

or write to these registers can take place.

Sample code to write 0x0155 to the 2-byte SAGLVL register

located at 0x14 in the energy measurement memory space is

shown below.

ACCESS TO ENERGY MEASUREMENT SFRs

MOV

DJNZ

MDATM,#01h

Access to the energy measurement SFRs is achieved by reading

or writing to the SFR addresses detailed in Table 30. The

internal data for the MIRQx SFRs are latched byte by byte into

the SFR when the SFR is read.

MDATL,#55h

MADDPT,#SAGLVL_W (Address 0x94)

A,#05h

ACC,$

The WAV1x, WAV2x, VRMSx, and IRMSx registers are all 3-byte

SFRs. The 24-bit data is latched into these SFRs when the high

byte is read. Reading the low or medium byte before the high

byte results in reading the data from the previous latched sample.

;Next write or read to energy

measurement SFR can be done after

this.

Reading the Internal Energy Measurement Registers

Sample code to read the V_rmsregister is as follows:

When Bit 7 of Energy Measurement Pointer Address SFR

(MADDPT, 0x91) is cleared, the content of the internal energy

measurement register designated by the address in MADDPT

is transferred to the MDATx SFRs. If the internal register is

1 byte long, only the MDATL SFR content is updated with a

new value, while the MDATM SFR and MDATH SFR contents

are reset to 0x00.

MOV

R1, VRMSH

//latches data in VRMSH,

VRMSM and VRMSL SFR

MOV

R2, VRMSM

R3, VRMSL

ACCESS TO INTERNAL ENERGY MEASUREMENT

REGISTERS

The energy measurement core functions with an internal clock

of 4.096 MHz ∕ 5 or 819.2 kHz. Because the 8052 core functions

with another clock, 4.096MHz ∕ 2^CD, synchronization between

the two clock environments when CD = 0 or 1 is an issue. When

data is read from the internal energy measurement registers, a

small wait period needs to be implemented before the MDATx

SFRs are transferred to another SFR.

Access to the internal energy measurement registers is achieved

by writing to the Energy Measurement Pointer Address SFR

(MADDPT, 0x91). This SFR selects the energy measurement

register to be accessed and determines if a read or a write is

performed (see Table 29).

Table 29. Energy Measurement Pointer Address SFR

(MADDPT, 0x91)

Sample code to read the peak voltage in the 2-byte VPKLVL

register located at 0x16 into the data pointer is shown below.

Bit

Description

7

1 = write, 0 = read

MOV

MADDPT,#VPKLVL_R (Address 0x16)

A,#05h

6 to 0

Energy measurement internal register address

Writing to the Internal Energy Measurement Registers

DJNZ ACC,$

When Bit 7 of the the Energy Measurement Pointer Address

SFR (MADDPT, 0x91) is set, the content of the MDATx SFRs

(MDATL, MDATM, and MDATH) is transferred to the internal

energy measurement register designated by the address in the

MOV

DPH,MDATM

DPL,MDATL

Rev. A | Page 37 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 30. Energy Measurement SFRs

Address

0x91

0x92

0x93

0x94

0xD1

0xD2

0xD3

0xD4

0xD5

0xD6

0xD9

0xDA

0xDB

0xDC

0xDD

0xDE

0xE2

0xE3

0xE4

0xE5

0xE6

0xE7

R/W

R

Name

Description

MADDPT

MDATL

Energy Measurement Pointer Address.

Energy Measurement Pointer Data Lowest Significant Byte.

Energy Measurement Pointer Data Middle Byte.

Energy Measurement Pointer Data Most Significant Byte.

V_rmsMeasurement Lowest Significant Byte.

V_rmsMeasurement Middle Byte.

MDATM

MDATH

VRMSL

R

VRMSM

VRMSH

IRMSL

R

V_rmsMeasurement Most Significant Byte.

R

I_rmsMeasurement Lowest Significant Byte.

I_rmsMeasurement Middle Byte.

R

IRMSM

R

IRMSH

I_rmsMeasurement Most Significant Byte.

R/W

R

MIRQENL

MIRQENM

MIRQENH

MIRQSTL

MIRQSTM

MIRQSTH

WAV1L

Energy Measurement Interrupt Enable Lowest Significant Byte.

Energy Measurement Interrupt Enable Middle Byte.

Energy Measurement Interrupt Enable Most Significant Byte.

Energy Measurement Interrupt Status Lowest Significant Byte.

Energy Measurement Interrupt Status Middle Byte.

Energy Measurement Interrupt Status Most Significant Byte.

Selection 1 Sample Lowest Significant Byte.

Selection 1 Sample Middle Byte.

R

WAV1M

WAV1H

WAV2L

R

Selection 1 Sample Most Significant Byte.

Selection 2 Sample Lowest Significant Byte.

Selection 2 Sample Middle Byte.

R

WAV2M

WAV2H

R

Selection 2 Sample Most Significant Byte.

×1, ×2, ×4,

×8, ×16

INTEGRATOR

dt

WGAIN[11:0]

MULTIPLIER

{GAIN[2:0]}

I

AP

N

PGA1

I

ADC

LPF2

HPF

CF1NUM[15:0]

WATTOS[15:0]

π

VARGAIN[11:0]

PHCAL[7:0]

2

CF1

DFC

Ф

LPF2

CF1DEN[15:0]

CF2NUM[15:0]

VAROS[15:0]

VAGAIN[11:0]

IRMSOS[11:0]

2

×

CF2

DFC

LPF

VRMSOS[11:0]

VARDIV[7:0]

V

CF2DEN[15:0]

P

PGA2

ADC

VADIV[7:0]

%

WDIV[7:0]

LPF

HPF

N

METERING SFRs

Figure 38. ADE7566 and ADE7569 Energy Metering Block Diagram

Rev. A | Page 38 of 144

ADE7566/ADE7569/ADE7166/ADE7169

×1, ×2, ×4,

×8, ×16

{GAIN[2:0]}

I

AP

INTEGRATOR

dt

WGAIN[11:0]

PGA1

I

ADC

MULTIPLIER

HPF

N

LPF2

PGA1

WATTOS[15:0]

π

2

I

BP

CF1NUM[15:0]

IBGAIN[11:0]

PHCAL[7:0]

VARGAIN[11:0]

CF1

DFC

Ф

LPF2

CF1DEN[15:0]

CF2NUM[15:0]

VAROS[15:0]

VAGAIN[11:0]

IRMSOS[11:0]

2

×

CF2

DFC

LPF

VRMSOS[11:0]

VARDIV[7:0]

V

2P

CF2DEN[15:0]

PGA2

ADC

VADIV[7:0]

%

WDIV[7:0]

LPF

HPF

V

2N

METERING SFRs

Figure 39. ADE7166 and ADE7169 Energy Metering Block Diagram

Rev. A | Page 39 of 144

ADE7566/ADE7569/ADE7166/ADE7169

ENERGY MEASUREMENT REGISTERS

Table 31. Energy Measurement Register List

Address

MADDPT[6:0]

Mnemonic R/W Length Signed/

Default Description

(Bits)

Unsigned

0x00

0x01

0x02

0x03

0x04

0x05

0x06

0x07

Reserved

WATTHR

RWATTHR

LWATTHR

VARHR¹

RVARHR¹

LVARHR¹

VAHR

R

24

S

0

Reads Wh accumulator without reset.

Reads Wh accumulator with reset.

Reads Wh accumulator synchronous to line cycle.

Reads VARh accumulator without reset.

Reads VARh accumulator with reset.

Reads VARh accumulator synchronous to line cycle.

Reads VAh accumulator without reset. If the VARMSCFCON bit in

MODE2 register (0x0C) is set, this register accumulates I_rms

Reads VAh accumulator with reset. If the VARMSCFCON bit in

MODE2 register (0x0C) is set, this register accumulates I_rms

Reads VAh accumulator synchronous to line cycle. If the VARMSCFCON

bit in MODE2 register (0x0C) is set, this register accumulates I_rms

.

0x08

0x09

RVAHR

LVAHR

R

24

S

0

.

0x0A

0x0B

0x0C

0x0D

PER_FREQ

MODE1

R

16

8

U

0

Reads line period or frequency register depending on Mode2 register.

Sets basic configuration of energy measurement (see Table 32).

Sets basic configuration of energy measurement (see Table 33).

R/W

0x06

0x40

0

MODE2

8

WAVMODE R/W

8

Sets configuration of Waveform Sample 1 and Waveform Sample 2

(see Table 34).

0x0E

0x0F

NLMODE

R/W

8

U

0

Sets level of energy no-load thresholds (see Table 35).

ACCMODE R/W

Sets configuration of W, VAR accumulation, and various tamper

alarms (see Table 36).

0x10

0x11

PHCAL

R/W

8

S

0x40

Sets phase calibration register (see the Phase Compensation section).

ZXTOUT

R/W 12

0x0FFF Sets timeout for zero-crossing timeout detection (see the Zero-

Crossing Timeout section).

0x12

0x13

0x14

0x15

0x16

LINCYC

SAGCYC

SAGLVL

IPKLVL

R/W 16

U

0xFFFF Sets number of half-line cycles for LWATTHR, LVARHR, and LVAHR

accumulators.

R/W

8

0xFF

Sets number of half-line cycles for SAG detection (see the Line

Voltage SAG Detection section).

R/W 16

0

Sets detection level for SAG detection (see the Line Voltage SAG

Detection section).

0xFFFF Sets peak detection level for current peak detection (see the Peak

Detection section).

VPKLVL

0xFFFF Sets peak detection level for voltage peak detection (see the Peak

Detection section).

0x17

0x18

0x19

IPEAK

R

24

U

0

Reads current peak level without reset (see the Peak Detection section).

Reads current peak level with reset (see the Peak Detection section).

RSTIPEAK

VPEAK

Reads voltage peak level without reset (see the Peak Detection

section).

0x1A

0x1B

0x1C

0x1D

0x1E

0x1F

0x20

0x21

0x22

0x23

0x24

0x25

RSTVPEAK

GAIN

R

24

8

U

S

0

Reads voltage peak level with reset (see the Peak Detection section).

Sets PGA gain of analog inputs (see Table 37).

Sets matching gain for I_PBcurrent input.

Sets watt gain register.

R/W

IBGAIN²

WGAIN

VARGAIN¹

VAGAIN

WATTOS

VAROS¹

IRMSOS

VRMSOS

WDIV

R/W 12

R/W 16

R/W 12

S

Sets VAR gain register.

S

Sets VA gain register.

S

Sets watt offset register.

S

Sets VAR offset register.

S

Sets current rms offset register.

Sets voltage rms offset register.

Sets watt energy scaling register.

Sets VAR energy scaling register.

S

R/W

8

U

VARDIV

Rev. A | Page 40 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Address

MADDPT[6:0]

Mnemonic R/W Length Signed/

Default Description

(Bits)

Unsigned

0x26

0x27

0x28

0x29

0x2A

0x3B

0x3C

0x3D

0x3E

0x3F

VADIV

R/W

8

U

0

Sets VA energy scaling register.

Sets CF1 numerator register.

CF1NUM

CF1DEN

CF2NUM

CF2DEN

Reserved

R/W 16

0x003F Sets CF1 denominator register.

Sets CF2 numerator register.

0x003F Sets CF2 denominator register.

0

This register must be kept at its default value for proper operation.

0x0300 This register must be kept at its default value for proper operation.

CALMODE²R/W

8

U

0

For ADE7166/ADE7169 only. Set Calibration mode.

Reserved

This register must be kept at its default value for proper operation.

Reserved

¹This function is not available in the ADE7566 and ADE7166.

²This function is not available in the ADE7566 and ADE7569.

ENERGY MEASUREMENT INTERNAL REGISTERS DETAILS

Table 32. MODE1 Register (0x0B)

Bit

Mnemonic

Default

Description

7

SWRST

0

1

0

Setting this bit resets all of the energy measurement registers to their default values.

Setting this bit disables the zero-crossing low-pass filter.

Setting this bit enables the digital integrator for use with a di/dt sensor.

Setting this bit swaps CH1 ADC and CH2 ADC.

6

DISZXLPF

INTE

5

4

SWAPBITS

PWRDN

DISCF2

3

Setting this bit powers down voltage and current ADCs.

Setting this bit disables Frequency Output CF2.

2

1

DISCF1

Setting this bit disables Frequency Output CF1.

0

DISHPF

Setting this bit disables the HPFs in voltage and current channels.

Table 33. MODE2 Register (0x0C)

Bit

Mnemonic

Default

Description

7 to 6

CF2SEL[1:0]

01

Configuration Bits for CF2 Output.

CF2SEL[1:0]

Result

00

01

1x

CF2 frequency is proportional to active power.

CF2 frequency is proportional to reactive power.¹

CF2 frequency is proportional to apparent power or I_rms

.

5 to 4

CF1SEL[1:0]

00

0

Configuration Bits for CF1 Output.

CF1SEL[1:0]

Result

00

01

1x

CF1 frequency is proportional to active power.

CF1 frequency is proportional to reactive power.¹

CF1 frequency is proportional to apparent power or I_rms

.

3

VARMSCFCON

Configuration Bits for Apparent Power or I_rmsfor CF1, CF2 Outputs, and VA Accumulation

Registers (VAHR, RVAHR, and LVAHR). Note that CF1 cannot be proportional to VA if CF2 is

proportional to I_rmsand vice versa.

VARMSCFCON Result

0

If CF1SEL[1:0] = 1x, CF1 is proportional to VA.

If CF2SEL[1:0] = 1x, CF2 is proportional to VA.

1

If CF1SEL[1:0] = 1x, CF1 is proportional to I_rms

.

If CF2SEL[1:0] = 1x, CF2 is proportional to I_rms

.

2

ZXRMS

0

Logic 1 enables update of rms values synchronously to Voltage ZX.

Rev. A | Page 41 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Bit

Mnemonic

Default

Description

1

FREQSEL

Configuration Bits to Select Period or Frequency Measurement for PER_FREQ Register

(0x0A).

FREQSEL

Result

0

1

PER_FREQ register holds a period measurement.

PER_FREQ register holds a frequency measurement.

0

WAVEN

0

When set, the waveform sampling mode is enabled.

¹This function is not available in the ADE7566 and ADE7166.

Table 34. WAVMODE Register (0x0D)

Bit

Mnemonic

Default

Description

Waveform 2 Selection for Samples Mode.

7 to 5

WAV2SEL[2:0]

000

WAV2SEL[2:0]

Source

000

Current

001

Voltage

010

011

100

101

Active power multiplier output

Reactive power multiplier output¹

VA multiplier output

I_rmsLPF output

Others

Reserved

4 to 2

WAV1SEL[2:0]

000

Waveform 1 Selection for Samples Mode.

WAV1SEL[2:0]

Source

000

Current

001

Voltage

010

011

100

101

Active power multiplier output

Reactive power multiplier output¹

VA multiplier output

I_rmsLPF output (low 24-bit)

Reserved

Others

1 to 0

DTRT[1:0]

00

Waveform Samples Output Data Rate.

DTRT[1:0]

Update Rate (Clock = f_CORE/5 = 819.2 kHz)

00

01

10

11

25.6 kSPS (clock/32)

12.8 kSPS (clock/64)

6.4 kSPS (clock/128)

3.2 kSPS (clock/256)

¹This function is not available in the ADE7566 and ADE7166.

Table 35. NLMODE Register (0x0E)

Bit

Mnemonic

Default

Description

7

DISVARCMP¹

0

Setting this bit disables fundamental VAR gain compensation over line frequency.

6

IRMSNOLOAD

Logic 1 enables I_rmsno-load threshold detection. The level is defined by the setting of the

VANOLOAD bits.

5 to 4

VANOLOAD[1:0]

00

Apparent Power No-Load Threshold.

VANOLOAD[1:0]

Result

00

01

10

11

No-load detection disabled

No-load detection enabled with threshold = 0.030% of full scale

No-load detection enabled with threshold = 0.015% of full scale

No-load detection enabled with threshold = 0.0075% of full scale

Rev. A | Page 42 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Bit

Mnemonic

Default

Description

3 to 2

VARNOLOAD[1:0]¹00

Reactive Power No-Load Threshold.

VARNOLOAD[1:0]

Result

00

01

10

11

No-load detection disabled

No-load detection enabled with threshold = 0.015% of full scale

No-load detection enabled with threshold = 0.0075% of full scale

No-load detection enabled with threshold = 0.0037% of full scale

1 to 0

APNOLOAD[1:0]

00

Active Power No-Load Threshold.

APNOLOAD[1:0]

Result

00

01

10

11

No-load detection disabled

No-load detection enabled with threshold = 0.015% of full scale

No-load detection enabled with threshold = 0.0075% of full scale

No-load detection enabled with threshold = 0.0037% of full scale

¹This function is not available in the ADE7566 and ADE7166.

Table 36. ACCMODE Register (0x0F)

Bit

Mnemonic

ICHANNEL¹

Default

Description

7

0

This bit indicates the current channel used to measure energy in antitampering mode.

0 – Channel A

1 – Channel B

6

FAULTSIGN¹

0

Configuration bit to select the event that triggers a fault interrupt.

0 – FAULT interrupt occurs when part enters fault mode

1 – FAULT interrupt occurs when part enters normal mode

5

4

VARSIGN²

APSIGN

0

Configuration bit to select the event that triggers a reactive power sign interrupt. If set to 0, VARSIGN

interrupt occurs when reactive power changes from positive to negative. If set to 1, VARSIGN

interrupt occurs when reactive power changes from negative to positive.

Configuration bit to select event that triggers an active power sign interrupt. If set to 0, APSIGN

interrupt occurs when active power changes from positive to negative. If set to 1, APSIGN interrupt

occurs when active power changes from negative to positive.

3

2

ABSVARM²

SAVARM²

0

Logic 1 enables absolute value accumulation of reactive power in energy register and pulse output.

Logic 1 enables reactive power accumulation depending on the sign of the active power. If active

power is positive, VAR is accumulated as it is. If active power is negative, the sign of the VAR is

reversed for the accumulation. This accumulation mode affects both the VAR registers (VARHR,

RVARHR, LVARHR) and the pulse output when connected to VAR.²

1

0

POAM

0

Logic 1 enables positive-only accumulation of active power in energy register and pulse output.

Logic 1 enables absolute value accumulation of active power in energy register and pulse output.

ABSAM

¹This function is not available in the ADE7566 and ADE7569.

²This function is not available in the ADE7566 and ADE7166.

Table 37. GAIN Register (0x1B)

Bit

Mnemonic

Default

Description

7 to 5

PGA2[2:0]

000

These bits define the voltage channel input gain.

PGA2[2:0]

000

001

010

011

Result

Gain = 1

Gain = 2

Gain = 4

Gain = 8

Gain = 16

100

4

3

Reserved

0

Reserved.

CFSIGN_OPT

This bit defines where the CF change of sign detection (APSIGN or VARSIGN) is implemented.

CFSIGN_OPT

Result

0

1

Filtered power signal

On a per CF pulse basis

Rev. A | Page 43 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Bit

Mnemonic

Default

Description

2 to 0

PGA1[2:0]

000

These bits define the current channel input gain.

PGA1[2:0]

000

001

010

011

Result

Gain = 1¹

Gain = 2

Gain = 4

Gain = 8

Gain = 16

100

¹This gain is not recommended in the ADE7166 and ADE7169 because it can create an overranging of the ADC when both current inputs are in opposite phase.

Table 38. CALMODE Register (0x3D)¹

Bit

Mnemonic

Default

Description

7 to 6

5 to 4

Reserved

0

These bits should be kept cleared for proper operation.

SEL_I_CH[1:0]

These bits define the current channel used for energy measurements.

[1:0]

00 Current channel automatically selected by the tampering condition

01 Current channel connected to I_PA

10 Current channel connected to I_PB

11 Current channel automatically selected by the tampering condition

3

V_CH_SHORT

I_CH_SHORT

Reserved

0

Logic one short voltage channel to ground.

Logic one short Current channels to ground.

2

1 to 0

¹This register is not available in the ADE7566 and ADE7569.

INTERRUPT STATUS/ENABLE SFRS

Table 39. Interrupt Status 1 SFR (MIRQSTL, 0xDC)

Bit

Interrupt Flag

Description

7

ADEIRQFLAG

This bit is set if any of the ADE status flags that are enabled to generate an ADE interrupt are set. This bit is

automatically cleared when all of the enabled ADE status flags are cleared.

6

5

4

3

2

Reserved

FAULTSIGN¹

VARSIGN²

APSIGN

Reserved.

Logic 1 indicates that the fault mode has changed according to the configuration of the ACCMODE register.

Logic 1 indicates that the reactive power sign has changed according to the configuration of the ACCMODE register.

Logic 1 indicates that the active power sign has changed according to the configuration of the ACCMODE register.

VANOLOAD

Logic 1 indicates that an interrupt has been caused by apparent power no-load detected. This interrupt is also

used to reflect the part entering the I_rmsno-load mode.

1

0

RNOLOAD²

APNOLOAD

Logic 1 indicates that an interrupt has been caused by reactive power no-load detected.

Logic 1 indicates that an interrupt has been caused by active power no-load detected.

¹This function is not available in the ADE7566 and ADE7569.

²This function is not available in the ADE7566 and ADE7166.

Table 40. Interrupt Status 2 SFR (MIRQSTM, 0xDD)

Bit

Interrupt Flag

Description

7

CF2

Logic 1 indicates that a pulse on CF2 has been issued. The flag is set even if CF2 pulse output is not enabled by

clearing Bit 2 of the MODE1 register.

6

CF1

Logic 1 indicates that a pulse on CF1 has been issued. The flag is set even if CF1 pulse output is not enabled by

clearing Bit 1 of the MODE1 register.

5

4

3

2

1

0

VAEOF

REOF¹

AEOF

Logic 1 indicates that the VAHR register has overflowed.

Logic 1 indicates that the VARHR register has overflowed.

Logic 1 indicates that the WATTHR register has overflowed.

Logic 1 indicates that the VAHR register is half full.

Logic 1 indicates that the VARHR register is half full.

Logic 1 indicates that the WATTHR register is half full.

VAEHF

REHF¹

AEHF

¹This function is not available in the ADE7566 and ADE7166.

Rev. A | Page 44 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 41. Interrupt Status 3 SFR (MIRQSTH, 0xDE)

Bit

Interrupt Flag

Description

7

RESET

Indicates the end of a reset (for both software and hardware reset).

Reserved.

6

5

WFSM

PKI

Logic 1 indicates that new data is present in the waveform registers (Address 0xE2 to Address 0xE7).

Logic 1 indicates that current channel has exceeded the IPKLVL value

Logic 1 indicates that voltage channel has exceeded the VPKLVL value.

Logic 1 indicates the end of the energy accumulation over an integer number of half-line cycles.

Logic 1 indicates that no zero crossing on the line voltage happened for the last ZXTOUT half-line cycles.

Logic 1 indicates detection of a zero crossing in the voltage channel.

4

3

PKV

2

CYCEND

ZXTO

ZX

1

0

Table 42. Interrupt Enable 1 SFR (MIRQENL, 0xD9)

Bit

Interrupt Enable Bit

Description

7 to 6

Reserved

Reserved.

5

4

3

2

1

0

FAULTSIGN¹

VARSIGN²

When this bit is set, the FAULTSIGN bit set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the VARSIGN flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the APSIGN flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the VANOLOAD flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the RNOLOAD flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the APNOLOAD flag set creates a pending ADE interrupt to the 8052 core.

APSIGN

VANOLOAD

RNOLOAD²

APNOLOAD

¹This function is not available in the ADE7566 and ADE7569.

²This function is not available in the ADE7566 and ADE7166.

Table 43. Interrupt Enable 2 SFR (MIRQENM, 0xDA)

Bit

Interrupt Enable Bit

Description

7

CF2

When this bit is set, a CF2 pulse creates a pending ADE interrupt to the 8052 core.

When this bit is set, a CF1 pulse creates a pending ADE interrupt to the 8052 core.

When this bit is set, the VAEOF flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the REOF flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the AEOF flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the VAEHF flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the REHF flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the AEHF flag set creates a pending ADE interrupt to the 8052 core.

6

CF1

5

VAEOF

REOF¹

AEOF

VAEHF

REHF¹

AEHF

4

3

2

1

0

¹This function is not available in the ADE7566 and ADE7166.

Rev. A | Page 45 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 44. Interrupt Enable 3 SFR (MIRQENH, 0xDB)

Bit

Interrupt Enable Bit

Description

7 to 6

Reserved.

5

4

3

2

1

0

WFSM

PKI

When this bit is set, the WFSM flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the PKI flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the PKV flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the CYCEND flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the ZXTO flag set creates a pending ADE interrupt to the 8052 core.

When this bit is set, the ZX flag set creates a pending ADE interrupt to the 8052 core.

PKV

CYCEND

ZXTO

ZX

GAIN[7:0]

ANALOG INPUTS

7

0

6

0

5

0

4

0

3

0

2

0

1

0

Each ADE7566/ADE7569/ADE7166/ADE7169 has two fully

differential voltage input channels. The maximum differential

input voltage for input pairs V_P/V_Nand I_P/I_Nis 0.4 V. for the

ADE7566 and ADE7569.

GAIN (K)

SELECTION

V 1

P

For the ADE7166 and ADE7169, PGA1 = 1 is not recommended

because at full scale, when both I_PAand I_PBare 180° out of phase,

the ADC can be overranged. It is recommended, for these

products, that PGA1 = 2, 4, 8, or 16 be used.

K × V

IN

V

IN

V

1

N

Each analog input channel has a programmable gain amplifier

(PGA) with possible gain selections of 1, 2, 4, 8, and 16. The

gain selections are made by writing to the GAIN register (see

Table 37 and Figure 41). Bit 0 to Bit 2 select the gain for the PGA

in the current channel, and Bit 5 to Bit 7 select the gain for the

PGA in the voltage channel. For the ADE7166 and ADE7169, it

is recommended that PGA1 = 2, 4, 8, or 16 be used. Figure 40

shows how a gain selection for the current channel is made

using the gain register.

Figure 40. PGA in Current Channel

GAIN REGISTER*

CURRENT AND VOLTAGE CHANNELS PGA CONTROL

7

0

6

0

5

0

4

0

3

0

2

0

1

0

ADDR:

0x1B

PGA2 GAIN SELECT

000 = × 1

PGA1 GAIN SELECT

000 = × 1

001 = × 2

010 = × 4

011 = × 8

100 = × 16

011 = × 8

100 = × 16

CFSIGN_OPT

RESERVED

*REGISTER CONTENTS SHOW POWER-ON DEFAULTS.

Figure 41. Analog Gain Register

Rev. A | Page 46 of 144

ADE7566/ADE7569/ADE7166/ADE7169

ADE7569/ADE7166/ADE7169 is 4.096 MHz/5 (819.2 kHz),

and the band of interest is 40 Hz to 2 kHz. Oversampling has

the effect of spreading the quantization noise (noise due to

sampling) over a wider bandwidth. With the noise spread more

thinly over a wider bandwidth, the quantization noise in the

band of interest is lowered (see Figure 42).

ANALOG-TO-DIGITAL CONVERSION

Each ADE7566/ADE7569/ADE7166/ADE7169 has two sigma-

delta (Σ-Δ) analog-to-digital converters (ADCs). The outputs of

these ADCs are mapped directly to waveform sampling SFRs

(Address 0xE2 to Address 0xE7) and are used for energy

measurement internal digital signal processing. In PSM1 (battery

mode) and PSM2 (sleep mode), the ADCs are powered down to

minimize power consumption.

However, oversampling alone is not efficient enough to improve

the signal-to-noise ratio (SNR) in the band of interest. For example,

an oversampling ratio of four is required to increase the SNR by

only 6 dB (1 bit). To keep the oversampling ratio at a reasonable

level, it is possible to shape the quantization noise so that the

majority of the noise lies at the higher frequencies. In the Σ-ꢀ

modulator, the noise is shaped by the integrator, which has a

high-pass-type response for the quantization noise. The result is

that most of the noise is at the higher frequencies where it can

be removed by the digital low-pass filter. This noise shaping is

shown in Figure 42.

For simplicity, the block diagram in Figure 43 shows a first-

order Σ-ꢀ ADC. The converter is made up of the Σ-ꢀ modulator

and the digital low-pass filter.

A Σ-∆ modulator converts the input signal into a continuous

serial stream of 1s and 0s at a rate determined by the sampling

clock. In the ADE7566/ADE7569/ADE7166/ADE7169, the

sampling clock is equal to 4.096 MHz/5. The 1-bit DAC in the

feedback loop is driven by the serial data stream. The DAC

output is subtracted from the input signal. If the loop gain is

high enough, the average value of the DAC output (and,

therefore, the bit stream) can approach that of the input signal

level.

ANTIALIAS

FILTER (RC)

DIGITAL

FILTER

SAMPLING

FREQUENCY

SIGNAL

SHAPED

NOISE

For any given input value in a single sampling interval, the data

from the 1-bit ADC is virtually meaningless. Only when a large

number of samples are averaged is a meaningful result obtained.

This averaging is carried into the second part of the ADC, the

digital low-pass filter. By averaging a large number of bits from

the modulator, the low-pass filter can produce 24-bit data-

words that are proportional to the input signal level.

0

2

409.6

FREQUENCY (kHz)

819.2

HIGH RESOLUTION

OUTPUT FROM DIGITAL

LPF

SIGNAL

NOISE

The Σ-ꢀ converter uses two techniques to achieve high resolution

from what is essentially a 1-bit conversion technique. The first

is oversampling. Oversampling means that the signal is sampled

at a rate (frequency) that is many times higher than the bandwidth

of interest. For example, the sampling rate in the ADE7566/

0

2

409.6

FREQUENCY (kHz)

819.2

Figure 42. Noise Reduction Due to Oversampling and

Noise Shaping in the Analog Modulator

MCLK/5

ANALOG

LOW-PASS FILTER

DIGITAL

INTEGRATOR

LOW-PASS

LATCHED

COMPARATOR

FILTER

+

R

–

C

24

V

REF

... 10100101 ...

1-BIT DAC

Figure 43. First-Order Σ-∆ ADC

Rev. A | Page 47 of 144

ADE7566/ADE7569/ADE7166/ADE7169

ALIASING EFFECTS

Antialiasing Filter

Figure 43 also shows an analog low-pass filter (RC) on the input

to the modulator. This filter is present to prevent aliasing, an

artifact of all sampled systems. Aliasing means that frequency

components in the input signal to the ADC, which are higher

than half the sampling rate of the ADC, appear in the sampled

signal at a frequency below half the sampling rate. Figure 44

illustrates the effect. Frequency components (the black arrows)

above half the sampling frequency (also know as the Nyquist

frequency, that is, 409.6 kHz) are imaged or folded back down

below 409.6 kHz. This happens with all ADCs regardless of the

architecture. In the example shown, only frequencies near the

sampling frequency (819.2 kHz) move into the band of interest

for metering (40 Hz to 2 kHz). This allows the use of a very

simple LPF (low-pass filter) to attenuate high frequency (near

819.2 kHz) noise and prevents distortion in the band of interest.

SAMPLING

FREQUENCY

IMAGE

FREQUENCIES

0

2

409.6

819.2

FREQUENCY (kHz)

Figure 44. ADC and Signal Processing in Current Channel Outline Dimensions

ADC Transfer Function

Both ADCs in the ADE7566/ADE7569/ADE7166/ADE7169 are

designed to produce the same output code for the same input

signal level. With a full-scale signal on the input of 0.4 V and an

internal reference of 1.2 V, the ADC output code is nominally

2,147,483 or 0x20C49B. The maximum code from the ADC is

4,194,304; this is equivalent to an input signal level of 0.794 V.

However, for specified performance, it is recommended that the

full-scale input signal level of 0.4 V not be exceeded.

For conventional current sensors, a simple RC filter (single-pole

LPF) with a corner frequency of 10 kHz produces an attenuation

of approximately 40 dB at 819.2 kHz (see Figure 44). The 20 dB

per decade attenuation is usually sufficient to eliminate the

effects of aliasing for conventional current sensors. However, for

a di/dt sensor such as a Rogowski coil, the sensor has a 20 dB

per decade gain. This neutralizes the −20 dB per decade

attenuation produced by one simple LPF. Therefore, when using

a di/dt sensor, care should be taken to offset the 20 dB per

decade gain. One simple approach is to cascade two RC filters

to produce the −40 dB per decade attenuation needed.

Current Channel ADC

Figure 45 shows the ADC and signal processing chain for the

current channel. In waveform sampling mode, the ADC outputs

a signed, twos complement, 24-bit data-word at a maximum of

25.6 kSPS (4.096 MHz/160).

With the specified full-scale analog input signal of 0.4 V and

PGA1 = 1, the ADC produces an output code that is approximately

between 0x20C49B (+2,147,483d) and 0xDF3B65 (−2,147,483d).

For inputs of 0.25 V, 0.125 V, 82.6 mV, and 31.3 mV with PGA1 = 2,

4, 8, and 16, respectively, the ADC produces an output code that

is approximately between 0x28F5C2 (+2,684,354d) and 0xD70A3E

(–2,684,354d).

MODE 1[5]

×1, ×2, ×4

×8, ×16

{GAIN[2:0]}

CURRENT RMS (I

CALCULATION

)

rms

REFERENCE

ADC

WAVEFORM SAMPLE

REGISTER

DIGITAL

INTEGRATOR*

I

PA

I

ACTIVE AND REACTIVE

POWER CALCULATION

PGA1

dt

HPF

I

N

CURRENT CHANNEL

WAVEFORM

DATA RANGE AFTER

INTEGRATOR (50Hz)

50Hz

0x342CD0

V1

0.25V, 0.125V,

CURRENT CHANNEL

62.5mV, 31.3mV

WAVEFORM

DATA RANGE

0x000000

0V

0x28F5C2

60Hz

0xCBD330

0x000000

ANALOG

INPUT

CURRENT CHANNEL

WAVEFORM

RANGE

DATA RANGE AFTER

INTEGRATOR (60Hz)

0xD70A3E

0x2B7850

0x000000

0xD487B0

*WHEN DIGITAL INTEGRATOR IS ENABLED, FULL-SCALE OUTPUT DATA IS ATTENUATED

DEPENDING ON THE SIGNAL FREQUENCY BECAUSE THE INTEGRATOR HAS A –20dB/DECADE

FREQUENCY RESPONSE. WHEN DISABLED, THE OUTPUT IS NOT FURTHER ATTENUATED.

PGA1 = 1 IS NOT RECOMMENDED IN THE ADE7166 AND ADE7169.

Figure 45. ADC and Signal Processing in Current Channel with PGA1 = 1, 2, 4, 8, or 16 for ADE7566 and ADE7569

Rev. A | Page 48 of 144

ADE7566/ADE7569/ADE7166/ADE7169

MODE 1[5]

×1, ×2, ×4

×8, ×16

{GAIN[2:0]}

CURRENT RMS (I

CALCULATION

)

rms

REFERENCE

ADC

WAVEFORM SAMPLE

REGISTER

DIGITAL

INTEGRATOR*

I

PA

ACTIVE AND REACTIVE

POWER CALCULATION

PGA1

I

dt

HPF

I

N

CURRENT CHANNEL

WAVEFORM

DATA RANGE AFTER

INTEGRATOR (50Hz)

ADC

50Hz

0x342CD0

HPF

BP

V1

0.25V, 0.125V,

62.5mV, 31.3mV

IBGAIN

0x000000

0V

60Hz

CURRENT CHANNEL

0xCBD330

WAVEFORM

CURRENT CHANNEL

WAVEFORM

DATA RANGE AFTER

INTEGRATOR (60Hz)

DATA RANGE

ANALOG

INPUT

RANGE

0x28F5C2

0x000000

0xD70A3E

0x2B7850

0x000000

0xD487B0

*WHEN DIGITAL INTEGRATOR IS ENABLED, FULL-SCALE OUTPUT DATA IS ATTENUATED

DEPENDING ON THE SIGNAL FREQUENCY BECAUSE THE INTEGRATOR HAS A –20dB/DECADE

FREQUENCY RESPONSE. WHEN DISABLED, THE OUTPUT IS NOT FURTHER ATTENUATED.

Figure 46. ADC and Signal Processing in Current Channel with PGA1 = 2, 4, 8, or 16 for ADE7166 and ADE7169

ACTIVE AND REACTIVE

×1, ×2, ×4,

REFERENCE

ADC

POWER CALCULATION

×8, ×16

{GAIN[7:5]}

VOLTAGE RMS (V

)

rms

V

P

CALCULATION

HPF

WAVEFORM SAMPLE

REGISTER

PGA2

V2

VOLTAGE PEAK DETECT

N

V2

0.5V, 0.25V,

0.125V, 62.5mV,

31.3mV

ZX DETECTION

LPF1

f_–3dB= 63.7Hz

0V

VOLTAGE CHANNEL

WAVEFORM

DATA RANGE

ZX SIGNAL

DATA RANGE FOR 60Hz SIGNAL

0x1DD0

ANALOG

MODE 1[6]

0x28F5

INPUT

RANGE

0x0000

0xE230

0x0000

0xD70B

ZX SIGNAL

DATA RANGE FOR 50Hz SIGNAL

0x2037

0x0000

0xDFC9

*WHEN DIGITAL INTEGRATOR IS ENABLED, FULL-SCALE OUTPUT DATA IS ATTENUATED

DEPENDING ON THE SIGNAL FREQUENCY BECAUSE THE INTEGRATOR HAS A –20dB/DECADE

FREQUENCY RESPONSE. WHEN DISABLED, THE OUTPUT IS NOT FURTHER ATTENUATED.

Figure 47. ADC and Signal Processing in Voltage Channel

Rev. A | Page 49 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Voltage Channel ADC

this bit is cleared, I_PAis selected and, when it is set, I_PBis

selected. The ADE7166/ADE7169 automatically switch from

one channel to the other and report the channel configuration

in the ACCMODE Register (0x0F).

Figure 47 shows the ADC and signal processing chain for the

voltage channel. In waveform sampling mode, the ADC outputs

a signed, twos complement, 24-bit data-word at a maximum

of 25.6 kSPS (MCLK/160). The ADC produces an output code

that is approximately between 0x28F5 (+10,485d) and 0xD70B

(−10,485d).

The current channel selected for measurement can also be

forced. Setting the SEL_I_CH[1:0] bits in the CALMODE

Register (0x3D) selects I_PAand I_PB, respectively. When both bits

are cleared or set, the current channel used for measurement is

selected automatically based on the fault detection.

Channel Sampling

The waveform samples of the current ADC and voltage ADC

can also be routed to the waveform registers to be read by the

MCU core. The active, reactive, apparent power, and energy

calculation remain uninterrupted during waveform sampling.

Fault Indication

The ADE7166/ADE7169 provide an indication of the part going

in or out of a fault condition. The new fault condition is

indicated by the FAULTSIGN flag (Bit 5) in the Interrupt Status

1 SFR (MIRQSTL, 0xDC).

When in waveform sampling mode, one of four output sample

rates can be chosen by using the DTRT[1:0] bits of the WAVMODE

register (see Table 34). The output sample rate can be 25.6 kSPS,

12.8 kSPS, 6.4 kSPS, or 3.2 kSPS. If the WFSM enable bit is set

in the Interrupt Enable 3 SFR (MIRQENH, 0xDB), the 8052

core has a pending ADE interrupt. The sampled signals selected

in the WAVMODE register are latched into the Waveform SFRs

when the waveform high byte (WAV1H or WAV2H) is read.

When FAULTSIGN bit (Bit 6) of the ACCMODE Register

(0x0F) is cleared, the FAULTSIGN flag in the Interrupt Status 1

SFR (MIRQSTL, 0xDC) is set when the part is a entering fault

condition or a normal condition.

When the FAULTSIGN bit is set in the Interrupt Enable 1 SFR

(MIRQENL, 0xD9), and the FAULTSIGN flag in the Interrupt

Status 1 SFR (MIRQSTL, 0xDC) is set, the 8052 core has a

pending ADE interrupt.

The ADE interrupt stays active until the WFSM status bit is

cleared (see the Energy Measurement Interrupts section).

FAULT DETECTION¹

Fault with Active Input Greater Than Inactive Input

If I_PAis the active current input (that is, being used for billing),

and the voltage signal on I_PB(inactive input) falls below 93.75%

of I_PA, and the FAULTSIGN bit (Bit 6) of ACCMODE Register

(0x0F) is cleared, the FAULTSIGN flag in the Interrupt Status 1

SFR (MIRQSTL, 0xDC) is set. Both analog inputs are filtered

and averaged to prevent false triggering of this logic output. As

a consequence of the filtering, there is a time delay of

approximately three seconds on the logic output after the fault

event. The FAULTSIGN flag is independent of any activity.

Because I_PAis the active input and it is still greater than I_PB,

billing is maintained on I_PA; that is, no swap to the I_PBinput

occurs. I_PAremains the active input.

The ADE7166/ADE7169 incorporate a fault detection scheme

that warns of fault conditions and allows the ADE7166/ADE7169

to continue accurate measurement during a fault event. The

ADE7166/ADE7169 do this by continuously monitoring both

current inputs (I_PAand I_PB). For ease of understanding, these

currents are referred to as phase and neutral (return) currents.

In the ADE7166/ADE7169, a fault condition is defined when

the difference between I_PAand I_PBis greater than 6.25% of the

active channel. If a fault condition is detected and the inactive

channel is larger than the active channel, the

ADE7166/ADE7169 automatically switch current measurement to

the inactive channel. During a fault, the active, reactive, current

rms and apparent powers are generated using the larger of the

two currents. On power-up, I_PAis the current input selected for

active, reactive, and apparent power and Irms calculations.

Fault with Inactive Input Greater Than Active Input

If the difference between I_PB, the inactive input, and I_PA, the

active input (that is, being used for billing), becomes greater

than 6.25% of I_PB, and the FAULTSIGN bit (Bit 6) of ACCMODE

Register (0x0F) is cleared, the FAULTSIGN flag in the Interrupt

Status 1 SFR (MIRQSTL, 0xDC) is set. The analog input I_PB

becomes the active input. Again, a time constant of about three

seconds is associated with this swap. I_PAdoes not swap back to

the active channel until I_PAis greater than I_PBand the difference

between I_PAand I_PB—in this order—becomes greater than 6.25%

of I_PB. However, if FAULTSIGN bit (Bit 6) of ACCMODE

Register (0x0F) is set, the FAULTSIGN flag in the Interrupt

Status 1 SFR (MIRQSTL, 0xDC) is set as soon as I_PAis within

6.25% of IP_B. This threshold eliminates potential chatter

between I_PAand I_PB.

To prevent false alarm, averaging is done for the fault detection,

and a fault condition is detected approximately one second after

the event. The fault detection is automatically disabled when the

voltage signal is less than 0.3% of the full-scale input range. This

eliminates false detection of a fault due to noise at light loads.

Because the ADE7166/ADE7169 look for a difference between

the voltage signals on I_PAand I_PB, it is important that both

current transducers be closely matched.

Channel Selection Indication

The current channel selected for measurement is indicated by

Bit 7 (ICHANNEL) in the ACCMODE Register (0x0F). When

¹This function is not available in the ADE7566 and ADE7569.

Rev. A | Page 50 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Calibration Concerns

di/dt CURRENT SENSOR AND DIGITAL

INTEGRATOR FOR THE ADE7569/ADE7169

Typically, when a meter is being calibrated, the voltage and

current circuits are separated, as shown in Figure 48. This

means that current passes through only the phase or neutral

circuit. Figure 48 shows current being passed through the phase

circuit. This is the preferred option because the ADE7166/

ADE7169 start billing on the input I_PAon power-up. The phase

circuit CT is connected to I_PAin the diagram. Because the

current sensors are not perfectly matched, it is important to

match current inputs. The ADE7166/ADE7169 provide a gain

calibration register for I_PB,IBGAIN (address 0x1C). IBGAIN is a

12-bit, signed, twos complement register that provides a gain

resolution of 0.0244%/LSB.

A di/dt sensor, a feature available for the AD7569/ADE7169 but

not for the AD7566/ADE7166, detects changes in the magnetic

field caused by ac currents. Figure 49 shows the principle of a

di/dt current sensor.

MAGNETIC FIELD CREATED BY CURRENT

(DIRECTLY PROPORTIONAL TO CURRENT)

+

–

EMF (ELECTROMOTIVE FORCE)

INDUCED BY CHANGES IN

For calibration, a first measurement should be done on I_PAby

setting the SEL_I_CH bits to 0b01 in the CALMODE Register

(0x3D). This measurement should be compared to the

MAGNETIC FLUX DENSITY (di/dt)

Figure 49. Principle of a di/dt Current Sensor

The flux density of a magnetic field induced by a current is

directly proportional to the magnitude of the current. The

changes in the magnetic flux density passing through a conductor

loop generate an electromotive force (EMF) between the two

ends of the loop. The EMF is a voltage signal that is proportional

to the di/dt of the current. The voltage output from the di/dt

current sensor is determined by the mutual inductance between

the current-carrying conductor and the di/dt sensor. The current

signal needs to be recovered from the di/dt signal before it can

be used. An integrator is therefore necessary to restore the

signal to its original form.

measurement on I_PB. Measuring I_PBcan be forced by setting

SEL_I_CH bits to 0b10 in the CALMODE Register (0x3D). The

gain error between these two measurements can be evaluated using

Measurement

(

I _B

)

− Measurement

I _A

(

I _A

)

Error

(

% =

)

Measurement

(

)

The two channels I_PAand I_PBcan then be matched by writing

–Error(%)/(1 + Error (%)) × 2¹²to the IBGAIN register. This

matching adjustment is be valid for all energy measurements,

active power, reactive power, I_rms, and apparent power, made by

the ADE7166/ADE7169.

I

The ADE7569/ADE7169 have a built-in digital integrator to

recover the current signal from the di/dt sensor. The digital

integrator on the current channel is switched off by default when

the ADE7569/ADE7169 are powered up. Setting the INTE bit in

the MODE1 register (0x0B) turns on the integrator. Figure 50 to

Figure 53 show the magnitude and phase response of the digital

integrator.

R

F

PA

I

PB

CT

0

R

B

C

V

F

A

AGND

I

N

0V

R

B

TEST

CURRENT

CT

10

R

F

I

PB

R

A

V

P

C

R

F

V

0

N

R

C

F

T

–10

V

240V rms

–20

–30

Figure 48. Fault Conditions for Inactive Input Greater Than Active Input

–40

–50

100

1000

FREQUENCY (Hz)

Figure 50. Combined Gain Response of the Digital Integrator and

Phase Compensator

Rev. A | Page 51 of 144

ADE7566/ADE7569/ADE7166/ADE7169

–89.70

–89.75

–89.80

–89.85

–89.90

–89.95

–90.00

–88.0

–88.5

–89.0

–89.5

–90.0

–90.5

–90.05

2

3

10

40

45

50

55

60

65

70

10

FREQUENCY (Hz)

Figure 53. Combined Phase Response of the Digital Integrator and

Phase Compensator (40 Hz to 70 Hz)

Figure 51. Combined Phase Response of the Digital Integrator and

Phase Compensator

–1.0

Note that the integrator has a −20 dB/dec attenuation and an

approximately −90° phase shift. When combined with a di/dt

sensor, the resulting magnitude and phase response should be a

flat gain over the frequency band of interest. The di/dt sensor

has a 20 dB/dec gain associated with it. It also generates

significant high frequency noise. Therefore, a more effective

antialiasing filter is needed to avoid noise due to aliasing (see

the Antialiasing Filter section).

–1.5

–2.0

–2.5

–3.0

–3.5

–4.0

–4.5

When the digital integrator is switched off, the ADE7569/ADE7169

can be used directly with a conventional current sensor such as a

current transformer (CT) or with a low resistance current shunt.

–5.0

–5.5

–6.0

40

45

50

55

60

65

70

FREQUENCY (Hz)

Figure 52. Combined Gain Response of the Digital Integrator and

Phase Compensator (40 Hz to 70 Hz)

Rev. A | Page 52 of 144

ADE7566/ADE7569/ADE7166/ADE7169

this register is 0xFFF. If the internal register decrements to 0

before a zero crossing is detected in the Interrupt Status 3 SFR

(MIRQSTH, 0xDE), and the ZXTO bit in the Interrupt Enable 3

SFR (MIRQENH, 0xDB) is set, the 8052 core has a pending

ADE interrupt.

POWER QUALITY MEASUREMENTS

Zero-Crossing Detection

Each ADE7566/ADE7569/ADE7166/ADE7169 has a zero-

crossing detection circuit on the voltage channel. This zero

crossing is used to produce a zero-crossing internal signal (ZX)

and is used in calibration mode.

The ADE interrupt stays active until the ZXTO status bit is

cleared (see the Energy Measurement Interrupts section). The

ZXOUT register (Address 0x11) can be written to or read by the

user (see the Energy Measurement Register List section). The

resolution of the register is 160/MCLK seconds per LSB. Thus,

the maximum delay for an interrupt is 0.16 seconds (1/MCLK ×

2¹²) when MCLK = 4.096 MHz.

The zero-crossing is generated by default from the output of

LPF1. This filter has a low cut-off frequency and is intended for

50 Hz and 60 Hz systems. If needed, this filter can be disabled

to allow a higher frequency signal to be detected or to limit the

group delay of the detection. If the voltage input fundamental

frequency is below 60 Hz, and a time delay in ZX detection is

acceptable, it is recommended to enable LPF1. Enabling LPF1

limits the variability in the ZX detection by eliminating the high

frequency components. Figure 54 shows how the zero-crossing

signal is generated.

Figure 55 shows the mechanism of the zero-crossing timeout

detection when the line voltage stays at a fixed dc level for more

than MCLK/160 × ZXTOUT seconds.

12-BIT INTERNAL

REGISTER VALUE

ZXTOUT

×1, ×2, ×4,

×8, ×16

REFERENCE

V

{GAIN [7:5]}

PGA2

P

N

HPF

ADC 2

V2

V

VOLTAGE

CHANNEL

ZERO

CROSS

ZX

LPF1

f_–3dB= 63.7Hz

ZXTO

FLAG

BIT

MODE 1[6]

43.24° @ 60Hz

1.0

0.73

Figure 55. Zero-Crossing Timeout Detection

ZX

Period or Frequency Measurements

The ADE7566/ADE7569/ADE7166/ADE7169 provide the

period or frequency measurement of the line. The period or

frequency measurement is selected by clearing or setting the

FREQSEL bit in the MODE2 register (0x0C). The period/

frequency register, PER_FREQ Register (0x0A), is an unsigned

16-bit register that is updated every period. If LPF1 is enabled, a

settling time of 1.8 seconds is associated with this filter before

the measurement is stable.

LPF1

V2

Figure 54. Zero-Crossing Detection on the Voltage Channel

The zero-crossing signal ZX is generated from the output of

LPF1 (bypassed or not). LPF1 has a single pole at 63.7 Hz (at

MCLK = 4.096 MHz). As a result, there is a phase lag between

the analog input signal V2 and the output of LPF1. The phase

lag response of LPF1 results in a time delay of approximately

2 ms (@ 60 Hz) between the zero crossing on the analog inputs

of the voltage channel and ZX detection.

When the period measurement is selected, the measurement has a

2.44 μs/LSB (4.096 MHz/10), which represents 0.014% when the

line frequency is 60 Hz. When the line frequency is 60 Hz, the value

of the period register is approximately 0d6827. The length of

the register enables the measurement of line frequencies as low

as 12.5 Hz. The period register is stable at 1 LSB when the line

is established and the measurement does not change.

The zero-crossing detection also drives the ZX flag in the

Interrupt Status 3 SFR (MIRQSTH, 0xDE). If the ZX bit in the

Interrupt Enable 3 SFR (MIRQENH, 0xDB) is set, the 8052 core

has a pending ADE interrupt. The ADE interrupt stays active

until the ZX status bit is cleared (see the Energy Measurement

Interrupts section).

When the frequency measurement is selected, the measurement

has a 0.0625 Hz/LSB resolution when MCLK = 4.096 MHz,

which represents 0.104% when the line frequency is 60 Hz.

When the line frequency is 60 Hz, the value of the frequency

register is 0d960. The frequency register is stable at 4 LSB when

the line is established and the measurement does not change.

Zero-Crossing Timeout

The zero-crossing detection also has an associated timeout

register, ZXTOUT. This unsigned, 12-bit register is decremented

(1 LSB) every 160/MCLK seconds. The register is reset to its

user programmed, full-scale value every time a zero crossing is

detected on the voltage channel. The default power-on value in

Rev. A | Page 53 of 144

ADE7566/ADE7569/ADE7166/ADE7169

V

2

Line Voltage SAG Detection

VPKLVL[15:0]

In addition to detection of the loss of the line voltage signal

(zero crossing), the ADE7566/ADE7569/ADE7166/ADE7169

can also be programmed to detect when the absolute value of

the line voltage drops below a certain peak value for a number

of line cycles. This condition is illustrated in Figure 56.

PKV RESET

LOW WHEN

MIRQSTH SFR

IS READ

VOLTAGE CHANNEL

FULL SCALE

PKV INTERRUPT

FLAG

SAGLVL [15:0]

RESET BIT PKV

IN MIRQSTH SFR

SAG RESET LOW

WHEN VOLTAGE

CHANNEL EXCEEDS

Figure 57. Peak Level Detection

SAGLVL [15:0] AND

Figure 57 shows a line voltage exceeding a threshold that is set

in the voltage peak register (VPKLVL[15:0]). The voltage peak

event is recorded by setting the PKV flag in the Interrupt Status

3 SFR (MIRQSTH, 0xDE). If the PKV enable bit is set in the

Interrupt Enable 3 SFR (MIRQENH, 0xDB), the 8052 core has a

pending ADE interrupt. Similarly, the current peak event is

recorded by setting the PKI flag in Interrupt Status 3 SFR

(MIRQSTH, 0xDE). The ADE interrupt stays active until the

PKV or PKI status bit is cleared (see the Energy Measurement

Interrupts section).

SAGCYC [7:0] = 0x04

SAG FLAG RESET

3 LINE CYCLES

SAG FLAG

Figure 56. SAG Detection

Figure 56 shows the line voltage falling below a threshold that is

set in the SAG level register (SAGLVL[15:0]) for three line

cycles. The quantities 0 and 1 are not valid for the SAGCYC

register, and the contents represent one more than the desired

number of full line cycles. For example, when the SAG cycle

(SAGCYC[7:0]) contains 0x04, FSAG in the Power Management

Interrupt Flag SFR (IPSMF, 0xF8) is set at the end of the third

line cycle after the line voltage falls below the threshold. If the SAG

enable bit (ESAG) in the Power Management Interrupt Enable SFR

(IPSME, 0xEC) is set, the 8052 core has a pending power supply

monitoring interrupt. The PSM interrupt stays active until the

ESAG bit is cleared (see the Power Supply Monitor Interrupt

(PSM) section).

Peak Level Set

The contents of the VPKLVL and IPKLVL registers are compared

to the absolute value of the voltage and current channels 2 MSBs,

respectively. Thus, for example, the nominal maximum code

from the current channel ADC with a full-scale signal is

0x28F5C2 (see the Current Channel ADC section). Therefore,

writing 0x28F5 to the IPKLVL register puts the current channel,

peak detection level at full scale and sets the current peak

detection to its least sensitive value. Writing 0x00 puts the

current channel detection level at 0. The detection is done by

comparing the contents of the IPKLVL register to the incoming

current channel sample. The PKI flag indicates that the peak level is

exceeded. If the PKI or PKV bit is set in the Interrupt Enable 3

SFR (MIRQENH, 0xDB), the 8052 core has a pending ADE

interrupt.

In Figure 56, the SAG flag (FSAG) is set on the fifth line cycle

after the signal on the voltage channel first dropped below the

threshold level.

SAG Level Set

The 2-byte contents of the SAG level register (SAGLVL, 0x14)

are compared to the absolute value of the output from LPF1.

Therefore, when LPF1 is enabled, writing 0x2038 to the SAG

level register puts the SAG detection level at full scale (see

Figure 56). Writing 0x00 or 0x01 puts the SAG detection level at

0. The SAG level register is compared to the input of the ZX

detection, and detection is made when the contents of the SAG

level register are greater.

Peak Level Record

Each ADE7566/ADE7569/ADE7166/ADE7169 records the

maximum absolute value reached by the voltage and current

channels in two different registers, IPEAK and VPEAK,

respectively. Each register is a 24-bit unsigned register that is

updated each time the absolute value of the waveform sample

from the corresponding channel is above the value stored in the

VPEAK or IPEAK register. The contents of the VPEAK register

correspond to the maximum absolute value observed on the

voltage channel input. The contents of IPEAK and VPEAK

represent the maximum absolute value observed on the current

and voltage input, respectively. Reading the RSTVPEAK and

RSTIPEAK registers clears their respective contents after the read

operation.

Peak Detection

The ADE7566/ADE7569/ADE7166/ADE7169 can also be

programmed to detect when the absolute value of the voltage or

current channel exceeds a specified peak value. Figure 57

illustrates the behavior of the peak detection for the voltage

channel. Both voltage and current channels are monitored at the

same time.

Rev. A | Page 54 of 144

ADE7566/ADE7569/ADE7166/ADE7169

PHASE COMPENSATION

RMS CALCULATION

The ADE7566/ADE7569/ADE7166/ADE7169 must work with

transducers that can have inherent phase errors. For example, a

phase error of 0.1° to 0.3° is not uncommon for a current

transformer (CT). These phase errors can vary from part to part,

and they must be corrected to perform accurate power

calculations. The errors associated with phase mismatch are

particularly noticeable at low power factors. The ADE7566/

ADE7569/ADE7166/ADE7169 provide a means of digitally

calibrating these small phase errors. The part allows a small

time delay or time advance to be introduced into the signal

processing chain to compensate for small phase errors. Because

the compensation is in time, this technique should only be used

for small phase errors in the range of 0.1° to 0.5°. Correcting

large phase errors using a time shift technique can introduce

significant phase errors at higher harmonics.

The root mean square (rms) value of a continuous signal V(t) is

defined as

T

1

V_rms

=

× V ²(t)dt

(3)

∫

T

0

For time sampling signals, rms calculation involves squaring the

signal, taking the average, and obtaining the square root. The

ADE7566/ADE7569/ADE7166/ADE7169 implement this

method by serially squaring the input, averaging them, and then

taking the square root of the average. The averaging part of this

signal processing is done by implementing a low-pass filter

(LPF3 in Figure 59, Figure 61, and Figure 62). This LPF has a

−3 dB cut-off frequency of 2 Hz when MCLK = 4.096 MHz.

V

(

t

)

= 2 ×V sin(ωt)

where V is the rms voltage.

V ²(t) =V ²−V ²cos

2ωt

(4)

The phase calibration register (PHCAL[7:0]) is a twos complement,

signed, single-byte register that has values ranging from 0x82

(−126d) to 0x68 (+104d).

(

)

(5)

The PHCAL register is centered at 0x40, meaning that writing

0x40 to the register gives 0 delay. By changing this register, the

time delay in the voltage channel signal path can change from

−231.93 μs to +48.83 μs (MCLK = 4.096 MHz). One LSB is

equivalent to 1.22 μs (4.096 MHz/5) time delay or advance. A

line frequency of 60 Hz gives a phase resolution of 0.026° at the

fundamental (that is, 360° × 1.22 μs × 60 Hz).

When this signal goes through LPF3, the cos(2ωt) term is attenu-

ated and only the dc term V_rms²goes through (see Figure 59).

2

V

(t) = V – V cos(2ωt)

V(t) = √2 × V sin(ωt)

LPF3

INPUT

V

Figure 58 illustrates how the phase compensation is used to

remove a 0.1° phase lead in the current channel due to the

external transducer. To cancel the lead (0.1°) in the current

channel, a phase lead must also be introduced into the voltage

channel. The resolution of the phase adjustment allows the

introduction of a phase lead in increments of 0.026°. The phase

lead is achieved by introducing a time advance into the voltage

channel. A time advance of 4.88 μs is made by writing −4 (0x3C)

to the time delay block, thus reducing the amount of time delay

by 4.88 μs, or equivalently, a phase lead of approximately 0.1° at a

line frequency of 60 Hz (0x3C represents −4 because the register is

centered with 0 at 0x40).

2

(t) = V

V

Figure 59. RMS Signal Processing

The I_rmssignal can be read from the waveform register by setting

the WAVMODE register (0x0D) and setting the WFSM bit in

the Interrupt Enable 3 SFR (MIRQENH, 0xDB). Like the

current and voltage channels waveform sampling modes, the

waveform data is available at sample rates of 25.6 kSPS,

12.8 kSPS, 6.4 kSPS, or 3.2 kSPS.

It is important to note that when the current input is larger than

40% of full scale, the I_rmswaveform sample register does not

represent the true processed rms value. The rms value processed

with this level of input is larger than the 24-bit read by the wave-

form register, making the value read truncated on the high end.

I

HPF

PA

24

PGA1

ADC 1

I

N

LPF2

24

V

P

CHANNEL 2 DELAY

REDUCED BY 4.48µs

(0.1°LEAD AT 60Hz)

0x0B IN PHCAL[7:0]

1

DELAY BLOCK

1.22µs/LSB

PGA2

V

ADC 2

0.1°

V

N

7

1

0

V

I

0

0 1 0 1 1 1

PHCAL[7:0]

–231.93µs TO +48.83µs

I

60Hz

Figure 58. Phase Calibration

Rev. A | Page 55 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Current Channel RMS Calculation

4, 8, or 16. The current rms measurement provided in the

ADE7566/ADE7569/ADE7166/ADE7169 is accurate to within

0.5% for signal inputs between full scale and full scale/500. The

conversion from the register value to amps must be done

externally in the microprocessor using an amps/LSB constant.

Each ADE7566/ADE7569/ADE7166/ADE7169 simultaneously

calculates the rms values for the current and voltage channels in

different registers. Figure 61 shows the detail of the signal

processing chain for the rms calculation on the current channel.

The current channel rms value is processed from the samples

used in the current channel waveform sampling mode and is

stored in an unsigned 24-bit register (I_rms). One LSB of the

current channel rms register is equivalent to one LSB of a

current channel waveform sample.

Current Channel RMS Offset Compensation

The ADE7566/ADE7569/ADE7166/ADE7169 incorporate a

current channel rms offset compensation register (IRMSOS).

This is a 12-bit signed register that can be used to remove offset

in the current channel rms calculation. An offset can exist in

the rms calculation due to input noises that are integrated into

the dc component of V²(t).

The update rate of the current channel rms measurement is

4.096 MHz/5. To minimize noise in the reading of the register,

the I_rmsregister can also be configured to update only with the

zero crossing of the voltage input. This configuration is done by

setting the ZXRMS bit in the MODE2 register (0x0C).

One LSB of the current channel rms offset is equivalent to

16,384 LSBs of the square of the current channel rms register.

Assuming that the maximum value from the current channel

rms calculation is 0d1,898,124 with full-scale ac inputs, then

1 LSB of the current channel rms offset represents 0.23% of

measurement error at −60 dB down of full scale.

With the specified full-scale analog input signal different PGA1

values, the ADC produces an output code that is approximately

0d2,147,483 (PGA1 = 1) or 0d2,684,354 (PGA1 = 2, 4, 8, or 16).

See the Current Channel ADC section. Similarly, the equivalent

rms value of a full-scale ac signal is 0d1,518,499 (0x172BA3)

when PGA = 1 and 0d1,898,124 (0x1CF68C) when PGA1 = 2,

2

I_rms

=

I_rms+ IRMSOS ×32768

(6)

0

where I_rms0is the rms measurement without offset correction.

CURRENT CHANNEL

WAVEFORM

60Hz

DATA RANGE WITH

INTEGRATOR ON (60Hz)

0x2B7850

0x000000

0xD487B0

IRMSOS[11:0]

I

(t)

rms

MODE 1[5]

25 26 27

18 17 16

2 2

sgn 2

LPF3

2

HPF

I

0x00

DIGITAL

PA

INTEGRATOR*

HPF1

24

+

24

I

[23:0]

rms

dt

I

PB

CURRENT CHANNEL

WAVEFORM

DATA RANGE WITH

INTEGRATOR OFF

0x28F5C2

0x000000

0xD70A3E

Figure 60. ADE7566/ ADE7569 Current Channel RMS Signal Processing with PGA1 = 1, 2, 4, 8, or 16

Rev. A | Page 56 of 144

ADE7566/ADE7569/ADE7166/ADE7169

CURRENT CHANNEL

WAVEFORM

60Hz

DATA RANGE WITH

INTEGRATOR ON (60Hz)

0x2B7850

0x000000

0xD487B0

IRMSOS[11:0]

I

(t)

rms

MODE 1[5]

25 26 27

18 17 16

2 2

sgn 2

LPF3

2

HPF

I

0x00

DIGITAL

PA

INTEGRATOR*

HPF1

24

+

24

I

[23:0]

rms

dt

I

PB

CURRENT CHANNEL

WAVEFORM

DATA RANGE WITH

INTEGRATOR OFF

IBGAIN

0x28F5C2

0x000000

0xD70A3E

Figure 61. ADE7166/ ADE7169 Current Channel RMS Signal Processing with PGA1 = 2, 4, 8, or 16

VOLTAGE SIGNAL (V(t))

VRMOS[11:0]

0x28F5

0x0

16 15

sgn 2

8

7

6

2

V

[23:0]

rms

0xD70B

0x28F5C2

0x00

LPF3

LPF1

+

VOLTAGE CHANNEL

Figure 62. Voltage Channel RMS Signal Processing

Rev. A | Page 57 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Voltage Channel RMS Calculation

The average power over an integral number of line cycles (n) is

given by the expression in Equation 11.

Figure 62 shows details of the signal processing chain for the

rms calculation on the voltage channel. The voltage channel

rms value is processed from the samples used in the voltage

channel waveform sampling mode and is stored in the unsigned

24-bit V_rmsregister.

1

nT

P =

^nTp(t)dt = VI

(11)

∫

0

where:

T is the line cycle period.

The update rate of the voltage channel rms measurement is

MCLK/5. To minimize noise in the reading of the register, the

V_rmsregister can also be configured to update only with the zero

crossing of the voltage input. This configuration is done by

setting the ZXRMS bit in the MODE2 register (0x0C).

P is referred to as the active or real power.

Note that the active power is equal to the dc component of the

instantaneous power signal p(t) in Equation 11, that is, VI. This

is the relationship used to calculate active power in the ADE7566/

ADE7569/ADE7166/ADE7169. The instantaneous power signal

p(t) is generated by multiplying the current and voltage signals. The

dc component of the instantaneous power signal is then extracted

by LPF2 (low-pass filter) to obtain the active power information.

This process is illustrated in Figure 63.

With the specified full-scale ac analog input signal of 0.4 V, the

output from the LPF1 in Figure 62 swings between 0x28F5 and

0xD70B at 60 Hz (see the Voltage Channel ADC section). The

equivalent rms value of this full-scale ac signal is approximately

0d1,898,124 (0x1CF68C) in the V_rmsregister. The voltage rms

measurement provided in the ADE7566/ADE7569/ADE7166/

ADE7169 is accurate to within 0.5% for signal input between

full scale and full scale/20. The conversion from the register

value to volts must be done externally in the microprocessor

using a V/LSB constant.

INSTANTANEOUS

POWER SIGNAL

p(t) = v × i – v × i × cos(2ωt)

0x19999A

ACTIVE REAL POWER

SIGNAL = v × i

VI

0xCCCCD

Voltage Channel RMS Offset Compensation

The ADE7566/ADE7569/ADE7166/ADE7169 incorporate a

voltage channel rms offset compensation register (VRMSOS).

This is a 12-bit signed register that can be used to remove offset

in the voltage channel rms calculation. An offset can exist in the

rms calculation due to input noises and dc offset in the input

samples. One LSB of the voltage channel rms offset is equivalent

to 64 LSBs of the rms register. Assuming that the maximum

value from the voltage channel rms calculation is 0d1,898,124

with full-scale ac inputs, then 1 LSB of the voltage channel rms

offset represents 3.37% of measurement error at −60 dB down

of full scale.

0x00000

CURRENT

i(t) = √2 × i × sin(ωt)

VOLTAGE

v(t) = √2 × v × sin(ωt)

Figure 63. Active Power Calculation

Because LPF2 does not have an ideal brick wall frequency

response (see Figure 64), the active power signal has some

ripple due to the instantaneous power signal. This ripple is

sinusoidal and has a frequency equal to twice the line frequency.

Because of its sinusoidal nature, the ripple is removed when the

active power signal is integrated to calculate energy (see the

Active Energy Calculation section).

V_rms= V_rms0+ 64 × VRMSOS

(7)

where V_rms0is the rms measurement without offset correction.

ACTIVE POWER CALCULATION

0

Active power is defined as the rate of energy flow from source

to load. It is the product of the voltage and current waveforms.

The resulting waveform is called the instantaneous power signal

and is equal to the rate of energy flow at every instant of time.

The unit of power is the watt or joules/second. Equation 10 gives an

expression for the instantaneous power signal in an ac system.

–4

–8

–12

–16

–20

v

(

t

)

= 2 ×V sin(ωt)

(8)

(9)

i t = 2 × I sin(ωt)

( )

where:

v is the rms voltage.

i is the rms current.

–24

1

3

10

30

100

FREQUENCY (Hz)

p(t) = v(t)×i(t)

Figure 64. Frequency Response of LPF2

p(t) = VI −VI cos(2ωt)

(10)

Rev. A | Page 58 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Active Power Gain Calibration

Active Power Sign Detection

Figure 65 shows the signal processing chain for the active power

calculation in the ADE7566/ADE7569/ADE7166/ADE7169. As

explained previously, the active power is calculated by filtering

the output of the multiplier with a low-pass filter. Note that

when reading the waveform samples from the output of LPF2,

the gain of the active energy can be adjusted by using the

multiplier and watt gain register (WGAIN[11:0]). The gain is

adjusted by writing a twos complement 12-bit word to the watt

gain register. Equation 12 shows how the gain adjustment is

related to the contents of the watt gain register.

The ADE7566/ADE7569/ADE7166/ADE7169 detect a change

of sign in the active power. The APSIGN flag in the Interrupt

Status 1 SFR (MIRQSTL, 0xDC) records when a change of sign

has occurred according to Bit APSIGN in the ACCMODE

register (0x0F). If the APSIGN flag is set in the Interrupt Enable

1 SFR (MIRQENL, 0xD9), the 8052 core has a pending ADE

interrupt. The ADE interrupt stays active until the APSIGN

status bit is cleared (see the Energy Measurement Interrupts

section).

When APSIGN in the ACCMODE register (0x0F) is cleared

(default), the APSIGN flag in the Interrupt Status 1 SFR

(MIRQSTL, 0xDC) is set when a transition from positive–to-

negative active power has occurred.

⎛

⎞

WGAIN

2¹²

⎧

⎫

⎬

⎭

⎜

⎟

Output WGAIN = Active Power × 1+

(12)

⎨

⎜

⎩

⎝

⎠

For example, when 0x7FF is written to the watt gain register, the

power output is scaled up by 50% (0x7FF = 2047d, 2047/2¹²= 0.5).

Similarly, 0x800 = −2048d (signed, twos complement) and

power output is scaled by –50%. Each LSB scales the power

output by 0.0244%. The minimum output range is given when

the watt gain register contents are equal to 0x800 and the

maximum range is given by writing 0x7FF to the watt gain

register. This can be used to calibrate the active power (or

energy) calculation in the ADE7566/ADE7569/ADE7166/

ADE7169.

When APSIGN in the ACCMODE register (0x0F) is set, the

APSIGN flag in the MIRQSTL SFR is set when a transition

from negative to positive active power occurrs.

Active Power No-Load Detection

The ADE7566/ADE7569/ADE7166/ADE7169 include a no-

load threshold feature on the active energy that eliminates any

creep effects in the meter. The part accomplishes this by not

accumulating energy if the multiplier output is below the no-

load threshold. When the active power is below the no-load

threshold, the APNOLOAD flag in the Interrupt Status 1 SFR

(MIRQSTL, 0xDC) is set. If the APNOLOAD bit is set in the

Interrupt Enable 1 SFR (MIRQENL, 0xD9), the 8052 core has a

pending ADE interrupt. The ADE interrupt stays active until

the APNOLOAD status bit is cleared (see the Energy

Measurement Interrupts section).

Active Power Offset Calibration

The ADE7566/ADE7569/ADE7166/ADE7169 also incorporate

an active power offset register (WATTOS[15:0]). It is a signed,

twos complement, 16-bit register that can be used to remove

offsets in the active power calculation (see Figure 63). An offset

can exist in the power calculation due to crosstalk between

channels on the PCB or in the IC itself. The offset calibration

allows the contents of the active power register to be maintained

at 0 when no power is being consumed.

The no-load threshold level is selectable by setting the

APNOLOAD bits in the NLMODE register (0x0E). Setting

these bits to 0b00 disables the no-load detection, and setting

them to 0b01, 0b10, or 0b11 sets the no-load detection

threshold to 0.015%, 0.0075%, or 0.0037% of the multiplier’s

full-scale output frequency, respectively. The IEC 62053-21

specification states that the meter must start up with a load

equal to or less than 0.4% I_PB, which translates to .0167% of the

full-scale output frequency of the multiplier.

The 256 LSBs (WATTOS = 0x0100) written to the active power

offset register are equivalent to 1 LSB in the waveform sample

register. Assuming the average value, output from LPF2 is

0xCCCCD (838,861d) when inputs on the voltage and current

channels are both at full scale. At −60 dB down on the current

channel (1/1000 of the current channel full-scale input), the

average word value output from LPF2 is 838.861 (838,861/1,000).

One LSB in the LPF2 output has a measurement error of

1/838.861 × 100% = 0.119% of the average value. The active

power offset register has a resolution equal to 1/256 LSB of the

waveform register. Therefore, the power offset correction

resolution is 0.000464%/LSB (0.119%/256) at −60 dB.

Rev. A | Page 59 of 144

ADE7566/ADE7569/ADE7166/ADE7169

integration or accumulation. The active power signal in the

waveform register is continuously added to the internal active

energy register.

ACTIVE ENERGY CALCULATION

As stated in the Active Power Calculation section, power is

defined as the rate of energy flow. This relationship can be

expressed mathematically in Equation 13.

The active energy accumulation depends on the setting of the

POAM and ABSAM bits in the ACCMODE register (0x0F).

When both bits are cleared, the addition is signed and, therefore,

negative energy is subtracted from the active energy contents.

When both bits are set, the ADE7566/ADE7569/ADE7166/

ADE7169 are set to be in the more restrictive mode, the positive-

only accumulation mode.

dE

P =

(13)

dt

where:

P is power.

E is energy.

Conversely, energy is given as the integral of power.

When POAM in the ACCMODE register (0x0F) is set, only

positive power contributes to the active energy accumulation.

When ABSAM in the ACCMODE register (0x0F) is set, the

absolute active power is used for the active energy accumulation

(see the Watt Absolute Accumulation Mode section).

E = P(t)dt

(14)

∫

The ADE7566/ADE7569/ADE7166/ADE7169 achieve the

integration of the active power signal by continuously accumu-

lating the active power signal in an internal, nonreadable, 49-bit

energy register. The register (WATTHR[23:0]) represents the

upper 24 bits of this internal register. This discrete time

accumulation or summation is equivalent to integration in

continuous time. Equation 15 expresses the relationship.

The output of the multiplier is divided by the value in the

WDIV register. If the value in the WDIV register is equal to 0,

the internal active energy register is divided by 1. WDIV is an

8-bit unsigned register. After dividing by WDIV, the active

energy is accumulated in a 49-bit internal energy accumulation

register. The upper 24 bits of this register are accessible through

a read to the active energy register (WATTHR[23:0]). A read to

the RWATTHR register returns the content of the WATTHR

register, and the upper 24 bits of the internal register are cleared.

As shown in Figure 65, the active power signal is accumulated

in an internal 49-bit signed register. The active power signal can

be read from the waveform register by setting the WAVMODE

register (0x0D) and setting the WFSM bit in the Interrupt Enable 3

SFR (MIRQENH, 0xDB). Like the current and voltage channels

waveform sampling modes, the waveform data is available at

sample rates of 25.6 kSPS, 12.8 kSPS, 6.4 kSPS, or 3.2 kSPS.

∞

⎧

⎨

⎩

⎫

⎬

⎭

(15)

E = p(t)dt = lim

p(nT)×T

∑

∫

t→0

n=1

where:

n is the discrete time sample number.

T is the sample period.

The discrete time sample period (T) for the accumulation

register in the ADE7566/ADE7569/ADE7166/ADE7169 is 1.22 μs

(5/MCLK). In addition to calculating the energy, this

integration removes any sinusoidal components that may be in

the active power signal. Figure 65 shows this discrete time

UPPER 24 BITS ARE

ACCESSIBLE THROUGH

WATTHR[23:0] REGISTER

FOR WAVEFORM

SAMPLING

WATTHR[23:0]

23

0

WATTOS[15:0]

6

5

–6 –7 –8

2 2 2

sgn

2

WDIV[7:0]

CURRENT

CHANNEL

LPF2

48

0

+

%

+

VOLTAGE

CHANNEL

WGAIN[11:0]

OUTPUTS FROM THE LPF2 ARE

ACCUMULATED (INTEGRATED) IN

ACTIVE POWER

SIGNAL

THE INTERNAL ACTIVE ENERGY REGISTER

TO

DIGITAL-TO-FREQUENCY

CONVERTER

5

T

CLKIN

WAVEFORM

REGISTER

VALUES

TIME (nT)

Figure 65. Active Energy Calculation

Rev. A | Page 60 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Figure 66 shows this energy accumulation for full-scale signals

(sinusoidal) on the analog inputs. The three displayed curves

illustrate the minimum period of time it takes the energy register

to roll over when the active power gain register contents are

0x7FF, 0x000, and 0x800. The watt gain register is used to carry

out power calibration in the ADE7566/ADE7569/ADE7166/

ADE7169. As shown, the fastest integration time occurs when

the watt gain register is set to maximum full scale, that is,

0x7FF.

When WDIV is set to a value other than 0, the integration time

varies, as shown in Equation 17.

Time = Time_{WDIV = 0}× WDIV

(17)

Active Energy Accumulation Modes

Watt Signed Accumulation Mode

The ADE7566/ADE7569/ADE7166/ADE7169 active energy

default accumulation mode is a watt-signed accumulation based

on the active power information.

WATTHR[23:0]

Watt Positive-Only Accumulation Mode

0x7F,FFFF

WGAIN = 0x7FF

The ADE7566/ADE7569/ADE7166/ADE7169 are placed in

watt positive-only accumulation mode by setting the POAM bit

in the ACCMODE register (0x0F). In this mode, the energy

accumulation is only done for positive power, ignoring any

occurrence of negative power above or below the no-load

threshold (see Figure 67). The CF pulse also reflects this

accumulation method when in this mode. The default setting

for this mode is off. Detection of the transitions in the direction

of power flow and detection of no-load threshold are active in

this mode.

WGAIN = 0x000

WGAIN = 0x800

0x3F,FFFF

0x00,0000

0x40,0000

TIME (Minutes)

13.7

3.41

6.82

10.2

0x80,0000

Figure 66. Energy Register Rollover Time for Full-Scale Power

(Minimum and Maximum Power Gain)

Note that the energy register contents roll over to full-scale

negative (0x800000) and continue to increase in value when the

power or energy flow is positive (see Figure 66). Conversely, if

the power is negative, the energy register underflows to full-

scale positive (0x7FFFFF) and continues to decrease in value.

ACTIVE ENERGY

NO-LOAD

THRESHOLD

By using the interrupt enable register, the ADE7566/ADE7569/

ADE7166/ADE7169can be configured to issue an ADE

interrupt to the 8052 core when the active energy register is half

full (positive or negative) or when an overflow or underflow

occurs.

ACTIVE POWER

NO-LOAD

THRESHOLD

APSIGN FLAG

Integration Time Under Steady Load: Active Energy

POS NEG POS

As mentioned in the Active Energy Calculation section, the

discrete time sample period (T) for the accumulation register is

1.22 μs (5/CLKIN). With full-scale sinusoidal signals on the

analog inputs and the WGAIN register set to 0x000, the average

word value from each LPF2 is 0xCCCCD (see Figure 63). The

maximum positive value that can be stored in the internal 49-

bit register is 2⁴⁸(or 0xFFFF,FFFF,FFFF) before it overflows. The

integration time under these conditions when WDIV = 0 is

calculated in the following equation:

INTERRUPT STATUS REGISTERS

Figure 67. Energy Accumulation in Positive-Only Accumulation Mode

Watt Absolute Accumulation Mode

The ADE7566/ADE7569/ADE7166/ADE7169 are placed in

watt-absolute accumulation mode by setting the ABSAM bit in

the ACCMODE register (0x0F). In this mode, the energy

accumulation is done using the absolute active power, ignoring

any occurrence of power below the no-load threshold (see

Figure 68). The CF pulse also reflects this accumulation method

when in this mode. The default setting for this mode is off.

Detection of the transitions in the direction of power flow, and

detection of no-load threshold are active in this mode.

Time =

0 xFFFF, FFFF, FFFF

×1.22 μs = 409.6sec = 6.82 min (16)

0 xCCCCD

Rev. A | Page 61 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Line Cycle Active Energy Accumulation Mode

In line cycle active energy accumulation mode, the energy accumu-

lation of the ADE7566/ADE7569/ADE7166/ADE7169 can be

synchronized to the voltage channel zero crossing so that active

energy can be accumulated over an integral number of half-line

cycles. The advantage of summing the active energy over an

integer number of line cycles is that the sinusoidal component in

the active energy is reduced to 0. This eliminates any ripple in the

energy calculation. Energy is calculated more accurately and

more quickly because the integration period can be shortened.

By using this mode, the energy calibration can be greatly

simplified, and the time required to calibrate the meter can be

significantly reduced.

ACTIVE ENERGY

NO-LOAD

THRESHOLD

ACTIVE POWER

NO-LOAD

THRESHOLD

In the line cycle active energy accumulation mode, the

ADE7566/ADE7569/ADE7166/ADE7169 accumulate the active

power signal in the LWATTHR register for an integral number of

line cycles, as shown in Figure 69. The number of half-line cycles is

specified in the LINCYC register.

APSIGN FLAG

APNOLOAD

POS

NEG POS

APNOLOAD

INTERRUPT STATUS REGISTERS

Figure 68. Energy Accumulation in Absolute Accumulation Mode

The ADE7566/ADE7569/ADE7166/ADE7169 can accumulate

active power for up to 65,535 half-line cycles. Because the active

power is integrated on an integral number of line cycles, the

CYCEND flag in the Interrupt Status 3 SFR (MIRQSTH, 0xDE) is

set at the end of an active energy accumulation line cycle. If the

CYCEND enable bit in the Interrupt Enable 3 SFR (MIRQENH,

0xDB) is set, the 8052 core has a pending ADE interrupt. The

ADE interrupt stays active until the CYCEND status bit is

cleared (see the Energy Measurement Interrupts section).

Another calibration cycle starts as soon as the CYCEND flag is

set. If the LWATTHR register is not read before a new CYCEND

flag is set, the LWATTHR register is overwritten by a new value.

Active Energy Pulse Output

All of the ADE7566/ADE7569/ADE7166/ADE7169 circuitry has a

pulse output whose frequency is proportional to active power

(see the Active Power Calculation section). This pulse

frequency output uses the calibrated signal from the WGAIN

register output, and its behavior is consistent with the setting of

the active energy accumulation mode in the ACCMODE

register (0x0F). The pulse output is active low and should be

preferably connected to an LED as shown in Figure 79.

TO

DIGITAL-TO-FREQUENCY

CONVERTER

WGAIN[11:0]

48

0

+

OUTPUT

FROM

LPF2

+

%

WATTOS[15:0]

WDIV[7:0]

ACTIVE ENERGY

IS ACCUMULATED IN

THE INTERNAL REGISTER,

AND THE LWATTHR

REGISTER IS UPDATED

AT THE END OF THE LINCYC

HALF-LINE CYCLES

23

0

LPF1

LWATTHR[23:0]

FROM VOLTAGE

CHANNEL

ADC

ZERO-CROSSING

DETECTION

CALIBRATION

CONTROL

LINCYC[15:0]

Figure 69. Line Cycle Active Energy Accumulation

Rev. A | Page 62 of 144

ADE7566/ADE7569/ADE7166/ADE7169

When a new half-line cycle is written in the LINCYC register,

the LWATTHR register is reset, and a new accumulation starts

at the next zero crossing. The number of half-line cycles is then

counted until LINCYC is reached. This implementation provides a

valid measurement at the first CYCEND interrupt after writing

to the LINCYC register (see Figure 70). The line active energy

accumulation uses the same signal path as the active energy

accumulation. The LSB size of these two registers is equivalent.

v(t) = 2 V sin(ωt +θ)

i(t) = 2 I sin(ωt)

(21)

π

2

⎛

⎝

⎞

⎟

⎠

′

i (t) = 2 I sin ωt +

(22)

⎜

where:

θ is the phase difference between the voltage and current channel.

v is the rms voltage.

i is the rms current.

LWATTHR REGISTER

CYCEND IRQ

q(t) = v(t) × i’(t)

(23)

q(t) = VI sin (θ) + VI sin (2ωt + θ)

The average reactive power over an integral number of lines (n)

is given in Equation 24.

LINCYC

VALUE

nT

1

nT

Q =

q(t)dt = VI sin(θ)

(24)

∫

0

Figure 70. Energy Accumulation When LINCYC Changes

where:

From the information in Equation 10 and Equation 11,

T is the line cycle period.

q is referred to as the reactive power.

⎧

⎪

⎨

⎪

⎩

⎫

⎪

⎬

⎪

⎭

nT

VI

Note that the reactive power is equal to the dc component of

the instantaneous reactive power signal q(t) in Equation 23.

E

(

t

)

=

VIdt −

cos

(

2πft dt

)

(18)

∫

2

0

f

⎛

⎜

⎞

⎟

1+

The instantaneous reactive power signal q(t) is generated by

8.9

⎝

⎠

multiplying the voltage and current channels. In this case, the

phase of the current channel is shifted by 90°. The dc component of

the instantaneous reactive power signal is then extracted by a

low-pass filter to obtain the reactive power information (see

Figure 71).

where:

n is an integer.

T is the line cycle period.

Because the sinusoidal component is integrated over an integer

number of line cycles, its value is always 0. Therefore,

In addition, the phase-shifting filter has a non-unity magnitude

response. Because the phase-shifted filter has a large attenuation

at high frequency, the reactive power is primarily for calculation

at line frequency. The effect of harmonics is largely ignored in

the reactive power calculation. Note that, because of the magnitude

characteristic of the phase shifting filter, the weight of the

reactive power is slightly different from the active power

calculation (see the Energy Register Scaling section).

nT

E = VIdt + 0

(19)

(20)

∫

0

E(t) = VInT

Note that in this mode, the 16-bit LINCYC register can hold

a maximum value of 65,535. In other words, the line energy

accumulation mode can be used to accumulate active energy

for a maximum duration of over 65,535 half-line cycles. At a

60 Hz line frequency, it translates to a total duration of

65,535/120 Hz = 546 sec.

The frequency response of the LPF in the reactive signal path is

identical to the one used for LPF2 in the average active power

calculation. Because LPF2 does not have an ideal brick wall

frequency response (see Figure 64), the reactive power signal

has some ripple due to the instantaneous reactive power signal.

This ripple is sinusoidal and has a frequency equal to twice the

line frequency. Because the ripple is sinusoidal in nature, it is

removed when the reactive power signal is integrated to

calculate energy.

REACTIVE POWER CALCULATION FOR THE

ADE7569/ADE7169

Reactive power, a function available for the ADE7569/ADE7169

but not for the ADE7566/ADE7166, is defined as the product of

the voltage and current waveforms when one of these signals is

phase-shifted by 90°. The resulting waveform is called the

instantaneous reactive power signal. Equation 23 gives an

expression for the instantaneous reactive power signal in an ac

system when the phase of the current channel is shifted by 90°.

The reactive power signal can be read from the waveform

register by setting the WAVMODE register (0x0D) and the

WFSM bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB).

Like the current and voltage channels waveform sampling modes,

the waveform data is available at sample rates of 25.6 kSPS, 12.8

kSPS, 6.4 kSPS, or 3.2 kSPS.

Rev. A | Page 63 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Reactive Power Gain Calibration

(MIRQENL, 0xD9), the 8052 core has a pending ADE interrupt.

The ADE interrupt stays active until the VARSIGN status bit is

cleared (see the Energy Measurement Interrupts section).

Figure 71 shows the signal processing chain for the

ADE7569/ADE7169 reactive power calculation. As explained in

the Reactive Power Calculation for the ADE7569/ADE7169

section, the reactive power is calculated by applying a low-pass

filter to the instantaneous reactive power signal. Note that,

when reading the waveform samples from the output of LPF2,

the gain of the reactive energy can be adjusted by using the

multiplier and by writing a twos complement, 12-bit word to

the VAR gain register (VARGAIN[11:0]). Equation 25 shows

how the gain adjustment is related to the contents of the watt

gain register.

When VARSIGN in the ACCMODE register (0x0F) is cleared

(default), the VARSIGN flag in the Interrupt Status 1 SFR

(MIRQSTL, 0xDC) is set when a transition from positive to

negative reactive power occurrs.

When VARSIGN in the ACCMODE register (0x0F) is set, the

VARSIGN flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC)

is set when a transition from negative to positive reactive power

occurrs.

Reactive Power No-Load Detection

Output VARGAIN =

The ADE7569/ADE7169 include a no-load threshold feature on

the reactive energy that eliminates any creep effects in the

meter. The ADE7569/ADE7169 accomplish this by not

accumulating reactive energy when the multiplier output is

below the no-load threshold. When the reactive power is below

the no-load threshold, the RNOLOAD flag in the Interrupt Status

1 SFR (MIRQSTL, 0xDC) is set. If the RNOLOAD bit is set in the

Interrupt Enable 1 SFR (MIRQENL, 0xD9), the 8052 core has a

pending ADE interrupt. The ADE interrupt stays active until the

RNOLOAD status bit is cleared (see the Energy Measurement

Interrupts section).

VARGAIN

⎛

⎜

⎞

⎟

⎧

⎩

⎫

⎬

⎭

Reactive Power× 1+

(25)

⎨

2¹²

⎝

⎠

The resolution of the VARGAIN register is the same as the

WGAIN register (see the Active Power Gain Calibration

section). VARGAIN can be used to calibrate the reactive

power (or energy) calculation in the ADE7569/ADE7169.

Reactive Power Offset Calibration

The ADE7569/ADE7169 also incorporate a reactive power

offset register (VAROS[15:0]). This is a signed, twos complement,

16-bit register that can be used to remove offsets in the reactive

power calculation (see Figure 71). An offset can exist in the

reactive power calculation due to crosstalk between channels on

the PCB or in the IC itself. The offset calibration allows the

contents of the reactive power register to be maintained at 0

when no power is being consumed.

The no-load threshold level is selectable by setting the

VARNOLOAD bits in the NLMODE register (0x0E).

Setting these bits to 0b00 disables the no-load detection,

and setting them to 0b01, 0b10, or 0b11 sets the no-load

detection threshold to 0.015%, 0.0075%, and 0.0037% of

the full-scale output frequency of the multiplier, respectively.

The 256 LSBs (VAROS = 0x100) written to the reactive power

offset register are equivalent to 1 LSB in the WAVMODE register.

REACTIVE ENERGY CALCULATION FOR THE

ADE7569/ADE7169

Sign of Reactive Power Calculation

As for active energy, the ADE7569/ADE7169 achieve the

integration of the reactive power signal by continuously

accumulating the reactive power signal in an internal, nonreadable,

49-bit energy register. The reactive energy register (VARHR[23:0])

represents the upper 24 bits of this internal register. The

VARHR register and its function are available for the

ADE7569/ADE7169 but not for the ADE7566/ADE7166.

Note that the average reactive power is a signed calculation.

The phase shift filter has −90° phase shift when the integrator

is enabled, and +90° phase shift when the integrator is disabled.

Table 45 summarizes the relationship of the phase difference

between the voltage and the current and the sign of the resulting

VAR calculation.

Table 45. Sign of Reactive Power Calculation

The discrete time sample period (T) for the accumulation register

in the ADE7569/ADE7169 is 1.22 μs (5/MCLK). As well as

calculating the energy, this integration removes any sinusoidal

components that may be in the active power signal. Figure 71

shows this discrete time integration or accumulation. The

reactive power signal in the waveform register is continuously

added to the internal reactive energy register.

Angle

Integrator

Sign

Off

On

Positive

Negative

Positive

Negative

Between 0° to +90°

Between –90° to 0°

Between 0° to +90°

Between –90° to 0°

Reactive Power Sign Detection

The reactive energy accumulation depends on the setting of the

SAVARM and ABSVARM bits in the ACCMODE register (0x0F).

When both bits are cleared, the addition is signed and, therefore,

negative energy is subtracted from the reactive energy contents.

When both bits are set, the ADE7569/ADE7169 are set to be in

the more restrictive mode, the absolute accumulation mode.

The ADE7569/ADE7169 detect a change of sign in the reactive

power. The VARSIGN flag in the Interrupt Status 1 SFR

(MIRQSTL, 0xDC) records when a change of sign has occurred

according to the VARSIGN bit in the ACCMODE register

(0x0F). If the VARSIGN bit is set in the Interrupt Enable 1 SFR

Rev. A | Page 64 of 144

ADE7566/ADE7569/ADE7166/ADE7169

When SAVARM in the ACCMODE register (0x0F) is set, the

reactive power is accumulated depending on the sign of the

active power. When active power is positive, the reactive power

is added as it is to the reactive energy register. When active

power is negative, the reactive power is subtracted from the

reactive energy accumulator (see the VAR Antitamper

Accumulation Mode section).

As shown in Figure 71, the reactive power signal is accumulated

in an internal 49-bit signed register. The reactive power signal

can be read from the waveform register by setting the WAVMODE

register (0x0D) and setting the WFSM bit in the Interrupt Enable 3

SFR (MIRQENH, 0xDB). Like the current and voltage channel

waveform sampling modes, the waveform data is available at

sample rates of 25.6 kSPS, 12.8 kSPS, 6.4 kSPS, or 3.2 kSPS.

When ABSVARM in the ACCMODE register (0x0F) is set, the

absolute reactive power is used for the reactive energy accumu-

lation (see the VAR Absolute Accumulation Mode section).

Figure 66 shows this energy accumulation for full-scale signals

(sinusoidal) on the analog inputs. These curves also apply for

the reactive energy accumulation.

The output of the multiplier is divided by VARDIV. If the value

in the VARDIV register is equal to 0, the internal reactive

energy register is divided by 1. VARDIV is an 8-bit, unsigned

register. After dividing by VARDIV, the reactive energy is

accumulated in a 49-bit internal energy accumulation register.

The upper 24 bits of this register are accessible through a read

to the reactive energy register (VARHR[23:0]). A read to the

RVARHR register returns the content of the VARHR register,

and the upper 24 bits of the internal register are cleared.

Note that the energy register contents roll over to full-scale

negative (0x800000) and continue to increase in value when the

power or energy flow is positive. Conversely, if the power is

negative, the energy register underflows to full-scale positive

(0x7FFFFF) and continues to decrease in value.

By using the interrupt enable register, the ADE7569/ADE7169

can be configured to issue an ADE interrupt to the 8052 core

when the reactive energy register is half-full (positive or

negative) or when an overflow or underflow occurs.

UPPER 24 BITS ARE

ACCESSIBLE THROUGH

VARHR[23:0] REGISTER

FOR WAVEFORM

SAMPLING

VARHR[23:0]

23

0

VAROS[15:0]

90° PHASE

SHIFTING FILTER

HPF

CURRENT

CHANNEL

6

5

–6 –7 –8

2 2 2

sgn

2

VARDIV[7:0]

Π

2

LPF2

48

0

+

%

+

VOLTAGE

CHANNEL

PHCAL[7:0]

VARGAIN[11:0]

OUTPUTS FROM THE LPF2 ARE

ACCUMULATED (INTEGRATED) IN

THE INTERNAL REACTIVE ENERGY

REGISTER

REACTIVE POWER

SIGNAL

TO

DIGITAL-TO-FREQUENCY

CONVERTER

5

T

CLKIN

WAVEFORM

REGISTER

VALUES

TIME (nT)

Figure 71. Reactive Energy Calculation

Rev. A | Page 65 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Integration Time Under Steady Load: Reactive Energy

As mentioned in the Active Energy Calculation section, the

discrete time sample period (T) for the accumulation register is

1.22 μs (5/MCLK). With full-scale sinusoidal signals on the

analog inputs and the VARGAIN and VARDIV registers set to

0x000, the integration time before the reactive energy register

overflows is calculated in Equation 26.

REACTIVE ENERGY

Time =

0xFFFF, FFFF, FFFF

NO-LOAD

THRESHOLD

×1.22 μs = 409.6 sec = 6.82 min (26)

0xCCCCD

REACTIVE POWER

When VARDIV is set to a value different from 0, the integration

time varies, as shown in Equation 27.

NO-LOAD

THRESHOLD

Time = Time_{WDIV =0}×VARDIV

(27)

Reactive Energy Accumulation Modes

VAR Signe d Accumu lation Mo de

NO-LOAD

THRESHOLD

The ADE7569/ADE7169 reactive energy default accumulation

mode is a signed accumulation based on the reactive power

information.

ACTIVE POWER

NO-LOAD

THRESHOLD

VAR Antitamper Accumulation Mode

The ADE7569/ADE7169 are placed in VAR antitamper

accumulation mode by setting the SAVARM bit in the ACCMODE

register (0x0F). In this mode, the reactive power is accumulated

depending on the sign of the active power. When active power

is positive, the reactive power is added as it is to the reactive

energy register. When active power is negative, the reactive

power is subtracted from the reactive energy accumulator (see

Figure 72). The CF pulse also reflects this accumulation method

when in this mode. The default setting for this mode is off.

Transitions in the direction of power flow and no-load threshold

are active in this mode.

APSIGN FLAG

POS

NEG

POS

INTERRUPT STATUS REGISTERS

Figure 72. Reactive Energy Accumulation in

Antitamper Accumulation Mode

Rev. A | Page 66 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Line Cycle Reactive Energy Accumulation Mode

VAR Absolute Accumulation Mode

In line cycle reactive energy accumulation mode, the energy

accumulation of the ADE7569/ADE7169 can be synchronized

to the voltage channel zero crossing so that reactive energy can

be accumulated over an integral number of half-line cycles. The

advantage of this mode is similar to the ones described in the

Line Cycle Active Energy Accumulation Mode section.

The ADE7569/ADE7169 are placed in absolute accumulation

mode by setting the ABSVARM bit in the ACCMODE register

(0x0F). In absolute accumulation mode, the reactive energy

accumulation is done by using the absolute reactive power and

ignoring any occurrence of power below the no-load threshold for

the active energy (see Figure 68). The CF pulse also reflects this

accumulation method when in the absolute accumulation mode.

The default setting for this mode is off. Transitions in the direction

of power flow and no-load threshold are active in this mode.

In line cycle active energy accumulation mode, the

ADE7569/ADE7169 accumulate the reactive power signal in

the LVARHR register for an integral number of line cycles, as

shown in Figure 74. The number of half-line cycles is specified

in the LINCYC register. The ADE7569/ADE7169 can

accumulate active power for up to 65,535 half-line cycles.

Because the reactive power is integrated on an integral number

of line cycles, the CYCEND flag in the Interrupt Status 3 SFR

(MIRQSTH, 0xDE) is set at the end of an active energy

accumulation line cycle. If the CYCEND enable bit in the

Interrupt Enable 3 SFR (MIRQENH, 0xDB) is set, the 8052 core

has a pending ADE interrupt. The ADE interrupt stays active

until the CYCEND status bit is cleared (see the Energy

Measurement Interrupts section). Another calibration cycle

starts as soon as the CYCEND flag is set. If the LVARHR

register is not read before a new CYCEND flag is set, the

LVARHR register is overwritten by a new value.

REACTIVE ENERGY

NO-LOAD

THRESHOLD

REACTIVE POWER

NO-LOAD

THRESHOLD

Figure 73. Reactive Energy Accumulation in Absolute Accumulation Mode

Reactive Energy Pulse Output

When a new half-line cycle is written in the LINECYC register,

the LVARHR register is reset, and a new accumulation starts at

the next zero crossing. The number of half-line cycles is then

counted until LINCYC is reached. This implementation

provides a valid measurement at the first CYCEND interrupt

after writing to the LINCYC register. The line reactive energy

accumulation uses the same signal path as the reactive energy

accumulation. The LSB size of these two registers is equivalent.

The ADE7569/ADE7169 provide all the circuitry with a pulse

output whose frequency is proportional to reactive power (see

the Energy-to-Frequency Conversion section). This pulse

frequency output uses the calibrated signal after VARGAIN,

and its behavior is consistent with the setting of the reactive

energy accumulation mode in the ACCMODE register (0x0F).

The pulse output is active low and should preferably be connected

to an LED, as shown in Figure 79.

TO

DIGITAL-TO-FREQUENCY

CONVERTER

VARGAIN[11:0]

48

0

+

OUTPUT

FROM

LPF2

%

VAROS[15:0]

VARDIV[7:0]

ACTIVE ENERGY

IS ACCUMULATED IN

THE INTERNAL REGISTER,

AND THE LWATTHR

REGISTER IS UPDATED

AT THE END OF THE LINCYC

HALF-LINE CYCLES

23

0

LPF1

LVARHR[23:0]

ZERO-CROSSING

DETECTION

CALIBRATION

CONTROL

FROM VOLTAGE

CHANNEL ADC

LINCYC[15:0]

Figure 74. Line Cycle Reactive Energy Accumulation Mode

Rev. A | Page 67 of 144

ADE7566/ADE7569/ADE7166/ADE7169

The gain of the apparent energy can be adjusted by using the

multiplier and by writing a twos complement, 12-bit word to the

VAGAIN register (VAGAIN[11:0]). Equation 32 shows how the

gain adjustment is related to the contents of the VAGAIN register.

APPARENT POWER CALCULATION

Apparent power is defined as the maximum power that can be

delivered to a load. V_rmsand I_rmsare the effective voltage and

current delivered to the load, respectively. Therefore, the apparent

power (AP) = V_rms× I_rms. This equation is independent from the

phase angle between the current and the voltage.

Output VAGAIN =

VAGAIN

⎛

⎞

⎟

⎧

⎩

⎫

⎬

⎭

Apparent Power× 1+

(32)

⎜

⎨

2¹²

Equation 31 gives an expression of the instantaneous power

signal in an ac system with a phase shift.

⎝

⎠

For example, when 0x7FF is written to the VAGAIN register, the

power output is scaled up by 50% (0x7FF = 2047d, 2047/2¹²= 0.5).

Similarly, 0x800 = –2047d (signed twos complement) and power

output is scaled by –50%. Each LSB represents 0.0244% of the

power output. The apparent power is calculated with the current

and voltage rms values obtained in the rms blocks of the

ADE7566/ADE7569/ADE7166/ADE7169.

(28)

v(t) = 2 V_rmssin(ωt)

= 2 I_rmssin(ωt + θ)

p(t) = v(t)×i(t)

= V_rmsI_rmscos(θ)−V_rmsI_rmscos(2ωt + θ)

i

(

t

)

(29)

(30)

(31)

p t

( )

Apparent Power Offset Calibration

Figure 75 illustrates the signal processing for the calculation of

the apparent power in the ADE7566/ADE7569/ADE7166/

ADE7169.

Each rms measurement includes an offset compensation register to

calibrate and eliminate the dc component in the rms value (see the

Current Channel RMS Calculation section and the Voltage

Channel RMS Calculation section). The voltage and current

channels rms values are then multiplied together in the

apparent power signal processing. Because no additional offsets

are created in the multiplication of the rms values, there is no

specific offset compensation in the apparent power signal

processing. The offset compensation of the apparent power

measurement is done by calibrating each individual rms

measurement.

The apparent power signal can be read from the waveform register

by setting the WAVMODE register (0x0D) and setting the WFSM

bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB). Like the

current and voltage channel waveform sampling modes, the

waveform data is available at sample rates of 25.6 kSPS,

12.8 kSPS, 6.4 kSPS, or 3.2 kSPS.

VARMSCFCON

APPARENT POWER

SIGNAL (P)

I

rms

0x1A36E2

CURRENT RMS SIGNAL – i(t)

0x1CF68C

0x00

VAGAIN

V

rms

VOLTAGE RMS SIGNAL – v(t)

0x1CF68C

TO

DIGITAL-TO-FREQUENCY

CONVERTER

0x00

Figure 75. Apparent Power Signal Processing

Rev. A | Page 68 of 144

ADE7566/ADE7569/ADE7166/ADE7169

provided to read the apparent energy. This register is reset to 0

after a read operation

APPARENT ENERGY CALCULATION

The apparent energy is given as the integral of the apparent power.

Note that the apparent energy register is unsigned. By setting the

VAEHF and VAEOF bits in the Interrupt Enable 2 SFR

(MIRQENM, 0xDA), the ADE7566/ADE7569/ADE7166/

ADE7169 can be configured to issue an ADE interrupt to the

8052 core when the apparent energy register is half-full or when

an overflow occurs. The half-full interrupt for the unsigned

apparent energy register is based on 24 bits as opposed to 23 bits

for the signed active energy register.

(33)

Apparent Energy = Apparent Power(t)dt

∫

The ADE7566/ADE7569/ADE7166/ADE7169 achieve the

integration of the apparent power signal by continuously

accumulating the apparent power signal in an internal 48-bit

register. The apparent energy register (VAHR[23:0]) represents

the upper 24 bits of this internal register. This discrete time

accumulation or summation is equivalent to integration in

continuous time. Equation 34 expresses the relationship.

Integration Times Under Steady Load: Apparent Energy

∞

⎧

⎨

⎩

⎫

⎬

⎭

As mentioned in the Apparent Energy Calculation section, the

discrete time sample period (T) for the accumulation register is

1.22 μs (5/MCLK). With full-scale sinusoidal signals on the

analog inputs and the VAGAIN register set to 0x000, the

average word value from the apparent power stage is 0x1A36E2

(see the Apparent Power Calculation section). The maximum

value that can be stored in the apparent energy register before it

overflows is 2²⁴or 0xFF,FFFF. The average word value is added

to the internal register, which can store 2⁴⁸or 0xFFFF,FFFF,FFFF

before it overflows. Therefore, the integration time under these

conditions with VADIV = 0 is calculated as follows:

(34)

Apparent Energy = lim

Apparent Power(nT)×T

∑

T →0

n=0

where:

n is the discrete time sample number.

T is the sample period.

The discrete time sample period (T) for the accumulation

register in the ADE7566/ADE7569/ADE7166/ADE7169 is 1.22 μs

(5/MCLK).

Figure 76 shows this discrete time integration or accumulation.

The apparent power signal is continuously added to the internal

register. This addition is a signed addition even if the apparent

energy theoretically remains positive.

Time =

0xFFFF, FFFF, FFFF

×1.22μs =199 sec = 3.33 min

(35)

The 49 bits of the internal register are divided by VADIV. If the

value in the VADIV register is 0, the internal apparent energy

register is divided by 1. VADIV is an 8-bit unsigned register.

The upper 24 bits are then written in the 24-bit apparent energy

register (VAHR[23:0]). The RVAHR register (24 bits long) is

0xD055

When VADIV is set to a value different from 0, the integration

time varies, as shown in Equation 36.

Time = Time_{WDIV = 0}× VADIV

(36)

VAHR[23:0]

23

0

48

0

%

VADIV

48

0

APPARENT POWER

+

or

+

I

rms

APPARENT

POWER SIGNAL = P

APPARENT POWER OR I

rms

IS

ACCUMULATED (INTEGRATED)

IN THE APPARENT ENERGY

REGISTER

T

TIME (nT)

Figure 76. Apparent Energy Calculation

Rev. A | Page 69 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Apparent Energy Pulse Output

the apparent energy accumulation. The LSB size of these two

registers is equivalent.

All the ADE7566/ADE7569/ADE7166/ADE7169 circuitry has a

pulse output whose frequency is proportional to apparent

power (see the Energy-to-Frequency Conversion section). This

pulse frequency output uses the calibrated signal after VAGAIN.

This output can also be used to output a pulse whose frequency

is proportional to I_rms.

Apparent Power No-Load Detection

The ADE7566/ADE7569/ADE7166/ADE7169 include a no-

load threshold feature on the apparent power that eliminates any

creep effects in the meter. The ADE7566/ADE7569/ADE7166/

ADE7169 accomplish this by not accumulating energy if the

multiplier output is below the no-load threshold. When the

apparent power is below the no-load threshold, the

The pulse output is active low and should preferably be connected

to an LED, as shown in Figure 79.

VANOLOAD flag in the Interrupt Status 1 SFR (MIRQSTL,

0xDC) is set. If the VANOLOAD bit is set in the Interrupt

Enable 1 SFR (MIRQENL, 0xD9), the 8052 core has a pending

ADE interrupt. The ADE interrupt stays active until the

APNOLOAD status bit is cleared (see the Energy Measurement

Interrupts section).

Line Apparent Energy Accumulation

The ADE7566/ADE7569/ADE7166/ADE7169 are designed

with a special apparent energy accumulation mode that

simplifies the calibration process. By using the on-chip, zero-

crossing detection, the ADE7566/ADE7569/ADE7166/ ADE7169

accumulate the apparent power signal in the LVAHR register for

an integral number of half cycles, as shown in Figure 77. The line

apparent energy accumulation mode is always active.

The no-load threshold level is selectable by setting the

VANOLOAD bits in the NLMODE register (0x0E). Setting

these bits to 0b00 disables the no-load detection and setting

them to 0b01, 0b10, or 0b11 sets the no-load detection

threshold to 0.030%, 0.015%, and 0.0075% of the full-scale

output frequency of the multiplier, respectively.

The number of half-line cycles is specified in the LINCYC

register, which is an unsigned 16-bit register. The ADE7566/

ADE7569/ADE7166/ADE7169 can accumulate apparent power

for up to 65,535 combined half cycles. Because the apparent

power is integrated on the same integral number of line cycles

as the line active register and reactive energy register, these

values can easily be compared. The energies are calculated more

accurately because of this precise timing control and provide all

the information needed for reactive power and power factor

calculation.

This no-load threshold can also be applied to the I_rmspulse

output when selected. In this case, the level of no-load threshold

is the same as for the apparent energy.

AMPERE-HOUR ACCUMULATION

In a tampering situation where no voltage is available to the

energy meter, the ADE7566/ADE7569/ADE7166/ADE7169 is

capable of accumulating the ampere-hour instead of apparent

power into the VAHR, RVAHR, and LVAHR. When Bit 3

(VARMSCFCON) of the MODE2 register (0x0C) is set, the VAHR,

RVAHR, and LVAHR, and the input for the digital-to-frequency

converter accumulate I_rmsinstead of apparent power. All the

signal processing and calibration registers available for apparent

power and energy accumulation remain the same when ampere-

hour accumulation is selected. However, the scaling difference

between I_rmsand apparent power requires independent values

for gain calibration in the VAGAIN, VADIV, CFxNUM, and

CFxDEN registers.

At the end of an energy calibration cycle, the CYCEND flag in

the Interrupt Status 3 SFR (MIRQSTH, 0xDE) is set. If the

CYCEND enable bit in the Interrupt Enable 3 SFR (MIRQENH,

0xDB) is enabled, the 8052 core has a pending ADE interrupt.

As for LWATTHR, when a new half-line cycles is written

in LINCYC register, the LVAHR register is reset and a new

accumulation start at the next zero crossing. The number of

half-line cycles is then counted until LINCYC is reached.

This implementation provides a valid measurement at the first

CYCEND interrupt after writing to the LINCYC register. The

line apparent energy accumulation uses the same signal path as

48

0

+

APPARENT POWER

%

or I

rms

LVAHR REGISTER IS

UPDATED EVERY LINCYC

ZERO CROSSING WITH THE

TOTAL APPARENT ENERGY

DURING THAT DURATION

VADIV[7:0]

23

0

LPF1

LVAHR[23:0]

FROM

VOLTAGE CHANNEL

ADC

ZERO-CROSSING

DETECTION

CALIBRATION

CONTROL

LINCYC[15:0]

Figure 77. Line Cycle Apparent Energy Accumulation

Rev. A | Page 70 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Pulse Output Configuration

ENERGY-TO-FREQUENCY CONVERSION

The two pulse output circuits have separate configuration bits

in the MODE2 Register (0x0C. Setting the CFxSEL bits to 0b00,

0b01, or 0b1x configures the DFC to create a pulse output

proportional to active power, to reactive power (not available in

The ADE7566/ADE7569/ADE7166/ADE7169 also provide two

energy-to-frequency conversions for calibration purposes. After

initial calibration at manufacturing, the manufacturer or end

customer often verify the energy meter calibration. One

convenient way to do this is for the manufacturer to provide an

output frequency that is proportional to the active power,

reactive power, apparent power, or I_rmsunder steady load

conditions. This output frequency can provide a simple, single-

wire, optically isolated interface to external calibration equipment.

Figure 78 illustrates the energy-to-frequency conversion in the

ADE7566/ADE7569/ADE7166/ADE7169.

the ADE7566 and ADE7166), or to apparent power or I_rms

,

respectively.

The selection between I_rmsand apparent power is done by the

VARMSCFCON bit in the MODE2 register (0x0C). With this

selection, CF2 cannot be proportional to apparent power if CF1

is proportional to I_rms, and CF1 cannot be proportional to

apparent power if CF2 is proportional to I_rms

.

MODE 2 REGISTER 0x0C

Pulse Output Characteristic

VARMSCFCON CFxSEL[1:0]

The pulse output for both DFCs stays low for 90 ms if the pulse

period is longer than 180 ms (5.56 Hz). If the pulse period is

shorter than 180 ms, the duty cycle of the pulse output is 50%.

The pulse output is active low and should preferably be

connected to an LED, as shown in Figure 79.

I_rms

CFxNUM

VA

CFx PULSE

DFC

OUTPUT

*

VAR

÷

V

DD

WATT

CFxDEN

CF

*

AVAILABLE ONLY IN THE ADE7569 AND ADE7169

Figure 78. Energy-to-Frequency Conversion

Figure 79. CF Pulse Output

Two digital-to-frequency converters (DFC) are used to generate

the pulsed outputs. When WDIV = 0 or 1, the DFC generates a

pulse each time 1 LSB in the energy register is accumulated. An

output pulse is generated when CFxNUM/CFxDEN number of

pulses are generated at the DFC output. Under steady load

conditions, the output frequency is proportional to the active

power, reactive power, apparent power, or I_rms, depending on the

CFxSEL bits in the MODE2 register (0x0C).

The maximum output frequency with ac input signals at

full scale and CFxNUM = 0x00 and CFxDEN = 0x00 is

approximately 21.1 kHz.

The ADE7566/ADE7569/ADE7166/ADE7169 incorporate two

registers per DFC, CFxNUM[15:0] and CFxDEN[15:0], to set

the CFx frequency. These are unsigned 16-bit registers that can

be used to adjust the CFx frequency to a wide range of values.

These frequency scaling registers are 16-bit registers that can

scale the output frequency by 1/2¹⁶to 1 with a step of 1/2¹⁶.

Both pulse outputs can be enabled or disabled by clearing or

setting Bit DISCF1 and Bit DISCF2 in the MODE1 register

(0x0B), respectively.

If 0 is written to any of these registers, 1 is applied to the

register. The ratio CFxNUM/CFxDEN should be less than 1 to

ensure proper operation. If the ratio of the CFxNUM/CFxDEN

registers is greater than 1, the register values are adjusted to a

ratio of 1. For example, if the output frequency is 1.562 kHz

while the content of CFxDEN is 0 (0x000), the output frequency

can be set to 6.1 Hz by writing 0xFF to the CFxDEN register.

Both pulse outputs set separate flags in the Interrupt Status 2 SFR

(MIRQSTM, 0xDD), CF1 and CF2. If the CF1 and CF2 enable

bits in the Interrupt Enable 2 SFR (MIRQENM, 0xDA) are set,

the 8052 core has a pending ADE interrupt. The ADE interrupt

stays active until the CF1 or CF2 status bits are cleared (see the

Energy Measurement Interrupts section).

Rev. A | Page 71 of 144

ADE7566/ADE7569/ADE7166/ADE7169

ENERGY REGISTER SCALING

ENERGY MEASUREMENT INTERRUPTS

The ADE7566/ADE7569/ADE7166/ADE7169 provide

measurements of active, reactive, and apparent energies that use

separate paths and filtering for calculation. The difference in

data paths can result in small differences in LSB weight between

active, reactive, and apparent energy registers. These

measurements are internally compensated so the scaling is nearly

one to one. The relationship between these registers is shown in

Table 46.

The energy measurement part of the ADE7566/ADE7569/

ADE7166/ADE7169 has its own interrupt vector for the 8052

core, Vector Address 0x004B (see the Interrupt Vectors section).

The bits set in the Interrupt Enable 1 SFR (MIRQENL, 0xD9),

Interrupt Enable 2 SFR (MIRQENM, 0xDA), and Interrupt

Enable 3 SFR (MIRQENH, 0xDB) enable the energy

measurement interrupts that are allowed to interrupt the 8052

core. If an event is not enabled, it cannot create a system

interrupt.

Table 46. Energy Registers Scaling

Line Frequency = 50 Hz Line Frequency = 60 Hz Integrator

The ADE interrupt stays active until the status bit that has created

the interrupt is cleared. The status bit is cleared when a zero is

written to this register bit.

VAR = 0.9952 × WATT

VA = 0.9978 × WATT

VAR = 0.9997 × WATT

VA = 0.9977 × WATT

VAR = 0.9949 × WATT

VA = 1.0015 × WATT

VAR = 0.9999 × WATT

VA = 1.0015 × WATT

Off

On

Rev. A | Page 72 of 144

ADE7566/ADE7569/ADE7166/ADE7169

TEMPERATURE, BATTERY, AND SUPPLY VOLTAGE MEASUREMENTS

The ADE7566/ADE7569/ADE7166/ADE7169 include

temperature measurements as well as battery and supply voltage

measurements. These measurements enable many forms of

compensation. The temperature and supply voltage measurements

can be used to compensate external circuitry. The RTC can be

calibrated over temperature to ensure that it does not drift. Supply

voltage measurements allow the LCD contrast to be maintained

despite variations in voltage. Battery measurements allow low

battery detection to be performed.

All ADC measurements are configured through the SFRs

detailed in Table 47.

The temperature, battery, and supply voltage measurements can

be configured to continue functioning in PSM1 and PSM2.

Keeping the temperature measurement active ensures that it is

not necessary to wait for the temperature measurement to settle

before using it for compensation.

Table 47. Temperature, Battery, and Supply Voltage Measurement SFRs

SFR Address

R/W

Name

Description

0xF9

STRBPER

DIFFPROG

ADCGO

Peripheral ADC Strobe Period (see Table 48).

Temperature and Supply Delta Configuration (see Table 49).

Start ADC Measurement (see Table 50).

Battery Detection Threshold (see Table 51).

V_DCINADC Value (see Table 52).

0xF3

0xD8

0xFA

BATVTH

VDCINADC

BATADC

TEMPADC

0xEF

0xDF

Battery ADC Value (see Table 53).

0xD7

Temperature ADC Value (see Table 54).

Table 48. Peripheral ADC Strobe Period SFR (STRBPER, 0xF9)¹

Bit

Mnemonic

Default

Description

7 to 6

5 to 4

Reserved

00

0

These bits should be left clear for proper operation.

Period for background external voltage measurements.

VDCIN_PERIOD[1:0]

Result

00

01

10

11

No V_DCINmeasurement

8 min

2 min

1 min

3 to 2

BATT_PERIOD[1:0]

TEMP_PERIOD[1:0]

0

Period for background battery level measurements.

BATT_PERIOD[1:0]

Result

00

01

10

11

No battery measurement

16 min

4 min

1 min

1 to 0

Period for background temperature measurements.

TEMP_PERIOD[1:0]

Result

00

01

10

11

No temperature measurements

8 min

2 min

1 min

¹The strobing option only works when the RTCEN bit in RTC Configuration SFR (TIMECON, 0xA1) is set.

Rev. A | Page 73 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 49. Temperature and Supply Delta SFR (DIFFPROG, 0xF3)

Bit

Mnemonic

Default Description

7 to 6

5 to 3

Reserved

0

Reserved.

TEMP_DIFF[2:0]

Difference threshold between last temperature measurement interrupting 8052 and new

temperature measurement that should interrupt 8052.

TEMP_DIFF[2:0]

Result

000

001

010

011

100

101

110

111

No interrupt

1 LSB (≈ 0.8°C)

2 LSB (≈ 1.6°C)

3 LSB (≈ 2.4°C)

4 LSB (≈ 3.2°C)

5 LSB (≈ 4°C)

6 LSB (≈ 4.8°C)

Every temperature measurement

2 to 0

VDCIN_DIFF[2:0]

0

Difference threshold between last external voltage measurement interrupting 8052 and new

external measurement that should interrupt 8052.

VDCIN_DIFF[2:0] Result

000

001

010

011

100

101

110

111

No interrupt

1 LSB (≈ 120 mV)

2 LSB (≈ 240 mV)

3 LSB (≈ 360 mV)

4 LSB (≈ 480 mV)

5 LSB (≈ 600 mV)

6 LSB (≈ 720 mV)

Every V_DCINmeasurement

Table 50. Start ADC Measurement SFR (ADCGO, 0xD8)

Bit

Address

Mnemonic

Default Description

7

0xDF

PLLACK

0

Set this bit to clear the PLL fault bit, PLL_FLT, in the PERIPH register. A PLL fault is

generated if a reset is caused because the PLL lost lock.

6 to 3

2

0xDE to 0xDB Reserved

0

Reserved.

0xDA

0xD9

0xD8

VDCIN_ADC_G

O

Set this bit to initiate an external voltage measurement. This bit is cleared when

the measurement request is received by the ADC.

1

0

TEMP_ADC_GO

0

Set this bit to initiate a temperature measurement. This bit is cleared when the

measurement request is received by the ADC.

BATT_ADC_GO

Set this bit to initiate a battery measurement. This bit is cleared when the

measurement request is received by the ADC.

Table 51. Battery Detection Threshold SFR (BATVTH, 0xFA)

Bit

Mnemonic

Default

Description

7 to 0

BATVTH

0

The battery ADC value is compared to this register, the battery threshold register. If BATADC is

lower than the threshold, an interrupt is generated.

Table 52. V_DCINADC Value SFR (VDCINADC, 0xEF)

Bit

Mnemonic

Default

Description

7 to 0

VDCINADC

0

The V_DCINADC value in this register is updated when an ADC interrupt occurs.

Table 53. Battery ADC Value SFR (BATADC, 0xDF)

Bit

Mnemonic

Default

Description

7 to 0

BATADC

0

The battery ADC value in this register is updated when an ADC interrupt occurs.

Table 54. Temperature ADC Value SFR (TEMPADC, 0xD7)

Bit

Mnemonic

Default

Description

7 to 0

TEMPADC

0

The temperature ADC value in this register is updated when an ADC interrupt occurs.

Rev. A | Page 74 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Start ADC Measurement SFR (ADCGO, 0xD8).

Background temperature measurements are not available.

In PSM2 operating mode, the 8052 is not active.

Temperature conversions are available through the

background measurement mode only.

TEMPERATURE MEASUREMENT

To provide a digital temperature measurement, each

ADE7566/ADE7569/ADE7166/ADE7169 includes a dedicated

ADC. An 8-bit Temperature ADC Value SFR (TEMPADC,

0xD7) holds the results of the temperature conversion. The

resolution of the temperature measurement is 0.78°C/LSB.

There are two ways to initiate a temperature conversion: a single

temperature measurement or background temperature

measurements.

•

The Temperature ADC Value SFR (TEMPADC, 0xD7) is updated

with a new value only when a temperature ADC interrupt occurs.

Temperature ADC Interrupt

The temperature ADC can generate an ADC interrupt when at

least one of the following conditions occurs:

Single Temperature Measurement

Set the TEMP_ADC_GO bit in the Start ADC Measurement

SFR (ADCGO, 0xD8) to obtain a temperature measurement

(see Table 50). An interrupt is generated when the conversion is

complete and when the temperature measurement is available

in the Temperature ADC Value SFR (TEMPADC, 0xD7).

•

The difference between the new temperature ADC value and

the last temperature ADC value generating an ADC interrupt

is larger than the value set in the TEMP_DIFF[2:0] bits.

The temperature ADC conversion, initiated by setting Start

ADC Measurement SFR (ADCGO, 0xD8) finishes.

•

Background Temperature Measurements

When the ADC interrupt occurs, a new value is available in the

Temperature ADC Value SFR (TEMPADC, 0xD7). Note that

there is no flag associated with this interrupt.

Background temperature measurements are disabled by default.

To configure the background temperature measurement mode,

set a temperature measurement interval in the Peripheral ADC

Strobe Period SFR (STRBPER, 0xF9). Temperature measurements

are then performed periodically in the background (see Table 48).

BATTERY MEASUREMENT

To provide a digital battery measurement, each ADE7566/

ADE7569/ADE7166/ADE7169 includes a dedicated ADC. The

battery measurement is available in an 8-bit SFR, the Battery

ADC Value SFR (BATADC, 0xDF). The battery measurement has

a resolution of 14.6 mV/LSB. A battery conversion can be

initiated by two methods: a single battery measurement or

background battery measurements.

When a temperature conversion completes, the new temperature

ADC value is compared to the last temperature ADC value that

created an interrupt. If the absolute difference between the two

values is greater than the setting in the TEMP_DIFF[2:0] bits in

the Temperature and Supply Delta SFR (DIFFPROG, 0xF3), a

TEMPADC interrupt is generated (see Table 49). This allows

temperature measurements to take place completely in the

background, only requiring MCU activity if the temperature

changes more than a configurable delta.

Single Battery Measurement

Set the BATT_ADC_GO bit in the Start ADC Measurement

SFR (ADCGO, 0xD8) to obtain a battery measurement. An

interrupt is generated when the conversion is done and when

the battery measurement is available in the Battery ADC Value

SFR (BATADC, 0xDF).

To set up background temperature measurements, follow

these steps:

1. Initiate a single temperature measurement by setting the

TEMP_ADC_GO bit in the Start ADC Measurement SFR

(ADCGO, 0xD8).

2. Upon completion of this measurement, configure the

TEMP_DIFF[2:0] bits to establish the change in temperature

that triggers an interrupt.

3. Set up the interval for background temperature measurements

by configuring the TEMP_PERIOD[1:0] bits in the

Peripheral ADC Strobe Period SFR (STRBPER, 0xF9).

Background Battery Measurements

To configure background measurements for the battery,

establish a measurement interval in the Peripheral ADC Strobe

Period SFR (STRBPER, 0xF9). Battery measurements are then

performed periodically in the background (see Table 48).

When a battery conversion completes, the battery ADC value is

compared to the low battery threshold, established in the Battery

Detection Threshold SFR (BATVTH, 0xFA). If the battery ADC

value is below this threshold, a low battery flag is set. This low

battery flag is the FBAT bit in the Power Management Interrupt

Flag SFR (IPSMF, 0xF8), which is used for power supply moni-

toring. This low battery flag can be enabled to generate the PSM

interrupt by setting the EBAT bit in the Power Management

Interrupt Enable SFR (IPSME, 0xEC). This method allows

battery measurements to take place completely in the background,

only requiring MCU activity if the battery drops below a user-

specified threshold.

Temperature ADC in PSM0, PSM1, and PSM2

Depending on the operating mode of the ADE7566/ADE7569/

ADE7166/ADE7169, a temperature conversion is initiated only

by certain actions.

•

In PSM0 operating mode, the 8052 is active. Temperature

measurements are available in the background measurement

mode and by initiating a single measurement.

•

In PSM1 operating mode, the 8052 is active and the part

is battery powered. Single temperature measurements

can be initiated by setting the TEMP_ADC_GO bit in the

Rev. A | Page 75 of 144

ADE7566/ADE7569/ADE7166/ADE7169

To set up background battery measurements, follow these steps:

conversion: a single external voltage measurement or

background external voltage measurements.

1. Configure the Battery Detection Threshold SFR

(BATVTH, 0xFA) to establish a low battery threshold.

If the BATADC measurement is below this threshold,

the FBAT in the Power Management Interrupt Flag SFR

(IPSMF, 0xF8) is set.

2. Set up the interval for background battery measurements

by configuring the BATT_PERIOD[1:0] bits in the

Peripheral ADC Strobe Period SFR (STRBPER, 0xF9).

Single External Voltage Measurement

To obtain an external voltage measurement, set the

VDCIN_ADC_GO bit in the Start ADC Measurement SFR

(ADCGO, 0xD8). An interrupt is generated when the conversion

is done and when the external voltage measurement is available

in the VDCIN ADC Value SFR (VDCINADC, 0xEF).

Background External Voltage Measurements

Battery ADC in PSM0, PSM1, and PSM2

Background external voltage measurements are disabled by

default. To configure the background external voltage

measurement mode, set an external voltage measurement

interval in the Peripheral ADC Strobe Period SFR (STRBPER,

0xF9). External voltage measurements are performed

periodically in the background (see Table 48).

Depending on the operating mode, a battery conversion is

initiated only by certain actions.

•

In PSM0 operating mode, the 8052 is active. Battery

measurements are available in the background

measurement mode and by initiating a single

measurement.

When an external voltage conversion is complete, the new

external voltage ADC value is compared to the last external

voltage ADC value that created an interrupt. If the absolute

difference between the two values is greater than the setting in

the VDCIN_DIFF[2:0] bits in the Temperature and Supply

Delta SFR (DIFFPROG, 0xF3), a V_DCINADC flag is set. This

V_DCINADC flag is the FVDCIN in the Power Management

Interrupt Flag SFR (IPSMF, 0xF8), which is used for power

supply monitoring. This V_DCINADC flag can be enabled to

generate a PSM interrupt by setting the EVDCIN bit in the

Power Management Interrupt Enable SFR (IPSME, 0xEC).

•

In PSM1 operating mode, the 8052 is active and the part is

battery powered. Single battery measurements can be

initiated by setting the BATT_ADC_GO bit in the Start

ADC Measurement SFR (ADCGO, 0xD8). Background

battery measurements are not available.

•

In PSM2 operating mode, the 8052 is not active. Unlike

temperature and VDCIN measurements, the battery

conversions are not available in this mode.

Battery ADC Interrupt

The battery ADC can generate an ADC interrupt when at least

one of the following conditions occurs:

This method allows external voltage measurements to take

place completely in the background, only requiring MCU

activity if the external voltage has changed more than a

configurable delta.

•

The new battery ADC value is smaller than the value set in

the Battery Detection Threshold SFR (BATVTH, 0xFA),

indicating a battery voltage loss.

To set up background external voltage measurements, follow

these steps:

•

A single battery measurement initiated by setting the

BATT_ADC_GO bit finishes.

1. Initiate a single external voltage measurement by setting

the VDCIN_ADC_GO bit in the Start ADC Measurement

SFR (ADCGO, 0xD8).

2. Upon completion of this measurement, configure the

VDCIN_DIFF[2:0] bits to establish the change in voltage

that sets the FVDCIN in the Power Management Interrupt

Flag SFR (IPSMF, 0xF8).

3. Set up the interval for background external voltage

measurements by configuring the VDCIN_PERIOD[1:0] bits

in the Peripheral ADC Strobe Period SFR (STRBPER, 0xF9).

When the battery flag (FBAT) is set in the Power Management

Interrupt Flag SFR (IPSMF, 0xF8), a new ADC value is available

in the Battery ADC Value SFR (BATADC, 0xDF). This battery

flag can be enabled as a source of the PSM interrupt to generate

a PSM interrupt every time the battery drops below a set voltage

threshold or after a single conversion initiated by setting the

BATT_ADC_GO bit is ready.

The Battery ADC Value SFR (BATADC, 0xDF) is updated with

a new value only when the battery flag is set in the Power

Management Interrupt Flag SFR (IPSMF, 0xF8).

EXTERNAL VOLTAGE MEASUREMENT

The ADE7566/ADE7569/ADE7166/ADE7169 include a

dedicated ADC to provide a digital measurement of an external

voltage on the V_DCINpin. An 8-bit SFR, the VDCIN ADC Value

SFR (VDCINADC, 0xEF), holds the results of the conversion.

The resolution of the external voltage measurement is 15.3

mV/LSB. There are two ways to initiate an external voltage

Rev. A | Page 76 of 144

ADE7566/ADE7569/ADE7166/ADE7169

External Voltage ADC in PSM1 and PSM2

External Voltage ADC Interrupt

An external voltage conversion is initiated only by certain actions

that depend on the operating mode of the ADE7566/ADE7569/

ADE7166/ADE7169.

The external voltage ADC can generate an ADC interrupt when

at least one of the following conditions occurs:

•

The difference between the new external voltage ADC

value and the last external voltage ADC value generating

an ADC interrupt is larger than the value set in the

VDCIN_DIFF[2:0] bits in the Temperature and Supply

Delta SFR (DIFFPROG, 0xF3).

•

In PSM0 operating mode, the 8052 is active. External

voltage measurements are available in the background

measurement mode and by initiating a single measurement.

In PSM1 operating mode, the 8052 is active and the part is

powered from battery. Single external voltage measurements

can be initiated by setting the VDCIN_ADC_GO bit in the

Start ADC Measurement SFR (ADCGO, 0xD8). Background

external voltage measurements are not available.

•

The external voltage ADC conversion initiated by setting

VDCIN_ADC_GO finishes.

When the ADC interrupt occurs, a new value is available in the

VDCIN ADC Value SFR (VDCINADC, 0xEF). Note that there

is no flag associated with this interrupt.

•

In PSM2 operating mode, the 8052 is not active. External

voltage conversions are available through the background

measurement mode only.

The external voltage ADC in the VDCIN ADC Value SFR

(VDCINADC, 0xEF) is updated with a new value only when an

external voltage ADC interrupt occurs.

Rev. A | Page 77 of 144

ADE7566/ADE7569/ADE7166/ADE7169

8052 MCU CORE ARCHITECTURE

The ADE7566/ADE7569/ADE7166/ADE7169 have an 8052

MCU core and use the 8052 instruction set. Some of the

standard 8052 peripherals, such as the UART, have been

enhanced. This section describes the standard 8052 core and its

enhancements used in the ADE7566/ADE7569/ADE7166/

ADE7169.

16kB ELECTRICALLY

REPROGRAMMABLE

NONVOLATILE

FLASH/EE

ENERGY

MEASUREMENT

PROGRAM/DATA

MEMORY

POWER

MANAGEMENT

256 BYTES

GENERAL

PURPOSE

RAM

RTC

128-BYTE

SPECIAL

FUNCTION

REGISTER

AREA

8051

COMPATIBLE

CORE

LCD DRIVER

STACK

The special function register (SFR) space is mapped into the

upper 128 bytes of internal data memory space and is accessed

by direct addressing only. It provides an interface between the

CPU and all on-chip peripherals. A block diagram showing the

programming model of the ADE7566/ADE7569/ADE7166/

ADE7169 via the SFR area is shown in Figure 80.

TEMPERATURE

ADC

REGISTER

BANKS

PC

IR

BATTERY

ADC

256 BYTES XRAM

OTHER ON-CHIP

PERIPHERALS:

• SERIAL I/O

• WDT

• TIMERS

Figure 80. ADE7566/ADE7569/ADE7166/ADE7169 Block Diagram

All registers except the program counter (PC), instruction

register (IR), and the four general-purpose register banks

reside in the SFR area. The SFR registers include power

control, configuration, and data registers that provide an

interface between the CPU and all on-chip peripherals.

MCU REGISTERS

The registers used by the MCU are summarized in this section.

Table 55. 8052 SFRs

Address

Mnemonic

ACC

Bit Addressable

Description

0xE0

Yes

No

Accumulator.

0xF0

B

Auxiliary Math Register.

0xD0

PSW

PCON

DPL

Program Status Word (see Table 56).

Program Control Register (see Table 57).

Data Pointer Low (see Table 58).

Data Pointer High (see Table 59).

Data Pointer (see Table 60).

Stack Pointer (see Table 61).

Configuration (see Table 62).

0x87

0x82

0x83

DPH

DPTR

SP

0x83 and 0x82

0x81

0xAF

CFG

Table 56. Program Status Word SFR (PSW, 0xD0)

Bit

Address

Mnemonic Description

7

0xD7

CY

AC

F0

Carry Flag. Modified by ADD, ADDC, SUBB, MUL, and DIV instructions.

Auxiliary Carry Flag. Modified by ADD and ADDC instructions.

6

0xD6

5

0xD5

General-Purpose Flag Available to the User.

Register Bank Select Bits.

4 to 3

0xD4, 0xD3 RS1, RS0

RS1

0

1

RS0

0

1

0

1

Result (Selected Bank)

0

1

2

3

2

1

0

0xD2

0xD1

0xD0

OV

F1

P

Overflow Flag. Modified by ADD, ADDC, SUBB, MUL, and DIV instructions.

General-Purpose Flag Available to the User.

Parity Bit. The number of bits set in the accumulator added to the value of the parity bit is always an

even number.

Rev. A | Page 78 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 60. Data Pointer SFR (DPTR, 0x82 and 0x83)

Table 57. Program Control SFR (PCON, 0x87)

Bit

Default Description

Contain the 2-byte address of the data pointer.

DPTR is a combination of DPH and DPL SFRs.

Bit

Default

Description

15 to 0

0

7

0

SMOD bit. Double baud rate control.

Reserved. Should be left cleared.

6 to 0

Table 61. Stack Pointer SFR (SP, 0x81)

Table 58. Data Pointer Low SFR (DPL, 0x82)

Bit

Default Description

Bit

Default

Description

7 to 0

7

Contain the 8 LSBs of the pointer for the stack.

7 to 0

0

Contain the low byte of the data pointer.

Table 59. Data Pointer High SFR (DPH, 0x83)

Bit

Default

Description

7 to 0

0

Contain the high byte of the data pointer.

Table 62. Configuration SFR (CFG, 0xAF)

Bit

Mnemonic

Reserved

EXTEN

Description

7

This bit should be left set for proper operation.

Enhanced UART Enable Bit.

6

EXTEN

Result

0

1

Standard 8052 UART without enhanced error-checking features.

Enhanced UART with enhanced error checking (see the UART Additional Features section).

5

4

SCPS

Synchronous Communication Selection Bit.

SCPS

Result

0

1

I²C port is selected for control of the shared I²C/SPI pins and SFRs.

SPI port is selected for control of the shared I²C/SPI pins and SFRs.

MOD38EN

38 kHz Modulation Enable Bit.

MOD38EN

Result

0

1

38 kHz modulation is disabled.

38 kHz modulation is enabled on the pins selected by the MOD38[7:0] bits in the

Extended Port Configuration SFR (EPCFG, 0x9F).

3 to 2 Reserved

1 to 0 XREN1,

XREN0

XRENx

Result

XREN1 OR XREN0 = 1

XREN1 AND XREN0 = 0

Enables MOVX instruction to use 256 bytes of extended RAM.

Disables MOVX instruction.

Rev. A | Page 79 of 144

ADE7566/ADE7569/ADE7166/ADE7169

BASIC 8052 REGISTERS

Program Counter (PC)

Data Pointer (DPTR)

The data pointer is made up of two 8-bit registers: DPH (high

byte) and DPL (low byte). These provide memory addresses for

internal code and data access. The DPTR can be manipulated as

a 16-bit register (DPTR = DPH, DPL) or as two independent

8-bit registers (DPH, DPL). See Table 58 and Table 59.

The program counter holds the two byte address of the next

instruction to be fetched. The PC is initialized with 0x00 at reset

and is incremented after each instruction is performed. Note

that the amount added to the PC depends on the number of

bytes in the instruction, so the increment can range from one

byte to three bytes. The program counter is not directly accessible

to the user but can be directly modified by CALL and JMP

instructions that change which part of the program is active.

The ADE7566/ADE7569/ADE7166/ADE7169 support dual

data pointers. See the Dual Data Pointers section. Note that the

Dual Data Pointers section of the data sheet is the only place

where the main and shadow data pointers are distinguished.

Whenever the data pointer (DPTR) is mentioned elsewhere in

the data sheet, active DPTR is implied.

Instruction Register (IR)

The instruction register holds the operations code of the

instruction being executed. The operations code is the binary

code that results from assembling an instruction. This register is

not directly accessible to the user.

Stack Pointer (SP)

The stack pointer keeps track of the current address at the top

of the stack. To push a byte of data onto the stack, the stack

pointer is incremented and the data is moved to the new top of

the stack. To pop a byte of data off the stack, the top byte of data

is moved into the awaiting address, and the stack pointer is

decremented. The stack is a last in, first out (LIFO) method of

data storage because the most recent addition to the stack is the

first to come off it.

Register Banks

There are four banks that each contain eight byte-wide registers

for a total of 32 bytes of registers. These registers are convenient

for temporary storage of mathematical operands. An

instruction involving the accumulator and a register can be

executed in one clock cycle, as opposed to two clock cycles to

perform an instruction involving the accumulator and a literal or

a byte of general-purpose RAM. The register banks are located in

the first 32 bytes of RAM.

The stack is utilized during CALL and RET instructions to keep

track of the address to move into the PC when returning from

the function call. The stack is also manipulated when vectoring

for interrupts to keep track of the prior state of the PC.

The active register bank is selected by the RS0 and RS1 bits in

the Program Status Word SFR (PSW, 0xD0).

The stack resides in the internal extended RAM, and the

SP register holds the address of the stack in the extended RAM

(XRAM). The advantage of this solution is that the stack is

segregated to the internal XRAM. The use of the general-

purpose RAM can be limited to data storage, and the use of the

extended internal RAM can be limited to the stack pointer. This

separation limits the chance of data RAM corruption when the

stack pointer overflows in data RAM.

Accumulator

The accumulator is a working register, storing the results of

many arithmetic or logical operations. The accumulator is used

in more than half of the 8052 instructions where it is usually

referred to as “A.” The program status register (PSW) constantly

monitors the number of bits that are set in the accumulator to

determine if it has even or odd parity. The accumulator is stored

in the SFR space (see Table 55).

Data can still be stored in XRAM by using the MOVX command.

B Register

The B register is used by the multiply and divide instructions,

MUL AB and DIV AB to hold one of the operands. Because

the B register is not used for many instructions, it can be used

as a scratch pad register such as those in the register banks.

The B register is stored in the SFR space (see Table 55).

0xFF

0x00

0xFF

0x00

256 BYTES OF

RAM

256 BYTES OF

ON-CHIP XRAM

(DATA)

DATA + STACK

Program Status Word (PSW)

Figure 81. Extended Stack Pointer Operation

The PSW register reflects the status of arithmetic and logical

operations through carry, auxiliary carry, and overflow flags.

The parity flag reflects the parity of the accumulator contents,

which can be helpful for communication protocols. The PSW

bits are described in Table 56. The Program Status Word SFR

(PSW, 0xD0) is bit addressable.

To change the default starting address for the stack, move a

value into the stack pointer (SP). For example, to enable the

extended stack pointer and initialize it at the beginning of the

XRAM space, use the following code:

MOV

SP,#00H

Rev. A | Page 80 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Program Control Register (PCON, 0x87)

STANDARD 8052 SFRS

The 8052 core defines two power-down modes: power down

and idle. The ADE7566/ADE7569/ADE7166/ADE7169

enhance the power control capability of the traditional 8052

MCU with additional power management functions. The Power

Control SFR (POWCON, 0xC5) is used to define power

control-specific functionality for the ADE7566/ADE7569/

ADE7166/ADE7169. The Program Control SFR (PCON, 0x87) is

not bit addressable. See the Power Management section.

The standard 8052 special function registers include the

Accumulator, B, PSW, DPTR, and SP SFRs described in the

Basic 8052 Registers section. The standard 8052 SFRs also

define timers, the serial port interface, interrupts, I/O ports,

and power-down modes.

Timer SFRs

The 8052 contains three 16-bit timers: the identical Timer0 and

Timer1, as well as a Timer2. These timers can also function as

event counters. Timer2 has a capture feature where the value of

the timer can be captured in two 8-bit registers upon the

assertion of an external input signal (see Table 102 and the

Timers section).

The ADE7566/ADE7569/ADE7166/ADE7169 have many other

peripherals not standard to the 8052 core, including

•

ADE energy measurement DSP

RTC

LCD driver

Serial Port SFRs

Battery switchover/power management

Temperature ADC

Battery ADC

The full-duplex serial port peripheral requires two registers,

one for setting up the baud rate and other communication

parameters, and another for the transmit/receive buffer. The

ADE7566/ADE7569/ADE7166/ADE7169 also have enhanced

serial port functionality with a dedicated timer for baud rate

generation with a fractional divisor and additional error

detection. See Table 131 and the UART Serial Interface section.

SPI/I²C communication

Flash memory controller

Watchdog timer

MEMORY OVERVIEW

Interrupt SFRs

The ADE7566/ADE7569/ADE7166/ADE7169 contain the

following memory blocks:

There is a two-tiered interrupt system standard in the 8052 core.

The priority level for each interrupt source is individually

selectable as high or low. The ADE7566/ADE7569/ADE7166/

ADE7169 enhance this interrupt system by creating, in essence,

a third interrupt tier for a highest priority, the power supply

management interrupt (PSM). See the Interrupt System section.

•

16 kB of on-chip Flash/EE program and data memory

256 bytes of general-purpose RAM

256 bytes of internal extended RAM (XRAM)

The 256 bytes of general-purpose RAM share the upper 128 bytes

of its address space with special function registers. All of the

memory spaces are shown in Figure 80. The addressing mode

specifies which memory space to access.

I/O Port SFRs

The 8052 core supports four I/O ports, Port 0 through Port 3,

where Port 0 and Port 2 are typically used to access external

code and data spaces. The ADE7566/ADE7569/ADE7166/

ADE7169, unlike standard 8052 products, provide internal

nonvolatile flash memory so that an external code space is

unnecessary. The on-chip LCD driver requires many pins, some

of which are dedicated for LCD functionality, and others that

can be configured as LCD or general-purpose inputs/outputs.

Due to the limited number of I/O pins, the ADE7566/ADE7569/

ADE7166/ADE7169 do not allow access to external code and

data spaces.

General-Purpose RAM

General-purpose RAM resides in the 0x00 through 0xFF

memory locations. It contains the register banks.

0x7F

GENERAL-PURPOSE

AREA

0x30

0x2F

BIT-ADDRESSABLE

BANKS

(BIT ADDRESSES)

SELECTED

VIA

BITS IN PSW

The ADE7566/ADE7569/ADE7166/ADE7169 provide 20 pins

that can be used for general-purpose I/O. These pins are mapped

to Port 0, Port 1, and Port 2. They are accessed through three bit-

addressable 8052 SFRs, P0, P1, and P2. Another enhanced

feature of the ADE7566/ADE7569/ADE7166/ADE7169 is that

the weak pull-ups standard on 8052 Port 1, Port 2, and Port 3

can be disabled to make open drain outputs, as is standard on

Port 0. The weak pull-ups can be enabled on a pin-by-pin basis.

See the I/O Ports section.

0x20

0x18

0x10

0x08

0x00

0x1F

11

10

01

00

0x17

0x0F

0x07

FOUR BANKS OF EIGHT

REGISTERS R0 TO R7

RESET VALUE OF

STACK POINTER

Figure 82. Lower 128 Bytes of Internal Data Memory

Rev. A | Page 81 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Address 0x80 through Address 0xFF of general-purpose RAM

are shared with the special function registers. The mode of

addressing determines which memory space is accessed, as

shown in Figure 83.

labeled as bit-addressable and the bit addresses are given in the

SFR Mapping section.

Extended Internal RAM (XRAM)

The ADE7566/ADE7569/ADE7166/ADE7169 provide 256

bytes of extended on-chip RAM. No external RAM is

supported. This RAM is located in Address 0x0000 through

Address 0x00FF in the extended RAM space. To select the

extended RAM memory space, the extended indirect addressing

modes are used. The internal XRAM is enabled in the

Configuration SFR (CFG, 0xAF) by writing 01 to CFG[1:0].

0x00FF

0xFF

ACCESSIBLE BY

INDIRECT ADDRESSING DIRECT ADDRESSING

ONLY

0x80

0x7F

ACCESSIBLE BY

DIRECT AND INDIRECT

ADDRESSING

0x00

GENERAL-PURPOSE RAM

SPECIAL FUNCTION REGISTERS (SFRs)

256 BYTES OF

EXTENDED INTERNAL

RAM (XRAM)

Figure 83. General-Purpose RAM and SFR Memory Address Overlap

Both direct and indirect addressing can be used to access general-

purpose RAM from 0x00 through 0x7F. However, only indirect

addressing can be used to access general-purpose RAM from

0x80 through 0xFF because this address space shares the same

space with the special function registers (SFRs).

0x0000

Figure 85. Extended Internal RAM (XRAM) Space

Code Memory

Code and data memory are stored in the 16 kB flash memory

space. No external code memory is supported. To access code

memory, code indirect addressing is used.

The 8052 core also has the means to access individual bits of

certain addresses in the general-purpose RAM and special

function memory spaces. The individual bits of general-purpose

RAM Address 0x20 to Address 0x2F can be accessed through

their Bit Address 0x00 through Bit Address 0x7F. The benefit of

bit addressing is that the individual bits can be accessed quickly

without the need for bit masking, which takes more code memory

and execution time. The bit addresses for general-purpose RAM

Address 0x20 through Address 0x2F can be seen in Figure 84.

BYTE

ADDRESSING MODES

The 8052 core provides several addressing modes. The

addressing mode determines how the core interprets the

memory location or data value specified in assembly language

code. There are six addressing modes as shown in Table 63.

Table 63. 8052 Addressing Modes

Core Clock

Cycles

ADDRESS

BIT ADDRESSES (HEXA)

Addressing Mode Example

Bytes

0x2F

0x2E

0x2D

0x2C

0x2B

0x2A

0x29

0x28

0x27

0x26

0x25

0x24

0x23

0x22

0x21

0x20

7F 7E 7D 7C 7B 7A 79 78

77 76 75 74 73 72 71 70

6F 6E 6D 6C 6B 6A 69 68

67 66 65 64 63 62 61 60

5F 5E 5D 5C 5B 5A 59 58

57 56 55 54 53 52 51 50

4F 4E 4D 4C 4B 4A 49 48

47 46 45 44 43 42 41 40

3F 3E 3D 3C 3B 3A 39 38

37 36 35 34 33 32 31 30

2F 2E 2D 2C 2B 2A 29 28

27 26 25 24 23 22 21 20

1F 1E 1D 1C 1B 1A 19 18

17 16 15 14 13 12 11 10

0F 0E 0D 0C 0B 0A 09 08

07 06 05 04 03 02 01 00

Immediate

MOV A,#A8h

2

3

2

1

2

3

2

1

2

4

3

MOV DPTR,#A8h

MOV A,A8h

MOV A,IE

Direct

MOV A,R0

Indirect

MOV A,@R0

MOVX A,@DPTR

Extended Direct

Extended Indirect MOVX A,@R0

Code Indirect MOVC A,@A+DPTR

MOVC A,@A+PC

JMP @A+DPTR

Immediate Addressing

In immediate addressing, the expression entered after the

number sign (#) is evaluated by the assembler and stored in the

specified memory address. This number is referred to as a literal

because it refers only to a value and not to a memory location.

Figure 84. Bit Addressable Area of General-Purpose RAM

Bit addressing can be used for instructions that involve Boolean

variable manipulation and program branching (see the Instruction

Set section).

Instructions using this addressing mode are slower than those

between two registers because the literal must be stored and

fetched from memory. The expression can be entered as a

symbolic variable or an arithmetic expression; the value is

computed by the assembler.

Special Function Registers

Special function registers are registers that affect the function of

the 8052 core or its peripherals. These registers are located in

RAM in Address 0x80 through Address 0xFF. They are only

accessible through direct addressing as shown in Figure 83.

The individual bits of some SFRs can be accessed for use in

Boolean and program branching instructions. These SFRs are

Rev. A | Page 82 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Direct Addressing

These two instructions require a total of seven clock cycles and

four bytes of storage in the program memory.

With direct addressing, the value at the source address is moved

to the destination address. Direct addressing provides the fastest

execution time of all the addressing modes when an instruction

is performed between registers. Note that indirect or direct

addressing modes can be used to access general-purpose RAM

Address 0x00 through Address 0x7F. An instruction with direct

addressing that uses an address between 0x80 and 0xFF is

referring to a special function memory location.

Extended Indirect Addressing

The internal extended RAM is accessed through a pointer to the

address in indirect addressing mode. The ADE7566/ADE7569/

ADE7166/ADE7169 have 256 bytes of internal extended RAM,

accessed through MOVX instructions. External memory is not

supported on the devices.

In extended indirect addressing mode, a register holds the address

of the byte of extended RAM. The following code moves the

contents of extended RAM Address 0x80 to the accumulator:

Indirect Addressing

With indirect addressing, the value pointed to by the register is

moved to the destination address. For example, to move the

contents of internal RAM Address 0x82 to the accumulator, use

the following instructions:

MOV

R0,#80h

A,@R0

MOVX

These two instructions require six clock cycles and three bytes

of storage.

MOV

R0,#82h

A,@R0

Note that there are 256 bytes of extended RAM; therefore, both

extended direct and extended indirect addressing can cover the

whole address range. There is a storage and speed advantage to

using extended indirect addressing because the additional byte

of addressing available through the DPTR register that is not

needed is not stored.

These two instructions require a total of four clock cycles and

three bytes of storage in the program memory.

Indirect addressing allows addresses to be computed, which is

useful for indexing into data arrays stored in RAM.

Note that an instruction that refers to Address 0x00 through

Address 0x7F is referring to internal RAM, and indirect or

direct addressing modes can be used. An instruction with

indirect addressing that uses an address between 0x80 and 0xFF

is referring to internal RAM, not to an SFR.

From the three examples demonstrating the access of internal

RAM from 0x80 through 0xFF, and the access of extended

internal RAM from 0x00 through 0xFF, it can be seen that it is

most efficient to use the entire internal RAM accessible through

indirect access before moving to extended RAM.

Extended Direct Addressing

Code Indirect Addressing

The DPTR register (see Table 60) is used to access internal

extended RAM in extended indirect addressing mode. The

ADE7566/ADE7569/ADE7166/ADE7169 have 256 bytes of

XRAM, accessed through MOVX instructions. External memory

spaces are not supported on this device.

The internal code memory can be accessed indirectly. This can

be useful for implementing lookup tables and other arrays of

constants that are stored in flash. For example, to move the data

stored in flash memory at Address 0x8002 into the accumulator,

use the following code:

In extended direct addressing mode, the DPTR register points

to the address of the byte of extended RAM. The following code

moves the contents of extended RAM Address 0x100 to the

accumulator:

MOV

DPTR,#8002h

A

CLR

MOVX

A,@A+DPTR

MOV

DPTR,#100h

A,@DPTR

The accumulator can be used as a variable index into the array

of flash memory located at DPTR.

MOVX

Rev. A | Page 83 of 144

ADE7566/ADE7569/ADE7166/ADE7169

INSTRUCTION SET

Table 64 documents the number of clock cycles required for each instruction. Most instructions are executed in one or two clock cycles,

resulting in a 4-MIPS peak performance.

Table 64. Instruction Set

Mnemonic

ARITHMETIC

ADD A,Rn

ADD A,@Ri

ADD A,dir

ADD A,#data

ADDC A,Rn 1 1

ADDC A,@Ri

ADDC A,dir

ADD A,#data

SUBB A,Rn

SUBB A,@Ri

SUBB A,dir

SUBB A,#data

INC A

INC Rn

INC @

INC dir

INC DPTR

DEC A

DEC Rn

DEC @Ri

DEC dir

MUL AB

Description

Bytes

Cycles

Add Register to A.

Add Indirect Memory to A.

Add Direct Byte to A.

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

1

2

3

1

2

9

2

Add Immediate to A.

Add Register to A with Carry.

Add Indirect Memory to A with Carry.

Add Direct Byte to A with Carry.

Add Immediate to A with Carry.

Subtract Register from A with Borrow.

Subtract Indirect Memory from A with Borrow.

Subtract Direct from A with Borrow.

Subtract Immediate from A with Borrow.

Increment A.

Increment Register.

Ri Increment Indirect Memory.

Increment Direct Byte.

Increment Data Pointer.

Decrement A.

Decrement Register.

Decrement Indirect Memory.

Decrement Direct Byte.

Multiply A by B.

Divide A by B.

Decimal Adjust A.

DIV AB

DA A A

LOGIC

ANL A,Rn

ANL A,@Ri

ANL A,dir

ANL A,#data

ANL dir,A

ANL dir,#data

ORL A,Rn

ORL A,@Ri

ORL A,dir

ORL A,#data

ORL dir,A

ORL dir,#data

XRL A,Rn

XRL A,@Ri

XRL A,#data

XRL dir,A

XRL A,dir

XRL dir,#data

CLR A

AND Register to A.

AND Indirect Memory to A.

AND Direct Byte to A.

AND Immediate to A.

AND A to Direct Byte.

AND Immediate Data to Direct Byte.

OR Register to A.

OR Indirect Memory to A.

OR Direct Byte to A.

OR Immediate to A.

OR A to Direct Byte.

OR Immediate Data to Direct Byte.

Exclusive-OR Register to A.

Exclusive-OR Indirect Memory to A.

Exclusive-OR Immediate to A.

Exclusive-OR A to Direct Byte.

Exclusive-OR Indirect Memory to A.

Exclusive-OR Immediate Data To Direct.

Clear A.

1

2

3

1

2

3

1

2

3

1

2

3

1

2

3

1

2

3

1

CPL A

SWAP A

RL A

Complement A.

Swap Nibbles of A.

Rotate A Left.

Rev. A | Page 84 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Mnemonic

RLC A

RR A

Description

Bytes

Cycles

Rotate A Left Through Carry.

Rotate A Right.

Rotate A Right Through Carry.

1

RRC A

DATA TRANSFER

MOV A,Rn

MOV A,@Ri

MOV Rn,A

MOV @Ri,A

MOV A,dir

MOV A,#data

MOV Rn,#data

MOV dir,A

MOV Rn,dir

MOV dir,Rn

MOV @Ri,#data

MOV dir,@Ri

MOV @Ri,dir

MOV dir,dir

MOV dir,#data

MOV DPTR,#data

MOVC A,@A+DPTR

MOVC A,@A+PC

MOVX A,@Ri

MOVX A,@DPTR

MOVX @Ri,A

MOVX @DPTR,A

PUSH dir

Move Register to A.

Move Indirect Memory to A.

Move A to Register.

Move A to Indirect Memory.

Move Direct Byte to A.

Move Immediate to A.

Move Register to Immediate.

Move A to Direct Byte.

Move Register to Direct Byte.

Move Direct to Register.

Move Immediate to Indirect Memory.

Move Indirect to Direct Memory.

Move Direct to Indirect Memory.

Move Direct Byte to Direct Byte.

Move Immediate to Direct Byte.

Move Immediate to Data Pointer.

Move Code Byte Relative DPTR to A.

Move Code Byte Relative PC to A 1.

Move External (A8) Data to A.

Move External (A16) Data to A.

Move A to External Data (A8).

Move A to External Data (A16).

Push Direct Byte onto Stack.

Pop Direct Byte from Stack.

Exchange A and Register.

1

2

3

1

2

1

2

1

2

1

2

3

4

2

1

2

POP dir

XCH A,Rn

XCH A,@Ri

XCHD A,@Ri

XCH A,dir

Exchange A and Indirect Memory.

Exchange A and Indirect Memory Nibble.

Exchange A and Direct Byte.

BOOLEAN

CLR C

CLR bit

SETB C

SETB bit

CPL C

CPL bit

ANL C,bit

ANL C,/bit

ORL C,bit

ORL C,/bit OR

MOV C,bit

MOV bit,C

BRANCHING

JMP @A+DPTR

RET

Clear Carry.

Clear Direct Bit.

Set Carry.

Set Direct Bit.

Complement Carry.

Complement Direct Bit.

AND Direct Bit and Carry.

AND Direct Bit Inverse to Carry.

OR Direct Bit And Carry.

Direct Bit Inverse to Carry.

Move Direct Bit to Carry.

Move Carry to Direct Bit.

1

2

1

2

1

2

1

2

1

2

1

2

Jump Indirect Relative to DPTR.

Return from Subroutine.

Return from Interrupt.

Absolute Jump to Subroutine.

Absolute Jump Unconditional.

Short Jump (Relative Address).

Jump on Carry Equal to 1.

1

2

3

4

3

RETI

ACALL addr11

AJMP addr11

SJMP rel

JC rel

Rev. A | Page 85 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Mnemonic

JNC rel

JZ rel

JNZ rel

DJNZ Rn,rel

LJMP

LCALL addr16

JB bit,rel

JNB bit,rel

Description

Bytes

Cycles

Jump on Carry Equal to 0.

Jump on Accumulator = 0.

Jump on Accumulator Not Equal to 0.

Decrement Register, JNZ Relative.

Long Jump Unconditional.

Long Jump to Subroutine.

Jump on Direct Bit = 1.

Jump on Direct Bit = 0.

Jump on Direct Bit = 1 and Clear.

Compare A, Direct JNE Relative.

Compare A, Immediate JNE Relative.

Compare Register, Immediate JNE Relative.

Compare Indirect, Immediate JNE Relative.

Decrement Direct Byte, JNZ Relative.

2

3

4

JBC bit,rel

CJNE A,dir,rel

CJNE A,#data,rel

CJNE Rn,#data,rel

CJNE @Ri,#data,rel

DJNZ dir,rel

MISCELLANEOUS

NOP

No Operation.

1

READ-MODIFY-WRITE INSTRUCTIONS

INSTRUCTIONS THAT AFFECT FLAGS

Some 8052 instructions read the latch and others read the pin.

The state of the pin is read for instructions that input a port bit.

Instructions that read the latch rather than the pins are the ones

that read a value, possibly change it, and rewrite it to the latch.

Because these instructions involve modifying the port, it is

assumed that the pins being modified are outputs, so the output

state of the pin is read from the latch. This prevents a possible

misinterpretation of the voltage level of a pin. For example, if a

port pin is used to drive the base of a transistor, a 1 is written to

the bit to turn on the transistor. If the CPU reads the same port

bit at the pin rather than the latch, it reads the base voltage of

the transistor and interprets it as Logic 0. Reading the latch

rather than the pin returns the correct value of 1.

Many instructions explicitly modify the carry bit, such as the

MOV C bit and CLR C instructions. Other instructions that

affect status flags are listed in this section.

ADD A, Source

This instruction adds the source to the accumulator. No status

flags are referenced by the instruction.

Affected Status Flags

C

Set if there is a carry out of Bit 7. Cleared otherwise.

Used to indicate an overflow if the operands are

unsigned.

OV

Set if there is a carry out of Bit 6 or a carry out of

Bit 7, but not if both are set. Used to indicate an

overflow for signed addition. This flag is set if two

positive operands yield a negative result or if two

negative operands yield a positive result.

The instructions that read the latch rather than the pins are

called read-modify-write instructions and are listed in Table 65.

When the destination operand is a port or a port bit, these

instructions read the latch rather than the pin.

AC

Set if there is a carry out of Bit 3. Cleared otherwise.

Table 65. Read-Modify-Write Instructions

Instruction

Example

ANL P0,A

ORL P1,A

XRL P2,A

Description

Logical AND.

Logical OR.

ADDC A, Source

ANL

This instruction adds the source and the carry bit to the accu-

mulator. The carry status flag is referenced by the instruction.

ORL

XRL

Logical EX-OR.

Affected Status Flags

JBC

JBC P1.1,LABEL Jump if Bit = 1 and Clear Bit.

CPL

CPL P2.0

INC P2

Complement Bit.

Increment.

C

Set if there is a carry out of Bit 7. Cleared otherwise.

Used to indicate an overflow if the operands are

unsigned.

INC

DEC

DEC P2

Decrement.

DJNZ

DJNZ P0,LABEL Decrement and Jump if Not Zero.

OV

Set if there is a carry out of Bit 6 or a carry out of Bit 7,

but not if both are set. Used to indicate an overflow

for signed addition. This flag is set if two positive

operands yield a negative result or if two negative

operands yield a positive result.

MOV PX.Y,C¹MOV P0.0,C

CLR PX.Y¹

SETB PX.Y¹

¹These instructions read the port byte (all 8 bits), modify the addressed bit,

and write the new byte back to the latch.

Move Carry to Bit Y of Port X.

Clear Bit Y of Port X.

CLR P0.0

SETB P0.0

Set Bit Y of Port X.

AC

Set if there is a carry out of Bit 3. Cleared otherwise.

Rev. A | Page 86 of 144

ADE7566/ADE7569/ADE7166/ADE7169

SUBB A, Source

of Bit 0 to Bit 3 exceeds nine, 0x06 is added to the accumulator

to correct the lower four bits. If the carry bit is set when the

instruction begins, or if 0x06 is added to the accumulator in the

first step, 0x60 is added to the accumulator to correct the higher

four bits.

This instruction subtracts the source byte and the carry

(borrow) flag from the accumulator. It references the carry

(borrow) status flag.

Affected Status Flags

The carry and AC status flags are referenced by this instruction.

C

Set if there is a borrow needed for Bit 7. Cleared

otherwise. Used to indicate an overflow if the

operands are unsigned.

Affected Status Flag

C

Set if the result is greater than 0x99. Cleared otherwise.

OV

Set if there is a borrow needed for Bit 6 or Bit 7, but

not for both. Used to indicate an overflow for signed

subtraction. This flag is set if a negative number

subtracted from a positive yields a negative result or

if a positive number subtracted from a negative

number yields a positive result.

RRC A

This instruction rotates the accumulator to the right through

the carry flag. The old LSB of the accumulator becomes the new

carry flag, and the old carry flag is loaded into the new MSB of

the accumulator.

The carry status flag is referenced by this instruction.

AC

Set if a borrow is needed for Bit 3. Cleared otherwise.

Affected Status Flag

MUL AB

C

Equal to the state of ACC.0 before execution of the

instruction.

This instruction multiplies the accumulator by the B register.

This operation is unsigned. The lower byte of the 16-bit product

is stored in the accumulator and the higher byte is left in the B

register. No status flags are referenced by the instruction.

RLC A

This instruction rotates the accumulator to the left through the

carry flag. The old MSB of the accumulator becomes the new

carry flag, and the old carry flag is loaded into the new LSB of

the accumulator.

Affected Status Flags

C

Cleared

The carry status flag is referenced by this instruction.

OV

Set if the result is greater than 255. Cleared otherwise.

Affected Status Flag

DIV AB

C

Equal to the state of ACC.7 before execution of the

instruction.

This instruction divides the accumulator by the B register. This

operation is unsigned. The integer part of the quotient is stored

in the accumulator and the remainder goes into the B register.

No status flags are referenced by the instruction.

CJNE Destination, Source, Relative Jump

This instruction compares the source value to the destination

value and branches to the location set by the relative jump if

they are not equal. If the values are equal, program execution

continues with the instruction after the CJNE instruction.

Affected Status Flags

C

Cleared

OV

Cleared unless the B register is equal to 0, in which

case the results of the division are undefined and the

OV flag is set.

No status flags are referenced by this instruction.

Affected Status Flag

C

Set if the source value is greater than the destination

value. Cleared otherwise.

DA A

This instruction adjusts the accumulator to hold two 4-bit digits

after the addition of two binary coded decimals (BCDs) with

the ADD or ADDC instructions. If the AC bit is set or if the value

Rev. A | Page 87 of 144

ADE7566/ADE7569/ADE7166/ADE7169

DUAL DATA POINTERS

MOV DPTR,#0

;Main DPTR = 0

Each ADE7566/ADE7569/ADE7166/ADE7169 incorporates

two data pointers. The second data pointer is a shadow data

pointer and is selected via the Data Pointer Control SFR (DPCON,

0xA7). DPCON features automatic hardware postincrement and

postdecrement, as well as an automatic data pointer toggle.

MOV DPCON,#55H

;Select shadow DPTR

;DPTR1 increment mode

;DPTR0 increment mode

;DPTR auto toggling ON

MOV DPTR,#0D000H ;DPTR = D000H

MOVELOOP: CLR A

Note that this section of the data sheet is the only place where

the main and shadow data pointers are distinguished. Whenever

the data pointer (DPTR) is mentioned elsewhere in the data

sheet, active DPTR is implied.

MOVC A,@A+DPTR

;Post Inc DPTR

;Get data

In addition, only the MOVC/MOVX @DPTR instructions

automatically postincrement and postdecrement the DPTR.

Other MOVC/MOVX instructions, such as MOVC PC

or MOVC @Ri, do not cause the DPTR to automatically

postincrement and postdecrement.

;Swap to Main DPTR(Data)

MOVX @DPTR,A

;Put ACC in XRAM

;Increment main DPTR

;Swap Shadow DPTR(Code)

MOV A, DPL

To illustrate the operation of DPCON, the following code copies

256 bytes of code memory at Address 0xD000 into XRAM,

starting from Address 0x0000:

JNZ MOVELOOP

Table 66. Data Pointer Control SFR (DPCON, 0xA7)

Bit

Mnemonic

Default Description

7

0

Not Implemented. Write Don’t Care.

6

DPT

Data Pointer Automatic Toggle Enable. Cleared by the user to disable autoswapping of the DPTR.

Set in user software to enable automatic toggling of the DPTR after each MOVX or MOVC instruction.

5, 4

DP1m1,

DP1m0

0

Shadow Data Pointer Mode. These bits enable extra modes of the shadow data pointer operation,

allowing more compact and more efficient code size and execution.

DP1m1

DP1m0

Result (Behavior of the Shadow Data Pointer)

8052 behavior.

DPTR is postincremented after a MOVX or a MOVC instruction.

DPTR is postdecremented after a MOVX or MOVC instruction.

DPTR LSB is toggled after a MOVX or MOVC instruction. This instruction can be

useful for moving 8-bit blocks to/from 16-bit devices.

0

1

0

1

0

1

3, 2

DP0m1,

DP0m0

0

Main Data Pointer Mode. These bits enable extra modes of the main data pointer operation, allowing

more compact and more efficient code size and execution.

DP0m1

DP0m0

Result (Behavior of the Main Data Pointer)

8052 behavior.

DPTR is postincremented after a MOVX or a MOVC instruction.

DPTR is postdecremented after a MOVX or MOVC instruction.

DPTR LSB is toggled after a MOVX or MOVC instruction. This instruction is useful

for moving 8-bit blocks to/from 16-bit devices.

0

1

0

1

0

1

0

Not Implemented. Write Don’t Care.

DPSEL

Data Pointer Select. Cleared by the user to select the main data pointer, meaning that the contents of

this 16-bit register are placed into the DPL SFR and DPH SFR. Set by the user to select the shadow data

pointer, meaning that the contents of a separate 16-bit register appear in the DPL SRF and DPH SFR.

Rev. A | Page 88 of 144

ADE7566/ADE7569/ADE7166/ADE7169

INTERRUPT SYSTEM

The unique power management architecture of the ADE7566/

ADE7569/ADE7166/ADE7169 includes an operating mode

(PSM2) where the 8052 MCU core is shut down. Events can be

configured to wake the 8052 MCU core from the PSM2

operating mode. A distinction is drawn here between events

that can trigger the wake-up of the 8052 MCU core and events

that can trigger an interrupt when the MCU core is active.

Events that can wake the core are referred to as wake-up events,

whereas events that can interrupt the program flow when the

MCU is active are called interrupts. See the 3.3 V Peripherals

and Wake-Up Events section to learn more about events that

can wake the 8052 core from PSM2.

occur at the same time, the Priority 1 interrupt is serviced first.

An interrupt cannot be interrupted by another interrupt of the

same priority level. If two interrupts of the same priority level

occur simultaneously, a polling sequence is observed. See the

Interrupt Priority section.

INTERRUPT ARCHITECTURE

The ADE7566/ADE7569/ADE7166/ADE7169 possess advanced

power supply monitoring features. To ensure a fast response to

time-critical power supply issues, such as a loss of line power,

the power supply monitoring interrupt should be able to

interrupt any interrupt service routine. To enable the user to have

full use of the standard 8052 interrupt priority levels, an additional

priority level is added for the power supply management (PSM)

interrupt. The PSM interrupt is the only interrupt at this highest

interrupt priority level.

The ADE7566/ADE7569/ADE7166/ADE7169 provide 12

interrupt sources with three priority levels. The power

management interrupt is at the highest priority level. The other

two priority levels are configurable through the Interrupt

Priority SFR (IP, 0xB8) and Interrupt Enable and Priority 2 SFR

(IEIP2, 0xA9).

HIGH

PSM

PRIORITY 1

PRIORITY 0

LOW

STANDARD 8052 INTERRUPT ARCHITECTURE

Figure 87. Interrupt Architecture

The 8052 standard interrupt architecture includes two tiers of

interrupts, where some interrupts are assigned a high priority

and others are assigned a low priority.

See the Power Supply Monitor Interrupt (PSM) section for

more information on the PSM interrupt.

HIGH

PRIORITY 1

INTERRUPT REGISTERS

PRIORITY 0

LOW

The control and configuration of the interrupt system is carried

out through four interrupt-related SFRs discussed in this section.

Figure 86. Standard 8052 Interrupt Priority Levels

A Priority 1 interrupt can interrupt the service routine of a

Priority 0 interrupt, and if two interrupts of different priorities

Table 67. Interrupt SFRs

SFR

Address Default Bit Addressable Description

IE

0xA8

0xB8

0xA9

0x00

0xA0

0x10

Yes

No

Yes

Interrupt Enable (see Table 68).

IP

Interrupt Priority (see Table 69).

IEIP2

Interrupt Enable and Priority 2 (see Table 70).

WDCON 0xC0

Watchdog Timer (see Table 75 and the Writing to the Watchdog Timer SFR (WDCON,

0xC0) section).

Table 68. Interrupt Enable SFR (IE, 0xA8)

Bit Address Mnemonic Description

7

6

5

4

3

2

1

0

0xAF

0xAE

0xAD

0xAC

0xAB

0xAA

0xA9

0xA8

EA

Enables All Interrupt Sources. Set by the user. Cleared by the user to disable all interrupt sources.

Enables the Temperature ADC Interrupt. Set by the user.

Enables the Timer 2 Interrupt. Set by the user.

ETEMP

ET2

ES

Enables the UART Serial Port Interrupt. Set by the user.

Enables the Timer 1 Interrupt. Set by the user.

ET1

EX1

ET0

EX0

Enables the External Interrupt 1 (INT1). Set by the user.

Enables the Timer 0 Interrupt. Set by the user.

Enables External Interrupt 0 (INT0). Set by the user.

Rev. A | Page 89 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 69. Interrupt Priority SFR (IP, 0xB8)

Bit

Address

Mnemonic

PADE

PTEMP

PT2

Description

7

0xBF

ADE Energy Measurement Interrupt Priority (1 = high, 0 = low).

Temperature ADC Interrupt Priority (1 = high, 0 = low).

Timer 2 Interrupt Priority (1 = high, 0 = low).

UART Serial Port Interrupt Priority (1 = high, 0 = low).

Timer 1 Interrupt Priority (1 = high, 0 = low).

INT1 (External Interrupt 1) Priority (1 = high, 0 = low).

Timer 0 Interrupt Priority (1 = high, 0 = low).

INT0 (External Interrupt 0) Priority (1 = high, 0 = low).

6

0xBE

5

0xBD

0xBC

0xBB

0xBA

0xB9

4

PS

3

PT1

2

PX1

1

PT0

0

0xB8

PX0

Table 70. Interrupt Enable and Priority 2 SFR (IEIP2, 0xA9)

Bit

Mnemonic

Description

7

Reserved

6

PTI

RTC Interrupt Priority (1 = high, 0 = low).

5

Reserved

4

PSI

SPI/I²C Interrupt Priority (1 = high, 0 = low).

Enables the Energy Metering Interrupt (ADE). Set by the user.

Enables the RTC Interval Timer Interrupt. Set by the user.

Enables the PSM Power Supply Management Interrupt. Set by the user.

Enables the SPI/I²C Interrupt. Set by the user.

3

EADE

ETI

2

1

EPSM

ESI

0

INTERRUPT PRIORITY

If two interrupts of the same priority level occur simultaneously, the polling sequence is observed (as shown in Table 71).

Table 71. Priority Within Interrupt Level

Source

IPSM

IRTC

Priority

Description

0 (Highest)

Power Supply Monitor Interrupt.

RTC Interval Timer Interrupt.

ADE Energy Measurement Interrupt.

Watchdog Timer Overflow Interrupt.

Temperature ADC Interrupt.

External Interrupt 0.

1

IADE

WDT

ITEMP

IE0

2

3

4

5

TF0

6

Timer/Counter 0 Interrupt.

External Interrupt 1.

IE1

7

TF1

8

Timer/Counter 1 Interrupt.

SPI/I²C Interrupt.

ISPI/I2CI

RI/TI

9

10

UART Serial Port Interrupt.

Timer/Counter 2 Interrupt.

TF2/EXF2

11 (Lowest)

Rev. A | Page 90 of 144

ADE7566/ADE7569/ADE7166/ADE7169

INTERRUPT FLAGS

The interrupt flags and status flags associated with the interrupt vectors are shown in Table 72 and Table 73. Most of the interrupts have

flags associated with them.

Table 72. Interrupt Flags

Interrupt Source

Flag

Bit Address Description

IE0

TCON.1

TCON.5

TCON.3

TCON.7

SCON.1

SCON.0

T2CON.7

T2CON.6

IE0

TF0

IE1

TF1

TI

External Interrupt 0.

TF0

IE1

Timer 0.

External Interrupt 1.

TF1

RI + TI

Timer 1.

Transmit Interrupt.

RI

Receive Interrupt.

TF2 + EXF2

TF2

EXF2

Timer 2 Overflow Flag.

Timer 2 External Flag.

ITEMP (Temperature ADC)

IPSM (Power Supply)

Temperature ADC Interrupt. Does not have an interrupt flag associated with it.

PSM Interrupt Flag.

IPSMF.6

FPSM

IADE (Energy Measurement DSP)

MIRQSTL.7

Read MIRQSTH, MIRQSTM, MIRQSTL.

Table 73. Status Flags

Interrupt Source

ITEMP (Temperature ADC)

ISPI/I2CI

Flag

SPI2CSTAT

Bit Address Description

Temperature ADC Interrupt. Does not have a status flag associated with it.

SPI Interrupt Status Register.

I²C Interrupt Status Register.

RTC Midnight Flag.

SPI2CSTAT

TIMECON.7

TIMECON.2

WDCON.2

IRTC (RTC Interval Timer)

WDT (Watchdog Timer)

RTC Alarm Flag.

WDS

Watchdog Timeout Flag.

A functional block diagram of the interrupt system is shown in

Figure 88. Note that the PSM interrupt is the only interrupt in

the highest priority level.

interrupt. Similarly, clearing the I²C/SPI status bits in the SPI

Interrupt Status SFR (SPISTAT, 0xEA) does not cancel a

pending I²C/SPI interrupt. These interrupts remain pending

until the RTC or I²C/SPI interrupt vectors are enabled. Their

respective interrupt service routines are entered shortly

thereafter.

If an external wake-up event occurs to wake the ADE7566/

ADE7569/ADE7166/ADE7169 from PSM2, a pending external

interrupt is generated. When the EX0 or EX1 bit in the Interrupt

Enable SFR (IE, 0xA8) is set to enable external interrupts, the

program counter is loaded with the IE0 or IE1 interrupt vector.

The IE0 and IE1 interrupt flags in the TCON register are not

affected by events that occur when the 8052 MCU core is shut

down during PSM2. See the Power Supply Monitor Interrupt

(PSM) section.

The RTC, temperature ADC, and I²C/SPI interrupts are latched

such that pending interrupts cannot be cleared without entering

their respective interrupt service routines. Clearing the RTC

midnight flags and alarm flags does not clear a pending RTC

Figure 88 shows how the interrupts are cleared when the

interrupt service routines are entered. Some interrupts with

multiple interrupt sources are not automatically cleared;

specifically, the PSM, ADE, UART, and Timer 2 interrupt

INT0

INT1

vectors. Note that the

and

interrupts are only

cleared if the external interrupt is configured to be triggered by

a falling edge by setting IT0 in the Timer/Counter 0 and

INT0 INT1

Timer/Counter 1 Control SFR (TCON, 0x88). If

or

is configured to interrupt on a low level, the interrupt service

routine is reentered until the respective pin goes high.

Rev. A | Page 91 of 144

ADE7566/ADE7569/ADE7166/ADE7169

PRIORITY LEVEL

IE/IEIP2 REGISTERS

IP/IEIP2 REGISTERS

LOW

HIGH HIGHEST

IPSMF

IPSME

FPSM

(IPSMF.6)

PSM

IN OUT

LATCH

MIDNIGHT

ALARM

RTC

RESET

MIRQSTH MIRQSTM MIRQSTL

MIRQENH MIRQENM MIRQENL

ADE

MIRQSTL.7

WATCHDOG TIMEOUT

WDIR

WATCHDOG

TEMP ADC

IN OUT

LATCH

TEMPADC INTERRUPT

RESET

PSM2

IT0

0

INT0

EXTERNAL

INTERRUPT 0

IE0

1

IT0

TF0

INTERRUPT

POLLING

SEQUENCE

TIMER 0

PSM2

IE1

IT1

0

EXTERNAL

INTERRUPT 1

INT1

1

IT1

TF1

TIMER 1

CFG.5

SPI INTERRUPT

IN OUT

LATCH

1

2

I C/SPI

2

I C INTERRUPT

RESET

0

RI

TI

UART

TF2

TIMER 2

EXF2

INDIVIDUAL

INTERRUPT

ENABLE

LEGEND

AUTOMATIC

CLEAR SIGNAL

GLOBAL

INTERRUPT

ENABLE (EA)

Figure 88. Interrupt System Functional Block Diagram

Rev. A | Page 92 of 144

ADE7566/ADE7569/ADE7166/ADE7169

INTERRUPT VECTORS

CONTEXT SAVING

When an interrupt occurs, the program counter is pushed onto the

stack, and the corresponding interrupt vector address is loaded into

the program counter. When the interrupt service routine is

complete, the program counter is popped off the stack by a RETI

instruction. This allows program execution to resume from where

it was interrupted. The interrupt vector addresses are shown in

Table 74.

When the 8052 vectors to an interrupt, only the program counter

is saved on the stack. Therefore, the interrupt service routine

must be written to ensure that registers used in the main

program are restored to their pre-interrupt state. Common

registers that can be modified in the ISR are the accumulator

register and the PSW register. Any general-purpose registers

that are used as scratch pads in the ISR should also be restored

before exiting the interrupt. The following example 8052 code

shows how to restore some commonly used registers:

Table 74. Interrupt Vector Addresses

Source

Vector Address

0x0003

0x000B

0x0013

0x001B

0x0023

0x002B

0x0033

0x003B

0x0043

0x004B

0x0053

0x005B

GeneralISR:

IE0

; save the current Accumulator value

TF0

PUSH

ACC

IE1

; save the current status and register bank

selection

TF1

RI + TI

PUSH

PSW

TF2 + EXF2

ITEMP (Temperature ADC)

ISPI/I2CI

; service interrupt

…

IPSM (Power Supply)

IADE (Energy Measurement DSP)

IRTC (RTC Interval Timer)

WDT (Watchdog Timer)

; restore the status and register bank

selection

POP

PSW

INTERRUPT LATENCY

; restore the accumulator

The 8052 architecture requires that at least one instruction

execute between interrupts. To ensure this, the 8052 MCU

core hardware prevents the program counter from jumping to

an ISR immediately after completing a RETI instruction or an

access of the IP and IE registers.

POP

ACC

RETI

The shortest interrupt latency is 3.25 instruction cycles, 800 ns

with a clock of 4.096 MHz. The longest interrupt latency for a

high priority interrupt results when a pending interrupt is

generated during a low priority interrupt RETI, followed by a

multiply instruction. This results in a maximum interrupt

latency of 16.25 instruction cycles, 4 μs with a clock of 4.096 MHz.

Rev. A | Page 93 of 144

ADE7566/ADE7569/ADE7166/ADE7169

WATCHDOG TIMER

The watchdog timer generates a device reset or interrupt within

a reasonable amount of time if the ADE7566/ADE7569/

ADE7166/ADE7169 enter an erroneous state, possibly due to a

programming error or electrical noise. The watchdog is enabled

by default with a timeout of two seconds and creates a system reset

if not cleared within two seconds. The watchdog function can be

disabled by clearing the watchdog enable bit (WDE) in the

Watchdog Timer SFR (WDCON, 0xC0).

The WDCON SFR can be written only by user software if the

double write sequence described in Table 75 is initiated on

every write access to the WDCON SFR.

To prevent any code from inadvertently disabling the watchdog, a

watchdog protection can be activated. This watchdog protection

locks in the watchdog enable and event settings so they cannot

be changed by user code. The protection is activated by clearing

a watchdog protection bit in the flash memory. The watchdog

protection bit is the most significant bit at Address 0x3FFA of

the flash memory. When this bit is cleared, the WDIR bit is forced

to 0, and the WDE bit is forced to 1. Note that the sequence for

configuring the flash protection bits must be followed to modify

the watchdog protection bit at Address 0x3FFA (see the

Protecting the Flash Memory section).

The watchdog circuit generates a system reset or interrupt

(WDS) if the user program fails to set the WDE bit within a

predetermined amount of time (set by the PRE[3:0] bits).

The watchdog timer is clocked from the 32.768 kHz external

crystal connected between the CLKIN and CLKOUT pins.

Table 75. Watchdog Timer SFR (WDCON, 0xC0)

Bit

Address

Mnemonic Default Description

7 to 4

0xC7 to

0xC4

PRE[3:0]

7

Watchdog Prescaler. In normal mode, the 16-bit watchdog timer is clocked by the input

clock (32.768 kHz). The PREx bits set which of the upper bits of the counter are used as the

watchdog output as follows:

2⁹

t_WATCHDOG= 2^PRE

×

CLKIN

PRE[3:0]

Result (Watchdog Timeout)

0000

15.6 ms

0001

31.2 ms

0010

62.5 ms

0011

125 ms

0100

250 ms

0101

500 ms

0110

1 sec

0111

2 sec

1000

1001

1010 to 1111

0, automatic reset

0, serial download reset

Not a valid selection

3

2

0xC3

0xC2

WDIR

WDS

0

Watchdog Interrupt Response Bit. When cleared, the watchdog generates a system reset

when the watchdog time out period has expired. When set, the watchdog generates an

interrupt when the watchdog time out period has expired.

Watchdog Status Bit. This bit is set to indicate that a watchdog timeout has occurred. It is

cleared by writing a 0 or by an external hardware reset. A watchdog reset does not clear

WDS; therefore, it can be used to distinguish between a watchdog reset and a hardware

reset from the RESET pin.

1

0

0xC1

0xC0

WDE

1

0

Watchdog Enable Bit. When set, this bit enables the watchdog and clears its counter. The

watchdog counter is subsequently cleared again whenever WDE is set. If the watchdog is

not cleared within its selected timeout period, it generates a system reset or watchdog

interrupt, depending on the WDIR bit.

WDWR

Watchdog Write Enable Bit. See the Writing to the Watchdog Timer SFR (WDCON, 0xC0)

section.

Rev. A | Page 94 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 76. Watchdog and Flash Protection Byte in Flash (Flash Address = 0x3FFA)

Bit

Mnemonic

Default Description

7

WDPROT_PROTKY7

1

This bit holds the protection for the watchdog timer and the 7^thbit of the flash protection key.

When this bit is cleared, the watchdog enable and event bits WDE and WDIR cannot be changed

by user code. The watchdog configuration is then fixed to WDIR = 0 and WDE = 1. The watchdog

timeout in PRE[3:0] can still be modified by user code.

The value of this bit is also used to set the flash protection key. If this bit is cleared to protect the

watchdog, then the default value for the flash protection key is 0x7F instead of 0xFF (see the

Protecting the Flash Memory section for more information on how to clear this bit).

6 to 0

PROTKY[7:0]

0xFF

These bits hold the flash protection key. The content of this flash address is compared to the

Flash Protection Key SFR (PROTKY, 0xBB) when the protection is being set or changed. If the two

values match, the new protection is written to the flash Address 0x3FFF to Address 0x3FFB. See

the Protecting the Flash Memory section for more information on how to configure these bits.

Watchdog Timer Interrupt

Writing to the Watchdog Timer SFR (WDCON, 0xC0)

If the watchdog timer is not cleared within the watchdog timeout

period, a system reset occurs unless the watchdog timer interrupt

is enabled. The watchdog timer interrupt enable bit (WDIR) is

located in the Watchdog Timer SFR (WDCON, 0xC0). Enabling

the WDIR bit allows the program to examine the stack or other

variables that may have led the program to execute inappropriate

code. The watchdog timer interrupt also allows the watchdog to

be used as a long interval timer.

Writing data to the WDCON SFR involves a double instruction

sequence. The WDWR bit must be set and the following

instruction must be a write instruction to the WDCON SFR.

Disable Watch dog

CLR EA

SETB WDWR

CLR WDE

SETB EA

Note that WDIR is automatically configured as a high priority

interrupt. This interrupt cannot be disabled by the EA bit in the

IE register (see Table 68). Even if all of the other interrupts are

disabled, the watchdog is kept active to watch over the program.

This sequence is necessary to protect the WDCON SFR from

code execution upsets that may unintentionally modify this

SFR. Interrupts should be disabled during this operation due to

the consecutive instruction cycles.

Rev. A | Page 95 of 144

ADE7566/ADE7569/ADE7166/ADE7169

LCD DRIVER

LCD REGISTERS

There are six LCD control registers that configure the driver for

the specific type of LCD in the end system and set up the user

display preferences. The LCD Configuration SFR (LCDCON,

0x95), LCD Configuration X SFR (LCDCONX, 0x9C), and

LCD Configuration Y SFR (LCDCONY, 0xB1) contain general

LCD driver configuration information including the LCD enable

and reset, as well as the method of LCD voltage generation and

multiplex level. The LCD Clock SFR (LCDCLK, 0x96) configures

timing settings for LCD frame rate and blink rate. LCD pins are

configured for LCD functionality in the LCD Segment Enable

SFR (LCDSEGE, 0x97) and LCD Segment Enable 2 SFR

(LCDSEGE2, 0xED).

Using shared pins, the LCD module is capable of directly driving an

LCD panel of 17 × 4 segments without compromising any

ADE7566/ADE7569/ADE7166/ADE7169 functions. It is

capable of driving LCDs with 2×, 3×, and 4× multiplexing. The

LCD waveform voltages generated through internal charge

pump circuitry support up to 5 V LCDs. An external resistor

ladder for LCD waveform voltage generation is also supported.

Each ADE7566/ADE7569/ADE7166/ADE7169 has an embedded

LCD control circuit, driver, and power supply circuit. The LCD

module is functional in all operating modes (see the Operating

Modes section).

Table 77. LCD Driver SFRs

SFR Address

R/W

Name

Description

0x95

LCDCON

LCDCLK

LCD Configuration SFR (see Table 78).

LCD Clock (see Table 82).

0x96

0x97

LCDSEGE

LCDCONX

LCDPTR

LCD Segment Enable (see Table 85).

LCD Configuration X (see Table 79).

LCD Pointer (see Table 86).

0x9C

0xAC

0xAE

LCDDAT

LCDCONY

LCDSEGE2

LCD Data (see Table 87).

0xB1

LCD Configuration Y (see Table 81).

LCD Segment Enable 2 (see Table 88).

0xED

Table 78. LCD Configuration SFR (LCDCON, 0x95)

Bit

Mnemonic Value Description

7

LCDEN

0

LCD Enable. If this bit is set, the LCD driver is enabled.

6

LCDRST

BLINKEN

LCD Data Registers Reset. If this bit is set, the LCD data registers are reset to zero.

5

Blink Mode Enable Bit. If this bit is set, blink mode is enabled. The blink mode is configured by the

BLKMOD[1:0] and BLKFREQ[1:0] bits in the LCD Clock SFR (LCDCLK, 0x96).

4

LCDPSM2

0

Forces LCD off when in PSM2 (Sleep Mode). Note that the internal voltage reference must be enabled by setting

the REF_BAT_EN bit in the Peripheral Configuration SFR (PERIPH, 0xF4) to allow LCD operation in PSM2.

LCDPSM2

Result

0

1

The LCD is disabled or enabled in PSM2 by the LCDEN bit.

The LCD is disabled in PSM2 regardless of LCDEN setting.

3

CLKSEL

BIAS

0

LCD Clock Selection.

CLKSEL

Result

0

1

f_LCDCLK= 2048 Hz

f_LCDCLK= 128 Hz

2

Bias Mode.

BIAS

Result

1/2

1/3

0

1

1 to 0

LMUX[1:0]

LCD Multiplex Level.

LMUX[1:0]

Result

00

01

10

11

Reserved.

2× Multiplexing. FP27/COM3 is used as FP27. FP28/COM2 is used as FP28.

3× Mulitplexing. FP27/COM3 is used as FP27. FP28/COM2 is used as COM2.

4× Multiplexing. FP27/COM3 is used as COM3. FP28/COM2 is used as COM2.

Rev. A | Page 96 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 79. LCD Configuration X SFR (LCDCONX, 0x9C)

Bit

Mnemonic

Reserved

EXTRES

Default

Description

7

0

Reserved.

6

External Resistor Ladder Selection Bit.

EXTRES

Result

0

1

External resistor ladder is disabled. Charge pump is enabled.

External resistor ladder is enabled. Charge pump is disabled.

5 to 0

BIASLVL[5:0]

0

Bias Level Selection Bits. See Table 80.

Table 80. LCD Bias Voltage When Contrast Control Is Enabled

1/2 Bias

V_C

1/3 Bias

V_C

BIASLVL[5]

V_A(V)

V_B

0

V_B= V_A

V_C= 2 × V_A

V_B= 2 × V_A

V_C= 3 × V_A

BLVL[4:0]

V_REF

×

31

1

V_B= V_A

V_C= 2 × V_A

V_B= 2 × V_A

V_C= 3 × V_A

BLVL

[

4:0]

⎛

⎝

⎞

⎟

⎠

V_REF× 1+

⎜

31

Table 81. LCD Configuration Y SFR (LCDCONY, 0xB1)

Bit

Mnemonic

Reserved

INV_LVL

Default

Description

7

0

This bit should be kept cleared for proper operation.

6

Frame Inversion Mode Enable Bit. If this bit is set, frames are inverted every other frame. If this bit is

cleared, frames are not inverted.

5 to 2

1

Reserved

0

These bits should be kept cleared for proper operation.

UPDATEOVER

Update Finished Flag Bit. This bit is updated by the LCD driver. When set, this bit indicates that the

LCD memory has been updated and a new frame has begun.

0

REFRESH

0

Refresh LCD Data Memory Bit. This bit should be set by the user. When set, the LCD driver does not

use the data in the LCD data registers to update the display. The LCD data registers can be updated

by the 8052. When cleared, the LCD driver uses the data in the LCD data registers to update display

at the next frame.

Table 82. LCD Clock SFR (LCDCLK, 0x96)

Bit

Mnemonic

Default

Description

7 to 6

BLKMOD[1:0]

0

Blink Mode Clock Source Configuration Bits.

BLKMOD[1:0]

Result

00

01

10

11

The blink rate is controlled by software. The display is off.

The blink rate is controlled by software. The display is on.

The blink rate is 2 Hz.

The blink rate is set by BLKFREQ[1:0].

5 to 4

BLKFREQ[1:0]

0

Blink Rate Configuration Bits. These bits control the LCD blink rate if BLKMOD[1:0] = 11.

BLKFREQ[1:0]

Result (Blink Rate)

1 Hz

00

01

10

11

1/2 Hz

1/3 Hz

1/4 Hz

3 to 0

FD[3:0]

LCD Frame Rate Selection Bits. See Table 83 and Table 84.

Rev. A | Page 97 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 83. LCD Frame Rate Selection for f_LCDCLK= 2048 Hz (LCDCON[3] = 0)

2× Multiplexing

3× Multiplexing

4× Multiplexing

Frame Rate (Hz)

FD3

0

FD2

0

FD1

0

FD0

1

f_LCD(Hz)

256

Frame Rate (Hz)

f_LCD(Hz)

341.3

256

Frame Rate (Hz)

170.7¹

113.8¹

85.3

f_LCD(Hz)

512

128¹

85.3

64

128¹

85.3

64

0

1

0

170.7

128

341.3

256

0

1

0

1

0

102.4

85.3

73.1

64

51.2

42.7

36.6

32

204.8

170.7

146.3

128

68.3

204.8

170.7

146.3

128

51.2

42.7

36.6

32

0

1

0

1

56.9

0

1

0

48.8

0

1

42.7

1

0

56.9

51.2

46.5

42.7

39.4

36.6

34.1

32

28.5

25.6

23.25

21.35

19.7

18.3

17.05

16

113.8

102.4

93.1

37.9

113.8

102.4

93.1

85.3

78.8

73.1

68.3

64

28.5

25.6

23.25

21.35

19.7

18.3

17.05

16

1

0

1

34.1

1

0

1

0

31

1

0

1

85.3

28.4

1

0

78.8

26.3

1

0

1

73.1

24.4

1

0

68.3

22.8

1

64

21.3

0

16

8

32

10.7

32

8

¹Not within the range of typical LCD frame rates.

Table 84. LCD Frame Rate Selection for f_LCDCLK= 128 Hz (LCDCON[3] = 1)

2× Multiplexing

3× Multiplexing

4× Multiplexing

FD3

0

FD2

0

FD1

0

FD0

1

f_LCD(Hz)

32

Frame Rate (Hz)

f_LCD(Hz)

32

Frame Rate (Hz)

10.7

f_LCD(Hz)

32

Frame Rate (Hz)

16¹

10.6

8

0

1

0

21.3

16

32

10.7

32

8

0

1

32

10.7

32

8

0

1

0

16

8

32

10.7

32

8

0

1

0

1

16

8

32

10.7

32

8

0

1

0

16

8

32

10.7

32

8

0

1

16

8

32

10.7

32

8

1

0

16

8

32

10.7

32

8

1

0

1

16

8

32

10.7

32

8

1

0

1

0

16

8

32

10.7

32

8

1

0

1

16

8

32

10.7

32

8

1

0

16

8

32

10.7

32

8

1

0

1

16

8

32

10.7

32

8

1

0

16

8

32

10.7

32

8

1

128

64

32

128

64

42.7

128

64

32

16

0

21.3

¹Not within the range of typical LCD frame rates.

Table 85. LCD Segment Enable SFR (LCDSEGE, 0x97)

Bit

Mnemonic

FP25EN

FP24EN

FP23EN

FP22EN

FP21EN

FP20EN

Reserved

Default

Description

7

0

FP25 Function Select Bit. 0 = General-Purpose I/O, 1 = LCD Function.

FP24 Function Select Bit. 0 = General-Purpose I/O, 1 = LCD Function.

FP23 Function Select Bit. 0 = General-Purpose I/O, 1 = LCD Function.

FP22 Function Select Bit. 0 = General-Purpose I/O, 1 = LCD Function.

FP21 Function Select Bit. 0 = General-Purpose I/O, 1 = LCD Function.

FP20 Function Select Bit. 0 = General-Purpose I/O, 1 = LCD Function.

These bits should be left at 0 for proper operation.

6

5

4

3

2

1 to 0

Rev. A | Page 98 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 86. LCD Pointer SFR (LCDPTR, 0xAC)

Bit

Mnemonic

Default

Description

7

R/W

0

Read or Write LCD Bit. If this bit is set (1), the data in LCDDAT is written to the address indicated

by the LCDPTR[5:0] bits.

6

RESERVED

ADDRESS

0

Reserved.

5 to 0

LCD Memory Address (see Table 89).

Table 87. LCD Data SFR (LCDDAT, 0xAE)

Bit

Mnemonic

Default

Description

7 to 0

LCDDATA

0

Data to be written into or read out of the LCD Memory SFRs.

Table 88. LCD Segment Enable 2 SFR (LCDSEGE2, 0xED)

Bit

Mnemonic

RESERVED

FP19EN

Default

Description

7 to 4

0

Reserved.

3

2

1

0

FP19 Function Select Bit. 0 = General-Purpose I/O, 1 = LCD function.

FP18 Function Select Bit. 0 = General-Purpose I/O, 1 = LCD function.

FP17 Function Select Bit. 0 = General-Purpose I/O, 1 = LCD function.

FP16 Function Select Bit. 0 = General-Purpose I/O, 1 = LCD function.

FP18EN

FP17EN

FP16EN

LCD SETUP

LCD TIMING AND WAVEFORMS

The LCD Configuration SFR (LCDCON, 0x95) configures the

LCD module to drive the type of LCD in the user end system.

The BIAS and LMUX[1:0] bits in this SFR should be set according

to the LCD specifications.

An LCD segment acts like a capacitor that is charged and

discharged at a certain rate. This rate, the refresh rate, determines

the visual characteristics of the LCD. A slow refresh rate results

in the LCD blinking on and off between refreshes. A fast refresh

rate presents a screen that appears to be continuously lit. In

addition, a faster refresh rate consumes more power.

The COM2/FP28 and COM3/FP27 pins default to LCD segment

lines. Selecting the 3× multiplex level in the LCD Configuration

SFR (LCDCON, 0x95) by setting LMUX[1:0] to 2d changes the

FP28 pin functionality to COM2. The 4× multiplex level selection,

LMUX[1:0] = 3d, changes the FP28 pin functionality to COM2

and the FP27 pin functionality to COM3.

The frame rate, or refresh rate, for the LCD module is derived

from the LCD clock, f_LCDCLK. The LCD clock is selected as 2048 Hz

or 128 Hz by the CLKSEL bit in the LCD Configuration SFR

(LCDCON, 0x95). The minimum refresh rate needed for the

LCD to appear solid (without blinking) is independent of the

multiplex level.

LCD segments FP0 to FP15 and FP26 are enabled by default.

Additional pins are selected for LCD functionality in the LCD

Segment Enable SFR (LCDSEGE, 0x97) and LCD Segment

Enable 2 SFR (LCDSEGE2, 0xED) where there are individual

enable bits for the FP16 to FP25 segment pins. The LCD pins do

not have to be enabled sequentially. For example, if the alternate

function of FP23, the Timer 2 input, is required, any of the

other shared pins, FP16 to FP25, can be enabled instead.

The LCD waveform frequency, f_LCD, is the frequency at which

the LCD switches the active common line. Thus, the LCD

waveform frequency depends heavily on the multiplex level.

The frame rate and LCD waveform frequency are set by f_LCDCLK

,

the multiplex level, and the FD[3:0] frame rate selection bits in

the LCD Clock SFR (LCDCLK, 0x96).

The Display Element Control section contains details about

setting up the LCD data memory to turn individual LCD

segments on and off. Setting the LCDRST bit in the LCD

Configuration SFR (LCDCON, 0x95) resets the LCD data

memory to its default (0). A power-on reset also clears the

LCD data memory.

The LCD module provides 16 different frame rates for

f_LCDCLK= 2048 Hz, ranging from 8 Hz to 128 Hz for an

LCD with 4× multiplexing. Fewer options are available

with f_LCDCLK= 128 Hz, ranging from 8 Hz to 32 Hz for a

4× multiplexed LCD. The 128 Hz clock is beneficial for

battery operation because it consumes less power than the

2048 Hz clock. The frame rate is set by the FD[3:0] bits in the

LCD Clock SFR (LCDCLK, 0x96); see Table 83 and Table 84.

The LCD waveform is inverted at twice the LCD waveform

frequency, f_LCD. This way, each frame has an average dc offset

of zero. ADC offset degrades the lifetime and performance of

the LCD.

Rev. A | Page 99 of 144

ADE7566/ADE7569/ADE7166/ADE7169

data byte to be accessed and initiates a read or write operation

(see Table 86).

BLINK MODE

Blink mode is enabled by setting the BLINKEN bit in the LCD

Configuration SFR (LCDCON, 0x95). This mode is used to

alternate between the LCD on state and LCD off state so that

the LCD screen appears to blink. There are two blinking modes:

a software controlled blink mode and an automatic blink mode.

Writing to LCD Data Registers

To update the LCD data memory, first set the LSB of the LCD

Configuration Y SFR (LCDCONY, 0xB1) to freeze the data

being displayed on the LCD while updating it. Then, move the

data to the LCD Data SFR (LCDDAT, 0xAE) prior to accessing

the LCD Pointer SFR (LCDPTR, 0xAC). When the MSB of the

LCDPTR SFR is set, the content of the LCDDAT SFR is

transferred to the internal LCD data memory designated by the

address in the LCDPTR SFR. Clear the LSB of the LCD

Configuration Y SFR (LCDCONY, 0xB1) when all of the data

memory has been updated to allow the use of the new LCD

setup for display.

Software Controlled Blink Mode

The LCD blink rate can be controlled by user code with the

BLKMOD[1:0] bits in the LCD Clock SFR (LCDCLK, 0x96) by

toggling the bits to turn the display on and off at a rate

determined by the MCU code.

Automatic Blink Mode

There are five blink rates available if the RTC peripheral is

enabled by setting the RTCEN bit in the RTC Configuration

SFR (TIMECON, 0xA1). These blink rates are selected by the

BLKMOD[1:0] and BLKFREQ[1:0] bits in the LCD Clock SFR

(LCDCLK, 0x96); see Table 82.

To update the segments attached to the FP10 and FP11 pins, use

the following sample 8052 code:

ORL

MOV

ANL

LCDCONY,#01h ;start updating the data

LCDDATA,#FFh

DISPLAY ELEMENT CONTROL

LCDPTR,#80h OR 05h

A bank of 15 bytes of data memory located in the LCD module

controls the on or off state of each LCD segment. The LCD data

memory is stored in Address 0 through Address 14 in the LCD

module. Each byte configures the on and off states of two segment

lines. The LSBs store the state of the even numbered segment

lines, and the MSBs store the state of the odd numbered segment

lines. For example, LCD Data Address 0 refers to segment lines

one and zero (see Table 89). Note that the LCD data memory is

maintained in PSM2 operating mode.

LCDCONY,#0FEh;update finished

Reading LCD Data Registers

When the MSB of the LCD Pointer SFR (LCDPTR, 0xAC) is

cleared, the content of the LCD data memory address designated by

LCDPTR is transferred to the LCD Data SFR (LCDDAT, 0xAE).

Sample 8052 code to read the contents of LCD Data Memory

Address 0x07, which holds the on and off state of the segments

attached to FP14 and FP15, is as follows.

The LCD data memory is accessed indirectly through the LCD

Pointer SFR (LCDPTR, 0xAC) and LCD Data SFR (LCDDAT,

0xAE). Moving a value to the LCDPTR SFR selects the LCD

MOV

LCDPTR,#07h

R1, LCDDATA

Table 89. LCD Data Memory Accessed Indirectly Through LCD Pointer SFR (LCDPTR, 0xAC) and LCD Data SFR (LCDDAT, 0xAE)^{1, 2}

LCD Pointer SFR (LCDPTR, 0xAC) LCD Pointer SFR (LCDDAT, 0xAE)

LCD Memory Address

COM3

COM2

COM1

COM0

COM3

FP28

FP26

FP24

FP22

FP20

FP18

FP16

FP14

FP12

FP10

FP8

COM2

FP28

FP26

FP24

FP22

FP20

FP18

FP16

FP14

FP12

FP10

FP8

COM1

FP28

FP26

FP24

FP22

FP20

FP18

FP16

FP14

FP12

FP10

FP8

COM0

FP28

FP26

FP24

FP22

FP20

FP18

FP16

FP14

FP12

FP10

FP8

0x0E

0x0D

0x0C

0x0B

0x0A

0x09

0x08

0x07

0x06

0x05

0x04

0x03

0x02

0x01

0x00

FP27

FP25

FP23

FP21

FP19

FP17

FP15

FP13

FP11

FP9

FP27

FP25

FP23

FP21

FP19

FP17

FP15

FP13

FP11

FP9

FP27

FP25

FP23

FP21

FP19

FP17

FP15

FP13

FP11

FP9

FP27

FP25

FP23

FP21

FP19

FP17

FP15

FP13

FP11

FP9

FP7

FP6

FP5

FP4

FP3

FP2

FP1

FP0

¹COMx designates the common lines.

²FPx designates the segment lines.

Rev. A | Page 100 of 144

ADE7566/ADE7569/ADE7166/ADE7169

VOLTAGE GENERATION

LCD EXTERNAL CIRCUITRY

The ADE7566/ADE7569/ADE7166/ADE7169 provide two ways

to generate the LCD waveform voltage levels. The on-chip

charge pump option can generate 5 V. This makes it possible to

use 5 V LCDs with the 3.3 V ADE7566/ADE7569/ADE7166/

ADE7169. There is also an option to use an external resistor

ladder with a 3.3 V LCD. The EXTRES bit in the LCD

Configuration X SFR (LCDCONX, 0x9C) selects the resistor

ladder or charge pump option.

The voltage generation selection is made by bit EXTRES in the

LCD Configuration X SFR (LCDCONX, 0x9C). This bit is

cleared by default for charge pump voltage generation, but can

be set to enable an external resistor ladder.

Charge Pump

Voltage generation through the charge pump requires external

capacitors to store charge. The external connections to LCDVA,

LCDVB, and LCDVC, as well as LCDVP1 and LCDVP2, are

shown in Figure 89.

When selecting how to generate the LCD waveform voltages,

the following should be considered:

LCDVC

•

Lifetime performance power consumption

Contrast control

470nF

LCDVB

CHARGE PUMP

470nF

AND

LCDVA

LCD WAVEFORM

470nF

CIRCUITRY

LCDVP1

Lifetime Performance Power Consumption

100nF

LCDVP2

In most LCDs, a high amount of current is required when the LCD

waveforms change state. The external resistor ladder option draws a

constant amount of current, whereas the charge pump circuitry

allows dynamic current consumption. If the LCD module is used

with the internal charge pump option when the display is disabled,

the voltage generation is disabled, so that no power is consumed by

the LCD function. This feature results in significant power

savings if the display is turned off during battery operation.

Figure 89. External Circuitry for Charge Pump Option

External Resistor Ladder

To enable the external resistor ladder option, set the EXTRES

bit in the LCD Configuration X SFR (LCDCONX, 0x9C). When

EXTRES = 1, the LCD waveform voltages are supplied by the

external resistor ladder. Because the LCD voltages are not

generated on-chip, the LCD bias compensation implemented to

maintain contrast over temperature and supply is not possible.

Contrast Control

The electrical characteristics of the liquid in the LCD change

over temperature. This requires adjustments in the LCD waveform

voltages to ensure a readable display. An added benefit of the

internal charge pump voltage generation is a configurable bias

voltage that can be compensated over temperature and supply

to maintain contrast on the LCD. These compensations can be

performed based on the ADE7566/ADE7569/ADE7166/

ADE7169 temperature and supply voltage measurements (see

the Temperature, Battery, and Supply Voltage Measurements

section). This dynamic contrast control is not easily

The external circuitry needed for the resistor ladder option is

shown in Figure 90. The resistors required should be in the

range of 10 kΩ to 100 kΩ and based on the current required by

the LCD being used.

LCDVC

LCDVB

LCD WAVEFORM

CIRCUITRY

LCDVA

LCDVP1

LCDVP2

implemented with external resistor ladder voltage generation.

Figure 90. External Circuitry for External Resistor Ladder Option

The LCD bias voltage sets the contrast of the display when the

charge pump provides the LCD waveform voltages. The ADE7566/

ADE7569/ADE7166/ADE7169 provide 64 bias levels selected by

the BIASLVL bits in the LCD Configuration X SFR (LCDCONX,

0x9C). The voltage level on LCDVA, LCDVB and LCDVC

depend on the internal voltage reference value (V_REF),

BIASLVL[5:0] selection, and the biasing selected as described in

Table 80.

LCD FUNCTION IN PSM2

The LCDPSM2 and LCDEN bits in the LCD Configuration SFR

(LCDCON, 0x95) control LCD functionality in the PSM2

operating mode (see Table 90).

Note that the internal voltage reference must be enabled by

setting the REF_BAT_EN bit in the Peripheral Configuration

SFR (PERIPH, 0xF4) to allow LCD operation in PSM2 (see

Table 19).

Lifetime Performance

DC offset on a segment degrades its performance over time.

The voltages generated through the internal charge pump

switch faster than those generated by the external resistor

ladder, reducing the likelihood of a dc voltage being applied

to a segment and increasing the lifetime of the LCD.

Rev. A | Page 101 of 144

ADE7566/ADE7569/ADE7166/ADE7169

A 96-segment LCD with 4× multiplexing requires 96/4 = 24

segment lines. Sixteen pins, FP0 to FP15, are automatically

dedicated for use as LCD segments. Eight more pins must be

chosen for the LCD function. Because the LCD has 4× multi-

plexing, all four common lines are used. As a result, COM2/FP28

and COM3/FP27 cannot be used as segment lines. Based on the

alternate functions of the pins used for FP16 through FP25,

FP16 to FP23 are chosen for the eight remaining segment lines.

These pins are enabled for LCD functionality in the LCD

Segment Enable SFR (LCDSEGE, 0x97) and LCD Segment

Enable 2 SFR (LCDSEGE2, 0xED).

Table 90. Bits Controlling LCD Functionality in PSM2 Mode

LCDPSM2

LCDEN

Result

0

1

0

1

X

The display is off in PSM2.

The display is on in PSM2.

The display is off in PSM2.

In addition, note that the LCD configuration and data memory

is retained when the display is turned off.

Example LCD Setup

An example of how to set up the LCD peripheral for a specific

LCD is described in this section with the following parameters:

To determine contrast setting for this 5 V LCD, Table 80 shows

the BIASLVL[5:0] setting that corresponds to a VC of 5 V in

1/3 bias mode. The maximal bias level setting for this LCD is

BIASLVL[5:0] = [101110].

•

Type of LCD: 5 V, 4× multiplexed with 1/3 bias, 96 segment

Voltage generation: internal charge pump

Refresh rate: 64 Hz

The LCD is setup with the following 8052 code:

; setup LCD pins to have LCD functionality

MOV

LCDSEG,#FP20EN+FP21EN+FP22EN+FP23EN

LCDSEGX,#FP16EN+FP17EN+FP18EN+FP19EN

; setup LCDCON for f_LCDCLK=2048Hz, 1/3 bias and 4x multiplexing

MOV LCDCON,#BIAS+LMUX1+LMUX0

; setup LCDCONX for charge pump and BIASLVL[110111]

MOV LCDCONX,#BIASLVL5+BIASLVL4+BIASLVL3+BIASLVL2+BIASLVL1+BIASLVL0

; set up refresh rate for 64Hz with f_LCDCLK=2048Hz

MOV LCDCLK,#FD3+FD2+FD1+FD0

; set up LCD data registers with data to be displayed using

; LCDPTR and LCDDATA registers

; turn all segments on FP27 ON and FP26 OFF

ORL

MOV

ANL

ORL

LCDCONY,#01h ; start data memory refresh

LCDDAT,#F0H

LCDPTR, #80h OR 0DH

LCDCONY,#0FEh; end of data memory refresh

LCDCON,#LCDEN ; enable LCD

To setup the same 3.3 V LCD for use with an external resistor ladder:

; setup LCDCONX for external resistor ladder

MOV

LCDCONX,#EXTRES

Rev. A | Page 102 of 144

ADE7566/ADE7569/ADE7166/ADE7169

FLASH MEMORY

In reliability qualification, every byte in both the program and

data Flash/EE memory is cycled from 0x00 to 0xFF until a first

fail is recorded, signifying the endurance limit of the on-chip

Flash/EE memory.

OVERVIEW

Flash memory is a type of nonvolatile memory that is in-circuit

programmable. The default state of a byte of flash memory is 0xFF

(erased). When a byte of flash memory is programmed, the

required bits change from 1 to 0. The flash memory must be

erased to turn the 0s back to 1s. However, a byte of flash

memory cannot be erased individually. The entire segment, or

page, of flash memory that contains the byte must be erased.

As indicated in the Specifications section, the

ADE7566/ADE7569/ADE7166/ADE7169 flash memory

endurance qualification has been carried out in accordance with

JEDEC Standard 22 Method A117 over the industrial temperature

range of −40°C, +25°C, and +85°C. The results allow the

specification of a minimum endurance figure over supply and

temperature of 100,000 cycles, with a minimum endurance figure

of 20,000 cycles of operation at 25°C.

The ADE7566/ADE7569/ADE7166/ADE7169 provide 16 kB of

flash program/ information memory. This memory is segmented

into 32 pages of 512 bytes each. Therefore, to reprogram one

byte of flash memory, the other 511 bytes in that page must be

erased. The flash memory can be erased by page or all at once

in a mass erase. There is a command to verify that a flash write

operation has completed successfully. The ADE7566/ADE7569/

ADE7166/ADE7169 flash memory controller also offers

configurable flash memory protection.

Retention is the ability of the flash memory to retain its

programmed data over time. Again, the parts have been qualified

in accordance with the formal JEDEC Standard 22 Method

A117 at a specific junction temperature (T_J= 55°C). As part of this

qualification procedure, the flash memory is cycled to its

specified endurance limit before data retention is characterized.

This means that the flash memory is guaranteed to retain its data

for its full specified retention lifetime every time the flash

memory is reprogrammed. It should also be noted that

retention lifetime, based on an activation energy of 0.6 eV,

derates with T_Jas shown in Figure 91.

The 16 kB of flash memory are provided on-chip to facilitate

code execution without any external discrete ROM device

requirements. The program memory can be programmed in-

circuit, using the serial download or emulation options provided or

using conventional third party memory programmers.

Flash/EE Memory Reliability

300

The flash memory arrays on the ADE7566/ADE7569/

ADE7166/ADE7169 are fully qualified for two key Flash/EE

memory characteristics: Flash/EE memory cycling endurance

and Flash/EE memory data retention.

250

ANALOG DEVICES

200

SPECIFICATION

100 YEARS MIN.

AT T = 55°C

Endurance quantifies the ability of the Flash/EE memory to be

cycled through many program, read, and erase cycles. In real

terms, a single endurance cycle is composed of the following four

independent, sequential events:

J

150

100

50

1. Initial page erase sequence.

2. Read/verify sequence.

3. Byte program sequence.

0

40

50

60

70

80

90

100

110

T

JUNCTION TEMPERATURE (°C)

J

4. Second read/verify sequence.

Figure 91. Flash/EE Memory Data Retention

Rev. A | Page 103 of 144

ADE7566/ADE7569/ADE7166/ADE7169

The implication of write/erase protecting the last page is that

the content of the 506 bytes in this page that are available to the

user must not change.

FLASH MEMORY ORGANIZATION

The 16 kB of flash memory provided by the ADE7566/ADE7569/

ADE7166/ADE7169 are segmented into 32 pages of 512 bytes

each. It is up to the user to decide which flash memory to

allocate for data memory. It is recommended that each page be

dedicated solely to program memory or data memory. Doing so

prevents the program counter from being loaded with data

memory instead of an operations code from the program

memory. It also prevents program memory used to update a

byte of data memory from being erased.

Thus, if code protection is enabled, it is recommended to use

this last page for program memory only (if the firmware does

not need to be updated in the field). If the firmware must be

protected and can be updated at a future date, the last page

should be used only for constants utilized by the program code.

Therefore, Page 0 through Page 30 are for general program and

data memory use. It is recommended that Page 31 be used for

constants or code that do not need to be updated. Note that the

last six bytes of Page 31 are reserved for protecting the flash

memory.

0x3FFF

0x1FFF

PAGE 15

PAGE 14

PAGE 13

PAGE 12

PAGE 11

PAGE 10

PAGE 9

PAGE 8

PAGE 7

PAGE 6

PAGE 5

PAGE 4

PAGE 3

PAGE 2

PAGE 1

PAGE 0

PAGE 31

PAGE 30

PAGE 29

PAGE 28

PAGE 27

PAGE 26

PAGE 25

PAGE 24

PAGE 23

PAGE 22

PAGE 21

PAGE 20

PAGE 19

PAGE 18

PAGE 17

PAGE 16

0x3E00

0x3DFF

0x1E00

0x1DFF

READ

0x3C00

0x3BFF

0x1C00

0x1BFF

PROTECT

BIT 7

PROTECT

BIT 3

0x3A00

0x39FF

0x1A00

0x19FF

USING THE FLASH MEMORY

0x3800

0x37FF

0x1800

0x17FF

The 16 kB of flash memory are configured as 32 pages, each of

512 bytes. As with the other ADE7566/ADE7569/ADE7166/

ADE7169 peripherals, the interface to this memory space is via

a group of registers mapped in the SFR space (see Table 91).

0x3600

0x35FF

0x1600

0x15FF

READ

PROTECT

BIT 6

READ

PROTECT

BIT 2

0x3400

0x33FF

0x1400

0x13FF

0x3200

0x31FF

0x1200

0x11FF

A data register, EDATA, holds the byte of data to be accessed. The

byte of flash memory is addressed via the EADRH and EADRL

registers. Finally, ECON is an 8-bit control register that can be

written to with one of seven flash memory access commands to

trigger various read, write, erase, and verify functions.

0x3000

0x2FFF

0x1000

0x0FFF

0x2E00

0x2DFF

0x0E00

0x0DFF

READ

PROTECT

BIT 5

READ

PROTECT

BIT 1

0x2C00

0x2BFF

0x0C00

0x0BFF

0x2A00

0x29FF

0x0A00

0x09FF

Table 91. The Flash SFRs

0x2800

0x27FF

0x0800

0x07FF

Bit Address-

Address Default able

SFR

Description

Flash Control.

Flash Key.

0x2600

0x25FF

0x0600

0x05FF

ECON

0xB9

0x00

0xFF

No

READ

PROTECT

BIT 4

READ

PROTECT

BIT 0

0x2400

0x23FF

0x0400

0x03FF

FLSHKY 0xBA

PROTKY 0xBB

0x2200

0x21FF

0x0200

0x01FF

Flash Protection

Key.

0x2000

0x0000

EDATA

0xBC

0x00

0xFF

No

Flash Data.

CONTAINS PROTECTION SETTINGS.

PROTB0 0xBD

Flash W/E

Protection 0.

Figure 92. Flash Memory Organization

The flash memory can be protected from read or write/erase

(W/E) access. The protection is implemented in part of the last

page of the flash memory, Page 31. Four of the bytes from this

page are used to set up write/erase protection for each page.

Another byte is used for configuring read protection of the flash

memory. The read protection is selected for groups of four pages.

Finally, one byte is used to store the key required for modifying

the protection scheme. The last page of flash memory must be

write/erase protected for any flash protection to be active.

PROTB1 0xBE

0xFF

0x00

No

Flash W/E

Protection 1.

PROTR

EADRL

EADRH

0xBF

0xC6

0xC7

Flash Read

Protection.

Flash Low Byte

Address.

Flash High

Byte Address.

Figure 93 demonstrates the steps required for access to the flash

memory.

ECON

COMMAND

ADDRESS ADDRESS PROTECTION

DECODER DECODER

ACCESS

ALLOWED?

TRUE: ACCESS

ALLOWED

EADRH EADRL

ECON = 0

FLASH

PROTECTION KEY

FLSHKY

FALSE: ACCESS

DENIED

ECON = 1

FLSHKY = 0 × 3B?

Figure 93. Flash Memory Read/Write/Erase Protection Block Diagram

Rev. A | Page 104 of 144

ADE7566/ADE7569/ADE7166/ADE7169

ECON—Flash/EE Memory Control SFR

The program counter (PC) is held on the instruction where the

ECON register is written to until the flash memory controller is

done performing the requested operation. Then, the PC

increments to continue with the next instruction.

Programming flash memory is done through the Flash Control

SFR (ECON, 0xB9). This SFR allows the user to read, write, erase,

or verify the 16 kB of flash memory. As a method of security, a

key must be written to the FLSHKY register to initiate any user

access to the flash memory. Upon completion of the flash memory

operation, the FLSHKY register is reset so that it must be written

to prior to another flash memory operation. Requiring the key

to be set before an access to the flash memory decreases the

likelihood of user code or data being overwritten by a program

inappropriately modified during its execution.

Any interrupt requests that occur while the flash controller is

performing an operation are not handled until the flash operation

is complete. All peripherals, such as timers and counters, continue

to operate as configured throughout the flash memory access.

Table 92. Flash Control SFR (ECON, 0xB9)

Bit

Mnemonic Value

Description

7 to 0

ECON

1

2

3

Write Byte. The value in EDATA is written to the flash memory at the page address given by EADRH and

EADRL. Note that the byte being addressed must be pre-erased.

Erase Page. A 512-byte page of flash memory address is erased. The page is selected by the address in

EADRH/EADRL. Any address in the page can be written to EADRH/EADRL to select it for erasure.

Erase All. All 16 kB of the flash memory are erased. Note that this command is used during serial and

parallel download modes but should not be executed by user code.

4

5

Read Byte. The byte in the flash memory addressed by EADRH/EADRL is read into EDATA.

Erase Page and Write Byte. The page that holds the byte addressed by EADRH/EADRL is erased. Data in

EDATA is then written to the byte of flash memory addressed by EADRH/EADRL.

8

Protect Code (see the Protecting the Flash Memory section).

Table 93. Flash Key SFR (FLSHKY, 0xBA)

Bit Mnemonic Default Description

7 to 0 FLSHKY

0xFF

The content of this SFR is compared to the flash key, 0x3B. If the two values match, the next ECON

operation is allowed (see the Protecting the Flash Memory section).

Table 94. Flash Protection Key SFR (PROTKY, 0xBB)

Bit Mnemonic Default Description

7 to 0 PROTKY 0xFF

The content of this SFR is compared to the flash memory location at Address 0x3FFA. If the two values

match, the update of the write/erase and read protection set up is allowed (see the Protecting the Flash

Memory section).

If the protection key in the flash is 0xFF, the PROTKY SFR value is not used for comparison. This SFR is

also used to write the protection key in the flash. This is done by writing the desired value in PROTKY

and by writing 0x08 in the ECON SFR. This operation can only be done once.

Table 95. Flash Data SFR (EDATA, 0xBC)

Bit Mnemonic Default Description

7 to 0 EDATA Flash Pointer Data.

0

Table 96. Flash Write/Erase Protection 0 SFR (PROTB0, 0xBD)

Bit Mnemonic Default Description

7 to 0 PROTB0

0xFF

This SFR is used to write the write/erase protection bits for Page 0 to Page 7 of the flash memory

(see the Protecting the Flash Memory section). Clearing the bits enables the protection.

PROTB0.7

PROTB0.6 PROTB0.5 PROTB0.4 PROTB0.3 PROTB0.2 PROTB0.1 PROTB0.0

Page 6 Page 5 Page 4 Page 3 Page 2 Page 1 Page 0

Page 7

Table 97. Flash Write/Erase Protection 1 SFR (PROTB1, 0xBE)

Bit Mnemonic Default Description

7 to 0 PROTB1

0xFF

This SFR is used to write the write/erase protection bits for Page 8 to Page15 of the flash memory

(see the Protecting the Flash Memory section). Clearing the bits enables the protection.

PROTB1.7 PROTB1.6 PROTB1.5 PROTB1.4 PROTB1.3 PROTB1.2 PROTB1.1 PROTB1.0

Page 15

Page 14

Page 13

Page 12

Page 11

Page 10

Page 9

Page 8

Rev. A | Page 105 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 98. Flash Read Protection SFR (PROTR, 0xBF)

Bit

Mnemonic Default Description

7 to 0

PROTR

0xFF

This SFR is used to write the read protection bits for Page 0 to Page 31 of the flash memory

(see the Protecting the Flash Memory section). Clearing the bits enables the protection.

PROTR.7

Page 28 to Page 24 to Page 20 to Page 16 to Page 12 to Page 8 to

Page 31 Page 27 Page 23 Page 19 Page 15 Page 11

PROTR.6

PROTR.5

PROTR.4

PROTR.3

PROTR.2

PROTR.1

PROTR.0

Page 4 to

Page 7

Page 0 to

Page 3

Table 99. Flash Low Byte Address SFR (EADRL, 0xC6)

Bit

Mnemonic Default Description

7 to 0

EADRL

0

Flash Pointer Low Byte Address. This SFR is also used to write the write/erase protection bits for Page 16

to Page 23 of the flash memory (see the Protecting the Flash Memory section). Clearing the bits enables

the protection.

EADRL.7

EADRL.6

EADRL.5

EADRL.4

EADRL.3

EADRL.2

EADRL.1

EADRL.0

Page 23

Page 22

Page 21

Page 20

Page 19

Page 18

Page 17

Page 16

Table 100. Flash High Byte Address SFR (EADRH, 0xC7)

Bit

Mnemonic Default Description

7 to 0

EADRH

0

Flash Pointer High Byte Address. This SFR is also used to write the write/erase protection bits for Page 24

to Page 31 of the flash memory (see the Protecting the Flash Memory section). Clearing the bits enables

the protection.

EADRH.7

EADRH.6

EADRH.5

EADRH.4

EADRH.3

EADRH.2

EADRH.1

EADRH.0

Page 31

Page 30

Page 29

Page 28

Page 27

Page 26

Page 25

Page 24

Flash Functions

Sample 8052 code is provided in this section to demonstrate

how to use the flash functions. For these examples, the byte of

flash memory 0x3C00 is accessed.

Erase All

Erase all of the 16 kB flash memory.

MOV FLSHKY,#3Bh

key.

; Write flash security

Write Byte

MOV ECON,#03h; Erase all

Read Byte

Write 0xF3 into flash memory byte 0x3C00.

MOV EDATA,#F3h

MOV EADRH,#3Ch

MOV EADRL,#00h

; Data to be written

; Setup byte address

Read flash memory byte 0x3C00.

MOV EADRH,#3Ch

MOV EADRL,#00h

; Setup byte address

MOV FLSHKY,#3Bh

key.

; Write flash security

MOV FLSHKY,#3Bh

key.

; Write flash security

; Read byte

MOV ECON,#01h; Write byte

Erase Page

MOV ECON,#04h

; Data is ready in EDATA register

Erase Page and Write Byte

Erase the page containing flash memory byte 0x3C00.

MOV EADRh,#3Ch

byte address

; Select page through

Erase the page containing flash memory byte 0x3C00 and then

write 0xF3 to that address. Note that the other 511 bytes in this

page are erased.

MOV EADRL,#00h

MOV FLSHKY,#3Bh

key.

; Write flash security

MOV EDATA,#F3h

MOV EADRH,#3Ch

MOV EADRL,#00h

; Data to be written

; Setup byte address

MOV ECON,#02h; Erase Page

MOV FLSHKY,#3Bh

key.

; Write flash security

MOV ECON,#05h; Erase page and then write

byte

Rev. A | Page 106 of 144

ADE7566/ADE7569/ADE7166/ADE7169

The sequence for writing the protection bits is as follows:

PROTECTING THE FLASH MEMORY

1. Set up the EADRH, EADRL, PROTB1, and PROTB0

registers with the write/erase protection bits. When erased,

the protection bits default to 1 (like any other bit of flash

memory). The default protection setting is for no protection.

To enable protection, write a 0 to the bits corresponding to

the pages that should be protected.

2. Set up the PROTR register with the read protection bits.

Note that every read protection bit protects four pages.

To enable the read protection bit, write a 0 to the bits that

should be read protected.

3. To enable the protection key, write to the PROTKY register.

If enabled, the protection key is required to modify the

protection scheme. The protection key, Flash Memory

Address 0x3FFA, defaults to 0xFF; if the PROTKY register

is not written to, it remains 0xFF. If the protection key is

written to, the PROTKY register must be written with this

value every time the protection functionality is accessed.

Note that once the protection key is configured, it cannot

be modified. Also note that the most significant bit of

Address 0x3FFA is used to enable a lock mechanism for

the watchdog settings (see the Watchdog Timer section

for more information).

Two forms of protection are offered for this flash memory: read

protection and write/erase protection. The read protection ensures

that any pages that are read protected are not able to be read by

the end user. The write protection ensures that the flash memory

cannot be erased or written over. This protects the end system

from tampering and can prevent the code from being overwritten

in the event of a unexpected disruption of the normal execution

of the program.

Write/erase protection is individually selectable for all 32 pages.

Read protection is selected in groups of 4 pages (see Figure 92

for the groupings). The protection bits are stored in the last

flash memory locations, Address 0x3FFA through Address

0x3FFF (see Figure 94); four bytes are reserved for write/erase

protection, one byte is for read protection, and another byte sets

the protection security key. The user must enable read and

write/erase protection for the last page for the entire protection

scheme to work.

Note that the read protection does not prevent MOVC

commands from being executed within the code.

There is an additional layer of protection offered by a protection

security key. The user can set up this security key so that the

protection scheme cannot be changed without this key. Once

the protection key has been configured, it cannot be modified.

4. Run the protection command by writing 0x08 to the

ECON register.

5. Reset the chip to activate the new protection.

Enabling Flash Protection by Code

To enable read and write/erase protection for the last page only,

use the following 8052 code. Writing the flash protection

command to the ECON register initiates programming of the

protection bits in the flash.

The protection bytes in the flash memory can be programmed

using the flash controller command and programming ECON to

0x08. In this case, the EADRH, EADRL, PROTB1, and PROTB0

bytes are used to store the data to be written to the 32 bits of

write protection. Note that the EADRH and EADRL registers

are not used as data pointers here but to store write protection

data.

; enable read protection on the last four

pages only

MOV PROTR,#07Fh

EADRH

WP

31

WP

30

WP

29

WP

28

WP

27

WP

26

WP

25

WP

24

0x3FFF

0x3FFE

0x3FFD

0x3FFC

0x3FFB

; set up a protection key of 0A3h. This

command can be

WP

23

WP

22

WP

21

WP

20

WP

19

WP

18

WP

17

WP

16

EADRL

WP

15

WP

14

WP

13

WP

12

WP

11

WP

10

WP

9

WP

8

PROTB1

PROTB0

PROTR

PROTKY

; omitted to use the default protection key

of 0xFF

WP

7

WP

6

WP

5

WP

4

WP

3

WP

2

WP

1

WP

0

MOV PROTKY,#0A3h

RP

7:4

RP

3:0

31:28 27:24 23:20 19:16 15:12 11:8

WDOG

LOCK

; write the flash key to the FLSHKY register

to enable flash

PROTECTION KEY

0x3FFA

0x3FF9

; access. The flash access key is not

configurable.

MOV FLSHKY,#3Bh

0x3E00

; write flash protection command to the ECON

register

Figure 94. Flash Protection in Page 31

MOV ECON,#08h

Rev. A | Page 107 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Enabling Flash Protection by Emulator Commands

Protection bits can be modified from a 1 to a 0, even after the

last page has been protected. In this way, more protection can

be added but none can be removed.

Another way to set the flash protection bytes is to use some

reserved emulator commands available only in download mode.

These commands write directly to the SFRs and can be used to

duplicate the operation mentioned in the Enabling Flash

Protection by Code section. When these flash bytes are written,

the part can exit emulation mode by a reset and the protections

are effective. This method can be used in production and

implemented after downloading the program. The commands

used for this operation are an extension of the commands listed

in the Application Note uC004: Understanding the Serial

Download Protocol, available at www.analog.com.

The protection scheme is intended to protect the end system. Pro-

tection should be disabled while developing and emulating code.

Flash Memory Timing

Typical program and erase times for the flash memory are

shown in Table 101.

Table 101. Flash Memory Program and and Erase Times

Bytes

Affected

Flash Memory

Timing

Command

Write Byte

Erase Page

Erase All

1 byte

30 μs

•

Command with ASCII Code I or 0x49 writes the data into R0.

Command with ASCII Code F or 0x46 writes R0 into the

SFR address defined in the data of this command.

512 bytes

16 kB

20 ms

200 ms

100 ns

21 ms

Read Byte

1 byte

By omitting the protocol defined in the uC004: Understanding

the Serial Download Protocol application note, the sequence to

load protections is similar to the sequence presented in the

Enabling Flash Protection by Code section, except that two

emulator commands are necessary to replace one assembly

command. For example, to write the protection value in

EADRH, the two following commands need to be executed:

Erase Page and Write

Byte

512 bytes

Verify Byte

1 byte

100 ns

Note that the core microcontroller operation is idled until the

requested flash memory operation is complete. In practice, this

means that even though the flash operation is typically initiated

with a two-machine-cycle MOV instruction to write to the

Flash Control SFR (ECON, 0xB9), the next instruction is not

executed until the Flash/EE operation is complete. This means

that the core cannot respond to interrupt requests until the

Flash/EE operation is complete, although the core peripheral

functions, such as counters and timers, continue to count as

configured throughout this period.

•

Command I with data = value of Protection Byte 0x3FFF.

Command F with data = 0xC7.

Following this protocol, the protection can be written to the

flash using the same sequence as mentioned in the Enabling

Flash Protection by Code section. When the part is reset, the

protection is effective.

IN-CIRCUIT PROGRAMMING

Notes on Flash Protection

Serial Downloading

The flash protection scheme is disabled by default so that none

of the pages of the flash are protected from reading or writing/

erasing.

The ADE7566/ADE7569/ADE7166/ADE7169 facilitate code

download via the standard UART serial port. The parts enter

SDEN

serial download mode after a reset or a power cycle if the

The last page must be read and write/erase protected for the

protection scheme to work.

pin is pulled low through an external 1 kΩ resistor. When in

serial download mode, the hidden embedded download kernel

executes. This allows the user to download code to the full 16 kB

of flash memory while the device is in-circuit in its target

application hardware.

To activate the protection settings, the ADE7566/ADE7569/

ADE7166/ADE7169 must be reset after configuring the

protection.

After configuring protection on the last page and resetting the

part, protections that have been enabled can only be removed by

mass erasing the flash memory. The protection bits are read and

erase protected by enabling read and write/erase protection on the

last page, but the protection bits are never truly write protected.

Protection configured in the last page of the ADE7566/ADE7569/

ADE7166/ADE7169 affects whether flash memory can be

accessed in serial download mode. Read protected pages cannot be

read. Write/erase protected pages cannot be written or erased.

Rev. A | Page 108 of 144

ADE7566/ADE7569/ADE7166/ADE7169

TIMERS

Each ADE7566/ADE7569/ADE7166/ADE7169 has three 16-bit

timer/counters: Timer/Counter 0, Timer/Counter 1, and Timer/

Counter 2. The timer/counter hardware is included on-chip to

relieve the processor core of overhead inherent in implementing

timer/counter functionality in software. Each timer/counter con-

sists of two 8-bit registers: THx and TLx (x = 0, 1, or 2). All three

timers can be configured to operate as timers or as event counters.

When functioning as a counter, the TLx register is incremented

by a 1-to-0 transition at its corresponding external input pin:

T0, T1, or T2. When the samples show a high in one cycle and a

low in the next cycle, the count is incremented. Because it takes

two machine cycles (two core clock periods) to recognize a 1-to-0

transition, the maximum count rate is half the core clock frequency.

There are no restrictions on the duty cycle of the external input

signal, but to ensure that a given level is sampled at least once

before it changes, it must be held for a minimum of one full

machine cycle. User configuration and control of all timer

operating modes is achieved via the SFRs in Table 102.

When functioning as a timer, the TLx register is incremented

every machine cycle. Thus, users can think of it as counting

machine cycles. Because a machine cycle on a single cycle core

consists of one core clock period, the maximum count rate is

the core clock frequency.

Table 102. Timer SFRs

SFR

Address

Bit Addressable

Description

TCON

TMOD

TL0

0x88

Yes

No

Yes

No

Timer/Counter 0 and Timer/Counter 1 Control (see Table 104).

Timer/Counter 0 and Timer./Counter 1 Mode (see Table 103).

Timer 0 Low Byte (see Table 107).

0x89

0x8A

0x8B

0x8C

0x8D

0xC8

0xCA

0xCB

0xCC

0xCD

TL1

Timer 1 Low Byte (see Table 109).

TH0

Timer 0 High Byte (see Table 106).

TH1

Timer 1 High Byte (see Table 108).

T2CON

RCAP2L

RCAP2H

TL2

Timer/Counter 2 Control (see Table 105).

Timer 2 Reload/Capture Low Byte (see Table 113).

Timer 2 Reload/Capture High Byte (see Table 112).

Timer 2 Low Byte (Table 111).

TH2

Timer 2 High Byte (see Table 110).

TIMER REGISTERS

Table 103. Timer/Counter 0 and Timer/Counter 1 Mode SFR (TMOD, 0x89)

Bit

Mnemonic Default Description

7

Gate1

C/T1

0

Timer 1 Gating Control. Set by software to enable Timer/Counter 1 only when the INT1 pin is high and the

TR1 control is set. Cleared by software to enable Timer 1 whenever the TR1control bit is set.

6

0

Timer 1 Timer or Counter Select Bit. Set by software to select counter operation (input from T1 pin).

Cleared by software to select the timer operation (input from internal system clock).

5 to 4 T1/M1,

T1/M0

00

Timer 1 Mode Select Bits.

T1/M[1:0] Result

00

01

10

11

TH1 operates as an 8-bit timer/counter. TL1 serves as 5-bit prescaler.

16-Bit Timer/Counter. TH1 and TL1 are cascaded; there is no prescaler.

8-Bit Autoreload Timer/Counter. TH1 holds a value to reload into TL1 each time it overflows.

Timer/Counter 1 Stopped.

3

2

Gate0

C/T0

0

Timer 0 Gating Control. Set by software to enable Timer/Counter 0 only when the INT0 pin is high and the TR0

control bit is set. Cleared by software to enable Timer 0 whenever the TR0 control bit is set.

0

Timer 0 Timer or Counter Select Bit. Set by software to the select counter operation (input from T0 pin).

Cleared by software to the select timer operation (input from internal system clock).

1 to 0 T0/M1,

T0/M0

00

Timer 0 Mode Select Bits.

T0/M[1:0] Result

00

01

10

11

TH0 operates as an 8-bit timer/counter. TL0 serves as a 5-bit prescaler.

16-Bit Timer/Counter. TH0 and TL0 are cascaded; there is no prescaler.

8-Bit Autoreload Timer/Counter. TH0 holds a value to reload into TL0 each time it overflows.

TL0 is an 8-bit timer/counter controlled by the standard Timer 0 control bits. TH0 is an

8-bit timer only, controlled by Timer 1 control bits.

Rev. A | Page 109 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 104. Timer/Counter 0 and Timer/Counter 1 Control SFR (TCON, 0x88)

Bit Address Mnemonic Default Description

7

6

5

4

3

0x8F

0x8E

0x8D

0x8C

0x8B

TF1

TR1

TF0

TR0

IE1¹

0

Timer 1 Overflow Flag. Set by hardware on a Timer/Counter 1 overflow. Cleared by hardware

when the program counter (PC) vectors to the interrupt service routine.

Timer 1 Run Control Bit. Set by the user to turn on Timer/Counter 1. Cleared by the user to turn

off Timer/Counter 1.

Timer 0 Overflow Flag. Set by hardware on a Timer/Counter 0 overflow. Cleared by hardware

when the PC vectors to the interrupt service routine.

Timer 0 Run Control Bit. Set by the user to turn on Timer/Counter 0. Cleared by the user to turn

off Timer/Counter 0.

External Interrupt 1 (INT1) Flag. Set by hardware by a falling edge or by a zero level applied

to the external interrupt pin, INT1, depending on the state of Bit IT1. Cleared by hardware when

the PC vectors to the interrupt service routine only if the interrupt was transition activated.

If level activated, the external requesting source controls the request flag rather than the

on-chip hardware.

2

1

0x8A

0x89

IT1¹

IE0¹

0

External Interrupt 1 (IE1) Trigger Type. Set by software to specify edge sensitive detection, that is, 1-

to-0 transition. Cleared by software to specify level sensitive detection, that is, zero level.

External Interrupt 0 (INT0) Flag. Set by hardware by a falling edge or by a zero level being applied

to the external interrupt pin, INT0, depending on the state of Bit IT0. Cleared by hardware when

the PC vectors to the interrupt service routine only if the interrupt was transition activated. If

level activated, the external requesting source controls the request flag rather than the on-chip

hardware.

0

0x88

IT0¹

0

External Interrupt 0 (IE0) Trigger Type. Set by software to specify edge sensitive detection, that is, 1-to-

0 transition. Cleared by software to specify level sensitive detection, that is, zero level.

1

INT0

INT1

interrupt pins.

These bits are not used to control Timer/Counter 0 and Timer/Counter 1 but are instead used to control and monitor the external

and

Table 105. Timer/Counter 2 Control SFR (T2CON, 0xC8)

Bit Address Mnemonic Default Description

7

6

5

0xCF

0xCE

0xCD

TF2

0

Timer 2 Overflow Flag. Set by hardware on a Timer 2 overflow. TF2 cannot be set when either

RCLK = 1 or TCLK = 1. Cleared by user software.

EXF2

RCLK

Timer 2 External Flag. Set by hardware when either a capture or reload is caused by a negative

transition on T2EX pin and EXEN2 = 1. Cleared by user software.

Receive Clock Enable Bit. Set by the user to enable the serial port to use Timer 2 overflow pulses

for its receive clock in Serial Port Mode 1 and Serial Port Mode 3. Cleared by the user to enable

Timer 1 overflow to be used for the receive clock.

4

3

0xCC

0xCB

TCLK

0

Transmit Clock Enable Bit. Set by the user to enable the serial port to use Timer 2 overflow pulses

for its transmit clock in Serial Port Mode 1 and Serial Port Mode 3. Cleared by the user to enable

Timer 1 overflow to be used for the transmit clock.

EXEN2

Timer 2 External Enable Flag. Set by the user to enable a capture or reload to occur as a result of a

negative transition on T2EX if Timer 2 is not being used to clock the serial port. Cleared by the

user for Timer 2 to ignore events at T2EX.

2

1

0xCA

0xC9

TR2

0

Timer 2 Start/Stop Control Bit. Set by the user to start Timer 2. Cleared by the user to stop Timer 2.

C/T2

Timer 2 Timer or Counter Function Select Bit. Set by the user to select the counter function (input

from external T2 pin). Cleared by the user to select the timer function (input from on-chip core

clock).

0

0xC8

CAP2

0

Timer 2 Capture/Reload Select Bit. Set by the user to enable captures on negative transitions at

T2EX if EXEN2 = 1. Cleared by the user to enable autoreloads with Timer 2 overflows or negative

transitions at T2EX when EXEN2 = 1. When either RCLK = 1 or TCLK = 1, this bit is ignored and the

timer is forced to autoreload on Timer 2 overflow.

Rev. A | Page 110 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Mode 0 (13-Bit Timer/Counter)

Table 106. Timer 0 High Byte SFR (TH0, 0x8C)

Mode 0 configures an 8-bit timer/counter. Figure 95 shows

Mode 0 operation. Note that the divide-by-12 prescaler is not

present on the single cycle core.

Bit

Mnemonic

Default

Description

7 to 0

TH0

0

Timer 0 Data High Byte.

Table 107. Timer 0 Low Byte SFR (TL0, 0x8A)

Bit

7 to 0

f_CORE

Mnemonic

Default

Description

C/T0 = 0

TL0

0

Timer 0 Data Low Byte.

INTERRUPT

TL0

TH0

TF0

(5 BITS) (8 BITS)

C/T0 = 1

Table 108. Timer 1 High Byte SFR (TH1, 0x8D)

P0.6/T0

GATE

Bit

Mnemonic

Default

Description

CONTROL

7 to 0

TH1

0

Timer 1 Data High Byte.

TR0

Table 109. Timer 1 Low Byte SFR (TL1, 0x8B)

Bit

Mnemonic

Default

Description

I

NT0

7 to 0

TL1

0

Timer 1 Data Low Byte.

Figure 95. Timer/Counter 0, Mode 0

In this mode, the timer register is configured as a 13-bit register.

As the count rolls over from all 1s to all 0s, it sets the timer

overflow flag, TF0. TF0 can then be used to request an interrupt.

The counted input is enabled to the timer when TR0 = 1 and either

Table 110. Timer 2 High Byte SFR (TH2, 0xCD)

Bit

Mnemonic

Default

Description

7 to 0

TH2

0

Timer 2 Data High Byte.

Table 111. Timer 2 Low Byte SFR (TL2, 0xCC)

INT0

Gate0 = 0 or

= 1. Setting Gate0 = 1 allows the timer to be

INT0

Bit

Mnemonic

Default

Description

controlled by external input

to facilitate pulse width

7 to 0

TL2

0

Timer 2 Data Low Byte.

measurements. TR0 is a control bit in the Timer/Counter 0 and

Timer/Counter 1 Control SFR (TCON, 0x88); the Gate bit is in

Timer/Counter 0 and Timer/Counter 1 Mode SFR (TMOD, 0x89).

The 13-bit register consists of all 8 bits of Timer 0 High Byte

SFR (TH0, 0x8C) and the lower 5 bits of Timer 0 Low Byte SFR

(TL0, 0x8A). The upper three bits of TL0 SFR are indeterminate

and should be ignored. Setting the run flag (TR0) does not clear

the registers.

Table 112. Timer 2 Reload/Capture High Byte SFR

(RACP2H, 0xCB)

Bit

Mnemonic

Default

Description

7 to 0

TH2

0

Timer 2 Reload/

Capture High Byte.

Table 113. Timer 2 Reload/Capture Low Byte SFR

(RACP2L, 0xCA)

Mode 1 (16-Bit Timer/Counter)

Bit

Mnemonic

Default

Description

Mode 1 is the same as Mode 0 except that the Mode 1 timer

register runs with all 16 bits. Mode 1 is shown in Figure 96.

7 to 0

TL2

0

Timer 2 Reload/

Capture Low Byte.

f_CORE

TIMER 0 AND TIMER 1

C/T0 = 0

INTERRUPT

Timer/Counter 0 and Timer/Counter 1 Data Registers

TL0

TH0

TF0

(8 BITS) (8 BITS)

Each timer consists of two 8-bit registers. They are Timer 0

High Byte SFR (TH0, 0x8C), Timer 0 Low Byte SFR (TL0, 0x8A),

Timer 1 High Byte SFR (TH1, 0x8D), and Timer 1 Low Byte SFR

(TL1, 0x8B) These can be used as independent registers or

combined into a single 16-bit register, depending on the timer

mode configuration (see Table 106 to Table 109).

C/T0 = 1

P0.6/T0

CONTROL

TR0

GATE

INT0

Figure 96. Timer/Counter 0, Mode 1

Timer/Counter 0 and Timer/Counter 1 Operating Modes

This section describes the operating modes for Timer/Counter 0

and Timer/Counter 1. Unless otherwise noted, these modes of

operation are the same for both Timer 0 and Timer 1.

Rev. A | Page 111 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Mode 2 (8-Bit Timer/Counter with Autoreload)

TIMER 2

Timer/Counter 2 Data Registers

Mode 2 configures the timer register as an 8-bit counter (TL0)

with automatic reload as shown in Figure 97. Overflow from TL0

not only sets TF0 but also reloads TL0 with the contents of TH0,

which is preset by software. The reload leaves TH0 unchanged.

Timer/Counter 2 also has two pairs of 8-bit data registers

associated with it: Timer 2 High Byte SFR (TH2, 0xCD), Timer

2 Low Byte SFR (TL2, 0xCC), Timer 2 Reload/Capture High

Byte SFR (RACP2H, 0xCB), and Timer 2 Reload/Capture Low

Byte SFR (RACP2L, 0xCA). These are used as both timer data

registers and as timer capture/reload registers (see Table 110 to

Table 113).

f_CORE

C/T = 0

INTERRUPT

TL0

TF0

(8 BITS)

C/T = 1

Timer/Counter 2 Operating Modes

P0.6/T0

CONTROL

TR0

The following sections describe the operating modes for

Timer/Counter 2. The operating modes are selected by bits in

the Timer/Counter 2 Control SFR (T2CON, 0xC8), as shown in

Table 105 and Table 114.

RELOAD

GATE

INT0

TH0

(8 BITS)

Figure 97. Timer/Counter 0, Mode 2

Table 114. T2CON Operating Modes

RCLK (or) TCLK

CAP2

TR2

Mode

Mode 3 (Two 8-Bit Timer/Counters)

0

1

X

0

1

X

1

16-bit autoreload

16-bit capture

Baud rate

Off

Mode 3 has different effects on Timer 0 and Timer 1. Timer 1 in

Mode 3 simply holds its count. The effect is the same as setting

TR1 = 0. Timer 0 in Mode 3 establishes TL0 and TH0 as two

separate counters. This configuration is shown in Figure 98.

1

0

T

TL0 uses the Timer 0 control bits, C/ , Gate0 (see Table 103),

INT0

16-Bit Autoreload Mode

TR0, TF0 (see Table 104), and

. TH0 is locked into a timer

Autoreload mode has two options that are selected by Bit EXEN2

in Timer/Counter 2 Control SFR (T2CON, 0xC8). If EXEN2 = 0

when Timer 2 rolls over, it not only sets TF2 but also causes the

Timer 2 registers to be reloaded with the 16-bit value in both the

Timer 2 Reload/Capture High Byte SFR (RACP2H, 0xCB) and

Timer 2 Reload/Capture Low Byte SFR (RACP2L, 0xCA)

registers, which are preset by software. If EXEN2 = 1, Timer 2

performs the same events as when EXEN2 = 0 but adds a 1-to-0

transition at external input T2EX, which triggers the 16-bit

reload and sets EXF2. Autoreload mode is shown in Figure 99.

function (counting machine cycles) and takes over the use of

TR1 and TF1 from Timer 1. Therefore, TH0 controls the Timer 1

interrupt. Mode 3 is provided for applications requiring an

extra 8-bit timer or counter.

When Timer 0 is in Mode 3, Timer 1 can be turned on and off

by switching it out of and into its own Mode 3, or it can be used

by the serial interface as a baud rate generator. In fact, Timer1

can be used in any application not requiring an interrupt from

Timer 1 itself.

CORE

CLK/12

16-Bit Capture Mode

f_CORE

Capture mode has two options that are selected by Bit EXEN2

in Timer/Counter 2 Control SFR (T2CON, 0xC8). If EXEN2 = 0,

Timer 2 is a 16-bit timer or counter that, upon overflowing, sets

Bit TF2, the Timer 2 overflow bit, which can be used to generate

an interrupt. If EXEN2 = 1, Timer 2 performs the same events

as when EXEN2 = 0 but adds a l-to-0 transition on external

input T2E, which causes the current value in the Timer 2 registers,

TL2 and TH2, to be captured into the RCAP2L and RCAP2H

registers, respectively. In addition, the transition at T2EX causes

Bit EXF2 in T2CON to be set, and EXF2, like TF2, can generate

an interrupt. Capture mode is shown in Figure 100. The baud

rate generator mode is selected by RCLK = 1 and/or TCLK = 1.

C/T = 0

INTERRUPT

TL0

TF0

(8 BITS)

C/T = 1

P0.6/T0

CONTROL

TR0

GATE

INT0

INTERRUPT

TH0

f_CORE/12

TF1

(8 BITS)

TR1

In either case, if Timer 2 is used to generate the baud rate, the TF2

interrupt flag does not occur. Therefore, Timer 2 interrupts do not

occur and do not have to be disabled. In this mode, the EXF2 flag

can, however, still cause interrupts that can be used as a third

external interrupt. Baud rate generation is described as part of the

UART serial port operation in the UART Serial Interface section.

Figure 98. Timer/Counter 0, Mode 3

Rev. A | Page 112 of 144

ADE7566/ADE7569/ADE7166/ADE7169

f_CORE

C/T2 = 0

C/T2 = 1

TL2

(8 BITS)

TH2

(8 BITS)

P1.4/T2

CONTROL

RELOAD

TR2

TRANSITION

DETECTOR

RCAP2L

RCAP2H

TF2

TIMER

INTERRUPT

P1.3/

T2EX

EXF2

CONTROL

EXEN2

Figure 99. Timer/Counter 2, 16-Bit Autoreload Mode

f_CORE

C/T2 = 0

C/T2 = 1

TL2

(8 BITS)

TH2

(8 BITS)

TF2

P1.4/T2

CONTROL

TR2

TIMER

INTERRUPT

CAPTURE

TRANSITION

DETECTOR

RCAP2L

RCAP2H

P1.3/

T2EX

EXF2

CONTROL

EXEN2

Figure 100. Timer/Counter 2, 16-Bit Capture Mode

Rev. A | Page 113 of 144

ADE7566/ADE7569/ADE7166/ADE7169

PLL

The ADE7566/ADE7569/ADE7166/ADE7169 are intended for use

with a 32.768 kHz watch crystal. A PLL locks onto a multiple of this

frequency to provide a stable 4.096 MHz clock for the system. The

core can operate at this frequency or at binary submultiples of it to

allow power savings when maximum core performance is not

required. The default core clock is the PLL clock divided by 4 or

1.024 MHz. The ADE energy measurement clock is derived

from the PLL clock and is maintained at 4.096 MHz/5 MHz,

819.2 kHz across all CD settings.

The PLL is controlled by the CD[2:0] bits in the Power Control

SFR (POWCON, 0xC5). To protect erroneous changes to the

POWCON SRF, a key is required to modify the register. First,

the Key SFR (KYREG, 0xC1) is written with the key, 0xA7, and

then a new value is written to the POWCON SFR.

If the PLL loses lock, the MCU is reset and the PLL_FLT bit is

set in the Peripheral Configuration SFR (PERIPH, 0xF4). Set

the PLLACK bit in the Start ADC Measurement SFR (ADCGO,

0xD8) to acknowledge the PLL fault, clearing the PLL_FLT bit.

PLL REGISTERS

Table 115. Power Control SFR (POWCON, 0xC5)

Bit

Mnemonic Default Description

7

Reserved

1

0

Reserved.

6

METER_OFF

Set this bit to turn off the modulators and energy metering DSP circuitry to reduce power if metering

functions are not needed in PSM0.

5

Reserved

COREOFF

Reserved

CD[2:0]

0

This bit should be kept at 0 for proper operation.

Set this bit to shut down the core if in the PSM1 operating mode.

Reserved.

4

3

2 to 0

010

Controls the core clock frequency (f_CORE). f_CORE= 4.096 MHz/2^CD.

CD[2:0]

000

001

010

011

100

101

110

111

Result (f_COREin MHz)

4.096

2.048

1.024

0.512

0.256

0.128

0.064

0.032

Writing to the Power Control SFR (POWCON, 0xC5)

Note that writing data to the POWCON SFR involves writing 0xA7 into the Key SFR (KYREG, 0xC1) followed by a write to the

POWCON SFR.

Table 116. Key SFR (KYREG, 0xC1)

Bit

Mnemonic Default Description

7 to 0

KYREG

0

Write 0xA7 to the KYREG SFR before writing to the POWCON SFR to unlock it.

Write 0xEA to the KYREG SFR before writing to the INTPR, HTHSEC, SEC, MIN, or HOUR timekeeping

registers to unlock it.

Rev. A | Page 114 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 117. Peripheral Configuration SFR (PERIPH, 0xF4)

Bit

Mnemonic

Default

Description

7

RXFLAG

0

1

If set, indicates that a Rx edge event triggered wake-up from PSM2.

6

VSWSOURCE

Indicates the power supply that is connected internally to V_SWOUT. If set, V_SWOUT= V_DD. If

cleared, V_SWOUT= V_BAT

.

5

4

3

VDD_OK

1

0

If set, indicates that V_DDpower supply is ok for operation.

If set, indicates that PLL is not locked.

PLL_FLT

REF_BAT_EN

If set, the internal voltage reference is enabled in PSM2 mode. This bit should be set if the

LCD is on in PSM2 mode.

2

Reserved

0

This bit should be kept to zero.

1 to 0

RXPROG[1:0]

00

Controls the function of the P1.0/RxD pin.

RXPROG [1:0]

Result

00

01

11

GPIO

Rx with wake-up disabled

Rx with wake-up enabled

Table 118. Start ADC Measurement SFR (ADCGO, 0xD8)

Bit

Address

Mnemonic

Default

Description

7

0xDF

PLL_FTL_ACK

0

Set this bit to clear the PLL fault bit, PLL_FLT in the PERIPH register. A PLL fault

is generated if a reset was caused because the PLL lost lock.

6 to 3

2

0xDE to 0xDB

0xDA

Reserved

0

Reserved.

VDCIN_ADC_GO

Set this bit to initiate an external voltage measurement. This bit is cleared

when the measurement request is received by the ADC.

1

0

0xD9

0xD8

TEMP_ADC_GO

BATT_ADC_GO

0

Set this bit to initiate a temperature measurement. This bit is cleared when

the measurement request is received by the ADC.

Set this bit to initiate a battery measurement. This bit is cleared when the

measurement request is received by the ADC.

Rev. A | Page 115 of 144

ADE7566/ADE7569/ADE7166/ADE7169

REAL-TIME CLOCK

The ADE7566/ADE7569/ADE7166/ADE7169 have an

embedded real-time clock (RTC) as shown in Figure 101. The

external 32.768 kHz crystal is used as the clock source for the

RTC. Calibration is provided to compensate the nominal crystal

frequency and for variations in the external crystal frequency

over temperature. By default, the RTC is maintained active in all

power saving modes. The RTC counters retain their values

through watchdog resets and external resets. They are only reset

during a power-on reset.

RTC REGISTERS

Note that all the real-time clock SFRs are not bit addressable.

Table 119. Real-Time Clock SFR

SFR

Address

Description

TIMECON

HTHSEC

0xA1

0xA2

RTC Configuration (see Table 120).

Hundredths of a Second Counter

(see Table 121).

Seconds Counter (see Table 122).

Minutes Counter (see Table 123).

Hours Counter (see Table 124).

Alarm Interval (see Table 125).

RTC Nominal Compensation

(see Table 126).

SEC

MIN

HOUR

INTVAL

RTCCOMP

0xA3

0xA4

0xA5

0xA6

0xF6

32.768kHz

CRYSTAL

RTCCOMP

TEMPCAL

CALIBRATION

CALIBRATED

32.768kHz

RTCEN

TEMPCAL

0xF7

RTC Temperature Compensation

(see Table 127).

ITS1 ITS0

Protecting the RTC from Runaway Code

To protect the RTC from runaway code, a key must be written

to the KYREG register to obtain write access to the Interrupt

Pins Configuration SFR (INTPR, 0xFF), Hundredths of a

Second Counter SFR (HTHSEC, 0xA2), Seconds Counter SFR

(SEC, 0xA3), Minutes Counter SFR (MIN, 0xA4), and Hours

Counter SFR (HOUR, 0xA5). KYREG should be set to 0xEA to

unlock it and reset it to zero after a timekeeping register is

written to. The RTC registers can be written using the following

8052 assembly code:

8-BIT

PRESCALER

HUNDREDTHS COUNTER

HTHSEC

INTERVAL

TIMEBASE

SELECTION

MUX

ITEN

SECOND COUNTER

SEC

MOV

KYREG,#0EAh

INTPR,#080h

MINUTE COUNTER

MIN

HOUR COUNTER

HOUR

MIDNIGHT EVENT

8-BIT

INTERVAL COUNTER

ALARM

EVENT

EQUAL?

INTVAL SFR

Figure 101. RTC Implementation

Rev. A | Page 116 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 120. RTC Configuration SFR (TIMECON, 0xA1)

Bit

Mnemonic Default Description

7

MIDNIGHT

0

Midnight Flag. This bit is set when the RTC rolls over to 00:00:00:00. It can be cleared by the user to

indicate that the midnight event has been serviced. In twenty-four hour mode, the midnight flag is

raised once a day at midnight. When this interrupt is used for wake-up from PSM2 to PSM1, the RTC

interrupt must be serviced and the flag cleared to be allowed to enter PSM2.

6

TFH

0

Twenty-Four Hour Mode. This bit is retained during a watchdog reset or an external reset. It is reset after

a power-on reset (POR).

TFH

0

1

Result

256-Hour Mode. The HOUR register rolls over from 255 to 0.

24-Hour Mode. The HOUR register rolls over from 23 to 0.

5 to 4

ITS[1:0]

0

Interval Timer Timebase Selection.

ITS[1:0]

00

01

Result (Time Base)

1/128 sec.

Second.

10

Minute.

11

Hour.

3

SIT

Interval Timer 1 Alarm.

SIT

0

1

Result

The ALARM flag is set after INTVAL counts and then another interval count starts.

The ALARM flag is set after one time interval.

2

1

ALARM

ITEN

0

Interval Timer Alarm Flag. This bit is set when the configured time interval has elapsed. It can be cleared

by the user to indicate that the alarm event has been serviced. This bit cannot be set to 1 by user code.

Interval Timer Enable.

ITEN

Result

0

1

The interval timer is disabled. The 8-bit interval timer counter is reset.

Set this bit to enable the interval timer. The RTCEN bit must also be set to enable the

interval timer.

0

Reserved

1

This bit must be left set for proper operation.

Table 121. Hundredths of a Second Counter SFR (HTHSEC, 0xA2)

Bit

Mnemonic Default Description

7 to 0

HTHSEC

0

This counter updates every 1/128 second, referenced from the calibrated 32.768 kHz clock. It overflows

from 127 to 00, incrementing the seconds counter (SEC). This register is retained during a watchdog

reset or an external reset. It is reset after a POR.

Table 122. Seconds Counter SFR (SEC, 0xA3)

Bit

Mnemonic Default Description

7 to 0

SEC

0

This counter updates every second, referenced from the calibrated 32.768 kHz clock. It overflows from 59 to

00, incrementing the minutes counter (MIN). This register is retained during a watchdog reset or an

external reset. It is reset after a POR.

Table 123. Minutes Counter SFR (MIN, 0xA4)

Bit

Mnemonic Default Description

7 to 0

MIN

0

This counter updates every minute, referenced from the calibrated 32.768 kHz clock. It overflows from 59 to

00, incrementing the hours counter, HOUR. This register is retained during a watchdog reset or an

external reset. It is reset after a POR.

Table 124. Hours Counter SFR (HOUR, 0xA5)

Bit

Mnemonic Default Description

7 to 0

HOUR

0

This counter updates every hour, referenced from the calibrated 32.768 kHz clock. If the TFH bit in the

RTC Configuration SFR (TIMECON, 0xA1) is set, the HOUR SFR overflows from 23 to 00, setting the

MIDNIGHT bit and creating a pending RTC interrupt. If the TFH bit is cleared, the HOUR SFR overflows from

255 to 00, setting the MIDNIGHT bit and creating a pending RTC interrupt. This register is retained during

a watchdog reset or an external reset. It is reset after a POR.

Rev. A | Page 117 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 125. Alarm Interval SFR (INTVAL, 0xA6)

Bit

Mnemonic

Default Description

7 to 0

INTVAL

0

The interval timer counts according to the time base established in the ITS[1:0] bits of the RTC Configuration

SFR (TIMECON, 0xA1). Once the number of counts is equal to INTVAL, the ALARM flag is set and a

pending RTC interrupt is created. Note that the interval counter is eight bits. Therefore, it can count up to

255 seconds, for example.

Table 126. RTC Nominal Compensation SFR (RTCCOMP, 0xF6)

Bit

Mnemonic

Default Description

The RTCCOMP SFR holds the nominal RTC compensation value at 25°C. This register is retained during

a watchdog reset or an external reset. It is reset after a POR.

7 to 0

RTCCOMP

0

Table 127. RTC Temperature Compensation SFR (TEMPCAL, 0xF7)

Bit

Mnemonic

Default Description

7 to 0

TEMPCAL

0

The TEMPCAL SFR is adjusted based on the temperature read in the TEMPADC to calibrate the RTC over

temperature. This allows the external crystal shift to be compensated over temperature. This register is

retained during a watchdog reset or an external reset. It is reset after a POR.

Table 128. Interrupt Pins Configuration SFR (INTPR, 0xFF)

Bit

Mnemonic

Default Description

7

RTCCAL

0

Controls the RTC calibration output. When set, the RTC calibration frequency selected by FSEL[1:0] is

output on the P0.2/CF1/RTCCAL pin.

6 to 5

FSEL[1:0]

Sets RTC calibration output frequency and calibration window.

FSEL[1:0]

Result (Calibration Window, Frequency)

30.5 sec, 1 Hz

30.5 sec, 512 Hz

0.244 sec, 500 Hz

0.244 sec, 16.384 kHz

0

1

0

1

0

1

4

Reserved

3 to 1

INT1PRG[2:0] 000

Controls the function of INT1.

INT1PRG[2:0]

Result

x

0

1

0

1

0

1

x

GPIO

BCTRL

INT1 input disabled

INT1 input enabled

0

INT0PRG

0

Controls the function of INT0.

INT0PRG

Result

0

1

INT0 input disabled

INT0 input enabled

Table 129. Key SFR (KYREG, 0xC1)

Bit

Mnemonic

Default Description

7 to 0

KYREG

0

Write 0xA7 to the this SFR before writing to the POWCON SFR, which unlocks KYREG.

Write 0xEA to the this SFR before writing to the INTPR, HTHSEC, SEC, MIN, or HOUR timekeeping

registers to unlock KYREG.

Rev. A | Page 118 of 144

ADE7566/ADE7569/ADE7166/ADE7169

READ AND WRITE OPERATIONS

RTC MODES

Writing to the RTC Registers

The RTC can be configured in a 24-hour mode or a 256-hour

mode. A midnight event is generated when the RTC hour

counter rolls over from 23 to 0 or 255 to 0, depending on

whether the TFH bit is set in the RTC Configuration SFR

(TIMECON, 0xA1). The midnight event sets the MIDNIGHT

flag in the TIMECON SFR, and a pending RTC interrupt is

created. The RTC midnight event wakes the 8052 MCU core if

the MCU is asleep in PSM2 when the midnight event occurs.

The RTC circuitry runs off a 32.768 kHz clock. The timekeeping

registers, Hundredths of a Second Counter SFR (HTHSEC, 0xA2),

Seconds Counter SFR (SEC, 0xA3), Minutes Counter SFR (MIN,

0xA4), and Hours Counter SFR (HOUR, 0xA5), are updated

with a 32.768 kHz clock. However, the RTC Configuration SFR

(TIMECON, 0xA1) and Alarm Interval SFR (INTVAL, 0xA6)

are updated with a 128 Hz clock. It takes up to two 128 Hz clock

cycles from when the MCU writes to the TIMECON SFR or

INTVAL SFR until there is a successful update in the RTC.

In the 24-hour mode, the midnight event is generated once a

day at midnight. The 24-hour mode is useful for updating a

software calendar to keep track of the current day. The 256-hour

mode results in power savings during extended operation in

PSM2 because the MCU core wakes up less frequently.

To protect the RTC timekeeping registers from runaway code, a

key must be written to the Key SFR (KYREG, 0xC1), which is

described in Table 116, to obtain write access to the HTHSEC,

SEC, MIN and HOUR SFRs. KYREG should be set to 0xEA to

unlock the timekeeping registers and reset to 0 after a timekeeping

register is written to. The RTC registers can be written to using

the following 8052 assembly code:

RTC INTERRUPTS

The RTC midnight interrupt and alarm interrupt are enabled by

setting the ETI bit in the Interrupt Enable and Priority 2 SFR

(IEIP2, 0xA9). When a midnight or alarm event occurs, a

pending RTC interrupt is generated. If the RTC interrupt is

enabled, the program vectors to the RTC interrupt address and

the pending interrupt is cleared. If the RTC interrupt is

disabled, the RTC interrupt remains pending until the RTC

interrupt is enabled. The program then vectors to the RTC

interrupt address.

MOV

CALL

…

RTCKey,#0EAh

UpdateRTC

UpdateRTC:

MOV KYREG,RTCKey

MOV SEC,#30

MOV KYREG,RTCKey

MOV MIN,#05

The MIDNIGHT flag and ALARM flag are set when the

midnight event and alarm event occur, respectively. The user

should manage these flags to keep track of which event caused

an RTC interrupt by servicing the event and clearing the

appropriate flag in the RTC interrupt servicing routine.

MOV KYREG,RTCKey

MOV HOUR,#04

MOV KYREG,#00h

RET

Note that if the ADE7566/ADE7569/ADE7166/ADE7169 are

awakened by an RTC event, either by the MIDNIGHT event or

ALARM event, the pending RTC interrupt must be serviced

before the device can go back to sleep again. The ADE7566/

ADE7569/ADE7166/ADE7169 keep waking up until this

interrupt has been serviced.

Reading the RTC Counter SFRs

The RTC cannot be stopped to read the current time because

stopping the RTC introduces an error in its timekeeping.

Therefore, the RTC is read on the fly, and the counter registers

must be checked for overflow. This can be accomplished

through the following 8052 assembly code:

Interval Timer Alarm

The RTC can be used as an interval timer. When the interval

timer is enabled by setting the ITEN bit in the RTC Configuration

SFR (TIMECON, 0xA1), the interval timer clock source selected

by the ITS1 and ITS0 bits is passed through an 8-bit counter.

This counter increments on every interval timer clock pulse

until it is equal to the value in the Alarm Interval SFR (INTVAL,

0xA6). Then, an alarm event is generated, setting the ALARM

flag and creating a pending RTC interrupt. If the SIT bit in the

RTC Configuration SFR (TIMECON, 0xA1) is cleared, the 8-bit

counter is also cleared and starts counting again. If the SIT bit is

set, the 8-bit counter is held in reset after the alarm occurs.

ReadAgain:

MOV R0,HTHSEC

MOV R1,SEC

; using Bank 0

MOV R2,MIN

MOV R3,HOUR

MOV A,HTHSEC

CJNE A, 00h, ReadAgain ; 00h is R0 in

Bank 0

Rev. A | Page 119 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Take care when changing the interval timer time base. The

recommended procedure is as follows:

mode: 1 Hz with FSEL[1:0] = 00 and 512 Hz with FSEL[1:0] =

01 in the Interrupt Pins Configuration SFR (INTPR, 0xFF).

1. If the Alarm Interval SFR (INTVAL, 0xA6) is going to

be modified, write to this register first. Then, wait for

one 128 Hz clock cycle to synchronize with the RTC,

64,000 cycles at a 4.096 MHz instruction cycle clock.

2. Disable the interval timer by clearing the ITEN bit in the

RTC Configuration SFR (TIMECON, 0xA1). Then, wait

for one 128 Hz clock cycle to synchronize with the RTC,

64,000 cycles at a 4.096 MHz instruction cycle clock.

3. Read the TIMECON SFR to ensure that the ITEN bit is

clear. If it is not, wait for another 128 Hz clock cycle.

4. Set the time-base bits (ITS[1:0]) in the TIMECON SFR to

configure the interval. Wait for a 128 Hz clock cycle for this

change to take effect.

A shorter window of 0.244 seconds is offered for fast calibration

during PSM0 or PSM1. Two output frequencies are offered for

this RTC calibration output mode: 500 Hz with FSEL[1:0] = 10

and 16.384 kHz with FSEL[1:0] = 11 in the INTPR SFR. Note

that for the 0.244 second calibration window, the RTC is

clocked 125 times faster than in normal mode, resulting in

timekeeping registers that represent seconds/125, minutes/125,

and hours/125 instead of seconds, minutes, and hours.

Therefore, this mode should be used for calibration only.

Table 130. RTC Calibration Options

Calibration

FSEL[1:0] Window (Sec)

f_RTCCAL

(Hz)

Option

Normal Mode 0

Normal Mode 1

00

01

30.5

1

The RTC alarm event wakes the 8052 MCU core if the MCU is

in PSM2 when the alarm event occurs.

30.5

512

500

16,384

Calibration Mode 0 10

Calibration Mode 1 11

0.244

RTC CALIBRATION

When no RTC compensation is applied, that is, when RTC

Nominal Compensation SFR (RTCCOMP, 0xF6) and RTC

Temperature Compensation SFR (TEMPCAL, 0xF7) are equal

to 0, the nominal compensation required to account for the

error in the external crystal can be determined. In this case, it is

not necessary to wait for an entire calibration window to determine

the error in the pulse output. Calculating at the error in frequency

between two consecutive pulses on the P0.2/CF1/RTCCAL pin

is enough.

The RTC provides registers to calibrate the nominal external

crystal frequency and its variation over temperature. A frequency

error up to 248 ppm can be calibrated out by the RTC circuitry,

which adds or subtracts pulses from the external crystal signal.

The nominal crystal frequency should be calibrated with the

RTC nominal compensation register so that the clock going into

the RTC is precisely 32.768 kHz at 25°C. The RTC Temperature

Compensation SFR (TEMPCAL, 0xF7) is used to compensate

for the external crystal drift over temperature by adding or

subtracting additional pulses based on temperature.

The value to write to the RTC Nominal Compensation

SFR (RTCCOMP, 0xF6) is calculated from the % error or

seconds per day error on the frequency output. Each LSB

of the RTCCOMP SFR represents 2 ppm of correction where

1 second/day error is equal to 11.57 ppm.

The LSB of each RTC compensation register represents a

2 ppm frequency error. The RTC compensation circuitry adds

the RTC Temperature Compensation SFR (TEMPCAL, 0xF7)

and the RTC Nominal Compensation SFR (RTCCOMP, 0xF6)

to determine how much compensation is required. Note that

the sum of these two registers is limited to 248 ppm.

RTCCOMP = 5000 ×(% Error)

1

RTCCOMP =

×(sec/day Error)

Calibration Flow

2 ×11.57

A RTC calibration pulse output is provided on the P0.2/CF1/

RTCCAL pin. Enable the RTC output by setting the RTCCAL

bit in the Interrupt Pins Configuration SFR (INTPR, 0xFF).

During calibration, user software writes the RTC with the

current time. Refer to the Read and Write Operations section

for more information on how to read and write the RTC

timekeeping registers.

The RTC calibration is accurate to within 2 ppm over a 30.5

second window in all operational modes: PSM0, PSM1, and

PSM2. Two output frequencies are offered for the normal RTC

Rev. A | Page 120 of 144

ADE7566/ADE7569/ADE7166/ADE7169

UART SERIAL INTERFACE

The ADE7566/ADE7569/ADE7166/ADE7169 UART can be

configured in one of four modes.

and TxD (P1.1) pins, while the firmware interface is through

the SFRs presented in Table 131.

Both the serial port receive and transmit registers are accessed

through the Serial Port Buffer SFR (SBUF, 0x99). Writing to

SBUF loads the transmit register, and reading SBUF accesses a

physically separate receive register.

•

Shift register with baud rate fixed at f_CORE/12

8-bit UART with variable baud rate

9-bit UART with baud rate fixed at f_CORE/64 or f_CORE/32

9-bit UART with variable baud rate

An enhanced UART mode is offered by using the UART timer

and by providing enhanced frame error, break error, and

overwrite error detection. This mode is enabled by setting the

EXTEN bit in the Configuration SFR (CFG, 0xAF) (see the

UART Additional Features section). The Enhanced Serial Baud

Rate Control SFR (SBAUDT, 0x9E) and UART Timer Fractional

Divider SFR (SBAUDF, 0x9D) are used to configure the UART

timer and to indicate the enhanced UART errors.

Variable baud rates are defined by using an internal timer to

generate any rate between 300 baud/second and 115,200

baud/second.

The UART serial interface provided in the ADE7566/ADE7569/

ADE7166/ADE7169 is a full-duplex serial interface. It is also

receive buffered by storing the first received byte in a receive

buffer until the reception of the second byte is complete. The

physical interface to the UART is provided via the RxD (P1.0)

UART REGISTERS

Table 131. Serial Port SFRs

SFR

Address

Bit Addressable

Description

SCON

SBUF

0x98

Yes

No

Serial Communications Control Register (see Table 132).

Serial Port Buffer (see Table 133).

0x99

SBAUDT

SBAUDF

0x9E

Enhanced Serial Baud Rate Control (see Table 134).

UART Timer Fractional Divider (see Table 135).

0x9D

Table 132. Serial Communications Control Register Bit Description SFR (SCON, 0x98)

Bit

Address

Mnemonic Default Description

7 to 6

0x9F, 0x9E SM0, SM1

00 UART Serial Mode Select Bits. These bits select the serial port operating mode.

SM[0:1]

00

01

Result (Selected Operating Mode)

Mode 0, shift register, fixed baud rate (f_CORE/12).

Mode 1, 8-bit UART, variable baud rate.

10

11

Mode 2, 9-bit UART, fixed baud rate (f_CORE/32) or (f_CORE/16).

Mode 3, 9-bit UART, variable baud rate.

5

0x9D

SM2

0

Multiprocessor Communication Enable Bit. Enables multiprocessor communication in

Mode 2 and Mode 3, and framing error detection in Mode 1.

In Mode 0, SM2 should be cleared.

In Mode 1, if SM2 is set, RI is not activated if a valid stop bit was not received.

If SM2 is cleared, RI is set as soon as the byte of data is received.

In Mode 2 or Mode 3, if SM2 is set, RI is not activated if the received ninth data bit in RB8 is 0.

If SM2 is cleared, RI is set as soon as the byte of data is received.

4

3

2

1

0x9C

0x9B

0x9A

0x99

REN

TB8

RB8

TI

0

Serial Port Receive Enable Bit. Set by user software to enable serial port reception.

Cleared by user software to disable serial port reception.

Serial Port Transmit (Bit 9). The data loaded into TB8 is the ninth data bit transmitted in

Mode 2 and Mode 3.

Serial Port Receiver Bit 9. The ninth data bit received in Mode 2 and Mode 3 is latched

into RB8. For Mode 1, the stop bit is latched into RB8.

Serial Port Transmit Interrupt Flag. Set by hardware at the end of the eighth bit in Mode 0 or

at the beginning of the stop bit in Mode 1, Mode 2, and Mode 3.

TI must be cleared by user software.

0

0x98

RI

0

Serial Port Receive Interrupt Flag. Set by hardware at the end of the eighth bit in Mode 0 or

halfway through the stop bit in Mode 1, Mode 2, and Mode 3.

RI must be cleared by user software.

Rev. A | Page 121 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 133. Serial Port Buffer SFR (SBUF, 0x99)

Bit

Mnemonic

Default

Description

7 to 0

SBUF

0

Serial Port Data Buffer.

Table 134. Enhanced Serial Baud Rate Control SFR (SBAUDT, 0x9E)

Bit

Mnemonic

Default Description

7

OWE

0

Overwrite Error. This bit is set when new data is received and RI = 1. It indicates that SBUF was not

read before the next character was transferred in, causing the prior SBUF data to be lost. Write a 0 to

this bit to clear it.

6

5

FE

BE

0

Frame Error. This bit is set when the received frame did not have a valid stop bit. This bit is read only

and updated every time a frame is received.

Break Error. This bit is set whenever the receive data line (Rx) is low for longer than a full transmission

frame, which is the time required for a start bit, 8 data bits, a parity bit, and half a stop bit. This bit is

updated every time a frame is received.

4, 3

SBTH1, SBTH0

0

Extended divider ratio for baud rate setting as shown in Table 136.

Binary Divider. See Table 136.

2, 1, 0

DIV2, DIV1, DIV0

DIV[2:0]

000

001

010

011

100

101

110

111

Result

Divide by 1.

Divide by 2.

Divide by 4.

Divide by 8.

Divide by 16.

Divide by 32.

Divide by 64.

Divide by 128.

Table 135. UART Timer Fractional Divider SFR (SBAUDF, 0x9D)

Bit

Mnemonic

Default Description

7

UARTBAUDEN

0

UART Baud Rate Enable. Set to enable UART timer to generate the baud rate.

When set, PCON.7 (SMOD), T2CON.4 (TCLK), and T2CON.5 (RCLK) are ignored.

Cleared to let the baud rate be generated as per a standard 8052.

6

5

4

3

2

1

0

Not Implemented, Write Don’t Care.

UART Timer Fractional Divider Bit 5.

UART Timer Fractional Divider Bit 4.

UART Timer Fractional Divider Bit 3.

UART Timer Fractional Divider Bit 2.

UART Timer Fractional Divider Bit 1.

UART Timer Fractional Divider Bit 0.

SBAUDF.5

SBAUDF.4

SBAUDF.3

SBAUDF.2

SBAUDF.1

SBAUDF.0

0

Rev. A | Page 122 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 136. Common Baud Rates Using UART Timer with a 4.096 MHz PLL Clock

Ideal Baud

115,200

57,600

38,400

19,200

9600

4800

2400

300

CD

0

1

0

1

0

1

2

0

1

2

3

0

1

2

3

4

0

1

2

3

4

5

0

1

2

3

4

5

6

0

1

2

3

4

5

6

7

SBTH

0

2

1

0

DIV

1

0

2

1

2

1

0

3

2

1

0

4

3

2

1

0

5

4

3

2

1

0

6

5

4

3

2

1

0

7

6

5

4

3

2

SBAUDT

0x01

0x00

0x02

0x01

0x02

0x01

0x00

0x03

0x02

0x01

0x00

0x04

0x03

0x02

0x01

0x00

0x05

0x04

0x03

0x02

0x01

0x00

0x06

0x05

0x04

0x03

0x02

0x01

0x00

0x17

0x0F

0x07

0x06

0x05

0x04

0x03

0x02

SBAUDF

0x87

0xAB

% Error

+0.16

−0.31

300

Rev. A | Page 123 of 144

ADE7566/ADE7569/ADE7166/ADE7169

All of the following conditions must be met at the time the final

shift pulse is generated to receive a character:

UART OPERATION MODES

Mode 0 (Shift Register with Baud Rate Fixed at f_CORE/12)

•

If the extended UART is disabled (EXTEN = 0 in the CFG

SFR), RI must be 0 to receive a character. This ensures that

the data in the SBUF SFR is not overwritten if the last

received character has not been read.

If frame error checking is enabled by setting SM2, the

received stop bit must be set to receive a character. This

ensures that every character received comes from a valid

frame, with both a start bit and a stop bit.

Mode 0 is selected when the SM0 and SM1 bits in the Serial

Communications Control Register Bit Description SFR (SCON,

0x98) are cleared. In this shift register mode, serial data enters

and exits through RxD. TxD outputs the shift clock. The baud

rate is fixed at f_CORE/12. Eight data bits are transmitted or

received.

•

Transmission is initiated by any instruction that writes to the

Serial Port Buffer SFR (SBUF, 0x99). The data is shifted out of

the RxD line. The eight bits are transmitted with the least

significant bit (LSB) first.

If any of these conditions are not met, the received frame is

irretrievably lost, and the receive interrupt flag (RI) is not set.

Reception is initiated when the receive enable bit (REN) is 1

and the receive interrupt bit (RI) is 0. When RI is cleared, the

data is clocked into the RxD line, and the clock pulses are

output from the TxD line as shown in Figure 102.

If the received frame has met the previous criteria, the following

events occur:

•

The eight bits in the receive shift register are latched into

the SBUF SFR.

RxD

(DATA OUT)

•

The ninth bit (stop bit) is clocked into RB8 in the SCON SFR.

The receiver interrupt flag (RI) is set.

DATA BIT 0

DATA BIT 1

DATA BIT 6

DATA BIT 7

TxD

(SHIFT CLOCK)

Mode 2 (9-Bit UART with Baud Fixed at f_CORE/64 or f_CORE/32)

Figure 102. 8-Bit Shift Register Mode

Mode 2 is selected by setting SM0 and clearing SM1. In this

mode, the UART operates in 9-bit mode with a fixed baud rate.

The baud rate is fixed at f_CORE/64 by default, although setting the

SMOD bit in the Program Control SFR (PCON, 0x87) doubles

the frequency to f_CORE/32. Eleven bits are transmitted or received:

a start bit (0), eight data bits, a programmable ninth bit, and a

stop bit (1). The ninth bit is most often used as a parity bit or as

part of a multiprocessor communication protocol, although it

can be used for anything, including a ninth data bit, if required.

Mode 1 (8-Bit UART, Variable Baud Rate)

Mode 1 is selected by clearing SM0 and setting SM1. Each data

byte (LSB first) is preceded by a start bit (0) and followed by a

stop bit (1). Therefore, each frame consists of 10 bits transmitted

on TxD or received on RxD.

The baud rate is set by a timer overflow rate. Timer 1 or Timer 2

can be used to generate baud rates, or both timers can be used

simultaneously where one generates the transmit rate and the

other generates the receive rate. There is also a dedicated timer

for baud rate generation, the UART timer, which has a fractional

divisor to precisely generate any baud rate (see the UART Timer

Generated Baud Rates section).

To use the ninth data bit as part of a communication protocol for

a multiprocessor network such as RS-485, the ninth bit is set to

indicate that the frame contains the address of the device with

which the master wants to communicate. The devices on the

network are always listening for a packet with the ninth bit set

and are configured such that if the ninth bit is cleared, the frame

is not valid, and a receive interrupt is not generated. If the ninth

bit is set, all devices on the network receive the address and obtain a

receive character interrupt. The devices examine the address and, if

it matches one of the device’s preprogrammed addresses, that

device configures itself to listen to all incoming frames, even those

with the ninth bit cleared. Because the master has initiated

communication with that device, all the following packets with

the ninth bit cleared are intended specifically for that addressed

device until another packet with the ninth bit set is received. If

the address does not match, the device continues to listen for

address packets.

Transmission is initiated by a write to the Serial Port Buffer SFR

(SBUF, 0x99). Next, a stop bit (1) is loaded into the ninth bit

position of the transmit shift register. The data is output bit-by-

bit until the stop bit appears on TxD and the transmit interrupt

flag (TI) is automatically set as shown in Figure 103.

STOP BIT

START

BIT

D0 D1 D2

D3

D4

D5 D6

D7

TxD

TI

(SCON.1)

SET INTERRUPT

(FOR EXAMPLE,

READY FOR MORE DATA)

Figure 103. 8-Bit Variable Baud Rate

Reception is initiated when a 1-to-0 transition is detected on

RxD. Assuming that a valid start bit is detected, character

reception continues. The eight data bits are clocked into the

serial port shift register.

Rev. A | Page 124 of 144

ADE7566/ADE7569/ADE7166/ADE7169

To transmit, the eight data bits must be written into the Serial

Port Buffer SFR (SBUF, 0x99). The ninth bit must be written to

TB8 in the Serial Communications Control Register Bit

Description SFR (SCON, 0x98). When transmission is initiated,

the eight data bits from SBUF are loaded into the transmit shift

register (LSB first). The ninth data bit, held in TB8, is loaded

into the ninth bit position of the transmit shift register. The

transmission starts at the next valid baud rate clock. The

transmit interrupt flag (TI) is set as soon as the transmission

completes, when the stop bit appears on TxD.

UART BAUD RATE GENERATION

Mode 0 Baud Rate Generation

The baud rate in Mode 0 is fixed.

f

⎛

⎜

⎞

⎟

CORE

Mode 0 Baud Rate =

12

⎝

⎠

Mode 2 Baud Rate Generation

The baud rate in Mode 2 depends on the value of the PCON.7

(SMOD) bit in the Program Control SFR (PCON, 0x87). If

SMOD = 0, the baud rate is 1/32 of the core clock. If SMOD = 1,

the baud rate is 1/16 of the core clock.

All of the following conditions must be met at the time the final

shift pulse is generated to receive a character:

2^SMOD

Mode 2 Baud Rate =

× f_CORE

•

If the extended UART is disabled (EXTEN = 0 in the CFG

SFR), RI must be 0 to receive a character. This ensures that

the data in SBUF is not overwritten if the last received

character has not been read.

If multiprocessor communication is enabled by setting

SM2, the received ninth bit must be set to receive a character.

This ensures that only frames with the ninth bit set, frames

that contain addresses, generate a receive interrupt.

32

Mode 1 and Mode 3 Baud Rate Generation

The baud rates in Mode 1 and Mode 3 are determined by the

overflow rate of the timer generating the baud rate, that is,

either Timer 1, Timer 2, or the dedicated baud rate generator,

UART timer, which has an integer and fractional divisor.

Timer 1 Generated Baud Rates

If any of these conditions are not met, the received frame is

irretrievably lost, and the receive interrupt flag (RI) is not set.

When Timer 1 is used as the baud rate generator, the baud rates

in Mode 1 and Mode 3 are determined by the Timer 1 overflow

rate. The value of SMOD is as follows:

Reception for Mode 2 is similar to that of Mode 1. The eight

data bytes are input at RxD (LSB first) and loaded onto the

receive shift register. If the received frame has met the previous

criteria, the following events occur:

Mode 1 or Mode 3 Baud Rate =

2^SMOD

32

× Timer 1 Overflow Rate

•

The eight bits in the receive shift register are latched into

the SBUF SFR.

The Timer 1 interrupt should be disabled in this application.

The timer itself can be configured for either timer or counter

operation, and in any of its three running modes. In the most

typical application, it is configured for timer operation in

autoreload mode (high nibble of TMOD = 0010 binary). In that

case, the baud rate is given by the following formula:

•

The ninth data bit is latched into RB8 in the SCON SFR.

The receiver interrupt flag (RI) is set.

Mode 3 (9-Bit UART with Variable Baud Rate)

Mode 3 is selected by setting both SM0 and SM1. In this mode,

the 8052 UART serial port operates in 9-bit mode with a variable

baud rate. The baud rate is set by a timer overflow rate. Timer 1

or Timer 2 can be used to generate baud rates, or both timers

can be used simultaneously where one generates the transmit

rate and the other generates the receive rate. There is also a

dedicated timer for baud rate generation, the UART timer,

which has a fractional divisor to precisely generate any baud

rate (see the UART Timer Generated Baud Rates section). The

operation of the 9-bit UART is the same as for Mode 2, but the

baud rate can be varied.

2^SMOD

f_CORE

Mode 1 or Mode 3 Baud Rate =

×

32

(256 −TH1)

Timer 2 Generated Baud Rates

Baud rates can also be generated by using Timer 2. Using Timer 2

is similar to using Timer 1 in that the timer must overflow 16 times

before a bit is transmitted or received. Because Timer 2 has a

16-bit autoreload mode, a wider range of baud rates is possible.

1

16

Mode 1 or Mode 3 Baud Rate =

× Timer 2 Overflow Rate

Therefore, when Timer 2 is used to generate baud rates, the

timer increments every two clock cycles rather than every core

machine cycle as before. It increments six times faster than

Timer 1, and, therefore, baud rates six times faster are possible.

Because Timer 2 has 16-bit autoreload capability, very low baud

rates are still possible.

In all four modes, transmission is initiated by any instruction

that uses SBUF as a destination register. Reception is initiated in

Mode 0 when RI = 0 and REN = 1. Reception is initiated in the

other modes by the incoming start bit if REN = 1.

Timer 2 is selected as the baud rate generator by setting TCLK

and/or RCLK in Timer/Counter 2 Control SFR (T2CON, 0xC8).

Rev. A | Page 125 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Timer 2 is selected as the baud rate generator by setting TCLK

and/or RCLK in Timer/Counter 2 Control SFR (T2CON, 0xC8).

The baud rates for transmit and receive can be simultaneously

different. Setting RCLK and/or TCLK puts Timer 2 into its baud

rate generator mode, as shown in Figure 105.

f_CORE

TIMER 1/TIMER 2

Tx CLOCK

FRACTIONAL

DIVIDER

÷(1 + SBAUDF/64)

TIMER 1/TIMER 2

Rx CLOCK

1

0

DIV + SBTH

÷2

In this case, the baud rate is given by the following formula:

Rx CLOCK

Mode 1 or Mode 3 Baud Rate =

1

÷32

UARTBAUDEN

Tx CLOCK

UART TIMER

Rx/Tx CLOCK

f_CORE

(

16×

65536 − RCAP2H : RCAP2L

[ ( )])

Figure 104. UART Timer, UART Baud Rate

UART Timer Generated Baud Rates

Two SFRs, Enhanced Serial Baud Rate Control SFR (SBAUDT,

0x9E) and UART Timer Fractional Divider SFR (SBAUDF,

0x9D), are used to control the UART timer. SBAUDT is the

baud rate control SFR; it sets up the integer divider (DIV) and

the extended divider (SBTH) for the UART timer.

The high integer dividers in a UART block mean that high speed

baud rates are not always possible. In addition, generating baud

rates requires the exclusive use of a timer, rendering it unusable

for other applications when the UART is required. To address

this problem, each ADE7566/ADE7569/ADE7166/ADE7169

has a dedicated baud rate timer (UART timer) specifically for

generating highly accurate baud rates. The UART timer can be

used instead of Timer 1 or Timer 2 for generating very accurate

high speed UART baud rates, including 115,200 bps. This timer

also allows a much wider range of baud rates to be obtained. In

fact, every desired bit rate from 12 bps to 393,216 bps can be

generated to within an error of 0.8%. The UART timer also

frees up the other three timers, allowing them to be used for

different applications. A block diagram of the UART timer is

shown in Figure 104.

The appropriate value to write to the DIV[2:0] and SBTH[1:0]

bits can be calculated using the following formula where f_COREis

defined in the POWCON SFR (see Table 25). Note that the DIV

value must be rounded down to the nearest integer.

⎛

⎜

⎝

⎞

⎟

⎠

f_CORE

16×Baud Rate

log

DIV + SBTH =

log

(

2

)

TIMER 1

OVERFLOW

2

0

1

SMOD

CONTROL

f_CORE

C/T2 = 0

TIMER 2

OVERFLOW

1

0

TL2

(8 BITS)

TH2

(8 BITS)

RCLK

16

C/T2 = 1

T2

Rx

CLOCK

TR2

TCLK

16

RELOAD

Tx

CLOCK

NOTE: AVAILABILITY OF ADDITIONAL

EXTERNAL INTERRUPT

RCAP2H

RCAP2L

TIMER 2

INTERRUPT

T2EX

EXF 2

CONTROL

EXEN2

TRANSITION

DETECTOR

Figure 105. Timer 2, UART Baud Rates

Rev. A | Page 126 of 144

ADE7566/ADE7569/ADE7166/ADE7169

START

STOP

D0

D1

D2

D3

D4

D5

D6

D7

Rx

SBAUDF is the fractional divider ratio required to achieve the

required baud rate. The appropriate value for SBAUDF can be

calculated with the following formula:

RI

⎛

⎜

⎝

⎞

⎟

⎠

f_CORE

FE

EXTEN = 1

SBAUDF = 64×

−1

DIV +SBTH

16×2

× Baud Rate

Figure 106. UART Timing in Mode 1

Note that SBAUDF should be rounded to the nearest integer.

After the values for DIV and SBAUDF are calculated, the actual

baud rate can be calculated with the following formula:

START

STOP

D0

D1

D2

D3

D4

D5

D6

D7

D8

Rx

RI

f_CORE

Actual Baud Rate =

SBAUDF

⎛

⎞

⎟

⎠

16×2^{DIV +SBTH}× 1+

FE

EXTEN = 1

⎜

64

⎝

Figure 107. UART Timing in Mode 2 and Mode 3

For example, to obtain a baud rate of 9600 bps while operating

at a core clock frequency of 4.096 MHz with the PLL CD bits

equal to 0,

The 8052 standard UART does not provide break error detection.

However, for an 8-bit UART, a break error can be detected when

the received character is 0, a null character, and when there is

no stop bit because the RB8 bit is low. Break error detection is

not possible for a 9-bit 8052 UART because the stop bit is not

recorded. The ADE7566/ADE7569/ADE7166/ADE7169

enhanced break error detection is available through the BE bit

in the SBAUDT SFR.

4,096,000

16×9600

⎛

⎜

⎝

⎞

⎟

⎠

log

DIV +SBTH =

= 4.74 = 4

log

2

( )

Note that the DIV result is rounded down.

4,096,000

⎛

⎜

⎝

⎞

⎠

The 8052 standard UART prevents overwrite errors by not

allowing a character to be received when the RI, receive interrupt

flag, is set. However, it does not indicate if a character has been

lost because the RI bit is set when the frame is received. The

enhanced UART overwrite error detection provides this infor-

mation. When the enhanced 8052 UART is enabled, a frame is

received regardless of the state of the RI flag. If RI = 1 when a

new byte is received, the byte in SCON is overwritten, and the

overwrite error flag is set. The overwrite error flag is cleared

when SBUF is read.

SBAUDF = 64×

−1 = 42.67 = 0x2B

⎟

16×2³×9600

Thus, the actual baud rate is 9570 bps, resulting in a 0.31% error.

UART ADDITIONAL FEATURES

Enhanced Error Checking

The extended UART provides frame error, break error, and

overwrite error detection. Framing errors occur when a stop bit

is not present at the end of the frame. A missing stop bit implies

that the data in the frame may not have been received properly.

Break error detection indicates whether the Rx line has been

low for longer than a 9-bit frame. It indicates that the data just

received, a 0 or null character, is not valid because the master has

disconnected. Overwrite error detection indicates when the

received data has not been read fast enough and, as a result, a

byte of data has been lost.

The extended UART is enabled by setting the EXTEN bit in the

Configuration SFR (CFG, 0xAF).

UART TxD Signal Modulation

There is an internal 38 kHz signal that can be OR’ed with the

UART transmit signal for use in remote control applications

(see the 38 kHz Modulation section).

The 8052 standard UART offers frame-error checking for an 8-bit

UART through the SM2 and RB8 bits. Setting the SM2 bit prevents

frames without a stop bit from being received. The stop bit is

latched into the RB8 bit in the Serial Communications Control

Register Bit Description SFR (SCON, 0x98). This bit can be

examined to determine if a valid frame was received. The 8052

does not, however, provide frame error checking for a 9-bit

UART. This enhanced error checking functionality is available

through the frame error bit, FE, in the Enhanced Serial Baud

Rate Control SFR (SBAUDT, 0x9E). The FE bit is set on framing

errors for both 8-bit and 9-bit UARTs.

One of the events that can wake the MCU from sleep mode is

activity on the Rx pin (see the 3.3 V Peripherals and Wake-Up

Events section).

Rev. A | Page 127 of 144

ADE7566/ADE7569/ADE7166/ADE7169

SERIAL PERIPHERAL INTERFACE (SPI)

firmware interface is via the SPI Configuration SFR 1

(SPIMOD1, 0xE8), the SPI Configuration SFR 2 (SPIMOD2,

0xE9), the SPI Interrupt Status SFR (SPISTAT, 0xEA), the

SPI/I²C Transmit Buffer SFR (SPI2CTx, 0x9A), and the SPI/I²C

Receive Buffer SFR (SPI2CRx, 0x9B).

Note that the SPI pins are shared with the I²C pins. Therefore, the

user can enable only one interface at a time. The SCPS bit in the

Configuration SFR (CFG, 0xAF) selects which peripheral is active.

The ADE7566/ADE7569/ADE7166/ADE7169 integrate a

complete hardware serial peripheral interface on-chip. The SPI

is full duplex so that eight bits of data are synchronously

transmitted and simultaneously received. This SPI

implementation is double buffered, allowing users to read the

last byte of received data while a new byte is shifted in. The next

byte to be transmitted can be loaded while the current byte is

shifted out.

The SPI port can be configured for master or slave operation.

The physical interface to the SPI is via the MISO (P0.5),

SS

MOSI (P0.4), SCLK (P0.6), and (P0.7) pins, while the

SPI REGISTERS

Table 137. SPI SFR List

SFR Address

Name

R/W

W

Length

Default

Description

0x9A

SPI2CTx

SPI2CRx

SPIMOD1

SPIMOD2

SPISTAT

8

SPI/I²C Transmit Buffer (see Table 138).

SPI/I²C Receive Buffer (see Table 139).

SPI Configuration SFR 1 (see Table 140).

SPI Configuration SFR 2 (see Table 141).

SPI/I²C Interrupt Status (see Table 142).

0x9B

R

0

0xE8

R/W

0x10

0xE9

0

0xEA

Table 138. SPI/I²C Transmit Buffer SFR (SPI2CTx, 0x9A)

Bit

Mnemonic Default Description

7 to 0 SPI2CTx

0

SPI or I²C Transmit Buffer. When SPI2CTx SFR is written, its content is transferred to the transmit FIFO

input. When a write is requested, the FIFO output is sent on the SPI or I²C bus.

Table 139. SPI/I²C Receive Buffer SFR (SPI2CRx, 0x9B)

Bit Mnemonic Default Description

7 to 0 SPI2CRx

0

SPI or I²C Receive Buffer. When SPI2CRx SFR is read, one byte from the receive FIFO output is transferred

to SPI2CRx SFR. A new data byte from the SPI or I²C bus is written to the FIFO input.

Rev. A | Page 128 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 140. SPI Configuration SFR 1 (SPIMOD1, 0xE8)

Bit

Address

Mnemonic

Default Description

7 to 6 0xEF to

0xEE

Reserved

0

Reserved.

5

4

0xED

0xEC

INTMOD

AUTO_SS

0

SPI Interrupt Mode.

INTMOD

Result

0

1

SPI interrupt is set when SPI Rx buffer is full.

SPI interrupt is set when SPI Tx buffer is empty.

1

Master Mode, SS Output Control (see Figure 108).

AUTO_SS Result

0

The SS pin is held low while this bit is cleared. This allows manual chip select

control using the SS pin.

1

Single Byte Read or Write. The SS pin goes low during a single byte

transmission and then returns high.

Continuous Transfer. The SS pin goes low during the duration of the multibyte

continuous transfer and then returns high.

3

2

0xEB

0xEA

SS_EN

0

Slave Mode, SS Input Enable.

When this bit is set to Logic 1, the SS pin is defined as the slave select input pin for the SPI

slave interface.

RxOFW

Receive Buffer Overflow Write Enable.

RxOFW

Result

0

If the SPI2CRx SFR has not been read when a new data byte is received,

the new byte is discarded.

1

If the SPI2CRx SFR has not been read when a new data byte is received,

the new byte overwrites the old data.

1 to 0 0xE9 to

0xE8

SPIR[1:0]

0

Master Mode, SPI SCLK Frequency.

SPIR[1:0] Result

00

01

10

11

f_CORE/8 = 512 kHz (if f_CORE= 4.096 MHz)

f_CORE/16 = 256 kHz (if f_CORE= 4.096 MHz)

f_CORE/32 = 128 kHz (if f_CORE= 4.096 MHz)

f_CORE/64 = 64 kHz (if f_CORE= 4.096 MHz)

Rev. A | Page 129 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 141. SPI Configuration SFR 2 (SPIMOD2, 0xE9)

Bit Mnemonic Default Description

7

SPICONT

0

Master Mode, SPI Continuous Transfer Mode Enable Bit.

SPICONT Result

0

The SPI interface stops after one byte is transferred and SS is deasserted. A new data transfer can

be initiated after a stalled period.

1

The SPI interface continues to transfer data until no valid data is available in the SPI2CTx SFR. SS

remains asserted until the SPI2CTx SFR and the transmit shift registers are empty.

6

5

SPIEN

0

SPI Interface Enable Bit.

SPIEN

Result

0

1

The SPI interface is disabled.

The SPI interface is enabled.

SPIODO

SPI Open-Drain Output Configuration Bit.

SPIODO

Result

0

1

Internal pull-up resistors are connected to the SPI outputs.

The SPI outputs are open drain and need external pull-up resistors. The pull-up voltage should

not exceed the specified operating voltage.

4

3

SPIMS_b

SPICPOL

0

SPI Master Mode Enable Bit.

SPIMS_b Result

0

1

The SPI interface is defined as a slave.

The SPI interface is defined as a master.

SPI Clock Polarity Configuration Bit (see Figure 110).

SPICPOL Result

0

The default state of SCLK is low, and the first SCLK edge is rising. Depending on the SPICPHA bit,

the SPI data output changes state on the falling or rising edge of SCLK while the SPI data input is

sampled on the rising or falling edge of SCLK.

1

The default state of SCLK is high, and the first SCLK edge is falling. Depending on the SPICPHA

bit, the SPI data output changes state on the rising or falling edge of SCLK while the SPI data

input is sampled on the falling or rising edge of SCLK.

2

SPICPHA

0

SPI Clock Phase Configuration Bit (see Figure 110).

SPICPHA Result

0

The SPI data output changes state when SS goes low at the second edge of SCLK and then every

two subsequent edges, whereas the SPI data input is sampled at the first SCLK edge and then

every two subsequent edges.

1

The SPI data output changes state at the first edge of SCLK and then every two subsequent

edges, whereas the SPI data input is sampled at the second SCLK edge and then every two

subsequent edges.

1

0

SPILSBF

TIMODE

0

1

Master Mode, LSB First Configuration Bit.

SPILSBF

Result

0

1

The MSB of the SPI outputs is transmitted first.

The LSB of the SPI outputs is transmitted first.

Transfer and Interrupt Mode of the SPI Interface.

TIMODE

Result

1

This bit must be left set for proper operation.

Rev. A | Page 130 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 142. SPI Interrupt Status SFR (SPISTAT, 0xEA)

Bit

Mnemonic Default Description

7

BUSY

0

SPI Peripheral Busy Flag.

BUSY

Result

0

1

The SPI peripheral is idle.

The SPI peripheral is busy transferring data in slave or master mode.

6

MMERR

0

SPI Multimaster Error Flag.

MMERR

Result

0

1

A multiple master error has not occurred.

If the SS_EN bit is set, enabling the slave select input and asserting the SS pin while the SPI

peripheral is transferring data as a master, this flag is raised to indicate the error.

Write a 0 to this bit to clear it.

5

4

SPIRxOF

SPIRxIRQ

0

SPI Receive Overflow Error Flag. Reading the SPI2CRx SFR clears this bit.

SPIRxOF

TIMODE Result

0

1

X

1

The SPI2CRx register contains valid data.

This bit is set if the SPI2CRx register is not read before the end of the next byte

transfer. If the RxOFW bit is set and this condition occurs, SPI2CRx is overwritten.

SPI Receive Mode Interrupt Flag. Reading the SPI2CRx SFR clears this bit.

SPIRxIRQ TIMODE Result

0

1

X

0

The SPI2CRx register does not contain new data.

This bit is set when the SPI2CRx register contains new data. If the SPI/I²C

interrupt is enabled, an interrupt is generated when this bit is set. If the SPI2CRx

register is not read before the end of the current byte transfer, the transfer stops

and the SS pin is deasserted.

1

The SPI2CRx register contains new data.

3

2

SPIRxBF

SPITxUF

0

Status Bit for SPI Rx Buffer. When set, the Rx FIFO is full. A read of the SPI2CRx clears this flag.

Status Bit for SPI Tx Buffer. When set, the Tx FIFO is underflowing and data can be written into SPI2CTx.

Write a 0 to this bit to clear it.

1

SPITxIRQ

0

SPI Transmit Mode Interrupt Flag. Writing new data to the SPI2CTx SFR clears this bit.

SPITxIRQ TIMODE Result

0

1

X

0

1

The SPI2CTx register is full.

The SPI2CTx register is empty.

This bit is set when the SPI2CTx register is empty. If the SPI/I²C interrupt is

enabled, an interrupt is generated when this bit is set. If new data is not written

into the SPI2CTx SFR before the end of the current byte transfer, the transfer

stops, and the SS pin is deasserted. Write a 0 to this bit to clear it.

0

SPITxBF

0

Status Bit for SPI Tx Buffer. When set, the SPI Tx buffer is full. Write a 0 to this bit to clear it.

SPI PINS

SCLK (Serial Clock I/O Pin)

The master serial clock (SCLK) is used to synchronize the data

being transmitted and received through the MOSI and MISO

data lines. The SCLK pin is configured as an output in master

mode and as an input in slave mode.

MISO (Master In, Slave Out Data I/O Pin)

The MISO pin is configured as an input line in master mode

and as an output line in slave mode. The MISO line on the

master (data in) should be connected to the MISO line in the

slave device (data out). The data is transferred as byte-wide

(8-bit) serial data, MSB first.

In master mode, the bit rate, polarity, and phase of the clock are

controlled by the SPI Configuration SFR 1 (SPIMOD1, 0xE8) and

SPI Configuration SFR 2 (SPIMOD2, 0xE9).

MOSI (Master Out, Slave In Pin)

The MOSI pin is configured as an output line in master mode

and as an input line in slave mode. The MOSI line on the master

(data out) should be connected to the MOSI line in the slave

device (data in).The data is transferred as byte-wide (8-bit)

serial data, MSB first.

In slave mode, the SPI Configuration SFR 2 (SPIMOD2, 0xE9)

must be configured with the phase and polarity of the expected

input clock.

In both master and slave modes, the data is transmitted on one

edge of the SCLK signal and sampled on the other. It is important,

therefore, that the SPICPHA and SPICPOL bits be configured

the same for the master and slave devices.

Rev. A | Page 131 of 144

ADE7566/ADE7569/ADE7166/ADE7169

(Slave Select Pin)

SS

In SPI slave mode, a transfer is initiated by the assertion of

low. The SPI port then transmits and receives 8-bit data until

SS

SCLK

the data is concluded by the deassertion of according to the

SS

AUTO_SS = 1

SPICONT = 1

SPICON bit setting. In slave mode, is always an input.

DIN

DIN1

DIN2

SS

In SPI master mode, the can be used to control data transfer

to a slave device. In the automatic slave select control mode, the

DOUT

DOUT1

DOUT2

SS

is asserted low to select the slave device and then raised to

deselect the slave device after the transfer is complete. Automatic

slave select control is enabled by setting the AUTO_SS bit in the

SPI Configuration SFR 1 (SPIMOD1, 0xE8).

SS

SCLK

SS

In a multimaster system, the can be configured as an input so

AUTO_SS = 1

SPICONT = 0

that the SPI peripheral can operate as a slave in some situations

and as a master in others. In this case, the slave selects for the

slaves controlled by this SPI peripheral should be generated

with general I/O pins.

DIN

DIN1

DIN2

DOUT

DOUT1

DOUT2

SPI MASTER OPERATING MODES

The double buffered receive and transmit registers can be used to

maximize the throughput of the SPI peripheral by continuously

streaming out data in master mode. The continuous transmit mode

is designed to use the full capacity of the SPI. In this mode, the

master transmits and receives data until the SPI/I²C Transmit

Buffer SFR (SPI2CTx, 0x9A) is empty at the start of a byte

transfer. Continuous mode is enabled by setting the SPICONT bit

in the SPI Configuration SFR 2 (SPIMOD2, 0xE9). The SPI

peripheral also offers a single byte read/write function.

SS

SCLK

AUTO_SS = 0

SPICONT = 0

(MANUAL SS CONTROL)

DIN

DIN1

DIN2

DOUT

DOUT1

DOUT2

In master mode, the type of transfer is handled automatically,

depending on the configuration of the SPICONT bit in the SPI

Configuration SFR 2 (SPIMOD2, 0xE9). Table 143 shows the

sequence of events that should be performed for each master

Figure 108. Automatic Chip Select and Continuous Mode Output

Note that reading the content of the SPI/I²C Receive Buffer SFR

(SPI2CRx, 0x9B) should be done using a 2-cycle instruction set

such as MOV A or SPI2CRX. Using a 3-cycle instruction such

as MOV 0x3D or SPI2CRX does not transfer the right

information into the target register.

SS

operating mode. Based on the configuration, some of these

events take place automatically.

Figure 108 shows the SPI output for certain automatic chip select

and continuous mode selections. Note that if the continuous mode

is not used, a short delay is inserted between transfers.

Table 143. Procedures for Using SPI as a Master

SPIMOD2[7] =

SPICONT Bit

Mode

Description of Operation

Single Byte Write

0

Step 1. Write to SPI2CTx SFR.

Step 2. SS is asserted low and a write routine is initiated.

Step 3. SPITxIRQ interrupt flag is set when the SPI2CTx register is empty.

Step 4. SS is deasserted high.

Step 5. Write to SPI2CTx SFR to clear the SPITxIRQ interrupt flag.

Step 1. Write to SPI2CTx SFR.

Continuous

1

Step 2. SS is asserted low and write routine is initiated.

Step 3. Wait for the SPITxIRQ interrupt flag to write to SPI2CTx SFR.

Transfer continues until the SPI2CTx register and transmit shift registers are empty.

Step 4. SPITxIRQ interrupt flag is set when the SPI2CTx register is empty.

Step 5. SS is deasserted high.

Step 6. Write to SPI2CTx SFR to clear the SPITxIRQ interrupt flag.

Rev. A | Page 132 of 144

ADE7566/ADE7569/ADE7166/ADE7169

(SPI2CRx, 0x9B) register is not read before new data is ready to

be loaded into the SPI/I²C Receive Buffer SFR (SPI2CRx, 0x9B),

an overflow condition has occurred. This overflow condition,

indicated by the SPIRxOF flag, forces the new data to be discarded

or overwritten if the RxOFW bit is set.

SPI INTERRUPT AND STATUS FLAGS

The SPI interface has several status flags that indicate the status

of the double-buffered receive and transmit registers. Figure 109

shows when the status and interrupt flags are raised. The transmit

interrupt occurs when the transmit shift register is loaded with

the data in the SPI/I²C Transmit Buffer SFR (SPI2CTx, 0x9A)

register. If the SPI master is in transmit operating mode, and the

SPI/I²C Transmit Buffer SFR (SPI2CTx, 0x9A) register has not

been written with new data by the beginning of the next byte

transfer, the transmit operation stops.

SPITx

SPIRx

SPITxIRQ = 1

SPIRxIRQ = 1

TRANSMIT SHIFT REGISTER

RECEIVE SHIFT REGISTER

SPITx (EMPTY)

SPIRx (FULL)

STOPS TRANSFER IF TIMODE = 1

SPIRxOF = 1

TRANSMIT SHIFT REGISTER RECEIVE SHIFT REGISTER

When a new byte of data is received in the SPI/I²C Receive

Buffer SFR (SPI2CRx, 0x9B) register, the SPI receive interrupt

flag is raised. If the data in the SPI/I²C Receive Buffer SFR

Figure 109. SPI Receive and Transmit Interrupt and Status Flags

SCLK

(SPICPOL = 1)

SCLK

(SPICPOL=0)

SS_b

MISO

MOSI

?

MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 LSB

SPICPHA = 1

SPIRx1 AND

SPITx1 FLAGS

SPIRx0 AND

SPITx0 FLAGS

MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 LSB

?

MISO

MOSI

SPICPHA = 0

SPIRx1 AND

SPITx1 FLAGS

SPIRx0 AND

SPITx0 FLAGS

Figure 110. SPI Timing Configurations

Rev. A | Page 133 of 144

ADE7566/ADE7569/ADE7166/ADE7169

I²C COMPATIBLE INTERFACE

The bit rate is defined in the I2CMOD SFR as follows:

The ADE7566/ADE7569/ADE7166/ADE7169 support a fully

licensed I²C interface. The I²C interface is implemented as a full

hardware master.

f_CORE

f_SCLK

=

16×2^I2CR[1:0]

SDATA is the data I/O pin, and SCLK is the serial clock. These

two pins are shared with the MOSI and SCLK pins of the on-chip

SPI interface. Therefore, the user can enable only one interface

or the other on these pins at any given time. The SCPS bit in the

Configuration SFR (CFG, 0xAF) selects which peripheral is active.

SLAVE ADDRESSES

The I²C Slave Address SFR (I2CADR, 0xE9) contains the slave

device ID. The LSB of this register contains a read/write request.

A write to this SFR starts the I²C communication.

I²C REGISTERS

The I²C peripheral interface consists of five SFRs:

The two pins used for data transfer, SDATA and SCLK, are

configured in a wire-AND format that allows arbitration in a

multimaster system.

The transfer sequence of an I²C system consists of a master device

initiating a transfer by generating a start condition while the bus

is idle. The master transmits the address of the slave device and

the direction of the data transfer in the initial address transfer. If

the slave acknowledges, the data transfer is initiated. This continues

until the master issues a stop condition and the bus becomes idle.

•

I2CMOD

SPI2CSTAT

I2CADR

SPI2CTx

SPI2CRx

Because the SPI and I²C serial interfaces share the same pins,

they also share the same SFRs, such as the SPI2CTx and SPIXCRx

SFRs. In addition, the I2CMOD, I2CADR, SPI2CSTAT, and

SPI2CTx SFRs are shared with the SPIMOD1, SPIMOD2, and

SPISTAT SFRs, respectively.

SERIAL CLOCK GENERATION

The I²C master in the system generates the serial clock for a

transfer. The master channel can be configured to operate in

fast mode (256 kHz) or standard mode (32 kHz).

Table 144. I²C SFR List

SFR Address

Name

R/W

W

R

R/W

Length

Default

Description

0x9A

0x9B

0xE8

0xE9

SPI2CTx

SPI2CRx

I2CMOD

I2CADR

SPI2CSTAT

8

SPI/I²C Transmit Buffer (see Table 138).

SPI/I²C Receive Buffer (see Table 139).

I²C Mode (see Table 145).

0

I²C Slave Address (see Table 146).

I²C Interrupt Status Register (see Table 147).

0xEA

Table 145. I²C Mode SFR (I2CMOD, 0xE8)

Bit

Address

Mnemonic Default Description

7

0xEF

I2CEN

0

I²C Enable Bit. When this bit is set to Logic 1, the I²C interface is enabled. A write to the

I2CADR SFR starts a communication.

6 to 5

0xEE to 0xED I2CR[1:0]

0

I²C SCLK Frequency.

I2CR[1:0] Result

00

01

10

11

f_CORE/16 = 256 kHz if f_CORE= 4.096 MHz

f_CORE/32 = 128 kHz if f_CORE= 4.096 MHz

f_CORE/64 = 64 Hz if f_CORE= 4.096 MHz

f_CORE/128= 32 kHz if f_CORE= 4.096 MHz

4 to 0

0xEC to 0xE8 I2CRCT[4:0]

0

Configures the length of the I²C received FIFO buffer. The I²C peripheral stops when

I2CRCT, Bit[4:0] + 1 byte have been read or if an error occurs.

Table 146. I²C Slave Address SFR (I2CADR, 0xE9)

Bit

7 to 1

0

Mnemonic

I2CSLVADR

I2CR_W

Default

Description

0

Address of the I²C Slave Being Addressed. Writing to this register starts the I²C transmission (read or write).

Command Bit for Read or Write. When this bit is set to Logic 1, a read command is transmitted on the

I²C bus. Data from the slave in the SPI2CRx SFR is expected after a command byte. When this bit is set

to Logic 0, a write command is transmitted on the I²C bus. Data to slave is expected in the SPI2CTx SFR.

Rev. A | Page 134 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 147. I²C Interrupt Status Register SFR (SPI2CSTAT, 0xEA)

Bit

Mnemonic

Default Description

7

I2CBUSY

0

This bit is set to Logic 1 when the I²C interface is used. When set, the Tx FIFO is emptied.

6

I2CNOACK

I²C No Acknowledgement Transmit Interrupt. This bit is set to Logic 1 when the slave device

does not send an acknowledgement. The I²C communication is stopped after this event.

Write a 0 to this bit to clear it.

5

I2CRxIRQ

0

I²C Receive Interrupt. This bit is set to Logic 1 when the receive FIFO is not empty.

Write a 0 to this bit to clear it.

I²C Transmit Interrupt. This bit is set to Logic 1 when the transmit FIFO is empty.

Write a 0 to this bit to clear it.

4

I2CTxIRQ

3 to 2

I2CFIFOSTAT[1:0]

Status Bits for 3- or 4-Bytes Deep I²C FIFO. The FIFO monitored in these two bits is the one currently

used in I²C communication (receive or transmit) because only one FIFO is active at a time.

I2CFIFOSTAT[1:0]

Result

00

01

10

11

FIFO empty

Reserved

FIFO half full

FIFO full

1

0

I2CACC_ERR

0

Set when trying to write and read at the same time. Write a 0 to this bit to clear it.

Set when write was attempted when I²C transmit FIFO was full. Write a 0 to this bit to clear it.

I2CTxWR_ERR

READ AND WRITE OPERATIONS

1

9

1

9

1

9

SCLK

A6 A5 A4 A3 A2 A1 A0 R/W

D7 D6 D5 D4 D3 D2 D1 D0

SDATA

START BY

D7 D6 D5 D4 D3 D2 D1 D0

ACK BY

SLAVE

ACK BY

MASTER

NACK BY

MASTER

STOP BY

MASTER

FRAME 1

FRAME 2

DATA BYTE 1 FROM MASTER

FRAME N + 1

SERIAL BUS ADDRESS BYTE

DATA BYTE N FROM SLAVE

Figure 111. I²C Read Operation

1

9

1

9

SCLK

A6 A5 A4 A3 A2 A1 A0 R/W

D7 D6 D5 D4 D3 D2 D1 D0

SDATA

START BY

ACK BY

SLAVE

ACK BY

SLAVE

STOP BY

MASTER

FRAME 1

FRAME 2

DATA BYTE 1 FROM MASTER

SERIAL BUS ADDRESS BYTE

Figure 112. I²C Write Operation

Figure 111 and Figure 112 depict I²C read and write operations,

respectively. Note that the LSB of the I2CADR register is used to

select whether a read or write operation is performed on the

slave device. During the read operation, the master acknowledges

are generated automatically by the I²C peripheral. The master

generated NACK (no acknowledge) before the end of a read

operation is also automatically generated after the I2CRCT

Bits[4:0] have been read from the slave. If the I2CADR register

is updated during a transmission, instead of generating a stop at

the end of the read or write operation, the master generates a

start condition and continues with the next communication.

Reading the SPI/I²C Receive Buffer SFR (SPI2CRx, 0x9B)

Reading the SPI2CRx SFR should be done with a 2-cycle

instruction, such as

Mov a, spi2crx or Mov R0, spi2crx.

A 3-cycle instruction such as

Mov 3dh, spi2crx

does not transfer the right data into RAM Address 0x3d.

Rev. A | Page 135 of 144

ADE7566/ADE7569/ADE7166/ADE7169

be generated after each byte is received or when the Rx FIFO

is full. If the peripheral is reading from a slave address, the

communication stops once the number of received bytes equals

the number set in the I2CRCT, Bits[4:0]. An error, such as not

receiving an acknowledge, also causes the communication to

terminate.

I²C RECEIVE AND TRANSMIT FIFOS

The I²C peripheral has a 4-byte receive FIFO and a 4-byte

transmit FIFO. The buffers reduce the overhead associated with

using the I²C peripheral. Figure 113 shows the operation of the

I²C receive and transmit FIFOs.

The Tx FIFO can be loaded with four bytes to be transmitted to

the slave at the beginning of a write operation. When the

transmit FIFO is empty, the I²C transmit interrupt flag is set,

and the PC vectors to the I²C interrupt vector if this interrupt is

enabled. If a new byte is not loaded into the Tx FIFO before it is

needed in the transmit shift register, the communication stops.

An error, such as not receiving an acknowledge, also causes the

communication to terminate. In case of an error during a write

operation, the Tx FIFO is flushed.

CODE TO FILL Tx FIFO:

CODE TO READ Rx FIFO:

2

MOV I CTx, TxDATA1

MOV A, I CRx; RESULT: A = RxDATA1

MOV I CTx, TxDATA2

MOV A, I CRx; RESULT: A = RxDATA2

MOV I CTx, TxDATA3

MOV A, I CRx; RESULT: A = RxDATA3

MOV I CTx, TxDATA4

MOV A, I CRx; RESULT: A = RxDATA4

2

I CRx

I CTx

TxDATA4

TxDATA3

RxDATA1

RxDATA2

4 BYTE FIFO

TxDATA2

TxDATA1

RxDATA3

RxDATA4

The Rx FIFO allows four bytes to be read in from the slave

before the MCU has to read the data. A receive interrupt can

TRANSMIT SHIFT REGISTER

RECEIVE SHIFT REGISTER

Figure 113. I²C FIFO Operation

Rev. A | Page 136 of 144

ADE7566/ADE7569/ADE7166/ADE7169

I/O PORTS

PARALLEL I/O

Weak Internal Pull-Ups Enabled

A pin with weak internal pull-up enabled is used as an input by

writing a 1 to the pin. The pin is pulled high by the internal pull-

ups, and the pin is read using the circuitry shown in Figure 114.

If the pin is driven low externally, it sources current because of

the internal pull-ups.

The ADE7566/ADE7569/ADE7166/ADE7169 use three

input/output ports to exchange data with external devices. In

addition to performing general-purpose I/O, some are capable of

driving an LCD or performing alternate functions for the

peripherals available on-chip. In general, when a peripheral is

enabled, the pins associated with it cannot be used as a general-

purpose I/O. The I/O port can be configured through the SFRs

in Table 148.

A pin with internal pull-up enabled is used as an output by

writing a 1 or a 0 to the pin to control the level of the output. If

a 0 is written to the pin, it drives a logic low output voltage

(V_OL) and is capable of sinking 1.6 mA.

Table 148. I/O Port SFRs

Open Drain (Weak Internal Pull-Ups Disabled)

SFR

Address Bit Addressable Description

When the weak internal pull-up on a pin is disabled, the pin

becomes open drain. Use this open-drain pin as a high impedance

input by writing a 1 to the pin. The pin is read using the circuitry

shown in Figure 114. The open-drain option is preferable for

inputs because it draws less current than the internal pull-ups

that were enabled.

P0

P1

P2

EPCFG

0x80

0x90

0xA0

0x9F

Yes

No

Port 0 Register.

Port 1 Register.

Port 2 Register.

Extended Port

Configuration.

Port 0 Weak

Pull-Up Enable.

Port 1 Weak

Pull-Up Enable.

PINMAP0 0xB2

PINMAP1 0xB3

PINMAP2 0xB4

No

38 kHz Modulation

Every ADE7566/ADE7569/ADE7166/ADE7169 provides a

38 kHz modulation signal. The 38 kHz modulation is

accomplished by internally XOR’ing the level written to the I/O

pin with a 38 kHz square wave. Then, when a 0 is written to the

I/O pin, it is modulated as shown in Figure 115.

Port 2 Weak

Pull-Up Enable.

The three bidirectional I/O ports have internal pull-ups that can

be enabled or disabled individually for each pin. The internal

pull-ups are enabled by default. Disabling an internal pull-up

causes a pin to become open drain. Weak internal pull-ups are

configured through the PINMAPx SFRs.

LEVEL WRITTEN

TO MOD38

38kHz MODULATION

SIGNAL

Figure 114 shows a typical bit latch and I/O buffer for an I/O

pin. The bit latch (one bit in each port’s SFR) is represented as a

Type D flip-flop, which clocks in a value from the internal bus

in response to a write-to-latch signal from the CPU. The

Q output of the flip-flop is placed on the internal bus in response

to a read latch signal from the CPU. The level of the port pin

itself is placed on the internal bus in response to a read pin

signal from the CPU. Some instructions that read a port activate

the read latch signal, and others activate the read pin signal. See

the Read-Modify-Write Instructions section for details.

OUTPUT AT

MOD38 PIN

Figure 115. 38 kHz Modulation

Uses for this 38 kHz modulation include IR modulation of

a UART transmit signal or a low power signal to drive an

LED. The modulation can be enabled or disabled with the

MOD38EN bit in the CFG SFR. The 38 kHz modulation is

available on eight pins, selected by the MOD38[7:0] bits in the

Extended Port Configuration SFR (EPCFG, 0x9F).

DV

DD

INTERNAL

PULL-UP

ALTERNATE

OUTPUT

FUNCTION

READ

LATCH

CLOSED: PINMAPx.x = 0

OPEN: PINMAPx.x = 1

Px.x

INTERNAL

BUS

D

Q

WRITE

TO LATCH

CL

LATCH

READ

ALTERNATE

INPUT

FUNCTION

Figure 114. Port 0 Bit Latch and I/O Buffer

Rev. A | Page 137 of 144

ADE7566/ADE7569/ADE7166/ADE7169

I/O REGISTERS

Table 149. Extended Port Configuration SFR (EPCFG, 0x9F)

Bit

Mnemonic

Default

Description

7

6

5

4

3

2

MOD38_FP21

MOD38_FP22

MOD38_FP23

MOD38_TxD

MOD38_CF1

MOD38_SSb

MOD38_MISO

MOD38_CF2

0

Enable 38 kHz modulation on P1.6/FP21 pin.

Enable 38 kHz modulation on P1.5/FP22 pin.

Enable 38 kHz modulation on P1.4/T2/FP23 pin.

Enable 38 kHz modulation on P1.1/TxD pin.

Enable 38 kHz modulation on P0.2/CF1/RTCCAL pin.

Enable 38 kHz modulation on P0.7/SS/T1pin.

Enable 38 kHz modulation on P0.5/MISO pin.

Enable 38 kHz modulation on P0.3/CF2 pin.

1

0

Table 150. Port 0 Weak Pull-Up Enable SFR (PINMAP0, 0xB2)

Bit

Mnemonic

PINMAP0.7

PINMAP0.6

PINMAP0.5

PINMAP0.4

PINMAP0.3

PINMAP0.2

PINMAP0.1

PINMAP0.0

Default

Description

7

6

5

4

3

2

1

0

The weak pull-up on P0.7 is disabled when this bit is set.

The weak pull-up on P0.6 is disabled when this bit is set.

The weak pull-up on P0.5 is disabled when this bit is set.

The weak pull-up on P0.4 is disabled when this bit is set.

The weak pull-up on P0.3 is disabled when this bit is set.

The weak pull-up on P0.2 is disabled when this bit is set.

The weak pull-up on P0.1 is disabled when this bit is set.

The weak pull-up on P0.0 is disabled when this bit is set.

Table 151. Port 1 Weak Pull-Up Enable SFR (PINMAP1, 0xB3)

Bit

Mnemonic

PINMAP1.7

PINMAP1.6

PINMAP1.5

PINMAP1.4

PINMAP1.3

PINMAP1.2

PINMAP1.1

PINMAP1.0

Default

Description

7

6

5

4

3

2

1

0

The weak pull-up on P1.7 is disabled when this bit is set.

The weak pull-up on P1.6 is disabled when this bit is set.

The weak pull-up on P1.5 is disabled when this bit is set.

The weak pull-up on P1.4 is disabled when this bit is set.

The weak pull-up on P1.3 is disabled when this bit is set.

The weak pull-up on P1.2 is disabled when this bit is set.

The weak pull-up on P1.1 is disabled when this bit is set.

The weak pull-up on P1.0 is disabled when this bit is set.

Table 152. Port 2 Weak Pull-Up Enable SFR (PINMAP2, 0xB4)

Bit

Mnemonic

Default

Description

7 to 6

Reserved

PINMAP2.5

Reserved

PINMAP2.3

PINMAP2.2

PINMAP2.1

PINMAP2.0

0

Reserved. Should be left cleared.

The weak pull-up on RESET is disabled when this bit is set.

Reserved. Should be left cleared.

5

4

3

2

1

0

Reserved. Should be left cleared.

The weak pull-up on P2.2 is disabled when this bit is set.

The weak pull-up on P2.1 is disabled when this bit is set.

The weak pull-up on P2.0 is disabled when this bit is set.

Rev. A | Page 138 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 153. Port 0 SFR (P0, 0x80)

Bit

Address

0x87

0x86

0x85

0x84

0x83

0x82

0x81

0x80

Mnemonic

Default

Description¹

7

T1

T0

1

This bit reflects the state of P0.7/SS/T1 pin. It can be written or read.

This bit reflects the state of P0.6/SCLK/T0 pin. It can be written or read.

This bit reflects the state of P0.5/MISO pin. It can be written or read.

This bit reflects the state of P0.4/MOSI/SDATA pin. It can be written or read.

This bit reflects the state of P0.3/CF2 pin. It can be written or read.

This bit reflects the state of P0.2/CF1 pin. It can be written or read.

This bit reflects the state of P0.1/FP19 pin. It can be written or read.

This bit reflects the state of BCTRL/INT1/P0.0 pin. It can be written or read.

6

5

4

3

2

CF2

CF1

1

0

INT1

¹When an alternate function is chosen for a pin of this port, the bit controlling this pin should always be set.

Table 154. Port 1 SFR (P1, 0x90)

Bit

Address

0x97

0x96

0x95

0x94

0x93

0x92

0x91

0x90

Mnemonic

Default

Description¹

7

6

5

1

This bit reflects the state of P1.7/FP20 pin. It can be written or read.

This bit reflects the state of P1.6/FP2 pin. It can be written or read.

This bit reflects the state of P1.5/FP22 pin. It can be written or read.

This bit reflects the state of P1.4/T2/FP23 pin. It can be written or read.

This bit reflects the state of P1.3/T2EX/FP24 pin. It can be written or read.

This bit reflects the state of P1.2/FP25 pin. It can be written or read.

This bit reflects the state of P1.1/TxD pin. It can be written or read.

This bit reflects the state of P1.0/RxD pin. It can be written or read.

4

T2

3

T2EX

2

1

0

TxD

RxD

¹When an alternate function is chosen for a pin of this port, the bit controlling this pin should always be set.

Table 155. Port 2 SFR (P2, 0xA0)

Bit

Address

0x97 to 0x94

0x93

Mnemonic

Default

Description¹

7 to 4

0x1F

These bits are unused and should remain set.

3

2

1

0

P2.3

P2.2

P2.1

P2.0

1

This bit reflects the state of P2.3/SDEN pin. It can be written only.

This bit reflects the state of P2.2/FP16 pin. It can be written or read.

This bit reflects the state of P2.1/FP17 pin. It can be written or read.

This bit reflects the state of P2.0/FP18 pin. It can be written or read.

0x92

0x91

0x90

¹When an alternate function is chosen for a pin of this port, the bit controlling this pin should always be set.

Rev. A | Page 139 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Table 156. Port 0 Alternate Functions

Pin No. Alternate Function

Alternate Function Enable

P0.0

BCTRL External Battery Control Input

Set INT1PROG[2:0] = X01 in the Interrupt Pins Configuration SFR (INTPR,

0xFF).

INT1 External Interrupt

Set EX1 in the Interrupt Enable SFR (IE, 0xA8).

INT1 Wake-up from PSM2 Operating Mode

Set INT1PROG[2:0] = 11X in the Interrupt Pins Configuration SFR (INTPR,

0xFF).

P0.1

P0.2

FP19 LCD Segment Pin

Set FP19EN in the LCD Segment Enable 2 SFR (LCDSEGE2, 0xED).

CF1 ADE Calibration Frequency Output

Clear the DISCF1 bit in the ADE energy measurement internal MODE1 register

(0x0B).

P0.3

P0.4

CF2 ADE Calibration Frequency Output

MOSI SPI Data Line

Clear the DISCF2 bit in the ADE energy measurement internal MODE1 register

(0x0B).

Set the SCPS bit in the Configuration SFR (CFG, 0xAF) and set the SPIEN bit in

the SPI Configuration SFR 2 (SPIMOD2, 0xE9).

SDATA I²C Data Line

Clear the SCPS bit in the Configuration SFR (CFG, 0xAF) and set the I2CEN bit

in the I²C Mode SFR (I2CMOD, 0xE8).

P0.5

P0.6

MISO SPI Data Line

Set the SCPS bit in the Configuration SFR (CFG, 0xAF) and set the SPIEN bit in

the SPI Configuration SFR 2 (SPIMOD2, 0xE9).

SCLK Serial Clock for I²C or SPI

T0 Timer0 Input

Set the I2CEN bit in the I²C Mode SFR (I2CMOD, 0xE8) or the SPIEN bit in the

SPI Configuration SFR 2 (SPIMOD2, 0xE9) to enable the I²C or SPI interface.

Set the C/T0 bit in the Timer/Counter 0 and Timer/Counter 1 Mode SFR (TMOD,

0x89) to enable T0 as an external event counter.

P0.7

SS SPI Slave Select Input for SPI in Slave Mode

Set the SS_EN bit in the SPI Configuration SFR 1 (SPIMOD1, 0xE8).

SS SPI Slave Select Output for SPI in Master Mode Set the SPIMS_b bit in the SPI Configuration SFR 2 (SPIMOD2, 0xE9).

T1 Timer 1 Input

Set the C/T1 bit in the Timer/Counter 0 and Timer/Counter 1 Mode SFR (TMOD,

0x89) to enable T1 as an external event counter.

Table 157. Port 1 Alternate Functions

Pin No. Alternate Function

Alternate Function Enable

P1.0

RxD Receiver Data Input for UART

Set the REN bit in the Serial Communications Control Register Bit Description

SFR (SCON, 0x98).

Rx Edge Wake-up from PSM2 Operating Mode Set RXPROG[1:0] = 11 in the Peripheral Configuration SFR (PERIPH, 0xF4).

P1.1

P1.2

P1.3

TxD Transmitter Data Output for UART

FP25 LCD Segment Pin

FP24 LCD Segment Pin

T2EX Timer 2 Control Input

FP23 LCD Segment Pin

T2 Timer 2 Input

This pin becomes TxD as soon as data is written into SBUF.

Set FP25EN in the LCD Segment Enable SFR (LCDSEGE, 0x97).

Set FP24EN in the LCD Segment Enable SFR (LCDSEGE, 0x97).

Set EXEN2 in the Timer/Counter 2 Control SFR (T2CON, 0xC8).

Set FP23EN in the LCD Segment Enable SFR (LCDSEGE, 0x97).

P1.4

Set the C/T2 bit in the Timer/Counter 2 Control SFR (T2CON, 0xC8) to enable T2

as an external event counter.

P1.5

P1.6

P1.7

FP22 LCD Segment Pin

FP21 LCD Segment Pin

FP20 LCD Segment Pin

Set FP22EN in the LCD Segment Enable SFR (LCDSEGE, 0x97).

Set FP21EN in the LCD Segment Enable SFR (LCDSEGE, 0x97).

Set FP20EN in the LCD Segment Enable SFR (LCDSEGE, 0x97).

Table 158. Port 2 Alternate Functions

Pin No. Alternate Function

Alternate Function Enable

P2.0

P2.1

P2.2

P2.3

FP18 LCD Segment Pin

FP17 LCD Segment Pin

FP16 LCD Segment Pin

Set FP18EN in the LCD Segment Enable 2 SFR (LCDSEGE2, 0xED).

Set FP17EN in the LCD Segment Enable 2 SFR (LCDSEGE2, 0xED).

Set FP16EN in the LCD Segment Enable 2 SFR (LCDSEGE2, 0xED).

SDEN serial download pin sampled on reset. P2.3 is an output only.

Enabled by default.

Rev. A | Page 140 of 144

ADE7566/ADE7569/ADE7166/ADE7169

Port 1 pins also have various secondary functions as described

in Table 157. The alternate functions of Port 1 pins can be

activated only if the corresponding bit latch in the Port 1 SFR

contains a 1. Otherwise, the port pin remains at 0.

PORT 0

Port 0 is controlled directly through the bit-addressable Port 0

SFR (P0, 0x80). The weak internal pull-ups for Port 0 are

configured through the Port 0 Weak Pull-Up Enable SFR

(PINMAP0, 0xB2); they are enabled by default. The weak

internal pull-up is disabled by writing a 1 to PINMAP0.x.

PORT 2

Port 2 is a 4-bit bidirectional port controlled directly through

the bit-addressable Port 2 SFR (P2, 0xA0). Note that P2.3 can be

used as an output only. Consequently, any read operation, such

as a CPL P2.3, cannot be executed on this I/O. The weak

internal pull-ups for Port 2 are configured through the Port 2

Weak Pull-Up Enable SFR (PINMAP2, 0xB4); they are enabled

by default. The weak internal pull-up is disabled by writing a 1

to PINMAP2.x.

Port 0 pins also have various secondary functions as described

in Table 156. The alternate functions of Port 0 pins can be

activated only if the corresponding bit latch in the Port 0 SFR

contains a 1. Otherwise, the port pin remains at 0.

PORT 1

Port 1 is an 8-bit bidirectional port controlled directly through

the bit-addressable Port 1 SFR (P1, 0x90). The weak internal

pull-ups for Port 1 are configured through the Port 1 Weak

Pull-Up Enable SFR (PINMAP1, 0xB3); they are enabled by

default. The weak internal pull-up is disabled by writing a 1 to

PINMAP1.x.

Port 2 pins also have various secondary functions as described

in Table 158. The alternate functions of Port 2 pins can be

activated only if the corresponding bit latch in the Port 2 SFR

contains a 1. Otherwise, the port pin remains at 0.

Rev. A | Page 141 of 144

ADE7566/ADE7569/ADE7166/ADE7169

DETERMINING THE VERSION OF THE ADE7566/ADE7569

Each ADE7566/ADE7569 holds in its internal flash registers a

value that defines its version. This value helps to determine if users

have the latest version of the part. The ADE7566/ADE756 version

corresponding to this datasheet is ADE7566/ADE7569V3.4.

2. Put the part in serial download mode by first holding

SDEN

to logic low then resetting the part

SDEN

3. Hold the

pin.

RESET

4. Press and release the

pin.

5. The following string should appear on the HyperTerminal

screen: ADE7566V3.4 or ADE7569V3.4

To access this value, the following procedure can be followed:

1. Launch HyperTerminal with a 9600 baud rate.

Rev. A | Page 142 of 144

ADE7566/ADE7569/ADE7166/ADE7169

OUTLINE DIMENSIONS

12.20

12.00 SQ

11.80

0.75

0.60

0.45

1.60

MAX

64

49

48

1

PIN 1

10.20

10.00 SQ

9.80

TOP VIEW

(PINS DOWN)

1.45

1.40

1.35

0.20

0.09

7°

3.5°

0°

0.08

COPLANARITY

16

33

0.15

0.05

SEATING

17

32

PLANE

VIEW A

0.27

0.22

0.17

0.50

BSC

LEAD PITCH

VIEW A

ROTATED 90° CCW

COMPLIANT TO JEDEC STANDARDS MS-026-BCD

Figure 116. 64-Lead Low Profile Quad Flat Package [LQFP]

(ST-64-2)

Dimensions shown in millimeters

0.30

0.25

0.18

9.00

BSC SQ

0.60 MAX

PIN 1

INDICATOR

64

49

48

1

PIN 1

INDICATOR

*

4.85

4.70 SQ

4.55

8.75

BSC SQ

TOP

VIEW

EXPOSED PAD

(BOTTOM VIEW)

0.50

33

32

16

17

0.40

0.30

7.50

REF

0.80 MAX

0.65 TYP

1.00

0.85

0.80

12° MAX

0.05 MAX

0.02 NOM

SEATING

PLANE

0.50 BSC

0.20 REF

*

COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4

EXCEPT FOR EXPOSED PAD DIMENSION

Figure 117. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

9 mm x 9 mm Body, Very Thin Quad

(CP-64-1)

Dimensions shown in millimeters

Rev. A | Page 143 of 144

ADE7566/ADE7569/ADE7166/ADE7169

ORDERING GUIDE

Anti-

Tamper

di/dt Sensor

Interface

Temperature

VAR Flash (kB) Range

Package

Option

Model¹

Package Description

64-Lead LFCSP_VQ

64-Lead LFCSP_VQ, Reel

64-Lead LFCSP_VQ

64-Lead LFCSP_VQ, Reel

64-Lead LQFP

64-Lead LQFP, Reel

64-Lead LQFP

64-Lead LQFP, Reel

64-Lead LFCSP_VQ

64-Lead LFCSP_VQ, Reel

64-Lead LQFP

64-Lead LQFP, Reel

64-Lead LFCSP_VQ

64-Lead LFCSP_VQ, Reel

64-Lead LFCSP_VQ

64-Lead LFCSP_VQ, Reel

64-Lead LQFP

64-Lead LQFP, Reel

64-Lead LQFP

64-Lead LQFP, Reel

64-Lead LFCSP_VQ

64-Lead LFCSP_VQ, Reel

64-Lead LQFP

ADE7566ACPZF8²

ADE7566ACPZF8-RL²

ADE7566ACPZF16²

ADE7566ACPZF16-RL²

ADE7566ASTZF8²

ADE7566ASTZF8-RL²

ADE7566ASTZF16²

ADE7566ASTZF16-RL²

ADE7569ACPZF16²

ADE7569ACPZF16-RL²

ADE7569ASTZF16²

ADE7569ASTZF16-RL²

ADE7166ACPZF8²

ADE7166ACPZF8-RL²

ADE7166ACPZF16²

ADE7166ACPZF16-RL²

ADE7166ASTZF8²

ADE7166ASTZF8-RL²

ADE7166ASTZF16²

ADE7166ASTZF16-RL²

ADE7169ACPZF16²

ADE7169ACPZF16-RL²

ADE7169ASTZF16²

ADE7169ASTZF16-RL²

ADE8052-PRG1

No

Yes

No

Yes

No

Yes

No

Yes

No

Yes

8

16

8

−40°C to +85°C

CP-64-1

ST-64-2

CP-64-1

ST-64-2

CP-64-1

ST-64-2

CP-64-1

ST-64-2

8

16

8

16

8

16

64-Lead LQFP, Reel

ADE Programmer

ADE Downloader

ADE Emulator

ADE8052Z-PRG1

ADE8052-DWDL1

ADE8052Z- DWDL 1

ADE8052-EMUL1

ADE8052Z-EMUL1

EVAL- ADE7169F16EBZ²

EVAL- ADE7569F16EBZ²

ADE Emulator

ADE7169 Evaluation Board

ADE7569 Evaluation Board

¹All models have W + VA + rms, 5 V LCD, and RTC.

²Z = RoHS Compliant Part.

Purchase of licensed I²C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I²C Patent

Rights to use these components in an I²C system, provided that the system conforms to the I²C Standard Specification as defined by Philips.

registered trademarks are the property of their respective owners.

D06353-0-12/07(A)

Rev. A | Page 144 of 144


型号：	EVAL-ADE7169F16EBZ
厂家：	ADI
描述：	Single-Phase Energy Measurement IC with 8052 MCU, RTC, and LCD Driver 单相电能计量IC，具有8052 MCU ，RTC和LCD驱动器驱动器 CD
文件：	总144页 (文件大小：2177K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

EVAL-ADE7169F16EBZ [ADI]

相关型号：

EVAL-ADE7566F16EB

EVAL-ADE7569F16EB

EVAL-ADE7569F16EBZ

EVAL-ADE7752AEB

EVAL-ADE7752EB

EVAL-ADE7753ZEB

EVAL-ADE7754EB

EVAL-ADE7755EB

EVAL-ADE7755EBZ

EVAL-ADE7755EBZ1

EVAL-ADE7755ZEB

EVAL-ADE7756EB