EVAL-ADF4150EB1Z [ADI]
Fractional-N/Integer-N PLL Synthesizer; 小数N /整数N分频PLL合成器型号: | EVAL-ADF4150EB1Z |
厂家: | ADI |
描述: | Fractional-N/Integer-N PLL Synthesizer |
文件: | 总28页 (文件大小:486K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Fractional-N/Integer-N PLL Synthesizer
ADF4150
FEATURES
GENERAL DESCRIPTION
Fractional-N synthesizer and integer-N synthesizer
Programmable divide-by-1/-2/-4/-8/-16 output
5.0 GHz RF bandwidth
3.0 V to 3.6 V power supply
1.8 V logic compatibility
Separate charge pump supply (VP) allows extended tuning
voltage in 3 V systems
Programmable dual-modulus prescaler of 4/5 or 8/9
Programmable output power level
RF output mute function
The ADF4150 allows implementation of fractional-N or
integer-N phase-locked loop (PLL) frequency synthesizers
if used with an external voltage-controlled oscillator (VCO),
loop filter, and external reference frequency.
The ADF4150 is for use with external VCO parts and is
software compatible with the ADF4350. The VCO frequency
can be divided by 1/2/4/8/16 to allow the user to generate RF
output frequencies as low as 31.25 MHz. For applications that
require isolation the RF output stage can be muted. The mute
function is both pin and software controllable.
3-wire serial interface
Control of all the on-chip registers is through a simple 3-wire
interface. The device operates with a power supply ranging
from 3.0 V to 3.6 V and can be powered down when not in use.
Analog and digital lock detect
Switched bandwidth fast-lock mode
Cycle slip reduction
The ADF4150 is available in a 4 mm × 4 mm package.
APPLICATIONS
Wireless infrastructure (W-CDMA, TD-SCDMA, WiMax, GSM,
PCS, DCS, DECT)
Test equipment
Wireless LANs, CATV equipment
Clock generation
FUNCTIONAL BLOCK DIAGRAM
SDV
AV
DV
V
R
SET
DD
DD
DD
P
MULTIPLEXER
MUXOUT
10-BIT R
COUNTER
÷2
DIVIDER
×2
REF
IN
DOUBLER
LOCK
DETECT
SW
LD
FL SWITCH
O
CLK
DATA
LE
DATA REGISTER
FUNCTION
LATCH
CHARGE
PUMP
CP
OUT
PHASE
COMPARATOR
RF
RF
+
OUT
OUTPUT
STAGE
DIVIDE-BY-1/
-2/-4/-8/-16
INTEGER
REG
FRACTION
REG
MODULUS
REG
–
OUT
PDB
RF
THIRD-ORDER
FRACTIONAL
INTERPOLATOR
RF
+
–
RF
INPUT
IN
MULTIPLEXER
RF
IN
N COUNTER
ADF4150
CE
A
CP
SD
GND
GND
GND
Figure 1.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2011 Analog Devices, Inc. All rights reserved.
ADF4150
TABLE OF CONTENTS
Features .............................................................................................. 1
Register 1 ..................................................................................... 18
Register 2 ..................................................................................... 18
Register 3 ..................................................................................... 20
Register 4 ..................................................................................... 20
Register 5 ..................................................................................... 20
Initialization Sequence .............................................................. 20
RF Synthesizer—A Worked Example ...................................... 21
Modulus....................................................................................... 21
Reference Doubler and Reference Divider ............................. 21
12-Bit Programmable Modulus................................................ 21
Cycle Slip Reduction for Faster Lock Times........................... 22
Spurious Optimization and Fast lock ...................................... 22
Fast Lock Timer and Register Sequences................................ 22
Fast Lock—An Example ............................................................ 23
Fast Lock—Loop Filter Topology............................................. 23
Spur Mechanisms ....................................................................... 23
Spur Consistency and Fractional Spur Optimization ........... 24
Phase Resync............................................................................... 24
Applications Information .............................................................. 25
Direct Conversion Modulator .................................................. 25
Interfacing ................................................................................... 26
PCB Design Guidelines for Chip Scale Package .................... 26
Output Matching........................................................................ 27
Outline Dimensions....................................................................... 28
Ordering Guide .......................................................................... 28
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Characteristics ................................................................ 5
Absolute Maximum Ratings............................................................ 6
Transistor Count........................................................................... 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 9
Circuit Description......................................................................... 11
Reference Input Section............................................................. 11
RF N Divider............................................................................... 11
INT, FRAC, MOD, and R Counter Relationship.................... 11
INT N Mode................................................................................ 11
R Counter .................................................................................... 11
Phase Frequency Detector (PFD) and Charge Pump............ 11
MUXOUT and Lock Detect...................................................... 12
Input Shift Registers................................................................... 12
Program Modes .......................................................................... 12
Output Stage................................................................................ 12
Register Maps.................................................................................. 13
Register 0 ..................................................................................... 18
REVISION HISTORY
7/11—Revision 0: Initial Version
Rev. 0 | Page 2 of 28
ADF4150
SPECIFICATIONS
AVDD = DVDD = SDVDD = 3.3 V 10%; VP = AVDD to 5.5 V; AGND = DGND = 0 V; TA = TMIN to TMAX, unless otherwise noted. The
operating temperature range is −40°C to +85°C.
Table 1.
B Version
Parameter
Min
Typ
Max
Unit
Conditions/Comments
REFIN CHARACTERISTICS
Input Frequency
Input Sensitivity
Input Capacitance
Input Current
10
0.7
250
AVDD
5.0
MHz
V p-p
pF
For f < 10 MHz ensure slew rate > 21 V/µs
Biased at AVDD/21
60
µA
RF INPUT CHARACTERISTICS
RF Input Frequency (RFIN), RF Output
Buffer Disabled
RF Input Frequency (RFIN), RF Output
Buffer Disabled
RF Input Frequency (RFIN) RF Output
Buffer Enabled
RF Input Frequency (RFIN) RF Output
Buffer and Dividers Enabled
Prescaler Output Frequency
MAXIMUM PFD FREQUENCY
Fractional-N (Low Spur Mode)
Fractional-N Mode (Low Noise Mode)
Integer-N Mode
0.5
0.5
0.5
0.5
4.0
5.0
3.5
3.0
750
GHz
GHz
GHz
GHz
MHz
−10 dBm ≤ RF input power ≤ +5 dBm
−5 dBm ≤ RF input power ≤ +5 dBm
−10 dBm ≤ RF input power ≤ +5 dBm
−10 dBm ≤ RF input power ≤ +5 dBm
26
32
32
MHz
MHz
MHz
CHARGE PUMP
ICP Sink/Source
RSET = 5.1 kΩ
High Value
Low Value
RSET Range
ICP Leakage
Sink and Source Current Matching
ICP vs. VCP
ICP vs. Temperature
LOGIC INPUTS
4.65
0.29
mA
mA
kΩ
nA
%
2.7
10
1
2
1
2
VCP = VP/2
0.5 V ≤ VCP ≤ VP − 0.5 V
0.5 V ≤ VCP ≤ VP − 0.5 V
VCP = VP/2
%
%
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINH/IINL
Input Capacitance, CIN
LOGIC OUTPUTS
1.5
V
V
µA
pF
0.6
1
3.0
Output High Voltage, VOH
Output High Current, IOH
Output Low Voltage, VO
POWER SUPPLIES
AVDD
DVDD − 0.4
V
µA
V
CMOS output chosen
IOL = 500 µA
500
0.4
3.0
3.6
V
DVDD, SDVDD
AVDD
VP
AVDD
5.5
60
V
2
DIDD + AIDD
Output Dividers
IRFOUT
50
6 to 24
24
1
mA
mA
mA
µA
Each output divide by two consumes 6 mA
RF output stage is programmable
2
32
Low Power Sleep Mode
Rev. 0 | Page 3 of 28
ADF4150
B Version
Typ
Parameter
Min
Max
Unit
Conditions/Comments
RF OUTPUT CHARACTERISTICS
Minimum Output Frequency Using RF 31.25
Output Dividers
Maximum RFIN Frequency Using RF
Output Dividers
MHz
MHz
500 MHz VCO input and divide-by-16 selected
4400
Harmonic Content (Second)
Harmonic Content (Third)
Harmonic Content (Second)
Harmonic Content (Third)
Output Power 3
−19
−13
−20
−10
−4
dBc
dBc
dBc
dBc
dBm
dBm
dB
Fundamental VCO output
Fundamental VCO output
Divided VCO output
Divided VCO output
Maximum setting
+5
1
Minimum setting
Output Power Variation
Level of Signal With RF Mute Enabled
NOISE CHARACTERISTICS
−40
dBm
−223
dBc/Hz
Normalized Phase Noise Floor
PLL loop BW = 500 kHz (ABP = 3 ns)
4
(PNSYNTH
Normalized 1/f Noise (PN1_f
)
5
dBc/Hz
dBc/Hz
)
−123
−222
10 kHz offset. Normalized to 1 GHz. (ABP = 3 ns)
PLL loop BW = 500 kHz (ABP = 6 ns); low noise
mode selected
10 kHz offset; normalized to 1 GHz; (ABP = 6 ns);
low noise mode selected
Normalized Phase Noise Floor
4
(PNSYNTH
)
5
dBc/Hz
Normalized 1/f Noise (PN1_f
)
−119
Spurious Signals Due to PFD
Frequency6
−90
−75
dBc
dBc
VCO output
RF output buffers
1 AC coupling ensures AVDD/2 bias.
2 TA = 25°C; AVDD = DVDD = 3.3 V; prescaler = 8/9; fREFIN = 100 MHz; fPFD = 26 MHz; fRF = 1.7422 GHz.
3 Using a tuned load.
4 The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log N (where N is the N divider
value) and 10 log FPFD. PNSYNTH = PNTOT − 10logFPFD − 20logN.
5 The PLL phase noise is composed of 1/f (flicker) noise plus the normalized PLL noise floor. The formula for calculating the 1/f noise contribution at an RF frequency (FRF)
and at a frequency offset (f) is given by PN = P1_f + 10log(10 kHz/f) + 20log(FRF/1 GHz). Both the normalized phase noise floor and flicker noise are modeled in ADIsimPLL.
6 Spurious measured on EVAL-ADF4150EB1Z, using a Rohde & Schwarz FSUP signal source analyzer.
Rev. 0 | Page 4 of 28
ADF4150
TIMING CHARACTERISTICS
AVDD = DVDD = SDVDD = 3.3 V 10%; VP = AVDD to 5.5 V; AGND = DGND = 0 V; TA = TMIN to TMAX, unless otherwise noted. Operating
temperature range is −40°C to +85°C.
Table 2.
Parameter
Limit (B Version)
Unit
Test Conditions/Comments
LE setup time
DATA to CLK setup time
DATA to CLK hold time
CLK high duration
CLK low duration
t1
t2
t3
t4
t5
t6
t7
20
10
10
25
25
10
20
ns min
ns min
ns min
ns min
ns min
ns min
ns min
CLK to LE setup time
LE pulse width
t4
t5
CLK
t2
t3
DB2
(CONTROL BIT C3)
DB1
DB0 (LSB)
(CONTROL BIT C1)
DB31 (MSB)
DB30
DATA
LE
(CONTROL BIT C2)
t7
t1
t6
LE
Figure 2. Timing Diagram
Rev. 0 | Page 5 of 28
ADF4150
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 3.
Parameter
AVDD to GND1
Rating
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to +5.8 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +85°C
−65°C to +125°C
150°C
AVDD to DVDD
VP to AVDD
Digital I/O Voltage to GND1
Analog I/O Voltage to GND1
REFIN to GND1
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
LFCSP θJA Thermal Impedance
(Paddle-Soldered)
TRANSISTOR COUNT
23380 (CMOS) and 809 (bipolar)
ESD CAUTION
27.3°C/W
Reflow Soldering
Peak Temperature
Time at Peak Temperature
260°C
40 sec
1 GND = AGND = DGND = 0 V.
Rev. 0 | Page 6 of 28
ADF4150
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
CLK
DATA
LE
CE
SW
1
2
3
4
5
6
18 DV
17 PDB
16 AV
DD
RF
2
ADF4150
TOP VIEW
(Not to Scale)
DD
15 RF
14 RF
+
−
OUT
OUT
V
13 A
P
GND
NOTES
1. THE LFCSP HAS AN EXPOSED PADDLE
THAT MUST BE CONNECTED TO GND.
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
CLK
Serial Clock Input. Data is clocked into the 32-bit shift register on the CLK rising edge. This input is a high
impedance CMOS input.
2
3
4
DATA
LE
Serial Data Input. The serial data is loaded MSB first with the three LSBs as the control bits. This input is a high
impedance CMOS input.
Load Enable, CMOS Input. When LE goes high, the data stored in the shift register is loaded into the register
that is selected by the three LSBs.
Chip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state
mode. Taking the pin high powers up the device depending on the status of the power-down bits.
CE
5
6
SW
VP
Fastlock Switch. Make a connection to this pin from the loop filter when using the fastlock mode.
Charge Pump Power Supply. This pin should be greater than or equal to AVDD. In systems where AVDD is 3 V, it
can be set to 5.5 V and used to drive a VCO with a tuning range of up to 5.5 V.
7
CPOUT
Charge Pump Output. When enabled, this provides ICP to the external loop filter. The output of the loop filter
is connected to VTUNE to drive the external VCO.
8
9
CPGND
Charge Pump Ground. This is the ground return pin for CPOUT
Analog Power Supply. This pin ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane
.
AVDD
1
are to be placed as close as possible to this pin. AVDD must have the same value as DVDD
Input to the RF Input. This small signal input is ac-coupled to the external VCO.
Complementary Input to the RF Input. This point must be decoupled to the ground plane with a small bypass
capacitor, typically 100 pF.
.
10
11
RFIN+
RFIN−
12, 13
14
AGND
RFOUT
Analog Ground. This is a ground return pin for AVDD1 and AVDD2.
Complementary RF Output. The output level is programmable. The VCO fundamental output or a divided
down version is available.
RF Output. The output level is programmable. The VCO fundamental output or a divided down version is
available.
Analog Power Supply. This pin ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane
−
+
15
16
RFOUT
AVDD
2
are to be placed as close as possible to this pin. AVDD2 must have the same value as DVDD
.
17
18
PDBRF
DVDD
RF Power-Down. A logic low on this pin mutes the RF outputs. This function is also software controllable.
Digital Power Supply. This pin should be the same voltage as AVDD. Place decoupling capacitors to the ground
plane as close as possible to this pin.
19
20
21
REFIN
Reference Input. This is a CMOS input with a nominal threshold of VDD/2 and a dc equivalent input resistance
of 100 kΩ. This input can be driven from a TTL or CMOS crystal oscillator, or it can be ac-coupled.
Lock Detect Output Pin. This pin outputs a logic high to indicate PLL lock; a logic low output indicates loss of
PLL lock.
Multiplexer Output. This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference
frequency to be accessed externally.
LD
MUXOUT
Rev. 0 | Page 7 of 28
ADF4150
Pin No.
Mnemonic
Description
22
SDVDD
Power Supply Pin for the Digital Sigma-Delta (Σ-Δ) Modulator. This pin should be the same voltage as AVDD
Decoupling capacitors to the ground plane are to be placed as close as possible to this pin.
.
23
24
SDGND
RSET
Digital Σ-Δ Modulator Ground. Ground return path for the Σ-Δ modulator.
Connecting a resistor between this pin and GND sets the charge pump output current. The nominal voltage
bias at the RSET pin is 0.48 V. The relationship between ICP and RSET is
23.9
ICP
=
RSET
where:
RSET = 5.1 kΩ.
ICP = 5 mA.
25
EP
The exposed pad must be connected to GND.
Rev. 0 | Page 8 of 28
ADF4150
TYPICAL PERFORMANCE CHARACTERISTICS
–60
0
–5
–80
–100
–120
–140
–160
–180
–10
–15
–20
–25
–30
–35
–40
+25°C
+85°C
–40°C
–45
–50
1k
10k
100k
1M
10M
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5 5.0
FREQUENCY (GHz)
FREQUENCY (Hz)
Figure 4. RF Input Sensitivity; RF Output Enabled; Output Divide-by-1
Selected
Figure 7. Integer-N Phase Noise and Spur Performance; Low Noise Mode;
VCOOUT = 1750 MHz, REFIN = 100 MHz, PFD = 25 MHz, Loop Filter
Bandwidth= 50 kHz
10
0
–60
–80
–100
–120
–140
–160
–180
–10
–20
–30
–40
+25°C
+85°C
–40°C
–50
0
1
2
3
4
5
6
1M
10M
100M
1G
10G
FREQUENCY (MHz)
FREQUENCY (Hz)
Figure 5. RF Input Sensitivity; RF Output Disabled
Figure 8. Fractional-N Phase Noise and Spur Performance; Low Noise Mode;
VCOOUT = 1750 MHz, REFIN = 100 MHz, PFD = 25 MHz, Loop Filter
Bandwidth= 15 kHz, Channel Spacing = 200 kHz. FRAC = 26, MOD = 125
–60
0
–5
–80
–100
–120
–140
–160
–180
–10
–15
–20
–25
–30
–35
+25°C
+85°C
–40°C
–40
1k
10k
100k
1M
10M
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
FREQUENCY (Hz)
FREQUENCY (GHz)
Figure 6. RF Sensitivity; RF Output Enabled (RF Dividers-by-2/-4/-8/-16
Enabled)
Figure 9. Fractional-N Phase Noise and Spur Performance; Low Spur Mode;
VCOOUT = 1750 MHz, REFIN = 100 MHz, PFD = 25 MHz, Loop Filter
Bandwidth= 50 kHz, Channel Spacing = 200 kHz. FRAC = 26, MOD = 125
Rev. 0 | Page 9 of 28
ADF4150
–60
–60
–80
–80
–100
–120
–140
–160
–100
–120
–140
–160
–180
–180
1k
10k
100k
1M
10M
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 10. RF Output Phase Noise RF Dividers Used; Integer-N; Low Noise
Mode; VCOOUT = 1750 MHz, REFIN = 100 MHz, PFD = 25 MHz, Loop Filter
Bandwidth = 50 kHz
Figure 12. RF Buffer Output Fractional-N Phase Noise and Spur Performance;
Low Noise Mode; VCOOUT = 1750 MHz, REFIN = 100 MHz, PFD = 25 MHz,
Loop Filter Bandwidth = 15 kHz, Channel Spacing = 200 kHz; FRAC = 1,
MOD = 5; Output Divider = 2
–60
–80
–60
–80
–100
–120
–140
–160
–180
–100
–120
–140
–160
–180
1k
10k
100k
1M
10M
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 13. RF Buffer Output Fractional-N Phase Noise and Spur Performance;
Low Noise Mode; VCOOUT = 1750 MHz, REFIN = 100 MHz, PFD = 25 MHz,
Loop Filter Bandwidth = 15 kHz, Channel Spacing = 200 kHz. FRAC = 1,
MOD = 5. Output divider = 4
Figure 11. RF Buffer Output Fractional-N Phase Noise and Spur Performance;
Low Noise Mode; VCOOUT = 1750 MHz, REFIN = 100 MHz, PFD = 25 MHz,
Loop Filter Bandwidth = 15 kHz, Channel Spacing = 200 kHz; FRAC = 1,
MOD = 5; Output Divider = 1
Rev. 0 | Page 10 of 28
ADF4150
CIRCUIT DESCRIPTION
RF N DIVIDER
N COUNTER
N = INT + FRAC/MOD
REFERENCE INPUT SECTION
FROM
VCO OUTPUT/
OUTPUT DIVIDERS
The reference input stage is shown in Figure 14. SW1 and SW2
are normally closed switches. SW3 is normally open. When
power-down is initiated, SW3 is closed and SW1 and SW2 are
opened. This ensures that there is no loading of the REFIN pin
on power-down.
TO PFD
THIRD ORDER
FRACTIONAL
INTERPOLATOR
POWER-DOWN
CONTROL
INT
REG
MOD
REG
FRAC
VALUE
100kΩ
SW2
NC
TO R COUNTER
REF
IN
Figure 15. RF INT Divider
NC
SW1
BUFFER
SW3
INT N MODE
NO
If the FRAC = 0 and DB8 in Register 2 (LDF) is set to 1, the
synthesizer operates in integer-N mode. The DB8 in Register 2
(LDF) should be set to 1 to get integer-N digital lock detect.
Additionally, lower phase noise is possible if the anti-backlash
pulse width is reduced to 3 ns. This mode is not valid for
fractional-N applications.
Figure 14. Reference Input Stage
RF N DIVIDER
The RF N divider allows a division ratio in the PLL feedback
path. Division ratio is determined by INT, FRAC, and MOD
values, which build up this divider.
R COUNTER
INT, FRAC, MOD, AND R COUNTER RELATIONSHIP
The 10–bit R counter allows the input reference frequency
(REFIN) to be divided down to produce the reference clock
to the PFD. Division ratios from 1 to 1023 are allowed.
The INT, FRAC, and MOD values, in conjunction with the R
counter, make it possible to generate output frequencies that
are spaced by fractions of the PFD frequency. See the RF
Synthesizer—A Worked Example section for more informa-
tion. The RF VCO frequency (RFOUT) equation is
PHASE FREQUENCY DETECTOR (PFD) AND
CHARGE PUMP
The phase frequency detector (PFD) takes inputs from the R
counter and N counter and produces an output proportional to
the phase and frequency difference between them. Figure 16 is
a simplified schematic of the phase frequency detector. The
PFD includes a programmable delay element that sets the width
of the antibacklash pulse, which can be either 6 ns (default, for
fractional-N applications) or 3 ns (for integer-N mode). This
pulse ensures there is no dead zone in the PFD transfer function,
and gives a consistent reference spur level.
RFOUT = fPFD × (INT + (FRAC/MOD))
where:
RFOUT is the output frequency of external voltage controlled
(1)
oscillator (VCO).
INT is the preset divide ratio of the binary 16–bit counter
(23 to 65535 for 4/5 prescaler, 75 to 65535 for 8/9 prescaler).
MOD is the preset fractional modulus (2 to 4095).
FRAC is the numerator of the fractional division (0 to MOD − 1).
fPFD = REFIN × [(1 + D)/(R × (1 + T))]
(2)
UP
HIGH
D1
Q1
where:
U1
CLR1
REFIN is the reference input frequency.
D is the REFIN doubler bit.
+IN
T is the REFIN divide-by-2 bit (0 or 1).
R is the preset divide ratio of the binary 10-bit programmable
reference counter (1 to 1023).
CHARGE
PUMP
CP
U3
DELAY
DOWN
CLR2
D2 Q2
HIGH
U2
–IN
Figure 16. PFD Simplified Schematic
Rev. 0 | Page 11 of 28
ADF4150
MUXOUT AND LOCK DETECT
PROGRAM MODES
The output multiplexer on the ADF4150 allows the user
to access various internal points on the chip. The state of
MUXOUT is controlled by M3, M2, and M1 (for details, see
Figure 22). Figure 17 shows the MUXOUT section in block
diagram form.
Figure 20 through Figure 25 show how the program modes are
to be set up in the ADF4150.
A number of settings in the ADF4150 are double buffered.
These include the modulus value, phase value, R counter
value, reference doubler, reference divide-by-2, and current
setting. This means that two events have to occur before the
part uses a new value of any of the double-buffered settings.
First, the new value is latched into the device by writing to the
appropriate register. Second, a new write must be performed
on Register R0. For example, any time the modulus value is
updated, Register R0 must be written to, thus ensuring the
modulus value is loaded correctly. Divider select in Register 4
(R4) is also double buffered, but only if DB13 of Register 2 (R2)
is high.
R COUNTER INPUT
DV
DD
THREE-STATE-OUTPUT
DV
DD
DGND
R COUNTER OUTPUT
N COUNTER OUTPUT
ANALOG LOCK DETECT
MUX
CONTROL
MUXOUT
DIGITAL LOCK DETECT
RESERVED
OUTPUT STAGE
The RFOUT+ and RFOUT− pins of the ADF4150 are connected
to the collectors of an NPN differential pair driven by buffered
outputs of the VCO, as shown in Figure 18. To allow the user
to optimize the power dissipation vs. the output power require-
ments, the tail current of the differential pair is programmable
by Bit D2 and Bit D1 in Register 4 (R4). Four current levels may
be set. These levels give output power levels of −4 dBm, −1 dBm,
+2 dBm, and +5 dBm, respectively, using a 50 Ω resistor to
AVDD and ac coupling into a 50 Ω load. Alternatively, both
outputs can be combined in a 1 + 1:1 transformer or a 180°
microstrip coupler (see the Output Matching section). If the
outputs are used individually, the optimum output stage
D
GND
Figure 17. MUXOUT Schematic
INPUT SHIFT REGISTERS
The ADF4150 digital section includes a 10-bit RF R counter,
a 16-bit RF N counter, a 12-bit FRAC counter, and a 12-bit
modulus counter. Data is clocked into the 32-bit shift register
on each rising edge of CLK. The data is clocked in MSB first.
Data is transferred from the shift register to one of six latches
on the rising edge of LE. The destination latch is determined
by the state of the three control bits (C3, C2, and C1) in the
shift register. These are the 3 LSBs, DB2, DB1, and DB0, as
shown in Figure 2. The truth table for these bits is shown in
Table 5. Figure 19 shows a summary of how the latches are
programmed.
consists of a shunt inductor to AVDD
.
Another feature of the ADF4150 is that the supply current
to the RF output stage can be shut down until the part
achieves lock as measured by the digital lock detect circuitry.
This is enabled by the mute-till-lock detect (MTLD) bit in
Register 4 (R4).
Table 5. C3, C2, and C1 Truth Table
Control Bits
RF
+
RF
–
OUT
OUT
C3
0
0
0
0
C2
0
0
1
1
C1
0
1
0
1
Register
Register 0 (R0)
Register 1 (R1)
Register 2 (R2)
Register 3 (R3)
Register 4 (R4)
Register 5 (R5)
BUFFER/
DIVIDE-BY-1/
-2/-4/-8/-16
VCO
1
1
0
0
0
1
Figure 18. Output Stage
Rev. 0 | Page 12 of 28
ADF4150
REGISTER MAPS
REGISTER 0
CONTROL
BITS
16-BIT INTEGER VALUE (INT)
12-BIT FRACTIONAL VALUE (FRAC)
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
N16 N15 N14 N13 N12 N11 N10
N9
N8
N7
N6
N5
N4
N3
N2
N1
F12 F11
F10
F9
F8
F7
F6
F5
F4
F3
F2
F1 C3(0) C2(0) C1(0)
REGISTER 1
CONTROL
BITS
1
DBR1
RESERVED
12-BIT PHASE VALUE (PHASE)
12-BIT MODULUS VALUE (MOD)
DBR
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
PR1 P12 P11 P10
P9
P8
P7
P6
P5
P4
P3
P2
P1
M12 M11 M10
M9
M8
M7 M6 M5 M4 M3 M2 M1 C3(0) C2(0) C1(1)
REGISTER 2
LOW
CHARGE
PUMP
CURRENT
SETTING
NOISE AND
LOW SPUR
MODES
DBR1
CONTROL
BITS
DBR1
MUXOUT
10-BIT R COUNTER
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
L2
L1
M3
M2
M1 RD2 RD1 R10
R9
R8
R7
R6
R5
R4
R3
R2
R1
D1
CP4 CP3 CP2 CP1 U6
U5
U4
U3
U2
U1 C3(0) C2(1) C1(0)
REGISTER 3
CLK
DIV
MODE
RESERVED
RESERVED
CONTROL
BITS
12-BIT CLOCK DIVIDER VALUE
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
0
0
0
0
0
F3
F2
0
0
F1
0
C2
C1
D12 D11 D10
D9
D8
D7
D6
D5
D4
D3
D2
D1 C3(0) C2(1) C1(1)
REGISTER 4
2
DBB
DIVIDER
SELECT
OUTPUT
POWER
RESERVED
CONTROL
BITS
RESERVED
RESERVED
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
0
0
0
0
D13 D12 D11 D10 BS8 BS7 BS6 BS5 BS4 BS3 BS2 BS1
D9
D8
D7
D6
D5
D4
D3
D2
D1 C3(1) C2(0) C1(0)
REGISTER 5
LD PIN
MODE
CONTROL
BITS
RESERVED
RESERVED
RESERVED
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
D15 D14 C3(1) C2(0) C1(1)
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
2
DBR = DOUBLE BUFFERED REGISTER—BUFFERED BY THE WRITE TO REGISTER 0.
DBB = DOUBLE BUFFERED BITS—BUFFERED BY THE WRITE TO REGISTER 0, IF AND ONLY IF DB13 OF REGISTER 2 IS HIGH.
Figure 19. Register Summary
Rev. 0 | Page 13 of 28
ADF4150
CONTROL
BITS
16-BIT INTEGER VALUE (INT)
12-BIT FRACTIONAL VALUE (FRAC)
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
N16
N15
N14
N13
N12
N11
N10
N9
N8
N7
N6
N5
N4
N3
N2
N1
F12
F11
F10
F9
F8
F7
F6
F5
F4
F3
F2
F1 C3(0) C2(0) C1(0)
F12
0
0
0
0
.
F11
0
0
0
0
.
.......... F2
F1
FRACTIONAL VALUE (FRAC)
N16
N15
...
...
...
...
...
...
...
...
...
...
...
...
N5
N4
N3
N2
N1
INTEGER VALUE (INT)
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
.........
0
0
1
1
.
0
1
0
1
.
0
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
0
1
0
.
NOT ALLOWED
1
NOT ALLOWED
2
NOT ALLOWED
3
...
.
0
0
0
.
0
0
0
.
1
1
1
.
0
0
1
.
1
1
0
.
1
1
0
.
0
1
0
.
NOT ALLOWED
23
.
.
.
.
.
24
.
.
.
.
.
...
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092
4093
4094
4095
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
0
1
65533
65534
65535
INTmin = 75 with prescaler = 8/9
Figure 20. Register 0 (R0)
CONTROL
BITS
RESERVED
12-BIT PHASE VALUE (PHASE)
DBR
12-BIT MODULUS VALUE (MOD)
DBR
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
PR1
P12
P11
P10
P9
P8
P7
P6
P5
P4
P3
P2
P1
M12 M11 M10
M9
M8
M7 M6
M5
M4
M3
M2
M1 C3(0) C2(0) C1(1)
P1
0
PRESCALER
P12
P11
.......... P2
P1
0
1
0
1
.
PHASE VALUE (PHASE)
M12
M11
..........
M2
M1
INTERPOLATOR MODULUS (MOD)
4/5
8/9
0
0
0
0
.
0
0
0
0
.
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
0
0
1
1
.
0
0
0
.
0
0
.
..........
..........
..........
..........
..........
..........
..........
..........
..........
1
1
.
0
1
.
2
1
3
1 (RECOMMENDED)
.
2
.
.
.
.
.
3
.
.
.
.
.
.
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092
4093
4094
4095
.
.
.
.
.
.
.
.
.
.
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092
4093
4094
4095
Figure 21. Register 1 (R1)
Rev. 0 | Page 14 of 28
ADF4150
CHARGE
PUMP
CURRENT
SETTING
LOW
NOISE AND
LOW SPUR
MODES
CONTROL
BITS
MUXOUT
10-BIT R COUNTER
DBR
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
L2
L1
M3
M2
M1 RD2 RD1 R10
R9
R8
R7
R6
R5
R4
R3
R2
R1
D1
CP4 CP3 CP2 CP1 U6
U5
U4
U3
U2
U1 C3(0) C2(1) C1(0)
REFERENCE
RD2
COUNTER
RESET
DOUBLE BUFFER
R4 DB22:DB20
U1
L1
0
L2
NOISE MODE
DOUBLER
D1
U6
0
LDF
0
1
DISABLED
ENABLED
0
1
0
1
LOW NOISE MODE
RESERVED
FRAC-N
INT-N
0
1
DISABLED
ENABLED
0
1
DISABLED
ENABLED
0
1
1
RESERVED
RD1 REFERENCE DIVIDE BY 2
CP
I
(mA)
1
LOW SPUR MODE
CP
U2
U5
LDP
THREE-STATE
0
1
DISABLED
ENABLED
CP4
CP3
CP2
CP1
4.7kΩ
0
1
10ns
6ns
0
1
DISABLED
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0.31
0.63
0.94
1.25
1.56
1.88
2.19
2.50
2.81
3.13
3.44
3.75
4.06
4.38
4.69
5.00
ENABLED
R10
R9
..........
R2
R1
R DIVIDER (R)
U3
POWER-DOWN
U4
0
PD POLARITY
NEGATIVE
POSITIVE
0
0
.
0
0
.
..........
..........
..........
..........
..........
..........
..........
..........
..........
0
1
.
1
0
.
1
0
1
DISABLED
ENABLED
2
1
.
.
.
.
.
.
.
.
.
.
.
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
1020
1021
1022
1023
M3
M2
0
M1
0
OUTPUT
0
0
0
0
1
1
1
1
THREE-STATE OUTPUT
0
1
DV
DD
1
0
DGND
1
1
R DIVIDER OUTPUT
N DIVIDER OUTPUT
ANALOG LOCK DETECT
DIGITAL LOCK DETECT
RESERVED
0
0
0
1
1
0
1
1
Figure 22. Register 2 (R2)
Rev. 0 | Page 15 of 28
ADF4150
CLK
DIV
MODE
CONTROL
BITS
RESERVED
12-BIT CLOCK DIVIDER VALUE
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
0
0
0
0
0
0
F1
0
C2
C1
D12 D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1 C3(0) C2(1) C1(1)
F3
F2
0
D12
D11
.......... D2
D1
CLOCK DIVIDER VALUE
CYCLE SLIP
REDUCTION
F1
0
0
0
0
.
0
0
0
0
.
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
0
0
1
1
.
0
1
0
1
.
0
0
1
DISABLED
ENABLED
1
2
3
.
.
.
.
.
.
C2
C1
0
CLOCK DIVIDER MODE
CLOCK DIVIDER OFF
FAST LOCK ENABLE
RESYNC ENABLE
RESERVED
.
.
.
.
.
0
0
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092
4093
4094
4095
1
0
1
CHARGE
CANCELLATION
F2
0
1
DISABLED
ENABLED
ANTIBACKLASH
PULSE WIDTH
F3
0
1
6ns (FRAC-N)
3ns (INT_N)
Figure 23. Register 3 (R3)
2
DBB
DIVIDER
SELECT
OUTPUT
POWER
RESERVED
CONTROL
BITS
RESERVED
RESERVED
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
0
0
0
0
D13 D12 D11 D10 BS8 BS7 BS6 BS5 BS4 BS3 BS2 BS1
D9
D8
D7
D6
D5
D4
D3
D2
D1 C3(1) C2(0) C1(0)
FEEDBACK
SELECT
D13
D2
D1
0
OUTPUT POWER
0
0
1
1
–4
–1
+2
+5
0
1
DIVIDED
FUNDAMENTAL
1
0
MUTE TILL
LOCK DETECT
D12
D11
D10
RF DIVIDER SELECT
1
D8
0
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
÷1
÷2
÷4
÷8
÷16
MUTE DISABLED
D3
RF OUT
1
MUTE ENABLED
0
1
DISABLED
ENABLED
Figure 24. Register 4 (R4)
Rev. 0 | Page 16 of 28
ADF4150
LD PIN
MODE
CONTROL
BITS
RESERVED
RESERVED
RESERVED
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0
0
0
0
0
0
0
0
D15
D14
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C3(1) C2(0) C1(1)
D15
D14
LOCK DETECT PIN OPERATION
0
0
1
1
0
1
0
1
LOW
DIGITAL LOCK DETECT
LOW
HIGH
Figure 25. Register 5 (R5)
Rev. 0 | Page 17 of 28
ADF4150
12-Bit Phase Value (Phase)
REGISTER 0
These bits control what is loaded as the phase word. The word
must be less than the MOD value programmed in Register 1.
The word is used to program the RF output phase from 0° to
360° with a resolution of 360°/MOD. See the Phase Resync
section for more information. In most applications, the phase
relationship between the RF signal and the reference is not
important. In such applications, the PHASE value can be used
to optimize the fractional and subfractional spur levels. See the
Spur Consistency and Fractional Spur Optimization section for
more information.
Control Bits
With Bits[C3:C1] set to 0, 0, 0, Register 0 is programmed.
Figure 20 shows the input data format for programming this
register.
16-Bit Integer Value (INT)
These 16 bits set the INT value, which determines the integer
part of the feedback division factor. They are used in Equation 1
(see the INT, FRAC, MOD, and R Counter Relationship section).
All integer values from 23 to 65,535 are allowed for 4/5 prescaler.
For 8/9 prescaler, the minimum integer value is 75.
If neither the PHASE resync nor the spurious optimization
functions are being used, it is recommended that the PHASE
word be set to 1.
12-Bit Fractional Value(FRAC)
The 12 FRAC bits set the numerator of the fraction that is input
to the Σ-Δ modulator. This, along with INT, specifies the new
frequency channel that the synthesizer locks to, as shown in the
RF Synthesizer—A Worked Example section. FRAC values from
0 to MOD − 1 cover channels over a frequency range equal to
the PFD reference frequency.
12-Bit Modulus Value (MOD)
This programmable register sets the fractional modulus. This
is the ratio of the PFD frequency to the channel step resolution
on the RF output. See the RF Synthesizer—A Worked Example
section for more information.
REGISTER 1
Control Bits
REGISTER 2
Control Bits
With Bits[C3:C1] set to 0, 0, 1, Register 1 is programmed.
Figure 21 shows the input data format for programming
this register.
With Bits[C3:C1] set to 0, 1, 0, Register 2 is programmed.
Figure 22 shows the input data format for programming
this register.
Prescaler Value
Low Noise and Spur Modes
The dual modulus prescaler (P/P + 1), along with the INT,
FRAC, and MOD counters, determines the overall division
ratio from the VCO output to the PFD input.
The noise modes on the ADF4150 are controlled by DB30 and
DB29 in Register 2 (see Figure 22). The noise modes allow the
user to optimize a design either for improved spurious perfor-
mance or for improved phase noise performance.
Operating at CML levels, it takes the clock from the VCO
output and divides it down for the counters. It is based on a
synchronous 4/5 core. When set to 4/5, the maximum RF
frequency allowed is 3 GHz. Therefore, when operating the
ADF4150 above 3 GHz, this must be set to 8/9. The prescaler
limits the INT value, where:
When the lowest spur setting is chosen, dither is enabled. This
randomizes the fractional quantization noise so it resembles
white noise rather than spurious noise. As a result, the part is
optimized for improved spurious performance. This operation
would normally be used when the PLL closed-loop bandwidth
is wide, for fast-locking applications. (Wide loop bandwidth is
seen as a loop bandwidth greater than 1/10 of the RFOUT channel
step resolution (fRES)). A wide loop filter does not attenuate the
spurs to the same level as a narrow loop bandwidth.
P = 4/5, NMIN = 23
P = 8/9, NMIN = 75
In the ADF4150, P1 in Register 1 sets the prescaler values.
For best noise performance, use the lowest noise setting option.
As well as disabling the dither, it also ensures that the charge
pump is operating in an optimum region for noise performance.
This setting is extremely useful where a narrow loop filter band-
width is available. The synthesizer ensures extremely low noise
and the filter attenuates the spurs. The typical performance
characteristics give the user an idea of the trade-off in a typical
W-CDMA setup for the different noise and spur settings.
Rev. 0 | Page 18 of 28
ADF4150
MUXOUT
Lock Detect Precision (LDP)
The on-chip multiplexer is controlled by Bits[DB28:DB26] (see
Figure 22).
When DB7 is set to 0, the fractional-N digital lock detect is
activated. In this case after setting DB7 to 0, 40 consecutive PFD
cycles of 10 ns must occur before digital lock detect is set. When
DB7 is programmed to 1, 40 consecutive reference cycles of 6 ns
must occur before digital lock detect goes high. Setting DB8 to 1
causes the activation of the integer-N digital lock detect. In this
case, after setting DB7 to 0, 5 consecutive cycles of 10 ns must
occur before digital lock detect is set. When DB7 is set to 1, five
consecutive cycles of 6 ns must occur.
Reference Doubler
Setting DB25 to 0 feeds the REFIN signal directly to the 10-bit
R counter, disabling the doubler. Setting this bit to 1 multiplies
the REFIN frequency by a factor of 2 before feeding into the
10-bit R counter. When the doubler is disabled, the REFIN
falling edge is the active edge at the PFD input to the fractional
synthesizer. When the doubler is enabled, both the rising and
falling edges of REFIN become active edges at the PFD input.
Phase Detector Polarity
DB6 sets the phase detector polarity. When a passive loop filter,
or noninverting active loop filter is used, set this bit to 1. If an
active filter with an inverting characteristic is used, this bit
should be set to 0.
When the doubler is enabled and the lowest spur mode is
chosen, the in-band phase noise performance is sensitive to the
REFIN duty cycle. The phase noise degradation can be as much
as 5 dB for the REFIN duty cycles outside a 45% to 55% range.
The phase noise is insensitive to the REFIN duty cycle in the
lowest noise mode. The phase noise is insensitive to the REFIN
duty cycle when the doubler is disabled.
Power-Down (PD)
DB5 provides the programmable power-down mode. Setting this
bit to 1 performs a power-down. Setting this bit to 0 returns the
synthesizer to normal operation. When in software power-down
mode, the part retains all information in its registers. Only if the
supply voltages are removed are the register contents lost.
The maximum allowable REFIN frequency when the doubler is
enabled is 30 MHz.
RDIV2
Setting the DB24 bit to 1 inserts a divide-by-2 toggle flip-flop
between the R counter and PFD, which extends the maximum
REFIN input rate. This function allows a 50% duty cycle signal
to appear at the PFD input, which is necessary for cycle slip
reduction.
When a power-down is activated, the following events occur:
•
The synthesizer counters are forced to their load state
conditions.
•
•
•
•
The charge pump is forced into three-state mode.
The digital lock detect circuitry is reset.
The RFOUT buffers are disabled.
The input register remains active and capable of loading
and latching data.
10-Bit R Counter
The 10-bit R counter allows the input reference frequency
(REFIN) to be divided down to produce the reference clock to
the PFD. Division ratios from 1 to 1023 are allowed.
Charge Pump (CP) Three-State
Double Buffer
DB4 puts the charge pump into three-state mode when
programmed to 1. It should be set to 0 for normal operation.
DB13 enables or disables double buffering of Bits[DB22:DB20]
in Register 4. The Divider Select section explains how double
buffering works.
Counter Reset
DB3 is the R counter and N counter reset bit for the ADF4150.
When this bit is 1, the RF synthesizer N counter and R counter
are held in reset. For normal operation, this bit should be set to 0.
Current Setting
Bits[DB12:DB9] set the charge pump current setting. This
should be set to the charge pump current that the loop filter
is designed with (see Figure 22).
LDF
Setting DB8 to 1 enables integer-N digital lock detect, when
the FRAC part of the divider is zero; setting DB8 to 0 enables
fractional-N digital lock detect.
Rev. 0 | Page 19 of 28
ADF4150
REGISTER 3
REGISTER 4
Control Bits
Control Bits
With Bits[C3:C1] set to 0, 1, 1, Register 3 is programmed.
Figure 23 shows the input data format for programming
this register.
With Bits[C3: C1] set to 1, 0, 0, Register 4 is programmed.
Figure 24 shows the input data format for programming this
register.
Antibacklash Pulse Width
Feedback Select
Setting DB22 to 0 sets the PFD antibacklash pulse width to 6 ns.
This is the recommended mode for fractional-N use. By setting
this bit to 1, the 3 ns pulse width is used and results in a phase
noise and spur improvement in integer-N operation. For
fractional-N mode it is not recommended to use this smaller
setting.
DB23 selects the feedback from VCO output to the N-counter.
When this bit is set to 1, the signal is taken from the VCO directly.
When this bit is set to 0, it is taken from the output of the output
dividers. The dividers enable covering of the wide frequency band
(137.5 MHz to 4.4 GHz). When the divider is enabled and the
feedback signal is taken from the output, the RF output signals
of two separately configured PLLs are in phase. This is useful in
some applications where the positive interference of signals is
required to increase the power.
Charge Cancellation Mode Pulse Width
Setting DB21 to 1 enables charge pump charge cancellation.
This has the effect of reducing PFD spurs in integer-N mode.
In fractional-N mode, this bit should not be used and the
relevant result in a phase noise and spur improvement. For
fractional-N mode, it is not recommended to use this smaller
setting.
Divider Select
Bits[DB22:DB20] select the value of the output divider (see
Figure 24).
Mute-Till-Lock Detect
Cycle Slip Reduction (CSR) Enable
If DB10 is set to 1, the supply current to the RF output stage is shut
down until the part achieves lock as measured by the digital lock
detect circuitry.
Setting DB18 to 1 enables cycle slip reduction. This is a method
for improving lock times. Note that the signal at the phase fre-
quency detector (PFD) must have a 50% duty cycle for cycle slip
reduction to work. The charge pump current setting must also
be set to a minimum. See the Cycle Slip Reduction for Faster
Lock Times section for more information.
RF Output Enable
DB5 enables or disables primary RF output, depending on the
chosen value.
Output Power
Clock Divider Mode
DB4 and DB3 set the value of the primary RF output power
level (see Figure 24).
Bits[DB16:DB15] must be set to 1, 0 to activate PHASE resync
or 0, 1 to activate fast lock. Setting Bits[DB16:DB15] to 0, 0
disables the clock divider. See Figure 23.
REGISTER 5
Control Bits
12-Bit Clock Divider Value
With Bits[C3:C1] set to 1, 0, 1, Register 5 is programmed.
Figure 25 shows the input data form for programming this
register.
The 12-bit clock divider value sets the timeout counter for
activation of PHASE resync. See the Phase Resync section for
more information. It also sets the timeout counter for fast lock.
See the Fast Lock Timer and Register Sequences section for
more information.
Lock Detect PIN Operation
Bits[DB23:DB22] set the operation of the lock detect pin (see
Figure 25).
INITIALIZATION SEQUENCE
The following sequence of registers is the correct sequence for
initial power up of the ADF4150 after the correct application
of voltages to the supply pins:
•
•
•
•
•
•
Register 5
Register 4
Register 3
Register 2
Register 1
Register 0
Rev. 0 | Page 20 of 28
ADF4150
RF SYNTHESIZER—A WORKED EXAMPLE
MODULUS
The following is an example how to program the ADF4150
synthesizer:
The choice of modulus (MOD) depends on the reference signal
(REFIN) available and the channel resolution (fRES) required at
the RF output. For example, a GSM system with 13 MHz REFIN
RFOUT = [INT + (FRAC/MOD)] × [fPFD]/RF Divider
(3)
sets the modulus to 65. This means the RF output resolution (fRES
)
where:
is the 200 kHz (13 MHz/65) necessary for GSM. With dither off,
the fractional spur interval depends on the modulus values chosen
(see Table 6).
RFOUT is the RF frequency output.
INT is the integer division factor.
FRAC is the fractionality.
MOD is the modulus.
REFERENCE DOUBLER AND REFERENCE DIVIDER
The reference doubler on-chip allows the input reference signal
to be doubled. This is useful for increasing the PFD comparison
frequency. Making the PFD frequency higher improves the
noise performance of the system. Doubling the PFD frequency
usually improves noise performance by 3 dB. It is important
to note that the PFD cannot operate above 32 MHz due to a
limitation in the speed of the Σ-Δ circuit of the N-divider.
RF Divider is the output divider that divides down the VCO
frequency.
fPFD = REFIN × [(1 + D)/(R × (1 + T))]
(4)
where:
REFIN is the reference frequency input.
D is the RF REFIN doubler bit.
T is the reference divide-by-2 bit (0 or 1).
R is the RF reference division factor.
The reference divide-by-2 divides the reference signal by 2,
resulting in a 50% duty cycle PFD frequency. This is necessary
for the correct operation of the cycle slip reduction (CSR)
function. See the Cycle Slip Reduction for Faster Lock Times
section for more information.
For example, in a UMTS system, where 2112.6 MHz RF
frequency output (RFOUT) is required, a 10 MHz reference
frequency input (REFIN) is available, and a 200 kHz channel
resolution (fRESOUT) is required, on the RF output. A 2.1 GHz
VCO would be suitable, but a 4.2 GHz VCO would also be
suitable. In the second case, the RF divider of 2 should be used
(VCO frequency = 4225.2 MHz, RFOUT = VCO frequency/RF
divider = 4225.2 MHz/2 = 2112.6 MHz).
12-BIT PROGRAMMABLE MODULUS
Unlike most other fractional-N PLLs, the ADF4150 allows the
user to program the modulus over a 12-bit range. This means
the user can set up the part in many different configurations for
the application, when combined with the reference doubler and
the 10-bit R counter.
It is also important where the loop is closed. In this example, the
loop is closed as depicted in Figure 26 (from the out divider).
For example, consider an application that requires 1.75 GHz RF
and 200 kHz channel step resolution. The system has a 13 MHz
reference signal.
fPFD
RF
OUT
PFD
VCO
÷2
One possible setup is feeding the 13 MHz directly to the PFD
and programming the modulus to divide by 65. This results in
the required 200 kHz resolution.
N
DIVIDER
Figure 26. Loop Closed Before Output Divider
Another possible setup is using the reference doubler to create
26 MHz from the 13 MHz input signal. The 26 MHz is then fed
into the PFD programming the modulus to divide by 130. This
also results in 200 kHz resolution and offers superior phase
noise performance over the previous setup.
A channel resolution (fRESOUT) of 200 kHz is required at the
output of the RF divider. Therefore, channel resolution at
the output of the VCO (fRES) is to be twice the fRESOUT, that
is, 400 kHz.
MOD = REFIN/fRES
The programmable modulus is also very useful for multi-
standard applications. If a dual-mode phone requires PDC
and GSM 1800 standards, the programmable modulus is a
great benefit. PDC requires 25 kHz channel step resolution,
whereas GSM 1800 requires 200 kHz channel step resolution.
MOD = 10 MHz/400 kHz = 25
From Equation 4
f
PFD = [10 MHz × (1 + 0)/1] = 10 MHz
2112.6 MHz = 10 MHz × (INT + FRAC/25)/2
where:
(5)
(6)
INT = 422
FRAC = 13
Rev. 0 | Page 21 of 28
ADF4150
A 13 MHz reference signal can be fed directly to the PFD, and
the modulus can be programmed to 520 when in PDC mode
(13 MHz/520 = 25 kHz).
If the phase error increases again to a point where another cycle
slip is likely, the ADF4150 turns on another charge pump cell.
This continues until the ADF4150 detects the VCO frequency
has gone past the desired frequency. The extra charge pump
cells are turned off one by one until all the extra charge pump
cells have been disabled and the frequency is settled with the
original loop filter bandwidth.
The modulus needs to be reprogrammed to 65 for GSM 1800
operation (13 MHz/65 = 200 kHz).
It is important that the PFD frequency remain constant (13 MHz).
This allows the user to design one loop filter for both setups
without running into stability issues. It is important to remem-
ber that the ratio of the RF frequency to the PFD frequency
principally affects the loop filter design, not the actual channel
spacing.
Up to seven extra charge pump cells can be turned on. In most
applications, it is enough to eliminate cycle slips altogether,
giving much faster lock times.
Setting Bit DB18 in Register 3 to 1 enables cycle slip reduction.
Note that the PFD requires a 45% to 55% duty
cycle for CSR to operate correctly.
CYCLE SLIP REDUCTION FOR FASTER LOCK TIMES
As outlined in the Low Noise and Spur Mode section, the
ADF4150 contains a number of features that allow optimization
for noise performance. However, in fast locking applications,
the loop bandwidth generally needs to be wide, and therefore,
the filter does not provide much attenuation of the spurs. If
the cycle slip reduction feature is enabled, the narrow loop
bandwidth is maintained for spur attenuation but faster lock
times are still possible.
SPURIOUS OPTIMIZATION AND FAST LOCK
Narrow loop bandwidths can filter unwanted spurious signals,
but these usually have a long lock time. A wider loop bandwidth
achieves faster lock times, but a wider loop bandwidth may lead
to increased spurious signals inside the loop bandwidth.
The fast lock feature can achieve the same fast lock time as the
wider bandwidth, but with the advantage of a narrow final loop
bandwidth to keep spurs low.
Cycle Slips
Cycle slips occur in integer-N/fractional-N synthesizers when
the loop bandwidth is narrow compared to the PFD frequency.
The phase error at the PFD inputs accumulates too fast for the
PLL to correct, and the charge pump temporarily pumps in the
wrong direction. This slows down the lock time dramatically.
The ADF4150 contains a cycle slip reduction feature that
extends the linear range of the PFD, allowing faster lock
times without modifications to the loop filter circuitry.
FAST LOCK TIMER AND REGISTER SEQUENCES
If the fast lock mode is used, a timer value is to be loaded into
the PLL to determine the duration of the wide bandwidth mode.
When Bits[DB16:DB15] in Register 3 are set to 0, 1 (fast
lock enable), the timer value is loaded by the 12-bit clock
divider value. The following sequence must be programmed
to use fast lock:
1. Initialization sequence (see the Initialization Sequence
section); occurs only once after powering up the part.
2. Load Register 3 by setting Bits[DB16:DB15] to 0, 1 and
the chosen fast lock timer value [DB14:DB3]. Note that
the duration the PLL remains in wide bandwidth is equal
When the circuitry detects that a cycle slip is about to occur,
it turns on an extra charge pump current cell. This outputs a
constant current to the loop filter, or removes a constant
current from the loop filter (depending on whether the VCO
tuning voltage needs to increase or decrease to acquire the
new frequency). The effect is that the linear range of the PFD
is increased. Loop stability is maintained because the current
is constant and is not a pulsed current.
to the fast lock timer/fPFD
.
Rev. 0 | Page 22 of 28
ADF4150
FAST LOCK—AN EXAMPLE
SPUR MECHANISMS
If a PLL has a reference frequency of 13 MHz, fPFD of 13 MHz
and a required lock time of 50 µs, the PLL is set to wide bandwidth
for 40 µs. This example assumes a modulus of 65 for channel
spacing of 200 kHz.
This section describes the three different spur mechanisms that
arise with a fractional-N synthesizer and how to minimize them
in the ADF4150.
Fractional Spurs
If the time period set for the wide bandwidth is 40 µs, then
Fast Lock Timer Value = Time In Wide Bandwidth × fPFD/MOD
Fast Lock Timer Value = 40 µs × 13 MHz/65 = 8
The fractional interpolator in the ADF4150 is a third-order Σ-Δ
modulator (SDM) with a modulus (MOD) that is programmable
to any integer value from 2 to 4095. In low spur mode (dither
enabled), the minimum allowable value of MOD is 50. The
SDM is clocked at the PFD reference rate (fPFD) that allows PLL
output frequencies to be synthesized at a channel step resolution
of fPFD/MOD.
Therefore, 8 must be loaded into the clock divider value in
Register 3 in Step 1 of the sequence described in the Fast Lock
Timer and Register Sequences section.
FAST LOCK—LOOP FILTER TOPOLOGY
In low noise mode (dither off), the quantization noise from the
Σ-Δ modulator appears as fractional spurs. The interval between
spurs is fPFD/L, where L is the repeat length of the code sequence
in the digital Σ-Δ modulator. For the third-order modulator
used in the ADF4150, the repeat length depends on the value
of MOD, as listed in Table 6.
To use fast lock mode, the damping resistor in the loop filter
is reduced to ¼ of its value while in wide bandwidth mode. To
achieve the wider loop filter bandwidth, the charge pump
current increases by a factor of 16. To maintain loop stability,
the damping resistor must be reduced a factor of ¼. To enable
fast lock, the SW pin is shorted to the GND pin by settings
Bits[DB16:DB15] in Register 3 to 0, 1. The following two
topologies are available:
Table 6. Fractional Spurs with Dither Off
Repeat
Length
Condition (Dither Off)
Spur Interval
Channel step/2
Channel step/3
Channel step/6
Channel step
•
The damping resistor (R1) is divided into two values (R1
and R1A) that have a ratio of 1:3 (see Figure 27).
An extra resistor (R1A) is connected directly from SW,
as shown in Figure 28. The extra resistor is calculated
such that the parallel combination of an extra resistor
and the damping resistor (R1) is reduced to ¼ of the
original value of R1 (see Figure 28).
If MOD is divisible by 2 but not 3 2 × MOD
If MOD is divisible by 3 but not 2 3 × MOD
•
If MOD is divisible by 6
Otherwise
6 × MOD
MOD
In low spur mode (dither on), the repeat length is extended to
221 cycles, regardless of the value of MOD, which makes the
quantization error spectrum look like broadband noise. This
may degrade the in-band phase noise at the PLL output by as
much as 10 dB. For lowest noise, dither off is a better choice,
particularly when the final loop bandwidth is low enough to
attenuate even the lowest frequency fractional spur.
ADF4150
R2
CP
VCO
C1
C2
R1
C3
SW
Integer Boundary Spurs
R1A
Another mechanism for fractional spur creation is the inte-
ractions between the RF VCO frequency and the reference
frequency. When these frequencies are not integer related (the
point of a fractional-N synthesizer) spur sidebands appear on
the VCO output spectrum at an offset frequency that corres-
ponds to the beat note or difference frequency between an
integer multiple of the reference and the VCO frequency. These
spurs are attenuated by the loop filter and are more noticeable
on channels close to integer multiples of the reference where
the difference frequency can be inside the loop bandwidth,
therefore the name integer boundary spurs.
Figure 27. Fast Lock Loop Filter Topology—Topology 1
ADF4150
R2
CP
VCO
C1
C2
R1
C3
R1A
SW
Figure 28. Fast Lock Loop Filter Topology—Topology 2
Rev. 0 | Page 23 of 28
ADF4150
Reference Spurs
Phase resync is enabled by setting Bit DB16, Bit DB15 in
Register 3 to 1, 0. When PHASE resync is enabled, an internal
timer generates sync signals at intervals of tSYNC given by the
following formula:
Reference spurs are generally not a problem in fractional-N
synthesizers because the reference offset is far outside the loop
bandwidth. However, any reference feedthrough mechanism
that bypasses the loop can cause a problem. Feedthrough of low
levels of on-chip reference switching noise, through the RFIN
pin back to the VCO, can result in reference spur levels as high
as −90 dBc. PCB layout needs to ensure adequate isolation
between VCO traces and the input reference to avoid a possible
feedthrough path on the board.
t
SYNC = CLK_DIV_VALUE × MOD × tPFD
where:
PFD is the PFD reference period.
t
CLK_DIV_VALUE is the decimal value programmed in
Bits[DB14:DB3] of Register 3 and can be any integer in the
range of 1 to 4095.
MOD is the modulus value programmed in Bits[DB14:DB3] of
Register 1 (R1).
SPUR CONSISTENCY AND FRACTIONAL SPUR
OPTIMIZATION
With dither off, the fractional spur pattern due to the quanti-
zation noise of the SDM also depends on the particular phase
word with which the modulator is seeded.
When a new frequency is programmed, the second sync pulse
after the LE rising edge is used to resynchronize the output
phase to the reference. The tSYNC time is to be programmed to
a value that is at least as long as the worst-case lock time. This
guarantees that the PHASE resync occurs after the last cycle slip
in the PLL settling transient.
The phase word can be varied to optimize the fractional and
subfractional spur levels on any particular frequency. Thus, a
look-up table of phase values corresponding to each frequency
can be constructed for use when programming the ADF4150.
In the example shown in Figure 29, the PFD reference is 25 MHz
and MOD is 125 for a 200 kHz channel spacing. tSYNC is set to
400 µs by programming CLK_DIV_VALUE to 80.
If a look-up table is not used, keep the phase word at a constant
value to ensure consistent spur levels on any particular frequency.
PHASE RESYNC
LE
tSYNC
The output of a fractional-N PLL can settle to any one of the
MOD phase offsets with respect to the input reference, where
MOD is the fractional modulus. The phase resync feature in the
ADF4150 produces a consistent output phase offset with respect
to the input reference. This is necessary in applications where the
output phase and frequency are important, such as digital beam
forming. See the Phase Programmability section for how to
program a specific RF output phase when using phase resync.
SYNC
(INTERNAL)
LAST CYCLE SLIP
FREQUENCY
PLL SETTLES TO
INCORRECT PHASE
PLL SETTLES TO
CORRECT PHASE
AFTER RESYNC
PHASE
–100
0
100 200 300 400 500 600 700 800 900 1000
TIME (µs)
Figure 29. Phase Resync Example
Phase Programmability
The phase word in Register 1 controls the RF output phase. As
this word is swept from 0 to MOD, the RF output phase sweeps
over a 360° range in steps of 360°/MOD.
Rev. 0 | Page 24 of 28
ADF4150
APPLICATIONS INFORMATION
The LO ports of the ADL5375 can be driven differentially from
the RFOUT+ and RFOUT− outputs of the ADF4150. This gives
better performance than a single-ended LO driver and
eliminates the use of a balun to convert from a single-ended LO
input to the more desirable differential LO inputs for the
ADL5375. The typical rms phase noise (100 Hz to 5 MHz) of
the LO in this configuration is 0.61°rms.
DIRECT CONVERSION MODULATOR
Direct conversion architectures are increasingly being used to
implement base station transmitters. Figure 30 shows how Analog
Devices, Inc., parts can be used to implement such a system.
The circuit block diagram shows the AD9788 TxDAC® being
used with the ADL5375. The use of dual integrated DACs, such
as the AD9788 with its specified 0.02 dB and 0.004 dB gain
and offset matching characteristics, ensures minimum error
contribution (over temperature) from this portion of the
signal chain.
The ADL5375 accepts LO drive levels from −10 dBm to 0 dBm.
The optimum LO power can be software programmed on the
ADF4150, which allows levels from −4 dBm to +5 dBm from
each output.
The local oscillator (LO) is implemented using the ADF4150.
The low-pass filter was designed using ADIsimPLL™ for a channel
spacing of 200 kHz and a closed-loop bandwidth of 35 kHz.
The RF output is designed to drive a 50 Ω load but must be
ac-coupled, as shown in Figure 30. If the I and Q inputs are
driven in quadrature by 2 V p-p signals, the resulting output
power from the modulator is approximately 2 dBm.
51Ω
51Ω
REFIO
IOUTA
IOUTB
LOW-PASS
FILTER
MODULATED
DIGITAL
DATA
AD9788
TxDAC
QOUTA
QOUTB
LOW-PASS
FILTER
FSADJ
51Ω
51Ω
2kΩ
ADL5375
IBBP
LOCK
DETECT
V
DD
V
VCO
IBBN
21
MUXOUT
4
20
9
18
DV
16
AV
17
6
22
3.9nH
3.9nH
AV
CE PDB
SDV
LD
VP
DD
DD
DD
RF
DD
1nF
1nF 1nF
LOIP
LOIN
RF
+
–
15
14
OUT
QUADRATURE
PHASE
SPLITTER
FREF
REF
19
51Ω
IN
IN
RFOUT
DSOP
RF
OUT
CLK
1
2
3
1nF
V
VCO
DATA
LE
V
VCO
QBBP
QBBN
100pF
100pF
CC
VCO
10
11
RF
+
–
OUT
IN
ADF4150
V
TUNE
24
R
RF
SET
IN
4.7kΩ
680Ω
CP
7
5
39nF
2700pF
1200pF
SW
360Ω
CP
A
A
SD
GND
GND
GND
GND
13
8
12
23
Figure 30. Direct Conversion Modulator
Rev. 0 | Page 25 of 28
ADF4150
ADSP-21xx Interface
INTERFACING
Figure 32 shows the interface between the ADF4150 and a
ADSP-21xx digital signal processor. The ADF4150 needs a
32-bit serial word for each latch write. The easiest way to
accomplish this using the ADSP-21xx family is to use the
autobuffered transmit mode of operation with alternate
framing. This provides a means for transmitting an entire
block of serial data before an interrupt is generated.
The ADF4150 has a simple SPI-compatible serial interface
for writing to the device. CLK, DATA, and LE control the data
transfer. When LE goes high, the 32 bits that have been clocked
into the appropriate register on each rising edge of CLK are
transferred to the appropriate latch. See Figure 2 for the timing
diagram and Table 5 for the register address table.
ADuC812 Interface
Figure 31 shows the interface between the ADF4150 and the
ADuC812 MicroConverter®. Because the ADuC812 is based
on an 8051 core, this interface can be used with any 8051-based
microcontroller. The MicroConverter is set up for SPI master
mode with CPHA = 0. To initiate the operation, the I/O port
driving LE is brought low. Each latch of the ADF4150 needs a
32-bit word, which is accomplished by writing four 8-bit bytes
from the MicroConverter to the device. When the fourth byte
has been written, the LE input should be brought high to
complete the transfer.
SCLK
CLK
MOSI
TFS
SDATA
LE
ADF4150
ADSP-21xx
I/O PORTS
CE
MUXOUT
(LOCK DETECT)
Figure 32. ADSP-21xx to ADF4150 Interface
Set up the word length for 8 bits and use four memory locations
for each 32-bit word. To program each 32-bit latch, store the 8-bit
bytes, enable the autobuffered mode, and write to the transmit
register of the DSP. This last operation initiates the autobuffer
transfer.
SCLOCK
MOSI
CLK
SDATA
ADuC812
I/O PORTS
LE
ADF4150
CE
PCB DESIGN GUIDELINES FOR CHIP SCALE
PACKAGE
MUXOUT
(LOCK DETECT)
The lands on the chip scale package (CP-24-7) are rectangular.
The PCB pad for these is to be 0.1 mm longer than the package
land length and 0.05 mm wider than the package land width.
The land is to be centered on the pad. This ensures the solder
joint size is maximized. The bottom of the chip scale package
has a central thermal pad.
Figure 31. ADuC812 to ADF4150 Interface
I/O port lines on the ADuC812 are also used to control power-
down (CE input) and detect lock (MUXOUT configured as
lock detect and polled by the port input). When operating in
the described mode, the maximum SCLOCK rate of the
ADuC812 is 4 MHz. This means that the maximum rate at
which the output frequency can be changed is 125 kHz.
The thermal pad on the PCB is to be at least as large as the
exposed pad. On the PCB, there is to be a minimum clearance
of 0.25 mm between the thermal pad and the inner edges of the
pad pattern. This ensures that shorting is avoided.
Thermal vias can be used on the PCB thermal pad to improve
the thermal performance of the package. If vias are used, they
are to be incorporated in the thermal pad at 1.2 mm pitch grid.
The via diameter is to be between 0.3 mm and 0.33 mm, and the
via barrel is to be plated with one ounce copper to plug the via.
Rev. 0 | Page 26 of 28
ADF4150
Experiments indicate that the circuit shown in Figure 34
OUTPUT MATCHING
provides an excellent match to 50 Ω for the W-CDMA UMTS
Band 1 (2110 MHz to 2170 MHz). The maximum output power
in that case is about 7 dBm. Both single-ended architectures can
be examined using the EVAL-ADF4150EB1Z evaluation board.
There are a number of ways to match the output of the ADF4150
for optimum operation; the most basic is to use a 50 Ω resistor to
AVDD. A dc bypass capacitor of 100 pF is connected in series as
shown in Figure 33. Because the resistor is not frequency
dependent, this provides a good broadband match. The output
power in this circuit into a 50 Ω load typically gives values
chosen by Bits[DB4:DB3] in Register 4 (R4).
AV
DD
3.9nH
1nF
RF
OUT
AV
DD
50Ω
50Ω
100pF
Figure 34. Optimum ADF4150 Output Stage
RF
OUT
If differential outputs are not needed, the unused output can be
terminated or combined with both outputs using a balun.
50Ω
Figure 33. Simple ADF4150 Output Stage
A better solution is to use a shunt inductor (acting as an RF
choke) to AVDD. This gives a better match and, therefore, more
output power.
Rev. 0 | Page 27 of 28
ADF4150
OUTLINE DIMENSIONS
4.10
4.00 SQ
3.90
0.30
0.25
0.18
PIN 1
INDICATOR
PIN 1
INDICATOR
19
18
24
0.50
BSC
1
2.65
2.50 SQ
2.45
EXPOSED
PAD
13
12
BOTTOM VIEW
6
7
0.50
0.40
0.30
0.25 MIN
TOP VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.80
0.75
0.70
0.05 MAX
0.02 NOM
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
Figure 35. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm ×4 mm Body, Very Very Thin Quad
(CP-24-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
CP-24-7
CP-24-7
ADF4150BCPZ
ADF4150BCPZ-RL7
EVAL-ADF4150EB1Z
24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Evaluation Board
1 Z = RoHS Compliant Part.
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08226-0-7/11(0)
Rev. 0 | Page 28 of 28
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