EVAL-ADF4154EB1 [ADI]

Fractional-N Frequency Synthesizer; 小数N分频合成器
EVAL-ADF4154EB1
型号: EVAL-ADF4154EB1
厂家: ADI    ADI
描述:

Fractional-N Frequency Synthesizer
小数N分频合成器

文件: 总20页 (文件大小:550K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Fractional-N Frequency Synthesizer  
ADF4154  
FEATURES  
GENERAL DESCRIPTION  
RF bandwidth 500 MHz to 4 GHz  
2.7 V to 3.3 V power supply  
Separate VP allows extended tuning voltage  
Programmable dual-modulus prescaler 4/5, 8/9  
Programmable charge pump currents  
3-wire serial interface  
The ADF4154 is a fractional-N frequency synthesizer that  
implements local oscillators in the up conversion and down  
conversion sections of wireless receivers and transmitters. It  
consists of a low noise digital phase frequency detector (PFD),  
a precision charge pump, and a programmable reference divider.  
There is a Σ-Δ based fractional interpolator to allow program-  
mable fractional-N division. The INT, FRAC, and MOD regis-  
ters define an overall N divider (N = (INT + (FRAC/MOD))).  
In addition, the 4-bit reference counter (R counter) allows  
selectable REFIN frequencies at the PFD input. A complete  
phase-locked loop (PLL) can be implemented if the synthesizer  
is used with an external loop filter and a voltage controlled  
oscillator (VCO).  
Digital lock detect  
Power-down mode  
Pin compatible with the ADF4110/ADF4111/  
ADF4112/ADF4113, ADF4106 and ADF4153  
Programmable modulus on fractional-N synthesizer  
Trade-off noise versus spurious performance  
Fast-lock mode with built-in timer  
APPLICATIONS  
CATV equipment  
Base stations for mobile radio (GSM, PCS, DCS,  
CDMA, WCDMA)  
Wireless handsets (GSM, PCS, DCS, CDMA, WCDMA)  
Wireless LANs  
A key feature of the ADF4154 is the fast-lock mode with a built-  
in timer. The user can program a predetermined count-down  
time value so that the PLL will remain in wide bandwidth mode,  
instead of having to control this time externally.  
Control of all on-chip registers is via a simple 3-wire interface.  
The device operates with a power supply ranging from 2.7 V to  
3.3 V, and can be powered down when not in use.  
Communications test equipment  
FUNCTIONAL BLOCK DIAGRAM  
AV  
DD  
DV  
DD  
V
SDV  
R
SET  
P
DD  
REFERENCE  
4-BIT  
R COUNTER  
+
PHASE  
×2  
REF  
IN  
CHARGE  
PUMP  
FREQUENCY  
DETECTOR  
DOUBLER  
CP  
V
DD  
HIGH Z  
DGND  
LOCK  
DETECT  
CURRENT  
SETTING  
OUTPUT  
MUX  
MUXOUT  
FAST-LOCK  
SWITCH  
V
RFCP3 RFCP2 RFCP1  
DD  
R
N
DIV  
DIV  
RF  
RF  
A
B
IN  
N COUNTER  
IN  
THIRD ORDER  
FRACTIONAL  
INTERPOLATOR  
FRACTION  
REG  
MODULUS  
REG  
INTEGER REG  
P = 4/5 OR 8/9  
B = 9 BITS; A = 3 BITS  
CLOCK  
DATA  
LE  
24-BIT  
DATA  
REGISTER  
ADF4154  
AGND  
DGND  
CPGND  
Figure 1.  
Rev. 0  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.326.8703  
www.analog.com  
© 2004 Analog Devices, Inc. All rights reserved.  
ADF4154  
TABLE OF CONTENTS  
Specifications..................................................................................... 3  
R-Divider Register, R1 ............................................................... 15  
Control Register, R2 ................................................................... 15  
Noise and Spur Register, R3...................................................... 16  
Reserved Bits............................................................................... 16  
RF Synthesizer: A Worked Example ........................................ 16  
Modulus....................................................................................... 17  
Reference Doubler and Reference Divider ............................. 17  
12-Bit Programmable Modulus................................................ 17  
Spurious Optimization and Fast-lock...................................... 17  
Fast-Lock Timer and Register Sequences ............................... 17  
Fast-Lock: A Worked Example ................................................. 18  
Fast-Lock: Loop Filter Topology .............................................. 18  
Spurious Signals.......................................................................... 18  
Filter Design—ADIsimPLL....................................................... 18  
Interfacing ................................................................................... 18  
PCB Design Guidelines for Chip Scale Package .................... 19  
Outline Dimensions....................................................................... 20  
Ordering Guide .......................................................................... 20  
Timing Characteristics..................................................................... 4  
Absolute Maximum Ratings............................................................ 5  
ESD Caution.................................................................................. 5  
Pin Configuration and Pin Function Descriptions...................... 6  
Typical Performance Characteristics ............................................. 7  
Circuit Description........................................................................... 9  
Reference Input Section............................................................... 9  
RF Input Stage............................................................................... 9  
RF INT Divider............................................................................. 9  
INT, FRAC, MOD, and R Relationship...................................... 9  
RF R Counter ................................................................................ 9  
Phase Frequency Detector (PFD) and Charge Pump.............. 9  
MUXOUT and Lock Detect...................................................... 10  
Input Shift Registers................................................................... 10  
Program Modes .......................................................................... 10  
Registers........................................................................................... 11  
Register Definition..................................................................... 15  
Rev. 0 | Page 2 of 20  
ADF4154  
SPECIFICATIONS  
Table 1. AVDD = DVDD = SDVDD = 2.7 V to 3.3 V; VP = AVDD to 5.5 V; AGND = DGND = 0 V; TA = TMIN to TMAX, unless otherwise  
noted; dBm referred to 50 Ω. The operating temperature for the B version is −40°C to +80°C.  
Parameter  
B Version  
Unit  
Test Conditions/Comments  
RF CHARACTERISTICS (3 V)  
RF Input Frequency (RFIN)1  
See Figure 18 for input circuit.  
−8 dBm/0 dBm min/max. For lower frequencies, ensure slew rate > 396 V/µs.  
−10 dBm/0 dBm min/max.  
0.5/4.0  
1.0/4.0  
GHz min/max  
GHz min/max  
REFERENCE CHARACTERISTICS  
REFIN Input Frequency1  
See Figure 17 for input circuit.  
For f < 10 MHz, use a dc-coupled, CMOS compatible square wave, slew rate >  
21 V/µs.  
10/250  
MHz min/max  
REFIN Input Sensitivity  
0.7/AVDD  
V p-p  
min/max  
AC-coupled.  
0 to AVDD  
10  
100  
V max  
pF max  
µA max  
CMOS compatible.  
REFIN Input Capacitance  
REFIN Input Current  
PHASE DETECTOR  
Phase Detector Frequency2  
CHARGE PUMP  
32  
MHz max  
ICP Sink/Source  
High Value  
Low Value  
Absolute Accuracy  
RSET Range  
ICP Three-State Leakage Current  
Matching  
ICP vs. VCP  
ICP vs. Temperature  
LOGIC INPUTS  
Programmable. See Table 5.  
With RSET = 5.1 kΩ.  
5
mA typ  
µA typ  
% typ  
kΩ min/max  
nA typ  
% typ  
312.5  
2.5  
1.5/10  
1
2
2
2
With RSET = 5.1 kΩ.  
Sink and source current.  
0.5 V < VCP < VP – 0.5.  
0.5 V < VCP < VP – 0.5.  
VCP = VP/2.  
% typ  
% typ  
VINH, Input High Voltage  
VINL, Input Low Voltage  
IINH/IINL, Input Current  
CIN, Input Capacitance  
LOGIC OUTPUTS  
VOH, Output High Voltage  
VOL, Output Low Voltage  
POWER SUPPLIES  
AVDD  
1.4  
0.6  
1
V min  
V max  
µA max  
pF max  
10  
1.4  
0.4  
V min  
V max  
Open-drain 1 kΩ pull-up to 1.8 V.  
IOL = 500 µA.  
2.7/3.3  
AVDD  
AVDD/5.5  
24  
V min/V max  
DVDD, SDVDD  
VP  
IDD  
V min/V max  
mA max  
3
20 mA typical.  
Low Power Sleep Mode  
NOISE CHARACTERISTICS  
Phase Noise Figure of Merit4  
ADF4154 Phase Noise Floor5  
1
µA typ  
−213  
−143  
−139  
dBc/Hz typ  
dBc/Hz typ  
dBc/Hz typ  
@ 10 MHz PFD frequency.  
@ 26 MHz PFD frequency.  
@ VCO output.  
Phase Noise Performance6  
1750 MHz Output7  
−102  
dBc/Hz typ  
@ 1 kHz offset, 26 MHz PFD frequency.  
1 Use a square wave for frequencies below fMIN  
.
2 Guaranteed by design. Sample tested to ensure compliance.  
3 AC coupling ensures AVDD/2 bias. See Figure 17 for typical circuit.  
4 This figure can be used to calculate phase noise for any application. Use the formula –213 + 10log(fPFD) + 20logN to calculate in-band phase noise performance, as seen  
at the VCO output. The value given is the lowest noise mode.  
5 The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20logN (where N is the N-divider value).  
The value given is the lowest noise mode.  
6 The phase noise is measured with the EVAL-ADF4154EB1 evaluation board and the HP8562E spectrum analyzer.  
7 fREFIN = 26 MHz; fPFD = 26 MHz; offset frequency = 1 kHz; RFOUT = 1750 MHz; loop B/W = 20 kHz; lowest noise mode.  
Rev. 0 | Page 3 of 20  
 
 
 
 
 
 
 
 
ADF4154  
TIMING CHARACTERISTICS  
Table 2. AVDD = DVDD = SDVDD = 2.7 V to 3.3 V; VP = AVDD to 5.5 V; AGND = DGND = 0 V; TA = TMIN to TMAX, unless otherwise  
noted; dBm referred to 50 Ω.  
Parameter1  
Limit at TMIN to TMAX (B Version)  
Unit  
Test Conditions/Comments  
t1  
t2  
t3  
t4  
t5  
t6  
t7  
20  
10  
10  
25  
25  
10  
20  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
LE Setup Time  
DATA to CLOCK Setup Time  
DATA to CLOCK Hold Time  
CLOCK High Duration  
CLOCK Low Duration  
CLOCK to LE Setup Time  
LE Pulse Width  
1 Guaranteed by design, but not production tested.  
t4  
t5  
CLOCK  
t2  
t3  
DB1  
DB0 (LSB)  
(CONTROL BIT C1)  
DB23 (MSB)  
DB22  
DB2  
DATA  
LE  
(CONTROL BIT C2)  
t7  
t1  
t6  
LE  
Figure 2. Timing Diagram  
Rev. 0 | Page 4 of 20  
 
 
ADF4154  
ABSOLUTE MAXIMUM RATINGS  
Table 3. Absolute Maximum Ratings.1, 2, 3 TA = 25°C, unless  
otherwise noted.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those listed in the operational sections  
of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
VDD to GND  
−0.3 V to +4 V  
VDD to VDD  
VP to GND  
VP to VDD  
Digital I/O Voltage to GND  
Analog I/O Voltage to GND  
REFIN, RFIN to GND  
−0.3 V to +0.3 V  
−0.3 V to +5.8 V  
−0.3 V to +5.8 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
1 This device is a high performance RF integrated circuit with an ESD rating of  
< 2 kV, and it is ESD sensitive. Proper precautions should be taken for  
handling and assembly.  
Operating Temperature Range  
Industrial (B Version)  
Storage Temperature Range  
Maximum Junction Temperature  
TSSOP θJA Thermal Impedance  
2 GND = AGND = DGND = 0 V.  
−40°C to +85°C  
−65°C to +150°C  
150°C  
150.4°C/W  
122°C/W  
3 VDD = AVDD = DVDD = SDVDD  
.
LFCSP θJA Thermal Impedance  
(Paddle Soldered)  
LFCSP θJA Thermal Impedance  
(Paddle Not Soldered)  
216°C/W  
Lead Temperature, Soldering  
Vapor Phase (60 sec)  
Infrared  
215°C  
220°C  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. 0 | Page 5 of 20  
 
 
 
 
ADF4154  
PIN CONFIGURATION AND PIN FUNCTION DESCRIPTIONS  
R
1
2
3
4
5
6
7
8
16  
V
P
SET  
CP  
15 DV  
DD  
CPGND  
AGND  
14 MUXOUT  
13 LE  
ADF4154  
15 MUXOUT  
14 LE  
13 DATA  
CPGND  
AGND  
AGND  
1
2
3
4
5
PIN 1  
INDICATOR  
TOP VIEW  
RF  
RF  
B
A
12 DATA  
11 CLK  
IN  
(Not to Scale)  
ADF4154  
12 CLK  
TOP VIEW  
RF  
RF  
B
A
IN  
IN  
IN  
11 SDV  
DD  
AV  
10 SDV  
DD  
DD  
REF  
9
DGND  
IN  
Figure 3. TSSOP Pin Configuration  
Figure 4. LFCSP Pin Configuration  
Table 4. Pin Function Descriptions  
TSSOP  
LFCSP  
Mnemonic Description  
1
19  
RSET  
Connecting a resistor between this pin and ground sets the maximum charge pump output current.  
The relationship between ICP and RSET is  
25.5  
RSET  
ICP max  
=
where RSET = 5.1 kΩ and ICPmax = 5 mA.  
2
20  
CP  
Charge Pump Output. When enabled, this provides ICP to the external loop filter, which in turn drives  
the external VCO.  
3
4
5
1
2, 3  
4
CPGND  
AGND  
RFINB  
Charge Pump Ground. This is the ground return path for the charge pump.  
Analog Ground. This is the ground return path of the prescaler.  
Complementary Input to the RF Prescaler. This point should be decoupled to the ground plane with a  
small bypass capacitor, typically 100 pF (see Figure 18).  
6
7
5
6, 7  
RFINA  
AVDD  
Input to the RF Prescaler. This small-signal input is normally ac-coupled from the VCO.  
Positive Power Supply for the RF Section. Decoupling capacitors to the digital ground plane should be  
placed as close as possible to this pin. AVDD has a value of 3 V 10%. AVDD must have the same voltage  
as DVDD  
.
8
8
REFIN  
Reference Input. This is a CMOS input with a nominal threshold of VDD/2 and an equivalent input  
resistance of 100 kΩ (see Figure 17). This input can be driven from a TTL or CMOS crystal oscillator, or it  
can be ac-coupled.  
9
10  
9, 10  
11  
DGND  
SDVDD  
Digital Ground.  
Σ-∆ Power. Decoupling capacitors to the digital ground plane should be placed as close as possible to  
this pin. SDVDD has a value of 3 V 10%. SDVDD must have the same voltage as DVDD  
.
11  
12  
13  
14  
15  
12  
CLK  
Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched  
into the shift register on the CLK rising edge. This input is a high impedance CMOS input.  
Serial Data Input. The serial data is loaded MSB first with the two LSBs as the control bits. This input is a  
high impedance CMOS input.  
Load Enable, CMOS Input. When LE is high, the data stored in the shift registers is loaded into one of  
the four latches, the latch being selected using the control bits.  
This multiplexer output allows either the RF lock detect, the scaled RF, or the scaled reference  
frequency to be accessed externally.  
13  
DATA  
LE  
14  
15  
MUXOUT  
DVDD  
16, 17  
Positive Power Supply for the Digital Section. Decoupling capacitors to the digital ground plane should  
be placed as close as possible to this pin. DVDD has a value of 3 V 10%. DVDD must have the same  
voltage as AVDD  
.
16  
18  
VP  
Charge Pump Power Supply. This should be greater than or equal to VDD. In systems where VDD is 3 V, it  
can be set to 5.5 V and used to drive a VCO with a tuning range of up to 5.5 V.  
Rev. 0 | Page 6 of 20  
 
ADF4154  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 5 to Figure 10, and Figure 12: RFOUT = 1.722 GHz, PFD Frequency = 26 MHz, INT = 66, Channel Spacing = 200 kHz,  
Modulus = 130, Fraction = 30/130, and ICP = 5 mA.  
Loop Bandwidth = 20 kHz, Reference = 26 MHz, VCO = Vari-L VCO190-1750T, Evaluation Board = EVAL-ADF4154EB1. Measurements  
were taken on the HP8562E spectrum analyzer.  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
V
= 3V, V = 5V  
P
DD  
= 5mA  
V
I
= 3V, V = 5V  
P
DD  
= 5mA  
CP  
I
CP  
REFERENCE  
LEVEL = –4.2dBm  
REFERENCE  
LEVEL = –4dBm  
PFD FREQUENCY = 26MHz  
CHANNEL STEP = 200kHz  
LOOP BANDWIDTH = 20kHz  
LOWEST NOISE MODE  
N = 66 30/130  
PFD FREQUENCY = 26MHz  
CHANNEL STEP = 200kHz  
LOOP BANDWIDTH = 20kHz  
LOWEST NOISE MODE  
N = 66 30/130  
RBW = 10Hz  
RBW = 10Hz  
–71dBc@200kHz  
–102dBc/Hz  
–400kHz  
–200kHz  
1.722GHz  
200kHz  
400kHz  
–2kHz  
–1kHz  
1.722GHz  
1kHz  
2kHz  
Figure 5. Phase Noise (Lowest Noise Mode)  
Figure 8. Spurs (Lowest Noise Mode)  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
V
= 3V, V = 5V  
P
DD  
= 5mA  
V
I
= 3V, V = 5V  
P
DD  
= 5mA  
I
CP  
REFERENCE  
LEVEL = –4.2dBm  
REFERENCE  
LEVEL = –4.2dBm  
CP  
PFD FREQUENCY = 26MHz  
CHANNEL STEP = 200kHz  
LOOP BANDWIDTH = 20kHz  
LOW NOISE AND  
PFD FREQUENCY = 26MHz  
CHANNEL STEP = 200kHz  
LOOP BANDWIDTH = 20kHz  
LOW NOISE AND  
SPUR MODE  
SPUR MODE  
N = 66 30/130  
RBW = 10Hz  
N = 66 30/130  
RBW = 10Hz  
–74dBc@200kHz  
–95dBc/Hz  
–90  
–100  
–2kHz  
–1kHz  
1.722GHz  
1kHz  
2kHz  
–400kHz  
–200kHz  
1.722GHz  
200kHz  
400kHz  
Figure 6. Phase Noise (Low Noise Mode and Spur Mode)  
Figure 9. Spurs (Low Noise and Spur Mode)  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
V
= 3V, V = 5V  
P
DD  
I = 5mA  
CP  
V
I
= 3V, V = 5V  
P
DD  
= 5mA  
REFERENCE  
LEVEL = –4.2dBm  
REFERENCE  
LEVEL = –4.2dBm  
CP  
PFD FREQUENCY = 26MHz  
CHANNEL STEP = 200kHz  
LOOP BANDWIDTH = 20kHz  
LOWEST SPUR NOISE  
N = 66 30/130  
PFD FREQUENCY = 26MHz  
CHANNEL STEP = 200kHz  
LOOP BANDWIDTH = 20kHz  
LOWEST SPUR MODE  
N = 66 30/130  
RBW = 10Hz  
RBW = 10Hz  
–90dBc/Hz  
–2kHz  
–1kHz  
1.722GHz  
1kHz  
2kHz  
–400kHz  
–200kHz  
1.722GHz  
200kHz  
400kHz  
Figure 7. Phase Noise (Lowest Spur Mode)  
Figure 10. Spurs (Lowest Spur Mode)  
Rev. 0 | Page 7 of 20  
 
 
 
ADF4154  
–130  
–80  
–85  
–140  
–150  
–160  
–90  
–95  
–100  
–105  
–110  
–170  
100  
0
5
10  
15  
20  
25  
30  
35  
1000  
10000  
100000  
R
VALUE (k)  
SET  
PHASE DETECTOR FREQUENCY (kHz)  
Figure 11. PFD Noise Floor vs. PFD Frequency (Lowest Noise Mode)  
Figure 14. Phase Noise vs. RSET  
5
–90  
–92  
–94  
–96  
0
–5  
–10  
–15  
–20  
–25  
–30  
–35  
P = 4/5  
–98  
–100  
P = 8/9  
–102  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
–104  
–60  
–40  
–20  
0
20  
40  
60  
80  
100  
FREQUENCY (GHz)  
TEMPERATURE(°C)  
Figure 12. RF Input Sensitivity  
Figure 15. Phase Noise vs. Temperature  
6
5
1.700  
1.696  
1.692  
1.688  
1.684  
1.680  
1.676  
1.672  
1.668  
1.664  
1.660  
1.656  
1.652  
1.648  
1.644  
1.640  
4
3
A
2
1
B
0
–1  
–2  
–3  
–4  
–5  
–6  
0
1
2
3
4
5
0
10  
20  
30  
40  
50  
60  
65  
75  
85  
95 100  
V
(V)  
CP  
TIME (µs)  
Figure 16. A) Lock Time in Fast-lock Mode. Fast Counter = 150, Low Spur  
Mode: a 1649.7 MHz to 1686.8 MHz Frequency Jump.  
Figure 13. Charge Pump Output Characteristics  
Final Loop Bandwidth = 60 kHz  
B) Lock Time with the PLL in Normal Mode (Non Fast-lock), Low Spur Mode, a  
1649.7 MHz to 1686.8 MHz Frequency Jump. Final Loop Bandwidth = 60 kHz  
Rev. 0 | Page 8 of 20  
ADF4154  
CIRCUIT DESCRIPTION  
REFERENCE INPUT SECTION  
FPFD = REFIN  
where:  
×
(
1 + D  
)
R
(2)  
The reference input stage is shown in Figure 17. SW1 and SW2  
are normally closed switches. SW3 is normally open. When  
power-down is initiated, SW3 is closed and SW1 and SW2 are  
opened. This ensures that the REFIN pin is not loaded on  
power-down.  
REFIN is the reference input frequency.  
D is the REFIN doubler bit.  
R is the preset divide ratio of binary 4-bit programmable  
reference counter (1 to 15).  
INT is the preset divide ratio of binary 9-bit counter (31 to 511).  
MOD is the preset modulus ratio of binary 12-bit program-  
mable FRAC counter (2 to 4095).  
FRAC is the preset fractional ratio of binary 12-bit  
programmable FRAC counter (0 to MOD).  
POWER-DOWN  
CONTROL  
100k  
SW2  
NC  
TO R COUNTER  
REF  
IN  
NC  
BUFFER  
SW1  
NO  
SW3  
RF R COUNTER  
Figure 17. Reference Input Stage  
The 4-bit RF R counter allows the input reference frequency  
(REFIN) to be divided down to produce the reference clock to  
the PFD. Division ratios from 1 to 15 are allowed.  
RF INPUT STAGE  
The RF input stage is shown in Figure 18. It is followed by a  
2-stage limiting amplifier to generate the current mode logic  
(CML) clock levels needed for the prescaler.  
RF N-DIVIDER  
N = INT + FRAC/MOD  
FROM RF  
INPUT STAGE  
TO PFD  
N COUNTER  
1.6V  
BIAS  
GENERATOR  
THIRD ORDER  
FRACTIONAL  
INTERPOLATOR  
AV  
DD  
2k  
2kΩ  
INT  
REG  
MOD  
REG  
FRAC  
VALUE  
RF  
RF  
A
B
IN  
Figure 19. A and B Counters  
IN  
PHASE FREQUENCY DETECTOR (PFD) AND  
CHARGE PUMP  
The PFD takes inputs from the R counter and N counter and  
produces an output proportional to the phase and frequency  
difference between them. Figure 20 is a simplified schematic.  
The PFD includes a fixed delay element that sets the width of  
the antibacklash pulse, which is typically 3 ns. This pulse  
ensures that there is no dead zone in the PFD transfer function  
AGND  
Figure 18. RF Input Stage  
RF INT DIVIDER  
The RF INT CMOS counter allows a division ratio in the PLL  
feedback counter. Division ratios from 31 to 511 are allowed.  
and gives a consistent reference spur level.  
UP  
HI  
D1  
Q1  
U1  
CLR1  
INT, FRAC, MOD, AND R RELATIONSHIP  
+IN  
The INT, FRAC, and MOD values, in conjunction with the  
R counter, make it possible to generate output frequencies that  
are spaced by fractions of the phase frequency detector (PFD).  
See the RF Synthesizer: A Worked Example section for more  
information. The RF VCO frequency (RFOUT) equation is  
CHARGE  
PUMP  
CP  
U3  
DELAY  
DOWN  
CLR2  
D2 Q2  
(
(
))  
RFOUT = FPFD × INT + FRAC MOD  
(1)  
HI  
U2  
where RFOUT is the output frequency of the external voltage  
–IN  
controlled oscillator (VCO).  
Figure 20. PFD Simplified Schematic  
Rev. 0 | Page 9 of 20  
 
 
 
 
ADF4154  
Data is transferred from the shift register to one of four latches  
on the rising edge of LE. The destination latch is determined by  
the state of the two control bits (C2 and C1) in the shift register.  
These are the 2 LSBs, DB1, and DB0, as shown in Figure 2. The  
truth table for these bits is shown in Table 5. Table 6 shows a  
summary of how the latches are programmed.  
MUXOUT AND LOCK DETECT  
The output multiplexer on the ADF4154 allows the user to  
access various internal points on the chip. The state of  
MUXOUT is controlled by M3, M2, and M1 (see Table 9).  
Figure 21 shows the MUXOUT section in block diagram form.  
The N-channel, open-drain, analog lock detect should be  
operated with an external pull-up resistor of 10 kΩ nominal.  
When lock has been detected, the lock detect is high with  
narrow low-going pulses.  
PROGRAM MODES  
Table 5 through Table 10 show how to set up the program  
modes in the ADF4154.  
DV  
DD  
The ADF4154 programmable modulus is double-buffered. This  
means that two events have to occur before the part uses a new  
modulus value. First, the new modulus value is latched into the  
device by writing to the R-divider register. Second, a new write  
must be performed on the N-divider register. Therefore, when-  
ever the modulus value is updated, the N-divider register must  
then be written to so that the modulus value is loaded correctly.  
LOGIC LOW  
ANALOG LOCK DETECT  
R-DIVIDER OUTPUT  
N-DIVIDER OUTPUT  
FAST-LOCK CONTROL  
THREE-STATE OUTPUT  
DIGITAL LOCK DETECT  
LOGIC HIGH  
MUXOUT  
MUX  
CONTROL  
Table 5. C2 and C1 Truth Table  
Control Bits  
DGND  
C2  
0
0
1
1
C1  
0
1
0
1
Data Latch  
Figure 21. MUXOUT Schematic  
N-divider register  
R-divider register  
Control register  
Noise and spur register  
INPUT SHIFT REGISTERS  
The ADF4154 digital section includes a 4-bit RF R counter, a  
9-bit RF N counter, a 12-bit FRAC counter, and a 12-bit  
modulus counter. Data is clocked into the 24-bit shift register  
on each rising edge of CLK. The data is clocked in MSB first.  
Rev. 0 | Page 10 of 20  
 
 
 
ADF4154  
REGISTERS  
Table 6. Register Summary  
N-DIVIDER REG  
CONTROL  
BITS  
9-BIT RF INTEGER VALUE  
12-BIT RF FRACTIONAL VALUE  
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10  
DB9 DB8  
F8 F7  
DB7  
F6  
DB6  
F5  
DB5  
F4  
DB4 DB3 DB2  
F3 F2 F1  
DB1  
DB0  
FL1  
N9  
N8  
N7  
N6  
N5  
N4  
N3  
N2  
N1  
F12  
F11  
F10  
F9  
C2 (0) C1 (0)  
R-DIVIDER REG  
4-BIT  
R COUNTER  
CONTROL  
BITS  
MUXOUT  
12-BIT MODULUS  
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9  
DB8  
M7  
DB7  
M6  
DB6  
M5  
DB5  
M4  
DB4 DB3 DB2  
DB1 DB0  
P3  
M3  
M2  
M1  
P2  
P1  
R4  
R3  
R2  
R1  
M12  
M11  
M10  
M9  
M8  
M3  
M2  
M1  
C2 (0) C1 (1)  
CONTROL REG  
CP CURRENT  
SETTING  
CONTROL  
BITS  
RESERVED  
DB15 DB14 DB13 DB12 DB11 DB10  
DB9  
CP2  
DB8  
CP1  
DB7  
CP0  
DB6  
U5  
DB5  
U4  
DB4  
U3  
DB3  
U2  
DB2  
U1  
DB1  
DB0  
0
0
0
0
U6  
CP3  
C2 (1) C1 (0)  
NOISE AND SPUR REG  
CONTROL  
BITS  
NOISE AND SPUR  
MODE  
RESERVED  
DB10  
T9  
DB9  
T8  
DB8  
T7  
DB7 DB6 DB5  
T6 T5 T4  
DB4  
T3  
DB3  
T2  
DB2  
T1  
DB1 DB0  
C2 (1) C1 (1)  
Table 7. Noise and Spur Register  
NOISE AND SPUR  
MODE  
CONTROL  
BITS  
RESERVED  
DB10  
T9  
DB9  
T8  
DB8  
T7  
DB7  
T6  
DB6  
T5  
DB5  
T4  
DB4  
T3  
DB3  
T2  
DB2  
T1  
DB1  
DB0  
C2 (1) C1 (1)  
DB10, DB5, DB4, DB3  
0
RESERVED  
RESERVED  
THESE BITS MUST BE SET TO 0  
FOR NORMAL OPERATION.  
DB9, DB8, DB7, DB6, DB2 NOISE AND SPUR SETTING  
00000  
11100  
11111  
LOWEST SPUR MODE  
LOW NOISE AND SPUR MODE  
LOWEST NOISE MODE  
Rev. 0 | Page 11 of 20  
 
 
ADF4154  
Table 8. N-Divider Register Map  
CONTROL  
BITS  
9-BIT INTEGER VALUE (INT)  
12-BIT FRACTIONAL VALUE (FRAC)  
DB23 DB22  
N9  
DB21  
N8  
DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9  
DB8  
F7  
DB7  
F6  
DB6  
F5  
DB5  
F4  
DB4 DB3 DB2  
F3 F2 F1  
DB1  
DB0  
N7  
N6  
N5  
N4  
N3  
N2  
N1  
C2 (0) C1 (0)  
FL1  
F8  
F12  
F11  
F10  
F9  
F12  
F11  
F10  
F3  
F2  
F1  
FRACTIONAL VALUE (FRAC)  
0
0
0
0
.
.
.
1
1
1
1
0
0
0
0
.
.
.
1
1
1
1
0
0
0
0
.
.
.
1
1
1
1
..........  
0
0
0
0
.
.
.
1
1
1
1
0
0
1
1
.
.
.
0
0
1
1
0
1
0
1
.
.
.
0
1
0
1
0
1
2
3
.
.
.
4092  
4093  
4094  
4095  
..........  
..........  
..........  
..........  
..........  
..........  
..........  
..........  
..........  
..........  
N9  
N8  
N7  
N6  
N5  
N4  
N3  
N2  
N1  
INTEGER VALUE (INT)  
0
0
0
0
.
0
0
0
0
.
0
0
0
0
.
0
1
1
1
.
1
0
0
0
.
1
0
0
0
.
1
0
0
0
.
1
0
0
1
.
1
0
1
0
.
31  
32  
33  
34  
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
...  
1
1
1
.
.
.
.
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
0
1
509  
510  
511  
FL1  
FAST-LOCK  
0
1
NORMAL OPERATION  
FAST-LOCK ENABLED  
Rev. 0 | Page 12 of 20  
 
ADF4154  
Table 9. R-Divider Register Map  
CONTROL  
BITS  
MUXOUT  
4-BIT R COUNTER  
12-BIT INTERPOLATOR MODULUS VALUE (MOD)  
DB23 DB22 DB21  
DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8  
DB7 DB6 DB5 DB4 DB3 DB2  
M6 M5 M4 M3 M2 M1  
DB1  
DB0  
DB20 DB19  
M1 P2  
M3  
M2  
P1  
R4  
R3  
R2  
R1  
M12  
M11  
M10  
M9  
M8  
M7  
P3  
C2 (0) C1 (1)  
P3 LOAD CONTROL  
P1  
PRESCALER  
INTERPOLATOR  
M12  
M11  
M10  
M3  
M2  
M1  
MODULUS VALUE (MOD)  
0
1
NORMAL OPERATION  
LOAD FAST-LOCK TIMER  
0
1
4/5  
8/9  
0
0
0
.
.
.
1
1
1
1
0
0
0
.
.
.
1
1
1
1
0
0
0
.
.
.
1
1
1
1
..........  
..........  
..........  
..........  
..........  
..........  
..........  
..........  
..........  
..........  
0
0
1
.
.
.
1
1
1
1
1
1
0
.
.
.
0
0
1
1
0
1
0
.
.
.
0
1
0
1
2
3
4
.
.
.
4092  
4093  
4094  
4095  
RF R-COUNTER  
DIVIDE RATIO  
R4  
R3  
R2  
R1  
0
0
0
0
.
0
0
0
1
.
0
1
1
0
.
1
0
1
0
.
1
2
3
4
.
.
.
.
.
.
.
.
.
.
.
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
12  
13  
14  
15  
M3  
M2  
M1  
MUXOUT  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
THREE-STATE OUTPUT  
DIGITAL LOCK DETECT  
ANALOG LOCK DETECT  
N-DIVIDER OUTPUT  
LOGIC HIGH  
LOGIC LOW  
R-DIVIDER OUTPUT  
FAST-LOCK SWITCH  
Rev. 0 | Page 13 of 20  
 
ADF4154  
Table 10. Control Register Map  
CP CURRENT  
SETTING  
CONTROL  
BITS  
RESERVED  
DB15 DB14 DB13 DB12 DB11 DB10 DB9  
U6 CP3 CP2  
DB8  
CP1  
DB7  
CP0  
DB6  
U5  
DB5  
U4  
DB4  
U3  
DB3 DB2  
U2 U1  
DB1  
DB0  
0
0
0
0
C2 (1) C1 (0)  
REFERENCE  
DOUBLER  
U6  
0
1
DISABLED  
ENABLED  
U1  
COUNTER RESET  
0
1
DISABLED  
ENABLED  
U2  
CP THREE-STATE  
0
1
DISABLED  
THREE-STATE  
U3  
POWER-DOWN  
0
1
NORMAL OPERATION  
POWER-DOWN  
I
(mA)  
CP  
÷3  
CP0  
CP1  
CP0  
2.700k  
5.100k10.00kΩ  
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1.090  
2.180  
3.260  
4.350  
5.440  
6.530  
7.620  
8.700  
0.630  
1.250  
1.880  
2.500  
3.130  
3.750  
4.380  
5.000  
0.290  
0.590  
0.880  
1.150  
1.470  
1.760  
2.060  
2.350  
U4  
LDP  
0
1
3
5
U5  
PD POLARITY  
0
1
NEGATIVE  
POSITIVE  
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0.540  
1.100  
1.640  
2.180  
2.730  
3.270  
3.810  
4.350  
0.310  
0.630  
0.940  
1.250  
1.570  
1.880  
2.190  
2.500  
0.150  
0.300  
0.440  
0.588  
0.740  
0.880  
1.030  
1.180  
Rev. 0 | Page 14 of 20  
 
ADF4154  
Prescaler (P/P + 1)  
REGISTER DEFINITION  
N-Divider Register, R0  
The dual-modulus prescaler (P/P + 1), along with the INT,  
FRAC, and MOD counters, determines the overall division ratio  
from the RFIN to the PFD input. Operating at CML levels, it  
takes the clock from the RF input stage and divides it down for  
the counters. It is based on a synchronous 4/5 core. When set to  
4/5, the maximum RF frequency allowed is 2 GHz. Therefore,  
when operating the ADF4154 above 2 GHz, this must be set to  
8/9. The prescaler limits the INT value.  
The on-chip N-divider register is programmed by setting  
R0[1, 0] to [0, 0]. Table 8 shows the input data format for  
programming this register.  
9-Bit INT Value  
These nine bits control what is loaded as the INT value. This is  
used to determine the overall feedback division factor (see  
Equation 1).  
With P = 4/5, NMIN = 31.  
With P = 8/9, NMIN = 91.  
12-Bit FRAC Value  
These 12 bits control what is loaded as the FRAC value into the  
fractional interpolator. This value helps determine the overall  
feedback division factor (see Equation 1). The FRAC value must  
be less than the value loaded into the MOD register.  
The prescaler can also influence the phase noise performance. If  
INT < 91, a prescaler of 4/5 should be used. For applications  
where INT > 91, P = 8/9 should be used for optimum noise  
performance (see Table 9).  
Fast-Lock  
4-Bit RF R Counter  
Setting the part to logic high enables fast-lock mode. To use  
fast-lock, the required time value for wide bandwidth mode  
needs to be loaded into the R-divider register.  
The 4-bit RF R counter allows the input reference frequency  
(REFIN) to be divided down to produce the reference clock to  
the phase frequency detector (PFD). Division ratios from 1 to  
15 are allowed.  
The charge pump current increases from 16× the minimum  
current and reverts back to 1× the minimum current once the  
time value loaded has expired.  
12-Bit Interpolator Modulus/Fast-Lock Timer  
Bits DB13–DB2 have two functions depending on the value of  
the load control bit: modulus or fast lock timer value.  
See the Fast-Lock Timer and Register Sequences section for  
more information.  
When the load control bit = 0 (DB23), the required modulus  
may be programmed into the R-divider register (DB13–DB2).  
R-DIVIDER REGISTER, R1  
The on-chip R-divider register is programmed by setting  
R1[1, 0] to [0, 1]. Table 9 shows the input data format for  
programming this register.  
When the load control bit = 1 (DB23), the required fast-lock  
timer value may be programmed into the R-divider register  
(DB13–DB2).  
Load Control  
This programmable register sets the fractional modulus, which  
is the ratio of the PFD frequency to the channel step resolution  
on the RF output. Refer to the RF Synthesizer: A Worked  
Example section for more information.  
When set to logic high, the value being programmed in the  
modulus is not loaded into the modulus. Instead, it sets the fast-  
lock timer. The value of the fast-lock timer/FPFD is the amount  
of time the PLL stays in wide bandwidth mode.  
The ADF4154 programmable modulus is double-buffered. This  
means that two events must occur before the part uses a new  
modulus value. First, the new modulus value is latched into the  
device by writing to the R-divider register. Second, a new write  
must be performed on the N-divider register. Therefore, when-  
ever the modulus value is updated, the N-divider register must  
be written to so that the modulus value is loaded correctly.  
MUXOUT  
The on-chip multiplexer is controlled by R1[22...20] on the  
ADF4154. Table 9 shows the truth table.  
Digital Lock Detect  
The digital lock detect output goes high if there are 40  
successive PFD cycles with an input error of less than 15 ns. It  
stays high until a new channel is programmed or until the error  
at the PFD input exceeds 30 ns for one or more cycles. If the  
loop bandwidth is narrow compared to the PFD frequency, the  
error at the PFD inputs may drop below 15 ns for 40 cycles  
around a cycle slip. Therefore, the digital lock detect may go  
falsely high for a short period until the error again exceeds  
30 ns. In this case, the digital lock detect is reliable only as a  
loss-of-lock detector.  
CONTROL REGISTER, R2  
The on-chip control register is programmed by setting R2[1, 0]  
to [0, 1]. Table 10 shows the input data format for programming  
this register.  
RF Counter Reset  
DB3 is the RF counter reset bit for the ADF4154. When this is 1,  
the RF synthesizer counters are held in reset. For normal  
operation, this bit should be 0.  
Rev. 0 | Page 15 of 20  
 
ADF4154  
RF Charge Pump Three-State  
NOISE AND SPUR REGISTER, R3  
This bit puts the charge pump into three-state mode when  
programmed to 1. It should be set to 0 for normal operation.  
The on-chip noise and spur register is programmed by setting  
R3[1, 0] to [1, 1]. Table 7 shows the input data format for  
programming this register.  
RF Power-Down  
Noise and Spur Mode  
DB4 on the ADF4154 provides the programmable power-down  
mode. Setting Bit DB4 to 1 powers down the device. Setting  
Bit DB4 to 0 returns the synthesizer to normal operation. While  
in software power-down mode, the part retains all information  
in its registers. Only when supplies are removed are the register  
contents lost.  
Noise and spur mode allows the user to optimize a design either  
for improved spurious performance or for improved phase  
noise performance. When the lowest spur setting is chosen,  
dither is enabled. This randomizes the fractional quantization  
noise so that it looks more like white noise rather than spurious  
noise. This means that the part is optimized for improved  
spurious performance. This operation would normally be used  
when the PLL closed-loop bandwidth is wide for fast-locking  
applications. A wide-loop bandwidth is seen as a loop  
bandwidth greater than 1/10 of the RFOUT channel step  
resolution (fRES). A wide-loop filter does not attenuate the spurs  
to a level that a narrow-loop bandwidth would. When the low  
noise and spur setting is enabled, dither is disabled. This  
optimizes the synthesizer to operate with improved noise  
performance. However, the spurious performance is degraded  
in this mode compared to the lowest spurs setting. To further  
improve noise performance, the lowest noise setting option can  
be used, which reduces the phase noise. As well as disabling the  
dither, it ensures that the charge pump operates in an optimum  
region for noise performance. This setting is extremely useful  
where a narrow-loop filter bandwidth is available. The  
synthesizer ensures extremely low noise and the filter attenuates  
the spurs. The typical performance characteristics give the user  
an idea of the trade-off in a typical WCDMA setup for the  
different noise and spur settings.  
When a power-down is activated, the following events occur:  
1. All active dc current paths are removed.  
2. The synthesizer counters are forced to their load  
state conditions.  
3. The charge pump is forced into three-state mode.  
4. The digital lock detect circuitry is reset.  
5. The RFIN input is de-biased.  
6. The input register remains active and capable of loading  
and latching data.  
Lock Detect Precision (LDP)  
When the LDP bit is programmed to 0, 24 consecutive reference  
cycles of 15 ns must occur before the digital lock detect is set.  
When this bit is programmed to 1, 40 consecutive reference  
cycles of 15 ns must occur before digital lock detect is set.  
Phase Detector Polarity  
DB6 in the ADF4154 sets the phase detector polarity. When the  
VCO characteristics are positive, this should be set to 1. When  
they are negative, it should be set to 0.  
RESERVED BITS  
Charge Pump Current Setting  
These bits should be set to 0 for normal operation.  
DB7, DB8, DB9, and DB10 set the charge pump current, which  
should be set according to the loop filter design (see Table 10).  
RF SYNTHESIZER: A WORKED EXAMPLE  
This equation governs how the synthesizer should be  
programmed.  
REFIN Doubler  
Setting the REFIN bit to 0 feeds the REFIN signal directly to the  
4-bit RF R counter, which disables the doubler. Setting the REFIN  
bit to 1 multiplies the REFIN frequency by a factor of 2 before  
feeding into the 4-bit R counter. When the doubler is disabled,  
the REFIN falling edge is the active edge at the PFD input to the  
fractional synthesizer. When the doubler is enabled, both the  
rising and falling edges of REFIN become active edges at the  
PFD input.  
RFOUT = [INT + (FRAC/MOD)] × [FPFD  
]
(3)  
(4)  
where:  
RFOUT is the RF frequency output.  
INT is the integer division factor.  
FRAC is the fractionality.  
MOD is the modulus.  
FPFD = [REFIN × (1 = D)/R]  
When the doubler is enabled and the lowest spur mode is  
chosen, the in-band phase noise performance is sensitive to the  
REFIN duty cycle. The phase noise degradation can be as much  
as 5 dB for the REFIN duty cycles outside a 45% to 55% range.  
The phase noise is insensitive to the REFIN duty cycle in the  
lowest noise mode and in the lowest noise and spur mode. The  
phase noise is insensitive to the REFIN duty cycle when the  
doubler is disabled.  
where:  
REFIN is the reference frequency input.  
D is the RF REFIN doubler bit.  
R is the RF reference division factor.  
Rev. 0 | Page 16 of 20  
 
ADF4154  
For example, in a GSM 1800 system, where a 1.8 GHz RF  
frequency output (RFOUT) is required, a 13 MHz reference  
frequency input (REFIN) is available and a 200 kHz channel  
resolution (fRES) is required on the RF output.  
resolution. A 13 MHz reference signal could be fed directly to  
the PFD. The modulus would be programmed to 520 when in  
PDC mode (13 MHz/520 = 25 kHz). The modulus would be  
reprogrammed to 65 for GSM 1800 operation (13 MHz/65 =  
200 kHz). It is important that the PFD frequency remains con-  
stant (13 MHz). By keeping the PFD constant, the user can  
design a one-loop filter that can be used in both setups without  
running into stability issues. The ratio of the RF frequency to  
the PFD frequency affects the loop design. Keeping this  
relationship constant instead of changing the modulus factor  
results in a stable filter.  
MOD = REFIN fRES  
MOD =13 MHz 200 kHz = 65  
From Equation 4,  
FPFD = [13 MHz × (1 + 0)/1] = 13 MHz  
(5)  
(6)  
1.8 G =13 MHz × INT + FRAC 65  
(
)
INT =138; FRAC = 30  
SPURIOUS OPTIMIZATION AND FAST-LOCK  
MODULUS  
The ADF4154 can be optimized for low spurious signals by  
using the noise and spur register. However, in order to achieve  
fast-lock time, a wider loop bandwidth is needed. Note that a  
wider loop bandwidth can lead to notable spurious signals,  
which cannot be reduced significantly by the loop filter.  
The choice of modulus (MOD) depends on the reference signal  
(REFIN) available and the channel resolution (fRES) required at  
the RF output. For example, a GSM system with 13 MHz REFIN  
would set the modulus to 65, resulting in the RF output resolu-  
tion (fRES) of 200 kHz (13 MHz/65) that is necessary for GSM.  
Using the fast-lock feature can achieve the same fast-lock time  
as the noise and spur register, but with the advantage of lower  
spurious signals, since the final loop bandwidth is reduced by  
a quarter.  
REFERENCE DOUBLER AND REFERENCE DIVIDER  
The reference doubler on-chip allows the input reference signal  
to be doubled. This is useful for increasing the PFD comparison  
frequency. Making the PFD frequency higher improves the  
noise performance of the system. Doubling the PFD frequency  
usually results in an improvement in noise performance of 3 dB.  
It is important to note that the PFD cannot be operated above  
32 MHz due to a limitation in the speed of the Σ-Δ circuit of  
the N divider.  
FAST-LOCK TIMER AND REGISTER SEQUENCES  
If the fast-lock mode is used, a timer value needs to be loaded  
into the PLL to determine the time of the wide bandwidth.  
When the load control bit = 1, the timer value is loaded via the  
12-bit modulus value. To use fast-lock, the PLL must be written  
to in the following sequence:  
12-BIT PROGRAMMABLE MODULUS  
Unlike most other fractional-N PLLs, the ADF4154 allows the  
user to program the modulus over a 12-bit range. This means  
that the user can set up the part in many different configura-  
tions for the application, when combined with the reference  
doubler and the 4-bit R counter.  
1. Load the R-divider register with DB23 = 1 and the chosen  
fast-lock timer value (DB13–DB2) instead of the modulus.  
Note that the duration of time the PLL remains in wide  
bandwidth is equal to the fast-lock timer/FPFD  
2. Load the noise and spur register.  
3. Load the control register.  
.
For example, consider an application that requires a 1.75 GHz  
RF and a 200 kHz channel step resolution. The system has a  
13 MHz reference signal.  
4. Load R-divider register with DB23 = 0 and MUXOUT =  
110 (DB22–DB20). All the other needed parameters,  
including the modulus, also need to be loaded.  
One possible setup is feeding the 13 MHz directly to the PFD  
and programming the modulus to divide by 65, which would  
result in the required 200 kHz resolution.  
5. Load the N-divider register, including fast-lock = 1  
(DB23), to activate fast-lock mode.  
Another possible setup is using the reference doubler to create  
26 MHz from the 13 MHz input signal. The 26 MHz signal is  
then fed into the PFD, which programs the modulus to divide  
by 130. This setup also results in 200 kHz resolution and offers  
superior phase noise performance over the previous setup.  
Once this procedure is completed, future frequency jumps  
deploying fast-lock need to repeat only Step 5.  
The programmable modulus is also very useful for multi-  
standard applications. If a dual-mode phone requires PDC and  
GSM 1800 standards, the programmable modulus is a huge  
benefit. The PDC requires a 25 kHz channel step resolution,  
whereas the GSM 1800 requires a 200 kHz channel step  
Rev. 0 | Page 17 of 20  
 
 
ADF4154  
If fast-lock is not used, then use the following sequence:  
1. Load the noise and spur register.  
2. Load the control register.  
ADF4154  
R2  
CP  
VCO  
C1  
C2  
R1  
C3  
R1A  
3. Load the R-divider register with DB23 = 0 and other  
MUXOUT  
necessary parameters.  
4. Load the N-divider register, including fast-lock = 0  
Figure 23. Fast-lock Loop Filter Topology—Topology 2  
(DB23) for normal operation.  
SPURIOUS SIGNALS  
Predicting Where They Appear  
To change frequency, only Step 4 need be repeated.  
FAST-LOCK: A WORKED EXAMPLE  
As in integer-N PLLs, spurs appear at PFD frequency offsets  
from the carrier. In a fractional-N PLL, spurs also appear at  
frequencies equal to the RFOUT channel step resolution (fRES).  
The third-order fractional interpolator engine of the ADF4154  
may also introduce subfractional spurs. If the fractional deno-  
minator (MOD) is divisible by 2, spurs appear at ½ fRES. If the  
fractional denominator (MOD) is divisible by 3, spurs appear at  
1/3 fRES. Harmonics of all spurs mentioned also appear. With the  
lowest spur mode enabled, the fractional and subfractional  
spurs are attenuated dramatically. The worst-case spurs appear  
when the fraction is programmed to 1/MOD. For example, in a  
GSM 900 MHz system with a 26 MHz PFD frequency and an  
RFOUT channel step resolution (fRES) of 200 kHz, the MOD = 130.  
PFD spurs appear at 26 MHz offset and fractional spurs appear  
at 200 kHz offset. Since the MOD is divisible by 2, subfractional  
spurs are also present at 100 kHz offset.  
Consider an example in which PLL has reference frequencies of  
13 MHz and FPFD = 13 MHz and a required lock time of 50 µs.  
Therefore, the PLL is set to wide bandwidth for 40 µs.  
If the time period chosen for the wide bandwidth is 40 µs, then  
Fast-lock timer value = time in wide bandwidth × FPFD  
Fast-lock timer value = 40 µs × 13 MHz = 520  
Therefore, 520 has to be loaded into the R-divider register in  
Step 1 of the sequence described in the Fast-Lock Timer and  
Register Sequences section.  
FAST-LOCK: LOOP FILTER TOPOLOGY  
To use fast-lock mode, an extra connection from the PLL to the  
loop filter is needed. The MUXOUT must reduce the damping  
resistor in the loop filter to ¼ while in wide bandwidth mode.  
This is required because the charge pump current is increased  
by 16 while in wide bandwidth mode and stability must be  
ensured. This can be done with the following two topologies:  
FILTER DESIGN—ADISIMPLL  
A filter design and analysis program is available to help the user  
implement the PLL design. Visit www.analog.com/pll for a free  
download of the ADIsimPLL software. The software designs,  
simulates, and analyzes the entire PLL frequency and time  
domain response. Various passive and active filter architectures  
are allowed. Rev. 2 of ADIsimPLL allows analysis of the  
ADF4154.  
1. Divide the damping resistor (R1) into two values (R1 and  
R1A) of ratio 1:3 (see Figure 22).  
2. Use an extra resistor (R1A) and connect it directly from the  
MUXOUT, as shown in Figure 22. The extra resistor must  
be chosen such that the parallel combination of an extra  
resistor and the damping resistor (R1) is reduced to ¼ of  
the original value of R1 alone (see Figure 23).  
INTERFACING  
The ADF4154 has a simple, SPI® compatible serial interface for  
writing to the device. SCLK, SDATA, and LE control the data  
transfer. When LE (latch enable) is high, the 22 bits that have  
been clocked into the input register on each rising edge of  
SCLK are transferred to the appropriate latch. See Figure 2 for  
the timing diagram and Table 5 for the latch truth table.  
ADF4154  
R2  
CP  
VCO  
C1  
C2  
R1  
C3  
MUXOUT  
R1A  
The maximum allowable serial clock rate is 20 MHz. This  
means that the maximum update rate possible for the device is  
909 kHz or one update every 1.1 µs. This is more than adequate  
for systems that have typical lock times in the hundreds of  
microseconds.  
Figure 22 Fast-lock Loop Filter Topology—Topology 1  
Rev. 0 | Page 18 of 20  
 
 
 
ADF4154  
ADuC812 Interface  
ADSP-21xx  
ADF4154  
Figure 24 shows the interface between the ADF4154 and the  
ADuC812 MicroConverter®. Since the ADuC812 is based on an  
8051 core, this interface can be used with any 8051-based  
microcontroller. The MicroConverter is set up for SPI master  
mode with CPHA = 0. To initiate the operation, bring the I/O  
port driving LE low. Each latch of the ADF4154 needs a 24-bit  
word, which is accomplished by writing three 8-bit bytes from  
the MicroConverter to the device. After the third byte is written,  
the LE input should be brought high to complete the transfer.  
SCLK  
SCLOCK  
SDATA  
LE  
DT  
TFS  
MUXOUT  
(LOCK DETECT)  
I/O FLAGS  
Figure 25. ADSP-21xx to ADF4154 Interface  
PCB DESIGN GUIDELINES FOR CHIP SCALE  
PACKAGE  
When operating in the mode described, the maximum  
SCLOCK rate of the ADuC812 is 4 MHz. This means that the  
maximum rate at which the output frequency can be changed is  
180 kHz.  
The lands on the chip scale package (CP-20) are rectangular.  
The printed circuit board pad for these should be 0.1 mm  
longer than the package land length and 0.05 mm wider than  
the package land width. The land should be centered on the pad.  
This ensures that the solder joint size is maximized.  
ADuC812  
ADF4154  
SCLOCK  
SCLK  
MOSI  
SDATA  
LE  
The bottom of the chip scale package has a central thermal pad.  
The thermal pad on the printed circuit board should be at least  
as large as this exposed pad. On the printed circuit board, there  
should be a clearance of at least 0.25 mm between the thermal  
pad and the inner edges of the pad pattern to avoid shorting.  
I/O PORTS  
MUXOUT  
(LOCK DETECT)  
Thermal vias may be used on the printed circuit board thermal  
pad to improve thermal performance of the package. If vias are  
used, they should be incorporated into the thermal pad at  
1.2 mm pitch grid. The via diameter should be between 0.3 mm  
and 0.33 mm, and the via barrel should be plated with 1 oz. of  
copper to plug the via.  
Figure 24. ADuC812 to ADF4154 Interface  
ADSP-2181 Interface  
Figure 25 shows the interface between the ADF4154 and the  
ADSP-21xx digital signal processor. As discussed previously, the  
ADF4154 needs a 24-bit serial word for each latch write. The  
easiest way to accomplish this using the ADSP-21xx family is to  
use the autobuffered transmit mode of operation with alternate  
framing. This provides a means for transmitting an entire block  
of serial data before an interrupt is generated. Set up the word  
length for eight bits and use three memory locations for each  
24-bit word. To program each 24-bit latch, store each of the  
three 8-bit bytes, enable the autobuffered mode, and write to the  
transmit register of the DSP. This last operation initiates the  
autobuffer transfer.  
The user should connect the printed circuit board thermal pad  
to AGND.  
Rev. 0 | Page 19 of 20  
 
 
 
ADF4154  
OUTLINE DIMENSIONS  
5.10  
5.00  
4.90  
16  
9
8
4.50  
4.40  
4.30  
6.40  
BSC  
1
PIN 1  
1.20  
MAX  
0.15  
0.05  
0.20  
0.09  
0.75  
0.60  
0.45  
8°  
0°  
0.30  
0.19  
0.65  
BSC  
SEATING  
PLANE  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-153AB  
Figure 26. 16-Lead Thin Shrink Small Outline Package [TSSOP]  
(RU-16)  
Dimensions shown in millimeters  
0.60  
MAX  
4.0  
BSC SQ  
0.60  
MAX  
16  
15  
20  
1
PIN 1  
INDICATOR  
2.25  
2.10 SQ  
1.95  
3.75  
BSC SQ  
TOP  
VIEW  
BOTTOM  
VIEW  
11  
10  
5
0.75  
0.55  
0.35  
6
0.25 MIN  
0.80 MAX  
0.65 TYP  
0.30  
0.23  
0.18  
12° MAX  
1.00  
0.85  
0.80  
0.05 MAX  
0.02 NOM  
0.20  
REF  
COPLANARITY  
0.08  
SEATING  
PLANE  
0.50  
BSC  
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1  
Figure 27. 20-Lead Lead Frame Chip Scale Package [LFCSP]  
4 mm × 4 mm Body, (CP-20)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model  
ADF4154BRU  
ADF4154BRU-REEL  
ADF4154BRU-REEL7  
ADF4154BCP  
ADF4154BCP-REEL  
ADF4154BCP-REEL7  
EVAL-ADF4154EB1  
Description  
Temperature Range  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
Package Option  
RU-16  
RU-16  
RU-16  
CP-20  
Thin Shrink Small Outline Package (TSSOP)  
Thin Shrink Small Outline Package (TSSOP)  
Thin Shrink Small Outline Package (TSSOP)  
Lead Frame Chip Scale Package (LFCSP)  
Lead Frame Chip Scale Package (LFCSP)  
Lead Frame Chip Scale Package (LFCSP)  
CP-20  
CP-20  
Purchase of licensed I2C components of Analog Devices, Inc. or one of its sublicensed Associated Companies conveys a license for the purchaser under the  
Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips.  
©
2004 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D04833–0–4/04(0)  
Rev. 0 | Page 20 of 20  
 

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