GRM15XR71C103KA86 [ADI]
Tiny I2C Programmable Linear Battery Charger; 微小的I2C可编程线性电池充电器
| 型号： | GRM15XR71C103KA86 |
| 厂家： | 
ADI |
| 描述： | Tiny I2C Programmable Linear Battery Charger |
| 文件： | 总44页 (文件大小：637K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Tiny I2C Programmable Linear Battery Charger
with Power Path and USB Mode Compatibility
Data Sheet
ADP5061
FEATURES
TYPICAL APPLICATION CIRCUIT
2.6 mm × 2 mm WLCSP package
ADP5061
SYSTEM
Fully programmable via I2C
ISO_S
VBUS
VIN
AC OR
USB
CBP
C3
47µF
Flexible digital control inputs
C1
10µF
C2
10nF
Up to 2.1 A current from an ac charger in LDO mode
Operating input voltage from 4.0 V to 6.7 V
Tolerant input voltage from −0.5 V to +20 V (USB VBUS)
Fully compatible with USB 3.0 and USB Battery Charging
Specification 1.2
SCL
SDA
ISO_B
CHARGER
CONTROL
BLOCK
C4
22µF
BAT_SNS
DIG_IO1
DIG_IO2
DIG_IO3
Li-ion
+
THR
Built-in current sensing and limiting
SYS_EN
As low as 30 mΩ battery isolation FET between battery and
charger output
ILED
VLED
AGND
Thermal regulation prevents over heating
Compliant with JEITA 1 and JEITA 2 Li-Ion battery charging
temperature specifications
Figure 1.
SYS_EN flag permits the system to be disabled until battery is at
minimum required level for guaranteed system start-up
APPLICATIONS
Digital still cameras
Digital video cameras
Single cell Li-Ion portable equipment
PDAs, audio, and GPS devices
Portable medical devices
Mobile phones
GENERAL DESCRIPTION
scenario, which allows for immediate system function on connec-
tion to a USB power supply.
The ADP5061 charger is fully compliant with USB 3.0 and the
USB Battery Charging Specification 1.2 and enables charging
via the mini USB VBUS pin from a wall charger, car charger, or
USB host port.
Based on the type of USB source, which is detected by an external
USB detection chip, the ADP5061 can be set to apply the correct
current limit for optimal charging and USB compliance.
The ADP5061 operates from a 4 V to 6.7 V input voltage range
but is tolerant of voltages up to 20 V. The 20 V voltage tolerance
alleviates the concerns about the USB bus spiking during dis-
connect or connect scenarios.
The ADP5061 has three factory programmable digital input/output
pins that provide maximum flexibility for different systems.
These digital input/output pins permit combinations of features
such as, input current limits, charging enable and disable,
charging current limits, and a dedicated interrupt output pin.
The ADP5061 features an internal FET between the linear
charger output and the battery. This permits battery isolation
and, hence, system powering under a dead battery or no battery
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2012 Analog Devices, Inc. All rights reserved.
ADP5061
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Battery Isolation FET................................................................. 20
Battery Detection ....................................................................... 20
Battery Pack Temperature Sensing .......................................... 21
I2C Interface ................................................................................ 25
I2C Register Map......................................................................... 26
Register Bit Descriptions........................................................... 27
Applications Information .............................................................. 35
External Components................................................................ 35
PCB Layout Guidelines.............................................................. 37
Power Dissipation and Thermal Considerations ....................... 38
Charger Power Dissipation ....................................................... 38
Junction Temperature ................................................................ 38
Factory Programmable Options................................................... 39
Charger Options......................................................................... 39
I2C Register Defaults.................................................................. 40
Digital Input and Output Options ........................................... 40
Packaging and Ordering Information ......................................... 42
Outline Dimensions................................................................... 42
Ordering Guide .......................................................................... 42
Applications....................................................................................... 1
Typical Application Circuit ............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Recommended Input and Output Capacitances...................... 6
I2C-Compatible Interface Timing Specifications..................... 6
Absolute Maximum Ratings ....................................................... 7
Thermal Resistance ...................................................................... 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Typical Performance Characteristics ............................................. 9
Temperature Characteristics..................................................... 11
Typical Waveforms ..................................................................... 13
Theory of Operation ...................................................................... 14
Summary of Operation Modes................................................. 14
Introduction ................................................................................ 15
Charger Modes............................................................................ 17
Thermal Management ............................................................... 20
REVISION HISTORY
6/12—Revision 0: Initial Version
Rev. 0 | Page 2 of 44
Data Sheet
ADP5061
SPECIFICATIONS
−40°C < TJ < +125°C, VVIN = 5.0 V, V HOT < VTHR < VCOLD, VBAT_SNS = 3.6 V, VISO_B = VBAT_SNS, CVIN = 10 µF, CISO_S = 22 µF, CISO_B = 22 µF,
C
CBP = 10 nF, all registers at default values, unless otherwise noted.
Table 1.
Parameter
Symbol
VUVLO
ILIM
Min
Typ
Max
Unit Test Conditions/Comments
GENERAL PARAMETERS
Undervoltage Lockout
Hysteresis
1
2.25
50
74
2.35
100
92
2.5
V
Falling threshold, higher of VVIN and VBAT_SNS
Hysteresis, higher of VVIN and VBAT_SNS rising1
Nominal USB initialized current level2
USB super speed
USB enumerated current level (specification for China)
USB enumerated current level
Dedicated charger input
Dedicated wall charger
Charging or LDO mode
DIS_IC1 = high, VISO_B < VINx < 5.5 V
LDO mode, VISO_S > VBAT_SNS
150
100
150
300
500
900
1500
mV
mA
mA
mA
mA
mA
mA
mA
µA
Total Input Current
114
425
470
VINx Current Consumption
Battery Current Consumption
IQVIN
IQVIN_DIS
IQBATT
2
280
20
450
µA
5
µA
Standby, includes ISO_Sx pin leakage, VVIN = 0 V,
TJ = −40°C to +85°C
0.5
0.9
mA
mA
Standby, battery monitor active
CHARGER
Fast Charge Current CC Mode
ICHG
715
750
775
VISO_B = 3.9 V; fast charge current accuracy is
guaranteed at temperatures from TJ = −40°C to
isothermal regulation limit (typically TJ = +115°C)2, 3
Fast Charge Current Accuracy
−40
−50
−65
16
+30
+30
+35
25
mA
mA
mA
mA
mA
ICHG = 50 mA to 550 mA
ICHG = 600 mA to 950 mA
ICHG = 1000 mA to 1300 mA
Trickle Charge Current2
Weak Charge Current2, 3
Trickle to Weak Charge Threshold
Dead Battery
ITRK_DEAD
ICHG_WEAK
20
ITRK_DEAD + ICHG
2, 4
VTRK_DEAD
ΔVTRK_DEAD
2.4
2.5
100
2.6
V
mV
VTRK_DEAD < VBAT_SNS < VWEAK
Hysteresis
On BAT_SNS2
Weak Battery Threshold
Weak to Fast Charge Threshold
VWEAK
ΔVWEAK
VTRM
2.89
3.0
100
4.200
3.11
V
mV
V
%
%
%
V
On BAT_SNS2, 4
Battery Termination Voltage
Termination Voltage Accuracy
−0.25
−0.96
−1.15
+0.25
+0.89
+1.20
On BAT_SNS, TJ = 25°C, IEND = 52.5 mA2
TJ = 0°C to 115°C2
TJ = −40°C to +125°C
Battery Overvoltage Threshold
Charge Complete Current
Charging Complete Current Threshold
Accuracy
VBATOV
IEND
VIN −
0.075
52.5
Relative to VINx voltage, BAT_SNS rising
15
17
98
83
mA
mA
VBAT_SNS = VTRM
IEND = 52.5 mA, TJ = 0°C to 115°C2
59
160
2.2
123
390
2.5
IEND = 92.5 mA, TJ = 0°C to 115°C
Relative to VTRM, BAT_SNS falling2
Recharge Voltage Differential
VRCH
260
2.4
20
3.7
260
3
mV
V
mA
V
mA
ms
Battery Node Short Threshold Voltage2 VBAT_SHR
2
Battery Short Detection Current
Charging Start Voltage Limit
Charging Soft Start Current
Charging Soft Start Timer
ITRK_SHORT
VCHG_VLIM
ICHG_START
tCHG_START
ITRK_SHORT = ITRK_DEAD
3.6
185
3.8
365
Voltage limit is not active by default
VBAT_SNS > VTRK_DEAD
BATTERY ISOLATION FET
Bump to Bump Resistance Between
ISO_Sx and ISO_Bx
Regulated System Voltage: VBAT Low
RDSONISO
VISO_SFC
30
49
mΩ
V
On battery supplement mode, VINx = 0 V, VISO_B = 4.2 V,
IISO_B = 500 mA
VTRM[5:0] programming ≥ 4.00 V
VTRM[5:0] programming < 4.00 V
VISO_S < VISO_B, VSYS rising
3.6
3.3
0
3.8
3.5
5
4.0
3.7
12
Battery Supplementary Threshold
VTHISO
mV
Rev. 0 | Page 3 of 44
ADP5061
Data Sheet
Parameter
Symbol
Min
Typ
Max
Unit Test Conditions/Comments
LDO AND HIGH VOLTAGE BLOCKING
Regulated System Voltage
VISO_STRK
4.214
4.3
4.386
V
VSYSTEM[2:0] = 000 (binary) = 4.3 V, IISO_S = 100 mA,
LDO mode2
Load Regulation
High Voltage Blocking FET (LDO FET)
On Resistance
Maximum Output Current
VINx Input Voltage, Good Threshold
Rising
VINx Falling
VINx Input Overvoltage Threshold
Hysteresis
−0.28
330
%/A IISO_S = 0 m A to 1500 mA
RDS(ON)HV
485
4.0
mΩ
IVIN = 500 mA
2.1
3.9
A
V
VISO_S = 4.3 V, LDO mode
VVIN_OK_RISE 3.75
VVIN_OK_FALL
3.6
6.9
0.1
3.7
7.2
V
V
V
VVIN_OV
6.7
ΔVVIN_OV
TVIN_RISE
TVIN_FALL
VINx Transition Timing
10
10
µs
µs
Minimum rise time for VINx from 5 V to 20 V
Minimum fall time for VINx from 4 V to 0 V
THERMAL CONTROL
Isothermal Charging Temperature
Thermal Early Warning Temperature
Thermal Shutdown Temperature
TLIM
TSDL
TSD
115
130
140
110
°C
°C
°C
°C
TJ rising
TJ falling
THERMISTOR CONTROL
Thermistor Current
10,000 NTC
100,000 NTC
INTC_10k
INTC_100k
CNTC
400
40
100
μA
μA
pF
°C
Thermistor Capacitance
Cold Temperature Threshold
Resistance Thresholds
Cool to Cold Resistance
Cold to Cool Resistance
Hot Temperature Threshold
Resistance Thresholds
Hot to Typical Resistance
Typical to Hot Resistance
TNTC_COLD
0
No battery charging occurs
No battery charging occurs
RCOLD_FALL
RCOLD_RISE
TNTC_HOT
20,500 25,600 30,720
Ω
Ω
°C
24,400
60
RHOT_FALL
RHOT_RISE
3700
3350
Ω
Ω
2750
3950
JEITA1 Li-ION BATTERY CHARGING
SPECIFICATION DEFAULTS5
JEITA Cold Temperature
Resistance Thresholds
Cool to Cold Resistance
Cold to Cool Resistance
JEITA Cool Temperature
Resistance Thresholds
Typical to Cool Resistance
Cool to Typical Resistance
JEITA Typical Temperature
TJEITA_COLD
0
°C
No battery charging occurs
RCOLD_FALL
RCOLD_RISE
TJEITA_COOL
20,500 25,600 30,720
Ω
Ω
°C
24,400
10
Battery charging occurs at 50% of programmed level
RTYP_FALL
RTYP_RISE
TJEITA_TYP
13,200 16,500 19,800
15,900
Ω
Ω
°C
Normal battery charging occurs at default/programmed
levels
Resistance Thresholds
Warm to Typical Resistance
Typical to Warm Resistance
JEITA Warm Temperature
Resistance Thresholds
Hot to Warm Resistance
Warm to Hot Resistance
JEITA Hot Temperature
RWARM_FALL
RWARM_RISE
TJEITA_WARM
5800
5200
45
Ω
Ω
°C
4260
2750
6140
3950
Battery termination voltage (VTRM) is reduced by 100 mV
No battery charging occurs
RHOT_FALL
RHOT_RISE
TJEITA_HOT
3700
3350
60
Ω
Ω
°C
Rev. 0 | Page 4 of 44
Data Sheet
ADP5061
Parameter
Symbol
Min
Typ
Max
Unit Test Conditions/Comments
JEITA2 Li-ION BATTERY CHARGING
SPECIFICATION DEFAULTS5
JEITA Cold Temperature
Resistance Thresholds
Cool to Cold Resistance
Cold to Cool Resistance
JEITA Cool Temperature
Resistance Thresholds
Typical to Cool Resistance
Cool to Typical Resistance
JEITA Typical Temperature
TJEITA_COLD
0
°C
No battery charging occurs
RCOLD_FALL
RCOLD_RISE
TJEITA_COOL
20,500 25,600 30,720
Ω
Ω
°C
24,400
10
Battery termination voltage (VTRM) is reduced by 100 mV
RTYP_FALL
RTYP_RISE
TJEITA_TYP
13,200 16,500 19,800
15,900
Ω
Ω
°C
Normal battery charging occurs at
default/programmed levels
Resistance Thresholds
Warm to Typical Resistance
Typical to Warm Resistance
JEITA Warm Temperature
Resistance Thresholds
Hot to Warm Resistance
Warm to Hot Resistance
JEITA Hot Temperature
BATTERY DETECTION
Battery Detection
Sink Current
RWARM_FALL
RWARM_RISE
TJEITA_WARM
5800
5200
45
Ω
Ω
°C
4260
2750
6140
3950
Battery termination voltage (VTRM) is reduced by 100 mV
No battery charging occurs
RHOT_FALL
RHOT_RISE
TJEITA_HOT
3700
3350
60
Ω
Ω
°C
ISINK
ISOURCE
13
7
20
10
34
13
mA
mA
Source Current
Battery Threshold
Low
High
Battery Detection Timer
TIMERS
VBATL
VBATH
tBATOK
1.8
1.9
3.4
333
2.0
V
V
ms
Clock Oscillator Frequency
Start Charging Delay
Trickle Charge
fCLK
tSTART
tTRK
tCHG
tEND
tDG
tWD
tSAFE
tBAT_SHR
2.7
3
1
3.3
MHz
sec
min
min
min
ms
sec
min
sec
60
600
7.5
31
32
40
30
Fast Charge
Charge Complete
Deglitch
Watchdog2
Safety
Battery Short2
VBAT_SNS = VTRM, ICHG < IEND
Applies to VTRK, VRCH, IEND, VDEAD, VVIN_OK
36
44
ILED OUTPUT PINS
Voltage Drop over ILED
Maximum Operating Voltage over
ILED
VILED
VMAXILED
200
mV
V
IILED = 20 mA
5.5
SYS_EN OUTPUT PIN
SYS_EN FET On Resistance
LOGIC INPUT PIN
RON_SYS_EN
10
Ω
ISYS_EN = 20 mA
Maximum Voltage on Digital Inputs
Maximum Logic Low Input Voltage
Minimum Logic High Input Voltage
Pull-Down Resistance
VDIN_MAX
VIL
VIH
5.5
0.5
V
V
V
kΩ
Applies to SCL, SDA, DIG_IO1, DIG_IO2, DIG_IO3
Applies to SCL, SDA, DIG_IO1, DIG_IO2, DIG_IO3
Applies to SCL, SDA, DIG_IO1, DIG_IO2, DIG_IO3
Applies to DIG_IO1, DIG_IO2, DIG_IO3
1.2
215
350
610
1 Undervoltage lockout generated normally from ISO_Sx or ISO_Bx; in certain transition cases, it can be generated from VINx.
2 These values are programmable via I2C. Values are given with default register values.
3 The output current during charging may be limited by the input current limit or by the isothermal charging mode.
4 During weak charging mode, the charger provides at least 20 mA of charging current via the trickle charge branch to the battery unless trickle charging is disabled.
Any residual current, which is not required by the system, is also used to charge the battery.
5 Either JEITA1 (default) or JEITA2 can be selected in I2C, or both JEITA functions can enabled or disabled in I2C.
Rev. 0 | Page 5 of 44
ADP5061
Data Sheet
RECOMMENDED INPUT AND OUTPUT CAPACITANCES
Table 2.
Parameter
CAPACITANCES
VINx
CBP
ISO_Sx
Symbol
Min
Typ
Max
Unit
Test Conditions/Comments
CVIN
CBP
CISO_S
CISO_B
4
6
20
10
10
14
100
μF
nF
μF
μF
Effective capacitance
Effective capacitance
Effective capacitance
Effective capacitance
10
47
22
ISO_Bx
I2C-COMPATIBLE INTERFACE TIMING SPECIFICATIONS
Table 3.
Parameter1
Symbol
Min
Typ
Max
Unit
Test Conditions/Comments
I2C-COMPATIBLE INTERFACE2
Capacitive Load for Each Bus Line
SCL Clock Frequency
SCL High Time
SCL Low Time
CS
fSCL
400
400
pF
kHz
µs
µs
ns
µs
µs
µs
µs
µs
ns
ns
ns
tHIGH
tLOW
tSU, DAT
tHD, DAT
tSU, STA
tHD, STA
tBUF
tSU, STO
tR
tF
0.6
1.3
100
0
0.6
0.6
1.3
0.6
20
20
0
Data Setup Time
Data Hold Time
0.9
Setup Time for Repeated Start
Hold Time for Start/Repeated Start
Bus Free Time Between a Stop and a Start Condition
Setup Time for Stop Condition
Rise Time of SCL/SDA
300
300
50
Fall Time of SCL/SDA
Pulse Width of Suppressed Spike
tSP
1 Guaranteed by design.
2 A master device must provide a hold time of at least 300 ns for the SDA signal to bridge the undefined region of the falling edge of SCL (see Figure 2).
Timing Diagram
SDA
tF
tSP
tR
tBUF
tLOW
tR
tSU, DAT
tF
tHD, STA
SCL
tBU, STO
tBU, STA
tHIGH
tHD, DAT
S
Sr
P
S
S = START CONDITION
Sr = REPEATED START CONDITION
P = STOP CONDITION
Figure 2. I2C Timing Diagram
Rev. 0 | Page 6 of 44
Data Sheet
ADP5061
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for a device soldered in a circuit board for surface-
mount packages.
Table 4. Absolute Maximum Ratings
Parameter
Rating
VIN1, VIN2, VIN3 to AGND
All Other Pins to AGND
Continuous Drain Current, Battery Supple-
mentary Mode, from ISO_Bx to ISO_Sx
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
–0.5 V to +20 V
–0.3 V to +6 V
2.1 A
Table 5. Thermal Resistance
Package Type
20-Lead WLCSP1
θJA
θJC
θJB
Unit
46.8 0.7
9.2
°C/W
–65°C to +150°C
–40°C to +125°C
JEDEC J-STD-020
1
5 × 4 array, 0.5 mm pitch (2.6 mm × 2.0 mm); based on a JEDEC 2S2P, 4-layer
board with 0 m/sec airflow.
Maximum Power Dissipation
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
The maximum safe power dissipation in the ADP5061 package
is limited by the associated rise in junction temperature (TJ) on
the die. At a die temperature of approximately 150°C (the glass
transition temperature), the properties of the plastic change.
Even temporarily exceeding this temperature limit may change
the stresses that the package exerts on the die, thereby perma-
nently shifting the parametric performance of the ADP5061.
Exceeding a junction temperature of 175°C for an extended
period can result in changes in the silicon devices, potentially
causing failure.
ESD CAUTION
Rev. 0 | Page 7 of 44
ADP5061
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
BALL A1 CORNER
1
2
3
4
ILED
SYS_EN
SDA
SCL
A
B
AGND
ISO_B3
ISO_B2
ISO_B1
THR
CBP
VIN3
VIN2
VIN1
DIG_IO3
DIG_IO2
BAT_SNS
DIG_IO1
ISO_S3
ISO_S2
ISO_S1
C
D
E
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
Figure 3. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Name
Type1 Description
E2, D2, C2 ISO_S1, ISO_S2,
ISO_S3
I/O
Linear Charger Supply Side Input to the Internal Isolation FET/Battery Current Regulation FET.
High current input/output.
E3, D3, C3 VIN1, VIN2, VIN3 I/O
B1 AGND
Power Connections to USB VBUS. These pins are high current inputs when in charging mode.
Analog Ground.
G
E1, D1, C1 ISO_B1, ISO_B2, I/O
ISO_B3
Battery Supply Side Input to Internal Isolation FET/Battery Current Regulation FET.
A4
A3
E4
SCL
SDA
DIG_IO1
I
I2C-Compatible Interface Serial Clock.
I2C-Compatible Interface Serial Data.
Set Input Current Limit. This pin sets the input current limit directly. When DIG_IO1 = low or
high-Z, the input limit is 100 mA. When DIG_IO1 = high, the input limit is 500 mA.2, 3
I/O
GPIO
C4
DIG_IO2
GPIO
Disable IC1. This pin sets the charger to the low current mode. When DIG_IO2 = low or high-Z, the
charger operates in normal mode. When DIG_IO2 = high, the LDO and the charger are disabled
and VINx current consumption is 280 µA (typical). 20 V VINx input protection is disabled and VINx
voltage level must be equal to or lower than 5.5 V.2, 3
B4
B2
DIG_IO3
THR
GPIO
I
Enable Charging. When DIG_IO3 = low or high-Z, charging is disabled. When DIG_IO3 = high,
charging is enabled.2, 3
Battery Pack Thermistor Connection. If this pin is not used, connect a dummy 10 kΩ resistor from THR
to GND.
D4
A1
A2
BAT_SNS
ILED
SYS_EN
I
O
O
Battery Voltage Sense Pin.
Open-Drain Output to Indicator LED.
System Enable. This is the battery OK flag/open-drain pull-down FET pin to enable the system
when the battery level reaches the VWEAK level.
B3
CBP
I/O
Bypass Capacitor Input.
1 I is input, O is output, I/O is input/output, G is ground, and GPIO is factory programmable general-purpose input/output.
2 See the Digital Input and Output Options section for details.
3 DIG_IOx setting defines the initial state of the ADP5061. When the parameter or the mode that is related to each DIG_IOx pin setting is changed (by programming the
equivalent I2C register bit or bits), the I2C register setting dominates over the DIG_IOx pin setting. VINx connection or disconnection resets control to the DIG_IOx pin.
Rev. 0 | Page 8 of 44
Data Sheet
ADP5061
TYPICAL PERFORMANCE CHARACTERISTICS
VVIN = 5.0 V, C VIN = 10 µF, CISO_S = 44 µF, CISO_B = 22 µF, CBP = 10 nF, all registers at default values, unless otherwise noted.
5.05
5.04
5.03
5.02
5.01
5.00
4.99
4.98
4.97
4.96
4.95
4.35
4.34
4.33
4.32
4.31
4.30
4.29
4.28
4.27
4.26
4.25
0.01
0.1
1
0.01
0.1
1
SYSTEM OUTPUT CURRENT (A)
SYSTEM OUTPUT CURRENT (A)
Figure 4. System Voltage vs. System Output Current, LDO Mode,
VSYSTEM[2:0] = 000 (Binary) = 4.3 V
Figure 7. System Voltage vs. System Output Current, LDO Mode, VVIN = 6.0 V,
VSYSTEM[2:0] = 111 (Binary) = 5.0 V
4.5
5.4
LOAD = 100mA
LOAD = 100mA
LOAD = 500mA
LOAD = 500mA
4.4
5.2
LOAD = 1000mA
LOAD = 1000mA
5.0
4.3
4.2
4.1
4.0
3.9
3.8
3.7
3.6
3.5
4.8
4.6
4.4
4.2
4.0
3.8
3.6
3.4
4.0
4.4
4.8
5.2
5.6
6.0
6.4
6.8
4.0
4.4
4.8
5.2
5.6
6.0
6.4
6.8
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 5. Output Voltage vs. Input Voltage (In Dropout), LDO Mode,
VSYSTEM[2:0] = 000 (Binary) = 4.3 V
Figure 8. Output Voltage vs. Input Voltage (In Dropout), LDO Mode,
VSYSTEM[2:0] = 111 (Binary) = 5.0 V
1000
900
700
WEAK
600
CHARGE
800
500
700
600
500
400
300
200
100
0
LIMIT = 900mA
LIMIT = 500mA
LIMIT = 100mA
FAST CHARGE
400
300
200
TRICKLE CHARGE
100
0
2.3
2.7
3.2
3.7
4.2
2.8
3.3
3.8
4.3
BATTERY VOLTAGE (V)
BATTERY VOLTAGE (V)
Figure 6. Input Current-Limited Charge Current vs. Battery Voltage
Figure 9. Battery Charge Current vs. Battery Voltage, ICHG[4:0] = 01001
(Binary) = 500 mA, ILIM[3:0] = 1111 (Binary) = 2100 mA
Rev. 0 | Page 9 of 44
ADP5061
Data Sheet
40
38
36
34
32
30
28
26
24
22
40
38
36
34
32
30
28
26
24
22
20
20
2.7
3.2
3.7
4.2
0
0.5
1.0
1.5
2.0
BATTERY VOLTAGE (V)
LOAD CURRENT (A)
Figure 10. Ideal Diode RON vs. Battery Voltage, IISO_S = 500 mA, VINx Open
Figure 12. Ideal Diode RON vs. Load Current, VISO_B = 3.6 V
4.0
4.4
4.2
4.0
3.8
3.6
3.4
3.2
3.0
0.7
DEFAULT STARTUP
DIS_LDO = HIGH
DIS_IC1 = HIGH
V
I
BAT_SNS
ISO_B
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0.6
0.5
0.4
0.3
0.2
0.1
0
0
2
4
6
8
0
50
100
150
INPUT VOLTAGE (V)
CHARGE TIME (min)
Figure 11. VINx Current vs. VINx Voltage
Figure 13. Charge Profile, ILIM[3:0] = 0110 (Binary) = 500 mA, Battery
Capacity = 925 mAh
Rev. 0 | Page 10 of 44
Data Sheet
ADP5061
TEMPERATURE CHARACTERISTICS
1.5
0.5
0.4
V
V
V
= 3.6V
= 4.2V
= 5.5V
ISO_B
ISO_B
ISO_B
V
V
= 4.3V
= 5.0V
ISO_S
ISO_S
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.3
0.2
0.1
0
–0.1
–0.2
–0.3
–0.4
–0.5
–40
–15
10
35
60
85
–40 –25 –10
5
20
35
50
65
80
95 110 125
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
Figure 14. Battery Leakage Current vs. Ambient Temperature
Figure 17. System Voltage vs. Temperature, Trickle Charge Mode,
VISO_S = 4.3 V and VINx = 5.0 V, or VISO_S = 5.0 V and VINx = 6.0 V
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
V
V
V
= 4.0V
= 5.0V
= 5.5V
V
V
V
= 4.0V
= 5.0V
= 6.7V
IN
IN
IN
IN
IN
IN
–40 –25 –10
5
20
35
50
65
80
95 110 125
–40 –25 –10
5
20
35
50
65
80
95 110 125
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
Figure 15. VINx Quiescent Current vs. Ambient Temperature, DIS_IC1 = High
Figure 18. VINx Quiescent Current vs. Ambient Temperature, LDO Mode
0.5
0.5
V
V
= 4.3V
= 5.0V
V
V
V
= 3.8V
= 4.2V
= 4.5V
ISO_S
ISO_S
TRM
TRM
TRM
0.4
0.3
0.4
0.3
0.2
0.2
0.1
0.1
0
0
–0.1
–0.2
–0.3
–0.4
–0.5
–0.1
–0.2
–0.3
–0.4
–0.5
–40 –25 –10
5
20
35
50
65
80
95 110 125
–40 –25 –10
5
20
35
50
65
80
95 110 125
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
Figure 16. LDO Mode Voltage vs. Ambient Temperature,
Load = 100 mA, VVIN = 5.5 V
Figure 19. Termination Voltage vs. Ambient Temperature
Rev. 0 | Page 11 of 44
ADP5061
Data Sheet
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1.4
I
= 1300mA
CHG
I
= 1500mA
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
LIM
I
I
I
= 900mA
= 500mA
= 100mA
LIM
LIM
LIM
I
I
= 750mA
CHG
= 500mA
–15
CHG
–40 –25 –10
5
20
35
50
65
80
95 110 125
–40
10
35
60
85
110
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
Figure 20. Fast Charge CC Mode Current vs. Ambient Temperature
Figure 22. Input Current Limit vs. Ambient Temperature
7.00
6.95
6.90
6.85
6.80
–40 –25 –10
5
20
35
50
65
80
95 110 125
AMBIENT TEMPERATURE (°C)
Figure 21. VINx Overvoltage Threshold vs. Ambient Temperature
Rev. 0 | Page 12 of 44
Data Sheet
ADP5061
TYPICAL WAVEFORMS
V
ISO_S
VIN
V
V
ISO_S
VIN
V
I
ISO_B
I
ISO_B
I
VIN
I
VIN
Figure 23. Charging Startup, VVIN = 5.0 V, ILIM[3:0] = 0110 (Binary) = 500 mA,
ICHG[4:0] = 01110 (Binary) = 750 mA
Figure 26. VBUS Disconnect
V
ISO_S
I
ISO_B
V
ISO_S
I
ISO_S
I
ISO_S
Figure 24. Load Transient, IISO_Sx Load = 300 mA to 1500 mA to 300 mA
Figure 27. Load Transient. IISO_Sx Load = 300 mA to 1500 mA to 300 mA,
EN_CHG = High, ILIM[3:0] = 0110 (Binary) = 500 mA
V
ISO_S
V
VIN
V
ISO_B
I
ISO_B
I
ISO_B
I
VIN
Figure 25. Input Current-Limit Transition from 100 mA to 900 mA,
ISO_Sx Load = 66 Ω, Charging = 750 mA
Figure 28. Battery Detection Waveform, VSYSTEM[2:0] = 000 (Binary) = 4.3 V,
No Battery
Rev. 0 | Page 13 of 44
ADP5061
Data Sheet
THEORY OF OPERATION
SUMMARY OF OPERATION MODES
Table 7. Summary of the ADP5061 Operation Modes
LDO
FET
State
Battery
Isolation Voltage
FET
System
VINx
Trickle
Charge
Additional
Conditions1
Mode Name
Condition Battery Condition
ISO_Sx
IC Off, Standby
0 V
Any battery condition
Off
Off
On/Off
Battery voltage Disable IC1
or 0 V
IC Off, Suspend
LDO Mode Off, Isolation
FET On
5 V
5 V
Any battery condition
Any battery condition
Off
Off
Off
Off
On
On
Battery voltage Disable IC1
Battery voltage Disable LDO and
enable isolation FET
LDO Mode Off, Isolation
FET Off (System Off)
5 V
5 V
5 V
5 V
5 V
5 V
5 V
Any battery condition
Any battery condition
Battery < VTRK_DEAD
Off
Off
On
Off
Off
0 V
Enable battery
charging
Enable battery
charging
Enable battery
charging
Enable battery
charging
Enable battery
charging
Enable battery
charging
Enable battery
charging
LDO Mode, Charger Off
Trickle Charge Mode
Weak Charge Mode
Fast Charge Mode
LDO
LDO
CHG
CHG
LDO
LDO
Off
5.0 V
Off
5.0 V
VTRK_DEAD ≤ battery < VWEAK On
CHG
CHG
Off
3.8 V
Battery ≥ VWEAK
Open
Off
Off
On
3.8 V (min)
5.0 V
Charge Mode, No Battery
Charge Mode, Battery
(ISO_Bx) Short
Short
Off
5.0 V
1 See Table 8 for details.
Table 8. Operation Mode Controls
Equivalent I2C
Address, Data
Pin Configuration
DIG_IOx
Description
Enable Battery Charging
DIG_IO3
0x07, D0
Low = all charging modes disabled (fast, weak, trickle).
High = all charging modes enabled (fast, weak, trickle).
VINx1 Supply
Disable IC1
DIG_IO2
0x07, D6
Disable IC1
Connected
LDO_FET ISO_FET
Low
No
Off
On
Yes
No
CHG
Off
CHG
On
High
Yes
Off
On
Disable LDO and Enable Isolation FET
0x07, D3, D0
Low = LDO enabled.
High = LDO disabled. In addition, when EN_CHG = low, the
battery isolation FET is on; when EN_CHG = high, the battery
isolation FET is off.
1 When disable IC1 mode is active and the VINx supply is connected, the supply voltage level must fulfill the following condition: VISO_B < VIN < 5.5 V.
Rev. 0 | Page 14 of 44
Data Sheet
ADP5061
by an external USB detection device, the ADP5061 can be set to
apply the correct current limit for optimal charging and USB
compliance. The USB charger permits correct operation under
all USB-compliant sources such as wall chargers, host chargers,
hub chargers, and standard host and hubs.
A processor can control the USB charger using the I2C to
program the charging current and numerous other parameters,
including
INTRODUCTION
The ADP5061 is a fully programmable I2C charger for single
cell lithium-ion or lithium-polymer batteries suitable for a wide
range of portable applications.
The linear charger architecture enables up to 2.1 A output
current at 4.3 V to 5.0 V (I2C programmable) on the system
power supply, and up to 1.3 A charge current into the battery
from a dedicated charger.
•
•
•
•
•
•
•
•
•
•
•
•
Trickle charge current level
The ADP5061 operates from an input voltage of 4 V up to 6.7 V
but is tolerant of voltages of up to 20 V. The 20 V voltage tolerance
alleviates the concerns of the USB bus spiking during discon-
nection or connection scenarios.
Trickle charge voltage threshold
Weak charge (constant current) current level
Fast charge (constant current) current level
Fast charge (constant voltage) voltage level at 1% accuracy
Fast charge safety timer period
Watchdog safety timer parameters
Weak battery threshold detection
Charge complete threshold
Recharge threshold
Charge enable/disable
Battery pack temperature detection and automatic charger
shutdown
The ADP5061 features an internal FET between the linear charger
output and the battery. This feature permits battery isolation
and, hence, system powering under a dead battery or no battery
scenario, which allows for immediate system function upon
connection to a USB power supply.
The ADP5061 is fully compliant with USB 3.0 and the USB
Battery Charging Specification 1.2. The ADP5061 is chargeable
via the mini USB VBUS pin from a wall charger, car charger, or
USB host port. Based on the type of USB source, which is detected
Rev. 0 | Page 15 of 44
ADP5061
Data Sheet
ISO_S1
ISO_S2
ISO_S3
VIN1
HIGH VOLTAGE
BLOCKING
LDO-FET
E3
D3
E3
TO USB VBUS
OR WALL
TO SYSTEM
LOAD
ADAPTER
VIN2
VIN3
D3
C3
+
C3
+
–
LDO-FET
CONTROL
VIN LIMIT
–
6.85V
VIN
OVERVOLTAGE
CBP
BATTERY
ISOLATION FET
B3
TRICKLE
CURRENT
SOURCE
+
–
3.9V
3MHz OSC
ISO_B1
ISO_B2
ISO_B3
E1
D1
C1
+
–
VIN GOOD
EOC
SCL
SDA
A4
A3
CHARGE CONTROL
+
–
CV-MODE
RECHARGE
2
I C INTERFACE
DIG_IO1
DIG_IO2
DIG_IO3
AND
E4
C4
B4
CONTROL LOGIC
+
–
WEAK
BATTERY
DETECTION
SINK
+
–
TRICKLE
BATTERY:
OPEN
BAT_SNS
D4
+
–
SHORT
3.4V
1.9V
SYS_EN
A2
BATTERY DETECTION
+
SYS_EN OUTPUT
LOGIC
–
VIN – 150mV
BATTERY OVERVOLTAGE
COLD
ILED
A1
COOL
ILED OUTPUT
LOGIC
NTC CURRENT
CONTROL
WARM
HOT
THR
+
–
B2
0.5V
THERMAL CONTROL
B1
SINGLE
CELL
Li-Ion
Figure 29. Block Diagram
Rev. 0 | Page 16 of 44
Data Sheet
ADP5061
The ADP5061 includes a number of significant features to
optimize charging and functionality including
Table 9. DIG_IO1 Operation
DIG_IO1
Function
0
100 mA input current limit or I2C programmed
value
500 mA input current limit or I2C programmed
value (or reprogrammed I2C value from 100 mA
default)
Thermal regulation for maximum performance
USB host current-limit accuracy: 5%.
Termination voltage accuracy: 1%.
1
Battery thermistor input with automatic charger shutdown
in the event that the battery temperature exceeds limits
(compliant with the JEITA Li-Ion battery charging
temperature specification).
Three external pins (DIG_IO1, DIG_IO2, and DIG_IO3)
that directly control a number of parameters. These pins
are factory programmable for maximum flexibility. They
can be factory programmed for functions such as
USB Compatibility
The ADP5061 features an I2C programmable input current limit
to ensure compatibility with the requirements listed in Table 10.
The current limit defaults to 100 mA to allow compatibility
with a USB host or hub that is not configured.
The I2C register default is 100 mA. An I2C write command to
the ILIM bits override the DIG_IOx pins, and the I2C register
default value can be reprogrammed for alternative
requirements.
Enable/disable charging.
Control of 100 mA or 500 mA input current limit.
Control of 1500 mA input current limit.
Control of the battery charge current.
Interrupt output pin.
When the input current-limit feature is used, the available input
current may be too low for the charger to meet the programmed
charging current, ICHG, thereby reducing the rate of charge and
setting the VIN_ILIM flag.
See the Digital Input and Output Options section for details.
CHARGER MODES
Input Current Limit
The VINx input current limit is controlled via the internal I2C
ILIM bits. The input current limit can also be controlled via the
DIG_IO1 pin (if factory programmed to do so) as outlined in
Table 9. Any change in the I2C default from 100 mA dominates
over the pin setting.
When connecting voltage to VINx without the proper voltage
level on the battery side, the high voltage blocking mechanism
is in a state wherein it draws only the current of <1 mA until
VIN reaches the VIN_OK level.
The ADP5061 charger provides support for the following con-
nections through the single connector VINx pin (see Table 10).
Table 10. Input Current Compatibility with Standard USB Limits
Mode
Standard USB Limit
ADP5061 Function
USB (China Only)
100 mA limit for standard USB host or hub
300 mA limit for Chinese USB specification
100 mA limit for standard USB host or hub
500 mA limit for standard USB host or hub
150 mA limit for superspeed USB 3.0 host or hub
900 mA limit for superspeed, high speed USB host or hub
charger
1500 mA limit for dedicated charger or low/full speed USB
host or hub charger
100 mA input current limit or I2C programmed value
300 mA input current limit or I2C programmed value
100 mA input current limit or I2C programmed value
500 mA input current limit or I2C programmed value
150 mA input current limit or I2C programmed value
USB 2.0
USB 3.0
900 mA input current limit or I2C programmed value
Dedicated Charger
1500 mA input current limit or I2C programmed value
Rev. 0 | Page 17 of 44
ADP5061
Data Sheet
Trickle Charge Mode
Fast Charge Mode (Constant Current)
A deeply discharged Li-Ion cell can exhibit a very low cell
voltage, making it unsafe to charge the cell at high current rates.
The ADP5061 charger uses a trickle charge mode to reset the
battery pack protection circuit and lift the cell voltage to a safe
level for fast charging. A cell with a voltage below VTRK_DEAD is
charged with the trickle mode current, ITRK_DEAD. During trickle
charging mode, the CHARGER_STATUS bits are set.
When the battery voltage exceeds VTRK_DEAD and VWEAK, the
charger switches to fast charge mode, charging the battery with
the constant current, ICHG. During fast charge mode (constant
current), the CHARGER_STATUS bits are set to 010.
During constant current mode, other features may prevent the
current, ICHG, from reaching its full programmed value.
Isothermal charging mode or input current limiting for USB
compatibility can affect the value of ICHG under certain oper-
ating conditions. The voltage on ISO_Sx is regulated to stay at
During trickle charging, the ISO_Sx node is regulated to
V
ISO_STRK by the LDO and the battery isolation FET is off, which
means that the battery is isolated from the system power supply.
V
ISO_SFC by the battery isolation FET when VISO_B < VISO_SFC
.
Trickle Charge Mode Timer
Fast Charge Mode (Constant Voltage)
The duration of trickle charge mode is monitored to ensure that
the battery is revived from its deeply discharged state. If trickle
charge mode runs for longer than 60 minutes without the cell
voltage reaching VTRK_DEAD, a fault condition is assumed and
charging stops. The fault condition is asserted on the
CHARGER_STATUS bits, allowing the user to initiate the fault
recovery procedure specified in the Fault Recovery section.
As the battery charges, its voltage rises and approaches the termi-
nation voltage, VTRM. The ADP5061 charger monitors the voltage
on the BAT_SNS pin to determine when charging should end.
However, the internal ESR of the battery pack, combined with
the printed circuit board (PCB) and other parasitic series
resistances creates a voltage drop between the sense point at the
BAT_SNS pin and the cell terminal. To compensate for this and
ensure a fully charged cell, the ADP5061 enters a constant voltage
charging mode when the termination voltage is detected on the
BAT_SNS pin. The ADP5061 reduces charge current gradually as
the cell continues to charge, maintaining a voltage of VTRM on the
BAT_SNS pin. During fast charge mode (constant voltage), the
CHARGER_ STATUS register is set.
Weak Charge Mode (Constant Current)
When the battery voltage exceeds VTRK_DEAD but is less than
V
WEAK, the charger switches to intermediate charge mode.
During the weak charge mode, the battery voltage is too low to
allow the full system to power-up. Because of the low battery
level, the USB transceiver cannot be powered and, therefore,
cannot enumerate for more current from a USB host. Conse-
quently, the USB limit remains at 100 mA.
Fast Charge Mode Timer
The duration of fast charge mode is monitored to ensure that
the battery is charging correctly. If the fast charge mode runs for
longer than tCHG without the voltage at the BAT_SNS pin
reaching VTRM, a fault condition is assumed and charging stops.
The fault condition is asserted on the CHARGER_STATUS bits
allowing the user to initiate the fault recovery procedure as
specified in the Fault Recovery section.
The system microcontroller may or may not be powered by the
charger output voltage (VISO_SFC), depending upon the amount
of current required by the microcontroller and/or the system
architecture. When the ISO_Sx pins power the microcontroller,
the battery charge current (ICHG_WEAK) cannot be increased above
20 mA to ensure the microcontroller operation (if doing so),
nor can ICHG_WEAK be increased above the 100 mA USB limit.
Thus, set the battery charging current as follows:
If the fast charge mode runs for longer than tCHG, and VTRM has
been reached on the BAT_SNS pin but the charge current has
not yet fallen below IEND, charging stops. No fault condition is
asserted in this circumstance and charging resumes as normal if
the recharge threshold is breached.
•
Set the default 20 mA via the linear trickle charger branch (to
ensure that the microprocessor remains alive if powered by
the main charger output, ISO_Sx). Any residual current on
the main charger output, ISO_Sx, is used to charge the
battery.
Watchdog Timer
The ADP5061 charger features a programmable watchdog timer
function to ensure charging is under the control of the processor.
The watchdog timer starts running when the ADP5061 charger
determines that the processor should be operational, that is,
when the processor sets the RESET_WD bit for the first time or
when the battery voltage is greater than the weak battery threshold,
•
During weak current mode, other features may prevent the
weak charging current from reaching its full programmed
value. Isothermal charging mode or input current limiting
for USB compatibility can affect the programmed weak
charging current value under certain operating conditions.
During weak charging, the ISO_Sx node is regulated to
V
WEAK. When the watchdog timer has been triggered, it must be
reset regularly within the watchdog timer period, tWD
.
V
ISO_SFC by the battery isolation FET.
While in charger mode, if the watchdog timer expires without
being reset, the ADP5061 charger assumes that there is a software
problem and triggers the safety timer, tSAFE. For more information,
see the Safety Timer section.
Rev. 0 | Page 18 of 44
Data Sheet
ADP5061
Safety Timer
Battery Voltage Limit to Prevent Charging
While in charger mode, if the watchdog timer expires, the
ADP5061 charger initiates the safety timer, tSAFE (see the
Watchdog Timer section). If the processor has programmed
charging parameters by the time the charger initiates the safety
timer, the ILIM is set to the default value. Charging continues for
a period of tSAFE, and then the charger switches off and sets the
CHARGER_STATUS bits.
The battery monitor of the ADP5061 charger can be configured
to monitor battery voltage and prevent charging when the battery
voltage is higher than VCHG_VLIM (typically 3.7 V) during charging
start-up (enabled by EN_CHG or DIG_IO3). This function can
prevent unnecessary charging of a half discharged battery and,
as such, can extend the lifetime of the Li-Ion battery cell. Charging
starts automatically when the battery voltage drops below VCHG_VLIM
and continues through full charge cycle until the battery voltage
reaches VTRM (typically 4.2 V).
Charge Complete
The ADP5061 charger monitors the charging current while
in constant voltage fast charge mode. If the current falls
below IEND and remains below IEND for tEND, charging stops
and the CHDONE flag is set. If the charging current falls below
By default, the charging voltage limit is disabled and it can be
enabled from I2C Register 0x08, Bit EN_CHG_VLIM.
SYS_EN Output
I
END for less than tEND and then rises above IEND again, the tEND
The ADP5061 features a SYS_EN open-drain FET to enable the
system until the battery is at the minimum required level for
guaranteed system start-up. When there are minimum battery
voltage and/or minimum battery charge level requirements, the
operation of SYS_EN can be set by I2C programming. The SYS_EN
operation can be factory programmed to four different operating
conditions as described in Table 11.
timer resets.
Recharge
After the detection of charge complete, and the cessation of
charging, the ADP5061 charger monitors the BAT_SNS pin as
the battery discharges through normal use. If the BAT_SNS pin
voltage falls to VRCH, the charger reactivates charging. Under
most circumstances, triggering the recharge threshold results in
the charger starting directly into fast charge constant voltage
mode.
The recharge function can be disabled in I2C, but a status bit
(Register 0x0C, Bit D3) informs the system that a recharge cycle
is required.
Table 11. SYS_EN Mode Descriptions
SYS_EN Mode
Description
Selection
SYS_EN is activated when LDO is active and
system voltage is available.
00
SYS_EN is activated by the ISO_Bx voltage,
battery charging mode.
01
10
IC Enable/Disable
SYS_EN is activated and the isolation FET is
disabled when the battery drops below VWEAK
The ADP5061 IC can be disabled by the DIG_IO2 digital input
pin (if factory programmed to do so) or by the I2C registers. All
internal control circuits are disabled when the IC is disabled.
Disabling the IC1 option can also control the states of the LDO
FET and the battery isolation FET.
.
This option is active, when VINx = 0 V and the
battery monitor is activated from Register 0x07,
Bit D5 (EN_BMON).
SYS_EN is active in LDO mode when the charger is
disabled.
11
It is critical to note that during the disable IC1 mode, a high
voltage at VINx passes to the internal supply voltage because all
of the internal control circuits are disabled. The VINx supply
voltage must fulfill the following condition:
SYS_EN is active in charging mode when ISO_Bx ≥
VWEAK
.
Indicator LED Output (ILED)
V
ISO_B < VINx < 5.5 V
The ILED is an open-drain output for indicator LED connection.
Optionally, the ILED output can be used as a status output for a
microcontroller. Indicator LED modes are shown in Table 12.
Battery Charging Enable/Disable
The ADP5061 charging function can be disabled by setting the
I2C EN_CHG bit to low. The LDO to the system still operates
under this circumstance and can be set in I2C to the default or
I2C programmed system voltage from 4.3 V to 5.0 V (see the
relevant I2C register description for full details).
Table 12. Indicator LED Operation Modes
ADP5061 Mode
ILED Mode
On/Off Time
IC Off
Off
LDO Mode Off
Off
The ADP5061 charging function can also be controlled via one
of the external DIG_IOx pins (if factory programmed to do so).
Any change in the I2C EN_CHG bit takes precedence over the
pin setting.
LDO Mode On
Charge Mode
Timer Error (tTRK, tCHG, tSAFE
Overtemperature (TSD)
Off
Continuously on
Blinking
Blinking
)
167 ms/833 ms
1 sec/1 sec
Rev. 0 | Page 19 of 44
ADP5061
Data Sheet
THERMAL MANAGEMENT
BATTERY ISOLATION FET
Isothermal Charging
The ADP5061 charger features an integrated battery isolation
FET for power path control. The battery isolation FET isolates a
deeply discharged Li-Ion cell from the system power supply in
both trickle and fast charge modes, thereby allowing the system
to be powered at all times.
The ADP5061 includes a thermal feedback loop that limits the
charge current when the die temperature exceeds TLIM (typically
115°C). As the on-chip power dissipation and die temperature
increase, the charge current is automatically reduced to maintain
the die temperature within the recommended range. As the die
temperature decreases due to lower on-chip power dissipation
or ambient temperature, the charge current returns to the pro-
grammed level. During isothermal charging, the THERM_LIM
I2C flag is set to high.
When VINx is below VVIN_OK, the battery isolation FET is in full
conducting mode.
The battery isolation FET is off during trickle charge mode.
When the battery voltage exceeds VTRK, the battery isolation
FET switches to the system voltage regulation mode. During
system voltage regulation mode, the battery isolation FET
maintains the VISO_SFC voltage on the ISO_Sx pins. When the
battery voltage exceeds VISO_SFC, the battery isolation FET is in
full conducting mode.
This thermal feedback control loop allows the user to set the
programmed charge current based on typical rather than worst
case conditions.
The ADP5061 does not include a thermal feedback loop to limit
ISO_Sx load current in LDO mode. If the power dissipated on
chip during LDO mode causes the die temperature to exceed
130°C, an interrupt is generated. If the die temperature
continues to rise beyond 140°C, the device enters into thermal
shutdown.
The battery isolation FET supplements the battery to support
high current functions on the system power supply. When
voltage on ISO_Sx drops below ISO_Bx, the battery isolation
FET enters into full conducting mode. When voltage on ISO_Sx
rises above ISO_Bx, the isolation FET enters regulating mode or
full conduction mode, depending on the Li-Ion cell voltage and
the linear charger mode.
Thermal Shutdown and Thermal Early Warning
The ADP5061 charger features a thermal shutdown threshold
detector. If the die temperature exceeds TSD, the ADP5061
charger is disabled, and the TSD 140°C bit is set. The ADP5061
charger can be reenabled when the die temperature drops below
the TSD falling limit and the TSD 140°C bit is reset. To reset the
TSD 140°C bit, write to the I2C Fault Register 0x0D or cycle the
power.
BATTERY DETECTION
Battery Voltage Level Detection
The ADP5061 charger features a battery detection mechanism to
detect an absent battery. The charger actively sinks and sources
current into the ISO_Bx/BAT_SNS node, and voltage vs. time is
detected. The sink phase is used to detect a charged battery,
whereas the source phase is used to detect a discharged battery.
Before die temperature reaches TSD, the early warning bit is set if
TSDL is exceeded. This allows the system to accommodate power
consumption before thermal shutdown occurs.
The sink phase (see Figure 30) sinks ISINK current from the
ISO_Bx/ BAT_SNS pins for a time period, tBATOK. If the
BAT_SNS pin is below VBATL when the tBATOK timer expires, the
charger assumes no battery is present, and starts the source phase.
If the BAT_SNS exceeds the VBATL voltage when the tBATOK timer
expires, the charger assumes the battery is present and begins a
new charge cycle.
Fault Recovery
Before performing the following operation, it is important to
ensure that the cause of the fault has been rectified.
To recover from a charger fault (when the CHARGER_STATUS =
110), cycle power on VINx or write high to reset the I2C fault
bits in the fault register.
The source phase sources ISOURCE current to ISO_Bx and the
BAT_SNS pin for a time period, tBATOK. If BAT_SNS pin exceeds
VBATH before the tBATOK timer expires, the charger assumes that
no battery is present. If the BAT_SNS does not exceed the VBATH
voltage when the tBATOK timer expires, the charger assumes that a
battery is present and begins a new charge cycle.
Rev. 0 | Page 20 of 44
Data Sheet
ADP5061
SOURCE PHASE
SINK PHASE
VBATL
V
BATH
LOGIC
STATUS
LOGIC
STATUS
tBAT_OK
tBAT_OK
OPEN
OR
SHORT
OPEN
ISO_Bx
ISO_Bx
Figure 30. Sink Phase
SINK PHASE
TRICKLE CHARGE
V
SOURCE PHASE
V
V
BATL
BATH
BAT_SHR
LOGIC
STATUS
LOGIC
STATUS
LOGIC
STATUS
tBAT_OK
tBAT_OK
tBAT_SHR
SHORT
OR
OPEN
OR
SHORT
SHORT
LOW
ISO_Bx
BATTERY
ISO_Bx
ISO_Bx
Figure 31. Trickle Charge
Battery (ISO_Bx) Short Detection
The battery pack temperature sensing can be controlled by I2C,
using the conditions shown in Table 13. Note that the I2C register
default setting for EN_THR (Register 0x07) is 0 = temperature
sensing off.
A battery short occurs under a damaged battery condition or
when the battery protection circuitry is enabled.
On commencing trickle charging, the ADP5061 charger moni-
tors the battery voltage. If this battery voltage does not exceed
Table 13. THR Input Function
V
BAT_SHR within the specified timeout period, tBAT_SHR, a fault is
Conditions
declared and the charger is stopped by turning the battery
isolation FET off, but the system voltage is maintained at
VINx
VISO_B
THR Function
Off
Off, controlled by I2C
Open or VIN = 0 V to 4.0 V <2.5 V
Open or VIN = 0 V to 4.0 V >2.5 V
V
ISO_STRK by the linear regulator.
4.0 V to 6.7 V
Don't care Always on
After source phase, if the ISO_Bx or BAT_SNS level remains
below VBATH, either the battery voltage is low or the battery node
can be shorted. Because the battery voltage is low, trickle charging
mode is initiated (see Figure 31). If the BAT_SNS level remains
below VBAT_SHR after tBAT_SHR has elapsed, the ADP5061 assumes
that the battery node is shorted.
If the battery pack thermistor is not connected directly to the
THR pin, a 10 kΩ (tolerance 20%) dummy resistor must be
connected between the THR input and GND. Leaving the THR
pin open results in a false detection of the battery temperature
being <0°C and charging is disabled.
The trickle charge branch is active during the battery short
scenario, and trickle charge current to the battery is maintained
until the 60-minute trickle charge mode timer expires.
The ADP5061 charger monitors the voltage in the THR pin and
suspends charging if the current is outside the range of less than
0°C or greater than 60°C.
BATTERY PACK TEMPERATURE SENSING
Battery Thermistor Input
The ADP5061 charger is designed for use with an NTC thermistor
in the battery pack with a nominal room temperature value of
either 10 kΩ at 25°C or 100 kΩ at 25°C, which is selected by
factory programming.
The ADP5061 charger features battery pack temperature
sensing that precludes charging when the battery pack
temperature is outside the specified range. The THR pin
provides an on and off switching current source that should be
connected directly to the battery pack thermistor terminal. The
activation interval of the THR current source is 167 ms.
The ADP5061 charger is designed for use with an NTC thermistor
in the battery pack with a temperature coefficient curve (beta).
Factory programming supports eight beta values covering a
range from 3150 to 4400 (see Table 44).
Rev. 0 | Page 21 of 44
ADP5061
Data Sheet
JEITA Li-Ion Battery Temperature Charging Specification
I2C. Alternatively, the JEITA1 or JEITA2 can be set as enabled
to default by factory programming.
The ADP5061 is compliant with the JEITA1 and JEITA2 Li-Ion
battery charging temperature specifications as outlined in Table 14
and in Table 16, respectively.
When the ADP5061 identifies a hot or cold battery condition,
the ADP5061 takes the following actions:
JEITA function can be enabled via the I2C interface and,
optionally, the JEITA1 or JEITA2 function can be selected in
•
•
Stops charging the battery.
Connects or enables the battery isolation FET such that the
ADP5061 continues in LDO mode.
Table 14. JEITA1 Specifications
Parameter
Symbol Conditions
Min Max Unit
JEITA1 Cold Temperature Limits IJEITA_COLD No battery charging occurs
JEITA1 Cool Temperature Limits IJEITA_COOL Battery charging occurs at approximately 50% of programmed level—
see Table 15 for specific charging current reduction levels
0
10
°C
°C
0
JEITA1Typical Temperature
Limits
JEITA1Warm Temperature
Limits
IJEITA_TYP
Normal battery charging occurs at default/programmed levels
10
45
60
45
60
°C
°C
°C
IJEITA_WARM Battery termination voltage (VTRM) is reduced by 100 mV from
programmed value
IJEITA_HOT
JEITA1 Hot Temperature Limits
No battery charging occurs
Table 15. JEITA1 Reduced Charge Current Levels, Battery Cool Temperature
ICHG[4:0] (Default)
00000 = 50 mA
00001 = 100 mA
00010 = 150 mA
00011 = 200 mA
00100 = 250 mA
00101 = 300 mA
00110 = 350 mA
00111 = 400 mA
01000 = 450 mA
01001 = 500 mA
01010 = 550 mA
01011 = 600 mA
ICHG JEITA1
ICHG[4:0] (Default)
01100 = 650 mA
01101 = 700 mA
01110 = 750 mA
01111 = 800 mA
10000 = 850 mA
10001 = 900 mA
10010 = 950 mA
10011 = 1000 mA
10100 = 1050 mA
10101 = 1100 mA
10110 = 1200 mA
10111 = 1300 mA
ICHG JEITA1
300 mA
350 mA
350 mA
400 mA
400 mA
450 mA
450 mA
500 mA
500 mA
550 mA
600 mA
650 mA
50 mA
50 mA
50 mA
100 mA
100 mA
150 mA
150 mA
200 mA
200 mA
250 mA
250 mA
300 mA
Table 16. JEITA2 Specifications
Parameter
Symbol Conditions
Min Max Unit
JEITA2 Cold Temperature
Limits
JEITA2 Cool Temperature
Limits
JEITA2 Typical Temperature
Limits
JEITA2 Warm Temperature
Limits
IJEITA_COLD No battery charging occurs
0
°C
°C
°C
°C
°C
IJEITA_COOL Battery termination voltage (VTRM) is reduced by 100 mV from
programmed value
0
10
45
60
IJEITA_TYP
Normal battery charging occurs at default/programmed levels
10
45
60
IJEITA_WARM Battery termination voltage (VTRM) is reduced by 100 mV from
programmed value
JEITA2 Hot Temperature Limits IJEITA_HOT
No battery charging occurs
Rev. 0 | Page 22 of 44
Data Sheet
ADP5061
POWER-ON RESET
RESET ALL
REGISTERS
NO
NO
IC OFF
VINOK
YES
SYSTEM
OFF
YES
NO
ENABLE
CHARGER
ENABLE
LDO
YES
LDO MODE
ENABLE
NO
CHARGER
YES
LOW
BATTERY
CHG
V
YES
BAT_SNS
CHG_VLIM
NO
< V
YES
NO
TO
CHARGING-MODE
Figure 32. Simplified Battery and VIN Connect Flowchart
Rev. 0 | Page 23 of 44
ADP5061
Data Sheet
TO CHARGING
MODE
TO IC OFF
YES
RUN
BATTERY
DETECTION
tSTART
EXPIRED
NO
YES
NO
V
BAT_SNS
< V
TRK
POWER-DOWN
TRICKLE
CHARGE
FAST CHARGE
NO
NO
NO
NO
VINOK
YES
VINOK
YES
V
IBUSLIM = HIGH
= I
BAT_SNS
I
< I
LIM
VIN
I
< V
VIN
LIM
TRK
YES
YES
WATCHDOG
EXPIRED
YES
YES
tWD EXPIRED
NO
NO
START tSAFE
THERMLIM = HIGH
TEMP = T
TEMP < T
LIM
I
= 100 mA
BUS
LIM
YES
TFAULT
OR
BAD BATTERY
tSAFE OR tTRK
EXPIRED
WATCHDOG
EXPIRED
YES
tWD EXPIRED
NO
START tSAFE
I
= 100 mA
BUS
NO
TFAULT OR
1
YES
tSAFE OR tCHG
EXPIRED
BAD BATTERY
1
SEE TIMER SPECS
NO
RUN
BATTERY
DETECTION
NO
V
=
BAT_SNS
CC MODE
CHARGING
V
YES
TRM
YES
V
=
BAT_SNS
V
RCH
NO
YES
NO
CHARGE
COMPLETE
CV MODE
CHARGING
I
< I
END
OUT
Figure 33. Simplified Charging Mode Flowchart
Rev. 0 | Page 24 of 44
Data Sheet
ADP5061
I2C INTERFACE
the master after the 8-bit data byte has been written (see Figure 34
for an example of the I2C write sequence to a single register).
The ADP5061 increments the subaddress automatically and
starts receiving a data byte at the next register until the master
sends an I2C stop as shown in Figure 35.
Figure 36 shows the I2C read sequence of a single register.
ADP5061 sends the data from the register denoted by the
subaddress and increments the subaddress automatically,
sending data from the next register until the master sends an
I2C stop condition as shown in Figure 37.
The ADP5061 includes an I2C-compatible serial interface for
control of the charging and LDO functions, as well as for a
readback of system status registers. The I2C chip address is 0x28
in write mode and 0x29 in read mode.
Registers values are reset to the default values when the VINx
supply falls below the VVIN_OK falling voltage threshold. The I2C
registers also reset when the battery is disconnected and VIN is 0 V.
The subaddress content selects which of the ADP5061 registers
is written to first. The ADP5061 sends an acknowledgement to
MASTER STOP
0 = WRITE
ST
0
0
1
0
1
0
0
0
0
0
0
SP
CHIP ADDRESS
SUBADDRESS
ADP5061 RECEIVES
DATA
Figure 34. I2C Single Register Write Sequence
MASTER STOP
0 = WRITE
ST
0
0
1
0
1
0
0
0
0
0
0
0
SP
0
CHIP ADDRESS
SUBADDRESS
REGISTER N
ADP5061 RECEIVES
DATA TO REGISTER N
ADP5061 RECEIVES
DATA TO REGISTER N + 1
ADP5061 RECEIVES
DATA TO LAST REGISTER
Figure 35. I2C Multiple Register Write Sequence
MASTER
STOP
0 = WRITE
1 = READ
0
0
1
0
1
0
0
0
0
0
0
0
1
0
1
0
0
1
0
0
1
SP
ST
ST
ADP5061 SENDS
DATA
CHIP ADDRESS
CHIP ADDRESS
SUBADDRESS
Figure 36. I2C Single Register Read Sequence
MASTER
STOP
1 = READ
0 = WRITE
0
0
1
0
1
0
0
0
0
0
0
0
1
0
1
0
0
1
0
0
0
0
1
SP
ST
ST
SUBADDRESS
REGISTER N
ADP5061 SENDS
DATA OF REGISTER N
ADP5061 SENDS
DATA OF REGISTER
N + 1
CHIP ADDRESS
CHIP ADDRESS
ADP5061 SENDS
DATA OF LAST
REGISTER
Figure 37. I2C Multiple Register Read Sequence
Rev. 0 | Page 25 of 44
ADP5061
Data Sheet
I2C REGISTER MAP
See the Factory Programmable Options section for programming option details. Note that a blank cell indicates a bit that is not used.
Table 17. I2C Register Map
Register
Addr. Name
D7
D6
D5
D4
D3
D2
D1
D0
0x00 Manufac-
turer and
MANUF
Model
model ID
0x01 Silicon
revision
REV
0x02 VINx pins
settings
ILIM1
0x03 Termination
settings
VTRM1, 2
CHG_VLIM[1:0] 1, 2
ITRK_DEAD1
0x04 Charging
current
ICHG1, 2
0x05 Voltage
thresholds
DIS_RCH1, 3
VRCH1
EN_TEND1
VTRK_DEAD1, 3
VWEAK1
0x06 Timer
settings
EN_CHG_TIMER1 CHG_TMR_PERIOD1 EN_WD1, 3
WD_PERIOD1 RESET_WD
EN_CHG1
0x07 Functional
Settings 1
DIS_IC11
EN_BMON1
EN_THR1
DIS_LDO1
EN_EOC1
0x08 Functional EN_JEITA1, 3 JEITA_SELECT1, 3
Settings 2
EN_CHG_VLIM1, 3
IDEAL_DIODE[1:0]1, 3
VSYSTEM[2:0]1, 3
0x09 Interrupt
enable
EN_THERM_LIM_INT EN_WD_INT
EN_TSD_INT
TSD_INT
EN_THR_INT
THR_INT
EN_BAT_INT EN_CHG_INT EN_VIN_INT
BAT_INT CHG_INT VIN_INT
0x0A Interrupt
active
THERM_LIM_INT
VIN_OK
WD_INT
VIN_ILIM
0x0B Charger
Status 1
VIN_OV
THERM_LIM
CHDONE
CHARGER_STATUS
BATTERY_STATUS
0x0C Charger
Status 2
THR_STATUS
RCH_LIM_INFO
BAT_SHR1
0x0D Fault
register
TSD 130°C1
VBAT_SHR1
TSD 140°C1
0x10 Battery
short
TBAT_SHR1
IEND1, 3
0x11 IEND
C/20 EOC1
C/10 EOC1
C/5 EOC1
SYS_EN_SET1, 3
1 These bits reset to default I2C values when VINx is connected or disconnected.
2 The default I2C values of these bits are partially factory programmable.
3 The default I2C values of these bits are fully factory programmable.
Rev. 0 | Page 26 of 44
Data Sheet
ADP5061
REGISTER BIT DESCRIPTIONS
In Table 18 through Table 33, the following abbreviations are used: R is read only, W is write only, R/W is read/write, and N/A means not
applicable.
Table 18. Manufacturer and Model ID, Register Address 0x00
Bit No.
Bit Name
Access
Default
Description
[7:4]
MANUF[3:0]
MODEL[3:0]
R
R
0001
The 4-bit manufacturer identification bus
The 4-bit model identification bus
[3:0]
1001
Table 19. Silicon Revision Register, Register Address 0x01
Bit No.
Bit Name
Not used
REV[3:0]
Access
Default
Description
[7:4]
R
R
[3:0]
0100
The 4-bit silicon revision identification bus
Table 20. VINx Settings Register, Register Address 0x02
Bit No.
[7:5]
4
Bit Name
Not used
RFU
Access
Default
Description
R
R/W
R/W
0
Reserved for future use.
[3:0]
ILIM[3:0]
0000 = 100 mA
VINx input current-limit programming bus. The current into VINx can
be limited to the following programmed values:
0000 = 100 mA.
0001 = 150 mA.
0010 = 200 mA.
0011 = 250 mA.
0100 = 300 mA.
0101 = 400 mA.
0110 = 500 mA.
0111 = 600 mA.
1000 = 700 mA.
1001 = 800 mA.
1010 = 900 mA.
1011 = 1000 mA.
1100 = 1200 mA.
1101 = 1500 mA.
1110 = 1800 mA.
1111 = 2100 mA.
Rev. 0 | Page 27 of 44
ADP5061
Data Sheet
Table 21. Termination Settings, Register Address 0x03
Bit No. Bit Name
Access
Default
Description
[7:2] VTRM[5:0]
R/W
100011 = 4.20 V Termination voltage programming bus. The values of the float voltage can be
programmed to the following values:
001111 = 3.80 V.
010000 = 3.82 V.
010001 = 3.84 V.
010010 = 3.86 V.
010011 = 3.88 V.
010100 = 3.90 V.
010101 = 3.92 V.
010110 = 3.94 V.
010111 = 3.96 V.
011000 = 3.98 V.
011001 = 4.00 V.
011010 = 4.02 V.
011011 = 4.04 V.
011100 = 4.06 V.
011101 = 4.08 V.
011110 = 4.10 V.
011111 = 4.12 V.
100000 = 4.14 V.
100001 = 4.16 V.
100010 = 4.18 V.
100011 = 4.20 V.
100100 = 4.22 V.
100101 = 4.24 V.
100110 = 4.26 V.
100111 = 4.28 V.
101000 = 4.30 V.
101001 = 4.32 V.
101010 = 4.34 V.
101011 = 4.36 V.
101100 = 4.38 V.
101101 = 4.40 V.
101110 = 4.42 V.
101111 = 4.44 V.
110000 = 4.44 V.
110001 = 4.46 V.
110010 = 4.48 V.
110011 to 111111 = 4.50 V.
[1:0]
CHG_VLIM[1:0] R/W
10 = 3.7 V
Charging voltage limit programming bus. The values of the charging voltage
limit can be programmed to the following values:
00 = 3.2 V.
01 = 3.4 V.
10 = 3.7 V.
11 = 3.8 V.
Rev. 0 | Page 28 of 44
Data Sheet
ADP5061
Table 22. Charging Current Settings, Register Address 0x04
Bit No.
Bit Name
Not used
Not used
ICHG[4:0]
Access
Default
Description
7
R
6
R
[5:2]
R/W
01110 = 750 mA
Fast charge current programming bus. The values of the constant
current charge can be programmed to the following values:
00000 = 50 mA.
00001 = 100 mA.
00010 = 150 mA.
00011 = 200 mA.
00100 = 250 mA.
00101 = 300 mA.
00110 = 350 mA.
00111 = 400 mA.
01000 = 450 mA.
01001 = 500 mA.
01010 = 550 mA.
01011 = 600 mA.
01100 = 650 mA.
01101 = 700 mA.
01110 = 750 mA.
01111 = 800 mA.
10000 = 850 mA.
10001 = 900 mA.
10010 = 950 mA.
10011 = 1000 mA.
10100 = 1050 mA.
10101 = 1100 mA.
10110 = 1200 mA.
10111 to 11111 = 1300 mA.
[1:0]
ITRK_DEAD[1:0]
R/W
10 = 20 mA
Trickle and weak charge current programming bus. The values of
the trickle and weak charge currents can be programmed to the
following values:
00 = 5 mA.
01 = 10 mA.
10 = 20 mA.
11 = 80 mA.
Table 23. Voltage Thresholds, Register Address 0x05
Bit No.
Bit Name
Access
Default
Description
7
DIS_RCH
R/W
0 = recharge
enabled
0 = recharge enabled.
1 = recharge disabled.
[6:5]
VRCH[1:0]
R/W
11 = 260 mV
Recharge voltage programming bus. The values of the recharge
threshold can be programmed to the following values (note that
the recharge cycle can be disabled in I2C by the DIS_RCH bit):
00 = 80 mV.
01 = 140 mV.
10 = 200 mV.
11 = 260 mV.
Rev. 0 | Page 29 of 44
ADP5061
Data Sheet
Bit No.
Bit Name
VTRK_DEAD[1:0]
Access
Default
Description
[4:3]
R/W
01 = 2.5 V
Trickle to fast charge dead battery voltage programming bus. The
values of the trickle to fast charge threshold can be programmed to
the following values:
00 = 2.0 V.
01 = 2.5 V.
10 = 2.6 V.
11 = 2.9 V.
[2:0]
VWEAK[2:0]
R/W
011 = 3.0 V
Weak battery voltage rising threshold.
000 = 2.7 V.
001 = 2.8 V.
010 = 2.9 V.
011 = 3.0 V.
100 = 3.1 V.
101 = 3.2 V.
110 = 3.3 V.
111 = 3.4 V.
Table 24. Timer Settings, Register Address 0x06
Bit No.
[7:6]
5
Bit Name
Not used
EN_TEND
Access
Default
Description
R/W
1
0 = charge complete timer, tEND, disabled. A 31 ms deglitch timer
remains on.
1 = charge complete timer enabled.
4
3
EN_CHG_TIMER
R/W
R/W
1
1
0 = trickle/fast charge timer disabled.
1 = trickle/fast charge timer enabled.
CHG_TMR_PERIOD
Trickle and fast charge timer period.
0 = 30 sec trickle charge timer and 300 minute fast charge timer.
1 = 60 sec trickle charge timer and 600 minute fast charge timer.
2
1
EN_WD
R/W
R/W
0
0
0 = watchdog timer is disabled even when BAT_SNS exceeds VDEAD
1 = watchdog timer safety timer is enabled.
.
WD_PERIOD
Watchdog safety timer period.
0 = 32 sec watchdog timer and 40 minute safety timer.
1 = 64 sec watchdog timer and 40 minute safety timer.
0
RESET_WD
W
0
When RESET_WD is set to logic high by I2C, the watchdog safety
timer is reset.
Table 25. Functional Settings 1, Register Address 0x07
Bit No.
Bit Name
Not used
DIS_IC1
Access
Default
Description
7
6
R/W
0
0
0 = normal operation.
1 = the ADP5061 is disabled, VVIN must be VISO_B < VVIN < 5.5 V.
5
4
3
EN_BMON
R/W
0 = when VVIN < VVIN_OK, the battery monitor is disabled. When VVIN
4.0 to 6.7 V, the battery monitor is enabled regardless of the
EN_BMON state.
1 = the battery monitor is enabled even when the voltage at the
VINx pins is below VVIN_OK
=
.
EN_THR
R/W
R/W
0
0
0 = when VVIN < VVIN_OK, the THR current source is disabled. When
VVIN = 4.0 V to 6.7 V, the THR current source is enabled regardless of
the EN_THR state.
1 = THR current source is enabled even when the voltage at the
VINx pins is below VVIN_OK
.
DIS_LDO
0 = LDO is enabled.
1 = LDO is off. In addition, If EN_CHG = low, the battery isolation
FET is on. If EN_CHG = high, the battery isolation FET is off.
Rev. 0 | Page 30 of 44
Data Sheet
ADP5061
Bit No.
Bit Name
Access
Default
Description
2
EN_EOC
R/W
1
0 = end of charge not allowed.
1 = end of charge allowed.
1
0
Not used
EN_CHG
R/W
0
0 = battery charging is disabled.
1 = battery charging is enabled.
Table 26. Functional Settings 2, Register Address 0x08
Bit No.
Bit Name
Access
Default
Description
7
EN_JEITA
R/W
0 = JEITA disabled
0 = JEITA compliance of the Li-Ion temperature battery charging
specifications is disabled.
1 = JEITA compliance enabled.
0 = JEITA1 is selected.
1 = JEITA2 is selected.
6
5
JEITA_SELECT
EN_CHG_VLIM
R/W
R/W
0 = JEITA1
0
0 = charging voltage limit disabled.
1 = voltage limit activated. The charger prevents charging until the
battery voltage drops below the VCHG_VLIM threshold.
[4:3]
[2:0]
IDEAL_DIODE[1:0]
VSYSTEM[2:0]
R/W
R/W
00
00 = ideal diode operates always when VISO_S < VISO_B.
01 = ideal diode operates when VISO_S < VISO_B and VBAT_SNS > VWEAK
10 = ideal diode is disabled.
.
11 = ideal diode is disabled.
000 = 4.3 V
System voltage programming bus. The values of the system voltage
can be programmed to the following values:
000 = 4.3 V.
001 = 4.4 V.
010 = 4.5 V.
011 = 4.6 V.
100 = 4.7 V.
101 = 4.8 V.
110 = 4.9 V.
111 = 5.0 V.
Table 27. Interrupt Enable Register, Register Address 0x09
Bit No.
Mnemonic
Access
Default
Description
7
6
Not used
EN_THERM_LIM_INT R/W
0
0
0
0
0
0
0
0 = isothermal charging interrupt is disabled.
1 = isothermal charging interrupt is enabled.
0 = watchdog alarm interrupt is disabled.
5
4
3
2
1
0
EN_WD_INT
EN_TSD_INT
EN_THR_INT
EN_BAT_INT
EN_CHG_INT
EN_VIN_INT
R/W
R/W
R/W
R/W
R/W
R/W
1 = watchdog alarm interrupt is enabled.
0 = overtemperature interrupt is disabled.
1 = overtemperature interrupt is enabled.
0 = THR temperature thresholds interrupt is disabled.
1 = THR temperature thresholds interrupt is enabled.
0 = battery voltage thresholds interrupt is disabled.
1 = battery voltage thresholds interrupt is enabled.
0 = charger mode change interrupt is disabled.
1 = charger mode change interrupt is enabled.
0 = VINx pin voltage thresholds interrupt is disabled.
1 = VINx pin voltage thresholds interrupt is enabled.
Rev. 0 | Page 31 of 44
ADP5061
Data Sheet
Table 28. Interrupt Active Register, Register Address 0x0A
Bit No.
Mnemonic
Access
Default Description
7
6
5
Not used
THERM_LIM_INT
WD_INT
R
R
0
0
1 = indicates an interrupt caused by isothermal charging.
1 = indicates an interrupt caused by the watchdog alarm. The
watchdog timer expires within 2 sec or 4 sec, depending on the
watch dog period setting of 32 sec or 64 sec, respectively.
4
3
2
TSD_INT
THR_INT
BAT_INT
R
R
R
0
0
0
1 = indicates an interrupt caused by an overtemperature fault.
1 = indicates an interrupt caused by THR temperature thresholds.
1 = indicates an interrupt caused by battery voltage thresholds.
1
0
CHG_INT
VIN_INT
R
R
0
0
1 = indicates an interrupt caused by a charger mode change.
1 = indicates an interrupt caused by VIN voltage thresholds.
Table 29. Charger Status Register 1, Register Address 0x0B
Bit No.
Mnemonic
Access
Default Description
7
6
5
VIN_OV
R
R
R
N/A
N/A
N/A
1 = indicates that the voltage at the VINx pins exceeds VVIN_OV
.
.
VIN_OK
1 = indicates that the voltage at the VINx pins exceeds VVIN_OK
VIN_ILIM
1 = indicates that the current into a VINx pin is limited by the high
voltage blocking FET and the charger is not running at the full
programmed ICHG
.
4
3
THERM_LIM
CHDONE
R
R
N/A
N/A
1 = indicates that the charger is not running at the full
programmed ICHG but is limited by the die temperature.
1 = indicates the end of charge cycle has been reached. This bit
latches on, in that it does not reset to low when the VRCH threshold
is breached.
[2:0]
CHAGER_STATUS[2:0]
R
N/A
Charger status bus.
000 = off.
001 = trickle charge.
010 = fast charge (CC mode).
011 = fast charge (CV mode).
100 = charge complete.
101 = LDO mode.
110 = trickle or fast charge timer expired.
111 = battery detection.
Rev. 0 | Page 32 of 44
Data Sheet
ADP5061
Table 30. Charger Status Register 2, Register Address 0x0C
Bit No.
Mnemonic
Access Default
Description
[7:5]
THR_STATUS[2:0]
R
N/A
THR pin status.
000 = off.
001 = battery cold.
010 = battery cool.
011 = battery warm.
100 = battery hot.
111 = thermistor OK.
4
3
Not used
R
R
N/A
N/A
RCH_LIM_INFO
The recharge limit information function is activated when DIS_RCH
is logic high and the CHARGER_STATUS[2:0] = 100 (binary). The
status bit informs the system that a recharge cycle is required.
0 = VBAT_SNS > VRCH
1 = VBAT_SNS < VRCH
.
.
2:0
BATTERY_STATUS[2:0]
R
Battery status bus.
000 = battery monitor off.
001 = no battery.
010 = VBAT_SNS < VTRK
.
011 = VTRK ≤ VBAT_SNS < VWEAK
.
100 = VBAT_SNS ≥ VWEAK
.
Table 31. Fault Register1, Register Address 0x0D
Bit No.
Mnemonic
Not used
BAT_SHR
Not used
TSD 130°C
TSD 140°C
Access Default
Description
[7:4]
3
2
1
0
R/W
R/W
R/W
R/W
0
1 = indicates detection of a battery short.
0
0
1 = indicates an overtemperature (lower) fault.
1 = indicates an overtemperature fault.
1 To reset the fault bits in the fault register, cycle power on VINx or write high to the corresponding I2C bit.
Table 32. Battery Short, Register Address 0x10
Bit No.
Mnemonic
Access Default
Description
[7:5]
TBAT_SHR[2:0]
R/W
100 = 30 sec
Battery short timeout timer.
000 = 1 sec.
001 = 2 sec.
010 = 4 sec.
011 = 10 sec.
100 = 30 sec.
101 = 60 sec.
110 = 120 sec.
111 = 180 sec.
[4:3]
[2:0]
Not used
R/W
R/W
VBAT_SHR[2:0]
100 = 2.4 V
Battery short voltage threshold level.
000 = 2.0 V.
001 = 2.1 V.
010 = 2.2 V.
011 = 2.3 V.
100 = 2.4 V.
101 = 2.5 V.
110 = 2.6 V.
111 = 2.7 V.
Rev. 0 | Page 33 of 44
ADP5061
Data Sheet
Table 33. IEND Register, Register Address 0x11
Bit No. Mnemonic
Access Default
Description
[7:5]
IEND[2:0]
R/W
010 = 52.5 mA
Termination current programming bus. The values of the termination current can
be programmed to the following values:
000 = 12.5 mA.
001 = 32.5 mA.
010 = 52.5 mA.
011 = 72.5 mA.
100 = 92.5 mA.
101 = 117.5 mA.
110 = 142.5 mA.
111 = 170.0 mA.
4
3
C/20 EOC
C/10 EOC
R/W
R/W
The C/20 EOC bit has priority over the other settings (C/10 EOC, C/5 EOC, and IEND).
1 = the termination current is ICHG/20 with the following limitations:
Minimum value = 12.5 mA.
Maximum value = 170 mA.
The C/10 EOC bit has priority over the other termination current settings (IEND),
but does not have priority over the C/20 EOC setting.
1 = the termination current is ICHG/10 unless C/20 EOC is high. The termination
current is limited to the following values:
Minimum value = 12.5 mA.
Maximum value = 170 mA.
2
C/5 EOC
R/W
The C/5 bit has priority over the other termination current settings (IEND), but
does not have priority over the C/20 EOC setting or the C/10 EOC setting.
1 = the termination current is ICHG / 5 unless the C/20 or the C/10 EOC is high.
The termination current is limited to the following values:
Minimum value = 12.5 mA.
Maximum value = 170 mA.
1:0
SYS_EN_SET[1:0] R/W
0
Selects the operation of the system enable pin (SYS_EN).
00 = SYS_EN is activated when LDO is active and the system voltage is available.
01 = SYS_EN activated by ISO_Bx voltage, the battery charging mode.
10 = SYS_EN is activated and the isolation FET is disabled when the battery drops
1
below VWEAK
.
11 = SYS_EN is active in LDO mode when the charger is disabled. SYS_EN is active
in the charging mode when VISO_B ≥ VWEAK
.
1 This option is active when VINx = 0 V and the battery monitor is activated from Register 0x07, Bit D5 (EN_BMON).
Rev. 0 | Page 34 of 44
Data Sheet
ADP5061
APPLICATIONS INFORMATION
Substituting these values in the equation yields
EFF = 34.3 μF × (1 − 0.15) × (1 − 0.2) ≈ 20.7 μF
EXTERNAL COMPONENTS
C
ISO_Sx (VOUT) Capacitor Selection
To guarantee the performance of the charger in various operation
modes including trickle charge, constant current charge, and
constant voltage charge, it is imperative that the effects of dc
bias, temperature, and tolerances on the behavior of the capaci-
tors be evaluated for each application.
To obtain stable operation of the ADP5061 in a safe way, the
combined effective capacitance of the ISO_Sx capacitor and the
system capacitance must not be less than 20 µF and must not
exceed 100 µF at any point during operation.
When choosing the capacitor value, it is also important to
account for the loss of capacitance due to the output voltage
dc bias. Ceramic capacitors are manufactured with a variety of
dielectrics, each with a different behavior over temperature and
applied voltage. Capacitors must have a dielectric that is adequate
to ensure the minimum capacitance over the necessary
temperature range and dc bias conditions. X5R or X7R dielectrics
with a voltage rating of 6.3 V or higher are recommended for best
performance. Y5V and Z5U dielectrics are not recommended
for use with any dc-to-dc converter because of their poor
temperature and dc bias characteristics.
Splitting ISO_Sx Capacitance
In many applications, the total ISO_Sx capacitance consists of a
number of capacitors. The system voltage node (ISO_Sx) usually
supplies a single regulator or a number of ICs and regulators,
each of which requires a capacitor close to its power supply
input (see Figure 39).
The capacitance close to the ADP5061 ISO_Sx output should be
at least 10 µF, as long as the total effective capacitance is at least
20 µF at any point during operation.
The worst-case capacitance accounting for capacitor variation
over temperature, component tolerance, and voltage is calcu-
lated using the following equation:
ISO_Sx
VIN1
C
≥10µF
ISO_S
C
IN1
IC1
ADP5061
C
EFF = COUT × (1 − TEMPCO) × (1 − TOL)
where:
EFF is the effective capacitance at the operating voltage.
SUM OF EFFECTIVE
CAPACITANCES
C
ON ISO_Sx NODE ≥ 20µF
TEMPCO is the worst-case capacitor temperature coefficient.
TOL is the worst-case component tolerance.
+
C
ISO_B
≥10µF
VIN2
IC2
In this example, the worst-case temperature coefficient
(TEMPCO) over the −40°C to +85°C temperature range is
assumed to be 15% for an X7R dielectric. The tolerance of the
capacitor (TOL) is assumed to be 20%, and COUT is 30.4 μF at
5.0 V, as shown in Figure 38.
C
IN2
Figure 39. Splitting ISO_Sx Capacitance
60
ISO_Bx Capacitor Selection
The ISO_Bx effective capacitance (including temperature and
dc bias effects) must not be less than 10 µF at any point during
operation. Typically, a nominal capacitance of 22 µF is required
to fulfill the condition at all points of operation. Suggestions for
an ISO_Bx capacitor are listed in Table 35.
55
50
45
40
35
30
25
20
CBP Capacitor Selection
The internal supply voltage of the ADP5061 is equipped with a
noise suppressing capacitor at the CBP terminal. Do not allow CBP
capacitance to exceed 14 nF at any point during operation. Do
not connect any external voltage source, any resistive load, or
any other current load to the CBP terminal. Suggestions for a
CBP capacitor are listed in Table 36.
0
1
2
3
4
5
DC BIAS VOLTAGE (V)
Figure 38. Murata GRM32ER61A476ME20C Capacitance vs. Bias Voltage
Rev. 0 | Page 35 of 44
ADP5061
Data Sheet
VINx Capacitor Selection
Table 34. ISO_Sx Capacitor Suggestions
According to the USB 2.0 specification, USB peripherals have a
detectable change in capacitance on VBUS when they are attached
to a USB port. The peripheral device VBUS bypass capacitance
must be at least 1 µF but not larger than 10 µF.
Vendor Part Number
Value
47 µF
47 µF
Voltage Size
Murata GRM32ER61A476ME20
10 V
10 V
1210
1210
TDK
C3225X5R1A476M
Table 35. ISO_Bx Capacitor Suggestions
Vendor Part Number
The VINx input of the ADP5061 is tolerant of voltages as high
as 20 V; however, if an application requires exposing the VINx
input to voltages of up to 20 V, the voltage range of the capacitor
must also be above 20 V. Suggestions for a VINx capacitor are
given in Table 37.
Value
22 μF
22 μF
22 µF
22 µF
Voltage Size
Murata
Murata
TDK
GRM31CR61A226KE19
10 V
6.3 V
6.3 V
6.3 V
1206
1206
1206
1206
GRM31CR60J226ME19
C3216X5R0J226M
JMK316ABJ226KL
Taiyo-
Yuden
When using ceramic capacitors, a higher voltage range is usually
achieved by selecting a component with larger physical dimen-
sions. In applications where lower than 20 V at VINx input
voltages can be guaranteed, smaller output capacitors can be
used accordingly.
Table 36. CBP Capacitor Suggestions
Vendor Part Number Value Voltage Size
Murata
TDK
GRM15XR71C103KA86
C1005X7R1C103K
10 nF
10 nF
16 V
16 V
0402
0402
Table 37. VINx Capacitor Suggestions
Vendor Part Number Value Voltage Size
Murata
TDK
GRM21BR61E106MA73 10 µF
C2012X5R1E106K 10 µF
25 V
25 V
0805
0805
Rev. 0 | Page 36 of 44
Data Sheet
ADP5061
PCB LAYOUT GUIDELINES
VIN = 4V TO 6.7V
C4
10µF
GRM21BR61E106MA73
E3
C3 D3
VIN1:3
ISO_S1:3
B3
CBP
C2
D2
E2
C1
10nF
GRM15XR71C103KA86
C3
47µF
GRM32ER61A476ME20
VDDIO
R1
1.5kΩ
R2
1.5kΩ
CHARGER
CONTROL
BLOCK
A4
A3
TO MCU
TO MCU
SCL
SDA
C1
E4
C4
B4
D1
E1
TO MCU/NC
DIG_IO1
DIG_IO2
DIG_IO3
TO MCU/NC
TO MCU/NC
CONNECT
CLOSE TO
BATTERY +
ISO_B1:3
D4
B2
BAT_SNS
THR
VDDIO
R4
10kΩ
C2
22µF
R5 NTC 10kΩ
(OPTIONAL)
GRM31CR60J226ME19
SYS_EN
ILED
A2
A1
TO MCU
VLED
AGND
B1
ADP5061 WLCSP20
Figure 40. Reference Circuit Diagram
ISO_S
ISO_B
C
47µF
C
22µF
ISO_S
ISO_B
PGND
PGND
ADP5061
C
10µF
VIN
VIN
8mm
Figure 41. Reference PCB Floor Plan
Rev. 0 | Page 37 of 44
ADP5061
Data Sheet
POWER DISSIPATION AND THERMAL CONSIDERATIONS
P
ISOFET = RDSON_ISO × ICHG
(4)
CHARGER POWER DISSIPATION
where:
When the ADP5061 charger operates at high ambient tempera-
tures and at maximum current charging and loading conditions,
the junction temperature can reach the maximum allowable
operating limit of 125°C.
R
DSON_ISO is the on resistance of the battery isolation FET
(typically 110 mΩ during charging).
The thermal control loop of the ADP5061 automatically limits
the charge current to maintain a die temperature below TLIM
(typically 115°C).
When the junction temperature exceeds 140°C, the ADP5061
turns off, allowing the device to cool down. When the die
temperature falls below 110°C and the TSD 140°C fault bit in
Register 0x0D is cleared by an I2C write, the ADP5061 resumes
normal operation.
The most intuitive and practical way to calculate the power
dissipation in the ADP5061 device is to measure the power
dissipated at the input and all of the outputs. Perform the
measurements at the worst-case conditions (voltages, currents,
and temperature). The difference between input and output
power is the power that is dissipated in the device.
This section provides guidelines to calculate the power dissi-
pated in the device to ensure that the ADP5061 operates below
the maximum allowable junction temperature.
JUNCTION TEMPERATURE
To determine the available output current in different operating
modes under various operating conditions, the user can reference
the following equations:
In cases where the board temperature, TA, is known, the
thermal resistance parameter, θJA, can be used to estimate the
junction temperature rise. TJ is calculated from TA and PD using
the formula
PD = PLDOFET + PISOFET
(1)
where:
TJ = TA + (PD × θJA)
(5)
P
P
LDOFET is the power dissipated in the input LDO FET.
ISOFET is the power dissipated in the battery isolation FET.
The typical θJA value for the 20-bump WLCSP is 46.8°C/W (see
Table 5). A very important factor to consider is that θJA is based
on a 4-layer, 4 in × 3 in, 2.5 oz. copper board as per JEDEC
standard, and real applications may use different sizes and
layers. It is important to maximize the copper to remove the heat
from the device. Copper exposed to air dissipates heat better
than copper used in the inner layers.
Calculate the power dissipation in the LDO FET and the battery
isolation FET using Equation 2 and Equation 3.
P
P
LDOFET = (VIN – VISO_S) × (ICHG + ILOAD
ISOFET = (VISO_S – VISO_B) × ICHG
)
(2)
(3)
where:
V
V
V
IN is the input voltage at the VINx pins.
ISO_S is the system voltage at the ISO_Sx pins.
ISO_B is the battery voltage at the ISO_Bx pins.
If the case temperature can be measured, the junction temperature
is calculated by
TJ = TC + (PD × θJC)
(6)
I
I
CHG is the battery charge current.
LOAD is the system load current from the ISO_Sx pins.
where TC is the case temperature and θJC is the junction-to-case
thermal resistance provided in Table 5.
LDO Mode
For a WLCSP device, where possible, remove heat from every
current carrying bump (VINx, ISO_Sx, and ISO_Bx). For
example, thermal vias to the board power planes can be placed
close to these pins, where available.
The system regulation voltage is user programmable from 4.3 V
to 5.0 V. In LDO mode (charging disabled, EN_CHG = low),
calculation of the total power dissipation is simplified, assuming
that all current is drawn from the VINx pins and the battery is
not shared with ISO_Sx.
The reliable operation of the charger can be achieved only if the
estimated die junction temperature of the ADP5061 (Equation 5)
is less than 125°C. Reliability and mean time between failures
(MTBF) are greatly affected by increasing the junction temperature.
Additional information about product reliability can be found in
the ADI Reliability Handbook located at the following URL:
www.analog.com/reliability_handbook.
PD = (VIN – VISO_S) × ILOAD
Charging Mode
In charging mode, the voltage at the ISO_Sx pins depends on
the battery level. When the battery voltage is lower than VISO_SFC
(typically 3.8 V), the voltage drop over the battery isolation FET
is higher and the power dissipation must be calculated using
Equation 3. When the battery voltage level reaches VISO_SFC, the
power dissipation can be calculated using Equation 4.
Rev. 0 | Page 38 of 44
Data Sheet
ADP5061
FACTORY PROGRAMMABLE OPTIONS
CHARGER OPTIONS
Table 38 to Table 50 list the factory programmable options of the ADP5061. In each of these tables, the selection column represents the
default setting of Model ADP5061ACBZ-2-R7.
Table 38. Default Termination Voltage
Table 42. Default System Voltage
Option
Selection
Option
Selection
000 = 4.20 V
010 = 3.70 V
011 = 3.80 V
100 = 3.90 V
101 = 4.00 V
110 = 4.10 V
111 = 4.40 V
000 = 4.20 V
000 = 4.3 V
001 = 4.4 V
010 = 4.5 V
011 = 4.6 V
100 = 4.7 V
101 = 4.8 V
110 = 4.9 V
111 = 5.0 V
111 = 5.0 V
Table 39. Default Fast Charge Current
Table 43. Thermistor Resistance
Option
Option
Selection
Selection
000 = 500 mA
001 = 300 mA
010 = 550 mA
011 = 600 mA
100 = 750 mA
101 = 900 mA
110 = 1300 mA
111 = 1300 mA
0 = 10 kΩ
1 = 100 kΩ
0 = 10 kΩ
Table 44. Thermistor Beta Value
100 = 750 mA
Option
Selection
0100 = 3150
0101 = 3350
0110 = 3500
0111 = 3650
1000 = 3850
1001 = 4000
1010 = 4200
1011 = 4400
0100 = 3150
Table 40. Default End of Charge Current
Option
Selection
000 = 52.5 mA
001 = 72.5 mA
010 = 12.5 mA
011 = 32.5 mA
100 = 142.5 mA
101 = 167.5 mA
110 = 92.5 mA
111 = 117.5 mA
000 = 52.5 mA
Table 45. DIS_IC1 Mode Select
Option
Selection
0 = DIC_IC1 mode select, VINx current = 280 µA,
ISO_B can float, no leak to ISO_Bx
1 = DIC_IC1 mode select, VINx current = 110 µA,
supply switch leaks from VINx to ISO_Bx
0
Table 46. Trickle or Fast Charge Timer Fault Operation
Table 41. Default Trickle to Fast Charge Threshold
Option
Selection
Option
Selection
0 = after timeout LDO off, charging off
00 = 2.5 V
01 = 2.0 V
10 = 2.9 V
11 = 2.6 V
00 = 2.5 V
1 = after timeout LDO mode active, charging
off
1 = LDO mode
active
Rev. 0 | Page 39 of 44
ADP5061
Data Sheet
I2C REGISTER DEFAULTS
Table 47. I2C Register Default Settings
Bit Name
CHG_VLIM
DIS_RCH
I2C Register Address, Bit Location
Option
Selection
Address 0x03, Bits[D1:D0]
Address 0x05, Bit D7
0 = limit 3.2 V, 1 = limit 3.7 V
0 = recharge enabled, 1 = recharge disabled
0 = limit 3.2 V
0 = recharge
enabled
EN_WD
DIS_IC1
EN_CHG
Address 0x06, Bit D2
Address 0x07, Bit D6
Address 0x07, Bit D0
0 = watchdog disabled, 1 = watchdog enabled
0 = not activated, 1 = activated
0 = charging disabled, 1 = charging enabled
0 = disabled
0 = not activated
0 = charging
disabled
EN_JEITA
JEITA_SELECT
Address 0x08, Bit D7
Address 0x08, Bit D6
0 = JEITA disabled, 1 = JEITA enabled
0 = JEITA1 charging, 1= JEITA2 charging
0 = JEITA disabled
0 = JEITA1
charging
EN_CHG_VLIM
IDEAL_DIODE[1:0] Address 0x08, Bits[D4:D3]
Address 0x08, Bit D5
0 = limit disabled, 1 = limit enabled
00 = ideal diode operates when VISO_S < VISO_B
0 = limit disabled
00
01 = ideal diode operates when VISO_S < VISO_B and
V
BAT_SNS > VWEAK
10 = ideal diode is disabled
11 = ideal diode is disabled
DIGITAL INPUT AND OUTPUT OPTIONS
Table 48. I2C Address 0x11, Bits[D1:D0] SYS_EN Output Default
Option
Selection
00 = SYS_EN is activated when LDO is active and system voltage is available
01 = SYS_EN is activated by ISO_Bx voltage; battery charging mode
00
1
10 = SYS_EN is activated and isolation FET is disabled when battery drops below VWEAK
11 = SYS_EN is active in LDO mode when charger is disabled. SYS_EN is active in charging mode when VISO_B ≥ VWEAK
1 This option is active when VINx = 0 V and battery monitor is activated from Register 0x07, Bit D5 (EN_BMON).
Rev. 0 | Page 40 of 44
Data Sheet
ADP5061
DIG_IO1, DIG_IO2, and DIG_IO3 Options
Table 49. DIG_IO1 Polarity
Option
Selection
0 = DIG_IO1 polarity, high active operation
1 = DIG_IO1 polarity, low active operation
0 = high active
Table 50. DIG_IOx Options
Option DIG_IO1 Function
DIG_IO2 Function
DIG_IO3 Function
Selection
0000
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
IVIN limit, low = 100 mA,
high = 500 mA
IVIN limit, low = 100 mA,
high = 500 mA
IVIN limit, low = 100 mA,
high = 500 mA
IVIN limit, low = 100 mA,
high = 500 mA
IVIN limit, low = 100 mA,
high = 500 mA
IVIN limit, low = 100 mA,
high = 500 mA
low = charging disabled,
high = charging enabled
IVIN limit, low = 100 mA,
high = 500 mA
IVIN limit, low = 100 mA,
high = 500 mA
IVIN limit, low = 100 mA,
high = 500 mA
IVIN limit, low = 100 mA,
high = 500 mA
IVIN limit, low = 100 mA,
high = 500 mA
Disable IC1, low = not activated,
high = activated
Low = charging disabled, high =
charging enabled
Disable IC1, low = not activated,
high = activated
Fast charge current, low = ICHG,
high = ICHG/2
Low = LDO active, high = LDO
disabled
Low = charging disabled, high =
charging enabled
Low = charging disabled, high =
charging enabled
High = disable recharge
Interrupt output
Interrupt output
Interrupt output
Interrupt output
Interrupt output
Interrupt output
Interrupt output
Interrupt output
0000
High = IVIN limit 1500 mA
High = IVIN limit 1500 mA
High = IVIN limit 1500 mA
High = IVIN limit 1500 mA
Disable recharge
Disable IC1, low = not activated,
high = activated
High = IVIN limit 1500 mA
Low = charging disabled,
high = charging enabled
Disable IC1, low = not activated,
high = activated
High = disable recharge
Fast charge current, low = ICHG,
high = ICHG/2
Low = LDO active, high = LDO
disabled
Low = charging disabled,
high = charging enabled
Low = charging disabled,
high = charging enabled
IVIN limit, low = 100 mA,
high = 500 mA
High = IVIN limit 1500 mA
Disable IC1, low = not activated,
high = activated
Rev. 0 | Page 41 of 44
ADP5061
Data Sheet
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
2.035
1.995
1.955
4
3
2
1
A
B
C
D
E
BALL A1
IDENTIFIER
2.635
2.595
2.555
2.00 REF
0.50
REF
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.390
0.360
0.330
1.50 REF
0.660
0.600
0.540
SIDE VIEW
COPLANARITY
0.04
SEATING
PLANE
0.360
0.320
0.280
0.270
0.240
0.210
Figure 42. 20-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-20-9)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2
Temperature Range
–40°C to +125°C
Package Description
20-Ball WLCSP
Evaluation Board
Package Option
CB-20-9
ADP5061ACBZ-2-R7
ADP5061CB-EVALZ
1 Z = RoHS Compliant Part.
2 For additional factory programmable options, contact a local Analog Devices, Inc., sales or distribution representative.
Rev. 0 | Page 42 of 44
Data Sheet
NOTES
ADP5061
Rev. 0 | Page 43 of 44
ADP5061
NOTES
Data Sheet
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10544-0-6/12(0)
www.analog.com/ADP5061
Rev. 0 | Page 44 of 44
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