HMC1048ALC3B [ADI]
2.25 GHz to 18 GHz, MMIC, Double Balanced Downconverter;
| 型号： | HMC1048ALC3B |
| 厂家： | 
ADI |
| 描述： | 2.25 GHz to 18 GHz, MMIC, Double Balanced Downconverter |
| 文件： | 总15页 (文件大小：373K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2.25 GHz to 18 GHz, MMIC,
Double Balanced Downconverter
Data Sheet
HMC1048ALC3B
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Passive: no dc bias required
High input IP3: 20 dBm typical
LO to RF isolation: 25 dB typical
LO to IF isolation: 20 dB typical
RF to IF isolation: 15 dB typical
IF frequency range: dc to 4 GHz
Downconverter applications
3 mm × 3 mm, 12-terminal ceramic leadless chip carrier
package
12 11 10
HMC1048ALC3B
1
2
3
9
8
7
GND
LO
GND
RF
GND
GND
4
5
6
Figure 1.
APPLICATIONS
Ka band transponders
Point to multipoint radios and very small aperture terminal
(VSAT)
Test equipment and sensors
Military end use
GENERAL DESCRIPTION
The HMC1048ALC3B is a general-purpose, monolithic microwave
integrated circuit (MMIC), double balanced mixer that can be used
as a downconverter with dc to 4 GHz at the intermediate frequency
(IF) port and 2.25 GHz to 18 GHz at the radio frequency (RF) port.
The mixer requires no external components or matching circuitry.
The HMC1048ALC3B provides excellent local oscillator (LO) to
RF, LO to IF, and RF to IF isolation. The mixer operates with LO
drive levels from 9 dBm to 17 dBm. The HMC1048ALC3B
eliminates the need for wire bonding and allows the use of surface-
mount manufacturing techniques.
Rev. B
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2018–2019 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
HMC1048ALC3B
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................5
Interface Schematics .....................................................................5
Typical Performance Characteristics ..............................................6
Downconverter Performance ......................................................6
Isolation and Return Loss ......................................................... 10
Spurious and Harmonics Performance ................................... 11
Theory of Operation ...................................................................... 12
Applications Information .............................................................. 13
Evaluation Board ........................................................................ 13
Outline Dimensions....................................................................... 15
Ordering Guide .......................................................................... 15
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
2.25 GHz to 12 GHz Frequency Range...................................... 3
12 GHz to 18 GHz Frequency Range......................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
Solder Profile................................................................................. 4
ESD Caution.................................................................................. 4
REVISION HISTORY
5/2019—Rev. A to Rev. B
Change to Table 5 ............................................................................. 5
7/2018—Rev. 0 to Rev. A
Changes to Figure 8 and Figure 9................................................... 6
Changes to Figure 13, Figure 14, and Figure 15 ........................... 7
Changes to Figure 17, Figure 18, and Figure 20 ........................... 8
Changes to Figure 26 Caption, Figure 27, and Figure 28.......... 10
2/2018—Revision 0: Initial Version
Rev. B | Page 2 of 15
Data Sheet
HMC1048ALC3B
SPECIFICATIONS
2.25 GHz TO 12 GHz FREQUENCY RANGE
The measurements are performed in downconverter mode at TA = 25°C, IF frequency (fIF) = 100 MHz, RF signal power = −10 dBm,
LO power (PLO) = 13 dBm, and lower sideband with a 50 Ω system, unless otherwise noted.
Table 1.
Parameter
Symbol
Min
Typ
Max
Unit
FREQUENCY RANGE
RF Frequency
IF Frequency
fRF
fIF
fLO
2.25
DC
2.25
9
12
4
12
17
GHz
GHz
GHz
dBm
LO Frequency
LO DRIVE LEVEL
RF PERFORMANCE
Downconverter
Conversion Loss
Single Sideband Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
ISOLATION
13
10
10
20
10
14
dB
dB
dBm
dB
SSB NF
IP3
P1dB
RF to IF
LO to RF
LO to IF
8
18
15
15
25
20
dB
dB
dB
12 GHz TO 18 GHz FREQUENCY RANGE
The measurements are performed in downconverter mode at TA = 25°C, fIF = 100 MHz, RF signal power = −10 dBm, PLO = 13 dBm, and
lower sideband with a 50 Ω system, unless otherwise noted.
Table 2.
Parameter
Symbol
Min
Typ
Max
Unit
FREQUENCY RANGE
RF Frequency
IF Frequency
fRF
fIF
fLO
12
DC
12
9
18
4
18
17
GHz
GHz
GHz
dBm
LO Frequency
LO DRIVE LEVEL
RF PERFORMANCE
Downconverter
Conversion Loss
Single Sideband Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
ISOLATION
13
10
10
20
11
14
dB
dB
dBm
dB
SSB NF
IP3
P1dB
RF to IF
LO to RF
LO to IF
6
25
25
20
30
30
dB
dB
dB
Rev. B | Page 3 of 15
HMC1048ALC3B
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
RF Input Power when LO = 18 dBm
LO Input Power
IF Input Power when LO = 18 dBm
IF Port Maximum Sink and Source Current
Maximum Junction Temperature
16 dBm
20 dBm
16 dBm
6 mA
θ
JA is the natural convection junction to ambient thermal
resistance measured in a one-cubic foot sealed enclosure, and
JC is the junction to case thermal resistance.
θ
175°C
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 2.6 mW/°C Above 85°C)
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range
235 mW
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
260°C
E-12-41
120
383
°C/W
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance.
Reflow Temperature
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charge Device Model
(FICDM)
SOLDER PROFILE
Class 1B (750 V)
Class C3 (1.25 kV)
The typical Pb-free reflow solder profile shown in Figure 2 is
based on JEDEC J-STD-20C.
60 SECONDS
TO
150 SECONDS
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
RAMP UP
3°C/SEC MAX
260°C –5°C/+0°C
217°C
150°C TO 200°C
RAMP DOWN
6°C/SECONDS MAX
TIME (Seconds)
60 SECONDS
20 SECONDS
TO 40 SECONDS
TO 180 SECONDS
480 SECONDS MAX
Figure 2. Pb-Free Reflow Solder Profile
ESD CAUTION
Rev. B | Page 4 of 15
Data Sheet
HMC1048ALC3B
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
12 11 10
GND 1
LO 2
9
8
7
GND
RF
HMC1048ALC3B
TOP VIEW
(Not to Scale)
GND 3
GND
4
5
6
NOTES
1. NIC = NOT INTERNALLY CONNECTED.
THESE PINS CAN BE CONNECTED TO RF
AND DC GROUND. PERFORMANCE IS
NOT AFFECTED.
2. EXPOSED PAD MUST BE CONNECTED TO
THE RF AND DC GROUND OF THE PCB.
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 3, 7, 9, 10, 12
GND
Ground. These pins must be connected to RF and dc ground of the PCB. See Figure 4 for the interface
schematic.
2
LO
NIC
IF
Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω. See Figure 5 for the interface schematic.
Not Internally Connected. These pins can be connected to RF and dc ground. Performance is not affected.
Intermediate Frequency Port. For applications not requiring operation to dc, dc block this port externally
using a series capacitor of a value chosen to pass the necessary IF frequency range. For operation to dc, IF
must not source or sink more than 6 mA of current. Otherwise, die malfunction and possible die failure
can result. See Figure 6 for the interface schematic.
4, 6, 11
5
8
RF
Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω. See Figure 7 for the interface
schematic.
EPAD
Exposed Pad. Exposed pad must be connected to the RF and dc ground of the PCB.
INTERFACE SCHEMATICS
GND
IF
Figure 4. GND Interface Schematic
Figure 6. IF Interface Schematic
LO
RF
Figure 5. LO Interface Schematic
Figure 7. RF Interface Schematic
Rev. B | Page 5 of 15
HMC1048ALC3B
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
IF = 100 MHz, Lower Sideband (High-Side LO)
0
0
–4
–4
–8
–8
–12
–16
–12
–16
–20
17dBm
15dBm
13dBm
11dBm
9dBm
+85°C
+25°C
–40°C
–20
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 8. Conversion Loss vs. RF Frequency over Temperature
at fIF = 100 MHz, PLO = 13 dBm
Figure 11. Conversion Loss vs. RF Frequency over LO Drive
at fIF = 100 MHz, TA = 25°C
30
25
20
15
10
30
25
20
15
10
5
17dBm
15dBm
13dBm
11dBm
9dBm
+85°C
+25°C
–40°C
5
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 9. Input IP3 vs. RF Frequency over Temperature
at fIF = 100 MHz, PLO = 13 dBm
Figure 12. Input IP3 vs. RF Frequency over LO Drive at fIF = 100 MHz,
TA = 25°C
20
16
12
8
4
+85°C
+25°C
–40°C
0
2
4
6
8
10
12
14
16
18
RF FREQUENCY (GHz)
Figure 10. Input P1dB vs. RF Frequency over Temperature
at fIF = 100 MHz, PLO = 13 dBm
Rev. B | Page 6 of 15
Data Sheet
HMC1048ALC3B
IF = 500 MHz, Lower Sideband (High-Side LO)
0
–4
0
9dBm
11dBm
13dBm
15dBm
17dBm
–4
–8
–8
–12
–16
–20
–12
–16
–20
+85°C
+25°C
–40°C
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 15. Conversion Loss vs. RF Frequency over LO Drive at fIF = 500 MHz,
Figure 13. Conversion Loss vs. RF Frequency over Temperature
at fIF = 500 MHz, PLO = 13 dBm
T
A = 25°C
30
25
20
15
10
5
30
25
20
15
10
17dBm
15dBm
13dBm
11dBm
9dBm
+85°C
+25°C
–40°C
5
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 16. Input IP3 vs. RF Frequency over LO Drive at fIF = 500 MHz, TA = 25°C
Figure 14. Input IP3 vs. RF Frequency over Temperature
at fIF = 500 MHz, PLO = 13 dBm
Rev. B | Page 7 of 15
HMC1048ALC3B
Data Sheet
IF = 1500 MHz, Lower Sideband (High-Side LO)
0
0
–4
17dBm
15dBm
13dBm
11dBm
9dBm
–4
–8
–8
–12
–16
–12
–16
–20
+85°C
+25°C
–40°C
–20
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 17. Conversion Loss vs. RF Frequency over Temperature
at fIF = 1500 MHz, PLO = 13 dBm
Figure 20. Conversion Loss vs. RF Frequency over LO Drive
at fIF = 1500 MHz, TA = 25°C
30
30
25
20
15
10
25
20
15
10
5
17dBm
15dBm
13dBm
11dBm
9dBm
+85°C
+25°C
–40°C
5
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 18. Input IP3 vs. RF Frequency over Temperature
at fIF = 1500 MHz, PLO = 13 dBm
Figure 21. Input IP3 vs. RF Frequency over LO Drive at fIF = 1500 MHz,
A = 25°C
T
20
16
12
8
4
+85°C
+25°C
–40°C
0
2
4
6
8
10
12
14
16
18
RF FREQUENCY (GHz)
Figure 19. Input P1dB vs. RF Frequency over Temperature
at fIF = 1500 MHz, PLO = 13 dBm
Rev. B | Page 8 of 15
Data Sheet
HMC1048ALC3B
IF Bandwidth
0
0
–4
17dBm
15dBm
13dBm
11dBm
9dBm
–4
–8
–8
–12
–16
–12
–16
–20
+85°C
+25°C
–40°C
–20
500
1000
1500
2000
2500
3000
3500
4000
500
1000
1500
2000
2500
3000
3500
4000
IF FREQUENCY (MHz)
IF FREQUENCY (MHz)
Figure 22. Conversion Loss vs. IF Frequency over Temperature
at fLO = 12 GHz, PLO = 13 dBm
Figure 24. Conversion Loss vs. IF Frequency over LO Drive
at fLO = 12 GHz, TA = 25°C
26
24
22
20
18
26
24
22
20
18
16
14
17dBm
15dBm
13dBm
11dBm
9dBm
16
+85°C
+25°C
–40°C
14
500
1000
1500
2000
2500
3000
3500
4000
500
1000
1500
2000
2500
3000
3500
4000
IF FREQUENCY (MHz)
IF FREQUENCY (MHz)
Figure 23. Input IP3 vs. IF Frequency over Temperature
at fLO = 12 GHz, PLO = 13 dBm
Figure 25. Input IP3 vs. IF Frequency over LO Drive at fLO = 12 GHz,
A = 25°C
T
Rev. B | Page 9 of 15
HMC1048ALC3B
Data Sheet
ISOLATION AND RETURN LOSS
0
0
–4
–10
–20
–30
–40
–50
–60
–70
–8
–12
–16
–20
LO TO IF
RF TO IF
LO TO RF
+85°C
+25°C
–40°C
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
FREQUENCY (GHz)
LO FREQUENCY (GHz)
Figure 26. Isolation vs. Frequency, TA = 25°C
Figure 28. LO Return Loss vs. LO Frequency over Temperature at
LO = 13 dBm
P
0
–4
0
–5
–8
–10
–15
–20
–25
–30
–35
–40
–45
–50
–12
–16
–20
–24
–28
–32
–36
–40
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
2
4
6
8
10
12
14
16
18
500
1000
1500
2000
2500
3000
3500
4000
RF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 27. RF Return Loss vs. RF Frequency over Temperature at fLO = 5.5 GHz,
LO = 13 dBm
Figure 29. IF Return Loss vs. IF Frequency over Temperature at fLO = 5.5 GHz,
LO = 13 dBm
P
P
Rev. B | Page 10 of 15
Data Sheet
HMC1048ALC3B
LO Harmonics
SPURIOUS AND HARMONICS PERFORMANCE
When measuring these parameters, 13 dBm LO input power
was applied at various LO frequencies. All values in dBc below
LO power level are measured at RF port. N/A means not
applicable.
M × N Spurious Outputs as Downconverter
When measuring these parameters, −10 dBm RF input power at
4 GHz and 13 dBm LO input power at 4.1 GHz were applied. All
values in dBc below the IF output power level and valid for
lower sideband measurements. N/A means not applicable.
Table 6. LO Harmonics
Spur values are (M × RF) − (N × LO).
N × LO Spur at RF Port
LO Frequency (GHz)
1
2
3
4
N × LO
2
4
6
10
12
14
58
34
35
27
47
32
62
31
30
27
42
55
57
46
47
39
40
39
62
40
63
66
65
N/A
0
1
2
3
4
N/A
4
31
0
19
27
40
57
77
27
35
34
55
62
4
0
1
2
3
4
39
59
59
67
M × RF
52
74
77
34
68
78
Rev. B | Page 11 of 15
HMC1048ALC3B
Data Sheet
THEORY OF OPERATION
The HMC1048ALC3B is a general-purpose, double balanced
mixer that can be used as a downconverter from 2.25 GHz
to 18 GHz.
The HMC1048ALC3B downconverts radio frequencies between
2.25 GHz and 18 GHz to intermediate frequencies between dc
and 4 GHz.
Rev. B | Page 12 of 15
Data Sheet
HMC1048ALC3B
APPLICATIONS INFORMATION
EVALUATION BOARD
Figure 30 and Figure 31 show the top and cross sectional views of
the EV1HMC1048ALC3B evaluation board, which uses 4-layer
construction with a copper thickness of 0.5 oz (0.7 mil) and
dielectric materials between each copper layer.
All RF traces are routed on Layer 1, and all other remaining layers
are grounded planes that provide a solid ground for RF trans-
mission lines. The top dielectric material is Rogers 4350, offering
low loss performance. The prepreg material in the middle is used to
attach the core layers together, the RoHS compliant Isola 370HR
and the Rogers 4350 layers, with copper traces above and below the
prereg material. Both the prepreg and the Isola 370HR core layer
are used to achieve the required board finish thickness.
The RF transmission lines were designed using a coplanar
waveguide (CPWG) model with a width of 18 mil and ground
spacing of 13 mil for a characteristic impedance of 50 Ω. For
optimal RF and thermal grounding, as many plated through vias as
possible are arranged around the transmission lines and under the
exposed pad of the package.
Figure 30. EV1HMC1048ALC3B Evaluation Board Layout Top View
G = 13mil
W = 18mil
0.5oz Cu (0.7mil)
0.5oz Cu (0.7mil)
0.5oz Cu (0.7mil)
10 mil ARLON 25 FR OR ROGERS 4350
0.5oz Cu (0.7mil)
PREPREG AS REQUIRED
0.5oz Cu (0.7mil)
ISOL 370HR AS REQUIRED
0.5oz Cu (0.7mil)
Figure 31. EV1HMC1048ALC3B Evaluation Board Cross Sectional View
Rev. B | Page 13 of 15
HMC1048ALC3B
Data Sheet
Figure 32 shows the EV1HMC1048ALC3B evaluation board
with component placement. Because the HMC1048ALC3B is a
passive device, there is no requirement for external components.
The LO and RF pins are internally ac-coupled. The IF pin is
internally dc-coupled. Use an external series capacitor when IF
operation is not required. Choose a value that stays within the
necessary IF frequency range (dc to 4 GHz). When IF operation
to dc is required, do not exceed the IF source and sink current
rating, as specified in the Absolute Maximum Ratings section.
The evaluation board shown in Figure 32 is available for order
from the Analog Devices, Inc., website at www.analog.com/EVAL-
HMC1048A.
Table 7 and Figure 33 show the evaluation board schematic and
bill of materials, respectively.
Table 7. Bill of Materials for the EV1HMC1048ALC3B
Evaluation Board
Item
J1 to J2
J3
U1
PCB1
Description
2.92 mm connectors
Subminiature Version A (SMA) connector
HMC1048ALC3B
08-047919 Evaluation PCB
1 08-047919 is the raw bare PCB identifier. Reference the EV1HMC1048ALC3B
part number when ordering the complete evaluation PCB.
590MILS
12 11 10
HMC1048ALC3B
GND
GND
GND
GND
1
2
3
9
8
7
RF
LO
1000MILS
4
5
6
IF
Figure 33. EV1HMC1048ALC3B Evaluation Board Schematic
Figure 32. EV1HMC1048ALC3B Evaluation Board
Rev. B | Page 14 of 15
Data Sheet
HMC1048ALC3B
OUTLINE DIMENSIONS
3.05
2.90 SQ
2.75
0.36
0.30
0.24
0.08
BSC
PIN 1
INDICATOR
10
12
PIN 1
9
1
3
0.50
BSC
1.60
1.50 SQ
1.40
EXPOSED
PAD
7
6
4
0.32
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
1.00 REF
2.10 BSC
0.90
0.80
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 34. 12-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC1048ALC3B
HMC1048ALC3BTR
HMC1048ALC3BTR-R5
EV1HMC1048ALC3B
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Moisture Sensitivity Level (MSL) Rating2
Package Description
Package Option
E-12-4
E-12-4
MSL3
MSL3
MSL3
12-Terminal Ceramic LCC
12-Terminal Ceramic LCC
12-Terminal Ceramic LCC
E-12-4
1 All models are RoHS compliant parts.
2 See the Absolute Maximum Ratings section, Table 3, and Figure 2 for the peak reflow temperature.
©2018–2019 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16345-0-5/19(B)
Rev. B | Page 15 of 15
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