HMC1055LP2CETR [ADI]
0.5 GHz to 4.0 GHz, GaAs, SPST Switch;
| 型号： | HMC1055LP2CETR |
| 厂家： | 
ADI |
| 描述： | 0.5 GHz to 4.0 GHz, GaAs, SPST Switch 射频 微波 |
| 文件： | 总11页 (文件大小：323K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
0.5 GHz to 4.0 GHz, GaAs, SPST Switch
HMC1055
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Low insertion loss: 0.7 dB typical at 2.0 GHz
High input third-order intercept (IP3): >60 dBm typical
Single positive control: 0 V or 3 V
HMC1055
NIC
GND
GND
NIC
1
2
3
4
8
7
6
5
RF2
V
V
CTL
DD
Small, surface-mount, 8-lead, 2 mm × 2 mm LFCSP package
RF1
APPLICATIONS
PACKAGE
BASE
Cellular infrastructure
Wireless infrastructure
Mobile radios
GND
Figure 1.
Test equipment
GENERAL DESCRIPTION
The HMC1055 is a low cost, gallium arsenide (GaAs), single-
pole, single-throw (SPST) switch in a surface-mount LFCSP
package. This switch offers low insertion loss, high isolation,
and exceptional third-order intermodulation performance that
make it ideal for many cellular and wireless infrastructure
applications from 0.5 GHz to 4.0 GHz.
The HMC1055 operates with single positive supply voltage and
a single positive control voltage at very low dc currents. RF1 is
reflective open, whereas RF2 is terminated to 50 Ω in the off
state.
Rev. A
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Last Content Update: 02/23/2017
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• HMC1055: 0.5 GHz to 4.0 GHz, GaAs, SPST Switch Data
Sheet
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HMC1055
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Interface Schematics .....................................................................5
Typical Performance Characteristics ..............................................6
Theory of Operation .........................................................................8
Applications Information .................................................................9
Evaluation Printed Circuit Board (PCB)....................................9
Evaluation Board Schematic and Artwork ................................9
Outline Dimensions....................................................................... 10
Ordering Guide .......................................................................... 10
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
REVISION HISTORY
2/16—v00.0912 to Rev. A
Changes to Figure 5...........................................................................6
Changes to Figure 11 and Figure 12 ...............................................7
Changes to Theory of Operation Section and Table 4 .................8
Added Applications Information Section, Evaluation Printed
Circuit Board Section, Evaluation Board Schematic and
Artwork Section, and Figure 13; Renumbered Sequentially .......9
Changes to Table 5.............................................................................9
Updated Outline Dimensions....................................................... 10
Changes to Ordering Guide.......................................................... 10
This Hittite Microwave Products data sheet has been reformatted
to meet the styles and standards of Analog Devices, Inc.
Changed NC to NIC...................................................... Throughout
Changes to Title, Features Section, Applications Section,
Figure 1, and General Description Section................................... 1
Changes to Table 1............................................................................ 3
Changes to Table 2............................................................................ 4
Added Figure 2; Renumbered Sequentially .................................. 5
Changes to Table 3............................................................................ 5
Deleted Typical Application Circuit............................................... 5
Rev. A | Page 2 of 10
Data Sheet
HMC1055
SPECIFICATIONS
VDD = 3 V , VCTL = 0 V or VDD, TA = 25°C, 50 Ω system, unless otherwise noted.
Table 1.
Parameter
Test Conditions/Comments
Min
Typ
Max Unit
FREQUENCY
INSERTION LOSS
0.5
4.0
GHz
dB
dB
0.5 GHz to 2.0 GHz
2.0 GHz to 4.0 GHz
0.5 GHz to 2.0 GHz
2.0 GHz to 4.0 GHz
0.7
1.4
36
ISOLATION
dB
dB
28
RETURN LOSS
On State
0.5 GHz to 2.0 GHz, RF1 and RF2 ports
2.0 GHz to 4.0 GHz, RF1 and RF2 ports
0.5 GHz to 2.0 GHz, RF2 port
2.0 GHz to 4.0 GHz, RF2 port
0.5 GHz to 4.0 GHz
27
25
12
24
dB
dB
dB
dB
Off State
INPUT LINEARITY
Input 0.1 dB Compression (P0.1dB)
Input Third-Order Intercept (IP3)
SWITCHING CHARACTERISTICS
28
>60
dBm
dBm
Two-tone input power = 15 dBm each tone
Rise/Fall Time (tRISE, tFALL
On/Off Time (tON, tOFF
CURRENT
)
10% to 90% RF
50% VCTL to 90% RF
40
50
ns
ns
)
Supply (IDD)
Control (ICTL
VDD = 3 V to 5 V
0 V or VDD
0.2
<5
mA
µA
)
Rev. A | Page 3 of 10
HMC1055
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Stresses at or above those listed under Absolute Maximum
Table 2.
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Parameter
Rating
RF Input Power (VDD = 3 V, TCASE = 85°C)
Supply Voltage
Control Voltage Range
Continuous Power Dissipation, PDISS
Thermal Resistance, θJC (Channel to
Package Bottom)
Channel Temperature
34 dBm
6.0 V
−0.2 V to VDD + 0.2 V
0.88 W
74°C/W
ESD CAUTION
150°C
Operating Temperature Range
Storage Temperature Range
Reflow Temperature
−40°C to +85°C
−65°C to +150°C
260°C (MSL1 Rating)
ESD Sensitivity, Human Body Model (HBM) 250 V (Class 1A)
Rev. A | Page 4 of 10
Data Sheet
HMC1055
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC
GND
GND
NIC
1
2
3
4
8
7
6
5
RF2
V
HMC1055
CTL
TOP VIEW
V
DD
(Not to Scale)
RF1
NOTES
1. NIC = NOT INTERNALLY CONNECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST
BE CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 4
2, 3
5
NIC
Not Internally Connected. These pins are not internally connected but can be grounded.
Ground. These pins must be connected to RF ground.
RF Input. This pin is dc-coupled and matched to 50 Ω. A blocking capacitor is required.
Supply Voltage Pin.
GND
RF1
VDD
6
7
8
VCTL
RF2
EPAD
Control Input Pin.
RF Output. This pin is dc-coupled and matched to 50 Ω. A blocking capacitor is required.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
R
GND
V
CTL
C
Figure 4. VCTL Interface Schematic
Figure 3. GND Interface Schematic
Rev. A | Page 5 of 10
HMC1055
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
0
0
–10
–20
–30
–40
–50
–60
–70
+85°C
+25°C
–40°C
–1
–2
–3
–4
+85°C
+25°C
–40°C
–5
0
1
2
3
4
5
0
1
2
3
4
5
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 5. Insertion Loss vs. Frequency over Temperature, VDD = 3 V, VCTL = 3 V
Figure 8. Isolation vs. Frequency over Temperature, VDD = 3 V, VCTL = 0 V
0
0
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
–5
–10
–15
–20
–25
–30
–35
–5
–10
–15
–20
–25
–30
–35
0
1
2
3
4
5
0
1
2
3
4
5
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 6. RF1 Return Loss vs. Frequency over Temperature,
DD = 3 V, VCTL = 3 V
Figure 9. RF2 Return Loss vs. Frequency over Temperature,
DD = 3 V, VCTL = 3 V
V
V
0
0
+85°C
+25°C
–40°C
–5
–2
–10
–15
–20
–25
–30
–35
–4
–6
–8
+85°C
+25°C
–40°C
–10
0
1
2
3
4
5
0
1
2
3
4
5
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 7. RF1 Return Loss vs. Frequency over Temperature,
DD = 3 V, VCTL = 0 V
Figure 10. RF2 Return Loss vs. Frequency over Temperature,
DD = 3 V, VCTL = 0 V
V
V
Rev. A | Page 6 of 10
Data Sheet
HMC1055
80
75
70
65
60
55
50
35
30
25
20
15
10
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 11. Input IP3 vs. Frequency Over Temperature, VDD = 3 V, VCTL = 3 V
Figure 12. Input P0.1dB vs. Frequency Over Temperature, VDD = 3 V, VCTL = 3 V
Rev. A | Page 7 of 10
HMC1055
Data Sheet
THEORY OF OPERATION
The HMC1055 requires a single-supply voltage applied to the
Table 4. Truth Table
Supply Voltage
V
DD pin. Bypassing capacitors are recommended on the supply
Control Voltage
Switch Mode
(RF1 to RF2)
1
line to minimize RF coupling.
(VDD
)
(VCTL
)
3 V
0 V
3 V
Off
On
Off
On
The HMC1055 is controlled via a single digital control voltage
applied to the VCTL pin. When the VCTL pin is high, the switch is
set to the on state, by which an insertion loss path is provided
from RF1 to RF2. When the VCTL pin is low, the switch is set to
the off state, by which RF2 is isolated from RF1 and terminated
to 50 Ω, whereas RF1 becomes reflective open (see Table 4).
5 V
0 V
5 V
1 Control voltage tolerances are 0.2 V dc.
The HMC1055 is internally matched to 50 Ω at the RF1 and
RF2 pins; therefore, no external matching components are
required. The RF1 and RF2 pins are dc-coupled, and dc
blocking capacitors are required on the RF lines.
Rev. A | Page 8 of 10
Data Sheet
HMC1055
APPLICATIONS INFORMATION
EVALUATION PRINTED CIRCUIT BOARD (PCB)
EVALUATION BOARD SCHEMATIC AND ARTWORK
The HMC1055 evaluation board is constructed of a 4-layer
material with a copper thickness of 0.7 mil on each layer. Every
copper layer is separated with a dielectric material. The top
dielectric material is 10 mil RO4350. The middle and bottom
dielectric materials are FR-4, used for mechanical strength and
overall board thickness of approximately 62 mil, which allows
SMA connectors to be slipped in at the board edges.
U1
HMC1055
C2
C3
330pF
330pF
1
RF1
RF2
1
All RF and dc traces are routed on the top copper layer. The RF
transmission lines are designed using a coplanar waveguide
(CPWG) model, with a width of 16 mil, spacing of 13 mil, and
dielectric thickness of 10 mil, to have a characteristic imped-
ance of 50 Ω. The inner and bottom layers are grounded planes
to provide a solid ground for the RF transmission lines. For
optimal electrical and thermal performance, as many vias as
possible are arranged around the transmission lines and under
the package exposed pad. The evaluation board layout shown in
Figure 14 serves as a recommendation for optimal and stable
performance, as well as for improvement of thermal efficiency.
J1
J2
C1
1nF
J3
J4
C4
C5
330pF
DEPOP
330pF
DEPOP
1
1
J5
DEPOP
J6
DEPOP
Figure 13. Evaluation Board Schematic
Table 5. List of Materials for EVAL01-HMC1055LP2C
Item
J1, J2
J3, J4
C1
C2, C3
U1
Description
The package ground pins are connected directly to the ground
plane. The supply voltage and control voltage must be con-
nected to the dc pins, J3 and J4, respectively, of the evaluation
board. One decoupling capacitor is populated on the supply
trace to filter high frequency noise.
PCB mount, SMA, RF connector
DC pin
1 nF capacitor, 0402 package
330 pF capacitor, 0402 package
HMC1055 SPST switch
600-00215-00-1 evaluation PCB
The RF input and output ports (RF1 and RF2) are connected
through 50 ꢀ transmission lines to the SMA connectors, J1
and J2, respectively. The RF1 and RF2 ports are ac-coupled
with capacitors of an appropriate value to ensure broadband
performance. A thru calibration line connects J5 and J6; this
transmission line is used to estimate the loss of the PCB over
the environmental conditions being evaluated.
PCB
Figure 14. Evaluation Board Layout—Top View
Rev. A | Page 9 of 10
HMC1055
Data Sheet
OUTLINE DIMENSIONS
1.25
1.20
1.15
2.05
2.00 SQ
1.95
0.50 BSC
5
8
PIN 1 INDEX
0.65
0.60
0.55
AREA
EXPOSED
PAD
0.40
0.35
0.30
0.35 BSC
4
1
TOP VIEW
SIDE VIEW
BOTTOM VIEW
1.00
0.90
0.80
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
SECTION OF THIS DATA SHEET.
0.30
0.25
0.20
SEATING
PLANE
0.20 REF
Figure 15. 8-Lead Lead Frame Chip Scale Package [LFCSP]
2 mm × 2 mm Body and 0.90 mm Package Height
(CP-8-26)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature
Range
MSL
Package
Option
Model1
Rating2
Package Description
Branding3
HMC1055LP2CE
−40°C to +85°C
MSL1
8-Lead Lead Frame Chip Scale Package [LFCSP]
CP-8-26
H1055
XXXX
HMC1055LP2CETR
−40°C to +85°C
MSL1
8-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board
CP-8-26
H1055
XXXX
EVAL01-HMC1055LP2C
1 HMC1055LP2CE and HMC1055LP2CETR are RoHS compliant parts.
2 See the Absolute Maximum Ratings section.
3 XXXX is the 4-digit lot number.
©2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13718-0-2/16(A)
Rev. A | Page 10 of 10
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