HMC219B [ADI]
2.5 GHz to 7.0 GHz GaAs, MMIC Fundamental Mixer;
| 型号： | HMC219B |
| 厂家： | 
ADI |
| 描述： | 2.5 GHz to 7.0 GHz GaAs, MMIC Fundamental Mixer |
| 文件： | 总27页 (文件大小：452K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2.5 GHz to 7.0 GHz GaAs, MMIC
Fundamental Mixer
Data Sheet
HMC219B
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Conversion loss: 9 dB typical
LO to RF isolation: 40 dB typical
LO to IF isolation: 35 dB typical
RF to IF isolation: 22 dB typical
Input IP3: 18 dBm typical
GND
LO
1
2
3
4
8
7
6
5
GND
RF
HMC219B
GND
NIC
GND
IF
Figure 1.
Input P1dB: 11 dBm typical
Input IP2: 55 dBm typical
Passive double balanced topology
8-lead, 3 mm × 3 mm, MINI_SO_EP
APPLICATIONS
Microwave radios
High performance radio local area network (HiperLAN) and
unlicensed national information infrastructure (U-NII)
Industrial, scientific, and medical (ISM)
GENERAL DESCRIPTION
The HMC219B is an ultraminiature, general-purpose, double
balanced mixer in an 8-lead plastic surface mini small outline
package with exposed pad (MINI_SO_EP). This passive
monolithic microwave integrated circuit (MMIC) mixer is
fabricated in a gallium arsenide (GaAs) metal semiconductor
field effect transistor (MESFET) process and requires no
external components or matching circuitry. The device can be
used as an upconverter, downconverter, biphase demodulator,
or phase comparator from 2.5 GHz to 7.0 GHz.
The HMC219B provides excellent local oscillator (LO) to radio
frequency (RF) isolation and LO to intermediate frequency (IF)
isolation due to optimized balun structures. The RoHS compliant
HMC219B eliminates the need for wire bonding and is compatible
with high volume surface-mount manufacturing techniques. The
consistent MMIC performance improves system operation and
assures regulatory compliance with HiperLAN, U-NII, and ISM.
Rev. A
Document Feedback
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rights of third parties that may result from its use. Specifications subject to change without notice.
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Tel: 781.329.4700
Technical Support
©2017 Analog Devices, Inc. All rights reserved.
www.analog.com
HMC219B
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Performance Characteristics ..............................................6
Downconverter Performance ......................................................6
Upconverter Performance......................................................... 18
Spurious and Harmonics Performance ................................... 24
Theory of Operation ...................................................................... 25
Applications Information .............................................................. 26
Typical Application Circuit....................................................... 26
Evaluation PCB Information .................................................... 26
Outline Dimensions ....................................................................... 27
Ordering Guide .......................................................................... 27
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 5
REVISION HISTORY
10/2017—Rev. 0 to Rev. A
Changes to Figure 16........................................................................ 7
Changes to M × N Spurious Outputs, IF = 100 MHz Section
and M × N Spurious Outputs, IF = 1000 MHz Section ............ 24
1/2017—Revision 0: Initial Version
Rev. A | Page 2 of 27
Data Sheet
HMC219B
SPECIFICATIONS
TA = 25°C, IF = 100 MHz, LO power = 13 dBm, and all measurements performed as downconverter with lower sideband selected, unless
otherwise noted.
Table 1.
Parameter
Min
Typ
Max
Unit
FREQUENCY RANGE
RF
LO
2.5
2.5
DC
7.0
7.0
3
GHz
GHz
GHz
dBm
IF
LO DRIVE LEVEL
13
PERFORMANCE
Conversion Loss
Single-Sideband (SSB) Noise Figure
Input Third-Order Intercept (IP3)
Input Second-Order Intercept (IP2)
LO to RF Isolation
LO to IF Isolation
RF to IF Isolation
Input 1 dB Compression Point (P1dB)
RF Return Loss
9
8
11
dB
dB
dBm
dBm
dB
dB
dB
dBm
dB
dB
15
18
55
40
35
22
11
10
25
12
34
29
LO Return Loss
IF Return Loss
dB
Rev. A | Page 3 of 27
HMC219B
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
RF Input Power
LO Input Power
IF Input Power
IF Source and Sink Current
Continuous Power Dissipation, PDISS (TA =
85°C, Derate 10.81 mW/°C Above 85°C)
Maximum Junction Temperature
Maximum Peak Reflow Temperature (MSL1)1
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
25 dBm
27dBm
25 dBm
6 mA
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
972 mW
RM-8
194.9
92.5
°C/W
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
175°C
260°C
−40°C to +85°C
−65°C to +125°C
ESD CAUTION
1500 V (Class 1C)
750 V (Class C4)
Field Induced Charged Device Model
(FICDM)
1 See the Ordering Guide.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. A | Page 4 of 27
Data Sheet
HMC219B
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND
1
2
3
4
8
7
6
5
GND
LO
HMC219B
RF
TOP VIEW
GND
NIC
GND
IF
(Not to Scale)
NOTES
1. NIC = NOT INTERNALLY CONNECTED.
LEAVE THIS PIN FLOATING.
2. EXPOSED PAD. EXPOSED PAD MUST
BE CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1, 3, 6, 8
GND
LO
NIC
IF
Ground. Connect the package bottom to RF/dc ground. See Figure 3 for the GND interface schematic.
Local Oscillator. This pin is dc-coupled and matched to 50 Ω. See Figure 4 for the LO interface schematic.
Not Internally Connected. Leave this pin floating.
Intermediate Frequency. This pin is dc-coupled. For applications not requiring operation to dc, externally block
this pin using a series capacitor with a value chosen to pass the necessary IF frequency range. For operation to
dc, this pin must not source or sink more than 6 mA of current or device nonfunction and possible device failure
results. See Figure 5 for the IF interface schematic.
2
4
5
7
RF
Radio Frequency. This pin is dc-coupled and matched to 50 Ω. See Figure 6 for the RF interface schematic.
INTERFACE SCHEMATICS
GND
IF
Figure 3. GND Interface Schematic
Figure 5. IF Interface Schematic
LO
RF
Figure 4. LO Interface Schematic
Figure 6. RF Interface Schematic
Rev. A | Page 5 of 27
HMC219B
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
Data taken as downconverter, lower sideband, TA = 25°C, IF = 100 MHz, and LO power = 13 dBm, unless otherwise noted.
0
60
55
50
45
40
35
30
25
20
15
10
+85°C
+25°C
–40°C
LO TO IF
LO TO RF
RF TO IF
–2
–4
–6
–8
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 10. Isolation vs. RF Frequency
30
20
18
16
14
12
10
8
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
25
20
15
10
5
6
4
2
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures
Figure 11. Input P1dB vs. RF Frequency at Various Temperatures
0
0
9dBm
IF RETURN LOSS
CONVERSION GAIN
–2
–4
–2
–4
11dBm
13dBm
15dBm
17dBm
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
IF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 9. Conversion Gain and IF Return Loss vs. IF Frequency
Figure 12. Conversion Gain vs. RF Frequency at Various LO Powers
Rev. A | Page 6 of 27
Data Sheet
HMC219B
30
20
18
16
14
12
10
8
9dBm
+85°C
+25°C
–40°C
11dBm
13dBm
15dBm
17dBm
25
20
15
10
5
6
4
2
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 13. Input IP3 vs. RF Frequency at Various LO Powers
Figure 16. Noise Figure vs. RF Frequency at Various Temperatures
80
80
70
60
50
40
30
+85°C
+25°C
–40°C
70
60
50
40
30
20
10
0
9dBm
20
10
0
11dBm
13dBm
15dBm
17dBm
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 14. Input IP2 vs. RF Frequency at Various Temperatures
Figure 17. Input IP2 vs. RF Frequency at Various LO Powers
0
0
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
–2
–4
–5
–10
–15
–20
–25
–30
–35
–40
–6
–8
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
LO FREQUENCY (GHz)
Figure 15. RF Return Loss vs. RF Frequency at Various Temperatures,
LO Frequency = 4.6 GHz, LO Power = 13 dBm
Figure 18. LO Return Loss vs. LO Frequency at Various Temperatures
Rev. A | Page 7 of 27
HMC219B
Data Sheet
Data taken as downconverter, lower sideband, TA = 25°C, IF = 1000 MHz, and LO power = 13 dBm, unless otherwise noted.
0
0
9dBm
+85°C
+25°C
–40°C
–2
–2
11dBm
13dBm
15dBm
17dBm
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 19. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 22. Conversion Gain vs. RF Frequency at Various LO Powers
30
30
9dBm
11dBm
13dBm
15dBm
17dBm
+85°C
+25°C
–40°C
25
25
20
15
10
5
20
15
10
5
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 20. Input IP3 vs. RF Frequency at Various Temperatures
Figure 23. Input IP3 vs. RF Frequency at Various LO Powers
80
80
9dBm
+85°C
+25°C
–40°C
11dBm
13dBm
15dBm
17dBm
70
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 21. Input IP2 vs. RF Frequency at Various Temperatures
Figure 24. Input IP2 vs. RF Frequency at Various LO Powers
Rev. A | Page 8 of 27
Data Sheet
HMC219B
20
20
18
16
14
12
10
8
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
18
16
14
12
10
8
6
6
4
4
2
2
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 25. Input P1dB vs. RF Frequency at Various Temperatures
Figure 26. Noise Figure vs. RF Frequency at Various Temperatures
Rev. A | Page 9 of 27
HMC219B
Data Sheet
Data taken as downconverter, lower sideband, TA = 25°C, IF = 2000 MHz, and LO power = 13 dBm, unless otherwise noted.
0
0
9dBm
+85°C
+25°C
–40°C
–2
–2
11dBm
13dBm
15dBm
17dBm
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 27. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 30. Conversion Gain vs. RF Frequency at Various LO Powers
30
30
9dBm
11dBm
13dBm
15dBm
17dBm
+85°C
+25°C
–40°C
25
25
20
15
10
5
20
15
10
5
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 28. Input IP3 vs. RF Frequency at Various Temperatures
Figure 31. Input IP3 vs. RF Frequency at Various LO Powers
80
80
+85°C
+25°C
–40°C
70
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
9dBm
11dBm
13dBm
15dBm
17dBm
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 29. Input IP2 vs. RF Frequency at Various Temperatures
Figure 32. Input IP2 vs. RF Frequency at Various LO Powers
Rev. A | Page 10 of 27
Data Sheet
HMC219B
20
35
30
25
20
15
10
5
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
18
16
14
12
10
8
6
4
2
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 33. Input P1dB vs. RF Frequency at Various Temperatures
Figure 34. Noise Figure vs. RF Frequency at Various Temperatures
Rev. A | Page 11 of 27
HMC219B
Data Sheet
Data taken as downconverter, upper sideband, TA = 25°C, IF = 100 MHz, and LO power = 13 dBm, unless otherwise noted.
0
0
9dBm
+85°C
+25°C
–40°C
–2
–2
11dBm
13dBm
15dBm
17dBm
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 35. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 38. Conversion Gain vs. RF Frequency at Various LO Powers
30
30
9dBm
11dBm
13dBm
15dBm
17dBm
+85°C
+25°C
–40°C
25
25
20
15
10
5
20
15
10
5
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 36. Input IP3 vs. RF Frequency at Various Temperatures
Figure 39. Input IP3 vs. RF Frequency at Various LO Powers
80
80
+85°C
+25°C
–40°C
70
60
70
60
50
40
30
20
10
0
50
40
30
20
10
0
9dBm
11dBm
13dBm
15dBm
17dBm
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 37. Input IP2 vs. RF Frequency at Various Temperatures
Figure 40. Input IP2 vs. RF Frequency at Various LO Powers
Rev. A | Page 12 of 27
Data Sheet
HMC219B
20
20
18
16
14
12
10
8
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
18
16
14
12
10
8
6
6
4
4
2
2
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 41. Input P1dB vs. RF Frequency at Various Temperatures
Figure 42. Noise Figure vs. RF Frequency at Various Temperatures
Rev. A | Page 13 of 27
HMC219B
Data Sheet
Data taken as downconverter, upper sideband, TA = 25°C, IF = 1000 MHz, and LO power = 13 dBm, unless otherwise noted.
0
0
9dBm
+85°C
+25°C
–40°C
–2
–2
11dBm
13dBm
15dBm
17dBm
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 43. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 46. Conversion Gain vs. RF Frequency at Various LO Powers
30
30
9dBm
11dBm
13dBm
15dBm
+85°C
+25°C
–40°C
25
25
17dBm
20
15
10
5
20
15
10
5
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 44. Input IP3 vs. RF Frequency at Various Temperatures
Figure 47. Input IP3 vs. RF Frequency at Various LO Powers
80
80
+85°C
+25°C
–40°C
70
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
9dBm
11dBm
13dBm
15dBm
17dBm
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 45. Input IP2 vs. RF Frequency at Various Temperatures
Figure 48. Input IP2 vs. RF Frequency at Various LO Powers
Rev. A | Page 14 of 27
Data Sheet
HMC219B
20
20
18
16
14
12
10
8
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
18
16
14
12
10
8
6
6
4
4
2
2
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 49. Input P1dB vs. RF Frequency at Various Temperatures
Figure 50. Noise Figure vs. RF Frequency at Various Temperatures
Rev. A | Page 15 of 27
HMC219B
Data Sheet
Data taken as downconverter, upper sideband, TA = 25°C, IF = 2000 MHz, and LO power = 13 dBm, unless otherwise noted.
0
0
9dBm
+85°C
+25°C
–40°C
–2
–2
11dBm
13dBm
15dBm
17dBm
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 51. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 54. Conversion Gain vs. RF Frequency at Various LO Powers
30
30
9dBm
11dBm
13dBm
15dBm
17dBm
+85°C
+25°C
–40°C
25
25
20
15
10
5
20
15
10
5
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 52. Input IP3 vs. RF Frequency at Various Temperatures
Figure 55. Input IP3 vs. RF Frequency at Various LO Powers
80
80
+85°C
+25°C
–40°C
70
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
9dBm
11dBm
13dBm
15dBm
17dBm
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 53. Input IP2 vs. RF Frequency at Various Temperatures
Figure 56. Input IP2 vs. RF Frequency at Various LO Powers
Rev. A | Page 16 of 27
Data Sheet
HMC219B
20
20
18
16
14
12
10
8
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
18
16
14
12
10
8
6
6
4
4
2
2
0
3.5
0
4.0
4.0
4.5
5.0
5.5
6.0
6.5
7.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 57. Input P1dB vs. RF Frequency at Various Temperatures
Figure 58. Noise Figure vs. RF Frequency at Various Temperatures
Rev. A | Page 17 of 27
HMC219B
Data Sheet
UPCONVERTER PERFORMANCE
Data taken as upconverter, lower sideband, TA = 25°C, IF = 100 MHz, and LO power = 13 dBm, unless otherwise noted.
0
0
9dBm
+85°C
+25°C
–40°C
–2
–2
11dBm
13dBm
15dBm
17dBm
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 59. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 61. Conversion Gain vs. RF Frequency at Various LO Powers
30
30
9dBm
11dBm
13dBm
+85°C
+25°C
–40°C
25
25
15dBm
17dBm
20
15
10
5
20
15
10
5
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 60. Input IP3 vs. RF Frequency at Various Temperatures
Figure 62. Input IP3 vs. RF Frequency at Various LO Powers
Rev. A | Page 18 of 27
Data Sheet
HMC219B
Data taken as upconverter, lower sideband, TA = 25°C, IF = 1000 MHz, and LO drive level = 13 dBm, unless otherwise noted.
0
0
9dBm
+85°C
+25°C
–40°C
11dBm
13dBm
15dBm
17dBm
–2
–2
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 63. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 65. Conversion Gain vs. RF Frequency at Various LO Powers
30
30
9dBm
11dBm
13dBm
15dBm
17dBm
+85°C
+25°C
–40°C
25
25
20
15
10
5
20
15
10
5
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 64. Input IP3 vs. RF Frequency at Various Temperatures
Figure 66. Input IP3 vs. RF Frequency at Various LO Powers
Rev. A | Page 19 of 27
HMC219B
Data Sheet
Data taken as upconverter, lower sideband, TA = 25°C, IF = 2000 MHz, and LO drive level = 13 dBm, unless otherwise noted.
0
0
9dBm
+85°C
+25°C
–40°C
–2
–2
11dBm
13dBm
15dBm
17dBm
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 67. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 69. Conversion Gain vs. RF Frequency at Various LO Powers
30
30
9dBm
11dBm
13dBm
15dBm
17dBm
+85°C
+25°C
–40°C
25
25
20
15
10
5
20
15
10
5
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 68. Input IP3 vs. RF Frequency at Various Temperatures
Figure 70. Input IP3 vs. RF Frequency at Various LO Powers
Rev. A | Page 20 of 27
Data Sheet
HMC219B
Data taken as upconverter, upper sideband, TA = 25°C, IF = 100 MHz, and LO drive level = 13 dBm, unless otherwise noted.
0
0
9dBm
+85°C
+25°C
–40°C
–2
–2
11dBm
13dBm
15dBm
17dBm
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 71. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 73. Conversion Gain vs. RF Frequency at Various LO Powers
30
30
9dBm
11dBm
13dBm
15dBm
17dBm
+85°C
+25°C
–40°C
25
25
20
15
10
5
20
15
10
5
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 72. Input IP3 vs. RF Frequency at Various Temperatures
Figure 74. Input IP3 vs. RF Frequency at Various LO Powers
Rev. A | Page 21 of 27
HMC219B
Data Sheet
Data taken as upconverter, upper sideband, TA = 25°C, IF = 1000 MHz, and LO drive level = 13 dBm, unless otherwise noted.
0
0
9dBm
+85°C
+25°C
–40°C
–2
–2
11dBm
13dBm
15dBm
17dBm
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 75. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 77. Conversion Gain vs. RF Frequency at Various LO Powers
30
30
9dBm
11dBm
13dBm
15dBm
17dBm
+85°C
+25°C
–40°C
25
25
20
15
10
5
20
15
10
5
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 76. Input IP3 vs. RF Frequency at Various Temperatures
Figure 78. Input IP3 vs. RF Frequency at Various LO Powers
Rev. A | Page 22 of 27
Data Sheet
HMC219B
Data taken as upconverter, upper sideband, TA = 25°C, IF = 2000 MHz, and LO drive level = 13 dBm, unless otherwise noted.
0
0
9dBm
+85°C
+25°C
–40°C
11dBm
13dBm
15dBm
17dBm
–2
–2
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 79. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 81. Conversion Gain vs. RF Frequency at Various LO Powers
30
30
9dBm
11dBm
13dBm
15dBm
17dBm
+85°C
+25°C
–40°C
25
25
20
15
10
5
20
15
10
5
0
2.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 80. Input IP3 vs. RF Frequency at Various Temperatures
Figure 82. Input IP3 vs. RF Frequency at Various LO Powers
Rev. A | Page 23 of 27
HMC219B
Data Sheet
SPURIOUS AND HARMONICS PERFORMANCE
Mixer spurious products are measured in dBc from the IF output
power level, unless otherwise noted. Spur values are (M × RF) −
(N × LO).
M × N Spurious Outputs, IF = 1000 MHz
RF = +2.5 GHz, LO = +3.5 GHz, RF power = −10 dBm, and
LO power = +13 dBm.
M × N Spurious Outputs, IF = 100 MHz
N × LO
RF = +2.5 GHz, LO = +2.6 GHz, RF power = −10 dBm, and
LO power = +13 dBm.
0
1
2
3
4
5
0
1
2
3
4
5
−2
+22
+29
+62
+69
+60
+74
+17
+38
+76
+60
+69
+63
+51
+56
+80
+82
+62
+55
+36
+61
+75
+81
+78
+79
+7
N/A1
+55
+61
+83
+83
N × LO
0
1
2
3
4
5
+75
+77
+82
+80
M × RF
0
1
2
3
4
5
1
28
27
35
86
67
85
84
55
44
82
73
90
87
39
62
77
81
85
90
7
N/A1 20
79
81
83
83
62
72
82
82
73
67
85
81
M × RF
1 N/A means not applicable.
RF = +4.5 GHz, LO = +5.5 GHz, RF power = −10 dBm, and
LO power = +13 dBm.
1 N/A means not applicable.
N × LO1
RF = +4.5 GHz, LO = +4.6 GHz, RF power = −10 dBm, and
LO power = +13 dBm.
0
1
2
3
4
5
0
1
2
3
4
5
6
44
27
51
74
71
89
87
29
45
82
84
86
90
N/A
45
79
82
84
87
N × LO
13
85
81
81
77
N/A 36
0
1
2
3
4
5
57
83
83
79
64
76
84
85
M × RF
0
1
2
3
4
5
3
39
34
57
74
84
80
31
46
57
71
87
84
35
71
83
88
88
86
33
57
76
86
89
89
15
85
80
80
80
N/A1
55
83
81
79
M × RF
1 N/A means not applicable.
RF = +6 GHz, LO = +7 GHz, RF power = −10 dBm, and
LO power = +13 dBm.
1 N/A means not applicable.
N × LO1
RF = +6 GHz, LO = +6.1 GHz, RF power = −10 dBm, and
LO power = +13 dBm.
0
1
2
3
4
5
0
1
2
3
4
5
6
36
22
60
70
66
65
70
N/A
29
78
82
73
59
N/A
N/A
64
78
80
N × LO1
16
80
79
70
N/A 37
0
1
2
3
4
5
68
82
79
67
59
73
83
79
M × RF
0
1
2
3
4
5
7
39
28
51
85
78
87
84
29
45
83
87
89
86
N/A
42
79
82
85
89
17
79
81
76
N/A 38
N/A
67
72
84
79
76
62
82
83
79
M × RF
1 N/A means not applicable.
N/A
1 N/A means not applicable.
Rev. A | Page 24 of 27
Data Sheet
HMC219B
THEORY OF OPERATION
The HMC219B is a general-purpose, double balanced mixer in
an 8-lead, MINI_SO_EP, RoHS-compliant package that can be
used as an upconverter or a downconverter from 2.5 GHz to
7.0 GHz.
When used as an upconverter, the mixer upconverts IF between
dc and 3 GHz to RF between 2.5 GHz and 7.0 GHz.
The mixer provides excellent LO to RF and LO to IF isolation
due to optimized balun structures. The HMC219B requires no
external components or matching circuitry. The RoHS compliant
HMC219B eliminates the need for wire bonding and is compatible
with high volume, surface-mount manufacturing techniques.
When used a downconverter, the HMC219B downconverts RF
between 2.5 GHz and 7.0 GHz to IF between dc and 3 GHz.
Rev. A | Page 25 of 27
HMC219B
Data Sheet
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
EVALUATION PCB INFORMATION
Figure 83 shows the typical application circuit for the HMC219B.
The HMC219B is a passive device and does not require any
external components. The LO and RF pins are internally
dc-coupled. When IF operation is not required until dc, use an
ac-coupled capacitor at the IF port. When IF operation to dc is
required, do not exceed the IF source and sink the current rating
specified in the Absolute Maximum Ratings section.
RF circuit design techniques must be implemented for the
evaluation board PCB shown in Figure 84. Signal lines must
have 50 Ω impedance, and the package ground leads and
exposed pad must connect directly to the ground plane, similar to
what is shown in Figure 84. Use a sufficient number of via holes
to connect the top and bottom ground planes. The evaluation
circuit board shown in Figure 84 is available from Analog
Devices, Inc., upon request. Reference EV1HMC219BMS8G
when ordering the evaluation PCB assembly. The bill of
materials for the evaluation PCB is shown in Table 5.
HMC219B
LO
8
1
RF
IF
2
3
4
7
6
5
GND
Table 5. Bill of Materials for Evaluation PCB
EV1HM219BMS8G
GND
Reference
Figure 83. Typical Application Circuit
Designator
J1 to J3
U1
Description
SMA RF connectors
HMC219B
101650 evaluation PCB, Rogers 4350
PCB1
1 101650 is the bare EV1HMC219BMS8G PCB.
Figure 84. HMC219B Evaluation PCB
Rev. A | Page 26 of 27
Data Sheet
HMC219B
OUTLINE DIMENSIONS
3.10
3.00
2.90
2.41
MAX
8
5
4
5.08
4.90
4.68
3.10
3.00
2.90
1.78
MAX
EXPOSED
PAD
1
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
TOP VIEW
SIDE VIEW
BOTTOM VIEW
0.65
BSC
1.95 BSC
SECTION OF THIS DATA SHEET.
0.95
0.85
0.75
1.10
MAX
0.25 GAGE
0.22
0.08
PLANE
END VIEW
6°
0°
0.13
MAX
0.38
0.30
0.22
0.80
0.60
0.40
0.95
REF
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA-T
Figure 85. 8-Lead Mini Small Outline Package with Exposed Pad (MINI_SO_EP)
(RH-8-4)
Dimensions shown in millimeters)
ORDERING GUIDE
Temperature
Range
MSL
Package
Description
Package Package
Option
Model1, 2
Rating3 Package Body Material
Marking4
H219B
XXXX
HMC219BMS8GE
−40°C to +85°C
MSL1
Low Stress Injection Molded Plastic
8-Lead MINI_SO_EP
RH-8-4
HMC219BMS8GETR −40°C to +85°C
EV1HMC219BMS8G
MSL1
Low Stress Injection Molded Plastic 8-Lead MINI_SO_EP
RH-8-4
H219B
XXXX
Evaluation PCB
Assembly
1 The HMC219BMS8GE and the HMC219BMS8GETR are RoHS Compliant Parts.
2 Lead finish, 100% SN 10 micron minimum.
3 See the Absolute Maximum Ratings section.
4 XXXX = four digit lot number.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15452-0-10/17(A)
Rev. A | Page 27 of 27
相关型号：
HMC220AMS8E
Double Balanced Mixer, 5000MHz Min, 12000MHz Max, 10.5dB Conversion Loss-Max, GAAS, ROHS COMPLIANT, ULTRA MINIATURE, PLASTIC, SMT, MSOP-8
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