HMC258LM3TR [ADI]
HMC258LM3TR;
| 型号： | HMC258LM3TR |
| 厂家： | 
ADI |
| 描述： | HMC258LM3TR 局域网 射频 微波 |
| 文件： | 总8页 (文件大小：353K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HMC258LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 14 - 20 GHz
Typical Applications
The HMC258LM3 is ideal for:
• 14 and 20 GHz Microwave Radios
• Point to Point Radios
Features
Integrated LO Amplifier: 0 dBm Input
Sub-Harmonically Pumped (x2) LO
High 2LO/RF Isolation: > 40 dB
LM3 SMT Package
8
• VSAT and SATCOM
Functional Diagram
General Description
The HMC258LM3 is a 14 - 20 GHz surface mount
sub-harmonically pumped (x2) MMIC mixer with an
integrated LO amplifier in a SMT leadless chip car-
rier package. The 2LO to RF isolation is an excellent
40 dB, eliminating the need for additional filtering.
The LO amplifier is a single bias (+5V) two stage
design with only 0 dBm drive requirement. All data is
with the non-hermetic, epoxy sealed LM3 packaged
device mounted in a 50 ohm test fixture. Utilizing the
HMC258LM3 eliminates the need for wirebonding,
thereby providing a consistent connection interface
for the customer.
Electrical Specifications, TA = +25° C, LO Drive = 0 dBm
IF = 1 GHz
Vdd = +5.0V
Parameter
Units
Min.
Typ.
14 - 20
7 - 10.5
DC - 3
10
Max.
Frequency Range, RF
Frequency Range, LO
Frequency Range, IF
Conversion Loss
GHz
GHz
GHz
dB
14
14
Noise Figure (SSB)
10
dB
2LO to RF Isolation
2LO to IF Isolation
IP3 (Input)
33
33
0
40
dB
45
dB
7
dBm
dBm
mA
1 dB Compression (Input)
Supply Current (Idd)
-5
0
50
*Unless otherwise noted, all measurements performed as downconverter, IF= 1 GHz.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
8 - 8
HMC258LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 14 - 20 GHz
Conversion Gain vs.
Temperature @ LO = 0 dBm
Conversion Gain vs. LO Drive
0
0
LO = -4dBm +25C
LO = -2dBm +25C
LO = 0 dBm +25C
LO = +2dBm +25C
LO = +4dBm +25C
-5
-5
-10
-15
-20
-25
-10
8
-15
+25C
-20
-25
-40C
+85C
13
14
15
16
17
18
19
20
21
21
6
13
14
15
16
17
18
19
20
21
25
6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Isolation @ LO = 0 dBm
RF & LO Return Loss @ LO = 0 dBm
10
0
0
-10
-20
-10
RF/IF LO/IF LO/RF
-20
2LO/RF 2LO/IF
-30
-40
-50
-60
LO
RF
-30
-40
13
14
15
16
17
18
19
20
0
5
10
15
20
RF FREQUENCY (GHz)
FREQUENCY (GHz)
IF Bandwidth @ LO = 0 dBm
IF Return Loss @ LO = 0 dBm
0
0
-5
-10
-15
-20
-25
-10
-20
-30
-40
0
1
2
3
4
5
0
1
2
3
4
5
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
8 - 9
HMC258LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 14 - 20 GHz
Input IP3 vs. LO Drive *
Input IP2 vs. LO Drive *
20
60
15
10
5
50
40
30
8
0
20
-2 dBm
0 dBm
+2 dBm
-2 dBm
0 dBm
+2 dBm
-5
10
-10
0
13
15
17
19
21
23
13
15
17
19
21
23
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Upconverter Performance
Conversion Gain @ LO = 0 dBm
Input P1dB
6
0
4
2
-5
-10
-15
-20
-25
0
-2
-4
14
15
16
17
18
19
20
21
22
13
14
15
16
17
18
19
20
21
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
MxN Spurious Outputs@ LO = 0 dBm
nLO
mRF
-3
-2
-1
0
5
4
3
2
1
0
45
69
26
58
50
15
34
X
-16
52
54
1
9
2
51
68
35
82
82
68
3
74
RF = 18 GHz @ -10 dBm
LO = 8.5 GHz @ 0 dBm
All values in dBc below IF power level.
* Two-tone input power = -10 dBm each tone, 1 MHz spacing.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
8 - 10
HMC258LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 14 - 20 GHz
Absolute Maximum Ratings
RF / IF Input (Vdd = +5V)
LO Drive (Vdd = +5V)
Vdd
+13 dBm
+13 dBm
+5.5V
Continous Pdiss (Ta = 85 °C)
(derate 4.28 mW/°C above 85 °C)
386 mW
8
Storage Temperature
Operating Temperature
-65 to +150 °C
-40 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. MATERIAL: PLASTIC
2. PLATING: GOLD OVER NICKEL
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. ALL TOLERANCES ARE 0.005 [ 0.13].
5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND.
6.
INDICATES PIN 1
•
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
8 - 11
HMC258LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 14 - 20 GHz
Pin Description
Pin Number
Function
Description
Interface Schematic
This pin may be connected to the housing
ground or left unconnected.
1, 2
N/C
Vdd
Power Supply for the LO Amplifier. An external RF bypass
capacitor of 100 - 330 pF is required as close to the package
as possible.
8
3
4
5
IF Port. This pin is DC coupled and should be DC blocked
externally using a series capacitor whose value has been
chosen to pass the necessary IF frequency range. Any applied
DC voltage to this pin will result in die non-function and pos-
sible die failure.
IF
RF Port. This pin is AC coupled and matched to
50 Ohm from 4 - 20 GHz.
RF
LO Port. This pin is AC coupled and matched to
50 Ohm from 7 - 10 GHz.
6
7
LO
GND
Must be soldered to PCB RF ground.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
8 - 12
HMC258LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 14 - 20 GHz
Evaluation PCB
8
The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground
(GSG) probes for testing. Suggested probe pitch is 400mm (16 mils). Alternatively, the board can be mounted in
a metal housing with 2.4 mm coaxial connectors.
Evalution Circuit Board Layout Design Details
Layout Technique
Material
Micro Strip to CPWG
Rogers 4003 with 1/2 oz. Cu
0.008” (0.20 mm)
Dielectric Thickness
Microstrip Line Width
CPWG Line Width
CPWG Line to GND Gap
Ground Via Hole Diameter
C1
0.018” (0.46 mm)
0.016” (0.41 mm)
0.005” (0.13 mm)
0.008” (0.20 mm)
100 pF Capacitor, 0402 Pkg.
LM3 package mounted to evaluation PCB
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
8 - 13
HMC258LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 14 - 20 GHz
Suggested LM3-02 PCB Land Pattern Tolerance: 0.003” ( 0.08 mm)
8
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
8 - 14
HMC258LM3
v01.1201
GaAs MMIC SUB-HARMONIC
SMT MIXER, 14 - 20 GHz
HMC258LM3 Recommended SMT Attachment Technique
Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting
The HMC LM3 package was designed to be compatible with
225
high volume surface mount PCB assembly processes. The
LM3 package requires a specific mounting pattern to allow
proper mechanical attachment and to optimize electrical per-
200
8
175
formance at millimeterwave frequencies. This PCB layout pat-
tern can be found on each LM3 product data sheet. It can also
be provided as an electronic drawing upon request from Hittite
150
125
Sales & Application Engineering.
100
Follow these precautions to avoid permanent damage:
75
50
25
Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. LM3 devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.
0
1
2
3
4
5
6
7
8
TIME (min)
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
General Handling: Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair of
bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pres-
sure to the top of the lid.
Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is
not recommended. Conductive epoxy attachment is not recommended.
Solder Paste
Solder paste should be selected based on the user’s experience and be compatible with the metallization systems
used. See the LM3 data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application
Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder
paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical &
electrical performance. Excess solder may create unwanted electrical parasitics at high frequencies.
Solder Reflow
The soldering process is usually accomplished in a reflow oven but may also use a vapor phase process. A solder
reflow profile is suggested above.
Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and
varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the
location of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder reflow profile. A standard profile
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the
flux to completely activate. Reflow must then occur prior to the flux being completely driven off. The duration of peak
reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand a peak temperature of
235°C for 15 seconds. Verify that the profile will not expose device to temperatures in excess of 235°C.
Cleaning
A water-based flux wash may be used.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders: Analog Devices, Inc.,
responsibility is assumed byAnalogDevices foritsuse, nor for anyinfringementsofpatentsor other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
8 - 15
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