HMC260ALC3BTR [ADI]
10 GHz to 26 GHz, GaAs, MMIC, Double Balanced Mixer;
| 型号： | HMC260ALC3BTR |
| 厂家： | 
ADI |
| 描述： | 10 GHz to 26 GHz, GaAs, MMIC, Double Balanced Mixer 局域网 射频 微波 |
| 文件： | 总16页 (文件大小：273K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
10 GHz to 26 GHz, GaAs, MMIC,
Double Balanced Mixer
Data Sheet
HMC260ALC3B
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Passive; no dc bias required
12 11 10
Conversion loss
HMC260ALC3B
8 dB typical for 10 GHz to 18 GHz
9 dB typical for 18 GHz to 26 GHz
LO to RF isolation: 40 dB
1
2
3
9
8
7
GND
LO
GND
RF
GND
GND
Input IP3: 19 dBm typical for 18 GHz to 26 GHz
Wide IF bandwidth: dc to 8 GHz
RoHS compliant, 12-terminal, 3 mm × 3 mm, ceramic
LCC package: 9 mm2
4
5
6
PACKAGE
BASE
Figure 1.
APPLICATIONS
Point to point radios
Point to multipoint radios and very small aperture terminals
(VSATs)
Test equipment and sensors
Military end use
GENERAL DESCRIPTION
The HMC260ALC3B is a general-purpose, double balanced,
monolithic microwave integrated circuit (MMIC) mixer housed in
a leadless, Pb-free, RoHS compliant LCC package. The device
can be used as an upconverter or downconverter in the 10 GHz to
26 GHz frequency range. The HMC260ALC3B mixer requires no
external components or matching circuitry.
The HMC260ALC3B provides local oscillator (LO) to radio
frequency (RF) and LO to intermediate frequency (IF)
suppression due to optimized balun structures. The mixer
operates with LO amplitude levels between 9 dBm and 15 dBm.
The HMC260ALC3B eliminates the need for wire bonding,
allowing the use of surface-mount manufacturing techniques.
Rev. 0
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2018 Analog Devices, Inc. All rights reserved.
www.analog.com
HMC260ALC3B
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Upconverter Performance............................................................8
Isolation and Return Loss ............................................................9
IF Bandwidth—Downconverter............................................... 11
IF Bandwidth—Upconverter .................................................... 12
Spurious and Harmonics Performance ................................... 13
Theory of Operation ...................................................................... 14
Applications Information.............................................................. 15
Typical Application Circuit....................................................... 15
Evaluation PCB Information .................................................... 15
Outline Dimensions....................................................................... 16
Ordering Guide .......................................................................... 16
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance...................................................... 6
REVISION HISTORY
1/2018—Revision 0: Initial Version
Rev. 0 | Page 2 of 16
Data Sheet
HMC260ALC3B
SPECIFICATIONS
Ambient temperature (TA) = 25°C, IF = 1000 MHz, LO = 13 dBm, upper sideband. All measurements performed as a downconverter on the
evaluation printed circuit board (PCB), unless otherwise noted.
Table 1.
Parameter
Symbol
Min
Typ
Max
Unit
Test Conditions/Comments
FREQUENCY RANGE
RF
LO Input
10
10
dc
9
26
26
8
GHz
GHz
GHz
dBm
IF
LO AMPLITUDE
13
15
10 GHz TO 18 GHz PERFORMANCE
Downconverter
Conversion Loss
8
10
dB
Single Sideband Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept
Upconverter
SSB NF
IIP3
IP1dB
IIP2
8
dB
13
18
9.5
43
dBm
dBm
dBm
IFIN
IFIN = 1000 MHz
Conversion Loss
7
dB
Input Third-Order Intercept
Input 1 dB Compression Point
Isolation
IIP3
IP1dB
18
7
dBm
dBm
RF to IF
LO to RF
LO to IF
14
25
21
40
35
dB
dB
dB
18 GHz TO 26 GHz PERFORMANCE
Downconverter
Conversion Loss
9
12
dB
Single Sideband Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept
Upconverter
SSB NF
IIP3
IP1dB
IIP2
10
23
13
46
dB
18
dBm
dBm
dBm
IFIN
IFIN = 1000 MHz
Conversion Loss
8
dB
Input Third-Order Intercept
Input 1 dB Compression Point
Isolation
IIP3
IP1dB
19
8.5
dBm
dBm
RF to IF
LO to RF
LO to IF
25
30
35
40
43
dB
dB
dB
Rev. 0 | Page 3 of 16
HMC260ALC3B
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
RF Input Power
LO Input Power
IF Input Power
IF Source/Sink Current
Peak Reflow Temperature
25 dBm
27 dBm
25 dBm
3 mA
260°C
260 mW
θJA is the natural convection junction to ambient thermal resistance
measured in a one cubic foot sealed enclosure. θJC is the junction to
case thermal resistance.
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 5 mW/°C Above 85°C)
Table 3. Thermal Resistance
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
Package Type
θJA
θJC
Unit
E-12-41
120
200
°C/W
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
500 V
1000 V
ESD CAUTION
Field Induced Charged Device Model
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. 0 | Page 4 of 16
Data Sheet
HMC260ALC3B
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
HMC260ALC3B
TOP VIEW
(Not to Scale)
12 11 10
1
2
3
9
8
7
GND
LO
GND
RF
GND
GND
4
5
6
PACKAGE
BASE
NOTES
1. NIC = NOT INTERNALLY CONNECTED. THESE
PINS CAN BE CONNECTED TO RF/DC GROUND.
PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
Figure 2.
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1, 3, 4, 6, 7, 9
2
5
GND
LO
IF
Ground. These pins and package bottoms connect to RF/dc ground.
Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω.
Intermediate Frequency Port. This pin is dc-coupled. For applications, not requiring operation to dc, dc
block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency
range. For operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction
and possible die failure may result. See Figure 5 for the interface schematic.
8
RF
Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.
10 to 12
NIC
EPAD
Not Internally Connected. These pins can be connected to RF/dc ground. Device performance is not affected.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
GND
IF
Figure 5. IF Interface Schematic
Figure 3. GND Interface Schematic
LO
RF
Figure 6. RF Interface Schematic
Figure 4. LO Interface Schematic
Rev. 0 | Page 5 of 16
HMC260ALC3B
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
Downconverter performance at IF = 1000 MHz, upper sideband (low-side LO).
0
0
–5
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–5
–10
–15
–20
–10
–15
–20
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
30
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
25
20
15
10
5
25
20
15
10
5
0
0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
20
20
15
10
5
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
15
10
5
0
0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 9. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 12. Noise Figure vs. RF Frequency at Various LO Power Levels, TA = 25°C
Rev. 0 | Page 6 of 16
Data Sheet
HMC260ALC3B
Downconverter P1dB and IP2
IF = 1000 MHz, upper sideband (low-side LO).
20
15
10
5
20
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
15
10
5
0
0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 13. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 15. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
60
50
40
30
20
60
50
40
30
20
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
10
0
A
A
A
10
0
LO = 11dBm
LO = 13dBm
LO = 15dBm
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 16. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Figure 14. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Rev. 0 | Page 7 of 16
HMC260ALC3B
Data Sheet
UPCONVERTER PERFORMANCE
Upconverter performance at input intermediate frequency (IFIN) = 1000 MHz, upper sideband (low-side LO).
0
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
A
A
A
–5
–5
–10
–15
–20
–10
–15
–20
RF
FREQUENCY (GHz)
RF
FREQUENCY (GHz)
OUT
OUT
Figure 17. Conversion Gain vs. RF Output (RFOUT) Frequency at Various
Temperatures, LO = 13 dBm
Figure 20. Conversion Gain vs. RFOUT Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
10
30
25
20
15
10
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
5
0
5
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
0
RF
FREQUENCY (GHz)
RF
FREQUENCY (GHz)
OUT
OUT
Figure 18. Input IP3 vs. RFOUT Frequency at Various Temperatures,
LO = 13 dBm
Figure 21. Input IP3 vs. RFOUT Frequency at Various LO Power Levels,
A = 25°C
T
20
20
15
10
5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
15
10
5
0
0
RF
FREQUENCY (GHz)
RF
FREQUENCY (GHz)
OUT
OUT
Figure 19. Input P1dB vs. RFOUT Frequency at Various Temperatures,
LO = 13 dBm
Figure 22. Input P1dB vs. RFOUT Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 8 of 16
Data Sheet
HMC260ALC3B
ISOLATION AND RETURN LOSS
Downconverter performance at IF = 1000 MHz, upper sideband.
60
60
50
40
30
20
10
0
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
50
40
30
20
T
T
T
= +85°C
= +25°C
= –40°C
10
0
A
A
A
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 23. LO to RF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 26. LO to RF Isolation vs. RF Frequency at Various LO Power levels,
TA = 25°C
60
60
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
50
40
30
20
10
0
50
40
30
20
10
0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 24. LO to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 27. LO to IF Isolation vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
50
50
40
30
20
10
0
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
40
30
20
10
0
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 25. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 28. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
LO = 17 GHz, TA = 25°C
Rev. 0 | Page 9 of 16
HMC260ALC3B
Data Sheet
0
0
–5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–10
–20
–30
–10
–15
–20
12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
8.1
9.1 10.1
LO FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 29. LO Return Loss vs. LO Frequency, TA = 25°C, LO = 13 dBm
Figure 31. IF Return Loss vs. IF Frequency at Various LO Powers, LO = 17 GHz,
TA = 25°C
0
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–10
–20
–30
–40
–50
RF FREQUENCY (GHz)
Figure 30. RF Return Loss vs. RF Frequency at Various LO Powers, TA = 25°C
Rev. 0 | Page 10 of 16
Data Sheet
HMC260ALC3B
IF BANDWIDTH—DOWNCONVERTER
Upper sideband, RF = 20 GHz.
0
–5
0
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–5
–10
–15
–20
–10
–15
–20
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
8.1
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
8.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 32. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 34. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
40
40
LO = 9dBm
LO = 11dBm
LO = 13dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
35
30
25
20
15
10
5
35
LO = 15dBm
30
25
20
15
10
5
0
0.1
0
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
8.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
8.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 33. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 35. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 11 of 16
HMC260ALC3B
Data Sheet
IF BANDWIDTH—UPCONVERTER
Upper sideband, RFOUT = 20 GHz.
0
0
–5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–5
–10
–15
–20
–10
–15
–20
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
8.1
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
8.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
IN
IN
Figure 36. Conversion Gain vs. IFIN Frequency at Various Temperatures,
LO = 13 dBm
Figure 38. Conversion Gain vs. IFIN Frequency at Various LO Power Levels,
TA = 25°C
40
40
LO = 9dBm
LO = 11dBm
LO = 13dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
35
30
25
20
15
10
5
35
LO = 15dBm
30
25
20
15
10
5
0
0.1
0
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
8.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
8.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
IN
IN
Figure 37. Input IP3 vs. IFIN Frequency at Various Temperatures,
LO = 13 dBm
Figure 39. Input IP3 vs. IFIN Frequency at Various LO Power Levels,
TA = 25°C
Rev. 0 | Page 12 of 16
Data Sheet
HMC260ALC3B
Upconverter M × N Spurious Outputs
SPURIOUS AND HARMONICS PERFORMANCE
Spur values are (M × IFIN) + (N × LO).
Mixer spurious products are measured in dBc from either the
RF pin or IF pin output power level. N/A means not applicable.
IFIN = 1000 MHz at −10 dBm, LO = 17 GHz at 13 dBm.
Downconverter M × N Spurious Outputs
Spur values are (M × RF) − (N × LO).
N × LO
0
1
2
3
4
81
83
73
55
18
0
77
78
64
42
0
73
71
72
66
28
17
40
67
64
66
68
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
−5
−4
−3
−2
−1
0
RF = 18 GHz at −10 dBm, LO = 17 GHz at 13 dBm.
N × LO
M × IFIN
0
1
2
3
4
N/A
23
7
19
34
66
72
64
N/A
42
71
84
74
N/A
N/A
68
0
1
2
3
4
0
9.5
0
67
71
63
N/A
M × RF
18
55
74
81
80
1
N/A
N/A
73
45
66
74
74
2
77
3
4
5
Rev. 0 | Page 13 of 16
HMC260ALC3B
Data Sheet
THEORY OF OPERATION
The HMC260ALC3B is a general-purpose, double balanced
mixer that can be used as an upconverter or a downconverter
from 10 GHz to 26 GHz.
The mixer performs well with LO drives of 9 dBm or greater,
and it provides LO to RF and LO to IF suppression due to opti-
mized balun structures. The ceramic LCC package eliminates the
need for wire bonding and is compatible with high volume,
surface-mount manufacturing techniques.
When used a downconverter, the HMC260ALC3B downconverts
RF between 10 GHz and 26 GHz to IF between dc and 8 GHz.
When used as an upconverter, the mixer upconverts IF between dc
and 8 GHz to RF between 10 GHz and 26 GHz.
Rev. 0 | Page 14 of 16
Data Sheet
HMC260ALC3B
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
EVALUATION PCB INFORMATION
Figure 40 shows the typical application circuit for the
Use RF circuit design techniques for the circuit board. Ensure
that signal lines have 50 Ω impedance. Connect the package
ground leads and the exposed pad directly to the ground plane
(see Figure 41). Use a sufficient number of via holes to connect
the top and bottom ground planes. The evaluation circuit board
shown in Figure 41 is available from Analog Devices, Inc., upon
request.
HMC260ALC3B. The HMC260ALC3B is a passive device and
does not require any external components. The LO ad RF pins
are internally ac-coupled. The IF pin is internally dc-coupled.
When IF operation to dc is not required, use of an external series
capacitor of a value chosen to pass the necessary IF frequency
range is recommended. When IF operation to dc is required, do
not exceed the IF source and sink current rating specified in the
Absolute Maximum Ratings section.
Table 5. Bill of Materials
Item
J1, J2
J3
U1
PCB1
Description
PCB mount SRI 2.92 mm connectors
PCB mount Johnson SMA connector
HMC260ALC3B
12
11 10
HMC260ALC3B
GND
LO
GND
RF
9
8
7
1
2
3
LO
RF
117611 evaluation board on Rogers 4350
GND
GND
1 117611 is the raw bare PCB identifier. Reference 109728 when ordering the
complete evaluation PCB.
4
5
6
IF
Figure 40. Typical Application Circuit
LO
RF
117611–1
260A
J2
J1
IF
U1
J3
Figure 41. Evaluation PCB Top Layer
Rev. 0 | Page 15 of 16
HMC260ALC3B
Data Sheet
OUTLINE DIMENSIONS
3.05
2.90 SQ
2.75
0.36
0.30
0.24
0.08
BSC
PIN 1
INDICATOR
10
12
PIN 1
9
1
3
0.50
BSC
1.60
1.50 SQ
1.40
EXPOSED
PAD
7
6
4
0.32
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
1.00 REF
2.10 BSC
0.90
0.80
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 42. 12-Terminal Ceramic Leadless Chip Carrier (LCC)
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC260ALC3B
HMC260ALC3BTR
HMC260ALC3BTR-R5
EV1HMC260ALC3B
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
MSL Rating2
MSL3
MSL3
MSL3
Package Description
12-Terminal LCC
12-Terminal LCC
12-Terminal LCC
Evaluation PCB
Package Option
E-12-4
E-12-4
E-12-4
1 All models are RoHS compliant devices.
2 The peak reflow temperature is 260°C. See Table 2 in the Absolute Maximum Ratings section.
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D13884-0-1/18(0)
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