HMC292ALC3B [ADI]
14 GHz to 30 GHz, GaAs, MMIC, Double Balanced Mixer;
| 型号： | HMC292ALC3B |
| 厂家： | 
ADI |
| 描述： | 14 GHz to 30 GHz, GaAs, MMIC, Double Balanced Mixer 局域网 射频 微波 |
| 文件： | 总15页 (文件大小：268K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
14 GHz to 30 GHz, GaAs, MMIC,
Double Balanced Mixer
HMC292ALC3B
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
HMC292ALC3B
Passive: no dc bias required
Conversion loss: 9 dB typical
12 11 10
Input IP3: 19 dBm typical
LO to RF isolation: 48 dB typical
Wide IF frequency range: dc to 8 GHz
12-terminal, 3 mm × 3 mm, RoHS compliant LCC package
1
2
3
9
8
7
GND
LO
GND
RF
GND
GND
APPLICATIONS
4
5
6
PACKAGE
BASE
Microwave and very small aperture terminal (VSAT) radios
Test equipment
GND
Figure 1.
Point to point radios
Military electronic warfare (EW); electronic countermeasure
(ECM); and command, control, communications and
intelligence (C3I)
GENERAL DESCRIPTION
The HMC292ALC3B is a general-purpose, double balanced,
monolithic microwave integrated circuit (MMIC), mixer housed in
a leadless Pb-free, RoHS compliant LCC package, that can be
used as an upconverter or downconverter in the 14 GHz to 30
GHz frequency range. The HMC292ALC3B is ideally suited for
applications where small size, no dc bias, and consistent IC
performance are required. This mixer can operate over a wide
local oscillator (LO) drive level of 9 dBm to 15 dBm. It performs
equally well as a biphase modulator or demodulator. The
HMC292ALC3B eliminates the need for wire bonding, allowing
use of surface-mount manufacturing techniques.
Rev. A
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2017–2018 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
HMC292ALC3B
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Downconverter Performance ......................................................6
Upconverter Performance............................................................8
Isolation and Return Loss ............................................................9
IF Bandwidth—Downconverter............................................... 11
Spurious and Harmonics Performance ................................... 12
Theory of Operation ...................................................................... 13
Applications Information .............................................................. 14
Typical Application Circuit....................................................... 14
Evaluation PCB Information .................................................... 14
Outline Dimensions....................................................................... 15
Ordering Guide .......................................................................... 15
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
REVISION HISTORY
2/2018—Rev. 0 to Rev. A
Changes to Figure 9.......................................................................... 6
Changes to Ordering Guide .......................................................... 15
8/2017—Revision 0: Initial Version
Rev. A | Page 2 of 15
Data Sheet
HMC292ALC3B
SPECIFICATIONS
Ambient temperature (TA) = 25°C, intermediate frequency (IF) = 1 GHz, radio frequency (RF) = −10 dBm, LO = 13 dBm, upper sideband. All
measurements performed as a downconverter, unless otherwise noted, on the evaluation printed circuit board (PCB).
Table 1.
Parameter
Min
Typ
Max
Unit
FREQUENCY RANGE
RF Pin
IF Pin
LO Pin
14
DC
14
9
30
8
30
15
GHz
GHz
GHz
dBm
LO DRIVE LEVEL
13
RF PERFORMANCE
Downconverter
Conversion Loss
9
12.5
dB
Single Sideband (SSB) Noise Figure (NF)
Input Third Order Intercept (IP3)
Input 1 dB Compression Point (P1dB)
Input Second Order Intercept (IP2)
10.5
19
12
50
dB
15
dBm
dBm
dBm
Isolation
RF to IF
LO to RF
LO to IF
22
28
38
48
40
dB
dB
dB
Upconverter
Conversion Loss
IP3
9
20
9
dB
dBm
dBm
P1dB
Rev. A | Page 3 of 15
HMC292ALC3B
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
18 dBm
27 dBm
18 dBm
3 mA
RF Input Power
LO Input Power
IF Input Power
IF Source and Sink Current
Reflow Temperature
Maximum Junction Temperature
θJA is the natural convection junction to ambient thermal resistance
measured in a one cubic foot sealed enclosure. θJC is the junction to
case thermal resistance.
260°C
175°C
Table 3. Thermal Resistance
Package Type
E-12-41
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 5.12 mW/°C
Above 85°C)
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range
460 mW
θJA
θJC
Unit
120
195
°C/W
−40 to +85°C
−65 to +150°C
−65 to +150°C
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device
Model (FICDM)
500 V
500 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. A | Page 4 of 15
Data Sheet
HMC292ALC3B
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
HMC292ALC3B
TOP VIEW
(Not to Scale)
12 11 10
1
2
3
9
8
7
GND
LO
GND
RF
GND
GND
4
5
6
PACKAGE
BASE
GND
NOTES
1. NOT INTERNALLY CONNECTED. THESE PINS
CAN BE CONNECTED TO RF/DC GROUND.
PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 3, 4, 6, 7, 9 GND
Ground. These pins and package bottom must be connect to RF/dc ground. See Figure 3 for the interface
schematic.
2
5
LO
IF
Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the interface schematic.
Intermediate Frequency Port. This pin is dc-coupled. For applications, not requiring operation to dc, dc block
this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For
operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction and possible
die failure can result. See Figure 5 for the interface schematic.
8
RF
NIC
EPAD
Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface schematic.
Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
10, 11, 12
INTERFACE SCHEMATICS
GND
IF
Figure 3. GND Interface Schematic
Figure 5. IF Interface Schematic
LO
RF
Figure 4. LO Interface Schematic
Figure 6. RF Interface Schematic
Rev. A | Page 5 of 15
HMC292ALC3B
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
Downconverter performance at IF = 1 GHz, upper sideband (low-side LO).
0
0
–5
–5
–10
–15
–10
–15
–20
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–20
14
16
18
20
22
24
26
28
30
14
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
40
35
30
25
20
15
10
40
35
30
25
20
15
10
5
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
5
0
0
14
16
18
20
22
24
26
28
30
14
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
25
20
15
10
5
0
14
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
Figure 9. Noise Figure vs. RF Frequency at TA = 25°C, LO = 13 dBm
Rev. A | Page 6 of 15
Data Sheet
HMC292ALC3B
Downconverter P1dB and IP2
IF = 1 GHz, upper sideband (low-side LO).
20
20
16
12
8
16
12
8
4
4
LO = 15dBm
LO = 13dBm
LO = 11dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
0
14
0
14
16
18
20
22
24
26
28
30
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 12. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 14. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
80
70
60
50
40
30
20
80
70
60
50
40
30
20
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
10
10
0
14
0
14
16
18
20
22
24
26
28
30
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 13. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 15. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 7 of 15
HMC292ALC3B
Data Sheet
UPCONVERTER PERFORMANCE
Upconverter performance at input intermediate frequency (IFIN) = 1 GHz, upper sideband (low-side LO).
0
0
–5
–5
–10
–15
–20
–10
–15
–20
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
14
16
18
20
22
24
26
28
30
14
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 16. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 19. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
40
35
30
25
20
15
10
40
LO = 15dBm
LO = 13dBm
LO = 11dBm
35
LO = 9dBm
30
25
20
15
10
5
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
5
0
0
14
16
18
20
22
24
26
28
30
14
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 17. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 20. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
16
12
8
20
16
12
8
4
4
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 13dBm
LO = 11dBm
0
14
0
14
16
18
20
22
24
26
28
30
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 21. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Figure 18. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Rev. A | Page 8 of 15
Data Sheet
HMC292ALC3B
ISOLATION AND RETURN LOSS
Downconverter performance at IF = 1 GHz, upper sideband (low-side LO).
80
80
70
60
50
40
30
20
10
0
70
60
50
40
30
20
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
10
0
14
16
18
20
22
24
26
28
30
14
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 22. LO to RF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 25. LO to RF Isolation vs. RF Frequency at Various LO Power levels,
T
A = 25°C
80
80
70
60
50
40
30
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
70
60
50
40
30
20
10
0
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
14
16
18
20
22
24
26
28
30
14
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 23. LO to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 26. LO to IF Isolation vs. RF Frequency at Various LO Power Levels,
T
A = 25°C
80
80
70
60
50
40
30
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
70
60
50
40
30
20
10
0
14
16
18
20
22
24
26
28
30
14
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 24. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 27. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 9 of 15
HMC292ALC3B
Data Sheet
0
0
–5
–5
–10
–15
–20
–25
–30
–10
–15
–20
–25
–30
–35
–40
T
T
T
= +85°C
= +25°C
= –40°C
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
A
A
A
–35
–40
14
16
18
20
22
24
26
28
30
0
1
2
3
4
5
6
7
8
LO FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 28. LO Return Loss vs. LO Frequency at Various Temperatures,
LO = 13 dBm
Figure 30. IF Return Loss vs. IF Frequency at Various Temperatures,
LO = 25 GHz, 13 dBm
0
–5
–10
–15
–20
–25
–30
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–35
–40
14
16
18
20
22
24
26
28
30
RF FREQUENCY (GHz)
Figure 29. RF Return Loss vs. RF Frequency at Various Temperatures,
LO = 25 GHz, 13 dBm
Rev. A | Page 10 of 15
Data Sheet
HMC292ALC3B
IF BANDWIDTH—DOWNCONVERTER
Upper sideband, LO frequency = 20 GHz.
0
0
–5
–5
–10
–15
–10
–15
–20
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
A
A
A
–20
0.1
1.0
2.1
3.1
4.1
5.1
6.1
7.1
8.1
9.1
0.1
1.0
2.1
3.1
4.1
5.1
6.1
7.1
8.1
9.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 31. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 33. Conversion Gain vs. IF Frequency at Various LO Power Levels,
A = 25°C
T
30
25
20
15
10
30
25
20
15
10
5
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
5
A
A
A
0
0.1
0
0.1
1.0
2.1
3.1
4.1
5.1
6.1
7.1
8.1
9.1
1.0
2.1
3.1
4.1
5.1
6.1
7.1
8.1
9.1
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 32. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 34. Input IP3 vs. IF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. A | Page 11 of 15
HMC292ALC3B
Data Sheet
Upconverter M × N Spurious Outputs
SPURIOUS AND HARMONICS PERFORMANCE
Spur values are (M × IFIN) − (N × LO).
Mixer spurious products are measured in dBc from the IF output
power level. N/A means not applicable.
IFIN = 1 GHz at −10 dBm, LO = 21 GHz at 13 dBm.
Downconverter M × N Spurious Outputs
Spur values are (M × RF) − (N × LO).
RF = 22 GHz at −10 dBm, LO = 21 GHz at 13 dBm.
N × LO
N × LO
0
1
2
3
4
0
1
2
3
4
N/A
23
57
80
94
15
0
NA
>90
>90
76
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
M × IFIN
40
65
87
0
1
2
3
4
0
1
2
3
4
N/A
32
13
0
39
51
62
74
N/A
N/A
70
73
73
73
N/A
N/A
71
75
M × RF
58
74
N/A
N/A
N/A
N/A
77
78
Rev. A | Page 12 of 15
Data Sheet
HMC292ALC3B
THEORY OF OPERATION
The HMC292ALC3B is a general-purpose, double balanced mixer
that can be used as an upconverter or a downconverter from
14 GHz to 30 GHz.
When used as an upconverter, the mixer upconverts intermediate
frequencies between dc and 8 GHz to radio frequencies between
14 GHz and 30 GHz.
When used as a downconverter, the HMC292ALC3B
downconverts RF between 14 GHz and 30 GHz to IF between dc
and 8 GHz.
Rev. A | Page 13 of 15
HMC292ALC3B
Data Sheet
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
EVALUATION PCB INFORMATION
Figure 35 shows the typical application circuit for the
HMC292ALC3B. The HMC292ALC3B is a passive device and
does not require any external components. The LO and RF pins
are internally ac-coupled. The IF pin is internally dc-coupled.
Use an external series capacitor when IF operation is not required.
Choose a value that stays within the necessary IF frequency
range. When IF operation to dc is required, do not exceed the
IF source and sink current rating specified in the Absolute
Maximum Ratings section.
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance,
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 36). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 36 is
available from Analog Devices, Inc., upon request.
Table 5. List of Materials for Evaluation PCB
EV1HMC292ALC3B
Item
J1, J2
J3
U1
PCB1
Description
SRI 2.92 mm connector
Johnson SMA connector
HMC292ALC3B
12
11
10
HMC292ALC3B
GND
LO
GND
RF
9
8
7
1
2
3
LO
RF
117611-7 evaluation board
GND
GND
1 117611-7 is the raw bare PCB identifier. Reference the EV1HMC292ALC3B
device when ordering the complete evaluation PCB.
4
5
6
IF
Figure 35. Typical Application Circuit
LO
RF
117611–7
292A
J2
J1
IF
U1
J3
Figure 36. Evaluation PCB Top Layer
Rev. A | Page 14 of 15
Data Sheet
HMC292ALC3B
OUTLINE DIMENSIONS
3.05
2.90 SQ
2.75
0.36
0.30
0.24
0.08
BSC
PIN 1
INDICATOR
10
12
PIN 1
9
1
3
0.50
BSC
1.60
1.50 SQ
1.40
EXPOSED
PAD
7
6
4
0.32
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
1.00 REF
2.10 BSC
0.90
0.80
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 37. 12-Terminal Ceramic Leadless Chip Carrier (LCC)
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
MSL Rating2
MSL3
MSL3
MSL3
Package Description
Package Option
E-12-4
E-12-4
HMC292ALC3B
12-Terminal Ceramic LCC
12-Terminal Ceramic LCC
12-Terminal Ceramic LCC
Evaluation PCB Assembly
HMC292ALC3BTR
HMC292ALC3BTR-R5
EV1HMC292ALC3B
E-12-4
1 The HMC292ALC3B, HMC292ALC3BTR, and HMC292ALC3B-R5 are RoHS Compliant Parts.
2 See Table 2 for the peak reflow temperature.
©2017–2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13886-0-2/18(A)
Rev. A | Page 15 of 15
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