HMC326MS8GRTR [ADI]

IC,MICROWAVE/MILLIMETER WAVE AMPLIFIER,SINGLE,BIPOLAR,TSSOP,8PIN,PLASTIC;
HMC326MS8GRTR
型号: HMC326MS8GRTR
厂家: ADI    ADI
描述:

IC,MICROWAVE/MILLIMETER WAVE AMPLIFIER,SINGLE,BIPOLAR,TSSOP,8PIN,PLASTIC

放大器
文件: 总6页 (文件大小:220K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HMC326MS8G / 326MS8GE  
v08.0808  
GaAs InGaP HBT MMIC DRIVER  
AMPLIFIER, 3.0 - 4.5 GHz  
Typical Applications  
Features  
The HMC326MS8G / HMC326MS8GE is ideal for:  
Psat Output Power: +26 dBm  
5
• Microwave Radios  
> 40% PAE  
• Broadband Radio Systems  
Output IP3: +36 dBm  
High Gain: 21 dB  
• Wireless Local Loop Driver Amplifier  
Vs: +5V  
Ultra Small Package: MSOP8G  
Functional Diagram  
General Description  
The HMC326MS8G & HMC326MS8GE are high  
efficiency GaAs InGaP Heterojunction Bipolar  
Transistor (HBT) MMIC driver amplifiers which  
operate between 3.0 and 4.5 GHz. The amplifier  
is packaged in a low cost, surface mount 8 leaded  
package with an exposed base for improved RF and  
thermal performance. The amplifier provides 21 dB  
of gain and +26 dBm of saturated power from a +5V  
supply voltage. Power down capability is available to  
conserve current consumption when the amplifier is  
not in use. Internal circuit matching was optimized to  
provide greater than 40% PAE.  
Electrical Specifications, TA = +25° C, Vs = 5V, Vpd = 5V  
Parameter  
Min.  
Typ.  
Max.  
Units  
GHz  
dB  
Frequency Range  
3.0 - 4.5  
Gain  
18  
21  
Gain Variation Over Temperature  
Input Return Loss  
0.025  
0.035  
dB / °C  
dB  
12  
Output Return Loss  
7
dB  
Output Power for 1dB Compression (P1dB)  
Saturated Output Power (Psat)  
Output Third Order Intercept (IP3)  
Noise Figure  
21  
32  
23.5  
dBm  
dBm  
dBm  
dB  
26  
36  
5
Supply Current (Icc)  
Control Current (Ipd)  
Switching Speed  
Vpd = 0V / 5V  
tOn/tOff  
0.001 / 130  
mA  
7
mA  
10  
ns  
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:  
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373  
Order On-line at www.hittite.com  
5 - 34  
HMC326MS8G / 326MS8GE  
v08.0808  
GaAs InGaP HBT MMIC DRIVER  
AMPLIFIER, 3.0 - 4.5 GHz  
Broadband Gain & Return Loss  
Gain vs. Temperature  
25  
20  
15  
10  
5
25  
5
23  
21  
S21  
S11  
S22  
0
19  
-5  
-10  
-15  
-20  
+25C  
17  
15  
+85C  
-40C  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
3
3.25  
3.5  
3.75  
4
4.25  
4.5  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
P1dB vs. Temperature  
Psat vs. Temperature  
30  
30  
28  
26  
24  
22  
20  
28  
26  
24  
22  
20  
+25C  
+85C  
-40C  
+25C  
+85C  
-40C  
3
3.25  
3.5  
3.75  
4
4.25  
4.5  
3
3.25  
3.5  
3.75  
4
4.25  
4.5  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Output IP3 vs. Temperature  
Power Compression @ 3.5 GHz  
40  
45  
40  
35  
30  
25  
20  
15  
10  
38  
36  
34  
+25C  
+85C  
32  
Output Power (dBm)  
Gain (dB)  
PAE (%)  
-40C  
5
0
30  
3
3.25  
3.5  
3.75  
4
4.25  
4.5  
-8  
-6  
-4  
-2  
0
2
4
6
8
10  
12  
FREQUENCY (GHz)  
INPUT POWER (dBm)  
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:  
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373  
Order On-line at www.hittite.com  
5 - 35  
HMC326MS8G / 326MS8GE  
v08.0808  
GaAs InGaP HBT MMIC DRIVER  
AMPLIFIER, 3.0 - 4.5 GHz  
Input Return Loss vs. Temperature  
Output Return Loss vs. Temperature  
0
0
5
-3  
-6  
+25C  
-5  
+85C  
-40C  
-10  
-9  
-15  
-20  
+25C  
+85C  
-40C  
-12  
-15  
3
3.25  
3.5  
3.75  
4
4.25  
4.5  
3
3.25  
3.5  
3.75  
4
4.25  
4.5  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Reverse Isolation vs. Temperature  
Noise Figure vs. Temperature  
0
10  
-10  
8
6
-20  
+25C  
+85C  
-40C  
-30  
-40  
-50  
-60  
4
+25C  
+85C  
-40C  
2
0
3
3.25  
3.5  
3.75  
4
4.25  
4.5  
3
3.25  
3.5  
3.75  
4
4.25  
4.5  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Gain, Power & Quiescent Supply  
Current vs. Vpd @3.5 GHz  
27  
24  
21  
18  
15  
12  
150  
PSAT  
P1dB  
120  
90  
60  
30  
0
GAIN  
Icc  
1.5  
2
2.5  
3
3.5  
4
4.5  
5
Vpd (Vdc)  
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:  
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373  
Order On-line at www.hittite.com  
5 - 36  
HMC326MS8G / 326MS8GE  
v08.0808  
GaAs InGaP HBT MMIC DRIVER  
AMPLIFIER, 3.0 - 4.5 GHz  
Absolute Maximum Ratings  
Collector Bias Voltage (Vcc)  
Control Voltage Range (Vpd)  
RF Input Power (RFIN)(Vs = Vpd = +5Vdc)  
Junction Temperature  
+5.5 Vdc  
+5.5 Vdc  
+15 dBm  
150 °C  
5
ELECTROSTATIC SENSITIVE DEVICE  
OBSERVE HANDLING PRECAUTIONS  
Continuous Pdiss (T = 85 °C)  
(derate 14 mW/°C above 85 °C)  
0.916 W  
71 °C/W  
Thermal Resistance  
(junction to ground paddle)  
Storage Temperature  
Operating Temperature  
ESD Sensitivity (HBM)  
-65 to +150 °C  
-40 to +85 °C  
Class 1A  
Outline Drawing  
NOTES:  
1. LEADFRAME MATERIAL: COPPER ALLOY  
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]  
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.  
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.  
5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO  
PCB RF GROUND.  
Package Information  
Part Number  
Package Body Material  
Lead Finish  
MSL Rating  
MSL1 [1]  
Package Marking [3]  
H326  
XXXX  
HMC326MS8G  
Low Stress Injection Molded Plastic  
Sn/Pb Solder  
H326  
XXXX  
MSL1 [2]  
HMC326MS8GE  
RoHS-compliant Low Stress Injection Molded Plastic  
100% matte Sn  
[1] Max peak reflow temperature of 235 °C  
[2] Max peak reflow temperature of 260 °C  
[3] 4-Digit lot number XXXX  
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:  
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373  
Order On-line at www.hittite.com  
5 - 37  
HMC326MS8G / 326MS8GE  
v08.0808  
GaAs InGaP HBT MMIC DRIVER  
AMPLIFIER, 3.0 - 4.5 GHz  
Evaluation PCB  
5
List of Materials for Evaluation PCB 104356 [1]  
The circuit board used in the final application should  
use RF circuit design techniques. Signal lines  
should have 50 ohm impedance while the package  
ground leads and exposed paddle should be con-  
nected directly to the ground plane similar to that  
shown. A sufficient number of via holes should be  
used to connect the top and bottom ground planes.  
The evaluation board should be mounted to an  
appropriate heat sink. The evaluation circuit board  
shown is available from Hittite upon request.  
Item  
J1 - J2  
J3  
Description  
PCB Mount SMA RF Connector  
2mm DC Header  
C1 - C2  
330 pF Capacitor, 0603 Pkg.  
C3  
C4  
C5  
L1  
0.7 pF Capacitor, 0603 Pkg.  
3.0 pF Capacitor, 0402 Pkg.  
2.2 μF Capacitor, Tantalum  
3.3 nH Inductor, 0805 Pkg.  
HMC326MS8G / HMC326MS8GE  
Amplifier  
U1  
[2]  
PCB  
104106 Eval Board  
[1] Reference this number when ordering complete evaluation PCB  
[2] Circuit Board Material: Rogers 4350, 10 mil thick, tr = 3.48  
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:  
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373  
Order On-line at www.hittite.com  
5 - 38  
HMC326MS8G / 326MS8GE  
v08.0808  
GaAs InGaP HBT MMIC DRIVER  
AMPLIFIER, 3.0 - 4.5 GHz  
Application Circuit  
5
Impedance  
TL1  
65  
TL2  
256  
47  
TL3  
128  
Physical Length (mils)  
Electrical Length (degs)  
12  
23.3  
Recommended Component Values  
L1  
3.3 nH  
330 pF  
C1 - C2  
C3  
0.7 pF  
C4  
C5  
3.0 pF  
2.2 μF  
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:  
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373  
Order On-line at www.hittite.com  
5 - 39  

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